Presentation for Mid-Term Management Plan

Mid-Term Corporate Plan
June, 2006
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Contents
1. Earnings results for the year ended
on March 31,2006
2. Mid-Term Management Planning
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1. Earnings Results for the year
ended on March 31,2006
3
Earnings Results for year ended on March 31,2006
(Million of Yen)
Consolidated
Amount
Change from
the previous
year
Non-Consolidated
Amount
Change from
the previous
year
Net Sales
19,641
-4,470
16,277
-960
Ordinary
i n c o m e
-2,778
-3,104
-1,363
-1,392
Net income
-5,923
-6,069
-5,846
-5,935
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Main Reasons of the deficit financial report
¾ By the Accounting for the impairment of Asset
¾ Hovering Net Profit in the first half of the year
¾ Depressed Results of TOWA-Intercon
¾ Paper Loss of raw materials, goods in process,
equipment for display and loaned equipment
¾ Dealing Expense by withdrawing Wafer cleaning
equipment and Bonding related equipment
business
¾ Reserve Fund, etc by reduction rearrangement of
overseas manufacturing subsidiary companies
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2. Mid-Term Management
Planning
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Worlds Semiconductor Manufacturing Equipment
Market Changes
(Hundred Millions of US$)
(Hundred Millions of US$)
600
60
Overall Manufacturing Equipment
3 years Average Growth Rate 13.8 %
50
Assembly Equipment
3 years Average Growth Rate 12.4%
400
40
300
30
200
20
100
10
0
Assembly Equipment
Overall Equipment
500
0
1999
2000
2001
2002
2003
2004
2005
Semiconductor Equipment Market Scale
2006(E) 2007(E) 2008(E)
(Assembly Equipment)
Source:SEMI（2005.12Release）
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Mid-Term Management Guideline
Back to our starting point of “Mold Die
related technology” and “Manufacturing” as
our Core Competence, establish earning
structure and construct a new growth line by
invest new products “PM series”, as
beginning, into the world market
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1. Re-establish Business Portfolio
1. Concentrate on Molding and Singulation
field
2. Develop Core Competence to the growth
field , LED market as beginning
3. Pioneer to the new business field by
developing New Material, etc
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2. Strengthening of Sales Strategy
1. Expand our market share by new products
“PM Series” and convert to discrimination
conversion competition
Double-Layer Method
* Mold Clamp Pressure
1/2
* Foot Print 30% less than Y series
* Compound usage 20 - 30% less than current method
Dramatically Reduced COO
*Applicable for Green compound
PM Series
High Release mold die
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Develope Ceramics New Material
for Mold material
(Problem)
Increased adhesion between compound and
mold by using green compound, productivity
is decreased by increased cleaning
frequency
Ceramics New Material
Developed Ceramics New Material
having High Release mold
(Resistance value of mold release,
1/10 less than current material)
- Cut down Cleaning process
- Simplified mold die by E-pin less structure
Loaded on “PM series”
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2. Strengthen fencing sub-contractor,
target top 10 of world major IDM and
Taiwan market
- Provide the latest packaging technology, SIP
(System In Package), Multistage stack, Low-K,
etc.
- Support Taiwan sub-contractor extending its
business to China market
- Sales and Marketing of “PM series”
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Packaging Road Map and TOWA’s Solution
MultiMulti-Plunger Method
Compression
Mold
Wafer Level
Integrated MAP
1 Line Frame
Matrix Flame
High density
SingleSingle-Plunger
Method
Package Stack
PM Target
Single Chip
Chip Stack
CSP
SO/TSOP
PBGA
DIP
Year
Mold Thickness (mm)
3
Mold Width (mm)
30
Number of stacked Chips 1
4
Wire Length (mm)
Wire Dimention (μm) 25
QFN
QFP
1995
1
0.5
50
5
FBGA
Stack Die
Multi Plunger + Side Gate
or Top Gate
+ FM Vacuum method
2005
0.4
75
2
6
20
0.3
5
18
0.2
100
7
8
15
2015
0.1 ・・・
150 ・・・
0.15
120
・・・
10 ・・・
12 10 ・・・
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3. Besides Taiwan Market, set up China Market
and South East Market as Important area
（Hundred Millions of Yen）
Net Sales Classified by Area (Consolidated)
120
100
80
60
40
20
0
Japan
Taiwan
Korea
China
Others
America
Europe
Asia
2005/3 Result
2006/3 Result
2007/3 Plan
2009/3 Plan
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4. Win Back Share of Singulation Equipment
Field
SBS
-Small Floor Space and High
Throughput by Integrated Dicer
and Handler
INJ
-Available for Curve Liner Cut
which has not cut by blade method
-Applicable for Composite Material
and Hard-cut Material like ceramic
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5. Bring Equipment into the LED Market
(Problem)
FFT
High density LED need to use
Silicone resin which is high
cost for ultraviolet measures
Clear
Resin
Clear Resin
Lens
Ceramic
Compression Mold Method
- Almost 100% Yield of Resin
- Stable mold of Lens shape
- Applicable to mass production
Silicone Resin (LED) Mold Products
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6. Develop New Material to Business field of
Existing equipment and General
electronic parts
More than 50%
Share of existing
market
Development of
Electronic parts
business field
New Products “PM series”
& New Material
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3. Optimization of QCD
1. VE (Value Engineering) of Existing products
2. Improvement of the operation rate for overseas
manufacturing subsidiary companies
3. Cut down distribution expenses and Shorten the
lead time by optimization of production system
including overseas manufacturing subsidiary
companies
4. Cut down material purchase expenses by
increasing overseas material supply
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4. Improvement of Financial structure
1. Capital stock increase by allocation of new
share to a third party
（Issued number of new stocks） 1,000,000 shares
（Total issued price）
８ hundred millions of yen
（Allocate to）
Kazuhiko Bandoh
（Purpose）- Express the responsibility of Manager
- Improvement of capital stock completeness
and financial structure
(Account of spending fund)
- Research & Development of New material
5 hundred millions of yen
- IT investment for business rationalization
3 hundred millions of yen
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2. Repayment of Loan by selling real estate of
overseas manufacturing subsidiary companies
3. Reducing inventories by reconsidering prior
manufacturing method of platform base
4. Cutting down the collecting term of accounts
receivable
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5. Reduce Fixed Cost
1. Reducing 20% of total group member (1,000 people
structure)
2. Cutting back on the number of staff by introducing
an early stage retirement favorable system and
loaning revolution register (Net 400 people
structure)
3. Close down TOWA Singapore and selling the plant
4. Restructuring of TOWA-Intercon
Reduce Total 2 billion yen of Fixed cost
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6. Reconfirm Management Responsibilities
¾ Demolishing reserve fund for executive
retirement bonus and abolition this system
¾ Returning total expenses of executive reward
for chairman, CEO &COO and cut them down 10
to 20 % for all executives
¾ Cutting down the salary of administrative
position staff
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7. Reformation of company cultures
and structures
1. Perfect pursuit of CS (Customer Satisfaction)
2. Enhancement of ES (Employee Satisfaction)
3. Simplification and Flat conversion of the
structure
4. Labor–saving and reducing staff by IT
introduction
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Management Target
(Hundred Millions of Yen)
350
80
300
60
40
Net Sales
250
20
200
0
150
-20
100
-40
50
Ordinary Profit / Net Profit
(Hundred Millions of Yen)
-60
0
-80
2005/3 Re su lt
2006/3 Re su lt
2007/3 Plan
Pr e c isio n m old c h ase fo r se m ic o n du c t o r m an u fac t u r in g
Pac kagin g e qu ipm e n t fo r LED
Ot h e r e qu ipm e n t s
Ne w m at e r ial r e lat i n g
Ne t pr o fit
2 008/3 Plan
2009/3 Plan
M o ldi n g e qu ipm e n t
Si n gu l at io n e qu ipm e n t
M o ldi n g pr o du c t s fo r fi n e plast ic
Or din ar y pr o fit
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The 2006 Fiscal year TOWA Corporation
whole company slogan
「
」
Back to our starting Point
and toward to the prideful TOWA
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