PC/104 Embedded Solutions - Winter 2005

Transcription

RSC #2 @ www.pc104online.com/rsc
Winter 2005
Volume 9 Number 5
w w w.pc10 4 online.c om
COLUMNS
FEATURES
HARDWARE: Embedded motherboards
8 PC/104 Embedded Consortium
The need for technological refresh
By Tom Barnum, PC/104 Embedded Consortium
22
By Roland Groeneveld, Logic Supply, Inc.
14 PC/104 Fundamentals 101
Sensor fundamentals 101
By Joel Huebner
Mini-ITX offers a useful alternative to traditional
embedded boards
TECHNOLOGY: Sensors
30
18 European Perspective
Interpolating DACs offer high speeds, but are they
controllable?
Company profile: DIGITAL-LOGIC AG
Constant innovation is the key to success
By Scott Hames, ICS
By Stefan Baginski
BUYER’S GUIDE:
36
66 Editor’s Insight
2006 PC/104 Buyer’s Guide
EPIC Express paves “bridge to the future”
By Chris A. Ciufo
EVENTS
DEPARTMENTS
45 Editor’s Choice Products
February 14-16, 2006
Embedded World
Nuremburg, Germany
www.embedded-world-2006.de
April 3-7, 2006
Embedded Systems Conference
San Jose, CA
www.esconline.com
April 4-6, 2006
RTS 2006
Paris, France
www.birp.com/rts2006/an/intro.htm
On the cover:
EEPD’s M1VE PCI-104 single board computer adds
serious horsepower to embedded systems. Now
available with a 1 GHz Intel Celeron, the module
is essentially a tiny desktop motherboard
that fits into PC/104-based
systems. PCI-104 is a PCI-only
version of PC/104 with the
legacy ISA bus omitted.
E-LETTER
Winter: www.pc104online.com/eletter
■ SOM vs. SBC: Comparing differences in embedded
technology
By Michele Lukowski, VersaLogic
■ Can this COTS-based system be saved?
Cover inset product:
Photo courtesy of EEPD.
www.EEPD.com
By Robert J. Leach, Howard University
WEB RESOURCES
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4 / Winter 2005
PC/104 Embedded Solutions
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PC/104 Embedded Solutions E-letter
PC/104 & Small Form Factor Catalog
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6 / Winter 2005
The need for
technological refresh
PC/104, EPIC, and EBX, are ubiquitous
in defense, medical, telecommunication,
and industrial applications where longterm availability is mandated. Many of
these applications go through a rigorous
certification and approval process. The
time required to move a project from conceptual development to testing, and subsequently to full production, can approach
3-5+ years. When the testing is complete,
the expectation is that embedded product
used in the application will be available for
an additional 5-10 years with some medical and military applications lasting for
25 years or more.
For their PC/104 and other small form
factor parts, manufacturers select highquality components from multiple vendors,
seek long-term commitments from silicon
suppliers, offer last-time buy opportunities, and maintain deep stocks of critical
components to ensure long-term product availability. Many of those vendors
offer life-cycle management programs to
ostensibly save OEMs time and money by
eliminating product redesigns. In addition,
embedded manufacturers have improved
their time to market for new platforms
and new derivatives of existing product.
In tandem, there are increasing promises
from embedded manufacturers to shepherd
product “from cradle to grave” and to back
up newly introduced products with a longevity guarantee.
Regrettably, the time associated with “from
cradle to grave” appears to be contracting.
There are considerable pressures in the ability to sustain these products over the span of
10-15 years or more, due to:
■ Early component obsolescence
■ The ever-present trend towards an
increasing number of components on
a platform (and concomitant increase
8 / Winter 2005
in the probability that a component
obsolescence could, in turn, cause
the obsolescence of the embedded
computer board)
■ Consolidations or mergers
■ Changes in business conditions or
otherwise
By Tom Barnum
from a single board supplier. In today’s
high-paced environment, the OEM would
be wise to allocate resources and have a
sustaining plan that includes the inevitable
technological refresh to either upgrade or
replace selected board-level product.
The nature of the problem:
Long-term component availability
vs. long development cycles
There are multiple drivers impacting longterm embedded computer availability. As
mentioned, early component obsolescence
due to changes in business conditions often forces a board“In today’s highlevel manufacturer to either
render a product obsolete earlier
paced environment,
than originally scheduled or to
move forward with a redesign.
the OEM would be
At present, there is the move
towards Restriction of the use
wise to allocate
of certain Hazardous Substances
resources and have a (RoHS)-compliant products and
the changeover by many silicon
vendors from a leaded to an
sustaining plan that
RoHS-compliant manufacturing
includes the inevitable process. That affords the opportunity for some firms to obsolete
less-profitable leaded compotechnological refresh
nent lines. After all, why expend
resources to change your manuto either upgrade
facturing process if volumes do
not warrant? In addition, technoor replace selected
logical advances will continue to
affect the availability of today’s
board-level product.”
silicon. The physical size of inteTo sustain a product over time requires
grated circuits will continue to get smaller
embedded computer manufacturers to
with improvements in chip-scale and wafercontinue their efforts to identify longscale packaging, and functionality previlived components and ensure a long-term,
ously implemented on several chips will
stable product supply. These requirements
integrate into single-chip, multi-chip, or
reinforce the need for embedded manufacSystem-on-Chip module solutions. These
turers to provide open specifications, supimprovements, in turn, will serve to conported by multiple vendors, to ensure that
tinue the trend of packing additional funca suitable option is available in case busitions and features onto embedded computer
ness conditions prompt early obsolescence
manufacturers’ current and future products.
Furthermore, the length of time required
to design-in an embedded computer platform exacerbates the ability to support the
product selected over the OEM’s targeted
product life cycle.
Winter 2005 / 9
With the increased number of components,
there is an associated rise in the probability
that the board may go obsolete or will need
to be upgraded to address the obsolescence
at the component level.
The OEM’s long development cycle exacerbates the problem. For example, the
FDA approval process for a Class II medical device consists of multiple phases. A
medical device manufacturer starts out
with strategic regulatory, scientific, and
safety planning in the preclinical phase.
This process eventually moves into fullfledged “pivotal” clinical trials, then moves
into intensive coordination of clinical and
post-marketing safety data collection, processing, and reporting. The documentation
associated with these phases is massive.
Military device development is no less time
consuming and resource intensive. Some
military applications follow the documentation protocol equivalent to the FDA
certification process. Intensive HALT,
HASS, extended temperature, and shock
(hammer/drop/barge) testing often follows
this protocol. The latter series of tests simulates conditions associated with torpedo or
missile attacks against military armament
that contains embedded computer devices.
It is a rare event for most industrial applications to be quickly developed. Although
not burdened by regulatory requirements,
in most industrial applications there are
multiple environmental conditions and
development issues that must be taken
into account before moving into production. Environmental issues include the
temperature and humidity requirements of
the system. Development concerns include
packaging requirements, OS selection,
application software development and
testing, and the market development associated with the device.
10 / Winter 2005
As a result, we have board-level manufacturers looking for long-lived components
and a “guarantee” of long-term availability from IC suppliers. However, high-end
embedded motherboards can take 12 or
more months to develop, test, and deploy.
Complicating matters, in most cases,
board designers do not immediately analyze newly released ICs and move forward
with a new design. Therefore, it could be
quite far along the silicon vendor’s guaranteed availability timeline before the boardlevel manufacturer has their embedded
product available. Even with a five-year
availability guarantee (from the date of
new silicon introduction), by the time an
embedded computer board manufacturer
designs and deploys their product and the
OEM goes through their development and
certification process, there is a high probability that the silicon originally selected
will have reached the end of its targeted
product life cycle.
As depicted in Figure 1, the IC Manufacturer (ICM) introduces their new component at time(0) while the Embedded
Board Manufacturer (EBM) selects that
component at time(1). The EBM takes
approximately one year to design-in the
ICM’s component bringing us to time(2).
The OEM selects the EBM’s embedded
computer at time(3) and spends three
years going through development and certification bringing us to full production at
time(6), just following the ICM’s expected
End-Of-Life (EOL).
The nature of the solution:
Open specifications, multiple
vendors, and periodic/staged
technological refreshes by OEMs
and end users
We can expect continued evolution
of embedded systems during the next
few years. There is the inevitable trend
towards higher performance processors
and advancements in memory and I/O
bandwidth. FPGAs and switched fabrics,
notably PCI-Express, will play an increas-
ingly important role in future development
efforts. The RoHS initiative will influence
component availability while simultaneously introducing new components. As
usual, the development and deployment of
new technology will displace legacy and
currently available integrated circuits.
OEMs will continue to select and develop
around board-level products that may
surpass the silicon supplier’s guarantee.
Accordingly, OEMs deploying embedded
computer products should have a formal
product life-cycle strategy during their
sustainment phase that includes planned,
routine, and technological refresh stages.
The technological refresh stage is an
opportunity to cut in upgraded product to
address component obsolescence issues at
the board level. In addition, it is an opportunity for the OEM to enhance additional
functionality and/or features that may be
available as a result of upgrades made to
product stemming from the board-level
manufacturer’s integration of a replacement component or migration path option
to address obsolescence issues.
Embedded computer manufacturers must
continue to do their part to sustain product
over the targeted life cycle of their OEM
customers. Migration options offering
form/fit/function solutions are generally
not drop-in replacements. For example,
a new video chip will invariably require
a new board layout, an updated driver,
and perhaps a change in the connector
scheme. An OEM may need to update
their software, change their connector
configuration, or even update packaging
to accommodate a board vendor’s change.
Board-level manufacturers need to better
understand the impact that even minimal
board-level changes have on specific OEM
applications and should endeavor to sup-
Figure 1
12 / Winter 2005
ply true form, fit, and function upgrade
paths that fit with the technological refresh
requirements of end users.
In summary, as a first step towards ensuring long-term availability, we have openstandards-based architecture supported by
multiple board-level manufacturers, which
allows OEMs to select from multiple
vendors. Additionally, these board-level
suppliers need to continue their efforts in
offering life-cycle management programs
that mitigate product redesigns. Keep in
mind that component obsolescence will
occur, and the board-level supplier must
do their part by offering either a revision
to the original platform or an upgrade path
to accommodate the OEM’s form, fit, and
function requirements. OEMs will need to
allocate significant resources to allow for
the periodic technological refreshes that
will invariably arise due to component and
board-level obsolescence.
For further information,
contact the Consortium:
PC/104 Embedded Consortium
490 2nd Street, Suite 301
San Francisco, CA 94107
Tel: 415-243-2104
Fax: 415-836-9094
E-mail: [email protected]
Website: www.pc104.org
Winter 2005 / 13
Sensor fundamentals 101
By Joel Huebner
No matter how much data processing speeds continue to advance, the
fundamental embedded systems requirement is for sensors to measure
and convert real-world data into a digitized format for PC/104 systems
to process.
This PC/104 Embedded Solutions Fundamentals 101 column focuses on
some of the more exciting and unique sensors that are readily available on
the commercial market. It briefly presents some of the basic but important
aspects of A/D converters and reviews some of the common pitfalls to
avoid when selecting a PC/104 data acquisition board with onboard A/D
converters for a particular PC/104 embedded system design.
LVDT
A Linear Variable Differential Transformer (LVDT) is a type of displacement
transducer. It measures the displacement
of a mechanical moving object in actual
applications ranging from jet engines to
robotics. For example, hydraulics and
mechanical assemblies utilize LVDTs.
Figure 1 depicts a transformer with a primary
winding and two secondary windings connected in opposition with a movable core.
The dots at each transformer winding indicate the polarity of the induced voltage. The
movable core of an LVDT is part of a shaft
that extends out of the LVDT and attaches
to any movable object. As the object moves,
causing the shaft or core to move within the
LVDT, the LVDT accurately measures the
displacement of the object.
The excitation provided to an LVDT is usually a sine wave measuring several volts RMS
and is typically between 1 kHz to 20 kHz.
The output of an LVDT is based upon the
relative displacement of the magnetic core.
When the magnetic core is centered, with
respect to the two secondary windings,
the output summation of both secondary windings is zero or null. As the core
moves toward one of the secondary windings, the net summation output increases
in amplitude and produces a non-zero dif14 / Winter 2005
A variation of an LVDT is the Rotary
Variable Differential Transformer (RVDT).
The RVDT is based upon the same principles and produces the same type of output as
the LVDT. The magnetic core of an RVDT
moves in a rotary motion with respect to the
primary and each secondary. This is useful
for 0º-360° rotational motion, as opposed to
the linear motion of an LVDT. Table 1 lists
a number of sensor applications.
Some of the advantages of an LVDT are:
Accelerometers
Acceleration is the measure of how
quickly speed changes, and an accelerometer is a sensor that measures acceleration. Accelerometers have made the most
remarkable advancements in the last five
to 10 years. They used to be very large,
power-hungry, and expensive devices.
Some of the newer accelerometer technology enables measuring the angle of tilt of
the sensor itself.
■ They are readily available and very
economical.
■ They are very reliable in terms of
service life due to a magnetic-based
sensor.
■ The core does not contact the
transformer.
The incorporation of accelerometers in
embedded systems has been, and continues to be, very diverse. Accelerometers
can monitor acceleration, angle of tilt, collision, gravity, and rotation. Such diverse
applications as automobile collision sensors, monitoring the pitch and roll of
ferential AC voltage output. The phase of
the summation signal will be in-phase with
the primary or 180° out-of-phase with the
primary, depending on which secondary
winding the core moves toward.
Figure 1
Sensor applications
LVDT
Used to measure the displacement of mechanical moving objects
Accelerometers
Used to measure acceleration, angle of tilt, collision, gravity, and rotation
Hall effect sensor
Used to measure changes in a magnetic field
Table 1
unmanned aerial vehicles, and the thumb
joystick found in many handheld electronic devices utilize accelerometers.
Many of today’s accelerometers either
incorporate a heated gas bubble located on
the silicon or a spring-suspended capacitive-based system. Thermal sensors surround the gas bubble system and detect the
movement of the gas bubble in much the
same way that the bubble in a carpenter’s
level works. The suspended, capacitivebased accelerometer includes a springsuspended plate above the silicon surface.
A differential capacitor created by the suspended plate and a fixed plate located on
the silicon surface measures deflections in
the plate due to external acceleration.
Hall effect sensor
The Hall effect sensor is simply a magnetic field sensor. It is especially useful
if the targeted component incorporates
or can incorporate a magnetic field. Hall
effect sensors operate in applications such
as anti-lock brake systems, gear rotation
monitoring, and solid-state switch applications. Hall effect sensors are advantageous
because they have no moving parts, are
solid state, are available in a broad temperature range, and are very reliable.
Semiconductor current flow is not orthogonal. When a constant DC current is present in a semiconductor in one direction,
no voltage (potential) is created in a perpendicular direction. But when a magnetic
field is placed at a right angle to the semiconductor material, the current passing
through the semiconductor is disturbed.
As a result, a DC voltage will be present.
The DC voltage measured is proportional
to the strength of the magnetic field. This
principle is the Hall effect (see Figure 2).
More than 125 years ago, Dr. Edwin Hall
discovered the Hall effect while using conductors. However, no one applied the Hall
effect to actual applications until semiconducting materials were invented in
the 1950s. In addition, no one utilized the
Hall effect sensors in the electronics industry until the last several decades when the
advancement of semiconducting materials
made the availability of the sensors more
common.
In fact, a vast array of sensors available on
the market today ranging from temperature sensors, pressure sensors, and position
sensors incorporate a Hall effect sensor.
These sensors internally include a magnet
and Hall effect sensor, which enable the
desired physical element (temperature,
pressure, or position) to alter the physical
distance of the magnetic element to the
Hall effect sensor.
A/D converters
The most fundamental requirement for any
type of analog-based sensor is to convert
the analog signal to a digital format for processing by a CPU, DSP, or FPGA located
within the PC/104 stack. The A/D converter
is the IC that performs this process. The
two main parameters that determine how
accurately it converts the analog input to a
digital signal are the bit resolution of the
Constant
Current
Constant
Current
Magnetic field
Semiconductor
Semiconductor
OV Measured
DC Voltage Measured
Figure 2
A/D converter and how fast the A/D converter samples the input analog signal.
Analog sensor output will have a fixed
voltage range that it uses to represent the
total range of the signal that it is measuring. For example, a pressure sensor may
be able to measure a range of 0-100 psi
and outputs an analog signal range of 05 VDC, which proportionally represents
the pressure it is measuring at any given
point in time. Alternatively, an LVDT sensor may have an analog AC output range
of ±10 VAC.
The analog input range that the A/D converter can accept should match with the
output voltage range of the sensor. A variety of A/D converters are available with
many different input ranges and are typically dependent upon the supply voltages
used to power the A/D converter itself.
A/D selection
Careful selection of the resolution of the A/D is very important. Utilize a
bit resolution that produces an accuracy that is satisfactory to the accuracy
required by the embedded system design. The system sensor’s data sheet
will determine the maximum bit resolution that is practical to use based
upon the minimum accuracy the output of the sensor itself can provide.
For example, suppose a data sheet of a sensor lists a minimum accuracy output
of 2.5 mV per something (gauss, PSI, temperature) and has an output range of
0-10 VDC. An A/D converter with a 12-bit resolution and input analog range
0-10 VDC would be able to accurately measure the maximum accuracy of the
sensor (12-bit = 4,096 binary numbers, 10 V/4,096 = 2.4m V).
It is also more important to determine if it is necessary to have that level
of resolution. If the end application of the PC/104 system dictates only an
accuracy required by the sensor that is a value greater than the resolution capabilities of the sensor itself, then utilize an A/D with a lower bit
resolution that meets the system requirements of the embedded design. The
PC/104 embedded system design requirements should dictate the accuracy
level of the required A/D converter.
Analog sensor output typically has to be
scaled through analog circuitry to match
the input range of the A/D converter.
16 / Winter 2005
The A/D converter takes discrete samples
of the incoming analog signal and converts
each sample to a digital number. This digital number is proportional to the full-scale
input analog range that the A/D converter
can accept as an analog input. An 8-bit
A/D converter can digitally represent 28
steps. The higher the bit resolution of the
A/D converter, the more steps that can be
represented. The bit resolution, in conjunction with the analog input range of
the A/D converter, determines the overall
resolution of the digital output. A 10-bit
A/D converter with a 0-5 V analog input
range can digitally represent the analog
input signal in 4.9 mV increments or steps.
(10-bit = 1,024 binary numbers, 5 V/1,024
= 4.9 mV). The bit resolution, in addition
to how fast the A/D converter can perform
the conversion process, determines the
digital accuracy of the measured analog
signal. Nyquist Theorem dictates that the
sample frequency needs to be at least twice
the highest frequency found in the input
analog signal to the A/D converter. If an
LVDT sensor has a 10 kHz output, the A/D
converter needs to have a sample rate of at
least 20 kHz or take a sample every 0.1 ms
or smaller to avoid anti-aliasing.
The technology of A/D converters continues to advance along with the entire
electronics industry. Many of today’s A/D
converters have integrated mux systems,
self-calibrating circuitry, integrated error
compensation, and additional features
that have advanced the accuracy, reliability, and capability of A/D converters as
a whole. The important thing is to select
a PC/104 data acquisition board that has
an A/D converter that possesses the functional parameters and capabilities that
meet the needs of the external sensors and
the requirements of the PC/104 embedded
system design itself.
PC/104 meets the physical world
The true advancement of PC/104 systems
is not necessary at the silicon level with
smaller and faster processors and memory,
but rather at the real-world interface level.
When the embedded engineer identifies
new ways of utilizing existing sensors to
gather data from the physical world in
new and creative ways, that is when the
embedded engineer pushes the envelope
of PC/104 technology and embedded systems as a whole.
Additional information, references, and Web
links about sensors and A/D converters are
available at www.jacyltechnology.com.
Web links on LVDT/RVDT, accelerometers,
the Hall effect sensor, and A/D converters
are available at www.pc104online.com/
departments/fundamentals/2005/winter/.
Joel Huebner is president of Jacyl
Technology, Inc. He holds two degrees
with honors from Purdue University in
electrical engineering and computer
engineering. Joel has more than 15 years’
experience as an electrical design engineer in the military aerospace industry
and in the custom electronic design
R&D industry.
For further information, contact
Joel at:
Jacyl Technology, Inc.
PO Box 350
Leo, IN 46765
Tel: 800-590-6067
Website: www.jacyltechnology.com
Winter 2005 / 17
Company profile: DIGITAL-LOGIC
By Stefan Baginski
Constant innovation is the key to success
The PC/104 market is composed of a variety of companies that often manufacture more than just PC/104 modules. The
Swiss company DIGITAL-LOGIC is no exception. A supplier of PC/104 and other small form factors, the company is
indicative of the market’s many innovators. DIGITAL-LOGIC was among the first to deploy Pentium processors on PC/104 by
designing a unique heat sink, and they continue to offer insight on how small-form-factor vendors are meeting the challenges
of market demands concerning more performance, reducing costs, and meeting European Restriction of the use of Hazardous
Substances (RoHS) requirements.
OpenSystems Publishing European bureau chief Stefan Baginski recently caught up with DIGITAL-LOGIC’s CEO, Felix Kunz.
DIGITAL-LOGIC is a mid-size company
specializing in supplying its customers
with PC/104 and other small-form-factor
embedded computers. Their modules are
small, provide relatively high performance
for their size, and usually offer an excellent compromise between power consumption and performance. Furthermore,
the company offers a range of small and
fanless computers called MICROSPACE
computer systems.
DIGITAL-LOGIC is
located in the northwestern part of Switzerland and supplies
customers in the areas
of industry, government (including military and space), and applied sciences.
Below is a recap of my recent conversation
with the company’s CEO, Felix Kunz.
We are not only a design and layout
company, but we have to make sure that
every DIGITAL-LOGIC-designed board
has solved the thermal dissipation problem. CPU performance generates heat,
and its dissipation or optimized distribution is one of our main objectives. One
of the ways we do this is to use a copper
ring acting as a power dissipation radiator. One example of this implementation
is our smartModule board, measuring
66 mm x 85 mm x 14 mm (2.6" x 3.3"
x 0.6"), that has a Pentium processor
working at 2 GHz (see Figure 1). I have
not yet seen a smaller module from our
competition with an equivalent or better
processor.
S.B. And now you are facing the RoHS
challenge. What does that entail?
F.K. In Europe, use of leaded products
will be restricted beginning in summer
2006. But we already have lead-free
computer boards. As soon as we can get
all associated components such as hard
drives in RoHS-compliant versions, our
products will be lead-free from the beginning of 2006. But beyond components,
the lead-free production process is also
more expensive. Our process must be free
of tin whiskers.
Some customers, such as the military, are
likely to remain using leaded products
because of their experience with quality.
They are prepared to pay for the 10-year
guarantee that coincides with their typical
life cycle.
S.B. How is the market changing
S.B. What is your market position, and
for you?
where do you see DIGITAL-LOGIC
now?
F.K. We had our revenues growing even
F.K. We are in the embedded market and
have the smallest size product of its class
on the market. I do not know of any other
company that offers the same performance
in the same- or smaller-size product format. This achievement is not easy. We have
to keep to the standard interfaces, of which
there are quite a few, and reducing module
sizes is not easy and often even impossible. In addition, we have to follow thermal
restrictions of all sorts.
18 / Winter 2005
Figure 1
The MICROSPACE PC systems are fully
equipped with hard disk, DVD, and passive cooling system. You will find no fan,
and everything is rock solid in this clever
patented cooling concept. Other features
of our products include scalability, designs
that are built for rugged environments, and
a long life-cycle availability guarantee.
at times of a slower growth in the market. During 2002-2004, we experienced
about 15 percent growth per year, and we
expect our growth to rise to 20 percent
or more in the next few years. We are
growing organically, from the financial
point of view, and we are a conservative company. We keep ourselves more
and more debt-free, and that’s what our
shareholders like. Thus, we are not planning an IPO, as we plan to stay stable.
In our business, the customer loses
confidence if he observes too much
movement around the supplier. Over the
years, we have kept the same sales people to service our customers and changed
only the products to meet their needs.
In 1998 and 2000, we had a couple of
rounds of refinancing and invested in
new technologies. Since then, we’ve been
operating in a high-cost marketplace, with
high salaries, and we must therefore push
the automation rate as high as possible to
make ourselves competitive with the Far
East production competitors. We do not
expect to outsource our production to offshore countries. Our biggest challenge is
here, in continuing innovation, increasing
yields, and investing in people.
For large quantity projects, we cooperate
with subcontractors for assembly.
new generation of products featuring the
GX 800LX processor.
On the technology side, we started very
early with RoHS, and the other challenge
is to stay close to Intel. The technology
changes rapidly, and DIGITAL-LOGIC is
focused on Intel because of product stability and the 10-year long life program.
As a positive example, we have 386 chips
in stock, which is a device that has been
running now for more than 20 years. We
take care to supply our customers with
products for up to 10 years. Only product
stability, product quality, and continued
new developments guarantee our leading
position in the embedded market.
S.B. Where are you staying on the
S.B. What technology or services are to
be expected in the future?
F.K. DIGITAL-LOGIC will integrate
Note that 90 percent of our shipments are
exported, outside of Switzerland, and about
50 percent end up in Europe. We always
concentrate on top performance. With our
own production, we are capable of assembling approximately 100,000 units per year,
so we have to concentrate on niche markets.
Intel’s high-performance CPUs as dual
core Pentiums with low power consumption. For medium performance and lower
priced applications, we will come up with
products featuring the AMD Geode800.
At the computer show SPS 2005, in
Nuremberg, we are going to introduce our
value chain?
F.K. We are staying with our core competence. Our SM855 and SM915 are amazing modules. As I said, we consider them
to be the world’s smallest Pentium M
computer modules, which are based
on the Intel 915GM chipset (533 MHz
front-side bus) and use the Pentium M
processor at speeds from 0.6 to 2.0 GHz.
Performance is our goal, and with 2 MB
of L2 cache, the Pentium M clocked at
1.8 GHz reaches a performance level
compatible to that of a 3.4 GHz Pentium 4
processor. Our module consumes only
6 W to 20 W. The SM915 uses the Extreme
Graphics video controller and supports
DirectX 9 with up to 256 MB.
We also use a sophisticated cooling concept in which a cover is made out of a
high-strength, milled aluminum block
with a fixed bearing system around the
circuit board, and it has a special copper core mounted on the CPU, which is
pressed tightly against the enclosure wall
or against the heat sink. The unit works in
the standard temperature range of -0 °C
to +60 °C, screened under the E48 modules. With lower CPU clock rates such as
600 MHz, the module has also been
approved for an extended temperature
range of -40 °C and +85 °C. As you see,
we try to always move upwards in the
value chain, thus our products are easier
to use and they provide cost-effective
solutions to the end user.
S.B. Finally, how much software is
involved in your product development?
F.K. We provide all board support packages and drivers and support all major
operating systems such as VxWorks,
Linux, Microsoft’s offerings, QNX, and
several others.
For more information, contact Felix at:
DIGITAL-LOGIC AG
20 / Winter 2005
Nordstrasse 11/F
CH-4542 Luterbach
Tel: +41-0-32-681-5800
Fax: +41-0-32-681-5801
Website: www.digitallogic.com
Hardware
Embedded motherboards
Mini-ITX offers a useful alternative
to traditional embedded boards
By Roland Groeneveld
Embedded systems engineers face the same question at the
beginning of every project – “Which embedded system board
is best suited to my application?” While custom design is
technically feasible, it’s not always fiscally realistic. Among the
off-the-shelf open standards such as PC/104, EBX, EPIC, and the
de facto 5.25" and 3.5" form factors, the Mini-ITX form factor
stands out as a relative newcomer to the embedded scene. System
engineers are discovering the advantages of Mini-ITX. While this
form factor isn’t the answer in all situations, the Mini-ITX main
board is emerging as a powerful alternative in the embedded
arena.
VIA originally launched Mini-ITX as a reference design to showcase their core products, chipsets, and processors. The enthusiastic response to these boards spurred VIA
to begin commercial production. They
formally launched the VIA EPIA line of
Mini-ITX motherboards (see Figure 1) in
2002. Shortly thereafter, Logic Supply,
Inc., a Mini-ITX distributor and solutions
provider, started offering this new form
factor and related components.
marketing took note, and to this day, the
company focuses especially on consumer
products utilizing the EPIA line of main
boards.
Figure 1
There are both technical and business
advantages fueling the market’s demand.
The appeal of the boards is derived, in
large part, from their usability. Mini-ITX
boards offer all the features of a standard
PC motherboard in a smaller package.
The form factor measures 17 cm x 17
cm (6.7" x 6.7") and frequently contains
an integrated processor. The EPIA line
was especially popular among computer
hobbyists eager for a smaller alternative to their large desktop towers. VIA’s
Technical advantages
Mini-ITX boards are defined by their size,
layout, degree of integration, and compatibility. As well, VIA offers a unique
feature known as the VIA Padlock
Security Suite.
22 / Winter 2005
This pedigree of PC similarity as well as
consumer attractiveness are perhaps why
hard-core embedded designers have, in
the past, looked suspiciously at Mini-ITX.
But with the possible exception of the military market, we are seeing the form factor used more frequently in “embedded”
areas. Industrial board manufacturers such
as Kontron, DFI-ACP, and Commell have
taken notice and are now offering a range
of solutions in 17 cm x 17 cm, many capable of carrying ultra low-voltage Celeron,
Pentium M, and P4 processors.
At 17 cm x 17 cm, the Mini-ITX form factor is hardly the smallest of the standard
embedded form factors. It is, however,
significantly smaller than a traditional
ATX PC board and suitable for many
applications where smaller, but not micro,
sizing is desired.
As compared to smaller form factors, the
extra real estate on the Mini-ITX board
creates ample space for integrated I/O.
The layout of the mounting holes, back
panel I/O shield, and PCI slot is similar to ATX-style PC boards. In fact, this
standardized layout has encouraged the
rapid development of Mini-ITX specific
chassis. Moreover, most Mini-ITX motherboards work with standard ATX power
supplies and a 20-pin ATX power connector. With “backward” compatibility, a
Mini-ITX board is even useful in an ATX
enclosure.
Morex and Casetronic are manufacturers
who specialize in Mini-ITX cases. They
offer very small (mobile) cases, expandable cases with PCI slots, and rackmount
cases. Serener has created a relatively
new solution – a range of fanless MiniITX cases. Using heat pipe technology,
they make VIA C3 and Pentium M-based
systems completely fanless by bringing
the heat to the side of the finned chassis
(refer to Figure 2).
The VIA Eden and C3 processors used on
many Mini-ITX motherboards are power-
Figure 2
Winter 2005 / 23
Embedded motherboards
Hardware
efficient and fully x86 compatible. These
processors are ideal for embedded applications where those considerations are
key. For applications requiring more processing power, Intel-based motherboards
are also available.
With full PC compatibility and mature
hardware, developing software applications is straightforward and fast. Available
support for almost all x86-based operating systems includes:
■ Windows 2000 and Windows XP
■ Windows XP Embedded and
CE .NET
■ Linux, BSD
■ Embedded Linux and RT-Linux
Just like a regular PC, Mini-ITX boards
have a range of I/O ports available: Serial,
parallel, USB, FireWire, keyboard/mouse,
audio, VGA, TV and S-Video out, 10/100
Ethernet LAN, floppy, and IDE ports are
standard. The more advanced boards fea-
ture onboard CompactFlash and PCMCIA
slots, DVI, LVDS, RGB, Gigabit LAN,
Serial ATA, and programmable digital I/O
ports.
All Mini-ITX motherboards come with a
PCI or PCI-Express slot, and some also
include mini-PCI, enabling additional
add-ons like video capture cards, extra
network, or wireless interfaces. With the
use of dual PCI riser cards, it’s possible to
add two PCI cards. Most main boards use
standard DDR266 or DDR400 memory or
the newer and faster DDR2 memory. The
high-end Mini-ITX boards offer a watchdog timer and standard system monitoring interfaces, not unlike many embedded
computer boards such as VME.
VIA EPIA Mini-ITX motherboards with
the latest VIA C3, Eden, and Eden N processors offer the VIA Padlock Security
Suite. This consists of an on-die hardware number generator and Advanced
Cryptography Engine. The hardware
number generator harvests oscillations
across the die for an extremely high
degree of randomness. These oscillations
can be used for the creation of virtual private networks and digital certificates. The
integrated cryptography engine offers
on-the-fly data encryption and decryption and encoding of locally stored data.
The VIA Padlock Security Suite offers
almost transparent encryption with minimal impact on system performance. For
an overview of popular Mini-ITX motherboards, see Table 1.
24 / Winter 2005
Bottom line business advantages
At some point during an engineer’s analysis of technical options, business considerations enter the picture. Here, the VIA
pioneered solution is most compelling
since the Mini-ITX form factor speeds
development time, is widely available,
and is in general quite economical. By
using standard, off-the-shelf PC components, the development and operational
cost of Mini-ITX solutions is considerably lower than most other embedded
form factors. With a range of compatible
accessories such as enclosures, power
supplies, CF adapters, riser cards, and
IDE adapters, it’s possible to quickly set
up a working prototype without designing
a custom enclosure.
Table 1
Winter 2005 / 25
VT1622
TV Out
1 x PS/2 mouse
port
1 x PS/2 keyboard
port
1 x PS/2 mouse
port
Keyboard/
Mouse
1.3GHz VIA C3
1 x PS/2 mouse
port
1 x PS/2 keyboard
port
1 x 10/100
VIA VT1617A
6-channel
LVDS ready
Yes
VT1623
–
Integrated VIA
Unichrome Pro AGP
Graphics Core with
MPEG-2/MPEG-4
Accelerator
1 x Onboard 1394
6 x Onboard USB2
2 x Back Panel
USB2
–
2 x SATA
2 x 40-pin ATA133
1 x 184-pin
DDR266/333/400
VIA CN400
& VT8237
Fan (1.3GHz)
VIA EPIA DP
2 x PS/2 onboard
headers
1 x Gigabit, 2 x
10/100
VIA VT1617A
6-channel
–
Yes
VT1623
–
Integrated VIA
Unichrome Pro AGP
Graphics Core with
MPEG-2/MPEG-4
Accelerator
1 x Onboard 1394
2 x Onboard USB2
2 x Back Panel
USB2
–
2 x SATA
1 x 40-pin ATA133
2 x 184-pin
DDR266/333/400
VIA CN400
& VT8238
Single Fan
1GHz VIA Eden-N
Dual Processor
Commell LV-667D
Commell LV-670
–
1 x Onboard 1394
1 x Onboard 1394
1 x PS/2 mouse
port
1 x PS/2 keyboard
port
2 x 10/100
VIA VT1616
6-channel
–
–
–
Onboard DVI
header
1 x PS/2 mouse
port
1 x PS/2 keyboard
port
1 x 10/100
Intel ICH4
6-channel
–
Yes (disables TV
out)
Chrontel CH7011
–
Integrated VIA
Integrated Intel
Unichrome Pro IGP Extreme Graphics
Graphics Core with Core
MPEG-2/MPEG-4
Accelerator
1 x Back Panel
1394
2 x Onboard USB2
2 x Back Panel
USB2
2 x Back Panel
1394
2 x Onboard USB2
4 x Back Panel
USB2
1 x 26-pin flat cable 1 x floppy port
2 x SATA
1 x 40-pin ATA100
1 x 44-pin ATA100
1 x 40-pin ATA100
1 x 184-pin
DDR200/266/333
Intel 845GV
& ICH4
Not included
Supports Pentium
4 / Celeron socket
478 400/533MHz
FSB
1 x 44-pin ATA100
1 x 184-pin
DDR266/333/400
VIA CN400
& VT8237
Fan (1GHz)
1GHz VIA C3
1 x PCI
–
–
ATX style
PCI Slot
CF Slot
PCMCIA
Power
Supply
3 x Onboard COM
ATX style
1 x PCMCIA slot
1 x CompactFlash
1 x PCI
ATX style
–
–
1 x PCI
1 x Onboard header 1 x Parallel port
1 x Onboard COM
ATX style
–
1 x CompactFlash
1 x PCI
ATX style
–
–
1 x PCI
ATX style
–
–
2 x PCI
1 x Onboard header 1 x Onboard header –
1 x Onboard COM
ATX style
–
1 x CompactFlash
1 x PCI
–
2 x Onboard COM
ATX style with P4
power connector
–
–
1 x PCI
1 x Parallel port
1 x Onboard COM
2 x PS/2 onboard
headers
1 x 10/100
VIA VT1616
6-channel
LVDS ready
Onboard header
VT1622A
–
Integrated VIA
Unichrome Pro
AGP Graphics
Core with MPEG-2
Accelerator
–
6 x Onboard USB2
–
–
2 x 40-pin ATA133
1 x 200-pin
SODIMM
VIA CLE266
& VT8237
Fan (1GHz)
Fanless (.8 & 1GHz) Fanless (800MHz)
1.2GHz VIA C3
1GHz VIA Eden
VIA EPIA SP
800MHz VIA Eden
1 x Back Panel COM 1 x Back Panel COM 2 x Back Panel COM 1 x Onboard COM
1 x PS/2 mouse
port
1 x PS/2 keyboard
port
2 x 10/100
VIA VT1612A
2-channel
LVDS ready
–
–
–
Integrated VIA
Unichrome AGP
Graphics Core
with MPEG-2
Accelerator
–
2 x Onboard USB2
4 x Back Panel
USB2
1 x floppy port
–
2 x 40-pin ATA133
1 x 184-pin
DDR266
VIA CLE266
& VT8237
Fan (1GHz)
Fanless (600MHz)
1GHz VIA C3
VIA EPIA MS
800MHz VIA Eden
1 x Back Panel COM 1 x Back Panel COM 1 x Back Panel COM 2 x Onboard COM
1 x 10/100
VIA EPIA PD
600MHz VIA Eden
1 x Onboard COM
Parallel Port 1 x Parallel port
Serial Port
1 x PS/2 keyboard
port
1 x 10/100
LAN
LVDS ready
VIA VT1616
6-channel
LVDS ready
VIA VT1616
6-channel
LVDS
Yes
VT1622A
–
Integrated VIA
Unichrome AGP
Graphics Core
with MPEG-2
Accelerator
1 x Back
Panel 1394
1 x floppy port
–
2 x 40-pin ATA133
Audio
S-Video Out Yes
–
DVI
2 x Onboard USB2
Integrated VIA
Unichrome AGP
Graphics Core
with MPEG-2
Accelerator
2 x Back Panel
USB2
USB
VGA
2 x Onboard USB2
1 x floppy port
Floppy
2 x Onboard 1394
–
Serial ATA
Firewire
(1394)
2 x Back Panel
USB2
2 x 40-pin ATA133
IDE
1 x 184-pin
DDR266
1 x 184-pin
DDR266
Memory
VIA CLE266
& VT8236
Fan (1 & 1.2GHz)
Fan (1GHz)
VIA CLE266
& VT8235
Fanless (600MHz)
Fanless (600MHz)
1.2GHz VIA C3
1GHz VIA C3
1GHz VIA C3
VIA EPIA MII
600MHz VIA Eden
VIA EPIA M
600MHz VIA Eden
Chipset
Processor
Cooling
Processor
Model
Commell LV-672
Commell LV-673NS
2 x SATA
1 x 44-pin ATA100
1 x 40-pin ATA100
2 x 240-pin
DDRII400/533
Intel 915GM
& ICH6M
Fan
Supports Pentium
M / Celeron
M socket 479
400/533MHz FSB
1 x PS/2 mouse
port
1 x PS/2 keyboard
port
2 x Gigabit
Intel ICH6R
6-channel
Onboard LVDS
–
Chrontel CH7011
–
Integrated
Graphic Media
Accelerator 900
–
2 x Onboard USB2
2 x Back Panel
USB2
ATX style with P4
power connector
–
–
Onboard 12V 4-pin
power connector
–
–
1 x PCI Express
1 x Mini-PCI
1 x Mini-PCI
(bottom)
–
1 x PCI Express
–
2 x Back Panel COM 2 x Back Panel
COM
1 x PS/2 mouse
port
1 x PS/2 keyboard
port
2 x 10/100
Intel ICH6R
6-channel
–
–
–
–
Integrated
Graphic Media
Accelerator 900
2 x Back Panel
1394
2 x Onboard USB2
4 x Back Panel
USB2
1 x 26-pin flat cable 1 x 26-pin flat cable
4 x SATA
1 x 40-pin ATA100
2 x 240-pin
DDRII400/533
Intel 915G
& ICH6R
Not included
Supports Pentium
4 / Celeron D with
LGA775 800MHz
FSB
26 / Winter 2005
Hardware
Tens of thousands of VIA boards are
sold each month in Asia, Europe, and
the United States. The popularity of the
board among consumers and engineers
has resulted in a range of different main
boards from which to choose. The broad
appeal of the product ensures availability
and shortens lead times.
■
■
Retail prices for VIA Mini-ITX boards
range from $129-225. Prices for Pentium M
and P4-compatible boards are higher, but
few break $400. While there are certainly
other form factors that offer comparable
per unit costs, most require upfront development costs that Mini-ITX minimizes.
Applications and examples
As a solution provider specializing in
the Mini-ITX form factor, Logic Supply
regularly works with engineers to develop
and refine Mini-ITX-based systems.
Customers are using Mini-ITX systems
as the engine to capture video security
data, power home automation appliances,
run kiosk and point-of-sale systems, and
serve as robots’ “brains.” We are certainly
seeing them used as digital entertainment
devices, set-top boxes, personal PCs and
servers, and thin clients. However, an
analysis of our customer base revealed
that these consumer-oriented and PC-like
applications are actually less pervasive
than one might suppose.
The following are examples of our customer base using Mini-ITX in traditionally embedded arenas:
■ Date logging – A Florida engineering
firm uses Mini-ITX systems inside
a NEMA enclosure to measure and
monitor the structural integrity of
Department of Transportation-run
state bridges.
■ Industrial control – A Maine paper
mill utilizes a Mini-ITX fanless system in its pulp room, where dust and
chemicals will, in the words of the
mill’s IT director, “break down a Dell
in three months.”
■ Kiosk – A PC-based ATM manufacturer uses embedded VIA boards
inside their cash machines. A gaming
kiosk manufacturer is using enclosed
Mini-ITX systems, enabling them
■
■
to “hot swap” units if they need to
update the software.
Communications – A broadcast
telephony company employs a MiniITX board as the basis for one of its
codecs, and a wireless networking
company uses a Mini-ITX system as
its mesh network box.
Digital signage – A satellite-based
digital signage company uses a
Mini-ITX product as the plasma
display engine, powering static and
multimedia content.
Dedicated appliance – A software
company specializing in license plate
recognition offers its customers a
complete (software plus hardware)
solution, including an appliance based
around the Mini-ITX form factor.
Mobile computing – A security company uses Mini-ITX systems to create
a mobile video recording and transmitting unit for law enforcement.
Mini-ITX-based systems can be tougher
than one might suppose. Processor fans,
enclosure fans, and hard drives are typical points of failure. Fanless solutions
are best suited to harsh environments,
and a fanless, solid state system (utilizing flash memory) is ideal. Fortunately,
both fanless and solid state systems are
easy to create in this form factor. The
low-power, low-heat characteristic of
Mini-ITX enabled the development
of several lines of fanless cases. These
enclosures make it possible to create
an extremely rugged and reliable solution for harsh environments and other
embedded solutions.
The future of Mini-ITX
VIA is planning a range of new Mini-ITX
motherboards with their highly efficient,
low-power C7 processor. These motherboards will include the latest technology
such as SATA, DDR2 400/533 memory,
Gigabit Ethernet, DVI, and mini-PCI
slots. Also planned is the new High
Definition Multimedia Interface (HDMI),
which offers eight-channel digital audio,
high definition video, and data (including
I2C data). HDMI is backwards-compatible with DVI, but it uses a much smaller
connector, which is always good news for
the embedded market.
Winter 2005 / 27
28 / Winter 2005
Hardware
Other manufacturers like Kontron, DFIACP, iBASE, and Commell are focusing
their Mini-ITX efforts mainly around
Intel processors. ULV, Celeron M, and
Pentium M processors allow for more
powerful solutions while maintaining
low power usage and heat dissipation.
Pentium 4 solutions are also available, but
generally the power and cooling requirements are difficult to combine with small
size requirements.
VIA’s long-awaited Nano-ITX motherboard will finally become available at
the end of this year. Measuring 12 cm x
12 cm (4.7" x 4.7"), this motherboard is
even smaller than the Mini-ITX, while
maintaining full PC compatibility. The
Nano-ITX is designed around the VIA
Luke CoreFusion processor, which has an
integrated Northbridge. With integrated
audio, video, LAN, SATA, and much
more, it is poised to be the smallest multimedia-capable single board computer
available on the market. For a comparison
of ATX, Mini-ITX, and nano-ITX main
boards see Figure 3.
Embedded engineers will continue to
weigh the pros and cons of their system
board choices. There are certain applications where the PC/104, EBX, EPIC,
and other boards shine: Think extreme
temperature swings, high vibration situations, and deployments lasting more
than five years. However, Mini-ITX lends
itself easily and reliably to many applications traditionally viewed as core to the
embedded market. For less extreme uses,
Mini-ITX offers a useful alternative to
often-employed solutions.
Links
VIA Embedded – www.viaembedded.com
Mini-ITX information – www.epiapenter.com
Logic Supply – www.logicsupply.com
HDMI – www.hdmi.org
Roland Groeneveld is founder and
president of Logic Supply, Inc., a
Mini-ITX distributor and solutions
provider. His background is in global
IT consultancy with LogicaCMG in
Europe and IT management at
Tiscali, a large European ISP. He has
degrees in electrical engineering and
computer science.
To learn more, contact Roland at:
Logic Supply, Inc.
35 Crossroad
Waterbury, VT 05676
Tel: 802-244-8302
Fax: 802-244-7938
Website: www.logicsupply.com
Nano
Mini
Figure 3
Winter 2005 / 29
Sensors
Technology
Interpolating DACs offer high speeds,
but are they controllable?
By Scott Hames
Current state-of-the-art software defined radio transmit
techniques typically involve synthesis of signals at the
Intermediate Frequency (IF) or, even in some cases, such as
High Frequency (HF) and Very High Frequency (VHF), at the
Radio Frequency (RF). Such synthesis demands data streaming
to the Digital Analog Converter (DAC) input at very high rates,
approaching 1 GHz in some cases. Supplying data at these rates
is a serious challenge, even between components on the same
board. To alleviate the problems of moving data at high speed and
simplifying system design, DAC manufacturers are offering parts
that include on-chip clock multipliers, Direct Digital Synthesis
Numerically Controlled Oscillators (DDS/NCOs), interpolating
filters, and mixers. The theory is that by digitally performing the
final upconversion on the DAC chip, the user need only supply
data at the baseband rate. Furthermore, the programmable
NCO can bring substantial flexibility to the hardware, enabling
software control for spread spectrum techniques such as
frequency hopping. While these features provide obvious benefits,
there are subtle caveats that should be noted when specifying
DACs for phase-sensitive applications.
Experimenting with digital
upconverter DACs
Phased array radar is a prime example
of a phase-sensitive application that
requires exact synchronization of multiple DAC outputs across multiple trigger
events. In the past, it was commonplace
to use “standard” DACs – simple but fast
devices that enabled clock and data input
control. However, the problem was ensuring clock and data stream synchronization. As DAC conversion rates increased
beyond about 300 MHz, keeping the
clock and data rates down to manageable
levels drove experimentation with what
could be called interpolating or digital
upconverter DACs – devices that accept
data at the baseband rate, and then perform Digital UpConversion (DUC) functions on the chip, before generating the
analog output. Unfortunately, in most
cases, the user is limited in precisely con30 / Winter 2005
trolling the internal DUC functions of
these parts. This limitation eliminates the
possibility of ensuring that the outputs are
truly synchronous. In many applications,
they do more harm than good.
At ICS, we have performed an extended
evaluation of a particular 200 MHz interpolating DAC – but have had to abandon
the effort. The DAC in question includes
all the features previously listed, including an on-chip clock multiplier, DDS
NCO, interpolating filters, and mixers.
Although it has been very successful
in some applications, it has been a total
failure in phase-sensitive situations. One
target application was generating a radar
system FM chirp pulse. It was critical that
the phase and timing of the output be the
same (sub-nanosecond consistency) from
one trigger to the next, and across multiple channels. Also, the ability to set phase
arbitrarily across channels for transmit
beam forming was highly desirable, if
possible.
The need for user control
Because the DAC in question was operating as a quadrature upconverter, it relied
on an internal DDS NCO. This operation
produced the intermediate frequency for
modulation by the incoming data. The
phase of any signal generated at the DAC
output would depend on the phase of the
baseband data and the phase of the DDS
NCO. Unfortunately, even if the onboard
logic perfectly controlled the input data
timing, the NCO was free running after
chip release from the reset condition. The
user could not reset the phase of the NCO
to zero, or any other known point, on
demand. Ideally, the requirement was to
use the variable Pulse Repetition Interval
(PRI) trigger input to restart the NCO, so
that every pulse was identical. Two necessary features that simply did not exist
were:
■ A register in the chip that would allow
specification of the starting phase of
the DDS NCO
■ An NCO_SYNC pin on the device
that would clear the phase accumulator and allow arbitrary synchronization based on an external event
Difficulties with synchronization
On-chip clock multipliers are another
feature that adds risk to phase-sensitive
multichannel designs. Many high-speed
DACs accept a low-speed clock and multiply it up to a much higher speed internal clock. This process is risky because
in multichannel systems, each chip usually generates its own high-speed inter-
PC/104
Solutions Winter 2005 / 31
RSCEmbedded
#31 @ www.pc104online.com/rsc
32 / Winter 2005
Technology
“...the high
want to ensure that they have access to all
of these controls.
speeds offered by
many of today’s
interpolating
DACs are
superficially
attractive, but
implementation
in real-world
applications
requires a deep
understanding
of how they
work and their
limitations. . .”
nal clock using a Phased Lock Loop
(PLL). Since each PLL will lock up at a
slightly different time after the clock is
applied, changed, or the chips are reset,
the DAC clocks will always be different.
Furthermore, after the high-speed clock is
generated, it is often contained within the
chip, so that no other equipment, such as
other DACs, can be synchronized with it.
If there is to be a clock multiplier on chip,
it is imperative that it has the ability to
deliver the full-speed conversion clock to
the outside world, not a low-speed derivative of it.
Other parts of the processing chain that
will affect the phase of the signal are,
for example, interpolation counters and
Finite Impulse Response/Infinite Impulse
Response/Cascaded Integrator Comb
(FIR/IIR/CIC) filter pipelines. The state
of the interpolation counter determines
when new data is accepted into the pipeline. Unless the counter state can be
controlled based on external conditions,
phase uncertainty exists. In addition, if
old, invalid data is not flushed from filter
pipelines, it could corrupt the new input.
Designers of phase-sensitive systems will
Solution built around GrayChip
products
A solution that has worked was a separate
DDC ASIC from GrayChip (now owned
by Texas Instruments) that converted the
baseband input data to the final intermediate frequency before feeding it to a
standard DAC. The GrayChip 4116 and
5016 in particular were outstanding products, with an excellent implementation
of all the features previously mentioned
(DDS NCOs, interpolating filters, mixers)
and more. A multilevel synchronization
scheme enables internal or external synchronization of virtually every parameter
in the signal processing chain. Although
this scheme puts responsibility for proper
control of the device squarely on the system designer or application programmer,
and the learning curve is substantial, it
is extremely powerful in the hands of an
experienced user.
In summary, the high speeds offered by
many of today’s interpolating DACs are
superficially attractive, but implementation in real-world applications requires
a deep understanding of how they work
and their limitations if the systems
designer is to be able to take advantage
of them.
Scott Hames is Director of Product
Management, Interactive Circuits and
Systems, Ltd., Ottawa, Canada. ICS
is a member of Radstone Embedded
Computing. Scott’s 11 years at ICS
have included positions in hardware,
test, and field applications engineering.
As well as qualifications in electronics,
Scott holds an MBA from the Richard
Ivey School of Business, University of
Western Ontario.
For more information, contact ICS
directly:
ICS
5430 Canotek Road
Ottawa, Ontario K1J9G2
Canada
Tel: 800-267-9794
Website: www.ics-ltd.com
TABLE OF CONTENTS
2006 PC/104 BUYER’S GUIDE
BOARD LEVEL
Chips & Cores: Other
DSP Resource Boards: TIM
Component-level modules
DSP Resource Boards: PC/104-Plus
Bridge: PC/104 to DeviceNet
DSP algorithm
Bridge: PC/104 to ISA
DSP Resource Boards: PC/104
Bridge: PC/104 to PC/104
Bridge: PCI-to-ISA
Bridge: Other bridges
Chips & Cores: Bus interface
I/O: Analog
Chips & Cores: FPGA
I/O: Digital
Chips & Cores: Media SoC
DSP Resource Boards: PCI-104
Chips & Cores: Pentium
I/O: FPGA
I/O: Industrial
I/O: Multifunction
Memory: Flash
Memory: General purpose
Memory: Reflective
PCMCIA/CardBus
PCMCIA/PC card
Structured ASIC
System Boards
Other Module <100cm2
36 / Winter 2005
Remote access
Routers/Switches
FABRICS
ETX
Servers
Fabrics: Fibre channel
IP
Software: Middleware
Fabrics: RapidIO
PC/104
Software defined radio
Fabrics: StarFabric
PC/104-Plus
Telecom: T1/E1
Turnkey system
COMMUNICATIONS
Datacom: ARCNET
Datacom: Ethernet
Datacom: FDDI
TABLE OF CONTENTS
CARRIER BOARDS
PACKAGING
Voice: VoIP
Air Transport Rack (ATR)
Wireless
Backplane
Wireless: GPS
Backplane accessories
Wireless: GSM/GPRS
Backplane: Other
Datacom: General
Datacom: GPIB/MXI
Datacom: LAN
Datacom: Security
Datacom: Serial controller
Datacom: USB controller
Datacom: WAN
Datacom: WLAN
Embedded Internet
Internet appliances
Modem/Fax modem
Optical
Winter 2005 / 37
TABLE OF CONTENTS
Battery
ESD management
Board accessories
IEEE 1394 (FireWire)
Card rack + card cage
Keypad/Keyboard interface
386SX
Card rack accessories
Power: General
80C188EB
Card rack/subrack
Power supply
AMD SC520
Connectors: Backplane
Power-fail module
C3
Connectors: Hard metric
Production tools
Celeron
Connectors: PC/104
SCSI controller
Celeron M
Connectors: Other
SCSI peripheral
Coldfire
Enclosure
Shelf and mechanical components
Crusoe
Enclosure + card rack
System monitoring
Cyrix
Enclosure + card rack + power supply
Thermal management
Eden
PROCESSOR BOARDS
ELAN
Ezra
Geode
Hitachi SH Family
MPC5200
Multiple MPU
Pentium
Pentium 4
Pentium II
Pentium III
Pentium M
Pentium MMX
PowerPC
PowerQUICC
RISC
SC520
Socket 370
Socket 7
STPC Consumer
STPC Elite
STPC Industrial
STPC-ATLAS
STPC-Client
x86
38 / Winter 2005
TEST AND ANALYSIS
Other
LVDT/RVDT stimulus and measurement
Counter/timer
RUGGEDIZED/MIL-SPEC
ARINC
GPS/Precision time code
Digital-to-synchro
Data acquisition
Signal conditioner
Synchro-to-Digital
Test systems
Avionics
Waveform digitizers/Digital oscilloscopes
MIL-STD-1553
Waveform generator
Telemetry
SOFTWARE & DEVELOPMENT
Bus analyzer
Development platform
Development tools
IDE
JTAG
Prototyping and debugging aids
Software: Application
Software: Board support packages
Software: Compilers
Software: Development tool
Software: Java
Software: Library
Software: Linux
Software: Modeling tool
Software: Networking
Software: Operating system
Software: Protocol stack
System integration services
Winter 2005 / 39
TABLE OF CONTENTS
XScale
ABIA Technology
•
ACCES I/O Products
•
•
Acromag
•
•
ACS-Tech 80
•
ADLINK Technology
•
•
•
Advanced Digital Logic
Advantech
•
•
Ampro Computers
•
•
Andor Design
Aprotek
•
APS
•
•
Aquarela Systems
•
Arbor Technology
•
•
Arcom Control Systems
•
Arista
Arius
•
ASRC
•
Axiomtek
•
•
BittWare
•
•
Blue Chip
•
CCII Systems
•
Centralp Automatismes
Comark
•
•
Commtech
•
•
•
CyberResearch
•
Data Device
•
•
Data I/O
•
Datalight
•
Dataram
•
Derivation Systems
•
Diamond Systems
Douglas Electronics
•
•
•
•
•
•
•
•
•
DPAC Technologies
•
DSP Design
DSP Systems
Eagle Technology
•
EEPD North America
•
EL Technology
EMAC
•
Embedded Designs Plus
•
•
Enseo
esd
•
EuroTecH
Evalue Technology
Continued on page 42
40 / Winter 2005
•
•
•
Reflective
General purpose
Flash
Multifunction
•
Memory
Industrial
Digital
•
FPGA
Analog
I/O
TIM
PCI-104
PC/104-Plus
PC/104
DSP Boards
Other chips & cores
Pentium
Media SoC
Bus interface
Other bridges
Chips & Cores
PCI-to-ISA
PC/104 to PC/104
PC/104 to ISA
Company
Name
PC/104 to DeviceNet
Bridges
FPGA
BOARD LEVEL
BOARD LEVEL
BOARD LEVEL
BOARD LEVEL
•
DSP algorithm
Other module <100cm2
System Boards
Structured ASIC
PCMCIA/PC card
PCMCIA/CardBus
Other
Website
www.abiatech.com
www.accesio.com
www.acromag.com
www.acs-tech80.com
www.adlinktech.com
•
•
www.digitallogic.com
•
www.advantech.com
•
www.ampro.com
•
www.andordesign.com
www.aprotek.com
www.associatedpro.com
www.aquarelasystems.com
•
www.arborsolution.com
www.arcomcontrols.com
•
•
www.aristaipc.com
www.arius.com
www.akspace.com/home.htm
•
www.axiomtek.com
www.bittware.com
www.bluechiptechnology.co.uk
www.ccii.co.za
•
www.centralp.com
www.comarkcorp.com
www.commtech-fastcom.com
www.cyberresearch.com
www.ddc-web.com
www.dataio.com
www.datalight.com
www.dataram.com
www.derivation.com
www.diamondsystems.com
www.douglas.com
www.dense-pac.com
•
www.dspdesign.com
•
www.dspsystems.com
www.eagle.co.za
•
•
www.eepd.com
•
www.eltechnology.com
•
www.emacinc.com
www.embedded-designs-plus.com
•
www.enseo.com
www.esd-electronics.com
•
www.eurotech.it
•
www.evalue-tech.com
Winter 2005 / 41
•
Reflective
Flash
•
General purpose
Multifunction
•
Grid Connect
Memory
Industrial
•
FPGA
Digital
General Standards
Analog
I/O
TIM
PCI-104
PC/104-Plus
PC/104
DSP Boards
Other chips & cores
Pentium
Media SoC
Bus interface
Other bridges
Chips & Cores
PCI-to-ISA
PC/104 to PC/104
PC/104 to ISA
Company
Name
PC/104 to DeviceNet
Bridges
FPGA
BOARD LEVEL
BOARD LEVEL
•
Hectronic
ICOP Technology
•
Intel
•
•
Intelec Technologies
Jacyl
•
•
JS Automation
•
•
Kane Computing
•
Kaxillion
•
Kontron
•
•
Lanner Electronics
•
Lattice Semiconductor Corporation
•
LAVA Computer Manufacturing
•
LSI Logic
Mango DSP
•
•
Measurement Computing
•
•
Mesa Electronics
•
•
•
Micro Industries
•
•
•
Micro Technic
•
Micro/sys
•
Microcomputer Systems
•
•
•
•
MPL
M-Systems
•
Nallatech
Octagon Systems
•
Parvus
•
•
•
•
Phoenix Contact
•
PHYTEC America
•
Rapid Controls
•
Ricoh Electronics, Inc.
Robotrol
•
Rochelle Communications
•
RPA
•
RTD
•
S&K Electronics
•
SBS Technologies
•
•
•
•
•
Sealevel Systems
•
Sheldon Instruments
•
Signalogic
•
•
•
•
•
SSV Software Systems
•
•
Sensoray
Sundance
•
•
SCIDYNE
42 / Winter 2005
•
•
•
•
•
•
•
BOARD LEVEL
BOARD LEVEL
DSP algorithm
System Boards
Structured ASIC
PCMCIA/PC card
PCMCIA/CardBus
Other
Website
www.generalstandards.com
www.synergetic.com
•
www.hectronic.se
•
www.icop.com.tw
•
www.intelec-tech.com
www.intel.com
www.jacyltechnology.com
www.automation.com.tw
www.kanecomputing.com
www.kaxillion.com
•
www.kontron.com
www.lannerinc.com
www.latticesemi.com
www.lavalink.com
•
www.lsilogic.com
www.mangodsp.com
www.measurementcomputing.com
www.mesanet.com
www.microindustries.com
www.micro-technic.com
•
www.embeddedsys.com
www.microcomputersystems.com
•
www.mpl.ch
www.m-sys.com
www.nallatech.com
www.octagonsystems.com
•
www.parvus.com
www.phoenixcontact.com
www.phytec.com
www.rapidcontrols.com
•
www.ricoh.com
www.robotrolcorp.com
www.rochelle.com
www.rpaelectronics.com
•
www.rtdusa.com
www.skecorp.com
www.sbs.com
www.scidyne.com
www.sealevel.com
www.sensoray.com
www.sheldoninst.com
www.signalogic.com
•
www.ssv-embedded.de
•
www.sundance.com
Winter 2005 / 43
•
Technologic
•
Tri-M Systems
VersaLogic
•
•
•
•
•
•
Virtium Technology
•
Vista Electronics
•
VMETRO
•
Vox Technologies
Warp Nine Engineering
•
WDL Systems
•
•
White Electronic Designs
•
WIN Enterprises
WinSystems
Woodhead
•
•
•
•
•
•
Zendex
•
•
ZTEC
•
44 / Winter 2005
Reflective
General purpose
•
Flash
•
Multifunction
Industrial
Technoland
Memory
FPGA
Digital
Analog
I/O
TIM
PCI-104
PC/104-Plus
PC/104
DSP Boards
Other chips & cores
Pentium
Media SoC
Bus interface
Other bridges
Chips & Cores
PCI-to-ISA
PC/104 to PC/104
PC/104 to ISA
Company
Name
PC/104 to DeviceNet
Bridges
FPGA
BOARD LEVEL
BOARD LEVEL
BOARD LEVEL
BOARD LEVEL
DSP algorithm
System Boards
Structured ASIC
PCMCIA/PC card
PCMCIA/CardBus
Other
Website
•
www.technoland.com
www.embeddedARM.com
www.tri-m.com
•
www.versalogic.com
www.virtium.com
www.vistaelectronics.com
www.vmetro.com
•
www.voxtechnologies.com
www.fapo.com
www.wdlsystems.com
www.whiteedc.com
•
•
www.win-ent.com
www.winsystems.com
•
www.woodhead.com
•
www.zendex.com
www.ztec-inc.com
Editor’s Choice
Product
Room for everything:
8-Gbit NAND Flash
It’s in your cell phone, PDA, MP3 player,
and TV remote. And increasingly, it’s
designed into PC/104 and embedded
boards and systems. What is it? It’s
NAND Flash, of course.
It used to be that nonvolatile storage
involved rotating disks, battery-backed
SRAM, expensive E2PROM, or awkward-to-erase UV EPROMs. But high-density
NAND Flash has changed all of that with its cost-effective and increasingly dense
nonvolatile storage capacity. Industry leader Micron Technology is helping to
drive the market for embedded, highest-density NAND Flash ICs. The company
is now shipping 4-Gbit and 8-Gbit devices in 3.3 V flavors and industry-standard
48-pin TSOPs.
The 8-Gbit MT29F8G08FABWP is organized as a 1 Gbit x 8 device, while the
4 Gbit (MT29F4G08BABWP and MT29F4G16BABWP) is available in either 512 Mbit
x 8 or 256 Mbit x 16 versions.
Micron Technology
www.micron.com
RSC #24361
Winter 2005 / 45
Datacom
Company
Name
General
ARCNET
Ethernet
FDDI
General
GPIB/MXI
LAN
Security
Serial controller
USB controller
WAN
WLAN
Embedded Internet
Internet appliances
Modem/Fax modem
Optical
Remote access
Routers/Switches
Servers
Telecom: T1/E1
Turnkey system
Voice: VoIP
Wireless
Wireless: GPS
Wireless: GSM/GPRS
COMMUNICATIONS
COMMUNICATIONS
3J Tech
•
www.3jtech.com
4DSP
•
AAEON Electronics
•
Website
www.4dsp.com
•
www.aaeon.com
ABIA Technology
•
Accelent Systems
www.abiatech.com
•
www.accelent.com
ACCES I/O Products
•
www.accesio.com
ADLINK Technology
•
www.adlinktech.com
•
Advanced Micro Periph.
•
•
•
• •
• •
www.advantech.com
•
Advantech
www.ampltd.com
•
AeroComm
www.aerocomm.com
•
Ampro Computers
•
www.ampro.com
•
Appliance-Lab
Aprotek
• •
Arbor Technology
•
Arista
•
www.app-lab.com
•
www.aprotek.com
•
•
Avocent Corporation
www.aristaipc.com
•
Axiomtek
www.avocent.com
•
www.axiomtek.com
Bihl+Wiedemann
•
C2I2 Systems
• •
•
Comark
•
•
Commtech
Connect Tech
Contemporary Controls
www.bihl-wiedemann.de
•
•
•
www.ccii.co.za
www.comarkcorp.com
•
www.commtech-fastcom.com
•
www.connecttech.com
•
www.ccontrols.com
•
Copeland Communications
CyberResearch
•
•
www.copelandcommunications.com
•
•
Datalight
DataLink Technologies
www.datalight.com
•
www.dltech.net
•
Designtech Engineering
Diamond Systems
•
•
DSP Design
•
•
www.designtechengineering.com
•
www.dspdesign.com
DSS Networks
•
Dynamic Engineering
www.dssnetworks.com
•
EEPD North America
•
EMAC
•
www.dyneng.com
www.eepd.com
•
•
•
• •
•
• •
www.emacinc.com
emBoot
•
www.emboot.com
Emtrion
•
www.emtrion.com
EuroTecH
• •
•
Gallantry
•
ww.gallantry.com
General Standards
•
GoAhead Software
•
Hardent
•
Hectronic
ICOP Technology
46 / Winter 2005
• •
•
www.eurotech.it
www.goahead.com
www.hardent.com
•
www.hectronic.se
•
www.icop.com.tw
COMMUNICATIONS
ARCNET
Ethernet
FDDI
General
GPIB/MXI
LAN
Security
Serial controller
USB controller
WAN
WLAN
Embedded Internet
Internet appliances
Modem/Fax modem
Optical
Remote access
Routers/Switches
Servers
Telecom: T1/E1
Turnkey system
Voice: VoIP
Wireless
Wireless: GPS
Wireless: GSM/GPRS
Company
Name
INES
Interface Masters
General
•
www.inesinc.com
•
www.interfacemasters.com
Kinetic Computer
Kontron
•
•
•
www.kontron.com
•
LiPPERT
www.lannerinc.com
•
www.lippert-at.com
•
Mesa Electronics
•
•
Micro Industries
•
•
Micro Technic
•
www.mesanet.com
•
•
•
•
•
•
•
• •
•
Nematron
Neoware Systems
•
www.embeddedsys.com
•
www.microbee-systems.com
•
www.mpl.ch
•
www.nematron.com
•
www.neoware.com
•
NextCom
Nippon Pulse America Inc.
www.nextcomputing.com
•
www.nipponpulse.com
Octagon Systems
•
• •
Parvus
•
• •
•
•
Pentek
www.parvus.com
•
www.pentek.com
•
Premier Advance
Protech Systems
www.PremierAdvance.com
•
www.Protech.com.tw
•
Radicom Research
RTD
MicroBee Systems
MPL
www.isci3000.com/kin
•
Lanner Electronics
Micro/sys
Website
•
Sealevel Systems
•
•
•
•
www.radi.com
•
•
www.rtdusa.com
www.sealevel.com
Winter 2005 / 47
COMMUNICATIONS
Datacom
Datacom
Company
Name
General
ARCNET
Ethernet
FDDI
General
GPIB/MXI
LAN
Security
Serial controller
USB controller
WAN
WLAN
Embedded Internet
Internet appliances
Modem/Fax modem
Optical
Remote access
Routers/Switches
Servers
Telecom: T1/E1
Turnkey system
Voice: VoIP
Wireless
Wireless: GPS
Wireless: GSM/GPRS
COMMUNICATIONS
COMMUNICATIONS
Sedlbauer
•
SMSC
www.sedlbauer-ag.de
•
www.smsc.com
•
www.ssv-embedded.de
Stealth Computer Corp.
•
www.steinhoff.de
Sundance
•
Team Solutions
www.teampctechnology.com
•
•
www.technoland.com
•
•
Tri-M Systems
www.embeddedARM.com
•
Tyco Electronics
•
VersaLogic
•
•
•
www.versalogic.com
•
Western DataCom
•
• •
• •
•
•
•
•
Xycom
•
•
•
48 / Winter 2005
www.wdlsystems.com
•
•
www.tri-m.com
www.tycoelectronics.com
•
WDL Systems
Zendex
www.sundance.com
•
Technoland
WinSystems
www.stealthcomputer.com
•
Steinhoff Automations
Technologic
Website
www.western-data.com
www.winsystems.com
www.xycom.com
www.zendex.com
Winter 2005 / 49
AAEON Electronics
Absopulse Electronics
•
Advanced Industrial Computer
•
•
Advantech
Amphenol
•
Ampro Computers
•
AMREL
apra-norm
APS
Arbor Technology
Astron
•
Axiomtek
•
Bestan
•
•
C I Systems
•
C&D Technologies
CCII Systems
•
•
Comark
Comm Con Connectors
•
Cooler Master
•
Data Device
Diamond Systems
•
Douglas Electronics
•
•
Dynamic Engineering
•
EEPD North America
ELMA Electronic
EMAC
•
•
EnerSys
Enseo
•
EPT USA
•
ERNI
•
EuroTecH
•
Hapco
•
50 / Winter 2005
•
•
Production tools
ESD management
Board accessories
Battery
Thermal management
System monitoring
Other
Other
PC/104
Hard metric
Connectors
Backplane
Card rack/subrack
Card Rack
Backplane: Other
Backplane
Company
Name
Backplane
PACKAGING
PACKAGING
•
SCSI
SCSI peripheral
Website
SCSI controller
Power-fail module
Power supply
General
Enclosure
Power
PACKAGING
Enclosures
PACKAGING
•
www.aaeon.com
•
www.absopulse.com
•
•
www.aicipc.com
•
www.advantech.com
www.amphenol.com
www.ampro.com
•
www.amrel.com
•
www.advpower.com
www.apra.de
•
•
•
•
www.astron-us.com
www.axiomtek.com
•
www.bestan.com
www.ccii.co.za
www.cd4power.com
•
www.ccii.co.za
www.centralp.com
•
www.comarkcorp.com
www.commcon.com
www.coolermaster.com
www.ddc-web.com
•
•
•
•
www.douglas.com
www.dyneng.com
•
www.eepd.com
•
www.elma.com
•
www.emacinc.com
www.enersys.com
www.enseo.com
www.ept.de
www.erni.com
•
www.eurotech.it
www.hapco.com
Winter 2005 / 51
Production tools
ESD management
Board accessories
Battery
Thermal management
System monitoring
Other
Other
PC/104
Hard metric
Connectors
Backplane
Card rack/subrack
Card Rack
Backplane: Other
Backplane
Company
Name
Backplane
PACKAGING
PACKAGING
Hardent
HARWIN
•
Hirose Electric
•
ICOP Technology
•
Intelligent Instrumentation
•
Keystone Electronic
Kontron
•
•
•
•
Lambda Electronics
LTS
•
Micro Technic
•
Micro/sys
•
Mindready Solutions
•
MMT Machrone
•
MPL
•
M-Systems
Parvus
•
•
•
•
•
•
•
•
Phihong
Polyonics
•
Radian Heatsink
•
RAF Electronic Hardware
RTD
•
•
•
•
Sabritec
•
Samtec
•
Sealevel Systems
•
•
Sensoray
Simon Industries
•
SMA
•
StacoSwitch
•
Steinhoff Automations
Symmetrix
Technologic
•
Teka Interconnection
•
•
Tri-M Systems
•
Tyco Electronics
•
VersaLogic
•
•
Vesta Technology
•
WinSystems
•
Zendex
52 / Winter 2005
•
•
SCSI
SCSI peripheral
Website
SCSI controller
Power-fail module
Power supply
General
Enclosure
Power
PACKAGING
Enclosures
PACKAGING
www.hardent.com
www.harwin.com
www.hirose.com
•
www.icop.com.tw
•
www.instrument.com
www.keyelco.com
•
www.kontron.com
•
www.lambdapower.com
•
www.ltsusa.com
•
•
www.embeddedsys.com
www.mindready.com
www.machrone.com
www.mpl.ch
•
•
•
•
•
www.m-sys.com
•
www.parvus.com
•
www.phihong.com
www.polyonics.com
www.radianheatsinks.com
www.rafhdwe.com
•
•
www.rtdusa.com
•
www.sabritec.com
www.samtec.com
www.sealevel.com
www.sensoray.com
•
www.simonindustries.com
www.SMAcomputers.com
www.stacoswitch.com
www.steinhoff.de
•
•
•
•
www.symtx.com
•
www.embeddedx86.com
www.tekais.com
•
•
•
www.tri-m.com
•
www.tycoelectronics.com
•
•
www.versalogic.com
www.vestatech.com
•
•
•
•
www.winsystems.com
www.zendex.com
Winter 2005 / 53
AAEON Electronics
ABIA Technology
Acrosser Technology
Actis
ADLINK Technology
Advanced Industrial Computer
Advanced Micro Peripherals
Advantech
Amer.com USA
American Predator
Ampro Computers
ANT Computer
Appliance-Lab
Applied Data Systems
Arbor Technology
Arise
Arista
Arraid
Asine
Atio Systems, Inc.
Axiomtek
Bagotronix
Blue Chip
BWI
Comark
COMMELL
CompuLab
Concurrent Technologies
Cybernetic Micro Systems
CyberResearch
Densitron
Diamond Point
Diamond Systems
Diversified Technology
DResearch
DSL
DSP Design
EEPD North America
EL Technology
ELTEC Electronik
EMAC
Embedded Planet
Emtrion
EuroTecH
Evalue Technology
Evoc Technology
Eyecross
Eyring
Fastwel
•
•
•
•
•
PowerQUICC
PowerPC
Pentium MMX
Pentium M
Pentium III
Pentium II
Pentium 4
Pentium
Multiple MPU
MPC5200
Hitachi SH Family
Geode
Ezra
ELAN
Cyrix
Crusoe
Coldfire
Celeron M
Celeron
C3
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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•
•
•
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•
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•
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•
•
•
•
•
54 / Winter 2005
AMD SC520
386SX
80C188EB
PR OCESSORS
Company
Name
Eden
PR OCESSORS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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•
•
•
•
•
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•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Website
Other
•
XScale
STPC-Client
•
x86
STPC-ATLAS
STPC Industrial
STPC Elite
STPC Consumer
Socket 7
Socket 370
SC520
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
PR OCESSORS
RISC
www.aaeon.com
www.abiatech.com
www.acrosser.com
www.actis-computer.com
www.adlinktech.com
www.aicipc.com
www.ampltd.com
www.advantech.com
www.amer.com
www.americanpredator.com
www.ampro.com
www.antcomputer.com
www.app-lab.com
www.applieddata.net
www.arisecomputer.com
www.aristaipc.com
www.arraid.com
www.asinegroup.com
www.atiosys.com
www.axiomtek.com
www.bagotronix.com
www.bluechiptechnology.co.uk
www.bwi.com
www.centralp.com
www.comarkcorp.com
www.commell-sys.com
www.compulab-systems.com
www.gocct.com
www.controlchips.com
www.densitron.com
www.dpie.com
www.dtims.com
www.dreseach.de
www.dsl-ltd.co.uk
www.dspdesign.com
www.eepd.com
www.eltechnology.com
www.eltec.com
www.emacinc.com
www.embeddedplanet.com
www.emtrion.com
www.eurotech.it
www.evalue-tech.com
www.evoc.com
www.eyecross.com
www.eyring.com
www.fastwel.com
Winter 2005 / 55
Gallantry
Gateworks
GE Fanuc Automation
General Micro Systems
GESPAC
Global American
Hectronic
iBase Technology
ICOP Technology
Intelec Technologies
Intelligent Instrumentation
Kontron
Lanner Electronics
LiPPERT Automationstechnik
Matrix Dynamics LLC
Megatel
MEN Micro
Mercury Computer Systems
Mesa Electronics
Micro Computer Specialists
Micro Digital
Micro Industries
Micro/sys
Microbus
MPL
Nagasaki IPC Technology
Nagasaki USA
Nematron
NEXCOM International
Octagon Systems
Parvus
PFU Systems
PHYTEC America
Protech Systems
RTD
SBS Technologies
SECO
Sensoray
SMA
Sundance
Technoland
Technologic
Tern
TME
Tri-M Systems
VersaLogic
WIN Enterprises
WinSystems
Xycom
Zendex
ZF Micro Solutions
56 / Winter 2005
•
PowerQUICC
PowerPC
Pentium MMX
Pentium M
Pentium III
Pentium II
Pentium 4
Pentium
Multiple MPU
MPC5200
Hitachi SH Family
Geode
Ezra
ELAN
Cyrix
Crusoe
Coldfire
Celeron M
Celeron
C3
AMD SC520
386SX
80C188EB
PR OCESSORS
Company
Name
Eden
PR OCESSORS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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•
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•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Website
Other
XScale
x86
STPC-Client
STPC-ATLAS
STPC Industrial
STPC Elite
STPC Consumer
Socket 7
Socket 370
SC520
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
PR OCESSORS
PR OCESSORS
RISC
www.gallantry.com
www.gateworks.com
www.gefanuc.com/embedded
www.gms4vme.com
www.gespac.ch
www.globalamerican.com
www.hectronic.se
www.ibase-i.com.tw
www.icop.com.tw
www.intelec-tech.com
www.instrument.com
www.kontron.com
www.lannerinc.com
www.lippert-at.com
www.matrixdynamics.com
www.megatel.ca
www.menmicro.com
www.mc.com
www.mesanet.com
www.mcsi1.com
www.smxinfo.com
www.embeddedsys.com
www.microbus.com
www.mpl.ch
www.nagasakiipc.com
www.nagasakiusa.com
www.nematron.com
www.nexcom.com
www.parvus.com
www.PFUsystems.com
www.phytec.com
www.Protech.com.tw
www.rtdusa.com
www.sbs.com
www.seco.it
www.sensoray.com
www.SMAcomputers.com
www.sundance.com
www.technoland.com
www.embeddedARM.com
www.tern.com
www.tme-inc.com
www.tri-m.com
www.versalogic.com
www.win-ent.com
www.winsystems.com
www.xycom.com
www.zendex.com
www.zfmicro.com
OpenSystems Publishing
Advertising/Business office:
30233 Jefferson Avenue
St. Clair Shores, MI 48082
Tel: 586-415-6500 ■ Fax: 586-415-4882
Vice President Marketing & Sales
Patrick Hopper
[email protected]
Senior Account Manager
Dennis Doyle
[email protected]
Account Manager
Tom Varcie
[email protected]
Print and Online Marketing Specialist
Christine Long
[email protected]
Advertising/Marketing Coordinator
Andrea Stabile
[email protected]
European Bureau Chief
Stefan Baginski
[email protected]
Account Manager
Doug Cordier
[email protected]
Business Manager
Karen Layman
For reprints call the sales office: 586-415-6500
Winter 2005 / 57
58 / Winter 2005
AIM-USA
•
Andor Design
•
Avalon
Ballard Technology
•
www.andordesign.com
•
www.avalondefense.com
•
www.ballardtech.com
•
www.bmccorp.com
•
www.ccii.co.za
•
www.condoreng.com
•
www.ddc-web.com
•
BMC Communications
•
C I Systems
•
CCII Systems
•
•
www.ccii.co.za
Condor Engineering
•
Data Device
Dynamic Engineering
•
EuroTecH
www.dyneng.com
•
Excalibur Systems
•
•
General Standards
www.mil-1553.com
•
www.focaltech.ns.ca
•
•
www.greatrivertech.com
Heim Data Systems
•
Parvus
SBS Technologies
Silicon Turnkey Express
www.eurotech.it
•
Focal Technologies Corp
SCI Technology
Website
www.aim-online.com
•
Great River Technology
Telemetry
MIL-STD-1553
Avionics
ARINC
Ruggedized
StarFabric
RapidIO
Fibre channel
Company
Name
CARRIER
BOARDS
R
UGGEDIZED
Fabrics
R UGGEDIZED
www.heimdata.com
•
•
www.parvus.com
•
•
www.sbs.com
•
www.sci.com
•
Tech S.A.T.
Western Avionics
www.SiliconTKx.com
•
www.techsat.com
•
www.western-av.com
Winter 2005 / 59
Acmet Embedded Services
Protocol stack
Operating system
Networking
Modeling tool
Linux
Library
Java
Development tool
Compilers
Board support packages
Software
Application
JTAG
Prototyping
& Debugging
Bus analyzer
Tools
System integration serv.
IDE
Company
Name
Platform
Development
Aids
SOFTWARE
SOFTWARE
•
•
ACT/Technico
•
www.advantech.com
•
www.aisysinc.com
aJile Systems
•
Ampro Computers
www.ajile.com
•
www.ampro.com
•
Applied Data Systems
•
•
www.applieddata.net
•
Argon Technology
•
www.argontechnology.com
•
Artisan Software Tools
www.artisansw.com
Ballard Technology
•
www.ballardtech.com
Catalyst Systems
•
www.openmake.com
CMX Systems
•
Comark
•
Concurrent Computer
www.acmet.com
www.acttechnico.com
Advantech
Aisys
Website
www.cmx.com
www.comarkcorp.com
•
www.ccur.com
Connect Tech
•
www.connecttech.com
Curtiss-Wright Embedded
Datalight
•
•
•
•
www.cwcembedded.com
www.datalight.com
Diamond Systems
•
Douglas Electronics
•
www.douglas.com
DSP Design
•
Dynamic Engineering
www.dspdesign.com
•
www.dyneng.com
EBSnet, Inc.
•
Embedded Performance
•
www.episupport.com
Flash Vos
•
FuturePlus Systems
www.flashvos.com
•
www.futureplus.com
General Software
•
Green Hills Software
www.gensw.com
•
•
•
H.A. Technical Solutions
www.ghs.com
•
Hitex Development Tools
www.lakeviewtech.com
•
www.hitex.com
ICOP Technology
•
Ittia
www.icop.com.tw
•
Kontron
www.ittia.com
•
•
LynuxWorks
•
www.kontron.com
•
•
•
•
•
Macraigor
•
www.lynuxworks.com
www.macraigon.com
Metrowerks
•
•
Micro Digital
www.metrowerks.com
www.smxinfo.com
•
Micro/sys
•
MontaVista
National Instruments
ND Tech
•
www.embeddedsys.com
•
www.mvista.com
•
www.ni.com
•
www.nd-tech.com
•
Neoware Systems
Nova Engineering
60 / Winter 2005
www.ebsnetinc.com
•
•
•
www.neoware.com
www.nova-eng.com
•
Website
OnCore Systems
•
Opal-RT Technologies
Protocol stack
Operating system
Networking
Modeling tool
Linux
Library
Java
Development tool
Compilers
Board support packages
Application
JTAG
Bus analyzer
Aids
Tools
System integration serv.
Platform
IDE
Octagon Systems
Software
www.OnCoreSystems.com
•
•
Parvus
•
PLD Applications
www.opal-rt.com
•
www.parvus.com
•
www.plda.com
QNX Software Systems
•
www.qnx.com
RadiSys (Microware)
•
www.radisys.com
Real-Time Innovations
•
www.rti.com
REDSonic
•
www.redsonic.com
RTD
•
www.rtdusa.com
S&K Electronics
•
SCIDYNE
•
www.scidyne.com
Sensoray
•
www.sensoray.com
Silicon Turnkey Express
www.skecorp.com
•
www.SiliconTKx.com
•
www.ssv-embedded.de
SynaptiCAD
•
Technologic
•
www.syncad.com
•
TenAsys Corporation
www.embeddedx86.com
•
Tri-M Systems
•
VersaLogic
•
www.tenasys.com
•
•
www.tri-m.com
•
www.versalogic.com
•
Vibren
www.vibren.com
WDL Systems
•
WIN Enterprises
•
WinSystems
•
www.wdlsystems.com
www.win-ent.com
•
•
www.winsystems.com
•
Xecom, Inc.
www.xecom.com
CARRIER BOARDS
Aprotek
PC/104-Plus
PC/104
IP
ETX
CARRIER BOARDS
Company
Name
•
Website
www.aprotek.com
Axiomtek
•
www.axiomtek.com
Dynamic Engineering
•
www.dyneng.com
EEPD North America
•
www.eepd.com
•
Evalue Technology
SOFTWARE
Prototyping
& Debugging
Development
Company
Name
SOFTWARE
•
www.evalue-tech.com
Precision Communications, Inc.
•
www.precisioncomm.com
Tri-M Systems
•
www.tri-m.com
Winter 2005 / 61
4DSP
ACCES I/O Products
Adapters.com
ADLINK Technology
ADPI
Advantech
Analog Devices
Apex Embedded Systems
Axiomtek
Brandywine Communications
Chase Scientific
Comark
Computer Conversions
Corelis
CyberResearch
Data Device
Dataforth Corporation
Diamond Systems
Eagle Technology
EMAC
Emulation Technology
EuroTecH
Excalibur Systems
Gage Applied Technologies
General Standards
Hardent
ICOP Technology
Instant Instrument
62 / Winter 2005
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Waveform generator
Waveform digitizers/Scopes
Test systems
Signal conditioner
LVDT/RVDT stimulus
Digital-to-synchro
Data acquisition
Counter/Timer
TEST AND ANALYSIS
Company
Name
Synchro-to-Digital
TEST AND ANALYSIS
•
•
•
•
•
•
•
•
Website
www.4dsp.com
www.accesio.com
www.adapters.com
www.adlinktech.com
www.adpi.com
www.advantech.com
www.analog.com
www.apexembedded.net
www.axiomtek.com
www.brandywinecomm.com
www.chase2000.com
www.comarkcorp.com
www.computerconversions.com
www.corelis.com
www.ddc-web.com
www.dataforth.com
www.eagle.co.za
www.emacinc.com
www.emulation.com
www.eurotech.it
www.mil-1553.com
www.gage-applied.com
www.hardent.com
www.icop.com.tw
www.instantinstrument.com
International Test Technologies
Micro Technic
Micro/sys
North Atlantic Industries
Octagon Systems
OPTEK Technology
Parvus
Quanser Consulting
RTD
Sundance
Symmetric Research
Symmetricom Inc.
Tri-M Systems
VersaLogic
WinSystems
ZTEC
Waveform generator
Waveform digitizers/Scopes
Test systems
Synchro-to-Digital
Signal conditioner
LVDT/RVDT stimulus
Digital-to-synchro
Data acquisition
TEST AND ANALYSIS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Website
www.intertesttech.com
www.embeddedsys.com
www.naii.com
www.optekinc.com
www.parvus.com
www.quanser.com
www.rtdusa.com
www.sundance.com
www.symres.com
www.symmetricom.com
www.tri-m.com
www.versalogic.com
www.winsystems.com
www.ztec-inc.com
Winter 2005 / 63
TEST AND ANALYSIS
Company
Name
Counter/Timer
64 / Winter 2005
Winter 2005 / 65
Insight
EPIC Express paves
“bridge to the future”
Where has the year gone? As 2005 winds
to a close, the embedded board market
continues to evolve with new technology and products, and PC/104 Embedded
Solutions continues to evolve with it
(more on that later). Of note: The demand
for standardized modules has never been
hotter as designers search for ways to
get to market quicker while avoiding the
drudgery and expense of designing an
entire system from scratch. Standardized
embedded form factors such as PC/104,
PC/104-Plus, PCI-104, and EBX are
among the most common types designed
into low- to medium-volume systems
where small size, desktop PC compatibility, and a robust vendor ecosystem are the
primary design criteria.
At huge volumes, systems like automobile telematics, cell phones, PDAs, or
iPods use proprietary, custom hardware
designs. And at the low end, onesy-twosy
prototype systems often just use PCs. The
PC/104 family fits perfectly in the middle
with its PC functionality, “rich” software
portfolio (to use Microsoft’s terminology), and inherent ruggedness that works
beautifully in harsh and low-maintenance
applications like military or industrial
control.
But still the market needs more, so
alternative form factors like the PC/104
Consortium’s EPIC standard have achieved
success. At 115 mm x 165 mm (4.528"
x 6.496"), EPIC is slightly larger than
PC/104’s size of 95.89 mm x 90.17 mm
(3.775" x 3.550"). EPIC is intentionally
designed with space for higher-power processors that can be conductively cooled
and have additional I/O connections and
the ability to stack legacy PC/104 I/O or
processor modules on top.
Vendors including Ampro, VersaLogic,
Octagon, WinSystems, Micro/sys, and
others all make COTS box-level systems
66 / Winter 2005
based upon EPIC that are intended to
make designers’ jobs even easier. EPIC
accommodates all standard PC/104 I/O
modules, so existing custom interface
hardware that drives LCDs, interfaces to
ball screw assemblies, or controls thermal
ovens can plug right into an EPIC-based
system.
But the PC desktop market is moving beyond PC/104, first by replacing ISA with
PCI, and now by moving to PCI Express,
a serial fabric that offers orders of magnitude more data movement potential
than the PCIbus. This same “gang of five”
that created EPIC recently extended the
spec to EPIC Express, bringing – you
guessed it – PCI Express capability to
EPIC. Not since the PC/104 spec was first
ratified in 1992 has so much potential
been included in a single proposed board
standard.
EPIC Express retains the stackability
of PC/104 by replacing PCI with highspeed PCI Express connectors ready for
a four-card stack and x1 or x4 lanes. A
2.5 Gbps x1 lane is about 4x the speed
of current PC/104 boards, while a x4
lane is about 16x. At these speeds, highend graphics controllers can be mounted
on “PC/104 Express” modules (for now
called an EPIC Express Module in the
specification at www.epic-express.org),
along with other high-end data capture,
signal processing, or A/D and D/A converters. In short: The EPIC Express CPU
basecard and “PC/104 Express” modules
perfectly meet the needs of high-performance, contemporary small- to mediumvolume applications. And because they’re
so small, inherently rugged, and flexible,
EPIC Express systems have a real potential to steal market share from other standards like 6U VME or 3U CompactPCI.
The EPIC Express creators – Ampro,
Micro/sys, Octagon, WinSystems, and
By Chris A. Ciufo
[email protected]
VersaLogic – will undoubtedly offer
their 0.8 revision spec to the PC/104
Consortium in time for the annual strategic planning session in Q12006. The
Consortium would look closely at how
EPIC Express addresses the past and the
future, as well as how it relates to the existing EPIC specification. Since PC/104 has
been successful for so long partly because
of its stability, the EPIC Express gang of
five even built in support for legacy ISAbased PC/104 boards.
This means that if the Consortium were
to endorse EPIC Express, the existing
vendor community’s literally thousands
of PC/104 modules could be carried forward, protecting the legacy investments of
vendors and customers alike. And looking
to the future, besides the obvious support
for PCI Express, there is no mechanical
reason at all that an EPIC Express module
couldn’t be modified to include the popular PMC (PCIbus) or XMC (serial fabric) mezzanine modules used with VME
and CompactPCI. In this case, not only
would EPIC Express use its own “PC/104
Express” mezzanine modules, it could use
those from other markets and standards as
well. What a concept.
I believe the existing EPIC specification
and the newer EPIC Express specification represent the future of the PC/104
Consortium – without breaking the fundamental heritage of PC/104. These specs
are a bridge to the future that’s increasingly based upon small form factors like
PC/104 and others. At PC/104 Embedded
Solutions, we’ve watched this small form
factor trend evolve for several years now.
Accordingly, we’re changing our name in
2006 to PC/104 and Small Form Factors
to expand our coverage and bring you
timely technical information about new
small form factor products and standards.
As always, PC/104 remains our core mission and technology.

PC/104 Embedded Solutions - Winter 2005

Transcription

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