ISM BAND - High Frequency Electronics

Transcription

ISM BAND - High Frequency Electronics
APRIL2012
ALSO PUBLISHED ONLINE:
www.highfrequencyelectronics.com
iSCISM: Interference
Sensing
and Coexistence
in the ISM Band
INSIDE THIS ISSUE:
High Bit Rate Miniaturized QPSK
Modulator for Satellite Data
Transmission
Cables & Connectors
Passive Components
Market Reports
Lightwave
Ideas for today’s engineers: Analog · Digital · RF · Microwave · mm-wave · April
2012
1
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IF/RF MICROWAVE COMPONENTS
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ALSO PUBLISHED ONLINE AT: www.highfrequencyelectronics.com
22
QPSK Modulator
A High Bit Rate
Miniaturized QPSK
Modulator for Satellite
Data Transmission
By D.V. Ramana and
Jolie R., ISRO Satellite
Centre
30
ISM Interference
iSCISM: Interference
Sensing and
Coexistence in the ISM
Band
By Joe Baylon, Ethan
Elenberg, and Samantha
Massengill
The Cooper Union for the
Advancement of
Science and Art
APRIL2012
Vol. 11 No. 4
52
New Products
New introductions from
McBain Systems, TriQuint
Semiconductor, Rohde &
Schwarz, and more.
16
12
6
Featured Products
In The News
Editorial
APRIL2012
ALSO PUBLISHED ONLINE:
www.highfrequencyelectronics.com
iSCiSM: interferenCe
SenSing and CoexiStenCe
in the iSM Band
Featured products from
EMC Technology, SGMC
Microwave, Planar
Monolithics Industries,
and more.
Including Raytheon, AWR,
Thermacore, Analog
Devices, SenarioTek,
Agilent Technologies,
Northrop Grumman, and
Linx Technologies.
INSIDE THIS ISSUE:
High Bit Rate Miniaturized QPSK
Modulator for Satellite Data
Transmission
Cables & Connectors
Passive Components
Market Reports
Ideas for today’s engineers: Analog · Digital · RF · Microwave · mm-wave · April
Lightwave
2012
1
HFE announces its firstever panel of Editorial
Advisors.
6 Editorial
12 In the News
48 Design Notes
8 Meetings & Events
52 New Products
76 Advertiser Index
April 2012
5
EDITORIAL
Vol. 11 No. 4, April 2012
Publisher
Scott Spencer
[email protected]
Tel: 603-472-8261
Associate Publisher/Managing Editor
Tim Burkhard
[email protected]
Tel: 707-544-9977
Senior Technical Editor
Tom Perkins
[email protected]
Tel: 603-472-8261
Vice President, Sales
Gary Rhodes
[email protected]
Tel: 631-274-9530
Editorial Advisors:
Ali Abedi, Ph.D.
Candice Brittain
Paul Carr, Ph.D.
Alen Fezjuli
Roland Gilbert, Ph.D.
Sherry Hess
Thomas Lambalot
John Morelli
Karen Panetta, Ph.D.
Business Office
Summit Technical Media, LLC
One Hardy Road, Ste. 203
PO Box 10621
Bedford, NH 03110
Also Published Online at
www.highfrequencyelectronics.com
Subscription Services
Sue Ackerman
Tel: 651-292-0629
[email protected]
Send subscription inquiries and address changes
to the above contact person. You may send them
by mail to the Business Office address above.
Our Environmental Commitment
High Frequency Electronics is printed
on paper produced using sustainable forestry practices, certified by
the Program for the Endorsement
of Forest Certification (PEFC™),
www.pefc.org
Copyright © 2012, Summit Technical Media, LLC
6
High Frequency Electronics
High Frequency
Electronics Adds Panel
of Distinguished
Advisors
Scott L. Spencer
Publisher
Recently we reached out to a select group of leaders
to serve as Editorial Advisors to High Frequency
Electronics magazine. It would be impossible to list all
the accomplishments of these individuals in such a
short space, so a brief introduction will have to suffice.
Ali Abedi is currently Associate Professor of Electrical
and Computer Engineering and Director of WiSe-Net Lab
at the University of Maine. He has published two books and over 60 articles
in refereed conference proceedings and archived journals covering topics in
distributed coding and information theory, wireless sensor networks, and
advanced signal processing. Dr. Abedi is a senior member of IEEE and currently serves on the IEEE MGA Conferences committee.
Candice Brittain is a Principal Microwave Engineer at BAE Systems.
She has worked on numerous microwave systems ranging from the kHz
range to the high GHz range and from the nano-watt to mega-watt levels.
Her experience ranges from circuit- and module- to system-level design.
She currently holds three patents. Candice is the publications chair for the
IEEE MTT-S Radio Wireless Week 2012-2013.
Paul Carr was Chief of the Microwave Physics branch of the Air Force
Research Laboratory (formerly AF Cambridge Research Laboratory &
Rome Laboratory) from 1967 to 1995. In 1979, Dr. Carr was elected Fellow
of the IEEE “For contributions to microwave acoustics and their use as
signal processing components.” He is a Life Fellow. His over 80 papers and
10 patents have contributed to miniature, low-cost signal processing components for radar, communications TV, and cell phones.
Alen Fejzuli is Group President of the Microwave and RF Group at
Electro Technik Industries (Res-Net Microwave and Wavetronix), and
founder of Electro-Photonics LLC. Previously, he was a VP of Engineering
with Smiths Group PLC in Stuart, Fla. He has authored a number of technical papers, holds several patents, and was an adjunct professor at Indian
River State College in Fort Pierce, Fla.
Roland Gilbert has been with BAE Systems, Nashua, N.H., since
1985 where he currently is an Engineering Fellow. His research includes
development of broad-band structurally integrated multifunction reconfigurable antenna arrays; highly efficient electrically small radiators; low
scattering antennas; and materials with engineered electrical properties.
Dr. Gilbert was inducted into the Association of Old Crows Technology Hall
of Fame for his work with EW Antennas. He is a member of the Antennas
and Propagation (APS) Microwave Theory and Techniques (MTT) societies
of IEEE, and holds several patents.
Sherry Hess is Vice President
of Marketing for AWR Corp., a
National Instruments company
and leader in the development of
high-frequency design software.
She has more than 15 years of EDA
experience in domestic and international sales, marketing, support,
and management. She held key
management positions at Ansoft
Corp. and served as director of
European operations, with responsibility for all company operations
throughout Europe.
Thomas Lambalot is Chief
Commercial Development Officer
at Paratek Microwave (recently
acquired by RIM) with broad experience in business development,
operations management and general management at both large and
venture-backed companies. Before
joining Paratek Tom was President
& CEO of SmartLink Radio
Networks; Envoy Networks; and
Filtronic Comtek.
John Morelli is the President
of IW Microwave. He has been
active on the EIA and IEC committees for RF connector standardization as well as being involved with
DSCC for Mil-Spec coordination of
coaxial connectors since the early
1980s. He serves as the Chief
U.S. Delegate to the IEC for SC46F
the International Committee
for Microwave Connectors and
Component Standardization. John
is recognized as a leading authority
on interconnect and electronic
packaging technology. He holds
eight U.S. Patents and has been
published in various trade journals.
Karen Panetta is a Professor
of Electrical and Computer
Engineering at Tufts University and
Director of its Simulation Research
Laboratory. She is the co-founder of
BA Logix Inc. and serves as the company’s Chief Research Scientist. She
was the first female electrical engineer to attain tenure in the Electrical
and
Computer
Engineering
Department. Dr. Panetta is an
IEEE Fellow, the Worldwide Director
of IEEE Women in Engineering, and
the recipient of a Presidential Award
for
Excellence
in
Science,
Mathematics, and Engineering
Mentoring. She is the founder of the
“Nerd Girls” program, aimed at
breaking down barriers that prevent women from entering engineering disciplines.
If you are planning on attending WAMICOM, April 16-17 in
Cocoa Beach, Fla., please stop by
and say hello to Senior Technical
Editor Tom Perkins, who will be
representing HFE at the event.
Get info at www.HFeLink.com
HFE
MEETINGS & EVENTS
Conferences
April 3 – 5, 2012
Microwave & RF
Paris, France
Information: http://www.microwave-rf.com/?lang=EN
April 3 – 5, 2012
Forum Radiocoms
Paris, France
Information: http://www.microwave-rf.com/
April 10 – 14, 2012
28th International Review of Progress in Applied
Computational Electromagnetics
Columbus, Ohio
Information: http://aces.ee.olemiss.edu
April 16 – 17, 2012
Wireless and Microwave Technology Conference
(WAMICON)
Cocoa Beach, Fla.
Information: wamicon.org
May 21 – 23, 2012
International Conference on Microwaves, Radar, and
Wireless Communications
Warsaw, Poland
Information: www.mikon-2012.pl
June 17 – 22, 2012
IMS 2012
Montreal, Canada
Information: http//ims2012.org
July 29 – August 3, 2012
International Conference on Wireless Information
Technology and Systems
Honolulu, Hawaii
Information: http://hcac.hawaii.edu/conferences/
tcwct2012
August 6 – 9, 2012
NIWeek 2012
Austin, Tex.
Information: http://www.niweek/
August 13 – 15, 2012
IEEE International Conference on Signal Processing,
Communications and Computing
Hong Kong
Information: www.icspcc2012.org
September 3 – 4, 2012
Workshop on Integrated Nonlinear Microwave and
Millimetre-Wave Circuits
Dublin, Ireland
Information: www.inmmic.org/
8
High Frequency Electronics
September 10 – 13, 2012
IEEE AUTOTESTCON
Anaheim, Calif.
Information: www.autotestcon.com
September 17 – 20, 2012
IEEE International Conference on Ultra-Wideband
Syracuse, N.Y.
Information: www.ICUWB2012.org
Short Courses
Tonex
tonex.com
Tel: 1-888-868-6639
Introduction to Wireless is a comprehensive two-day
course covering all important aspects of wireless networks, applications and services.
802.11ac Training covers the fundamentals of 802.11c
concepts, features, technology, operations and configurations. Next generation of Wireless LAN technology or
802.11ac standard aims to increase data rates to the
region of 1Gbit/s by using wider channels compared to
802.11n such as 80MHz and 160MHz channels. Up to 8
MIMO spatial streams may be possible and includes
higher-order modulation such as 256QAM and will be
situated in the 5GHz band.
Radar Communications Training features in-depth
coverage of important, firm standards such as WML,
WMLScript and XHTML. In addition a technical overview of WAP 2.0 is provided in this updated course. An
overview of Open Mobile Architecture (OMA) initiative is
also provided.
Cellular Networks Performance Workshop provides a
complete overview of the QoS and performance on the
entire GSM/GERAN, CDMA and UMTS systems. It provides an introduction to the performance and QoS complete
evolution of GSM towards a radio access and core IP networks that efficiently supports UMTS services (GERAN). It
features a comprehensive study of system performance
with simulations and field trials. Covers all major features
such as basic QoS of voice, data and multimedia applications in GSM, GPRS, EDGE, CDMA, W-CDMA/UMTS and
AMR and the full capability of the GERAN radio interface
for 3G service support is envisaged.
WiMAX Training provides an overview of WiMAX
applications, technologies, architectures and standards.
Other important topics such as protocol layers, QoS,
throughput, security, coverage, capacity planning, interference, testing and interoperability, are discussed. Basic
WiMAX architecture, RF theory, microwave, propagation,
Link budget math, troubleshooting, security and QoS
foundations and site surveys are explored.
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MEETINGS & EVENTS
Intelligence, Surveillance, and Reconnaissance
Training (ISR Training course) covers concepts and
architectures of Intelligence, Surveillance, and
Reconnaissance. ISR training also covers all related
enabling architecture, technologies, standards, modeling,
analysis, engineering, testing and evaluation. This course
is designed for engineers, technical professionals, project
managers and analysts. An overview of SysML, DoDAF
2.0 and NAF 3.0 architecture related to Intelligence,
Surveillance, and Reconnaissance is discussed.
Besser Associates
besserassociates.com
Tel: 650-949-3300
RF Measurements: Principles & Demonstration
April 23 – 27, 2012, San Jose, Calif.
CMOS RF Design
April 23 – 25, 2012, San Jose, Calif.
Transceiver and Systems Design for Digital
Communications
April 23 – 25, 2012, San Jose, Calif.
Modern Digital Modulation Techniques
May 21 – 25, 2012, Braintree, Mass.
Antennas & Propagation for Wireless Communications
May 21 – 23, 2012, Braintree, Mass.
Radio System Design – Theory and Practice
May 21 – 25, 2012, Braintree, Mass.
BER and EVM Testing for Test & Product Engineers
May 21 – 25, 2012, Braintree, Mass.
Wireless/Computer Network Security
May 23 – 25, 2012, Braintree, Mass.
Company-Sponsored
Training & Tools
National Instruments
LabVIEW Core 1
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
LabVIEW Core 2
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
Linear Technology
LTSpice IV
LTpowerCAD
LTpowerPlay
Amplifier Simulation & Design
Filter Simulation & Design
Timing Simulation & Design
Data Converter Evaluation Software
http://www.linear.com/designtools/software/
Call
for
Papers
2012 Workshop on Integrated Nonlinear Microwave
and Millimetre –Wave Circuits
September 3 – 4, 2012, Dublin, Ireland
Abstract Deadline: May 4, 2012
Final Paper Deadline: August 3, 2012
http://ieee.org/web/callforpapers
2012 IEEE International Conference on Ultra-Wideband
(ICUWB2012)
September 17 – 20, 2012, Syracuse, N.Y.
Abstract Deadline: March 9, 2012
Final Paper Deadline: June 15, 2012
http://ieee.org/web/callforpapers
2012 37th International Conference on Infrared,
Millimeter, and Terahertz Waves
September 23 – 28, 2012, Wollongong, NSW, Australia
Abstract Deadline: April 20, 2012
Final Paper Deadline: July 6, 2012
http://ieee.org/web/callforpapers
2012 IEEE MTT-S International Microwave Workshop
Series on Millimeter Wave Wireless Technology and
Applications (IMWS)
September 18 – 20, 2012, Nanjing, China
Abstract Deadline: May 31, 2012
Final Paper Deadline: July 31, 2012
http://www.emfield.org/imws2012/
Object-Oriented Design and Programming in LabVIEW
Online
http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/
Agilent Technologies
Advanced Agilent VEE Pro
June 19 – 22, 2012, Las Vegas, Nev.
http://www.home.agilent.com/agilent/eventDetail.
jspx?cc=US&lc=eng&ckey=701878-14&nid=34787.0.00&id=701878-14
AWR
On-site and online training, and open training courses
on design software.
http://web.awrcorp.com/Usa/News--Events/Events/
Training/
10 High Frequency Electronics
2012 IEEE 21st Conference on Electrical Performance
of Electronic Packaging and Systems
October 21 – 24, 2012, Tempe, Ariz.
Abstract Deadline: July 1, 2012
Final Paper Deadline: July 8, 2012
http://ieee.org/web/callforpapers
2012 Asia Pacific Microwave Conference
December 4 – 7, 2012, Kaohsiung, Taiwan
Abstract Deadline: June 20, 2012
Final Paper Deadline: September 2012
http://apmc2012.com/
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IN THE NEWS
Business News
Raytheon Technical Services Company LLC (RTSC),
a subsidiary of Raytheon Company, won a U.S. Army
TOW (tube-launched, optically tracked, wireguided) missile subsystems contract valued at
$77.9 million. Under the five-year contract, Raytheon
will provide logistics and engineering support for TOW
subsystems and
associated support equipment.
S p e c i f i c a l l y,
work
will
include
field
engineering
support,
provisioning and
repair support, technical engineering and configuration
management for the Army’s Close Combat Systems,
including Bradley Fighting Vehicles. Raytheon has performed work on the TOW missile since the 1990s. “The
customer’s selection of Technical Services as a prime
contractor affirms our strong capabilities in providing
engineering services and innovative, cost-effective customer solutions,” said John Harris, RTSC president.
“Together, RTSC and Raytheon Missile Systems’ engineering and logistics solutions will support systems
from Huntsville to Afghanistan and offer assurance to
our warfighters that they have systems that perform
anytime and everywhere.”
TDK company EPCOS, a leading manufacturer of
electronic components, modules and systems, and
Pulse Electronics, a leading antenna manufacturer,
used AWR’s Microwave Office to design indie, a
breakthrough technology that answers the challenge
from carriers in the Next Generation Mobile Networks
(NGMN) Alliance to develop a single, operator-independent RF platform supporting all NGMN operator
frequency bands. indie, the world’s first operatorindependent RF hardware platform for global LTE
smartphones enables for the first time global roaming and downlink inter-band carrier aggregation for
LTE mobile devices. It is the only high-end platform
in the industry that can be used by the majority of
operators with the same hardware configuration and
no expensive modifications. indie was designed with
AWR’s Microwave Office electronic design automation
(EDA) software, which enabled the unique design of a
three-feed antenna system and RF front-end module
architecture. Microwave Office allowed indie designers
to explore alternative design possibilities that resulted
in the elimination of the region-specific duplexer
matching that is necessary in single-feed architectures,
such that universal operator-independent applicability
resulted.
12 High Frequency Electronics
Thermacore Inc., a leading provider of advanced
thermal solutions, announced that it has achieved
AS9100:2009 Rev. C certification and was recertified to ISO 9001:2008. “Achieving this certification is a true testament to our quality systems and
our commitment to ensuring we meet and exceed our
customers’ expectations for highly reliable thermal
management products, services and material solutions,” said Jerome E. Toth, President and Chief
Executive Officer of Thermacore. Developed specifically for the aviation, space and defense industries, the
AS9100 standard was established by the International
Aerospace Quality Group (IAQG) for the purpose of
achieving significant industry improvements in quality, safety, and customer service, as well as reductions
in cost throughout the value stream. AS9100 is globally recognized and incorporates best practices from
across the aerospace and defense industry. The latest
revision of AS9100, known as Rev. C, places additional
emphasis on risk management and mitigation, stresses
supply chain management controls, and assigns greater focus on planning and project management, which
are all designed to ensure a higher level of customer
satisfaction and quality.
Analog Devices, Inc. announced that it transferred
its stock exchange listing to The NASDAQ Global
Select Market from The New York Stock Exchange.
ADI shares are now trading as a NASDAQ-listed
security under the symbol “ADI.” “NASDAQ is recognized throughout the world for being synonymous with
technology and innovation. Not only are the foremost
technology companies listed on NASDAQ, but also the
exchange employs leading technology to provide excellent service, making it a great fit for ADI,” said David
Zinsner, vice president of finance and chief financial
officer for Analog Devices.
RFMW, Ltd and MAJR Products announced a worldwide distribution agreement. MAJR Products is a
leading supplier of high performance EMI/RFI shielding products. RFMW Ltd. is a specialized distributor providing customers and suppliers with focused
distribution of RF and microwave components as
well as specialized component-engineering support.
According to the agreement, RFMW will distribute
MAJR Products broad portfolio of electromagnetic
interference (EMI) and radio frequency interference
(RFI) shielding products including conductive gaskets,
form-in-place gasketing, shielded tents, sticky fingers, elastomers, EMI windows, board level (EMI/RFI)
shielding, and air ventilation/filtration panels.
AWR Corp. announced the continuation of its
Graduate Gift Initiative, which provides quali-
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fied Electrical Engineering graduates with a complimentary, fully functional 1-year term license of its
popular Microwave Office™ and Visual System
Simulator™ (VSS) software suites – inclusive of
AXIEM® 3D planar EM software. Working with universities worldwide to empower students with access
to RF/Microwave software tools, AWR first launched
this initiative in 2010 in direct response to industry
and academia expressing the need for students to have
access to these tools prior to graduation and entering
the job market.
Agilent Technologies Inc. reported revenues of $1.64
billion for the first fiscal quarter ended Jan. 31, 2012,
8 percent above one year ago. First-quarter GAAP
net income was $230 million, or $0.65 per share. Last
year’s first-quarter GAAP net income was $193 million,
or $0.54 per share. During the first quarter, Agilent had
intangible amortization of $27 million, transformational charges of $8 million, and acquisition and integration costs of $7 million. The company also recognized
a tax benefit of $24 million. Excluding these items and
$4 million of other net benefits, Agilent reported firstquarter adjusted net income of $244 million, or $0.69
per share. Bill Sullivan, Agilent president and CEO,
said, “First-quarter currency adjusted revenue was at
the low end of our guidance. We delivered earnings at
the high end of our guidance, reflecting the strength
of our operating model.” Electronic Measurement
first-quarter revenues were up 1 percent over the prior
year. Orders were down 5 percent from the same period
last year, when orders increased 24 percent. Solid
growth in the Aerospace/Defense and Industrial markets was offset by weaker Communications demand.
TriQuint Semiconductor, Inc. opened TriQuint
International Pte Ltd, its new International
Headquarters in Singapore. The facility will be the
focal point for most international customers, suppliers
and manufacturing partners. “Our business outside of
the United States now contributes about 70 percent of
the company’s annual revenue,” said Ralph Quinsey,
President and CEO, TriQuint Semiconductor, Inc.
“With Asia’s appetite for new technologies, particularly in mobile devices, and government support of
the latest communications infrastructure, we believe
Asia will continue to offer great opportunities for business growth,” he said. The new TriQuint International
Headquarters is located at the Changi Business Park,
close to Singapore’s Changi International Airport. This
new office will offer dedicated resources in a wide variety of areas ranging from customer service to supply
chain management. The company just completed its
14 High Frequency Electronics
sixth consecutive year of record revenue, largely driven
by the proliferation of smartphones, tablets and the
emergence of 3G/4G broadband wireless.
People in the News
The Central Florida chapter of the Air Force
Association (AFA) has designated
Northrop Grumman Corporation a
Jimmy Doolittle Educational Fellow,
recognizing the company for its pioneering work in the field of precision
navigation. The Jimmy Doolittle
Educational Fellowship honors
the late Gen. Jimmy Doolittle who
Elizabeth Iversen
actively promoted public understanding and support for aerospace power.
Being named a Doolittle Fellow honors the many men
and women who have supported the U.S. Air Force and
the AFA from their inception. Elizabeth Iversen, sector vice president and general manager of Northrop
Grumman’s Navigation Systems Division, accepted the
award on behalf of the company at the Air Force Gala
banquet in Orlando, Fla., on Feb. 24.
Linx Technologies hired Kris Lafko as its director
of worldwide sales. Kris has over 20 years of experience
building and managing customer-centered organizations in the semiconductor and sensor industries. His
expertise will help Linx continue to improve its sales
and customer service processes at this crucial point
in the company’s growth. Kris will be responsible for
direct and distributor sales for Linx Technologies as
well as its Antenna Factor and Apex Wireless divisions.
He will report directly to president and CEO Tolga
Latif as part of the senior management team.
SenarioTek, a privately-held designer and manufacturer of RF and microwave products, named
James Melville as its new US Sales Manager. This
is a new position established to continue and expand
SenarioTek’s growing business. Prior to joining
SenarioTek, Mr. Melville has had extensive RF experience including the support of various satellite, radar,
JSF, and missile programs. He has held prominent
sales positions with GenRad, Teradyne, and Symtx/
AAI. His most recent experience was with Symtx/AAI
as National Account Manager for Lockheed Martin and
Northeastern Sales Manager. “SenarioTek has seen
rapid growth over the last few years and Jim’s 30 years
of industry experience and customer knowledge will
strengthen our position in our targeted markets,” said
Simi Ghiasvand, SenarioTek’s CEO and President.
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In the News
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16 High Frequency Electronics
designed to perform many functions,
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KRYTAR, Inc. announced two new
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Precision Connector, Inc. introduced
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High Frequency Products
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systems where phase and port isolations are critical.
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SWM series magic tees are offered
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Drop-In Circulator
VidaRF introduced its model VDC04200450-3 Drop-In Circulator.
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18 High Frequency Electronics
Get info at www.HFeLink.com
© 2012 AWR Corporation. All rights reserved. AWR is a National Instruments Company.
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20 High Frequency Electronics
Leonard Weber
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HFeLink 101
High Frequency Design
QPSK Modulator
A High Bit Rate Miniaturized
QPSK Modulator for Satellite
Data Transmission
By D.V. Ramana and Jolie.R
Communication Systems Group, ISRO Satellite Centre, Bangalore, India
A
high bit rate mini a t u r i z e d
Quadrature
Phase
Shift
Keying
(QPSK) modulator was
designed at X-band using
microstrip line techniques. The modulator
was tested for its performance for a data rate of upto 800Mbps. The
paper discusses the practical realization of the
unit.
A high bit rate
miniaturized Quadrature
Phase Shift Keying
(QPSK) modulator was
designed at X-band
using microstrip line
techniques.
Introduction
Space communication systems are designed
based on the prime requirements of size,
weight, on-board power requirements and
reliability. Various factors limit the transmission of data from satellites and the design of
the system becomes more complex with an
increase in data rates.
Indian Remote Sensing (IRS) satellites
provide data in a variety of spatial, spectral
and temporal resolutions. The data transmission requirement for IRS satellites has
increased from 20Mbps to 640Mbps. There is a
need to improve the resolution of images and
hence there is increase in demand for higher
data rate transmitters. This calls for developing new data transmitting systems—the modulator in particular.
Data transmission from space to ground
needs to be carried out in the frequency band
allotted by International Telecommunication
Union (ITU). The S-band is overcrowded and
moreover higher data rates cannot be accommodated in the allowable 20MHz bandwidth.
The other bands allotted for data transmis22 High Frequency Electronics
sion from space to ground are X-band and
Ka-band with 375MHz and 1500MHz bandwidth, respectively. At present, data transmission from remote sensing satellites is confined
to X-band, with data rates as high as 210Mbps
on two different carriers using QPSK modulation. The next generation satellite will transmit data rates as high as 640Mbps on a single
carrier using dual polarization. If the data
rates are increased further, transmission at
Ka-band is the only option.
In a digital communication system, especially in satellite links, there is a trade-off
between bandwidth efficiency and power efficiency when selecting a suitable modulation
scheme. The QPSK modulation scheme, which
is optimum in terms of power and bandwidth
efficiency, is widely used for high bit rate data
transmission for terrestrial as well as satellite
communications.
A miniaturized QPSK modulator was
designed at X-band using micro-strip line
techniques. It was tested for its performance
up to a data rate of 800 Mbps. The high data
rate ensures the transmission of images
acquired by high resolution cameras to ground.
Realization of the unit and its test results are
explained in this paper.
Description
The existing on-board QPSK modulator at
X-band transmits 105Mbps on a single carrier.
The modulator is reflection type consisting of
a hybrid, two BPSK modulators and a power
combiner. Each BPSK modulator consists of a
hybrid ring with switching diodes in two arms.
The diodes are switched by data to include or
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The Design Engineers Search Engine finds the model you need, Instantly • For detailed performance specs & shopping online see
U.S. Patents
7739260, 7761442
IF/RF MICROWAVE COMPONENTS
455 rev F
High Frequency Design
QPSK Modulator
at the output of the modulator. The modulator MIC was
realized on a 2" x 2" alumina substrate.
A new miniaturized QPSK modulator at X-band was
realized using a 3dB/90° hybrid, two double balanced
mixers (HMC 141&142 from M/S Hittite) used as BPSK
modulators and a Wilkinson power combiner. It was realized at X-band wherein the BPSK modulator was realized
using MMIC double balanced mixers, thus drastically
reducing the size. The two double balanced mixers are
mirror images of each other and have identical characteristics except for the location of the IF port. These mixers
were selected to avoid cross over of the data line over the
RF path in the layout.
The use of double balanced mixers gives a wider bandwidth, possibility to operate at higher data rates and better isolation between the input, output and data ports.
The double balanced mixer has four diodes connected as
a bridge. A pair of diodes conducts at a time depending on
the polarity of the applied data signal, thus providing 0°
or 180° phase shift. The 3dB/90° hybrid and power combiner were designed using micro-strip line techniques.
These were designed to cover a broader bandwidth of 8.08.55GHz. The modulator has the benefits of reduced size
and high data rate handling capability. The same modulator design can be used for data transmission at X-band as
well as the extended X-band for deep space missions.
The block diagram of the QPSK modulator is shown in
Fig.1. The un-modulated X-Band carrier is split into two
Figure 1 • Block Diagram of X-band QPSK Modulator.
carrier components using a 3dB/90° hybrid coupler. The
two double balanced mixers bi-phase modulate the carriers with the I and Q data streams and their outputs are
combined using a Wilkinson power combiner to provide
QPSK modulated signal.
Simulation
The simulated test results of the microstrip elements
i.e. the 3dB hybrid coupler and power combiner are
presented.
Hybrid Coupler
The hybrid coupler also known as branchline coupler
is a four port device. The input RF carrier power will be
Table 1
Figure 3 • Magnitude plots.
24 High Frequency Electronics
Figure 4 • Phase plots.
Figure 5 • Return loss plots.
Rugged, Reliable Performance
Emerson Connectivity Solutions offers the Midwest Microwave product line
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High Frequency Design
QPSK Modulator
Table 2
Figure 6 • Magnitude plots.
Figure 7 • Phase plots.
divided equally into two with 90º phase difference
between the output ports. The fourth port is terminated
in a 50ohms load. Table 1 gives the simulated test results
of the 3dB/ 90º hybrid coupler. Figs. 3 & 4 give the simulated magnitude and phase plots respectively for the
S-parameters S21 and S31. The phase difference between
two output ports is 90º. Fig.5 gives the
return losses (S11, S22, S33 and S44) of
all the four ports.
Figure 8 • Return loss plots.
lator was realized using bare dies. All the units were realized on a 1"x1" alumina substrate. The photograph of the
modulator is shown in Fig.9. The substrate was mounted
on a test jig and tested for its performance. The size can
be reduced further by using a suitable package which
may also improve the performance.
Test Results
The individual test results of the 3dB
hybrid coupler and power combiner are
given in Tables 3 & 4 respectively. The
Power Combiner
QPSK modulator consisting of the 3dB
A two-way Wilkinson power combiner
hybrid, mixer dies and power combiner
is a three port device which is used to
was realized on a single substrate and
divide the power into two equal magnitested for its performance. The data rate
tudes without any phase difference
requirement at X-band is only 320 Mbps
between the output ports. Table 2 gives
per carrier. However, the modulator was
the simulated test results of the power
Figure 9 • Miniaturized high
tested up to 800Mbps. The spectrums for
combiner. Figs. 6 & 7 give the simulated
data rate QPSK modulator.
Pseudo Random Bit Sequence (PRBS)
magnitude and phase plots respectively.
data pattern for 320Mbps and 800Mbps
It can be noted that the both ports magnitude is same (3dB) and phase difference is zero. Fig.8 are shown in Figs.10 & 11 respectively.
The modulator was also tested for its four phases on a
gives the return losses of all the three ports and it is more
network analyzer. The output phase states are shown in
than 20dB throughout the band.
the constellation diagrams in Fig.12. The amplitude and
phase imbalance achieved are ±1.21 dB and ± 3.6º
Hardware Realization
A QPSK modulator was fabricated using 3dB hybrid, respectively.
BPSK modulators and power combiner. The BPSK modu26 High Frequency Electronics
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High Frequency Design
QPSK Modulator
Table 3
Table 4
Conclusion
A simple and compact QPSK modulator was designed
at X-band using micro-strip line techniques for satellite
data transmission. Simulated and hardware results are
presented in the paper. It can support data rates up to
800Mbps. The modulator can be used directly at X-band
by limiting the data to 375Mbps or the output can be upconverted to Ka-band to transmit higher data rates. The
performance of the modulator is expected to improve if
the test jig is replaced with proper RF package.
Figure 10 • PRBS spectrum for 320Mbps.
Figure 11 • PRBS spectrum for 800Mbps.
28 High Frequency Electronics
Figure 12 • Constellation Plots of
QPSK Modulator.
About the Authors:
Dr. D. Venkata Ramana holds
an M.Tech degree from National
Institute of Technology, Surathkal
and a Ph.D. from the Indian
Institute of Science, Bangalore,
India. He joined ISRO Satellite
Centre, Bangalore in 1983 and has
been
associated
with
the
Communication Systems Group.
He is involved in the design and
development of high bit rate data
transmitters and advanced modulation schemes for various Indian
Remote Sensing Satellites. He has
published papers in various
national and international journals. He is a Senior Member-IEEE;
Fellow-IETE;
Fellow-IE;
LM-IMAPS.
Mrs. Jolie.R received her
B.Tech from University of Kerala
and M.Tech from Cochin University
of Science and Technology. She
joined the ISRO Satellite Centre,
Bangalore in 2000 and is a design
engineer for data transmitting
systems for IRS satellites. Her
work includes development of high
bit rate modulators, data transmitters at X and Ka-band and
investigations in the area of spectrally efficient data transmission
system for space communication
links. She is currently registered
for her Ph.D. at VTU, Bangalore.
She is a Life Member of IMAPS.
HFE
Get info at www.HFeLink.com
April 2012
29
High Frequency Design
ISM Interference
????
iSCISM: Interference Sensing
and Coexistence in the ISM
Band
By Joe Baylon, Ethan Elenberg, Samantha Massengill
Department of Electrical Engineering
The Cooper Union for the Advancement of Science and Art
1. Introduction
A multitude of commercial devices transmit
in the unlicensed 2.4 GHz
ISM band, and these
devices are likely to interfere with each other.
These effects are compounded in highly populated metropolitan areas with large numbers
of microwave ovens, Bluetooth devices, cordless phones, wireless game controllers, and
other devices which occupy the ISM band.
This contributes to an ever increasing need for
effective interference mitigation schemes in
Wi-Fi networks.
Wideband Interference: Microwave
Oven. The most common source of interference in the ISM band is the microwave oven
(MWO). Nearly every home, apartment, office,
and restaurant in a large metropolitan area
contains an MWO, and its operation can
severely degrade WiFi transmission. Both
residential and commercial MWOs are characterized by a wide-band frequency profile.
However, the interference varies in time with
a nearly even on-off cycle corresponding to its
60 Hz AC power supply. This corresponds to a
period T of approximately 16.7 ms, a key characteristic used in both modeling and identifying MWO signals.
Narrowband Interference: Bluetooth.
Other than MWOs, most interferers in the
ISM band occupy a bandwidth smaller than
the approximately 20 MHz WiFi channel. The
majority of these devices employ a frequencyhopping spread spectrum (FHSS) method to
randomly change between several carrier fre-
There is an everincreasing need for
effective interferencemitigation schemes in
WiFi networks.
30 High Frequency Electronics
quencies throughout the 2.4 GHz ISM band.
Although FHSS devices should theoretically
cause minimal interference with Wi-Fi communication, their increased prevalence has
been shown to be detrimental to throughput
in both simulation and field testing.
Efforts to eliminate the effects of these
interferers on WiFi networks have been
focused on providing robust, interferer-agnostic mitigation techniques. Previous work has
focused on detecting and classifying signals,
but alleviating their negative effects based on
this classification has not yet been explored.
For example, Airshark [1] and RFDump [2] act
as low-cost spectrum analyzers that are helpful as network diagnostic tools. The authors of
these papers mention the potential of interference mitigation but neglect to implement it.
Other work has been done in avoiding interference at the MAC layer by switching to a
different channel or changing the rate of
transmission, but this approach does not
adjust mitigation to best remedy the effects of
a specific interferer. The disconnect between
these techniques fundamentally limits the
potential for interference mitigation.
1.1 iSCISM
Previous work has motivated the formation of the iSCISM project as a bridge between
identification and mitigation. The process can
be decomposed into three stages; the first of
these is the detection stage, in which information is gathered regarding the signals present.
The information required to properly identify
a signal varies widely based on the signals
being identified and the comparisons used.
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High Frequency Design
????
ISM Interference
Figure 1• Block diagram of the iSCISM mitigation
architecture.
Features such as changes in a received signal’s phase or
the times of transmission can be used to differentiate
between different types of interferers. The block diagram
of the iSCISM system is shown in Figure 1. The PHY
layer extracts data from the received signals, an identification algorithm specifies the existence of interferers,
and mitigation algorithms are activated to mitigate the
effects of the interferers present in the system.
The second stage in the process of utilizing unique
mitigation schemes is specifying the type of interference
present in the relevant frequency band. Even after
selecting a specific parameter upon which to base
identification, the methods for implementing this stage
can vary widely. Decisions may be based simply on hardcoded threshold techniques or on more complicated
methods such as machine learning. The former keeps
computation low while the latter may permit higher
degrees of accuracy.
The third stage is implementation of the appropriate
interference mitigation algorithm, and this will determine how practical the first two prove. Mitigation schemes
are the most pivotal portion of the project as a whole. By
combining interference identification and previously
developed mitigation schemes to produce an interfererspecific mitigation architecture, the coexistence of Wi-Fi
with various interferers in the ISM band can be better
facilitated. The schemes to be implemented, however,
must be both computationally efficient and effective in
alleviating the effects of interferers. Several mitigation
schemes were tested and analyzed for these factors.
Varying the operation of mitigation schemes based on
detected interferers requires a modular and quickly
adaptable system. Software-defined radio (SDR) presents
an excellent solution. Advances in SDR have enabled
transmitters and receivers to become reconfigurable
through software instead of dedicating excess hardware
to perform particular tasks. The notion of re-configurability is exploited in order to create systems that are able to
adapt in real-time to environmental changes. Through
the application of SDR, cognitive radio communication
systems are able to most efficiently allocate resources
based on information about their surroundings, and sec32 High Frequency Electronics
ondary users are able to share spectrum with primary
users. These developments make SDR the ideal foundation on which to construct an interference specific mitigation architecture.
The rest of the paper is outlined as follows: The formation of a testbench in MATLAB® is described in Section 2.
This served as the platform for the simulations completed
thus far. Section 3 details the signal identification techniques implemented in this testbench. The techniques for
peak detection and specific algorithms for identification
are detailed in Section 4. Mitigation schemes are described
in Section 5. The theory behind each is explained and a
brief analysis is offered. The experimental procedure of
implementing peak detection and identification algorithms on the MATLAB testbench as well as the results
obtained from the testbench are detailed in Section 6, and
Section 7 outlines the conclusions drawn from the completed work and the direction for future work.
2 . MATLAB Testbench
To properly test the performance of iSCISM in improving throughput in the presence of interferers, two platforms are used. First, a MATLAB simulation serves as
the modular testbench on which several identification
and mitigation schemes are tested. This allows blocks of
code to be interchanged easily, and both recorded and
simulated interference signals may be used for testing.
Once results are obtained and the most successful algorithms are selected, the iSCISM system will be implemented on an SDR platform for testing in a more realistic
setting.
The MATLAB testbench has been developed to provide a way to test several different interference mitigation schemes for a variety of interference signals, signal
to noise ratio (SNR) and signal to interference ratio (SIR)
values, and time durations. While MATLAB is often used
for Physical (PHY) layer simulations, discrete event simulators such as OPNET® and ns-3 are typically used for
Medium Access Control (MAC) layer simulations. These
do not allow manipulation or observation of the PHY
layer, so MATLAB was chosen as a simulation medium.
Due to computational restrictions in MATLAB and the
relatively low sampling rate of the USRP2, it is feasible
to simulate only a portion of one 20 MHz channel.
Hopping across multiple channels is not a necessary
design feature, so this should be sufficient for modeling
the Wi-Fi component of the testbench.
A limited MAC layer is implemented with the following procedure. To begin, input data are split into packets.
At each iteration of a loop, a packet is passed through an
802.11g PHY layer simulation. After filtering with a
Rayleigh fading channel, the signal power is calculated.
Then, additive white Gaussian noise and interference are
added at the packet level to ensure constant SNR and
SIR regardless of input signal amplitude. Instead of com-
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High Frequency Design
ISM Interference
puting checksums, the receiver compares the received,
demodulated bits to the original packet and the variable
ack is set to 0 if there are any errors. If ack = 1, then
throughput is incremented based on the current bitrate
and the next packet is sent on the following iteration.
Prior to each transmission, a wait period is allocated
to account for delays between consecutive transmissions.
These time delays represent the Short Interframe Space
(SIFS), Distributed Interframe Space (DIFS), and exponential backoff times specified in the 802.11g protocol.
Interference signals corresponding to these time frames
are selected and processed to ensure that the relevant
data are extracted for use in the identification process.
This allows for processing of interference signals in both
the transmission and wait periods. To keep track of
elapsed time over several iterations, the variable T is
incremented based on the number of OFDM symbols
transmitted and the duration of the waiting periods.
Within this testbench framework, the effects of simulated and actual interference signals have been determined and mitigation solutions have been evaluated
based on throughput and bit error rate. Because the system is not yet mapped to a real-time hardware implementation, computational complexity has been assessed by
monitoring the amount of time required to conduct simulations.
3. Feature Extraction
Gathering information from the iSCISM system’s
received signals relies almost exclusively on peak detection. The peak detection algorithm is therefore the most
pivotal point of any identification algorithm. Successful
identification of interference, regardless of the type of
interference or method used, first requires accurately
distinguishing between background noise and signals of
interest.
The edge detection algorithm is an adaptation of the
algorithm used in the RFDump architecture [2], but filtering techniques are refined to produce more computationally efficient and effective results. The algorithm
averages in time and downsamples the received signal by
means of a cascaded integrator and comb (CIC) filter.
Downsampling the received signal allows for longer averaging times with minimal increases in computational
complexity. A 50 µs time average is used as it effectively
removes noise without blurring the often tightly-spaced
peaks. A sloped filter identical in length to the averaging
filter is then applied. This produces a time-averaged
derivative of the received signal. Sharp peaks in the
resulting signal can then be easily identified, and a
threshold is used for separating out these peaks. The
value for this threshold is set based on the maximum
value of the time-averaged signal. Times at which the
derivative surpasses this threshold are labeled as rising
34 High Frequency Electronics
edges, and times at which the derivative falls below the
negative of the threshold are labeled as falling edges.
Following peak detection, feature extraction is a simple task. The phase of an interferer as it changes in time
can be observed through a simple arctangent operation.
The time stamps exported with the peak data can be easily manipulated to analyze the timing characteristics of
the received signals. It should be noted, however, that this
approach is done separately from spectral analysis.
Analyzing the frequencies of interfering signals in any
detail requires similar peak detection algorithms in the
frequency domain. Analyzing the spectrum in a way that
provides sufficient detail for interference identification
requires more complicated time and hardware intensive
architectures. While it is likely a promising method for
identifying signals, the relative complexity dictates its
exclusion from this discussion.
4. Classification Algorithms
Machine learning algorithms can be used to classify
interfering signals based on their unique features. This
section outlines the theory behind supervised learning
algorithms, where supervised refers to training prior to
classification using signals that are mapped with certainty to particular devices.
K-Nearest Neighbors The K-nearest neighbors
(KNN) algorithm has been used in the past to classify
biological signals immersed in noise [3]. This idea could
easily be extended to interference identification in Wi-Fi
networks, such as in the iSCISM system. The KNN algorithm classifies training samples according to their
Euclidean distance to other samples in the feature space.
This is done by a probability density estimate in the form
K
where p(x) = NV
where p(x) is the unknown probability
density at sample x, V is the volume of the region containing x, N is the total number of sample points, and K is the
number of points in the region containing x. The K -nearest neighbors algorithm fixes K and determines the value
of V from the data by centering a sphere at point x and
increasing the radius until K points are inside the sphere.
This approach is applied to each class, and samples are
assigned based on the class the majority of their K -nearest neighbors are a part of. The posterior probability of
class membership is given by
[4].
Naive Bayes The Naive Bayes classifier has been
used to classify network traffic and obtain high accuracy
[5]. This classifier could also be used for interference
identification in Wi-Fi networks as interference is also
network traffic. The Naive Bayes classifier assumes that
classifications of an object are independent from all other
classifications of other objects, and features are also
assumed to be independent from all other features.
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High Frequency Design
ISM Interference
According to Bayes’ Theorem and conditional independence assumptions, the joint probability of class variables
and feature variables can be rewritten as the product of
the class prior p (Ck ) and all i independent distributions
P (fi|Ck) where fi are the feature variables. Maximum
likelihood is then used to match an object to a class. A
maximum a posteriori (MAP) classifier is similar to a
Naive Bayes classifier but instead of assuming independent features, it uses the MAP decision rule and picks the
most probable hypothesis.
Support Vector Machines A binary SVM classifier
composes a hyperplane in a feature space of a higher
dimension than the original sample space so that data
can be linearly separable. A margin is the shortest (and
therefore perpendicular) distance from a hyperplane to
data points, and the hyperplane where the margin is
maximized coincides with minimum error and is therefore a useful decision boundary. For a problem in the form
y(x) = wT ϕ (x)+b where ϕ (x) is the feature space transformation, b is the bias term, w is the vector normal to the
hyperplane and the sign of y(x) is what classifies the N
input data vectors x1, ..., xN , the decision hyperplane is
represented as
tn(wT f(xn ) + b) ≥ 1 9 n = 1, ..., N; these are constraints
to the quadratic programming problem
argminw,b
1
2
||w||2
which can be solved using Lagrange multipliers
an ≥ 0. This problem becomes one in which we minimize
with respect to w and b and maximize with respect to a.
After the model has been trained, y(x) can be expressed as
SNn=1 antnk(x,xn )+b where k(x,x') = f(x)T f(x')
in general. A purely receiver side solution is also preferable to one that requires communication or synchronization between the transmitter and the receiver.
Low layer design: In order to be implemented on a
Wi-Fi card, the solution must be mapped to hardware or
low level software. Information should be extracted from
waveforms or bitstreams rather than packets. Techniques
are considered only if they employ either the PHY layer
or the MAC sublayer. Hybrid, cross-layer (MAC/PHY)
approaches are also permissible.
Scalability to multiple networks: An ideal solution will have no negative consequences if all radios in a
large urban area adopt the technique. Therefore it must
avoid a tragedy of the commons in which the system’s
benefits vanish once it is implemented in a majority of
Wi-Fi networks.
A sensing and interference mitigation approach has
several advantages and disadvantages. The obvious benefit of software-defined radios adapting to interference is
increased throughput between the transmitter and
receiver. This method also provides better utilization of
RF spectrum, a limited resource for wireless devices.
With different coexistence strategies for different interferers, the solution should perform better than any individual approach. However, the potential for error increases with complexity. Latency and other forms of overhead
make interference mitigation inappropriate for all cases.
An unrobust implementation also runs the risk of performing worse than a baseline Wi-Fi network without
interference suppression.
Several methods for interference mitigation were considered, including frequency diversity [6], adaptive filtering [7, 8], timed transmission, and rate adaptation. The
latter two techniques were selected for development and
implementation the iSCISM project.
is the kernel function. After satisfying the KuhnTucker conditions, either an = 0 or tn y(xn ) = 1 for every
data point. The data points for which an = 0 do not contribute to new points being classified, so only the data
points for which tn y(xn ) = 1 remain. These points are support vectors that lie on the maximum-margin hyperplane.
This hyperplane is the decision boundary used for binary
classification [4].
5. Interference Mitigation
To be applicable to the iSCISM system, interference
mitigation solutions should satisfy the following criteria:
Noncollaborative: In a collaborative environment,
one device can coordinate its transmissions as to not
interfere with those from another device. Collaboration is
certainly possible in the context of a multistandard wireless device containing two or more collocated radios.
Coexistence among multiple cognitive RF devices would
simplify the problem greatly, but collaboration depends
on the exchange of information which cannot be assumed
36 High Frequency Electronics
Figure 2 • MWO spectrogram with optimal transmission
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High Frequency Design
ISM Interference
(a) Received Signal
(b) Differentiated Signal
(c) Detected Edges
Figure 3 • The process of edge detection performed on a microwave oven is demonstrated above. The input signal is
averaged, downsampled, and differentiated before a threshold separates peaks.
5.1 Timed Transmission
One approach to mitigating microwave oven interference is to simply avoid transmitting while the MWO is in
its on cycle. Although this reduces the transfer rate to
half, the bit error rate has been shown to drop to zero in
experimental tests [9]. Transients are detected as on-off
boundaries, and Figure 2 shows that the recommended
transmit time is in between these bursts. Although this
method forces the Wi-Fi transmitter to operate at a 50
percent duty cycle, the absence of MWO interference
should result in greater overall throughput. While it is a
promising PHY layer solution, it requires the transmitter
to adjust its output based on the receiver’s identification
procedure.
5.2 MAC Rate Adaptation
The 802.11 Wi-Fi standard allows for several modulation schemes and transmit rates. One general strategy
against interference is to dynamically adjust the rate in
accordance with the presence of interference. Several
common rate adaptation schemes assume that packet
loss is due to multipath or fading channel conditions and
neglect the possibility of RF interference. Algorithms
such as the WOOF scheme [10] identify losses due to
wireless network congestion and take no action instead of
decreasing the data rate. Although this mitigation technique focuses on accommodating large, multi-user networks instead of mitigating external interference, it
shows considerable improvement in throughput compared to naive methods which decrease the transmit rate
in the event of any packet loss.
Previous efforts have attempted to detect and reduce
microwave oven interference using the MAC sublayer by
correlating the number of consecutive successful transmissions with an MWO on-off cycle [11]. Because the
system only requires spectrum sensing and MAC characteristics to sense MWO interference, it should be easily
42 High Frequency Electronics
implemented on commercial 802.11 radios without hardware modifications.
Once interferers have been detected, interference
mitigation algorithms adjust MAC parameters to improve
overall performance. One algorithm dynamically adjusts
the contention window in order to transmit more often in
the off cycle and less often in the on cycle. In some cases,
an MWO may cause a radio to interpret the spectrum as
busy even when it poses no threat of interference. One
solution is to adjust the clear-channel-assessment threshold and transmit at the moderate, previously unacceptable SIR. However, these algorithms only work in specific
cases based on the microwave oven’s proximity to the
transmitter and receiver.
Rate adaptation was determined to be a simple method for implementation against Bluetooth interference in
the iSCISM system. The scheme presented in [12] was
implemented: the rate was increased upon eight successful transmissions and decreased upon three failed transmissions.
6. Experimental Results
After preliminary results with simulated interference
models, experimental data were obtained using a USRP2
software-defined radio. Complex valued, 32-bit floatingpoint interference signals for both microwave ovens and
Bluetooth headsets were recorded at a sampling rate of
20 MS/s.
6.1 Peak Detection
The edge detection algorithm performed well at relatively low INRs. Testing was performed on simulated
Bluetooth and MWO interferers. These were weighted and
added to produce a single interference vector containing
both interferers. Edges were noted as accurately detected
if an edge was marked within 5 µs of the generated peak.
At an INR of 2 dB for the simulated Bluetooth interferer
and 1 dB for the simulated MWO interferer, 84% of the
.
.
.
High Frequency Design
ISM Interference
generated Bluetooth peaks and 90% of genAlgorithm
Training
Run time(s)
Accuracy,
Accuracy,
erated MWO peaks were located accuratetime(s)
all BT
all MWO
ly. Minimal false positives were generated
KNN
0.01
0.011
93%
100%
(less than one every 5 ms). These results at
Naive Bayes 0.04
0.008
97%
93%
relatively low INR values demonstrate reasonable accuracy at non-ideal conditions.
MAP
0.02
0.011
97%
93%
Higher INR values yield better detection
SVM
0.09
0.012
96%
98%
accuracy with fewer false positives. At
lower INRs the performance degrades, but
Table 1 • Experimental Classifier Results.
such low-power interference signals do little
more than raise the noise floor, and thus
formance of the identification algorithm as the overall
detection and identification of these signals is relatively timing of an MWO interferer is maintained quite closely.
unimportant. Successful implementation of the edge detection algorithm is demonstrated in Figure 3.
6.2 Classification Results
While these results refer to the performance of edge
Using a computer with an Intel Core i7 CPU 870 @
detection purely on simulated signals, similar results 2.93 GHz processor and 6 GB of RAM, the classifiers were
have been demonstrated when this algorithm is applied trained and tested. Training data and test data came
to recorded interferers. Quantifying the success of the from two separate simulations of interference modeling
algorithm on these interferers is much more difficult as and feature extraction. At a sampling rate of 20 MHz,
there is no accurate definition of the location of transmis- duration of 60 ms, SIR of 10 dB, and SNR of 10 dB (INR
sion edges against which the identified edge times can be = 0 dB), the run times of each classifier were averaged
compared. The performance of the algorithm with record- over ten trials. The training times are less relevant than
ed interferers was carefully observed over several differ- the run times since training is a one-time expense and
ent sets of data, and it also proved successful in locating can be done offline without real-time concerns. The algothese edges accurately. One notable difference, however, rithms were each tested for accuracy by using test data
arose in the detection of microwave oven edge detection. that was comprised of entirely Bluetooth information or
While the overall envelope of the simulated MWO signal entirely microwave oven information, for the cases of only
matched that of the recorded MWO signal very closely, Bluetooth interference being present and only microwave
the signal power rose much more gradually to peaks in oven interference being present. Accuracy measurements
power than in the simulated MWO. The resulting upward were averaged over ten trials for each interference type.
slope was much longer in duration than the simulated These results are shown in Table 1. For the case of mixed
counterpart, and this caused the detection of multiple BT and MWO interference, qualitative results showed
closely-spaced edges within a single upward slope. This roughly the appropriate amount of each interference type
inconsistency, however, has a negligible effect on the per- was classified correctly. However, since ground truth is
unknown, quantitative results have yet to be established.
Figure 4 • 802.11 throughput (left) with experimental BT interference and (right) with experimental BT and rate
adaptation.
44 High Frequency Electronics
6.3 Mitigation Results
Due to time constraints, tests of timed transmission
performance in the presence of MWO interference were
determined to be inconclusive. Rate adaptation was tested
using two interference signals, each experimentally recorded from a different Bluetooth headset. In the adaptation
scheme, data rate was permitted to vary among 6, 12, and
24 Mbit/s according to the scheme described in Section 5.2.
This was then compared to a simulation with a fixed data
rate of 24 Mbit/s for SIR and SNR values ranging from 0
dB to 20 dB. In addition to the bit
error rate improving by an order of
magnitude for rate adaptation at
SNR values from 5 dB to 15 dB, the
throughput increased for all SIR
values above 5 dB SNR. While a normal 802.11g simulation with the
second Bluetooth interferer yields
no data transmission at 10 dB SNR,
all but 0 dB SIR had nonzero
throughput for the same SNR level
when rate adaptation was applied.
Figure 4 shows these results averaged over 20 iterations. At a constant SNR value of 20 dB, the
throughput improvement ranged
from 7% at 20 dB SIR to over 100%
at 15 dB SIR.
This includes incorporating the finalized identification
and mitigation schemes onto one unified platform. The
ability of the system to dynamically identify the presence
of interferers can then be fully tested. Identification algorithms will be quantitatively evaluated further by examining performance when the interference is a weighted
sum of both MWO and Bluetooth interference. In addition, timed transmission must be tested more extensively
to determine the amount of improvement it provides.
7 . Conclusions
Edge detection, identification,
and interferer-specific mitigation
schemes have each been tested. The
edge detection algorithm yields
accurate detection of interference
transmissions at relatively low
INRs. Interference identification
algorithms have been shown to
accurately identify interferers
based on the detected edges. Naive
Bayes is the likely candidate for the
final identification algorithm as it
produces accurate results with the
smallest computational cost. In
addition, throughput improvements
in a Wi-Fi system have been demonstrated when rate adaptation (for
the case of a Bluetooth interferer) is
used to mitigate the effect of interference.
7.1 Future Work
Some work must still be done to
finalize the implementation of
iSCISM on the MATLAB testbench.
Get info at www.HFeLink.com
April 2012
45
High Frequency Design
ISM Interference
The next version of iSCISM will be completed on a
USRP2 SDR platform. To more accurately simulate the
effects of interferers on a Wi-Fi system and iSCISM’s ability to mitigate them, a Wi-Fi transmitter and receiver
platform will be implemented through the GNU Radio
interface. iSCISM will then be added to this platform. The
computational simplicity of low-level design should permit
the finalized version to then be used on a Wi-Fi card.
iSCISM’s performance may also be improved when
more identification and mitigation schemes can be implemented and tested on the SDR platform. Several promising but complex methods of interference identification and
mitigation were not tested. Should these prove effective,
they may be incorporated in future versions of the iSCISM
platform.
Notes: MATLAB® is a registered trademark of The
MathWorks, Inc. OPNET® is a registered trademark of
OPNET Technologies, Inc.
References
[1] S. Rayanchu, A. Patro, and S. Banerjee, “Airshark:
Detecting non-wifi rf devices using commodity wifi hardware,”
2011, unpublished.
[2] K. Lakshminarayanan, S. Seshan, S. Sapra, and P.
Steenkiste, “RFDump: An architecture for monitoring the
wireless ether,” in Proc. 5th ACM International Conference on
emerging Network EXperiments and Technologies
(CoNEXT’09), Rome, Italy, Dec. 1–4, 2009, pp.253–264.
[3] V. D. Gesu, G. L. Bosco, and L. Pinello, “A one class knn
for signal identification: a biological case study,” International
Journal of Knowledge Engineering and Soft Data Paradigms,
vol. 1, no. 4, pp. 376–389, 2009.
[4] C. M. Bishop, Pattern Recognition and Machine
Learning. New York, NY: Springer Science + Business Media,
2006.
[5] Y. Liu, Z. Li, S. Guo, and T. Feng, “Efficient, accurate
internet traffic classification using discretization in naive
bayes,” in IEEE International Conference on Networking,
Sensing and Control, 2008.
[6] K. Premkumar and S. Srinivasan, “Diversity techniques for interference mitigation between IEEE 802.11
WLANs and Bluetooth,” in IEEE 16th International
Symposium on Personal, Indoor and Mobile Radio
Communications (PIMRC’05), vol. 3, Berlin, Germany, Sep.
2005, pp. 1468–1472.
[7] A. Soltanian, R. E. V. Dyck, and O. Rebala, “Rejection of
bluetooth interference in 802.11 WLANs,” in Proc. IEEE 56th
Vehicular Technology Conference (VTC’02), vol. 2, Birmingham,
AL, May 2002, pp. 932–936.
[8] Z. Zeng, B. Allen, and A. Aghvami, “Performance evaluation of a bluetooth interference canceller in IEEE802.11b
wireless networks,” IEEE Trans. Consum. Electron., vol. 51,
no. 4, pp. 1188–1196, Nov. 2005.
[9] T. Taher, M. Misurac, J. LoCicero, and D. Ucci,
“Microwave oven signal interference mitigation for Wi-Fi com-
46 High Frequency Electronics
munication systems,” in 5th IEEE Consumer Communications
and Networking Conference (CCNC’08), Las Vegas, NV, Jan.
2008, pp. 67–68.
[10] P. A. K. Acharya, A. Sharma, E. M. Belding, K. C.
Almeroth, and K. Papagiannaki, “Congestion-aware rate
adaptation in wireless networks: A measurement-driven
approach,” in 5th IEEE Communications Society Conference
on Sensor, Mesh and Ad Hoc Communications and Networks
(SECON’08), San Francisco, CA, Jun. 16-20, 2008, pp. 1–9.
[11] G. Li, S. Srikanteswara, and C. Maciocco, “Spectrumsensing based interference mitigation for WLAN devices,” in
3rd International Conference on Communication Systems
Software and Middleware and Workshops (COMSWARE’08),
Bangalore, India, Jan. 5–10, 2008, pp. 402–408.
[12] S. Miyamoto, S. Harada, and N. Morinaga,
“Performance of 2.4GHz-band wireless LAN system using
orthogonal frequency division multiplexing scheme
under microwave oven noise environment,”
in IEEE
International Symposium on Electromagnetic Compatibility,
(EMC’05), vol. 1, Aug. 8–12, 2005, pp. 157–162.
About the Authors:
Joe Baylon, Ethan Elenberg, and Samantha Massengill
will soon graduate from the EE program at The Cooper Union
for the Advancement of Science and Art, New York, NY.
Get info at www.HFeLink.com
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Design Notes & Market Reports
GaN Development Efforts Expanding
As products using Gallium Nitride (GaN) technology
continue to gain acceptance in military and commercial
applications, development activities at microelectronics
companies are accelerating. The Strategy Analytics GaAs
and Compound Semiconductor Technologies Service
(GaAs) viewpoint, “Compound Semiconductor Industry
Review October-December 2011: Microelectronics,” captures product, technology, contract and financial
announcements for companies such as RFMD, Skyworks
Solutions, Fujitsu, ANADIGICS, Agilent, Hittite
Microwave, TriQuint Semiconductor, Avago, NXP
Semiconductors, Microsemi, Renesas Electronics,
Freescale, Broadcom Cree and Murata Manufacturing.
“GaN-based products have demonstrated performance
advantages for military systems for some time and they
are finally beginning to see acceptance in commercial
applications, such as CATV and wireless infrastructure,”
noted Eric Higham, Director of the Strategy Analytics
GaAs and Compound Semiconductor Technologies
Service. “As these application areas broaden, the industry
is responding by increasing their efforts to develop new
products, processes and partnerships.”
Asif Anwar, Director, Strategy Analytics Strategic
Technologies Practice, added, “Recent announcements
indicate growing interest in GaN-on-silicon processing to
reduce cost and higher voltage GaN processes, which will
improve power handling performance.”
This viewpoint summarizes financial, product, contract and employment developments from leading compound semiconductor device suppliers in Q4 2011. These
announcements address a variety of commercial and
military applications that use gallium arsenide (GaAs),
gallium nitride (GaN), Silicon carbide (SiC), silicon germanium (SiGe) and complementary metal-oxide-semiconductor (CMOS) technologies.
--Strategy Analytics
strategyanalytics.com
Personal Tracking: The Next Billion
Dollar GPS Market
GPS personal tracking devices and applications are
forecast to grow with a CAGR of 40%, with both markets
breaking $1 billion in 2017.
Senior analyst Patrick Connolly says, “The hardware
market remained below 100,000 units in 2011. However,
it is forecast to reach 2.5 million units in 2017, with significant growth in elderly, health, and lone worker markets. Dedicated devices can offer significant benefits, with
insurance and liability increasingly encouraging the use
of approved equipment.”
48 High Frequency Electronics
“We are also seeing the first signs of leading CE companies entering the market, such as Qualcomm, Apple
(via PocketFinder), Garmin, Cobra, etc. and there will
also be significant partnerships and acquisitions in this
space as new entrants looks to add tracking to their portfolio,” adds Connolly. Other markets include family, personal items (e.g. luggage), and pet and offender tracking.
There is an addressable market of over 120 million
people across these markets alone, with over two million
US elderly using non-GPS Personal Emergency Response
Systems (PERS). However, awareness, battery life, economic conditions, and high subscription fees remain significant barriers. There is also a fear that smartphone
applications will cannibalize the market.
The application market is already booming, with
Life360 reaching 10 million downloads for its family locator application. Long term, these solutions will become
part of much bigger security and health markets, growing
to over 200 million downloads in 2017, as well as the
majority of total tracking market revenue.
Group director Dominique Bonte adds, “In particular,
carrier platforms represent a major revenue generator
opportunity for family locator applications, matching
their secure image and offering differentiation to family
subscription plans. Companies such as Location Labs and
TCS are already seeing success in this space.”
--ABI Research
abiresearch.com
Book Review
Nonlinear Transistor Model
Parameter Extraction Techniques
Edited by Matthais Rudolph, Christian Fager, and
David E. Root
Cambridge University Press 2012 ISBN 978-0-52176210-6 Hardback
Having experienced an
arms-length association with
microwave transistor modelers
and designers for about 20
years, this book comes as a
pleasant surprise. With many
recognized contributors it is
organized in a manner that
takes the reader through a logical progression from DC models, extrinsic factors, small-signal equivalents to large signal
non-linear models.
Design Notes & Market Reports
Following the earlier chapters, more esoteric subject
matter is dealt with in a relatively easy to understand
manner. Many useful references are cited throughout.
It’s nice to see early work of people like Cutice, Angelov,
Poon and others referred to as well as much recent work.
The placement of noise modeling as the final chapter,
albeit useful, seems possibly to be an afterthought.
One of the downsides of having many contributors is
that not all chapters are in the same writing style; but
that said, the book is far more organized than a collection
of technical papers, and takes advantage of a wealth of
knowledge that two or three authors would likely not easily create on their own. The three editors have done an
excellent job of organizing the content of a 2009 IEEE
Microwave Theory and Techniques Society workshop into
a very useful book that should be of help to device designers for some time to come.
smart card-based solutions. Shipment growth should continue for at least the next four years. The next phase in
India’s Aadhaar project could be a real game changer. The
project could form the basis for a whole range of services
deploying in both an online and offline manner, across
both government and commercial sectors.”
ABI Research’s report, “Smart Cards in Government
and Healthcare Citizen ID,” addresses the barriers and
drivers of planning and deploying infrastructure and
issuance of citizen-deployed documents and discusses the
future market changes and developments.
--Tom Perkins
Sr. Technical Editor
According to the latest research from Strategy
Analytics, global LTE phone shipments will grow tenfold
to reach 67 million units in 2012. It is a breakout year for
4G technology. Companies leading the growth spurt will
include Apple, Samsung, HTC and others.
Neil Shah, Analyst at Strategy Analytics, said, “We
forecast global LTE phone shipments to grow tenfold
from 6.8 million units in 2011 to 67.0 million in 2012.
Major countries driving LTE growth this year will include
the United States, Japan and South Korea. Multiple
operators, such as Verizon Wireless, NTT Docomo and SK
Telecom, are aggressively expanding their LTE networks.
Key vendors leading the push into LTE phones will
include Apple, Samsung, HTC, LG, Nokia, Motorola,
Pantech and Fujitsu.”
Neil Mawston, Executive Director at Strategy
Analytics, added, “The mobile industry is entering a
breakout year for 4G LTE technology. Multiple operators
and multiple phone vendors will be launching dozens of
LTE models across numerous countries worldwide. LTE
has quickly become a high-growth, high-value market
that no operator, service developer, device vendor or component maker can afford to ignore.”
Tom Kang, Director at Strategy Analytics, added, “The
LTE phone segment is expanding at a rapid rate this
year, but there will undoubtedly be growing pains in this
early phase. Many LTE phones and data plans will be
relatively expensive, which means operators will need to
invest generous subsidies to make 4G more affordable for
subscribers. Meanwhile, consumers will be concerned
about LTE usability issues, such as shortened battery life,
excessive device weight, or sudden bill shock caused by
high data consumption.”
Smart Cards: $72 Billion by 2016
The market for smart cards, secure ICs, inlays, (biometric) data capture, card personalization, printing and
issuance in government, healthcare, and citizen ID will
reach a cumulative value of $72 billion by 2016. The largest proportion of revenues will be from the deployment of
national ID cards and e-passports.
The employment of higher-value applications, in particular e-passports and smart national ID cards, alongside the increased focus on multi-application credentials,
has accelerated the smart card market value. The market
is expected to peak in 2014, before settling at a level close
to $15 billion.
The greater employment of smart cards is adding further value for vendors as more countries look to migrate
from legacy-based solutions to secure smart card-based
ones and next generation credentials. Shipments of smart
credentials will overtake legacy in 2014. The keys to this
shift are several countries: France, Brazil, and Poland are
moving to dual interface national ID cards and China has
a pending upgrade to a microcontroller national ID.
Research analyst Phil Sealy comments, “Contactless
is the new ‘must have’ technology in the ID space.
Contactless projects have already shown success, deploying within national ID projects in Germany, Egypt, and
most notably, China. The trend to adopt a contactless
interface will continue throughout the forecast period. We
expect to see strong and continued adoption of dual interface ICs primarily utilized in national ID cards.”
Group director John Devlin adds, “This market has
produced some excellent YoY growth over the past few
years as vendors add value and increase the appeal of
--ABI Research
Abiresearch.com
Global LTE Phone Shipments to Grow
Tenfold This Year
--Strategy Analytics
strategyanalytics.com
April 2012
49
Design Notes & Market Reports
Global BTS Market Volumes
Declined 11.9% in 2011
•E
JL Wireless Research LLC was correct in predicting overall LTE BTS shipments for 2011 with a
forecast variance of 10.6%
The global base transmitting station (BTS) market
•
EJL Wireless Research LLC was correct in predictdeclined by 11.9% in units in 2011, according to the lating overall W-CDMA/HSPA+ BTS shipments for
est report from EJL Wireless Research titled “Global
2011 with a forecast variance of 3.7%
Base Station Market Analysis and Forecast, 8th Edition,
“Similar
to the BTS transceiver market, LTE BTS
2011-2016.”
shipments
were
“The decline in 2011 was the first ever in BTS shipup
in
2011
but
ments since 2001 with weakness in India accounting for
delays
in
specGlobal BTS LTE shipments are
a substantial portion of the decline in GSM BTS,” says
expected to increase 42% and
founder and President, Earl Lum. The report provides a trum auctions in
become the second largest
unique perspective on the global shipments and demand Spain, Italy and
pushed
category
for base station equipment covering all air interface France
standards and frequencies and major OEMs including some forecasted
into
Alcatel-Lucent, Ericsson, Huawei Technologies, Nokia shipments
2012.
We
estimate
that TDD-LTE BTS accounted for 6%
Siemens Networks (including Motorola), Samsung
of
overall
LTE
BTS
shipments in 2011. Distributed RRU
Electronics and ZTE.
BTS
shipments
were
48% of the overall market and are
• Some key and notable facts from the analysis
expected
to
grow
to
74%
by 2016,” says Lum.
include:
Some
key
predictions
from EJL Wireless Research
• EJL Wireless Research LLC was correct in predictLLC
for
2012:
ing a decline in overall BTS shipments for 2011
• Global BTS shipments will be down
with a forecast variance of 8.2%
• Global BTS GSM shipments
are expected to remain the
TM
largest category
• Global BTS LTE shipments are
expected to increase 42% and
System and Circuit
become the second largest category
Simulation Software
• Global BTS W-CDMA/HSPA+
shipments are expected to
decline by 50%
The top suppliers for overall base
station shipments as well as by air
interface standards for 2011
Check Web for Latest Specials
were:
www.appliedmicrowave.com
• O verall #1 BTS Supplier:
Ericsson
• Overall #1 GSM BTS Supplier:
Huawei Technologies
• Overall #1 W-CDMA/HSA+
BTS Supplier: Ericsson
• Overall #1 CDMA BTS
Supplier: ZTE
• Overall #1 LTE BTS Supplier:
Ericsson
LINC2 Visual System Architect
• Powerful
• Accurate
• Affordable
--EJL Wireless Research LLC
ejlwireless.com
RF & MW Design Software
To order, contact: www.appliedmicrowave.com
Get info at www.HFeLink.com
50 High Frequency Electronics
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isolation at 36 dB. Selective backside metallization is applied to the
switch, producing a surface mount
device. The topside is fully encapsulated with silicon nitride and has
an additional polymer layer for
scratch and impact protection.
These protective coatings prevent
damage during handling and
assembly.
M/A-COM Technology Solutions
Macomtech.com
RF Test System
AR RF/Microwave Instrumentation
is introducing a new Multi-tone RF
Test System that reduces radiated
immunity testing from days to
hours. The Multi-tone system,
model MT06000 (80 MHz – 6 GHz),
includes all the necessary instruments to perform radiated immunity testing per IEC 61000-4-3
except the required amplifiers,
antennas and directional couplers.
Amplifiers are selected and sized
based on your required field levels
and testing needs. The system mimics real world threats with the ability to expose EUT’s to more than
one frequency at a time. By testing
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efforts during dwell time to increase
testing speed. The AR Multi-Star is
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conduct RF immunity testing 10
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tested simultaneously is limited
only by the signal generator bandwidth (150 MHz) and the size of the
amplifier.
AR RF/Microwave Instrumentation
arworld.us
GaN Power Amp
The TriQuint TGA2576-FL is a
packaged wideband power amplifier fabricated on TriQuint’s production-released 0.25 um GaN on SiC
process. Operating from 2.5 GHz to
6 Ghz, it achieves 45.5 dBm saturated output power, 35% PAE and
26 dB small signal gain. Fully
52 High Frequency Electronics
matched to 50 ohms and with the
integrated DC blocking caps on
both I/O ports, the TGA2576-FL is
ideally suited to support both commercial and defense related opportunities. Samples and evaluation
boards are available. Features:
Frequency range: 2.5 – 6 GHz; Psat:
45.5 dBm @ Pin = 26 dBm; PAE:
35%; Small signal gain: 26 dB; Bias:
Vd = 30 V, Idq = 1.55 A, Vg = -3.3 V
typical; Dimensions: 11.4 x 17.3 x
3.0 mm.
TriQuint Semiconductor
triquint.com
Switch
M/A-COM Technology Solutions
Inc. introduced a new HMIC™ silicon PIN diode SPDT switch for
military, commercial, and weather
radar applications. The MASW011021 is a Surmount (Surface
Mountable) X-Band monolithic
SPDT switch designed for high
power and high performance applications. The surface mount chipscale configuration is designed with
minimal parasitic inductances and
capacitances that are usually associated with hybrid MIC designs.
The device is fabricated using M/ACOM Tech’s patented HMIC™ PIN
diode based process. Packaged as a
surface mountable die, the MASW011021 boasts low insertion loss of
0.65 dB and a high input to output
Switches
New from the Engineering Division
of Link Microtek is a series of waveguide switches that offer environmental sealing to IP65 standard,
enabling them to operate reliably
even when subjected to dusty or
moist environmental conditions.
Primarily aimed at automatic
transfer applications in redundancy
systems, the AM-WGS series
switches are particularly suitable
for use at civil or military
satellite-communications ground
stations. The devices are available
in a wide range of rectangular
waveguide sizes covering microwave frequencies from 2.6 to 40GHz,
typically for applications in the C,
X, Ku and Ka bands. Incorporating
a small, lightweight motor, these
electrically actuated switches offer
tell-back functionality to confirm
switch status and can also be operated manually in the event of a
localized power failure.
Link Microtek
linkmicrotekeng.com
Switch
The QK Series Coaxial Multi Switch
features K type Connectors with a
frequency of DC to 40GHz. Available
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sizes up to 4” O.D. They can incorporate edge steps and profiles for
mounting purposes and can be supplied with surface finishes to 20-10
scratch-dig per MIL-PRF-13830.
Spinel domes (Moh 8 hardness) in
sizes up to 6” O.D. are also offered.
Actuator options include normally
Open and TTL circuitry with
Integrated Indicator circuits.
Terminated models are also available with the 2.4mm Connector.
Features: RF Impedance: 50 ohms
nominal; Operating Temperature:
-35°C to +85°C ambient; Operating
Life: 1,000,000+ cycles; Switching
Time: 15 mSec max.; Switching
Sequence: Break Before Make;
Environmental: Designed to meet
MIL-E-5400 and Mil-S-3928.
Ducommun LaBarge Technologies
ducommun.com
Domes
Custom fabricated sapphire domes
for the protection of electro-optical
devices including detectors, sensors, and cameras in weapons systems are available from Meller
Optics, Inc. of Providence, Rhode
Island. Meller Sapphire Domes feature Moh 9 hardness, which is second only to diamond, and provide
160 degree maximum included
angles to extend the viewing angles
and protect electro-optics in the
front of guided weapons. Providing
up to 85% transmission uncoated in
the UV to IR, with up to 99% when
A/R coated on two sizes, they can
withstand very harsh environments. Unaffected by moving sand,
dirt, water, chemicals, and temperatures up to 1,000°C, Meller Sapphire
Domes can be manufactured in
Get info at www.HFeLink.com
54 High Frequency Electronics
Meller Optics, Inc.
melleroptics.com
Modulators/Demodulators
Richardson RFPD, Inc. announced
availability and full design support
capabilities for a group of high performance quadrature modulators
and demodulators for operation at
frequencies up to 2.4 GHz from
Analog Devices, Inc. (ADI). The
devices offer a combination of performance, broadband operating frequency, and flexible device architecture that makes them ideal for a
variety of wireless infrastructure
applications, including 2G, 2.5G
and 3G cellular base station radios,
high-capacity point-to-point and
point-to-multipoint radio links,
wireless LAN and aerospace and
defense equipment. The ADRF6806
and ADRF6807 are high dynamic
range IQ demodulators with integrated PLLs and VCOs. The fractional-N PLL/synthesizer generates
a frequency in the range of 2.8 GHz
to 4.2 GHz. A programmable
quadrature divider divides the output frequency of the VCO down to
the required local oscillator (LO)
frequency to drive the mixers in
quadrature. Additionally, an output
divider generates a divided-down
VCO signal for external use.
Richardson RFPD
richardsonrfpd.com
Clock Oscillator
Crystek Corp. launched the CCHD957, a new Ultra-Low Phase Noise
HCMOS Clock Oscillator with
Imita tor s Ca n Be D ang ero u s . ..
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High Frequency Products
NEW PRODUCTS
Standby Mode, featuring an
extremely low close-in phase noise
of -100 dBc/Hz @ 10Hz offset and a
typical noise floor of -170 dBc/Hz @
100kHz offset. This performance
makes Crystek’s HCMOS Clock
Oscillator family an industry-leading choice for use in applications
such as: DACs (digital-to-analog
converters), ADCs (analog-to-digital converters), DAB (digital audio
broadcasting), and professional CD
audio equipment. The Crystek
CCHD-957
HCMOS
Clock
Oscillator also features a “Standby
Function” – when placed in disable
mode, the internal oscillator is completely shut down and its output
buffer is placed in Tri-State. This
family is housed in a 9x14 mm SMT
package and operates with a +3.3V
power supply consumring 15mA of
current. Stability is rated at
20-50ppm (0°C to +70°C) and ±2550ppm (-40°C to +85°C).
Crystek Corp.
crystek.com
Transmit/Receive Module
RFMD’s new RF6559 is a Front
End Module (FEM) for 915MHz
AMR systems. It contains an integrated three-stage PA with 42dB of
gain and typical power output of
28dBm. The RF6559 allows for Tx/
Rx on a single antenna via 2 integrated SPDT switches. Tx filtering,
built-in Power Detector, and a twostage LNA with typical gain of
32dB are also included, packaged in
a 28-pin, 6mmx6mm laminate package with backside ground. Features:
Tx Output Power: 28dBm; Tx Gain:
42dB; Integrated Single Port Rx/Tx
50Ω; Bi-directional Transceiver
Interface; LNA with Bypass Mode.
Applications: Wireless Automated
Metering; Wireless Alarm Systems;
Portable
Battery
Powered
Equipment;
Smart
Energy;
868MHz/915MHz
ISM
Band
Applications; Single-Chip RF Front
End Module.
RFMD
rfmd.com
Time Delay/Phase Shifter
Hittite Microwave Corp. expanded
its Broadband Time Delay/Phase
Get info at www.HFeLink.com
56 High Frequency Electronics
shifter portfolio adding the
HMC911LC4B, which is ideal for
10G, 40G RZ-DQPSK, 100G DWDM
RZ Carver clock chain and skew
adjustments in the fiber optic
domain. The HMC911LC4B is a DC
to 24 GHz Broadband Time Delay
product that provides a continuously
variable delay from 0 ps to 70 ps
while maintaining a constant differ-
ential output voltage swing. The
device accepts either single-ended or
differential input data, while the differential output swing is adjustable
from 150 mVp-p to 800 mVp-p. The
modulation bandwidth is 1.6 GHz,
which is the highest phase modulation bandwidth available in the market. Suitable for both clock and data
retiming
applications,
the
HMC911LC4B features internal
temperature compensation and bias
circuitry to minimize delay variations with temperature. All RF input
and outputs of the HMC911LC4B
are internally terminated with 50
Ohms to Vcc, and may either be AC
or DC coupled.
Hittite Microwave Corp.
hittite.com
GVA
-81
+
10 d
B
GVA
GVA -83+
-63
+
GVA
GVA -82+
-62
+
20 d
B
15 d
B
GVA
-84
+
24 d
B
+20 dBm Power Amplifiers with a choice of gain
DC to 7 GHz
*
w
2 Neels!
d
Mo
The GVA-62+ and -63+ add ultra-flat gain to our GVA lineup,
as low as ±0.7 dB across the entire 100 MHz-6 GHz band!
All of our GVA models are extremely broadband, with a wide
dynamic range and the right gain to fit your application.
Based on high-performance InGaP HBT technology, these
patented amplifiers cover DC* to 7 GHz, with a gain
selection of 10, 15, 20 or 24 dB (at 1 GHz). They all provide
better than +20 dBm typical output power, with typical IP3
*Low frequency cut-off determined by coupling cap,
except for GVA-62+ and GVA-63+ low cutoff at 10 MHz.
US patent 6,943,629
PLIFIERS
159
$
from
ea. (qty.1000 )
performance as high as +41 dBm at 1 GHz. Supplied in
RoHS-compliant, SOT-89 housings, low-cost GVA amplifiers
feature excellent input/output return loss and high reverse
isolation. With built-in ESD protection, GVA amplifiers are
unconditionally stable and designed for a single 5V supply.
Just go to minicircuits.com for technical specifications,
performance data, export info, pricing, and everything you
need to choose your GVA today!
Mini-Circuits…we’re redefining what VALUE is all about!
®
ISO 9001
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ISO 14001 AS 9100
P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661
The Design Engineers Search Engine finds the model you need, Instantly • For detailed performance specs & shopping online see
U.S. Patents
7739260, 7761442
IF/RF MICROWAVE COMPONENTS
458 rev H
High Frequency Products
NEW PRODUCTS
Vector Signal Generator
Rohde & Schwarz added new functionality to its R&S®SMU200A vector signal generator: Equipped with
the R&S®SMU-K77 option, the
R&S®SMU200A simulates dynamic fading scenarios for testing military radio communications equipment. This makes it possible to
verify the performance of military
radios and optimize their hardware
to enable smooth operation under
harsh receiving conditions such as
dynamic fading and multipath signal propagation. Fading simulation
enables precise and repeatable
tests in the lab and eliminates the
need for expensive field or flight
tests.
The
state-of-the-art
R&S®SMU200A vector signal generator offers – in a single box – all
the necessary tools to generate the
desired test signals and interferers,
and to simulate a radio channel.
Together with the R&S®SMU-K77
option, the R&S®SMU200A supports high Doppler speeds and
dynamic scenarios including:
Tower-to-aircraft mode, simulating
radio communications during aircraft take-off, fly-by and landing;
Ship-to-ship mode, simulating radio
communications between two ships
traveling on straight paths; and
User-defined mode, providing ultimate flexibility in transmitter and
receiver trajectory simulation.
Rohde & Schwarz
rohde-schwarz.com
Cal Kit
This economical calibration kit for
SMA-female-connectors from HHF
allows easy and quick broadband
VNA-measurements of microwave
devices up to 8 GHz, which is
achieved with three SMA-standards
for the four calibration measurements short (S), open (O), load (L)
and thru (T). This EcoCal calibration kit has enjoyed long-term successful use at the University of
58 High Frequency Electronics
Applied Science Aachen and many
other laboratories.
Heuermann HF-Technik GmbH
hhft.de
Filter
The
new
Mini-Circuits’
ZX75BS-160+ is a band stop filter
built in a rugged and compact connectorized package. This filter
offers good rejection in stopband
and has repeatable performance
across lots and consistent perfor-
mance across temperature. Useful
in instrumentation systems for
industrial applications. Features:
high
rejection: ZX75BS-160+
enables the filter to attenuate spurious signals without compromising
pass band signal; connectorized
package: easy to interface with
other devices and well suited for
test setups. Can be used in systems
to prevent noise and avoid jamming
by marine communication, IVHS,
paging, and other radio systems.
Mini-Circuits
minicircuits.com
IR Inspection System
McBain Systems introduced a new,
more affordable system for interior,
infrared (IR) inspection—for the
semiconductor and other advanced
technology industries. The new
BT-IR
Benchtop
Infrared
Microscope System allows an operator to see through materials that
are transparent in the infrared
range between 740nm and 1700nm.
Initial experiments indicate that it
is able to penetrate thicker, more
highly doped materials with rougher surfaces than other systems—
and deliver higher quality images.
The BT-IR yields submicron-precision optical measurements, and its
staging provides up to 0.1 micron
linear encoder resolution. In addition, the system is reputed to have
the highest resolution 900-1700
InGaAs digital camera in its class.
McBain Systems
mcbainsystems.com
Switching Platform
Giga-tronics Inc. announced the
release of the new Giga-tronics
ASCOR rackmount/benchtop microwave switching solution, the Series
8900. The new 8900 microwave
switching platform provides the
ultimate in scalability and reconfigure-ability. Wide variety of Available
Relays – While being only 2U tall,
the 8900 series is configured to support relays of various sizes from 1x2
up to 1x12 either terminated or unterminated types. In addition, the
8900 is designed to support two
families of relays, one for ultra-high
reliability for high use applications,
and the other focused on lower use
applications at reduced cost. This
provides the utmost in flexibility in
providing a switching system that
meets the customer’s requirements
for cost, reliability and configuration.
Giga-tronics Inc.
gigatronics.com
High Frequency Products
NEW PRODUCTS
instruments allow Keithley’s customers to characterize an even
broader range of power semiconductor devices and materials. A built-in
3,000V, 180W source allows the
Model 2657A to source up to five
times as much power to a device
under test as the nearest competitive system, at significantly lower
cost. The precision, high speed 6-1/2digit measurement engine built into
the Model 2657A enables 1fA (femtoamp) current measurement resolution to support the low-leakage
requirements of next-generation
power semiconductor devices.
Keithley Instruments
keithley.com
Analog Design Kit
The Digilent Analog Discovery
Design Kit ($99 USD) and the more
Reed Relays
MEDER electronic Inc. announced
availability of the new UMS series
of Micro Single-In-Line (SIL) Reed
Relays, ideal for use in test systems
and closely stacked matrices applications in the test and measurement, telecommunications, and
security industries. As a drop-in
replacement SIL relay, the UMS
series requires less PCB space than
other options on the market. At only
9.5 x 3.6 x 6.85mm, the UMS relays
are about half the size of the standard MS series, but offer the same
electrical characteristics as their
larger SIL relay equivalent.
Specifically designed with a slim
molded body and internal magnetic
shield, the UMS relays can be used
in very closely stacked matrices
often required in test and measurement applications.
MEDER electronic Inc.
meder.com
Semiconductor Test Unit
Keithley Instruments, Inc. introduced the Model 2657A High Power
System SourceMeter® instrument.
The Model 2657A adds high voltage
to the company’s Series 2600A
System SourceMeter® family of
high speed, precision source measurement units. Together, these
Optical Power Monitor
• Measure Optical Power from
100µW to 1mW
• Wavelength form 900nm to 1600nm
• 0.500 Volts Output Increase per
Decade Increase in Optical Power
• Integrated Single Mode Fiber, InGaAs,
Photodiode, and TemperatureCompensated Log Amplifier
• Single +5VDC Operation
•
•
•
•
•
•
Subminiature Proportional
& PI Controlled Heaters
Beryllia and Aluminum Nitride
Heater Substrate
Self Contained Control Electronics
Temperature set with a Single Resistor
Set temperature from Ambient to 150°C
5 to 50VDC Operation
5 to 50Watts of Power
Control the Temperature of:
Microwave Frequency Sources, Saw Filters, Optical Arrayed Waveguides (AWGs)
Get info at www.HFeLink.com
April 2012
59
High Frequency Products
NEW PRODUCTS
Product Showcase
advanced Digilent Analog Explorer
Design Kit ($199 USD) allow students to build and test a wide range
of analog and digital circuits using
their own PC without the need for
any other equipment. This approach
eliminates the time and space limitations of traditional university lab
settings and allows students more
flexibility to experiment with real
circuits through direct hands-on
experience. Digilent is the leading
supplier of academic electrical engineering design kits with kits in use
at over 1,500 universities in 70
countries. ADI is one of the world’s
leading analog semiconductor companies.
Analog Devices, Inc.
analog.com
VCO
Crystek’s CVCO55CC-2800-3075
VCO (Voltage Controlled Oscillator)
operates from 2800 MHz to 3075
MHz with a control voltage range of
1.0V~15V. This VCO features a typical phase noise of -104 dBc/Hz @
10KHz offset and has excellent linearity. Output power is typically +2
dBm. Engineered and manufactured
in
the
USA,
the
model
CVCO55CC-2800-3075 is packaged
in the industry-standard 0.5-in. x
0.5-in. SMD package. Input voltage
is 5V, with a max. current consumption of 20 mA. Pulling and Pushing
are minimized to 4.0 MHz and 2.0
MHz/V, respectively. Second harmonic suppression is -15 dBc typical.
Crystek
crystek.com
60 High Frequency Electronics
HFE’s Product
Showcase
Your ad will stand out when
it’s displayed in our Product
Showcase!
For more information, or
to place your ad, please
contact:
Joanne Frangides
Tel: 201-666-6698
Fax: 201-666-6698
[email protected]
www.highfrequencyelectronics.com
Product Showcase
Advanced
Switch
Technology
754 Fortune Cr, Kingston, ON
K7P 2T3, Canada.
613 384 3939
[email protected]
Our line of Waveguide, Coaxial and Dual Switches are the most
reliable in the industry, but don’t just take our word for it. Join
the hundreds of satisfied customers who use our switches every
day.
When only the best will do
WIRELESS COMMUNICATIONS
30
Years
Fast Pulse Test Solutions from AVTECH
Avtech offers over 500 standard models of high-speed
pulse generators, function generators, and amplifiers
ideal for both R&D and automated factory-floor testing.
Typical Output Waveform
2 A/div, 40 ns/div
AVR-CD1-B Reverse Recovery Test System
Some of our standard models:
AVR-EB4-B:
AV-156F-B:
AVO-9A-B:
AV-151J-B:
AVOZ-D2-B:
AVR-DV1-B:
+2A / -4A pulser for diode reverse-recovery time tests
+10 Amp constant current pulser for airbag initiator tests
200 mA, 200 ps rise time driver for pulsed laser diode tests
±400 V, 50 kHz function generator for piezoelectric tests
700 V, 70 A pulser for production testing of attenuators
1000 V, variable rise-time pulser for phototriac dV/dt tests
Pricing, manuals, datasheets: www.avtechpulse.com
Avtech electrosystems ltd. | Tel: 888-670-8729
PO Box 265 Ogdensburg, NY 13669 | Fax: 800-561-1970
www.highfrequencyelectronics.com
E-mail us at: info@
avtechpulse.com
Product Highlights
SAW Filters
Diodes
Richardson RFPD, Inc. announced availability and
full design support capabilities for three new RF Surface
Acoustic Wave (SAW) filters from TriQuint Semiconductor,
Inc. The high performance filters are ideally-suited for
wireless infrastructure applications, including 3G standards, such as Wideband Code Division Multiple Access
(WCDMA); 4G standards, such as Long Term Evolution
(LTE); Multistandard platforms, as well as repeaters and
other general purpose wireless applications. The filters,
identified as 856977, 857019 and 856934, offer substantial benefits, including low insertion loss, high attenuation, excellent power handling, drop-in compatibility with
competitor parts, and in the case of the 857019 and
856934, no matching is required. All three of the filters
are available in 3 x 3 mm hermetic ceramic packages.
Skyworks introduced three new miniature 0402
hyperabrupt varactor diodes for VCO, phase noise and
voltage-tuned filter applications. These discrete, small
form factor devices are offered in a low profile plastic surface mount technology package where low resistance, lowseries inductance and a large capacitance ratio are
required. These solutions are ideal for several markets
including WLAN, CATV, energy management, wireless
infrastructure and military.
Skyworks Solutions, Inc.
skyworksinc.com
RichardsonRFPD
richardsonrfpd.com
Fixed Frequency Synthesizer
Z-Communications, Inc. announced a RoHS compliant
Fixed Frequency Synthesizer model SFS1900A-LF in
L-band. The SFS1900A-LF is a single frequency synthesizer that operates at 1900 MHz. This Synthesizer features a typical phase noise of -98 dBc/Hz @ 10 KHz offset
and typical sideband spurs of -70 dBc. The SFS1900A-LF
is designed to deliver a typical output power of 0 dBm
with a VCO voltage supply of 5 Vdc while drawing 25 mA
(typical) and a phase locked loop voltage of 3.3 Vdc while
62 High Frequency Electronics
drawing 10 mA (typical) over the temperature range of
-40º to 85º C. This Fixed Frequency Synthesizer features
typical 2nd harmonic suppression of -20 dBc and comes in
Z-Comm’s industry standard PLL-V12N package measuring 0.60 in. x 0.60 in. x 0.13 in. It is available in tape and
reel packaging for production requirements. The
SFS1900A-LF is also ideal for automated surface mount
assembly and reflow.
Z-Communications
zcomm.com
QUALITY, PERFORMANCE AND RELIABILITY
IN PRECISION COAXIAL CONNECTORS
BETWEEN SERIES
ADAPTERS
EDGE LAUNCH
CONNECTORS
BULKHEAD & PANEL
ADAPTERS
CABLE CONNECTORS
IN SERIES ADAPTERS
CUSTOM DESIGNS
ADAPTERS · CABLE CONNECTORS · RECEPTACLES · CUSTOM DESIGNS
Including These Connector Series
1.85mm
2.4mm
DC-65 GHz
DC-50 GHz
2.92mm
3.5mm
DC-40 GHz
DC-34 GHz
7mm
SSMA
DC-18 GHz
DC-40 GHz
ISO 9001:2008
SGMC Microwave — The name to count on for Quality, Performance
and Reliability! Please contact us today by Phone, Fax or Email.
Manufacturer of Precision Coaxial Connectors
620 Atlantis Road, Melbourne, FL 32904
Phone: 321-409-0509 Fax: 321-409-0510
[email protected]
www.sgmcmicrowave.com
Get info at www.HFeLink.com
Product Highlights
Transceivers
PLO
Linear Technology Corporation introduced automotive
(H-grade) and high reliability military (MP-grade) versions of the LTM2881 and LTM2882, isolated µModule®
transceivers which guard against large ground-to-ground
differentials and common-mode transients in RS485 and
RS232 networks. The LTM2881 single RS485 and
LTM2882 dual RS232 transceivers break ground loops by
isolating the logic level interface and line transceiver
using internal inductive signal isolation. This allows for a
much larger common- mode voltage range plus superior
common mode rejection >30kV/us. A low EMI, 1W DC/DC
converter generates the power supplies for driving RS485
or RS232 levels and provides an additional isolated 5V
supply output for powering any supporting external components. With 2,500VRMS of galvanic isolation, onboard
secondary power, and fully compliant transmitters and
receivers, the LTM2881 and LTM2882 require no external
components, providing complete, compact µModule solutions for isolated serial data communications.
The ESP-11000 Phase-Locked Oscillator from EM
Research operates at 11000 MHz and features exceptionally-low phase noise (<-112 dBc/Hz @ 10 KHz). The unit is
phase-locked to a 200 MHz external reference and offers +3
dBm output power, low spurs (<-80 dBc), low harmonics
(<-40 dBc), while operating off +8VDC supply with low
power consumption (<250 mA). The ESP units are designed
as DRO replacements for test and measurement or in
Hi-Rel, ruggedized ground and airborne applications, such
as SATCOM, Electronic Warfare, Radar and Telemetry.
Custom units are available in fixed frequencies from 50
MHz to 26 GHz, with optional internal references, in a connectorized DRO standard package of just 2.25” x 2.25” x
0.6”. The package can be optionally hermetically-sealed.
EM Research, Inc.
emresearch.com
Linear Technology
linear.com
Signal and Spectrum Analyzer
The Rhode & Schwarz FSW signal and spectrum analyzer comes in three models that cover the frequency
ranges 2 Hz to 8 GHz, 13 GHz or 26.5 GHz. The R&S FSW
was specially designed to meet the requirements of development laboratories in the aerospace, defense and communications industries. The practical 12.1” touchscreen
with its MultiView function allows users to display the
results of different applications on the touchscreen at the
same time, enabling them to keep track of even the most
complex signal analyses and find errors more easily. An
64 High Frequency Electronics
additional benefit is the elimination of time-consuming
switching between measurement applications. At 10 kHz
carrier offset, the R&S FSW achieves a phase noise specification of less than –137 dBc (1 Hz), which is up to 10 dB
less than comparable instruments on the market. This is
especially important for developers of RF components and
complete systems for radar applications. By taking advantage of the analyzer’s excellent phase noise specification,
they can achieve more stable radar signals.
Rohde & Schwarz
rohde-schwarz.com
Product Highlights
VCOs for Radio Applications
M/A-COM Technology Solutions Inc. introduced a set
of voltage controlled oscillators (VCOs) for radio applications. The VCOs are ideal for point-to-point radio, point to
multipoint radio, communications systems, and low phase
noise applications. The InGaP HBT-based VCOs are easily integrated into a phase lock loop, using a divide-by-two
output. The MAOC-009871, MAOC-009872, and MAOC010334 meet the high performance requirements of high
capacity digital radios by optimizing for low phase noise,
wide tuning range, and low current consumption.
Packaged in a lead-free 5mm, 32-lead PQFN package, the
VCOs feature an integrated buffer amplifier and excellent
temperature stability. The package also features low lead
inductance and an excellent thermal path. Operating
with case temperature at or below +85°C, the VCOs
allows for a MTBF of 2,500,000 hours. With a 5.0 V bias
supply, these VCOs operate between the 8.4 GHz to 11.8
GHz frequency band.
Passive devices can produce intermodulation products
detrimental to communications systems and test equipment that combine multiple signals into one channel.
EPX Microwave is adding very low passive intermodulation level (PIM) SPDT, transfer, and multi-pole switches
operating from DCV to 3 GHz to its popular switch line.
The switches with 7/16 DIN connectors produce PIM
below -160 dBc while still providing low insertion loss of
0.20 dB and 70 dB isolation to the off port. With Type N
connectors the PIM is below -150 dBc and with SMA connectors below -140 dBc. More information on these products is available on the EPX Microwave website.
M/A-Com Technology Solutions
macomtech.com
EPX Microwave Inc.
epxmicrowave.com
Frequency Mixers
Mini-Circuits’ 300 MHz to 12 GHz MAC series of mixers,
featuring LO levels of 4 to 17 dBm, employ a unique new
design and a highly repeatable, tightly controlled, automated process that delivers industry-leading reliability at
an affordable price. Schottky diode quads meeting strict
specifications are bonded to a multilayer integrated LTCC
66 High Frequency Electronics
Switches
substrate, and then hermetically sealed under a controlled atmosphere with gold-plated covers and eutectic
AuSn solder. Every MAC mixer is backed by a 3-year
guarantee.
Mini-Circuits
minicircuits.com
Product Highlights
Capacitor
Vishay Intertechnology, Inc.’s multilayer ceramic chip
capacitor (MLCC) features an integrated resistor and low
electrostrictive ceramic formulation. For high-pulse-current applications, the VJ controlled discharge capacitor
(CDC) offers excellent reliability, high voltage ratings from
1000 VDC to 1500 VDC, and a capacitance range from 33
nF to 560 nF. The integration of a high-capacitance MLCC
with a bleed resistor on its surface allows the VJ CDC to
discharge more rapidly, while also reducing board space
requirements and assembly costs. Typical applications for
the device will include detonation devices (munitions, pyrotechnics, blasting) and electronic fuzing. The capacitor is
manufactured in Noble Metal Electrode Technology (NME)
with a wet build process. The VJ CDC features a low electrostrictive ceramic formulation for repeated charge and
discharge cycles, allowing the device to achieve very high
field reliability. The VJ CDC is offered in the 3040, 3640,
and 4044 case sizes, and is available with X7R and X5P
dielectrics. The device features a wide capacitance range of
33 nF to 220 nF in the 3040 case size, 47 nF to 330 nF in
the 3640, and 100 nF to 560 nF in the 4044.
High Power Pulsed Amp
The HHPAW-441 is a W-Band Pulsed High Power
Amplifier that offers + 27 dBm (1/2 watt) of RF power
over the range from 92 to 96 GHz. This amp can be operated with a variable pulse rate from CW to 100 nS. It uses
the latest MMICs that are power combined for the maximum RF power and gain. Various gain and power combinations are offered: gain levels from 7 to 30 dB SSG and
power from 50 to 500 mW are available with +30 dBm
(1W) presently in development. The variable pulse width
can be tuned from 100 nS to full-on CW with rise and fall
times at less than 10 nS. The HHPAW-441 has 20 dB of
gain with +/- 1.8 dB flatness and + 26 dBm of power. A
heat sink is supplied with the amp.
HXI Millimeter Wave Products
hxi.com
Vishay Intertechnology
vishay.com
ELINT Downconverter
Norden Millimeter has designed and is presently
manufacturing for the Electronic Intelligence (ELINT)
market a 24 GHz to 40 GHz Down Converter with an
integrated 0.8 GHz to 24 GHz Bypass path for combining
both into a single 0.8 to 24 GHz IF output. Norden uses a
variety of technologies to miniaturize multiple functions
into a single small house running off a single power supply voltage to minimize size weight and power.
Norden Millimeter
nordengroup.com
April 2012
67
Product Highlights
800 Watt Termination
Florida RF Labs’ high performance, flange mounted,
800 watt termination, model 32M7200F, offers outstanding
performance and low VSWR and the convenience of bolt on
installation. It has been optimized for performance in the
DC-0.5 GHz frequency range, boasting a 1.10:1 maximum
VSWR, making it very appealing to the Broadcast, Public
Safety and Medical (MRI) markets. This termination offers
high power, integrated heat sink, and tab launch. It exhibits excellent thermal characteristics through a superb heat
distribution design. Package size is 1.900” (456.26mm) X
1.040” (26.42mm) and delivered in a convenient tray package. This product is also non-magnetic and RoHS and
REACH compliant. In addition to the flange termination,
Florida RF Labs offers a complete line of non-magnetic
products for the Medical MRI market. All products are
100% tested in production for magnetism.
Florida RF Labs
emc-rflabs.com
E-Band Gunn Oscillator
Model SOM-77302320-12-S1 is a free running, E band
mechanically tuned Gunn oscillator with output power 20
dBm and tuning bandwidth +/- 1 GHz. The mechanical
tuning is accomplished via a self-locking tuning screw or
micrometer. Bias voltage and current to operate the oscillator is at +10 Vdc and 200 mA typically. The oscillator is
also bias tunable to allow frequency modulation via its
68 High Frequency Electronics
SAW Filter
Crystek’s line of SAW Band Pass Filters, the CBPFS
Series, are encased in a rugged SMA housing and
designed for test equipment and general lab use. Six models, with center frequency ranges from 836.5 through
1960.0 MHz, compose the CBPFS line. The Crystek
CBPFS SAW Band Pass Filter line has excellent out-ofband rejection and features 50-ohm SMA connectors.
Band pass width is rated at 25 MHz, 26 MHz or 60 MHz,
depending on model. All filters in the CBPFS family have
an operating temperature range of -40°C to 85°C.
Crystek
crystek.com
bias port. While the oscillator exhibits moderate frequency stability, an optional heater can be installed to further
improve temperature performance with a single bias at
+10 Vdc to supply heating power up to 5 watts. This
mechanically tuned Gunn oscillator family also includes
the models to cover Q, U, V and W band.
SAGE Millimeter, Inc.
sagemillimeter.com
2012
EDITORIAL CALENDAR
I
Coaxial Cable
Assemblies
Reliable •
Responsive •
Quality •
May
n Signal Generation
n MM-Wave
n IMS Preview
June
n Radar and Avionics
n Antennas
n EMI/EMC
Products: 3G, 4G, Substrates and
Laminates, Power Products
Products: Antennas, Front-End
Components, Defense/Homeland Security
Bonus Distribution: MTT IMS, June 17-22
Bonus Distribution: AP/URSI, July 8-14
July
n High Power
n Cables and Connectors
n Sensors
August
n High Speed Digital
n VCOs & Synthesizers
n Wireless ICs
Products: Telecom, Filters, EMC Products
Products: Switches, Synthesizers, EDA,
Power Amps
Bonus Distribution: IEEE EMC Symposium,
Aug 5-9
September
n G
overnment and Military Electronics
n S
imulation and Layout Software
n COTS Components
October
n Aerospace
n Cables and Connectors
n ICs & Devices
Products: Modules, ICs, Filters
Products: Design Software, Space
Products, Amplifiers
Bonus Distribution: EuMW Week, Oct
29-Nov 2 MILCOM, Oct 29-Nov 1
• Semi-rigid
• Flexible
• Conformable
• Stainless Steel
• Delay Lines
• Phase Matched
• Cryogenic
• Armored
• Wire Harness
• Testing to 50 GHz
• Various Dielectrics
• Meet or Exceed MIL Standards
(360) 426-5719
ssicable.com
Get info at www.HFeLink.com
Bonus Distribution: AOC International,
Sept 23-26
November
n M
icrowave and Power Modules
n MM-Wave
n Signal Generation
December
n Communications
n Mixers and Amps
n S
ubsystems and Systems – Power
Products: MM-Wave, Passives, Test and
Measurement
Bonus Distribution: Asia Pacific
Microwave
Conference, Dec 4-7
Products: RFICs & MMICs, Signal
Generation, Software
Press Releases
Press releases for our informational
columns should be sent by the first
of the month prior to the desired
publication date (e.g., April 1 for
the May issue). Late-breaking news
can be accommodated, but please
advise the editors of urgent items
by telephone or e-mail.
[email protected]
Bonus Distribution: Radio Wireless Week,
Jan 15-18
Article Contributions
We encourage the submission of
technical articles, application notes
and other editorial contributions.
These may be on the topics noted
above, or any other subject of current interest. Contact us with article
ideas:
[email protected]
INCREDIBLE
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Outstanding IP3, at low DC power. Mini-Circuits HXG
amplifiers feature an eye-popping IP3 of +46 dBm, at only
730 mW DC power. A typical gain of 15 dB, output power of
23 dBm, and an IP3/P1dB ratio of 23 dB make them very useful for output stage amplifiers. All this, and surprisingly low noise
figures (2.4 dB) extend their usefulness to receiver front-end
circuitry! All in all, the HXG family delivers incredible performance
with less heat dissipation, for greater reliability and a longer life.
MSiP brings it all together. Our exclusive Mini-Circuits System
in Package techniques utilize load-pull technology and careful
impedance matching to reach new levels of performance
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Our first two HXG models are optimized for low ACPR at
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also ideal for applications in high-EMI environments and instrumentation, where low distortion is essential. HXG performance
is only available at Mini-Circuits, and our new models are ready
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patented broadband mixers that are specially designed to help improve overall dynamic range.
With a wide selection of models, you’ll find a LAVI mixer optimized for your down converter and
up converter requirements. Visit the Mini-Circuits website at www.minicircuits.com for comprehensive
performance data, circuit layouts, and environmental specifications. Price & availability for on-line
ordering is provided for your convenience.
Check these LAVI Mixer outstanding features!
• Very wide band, 2 to 3100 MHz
• Ultra high IP2 (+60 dBm) and IP3 (+36 dBm)
• -73 dBc harmonic rejection 2LO-2RF, 2RF-LO
• Super high isolation, up to 52 dB
• High 1dB compression, up to +23 dBm
• Extremely low conversion loss, from 6.3 dB
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®
ISO 9001
®
ISO 14001 AS 9100
P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661
The Design Engineers Search Engine finds the model you need, Instantly • For detailed performance specs & shopping online see
U.S. Patents
7739260, 7761442
IF/RF MICROWAVE COMPONENTS
451 Rev J
The difference:
apples and
s?
Product Highlights
You decide.
Low Pass Filter
MegaPhase - Simply Better
Unmatched service before and
after our unmatched delivery
time, backed by our industryleading12 month warranty.
MegaPhase cables are still the
“Lowest Cost per Measurement”
and always phase stable.
Best overall value - period.
VNA Test Port Extension Cable
3.5mm connectors, 26.5 GHz, 38 in
Alternative OEM:
$3,505
MegaPhase:
$800
2.4mm connectors, 50 GHz, 38 in
Alternative OEM:
$6,033
MegaPhase:
$1,256
Mini-Circuits’ model NLP-500+ is
a connectorized low pass filter, built
in N-unibody. Covering DC to 500
MHz, it offers a very low passband
insertion loss 0.5 dB typical and a
wide stop band rejection. Designed
for any environment, the NLP-500+
is equipped with a rugged shielded
case and with a wide operating temperature range (-55 deg C to 100 deg
C). Suitable for many environments
and applications, the new model features wide rejection; minimal passband insertion loss; and more than
40 dB rejection up to 4500 MHz and
40 dB typical up to 10 GHz.
Mini-Circuits
minicircuits.com
1.85mm connectors, 67 GHz, 38 in
Alternative OEM:
$8,021
MegaPhase:
$1,770
Very typical Test cable comparison.
Probe Station for
Semiconductors, MICs
J microtechnology features its
model Jr -2745 manual, benchtopsize microprobing environment for
engineers and scientists. Unit is useful in the electrical test and analytical evaluation of semiconductor
devices, planar components, and
microwave assemblies. Test samples
can be clamped with a vacuumassisted stage/chuck.
Available
microwave microprobing positioners
can be mounted on three or four
sides with optional insert plate and/
or on four corners, making difficult
differential measurements much
easier. Features include applicationdriven design; 6- and 8-inch wafer
capability; stable and rigid unit for
consistent, repeatable measurements; manually operated top plate
lift; slide out for easy loading; vibration isolation; integral vacuum
accessory manifold, and more.
J microTechnology
jmicrotechnology.com
Excellence in RF Interconnects
2098 West Main Street
Stroudsburg, PA 18360
Tel: 1-888-259-9067
Fax: 1-877-MegaFax / 570-424-6031
Email: [email protected]
Web: www.megaphase.com/hfe
Get info at www.HFeLink.com
72 High Frequency Electronics
75 – 110 GHz Detector
Spacek Labs’ model DW-2 is a
full-band, 75-110 GHz detector – a
cost-effective way of measuring
power in the W-band spectrum. The
RF input is WR-10 (UG387/UM) and
the output is SMA (F). These detectors can be used as fast data rate
receivers, with up to 3 GHz bandwidth at the 3 dB point into a 50-ohm
load. Typical input sensitivity is 1500
mV/mW at -20 dBm input power.
Using a 10 megohm load the sensitivity is 1500 mV/mW at -20 dBm
input power. Flatness across the
band is +/- 2 dB with a typical tangential sensitivity of -45 dBm in a 1
MHz video bandwidth. Maximum
input power is +18 dBm. This detector is available with positive (P) or
negative (N) output polarity.
Spacek Labs
spaceklabs.com
Look What’s Happening at IMS2012!
Plenary Session Speaker: Steve Mollenkopf
President and Chief Operating Officer, Qualcomm
3G/4G Chipsets and the Mobile Data Explosion
Monday, 18 June 2012
1730-1900
The rapid growth of wireless data and complexity of 3G and 4G chipsets drives new design
and deployment challenges for radio and device manufacturers along with carriers. This
talk will provide a perspective on the problem from the point of view of a large, worldwide
manufacturer of semiconductors and technology for cellular and connected consumer
electronics devices. The increase in device and network complexity will result in significant
business opportunities for the industry.
Closing Ceremony Speaker: Thomas H. Lee
Professor, Stanford University
The Fourth Age of Wireless and the Internet of Everything
Thursday, 21 June 2012
1600-1730
“Making predictions is hard, particularly about the future.” The patterns of history are rarely
discernible until they’re obvious and perhaps irrelevant. Wireless may be an exception,
at least in broad outline, for the evolution of wireless has been following a clear pattern
that tempts us to extrapolate. Marconi’s station-to-station spark telegraphy gave way to a
second age dominated by station-to-people broadcasting, and then to today’s ubiquitous
people-to-people cellular communications. Each new age was marked by vast increases in
value as it enlarged the circle of interlocutors. Now, these three ages have covered all combinations of “stations” and
“people,” so any Fourth Age will have to invite “things” into the mix to provide another stepwise jump in the number
of interlocutors. This talk will describe how the inclusion of multiple billions of objects, coupled with a seemingly
insatiable demand for ever-higher data rates, will stress an infrastructure built for the Third Age. Overcoming the
challenges of the coming Fourth Age of Wireless to create the Internet of Everything represents a huge opportunity
for RF engineers. History is not done.
The IMS2012 Housing Bureau and Registration are now open!
Don’t miss your chance to see the latest RF/Microwave technology advancements while accessing over 500 companies
technologies and services.
Visit http://ims2012.mtt.org for complete details and to download your Program Book. Review technical sessions,
workshop descriptions and exhibiting companies so you can make the most of your time at Microwave Week!
http://ims2012.mtt.org
Product Highlights
Power Sensors
LNA
MITEQ Model AMF-2F-00020050-20-28P is part of its
family of low noise, wideband, and ultra-small coaxial
LNAs in the 20 to 500 MHz band. This LNA has over 35
dB of gain in a housing that is only 1.22” long and 0.88”
wide without the field-replaceable SMA connectors that
are mounted on a removable heatsink. Gain flatness is a
maximum of ±1.75 dB, though typical is ±1.0 dB. The
AMF-2F-00020050-20-28P has a maximum noise figure of
2.0 dB in the full band, though the typical value is 1.5 dB.
This unit operates from -40 to +75°C, has an output P1dB
of minimum +28 dBm, output IP3 of typically +40 dBm,
output 1P2 of typically +58 dBm, and a current draw of
maximum 500 mA from a single +15V DC from 25 to 50
dB are available in the same outline. The aluminum alloy
housing provides excellent thermal performance in addition to being very small and lightweight. Hermetic sealing is an option. Wider frequency options are available.
Miteq
miteq.com
The R&S NRP-Z211 and NRP-Z221 two-path diode
power sensors from Rohde & Schwarz offer high measurement speed and accuracy for a price-sensitive market. The
R&S NRP-Z211 (up to 8 GHz) and R&S NRP-Z221 (up to
18 GHz), round out the company’s portfolio of multipath
diode power sensors in the lower price segment. Power
measurements over a dynamic range of 80 dB (-60 dBm to
+20 dBm) are now possible for both CW and modulated
signals. The noise component is two times less than that of
comparable solutions on the market. As a result, measurement speed is increased by a factor of four. The overlapping
diode paths are measured in parallel. They are weighted in
the transition range to ensure a smooth transition between
measurement paths and eliminate differential nonlinearity. In addition, the user does not have to switch paths, since
both diode paths are measured in parallel. This increases
measurement accuracy and reduces measurement times.
The new power sensors can be operated on the R&S NRP2
base unit and on virtually all signal generators, spectrum
analyzers and network analyzers from Rohde & Schwarz.
In combination with the R&S NRP-Z4 USB adapter, the
sensors can be used directly with a PC.
Rohde & Schwarz
rohde-schwarz.com
Waveguide Couplers
The AM-C series of broadwall waveguide couplers
from the Engineering Division of Link Microtek feature a
high directivity of up to 45dB and a low main-line VSWR
of 1.06:1, making them ideal for accurate measurement of
power levels in microwave systems. Offered in a wide
range of rectangular and double-ridge sizes covering frequencies from 1.12 to 40GHz, the devices have very flat
and precise coupling values over the full band, with both
mean coupling and frequency sensitivity specified as
+/-0.5dB.
74 High Frequency Electronics
They are available with either waveguide flange outputs or a variety of different connectors, including SMA,
N-type and TNC. Standard coupling values are 3, 6, 10,
20, 30 and 40dB. Designed and manufactured by Link
Microtek at its premises in the centre of Basingstoke, the
AM-C couplers are fabricated as standard from lightweight Alochromed aluminium and can also be supplied
in brass or other materials to special order.
Link Microtek
linkmicrotekeng.com
TIMES MICROWAVE SYSTEMS
Available From Stock !!
LMR
LMR-75
LMR-FR
LMR-UltraFlex
LMR-PVC
LMR-DB
LMR-LLPL
TFlex 402
TFlex 405
StripFlex
StripFlex II
Connectors &
Accessories
LMR® TFlex® and StripFlex®
are Registered Trademarks of
Times Microwave Systems
DISTRIBUTED BY:
Phone: (888) 591-4455 or (772) 286-4455 Fax: (772) 286-4496
E-mail: [email protected]
Web Site: www.microwavecomponentsinc.com
Get info at www.HFeLink.com
AS 9120
ISO 9001:2000
CERTIFIED
Advertiser Index
Company........................................................................... Page
Advanced Switch Technology............................................................................61
Aeroflex.............................................................................................center spread
Agilent Technologies..............................................................................................4
Anaren....................................................................................................................47
Applied Computational Sciences......................................................................50
AR Modular RF.......................................................................................................37
Avtech....................................................................................................................61
AWR Corp...............................................................................................................19
Cernex....................................................................................................................54
Coilcraft..................................................................................................................11
C.W. Swift & Associates........................................................................................C2
C.W. Swift/SGMC...................................................................................................21
Delta Electronics...................................................................................................43
Dudley Lab............................................................................................................60
Emerson Network Power......................................................................................25
Emerson Network Power.....................................................................................C4
ES Microwave........................................................................................................16
ET Industries............................................................................................................61
Florida RF Labs.......................................................................................................65
IMS 2012.................................................................................................................73
JFW..........................................................................................................................18
J microTechnology................................................................................................56
J microTechnology................................................................................................56
J microTechnology................................................................................................56
Krytar......................................................................................................................45
Linear Technology.................................................................................................13
Linear Technology.................................................................................................15
LPKF Laser & Electronics.......................................................................................20
Meca Electronics..................................................................................................27
MegaPhase...........................................................................................................72
Micro Lambda Wireless..........................................................................................9
Microwave Components.....................................................................................75
Mini-Circuits..............................................................................................................2
Mini-Circuits..............................................................................................................3
Mini-Circuits............................................................................................................23
Mini-Circuits............................................................................................................31
Mini-Circuits............................................................................................................54
Mini-Circuits............................................................................................................57
Mini-Circuits............................................................................................................70
Mini-Circuits............................................................................................................71
Miteq........................................................................................................................1
Molex.....................................................................................................................C3
Planar Monolithics Industries................................................................................29
Precision Connector.............................................................................................33
Relcomm................................................................................................................51
RF Bay.....................................................................................................................60
RLC Electronics......................................................................................................17
Satellink..................................................................................................................61
Sector Microwave.................................................................................................61
SGMC Microwave.................................................................................................63
SSI Cable Corp......................................................................................................69
SW Tech..................................................................................................................46
ThermOptics...........................................................................................................59
Times Microwave...................................................................................................55
TRU Corp.................................................................................................................35
VidaRF......................................................................................................................7
Wenteq Microwave Corp.....................................................................................61
Wilmanco...............................................................................................................60
The ad index is provided as an additional service by the publisher,
who assumes no responsibility for errors or omissions.
n Find Our Advertisers’ Web Sites
using
HFeLink™
1. G
o to our company information Web site:
www.HFeLink.com, or
2. F rom www.highfrequencyelectronics.com, click on the HFeLink
reminder on the home page
3. C
ompanies in our current issue are listed, or you can choose
one of our recent issues
4. F ind the company you want ... and just click!
5. Or ... view our Online Edition and simply click on any ad!
Publisher
Scott Spencer
Tel: 603-472-8261
Fax: 603-471-0716
[email protected]
Advertising Sales — East
Gary Rhodes
Vice President, Sales
Tel: 631-274-9530
Fax: 631-667-2871
[email protected]
Advertising Sales — west
Tim Burkhard
Associate Publisher
Tel: 707-544-9977
Fax: 707-544-9375
[email protected]
Advertising Sales — central
Keith Neighbour
Tel: 773-275-4020
Fax: 773-275-3438
[email protected]
Product Showcase
Joanne Frangides
Tel: 201-666-6698
Fax: 201-666-6698
[email protected]
U.K and Europe
Sam Baird
Tel: +44 1883 715 697
Fax: +44 1883 715 697
[email protected]
U.K and Europe
Zena Coupé
Tel: +44 1923 852 537
Fax: +44 1923 852 261
[email protected]
High Frequency Electronics (USPS 024-316) is published monthly by Summit Technical Media, LLC, 3 Hawk Dr., Bedford, NH 03110.
Vol. 11 No. 4 April 2012. Periodicals Postage Paid at Manchester, NH and at additional mailing offices.
POSTMASTER: Send address corrections to High Frequency Electronics, PO Box 10621, Bedford, NH 03110-0621.
Subscriptions are free to qualified technical and management personnel involved in the design, manufacture and distribution of electronic equipment and systems at high frequencies. Copyright © 2012, Summit Technical Media, LLC
76 High Frequency Electronics
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