506668-CEM Brochure

WELCOME
To
It is our policy to exceed our customers' expectations.
To fulfill this mission we each take personal responsibility
for everything we do.
Markets Served
Military
Industrial
Medical
LED Lighting
Telecom
Quality Policy Statement
It is our policy to exceed our customers' expectations.
To fulfill this mission we each take personal responsibility
for everything we do.
Company Overview

Founded 1989

Conceptual Design Engineering

49 Staff Members

PWB Layout

2 Shifts – Expanded (6AM-11PM)
Quick-Turn Prototypes.

20,000 Square Feet Facility
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ISO 9001:2008 Registered

3-Unannounced ISO Audits Annually
IPC-A-610 Certified

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Exotic Materials

J-STD-001 Certified

Smallest Comp – 0201’s

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ITAR Registered
Extensive BGA Evaluation Capabilities
Including X-Ray and End-Scope Optical

Inspection


Pre-production & Production
Runs
Largest Comp BGA’s 1800 Balls
uBGA’s
Full Turnkey Capabilities
Fully Staffed Purchasing Dept
Design Thru Assembly and Test
Manufacturing Capabilities

Leaded, RoHS, and Mixed Technologies

High Layer Count, Up to 32 Layers

Quick Reaction Prototyping Services

Pre-Production & Production Runs

Smallest Component Size Placed, 0201

Largest SMT Processed Board Size 36” by 48”

In Excess of 1000 BGA’s Placed Each Month

Largest BGA, 1800 Balls

u BGA’s, Fine Pitch Placed

In House BGA Rework and Re-balling Expertise

Largest # BGA’s Places on Single Board, 64

X-Ray and Endo-Scope BGA Inspection

Automatic Optical Inspection (AOI)

Functional Testing Services
Equipment List
Surface Mount Technology
Surface Mount & Thru-Hole Technology
MYDATA MY19 Hydra-SMT (21kCPH) (2 Each)
AIR-VAC Model DRS22 BGA Split Prism Hot Air Rework System
MYDATA MY15 Hydra-SMT (15kCPH)
AIR-VAC Model DRS25 BGA Split Prism Hot Air Rework System
MYDATA MY12 Hydra-SMT (21kCPH)
ELECTROVERT Vectra Solder Wave (Leaded)
MY DATA TP11- Hydra-SMT (10KCPH)
MY DATA TP11- UFP-SMT (6KCPH)
MYDATA TP9-Hydra SMT (10kCPH)
ELECTROVERT Econopac I Solder Wave (Lead Free)
Air-Vac Solder Pot
BLUE M Temperature Chamber (3 Each)
Ultra-Kool Cold Trap Vapor Degreaser
MYDATA TP9-UFP SMT (6kCPH)
BRANSON Vapor Degreaser
MYDATA TP9-2 SMT (4.5kCPH)
PYRAMAX 98 7 Zone Reflow Oven
KISS Selective Soldering Machine Model 103
PVA Selective Conformal Coating Model Delta 6
ELECTROVERT Omniflo-5 Zone Reflow Oven
MPM Corp MPM Screen Printer (2 Each)
Inspection / Test
MIRTEC MV - MV-3L Automatic Optical Inspection – AOI (2 Each)
METCAL 1000 Optical BGA Inspection System
V.J. TECHNOLOGIES Model VJ 2000 X-RAY System
AQUEOUS TECHNOLOGY Ionic Contamination Tester
VISION ENGINEERING Mantis Stereoscopes (6 Each)
Temperature Cycling / Burn-In Room
Assorted General Purpose Test Equipment
Engineering Overview


Specializing in High Density / High Performance Applications
PWB Layout Services Performed by Degreed, and IPC Certified,
Engineers

Controlled Impedance, Crosstalk Management, Exotic Materials
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RF, Microwave, Analog, Digital, and Mixed Technologies
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Flex and Rigid-Flex Circuitry
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2-32 Layers
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u BGA’s, Fine Pitch, Double Sided SMT
Product Management &
Sustaining Engineering Services
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CEM offers complete Product Management, Product Life Cycle,
and Sustaining Engineering Services. These Services often
specifically address long life cycle products such as Military,
Medical, and Capital Equipment products.
CEM takes responsibility for Configuration Control and Product
Modifications.
This includes Maintenance of Native and Production Databases,
cost reduction management, product enhancements, and
product longevity assurance
Product Management & Sustaining Engineering Services
ITEM: Bill of Materials

Periodic End of Life & Obsolescence Analysis
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Recommendations for replacement parts
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RoHS Conversions
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PTH to SMT Conversions
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Recommendations for buying / stocking long lead & other items
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Alternate Source recommendations

Cost Reduction Analysis
Product Management & Sustaining Engineering Services
ITEM: Engineering

Configuration Control management
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Schematic & PWB Design / ReDesign
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Drafting Services
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Native & Production Tool maintenance & control
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DFM / DFT Review for cost reduction and improved quality.
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Cost Reduction Analysis
Product Management & Sustaining Engineering Services
ITEM: Testing
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Test Development
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Custom & semi-custom hardware & software
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Complete Product testing
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Maintenance of Customer Supplied Test Equipment
Product Management & Sustaining Engineering Services
ITEM: Inventory Management

Customer inventory maintained in quarantined moisture proof
environment.
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Recommendations for inventory levels based upon supply &
demand
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Both piece parts and finished goods inventory
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Kanban
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Tests services for “broker” parts if necessary
World Class Manufacturing Facility
Surface Mount Technology 7 SMT Lines
Automatic Selective Soldering
150 KV Real Time X-Ray
BGA X-Ray
CEM ltd. BGA Attachment
Color enhancement to show solder attachment
Real Time BGA Optical Imaging
Automatic Optical Inspection
Automatic Selective Conformal Coating
Inspection Center
World Class Design & Manufacturing
World Class Design & Manufacturing
World Class Design & Manufacturing
World Class Design & Manufacturing
World Class Design & Manufacturing
World Class Design & Manufacturing
World Class Design & Manufacturing
World Class Design & Manufacturing
Quality Management System
Quality System
Contracts
Design
Procurement
Incoming Insp
SOP 4.01 & SOP 4.02 Management Responsibility
SOP 4.03 Contract Review
SOP 4.04 Design
SOP 4.06 Purchasing
SOP 4.10 Inspect
ISO 9001:2008 Registered
•ECN Change control
•Customer approval
•Program combine like material
•Subcontract review
•Approved vendor list
•ECN change control
•Received material
•Bare board testing
•Match purchase orders
Quality Management System
Kit Verification
SOP 4.09 Process Control
Operations
SOP 4.09 Process Control
In-Process Insp
Final Insp
Test
SOP 4.10 Inspect
SOP 4.10 Insp.
SOP 4.10 Insp. & Test
ISO 9001:2008 Registered
•Verify to BOM
•Supply Documentation
•Create travelers
•Measure accuracy
•Process control
•Traveler
•Traceability
•Measurement
•Prevention
•100%
•Measurement
•Documentation Control
•Process feedback
•In-circuit
•Functional
•ESS
•Measure 1st pass yield
Quality Management System
•Controlled documents
•ECN control
•Customer documents
Document Cont
SOP 4.05 Document and Data control
Customer Prod
SOP 4.07 Control of customer supplied products
Traceability
Measuring
Corrective Action
SOP 4.08 Product Identification and Traceability
SOP 4.11 Control of Measuring, Inspection and Test Equipment
SOP 4.14 Corrective and Preventative Action
ISO 9001:2008 Registered
•CAR
•Training
Quality Management System
General Product Flow
T. Blackmon
Start
Procurement
Special
Instructions
Kit Verification &
Prep
Electrical
Assembly
Harness
Assembly
Mechanical
Assembly
Inspection
Inspection
Inspection
Final Assembly
Inspection
Product Flow General
Customer
Program
Quality Management System
Process Flow Chart
Surface Mount Technology Automatic
T. Blackmon
Start
Surface Mount
Technology
Automatic
Process
Program
SMT
Equipment
Screen Print
Side 1
Load SMT
Devices Into
Magazine
Place SMT
Components
Side 1
100% X -RAY
BGA
Placement
100 %
verification to
BOM
1st Piece
Inspection
Side 1
To
A
Includes BGA's and BGA Sockets
Document
Results
Document
Results
Control Point
Control Point
Product Flow General
Laser Cut
Stencil
Quality Management System
Process Flow Chart
Surface Mount Technology Automatic
Develop
Recipe
From
A
Re - Flow
Side 1
Document
Results
No
Control Point
Laser
Stencil
Recipes
Repeat
Process Side
2
X - Ray
100 % visual
Inspection
Test
Ship
Stop
Document
Results
No
Control Point
Document
Results
No
Control Point
Product Flow General
100% X -RAY
BGA Solder
Special Instructions: This Job contains Moisture Sensitive Devices.
See Manufacturing Traveler Amendment F 4.09.00.02.
Operation
10
20
30
40
45
50
55
60
65
75
80
90
95
100
105
110
115
125
130
140
145
155
160
170
175
PS
CL
II
TST
FI
180
190
195
205
295
SH
SH
NOTE
298
299
XX
Operation Description
Verify Kit Per WI4.09.01
Set-Up Per WI4.09.03
Verify MSD Sheet Is Filled Out Per WI4.09.03
Screen Boards Per WI4.09.09
Inspect Solder Paste Per WI4.10.01
Place Parts Per WI4.09.03
Inspect Side 1 Verification Per WI4.10.01
Reflow 1 Board Per WI4.09.03
Inspect Solder Per WI4.10.01
X-Ray 1 Board Per WI4.10.01 - Process Check
Reflow Balance Of Boards Per WI4.09.03
Screen Boards Per WI4.09.09
Inspect Solder Paste Per WI4.10.01
Place Parts Per WI4.09.03
Inspect Side 2 Verification Per WI4.10.01
Reflow 1 Board Per WI4.09.03
Inspect Solder Per WI4.10.01
X-Ray 1 Board Per WI4.10.01 - Process Check
Reflow Balance Of Boards Per WI4.09.03
Clean Per WI4.09.07
X-Ray Per WI4.10.01 100%
AOI Inspect Per WI 4.10.01 100%
Install Thru Hole Parts Per WI4.09.08
Clean Per WI4.09.07
Inspect Per WI4.10.01
Thru Hole & All Solder
Install Post Parts Per WI4.09.08
Clean Per WI4.09.07
Inspect Post Parts Per WI4.10.01
Test Per WI4.10.03
Final Inspect Per WI4.10.02
Serial Numbers - As Required
Pack Per WI4.15.02
Ship Per WI4.15.02
Return Traveler To Material Control
This traveler has been issued by Material Control Supervisor: Signature and date.
This traveler has been reviewed and approved by Quality Assurance.
Oper
Qty
Comp
Process
Time*
Date
Product Flow Typical
Work
Center
KV
ASM
ASM
ASM
II
ASM
II
ASM
II
XR
ASM
ASM
II
ASM
II
ASM
II
XR
ASM
CL
XR
II
PS
CL
II
Reviewed by Production Supervisor:
Signature and date.
The Contract Engineering and
Manufacturer of Choice
•We are Committed
•We are Flexible
•We are the Right Company Size
•We Exceed Customer’s Expectations