Accretech

The Precision Company
Corporate Presentation
(May.2012)
30. Mai 2012
0
Strictly Confidential
Strictly Confidential
Key Corporate Facts!
Head Office:
Tokyo, Japan.
Established:
March,
Paid-in Capital:
US$ 80 Million.
Sales 2009/2010:
US$335 Million.
Sales 2010/2011:
US$615 Million.
Sales 2011/2012:
US$720 Million.
Exchange listing:
Tokyo, Japan.
Securities code:
7729.
Employees:
~1600 (31/03/2012)
Key Business:
Sales & Manufacture Capital
1949.
Equipment.
Managing Directors:
30. Mai 2012
Mr. Ota (President & CEO)
1
Strictly Confidential
Accretech Semiconductor
Accretech equipment
Fast Fab to Market
30. Mai 2012
2
Strictly Confidential
Accretech - A Global Organisation!
Accretech (Europe) GmbH
Accretech USA, Inc.
Tokyo Seimitsu Co.,
Accretech (China) Co., Ltd.
Ltd., Japan
Accretech Thailand Office
Accretech Vietnam Office
Accretech (Malaysia) Sdn.Bhd.
Accretech (Singapore) Pte.Ltd.
Semiconductor Manufacturing Equipment
High Precision Measuring Instruments
30. Mai 2012
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Strictly Confidential
Accretech (Europe) GmbH
Established: 1989
Wolfgang Bonatz
( President & COO )
Employees: 50
Headquarter: Munich
Board of Directors:
Mr. Ryuichi Kimura
Mr. Wolfgang Bonatz
Semiconductor
Business Unit
- Wafer Prober Systems
- Dicing Systems
- Polish Grinding systems
- Wafer Inspection
- Edge Grinding (Tosei)
30. Mai 2012
Metrology
Business Unit
- Surface Measurement Systems
- Contour Measurement Systems
- Inline Gauges (Tosei)
4
Admin & Finance
Eckard Merz
(Vice President)
Strictly Confidential
Accretech (Europe) GmbH – french office
Established: 1993
Wolfgang Bonatz
Employees: 7
Location: Crolles
( President )
Sales
Daniel VERVIER
- Wafer Prober Systems
- Dicing Systems
- Polish Grinding systems
- Edge Grinding (Tosei)
30. Mai 2012
Customer Support
- Grégoire MARECHAL (Supervisor)
- Francky DINH (Engineer)
- J-P SCOLARI (Engineer)
- Stéphane LEPROVOST Engineer)
5
Admin & Finance
Annick Lehnebach
Strictly Confidential
Accretech - Key Products
UF3000EX / UF3000EX-e
Industry
First!
Industry
First!
MAHOH
Laser Dicing
PG-300-RM
UF2000 / UF200R
Polish Grinding
Industry
First!
(HRG 300)
(ChaMP)
Grindier
(WIN-WIN 50)
Wafer
Inspection
(W-GM-5200)
Edge Grinding
30. Mai 2012
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Strictly Confidential
Thin Wafer Processing – Complete Solution
Probed Wafers
High Yield
WIN-WIN 50 - UV Brightfield
Patterned Wafer Inspection
Functional
Wafer Probe & Sort
Grind & Polish to 30µm
Mount Wafers to Frames
Mounted Frames
Diced Frames
Diced, Tested, Sorted
Framed Wafers
30. Mai 2012
Final Probe & Sort
of Diced Wafers
Dice Framed Wafers
Blade or Laser
7
Probed Frames
Functionaly Probe
& Sort Framed Wafers
Strictly Confidential
Thin Wafer Processing – Complete Solution
Probed Wafers
High Yield
WIN-WIN 50 - UV Brightfield
Patterned Wafer Inspection
Functional
Wafer Probe & Sort
Mounted Frames
NEW FP3000
Diced Frames
Diced, Tested, Sorted
Framed Wafers
30. Mai 2012
Grind & Polish to 30µm
Mount Wafers to Frames
Final Probe & Sort
of Diced Wafers
Dice Framed Wafers
Blade or Laser
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NEW FP3000
Probed Frames
Functionaly Probe
& Sort Framed Wafers
Strictly Confidential
Accretech Dicing Demo Center Munich
What can we offer to our customers?
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Sample dicing
Dicing service
Process optimization
Dicing blade evaluation
Mahoh Laser dicing of
sensitive MEMS-Devices
 ….
Mahoh Laser Dicing
(Clean room class 1000)
ML Separator
Laser dicer ML200
Measuring tools
Blade Dicing Tools
30. Mai 2012
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Strictly Confidential
Thank You
Merci !
30. Mai 2012
10
Strictly Confidential