Material Certification

— APPROVED SHEET —
SERIES : SC014
TITLE :
SMART CARD CONNECTOR
Content
1
2
3
4
5
6
7
Customer Drawing
Packing List
Material Certification
Plating Certification
SGS Report
Product Specification
Test Report
APPROVER
CHECKER
WRITER
張坤煌
任文進
詹宜芳
Date : 11/10/06’
Rev : C
-- Packing List -<< Smart Card Package Tray >>
Pos.
PCS/Tray
PCS/Carton
N.W./C
G.W./C
8PIN
20
500
9.9kg
12.15kg
-- Material Certification -[Housing] – 1/4
-- Material Certification -[Housing] – 2/4
-- Material Certification -[Housing] – 3/4
-- Material Certification -[Housing] - 4/4
-- Material Certification -[Contact]
-- Material Certification -[Switch]
-- Plating Certification -[Contact]
-- Plating Certification -[Switch]
-- Plating Certification -[Switch]
-- Material SGS Test Report -[ Housing ] - 1/3
-- Material SGS Test Report -[ Housing ] – 2/3
-- Material SGS Test Report -[ Housing ] – 3/3
-- Material SGS Test Report -[ Contact ] - 1/4
-- Material SGS Test Report -[ Contact ] – 2/4
-- Material SGS Test Report -[ Contact ] – 3/4
-- Material SGS Test Report -[ Contact ] – 4/4
-- Material SGS Test Report -[ Plating ] – 1/2
-- Material SGS Test Report -[ Plating ] – 2/2
-- Product Specification -1. Scope
This specification covers the performances, tests and quality requirements of a Smart Card
Connector.
2. Ratings
Item
Rated Voltage
Rated Current
3. Performance
3-1 Electrical
Item
3-1-1
Contact
Resistance
3-1-2
Insulation
Resistance
3-1-3
Dielectrical
withstanding
voltage
Standard
50 VDC max.
1 A max.
Test Condition
Mated connector with dry circuit of
20mV, 100mA max.
100 mΩ max.
Unmated connector with 500 VDC
between adjacent contacts.
1000 MΩ min.
Unmated connector with 1000 VAC
between adjacent contacts.
No breakdown.
3-2 Mechanical
Item
Test Condition
Mate Smart card with connector at rate
3-2-1 Card mating force of 25±3 mm/min.
3-2-2
3-2-3
Card unmating
force
Durability
Unmate Smart card from connector at
rate of 25±3 mm/min.
Mate and unmate samples for 30,000
cycles.
Smart card to be replaced by a new one
every 5,000 cycles. Maximum rate 10
cycles/minute. Insertion speed 80mm/s
max. Rest Between cycles : 0.5 s
unmated
Requirement
Requirement
10N(1.02kgf) max.
1.5N(0.15kgf) min.
After 30,000 cycles :
No defect that would
Impair normal operation
*contact resistance
100 mΩ max.
.
-- Product Specification -3-3 Environmental
Item
3-3-1
Temperature
Cycling
3-3-2
Temperature
Life
3-3-3
3-3-4
Solder-ability
Resistance to
soldering Heat
Test Condition
Subject mated sampled to 5 cycle
between -40°C to +85°C
No physical damage
Subject mated sampled to temperature
life at +85°C for 1000 Hours
No physical damage
Immersion in the soldering bath at
1.5mm from bottom of housing.
Soldering Time : 3±0.5 sec.
Soldering Temperature : 235±5°C
Immersion in the soldering bath at
1.5mm from bottom of housing.
Soldering Time : 5±0.5 sec.
Soldering Temperature : 260±5°C
Requirement
90% of immersed area
must show no voids,
pin holes.
No Damage
-- TEST REPORT -Commodity :
Smart Card
Testing Item :
1. Contact Resistance
2. Insulation Resistance
3. Dielectric Withstanding Voltage
4. Card Mating Force
5. Card Unmating Force
6. Durability
7. Temperature cycling
8. Temperature Life
9. Solder-ability
10. Resistance to Soldering Heat
< Test Equipment >
Equipment
Model
High Resistance Meter
HP-4339B
Digital Micro-Ohmmeter
Valhalla Scientific-4300B
Breakdown Tester
GPD-515AD
Force Measurement Machine
順瀅 1220
Solder-ability Tester
TABAI-120073
<ITEM 1> Contact Resistance
[ Test Method ]
1) Subject mated contact with Test Card.
2) Open circuit voltage : Less than AC 20mV
3) Test current : Less than 100mA.
[ Requirements ]
100 MΩ max.
[ Result ]
Unit : mΩ
Test Point
Sample 1
Sample 2
1
2
3
4
Max.
Min.
38.5
36.4
35.5
36.3
43.4
39.2
36.9
38.1
43.4
35.5
[ Comment ]
Passed
<ITEM 2> Insulation Resistance
[ Test Method ]
1) Test between one contact and others.
2) Test voltage : 500VDC
3) Duration : 1min.
[ Requirements ]
1000 MΩ min.
[ Result ]
Unit : 106MΩ
Test Point
Sample 1
Sample 2
1#-2#
3#-4#
5#-6#
7#-8#
Max.
Min.
3.5
4.0
2.4
2.8
2.3
3.1
2.2
3.8
[ Comment ]
Passed
4.0
2.3
<ITEM 3> Dielectric Withstanding Voltage
[ Test Method ]
1) Test between one contact and the others.
2) Test voltage : 1000 VAC
.
[ Requirements ]
No breakdown.
[ Result ]
Data contacts
Test Point
Sample 1
Sample 2
1#-2#
3#-4#
5#-6#
7#-8#
Normal
Normal
Normal
Normal
Normal
Normal
Normal
Normal
[ Comment ]
Passed
<ITEM 4> Card Mating Force
[ Test Method ]
1) Measure force necessary to mate card into sample .
2) Speed : 25±3 mm/minute
[ Requirements ]
10N(1.02kgf) max.
[ Result ]
Test Item
Force
Max.
Min.
Avg.
[ Comment ]
Passed
Sample
1
0.30
Sample
2
0.25
Sample
3
0.28
0.30
0.25
0.276
Unit : kgf
Sample Sample
4
5
0.30
0.25
<ITEM 5> Card Unmating Force
[ Test Method ]
1) Measure force necessary to unmate card into sample.
2) Speed : 25±3 mm/minutes.
[ Requirements ]
1.5N(0.15kgf) min.
[ Result ]
Test Item
Force
Max.
Min.
Avg.
Sample
1
0.38
Sample
2
0.35
Sample
3
0.31
0.39
0.33
0.35
Sample
4
0.39
Unit :kgf
Sample
5
0.33
[ Comment ]
Passed
<ITEM 6> Durability
[ Test Method ]
1) Mate and unmate samples for 30,000 cycles.
2) Smart card to be replaced by a new one every 5,000 cycles.
3) Maximum rate 10 cycles/minute.
4) Insertion speed 80mm/s max.
5) Rest between cycles : 0.5sec. unmated.
[ Requirements ]
Afetr 30,000 cycles :
1) No defect that would impair normal operation.
2) Contact resistance: 100 mΩ max.
[ Result ]
Contact resistance
Unit : mΩ
Test point
Sample 1
Sample 2
1
2
3
4
44.3
46.5
52.9
62.3
45.7
47.8
66.0
58.7
[ Comment ]
Passed
<ITEM 7> Temperature Cycling
[ Test Method ]
Subject mated sampled to 5 cycles between -40°C to +85°C
[ Requirements ]
No physical damage.
[ Result ]
Test
Result
Sample 1
Sample 2
Normal
Normal
[ Comment ]
Passed
<ITEM 8> Temperature Life
[ Test Method ]
Subject mated sampled to temperature life at +85°C for 1,000 hours.
[ Requirements ]
No physical damage.
[ Result ]
Test
Result
[ Comment ]
Passed
Sample 1
Sample 2
Normal
Normal
<ITEM 9> Solder-ability
[ Test Method ]
1) Immersion in the soldering bath st 1.5mm from bottom of housing.
2) Soldering Time : 3 ± 0.5 sec.
3) Soldering Temperature : 235 ± 5 °C
[ Requirements ]
90% of immersed area muse show no voids, pin holes.
[ Result ]
Test Item
Sample 1
Sample 2
Immersed area
Appearance
Over 90%
Normal
Over 90%
Normal
[ Comment ]
Passed
<ITEM 10> Resistance to soldering Heat
[ Test Method ]
1) Immersion in the soldering bath st 1.5mm from bottom of housing.
2) Soldering Time : 5 ± 0.5 sec.
3) Soldering Temperature : 260 ± 5 °C
[ Requirements ]
No damage.
[ Result ]
Test
Result
[ Comment ]
Passed
Sample 1
Sample 2
Normal
Normal