立足本土 ,放眼全球 - 中微的发展道路

立足本土 ,放眼全球 - 中微的发展道路
China-Based with Global Thinking - AMEC
Practice
Michael Chu, VP and GM of Etch Product
AMEC:
Built in Pudong in Aug 2004 with total 380 employees and 28000m2
plant.
Build 1
Build 2
• Build 1 (6,500 m2 ) was built in 2005 with 1,000m2 class 100 lean room for R&D Lab.
• Build 2 (22,000m2 ) Phase 1 of 3000m2 clean room for production was put in use in Aug 2012.
• Complete Build 2 plant will have 300 tools with $6 billion annual production capacity by E/2013.
Market Opportunities
IC Unit Growth Across most End Markets in 2014
Source: SIA, Goldman Sachs, Apr 2014
Longer-term End Market Trends
Semiconductor Revenue by End Market Over Time
By end market over the last decade, communications (including handsets) and
industrial have grown the most as a percentage of the total.
Source: SIA, Goldman Sachs, Apr 2014
Asia Pacific Rising Sharply
Worldwide Semiconductor Market Billings
Asia
Asia Pacific’s market share keeps going up and exceeded all other regions in
year 2011. Now the billings from Asia is over half of the global billings.
Source: SIA, Feb 2013
China has Become the Largest IC Market Since 2005
Worldwide semiconductor market by region, 2003–2012
China’s semiconductor consumption market grew by 8.7% in 2012 to
reach a new record of 52.5% of the global market.
Source: PwC, Sep 2013
China’s IC Manufacturing Still at Week Position
The Chinese IC market is forecast to have a 2012-2017 CAGR of 13%, five points
higher than the 8% CAGR forecast for the total IC market during this same time period.
However, most of the capacity are come from foreign companies.
Source :World Fab Watch, Sep 2013
Greater China’s Has Been More and More Important
Greater China Share in 2012
China,
Hongkong,
and Taiwan
Source: CCID, Gartner Dataquest, ICI Insights, SEMI World Fab Watch, TSIA, WSTS, PwC, Sep 2013
2014 Could be a Recovery Year for Capex
YoY Percentage Change in Capex
Driven by NAND and foundry, 2014 capex will improve to show 11% growth.
Source: SIA, Goldman Sachs, Apr 2014
Capex Breakdown
NAND Capex
DRAM Capex
Foundry Capex
Logic Capex
Source: SIA, Goldman Sachs, Apr 2014
Challenges
Number of Companies with Fabs is Dwindling
The number of companies able to afford the cost of new advanced fab continues
to dwindle, causing greater reliance on foundries for production capacity.
Source: IC Insights, Jan 2013
Global IC Capacity Breakdown
Installed Monthly Capacity of Each Region
Capacity Leaders’ Share
IC capacity in China mainland only represents 9.4% of global overall capacity.
Taiwan region now has the biggest installed capacity.
Source: IC Insights, Feb 2014
Wafer Capacity Leaders
Capex is becoming more
concentrated with a greater
percentage of spending
coming from a shrinking
number of companies. As a
result, IC industry capacity is
also becoming more
concentrated and this trend
is especially prevalent in
300mm wafer technology.
Source: IC Insights, Jan 2013
Top Capexer
Samsung, Intel and
TSMC are the big three
entered into “$10 Billion
Club” in year 2013.
Source: Citi, Owen, Feb 2013
Top 7 Capexer Share Keep Growing
Samsung, Intel, TSMC, Global Foundry, Toshiba, Hynix and Micron
Top 7 Capex
100%
Top 7 as % of Total
40,000
70%
30,000
75%
74%
77% 80%
60%
59%
49,085
20,000
10,000
41%
24%
30%
18,467
31,724
38,934
41,037
40%
40,184
24,054
20%
Top 7 Capex as % of Total
Capex (Million US Dollars)
50,000
9,235
0
0%
1995
Average
Capex
$1.32B
2000
2007
$2.64B
2010
$3.44B
2011
$4.53B
2012
$5.56B
2013E
$5.86B
2014E
$5.74B
$7.01B
Though the average capex for top 7 drops a little bit, their share as of total
capex increase to 75% this year.
Source: Citi, Owen, Feb 2013
The Business Cyclically Reach Bottom This Quarter
Fab equipment spending saw a drastic dip in 2H12 and, accounting for seasonal
weakness and near-term uncertainty, 1Q13 is expected to be even lower
Source: SEMI, Nov 2012
Top Equipment Suppliers
Total Wafer Fab Equipment
After the merge of Applied and Tokyo Electron, the company represents over 30%
of the total wafer fab equipment share.
Source: Gartner, Morgan Stanley, Sep 2013
Top 4 Equipment Players
Fiscal Year End on 10/27/2013
Fiscal Year End on 03/31/2013
Revenue: $12.32B
Fiscal Year End on 06/30/2013
Fiscal Year End on 06/30/2013
Revenue: $7.27B
Revenue: $3.59B
Revenue: $2.84B
Asset：
$15.96B
Asset：
Fiscal Year End on 12/31/2013
$7.51B + $4.81B
Asset：
$19.55B
R&D:
$12.04B + $7.51B
R&D:
$2028M
1 USD=103.2350JPY
$1319M+$709M
$7.25B Asset：
$684M R&D:
$5.28B
$465M
R&D:
$1163M
1 EUR=1.3862USD
Exchange Rate Date: 2014/03/11
After the merge of Applied and Tokyo Electron, the new company’s annual R&D
expense will exceed $2B. Following by ASML , which company’s annual R&D
expense also exeed $1B.
Source: Google Finance, AMEC, Mar 2014
Driving Factors of the Industry Growth
Resource
Investment
Industry Evolution
Creative Design
Resource
Investment
Resource
Large Font Indicates
Main Driving Force
Development Stage
Industry players who can fulfill customers’ variously needs and deliver better ROI
through creative design will prosper in the market at current stage.
AMEC Practices & Learning
Better Understanding for Customers’ Requirement
On-Wafer Performance
Software/Hardware Friendly
Quality and Reliability
Design for Zero Failure
Easy Manufacturing
Easy Assemble and Disassemble
Easy Maintenance
Fast Recovery
Upgradability
Minimize Changes during Upgrade
Modulization
Simplify Interface/Module Test
Standardization
Standard Parts and Interface
Safety and EHS
Requirement
Meet Multi-National Needs
Low System Cost
and Running Cost
Clear Cost target and Reduction Roadmap
Customer Satisfaction
Easy to Operate
Customer Partners/Friends
AMEC Build a Strong in-house R&D Team
Gerald Yin
CEO & Chairman
Zhiyou Du
SVP & MOCVD GM
Michael Chu
VP & Etch GM
Andrew Chen
VP & CFO
Tom Ni
VP & Etch DGM
James Yang
VP & GM of CM
Matthew Ruby
VP & General Counsel
Steve Mak
VP & Etch DGM
KH Koh
VP & Singapore GM
KI Yoon
VP & Korea GM
Steven Lee
VP & DGM of CM
George Cao
VP & China GM
Vic Meksavan
VP, GMO
Henry Ho
VP, MOCVD Eng.
Janet Huang
Mgt Dir., HR
Pat Walsh
VP & US GM
Hirofumi Matsuo
SD & Japan Act. GM
Bryan Pu
VP. Etch Tech
Xingcai Su
Sr. Dir. Etch App
Songlin Xu
Sr. Dir, TSV
Ben Chen
Taiwan Deputy GM
More than 40 from Silicon Valley and more than 50 from Japan, Korea, Taiwan and Singapore with a
total of 2500 years accumulated semi-equipment experience incl. process tech, product development,
operation, MFG, material management, quality management, sales and service
24
Besides Technology Innovation, AMEC also Focus on
Lower Cost of Ownership
AMEC Practice
Cost
Reduction
Design simple, reliable and easy-to-use products



Simple mainframe and wafer transfer system
Simple process chamber sub-system
Single Compact Pci will switch to PC control
10%
Design high throughput multi-wafer system


Share major parts and components
Increase throughput per unit cost
10%
Low cost outsourcing material, and subassembly


50% material and subsystem outsourced to Asia manufacturer
Only perform final assemble and test in house
10%
Lower product operation cost


Lower consumption of water, electricity and gases
Increase life of consumables, lower their cost
Tax and cost benefits in industry zone
5%
Additional
AMEC will offer 35% lower cost of ownership as compared to competitors
AMEC D-RIE Etch Chamber Design Key Features
Decoupled RIE Plasma Source
VHF RF for plasma density control
LF RF for ion energy control
Patented fast tuning RF system
Operate four different plasma regimes
Single and Dual Wafer Processing
Single wafer and dual wafer flexible
Precise station matching
Separate RF and endpoint control
Dual Plasma Confinement
Large window for plasma confinement
In-situ clean fro near zero particle
High Purity Chamber Materials
Less erosion for low CoC
Less contamination and defects
Etch Uniformity Optimization
Symmetrical process zone
Gas distribution tuning
Unique electrode edge design
Asia Materials and Subassembly Suppliers
AMEC has partnered with over 350 global suppliers to optimize
its systems’ performance, as well as provides cost-cutting spare
parts outsource services.
Singapore
China
ENI (MKS)
AEI
ECC
Flextronics/CZ
Foxsemicon
Kinergy/NT
Saes Getters
Mitsui-Ferrotec/HZ
Technoquartz/HZ
Volex
Xian Aero-Engine
Xian Aerocraft
Sanyo/DL
Robert
Automation
GD Technology
View Tech
Jiao Dai Nan Yang

Korea
Daewoo
 KSM
 CoorsTek
 HanYang
 Shinsong
 KoMiCo
 Tae Kwang Bend
 Lasemtec
 NPP
 MAT
 APEX
 Inocera
 Genesis
Philips
 Norelco-UMS
 Kinergy
 Watlow
 Hup-Fat
 CEI


Taiwan
Gongin
 Foxsemicon
 MIC
 Ares Green
 Hiwin
 SIC
 SCH
 Contreal

Japan
Daikin
 Ebara Tech
 Fujikin
 Kawasaki
 Mitsubishi
 Cables
 Sanyo Denki
 Shimadzu
 JAL
 Ferrotec
 Mitsui
 V-Tek
 Fuji Film

Indonesia

PerkinElmer
Belfab
Tokai Carbon
 Shinko
 Oriental Motors
 TDK
 Techno Quartz
 THK
 Yasakawa
 Seiko Seiki
 CKD
 Aitech
 SMC
 Pearl
 Aera (AEI Co.)

Hirata
 Rorze
 Kyocera
 NGK
 NSK
 Shibaura
 Toshiba
Ceramics

Vietnam
Vietnam Bingo
 Asuzac

Global CyberSoft
 Rorze

AMEC ETCH-Related Patents (E/2013)
Processing
/ Pending
Granted
China
233
72
Taiwan
103
33
JP
9
4
KR
2
9
US
13
9
PCT filing
0
0
Sub-total
360
127
Total
487
AMEC has been granted 127 patents worldwide since 2005. This includes
patents for important system innovations like a VHF de-couple RF system,
CVD SiC showerhead, High pumping confinement ring, etc..
AMEC MOCVD-Related Patents (E/2013)
Processing
/ Pending
Granted
China
27
33
Taiwan
28
18
JP
3
4
KR
7
4
US
12
4
PCT filing
2
0
Sub-total
79
63
Total
142
AMEC has been granted 63 patents worldwide since 2005. This includes
patents for important system innovations like a gas distribution system and
heater rotation system that can be used for novel MOCVD tool features.
AMEC Legal Partner
US
(Corporate legal consultancy)
(Patent prosecution & legal opinion)
(Patent prosecution & legal opinion)
Herald McElhinny
( IP consultancy & IP agreement review )
(Litigator)
(US top 10 attorney on patent lawsuit)
あいわ内外特許事務所
Japan
(Patent prosecution)
(Patent prosecution)
China
(Corporate legal consultancy)
(Patent prosecution)
( IP consultancy)
Taiwan
(Patent prosecution & legal opinion)
(Patent prosecution)
(Patent prosecution)
(Patent prosecution)
Korea
(Litigator)
Diversified Product Offerings
AMEC Products
Dielectric Etcher
TSV Etcher
MOCVD
65nm to 1xnm
Dielectric Etch
MEMS, CIS package ,
Interposer & 3D IC,
LED, Dicing
LED Chips
AMEC has various product offerings that cover IC manufacturing, IC assembly & testing
as well as LED chips with a main focus on Etch and CVD technology.
AMEC D-Etch and TSV Install Base (E/Jan of 2014)
AMEC Etch Products Install Base Summary (E/2013)
Region
Business
Tech Node
# Systems
# Stations
Foundry
65/40/28/20nm
21
94
Memory
58/46/30nm
4
14
Packaging
CIS
2
8
Foundry
65/40/28nm
13
52
Packaging
CIS, MEMS, 3DIC, BSI
13
48
Foundry
65/45/40nm
3
12
Packaging
MEMS
1
6
Korea
Memory
26/20/15nm; VNAND
2
16
Japan
Packaging
Dicing
1
4
Taiwan
China
Singapore


D-RIE
17 Systems / 60 Stations
17
60
TSV
45 Systems / 194 Stations
45
194
Total
62 Systems / 254 Stations
62
254
Over 10.3M wafers processed with stable yield running 65/40/28/26/20nm devices
Qualifications in-progress for 1xnm Memory, 1Xnm Foundry application
AMEC Etch Install Base Growth Momentum
In 2014, Install base of 376 Stations in 22 Customer Production Sites (30 Fabs)
 Est. YOY Growth > 55% for 2012 to 2014 and > 50% for 2009 thru 2014

33
Wfs Pass Summary – Total Etch All Regions
(E/Jan’2014)
2013



2014
All regions total wfs pass over 10.3M (D-Etch- 9.9M; TSV: 0.4M) by end of Jan 2014
N40/45 is the major output and <=N30 running >100K WSPM
MEMS and CIS output >35K WSPM since Aug 2013
34
BetaMOCVD
Evaluation
AMEC
ProductUpdate
Positioning
Customer
Evaluation Status
Customer 1
(2” LED)
1. Evaluation tool (1 CH) shipped in Feb of 2013
2. Production proven with twice ~100 continual runs without open chamber
3. Total > 250run (2” x 12500 wfs)
Customer 2
(2” LED)
1. 1st evaluation tool (1 CH) shipped in Aug of 2013 and completed Tier 3.
Will plan to run production for repeatability test.
1. 2nd evaluation tool (1 CH) shipped in Oct of 2013 and Tier 2 completed
Customer 3
(2” LED)
Customer 4
(4~6” Power Device)
Customer 5
(4” LED)
Customer 6
(4” LED)
1. Evaluation tool shipped in Dec. of 2013
2. Will complete Tier 1 in March
1. Evaluation tool shipped in Dec. of 2013
2. Will complete Tier 1 in March
1. Live demo. completed
2. Chip process test is ongoing
3. Subsidy support is important for JDP
1. Demo is on going
2. Customer plan to visit AMEC HQ in May
35
Summary
 The industry we are in is very fantastic with steady growth
potential
 With its huge consumer base and growing manufacturing base, Asia is now
capable of self-sustainable electronics supply chain from product design to
system integration, but still lack of high-end micro-fabrication equipment
 IC and LED equipment industry is emerging in China, will get fast
growth with the increase of local demand and strong government
support
 AMEC is well-positioned and dedicated to contribute to the development
of the ever growing micro-fabrication equipment industry and we welcome
you to join us in this endeavour!
Visit us at http://www.amec-inc.com
Thanks!