Barbara Sulignano

S3 : Super Separator Spectrometer
Physics Cases
Proton
ProtonDripline:
Dripline:
Heavy
Heavyand
andSuperheavy
Superheavynuclei
nuclei
Single
Singleparticle
particlestructure
structure
Development
Developmentofofcollectivity
collectivity
Ground
Groundstate
stateproperties
properties
Fusion evaporation reaction:
58Ni + 46Ti 100Sn + 4n
N=Z
N=Znuclei
nuclei
Test
Testofofshell
shellmodel
model
Shape
Shapecoexistence
coexistence
on
t
o
Pr
lin
p
i
dr
e
Synthesis
Synthesis
Spectroscopy
Spectroscopyand
andstructure
structure
Ground
state
properties
Ground state properties
Chemistry
Chemistry
Uranium Fusion evaporation reaction:
48Ca + 248Cm 292116 + 4n
But
Butalso……
also……
Neutron
Neutronreach
reachnuclei
nuclei
Single
Singleparticle
particle structure
structure
Quenching
Quenching ofofshell
shellgaps
gaps
Ground
Groundstate
stateproperties
properties
Transfer & Deep inelastic
Reactions
12C(13C,2p)11Be
82Se(64Ni,X)78Ni and around
Summary of Technical Challenges
High Beam intensity
High power target : 10pµA ( = 6.1014pps) or more
Rejection of the beam : >1013
Low Energy (fusion-evaporation residues)
Large angular acceptance : +/- 60 mrad X and Y
Large Charge state acceptance : Bρ acceptance: +/- 10%
Many reaction channels (evaporation channels)
M/q selection : 1/350 resolution
Identification when possible
Transfer/Deep inelastic Reactions (non 0°)
Beam Sweeper for incident beam at 10°
Specific Target chamber and beam dump
How do we fulfil them?
S3 Spectrometer
Groups of 4 (or 3) Multipoles (warm or SC)
(combined quadrupole and sextupole)
Magnetic dipole
Target
Low energy Branch
Heavy ion beams
from LINAG
from C to U
2 to 14 MeV/u
up to 1015ions/sec
up to 50kW
Intermidiate FP
Mass
Spectrometer
Momentum
achromat
Electric dipole
Detection
Large
Largeangular
angularacceptance
acceptance: :+/+/-60
60mrad
mradXXand
andYY
Large
LargeCharge
Chargestate
stateacceptance
acceptance: :Bρ
Bρacceptance:
acceptance:+/+/-10%
10%
M/q
M/qselection
selection: :1/350
1/350resolution
resolution
13
Rejection
Rejectionof
ofthe
thebeam
beam: :>10
>1013
Optical characteristics
Detection plane
dM/M ~1/350
10%
First bend
TraceWin - CEA/DSM/IRFU/SACM
50
y (mm)
Q=24+
M=99,100,101
45
40
) 35
%30
(
se
ss 25
oL 20
20%
Suppressors
15
10
5
0
2
4
6
Position ( m )
8
10
12
x (mm)
All order transmission
~ 52% for 58Ni+46Ti100Sn
~ 57% for 48Ca+248Cm292116
Argonne National Laboratory
CEA Saclay Irfu
Detection system for delayed spectroscopy
Germanium detector
e.x. Exogam2
Σ ~ 900 channels
Number of channels = 32
Counting rate = 1kHz/core
2.3 keV @ 1.3 MeV
Energy, Time Stamp, PSA
Sampling 100 MHz, 14 bits
Triggerless
Time of flight + tracking detector
Number of channels = 200
Counting rate
= 1kHz/channel
Time Resolution
= 300 ps
Position resolution = 1mm
Tunnel detector for escaped
e- and α
Number of channels = 40
•High gain pour α
•Low gain pour HI
Implantation detector
(HI, α and e- decay)
Number of channels ~300 - 650
Counting rate < 1kHz/channel
20 keV@ 5 MeV α
5-10 MeV Heavy ions
2 gains
High gain for α
low gain for HI
No Dead time
Energy, Time Stamp, PSA
Sampling 100 MHz 14 bits
Existing detectors:
Best Box for Electron Spectroscopy after Tagging
– DSSD for implantation + Alpha decay
– Tunnel for electrons + escaped alphas
– Exogam Ge clovers
Double side stripped detector
• 48x48 strips
• 5x5 cm
• Cooled to -15°
• Resolution ~ 35 keV
TUNNEL
• 4-fold segmented Si
• 1 mm thick
• α veto; resolution < 20 keV (hot)
• Electron spectroscopy :
• resolution 7-8 keV (cold)
MUSETT (Mur de Silicium pour l’Etude des Transfermiums par Tagging)
Si
Si det:
det:
2
•Si
•SiWall
Wall: :40x10
40x10cm
cm2
FRONT
FRONT END
END ELECTRONICS:
ELECTRONICS:
ASIC
ASICelectronics
electronics: :ATHED
ATHED(based
(basedon
onMUST2)
MUST2)
16
channels
preamps
(E,T)+TAC,
16 channels preamps (E,T)+TAC,
multiplexed
multiplexedreadout
readout
Total
Dead
Time
Total Dead Timeofofthe
theelectronic
electronicchain
chain
isis30
µs
30 µs
Cofee
front-end
Cofee front-endelectronics
electronics
I2C
I2Cslow
slowcontrol
control
threshold
thresholdvalue,
value,channel
channelenable,
enable,
channel
test,
shaping
time,
readout
channel test, shaping time, readoutmode
mode
Mufee-like
Mufee-like“Cofee”
“Cofee”mother
motherboards
boards(IPNO)
(IPNO)
MUVI
MUVIVXI
VXIreadout
readout&&slow-control
slow-control(GANIL)
(GANIL)
10 cm
Window-less
Window-lessSiSidetectors
detectors
–No
Al
window,
B
–No Al window,2 Bimplantation
implantation0.25
0.25µm
µm
–Size
10x10
cm
2
–Size 10x10 cm
–128+128
–128+128strips
strips(step
(step0.7
0.7mm)
mm)
-Time
resolution
~
1
ns
-Time resolution ~ 1 ns
-Energy
-Energyresolution
resolution30
30keV
keVfor
forααparticle
particle@5
@5MeV
MeV
–Design
based
on
MUST
II
–Design based on MUST II
10 c m
Front End Electronique
Trigger-Less System. No dead time.
Digital electronics and time stamping are needed; Time resolution 10 ns (100 MHz);
Discrimination e- - alpha - ions
Events will be correlated by the time stamp information over a month which means a large
dynamic for the time stamping system. Decay tagging over days
The basic requirement is a common electronic architecture for all type of detectors (Si, Ge,
Beam Tracker and ionization chamber).
Time Synchronisation between the different detectors. (EXOGAM2,PARIS, AGATA,
GASPARD,FAZIA)
Which electronics for the digitizer ? Commercial ?GRETINA Like ? AIDA ? TIGRESS
like ? EXOGAM2 like ? New ?
Detection ::
Detection
Heavyelement(1
element(1GeV);
GeV);ααdecay
decay(<20MeV)
(<20MeV)
Heavy
Timeand
andspace
spacecorrelation
correlation
Time
E.X of developpment at SACLAY
MUSETT
10 cm
••
••
••
••
••
••
••
••
DoubleSide
SideMicrostrip
MicrostripDetector
Detector
Double
1024strips
strips(steps:0.7
(steps:0.7mm)
mm)
1024
Windowless
Windowless
Smalldead
deadtime:
time:max
max50µs
50µs
Small
implantationjunction
junctionside:
side:0.25
0.25µm
µm
BBimplantation
Spaceresolution
resolution1mm
1mm22
Space
Energyresolution
resolution~~30
30keV
keVfor
forαα
Energy
Timeresoluution
resoluution~~11ns
ns
Time
10 c m
ASIC ATHED (Asic for Time & High Energy Deposit)
•
4 Energy ranges:
•
•
•
16 channels (Energy + Time)
Total Dead Time of the electronic chain is 30 µs
Slow Control via bus I2C allows: threshold value,
± 10 MeV, ± 45 MeV(Alpha)
± 225 MeV
(Heavy ion and beam)
± 1GeV
(Fragmentation, HE beam)
channel enable, channel test, shaping time, readout mode
•
•
Multiplex output : analogue differential bus 2 MHz
Energy resolution : 16 keV for Cdet = 65 pF
The ASIC does not satisfied the high
counting rate and energy resolution
Today
Today
CAEN SY 2527
Electronics for one MUSETT detector
Analogue
Bus
4
COFEE (x4)
LV
MUVI or CVM (x4)
Readout
ATHED
Trigger
Slow Control
HV
I2C
64
128 + 128
strips
Slow Control
Slow Control
Silicium
Cooling LAUDA
Proline RP 845 C
•
•
•
•
•
•
•
0.8 µm BiCMOS AMS 6×6mm2
16 channels (Energy + Time)
Dynamics : +/-10MeV; +/-45MeV; +/-225MeV; +/-1GeV
Shaping : 1 or 3 µs
Energy resolution : 16 keV for Cdet = 65 pF
Multiplex output : analogue differential bus 2 MHz
Slow Control: serial I2C; DAC, channel enable, channel test, shaping time,
readout mode, …
Hold
16Channels
Channels
16
Idet1
Energy
Energy
Energy
Energy
E1
Idet16
ATHED
ATHED
E16
V.I.C
Analogue
Data
C.S.A
C.S.A
In
Time
Time
Time
Time
T1
start16
start1
Stop
OR
OR start
start
Slow
Slow Control
Control
DAC
DAC Discri
Discri thresh
thresh
Test
T16
Start
Reset
Request
I2C
Front-end electronics : COFEE (IPNO design)
• COulex Front-End Electronics
• Based on MUST II MUFEE
•
•
•
•
•
4 ASICs / board
1 analogue bus / ASIC
Size 12 x 5 cm2
Slow control : I2C
Provides HV to detectors (daughter boards)
CVM VME card (Saclay design)
•
•
•
•
•
•
•
Multipurpose card for ASICs readout
4 analogue bus input = 4 ASICs with COFEE = 64 channels
USB slow control through STUC probe (Cypress micro controller, Virtex II
FPGA).
VME or USB readout
Possibility to correlate VME cards (front panel trigger signals and clock).
14 bits ADCs
48 bits timestamp (100 MHz)
Status:
• Two prototypes tested
• VME readout in progress
• Waiting for Cofee front-end electronics before production.
MUVI (Ganil design)
• MUST VXI
• 4x4 analogue bus input.
– For 4 Cofee cards (16 ASICs) = 128 strips = 1 MUSETT detector (for 4
MUST II detectors since 1 bus/Mufee)
• CAS mezzanine converter
• Free running mode : all bus running independently and trigger-less
• Time stamp with ATOM / GAMER / CENTRUM cards (48 bits, 10 ns
resolution).
• Full integration into the GANIL DAQ – DAS GUI
MUVI
CAS
ATOM
m
Co
e
pl
ly
te
t
no
ed
er
t
s
gi
re
Beam optics
58
46
100
Ni + Ti →
Sn + 4n
Charge state distribution
30
25
100Sn
%
20
58Ni
(beam)
15
10
5
0
0.4
0.6
0.8
1.0
Beam dump in dipole & Qpoles
Beam suppressors in the dispersive plane
(not for asymmetric reactions)
Bro (T.m)
Momentum
Achromat
x (m)
Simulations CEA Saclay – Irfu Jacques Payet Didier Uriot
s (m)
Beam Dump configurations
Beam stopped in
extended chamber
Vacuum chamber
Lateral
Beam
stop
Side view
Optics Simulations :first and second order optimization
0
Mass
spectrometer
5
Momentum
spectrometer
10
√βx
ED
15
0
5
10
15
20
25
30
35
√βy
Dx
s (m)
101Sn
24+ trajectory
Horizontal
•L=27.905 m
•24 multipoles (QP+SX), l=0.4 m, Ø= 0.3 m
Vertical
•2 magnetic bend, l=1 m, θ=27°, B=0.94 T
•1 electrostatic bend, l=1.3 m, θ=21.27°, E=2.1 MV/m
•1 magnetic bend, l=1.3 m, θ=37.75°, B=1.02 T
•Mass separation 5.5mm / %
100Sn
24+ beam envelope
Optics Simulations : All order raytracing
58Ni
+ 46Ti → 104Sn* → 100Sn + 4n
y (mm)
x (mm)
Detection plane
dM/M ~1/350
Realistic magnet field maps
(achromat momentum only)
Argonne National Laboratory
CEA Saclay Irfu