KLA Tencor EV300 Defect Review SEM

eV300
D e f e c t R e v i e w To o l ( D R T )
DEFECT CONTROL
T H E e V 3 0 0 I S A N A D VA N C E D , fully automated Scanning Electron Microscope (SEM) designed specifically for high-volume review
and analysis in a manufacturing environment. Integrated automatic defect classification (ADC) capabilities, flexible tilt/rotation, voltage
contrast review, high aspect ratio interconnect (HARI) imaging, and landing energy up to 19 keV (which enables unambiguous material
identification) make it ideal for both in-line monitoring and engineering analysis applications for 0.13 micron and smaller design rules.
The eV300 reviews, classifies, and provides elemental data for defects captured by KLA-Tencor's comprehensive suite of unpatterned
and patterned wafer inspection systems. Integration with Klarity Defect, KLA-Tencor's automated analysis and defect data management
system, provides capabilities for further analysis, defect control, and excursion monitoring. The eV300 delivers a four-fold increase in
productivity compared to manual SEM review systems, and can be configured to handle 150 mm, 200 mm, or 300 mm wafers.
PRODUCT DESCRIPTION
IMPACT SEM ADC Enables more rapid, consistent and
Elemental Analysis Unique 19-keV landing energy enables
accurate sourcing of yield-limiting defects that affect device
unambiguous elemental analysis of copper-related defects.
performance and reliability.
It also allows differentiation of the peak overlaps of
SmartGallery™ for Power Assisted Classification and ADC
Recipe Setup An intuitive graphical user interface that
tungsten silicide and titanium nitride layers quickly and
accurately.
facilitates scheme creation, sorts defects by attributes,
I N T E G R AT E D I N S P E C T I O N , R E V I E W A N D A N A LY S I S
enables high-speed manual defect classification, allows
Detecting defects is only the first part of managing
real-time confidence-level adjustment and displays multiple
defectivity. A critical requirement is the ability to identify
defect images simultaneously for faster and more reliable
the source of the defects quickly so the problem with the
classification.
process or equipment can be resolved with minimum yield
Voltage Contrast/HAR Defect Review Imaging capability
enables rapid review and classification of defects detected
using voltage-contrast capabilities of the e-beam inspector.
Extraction field capability enables collection of low-energy
secondary electrons for superior imaging at the bottom of
HAR contact holes.
TruePerspective™ Features a flexible 0-45 degree tilt and
360-degree continuous rotation, enabling exceptional
accuracy in analyzing and classifying defects by allowing
selection of the optimum orientation for defect review.
impact. This necessitates efficient and effective defect classification and data analysis—seamlessly integrated as part
of an overall solution for defect reduction and control. KLATencor provides the most comprehensive range of defect
reduction and control technology available.
This includes brightfield and darkfield optical inspection
systems for patterned and unpatterned wafers (2XXX, AIT
III, SP1); an optical inspection system designed to detect
macro defects for after-develop inspection (2401); the
industry's first e-beam wafer inspection system designed
for full-scale production (eS20XP); a UV reticle inspection
Automated Bare Wafer Review Automatically reviews bare
system that simultaneously uses transmitted and reflected
wafers by taking advantage of the coordinate-generation
light to ensure capture of all defect types (TeraStar); a
knowledge of KLA-Tencor's unpatterned wafer inspector
comprehensive set of automated defect review and classifi-
(SP1) and intelligently selecting defects for alignment.
cation systems (including the eV300); and a data analysis
Additionally, the eV300 is able to map the defect-coordi-
system that manages and integrates the wealth of defect
nate system of individual inspection tools, thus improving
data and images from these and other tools, and provides
overall defect-coordinate accuracy.
powerful analysis for yield optimization and acceleration.
D e f e c t R e v i e w To o l ( D R T )
eV300
BENEFITS
A P P L I C AT I O N S
Rapid review and classification of
" Lithography
voltage contrast and high aspect ratio
Reviews and analyzes inspection
(HAR) defects.
data on process layers such as
Superior defect classification, analysis
accuracy; ease of recipe setup for
Automatic Defect Classification (ADC)
resists and dual damascene copper.
Can resolve device structure differ-
Unambiguous elemental analysis
ences of 4 nm at 600 eV, providing
of copper-related defects by using
excellent imaging at extremely
landing energy up to 19 keV.
low voltage conditions. Analyzes
Accelerated yield binning rates and
defect types such as incomplete
baseline yield improvement.
removal of backside antireflective
coating (BARC) material. Excellent
Fully flexible tilt and rotation
resolution of High Aspect Ratio
capability.
Interconnect (HARI) structures.
Four-fold increase in productivity
" Copper CMP
compared with manual SEM review
Provides unsurpassed elemental
systems.
eV300 enables rapid imaging, review, and classification of high aspect ratio (HAR) defects and other killer
defects
dielectrics, deep ultraviolet (DUV)
" Etch
and ADL.
True Perspective™ feature enables exceptional accuracy
in analyzing and classifying defects and allows viewing
from many angles.
silicon on insulators and low-k
analysis of copper-related defects
Wide dynamic range of landing
and allows differentiation of the
energy (200 eV to 19 keV) for high
peak overlaps of tungsten silicide
image quality on all layers (up to
and titanium nitride layers quickly
4 nm resolution).
and accurately.
Dramatically reduced cost of
ownership (CoO) over manual review.
Automatically reviews bare wafers
using AutoEDX.
Synergy with optical and e-beam
inspection systems for comprehensive
With Power Assisted Classification using SmartGallery,
you get fast, easy manual classification and simultaneous ADC classifier creation in addition to eV300
image-review capability and Klarity data analysis.
defect reduction and control.
K L A - T E N C O R : A C C E L E R AT I N G Y I E L D
KLA-TENCOR SERVICE/SUPPORT
KLA-Tencor's portfolio of solutions includes the industry's
Customer service and support are an integral part of
broadest line of advanced inspection and metrology systems,
KLA-Tencor's yield optimization solution. Our vast customer
which enables customers to gather all of the yield-critical
support organization services our worldwide installed base and
defect and metrology data. It also includes the sophisticated
is responsible for customer support following the shipment of
software needed to turn that data into quick corrective action.
equipment and software. Services include system installation,
Finally, it includes the expertise needed to help customers rap-
secure on-line monitoring, on-site repair, telephone support,
idly understand and resolve complex manufacturing problems
relocation services, and selected post-sales applications.
so they can reap the financial and market rewards associated
with faster time to market and increased product yields.
© 2001 KLA-Tencor Corporation. All brands or product names may be trademarks of their respective
Printed in the U.S.A.
companies. KLA-Tencor reserves the right to change the hardware and/or software specifications without notice.
K L A - T E N C O R C O R P O R AT I O N
W W W. K L A - T E N C O R . C O M
160 RIO ROBLES
SAN JOSE, CA 95134
AM-DR-01-01
PHONE 408.875.3000
FAX 408.875.4144