US $7.5, €5
50 Singapore
RNI No. DELENG/2012/45770, Mailed on 27-28th of Advance Month
Delhi Postal Reg. No. DL(E)20/5424/2013-2015
Vol : 5, Issue 1, January 2016, Monthly | Pages - 68
Spotlight on Indian
ELE Times to Launch
s you are aware that New Delhi Print Media is launching “Spotlight on Indian Electronics”, that
gives a holistic picture of Indian Electronics in India. The book would carry the comprehensive
information on policies, products, and the brands in India. It would be a primary source of
information on Indian Electronics to Indians and the rest of the world. The book is an attempt to
extend the help to all of them who would want to know anything about electronics industry.
The year book 2016 would be launched at Elecrama 2016 in Bangalore. The Guide Book will get
distributed throughout the year to Industry Professionals, Government Sectors, Trade Fairs,
Embassies, Associations and consultants in India and overseas.
World's First
TV Channel
on Electronics
Time: 10.30 to 18.30 Hours IST
Days: Mon to Fri
Broadcast: World-Wide
URL: eletimes.tv
Compatible with-
LED Lights
are straight forward
inspiration of
green lighting
Make in India
Inoday offers wide range of
LED Lighting Solutions.
Made in India
Downlights (3W to 24W)
LED Bulbs (3W to 9W)
Tubelights (18W & 20W)
Industrial Lights
Street Lights (10W to 70W)
Drivers (1W to 70W)
Flood Light (10W-90W)
MPPT Based Solar Charger
En al tors
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All types of LED Drivers are available
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Manufactured & Marketed By:
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Regd. Off: B-15/190, Pharma Apartment, 88, I.P. Extension, Patparganj Depot, New Delhi -110092
Tel: 011-43082856, Email: [email protected]
Works: D-43, First Floor, Sector 59, Noida - 201301
Website: www.inodayled.com www.inodaytech.com.
Spotlight on Indian
16 Cover Story
Issue Focus
Winning with the Industrial Internet of Things
T&M Times
Keysight Introduces Infiniium V-Series Oscilloscopes for
Greater Insights in Validation, Debug
R&S RTE Digital Storage Oscilloscope Easy, powerful and simply more scope
Semi Power
Reinforced insulated DC/DC Converters Prolong The Service Life of IGBT Circuits
Small and reliable
ROHM Expands Its Full SiC Power Module Lineup
Vol : 5, Issue 01, January, 2016
Devendra Kumar
Shailesh Shukla
Sub Editors
Aakansha Mehrotra
Shloka Chauhan
Chief Correspondent
Dr. Ajay Shukla
Corporate Communication
Shilpa Shukla
Sales & Marketing
Nempal Singh Rana
Design & Print Production
Jitendra Sagar
Atul Kumar Tiwari
Director Technical-Advisory Board
K. R. Sripathy
Human Resource Development
Dr. Anjana Singh
Legal Advisor
Dharmendra Rajput
Sr. Advocate High Court, Delhi
Service Support
Delhi Head Office :
A-159, 3rd Floor
Vikas Marg
Delhi - 110092 (India)
Tel : +91-11-42754100,
42750100, 64641886
E-mail : [email protected]
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E-mail : [email protected]
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E-mail: [email protected]
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E-mail : [email protected]
Pune :
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Kolkata :
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In Conversation
We primarily set ourselves apart through innovation and find substantially more
room for developing our strengths in growing markets -Vivek Mahajan
Complexities at product designing need masterly Multiphysics Simulation from COMSOL
Four Quick Steps to Production, Using Model-Based Design for Software-Defined Radio
Developing Effective Design Strategies for Today’s Wearable Devices: POWER MANAGEMENT
Meeting the Cyber Challenges of Tomorrow
Future Technology
Flexible Electronics Paving the way for technologies of the future
Contributing Authors
Srinivasa Rao Appalla | Rohde & Schwarz
Bianca Aichinger | RECOM Power GmbH
Akshat Garg | Texas Instruments
Pavan Shetty | Texas Instruments
Pre Show Report
Elecrama 2016 adds interesting features to boost energy sector
High-growth prospects of Indian manufacturing sector opens up valuable
opportunities for automation and technology players
Printed and Published by Mr. Shailesh Shukla for and on
behalf of New Delhi Print Media Pvt. Ltd. from A-159,
3rd Floor, Vikas Marg, Delhi-110092, Phone No.: 01142754100, 42750100 and printed at MP Printers, B-220,
Phase-II, Noida, Gautambuddh Nagar (UP) Pin - 201305
The opinions expressed by authors to ELE Times are not
necessarily those of the editor or publisher.
ELE Times may not be reproduced in whole or in part
without prior permission of the publisher.
Copyright © 2016 ........... All rights reserved.
Reproduction in any manner is prohibited
Pushing the
aking on new ways of doing things is to go with
the flow and to follow the Time. New Thoughts
are the principle of origin, creation and universal
movement. We think that certain ways of doing
things are best because they are according to Time. New
thoughts that come from within the time become a timeless
creation. To change the ways with time is the way of ELE
Times – that creates the universal appeal cutting across the
industry line and becomes the slogan instantly.
The Spotlight on Indian Electronics is one such initiative
from New Delhi Print Media. In this era of extraordinary
change and globalization, we acknowledge that knowledge
and innovations are now driving the new economies. Since
the period of Aryabhata and Varahamihira India has had a
scientific temper throughout these years. Such temper is a
prerequisite of systemic study of the subject. The same
scientific temper is tapering down to the present day in the
We rely on an unlimited global resource, the hands on
information, policies, strategic locations branding and
human creativity. Growth strategies in the creative
economy therefore focus on harnessing the development
potential of an unlimited resource and not on optimizing
limited resources (as in traditional manufacturing
industries). For harnessing resources and growth one needs
to have a systematic information of all the components
required for uninterrupted source of information.
For such a scientific society there has to be a systemic
study of Electronics Industry which was hither to
somewhat absent. The Spotlight on Indian Electronics is an
attempt to pore-forth the stream of information that will
help, guide and in a way be the torchbearer to business
optimization for countless professionals and entrepreneurs.
The book has a nature of an encyclopedia, carries
comprehensive information on Electronic policies,
products, and the brands in India. It would be a primary
source of information on Indian Electronics to Indians and
the rest of the world. The book is an attempt to extend the
help to all of them who would want to know anything
about electronics industry.
The Spotlight on Indian Electronics would be launched at
ELECRAMA 2016 in February in Bangalore. Industry
Professionals, Government Sectors, Trade Fairs,
Embassies, Associations and consultants in India and
overseas have the excess to Spotlight distribution
throughout the year.
We invoke the illuminated community from electronics
and allied industries to take the optimum benefit of the
information as policies, products and brands.
Innovations in technology and digitization are increasingly
impacting how we connect with the issues. The industry
developments are impacting how we connect and interact
with each other, where newer generations are leading the
evolution. Broader innovative consequences of this
evolution are just beginning to unfold in what is perhaps
one of the most rapid media metamorphoses the world has
experienced of late. EletimesTV has been designed to
provide strategic insights to the industry that investigates
the developments evolved through the current period.
eletimesTV has afforded the world to connect 24/7, hence
created a digital generation so fortunate to have a wealth of
powerful, affordable promotional and marketing tools at
everyone’s disposal.
The unprecedented levels of access that eletimesTV
provide allows us to connect directly with potential
customers and buyers on an individual basis, at a much
lower cost than would have been possible up-till now. The
TV plays an essential role in how consumers discover,
research, and share information about brands and products.
With worldwide reach of eletimesTV, businesses cannot
avoid using this platform as a catalyst to disseminate their
information. Consequently the TV transforms the way we
think on advertising, the retail marketing, global business,
industry interactions, as an important trend to understand
and adopt accordingly.
We congratulate everyone of us on the onset of new year
for more innovations and a rightful sharing of news and
information so fast as through eletimesTV and so steady as
through Spotlight.
Enjoy Reading ELE Times.
Devendra Kumar
[email protected]
ELE Times | 08 | January, 2016
Thank you for your patronage !
STMicroelectronics ships Billionth
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• Continued evolution of portfolio with new devices every year as
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The Electronics manufacturing
sector in India set to receive subsidies
The Centre has decided to give subsidies
to companies involved in the electronics
manufacturing sector. Guidelines are
being finalised for subsidising of the
production of electronic items in India, like
microprocessors, semiconductors and
others. Ajay Kumar, additional secretary in
Department of Electronics and
Information Technology (DeitY), said at an
event organised by Assocham, "We have
introduced an element of production
subsidy, now we are in process of
finalising guidelines and since there are
different kinds of projects, we are looking
for specific technical inputs,"
He also said that the government needed
support in making the guidelines- “We
need support, to be able to pin-point what
needs to be subsidised and how, some
work is going on, the consultants are
Consumer electronics to
go 3D: Dassault Systemes
Dassault Systemes –
the world leader in 3D
design software,
recently released a
report that said that
3D technology is going
to transform how
consumer electronics
are manufactured and
The multinational which has presence in 140 countries
announced that it will showcase its virtual universe technology
at the International Consumer Electronics Show (CES) in Las
Vegas, Nevada, from January 6 to 9(2016), to provide a
“glimpse of how innovations will look and behave in the
future.” The company will demonstrate its 3D Experience
universes technology at CES to allow innovators from business,
science and a host of other fields to engage in an interactive
journey around the theme of ‘Dream, Create, Live.’
In the “Dream” area, visitors will experience a 3D application
paired with an HTC virtual reality headset, to sketch ideas and
bring them to life. Next, they will explore how companies can
“Create” products through demonstrations spanning all steps
of product development, from ideation to design to sales and
marketing. Lastly, visitors will see how people can “Live” and
consume a 3D experience, from personalizing their home, to
shopping with 3D technologies or navigating cities of the
future, it added. “Sophisticated data sensors and connected
devices are transforming how humans interact with the world
around them, and CES is the perfect forum to show
businesses, consumers, executives, manufacturers, makers
and tinkerers how 3D Experience universes are the backbone
of this new era of highly social, mobile and connected
consumer electronics,” said Olivier Ribet, Dassault Systems’
vice president of high-tech industry.
working on it, but any specific inputs from
industry are more than welcome,"
Ajay Kumar also revealed that the
government is working on fabless chip
design policy. "That is work under
progress, it will support the companies
involved in chip design."
He emphasised upon the need to
manufacture low-priced laptops in India to
spur computer manufacturing. "Maybe a
price point of Rs. 10,000 and it cannot be
a device which can be seen as a low grade
version of laptop."
Govt to invest Rs 10,000
crores to Boost Electronics
The government will
announce a corpus of Rs
10,000 crores, to an
Electronics Development
Fund this month to provide
financial assistance to domestic companies, in its bid to
encourage electronics manufacturing and innovation.
Launching Qualcomm’s Design in India initiative, Department
of Electronics and IT (DeitY) secretary J S Deepak said the fund,
housed with Canbank Venture Capital Fund, will start this
month with an initial corpus of Rs 2,500 crore and the rest will
be raised from various sources.
“This fund is a fund of funds. This will fund venture capitalists,
who in turn will fund domestic companies in the field of
electronics system design and manufacturing… The Cabinet
has already approved it,” he said.
“It will be used to encourage innovation and support
entrepreneurship. We need to change present system of
electronics manufacturing. It has to be rich in domestic
Intellectual Property Rights,” added Deepak.
At the event, Qualcomm India vice-president Sunil Lalvani
announced the launch of its ‘Design in India’ initiative to
support the government’s ‘Make in India’ vision. Qualcomm
has tied up with IT industry body Nasscom for its ‘Design in
India’ initiative, which will largely be for hardware components
rather than software, for which it is largely known.
Lalvani said the company creating a product under the Design
in India programme will own intellectual property rights (IPR).
A Qualcomm Innovation Lab has been set up at Bangalore and
10 Indian companies have been shortlisted, these will be
eligible for funding of up to Rs 6.5 lakh each to enable them to
translate ideas to working prototypes. Up to three winning
companies will receive up to Rs 65 lakh each as recognition
and encouragement for future efforts,” he added.
ELE Times | 10 | January, 2016
Next Issue
Official Media Partner
Grand Distribution
Inquiries :
[email protected]
011-42750100, 9911233833
Top technology trends to watch out
for in 2016 in the server space
As the volume of data generated goes up
drastically, enterprises are facing new
challenges when it comes to storage and
processing of this data in a secure and
easily retrievable manner. The everburgeoning datacenter and storage
requirements have meant that companies
are increasingly expecting their existing
infrastructure to scale up seamlessly,
preferably without demanding too many
investments in terms of cost, energy and
space. Below are some trends we saw in
the last one year and which we expect to
continue well into 2016.
• Security is the number 1 concern:
Enterprises have always been concerned
about security; but in the last one year,
security has become even more
important. Customers and employees are
demanding access to information anytime,
anywhere and on any device; but at the
same time, the threat landscape
becoming deadlier than ever.
• Pressure to do more with less: One of
the big challenges for CIOs is that
enterprises are demanding more from IT
than ever before- both from a budget and
performance point of view. Businesses
expect IT to deliver the same results from
smaller IT budgets.
• But an even bigger challenge is the
saturation of the energy envelope for their
datacenters, which means they don’t have
the physical space or the Power required
to run and cool more servers.
• Hyperconvergence: Customers today
are looking for the convenience of a single
management console for several
infrastructure layers, be it the compute
layer, hypervisor, networking, fabric or
storage.Hyper convergence enables
businesses to grow their infrastructure as
and when it is needed, in the form of
building blocks.
• On public cloud, hype is greater than
actual adoption: Large enterprises are still
taking baby steps on the cloud. Although
the peripheral data has moved out to the
Siddhesh Naik
Director, Enterprise
Business Group
Lenovo India
cloud, core applications and data are still
in-house. Instead, we’ve seen greater
demand for Hybrid clouds, with a single
window between public and private cloud
for a seamless user experience.
• Analytics is starting to come of age:
There has been huge demand for business
analytics in India, with core decision
making becoming real-time. Using real
time data, manufacturing cycles are being
planned on a daily basis, based on current
• High Performance Computing: High
Performance Computing (HPC) has seen a
good investment in 2015. This is expected
to significantly go up in 2016 / 17.
Government of India has announced their
outlay of 4500 cr for the National
Supercomputing Mission.
AVX Partners with Mouser Electronics to Littelfuse Invests In Silicon
Empower Autonomous Vehicle Innovation Carbide Technology
AVX Corporation, a leading manufacturer of passive components and interconnect
solutions, has teamed up with Mouser Electronics, celebrity engineer Grant
Imahara, and several other visionaries within the global electronics industry to
launch a Driver-less Cars Series for Mouser’s award-winning Empowering
Innovation Together™ program, which is designed to inspire creative thinking in
both professional and aspiring engineers. Dedicated to addressing various aspects
of autonomous vehicle technology spanning history, ethics, discoveries,
innovations, and public opinion, the Driver-less Cars Innovation Hub features
articles, blogs, videos, challenges, product information, and other in-depth
technical content contributed by various industry experts to provide visitors with
insider insights about where technology is heading and how autonomous driving
will revolutionize how we live and get around. “Moving to full-scale autonomous
driving will have substantial economic, environmental, and social impacts that will
drastically change the way people live and conduct their everyday lives,” said
Mouser Electronics President and CEO, Glenn Smith. “This new series is a great
opportunity for the engineering community to experience first-hand the
technology created and still needed for driver-less cars to become a reality.”
As part of the company’s strategy to move more
significantly into power semiconductors for industrial
and automotive markets, Littelfuse has made an
investment in Monolith Semiconductor, Inc., a start-up
company developing silicon carbide technology. Silicon
carbide is a rapidly emerging semiconductor material
that enables power devices to operate at higher
switching frequencies and temperatures versus
conventional silicon. This allows inverters and other
energy conversion systems to be built with significantly
improved power density, energy efficiency and cost.
“Investing in and partnering with Monolith’s
experienced team of silicon carbide and power
semiconductor experts allows us to quickly evolve our
portfolio with strategically relevant and innovative
technology,” said Ian Highley, Littelfuse Senior VP and
GM, Semiconductor Products, and CTO.
“Forming this strategic partnership with Littelfuse
accelerates development and helps bring silicon
carbide technology to the market,” said Sujit Banerjee,
PhD, CEO of Monolith Semiconductor. “Littelfuse is an
ideal partner for us. We are excited to dramatically
increase our customer reach, gain access to global
channels, and benefit from their sales and marketing
depth and expertise.” Initially this is not a material
investment for Littelfuse; however, the company has
committed to add to its investment once Monolith has
achieved certain milestones. This investment is not
expected to have any material financial impact on
Littelfuse in 2015 or 2016.
ELE Times | 12 | January, 2016
About 50 Percent Consumers Will Prefer Using
Smartphones or Wearable Devices
According to Gartner, Inc., with half of
consumers in mature MARKETS are
expected to be using smartphones or
wearable for mobile payments by 2018.
“Innovation in apps, mobile devices and
mobile services are impacting traditional
business models, particularly in the way
people use personal technology for
productivity and pleasure,” said Amanda
Sabia, principal research analyst at
When it comes to mobile payments, there
are three types of mobile payments or
mobile wallets available now: smartphone
or wearable-based payments, branded
mobile wallets from banks or credit card
providers, and branded mobile wallets
from retailers such as Starbucks.
However, mobile payments using Near
FieldCOMMUNICATION (NFC) technology
(Apple Pay, Samsung Pay and Android Pay)
will be limited in the short to midterm due
to a lack of partnerships between retailers
and financial organizations, “Instead,
cloud-based solutions will have a better
chance to succeed as they can reach a
wider audience and can support many use
cases beyond face-to-face or in-store
options.”, said Annette Jump, research
director at Gartner.
Gartner made two further predictions for
the personal technologies market:
By 2018, 75 percent of TV-style content
will be watched through applicationbased services in matureMARKETS
“The increasing prevalence of applicationbased TV-style viewing will be disruptive
to the traditional pay-TV market. services
such as Netflix and Hulu Plus are putting
pressure on the revenue of pay-TV
By 2019, less than 20 percent of users in
mature markets will subscribe to mobile
data-only connections
Communications service providers (CSPs)
have been promoting mobile data-only
connections as a complement to fixed
broadband accessed through Wi-Fi, when
consumers need the flexibility to use their
data-centric devices on the go.
NTT Com Receives NLD License to Revenue Drop in Fabless
Launch Network Services in India IC Industry Marks Continuous
NTT Communications
Corporation, the ICT solutions
and international
communications business
within the NTT Group,
announced recently that it has
been licensed to launch
domestic network services in
India through NTT
Communications India
Network Services, a newly
established Indian subsidiary.
The launch will include IP-VPNand and other reliable, high-quality
connectivity services, that are required by businesses in India today.
Customers will be able to use multiple local carriers for carrier-redundant
access, one of the many ways NTT Com aims to provide secure, costefficient networks backed by strong service-level agreements for the
mission-critical systems of its enterprise customers. NTT Com will combine
its new network services with managed-hosting and cloud services
currently offered by Netmagic, another NTT Com subsidiary, which owns
nine data centers in India. As a result, NTT Com will offer a comprehensive
range of ICT services, including system integration, to support the
businesses of Indian enterprises and multinational corporations. With the
addition of this capability, NTT Com&Netmagic will be able to address
more mature requirements of enterprises, especially with the wide spread
adoption of SMAC based technologies and growth of internet centric
enterprises in India. Netmagic already enjoys the trust of over 1500
enterprises, spread across industries and with this additional capability set,
Netmagic will be able to add more value on ICT front.
Struggle in 2016 : TradeForce
2015 was a challenging year for the fabless IC industry,
due to slowdown in the end market, and as TrendForce
projects it will continue to struggle in 2016, with revenues
dropping 4.1 percent.
According to global market research firm TrendForce,
revenue generated by fabless IC industry worldwide for
the entire 2015 is estimated around US$80.52 billion,
down 8.5 percent year on year which will continue in
2016, with limited end market demand. While the
Internet of Things will eventually lead to a reversal of
fortunes, TrendForce analysts say the trend is still nascent
in development, and will have limited contribution to the
industry’s revenue for 2016.
Price decline in the processor chip market will continue as
Chinese IC design houses like Spreadtrum escalate the
competition by chipping away at prices at the low end.
Smartphone vendors like Samsung, Huawei and LG, who
hope to differentiate their devices from their competitors’
will develop their own processor chips. While these will
not pose a threat to dedicated chipset makers in the short
term because of the initial cost and technology hurdles,
this trend does erode the market for ICs.
ELE Times | 14 | January, 2016
Mouser Electronics, Inc. is now stocking the
bq25120 battery management IC from
Texas Instruments (TI). The bq25120 is the
industry’s smallest and lowest-power
battery management solution in the
wearables market, requiring a no-load
quiescent current of just 700 nA at 1.8V
when the buck converter is enabled. The
solution supports batteries from 3.6V to
4.65V, and fast charge currents from 5mA to
300mA, allowing wearables and industrial
Internet of Things (IoT) applications to
always be on without draining the battery.
TI’s bq25120 battery management IC, now
available from Mouser Electronics, features
a linear charger, configurable low-dropout
(LDO) regulator, load switch, buck converter,
pushbutton control, and battery voltage
monitor in a diminutive 2.5mm2 WCSP
package. The bq25120 integrates a highefficiency, low-quiescent-current buck
converter with TI’s DCS-control architecture
that extends light-load efficiency down to
10-µA load currents. Low quiescent current
during operation and shutdown enables
maximum battery life, and the device’s
accurate charge termination down to 500
µA maximizes the energy delivered to the
battery before completing the charging
cycle, allowing batteries to draw a more
robust full charge.
The bq25120's I2C programming interface
allows designers to set key parameters
including battery charger voltage, current,
termination threshold, input current limit,
load switch control, flexible timer, and reset
options. The device is supported by the
bq25120EVM-731 evaluation module, a
high-performance, easy-to-use
development kit that helps engineers
design flexible power management
solutions based on the onboard bq25120
IC. The bq25120 IC and evaluation module
are ideal for smartwatches and other
wearable devices, health monitoring
accessories, and rechargeable toys.
ELE Times | 15 | January, 2016
leader in transport
ticketing solutions
Gemalto , the world leader in digital
security, has been recognized by three
market research analysts as the world’s
number one supplier of contactless and
mobile solutions for public transportation.
ABI Research, Juniper Research and IHS
have all published independent reports that
rank Gemalto as the global leader in this
fast-growing sector. They scored the
company highly for its market position,
commitment to innovation, international
presence and evident success in
implementing a series of pioneering NFC
applications for major public transportation
networks. Gemalto has been working with
the Government of India in consolidating
and digitising vehicle registration data in
many Indian cities and handling interstate
traffic, since 2003.
For more information visit www.gemalto.com
TI's bq25120 Battery Management Solution Gemalto awarded three
times as the global
Smallest on Market, Now at Mouser
Spotlight on Indian
An encyclopedia on India Electronics
from the House of ELE Times
Proud Promoter Of
Grand Launch at
ELE Times | 16 | January, 2016
ELE Times Presents
n this era of extraordinary change and
globalization, many acknowledge that
knowledge and innovations are now driving the
new economies. Organizations and even economic
regions that embrace knowledge information and
knowhow generate significantly higher revenue and
provide greater stability into the future. It is true
that we rally on an unlimited global resource, the
hands on information, policies, strategic locations
branding and human creativity. Growth strategies
in the creative economy therefore focus on
harnessing the development potential of an
unlimited resource and not on optimizing limited
resources (as in traditional manufacturing
industries). For harnessing resources and growth
one needs to have a systematic information of all
the components required for uninterrupted source
of information.
Keeping in mind the needs for a comprehensive
knowledge and statistics at one place for
electronics industry players in India and
international, New Delhi Print Media is launching
“Spotlight on Indian Electronics”, that gives a
holistic picture of Indian Electronics in India. The
book would carry the comprehensive information
on Electronics policies, products, and the brands in
India. It would be a primary source of information
on Indian Electronics to Indians and the rest of the
world. The book is an attempt to extend the help to
all of them who would want to know anything
about electronics industry.
Devendra Kumar | ELE Times
Cover Story
ELE Times | 17 | January, 2016
Cover Story
The year book 2016 would be launched at in the month of
February 2016 at ELECRAMA Exhibition in Bangalore. The Guide
Book will get distributed throughout the year to Industry
Professionals, Government Sectors, Trade Fairs, Embassies,
Associations and consultants in India and overseas.
As you know India is now the epicenter of consumer demand for
high technology and electronic products. The Spotlight on Indian
demand-supply gap and venture in to take informed decision.
• Is an important part of business planning.
Current situation provides an ideal condition for each one of us
dealing in electronics for tremendous growth. The spotlight on
Indian Electronics provides an opportunity to all of us to flaunt
our brands and have a bigger part of the profit pie.
“India is experiencing a real boom within the electronics industry driven by many factors including trends
in technology and communication, not forgetting the ‘Make in India’ initiative. Electronic Hardware
Technology Parks, Special Economic Zones and a strong drive for foreign investment, along with a culture
of liberalisation and relaxed tariffs are enabling some very impressive growth figures. The Guide Book,
“Spotlight on Indian Electronics”, is clearly being launched at a very important time and is poised to
become the go-to guide for clear up to date information regarding the electronics industry. As a primary
information source carrying pre-categorised and segmented information relating to products, policies
and key brands, the Guide Book will quickly become invaluable in enabling both informed and strategic
purchasing decisions.” Padmanabha Shakthivelu, Electrolube Sales Manager, India
Electronics 2016, an annual edition and a four hundred pages
encyclopedia on Indian electronics industry is badly needed by
the marketing and technology professionals in electronics
The Spotlight on Indian Electronics is a knowledge pack on
Government Policies and resultant development in the country,
High Priority Markets and the information on Mega Brands and
their Channel Partners, that help existing and the incumbent
investors take informed decision on their investment. The
Spotlight, not only help grow your business but also mark the
epithet of excellence in the electronics fraternity.
Spotlight on Indian Electronics 2016 is the first edition of an
encyclopedia on India Electronics. The encyclopedia, updated
annually, deals with electronic information and all the burning
issues related to it. The book has importance in the fact that
electronic market is ever increasing and you need to abreast the
minutest details and would like to update on micro and micro
The encyclopedia is available on the tables of the strategic
planners, libraries, Embassies and Consulates in India, Chambers
of commerce, Consultants, trade Associations in India, China,
Taiwan, Japan, Korea, USA, European Union and Association of
African countries, government and PSUs, Industry trade channel,
Major trade fairs in electronics and allied industries in India,
Aerospace and Defence Labs and establishments and electronic
companies in general in India.
The Spotlight on Indian Electronics is a rich source of information
and detailed overview of the electronics industry such as
comprehensive database, government policies, size and trends in
Output and the market, Import-export scenario, drivers of
growth, overall market size and SWOT analysis of the ecosystem
for the following high priority product markets.
“The Spotlight on Indian Electronics is a good initiative by New Delhi Print Media. The information on
governmental policies, market, products and the brands in India – all at one place will be very much
complementing to each other. I expect it to be a good source of information on whole ecosystem of Indian
electronics. This idea and concept is appealing. It should be able to extend the help to all stakeholders and
information seekers of entire electronics fraternity. I wish a great success to this endeavour,” Sumit Sharma,
Marketing Manager – India, Good Will Instrument Co., Ltd.
economics on Electronics. As you know the electronics market in
India is one of the largest in the world and is anticipated to reach
US$ 400 billion in 2022. The fact is – it is a big business for
domestic and foreign players.
Spotlight on Indian Electronics 2016 highlights on the following points:
• Is a window to know Indian Electronic industry.
• Highlights and compiles extensive information of electronics
and allied industries.
• Throws light enacting a brief biographical sketch of prominent
persons excel in electronics business and R&D.
• Is important because it allows business owners to estimate the
Economy need Statistics and Market Intelligence
India is one of the fastest growing markets for electronics. The
demand is projected to reach USD 400 Billion by 2020.
Government of India has launched the National Policy on
Electronics 2012 with the vision to make India a globally
competitive destination for Electronics System Design and
Manufacturing. Besides, The National Telecom Policy 2012 works
in conjunction with NPE, 2012 and provides for creating a design
and manufacturing ecosystem for telecom equipment.
Electronic System Design & Manufacturing
ELE Times | 18 | January, 2016
Cover Story
Over the last couple of decades India has been the epicenter of
consumer demand fuelled by a phenomenal GDP growth. While
demand increased across all sectors, demand for high
technology products, specifically electronic products has
registered significant growth and going by current estimates, the
demand for electronics hardware in the country is projected to
increase from USD 45 billion in 2009 to USD400 billion by 2020.
The estimated production will reach USD 104 billion by the year
2020, creating a gap of USD 296 billion in demand and
electronics, apart from covering electronic hardware products
relating to IT and office automation, telecom, consumer
electronics, electronic components, etc., we cover a wide range of
products relating to verticals like solar photovoltaic, automotive
electronics, medical electronics, avionics, LED etc. To address the
issue of infrastructure, a scheme for Electronics Manufacturing
Cluster provides 50% of the cost of upgrading infrastructure and
logistics as grant in aid from Government.
“Spotlight on Indian Electronics is an excellent attempt to bring the industry closer to investors and other
institutions. It’s like a mini encyclopedia and would be a great source of information. Such efforts are very
helpful for the industry to grow fast and also keep pace with competition. Comprehensive relevant
information on electronics is now available in a very presentable manner,” Sunil Bhatnagar, Director- Sales &
Marketing, Coslight India Telecom Pvt. Ltd.
production. This creates a unique opportunity for companies in
the ESDM (Electronic System Design & Manufacturing) sector to
look at India as their next destination to cater to the domestic
Indian demand as well as act as an exports hub.
Why we need to abreast with Government Policies
The Government has recently approved National Policy on
Electronics (NPE). One of the important objectives of the NPE is
to achieve a turnover of about USD 400 Billion by 2020 involving
investment of about USD 100 Billion and employment to around
28 million by 2020. This interalia, includes achieving a turnover
of USD 55 Billion of chip design and embedded software
industry, USD 80 Billion of exports in the sector. Moreover, the
policy also proposes setting up of over 200 Electronic
Manufacturing Clusters. Another important objective of the
policy is to significantly upscale high-end human resource
creation to 2500 PhDs annually by 2020 in the sector.
As part of the efforts to promote the electronics sector, India is
setting up a semiconductor wafer fab in the country. India has
become the hub for semiconductor design with nearly 2000
chips being designed per year and more than 20,000 engineers
Electronic Hardware Technology Parks (EHTPs) and
Special Economic Zones (SEZs)
The Government of India has set up Electronic Hardware
Technology Parks (EHTPs), Special Economic Zones (SEZs) and a
brought about a favourable climate for foreign direct investment
(FDI). It has also increased liberalisation and relaxed tariffs to
promote growth in the sector. In addition, the government gave its
green signal to the Modified Special Incentive Package Scheme
(MSIPS) under which the central government will be offering up to
US$ 1.7 billion in benefits to the electronics sector in next five
years. The growing customer base and the increased penetration
in consumer durables segment has provided enough scope for the
growth of the Indian electronics sector. Also, digitisation of cable
could lead to increased broadband penetration in the country and
open up new avenues for companies in the electronics industry.
Employment opportunities
India has a vast pool of innovative and talented human resource.
Our human resource is our strength which we offer to an investor
from abroad. We produce over 200,000 engineers every year. We
“New Delhi Print Media is renowned to bring forth the excellent industry publications every time. I hope that
Spotlight on Indian Electronics will be the next gem in the line. Spotlight is the need of the hour as it gives the
much needed information to the professionals. I appreciate and congratulate the management for the
foresight for sensing the need of the industry. The book will not only give a progressive picture of the
industry, it highlights the commitment of the government in order to create a better eco system for FDIs and
manufacturing,” R A Gotur, Director Operation, Hongfa India
are working in various aspects of chip design and verification.
Annually India is generating nearly USD 2 Billion in revenues for
the chip design services. This provides an enabling environment
for the semiconductor wafer fab which will come up in India.
Financial Incentives
The financial incentives are available not only for new units but
also for units relocating from abroad. Besides, when we speak of
also propose to enhance the number of post graduates and PhDs
in Electronics so that abundant manpower is available for
Electronics industry to grow and flourish. The Indian domestic
demand for electronics products is expected to reach $125 billion
by 2014 from the current level of $45 billion annually. The primary
demand drivers for the Indian Electronic Industry are sectors like
telecom, defence, IT and e-governance, automotive, consumer
ELE Times | 20 | January, 2016
“The ‘Spotlight on Indian Electronics’ is
an great Initiative NEW DELHI PRINT
MEDIA. This initiative will spot the light
on Policies, Programs and Incentives
from the Government of India. The
book gives full information to stake
holders about opportunities in Indian
Electronics Industry. The effort will
make our beloved Prime Minister’s
dream of MAKE IN INDIA go faster,”
R Sivaprasad, Managing Director,
Cover Story
electronics, and energy. At these demand levels, until India creates
its own electronics product industry, the imports of these products
will create the single largest trade deficit item, which would even be
larger than petroleum products. On the other hand, if this
particular unique opportunity is utilized, it can create a large
industry catering to domestic consumption, which will help achieve
self reliance in strategic sectors like telecom and defence, while
leading to large exports.
AN ISO 9001 : 2008 COMPANY
SMT/LED Manual Printer
BGA Reballing Kit
Step Up - Step Down Stencil
SMT / Laser Cut Stencils
Sheet Metal Components
In a major boost to the 'Make in India' initiative, the Government of
India has received investment proposals of over Rs 1,10,000 crore
(US$ 16.56 billion) in the last 12 months from various companies
including Airbus, Phillips, Thomson, Samsung, LG and Flextronics
among others. India has become one of the most attractive
destinations for investments in the manufacturing sector.
Road Ahead
The Government of India has an ambitious plan to locally
manufacture as many as 181 products. The move could help
infrastructure sectors such as power, oil and gas, and automobile
manufacturing that require large capital expenditure and revive the
Rs 1,85,000 crore (US$ 27.85 billion) Indian capital goods business.
India is an attractive hub for foreign investments in the
manufacturing sector. Several mobile phone, luxury and automobile
brands, among others, have set up or are looking to establish their
manufacturing bases in the country. With impetus on developing
industrial corridors and smart cities, the government aims to ensure
holistic development of the nation. The corridors would further
assist in integrating, monitoring and developing a conducive
environment for the industrial development and will promote
advance practices in manufacturing.
Spotlight is Knowledge and knowledge is power
Knowledge is power, Information is liberating and Education is the
premise of progress. Man has placed himself at the top of all living
beings and natural objects of the world by means of his great
knowledge. Man has conquered the space above, tamed the sea
and scaled the snow-clad mountains. He has dug out the wealth
that remained deposited long in the womb of the earth. Let you
acquire Spotlight on Indian Electronics 2016, for knowledge is
power. You will find this out for yourselves as you learn more.
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Decades of Engineering Excellence
ELE Times | 21 | January, 2016
Seizing the opportunity
Just when you thought the digital revolution was too focused on
consumers, along comes the Industrial Internet of Things (IIoT).
Arguably the biggest driver of productivity and growth in the next
decade, this latest wave of digital innovation will accelerate the
reinvention of sectors that account for almost two-thirds of world
Accenture estimates it could add US$14.2 trillion to the global
economy by 2030, and that there will be particularly significant
gains for the real gross domestic product (GDP) of mature
economies. Contrary to conventional wisdom, Accenture research
suggests that this next generation of digital technology will also
benefit workforces of the future by augmenting skills and
redefining tasks. The potential economic benefits of the IIoT may
be massive, but they are by no means guaranteed. Realizing
returns begs two key questions: Are companies prepared to take
full advantage of this opportunity? Are governments putting the
right conditions in place to facilitate progress and capture
Although a few pioneers are reaping rewards from their early
investments, widespread adoption is hampered by major
challenges. Accenture analysis reveals that many CEOs may be
overconfident about their readiness for the IIoT. It also shows that
many countries lack the full spectrum of enabling conditions
required to spur the application of these new technologies across
their economies. As the world struggles to emerge from a phase
of weak productivity growth, fragile employment and pockets of
inadequate demand, the IIoT offers a chance to redefine many
sectors and accelerate economic and employment growth.
However, to seize these opportunities, businesses and
governments must intensify their efforts and escalate
The Industrial Internet of Things is a network of physical objects,
systems, platforms and applications that contain embedded
technology to communicate and share intelligence with each other,
the external environment and with people. The adoption of the IIoT is
being enabled by the improved availability and affordability of
sensors, processors and other technologies that have helped facilitate
capture of and access to real-time information.
Securing economic growth
The raw technical conditions for the widespread adoption of the IIoT
are highly favorable. The number of sensors and devices on which the
IIoT depends has already reached tens of billions.
There is a difference, however, between the availability of these
technologies and capitalizing on their full potential by applying
them effectively within organizations, through entire supply
chains and across multiple industries. Consider the emergence of
electric power at the turn of the last century. Electricity did not
become mainstream or transformative until the United States
took the lead in embedding it across the wider economy. It was
one thing to light the streets; it was another to reinvent factories
around powered assembly lines, retrain workers and standardize
manufacturing processes. The substantial boost to productivity
laid the foundations for entirely new markets. The United States’
head start in electricity gave the nation an advantage in
developing and leading a range of related sectors, from the light
bulb and domestic appliances, to automotive, semiconductors or
Likewise, if the IIoT is to generate economic growth, company and
country leaders will have to think unconventionally as the rules of
competition, production and service delivery change. Accenture
estimates that the IIoT will lift real gross domestic product (that
is, adjusted for inflation) by 1.0 percent in 2030 over trend
Winning with the
Industrial Internet
of Things
How to accelerate the journey
to productivity and growth
ELE Times | 22 | January, 2016
projections for 20 major economies studied. And if those
economies were to increase their IIoT investments by 50 percent
and improve the underlying enabling conditions in their
respective countries, this could rise from 1.0 percent to 1.5
percent in that year. Looked at collectively in 2030, Brazil, Russia,
India and China (BRICs) will see corresponding increments to
annual GDP of 0.2 percent on average and, with enhanced
investments and measures, 0.5 percent. In particular, Accenture
estimates that China looks set to see greater economic gains from
the IIoT than Russia, India or Brazil. With IIoT-enhancing
measures in place, China could see its cumulative GDP rise by
US$1.8 trillion by 2030, raising its GDP in 2030 by 1.3 percent
over trend projections.
The United States’ economy will gain US$6.1 trillion in cumulative
GDP by 2030. By taking additional measures, for instance, to
improve the country’s broadband infrastructure, this figure could
rise to US$7.1 trillion. This could mean that the United States’
annual GDP is 2.3 percent higher than trend projections in 2030.
Including additional efforts and investments, Germany could lift
its cumulative GDP by US$700 billion and the United Kingdom by
US$531 billion within the next 15 years. This would raise German
gross domestic product and United Kingdom gross domestic
product by 1.7 and 1.8 percent, respectively, in 2030 over trend
projections. How can this economic uplift be achieved?
Creating the outcome economy
Today, the IIoT is helping to improve productivity, reduce operating
costs and enhance worker safety. For example, in the petroleum
industry wearable devices sense dangerous chemicals and unmanned
aerial vehicles can inspect remote pipelines.
However, the longer-term economic and employment potential
will require companies to establish entirely new product and
service hybrids that disrupt their own markets and generate fresh
revenue streams. Many of these will underpin the emergence of
the “outcome economy,” where organizations shift from selling
products to delivering measurable outcomes. These may range
from guaranteed energy savings in commercial buildings to
guaranteed crop yields in a specific parcel of farmland.
How ready are companies?
It is clear that many companies are not ready to take advantage of
the outcome economy. When Accenture surveyed more than
1,400 C-suite decision makers—including 736 CEOs—from some
of the world’s largest companies, the vast majority (84 percent)
believe their organizations have the capability to create new,
service-based income streams from the IIoT. But scratch beneath
the surface and the gloss comes off. Seventy-three percent
confess that their companies have yet to make any concrete
progress. Just 7 percent have developed a comprehensive
strategy with investments to match. Similarly, CEOs and
executives express remarkable confidence (96 percent) that the
senior leadership in their organizations grasp at least something
of the nature of the IIoT. But far fewer say their leaders have
completely understood it (38 percent).
And even this percentage seems to reflect a degree of
overconfidence. Accenture, in collaboration with the Industrial
Internet Consortium (IIC) undertook a World Economic Forum
Industrial Internet Impact Survey among more than 90 market
leaders, those who are actively pursuing IIoT initiatives. The vast
majority (88 percent) said that they still do not fully understand
the underlying business models and long-term implications of the
IIoT. These conflicting opinions underscore uncertainty around
the IIoT. Accenture argues that many companies do not
comprehend its full potential and that most are not primed for
the fundamental shifts required to deliver hybrid products and
services in an outcome-focused economy. If companies are to
move from recognizing the potential of the IIoT to taking action,
they need to improve their understanding through early
experimentation and pilots with a range of partners.
Commitment to the Industrial Internet of Things: 73 percent of
businesses have yet to make concrete progress. Only 7 percent have
developed a comprehensive strategy.
Good news for the workforce of the future
Contrary to some accounts of the growing threat from intelligent
machines, the IIoT will make people’s work more engaging and
Eighty-seven percent of business leaders believe that the IIoT will
result in the net creation of jobs. Intelligent machines will
automate mundane tasks, freeing up workers to perform more
creative and collaborative work with wider networks of people
and machines. For example, real-time data access will enable
today’s blue collar workers to jointly analyze and adjust the
performance of drill equipment in a mine or design products
more iteratively with the use of rapid 3D printed prototypes. The
IIoT will augment work through innovations, such as wearable
technology. Global positioning system (GPS) navigation is an early
example. Accenture and Royal Philips have created a proof-ofconcept demonstration that uses a Google Glass head-mounted
display for researching ways to improve the effectiveness and
efficiency of performing surgical procedures. This solution could
provide physicians with hands-free access to critical clinical
information. Theoretically transferable to other industries, the
ELE Times | 24 | January, 2016
Reimagine industry models
Three accelerators to productivity and growth
The power of the IIoT comes not only from generating insightful
data from physical objects, but also from sharing it between
players within supply chains and cross industry consortia.
According to a survey undertaken by Accenture and GE, 73 percent
of companies are already investing more than 20 percent of their
overall technology budget on big data analytics. That shift requires
new technical and management skills. Further, it demands a
cultural willingness to streamline data flow, not only within
enterprises, but also between them. Companies must create new
financial and governance models to share the rewards of using
common data. Interoperability and security are identified as the
greatest hurdles to progress by two thirds of those companies
actively pursuing IIoT initiatives. Collaborators should establish
their own processes and tests to improve interoperability while
establishing common security frameworks. Governments need to
work across borders with business and other stakeholders to agree
who owns data, what can be shared and how liabilities will be
handled across jurisdictions.
Given the clear impact of national enabling conditions on a country’s
ability to take advantage of the IIoT, government action will be
important. It will be a balancing act.
To accelerate the IIoT, countries require “hard” capabilities, such
as digital infrastructure, and “soft” technology skills and
upskilling programs that depend on investment—in industries,
data and people.
Business should play its part in identifying the deficiencies in
education, capital, technology or institutional frameworks, and
ensure that policy action focuses on a balance of factors that can
amplify existing competitive advantages.
Governments can support directly by bringing together the
public, private and education sectors in the promotion of pilots
that fast track innovation while reducing the investment risks.
For businesses, three key areas need to be addressed to accelerate
the economy-wide, cross-industry application of the IIoT:
If every product is connected and enables a new service,
reinventing industry practices and business models becomes
paramount. As companies embark on a journey that begins with
using the IIoT to improve efficiencies, and progresses to creating
outcome-oriented, product service hybrids, they will need to plan
each stage. How can their efforts for improving asset utilization, for
example, be used as a platform for new services? Will a company
gain most value by offering its own data to an ecosystem of
partners, or from incorporating third-party data to enhance its
own services? Should a company invest in its own platform or join
existing industry platforms? How will its partnerships evolve as a
Capitalize on the value of data
Prepare for the future of work
An overwhelming majority of executives (94 percent) believe that
the increasing use of smart products and robotics will change the
required skill and job mix in the workforce of the future. Decision
making can be devolved to workers empowered by valuable data,
while the design and creative process could become more iterative
and experimental. Employees may have to develop working
relationships with intelligent machines. And continuous learning
could replace traditional training as technologies and business
practices evolve quickly. Managers will have to be willing to
collapse hierarchies and silos and open up to extended workforces
beyond their own walls. Such an approach demands a new culture
and tolerance of autonomy. Leaders must also accept the demand
for individually tailored working environments and experiences by
creative and dispersed workforces, while maintaining core values
and a common purpose within their organizations. Companies will
have to establish digital platforms to create global talent
exchanges that address skills shortages. Digital tools will also
accelerate skills development and support a continuous learning
culture. Companies will need to reassess their organizational
structures and operations. Thanks to technologies such as 3D
printing and micro-assembly, in some quarters, the IIoT will reverse
today’s trend of centralized manufacturing and localized services,
requiring the reconfiguration of operations and talent.
ELE Times | 25 | January, 2016
application could be used to help field engineers repair
equipment with which they are unfamiliar, for instance. As IIoT
growth takes hold, the need for talent will intensify. What is
more, entirely new categories of jobs will be created: in digital
medicine and precision agriculture, for example. The demand for
digital literacy will be at a premium, with new skills required in
specialist roles from digital robot design and management to
transport network engineering and data analytics. As digital
technology blurs or removes organizational boundaries, it will
create more flexible workplaces that will appeal to sought-after
Millennials and other groups that will be required to deliver new
customer-oriented services. The impact will be felt on the
workforce at every level and will require greater delegation by
leadership and more decentralized decision making by individual
Keysight Introduces
Infiniium V-Series
for Greater Insights in Validation, Debug
The Infiniium V-Series oscilloscopes from Keysight Technologies
provide superior measurement accuracy, enhanced analysis tools
and advanced probing systems. With models that range from 8 GHz
to 33 GHz, the V-Series enables circuit designers and engineers to
make rapid progress from first silicon to eventual product release.
When engineers are designing high-speed digital products or
components, they need an oscilloscope to help them debug,
validate and optimize their designs, perform pre-compliance tests,
discover the root cause of failures, and maximize design margins.
The Infiniium V-Series offers engineers the capability to perform
these tests faster and more accurately, allowing them to get their
products to market faster and with more confidence in design
The V-Series’ measurement accuracy leads the industry in three
areas: 1) lowest oscilloscope noise floor, 2) lowest real-time
oscilloscope jitter floor, and 3) highest number of effective bits.
Based on a Keysight-proprietary indium phosphide integrated circuit
process, these advantages enable developers to see highly accurate
depictions of their signals and achieve tighter design margins.
To help designers find and debug their most challenging problems,
the V-Series includes a 12.5-Gbps hardware serial trigger with a 160bit sequence (the industry’s longest). Currently, this is the only
hardware serial trigger capable of finding 132-bit USB 3.1
(128b/132b) or 130-bit PCIe® Gen 3 (128b/130b) symbols. The VSeries also includes the industry’s fastest mixed signal oscilloscope
with 20-GS/s digital channels, which is ideal for triggering, analyzing
and debugging DDR4 and LPDDR4 buses.
Keysight Introduces
Portable Oscilloscope Families
That Set New Standards in Price,
Performance and Measurement Accuracy
Keysight Technologies introduced new high-performance portable
oscilloscope series deploying next-generation oscilloscope
technology. The Infiniium S‐Series sets a new standard for signal
integrity for bandwidths up to 8 GHz.
The Infiniium S-Series has the world’s fastest 10-bit ADC. Compared
with traditional scopes with 8-bit ADCs, the S-Series has four times
the vertical resolution for precise viewing of signal detail. Coupled
with a new low-noise front end, the S-Series delivers an ENOB
(effective number of bits) for the system of more than eight, the
highest in the industry. The series includes bandwidths from 500
MHz to 8 GHz with four-channel DSO models and 16-digital-channel
MSO models. Standard memory is 50 Mpts per channel or 100 Mpts
per channel when interleaved, the deepest in the industry.
The S-Series features the industry’s most comprehensive applicationspecific measurement software, fueled by a powerful motherboard
with 8-GB RAM, ensuring the scope stays responsive in all operating
modes. Fast boot-up time and increased reliability is made possible
with its solid-state drive. The 15-inch (38.1-cm) multi touch
capacitive display is the largest in the industry, making it easier to
see results and easier to use. Keysight also provides options for
integrating MATLAB capabilities directly into the oscilloscopes,
further increasing their measurement and analysis power for
For general-purpose, high-speed differential probing with the
Infiniium S-Series oscilloscopes, Keysight also introduced the new
InfiniiMax III+ probing solutions, including 4-GHz, 8-GHz and 13-GHz
differential active probes and new QuickTip accessories for
InfiniiMax probes. The InfiniiMax III+ probes work with the full array
of InfiniiMax III probe heads, including a wide range of solder-in
probe heads, a browser head, ZIF (zero insertion force) tips, 2.92mm/3.5-mm/SMA heads and the new QuickTip head.
ELE Times | 26 | January, 2016
R&S RTE Digital
Storage Oscilloscope
Easy, powerful and
simply more scope
Srinivasa Rao Appalla, Manager-Product Support & Applications, Rohde & Schwarz
R&S has launched different oscilloscopes
to address various market requirements.
RTE Digital Storage oscilloscopes were
launched to cater the demands of
embedded design development to power
electronics analysis to general debugging.
RTE Series digital storage oscilloscopes
offer quick and reliable solutions for every
day test and measurement tasks.
Many analysis tools provide fast results
like FFT that allows EMI debugging during
development. QuickMeas function that
displays several measurement results at
the same time. An Intuitive and smart
interface based on high resolution touch
screen makes operation easy.
The RTE Digital storage oscilloscope has
many unique features and one among
them is High Definition (HD) mode. The
vertical resolution determines how
precisely the signal can be measured and
how accurately it can be analysed. The HD
mode enhances the vertical resolution up
to 16 bits against 8 bit vertical resolution
of A to D converter. It means HD mode
provides 256 times more vertical
resolution. This improved vertical
resolution enables display of small signals
that are otherwise buried in noise. With
the unique Digital Trigger, we can even
trigger on these small signals and make
precise measurements.
The High Definition (HD) mode doesn’t
require special hardware. It can be
enabled by software key code and simple
upgrade for existing units as well. Hence
depending on the application, the user
has flexibility to choose between high
bandwidth and high resolution mode on
single instrument.
We are now explain the brief technical
details about the HD mode -High
Definition (HD) mode enhances the
vertical resolution up to 16 bit by applying
digital low pass filtering to the signal in
real time directly after A/D converter. Due
to filtering noise is reduced and signal to
noise ration increases which results in
enhanced resolution. The bandwidth of
the filter can be adapted to signal
characteristics. Lower the bandwidth of
the filter, higher the gain and resolution.
The schematic diagram showing the
signal flow is shown below:
The enhanced resolution results in clean
waveforms and signal details otherwise
lost in noise are visible now. The low
noise front end and single core A/D
converter of scope with Effective number
of bits (ENOB) >7, has contributed to high
dynamic range and measurement
accuracy. With High Definition mode the
user benefits from precise analysis results
due to high dynamic range and better
Fig 2 -This picture shows Zoom in to a sine
wave in normal mode. The quantisation steps
are clearly visible. Signal details might be
hidden in noise.
The same signal is as in Fig 2 with HD
mode is activated. Due to improved
resolution, the super imposition of sine
ELE Times | 27 | January, 2016
wave is clearly seen
The user doesn’t need to compromise on
speed or measurement capabilities with
High definition mode. The reason being
digital filtering in HD mode is done thru
ASIC which results in high acquisition and
processing rate. Analysis tools like
automatic measurements, FFT, History
mode can be used in High Definition mode
without any compromise.
The High Definition (HD) Mode is really
beneficial for analyzing switched mode
power supplies usually known as SMPS. In
SMPS, the Switching devices on and off
voltage must be measured in the same
acquisition cycle. The difference in on and
off voltage is of several hundred volts
which requires high dynamic range. The
HD mode with vertical resolution up to 16
is best suited to make these
High Definition (HD) mode is also suitable
for measuring modulated RF signals with
small modulation index which is common
in radar applications.
High Definition (HD) mode ability to
measure low level signal accurately is
really beneficial to Bio medical
In summary, RTE Digital storage
Oscilloscope’s low noise performance,
High waveform update rate, precise digital
trigger, powerful analysis functions
combined with High Definition (HD) mode
results in more confidence in your
GDS-2000E Series
Digital Storage
from GW Instek
GW Instek introduced the brand new GDS-2000E series to offer
users a more affordable and excellent 8” TFT LCD oscilloscope.
The GDS-2000E Series Digital Storage Oscilloscope offers 2 and 4channel configurations and the bandwidth selections, including
200MHz, 100MHz and 70MHz. 4 channel models of the series
provide 1GSa/s max.real-time sampling rate; 2 channel models of
the series provide 1GSa/s per channel real-time sampling rate.
The series is equipped with waveform update rate of 120,000
wfm/s. The 8-inch 800*480 16:9 WVGA display and the minimum
1mV/div vertical range allow the GDS-2000E series to clearly
display complex and random waveforms.
The GDS-2000E series provides 10 Mega point record length in
each channel with Waveform Search and Segmented Memory
functions, which greatly enhance the value of long memory
utilization of a DSO. The GDS-2000E series also provides 1M max
FFT display. High resolution FFT display, high waveform update
rate, Window Zoom and Peak Search allow users to obtain more
accurate and efficient test and measurement results while
conducting tests in the frequency domain.
Low Background Noise:
For small signal measurement, oscilloscope’s background noise
will affect the measurement results. The brand new GDS-2000E
low noise amplifying circuit can tremendously improve overall
noise interference to produce the genuine signal demonstration.
As shown in the diagram below, the GDS-2000E series has merely
the background noise of 400uV under 2mV/div that is superior to
the same category oscilloscopes developed by competitors.
Waveform Update Rate of 120,000 wfm/s and VPO Waveform
Display Technology:
The GDS-2000E digital oscilloscope allows users to easily and
completely observe inrush signals and rare transient waveforms
to increase waveform debugging efficiency by using features,
including advanced VPO (Visual Persistence Oscilloscope) signal
processing technology, waveform update rare as high as 120,000
wfm/s, and multi-layered afterglow display to enhance waveform
display efficiency. Oscilloscope with VPO technology displays
signals with three dimensional waveforms constructing by
amplitude, time and signal strength to show each waveform
point. 256 color gradients yield clear waveform changes.
Comparing with the conventional digital storage oscilloscope, the
GDS-2000E series provides more natural and more genuine signal
display effect which is very close to the original analog signal.
1M FFT Display:
The FFT function of the GDS-2000E Series provides the maximum
1M display for more precision frequency domain display. The
function supports four window displays, including Rectangular,
Hamming, Hanning, and Black-harris. Users select window display
for frequency domain analysis according to test requirements.
The GDS-2000E series not only provides the FFT function but also
FFTrms, vertical adjustment, and local zoom-in functions for users
to adjust waveforms of frequency domain by their requirements.
Via rapid waveform update rate and waveform search functions,
users can precisely observe the test results of frequency domain.
Digital Filter Function:
Engineers are often troubled by noise interference while
measuring signals in the electric circuit tests. The GDS-2000E
series features the digital filter function which can be set to high
pass or low pass digital filter. Digital filter allows users to
independently set filter frequency for each channel. The tracking
on function rapidly sets same filter frequency for all channels.
Support I2C/SPI/UART/CAN/LIN Serial Bus Trigger and
Decoding Function:
The serial bus technology has been widely applied in the present
embedded application design. How to rapidly and correctly
trigger and analyze serial bus data has posed a difficult challenge
to engineers. The GDS-2000E series provides serial bus analysis
function and 10M long memory depth to trigger, decode, and
analyze frequently used I2C, SPI ,UART serial bus and CAN/LIN
bus, which is often used by automotive communications.
GDS-2000E Features and Functions:
200/100/70MHz Bandwidth Selection; 2 or 4 Channels
1GSa/s Real-Time Sampling Rate for Each Channel (2ch model)
1GSa/s Maximum Real-Time Sampling Rate (4ch model)
Standard 10M Maximum Memory Depth and VPO Waveform
Display Technology
Max. Waveform Update Rate of 120,000 wfm/s
8 ” WVGA TFT LCD Display
FFT with Maximum 1M points to Provide Higher Frequency
Domain Resolution Measurement
High and Low Pass Digital Filter Functions
29,000 Sections of Segmented Memory and Waveform Search
I2C/SPI/UART/CAN/LIN Serial Bus Trigger and Decoding
Data Log Function Tracks Signal Changes Up To 100 hours
Network Storage Function
Contact: Sumit Sharma, Good Will Instrument Co., Ltd., Noida,
Mob No: +91-9999167300, E-mail: [email protected],
ELE Times | 28 | January, 2016
DGS&D ilable on
with st Contract
3 years ndard
email: [email protected]
Contact us: New Delhi: +91-11-42535400 | Bangalore: +91-80-41780400 | Hyderabad: +91-40-40003200 | Mumbai: +91-22-26743848
BERTWave MP2100B : Anritsu
4ch BERT, Sampling Oscilloscope in single unit
Global Data center IP traffic grows at a compound annual growth rate (CAGR) of 23 percent, resulting in increasing
production of optical modules. (Production of optical modules exceeded 15 million units.)
The recent rapid increases in data volumes at network
equipment, servers, and storage due to increasing use of
smartphones, cloud computing, FTTx rollout, video streaming,
etc., seem likely to increase even further in future. To cope with
demand, many appliances and facilities are using digital signals
exceeding the Gbit/s band. Dealing with these high-speed signals
requires paying attention not only to the digital aspects but also
to analog-type behavior, and care is required in choosing tools for
monitoring these signals. This document discusses the key points
when handling digital signals exceeding 10 Gbit/s from the
perspective of measurement tools.
The BERTWave MP2100B is an all-in-one test set with built-in
BERT and available sampling oscilloscope supporting evaluation of
optical modules, including BER measurements, Eye Mask tests,
Eye pattern analyses, etc.
A BERT and sampling oscilloscope are required measuring
instruments for evaluating optical modules used by optical
communications systems. Previous evaluations of optical
modules, such as QSFP+ and SFP+ modules, required provision of
a separate BERT and sampling oscilloscope. However, the
BERTWave MP2100B incorporates a BERT supporting from one up
to 4 channels as well as an optional sampling oscilloscope in a
single, compact, 18 cm deep cabinet, slashing equipment
investment costs and saving bench-top space. In addition, the
BERTWave MP2100B reduces measurement times by eliminating
the need to change cable connections at simultaneous BER
measurements, Eye Mask tests, and Eye pattern analyses.
Additionally, adding the SFP+ plug-in port supports optical BER
Key Features:
Built-in 4ch BERT and sampling oscilloscope
Simultaneous 4ch Bit Error Rate (BER) measurements
High-quality waveform PPG (1 psrms Jitter)
High-input sensitivity (10 mVp-p minimum input sensitivity)
High-speed Eye Mask test and Eye pattern analysis at 150
ksample/s max.
Supports differential signal BER measurement, Eye Mask test
and Eye pattern analysis
Up to six built-in Bessel filters for full-featured application
Compact (18 cm deep) test set for optical module evaluation
Simultaneous measurement of BER, Jitter, Eye pattern and Eye
Supports WDP measurements
Calculates optimum values for sampling simultaneously with
equalizer and emphasis values to display Eye Pattern
Simultaneous Eye Pattern, Eye Mask and Jitter measurements
of simulated waveform
Key Application Area:
Evaluation of Active Optical Cables (AOCs) not only requires
BER measurements and Eye Pattern analyses but also requires
Jitter Analysis due to a analysis at electrical signal conversion.
By using the MP2100B along with the Jitter Analysis Software
MX210001A option, the Jitter of high-speed, multichannel
AOCs can be measured at the same time as performing Eye
Pattern and Eye Mask tests.
Simultaneous Multi-channel Measurements Both-ways
transmissions of multichannel AOCs using InfiniBand, etc., can
be measured simultaneously. Since the MP2100B has a built-in
4ch PPG and ED, it can also measure BER simultaneously,
helping cut measurement times.
40 Gbit/s QSFP+ (4 x 10 Gbit/s) Measurement:
Simultaneous Measurements: Optical modules used in data
centers are handling increasing data volumes, some more
multichannel optical modules such as QSFP+ are being used.
The MP2100B supports simultaneous BER measurements of
multichannel optical modules for four channels using the builtin BERT. In addition, Eye Pattern and BER can be measured
simultaneously using the built-in BERT and sampling
PON Device BOB (BOSA On Board) Evaluation: Clock
Recovery Options: Because the MP2100B has a built-in clock
recovery option supporting 8.5 GHz to 12.5 GHz and 0.1 GHz
to 2.7 GHz, it can be used to confirm the optical output
characteristics of transmission equipment without requiring a
trigger source. High-Speed Mask Margin Measurement: Eye
Pattern analysis can be performed at sampling rates up to 150
ksample/s using the Fast Sampling Mode. In addition,
automated Mask Margin tests shorten measurement times
and increase measurement efficiency.
Direct Attach Cable (DAC) Measurement: The Eye opening of
passive cables like Direct Attach Cables (DAC) used for short
connections between server racks, etc., can be assured using
the equalizer built into the equipment Rx section. The
MX210002A can measure the S21 Gain and Phase
characteristics of these devices. Moreover, since waveforms
with optimized equalizer, filter, and emphasis values can be
predicted from these transmission characteristics, Eye Pattern
measurements and Eye Mask tests of simulated waveforms
can be performed.
Emphasis Effect Simulation: The same 4Tap Emphasis as the
4Tap Emphasis MP1825B can be set. The type of Eye Pattern
measurement resulting from equalization and Emphasis
correction of a waveform with an Eye Pattern measurement
degraded by transmission path loss, or analysis using on-thespot waveform simulation to determine the required
equalization or Emphasis can be fed-back into the Emphasis
1. Active Optical Cable (AOC) Measurement: Jitter Analysis:
ELE Times | 30 | January, 2016
EE Corporation, Japan
High-speed 20MS/s
Memory Recorder
Measure signals from multiple circuits at once, across the
full range of voltage magnitudes - from high to trace voltage.
Energy and power applications
Tr an s p o r t e quipm e n t
n Evaluate systems for power plants and substations
n Monitor multi-circuit power supply lines for anomalies
n Regular diagnostics and troubleshooting
n Verification testing when bringing new facilities or
equipment online
n Evaluate vehicle control circuit boards
n Test and evaluate motors and inverters
n Measure vibration, pressure, and stress
n Endurance testing and destructive testing
Simultaneous, multipoint measurement of high-voltage, high-current,
and relay control signals
Bangalore Head Quarters : No. 528, 2nd Floor, 8th Main, 6th Stage, BEML Layout, ITPL Road, Bangalore - 560 066. Phone: 080-40936722 /922 Fax: 080-40936322
Hyderabad : Flat No. 302, Bliss Apartments, H.No. 1-4-6, Street No. 7, Habsiguda, Hyderabad - 500 007 Tel/fax: 040-40147045
Chennai : Plot No. 990, 'H' Block, 2nd street, 11th Main Road, Anna Nagar, Chennai-600 040 Phone: 044-4218 0909 / 26160146
Email: [email protected] Web: www.tangenttest.com
Editorial Calendar 2016
Future Technologies of
ELE Times
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Power Semiconductor New Technologies in
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the Industrial IoT
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Connectors, Relays
& Switches
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on AC-DC Power
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Interconnect Technology
Smart Metering
Encryption and
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Unmanned Vehicles
November Memristor
New Avenues for
Test Solutions
Stealth Technology
December Future batteries
LED Driving
India in 2017
Leading Innovators
Swarm Robotics
September Optical computing
3D Printing
and beyond
Company Special
Elecrama, Bangalore
13-17 Feb 2016
Texas Instruments
SPS Automation
7-9 April 2016
LED EXPO, Mumbai
12-14 May
IPCA Expo*, Delhi
Analog Devices
WRET Congress
21-23 Aug, Delhi
Electronica &
Productronica India
Bangalore, 21-23 Sep
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Light India, Delhi
5-7 Oct 2016
electronica , Munich
08-11 Nov
LED Expo, Delhi*
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The Service
Life of
IGBT Circuits
Small and reliable
Bianca Aichinger, Product Marketing Manager, RECOM Power GmbH
IGBTs are key components in power electronics and are mainly used where fast switching is essential, for example in inverters
or motor control systems. Their drivers are powered through small, highly efficient DC/DC converters that play a crucial role for
the reliability of the entire system. It is therefore very important that the correct converter model is chosen.
IGBTs have become indispensible in power electronics. Due to
their capability to switch high powers with minimum current, they
have become the preferred solution in many types of circuits,
including modern frequency converters. In times of rising
electricity costs, frequency converters are among the most
effective solutions for the efficient operation of production
plants. The primary task of frequency converters is regulating the
speed of a three-phase asynchronous motor. As the frequency of
the power grid determines the motor speed, changing the
frequency enables operators to change the speed of the motor.
Design of standard frequency converter:
A frequency converter consists of three main components,
namely the rectifier, the intermediate circuit and the inverter (see
figure 1). In the power rectifier, the alternating current is
converted by means of a three-phase bridge circuit into pulsed
direct current. This current is smoothed in the intermediate
circuit capacitor. Subsequently, the output voltage and frequency
are adjusted in the inverter. The main components of the inverter
are 6 IGBTs that are arranged in pairs on three branches. The
IGBTs control the rectified intermediate circuit voltage output by
means of pulse width modulation (PWM).
Figure 1: Diagram of frequency converter
IGBT control
The IGBTs are powered and controlled by means of IGBT drivers
integrated into the power circuit where they float in line with the
input voltage. There is thus a need for electrical insulation.
Optocouplers act as insulators for the control signal. For the
supply power, the insulation is normally provided by two
reinforced insulated DC/DC converters.
IGBTs thus combine the characteristics of MOSFETs at the input
end and bipolar transistors at the output end. They can be
controlled with minimum current. When through-connected, they
show minimum voltage drop along the collector-emitter path.
IGBTs are thus the ideal devices for the switching of high voltages
and currents with minimum power consumption. During the
ELE Times | 36 | January, 2016
Figure 2: IGBT switching; the curves to the left show the switching-on
and switching-off currents and voltages. The advantage of reducing
the switch-off voltage to acceptable dv/dt loads is clearly visible.
The latest products on the market are IGBT converters. These
devices are perfectly adapted for combination with IGBT drivers,
and feature dual asymmetric outputs of +15V and -9V for the
supply of the drivers (see figure 3). As a single converter is thus
sufficient, they cater for compact solutions and can help save
Why insulation is crucial for a long service life
At first sight, given an intermediate circuit voltage of around 560V,
insulation strength does not appear to be a huge problem. As a
rule of thumb, one would expect that insulation by twice the
intermediate circuit voltage should be more than sufficient. When
taking into account the high switching frequencies of up to 16kHz
and the associated steep switching edges, it becomes apparent,
however, that other aspects must be considered for effective
insulation. As the switching rates are normally within the µs range,
damage to the insulation is not immediately detectable. Over time,
the extra load can, however, lead to premature failure of the
component. As the saying goes, little strokes fell big oaks, and this
is exactly what can happen here.
When choosing the type of insulation, air clearance and creepage
distances around the transformer are the main issues. They are
normally specified for 50Hz. At higher and irregular frequencies
that are commonly found in motor control devices, the behaviour
of electromagnetic components and materials is, however, very
different. In addition, the steep switching edges cause parasitic
capacities. It would therefore be foolish to rely on simple or
functional insulation consisting of varnish around the transformer
winding wires. Double or basic insulation, where the wires are
separated by additional insulation barriers, offer much greater
In conclusion, it is therefore recommended to choose an insulation
voltage that is significantly above the expected voltage peaks.
Combined with basic or even reinforced insulation, the reliability
of IGBT converters can be greatly improved. The fact that
manufacturers do not always provide the necessary information in
the data sheets of their products can make it difficult for designers
to compare like with like. Sometimes, the values refer to a test
voltage applied for "1 second". In other data sheets, the
specifications apply to test voltages of "1 minute" or "continuous".
The longer the test time, the lower the voltage value.
Advanced IGBT converters from RECOM
In order to meet the demands of as many applications as possible,
RECOM now offers seven new IGBT converter series. All models
feature asymmetric outputs of +15V and -9V at input voltages of
5V, 12V, or 24V, respectively, and are therefore tailor-made for the
operation of IGBT drivers. Special attention has been paid to the
insulation rating of the new products. Ranging from 3kV (RHxx1509D) to 6.4kV (RxxP1509D), the new converters offer suitable
insulation values for virtually all applications. As designers often
need to consider the size of components, the new IGBT converters
are available with the compact SIP7 housing (RP-xx1509D), the
universal DIP14 housing (RKZ-xx1509D), or as flat DIP24 miniature
(RV-xx1509D) models.
These 1W and 2W modules are certified according to EN60950-1
and do not contain hazardous substances according to the RoHS2
and REACH Directives. As usual for RECOM devices, these products
come with a three-year warranty.
Figure 3: In the IGBT control stage (IAS in fig. 1), the control circuit
(blue) and the power circuit (red) are completely separated
ELE Times | 37 | January, 2016
Semi Power
switch-on process, it is important that the gate capacity is
charged as quickly as possible. This, however, results in shortterm current peaks. The gate resistance RG ensures that the
longest permissible switching time at just about acceptable di/dt
is achieved. During switching off, the voltage of the gate capacity
must be reduced as quickly as possible. This is done by applying
a suitable control voltage VG-. With symmetric power supply and
+15V, which is required for IGBTs to switch on reliably, the
control voltage should thus be -15V. If the gate charge drops too
quickly, the components of the device would, however, be
exposed to huge voltage peaks. In order to protect the
components against such peaks, the control voltage is normally
reduced during switching off. Tests have shown that -9V is a
good compromise, as the gate is discharged sufficiently quickly
at acceptable dv/dt values. Figure 2 shows the respective current
and voltage curves. Developers of IGBTs have thus to make a
choice: they can opt for a compact design with a single converter
and symmetric ±15V, or choose a more costly, and less compact,
solution with supply through two separate converters with +15V
and -9V.
ROHM Expands
Its Full SiC Power Module Lineup
New 1200V/300A model ideal for
high power applications
ROHM has recently announced the development of a
1200V/300A full SiC power module designed for inverters and
converters in solar power conditioners and industrial equipment.
The 300A rated current makes the BSM300D12P2E001 suitable
for high power applications such as large-capacity power
supplies for industrial equipment. In addition, 77% lower
switching loss vs. conventional IGBT modules enables highfrequency operation, contributing to smaller cooling
countermeasures and peripheral components.
ROHM began mass production of the world’s first full SiC power
module with an integrated power semiconductor element
composed entirely of silicon carbide, and its 120A and
180A/1200V products continue to see increased adoption in the
industrial and power sectors. And although further increases in
current are expected due to energy-saving effects, in order to
take advantage of the high-speed switching capability of SiC
products an entirely new package design was needed that can
minimize the effects of surge voltage during switching which can
becomeparticularly problematic at higher currents.
In response, the BSM300D12P2E001 features an optimized the
chip layout and module construction that significantly reduces
internal inductance, suppressing surge voltage while enabling
support for higher current operation up to 300A. And going
forward ROHM will continue to strengthen its lineups by
developing products compatible with larger currents that
incorporate SiC devices utilizing high voltage modules and trench
Key Features
1. Reduced switching loss through higher frequency
operation: Replacing IGBT modules is expected to reduce
switching loss by up to 77%, enabling smaller cooling systems to
be used. And higher frequency switching will make it possible to
decrease the size of peripheral components such as the coil and
capacitors as well, improving efficiency while contributing to
greater end-product miniaturization.
2. Lower inductance improves current-handling capability:
Increasing the rated current for power modules involves
reducing the internal inductance to counter the higher surge
voltages generated during switching. The BSM300D12P2E001
features an all-SiC construction and optimized circuit layout that
cuts internal inductance by half, making it possible to increase
the rated current to 300A.
Device Configuration
• Full SiC module integrates an SiCSBDand SiC-MOSFET into a
single package
• Equivalent package size as standard IGBT modules
• Built-in thermistor
• Tjmax=175°C
SiC Power Module Lineup
ELE Times | 38 | January, 2016
Akshat Garg | Analog Applications Engineer, Pavan Shetty | Field Applications Engineer (Analog)
Texas Instruments
Today’s enterprise and telecom hardware systems are pushing the
technology in power electronics to achieve smaller size, robust
design, better efficiency and thermal performance. At present,
there is a need to pack more computing power on the same formfactor boards, which increases the power density needed from
the power delivery modules. In short, customers’ demand of
“increase the power density without increasing the size”, needs to
be met.
Reducing size with new TI solutions
Applications such as server racks and network switches have
multiple boards stacked inside a single chassis. Designers often
have height and space constraints. Low profile inductors,
transformers, bulk capacitors, etc. are in common demand.
Designers need to look at ways of increasing the switching
frequencies in order to reduce their size.
Silicon Mosfets with improved gate charge and RdsON, as well as
newer wide bandgap devices like GaN (Gallium Nitride), are major
breakthroughs that help in reducing the size of power solutions.
GaN switching devices enable customers to implement large step
down ratios without having an intermediate bus, increasing
switching frequency beyond 2MHz. Designers can directly look to
convert 48V to 3.3V high power rails instead of generating a 12V
intermediate bus. One of the main challenges that come up in the
design of high switching frequency convertors is in the layout,
where it is imperative to minimize switching loops to reduce
output noise and address EMI/EMC concerns. LMG5200 Module
from TI combines a GaN FET and GaN driver in a single package,
reducing the stress on external layout design. LMG5200 when
combined with a digital controller like UCD3138A can be used for
direct point of load applications from a high voltage bus or
isolated supplies with reduced transformer size.
Silicon FET such as 100V CSD19536KTT offers a 2.4 mOhm (Max)
Rdson which is excellent for applications that need Oring or
Hotswap. Power stages such as CSD95378 combine a gate driver
and MOSFET in the same package enabling tighter layout for high
current point of load designs.
When we hit the limits of switching frequencies, the next thing
Figure 1: TI Silicon FET power block CSD95378
that can be turned to is INTEGRATION. Integrated MOSFET
convertors also often have internal compensation or use
hysteretic control topologies like adaptive constant on time that
do not need external circuitry. Convertors like TPS544C20 and
TPS544C25 can deliver 30A loads, replacing traditional controller
+ external MOSFETs to integrated FET solutions. TPS544C20 uses
TI’s DCAP2 (adaptive constant on time) topology that incorporates
internal ripple injection and requires fewer external components.
Due to the extremely fast transient response on these control
topologies, designers can afford to use fewer and smaller
capacitors to satisfy load regulation needs while going for low ESR
ceramic capacitor bank. Introduction of plug and play modules
further shrink the solution size by integrating inductors and
capacitors with the convertor. TPS82085 (SIL) for example allows
for an implementation of 35mm2 which is half the size of a
corresponding external inductor design. Modules like TPS8268
(SIP) even integrate the input and output capacitors, in a low
profile solution.
Figure 2 : Integration levels
Size reduction can also come in the form of eliminating
component footprints present for qualification purposes. Board
designs usually incorporate margining circuitry to enable DVT
qualifications, otherwise unused. By using convertor control
topologies like a PMBus, designers can eliminate this circuitry and
instead implement the margining through simple software.
PMBus functionality in devices like the TPS544C2x also
incorporates real-time voltage and current sensing to gauge the
actual load. Devices like TPS549A20 come in a PMBus and non
PMBus pin compatible version to optimize cost during mass
A popular way to increase the power density is to use a
multiphase converter where each phase can switch at a higher
switching frequency, using smaller passives. Using 2 phase
options like TI’s TPS62180, designers can opt for two smaller
lower cost low profile inductors instead of one bulky inductor.
Similarly devices like LP8758-B0 can deliver upto 16A in less than
50mm2 area, enabled by a 4 phase configuration. For higher
current (200A), multiphase controllers like TPS53647 can be
combined with power stages to reduce solution size and also
output switching ripple.
ELE Times | 39 | January, 2016
Semi Power
Texas Instruments’ Power solutions for
Enterprise and Telecom Market
We primarily set ourselves
apart through innovation
and find substantially more
room for developing our
strengths in growing markets
-Vivek Mahajan
Infineon, through relentless innovations, has made the barely visible electronic components an indispensable part of our
daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry
computers, safeguard the data flying through cyberspace and make cars more energy-efficient. Vivek Mahajan, Division
Head, Industrial power control for Asia Pacific, Infineon Technologies, in conversation with ELE Times discusses the
power semiconductor and the market. Excerpts from the interview.
ELE Times: What are the current global
trends in the Power Semiconductor
market and how do you foresee the
market to grow in the next couple of
Vivek Mahajan: We expect that the
growth in the Industrial, Consumer,
Automotive and Chip Card ICs segments of
the semiconductor industry will outpace
the total semiconductor market in the
next 4 years. Infineon, with its technology
and products in the four divisions
Industrial Power Control, Power
Management and Multimarket,
Automotive and Chip Card and Security is
well positioned to profit from the
developments we foresee. And our market
assessment is supported by IHS and a
report they issued in September last year.
The industrial segment covers a wide
spectrum of applications along the entire
power value chain, starting with power
generation including renewable energy
conversion, to transmission and a broad
range of consumption. The consumption
area includes various applications ranging
from traction, CAV, general purpose
drives, conveyors, home appliances and
robotics, to data servers, power tools,
lighting, consumer gadgets in the low
power arena.
The major trends in the industrial segment
are industrial automation due to higher
labour cost, and rapid urbanization
demanding mass transport systems not
only within cities but also for commuters.
After we have seen the success of the
Paris negotiations on climate fostered by
the UN, the legislative push for higher mix
of renewable energy sources will have to
be intensified. In general we feel very
comfortable that semiconductor
technology that enables higher power
density and with that, higher energy
efficiency, will profit from these trends.
Even though the semiconductor itself is
ELE Times | 40 | January, 2016
not noticed at all by the consumer, up to
90 percent of innovations in vehicles, for
example, are implemented today by
means of electronics. Progress in
electronics in turn is based nearly entirely
on the pace of innovation in
semiconductors. In automotive, power
and sensors are among the fastest
growing product categories with Y-Y
growth of 11 percent. (Source: Strategic
Analytics, Apr 2015). The global trends in
the automotive segment, for example
ADAS, xEV, connectivity, and advanced
security – are significantly increasing the
semi content per vehicle. Legislations in
favour of CO2 reduction will push for
improvements in internal combustion
engine and adoption of EV and HEV.
Semiconductors and innovative
manufacturing technologies are also
helping to reduce system cost to enable
wider adoption of advanced safety and
comfort features.
Contd. on Pg 42
provides software
solutions for
modeling. It is a
fast growing high
tech engineering
Multiphysics is a
finite element
analysis, solver
and Simulation
software / FEA
Software package
for various
physics and
phenomena, or
multiphysics. Dr.
Samarth Agarwal,
Office Manager,
Multiphysics had
a candid
conversation with
ELE Times during
conference last
month at Pune,
India. Excerpts
from the
ELE Times: What is the significance of
Multiphysics? How can product developers use
Multiphysics? Please make us understand with an
Samarth Agarwal: Technology today, be it the
designing of a simple light bulb or an automobile,
require inputs from different areas of science and
engineering. The ability to handle these different
physical phenomena together through computer
simulations is called Multiphysics. Any product
developer would need to be mindful of these
different phenomena influencing the product design
simultaneously. To be able to handle these
complexities one would have to resort to using a
Multiphysics simulator like COMSOL. Adopting an
approach that is not Multiphysics in nature would
never allow a product designer to reach the most
optimum operating points, given that the design
space is typically large. For example in the designing
of a light bulb, one has to look at several aspects,
like the heat transfer inside the bulb, structural
strength and electrical properties of the materials all
at the same time. By taking these phenomena one
at a time, one cannot possibly understand the effect
they have on each other and therefore it would be
virtually impossible to achieve the best combination.
A Multiphysics approach on the other hand would
help in designing this efficiently and give the
optimum solution in a given design space.
ELE Times: What are the several important roles in
simulation-based design? (As product development
moves towards completely digitized processes,
Multiphysics simulations can play several
important roles in simulation-based design. What
are they)? How has the emergence of a shorter
time-to-market affected work practices?
Samarth Agarwal: Though the importance of
simulation is well understood, the move towards
Multiphysics simulations is more recent. Previously
several different teams
working independently with different simulation
tools would design different aspects of the
technology. Now as these different technology
aspects get intertwined, a Multiphysics approach is
essential. Uniformity across these teams also
demands that as far as possible a similar software
platform capable of handling a wide range of
problems be used. In addition to that, all tasks down
to analysing data and creating reports can be
handled by COMSOL. Uniformity and standardization
across teams has also reduced the time-to-market.
So an organization looking at choosing a computer
simulator must ensure that they adopt an approach
that makes it easy to achieve their objectives of
streamlining processes and keeping the time to
market as short as possible.
ELE Times: Can you elaborate on simulation for
everyone? What ramification does the Application
Builder has for semiconductor industry?
Samarth Agarwal: The essential idea is to be able to
use simulation capability such that one is required to
look only at parameters relevant to the problem,
rather than all the details of a Multiphysics
simulation. The Application Builder from COMSOL is
a big step in this direction. It gives the power to the
user to design a custom interface keeping only
relevant design parameters, and then pass them on
to other users in the form of an application. This way
a larger group of people will then have access to
simulations in any organization. For example in the
semi-conductor industry, various teams are involved
in the manufacturing stage and have knowledge of
the operating points of the technology. The
technology design however is taken care of by a
relatively smaller R&D team. Using the application
builder, the R&D team can reach out to a large
number of experts in the manufacturing team
through custom designed applications and get
feedback on their design. The manufacturing team
will only have to deal with the relevant parameters
and not with all the details that went into building a
Multiphysics simulation model. This would ensure a
smoother transition of any design from concept to
ELE Times: What major electronics design
challenges does simulation help tackle? What are
the offerings from COMSOL for an electrical and
ELE Times | 41 | January, 2016
In Conversation
Dr. Samarth Agarwal
Office Manager
COMSOL Multiphysics
Complexities at product designing need
masterly Multiphysics Simulation
In Conversation
We primarily set ourselves...
Contd. from Pg 40
ELE Times: How is technology changing
with this growth?
Vivek Mahajan: The semiconductor
industry is particularly exciting because of
its rapid and significant changes. About
every three to five years, a new
technology generation emerges. Even the
automotive industry that is characterized
by longer development cycles recently had
to experience how quickly new suppliers
can move the market. It was as recent as
in 2008 when Tesla entered serial
production with the Roadster. Since that
time, the company also sells electric
components to established car
manufacturers or home energy storage
systems known as powerwall to end
In a rapidly changing market, it is
necessary to consider whether a recipe for
success might lead to a dead end over the
longer term. This is especially true when
you focus on technology, a key element in
semiconductors. Here, it is warranted to
find a compromise between continuity
and change. Technology must serve a
purpose which is of major relevance for
our society, and move people and
markets. We make life easier, safer and
greener – with technology that achieves
more, consumes less and is accessible to
everyone. Microelectronics from Infineon
is the key to a better future. We primarily
set ourselves apart through innovation
and find substantially more room for
developing our strengths in growing
ELE Times: Which are the key sectors
where you are investing for solving
current challenges?
Vivek Mahajan: On a more general level,
we see three major challenges modern
societies are facing today: energy
efficiency, mobility and security. Why?
Electricity will remain our main source of
power in thefuture. But we must use it
more efficiently. Our semiconductor
technologies are building more efficiency
into the entire energy value chain – from
generation through transmission to
consumption. Everyone wants to be
mobile. But the increasing urbanization
and the pressing need to protect our
climate call for new forms of mobility.
Besides more energy-efficient cars, we
also need sustainable and affordable
concepts for localand long-distance travel.
Our daily lives are shaped by digital
services. And all modern communication
media – from the Internet to electronic
passports – must be safeguarded against
misuse to protect personal data. These are
three sectors in which we build up system
understanding so that we can now provide
solutions to our customers which set them
apart from their competition.
To give you an inside to our approach let’s
take the example of the major home
appliance (MHA) market: In 2011, out of
the estimated 420m units of electric
motor based home appliances, only about
20 percent are based on Variable Speed
Drive (VSD) technology. Growing demand
for MHA will put a strain on energy
supplies. The need for energy efficiency
will continue to drive VSD penetration rate
in MHA segment.
It is in this regards that we took shares in
LS Power Semitech Co., Ltd., a company
established in 2009 as a joint-venture of
Infineon and LS Industrial Systems in
Korea. The strategic acquisition increased
our global footprint in the growing market
segment of Intelligent Power Modules
(IPM) which enable higher energy
efficiency in consumer appliances such as
refrigerators, freezers, washing machines,
dryers, and air conditioners. In May 2015
we announced the acquisition of the
outstanding shares. The acquisition of
International Rectifier can also be seen in
this light. They have perfectly matched
with our portfolio to address the growing
demand for energy efficiency in MHA.
Thanks to these acquisitions Infineon in
2014 was ranked among the top-5 players
in the market for IPMs for the first time. In
this year,the market for IPMs amounted to
1.26 billion US-Dollars in total.
Complexities at product designing...
electronics engineers?
Samarth Agarwal: Even in the electronics
domain COMSOL has demonstrated that
complicated problems in optoelectronics
and mems can be handled using a
Multiphysics approach. These problems are
particularly involved because of the need to
understand different sub-disciplines in the
electronics domain. The capability of
COMSOL in electrical and electronics
engineering ranges from being able to treat
low frequency or DC to high frequency
problems in electromagnetism. The
semiconductor capability on the other had
allows analysis at the device physics level.
Geometrical ray tracing can be done using
the Ray optics capability. COMSOL is capable
of handling problems in EMI/EMC
(Electromagnetic interferenc/Electromagnetic compatibility) which involves simulating
electromagnetic energy generation and
propagation. More involved topics like
plasmonics where the interaction of
electromagnetic fields with electrons is
studied can also be attempted. The
electrical capability in COMSOL can not only
handle mixed simulations involving circuits
and devices, but it can also interface with
other circuit simulators. Finally other related
phenomena like heat transfer and thermal
expansion can be seamlessly integrated into
the electronics capability.
ELE Times: Please give a brief account of
the paper presented at COMSOL
Conference held at Pune.
Samarth Agarwal: Participation from the
ELE Times | 42 | January, 2016
COMSOL community has gone from
strength to strength, with over a 100
presentations from both industry and
academia being submitted at this year’s
conference held in Pune. Electromagnetism
and related topics seemed to be the most
popular area of work. The top academic
institutions from across the country were
well represented. The industry participation
was from several leading corporates and
government labs. The level of work can be
gauged from the fact that several of the
papers presented close comparisons
between simulations and experiments.
These presentations are now available
Four Quick Steps to Production
Using Model-Based Design for
Software-Defined Radio
Analog Devices / Xilinx SDR Rapid Prototyping Platform:
Its Capabilities, Benefits, and Tools
With the exponential growth in the ways and means by which people need to communicate, modifying radio devices
easily and cost effectively has become business critical. Based on this requirement, software-defined radio technology
has been widely employed recently since it brings the flexibility, cost efficiency, and power to drive communications
forward. The purpose of an SDR system is to implement as much as possible of the modulation/demodulation and data
processing algorithms in software and reprogrammable logic so that the communication system can be easily
reconfigured just by updating the software and the reprogrammable logic and not making any changes to the hardware
platform. With the advent of system on chip (SoC) devices like the Xilinx Zynq. All Programmable SoC that combine the
versatility of a CPU and the processing power of an FPGA, designers have the means to consolidate the data processing
functions of an SDR system into a single device while integrating additional processing tasks. Processing intensive tasks
like the data modulation/demodulation algorithms are offloaded to the programmable logic of the device while tasks like
data decoding and rendering, system monitoring and diagnosis and user interface are deferred to the processing unit.
At the same time, prototyping wireless systems has been a discussion topic for decades but has only in recent years
evolved into a complete design flow for FPGAs—from model creation to complete implementation—due to the evolution
of the modelling and simulation tools like MATLAB and Simulink from MathWorks. Prototyping wireless systems is
transforming the way engineers and scientists work by moving design tasks from the lab and field to the desktop. Now the
entire wireless system, such as an SDR system, can be modeled, allowing the engineer to
observe the system’s behavior and to tune it before it is actually implemented in the
field. This has several benefits, such as accelerating system integration and
reducing the dependency on equipment availability. Moreover, once the
Simulink model for the SDR system is complete, C and HDL code can be
generated automatically for implementation on Zynq SoCs, saving time
and avoiding the introduction of manually coded errors. The risk is
further reduced by linking the system model to a rapid prototyping
environment that allows the SDR system to be exercised under
real-world conditions.
This first part of the four part article series will discuss the
Analog Devices/Xilinx SDR rapid prototyping system, its
capabilities and benefits, and a brief description of the tool
flow. The article showcases how Analog Devices RF IC
technology and reference design hardware and software
require a reduced design skill subset, thus enabling
customers to mitigate risk and shorten their time to market.
By Di Pu, Andrei Cozma, and Tom Hill
ELE Times | 43 | January, 2016
Figure 1. Xilinx Zynq SoC block diagram
Zynq for SDR
Advanced SDR systems are required to execute a combination of
data processing, communication, and user interface tasks that
have different processing bandwidth requirements and real-time
constraints. The hardware platform chosen
to implement such a system must be robust
and scalable at the same time allowing for
future system improvements and expansion.
Xilinx Zynq-7000 All Programmable SoCs
fulfil these requirements by supplying a high
performance processing system combined
with programmable logic as shown in Figure
1. The combination of programmable logic
and processing system delivers superior
parallel processing power, real-time
performance, fast computational speeds,
and connectivity versatility.
The processing system side of the Zynq SoC
consists of a dual-core ARM Cortex-A9
processor combined with a NEON
coprocessor and floating-point extensions to
accelerate software execution. Embedded
Linux or real-time operating systems can be
deployed on the dual-core ARM processor
to fully benefit from the system’s
capabilities. The processor is self-contained
and can be used without the need to
configure the programmable logic, which is a critical element for
software developers who will want to start developing code in
parallel to hardware developers who will design the FPGA fabric.
On the programmable logic side, the device has up to 444,000
logic cells and 2,200 DSP slices that supply massive processing
bandwidth, allowing the Zynq device to tackle a variety of
challenging signal processing applications. Five high through-put
AMBA-4 AXI high speed interconnects tightly couple the
programmable logic to the processing system with the
equivalent of more than 3,000 pins of effective bandwidth.
AD9361 Agile Wideband RF Transceiver IC for SDR
In recent years, Analog Devices has brought to market
revolutionary SDR products to support increasingly evolving SDR
requirements and system architectures.
Some of the most important Analog
Devices products in this field are the
AD9361/ AD9364 integrated RF agile
transceivers. The AD9361 (2 × 2) and
AD9364 (1 × 1) are high performance,
highly integrated RF transceiver ICs
intended for use in SDR architectures in
applications such as wireless
communications infrastructure, defense
electronics systems, RF test equipment
and instrumentation, and general
software-defined radio plat-forms. The
devices combine an RF front end with a
flexible, mixed-signal baseband section
and integrated frequency synthesizers,
simplifying design-in by providing a
configurable digital interface to a processor or FPGA. The chips
operate in the 70 MHz to 6 GHz range, covering most licensed and
unlicensed bands, and support channel bandwidths from less than
200 kHz to 56 MHz by changing the sample rate, digital filters, and
decimation, all programmable within the AD9361 and AD9364
devices. Figure 2 shows the block diagram of a AD9361 device.
Figure 2. AD9361 block diagram.
In order to help customers shorten time to market and overall
development effort, Analog Devices has gone a step further by
providing SDR solutions within a complete ecosystem of seamless
FPGA connectivity, enabling a rapid prototyping and development
environment for complete radio system design. The ADFMCOMMSx-EBZ rapid development and prototyping boards are a
family of high speed analog FMC modules, incorporating AD9361
or AD9364 agile RF transceiver ICs or a discrete signal chain that
seamlessly connects to the Xilinx FPGA development platform
ecosystem. These boards are fully customizable by software
without any hardware changes and come with downloadable Linux
drivers and bare metal software drivers, schematics, board layout,
and design aid reference materials, all contained on their
ELE Times | 44 | January, 2016
Figure 3. ADI HDL and software infrastructure.
Zynq SDR Rapid Prototyping Platform
Reference Design
Together with the FMCOMMSx platforms,
Analog Devices provides a complete Vivado
framework, with a Linux and bare metal
software infrastructure that can be used both
for prototyping purposes as well as a part of the
final production system. Figure 3 shows the
Analog Devices Zynq Infrastruc-ture to support
the FMCOMMSx boards.
This high level diagram shows how the ADI
reference design is partitioned on a Xilinx Zynq
SoC. An HDMI output is used to display the
Linux interface on a monitor while a keyboard
and mouse can be connected to the system on a
USB 2.0 port. The ARM Cortex-A9 processing
system runs Ubuntu Linux provided by Analog
Devices. This includes the Linux IIO drivers needed to interface
with the Analog Devices FMCOMMS hard-ware, the IIO
Oscilloscope (Scope) user space application for monitoring and
control, a libiio server that allows real -time data acquisition and
system control over TCP together with clients running on a
remote computer, and optional user applications that
incorporate C code generated by the Embedded Coder for the
controller’s Simulink model.
Software Infrastructure
All ADI Linux drivers are based on the Linux Industrial I/O (IIO)
subsystem, which is now included in all mainline Linux kernels.
The IIO Scope is an open-source Linux application developed by
Analog Devices that runs on the dual ARM Cortex-A9 cores
inside the Xilinx Zynq and has the ability to display real-time data
acquired from any Analog Devices FMC card connected to the
Xilinx Zynq platform. The data can be displayed either as a time
domain, frequency domain, or constellation plot. Different
popular file formats like comma separated values or .mat
MATLAB data files are supported to save the captured data for
further analysis. The IIO Scope provides a graphical user
interface for changing or reading back the configuration of the
Analog Devices FMC cards. The libiio server allows real-time data
acquisition and system control over transmission control protocol
(TCP) together with clients running on a remote computer. The
server runs on an embedded target under Linux and manages realtime data exchange over TCP between the target and a remote
client. This library abstracts the low level details of the hardware,
and provides a simple yet complete programming interface that
can be used for advanced projects. Its modular architecture, well
designed API, and built-in network capabilities allow the users to
create applications that will run on the system not only where the
IIO devices are connected, but also remotely through the network.
At first targeted at Linux, it can now be used under Windows as
well by using the remote back end of the library. Written in C and
licensed under the LGPL, it features bindings for C#, Python, and
MATLAB. A MathWorks IIO client is available as a system object to
be integrated in native MATLAB and Simulink applications. It is
designed to exchange data over Ethernet with an ADI hardware
system connected to a FPGA/SoC platform running the ADI Linux
distribution, which enables a MATLAB or Simulink model to
perform the following functions:
• Stream data to and from a target
• Control the settings of a target
• Monitor different target parameters
Figure 4. Screen capture of the beacon frame receiver example.
The IIO System Object is available in both MATLAB and Simulink,
depending on whether the user calls it from a MATLAB script or
incorporates it into a MATLAB System Block. The Linux software
and HDL infrastructure provided by ADI for the FMCOMMS
platforms is a great environment for proto-typing SDR applications
together with the tools provided by MathWorks and Xilinx, and it
also contains production ready components that can be integrated
into the SDR system— helping to reduce the time and cost needed
to move from concept to production.
In order to help customers ramp up quickly and easily with the IIO
System Object, we provide several MATLAB and Simulink examples
based on this interface, such as a beacon frame receiver, QPSK
transmitter and receiver, as well as a LTE transmitter and receiver.
In these examples, FMCOM-MSx platforms are configured by IIO
System Object, and are used as RF front ends, which transmit or
receive the analog signals over the air. These signals are streamed
to or from the target via the IIO System Object. All the other signal
pro-cessing happens in MATLAB or Simulink. Figure 4 is a screen
capture of the beacon frame receiver example, which shows a
typical connection between the IIO System Object and the other
Simulink blocks.
ELE Times | 45 | January, 2016
respective Analog Devices wiki sites. Table 1 summarizes the
features of the different FMCOMMSx platforms.
Developing Effective Design
Strategies for Today’s Wearable Devices
Warren Kurisu, Director of Product Management, Mentor Graphics Embedded Systems Division
Comprehensive Power Management
As the next wave of wearable devices expands into a new class of
revolutionary and innovative products, there will be a growing
importance placed on the real-time operating system (RTOS) and
corresponding middleware. Wearable System-on-Chip (SoC)
processors require an operating system optimized for size and
performance with power-efficient wireless connectivity options
needed for machine-to-machine (M2M) communication and
cloud connectivity. A full-featured RTOS which includes a variety
of power management techniques is of the upmost importance.
The Mentor Graphics Nucleus RTOS is one such operating system
that offers a variety of power saving and power management
capabilities. Two key power management capabilities supported
by Nucleus are the Nucleus native power management
framework and the Mentor Embedded Multicore Framework.
This paper examines how a full-featured RTOS can assist
developers in the areas of extending battery life, designing within
multicore/multi-OS environments, and other areas relating to
embedded system power management which include scalability,
space partitioning, and connectivity.
Extending Battery Life
Battery life has long been an important feature for connected and
wearable devices as the end-user has very little patience for
energy-hog gadgets requiring frequent recharging cycles. The
current generation of wearables is placing new demands on
reducing power consumption at a time when software complexity
is rapidly increasing under system resource constraints of the
wearable device.
From a business perspective, companies face enormous pressure
to reduce development costs and shorten time-to-market with
their devices in this increasingly crowded and competitive space.
Also, leveraging software investments and minimizing costs in
follow-on product versions utilizing updated hardware
technologies is key to the success of any wearables product line.
Nucleus RTOS is the first real-time operating system with a built-in
native power management framework designed to take
advantage of the power management features now present in
wearable SoCs. This framework allows developers to immediately
address critical power issues without requiring developers to
invest enormous amounts of time developing the power
management software themselves. The Nucleus power
management framework enables software developers to manage
the power state for each peripheral, set of peripherals, or system,
using simple high-level application programming interface (API)
Just as modern software architectures abstract hardware
functions through device drivers, the Nucleus power
ELE Times | 46 | January, 2016
With a power management framework, software developers can
effectively write code to meet power requirements without
spending precious development cycles that could result in code
bloat (Figure 2) or increasing the size of the memory footprint. A
word about bare metal: Bare metal is usually considered more
efficient because it is so lightweight. However, the amount of code
required to move devices in and out of various power states is
complex and can add code bloat without an established
framework. For example, taking the Wi-Fi off-line for a transition
requires code to ensure the buffers are empty for each TCP/UDP
socket, as well as IP management queues. And, the buffer
descriptors for each protocol level down to the direct memory
access (DMA) state must be verified before the Wi-Fi can be taken
off-line. This code is complex and can often be difficult to test.
Just as important, the Nucleus power management framework
allows software developers to consider power specifications early
in the software design cycle and enables them to define power
states which can then be managed through the power
management framework (Figure 3). Code can be written to
minimize both the footprint and power consumption – and tested
throughout the development process to ensure power
requirements are achieved.
Designing and Working within Multicore/MultiOS Architectures
Figure 1: At the center of a power management framework is the
device manager capability which coordinates the transition of all
devices during a change to a low-power state.
Figure 2: Source lines of code: comparison between bare metal,
standard RTOS, and Nucleus RTOS with power management features.
Oftentimes, developers end up with far more code when working in a
bare metal environment.
Wearable SoC architectures are evolving rapidly to integrate more
application-class and microcontroller-class cores on a single piece
of silicon. System architects see a tremendous opportunity to
consolidate and extend functions on these heterogeneous
multicore processors, but are finding that consolidation of
heterogeneous operating environments on a single SoC presents
some unique architectural and development challenges. With this
type of dynamic, it’s also more difficult for developers to utilize the
power-saving capabilities available in the underlying hardware.
While symmetric multiprocessing (SMP) operating architectures
allow load balancing of the application workload across
homogeneous processors within the multicore infrastructure, they
do not scale to heterogeneous cores. Further, while asymmetric
multiprocessing (AMP) system architectures are increasingly
required, there is a lack of accepted standards and software design
paradigms to take full advantage of AMP architectures. Having
certain mechanisms in place enables AMP applications to
efficiently leverage parallelism offered by the heterogeneous
processors present in a multicore configuration. Mentor’s
multicore framework was designed specifically for these
challenges and offers architects a light-weight methodology to
quickly begin AMP architectural development.
The Mentor Embedded Multicore Framework
Figure 3: The Nucleus power management framework can be used to
define and manage system power budgets, as in this medical
wearable device example.
To address AMP complexities, the Mentor Embedded Multicore
Framework (enabling AMP with the Nucleus RTOS, Mentor
Embedded Linux, bare metal environments, and the Mentor
Embedded Hypervisor) allows developers to configure and deploy
multiple operating systems and applications across heterogeneous
processor cores. This comprehensive framework enables
developers to manage the many challenges associated with interprocess communication (IPC), resource management and sharing,
booting, process control, debugging, and application optimization
within a heterogeneous multicore environment by supporting
native, virtualized, and trusted configurations of multiple operating
ELE Times | 47 | January, 2016
management framework (Figure 1) provides a structured
mechanism for all system devices to be controlled using intuitive
API calls. Any alteration of one device that impacts other devices
results in a coordinated transition across all involved subsystems.
The power management framework approaches the
conservation of power usage from four different directions:
• System states used to control peripheral power.
• Dynamic Voltage Frequency Scaling (DVFS) focuses on the
entire system.
• Idle power management prevents expending energy without
an ascertainable goal.
• Hibernate/sleep modes allow the system to go off-line during
long periods of inactivity.
Components of the multicore framework include:
Inter-Process Communication (IPC)
Once the master processor OS and application stack are running,
many use cases require communication with other parts of the
system. The multicore framework provides a cleanroom,
proprietary implementation of an open source remote processor
messaging feature (referred to as rpmsg) to establish a
communications channel between the master operating system
and the remote operating systems. In this way, data can be
passed back and forth between the two in an inter processor
communication channel (Figure 4).
Processor Lifecycle Control and Management
Assuming control over a remote processor, and then starting or
stopping an OS and/or application stack within that remote
processor, is referred to as remote processor lifecycle
management. The Linux community has adopted a remote
processor framework (remoteproc) for managing this scenario in
an open source environment and now this technology is part of
the Mentor multicore framework. Remoteproc allows a master
operating system to bring up other operating systems on other
processor cores in the same SoC.
The remoteproc feature within Mentor’s multicore framework
(Figure 5) allows remoteproc interoperability between numerous,
disparate operating systems, such as Mentor Embedded Linux,
Nucleus RTOS, and bare metal environments. A key benefit to
remote processor lifecycle management is reduced power
consumption. The remote processor stays in a low power state
when not in use, which is a critical design requirement for
wearables. When the use case of the wearable device requires
more powerful processing tasks, remoteproc is used to bring up
the remote processor, which increases the power consumption
only for the duration of that activity.
Simplified Booting
Figure 4: The inter processor communication (IPC) channel allows data
to passed between the master OS (core 0) and the remote OS (core 1)
allowing for buffer allocation, payload prioritization, and
configuration from device trees.
The transport layer that enables both remote processor lifecycle
management and interprocess communication is made possible
by VirtIO. VirtIO is a virtualization standard for high performance
input/output device drivers widely adopted in virtualized Linux
environments. This same technology has now been imported
and tested and is fully operational in an RTOS environment,
allowing a seamless system IPC mechanism that interoperates
between proprietary and open source environments.
Booting a heterogeneous system is also not as simple as booting
an OS on a unicore or homogeneous multicore processor. One
needs a way to manage the booting of operating systems across
the various cores, and to manage the applications that run on
those processors. For example, performance requirements may
dictate a certain boot order of the components. The multicore
framework feature provides the capabilities to manage the booting
of operating systems and applications across heterogeneous cores
through the support for the remoteproc which can be used for
open source, RTOS, and even bare metal implementations.
Visualization into a Multicore System
In order to optimize performance and power consumption,
developers can benefit by having a way in which to visualize how
the heterogeneous components interact in the consolidated
heterogeneous system. Because the systems are consolidated on
shared hardware, chances of running into resource contention and
bottlenecks are increased, which can hinder performance, and
create unnecessary processing cycles and power consumption.
Developers need tools that can help them identify those
contentions and bottlenecks, and then quickly find solutions to the
problems. Sourcery CodeBench with built-in Sourcery Analyzer has
been integrated into the multicore framework. This means various
runtime systems and graphics components, along with virtualized
guest runtimes and corresponding applications can be visualized
on a single common timeline.
Figure 5: Remote processor lifecycle management allows the master
OS (core 0) to bring up other OSes on other cores.
Small, battery-powered wearables require highly efficient methods
that consume minimal resources and are amicable to minimizing
power modes. Nucleus RTOS allows common applications to span
not only a wide variety of peripheral combinations, but also allows
applications to be transportable across different processor
variations, families, and architectures. A reduced feature version of
an application can share the same environment on an MCU device
as a full-featured version would experience on a high-performance
MPU platform.
ELE Times | 48 | January, 2016
Although there are plenty of commercial RTOSes to choose from,
many of these RTOSes do not provide a mechanism for
embedded developers to design software that can take
advantage of spatial (memory) partitioning. With spatial
partitioning built into the operating system, Protected Protected
Protected Protected the MPU can be easily configured at
runtime Memory Memory Memory Memory to establish
memory regions in both kernel and user space. Intuitive APIs can
be used to Process Process Library Library load processes at
runtime or dynamically based on the use-case during execution.
Nucleus employs a light-weight approach to a process model
(Figure 6).
challenges associated with wireless connectivity to support M2M
communication and cloud integration can be a critical factor on
whether a product makes it to market on time, or if the product
launches at all. This is especially true for wearable systems with
complex applications that use multiple wireless connections or
multiple profiles on a single device. The networking features in
Nucleus incorporate a wide range of standards-compliant
networking and communication protocols designed exclusively for
wearables supporting Wi-Fi, Bluetooth, USB 2.0/3.0, and lowpower options such as Bluetooth Low Energy (BLE) and 6LoWPAN
over 802.15.4. Nucleus RTOS supports an array of chipsets and
SoCs and its modular and highly structured organization provides
for the ability to install additional software protocols as SoC
requirements change.
It’s quite common for wireless connectivity technologies to change
over the lifetime of a wearable device. The introduction of
Bluetooth Low Energy (BLE) is just one example. It’s even possible
that a new wireless technology will be introduced during the
development cycle of a wearable design. Some wireless
technologies and their distinct advantages and requirements are
outlined in (Figure 7).
Figure 6: The Nucleus process model offers increased device reliability
by providing hardware-enforced fault isolation.
The MPU in the ARM Cortex-M3/M4-based Nucleus RTOS SoCs
can be used for spatial domain partition- ing without the need
(or overhead) to virtualize memory. Processes can be loaded
directly into Networking GUI File Peripheral Systems Bus Drives
memory from ROM or Flash. And with prelinked embedding,
processes can execute in Flash, which is a feature commonly
required in MCUs with very limited RAM. Utilization of the MPU
for process separation in Cortex-M-based SoCs, Ethernet / LCD
Storage Connectivity Wireless provides embedded developers
with a powerful Protected Memory feature to design embedded
systems for wearables that gives the perception of a system
being much larger on the outside than what Figure 6: The
Nucleus process model offers increased device reliability by is
actually available on the inside, since providing hardwareenforced fault isolation. applications can be dynamically loaded
depending on the current demands on the wearable by the user.
The ability to dynamically load processes in this manner allows
the wearables designer to select hardware with minimum
processing power and memory, which not only saves on cost,
but also minimizes power consumption.
Figure 7: The more common wireless links used in today’s wearables.
Ethernet included as a comparison.
6LoWPAN IPv6 over Low Power Wireless Personal Area Networks
(or 6LoWPAN) is a networking connectivity technology connecting
wearables to each other and to the cloud. 6LoWPAN’s low-power,
IP-driven nodes, and large mesh network support make it an ideal
connectivity technology for not only wearables, but for a variety of
IoT applications. It supports Layer 2 packet forwarding over
multiple radio hops and is compatible with Ethernet, Wi-Fi, 3G,
and satellite.
Constrained Application Protocol (CoAP) is an application-layer
protocol for simple, low-power connected devices allowing a
device to communicate interactively over the Internet. CoAP is
especially suited for devices such as wearables. CoAP is ideal for
limited Flash or RAM requirements and supports DTLS for
communications security.
For wearable embedded systems, eliminating the design
ELE Times | 49 | January, 2016
Space Partitioning
Vol 2
Issue 01
January 2016
Aerospace researchers are pursuing diverse means of endowing space systems with
the intelligence, autonomy, and adaptability needed to overcome a range of future threats
Shailesh Shukla | ELE Times
s the cyber threat evolves and the incidence of
attacks increases, maintaining preparedness and
situational awareness is vitally important.
Customised malware, DDoS attacks and the vulnerabilities
of mobile and enterprise networks all present real
While we progress through IT and make a more digitalised
army, the danger is of disruption through cyber attacks by
the enemy. We need to enhance our capabilities to ensure
that they are protected from such disruptive cyber attacks
or cyber manipulations. Stating that the future wars might
be fought in the cyberspace, Defence Minister Manohar
Parrikar warned the Army against "information blackout"
as he sought enhanced capabilities to ensure protection
from disruptive cyber attacks or manipulations.
Information corruption and information overload can be
another danger to the platform which we use. India as a
nation will be interacting with increasingly fraught with
turbulence and will call for dominant military might. India
needs to develop technology and system appropriate to
evolving military doctrine.
Information Technology (IT) has an important role to play
because future wars may be cyber wars. Though boots on
the ground cannot be replaced but they can be equipped
with equipment which will provide them with all the
information to fight with a well decided and well planned
way without getting interrupted.
The terrorist organizations like ISIS are one of the best
users of internet technology for promoting their cause. It is
explicitly evident from the fact that the Lashkar-e-Toiba,
Hizb-ul-Mujahideen, the Haqqanis, ISIS and al-Qaeda pose
a very potent threat to India security in the cyberspace. As
threats continue to mount, understanding and managing
cybersecurity risks have become top of mind for leaders in
business and government. Nations and organisations are
responding by taking action. Increasingly, they are
adopting innovative technologies like cloud-enabled
cybersecurity, Big Data analytics and advanced
authentication to reduce cyber-risks and improve
cybersecurity programmes.
ELE Times | 50 | January, 2016
Aerospace Threat
Virtual machines offer some interesting capabilities. They can
be started and stopped on demand, or paused and unloaded.
The state of the paused machine can be saved as a snapshot
that can later be reloaded and execution resumed. This
capability provides a great benefit for forensic operations: if
an attack is detected, a snapshot can be created and
inspected before any malware has a chance to cover its tracks.
Virtual machines have proved invaluable to malware research
and analysis because they can be used to create a quarantined
area for the study of malware execution. The malware can be
observed without risk of spreading or infecting real systems.
While virtualization has many benefits, it also carries some
associated risk. For example, what were formerly multiple
operating system instances on distinct pieces of hardware
become virtual machines on a single physical machine. Thus, a
single hardware failure can affect multiple virtual machines.
All software has bugs, and hypervisors are no exception. If an
attacker can exploit a bug in the hypervisor, he gains control of
all virtual machines hosted on that server. What was formerly
the compromise of a single server now extends to many. The
weak link of a single virtual machine has the potential to affect
many more.
Aerospace has been active in the area of virtualization for
many years. Initial efforts focused on defining data and system
architectures to use as baselines for empirical studies. This
work later led to the creation of a virtualization test bed in
which to build and test secure virtualized applications. Some
Aerospace research has focused on virtualization as a tool and
not an end in itself. Researchers are investigating, for example,
how functional components could be isolated into virtual
machines so that a failure of one would not take down the
entire system. In such a setup, malfunctioning components
could be restarted with the goal of seamless operation.
Growth Regions
ELE Times | 51 | January, 2016
Global cyber security market for the defence industry is
expected to grow significantly over the next decade. Huge
investments in cloud network security solutions applicable for
the battle field management, data protection, and wireless
security solutions along with development of network security
and cloud security software stands out as the key factors
contributing to the growth of cyber security market for the
defence sector.
One of the major trends in the Global Aviation Cyber Security
Market is the increased demand for cloud-based security
solutions. Budget constraints and a lack of available resources
and expertise are some of the main challenges for companies
managing standalone or integrated network components. This
is causing many organizations to look to cloud-based IT
security solutions that are cost-effective, comply with PCI DSS
regulations, and offer round-the-clock system monitoring.
Demand for Cloud-based Security Solutions
Encouraged by patterns carried out on a larger scale recently,
researchers believe digital steganography has arrived as a
legitimate method for attackers to use when it comes to
obscuring communication between command and control
servers. Steganography, or the art of hiding information inside
media, isn’t a particularly new concept, but the researchers
claim that malware programmers and operators appear taken
with the technique as of late.
Attackers Embracing Steganography to Hide
The defence industry has changed dynamically over the past
decade. Threats from conventional insurgent activities are no
longer the only concerns for the defence industry.
Advancement in the field of information technology, upgradation of existing weapons with intelligence, surveillance,
and reconnaissance systems along with increasing volume of
classified data gathered systems have necessitated the usage
of reliable and enhanced cyber security solutions for the
defence industry.
The aerospace, defense, and intelligence verticals are
considered one of the most complex and integrated systems
of information and communications technology (ICT) globally
and are the most potential target for large-scale cyberattacks. With the continual and rapid integration of new
technologies, aviation industry keeps expanding, changing,
and becoming increasingly connected, however, so do our
adversaries and their threats. And without the appropriate
cyber security measures in place for this evolving threat, the
industry may be at high risk.
The computer based systems is used in almost every aspect of
civil aviation operations – ranging from sophisticated air
navigation systems, on-board aircraft control and
communications systems, airport ground systems including
flight information and security screening, to simply inventory
and day-today office data management systems and have
been going on for many years now. Similarly, cyber threats
such as computer viruses and more malicious deliberate
attacks on computer systems by hackers and other adversaries
are not new occurrences.
Hacked medical devices may be the biggest cyber security
threat in 2016. through insulin pumps and pacemakers,
hackers could hold your life ransom. Hackers have been using
ransom ware - a type of malware in which attackers can steal
or delete the contents of users’ computers if they don’t pay a
ransom. Now, it seems, the same tactic may be used on
insulin pumps and pacemakers.
Market Players
The companies catering to the cyber security market can be
broadly classified into security vendors, and defence
companies. Security vendors consist of companies engaged in
designing, manufacturing, and delivering information security
products, services, and solutions to the defence and
government organisations. Cisco Systems Inc., IBM
Corporation, Intel Security Group, Dell SecureWorks Inc.,
Symantec Corporation, and Verizon Communications Inc., are
some of the most prominent security vendors in the cyber
security market. Defence companies engaged in developing
cyber security solutions consists of leading players in the
defence industry engaged in developing network security
solutions and software to prevent cyber-attacks on military
software systems. BAE Systems Plc, General Dynamics
Corporation, Finmeccanica S.p.A., Lockheed Martin
Corporation, Northrop Grumman Corporation, Raytheon
Company, and Thales Group are some of the leading defence
companies engaged in manufacturing such solutions, globally.
Cybersecurity Market in India
Commercial impacts to the businesses due to Cyber-attacks
are costing more than $400 billion yearly. Market research
firm Gartner says global spending on IT security is set to
increase 8.2 percent in 2015 to $77 billion, while India has the
world’s second largest population, and a very small
cybersecurity economy. But it is a nation to watch for
cybersecurity market growth. According to a PwC report
India’s cyber security market size in India will jump to $1
billion USD in 2015 (from an estimated $500 million USD last
year) which is anticipating as 100 percent year-over-year
growth. The aviation sector is currently seeing high demand
for cyber security solutions to protect critical information and
detect, monitor, report and counter cyber threats while
maintaining the integrity of IT systems. While aviation only
accounted for 2.32 percent share of the overall cyber security
market in 2014, the Global Aviation Cyber Security market is
witnessing significant growth and is expected to grow at a
CAGR of 5.94 percent from 2014-2019.
Upcoming Trends
The current cyber security market encompasses a variety of
solutions ranging from network security solution to endpoint
security, application security, content security, cloud security,
and wireless security solutions. These solutions have the
capability to perform individual tasks and can be integrated
together to form a strong line of defence against sophisticated
threats in a multi-layered fashion. Sophistication of cyberattacks from worms and viruses to enhanced techniques such
as zero-day attack, Dynamic Trojan Horse Network (DTHN)
Internet worm, and Stealth Bot led the cyber security vendors
to design upgraded security software and solutions such as
the Integrating Basic Unified Threat Management systems,
Security of Information Management (SIM) software
solutions, network flow analysis, Next-Generation Firewalls
(NGFWs), Security Information and Event Management
(SIEM), white listing, and DDoS mitigation techniques.
Rising threat of cyber-attacks to critical infrastructures by
organised criminal groups along with technological
advancement in the cyber security market remains as the key
driver for the growth of cyber security solutions for the
defence industry. The defence and the homeland security
agencies are expected to cover around 40% share of the
global cyber security market in 2015. Growth in investments
on military programs and allocation of resources for research
and development of cyber security solution for the battle field
communication systems is expected to remain as the most
upcoming trends in the cyber security market for the defence
industry over the coming years.
Emerging technologies have the potential to change the way
information assurance and mission resilience are achieved.
The Aerospace agencies have been investigating various
technologies that may eventually influence the development
of space and cyber systems. Some of these include virtualized
computers, protected terrestrial networks, cognitive radios,
and biologically inspired mechanisms. These technologies may
seem unrelated, but when considered collectively, they
suggest the sort of grand synthesis that space and cyber
systems will need to achieve in the coming years.
Traditionally, computer hardware runs a single operating
system that runs user applications. Virtualization inserts
another layer of software between the hardware and
operating system, a “hypervisor.” The hypervisor implements
and manages virtual machines, which allow the installation of
operating systems and associated applications. The hypervisor
manages and allocates the physical hardware to support
concurrent operation of multiple virtual machines and
therefore multiple operating systems. Each virtual machine is
partitioned from the others to prevent interference.
Virtualization is a powerful technology with many
applications. It is a fundamental part of cloud computing,
providing the flexibility to handle dynamic workloads. But as
with any technology, there is a cost in terms of price,
performance, and risk. These need to be considered when
deciding if virtualization is the correct tool for the job.
Using Satellites to Protect Terrestrial
ELE Times | 52 | January, 2016
The need to protect networks from advanced cyber threats
has led companies worldwide to adopt multiple security
solutions, which has increased the complexity of IT
infrastructure. To mitigate the effects of such complex
infrastructure, companies are opting for converged security
solutions, which is boosting the market for solutions like
unified threat management and next-generation firewalls.
National Cyber Coordination Centre
While the defence industry tends to be program focused and
slow moving, the cyber security market is technology driven
and is growing very rapidly. With increasing dependency on
internet network by the military organisations, the frequency
of sophisticated and organised cyber-attacks is on the rise.
Hence, the major focus of security vendors and defence
organisations in the cyber security market should be to design
enhanced cloud computing solutions, operating systems, and
virtual machine technologies aided with highly reliable and
breach free software systems with an aim to defend their
cyber space against cyber-attacks from clandestine state and
non-state activist groups in the near future.
Government of India has approved setting up of the National
Cyber Coordination Centre (NCCC), which will screen online
threats and coordinate with the intelligence agencies to
handle issues related to the national security. Elaborating on
its structure, the official said that the instructions are to
create a group of cyber security professionals and experts
who will look after the functioning of the centre and track
illegal and terror activities online. This centre will have top
experts from the field and it will be run like similar
organisation in other countries such as the US, the UK, France,
Germany, etc. NCCC is expected to coordinate between
intelligence agencies, specifically during network intrusions
and cyber attacks.
Using Biology to Inspire Cybersecurity
Technological Convergence
The U.S. military’s trend toward more combat units comprised
of smaller teams has generated an unprecedented increase in
the number of required communication links. To meet the
increased demand, the military relies on unhardened,
commercial satellites. A recent study reported that 21 out of
50 ground-to-commercial-satellite interference incidents
could not be accounted for. On the basis of geographic
location and transmission type, the authors concluded that
intentional jamming was a likely cause. In a sense, jamming
represents a denial of the cyber domain and is therefore a
form of cyber warfare that targets the physical layer of a
communication system.
Cognitive Technologies
to autonomously monitor their operational environment and
adapt accordingly. Aerospace has been investigating how the
study of biological systems can lead to greater autonomy and
adaptability in cyber systems. More specifically, researchers
are examining whether the means by which a biological
system recognizes and protects itself can have implications for
In addition to research into virtualized machines, Aerospace
has been exploring the dynamics and security implications of
controlling large networks. The Internet, for example, is not
actually a single network, but an aggregation of smaller,
autonomously managed networks (known as domains)
connected in such a way that a user of one domain can
communicate with a user in any other domain. The key to this
universal connectivity is that all of the routers—the switching
devices that bridge two or more networks—must
collaboratively teach each other how best to forward traffic.
ELE Times | 53 | January, 2016
Algorithms known as problem managers use the Wrappings
descriptions to determine which resources to use, how to
combine them, and how to organize the system’s
computational resources in response to problems posed to it.
In practice, several problem managers might operate on a
problem. A primary benefit of cognitive radios is their ability
Paving the way for technologies of the future
Shloka Chauhan | ELE Times
he market for flexible electronics is growing
exponentially. According to estimates the current
market is set at one billion dollars; which is going to
rise to 45 billion dollars by 2016.This estimated meteoric rise
in the market for flexible electronics is the due to the
unprecedented, life-altering potential of these flexible
electronics and the extensive research and development that
is going on in this extraordinary field if innovation.
Flexible electronics are electronics that are not only durable,
but pliant as well, that can twist and bend and fold, like a
contortionist, according to our needs and our will. In this
technology, organic electronic components are mounted on
pliable, conductive, plastic substrates or are printed on
polyester or other materials; to make the whole thing or
parts of it flexible and bendable. It allows more components
to be packed or printed in a circuit than normal.
Flexible electronics are paving the way for a future with
flexible displays and smart textiles, a future where you could
stretch your charger chord to any length and then compress it
back according to your need, or where you could carry
foldable flexible displays that could fold out as large as a
television, or where you could have foldable and flexible
photovoltaic cells and reconfigurable antennas- that would
conform to the roofs and trunks of your cars to power them,
or sown to your clothes or bags- to charge your phones while
you are walking on the street, and to make sure that you are
online no matter what remote destination you are in. The list
of potential technologies and innovative devices and
equipments that flexible electronics is going to bring into our
lives, is endless.
Along with these innovations flexible electronics is also going
to bring us cheap, scalable, wearable communication devices
that will be rugged and durable, bendable and foldable.
Researchers are developing the technology through which
electronic components would be printed on long plastic
sheets, in an assembly line, as they move through a factory. A
printer would do this by applying different inks onto the film.
“As the inks dried, they would turn into wires, transistors,
capacitors, LEDs and all the other things needed to make
displays and circuits”, as Thomas N. Jackson, the Robert E.
Kirby Chair Professor of Electrical Engineering at Penn State
University explains on the Penn State University website.
Flexible electronics is going to change the basics of how
electronics are made. Printed electronics is going to
completely transform the electronics manufacturing sector by
lowering production costs significantly. Conventional
semiconductors require complex processes and multi-billion
dollar foundries but if they were to be printed on plastics the
same way ink is printed on newspapers the cost of
production will go down drastically.
ELE Times | 54 | January, 2016
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Future Technology
The potential applications and future
Flexible electronics are going to have a wide range of applications
because of its adaptability and conductivity. These preliminary
R&D’s are something that is going to start a chain reaction which
will see the growth of revolutionary future technologies that will
have huge commercial applications. Here’s a look at some future
technologies and innovations that are soon going to be realised,
because of flexible electronics-
The future innovations that flexible
electronics will bring will have the potential
to make the lame walk and the blind to see
1:In Medicine and health
Consider surgery to remove a tumor from a patient's liver. Even
after following up with radiation or chemotherapy, the surgeon is
never sure if the treatment was successful. But now through
flexible electronics doctors could image the cancerous tissue and
clearly see if there is a new malignancy, and then wirelessly
release a drug directly onto the spot or heat up that tissue to kill
the malignant cells.
A research team at MIT ha35s developed a highly versatile matrix
of stretchy hydrogel that can incorporate electronics, and has
various potential uses in healthcare. They have designed hydrogel
in a way for it to possess similar mechanical and physiological
use electronic implants to emit light in order to manipulate neural
circuits in the brain and the spinal cord to reduce pain.
Researchers at Washington University in St. Louis have been
testing these implants on mice and have got excellent results in
mapping sensory information in the spinal cord.
2:In prosthetics
Our smart phones and other electronic
devices will now not only be durable but also
bendable, foldable and potentially rollable,
not to mention cheap
properties as the brain, which will allow electronics to be
implanted into our bodies and even our brain. An envelope of
hydrogel will allow for the implants to behave like smart tissues
that would relay information and perform diagnostic functions.
Researchers are also in the process of developing electronic
implants that will be soft and flexible and tissue-like in its
structure, which would make it easier for electronic tags to be
implanted. These implants can be left in the body for long periods
of time. They could then be used to not only to monitor the
health of patients but to take action and release medicine and
Treating chronic pain is also going to get easier, thanks to flexible
electronics. Researchers in the field of Optogenetics are hoping to
Research and the use of flexible electronics in the field of
prostheses is going to make captain hook even more ridiculous
and alien to the children of today, the days of metal-hook hands
and wooden legs are long over. Robotic limbs have changed the
lives of millions of amputees, they have allowed amputees to
walk and carry on daily tasks. But robotic limbs don’t come close
to the real things that give us the sense of touch along with the
usual paraphernalia of uses and functions. Engineers at Stanford
University and the Palo Alto Research Center have created a
plastic skin-like material that can detect pressure and deliver a
Morse code-like signal directly to a living brain cell. This skin can
be added to artificial limbs that may allow a person with a
prosthetic hand to actually feel a handshake.
The engineers have created artificial mechanoreceptors that
mimic the complex process through which our skin detects the
sense of touch. To the prosthetic “skin,” the scientists combined a
pressure sensor with a flexible circuit layer that produces
electrical pulses. The sensors are made of flexible pyramidshaped nanotubes that funnel electric currents to the circuit
layer. The circuit layer, made of plastic, is created from ink-jet
printing. When pressure increases, the nanotubes compress and
electricity flows through the sensors and the circuit layer. This
produces electrical pulses, and the number of pulses is
determined by the level of pressure—just as mechanoreceptors
work in real skin.
The researchers tested their design by connecting a prosthetic
hand fitted with their artificial “skin” to a slice of brain from a
mouse. They genetically engineered the neurons in the brain that
normally react to touch, so they would also react to light. The
scientists found that light stimulation to the skin produced
neuronal activity. The researchers say this indicates that the manmade material would potentially be able to transmit physical
sensation as well. “If the brain is following the light pulses, that
ELE Times | 56 | January, 2016
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Future Technology
mean the brain understood the information,” explains Zhenan
Bao, a professor of chemical engineering at Stanford and the
lead author on the paper.
“The next step we want is to do such experiments in live
animals, and increase the complexity to add other sensing
functionalities,” says Bao. That could mean creating skin that can
feel temperature or texture rather than just pressure. “But how
humans will actually react and how the signal will be
perceived—that requires experiments in the future.” Research in
this field is going to be a boon for paraplegics.
3: Making Structures safer
If you have a fear of flying then rest assured, you were born in
the right century. Innovations in flexible electronics is going to
make your life much safer, flexible electronics is going to
facilitate the production of sensors that could be attached to the
curved surfaces of airplanes which could monitor the state of
the aircraft and morph to adapt to changing flight conditions.
Similarly flexible, smart and super-durable sensors could be built
that could be attached to the blades of colossal windmills and on
bridges. These flexible sensors would monitor the vibrations of
the wind-mills, bridges and dams and warn us when these
structures needed maintenance.
Researchers have been developing very tiny flying drones that
could find potential use in surveillance. These tiny drones have
been modelled on miniscule insects, like the housefly. These spy
drones also have the 360 degree vision of insects to help them
from colliding into buildings and electric poles. Insect-like
miniature robots are no longer some fantasy technology that you
only find in sci-fi Hollywood movies and comic books.
These drones will have miniature navigation systems that would
use flexible electronics to fit the components into the confined
space, and will have small and lightweight, flexible digital
cameras, which will be highly sensitive to light changes as they
move to alert them of any obstacles in their way. These drones
will also have sensors, weighing only two milligrams which will
take up only two cubic millimetres, and will be able to detect
motion in conditions ranging from a poorly lit room to very
bright sunlight outdoors—three times faster than fast flying
5: Solar power
Organic solar cells that use organic flexible electronics will
provide a pathway toward low-cost, clean energy. These solar
cells will be lightweight and mechanically flexible, making it
possible, to integrate them into curved surfaces, and possibly
making them rollable and foldable increasing access and making
them easier to use. This will allow more and more people to
satisfy their domestic electric power needs through this cheap,
renewable and convenient source.
6: Wearable electronic devices
OLED displays have already been making a buzz in the
electronics arenas for a while now and they have opened the
gates for flexible electronics to have large scale commercial
applications. OLED’s consist of organic semiconductors
approximately 100 nm thick, that emit light due to the
electroluminescence. While regular LEDs are usually fabricated on
a glass substrate which makes them rigid and non-bendable, but
by replacing glass with a flexible plastic such as polyethylene
terephthalate (PET) among others, OLEDs become bendable and
Now, academics at the University of Manchester, have come up
with communication devices such as mobile phones and
healthcare monitors, made of cheap, flexible, wireless graphene
that can be directly printed into clothing and even skin. This
breakthrough paper, which was published in Scientific Reports,
demonstrates how graphene can be crucial to wearable electronic
applications because of its highly-conductive and ultra-flexible
This research is going to pave the way for smart, battery-free
healthcare and fitness monitoring, phones, internet-ready devices
and chargers to be incorporated into clothing and ‘smart skin’
applications .The researchers printed graphene to construct
transmission lines and antennas and experimented with these in
communication devices, such as mobile and Wifi connectivity.
Using a mannequin, they attached graphene-enabled antennas on
each arm. The devices were able to ‘talk’ to each other, effectively
creating an on-body communications system.
Printed flexible, organic, electronics is going to revolutionize
technology and make the electronic devices that are now high end
products, dirt cheap, and much more efficient and convenient.
The benefits of these new electronics are going to be numerous ranging from lower cost, improved performance, flexibility,
transparency, reliability, to better environmental credentials and
much more.
The ongoing research is going to create new and exciting
applications for the technology, which all technology and
electronics enthusiasts are going to eagerly wait for. In the
meantime, all existing electronic and electrical products that we
are now using will see a complete overhaul.
Flexible electronics is only going to aid us in our quest to be
constantly hooked to our electronic devices. Wearable, foldable
smart phones, prosthetic limbs, wearable monitoring devices, etc
are no longer something that our great grandkids will use, way off
in the future. The technology is in the making and it will once again
end up transforming our lives completely.
ELE Times | 58 | January, 2016
adds interesting features
to boost energy sector
ELECRAMA, the world electricity forum, has now turned into a
movement, beyond just an exhibition. It is a premier show of Indian
Electrical Sector and is the World’s largest confluence of the power
transmission and distribution community. Held biennially since
1990 in India, the eleventh edition ELECRAMA-2014 hosted 970
exhibitors from India and across the world and also attracted
100,000+ footfalls into the exhibition.
In the last two decades ELECRAMA as an exhibition featured the
biggest names in the global electrical T&D industry, to whom it
serves as the perfect launch vehicle to introduce latest products and
technology. ELECRAMA showcases products and technology
through the entire voltage spectrum, from 220 V to 1200 kV,
conforming to global standards and specifications. A large number
of business and technology partnerships are also transacted during
the 5 day period giving it a must attend event status amongst global
ELECRAMA visitors consist of a wide spectrum of industry
stakeholders, offering them an international framework for display,
discussions and deliberations. It brings together manufacturers and
suppliers to interface with key customer segments like private and
public transmission and distribution utilities, EPCs, Consultants and
specifiers, members of the government and policy makers. It also
brings together global thought leaders in the electrical transmission
and distribution sector consisting of industry leaders, engineering
professionals and technologists, professionals and academia, et al
through high power panel discussions, premier conferences,
technical workshops, tutorials and seminars held concurrently with
the exhibition. ELECRAMA also hosts international diplomatic and
trade visitor delegations from various countries and large country
pavilions from leading manufacturing nations from around the
The Government of India participation is reinforced with the
presence of four senior ministers. The ministers who have lent their
consent to be present during the event are Suresh Prabhu, Minister
of Railways, Kalraj Mishra, Minister of MSME, Anant Geete, Minister
of Heavy Industries and Public Enterprises and Piyush Goyal,
Minister of Power who would also be inaugurating this grand event.
ELECRAMA is a stellar platform for a world view on technology, best
practices, new systems and forecasting the trends in the future of
electricity, both from technology and a socio-economic point of
view. ELECRAMA will for the first time feature “WORLD UTILITY
SUMMIT”, a unique global platform like no other. This ‘By Invitation
Only’, event is ‘of the utilities, for the utilities and by the utilities’.
CXOs of more than 50 global utilities are being invited to participate
in the two day summit to interact with CXOs of Indian utilities and
share their experiences and best practices.
‘Network to Networth’ is another new interesting and necessary
addition to ELECRAMA 2016. N to N is planned for creating
awareness about the huge investment and JV opportunities in the
Indian electrical sector for both Global and domestic investors.
ELECRAMA for the first time features unique experience pavilions
displaying, ”Energies of Tomorrow” and “Evolution of 125 years of
Electricity”, in collaboration with IEEE, a coffee table book on this
subject is also under preparation.
RND – Railway, Nuclear & Defense pavilion is also planned for the
first time at ELECRAMA to enable interaction between Industry and
these critical sectors displaying their strengths, capabilities,
services and plans in this specially dedicated pavilion.
Renewable Energy pavilion is another addition under planning for
displaying the strengths of the Indian Industry in the renewable
Contemporary Events which have added strength to ELECRAMA
over the years continue to feature.
The third edition of Reverse buyer Seller Meet, supported by the
Ministry of Commerce, Govt. of India continues to generate large
scale business opportunities. 8000+ meetings with 600 overseas
buyers from 42 countries are planned over two and half days of this
‘Engineer Infinite’ in ELECRAMA 2016 will feature 50 most
innovative third year student projects in the electro mechanical
segment, for encouraging young budding engineers from across the
country. A subset to this activity is “Coffee with Sir”, where
participating students listen and network with industry leaders over
all five days. The 5 best student’s projects are awarded by an
industry leader at the “Innovation Day’.
International T & D conclave, another Co-located event has been
planned as a half day event in its third edition. It provides a unique
opportunity for Indian industry and it’s stakeholders to listen to and
interact with global experts from the energy sector.
ELE Times | 59 | January, 2016
Trade Fair Report
prospects of
sector opens
up valuable
With the new phase of Indian
manufacturing slated to be technology
intensive, the country’s manufacturing
sector, projected to touch USD 1 trillion by
2025,opens up invaluable opportunities
for automation and technology industry
players. Against this optimistic
background, German companies Mesago
Messe Frankfurt GmbH and P. E. Schall
GmbH & Co KG together with Messe
Frankfurt Trade Fairs India Pvt Ltd have
come together once again to organise the
second edition of the SPS Automation
India, Motek and Control India in Gujarat.
The three trade fairs, which draw
attention to high-quality manufacturing
technologies for the Indian market,
envisages to bring the Indian
manufacturing sector a step closer to
government’s ‘Make-in-India’ vision by
bringing the required technology in
industrial, factory and process automation
as well as quality control solutions from
the world’s leading technology companies.
This premium business event for the
manufacturing sector will take place from
7 – 9 April 2016 at the Helipad Exhibition
and Convention Centre, Gandhinagar,
India is moving from being a costconscious market to a value-based market
striving for operational excellence. Seeking
resource and performance enhancing
solutions, manufacturers today are ready
to invest in automated processes. The
automation market in the country has
been continually witnessing development
and requirement of customised solutions
by combining old technologies with new
intelligent processes.
In keeping with the technology needs of
the Indian market, SPS Automation India
2016 will be dedicated to industrial
automation and applied solutions whereas
Motek India will cover automation in
production and assembly line. Control
India, on the other hand, will cover
solutions in inspection and quality
assurance. Together, the three shows will
feature all aspects of manufacturing
technologies to attain greater productivity,
efficiency, quality and safety – the key to
global competitiveness.
Co-joint fairs re-locate to
Helipad Convention and
Exhibition Centre
The fairs which made their debut in
Gujarat early this year had strong support
from industry associations as well as
Gujarat government and saw 2,858
decision makers and business visitors
networking and matching their business
requirements with leading industry brands
on over 3,500 sqm of exhibition space.
Going by the successful response, the
organisers have decided to double up the
exhibition space and participation level for
the second edition as well as bring in
wider participation in the Motek and
Control segment.
As part of strategic planning for the 2016
edition, the shows have also been relocated to the state-of-the art Helipad
Convention and Exhibition Centre in
Gandhinagar, Gujarat which offers
convenience and ultra-modern facilities
with better connectivity. The fairground is
also ideal for live demonstration of heavy
machinery and equipment.
Referred as one of ‘Asia’s biggest
investment infrastructure opportunity
centre’, Gujarat has been a frontrunner in
industrial development of petrochemicals,
automobiles, pharmaceuticals, gems and
jewellery, textiles, education, hospitality
and urban infrastructure sectors making it
an ideal location to create a business
arena for manufacturing sector players
and technology solution providers.
Visit: www.spsautomation-india.com;
www.control-india.com; www.motekindia.com
ELE Times | 60 | January, 2016
Deployments with ARM mbed and Maxim Microcontrollers
Maxim Integrated’s low power MAX32600MBED
brings integrated security and precision analog to
the IoT.
With the addition of MAX32600MBED to the ARM mbed IoT Device
Platform program, mbed engineers and IoT developers can quickly
develop embedded Systems based on the MAX32600
microcontroller (MCU) from Maxim Integrated Products.
To make it easier and faster to design Internet of Things (IoT)
applications with differentiated silicon, Maxim has developed
software libraries and development hardware for its MCUs to be
prototyped Through mbed. MAX32600MBED includes a MAX32600
ARM Cortex‐M3 based microcontroller, Prototyping area with
adjacent access to precision analog front end (AFE) connections, I/O
access through Arduino-compatible connectors, additional I/O
access through 100mil x 100milheaders, USB interface, and other
general purpose I/O devices.
Key Advantages:
• Fast time to market: Ease of design with access to software,
tools, infrastructure, and support community
• Integrated security: On-board trust protection unit
• Low power: 175µA/MHZ with full SRAM retention in 1.5µA
standby mode
“Maxim has been making microcontrollers for a long time for
Microchip Launches PIC32 MPLAB
specific markets; now with our mbed
supported platform, we’re opening up our
technology so any developer and any
application can make use of our security,
analog, and low power technology,” said
Kris Ardis, Executive Director for Micros &
Security, Maxim Integrated. “We will
continue to support the mbed ecosystem
on upcoming Maxim microcontrollers,
enabling any designer to build secure, power-conscious Internet of
Things applications.” “Trusted products are required for enterprises
looking to take advantage of IoT deployment for efficiencies,” said
Zach Shelby, Vice President of Marketing, IoT Business, ARM.
“Maxim’s offering brings secure, low power, mixed-signal
microcontrollers to ease the development path to IoT products, and
this will be welcomed by the growing mbed community.”
Availability and Pricing: The MAX32600MBED development
platform is available for $49 at Maxim’s website.
• Details for MAX32600MBED: http://bit.ly/MAX32600MBED
• MAX32600MBED hi-res image:
• Start designing now: http://bit.ly/MAX32600MBED_ARM_mbed
Contact: Joy Zhao, +86 10 52264215,
email: [email protected]
New Power MOSFETs from STMicro
Harmony Ecosystem Development Program Enable Smaller, Greener
Microchip Technology Inc., has announced its MPLAB®
Harmony Ecosystem Program for the developers of embedded
middleware and operating systems who are seeking to unlock
the business potential of Microchip’s 32-bit PIC32 MCU
customer base. MPLAB Harmony is the industry’s most
comprehensive 32-bit microcontroller firmware development
framework, which integrates licensing, resale and support of
Microchip and third-party middleware, drivers, libraries and
real-time operating systems. This new Ecosystem Program
builds on that framework by offering an open and structured
method to become certified as “Harmony Compatible”, using
the embedded-control industry’s only set of test harnesses,
checklists and reference validation points.
Microchip’s MPLAB Harmony framework for its PIC32 MCUs
can reduce the development time of a typical project by a
minimum of 20-35 percent, by providing a single integrated,
abstracted and flexible source of tested, debugged and
interoperable code. Additionally, MPLAB Harmony provides a
modular architecture that enables the efficient integration of
multiple drivers, middleware and libraries, while offering an
RTOS-independent environment. Not only does this preverification and integration speed development, it also
increases reuse. On the hardware side, the MPLAB Harmony
framework makes it even easier to port code, thereby
simplifying migration among all of Microchip’s 32-bit PIC32
microcontrollers, enabling a highly profitable, multi-tiered end
equipment offering with minimal code redevelopment.
Automotive Power Supplies
STMicroelectronics has introduced
a new family of high-voltage Nchannel Power MOSFETs for
automotive applications. These
AEC-Q101-qualified devices are
built using ST’s state-of-the-art
MDmesh™ DM2 super-junction
technology with fast-recovery diode. The devices feature a breakdown
voltage over the 400V-650V range and are housed in D2PAK, TO-220, and
TO-247 packages.
ST’s new Power MOSFETs offer the best performance in both Trr / Qrr
and softness factor in the automotive market, while they are also among
the best in turn-off energy (Eoff) at high currents, improving efficiency of
automotive power supplies. In addition, excellent fast body-diode
performance reduces EMI issues, allowing the use of smaller passivefiltering components. In this way, MDmesh™ DM2 technology enables
greener power design by reducing wasted energy, maximizing the
efficiency, and minimizing the form factor of the end products.
Key technical features of ST’s new automotive Power MOSFETs include:
• Fast-recovery body diode
• Extremely low gate charge and input capacitance of 44nC and
1850pF, respectively, for a 500Vdevice in D2PAK
• Low on-resistance
• Best Reverse Recovery Time (Trr): 120ns @ 28A for a 600Vdevice in
TO-247 and 135ns @ 48A for a 650Vdevice in TO-247
• Gate to Source zener-protected
ELE Times | 61 | January, 2016
Enable Rapid Prototyping for Commercial IoT
Mouser Kicks Off
2016 IoT Design
Contest with
Murata and
Mouser Electronics Inc., announced the
launch of the 2016 IoT Design Contest,
sponsored by Mouser, Murata, and
Broadcom. The contest challenges
engineers, students, and hobbyists to
unleash their creativity by designing projects
that use Murata and Broadcom
components. “India is host to one of the
fastest-growing electronics design and
manufacturing sectors, and IoT is a booming
trend,” says Mark Burr-Lonnon, Senior VP,
EMEA & APAC Business, Mouser Electronics.
“Mouser proudly sponsors this design
contest, which is all about thinking
differently to create innovative designs. We
can’t wait to see the next generation of
ideas that Indian designers bring forward.”
Mouser Electronics, the industry leader in
new product introductions (NPIs), is
sponsoring the IoT Design Contest to
motivate and support engineering
innovations for Internet of Things (IoT)
applications. Designers of the top 100
projects will gain access to free-of-cost
Murata and Broadcom components from
Mouser, including:
• Murata PKGS shock sensors
• Murata Board Mount Barometric
Pressure Sensors
• Murata Type YD-Certified Wi-Fi module
• Murata UMAC Series small energy device
• Broadcom WICED™ Sense Bluetooth®
Smart sensor development kit
• Broadcom BCM92073X_LE_KIT WICED
SMART™ development kit
• Broadcom WICED SMART Bluetooth
System-on-Chip (SoC)
Those designers will then be eligible for
other prizes throughout the contest,
including three grand prizes. For more
Emerson Launches New Transformer
free UPS Maximizing Energy Savings
Emerson Network Power, the world’s leading
provider of critical infrastructure for information and
communication technology systems, announced the
availability of their new Liebert® uninterrupted
power supply (UPS) system. The company has further
bolstered its product portfolio by introducing the
new Liebert® GXT MT+ 10/20 kVA 3×1 UPS system in
Targeted at IT Resellers and VAR’s(Value Added
Resellers) in India, the new product is a transformerfree UPS offering a compact, efficient and reliable
solution to protect modern electronic gadgets. The
availability of the true double conversion online backup power feature on this new UPS system makes it a
reliable and yet uninterruptible power supply source
for optimal running of small data centers, data
networks, voice networks and process automation
equipment, even in harsh power environments.
With a capacity of 20 kVA and battery backup, it has provisions for extra battery cabinets
which can be added for an extended run time in case of power supply failure. Another key
highlight of the Liebert UPS is, whatsoever the quality of the power coming in, the good
output ensures that the equipment remains protected at all times, making it a good option
for businesses when looking out for secure power management apparatus. With an output
power factor of 0.9, this is a best in class UPS system, that assures maximum reliability,
highest efficiency and energy savings making it best suited for mission critical applications as
it offers full protection from damaging power problems which includes outages, spikes,
surges, noise, and voltage fluctuations.
visit: http://www.mouser.in/india-iot-design-contest/.
SMD Kits
Resistor Kits
Capacitor Kits
Inductor Kits
Diode Kits
Transistor Kits
Achche Din Aagaye
India's Online Electronic Component Mega Store
• Components • Instruments • Tools • Consumables
SMDs Online Now
Contact: +91 99 00 48 66 77
ELE Times | 62 | January, 2016
…more being added
Comkey Products
Digital innovation for a clean future – emissions monitoring in vehicles
India, 21thDecember 2015 -HARTING IIC MICA from HARTING is a
modular platform comprising openhardware and software
components whichcan be adapted quickly and cost-effectively to
many industrial areas of application. The Swiss automotive
manufacturer Rinspeed is now also deploying HARTING IIC MICA.
Rinspeed’s “Etos”concept car is fitted with HARTING IIC MICAfor
independent emissions and status monitoring. This digital
innovation therefore aimsto ensure a clean future. The intelligent
mini-industrial-computer MICA manufactured by the industrial
connectivity specialist HARTING illustrates how drive and engine
data can be continually recorded and transmitted and then
evaluated and processed by an independent, neutral body
(Dekra),as agreed beforehand by the customer and contracting
partner. It also allows statements on the credibility of mileage
status to be made.
“MICA can be quickly and easily integrated into a wide range of
vehicles. Its installation in the Etos is an excellent example of
this,”remarked Dr. Jan Regtmeier, Director of Product
Management at HARTING IT Software Development.
The MICA will embark on a roadshow over the coming weeks and
will be on display at the CES in Las Vegas (5 to8 January 2016), the
Hannover Messe Preview (27 January 2016), the Geneva Motor
Show (3 to13March 2016) and the Hannover Messe (25to 29 April
Deals in
Industrial Electronic Components
239, Lajpat Rai Market, Delhi-110006
Telephone : 011-23867631, 23860623
M: 9873847233, E-Mail : [email protected]
ELE Times | 63 | January, 2016
Rinspeed's Etos concept car deploys HARTING MICA
3D Image Sensor Chips REAL3 of Infineon Bring
Virtual Reality to the Smartphone
In the future, mobile devices will be able to
quickly and realistically detect their
surroundings in three dimensions. When
they do, it will be thanks to the 3D image
sensor chips from Infineon Technologies AG
and pmdtechnologies.
REAL3™ will enable extremely realistic
virtual and augmented reality game
experiences that involve the interaction of
the gamer’s own hands and his living
environment within the game, via headmounted devices.
Infineon and pmd will be showcasing the
latest 3D image sensor chip of the REAL3
family at the Consumer Electronics Show
(CES) 2016 in Las Vegas. The optical pixel
sensitivity of the new 3D image sensor chips
are now double that of the previous
version, thus the camera’s system power
consumption is almost halved.
Google’s “Project Tango” using Infineon's
IRS1645C 3D image sensor chip
Infineon and pmdtechnologies are joint
partners in Google’s “Project Tango”. With
“Tango”, cell phones and
tablets are equipped with a
special optical sensor
system for 3D perception,
which includes a 3D camera
with Infineon’s IRS1645C 3D
image sensor chip.
Applications are augmented
reality, indoor navigation
and three-dimensional
The 3D image sensor chips
operate with infrared light and use the
time-of-flight (ToF) measuring principle: For
each of its pixels, the 3D image sensor chip
measures the time the infrared light takes
to travel from the camera to the object and
back again. At the same time, each of the
pixels also detects the brightness value of
the objects.
The IRS1125C will be available in volume as
of first quarter of 2016. The start of
production for the smaller IRS1645C and
IRS1615C is planned for the second quarter
of 2016. All three types are exclusively
delivered as a bare die to allow maximum
design flexibility while minimizing system
Commitment of Reliable Connection
Deals in all types of Connectors & Wire Harness
ME391 (3.96)
ME2515 (2-54)
ME 2517/18
ME 451/452
ME 56
ME 423/424
ME 2510 (2.54)
ME 255
ME 201
IC Socket
Box Header
FRC (Female)
ZIF Socket
Burge Housing
ME 257
Metal Connector
Solder Type
FRC Cable
Heat Shrink
ME85 (10mm)
Bread Board
1702/3, IInd Floor , Sri Nath Market
Bhagirath Place, Delhi-110006
Tel: 011-23876229, Mob: 9810192831
e-mail: [email protected], [email protected]
ELE Times | 64 | January, 2016
Featuring green
lighting technology
5 – 7 October 2016
Pragati Maidan, New Delhi, India
For bookings please contact:
Rasheed Anwaar
+91 99901 01000 | [email protected]
Himanshu Joshi
+91 85869 26107 | [email protected]
Who will prevent downtime
and equipment failure?
You and NI will. With an integrated platform that combines flexible,
rugged hardware with intuitive software, NI helps organizations improve
operational efficiency by providing systems that monitor and analyze
rotating equipment. With advanced I/O, complex signal processing, and
data analytics and visualization capabilities, NI puts you on the cutting
edge of the Industrial Internet of Things and connects equipment,
people, and technology like never before. See how at ni.com/mcm.
NI Systems (India) Private Limited
Phone: 1800 103 9449 (Toll Free) | Email: [email protected]
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