Full Conference Program

Transcription

2002 IEEE MTT-S
INTERNATIONAL
MICROWAVE SYMPOSIUM
Seattle, WA • June 2–7, 2002
F
R
www.ims2002.org
RFIC
A
T
G
IMS 2002
IMS
2002 Symposium
Symposium Week
Week at
at a
a Glance
Glance
IMS
Activity
Location
Tutorials
Workshops
Plenary Session
Technical Sessions
Interactive Forum
Panel Sessions
WSCTC
WSCTC
WSCTC
WSCTC
WSCTC
WSCTC
Exhibits µAPS
RFIC
Workshops
Plenary Session
Technical Sessions
Panel Session
Interactive Forum
ARFTG Conference
Exhibits
Social
Workshop Breakfast, Lunch
MTT Member Breakfast
RFIC Reception
MJ Reception
Salmon Bake
Industry Reception
MTT Awards Banquet
Student Awards Banquet
Speakers Breakfast
ARFTG Breakfast
ARFTG Awards Lunch
WSCTC
WSCTC
WSCTC
WSCTC
WSCTC
WSCTC
WSCTC
WSCTC
WSCTC
WSCTC
Sheraton
Pacific Science Center
Tillicum Village
Sheraton
Sheraton
Sheraton
WSCTC
WSCTC
WSCTC
SUN/2
M N A
MON/3
E M N A
TUE/4
E M N A
WED/5
E M N A
THU/6
E M N A
FRI/7
E M N A
E
IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM 2002/MICROWAVE WEEK
MORNING
8:00–9:40 AM
10:10–11:50 AM
LUNCHTIME
12:00–1:15 PM
AFTERNOON
1:20–3:00 PM
Monday,
June 3, 2002
Sunday,
June 2, 2002
Sat.,
June 1
EVENING
3:30–5:10 PM
Registration 2 to 6 PM
Registration 7 AM to 6 PM
TSA: RF Fundamentals
TSB: MEMS Technology for Highly Integrated RF Systems
TSC: EM Simulators — Theory and Practice
WSA: Developments in Integrated Circuits for Communications at 40 Gb/s and Beyond
WSB: Highly Integrated Packaging Techniques for Microwave and Millimeter-wave Packaging for Broadband Applications
WSC: Direct Conversion Transceivers for Cellular and Wireless Applications
WSD: RF and High Speed Flip-chip Technology and Design
WSE: Advances in Bluetooth Technology
WSF: Wireless Systems on a Chip
WSH: RF Solutions for GPS-to-handset Applications
WSG: GHz and THz Solid State Device Simulation
WSI: Intelligent RF Front-ends
RFIC Plenary Session 8 AM to 10 AM — RFIC Technical Sessions 10 AM to 5 PM – WSCTC
WMA: Automotive Radar and Prospective Circuit/Antenna Technologies — From Car Collision Avoidance to Autonomous Driving
WMB: Microwave Component Design Using Space Mapping Methodologies
WMC: Ultrahigh Speed Microwave and Photonic Devices and Systems: How Will They Be Tested?
WMD: Wide Bandgap Technologies: Applications, Devices and Circuit Issues
WME: Advances in Ceramic Interconnect Technologies for Wireless, Microwave and Photonic Applications
WMF: Introducing New Concepts in Nonlinear Network Design
WMG: EM-based CAD and Optimization of Waveguide Components, Planar Circuits and Antennas
WMH: Passive Components for RF Applications
WML: Wireless Microsensors: Technology and Applications
WMI: Spectrum Management Issues
WMM: Microwave and Lightwave System Architectures…
PM: RF CMOS in Cell Phones:
WMJ: Advances in RF MEMS Technology
WMN: Modeling of RF MEMS Switches
Fact or Fiction
WMK: Microwave Photonics for Medical Imaging
WMO: Differential Device Characterization and Modeling
RFIC Reception
7 to 9 PM
Sheraton
Microwave Journal/
MTT-S Reception
6 to 8 PM
Pacific Science
Center
Tuesday,
June 4, 2002
RFIC Symposium 8:30 AM to 5 PM – WSCTC
IMS Exhibition and µAPS 9 AM to 5 PM
TU1: Plenary Session
TU2A*: Radio Frequency Integrated
Circuits for 3G
(Joint IMS/RFIC)
TU2B: MMIC Technology
(Joint IMS/RFIC)
TU2C: Phased Arrays and Beam
Steering Techniques
TU2D: Integrated Circuits for 40 Gb/s
Fiber Systems
TU2E: Couplers, Dividers
and Baluns
TU2F: Nonlinear CAD Techniques
for Circuits and Systems
PT: Is the Single Chip Radio Dead?
IF-TU: INTERACTIVE FORUM 1:30 TO 4:30 PM
TU4A: Active Device Modeling
TU3A: Silicon Substrate
and Characterization
and Inductor Modeling
(Joint IMS/RFIC)
(Joint IMS/RFIC)
TU4B: RFIC Power Amplifier
TU3B: SiGe RFIC Process Technologies
Technologies (Joint IMS/RFIC)
(Joint IMS/RFIC)
TU4C: Smart Antennas and Digital
TU3C: Integrated Passives for RF
Beamforming Techniques
and Millimeter-wave Applications
TU4D: Application of RF MEMS
TU3D: RF MEMS Switch Design
and Modeling
TU4E: Frequency and Phase
TU3E: Frequency Conversion Circuits
Control Circuits
Tillicum Village
5:30 to 10:30 PM
Wednesday,
June 5, 2002
IF-WE: INTERACTIVE FORUM 1:30 TO 4:30 PM
WE1A: High Power Amplifiers
WATTS UP?
WE2A: Distortion Correction
Techniques for High Power Amplifiers
WE1B: Microwave and Millimeter-wave
Sensor Applications
WE1C: Transmission Line
Structures
WE1D: Advances in Microwave
Oscillators
WE1E: Linear Modeling
WE2B: Evolving Communication
and Radar Systems
WE2C: Transitions, Polarizers
and Coupling Characteristics in LTCC
WE2D: Microwave and Millimeter-wave
Signal Generation
WE2E: Nonlinear Device Modeling I
WE1F: Advances in Time Domain
Techniques for EM Field Modeling
WE2F: Applications of the
Finite-difference Time-domain Method
PW: RF MEMS: Revolution or Evolution
WE3A: Power Amplifier Technologies
for Broadband, High Efficiency
Applications
WE3B: Direct Conversion Techniques
for Wireless Systems
WE3C: New Leakage Effects
on PC Transmission Lines
WE3D: Efficient Modeling Techniques
for Circuit Simulation
WE3E: Nonlinear Device Modeling II
WE3F*: 50th Anniversary of MTT-S
WE4A: RF Power Amplifiers
for Wireless Applications
WE4B: New Technologies
for Communications Systems
WE4C: New Periodic Structures
and Effects
WE4D: CAD Techniques Using
Computational Intelligence
WE4E: Applications of Time Domain
Methods
Industry-hosted Cocktail
Reception
6 to 7:30 PM
Sheraton
Awards Banquet
7:30 to 10 PM
Sheraton
50th Anniversary Special
Interactive Forum
Friday,
June 7, 2002
Thursday,
June 6, 2002
IF-TH: INTERACTIVE FORUM 1:30 TO 4:30 PM
TH1A: Flip-chip Techniques and Novel
Application of Organic Materials
in Packaging
TH1B: Low Noise Devices
and Applications
TH1C: Synthesis and Multi-mode
Techniques
TH1D: Ferroelectric, Ferrite
and Acoustic Components
TH1E*: High-speed/
Non-contacting Electrical Probing
TH1F: Spatial Power Combining
and Quasi-optical Techniques
TH2A: Packaging
TH2B*: THz Technology
and Applications
TH2C: Novel Filter Structures
TH2D: High Efficiency Amplifier
Techniques
TH2E: Microwave Measurements I
PTH: Making Sense or Cents:
Which WLAN Technology will Survive?
Sheraton
TH3A: Advanced V-band Transceiver
Technology
TH4A: W-band Transceiver
Components and Applications
TH3B: Biological Effects
and Medical Applications
TH3C: Waveguide and Planar Filter
Structures
TH3D*: Wide Bandgap Devices
and Their Application in High Power
TH3E: Microwave Measurements II
TH4B: Frequency Domain Techniques
TH4C: Active, Periodic
and Planar Filters
TH4D*: Optical Processing
of Antenna Signals
TH4E: Superconducting Components
and Technology
TH2F: Microwave Photonics
Workshop Registration 7 AM to 9 AM
ARFTG Conference and Exhibition 7:30 AM to 5 PM – WSCTC
WFA: Cryogenic and Superconductor Microwave Subsystems
WFB: Evolution of the Photonic Antenna
WFC: Optical Packaging Techniques Combining Optics and Electronics
*SPECIAL
SESSIONS
CONTENTS (LISTED ALPHABETICALLY)
Administrative Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
ARFTG Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
ARFTG Microwave Measurement Conference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Awards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Exhibition Invitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Exhibitors and Exhibition Hours . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Fellows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Future IMS Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
General Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
Guest Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Historical Exhibit and Interactive Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Hotel Map and Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10, 68, INSIDE BACK COVER
Housing Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
IEEE MTT-S Membership Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Interactive Forum
Tuesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52–53
Microwave Application & Product Seminars . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56–57
MTT-S Technical Program Chairs’ Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Panel Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Plenary Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Registration Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Registration Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
RFIC Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
RFIC Symposium . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12–14
Seattle Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Sheraton Seattle Hotel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .INSIDE BACK COVER
Social Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Special Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39,43,59
Special Tuesday Evening Event . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Steering Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
Student Paper Competition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Technical Program Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
Technical Sessions
Tuesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26–31
Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34–41
Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44–51
Tutorials
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Sunday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Washington State Convention and Trade Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
Westin Seattle Hotel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
Workshops
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
1
AN INVITATION TO MICROWAVE WEEK 2002
Welcome to Seattle, Washington for the 2002 International Microwave Symposium, the 50th anniversary of the Microwave Theory and
Techniques Society. This year marks the first year
the Symposium is held in the beautiful Pacific
Northwest. A dedicated team of over 60 volunteers from Northwest industry and academia has
been working together for over seven years to put
together this year’s symposium. We are proud to
present Microwave Week 2002.
Microwave Week is the highlight of the year
for our industry. It is a time to present breakthrough research or make new product announceDonn Harvey
ments, a time to learn about a new technology or
find the missing piece to a design problem, a time to make contact with
industry experts, a time for user groups, workshops, side meetings, social
events and friends. It’s a full week with something for everyone and
more than can be absorbed by most. The week includes the IMS technical program, panel sessions, plenary session, workshops, tutorials, the
RFIC Symposium and the ARFTG conference. Plenty of social events
and a full guest program round out the week. Enjoy your stay, learn
something and have fun.
Donn Harvey
General Chairman
2002 International Microwave Symposium
IMS TECHNICAL PROGRAM
This year’s Tutorials offer a new way to help MTT newcomers come
up to speed on microwave or RF topics. There are three tutorials on Sunday to introduce basic concepts, tools and technologies for those not working in these areas.
These tutorials will help attendees to understand
papers presented later in Microwave Week.
2002 is the 50th anniversary of the Microwave
Theory and Techniques Society. One of the major
activities the Society has undertaken for this celebratory year is a special issue of the Transactions
that reviews the progress of microwave technology over the past 50 years. Charts and excerpts
Ed Godshalk
from these transactions papers, with additional
photographs and historical hardware, will augment the historical exhibit
in the Convention Center lobby. In addition, some of the authors of
these transactions articles will be on hand for a special Interactive Forum
on Wednesday afternoon.
Microwave Week is also a great place to see old acquaintances and
network with RF and microwave experts from around the world. We are
looking forward to a great Symposium and a great celebration of 50
Years of Microwaves, and we’re looking forward to seeing you in Seattle.
Eric Strid, Chair
Ed Godshalk, Vice-Chair
IMS 2002 Technical Program
The 2002 IMS Technical Program Committee has organized an exciting program that spans the breadth of topics in the MTT Society, with
contributed paper sessions and workshops at
state-of-the-art depth as well as tutorials targeting newcomers to microwaves and RF. This year
886 papers were submitted to IMS, of which 491
were accepted either for talks or for presentations
at Interactive Forums. The quality and quantity
of the submitted papers reflects the continuing
rapid pace of RF and microwave developments at
the theoretical and practical level. About 57% of
the presented papers are from outside North
Eric Strid
America, which is a good representation of the
growing microwave activity around the world. This year’s student paper
competition draws from over 200 papers submitted by students. Student
paper finalists will be recognized and awards will be presented at the
student paper awards banquet on Thursday. To accommodate all of the
accepted papers, there are six parallel sessions arranged to minimize conflicts with similar topic areas.
This year there are 27 full-day or half-day workshops on a wide range
of microwave and RF topics. These will be held before IMS on Sunday,
Monday, and after IMS on Friday. These workshops provide a great way
to get an update on a specific topic. In addition to workshops, there will
be a panel session each day on Tuesday, Wednesday and Thursday at
lunchtime, and six special sessions on targeted topics throughout these
three days.
2
RFIC SYMPOSIUM
On behalf of the Technical Program Committee, welcome to the 2002
IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. The
RFIC Symposium is one of the foremost IEEE
technical conferences dedicated to the latest innovations in RFIC development for wireless and
wire-line communication systems. The RFIC
Symposium will begin on Sunday with workshops that address various topics on RF technology, design, and system issues. On Sunday there
will also be several Tutorial sessions that are intended to be in the form of an educational forum.
The Plenary Session will start off the conference
Natalino Camilleri
on Monday with a focus on wireless systems, the
future of cellular communications, and RFIC design. Following the Plenary Session, the regular technical program will start with four parallel
sessions. A Panel Session during lunch will allow interactive discussions
on the merits of using RF-CMOS in Cell-Phones. The Panelist, representing various industries and academia will address their views on the
future of high performance RF-CMOS for mobile handsets. The RFIC
symposium will conclude on Tuesday with several Joint sessions with
IMS, which also includes an interactive forum. The goal of the technical
committee has been to enhance the quality of the technical program.
During Monday and Tuesday the RFIC Symposium will have 18 sessions, together with 16 invited papers.
I would like take the opportunity to thank the authors and the technical program committee members for an exciting program. On behalf of
the Steering Committee, we are look forward to seeing you in Seattle.
Natalino Camilleri
RFIC Technical Program Committee Chairman
2002 IEEE RFIC Symposium
59TH ARFTG MICROWAVE
MEASUREMENT CONFERENCE
Welcome to the 59th Automatic RF Techniques Group (ARFTG)
Conference being held at the Washington State Convention and
Trade Center on Friday, June 7, 2002. The conference will include technical presentations, an
interactive forum and an exhibition. The result is
a great opportunity to meet and interact with
many experts in the RF and microwave test community.
The conference theme is “Test, Measurement
and Characterization of High-Speed Digital
Components and Systems.” The demand for high
data rates and broad-bandwidth wireless and fiber
Ed Godshalk
networks has resulted in high speed digital circuits with clock rates up to 40 GHz and beyond. Developing these products has led to remarkable challenges and opportunities as engineers are
forced to meet both digital and microwave demands simultaneously.
Presentations will discuss test, measurement and characterization issues
in both the time and frequency domain plus related topics such as packaging solutions, circuit model extraction and interconnect characterization. In addition, papers concerning traditional ARFTG topics such as
noise measurements, nonlinear characterization, S-parameter network
analysis, calibration and on-wafer measurements will be included.
A popular and well-noted aspect of ARFTG conferences is the opportunity to meet one-on-one with experts, colleagues and vendors in the
RF and microwave test and measurement community. You will have
ample opportunity to meet with other attendees and presenters at the
continental breakfast and breaks in the exhibition area, interactive forum
sessions and the luncheon. It is a great opportunity to discuss your ideas
and questions concerning metrology, S-parameters, nonlinear measurements, etc. with some of the leaders in the measurement community.
Attendees often find that these interactions are their best source of ideas
and information for their current projects. The atmosphere is informal
and friendly so please come and join us.
There will also be a joint IMS/ARFTG session on Thursday, June 6,
titled “High-Speed/Non-Contacting Electrical Probing” with particular
emphasis on instrumentation and calibration techniques for testing 40
Gb/s digital circuitry associated with high-speed optical links, and noncontact probing for testing dense digital integrated circuits.
Ed Godshalk
Conference Chair
EXHIBITION
The exhibition that is part of Microwave Week gives you the opportunity to visit displays from more than 450 companies that will be
showing the latest products and services available to our industry. A
number of new companies will be exhibiting this year in addition to the
traditional exhibitors. In addition, the Microwave Application and Product Seminars (µAPS), which are in their seventh year, will be held near
the show floor. These seminars are always well received and have been
improved and expanded for this year’s meeting.
The exhibition is open from 9:00 AM to 5:00
on Tuesday and Wednesday and from 9:00 AM
to 3 PM on Thursday. I hope you will take advantage of this unique chance to visit the largest
group of microwave exhibitors at any show in the
world.
Harlan Howe, Jr.
Exhibition Manager
PM
3
PLENARY SESSION
All Microwave Week registrants and guests are invited to attend the IMS 2002 Plenary Session, which will begin at 8:00 AM
on Tuesday, June 4, in the Washington
State Convention and Trade Center sixth
floor ballroom. Welcoming remarks will be
given by Symposium Chairman Donn Harvey, and by MTT-S President John Barr, followed by an overview of the technical program by TPC Chairman Eric Strid. The Class
of 2002 IEEE Fellows will be recognized.
Mr. Juha Christensen, corporate vice president, Mobility Group of Microsoft, will preMarc A. Sweet
sent the keynote address
Marc A. Sweet, Vice Chairman
IMS 2002 Steering Committee
and also oversees companywide mobility solutions and scenario
planning.
Before joining Microsoft, Christensen co-founded Symbian
Ltd., a joint venture between Nokia Oyj, Telefonaktiebolaget LM
Ericsson, Motorola Inc., Matsushita Communication Industrial Co. and Psion Plc.
During his time at Symbian, Christensen
wrote the company’s first business plan —
which had a large impact on the company’s
overall strategy and vision — and led the
core team responsible for bringing together
joint venture partners.
While at Symbian, Christensen was a
board member and executive vice president
Juha Christensen
in charge of product management, marketing, sales, business development, evangelism and supplier relationships. He also had overall responsibility for the company’s
operations in North America and Asia.
Previously, Christensen was vice president of licensing at
Psion, in charge of the commercialization of Psion’s intellectual
properties. During his six years at Psion, Christensen held positions in marketing, sales, product management and product design. Before joining Psion, Christensen held general management and product design positions in networking, communications and operating system software companies.
Juha Christensen
Corporate Vice President, Mobility Group, Microsoft
As corporate vice president of the Mobility Group at Microsoft
Corp., Juha Christensen is responsible for managing strategic
partnerships, business development and product marketing for
Microsoft’s mobility solutions. Products overseen by Christensen
include Pocket PC, Microsoft(r) Mobile Explorer microbrowser
and Microsoft’s smart phone platform. He heads Microsoft’s participation in a variety of worldwide wireless standards bodies
SPECIAL SESSIONS
✗ Radio Frequency Integrated Circuits for 3G Terminals
and Base Stations
✗ High-Speed/Non-Contacting Electrical Probing
✗ THz Technology and Applications
✗ Wide Bandgap Devices and Their Application
in High Power and Low Noise Circuits
✗ Optical Processing of Antenna Signals
✗ 50th Anniversary of the MTT
The IMS2002 technical program committee has organized six
sessions and a special interactive forum in diverse areas of special interest to many attendees of the Symposium. All papers in
these special sessions were solicited and invited by the session
organizers, and then reviewed and accepted by the technical
program committee. Detailed descriptions of the special sessions
and interactive forum can be found on pages 39, 43 and 59.
NOTES
4
TUTORIALS
(FOR A MORE DETAILED DESCRIPTION OF ANY OF THE EVENTS ON THIS PAGE, VISIT WWW.IMS2002.ORG)
Sunday
TSA
8:00 AM–5:00 PM
RF Fundamentals
Sunday
TSB
8:00 AM–5:00 PM
MEMS Technology for Highly Integrated RF Systems
Sunday
TSC
8:00 AM–5:00 PM
EM Simulators – Theory and Practice
WSA
8:00 AM–5:00 PM
Developments in Integrated Circuits for Communications at 40 Gb/s and Beyond
WSB
8:00 AM–5:00 PM
Highly Integrated Packaging Techniques for Microwave and mm-wave Packaging for Broadband Applications
WSC
8:00 AM–5:00 PM
Direct Conversion Transceivers for Cellular and Wireless Applications
WSD
8:00 AM–5:00 PM
RF and High Speed Flip-chip Technology and Design
WSE
8:00 AM–5:00 PM
Advances in Bluetooth Technology
WSF
8:00 AM–12:00 PM
Wireless Systems on a Chip
WSG
8:00 AM–12:00 PM
GHz and THz Solid State Device Simulation
WSH
1:00 PM–5:00 PM
RF Solutions for GPS-to-handset Applications
WSI
1:00 PM–5:00 PM
Intelligent RF Front-ends
WMA
8:00 AM–5:00 PM
Automotive Radar and Prospective Circuit/Antenna Technologies —
From Car Collision Avoidance to Autonomous Driving
WMB
8:00 AM–5:00 PM
Microwave Component Design Using Space Mapping Methodologies
WMC
8:00 AM–5:00 PM
Ultrahigh Speed Microwave and Photonic Devices and Systems: How Will They Be Tested?
WMD
8:00 AM–5:00 PM
Wide Bandgap Technologies: Applications, Devices and Circuit Issues
WME
8:00 AM–5:00 PM
Advances in Ceramic Interconnect Technologies for Wireless, Microwave and Photonic Applications
WMF
8:00 AM–5:00 PM
Introducing New Concepts in Nonlinear Network Design
WMG
8:00 AM–5:00 PM
EM-based CAD and Optimization of Waveguide Components, Planar Circuits and Antennas
WMH
8:00 AM–12:00 PM
Passive Components for RF Applications
WMI
8:00 AM–12:00 PM
Spectrum Management Issues
WMJ
8:00 AM–12:00 PM
Advances in RF MEMS Technology
WMK
8:00 AM–12:00 PM
Microwave Photonics for Medical Imaging
WML
1:00 PM–5:00 PM
Wireless Microsensors: Technology and Applications
WMM
1:00 PM–5:00 PM
Microwave and Lightwave System Architectures, Signal Processing, Limitations and Noise
WMN
1:00 PM–5:00 PM
Modeling of RF MEMS Switches
WMO
1:00 PM–5:00 PM
Differential Device Characterization and Modeling
WFA
8:00 AM–5:00 PM
Cryogenic and Superconductor Microwave Subsystems
WFB
8:00 AM–12:00 PM
Evolution of the Photonic Antenna
WFC
8:00 AM–12:00 PM
Optical Packaging Techniques Combining Optics and Electronics
Friday
June 7
Monday
June 3
Sunday
June 2
WORKSHOPS
MTT-S PANEL SESSIONS
In addition to the workshops and special
sessions, the 2002 Symposium will feature
four lunchtime (12:00 to 1:15 PM) panel sessions at the Washington State Convention
and Trade Center. These panel sessions provide attendees with opportunities to hear
lively dialog and differing views from a panel of experts on subjects of current interest,
while at the same time allowing a high level
of audience interaction. The following topics will be discussed:
PANEL SESSIONS
Monday, June 3
• RF CMOS in Cell Phones: Fact or Fiction
Tuesday, June 4
• Is the Single Chip Radio Dead?
Wednesday, June 5
• RF MEMS: Revolution or Evolution
Thursday, June 6
• Making Sense or Cents: Which WLAN
Technology will Survive?
5
Detailed descriptions of all four panel sessions can be found on page 33.
Participation in the panel sessions requires separate registration; please use the
registration form on page 7. Registration for
panel sessions includes a box lunch.
2002 IEEE MICROWAVE THEORY AND TECHNIQUES SOCIETY
MEMBERSHIP APPLICATION
(Current and reinstating IEEE members joining MTTS complete areas 1, 2, 8, 9.)
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6
Date
Advance Conference Registration
IEEE MTT-S MICROWAVE WEEK EVENTS
June 2–7, 2002 ✦ Seattle, WA ✦ IMS ✦ RFIC ✦ ARFTG
Each conference
must submit
a separate
registration
form.
Each conference
attendee must attendee
submit a separate
registration
form. A copy
of this form
may be
Aused.
copy
of thisfor
form
mayregistration
be used. The
deadline
advanced
is May via
15, 2000.
Deadline
advance
via fax
or mail isfor
April
26, 2002.registration
Registration deadline
Afterwards,
feeson-site
applyfees
andapply
willand
be will
approximately
30%
higher.
Website is
May 3, 2002.on-site
Afterwards,
be approximately
30%
higher.
NAME
Last
First
AFFILIATION
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To register, check ■
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ONLY PAID ATTENDEES WILL BE ADMITTED TO THE WORKSHOPS AND TECHNICAL SESSIONS.
INTERNATIONAL MICROWAVE SYMPOSIUM (Tue., Wed. & Thur.)
(INCLUDES EXHIBITS AND µAPS)
IEEE
NonMember
Member
All IMS Sessions (Includes IMS CD ROM, no Digest.)
■ $265
■ $405
■ $320
■ $460
All IMS Sessions (Includes IMS CD ROM and Digest.)
■ $140
■ $200
Single-Day Registration
WORKSHOPS AND TUTORIALS For paid attendees only.
(SEE BACK OF THIS PAGE FOR TITLES.)
Student/Retiree/
IEEE Member
Non-member
Life Member
Remittance
Full Day
Half Day
$ _____________
$ _____________
$ _____________
SUNDAY
■ WSA
■ WSB
■ WSC
■ WSD
■ WSE
■ WSF
■ WSG
■ WSH
■ WSI
(Includes IMS CD ROM, no Digest.)
■ $145
■ $160
$ _____________
■ $150
(INCLUDES EXHIBITS, LUNCH, RFIC RECEPTION AND RFIC DIGEST.)
■ $250
RFIC Reception Only
■ $200
$ _____________
■ $455
$ _____________
Student, Retiree, Life Member
RFIC SYMPOSIUM (Mon. & Tue.)
ARFTG – MICROWAVE MEASUREMENT CONFERENCE (Thur., Fri.)
(INCLUDES EXHIBITS, BREAKFAST, LUNCH, ARFTG MEMBERSHIP, DIGEST AND ARFTG EXHIBITION.)
ARFTG Registration
■ $175** ■ $225
ARFTG Student, Retiree
■ $185** ■ $110
**ARFTG MEMBERS USE IEEE MEMBER PRICE
ADDITIONAL DIGESTS
AND
$110
$175
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Morning)
(Morning)
(Afternoon)
(Afternoon)
$____
$____
$____
$____
$____
$____
$____
$____
$____
$ _____________
$ _____________
CD ROMS
(FOR PICKUP ON-SITE ONLY. SEPARATE DIGESTS AND CD ROMS WILL BE AVAILABLE AFTER THE SYMPOSIUM FROM THE IEEE.)
IMS Digest
Qty. ___ @
■ $175
■ $100
$ _____________
■ $125
■ $135
$ _____________
IMS CD ROM
Qty. ___ @
RFIC Digest
Qty. ___ @
■ $140
■ $155
$ _____________
■ $125** ■ $145
$ _____________
ARFTG Digest
Qty. ___ @
ARFTG Microwave Measurement Conference Digest Compilation
CD ROM 1982–2001
Qty. ___ @
■ $150**
■ $165
MONDAY
■ WMA
■ WMB
■ WMC
■ WMD
■ WME
■ WMF
■ WMG
■ WMH
■ WMI
■ WMJ
■ WMK
■ WML
■ WMM
■ WMN
■ WMO
$85
$60
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Full Day)
(Morning)
(Morning)
(Morning)
(Morning)
(Afternoon)
(Afternoon)
(Afternoon)
(Afternoon)
TUTORIALS (SEE BACK OF THIS PAGE FOR TITLES.) SUNDAY
■ TSA (Full Day)
$____ ■ TSB
(Full Day)
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
$____
FRIDAY
■ WFA
■ WFB
■ WFC
(Full Day)
(Morning)
(Morning)
$____
$____
$____
WORKSHOPS $ ________
TOTAL
$____ ■ TSC (Full Day) $____
TUTORIAL TOTAL $ ________
Full-day workshops and Tutorials include continental breakfast, lunch and afternoon refreshments.
Morning workshops include continental breakfast and lunch. Afternoon workshops include lunch
and afternoon refreshments. Registration includes Workshop CD ROM. Workshop presenters’ notes
will be available at the workshop.
$ _____________
**ARFTG MEMBERS USE IEEE MEMBER PRICE
PANEL SESSIONS (INCLUDES BOX LUNCH. SEE REVERSE SIDE FOR SCHEDULE.)
PM: RF CMOS in Cell Phones: Fact or Fiction
■
PT: Is the Single Chip Radio Dead?
■
PW: RF MEMS: Revolution or Evolution
■
PTH:Making Sense or Cents: Which WLAN Technology will Survive? ■
$145
$100
GUEST PROGRAMS
$15
$15
$15
$15
GSA:
GSB:
GMB:
GMC:
GTD:
GTE:
GWF:
GWG:
GTHH:
GTHI:
GFJ:
GFK:
$ _____________
$ _____________
$ _____________
$ _____________
AWARDS BANQUET (WEDNESDAY EVENING)
SHERATON HOTEL
Qty. ___@
■ $40 $ _____________
SOCIAL EVENT (TUESDAY EVENING)
TILLICUM VILLAGE
Qty. ___@
■ $48 $ _____________
Golf Tournament
Victoria Day Trip (unescorted)
Mt. Rainier Tour
Seattle Highlights w/Lunch
Northwest Winery/Brewery Tour
Snoqualmie Falls/Train Ride
Boeing Everett Plant Tour
Museum Tour w/Lunch
Harbor Cruise w/Lunch
Victoria Overnight (escorted)
Qty.
Qty.
Qty.
Qty.
Qty.
Qty.
Qty.
Qty.
Qty.
Qty.
Qty.
Qty.
GUEST
The only acceptable forms of payment are check, money order, MasterCard, VISA or American Express.
Make your check or money order (US $ ONLY on a US Bank or Traveler’s Check) payable to: IEEE/MTT-S
■ MasterCard
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■ American Express
Card #
Signature __________________________________________
___ @ ■ $105
___ @ ■ $115
___ @ ■ $187
___ @ ■ $168
___ @ ■ $133
___ @ ■ $163
___ @ ■ $140
___ @ ■ $158
___ @ ■ $185
___ @ ■ $140
___ @ ■ $285
___ @ ■ $115
PROGRAM TOTAL
$________
$________
$________
$________
$________
$________
$________
$________
$________
$________
$________
$________
$________
TOTAL REMITTANCE $ _________________
INDIVIDUAL PAYMENT MUST ACCOMPANY FORM
Exp. Date
Written requests for refunds will be honored if received by April 27, 2002.
A $25 cancellation fee will be charged for processing.
(Signature must accompany credit card payment)
MAIL COMPLETED FORM AND PAYMENT TO: MTT-S Registration, 685 Canton Street, Norwood, MA 02062
For information or handicap special needs only (phone registration is not available) (781) 769-9750.
PLEASE FAX (781) 769-5037 OR MAIL; DO NOT FORWARD HARD COPY IF FAXED
REGISTRATION IS AVAILABLE ONLINE AT WWW.MTT-SREGISTRATION.COM
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Please indicate those you do NOT wish to contact you: ■ IEEE MTT-S ■ Selected outside industry organizations
7
TUTORIALS
Sunday
Sunday
Sunday
(FOR A MORE DETAILED DESCRIPTION OF ANY OF THE EVENTS ON THIS PAGE, VISIT WWW.IMS2002.ORG)
TSA
8:00 AM–5:00 PM
RF Fundamentals
TSB
8:00 AM–5:00 PM
MEMS Technology for Highly Integrated RF Systems
TSC
8:00 AM–5:00 PM
EM Simulators – Theory and Practice
WSA
WSB
WSC
WSD
WSE
WSF
WSG
WSH
WSI
WMA
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
1:00 PM–5:00 PM
1:00 PM–5:00 PM
8:00 AM–5:00 PM
WMB
WMC
WMD
WME
WMF
WMG
WMH
WMI
WMJ
WMK
WML
WMM
WMN
WMO
WFA
WFB
WFC
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
1:00 PM–5:00 PM
1:00 PM–5:00 PM
1:00 PM–5:00 PM
1:00 PM–5:00 PM
8:00 AM–5:00 PM
8:00 AM–12:00 PM
8:00 AM–12:00 PM
Developments in Integrated Circuits for Communications at 40 Gb/s and Beyond
Highly Integrated Packaging Techniques for Microwave and mm-wave Packaging for Broadband Applications
Direct Conversion Transceivers for Cellular and Wireless Applications
RF and High Speed Flip-chip Technology and Design
Advances in Bluetooth Technology
Wireless Systems on a Chip
GHz and THz Solid State Device Simulation
RF Solutions for GPS-to-handset Applications
Intelligent RF Front-ends
Automotive Radar and Prospective Circuit/Antenna Technologies —
From Car Collision Avoidance to Autonomous Driving
Microwave Component Design Using Space Mapping Methodologies
Ultrahigh Speed Microwave and Photonic Devices and Systems: How Will They Be Tested?
Wide Bandgap Technologies: Applications, Devices and Circuit Issues
Advances in Ceramic Interconnect Technologies for Wireless, Microwave and Photonic Applications
Introducing New Concepts in Nonlinear Network Design
EM-based CAD and Optimization of Waveguide Components, Planar Circuits and Antennas
Passive Components for RF Applications
Spectrum Management Issues
Advances in RF MEMS Technology
Microwave Photonics for Medical Imaging
Wireless Microsensors: Technology and Applications
Microwave and Lightwave System Architectures, Signal Processing, Limitations and Noise
Modeling of RF MEMS Switches
Differential Device Characterization and Modeling
Cryogenic and Superconductor Microwave Subsystems
Evolution of the Photonic Antenna
Optical Packaging Techniques Combining Optics and Electronics
Monday
Tuesday
Wednesday
Thursday
PM
PT
PW
PTH
12:00 PM–1:15 PM
12:00 PM–1:15 PM
12:00 PM–1:15 PM
12:00 PM–1:15 PM
Friday
June 7
Monday
June 3
Sunday
June 2
WORKSHOPS
PANEL SESSIONS
Tuesday
Wednesday
Thursday
9:00 AM–5:00 PM
9:00 AM–5:00 PM
9:00 AM–3:00 PM
Sunday
Monday
Tuesday
Wednesday
Wednesday
Thursday
7:00 PM –9:00 PM
6:00 PM–8:00 PM
5:30 PM–10:30 PM
6:00 PM–7:30 PM
7:30 PM–10:00 PM
12:00 PM–1:30 PM
RF CMOS in Cell Phones: Fact or Fiction
Is the Single Chip Radio Dead?
RF MEMS: Revolution or Evolution
Making Sense or Cents: Which WLAN Technology will Survive?
µAPS
SOCIAL EVENTS
RFIC Reception
Microwave Journal Reception
Tillicum Village
Industry Reception
Awards Banquet
GUEST PROGRAMS
Saturday
Sunday
Monday
Monday
Tuesday
Tuesday
Wednesday
Wednesday
Thursday
Thursday
Friday
Friday
GSA
GSB
GMB
GMC
GTD
GTE
GWF
GWG
GTHH
GTHI
GFJ
GFK
3:00 PM
7:30 AM–8:00 PM
8:00 AM–6:00 PM
9:00 AM–2:00 PM
12:30 PM–4:30 PM
9:00 AM–3:00 PM
8:30 AM–12:00 PM
9:00 AM–2:00 PM
9:30 AM–1:30 PM
12:30 PM–4:00 PM
6:30 AM–10:00 PM
7:30 AM–8:00 PM
Golf Tournament
Mt. Rainier Tour
Seattle City Highlights with Lunch at the Space Needle
Northwest Winery and Brewery Tour
Snoqualmie Falls, Steam Engine Train and Hedges Winery Tour
Seattle’s Museum Tour with Lunch in Pike Place market
Cruise the Locks and Seattle Harbor Tour with Lunch at Harborside Restaurant
Boeing Everett Plan t Tour
Victoria Overnight (Friday AM to Saturday PM) (escorted)
8
CONFERENCE HOUSING
2002 IEEE MTT-S INT’L
MICROWAVE SYMPOSIUM
JUNE 2–7, 2002
MTT-S
•
ATTENDEE
use code
MTTSATT502
SEATTLE, WA
• ARFTG • RFIC
Reservations may be made on-line, by phone, fax or mail and must be received by the Housing Bureau between January 2, 2002 and May 2, 2002.
Changes and cancellations should be made through the Housing Bureau until May 16, 2002 using one of these methods.
ON-LINE
PHONE
www.ims2002.org
Code: MTTSATT502
9 AM–8 PM EST Mon–Fri
888-877-0255
206-461-5881
FAX
MAIL
206-461-5853
MTT-S Housing Bureau
520 Pike Street, Suite 1300
Seattle, WA 98101
INSTRUCTIONS AND HOUSING BUREAU POLICY
1. Please print or type all data requested.
5. The deposit amount is $200. Checks should be made out to the MTT-S Housing Bureau. Hotels
2. An acknowledgment confirming the reservation will be sent after each reservation booking,
may charge credit card deposits after May 2, 2002. Cards must be valid through June 2002.
modification or cancellation. If you do not receive an acknowledgment via e-mail, fax or
6. Changes and cancellations should be made through the MTT-S Housing Bureau until May
mail within 14 days after any transaction, contact the Housing Bureau at 888-877-0255 or
16, 2002. Cancellations made on or after May 2, 2002 will be assessed a $25 processing fee.
206-461-5881. You will not receive a confirmation from the hotel.
Cancelled reservations that are guaranteed with a check will be assessed a $25 processing fee
3. All rates are per room per night and are subject to 15.6% tax (subject to change).
regardless of when they are cancelled. After May 16, 2002 additional hotel cancellation
4. Request room and bedding and indicate special requests in the section provided on the form.
policies may apply.
Specific room types will be assigned at check in. Please be advised that requests
7. Changes after May 16, 2002 must be made with your hotel.
are not guaranteed.
Requests for blocks of rooms without named occupants must be accompanied by this completed form and faxed to Susan Ranney at the MTT-S Housing Bureau, 206-461-5853, by April 11, 2002.
She may be reached directly by phone at 206-461-5894 or by e-mail at [email protected].
LISTED CONVENTION RATES ARE AVAILABLE ONLY FOR RESERVATIONS MADE BY MAY 2, 2002
HOTEL PREFERENCE
Hotel locations and rates are shown on the reverse side of this form. Please show three choices.
First choice
________________________________ Second choice________________________________________ Third choice _________________________________________
If hotel choices are unavailable, which is most important: Rate ______ or Location ______ (please select one)
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CARDHOLDER SIGNATURE *REQUIRED
CARD NO. ___________________________________________ EXP. DATE (Must be later than 6-30-2002) _____________________________________
ROOM OCCUPANTS
1. Print or type names of persons occupying each room. If more than three rooms are required,
attach a list providing the information requested below for each additional room.
2. Select room type desired, indicate arrival and departure dates, and special requests (not guaranteed).
Occupants (first name first)
ROOM
NO. 1
ROOM
NO. 2
ROOM
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Check one:
■ Single
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Arr. Date: ____________________
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9
HOTEL INFORMATION
Courtesy of Seattle Convention and Visitors Bureau
2002 IMS CONFERENCE HOTELS
LISTED CONVENTION RATES
ARE AVAILABLE ONLY FOR RESERVATIONS MADE BY
MAY 2, 2002
MAP NO.
HOTEL
SINGLE/DOUBLE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Sheraton Seattle Hotel
Westin Seattle Hotel
Elliott Grand Hyatt
W. Seattle Hotel
The Warwick Hotel
WestCoast Grand
Hilton Seattle Hotel
The Paramount Hotel
The Claremont Hotel
Summerfield Suites
Crowne Plaza Seattle
Renaissance Madison Hotel
Mayflower Park Hotel
The Roosevelt Hotel
Washington Athletic Club
$189
$199
$225
$189/209
$185
$170
$171
$169/179
$159
$159
$158
$157
$155
$143
$140
CHECK
WITH THE
HOUSING BUREAU
FOR TRIPLE OR QUADRUPLE OCCUPANCY RATES.
10
REGISTRATION
REQUIREMENTS
ON-SITE REGISTRATION FEES
Registration fees are required of all participants, including session chairs, authors, and workshop and panel session organizers
and speakers.
IEEE
NonMember Member
Int’l Microwave Symposium
ADVANCE REGISTRATION
All IMS Sessions
Reduced rates are offered for advanced registration when received by April 27, 2002. A registration form is available on
page 7 of this program. Each registrant must submit a separate
form, with payment, to the address shown at the bottom of the
registration form. If using a credit card, then fax and online registration is available. When mailing, please mail early to ensure
receipt by the deadline; otherwise, on-site fees will apply.
Individual remittance must accompany the registration form
and is payable in US dollars only using personal check drawn
on a US bank, traveler’s check, international money order or
credit card (MasterCard, VISA or American Express). Personal
checks must be encoded at the bottom with the bank number,
account number and check number. Bank drafts, wire transfers
and cash are unacceptable and will be returned. Government or
company purchase orders will not be accepted and will be returned.
(Includes IMS CD ROM and Digest.)
All IMS Sessions
$415
$600
$345
$530
$180
$260
$60
$80
$195
$65
$230
$260
$70
$300
Single Day
Student, Retiree, Life Member
RFIC Symposium
RFIC Reception Only
ARFTG Conference (Thur. & Fri)**
(Includes exhibits, Breakfast, Lunch, ARFTG Membership,
Digest and ARFTG Exhibition)
ARFTG Student/Retiree
$110
$110
Additional Digests and CD ROMs (on-site pickup only)
IMS Digest
$100
IMS CD ROM
$35
RFIC Digest
$50
ARFTG Digest**
$35
ARFTG Microwave Measurement Conf.
Digest Compilation**
$65
GUEST REGISTRATION
To preregister your guest, include his or her name on your
registration form. Guest badges will be included in the envelope
that you will receive upon check-in. On-site guest registration
also will be available.
$130
$45
$70
$60
$85
STUDENTS, RETIREES AND LIFE MEMBERS
Panel Session
$20
$20
Students, retirees and IEEE Life Members receive a substantial
discount on the IMS registration fee. Digests are not included.
To qualify as a student, a registrant must be either a student
member of IEEE or a full-time student carrying a course load of
at least nine credit hours. ARFTG also provides discounts for
students and retirees.
Awards Banquet (Wed. Evening)
$50
$50
Exhibits Only
$20
$20
Guest Programs (See page 66 for complete information.)
GSA:
GSB:
GMB:
GMC:
GTD:
GTE:
GWF:
GWG:
GTHH:
GTHI:
GFJ:
GFK:
PRESS REGISTRATION
Credentialed press representatives are welcome to register onsite only at the Exhibitor Counter, without cost and thereby
have access to technical sessions and exhibits. Digest are not
included.
ON-SITE REGISTRATION
On-site registration for all Microwave Week events will be
available at the Washington State Convention and Trade Center.
Registration hours are:
Saturday, June 1 2:00 PM–6:00 PM
Sunday, June 2 7:00 AM–6:00 PM
Monday, June 3 7:00 AM–5:00 PM
Tuesday, June 4 7:00 AM–5:00 PM
Wednesday, June 5 7:00 AM–5:00 PM
Thursday, June 6 7:00 AM–3:00 PM
Friday, June 7 7:00 AM–9:00 AM
Golf Tournament
Mt. Rainier Tour
Seattle Highlights w/Lunch
Northwest Winery/Brewery Tour
Snoqualmie Falls/Train Ride
Museum Tour w/Lunch
Harbor Cruise w/Lunch
Victoria Overnight (escorted)
$105
$115
$187
$168
$133
$163
$140
$158
$185
$140
$285
$115
Workshops
IEEE
Member
NonMember
Student/Retiree
Life Member
Full Day
Half Day
$145
$100
$190
$130
$110
$185
**ARFTG MEMBERS
USE
IEEE MEMBER PRICE
REFUND POLICY
ON-SITE WORKSHOP REGISTRATION
Refund requests received by April 27, 2002 will be honored,
but will be subject to a $25 service charge. For requests postmarked after this date, preregistrants will, in lieu of a refund, be
mailed any digests due. This policy applies to registrations for
guest programs and the awards banquet as well. Please state the
preregistrant’s name and provide a mailing address for the refund check. If the registration was paid by credit card, reimbursement will be through an account credit. Address your requests to: MTT-S Registration, 685 Canton St., Norwood, MA
02062.
On-site registration on Saturday and Sunday is available to
everyone. On-site registration for Friday’s workshops will be
available from 7:00 to 9:00 AM on Friday for those who have not
previously registered.
ON-SITE ARFTG REGISTRATION
Late on-site ARFTG registration will be available at the Washington State Convention and Trade Center on Friday from 7:00 to
9:00 AM. If at all possible, please preregister earlier in the week to
reduce the on-site workload.
11
Message from the RFIC General Chairman
2002 RFIC TECHNICAL PROGRAM
Welcome to the 2002 IEEE Radio Frequency Integrated Circuit (RFIC) Symposium, being held in Seattle, Washington at the Convention Center on June 2–4, 2002. The RFIC Symposium is the leading IEEE conference dedicated to the advancement of integrated circuits technologies for RF, wireless,
wireline, and broadband communications systems.
The Symposium opens on Sunday, June 2 with workshops
on RF circuits and architectures. On Sunday evening, there
will be a RFIC social hour and reception from 7–9 PM. The
technical program continues on Monday and Tuesday June
3–4, with technical sessions. The Technical Program Committee under the chairmanship of Dr. Natalino Camilleri has selected over 60 papers and several special sessions for presentation during 18 technical sessions and an interactive forum.
Sayfe Kiaei
The committee has also selected 16 invited papers covering
topics such as Multi-Band Transceiver Design, 3rd Generation and Wideband CDMA transceivers, RF power amplifiers, frequency generation, next generation front-end design, RF IC
packaging, RF IC passive components and high frequency device modeling. Monday will
include a lunchtime panel discussion on the topic of “RF-CMOS in Cell Phones: Fact or Fiction” with expert panelists from industry and academia.
The technical program is complemented by social activities to relax, meet peers, make
new friends and have informal technical discussions. The opportunity to meet informally
with colleagues has proven to be an important part of past RFIC symposia. The RFIC social
program includes the traditional reception held on Sunday evening, as well as the Microwave Journal Reception on Monday evening. On Tuesday, the RFIC Symposium attendees will also be able to attend the Plenary Session of the MTT-S Symposium and visit over
850 exhibit booths displaying a wide variety of RF and microwave products and services.
Once again, on behalf of the Steering Committee, we welcome you to the 2002 IEEE
RFIC Symposium in Seattle.
Sayfe Kiaei
General Chairman, 2002 IEEE RFIC Symposium
MO2A Cellular Transceivers — Room 6B
Chair: S. Lloyd, Conexant Systems Inc. • Co-chair: J.P. Mondal, Motorola
10:10 AM MO2A-1: Invited: Direct Conversion Transceiver Design for Mobile Phone
Systems – Issues, Status and Trends
Fazal Ali, Nokia Mobile Phones
10:30 AM MO2A-2: RF Local Oscillator Path for GSM Direct Conversion Transceiver
with True 50% Duty Cycle Divide by Three and Active Third Harmonic
Cancellation
R. Magoon, A. Molnar, Conexant Systems Inc.
10:50 AM MO2A-3: W-CDMA SiGe TX-IC with High Dynamic Range and High Power
Control Accuracy
H. Joba, Y. Takahashi, Y. Matsunami, K. Itoh, Mobile Communication Business Div.,
Mitsubishi Electric Corp.; S. Shinjo, N. Suematsu, D.S. Malhi, D. Wang, K. Schelkle, P. Bacon
11:10 AM MO2A-4: A Direct-conversion W-CDMA Front-end SiGe Receiver Chip
D.Y.C. Lie, J. Kennedy, D. Livezey, B. Yang, T. Robinson, N. Sornin, T. Beukema, L.E. Larson,
A. Senior, C. Saint, J. Blonski, N. Swanberg, P. Pawlowski, D. Gonya, X. Yuan, H. Zamat,
N. Sornin, IBM LaGaude Design Center, LaGaude, France
11:30 AM MO2A-5: Invited: Highly Integrated, Dual Band/Tri-mode SiGe Bi-CMOS
Transmitter IC for CDMA Mobile Phone Applications
M. Reddy, Conexant Systems,
MO2B Efficiency Enhancement Techniques for Handset Applications — Room 6A
Chair: T. Quach, Motorola Inc. • Co-chair: D. Ngo, RFMD
10:10 AM MO2B-1: Invited: Efficiency Improvement Techniques for Linear CDMA
and WCDMA Power Amplifiers
T. Fowler, Conexant Systems
10:30 AM MO2B-2: Invited: An Overview of Efficiency Enhancements with Applications
to Linear Handset Power Amplifiers
J. Staudinger, Motorola
10:50 AM MO2B-3: Invited: Switched-mode Tuned High-efficiency Power Amplifiers:
Historical Aspect and Future Prospect
A. Grebennikov, M/A-COM Eurotec Operations
11:10 AM MO2B-4: A Broadband Monolithic S-band Class-E Power Amplifier
R. Tayrani, Raytheon Electronic Systems
11:30 AM MO2B-5: Paper Withdrawn
MO2C Integrated VCO — Rooms 602/03/04
Chair: J. Lin, Agere Systems • Co-chair: N. Camilleri, RF & Wireless Design Service
10:10 AM MO2C-1: Invited: 1/F Noise of NMOS and PMOS Transistors and Their
Implications to Design of Voltage Controlled Oscillators
K. O, Univ. of Florida
10:30 AM MO2C-2: Student Paper: A 900 MHz Low Phase Noise CMOS Quadrature
Oscillator
J. Cabanillas, J.M. Lûpez-Villegas, Dept. d’Electrúnica (SIC), Univ. of Barcelona, Barcelona,
Spain; L. Dussopt, G.M. Rebeiz, EECS Dept., The Univ. of Michigan, Ann Arbor, Michigan
10:50 AM MO2C-3: A 0.18 µm CMOS 2.45 GHz Low-power Quadrature VCO
with 15 Percent Tuning Range
D.M.W. Leenaerts, C. Dijkmans, Philips Research Labs; M. Thompson, S3, Dublin, Ireland
11:10 AM MO2C-4: A 1.8 V 6–9 GHz Switchable Dual-band Quadrature LC VCO in SiGe
BiCMOS Technology
H.Shin, Z.Xu, M.F. Chang, Univ. of California, Los Angeles
11:30 AM MO2C-5: Student Paper: A 1 V 3.8-5.7 GHz Differentially-tuned VCO in SOI CMOS
N. Fong, C. Plett, G. Tarr, Dept. of Electronics, Carleton Univ.; J-O. Plouchart, D. Liu, IBM T.J.
Watson Research Center; N. Zamdmer, L. Wagner, IBM Microelectronics Semiconductor
Research and Development Center
MO2D Optical System ICs — Room 606/07
Chair: K. Kobayashi, Sirenza Microdevices • Co-chair: J. Ou, Intel
10:10 AM MO2D-1: Invited: Design of High-speed Fiber-optic Datalinks
T. Mader, Intel
10:40 AM MO2D-2: A 37–50 GHz InP HBT VCO IC for OC-768 Fiber Optic
Communication Applications
L. Zhang, R. Pullela, C. Winczewski, J. Chow, Gtran Inc., Newbury Park; D. Mensa,
S. Jaganathan, R. Yu
10:50 AM MO2D-3: Student Paper: Amplifier Array for 12 Parallel 10 Gb/S
Optical-fiber Links Fabricated in a SiGe Production Technology
A. Schild, H.-M. Rein, J. Mullrich, L. Altenhain, Ruhr-Univ. Bochum, Bochum, Germany;
J. Blank, K. Schrodinger, Infineon Technologies AG, Fiber Optics, Berlin, Germany
11:10 AM MO2D-4: Front-end CMOS Chipset for 10 Gb/s Communication
A.K. Petersen, K. Kiziloglu, T. Yoon, F. Williams, M.R. Sandor, Intel Corp.
11:30 AM MO2D-5: Application of Quasi-static Method of Moments for the Design
of OC-192 and OC-768 Fiber Optic Integrated Circuits
C-W.P. Huang, J-W. Bao, N. Dwarakanath, S. Al-Kuran, Anadigics Inc., Warren, New Jersey
MO3A Wireless Data System ICs — Room 6B
Chair: W.B. Kuhn, Kansas State Univ. • Co-chair: A. Jerng, DSP Group
1:20 PM MO3A-1: Invited: CMOS Components for 802.11b Wireless LAN Applications
K. O, Univ. of Florida
1:40 PM MO3A-2: Student Paper: A 3V, 0.35 µm CMOS Bluetooth Receiver IC
W. Sheng, B. Xia, A. Emira, C. Xin, A.Y. Valero-Lopez, S.T. Moon, E. Sanchez-Sinencio,
Analog & Mixed Signal Center, Dept. EE, Texas A&M Univ.
2:00 PM MO3A-3: Integrated CMOS Transceivers Using Single-conversion Standard IF
or Low IF RX for Digital Narrowband Cordless Systems
A. Jerng, A. Truong, D. Wolday, E. Unruh, E. Landi, L. Wong, R. Fried, S. Gibbons, DSP Group
2:20 PM MO3A-4: A Highly Integrated, Versatile GPS Receiver for E911 Applications
L.J. Wilz, T.J. Shie, J.P. Young, Conexant Systems Inc.; T. Hancock, Univ. of Michigan EE Dept.
RFIC STEERING COMMITTEE
Sayfe Kiaei, General Chair
Natalino Camilleri, TPC Chair
Kirk Ashby, Finance
Luciano Boglione, Publicity
Stephen Lloyd, Transactions
Eric Maass, Special Sessions
Tina Quach, Secretary
Joe Staudinger, Digest
Takao Inoue, Web Master
Advisory Board
Fazal Ali
Eliot Cohen
Reynold Kagiwada
Christian Kermarrec
Mahesh Kumar
Louis Liu
David Lovelace
Vijay Nair
RFIC TECHNICAL PROGRAM COMMITTEE
Luciano Boglione, Agilent Technologies
Kirk Ashby, Microtune
Natalino Camilleri, RF & Wireless Design Services
Glen Chang, Silicon Wave
Thomas Cho, Wireless Interface Technologies
Yann Deval, Laboratoire IXL
Sherif Embabi, TI
Fazal Ali, Nokia Mobile Phones
Aditya Gupta, Anadigics
Stefan Heinen, Infineon Technologies
Albert Jerng, DSP Group
Reynold Kagiwada, TRW
Andrew Karanicolas, Maxim
Sayfe Kiaei, Arizona State University
Kevin Kobayashi, Stanford Microdevices
Mahesh Kumar, Lockheed Martin
Bill Kuhn, Kansas State University
Jenshan Lin, Agere
Louis Liu, TRW
Stephen Lloyd, Conexant Systems
David Lovelace, Gain Technology
Jyoti Mondal, Motorola
Patrick Murphy, University College
Vijay Nair, Motorola
David Ngo, RFMD
Dan Nobbe, Peregrine Semiconductor
Jeffrey Ou, Intel
Allen Podell, Besser Assoc.
Tina Quach, Motorola
Eli Reese, Triquint
Joe Staudinger, Motorola
Noriharu Suematsu, Mitsubishi Electric Corp.
Bruce Thompson, Motorola
Alan Westwick, Silicon Laboratories
Bernard Xavier, National
12
2:40 PM
3:50 PM
MO3A-5: A SiGe Transceiver Chipset for 100 Mbps/1 bps Digital
Communication Over Cable System
A. Alexanian, M. Wu, A. Burgess, W. Ye, X. Zhang, Narad Networks Inc.
MO3B LNAs, Mixers and Switches — Room 6A
Chair: Y. Deval, IXL • Co-chair: D. Nobbe, Peregrine Semiconductor
1:20 PM MO3B-1: Student Paper: Automatic Synthesis of a 2.1 GHz SiGe Low Noise
Amplifier
G. Zhang, L.R. Carley, Carnegie Mellon Univ. Electrical & Computer Engineering Dept.;
A. Dengi, Neolinear Inc.
1:40 PM MO3B-2: Highly Linear SiGe BiCMOS LNA and Mixer for Cellular CDMA/Amps
Applications
V. Aparin, E. Zeisel, P. Gazzerro, QUALCOMM Inc.
2:00 PM MO3B-3: An Even Harmonic Type Direct Conversion SiGe-MMIC Receiver
for W-CDMA Mobile Terminal
E. Taniguchi, M. Shimozawa, N. Suematsu, T. Takagi, O. Ishida, Information Technology
R&D Center, Mitsubishi Electric Corp.; T. Ikushima, K. Sadahiro, T. Katsura, K. Maeda,
K. Itoh, Mobile Communication Business Div., Mitsubishi Electric Corp.
2:20 PM MO3B-4: A 2.6 V GSM/PCN Dual Band Variable Gain Low Noise RF Down
Conversion Mixer
B. Kim, K-S. Nah, T-W. Ahn, H-I. Lee, J-K. Cho, B-H. Par, RF Products Team, Samsung
Electronics Co. Ltd.
2:40 PM MO3B-5: A +2.4/0 V Controlled High Power GaAs SPDT Antenna Switch IC
for GSM Application
K. Numata, Y. Takahashi, T. Maeda, H. Hida, Photonic and Wireless Device Research Lab,
NEC Corp.
MO3C High Frequency Receiver and Converter Technology — Room 602/03/04
Chair: M. Kumar, Lockheed Martin • Co-chair: E. Reese, TriQuint Semiconductor
1:20 PM MO3C-1: A 2–18 GHz Wideband High Dynamic Range Receiver MMIC
D.C. Bannister, C.A. Zelley, A.R. Barnes, QinetiQ Ltd, UK
1:40 PM MO3C-2: A 3–33 GHz PHEMT MMIC Distributed Drain Mixer
K-L. Den, H. Wang, Graduate Institute of Communication Engineering, National Taiwan
Univ.
2:00 PM MO3C-3: Student Paper: Ka-band Direct Digital Receiver Using 0.25 µm GaAs
pHEMTs
S.O. Tatu, E. Moldovan, Centre de Recherches Avancees en Micro-ondes et en Electronique
Spatiale (Poly-Grames) Departament de genie Electrique, Ecole Polytechnique de Montreal
CAN; G. Brehm, Tri; K. Wu, R.G. Bosisio
2:20 PM MO3C-4: A Single-chip 24 GHz Receiver Front-end Using a Commercially
Available SiGe HBT Foundry Process
E. Soenmez, A. Trasser, K.-B. Schad, P. Abele, H. Schumacher, Univ. of Ulm, Dept. of Electron
Devices and Circuits
MO3D PLL and Frequency Synthesizer — Room 606/07
Chair: J. Lin, Agere Systems • Co-chair: N. Camilleri, RF & Wireless Design Serv
1:20 PM MO3D-1: Low Power, High Speed PLL Fabricated in UTSI Process
G.C. Wu, D. Kelly, Peregrine Semiconductor Corp., San Diego, CA
1:40 PM MO3D-2: Student Paper: A 2V, 2.3/4.6 GHz Dual-band CMOS Frequency
Synthesizer
W-Z. Chen, J-X. Chang, Y-J. Hong, M-T. Wong, C-L. Kuo, Dept. of Electrical Engineering,
National Central Univ.
2:00 PM MO3D-3: Student Paper: A Low Jitter 5.3-GHz 0.18-µm CMOS PLL Based
Frequency Synthesizer
S.A. Ali, PhD Student, F. Jain, Univ. of Connecticut, Dept. of Electrical and Computer
Engineering, Storrs, CT
2:20 PM MO3D-4: Student Paper: Design Considerations in a BiCMOS Dual-modulus
Prescaler
F. Dulger, E. Sanchez-Sinencio, Texas A&M Univ. Dept. of Electrical Engineering;
A. Bellaouar, Texas Instruments Inc.
2:40 PM MO3D-5: Student Paper: Time Delay Considerations in High-frequency
Phase-locked Loops
R. A. York, Univ. of California, Santa Barbara ECE Dept.
MO4A 3G Cellular Systems & Chip Sets — Room 6B
Chair: F. Ali, Nokia Mobile Phones • Co-chair: J. Mondal, Motorola
3:30 PM MO4A-1: Invited: The MSM5100 CDMA2000 + Amps + Gpsone + Bluetooth
Multimode ASCI For 3G Handsets
Brian Butler, QUALCOMM CDMA Technologies
3:50 PM MO4A-2: A Reconfigurable Receiver Architecture for 3G Mobiles
B.J. Minnis, P.A. Moore, Philips Research Labs
4:10 PM MO4A-3: A Highly Integrated 0.25 µm BiCMOS Chipset For 3G UMTS/WCDMA
Handset RF Subsystem
D. Brunel, C. Caron, C. Cordier, E. Soudée, Philips Semiconductors
4:30 PM MO4A-4: A CMOS Transmit/Receive IF Chip-set for WCDMA Mobiles
U. Dasgupta, W.G. Yeoh, C.G. Tan, S.J. Wong, R. Singh, Institute of Microelectronics,
Singapore; H. Mori, Oki Electric Industry, Japan; M. Itoh, Oki Techno Centre, Singapore
4:50 PM MO4A-5: Invited: 4G RF Systems On-chip or On-module?
D. Belot, ST Microelectronics
MO4B Low Noise Amplifiers — Room 6A
Chair: D. Nobbe, Peregrine Semiconductor • Co-chair: Y. Deval, IXL
3:30 PM MO4B-1: Student Paper: Gain Controllable Very Low Voltage (< 1 V) 8–9 GHz
Integrated CMOS LNAs
T.K.K. Tsang, M.N. El-Gamal, Microelectronics and Computer Systems Lab, McGill Univ.
MO4B-2: Step Gain Amplifier with Impedance Unchanged in Gain Control
M. Tanabe, T. Fukuda, K. Nishii, Semiconductor Devices Research Center, Corporate
Manufacturing & Development Div., Semiconductor Co., Matsushita Electric Ind. Co. Ltd.
4:10 PM MO4B-3: Enhancement Mode pHEMT Low Noise Amplifier with LNA Linearity
Control (IP3) And Mitigated Bypass Switch
S. Kumar, M. Vice, H. Morkner, L. Wayne, Agilent Technologies, WSD R&D
4:30 PM MO4B-4: Student Paper: Low Noise, High Linearity, Wide Bandwidth Amplifier
Using a 0.35 µm SiGe BiCMOS For WLAN Applications.
J.Sadowy, LAAS CNRS 7, Av du Colonel Roche, France and STMicroelectronics, Cedex France;
V.Le-Goascoz, I.Telliez, STMicroelectronic; J.Graffeuil, E.Tournier, L. Escotte, R. Plana
4:50 PM MO4B-5: A 5.8 GHz Two-stage High-linearity Low-voltage Low Noise
Amplifier in A 0.35-µm CMOS Technology
R-C. Liu, C-R. Lee, H. Wang, C-K. Wang, Dept. of EE, National Taiwan Univ.
MO4C Very High Speed Si and SiGe Divider ICs — Room 602/03/04
Chair: E. Reese, TriQuint Semiconductor • Co-chair: M. Kumar, Lockheed Martin
3:30 PM MO4C-1: A 14.5 GHz – 0.35 µm Frequency Divider for Dual-modulus
Prescaler
E. Tournier, J. Graffeuil, LAAS/CNRS and Univ; P. Sabatier, Cedex 4, France; M. Sié,
LAAS/CNRS and ST Microelectronics, Cedex, France
3:50 PM MO4C-2: A 19 GHz High Sensitivity Static 2:1 Frequency Divider in 120 Nm
CMOS
H.-D. Wohlmuth, D. Kehrer, W. Simbuerger, INFINEON Technologies AG, CPR HF
4:10 PM MO4C-3: A Low-power 20 GHz Static Frequency Divider with Programmable
Input Sensitivity
M. Apostolidou, Philips Research Laboratories
4:30 PM MO4C-4: 36 GHz Dual-modulus Prescaler In SiGe Bipolar Technology
H. Knapp, M. Wurzer, G. Ritzberger, Infineon Technologies, Corporate Research; J. Boeck,
T.F. Meister, K. Aufinger, Infineon Technologies, Wireless Products
MO4D Power Amplifiers for Handset Applications — Room 606/07
Chair: T. Quach, Motorola Inc. • Co-chair: N. Suematsu, Mitsubishi Electronic Corp.
3:30 PM MO4D-1: A GSM/Edge Dual-mode, 900/1800/1900 MHz Triple-band HBT
MMIC Power Amplifier Module
K. Yamamoto, RFIP Group, System LSI Dev. Ctr., Mitsubishi Electric Corp.; T. Asada,
S. Suzuki, T. Miura, A. Inoue, S. Miyakuni, J. Otsuji, R. Hattori, Y. Miyazaki, T. Shimura,
High Frequency
3:50 PM MO4D-2: A 20 mA Quiescent Current CV/CC Parallel Operation HBT Power
Amplifier for W-CDMA Terminals
S. Shinjo, K. Mori, H. Ueda, T. Takagi, N. Suematsu, Mitsubishi Electric Corp. Information
Technology R&D Center; A. Ohta, H. Seki, Mitsubishi Electric Corp. High Freq. & Opt.
Semiconductor Business Div.
4:10 PM MO4D-3: Paper Withdrawn
4:30 PM MO4D-4: Student Paper: A New Active “Predistortor with High Gain Using
Cascode-FET Structures”
M.S. Jeon, J. Kim, Y. Kwon, School of Electrical Engineering, Seoul National Univ., Seoul,
Korea; H. Kang, S. Jung, J. Lee, WAVICS Co., Ltd., Telson Venture B/D, 949-3, Dogok-dong,
Seoul, 135-270, Korea
4:50 PM MO4D-5: Integrated Distributed Amplifier with Passive-free Input Driver
B. Stengel, Motorola Inc., Motorola Labs; B. Thompson, Motorola Inc., Wireless Integration
Technology Center
TU2A Special Session on Radio Frequency Integrated Circuits for 3G — Room 608/09
Joint RFIC/IMS Session
Chair: R. Weigel, Univ. of Linz, Austria • Co-chair: C.C.W. Ruppel, EPCOS AG
10:10 AM TU2A-1: Invited: Integrated Even Harmonic Type Direct Conversion Receiver
for W-CDMA Mobile Terminals
K. Itoh, T. Yamaguchi, T. Katsura, K. Sadahiro, T. Ikushima, R. Hayashi, F. Ishizu, Mobile
Communication Business Division, Mitsubishi Electric Corp., E. Taniguchi, T. Nishino,
M. Shimozawa
10:40 AM TU2A-2: Invited: An Analog Baseband Chain for a UMTs Zero-IF Receiver
in a 75 GHz SiGe BiCMOs Technology
W. Schelmbauer, J.K. University of Linz; H. Pretl, DICE Linz; L. Maurer, INIT Linz; B. Adler, J.
Fenk, Infineon Munich; R. Weigel, INIT Linz, DICE Linz; R. Hagelauer, RIIC Linz, DICE Linz
11:10 AM TU2A-3: Invited: A 2 GHz RF Front-end Transceiver Chipset in CMOS
Technology For PCS and IMT-2000 Applications
Y-S. Youn, N-S. Kim, J-H. Chang, H-K. Yu, J-K. Kwon, K-S. Kim, Electronics
and Telecommunications Research Institute (ETRI)
11:30 AM TU2A-4: Invited: System Analysis of a W-CDMA Base-station PA Employing
Adaptive Digital Predistortion
C. Potter, Wireless & Multimedia Design Group, Tality UK Ltd
TU2B MMIC Technology — Room 606/07
Chair: A. Madjar, Rafael • Co-chair: T. Lee, Boeing Satellite System
10:10 AM TU2B-1: Paper Withdrawn
10:30 AM TU2B-2: Ku-band MMICs in Low-cost, SMT Compatible Packages
H.C. Huang, A. Ezzeddine, A. Darwish, B. Hsu, AMCOM Communication Inc.
10:50 AM TU2B-3: ESD Protection of RF Circuits in Standard CMOS Process
K. Higashi, A. O. Adan, M. Fukumi, M. Hayashi, Design Technology Dev. Center, IC Dev.
Group, Sharp Corp.; N. Tanba, T. Yoshimasu, Analog IC Div., IC Group, Sharp Corp.
11:10 AM TU2B-4: Novel BICMOS Compatible, Short Channel LDMOS Technology
for Medium Voltage RF and Power Applications
A. Litwin, Ericsson Microelectronic; O. Bengtsson, Swedish Linear Microwave; J. Olsson,
Uppsala Univ.
13
11:20 AM TU2B-5: Electromagnetic Coupling Effects in RF-CMOS Circuits
A.O. Adan, M. Fukumi, K. Higashi, M. Hayashi, IC Development Group, Sharp Corp.;
T. Suyama, M. Miyamoto, Advanced Research Labs., Sharp Corp.
11:30 AM TU2B-6: Ultra Low Power VCO Based on InP-HEMT and Heterojunction
Interband Tunnel Diode for Wireless Application
A. Cidronali, G. Collodi, M. Camprini, G. Manes, Dept. Electronics and Telecommunications,
Univ. of Florence; V. Nair, J. Lewis, H. Goronkin, PSRL, Motorola Labs.
TU3A Silicon Substrate and Inductor Modeling — Room 608/09
Chair: A. Gupta, Anadigics • Co-chair: A. Westwick, Silicon Laboratories
1:20 PM TU3A-1: Invited: Modeling of Passive Elements with Asitic
A. Niknejad, UC Berkeley
1:40 PM TU3A-2: Modeling of Frequency Dependent Losses in Two-port
and Three-port Inductors on Silicon
T. Kamgaing, T. Myers, Mel Miller, Motorola Inc., Semiconductor Product Sector, Tempe, AZ
2:00 PM TU3A-3: Characterization and Modeling of On-chip Inductor Substrate
Coupling Effect
C-J. Chao, M-J. Chen, Institute of Electronics Engineering, National Chiao-Tung Univ.,
Taiwan, ROC; S-C. Wong, Acer Labs Inc., Taipei, Taiwan, ROC; C-J. Hsu, L-Y. Leu, Winbond
2:20 PM TU3A-4: Characterization and Modeling of Small-signal Substrate Resistance
Effect In RF CMOS
Y-S. Lin, T-H. Lee, H-B. Liang, National Chi-Nan Univ. Electrical Engineering Dept.; S-S. Lu,
National Taiwan Univ. Electrical Engineering Dept.
2:40 PM TU3A-5: A New Method for the Computation of the Substrate Parasitics
of Octagonal Inductors
W. Tatinian, Modeling Ingeneer Alcatel Microelectronics, PhD Student L2MP; P. Pannier,
Maitre de Conferences, Ecole Polytechnique Universitaire de Marseille; R. Gillon, Competence
Leader Modeling and Characterisation Alcatel Microele
TU3B SiGe RFIC Process Technologies — Room 606/07
Chair: K. Ashby, Microtune Inc. • Co-chair: B. Xavier, National Semiconductor
1:20 PM TU3B-1: Invited: Review of SiGe BiCMOS Process Technology and Its Impact
on RFIC Design
null, Motorola
1:40 PM TU3B-2: Invited: High Performance Circuits in 0.18 µm SiGe BiCMOS Process
P. Ye, Conexant Systems
2:00 PM TU3B-3: Student Paper: Low Frequency Noise Figures of Merit in RF SiGe HBT
Technology
J. Tang, G.F. Niu, Z. Jin, J.D. Cressler, S. Zhang, Auburn Univ. Electrical and Computer
Engineering Dept.; A.J. Joseph, D.L. Harame, IBM Microelectronics
2:20 PM TU3B-4: Com2 Enhanced Graded Base SiGe Technology for High Speed
Applications
T. Ivanov, M. Carroll, S. Moinian, M. Mastrapasqua, M. Frei, A. Chen, C. King, A. Hamad,
E. Martin, S. Shive, T. Esry, C. Lee, R. Johnson, T. Sorsch, M. S. Carroll, K. Banoo, P. Smith,
L. Bizzarro, W. Cochran, Agere Systems, Murray
2:40 PM
TU3B-5: Advanced Passive Devices for Enhanced Integrated RF Circuit
Performance
D. Coolbaugh, E. Eshun, D. Harame, J. Johnson, M. Hammad, Z. He, V. Ramachandran,
S. St Onge, K. Watson, IBM Corp, Essex Junction, VT; R. Groves, K. Stein, S. Subbanna,
R. Volant, IBM Corp, Hopewell; D. Wang, X. Wang
TU4A Active Device Modeling and Characterization — Room 608/09
Chair: J. Staudinger, Motorola • Co-chair: P. Murphy, Univ. College Cork
3:30 PM TU4A-1: Invited: Robust High Voltage SiLDMOS Model Extraction Process to
Achieve First Pass Linear RFIC Amplifier Designs
J. Pla, Motorola
3:50 PM TU4A-2: Student Paper: Large-signal Modeling of GaN FET and Nonlinearity
Analysis Using Volterra Series
S.S. Islam, A.F.M. Anwar, Univ. of Connecticut, Dept. of Electrical and Computer Engineering
4:10 PM TU4A-3: Direct Parameter Extraction on RF-CMOS
F.X. Pengg, CSEM Swiss Center for Electronics and Microtechnology Inc.
4:30 PM TU4A-4: Student Paper: Low Frequency Noise Characterization and Modeling
of Microwave Bipolar Devices: Application to the Design of Low Phase Noise
Oscillator
L. Bary, G. Cibiel, J. Rayssac, A. Rennane, O. Llopis, R. Plana, J. Graffeuil, Laboratory
for Analysis and Architecture of Systems, Toulouse, France; M. Regis, SiGe Semiconductor,
Ottawa, Ontario CAN; M. Borgarino, Univ. of
4:50 PM TU4A-5: Linearity Analysis of CMOS for RF Application
S. Kan, B. Cho, B. Kim, Pohang Univ. of Science and Technology Electronic and Electrical
Engineering Dept.
TU4B RFIC Power Amplifier Technologies — Room 606/07
Chair: B. Xavier, National Semiconductor • Co-chair: K. Ashby, Microtune Inc.
3:30 PM TU4B-1: Invited: RF Power Semiconductor Devices for Portable
Communications
C. Weitzel, Motorola, MS EL720
3:50 PM TU4B-2: SiGe/Si Power HBTS for X- to K-band Applications
S. Mohammadi, Z. Ma, J. Park, P. Bhattacharya, L.P.B. Katehi, Univ. of Michigan, EECS Dept.;
G.E. Ponchak, S.A. Alterovitz, NASA Glen Research Center; K.M. Strohm, J-F. Luy
4:10 PM TU4B-3: RF Power Characteristics of SiGe Heterojunction Bipolar Transistor
with High Breakdown Voltage Structures
T. Matsuno, Semiconductor Device Research Center, Semiconductor Co., Matsushita Electric
Industrial Co., Ltd.; K. Nishii, Semiconductor Device Research Center, Sem; S. Sonetaka,
Y. Toyoda, N. Iwamoto
4:30 PM TU4B-4: Design Techniques for Improved Performance of Small Outline
Packages
L.E. Larson, Univ. of California, San Diego; D. Jessie, Univ. of California, San Diego
and QUALCOMM
4:50 PM TU4B-5: Spiral Inductor Performance in Deep-submicron, Bulk CMOS
with Copper Interconnects
W.B. Kuhn, A.W. Orsborn, M.C. Peterson, S.R. Kythakyapuzha, A.I. Hussein, J. Zhang, J. Li,
E.A. Shumaker, N.C. Nair, Kansas State Univ., Manhattan, KS
NOTES
14
These tutorials are targeted for people who are new to microwave design or new to specific technical areas.
Each is a full-day format, starting with basics to help you “impedance match” into the topic and help you
understand papers on these topics later in Microwave Week.
3-D structures using the extension of 2-D IC process. MEMS technology
can be used to fabricate and integrate RF 3-D structures including high
Q passives, tunable passives, switches, and resonators on a chip. Hence
MEMS has become one of the enabling technologies for the development
of lighter weight and lower cost miniature RF systems by providing
low-cost batch manufacturing, miniaturization and monolithic integration with IC process. The objective of the proposed half-day short course
is to give a fundamental introduction of various aspects of the MEMS
technology, and its applications for RF systems and ICs. The workshop
includes an overview of MEMS applications, design, prototyping, fabrication processes, monolithic integration with ICs, and packaging and reliability issues. It also covers existing and potential MEMS devices for
RF applications such as high-Q self-inductors, tunable capacitors, RF
switches, micro/nano micro-electro-mechanical resonators, and reconfigurable impedance matching networks. Four sessions for total time of
~7.5 hours will be conducted each by one of the four speakers.
TSA: RF CIRCUIT FUNDAMENTALS
Date & Time:
Sunday, June 2; 8:00 AM to 5:00 PM
Location:
Washington State Convention & Trade Center
Topics & Speakers:
✗ RF Circuit Fundamentals, Les Besser, Besser Associates
Organizer:
Les Besser, Besser Associates
You will get a quick overview of passive and active RF circuit design.
We emphasize practical real-life components, circuits and design procedures. Traveling-wave based scattering (s-) parameters replace traditional
voltage and current measurements in characterizing RF circuit and system components. Graphical (Smith Chart) techniques are introduced to
simplify the complex algebra required for RF design.
The importance of impedance matching is stressed, and simple methods are introduced to eliminate mismatch among various RF system
components. We also examine the upper frequency limit of lumped
equivalent circuits in modeling RF component behavior, and use distributed (transmission-line) elements for the higher microwave frequencies.
Although the course focuses on discrete “unbalanced” RF components
and techniques, we also present a recently developed design/measurement methodology called “mixed-mode s-parameter technique.” This
topic will be helpful to those working with RFICs as well as balanced
circuits and components.
Since circuit layout is a critical factor in RF performance, the course
concludes with layout considerations, pointing out design rules and
common mistakes. We also look at various PC board materials and discuss their limitations for RF circuits.
Throughout the course, we show illustrative examples via interactive
video projection, using state-of-the-art CAD.
TSC: EM SIMULATORS: THEORY AND PRACTICE
Location:
Location:
✗ Daniel G. Swanson, Jr., Bartley R.F. Systems
✗ Wolfgang J.R. Hoefer, University of Victoria
Organizers:
Daniel G. Swanson, Jr., Bartley R.F. Systems
Wolfgang J.R. Hoefer, University of Victoria
Sponsor:
MTT-15 Microwave Field Theory
The proliferation of computer tools for microwave analysis, design and
optimization is having a profound effect on the working environment of
microwave engineers. While most practitioners can use such tools after a
certain period of training, many remain skeptical as to the trustworthiness of numerical results and hesitate about the limits, errors, and significance of the data generated. The key is to understand what goes on inside these tools and how they solve electromagnetic fields.
The purpose of this tutorial is a) to provide insight into the operating
principles of electromagnetic simulators, and b) to show how these translate into their properties as engineering tools.
The characteristics of frequency- and time domain simulators based
on finite element, finite difference and method of moment formulations
will be presented in terms accessible to the practitioner, and the resulting performance profiles of simulators based on these methods will be
demonstrated. This includes the pre- and post-processing steps that relate geometry and material data with field information and microwave
characteristics. Special emphasis will be on convergence, error control
and validation using basic calibration elements. By solving a canonical
set of structures whose properties are accurately known, the key aspects
of the various methods and simulator types will be demonstrated. In this
way, a solid foundation for user confidence and good technical judgement will be laid in a systematic manner.
The tutorial will benefit a) Microwave engineers familiar with linear
and non-linear CAD who would like to learn more about field solvers, b)
Experienced users of electromagnetic simulators who seek a better understanding of their theoretical and computational foundations, c) Researchers familiar with computational electromagnetics who would like
to learn more about the requirements, concerns and methodology of microwave practitioners.
Specific commercial tools will only be mentioned or used for the purpose of providing typical examples. This in no way implies a commercial
endorsement by the speakers.
Topics & Speakers:
✗ MEMS Overview, Applications, Technology, John McKillop,
JDS Uniphase Corp.
✗ High-Q RF MEMS Passives and RF Switches, Navid Yazdi,
Arizona State University
✗ MEMS/NEMS Resonators for RFIC Applications, Sanjay Raman,
Virginia Polytechnic Institute and State University
✗ Tunable Networks Using RF-MEMS Switches, N. Scott Barker,
University of Virginia
Organizers:
Topics & Speakers:
TSB: MEMS TECHNOLOGY FOR HIGHLY INTEGRATED RF SYSTEMS
Date & Time:
Date & Time:
Navid Yazdi, Arizona State University
John McKillop, JDS Uniphase Corp.
Recent advances of RF integrated circuit technology have enabled
higher integration, and hence the development of low-cost miniature
wireless and high-speed data communication systems. However integrated circuits often require additional discrete passive components including capacitors, inductors, switches, resonators, and impedance matching
networks that cannot be integrated with the conventional RFIC fabrication technology due to performance or structural limitations. These discrete devices increase the overall system component count, size, and cost
significantly. For instance they occupy 25–40% of a current transceiver
board area. Micromachining and micro-electro-mechanical-systems
(MEMS) processes are emerging technologies that enable fabrication of
15
SUNDAY
SUNDAY TUTORIALS
SUNDAY
SUNDAY WORKSHOPS
dors are either delaying tape-outs, planning re-spins, or counting on extra
“glue” chips to accommodate this ever-evolving standard. Fully integrated
40Gbps transponder modules, similar to those employed at 10 Gbit/s, will
also be the focus of many companies efforts.
The design of 40 Gbps ICs are being approached from two different
directions. LSI analog and digital design techniques are being pushed to
higher frequencies, while microwave design methods are being extended
to include time-domain issues like group delay and timing skew. Field
simulators are being employed to address layout and packaging issues,
which will make or break 40 Gbps designs.
The aim of this workshop is to review the latest architectures being
considered for 40 Gbit/s transmit and receive systems, discuss the extensive IC development addressing this area, and debate the technology requirements for compact integration of these components. Due to the
competitive nature of this industry, there will inevitably be some proprietary details and design tricks that the speakers cannot reveal. Nevertheless, the speakers are expected to educate and inform the audience, rather
than simply market their ICs.
The workshop will conclude with a panel session in which the speakers discuss future directions, including 80 and 160 Gbps, higher levels
of integration, advanced packaging, and cost reduction.
WSA: DEVELOPMENTS IN INTEGRATED CIRCUITS
FOR COMMUNICATIONS AT 40GB/S AND BEYOND
Date & Time:
Location:
Topics and Speakers:
✗ A service provider’s view of 40 Gbit/s, Martin Birk, AT&T Labs
✗ Integrated Circuits for 40 Gb/s Applications, Eli Reese,
Triquint Semiconductor
✗ GaAs ICs for 40 Gbps Transceiver Applications, John Grebliunas,
Nanowave
✗ InP AND GaAs ICs For 40 Gbps Applications,
Augusto Gutierrez-Aitken, TRW Space and Electronics
✗ Development of Circuits in Indium Phosphide for Communication
at 40 Gbit/s and Above, Alan Huelsman, Vitesse Semiconductor Corp.
✗ Electronics for OC-768 and Beyond: Technology, Design,
Packaging and Test, Gopal Raghavan, Inphi Corp.
✗ Challenges in OC-768 Physical Layer Semiconductors,
Rob Glidden, AMCC
✗ Monolithic Serializer and DeserializerI ICs for OC-768
Applications, Thomas Krawczyk, Sierra Monolithics
✗ InP HEMT Optical Communication ICs for 40 Gbit/s and beyond,
Koichi Murata, NTT Photonics Laboratories
✗ How to Get a Production 40 Gb/s System, Ernst Müllner, Siemens
✗ Commercial 40 Gbps Chipsets Based on an InP HBT Technology,
Raja Pullela, Gtran
Organizers:
Dr Steve Marsh, Marconi Optical Components
Larry Kushner, PhotonEx Corp.
Sponsor:
MTT-6 Microwave and MM-Wave IC
WSB: HIGHLY INTEGRATED PACKAGING TECHNIQUES
FOR MICROWAVE AND MILLIMETER-WAVE PACKAGING
FOR BROADBAND APPLICATIONS
Date & Time:
Location:
Topics and Speakers:
✗
✗
✗
✗
✗
✗
✗
✗
Despite the stock market’s gloomy view of the communications industry, all the large IC companies are pushing ahead with the development of chips for 40 Gbit/s data rate systems. This chip development
covers a very broad range of technologies including CMOS, SiGe, GaAs,
and InP. Indeed, many of the companies are investing in new fabrication
facilities for these semiconductor processes in order to supply into this
expanding application area.
Work is also progressing in the development of the optimum system
architecture and the integration of these chips into compact modules and
transponders. At 40 Gbit/s data rates the phase response and jitter specifications are so demanding that some of the functions may be better performed in the optical domain. Indeed, this is also forcing the chip designers to combine different functions into single chips such as combining the transimpedance amplifier and the limiting amplifier, reducing
the number of interconnects and their associated degradation. System
partitioning — how much to place in one module or pcb and where to
draw the lines becomes even more critical at 40 Gbps. It is likely that
different applications, such as short-reach vs. long-haul, will require different solutions.
Packaging is a critical issues at 40 Gbps, presenting a significant number of technology and design challenges. Integration density must be balanced against thermal requirements. Getting high-speed signals in and out
of ICs and packages at these rates with minimal distorton and loss will require a coordinated effort between the IC, package, and pc board designers. Even the “low-speed” side of 40 Gbps MUX/DMUX ICs presents
quite a challenge, as routing and skew considerations can dramatically increase the complexity of these ICs. The industry is attempting to standardize this low-speed side via the SFI-5 interface, but in many cases, IC ven-
Joy Laskar, Georgia Institute of Technology
Allen Linder, StratEdge Corp.
Katherine J. Herrick, Raytheon RF Components
Wolfgang Heinrich, Ferdinand-Braun-Institut (FBH)
River Huang, HEI
Jean-Rene Bois, United Monolithic Semiconductors SAS
Barry R. Allen, TRW
Anh-Vu Pham, Clemson University
Organizers:
Anh-Vu Pham, Clemson University
Alan Lindner, StratEdge Corp
Klaus Beilenhoff,
United Monolithic Semiconductors, SAS
Sponsor:
MTT-12 Microwave and Millimeter Wave Packaging
The emergence of broadband wireless applications such VSAT (14.5
GHz), Point to point (5–38 GHz), Point to Multi-Point (28-31 GHz),
Ka band Satellite (26–31 GHz) and the High Speed Digital family
(1–100 GHz) has brought new demands for low-cost, miniaturized,
high-volume packages and multi-chip modules. To develop low cost,
high volume systems, microwave, high-speed digital and RF MEMs devices need to be packaged in either single- or multi-chip format. As the
level of integration and the operating frequency increases, coupling between components and parasitic reactance within the package play a
greater role in the package design.
In this full day workshop, the participants will obtain: a clear understanding of the issues involved in designing advanced broadband packages; an in depth understanding of the current manufacturing techniques that the packaging industry is currently using; an overview of advanced packaging technologies for broadband, high-speed, highly
integrated systems at the package and wafer level.
16
Date & Time:
Location:
✗ The Integration of Direct Conversion Transceivers for Modern
Cellular Standards, Rahul Magoon and Aloysha Molnar, Conexant
Systems
✗ Direct Conversion Transceiver for GSM Mobile Phone, Christian
Kermarrec, Analog Devices
✗ RF Integrated Homodyne Transceivers for 3G Mobile Radio,
Harald Pretl, Infineon
✗ The Even Harmonic Type Direct Conversion Receiver for
WCDMA Mobile Terminals, Kenji Itoh, Mitsubishi
✗ Circuit Techniques for GSM/DCS1800 Direct Conversion Receiver,
Satoshi Tanaka, Hitachi
✗ Digital Receivers for CDMA Applications, Charlie Jackson,
Ditrans Corp.
✗ A Direct Conversion 802.11b Transceiver Design Based on Energy
Sampling, David Sorrells and Gregory Rawlins, Direct2Data
Technologies
✗ Direct Conversion Transceiver Design Techniques, Joe Heck,
Motorola
Date & Time:
Location:
✗ Bluetooth Applications, Thinking Out of the Box, Bob Morrow,
Morrow Technical Services
✗ Bluetooth, an RF-System’s Perspective, Jack Glas, Agere Systems
✗ Bluetooth and 802.11: Can They Live Together?, Bob Morrow,
Morrow Technical Services
✗ The Bluetooth Technology Evolution to Low Cost, Skip Bryan,
Ericsson
✗ A Bluetooth Single Chip Solution in 0.25 µm CMOS, Steffan
Heinen, Infineon
✗ Bluetooth IC Solution in CMOS, Vladimir Prodanov,
Agere Systems
✗ A Bluetooth Total Solution: SOI Radio-modem with Directconversion Architecture, Glenn Chang, Siliconwave
WSD: RF AND HIGH SPEED FLIP CHIP TECHNOLOGY & DESIGN
Location:
MTT-6 Microwave and mm-Wave IC
Topics & Speakers:
Direct Conversion or ZIF (Zero Intermediate Frequency) radio architectures have recently found their way into the wireless and cellular mobile communication systems. The intent of this workshop is to understand the basic operation of this architecture for various applications,
semiconductor technologies used in the implementation and design
techniques used to overcome the limitations. In particular, applications
of direct conversion radios in Bluetooth, GSM, WCDMA, CDMA,
WLAN, GPS will be covered. Speakers will also address psuedo direct
conversion (i.e., low IF) techniques where ZIF is not pragmatic.
Sponsor:
WSE: ADVANCES IN BLUETOOTH TECHNOLOGY
Dr. Fazal Ali, Nokia Mobile Phones
Dr. Mike Golio, Rockwell Collins
Date & Time:
Vijay Nair, Motorola Inc.
Mohamed Megahed, Conexant Systems
Deborah Patterson, Flip Chip Technologies
Flip Chip (FC) technology is experiencing a new period of explosive
growth. The need for smaller size, lower cost, and better performance characteristics for high volume and high speed micro/optoelectronics products
are the driven areas for this growth. The recent emergence of global flip
chip infrastructure is speeding the adoption of the technology into mainstream packaging. Flip chip shows a promise to topple down wirebond
technology from its seat of preeminence in certain type of applications. In
addition, flip chip technology paves the way for the ultimate direct chip
attach (DCA) on MCM, SIP, and printed circuits boards.
This workshop will overview flip chip technology, in general. Special
attention will be addressed for high frequency/high speed product applications. The history and current status of the technology will be introduced. Potential applications of the technology will be presented. Compatibility of die and package processes for FC will be discussed. RFIC
circuit design considerations will be addressed. IC/Package codesign
concept for FC will be explained. FC testing at the wafer and package
levels will be explored. Finally, DCA applications will be presented.
Topics & Speakers:
Organizers:
Organizers:
Topics & Speakers:
✗ Key note: Flip Chip Potential and Future Road Map, Gil Olachea,
Flip Chip Div. of Kulicke & Soffa (formally Flip Chip Technologies)
✗ Flip Chip Process Description and Evolution, Glenn A. Rinne,
Unitive
✗ Packaging Considerations for RF and High Speed Applications,
Dr. Sandra Petty, Conexant Systems
✗ Testing Challenges for FC Technology, January Kister,
Kulicke & Soffa, Test Div.
✗ Update and Review of Flip Chip Process Applications,
Neil Moskowitz, Prismark Partners
✗ RF Circuit Design Consideration for FC, Dr. Mohamed Megahed,
Conexant Systems
✗ Design Considerations for Flip Chip Technology in High Speed
Digital and High Frequency Applications, Dr. Mali Mahalingam,
Motorola
✗ FC on Ceramic Substrate Technology Applications,
Hassan Hashemi, Minspeed
Organizers:
Edward C. Niehenke, Niehenke Consulting
Jenshan Lin, Bell Laboratories
Allen Podell, Besser Associates
Sponsors:
MTT-16 Microwave Systems
MTT-20 Wireless Communication
This workshop will first focus the system applications of Bluetooth
followed by an in depth discussion of the specifications of this new technology. Next, techniques will be presented enabling Bluetooth to operate with interference with other devices in the ISM 2.4 GHz band. Various approaches will next be presented to meet the design requirements
using technologies such as CMOS, BiCMOS, with integration technologies such as LTCC and flip chip, along with power-efficient chip designs
and software and hardware optimized power management approaches.
This workshop will conclude with a panel discussion where all the
speakers will answer the attendee’s questions and will include their cost
projections.
17
SUNDAY
SUNDAY WORKSHOPS
WSC: DIRECT CONVERSION TRANSCEIVERS
FOR CELLULAR & WIRELESS APPLICATIONS
SUNDAY
SUNDAY WORKSHOPS
WSF: WIRELESS SYSTEMS ON A CHIP
Date & Time:
Location:
✗ Some Systems on Some Chips, Manfred Schindler, RFMD
✗ System on a Chip for MW/mmW Applications, J-P Lanteri,
M/A-COM
✗ RFICs — To Integrate or Not, That is the Question, Robert
Donahue, Hittite
✗ Benefits of SOI for Mixed Signal RF SoC ICs, Dr. Yuri Erokhin,
Ibis Technology Corp.
✗ RF SOI Comes of Age, David E. Kelly, Peregrine Semiconductor Corp.
✗ Issues for Highly Integrated Radios, Dr. Kenneth O,
Global Communication Devices
✗ System on a Chip at mmw-Frequencies: Automotive and
Communication Frontends, Dr. Heinrich Daembkes, UMS
✗ Power Amplifiers for WLAN Integrated Chips, Peter Sahjani,
Agilent
✗ WLAN System on a Chip Solutions, Dr. Sanjay Moghe, RF Solutions
Lamberto Raffaelli, LNX Corp.
Geoff Dawe, Global Communication Devices
Sponsors:
Location:
MTT-1 Computer-Aided Design
Date & Time:
Sunday, June 2; 1:00 PM to 5:00 PM
Location:
Topics & Speakers:
✗
✗
✗
✗
WSG: GHZ AND THZ SOLID STATE DEVICE SIMULATION
Sponsor:
WSH: RF SOLUTIONS FOR GPS — TO - HANDSET APPLICATIONS
To reduce manufacturing cost and simplify integration, the wireless
industry is rapidly moving toward highly integrated chips. A number of
companies now claim to have developed an entire system on a single
chip for applications such as WLAN and fixed wireless. Present industry
leaders, such as RFMD, Alpha, Hittite and others, have so far mainly developed single-function chips. More innovative companies, such as Atheros, Global Communication Devices, and Intersil are moving towards
system-on-a-chip solutions. This workshop will stimulate debate between the more conservative but well-established companies who have
been the leaders in the wireless chip industry, and the more innovative
companies who are taking the “wireless systems on a chip” approach.
Date & Time:
Dr. Gregory Tait, Virginia Commonwealth University
Dr. Jack East, University of Michigan
Global modeling of complete high-frequency circuits requires the integration of circuit, electromagnetic, and device transport simulators
into a single package. While much attention is currently focused on simulating the full electromagnetic field environment, the solid-state devices present in the circuit are typically modeled using equivalent circuit
elements and sources, behavioral models, or simplified carrier transport
equations. As circuit operation extends into the millimeter- and submillimeter-wave regimes, appropriate device modeling is needed for the
submicron-sized devices embedded in the circuit. The challenges are
two-fold: (1) what large-signal, dynamic high-frequency carrier transport
physics must be included in the numerical modeling, and (2) how can
these more accurate models/simulations be efficiently incorporated in the
field and/or circuit simulations.
An overview of device modeling and nonlinear circuit simulation is
presented, followed by topics in advanced carrier transport including
high-frequency physics, coupled electro-thermal models, and Monte Carlo simulation. Efficient coupling schemes between physical transport,
electromagnetic, and nonlinear circuit simulations are then presented.
Topics include hydrodynamic and ensemble Monte Carlo device simulations coupled with full-wave electromagnetics and with time- and frequency-domain nonlinear circuit analysis techniques.
Topics & Speakers:
Organizers:
Organizers:
Tony Pratt, Parthus UK Ltd.
Solon Spiegel, u-blox AG
James P. Young, Conexant
Hans-Joachim Golberg, Atmel GmbH
Organizers:
Solon Spiegel, u-blox AG
Tony Pratt, Parthus UK Ltd.
Hans-Joachim Golberg, Atmel GmbH
Sponsors:
The integration of global position (GPS) and wireless communication
(WCS) systems into handsets has been increasingly requested for location
services. The position information is transmitted over the wireless network whenever demanded. The fast acquisition of GPS signals, the weak
signal detection and the interference caused by the wireless systems on
the GPS become, hence, major issues. This workshop provides technical
information related to integrated GPS receivers into mobile stations of
wireless communication systems. The overview, the trends and the weak
signal requirements of GPS-to-handsets are initially covered. Particularly, emphases are given to in-door GPS and weak signal acquisition. The
RF issues and requirements for GPS-to-handset applications are then
presented and the different degradation mechanisms of the signal-tonoise ratio are analysed. The SNR degradation due to the close proximity between the wireless transmitter and the GPS receiver is demonstrated. An overview of past and present RF system architectures will be presented which demonstrate how the GPS system architecture has changed
to reduce cost with increasing levels of integration. The increased demands on the semiconductor technology and the technology trades including GaAs, Bipolar, CMOS and BiCMOS are described. Finally, a
low current consumption and a low cost GPS RF receiver are reported
with respect to the special requirements in handsets. The influence of the
frequency plan, the gain distribution to power and the noise performance
will be discussed.
Topics & Speakers:
✗ Introduction: High-Frequency Device Simulation in Global
Microwave Circuit Modeling, Dr. Gregory Tait,
Virginia Commonwealth University
✗ Device-Circuit Interactions at THz Frequencies, Dr. Jack East,
University of Michigan
✗ Coupled Electro-Thermal Physical Device Simulation in Global
Microwave Circuit Modeling, Dr. William Batty,
University of Leeds
✗ Modelling of Planar Schottky diodes for Millimeter-Wave and
Submillimeter-Wave Circuit Applications, Dr. Viktor Krozer,
Technical Univerisity of Chemnitz
✗ Coupled Electromagnetic-Semiconductor Device Simulation Tools
for Global Modeling of High Frequency Devices and Circuits, Dr.
Samir El-Ghazaly, Arizona State University
✗ Nonlinear Coupling of Electromagnetic Waves and Free Carriers in
Semiconductors, Dr. Matt Grupen, Ansoft Corp.
✗ Linearity Optimization of Bipolar Transistors Using the Agilent
MDS/ADS Implemented Mixed-level Simulator MAIDS,
Dr. Leo de Vreede, Delft University of Technology
18
Date & Time:
Sunday, June 2; 1:00 to 5:00 PM
Location:
due to recent advances in many areas of microelectronics such as microelectro-mechanical systems (MEMS), mixed-signal electronics, high
speed digital electronics, and heterogeneous integration techniques. The
objective of this workshop is to promote the industrial and academic
community to focus on this new paradigm shift to monolithic microwave integrated circuit (MMIC) technologies and to stimulate exchange of innovative ideas for realization of intelligent microsystems.
This workshop will feature six invited talks followed by a group/panel
discussion. The main objective is to engage the workshop participants in
an open dialog and exchange technical ideas among the participants. The
first speaker will be Dr. Zachary Lemnios from MIT Lincoln Laboratories, who has been active in studies of future microsystems and their role
in future DoD applications. Dr. Lemnios will present the future vision of
intelligent systems, emphasizing the “intellegence” or “adaptivity” aspects of the concept. His talk will stimulate the participants to think out
of the box about future systems needs and capabilities. Following the introduction, leading researchers will discuss various aspects of the key
technologies required to implement such intelligent systems. The topics
discussed will include MEMS for RF adaptation, digital self-assessment
of analog functions, and design issues for adaptive circuits. Prof. Gabriel
Rebeiz of the University of Michigan, who is a leading researcher on
MEMS and micromachining techniques for radar and communications
applications, will discuss the topic of MEMS for RF adaptation and reconfiguration. Dr. Peter Asbeck of the University of California at San
Diego, will address new architectures for power amplifiers with improved efficiency and linearity, and the assessment of analog functions.
Prof. Michael Steer of North Carolina State University, who has conducted extensive research work on RF and microwave design for power and
wireless applications, will address the design issues for adaptive circuits.
After a review of the basic technologies for realization of intelligent systems, two industry representatives, Dr. Daniel Ko from TRW and Dr.
John Wyndika from BAE Systems, will provide the industry perspectives for this technology. These two talks will cover technology challenges, component development process, and component integration to
make smart systems and platforms. The status, challenges and future opportunities will be highlighted.
If time permits, the presentations will be followed by a one-hour period for discussion of the technical challenges for realization of intelligent
systems and innovative ideas for overcoming these problems.
Topics & Speakers:
✗ The Path from Scaled Microelectronics to Intelligent Systems,
Zachary J. Lemnios, MIT Lincoln Laboratory
✗ MEMS for RF Adaptation, Prof. Gabriel M. Rebeiz, University of
Michigan, EECS Department
✗ Extending Analog Transistor Functionality with Digital
Techniques, Prof. Peter Asbeck, University of California at San
Diego
✗ Design Issues for Multifunctional Adaptive Radar, Radio and
Sensor (MARRS) Systems, Prof. Michael Steer, North Carolina
State University, Department of Electrical and Computer Engineering
✗ System Concepts for RF Intelligence, Dr. Daniel K. Ko, TRW
✗ Intelligent RF Front-ends for Wideband Receivers,
John A. Windyka, BAE Systems
Organizers:
Dr. Edgar Martinez, DARPA
Chun-Lim Lau, Booz Allen Hamilton
Sponsors:
MTT-9 Digital Signal Processing
The Defense Advanced Research Projects Agency is exploring new
concepts on Intelligent Microsystems in which components will possess
the ability to self-assess and self-optimize their performance in real time.
This is the concept of Intelligent RF Front-end systems - highly adaptable, highly integrated RF/analog components. The ability of RF/analog
components to intelligently tune or adapt in real time optimizing themselves to operational demands, and/or dynamic changes in the environment is highly desirable. Such capabilities would enable a new class of
system architectures with unprecedented performance, agility, and multifunctionality, and open the door to new opportunities in RF sensing
and communication. The realization of this new class of high performance, compact, and low-cost RF/analog microsystems will be possible
19
SUNDAY
SUNDAY WORKSHOPS
WSI: INTELLIGENT RF FRONT-ENDS
MONDAY WORKSHOPS
✗ Designing LTCC Circuits Using Companion Models and SpaceMapping Techniques, Tony Pavio, Motorola
✗ Coupled Resonator Filter Realization by 3D-EM Analysis and
Space Mapping, Dieter Pelz, Radio Frequency Systems
✗ EM-Based Design Through Neural Space Mapping Methods, Jose
Rayas-Sanchez, ITESO University
✗ A Multi-level Design Optimization Strategy for Complex
RF/Microwave Structures, S. Safavi-Naeini, University of Waterloo
✗ An Explicit Knowledge-Embedded Space Mapping Scheme for
Optimization Design of LTCC RF Passive Circuits, Ke-Li Wu, The
Chinese University of Hong Kong
✗ Knowledge Based Neural Network Approaches for Microwave
Modeling and Design, Q.J. Zhang, Carleton University
✗ Jan-Willem Lobeek, Philips Semiconductors
MONDAY
WMA: AUTOMOTIVE RADAR & PROSPECTIVE CIRCUIT/ANTENNA
TECHNOLOGIES? FROM CAR COLLISION AVOIDANCE
TO AUTONOMOUS DRIVING
Date & Time:
Monday, June 3; 8:00 AM to 5:00 PM
Location:
Topics & Speakers:
✗ Design and Realization of a Novel, Synchronized 77 GHz Radar
Network for Automotive Use, Alfred Hoess, SiemensVDO
Automotive AG
✗ Advanced Radar Concepts for Automotive Applications, Arne F.
Jacob, Institut fuer Hochfrequenztechnik
✗ Electrically Scanned Millimeter-Wave Radar for Automotive
Applications, Yoshikazu Asano, Toyota
✗ Space Division Multiple Access (SDMA) Techniques Applied to
Car Radar Sensors, Martin Schneider, BOSCH
✗ Semiconductor Solutions for Low Cost Millimeter-Wave
Automotive Radar Frontends, Heinz-Juergen Siweris, Infineon
✗ A Chip-set for 76 GHz Automotive Radar Sensors Using Flip-Chip
Bonding Technology, Tatsuya Hirose, Fujitsu
✗ Monolithic Microwave and MM-Wave ICs for Automotive Applications
— Measures for Cost Reduction, Klaus Beilenhoff, UMS
✗ 76 GHz Transceiver for Automotive Forward-Looking Radars,
Hiroshi Kondoh, Hitachi
✗ Automotive Radar Systems, Josef Wenger, DaimlerChrysler
Organizers:
Mohammad Madihian, NEC USA Inc.
Hiroshi Kondoh, Hitachi
Sponsor:
Sponsors:
MTT-15 Microwave Field Theory
WMC: ULTRAHIGH SPEED MICROWAVE AND PHOTONIC DEVICES
AND SYSTEMS: HOW WILL THEY BE TESTED?
Date & Time:
Location:
Topics & Speakers:
✗ Fundamentals of High-Speed Lightwave Component
Characterisation Using S-Parameters, Dr. Stavros Iezekiel,
University of Leeds
✗ Emerging Trends in High-Speed Lightwave Component
Characterisation, Dr. Bala Elamaran, Lightwave Division, Agilent
Technologies
✗ Probing Photonic Devices, Scott Rumbaugh, Cascade Microtech
✗ Calibrated High-Speed Optoelectronic Measurements, Dr. Paul
Hale, Dr. Tracy Clement and Dr. Dylan Williams, NIST
✗ Electro-Optic Sampling Applied to mm-wave MMIC
Characterisation, Dr. Richard Dudley, National Physical Lab
✗ Electro-Optic Field Mapping for Diagnostics of Circuits and
Arrays, Dr. John F. Whitaker, University of Michigan
✗ Photonic Probes For an On-Wafer Broad-Band (300 GHz)
Millimeter-Wave Network Analyzer, Dr. Nabil Sahri, Alcatel
Research & Innovation
WMB: MICROWAVE COMPONENT DESIGN
USING SPACE MAPPING METHODOLOGIES
Location:
Dr. John Bandler, Bandler Corp.
Microwave engineers have been using optimization techniques for device, component and circuit modeling and CAD for decades. Automatic
optimization in modeling, simulation and design is now taken for granted. One of the frontiers that remain is the successful application of optimization procedures in problems for which direct application of traditional optimization approaches is not practical. The recent exploitation
of iteratively refined surrogates of “fine” or accurate models, and the implementation of space mapping and related methodologies can be viewed
as attempts to address this issue.
Space mapping optimization intelligently links companion “coarse” and
“fine” models of different complexities. Examples include full-wave electromagnetic simulations with empirical circuit-theory based simulations,
or devices under test with a suitable simulation surrogate. The aim is to
accelerate iterative design optimization. It is a simple CAD methodology,
which closely follows the traditional experience and intuition of microwave
designers, yet can be rigorously grounded mathematically. The exploitation of properly managed space mapped models promises significant efficiency in engineering design optimization practices.
This workshop will bring together the foremost practitioners in these
fields including microwave component designers, software developers
and academic innovators. They will focus on the state of the art and address designers’ needs for effective tools for optimal designs, including
yield optimization, exploiting accurate physically based device and component models. Current progress in the development and application of
suitable algorithms and software engines will be presented. The concepts
address the contradictory challenge of exploitation of device and system
models that are both accurate and fast.
Long-awaited automotive radars, which were originally considered for
better driving safety, are no longer “car collision avoidance”-only tools.
Projected complexity and functionality for forward looking radars for the
next decade include “adaptive cruise control,” “automatic stop and go,”
airbag pre-crash warning,” “parking aid,” and ultimately “autonomous driving.” Automotive radars have been researched and developed over the
past two decades. Commercial products have been introduced into the
market for heavy vehicles such as buses, trucks and trailers, and more recently for passenger cars. While the commercialization of the radar technology coincides with carmakers’ emphasis on driving safety and feature
enhancement, it would not have been possible without maturity of viable
microwave and millimeter wave technologies at 24 GHz and 77 GHz.
Since automotive radars are rather loosely specified and regulated worldwide, applicable technologies may vary for optimum performance/cost depending on the radar schemes and their intended functionality. Radar
modulation schemes include FMCW, two-frequency CW, pulsed and
spread spectrum, whereas azimuth-angle detection may rely on beam scanning, beam switching, or mono-pulse. Microwave and millimeter-wave
signal generation may utilize direct oscillation, frequency multipliers,
DRO, and/or PLL. Antenna and circuit topologies are therefore the most
crucial constituents influenced by the radar requirements. Even with a
fixed set of requirements, there are many factors to be considered for best
compromise between performance, cost, and size. The present workshop
will bring together experts from consortiums, automotive suppliers and
car manufacturers, radar system manufacturers, universities, and semiconductor manufacturers. The workshop will address (a) present and future
automotive radars’ functionalities, (b) different automotive radar schemes,
(c) adoptable device/circuit topologies, (d) suitable antenna technologies,
and (e) present and future challenging issues and consortium activities.
Date & Time:
Organizer:
Topics & Speakers:
✗ Space Mapping Approaches To EM-Based Device Modeling And
Component Design, John Bandler, Bandler Cor.
✗ Theory and Applications of the Space Mapping Technique, Kaj
Madsen, Technical University of Denmark
20
Organizer:
Dr Stavros Iezekiel, Inst. of Microwaves and Photonics
Sponsors:
MTT-3 Microwave Photonics
MTT-7 Microwave and mm-Wave Solid State Devices
MTT-11 Microwave Measurements
and amplification. In addition, applications such as phased arrays and
communications will be covered. The thermal aspects of implementing
this technology will also be discussed.
The initial part of the workshop, approximately 1/3, will focus on the
theory, projection and limitations of the devices including key electrical
parameters of the materials with presentations from leading university
professors. This part will also address the use of different substrates such
as silicon carbide (SiC), sapphire, silicon (Si), Gallium Nitride (GaN),
etc. The main part of the workshop will contain presentations from industrial and government speakers focused on this leading edge technology. To provide a worldwide overview, the speaker list will include technology leaders from the United States and Europe.
Modern society has an insatiable appetite for information, which manifests itself in ever increasing bit rates (> 40 Gb/s) in optical communication systems and the development of broadband mm-wave wireless
systems (especially at 60 GHz). Advances in the cut-off frequencies of
devices such as traveling wave photodetectors, polymer modulators and
pHEMTs and HBTs make it only a matter of time before the 100 Gb/s
barrier is reached by commercial fiber optic products, while 180 GHz
wireless systems have been suggested. These exciting developments pose
a number of challenges in the design and fabrication of high-speed photonic and microwave devices, ICs, interconnects and packages.
However, they also push the envelope in the vital area of characterization, demanding measurement instruments with at least the same bandwidth. Whilst techniques such as electro-optic sampling and network
analysis to 100 GHz and beyond would have been previously viewed as
esoteric, the time has now come for mm-wave and photonic device designers to use them. (A fact borne out by the recent appearance of commercial 40 Gb/s BER test sets).
This workshop specifically addresses a number of state-of-the-art approaches to the time- and frequency-domain measurement and diagnostic testing of critical components in present and emerging broadband
optical and wireless systems.
WME: ADVANCES IN CERAMIC INTERCONNECT TECHNOLOGIES
FOR WIRELESS, MICROWAVE & PHOTONIC APPLICATIONS
Location:
Topics & Speakers:
✗ Wide Bandgap Semiconductor Technology Initiative, Dr. Edgar
Martinez, Defense Advanced Research Projects Agency (DARPA)
✗ Fundamental Limitations in AlGaN/GaN HEMT Power and
Frequency, Dr. Lester F. Eastman, Cornell University
✗ Large-Signal Operation and Physical Effects Limiting the RF
Performance of Wide Bandgap FET’s, Dr. Robert J. Trew,
Virginia Tech
✗ GaN HEMTs: An Enabling Technology for Next Generation Solid
State Phased Array Applications, Dr. Thomas Kazior, Raytheon
✗ Dr. William Pribble, CREE Inc.
✗ Dr. Umesh Mishra, UCSB
✗ RF Analysis of Passivated AlGaN/GaN HFETS, Dr. H. Leier,
DaimlerChrysler Research
✗ On the Benefits of SiC and GaN RF Power Devices for Mobile
Communication Basestations, Dr. G. Fischer, Lucent Technologies
✗ Feasibility of AlGaN/GaN HEMTs for Ku and Ka-Band
Applications, Dr. R. Kiefer, Fraunhofer-IAF
✗ AlGaN/GaN-HEMTs on Silicon Substrates, Dr. Rolf H. Jansen,
GaN Consortium
✗ Development of GaN power HEMT Technology on Si Substrates,
Dr. D. Pons, Thales TRT
✗ Thermal Effects in AlGaN/GaN HFETs, Dr. M.J. Uren, QinetiQ
Organizers:
Frank Sullivan, Raytheon Systems Company
Dr. Rolf H.Jansen, Aachen University of Technology
Sponsors:
MTT-6 Microwave and mm-Wave IC
MTT-7 Microwave and mm-Wave Solid State Devices
MTT-12 Microwave and mm-Wave Packaging
Location:
Topics & Speakers:
✗ A Discussion of the Critical Properties of LTCC Materials for
Microwave Applications, Dr. Peter Barnwell, Heraeus CMD
✗ The Performance of High Frequency Functions Using Multilayer,
Photoimagable Low Temperature Cofired Ceramic (LTCC), Dan
Amey, DuPont Microcircuit Materials
✗ Low Loss High Definition Conductor Line in LTCC, Laurent
Boyer, Thales Microsonics
✗ Trends in Wireless/RF/Optoelectronic Integrated Packaging, Don
Brown, IWPC
✗ Design of Integrated RF Functions for a Complete Bluetooth
Solution, Chris Barratt and Sylvain Gerbier, National
Semiconductor Corp.
✗ Low Loss Transmission Line Structures Achievable Using LTCC,
Liang Chai, Ferro Electronic Materials
✗ System-in-a-Package — Market Potentials Using LTCC, Jim
Lawson, C-MAC MicroSystems
✗ The Effective Use of Ceramics in Microwave Power Amplifier
Design, John W. Roman, Film Microelectronics Inc.
✗ Plated and Bonded Copper on Alumina Ceramic for RF
Component Packaging, Christopher Wolf, CirQon Technologies
✗ RF Circuits with Thick Film Technology Offer Improved
Performance, Clark M. Steddom and Juan L. Sepulveda, Zentrix
Technologies Inc.
✗ Design Considerations for the Incorporation of Large Number of
Differential Pairs in Ceramic Packaging, Paul Garland, Kyocera
America Inc.
WMD: WIDEBAND GAP TECHNOLOGIES: APPLICATIONS,
DEVICES AND CIRCUIT ISSUES
Date & Time:
Date & Time:
Organizers:
Dr. Samuel J. Horowitz, DuPont Microcircuit Mat.
Dr Peter Barnwell, Heraeus CMD
Sponsor:
The workshop builds on the success of previous events organised for
Anaheim in 1999 Boston in 2000 and Phoenix in 2001. In 2001 well in
excess of 140 delegates registered and the workshop was nearly full. The
purpose of the workshop will be to acquaint engineers with the capabilities of ceramic interconnect and packaging technologies for realizing
wireless and microwave circuits and systems. For the year 2002, optical
and fiber optic packaging photonics will be included.
The reason for running the workshop is that ceramic technologies are
generally less familiar to design engineers and yet offer significant benefits in terms of circuit performance, weight and reliability. In the last
two years this has started to change with many engineers considering ceramic as an important technology for microwave and related packaging
demands. Newer technologies are advancing these benefits further, while
at the same time driving costs down. Eminent speakers will be selected
to describe and discuss the technologies, applications and the economics
of ceramic solutions.
Target Audience: Microwave and Optoelectronics Circuit and System Designers.
Technologies to be covered: All ceramic circuit technologies suitable for RF,
Microwave and photonics applications. To include: Thick Film; Thin
This workshop will address the state of the art of Wideband Gap
Semiconductor Technologies. A major effort is being made to advance
GaN and SiC technologies for high power applications in the microwave
region. There are other components where these devices will also find applications but the main focus in this workshop will be power generation
21
MONDAY
MONDAY WORKSHOPS
✗ Beyond 40 GHz: Chips to be Tested, Instruments to Measure
Them, Prof. Mark J. W. Rodwell, University of California
MONDAY WORKSHOPS
✗ EVFE Technique — An Efficient and Practical Solution to Guided
Wave Problems, Tasuo Itoh and Yuanxun Wang, UCLA
✗ CAD and Optimization of Waveguide Components and Antennas
by Fast Hybrid MM/FE/MoM/FD Methods, Fritz Arndt,
University of Bremen
✗ Effects of Selection of Irises on Stopband Performance in the CAD
of Direct Coupled Cavity Filters, Christoph Ernst, Lorch Microwave
✗ The Use of CAD Tools in Filter Design for Telecommunication
Applications, Jan Kocbach, NERA Research, Satellite Comm.
✗ Enhanced Numerical Modelling of Waveguide Networks and
Planar Circuits, Juan Mosig, University of Lausanne
✗ Efficient Simulation of MMIC and RFIC Systems Using a New
Matrix Generation Technique and the MNM Iterative Solver, Raj
Mittra, Pennsylvania State University
✗ Efficient MoM Techniques for Complex Digital High-Speed and
RF Circuits and for Parameterized Model Building, Daniel
DeZutter, University of Gent
✗ Discretization and Circuit-Based Simulation of High Frequency
Devices and Circuits Including Distributed Effects,
Samir El-Ghazaly, Arizona State University
✗ A Domain Decomposition of the Finite Element-Boundary Integral
Method for Finite Arrays, John Volakis, University of Michigan
Film; Low Temperature Co-fired Ceramic (LTCC); High Temperature
Co-fired Ceramic (HTCC); Plated Conductors; Integrated Passives; Photo Patterning; Design Systems and Techniques; Cost Factors.
Targeted Applications: Cell phone handsets; Bluetooth Modules; Base stations; Satellite Systems; LMDS; Collision Avoidance; Paging; Wireless
Local Loop; Radar Systems; Optical Interfaces, Fiber Optics etc.
MONDAY
WMF: INTRODUCING NEW CONCEPTS
IN NONLINEAR NETWORK DESIGN
Date & Time:
Location:
Topics & Speakers:
✗ Overview of New Concepts in Nonlinear Network Design, Prof.
Dr.-Ing. Adalbert Beyer, Gerhard-Mercator-Universität Duisburg
✗ Introduction to and Recent Developments in the Novel Largesignal Modelling Philosophy, Directly Based on Large-signal
Measurement Data, Dr. ir. Dominique Schreurs, KatholiekeUniversiteit Leuven
✗ The Nonlinear Design Discontinuity, Prof. Steven A. Maas,
Nonlinear Technologies Inc.
✗ An Integrated Overview of Nonlinear CAD/CAE Tools and Their
Use on Nonlinear Network Design, Prof. J. C. Pedro, University of
Aveiro
✗ Dr. Peter Asbeck, University of California at San Diego
✗ Nonlinearity Simulation Using CAE System Amplifier and Mixer
Models, Prof. L. Dunleavy, University of South Florida
✗ Everything You’ve Always Wanted to Know About “Hot-S22”
(But Were Afraid to Ask), Dr. J. Verspecht, Agilent Brussels
✗ Nonlinear Microwave Design — Extrapolating Beyond SParameters, Prof. J. S. Kenney, Georgia Institute of Technology
✗ Improved Techniques Utilizing Harmonic Termination Methods
for Microwave and RF Circuit Design, Dr. Larry Larson,
University of California at San Diego
✗ Simulation of a Microwave-Bank, Mrs. Lidia Esther, Microwave
Department of LPGC
✗ Jeff Jargon, K.C. Gupta and Don DeGroot, University of Colorado
at Boulder
Organizers:
Prof. Dr.-Ing. Adalbert Beyer,
Gerhard-Mercator-Universität Duisburg
Dr. ir. Dominique Schreurs,
Katholieke-Universiteit Leuven
Prof. Steven A. Maas, Nonlinear Technologies, Inc.
Sponsor:
Organizer:
The workshop will build on the popularity and success of recent
workshops involving computational electromagnetics and CAD for industrial applications of passive microwave circuits with the goal to reduce design cycles drastically.
Much effort has been devoted to the development of electromagnetic
(EM) simulators for analyzing microwave circuits and antennas, during
the last decade. The consequent next step is the reliable CAD of components and systems for wireless and space communications based on EM
field simulators, fast hybrid techniques, and proven optimization methods. The focus of this workshop will be the presentation of the state-ofthe-art and recent progress in the development of advanced and efficient
EM techniques and their use for performance assessments and the design
of passive key components relevant to communication systems and military applications for the next pentad.
Examples will be given from the application of such CAD capability
to a variety of practical component design problems, such as waveguide
filters, diplexers, multiplexers, couplers, feed networks, horn and slot antennas, planar circuits, patch antennas and microstrip arrays. The techniques and examples directly address the industrial demand for faster design cycles and reduced time to market for microwave components and
systems products.
A balance between theory, applications and practical discussions of issues and solutions is intended so that the workshop will appeal to a wide
range of engineers. Attendees will be encouraged to bring questions, proposals and/or viewgraphs to describe their problems. The workshop will
include the presentation of software vendors on the status of the implementation of advanced techniques in commercially available CAD tools.
The purpose of this workshop is twofold. First of all, it is intended to
give an overview of the recent developments in nonlinear simulation, modeling, characterization and design techniques. Secondly, the issue to teach
about nonlinear concepts should be addressed. Undergraduate programs
are currently mostly limited to the coverage of linear concepts, but the industry demands basic understanding of nonlinear concepts. Therefore, the
workshop speakers, all have on-hands experience in nonlinear concepts,
want to show how these concepts can be established. Finally, the goal of
this workshop is to supply a forum for discussion and therefore the participants will be invited to interact and to express their point of view.
WMH: PASSIVE COMPONENTS FOR RF APPLICATIONS
Location:
Date & Time:
Location:
Topics & Speakers:
✗ RF Couplers, Dave Andrews, Vectawave
✗ RF Baluns & Impedance Transformers, John Walker, Semelab plc
✗ Coils for RF & Microwave Applications, Steve Slenker, Piconics Inc.
✗ Capacitors for RF Applications, Michael Busse, Dielectric Labs
✗ PIN & FET RF Switches and Attenuators, Robert Caverly,
Villanova University
✗ Powdered Iron Magnetic Materials, Chris Trask, Sonoran Radio
Research
✗ Ferrites For RF Applications, Prof. Lionel Davis, University of
Manchester Institute of Science & Technology
WMG: EM BASED CAD & OPTIMIZATION OF WAVEGUIDE
COMPONENTS, PLANAR CIRCUITS & ANTENNAS
Date & Time:
Fritz Arndt, University of Bremen
Topics & Speakers:
✗ System Level Electromagnetic Analysis Through Black-Box
Representations of Components, Zoltan Cendes, Ansoft Corp.
✗ Generation of a Ultrawideband Electromagnetic Response Through
a Laguerre Expansion Using Early Time and Low Frequency Data,
Tapan Sarkar, University of Syracuse
22
Organizers:
Dr John Walker, Semelab plc
Dan Myer, Communication Power Corp.
Sponsor:
MTT-17 HF/VHF/UHF Technology
Topics & Speakers:
✗ High Resolution Imaging of Biological Tissues with Optical
Coherence Tomography, Xingde Li, University of Washington
✗ NIR Diffuse Optical Mammography, Xavier Intes, University of
Pennsylvania
✗ Near Infrared Diffusive Light Imaging with Ultrasound
Localization, Quing Zhu, University of Connecticut
✗ Hybrid Lidar-Radar for Medical Diagnostics, Linda Mullen,
NAVAIR
✗ Ultrasound-Mediated Biophotonic Imaging, Lihong Wang, Texas
A&M University
✗ Imaging Function and Gene Expression in the NIR Using Diffuse
Optical Tomography, Vasilis Ntziachristos, Harvard Medical
School
✗ Functional Optical Brain and Breast Imaging, Kambiz
Pourrezaei, Drexel University
Passive components for use at RF (1-1000MHz) present many challenges. Conventional transmission lines are generally prohibitively large
unless special shortening techniques are employed while lumped elements often exhibit unwanted resonances. Furthermore, RF applications
often involve high power levels. This Workshop is intended to serve as
both a tutorial introduction to the issues involved as well as to be a forum for presenting the latest state-of-the-art results in this field. The
topics to be covered are: Inductors, Capacitors, Ferrites/powdered iron
materials, Transformers, Couplers, Baluns, PIN diodes, RF Switches and
Attenuators.
WMI: SPECTRUM MANAGEMENT ISSUES
Date & Time:
Location:
Topics & Speakers:
✗ Henry Goldberg, Esq., Goldberg Godles Wiener & Wright
✗ Ben Dawson, Hatfield & Dawson
✗ Greg Kiemel, Northwest EMC Inc.
✗ Michael Marcus, Federal Communications Commission
✗ Chris Hardy, Comsearch
Organizers:
Afshin S. Daryoush, Drexel University
Rajeev Bansal, University of Connecticut
Arye Rosen,
Sarnoff Corp and Thomas Jefferson University
Sponsors:
MTT-10 Biological Effects & Medical Applications
Organizer:
Michael Marcus, FCC
Sponsor:
Picosecond optical pulses and modulated light at RF and microwave
frequencies are considered as new imaging modality in diffused media.
The Diffused Photon in Near Infrared region is employed to penetrate in
the biological tissue and create the medical image from the backscattered
light. The modulated light is used to enhance detection system and improve spatial resolution of the image in DPNIR, as short optical pulses
are used for high resolution images using optical coherent tomography.
On the other hand, IR spectroscopy is employed for absorption of oxygenated and de-oxygenated hemoglobin. This technique is employed to
detect breast tumor, hemorrhage deep within tissues, and human brain
function in cognitive activity.
A panel of distinguished scientists and engineers will introduce physical foundations and instrumentations for various medical applications.
Many new microwave products raise spectrum management issues
that must be resolved before the product can reach the marketplace. This
workshop will address the realities of US domestic spectrum management policies and equipment authorization policies. It will cover spectrum allocations, technical standards, and equipment authorization. The
intended audience is microwave engineers and managers who have little
or no experience with design for the commercial market. It will deal
with both how to find information about present policies as well as getting involved with policy development.
WMJ: ADVANCES IN RF MEMS TECHNOLOGY
Date & Time:
Location:
WML: WIRELESS MICROSENSORS: TECHNOLOGY & APPLICATIONS
Topics & Speakers:
✗ Gabriel Rebeiz and John Smith, UoM and DARPA
✗ Large Force Electrostatic MEMS Relay for DC to 20GHz,
Tomonori Seki and Mitsuru Fujii, Omron
✗ The 10 Billion Cycle Lincoln Labs MEMS Switch: Technology and
Packaging, Craig Keast, Mark Gouker and Jeremy Muldavin,
Lincoln Labs
✗ Development of Miniature X-band Low-Loss Phase Shifters,
Jeffrey F DeNatale, Rockwell Scientific
✗ Millimeter-wave Packaged MEMS Switches for Space Application,
Pierre Blondy, University of Limoges
✗ Vaccum Packaging of RF MEMS, Clark Nguyen, University of
Michigan/DARPA
Organizers:
Gabriel Rebeiz, University of Michigan
John Smith, DARPA–Consultant
Sponsor:
MTT-21 RF MEMS & Micromachining
and Nanotechnology
Location:
✗ Pico Radio Technology and Applications, Jan M. Rabaey,
University of California-Berkeley
✗ Low-Power RF CMOS, Thomas H. Lee, Stanford University
✗ Sensor Webs for Planetary Exploration and Monitoring, Kevin A.
Delin, Jet Propulsion Laboratory
✗ Military Applications and Communication Requirements for
Microsensors, Gary A. Shaw, MIT Lincoln Laboratory
✗ Sensing, Signal Processing, and Networking for Distributed
Wireless Microsensors, William J. Kaiser, Sensoria Corp. & UCLA
Organizers:
Gregory Lyons, MIT Lincoln Laboratory
Roger Kaul, Johns Hopkins University
Sponsors:
Dramatic advances in wireless technology and the advent of low-power
RF systems have enabled the application of small, wireless sensors, or microsensors, to a variety of problems beyond the capability of wired sensors.
Many applications involve a network of microsensors. Individual highly
intelligent, long-lived microsensors will also enable new capability. Applications range from planetary exploration using microsensor networks (sensor webs) to automotive, industrial, and military sensing. This workshop
will cover a sampling of applications in a variety of physical environments,
as well as the technologies that enable wireless microsensors. Low-power
RF and digital circuitry result in long-lived battery-powered radios. Future efforts will scavenge energy from the microsensor’s environment to
WMK: MICROWAVE PHOTONICS FOR MEDICAL IMAGING
Monday, June 3; 1:00 to 5:00 PM
Location:
Topics & Speakers:
RF-MEMS are rapidly advancing, and new devices (switches, varactors, tunable networks, etc.) are being developed every month. This
workshop presents the latest technological achievements in this new and
dynamic area.
Date & Time:
Date & Time:
23
MONDAY
MONDAY WORKSHOPS
MONDAY WORKSHOPS
MONDAY
power the electronics or significantly supplement the battery power.
Workshop discussion will cover the tradespace of digital processing within
each microsensor versus energy requirements for node-to-node or gateway
(to/from network) communication. Moore’s Law continues to make digital
processing (microsensor intelligence) more powerful and more energy efficient. Energy required for communication tends to depend more on the
physics of RF propagation in the physical environment than on the RF system implementation. The present outlook and future directions for wireless microsensors will be discussed.
WMN: MODELING OF RF MEMS SWITCHES
Location:
Yohtaro Umeda, NTT Electronics Corp.
Hermann Boss, Rohde & Schwarz GmbH & Co. KG
Sponsor:
MTT-9 Digital Signal Processing
✗ Thermal Modeling and Contact Physics of MEMS Switches, Nick
McGruer, Northeastern University
✗ Dielectric Charging: Modeling, Effects and Solutions, James Reid,
AFRL/SNHA
✗ Dynamic Modeling of the Actuation Mechanism of Electrostatic
MEMS Switches, Dr. Jeremy Muldavin, Lincoln Labs
✗ Electromagnetic Modeling and Equivalent RLC Circuits of RFMEMS Devices, Scott Barker, University of Virginia
✗ Large Displacement Electromechanical Modeling of MEMS
Devices, James Marchetti, Corning Intellisense
✗ Integrated Design and Modeling of RF-MEM Devices, W. Scott
Best, Coventor
Topics & Speakers:
✗ Universal Mobile Telecommunication System (UMTS), Gottfried
Schnabl, Siemens AG, Information and Communication Mobile
✗ RF-Sampling Converters for Mobile Radio Systems, Armin O.
Splett, Siemens AG
✗ Communicating Near Range Sensor System for Automotive
Application, Stefan Lindenmeier, DaimlerChrysler Research and
Technology Center
✗ The Overview and Future Evolution of High-Speed Channel
Technologies in Optical Transport Network, Yutaka Miyamoto,
NTT Network Innovation Laboratories
✗ Ultra-High-Speed Technologies and Circuits for 40 Gb/s and
Higher Lightwave Transceivers, Yves Baeyens, Lucent Technologies
— Bell Laboratories
✗ Design for the Small Form 10 gigabit Ethernet Transceiver,
Nobuharu Kami, Networking Research Laboratories, NEC Corp.
✗ Recent Progress in mm-Wave Photonic Component Technologies
for Broadband Wireless Access Systems, Tadao Nagatsuma, NTT
Telecommunications Energy Laboratories
Organizers:
Location:
Topics & Speakers:
WMM: MICROWAVE AND LIGHTWAVE SYSTEM ARCHITECTURES,
SIGNAL PROCESSING, LIMITATIONS AND NOISE
Date & Time:
Date & Time:
Organizers:
Gabriel Rebeiz, University of Michigan
Harvey Newman, Naval Research Laboratory
Sponsor:
MTT-21 RF MEMS & Micromachining
and Nanotechnology
The half-day workshop will present the latest modeling tools for
electromechanical, thermal, and electromagnetic analysis of RF-MEMS
devices. The role of CAD in RF MEMS, and where it really makes a difference, will be discussed. The limitation of RF MEMS devices in terms
of speed, power handling, thermal consideration, and how CAD can help
solve these problems will be presented.
WMO: DIFFERENTIAL DEVICE CHARACTERIZATION & MODELING
Date & Time:
Location:
Topics & Speakers:
✗ Joel Dunsmore, Greg Amorese and Wayne Smith, Agilent
Technologies
✗ Vahe Adamian and David Ballo, Agilent Technologies
✗ Uwe Arz, Dylan Williams and Uwe Arz, PTB; Dylan
Williams, National Institute of Standards and Technology
✗ Vahe Adamian, Agilent Technologies
✗ Robert Stengel, Motorola
Since 1940s the microwave technologies have been used in various
systems such as radars and wireless communication systems. In recent 20
years, these technologies have been applied to baseband signal processing
in fiber-optic communication systems. In addition, the mobile phones
have been spread out to almost every person in many countries. Recently, the anti-collision radars have been attached to automobiles and the
software receivers have been developed using sampling converters. Moreover, the microwave-photonic systems, which incorporating microwave
and lightwave technologies, have been rising. For the engineers who try
to apply microwave technologies to such various systems, the knowledge
of the target system is essential. In particular, the information about the
system requirements for electronic/photonic components is crucial. This
workshop presents the outline and requirements of the state-of-the-art
wireless/lightwave systems where microwave techniques are used as key
technologies. The topics range over the air interface and the RF-sampling converters for the third generation mobile phones, the communicating sensor system for automotive radar systems, the optical transport
network terminal and the integrated circuits for 40 Gbit/s and higher
core-network fiber-optic systems, the transceiver module for 10 gigabit
ethernet systems, and the millimeter-wave photonic components for
broadband wireless access systems. System architectures, signal-processing methods, limitation factors of system performance, and system requirements, such as flexibility, cost, bandwidth, power, linearity, dynamic range, sensitivity, and noise figure, will be discussed in detail
from the standpoint of both systems and components. The key technologies, such as modulation methods, digital techniques, integration techniques, packaging techniques, and photonic techniques, to extend the
limits and meet the requirements will be demonstrated in the above systems. In addition, the prospect of the technologies for future
wireless/lightwave systems will be discussed and the directions in research and development of these systems will be provided.
Organizers:
Greg Amorese, Agilent Technologies
Sadonna Cody, Agilent Technologies
Sponsors:
MTT-11 Microwave Measurements
MTT-14 Microwave Low-Noise Techniques
Differential devices are finding wide application in RF circuit design
due to their highly desirable noise immunity and density. However the
proper use of these devices is constrained by the designer’s ability to accurately characterize available devices for each specific circuit design.
Measurement of these devices presents significant challenges.
This workshop will cover both the theoretical operating modes and
measurement of these devices as well as the interaction of measurement
techniques and modeling approaches. Symmetric and Asymmetric cases
and signal integrity issues will be covered. Proper differential fixturing
and error correction techniques will also be discussed. Practical design
examples will be used to enhance the understanding of these challenging
topics.
24
The MTT-S Student Paper Competition encourages and recognizes
excellence in research in microwave science and technology. Two hundred and forty-one papers were submitted to the competition this year.
Among these submissions, 140 were accepted for presentation, and the
technical program committee selected 24 finalists. All of the accepted
student papers will be presented at their appropriate paper sessions. In
addition, the 24 finalists will also present their papers at the Student Paper Competition Interactive Forums on Tuesday, June 4 and Wednesday, June 5 from 1:30pm to 4:30pm. All Symposium attendees are welcome to attend these Student Paper Competition Interactive Forum sessions where final presentation and judging will occur.
Prizes will be awarded to the six best papers among the finalists. All
student finalists will be given certificates and complimentary registration to IMS2002. Cash awards in the amount of $2900 and additional
prizes have been donated by MTT-S. The National Science Foundation
and MTT-S sponsored travel subsidies to the Symposium for all the finalists.
A student awards banquet will be held at the Sheraton Hotel on
Thursday of IMS Week during which the awards will be presented. All
Student Paper Competition participants and their advisors are invited.
Following is a list of the finalists’ papers, lead authors and their respective institutions.
New Linearization Method for the Modulated Signals with High
Peak-to-average Ratio: Peak-to-average Ratio Reduction and Expansion
(WE2A) IF-TU
Youngoo Yang, Pohang University of Science and Technology, Korea
Negative Refractive Index Metamaterials Supporting 2-D Waves
(WE4C) IF-TU
Ashwin K Iyer, University of Toronto, Canada
A Time-hopping Smart Antenna Receiver Array Using a Single RF Channel
and Digital Beamforming (TU4C) IF-WE
Jonathan D Fredrick, University of California, Los Angeles, USA
45 GHz Highly Integrated Phase-locked Loop Frequency Synthesizer in SiGe
Bipolar Technology (WE2D) IF-TU
Guenter Ritzberger, Technische Universitaet Wien, Austria
Integrated Inductors in the Chip-to-board Interconnect Layer Fabricated
Using Solderless Electroplating Bonding (TH1A) IF-WE
Yeun-Ho Joung, Georgia Institute of Technology, USA
Development of RF Carbon Nanotube Resonant Circuit Sensors
for Gas Remote Sensing Applications (WE1B) IF-WE
Saurabh Chopra, Clemson University, USA
Suppression of the Parallel-plate Noise in High-speed Circuits Using a
Metallic Electromagnetic Band-gap Structure (WE) IF-TU
Ramesh Abhari, University of Toronto, Canada
Extraction of Accurate Behavioral Models for Power Amplifiers with
Memory Effects Using Two-tone Measurements (TU2F) IF-TU
Hyunchul Ku, Georgia Institute of Technology, USA
Optimum Bias Conditions for Linear Broadband InGaP/GaAs HBT Power
Amplifiers (WE3A) IF-TU
Masaya Iwamoto, University of California, San Diego, USA
High-isolation Bonding Pad with Depletion-insulation Structure for
RF/Microwave Integrated Circuits on Bulk Silicon CMOS (WE1C) IF-WE
Sang Lam, Hong Kong University of Science and Technology, China
Uncertainty Estimation and Optimal Extraction of Intrinsic FET Small
Signal Model Parameters (WE1E) IF-TU
Christian Fager, Chalmers University of Technology, Sweden
Architecture and Algorithm for High Precision Image Rejection and
Spurious Rejection Mixers Using Digital Compensation (WE2B) IF-WE
Youngjin Kim, Korea Advanced Institute of Science and Technology, Korea
Ultra Low Phase Noise SiGe HBT Application to a C-band Sapphire
Resonator Oscillator (WE1D) IF-TU
Gilles Cibiel, LAAS-CNRS, France
Optical Delivery of Modulated Millimetre-Wave Signals Using Free-running
Laser Heterodyne with Frequency Drift Cancellation (TH2F) IF-WE
Leif Johansson, University College London, England
A New X-band 180° High Performance Phase Shifter Using (Ba,Sr)Tio3 Thin
Films (TH1D) IF-WE
Baki Acikel, University of California, Santa Barbara, USA
Quasi-optical E-band MEMS Switching Arrays (TH1F) IF-WE
Weikang Zhang, University of California, Davis, USA
Low Contact-resistance Series MEMS Switches (TU3D) IF-WE
Dimitrios Peroulis, University of Michigan, USA
Field-tuneable Probe for Combined Electric and Magnetic Field
Measurements (TH1E) IF-WE
Ronald M Reano, University of Michigan, USA
A Novel Extraction Method for a Fully Electro-thermal
Large-signal Model of HBT (WE3E) IF-TU
Hyun-Min Park, Korea Advanced Institute of Science and Technology, Korea
Analysis and Design of Low-loss Planar Microwave Baluns Having Three
Symmetric Coupled Lines (TU2E) IF-WE
Jong-Wook Lee, Purdue University, USA
Intrinsic Noise Characteristics of AlGaN/GaN HEMTs (TH1B) IF-WE
Sungjae Lee, Purdue University, USA
A Microwave Communication Link with Self-heterodyne Direct Down
Conversion and System Predistortion (WE3B) IF-TU
Jin W Park, University of California, Los Angeles, USA
Neural Based Dynamic Modeling of Nonlinear Microwave Circuits
(WE4D) IF-TU
Jianjun Xu, Carleton University, Canada
Analysis of Guided Wave Structures Using 3-D Envelope-finite Element
(Evfe) Technique (WE1F) IF-TU
Hsiao-Ping Tsai, University of California, Los Angeles, USA
IF-TU: Interactive Forum presentation takes place Tuesday, June 4
IF-WE: Interactive Forum presentation takes place Wednesday, June 5
25
TUESDAY
MTT-S STUDENT PAPER COMPETITION
TUESDAY, JUNE 4, 2002
10:10–11:40
AM
TU2B MMIC Technology
TU2C Phased Arrays and Beam Steering Techniques
Chair: A. Madjar, Rafael
Co-chair: T. Lee, Boeing Satellite Systems
ROOM 606–607
Chair: B. Perlman, USA Comm.-Elect. R&D Center
Co-chair: R. Sudbury, MIT Lincoln Lab
ROOM 611–612
TU2A-1: Invited: Integrated Even Harmonic Type Direct Conversion
Receiver for W-CDMA Mobile Terminals
K. Itoh, T. Yamaguchi, T. Katsura, K. Sadahiro, T. Ikushima,
R. Hayashi, F. Ishizu, E. Taniguchi, T. Nishino, M. Shimozawa,
Mobile Communication Business Div., Mitsubishi Electric Corp.,
TU2C-1: Correlation of Nonlinear Distortion in Digital Phased
Arrays: Measurement and Mitigation
D.J. Rabideau, L.C. Howard, MIT, Lincoln Lab
TU2B-2: Ku-band MMICs in Low-cost, SMT Compatible Packages
H.C. Huang, A. Ezzeddine, A. Darwish, B. Hsu, AMCOM
Communication Inc.
TU2C-2: Planar Implementation of the Partially Overlapped
Subarrays for mm-wave Beam Steerable Antenna Applications
A. Abbaspour-Tamijani (student), K. Sarabandi (Professor/Director),
Radiation Lab, Univ. of Michigan
TU2B-3: ESD Protection of RF Circuits in Standard CMOS Process
K. Higashi, A.O. Adan, M. Fukumi, M. Hayashi, Design Technology
Development Center, IC Development Group, Sharp Corp.; N. Tanba,
T. Yoshimasu, Analog IC Div., IC Group, Sharp Corp.
TU2C-3: A Novel Multibeam Grating Antenna with Applications
to Low-cost mm-Wave Beam Steering
C.T. Rodenbeck, M-Y. Li, K. Chang, Texas A&M Univ. Electrical
Engineering Dept.
TU2A-2: Invited: An Analog Baseband Chain for a UMTs Zero-IF
Receiver in a 75 GHz SiGe BiCMOs Technology
W. Schelmbauer, J.K. University of Linz; H. Pretl, DICE Linz;
L. Maurer, INIT Linz; B. Adler, J. Fenk, Infineon Munich; R. Weigel,
INIT Linz, DICE Linz; R. Hagelauer, RIIC Linz, DICE Linz
10:50
AM
10:40
AM
10:30
AM
10:20
AM
10:10
AM
TU2A Special Session
on Radio Frequency Integrated Circuits for 3G
Chair: R. Weigel, Univ. of Linz, Austria
Co-chair: C.C.W. Ruppel, EPCOS AG
ROOM 608–609
IEEE MTT-S IMS TECHNICAL SESSIONS
TU2A-3: A 2-GHz RF Front-end Transceiver Chipset
in CMOS Technology for PCS and IMT-2000 Applications
Y-S. Youn, N-S. Kim, J-H. Chang, H-K. Yu, J-K. Kwon, K-S. Kim,
Electronics and Telecommunications Research Institute (ETRI)
TU2A-4: System Analysis of a W-CDMA Base-station PA Employing
Adaptive Digital Predistortion
C. Potter, Wireless & Multimedia Design Group, Tality UK Ltd.
TU2B-4: Novel BiCMOS Compatible, Short Channel LDMOS
Technology for Medium Voltage RF and Power Applications
A. Litwin, Ericsson Microelectronic; O. Bengtsson, Swedish Linear
Microwave; J. Olsson, Uppsala Univ.
TU2C-5: High Performance Voltage Controlled Bi-directional
Amplifiers in Support of Component Reuse for Large Aperture
Phase Array
J.M. Yang, Y.H. Chung, M. Nishimoto, R. Lai, R. Tsai, R. Kagiwada,
C.C. Yang, TRW
TU2B-5: Electromagnetic Coupling Effects in RF-CMOS Circuits
A.O. Adan, M. Fukumi, K. Higashi, M. Hayashi, IC Development
Group, Sharp Corp.; T. Suyama, M. Miyamoto, Advanced Research
Labs., Sharp Corp.
TU2C-6: Experimental Investigation of a Varactor Loaded Reflect
Array Antenna
L. Boccia, F. Venneri, G. Amendola, G. Di Massa, Dipartimento di
Elettronica, Informatica e Sistemistica, Italy
TU2B-6: Ultra Low-power VCO Based on InP-HEMT and
Heterojunction Interband Tunnel Diode for Wireless Application
A. Cidronali, G. Collodi, M. Camprini, G.Manes, Dept. Electronics and
Telecommunications, Univ. of Florence; V. Nair, J. Lewis,
H. Goronkin, PSRL, Motorola Labs.
11:40
AM
11:30
AM
11:20
AM
11:10
AM
11:00
AM
TU2C-4: Highly Integrated RF-modules for Ka-band Multiple-beam
Active Phased Array Antennas
J. Butz, M. Spinnler, Bosch SatCom GmbH; J. Christ, U. Mahr,
Marconi Communications
26
AM
TU2E Couplers, Dividers, and Baluns
TU2F Nonlinear CAD Techniques
for Circuits and System
Chair: K.C. Wang, OpNext
Co-chair: J.F. Luy, DaimlerChrysler
ROOM 615–617
Chair: C. Buntschuh, Microwave Engineering Services
Chair: J.C. Pedro, Aveiro Univ.
Co-chair: T. Brazil, Univ. College of Dublin
ROOM 613–614
ROOM 602–604
TU2D-1: A 50-Gbit/S 1:4 Demultiplexer IC In InP-based HEMT
Technology
H. Kano, T. Suzuki, S. Yamaura, Y. Nakasha, K. Sawada, T. Takahashi,
K. Makiyama, T. Hirose, Y. Watanabe, Fujitsu Lab Ltd.; M. Mizoguchi,
H. Ito, M. Nishi, Fujitsu Quantum Devices Ltd.
TU2E-1: Design of a Miniaturized Stripline-to-microstripline
Coupler
K. Rambabu, J. Bornemann, Dept. of Electrical and Computer
Engineering, Univ. of Victoria
TU2F-1: Coupled Electromagnetic/Nonlinear Optimization
of Self-oscillating Microstrip Antennas with Far-field Performance
Specifications
V. Rizzoli, A. Costanzo, E. Montanari, DEIS Univ. of Bologna, Italy
TU2D-2: A 0.15 µm GaAs MHEMT Transimpedance Amplifier IC
for 40-Gb/S Applications
C.F. Campbell, M.S. Heins, M. Kao, M. Muir, J. Carroll, TriQuint
Semiconductor, Richardson, TX
TU2E-2: A High-directivity Microstrip Directional Coupler
with Feedback Compensation
J.L. Chen, S.F. Chang, C.T. Wu, National Chung Cheng Univ.,
Dept.
of Electrical Engineering
TU2F-2: Analog Frequency Divider by Variable Order 6 to 9
F. Ramirez, E. de Cos, A. Suarez, DICOM, Univ. of Cantabria
TU2E-3: An All 50 Ω Divider/Combiner Structure
E. Turan, Army Academy, Ankara, Turkey; S. Demir, Dept. of
Electrical and Electronics Eng., Middle East Tech. Univ., Ankara,
Turkey
TU2F-3: Intermodulation Behavior in LDMOS Transistor
Amplifiers
C. Fager, H. Zirath, Microwave Electronics Lab, Chalmers Univ.
of Technology, Sweden; N.B. de Carvalho, J.C. Pedro, Institute
f Telecommunications, Univ. of Aveiro, Portugal
TU2D-3: A Fully Integrated 40-Gbit/s Clock and Data Recovery
Circuit Using InP/InGaAs HBTs
H. Nosaka, E. Sano, K. Ishii, M. Ida, K. Kurishima, T. Enoki,
T. Shibata, NTT Photonics Labs., NTT Corp.
TU2E-4: Vertical Balun and Wilkinson Divider
A. Darwish, A. Ezzeddine, H.C. Huang, AMCOM Communications Inc.;
K. Bumman, L. Joonyoul, Y. Sungwhan, POSTECH Univ., Soul, Korea
TU2F-4: Augmented Behavioral Characterization for Modeling
the Nonlinear Response of Power Amplifiers
P.M. Asbeck, M. Iwamoto, L.E. Larson, Univ. of California, San Diego;
H. Kobayashi, Fuji Electric, Japan; G. Hanington, American High
Voltage, Elko, NV; S. Nam, Seoul National Univ., Korea
TU2D-4: 40 Gb/S Optical Receiver IC Chipset — Including a
Transimpedance Amplifier, a Differential Amplifier and a
Decision Circuit — Using GaAs-based HBT Technology
Y. Amamiya, Y. Suzuki, M. Kawanaka, K. Hosoya, Z. Yamazaki,
M. Mamada, H. Takahashi, S. Wada, T. Kato, Y. Ikenaga, S. Tanaka,
T. Takeuchi, H. Hida, Photonic and Wireless Devices Research Lab,
NEC Co.
TU2E-5: Analysis and Design of a High-performance Planar
Marchand Balun
C.Y. Ng, I.D. Robertson, Microwave and Systems Research Group
(MSRG), School of Electronics, Computing and Mathematics, Univ. of
Surrey, M. Chongcheawchamnan, Mahanankorn Telecommunication
Dept., Mahanakorn Univ. of Technology, Bangkok
TU2F-5: Extraction of Accurate Behavioral Models for Power
Amplifiers with Memory Effects Using Two-tone Measurements
H. Ku, M.D. McKinley, J.S. Kenney, Georgia Institute of Technology,
School of Electrical and Computer Engineering
TU2D-5: 40-GHz MMIC for Optical Modulator Driver Applications
R. S. Virk, E. Camargo, R. Hajji, S. Parker, S. Notomi, Fujitsu
Compound Semiconductor Inc.; R. Benelbar, formerly with Fujitsu
Compound Semiconductor Inc.; H. Ohnishi, Fujitsu Quantum Devices
Ltd.
TU2E-6: Analysis and Design of Low-loss Planar Microwave Baluns
Having Three Symmetric Coupled Lines
J-W. Lee, K.J. Webb, School of Electrical and Computer Engineering,
Purdue Univ., West Lafayette, IN
TU2F-6: Statistical Modeling of the Interaction of Multiple Signals
in Nonlinear RF Systems
K.M. Gharaibeh, M.B. Steer, Dept. of Electrical and Computer
Engineering, N. Carolina State Univ.; K. Gard, QUALCOMM CDMA
Technologies Inc.
11:40
AM
11:30
AM
11:20
AM
11:10
AM
11:00
AM
10:50
AM
27
TUESDAY
10:40
AM
10:30
AM
10:20
AM
10:10
TU2D Integrated Circuits for 40Gb/s Fiber Systems
TU3A Silicon Substrate and Inductor Modeling
TU3B SiGe RFIC Process Technologies
Chair: A. Gupta, Anadigics
Co-chair: A. Westwick, Silicon Lab
ROOM 608–609
Chair: K. Ashby, Microtune Inc.
Co-chair: B. Xavier, National Semiconductor
ROOM 606–607
1:20–3:00
PM
TU3C Integrated Passives for RF
and mm-Wave Applications
Chair: K. Kornegay, School of ECE, Cornell Univ.
ROOM 611–612
TU3B-1: Invited: Review of SiGe BiCMOS Process Technology
and Its Impact on RFIC Design
Motorola
TU3C-1: High Quality Factor and High Self-resonant Frequency
Monolithic Inductor for mm-Wave Si-based ICs
É. Tournier, J. Graffeuil, LAAS/CNRS and Univ. P. Sabatier, Toulouse,
France; C. Boulanger, Toulouse, France; I. Telliez,
STMicroelectronics, Croll
TU3A-2: Modeling of Frequency Dependent Losses in Two-port and
Three-port Inductors on Silicon
T. Kamgaing, T. Myers, Mel Miller, Motorola Inc., Semiconductor
Product Sector, Tempe, AZ
TU3B-2: Invited: High Performance Circuits in 0.18 mm SiGe
BiCMOS Process for Wireless Applications
P. Ye, Conexant Systems
TU3C-2: Two-port Type Ferromagnetic RF Integrated Inductor
T. Kuribara, K-I. Arai, RIEC, Tohoku Univ.
TU3A-3: Characterization and Modeling of On-chip Inductor
Substrate Coupling Effect
C-J. Chao, M-J. Chen, Institute of Electronics Engineering, National
Chiao-Tung Univ., Taiwan, ROC; S-C. Wong, Acer Labs Inc., Taipei,
Taiwan, ROC; C-J. Hsu, L-Y. Leu, Winbond
TU3B-3: Low Frequency Noise Figures of Merit in RF SiGe HBT
Technology
J. Tang, G.F. Niu, Z. Jin, J.D. Cressler, S. Zhang, Auburn Univ.
Electrical and Computer Engineering Dept.; A.J. Joseph, D.L. Harame,
IBM Microelectronics
TU3C-3: RF MIM Capacitors Using High-K Al2O3 and Altiox
Dielectrics
S.B. Chen, J.H. Chou, A. Chin, Dept. of Electronics Eng., National
Chiao Tung Univ., Hsinchu, Taiwan; J.C. Hsieh, J. Liu, United
Microelectronics Corp.
TU3A-4: Characterization and Modeling of Small-signal Substrate
Resistance Effect In RF CMOS
Y-S. Lin, T-H. Lee, H-B. Liang, National Chi-Nan Univ. Electrical
Engineering Dept.; S-S. Lu, National Taiwan Univ. Electrical
Engineering Dept.
TU3B-4: Com2 Enhanced Graded Base SiGe Technology for High
Speed Applications
T. Ivanov, M. Carroll, S. Moinian, M. Mastrapasqua, M. Frei, A. Chen,
C. King, A. Hamad, E. Martin, S. Shive, T. Esry, C. Lee, R. Johnson,
T. Sorsch, M. S. Carroll, K. Banoo, P. Smith, L. Bizzarro, W. Cochran,
Agere Systems, Murray
TU3C-4: Performance Analysis of Monolithic RF Transformers
by Experimental Characterization
T. Kamgaing, T. Myers, M. Miller, F. Ling, Motorola, Semiconductor
Product Sector, Tempe, AZ
TU3A-5: A New Method for the Computation of the Substrate
Parasitics of Octagonal Inductors
W. Tatinian, Modeling Ingeneer Alcatel Microelectronics, PhD
Student L2MP; P. Pannier, Maitre de Conferences, Ecole
Polytechnique Universitaire de Marseille; R. Gillon, Competence
Leader Modeling and Characterisation Alcatel Microele
TU3B-5: Advanced Passive Devices for Enhanced Integrated RF
Circuit Performance
D. Coolbaugh, E. Eshun, D. Harame, J. Johnson, M. Hammad, Z. He,
V. Ramachandran, S. St Onge, K. Watson, IBM Corp, Essex Junction,
VT; R. Groves, K. Stein, S. Subbanna, R. Volant, IBM Corp, Hopewell;
D. Wang, X. Wang
TU3C-5: Lumped and Distributed Lattice-type LC-Baluns
W. Bakalski, W. Simbuerger, H. Knapp, H.-D. Wohlmuth, Infineon
Technologies; A.L. Scholtz, The Institute of Communications
and Radio-Frequency Engineering, Technical Univ. of Vienna
TU3C-6: Design of a Novel Lumped Element Backward Directional
Coupler Based on Parallel Coupled-line Theory
T-Y. Song, J-H. Kim, S-H. Kim, J-S. Park, Div. of Information
Technology Eng., Soonchunhyang Univ., Asan, Korea; J-B. Lim, Dept.
of EE Eng., Kookmin Univ., Seoul, Korea
2:50
PM
2:40
PM
2:30
PM
2:20
PM
2:10
PM
2:00
PM
1:50
PM
1:40
PM
1:30
PM
1:20
PM
TU3A-1: Invited: Modeling of Passive Elements with Asitic
A. Niknejad, UC Berkeley
28
TU3D RF MEMS Switch Design and Modeling
TU3E Frequency Conversion Circuits
Chair: T. Weller, Univ. of South Florida
Co-chair: C. Goldsmith, Cogent Solutions Inc.
ROOM 615–617
Chair: E. Camargo, Fujitsu Compound Semicon. Inc.
Co-chair: M. Goldfarb, Analog Devices
ROOM 602–604
TU3D-1: Toggle-switch — A New Type of RF MEMs Switch
for Power Applications
B. Schauwecker, K.M. Strohm, J-F. Luy, DaimlerChrysler AG;
W. Simon, J. Mehner, IMST GmbH Kamp Lintfort, Germany
TU3E-1: A Balanced Resistive Mixer Avoiding an IF Balun
Thomas A. Bös, E. Camargo, Fujitsu Compound Semiconductor Inc.
TU3D-2: Low Contact-resistance Series MEMs Switches
D. Peroulis, K. Sarabandi, L.P.B. Katehi, Univ. of Michigan
TU3E-2: A Compact L-band LTCC Mixer with High Image Rejection
G. Passiopoulos, K. Lamacraft, Nokia Networks, Camberley, UK.
TU3D-3: High-isolation BST-MEMs Switches
Y. Liu, T.R. Taylor, J. Speck, R.A. York, Univ. of California, Santa
Barbara, Electrical and Computer Engineering Dept., Materials Dept.,
Santa Barbara, CA
TU3E-3: An Even Harmonic Mixer Using Self Biased Anti Parallel
Diode Pair
M. Shimozawa, E. Taniguchi, N. Suematsu, Y. Isota, T. Takagi,
Information Technology R&D Center, Mitsubishi Electric Corp.;
T. Katsura, K. Maeda, T. Ikushima, K. Itoh, Mobile Comm. Business
Div., Mitsubishi Electric Corp.
TU3D-4: RF MEMs Capacitive Switches Fabricated with HDICP CVD
SINX
C.H. Chang, J.Y. Qian, B.A. Cetiner, Q. Xu, M. Bachman, F. De Flaviis,
G.P.Li, Univ. of California at Irvine, Electrical and Computer
Engineering Dept., Irvine, CA; H.K. Kim, Y. Ra, Bethel Material
Research, Placentia, CA
TU3D-5: A Study of Thermal Effects in RF-MEM-switches Using a
Time Domain Approach
W. Thiel, K. Tornquist, R. Reano, L.P.B. Katehi, Univ. of Michigan,
Radiation Lab, Electrical Engineering and Computer Science
TU3E-4: A Monolithic, 2 to 18 GHz Upconverter
L.M. Devlin, A.W. Dearn, G.A. Pearson, Plextek Ltd.; P.D.L. Beasley,
G.D. Morgan, QinetiQ
TU3D-6: Steady State Thermal Analysis and High-power Reliability
Considerations of RF-MEMs Capacitive Switches
J. Rizk, E. Chaiban, G.M. Rebeiz, Univ. of Michigan, Ann Arbor,
Radiation Lab, EECS Dept., Ann Arbor, MI
2:50
PM
2:40
PM
2:30
PM
2:20
PM
2:10
PM
2:00
PM
1:50
PM
TUESDAY
1:40
PM
1:30
PM
1:20
PM
NOTES
29
TU4A Active Device Modeling and Characterization
TU4B RFIC Power Amplifier Technologies
Chair: J. Staudinger, Motorola
Co-chair: P. Murphy, Univ. College Cork
ROOM 608–609
Chair: B. Xavier, National Semiconductor
Co-chair: K. Ashby, Microtune Inc.
ROOM 606–607
3:30–5:00
PM
TU4C Smart Antennas
and Digital Beam Forming Techniques
Chair: M. Thursby, SkyCross Inc.
Co-chair: W. Shiroma, Univ. of Hawaii
ROOM 611–612
TU4A-1: Invited: Robust High Voltage SiLDMOS Model Extraction
Process to Achieve First Pass Linear RFIC Amplifier Designs
J. Pla, Motorola
TU4B-1: Invited: RF Power Semiconductor Devices for Portable
Communications
C. Weitzel, Motorola
TU4C-1: Digital Beamforming and Calibration for Smart
Antennas Using Real-time FPGA Processing
T.W. Nuteson, J.S. Clark IV, D.S. Haque, G.S. Mitchell,
The Aerospace Corp.
TU4A-2: Large-signal Modeling of GaN FET
and Nonlinearity Analysis Using Volterra Series
S.S. Islam, A.F.M. Anwar, Univ. of Connecticut, Dept. of Electrical
and Computer Engineering
TU4B-2: SiGe/Si Power HBTS for X- to K-band Applications
S. Mohammadi, Z. Ma, J. Park, P. Bhattacharya, L.P.B. Katehi, Univ.
of Michigan, EECS Dept.; G.E. Ponchak, S.A. Alterovitz, NASA Glen
Research Center; K.M. Strohm, J-F. Luy
TU4C-2: A Time-hopping Smart Antenna Receiver Array Using a
Single RF Channel and Digital Beamforming
J.D. Fredrick, Y. Wang, S-S. Jeon, T. Itoh, Univ. of California, Los
Angeles, Electrical Engineering Dept., Los Angeles, CA
TU4A-3: Direct Parameter Extraction on RF-CMOS
F.X. Pengg, CSEM Swiss Center for Electronics and Microtechnology
Inc.
TU4B-3: RF Power Characteristics of SiGe Heterojunction Bipolar
Transistor with High Breakdown Voltage Structures
T. Matsuno, Semiconductor Device Research Center, Semiconductor
Co., Matsushita Electric Industrial Co., Ltd.; K. Nishii, Semiconductor
Device Research Center, Sem; S. Sonetaka, Y. Toyoda, N. Iwamoto
TU4C-3: A 62/66 GHz Frequency Offset Retrodirective Array
N.B. Buchanan, T. Brabetz, V.F. Fusco, The Dept. of Electrical
and Electronic Engineering, Queens Univ. Belfast
TU4A-4: Low Frequency Noise Characterization and Modeling of
Microwave Bipolar Devices: Application to the Design of Low
Phase Noise Oscillator
L. Bary, G. Cibiel, J. Rayssac, A. Rennane, O. Llopis, R. Plana,
J. Graffeuil, Laboratory for Analysis and Architecture of Systems,
Toulouse, France; M. Regis, SiGe Semiconductor, Ottawa, Ontario,
CAN; M. Borgarino, Univ. of
TU4B-4: Design Techniques for Improved Performance of Small
Outline Packages
L.E. Larson, Univ. of California, San Diego; D. Jessie,
Univ. of California, San Diego and QUALCOMM
TU4C-4: Compact Beamforming Matrix Module for Use
in Multibeam Communications Satellites
W.P. Kornrumpf, GE Research and Development Center, Schenectady,
NY; A.W. Jacomb-Hood, R. Melcher, Lockheed Martin CPC, Newtown,
PA
TU4A-5: Linearity Analysis of CMOS for RF Application
S. Kan, B. Cho, B. Kim, Pohang Univ. of Science and Technology
Electronic and Electrical Engineering Dept.
TU4B-5: Spiral Inductor Performance in Deep-submicron, Bulk
CMOS with Copper Interconnects
W.B. Kuhn, A.W. Orsborn, M.C. Peterson, S.R. Kythakyapuzha,
A.I. Hussein, J. Zhang, J. Li, E.A. Shumaker, N.C. Nair, Kansas State
Univ., Manhattan, KS
TU4C-5: Smart Antenna System Implementation Based on Digital
Beamforming and Software Radio Technologies
J. Wu, W-X. Sheng, K-P. Chan, W-K. Chung, K-K. M. Cheng, K-L. Wu,
Dept. of Electronic Engineering, The Chinese Univ. of Hong Kong
5:00
PM
4:50
PM
4:40
PM
4:30
PM
4:20
PM
4:10
PM
4:00
PM
3:50
PM
3:40
PM
3:30
PM
30
Chair: N. Scott Barker, Univ. of Virginia
Co-chair: K. Varian, Raytheon Co.
ROOM 615–617
Chair: M. Madihian, NEC USA
Co-chair: B. Nelson, Sirenza
ROOM 602–604
TU4D-1: RF Power Handling of Capacitive RF MEMs Devices
B.W. Pillans, J.L. Kleber, C.L. Goldsmith, M.D. Eberly, Raytheon
Systems Co
3:40
PM
TU4E-2: Integrated Quadrupler Circuit in Coplanar Technology
for 60 GHz Wireless Applications
M. Schefer, Agilent Technologies, Wireless Semiconductor Div., S
anta Clara, CA
TU4D-2: A Very-low-loss 2-bit X-band RF MEMs Phase Shifter
G.L. Tan, G.M. Rebeiz, Univ. of Michigan, Ann Arbor, Ann Arbor, MI;
R.B. Mihailovich, J.B. Hacker, J.F. DeNatale, Rockwell Scientific
3:50
PM
TU4E-1: Miniaturized and Broadband V-band Balanced Frequency
Doubler for Highly Integrated 3-D MMIC
K. Nishikawa, T. Nakagawa, K. Araki, NTT Network Innovation Lab;
B. Piernas, Fujitsu Compound Semiconductor Inc.
TU4D-3: A Low-loss Ka-band Distributed MEMS 2-bit Phase Shifter
Using Metal-air-metal Capacitors
J.S. Hayden, G.M. Rebeiz, Univ. of Michigan, Radiation Lab
4:10
PM
4:00
PM
TU4E-3: Some Rules for the Choice of the C(V) Characteristic
for the Design of Frequency Triplers with Symmetrical Varactors
J.M. Duchamp, P. Ferrari, LAHC, Univ. de Savoie, Cedex, France;
J.W. Tao, ENSEEIHT-LEN7, INP Toulouse, Toulouse Cedex, France;
D. Lippens, IEMN, UST de Lille, Cedex, France
TU4D-4: V-band Low-loss and Low-voltage Distributed MEMs
Digital Phase Shifter Using Metal-air-metal Capacitors
H.T. Kim, J.H. Park, Y.K. Kim, Y. Kwon, Center for 3-D mm-Wave
Integrated Systems, Seoul National Univ.,Korea
TU4E-5: Tunable Inverted-microstrip Phase Shifter Device Using
Nematic Liquid Crystals
C. Weil, R. Jakoby, Darmstadt Univ. of Technology, Institute
of Microwave Engineering, Germany; G. Luessem, Merck KGaA,
Liquid Crystal Div., Darmstadt, Germany
TU4D-5: Differential Multi-finger MEMs Tunable Capacitors
for RF Integrated Circuits
G.V. Ionis, Columbia Univ., Dept. of Electrical Engineering;
A. Dec, K. Suyama, Epoch Technologies, LLC
5:00
PM
4:50
PM
4:40
PM
4:30
PM
4:20
PM
TU4E-4: Microwave Variable Delay Line Using a Membrane
Impregnated with Liquid Crystal
T. Kuki, H. Fujikake, H. Kamoda, T. Nomoto, NHK Science
and Technical Research Lab
31
ALSO
OCCURRING
Tuesday, June 4, 5:30–10:30 PM
MTT-S Special Tuesday Evening Event,
Tillicum Village
A unique Northwest experience is available on Tuesday
evening, June 4th from 5:30 PM to 10:30 PM. Leave Seattle on a
boat cruise to Blake Island while enjoying the view of islands,
mountains and the Seattle skyline. Once there, savor a delicious buffet inside the huge cedar longhouse featuring Northwest Coast Indian-style baked salmon. The evening includes a
spectacular dance show by the Tillicum Village Dancers, who
bring to life the dances and legends of the Northwest Coast.
Tickets are limited; transportation is included.
TUESDAY
TU4E Frequency and Phase Control Circuits
3:30
PM
TU4D Application of RF MEMS
TUESDAY, JUNE 4, 2002 • IF-TU INTERACTIVE FORUM • 1:30–4:30
PM
WSCTC • CHAIR: RICK LUTZ, MAXIM INTEGRATED PRODUCTS • ROOM 6E
IFTU-1: Harmonic Rejection Filters for the Dominant and Higher Waveguide Modes Based
in the Slotted Strips
A.A. Kirilenko, L.P. Mospan, Usikov Institute for Radiophysics and Electronics of the National Academy
of Sciences of Ukraine
IFTU-2: A Novel Compact mm-Wave Diplexer
E. Ofli, R. Vahldieck, Swiss Federal Institute of Technology, Lab for Electromagnetic Fields
and Microwave Electronics
IFTU-3: Broadband TEM-mode Planar-rectangular Dielectric Waveguide Bandpass Filter
and its Miniaturization
A.C. Kundu, TDK R&D Corp., Phoenix, AZ
IFTU-4: λ4 Stepped-impedance Resonator Bandpass Filters Fabricated on Coplanar Waveguide
A. Sanada, H. Takehara, T. Yamamoto, I. Awai, Dept. of EE Engineering, Yamaguchi Univ.
IFTU-5: A Stepped Cavity Resonator with Optimized Spurious Performance and Its Applications
to BPFS
K. Konno, M. Kubota, Antenna Giken Co., Ltd.
IFTU-6: Efficient Analysis of Waveguide Filters by the Integral Equation Technique
and the Bi-RME-method
V.E. Boria, S. Cogollos, Univ. Politecnica de Valencia, Dpto. Comunicaciones, Valencia, Spain;
M. Bozzi, F. Bruni, G. Conciauro, L. Perregrini, Univ. of Pavia, Dept. of Electronics, Pavia, Italy;
B. Gimeno, Univ. de Valencia
IFTU-7: Generation of RF Pulsewidth Modulated Microwave Signals Using Delta-Sigma
Modulation
J.S. Keyzer, R. Uang, M. Iwamoto, P.M. Asbeck, I. Galton, Univ. of California, San Diego; Y. Sugiyama,
Hitachi Metals, Ltd.
IFTU-8: Using Silicon-Germanium Mainstream BiCMOS Technology For X-band and LMDS
(25–30 GHz) Microwave Applications
S. Subbanna, R. Groves, B. Jagannathan, G. Freeman, E. Eld, D. Ahlgren, B. Martin, D. Herman,
B. Meyerson, IBM Microelectronics
IFTU-9: Low Frequency Noise in Boron Doped Poly-SiGe Resistors
K.M. Chen, G.W. Huang, National Nano Device Lab; T.H. Yang, National Chiao Tung Univ. Materials
Science and Eng. Dept.; H.J. Huang, C.Y. Chang, National Chiao Tung Univ. Electrons Eng. Dept.
IFTU-10: A Fully-integrated Broadband Amplifier MMIC Employing a Novel Chip Size Package
Y. Yun, M. Katsuno, K. Minagawa, T. Tanaka, M. Nishijima, H. Ishida, T. Nobusada, Semiconductor
Device Research Center, Matsushita Electric Industrial Co., Ltd.
IFTU-11: RF Performance Tradeoffs of SiGe HBT Fabricated by Reduced Pressure Chemical Vapor
Deposition
B. Mheen, D. Suh, H.S. Kim, S-Y. Lee, C-W. Park, S-H. Kim, K-H. Shim, J-Y. Kang, Advanced
Microelectronics Lab, Electronics and Telecommunications Research Institute
IFTU-12: A Novel Equivalent Circuit and Modeling Method for Defected Ground Structure
and its Application to Optimization of a DGS Lowpass Filter
J-H. Kim, J-H. Lee, S-H. Kim, J-S. Park, Div. of Information Technology Eng, Soonchunhyang Univ.;
Asan, Korea; S-H. Myung, Ansoft, Korea
IFTU-13: Microwave Planar Active Filters in GaAs and SiGe Technologies
H. Bazzi, F. Biron, S. Bosse, L. Delage, B. Barelaud, L. Billonnet, B. Jarry, IRCOM — Univ. of Limoges
IFTU-14: GSM 900/DCS 1800 Fractional-N Modulator with Two-point-modulation
B. Neurauter, Institute for Communications and Information Engineering, Univ. of Linz, Austira;
G. Märzinger, A. Schwarz, DICE Danube Integrated Circuit Engineering, Linz, Austria; R. Vuketich,
R. Weigel, J. Fenk, M. Scholz
IFTU-15: On The Stability of mm-Wave Power Amplifiers
L.A. Samoska, S. Weinreb, D. Dawson, Caltech-Jet Propulsion Lab; K.Y. Lin, H. Wang, National Taiwan
Univ.; Y.H. CHung, M. Aust, TRW
IFTU-16: Output Harmonic Termination Techniques for AlGaN/GaN HEMT Power Amplifiers
Using Active Integrated Antenna Approach
Y. Chung, C.Y. Hang, S. Cai, C.P. Wen, K.L. Wang, T. Itoh, Univ. of California, Los Angeles,
Dept. of Electrical Engineering, Los Angeles, CA; Y. Qian, Microsemi Corp.
IFTU-17: An Advanced 2 W High Power Amplifier for CDMA 900 MHz System
T.H. Kim, J.C. Lee, J.H. Kim, B. Lee, N.Y. Kim, C.S. Kim, K.Y. Lee, Kwangwoon Univ., Seoul, Korea;
J.H. Moon, VSWR, An-yang, Korea
IFTU-18: 2W Ku-band Coplanar MMIC HPA Using HBT for Flip-chip Assembly
J.P. Fraysse, O. Vendier, M. Soulard, Alcatel Space Industries; P. Auxemery, United Micro. Semicond.
IFTU-19: 1 and 2 W MMIC Power Amplifiers for Commercial K/Ka-band Applications
J.M. Schellenberg, Schellenberg Associates
IFTU-20: Characteristics of Microwave Power GaN HEMTs on 4" Si Wafers
S. Manohar, A. Narayanan, A. Keerti, A. Pham, Clemson Univ.; R. Borges, K. Linthicum, Nitronex Corp.
IFTU-21: Intercept Point Behavior of Ka-band GaAs High Power Amplifiers
T. Merkle, A. Tessmann, S. Ramberger, Fraunhofer Institute for Applied Solid State Physics
IFTU-22: Traveling-wave Tube Amplifier Performance Evaluation and Design Optimization
for Applications in Multi-level Digital Communications
J. Qiu, D. Abe, B.G. Danly, B. Levush, Naval Research Lab, Washington, DC; T.M. Antonsen, Jr.,
Univ. of Maryland, College Park, MD
IFTU-23: An Adaptive Volterra Predistorter for the Linearization of RF High Power Amplifiers
A. Zhu, T.J. Brazil, Dept. of Electronic and Electrical Engineering, Univ. College Dulbin, Ireland
IFTU-24: A Low Cost Traveling Wave Tube for Wireless Communications
B.K. Vancil, FDE Inc.; E.G. Wintucky, NASA Glenn Research Center
IFTU-25: Effects of Anti-aliasing Filters in Feedback Path of Adaptive Predistortion
W. Shan, Competence Center for Circuit Design, Dept. of Electroscience, Lund Univ., Lund, Sweden;
L. Sundström, Ericsson Mobile Platforms AB, Scheelevägen Lund, Sweden
IFTU-26: Error Signal Reuse in a Feedforward Amplifier
A. Khanifar, M. Gurvich, B. Vassilakis, Powerwave Technologies Inc.
IFTU-27: RF-interconnect for Multi-GBPS Digital Interface Based on 10 GHz RF Modulation
n 0.18 µm CMOS
H. Shin, Z. Xu, M.F. Chang, Univ. of California, Los Angeles
IFTU-28: 50 GHz High Output Voltage Distributed Amplifiers for 40 Gb/s EO Modulator Driver
Application
C.H. Yuen, K.G. Laursen, D.N. Chu, K.A. Mar, OEpic Inc.
IFTU-29: Development of 4-GSPS 2-bit ADC with GaAs ICs For Radio Astronomy
M. Okiura, Dept. of Astronomy, School of Science, The Univ. of Tokyo; S. Iguchi, S.K. Okumura,
Nobeyama Radio Observatory; M. Momose, Institute of Astrophysics and Planetary Science, Ibar;
K. Matsumoto, N. Kawaguchi
IFTU-30: 0.25 µm PHEMT 40Gb/S E/O Modulator Drivers
J.M. Carroll, M. Coutant, M.S. Heins, C.F. Campbell, E. Reese, TriQuint Semiconductor Texas,
Richardson, TX
IFTU-31: Suppression of the Parallel-plate Noise in High-speed Circuits Using a Metallic
Electromagnetic Band-gap Structure
R. Abhari, G.V. Eleftheriades, Univ. of Toronto, The Edward S. Rogers Sr. Dept. of Elec. and Comp. Eng.
IFTU-32: Results on a Direct Digital Receiver Operated with Fast Learning Networks
IFTU-33: A 6.5 mW Receiver Front-end for Bluetooth in 0.18 µm CMOS
F. Beffa, R. Vogt, W. Baechtold, Swiss Federal Institute of Technology (ETH); E. Zellweger, Asulab S.A.,
Marin, Switzerland; U. Lott, Acter A.G., Zurich, Switzerland
IFTU-34: An Active SiGe Sub-harmonic Direct-conversion Receiver Front-end
for 5-6 GHz Band Applications
R.M. Svitek, S. Raman, Virginia Tech, Bradley Dept. of Electrical and Computer Engineering;
D.A. Johnson, M/A-COM Integrated Semiconductor Business Unit
IFTU-35: Soft Breakdown and Hot Carrier Reliability for CMOS RF Mixers
Q. Li, J.S. Yuan, Chip Design and Reliability Lab, School of Electrical Engineering & Computer Science,
Univ. of Central FL; J. Zhang, VLSI Tech. Lab, Agere Systems, Orlando, FL
IFTU-36: High-Q Copper Inductors on Standard Silicon Substrate
with a Low-K BCD Dielectric Layer
H. Xiao, K.J. Chen, P.C-H. Chan, Hong Kong Univ. of Science and Technology
IFTU-37: Geometry and Bias Current Optimization for SiGe HBT Cascode
Low-noise Amplifiers
Q. Liang, G.F. Niu, J.D. Cressler, Auburn Univ. Electrical and Computer Engineering Dept.; S. Taylor,
Maxim Integrated Products; D.L. Harame, IBM Microelectronics
IFTU-38: High Linearity Low-K BCD-bridged AlGaAs/InGaAs Power HFETs
H-C. Chiu, M-J. Hwu, S-C. Yang,Y-J. Chan, National Central Univ., Chungli, Taiwan, ROC
IFTU-39: Performance of a CMOS Bluetooth Transceiver IC with Copper RF Passives
M.T. Doan, Y. Qian, E.S. Khoo, P.B. Khannur, S.C. Rustagi, J. Shi, P.D. Foo, A.B. Ajjikuttira,
Institute of Microelectronics, Singapore
IFTU-40: Effects of Dummy Patterns and Substrate on Spiral Inductors
for Sub-micron RFICs
J-H. Chang, C-K. Kim, Dept. of EECS, Korea Advanced Institute of Science and Technology; Y-S. Youn,
H-K. Yu, Electronics and Telecommunications Research Institute (ETRI)
IFTU-41: Schottky Junction Transistors for Micropower RFICs
J. Spann, Z. Wu, P. Jaconelli, J. Yang, T J Thornton, Arizona State Univ., Dept. of Electrical Engineering
and Center for Solid State Electronics
IFTU-42: ESD Protection Design for 900 MHz RF Receiver with 8-kV HBM ESD Robustness
M-D. Ker, W-Y. Lo, C-M. Lee, Hsinchu, Taiwan, Tamarack Microelectronics Inc., Science-based Ind.
Park, Institute of Electronics, National Chiao-Tung Univ.; C-P. Chen, H-S. Kao, Hsinchu, Taiwan
IFTU-43: Improvements to Performance of Spiral Inductors on Insulators
D.J. Kelly, F.A. Wright, Peregrine Semiconductor
IFTU-44: Octave Tunable, Highly Linear, RC-ring Oscillator with Differential Fine-coarse Tuning,
Quadrature Outputs and Amplitude Control for Fiber Optic
M.A.T. Sanduleanu, D. van Goor, H. Veenstra, Philips Research Eindhoven
IFTU-45: A 2.45 GHz Fully-differential CMOS Image-reject Mixer for Bluetooth Application
P.B.Khannur, Institute of Microelectronics, Singapore; S.L.Koh, Oki Techno Centre Singapore
IFTU-47: High Performance Single Supply Power Amplifiers for GSM and DCS Applications Using
True Enhancement Mode FET Technology
E Glass, M. Shields, A. Reyes, Motorola Semiconductor Product Sector
IFTU-48: Integrated 2.4 GHz CMOS Quadrature VCO with Symmetrical Spiral Inductors and
Differential Varactors
B. Chi, B. Shi, Institute of Microelectronics, Tsinghua Univ., Beijing, China
IFTU-49: A Fully Monolithic SiGe Quadrature Voltage Controlled Oscillator Design
for GSM/DCS-PCS Applications
D. Cordeau, H. Cam, G. De Astis, ACCO, 78100 Saint-Germain-en-Laye, France; J.M. Paillot,
L. Dascalescu, LAII-ESIP, IUT d’AngoulÍme 4, AngoulÍme, France
IFTU-50: Hot Carrier And Soft Breakdown Effects on VCO Performance
E. Xiao, J.S. Yuan, Univ. of Central Florida, School of Electrical and Computer Science
IFTU-51: A 1.5 V 4 GHz Dynamic-loading Regenerative Frequency Doubler
in a 0.35 µm CMOS Process
J.M.C. Wong, H.C. Luong, Hong Kong Univ. of Science and Technology Electrical and Electronic Dept.
IFTU-52: Very Low Phase-noise Fully-integrated Coupled VCOs
H. Jacobsson, B. Hansson, Ericsson Microwave Systems; H. Berg, Chalmers Univ. of Technology;
S. Gevorgian, Ericsson Microwave Systems and Chalmers Univ.
IFTU-53: Wide-tuning-range Dual-VCOs for Cable Modem Receivers
K. Stadius, K. Halonen, Helsinki Univ. of Technology, Electronic Circuit Design Lab
IFTU-54: A 5.8 GHz Fully Integrated Low Power Low Phase Noise CMOS LC VCO
for WLAN Applications
J. Bhattacharjee, D. Mukherjee, E. Gebara, S. Nuttinck, J. Laskar, School of ECE, Georgia Institute of
Technology, Atlanta, GA
IFTU-55: A 5 GHz Fast-switching CMOS Frequency Synthesizer
X. Yang, T. X. Wu, Univ. of Central Florida School of Electrical Engineering and Computer Science;
J. McMacken, Agere Systems Inc.
IFTU-56: A Wilkinson Power Divider on a Low Resistivity Si Substrate with a Polyimide Interface
Layer for Wireless Circuits
J. Papapolymerou, E.M. Tentzeris, School of ECE, Georgia Tech; G.E. Ponchak, NASA Glenn Research
Center
IFTU-57: Development and Verification of a New Non-linear MOSFET Model
H. Romdane, E. Bergeault, B. Huyart, ENST-Dep. Comelec-CNRS-URA 820
IFTU-58: Design and Analysis of a Multi-layer Transformer Balun for Silicon RF Integrated
Circuits
H.Y.D. Yang, L. Zhang, J. Castaneda, Broadcom Corp.
IFTU-59: Smoothing Gate Capacitance Models for CMOS Radio Frequency and Microwave
Integrated Circuits CAD
J. Dobes, Czech Technical Univ., Dept. of Radioelectronics
O. Mireux, J-J. Brault, R.G. Bosisio, Centre de Recherche Avancée en Micro-ondes et Electronique
Spatiale (PolyGrames), Ecole Polytechnique de Montréal
32
PANEL SESSIONS
PM: RF-CMOS IN CELL PHONES: FACT OR FICTION?
PW: RF MEMS: REVOLUTION OR EVOLUTION
Date & Time:
Date & Time:
Wednesday, June 5; 12:00 to 1:15 PM
Location:
Washington State Convention Center, Room 6E
Location:
Washington State Convention Center, Room 6A/B
Organizers:
Natalino Camilleri, RF & Wireless Design Services
Fazal Ali, Nokia
Organizers:
N. Scott Barker, University of Virginia
Larry E. Corey, DARPA/SPO
Speakers:
Stephen Dow, Motorola
Stefan Heinen, Infineon Technologies
Christian Kermarrec, ADI
Stephen Lloyd, Conexant
Ahmadreza Rofougaran, Broadcom
Jacques C. Rudell, UC Berkeley
Darek K. Shaeffer, BigBear Networks
Bernard Xavier, National Semiconductor
Speakers:
Eric Varian, Raytheon
Greg Tavik, Naval Research Laboratories
John K. Smith, former DARPA
Gabriel M. Rebeiz, University of Michigan
While MEMS technology has been used for years as sensors and actuators in commercial low frequency applications, it has yet to penetrate
deeply into the RF arena. To date, RF-MEMS have demonstrated improved performance of existing system architectures through device for
device replacement. For instance, by replacing the PIN diode switch in
switched line phase shifters with an RF-MEMS switch the loss is greatly
reduced. However, do RF-MEMS have the potential to enable new architectures? Can they be cost-effective and compatible with existing RFIC
technologies?
RF-CMOS development has come a long way towards being implemented in several systems for multiple applications. One can find RFCMOS in some cordless devices, WLAN and Bluetooth products. However, in Cellular Handset systems, RF-CMOS has had a difficult time
competing with the SiGe BiCMOS technology in offering the “best-inclass” RF performance while maintaining the lowest power consumption. The Panelist, representing various industries and academia, will address their views on the future of high performance RF-CMOS for mobile handsets.
PTH: MAKING SENSE OR CENTS:
WHICH WLAN TECHNOLOGY WILL SURVIVE?
PT: IS THE SINGLE-CHIP RADIO DEAD?
Date & Time:
Thursday, June 6; 12:00 to 1:15 PM
Location:
Date & Time:
Tuesday, June 4; 12:00 to 1:15 PM
Organizer:
IceFyre Semiconductor
Location:
Speakers:
Organizers:
Bob Jackson, University of Massachusetts
Joy Laskar, Georgia Tech
Speakers:
Fred Schindler, RFMD
Sanjay Moghe, RF Solutions
Rob Roy, Mobillian Corporation
Teresa Meng, Stanford University
Paul McGoldrick, analogZONE (moderator)
Mark Roberts, IceFyre Semiconductor
Benno Ritter, Philips Semiconductor
Kevin Negus, Proxim
Teik Kheong Tan, 3Com
Bent Hessen-Schmidt, SiGe Semiconductor
Eric Blaufarb, Cisco Systems/WECA
The popularity of 802.11b 2.4-GHz wireless Local Area Network
(WLAN) applications has ensured that the wireless LAN industry has
gained much more than just a toehold in the enterprise and home markets. Analysts are predicting that the enterprise WLAN equipment market alone will grow to over $4.6 billion in 2005.
Even with this recent success, a number of questions concerning wireless LAN technologies and their applications remain. What do the various wireless LAN technologies have to offer? What are their drawbacks?
When will security of wireless LAN become truly “wired equivalent”?
How serious is the issue of backward compatibility, and how will it be
solved?
This panel will include representatives who cover the various wireless
LAN technologies, including 802.11b, 802.11a and Bluetooth, all of
whom will debate the merits and drawbacks of their chosen technology.
The panel will also include a WLAN OEM representative and a WECA
representative to challenge the panelists on interoperability.
Issues the panel will address include interoperability, throughput, implementation, security, time-to-market, end-user experience and system
cost.
This panel session will address two questions: (1) are single chip radios viable now or in the future based upon technological and market requirements? (2) if single-chip radios are viable, for what applications:
WLAN, Bluetooth, Handsets or are they relegated to garage door openers? Leading speakers from industry and academia are targeted to provide their views into the single-chip radio or the radio in a package debate.
33
8:00–9:30
AM
WE1A High Power Amplifiers WATTS UP?
WE1B Microwave and mm-Wave Sensor Applications
WE1C Transmission Line Structures
Chair: K. Ikossi, NRL
Co-chair: J. Komiak, BAE SYSTEMS
ROOM 608–609
Chair: P. Staecker, Photonic Systems Inc.
Co-chair: Richard Sparks, ANRO Engineering Inc.
ROOM 606–607
Chair: G.E. Ponchak, NASA Glenn Research Center
Co-chair: E. Denlinger, Sarnoff Corp.
ROOM 611–612
WE1A-1: A 20 W 2080-2200 MHz Hybrid Power Amplifier
Optimized for Error Amplifier Applications
E.J. Crescenzi, Jr., UltraRF, Sunnyvale, CA
WE1B-1: Development of RF Carbon Nanotube Resonant Circuit
Sensors for Gas Remote Sensing Applications
S. Chopra, A. Pham, Holcombe Dept. of Electrical and Computer
Engineering, Clemson Univ.; J. Gillard, A. M. Rao, Dept. of Physics
and Astronomy, Clemson Univ.
WE1C-1: High Performance Air Gap Transmission Lines for mmWave Applications
I. Jeong, J-S. Lee, C-M. Nam, D-W. Kim, Telephus Inc.; S-H. Shin,
J-H. Go, Y-S. Kwon, Dept. of EE, Korea Advanced Institute of Science
and Technology
WE1A-2: A 15 W PEP GaAs PHEMT MMIC Power Amplifier for 3G
Wireless Transmitter Applications
J. Staudinger, R. Sherman, T. Quach, M. Miller, L. Frye, Motorola,
Semiconductor Products Sector
WE1B-2: Integrated Microwave Sensor for Cavity-length
Measurement with Sub-millimeter Accuracy
A. Megej, M. Schuessler, B. Mottet, O. Yilmazoglu, K. Mutamba,
H.L. Hartnagel, Institute of Microwave Engineering, Darmstadt Univ.
of Technology; K. Beilenhoff, United Monolithic Semiconductor;
A. Ziroff, C.D. Hamann, R. Baican
WE1C-2: Reconfigurable Quasi-fractal Transmission Line
Structures
J. Sor, Y. Wang, T. Itoh, UCLA Microwave Electronics Lab
8:20
AM
8:10
AM
8:00
AM
WEDNESDAY, JUNE 5, 2002
WE1A-3: 70% High Efficient C-band 27W Hetero-structure FET
for Space Application
H. Minamide, M. Kohno, N. Yoshida, K. Yajima, K. Mori, High
Frequency and Optical Semiconductor Div., Mitsubishi Electric Corp.,
T. Ogata, T. Sonoda
WE1A-4: Ka-band Coupled-cavity Amplifiers for Military Radar
and Commercial Satellite Communication
J.R. Legarra, P.E. Kolda, Communications and Power Industries, Palo
Alto, CA; H.P. Freund, T.M. Antonsen, Jr., Science Applications
International Corp., McLean, VA; B. Levush, Naval Research Lab,
WE1B-3: A Planar Resonant Sensor for the Complex Permittivity
Characterization of Materials
E. Fratticcioli, M. Dionigi, R. Sorrentino, D.I.E.I of the Univ.
of Perugia, Perugia, Italy
WE1C-4: Modeling of Real-shaped LTCC Stripline Structure Having
Sharpened Edges and Embedded Pores
J.H. Jang, N. Ishitobi, C.H. Kim, R&D Center, Samsung
Electromechanics, Suwon, Korea
WE1B-4: Microwave Reflection Tomography Array for Damage
Detection in Concrete Structures
Y.J. Kim, M.Q. Feng, University of California, Irvine, Civil and
Environmental Engineering Dept.; L. Jofre, Technical Univ. of
Catalonia, Barcelona, Spain; F.D. Flaviis, Signal Theory &
Communication Dept., University
WE1C-5: High-isolation Bonding Pad with Depletion-insulation
Structure for RF/Microwave Integrated Circuits on Bulk Silicon
CMOS
S. Lam, W.H. Ki, M. Chan, Dept. of Electrical & Electronic
Engineering, Hong Kong Univ. of Science & Technology
WE1B-5: Wireless MEMs IDT Ice Sensor
K.A. Jose, G. Sunil, V.K. Varadan, V.V. Varadan, Pennsylvania State
Univ., Univ. Park, PA
WE1C-6: Porosity Effects on Coplanar Waveguide Porous Silicon
Inteconnects
I.K. Itotia, R.F. Drayton, Univ. of Minnesota, Electrical and Computer
Engineering Dept.
WE1C-7: Substrate Loss Mechanisms for Microstrip and CPW
D.C. Lederer, J-P. Raskin, Microwave Lab Université Catholique de
Louvain Belgium
WE1A-5: High Performance Microwave Power Modules for Military
and Commercial Systems
M.A. Basten, D.R. Whaley, J. Duthie, V.O. Heinen, K.E. Kreischer,
J. Tucek, A. Ferek, F. Trimble, B.M. Gannon, Electronic Systems,
Northrop Grumman Corp.
9:30
AM
9:20
AM
9:10
AM
9:00
AM
8:50
AM
8:40
AM
8:30
AM
WE1C-3: Miniaturized Slow-wave Coplanar Waveguide Circuits
on High-resistivity Silicon
J. Naylor, T.M. Weller, Univ. of South Florida; J.W. Culver, M. Smith,
Raytheon
WE1A-6: Production and Operation of a High-efficiency DBS-band
Klystron Utilizing a Multistage Depressed Collector
T. Habermann, R. Batra, R. Begum, E.W. McCune, E.L. Wright,
Communications and Power Industries (CPI)/Microwave Power
Products (MPP) Div.
34
WE1E Linear Modeling
Chair: J. Papapolymerou, Georgia Institute of Technology
Co-chair: S. Wetenkamp, SCEAN
ROOM 602–604
Chair: M. Nakhla, Carleton Univ.
Co-chair: W. Struble, M/ACOM
ROOM 602–604
WE1D-1: Ultra Low Phase Noise SiGe HBT Application to a C-band
Sapphire Resonator Oscillator
G. Cibiel, O. Llopis, R. Plana, LAAS-CNRS, Toulouse, France; M. Régis,
H. Lafontaine, SiGe Se; Y. Kersalé, V. Giordano, M. Chaubet
8:00
AM
WE1D Advances in Microwave Oscillators
WE1E-1: Implicit Space Mapping EM-based Modeling and Design
Exploiting Preassigned Parameters
J.W. Bandler, Bandler Corp. and McMaster Univ.; Q.S. Cheng, N.
Georgieva, McMaster Univ. Dept. of Electrical and Computer
Engineering; M.A. Ismail, Com Dev International Ltd.
WE1F-1: Enhanced PML-like ABCs for Layered Media Transmission
Line Termination
A. Lauer, A. Wien, P. Waldow, I. Wolff, IMST GmbH
8:10
AM
WE1F-2: Global Modeling of Active Microwave Devices
Incorporating a Novel Large-signal Time-domain Fullhydrodynamic Physical Simulator Using Wavelet-based Adaptive
GR
Y.A. Hussein, S.M. El-Ghazaly, Arizona State Univ. Electrical
Engineering Dept.
WE1D-2: A Low Phase Noise Silicon VCO and an 18 GHz Push-push
Oscillator
L. Dussopt, G.M. Rebeiz, Univ. of Michigan, EECS Dept.; D. Guillois,
Thales Microwave
WE1E-2: Wide-band Compact Modeling of Spiral Inductors in
RFICS
D. Melendy, A. Weisshaar, Oregon State Univ., ECE Dept.; P. Francis,
C. Pichler, K. Hwang, G. Srinivasan, National Semiconductor Corp.
8:20
AM
WE1F Advances in Time-domain Techniques for EM
Field Modeling
Chair: P. Russer, Institute for High Frequency
Engineering, Technical
Co-chair: A. Beyer, Institute of Electrical Engineering
ROOM 613–614
WE1E-4: New Extraction Algorithm for GaAs-HBTs with Low
Intrinsic Base Resistance
F. Lenk, M. Rudolph, Ferdinand-Braun-Institut für
Höchstfrequenztechnik (FBH)
8:50
WE1D-4: C-band Oscillator Using High-Q Inductors Embedded in
Multilayer Organic Packaging
S-W. Yoon, M.F. Davis, K. Lim, S. Pinel, M. Maeng, J. Laskar, School
of Electrical and Computer Engineering, Georgia Institute of
Technology; C-H. Lee, RF Solutions Inc.; T. Nonaka, G. White, R.
Tummala, Packaging Research Center
WE1F-4: Demonstration and Suppression of Numerical
Divergence Errors in FDTD Analysis of Practical Microwave
Problems
M. Celuch-Marcysiak, Institute of Radioelectronics, Warsaw Univ. of
Technology
WE1D-5: A Differentially-tuned CMOS LC VCO for Low-voltage
Full-rate 10 Gb/s CDR Circuit
D. Mukherjee, J. Bhattacharjee, J. Laskar, School of ECE, Georgia
Institute of Technology, Atlanta, GA
WE1E-5: Uncertainty Estimation and Optimal Extraction of
Intrinsic FET Small Signal Model Parameters
C. Fager, P. Linnér, Microwave Electronics Lab, Chalmers Univ. of
Technology, Sweden; J.C. Pedro, Institute of Telecommunications,
Univ. of Aveiro, Portugal
WE1F-5: Analysis of Guided Wave Structures Using 3-D
Envelope-finite Element Technique
H-P. Tsai, Y. Wang, T. Itoh, Electrical Engineering Dept., Univ. of
California, Los Angeles
WE1E-6: An Exact Expression for the HBT Extrinsic Base-collector
Capacitance Derived from S-parameter Measurements
E. Wasige, B. Sheinman, D. Ritter, Microelectronics Research Center,
Technion, Israel Institute of Technology
WE1F-6: A Surface Impedance Approach for Modeling Multilayer
Conductors in FDTD
W. Thiel, L.P.B. Katehi, Univ. of Michigan, Electrical Engineering and
Computer Science, Radiation Lab
8:40
AM
9:00
AM
9:10
AM
9:20
AM
9:30
35
WEDNESDAY
WE1E-3: On the Synthesis of Equivalent Circuit Models for
Multiports Characterized by Frequency-dependent Parameters
R. Neumayer, A. Stelzer, R. Weigel, Institute for Communications and
Information Engineering, JK Univ. Linz; F. Haslinger, BMW Group
Munich, Germany
AM
WE1D-3: A Novel Microwave Oscillator Using Double-sided MIC
K. Kawahata, N. Miyayoshi, M. Aikawa, Dept. of Electrical and
Electronic Engineering, Saga Univ.
AM
8:30
AM
WE1F-3: Coupling Front Tracking and Wavelet Techniques for Fast
Time Domain Simulations
C.D. Sarris, L.P. Katehi, Radiation Lab, Dept. of Electrical Engineering
and Computer Science, Univ. of Michigan
10:10
AM–12:00 PM
WE2A Distortion Correction Techniques
for High Power Amplifiers
WE2B Evolving Communication
and Radar Systems
WE2C Transitions, Polarizers
and Coupling Characteristics in LTCC
Chair: A. Katz, The College of New Jersey
Co-chair: J.Goel, S&EG/TRW
ROOM 608–609
Chair: R.H. Knoechel, Univ. of Kiel
Co-chair: K. Breuer, BAE Systems
ROOM 606–607
Chair: M. Dydyk, Motorola
Co-chair: K. Wu, Ecole Polytechnique
ROOM 611–612
WE2A-1: Power Amplifier Module with Digital Adaptive
Predistortion for Cellular Phone.
S. Kusunoki, K. Yamamoto, T. Hatsugai, K. Tagami, H. Nagaoka, Sony
Ericsson Japan,Inc.; N. Tominaga, K. Nakajima, T. Sakurai, Taiyo
Yuden Co.,Ltd.; K. Osawa, K. Tanabe, S. Sakurai, T. Iida, Toshiba
Corp.
WE2B-1: A Compact Ka-band 156 Mbps Transceiver for a Wireless
LAN System Using PTTE/FR-4 Laminated MCMs
K. Takahashi, S. Fujita, H. Yabuki, Matsushita Electric Industrial,
Co.,Ltd.; M. Inoue, G. Wu, Communications Research Lab,
Independent Administrative Institution
WE2C-1: Analysis and Synthesis of In-line Coaxial-to-waveguide
Adapters
R. Levy, R. Levy Associates; L.W. Hendrick, Boeing Satellite Systems
WE2A-2: Feedforward Amplifier for W-CDMA Base Stations with a
New Adaptive Control Method
Y.Y. Woo, Y. Yang, J. Yi, J. Nam, J.H. Cha, B. Kim, Pohang Univ. of
Science and Technology, E.E.E. Dept.
WE2B-2: An Obstacle Sensing System for a Railway Crossing
Application: A 60 GHz mm-Wave Spread Spectrum Radar
M. Watanabe, K. Okazaki, T. Fukae, Industrial Electronics and
Systems Lab, Mitsubishi Electric Corp., N. Tamiya, N. Ueda, M.
Nagashima, Trans
WE2C-2: A Transition from Microstrip to Dielectric-filled
Rectangular Waveguide in Surface Mounting
K. Sano, TOKO, Inc.; T. Yoneyama, Tohoku Institute of Technology,
Dept. of Communication Engineering
WE2C-3: A mm-Wave Perpendicular Coax-to-microstrip
Transition
M.A. Morgan, Dept. of Electrical Engineering, California Institute
of Technology; S. Weinreb, Jet Propulsion Lab, California Institute
of Technology
WE2A-3: A Novel Technology for Linearzing Traveling Wave Tube
Amplifiers
T. Chen, Y. Goren, C. Jensen, P.M. Lally, D.R. Gagne, Teledyne
Electronic Technologies
WE2B-3: Highly Integrated Microwave Point-to-point Outdoor
Unit Optimized for Ultra High Volume Manufacturing
J.T. Louhi, H. Somerma, K. Nikkanen, M. Koivisto, N. Nordman,
T. Tuoriniemi, M. Hirvilampi, M. Pehkonen, K. Vepsäläinen,
P. Bergholm, P. Ruhanen, M. Platan, J. Rantiala, P. Mikkonen,
J. Mäkinen, Nokia
WE2C-4: Mono-grooved Circular Waveguide Polarizers
N. Yoneda, M. Miyazaki, T. Horie, H. Satou, Mitsubishi Electric Corp.
WE2A-4: New Linearization Method for the Modulated Signals with
High Peak-to-average Ratio: Peak-to-average Ratio Reduction and
Expansion
Y. Yang, Y.Y. Woo, J. Cha, J. Yi, B. Kim, Pohang Univ. of Science and
Technology Dept. of Elecronic and Electric Engineering
WE2B-4: Architecture and Algorithm for High Precision Image
Rejection and Spurious Rejection Mixers Using Digital
Compensation
Y. Kim, S. Shin, K. Lee, KAIST, Electrical Engineering Dept.
WE2C-5: Analysis of Coupling Characteristics Between
Transmission Lines with a Buried Meshed-ground in LTCC-MCMs
J-G. Kim, S-Y. Lee, C-Y. Cheon, School of EE Eng., Univ. of Seoul,
Seoul, Korea; E-T. Lee, D-H. Kim, Amotech Co., Ltd., Seoul, Korea;
J-H. Lee, S-H. Kim, J-S. Park, Div. of Information Technology
WE2A-5: Reduction of Intermodulation Distortion in Active
Phased Array Antenna Systems Using a Distortion Controller
T. Kaho, T. Nakagawa, K. Araki, NTT Network Innovation
Laboratories, NTT Corp.
WE2B-5: Power Amplifier Transient Tracking in OFDM
D.G. Bateman, S. Simoens, M. de Courville, Motorola CRM, Espace
Technologique, France; G. Julien, Motorola WSSG, Geneva,
Switzerland
11:40
AM
11:30
AM
11:20
AM
11:10
AM
11:00
AM
10:50
AM
10:40
AM
10:30
AM
10:20
AM
10:10
AM
36
WE2F Applications of the Finite-difference
Time-domain Method
Chair: P. Khanna, Agilent Technologies
Co-chair: D. Elad, Rastech
ROOM 615–617
Chair: B. Pejcinovic, Portland State Univ.
Co-chair: S. Goodnick, Arizona State Univ.
ROOM 602–604
Chair: E.M. Tentzeris, School of ECE, Georgia Inst. of Tech.
Co-chair: L. Roselli, Dept. of Elec. and Inf. Eng.
ROOM 613–614
WE2D-1: 45 GHz Highly Integrated Phase-locked Loop Frequency
Synthesizer in SiGe Bipolar Technology
G. Ritzberger, Infineon Technologies, Technical Univ. of Vienna;
J. Boeck, Infineon Technologies; A.L. Scholtz, Technical Univ.
of Vienna
WE2E-1: A New Behavioral Model Taking into Account Nonlinear
Memory Effects and Transient Behaviors in Wideband SSPAs
A. Soury, E. Ngoya, J.M. Nebus, IRCOM, Univ. of Limoges
WE2F-2: Custom Hardware Implementation
of the Finite-difference Time-domain (FDTD) Method
R.N. Schneider, M.M. Okoniewski, L.E. Turner, Univ. of Calgary,
Electrical and Computer Engineering Dept.
10:20
AM
10:30
WE2D-2: Single Chip 20 GHz VCO and Frequency Divider in SiGe
Tehnology
K. Ettinger, DICE GmbH & Co. KG
WE2E-2: Accurate Prediction of PHEMT Intermodulation
Distortion Using the Nonlinear Discrete Convolution Model
A. Costantini, G. Vannini, Dept. of Engineering, Univ. of Ferrara,
Ferrara, Italy; R.P. Paganelli, P.A. Traverso, A. Santarelli, F. Filicori,
Dept. of Electronics, Univ. of B; D. Argento, G. Favre, M. Pagani
WE2D-3: 38 GHz Push-push GaAs-HBT MMIC Oscillator
M. Schott, H. Kuhnert, F. Lenk, J. Hilsenbeck, J. Würfl, W. Heinrich,
Ferdinand-Braun-Institut für Höchstfrequenztechnik (FBH)
WE2E-3: An Electrothermal BSIM3 Model for Large-signal
Operation of RF Power LDMOS Devices
O. Tornblad, C. Blair, Ericsson Inc., Microelectronics,
Morgan Hill, CA
WE2D-4: A 40 GHz-band Fully Monolithic VCO with a One-wave
Length Microstrip Resonator for Accurate Oscillation Frequency
H. Ikematsu, K. Kawakami, T. Katoh, K. Itoh, Mitsubishi Electric Corp.
WE2F-4: Modeling and Optimization of RF-MEMs Reconfigurable
Tuners with Computationally Efficient Time-domain Techniques
N. Bushyager, M. Tentzeris, J. Papapolymerou, Georgia Institute
of Technology, Atlanta GA; K. Lange, Raytheon Co., Tucson AZ
11:00
AM
10:50
AM
10:40
AM
WE2F-3: Analysis of CMOS Interconnections Combining LE-FDTD
Method and SOC Procedure
F. Alimenti, V.Palazzari, P. Placidi, G. Stopponi, A. Scorzoni,
L. Roselli, Univ. of Perugia
11:10
AM
WE2E-4: Nonlinear Amplifier Modeling Taking into Account HF
Memory Frequency
F. Launay, Y. Wang, S. Toutain, IRCCyN - SETRA, École Polytechnique
de Université de Nantes, France; D. Barataud, J.M. Nebus, R. Quere,
IRCOM, Limoges, France
WE2D-5: A Ku-band InGaP/GaAs HBT MMIC VCO with a Balanced
and a Differential Topologies
D-H. Baek, J-G. Kim, S. Hong, Dept. EECS, KAIST
WE2F-5: Application of C-COM for Microwave Integrated Circuit
Modeling
K. Lan, S.K. Chaudhuri, S. Safavi-Naeini, Dept. of Electrical and
Computer Engineering, Univ. of Waterloo, Waterloo, ON, Canada
11:20
AM
WE2F-1: Equivalent Circuit of Radiating Longitudinal Slots
in Dielectric Filled Rectangular Waveguides Obtained
with FDTD Method
R.V. Gatti, R. Sorrentino, M. Dionigi, Univ. of Perugia,
Dept. Electronic and Information Engineering
11:40
AM
11:30
AM
WE2F-6: Comparison of The Efficiency of Electromagnetic Solvers
in The Time- and Frequency-domain for the Accurate Modeling
of Planar Circuits and MEMs
L.Pierantoni, M. Farina, T. Rozzi, Dipartimento di Elettronica ed
Automatica, Univ. of Ancona, Ancona, Italy; F. Coccetti, W. Dressel,
P.Russer, Technische Universität München, Lehrstuhl für
Hochfrequenztechnik, Munich, Germany
37
WEDNESDAY
AM
WE2E Nonlinear Device Modeling I
AM
10:10
WE2D Microwave and mm-Wave
Signal Generation
1:20–3:00
PM
WE3A Power Amplifier Technologies for Broadband,
High Efficiency Applications
WE3B Direct Conversion Techniques
for Wireless Systems
WE3C New Leakage Effects
on Printed Circuit Transmission Lines
Chair: A. Platzker, Raytheon
Co-chair: P. Asbeck, UCSD
ROOM 608–609
Chair: S.D. Pritchett, Texas Instruments Inc.
Co-chair: S.L. March, Texas Instruments Inc.
ROOM 606–607
Chair: J. Zehentner, Czech Technical Univ.
Co-chair: H. Shigesawa, Doshisha Univ.
ROOM 611–612
WE3A-1: A 6 W LDMOS Broadband High Efficiency Distributed
Power Amplifier Fabricated Using LTCC Technology
L. Zhao, A. M. Pavio, Solid State Research Center, Motorola,
Tempe, AZ
WE3B-1: A 0.9-2.6 GHz Broadband RF Front-end for Direct
Conversion Transceivers
M. Kawashima, H. Hayashi, T. Nakagawa, K. Nishikawa, K. Araki,
Nippon Telegraph and Telephone Corp., NTT Network Innovation Lab
WE3C-1: The Danger of High Frequency Spurious Effects on Wide
Microstrip Line
F. Mesa, Dept. of Applied Physics, Univ. of Seville; D.R. Jackson,
Dept. of ECE, Univ. of Houston
WE3A-2: Optimum Bias Conditions for Linear Broadband
InGaP/GaAs HBT Power Amplifiers
M. Iwamoto, M. Vaidyanathan, P.M. Asbeck, Univ. of California at San
Diego, C.P. Hutchinson, J.B. Scott, T.S. Low, D.C. D’Avanzo, Agilent
Technologies
WE3B-2: Six-port Direct Digital Receiver (SPDR) and Standard
Direct Receiver (SDR) Results for QPSK Modulation at High Speeds
J-C. Schiel, S.O. Tatu, K. Wu, R.G. Bosisio, Centre de Recherche en
Micro-ondes et Electronique Spatiale (PolyGrames), Ecole
Polytechnique de Montreal
WE3C-2: Frequency Dependent Characteristics of Radiation
from a Voltage Source on a Covered Microstrip Line
W.L. Langston, J.T. Williams, D.R. Jackson, Dept. of ECE, Univ.
of Houston; F. Mesa, Microwave Group, Univ. of Seville
WE3A-3: High Efficiency Wideband 6 To 18 GHz PHEMT Power
Amplifier MMIC
J.J. Komiak, W. Kong, K. Nichols, BAE Systems Information
and Electronic Warfare Systems
WE3B-3: Development of A Low-IF Receiver and a Fixed Wireless
Utility Network
S. Thumaty, A. Pham, Dept. of Electrical and Computer Engineering,
Clemson Univ.; H. van Wyk, SchlumbergerSema Utilities, Union, SC
WE3C-3: Approximate Analytical Evaluation of the Continuous
Spectrum in a Substrate-superstrate Dielectric Waveguide
P. Baccarelli, P. Burghignoli, F. Frezza, A. Galli, G. Lovat, La Sapienza
Univ. of Rome, Electronic Engineering Dept., Rome, Italy; D.R.
Jackson, Univ. of Houston, Dept. of ECE, Houston, TX.
WE3B-4: A Microwave Communication Link with Self-heterodyne
Direct Down Conversion and System Predistortion
J. Park, Y. Wang, T. Itoh, Electrical Engineering Dept.,
Univ. of California, Los Angeles
WE3C-4: Significant Contribution of Nonphysical Leaky Mode
to the Fields Excited by a Practical Source in Printed Circuit
Transmission Lines
M. Tsuji, S. Ueki, H. Shigesawa, Doshisha Univ. Dept. of Electronics
WE3A-4: A Broadband, Push-pull Power MMIC Operating
at K/Ka-band Frequencies
J.M. Schellenberg, Schellenberg Associates
2:50
PM
2:40
PM
2:30
PM
2:20
PM
2:10
PM
2:00
PM
1:50
PM
1:40
PM
1:30
PM
1:20
PM
WE3A-5: A New Amplifier Power Combining Scheme
with Optimum Efficiency under Variable Outputs
C.Y. Hang, Y. Wang, T. Itoh, Electrical Engineering Dept.,
Univ. of California, Los Angeles,
WE3A-6: W-band InN/InGaAs/InP DHBT MMIC Power Amplifiers
Y. Wei, S. Lee, K. Sundararajan, M. Dahlstrom, M. Urteaga,
M. Rodwell, Univ. of California Electrical and Computer
Engineering Dept.
WE3C-5: Novel Selected Modes on the Conductor-backed Slotline
J. Zehentner, J. Machac, J. Mrkvica, Czech Technical Univ.
WE3A-7: RF Performance and Thermal Analysis of AlGaN/GaN
Power HEMTs in Presence of Self-heating Effects
S. Nuttinck, J. Laskar, Yamacraw Design Center, School of Electrical
and Computer Engineering, Georgia Institute of Technology, Atlanta,
GA; E Gebara, Quellan Inc., Atlanta, GA; B. Wagner, Georgia Tech
Research Center
38
WE3D Efficient Modeling Techniques
for Circuit Simulation
WE3E Nonlinear Device Modeling II
Chair: A.K. Sharma, TRW
Co-chair: R. Goyal, TeleVersal Systems Inc.
ROOM 615–617
Chair: S.K. Rockwell, Motorola
Co-chair: G.F. Manes, Univ. of Florence
ROOM 602–604
WE3D-1: A Symmetry Device to Speed-up Circuit Simulation
and Stability Tests
S. Ramberger, T. Merkle, Fraunhofer Institute for Applied Solid-state
Physics, Freiburg, Germany
WE3E-1: Novel Technique for Determining Bias, Temperature
and Frequency Dependence of FET Characteristics
A.E. Parker, Dept. of Electronics, Macquarie Univ., Sydney Australia;
J.G. Rathmell, School of Electrical Engineering, The Univ. of Sydney,
Australia
WE3D-2: Feasible Adjoint Sensitivity Technique (FAST) for EM
Design Optimization
N.K. Georgieva, S. Glavic, M. Bakr, J.W. Bandler, (and Bandler
Corp.), McMaster Univ., Dept. of Electrical and Computer
Engineering
WE3E-2: Towards a Unified Method to Implement Transit-time
Effects in PI-topology HBT Compact Models
M. Rudolph, F. Lenk, R. Doerner, P. Heymann,
Ferdinand-Braun-Institut fuer Hoechstfrequenztechnik (FBH)
WE3D-3: On Passive Time-domain Macromodels of Distributed
Transmission Line Networks
A. Dounavis R. Achar, M. Nakhla, Carleton Univ., Dept. of Electronics
WE3E-3: Measurement and Modelling of Static and Dynamic
Breakdowns of Power GaInP/GaAs HBTs
S. Heckmann, J-M. Nébus, R. Quéré, IRCOM, Univ. of Limoges,
France; D. Floriot, Thales Research and Technology, Orsay, France;
P. Auxemery, United Monolithic Semiconductors, Orsay, France
WE3D-4: Fast And Accurate CAD of Narrow Band Waveguide Filters
Applying an Electromagnetic Segmentation Method
D. Bariant, S. Bila, D. Baillargeat, S. Verdeyme, P. Guillon,
IRCOM UMR
WE3E-4: A Simple Practical Technique for Estimating the Junction
Temperature and the Thermal Resistance of a GaAs HBT
M. Olavsbråten, Norwegian Univ. of Science and Technology, Dept.
of Telecommunication, Trondheim, Norway.
ALSO
OCCURRING
Wednesday, June 5, 1:20–3:00 PM
Special Session
on the 50th Anniversary of the MTT
WSCTC, Room 613–614
2:50
PM
2:40
PM
2:30
PM
2:20
PM
2:10
PM
WEDNESDAY
2:00
PM
1:50
PM
1:40
PM
1:30
PM
1:20
PM
NOTES
WE3D-5: Coupling of Large Number of Vias in Electronic
Packaging Structures and Differential Signaling
H. Chen, Univ. of Washington, Dept. of Electrical Engineering, Seattle,
WA; L. Tsang, City Univ. of Hong Kong, Dept. of Electrical
Engineering, Hong Kong
WE3E-5: A Novel Extraction Method for a Fully Electro-thermal
Large-signal Model of HBT
H.M. Park, S. Hong, Dept. EECS, KAIST, R. Green, Dynalinear
Technologies Inc.
WE3D-6: Full Wave Analysis of Isolated Pocket to Improve
Isolation Performances on Silicon Based Technology.
D. Bajon, ENSAE Groupe MOSE; S. Wane, H. Baudrand, ENSEEIHT
Len7; P. Gamand, Philips Semiconductor France
Session Chair and Moderator:
Leo Young, Consultant, Washington, DC
Panelists:
H. George Oltman Jr., Consultant, Albuquerque, NM
Harold Sobol, retired, Dallas, TX
Kiyo Tomiyasu, Lockheed Martin, Philadelphia, PA
Ted Saad, retired, Weston, MA
James Wiltse, Georgia Tech, Atlanta, GA
The IEEE Microwave Theory and Techniques Society
celebrates its 50th birthday this year, along with 50 years of
great progress in microwave technology. This session will
review briefly both the history of microwave technology over
the past 50 years and the history of the Society. The more
daring panelists may attempt a prediction as to the future.
The panelists are eminent contributors to both the technology
and the Society. Each will present a short account of the
highlights from his perspective, and it is hoped there will be
time for discussion and questions afterwards, including from
the audience.
39
3:30–5:00
PM
WE4A RF Power Amplifiers
WE4B New Technologies
for Communications Systems
WE4C New Periodic Structures and Effects
Chair: C.E. Weitzel, Motorola Inc.
Co-chair: A. Pham, Clemson Univ.
ROOM 608–609
Chair: J. Sitch, Nortel Networks
Co-chair: J.B. Horton, J.B. Horton Group
ROOM 606–607
Chair: A. Omar, Univ. of Magdeburg
Co-chair: D.R. Jackson, Univ. of Houston
ROOM 611–612
WE4A-1: High Performance Silicon Bipolar Power Amplifier
for 1.8 GHz Applications
F. Carrara, A. Castorina, G. Palmisano, Universita di Catania, Facolta
di Ingegneria, DEES; A. Scuderi, STMicroelectronics Catania Site
WE4B-1: Broadband Highly Integrated LTCC Front-End Module
for IEEE 802.11a WLAN Applications
C-H. Lee, A. Sutono, S. Yoo, RF Solutions, Atlanta GA; S. Chakraborty,
J. Laskar, Georgia Institute of Technology; D. Heo, National
Semiconductor, Norcross GA
WE4C-1: Negative Refractive Index Metamaterials Supporting
2-D Waves
A.K. Iyer, G.V. Eleftheriades, Edward S. Rogers Sr. Dept. of Electrical
& Computer Engg., Univ. of Toronto, Ontario, Canada
WE4A-2: A 2.4 GHz High Efficiency SiGe HBT Power Amplifier
with High-Q LTCC Harmonic Suppression Filter
A. Raghavan, M. Maeng, K. Lim, J. Laskar, Georgia Institute
of Technology, School of Electrical and Computer Engineering;
D. Heo, National Semiconductor Inc.; A. Sutono, RF Solutions
WE4B-2: DCS1800 Base Station Receiver Integrated in 0.25 µm
CMOS
O. Boric-Lubecke, P. Gould, Bell Labs, Lucent; J. Lin, Agere Systems
WE4C-2: Characteristics of Ka-band Waveguide Employing
Electromagnetic Crystal Sidewalls
J.A. Higgins, H. Xin, A. Sailer, Rockwell Scientific Co.
WE4C-3: THz Pulse Propagation in Plastic Photonic Crystal Fibers
H. Han, H. Park, M. Cho, J. Kim, Dept. of Electrical and Computer
Engineering, Pohang Univ. of Science and Technology; I. Park,
H. Lim, Dept. of Electrical and Computer Engineering, Ajou Univ.
WE4A-3: The Maximum Operating Region in SiGe HBTs
A. Inoue, R. Hattori, Y. Matsuda, Mitsubishi Electric Corp.;
. Nakatsuka, Miyoshi Electronics Corp.
4:30
PM
4:40
WE4B-4: Design of High Speed Master-slave D-Type Flip-flop
in InP DHBT Technology
A. Kasbari, OPTO+, Alcatel R&I, Marcoussis France/ENSEA,
Cergy-Pontoise France; P. André, A. Konczykowska, M. Riet, S. Blayac,
J. Godin, OPTO+, Alcatel R&I, Marcoussis France; H. Ouslimani,
ENSEA, Cergy-Pontoise France
WE4C-5: Dispersion Characteristics of EME Microstrip at First
Higher Order
C-K. Wu, C-K. Tzuang, Institute of Communication Engineering,
National Chiao Tung Univ.
WE4A-5: Performance of GaAs-on-Si Power Amplifier for Wireless
Handset Applications
N. Escalera, R. Emrick, S. Franson, B. Farber, G. Garrison, J. Holmes,
S. Rockwell, B. Bosco, Physical Sciences Research Labs, Motorola
Inc.
WE4A-6: Broadband High Efficiency Monolithic InGaP/GaAs HBT
Power Amplifiers for 3G Handset Applications
H. Jäger, A.V. Grebennikov, E.P. Heaney, M/A-COM Eurotec
Operations, Ireland; R. Weigel, Univ. of Linz, Austria
4:50
PM
WE4C-4: Radiation from Ground-plane Photonic Bandgap
Microstrip Waveguides
N. Shino, Z. Popovic, Univ. of Colorado, Dept. of Electrical
WE4C-6: EBG-Enhanced Inductor
H-S. Wu, C-K. Tzuang, Institute of Electrical Communication
Engineering, National Chiao Tung Univ.
WE4B-5: A GaAs MHEMT Distributed Amplifier with Greater than
250 GHz Gain-bandwidth Product for 40-Gb/S Optical
Applications
M.S. Heins, C.F. Campbell, M-Y. Kao, M.E. Muir, J. M. Carroll,
TriQuint Semiconductor
WE4A-7: InGaP PHEMTs for 3.5 GHz W-CDMA Applications
E. Lan, E. Johnson, B. Knappenberger, Motorola, Digital DNA Lab,
SPS; M. Miller, Motorola, Wireless Infrastructure Systems Div., SPS
5:00
PM
WE4B-3: Development of SOI Based MMICs for Wireless LAN
Applications
S. Pinel, S. Chakraborty, S. Venkataraman, S. Mandal, S. Nuttinck,
J. Bhattacharjee, D. Mukherjee, Joy Laskar, School of Electrical
and Computer Engineering, Georgia Institute of Technology
WE4A-4: Implementation of RF Power MOS in 0.18 µm CMOS
Technology for Single Chip Solution
H-M. Hsu, C.H. Chen, Dept. of Electrical Engineering, National Taiwan
Univ., Taipei, Taiwan ROC; C-W. Chen, J-G. Su, T-H. Yeh, J.C-H. Lin,
J.Y-C. Sun, Research Development Center
PM
4:20
PM
4:10
PM
4:00
PM
3:50
PM
3:40
PM
3:30
PM
40
WE4C-7: Reduced Size Capacitive Defect EBG Resonators
X. Gong, W.J. Chappell, L.P.B. Katehi, EECS Dept., Univ. of Michigan,
Ann Arbor
WE4D CAD Techniques
Using Computational Intelligence
WE4E Applications of Time Domain Methods
Chair: K.C. Gupta, Univ. of Colorado at Boulder
Co-chair: Q.J. Zhang, Carleton Univ.
ROOM 615–617
Chair: S. El-Ghazaly, Dept. of Elect. Eng., Arizona
Co-chair: W. Gwarek, Warsaw Univ. of Technology
ROOM 602–604
WE4D-1: Advanced Microwave Modeling Framework Exploiting
Automatic Model Generation, Knowledge Neural Networks
and Space Mapping
V. Devabhaktuni, B. Chattaraj, Q.J. Zhang, Dept. of Electronics,
Carleton Univ., Ottawa, ON Canada; M.C.E. Yagoub, SITE, Univ.
of Ottawa, Ottawa, ON Canada
WE4E-1: A General Framework for Spice-TLM Interconnection
P.P.M. So, W.J.R. Hoefer, Univ. of Victoria, Dept. of Electrical
WE4D-2: Neural Based Dynamic Modeling of Nonlinear Microwave
Circuits
J. Xu, Q.J. Zhang, Dept. of Electronics, Carleton Univ., Ottawa, ON,
Canada; M.C.E. Yagoub, SITE, Univ. of Ottawa, Ottawa, ON Canada
WE4E-2: FDTD Study of Surface Waves in Microstrip and Patch
Structures
E. Semouchkina, G. Semouchkin, W. Cao, Pennsylvania State Univ.
Materials Research Institute; R. Mittra, Pennsylvania State Univ. Dept.
of Electrical Engineering
WE4D-3: A Systematic Approach to a Reliable Neural Model
for PHEMT Using Different Numbers of Training Data
M. Joodaki, G. Kompa, Univ. of Kassel, High Frequency
Engineering Dept.
WE4E-3: Time Domain Field Synthesis with 3D Symmetric
Condensed Node TLM
M.H. Bakr, McMaster Univ., Hamilton, Canada; P.P.M. So,
W.J.R. Hoefer, Univ. of Victoria, Canada
WEDNESDAY
WE4D-4: A Novel Design Approach for Microwave Planar Filters
S.F. Peik, Univ. of Applied Sciences Bremen, Bremen, Germany;
R.R. Mansour, Univ. of Waterloo, Waterloo, ON Canada
WE4D-5: EM-simulator Based Parameter Extraction and
Optimization Technique for Microwave and mm-Wave Filters
P. Harscher, E. Ofli, R. Vahldieck, Swiss Federal Institute
of Technology, Lab for Electromagnetic Fields and Microwave
Electronics (IFH); S. Amari, Royal Military College of Canada,
Dept. ECE
4:40
WE4D-6: Computer-aided Tuning of Microwave Filters Using
Fuzzy Logic
V. Miraftab, R.R. Mansour, Electrical and Computer Engineering
Dept., Univ. of Waterloo
WE4E-6: A New 2-D Image Reconstruction Algorithm Based
on FDTD and Design Sensitivity Analysis
N-W. Kang, Y-S. Chung, H-K. Jung, School of Electrical Engineering,
Seoul National Univ.; C. Cheon, Dept. of Electronis, Univ. of Seoul
5:00
PM
4:50
PM
WE4E-4: Toward Accurate Time-domain Simulation of Highly
Conductive Materials
C. Yuan, Z. Chen, Dalhousie Univ. Electrical and Computer
Engineering Dept.
WE4E-5: Lumped Device Modeling with FDTD Including Packaging
Effects
B.P. Koh, I.J. Craddock, P. Urwin-Wright, C.J. Railton, Univ. of Bristol,
Center for Communication Research
PM
4:30
PM
4:20
PM
4:10
PM
4:00
PM
3:50
PM
3:40
PM
3:30
PM
NOTES
ALSO
Wednesday, June 5, 3:00–5:00 PM
OCCURRI
NG
Special Interactive Forum on the 50th Anniversary of the MTT
WSCTC, South Lobby
This Special Interactive Forum will take place in the historical exhibit area immediately following the Special Session on the 50th
Anniversary of the MTT. Authors will present their work from the 50th Anniversary Special Issue of the MTT Transactions.
41
WEDNESDAY, JUNE 5, 2002 • IF-WE INTERACTIVE FORUM • 1:30–4:30
PM
WEDNESDAY
WSCTC • CHAIR: ROB HAMILTON, TRIQUINT SEMICONDUCTOR • ROOM 6E
IFWE-1: Measurements on Dielectric and Radiation Loss of Flexible Circular Dielectric
Waveguides in Q-band
J.R. Sohn, H.J. Seo, J-W. Han, H-S. Tae, School of Electrical Engineering and Computer Sciences,
Kyungpook Nat’Univ.; J-H. Lee, Radio Science and Communication Engineering, Hongik Univ.
IFWE-2: A Technique for Reducing the Size of Amplifiers Using Defected Ground Structure
J-S. Lim, Y-T. Lee, J-H. Han, S. Nam, School of Electrical Engineering, Seoul National Univ., Seoul,
ROK; J-S. Park, D. Ahn, Div. of Information Technology Engineering, SoonChunHyang Univ.,
Chungnam,
IFWE-3: A New Sandwich Structure of Photonic Bandgap
Y. Pang, B. Gao, Electronic Engineering Dept., Tsinghua Univ., State Key Lab on Microwave and Digital
Communications, Beijing, China
IFWE-4: Amplifier Design Using λ/4 High Impedance Bias Line with Defect Ground Structure
(DGS)
S-G. Jeong, D-K. Hwang, Y-C. Jeong, C-D. Kim, Chonbuk National Univ.
IFWE-5: A Derivation of a Class of 3-port Baluns from Symmetrical 4-port Networks
Y.C. Leong, K.S. Ang, C.H. Lee, DSO National Lab
IFWE-6: An Inverted Coplanar Coupler with Integral Microstrip Interfaces and Bias Crossover
E.J. Crescenzi, Jr., UltraRF, Sunnyvale, CA
IFWE-7: Dividing and Filtering Function Integration for the Development of a Band-pass
Filtering Power Amplifier
S. Avrillon, A. Chousseaud, S. Toutain, IRCCyN UMR CNRS 6597
IFWE-8: Design Method of a Dual Band Balun and Divider
J.H. Sung, S.H. Son, H.J. Lee, Micro-Radio Wave Technologies Ltd, ROK; G.Y. Kim, School
of Information and Communication, Tamna Univ., ROK; Y.J. Song, Y.W. Jeong, H.S. Park, D. Ahn,
Div. of Information Technology Eng
IFWE-9: TFbar Filters for 2 GHz Wireless Applications
K-W. Kim, J-G. Yook, M-G. Gu, W-Y. Song, Y-J. Yoon, H-K. Park, Dept. of EE Eng., Yonsei Univ., Seoul,
Korea
IFWE-10: Ferromagnetic Composite-based and Magnetically-tunable Microwave Devices
E. Salahun, G. Tanné, P. Quéffélec, P. Gelin, LEST, UBO/ENSTBr, Brest Cedex, France; A-L. Adenot,
O. Acher, CEA, Le Ripault, Monts, France
IFWE-11: Field Distributions in Six-port Gyroelectric Semiconductor Circulators with Coplanar
Waveguide (CPW) Feeders
Z.M. Ng, L.E. Davis, R. Sloan, Univ. of Manchester Institute of Science & Technology (UMIST),
Dept. EE&E
IFWE-12: A Novel Microwave Absorber with Surface-printed Conductive Line Patterns
M. Amano, Y. Kotsuka, Dept. of Communications Engineering, Tokai Univ.
IFWE-13: Design of Narrow-band Tunable Band-pass Filters Based on Dual-mode STO Disc
Resonators
A. Deleniv, A. Eriksson, S. Gevorgian, Microwave and High Speed Research Center, Ericsson
Microwave Systems, Moelndal, Sweden, Dept. of Microelectronics MC-2, Chalmers Univ. of
Technology, Sweden
IFWE-14: Microwave Characterization of Thin Film BST Material Using a Simple Measurement
Technique
Z. Jin, Dept. of Electrical and Computer Engineering, N. Carolina State Univ., Raleigh, NC; A. Tombak,
J-P. Maria, B. Boyette, G.T. Stauf, A.I. Kingon, A. Mortazawi
IFWE-15: High-Q mm-Wave Varactors: Extended Tuning Range and Discrete-position Designs
L. Dussopt, G.M. Rebeiz, Univ. of Michigan, EECS Dept.
IFWE-16: Silicon Micromachined RF MEMs Ressonators
K.M.Strohm, B. Schauwecker, J-F. Luy, Fellow, W. Heinrich, DaimlerChrysler Research Center, Ulm,
Germany; F.J. Schmückle, Ferdinand-Braun-Institut (FBH), Berlin, Germany
IFWE-17: Gas Damping Model for a RF MEM Switch and Its Dynamic Characteristics
T. Veijola, T. Tinttunen, Helsinki Univ. of Technology, Finland; H. Nieminen, V. Ermolov, T. Ryhanen,
Nokia Research Center, Finland
IFWE-18: Digital-type RF MEMs Switched Capacitors
J. Rizk, G.M. Rebeiz, Radiation Lab, EECS Dept, Univ. of Michigan, Ann Arbor
IFWE-19: Series Switch Compatible With CMOS Technology
Y. Cai, L.P.B. Katehi, Univ. of Michigan, Radiation Lab, Dept. of Electrical Engineering and Computer
Science, Ann Arbor, MI
IFWE-20: Low Cost Low Actuation Voltage Copper RF MEMs Switches
D. Balaraman, S. Bhattacharya, F. Ayazi, J. Papapolymerou, Georgia Tech
IFWE-21: Atomic Layer Deposition (ALD) Technology
N. Hoivik, J. Elam, S. George, K.C. Gupta, V.M. Bright, Y.C. Lee, Univ. of Colorado at Boulder
IFWE-22: Polyimide Film Based RF MEMs Switches
R. Ramadoss, S. Lee, V.M. Bright, Y.C. Lee, K.C. Gupta, Univ. of Colorado at Boulder, Boulder, CO
IFWE-23: Distributed MEMs Phase Shifters on Silicon Using Tapered Impedance Unit Cells
B. Lakshminarayanan, T. Weller, Univ. of South Florida, Electrical Engineering Dept.
IFWE-24: 40 GHz Monolithic Integrated Mixer in SiGe Bipolar Technology
S. Hackl, J. Böck, M. Wurzer, A.L. Scholtz, Infineon Technologies, Technical University of Vienna
IFWE-25: Designing Reliable High-power Limiter Circuits with GaAs Pin Diodes
D.G. Smith, D.D. Heston, J.G. Heston, B.R. Heimer, Raytheon Systems Co.; K. Decker, TriQuint
Semiconductor
IFWE-26: A 94 GHz High Performance Quadruple Subharmonic Mixer MMIC
K. Kanaya, T. Hisaka, T. Ishikawa, S. Sakamoto, High Frequency and Optical Semiconductor Div.,
Mitsubishi Electric Corp.; K. Kawakami, Information Technology R&D Center, Mitsubishi Electric
Corp.
IFWE-27: Harmonic Boosting for High Performance Mixers
S. Chakraborty, C-L. Lin, J. Laskar, Georgia Institute of Technology, ECE, Atlanta GA; B. Matinpour,
RF Solutions Inc., Atlanta GA
IFWE-28: Development of Ku-band Receiver/Downconverter for Satellite Transponders
J-C. Jeong, Y-H. Lim, B-J. Jang, I-B. Yom, S-P. Lee, ETRI, Communications Satellite Development
Center
IFWE-29: The Design of SiGe HBT LNA for IMT-2000 Mobile Application
J. Lee, G. Lee, J.H. Kim, J.C. Lee, B. Lee, N.Y. Kim, Kwangwoon Univ., Seoul, Korea, Alabama
Microelectronics Science and Technology Center, Auburn Univ., AL
IFWE-30: THz Radiation Using High Power, Microfabricated, Wideband TWTs
C.L. Kory, Analex Corp./NASA Glenn Research Center, Cleveland, OH; J.H. Booske, Univ. of Wisconsin,
Madison; W.-J. Lee, S. Gallagher, D.W. van der Weide, S. Limbach, S. Bhattacharjee
IFWE-31: Simulation and Measurement Results of 150 GHz Integrated Silicon IMPATT Diodes
M. Luschas, R. Judaschke, Arbeitsbereich Hochfrequenztechnik, TU Hamburg-Harburg, Germany;
J.-F. Luy, DaimlerChrysler Research Center, Ulm, Germany
IFWE-32: A Set of Integrated Circuits for 60 GHz Radio Front-end
M. Kärkkäinen, M. Varonen, J. Riska, V. Porra, P. Kangaslahti, Electronic Circuit Design Lab, Helsinki
Univ. of Technology
IFWE-33: mm-Wave Direct Quadrature Converter Integrated with Antenna for Broad-band
Wireless Communications
J-Y. Park, S-S. Jeon, Y. Wang, T. Itoh, Univ. of California, Los Angeles, Dept. of Electrical Engineering
IFWE-34: A Novel HMSM Photodetector with Resonant Cavity for Short Haul Communications
X. Chen, B. Nabet, Electrical and Computer Engineering Dept., Drexel Univ., Philadelphia, PA;
F. Quarantab, A. Cola, Institute of Microelectronics, National Research Council; M. Curriec
IFWE-35: Effect of Substrate Modes In 40 Gbit Travelling Wave LiNbO3 Modulators
K. Goverdhanam, Waveguide and Electro-Opto Research, Agere Systems
IFWE-36: Experimental Results for a CW-mode Optically Controlled Microwave Switch
with a Carrier-confinement Structure
S. Lee, Y. Kuga, R.A. Mullen, Dept. of Electrical Engineering, Univ. of Washington
IFWE-37: Direct Carrier Modulation for Wireless Digital Communications Using an Improved
Microwave-photonic Vector Modulator (MPVM) Approach
S. Chandramouli, W.D. Jemison, Dept. of ECE Lafayette College; E. Funk, Naval Research Lab
IFWE-38: A Novel Dual Frequency Rectenna for High Efficiency Wireless Power Transmission
at 2.45 and 5.8 GHz
Kai Chang, Texas A&M Univ., Dept. of Electrical Engineering
IFWE-39: An Investigation on the Effects of the Array Parameters on the Performance of Spatial
Power Amplifiers with Hard Horn Feeds
M. Ozkar, N. Carolina State Univ., Dept. of Electrical Engineering; A. Mortazawi, Univ. of Michigan,
Dept. of Electrical Engineering and Computer Science
IFWE-40: Radio-wave Beam Shaping Using Holograms
J. Meltaus, J. Salo, E. Noponen, M.M. Salomaa, MilliLab, Radio Lab, Helsinki Univ. of Technology;
A. Räisänen is presently visiting Observatoire de Paris, Paris, France
IFWE-41: How to Increase Locking Range of Coupled Oscillator Cells Without Lowering Q
J. Shen, L.W. Pearson, ECE Dept., Clemson Univ.
IFWE-42: Bandwidth Improvement in a Tile Based Spatial Power Amplifier
A. Al-Zayed, S. Ortiz, N. Carolina State Univ., Dept. of Electrical Engineering and Computer Science;
A. Mortazawi, Univ. of Michigan, Dept. of Electrical Engineering and Computer Science,
IFWE-43: A 10 GHz Integrated Class-E Oscillating Annular Ring Element for High-efficiency
Transmitting Arrays
J.A. Hagerty, Z. Popovic, Univ. of Colorado at Boulder
IFWE-44: A New mm-Wave Printed Dipole Phased Array Antenna Using Microstrip-fed Coplanar
Stripline Tee Junctions
K. Chang, Texas A&M Univ., Dept. of Electrical Engineering
IFWE-45: A Novel Broadband T/R Module for Phased Array Applications in Wireless
Communications
C. Wang, C.T. Rodenbeck, M.R. Coutant, K. Chang, Texas A&M Univ. Dept. of Electrical Engineering
IFWE-46: Multi-layer Spatial Angular Filter with Air Gap Tuner to Suppress the Grating Lobes
of Microstrip Patch Arrays
Y. Lee, S.H. Jeong, W.S. Park, Dept. of Electronic and Electrical Engineering,Pohang Univ. of Science
and Technology; J.S. Yun, S.I. Jeon, Electronics and Telecommunications Research Institute
IFWE-47: Integrated MEM Antenna System for Wireless Communications
B.A. Cetiner, C.H. Chang, J.Y. Qian, M. Bachman, G.P. Li, F. De Flaviis, Univ. of California at Irvine,
Electrical and Computer Engineering Dept., Irvine, CA; L. Jofre, Technical University
IFWE-48: The Design of T/R Module for X-band APAA System Used in Satellite Communications
Y.B. Jung, S.Y. Eom, S.I. Jeon, J.I. Choi, Electronics and Telecommunications Research Institute, ROK
IFWE-49: Experimental APAA for Satellite Communications
S.I. Jeon, J.I. Choi, Electronics and Telecommunications Research Institute, ROK; Y.K. Choi, Agency
for Defense Development, ROK; S.H. Oh, Dept. of Electronics, Chungnam Univ., ROK
IFWE-50: A Novel K-band Frequency-controlled Beam-steering Quasi-Yagi Array with Mixing
Frequency Compensation
T. Nishio, Y. Wang, Y. Qian, T. Itoh, Dept. of Electrical Engineering Univ. of California Los Angeles
IFWE-51: A Frequency Autonomous Retrodirective Array Transponder
K. Leong, R.Y. Miyamoto, S-S. Jeon, Y. Wang, T. Itoh, Dept. of Electrical Engineering, Univ.
of California, Los Angeles
IFWE-52: Effects of Local Oscillator Phase Noise on the Interference Rejection Capability of CDMA
Receivers Using Adaptive Antenna Arrays
G.W. Slade, School of Electrical and Computer Systems Engineering, RMIT
IFWE-53: A Balanced Adaptive Beamforming System for Broadband Wireless Communications
S-S. Jeon, Y. Wang, T. Itoh, Dept. of Electrical Engineering, Univ. of California, Los Angeles
IFWE-54: Impulse Ground Penetrating Radar for Nondestructive Evaluation of Pavements
J.S. Lee, C. Nguyen, Texas A&M Univ. Electrical Engineering Dept.; T. Scullion, Texas A&M Univ. Texas
Transportation Institute
IFWE-55: Reentrant Resonators for Microwave Measurement Units
L.V. Shebalkova, Electronic Devices Research Institute
IFWE-56: An Adaptive Multi-functional Array for Wireless Sensor Systems
R.Y. Miyamoto, K.M.K.H. Leong, S-S. Jeon, Y. Wang, T. Itoh, Dept. of Electrical Engineering,
Univ. of California, Los Angeles
IFWE-57: Compact Multibeam Imaging System for Automotive Radars
B. Schoenlinner, G.M. Rebeiz
IFWE-58: A New Approach for RIN Peak And Phase Noise Suppression in Microchip Lasers
M. Csörnyei, T. Berceli, T. Bánky, T. Marozsák, Budapest Univ. of Technology and Economics, Dept.
of Microwave Telecommunications; P.R. Herczfeld, Drexel Univ. Philadelphia Center
for Microwave-Lightwave Engineering
42
SPECIAL SESSIONS
TU2A: RADIO FREQUENCY INTEGRATED CIRCUITS
FOR 3G TERMINALS AND BASE STATIONS
Date & Time:
Tuesday, June 4; 10:10 to 11:50 AM
Location:
WSCTC, Rooms 608–609
Organizers:
Prof. Robert Weigel; W. Schelmbauer
Speakers:
✗ K. Itoh, Integrated Even Harmonic Type Direct Conversion Receiver
for W-CDMA Mobile Terminals
✗ W. Schelmbauer, An Analog Baseband Chain for a UMTs Zero-IF
Receiver in a 75 GHz SiGe BiCMOs Technology
✗ Y-S. Youn, A 2 GHz RF Front-end Transceiver Chipset in CMOS
Technology for PCS and IMT-2000 Applications
✗ C. Potter, System Analysis of a W-CDMA Base-station PA
Employing Adaptive Digital Predistortion
This session deals with radio frequency integrated circuits and system
aspects for third generation mobile terminals and base stations. Two invited papers demonstrate the first implementations of an integrated even
harmonic type direct conversion receiver and of a zero-IF receiver chip
for wideband-CDMA, respectively. Furthermore, a CMOS transceiver
chipset and system analysis of base station power amplifier are presented.
ical community and promises to open the field up to the general public
for the first time. Other less pervasive applications have been proposed,
all of which would benefit from broader-based interest in the field.
This session will focus on THz technology today with emphasis on
frequencies above 500 GHz and on applications that may not be familiar
to every listener. The session will offer a wide range of speakers on a variety of THz techniques and application areas with emphasis on those subjects that have not traditionally been, or are not now, a part of the microwave community. The goal will be to rekindle interest in this application area and bring back many of the experts who have either drifted
away from IEEE or have come into the field from other disciplines.
In order to draw in speakers with substantial experience and cover areas not traditionally part of todays MTT, the session will be composed
mostly of invited talks.
TH3D: WIDE BANDGAP DEVICES AND THEIR APPLICATION
IN HIGH POWER AND LOW NOISE CIRCUITS
Date & Time:
Location:
Organizers:
Kevin Webb; Scott Sheppard
Speakers:
✗ L.F. Eastman, Experimental Power-frequency Limits of AlGan/Gan
HEMTs
✗ R.J. Trew, AlGan/Gan HFET Amplifier Performance and
Limitations
✗ T. Kikkawa, A 36W CW AlGan/Gan-power HEMT Using Surfacecharge-controlled Structure
✗ W.L. Pribble, Applications of SiC MESFETs and Gan HEMTs in
Power Amplifier Design
✗ S.C. Binari, Trapping Effects in Wide-bandgap Microwave FETs
Wide bandgap semiconductor devices, such as silicon carbide FETs
and IMPATTs, and gallium nitride HEMTs on silicon carbide substrates, offer the opportunity for dramatically increased power densities.
In oscillator applications, low 1/f noise is important, and in receiver applications, low microwave noise is critical. Advances in wide bandgap
material systems have recently led to devices with good microwave performance, thereby yielding opportunities for high power and also low
noise circuits. This session offers a forum for the presentation of recent
advances in both wide bandgap devices and their utilization in circuits.
TH1E: HIGH-SPEED/NON-CONTACTING ELECTRICAL PROBING
Date & Time:
Thursday, June 6; 8:00 to 9:40 AM
Location:
Organizers:
Dylan Williams; Paul Hale
Speakers:
✗ T. Nagatsuma, Millimeter-Wave Network Analyzers Based on
Photonic Techniques
✗ W. Mertin, Contactless Probing of High-Frequency Electrical
Signals with Scanning Microscopy
✗ A.J.A. Smith, Optoelectronic Techniques for Improved High Speed
Electrical Risetime Measurements
✗ M.K. Mc Manus, Picosecond Imaging Circuit Analysis of HighSpeed Digital Circuits
✗ Y. Norihide, Atomic Force Microscopy for IC Test
This joint IMS/ARFTG session will address high-speed and non-contacting electrical probing for a variety of microwave applications. Particular emphasis will be placed on instrumentation and calibrations for
testing 40 Gb/s digital circuitry associated with high-speed optical links
and noncontact probing for testing dense digital integrated circuits.
TH4D: OPTICAL PROCESSING OF ANTENNA SIGNALS
Date & Time:
Location:
Organizer:
Robert Minasian
Speakers:
✗ H.R. Fetterman, Multiple Output Photonic RF Phase Shifters for
Optically Controlled Radar Systems
✗ S.A. Khan, Flexible Beamformer and Remoting Head for Optically
Controlled Phased Array Antennas
✗ J.L. Corral, A Novel 2N Beams Heterodyne Optical Beamforming
Architecture Based on NXN Optical Butler Matrices
✗ J.L. Corral, Photonic True-time Delay Beamformer for Broadband
Wireless Access Networks at 40 GHz Band
✗ G. Maury, Optical Mixing of Antenna Signals in WDM Systems
✗ B. Ortega, Optimization of an Optical System Based on a Chirped Fibre
Bragg Grating for Driving Phased Array Antennas
Photonics provides a powerful technique for processing high bandwidth antenna signals. A major future challenge is new fibre-optic microwave transport systems that also have in-built signal conditioning, in
applications such as fibre-radio and phased array signal distribution.
Photonics offers advantages of extremely high time-bandwidth products,
EMI immunity, and dense parallel signal processing capabilities using
WDM. It also opens up new microwave signal processing functions for
high resolution, wideband and adaptive processing for the evolution of
future antenna systems that need increased instantaneous bandwidths.
The object of this Special Session is to bring together leading researchers
from around the world to present the current state-of-the-art in optical
processing of antenna signals. Topics to be addressed include optical microwave filters, A/D converters, photonic interference mitigation filtering, frequency converters, and beamforming in phased arrays.
TH2B: THZ TECHNOLOGY AND APPLICATIONS
Date & Time:
Thursday, June 6; 10:10 to 11:50 AM
Location:
Organizers:
Peter H. Siegel; Mohammed N. Afsar
Speakers:
✗ D. Mittleman, T-Ray Imaging: New Possibilities in the Far Infrared
✗ F.C. DeLucia, THz Spectroscopy – Techniques and Applications
✗ M.J. Coulombe, Submillimeter-Wave Polarimetric Compact Ranges
for Scale-model Radar Measurements
✗ B. Deng, THz Techniques in Plasma Diagnostics
✗ E.R. Brown, Remote Detection of Bioparticles in theTHz Region
Despite great scientific interest since at least the 1920s, the THz frequency range remains one of the least tapped regions of the electromagnetic spectrum. Sandwiched between traditional microwave and optical technologies where there is a limited atmospheric propagation path, little commercial emphasis has been placed on THz systems. This has, perhaps
fortunately, preserved some unique science and applications for tomorrow’s
technologists. For over 25 years the major niche for THz technology has
been in the high resolution spectroscopy and remote sensing areas where
heterodyne and Fourier transform techniques have allowed astronomers,
chemists, Earth, planetary and space scientists to measure, catalog and map
thermal emission lines for a wide variety of lightweight molecules. As it
turns out, nowhere else in the electromagnetic spectrum do we receive so
much information about these chemical species. In fact, the universe is
bathed in THz energy, most of it going unnoticed and undetected.
Commercial uses for THz sensors and sources are just beginning to
emerge as the technology enables new instrumentation and measurement
systems. So called T-Ray imaging is tantalizing the interests of the med-
43
8:00–9:30
AM
TH1A Flip-chip Techniques and Novel Application
of Organic Materials in Packaging
TH1B Low Noise Devices and Applications
TH1C Synthesis and Multi-mode Techniques
Chair: W. Heinrich, Ferdinand-Braun-Institut
Co-chair: R. Franklin-Drayton, Univ. of Minnesota
ROOM 608–609
Chair: M.S. Gupta, San Diego State Univ.
Co-chair: T.C. Cisco, Raytheon
ROOM 606–607
Chair: W.C. Tang, Com Dev International
Co-chair: J.W. Modelski, Warsaw Univeresity of Technol
ROOM 611–612
TH1A-1: Suppression of Multi-path Couplings in MCM with a
Flip-chipped SiGe-MMIC
T. Nishino, M. Shimozawa, N. Suematsu, H. Oohashi, T. Takagi,
O. Ishida, Mitsubishi Electric Co, Information Technology R&D
Center; T. Ikushima, K. Sadahiro, T. Katsura, K. Maeda, K. Itoh,
Mitsubishi Electric Co, Mobile Communications
TH1B-1: Intrinsic Noise Characteristics of AlGaN/GaN HEMTs
S. Lee, School of Electrical and Computer Engineering, Purdue Univ.,
West Lafayette, IN; V. Tilak, L.F. Eastman, School of Electrical
Engineering, Cornell Univ., Ithaca, NY; K.J. Webb, School of Electrical
TH1C-1: Synthesis of Advanced Microwave Filters
without Diagonal Cross-couplings
R.J. Cameron, Com Dev International; A.R. Harish, Com Dev Wireless;
C.J. Radcliffe, Pentire Associates
TH1A-2: Flip-chip Mounted, Ku-band Power Amplifier Compliant
with Space Application
O. Vendier, J-P. Fraysse, C. Schaffauser, M. Paillard, C. Drevon,
J-L. Cazaux, D. Floriot, N. Caillas-Devignes, H. Blanck, P. Auxemery,
W. de Ceuninck, R. Petersen, N. Haese, P-A. Rolland
TH1B-2: A 2.4 GHz to 5 GHz CMOS Low Noise Amplifier
with High-resistivity Eltran® SoI-Epi™ Wafers
J. Kodate, M. Ugajin, T. Tsukahara, T. Douseki, NTT
Telecommunications Energy Lab; N. Sato, T. Okabe, K. Ohmi,
T. Yonehara, Canon Inc.
TH1C-2: A Method for the Direct Synthesis of Cascaded
Quintuplets
T.B. Reeves, TRAK Microwave, Inc.; N.D. van Stigt, R3 Microwave
TH1A-3: W-band Flip-chip Interconnects on Thin-film Substrate
F.J. Schmueckle, A. Jentzsch, W. Heinrich, Ferdinand-Braun-Institut;
H. Oppermann, Fraunhofer-Institut IZM; K. Riepe, United Monolithic
Semiconductors GmbH
TH1B-3: A Modified Cascode Type Low Noise Amplifier Using Dual
Common Source Transistors
S. Ock, J-R. Lee, Future Communications IC; K. Han, B. Kim, Dept.
of Electronic and Electrical Engineering Pohang Univ. of Science
and Technology
TH1C-3: Parameter Extraction for Symmetric Coupled-resonator
Filters
H-T. Hsu, Z.Y. Zhang, K.A. Zaki, Dept. of Electric and Computer
Engineering, Univ. of Maryland at College Park; A.E. Atia, Orbital
Sciences Corp.
TH1B-4: Ku-band Low Noise MMIC Amplifier with Bias Circuit for
Compensation of Temperature Dependence and Process Variation
K. Yamanaka, K. Yamauchi, K. Mori, Y. Ikeda, T. Takagi, Mitsubishi
Electric Corp., Information Technology R&D Center; H. Ikematsu,
Mitsubishi Electric Corp., Communication Systems Center;
N. Tanahashi, Mitsubishi Electric
TH1C-4: Design Procedure for Waveguide Filters
with Cross-couplings
J. Kocbach, K. Folgerø, Nera ASA, Nera Research, Bergen, Norway
TH1A-4: A Locally Matching Technique for Broadband Flip-chip
Transition Design
C-L. Wang (student), R-B. Wu (professor), Dept. of Electrical
Engineering, National Taiwan Univ.
TH1A-5: Development of an Organic Wafer-level Packaging
Platform for Highly Integrated RF Transceivers.
R. Ramachandran, A.Pham, Clemson Univ., Clemson
9:00
AM
8:50
AM
8:40
AM
8:30
AM
8:20
AM
8:10
AM
8:00
AM
THURSDAY, JUNE 6, 2002
9:30
AM
9:20
AM
9:10
AM
TH1C-5: Dual-mode Filters with Grooved Dielectric Resonators
for Cellular-radio Base Stations
L. Accatino, G. Bertin, Telecom Italia Lab, Torino; M. Mongiardo,
Dipartimento di Elettronica, Universita’ di Perugia; G. Resnati,
FOREM, SRL, Agrate Brianza
TH1A-6: Design of Inductors in Organic Substrates for 1-3 GHz
Wireless Applications
S. Dalmia, F. Ayazi, M. Swaminathan, S.H. Min, S.H. Lee, W. Kim,
D. Kim, S. Bhattacharya, V. Sundaram, G. White, R. Tummala,
Georgia Institute of Technology
TH1B-5: A 7.9 to 9.7 GHz On-chip Radar Receiver Front-end
for Future Adaptive X-band Smart Skin Array Antennas
J.R. Malmqvist, O.M. Alfredsson, B.A. Gustafsson, A. Ouacha, FOI
Swedish Defence Research Agency Microwave Technology Dept.
TH1A-7: Integrated Inductors in the Chip-TO Board Interconnect
Layer Fabricated Using Solderless Electroplating Bonding
Y-H. Joung, S. Nuttinck, S-W. Yoon, M.G. Allen, J. Laskar, Georgia
Institute of Technology
TH1C-6: A Dual Mode Filter with Trifurcated Iris and Reduced
Footprint
M. Yu, D.J. Smith, A. Sivadas, W. Fitzpatrick, COM DEV International,
Cambridge, Ontario, Canada
TH1C-7: Method of Spurious Mode Compensation Applied
to Manifold Multiplexer Design
D. Bariant, S. Bila, D.E. Baillargeat, S. Verdeyme, P. Guillon, IRCOM
UMR, D. Pacaud, J-J. Herren,Alcatel Space Industries
44
TH1D Ferroelectric, Ferrite
and Acoustic Components
Joint ARFTG/IMS2002 Special Session
Chair: D. Williams, NIST
Co-chair: P. Hale, NIST
ROOM 602–604
TH1F Spatial Power Combining
and Quasi-optical Techniques
Chair: D. Palmer, U.S. Army Research Office
Co-chair: A. Mortazawi, Univ. of Michigan
ROOM 613–614
TH1D-1: A New X Band 180° High Performance Phase Shifter Using
(Ba,Sr)Tio3 Thin Films
B. Acikel, R.A. York, Electrical & Computer Engineering Dept.,UC
Santa Barbara, Santa Barbara, CA; T.R. Taylor, P.J. Hansen,
J.S. Speck, Materials Dept.,UC Santa Barbara, Santa Barbara, CA
TH1E-1: Invited: Contactless Probing of High Frequency Electrical
Signals with Scanning Probe Microscopy
TH1F-1: A Ka-band Perpendiculary-fed Patch Array for Spatial
Power Combining
S. Ortiz, Harris Corp., Melbourne, FL; A. Al-Zayed, Dept. of Electrical
and Computer Engineering, N. Carolina State Univ., Raleigh, NC;
A. Mortazawi, Dept. of Electrical Engineering and Computer Science,
TH1D-2: A Wide Bandwidth Monolithic BST Reflection-type Phase
Shifter Using a Coplanar Waveguide Lange Coupler
D.S. Kim, Y.S. Choi, M.G. Allen, J.S. Kenney, Georgia Institute
of Technology, School of Electrical and Computer Engineering,
Atlanta, GA; B. Garvey, D. Kiesling, Microcoating Technologies Inc.
Chamblee, GA
TH1E-2: Invited: mm-Wave Network Analyzers Based on Photonic
Techniques
T. Nagatsuma, N. Sahri, A. Hirata, Y. Royter, A. Sasaki, NTT
Telecommunications Energy Lab
TH1F-2: A Waveguide Mode-converter Feed for a 5 W, 34 GHz Grid
Amplifier
C-T. Cheung, D.B. Rutledge, California Institute of Technology,
Pasadena, CA; J.B. Hacker, G. Nagy, Rockwell Scientific Co. LLC,
Thousand Oaks, CA
TH1E-3: Invited: Optoelectronic Techniques for Improved High
Speed Electrical Risetime
A.J.A. Smith, A.G. Roddie, P.D. Woolliams, National Physical Lab
TH1F-3: A 10 GHz High-efficiency Active Antenna Sub-array
S. Pajic, Z. Popovic, Univ. of Colorado at Boulder
TH1E-4: Invited: Picosecond Imaging Circuit Analysis of ULSI
Microprocessors
M.K. Mc Manus, IBM Research, Yorktown Heights
TH1F-4: Quasi-optical E-band MEMs Switching Arrays
W-K. Zhang, C.W. Domier, N.C. Luhmann, Jr, Univ. of California,
Davis,Dept. of Applied Science; F. Jiang, Wytec Inc.
TH1E-5: Electric-field Observation of Pico-pulse Propagation on
Right-angle Bends by Miniature Photoconductive Near-field Probe
J. Lee, J. Kim, KAIST, Electrical Engineering & Computer Science
Dept.
TH1F-5: A Circularly Polarized Rectifying Antenna Array for
Wireless Microwave Power Transmission with Over 78% Efficiency
B.H. Strassner, K. Chang, Texas A&M Univ. Electrical Engineering
Dept.
TH1E-6: Field-tuneable Probe for Combined Electric and Magnetic
Field Measurements
R.M. Reano, J.F. Whitaker, L.P.B. Katehi, Univ. of Michigan
TH1F-6: A Multi-element 150 to 300 GHz Spatial Power
Dividing/Combining Frequency Doubler
B. Schumann, M. Hoeft, R. Judaschke, Arbeitsbereich
Hochfrequenztechnik, Technische Universität Hamburg-Harburg,
Hamburg
TH1D-3: Bandwidth and Losses of 4-port Ferrite Coupled Line
Circulators
C.K. Queck, L.E. Davis, Microwave Engineering Group, Dept.
of Electrical Eng. & Electronics, UMIST, Manchester, UK
TH1D-4: Modeling and Optimization of Parallel Line Edge Mode
Isolators
A.H. Aly, B. Elsharawy, Dept. of Electrical Engineering, Arizona State
Univ., Tempe, AZ
9:30
AM
9:20
THURSDAY
TH1D-5: SAW FEMs for GSM-based Multi-band Cellular Phones
with Direct-conversion Demodulation
M. Hikita, Central Research Lab. Hitachi Ltd., Kokubunji, Tokyo,
Japan; N. Matsuura, Y. Yokoyama, K. Sakiyama, Hitachi Media Ltd.;
N. Shibagaki, C.R.L. Hitachi Ltd.
AM
9:10
AM
9:00
AM
8:50
AM
8:40
AM
8:30
AM
8:20
AM
8:10
AM
8:00
AM
Chair: C.C.W. Ruppel, EPCOS AG
Co-chair: J. Owens, Boise State Univ.
ROOM 615–617
TH1E High-speed/Non-contacting Electrical
TH1D-6: Bulk Acoustic Wave Resonators and Filters
for Applications Above 2 GHz
K. Lakin, J. Belsick, J. McDonald, K.T. McCarron, C. Andrus, TFR
Technologies Inc.
45
10:10
AM–12:00 PM
TH2A Packaging
TH2B Special Session on THz Technology
and Applications
TH2C Novel Filter Structures
Chair: B.R. Allen, TRW
Co-chair: M.A. Gouker, MIT Lincoln Lab
ROOM 608–609
Chair: P.H. Siegel, Caltech JPL
Co-chair: M. Afsar, Tufts Univ.
ROOM 606–607
Chair: S. Kanamaluru, Sarnoff Corp.
Co-chair: A.E. Atia, Orbital Sciences Corp.
ROOM 611–612
TH2A-1: Design of an LTCC Integrated Tri-band Direct Conversion
Receiver Front-end Module
R. Lucero, A. Pavio, D. Penunuri, J. Bost, Solid State Research Center,
Motorola Labs
TH2B-1: Invited: T-Ray Imaging: New Possibilities in the Far
Infrared
D.M. Mittleman, Rice Univ.
TH2C-1: Suspended Resonators for Filters-reduced Wavelength
Excitation of Evanescent Cavities Using High Dielectric Constant
Feedlines
R.V. Snyder, RS Microwave; E. Niver, K.Um, S. Shin, New Jersey
Institute of Technology
TH2A-2: An L-band, LTCC Frequency Doubler Using Embedded
Lumped Element Filters
R.B. Hurley, G.T. Sloan, Sandia National Lab
TH2B-2: Invited: THz Spectroscopy — Techniques and Applications
F.C. De Lucia, Ohio State Univ. Dept. of Physics
TH2C-2: Lumped-element Conductor-loaded Cavity Resonator
H. Salehi, R.R. Mansour, Electrcial & Computer Engineering
Department, Univ. of Waterloo; V. Dokas, COM DEV International
TH2B-3: Invited: Submillimeter-Wave Polarimetric Compact
Ranges for Scale-model Radar Measurements
M.J. Coulombe, J. Waldman, R.H. Giles, UMass Lowell STL;
W.E. Nixon, US Army National Ground Intelligence Center
TH2C-3: Novel Coupling Schemes for Microwave Resonator Filters
U. Rosenberg, Royal Military College of Canada, Canada; Marconi
Communications, GmbH, Backnang, Germany; S. Amari, Dept. of ECE,
Kingston, ON, Canada
TH2B-4: Invited: THz Techniques in Plasma Diagnostics
B.H. Deng, Univ. of California at Davis, Dept. of Applied Science,
Davis, CA; C.W. Domier, K.C. Lee, N.C. Luhmann, Jr., Univ.;
A.J.H. Donné, E. Mazzucato, T. Munsat, H. Park, M. van de Pol
TH2C-4: Folded Quarter-wave Resonator Filters with Chebyshev,
Flat Group Delay, or Quasi-elliptical Function Response
C-Y. Chang, C-C. Chen, H-J. Huang, Institute of Electrical
Communication Engineering, National Chiao Tung Univ., Hsinchu,
Taiwan
TH2A-3: 3D Integrated LTCC Module Using MbGa Technology
for Compact C-band RF Front-end Module
S. Pinel, S. Chakraborty, S. Mandal, H. Liang, K. Lim, M. Tentzeris,
School of Electrical and Computer Engineering Georgia Institute
of Technology; M. Roellig, R. Kunze, R. Tummala, Packaging
Research Center; J. Laskar, School
TH2A-4: Low Temperature Co-fired Ceramic: An Enabler of High
Power RF Integrated Amplifiers
P. Piel, J. Estes, S. Marshall, G. Funk, A. Pavio, Motorola
TH2A-5: High Performance RF Passive Integration on Si Smart
Substrate
D-W. Kim, Telephus Inc.; I-H. Jeong, H-S. Sung, T-O. Kong, J-S. Lee,
C-M. Nam, Telephus Inc., Y-S. Kwon, Dept. of EE, Korea Advanced
Institute of Science and Technology
TH2C-5: Stepped Impedance Resonator Bandpass Filters with
Tunable Transmission Zeros and Its Application to Wide Stopband
Design
J-T. Kuo, E. Shih, National Chiao Tung Univ. Dept. of Communications
Engineering
11:40
PM
11:30
PM
11:20
PM
11:10
PM
11:00
PM
10:50
PM
10:40
AM
10:30
AM
10:20
AM
10:10
AM
TH2A-6: Micromachined Low Dispersion Interconnects
for Optoelectronic Array Packaging
S.R. Banerjee, R.F. Drayton, Univ. of Minnesota Dept. of Electrical
TH2B-5: Invited: Remote Detection of Bioparticles in the THz
Region
E.R. Brown, UCLA, Los Angeles, CA; D.L. Woolard, US Army Research
Office, Research Triangle Park, NC; A.C. Samuels, Aberdeen Proving
Ground, Aberdeen, MD; T. Globus, B. Gelmont, Univ. of Virginia,
Charlottesville, VA
TH2A-7: Use of a Transparent Conductive Thin-film on a Glass
Substrate in Active Integrated Antenna Arrays with Double Strong
Coupling
K. Oshima, N. Kidera, K. Niwano, K. Ikawa, Asahi Glass Co., Ltd.
Research Center; R. Sonoda, S. Kawasaki, Tokai Univ., Dept.
of Electrical and Electronic Engineering
TH2C-6: A Ku-band Low-loss Stripline Low-pass Filter for LTCC
Modules with Low-impedance Lines to Obtain Plural
Transmission Zeros
T. Ohwada, H. Ikematsu, H. Oh-hashi, T. Takagi, O. Ishida, Mitsubishi
Electric Corp.
TH2C-7: Design and Analysis of Novel Compact Inductor
Resonator Filter
G-A. Lee, F. De Flaviis, Conexant Systems Inc., Newport Beach, CA;
M. Megahed, Dept. of Electrical and Computer Engineering,
Univ. of California, Irvine, Irvine, CA
46
TH2E Microwave Measurements Inc.
TH2F Microwave Photonics
Chair: F. Raab, Green Mountain Radio Research
Co-chair: J. Sevic, Tropian Inc.
ROOM 615–617
Chair: R. Henderson, Motorola Inc.
Co-chair: R.D. Pollard, The Univ. of Leeds
ROOM 602–604
Chair: D. Jaeger, Gerhard-Mercator-Universitaet Duisbur
Co-chair: C. Cox, Photonic Systems Inc.
ROOM 613–614
TH2D-1: Switched-mode Class P — A New Challenge
for High-efficiency RF And Microwave Power Amplifiers
A.V. Grebennikov, H. Jaeger, M/A-COM Eurotec Operations
10:10
AM
TH2D High Efficiency Amplifier Techniques
10:30
AM
10:20
AM
TH2E-2: Error Analysis of the Unloaded Q-factors of a
Transmission-type Resonator Measured by the Insertion Loss
Method and the Return Loss Method
Z. Ma, Y. Kobayashi, Dept. of Electrical and Electronic Systems,
Saitama Univ.
TH2D-2: Demonstration of A Switchless Class E/F(Odd) Dual-band
Power Amplifier
F. Bohn, S. Kee, A. Hajimiri, Dept. of Electrical Engineering,
California Institute of Technology
TH2E-3: Comparing Measurements of the Unloaded Q-factor
of a High-Q Dielectric Resonator Using the Transmission Mode
and Reflection Mode Methods Involving S-parameter
K. Leong, J. Mazierska, M.V. Jacob, D. Ledenyov, Electrical and
Computer Engineering, James Cook Univ.
TH2F-2: Nonlinear Distortion and Crosstalk in Microwave
Fiber-radio Links
E.E. Funk, A.L. Campillo, D.A. Tulchinsky, Naval Research Lab
TH2D-3: Push/Pull Class-DE Switching Power Amplifier
A.S. Alipov, V.B. Kozyrev, Moscow Tech. Univ. of Communications
and Informatics Chair of Radiotransmitters
TH2E-4: Removal of Cable and Connector Dispersion
in Time-domain Waveform Measurements on 40 Gb ICs
J.B. Scott, B. Behnia, M. Vanden Bossche, A. Cognata, J. Verspecht,
F. Verbeyst, D.R. Scherrer, Agilent Technologies
TH2F-3: Optical Delivery of Modulated mm-Wave Signals Using
Free-running Laser Heterodyne with Frequency Drift Cancellation
L.A. Johansson, A.J. Seeds, Dept. of Electronic and Electrical
Engineering, Univ. College London, London, UK
TH2E-5: Characterization of a Solid 8 GHz Transient Signal
Analyzer
A. Ghis, P. Ouvrier-Buffet, LETI (CEA-Technologies Avancées);
N. Rolland, A. Benlarbi-Delai, P.A. Rolland, D. Glay, IEMN/DHS;
D.Jaeger, IN-SNEC
TH2F-4: 10 and 39 GHz Band InP/InGaAs HPT Direct Optical
Injection-locked Oscillator ICs for Optoelectronic Clock Recovery
Circuits
H. Kamitsuna, T. Shibata, K. Kurishima, M. Ida, NTT Photonics Lab,
NTT Corp.
TH2D-6: The Switching Noise Active Cancellation for The DC-DCConverter Driven RF Power Amplifier
H. Kobayashi, Fuji Electric Co., Ltd., Nagano, Japan; P.M Asbeck,
Univ. of California, San Diego, La Jolla, CA
TH2E-6: A Sampled-line Reflectometer for Submillimeter-Wave
Measurements
S. Ulker, R.M. Weikle II, School of Engineering and Applied Science,
Univ. of Virginia
TH2F-5: A WDM Fiber-radio Experiment Incorporating
a Wavelength Self-tunable Single-sideband Filter
E. Vourch, LEST-ENST Bretagne; D. Le Berre, LEST-Univ. of Brest;
D. Herve, ENST Bretagne
TH2D-7: A Novel EER Transmitter Using Two-point Delta-Sigma
Modulation Scheme for WLAN and 3G Applications
K.C. Peng, J.K. Jau, T.S. Horng, National Sun Yat-Sen Univ. Electrical
Engineering Dept.
TH2E-7: Sampling Circuit on Silicon Substrate for Frequencies
Beyond 50 GHz
P. Abele, M. Birk, (now with AT&T Labs-Research, Red Bank, New
Jersey), D. Behammer, H. Kibbel, A. Trasser, P. Maier, K.-B. Schad, E.
Soenmez, H. Schumacher, Dept. of Electron Devices and Circuits,
Univ. of Ulm, Germany,
TH2F-6: A Circuit Model of Traveling Wave Electroabsorption
Modulator
J. Lim, S. Hong, Dept. of EECS, Korea Advanced Institute of Science
and Technology; S. Jeon, Knowledge*on Inc.; J. Kim, Basic Research
Lab, Electronics Telecommunication Research Institute
10:40
AM
TH2F-1: Implementing Subcarrier-based Control in Optical
Networking
A.E. Willner, Univ. of Southern California
TH2D-4: Harmonic Tuned PAS Design Criteria
P. Colantonio, F. Giannini, G. Leuzzi, E. Limiti, Dipartimento di
Ingegneria Elettronica, Università di Roma Tor Vergata
TH2F-7: Predistortion Circuit Design for Second- and Third-order
Simultaneous Linearization in Multiservice Telecommunications
L. Roselli, V. Borgioni, F. Zepparelli, M. Comez, Dipartimento di
Ingegneria Elettronica e dell’Informazione, Università di Perugia;
P. Faccin, A. Casini, Tekmar Sistemi S.r.l, Faenza, Italy
11:40
47
THURSDAY
TH2D-5: Finite DC Feed Inductor in Class E Power Amplifiers —
A Simplified Approach
D.K. Choi, RF Electronics Lab, Nokia Research Center (NRC),
Mountain View, CA; S.I. Long, Dept. of Electrical and Computer
Engineering, Univ. of California, Santa Barbara, CA
AM
11:30
AM
11:20
AM
11:10
AM
11:00
AM
10:50
AM
TH2E-1: Dielectric Sleeve Resonator Techniques
for Variable-temperature Microwave Characterization of
Ferroelectric Materials
R.G. Geyer, P. Kabos, J. Baker-Jarvis, National Institute of Standards
and Technology
1:20–3:00
PM
TH3A Advanced V-band Transceiver Technology
TH3B Biological Effects and Medical Applications
TH3C Waveguide and Planar Filter Structures
Chair: E.C. Niehenke, Niehenke Consulting
Co-chair: P. Saunier, TriQuint Semiconductor
ROOM 608–609
Chair: A.V. Vorst, Microwaves UCL
Co-chair: R. Bansal, Univ. of Connecticut
ROOM 606–607
Chair: C. Wang, Radio Frequency Systems
Co-chair: R.V. Snyder, RS Microwave Inc.
ROOM 611–612
TH3A-1: Compact LNA and VCO 3-D MMICs Using Commercial
GaAs PHEMT Technology for V-band Single-chip TRX MMIC
K. Nishikawa, T. Nakagawa, K. Araki, NTT Network Innovation Lab;
B. Piernas, Fujitsu Compound Semiconductor Inc.; K. Kamogawa,
NTT DoCoMo Inc.
TH3B-1: A Rugged Microstrip Tapered Balun Printed Dipole
Reference for SAR System Verification
M. Richard, M. Kanda, C. DiNallo, C.K. Chou, Motorola Florida
Research Labs, Corporate EME Research Lab, Ft. Lauderdale, FL
TH3C-1: A Two Zero Fourth Order Microwave Waveguide Filter
Using a Simple Rectangular Quadruple-mode Cavity
N. Boutheiller, P. Jarry, E. Kerherve, J.M. Pham, IXL Lab, Univ.
Bordeaux; S. Vigneron, Alcatel Space
TH3A-2: A 60 GHz mm-Wave MMMIC Chipset for Broadband
Wireless Access System Front-end
Y. Mimino, K. Nakamura, Y. Hasegawa, Y. Aoki, S. Kuroda,
T. Tokumitsu, Fujitsu Quantum Devices Ltd.
TH3B-2: Evaluation of Human Exposure in the Vicinity of a Base
Station Antenna Using the Multiple Region/FDTD Hybrid Method
P. Bernardi, M. Cavagnaro, S. Pisa, E. Piuzzi, Dept. of Electronic
Engineering, Univ. La Sapienza of Rome
TH3C-2: 26 GHz TM11D Mode Dielectric Resonator Filter and
Duplexer with High-Q Performance and Compact Configuration
A. Enokihara, Matsushita Electric Industrial Co.,Ltd. Advanced
Technology Research Lab; H. Nanba, T. Nakamura, Matsushita Nitto
Electric Co., Ltd. Engineering Dept.; T. Ishizaki, Matsushita; T. Uwano
TH3A-3: A 60 GHz MMIC Chipset for 1 Gbit Wireless Links
K. Fujii, S. Hessel, H. Morkner, Agilent Technologies, SPG R&D,
Newark, CA.
TH3B-3: Theoretical Evaluation of UMTS/GSM Electromagnetic
Fields on Neuronal Network Response
F. Apollonio, M. Liberti, G. D’Inzeo, ICEmB at La Sapienza Univ.
of Rome, Rome, Italy
TH3A-4: A Highly Integrated MMIC Chipset for 60 GHz Broadband
Wireless Applications
O. Vaudescal, B. Lefebvre, V. Lehoué, P. Quentin, United Monolithic
Semiconductors (UMS)
2:30
PM
2:40
PM
2:50
TH3B-4: A Parallel FDT Tool for the Solution of Large Dosimetric
Problems: An Application to the Interaction Between Humans
and Radiobase Antennas
L. Catarinucci, L. Tarricone, Univ. of Lecce, Dept. of Innovation
Engineering; P. Palazzari, Centro Ricerche Casaccia — ENEA
TH3C-3: Low-spurious Coaxial-line Bandpass Filter with Saucerloaded Stepped-impedance Resonators
H. Uchida, Y. Furukawa, T. Ohwada, N. Yoneda, M. Miyazaki,
Mitsubishi Electric Corp.
TH3B-5: Confocal Microwave Imaging for Breast Tumor
Detection: Application to a Hemispherical Breast Model
M. Okoniewski, Electrical and Computer Engineering, Univ.
of Calgary
TH3C-4: 60 GHz Band Dielectric Waveguide Filters
with Cross-coupling for Flip-chip Modules
M. Ito, K. Maruhashi, K. Ohata, Photonic and Wirelss Devieces
Research Labs., NEC Corp.; K. Ikuina, T. Hashiguchi, Functional
Devices and Materials Reserach Labs., NEC Corp.; S. Iwanaga, NEC
Kansai Ltd.
TH3A-5: A Compact 60 GHz Sub-harmonically Pumped Mixer
MMIC Integrated with an Image Rejection Filter
A. Yamada, Y. Amano, Y. Motouchi, N. Takahashi, E. Suematsu,
H. Sato, Sharp Corp. Advanced Technology Research Lab
PM
2:20
PM
2:10
PM
2:00
PM
1:50
PM
1:40
PM
1:30
PM
1:20
PM
TH3A-6: GaAs HBT Operating as Integrated V- to W-band Gunn
Oscillator
M. Rudolph, R. Doerner, P. Heymann, Ferdinand-Braun-Institut
(FBH)
TH3C-5: A Novel Compact Coplanar Filter
T. Paillot, D. Cros, P. Blondy, IRCOM
TH3B-6: Study of The Activity of Neurological Cell Solutions Using
Complex Permittivity Measurement
M-R. Tofighi, A. Daryoush, Dept. of ECE, Drexel Univ., Philadelphia,
PA
TH3C-6: Novel Low-pass Filter for Broad-band Spurious
Suppression
M.Q. Lee, K-K. Ryu, I-B. Yom, S-P. Lee, Communication Satellite
Development Center, Electronics Telecommunications Research
Institute, Yusung-Gu, Daejon, Korea
TH3B-7: A Compact Low Cost Add-on Module for Doppler Radar
Sensing of Vital Signs Using a Wireless Communications Terminal
V.M. Lubecke, O. Boric-Lubecke, E. Beck, Bell Labs, Lucent
Technologies
TH3C-7: Improvement of Microstrip Open Loop Resonator Filter
Using Aperture
S.S. Im, C.H. Seo, J.H. Kim, School of Electronic Engineering,
Soongsil Univ, Seoul, S. Korea; Y.W. Kim, N. Kim, ETRI, Daejern,
S. Korea
TH3B-8: Modeling of Planar Annular Applicators for Microwave
Thermotherapy
J. Carlier, V. Thomy, J-C. Camart, L. Dubois, J. Pribetich, IEMN —
Universite Des Sciences & Technologies De Lille
TH3C-8: Full Wave Optimization of Stripline Tapped-in Ridge
Waveguide Bandpass Filters
M.A. El Sabbagh, H.T. Hsu, K.A. Zaki, Electrical and Computer
Engineering Dept., Univ. of Maryland, College Park; P. Pramanick,
T. Dolan, K&L Microwave Inc., Salisbury, MD
48
TH3D Special Session on Wide Bandgap Devices
and Their Application in High Power
TH3E Microwave Measurements II
Chair: K. Webb, Purdue University
Co-chair: S.T. Sheppard, Cree Inc.
ROOM 615–617
Chair: A. Ferrero, Politecnico di Torino
Co-chair: L. Dunleavy, Univ. of South Florida
ROOM 602–604
TH3D-1: Invited: Experimental Power Frequency Limits
of AlGaN/GaN HEMTs
L.F. Eastman, ECE and CNF, Cornell University Ithaca, NY
TH3E-1: Broadband Thermoelectric Microwave Power Sensors
Using GaAs Foundry Process
A. Dehé, Infineon Technologies, Balanstrasse, Munich, Germany;
K. Fricke-Neuderth, FH Fulda, FB Elektrotechnik, Fulda, Germany
TH3D-2: Invited: AlGaN/GaN HFET Amplifier Performance
and Limitations
R.J. Trew, Virginia Tech, ECE Dept.
TH3E-2: Novel Method for Vector Mixer Characterization
and Mixer Test System Vector Error Correction
J. Dunsmore, Agilent Technologies
TH3D-3: A 36W CW AlGaN/GaN-power HEMT Using
Surface-charge-controlled Structure
T. Kikkawa, T. Kimura, N. Hara, K. Joshin, Fujitsu Laboratories Ltd.;
M. Nagahara, S. Yokokawa, S. Kato, M. Yokoyama, Y. Tateno,
K. Horino, K. Domen, Y. Yamaguchi, Fujitsu Quantum Devices Ltd.
TH3E-3: Compensating Differences Between Measurement
and Calibration Wafer in Probe-tip Calibrations
G. Carchon, W. De Raedt, E. Beyne, IMEC, Div. MCP-HDIP,
Kapeldreef, Heverlee, Belgium
TH3D-4: Invited: Applications of SiC MESFETs and GaN HEMTs in
Power Amplifier Design
W.L. Pribble, J.W. Palmour, S.T. Sheppard, R.P. Smith, S.T. Allen,
T.J. Smith, Z. Ring, J.J. Sumakeris, A.W. Saxler, J.W. Milligan, Cree,
Inc.
TH3E-4: A Study of the Effect of Envelope Impedance
on Intermodulation Asymmetry Using a Two-tone Time Domain
Measurement System
D. J. Williams, J. Leckey, P J. Tasker
TH3D-5: Invited: Trapping Effects in Wide-bandgap Microwave
FETs
S.C. Binari, P.B. Klein, Naval Research Lab, Washington DC;
T.E. Kazior, Raytheon RF components, Andover MA
TH3E-5: Simulations of Noise-parameter Uncertainties
J. Randa, National Institute of Standards and Technology
THURSDAY
2:50
PM
2:40
PM
2:30
PM
2:20
PM
2:10
PM
2:00
PM
1:50
PM
1:40
PM
1:30
PM
1:20
PM
NOTES
49
Chair: D. Choudhury, HRL Lab
Co-chair: J. C. Wiltse, Georgia Tech
ROOM 608–609
Chair: R. Sorrentino, Univ. of Perugia
Co-chair: A. Gopinath, Univ. of Minnesota
ROOM 606–607
Chair: D. Swanson, Forem USA
Co-chair: S. Ye, Conductus Inc.
ROOM 611–612
TH4A-1: A 94 GHz Single-chip FMCW Radar Module
for Commercial Sensor Applications
A. Tessmann, T. Feltgen, M. Riessle, W.H. Haydl, Fraunhofer Institute
for Applied Solid State Physics (IAF); S. Kudszus, Bigbear Networks;
C. Sklarczyk, Fraunhofer Institute for Nondestructive Testing (IZFP)
3:40
PM
TH4C-1: A Tunable Active MMIC Filter for On-chip X-band Radar
Receiver Front-ends
J.R. Malmqvist, B.A. Gustafsson, O.M. Alfredsson, A. Ouacha, FOI
Swedish Defence Research Agency Microwave Technology Dept.
TH4C-2: Active Impedance Inverter: Analysis and Its Application
to the Bandpass Filter Design
Y-H. Chun, J-K. Rhee, Millimeter-wave Innovation Technology
Research Center, Dongguk Univ.; S-W. Yun, Dept. of Electronic
Engineering, Sogang Univ.
TH4B-3: Accuracy Limitations of Perfectly Matched Layers
in 3D Finite-difference Frequency-domain Method
T. Tischler, W. Heinrich, Ferdinand-Braun-Institut fuer
Hoechstfrequenztechnik (FBH)
PM
3:50
TH4A-2: A 38/76 GHz Automotive Radar Chip Set Fabricated
by a Low Cost PHEMT Technology
A. Werthof, H.J. Siweris, H. Tischer, W. Liebl, G. Jaeger, T. Grave,
Infineon Technologies
4:00
PM
TH4B-1: Hybrid Analysis of Three-dimensional Structures by the
Method Of Lines Using Novel Nonequidistant Discretization
L.A. Greda, R. Pregla, Univ. of Hagen, Electrical Engineering Dept.
TH4B-2: 3D Hybrid Finite-difference Method for Lossy Structures
Based on Quasi-static Field Solutions
M. Kunze, W. Heinrich, Ferdinand-Braun-Institut (FBH), Berlin,
Germany
TH4A-3: A MMIC-based 75-110 GHz Signal Source
M. Morgan, N. Wadefalk, Dept. of Electrical Engineering, California
Institute of Technology; S. Weinreb, L. Samoska, Jet Propulsion Lab,
California Institute of Technology
PM
4:10
PM
TH4C Active, Periodic and Planar Filters
4:20
PM
4:30
PM
4:50
PM
5:00
3:30–5:10
TH4B Frequency Domain Techniques
TH4A-4: A Gunn Diode Based Surface Mount 77 GHz Oscillator
for Automotive Applications
N.E. Priestley, K.D. Newsome, I. Dale, P.C. Norton, Marconi Applied
Technologies, Lincoln, England
TH4C-3: A Filter Synthesis Technique Applied to the Design
of Multistage Broadband Microwave Amplifiers
J-P. Rooney, I.C. Hunter, R.D. Pollard, The University of Leeds School
of Electronic and Electrical Engineering; R. Parry, Filtronic
Components plc, Shipley, West Yorkshire, England.
TH4B-4: Coupled Padé Approximation-finite Element Method
Applied to Microwave Device Design
B. Thon, D. Bariant, S. Bila, D. Baillargeat, M. Aubourg, S. Verdeyme,
P. Guillon, IRCOM UMR; F. Thevenon, M. Rochette, Cadoe; J. Puech,
L. Lapierre, J. Sombrin, CNES
TH4C-4: A Super Compact Super Broadband Tapered Uniplanar
PBG Structure for Microwave and Millimeter-Wave Applications
C. Caloz, T. Itoh, University of California Los Angeles, Electrical
Engineering Dept.
TH4B-5: Electromagnettics Modeling of Interconnects
for Mixered-signal Integrated Circuits from DC To Multi-GHz
Frequencies
A. Rong, A. Cangellaris, Dept. of Electrical and Computer
Engineering, Univ. of Illinois at Urbana-Champaign
TH4C-5: A Novel Planar Silicon Waveguide Filter at 45 GHz Based
on a Periodic Structure
B. Lenoir, P. Blondy, D. Baillargeat, S. Verdeyme, P. Guillon, IRCOM,
Univ. of Limoges, France; C. Tavernier, EGIDE, Research
and Development Group, France; J. Papapolymerou, School of ECE,
Georgia Tech
TH4A-5: A Comparison of W-band Monolithic Resistive Mixer
Architectures
A.R. Barnes, P.D. Munday, R. Jennings, M.T. Moore, QinetiQ Malvern
TH4C-6: A Folded Coupled-line Structure and Its Application
to Filter and Diplexer Design
C-M. Tsai, S-Y. Lee, C-C. Chuang, C-C. Tsai, Dept. of Electrical
Engineering, National Cheng Kung University
4:40
PM
TH4A W-band Transceiver Components
and Applications
PM
3:30
PM
TH4A-6: A Micromachined Finite Coplanar Line-to-silicon
Micromachined Waveguide Transition for mm- and
Submillimeter-Wave Applications
Y. Lee, L.P. Katehi, Radiation Lab, Univ. of Michigan; J.P. Becker,
Electrical and Computer Engineering, Montana State Univ.; J.R. East,
Solid State Electronics Lab, Univ. of Michigan
TH4B-6: An Efficient Integral Equation Solver for the
Electromagnetic Modeling of Highly-integrated Planar
RF/Microwave Circuits
V.I. Okhmatovski, J. Morsey, A.C. Cangellaris, Univ. of Illinois at U.C.,
Dept. of Electrical and Computer Engineering
TH4B-7: Simulation of Resonant Modes of Rectangular DR In MIC
Environment Using MPIE-MOM with Combined Entire-domain
and Sub-domain Basis Functions
Y. Liu, S. Safavi-Naeini, S.K. Chaudhuri, R. Sabry, Univ. of Waterloo
Electrical and Computer Engineering Dept.
50
TH4C-7: Narrow-band, Band-pass Filters with Zig-Zag,
Hairpin-comb Resonators
G.L. Matthaei, Superconductor Technologies
TH4D Special Session on Optical Processing
of Antenna Signals
TH4E Superconducting Components
and Technology
Chair: R. Minasian, Univ. of Sydney
Co-chair: E. Rezek, TRW Velocium
ROOM 615–617
Chair: C. Jackson, Ditrans
Co-chair: J.F. Davis, Jet Propulsion Lab
ROOM 602–604
TH4D-1: Invited: Multiple Output Photonic RF Phase Shifters
for Optically Controlled Radar Systems
H. Fetterman, J. Han, D. Chang, Dept of Electrical Engineering, Univ.
of California, Los Angeles; H. Erlig, M-C. Oh, H. Zhang, Pacific Wave
Communications, Los Angeles, CA; W. Steier, Dept of Electri
TH4E-1: Folded Dual-mode HTS Microstrip Band Pass Filter
K.F. Raihn, G.L. Hey-Shipton, Superconductor Technologies Inc.
TH4D-2: Flexible Beamformer and Remoting Head
for Optically Controlled Phased Array Antennas
N.A. Riza, School of Optics/CREOL, Univ. of Central Florida;
M.A. Arain, S.A. Khan, Photonic Information Processing Systems
(PIPS) Lab
TH4E-2: Ultra Selective 22 Pole, 10 Transmission Zero
Superconducting Bandpass Filter Surpasses 50 Pole Chebyshev
Rejectionnn
G. Tsuzuki, S. Ye, S. Berkowitz, Conductus Inc.
TH4E-3: A Low Loss 5 GHz Bandpass Filter Using HTS Coplanar
Waveguide Quarter-wavelength Resonators
Z. Ma, H. Suzuki, Y. Kobayashi, Dept. of Electrical and Electronic
Systems, Saitama Univ., Japan; K. Satoh, S. Narahashi, T. Nojima,
Wireless Lab, NTT DoCoMo Inc., Japan
TH4D-3: A Novel 2N Beams Heterodyne Optical Beamforming
Architecture Based on NXN Optical Butler Matrices
B. Vidal, D. Madrid, J.L. Corral, V. Polo, A. Martínez, J. Martí,
FRG/ITACA, Universidad Politécnica de Valencia (Spain)
TH4E-4: Tuning Superconducting Microwave Filters by Laser
Trimming
N.J. Parker, S.W. Goodyear, D.J.P. Ellis, R.G. Humphreys, QinetiQ
TH4E-6: Design Of Sapphire Rod Resonators to Measure the
Surface Resistance of High Temperature Superconductor Films
T. Hashimoto, Y. Kobayashi, Dept. of Electrical and Electronic
Systems, Saitama Univ.
4:40
5:00
PM
4:50
PM
TH4D-5: Optical Mixing of Antenna Signals in WDM Systems
B. Cabon, IMEP; V. Girod, G. Maury, IMEP
TH4D-6: Optimization of an Optical System Based on a Chirped
Fibre Bragg Grating for Driving Phased Array Antennas
P. Monteagudo, J. Capmany, C. de Vera, J.L. Cruz, C. Mo, Universidad
Politecnica de Valencia, Spain;
TH4E-7: Shunt Capacitor Approximation for HTS Microstrip
Circuit Design
S. Ye, Conductus Inc.
51
THURSDAY
TH4D-4: Photonic True-time Delay Beamformer for Broadband
Wireless Access Networks at 40 GHz Band
B. Vidal, D. Madrid, J.L. Corral, V. Polo, A. Martínez, J. Martí,
FRG/ITACA, Universidad Politécnica de Valencia, Spain;
J.H. den Besten, F. Soares, M.K. Smit, COBRA/DIMES, Eindhoven
Univ. of Technology, The Netherlands
PM
4:30
PM
4:20
PM
4:10
PM
4:00
PM
3:50
PM
3:40
PM
3:30
PM
NOTES
THURSDAY, JUNE 6, 2002 • IF-TH INTERACTIVE FORUM • 1:30–4:30 PM
THURSDAY
WSCTC • CHAIR: KEN MAYS, TRIQUINT SEMICONDUCTOR • ROOM 6E
IFTH-1: TE-Mode Propagation Properties of the Coupled Planar Kerr-like Nonlinear Waveguides
J-G. Ma, Nanyang Technological University, Singapore
IFTH-2: Generation of Wideband Electromagnetic Response Through a Laguerre Expansion Using
Early Time and Low Frequency Data
T.K. Sarkar, J. Koh, Syracuse Univ.; M. Salazar-Palma, Politechnique Univ. of Madrid
IFTH-3: New Design of High-Q Sapphire Resonator with Distributed Bragg Reflector
O. Piquet, D. Cros, S. Verdeyme, P. Guillon, IRCOM, UMR 6615 CNRS; M.E. Tobar, Dept . Physics,
Univ. of Western Australia
IFTH-4: Ferrite Filled Reflector Mode Converter for Axially Corrugated Waveguides
A.J. Viitanen, T.M. Uusitupa, Helsinki Univ. of Technology
IFTH-5: New Transmission Line Structure with Suppressed Eddy Current Effects
M. Peter, P. Baureis, Univ. of Applied Sciences Würzburg-Schweinfurt, RF-design; H. Hein, F. Oehler,
Fraunhofer Institute for Integrated Circuits, Erlangen, Germany
IFTH-6: An Analytical Based Method for the Microwave Imaging of Cylindrically Stratified Media
M.J. Akhtar, A.S. Omar, FET-IESK, Univ. of Magdeburg
IFTH-7: Resonant Tunneling of Microwave Energy in Thin Film Multilayer Metal/Dielectric
Structures
A. Eriksson, A. Deleniv, S. Gevorgian, Dept. of Microelectronics MC-2, Chalmers Univ. of Technology,
Sweden; Microwave and High Speed Research Center, Ericsson Microwave Systems, Moelndal,
Sweden
IFTH-8: High Functionality Mode Transformers with Bandwidth Control and Mode Selectivity
M. Yang, K.J. Webb, School of Electrical and Computer Engineering, Purdue Univ., West Lafayette, IN
IFTH-9: Frequency Parameterization of Open Structures by Modal Decomposition Using Finite
Elements and Spherical Modes
Y. Adane, A. Gati, M.F. Wong, France Télécom R&D — DMR/IIM; V.F. Hanna, Laboratoire
Instruments et Systèmes Université Pierre et Marie Curie
IFTH-10: Novel Wave Effects on Anisotropic and Ferrite Planar Slab Waveguides in Connection
with Singularity Theory
A.B. Yakovlev, The Univ. of Mississippi, Dept. of Electrical Engineering; G.W. Hanson, The Univ.
of Wisconsin-Milwaukee, Dept. of Electrical Engineering and Computer Science
IFTH-11: FEM-based Reduced-order Model for Steady-state Skin-effect Analysis in Lossy Lines
F. Carbonera, F. Bertazzi, M. Goano, G. Ghione, Politecnico di Torino, DELEN
IFTH-12: Modified RWG Basis Functions for Analysis of Periodic Structures
P.S. Simon, Space Systems/Loral, Palo Alto, CA
IFTH-13: Line-integral Formulation of the Hybrid MM/FEM Technique
V. Crino, Space Engineering SpA. Via dei Berio 91 00155 Rome, Italy; C. Tomassoni, M. Mongiardo,
DIEI, Università di Perugia, Via G. Duranti, Perugia, Italy
IFTH-14: Efficient Calculation of Effective Material Parameters in Metamaterials Using FDT
and a Modal Approach
R. Schuhmann, T. Weiland, Technische Universität Darmstadt, Computational Electromagnetics Lab
(TEMF)
IFTH-15: An Efficient Technique for the Iterative Solution of Large Dense Matrices Arising
in Method of Moments Simulation of MMIC Problems
V.V.S. Prakash, Electromagnetic Communication Lab, Pennsylvania State Univ.; R. Mittra, Director,
ECL, EE Dept., Pennsylvania State Univ.
IFTH-16: Multiple Scattering Among Vias in Planar Waveguides Using SMCG Method
C-C. Huang, L. Tsang, Univ. of Washington, Dept. of Electrical Engineering, Seattle; C.H. Chan, Dept.
of Electronic Engineering, City Univ. of Hong Kong, Hong Kong
IFTH-17: Development of an Unconditionally Stable Full Wave 2D ADI FDTD Method for Analysis
of Arbitrary Wave Guiding Structures. PDF
Ch. Ma, Z. Chen, Dalhousie Univ., Dept. of E&CE, Halifax, Nova Scotia, Canada; A-P. Zhao, Nokia
Research Center,Helsinki, Finland
IFTH-18: Direct EM-based Optimization of Advanced Waffle Iron Filters with Improved
Performance
F. Arndt, J. Brandt, Microwave Dept., Univ. of Bremen, Bremen, Germany
IFTH-19: A New Time Domain Near Field to Far Field Transformation for FDTD
in Two Dimensions
F. Xu, W. Hong, Dept. of Radio Engineering, Southeast Univ.
IFTH-20: 2-D Envelope Finite Element (EVFE) Technique — Implementation of PML
and Dispersive Medium
W. Yao, Y. Wang, T. Itoh, Dept. of Electrical Engineering, Univ. of California at Los Angeles,
IFTH-21: Efficient Transient Simulation of Transmission Lines
M. Condon, School of Electronic Engineering Dublin City Univ. Glasnevin Dublin, Ireland
IFTH-22: Inductance Formula of a Square Spiral Inductor on Grounded Substrate by Duality
and Synthetic Asymptote
W.C. Tang, Y.L. Chow, City Univ. of Hong Kong
IFTH-23: Electromagnetic/Circuit Co-optimization of Lumped Component and Physical Layout
Parameters Using Generalized Layout Components
J. Sercu, F. Demuynck, Agilent Technologies, EEsof EDA
IFTH-24: CAD of Multipactor-free Waveguide Components for Communication Satellites
M. Ludovico, L. Accatino, G. Zarba, Telecom Italia Lab; M. Mongiardo, DIEI, Universita’ di Perugia
IFTH-25: CAD of Waveguide Structures with Production Based Radii at Arbitrary Double (E-H)
Plane Steps and Junction Ports
J.M. Reiter, R. Beyer, Mician GbR, Bremen, Germany; U. Rosenberg, Marconi Communications
GmBH, Backnang, Germany
IFTH-26: Electrothermal Modeling of Multi-fingered PHEMTs Applying a Global Approach
E. Byk, D. Lopez, D. Baillargeat, S. Verdeyme, R. Quéré, R. Sommet, P. Guillon, IRCOM — Université
de Limoges, France; E. Laporte, M. Soulard, ALCATEL Space industries, Toulouse, France
IFTH-27: Accurate Computer Aided Design of Interdigital Filters Applying a Coupling
Identification Method
C. Saboureau, S. Bila, D. Baillargeat, S. Verdeyme, P. Guillon, IRCOM-UMR CNRS
IFTH-28: Language Design Requirements for VVHDL-RF-MW™
J Willis, J Johnson, FTL Systems
IFTH-29: CAD of Integrated Passives on Printed Circuit Boards Through Utilization of Multiple
Material Domains
P.J. Draxler
IFTH-30: EM-based Optimization Exploiting Partial Space Mapping and Exact Sensitivities
J.W. Bandler, McMaster Univ. and Bandler Corp.; A.S. Mohamed, M.H. Bakr, McMaster Univ. Dept.
of Electrical and Computer Engineering; K. Madsen, J. Søndergaard, Technical Univ. of Denmark
Dept. of Math
IFTH-31: ANN and EM-based Models for Fast and Accurate Modeling of Excitation Loops
n Combline-type Filters
A. Borji, D. Busuioc, S. Safavi-Naeini, S.K. Chaudhuri, Dept. of ECE, Univ. of Waterloo, Waterloo,
Ontario, Canada
IFTH-32: IC Package Characterization Software and Its Application to RFIC Design
K. Goto, Y. Horio, Tokyo Denki Univ., Dept. of Electronics Engineering; A. Dec, K. Suyama,
Epoch-Technologies
IFTH-33: Constrained EM-based Modeling of Passive Components
T. Dhaene, Agilent EEsof Comms EDA, Agilent Technologies; J. De Geest, D. De Zutter, Dept.
of Information Technology (INTEC), Ghent Univ., Belgium
IFTH-34: Microwave Noise Sources in AlGaAs/GaAs HBTs
P. Sakalas, M. Schroter, Dresden Univ., Elektronische Bauelemente und Integrierte Schaltungen;
P. Zampardi, Conexant Systems Inc., RF Component Engineering; H. Zirath, Chalmers Univ., Dept.
of Microelectronics; R. Welser
IFTH-35: A Practical Small-signal Equivalent Circuit Model for RF-MOSFETs Valid up to the
Cut-off Frequency
H. Kawano, M. Nishizawa, S. Matsumoto, S. Mitani, M. Tanaka, N. Nakayama, H. Ueno,
M. Miura-Mattausch, Graduate School of Advanced Sciences of Matter, Hiroshima Univ.;
H.J. Mattausch, Research Center for Nanodevices and Systems, Hirochima Univ.
IFTH-36: The Equivalent Circuit Modeling of Defected Ground Structure with Spiral Shape
C.S. Kim, K.Y. Kang, Telecommunication Basic Research Lab., ETRI, ROK; J.S. Lim, S. Nam, School
of Electrical Eng., Seoul National Univ., ROK; J.I. Park, D. Ahn, Div. of Information Technology Eng.;
G.Y. Kim
IFTH-37: HBT Small Signal Tee and Pi Model Extraction Using a Simple, Robust and Fully
Analytical Procedure
P.J. Tasker, Univ. of Cardiff, Cardiff, Wales, UK; M. Fernandez-Barciela, Univ. of Vigo, Vigo, Galicia,
Spain
IFTH-38: Completely Consistent No Charge PHEMT Model Including DC/RF Dispersion
C-J. Wei, Y.A. Tkachenko, J. Gering, D. Bartle, Alpha Industries Inc., Woburn, MA
IFTH-39: A Simple HBT Large Signal Model for CAD
I Angelov, Microwave Electr. Lab, Chalmers Univ., Goteborg Sweden; A. Inoue, Mizuhara, Itami,
Hyogo, Japan; K. Choumei, Melco Co.
IFTH-40: A New Large Signal InP/InGaAs Single HBT Model Including Self-heating and Impact
Ionization Effects
T. Kim, K. Yang, Dept. of Electrical Engineering and Computer Science, KAIST
IFTH-41: Large-signal Circuit-based Time Domain Analysis of High Frequency Devices Including
Distributed Effects
M. Valiullah, K. Liu, S.M. El-Ghazaly, S. Goodnick, ASU
IFTH-42: The Smoothie “Data Base Model for the Correct Modeling of Non-linear Distortion in
FET Devices”
V. Cuoco, L.C. de Vreede, M.P. van der Heijden, Delft Univ. of Technology, Information Technology
and Systems Dept., Lab. of Electronic Components, Technology & Materials ECTM, The Netherlands
IFTH-43: The Assessment of Output Digital Spectra in Quasi Enhancement-mode PHEMTs
by a Modified Large-signal Model
S-C. Yang, C-W. Wang, C-K. Lin, Y-J. Chan, Dept. of Electrical Engineering, National Central Univ.,
Chungli, Taiwan, ROC
IFTH-44: Extraction of a Polynomial LDMOS Model for Distortion Simulations Using Small-signal
S-Parameter Measurements
J. Vuolevi, T. Rahkonen, Electronics Lab, Dept. of Electrical Engineering, Univ. of Oulu, Finland;
J. Aikio, Elektrobit Ltd, Tutkijantie, Oulu, Finland
IFTH-45: Direct Observation of Loadlines in MESFET by Using Average RF Gate and Drain
Currents
C.C. Meng, C.H. Chang, Dept. of Electrical Engineering, National Chung-Hsing Univ.; J.F. Kuan,
G.W. Huang, National Nano Device Lab
IFTH-46: Implemention of a Scalable and Statistical VBIC Model for Large-signal Analysis
and Intermodulation Distortion Of SiGe HBTs
M.R. Murty, K.M. Newton, S.L. Sweeney, D.C. Sheridan, D.L. Harame, Communications R&D Center,
IBM Microelectronics, Essex Junction, VT
IFTH-47: Statistical Study of Metrics for Nonlinear Model Evaluation
K.A. Remley, J.A. Jargon, D.C. DeGroot, D. Schreurs, K.U. Leuven, National Institute of Standards
and Technology,
IFTH-48: Simulation of RF Circuits Driven by Modulated Signals Without Bandwidth Constraints
J.C. Pedro, N.B. Carvalho, Instituto de Telecomunicacoes, Universidade de Aveiro, Aveiro, Portugal
IFTH-49: Global Coupled Electromagnetic-electrical-thermal Simulation and Experimental
Validation for a Spatial Power Combining MMIC Array
W. Batty, C.E. Christoffersen, A.B. Yakovlev, J.F. Whitaker, M. Ozkar, S. Ortiz, A. Mortazawi, R. Reano,
K. Yang, L.P.B. Katehi, C.M. Snowden, M.B. Steer, Institute of Microwaves and Photonics, School
of Elec.
IFTH-50: Analysis and Elimination of Parametric Oscillations in Monolithic Power Amplifiers
A. Anakabe, J.M. Collantes, J. Portilla, J. Jugo, Univ. of the Basque Country Electricity and Electronics
Dept.; A. Mallet, L. Lapierre, CNES, Toulouse Space Center; J.P. Fraysse, ALCATEL Space
IFTH-51: Nonlinear Analysis of a Microwave Fractional Synthesizer
S. Sancho, A. Suarez, J. Chuan, DICOM, Univ. of Cantabria
IFTH-52: Universal Parameterized Nonlinear Device Model Formulation for Microwave Circuit
Simulation
C.E. Christoffersen, S. Velu, M.B. Steer, Dept. of Electrical and Computer Engineering, N. Carolina
State Univ.
52
THURSDAY, JUNE 6, 2002 • IF-TH INTERACTIVE FORUM (cont.) • 1:30–4:30 PM
WSCTC • ROOM 6E
IFTH-63: A Novel Signal Processing Approach for Microwave Doppler Speed Sensing
S. Moedl, M. Hackner, Fraunhofer-Institut fuer Integrierte Schaltungen
IFTH-64: Ultra-fast Broadband EMI Measurement in Time Domain Using Classical Spectral
Estimation
F. Krug, P. Russer, Technische Universitaet Muenchen, Lehrstuhl fuer Hochfrequenztechnik
IFTH-65: An Accurate Complex Behavior Test Bed Suitable for 3G Power Amplifiers
Characterization
S. Boumaiza, F.M. Ghannouchi, Poly-Grames Research Center, Dept. of Electrical Engineering, Ecole
Polytechnique, Montreal, Quebec, Canada
IFTH-66: A New Satellite Repeater Amplifier Characterization System for Large Bandwidth NPR
and Modulated Signals Measurements
A. Mallet, F. Gizard, L. Lapierre, J. Sombrin, CNES, Toulouse Space Center,France; T. Reveyrand,
IRCOM, Univ. of Limoges, France
IFTH-67: Quantitative Extraction and Compensation of Excess Inductance: Case Study
of a Digital Attenuator Chip
S.C. Choi, D.H. Kwon, K.H. Kim, S.W. Hwang, Korea Univ. Dept. of Electronics Engineering
IFTH-68: Vector Corrected Noise Temperature Measurements
M.H. Weatherspoon, L.P. Dunleavy, Dept. of Electrical Engineering, Univ. of South Florida; A. Boudiaf,
Agilent Technologies, N. Billerica, MA; J. Randa, National Institute of Standards and Technology,
Boulder, CO
IFTH-69: Sensitivity Analysis of Calibration Standards for Fixed Probes Spacing On-wafer
Calibration Techniques
M.E. Safwat, L. Hayden, Cascade Microtech Inc., Beaverton, OR
IFTH-70: Estimation of Deep-seated Profile of Temperature Distribution Inside Biological
Tissues by Means of Multifrequency Microwave Thermograph
B. Stec, W. Susek, A. Dobrowolski, Military Univ. of Technology, Faculty of Electronics, Poland
IFTH-71: A Bioelectromagnetic Overview of the Universal Mobile Telecommunication System
(UMTS)
M. Cappelli, DIEI, Univ. of Perugia, Italy; L. Tarricone, Dept. of Innovation Engineering, Univ. of Lecce,
Italy
IFTH-72: 3-D Scalar Microwave Image Reconstruction Algorithm
P.M. Meaney, Q. Fang, S.H. Geimer, A.V. Streltsov, K.D. Paulsen, Thayer School of Engineering,
Dartmouth College
THURSDAY
IFTH-53: Characterization of Intermodulation Distortion in Multicarrier Transmission Systems
K. Naishadham, Systems Terchnology Center, Syracuse Research Corp.
IFTH-54: M-ARY PSK Signal Power Spectrum at the Output of a Nonlinear Power Amplifier
F. Launay, Y. Wang, S. Toutain, IRCCyN SETRA, École polytechnique de Université de Nantes, France
IFTH-55: A Semi-limped Balun Fabricated by Low Temperature Cofired Ceramic
C-W. Tang, C-Y. Chang, Hsinchu 300, Taiwan, Dept. of Communication Engineering, National Chiao
Tung Univ.
IFTH-56: Low-cost Flip-chip Alternatives for Millimeter Wave Applications
J. Heyen, J. Schroeder, A.F. Jacob, Institut fuer Hochfrequenztechnik, TU Braunschweig,
Braunschweig, Germany
IFTH-57: X-band Microstrip Bandpass Filter Using Photoimageable Thick-film Materials
C.Y. Ng, M.S. Aftanasar, I.D. Robertson, Microwave and Systems Research Group (MSRG), School
of Electronics, Computing and Mathematics, Univ. of Surrey; M. Chongcheawchamnan, Maharnankorn
Telecommunication Dept.; J. Minalgiene
IFTH-58: Novel Lumped-element Coplanar Waveguide-to-coplanar Stripline Transitions
with Low-pass and High-pass Characteristics
Y-S. Lin, C.H. Chen, Dept. of Electrical Engineering and Graduate Institute of Communication
Engineering, National Taiwan Univ., Taipei, Taiwan
IFTH-59: RF Microwave Multi-band Design Solutions for Multilayer Organic System on Package
Integrated Passives
M.F. Davis, S-W. Yoon, S. Mandal, M. Maeng, K. Lim, S. Pinel, J. Laskar, M. Tentzeris, T. Nonaka,
V. Sundaram, F. Liu, R. Tummala, Georgia Institute of Technology; A. Sutono, RF Solutions Inc.
IFTH-60: Coupling Between Microstrip Lines with Finite Width Ground Plane Embedded
in Polyimide Layers for 3D-MMICs on Si
GE. Ponchak, NASA Glenn Research Center, Cleveland, OH; E. Dalton, E.M. Tentzeris,
J. Papapolymerou, Georgia Institute of Technology, Atlanta, GA
IFTH-61: A Novel Directional Coupler for PCB and LTCC Applications
A. Sawicki, Ericsson Radio Access AB, Stockholm, Sweden; K. Sachse, Wroclaw Univ. of Technology,
Wroclaw, Poland
IFTH-62: High Performance Spiral Inductors Embedded on Organic Substrates for SOP
Applications
S.H. Lee, S. Kim, Georgia Institute of Technology, Atlanta, GA
53
FRIDAY WORKSHOPS
WFB: EVOLUTION OF THE PHOTONIC ANTENNA
WFA: CRYOGENIC AND SUPERCONDUCTOR MICROWAVE SUBSYSTEMS
Date & Time:
Friday, June 7; 8:00 AM to 5:00 PM
Date & Time:
Location:
Location:
Topics & Speakers:
Topics & Speakers:
✗ Fundamentals of Microwave Superconductivity, M.A. Hein,
University of Wuppertal
✗ Fundamentals of Passive High-Temperature Superconductive
(HTS) Microwave Components, H.J. Chaloupka,
✗ Design, Technology and Fabrication of HTS Filters, T. Kaesser,
Tesat-Spacecom
✗ Tunable Devices at Cryogenic Temperatures, D.E. Oates,
Lincoln Laboratory
✗ Cryogenic Dielectric Resonator Devices, N. Klein,
Juelich Research Center
✗ Cryogenically Cooled Field Effect Transistors for Low Noise
Applications, M.W. Pospieszalski, Inphi Corp.
✗ Cryogenic Refrigeration Technology, M. Nisenoff,
M. Nisenoff Associates
✗ Cryogenic Subsystems for Wireless Base Stations,
R.B. Hammond, Superconductor Technologies Inc.
✗ Active Superconductive Devices for Microwave Applications,
M. Siegel, Juelich Research Center
✗ The Commercial Evolution of Fiber Optic Wireless Sytems,
Henry Wojtunik, Anacom Systems Corp.
✗ Taking the Cost of Complexity Out of the Photonic Antenna,
Dr. Dave Wake, UCL
✗ Photonic Feeding Coplanar Patch Antennas for Microwave and
Millimeter-wave Wireless Communication System, Dr. Keren Li
and Dr. Masayuki Izutzu, CRL
✗ Planar Antennas for Photonic-Microwave Conversion,
Kevin M.K.H. Leong and Professor Tatsuo Itoh, UCLA
✗ Lightwave Antennas for Inter-satellite Communications, Professor
Tadashi Takano, Astronautical Instutite of Japan
✗ Optical Control of the Active Integrated Antenna, Professor
Shigeo Kawasaki, Tokai University
Organizers:
Prof. Dr. Heinz J. Chaloupka,
Dr. Norbert Klein, Juelich Research Center
Sponsor:
MTT-18 Microwave Superconductivity
Organizers:
Charles Cox, Photonic Systems Inc.
Tatsuo Itoh, UCLA
Sponsors:
Today when we speak of using photonics for antenna remoting, we are
basically talking about the photonics replacing conventional components, such as coax. Important as these initial applications have been,
they are really just the first step along a path that eventually could lead
to the evolutionary merging of the two fields: photonics and antennas. A
second evolutionary step, which we are already beginning to see, is integrating photonics with antennas. The third and ultimate step in the evolution is the photonic antenna. In this stage new devices are employed
which transition directly between the free space electro-magnetic wave
and the modulated optical carrier. This session will present work in all
phases of Photonic Antenna evolution.
Cryogenic microwave systems represent a challenging approach to
match the highest performance requirements with respect to extremely
low noise figures, superior selectivity and high functional density. Those
systems include passive high-Q components which are realized from
high-temperature superconductors (HTS) and/or cooled low-loss dielectric materials. In addition, cryogenic semiconductor devices, like LNAs,
mixers etc. contribute to an improvement of system performance. In the
first three lectures of this tutorial short course fundamentals of microwave superconductivity and applications of high-temperature superconductivity for passive microwave devices, like pre-select filters, chirp
filters etc., will be covered. This introduction is followed by a lecture on
re-configurable and tunable filters based on a combination of HTS circuits with ferroelectric and/or ferrimagnetic structures as well as with
MEMS. Subsequent parts of the short course deal with cryogenic dielectric devices as well as with cryogenic low-noise amplifiers and mixers.
The succeeding lectures are devoted to cryocoolers and specific packaging issues for cryogenic systems. A lecture on cryogenic subsystems for
wireless base stations will demonstrate how superior performance on the
component level can be transformed into a significant benefit on the system level. Furthermore, this lecture will cover the status of commercialization of this new technology. In a final lecture, the fundamentals of
nonlinear millimeter and submillimeter wave components based on the
Josephson effects are presented.
WFC: OPTICAL PACKAGING TECHNIQUES
COMBINING OPTICS & ELECTRONICS
Date & Time:
Location:
Topics & Speakers:
✗
✗
✗
✗
✗
✗
S.J. Ben Yoo, University of California at Davis
Alan Lindner, Stratedge Corp.
Berinder Brar, Rockwell Science Center
Vince Hietala, Quellan
Hongwei Liang, Multilink
James A. Hathaway, Velocium
Organizers:
Joy Laskar, Georiga Institute of Technology
Alan Lindner, StratEdge Corporation
Sponsor:
FRIDAY
This workshop will address enabling technologies for packaging techniques for high performance optoelectronics including OC-192, OC768, 10 GB Ethernet and combined optical/microwave techniques. The
half day workshop will be equally divided into an overview of system requirements, enabling optical technologies and enabling packaging technologies. Speakers will come from leading industry and academic institutions.
54
ARFTG 59th MICROWAVE MEASUREMENT CONFERENCE
F
R
T
A
G
CONFERENCE ORGANIZATION
Conference Chair
Dr. Edward M. Godshalk
Maxim Integrated Products
T (503) 641-3737 x1633 F (503) 644-9929
[email protected]
Technical Program Chair
Dr. Alfy Riddle
Macallan Consulting
T (408) 262-3575
[email protected]
Exhibits and Conference Chair
Dr. Leonard Hayden
Cascade Microtech Inc.
T (503) 601-1580 F (503) 601-1601
[email protected]
EXECUTIVE COMMITTEE
Dr. Charles Wilker, President
DuPont Superconductivity
Brian Pugh, Vice-President & Electronic Communication
SiliconWave
J. Gregory Burns, Secretary & Publications
Northrop Grumman
Ken Wong, Treasurer
Agilent Technologies
David Walker, Education
NIST
Dr. Edward M. Godshalk, Nominations
Maxim Integrated Products
Dr. Kate Remley, Publicity
NIST
TEST, MEASUREMENT AND CHARACTERIZATION
OF HIGH SPEED DIGITAL COMPONENTS AND SYSTEMS
AUTOMATIC RF TECHNIQUES GROUP
Welcome to the 59th Automatic RF Techniques Group (ARFTG) Conference
being held at the Washington State Convention and Trade Center on Friday, June
7, 2002. The conference theme is “Test, Measurement and Characterization of
High-Speed Digital Components and Systems.” The demand for high data rates
and broad-bandwidth wireless and fiber networks has resulted in high speed digital circuits with clock rates up to 40 GHz and beyond. Developing these products
has led to remarkable challenges and opportunities as engineers are forced to meet
both digital and microwave demands simultaneously. Presentations will discuss
test, measurement and characterization issues in both the time and frequency domain plus related topics such as packaging solutions, circuit model extraction and
interconnect characterization. In addition, papers concerning traditional ARFTG
topics such as noise measurements, nonlinear characterization, S-parameter network analysis, calibration and on-wafer measurements will be included.
The ARFTG conference is a great opportunity to meet and interact with many
experts in the RF and microwave test community. You will have ample opportunity to meet with other attendees, presenters and leaders in measurement community at the continental breakfast and breaks in the exhibition area, interactive forum
sessions and the luncheon.
LOCATION
The 59th ARFTG Conference will be held in rooms 602–604 of the Convention
Center. You may reserve your hotel room using the IMS Conference Housing
Form. Visit www.ims2002.org/hotelregistration.html for more information. There
will also be a joint IMS/ARFTG session on Thursday, June 6 titled “Highspeed/Non-contacting Electrical Probing” with particular emphasis on instrumentation and calibration techniques for testing digital circuitry associated with highspeed optical links, and non-contact probing for testing dense digital integrated
circuits.
SCHEDULE
John Cable, Standards
Honeywell FM&T
Dr. Leonard Hayden, Exhibits
Cascade Microtech
Raymond W. Tucker, Membership
Air Force Research Lab
Dr. Dylan Williams, Technical Coordinator
NIST
Robert M. Judish, Past-President
NIST
EX-OFFICIO MEMBERS
Doug Rytting, Awards
Friday, June 7
Activity
Convention Center Room
7:00 AM – 4:00 PM
7:00 AM – 8:00 AM
7:00 AM – 8:00 AM
8:00 AM – 9:45 AM
9:45 AM – 10:30 AM
10:30 AM – 12:00 NOON
12:00 NOON – 1:15 PM
1:15 PM – 3:00 PM
3:00 PM – 3:30 PM
3:30 PM – 4:50 PM
Exhibition and Interactive Forum
Continental Breakfast
Speaker’s Breakfast
Technical Session 1
Exhibition/Poster Session
Technical Session 2
Luncheon
Technical Session 3
Exhibition/Poster Session
Technical Session 4
606–607
606–607
611
602–604
606–607
602–604
611–614
602–604
606–607
602–604
Jim L. Taylor, Executive Secretary
Chris Potter, ARMMS Liaison
P&H Technology Consultants
Dr. Roger Marks, MTT-S Liaison
NIST
EXHIBITS
The 59th ARFTG Conference also offers an outstanding exhibition opportunity. Please contact our Exhibits Chair directly for further information.
www.arftg.org
55
µAPS
Microwave Application
& Product Seminars
µAPS are technical, product-oriented seminars presented
near the trade show floor in Room 310.
MESSAGE FROM THE 2002 µAPS CHAIRMAN
The µAPS are in their seventh year serving as a forum for exhibitors. The
µAPS provide technical information and background related to commercially
available state-of-the-art products of interest to the microwave community. The
product seminars will cover materials, active and passive components, EM simulation, circuit and system simulation and models, test and measurement topics, and
foundry services. Individual presentations will be 20 minutes long, inclusive of
questions and answers. Provisions are made for presenters to display and share
product literature related to their presentations. The µAPS are open to all technical conference and exhibit attendees. The seminars will be held in a location close
to the exhibit floor in the Washington State Convention and Trade Center on
Tuesday, Wednesday and Thursday, June 4–6, 2002 in conjunction with the IMS
2002 Exhibition.
Lisa Critchlow
µAPS Chair
2002 µAPS SCHEDULE
The 2002 Microwave Application & Product Seminars will be
held on Tuesday, Wednesday and Thursday, June 4–6, 2002 in
conjunction with the 2002 International Microwave Symposium
at the Washington State Convention and Trade Center. The series of individual presentations is open to any exhibition or conference attendee.
Tuesday, June 4, 2002
Wednesday, June 5, 2002
Thursday, June 6, 2002
9:00 AM–4:40 PM
9:00 AM–5:00 PM
9:00 AM–2:20 PM
µAPS — MICROWAVE APPLICATION & PRODUCT SEMINARS — TECHNICAL PROGRAM
TUESDAY, June 4, 2002 — ROOM 310, WSCTC
Osprey Metals Have Developed a Novel Range of Al/Si Alloys
ANDREW OGILVY, OSPREY METALS LTD.
9:00–9:20 AM
Elements of Magnetic Circuit Design and Magnet Material Selection
9:20–9:40 AM
ANTHONY PARAKKA, DEXTER MAGNETIC TECHNOLOGIES
Cost-performance Substrate Solutions for High Volume RF Devices
9:40–10:00 AM
GREGG WILDES, GORE ELECTRONIC MATERIALS
Building RF and Microwave Circuits with Constrained Low Temperature Cofired Ceramics (LTCC)
10:00–10:20 AM
JOE MAZZOCHETTE, LAMINA CERAMICS INC.
Pure Copper Layers on Copper-Tungsten Composite Heatsink for Electronic Packages
10:20–10:40 AM
LARRY CHATFIELD, KYOCERA AMERICA INC.
Variable Integrated Passive (VIP) Components Using Thin-film Ferroelectric Technology
10:40–11:00 AM
R.A. YORK, C. ELSASS, C.R. BISCHOF, AGILE MAERIALS AND TECHNOLOGIES
Evolution of the BNC: From Common Connector to Miniaturized High Frequency Solution
11:00–11:20 AM
DALE REED, TROMPETER ELECTRONICS INC.
Save Time with New Interconnects for the Next Generation Base Station
11:20–11:40 AM
DOUGLAS FINAN, HUBER + SUHNER
Ceramic Monolithic Block Filters for RF and Microwave Applications
11:40–12:00 AM
EDWARD LIANG, BRYAN CHEN, MCV TECHNOLOGIES INC.
Super-mini Blows a Hole in the Equalizer Performance Wall
1:00–1:20 AM
JOE FOREMAN, KAMAN INSTRUMENTATION
Connector Design Combines High Performance and the Ability to Blindmate —
All with Less Contact Engagement Required
1:20–1:40 AM
RICHARD HEALEY, LITTON WINCHESTER/NORTHROP GRUMMAN
Waveguide R-switch Redundant Networks for Multiple Amplifier Multimedia Communications Systems
1:40–2:00 AM
STEVE HACK, LOGUS MICROWAVE CORP.
Low Loss MMIC Filters from 10 to 50 GHz
2:00–2:20 AM
TIMOTHY L. CHILDS, TLC PRECISION WAFER TECHNOLOGY
Technical Product Literature — Application Principles for Circulators and Isolators
2:20–2:40 AM
TONY ELDRIDGE, RODGER BILLINGS, M2 GLOBAL TECHNOLOGY LTD.
New Low Spur-wide BW Direct Digital Synthesizer Demo and Presentation
2:40–3:00 PM
BRIAN DAVIS, ITT INDUSTRIES INC., AES-MICROWAVE SYSTEMS
Enhanced Phase Noise Performance Crystal Oscillator Using an Ulatralow Dropout Voltage Regulator
3:00–3:20 PM
FINN JENSEN, KEN JENSEN, RUSS WEBER, TRAK MICROWAVE CORP.
New Synthesizer DesignDelivers YIG Benefits without the Drawbacks
3:20–3:40 PM
LANCE HAAG, VERTICOM INC.
MMIC Oscillator Chips from 20 to 80 GHz
3:40–4:00 PM
Ka-band Phase Shifters, Modulators and Switches from 20 to 40 GHz
4:00–4:20 PM
High-power Tunable Microwave Sources of High Frequency Stability
4:20–4:40 PM
WOJCIECH GWAREK, QWED
56
SESSION I
9:00–11:00 AM
Materials
SESSION II
11:00 AM–2:40 PM
Passive Components
SESSION III
2:40–4:40 PM
Modulators, MEMs, Oscillators
WEDNESDAY, June 5, 2002 — ROOM 310, WSCTC
GSM/Edge Triple-band Power Amplifier Module
ALVAN BEZOOIJEN, PHILIPS SEMICONDUCTORS
9:00–9:20 AM
Packaging a 17–24 GHz PA MMIC
DAVID RICHARDSON, MIMIX BROADBAND
9:20–9:40 AM
New Sirenza Microdevices Power Amplifier RFICs Deliver Unequalied Linearity and ACP Performance
JOANN CHUN, RAY CRAMPTON, NORM HILDRETH, SIRENZA MICRODEVICES (FORMERLY STANFORD MICRODEVICES)
9:40–10:10 AM
SiGe-LNA at 1900 MHz for Direct Conversion Receivers
MICHAEL SAGEBIEL, ATMEL GERMANY
10:00–10:20 AM
A Commercial 20 GHz Balanced Optical Photoreceiver
ROY HOWARD, DISCOVERY SEMICONDUCTORS INC.
10:20–10:40 AM
LDMOS vs VDMOS — 30 to 510 MHz Broadband Amplifier Design
S.K. LEONG, POLYFET RF DEVICES
10:40–11:00 AM
Plug-n-play Power Technology
SCOTT BEHAN, TALLY COSTA, XEMOD INC.
11:00–11:20 AM
Demonstration of a 76 GHz MMIC Transceiver Module
11:20–11:40 AM
Modeling of 24 GHz RX/TX Filters in LTCC
ANDREAS WIEN, ANDREAS LAUER, IMST GMBH
11:40 AM–12:00 PM
WASP-NET — CAD and Optimization Tool — New Fast Hybrid MM/FE/MoM/FD
Software for Waveguide Components and Horn Antennas
FRITZ ARNDT, MICROWAVE INNOVATION GROUP
1:00–1:20 PM
Object Oriented and Network Based Distributed Electromagnetic Simulation
and Optimization on the IE3D 9.0
JIAN-X. ZHENG, ZELAND SOFTWARE INC.
1:20–1:40 PM
CST MICROWAVE STUDIO (CST MWS) Version 4.0 —
The Cutting Edge 3D Electromagnetic Field Simulation Software
JONATHAN OAKLEY, CST OF AMERICA INC.
1:40–2:00 PM
Accurate 3D EM Simulations and Precision Machining for Low Cost Microwave
and Millimeter-Wave Filters/Diplexers
MACIEJ ZNOJKIEWICZ, ADAM ABRAMOWICZ, MWTG TELECOM, WARSAW UNIV. OF TECHNOLOGY AND QWED COMPANY
2:00–2:20 PM
Full-wave 3D EM Design with no Need for 3D Drawing
MALGORZATA CELUCH, QWED
2:20–2:40 PM
Fast and Accurate EM Design of Coaxial Connectors and Axisymmetrical Antennas with QW-V2D
MALFORZATA CELUCH, QWED
2:40–3:00 PM
µWaveWizard — Seamless Integration of Fast and Flexible EM Methods
PETER KRAUSS, MICIAN
3:00–3:20 PM
EMPiCASSO™: An Advanced Design Tool for Printed Microwave Circuits and Antennas Arrays
KAZ SABET, EMAG TECHNOLOGIES INC.
3:20–3:40 PM
The New Comprehensive Multi-layer Library for ADS: MultiLIBTM
ANDREAS BETTRAY, ANDREAS WIEN, IMST GMBH
Vector Fields’ CONCERTO Software for Design and Analysis of RF Devices
CRIS EMSON, DAVID CARPENTER, VECTOR FIELDS INC.
Ansoft Designer™: The New World of Communications Design Software
DAVID VYE, ANSOFT CORP.
Characterization of an IQ-modulator Behavioral Model for RFIC System Design and Verification
JOEL DUNSMORE, GREG JUE, JOHN KIKUCHI, AGILENT TECHNOLOGIES
SESSION I
9:00–11:40 AM
Devices, PAs
SESSION II
11:40 AM–3:40 PM
EM Simulation
3:40–4:00 PM
4:00–4:20 PM
SESSION III
3:40–5:00 PM
4:20–4:40 PM
Circuit/System Simulation and Models
4:40–5:00 PM
THURSDAY, JUNE 6, 2002 — ROOM 310, WSCTC
Efficient and Accurate Modeling of RF/Microwave Effects in a System Simulator
JOEL KIRSHMAN, REZA MAHMOUDI, APPLIED WAVE RESEARCH
Neural Network Aided Microwave Modeling and Design
Q.J. ZHANG, CARLETON UNIVERSITY
Topas 2.0 — Nonlinear FET Model and Extraction Software
RÜDIGER FOLLMANN, IMST GMBH
Design Flow for RF MEMS Using Coventorwave™ — Part 1: Parametric Design
W. SCOTT BEST, JOE REPKE, WILLIAM SUH, COVENTOR INC.
Design Flow for RF MEMS Using Coventorwave™ — Part 2: Parametric Design
W. SCOTT BEST, JOE REPKE, WILLIAM SUH, COVENTOR INC.
9:00–9:20 AM
9:20–9:40 AM
SESSION I
9:00–10:40 AM
9:40–10:00 AM
Circuit/System Simulation and Models
10:00–10:20 AM
10:20–10:40 AM
Synchronized Prematching a Family of Wideband High VSWR Tuners
CHRISTOS TSIRONIS, FOCUS MICROWAVES INC.
10:40–11:00 AM
New Programmable 65 GHz Tuner Using V Connectors
CHRISTOS TSIRONIS, CHRIS LIU, RAYMOND JALLAD, FOCUS MICROWAVES INC.
11:00–11:20 AM
Benefits of Thermal Management in the Test Environment
HARLAN FALLER, JOHNSTECH INTERNATIONAL
11:20–11:40 AM
Addressing the Problems of Characterizing RFIC Devices
JOHN LUKEZ, CREDENCE SYSTEMS CORP.
11:40 AM–12:00 PM
New Micromachining Technology Enables the Design of a Fully Impedance Controlled Probe Tip
MOSTAFA DAOUDI, SUSS MICROTEC
1:00–1:20 PM
InP HBT Foundry Services is available for High-Frequency Analog, Mixed-Signal, and RF Applications
CHANH NGUYEN, GLOBAL COMMUNICATION SEMICONDUCTORS INC.
1:20–1:40 PM
GCS is Offering Foundry Services with Multi-Purpose InGaP HBT Technology
to Meet Today's Communication Needs
W. YAU, D. HOU, Y. YANG, B. KUS, CHRIS LIU, RAYMOND JALLAD, GLOBAL COMMUNICATION SEMICONDUCTORS INC.
1:40–2:00 PM
TriQuint Foundry Services — Your Sustainable GaAs Source
ROB CHRIST, TRIQUINT SEMICONDUCTOR INC.
2:00–2:20 PM
57
SESSION II
10:40 AM –1:20 PM
Test and Measurement
SESSION III
1:20 –2:20 PM
Foundry Services
EXHIBITORS
The MTT-S Exhibition is an annual event that has taken place since 1970. It comprises more than 450 microwave, subassembly, component, device, material, instrument and design software suppliers and each year draws approximately 11,000 microwave engineers involved in the design of systems, subsystems, components and
devices.
A-A Systel
A-Alpha Waveguide Co.
AC Microwave Gmbh
Accent Optical Technologies
Accumet Engineering Corp.
ACE Technology
Actipass Co. Ltd.
Advance Reproductions Corp.
Advanced Chemical Co.
Advanced Control Components
Advanced Electromagnetics Inc.
Advanced Switch Technology
Aeroflex Microelectronic Solutions
Aeroflex Test Solutions
Aeroflex Inc.
Aerowave Inc.
Aethercomm Inc.
Agile Materials and Technologies
Air Precision/Sivers
AKON Inc.
Alan Industries Inc.
Aliner Industries Inc.
Alpha Industries
AMCOM Communications Inc.
American Microwave Corp.
American Technical Ceramics
Ametek Specialty Metal Products
AMITRON
AML Communications Inc.
Amotech Co.
Amplifier Research & AR Kalmus
Amplifonix
Amplitronix LLC
Analog Devices Inc.
Anaren Microwave Inc.
Anritsu Company
Ansoft Corp.
Ansys Inc.
API Delevan Inc.
Aplac Solutions Inc.
Applied Microwave & Wireless
Applied Specialties Inc.
Applied Thin-Film Products
Applied Wave Research Inc.
ARC Technologies
Arcom Wireless Inc.
Argosy Component Sales
Arlon Materials for Electronics
Artech House
Ascor
Assemblies Inc.
Astrolab Inc.
Atlantic Microwave
Avitronics
Avnet RF & Microwave
AVX Corp.
BAE Systems
Barry Industries
Base Station/Earth Station
Besser Associates Inc.
Bird Component Products
Bird Electronic Products
Bird Technologies Group
Bliley Technologies Inc.
Bomar Interconnect Products Inc.
Boonton Electronics
BroadWave Technologies Inc.
C-MAC MicroTechnology
C.E. Precision Assemblies Inc.
California Eastern Laboratories
Carleton University
Cascade Microtech
Celeritek Inc.
Celerity Systems
Cernex Inc.
Channel Microwave Corp.
Chipcon AS
Circuits Processing Technology
Cirexx Corp.
Cirqon Technologies Corp.
Clarisay Inc.
ClearComm Technologies LLC
CMP Europe
CMR Circuits
Coilcraft Inc.
Coleman Microwave
Com Dev Ltd.
Commercial Microwave Technology Inc
Communication Techniques Inc.
Communications & Power Industries
Compac Development Corp.
Compel Electronics Inc.
Compex Corp.
Component Distributors Inc.
Component Sources Int’l
COMSOL Inc.
Comtech PST
Connecting Devices Inc.
Connectronics Inc.
Continental Microwave & Tool Co.
CoorsTek
Corning Gilbert Inc.
Corning IntelliSense
Corry Micronics
Cougar Components
Coventor Inc.
CRC Press
Credence Systems Inc.
CST of America Inc.
CTS Wireless Components
CTT Inc.
Cuming Microwave Corp.
Custom Cable Assemblies Inc.
Cylux Technologies Inc.
D-Coax
Datum – Irvine
DB Products Inc.
Delta Electronics
Dexter Magnetic Technologies
Diablo Industries Thin Film
Diamond
Discovery Semiconductors
Ditom Microwave Inc.
DLI
Dorado International Corp.
Dow-Key Microwave
DRC – Metrigraphics
Ducommun Technologies Inc.
DuPont Microcircuit Materials
Dynamic Microcircuits
Dynawave Inc.
Eagleware Corp.
Ecliptek Corp.
EDO Corp.
EE – Evaluation Engineering
EiC Corp.
ELANIX Inc.
Elcom Technologies Inc.
Electro Rent Corp.
Elisra Electronic Systems Ltd.
Elva-1 Ltd.
EMAG Technologies
EMC Technology Inc.
Emerson & Cuming Microwave Products
EMF Systems
Emhiser Micro-Tech
EMS Technologies Inc.
Endwave Corp.
EONCOM Ltd.
Ericsson Microelectronics
ETS – Lindgren
Excelics Semiconductor Inc.
EZ Form Cable Corp.
F&K Delvotec Inc.
Farran Technology Ltd.
Faustus Scientific Corp.
FCT Electronics LP
The Ferrite Company Inc.
Ferro Electronic Materials
Filtel Microwave Inc.
Filtran Microcircuits Inc.
Filtronic Components Ltd.
Filtronic Solid State
First Technology
Flexco Microwave Inc.
Flomerics Inc.
Florida RF Labs
Focus Microwaves Inc.
Fotofab
Frequency Management
Fujitsu Compound Semiconductor Inc.
Fujitsu Microelectronics Inc.
G.T. Microwave
Gaiser Tool Co.
Gannon & Scott
Gavish Inc.
Gawell Technology Inc.
Gel-Pak/Quik Pak
GGB Industries Inc.
GHz Technologies Inc.
GHz Technology Inc.
Giga Solution Tech Co. Ltd.
Giga-tronics
Gigatech Co., Ltd.
GIL Technologies
Global Communication Semiconductors
W.L. Gore & Associates Inc.
Gowanda Electronics
Harbour Industries
Haverhill Cable & Mfg. Co.
HCC Industries Inc.
HEI Inc.
Heraeus Inc.
Herley Industries
Herotek Inc.
Hexawave Inc.
Hitachi Metals America
Hitachi Semiconductor America
Hittite Microwave Corp.
Honeywell
Huber + Suhner
Hypertronics Corp.
Hytronics Corp.
IBM
IEEE Microwave Magazine/IEEE Media
IMI Inc.
IMS Connector Systems
The 2002 Exhibition will be held in the Washington State Convention and Trade
Center. Exhibition hours are Tuesday, June 4 and Wednesday, June 5 from 9:00 AM
to 5:00 PM, and Thursday, June 6 from 9:00 AM to 3:00 PM. Following is a list of exhibiting companies. The list is complete as of press time, but may not include all
companies.
IMST GmbH
In-Phase Technologies
Infineon Technologies
Instruments For Industry
Integra Technologies Inc.
Integrated Microwave Corp.
International Crystal Mfg.
International Manufacturing Svcs.
Interpoint, a Crane Co. company
Ion Beam Milling Inc.
IQE Inc.
ITT Industries
IW
Ixion Technologies
JCA Technology, a NEW FOCUS company
JFW Industries Inc.
Johanson Manufacturing
Johanson Technology Inc.
Johnson Components/Cambridge Prod.
Johnstech International Corp.
Jye Bao Co. Ltd.
K&L Microwave Inc.
Kaman Instrumentation
Keithley Instruments Inc.
Kemac Technology Inc.
Kevlin
Knowledge*on Inc.
Korea Sangshin Electric Co. Ltd.
Krytar Inc.
KW Microwave Corp.
Kyocera America Inc.
Kyocera Industrial Ceramics Corp.
Labtech Limited
Lamina Ceramics Inc.
Lark Engineering
Laser Processing Technology
Laser Services Inc.
Litron Inc.
Logus Microwave Corp.
Lorch Microwave
LPKF Laser & Electronics
Lucas/Signatone Corp.
Lucix Corp.
M2 Global Technology Ltd.
M/A-COM
Marconi Applied Technologies
Maryatt Technologies Inc.
Maury Microwave Corp.
MCE Technologies (Nanjing) Co. Ltd.
MCE Technologies Inc.
MCE/DML Microwave, Ltd.
MCE/Inmet Corp.
MCE/KDI-Integrated Products
MCE/KDI-Resistor Products
MCE/Metelics Corp.
MCE/Weinschel Corp.
MCV Technologies Inc.
MECA Electronics Inc.
Mega Circuit Inc.
MegaPhase
Meggitt Safety Systems
MEMSCAP Inc.
Merrimac Industries
Metallix Inc.
MH&W International Corp.
MICA Microwave Corp.
Mician GbR
Micralyne
Micro Lambda Wireless Inc.
Micro Networks, an ICS company
Micro-Coax Inc.
Micro-Mode Products Inc.
Microlab FXR
Microlab Inc.
Micromanipulator Co. (The)
MicroMetrics Inc.
Micronetics
Microphase Corp.
Microsemi Corp.
Microsource
Microtech Inc.
Microwave Applications Group
Microwave Circuits Inc.
Microwave Communications Labs Inc.
Microwave Development Company Inc.
Microwave Development Labs Inc.
Microwave Device Technology Corp.
Microwave Devices Inc.
Microwave Dynamics
Microwave Engineering Europe
Microwave Journal
Microwave Product Digest
Microwave Solutions Limited
Microwave Technology Inc. (MWT)
Mid-Atlantic RF Systems
MIG Microwave Innovation Group
Millitech, LLC
Mimix Broadband
Mini-Circuits
Mini-Systems Inc.
Mission Telecom (Inc.)
MI Technologies
MI.TEL SRL
MITEQ Inc.
58
Mitsubishi Electric & Electronics
MMCOMM Inc.
Modco Inc.
Modular Components National Inc.
Molex RF/Microwave Connector Div.
Monitor Products Company Inc.
Motorola SPS
MRSI
MTI – Milliren Technologies Inc.
Murata Electronics N.A. Inc.
Nanowave Inc.
Narda Microwave
Narda Microwave East
Narda Microwave Group
Narda Microwave West
Narda Safety Test Solutions
National Semiconductor
NEL America Inc.
Net Shape Technologies
Networks International Corp.
Nextec Microwave & RF Inc.
Noise Com Inc.
Northeast Electronics Corp.
Northrop Grumman Electronic Systems
Northwest EMC Inc.
NTK Technical Ceramics
Nurad Technologies
Octagon Communications
Olin Aegis
Ophir RF Inc.
Optotek Ltd.
Orbit/FR Inc.
Osprey Metals
P/M Industries
Pacific Aerospace & Electronics
Palomar Technologies
Paratek Microwave Inc.
Park/Nelco
Pascall Electronics Ltd.
Passive Microwave Technology
PC Dynamics
PCB Engineering
Peregrine Semiconductor Corp.
Philips Semiconductors
Piconics Inc.
Planar Electronics Technology
Planar Filter Company
Planar Monolithics Industries Inc.
Pletronics Inc.
Pole/Zero Corp.
Poly Circuits Inc.
Polyfet RF Devices
Polyflon
Polyphaser Corp.
Poseidon Scientific Instruments Pty.
Precision Photo Fab Inc.
Precision Tube
Presidio Components
Pulsar Microwave Corp.
Q Microwave
QinetiQ
Quasar Microwave Technology Ltd.
QUEST Microwave Inc.
QuinStar Technology Inc.
QWED
R & K Company Limited
Radio Waves Inc.
Raytheon RF Components
Reactel Inc.
RelComm Technologies Inc.
REMEC Inc.
Remtec Inc.
Renaissance Electronics Corp.
Res-Net Microwave
Resin Systems
RF Depot.com
RF Design
RFHIC
RF Industries
RF Micro Devices
RF Solutions
Richardson Electronics Ltd.
RJR Polymers Inc.
RLC Electronics
Rogers Corp.
H. Rollet & Co. Ltd.
Roos Instruments Inc.
Rosenberger of North America LLC
Royce Instruments Inc.
Sabritec
Sage Laboratories Inc.
Salisbury Engineering Inc.
San-Tron Inc.
SaRonix
Sawcom Tech Inc. (STI)
Sawtek Inc.
Schleifring Und Apparatebau GmbH
Schwarzkopf Technologies Corp.
Scientific Microwave Corp.
SDP Components Inc.
Semflex Inc.
Semi Dice Inc.
Semx Microelectronic Packaging Grp.
Sierracom
Sigma Systems Corp.
Signal Technology Corp.
Silicon Wireless
Simulation Technology & Applied Res.
Sinclair Manufacturing
Sirenza Microdevices
Smiths Group plc
Sonnet Software Inc.
Sonoma Scientific Inc.
Sophia Wireless
Soshin Electronics of America Inc.
Southwest Microwave
Spectra-Mat Inc.
Spectrum Control Inc.
Spectrum Elektrotechnik Gmbh
Spinner North America
Sprague-Goodman Electronics Inc.
SRC Cables Inc.
SRI Connector Gage Company
SSI Cable Corp.
SSPA Microwave Corp.
State Of The Art Inc.
Stetco Inc.
STMicroelectronics
Storm Products
StratEdge Corp.
Sumitomo Electric USA Inc.
Summitek Instruments Inc.
SUSS MicroTec
SV Microwave
C.W. Swift & Associates
Synergy Microwave
SyntheSys Research Inc.
T-Tech Inc.
Tachyonics Corp.
Taconic Advanced Dielectric Div.
Tecan Components
Tecdia Inc.
Technical Research & Manufacturing
Tecom Industries Inc.
Tektronix
Telegartner Inc.
Telephus Inc.
Telwave Inc.
Temex
Temptronic Corp.
Temwell Corp./The TW
Tensolite
Tensolite Complex Cable Assemblies
Tensolite High Performance Cable
Tensolite RF/Microwave Cable Assy.
Tensolite RF/Microwave Connectors
Thales Components Corp.
Thermax/CDT
Thin Film Concepts Inc.
Thunderline-Z
Times Microwave Systems
TLC Precision Wafer Technology
TRAK Communications Inc.
TRAK Microwave
Trans-Tech
Transcom Inc.
Trilithic Inc.
TriQuint Semiconductor
Trompeter Electronics
Tronser Inc.
Tru-Connector Corp.
TTE Inc.
A.J. Tuck Company
Ube Electronics
UltraRF
UltraSource Inc.
United Monolithic Semiconductors
Unity Wireless
Universal Microwave Technology Inc.
UTE Microwave Inc.
Vacuum Engineering & Materials Co.
ValPey Fisher Corp.
Vari-L
Vector Fields Inc.
Vectron International
Velocium, a TRW company
VertiCom Inc.
Vishay Intertechnology Inc.
Voltronics Corp.
VXI Technology Inc.
A.T. Wall Company
Wavetronix
Wenzel Associates
Werlatone Inc.
Wessex Electronics Ltd.
West Bond Inc.
John Wiley & Sons Inc.
WIN Semiconductors Corp.
Wireless Design & Development
WJ Communications
Xemod
XL Microwave Inc.
Zeland Software Inc.
Zentrix Tech, Circuitry Products
Zentrix Tech, Electronic Packaging
Zentrix Technologies, Powder Metal
Zeta-IDT
ZIFOR Enterprise Co. Ltd.
HISTORICAL EXHIBIT
HISTORICAL INTERACTIVE FORUM
The 2002 Microwave Theory and Techniques Society Historical Exhibit will be located in the South lobby entrance to the Exhibition Hall.
Symposium attendees are encouraged to visit the Historical Exhibit during regular exhibition hours.
In addition to the 50th ANNIVERSARY HISTORICAL EXHIBIT,
be sure to attend the HISTORICAL INTERACTIVE FORUM to be
held Wednesday afternoon from 3:30 to 5:10 PM. The forum will be held
in the lobby near the south entrance to the exhibit hall just adjacent to
the HISTORICAL EXHIBIT.
This forum will feature papers from the 50th Anniversary Transaction
issue written by leading pioneers in our field. This will be your chance to
meet some of the people in this industry who have inspired so many of
us.
The forum will be informal and completely interactive. Some authors
will also have historical hardware on hand to view and learn more about.
The authors will be on hand to present their papers, answer questions
and tell old “war stories” about their experiences in the industry. Don’t
miss this opportunity to learn more about how this industry has grown
in 50 years.
FIFTIETH AND ONE-HUNDREDTH ANNIVERSARIES
Not only are we celebrating the 50th anniversary of the formation of
the Microwaves Theory and Techniques Society (MTT-S) but an even
greater historical event occurred One Hundred years ago. December 11,
1901 was the genesis of a technology that evolved into the ubiquitous
(microwave) cell phone of today. Sitting high on Signal Hill in St. Johns,
Newfoundland Guglielmo Marconi held a receiver to his ear straining to
hear the Morse Code “dit-dit-dit” symbol for the letter “S” just as a commuter today tries to decipher the voice of his wife from the earpiece of
the modern cell phone as a roaring train pulls into the station. Somehow
both were able to receive their messages. The signal received by Mr.
Marconi was sent from a transmitter with a makeshift “Elephant Cage”
suite of antenna masts located in Poldhu, Cornwall, England. Just prior
to the scheduled transmission the array was blown over and temporary
antennas were held aloft with balloons and kites. As every good microwave engineer knows if something fails “improvise!” It was on this
day that Marconi proved to the world that radio signals could be transmitted great distances even around the curvature of the earth. Cornwall
to St. Johns is over 2100 miles. Over the ensuing years he created many
inventions. US patent No. 7777 solved the problem of interference
where different transmitters jammed one another. This invention offered
a new method of syntonic tuning. It was his inventions and business acumen that made the name Marconi the most famous name in the RF communications. The company that he started in 1897 as General Electric
Company plc lives on today as Marconi plc. His legacy and name are still
with us.
The equipment used in those early transmissions were “Spark Gap”
transmitters. To celebrate this 100th anniversary of the first long distant
transmission and successful reception of RF/Microwave energy by
Guglielmo Marconi, we will be displaying and demonstrating the same
type of spark gap equipment used by Marconi. As part of the Historical
Exhibit a spark gap transmitter built in 1912 will be shown. Also on
display will be an extremely rare 1908 DeForest spherical audion, which
was the first commercially available triode. In addition World War I
communications gear from private collections will be on display to show
the vast progress that has been made in less than 100 years.
HISTORICAL ELECTRONICS MUSEUM
The Historical Electronics Museum is the permanent home of the
MTT-S Historical Collection between Symposia. The Museum holds
many microwave related items besides the MTT-S Collection, including
parts of the SCR-270 (Pearl Harbor) radar and a complete SCR-584
radar, which was used with the proximity fuse anti aircraft shell in
World War II. It also contains an impressive library of over 7000 books
and 11,000 journals. The museum is located near the Baltimore-Washington International Airport, and is approximately 20 minutes from the
downtown Baltimore. Additional information on the Museum can be
found on its web site at http://www.erols.com/radarmus, or call (410)
765-2345. A visit to the museum will be an interesting and educational
experience for both young and old.
59
2002 MTT-S AWARDS
2002 MICROWAVE PRIZE
The Microwave Prize recognizes, on an annual basis, the most significant contribution by a
published paper to the field of interest of the Microwave Theory and Techniques Society. Papers
under consideration are those published during the period January 1 to December 31 of the year
preceding the Fall Meeting of the Administrative Committee at which the award is considered.
This year’s recipients are Emad Gad, Roni Khazaka, Michel Nakhla and Richard Griffith.
Citation:
2002 MICROWAVE CAREER AWARD
This award recognizes an individual for a career of meritorious achievement and outstanding
technical contribution in the field of microwave theory and techniques.
This year’s recipient is Ingo Wolff.
Citation:
“FOR A CAREER OF LEADERSHIP, MERITORIOUS ACHIEVEMENTS, CREATIVITY
AND OUTSTANDING CONTRIBUTIONS IN THE FIELD OF MICROWAVE THEORY
AND TECHNIQUES.”
“FOR A SIGNIFICANT CONTRIBUTION TO THE FIELD OF ENDEAVOR OF THE IEEE MTT
SOCIETY IN THE PAPER ENTITLED, “A CIRCUIT REDUCTION TECHNIQUE FOR FINDING THE STEADY
STATE SOLUTION OF NONLINEAR CIRCUITS,” IEEE TRANSACTIONS ON MICROWAVE THEORY AND
TECHNIQUES, MTT-48, PP. 2389–2396 (2000)”
2002 DISTINGUISHED SERVICE AWARD
This award is given in recognition of significant contributions and outstanding service to the
Microwave Theory and Techniques Society and the microwave profession over a sustained period of
time.
This year’s recipient is H. John Kuno.
Citation:
2002 N. WALTER COX AWARD
The N. Walter Cox Award has been established in recognition of the qualities of N. Walter Cox
and his service to the MTT Society prior to his untimely death in 1988. It is given to a Society volunteer whose efforts on behalf of MTT-S best exemplify Walter’s spirit and dedication.
This year’s recipient is J. Michael Golio.
Citation:
“FOR HIS OUTSTANDING AND DEDICATED SERVICE TO THE SOCIETY.”
2002 DISTINGUISHED EDUCATOR AWARD
This award was inspired by the untimely death of Prof. F.J. Rosenbaum (1937–1992), an outstanding teacher of microwave science and a dedicated Administrative Committee Member and
contributor. The award recognizes a distinguished educator in the field of microwave engineering
and science who best exemplifies the special human qualities of Fred Rosenbaum who considered
teaching a high calling and demonstrated his dedication to the Society through tireless service.
This year’s recipient is Linda P.B. Katehi.
Citation:
“FOR EXEMPLARY SERVICE, GIVEN IN A SPIRIT OF SELFLESS DEDICATION AND
COOPERATION.”
2002 OUTSTANDING YOUNG ENGINEER AWARD
The IEEE Electromagnetics Award was established in 1996, and is presented to an individual
for outstanding contributions to electromagnetics in the areas of theory, application or education.
The Award consists of a bronze medal, certificate and a cash prize.
This year’s recipient is Ke Wu.
Citation:
“FOR OUTSTANDING ACHIEVEMENTS AS AN EDUCATOR, MENTOR AND ROLE MODEL OF
MICROWAVE ENGINEERS AND ENGINEERING STUDENTS.”
“FOR OUTSTANDING CONTRIBUTIONS TO HYBRID INTEGRATION OF PLANAR
AND NON-PLANAR MICROWAVE AND MILLIMETER-WAVE CIRCUITS, AND THE THEORY
AND PRACTICE OF GUIDED-WAVE STRUCTURES.”
2002 MICROWAVE PIONEER AWARD
The Microwave Pioneer Award recognizes an individual or a team not exceeding three persons
having made outstanding pioneering technical contributions that advance microwave theory and
techniques and described in an archival paper published at least 20 years prior to the year of the
award.
This year’s recipient is John R. Tucker.
Citation:
2002 IEEE USA HARRY DIAMOND MEMORIAL AWARD
The Harry Diamond Memorial Award, sponsored by IEEE USA, honors individuals for distinguished technical contributions in the field of electro technology while in US government service.
This year’s recipient is Robert J. Trew.
Citation:
“FOR GENERALIZING MICROWAVE MIXER THEORY TO INCLUDE PHOTON-ASSISTED
TUNNELING AND DISCOVERING NEW EFFECTS LEADING TO QUANTUM-NOISE-LIMITED
MILLIMETER WAVE RECEIVERS.”
“FOR TECHNICAL CONTRIBUTIONS TO THE THEORY AND DESIGN OF MICROWAVE
POWER DEVICES USING WIDE BANDGAP SEMICONDUCTORS AND LEADERSHIP IN
MANAGING DOD’S BASIC RESEARCH PROGRAMS.”
2002 APPLICATION AWARD
The Microwave Application Award recognizes an individual or team for outstanding application of microwave theory and techniques.
This year’s recipient is Steven A. Maas.
Citation:
“FOR PROPOSING, ANALYZING AND DEMONSTRATING THE FET RESISTIVE MIXER.”
IEEE FELLOWS: CLASS OF 2002
The Member Grade of Fellow is conferred in recognition of unusual and outstanding professional distinction. It is awarded at the initiative of the IEEE Board
of Directors following a rigorous nomination and evaluation process. Individuals
receiving this distinction have demonstrated extraordinary contributions to one or
more fields of electrical engineering, electronics, computer engineering and related
sciences. This Grade is not conferred automatically on nomination; only a fraction
of those nominated are elected.
Twelve MTT-S Members who were evaluated by our Society were elected to
the Grade of Fellow, effective 1 January 2002:
Osami Ishida
For leadership in research and development of microwave devices
for mobile communication
Stephen James Nightingale
For contributions to planar microwave and millimeter-wave
circuits
Zoya Popovic
For contributions to the development of active antenna arrays
and quasi-optical power combining techniques
Ulrich Lothar Rohde
For contributions to and leadership in the development
and industrial implementation of microwave computer-aided
design technology
NAME
CITATION
John Tilman Barr, IV
For contributions and leadership in RF & microwave component
measurements & instrumentation for design and manufacturing
David E. Root
For contributions to nonlinear modeling of active
semiconductor devices
For contributions to the modeling of design of waveguide
components and planar structures
James Carson Stewart
For leadership in education and academic research
in the field of microwave and millimeter-wave devices and circuits
For contributions to the exact synthesis techniques
for microwave filters
Robert Weigel
For contributions to microwave acoustic, radio frequency
integrated circuits, and microwave circuits and their applications
For leadership in the development and application of MSAG GaAs
processes for novel MMIC circuits
Dylan Forrest Williams
For contributions to advancements in microwave measurement
Jens Bornemann
Richard John Cameron
Edward L. Griffin
60
In addition, the following thirteen MTT-S Members of the Class of 2002 Fellows
were evaluated by other Societies:
Joachim N. Burghatz
For contributions to integrated high-speed and radio-frequency
silicon devices and components
Neville Clinton Luhmann
For advances in millimeter/submillimeter wave plasma
diagnostics, intense microwave plasma interactions,
and coherent radiation generation
Leda M. Lunardi
For contributions to the development of high-performance 155 µm
monolithically integrated photoreceiver for optical communication
Eric Michielssen
For contributions to the advancement of computational
electromagnetics
Edl Schamiloglu
For contributions to the generation and propagation of intense
pulsed charged particle beams
Chi Ho Chan
For contributions to computational electromagnetics
Christos G. Christodoulou
For contributions to the application of neural networks in adaptive
antenna arrays
Ramesh Garg
For contributions to microstrip antenna technology
Albin John Gasiewski
For contributions to passive microwave sounding within clouds
and precipitation, and passive polarimetric microwave imaging
Staffan Einar Strom
For contributions to null field approach to multiple scattering
problems
Allen W. Glisson
For contributions to the development of numerical solution methods
in electromagnetic scattering by complex surfaces
Manfred Kaspar Andreas Thumm
For contributions to the development and application of gyrotron
oscillators, oversized microwave mode converters and transmission
line components
Hiroyoshi Ikuno
For contributions to the development of new numerical methods
and asymptotic techniques in computational electromagnetics
GENERAL INFORMATION
Information Booth: Pamphlets and information on the Seattle
area will be available at a booth centrally located in the registration area of the WSCTC. The Hospitality Suite is located in
the Sheraton Hotel.
IEEE/MTT-S Memberships: An IEEE/MTT-S membership
booth will be located in the registration area. (In addition, a
membership application is provided on page 6 of this program.) Those who apply for membership on site will be eligible for the discounted member rates on registration fees. IEEE
members (or on-site applicants) who register for the full Symposium and have not been MTT-S members in the past year
will be offered a free basic MTT-S membership good until the
end of the year, which will include admission to the MTT-S
members’ breakfasts.
Drinks and Refreshments: Free coffee and soft drinks will be
available during mid-morning and mid-afternoon breaks in the
refreshment areas in the exhibition hall.
Smoking: Smoking is not permitted in the WSCTC. Many
restaurants in Seattle are completely smoke-free but, generally,
if there is a lounge attached, some smoking is permitted. It is
best to inquire when making reservations.
Recruiting: Businesses do not send their personnel to the IMS
to be recruited by other businesses. To ensure that these meetings continue in the future, IEEE policy insists that recruiting
does not occur at the Symposium.
Recording of Technical Presentations: The recording of
technical presentations by video or audio recorders or cameras
is not allowed without the permission of the speaker and notification of the session organizer.
NOTES
61
2002 IEEE MTT-S TECHNICAL PROGRAM COMMITTEE
Mohamed Abouzahra
Douglas Adam
Mohammed Afsar
Fazal Ali
Barry Allen
Roberto Alm
Fritz Arndt
Peter Asbeck
John S. Atherton
Ali Atia
Inder Bahl
John Bandler
Rajeev Bansal
Zaher Bardai
Scott Barker
H. Clark Bell
Adalbert Beyer
Sarjit Bharj
Radek Biernacki
Luciano Boglione
Jens Bornemann
Hermann Boss
Ali Boudiaf
Tom Brazil
Gailon Brehm
Klaus Breuer
Steve Brozovich
Charles Buntschuh
Mark Calcatera
Edmar Camargo
Raymond Camisa
Richard Campbell
Andreas Cangellaris
Kenneth Carr
Zol Cendes
Kai Chang
Yung Kai Chen
Debabani Choudhury
Terry Cisco
Eliot Cohen
Charles Cox
James Crescenzi
Steve Cripps
Gilles Dambrine
Nirod Das
Lionel Davis
John Davis
Michael DeLisio
Edgar Denlinger
Norman Dietrich
Guglielmo D’Inzeo
Paul Draxler
Rhonda Drayton
Lawrence Dunleavy
Michael Dydyk
Dan Elad
Samir El-Ghazaly
Badawy Elsharawy
Rudy Emrick
Murat Eron
Aly Fathy
Andrea Ferraro
S. Jerry Fiedziuszko
Victor Fouad Hanna
Carol Gee
Bernard Geller
Ravindra Goel
Jitendra Goel
Marc Goldfarb
Charles Goldsmith
Mike Golio
Stephan Goodnick
Anand Gopinath
Mark Gouker
Gianfranco Manes
Raafat Mansour
Steve March
Steve Marsh
John Martens
Babak Matinpour
Mehran Matloubian
J.K. McKinney
David McQuiddy
Mohamed Megahed
David Meharry
James Mink
Koji Mizuno
Jozef Modelski
Mauro Mongiardo
Amir Mortazawi
Vijay Nair
Krishna Naishadham
Michel Nakhla
Brad Nelson
Clark Ngyuen
Edward C. Niehenke
Martin Nisenoff
Toshio Nishikawa
Michal Odyniec
Hiroyo Ogawa
Arthur A. Oliner
Abbas S. Omar
John Owens
Terry Oxley
Dev Palmer
John Papapolymerou
Don Parker
Suman Patel
Anthony M. Pavio
Jeanne Pavio
Jose Carlos Pedro
Branimir Pejcinovic
Song-Tsuen Peng
Barry S. Perlman
Anh-Vu Pham
John Pierro
Aryeh Platzker
Roger D. Pollard
George Ponchak
Jeffrey Pond
Zoya Popovic
Marian Pospieszalski
Reinhold Pregla
Sam Pritchett
Frederick Raab
Lamberto Raffaelli
Sanjay Raman
Richard Ranson
James Rautio
Jose Rayas-Sanchez
Gabriel Rebeiz
Don Reid
Leonard D. Reynolds
Edward Rezek
Alfy Riddle
Vittorio Rizzoli
Steve Rockwell
David Root
Luca Roselli
Arye Rosen
Clemens Ruppel
Peter Russer
Tom Ruttan
Magdalena Salazar-Palma
Tapan Sarkar
Paul Saunier
James Schellenberg
Ed Griffin
Marco Guglielmi
Pierre Guillon
K.C. Gupta
Madhu S. Gupta
Ramesh Gupta
Wojciech Gwarek
Mike Harris
Leonard Hayden
John Heaton
Patric Heide
Wolfgang Heinrich
George Heiter
Rashaunda Henderson
Rudolf E. Henning
Peter Herczfeld
Wolfgang J.R. Hoefer
Jia-Sheng Hong
Kazuhiko Honjo
Glenn Hopkins
Derry Hornbuckle
John B. Horton
Charles Huang
Ho C. Huang
H. Alfred Hung
James C.M. Hwang
Kiki Ikossi
Tatsuo Itoh
Kenji Itoh
Ferdo Ivanek
David Jackson
Robert W. Jackson
Charles Jackson
Dieter Jaeger
Rolf H. Jansen
George Jerinic
Reynold Kagiwada
Sridhar Kanamaluru
Linda Katehi
Allen Katz
Roger Kaul
Steve Kenney
Amarpal (Paul) Khanna
Marek Kitlinski
Reinhard Knerr
Reinhard Knöchel
Jim Komiak
Hiroshi Kondoh
Bruce Kopp
Kevin Kornegay
Youji Kotsuka
Chandra Kudsia
H. John Kuno
Lawrence J. (Larry) Kushner
Richard Lai
Paolo Lampariello
Mike Lancaster
Joy Laskar
Timothy Lee
Chi Lee
S.K. Leong
Baruch Levush
Ralph Levy
Guo-Chun Liang
Jenshan Lin
Alan Lindner
Olivier Llopis
Johann Luy
Gregory Lyons
Stephen (Steve) Maas
Mohammad Madihian
Asher Madjar
Raghu Mallavarpu
Donald Malocha
62
Manfred (Fred) Schindler
Franco Sechi
Alwyn Seeds
John Sevic
Arvind Sharma
Tsugumichi Shibata
Heroshi Shigesawa
Wayne Shiroma
Peter Siegel
John Sitch
Zbynek Skvor
Phillip Smith
Chris Snowden
Richard V. Snyder
Elissa Sobolewski
Roberto Sorrentino
Richard A. Sparks
Peter Staecker
Joe Staudinger
Michael Steer
Steven Stitzer
Wayne Struble
Roger W. Sudbury
Frank Sullivan
Stephen Sussman-Fort
Dan Swanson
Bela Szendrenyi
Salvador Talisa
Wai-Cheung Tang
Jesse J Taub
Joe Tauritz
Douglas Teeter
Emmanuil Tentzeris
Michael Thorburn
Glenn Thoren
Michael H. (Mike) Thursby
Yevgeniy Tkachenko
Tsuneo Tokumitsu
Kiyo Tomiyasu
Robert J. Trew
James Tsui
Ching-Kuang Tzuang
Yohtaro Umeda
Ruediger Vahldieck
André Vander Vorst
Karl Varian
Kikuo Wakino
John Walker
Chi Wang
Key-Chung (K.C.) Wang
Denis Webb
Robert Weigel
Claude M. Weil
Sander Weinreb
Andreas Weisshaar
Charles (Chuck) Weitzel
Thomas (Tom) Weller
Cheng P. Wen
Scott Wetenkamp
James Whelehan
Dylan Williams
James C. Wiltse
Ke Wu
HungYu (David) Yang
Shen Ye
Tsukasa Yoneyama
Robert York
Paul Yu
Kawthar A. Zaki
Peter Zampardi
Jan Zehentner
Q.J. Zhang
David Zimmermann
2002 IEEE MTT-S IMS STEERING COMMITTEE
Donn Harvey,
General Chairman
[email protected]
T 206-528-2002
T 425-837-8801
Marc Sweet, Vice-Chairman
[email protected]
T 425-562-6028
Tom Raschko,
Operations Chairman
[email protected]
T 425-391-6714
Technical Program
Eric Strid, Chair
[email protected]
T 503-601-1223
Ed Godshalk, Vice-Chair
[email protected]
T 503-641-3737 x1633
Workshops
Tom Ruttan, Workshop
Committee Chairman
[email protected]
T 503-696-2554
Larry Jacobs,
Workshops – Sunday
[email protected]
T 503-646-2410 x20
Rick Campbell,
Workshops – Monday
[email protected]
T 503-615-9378
Walter Wohlmuth,
Workshops – Friday
[email protected]
T 503-615-9236
Nelly Vladimirsky,
Workshop Publicity
[email protected]
T 503-615-9377
Terry Martin,
Workshop Publications Editor
[email protected]
T 503-612-4422
Panel Sessions
John Cowles,
Sub-Committee Chair
[email protected]
T 503-690-1333 x7696
Special Sessions
Alok Tripathi,
Sub-Committee Chair
[email protected]
Interactive Forum
Darren Ferwalt, Chair
[email protected]
T 503-615-9343
Rick Lutz, Vice-Chair
[email protected]
T 503-641-3737 x4756
Tim Mintzer,
Special Interactive Chair
[email protected]
T 503-749-3444
Ken Mays
[email protected]
T 503-615-9341
µAPS
Lisa Critchlow, Chair
[email protected]
T 503-245-2220
Audio/Visual
James McSpadden,
Sub-Committee Chair
[email protected]
T 253-657-3424
Scott Raby, Member
[email protected]
T 425-291-4861
Awards
Bill Gjertson, Chairman
[email protected]
T 425-393-2557
Isaac Bekker
[email protected]
T 253-657-5923
Catering
Gary Liebrecht
[email protected]
T 253-657-0891
CD-ROM
Aurea Taylor, CD-ROM Editor
[email protected]
T 503-615-9331
Data Base
Jock Argust
[email protected]
T 425-702-5916
Digest
Rob Hamilton,
Sub-Committee Chair
[email protected]
T 503-615-9407
Gul Gazipura, Member
[email protected]
T 408-782-5911
Norman Chiang, Member
[email protected]
T 408-588-2264
Rob Christ, Member
[email protected]
T 503-615-9316
Electronic Submissions
Rob Shaver
[email protected]
T 512-933-6212
Joe Decuir,
Presentations Coordinator
[email protected]
T 425-562-6598
Finance
Steve Peters
[email protected]
T 425-844-9307
Mark Virtue
[email protected]
T 425-468-2335
Scott Huhn
[email protected]
T 503-624-2139
Eric Downs,
Foothills Financial Services
[email protected]
T 425-557-8418
Historical Exhibit
Harry Rutstein, Chair
[email protected]
T 206-574-0900
Liaisons
Russ Hertenberger,
University Liaison
[email protected]
T 425-702-5886
Paul Ferguson,
Liaison, RFIC & ARFTG
[email protected]
T 425-376-2253
Leonard Hayden,
Liaison, ARFTG
Leonard_Hayden
@cascademicrotech.com
T 503-601-1580
Ming Chen,
International Liaison
[email protected]
T 253-657-5953
Local Arrangements
Jim Freeman, Chair
[email protected]
T 253-657-4250
Shashi Sanzgiri, Vice-Chair
[email protected]
T 253-657-5591
Jennifer Turso, Contact
[email protected]
T 732-981-3428
Photography
Ed Adamick
[email protected]
T 425-562-6112
Protocol
Deby Harvey
[email protected]
T 425-391-3455
Gerald Kaufman
[email protected]
T 425-889-9133
Ray Butler
[email protected]
T 425-580-1847
Janet Oneil
[email protected]
T 425-868-2558
Publicity
Jerry Prismantas, Chair
[email protected]
T 425-354-1320
Henry Oman, Member
[email protected]
T 206-878-4458
Registration
Steve Pennock
[email protected]
T 209-815-1438
Eric Soshea
[email protected]
T 425-376-2381
RFIC
Sayfe Kiaei, General Chairman
[email protected]
RFIC Local Arrangements
Vikram Jandhyala
[email protected]
T 206-543-2186
63
Signs
Roland Svensson,
Sub-Committee Chair
[email protected]
Special Events
Mike Florian,
Sub-Committee Chair
[email protected]
T 253-773-9346
Student Papers
Branimir Pejcinovic
[email protected]
T 503-725-5416
Garth Sundberg
[email protected]
T 503-641-3737 x1112
Transactions
Andreas Weisshaar, Co-Editor
[email protected]
T 541-737-3153
Wolfgang Hoefer, Co-Editor
[email protected]
T 250-721-6030
George Heiter, Co-Editor
[email protected]
T 978-475-7266
Kathee Runo,
Transactions Editorial Assistant
[email protected]
T 480-775-1260
Transportation
Julio Navarro,
Sub-Committee Chair
[email protected]
T 253-657-8079
T 425-468-2268
Web Support
Jimmy Takeuchi,
Sub-Committee Chair
[email protected]
T 253-657-5955
Ruth MacDonald-Schmidt
[email protected]
T 425-861-0689
Trisha Sutakawa
[email protected]
Other Members
Larry Whicker, owner of LRW
[email protected]
T 704-841-1915
Exhibition
Harlan Howe, Chair
[email protected]
T 781-769-9750
F 781-769-5037
Kristen Dednah, Member
[email protected]
T 781-769-9750
F 781-769-5037
Program Publication
Keith Moore
[email protected]
T 781-769-9750
F 781-769-5037
At-Large Member
Howard Ellowitz, Member
[email protected]
T 781-769-9750
F 781-769-5037
IEEE MTT-S ADMINISTRATIVE COMMITTEE
2002 OFFICERS
President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J.T. Barr, IV
Vice President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .M.J. Schindler
Treasurer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J.S. Kenney
Secretary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .D.K. Lovelace
ELECTED ADCOM MEMBERS
2002
2003
2004
J.T. Barr, IV
S.M. El-Ghazaly
J. Hausner
M.P. DeLisio
H.M. Harris
J. Modelski
K.C. Gupta
K. Honjo
V.K. Nair
L.B. Katehi
J.S. Kenney
B.S. Perlman
M.J. Schindler
J.M. Pond
W.A. Shiroma
K.R. Varian
R. Sorrentino
R.J. Trew
S.F. Wetenkamp
G.R. Thoren
IMMEDIATE PAST PRESIDENTS
2001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .C.M. Jackson
2000 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .R.W. Sudbury
1999 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .E.A. Rezek
HONORARY LIFE MEMBERS
A.C. Beck
A.A. Oliner
K. Tomiyasu
S.B. Cohn
T.S. Saad
L. Young
T. Itoh
FUTURE IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIA
2003 — PHILADELPHIA, PA — JUNE 8–13, 2003
General Chairman
Richard Snyder
Tel (973) 492-1207
[email protected]
Finance
Sridhar Kanamaluru
Tel (609) 734-2016
[email protected]
Co-Chairman
TPC Chair
Kiyo Tomiyasu
Tel (610) 531-5740
[email protected]
Local Arrangements
Peter Herczfeld
Tel (215) 895-2256
[email protected]
Publicity
Ray Benson
Tel (609) 259-0400
[email protected]
Bill Wilber
Tel (732) 462-1880
[email protected]
TPC Co-Chairman
Arye Rosen
Tel (609) 734-2927
[email protected]
Web Master
Jenshan Lin
Tel (908) 582-5182
[email protected]
2004—FORT WORTH, TX
2006—SAN FRANCISCO, CA
2008—ATLANTA, GA
June 6–11, 2004
Chairman
June 11–16, 2006
Co-Chairmen
June 2008
Chairman
Karl Varian
Raytheon
Tel (972) 344-2616
[email protected]
Jerry Fiedziuszko
Space Systems/LORAL
Tel (650) 852-6868
[email protected]
John T. Barr, IV
Hewlett-Packard
Tel (707) 577-2350
[email protected]
Joy Laskar
Georgia Tech
Tel (404) 894-5268 • Fax (404) 894-0222
[email protected]
2005—LONG BEACH, CA
2007—HONOLULU, HI
2009—BOSTON, MA
June 12–17, 2005
Chairman
June 2007
Chairman
June 2009
Chairman
Charlie Jackson
TRW
Tel (310) 812-0283
[email protected]
Mike DeLisio
University of Hawaii
Tel (808) 956-7898 • Fax (808) 956-3427
[email protected]
64
Fred Schindler
RF Micro Devices
Tel (978) 670-2230
[email protected]
SEATTLE INFORMATION
WELCOME TO THE EMERALD CITY
Within 10 years the market became Seattle’s funky equivalent of a town
square. With the Depression and World War II, the decline of First Avenue became apparent. By 1963, planners encouraged the city to tear
down the market in favor of a parking facility and high-rise development. Preservationists, politicians, local architects, and voters saved the
heart and soul of Seattle. Because of this fight the market has become a
part of every Seattleite’s soul. In 1974, a seven-acre Market Historical
District was established. Today, about 125 local farmers have permits to
sell their produce at day stalls, 200 permanent businesses operate yearround and 200 registered craftspeople and artists sell their wares.
The main attraction at the Market are the people. Old sailors reminisce about the Market’s past; the outgoing produce and fish vendors
draw the people to their stalls; the street musicians, puppeteers, and
mimes turn street corners into stages. Spend an unstructured day meandering the nooks and crannies of the market. Nibble from its astonishing
variety of ethnic and regional foods, browse the shops and people watch.
If you visit before 9:00am, you can watch the market come alive as the
vendors set up in the Main Arcade. The Pike Place Market is one area of
Seattle that should not be missed.
Steep hills. Lush greenery. Flowers bursting with color. Glimpses of
crystal blue water everywhere — Puget Sound, bays, lakes, rivers and
canals. All of this combined with snowcapped Mount Rainier to the
South, the Cascades to the East and the Olympics to the West, show a
visitor why Seattle is known as “The Emerald City.” No, you won’t find
Dorothy, the Tinman or Toto here, but you will find friendly people,
high standards of service and a youthful creativity.
The boundaries of hills and water create vibrant and intriguing neighborhoods creating a “small town” feel. The city is filled with a variety of
specialty shops, wonderful restaurants and spectacular sights which fill
every one of the five senses.
DOWNTOWN SEATTLE
Technically, the center of town is at University Street and Fourth Avenue. The lively downtown area consists of department stores, specialty
shops, renovated historic theaters, cinemas, espresso stands, restaurants
and unexpected experiences. In general, streets run east and west, and avenues run north and south. Yesler Avenue in Pioneer square is the “0”
mark for North & South streets. Listed below are some favorite sights
and secrets.
TILLICUM VILLAGE
A unique Northwest experience is available on Tuesday evening, June
4th from 5:30 PM to 10:30 PM. Leave Seattle on a boat cruise to Blake Island while enjoying the view of islands, mountains and the Seattle skyline. Once there, savor a delicious buffet inside the huge cedar longhouse
featuring Northwest Coast Indian-style baked salmon. The evening includes a spectacular dance show by the Tillicum Village Dancers, who
bring to life the dances and legends of the Northwest Coast. Tickets are
limited; transportation is included.
PIONEER SQUARE
Seattle’s first neighborhood and business district burned to the
ground in the summer of 1889. Thirty central city blocks, a total of 64
acres, were leveled before the Great Fire fizzled amid tidelands where the
Kingdome stands today. The area was rebuilt immediately on higher
ground that created an “Underground Seattle” which can be toured daily. The area has kept the charm of the early 1900s with its brick buildings and walking malls. Today, approximately 88 acres of offices, restaurants, art galleries and specialty stores populate what was the city’s first
historic district. Pioneer Square is filled with history, unique shops, antique stores, and some of Seattle’s best nightclubs.
TRANSPORTATION
Driving Directions from Sea/Tac Airport to Downtown
• Start out going South on Parking/Baggage Claim towards
Parking Terminal
• Follow the road around as it curves to the left and heads back north
toward the airport entrance and the freeways
• Continue north and take the 518 east exit to the right, toward I5
• Take the I-5 North Exit on left towards Seattle
• Contiue on I-5 North
• Take the Seneca St. exit #165 on left side
An alternative to rental cars is to take the Gray Line Airport Express
from the Sea/Tac Airport for $8.50 one way. The shuttle runs every 30
minutes and makes stops at all major hotels. The 25 mile trip to downtown from the airport via taxicab will cost approximately $30.00–
$45.00 one way depending on traffic and time of day.
WATERFRONT
The waterfront drew visitors a century ago as the last stop for gold
prospectors in the US before heading to Alaska. The waterfront still excites the senses with the bright lights, colorful banners, clanging bells on
the restored street cars, large parks overlooking ships, ferry horns echoing and enticing aromas of salmon, crab, and sourdough bread.
The best way to reach this bustling area is via University Street. Walk
down University Street West towards the water and cross First Avenue
where you will come upon the Harbor Steps. This 16,000 square foot
staircase is so grand, that it is a park. The steps have become Seattle’s
version of Rome’s Spanish Steps, a place to meet, to pause and reflect and
to catch the sun amid eight waterfall fountains.
Once you reach the waterfront you will find refurbished old warehouses containing restaurants and shops. The bare wood decks of Piers 62/63
become one of America’s most spectacular concert venues every summer
where big name artists perform amid an incredible setting of skyscrapers, boats, sunsets and mountains. The waterfront is where you can hop
aboard a boat for a quick Harbor Tour or take a Ferry ride. This area is
continually growing and expanding and enhancing the city.
SOCIAL EVENTS
RFIC Symposium Reception: All RFIC Symposium attendees are invited to attend a reception hosted by the RFIC Steering Committee and
several leading RF/Wireless IC vendors on Sunday, June 2 from 7:00 PM
to 9:00 PM at the Sheraton Hotel. Admission tickets for attendees and
one guest will be included in the registration packets.
Microwave Journal/MTT-S Reception: All Microwave Week attendees
and exhibitors are invited to attend a reception hosted by Microwave
Journal and MTT-S on Monday, June 3 from 6:00 PM to 8:00 PM at the
Pacific Science Center, 200 Second Avenue North, Seattle. Transportation will leave the Convention Center starting at 5:45 PM.
Industry Hosted Cocktail Reception: Symposium exhibitors will host a
cocktail reception on Wednesday, June 5 from 6:00 PM to 7:30 PM at the
Sheraton Hotel. Complementary beverage tickets will be included in the
registration packages.
IEEE MTT-S Awards Banquet: The Annual Awards Banquet will be
held on Wednesday, June 5 from 7:30 PM to 10:00 PM at the Sheraton
Hotel. This evening will consist of an elegant dinner, awards presentation and entertainment featuring the first “MTTV” production.
Student Awards Banquet: Student Paper Awards, MTT Graduate Fellowships and MTT Undergraduate Scholarships will be presented at the
Student Awards Banquet on Thursday, June 6 at noon. The banquet is
free of charge for all IMS 2002 student paper authors and advisors.
PIKE PLACE MARKET
The oldest continuously operating farmer’s market in the country has
been called the “Marrakesh of the Northwest” by the New York Times.
The market began in 1907, when food wholesalers formed a “Produce
Row” along Western Avenue. Farmers who didn’t have the time to sell
their crops relied on wholesalers to help them. The farmers suspected
that the wholesalers were cheating them and gouging the purchasers and
the city responded by establishing a true farmer’s market. On the first
day, fewer than a dozen wagons showed up but thousands of people came
eager to buy. The next week, 70 wagons lined the Pike Place curb and
created the need to standardize stall sizes to fit everyone and canopies
were built to protect them from the rain. There was a proposal to move
the market to the waterfront and create a grandiose complex, but residents voted to keep the market small and personable in Pike Place.
Portions of the above information appear courtesy of Carol Riddle, Seattle VIP Services
65
GUEST PROGRAM
Saturday, June 1, 2002
Golf Tournament
Hours: 3:00 PM
Designed by Englishman William Henry Tucker, Sr. and Frank James in 1930, Jackson Park Golf Course is
a traditional 18-hole championship course. Named after Andrew Jackson, the former President of the United States, Jackson Park is located north of downtown in the Olympic Hills section of Seattle. ($105)
Includes: Transportation, greens fees and golf cart
Sunday, June 2 & Friday, June 7, 2002
Pre and Post Tour Options
Hours: 7:30 AM–8:00 PM (2 hr service to Victoria)
Independent Victoria Day Trip (Unescorted)
For those wishing to visit the picturesque town of Victoria, British Columbia on their own, a scenic two or
three hour cruise aboard the Victoria Clipper catamaran will bring you to this quaint “Old English” town.
Reservations aboard the Victoria Clipper can be made for any day of the week. You are responsible for
transportation to and from Pier 69, which is a short cab ride from the downtown Seattle hotels. You must check in at the dock 45 minutes prior to departure to collect your boarding passes. ($115)
Snoqualmie Falls, Steam Engine Train
and Hedges Winery Tour
Hours: 9:00 AM–3:00 PM
Twenty-five miles east of Seattle, you will find one of Washington’s most popular scenic attractions, Snoqualmie Falls. The Snoqualmie River cascades 270 feet through a spectacular rock gorge into a 65-foot
deep pool. On top of the falls sits one of Seattle’s most popular romantic getaways — the Salish Lodge. The
exterior of the Salish may look familiar, as it was the lodge used to film the quirky TV hit Twin Peaks. After
enjoying the views from the falls, guests will enjoy a gourmet boxed lunch before traveling to Snoqualmie’s
Historic Train Depot. After lunch, guests will experience a scenic train excursion aboard antique railroad
coaches through the upper Snoqualmie Valley. This round trip excursion will last an hour. Afterwards,
guests will board deluxe motorcoaches and head back towards Seattle with a stop in the town of Issaquah,
home to a favorite Washington wine, Hedges Cellars. ($63)
Includes: Motorcoach Transportation; Seattle VIP Services Guide; Viewing of Snoqualmie Falls; Steam Engine Train Tour; Hedges Wine Tasting; Washington State Sales Tax
Wednesday, June 5 and Thursday, June 6, 2002
Boeing’s Everett Plant Tour
Hours: 8:30 AM–12:00 PM, Wednesday; 12:30–4:00 PM, Thursday
A trip to Boeing’s Everett facility offers an in-depth view of the construction and assembly of jet aircraft.
This is a fascinating tour, which gives insight into the many facets of the airplane industry. The 90-minute
tour includes a video presentation followed by a visit to the 747 assembly building and a drive to the flight
line. There are 21 steep steps, a 1/3 mile walk and an elevator ride to 35 feet above the factory floor. On the
way to the plant our informative guide will also give visitors the opportunity to learn about life in the Pacific Northwest and the area’s relationship to Boeing, one of it’s largest employers. ($40)
Includes: Motorcoach Transportation; Boeing Plant Tour Admission; Washington State Sales Tax; Seattle
VIP Services Tour Guide
Wednesday, June 5, 2002
Seattle’s Museum Tour with Lunch in Pike Place Market
Seattle Art Museum
The pride of the city’s art community, the new Seattle Art Museum is itself a work of art, designed by worldrenowned architect Robert Venturi. A beautifully displayed Northwest Native American collection includes
masks, sculptures, textiles, decorative and household objects. Contemporary Pacific Northwest artists are
featured as well as world-renowned artists from America, Europe and Asia.
Burke Museum
See displays of Washington’s only real dinosaur fossils, our world-renowned Northwest Coast Native art and
other fabulous treasures from the Burke collections. The Burke Museum has served the people of Washington State as the premier museum of natural history and culture for more than 100 years.
Museum of History and Industry
The Museum of History and Industry, opened on February 15, 1952, has grown to become the largest private heritage organization in the state of Washington, attracting more than 60,000 visitors annually from
the Northwest and beyond. The Museum collects, preserves and presents everything from ship’s wheels to
evening gowns, gramophones to baby carriages, time clocks to crosscut saws, which gives visitors glimpses
of life in Puget Sound from the 1780s to the present day.
Lunch at No Boundaries Café
No Boundaries is a quaint little European-style café in the heart of Pike Place Market. They serve fresh
soups, salads and sandwiches. Each guest will receive a $10.00 voucher to use at their convenience, while
strolling through Pike Place Market for an hour and a half.
Includes: Motorcoach Transportation; Museum Tour Package ($58)
Thursday, June 6, 2002
Cruise the Locks and Seattle Harbor Tour
Hours: 9:30 AM–1:30 PM (Lock tour departs at 10:00 AM)
with Lunch at Harborside Restaurant
Since 1963, this 2-1/2 hour cruise has been operating on both salt and fresh water via Seattle’s famous Hiram
Chittenden Locks. The Hiram Chittenden Locks, built early in the century, were as important for Seattle and
Puget Sound as the Panama Canal was for the Western Hemisphere. As you pass through the locks, you will
learn how they operate. Cruising in Elliott Bay, you will be fascinated by the maritime activity of chugging tugboats, smoothly gliding sailboats, mighty oceangoing tankers and cargo ships while you watch the architecturally exciting Seattle skyline unfold. For spectacular views, look west to the Islands of Puget Sound and the snowcapped Olympic Mountains. The cruise is narrated so you will understand just what you are seeing. ($85)
Note: Proof of US citizenship (such as a passport, photo drivers license or certified copy of birth certificate) is required for all
US citizens (including minors) entering Canada. Foreign nationals should check possible visa needs for entry into Canada
and re-entry into the U.S.
Boat departs Seattle at 8:30 AM and arrives in Victoria at 10:30 AM (Guests MUST check in one hour in advance) • Boat departs Victoria at 6:00 PM and arrives in Seattle at 8:00 PM.
Includes: Round trip Victoria Clipper Fare; Seattle VIP Services Victoria Clipper Voucher
Monday, June 3–Thursday, June 6, 2002
Morning Activities
Hours: 6:30 AM–7:15 AM
Morning Run Through Downtown Seattle
You have the opportunity of joining one of our fitness experts on either a run or slower paced jog through
scenic downtown Seattle. Each guide will be sensitive to the group’s fitness level and desired intensity. The
morning run will provide you an opportunity to see different areas of downtown Seattle. Each morning, our
running guide will take you on a different run through the city. (Free)
Morning Walking Tour of Seattle
Guests who prefer a walk in the mornings will enjoy an invigorating walk through downtown Seattle. Our
walking guide will narrate the walk, pointing out interesting sights, architecture and public art highlights.
Each morning will offer a different tour of the downtown area. (Free)
Monday–Wednesday: 8:00 AM–5:00 PM — Thursday: 8:00 AM–12:00 NOON
Our knowledgeable hosts, hostesses and tour guides delight in our city and enjoy the opportunity to share
Seattle with others. They are involved in the community and are well versed in the Pacific Northwest. Many
guides have also traveled extensively and are conversant on a broad range of topics. They will provide you
with restaurant suggestions, make reservations, give ideas on where to explore and answer any questions.
Monday, June 3, 2002
Mount Rainier Tour
For many years Mount Rainier has been the landmark and sacred ground for the Northwest Native American Indians and is now the symbol of natural grandeur for the Northwest. This majestic peak (Elevation:
14,411 feet) was named by Captain Vancouver of the English Navy in 1792 for his friend, Admiral Peter
Rainier. You will enjoy a drive through the countryside to Mount Rainier National Park (Elevation: 5,400
feet) with its easy hiking trails that pass waterfalls, massive glaciers and fields of wildflowers. There is an
informative Visitor Center with panoramic views and slide and movie presentations on the park and its history. Snack and gift shops can be found at the Visitor Center and the beautiful Paradise Inn. Sturdy walking
shoes are advised. Lunch is on your own. We recommend the lovely restaurant at the Paradise Inn. ($87)
Includes: Motorcoach Transportation; Mt. Rainier Nat’l Park Admission; Seattle VIP Services Tour Guide
Monday, June 3, 2002
Seattle City Highlights
with lunch at the Space Needle
You will learn why Seattle has been named one of America’s most livable cities! Our friendly and informative guides will give historical background on the area, point out interesting landmarks, as well as give insider tips on special shopping and sightseeing areas. Included in the tour is historic Pioneer Square, the location for Seattle’s top art galleries; the International District, heart of Seattle’s Asian community; and the
beautiful Univ. of Washington campus. A stop at the Hiram H. Chittenden Locks will show how the area’s
fresh and salt waters meet, and you will enjoy the underwater viewing at the adjoining salmon ladders. Last
but not least a short stop at Seattle’s renowned Pike Place Market, an exciting array of color, aroma and
sounds! A highlight of the tour is lunch at the Space Needle. The Seattle Center is the park-like setting created for the 1962 World’s Fair, and home to Seattle’s most famous landmark, the Space Needle. ($68)
Includes: Motorcoach Transportation; Map of Pike Place Market; Lunch at the Space Needle; Private Room
with view; Admission to Observation Deck of Space Needle; All Applicable Gratuities; Washington
State Sales Tax; Seattle VIP Services Tour Guide
Northwest Winery and Brewery Tour
Hours: 12:30 PM–4:30 PM
Situated on the same latitude as the French wine country, Washington State has a growing wine industry
that is winning prestigious awards throughout the world. You will learn about Northwest wines as you visit
a popular local winery. Located on 87 acres of arboretum-like grounds, Chateau Ste. Michelle is Washington’s oldest and most famous winery. After a cellar tour and wine tasting, you will enjoy strolling the
grounds and visiting the extensive wine and accessory shop. You will also visit Columbia Winery, the pioneer of premium wine production in Washington State, and Red Hook Brewery, one of the finest microbrews that Seattle has to offer! ($33)
Includes: Motorcoach Transportation; Columbia and Chateau Ste. Michelle Tour and Tasting; All Applicable Taxes and Gratuities
Note: Sweater, jacket and comfortable walking shoes are recommended.
Includes: Motorcoach Transportation; Harbor/Locks Cruise; Lunch at Harborside Restaurant; Washington
State Sales Tax; Seattle VIP Services Tour Guide
Friday, June 7–Saturday, June 8, 2002
Escorted Victoria Trip
Hours: 6:30 AM, Friday–10:00 PM, Saturday
Pre and Post Overnight Tour Options
Enjoy a 2 day/1 night outing to nearby Canada by visiting the “Old English” town of Victoria, British Columbia. The morning begins with a scenic cruise aboard the Victoria Clipper. Once in Victoria, you will be
whisked away to your hotel to drop off your belongings. Our knowledgeable guide will be on hand throughout the day to help you make the most of your trip, and there will be ample free time to enjoy shopping and
sightseeing in Victoria before the return trip to Seattle. ($285)
Note: Proof of US citizenship (such as a passport, photo drivers license or certified copy of birth certificate) is required for all
US citizens (including minors) entering Canada. Foreign nationals should check possible visa needs for entry into Canada
and re-entry into the US.
Friday, June 7: Boat departs Seattle at 8:00 AM and arrives in Victoria at 11:00 AM (Guests MUST check in one
hour in advance) • Saturday, June 8: Boat departs Victoria at 7:00 PM and arrives in Seattle at 9:45 PM
Includes: Round-trip Motorcoach Transportation to Pier 69; Round trip Victoria Clipper Fare; Seattle VIP Services Victoria Clipper voucher; Transfer between Hotel and Pier in Victoria; (1) Night Accommodation
in Victoria (double occupancy); Luggage handling; Continental Breakfast; Seattle VIP Services Staff
Note: Guests wishing to have High Tea at the Empress Hotel should be aware that there is a dress code. Shorts, blue jeans, jogging attire and T-shirts are not allowed.
66
Washington State Convention
and Trade Center
LEVEL 3
MEETING ROOMS
LEVEL 2
MEETING ROOMS
LEVEL 6
BALLROOMS
67
Westin Seattle Hotel
MEZZANINE
SAN JUAN LEVEL
GRAND BALLROOM
68
Sheraton Seattle Hotel
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IEEE MTT-S
INTERNATIONAL MICROWAVE SYMPOSIUM PROGRAM GUIDE
Seattle, Washington
FIRST CLASS MAIL
US POSTAGE
PAID
Permit No. 490
LIBERTY, MO

Full Conference Program

Transcription

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