led tv service manual - LG Parts and Accessories

Transcription

led tv service manual - LG Parts and Accessories
Internal Use Only
North/Latin America
http://aic.lgservice.com
Europe/Africahttp://eic.lgservice.com
Asia/Oceaniahttp://biz.lgservice.com
LED TV
SERVICE MANUAL
CHASSIS : LA57H
MODEL : 32LF5600
32LF5600-UB
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
P/NO : MFL68646501(1502-REV00)
Printed in Korea
CONTENTS
CONTENTS ............................................................................................... 2
PRODUCT SAFETY .................................................................................. 3
SPECIFICATION........................................................................................ 4
ADJUSTMENT INSTRUCTION............................................................... 10
TROUBLE SHOOTING............................................................................. 16
BLOCK DIAGRAM................................................................................... 22
EXPLODED VIEW ................................................................................... 23
SCHEMATIC CIRCUIT DIAGRAM .............................................APPENDIX
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
-2-
LGE Internal Use Only
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
-3-
LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as “anti-static” can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
-4-
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
-5-
LGE Internal Use Only
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This spec sheet is applied LED TV with LA57H chassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Market
Input voltage
Frequency
USA
100~240V
50/60Hz
Remark
Standard Voltage of each
product is marked by
models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM
5) The receiver must be operated for about 20 minutes prior to
the adjustment
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
Safety : UL, CSA, IEC specification
EMC: FCC, ICES, IEC specification
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
-6-
LGE Internal Use Only
4. General Specification
No
Item
Specification
Result
Remark
1.
Receiving System
ATSC / NTSC-M / 64 & 256 QAM
2.
Available Channel
1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
3.
Input Voltage
AC 100 ~ 240V 50/60Hz
4.
Market
NORTH AMERICA
5.
Screen Size
32/42/43/49/55 inch Wide
(1920 × 1080)
FHD / 60Hz
32LF5600-Ux
42LF5500-Ux
42LF5600-Ux
43LF5400-Ux
49LF5500-Ux
49LF5400-Ux
55LF5500-Ux
32 inch Wide (1366 × 768)
HD / 60Hz
32LF560B-Ux
6.
Aspect Ratio
16:9
7.
Tuning System
FS
8.
Module
Direct
Mark : 110V, 60Hz (N.America)
LC320DXE-MGA3
LGD
HD / 60Hz
32LF560B-Ux
HC320DXN-ABHS3
BOE
HD / 60Hz
32LF560B-Ux
LC320DUE-MGA3
LGD
FHD / 60Hz
32LF5600-Ux
NC320DUN-VBBP3
BOE
FHD / 60Hz
32LF5600-Ux
LC420DUE-MGA3
LGD
FHD / 60Hz
42LF5600-Ux
NC420DUN-VUBP5
AUO
FHD / 60Hz
42LF5600-Ux
LC420DUE-MGA6
LGD
FHD / 60Hz
42LF5500-Ux
NC420DUN-VUBP8
AUO
FHD / 60Hz
42LF5500-Ux
LC490DUE-MGA6
LGD
FHD / 60Hz
49LF5500-Ux
LC550DUE-MGA6
LGD
FHD / 60Hz
55LF5500-Ux
NC430EUN-AACR1
LGD
FHD / 60Hz
43LF5400-Ux
NC490EUN-AACR1
LGD
FHD / 60Hz
49LF5400-Ux
9.
Operating Environment
1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10.
Storage Environment
1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
-7-
LGE Internal Use Only
5. Supported video resolutions
5.1. Component input(Y, CB/PB, CR/PR)
No
Resolution
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
Proposed
1
720*480
15.73
59.94
13.50
SDTV ,DVD 480I
2
720*480
15.73
60.00
13.5135
SDTV ,DVD 480I
3
720*480
31.47
59.94
27.00
SDTV 480P
4
720*480
31.50
60.00
27.027
SDTV 480P
5
1280*720
44.96
59.94
74.176
HDTV 720P
6
1280*720
45.00
60.00
74.25
HDTV 720P
7
1920*1080
33.72
59.94
74.176
HDTV 1080I
8
1920*1080
33.75
60.00
74.25
HDTV 1080I
9
1920*1080
26.97
23.976
74.176
HDTV 1080P
10
1920*1080
27.00
24.00
74.25
HDTV 1080P
11
1920*1080
33.71
29.97
74.176
HDTV 1080P
12
1920*1080
33.75
30.00
74.25
HDTV 1080P
13
1920*1080
67.432
59.94
148.352
HDTV 1080P
14
1920*1080
67.50
60.00
148.50
HDTV 1080P
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
-8-
LGE Internal Use Only
5.2. HDMI Input (DTV / PC)
No.
Resolution
H-freq(kHz)
V-freq.(kHz)
Pixel clock(MHz)
Proposed
Remarks
DTV
1
640*480
31.46
59.94
25.125
SDTV 480P
2
640*480
31.5
60.00
25.125
SDTV 480P
3
720*480
15.73
59.94
13.500
SDTV 480I
Spec-Out.
(Just Display)
4
720*480
15.75
60.00
13.514
SDTV 480I
Spec-Out.
(Just Display)
5
720*480
31.47
59.94
27.00
SDTV 480P
6
720*480
31.5
60.00
27.027
SDTV 480P
7
1280*720
44.96
59.94
74.176
HDTV 720P
8
1280*720
45
60.00
74.25
HDTV 720P
9
1920*1080
33.72
59.94
74.176
HDTV 1080I
10
1920*1080
33.75
60.00
74.25
HDTV 1080I
11
1920*1080
26.97
23.97
74.176
HDTV 1080P
12
1920*1080
27.00
24.00
74.25
HDTV 1080P
13
1920*1080
33.71
29.97
74.176
HDTV 1080P
14
1920*1080
33.75
30.00
74.25
HDTV 1080P
15
1920*1080
67.43
59.94
148.352
HDTV 1080P
16
1920*1080
67.5
60.00
148.50
HDTV 1080P
1
640*350 @70Hz
31.46
70.09
25.17
EGA
X
2
720*400 @70Hz
31.46
70.08
28.32
DOS
O
3
640*480 @60Hz
31.46
59.94
25.17
VESA(VGA)
O
4
800*600 @60Hz
37.87
60.31
40.00
VESA(SVGA)
O
5
1024*768 @60Hz
48.36
60.00
65.00
VESA(XGA)
O
6
1152*864 @60Hz
54.34
60.05
80.002
VESA
O
7
1280*1024 @60Hz
63.98
60.02
108.0
VESA (SXGA)
O
8
1360*768 @60Hz
47.71
60.01
85.50
VESA (WXGA)
O
9
1920*1080 @60Hz
67.5
60.00
148.5
WUXGA(CEA 861D)
O
PC
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
-9-
FHD only
FHD only
LGE Internal Use Only
ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to LA57H Chassis applied LED TV all
models manufactured in TV factory
4. MAIN PCBA Adjustments
* Download
(1) E xecute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message. If display “Error”, Check connect computer, jig, and
set.
(3) C lick “Connect” tab. If display “Can’t ”, Check connect
computer, jig, and set.
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15 ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
(4) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
(5) Click “Auto” tab and set as below
(6) Click “Run”.
(7) After downloading, check “OK” message.
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p
(2) EDID download: HDMI and RGB-PC
■ A
bove adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and
final assembly tages can be checked by using the INSTART
Menu(1.ADJUST CHECK)
Component 1080p and RGB-PC Adjust will be calculated by
480i adjust value.
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
4.1. ADC Calibration
4.1.1. Overview
▪ ADC adjustment is needed to find the optimum black level and
gain in Analog-to-Digital device and to compensate RGB
deviation
▪ ADC adjustment is OTP (Auto ADC)
3.3. Appendix
(1) Shipment conditions
(2) Tool option menu
(3) USB Download (S/W Update, Option and Service only)
(4) Preset CH Information
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 10 -
LGE Internal Use Only
4.2. EDID Download
▪ 2D / 8bit / FHD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
4.2.1. Overview
▪ I t is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust by using remote controller
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
4.2.3. Download method (using DFT)
※ PC(for communication through RS-232C), UART baud rate:
115200 bps
Command : aa 00 00 (Start Factory mode)
Command : ae 00 10 (Download All EDID)
Command : aa 00 90 (End of Factory mode)
4.2.4. Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
■ L15_M1L EDID - AC3
▪ 2D / 8bit / HD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
※ Caution) When EDID Download, must remove RGB/HDMI
Cable.
6) EDID Write confirmation
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
4.2.5. Models for EDID Data
2D
North America
(PCM)
HD / 8bit
HDMI 2ea
FHD / 8bit
HDMI 2ea
32LF560B-Ux
32LF550B-Ux
32/42LF5600-Ux
42/49/55LF5500-Ux
43/49LF5400-Ux
▪ 2D / 8bit / FHD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
4.2.6. EDID DATA
■ L15_M1L EDID - PCM
▪ 2D / 8bit / HD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
4.2.7. Tool Option Input
▪ Input Model Tool Option according to BOM
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 11 -
LGE Internal Use Only
5. Final Assembly Adjustment
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
5.1. White Balance Adjustment
RS-232C COMMAND
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- A fter Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
DATA
ID
Wb
00
00
Begin White Balance adj.
Wb
00
ff
End White Balance adj.
(internal pattern disappears )
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.
wb 00 ff ->End white balance auto adj.
(2) Adjustment Map
Adj.
item
Cool
5.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) A dj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) V ideo Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
→ Only when internal pattern is not available
※ Color Analyzer Matrix should be calibrated using CS-1000
5.1.3. Equipment connection
Explanation
CMD
Command
(lower case ASCII)
Data Range
(Hex.)
CMD1
CMD2
MIN
MAX
R Gain
j
g
00
C0
172
G Gain
j
h
00
C0
172
B Gain
j
i
00
C0
192
R Cut
128
G Cut
128
B Cut
Medium
Warm
Default
(Decimal)
128
R Gain
j
a
00
C0
192
G Gain
j
b
00
C0
192
B Gain
j
c
00
C0
192
R Cut
128
G Cut
128
B Cut
128
R Gain
j
d
00
C0
192
G Gain
j
e
00
C0
192
B Gain
j
f
00
C0
172
R Cut
128
G Cut
128
B Cut
128
▪ When you connect the RS232 to set Phone jack, please use
3pin phone jack cable.
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 12 -
LGE Internal Use Only
5.1.5. Adjustment method
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.1.6. Reference (White Balance Adj. coordinate and
color temperature)
5.1.5.2. Manual adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key → EZ adjust using adj. R/C → 6. WhiteBalance then press the cursor to the right (KEY►).
( When KEY(►) is pressed 204 Gray(80IRE) internal
pattern will be displayed)
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
※ CASE
First adjust the coordinate far away from the target value(x,
y).B
(1) x, y >target
i) Decrease the R, G.
(2) x, y< target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) F
irst decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
** (normal line) LGD Cell (LF56xx, LF55xx,LF54xx)
▪ S tandard color coordinate and temperature using
CA-210(CH-14) – by aging time
L15
※ CASE : Medium / Warm mode
First adjust the coordinate far away from the target value(x, y).
(1) x, y >target
i) Decrease the R, G.
(2) x, y< target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
- 13 -
Aging time
(Min)
Cool
Medium
Warm
X
Y
X
Y
X
Y
271
270
286
289
313
329
1
0-2
281
285
296
304
323
344
2
3-5
280
284
295
303
322
343
3
6-9
279
282
294
301
321
341
4
10-19
277
279
292
288
319
338
5
20-35
275
275
290
294
317
334
6
36-49
273
273
288
292
315
332
7
50-79
272
272
287
291
314
331
8
80-119
271
270
286
289
313
329
9
Over 120
271
270
286
289
313
329
** ( Aging chamber) LGD Cell (LF56xx, LF55xx,LF54xx)
▪ S tandard color coordinate and temperature using
CA-210(CH-14) – by aging time
L15
► How to adjust
(1) Fix G gain at least 172 :
Adjust R, B Gain ( In Case of Mostly Blue Gain Saturation )
(2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
▪ Luminance: 204 Gray, 80IRE
Aging time
(Min)
Cool
Medium
Warm
X
Y
X
Y
X
Y
271
270
286
289
313
329
1
0-5
280
285
295
304
319
340
2
6-10
276
280
291
299
315
335
3
11-20
272
275
287
294
311
330
4
21-30
269
272
284
291
308
327
5
31-40
267
268
282
287
306
323
6
41-50
266
265
281
284
305
320
7
51-80
265
263
280
282
304
318
8
81-119
264
261
279
280
303
316
9
Over 120
264
260
279
279
303
315
** For INX,AUO,SHARP,CSOT Module.( In the case of , the
color temperature spec of cool mode is 13000K)
L15
cool
med
warm
x
y
x
y
x
y
spec
271
270
286
289
313
329
target
276
277
291
296
318
336
LGE Internal Use Only
6. GND and HI-POT Test
5.2. Option selection per country
5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA
North America due to rating
(2) Applied model: LA57H Chassis applied to CANADA and
MEXICO
6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically.
5.2.2. Country Group selection
(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu
(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX.
Selection is done using +, - KEY
(3) Using DFT(Auto)
※ PC (for communication through RS-232C) -> UART Baud
rate : 115200 bps
Command : ah 00 00 DATA(Area Number(hexadecimal))
ITEM
DATA(Area Number)
AREA
AREA OPTION1
0
USA
1
CANADA
2
MEXICO
6.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
5.2.3. Tool Option inspection
▪ Press Adj. key on the Adj. R/C, then select Tool option.
2,3th
Suffix
4th
Suffix
Module
Tool 1
Tool 2
Tool 3
Tool 4
32LF560B
-Ux
-
M
Sharp
13074
13314
41036
28768
32LF550B
-Ux
CC/US
M
Sharp
13074
17410
53324
24672
WM
M
Sharp
13074
17410
53316
24672
CC/US
F
BOE
21266
17410
53324
24672
WM
F
BOE
21266
17410
53316
24672
CC/US
Y
LGD
785
17410
49228
24672
WM
Y
LGD
785
17410
49220
24672
32LF5600
-Ux
CC/US
Y
LGD
785
1030
45132
28768
WM
Y
LGD
785
1030
45124
28768
32LF5600
-Ux
CC/US
F
BOE
21264
1030
49228
20576
WM
F
BOE
21264
1030
49220
20576
42LF5600
-Ux
CC/US
Y
LGD
1553
1030
49228
28768
WM
Y
LGD
1553
1030
49220
28768
CC/US
D
AUO
9744
1030
49228
24672
WM
D
AUO
9744
1030
49220
24672
CC/US
Y
LGD
1553
5126
49228
28768
WM
Y
LGD
1553
5126
49220
28768
CC/US
D
AUO
9744
5126
49228
24672
Model
42LF5500
-Ux
WM
D
AUO
9744
5126
49220
24672
49LF5500
-Ux
CC/US
Y
LGD
2321
5126
49228
24672
WM
Y
LGD
2321
5126
49220
24672
55LF5500
-Ux
CC/US
Y
LGD
2833
5126
53324
24672
WM
Y
LGD
2833
5126
53316
24672
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
7.2. Specification
No
Item
Min
Typ
Max
Unit
1
Audio practical
max Output,
L/R
(Distortion=10% max
Output)
4.5
6.0
5.0
6.3
6.0
6.9
W
Vrms
(1) Measurement
condition
-E
Q/AVL/Clear
Voice: Off
(2) S
peaker (8Ω
Impedance)
(3) LF55 Series
Remark
2
Audio practical
max Output,
L/R
(Distortion=10% max
Output)
9.0
8.5
10.0
8.9
12.0
9.8
W
Vrms
(1) Measurement
condition
-E
Q/AVL/Clear
Voice: Off
(2) S
peaker (8Ω
Impedance)
(3) LF56 Series
※ Tool option can be reconstructed by Software
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 14 -
LGE Internal Use Only
8. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 15 -
LGE Internal Use Only
TROUBLE SHOOTING
1. Power-up boot check
Check PSU DC Voltage
P401_5,6,7,8 pin : 13.2V
NO
Check 12pin
Power connector
OK
Main B/D 13.2V Line
Short Check
NO
Main B/D 3.3V Line
Short Check
OK
Replace IC201
(DCDC)
NO
Replace X100
NO
Re-download software.
NO
Replace Mstar(IC102)
or Main board
NO
Replace IC402, IC403,
IC404, Q403
NO
Replace Q205
NO
Replace Mstar(IC102) or
Main Board
NO
Check PSU
OK
Replace PSU
OK
Check stand-by Voltage
L202 : +3.3V
OK
Check X100 clock
24 MHz
OK
Check P200 PWR_ON.
1pin : 3.3V
OK
Check IC402/3/4 Output
Voltage
IC202 : 1.15V & 5V
IC200 : 1.8V
Q204 : 3.3V
OK
Check TCON(Module)
Panel_VCC
Q205 : 13.2V
OK
Check
Output
Mstar
LV D S
OK
Check DRV ON Control
P200 11pin : High
OK
Change Module
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 16 -
LGE Internal Use Only
2. Digital / Analog TV Video
Check RF Cable & Signal
OK
Check Tuner 3.3V Power
L500
NO
Replace L500
NO
B a d Tu n e r. R e p l a c e
Tuner.
NO
Replace Mstar(IC102)
or Main Board.
NO
Replace Jack
NO
Replace AR401 or R110
NO
Replace Mstar(IC102)
or Main Board.
OK
Check IF_P/N Signal
TU501 6,7 Pin
OK
Check Mstar LVDS Output
3. AV Video
Check input signal format.
Is it supported?
OK
Check AV Cable for damage
for damage or open
conductor
OK
Check JK401,
CVBS Signal Line
R120
OK
Check CVBS_DET Signal
OK
Check
Output
Mstar
LV D S
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 17 -
LGE Internal Use Only
4. Component Video
Check input signal format.
Is it supported?
OK
Check Component Cable
for damage or open
conductor.
OK
Check JK401
Y/PB/PR signal Line
NO
Replace Jack
NO
Replace AR401or R109
NO
Replace Mstar(IC101) or
Main Board.
OK
Check
Signal
COMP_DET
OK
Check
Output
Mstar
LV D S
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 18 -
LGE Internal Use Only
5. HDMI Video
Check input signal format.
Is it supported?
OK
Check HDMI Cable conductors
for damage or open conductor.
OK
Check EDID
NO
AR102, AR101, AR410, AR411 I2C
Signal
Replace the defective IC or
re-download EDID data
OK
Check JK403, JK404
NO
Replace Jack
NO
Replace R418, R410,
Q400, R419
NO
Check other set
If no problem, check signal line
NO
Replace Mstar(IC101) or
Main Board.
OK
Check HDMI_DET (HPD)
OK
Check HDMI Signal
NO
Replace Main Board
OK
Check
Output
Mstar
LV D S
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 19 -
LGE Internal Use Only
6. All Source Audio
Check the TV Speaker Menu
(Menu -> Audio -> TV Speaker)
OFF
Toggle the Menu
NO
Main B/D 3.3V Line
Short Check
ON
Check AMP IC(IC5600) Power
24V, 3.3V
OK
Check Mstar AUDIO_MASTER_CLK NO
R148
Replace Mstar(IC101)
or Main Board.
OK
Check AMP I2C Line
R140, R141
NO
Check signal line.
Or replace Mstar(IC101)
NO
Check signal line.
Or replace Mstar(IC101)
NO
Replace Audio AMP
IC(IC5600)
NO
Replace connector
if found to be damaged.
OK
Check Mstar I2S Output
IC5600 20,21,22 Pin
OK
Check Output Signal
P5600
1, 2, 3, 4 pin.
OK
Check Connector &
P5600
OK
Check speaker resistance
and connector damage.
NO
Replace speaker.
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 20 -
LGE Internal Use Only
7. Digital / Analog TV Audio
Check RF Cable & Signal
OK
Check Tuner 3.3V Power
L500
NO
Replace L500
NO
Replace AR500, R502,
R503
NO
B a d Tu n e r. R e p l a c e
Tuner.
OK
Check Tuner I2C
AR500, R502, R503
OK
Check IF_P/N Signal
TU501 6/7 Pin
OK
Follow procedure
‘7. All source audio’
trouble shooting guide.
8. AV Audio
Check AV Cable for damage
for damage or open conductor
OK
Check JK401 Signal Line
R409 ,R406
NO
Replace Jack
NO
Replace Jack
OK
Follow procedure
‘7. All source audio’
trouble shooting guide.
9. Component Audio
Check Component Cable
for damage or open conductor.
OK
Check JK401 Signal Line
R409 ,R406
OK
Follow procedure
‘7. All source audio’
trouble shooting guide.
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 21 -
LGE Internal Use Only
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 22 -
((
((
P305
LPF
LPF
S_AMP_24V
IC100
EEPROM
24C512
IC101
Serial Flash
8Mbytes
VDDC_1.15V
Panel_Vcc
13
N_3.3V
46
36
39
IC301
22
21
20
23 24
Sound AMP
TAS5733
1
15
USB_DN
USB_DP
Audio_SCL
2
1
56 132
94
95
32 57 131 144
JK602
HDMI1
134,135,145~152
EEP SCL
EEP SDA
106 105
HDMI2
139,140,1~4,153~156
22,24,26,34,35
IC101
29,34,35
Panel_12V
LGE8220 / M1L
SPI_CLK
SPI_DI
SPI_CZ
SPI_DO
114 113 112 111
RL_on
124 123 110 100 101
PWM
21 33 51 52 87 127
63
64
65
66
Audio_SDA
I2S_MCLK
I2S_WS
I2S_SCK
I2S_SDO
DDR_1.8V
IR
KEY1/2
LED
IC200
AZ1117EH
AVDD_ST_3.5V
3 4
33 34
Q204
DMP2130L
IC202
BD9D321EFJ
IC201
TI (TBD)
2BUCK 1OCP
Q204
DMP2130L
4
INV_on
P200
JK601
62
JK608
SPDIF
116 117
79 ~ 89
P300/301
48
49
50
58
59
53
54
P304
IR
B+ 5
Tx, Rx
Debug
JK607/P601/P602
M_3.3V
TU_3.3V
TDSS-H701F
9 IF_AGC
10
11
TUNER
IF_P
IF_N
TU701
HDMI2
MHL_5V
USB_DN
USB_DP
USB_5V
ST_3.5V
IR Board
3 Tuner SCL
4 Tuner SDA
24Mhz
KEY2
Module
KEY1
3, 4, 7, 8
P_13.2V
Y,Pb,Pr In
67 ~ 78
Comp. R/L In
JK605
AV1 In
LED
Power Board(LPB)
BLOCK DIAGRAM
JK603
LGE Internal Use Only
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Set + Stand
200
A2
A10
121
LV1
530
310
540
900
410
120
521
400
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by
in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 23 -
LGE Internal Use Only
AR103
100
1/16W
Closed to SoC as possible
KEY1
KEY2
LED_RED
+1.15V_VDDC
DDR_DATA
AV_DET
DDC_SCL_1
DDC_SDA_1
COMP_DET
5V_DET_HDMI_2
R111
1K
DP_P1
126
AVDD_MOD_4
SAR0/GPIO75
SAR1/GPIO74
SAR2/GPIO73
127
VDDC_3
R110
1K
AR102
100
1/16W
GPIO54
DDCDD_CL
DDCDD_DA
136
10K
DDCDA_DA
137
R128
10K
RXB0-
RXB0+
RXB1+
RXB1-
RXB2-
RXBCK-
RXB2+
RXBCK+
RXB3-
AVDD_MOD
RXB3+
USB_OCD
USB_CTL
AMP_SDA
AMP_SCL
AR112
1/16W
100
1/16W
AR111
33
79
80
81
82
83
84
85
R_ODD[3]/LVB2-/RLV4-/EPI5R_ODD[2]/LVB2+/RLV4+/EPI5+
R_ODD[1]/LVBCLK-/RLV5-/EPI4R_ODD[0]/LVBCLK+/RLV5+/EPI4+
G_ODD[7]/LVB3-/RLV6-/EPI3G_ODD[6]/LVB3+/RLV6+/EPI3+
G_ODD[5]/LVB4-/LLV0-/EPI2G_ODD[4]/LVB4+/LLV0+/EPI2+
86
AVDD_MOD_3
87
88
89
90
91
92
93
95
GPIO9/TCON9
GPIO10/TCON10
96
97
GPIO8/TCON8
99
98
GPIO7/TCON7
GPIO6/TCON6
100
GPIO5/TCON5
101
GPIO4/TCON4
102
GPIO3/TCON3
103
GPIO2/TCON2
104
GPIO1/TCON1
105
94
LVSYNC/GPIO16/RLV0-/GPIO16
LHSYNC/GPIO17/RLV0+/GPIO17
LDE/GPIO18/RLV1-/GPIO18
LCK/GPIO19/RLV1+/GPIO19
R_ODD[7]/LVB0-/RLV2-/EPI7R_ODD[6]/LVB0+/RLV2+/EPI7+
R_ODD[5]/LVB1-/RLV3(CLK)-/EPI6R_ODD[4]/LVB1+/RLV3(CLK)+/EPI6+
5V_DET_HDMI_1
HPD1
106
GPIO0/TCON0
HOTPLUG_A
HOTPLUG_D
107
108
PWM1/GPIO14
109
PWM0/GPIO15
110
SPI_DI
SPI_DO
111
112
SPI_CZ
113
SPI_CK
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
RXACK+
RXACKRXA2+
RXA2RXA1+
RXA1RXA0+
RXA0-
AUD_LRCH
AUD_SCK
AUD_MASTER_CLK
AUD_LRCK
SPDIF_OUT
VCOM_SDA
VCOM_SCL
TU_SCL
TU_SDA
VDDC_2
56
VDDIO_CMD
55
AVDD_MOD_2
54
XOUT
53
XIN
52
AVDD3P3_DMPLL
51
AVDD3P3_DADC
50
VIFM
R122
0
49
VIFP
R123
0 C124
48
IFAGC
+1.15V_VDDC
DDR_CMD
AVDD_MOD
R127
1M
C143
15pF
C142
15pF
X100
24MHz
AVDD_DMPLL
Closed to SoC
AVDD_DADC
C123
0.1uF
16V
IF_N_MSTAR
IF_P_MSTAR
0.1uF
16V
OPT
C128
100pF
LINEOUTR0
OPT
C134
100pF
45
46
LINEOUTL0
LINEOUTR3
44
LINEOUTL3
43
42
VRM
VAG
41
AUL3
39
40
AUR3
AUL2
38
AUR2
37
AUL1
36
35
AUR1
10V
AUL0
+3.3V_NORMAL
C122
0.1uF
16V
C116
0.1uF
16V
C115
C114
10V
2.2uF
34
AUR0
2.2uF
33
32
AVDD_AU33
VDDC_1
31
25V
CVBS_OUT1
R124
10K
IF_AGC_MAIN
R125
100
PZ1608U121-2R0TF
L100
COMP_L_IN
AVDD_AU33
TP1
+1.15V_VDDC
C117
10uF
6.3V
COMP_R_IN
30
C113
180
COMP_Y+
R121
0.047uF
VCOM
25V
28
29
CVBS0
C112
150
R120
CVBS1
27
VSYNC1
26
C111
R119
33
0.047uF
25V
RIN1P
25
GIN1M
25V
25V
C110
0.047uF
24
23
SOGIN1
GIN1P
50V
0.047uF
1000pF
33
C109
0.047uF
C107
SPI_SDI
Not USe Macronix (EAN63146601)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
C108
8
9
RX0P_A
RX0N_A
7
RXCP_A
RXCN_A
6
5
4
SPI_SCK
DI[IO0]
68
5
CLK
R118
6
4
C106
0.1uF
16V
AR109
3
%HOLD[IO3]
33
7
COMP_Pr+
GND
2
VCC
R113
WP[IO2]
8
COMP_Pb+
DO[IO1]
SPI_SDO
1
AVDD_VIDEO
CS
/SPI_CS
AVDD_MOD
R105
4.7K
/FLASH_WP
114
DDCA_DA
ARC/GPIO87
115
116
DDCA_CK
117
TEST
118
IRIN
CEC
119
120
121
RESET
IC101
W25Q64FVSSIG
OPT
R100
10K
+3.3V_ST
AVDD_MOD_1
SERIAL FLASH(64MB)
RXA3-
Closed to SoC
E-PAD
OPT
C104
8pF
D2+_HDMI2
OPT
C102
8pF
OPT
C141
0.1uF
16V
RXA3+
57
47
COMP_Y+
156
I2C_SDA
22
155
RX0P_B
BIN1P
RX0N_B
D0+_HDMI2
25V
D0-_HDMI2
RX2P_B
I2C_SCL
SDA
3
5
154
AVDD3P3_ADC 21
RXCP_B
20
CK+_HDMI2
RX2N_B
6
4
AR100
33
1/16W
SCL
19
153
VSYNC0
RXCN_B
RIN0P
CK-_HDMI2
D2-_HDMI2
3
R107
2.2K
D1+_HDMI2
7
R106
2.2K
1
GND
2
C105
0.1uF
16V
WP
RX1N_B
A2
VCC
18
152
17
D2+_HDMI1
RX2P_D
GIN0M
151
GIN0P
150
RX2N_D
16
RX1P_D
D2-_HDMI1
15
D1+_HDMI1
BIN0P
149
SOGIN0
RX1N_D
14
148
D1-_HDMI1
13
D0+_HDMI1
RX0P_D
HSYNC0
147
RX2P_A
RX0N_D
12
D0-_HDMI1
11
146
RX2N_A
RXCP_D
RX1P_A
CK+_HDMI1
58
10
CK-_HDMI1
145
RX1N_A
144
RXCN_D
+3.3V_ST
8
62
59
2
SDA
NVRAM_ATMEL
1
63
143
VDDC_4
+1.15V_VDDC
SCL
IC100
AT24C512C-SSHD-T
A1
64
THERMAL
157
GND_EFUSE
WP
65
[M1L]
C136
0.1uF
16V
C135
10uF
6.3V
GPIO46/MHL_VBUS
GPIO45/I2C_SCLM/UART_RX1
GPIO44/I2C_SDAM/UART_TX1
66
AVDD_5V_MHL 142
HDMI2_5V
VCC
EEPROM(512KB)
A0
141
OPT
C125
0.1uF
16V
60
67
RX1P_B
5
140
HOTPLUG_B
C119
0.1uF
16V
GPIO47
68
139
DDCDB_CL
L104
PZ1608U121-2R0TF
61
69
D1-_HDMI2
6
4
DDCDB_DA
AVDD_VIDEO
C144
0.1uF
16V
+1.8V_DDR
SPDIF
70
MHL_DET/GPIO86 138
AVDD_DMPLL
C145
0.1uF
16V
DDR_DATA
R126
100
71
IC102
LGE8220(MSD8220LBM)
L107
PZ1608U121-2R0TF
C138
0.1uF
16V
C137
0.1uF
16V
G_ODD[3]/LVA0-/LLV1-/EPI1G_ODD[2]/LVA0+/LLV1+/EPI1+
G_ODD[1]/LVA1-/LLV2-/EPI0G_ODD[0]/LVA1+/LLV2+/EPI0+
B_ODD[7]/LVA2-/LLV3(CLK)B_ODD[6]/LVA2+/LLV3(CLK)+
B_ODD[5]/LVACLK-/LLV4B_ODD[4]/LVACLK+/LLV4+
B_ODD[3]/LVA3-/LLV5B_ODD[2]/LVA3+/LLV5+
B_ODD[1]/LVA4-/LLV6B_ODD[0]/LVA4+/LLV6+
GPIO53/I2S_OUT_SD
GPIO52/I2S_OUT_BCK
GPIO51/I2S_OUT_MCK
GPIO50/I2S_OUT_WS
GPIO49/SPDIF_OUT
72
135
AVDD_AU33
Closed to Main SoC Each Pin
73
134
C130
0.1uF
16V
C129
0.1uF
16V
C126
1uF
10V
C118
10uF
6.3V
74
133
R108
HPD2
IC100-*1
BR24G512FJ-3
3
L108
PZ1608U121-2R0TF
C146
0.1uF
16V
+1.8V_DDR
L101
PZ1608U121-2R0TF
75
131
DDCDA_CL
1/16W
GND
C140
0.1uF
16V
DDR_CMD
76
130
AVDD_DADC
C147
0.1uF
16V
L106
PZ1608U121-2R0TF
77
129
1K
DDC_SCL_2
7
C127
1uF
10V
C120
10uF
6.3V
78
128
R109
AR101 100
SUB_NVRAM_ROHM
R114
10K
VDDIO_DATA 132
DDC_SDA_2
2
L105
PZ1608U121-2R0TF
+1.15V_VDDC
125
MHL Disable
A2
C121
10uF
6.3V
C132
0.1uF
16V C139
0.1uF
16V
C131
0.1uF
16V
PZ1608U121-2R0TF
L103
AVDD_MOD
AR107
33
1/16W
AR106
33
1/16W
INT/GPIO64/I2S_OUT_MCK
1/16W
100
AR104
DM_P1
122
DM_P0
DP_P0
HD
R101
4.7K
123
124
MODEL_OPT
A1
AMP_MUTE
R117
10K
Closed to SoC as possible
FHD
R102
4.7K
8
AVDD_MOD
Closed to SoC as possible
C103
0.1uF
16V
+3.3V_NORMAL
1
AR110
100
1/16W
4.7K
1/16W AR108
<HW_OPTION>
A0
AMP_RESET
POWER_ON/OFF
MODEL_OPT
INV_CTL
RL_ON
PANEL_CTL
/FLASH_WP
I2C_SDA
I2C_SCL
PWM_DIM
<Chip config.>
SOC_RESET
R104
470K
+3.3V_ST
L102
PZ1608U121-2R0TF
1K
1K
C101
4.7uF
10V
<MAIN SoC Vcc>
+3.3V_ST
0.047uF
OPT
R112
OPT
AR105
4.7K
R115
+3.3V_ST
C100
4.7uF
10V
PWM_DIM2
SPI_SDO
SPI_SCK
/SPI_CS
SPI_SDI
PM_RXD
PM_TXD
+3.3V_ST
IR
POWER_DET_RESET
POWER_DET
OPT
R103
470
SOC_RESET
SIDE_USB_DP
SIDE_USB_DM
<SOC_RESET>
C133
0.047uF
25V
Close to MSTAR
L15_M1L
MAIN
140822
1
5
LGE Internal Use Only
L15 NA POWER BLOCK
PANEL_Vcc
FROM LIPS or POWER B/D
Power_DET
+13.2V --> 3.56V
M13.2V
TR_NXP
+3.3V_ST
TR_KEC
Q201-*1
2N3906S-RTK
C
E
MMBT3906(NXP)
Q201
3
1
OPT
R215
33K
OPT
R201
10K
2
PANEL_VCC
L203
UBW2012-121F
B
OPT
C212
0.1uF
25V
R205
10K
RL_ON
R219
33K
10%
1608
R202
10K
PANEL_VCC
+3.3V_ST
+3.3V_ST
Q205
SSM3J332R
S
D
Panel_Cgs_0.22uF
C213
0.22uF
G
25V
R241
100K
R224
3.3K
OPT
R236
0
R232
14K
1%
OPT
R225
3.3K
Reset_IC_KEC
IC203
VCC
R220
120K
OPT
R207
0
To make high at RL_ON
when AC On
+3.3V_NORMAL
+3.3V_ST
P200
SMAW200-H12S5K(BK)(LTR)
OPT
VR200
ICVS0518150FR_
R206 R209
1K
100
INV_CTL
C
R203
10K
B
TR_NXP
Q200
MMBT3904(NXP)
C
2
PDIM#2
GND
3
4
D13.2V
D13.2V
5
6
D13.2V
A13.2V
A13.2V
7
8
GND
9
10
GND
12
PDIM#1
DRV_ON
11
E
PWM_DIM2
2
OUT
POWER_DET
1
C238
0.1uF
GND
POWER_DET_RESET
RESET_IC_DIODES
IC203-*1
E
APX803E29
VCC
3
2
RESET
1
GND
PWM_DIM
L208
E
TR_KEC
Q200-*1 B
2N3904S
1
TR_KEC
Q202-*1
2N3904S
B
R233
5.6K
1%
C224
0.1uF
16V
C
TR_NXP
Q202
MMBT3904(NXP)
3
OPT
R237
0
R245
300
13
MLB-201209-0120P-N2
OPT
.
R200
10K
C
B
PANEL_CTL
PWR_ON
Panel_Cgs_0.1uF
C213-*1
0.1uF
50V
10%
1608
R246
4.7K
KIC7529M2
L201
MLB-201209-0120P-N2
E
M13.2V
D
S
+3.3V_ST
FET_3.3V_TOSHIBA
Q204
SSM3J332R
C214
4.7uF
10V
+3.3V_NORMAL
L204
PZ1608U121-2R0TF
OPT
ZD202
5V
C218
10uF
6.3V
C215
0.1uF
16V
G
S
R221
12K
AO3435
C241
0.1uF
25V
Q204-*1
SUB_FET_3.3V_AOS
+3.3V_Normal
A13.2V
G
C205
0.1uF
25V
D
C203
10uF
25V
OPT
R216
10K
R222
1.8K
+1.8V_DDR
POWER_ON/OFF
R218
10K
OPT
R217
10K
C
C
TR_NXP
Q203
MMBT3904(NXP)
B
E
TR_KEC
Q203-*1
2N3904S
B
E
+3.3V_NORMAL
+1.8V_DDR
IC200
AZ1117EH-ADJTRG1
IN
C201
10uF
6.3V
OUT
R1
ADJ/GND
R214
0
1%
R212
3.9K
OPT
ZD205
5.1v
ZD200
2.5V
C208
10uF
6.3V
R2
+5V_Normal & +1.15V_VDDC
1%
R213
1.6K
Check ESR!!
Vout=1.25*(1+R2/R1)+I(ADJ)XR2
Vout=0.6(R1/R2)+0.6
+1.15V_VDDC
M13.2V
L206
4.7uH
C223
1uF
10V
1
1/16W
1%
BST1
LX1
FB1
1/16W
1%
VREG
C204
100pF
50V
2
3
7
6
BOOT
SW
AGND
3
ROSC/SYNC
RSET
FB2
SW_EN
5
14
6
13
12
11
10
9
C229
R235 3300pF
20K 50V
BST2
LX2
VIN2
R247
3.3K
+3.3V_NORMAL
R231
0
C228
0.047uF
25V
3A
5
C207
2200pF
50V
GND
C210
22uF
10V
3216
125C
R2
C235
47pF
50V
+5V_NORMAL
L207
4.7uH
USB_OCD
C211
22uF
10V
3216
125C
C236
22uF
16V
3216
85C
C239
22uF
16V
3216
85C
+5V_USB
CST Check!!
16V
22uF
C225
22K
R211
1%
1/16W
C206
1uF
10V
4
R244
39K
1%
R1
+5V_NORMAL
SS
R2
R242
200
1%
R243
5.1K
1%
C230
22pF
50V
COMP2
8
NFAULT
USB_CTL
16V
0.1uF
C209
L202
2uH
16
IC202
4 SN1406035RGER 15
7
R227
4.7K
OPT
R229
91K
OPT
ZD204
5.1v
C240
22uF
6.3V
17
PGND2
FB
VIN
OPT
R250 +3.3V_NORMAL
300K
SW_IN
R1
8
OPT
ZD201
5V
SD05
OPT
C217
4700pF
50V
SW_OUT
R208
68K
1
9
R204
6.2K
EN
THERMAL
R248
33K
[EP]
OPT
R249
300K
R228
10K
IC201
BD9D321EFJ
R210
100K
OPT
C216
4700pF
50V
C232
R240 3300pF
10K 50V
COMP1
18
THERMAL
25
EN1
EN2
OPT
C202
0.1uF
25V
C237
22uF
6.3V
C233
22pF
50V
19
PGND1
VIN1
V7V
SS1
SS2
2
C200
10uF
25V
OPT
C234
10uF
6.3V
OPT
ZD203
2.5V
R239
5.1K
1%
R234
15K
OPT
C222
2200pF
50V
20
R226
10K
21
R223
10K
22
L200
BLM18PG121SN1D
OPT
C221
2200pF
50V
OPT
C231
82pF
50V
R2
23
+3.3V_ST
+3.3V_ST
R238
4.7K
1%
0
R230
24
+3.3V_NORMAL
M13.2V
C220
10uF
25V
[EP]
C219
10uF
25V
+3.3V_STANDBY
R1
25V
0.047uF
C226
L205
CB2012PK501T
C227
1uF
16V
Vout=0.6(R1/R2)+0.6
Vout=0.765*(1+R1/R2)
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
L15_M1L
POWER
141020
2
5
LGE Internal Use Only
AUDIO AMP(TI)/LVDS/IR
IR
+3.3V_ST
[51Pin LVDS Connector]
(For FHD 60Hz)
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
AR303
10K
1/16W
HD
P301
KEY1
10031HR-30
FHD
P300
OPT
C338
0.1uF
16V
VR302
SP14-11592-01-51Pin
OPT
1
P302
P303
12507WR-08L
12507WR-10L
2
1
2
LVDS_SEL
3
VCOM_SDA_M
5
VCOM_SCL_M
6
9
13
14
15
16
17
V_COM
R317
2K
1
1
2
2
3
3
4
4
5
5
6
6
7
7
L307
PZ1608U121-2R0TF
C335
0.1uF
16V
RXA1+
12
RXA2-
13
RXA2+
RXA0-
14
RXA0+
15
RXACK-
RXA1-
16
RXACK+
RXA1+
17
RXA2-
18
RXA3-
RXA2+
19
RXA3+
VCOM_SCL_M
VCOM_SCL
VCOM_SDA_M
VCOM_SDA
C336
1000pF
50V
LED_RED
V_COM
OPT
R323
2K
OPT
R324
2K
OPT
VR300
+3.3V_ST
OPT
R322
3.3K
8
IR
8
9
C339
100pF
50V
LVDS_SEL
18
9
OPT
VR303
10
+3.3V_NORMAL
11
20
19
20
RXACK-
21
RXACK+
22
OPT
R307
3.3K
PANEL_VCC
21
OPT
R306
10K
23
22
23
RXA3-
24
RXA3+
25
24
HD
L302
120OHM
UBW2012-121F
26
25
33
+3.3V_ST
AR302
0
11
12
32
RXA1-
10
11
31
OPT
C337
0.1uF
16V
OPT
VR301
V_COM
R316
2K
RXA0+
9
10
30
KEY2
+3.3V_NORMAL
8
OPT
R301
10K
8
29
V-COM I2C or GPIO(Tuner)
RXA0-
7
OPT
R302
3.3K
7
28
VCOM_SDA_M
+3.3V_NORMAL
6
27
VCOM_SCL_M
4
5
4
26
3
27
R300
0
R320
0
FHD_GND_26
28
FHD_GND_27
RXB0-
HD
C306
0.1uF
25V
HD_VCC_Cap
C303
10uF
25V
29
30
RXB0+
31
RXB1RXB1+
RXB2RXB2+
34
35
36
RXBCKRXBCK+
37
38
39
RXB3RXB3+
40
AUDIO AMP(TI)
41
FHD_GND_42_43
AR300
0
+13.2V_AMP
A13.2V
This parts are Located
on AVSS area.
R303
0
PANEL_VCC
L301
44
1/16W
120OHM
FHD
L300
UBW2012-121F
C307
0.1uF
50V
47
L304
SPK_L+
C311
4700pF
14
MCLK
15
OSC_RES
16
DVSSO
17
VR_DIG
18
PDN
PVDD_AB_2
PVDD_AB_1
BST_A
NC_1
SSTIMER
NC_2
PBTL
OUT_A
1
2
3
4
5
6
7
10.0uH
NRS6045T100MMGK
C332
0.1uF
50V
C333
0.1uF
50V
[EP]
48
PGND_AB_2
47
PGND_AB_1
46
OUT_B
45
NC_6
44
NC_5
43
BST_B
42
BST_C
R313
18
SPK_L-
10.0uH
NRS6045T100MMGK
SPK_L+
NC_4
NC_3
SDIN
22
39
OUT_C
SDA
23
38
PGND_CD_2
SCL
24
37
PGND_CD_1
C325
0.033uF
50V
36
SPK_R-
OUT_D
PVDD_CD_1
PVDD_CD_2
BST_D
GVDD_OUT
GND
VREG
AGND
DVSS
DVDD
STEST
RESET
AR301
4.7K
1/16W
+3.3V_NORMAL
C308
0.1uF
16V
C316
0.1uF
16V
C323
10uF
25V
C334
0.1uF
50V
C328
330pF
50V
C331
0.33uF
50V
C329
330pF
50V
AMP_SCL
R315
18
2
SPK_R+
1/16W
1%
AUD_SCK
+13.2V_AMP
3
SPK_R+
L303
10.0uH
NRS6045T100MMGK
R314
18
C321
0.1uF
50V
4
SPK_L-
40
AMP_RESET
P304
250A1-WR-H04M
1/16W
1%
C324
0.033uF
50V
41
AMP_SDA
OPT
C342
2200pF
50V
L306
21
AUD_LRCH
OPT
C341
2200pF
50V
SPEAKER_L
C330
0.33uF
50V
C327
330pF
50V
20
AUD_LRCK
1/16W
1%
C326
330pF
50V
C322
10uF
25V
SCLK
25
+3.3V_NORMAL
C320
0.1uF
50V
LRCLK
35
C309
0.1uF
16V
34
POWER_DET
OPT
C302
1000pF
50V
TAS5733
33
OPT
R304
0
19
32
AMP_MUTE
IC300
31
18K 1%
49
13
30
AUD_MASTER_CLK
Need to Check.
AVDD
A_SEL_FAULT
THERMAL
R309
2.2K
R308
12
C305
0.1uF
16V
8
VR_ANA
470
52
R305
4.7K
R312
18
C315
2200pF
50V
R310
29
0.047uF
PLL_FLTP
PLL_FLTM
C310
+3.3V_NORMAL
+3.3V_NORMAL
51
+13.2V_AMP
AVSS
FHD
C301
0.1uF
25V
9
FHD_VCC_Cap
C300
10uF
25V
C318
0.033uF
50V
C314
0.047uF
28
50
Close to Speaker
C313
4700pF
Separate DGND AND AVSS
48
49
R311
470
OPT
11
46
10
45
27
43
26
42
C340
0.1uF
50V
OPT
C343
2200pF
50V
OPT
C344
2200pF
50V
1
SPK Wafer Box Type
SPEAKER_R
1/16W
1%
L305
SPK_R-
OPT
ZD300
5V
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
C317
1uF
16V
C319
0.033uF
50V
10.0uH
NRS6045T100MMGK
C312
0.1uF
16V
L15_M1L
LVDS/S_AMP/IR
140828
3
5
LGE Internal Use Only
EXTERNAL INTERFACE
HDMI_1(REAR)
OPT
R414
AV/COMPONENT
10K
C
R410
1K
JK401
PPJ245N2-01
TR_NXP
Q400
MMBT3904(NXP)
JK404
6E
[RD2]E-LUG
E
OPT
VR408
GND
R409
10K
SHIELD
R418
10K
HPD1
+5V_NORMAL
C
TR_KEC
B Q400-*1
2N3904S
5V_DET_HDMI_1
R413
2.7K
20
COMP_R_IN
B
AR410
4.7K
1/16W
E
DDC_SDA_1
HP_DET
5E
VR403
OPT
[RD2]O-SPRING
19
OPT
C402
1000pF
50V
R402
470K
5V
R408
12K
18
R416
4.7K
VR409
OPT
OPT
VR404
DDC_SCL_1
GND
OPT
VR410
17
DDC_DATA
OPT
VR412
16
DDC_CLK
4E
15
[RD2]CONTACT
NC
R406
10K
14
CE_REMOTE
COMP_L_IN
4C
[WH]O-SPRING
OPT
C401
1000pF
50V
EAG59023302
5D
R401
470K
VR401
OPT
13
+3.3V_NORMAL
R407
12K
AR401
10K
1/16W
CK-
9
8
7
OPT
VR402
6
5
5C
[RD1]O-SPRING
4
COMP_Pr+
5B
[RD1]E-LUG-S
ZD405
3
2
ZD404
7C
OPT
VA402
ICVS0518150FR_
L401
DLP11SA900HL2L
CK_GND
11
10
COMP_DET
[RD1]CONTACT
AR406
5.1
1/16W
AR407
5.1
1/16W
12
R405
75 1%
comp-shape=1005
1
4
3
1
2
CK-_HDMI1
CK+
CK+_HDMI1
D0L402
DLP11SA900HL2L
D0_GND
D0+
4
3
1
2
D0-_HDMI1
D0+_HDMI1
D1D1_GND
L403
DLP11SA900HL2L
4
3
1
2
AR408
5.1
1/16W
AR409
5.1
1/16W
D1-_HDMI1
D1+
D1+_HDMI1
D2L404
DLP11SA900HL2L
D2_GND
D2+
4
3
1
2
D2-_HDMI1
D2+_HDMI1
HDMI_EMI_Filter
[BL]O-SPRING
COMP_Pb+
ZD402
4A
[GN/YL]CONTACT
5A
[GN/YL]O-SPRING
OPT
VA401
ZD403
ICVS0518150FR_
R404
75 1%
comp-shape=1005
HDMI_2(SIDE)
AV_DET
OPT
VR400
6A
Check!!
HPD2 Pull-Up
[GN/YL]E-LUG
GND
JK403
COMP_Y+
BODY_SHIELD
R420
10
ZD401
UART For DEBUG
OPT
VA400
ICVS0518150FR_
R403
75
1%
comp-shape=3216
USB(SIDE)
+3.3V_ST
EAG62611204
ZD400
JK400
+5V_USB
OPT
1/16W
5%
IC400
P401
MAX3232CDR
M6
3AU04S-305-ZC-(LG)
C400
0.1uF
16
1
15
2
14
3
M3_DETECT
GND
4
M4
5
M5_GND
AR400
100
1/16W
DOUT1
13
4
12
5
C1-
C406
0.1uF
C405
0.1uF
22uF
16V
3216
22uF
10V
2012
22uF
10V
2012
ROUT1
DIN1
DIN2
ROUT2
P400
11
6
10
7
9
8
12507WS-04L
EAN41348201
18
5V
17
GND
16
DDC_DATA
15
DDC_CLK
14
NC
CE_REMOTE
12
CK-
11
10
9
8
7
4
SIDE_USB_DP
RCLAMP0502BA
OPT
D400
OPT
C413
5pF
50V
3
2
OPT
C414
5pF
50V
1
+5V_NORMAL
AR411
4.7K
1/16W
5V_DET_HDMI_2
DDC_SDA_2
13
5
C2+
C2-
HP_DET
SIDE_USB_DM
5
RIN1
V+
22uF
16V
3216
19
6
USB DOWN STREAM
3
C1+
OPT
C418
2
VCC
1
M1
C407
OPT
C417
4
1
OPT
ZD406
5V
OPT
C409
3
6
R400
0
HPD2
OPT
VR406
OPT
R411
1K
R412
2.7K
20
KJA-PH-1-0177
R419
33
HDMI2_5V
VR405
OPT
VR407
OPT
R415
4.7K
DDC_SCL_2
OPT
VR411
OPT
VR413
OPT
D401
CK_GND
AR404
5.1
1/16W
AR405
5.1
1/16W
CK+
D0D0_GND
IP4283CZ10-TBA
1
10
2
9
3
8
4
7
D0-_HDMI2
5
6
D0+_HDMI2
1
10
D1-_HDMI2
2
9
D1+_HDMI2
D0+
CK-_HDMI2
CK+_HDMI2
D1D1_GND
AR402
5.1
1/16W
D1+
D2D2_GND
AR403
5.1
1/16W
3
8
4
7
D2-_HDMI2
5
6
D2+_HDMI2
D2+
D402
IP4283CZ10-TBA
C404
0.1uF
OPT
V-
DOUT2
C403
0.1uF
RIN2
SPDIF OPTIC JACK
+3.3V_NORMAL
1
SPDIF
JK402
2
PM_TXD
PM_RXD
OPT
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
C408
1uF
10V
ESD Ready
SPDIF
C412
18pF
50V
JP425
JP424
2
FIX_POLE
4
SPDIF_OUT
JP423
VINPUT
JP422
5
Fiber Optic
VCC
4
3
GND
3
1
JST1223-001
L15_M1L
COMP/USB/SPDIF
141020
4
5
LGE Internal Use Only
3.3V_NORMAL -> 3.3V_TU
TUNER for ATSC W/O Isolator
+3.3V_NORMAL
+3.3V_TU
L500
PZ1608U121-2R0TF
C507
0.1uF
16V
C508
22uF
6.3V
C509
22uF
6.3V
C510
0.1uF
16V
+3.3V_TU
TU501
TDJH-H301F
C500
100pF
50V
C503
0.1uF
16V
close to the tuner pin
1
2
3
4
5
6
7
8
9
IF_AGC_MAIN
+3.3V
C502
0.1uF
16V
should be guarded by ground
NC_1
+3.3V_TU
DIF_AGC
SCL_RF
R502
1.8K
AR500
33
1/16W
SDA_RF
R503
1.8K
TU_SCL
TU_SDA
DIF[P]
C501
15pF
50V
C504
15pF
50V
OPT
C505
20pF
50V
OPT
C506
20pF
50V
DIF[N]
SIF
R501
33
IF_P_MSTAR
1/16W
5%
CVBS
R500
33
IF_N_MSTAR
1/16W
5%
A1
A1
B1
B1
Close to the tuner
47
SHIELD
TU_GND_A
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
L15_M1L
TUNER
140822
5
5
LGE Internal Use Only

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