OLED-on-CMOS

Technology Trend and Application of
OLED-on-CMOS (OLEDoS)
Center for Organic Materials and Electronic Devices Dresden (COMEDD)
Fraunhofer Institute for Photonic Microsystems (IPMS), Dresden, D-01109, Germany
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
2
complexity
Mobile Display Dilemma  micro-displays (<1.3”)
 Mobile display driving forces:
 Multimedia content
 information navigation
by user interaction
(touch screen,...)
 augmented-reality (AR)
Mobile
Flexible
Display
Mobile
Projection
Display
i
Full color
PM-Display
Microdisplay
Monochrome
PM-Display
See-through
Microdisplay
Full color
AM-Display
Multicolor
PM-Display
time
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
AR
Microdisplays: Definition, Application (general)
 Definition
 Physically very small, but
 High information content (TV quality)
 Active matrix substrate (often CMOS)
 Low power consumption
 Enlarged image viewed through magnifying
optics
 Applications
 Projection
 Rear projection
 Front projection
 Micro projection
 Near-to-Eye (NTE)
 Electronic Viewfinder (EVF)
 Hand-held
 Head Mounted Display (HMD)
 Professional
 Consumer
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
3
4
OLED-on-CMOS
(OLED-on-Silicon/OLEDoS)
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
5
Introduction OLED-on-CMOS

Key features

transparent conductor
highly-efficient OLED light source in/on CMOS
organic layers
 extremely thin (~100nm)
metal cathode
substrate
 small-molecules/vapor phase (SM-OLED)
top-emitting
 polymers/ liquid phase (P-LED)
 arbitrary shapes
_
Light emission
 all colors monochrome, white, NIR
 excellent current/power efficiency (low-voltage,
low-power)
 good/improving lifetime (several 10kh)
intransparent substrate
(Silicon CMOS wafer)
 self-emissive
 fast response time (MHz)

electronics feature integration
 driving, acqusition, processing, control

sensor co-integration
 CMOS-compatible sensors
 embedded photodetectors
 temperature
 magnetic (Hall)
 M(O)EMS,...
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
CMOS cross-section with OLED on top
+
6
Introduction OLED-on-CMOS
 Top-emitting p-i-n OLED
 based on small molecules
(NOVALED AG)
 evaporated on Si-wafer
 intransparent bottom
electrode (Si-CMOS
substrate)
 transparent top electrode
 high transparency
 low sheet resistivity
 Ag, Al or Yb
5
2
 avoid CMOS HV
devices
Current density [mA/cm²]
 reduce operating voltage
orange emitter
red emitter
white emitter system
1
10
0
10
-1
10
3
10
-2
10
-3
10
2
10
-4
10
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
red
Voltage [V]
Current lifetime
efficiency
@100 @1000cd
@1000c
[Cd/A]
cd/m²
/m²
d/m²
@100cd/m²
2.4
3.1
14.1
ora
2.5
3.2
11.6
white
3.2
4.7
5.7
-5
10
1
10
-6
10
-5
 lower power dissipation at
equivalent radiance
4
10
Luminance [cd/m²]
 Doped charge transport layers
 yield better OLED
performance
10
10
-4
-3
-2
-1
0
1
Voltage [V]
2
3
4
5
12.000
OLED-on-CMOS: Device Manufacturing/SM-OLED

 CMOS
 (so far) 1.0, 0.6, 0.35, 0.18μm
processes
 integrated, mixed-signal circuit design
by IPMS/COMEDD
 wafers contract-manufactured at
silicon foundry providers (e.g., X-FAB)
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
OLED post-processing
 SUNICEL plus200 by Sunic System, Ltd.
(Korea)
 Silicon and quartz wafer: Ø150 mm/6“,
Ø200 mm/8“, thickness: 0.6 to 0.8 mm
 Configuration
 7 process chambers
 12 organic sources
 5 inorganic sources
 2 PVD sources
 Ar/O2 plasma activitation
 Cycle time: ~ 60 min
 Pilot capacity: ~ 6000 wafers/a
7
OLED-on-CMOS: Device Manufacturing/P-LED
 PLED R&D and production line
 Si-wafer Ø200 mm
 Etching / Sputtering Clustex 200 | Leybold
Optics
 Spin coating EVG120 | EVG
 Nitrogen oven MB-OV | MBraun
 Etching, deposition by thermal evaporation
and
 Barix™ thinfilm encapsulation
 Helisys | ANS Korea
 Full-automated wafer bonding system
Hercules | EVG
 Wafer prober Pegasus PA200 | Wentworth
 Microscopes Eclipse L200 | Nikon
 Ellipsometer M-2000U | J. A. Woollam
 Particle scanner Surfscan 7700 | KLA Tencor
 former microdisplay production line of
MicroEmissive Displays Germany GmbH
(MED)
 installed by MED at IPMS premises in
E/2006..B/2007
 original product: MED eyescreen
ME3204 (QVGA, RGB)
 acquired by IPMS E/2009
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
8
9
OLED-on-CMOS: Applications
 microdisplays
 microdisplay
 HMD, mobile/micro-projection, HUD,
electronic viewfinder (EVF),...
 bi-directional microdisplay (display +
embedded camera)
 interactive HMD, optical inspection,...
 sensors
 optical sensors
 fluorescence, color, flowmetry,
photoplethysmography,...
 embedded illumination for image sensors
 patterned illumination possible
 optical finger-print, lab-on-chip,...
 light barriers (reflective)
 opto-coupler
 autostereoscopic 3D displays
 mobile devices (single user, single/multi
view)
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
object
surface
micro-optics
encapsulation
CMOS substrate (wafer)
OLED CMOS detector
CMOS circuit
organic-opto-micro-system
10
OLED micro-displays
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
11
OLED microdisplay: „HYPOLED“

colour VGA (640x480) OLED micro-display for HMD and
micro-projection

24 bit parallel video interface

color options
 monochrome (8 bit)
 full colour (24 bit)

digital pixel cell

luminance control by pulse width (PWM)

color, contrast and gamma correction control via I²C

0.18μm CMOS foundry process

core supply 1.8V

digital 1.8V I/O interfaces

negative OLED cathode voltage (max. -5.5V)

active area 7.68x5.76mm²

chip size 12x11mm²

High brightness
5.8mm
 up to 10,000 nits for monochrome green
(micro-projection)
 1,000 nits for RGB colour (HMD)

I²C interface (configuration)

50/60Hz frame rate
7.7mm
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
„HYPOLED“: System integration
 Demonstrator
 Full-color VGA
microdisplay
 MediaBox (DVB-T, DVBH, WLAN)
Full-color VGA microdisplay
MediaBox
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
12
13
„HYPOLED“: System integration
 head-mounted display (HMD)
ED
OL
 micro-projection optics (MPU)
 MediaBox (DVB-T, DVB-H, WLAN)
MPU (3-panel)
MediaBox
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
i
rod
mic
a
spl
y
14
OLED-on-CMOS: photodetector integration
 embedded photodetectors
 CMOS photodiodes
 lower level than OLED
 side-by-side with active
electronics devices
 emission and detection can
be operated in parallel or
sequentially
 possibly shaping of OLED emission
characteristics (angular, spectral
width)
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
micro-optics
encapsulation
CMOS substrate
(wafer)
OLED CMOS detector
CMOS circuit
15
Bi-directional OLED micro-display

OLED-Microdisplay
 320 x 240 (QVGA)

Embedded image sensor
 160x120 (QQVGA)
inverted camera image
image sensor mode
Embedded Computersystem
OLED micro-display mode
feedback-mode demonstrator
system setup
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
Bi-directional OLED microdisplay
 Feedback-mode demonstrator
 no imaging optics so far
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
16
18
Bi-directional OLED micro-display: HMD application
 Head-mounted display (HMD) application: aimed at
tracking the eye movement with respect to
 user's sight (consciously and unconsciously)
 user's (situation) awareness (unconsciously)
interaction object
 gaze-based human-display-interaction
 visual Input-/Output-Device (I/O) for personal
information management (PIM)
virtual street map
 interactive augmented-reality (AR) applications
virtual image
www.lumusvision.com
real view
virtual
zoomin
button
virtual
zoomout
button
HMD carrier
Radio
53 km/h
Menü
-1°
Navi
mobile host
platform
bi-directional
OLED
microdisplay
60
30
Display off
see-through optics
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
iSTAR: Bi-directional OLED micro-display

“Interactive see-through augmented-reality
displays” (iSTAR)
 Fraunhofer-internal collaborative
project (WISA)

Display: VGA 640x480, full-color

embedded camera
 128x96 pixel

frame camera
 1280x80 pixel
ST-Prism and IR sources (eye scene illumination)
See-through view, display „on“
Near-to-eye projection optics attached to commercial sports
goggles
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
i
AR
19
20
Markets
SMS by " BOSS" :
 Consumer
 head-mounted
Displays für
Smartphones,
mobile TV (3D)
 electronic view
finder (EVF)
 Industrial
 HMD
 Optical Inspection
 Medizin
 HMD, lab-on-chip,
functional
microscopy
 Automotive
 HMD, optocoupler
 MIL
 ST-HMD
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
(Wed, 05/02/14, 18:21)
Hi Paul,
how about our meeting
today?
Have you missed it? Please
call back immediately!
Rgds, BOSS.
CALL DEL ESC
SPL: 60dB
f: 1kHz
F: 23mN
HR: 93
BP : 40/105
CT: 14:21
OT: 5:35
Thermocouples
Part No. 467-854
M ore Information
Yes No ?
LAS
SPL
M OB
21
Outlook
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
22
Organics Micro-Patterning
 OLED Microdisplay Fabrication by Orthogonal
Photolithography (OLITH)
 Aims
 full-color OLED micro-displays w/o
color-filter (CF)
 high-resolution (<5 μm)
 high yield (>90%)
 fast, parallel processing
 scaleable onto 8“ wafers and beyond
 Advantages
 high OLED efficiency (10x)
 better stability (via color-specific
stack design)
 widened color gamut
 no color diffusion
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
Octadecene
solution
Water solution
Fluorous solution
23
Outlook









color-by-color OLED microdisplays
 color gamut 
 current/power efficiency , power consumption 
Enhanced hardware/circuitry integration
 additional, non-optical CMOS sensorics (e.g. magnetic)
 additional system features
 e.g., embedded eye-tracking
high-luminance OLED microdisplays (>1000cd/m²)
 ST-HMD outdoor
 micro-projection (ultra-flat optical module)
micro-signs
 no active CMOS  small die size  cost-effective
 passive, i.e., external drive/control
 very fine patterning of emission areas
 e.g., signs, 7-segment displays,...
micro-optics integration (in cover glass)
 beam steering, shaping
high-temperature OLED-on-CMOS (lifetime)
 ..+85..105..125°C
NIR-OLED integration
 750..900nm
3D+
 high-res, high-speed emissive image source
new applications
 sensors
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
~60 mm
2 μm
4 μm
1.3 mm
Tool extension to combine SM-OLED & P-LED
 Extension of 8“ P-LED tool by SM-OLED
 add 2 organic evaporation
chambers
 liquid and vapor phase
processes in single cluster
tool
 hybrid OLED (smallmolecules + polymers)
 eBeam, sputter chamber and
etcher allow new processes
for SM-OLED
 attractive for 8“ wafer
customers due to unique
large variety of processes
 etcher, eBeam, VitexTFE, metal evaporation,
sputter, organics
evaporation
 FAT Q1..2/’13
 further extension feasible
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
24
COMEDD: Business Unit OLED Microdisplay & Sensors
R&D and pilot-fabrication of OLED
Microdisplays & Sensors
design, process development/integration, system
integration
 OLED micro-displays (QVGA..XGA), bidirectional (display and imager in single
device, QVGA..SVGA)
 backplane CMOS IC design (in silicon foundry
process, 0.11..0.6μm)
 proprietary OLED module @ silicon foundry
 OLED processing (SM-OLED & P-LED)
 system design (e.g., multimedia controller)
 applications (e.g., head-mounted display)
pilot fabrication lines
 pilot line OLED-on-CMOS (8” Si wafer)
 pilot line PLED-on-CMOS (ex MicroEmissive
Displays production line, 8” Si wafer)
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]
- Confidential -
25
26
Contact




Dr. Uwe Vogel
Business Unit Manager OLED Microdisplays and Sensors
Center for Organic Materials & Electronic Devices Dresden (COMEDD)
Fraunhofer Institut für Photonische Mikrosysteme (IPMS)
See you!
 Maria-Reiche-Strasse 2
 D-01109 Dresden
 phone:+49-351-8823-282
 email: [email protected]
http://www.eetimes.com/electronics-news/4213523/Photo-gallery-Eye-on-innovations-at-ISSCC

Thanks to collaborative partners: X-FAB Semiconductor Foundries; Novaled, Fraunhofer IOF, IOSB, IGD; TU Dresden

Work was in parts sponsored by
 European Commission within the HYPOLED project (High-Performance OLED-Microdisplays for Mobile Multimedia HMD and
Projection Applications, ICT-2007.3.2-217067)
 Federal Ministry for Education and Research of the German government (Bundesministerium für Bildung und Forschung),
BMBF 01 BK 916-919, 16SV2283/"ZOOM", 16SV3682/"ISEMO"
 Sächsische Aufbaubank (SAB) of the State of Saxony (11107/1733)
 Fraunhofer Internal Programs “iSTAR”, Grant No. WISA 817 805 (Industry-focused strategic alliance)
© Fraunhofer IPMS
Dr. Uwe Vogel
[email protected]