Ideas for today`s engineers: Analog · Digital · RF

Transcription

Ideas for today`s engineers: Analog · Digital · RF
AUGUST2014
ALSO PUBLISHED ONLINE:
www.highfrequencyelectronics.com
Integrated
Framework for
Radar Design
IN THIS ISSUE:
Simplifying HDMI 2.0 Source
Impedance Measurements with a
VNA-Based Methodology
Market Reports
Meetings & Events
Featured Products
Product Highlights
Ideas for today’s engineers: Analog · Digital · RF · Microwave · mm-wave · Lightwave
RF, Microwave, and Millimeter-Wave Transmission Line Connectors & Components
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448 rev N
ALSO PUBLISHED ONLINE AT: www.highfrequencyelectronics.com
Vol. 13 No. 8
22
30
16
Feature Article
Feature Article
Featured Products
Integrated
Framework for Radar
Design
Simplifying HDMI 2.0
Source Impedance
Measurements
with a VNA-Based
Methodology
By Dr. Gent Paparisto
The NI-AWR integrated
framework provides
a unique avenue for
digital, RF, and system
engineers.
By Yoji Sekine
A new methodology
based on a Vector
Network Analyzer (VNA)
is now simplifying this
task.
Including Vubiq
Networks, Marki
Microwave, Pulse
Electronics, Modelithics,
Response Microwave.
38
12
60
New Products
In The News
Book Reviews
Highlighting Materials
Development for
Platforms, XMA Corp.,
Empower RF Systems,
Coaxicom.
Tom Perkins reviews
Microwave and Wireless
Measurement Techniques
and Modern Small
Antennas.
Including Anritsu,
MACOM, Richardson
RFPD, OML, Crane
Aerospace, Tango Wave,
RFMD.
4
august2014
6 Editorial
12 In the News
16 Featured Products
8 Meetings & Events
38 New Products
64 Advertiser Index
High Frequency Electronics
EDITORIAL
Vol. 13 No. 8 August 2014
Publisher
Scott Spencer
[email protected]
Tel: 603-472-8261
Associate Publisher/Managing Editor
Tim Burkhard
[email protected]
Tel: 707-544-9977
Senior Technical Editor
Tom Perkins
[email protected]
Tel: 603-472-8261
Vice President, Sales
Gary Rhodes
[email protected]
Tel: 631-274-9530
Editorial Advisors:
Ali Abedi, Ph.D.
Candice Brittain
Paul Carr, Ph.D.
Alen Fezjuli
Roland Gilbert, Ph.D.
Sherry Hess
Thomas Lambalot
John Morelli
Karen Panetta, Ph.D.
Business Office
Summit Technical Media, LLC
One Hardy Road, Ste. 203
PO Box 10621
Bedford, NH 03110
Also Published Online at
www.highfrequencyelectronics.com
Subscription Services
Sue Ackerman
Tel: 651-292-0629
[email protected]
Send subscription inquiries and address
changes to the above contact person. You
can send them by mail to the Business
Office address above.
Our Environmental Commitment
High Frequency Electronics is printed
on paper produced using sustainable forestry practices, certified by
the Program for the Endorsement
of Forest Certification (PEFC™),
www.pefc.org
Copyright © 2014, Summit Technical Media, LLC
6
High Frequency Electronics
A Sober Remembrance:
August 1945
Tom Perkins
Senior Technical Editor
The last week of July 2014 marked two happenings
that evoke pause and thought about events that
occurred in August 1945. I speak of the atom bomb
drops at Hiroshima and Nagasaki, Japan. On Sunday,
July 27, a WGN TV series simply called Manhattan
had its premiere. The next day, July 28, Major
Theodore ‘Dutch’ Van Kirk died at age 93. He was the
last surviving crew member of the B-29 bomber Enola
Gay that delivered the first bomb on August 6, 1945.
He (then a Captain) was the navigator, but also had a distinguished
record earlier in the European theater, along with pilot Col. Paul W.
Tibbets Jr. and bombardier Major Thomas Ferebee.
The Manhattan Project, which began modestly in 1939, like the MIT
Radiation Laboratory (emphasis on RADAR), was a highly focused effort.
More than 130,000 people were eventually involved, primarily in New
Mexico, Tennessee and Washington State. Separate and apart from ethical and moral arguments regarding the justification for use and the
results, which are appropriate for other forums but entirely beyond the
charter of a technical publication, I am still amazed at how rapidly the
technology was employed, and then repeated, in one August week, 69
years ago. Not only was its success critically important. On two some­
what different devices, the delivery system — ships and then (modified
B-29 bombers), bases for those planes, and trained crews—had to be
ready. The time lapse between the Trinity nuclear (implosion) test July
16 and the Hiroshima drop (“Little Boy”) which used a “gun-type” design
was just three weeks. The (“Fat Man”) Nagasaki bomb dropped on August
9 was more like the tested Trinity bomb. By mid-August, World War II
thankfully and abruptly ended.
Tail Warning to Radar Altimeter
So, what is the relevance to High Frequency Electronics? Well, about
25 years ago an engineer (now deceased) here in New Hampshire
described briefly a microwave (really UHF) component involving at least
one, or possibly both bombs. I think he had known folks directly involved
in the work. I hadn’t thought about this until recently, and wish I had
recorded what he told me. Some research on the internet disclosed the
following, which sounds somewhat similar.
The arming and firing sequence for the first two atomic bombs was as
follows. (1) arming wires were pulled out when the bomb was released;
(2) 15 seconds after release, when the weapon had fallen 3,600 feet, the
timer switches closed part of the firing circuit; (3) at an altitude above
ground level (AGL) of 7,000 feet, a
barometric switch closed another
part of the firing circuit and allowed
electrical current from batteries in
the bomb to charge a number of
capacitors and turn on the radar
fuzes; (4) at an altitude of approximately 1,850 feet AGL, radar signals
emanating from the “Archies”
(derived from the US Army Air
Corps AN/APS-13) and reflecting
from the ground completed the last
part of the firing circuit and triggered the detonation signal. “Archie,”
designed and manufactured by RCA,
operated at frequencies of 410 to 420
MHz and had an effective range of
about 2,500 feet. The Archie system
AN/APS-13 (SCR 718) airborne tail
warning radar was originally used
in fighter planes—apparently P-51
Mustangs. Two of four redundant
“Archies” had to respond as the bomb
went through the critical altitude to
reduce the possibility of false trigger.
There was a backup mechanical fuze
in case Archie failed. It worked, however.
the Self-Employed Engineer. While
there is sympathy towards the problem, one company informs us that
they are actually working on a solution. They are considering charging
a licensee only for the time actually
used working with the software program, instead of a flat fee.
Alternatively, they are looking at a
short term “rental” program. Perhaps
Ka-Band
we’ll see some innovative alternatives in the near future.
HFE
Inflight
Communication
Solutions
MITEQ offers a wide range of flight proven
[RTCA D0-160 E/F] components and
subsystems at Ka-Band
Internet
Low Noise Amplifiers
•
•
•
•
Confluence of Technologies
If one were to attempt to make a
modern Gantt Chart including
dependencies (precedence network)
between activities for development
of the atomic bomb, even in retrospect, it would be quite a chore. The
Manhattan Project, which is an
important part of history, is well
worth examining even if you don’t
wish to contemplate the consequences. From a purely technical standpoint, the Project was a dramatic
success.
17.7–21.2 GHz with Noise Figures as low as 1.25 dB
Lightweight/Hermetic
Waveguide or Coaxial
Low Voltage [+5 VDC]
Modular
Frequency Converters
• Small Efficient Up/Downconverters
• Wideband IF coverage
• High Linearity
Power Amplifiers
• 29.5-31 GHz
• Power levels to 10 watts
• Adjustable Gain
PIN Diode Switches
• SP2T-SP4T Coaxial Absorptive type
• High Isolation
Frequency Sources
EM Software Update
While at IMS2014, I mentioned
with several vendor exhibitors the
problem regarding EM software
access discussed in my April 2014
HFE Editorial, Design Software for
• Ultra-low Phase Noise vibration insensitive
• Step sizes down to 1 kHz (synthesizer)
www.miteq.com
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MEETINGS & EVENTS
Conferences
2014 IEEE MTT-S International Symposium on
Radio-Frequency Integration Technology (RFIT 2014)
27-30 August 2014
Heifi, Huangshan, China
http://www.rfit2014.org
2014 IEEE International Conference on Ultra-Wideband
(ICUWB 2014)
1-3 September 2014
Paris, France
http://www.icuwb2014.org
2014 IEEE Conference on Electrical Performance of Electrical Packaging and Systems (EPEPS 2014)
26-29 October 2014
Portland, Oregon
http://epeps.ece.illinois.edu
2014 IEEE MTT-S International Microwave and RF Conference (IMaRC)
15-17 December 2014
Bangalor, India
http://www.imarc-ieee.org
Paper Submission Deadline: 15 August 2014
2015 IEEE MTT-S Radio Wireless Week (RWW 2015)
25-28 January 2015
San Diego, California, USA
http://www.radiowirelessweek.org/
Radio Wireless Week consists of 5 co-located topical
conferences:
RWS: IEEE Radio and Wireless Symposium
PAWR: IEEE Topical Meeting on Power Amplifiers for
Wireless and Radio Applications
SiRF: IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
BioWireleSS: IEEE Topical Conference on Biomedical
Wireless Technologies, Networks, and Sensing Systems
WiSNet: IEEE Topical Meeting on Wireless Sensors and
Sensor Networks
Paper Submission Deadline: 25 July 2014
2015 IEEE International Wireless Symposium (IWS 2015)
30 March-1 April 2015
Shenzhen, China
http://iws-ieee.org/
2015 IEEE Wireless and Microwave Technology Conference (WAMICON 2015)
13-15 April 2015
Cocoa Beach, Florida, USA
http://www.wamicon.org/
Paper Submission Deadline: 5 January 2015
2015 IEEE MTT-S International Conference on Microwaves
for Intelligent Mobility (ICMIM 2015)
27-29 April 2015
Heidelberg, Germany
http://www.icmim-ieee.org
Paper Submission Deadline: 20 December 2014
8
High Frequency Electronics
2015 IEEE MTT-S International Wireless Power Transfer
(WPTC 2015)
13-15 May 2015
Boulder, Colorado, USA
http://www.wptc2015.org/
Paper Submission Deadline: 16 January 2015
2015 IEEE International Microwave Symposium (IMS2015)
17-22 May 2015
Phoenix, Arizona, USA
http://ims2015.org/
Paper Submission Deadline: 8 December 2014
2015 IEEE Radio Frequency Circuits Symposium (RFIC
2015)
17-19 May 2015
Phoenix, Arizona, USA
http://rfic-ieee.org/
Paper Submission Deadline: 12 January 2015
85rd ARFTG Microwave Measurement Symposium Topic
22 May 2015
Phoenix, AZ, USA
http://www.arftg.org/
2015 IEEE MTT-S International Conference on Numerical
Electromagnetic Modeling and Optimization for RF, Microwave and Terahertz Applications (NEMO 2015)
11-14 August 2015
Ottawa, Canada
http://nemo-ieee.org
Paper Submission Deadline: 16 February 2015
Company-Sponsored
Training & Tools
Analog Devices
Training, tutorials and seminars.
http://www.analog.com/en/training-tutorials-seminars/resources/index.html
AWR
On-site and online training, and open training courses on
design software.
http://web.awrcorp.com/Usa/News--Events/Events/
Training/
National Instruments
LabVIEW Core 1
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
LabVIEW Core 2
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
Object-Oriented Design and Programming in LabVIEW
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
Free, online LabVIEW training for students and teachers.
http://sine.ni.com/nievents/app/results/p/country/
us/type/webcasts/
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MARKET REPORTS
Wi-Fi Double-Digit Growth to
Continue
Qualcomm-Atheros’ recently announced portfolio of
802.11n/ac MU-MIMO “Wave 2” chips represents the next
evolution of Wi-Fi to higher data rates and capacity, helping stimulate demand for Wi-Fi routers and Wi-Fienabled mobile devices. The Strategy Analytics report,
“Wi-Fi Chipset and RF Front-End Opportunities: 802.11ac,
ad, Phones, New Standards and Applications,” predicts
that 802.11n/ac with MU-MIMO will help propel the
Wi-Fi market to 3 billion systems shipped in 2018, at
the same time pushing the market for external RF power
amplifiers for Wi-Fi up by more than 50 percent from
2013 sales, to the benefit of Skyworks, RFMD, TriQuint
and other suppliers.
Based on a detailed analysis of Wi-Fi adoption and
radio component architectures in 24 types of Wi-Fi systems, the report includes historical shipment estimates
and specifications for the latest Wi-Fi radio SoCs and
power amplifiers.
“The Wi-Fi SoC suppliers have worked hard to incorporate LNAs, PAs and RF switches on chip, but moving to
smaller CMOS nodes and higher throughputs and linearity at 5 GHz for 802.11ac has made integration of the RF
functions more challenging. Many upcoming Wi-Fi
devices will use external PAs over the next five years,”
said Strategy Analytics’ Christopher Taylor.
“External CMOS PAs have started to compete with
GaAs-based PAs in Wi-Fi just as in cellular, but GaAs
will maintain its position for the foreseeable future,
especially in higher-performance applications such as
802.11ac Wi-Fi infrastructure,” remarked SA’s Eric
Higham.
—Strategy Analytics
strategyanalytic.com
Global Defense Market Gaining
Momentum
The global defense market is gaining momentum as
the near end of platform service life in several nations
forces investment in new builds and the extensive use of
maintenance, repair and overhaul, logistics, and training
services. Market participants should target countries
such as India, Turkey, Poland, Taiwan, Japan, South
Korea and Brazil, which can now afford to routinely
purchase and co-produce state-of-the-art platforms and
replace older cold-war era equipment.
New analysis from Frost & Sullivan’s Global Defense
Outlook finds defense procurement spending stood at
$600 billion in 2013 and is expected to reach $660 billion
in 2018. Command, control, communications, computers,
intelligence, surveillance and reconnaissance (C4ISR)
contributed the most to market revenues in 2013 due to
10 High Frequency Electronics
the high demand for radars, optical sensors, sonars, and
secure flexible networks.
“Market participants have adequate opportunities for
growth, with Saudi Arabia, Germany and other countries expanding and upgrading their military capabilities
to counter the threat posed by the increased number,
range, accuracy, and lethality of land-based missile systems, naval power projection, and basing in North Korea,
China, Russia and Iran,” said Frost & Sullivan Aerospace
& Defense Senior Industry Analyst Brad Curran.
However, economic uncertainty, particularly in
Western nations, has lowered national budgets, causing
intense competition for budget share between defense
and domestic programs. This is suppressing the demand
for military equipment.
“Not surprisingly, market participants are facing a
situation of overcapacity, which is forcing the industry to
consolidate or enter joint ventures and engage in technology transfer,” noted Curran. “Market participants are also
adopting a long-term perspective, maintaining smaller
margins, and forging partnerships with commercial providers.”
To prevent further overcapacity, vendors must focus
on unmet customer needs, which include submarines,
unmanned vehicles, and networked sensors and
communications. Strong customer relationships and
robust support services are also necessary to strengthen
presence in the market.
—Frost & Sullivan
frost.com
300Mbps Smartphone Modem
Shipments Growing
Shipments of second-generation LTE basebands, commonly called Cat4, enabling mobile users to enjoy up to
150 Mbps bandwidth, barely exceeded 42 million in 2013.
However, key chipset suppliers are stretching their muscles for next-generation basebands that will enable
speeds of up to 300 Mbps, namely Cat6 chips. ABI
Research indicates that cumulative shipments of Cat6
chips targeting smartphones are expected to exceed 700
million by the end of 2019.
Qualcomm is the market leader when it comes to
supplying LTE chips for mobile devices. The company
maintained an unrivalled leadership across several generations of LTE, but with the emergence of Cat6, some
specific competitors could challenge Qualcomm in this
market space. However, other mainstream chipset suppliers such as Spreadtrum and MediaTek might enter the
race for LTE speed quite late as these vendors will focus
more on entry level LTE devices.
—ABI Research
abiresearch.com
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IN THE NEWS
ments. This capability allows for simultaneous optimization of efficiency and linearity—a key goal of all transmitters and power amplifiers designed to quickly deliver
large amounts of data on the emerging, net-dependent
battlefield.
“This SoC can support a range of modulation formats, so
it’s possible to communicate to multiple systems using
different waveforms from a single silicon chip,” Palmer
said. “Its efficient silicon construction will significantly
reduce SWAP [size, weight, and power] requirements for
millimeter-wave applications, including compact satellite
communications ground terminals for frontline troops.
These new capabilities will provide connectivity to more
service members faster and at lower cost.”
The DARPA performer for the all-silicon SoC is Northrop
Grumman Aerospace Systems.
Darpa Image
Many existing compact, high-data-rate millimeterwave wireless communications systems use integrated circuits (ICs) made with gallium arsenide (GaAs)
or gallium nitride (GaN). These circuits provide high
power and efficiency in small packages but are costly to
produce and difficult to integrate with silicon electronics
that provide most other radio functions. Silicon ICs are
less expensive to manufacture in volume than those with
gallium compounds but until now have not demonstrated
sufficient power output and efficiency at millimeter-wave
frequencies used for communications and many other military applications, such as radar and guidance systems.
Researchers with DARPA’s Efficient Linearized All-Silicon
Transmitter ICs (ELASTx) program recently demonstrated an all-silicon, microchip-sized transmitter—a
system on a chip (SoC)—that operates at 94 GHz.
This accomplishment marks the first time a silicon-only
SoC has achieved such a high frequency, which falls in the
millimeter-wave range.
“What normally would require multiple circuit boards,
separate metal shielded assemblies and numerous I/O
cables we can now miniaturize onto one silicon chip
about half the size of an adult’s thumbnail,” said Dev
Palmer, DARPA program manager. “This accomplishment opens the door for co-designing digital CMOS
[complementary metal oxide semiconductors] and
millimeter-wave capabilities as an integrated system on an all-silicon chip, which should also make
possible new design architectures for future military RF systems.”
The all-silicon SoC transmitter uses a digitally assisted
power amplifier that dynamically adapts amplifier performance characteristics to changing signal require12 High Frequency Electronics
Darpa Image
Military platforms—such as ships, aircraft and ground
vehicles—rely on advanced materials to make them lighter, stronger and more resistant to stress, heat and other
harsh environmental conditions. Currently, the process
for developing new materials to field in platforms
frequently takes more than a decade. This lengthy
process often means that developers of new military platforms are forced to rely on decades-old, mature materials
because potentially more advanced materials are still
being tested and aren’t ready to be implemented into
platform designs.
DARPA’s Materials Development for Platforms (MDP)
program seeks to address this problem by developing
a methodology and toolset to compress the applied
material development process by at least 75 per-
IN THE NEWS
cent: from an average of 10 years
or longer to just two and a half
years. To achieve this goal, the program intends to establish a crossdisciplinary model that incorporates
materials science and engineering, Integrated Computational
Materials Engineering (ICME)
principles and the platform development disciplines of engineering,
design, analysis and manufacturing.
XMA Corp. announced it has
achieved AS9100 Rev C registration.
Marc Smith, President and CEO
commented, “As an industry leader for
RF, Microwave and Millimeter wave
products, XMA believes the AS9100
Rev C registration is not only an
important step in our growth strategy
and customer satisfaction, but also
serves as a testament to the dedication of our employees and our commitment for continuous improvement.”
XMA also appointed CK Associates
as its exclusive sales representatives
for the Southwestern U.S.
Get info at www.HFeLink.com
14
14 High
High Frequency
Frequency Electronics
Electronics
Empower RF Systems announced
the approval of a patent on
“Broadband linearization module
and method.” The patent was submitted and authored for Empower by
Paulo Correa and Andre A. Castro.
In the approved abstract released by
the U.S. Patent & Trademark Office
the patent is described as “A system
including a power amplifier and a
pre-distortion module coupled to the
power amplifier. The pre-distortion
module includes one or more smaller
versions of the power amplifier to
generate a pre-distortion signal that
compensates for any memory-effect
or inertia present in the power ampli-
fier with application on frequency
hopping and larger (up to 1 octave)
instantaneous bandwidth communications systems.”
Coaxial Components Corp. also
known worldwide as Coaxicom, a
leading U.S. manufacturer of RF microwave components, announced that it
has received AS9100C Certification
after satisfying an audit of rigorous
process control, quality management,
and risk management required for
registration. Established as the industry’s gold standard for quality and
control, AS9100C is a quality management certification that assures
the highest quality RF components
by providing traceability, risk management, process control, Customer
support, product availability and completeness of documentation.
Analog Devices, Inc. Technology
Fellow Bob Adams, a leader in
the development of groundbreaking
multi-bit sigma-delta data converters, has been selected to receive the
2015 IEEE (Institute of Electrical
and Electronics Engineers) Donald
O. Pederson Award in SolidState Circuits by the IEEE Board
of Directors. Adams’ distinguished
career spans decades and includes
many groundbreaking inventions
across a wide range of disciplines,
including the fields of audio conversion and DSP (digital signal processing). The IEEE Donald O. Pederson
Award in Solid-State Circuits traditionally has been awarded to highprofile academics, but Adams is
among a select group with an industry background.
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HFE | Featured Products
can be used in wireless devices,
broadband circuits, RFID devices,
RF transceivers, modules, and medical devices.
Pulse Electronics
pulseelectronics.com
Mixer
The ultra-high linearity, broadband
T3 mixers are now offered with complete frequency overlap on all three
ports up to 18 GHz. The T3H-18 and
T3H-20 feature RF/LO coverage of
.01 - 18/20 GHz, with matching IF
coverage of .01 - 18 GHz. These triple balanced mixers allow virtually
any frequency plan from VHF-Ku in
a single unit. With the superior spurious (and two tone) suppression of
the T3 mixer series, and low conversion loss, these arbitrary frequency conversions can be completed
cleanly and with excellent dynamic
range.
Marki Microwave
markimicrowave.com
Rotary Joints
Fairview Microwave announced a
new line of single-channel/singleaxis and single-channel/multi-axis
RF totary joints. RF rotary joints
are needed wherever RF signals
have to be transmitted between stationary and moving parts of a system, commonly used in commercial
and military radar, land-mobile-radio communications and anti-missile defense applications.
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Transistor
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16 High Frequency Electronics
application. Ideal for professional
and military communications, radar systems, test instrumentation
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YTOs
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Inductors
Pulse Electronics announced a new
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Simulation Model Library
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CTS Corp. released two new sample
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Vubiq Networks
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Response Microwave
responsemicrowave.com
DRO
Signal Sources
18 High Frequency Electronics
Vubiq Networks released a fully
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DC Block
Response Microwave announced its
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Transmitter Module
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SAGE Millimeter
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Isolator
For SATCOM on-the-Move (SOTM)
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applications including use in black
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bandwidth requirement of 27.5 to
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Pasternack
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Software Portfolio
NI (formerly AWR Corp.) has released V11.01 of the NI AWR Design
Environment™ with enhancements
to Analyst™ 3D finite element
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National Instruments
ni.com
Image Reject Mixer
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20 High Frequency Electronics
Power Amp
Model SBB-0134033016-KFKF-SB
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High Frequency Design | Radar Design
Integrated Framework for
Radar Design
By Dr. Gent Paparisto
The NI-AWR integrated
framework provides a
unique avenue for digital,
RF, and system engineers.
Introduction
As modern radar systems become more complex, they depend heavily
on advanced signal processing algorithms to improve detection performance, making their design and implementation more challenging and
expensive. At the same time, the radio front end must meet specifications
that are often a combination of available devices, implementation technologies, regulatory constraints, requirements from the system, and sig-
nal processing.
To overcome these challenges, digital and RF/microwave engineers are increasingly cooperating such that the overall system performance metrics are jointly optimized across the two
disparate domains. This paper demonstrates how this can be done using the NI AWR Design
Environment™ combined with NI LabVIEW and PXI instruments to design, validate, and
prototype a radar system. The NI-AWR integrated framework provides a unique avenue for
digital, RF, and system engineers, to all collaborate on a complex radar system.
EDA tools offer a unique value in this process: they help to accelerate the design process
and reduce the cost of system implementation and testing. While computers are becoming
cheaper and more powerful every day, the simulation complexity associated with radar systems is also growing. Hence, innovative solutions are needed to facilitate and shorten the
design cycle.
Another challenge unique to radar systems is the wide variety of signal sources and signal
processing algorithms used by different types of radar and/or manufacturers. Due to the
nature of this field, there is little standardization and most manufacturers rely heavily on
proprietary designs for their products. This makes it difficult for any EDA tool to provide a
comprehensive library.
NI AWR has taken the approach of providing a number of radar signal sources and signal
processing capabilities that are well documented in the technical literature, along with a set
of tools that make it easy for users to implement and test their own proprietary signals,
designs, and algorithms.
The AWR simulation tools and hardware offered by NI provide a framework that can be
indispensable for engineers working at the system, sub-system, and hardware level. They
enable various engineering groups to work on the same platform while developing and testing
their particular elements at different levels of the design process. One advantage of this
approach is that all groups involved in the design process employ the same IP throughout the
phases of product development and testing, reducing risks associated with potential inconsistencies between offerings from different tools and/or manufacturers.
Radar System Modeling
The radar signal design has evolved significantly over the last decades and a wide variety
of radar signals and detection techniques have been developed for different applications [1].
While simple continuous wave (CW) radar signals are still used to estimate target velocity,
many systems employ various versions of pulsed linear FM, also known as Chirp- or Pulsed22 High Frequency Electronics
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478 rev N
HF Design | Radar Design
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Figure 1 • Simple block diagram of a radar system.
Doppler radar. Such signals allow users to achieve both range detection
and relative velocity measurements [2].
A simple block diagram of a radar system is shown in Figure 1.
The NI AWR Visual System Simulator™ (VSS) Radar Library offers a
wide range of capabilities for antennae, propagation and target models.
System designers can simulate various propagation environments using
the TX and RX antenna models, allowing definition of antenna patterns
and different angles of arrivals for different reflections of the signal of
interest and/or interferers and clutter. Specific models are also provided
for jammers, RF clutter, etc. The target is modeled using its radar cross
section (RCS), which can be calculated based on its geometry or defined by
the user based on measurements. Furthermore, target dynamics may be
defined, either theoretically or generated using third-party tools.
The signal processing at the receiver contains several well-defined
algorithms, including a second-order moving target indicator (MTI), a
moving target detector (MTD) and a constant false alarm rate (CFAR)
calculator. While users may have their own proprietary designs for such
functionality, the NI AWR Design Environment™ makes it easy to add
such custom implementations to the overall radar system simulation.
Furthermore, customers are able to take advantage of the VSS framework
to test and verify their implementations of their proprietary algorithms.
Get info at www.HFeLink.com
24 High Frequency Electronics
System and Algorithm Design
In order to define the architecture and requirements for each of the
blocks in this diagram, computer simulations using various EDA tools are
always the first step in the design process. Such tools enable system engineers to define requirements for radar system components at the system
level, which are then passed on to the sub-system and hardware designers.
Realistic models for the signals, RF links and the environment are crucial
for achieving reliable results during this process.
The signal generation and signal processing stages always require
careful consideration during the various development phases, from design
to implementation, prototyping, manufacturing, testing, and verification.
A unique approach of the NI AWR framework is that it enables the use of
the same IP from the initial design phase all the way to manufacturing,
testing, and verification. This eliminates potential inconsistencies between
signal sources and/or detection signal processing implementations used
during different phases of the design process and reduces the amount of
time spent on transitioning between them.
To take advantage of this approach, the VSS platform is used as the
main framework for simulations of the radar system. Various blocks of the
diagram above can be implemented in VSS, LabVIEW, or any other thirdparty tool that can seamlessly co-simulate with VSS. The advantage of
implementing some of the blocks in LabVIEW is that it provides a clear
path towards hardware-in-loop (HIL) simulations or a fast implementation in various FPGA boards offered by NI. This would provide an accelerated path toward prototyping and testing with real hardware.
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26 High Frequency Electronics
Figure 3 • Cascaded noise figure measurement at
each point of the RF link.
Figure 4 • Available gain at each point of the RF link.
System and algorithm design
Circuit engineers working on components for radar
systems are tasked with providing RF components or
complete transmitter/receiver RF links that comply
with the requirements defined by system designers.
Traditionally, these two groups have worked separately
and have relied on a set of hardware requirements for
designing and testing the components and/or RF links.
The NI AWR Design Environment provides a unique
solution where design and testing of the RF components/links can be accomplished in much tighter collaboration with the systems engineers. Microwave
Office® provides seamless co-simulation with the VSS
system tool, hence circuit designers are able to verify
the performance of their components using system-level
simulations and measurements. This approach shortens
the time required for collaboration between systems and
circuit designers and avoids the need for over-specification or over-design of components in order to ensure
proper performance of the circuit designs as part of the
overall system.
An example of typical analysis performed during the
design of a transmitter RF link is in Figure 2 [3]. A twostage up-converter architecture is
employed, and a monolithic microwave integrated circuit (MMIC) power
amplifier (PA) designed in Microwave
Office is used as part of this link. VSS
is used to perform a number of cascaded budget measurements.
The measurements shown in
Figures 3 and 4 include the cascaded
noise figure (NF) and available gain
at each point of the RF link. Other
measurements can be easily obtained
using the same system diagram, but
they are not shown here due to space
restrictions.
Another type of analysis that is
performed in VSS is spur heritage
analysis, which enables designers to
track down the heritage of each spur
observed at various point of the RF
link. Understanding the heritage of
the spur helps in modifying the link
design to reduce and/or eliminate
such spurs.
lyzers (VSA). They can be used for generating radar
signals based on the VSS models, driving the RF components under test, and capturing the signal, which is then
sent back to the VSS receiver signal processing unit.
This configuration enables testing of RF components
with realistic signals and evaluating them using system-level measurements.
A recent offering from NI is the vector signal transceiver (VST) [5], which combines a VSG and a VSA with
Hardware
Simulations
and
Prototyping
This phase of the design process
consists of testing various components
and/or RF links developed for a radar
system. An important component for
achieving this is the NI PXI platform
[4]. PXI is a rugged PC-based platform for measurement and automation systems. Because it is both a
high-performance
and
low-cost
deployment platform, it is ideal for
applications such as manufacturing
test, military and aerospace, and
industrial test. PXI can host various
controllers, modules, and software,
making it ideal for development and
rapid prototyping efforts.
Some of the PXI modules employed
in this process are vector signal generators (VSG) and vector signal anaGet info at www.HFeLink.com
27
High Frequency Design | Radar Design
Figure 5 • Another type of analysis that is performed in
VSS is spur heritage analysis.
FPGA-based real-time signal processing and control.
The advantage of this module is that it enables users to
implement part of their receiver in FPGA to be used as
a hardware accelerator for the computationally-intensive signal processing algorithms, such as the MTD and
CFAR. The latter blocks usually consist of proprietary
algorithms and implementations and require extensive
testing using controlled target dynamics and environment conditions. To achieve this, a test bench was developed using a combination of NI AWR EDA software and
NI hardware. This test bench uses VSS to model the
radar signal, transmitter RF link, propagation environment, target dynamics, and receiver front end and stores
the signal at the input of the receiver baseband section
for various configurations of the target dynamics and
propagation environment. These signals are then used
by the PXI to drive the MTD and CFAR algorithms
implemented in a hardware platform, such as FPGA
boards, resulting in much faster simulation and testing
of such algorithms. The benefit of such an approach is
that the signal used for testing of the baseband algorithms contains all the effects of hardware implementation and controlled target dynamics and propagation
environment, and it takes advantage of hardware acceleration, providing much faster results.
As an example of such a methodology, the signal at
the output of the MTD processor is shown in Figure 6,
when a single target is present. The results show measurements of the target range and Doppler offset estimated by the signal processing algorithms.
Conclusion
This paper has presented a framework that can be
used for the design, development, and testing of modern
radar systems. This framework takes advantage of the
extensive RF design and measurement capabilities of NI
AWR VSS and the flexibility of the NI PXI hardware,
28 High Frequency Electronics
Figure 6 • The signal at the output of the MTD processor
when a single target is present.
offering a unique platform that enables designers to use
the same IP from design/simulation all the way to the
implementation/testing phase. Such an approach accelerates the design process, yields better components and
reduces the need for lengthy validation periods when
moving between different phases of the product cycle,
driving faster time to market.
About the Author:
Dr. Gent Paparisto serves as Senior Systems
Engineer, AWR Group, National Instruments.
References
[1] G. Eason, B. Noble, and I. N. Sneddon, “On certain
integrals of Lipschitz-Hankel type involving products of
Bessel functions,” Phil. Trans. Roy. Soc. London, vol.
A247, pp. 529–551, April 1955. (references)
[2] J. Clerk Maxwell, A Treatise on Electricity and
Magnetism, 3rd ed., vol. 2. Oxford: Clarendon, 1892,
pp.68–73.
[3] I. S. Jacobs and C. P. Bean, “Fine particles, thin
films and exchange anisotropy,” in Magnetism, vol. III,
G. T. Rado and H. Suhl, Eds. New York: Academic, 1963,
pp. 271–350.
[4] K. Elissa, “Title of paper if known,” unpublished.
[5] R. Nicole, “Title of paper with only first word
capitalized,” J. Name Stand. Abbrev., in press.
[6] Y. Yorozu, M. Hirano, K. Oka, and Y. Tagawa,
“Electron spectroscopy studies on magneto-optical media
and plastic substrate interface,” IEEE Transl. J. Magn.
Japan, vol. 2, pp. 740–741, August 1987 [Digests 9th
Annual Conf. Magnetics Japan, p. 301, 1982].
[7] M. Young, The Technical Writer’s Handbook. Mill
Valley, CA: University Science, 1989.
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High Frequency Design | Impedance Measurements
Simplifying HDMI 2.0 Source
Impedance Measurements with
a VNA-Based Methodology
By Yoji Sekine
The HDMI 2.0 specification, released by the HDMI Forum on
September 4, 2013, increases the maximum per lane throughput from 3.4
Gbit/s to 6 Gbit/s. The result is a maximum total throughput of 18 Gbit/s,
which can support 4K image transmission with a 4:4:4 full-color format.
While this bodes well for consumers, it also presents a number of measurement challenges. One key challenge stems from the fact that the
transmission rate is nearly doubled and yet it is still necessary to support
existing HDMI cables. This raises interoperability issues due to poor signal integrity.
One reason for the poor signal integrity is impedance mismatch of active devices.
Impedance matching is essential in the design of high-speed applications and many modern
high-speed digital standards specify limits for impedance and return loss. For HDMI 2.0, the
source and sink differential impedance requirements are detailed in section HF1-9 and HF2-4
of the Compliance Test Specification. Most of the standards require that devices operate during measurements, because device characteristics will differ between the power-on and the
power-off states. Depending on the device design, the impedance may also differ for different
data rates as well (Figure 1). To obtain an accurate representation of the impedance, it is
therefore crucial to evaluate the impedance of active devices under actual operating condi-
A new methodology
based on a VNA is now
helping to dramatically
simplify this task.
Figure 1 • These graphs illustrate the source impedance and return loss with power off (red),
power on at 1333 Mbps (blue), and power on at 334 Mbps (green).
30 High Frequency Electronics
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515 rev D
High Frequency Design | Impedance Measurements
Due to instrument architectural
differences, however, VNAbased solutions provide significant advantages over the traditional solutions based on TDR
oscilloscopes.
Figure 2 • Multiple reflections between the source and
diagram.
tions. Fortunately a new methodology based on a Vector
Network Analyzer (VNA) is now helping to dramatically
simplify this task.
Measuring Source Impedance
The impedance measurement of active devices in the
powered-on and operating state is called Hot TDR. Hot
TDR measurements are difficult to make because the
signal from the source causes measurement errors. The
key measurement challenge here is how to avoid the
effects of the source output signal and provide stable
measurements.
Generally, TDR oscilloscopes have been used to measure Hot TDR. VNAs can also be used for this purpose.
Importance of Impedance
Matching
The eye diagram is a key
metric for signal integrity engineers. One factor impacting the
eye opening is signal reflection
due to impedance mismatch.
When there is more than one
impedance mismatch in the
link, multiple reflections occur
and degrade signal integrity. A
portion of the transmitted sigsink are shown in this nal is reflected from the sink
due to non-ideal impedance
match, as shown in Figure 2. If
the source is not impedance
matched, the signal is re-reflected back again into the
channel and causes eye closure when it reaches the sink.
This effect becomes more critical for multi-gigabit systems, such as HDMI 2.0. Impedance matching on the
source and sink is therefore, essential to improving signal integrity and opening up the eye diagram.
The eye diagrams in Figure 3 depict simulation
results for the purpose of comparing different termination conditions. The eye diagram on the left was computed using the return loss extracted from an actual
source device that is not impedance matched. The eye
diagram on the right was computed assuming a perfectly terminated source. Obviously, the eye diagram on
the right has a wider eye opening, verifying that imped-
Figure 3 • This eye diagram compares simulation results without (left) and with (right) ideal source termination.
32 High Frequency Electronics
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w w w . r e l c o m m t e c h . c o m
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High Frequency Design | Impedance Measurements
Figure 4 • Shown here are the Hot TDR measurement principles for TDR oscilloscopes and VNAs.
ance matching of the source can in fact dramatically
improve eye opening.
Effects of the Source Signal on Measurement
Both the TDR oscilloscope and VNA work by applying a stimulus to the Device-Under-Test (DUT) and
measuring the response. To measure the response, the
TDR oscilloscope uses a wideband receiver up to the
maximum bandwidth of the instrument, typically 20
GHz. The VNA, on the other hand, uses a narrowband
receiver; typically on the order of 10 kHz.
As can be seen in the frequency domain plot in
Figure 4, the impact of the data signal from the source
is dramatically different, depending on whether the
TDR oscilloscope or VNA is employed. The data signal is
represented by a number of line spectra, or spurious, in
the frequency domain. Since the TDR oscilloscope uses a
wideband receiver that captures all of the signal energy,
including source spurs, the measurement result is highly noisy. To reduce the noise, extensive averaging (on the
order of 1000 times) is necessary. In contrast, the VNA
sweeps across the desired frequency range acquiring
data on discrete frequency points. The narrowband
34 High Frequency Electronics
receiver used in the VNA filters out the unwanted
source spurs and, in many cases, averaging is not necessary. The result is a significant speed advantage for the
VNA-based solution.
When the receiver sampling points coincide with the
source spur frequency, the source signal energy cannot
be minimized by averaging. This typically results in an
excessive amount of noise and ripple on the measured
impedance profile, and spikes in the frequency domain
response. In these cases, the sampling points must be
adjusted to avoid the effects of source spurs. This is done
by adjusting the TDR repetition rate on the TDR oscilloscope. As the ideal setting is related to the harmonic
relationship of the repetition rate and the DUT’s source
signaling rate, the ideal repetition rate setting is unique
to each DUT. The process for finding the ideal setting is
determined by trial and error.
A similar situation occurs for the VNA as well.
Although VNAs avoid the data signal by using a narrowband receiver, the source spurs can coincide with the
measurement points during the frequency sweep.
Consequently, the measurement points must be adjusted to avoid the source spur frequencies. This can be
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High Frequency Design | Impedance Measurements
Figure 5 • Keysight Technologies’ ENA Option TDR automatically minimizes the effects of source spurs.
accomplished by setting the appropriate start and stop
frequencies, and number of points. Some modern VNAs,
such as the Keysight E5071C ENA Option TDR, have
the ability to automatically set up the optimum fre-
AMCOM is pioneering the technology
of controlling the device impedance to
achieve ultra wide-band, high-power
MMIC amplifiers. AMCOM is releasing 4
GaN MMIC ultra wide-band, high-power
amplifiers. The Table below shows the
performance. AMCOM products include
discrete power devices, MMIC power
amplifiers and connectorized power
amplifier modules from 30MHz to 16 GHZ
with output power from 1W to 50W. For
more product details, please visit www.
amcomuse.com for data sheet with detailed performance.
AMCOM GaN HEMT MMIC Summary
Model
Frequency
(GHz )
GSS
(dB)
P5dB
(dBm)
Eff(5dB)
(%)
Vd (V)
Idq (A)
ECCN
AM004047SF-2H*
0.05-4.0
33
47
44
25, 90
0.5, 0.9
EAR99
AM006044SF-2H*
0.05-6.0
22
44
42
30, 60
0.4, 1.0
EAR99
AM206542TM-00!
2.0-6.5
25
42
20
28
0.96
3A001.b.2.a
AM010130TM-00!
0.05-13.0
13
33
15
28
0.24
3A001.b.2.b
* 100uS pulse width, 10% duty cycle. They also work in CW mode at lower bias
voltage with slightly reduced output power.
! CW Operation.
(301) 353-8400
The RF Power House
[email protected] m
www.amcomusa.co m
Get info at www.HFeLink.com
36 High Frequency Electronics
quency sweep to minimize the effects from the source
spurs based on the data rate input. Its Avoid Spurious
feature provides a one-click operation for Hot TDR measurements.
An example of how the ENA Option TDR minimizes
the effects of spurious signals from the source is shown
in Figure 5. Note that the effects of the source spurs in
the left image are minimized when the Avoid Spurious
feature is activated.
Summary
Impedance measurement of active devices or Hot
TDR, is essential when designing with high-speed digital standards like HDMI 2.0. The increase in bit rates
due to HDMI 2.0 means that the impedance of active
devices must be properly evaluated to provide new
insight into signal integrity issues. While a TDR oscilloscope can be used for this purpose, the VNA with its
range of functionality and features like Avoid Spurious,
offers a much more viable solution—one that offers
many advantages over the traditional TDR oscilloscope
solution.
For more information on the ENA Option TDR, visit
www.Keysight.com/find/ena-tdr.
About the Author
Yoji Sekine is a marketing engineer at Keysight
Technologies. During his 14 years with the company he
has held various positions, including as an R&D engineer designing various products, such as vector network
analyzers, signal source analyzers and LCR meters.
Sekine holds a BSEE degree from the University of
California at Davis. Agilent Technologies Electronic
Measurement Group is now Keysight Technologies Inc.
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C. W. SWIFT & Associates, Inc.
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C. W. SWIFT & Associates, Inc.
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Tel: 800-642-7692 or 818-989-1133
Fax: 818-989-4784
[email protected]
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HFE | New Products
VSAT Synthesizer
The MLSP-Series of YIG-based
wideband synthesizers are specifically designed for VSAT applications. They provide 1 kHz frequency
resolution over the 600 MHz to 20
GHz frequency range. Power levels of +8 to +13 dBm are provided
throughout the series and full band
tuning speed is 6 mSec. The units
are 5” x 3” x 1” high and fit a 2 slot
PXI chassis.
Micro Lambda Wireless
microlambdawireless.com
In-Series Adapter
SGMC Microwave introduced its Internally Swept Right Angle Type N
Male to Female In-Series Adapter.
Featuring: DC-18 GHz; Low VSWR
& Insertion Loss; Passivated 303
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ship today. Quality, Performance, &
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SGMC Microwave
sgmcmicrowave.com
LNA
Custom MMIC announced the
CMD206, a new DC-50 GHz distributed low noise amplifier in die
form. The CMD206 features DC to
50 GHz operation with a noise figure of less than 3.5 dB, a gain of
greater than 11 dB, and an output
1dB compression point of +12 dBm
at 30 GHz. The amplifier requires
38 High Frequency Electronics
an all-positive bias of only 4 V @ 32
mA (drain), 3 V (gate).
Custom MMIC
custommmic.com
Test Box
PMI Model No. PL-MCU-ENETTTL-MAH is an Ethernet Microcontroller Test Box which allows for
an ethernet command to be sent up
to 18 paralell TTL output bits. This
controller can be used with may
PMI products that required parallel
digital commands, such as switches,
attenuators, phase shifters and IQ
Modulators.
Planar Monolithics Industries
pmi-rf.com
Isolators, Circulators
VidaRF offers .50 x .67 x .50” package which has a rugged body with
S/Steel SMA connectors, sealed
and painted if required. Fast turnaround, high performance covering
X to K band frequencies with high
Isolation, low insertion loss, temp
-54 to +85C. Custom configuration
available upon request.
VidaRF
vidarf.com
Switch Matrix
SenarioTek’s FlexMatrix standard
off-the-shelf RF switch matrix products offer high performance over
the broadest range of standard input and output configurations. With
products from DC up to 40 GHz, the
FlexMatrix Family enables designers and test engineers to accelerate the development of their next
generation products. With FlexMatrix you can be confident of reliable
switching for all your test needs.
SenarioTek
senariotek.com
Antenna
Model SAY-3734334201-22-M1 is a
Q band Cassegrain antenna with
center frequency at 40 GHz and ±
3 GHz operation bandwidth. The
antenna measures 18” in diameter
and 10”in depth. It has 1.3 degree
half power beamwidth, a typical
of 42 dBi gain and -15 dB sidelobe
levels. The RF feed port is WR-22
waveguide with UG383/U Flange.
An optical line-up is equipped for
field alignment.
SAGE Millimeter
sagemillimeter.com
Extension Module
OML’s Signal Generator Frequency
Extension Module can extend the
frequency range of your existing
20 GHz microwave synthesizer to
millimeter wave frequencies. Modules are available to span the waveguide bands between 50 and 500
NOWUSB & ETHERNET
RF SWITCH MATRIX
Efficiency for your test setup. Economy for your budget.
Switch position
indicator lights
ature!
New Fe
DC to 18 GHz
Switch Cycle Counting
We’re adding more models and more functionality to our line of RF
switch matrices. All models now feature switch cycle counting
with automatic calibration interval alerts based on actual usage,
an industry first! This function improves test reliability and saves
you money. Our new RC-series models feature both USB and
Ethernet control, so you can run your test setup from anywhere
in the world! Rugged aluminum cases on all models house our
patented mechanical switches with extra-long life of 10 years/100
million cycles of guaranteed performance!*
# Switches IL
VSWR
(SPDT)
(dB)
(:1)
Our easy-to-install, easy-to-use GUI will have you up and
running in minutes for step-by-step control, full automation,
or remote operation. They’re fully compatible with most
third-party lab software,† adding capabilities and efficiency
to existing setups with ease! Visit minicircuits.com today
for technical specifications, performance data, quantity
pricing, and real time availability – or call us to discuss your
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NEW USB
USB Control Switch Matrices
Model
385 ea.
$
from
Isolation RF PMAX
( dB)
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Price $
(Qty. 1-9)
and Ethernet Control Switch Matrices
Model
# Switches IL
VSWR
(SPDT)
(dB)
(:1)
Isolation RF PMAX
( dB)
(W)
Price $
(Qty. 1-9)
USB-1SPDT-A18
USB-2SPDT-A18
1 (SP4T)
1
2
0.25
0.25
0.25
1.2
1.2
1.2
85
85
85
2
10
10
795.00
385.00
685.00
RC-1SP4T-A18
RC-1SPDT-A18
RC-2SPDT-A18
1 (SP4T)
1
2
0.25
0.25
0.25
1.2
1.2
1.2
85
85
85
2
10
10
895.00
485.00
785.00
USB-3SPDT-A18
USB-4SPDT-A18
USB-8SPDT-A18
3
4
8
0.25
0.25
0.25
1.2
1.2
1.2
85
85
85
10
10
10
980.00
1180.00
2495.00
RC-3SPDT-A18
RC-4SPDT-A18
RC-8SPDT-A18
3
4
8
0.25
0.25
0.25
1.2
1.2
1.2
85
85
85
10
10
10
1080.00
1280.00
2595.00
NEW USB-1SP4T-A18
*The mechanical switches within each model are offered with an optional 10 year extended warranty.
Agreement required. See data sheets on our website for terms and conditions. Switches protected by
US patents 5,272,458; 6,650,210; 6,414,577; 7,633,361; 7,843,289; and additional patents pending.
†
See data sheet for a full list of compatible software.
Mini-Circuits
®
www.minicircuits.com
P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
521 rev D
HFE | New Products
both worlds for military and commercial applications.
dB Control
dbcontrol.com
GHz. These source modules are
RoHS compliant. In addition, an option is available for manual power
sweeps using a micrometer as a
tuning mechanism. Millimeter Band
OML
omlinc.com
Phase Adjuster
WR10 thru WR975
SPDT to SP4T
Standard & Custom
Lab to Space
Coaxicom’s 3993 series of Phase
Adjusters are designed to deliver
a means of phase adjustment over
frequency ranges up to 18 GHz. The
3993-2 SMA Phase Adjustable connector has an adjustment range of
over 180 degrees and a maximum
VSWR of 1.30:1. The 3993-2 is a
phase adjustable SMA plug (male)
direct solder connector for RG402
(0.141” semi-rigid) or Coaxicom’s ultra-flex and blue-flex cables. Available from stock.
Multiplier
Model SFA-104104213-10VF-S1 is
a 102.0 GHz to 103.0 GHz X2 active multiplier. The active multiplier converts 51.0 to 51.5 GHz/+5
dBm input signal to deliver 102.0
to 103.0 GHz frequency band with
minimum +13 dBm output power.
The output spurious and harmonic
levels of the multiplier are -60 dBc
and -20 dBc, respectively. It draws
460 mA current from a +8Vdc DC
power supplier.
SAGE Millimeter
sagemillimeter.com
Coaxicom
coaxicom.com
DC thru 40 GHZ
SPDT to SPMT
High Power
Standard & Custom
Lab to Space
LOGUS MICROWAVE
p: 561-842-3550
f: 561-842-2196
www.Logus.com
Get info at www.HFeLink.com
40 High Frequency Electronics
WLAN FEM
MPM
dB Control’s high-efficiency, conduction-cooled microwave power
modules (MPMs) provide extremely
dense packaging across the 2 - 40
GHz frequency band. The MPMs
are based on a modular design for
easy customization and are available with continuous wave or
pulsed power. Each is a complete
microwave amplifier that uses both
traveling wave tubes and solid state
technologies to provide the best of
RFMW announced design and
sales support for a fully integrated
802.11a/n/ac FEM, with bypass
LNA + T/R SPDT switch from
TriQuint. The TQL1600 incorporates an LNA with high-gain/low
gain mode. When gain is required,
the FEM offers 13 dB. The alternate, bypass mode gain is -7 dB.
Noise figure from the LNA measures 2.5 dB. TriQuint’s TQL1600
features internally matched I/O
ports for ease of design.
RFMW
rfmw.com
Network Analyzer
Anritsu’s VectorStar ME7838D
broadband system provides indus-
HFE | New Products
units, Iso-adapters, Iso-hybrid combiners, and multi-junctions.
QUEST Microwave
questmw.com
Resistor Array
try-best frequency coverage of 70
kHz to 145 GHz in a single sweep
using a coaxial test port. Best-inclass dynamic range, calibration
and measurement stability, and
measurement speed.
Anritsu
anritsu.com
Isolator
For SATCOM on-the-Move (SOTM)
terminals, Renaissance has designed a compact low loss isolator
with K-connectors to support the
bandwidth requirement of 27.35 to
31.7 GHz. The power handling on
this model is 10 W forward and 1 W
reverse but this package can be customized for up to 50 W forward and
10 W reverse.
Renaissance Electronics
rec-usa.com
Vishay Intertechnology introduced
a series of precision thin film chip
resistor arrays featuring gold ter-
Powerful Multipath/Link
Emulator
Multipath Rayleigh & Rician Fading
Unmanned Arial Vehicle (UAV) testing
Sophisticated Satellite link emulation
Mobile Comm’s on the move testing
Test solutions for ....
WIN-T
MUOS
JTRS
IRIS
MET
Hz h
0 M idt
5
2 dw
n
ba
- warfare information networks, tactical
- mobile user objective system
- Joint Tactical Radio System
- Internet routing in space
- Modernization Enterprise Terminal
Software showing mobile link setup
Isolators
The F9 series is a small flange
mount drop in device covering from
3.6 GHz to 14.5 GHz. QUEST Microwave has several standard products
including Microwave Isolator and
Circulator drop-in units available
in ultra-small with flange mounting
or conventional thru-hole mounting
as well as coaxial units. Other standard products include waveguide
dBmCorp, Inc
32A Spruce Street
Tel (201) 677-0008
RF Test Equipment for Wireless Communications


Oakland, NJ 07436
Fax (201) 677-9444
www.dbmcorp.com
Get info at www.HFeLink.com
41
HFE | New Products
minations for conductive gluing.
Offering two integrated resistors
on one substrate, the ACAS 0606
ATAU resistor array combines
high-temperature operation to 155
°C with relative tolerance down to
±0.05 % and relative TCR down to
±5 ppm/K. The new resistor arrays
are ideally suited for precision analog circuits, voltage dividers, feedback circuits, and signal conditioning applications.
Vishay Intertechnology
vishay.com
X-Band PA
M/A-COM Technology Solutions
announced a new high power
MMIC amplifier ideal for X-Band
communication and radar applications. The MAAP-015036, a two
stage 8.5 – 10.5 GHz GaAs MMIC
power amplifier, has a saturated
pulsed output power of 42 dBm, a
large signal gain of 17 dB and a
typical 43 % power added efficiency. It can be biased using a direct
gate voltage or using an on-chip
gate bias circuit.
MACOM
macom.com
Couplers
VidaRF offers a wide selection of
Directional Couplers, Dual Directional Couplers and Hybrid Couplers, designed to cover 0.1 GHz to
20 GHz. Average power from 50W to
1kW. Standard coupling values 3, 6,
10, 15, 20, 25 and 30 dB. Standard
42 High Frequency Electronics
Connector type: SMA female, other
connectors available upon request.
VidaRF
vidarf.com
SiC MOSFET
Richardson RFPD, Inc. announced
availability and full design support capabilities for a new silicon
carbide power Z-FET® from Cree,
Inc. The C2M0040120D is a 1200V,
40mOhm RDS(on) SiC MOSFET
that features N-channel enhancement mode and is available in a
TO-247-3 package. Benefits include
higher system efficiency, reduced
cooling requirements, and increased
system switching frequency and reliability.
moves the need to additional components and connectors. Removing
these improves reliability and allows the electrical performance to
be enhanced. This product provides
the ability for a Satellite receiver or
transmitter to share antennas in a
redundant configuration--a critical
function which demands low insertion loss and exceptional performance.
Crane Aerospace
craneae.com/mw
Richardson RFPD
richardsonrfpd.com
Directional Coupler
Calibration Kit
For vector error correction procedures with your existing vector
network analyzers, OML offers
precision millimeter waveguide
calibration kits with coverage from
50 GHz to 0.5 THz in three configurations: Universal, Standard, and
Standard plus Sliding Load (except
WR-02.2).
Mini-Circuits’ 50Ω, 8300 to 9700
MHz, ZX30-14-972HP+ is a 14 dB
high power directional coupler that
can pass up to 50mA DC from input
to output ports. Internally, low loss
dielectric material in a microstrip
configuration utilizing ADS design
software allow for low insertion
loss, 0.6 dB. Packaged in a miniature unibody case allows for excellent grounding and heat transfer.
Mini-Circuits
minicircuits.com
OML
omlinc.com
Iso-Divider
The Iso-Divider represents a marriage of Crane Electronics’ Passive
and Ferrite products. It is a higher
isolation power divider which re-
Amplifier
MITEQ’s new Model JS5-2600400032-18P is a state-of-the-art 26 to 40
GHz low-noise high gain amplifier
HFE | New Products
with only 3.2 dB maximum noise
figure and +18 dBm minimum
P1dB. This model has a gain of 32
dB minimum in a small hermetically sealed package with field replaceable K-connectors. MIL-883 screening is also available. This model is
also available as RoHS compliant,
along with different options such
as low gain, nose figure and power
output.
good return loss; aqueous washable;
patent pending.
Mini-Circuits
minicircuits.com
Miteq
miteq.com
Power Amps
TWTA Website
Tango Wave, provider of Satellite
Communications (SATCOM) power
amplifier products, announced their
new Website (www.tango-wave.
com) is up and running. Tango Wave
is a manufacturer of high-power,
high-linearity outdoor unit (ODU)
Traveling Wave Tube Amplifiers
(TWTAs) and subsystems designed
for direct-to-home (DTH), global
up-linking, satellite news gathering
(DSNG/SNG), broadcasting, voice/
data, mobile up-linking and maritime applications.
Tango Wave
tango-wave.com
Transformer
Mini-Circuits’ 50Ω, 10 to 8000
MHz, TCM1-83X+, RF transformer
features: differential modulator/
demodulator and active mixers;
wideband push-pull amplifiers;
LTE, Cellular, PCS, UMTS, WiFi,
WiMAX; ultra wide bandwidth 10
to 8000 MHz; one model covers all
telecom bands; flat insertion loss;
RFMD’s Power ICs are wideband
power amplifiers designed for CW
and pulsed applications such as
wireless infrastructure, radar, twoway radios, and general purpose TX
amplification. These input matched
GaN transistors are packaged in an
air cavity ceramic package, which
provides excellent thermal stability
through the use of advanced heatsink and power dissipation technologies.
S
IER
LIF NAs LIES
P
/ L MB
AM
ER TERS SSE
W
PO VER EL A
N
I-R
CO Y / H
R
ITA
MIL
RFMD
rfmd.com
M
TO
US AVE
C
IN OW
Hz
ING ICR z-33G
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I
IAL TED M 0MH
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EC
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IN MB
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AS
HEMTs
STANDARD AMPLIFIERS
3 - 4 WEEK DELIVERY
Cree released two new unmatched
50V gallium nitride (GaN) high
electron
mobility
transistors
(HEMTs) ideal for use in high power broadband amplifier, CW, and
pulsed applications. They exhibit
high efficiency, high gain, and wide
bandwidth capabilities, in addition
to high power density, low parasitics, and high current gain cutoff frequency (FT).
Cree
Cree.com
BAW Duplexer
RFMW announced design and sales
support for a band 25 duplexer
from TriQuint. The TQM963001 is
a high-performance Bulk Acoustic
3560 BUSINESS DR. SUITE 100
SACRAMENTO, CA 95820
PHONE: (916) 453-3382
[email protected]
ALDETEC.COM
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43
HFE | New Products
Test Cable
Wave (BAW) duplexer designed
to meet the strict CDMA requirements in the PCS extension band
BC14 and provide excellent insertion loss (typically 1.8dB), cross
isolation and linearity for LTE B25.
RFMW
rfmw.com
Mini-Circuits’ 50Ω, 6FT, DC to 26
GHz, FLC-6FT-SMSM+ flexible
test cable features: low insertion
loss, 4.5 dB at 26 GHz; rugged construction includes protective shield
and strain relief for longer life;
stainless steel connectors for long
mating-cycle life; extra flexible. Applications: military and defense applications; research & development
labs.
30
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Mini-Circuits
minicircuits.com
HFE’s Product
Showcase Classified
Advertising
Termination
This feed thru termination is designed to match 50 Ohm RF components with high impedance test
equipment such as an oscilloscope.
Model 851-054-FTT is a 50 Ohm, 1
Watt average power, SMA male to
SMA female feed thru termination.
It operates DC - 1500 MHz, exhibits maximum VSWR of 1.20:1, DC
- 1000 MHz and 1.40:1, 1000 - 1500
MHz.
BroadWave Technologies
broadwavetech.com
Test Set
Aeroflex Incorporated announced
additional test and alignment capabilities for Motorola APX Series Radios on the Aeroflex 3920B
Digital Radio Test Set. The new
test capabilities focus on Phase
II Transmit and Receive tests.
The Aeroflex Automated Test and
Alignment procedure provides fully automated test and alignment of
Motorola APX radios without the
need for user interaction.
Aeroflex
aeroflex.com
Frequency Synthesizer
GaN Amps
RFMD’s MPT products are high
power discrete GaN amplifiers designed for radar, air traffic control
and surveillance, and general purpose broadband amplifier applications.
RFMD
rfmd.com
44 High Frequency Electronics
API Technologies Corp. announced
configurable frequency synthesizers (Models LCFS-X). Offering
superior phase noise performance
as low as -92 dBc/Hz at 100 kHz
offset, they are ideally suited for
a variety of applications including
SIGINT/electronic warfare (EW),
SATCOM, Doppler radar, and telecommunication systems. Compact
surface mount packaging and an
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affordable price point make these
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API Technologies
apitech.com
Product Showcase
Advanced
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Technology
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Page 1 General Test Equip
Page 2 Mini-Circuits
Page 3 Power Supplies
Page 4 Oscilloscopes Le Croy
Page 5 RF Power Meters
Page 6 Waveguide Parts Section
Page 7 RF Coaxial Parts
Page 8 Manuals Free pdf Download
Page 9 Solid State RF Amplifiers
Page 10 Tube Type RF Amps TWT
Page 11 Miscellaneous Repair Parts
VOICE:
When only the best will do
EMAIL:
WEB:
www.highfrequencyelectronics.com
732.240.6895
[email protected]
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Product Highlights
Cable Assemblies
Rosenberger of North America announced R-Mor
cable assemblies for test and measurement applications.
These assemblies offer very low loss and high phase stability during flexure. R-Mor includes a wide range of
available connectors, 2.92 mm/K, 3.5, Precision N, SMA
and 2.4 mm, as well as a highly flexible armor, ensuring
Online Learning Portal
The NI AWR Design Environment™ E-Learning
Portal gives current customers* of NI AWR software the
ability to learn more about the powerful tools, technologies and applications of the software as their time and
interest allows. The portal offers jumpstart training modules that help customers cover all aspects of the software
in about an hour and technical archives that contain a full
46 High Frequency Electronics
highly repeatable measurements. R-Mor cables are available through RFMW distribution in standard lengths of
18”, 24”, 36” and 48”.
RFMW
rfmw.com
compilation of technical application notes, white papers
and educational web events—all conveniently located for
fast and easy access.
AWR Corp.
awrcorp.com
Product Highlights
Power Sensor
The new LB5908L Power Sensor measures RF power
at frequencies from 9 kHz to 8 GHz, making it ideal for
source calibration and EMC testing applications. It has
excellent sensitivity and measures from -60 dBm to +20
dBm. It has three interfaces, giving it new never-before
-available connectivity. Customers can connect to the sensor using USBTMC, USB HID, or the optional SPI/IIC
Rack Mount Amplifier
Mini-Circuits’ new HPA-272+ high-power rack mount
amplifier is capable of amplifying signals up to 100 W
across its entire operating bandwidth of 700 – 2700 MHz.
It delivers 48 dB typical gain with ±1.7 dB gain flatness
across its entire operating frequency range. Its wide
bandwidth covers popular application bands including
wireless communications, SATCOM, and radar in a single
interface. It has a built in real-time clock and measurement storage. Once programmed, it can make and store
over 100 million measurements with no computer or
power meter connected.
LadyBug Technologies
ladybug-tech.com
instrument, and its high gain performance and output
power support a variety of high power test applications
such as EMI, reliability testing, RF power stress testing,
and more.
Mini-Circuits
minicircuits.com
47
Product Highlights
IMD Direct Connect Solution
OML introduced the industry’s first direct connect
solution for mm-wave Intermodulation Distortion (IMD)
measurements. IMD is an industry standard technique
revealing the linearity of an amplifier using a two-tone
measurement. OML’s direct connect solution provides you
the capability to measure IMD as well as gain compres-
Touch-Screen Oscilloscope
Saelig Company Inc. announced the Owon TDS7102, a
100MHz four-channel benchtop scope with touch-screen
capabilities that make instrument setting, operation, and
adjustment faster and more intuitive. With 1GSa/s signal
capturing on all four channels simultaneously, a 7.6MSa
record length, and 50,000 wfmSa/s capture rate, zooming
48 High Frequency Electronics
sion and S-parameters. Compatible with modern network
analyzers, OML offers mechanical compatibility with
existing probe stations and ability to upgrade existing
module for IMD capabilities.
OML
omlinc.com
in and finding fast, intermittent pulses is now much
quicker and simpler. Controlling waveform position, display, and triggering is much faster with touch control, but
buttons are also provided to offer conventional operation.
Saelig Company
saelig.com
Product Highlights
Impedance Calculator
Isola announced a free Impedance and Power-Handling
Calculator that predicts the design attributes for
microstrips and striplines based on the design’s target
impedance and dielectric properties of the company’s RF,
microwave and millimeter-wave laminate materials. This
new tool supports Isola’s earlier announcement of a
Design Review Service, in which its technical staff will
provide PCB fabricators and OEMs all of the calculations,
testing, characterizations and material recommendations
needed to convert to Isola’s materials.
Isola Group
isolagroup.com
Cable Assemblies
High Speed Interconnects announced a new range of
flexible cable assemblies which outperform semi-rigid
cable performance. Combining advanced coaxial cable and
proprietary VP90™ expanded PTFE (ePTFE) extrusion
technologies, HSI is able to manufacture highly phasestable, low-loss interconnect solutions for a wide variety of
applications. Coaxial cable sizes range from 16-52AWG,
with most cables exhibiting insertion losses of less than
1.00 db per foot with little to no phase change.
High Speed Interconnects
highspeedint.com
49
Product Highlights
Cable Assembly Builder
San-tron announced the launch of their new website
that features a robust product finder, which pulls from
San-tron’s extensive library of RF and microwave coaxial
connectors and adapters, as well as a simple, user-friendly cable assembly builder. Both tools feed into their new
Model Libraries
Keysight Technologies announced that the Modelithics
COMPLETE Library of RF and microwave component
model libraries is available free of charge for six months
to Genesys 2014 users new to Modelithics. First made
available to Genesys users in 2003, the Modelithics
COMPLETE Library contains over 10,000 RF/microwave
50 High Frequency Electronics
“My Quote” system, which allows multiple products to be
added at once including a new custom quote option.
San-tron
santron.com
components with accurate nonlinear models for active
devices and highly scalable linear models for passive component families.
Keysight Technologies
keysight.com
Website Highlights
markimicrowave.com
Marki Microwave’s goal is to invent technologies to
empower the RF and microwave industry to design faster,
simplify production, eliminate complexity, and shatter
performance barriers. These capabilities lead to a portfolio of high performance components including broadband,
richardsonrfpd.com
Richardson RFPD/Arrow RF & Power is a specialized
electronic component distributor providing design engineers with deep technical expertise and localized global
design support for the latest new products from the
low conversion loss, and highly linear mixers, high directivity, low return loss couplers and directional bridges,
well balanced power dividers and hybrid couplers, and
many other quality products.
world’s leading suppliers of RF, Wireless, Energy and
Power Technologies. Richardson RFPD has a rich and
unique history of engineering solutions and distributing
components for the global electronics market.
51
Website Highlights
dowkey.com
Dow-Key Microwave Corporation is the world’s largest
manufacturer of electromechanical switches for radio frequency (RF) and microwave applications. Founded in
1945, we are also the oldest continuously operating RF/
microwave switch manufacturer in the United States and
are an operating company within Ceramic & Microwave
Products, a subsidiary of Dover Corp. Dover is a multibillion dollar, NYSE-traded, diversified manufacturer of a
wide range of proprietary electronic components and systems.
rohde-schwarz.com
For 80 years, Rohde & Schwarz has stood for quality,
precision and innovation in all fields of wireless communications. The company is strategically based on four pillars: test and measurement, broadcasting, secure commu-
nications, radiomonitoring and radiolocation. Approx.
9300 employees in more than 70 countries, with Rohde &
Schwarz subsidiaries in 57 of these countries. Export
share: over 90 percent.
52 High Frequency Electronics
Website Highlights
craneae.com
Crane Aerospace & Electronics combines the experience of long-time industry leaders to supply critical systems and components to the aerospace and defense markets. Our products are found in some of the most demand-
ing environments, from engines to landing gear, from
satellites to medical implants, and from missiles to
unmanned aerial systems (UAS).
custommmic.com
Typically, microwave system designers must choose
standardized, off-the-shelf components that support various applications by achieving lowest common denominator specs. Although many would prefer to use customized
components, they’ve been taught these solutions are
reserved for only the most specialized, big budget applications. At Custom MMIC we’re changing that thinking by
putting the power of a custom solution in the hands of
every designer.
53
Industry Original
Selecting an RF Power Meter
or Sensor
By LadyBug Technologies
Describing and comparing the variety of power
meter and sensor technologies available
today.
There are several types of RF power measurement systems available to
the RF design engineer and technician. As advances in measurement technology have been made, options and flexibility have increased, leaving a
vast array of offerings. This article will describe and compare a sampling
of the variety of power meter and sensor technologies available today.
Sensors or Meters & Sensors
Generally, there are two systems used for power measurement. First
and traditionally, a power meter, or display and processing device along with a sensing head,
often called a power sensor. Together the meter and sensor make power measurements as
depicted in Figure 1. Sensing heads detect RF power and send an analog, or in some cases,
digital signal to the meter. An accurate measurement can be made; however, in many cases this
system requires meter-sensor calibration to remove systematic errors in addition to zeroing for
removal of temperature and time drift errors. It may be necessary to disconnect the sensor to
zero and calibrate the meter before use. Of course annual calibration for both the meter and
sensor are required, as well.
Second, about 10 years ago, available technology allowed an entire high-quality power sensor and processing system to be placed inside a device the size of a sensing head along with a
USB interface. From there, digital data is sent to a computer for display as shown in Figure 2,
or a programmatic system for use in a test system. These devices are referred to as USB power
sensors, or simply power sensors to most users. Some sensors divide the incoming power into
more than one signal path to increase the dynamic range. One of the advantages of this measurement system is the fact that, unlike analog power meter and sensor systems, when the
sensor is calibrated, the entire analog measurement path is calibrated. This reduces the cost of
annual calibration, and significantly reduces the measurement setup. An additional benefit is
the elimination of approximately 2 - 3% systematic error associated with the meter and sensor
combination.
Figure 1 • Power Meter and Sensor.
54 High Frequency Electronics
Figure 2 • USB Power Sensor and Computer.
Questions often arise because many engineers are not
familiar with this type of USB instrumentation and are
not aware of the innovative features and flexibility
afforded by directly using a computer with a power sensor. There are many USB power sensors available with
equal or superior accuracy compared with meter/sensor
combinations. Today, all leading power sensor manufacturers include USB power sensors in their product lines.
In many cases, the cost of a USB sensor is similar to that
of a sensing head to be used with a power meter. This creates a significant savings in cost for the buyer of the USB
power sensor, in addition to improved performance due to
the reduced number of connections and systematic errors.
The savings can be quite large in the case of an ATE or
other test system that requires multiple sensors or where
the data must be sent to a computer regardless of the sensor choice.
Types of Sensors and Measurements
Over time many innovative approaches have been
taken to the important job of measuring RF Power. The
list of sensors is long, power sensor manufacturers may
refer to their sensors as True RMS sensors, CW sensors,
thermal sensors, thermocouple sensors, thermistor sensors, mounts, diode sensors, peak & pulse sensors, pulse
profiling sensors, log detectors or RF power detectors and
more. Basic RF power measurements can be made with
most of these power sensors. For the purposes of this
paper, we will group the sensors into two types.
1) Those primarily suitable for general purpose average power measurements. This includes all thermal sensors and narrow-band True RMS diode sensors, such as
the LB5940A square law diode sensor used in this article.
These sensors are limited to measuring overall average
power over a (short) period of time.
2) Sensors that process the detected power as video
and provide usable modulation information. This includes
wide-band diode sensors and wide-band log detectors.
These are sub-categorized into “peak and pulse” sensors
that numerically calculate data from a stream of repetitive pulses and “pulse profiling” sensors that can display
the video on a time domain basis. These types of sensors
will also measure average power accurately; however,
there can be limitations. For certain signals, diode sensors that operate outside of the square law region and log
detector sensors use these technologies to increase
dynamic range, while maintaining a wide video bandwidth and may subject to signal limitations. These sensors find value in making high speed, high dynamic range
pulse measurements; however, if non-sinusoidal RF waveforms or complex signals that exceed the sensors video
bandwidth are to be measured, some video detecting sensors may impart a small error. For this reason sensors
Figure 3 • Pulse Modulated signal.
55
Industry Original
Figure 4 • Measurement 1.
used for calibration purposes are often either square law
diode True RMS sensors or thermal sensors.
For a common CW signal, any of the sensors discussed
to this point will make accurate measurements.
The pulse wave from shown in Figure 3 will be used to
further explain the type of measurement that can be
made with the two sensor types.
The image in Figure 3 depicts a pulse modulated signal that will be used in this example. The actual generated pulse width is 11.15 us, and pulse repetition time is
100.15 us. The Peak power in this example is -26.9 dBm
or 2.04 uw.
Calculating the duty cycle and average power: DC =
T/P = 11.15/100.15 = 0.1113 or 11.13 %. Average power is
then: Pa = DC*Peak = 0.1113*0.00000204 = 0.227uw or
-36.4 dBm.
General Purpose Average Power Sensors
A good average power sensor with properly set averaging will yield an accurate measurement of -36.4dBm on
the waveform depicted above. The LB5940A sensor used
to make the measurement shown in Figure 4, was set to
2,000 averages which is about ¼ second in this case. This
time could be lowered and the accuracy maintained, if
faster measurements were desired.
True RMS average sensors offer two distinct advantages over thermal sensors. First, they are significantly
faster because they do not require time to heat a thermal
mass; second, they are capable of measuring to much
lower power levels because thermal isolation and mea-
surement at very low levels is impractical. As mentioned
earlier, True RMS sensors can be set to average over the
minimum required period of time to achieve an accurate
measurement for various signals. This “averaging” time
must be long enough to average the signal into a stable
value. For example, if averaging time were set too short
on signal in Figure 3, the effects of the narrow pulse
would cause an unstable result. The mass in a thermal
sensor would normally cause it to be slow in responding
relative to the pulse information of this particular signal.
If it were capable of measuring down to -36 dBm, it would
inherently average the signal into a stable result. The
response time however could be substantially longer than
that of a modern diode detector system such as a LadyBug
LB5940A with properly set averaging.
Sensors with Video Processing
Peak and pulse sensors, the first of the video detecting
types described here, can be very useful in many testing
and manufacturing applications. For repetitive pulses,
these sensors provide certain statistical numerical pulse
information. Today, most microwave communication and
radar signals are pulsed. Using fast statistical measurements can be quite valuable to the power sensor user. To
make the measurement, the sensor collects power levels
and places them into “buckets”; enough time for several
pulses to occur must be allowed. These “buckets” are then
statistically processed. The Peak power is located and
reported. The pulses proximal, mesial, distal and top line
levels are located. Using this information, these sensors
can automatically calculate and report accurate pulse
power, duty cycle and crest factor to the user, as shown in
Figure 5 or to an automated test system.
In addition to statistical information, pulse profiling
sensors provide time domain trace measurements. The
sensor measures RF power, converts and sends data
points fast enough to build a time domain trace. The measurement can be triggered and the signals detail can be
plotted for on-screen viewing as shown in Figure 6, which
was made with a LadyBug LB480A sensor. Droop and
other signal anomalies can be seen easily. Additionally,
many of these sensors can calculate pulse parameters
similar to peak & pulse sensors plus additional data such
as pulse width and pulse repetition time. The
LadyBug LB480A sensor used in this paper also
provides a full complement of statistical information such as CDF, CCDF and PDF.
Accuracy
What makes a good power sensor? It’s often
been said that the devil is in the details. In power
sensors, one of the most important details is the
sensor’s calibration. A power measurement’s accuracy is limited by its calibration standard. A quality
power sensor must have a traceable calibration
Figure 5 • USB Peak and Pulse Sensor Display.
56 High Frequency Electronics
Figure 6 • USB Pulse Profiling Display.
from a recognized primary laboratory such as NIST
(National Institute of Standards and Technology) run by
the US Department of Commerce; PTB in Germany; NPL
in the United Kingdom. Because uncertainty is added
each time a calibration occurs, it is important to have as
few calibrations as possible from the primary laboratory.
For example, the LadyBug sensors mentioned in this
article are calibrated with first-tier standards that are
calibrated directly by NIST. This method allows for the
best possible calibration.
Summary
Many advances have been made in the area of RF
Power measurement technology. Much of this work has
focused on USB sensors. Recent advances in chip technology have made low power, very fast analog to digital converters possible. When combined with FPGAs and stateof-the-art processors, many new capabilities are possible.
Opportunities for faster measurements with more
information are available today and should be reviewed
by the power sensor user. When considering the purchase
of a power measurement system, bear in mind that today,
high quality USB power sensors are a great alternative to
meter and sensor combinations. The systems offer the
same accuracy and, as with all new technology, new measurement features are often required to measure new
signals. For assistance with your selection of a power
meter or sensor, contact LadyBug Technologies: ladybugtech.com, 707-546-1050.
20 GHz Modular Signal Sources
Frequency 50 MHz to 20 GHz
Power _ 30 dBm to +10 dBm
Low phase noise
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PXIe, USB, SPI, RS-232
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SMT Synthesizer Module
Introducing the SC800...
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57
Product Feature
I/Q Modulator
A new low power I/Q modulator from Linear Technology
enables battery-powered transmitters operating in the
30MHz to 1.3GHz frequency bands, breaking new ground
in power consumption, sideband suppression, carrier
leakage and dynamic range performance. The LTC5599
modulator, powered from a single 2.7V to 3.6V supply,
draws only 28mA current, less than 60% that of alternative solutions—with no performance sacrifice. The
LTC5599 delivers outstanding native –52.6dBc sideband
suppression and –51.5dBm carrier leakage without calibration. With on-chip calibration resources, performance
can be further improved to –60dBc and –65dBm, respectively. Moreover the device output achieves an excellent
noise floor of –156dBm/Hz with an OIP3 of 20.8dBm,
delivering superior transmitter performance.
The LTC5599 combines low power consumption and
robust performance to suit a wide range of demanding
battery-powered radios and wireless communications
applications that are exposed to strong radio interference.
These include wireless professional microphones, frequency hopping narrowband and broadband portable
field radios, public safety radios, train communications, as
well as broadband VHF/UHF white space modems, software-defined radios, portable RF test equipment, picocell
base stations, low-power microwave backhaul, small wireless repeaters and satellite modems.
The device’s gain can be set via the on-chip serial port.
A coarse gain control provides 1dB/step, along with
58 High Frequency Electronics
adjustable fine gain control of 0.1dB. Total gain ranges
from –19dB to 0dB. Varying the modulator gain enables
device supply current from 8mA to 35mA, allowing the
device to be set to lower power consumption with slightly
reduced gain and performance, as needed for specific
applications. Once set, the gain can be automatically temperature compensated by activating the on-chip temperature correction feature.
The LTC5599 supports narrowband and wideband
radio applications. Its I and Q inputs are each capable of
–1dB modulation bandwidth of up to 37MHz, supporting
a total of 74MHz RF bandwidth at 900MHz frequency. The LTC5599 is available in a 4mm x 4mm QFN package, providing a compact footprint. The product is specified for case operating temperature from –40°C to 105°C,
supporting reliable operation in extended temperature
environments. The device can be conveniently shut down
with an enable control pin. When disabled, the device
conserves power by drawing a typical of 0.7μA standby
current. The LTC5599, priced starting at $4.45 each in
1,000-pieces quantities, is available immediately in production quantities. For more information, visit www.linear.com/product/LTC5599.
Linear Technology
linear.com
2014
EDITORIAL CALENDAR
September
n Resistive Products
n Control Components
n EuMW 2014 Preview
n Product Highlights: Defense
Electronics
Events:
EuMW2014 - Rome
October 5 - 10, 2014
Milcom2014 - Baltimore
October 6 - 8, 2014 & AOC Washington
October 7 - 9, 2014
November
nC
ontrol Components
n Power Amplifiers
n RFICs and MMICs
n Product Highlights: Defense
Electronics
December
nM
illimeter-wave Interconnects
n Military Systems Update
n Software Designed Test
Equipment
n Product Highlights: Connectors
& Cables
October
n Defense Electronics
n Design Tools
n Cables and Connectors
n Product Highlights: Connectors
& Cables
Events:
Asia Pacific Microwave
Conference
Sendai, Japan
November 4 - 7, 2014
Regular monthly columns include:
Commentary n In the News n Meetings & Events
New Products n Featured Products
In addition to the coverage above, each monthly issue will
offer the reader a balanced mix of subject matter at levels of
technical depth ranging from fundamental tutorials to advanced
theory. Each month the subject matter is carefully selected to be
both practical and useful to engineers who are developing high
frequency and high-speed systems for applications in wireless and
wireless communications, military and civilian defense, navigation,
computing, imaging, and more.
Editorial
Submissions
Regular Columns
Meetings & Events, In the News, Design Notes, High Frequency Applications
Press Releases
Press releases for our informational columns should be sent by the first of the
month prior to the desired publication
date (e.g., April 1 for the May issue).
Late-breaking news can be accommodated, but please advise the editors of
urgent items by telephone or e-mail.
[email protected]
Article Contributions
We encourage the submission of
technical articles, application notes
and other editorial contributions. These
may be on the topics noted above, or
any other subject of current interest.
Contact us with article ideas:
[email protected]
How to Contact Us
Send press releases and other communications to our general editorial e-mail
address:
[email protected]
Book Reviews
Modern Small Antennas
Kyohei Fujimoto and Hisashi Morishita
Microwave and Wireless
Measurement Techniques
Cambridge University Press
Nuno Borges Carvalho
© K. Fujimoto and H. Morishita 2013
Dominique Schreurs
ISBN 978-0-521-87786-2 Hardback
© Cambridge University Press 2013
Reviewed by Tom Perkins, HFE Senior Technical Editor
ISBN 978 1 107 00461 0 Hardback
Who says passive circuits aren’t interesting? Having
experimented with antennas since for close to six decades,
I found this book to be crammed full of stuff that I used to
fantasize about. For example,
I used to have a fascination
about ferrite loaded antennas
found in AM broadcast receivers, and much later wondered
about odd shapes that could
be realized in microstrip
patches and feeding them at
some optimum device matching impedance other than 50
ohms. But I digress!
This book introduces the
fundamentals, dating back to
Hertz’s experiment, and
builds on the progress made
since then. The significance of Electrically Small Antennas
(ESAs), Physically Constrained Small Antennas (PCSAs),
Functionally Small Antennas (FSAs), and Physically Small
Antennas (PSAs) is clearly explained. Many forms within
these broad categories are introduced and explained in
detail. Both narrow-band and broad-band types are
described. The shapes indicated in the area of fractal
antennas are particularly intriguing.
One interesting fact is that, as stated in the book’s preface, “Antennas today are no longer a single device, but constructed within a composite structure to perform sophisticated functions even with physically small dimensions.”
Integration of active devices (transistors, PIN-Diodes,
varactors) into antennas is covered to some extent. Having
developed microstrip patches with negative resistance
diode oscillators embedded, I found this particularly interesting.
A comprehensive glossary provides about 40 pages of
cataloged small antennas with references back to where
they are introduced in the text. This feature greatly
enhances the usefulness of the book as there are so many
different types, styles and shapes of antennas discussed.
Modern Small Antennas is a book that would be very
handy for just about any designer of small or covert wireless communications, video, data, tag, security and sensor
devices. The book cites many examples and the authors
include extensive references, indicating that they took this
effort very seriously. I subscribe to a couple of internet sites
(blogs) that address antenna issues. Many of the contemporary questions asked would conveniently be answered if
the inquirer had this book in his or her possession.
Reviewed by Tom Perkins, HFE Senior Technical Editor
This book’s Preface makes reference to laboratory
adventures, which could imply that some aspects of the
Microwave Jungle mentioned in my July 2014 Editorial
may still exist, at least for the beginner. The text endeavors to accurately identify the parameters to be measured
and their significance, and how to actually perform the
desired measurements. Differences in excitation (stimulus) signals, instruments,
and quantities to be measured in different domains
are explained. Much importance is placed on understanding important Figures
of Merit (FOM). The book
clearly addresses the definition of various parameters
that are typically found on a
component datasheet. Clear
discriminators between various measurement instruments and techniques are
explained. Description of
best usage practices, calibration techniques, limitations and measurement uncertainties helps to clear up misunderstandings and myths
that may have persisted for some time. The book also
deals with parameters associated with modern wireless
digital converters (both ADC, DAC), software-defined
radio (SDR), and cognitive radio (CR).
Each chapter culminates with a group of problems/
exercises, engaging the reader in careful assessment of
what they have learned. A refreshing observation is that
many of the problems require not just numerical solutions, but reasoning and descriptive dialog. Other problems are addressed by going to the lab (hopefully adequately equipped) and implementing a specific measurement setup.
Microwave and Wireless Measurement Techniques is
not only useful for students, technicians and engineers,
but also for personnel writing specifications, and those
having cognizance over sell-off and acceptance of hardware and systems. These personnel might include program managers, quality assurance/control, system integrators, government inspectors, and contract administrators.
60 High Frequency Electronics
International Microwave Symposium
IEEE 17-22 May 2015 • Phoenix, A Z MTT-S
IMS2015 MUST ATTEND!
The 2015 IEEE MTT-S International Microwave Symposium (IMS2015) is the premier conference for the Microwave and RF
Industries! With over 9,000 attendees and over 600 industrial exhibits of the latest state-of-the-art microwave products,
Microwave Week is the world’s largest gathering of Radio Frequency (RF) and Microwave professionals and the most
important forum for the latest and most advanced research in the area.
SUBMIT YOUR TECHNICAL PAPER
TO IMS2015 TODAY!
EXPERIENCE ALL THE ADVANTAGES OF
BECOMING AN EXHIBITOR AT IMS2015.
Technical Paper Submissions: Authors
are invited to submit technical papers describing
original work on radio-frequency, microwave, millimeterwave, and terahertz (THz) theory and techniques. The
deadline for submission is 8 December 2014. Please refer
to the IMS2015 website (www.ims2015.org) for detailed
instructions concerning paper submission, as well as a
complete list of technical areas.
Become an Exhibitor: The 2015 IEEE MTT-S
International Microwave Symposium is the world’s premier
microwave event. It features a large trade show, technical
sessions, workshops and panel sessions covering a wide range
of topics. Attendee interests include wireless communication,
radar,
RF technologies, high frequency semiconductors,
electromagnetics, commercial and military RF, microwave
and mm-wave electronics, applications, and much more.
IMS2015 EXHIBIT SPACE IS AVAILABLE.
For reservation questions or
further information contact:
The Exhibits Department at MP Associates, Inc.
tel: +303-530-4562
[email protected]
FOR FULL CONFERENCE DETAILS VISIT
WWW.IMS2015.ORG
JOIN THE CONVERSATION: #IMS2015
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100 kHz to18 GHz
995
$
from
ea. qty. (1-9)
Model
High-powered performance across wide frequency ranges.
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ZVE-3W-83+
ZVE-3W-183+
ZHL-5W-2G+
ZHL-5W-1
ZHL-10W-2G
Frequency Gain
(MHz )
( dB )
2000-8000
5900-18000
800-2000
5-500
800-2000
36
35
45
44
43
Pout @ Comp.
1 dB 3 dB
(W)
( W)
2
3
2
3
5
6
8
11
10
13
$ Price
(Qty. 1-9)
1295
1295
995
1020
1295
1800-4000
• ZHL-16W-43+
20-1000
• ZHL-20W-13+
20-1000
• ZHL-20W-13SW+
LZY-22+
ZHL-30W-262+
0.1-200
2300-2550
45
50
50
43
50
13
13
13
16
20
16
20
20
32
32
1595
1395
1445
1495
1995
ZHL-30W-252+
LZY-2+
LZY-1+
• ZHL-50W-52+
700-2500
500-1000
20-512
50-500
50
47
43
50
25
32
37
40
40
38
50
63
2995
2195
1995
1395
50-500
20-500
800-1000
3000-3500
3500-4000
0.4-5
50
42
50
50
50
52.5
63
79
79
100
100
100
79
100
100
100
100
100
1995
2395
2195
3595
3595
1995
• ZHL-100W-52+
• ZHL-100W-GAN+
ZHL-100W-13+
NEW ZHL-100W-352+
ZHL-100W-43+
NEW
NEW LZY-5+
Listed performance data typical, see minicircuits.com for more details.
• Protected under U.S. Patent 7,348,854
Mini-Circuits
®
www.minicircuits.com
P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
416 rev AD
ZVA
super ultra wideband
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ea.
Electrical Specifications (-55 to +85°C base plate temperature)
Model
NEW
Frequency Gain
(GHz)
(dB)
ZVA-183WX+
ZVA-183X+
ZVA-213X+
0.1-18
0.7-18
0.8-21
28±3
26±1
25±2
P1dB
IP3
(dBm) ( dBm)
27
24
24
35
33
33
*
NF
(dB )
( Qty. 1-9)
4.0
3.0
3.0
1345.00
845.00
945.00
Price $
Heat sink must be provided to limit base plate temperature.To order
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Wideband Performance
183W+
RoHS compliant
183+
213+
I
0.1
I
I
0.7 0.8
Frequency (GHz)
I
18
I
21
Mini-Circuits
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P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
440 rev Q
Advertiser Index
CompanyPage
Advanced Switch Technology............................................................... 45
Aeroflex Inmet........................................................................................ 1
Aldetec................................................................................................... 43
AMCOM................................................................................................. 36
AR Modular RF..................................................................................... 26
Avtech.................................................................................................... 45
Cernex.................................................................................................... 18
Coaxicom............................................................................................... 24
Coilcraft................................................................................................. 11
C. W. Swift & Associates.......................................................................C2
C. W. Swift/SRI Connector Gage.......................................................... 37
dBm........................................................................................................ 41
Dow-Key Microwave............................................................................. 27
Dudley Lab............................................................................................ 45
Fairview Microwave.............................................................................. 17
Herotek.................................................................................................. 14
IMS 2015............................................................................................... 61
IW Microwave....................................................................................... 25
Keysight Technologies.......................................................................... 19
Logus Microwave.................................................................................. 40
Micro Lambda Wireless.......................................................................... 9
Microwave Components........................................................................ 35
Mini-Circuits....................................................................................... 2, 3
Mini-Circuits......................................................................................... 21
Mini-Circuits......................................................................................... 23
Mini-Circuits......................................................................................... 31
Mini-Circuits......................................................................................... 39
Mini-Circuits................................................................................... 62, 63
Miteq........................................................................................................ 7
Molex.....................................................................................................C3
National Instruments............................................................................. 5
Planar Monolithics Industries............................................................. 29
Pulsar Microwave................................................................................. 20
RelComm Technologies......................................................................... 33
RF Bay................................................................................................... 45
Rogers Corp...........................................................................................C4
SAGE Millimeter.................................................................................. 13
Satellink................................................................................................ 44
Sector Microwave.................................................................................. 45
SGMC Microwave................................................................................. 15
SignalCore............................................................................................. 57
Wenteq Microwave................................................................................ 45
The ad index is provided as an additional service by the publisher,
who assumes no responsibility for errors or omissions.
n Find Our Advertisers’ Web Sites using HFeLink™
1. G
o to our company information Web site:
www.HFeLink.com, or
2. F
rom www.highfrequencyelectronics.com, click on the HFeLink
reminder on the home page
3. C
ompanies in our current issue are listed, or you can choose one of
our recent issues
4. F
ind the company you want ... and just click!
5. Or ... view our Online Edition and simply click on any ad!
Publisher
Scott Spencer
Tel: 603-472-8261
Fax: 603-471-0716
[email protected]
Advertising Sales — East
Gary Rhodes
Vice President, Sales
Tel: 631-274-9530
Fax: 631-667-2871
[email protected]
Advertising Sales — west
Tim Burkhard
Associate Publisher
Tel: 707-544-9977
Fax: 707-544-9375
[email protected]
ADVERTISING SALES—WEST—NEW
ACCOUNTS
Jeff Victor
Tel: 224-436-8044
Fax: 509-472-1888
[email protected]
Advertising Sales — central
Keith Neighbour
Tel: 773-275-4020
Fax: 773-275-3438
[email protected]
ADVERTISING SALES — New
accounts & Product Showcase
Joanne Frangides
Tel: 201-666-6698
Fax: 201-666-6698
[email protected]
U.K. and Europe
Sam Baird
Tel: +44 1883 715 697
Fax: +44 1883 715 697
[email protected]
U.K. and Europe
Zena Coupé
Tel: +44 1923 852 537
Fax: +44 1923 852 261
[email protected]
High Frequency Electronics (USPS 024-316) is published monthly by Summit Technical Media, LLC, 3 Hawk Dr., Bedford, NH 03110.
Vol. 13 No. 8 August 2014. Periodicals Postage Paid at Manchester, NH and at additional mailing offices.
POSTMASTER: Send address corrections to High Frequency Electronics, PO Box 10621, Bedford, NH 03110-0621.
Subscriptions are free to qualified technical and management personnel involved in the design, manufacture and distribution of electronic equipment and
systems at high frequencies. Copyright © 2014 Summit Technical Media, LLC
64 High Frequency Electronics
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INTRODUCING
MEET YOUR COOLSPAN®
TECA FILM SUPPORT TEAM
Leading the way in...
• Support • Service • Knowledge • Reputation
Rogers can help by being your reliable
conductive adhesive film source
SCAN THE CODE TO GET OUR CONTACT INFO.
Get the heat out of those high-power PCBs. COOLSPAN®
Thermally & Electrically Conductive Adhesive (TECA) Films
are ideal for dissipating heat in high-frequency circuits.
COOLSPAN adhesives feature outstanding thermal
conductivity (6 W/m/K) and reliable thermal stability.
Keep things cool, with Rogers and COOLSPAN TECA film.
CONTACT YOUR
SUPPORT TEAM
TODAY
Greg Bull
Applications
Development
Manager
Western
Territory
(U.S.)
John Dobrick
Scott Kennedy
Applications
Development
Manager
Southern
Territory
(U.S.) & South
America
Visit us at European
Microwave Week
October 7-9
Fiera di Roma, Italy
Stand 128
www.rogerscorp.com
Dale Doyle
Applications
Development
Manager
Northern
Territory
(U.S.) &
Canada
JohnHendricks
Regional
Sales Manager
Europe
Applications
Development
Manager
Eastern
Territory (U.S.)
Kent Yeung
Regional
Sales Director
Asia
If you are unable to scan a VR code please visit our
Support Team website at www.rogerscorp.com/coolspan