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PowerPoint Presentation Template - STANDARD full
PDK-based design automation enablement for MEMS- and CMOS processes DATE Exhibition Theatre Session 11.8 - Launch of the Worldwide MEMS Design Contest Jörg Doblaski [email protected] Director of Design Support X-FAB group X-FAB Semiconductor Foundries AG 21 March 2016 Company Confidential 1 Outline About X-FAB Process overview inertial sensor open-platform processes CMOS design flow vs. MEMS design flow PDK-based design flow enablement for MEMS MEMS IP Reference Kit for easy adoption Summary 21 March 2016 Company Confidential 2 About X-FAB 21 March 2016 Company Confidential 3 Key Facts The More than Moore Foundry. • 20+ years of experience in pure-play foundry services for analog/mixed-signal semiconductor applications • Best-in-class design and engineering support Technologies interfacing the real world • Technologies for sensors, actuators and SoCs on modular CMOS, SOI and MEMS processes engineered in Germany • Flexible combination and integration of power, high-voltage, analog, sensors and non-volatile memory features • Dedicated MEMS foundry operations Manufacturing excellence • • • • 5 wafer fab facilities in Germany, Malaysia and US Capacity: 72,000 eight inch equiv. wafer starts per month All production sites are automotive qualified 2,500 employees worldwide 21 March 2016 Company Confidential 4 MEMS Offering High-volume MEMS production on 6" & 8" wafers Custom process manufacturing • Wide range of process capabilities e.g.: – Au, Pt, Cr, Ni, Cu, Mo deposition – Piezoelectric materials (PZT, AlN) – Eutectic bonding; thick Epi-silicon micro-machining … Open-platform technologies • 3-axis accelerometers & gyroscopes • Relative and absolute pressure sensors • Design support including IP blocks Integrated CMOS & MEMS manufacturing Other supported applications include: Medical/Biotech Infrared Sensors Wafer Level Packaging 21 March 2016 Micro-Mirrors RF MEMS Microphones Company Confidential 5 Process overview inertial sensor open-platform processes 21 March 2016 Company Confidential 6 XMS10 surface–micromachined capacitive MEMS foundry process • SOI wafer based technology • Sensor elements formed by Silicon DRIE process • Releasing of movable parts using isotropic Silicon etching • Cost effective wafer level packaging by wafer bonding Sensor principle • Detection of capacity changes, e.g. caused by inertial forces • Feasibility of electrical stimulation, e.g. detection of Coriolis forces (Gyro's) • Sensor capacity consists of interdigital structures • Element moving or finger bending in X-Y-plane 21 March 2016 Company Confidential 7 XMS10 discrete surface mounted micromachined devices • Gyroscopes • acceleration sensors MEMS components: • • • • • • • comb structures anchors springs moveable mass stopper Fixed-to-move transitions bond pads electrical connection using metal areas and substrate 21 March 2016 Company Confidential 8 XMS10: acceleration sensor 21 March 2016 Moveable mass Comb Springs Anchor Company Confidential 9 XMB10: 3-axis inertial sensor process Triple axis inertial sensor using cavity SOI wafer based technology Recessed fingers enable sensing in Z-direction 100% efficient silicon mass possible 21 March 2016 Company Confidential 10 Design flow: CMOS versus MEMS 21 March 2016 Company Confidential 11 State-of-the-art CMOS design flow Fully automated digital implementation • Synthesis of digital features based on high level description • Automated power- and timingaware placement and routing Semi-automated analog implementation • Connectivity- and constraintdriven • Layout automation using layout generators (pcells) and analog module generators 21 March 2016 Company Confidential 12 Feature-rich CMOS PDK Interface between foundry process and EDA tools PDK acts a process abstraction contains all data to work with the digital, analog and mixedsignal design-flows provides out-of-the-box support of the latest design flows 21 March 2016 Company Confidential 13 PDK components: CMOS vs. MEMS CMOS MEMS vs. 50% D_ CELLS IO_ CELLS DIGITAL RF_ CELLS I/O I_ CELLS OTHER IP Inertial application specific CELL LIBRARIES PRIMLIB PRIMITIVE LIBRARIES XY_ CELLS Pressure OTHER IP application specific CELL LIBRARIES 0% BSIM3V3 MC OCC P_ CELLS 0% 10% Assura (PVS) QRC … SIMULATION MODELS Assura (PVS) QRC DRC/LVS/RCX DRC/LVS/RCX 30% TECH_ XH035 TECHNOLOGY LIBRARIES xkit .il .cxt TECH_ XMS10 Design Flow / User Ware TECHNOLOGY LIBRARIES 10% xkit .il .cxt Design Flow / User Ware Status: 2012 21 March 2016 Company Confidential 14 Missing MEMS PDK support CMOS EDA tools expect a certain, CMOS-like process architecture HV CMOS process • device specific process layers • only one dielectric layer per stack level • polygon shapes with 90° or 135° angles Inertial MEMS sensor process • Different structures defined in the same layer • Multiple dielectric layers per stack level • Circular shapes, fixed width, maximum spacing… MEMS EDA tools usually do not support a PDK interface 21 March 2016 Company Confidential 15 Design flow: CMOS vs. MEMS Digital CMOS • automated Analog HV CMOS • Semi-automated MEMS ? • manual • Artwork: The quality strongly depends on the artist… 21 March 2016 [https://www.youtube.com/watch?v=ZHhu0qSrurE] Company Confidential 16 PDK-based design flow enablement for MEMS 21 March 2016 Company Confidential 17 research project “Schematic-Based Design of MEMS for Applications in Optics and Robotics” • funding initial BMBF F&E 16M3093 Project objective: “develop the first ever universal design methodology for MEMS to close the gap between electronics and mechanics design, manufacturing, and subsequent integration into products” [1] Project partners: * [1] MEMS2015: Schematic Driven MEMS Design for Applications in Optics and Robotics. (n.d.). Retrieved January 29, 2016, from https://www.edacentrum.de/en/projects/MEMS2015 * Coventor: Associated partner 21 March 2016 Company Confidential 18 MEMS PDK overview Similar to CMOS: MEMS PDK components enabling design flow 21 March 2016 Company Confidential 19 MEMS+ library customization Generic MEMS+ Component Library Design Rules Custom Library Sub Schematics 21 March 2016 Company Confidential 20 MEMS+ PDK Elements New Plugin Define Layer Set parameter defaults 21 March 2016 Company Confidential Look Parameter Constrain component parameter 21 MEMS+ PDK Elements (2) 21 March 2016 Company Confidential 22 MEMS+ PDK: design flow enablement MEMS+ PDK enables “lego-brick” design of MEMS 21 March 2016 Company Confidential 23 Virtuoso PDK: Pcells PRIMLIB with layout Pcells • • • • Bond Pad Crossing Fixed-To-Move Transition Frame 21 March 2016 Company Confidential 24 Virtuoso PDK: Layout implementation • Import MEMS-base structure • Placement of Fixed-ToMove-Transitions • Generate surrounding TCOVER and MECH • Generate metal at TCOVER edges • Route the sensor and cut-off TCOVER at crossings • Place routed sensor into the MEMS-frame 21 March 2016 Company Confidential 25 Virtuoso PDK: DRC checks process-specific layer-based design rules uses standard CMOS verification tool (Cadence Assura) support of design-rule-driven layout Challenges: structures, which are round or non-parallel to x- and y-axis? • solution: rule check with tolerance handle rules with fixed or maximum values? • solution: complex rule implementation device recognition without definition layers? • Only partly implemented (fixed- and movable parts) 21 March 2016 Company Confidential 26 Virtuoso PDK: LVS MEMS core is considered to be LVS clean • Both schematic and layout are generated within Coventor MEMS+ Final LVS after implementation of MEMS surrounding based on the extraction capabilities of CMOS verification tools • Extraction of fixed- and movable structures and electrical connections • Open-Short-check between layout and schematic 21 March 2016 Company Confidential 27 Virtuoso PDK: Parasitic Extraction Process architecture cannot be defined within one single PEX process files • At least 2 layers with different dielectric properties at the same level in the layer stack • General problem with CMOS PEX Tools PEX runset implementation with Cadence Quantus QRC • 2 separate prozess files • Supports extraction of parasitic capacitances and resistors in MEMS surrounding and below the MEMS structure • Extracted netlist can be used for post-layout simulation 21 March 2016 Company Confidential 28 Inertial Sensor IP 21 March 2016 Company Confidential 29 XMS10 MEMS IP Ready-to-use accelerometer IP Wafer-level packaged using wafer bonding 21 March 2016 Company Confidential 30 MEMS-IP Cell Library Cadence infrastructure for MEMS-IPs • Library, Cells, Views, CDF Parameter & Spectre/Verilog-A model library inertial sensor models für ACC001, ACC010 & ACC100 in XMS10 incl. corners tm, wc & wf Spectre Library typical mean worst capacity worst frequency 21 March 2016 Company Confidential 31 Reference Kit for easy adoption of new design flows 21 March 2016 Company Confidential 32 Adoption of new design flows The adoption of a new design flows needs some initial investment… EDA provider …which will pay back soon, due to higher performance, reduced development time and better quality EDA trainings and reference flows help, but are not sufficient EDA provider XFAB Reference ReferenceFlow - Tool1 Kit - Tool2… X-FAB Reference Kits close this gap! 21 March 2016 Company Confidential 33 X-FAB A/MS Reference Kit Overview demonstration of supported design tools and flows demonstration of advanced X-FAB design kit features ready-to-use package silicon-proven mixed-signal design fast and easy adoption of new design flows • detailed documentation • full setup for all implementation steps 21 March 2016 Company Confidential 34 X-FAB A/MS Reference Kit Cadence A/MS Design Flow Schematic XL Constraint Manager MODGENS Auto Placer Guard Rings VSR / Wire Editor Circuit Prospector Floorplanning EDI Digital Implementation Timing-driven Place & Route AoT Implementation 21 March 2016 Sensitivity Analysis Low-Power Implementation DRC, LVS, PEX ADE XL/GXL Company Confidential Sweeps & Corners Monte Carlo 35 X-FAB MEMS Reference Kit demonstration of MEMS design flow with Coventor MEMS+ and Cadence Virtuoso XMB10 MEMS+ and Virtuoso PDK ACC100-like device as a demonstrator 21 March 2016 Company Confidential 36 X-FAB MEMS Reference Kit MEMS design flow mechanical Specification electrical Results Viewer Electrical Design Symbol Schematic Results MEMS Netlist Netlist Simulator Layout LVS Re-Design MEMS+ Core Design MEMS+ CDS Import PEX .3dsch MEMS+ behavioural models .mpdk .proc .mmdb Primitive Components Layer Definition Material Database .tech Layer Definition Design Constraints FAB PDK 21 March 2016 Netlist Tape Out Company Confidential DRC .lib MEMS Primitives PEX-Rules LVS-Rules Design-Rules 37 Summary 21 March 2016 Company Confidential 38 Summary Feature-rich foundry MEMS-PDK for Cadence- and Coventor tools • The MEMS-PDK acts as an process abstraction – Process- and device parameters, material data base – Design layers, design rules encapsulates process information less expert process knowledge required! • The MEMS-PDK as an enabler of design automation – interface to EDA tools – Includes re-usable, predefined, process-specific components – Pcells for layout generation – Physical verification of implemented layout less implementation effort, better quality • MEMS PDK supports a continuous design flow using MEMS- and CMOS tools X-FAB Reference Kits for easy adoption of the new design flows 21 March 2016 Company Confidential 39 Thank you for your attention.
