Full Conference Program
Transcription
Full Conference Program
2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM Seattle, WA • June 2–7, 2002 F R www.ims2002.org RFIC A T G IMS 2002 IMS 2002 Symposium Symposium Week Week at at a a Glance Glance IMS Activity Location Tutorials Workshops Plenary Session Technical Sessions Interactive Forum Panel Sessions WSCTC WSCTC WSCTC WSCTC WSCTC WSCTC Exhibits µAPS RFIC Workshops Plenary Session Technical Sessions Panel Session Interactive Forum ARFTG Conference Exhibits Social Workshop Breakfast, Lunch MTT Member Breakfast RFIC Reception MJ Reception Salmon Bake Industry Reception MTT Awards Banquet Student Awards Banquet Speakers Breakfast ARFTG Breakfast ARFTG Awards Lunch WSCTC WSCTC WSCTC WSCTC WSCTC WSCTC WSCTC WSCTC WSCTC WSCTC Sheraton Pacific Science Center Tillicum Village Sheraton Sheraton Sheraton WSCTC WSCTC WSCTC SUN/2 M N A MON/3 E M N A TUE/4 E M N A WED/5 E M N A THU/6 E M N A FRI/7 E M N A E IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM 2002/MICROWAVE WEEK MORNING 8:00–9:40 AM 10:10–11:50 AM LUNCHTIME 12:00–1:15 PM AFTERNOON 1:20–3:00 PM Monday, June 3, 2002 Sunday, June 2, 2002 Sat., June 1 EVENING 3:30–5:10 PM Registration 2 to 6 PM Registration 7 AM to 6 PM TSA: RF Fundamentals TSB: MEMS Technology for Highly Integrated RF Systems TSC: EM Simulators — Theory and Practice WSA: Developments in Integrated Circuits for Communications at 40 Gb/s and Beyond WSB: Highly Integrated Packaging Techniques for Microwave and Millimeter-wave Packaging for Broadband Applications WSC: Direct Conversion Transceivers for Cellular and Wireless Applications WSD: RF and High Speed Flip-chip Technology and Design WSE: Advances in Bluetooth Technology WSF: Wireless Systems on a Chip WSH: RF Solutions for GPS-to-handset Applications WSG: GHz and THz Solid State Device Simulation WSI: Intelligent RF Front-ends Registration 7 AM to 5 PM RFIC Plenary Session 8 AM to 10 AM — RFIC Technical Sessions 10 AM to 5 PM – WSCTC WMA: Automotive Radar and Prospective Circuit/Antenna Technologies — From Car Collision Avoidance to Autonomous Driving WMB: Microwave Component Design Using Space Mapping Methodologies WMC: Ultrahigh Speed Microwave and Photonic Devices and Systems: How Will They Be Tested? WMD: Wide Bandgap Technologies: Applications, Devices and Circuit Issues WME: Advances in Ceramic Interconnect Technologies for Wireless, Microwave and Photonic Applications WMF: Introducing New Concepts in Nonlinear Network Design WMG: EM-based CAD and Optimization of Waveguide Components, Planar Circuits and Antennas WMH: Passive Components for RF Applications WML: Wireless Microsensors: Technology and Applications WMI: Spectrum Management Issues WMM: Microwave and Lightwave System Architectures… PM: RF CMOS in Cell Phones: WMJ: Advances in RF MEMS Technology WMN: Modeling of RF MEMS Switches Fact or Fiction WMK: Microwave Photonics for Medical Imaging WMO: Differential Device Characterization and Modeling RFIC Reception 7 to 9 PM Sheraton Microwave Journal/ MTT-S Reception 6 to 8 PM Pacific Science Center Tuesday, June 4, 2002 Registration 7 AM to 5 PM RFIC Symposium 8:30 AM to 5 PM – WSCTC IMS Exhibition and µAPS 9 AM to 5 PM TU1: Plenary Session TU2A*: Radio Frequency Integrated Circuits for 3G (Joint IMS/RFIC) TU2B: MMIC Technology (Joint IMS/RFIC) TU2C: Phased Arrays and Beam Steering Techniques TU2D: Integrated Circuits for 40 Gb/s Fiber Systems TU2E: Couplers, Dividers and Baluns TU2F: Nonlinear CAD Techniques for Circuits and Systems PT: Is the Single Chip Radio Dead? IF-TU: INTERACTIVE FORUM 1:30 TO 4:30 PM TU4A: Active Device Modeling TU3A: Silicon Substrate and Characterization and Inductor Modeling (Joint IMS/RFIC) (Joint IMS/RFIC) TU4B: RFIC Power Amplifier TU3B: SiGe RFIC Process Technologies Technologies (Joint IMS/RFIC) (Joint IMS/RFIC) TU4C: Smart Antennas and Digital TU3C: Integrated Passives for RF Beamforming Techniques and Millimeter-wave Applications TU4D: Application of RF MEMS TU3D: RF MEMS Switch Design and Modeling TU4E: Frequency and Phase TU3E: Frequency Conversion Circuits Control Circuits Tillicum Village 5:30 to 10:30 PM Registration 7 AM to 5 PM IMS Exhibition and µAPS 9 AM to 5 PM Wednesday, June 5, 2002 IF-WE: INTERACTIVE FORUM 1:30 TO 4:30 PM WE1A: High Power Amplifiers WATTS UP? WE2A: Distortion Correction Techniques for High Power Amplifiers WE1B: Microwave and Millimeter-wave Sensor Applications WE1C: Transmission Line Structures WE1D: Advances in Microwave Oscillators WE1E: Linear Modeling WE2B: Evolving Communication and Radar Systems WE2C: Transitions, Polarizers and Coupling Characteristics in LTCC WE2D: Microwave and Millimeter-wave Signal Generation WE2E: Nonlinear Device Modeling I WE1F: Advances in Time Domain Techniques for EM Field Modeling WE2F: Applications of the Finite-difference Time-domain Method PW: RF MEMS: Revolution or Evolution WE3A: Power Amplifier Technologies for Broadband, High Efficiency Applications WE3B: Direct Conversion Techniques for Wireless Systems WE3C: New Leakage Effects on PC Transmission Lines WE3D: Efficient Modeling Techniques for Circuit Simulation WE3E: Nonlinear Device Modeling II WE3F*: 50th Anniversary of MTT-S WE4A: RF Power Amplifiers for Wireless Applications WE4B: New Technologies for Communications Systems WE4C: New Periodic Structures and Effects WE4D: CAD Techniques Using Computational Intelligence WE4E: Applications of Time Domain Methods Industry-hosted Cocktail Reception 6 to 7:30 PM Sheraton Awards Banquet 7:30 to 10 PM Sheraton 50th Anniversary Special Interactive Forum Registration 7 AM to 3 PM IMS Exhibition and µAPS 9 AM to 3 PM Friday, June 7, 2002 Thursday, June 6, 2002 IF-TH: INTERACTIVE FORUM 1:30 TO 4:30 PM TH1A: Flip-chip Techniques and Novel Application of Organic Materials in Packaging TH1B: Low Noise Devices and Applications TH1C: Synthesis and Multi-mode Techniques TH1D: Ferroelectric, Ferrite and Acoustic Components TH1E*: High-speed/ Non-contacting Electrical Probing TH1F: Spatial Power Combining and Quasi-optical Techniques TH2A: Packaging TH2B*: THz Technology and Applications TH2C: Novel Filter Structures TH2D: High Efficiency Amplifier Techniques TH2E: Microwave Measurements I PTH: Making Sense or Cents: Which WLAN Technology will Survive? Student Awards Banquet Sheraton TH3A: Advanced V-band Transceiver Technology TH4A: W-band Transceiver Components and Applications TH3B: Biological Effects and Medical Applications TH3C: Waveguide and Planar Filter Structures TH3D*: Wide Bandgap Devices and Their Application in High Power TH3E: Microwave Measurements II TH4B: Frequency Domain Techniques TH4C: Active, Periodic and Planar Filters TH4D*: Optical Processing of Antenna Signals TH4E: Superconducting Components and Technology TH2F: Microwave Photonics Workshop Registration 7 AM to 9 AM ARFTG Conference and Exhibition 7:30 AM to 5 PM – WSCTC WFA: Cryogenic and Superconductor Microwave Subsystems WFB: Evolution of the Photonic Antenna WFC: Optical Packaging Techniques Combining Optics and Electronics *SPECIAL SESSIONS CONTENTS (LISTED ALPHABETICALLY) Administrative Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 ARFTG Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 ARFTG Microwave Measurement Conference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Awards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Exhibition Invitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Exhibitors and Exhibition Hours . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Fellows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Future IMS Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 General Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Guest Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66 Historical Exhibit and Interactive Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Hotel Map and Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10, 68, INSIDE BACK COVER Housing Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 IEEE MTT-S Membership Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Interactive Forum Tuesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52–53 Microwave Application & Product Seminars . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56–57 MTT-S Technical Program Chairs’ Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Panel Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Plenary Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Registration Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Registration Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 RFIC Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 RFIC Symposium . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12–14 Seattle Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Sheraton Seattle Hotel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .INSIDE BACK COVER Social Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Special Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39,43,59 Special Tuesday Evening Event . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Steering Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 Student Paper Competition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Technical Program Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 Technical Sessions Tuesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26–31 Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34–41 Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44–51 Tutorials Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Sunday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Washington State Convention and Trade Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 Westin Seattle Hotel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68 Workshops Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 1 AN INVITATION TO MICROWAVE WEEK 2002 Welcome to Seattle, Washington for the 2002 International Microwave Symposium, the 50th anniversary of the Microwave Theory and Techniques Society. This year marks the first year the Symposium is held in the beautiful Pacific Northwest. A dedicated team of over 60 volunteers from Northwest industry and academia has been working together for over seven years to put together this year’s symposium. We are proud to present Microwave Week 2002. Microwave Week is the highlight of the year for our industry. It is a time to present breakthrough research or make new product announceDonn Harvey ments, a time to learn about a new technology or find the missing piece to a design problem, a time to make contact with industry experts, a time for user groups, workshops, side meetings, social events and friends. It’s a full week with something for everyone and more than can be absorbed by most. The week includes the IMS technical program, panel sessions, plenary session, workshops, tutorials, the RFIC Symposium and the ARFTG conference. Plenty of social events and a full guest program round out the week. Enjoy your stay, learn something and have fun. Donn Harvey General Chairman 2002 International Microwave Symposium IMS TECHNICAL PROGRAM This year’s Tutorials offer a new way to help MTT newcomers come up to speed on microwave or RF topics. There are three tutorials on Sunday to introduce basic concepts, tools and technologies for those not working in these areas. These tutorials will help attendees to understand papers presented later in Microwave Week. 2002 is the 50th anniversary of the Microwave Theory and Techniques Society. One of the major activities the Society has undertaken for this celebratory year is a special issue of the Transactions that reviews the progress of microwave technology over the past 50 years. Charts and excerpts Ed Godshalk from these transactions papers, with additional photographs and historical hardware, will augment the historical exhibit in the Convention Center lobby. In addition, some of the authors of these transactions articles will be on hand for a special Interactive Forum on Wednesday afternoon. Microwave Week is also a great place to see old acquaintances and network with RF and microwave experts from around the world. We are looking forward to a great Symposium and a great celebration of 50 Years of Microwaves, and we’re looking forward to seeing you in Seattle. Eric Strid, Chair Ed Godshalk, Vice-Chair IMS 2002 Technical Program The 2002 IMS Technical Program Committee has organized an exciting program that spans the breadth of topics in the MTT Society, with contributed paper sessions and workshops at state-of-the-art depth as well as tutorials targeting newcomers to microwaves and RF. This year 886 papers were submitted to IMS, of which 491 were accepted either for talks or for presentations at Interactive Forums. The quality and quantity of the submitted papers reflects the continuing rapid pace of RF and microwave developments at the theoretical and practical level. About 57% of the presented papers are from outside North Eric Strid America, which is a good representation of the growing microwave activity around the world. This year’s student paper competition draws from over 200 papers submitted by students. Student paper finalists will be recognized and awards will be presented at the student paper awards banquet on Thursday. To accommodate all of the accepted papers, there are six parallel sessions arranged to minimize conflicts with similar topic areas. This year there are 27 full-day or half-day workshops on a wide range of microwave and RF topics. These will be held before IMS on Sunday, Monday, and after IMS on Friday. These workshops provide a great way to get an update on a specific topic. In addition to workshops, there will be a panel session each day on Tuesday, Wednesday and Thursday at lunchtime, and six special sessions on targeted topics throughout these three days. 2 RFIC SYMPOSIUM On behalf of the Technical Program Committee, welcome to the 2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. The RFIC Symposium is one of the foremost IEEE technical conferences dedicated to the latest innovations in RFIC development for wireless and wire-line communication systems. The RFIC Symposium will begin on Sunday with workshops that address various topics on RF technology, design, and system issues. On Sunday there will also be several Tutorial sessions that are intended to be in the form of an educational forum. The Plenary Session will start off the conference Natalino Camilleri on Monday with a focus on wireless systems, the future of cellular communications, and RFIC design. Following the Plenary Session, the regular technical program will start with four parallel sessions. A Panel Session during lunch will allow interactive discussions on the merits of using RF-CMOS in Cell-Phones. The Panelist, representing various industries and academia will address their views on the future of high performance RF-CMOS for mobile handsets. The RFIC symposium will conclude on Tuesday with several Joint sessions with IMS, which also includes an interactive forum. The goal of the technical committee has been to enhance the quality of the technical program. During Monday and Tuesday the RFIC Symposium will have 18 sessions, together with 16 invited papers. I would like take the opportunity to thank the authors and the technical program committee members for an exciting program. On behalf of the Steering Committee, we are look forward to seeing you in Seattle. Natalino Camilleri RFIC Technical Program Committee Chairman 2002 IEEE RFIC Symposium 59TH ARFTG MICROWAVE MEASUREMENT CONFERENCE Welcome to the 59th Automatic RF Techniques Group (ARFTG) Conference being held at the Washington State Convention and Trade Center on Friday, June 7, 2002. The conference will include technical presentations, an interactive forum and an exhibition. The result is a great opportunity to meet and interact with many experts in the RF and microwave test community. The conference theme is “Test, Measurement and Characterization of High-Speed Digital Components and Systems.” The demand for high data rates and broad-bandwidth wireless and fiber Ed Godshalk networks has resulted in high speed digital circuits with clock rates up to 40 GHz and beyond. Developing these products has led to remarkable challenges and opportunities as engineers are forced to meet both digital and microwave demands simultaneously. Presentations will discuss test, measurement and characterization issues in both the time and frequency domain plus related topics such as packaging solutions, circuit model extraction and interconnect characterization. In addition, papers concerning traditional ARFTG topics such as noise measurements, nonlinear characterization, S-parameter network analysis, calibration and on-wafer measurements will be included. A popular and well-noted aspect of ARFTG conferences is the opportunity to meet one-on-one with experts, colleagues and vendors in the RF and microwave test and measurement community. You will have ample opportunity to meet with other attendees and presenters at the continental breakfast and breaks in the exhibition area, interactive forum sessions and the luncheon. It is a great opportunity to discuss your ideas and questions concerning metrology, S-parameters, nonlinear measurements, etc. with some of the leaders in the measurement community. Attendees often find that these interactions are their best source of ideas and information for their current projects. The atmosphere is informal and friendly so please come and join us. There will also be a joint IMS/ARFTG session on Thursday, June 6, titled “High-Speed/Non-Contacting Electrical Probing” with particular emphasis on instrumentation and calibration techniques for testing 40 Gb/s digital circuitry associated with high-speed optical links, and noncontact probing for testing dense digital integrated circuits. Ed Godshalk Conference Chair EXHIBITION The exhibition that is part of Microwave Week gives you the opportunity to visit displays from more than 450 companies that will be showing the latest products and services available to our industry. A number of new companies will be exhibiting this year in addition to the traditional exhibitors. In addition, the Microwave Application and Product Seminars (µAPS), which are in their seventh year, will be held near the show floor. These seminars are always well received and have been improved and expanded for this year’s meeting. The exhibition is open from 9:00 AM to 5:00 on Tuesday and Wednesday and from 9:00 AM to 3 PM on Thursday. I hope you will take advantage of this unique chance to visit the largest group of microwave exhibitors at any show in the world. Harlan Howe, Jr. Exhibition Manager PM 3 PLENARY SESSION All Microwave Week registrants and guests are invited to attend the IMS 2002 Plenary Session, which will begin at 8:00 AM on Tuesday, June 4, in the Washington State Convention and Trade Center sixth floor ballroom. Welcoming remarks will be given by Symposium Chairman Donn Harvey, and by MTT-S President John Barr, followed by an overview of the technical program by TPC Chairman Eric Strid. The Class of 2002 IEEE Fellows will be recognized. Mr. Juha Christensen, corporate vice president, Mobility Group of Microsoft, will preMarc A. Sweet sent the keynote address Marc A. Sweet, Vice Chairman IMS 2002 Steering Committee and also oversees companywide mobility solutions and scenario planning. Before joining Microsoft, Christensen co-founded Symbian Ltd., a joint venture between Nokia Oyj, Telefonaktiebolaget LM Ericsson, Motorola Inc., Matsushita Communication Industrial Co. and Psion Plc. During his time at Symbian, Christensen wrote the company’s first business plan — which had a large impact on the company’s overall strategy and vision — and led the core team responsible for bringing together joint venture partners. While at Symbian, Christensen was a board member and executive vice president Juha Christensen in charge of product management, marketing, sales, business development, evangelism and supplier relationships. He also had overall responsibility for the company’s operations in North America and Asia. Previously, Christensen was vice president of licensing at Psion, in charge of the commercialization of Psion’s intellectual properties. During his six years at Psion, Christensen held positions in marketing, sales, product management and product design. Before joining Psion, Christensen held general management and product design positions in networking, communications and operating system software companies. Juha Christensen Corporate Vice President, Mobility Group, Microsoft As corporate vice president of the Mobility Group at Microsoft Corp., Juha Christensen is responsible for managing strategic partnerships, business development and product marketing for Microsoft’s mobility solutions. Products overseen by Christensen include Pocket PC, Microsoft(r) Mobile Explorer microbrowser and Microsoft’s smart phone platform. He heads Microsoft’s participation in a variety of worldwide wireless standards bodies SPECIAL SESSIONS ✗ Radio Frequency Integrated Circuits for 3G Terminals and Base Stations ✗ High-Speed/Non-Contacting Electrical Probing ✗ THz Technology and Applications ✗ Wide Bandgap Devices and Their Application in High Power and Low Noise Circuits ✗ Optical Processing of Antenna Signals ✗ 50th Anniversary of the MTT The IMS2002 technical program committee has organized six sessions and a special interactive forum in diverse areas of special interest to many attendees of the Symposium. All papers in these special sessions were solicited and invited by the session organizers, and then reviewed and accepted by the technical program committee. Detailed descriptions of the special sessions and interactive forum can be found on pages 39, 43 and 59. NOTES 4 TUTORIALS (FOR A MORE DETAILED DESCRIPTION OF ANY OF THE EVENTS ON THIS PAGE, VISIT WWW.IMS2002.ORG) Sunday TSA 8:00 AM–5:00 PM RF Fundamentals Sunday TSB 8:00 AM–5:00 PM MEMS Technology for Highly Integrated RF Systems Sunday TSC 8:00 AM–5:00 PM EM Simulators – Theory and Practice WSA 8:00 AM–5:00 PM Developments in Integrated Circuits for Communications at 40 Gb/s and Beyond WSB 8:00 AM–5:00 PM Highly Integrated Packaging Techniques for Microwave and mm-wave Packaging for Broadband Applications WSC 8:00 AM–5:00 PM Direct Conversion Transceivers for Cellular and Wireless Applications WSD 8:00 AM–5:00 PM RF and High Speed Flip-chip Technology and Design WSE 8:00 AM–5:00 PM Advances in Bluetooth Technology WSF 8:00 AM–12:00 PM Wireless Systems on a Chip WSG 8:00 AM–12:00 PM GHz and THz Solid State Device Simulation WSH 1:00 PM–5:00 PM RF Solutions for GPS-to-handset Applications WSI 1:00 PM–5:00 PM Intelligent RF Front-ends WMA 8:00 AM–5:00 PM Automotive Radar and Prospective Circuit/Antenna Technologies — From Car Collision Avoidance to Autonomous Driving WMB 8:00 AM–5:00 PM Microwave Component Design Using Space Mapping Methodologies WMC 8:00 AM–5:00 PM Ultrahigh Speed Microwave and Photonic Devices and Systems: How Will They Be Tested? WMD 8:00 AM–5:00 PM Wide Bandgap Technologies: Applications, Devices and Circuit Issues WME 8:00 AM–5:00 PM Advances in Ceramic Interconnect Technologies for Wireless, Microwave and Photonic Applications WMF 8:00 AM–5:00 PM Introducing New Concepts in Nonlinear Network Design WMG 8:00 AM–5:00 PM EM-based CAD and Optimization of Waveguide Components, Planar Circuits and Antennas WMH 8:00 AM–12:00 PM Passive Components for RF Applications WMI 8:00 AM–12:00 PM Spectrum Management Issues WMJ 8:00 AM–12:00 PM Advances in RF MEMS Technology WMK 8:00 AM–12:00 PM Microwave Photonics for Medical Imaging WML 1:00 PM–5:00 PM Wireless Microsensors: Technology and Applications WMM 1:00 PM–5:00 PM Microwave and Lightwave System Architectures, Signal Processing, Limitations and Noise WMN 1:00 PM–5:00 PM Modeling of RF MEMS Switches WMO 1:00 PM–5:00 PM Differential Device Characterization and Modeling WFA 8:00 AM–5:00 PM Cryogenic and Superconductor Microwave Subsystems WFB 8:00 AM–12:00 PM Evolution of the Photonic Antenna WFC 8:00 AM–12:00 PM Optical Packaging Techniques Combining Optics and Electronics Friday June 7 Monday June 3 Sunday June 2 WORKSHOPS MTT-S PANEL SESSIONS In addition to the workshops and special sessions, the 2002 Symposium will feature four lunchtime (12:00 to 1:15 PM) panel sessions at the Washington State Convention and Trade Center. These panel sessions provide attendees with opportunities to hear lively dialog and differing views from a panel of experts on subjects of current interest, while at the same time allowing a high level of audience interaction. The following topics will be discussed: PANEL SESSIONS Monday, June 3 • RF CMOS in Cell Phones: Fact or Fiction Tuesday, June 4 • Is the Single Chip Radio Dead? Wednesday, June 5 • RF MEMS: Revolution or Evolution Thursday, June 6 • Making Sense or Cents: Which WLAN Technology will Survive? 5 Detailed descriptions of all four panel sessions can be found on page 33. Participation in the panel sessions requires separate registration; please use the registration form on page 7. Registration for panel sessions includes a box lunch. 2002 IEEE MICROWAVE THEORY AND TECHNIQUES SOCIETY MEMBERSHIP APPLICATION (Current and reinstating IEEE members joining MTTS complete areas 1, 2, 8, 9.) Mail to: IEEE OPERATIONS CENTER, Admission & Advancement Dept., 445 Hoes Lane, P.O. Box 459, Piscataway, New Jersey 08855-0459 USA or Fax to: (732) 981-0225 (credit card payments only) For info. call (732) 981-0060 or 1 (800) 678-IEEE or E-mail: [email protected] 1. NAME AS IT SHOULD APPEAR ON IEEE MAILINGS: SEND MAIL TO: ■ Home Address OR ■ Business/School Address If not indicated, mail will be sent to home address. NOTE: Enter your name as you wish it to appear on membership card and all correspondence. PLEASE PRINT Do not exceed 40 characters or spaces per line. Abbreviate as needed. Please circle your last/surname as a key identifier for the IEEE database. TITLE FIRST OR GIVEN NAME MIDDLE NAME SURNAME/LAST NAME HOME ADDRESS STATE/PROVINCE CITY POSTAL CODE 2. COUNTRY 8. Are you now or were you ever a member of IEEE? ■ Yes ■ No If yes, please provide, if known: MEMBERSHIP NUMBER Grade 3. Year Membership Expired BUSINESS/PROFESSIONAL INFORMATION Company Name Department/Division Title/Position ■ PE $14.00 ■ MTT CD-ROM Collection Includes T-MTT, MGW-L, Digests of International Microwave Symposium and RFIC Symposium (Included in membership fee) Country Selected Publications of MTT and ED Societies T-MTT, MGW-L, ED-L, T-ED EDUCATION A baccalaureate degree from an IEEE recognized educational Mo./Yr. Degree Received Microwave and Guided Wave Letters Transactions on: Applied Superconductivity Microwave Theory and Techniques Journal of Lightwave Technology, IEEE/OSA Program/Course of Study *IEEE membership required or request *Affiliate application to join MTT Society only. A. Baccalaureate Degree Received Program/Course of Study College/University State/Province Campus Country B. Highest Technical Degree Received College/University State/Province Country (Included in membership fee) $118.00 ■ $14.00 ■ $118.00 ■ $19.00 ■ $113.00 ■ $17.00 ■ $135.00 ■ $18.00 ■ Amount Paid $ __________ METHODS OF PAYMENT: • Credit Card – American Express, Visa, MasterCard, Diners Club, Eurocard • Check • Bank Drafts • Money Orders Campus Mo./Yr. Degree Received Payable on a U.S. Bank SIGNATURE OF APPLICANT • UNESCO Coupons I hereby make application for IEEE membership and agree to be governed by IEEE’s Constitution, Bylaws, Statements of Policies and Procedures and Code of Ethics. Full Signature of Applicant 6. $66.00 ■ $62.00 ■ $66.50 ■ $56.00 ■ $52.50 ■ $53.00 ■ (Society Magazine included with fee) (Pay $40.00 once for “permanent” MTT-S membership for as long as IEEE membership remains current) $40.00 ■ program assures assignment of “Member” grade. For others, additional information and references may be necessary for grade assignment. 5. $132.00 ■ $124.00 ■ $133.00 ■ $112.00 ■ $105.00 ■ $106.00 ■ Microwave Theory and Techniques Society Membership Fee* $118.00 ■ State/Province Postal Code 4. 11 Mar. 2002 15 Aug. 2002 Pay Half Year** 2002 MTT-S MEMBER RATES State/Province Street Address City 16 Aug. 2001 28 Feb. 2002 Pay Full Year **IEEE Canadian Business No. 125634188 **If application is to be received by IEEE after 16 August pay full year. Subscription to Spectrum ($16.00/year) and The Institute are included in dues. Years in Current Position Years in the Profession Since Graduation 2002 IEEE MEMBER RATES Check (✓) a box IEEE DUES Residence United States Canada (includes GST)* Canada (includes HST)* Africa, Europe, Middle East Latin America Asia, Pacific 9. 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Each conference attendee must attendee submit a separate registration form. A copy of this form may be Aused. copy of thisfor form mayregistration be used. The deadline advanced is May via 15, 2000. Deadline advance via fax or mail isfor April 26, 2002.registration Registration deadline Afterwards, feeson-site applyfees andapply willand be will approximately 30% higher. Website is May 3, 2002.on-site Afterwards, be approximately 30% higher. NAME Last First AFFILIATION Company, Etc. Mail Stop ADDRESS Street City State/Prov. Postal Code Country e-mail Address US/CANADA TEL. INT'L TEL. IEEE MEMBER ■ Yes ■ No MTT-S MEMBER ■ Yes ■ No IEEE Membership No.* *Must be given to qualify for member discount ARFTG MEMBER ■ Yes ■ No Name of Guest For a complimentary badge for plenary session and exhibits To register, check ■ ✓ the appropriate boxes and enter corresponding fees in the Remittance column. ONLY PAID ATTENDEES WILL BE ADMITTED TO THE WORKSHOPS AND TECHNICAL SESSIONS. INTERNATIONAL MICROWAVE SYMPOSIUM (Tue., Wed. & Thur.) (INCLUDES EXHIBITS AND µAPS) IEEE NonMember Member All IMS Sessions (Includes IMS CD ROM, no Digest.) ■ $265 ■ $405 ■ $320 ■ $460 All IMS Sessions (Includes IMS CD ROM and Digest.) ■ $140 ■ $200 Single-Day Registration WORKSHOPS AND TUTORIALS For paid attendees only. (SEE BACK OF THIS PAGE FOR TITLES.) Student/Retiree/ IEEE Member Non-member Life Member Remittance Full Day Half Day $ _____________ $ _____________ $ _____________ SUNDAY ■ WSA ■ WSB ■ WSC ■ WSD ■ WSE ■ WSF ■ WSG ■ WSH ■ WSI (Includes IMS CD ROM, no Digest.) ■ $145 ■ $160 $ _____________ ■ $150 (INCLUDES EXHIBITS, LUNCH, RFIC RECEPTION AND RFIC DIGEST.) ■ $250 RFIC Reception Only ■ $200 $ _____________ ■ $455 $ _____________ Student, Retiree, Life Member (Includes IMS CD ROM, no Digest.) RFIC SYMPOSIUM (Mon. & Tue.) ARFTG – MICROWAVE MEASUREMENT CONFERENCE (Thur., Fri.) (INCLUDES EXHIBITS, BREAKFAST, LUNCH, ARFTG MEMBERSHIP, DIGEST AND ARFTG EXHIBITION.) ARFTG Registration ■ $175** ■ $225 ARFTG Student, Retiree ■ $185** ■ $110 **ARFTG MEMBERS USE IEEE MEMBER PRICE ADDITIONAL DIGESTS AND $110 $175 (Full Day) (Full Day) (Full Day) (Full Day) (Full Day) (Morning) (Morning) (Afternoon) (Afternoon) $____ $____ $____ $____ $____ $____ $____ $____ $____ $ _____________ $ _____________ CD ROMS (FOR PICKUP ON-SITE ONLY. SEPARATE DIGESTS AND CD ROMS WILL BE AVAILABLE AFTER THE SYMPOSIUM FROM THE IEEE.) IMS Digest Qty. ___ @ ■ $175 ■ $100 $ _____________ ■ $125 ■ $135 $ _____________ IMS CD ROM Qty. ___ @ RFIC Digest Qty. ___ @ ■ $140 ■ $155 $ _____________ ■ $125** ■ $145 $ _____________ ARFTG Digest Qty. ___ @ ARFTG Microwave Measurement Conference Digest Compilation CD ROM 1982–2001 Qty. ___ @ ■ $150** ■ $165 MONDAY ■ WMA ■ WMB ■ WMC ■ WMD ■ WME ■ WMF ■ WMG ■ WMH ■ WMI ■ WMJ ■ WMK ■ WML ■ WMM ■ WMN ■ WMO $85 $60 (Full Day) (Full Day) (Full Day) (Full Day) (Full Day) (Full Day) (Full Day) (Morning) (Morning) (Morning) (Morning) (Afternoon) (Afternoon) (Afternoon) (Afternoon) TUTORIALS (SEE BACK OF THIS PAGE FOR TITLES.) SUNDAY ■ TSA (Full Day) $____ ■ TSB (Full Day) $____ $____ $____ $____ $____ $____ $____ $____ $____ $____ $____ $____ $____ $____ $____ FRIDAY ■ WFA ■ WFB ■ WFC (Full Day) (Morning) (Morning) $____ $____ $____ WORKSHOPS $ ________ TOTAL $____ ■ TSC (Full Day) $____ TUTORIAL TOTAL $ ________ Full-day workshops and Tutorials include continental breakfast, lunch and afternoon refreshments. Morning workshops include continental breakfast and lunch. Afternoon workshops include lunch and afternoon refreshments. Registration includes Workshop CD ROM. Workshop presenters’ notes will be available at the workshop. $ _____________ **ARFTG MEMBERS USE IEEE MEMBER PRICE PANEL SESSIONS (INCLUDES BOX LUNCH. SEE REVERSE SIDE FOR SCHEDULE.) PM: RF CMOS in Cell Phones: Fact or Fiction ■ PT: Is the Single Chip Radio Dead? ■ PW: RF MEMS: Revolution or Evolution ■ PTH:Making Sense or Cents: Which WLAN Technology will Survive? ■ $145 $100 GUEST PROGRAMS $15 $15 $15 $15 GSA: GSB: GMB: GMC: GTD: GTE: GWF: GWG: GTHH: GTHI: GFJ: GFK: $ _____________ $ _____________ $ _____________ $ _____________ AWARDS BANQUET (WEDNESDAY EVENING) SHERATON HOTEL Qty. ___@ ■ $40 $ _____________ SOCIAL EVENT (TUESDAY EVENING) TILLICUM VILLAGE Qty. ___@ ■ $48 $ _____________ Golf Tournament Victoria Day Trip (unescorted) Mt. Rainier Tour Seattle Highlights w/Lunch Northwest Winery/Brewery Tour Snoqualmie Falls/Train Ride Boeing Everett Plant Tour Museum Tour w/Lunch Harbor Cruise w/Lunch Boeing Everett Plant Tour Victoria Overnight (escorted) Victoria Day Trip (unescorted) Qty. Qty. Qty. Qty. Qty. Qty. Qty. Qty. Qty. Qty. Qty. Qty. GUEST The only acceptable forms of payment are check, money order, MasterCard, VISA or American Express. Make your check or money order (US $ ONLY on a US Bank or Traveler’s Check) payable to: IEEE/MTT-S ■ MasterCard ■ VISA ■ American Express Card # Signature __________________________________________ ___ @ ■ $105 ___ @ ■ $115 ___ @ ■ $187 ___ @ ■ $168 ___ @ ■ $133 ___ @ ■ $163 ___ @ ■ $140 ___ @ ■ $158 ___ @ ■ $185 ___ @ ■ $140 ___ @ ■ $285 ___ @ ■ $115 PROGRAM TOTAL $________ $________ $________ $________ $________ $________ $________ $________ $________ $________ $________ $________ $________ TOTAL REMITTANCE $ _________________ INDIVIDUAL PAYMENT MUST ACCOMPANY FORM Exp. Date Written requests for refunds will be honored if received by April 27, 2002. A $25 cancellation fee will be charged for processing. (Signature must accompany credit card payment) MAIL COMPLETED FORM AND PAYMENT TO: MTT-S Registration, 685 Canton Street, Norwood, MA 02062 For information or handicap special needs only (phone registration is not available) (781) 769-9750. PLEASE FAX (781) 769-5037 OR MAIL; DO NOT FORWARD HARD COPY IF FAXED REGISTRATION IS AVAILABLE ONLINE AT WWW.MTT-SREGISTRATION.COM By providing your e-mail address you are granting IEEE MTT-S permission to contact you regarding your registration, as well as other products and services of IEEE MTT-S and/or selected outside industry organizations. Please indicate those you do NOT wish to contact you: ■ IEEE MTT-S ■ Selected outside industry organizations 7 TUTORIALS Sunday Sunday Sunday (FOR A MORE DETAILED DESCRIPTION OF ANY OF THE EVENTS ON THIS PAGE, VISIT WWW.IMS2002.ORG) TSA 8:00 AM–5:00 PM RF Fundamentals TSB 8:00 AM–5:00 PM MEMS Technology for Highly Integrated RF Systems TSC 8:00 AM–5:00 PM EM Simulators – Theory and Practice WSA WSB WSC WSD WSE WSF WSG WSH WSI WMA 8:00 AM–5:00 PM 8:00 AM–5:00 PM 8:00 AM–5:00 PM 8:00 AM–5:00 PM 8:00 AM–5:00 PM 8:00 AM–12:00 PM 8:00 AM–12:00 PM 1:00 PM–5:00 PM 1:00 PM–5:00 PM 8:00 AM–5:00 PM WMB WMC WMD WME WMF WMG WMH WMI WMJ WMK WML WMM WMN WMO WFA WFB WFC 8:00 AM–5:00 PM 8:00 AM–5:00 PM 8:00 AM–5:00 PM 8:00 AM–5:00 PM 8:00 AM–5:00 PM 8:00 AM–5:00 PM 8:00 AM–12:00 PM 8:00 AM–12:00 PM 8:00 AM–12:00 PM 8:00 AM–12:00 PM 1:00 PM–5:00 PM 1:00 PM–5:00 PM 1:00 PM–5:00 PM 1:00 PM–5:00 PM 8:00 AM–5:00 PM 8:00 AM–12:00 PM 8:00 AM–12:00 PM Developments in Integrated Circuits for Communications at 40 Gb/s and Beyond Highly Integrated Packaging Techniques for Microwave and mm-wave Packaging for Broadband Applications Direct Conversion Transceivers for Cellular and Wireless Applications RF and High Speed Flip-chip Technology and Design Advances in Bluetooth Technology Wireless Systems on a Chip GHz and THz Solid State Device Simulation RF Solutions for GPS-to-handset Applications Intelligent RF Front-ends Automotive Radar and Prospective Circuit/Antenna Technologies — From Car Collision Avoidance to Autonomous Driving Microwave Component Design Using Space Mapping Methodologies Ultrahigh Speed Microwave and Photonic Devices and Systems: How Will They Be Tested? Wide Bandgap Technologies: Applications, Devices and Circuit Issues Advances in Ceramic Interconnect Technologies for Wireless, Microwave and Photonic Applications Introducing New Concepts in Nonlinear Network Design EM-based CAD and Optimization of Waveguide Components, Planar Circuits and Antennas Passive Components for RF Applications Spectrum Management Issues Advances in RF MEMS Technology Microwave Photonics for Medical Imaging Wireless Microsensors: Technology and Applications Microwave and Lightwave System Architectures, Signal Processing, Limitations and Noise Modeling of RF MEMS Switches Differential Device Characterization and Modeling Cryogenic and Superconductor Microwave Subsystems Evolution of the Photonic Antenna Optical Packaging Techniques Combining Optics and Electronics Monday Tuesday Wednesday Thursday PM PT PW PTH 12:00 PM–1:15 PM 12:00 PM–1:15 PM 12:00 PM–1:15 PM 12:00 PM–1:15 PM Friday June 7 Monday June 3 Sunday June 2 WORKSHOPS PANEL SESSIONS Tuesday Wednesday Thursday 9:00 AM–5:00 PM 9:00 AM–5:00 PM 9:00 AM–3:00 PM Sunday Monday Tuesday Wednesday Wednesday Thursday 7:00 PM –9:00 PM 6:00 PM–8:00 PM 5:30 PM–10:30 PM 6:00 PM–7:30 PM 7:30 PM–10:00 PM 12:00 PM–1:30 PM RF CMOS in Cell Phones: Fact or Fiction Is the Single Chip Radio Dead? RF MEMS: Revolution or Evolution Making Sense or Cents: Which WLAN Technology will Survive? µAPS SOCIAL EVENTS RFIC Reception Microwave Journal Reception Tillicum Village Industry Reception Awards Banquet Student Awards Banquet GUEST PROGRAMS Saturday Sunday Monday Monday Tuesday Tuesday Wednesday Wednesday Thursday Thursday Friday Friday GSA GSB GMB GMC GTD GTE GWF GWG GTHH GTHI GFJ GFK 3:00 PM 7:30 AM–8:00 PM 8:00 AM–6:00 PM 9:00 AM–2:00 PM 12:30 PM–4:30 PM 9:00 AM–3:00 PM 8:30 AM–12:00 PM 9:00 AM–2:00 PM 9:30 AM–1:30 PM 12:30 PM–4:00 PM 6:30 AM–10:00 PM 7:30 AM–8:00 PM Golf Tournament Victoria Day Trip (unescorted) Mt. Rainier Tour Seattle City Highlights with Lunch at the Space Needle Northwest Winery and Brewery Tour Snoqualmie Falls, Steam Engine Train and Hedges Winery Tour Boeing Everett Plant Tour Seattle’s Museum Tour with Lunch in Pike Place market Cruise the Locks and Seattle Harbor Tour with Lunch at Harborside Restaurant Boeing Everett Plan t Tour Victoria Overnight (Friday AM to Saturday PM) (escorted) Victoria Day Trip (unescorted) 8 CONFERENCE HOUSING 2002 IEEE MTT-S INT’L MICROWAVE SYMPOSIUM JUNE 2–7, 2002 MTT-S • ATTENDEE use code MTTSATT502 SEATTLE, WA • ARFTG • RFIC Reservations may be made on-line, by phone, fax or mail and must be received by the Housing Bureau between January 2, 2002 and May 2, 2002. Changes and cancellations should be made through the Housing Bureau until May 16, 2002 using one of these methods. ON-LINE PHONE www.ims2002.org Code: MTTSATT502 9 AM–8 PM EST Mon–Fri 888-877-0255 206-461-5881 FAX MAIL 206-461-5853 MTT-S Housing Bureau 520 Pike Street, Suite 1300 Seattle, WA 98101 INSTRUCTIONS AND HOUSING BUREAU POLICY 1. Please print or type all data requested. 5. The deposit amount is $200. Checks should be made out to the MTT-S Housing Bureau. Hotels 2. An acknowledgment confirming the reservation will be sent after each reservation booking, may charge credit card deposits after May 2, 2002. Cards must be valid through June 2002. modification or cancellation. If you do not receive an acknowledgment via e-mail, fax or 6. Changes and cancellations should be made through the MTT-S Housing Bureau until May mail within 14 days after any transaction, contact the Housing Bureau at 888-877-0255 or 16, 2002. Cancellations made on or after May 2, 2002 will be assessed a $25 processing fee. 206-461-5881. You will not receive a confirmation from the hotel. Cancelled reservations that are guaranteed with a check will be assessed a $25 processing fee 3. All rates are per room per night and are subject to 15.6% tax (subject to change). regardless of when they are cancelled. After May 16, 2002 additional hotel cancellation 4. Request room and bedding and indicate special requests in the section provided on the form. policies may apply. Specific room types will be assigned at check in. Please be advised that requests 7. Changes after May 16, 2002 must be made with your hotel. are not guaranteed. Requests for blocks of rooms without named occupants must be accompanied by this completed form and faxed to Susan Ranney at the MTT-S Housing Bureau, 206-461-5853, by April 11, 2002. She may be reached directly by phone at 206-461-5894 or by e-mail at [email protected]. LISTED CONVENTION RATES ARE AVAILABLE ONLY FOR RESERVATIONS MADE BY MAY 2, 2002 HOTEL PREFERENCE Hotel locations and rates are shown on the reverse side of this form. Please show three choices. First choice ________________________________ Second choice________________________________________ Third choice _________________________________________ If hotel choices are unavailable, which is most important: Rate ______ or Location ______ (please select one) Name First Last e-mail Company Address City _______________________________________________________ Country ____________________Daytime Phone ( Deposit paid by: State/Province ____________ZIP/Postal Code _____________________________________ ) ______________________________________or FAX ( ) ________________________________________ w/Int’l Country Code ■ Check or Money Order (Payable to: MTT-S Housing Bureau) ■ MasterCard ■ Visa ■ American Express ■ _________________________ Other CARDHOLDER NAME (printed) CARDHOLDER SIGNATURE *REQUIRED CARD NO. ___________________________________________ EXP. DATE (Must be later than 6-30-2002) _____________________________________ ROOM OCCUPANTS 1. Print or type names of persons occupying each room. If more than three rooms are required, attach a list providing the information requested below for each additional room. 2. Select room type desired, indicate arrival and departure dates, and special requests (not guaranteed). Occupants (first name first) ROOM NO. 1 ROOM NO. 2 ROOM NO. 3 Check one: ■ Single ■ Double (1 bed) ■ Dbl/Dbl (2 dbl beds) Arr. Date: ____________________ Dep. Date: ____________________ Requests: ■ Smoking ■ Non-Smoking ■ Wheelchair Accessible ■ King 1. 2. Check one: ■ Single ■ Double (1 bed) ■ Dbl/Dbl (2 dbl beds) Arr. Date: ____________________ Dep. Date: ____________________ Requests: ■ Smoking ■ Non-Smoking ■ Wheelchair Accessible ■ King 1. 2. Check one: ■ Single ■ Double (1 bed) ■ Dbl/Dbl (2 dbl beds) Arr. Date: ____________________ Dep. Date: ____________________ Requests: ■ Smoking ■ Non-Smoking ■ Wheelchair Accessible ■ King 1. 2. 9 HOTEL INFORMATION Courtesy of Seattle Convention and Visitors Bureau 2002 IMS CONFERENCE HOTELS LISTED CONVENTION RATES ARE AVAILABLE ONLY FOR RESERVATIONS MADE BY MAY 2, 2002 MAP NO. HOTEL SINGLE/DOUBLE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Sheraton Seattle Hotel Westin Seattle Hotel Elliott Grand Hyatt W. Seattle Hotel The Warwick Hotel WestCoast Grand Hilton Seattle Hotel The Paramount Hotel The Claremont Hotel Summerfield Suites Crowne Plaza Seattle Renaissance Madison Hotel Mayflower Park Hotel The Roosevelt Hotel Washington Athletic Club $189 $199 $225 $189/209 $185 $170 $171 $169/179 $159 $159 $158 $157 $155 $143 $140 CHECK WITH THE HOUSING BUREAU FOR TRIPLE OR QUADRUPLE OCCUPANCY RATES. 10 REGISTRATION REQUIREMENTS ON-SITE REGISTRATION FEES Registration fees are required of all participants, including session chairs, authors, and workshop and panel session organizers and speakers. IEEE NonMember Member Int’l Microwave Symposium ADVANCE REGISTRATION All IMS Sessions Reduced rates are offered for advanced registration when received by April 27, 2002. A registration form is available on page 7 of this program. Each registrant must submit a separate form, with payment, to the address shown at the bottom of the registration form. If using a credit card, then fax and online registration is available. When mailing, please mail early to ensure receipt by the deadline; otherwise, on-site fees will apply. Individual remittance must accompany the registration form and is payable in US dollars only using personal check drawn on a US bank, traveler’s check, international money order or credit card (MasterCard, VISA or American Express). Personal checks must be encoded at the bottom with the bank number, account number and check number. Bank drafts, wire transfers and cash are unacceptable and will be returned. Government or company purchase orders will not be accepted and will be returned. (Includes IMS CD ROM and Digest.) All IMS Sessions $415 $600 $345 $530 $180 $260 $60 $80 $195 $65 $230 $260 $70 $300 (Includes IMS CD ROM, no Digest.) Single Day (Includes IMS CD ROM, no Digest.) Student, Retiree, Life Member (Includes IMS CD ROM, no Digest.) RFIC Symposium RFIC Reception Only ARFTG Conference (Thur. & Fri)** (Includes exhibits, Breakfast, Lunch, ARFTG Membership, Digest and ARFTG Exhibition) ARFTG Student/Retiree $110 $110 Additional Digests and CD ROMs (on-site pickup only) IMS Digest $100 IMS CD ROM $35 RFIC Digest $50 ARFTG Digest** $35 ARFTG Microwave Measurement Conf. Digest Compilation** $65 GUEST REGISTRATION To preregister your guest, include his or her name on your registration form. Guest badges will be included in the envelope that you will receive upon check-in. On-site guest registration also will be available. $130 $45 $70 $60 $85 STUDENTS, RETIREES AND LIFE MEMBERS Panel Session $20 $20 Students, retirees and IEEE Life Members receive a substantial discount on the IMS registration fee. Digests are not included. To qualify as a student, a registrant must be either a student member of IEEE or a full-time student carrying a course load of at least nine credit hours. ARFTG also provides discounts for students and retirees. Awards Banquet (Wed. Evening) $50 $50 Exhibits Only $20 $20 Guest Programs (See page 66 for complete information.) GSA: GSB: GMB: GMC: GTD: GTE: GWF: GWG: GTHH: GTHI: GFJ: GFK: PRESS REGISTRATION Credentialed press representatives are welcome to register onsite only at the Exhibitor Counter, without cost and thereby have access to technical sessions and exhibits. Digest are not included. ON-SITE REGISTRATION On-site registration for all Microwave Week events will be available at the Washington State Convention and Trade Center. Registration hours are: Saturday, June 1 2:00 PM–6:00 PM Sunday, June 2 7:00 AM–6:00 PM Monday, June 3 7:00 AM–5:00 PM Tuesday, June 4 7:00 AM–5:00 PM Wednesday, June 5 7:00 AM–5:00 PM Thursday, June 6 7:00 AM–3:00 PM Friday, June 7 7:00 AM–9:00 AM Golf Tournament Victoria Day Trip (unescorted) Mt. Rainier Tour Seattle Highlights w/Lunch Northwest Winery/Brewery Tour Snoqualmie Falls/Train Ride Boeing Everett Plant Tour Museum Tour w/Lunch Harbor Cruise w/Lunch Boeing Everett Plant Tour Victoria Overnight (escorted) Victoria Day Trip (unescorted) $105 $115 $187 $168 $133 $163 $140 $158 $185 $140 $285 $115 Workshops IEEE Member NonMember Student/Retiree Life Member Full Day Half Day $145 $100 $190 $130 $110 $185 **ARFTG MEMBERS USE IEEE MEMBER PRICE REFUND POLICY ON-SITE WORKSHOP REGISTRATION Refund requests received by April 27, 2002 will be honored, but will be subject to a $25 service charge. For requests postmarked after this date, preregistrants will, in lieu of a refund, be mailed any digests due. This policy applies to registrations for guest programs and the awards banquet as well. Please state the preregistrant’s name and provide a mailing address for the refund check. If the registration was paid by credit card, reimbursement will be through an account credit. Address your requests to: MTT-S Registration, 685 Canton St., Norwood, MA 02062. On-site registration on Saturday and Sunday is available to everyone. On-site registration for Friday’s workshops will be available from 7:00 to 9:00 AM on Friday for those who have not previously registered. ON-SITE ARFTG REGISTRATION Late on-site ARFTG registration will be available at the Washington State Convention and Trade Center on Friday from 7:00 to 9:00 AM. If at all possible, please preregister earlier in the week to reduce the on-site workload. 11 Message from the RFIC General Chairman 2002 RFIC TECHNICAL PROGRAM Welcome to the 2002 IEEE Radio Frequency Integrated Circuit (RFIC) Symposium, being held in Seattle, Washington at the Convention Center on June 2–4, 2002. The RFIC Symposium is the leading IEEE conference dedicated to the advancement of integrated circuits technologies for RF, wireless, wireline, and broadband communications systems. The Symposium opens on Sunday, June 2 with workshops on RF circuits and architectures. On Sunday evening, there will be a RFIC social hour and reception from 7–9 PM. The technical program continues on Monday and Tuesday June 3–4, with technical sessions. The Technical Program Committee under the chairmanship of Dr. Natalino Camilleri has selected over 60 papers and several special sessions for presentation during 18 technical sessions and an interactive forum. Sayfe Kiaei The committee has also selected 16 invited papers covering topics such as Multi-Band Transceiver Design, 3rd Generation and Wideband CDMA transceivers, RF power amplifiers, frequency generation, next generation front-end design, RF IC packaging, RF IC passive components and high frequency device modeling. Monday will include a lunchtime panel discussion on the topic of “RF-CMOS in Cell Phones: Fact or Fiction” with expert panelists from industry and academia. The technical program is complemented by social activities to relax, meet peers, make new friends and have informal technical discussions. The opportunity to meet informally with colleagues has proven to be an important part of past RFIC symposia. The RFIC social program includes the traditional reception held on Sunday evening, as well as the Microwave Journal Reception on Monday evening. On Tuesday, the RFIC Symposium attendees will also be able to attend the Plenary Session of the MTT-S Symposium and visit over 850 exhibit booths displaying a wide variety of RF and microwave products and services. Once again, on behalf of the Steering Committee, we welcome you to the 2002 IEEE RFIC Symposium in Seattle. Sayfe Kiaei General Chairman, 2002 IEEE RFIC Symposium MO2A Cellular Transceivers — Room 6B Chair: S. Lloyd, Conexant Systems Inc. • Co-chair: J.P. Mondal, Motorola 10:10 AM MO2A-1: Invited: Direct Conversion Transceiver Design for Mobile Phone Systems – Issues, Status and Trends Fazal Ali, Nokia Mobile Phones 10:30 AM MO2A-2: RF Local Oscillator Path for GSM Direct Conversion Transceiver with True 50% Duty Cycle Divide by Three and Active Third Harmonic Cancellation R. Magoon, A. Molnar, Conexant Systems Inc. 10:50 AM MO2A-3: W-CDMA SiGe TX-IC with High Dynamic Range and High Power Control Accuracy H. Joba, Y. Takahashi, Y. Matsunami, K. Itoh, Mobile Communication Business Div., Mitsubishi Electric Corp.; S. Shinjo, N. Suematsu, D.S. Malhi, D. Wang, K. Schelkle, P. Bacon 11:10 AM MO2A-4: A Direct-conversion W-CDMA Front-end SiGe Receiver Chip D.Y.C. Lie, J. Kennedy, D. Livezey, B. Yang, T. Robinson, N. Sornin, T. Beukema, L.E. Larson, A. Senior, C. Saint, J. Blonski, N. Swanberg, P. Pawlowski, D. Gonya, X. Yuan, H. Zamat, N. Sornin, IBM LaGaude Design Center, LaGaude, France 11:30 AM MO2A-5: Invited: Highly Integrated, Dual Band/Tri-mode SiGe Bi-CMOS Transmitter IC for CDMA Mobile Phone Applications M. Reddy, Conexant Systems, MO2B Efficiency Enhancement Techniques for Handset Applications — Room 6A Chair: T. Quach, Motorola Inc. • Co-chair: D. Ngo, RFMD 10:10 AM MO2B-1: Invited: Efficiency Improvement Techniques for Linear CDMA and WCDMA Power Amplifiers T. Fowler, Conexant Systems 10:30 AM MO2B-2: Invited: An Overview of Efficiency Enhancements with Applications to Linear Handset Power Amplifiers J. Staudinger, Motorola 10:50 AM MO2B-3: Invited: Switched-mode Tuned High-efficiency Power Amplifiers: Historical Aspect and Future Prospect A. Grebennikov, M/A-COM Eurotec Operations 11:10 AM MO2B-4: A Broadband Monolithic S-band Class-E Power Amplifier R. Tayrani, Raytheon Electronic Systems 11:30 AM MO2B-5: Paper Withdrawn MO2C Integrated VCO — Rooms 602/03/04 Chair: J. Lin, Agere Systems • Co-chair: N. Camilleri, RF & Wireless Design Service 10:10 AM MO2C-1: Invited: 1/F Noise of NMOS and PMOS Transistors and Their Implications to Design of Voltage Controlled Oscillators K. O, Univ. of Florida 10:30 AM MO2C-2: Student Paper: A 900 MHz Low Phase Noise CMOS Quadrature Oscillator J. Cabanillas, J.M. Lûpez-Villegas, Dept. d’Electrúnica (SIC), Univ. of Barcelona, Barcelona, Spain; L. Dussopt, G.M. Rebeiz, EECS Dept., The Univ. of Michigan, Ann Arbor, Michigan 10:50 AM MO2C-3: A 0.18 µm CMOS 2.45 GHz Low-power Quadrature VCO with 15 Percent Tuning Range D.M.W. Leenaerts, C. Dijkmans, Philips Research Labs; M. Thompson, S3, Dublin, Ireland 11:10 AM MO2C-4: A 1.8 V 6–9 GHz Switchable Dual-band Quadrature LC VCO in SiGe BiCMOS Technology H.Shin, Z.Xu, M.F. Chang, Univ. of California, Los Angeles 11:30 AM MO2C-5: Student Paper: A 1 V 3.8-5.7 GHz Differentially-tuned VCO in SOI CMOS N. Fong, C. Plett, G. Tarr, Dept. of Electronics, Carleton Univ.; J-O. Plouchart, D. Liu, IBM T.J. Watson Research Center; N. Zamdmer, L. Wagner, IBM Microelectronics Semiconductor Research and Development Center MO2D Optical System ICs — Room 606/07 Chair: K. Kobayashi, Sirenza Microdevices • Co-chair: J. Ou, Intel 10:10 AM MO2D-1: Invited: Design of High-speed Fiber-optic Datalinks T. Mader, Intel 10:40 AM MO2D-2: A 37–50 GHz InP HBT VCO IC for OC-768 Fiber Optic Communication Applications L. Zhang, R. Pullela, C. Winczewski, J. Chow, Gtran Inc., Newbury Park; D. Mensa, S. Jaganathan, R. Yu 10:50 AM MO2D-3: Student Paper: Amplifier Array for 12 Parallel 10 Gb/S Optical-fiber Links Fabricated in a SiGe Production Technology A. Schild, H.-M. Rein, J. Mullrich, L. Altenhain, Ruhr-Univ. Bochum, Bochum, Germany; J. Blank, K. Schrodinger, Infineon Technologies AG, Fiber Optics, Berlin, Germany 11:10 AM MO2D-4: Front-end CMOS Chipset for 10 Gb/s Communication A.K. Petersen, K. Kiziloglu, T. Yoon, F. Williams, M.R. Sandor, Intel Corp. 11:30 AM MO2D-5: Application of Quasi-static Method of Moments for the Design of OC-192 and OC-768 Fiber Optic Integrated Circuits C-W.P. Huang, J-W. Bao, N. Dwarakanath, S. Al-Kuran, Anadigics Inc., Warren, New Jersey MO3A Wireless Data System ICs — Room 6B Chair: W.B. Kuhn, Kansas State Univ. • Co-chair: A. Jerng, DSP Group 1:20 PM MO3A-1: Invited: CMOS Components for 802.11b Wireless LAN Applications K. O, Univ. of Florida 1:40 PM MO3A-2: Student Paper: A 3V, 0.35 µm CMOS Bluetooth Receiver IC W. Sheng, B. Xia, A. Emira, C. Xin, A.Y. Valero-Lopez, S.T. Moon, E. Sanchez-Sinencio, Analog & Mixed Signal Center, Dept. EE, Texas A&M Univ. 2:00 PM MO3A-3: Integrated CMOS Transceivers Using Single-conversion Standard IF or Low IF RX for Digital Narrowband Cordless Systems A. Jerng, A. Truong, D. Wolday, E. Unruh, E. Landi, L. Wong, R. Fried, S. Gibbons, DSP Group 2:20 PM MO3A-4: A Highly Integrated, Versatile GPS Receiver for E911 Applications L.J. Wilz, T.J. Shie, J.P. Young, Conexant Systems Inc.; T. Hancock, Univ. of Michigan EE Dept. RFIC STEERING COMMITTEE Sayfe Kiaei, General Chair Natalino Camilleri, TPC Chair Kirk Ashby, Finance Luciano Boglione, Publicity Stephen Lloyd, Transactions Eric Maass, Special Sessions Tina Quach, Secretary Joe Staudinger, Digest Takao Inoue, Web Master Advisory Board Fazal Ali Eliot Cohen Reynold Kagiwada Christian Kermarrec Mahesh Kumar Louis Liu David Lovelace Vijay Nair RFIC TECHNICAL PROGRAM COMMITTEE Luciano Boglione, Agilent Technologies Kirk Ashby, Microtune Natalino Camilleri, RF & Wireless Design Services Glen Chang, Silicon Wave Thomas Cho, Wireless Interface Technologies Yann Deval, Laboratoire IXL Sherif Embabi, TI Fazal Ali, Nokia Mobile Phones Aditya Gupta, Anadigics Stefan Heinen, Infineon Technologies Albert Jerng, DSP Group Reynold Kagiwada, TRW Andrew Karanicolas, Maxim Sayfe Kiaei, Arizona State University Kevin Kobayashi, Stanford Microdevices Mahesh Kumar, Lockheed Martin Bill Kuhn, Kansas State University Jenshan Lin, Agere Louis Liu, TRW Stephen Lloyd, Conexant Systems David Lovelace, Gain Technology Jyoti Mondal, Motorola Patrick Murphy, University College Vijay Nair, Motorola David Ngo, RFMD Dan Nobbe, Peregrine Semiconductor Jeffrey Ou, Intel Allen Podell, Besser Assoc. Tina Quach, Motorola Eli Reese, Triquint Joe Staudinger, Motorola Noriharu Suematsu, Mitsubishi Electric Corp. Bruce Thompson, Motorola Alan Westwick, Silicon Laboratories Bernard Xavier, National 12 2002 RFIC TECHNICAL PROGRAM 2:40 PM 3:50 PM MO3A-5: A SiGe Transceiver Chipset for 100 Mbps/1 bps Digital Communication Over Cable System A. Alexanian, M. Wu, A. Burgess, W. Ye, X. Zhang, Narad Networks Inc. MO3B LNAs, Mixers and Switches — Room 6A Chair: Y. Deval, IXL • Co-chair: D. Nobbe, Peregrine Semiconductor 1:20 PM MO3B-1: Student Paper: Automatic Synthesis of a 2.1 GHz SiGe Low Noise Amplifier G. Zhang, L.R. Carley, Carnegie Mellon Univ. Electrical & Computer Engineering Dept.; A. Dengi, Neolinear Inc. 1:40 PM MO3B-2: Highly Linear SiGe BiCMOS LNA and Mixer for Cellular CDMA/Amps Applications V. Aparin, E. Zeisel, P. Gazzerro, QUALCOMM Inc. 2:00 PM MO3B-3: An Even Harmonic Type Direct Conversion SiGe-MMIC Receiver for W-CDMA Mobile Terminal E. Taniguchi, M. Shimozawa, N. Suematsu, T. Takagi, O. Ishida, Information Technology R&D Center, Mitsubishi Electric Corp.; T. Ikushima, K. Sadahiro, T. Katsura, K. Maeda, K. Itoh, Mobile Communication Business Div., Mitsubishi Electric Corp. 2:20 PM MO3B-4: A 2.6 V GSM/PCN Dual Band Variable Gain Low Noise RF Down Conversion Mixer B. Kim, K-S. Nah, T-W. Ahn, H-I. Lee, J-K. Cho, B-H. Par, RF Products Team, Samsung Electronics Co. Ltd. 2:40 PM MO3B-5: A +2.4/0 V Controlled High Power GaAs SPDT Antenna Switch IC for GSM Application K. Numata, Y. Takahashi, T. Maeda, H. Hida, Photonic and Wireless Device Research Lab, NEC Corp. MO3C High Frequency Receiver and Converter Technology — Room 602/03/04 Chair: M. Kumar, Lockheed Martin • Co-chair: E. Reese, TriQuint Semiconductor 1:20 PM MO3C-1: A 2–18 GHz Wideband High Dynamic Range Receiver MMIC D.C. Bannister, C.A. Zelley, A.R. Barnes, QinetiQ Ltd, UK 1:40 PM MO3C-2: A 3–33 GHz PHEMT MMIC Distributed Drain Mixer K-L. Den, H. Wang, Graduate Institute of Communication Engineering, National Taiwan Univ. 2:00 PM MO3C-3: Student Paper: Ka-band Direct Digital Receiver Using 0.25 µm GaAs pHEMTs S.O. Tatu, E. Moldovan, Centre de Recherches Avancees en Micro-ondes et en Electronique Spatiale (Poly-Grames) Departament de genie Electrique, Ecole Polytechnique de Montreal CAN; G. Brehm, Tri; K. Wu, R.G. Bosisio 2:20 PM MO3C-4: A Single-chip 24 GHz Receiver Front-end Using a Commercially Available SiGe HBT Foundry Process E. Soenmez, A. Trasser, K.-B. Schad, P. Abele, H. Schumacher, Univ. of Ulm, Dept. of Electron Devices and Circuits MO3D PLL and Frequency Synthesizer — Room 606/07 Chair: J. Lin, Agere Systems • Co-chair: N. Camilleri, RF & Wireless Design Serv 1:20 PM MO3D-1: Low Power, High Speed PLL Fabricated in UTSI Process G.C. Wu, D. Kelly, Peregrine Semiconductor Corp., San Diego, CA 1:40 PM MO3D-2: Student Paper: A 2V, 2.3/4.6 GHz Dual-band CMOS Frequency Synthesizer W-Z. Chen, J-X. Chang, Y-J. Hong, M-T. Wong, C-L. Kuo, Dept. of Electrical Engineering, National Central Univ. 2:00 PM MO3D-3: Student Paper: A Low Jitter 5.3-GHz 0.18-µm CMOS PLL Based Frequency Synthesizer S.A. Ali, PhD Student, F. Jain, Univ. of Connecticut, Dept. of Electrical and Computer Engineering, Storrs, CT 2:20 PM MO3D-4: Student Paper: Design Considerations in a BiCMOS Dual-modulus Prescaler F. Dulger, E. Sanchez-Sinencio, Texas A&M Univ. Dept. of Electrical Engineering; A. Bellaouar, Texas Instruments Inc. 2:40 PM MO3D-5: Student Paper: Time Delay Considerations in High-frequency Phase-locked Loops R. A. York, Univ. of California, Santa Barbara ECE Dept. MO4A 3G Cellular Systems & Chip Sets — Room 6B Chair: F. Ali, Nokia Mobile Phones • Co-chair: J. Mondal, Motorola 3:30 PM MO4A-1: Invited: The MSM5100 CDMA2000 + Amps + Gpsone + Bluetooth Multimode ASCI For 3G Handsets Brian Butler, QUALCOMM CDMA Technologies 3:50 PM MO4A-2: A Reconfigurable Receiver Architecture for 3G Mobiles B.J. Minnis, P.A. Moore, Philips Research Labs 4:10 PM MO4A-3: A Highly Integrated 0.25 µm BiCMOS Chipset For 3G UMTS/WCDMA Handset RF Subsystem D. Brunel, C. Caron, C. Cordier, E. Soudée, Philips Semiconductors 4:30 PM MO4A-4: A CMOS Transmit/Receive IF Chip-set for WCDMA Mobiles U. Dasgupta, W.G. Yeoh, C.G. Tan, S.J. Wong, R. Singh, Institute of Microelectronics, Singapore; H. Mori, Oki Electric Industry, Japan; M. Itoh, Oki Techno Centre, Singapore 4:50 PM MO4A-5: Invited: 4G RF Systems On-chip or On-module? D. Belot, ST Microelectronics MO4B Low Noise Amplifiers — Room 6A Chair: D. Nobbe, Peregrine Semiconductor • Co-chair: Y. Deval, IXL 3:30 PM MO4B-1: Student Paper: Gain Controllable Very Low Voltage (< 1 V) 8–9 GHz Integrated CMOS LNAs T.K.K. Tsang, M.N. El-Gamal, Microelectronics and Computer Systems Lab, McGill Univ. MO4B-2: Step Gain Amplifier with Impedance Unchanged in Gain Control M. Tanabe, T. Fukuda, K. Nishii, Semiconductor Devices Research Center, Corporate Manufacturing & Development Div., Semiconductor Co., Matsushita Electric Ind. Co. Ltd. 4:10 PM MO4B-3: Enhancement Mode pHEMT Low Noise Amplifier with LNA Linearity Control (IP3) And Mitigated Bypass Switch S. Kumar, M. Vice, H. Morkner, L. Wayne, Agilent Technologies, WSD R&D 4:30 PM MO4B-4: Student Paper: Low Noise, High Linearity, Wide Bandwidth Amplifier Using a 0.35 µm SiGe BiCMOS For WLAN Applications. J.Sadowy, LAAS CNRS 7, Av du Colonel Roche, France and STMicroelectronics, Cedex France; V.Le-Goascoz, I.Telliez, STMicroelectronic; J.Graffeuil, E.Tournier, L. Escotte, R. Plana 4:50 PM MO4B-5: A 5.8 GHz Two-stage High-linearity Low-voltage Low Noise Amplifier in A 0.35-µm CMOS Technology R-C. Liu, C-R. Lee, H. Wang, C-K. Wang, Dept. of EE, National Taiwan Univ. MO4C Very High Speed Si and SiGe Divider ICs — Room 602/03/04 Chair: E. Reese, TriQuint Semiconductor • Co-chair: M. Kumar, Lockheed Martin 3:30 PM MO4C-1: A 14.5 GHz – 0.35 µm Frequency Divider for Dual-modulus Prescaler E. Tournier, J. Graffeuil, LAAS/CNRS and Univ; P. Sabatier, Cedex 4, France; M. Sié, LAAS/CNRS and ST Microelectronics, Cedex, France 3:50 PM MO4C-2: A 19 GHz High Sensitivity Static 2:1 Frequency Divider in 120 Nm CMOS H.-D. Wohlmuth, D. Kehrer, W. Simbuerger, INFINEON Technologies AG, CPR HF 4:10 PM MO4C-3: A Low-power 20 GHz Static Frequency Divider with Programmable Input Sensitivity M. Apostolidou, Philips Research Laboratories 4:30 PM MO4C-4: 36 GHz Dual-modulus Prescaler In SiGe Bipolar Technology H. Knapp, M. Wurzer, G. Ritzberger, Infineon Technologies, Corporate Research; J. Boeck, T.F. Meister, K. Aufinger, Infineon Technologies, Wireless Products MO4D Power Amplifiers for Handset Applications — Room 606/07 Chair: T. Quach, Motorola Inc. • Co-chair: N. Suematsu, Mitsubishi Electronic Corp. 3:30 PM MO4D-1: A GSM/Edge Dual-mode, 900/1800/1900 MHz Triple-band HBT MMIC Power Amplifier Module K. Yamamoto, RFIP Group, System LSI Dev. Ctr., Mitsubishi Electric Corp.; T. Asada, S. Suzuki, T. Miura, A. Inoue, S. Miyakuni, J. Otsuji, R. Hattori, Y. Miyazaki, T. Shimura, High Frequency 3:50 PM MO4D-2: A 20 mA Quiescent Current CV/CC Parallel Operation HBT Power Amplifier for W-CDMA Terminals S. Shinjo, K. Mori, H. Ueda, T. Takagi, N. Suematsu, Mitsubishi Electric Corp. Information Technology R&D Center; A. Ohta, H. Seki, Mitsubishi Electric Corp. High Freq. & Opt. Semiconductor Business Div. 4:10 PM MO4D-3: Paper Withdrawn 4:30 PM MO4D-4: Student Paper: A New Active “Predistortor with High Gain Using Cascode-FET Structures” M.S. Jeon, J. Kim, Y. Kwon, School of Electrical Engineering, Seoul National Univ., Seoul, Korea; H. Kang, S. Jung, J. Lee, WAVICS Co., Ltd., Telson Venture B/D, 949-3, Dogok-dong, Seoul, 135-270, Korea 4:50 PM MO4D-5: Integrated Distributed Amplifier with Passive-free Input Driver B. Stengel, Motorola Inc., Motorola Labs; B. Thompson, Motorola Inc., Wireless Integration Technology Center TU2A Special Session on Radio Frequency Integrated Circuits for 3G — Room 608/09 Joint RFIC/IMS Session Chair: R. Weigel, Univ. of Linz, Austria • Co-chair: C.C.W. Ruppel, EPCOS AG 10:10 AM TU2A-1: Invited: Integrated Even Harmonic Type Direct Conversion Receiver for W-CDMA Mobile Terminals K. Itoh, T. Yamaguchi, T. Katsura, K. Sadahiro, T. Ikushima, R. Hayashi, F. Ishizu, Mobile Communication Business Division, Mitsubishi Electric Corp., E. Taniguchi, T. Nishino, M. Shimozawa 10:40 AM TU2A-2: Invited: An Analog Baseband Chain for a UMTs Zero-IF Receiver in a 75 GHz SiGe BiCMOs Technology W. Schelmbauer, J.K. University of Linz; H. Pretl, DICE Linz; L. Maurer, INIT Linz; B. Adler, J. Fenk, Infineon Munich; R. Weigel, INIT Linz, DICE Linz; R. Hagelauer, RIIC Linz, DICE Linz 11:10 AM TU2A-3: Invited: A 2 GHz RF Front-end Transceiver Chipset in CMOS Technology For PCS and IMT-2000 Applications Y-S. Youn, N-S. Kim, J-H. Chang, H-K. Yu, J-K. Kwon, K-S. Kim, Electronics and Telecommunications Research Institute (ETRI) 11:30 AM TU2A-4: Invited: System Analysis of a W-CDMA Base-station PA Employing Adaptive Digital Predistortion C. Potter, Wireless & Multimedia Design Group, Tality UK Ltd TU2B MMIC Technology — Room 606/07 Joint RFIC/IMS Session Chair: A. Madjar, Rafael • Co-chair: T. Lee, Boeing Satellite System 10:10 AM TU2B-1: Paper Withdrawn 10:30 AM TU2B-2: Ku-band MMICs in Low-cost, SMT Compatible Packages H.C. Huang, A. Ezzeddine, A. Darwish, B. Hsu, AMCOM Communication Inc. 10:50 AM TU2B-3: ESD Protection of RF Circuits in Standard CMOS Process K. Higashi, A. O. Adan, M. Fukumi, M. Hayashi, Design Technology Dev. Center, IC Dev. Group, Sharp Corp.; N. Tanba, T. Yoshimasu, Analog IC Div., IC Group, Sharp Corp. 11:10 AM TU2B-4: Novel BICMOS Compatible, Short Channel LDMOS Technology for Medium Voltage RF and Power Applications A. Litwin, Ericsson Microelectronic; O. Bengtsson, Swedish Linear Microwave; J. Olsson, Uppsala Univ. 13 2002 RFIC TECHNICAL PROGRAM 11:20 AM TU2B-5: Electromagnetic Coupling Effects in RF-CMOS Circuits A.O. Adan, M. Fukumi, K. Higashi, M. Hayashi, IC Development Group, Sharp Corp.; T. Suyama, M. Miyamoto, Advanced Research Labs., Sharp Corp. 11:30 AM TU2B-6: Ultra Low Power VCO Based on InP-HEMT and Heterojunction Interband Tunnel Diode for Wireless Application A. Cidronali, G. Collodi, M. Camprini, G. Manes, Dept. Electronics and Telecommunications, Univ. of Florence; V. Nair, J. Lewis, H. Goronkin, PSRL, Motorola Labs. TU3A Silicon Substrate and Inductor Modeling — Room 608/09 Joint RFIC/IMS Session Chair: A. Gupta, Anadigics • Co-chair: A. Westwick, Silicon Laboratories 1:20 PM TU3A-1: Invited: Modeling of Passive Elements with Asitic A. Niknejad, UC Berkeley 1:40 PM TU3A-2: Modeling of Frequency Dependent Losses in Two-port and Three-port Inductors on Silicon T. Kamgaing, T. Myers, Mel Miller, Motorola Inc., Semiconductor Product Sector, Tempe, AZ 2:00 PM TU3A-3: Characterization and Modeling of On-chip Inductor Substrate Coupling Effect C-J. Chao, M-J. Chen, Institute of Electronics Engineering, National Chiao-Tung Univ., Taiwan, ROC; S-C. Wong, Acer Labs Inc., Taipei, Taiwan, ROC; C-J. Hsu, L-Y. Leu, Winbond 2:20 PM TU3A-4: Characterization and Modeling of Small-signal Substrate Resistance Effect In RF CMOS Y-S. Lin, T-H. Lee, H-B. Liang, National Chi-Nan Univ. Electrical Engineering Dept.; S-S. Lu, National Taiwan Univ. Electrical Engineering Dept. 2:40 PM TU3A-5: A New Method for the Computation of the Substrate Parasitics of Octagonal Inductors W. Tatinian, Modeling Ingeneer Alcatel Microelectronics, PhD Student L2MP; P. Pannier, Maitre de Conferences, Ecole Polytechnique Universitaire de Marseille; R. Gillon, Competence Leader Modeling and Characterisation Alcatel Microele TU3B SiGe RFIC Process Technologies — Room 606/07 Joint RFIC/IMS Session Chair: K. Ashby, Microtune Inc. • Co-chair: B. Xavier, National Semiconductor 1:20 PM TU3B-1: Invited: Review of SiGe BiCMOS Process Technology and Its Impact on RFIC Design null, Motorola 1:40 PM TU3B-2: Invited: High Performance Circuits in 0.18 µm SiGe BiCMOS Process for Wireless Applications P. Ye, Conexant Systems 2:00 PM TU3B-3: Student Paper: Low Frequency Noise Figures of Merit in RF SiGe HBT Technology J. Tang, G.F. Niu, Z. Jin, J.D. Cressler, S. Zhang, Auburn Univ. Electrical and Computer Engineering Dept.; A.J. Joseph, D.L. Harame, IBM Microelectronics 2:20 PM TU3B-4: Com2 Enhanced Graded Base SiGe Technology for High Speed Applications T. Ivanov, M. Carroll, S. Moinian, M. Mastrapasqua, M. Frei, A. Chen, C. King, A. Hamad, E. Martin, S. Shive, T. Esry, C. Lee, R. Johnson, T. Sorsch, M. S. Carroll, K. Banoo, P. Smith, L. Bizzarro, W. Cochran, Agere Systems, Murray 2:40 PM TU3B-5: Advanced Passive Devices for Enhanced Integrated RF Circuit Performance D. Coolbaugh, E. Eshun, D. Harame, J. Johnson, M. Hammad, Z. He, V. Ramachandran, S. St Onge, K. Watson, IBM Corp, Essex Junction, VT; R. Groves, K. Stein, S. Subbanna, R. Volant, IBM Corp, Hopewell; D. Wang, X. Wang TU4A Active Device Modeling and Characterization — Room 608/09 Joint RFIC/IMS Session Chair: J. Staudinger, Motorola • Co-chair: P. Murphy, Univ. College Cork 3:30 PM TU4A-1: Invited: Robust High Voltage SiLDMOS Model Extraction Process to Achieve First Pass Linear RFIC Amplifier Designs J. Pla, Motorola 3:50 PM TU4A-2: Student Paper: Large-signal Modeling of GaN FET and Nonlinearity Analysis Using Volterra Series S.S. Islam, A.F.M. Anwar, Univ. of Connecticut, Dept. of Electrical and Computer Engineering 4:10 PM TU4A-3: Direct Parameter Extraction on RF-CMOS F.X. Pengg, CSEM Swiss Center for Electronics and Microtechnology Inc. 4:30 PM TU4A-4: Student Paper: Low Frequency Noise Characterization and Modeling of Microwave Bipolar Devices: Application to the Design of Low Phase Noise Oscillator L. Bary, G. Cibiel, J. Rayssac, A. Rennane, O. Llopis, R. Plana, J. Graffeuil, Laboratory for Analysis and Architecture of Systems, Toulouse, France; M. Regis, SiGe Semiconductor, Ottawa, Ontario CAN; M. Borgarino, Univ. of 4:50 PM TU4A-5: Linearity Analysis of CMOS for RF Application S. Kan, B. Cho, B. Kim, Pohang Univ. of Science and Technology Electronic and Electrical Engineering Dept. TU4B RFIC Power Amplifier Technologies — Room 606/07 Joint RFIC/IMS Session Chair: B. Xavier, National Semiconductor • Co-chair: K. Ashby, Microtune Inc. 3:30 PM TU4B-1: Invited: RF Power Semiconductor Devices for Portable Communications C. Weitzel, Motorola, MS EL720 3:50 PM TU4B-2: SiGe/Si Power HBTS for X- to K-band Applications S. Mohammadi, Z. Ma, J. Park, P. Bhattacharya, L.P.B. Katehi, Univ. of Michigan, EECS Dept.; G.E. Ponchak, S.A. Alterovitz, NASA Glen Research Center; K.M. Strohm, J-F. Luy 4:10 PM TU4B-3: RF Power Characteristics of SiGe Heterojunction Bipolar Transistor with High Breakdown Voltage Structures T. Matsuno, Semiconductor Device Research Center, Semiconductor Co., Matsushita Electric Industrial Co., Ltd.; K. Nishii, Semiconductor Device Research Center, Sem; S. Sonetaka, Y. Toyoda, N. Iwamoto 4:30 PM TU4B-4: Design Techniques for Improved Performance of Small Outline Packages L.E. Larson, Univ. of California, San Diego; D. Jessie, Univ. of California, San Diego and QUALCOMM 4:50 PM TU4B-5: Spiral Inductor Performance in Deep-submicron, Bulk CMOS with Copper Interconnects W.B. Kuhn, A.W. Orsborn, M.C. Peterson, S.R. Kythakyapuzha, A.I. Hussein, J. Zhang, J. Li, E.A. Shumaker, N.C. Nair, Kansas State Univ., Manhattan, KS NOTES 14 These tutorials are targeted for people who are new to microwave design or new to specific technical areas. Each is a full-day format, starting with basics to help you “impedance match” into the topic and help you understand papers on these topics later in Microwave Week. 3-D structures using the extension of 2-D IC process. MEMS technology can be used to fabricate and integrate RF 3-D structures including high Q passives, tunable passives, switches, and resonators on a chip. Hence MEMS has become one of the enabling technologies for the development of lighter weight and lower cost miniature RF systems by providing low-cost batch manufacturing, miniaturization and monolithic integration with IC process. The objective of the proposed half-day short course is to give a fundamental introduction of various aspects of the MEMS technology, and its applications for RF systems and ICs. The workshop includes an overview of MEMS applications, design, prototyping, fabrication processes, monolithic integration with ICs, and packaging and reliability issues. It also covers existing and potential MEMS devices for RF applications such as high-Q self-inductors, tunable capacitors, RF switches, micro/nano micro-electro-mechanical resonators, and reconfigurable impedance matching networks. Four sessions for total time of ~7.5 hours will be conducted each by one of the four speakers. TSA: RF CIRCUIT FUNDAMENTALS Date & Time: Sunday, June 2; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center Topics & Speakers: ✗ RF Circuit Fundamentals, Les Besser, Besser Associates Organizer: Les Besser, Besser Associates You will get a quick overview of passive and active RF circuit design. We emphasize practical real-life components, circuits and design procedures. Traveling-wave based scattering (s-) parameters replace traditional voltage and current measurements in characterizing RF circuit and system components. Graphical (Smith Chart) techniques are introduced to simplify the complex algebra required for RF design. The importance of impedance matching is stressed, and simple methods are introduced to eliminate mismatch among various RF system components. We also examine the upper frequency limit of lumped equivalent circuits in modeling RF component behavior, and use distributed (transmission-line) elements for the higher microwave frequencies. Although the course focuses on discrete “unbalanced” RF components and techniques, we also present a recently developed design/measurement methodology called “mixed-mode s-parameter technique.” This topic will be helpful to those working with RFICs as well as balanced circuits and components. Since circuit layout is a critical factor in RF performance, the course concludes with layout considerations, pointing out design rules and common mistakes. We also look at various PC board materials and discuss their limitations for RF circuits. Throughout the course, we show illustrative examples via interactive video projection, using state-of-the-art CAD. TSC: EM SIMULATORS: THEORY AND PRACTICE Sunday, June 2; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center Location: Washington State Convention & Trade Center ✗ Daniel G. Swanson, Jr., Bartley R.F. Systems ✗ Wolfgang J.R. Hoefer, University of Victoria Organizers: Daniel G. Swanson, Jr., Bartley R.F. Systems Wolfgang J.R. Hoefer, University of Victoria Sponsor: MTT-15 Microwave Field Theory The proliferation of computer tools for microwave analysis, design and optimization is having a profound effect on the working environment of microwave engineers. While most practitioners can use such tools after a certain period of training, many remain skeptical as to the trustworthiness of numerical results and hesitate about the limits, errors, and significance of the data generated. The key is to understand what goes on inside these tools and how they solve electromagnetic fields. The purpose of this tutorial is a) to provide insight into the operating principles of electromagnetic simulators, and b) to show how these translate into their properties as engineering tools. The characteristics of frequency- and time domain simulators based on finite element, finite difference and method of moment formulations will be presented in terms accessible to the practitioner, and the resulting performance profiles of simulators based on these methods will be demonstrated. This includes the pre- and post-processing steps that relate geometry and material data with field information and microwave characteristics. Special emphasis will be on convergence, error control and validation using basic calibration elements. By solving a canonical set of structures whose properties are accurately known, the key aspects of the various methods and simulator types will be demonstrated. In this way, a solid foundation for user confidence and good technical judgement will be laid in a systematic manner. The tutorial will benefit a) Microwave engineers familiar with linear and non-linear CAD who would like to learn more about field solvers, b) Experienced users of electromagnetic simulators who seek a better understanding of their theoretical and computational foundations, c) Researchers familiar with computational electromagnetics who would like to learn more about the requirements, concerns and methodology of microwave practitioners. Specific commercial tools will only be mentioned or used for the purpose of providing typical examples. This in no way implies a commercial endorsement by the speakers. Topics & Speakers: ✗ MEMS Overview, Applications, Technology, John McKillop, JDS Uniphase Corp. ✗ High-Q RF MEMS Passives and RF Switches, Navid Yazdi, Arizona State University ✗ MEMS/NEMS Resonators for RFIC Applications, Sanjay Raman, Virginia Polytechnic Institute and State University ✗ Tunable Networks Using RF-MEMS Switches, N. Scott Barker, University of Virginia Organizers: Sunday, June 2; 8:00 AM to 5:00 PM Topics & Speakers: TSB: MEMS TECHNOLOGY FOR HIGHLY INTEGRATED RF SYSTEMS Date & Time: Date & Time: Navid Yazdi, Arizona State University John McKillop, JDS Uniphase Corp. Recent advances of RF integrated circuit technology have enabled higher integration, and hence the development of low-cost miniature wireless and high-speed data communication systems. However integrated circuits often require additional discrete passive components including capacitors, inductors, switches, resonators, and impedance matching networks that cannot be integrated with the conventional RFIC fabrication technology due to performance or structural limitations. These discrete devices increase the overall system component count, size, and cost significantly. For instance they occupy 25–40% of a current transceiver board area. Micromachining and micro-electro-mechanical-systems (MEMS) processes are emerging technologies that enable fabrication of 15 SUNDAY SUNDAY TUTORIALS SUNDAY SUNDAY WORKSHOPS dors are either delaying tape-outs, planning re-spins, or counting on extra “glue” chips to accommodate this ever-evolving standard. Fully integrated 40Gbps transponder modules, similar to those employed at 10 Gbit/s, will also be the focus of many companies efforts. The design of 40 Gbps ICs are being approached from two different directions. LSI analog and digital design techniques are being pushed to higher frequencies, while microwave design methods are being extended to include time-domain issues like group delay and timing skew. Field simulators are being employed to address layout and packaging issues, which will make or break 40 Gbps designs. The aim of this workshop is to review the latest architectures being considered for 40 Gbit/s transmit and receive systems, discuss the extensive IC development addressing this area, and debate the technology requirements for compact integration of these components. Due to the competitive nature of this industry, there will inevitably be some proprietary details and design tricks that the speakers cannot reveal. Nevertheless, the speakers are expected to educate and inform the audience, rather than simply market their ICs. The workshop will conclude with a panel session in which the speakers discuss future directions, including 80 and 160 Gbps, higher levels of integration, advanced packaging, and cost reduction. WSA: DEVELOPMENTS IN INTEGRATED CIRCUITS FOR COMMUNICATIONS AT 40GB/S AND BEYOND Date & Time: Sunday, June 2; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center Topics and Speakers: ✗ A service provider’s view of 40 Gbit/s, Martin Birk, AT&T Labs ✗ Integrated Circuits for 40 Gb/s Applications, Eli Reese, Triquint Semiconductor ✗ GaAs ICs for 40 Gbps Transceiver Applications, John Grebliunas, Nanowave ✗ InP AND GaAs ICs For 40 Gbps Applications, Augusto Gutierrez-Aitken, TRW Space and Electronics ✗ Development of Circuits in Indium Phosphide for Communication at 40 Gbit/s and Above, Alan Huelsman, Vitesse Semiconductor Corp. ✗ Electronics for OC-768 and Beyond: Technology, Design, Packaging and Test, Gopal Raghavan, Inphi Corp. ✗ Challenges in OC-768 Physical Layer Semiconductors, Rob Glidden, AMCC ✗ Monolithic Serializer and DeserializerI ICs for OC-768 Applications, Thomas Krawczyk, Sierra Monolithics ✗ InP HEMT Optical Communication ICs for 40 Gbit/s and beyond, Koichi Murata, NTT Photonics Laboratories ✗ How to Get a Production 40 Gb/s System, Ernst Müllner, Siemens ✗ Commercial 40 Gbps Chipsets Based on an InP HBT Technology, Raja Pullela, Gtran Organizers: Dr Steve Marsh, Marconi Optical Components Larry Kushner, PhotonEx Corp. Sponsor: MTT-6 Microwave and MM-Wave IC WSB: HIGHLY INTEGRATED PACKAGING TECHNIQUES FOR MICROWAVE AND MILLIMETER-WAVE PACKAGING FOR BROADBAND APPLICATIONS Date & Time: Sunday, June 2; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center Topics and Speakers: ✗ ✗ ✗ ✗ ✗ ✗ ✗ ✗ Despite the stock market’s gloomy view of the communications industry, all the large IC companies are pushing ahead with the development of chips for 40 Gbit/s data rate systems. This chip development covers a very broad range of technologies including CMOS, SiGe, GaAs, and InP. Indeed, many of the companies are investing in new fabrication facilities for these semiconductor processes in order to supply into this expanding application area. Work is also progressing in the development of the optimum system architecture and the integration of these chips into compact modules and transponders. At 40 Gbit/s data rates the phase response and jitter specifications are so demanding that some of the functions may be better performed in the optical domain. Indeed, this is also forcing the chip designers to combine different functions into single chips such as combining the transimpedance amplifier and the limiting amplifier, reducing the number of interconnects and their associated degradation. System partitioning — how much to place in one module or pcb and where to draw the lines becomes even more critical at 40 Gbps. It is likely that different applications, such as short-reach vs. long-haul, will require different solutions. Packaging is a critical issues at 40 Gbps, presenting a significant number of technology and design challenges. Integration density must be balanced against thermal requirements. Getting high-speed signals in and out of ICs and packages at these rates with minimal distorton and loss will require a coordinated effort between the IC, package, and pc board designers. Even the “low-speed” side of 40 Gbps MUX/DMUX ICs presents quite a challenge, as routing and skew considerations can dramatically increase the complexity of these ICs. The industry is attempting to standardize this low-speed side via the SFI-5 interface, but in many cases, IC ven- Joy Laskar, Georgia Institute of Technology Allen Linder, StratEdge Corp. Katherine J. Herrick, Raytheon RF Components Wolfgang Heinrich, Ferdinand-Braun-Institut (FBH) River Huang, HEI Jean-Rene Bois, United Monolithic Semiconductors SAS Barry R. Allen, TRW Anh-Vu Pham, Clemson University Organizers: Anh-Vu Pham, Clemson University Alan Lindner, StratEdge Corp Klaus Beilenhoff, United Monolithic Semiconductors, SAS Sponsor: MTT-12 Microwave and Millimeter Wave Packaging The emergence of broadband wireless applications such VSAT (14.5 GHz), Point to point (5–38 GHz), Point to Multi-Point (28-31 GHz), Ka band Satellite (26–31 GHz) and the High Speed Digital family (1–100 GHz) has brought new demands for low-cost, miniaturized, high-volume packages and multi-chip modules. To develop low cost, high volume systems, microwave, high-speed digital and RF MEMs devices need to be packaged in either single- or multi-chip format. As the level of integration and the operating frequency increases, coupling between components and parasitic reactance within the package play a greater role in the package design. In this full day workshop, the participants will obtain: a clear understanding of the issues involved in designing advanced broadband packages; an in depth understanding of the current manufacturing techniques that the packaging industry is currently using; an overview of advanced packaging technologies for broadband, high-speed, highly integrated systems at the package and wafer level. 16 Date & Time: Sunday, June 2; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center ✗ The Integration of Direct Conversion Transceivers for Modern Cellular Standards, Rahul Magoon and Aloysha Molnar, Conexant Systems ✗ Direct Conversion Transceiver for GSM Mobile Phone, Christian Kermarrec, Analog Devices ✗ RF Integrated Homodyne Transceivers for 3G Mobile Radio, Harald Pretl, Infineon ✗ The Even Harmonic Type Direct Conversion Receiver for WCDMA Mobile Terminals, Kenji Itoh, Mitsubishi ✗ Circuit Techniques for GSM/DCS1800 Direct Conversion Receiver, Satoshi Tanaka, Hitachi ✗ Digital Receivers for CDMA Applications, Charlie Jackson, Ditrans Corp. ✗ A Direct Conversion 802.11b Transceiver Design Based on Energy Sampling, David Sorrells and Gregory Rawlins, Direct2Data Technologies ✗ Direct Conversion Transceiver Design Techniques, Joe Heck, Motorola Washington State Convention & Trade Center Date & Time: Sunday, June 2; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center ✗ Bluetooth Applications, Thinking Out of the Box, Bob Morrow, Morrow Technical Services ✗ Bluetooth, an RF-System’s Perspective, Jack Glas, Agere Systems ✗ Bluetooth and 802.11: Can They Live Together?, Bob Morrow, Morrow Technical Services ✗ The Bluetooth Technology Evolution to Low Cost, Skip Bryan, Ericsson ✗ A Bluetooth Single Chip Solution in 0.25 µm CMOS, Steffan Heinen, Infineon ✗ Bluetooth IC Solution in CMOS, Vladimir Prodanov, Agere Systems ✗ A Bluetooth Total Solution: SOI Radio-modem with Directconversion Architecture, Glenn Chang, Siliconwave WSD: RF AND HIGH SPEED FLIP CHIP TECHNOLOGY & DESIGN Location: MTT-6 Microwave and mm-Wave IC Topics & Speakers: Direct Conversion or ZIF (Zero Intermediate Frequency) radio architectures have recently found their way into the wireless and cellular mobile communication systems. The intent of this workshop is to understand the basic operation of this architecture for various applications, semiconductor technologies used in the implementation and design techniques used to overcome the limitations. In particular, applications of direct conversion radios in Bluetooth, GSM, WCDMA, CDMA, WLAN, GPS will be covered. Speakers will also address psuedo direct conversion (i.e., low IF) techniques where ZIF is not pragmatic. Sunday, June 2; 8:00 AM to 5:00 PM Sponsor: WSE: ADVANCES IN BLUETOOTH TECHNOLOGY Dr. Fazal Ali, Nokia Mobile Phones Dr. Mike Golio, Rockwell Collins Date & Time: Vijay Nair, Motorola Inc. Mohamed Megahed, Conexant Systems Deborah Patterson, Flip Chip Technologies Flip Chip (FC) technology is experiencing a new period of explosive growth. The need for smaller size, lower cost, and better performance characteristics for high volume and high speed micro/optoelectronics products are the driven areas for this growth. The recent emergence of global flip chip infrastructure is speeding the adoption of the technology into mainstream packaging. Flip chip shows a promise to topple down wirebond technology from its seat of preeminence in certain type of applications. In addition, flip chip technology paves the way for the ultimate direct chip attach (DCA) on MCM, SIP, and printed circuits boards. This workshop will overview flip chip technology, in general. Special attention will be addressed for high frequency/high speed product applications. The history and current status of the technology will be introduced. Potential applications of the technology will be presented. Compatibility of die and package processes for FC will be discussed. RFIC circuit design considerations will be addressed. IC/Package codesign concept for FC will be explained. FC testing at the wafer and package levels will be explored. Finally, DCA applications will be presented. Topics & Speakers: Organizers: Organizers: Topics & Speakers: ✗ Key note: Flip Chip Potential and Future Road Map, Gil Olachea, Flip Chip Div. of Kulicke & Soffa (formally Flip Chip Technologies) ✗ Flip Chip Process Description and Evolution, Glenn A. Rinne, Unitive ✗ Packaging Considerations for RF and High Speed Applications, Dr. Sandra Petty, Conexant Systems ✗ Testing Challenges for FC Technology, January Kister, Kulicke & Soffa, Test Div. ✗ Update and Review of Flip Chip Process Applications, Neil Moskowitz, Prismark Partners ✗ RF Circuit Design Consideration for FC, Dr. Mohamed Megahed, Conexant Systems ✗ Design Considerations for Flip Chip Technology in High Speed Digital and High Frequency Applications, Dr. Mali Mahalingam, Motorola ✗ FC on Ceramic Substrate Technology Applications, Hassan Hashemi, Minspeed Organizers: Edward C. Niehenke, Niehenke Consulting Jenshan Lin, Bell Laboratories Allen Podell, Besser Associates Sponsors: MTT-6 Microwave and MM-Wave IC MTT-16 Microwave Systems MTT-20 Wireless Communication This workshop will first focus the system applications of Bluetooth followed by an in depth discussion of the specifications of this new technology. Next, techniques will be presented enabling Bluetooth to operate with interference with other devices in the ISM 2.4 GHz band. Various approaches will next be presented to meet the design requirements using technologies such as CMOS, BiCMOS, with integration technologies such as LTCC and flip chip, along with power-efficient chip designs and software and hardware optimized power management approaches. This workshop will conclude with a panel discussion where all the speakers will answer the attendee’s questions and will include their cost projections. 17 SUNDAY SUNDAY WORKSHOPS WSC: DIRECT CONVERSION TRANSCEIVERS FOR CELLULAR & WIRELESS APPLICATIONS SUNDAY SUNDAY WORKSHOPS WSF: WIRELESS SYSTEMS ON A CHIP Date & Time: Sunday, June 2; 8:00 AM to 12:00 PM Location: Washington State Convention & Trade Center ✗ Some Systems on Some Chips, Manfred Schindler, RFMD ✗ System on a Chip for MW/mmW Applications, J-P Lanteri, M/A-COM ✗ RFICs — To Integrate or Not, That is the Question, Robert Donahue, Hittite ✗ Benefits of SOI for Mixed Signal RF SoC ICs, Dr. Yuri Erokhin, Ibis Technology Corp. ✗ RF SOI Comes of Age, David E. Kelly, Peregrine Semiconductor Corp. ✗ Issues for Highly Integrated Radios, Dr. Kenneth O, Global Communication Devices ✗ System on a Chip at mmw-Frequencies: Automotive and Communication Frontends, Dr. Heinrich Daembkes, UMS ✗ Power Amplifiers for WLAN Integrated Chips, Peter Sahjani, Agilent ✗ WLAN System on a Chip Solutions, Dr. Sanjay Moghe, RF Solutions Lamberto Raffaelli, LNX Corp. Geoff Dawe, Global Communication Devices Sponsors: MTT-16 Microwave Systems MTT-20 Wireless Communication Location: Washington State Convention & Trade Center MTT-1 Computer-Aided Design Date & Time: Sunday, June 2; 1:00 PM to 5:00 PM Location: Washington State Convention & Trade Center Topics & Speakers: ✗ ✗ ✗ ✗ WSG: GHZ AND THZ SOLID STATE DEVICE SIMULATION Sunday, June 2; 8:00 AM to 12:00 PM Sponsor: WSH: RF SOLUTIONS FOR GPS — TO - HANDSET APPLICATIONS To reduce manufacturing cost and simplify integration, the wireless industry is rapidly moving toward highly integrated chips. A number of companies now claim to have developed an entire system on a single chip for applications such as WLAN and fixed wireless. Present industry leaders, such as RFMD, Alpha, Hittite and others, have so far mainly developed single-function chips. More innovative companies, such as Atheros, Global Communication Devices, and Intersil are moving towards system-on-a-chip solutions. This workshop will stimulate debate between the more conservative but well-established companies who have been the leaders in the wireless chip industry, and the more innovative companies who are taking the “wireless systems on a chip” approach. Date & Time: Dr. Gregory Tait, Virginia Commonwealth University Dr. Jack East, University of Michigan Global modeling of complete high-frequency circuits requires the integration of circuit, electromagnetic, and device transport simulators into a single package. While much attention is currently focused on simulating the full electromagnetic field environment, the solid-state devices present in the circuit are typically modeled using equivalent circuit elements and sources, behavioral models, or simplified carrier transport equations. As circuit operation extends into the millimeter- and submillimeter-wave regimes, appropriate device modeling is needed for the submicron-sized devices embedded in the circuit. The challenges are two-fold: (1) what large-signal, dynamic high-frequency carrier transport physics must be included in the numerical modeling, and (2) how can these more accurate models/simulations be efficiently incorporated in the field and/or circuit simulations. An overview of device modeling and nonlinear circuit simulation is presented, followed by topics in advanced carrier transport including high-frequency physics, coupled electro-thermal models, and Monte Carlo simulation. Efficient coupling schemes between physical transport, electromagnetic, and nonlinear circuit simulations are then presented. Topics include hydrodynamic and ensemble Monte Carlo device simulations coupled with full-wave electromagnetics and with time- and frequency-domain nonlinear circuit analysis techniques. Topics & Speakers: Organizers: Organizers: Tony Pratt, Parthus UK Ltd. Solon Spiegel, u-blox AG James P. Young, Conexant Hans-Joachim Golberg, Atmel GmbH Organizers: Solon Spiegel, u-blox AG Tony Pratt, Parthus UK Ltd. Hans-Joachim Golberg, Atmel GmbH Sponsors: MTT-16 Microwave Systems MTT-20 Wireless Communication The integration of global position (GPS) and wireless communication (WCS) systems into handsets has been increasingly requested for location services. The position information is transmitted over the wireless network whenever demanded. The fast acquisition of GPS signals, the weak signal detection and the interference caused by the wireless systems on the GPS become, hence, major issues. This workshop provides technical information related to integrated GPS receivers into mobile stations of wireless communication systems. The overview, the trends and the weak signal requirements of GPS-to-handsets are initially covered. Particularly, emphases are given to in-door GPS and weak signal acquisition. The RF issues and requirements for GPS-to-handset applications are then presented and the different degradation mechanisms of the signal-tonoise ratio are analysed. The SNR degradation due to the close proximity between the wireless transmitter and the GPS receiver is demonstrated. An overview of past and present RF system architectures will be presented which demonstrate how the GPS system architecture has changed to reduce cost with increasing levels of integration. The increased demands on the semiconductor technology and the technology trades including GaAs, Bipolar, CMOS and BiCMOS are described. Finally, a low current consumption and a low cost GPS RF receiver are reported with respect to the special requirements in handsets. The influence of the frequency plan, the gain distribution to power and the noise performance will be discussed. Topics & Speakers: ✗ Introduction: High-Frequency Device Simulation in Global Microwave Circuit Modeling, Dr. Gregory Tait, Virginia Commonwealth University ✗ Device-Circuit Interactions at THz Frequencies, Dr. Jack East, University of Michigan ✗ Coupled Electro-Thermal Physical Device Simulation in Global Microwave Circuit Modeling, Dr. William Batty, University of Leeds ✗ Modelling of Planar Schottky diodes for Millimeter-Wave and Submillimeter-Wave Circuit Applications, Dr. Viktor Krozer, Technical Univerisity of Chemnitz ✗ Coupled Electromagnetic-Semiconductor Device Simulation Tools for Global Modeling of High Frequency Devices and Circuits, Dr. Samir El-Ghazaly, Arizona State University ✗ Nonlinear Coupling of Electromagnetic Waves and Free Carriers in Semiconductors, Dr. Matt Grupen, Ansoft Corp. ✗ Linearity Optimization of Bipolar Transistors Using the Agilent MDS/ADS Implemented Mixed-level Simulator MAIDS, Dr. Leo de Vreede, Delft University of Technology 18 Date & Time: Sunday, June 2; 1:00 to 5:00 PM Location: Washington State Convention & Trade Center due to recent advances in many areas of microelectronics such as microelectro-mechanical systems (MEMS), mixed-signal electronics, high speed digital electronics, and heterogeneous integration techniques. The objective of this workshop is to promote the industrial and academic community to focus on this new paradigm shift to monolithic microwave integrated circuit (MMIC) technologies and to stimulate exchange of innovative ideas for realization of intelligent microsystems. This workshop will feature six invited talks followed by a group/panel discussion. The main objective is to engage the workshop participants in an open dialog and exchange technical ideas among the participants. The first speaker will be Dr. Zachary Lemnios from MIT Lincoln Laboratories, who has been active in studies of future microsystems and their role in future DoD applications. Dr. Lemnios will present the future vision of intelligent systems, emphasizing the “intellegence” or “adaptivity” aspects of the concept. His talk will stimulate the participants to think out of the box about future systems needs and capabilities. Following the introduction, leading researchers will discuss various aspects of the key technologies required to implement such intelligent systems. The topics discussed will include MEMS for RF adaptation, digital self-assessment of analog functions, and design issues for adaptive circuits. Prof. Gabriel Rebeiz of the University of Michigan, who is a leading researcher on MEMS and micromachining techniques for radar and communications applications, will discuss the topic of MEMS for RF adaptation and reconfiguration. Dr. Peter Asbeck of the University of California at San Diego, will address new architectures for power amplifiers with improved efficiency and linearity, and the assessment of analog functions. Prof. Michael Steer of North Carolina State University, who has conducted extensive research work on RF and microwave design for power and wireless applications, will address the design issues for adaptive circuits. After a review of the basic technologies for realization of intelligent systems, two industry representatives, Dr. Daniel Ko from TRW and Dr. John Wyndika from BAE Systems, will provide the industry perspectives for this technology. These two talks will cover technology challenges, component development process, and component integration to make smart systems and platforms. The status, challenges and future opportunities will be highlighted. If time permits, the presentations will be followed by a one-hour period for discussion of the technical challenges for realization of intelligent systems and innovative ideas for overcoming these problems. Topics & Speakers: ✗ The Path from Scaled Microelectronics to Intelligent Systems, Zachary J. Lemnios, MIT Lincoln Laboratory ✗ MEMS for RF Adaptation, Prof. Gabriel M. Rebeiz, University of Michigan, EECS Department ✗ Extending Analog Transistor Functionality with Digital Techniques, Prof. Peter Asbeck, University of California at San Diego ✗ Design Issues for Multifunctional Adaptive Radar, Radio and Sensor (MARRS) Systems, Prof. Michael Steer, North Carolina State University, Department of Electrical and Computer Engineering ✗ System Concepts for RF Intelligence, Dr. Daniel K. Ko, TRW ✗ Intelligent RF Front-ends for Wideband Receivers, John A. Windyka, BAE Systems Organizers: Dr. Edgar Martinez, DARPA Chun-Lim Lau, Booz Allen Hamilton Sponsors: MTT-9 Digital Signal Processing MTT-16 Microwave Systems The Defense Advanced Research Projects Agency is exploring new concepts on Intelligent Microsystems in which components will possess the ability to self-assess and self-optimize their performance in real time. This is the concept of Intelligent RF Front-end systems - highly adaptable, highly integrated RF/analog components. The ability of RF/analog components to intelligently tune or adapt in real time optimizing themselves to operational demands, and/or dynamic changes in the environment is highly desirable. Such capabilities would enable a new class of system architectures with unprecedented performance, agility, and multifunctionality, and open the door to new opportunities in RF sensing and communication. The realization of this new class of high performance, compact, and low-cost RF/analog microsystems will be possible 19 SUNDAY SUNDAY WORKSHOPS WSI: INTELLIGENT RF FRONT-ENDS MONDAY WORKSHOPS ✗ Designing LTCC Circuits Using Companion Models and SpaceMapping Techniques, Tony Pavio, Motorola ✗ Coupled Resonator Filter Realization by 3D-EM Analysis and Space Mapping, Dieter Pelz, Radio Frequency Systems ✗ EM-Based Design Through Neural Space Mapping Methods, Jose Rayas-Sanchez, ITESO University ✗ A Multi-level Design Optimization Strategy for Complex RF/Microwave Structures, S. Safavi-Naeini, University of Waterloo ✗ An Explicit Knowledge-Embedded Space Mapping Scheme for Optimization Design of LTCC RF Passive Circuits, Ke-Li Wu, The Chinese University of Hong Kong ✗ Knowledge Based Neural Network Approaches for Microwave Modeling and Design, Q.J. Zhang, Carleton University ✗ Jan-Willem Lobeek, Philips Semiconductors MONDAY WMA: AUTOMOTIVE RADAR & PROSPECTIVE CIRCUIT/ANTENNA TECHNOLOGIES? FROM CAR COLLISION AVOIDANCE TO AUTONOMOUS DRIVING Date & Time: Monday, June 3; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center Topics & Speakers: ✗ Design and Realization of a Novel, Synchronized 77 GHz Radar Network for Automotive Use, Alfred Hoess, SiemensVDO Automotive AG ✗ Advanced Radar Concepts for Automotive Applications, Arne F. Jacob, Institut fuer Hochfrequenztechnik ✗ Electrically Scanned Millimeter-Wave Radar for Automotive Applications, Yoshikazu Asano, Toyota ✗ Space Division Multiple Access (SDMA) Techniques Applied to Car Radar Sensors, Martin Schneider, BOSCH ✗ Semiconductor Solutions for Low Cost Millimeter-Wave Automotive Radar Frontends, Heinz-Juergen Siweris, Infineon ✗ A Chip-set for 76 GHz Automotive Radar Sensors Using Flip-Chip Bonding Technology, Tatsuya Hirose, Fujitsu ✗ Monolithic Microwave and MM-Wave ICs for Automotive Applications — Measures for Cost Reduction, Klaus Beilenhoff, UMS ✗ 76 GHz Transceiver for Automotive Forward-Looking Radars, Hiroshi Kondoh, Hitachi ✗ Automotive Radar Systems, Josef Wenger, DaimlerChrysler Organizers: Mohammad Madihian, NEC USA Inc. Hiroshi Kondoh, Hitachi Sponsor: MTT-6 Microwave and MM-Wave IC Monday, June 3; 8:00 AM to 5:00 PM Washington State Convention & Trade Center Sponsors: MTT-1 Computer-Aided Design MTT-15 Microwave Field Theory WMC: ULTRAHIGH SPEED MICROWAVE AND PHOTONIC DEVICES AND SYSTEMS: HOW WILL THEY BE TESTED? Date & Time: Monday, June 3; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center Topics & Speakers: ✗ Fundamentals of High-Speed Lightwave Component Characterisation Using S-Parameters, Dr. Stavros Iezekiel, University of Leeds ✗ Emerging Trends in High-Speed Lightwave Component Characterisation, Dr. Bala Elamaran, Lightwave Division, Agilent Technologies ✗ Probing Photonic Devices, Scott Rumbaugh, Cascade Microtech ✗ Calibrated High-Speed Optoelectronic Measurements, Dr. Paul Hale, Dr. Tracy Clement and Dr. Dylan Williams, NIST ✗ Electro-Optic Sampling Applied to mm-wave MMIC Characterisation, Dr. Richard Dudley, National Physical Lab ✗ Electro-Optic Field Mapping for Diagnostics of Circuits and Arrays, Dr. John F. Whitaker, University of Michigan ✗ Photonic Probes For an On-Wafer Broad-Band (300 GHz) Millimeter-Wave Network Analyzer, Dr. Nabil Sahri, Alcatel Research & Innovation WMB: MICROWAVE COMPONENT DESIGN USING SPACE MAPPING METHODOLOGIES Location: Dr. John Bandler, Bandler Corp. Microwave engineers have been using optimization techniques for device, component and circuit modeling and CAD for decades. Automatic optimization in modeling, simulation and design is now taken for granted. One of the frontiers that remain is the successful application of optimization procedures in problems for which direct application of traditional optimization approaches is not practical. The recent exploitation of iteratively refined surrogates of “fine” or accurate models, and the implementation of space mapping and related methodologies can be viewed as attempts to address this issue. Space mapping optimization intelligently links companion “coarse” and “fine” models of different complexities. Examples include full-wave electromagnetic simulations with empirical circuit-theory based simulations, or devices under test with a suitable simulation surrogate. The aim is to accelerate iterative design optimization. It is a simple CAD methodology, which closely follows the traditional experience and intuition of microwave designers, yet can be rigorously grounded mathematically. The exploitation of properly managed space mapped models promises significant efficiency in engineering design optimization practices. This workshop will bring together the foremost practitioners in these fields including microwave component designers, software developers and academic innovators. They will focus on the state of the art and address designers’ needs for effective tools for optimal designs, including yield optimization, exploiting accurate physically based device and component models. Current progress in the development and application of suitable algorithms and software engines will be presented. The concepts address the contradictory challenge of exploitation of device and system models that are both accurate and fast. Long-awaited automotive radars, which were originally considered for better driving safety, are no longer “car collision avoidance”-only tools. Projected complexity and functionality for forward looking radars for the next decade include “adaptive cruise control,” “automatic stop and go,” airbag pre-crash warning,” “parking aid,” and ultimately “autonomous driving.” Automotive radars have been researched and developed over the past two decades. Commercial products have been introduced into the market for heavy vehicles such as buses, trucks and trailers, and more recently for passenger cars. While the commercialization of the radar technology coincides with carmakers’ emphasis on driving safety and feature enhancement, it would not have been possible without maturity of viable microwave and millimeter wave technologies at 24 GHz and 77 GHz. Since automotive radars are rather loosely specified and regulated worldwide, applicable technologies may vary for optimum performance/cost depending on the radar schemes and their intended functionality. Radar modulation schemes include FMCW, two-frequency CW, pulsed and spread spectrum, whereas azimuth-angle detection may rely on beam scanning, beam switching, or mono-pulse. Microwave and millimeter-wave signal generation may utilize direct oscillation, frequency multipliers, DRO, and/or PLL. Antenna and circuit topologies are therefore the most crucial constituents influenced by the radar requirements. Even with a fixed set of requirements, there are many factors to be considered for best compromise between performance, cost, and size. The present workshop will bring together experts from consortiums, automotive suppliers and car manufacturers, radar system manufacturers, universities, and semiconductor manufacturers. The workshop will address (a) present and future automotive radars’ functionalities, (b) different automotive radar schemes, (c) adoptable device/circuit topologies, (d) suitable antenna technologies, and (e) present and future challenging issues and consortium activities. Date & Time: Organizer: Topics & Speakers: ✗ Space Mapping Approaches To EM-Based Device Modeling And Component Design, John Bandler, Bandler Cor. ✗ Theory and Applications of the Space Mapping Technique, Kaj Madsen, Technical University of Denmark 20 Organizer: Dr Stavros Iezekiel, Inst. of Microwaves and Photonics Sponsors: MTT-3 Microwave Photonics MTT-7 Microwave and mm-Wave Solid State Devices MTT-11 Microwave Measurements and amplification. In addition, applications such as phased arrays and communications will be covered. The thermal aspects of implementing this technology will also be discussed. The initial part of the workshop, approximately 1/3, will focus on the theory, projection and limitations of the devices including key electrical parameters of the materials with presentations from leading university professors. This part will also address the use of different substrates such as silicon carbide (SiC), sapphire, silicon (Si), Gallium Nitride (GaN), etc. The main part of the workshop will contain presentations from industrial and government speakers focused on this leading edge technology. To provide a worldwide overview, the speaker list will include technology leaders from the United States and Europe. Modern society has an insatiable appetite for information, which manifests itself in ever increasing bit rates (> 40 Gb/s) in optical communication systems and the development of broadband mm-wave wireless systems (especially at 60 GHz). Advances in the cut-off frequencies of devices such as traveling wave photodetectors, polymer modulators and pHEMTs and HBTs make it only a matter of time before the 100 Gb/s barrier is reached by commercial fiber optic products, while 180 GHz wireless systems have been suggested. These exciting developments pose a number of challenges in the design and fabrication of high-speed photonic and microwave devices, ICs, interconnects and packages. However, they also push the envelope in the vital area of characterization, demanding measurement instruments with at least the same bandwidth. Whilst techniques such as electro-optic sampling and network analysis to 100 GHz and beyond would have been previously viewed as esoteric, the time has now come for mm-wave and photonic device designers to use them. (A fact borne out by the recent appearance of commercial 40 Gb/s BER test sets). This workshop specifically addresses a number of state-of-the-art approaches to the time- and frequency-domain measurement and diagnostic testing of critical components in present and emerging broadband optical and wireless systems. WME: ADVANCES IN CERAMIC INTERCONNECT TECHNOLOGIES FOR WIRELESS, MICROWAVE & PHOTONIC APPLICATIONS Monday, June 3; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center Topics & Speakers: ✗ Wide Bandgap Semiconductor Technology Initiative, Dr. Edgar Martinez, Defense Advanced Research Projects Agency (DARPA) ✗ Fundamental Limitations in AlGaN/GaN HEMT Power and Frequency, Dr. Lester F. Eastman, Cornell University ✗ Large-Signal Operation and Physical Effects Limiting the RF Performance of Wide Bandgap FET’s, Dr. Robert J. Trew, Virginia Tech ✗ GaN HEMTs: An Enabling Technology for Next Generation Solid State Phased Array Applications, Dr. Thomas Kazior, Raytheon ✗ Dr. William Pribble, CREE Inc. ✗ Dr. Umesh Mishra, UCSB ✗ RF Analysis of Passivated AlGaN/GaN HFETS, Dr. H. Leier, DaimlerChrysler Research ✗ On the Benefits of SiC and GaN RF Power Devices for Mobile Communication Basestations, Dr. G. Fischer, Lucent Technologies ✗ Feasibility of AlGaN/GaN HEMTs for Ku and Ka-Band Applications, Dr. R. Kiefer, Fraunhofer-IAF ✗ AlGaN/GaN-HEMTs on Silicon Substrates, Dr. Rolf H. Jansen, GaN Consortium ✗ Development of GaN power HEMT Technology on Si Substrates, Dr. D. Pons, Thales TRT ✗ Thermal Effects in AlGaN/GaN HFETs, Dr. M.J. Uren, QinetiQ Organizers: Frank Sullivan, Raytheon Systems Company Dr. Rolf H.Jansen, Aachen University of Technology Sponsors: MTT-6 Microwave and mm-Wave IC MTT-7 Microwave and mm-Wave Solid State Devices MTT-12 Microwave and mm-Wave Packaging Monday, June 3; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center Topics & Speakers: ✗ A Discussion of the Critical Properties of LTCC Materials for Microwave Applications, Dr. Peter Barnwell, Heraeus CMD ✗ The Performance of High Frequency Functions Using Multilayer, Photoimagable Low Temperature Cofired Ceramic (LTCC), Dan Amey, DuPont Microcircuit Materials ✗ Low Loss High Definition Conductor Line in LTCC, Laurent Boyer, Thales Microsonics ✗ Trends in Wireless/RF/Optoelectronic Integrated Packaging, Don Brown, IWPC ✗ Design of Integrated RF Functions for a Complete Bluetooth Solution, Chris Barratt and Sylvain Gerbier, National Semiconductor Corp. ✗ Low Loss Transmission Line Structures Achievable Using LTCC, Liang Chai, Ferro Electronic Materials ✗ System-in-a-Package — Market Potentials Using LTCC, Jim Lawson, C-MAC MicroSystems ✗ The Effective Use of Ceramics in Microwave Power Amplifier Design, John W. Roman, Film Microelectronics Inc. ✗ Plated and Bonded Copper on Alumina Ceramic for RF Component Packaging, Christopher Wolf, CirQon Technologies ✗ RF Circuits with Thick Film Technology Offer Improved Performance, Clark M. Steddom and Juan L. Sepulveda, Zentrix Technologies Inc. ✗ Design Considerations for the Incorporation of Large Number of Differential Pairs in Ceramic Packaging, Paul Garland, Kyocera America Inc. WMD: WIDEBAND GAP TECHNOLOGIES: APPLICATIONS, DEVICES AND CIRCUIT ISSUES Date & Time: Date & Time: Organizers: Dr. Samuel J. Horowitz, DuPont Microcircuit Mat. Dr Peter Barnwell, Heraeus CMD Sponsor: MTT-12 Microwave and Millimeter Wave Packaging The workshop builds on the success of previous events organised for Anaheim in 1999 Boston in 2000 and Phoenix in 2001. In 2001 well in excess of 140 delegates registered and the workshop was nearly full. The purpose of the workshop will be to acquaint engineers with the capabilities of ceramic interconnect and packaging technologies for realizing wireless and microwave circuits and systems. For the year 2002, optical and fiber optic packaging photonics will be included. The reason for running the workshop is that ceramic technologies are generally less familiar to design engineers and yet offer significant benefits in terms of circuit performance, weight and reliability. In the last two years this has started to change with many engineers considering ceramic as an important technology for microwave and related packaging demands. Newer technologies are advancing these benefits further, while at the same time driving costs down. Eminent speakers will be selected to describe and discuss the technologies, applications and the economics of ceramic solutions. Target Audience: Microwave and Optoelectronics Circuit and System Designers. Technologies to be covered: All ceramic circuit technologies suitable for RF, Microwave and photonics applications. To include: Thick Film; Thin This workshop will address the state of the art of Wideband Gap Semiconductor Technologies. A major effort is being made to advance GaN and SiC technologies for high power applications in the microwave region. There are other components where these devices will also find applications but the main focus in this workshop will be power generation 21 MONDAY MONDAY WORKSHOPS ✗ Beyond 40 GHz: Chips to be Tested, Instruments to Measure Them, Prof. Mark J. W. Rodwell, University of California MONDAY WORKSHOPS ✗ EVFE Technique — An Efficient and Practical Solution to Guided Wave Problems, Tasuo Itoh and Yuanxun Wang, UCLA ✗ CAD and Optimization of Waveguide Components and Antennas by Fast Hybrid MM/FE/MoM/FD Methods, Fritz Arndt, University of Bremen ✗ Effects of Selection of Irises on Stopband Performance in the CAD of Direct Coupled Cavity Filters, Christoph Ernst, Lorch Microwave ✗ The Use of CAD Tools in Filter Design for Telecommunication Applications, Jan Kocbach, NERA Research, Satellite Comm. ✗ Enhanced Numerical Modelling of Waveguide Networks and Planar Circuits, Juan Mosig, University of Lausanne ✗ Efficient Simulation of MMIC and RFIC Systems Using a New Matrix Generation Technique and the MNM Iterative Solver, Raj Mittra, Pennsylvania State University ✗ Efficient MoM Techniques for Complex Digital High-Speed and RF Circuits and for Parameterized Model Building, Daniel DeZutter, University of Gent ✗ Discretization and Circuit-Based Simulation of High Frequency Devices and Circuits Including Distributed Effects, Samir El-Ghazaly, Arizona State University ✗ A Domain Decomposition of the Finite Element-Boundary Integral Method for Finite Arrays, John Volakis, University of Michigan Film; Low Temperature Co-fired Ceramic (LTCC); High Temperature Co-fired Ceramic (HTCC); Plated Conductors; Integrated Passives; Photo Patterning; Design Systems and Techniques; Cost Factors. Targeted Applications: Cell phone handsets; Bluetooth Modules; Base stations; Satellite Systems; LMDS; Collision Avoidance; Paging; Wireless Local Loop; Radar Systems; Optical Interfaces, Fiber Optics etc. MONDAY WMF: INTRODUCING NEW CONCEPTS IN NONLINEAR NETWORK DESIGN Date & Time: Sunday, June 3; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center Topics & Speakers: ✗ Overview of New Concepts in Nonlinear Network Design, Prof. Dr.-Ing. Adalbert Beyer, Gerhard-Mercator-Universität Duisburg ✗ Introduction to and Recent Developments in the Novel Largesignal Modelling Philosophy, Directly Based on Large-signal Measurement Data, Dr. ir. Dominique Schreurs, KatholiekeUniversiteit Leuven ✗ The Nonlinear Design Discontinuity, Prof. Steven A. Maas, Nonlinear Technologies Inc. ✗ An Integrated Overview of Nonlinear CAD/CAE Tools and Their Use on Nonlinear Network Design, Prof. J. C. Pedro, University of Aveiro ✗ Dr. Peter Asbeck, University of California at San Diego ✗ Nonlinearity Simulation Using CAE System Amplifier and Mixer Models, Prof. L. Dunleavy, University of South Florida ✗ Everything You’ve Always Wanted to Know About “Hot-S22” (But Were Afraid to Ask), Dr. J. Verspecht, Agilent Brussels ✗ Nonlinear Microwave Design — Extrapolating Beyond SParameters, Prof. J. S. Kenney, Georgia Institute of Technology ✗ Improved Techniques Utilizing Harmonic Termination Methods for Microwave and RF Circuit Design, Dr. Larry Larson, University of California at San Diego ✗ Simulation of a Microwave-Bank, Mrs. Lidia Esther, Microwave Department of LPGC ✗ Jeff Jargon, K.C. Gupta and Don DeGroot, University of Colorado at Boulder Organizers: Prof. Dr.-Ing. Adalbert Beyer, Gerhard-Mercator-Universität Duisburg Dr. ir. Dominique Schreurs, Katholieke-Universiteit Leuven Prof. Steven A. Maas, Nonlinear Technologies, Inc. Sponsor: MTT-1 Computer-Aided Design Organizer: The workshop will build on the popularity and success of recent workshops involving computational electromagnetics and CAD for industrial applications of passive microwave circuits with the goal to reduce design cycles drastically. Much effort has been devoted to the development of electromagnetic (EM) simulators for analyzing microwave circuits and antennas, during the last decade. The consequent next step is the reliable CAD of components and systems for wireless and space communications based on EM field simulators, fast hybrid techniques, and proven optimization methods. The focus of this workshop will be the presentation of the state-ofthe-art and recent progress in the development of advanced and efficient EM techniques and their use for performance assessments and the design of passive key components relevant to communication systems and military applications for the next pentad. Examples will be given from the application of such CAD capability to a variety of practical component design problems, such as waveguide filters, diplexers, multiplexers, couplers, feed networks, horn and slot antennas, planar circuits, patch antennas and microstrip arrays. The techniques and examples directly address the industrial demand for faster design cycles and reduced time to market for microwave components and systems products. A balance between theory, applications and practical discussions of issues and solutions is intended so that the workshop will appeal to a wide range of engineers. Attendees will be encouraged to bring questions, proposals and/or viewgraphs to describe their problems. The workshop will include the presentation of software vendors on the status of the implementation of advanced techniques in commercially available CAD tools. The purpose of this workshop is twofold. First of all, it is intended to give an overview of the recent developments in nonlinear simulation, modeling, characterization and design techniques. Secondly, the issue to teach about nonlinear concepts should be addressed. Undergraduate programs are currently mostly limited to the coverage of linear concepts, but the industry demands basic understanding of nonlinear concepts. Therefore, the workshop speakers, all have on-hands experience in nonlinear concepts, want to show how these concepts can be established. Finally, the goal of this workshop is to supply a forum for discussion and therefore the participants will be invited to interact and to express their point of view. WMH: PASSIVE COMPONENTS FOR RF APPLICATIONS Monday, June 3; 8:00 AM to 5:00 PM Location: Washington State Convention & Trade Center Date & Time: Monday, June 3; 8:00 AM to 12:00 PM Location: Washington State Convention & Trade Center Topics & Speakers: ✗ RF Couplers, Dave Andrews, Vectawave ✗ RF Baluns & Impedance Transformers, John Walker, Semelab plc ✗ Coils for RF & Microwave Applications, Steve Slenker, Piconics Inc. ✗ Capacitors for RF Applications, Michael Busse, Dielectric Labs ✗ PIN & FET RF Switches and Attenuators, Robert Caverly, Villanova University ✗ Powdered Iron Magnetic Materials, Chris Trask, Sonoran Radio Research ✗ Ferrites For RF Applications, Prof. Lionel Davis, University of Manchester Institute of Science & Technology WMG: EM BASED CAD & OPTIMIZATION OF WAVEGUIDE COMPONENTS, PLANAR CIRCUITS & ANTENNAS Date & Time: Fritz Arndt, University of Bremen Topics & Speakers: ✗ System Level Electromagnetic Analysis Through Black-Box Representations of Components, Zoltan Cendes, Ansoft Corp. ✗ Generation of a Ultrawideband Electromagnetic Response Through a Laguerre Expansion Using Early Time and Low Frequency Data, Tapan Sarkar, University of Syracuse 22 Organizers: Dr John Walker, Semelab plc Dan Myer, Communication Power Corp. Sponsor: MTT-17 HF/VHF/UHF Technology Topics & Speakers: ✗ High Resolution Imaging of Biological Tissues with Optical Coherence Tomography, Xingde Li, University of Washington ✗ NIR Diffuse Optical Mammography, Xavier Intes, University of Pennsylvania ✗ Near Infrared Diffusive Light Imaging with Ultrasound Localization, Quing Zhu, University of Connecticut ✗ Hybrid Lidar-Radar for Medical Diagnostics, Linda Mullen, NAVAIR ✗ Ultrasound-Mediated Biophotonic Imaging, Lihong Wang, Texas A&M University ✗ Imaging Function and Gene Expression in the NIR Using Diffuse Optical Tomography, Vasilis Ntziachristos, Harvard Medical School ✗ Functional Optical Brain and Breast Imaging, Kambiz Pourrezaei, Drexel University Passive components for use at RF (1-1000MHz) present many challenges. Conventional transmission lines are generally prohibitively large unless special shortening techniques are employed while lumped elements often exhibit unwanted resonances. Furthermore, RF applications often involve high power levels. This Workshop is intended to serve as both a tutorial introduction to the issues involved as well as to be a forum for presenting the latest state-of-the-art results in this field. The topics to be covered are: Inductors, Capacitors, Ferrites/powdered iron materials, Transformers, Couplers, Baluns, PIN diodes, RF Switches and Attenuators. WMI: SPECTRUM MANAGEMENT ISSUES Date & Time: Monday, June 3; 8:00 AM to 12:00 PM Location: Washington State Convention & Trade Center Topics & Speakers: ✗ Henry Goldberg, Esq., Goldberg Godles Wiener & Wright ✗ Ben Dawson, Hatfield & Dawson ✗ Greg Kiemel, Northwest EMC Inc. ✗ Michael Marcus, Federal Communications Commission ✗ Chris Hardy, Comsearch Organizers: Afshin S. Daryoush, Drexel University Rajeev Bansal, University of Connecticut Arye Rosen, Sarnoff Corp and Thomas Jefferson University Sponsors: MTT-3 Microwave Photonics MTT-10 Biological Effects & Medical Applications Organizer: Michael Marcus, FCC Sponsor: MTT-20 Wireless Communication Picosecond optical pulses and modulated light at RF and microwave frequencies are considered as new imaging modality in diffused media. The Diffused Photon in Near Infrared region is employed to penetrate in the biological tissue and create the medical image from the backscattered light. The modulated light is used to enhance detection system and improve spatial resolution of the image in DPNIR, as short optical pulses are used for high resolution images using optical coherent tomography. On the other hand, IR spectroscopy is employed for absorption of oxygenated and de-oxygenated hemoglobin. This technique is employed to detect breast tumor, hemorrhage deep within tissues, and human brain function in cognitive activity. A panel of distinguished scientists and engineers will introduce physical foundations and instrumentations for various medical applications. Many new microwave products raise spectrum management issues that must be resolved before the product can reach the marketplace. This workshop will address the realities of US domestic spectrum management policies and equipment authorization policies. It will cover spectrum allocations, technical standards, and equipment authorization. The intended audience is microwave engineers and managers who have little or no experience with design for the commercial market. It will deal with both how to find information about present policies as well as getting involved with policy development. WMJ: ADVANCES IN RF MEMS TECHNOLOGY Date & Time: Monday, June 3; 8:00 AM to 12:00 PM Location: Washington State Convention & Trade Center WML: WIRELESS MICROSENSORS: TECHNOLOGY & APPLICATIONS Topics & Speakers: ✗ Gabriel Rebeiz and John Smith, UoM and DARPA ✗ Large Force Electrostatic MEMS Relay for DC to 20GHz, Tomonori Seki and Mitsuru Fujii, Omron ✗ The 10 Billion Cycle Lincoln Labs MEMS Switch: Technology and Packaging, Craig Keast, Mark Gouker and Jeremy Muldavin, Lincoln Labs ✗ Development of Miniature X-band Low-Loss Phase Shifters, Jeffrey F DeNatale, Rockwell Scientific ✗ Millimeter-wave Packaged MEMS Switches for Space Application, Pierre Blondy, University of Limoges ✗ Vaccum Packaging of RF MEMS, Clark Nguyen, University of Michigan/DARPA Organizers: Gabriel Rebeiz, University of Michigan John Smith, DARPA–Consultant Sponsor: MTT-21 RF MEMS & Micromachining and Nanotechnology Location: Washington State Convention & Trade Center Washington State Convention & Trade Center ✗ Pico Radio Technology and Applications, Jan M. Rabaey, University of California-Berkeley ✗ Low-Power RF CMOS, Thomas H. Lee, Stanford University ✗ Sensor Webs for Planetary Exploration and Monitoring, Kevin A. Delin, Jet Propulsion Laboratory ✗ Military Applications and Communication Requirements for Microsensors, Gary A. Shaw, MIT Lincoln Laboratory ✗ Sensing, Signal Processing, and Networking for Distributed Wireless Microsensors, William J. Kaiser, Sensoria Corp. & UCLA Organizers: Gregory Lyons, MIT Lincoln Laboratory Roger Kaul, Johns Hopkins University Sponsors: MTT-16 Microwave Systems MTT-20 Wireless Communication Dramatic advances in wireless technology and the advent of low-power RF systems have enabled the application of small, wireless sensors, or microsensors, to a variety of problems beyond the capability of wired sensors. Many applications involve a network of microsensors. Individual highly intelligent, long-lived microsensors will also enable new capability. Applications range from planetary exploration using microsensor networks (sensor webs) to automotive, industrial, and military sensing. This workshop will cover a sampling of applications in a variety of physical environments, as well as the technologies that enable wireless microsensors. Low-power RF and digital circuitry result in long-lived battery-powered radios. Future efforts will scavenge energy from the microsensor’s environment to WMK: MICROWAVE PHOTONICS FOR MEDICAL IMAGING Monday, June 3; 8:00 AM to 12:00 PM Monday, June 3; 1:00 to 5:00 PM Location: Topics & Speakers: RF-MEMS are rapidly advancing, and new devices (switches, varactors, tunable networks, etc.) are being developed every month. This workshop presents the latest technological achievements in this new and dynamic area. Date & Time: Date & Time: 23 MONDAY MONDAY WORKSHOPS MONDAY WORKSHOPS MONDAY power the electronics or significantly supplement the battery power. Workshop discussion will cover the tradespace of digital processing within each microsensor versus energy requirements for node-to-node or gateway (to/from network) communication. Moore’s Law continues to make digital processing (microsensor intelligence) more powerful and more energy efficient. Energy required for communication tends to depend more on the physics of RF propagation in the physical environment than on the RF system implementation. The present outlook and future directions for wireless microsensors will be discussed. WMN: MODELING OF RF MEMS SWITCHES Monday, June 3; 1:00 to 5:00 PM Location: Washington State Convention & Trade Center Yohtaro Umeda, NTT Electronics Corp. Hermann Boss, Rohde & Schwarz GmbH & Co. KG Sponsor: MTT-9 Digital Signal Processing Washington State Convention & Trade Center ✗ Thermal Modeling and Contact Physics of MEMS Switches, Nick McGruer, Northeastern University ✗ Dielectric Charging: Modeling, Effects and Solutions, James Reid, AFRL/SNHA ✗ Dynamic Modeling of the Actuation Mechanism of Electrostatic MEMS Switches, Dr. Jeremy Muldavin, Lincoln Labs ✗ Electromagnetic Modeling and Equivalent RLC Circuits of RFMEMS Devices, Scott Barker, University of Virginia ✗ Large Displacement Electromechanical Modeling of MEMS Devices, James Marchetti, Corning Intellisense ✗ Integrated Design and Modeling of RF-MEM Devices, W. Scott Best, Coventor Topics & Speakers: ✗ Universal Mobile Telecommunication System (UMTS), Gottfried Schnabl, Siemens AG, Information and Communication Mobile ✗ RF-Sampling Converters for Mobile Radio Systems, Armin O. Splett, Siemens AG ✗ Communicating Near Range Sensor System for Automotive Application, Stefan Lindenmeier, DaimlerChrysler Research and Technology Center ✗ The Overview and Future Evolution of High-Speed Channel Technologies in Optical Transport Network, Yutaka Miyamoto, NTT Network Innovation Laboratories ✗ Ultra-High-Speed Technologies and Circuits for 40 Gb/s and Higher Lightwave Transceivers, Yves Baeyens, Lucent Technologies — Bell Laboratories ✗ Design for the Small Form 10 gigabit Ethernet Transceiver, Nobuharu Kami, Networking Research Laboratories, NEC Corp. ✗ Recent Progress in mm-Wave Photonic Component Technologies for Broadband Wireless Access Systems, Tadao Nagatsuma, NTT Telecommunications Energy Laboratories Organizers: Monday, June 3; 1:00 to 5:00 PM Location: Topics & Speakers: WMM: MICROWAVE AND LIGHTWAVE SYSTEM ARCHITECTURES, SIGNAL PROCESSING, LIMITATIONS AND NOISE Date & Time: Date & Time: Organizers: Gabriel Rebeiz, University of Michigan Harvey Newman, Naval Research Laboratory Sponsor: MTT-21 RF MEMS & Micromachining and Nanotechnology The half-day workshop will present the latest modeling tools for electromechanical, thermal, and electromagnetic analysis of RF-MEMS devices. The role of CAD in RF MEMS, and where it really makes a difference, will be discussed. The limitation of RF MEMS devices in terms of speed, power handling, thermal consideration, and how CAD can help solve these problems will be presented. WMO: DIFFERENTIAL DEVICE CHARACTERIZATION & MODELING Date & Time: Monday, June 3; 1:00 to 5:00 PM Location: Washington State Convention & Trade Center Topics & Speakers: ✗ Joel Dunsmore, Greg Amorese and Wayne Smith, Agilent Technologies ✗ Vahe Adamian and David Ballo, Agilent Technologies ✗ Uwe Arz, Dylan Williams and Uwe Arz, PTB; Dylan Williams, National Institute of Standards and Technology ✗ Vahe Adamian, Agilent Technologies ✗ Robert Stengel, Motorola Since 1940s the microwave technologies have been used in various systems such as radars and wireless communication systems. In recent 20 years, these technologies have been applied to baseband signal processing in fiber-optic communication systems. In addition, the mobile phones have been spread out to almost every person in many countries. Recently, the anti-collision radars have been attached to automobiles and the software receivers have been developed using sampling converters. Moreover, the microwave-photonic systems, which incorporating microwave and lightwave technologies, have been rising. For the engineers who try to apply microwave technologies to such various systems, the knowledge of the target system is essential. In particular, the information about the system requirements for electronic/photonic components is crucial. This workshop presents the outline and requirements of the state-of-the-art wireless/lightwave systems where microwave techniques are used as key technologies. The topics range over the air interface and the RF-sampling converters for the third generation mobile phones, the communicating sensor system for automotive radar systems, the optical transport network terminal and the integrated circuits for 40 Gbit/s and higher core-network fiber-optic systems, the transceiver module for 10 gigabit ethernet systems, and the millimeter-wave photonic components for broadband wireless access systems. System architectures, signal-processing methods, limitation factors of system performance, and system requirements, such as flexibility, cost, bandwidth, power, linearity, dynamic range, sensitivity, and noise figure, will be discussed in detail from the standpoint of both systems and components. The key technologies, such as modulation methods, digital techniques, integration techniques, packaging techniques, and photonic techniques, to extend the limits and meet the requirements will be demonstrated in the above systems. In addition, the prospect of the technologies for future wireless/lightwave systems will be discussed and the directions in research and development of these systems will be provided. Organizers: Greg Amorese, Agilent Technologies Sadonna Cody, Agilent Technologies Sponsors: MTT-1 Computer-Aided Design MTT-6 Microwave and MM-Wave IC MTT-11 Microwave Measurements MTT-14 Microwave Low-Noise Techniques MTT-20 Wireless Communication Differential devices are finding wide application in RF circuit design due to their highly desirable noise immunity and density. However the proper use of these devices is constrained by the designer’s ability to accurately characterize available devices for each specific circuit design. Measurement of these devices presents significant challenges. This workshop will cover both the theoretical operating modes and measurement of these devices as well as the interaction of measurement techniques and modeling approaches. Symmetric and Asymmetric cases and signal integrity issues will be covered. Proper differential fixturing and error correction techniques will also be discussed. Practical design examples will be used to enhance the understanding of these challenging topics. 24 The MTT-S Student Paper Competition encourages and recognizes excellence in research in microwave science and technology. Two hundred and forty-one papers were submitted to the competition this year. Among these submissions, 140 were accepted for presentation, and the technical program committee selected 24 finalists. All of the accepted student papers will be presented at their appropriate paper sessions. In addition, the 24 finalists will also present their papers at the Student Paper Competition Interactive Forums on Tuesday, June 4 and Wednesday, June 5 from 1:30pm to 4:30pm. All Symposium attendees are welcome to attend these Student Paper Competition Interactive Forum sessions where final presentation and judging will occur. Prizes will be awarded to the six best papers among the finalists. All student finalists will be given certificates and complimentary registration to IMS2002. Cash awards in the amount of $2900 and additional prizes have been donated by MTT-S. The National Science Foundation and MTT-S sponsored travel subsidies to the Symposium for all the finalists. A student awards banquet will be held at the Sheraton Hotel on Thursday of IMS Week during which the awards will be presented. All Student Paper Competition participants and their advisors are invited. Following is a list of the finalists’ papers, lead authors and their respective institutions. New Linearization Method for the Modulated Signals with High Peak-to-average Ratio: Peak-to-average Ratio Reduction and Expansion (WE2A) IF-TU Youngoo Yang, Pohang University of Science and Technology, Korea Negative Refractive Index Metamaterials Supporting 2-D Waves (WE4C) IF-TU Ashwin K Iyer, University of Toronto, Canada A Time-hopping Smart Antenna Receiver Array Using a Single RF Channel and Digital Beamforming (TU4C) IF-WE Jonathan D Fredrick, University of California, Los Angeles, USA 45 GHz Highly Integrated Phase-locked Loop Frequency Synthesizer in SiGe Bipolar Technology (WE2D) IF-TU Guenter Ritzberger, Technische Universitaet Wien, Austria Integrated Inductors in the Chip-to-board Interconnect Layer Fabricated Using Solderless Electroplating Bonding (TH1A) IF-WE Yeun-Ho Joung, Georgia Institute of Technology, USA Development of RF Carbon Nanotube Resonant Circuit Sensors for Gas Remote Sensing Applications (WE1B) IF-WE Saurabh Chopra, Clemson University, USA Suppression of the Parallel-plate Noise in High-speed Circuits Using a Metallic Electromagnetic Band-gap Structure (WE) IF-TU Ramesh Abhari, University of Toronto, Canada Extraction of Accurate Behavioral Models for Power Amplifiers with Memory Effects Using Two-tone Measurements (TU2F) IF-TU Hyunchul Ku, Georgia Institute of Technology, USA Optimum Bias Conditions for Linear Broadband InGaP/GaAs HBT Power Amplifiers (WE3A) IF-TU Masaya Iwamoto, University of California, San Diego, USA High-isolation Bonding Pad with Depletion-insulation Structure for RF/Microwave Integrated Circuits on Bulk Silicon CMOS (WE1C) IF-WE Sang Lam, Hong Kong University of Science and Technology, China Uncertainty Estimation and Optimal Extraction of Intrinsic FET Small Signal Model Parameters (WE1E) IF-TU Christian Fager, Chalmers University of Technology, Sweden Architecture and Algorithm for High Precision Image Rejection and Spurious Rejection Mixers Using Digital Compensation (WE2B) IF-WE Youngjin Kim, Korea Advanced Institute of Science and Technology, Korea Ultra Low Phase Noise SiGe HBT Application to a C-band Sapphire Resonator Oscillator (WE1D) IF-TU Gilles Cibiel, LAAS-CNRS, France Optical Delivery of Modulated Millimetre-Wave Signals Using Free-running Laser Heterodyne with Frequency Drift Cancellation (TH2F) IF-WE Leif Johansson, University College London, England A New X-band 180° High Performance Phase Shifter Using (Ba,Sr)Tio3 Thin Films (TH1D) IF-WE Baki Acikel, University of California, Santa Barbara, USA Quasi-optical E-band MEMS Switching Arrays (TH1F) IF-WE Weikang Zhang, University of California, Davis, USA Low Contact-resistance Series MEMS Switches (TU3D) IF-WE Dimitrios Peroulis, University of Michigan, USA Field-tuneable Probe for Combined Electric and Magnetic Field Measurements (TH1E) IF-WE Ronald M Reano, University of Michigan, USA A Novel Extraction Method for a Fully Electro-thermal Large-signal Model of HBT (WE3E) IF-TU Hyun-Min Park, Korea Advanced Institute of Science and Technology, Korea Analysis and Design of Low-loss Planar Microwave Baluns Having Three Symmetric Coupled Lines (TU2E) IF-WE Jong-Wook Lee, Purdue University, USA Intrinsic Noise Characteristics of AlGaN/GaN HEMTs (TH1B) IF-WE Sungjae Lee, Purdue University, USA A Microwave Communication Link with Self-heterodyne Direct Down Conversion and System Predistortion (WE3B) IF-TU Jin W Park, University of California, Los Angeles, USA Neural Based Dynamic Modeling of Nonlinear Microwave Circuits (WE4D) IF-TU Jianjun Xu, Carleton University, Canada Analysis of Guided Wave Structures Using 3-D Envelope-finite Element (Evfe) Technique (WE1F) IF-TU Hsiao-Ping Tsai, University of California, Los Angeles, USA IF-TU: Interactive Forum presentation takes place Tuesday, June 4 IF-WE: Interactive Forum presentation takes place Wednesday, June 5 25 TUESDAY MTT-S STUDENT PAPER COMPETITION TUESDAY, JUNE 4, 2002 10:10–11:40 AM TU2B MMIC Technology TU2C Phased Arrays and Beam Steering Techniques Joint RFIC/IMS Session Chair: A. Madjar, Rafael Co-chair: T. Lee, Boeing Satellite Systems ROOM 606–607 Chair: B. Perlman, USA Comm.-Elect. R&D Center Co-chair: R. Sudbury, MIT Lincoln Lab ROOM 611–612 TU2A-1: Invited: Integrated Even Harmonic Type Direct Conversion Receiver for W-CDMA Mobile Terminals K. Itoh, T. Yamaguchi, T. Katsura, K. Sadahiro, T. Ikushima, R. Hayashi, F. Ishizu, E. Taniguchi, T. Nishino, M. Shimozawa, Mobile Communication Business Div., Mitsubishi Electric Corp., TU2C-1: Correlation of Nonlinear Distortion in Digital Phased Arrays: Measurement and Mitigation D.J. Rabideau, L.C. Howard, MIT, Lincoln Lab TU2B-2: Ku-band MMICs in Low-cost, SMT Compatible Packages H.C. Huang, A. Ezzeddine, A. Darwish, B. Hsu, AMCOM Communication Inc. TU2C-2: Planar Implementation of the Partially Overlapped Subarrays for mm-wave Beam Steerable Antenna Applications A. Abbaspour-Tamijani (student), K. Sarabandi (Professor/Director), Radiation Lab, Univ. of Michigan TU2B-3: ESD Protection of RF Circuits in Standard CMOS Process K. Higashi, A.O. Adan, M. Fukumi, M. Hayashi, Design Technology Development Center, IC Development Group, Sharp Corp.; N. Tanba, T. Yoshimasu, Analog IC Div., IC Group, Sharp Corp. TU2C-3: A Novel Multibeam Grating Antenna with Applications to Low-cost mm-Wave Beam Steering C.T. Rodenbeck, M-Y. Li, K. Chang, Texas A&M Univ. Electrical Engineering Dept. TU2A-2: Invited: An Analog Baseband Chain for a UMTs Zero-IF Receiver in a 75 GHz SiGe BiCMOs Technology W. Schelmbauer, J.K. University of Linz; H. Pretl, DICE Linz; L. Maurer, INIT Linz; B. Adler, J. Fenk, Infineon Munich; R. Weigel, INIT Linz, DICE Linz; R. Hagelauer, RIIC Linz, DICE Linz 10:50 AM 10:40 AM 10:30 AM 10:20 AM 10:10 AM TU2A Special Session on Radio Frequency Integrated Circuits for 3G Joint RFIC/IMS Session Chair: R. Weigel, Univ. of Linz, Austria Co-chair: C.C.W. Ruppel, EPCOS AG ROOM 608–609 IEEE MTT-S IMS TECHNICAL SESSIONS TU2A-3: A 2-GHz RF Front-end Transceiver Chipset in CMOS Technology for PCS and IMT-2000 Applications Y-S. Youn, N-S. Kim, J-H. Chang, H-K. Yu, J-K. Kwon, K-S. Kim, Electronics and Telecommunications Research Institute (ETRI) TU2A-4: System Analysis of a W-CDMA Base-station PA Employing Adaptive Digital Predistortion C. Potter, Wireless & Multimedia Design Group, Tality UK Ltd. TU2B-4: Novel BiCMOS Compatible, Short Channel LDMOS Technology for Medium Voltage RF and Power Applications A. Litwin, Ericsson Microelectronic; O. Bengtsson, Swedish Linear Microwave; J. Olsson, Uppsala Univ. TU2C-5: High Performance Voltage Controlled Bi-directional Amplifiers in Support of Component Reuse for Large Aperture Phase Array J.M. Yang, Y.H. Chung, M. Nishimoto, R. Lai, R. Tsai, R. Kagiwada, C.C. Yang, TRW TU2B-5: Electromagnetic Coupling Effects in RF-CMOS Circuits A.O. Adan, M. Fukumi, K. Higashi, M. Hayashi, IC Development Group, Sharp Corp.; T. Suyama, M. Miyamoto, Advanced Research Labs., Sharp Corp. TU2C-6: Experimental Investigation of a Varactor Loaded Reflect Array Antenna L. Boccia, F. Venneri, G. Amendola, G. Di Massa, Dipartimento di Elettronica, Informatica e Sistemistica, Italy TU2B-6: Ultra Low-power VCO Based on InP-HEMT and Heterojunction Interband Tunnel Diode for Wireless Application A. Cidronali, G. Collodi, M. Camprini, G.Manes, Dept. Electronics and Telecommunications, Univ. of Florence; V. Nair, J. Lewis, H. Goronkin, PSRL, Motorola Labs. 11:40 AM 11:30 AM 11:20 AM 11:10 AM 11:00 AM TU2C-4: Highly Integrated RF-modules for Ka-band Multiple-beam Active Phased Array Antennas J. Butz, M. Spinnler, Bosch SatCom GmbH; J. Christ, U. Mahr, Marconi Communications 26 AM TU2E Couplers, Dividers, and Baluns TU2F Nonlinear CAD Techniques for Circuits and System Chair: K.C. Wang, OpNext Co-chair: J.F. Luy, DaimlerChrysler ROOM 615–617 Chair: C. Buntschuh, Microwave Engineering Services Chair: J.C. Pedro, Aveiro Univ. Co-chair: T. Brazil, Univ. College of Dublin ROOM 613–614 ROOM 602–604 TU2D-1: A 50-Gbit/S 1:4 Demultiplexer IC In InP-based HEMT Technology H. Kano, T. Suzuki, S. Yamaura, Y. Nakasha, K. Sawada, T. Takahashi, K. Makiyama, T. Hirose, Y. Watanabe, Fujitsu Lab Ltd.; M. Mizoguchi, H. Ito, M. Nishi, Fujitsu Quantum Devices Ltd. TU2E-1: Design of a Miniaturized Stripline-to-microstripline Coupler K. Rambabu, J. Bornemann, Dept. of Electrical and Computer Engineering, Univ. of Victoria TU2F-1: Coupled Electromagnetic/Nonlinear Optimization of Self-oscillating Microstrip Antennas with Far-field Performance Specifications V. Rizzoli, A. Costanzo, E. Montanari, DEIS Univ. of Bologna, Italy TU2D-2: A 0.15 µm GaAs MHEMT Transimpedance Amplifier IC for 40-Gb/S Applications C.F. Campbell, M.S. Heins, M. Kao, M. Muir, J. Carroll, TriQuint Semiconductor, Richardson, TX TU2E-2: A High-directivity Microstrip Directional Coupler with Feedback Compensation J.L. Chen, S.F. Chang, C.T. Wu, National Chung Cheng Univ., Dept. of Electrical Engineering TU2F-2: Analog Frequency Divider by Variable Order 6 to 9 F. Ramirez, E. de Cos, A. Suarez, DICOM, Univ. of Cantabria TU2E-3: An All 50 Ω Divider/Combiner Structure E. Turan, Army Academy, Ankara, Turkey; S. Demir, Dept. of Electrical and Electronics Eng., Middle East Tech. Univ., Ankara, Turkey TU2F-3: Intermodulation Behavior in LDMOS Transistor Amplifiers C. Fager, H. Zirath, Microwave Electronics Lab, Chalmers Univ. of Technology, Sweden; N.B. de Carvalho, J.C. Pedro, Institute f Telecommunications, Univ. of Aveiro, Portugal TU2D-3: A Fully Integrated 40-Gbit/s Clock and Data Recovery Circuit Using InP/InGaAs HBTs H. Nosaka, E. Sano, K. Ishii, M. Ida, K. Kurishima, T. Enoki, T. Shibata, NTT Photonics Labs., NTT Corp. TU2E-4: Vertical Balun and Wilkinson Divider A. Darwish, A. Ezzeddine, H.C. Huang, AMCOM Communications Inc.; K. Bumman, L. Joonyoul, Y. Sungwhan, POSTECH Univ., Soul, Korea TU2F-4: Augmented Behavioral Characterization for Modeling the Nonlinear Response of Power Amplifiers P.M. Asbeck, M. Iwamoto, L.E. Larson, Univ. of California, San Diego; H. Kobayashi, Fuji Electric, Japan; G. Hanington, American High Voltage, Elko, NV; S. Nam, Seoul National Univ., Korea TU2D-4: 40 Gb/S Optical Receiver IC Chipset — Including a Transimpedance Amplifier, a Differential Amplifier and a Decision Circuit — Using GaAs-based HBT Technology Y. Amamiya, Y. Suzuki, M. Kawanaka, K. Hosoya, Z. Yamazaki, M. Mamada, H. Takahashi, S. Wada, T. Kato, Y. Ikenaga, S. Tanaka, T. Takeuchi, H. Hida, Photonic and Wireless Devices Research Lab, NEC Co. TU2E-5: Analysis and Design of a High-performance Planar Marchand Balun C.Y. Ng, I.D. Robertson, Microwave and Systems Research Group (MSRG), School of Electronics, Computing and Mathematics, Univ. of Surrey, M. Chongcheawchamnan, Mahanankorn Telecommunication Dept., Mahanakorn Univ. of Technology, Bangkok TU2F-5: Extraction of Accurate Behavioral Models for Power Amplifiers with Memory Effects Using Two-tone Measurements H. Ku, M.D. McKinley, J.S. Kenney, Georgia Institute of Technology, School of Electrical and Computer Engineering TU2D-5: 40-GHz MMIC for Optical Modulator Driver Applications R. S. Virk, E. Camargo, R. Hajji, S. Parker, S. Notomi, Fujitsu Compound Semiconductor Inc.; R. Benelbar, formerly with Fujitsu Compound Semiconductor Inc.; H. Ohnishi, Fujitsu Quantum Devices Ltd. TU2E-6: Analysis and Design of Low-loss Planar Microwave Baluns Having Three Symmetric Coupled Lines J-W. Lee, K.J. Webb, School of Electrical and Computer Engineering, Purdue Univ., West Lafayette, IN TU2F-6: Statistical Modeling of the Interaction of Multiple Signals in Nonlinear RF Systems K.M. Gharaibeh, M.B. Steer, Dept. of Electrical and Computer Engineering, N. Carolina State Univ.; K. Gard, QUALCOMM CDMA Technologies Inc. 11:40 AM 11:30 AM 11:20 AM 11:10 AM 11:00 AM 10:50 AM 27 TUESDAY 10:40 AM 10:30 AM 10:20 AM 10:10 TU2D Integrated Circuits for 40Gb/s Fiber Systems TUESDAY, JUNE 4, 2002 IEEE MTT-S IMS TECHNICAL SESSIONS TU3A Silicon Substrate and Inductor Modeling TU3B SiGe RFIC Process Technologies Joint RFIC/IMS Session Chair: A. Gupta, Anadigics Co-chair: A. Westwick, Silicon Lab ROOM 608–609 Joint RFIC/IMS Session Chair: K. Ashby, Microtune Inc. Co-chair: B. Xavier, National Semiconductor ROOM 606–607 1:20–3:00 PM TU3C Integrated Passives for RF and mm-Wave Applications Chair: K. Kornegay, School of ECE, Cornell Univ. ROOM 611–612 TU3B-1: Invited: Review of SiGe BiCMOS Process Technology and Its Impact on RFIC Design Motorola TU3C-1: High Quality Factor and High Self-resonant Frequency Monolithic Inductor for mm-Wave Si-based ICs É. Tournier, J. Graffeuil, LAAS/CNRS and Univ. P. Sabatier, Toulouse, France; C. Boulanger, Toulouse, France; I. Telliez, STMicroelectronics, Croll TU3A-2: Modeling of Frequency Dependent Losses in Two-port and Three-port Inductors on Silicon T. Kamgaing, T. Myers, Mel Miller, Motorola Inc., Semiconductor Product Sector, Tempe, AZ TU3B-2: Invited: High Performance Circuits in 0.18 mm SiGe BiCMOS Process for Wireless Applications P. Ye, Conexant Systems TU3C-2: Two-port Type Ferromagnetic RF Integrated Inductor T. Kuribara, K-I. Arai, RIEC, Tohoku Univ. TU3A-3: Characterization and Modeling of On-chip Inductor Substrate Coupling Effect C-J. Chao, M-J. Chen, Institute of Electronics Engineering, National Chiao-Tung Univ., Taiwan, ROC; S-C. Wong, Acer Labs Inc., Taipei, Taiwan, ROC; C-J. Hsu, L-Y. Leu, Winbond TU3B-3: Low Frequency Noise Figures of Merit in RF SiGe HBT Technology J. Tang, G.F. Niu, Z. Jin, J.D. Cressler, S. Zhang, Auburn Univ. Electrical and Computer Engineering Dept.; A.J. Joseph, D.L. Harame, IBM Microelectronics TU3C-3: RF MIM Capacitors Using High-K Al2O3 and Altiox Dielectrics S.B. Chen, J.H. Chou, A. Chin, Dept. of Electronics Eng., National Chiao Tung Univ., Hsinchu, Taiwan; J.C. Hsieh, J. Liu, United Microelectronics Corp. TU3A-4: Characterization and Modeling of Small-signal Substrate Resistance Effect In RF CMOS Y-S. Lin, T-H. Lee, H-B. Liang, National Chi-Nan Univ. Electrical Engineering Dept.; S-S. Lu, National Taiwan Univ. Electrical Engineering Dept. TU3B-4: Com2 Enhanced Graded Base SiGe Technology for High Speed Applications T. Ivanov, M. Carroll, S. Moinian, M. Mastrapasqua, M. Frei, A. Chen, C. King, A. Hamad, E. Martin, S. Shive, T. Esry, C. Lee, R. Johnson, T. Sorsch, M. S. Carroll, K. Banoo, P. Smith, L. Bizzarro, W. Cochran, Agere Systems, Murray TU3C-4: Performance Analysis of Monolithic RF Transformers by Experimental Characterization T. Kamgaing, T. Myers, M. Miller, F. Ling, Motorola, Semiconductor Product Sector, Tempe, AZ TU3A-5: A New Method for the Computation of the Substrate Parasitics of Octagonal Inductors W. Tatinian, Modeling Ingeneer Alcatel Microelectronics, PhD Student L2MP; P. Pannier, Maitre de Conferences, Ecole Polytechnique Universitaire de Marseille; R. Gillon, Competence Leader Modeling and Characterisation Alcatel Microele TU3B-5: Advanced Passive Devices for Enhanced Integrated RF Circuit Performance D. Coolbaugh, E. Eshun, D. Harame, J. Johnson, M. Hammad, Z. He, V. Ramachandran, S. St Onge, K. Watson, IBM Corp, Essex Junction, VT; R. Groves, K. Stein, S. Subbanna, R. Volant, IBM Corp, Hopewell; D. Wang, X. Wang TU3C-5: Lumped and Distributed Lattice-type LC-Baluns W. Bakalski, W. Simbuerger, H. Knapp, H.-D. Wohlmuth, Infineon Technologies; A.L. Scholtz, The Institute of Communications and Radio-Frequency Engineering, Technical Univ. of Vienna TU3C-6: Design of a Novel Lumped Element Backward Directional Coupler Based on Parallel Coupled-line Theory T-Y. Song, J-H. Kim, S-H. Kim, J-S. Park, Div. of Information Technology Eng., Soonchunhyang Univ., Asan, Korea; J-B. Lim, Dept. of EE Eng., Kookmin Univ., Seoul, Korea 2:50 PM 2:40 PM 2:30 PM 2:20 PM 2:10 PM 2:00 PM 1:50 PM 1:40 PM 1:30 PM 1:20 PM TU3A-1: Invited: Modeling of Passive Elements with Asitic A. Niknejad, UC Berkeley 28 TU3D RF MEMS Switch Design and Modeling TU3E Frequency Conversion Circuits Chair: T. Weller, Univ. of South Florida Co-chair: C. Goldsmith, Cogent Solutions Inc. ROOM 615–617 Chair: E. Camargo, Fujitsu Compound Semicon. Inc. Co-chair: M. Goldfarb, Analog Devices ROOM 602–604 TU3D-1: Toggle-switch — A New Type of RF MEMs Switch for Power Applications B. Schauwecker, K.M. Strohm, J-F. Luy, DaimlerChrysler AG; W. Simon, J. Mehner, IMST GmbH Kamp Lintfort, Germany TU3E-1: A Balanced Resistive Mixer Avoiding an IF Balun Thomas A. Bös, E. Camargo, Fujitsu Compound Semiconductor Inc. TU3D-2: Low Contact-resistance Series MEMs Switches D. Peroulis, K. Sarabandi, L.P.B. Katehi, Univ. of Michigan TU3E-2: A Compact L-band LTCC Mixer with High Image Rejection G. Passiopoulos, K. Lamacraft, Nokia Networks, Camberley, UK. TU3D-3: High-isolation BST-MEMs Switches Y. Liu, T.R. Taylor, J. Speck, R.A. York, Univ. of California, Santa Barbara, Electrical and Computer Engineering Dept., Materials Dept., Santa Barbara, CA TU3E-3: An Even Harmonic Mixer Using Self Biased Anti Parallel Diode Pair M. Shimozawa, E. Taniguchi, N. Suematsu, Y. Isota, T. Takagi, Information Technology R&D Center, Mitsubishi Electric Corp.; T. Katsura, K. Maeda, T. Ikushima, K. Itoh, Mobile Comm. Business Div., Mitsubishi Electric Corp. TU3D-4: RF MEMs Capacitive Switches Fabricated with HDICP CVD SINX C.H. Chang, J.Y. Qian, B.A. Cetiner, Q. Xu, M. Bachman, F. De Flaviis, G.P.Li, Univ. of California at Irvine, Electrical and Computer Engineering Dept., Irvine, CA; H.K. Kim, Y. Ra, Bethel Material Research, Placentia, CA TU3D-5: A Study of Thermal Effects in RF-MEM-switches Using a Time Domain Approach W. Thiel, K. Tornquist, R. Reano, L.P.B. Katehi, Univ. of Michigan, Radiation Lab, Electrical Engineering and Computer Science TU3E-4: A Monolithic, 2 to 18 GHz Upconverter L.M. Devlin, A.W. Dearn, G.A. Pearson, Plextek Ltd.; P.D.L. Beasley, G.D. Morgan, QinetiQ TU3D-6: Steady State Thermal Analysis and High-power Reliability Considerations of RF-MEMs Capacitive Switches J. Rizk, E. Chaiban, G.M. Rebeiz, Univ. of Michigan, Ann Arbor, Radiation Lab, EECS Dept., Ann Arbor, MI 2:50 PM 2:40 PM 2:30 PM 2:20 PM 2:10 PM 2:00 PM 1:50 PM TUESDAY 1:40 PM 1:30 PM 1:20 PM NOTES 29 IEEE MTT-S IMS TECHNICAL SESSIONS TU4A Active Device Modeling and Characterization TU4B RFIC Power Amplifier Technologies Joint RFIC/IMS Session Chair: J. Staudinger, Motorola Co-chair: P. Murphy, Univ. College Cork ROOM 608–609 Joint RFIC/IMS Session Chair: B. Xavier, National Semiconductor Co-chair: K. Ashby, Microtune Inc. ROOM 606–607 3:30–5:00 PM TU4C Smart Antennas and Digital Beam Forming Techniques Chair: M. Thursby, SkyCross Inc. Co-chair: W. Shiroma, Univ. of Hawaii ROOM 611–612 TU4A-1: Invited: Robust High Voltage SiLDMOS Model Extraction Process to Achieve First Pass Linear RFIC Amplifier Designs J. Pla, Motorola TU4B-1: Invited: RF Power Semiconductor Devices for Portable Communications C. Weitzel, Motorola TU4C-1: Digital Beamforming and Calibration for Smart Antennas Using Real-time FPGA Processing T.W. Nuteson, J.S. Clark IV, D.S. Haque, G.S. Mitchell, The Aerospace Corp. TU4A-2: Large-signal Modeling of GaN FET and Nonlinearity Analysis Using Volterra Series S.S. Islam, A.F.M. Anwar, Univ. of Connecticut, Dept. of Electrical and Computer Engineering TU4B-2: SiGe/Si Power HBTS for X- to K-band Applications S. Mohammadi, Z. Ma, J. Park, P. Bhattacharya, L.P.B. Katehi, Univ. of Michigan, EECS Dept.; G.E. Ponchak, S.A. Alterovitz, NASA Glen Research Center; K.M. Strohm, J-F. Luy TU4C-2: A Time-hopping Smart Antenna Receiver Array Using a Single RF Channel and Digital Beamforming J.D. Fredrick, Y. Wang, S-S. Jeon, T. Itoh, Univ. of California, Los Angeles, Electrical Engineering Dept., Los Angeles, CA TU4A-3: Direct Parameter Extraction on RF-CMOS F.X. Pengg, CSEM Swiss Center for Electronics and Microtechnology Inc. TU4B-3: RF Power Characteristics of SiGe Heterojunction Bipolar Transistor with High Breakdown Voltage Structures T. Matsuno, Semiconductor Device Research Center, Semiconductor Co., Matsushita Electric Industrial Co., Ltd.; K. Nishii, Semiconductor Device Research Center, Sem; S. Sonetaka, Y. Toyoda, N. Iwamoto TU4C-3: A 62/66 GHz Frequency Offset Retrodirective Array N.B. Buchanan, T. Brabetz, V.F. Fusco, The Dept. of Electrical and Electronic Engineering, Queens Univ. Belfast TU4A-4: Low Frequency Noise Characterization and Modeling of Microwave Bipolar Devices: Application to the Design of Low Phase Noise Oscillator L. Bary, G. Cibiel, J. Rayssac, A. Rennane, O. Llopis, R. Plana, J. Graffeuil, Laboratory for Analysis and Architecture of Systems, Toulouse, France; M. Regis, SiGe Semiconductor, Ottawa, Ontario, CAN; M. Borgarino, Univ. of TU4B-4: Design Techniques for Improved Performance of Small Outline Packages L.E. Larson, Univ. of California, San Diego; D. Jessie, Univ. of California, San Diego and QUALCOMM TU4C-4: Compact Beamforming Matrix Module for Use in Multibeam Communications Satellites W.P. Kornrumpf, GE Research and Development Center, Schenectady, NY; A.W. Jacomb-Hood, R. Melcher, Lockheed Martin CPC, Newtown, PA TU4A-5: Linearity Analysis of CMOS for RF Application S. Kan, B. Cho, B. Kim, Pohang Univ. of Science and Technology Electronic and Electrical Engineering Dept. TU4B-5: Spiral Inductor Performance in Deep-submicron, Bulk CMOS with Copper Interconnects W.B. Kuhn, A.W. Orsborn, M.C. Peterson, S.R. Kythakyapuzha, A.I. Hussein, J. Zhang, J. Li, E.A. Shumaker, N.C. Nair, Kansas State Univ., Manhattan, KS TU4C-5: Smart Antenna System Implementation Based on Digital Beamforming and Software Radio Technologies J. Wu, W-X. Sheng, K-P. Chan, W-K. Chung, K-K. M. Cheng, K-L. Wu, Dept. of Electronic Engineering, The Chinese Univ. of Hong Kong 5:00 PM 4:50 PM 4:40 PM 4:30 PM 4:20 PM 4:10 PM 4:00 PM 3:50 PM 3:40 PM 3:30 PM TUESDAY, JUNE 4, 2002 30 Chair: N. Scott Barker, Univ. of Virginia Co-chair: K. Varian, Raytheon Co. ROOM 615–617 Chair: M. Madihian, NEC USA Co-chair: B. Nelson, Sirenza ROOM 602–604 TU4D-1: RF Power Handling of Capacitive RF MEMs Devices B.W. Pillans, J.L. Kleber, C.L. Goldsmith, M.D. Eberly, Raytheon Systems Co 3:40 PM TU4E-2: Integrated Quadrupler Circuit in Coplanar Technology for 60 GHz Wireless Applications M. Schefer, Agilent Technologies, Wireless Semiconductor Div., S anta Clara, CA TU4D-2: A Very-low-loss 2-bit X-band RF MEMs Phase Shifter G.L. Tan, G.M. Rebeiz, Univ. of Michigan, Ann Arbor, Ann Arbor, MI; R.B. Mihailovich, J.B. Hacker, J.F. DeNatale, Rockwell Scientific 3:50 PM TU4E-1: Miniaturized and Broadband V-band Balanced Frequency Doubler for Highly Integrated 3-D MMIC K. Nishikawa, T. Nakagawa, K. Araki, NTT Network Innovation Lab; B. Piernas, Fujitsu Compound Semiconductor Inc. TU4D-3: A Low-loss Ka-band Distributed MEMS 2-bit Phase Shifter Using Metal-air-metal Capacitors J.S. Hayden, G.M. Rebeiz, Univ. of Michigan, Radiation Lab 4:10 PM 4:00 PM TU4E-3: Some Rules for the Choice of the C(V) Characteristic for the Design of Frequency Triplers with Symmetrical Varactors J.M. Duchamp, P. Ferrari, LAHC, Univ. de Savoie, Cedex, France; J.W. Tao, ENSEEIHT-LEN7, INP Toulouse, Toulouse Cedex, France; D. Lippens, IEMN, UST de Lille, Cedex, France TU4D-4: V-band Low-loss and Low-voltage Distributed MEMs Digital Phase Shifter Using Metal-air-metal Capacitors H.T. Kim, J.H. Park, Y.K. Kim, Y. Kwon, Center for 3-D mm-Wave Integrated Systems, Seoul National Univ.,Korea TU4E-5: Tunable Inverted-microstrip Phase Shifter Device Using Nematic Liquid Crystals C. Weil, R. Jakoby, Darmstadt Univ. of Technology, Institute of Microwave Engineering, Germany; G. Luessem, Merck KGaA, Liquid Crystal Div., Darmstadt, Germany TU4D-5: Differential Multi-finger MEMs Tunable Capacitors for RF Integrated Circuits G.V. Ionis, Columbia Univ., Dept. of Electrical Engineering; A. Dec, K. Suyama, Epoch Technologies, LLC 5:00 PM 4:50 PM 4:40 PM 4:30 PM 4:20 PM TU4E-4: Microwave Variable Delay Line Using a Membrane Impregnated with Liquid Crystal T. Kuki, H. Fujikake, H. Kamoda, T. Nomoto, NHK Science and Technical Research Lab 31 ALSO OCCURRING Tuesday, June 4, 5:30–10:30 PM MTT-S Special Tuesday Evening Event, Tillicum Village A unique Northwest experience is available on Tuesday evening, June 4th from 5:30 PM to 10:30 PM. Leave Seattle on a boat cruise to Blake Island while enjoying the view of islands, mountains and the Seattle skyline. Once there, savor a delicious buffet inside the huge cedar longhouse featuring Northwest Coast Indian-style baked salmon. The evening includes a spectacular dance show by the Tillicum Village Dancers, who bring to life the dances and legends of the Northwest Coast. Tickets are limited; transportation is included. TUESDAY TU4E Frequency and Phase Control Circuits 3:30 PM TU4D Application of RF MEMS TUESDAY, JUNE 4, 2002 • IF-TU INTERACTIVE FORUM • 1:30–4:30 PM WSCTC • CHAIR: RICK LUTZ, MAXIM INTEGRATED PRODUCTS • ROOM 6E IFTU-1: Harmonic Rejection Filters for the Dominant and Higher Waveguide Modes Based in the Slotted Strips A.A. Kirilenko, L.P. Mospan, Usikov Institute for Radiophysics and Electronics of the National Academy of Sciences of Ukraine IFTU-2: A Novel Compact mm-Wave Diplexer E. Ofli, R. Vahldieck, Swiss Federal Institute of Technology, Lab for Electromagnetic Fields and Microwave Electronics IFTU-3: Broadband TEM-mode Planar-rectangular Dielectric Waveguide Bandpass Filter and its Miniaturization A.C. Kundu, TDK R&D Corp., Phoenix, AZ IFTU-4: λ4 Stepped-impedance Resonator Bandpass Filters Fabricated on Coplanar Waveguide A. Sanada, H. Takehara, T. Yamamoto, I. Awai, Dept. of EE Engineering, Yamaguchi Univ. IFTU-5: A Stepped Cavity Resonator with Optimized Spurious Performance and Its Applications to BPFS K. Konno, M. Kubota, Antenna Giken Co., Ltd. IFTU-6: Efficient Analysis of Waveguide Filters by the Integral Equation Technique and the Bi-RME-method V.E. Boria, S. Cogollos, Univ. Politecnica de Valencia, Dpto. Comunicaciones, Valencia, Spain; M. Bozzi, F. Bruni, G. Conciauro, L. Perregrini, Univ. of Pavia, Dept. of Electronics, Pavia, Italy; B. Gimeno, Univ. de Valencia IFTU-7: Generation of RF Pulsewidth Modulated Microwave Signals Using Delta-Sigma Modulation J.S. Keyzer, R. Uang, M. Iwamoto, P.M. Asbeck, I. Galton, Univ. of California, San Diego; Y. Sugiyama, Hitachi Metals, Ltd. IFTU-8: Using Silicon-Germanium Mainstream BiCMOS Technology For X-band and LMDS (25–30 GHz) Microwave Applications S. Subbanna, R. Groves, B. Jagannathan, G. Freeman, E. Eld, D. Ahlgren, B. Martin, D. Herman, B. Meyerson, IBM Microelectronics IFTU-9: Low Frequency Noise in Boron Doped Poly-SiGe Resistors K.M. Chen, G.W. Huang, National Nano Device Lab; T.H. Yang, National Chiao Tung Univ. Materials Science and Eng. Dept.; H.J. Huang, C.Y. Chang, National Chiao Tung Univ. Electrons Eng. Dept. IFTU-10: A Fully-integrated Broadband Amplifier MMIC Employing a Novel Chip Size Package Y. Yun, M. Katsuno, K. Minagawa, T. Tanaka, M. Nishijima, H. Ishida, T. Nobusada, Semiconductor Device Research Center, Matsushita Electric Industrial Co., Ltd. IFTU-11: RF Performance Tradeoffs of SiGe HBT Fabricated by Reduced Pressure Chemical Vapor Deposition B. Mheen, D. Suh, H.S. Kim, S-Y. Lee, C-W. Park, S-H. Kim, K-H. Shim, J-Y. Kang, Advanced Microelectronics Lab, Electronics and Telecommunications Research Institute IFTU-12: A Novel Equivalent Circuit and Modeling Method for Defected Ground Structure and its Application to Optimization of a DGS Lowpass Filter J-H. Kim, J-H. Lee, S-H. Kim, J-S. Park, Div. of Information Technology Eng, Soonchunhyang Univ.; Asan, Korea; S-H. Myung, Ansoft, Korea IFTU-13: Microwave Planar Active Filters in GaAs and SiGe Technologies H. Bazzi, F. Biron, S. Bosse, L. Delage, B. Barelaud, L. Billonnet, B. Jarry, IRCOM — Univ. of Limoges IFTU-14: GSM 900/DCS 1800 Fractional-N Modulator with Two-point-modulation B. Neurauter, Institute for Communications and Information Engineering, Univ. of Linz, Austira; G. Märzinger, A. Schwarz, DICE Danube Integrated Circuit Engineering, Linz, Austria; R. Vuketich, R. Weigel, J. Fenk, M. Scholz IFTU-15: On The Stability of mm-Wave Power Amplifiers L.A. Samoska, S. Weinreb, D. Dawson, Caltech-Jet Propulsion Lab; K.Y. Lin, H. Wang, National Taiwan Univ.; Y.H. CHung, M. Aust, TRW IFTU-16: Output Harmonic Termination Techniques for AlGaN/GaN HEMT Power Amplifiers Using Active Integrated Antenna Approach Y. Chung, C.Y. Hang, S. Cai, C.P. Wen, K.L. Wang, T. Itoh, Univ. of California, Los Angeles, Dept. of Electrical Engineering, Los Angeles, CA; Y. Qian, Microsemi Corp. IFTU-17: An Advanced 2 W High Power Amplifier for CDMA 900 MHz System T.H. Kim, J.C. Lee, J.H. Kim, B. Lee, N.Y. Kim, C.S. Kim, K.Y. Lee, Kwangwoon Univ., Seoul, Korea; J.H. Moon, VSWR, An-yang, Korea IFTU-18: 2W Ku-band Coplanar MMIC HPA Using HBT for Flip-chip Assembly J.P. Fraysse, O. Vendier, M. Soulard, Alcatel Space Industries; P. Auxemery, United Micro. Semicond. IFTU-19: 1 and 2 W MMIC Power Amplifiers for Commercial K/Ka-band Applications J.M. Schellenberg, Schellenberg Associates IFTU-20: Characteristics of Microwave Power GaN HEMTs on 4" Si Wafers S. Manohar, A. Narayanan, A. Keerti, A. Pham, Clemson Univ.; R. Borges, K. Linthicum, Nitronex Corp. IFTU-21: Intercept Point Behavior of Ka-band GaAs High Power Amplifiers T. Merkle, A. Tessmann, S. Ramberger, Fraunhofer Institute for Applied Solid State Physics IFTU-22: Traveling-wave Tube Amplifier Performance Evaluation and Design Optimization for Applications in Multi-level Digital Communications J. Qiu, D. Abe, B.G. Danly, B. Levush, Naval Research Lab, Washington, DC; T.M. Antonsen, Jr., Univ. of Maryland, College Park, MD IFTU-23: An Adaptive Volterra Predistorter for the Linearization of RF High Power Amplifiers A. Zhu, T.J. Brazil, Dept. of Electronic and Electrical Engineering, Univ. College Dulbin, Ireland IFTU-24: A Low Cost Traveling Wave Tube for Wireless Communications B.K. Vancil, FDE Inc.; E.G. Wintucky, NASA Glenn Research Center IFTU-25: Effects of Anti-aliasing Filters in Feedback Path of Adaptive Predistortion W. Shan, Competence Center for Circuit Design, Dept. of Electroscience, Lund Univ., Lund, Sweden; L. Sundström, Ericsson Mobile Platforms AB, Scheelevägen Lund, Sweden IFTU-26: Error Signal Reuse in a Feedforward Amplifier A. Khanifar, M. Gurvich, B. Vassilakis, Powerwave Technologies Inc. IFTU-27: RF-interconnect for Multi-GBPS Digital Interface Based on 10 GHz RF Modulation n 0.18 µm CMOS H. Shin, Z. Xu, M.F. Chang, Univ. of California, Los Angeles IFTU-28: 50 GHz High Output Voltage Distributed Amplifiers for 40 Gb/s EO Modulator Driver Application C.H. Yuen, K.G. Laursen, D.N. Chu, K.A. Mar, OEpic Inc. IFTU-29: Development of 4-GSPS 2-bit ADC with GaAs ICs For Radio Astronomy M. Okiura, Dept. of Astronomy, School of Science, The Univ. of Tokyo; S. Iguchi, S.K. Okumura, Nobeyama Radio Observatory; M. Momose, Institute of Astrophysics and Planetary Science, Ibar; K. Matsumoto, N. Kawaguchi IFTU-30: 0.25 µm PHEMT 40Gb/S E/O Modulator Drivers J.M. Carroll, M. Coutant, M.S. Heins, C.F. Campbell, E. Reese, TriQuint Semiconductor Texas, Richardson, TX IFTU-31: Suppression of the Parallel-plate Noise in High-speed Circuits Using a Metallic Electromagnetic Band-gap Structure R. Abhari, G.V. Eleftheriades, Univ. of Toronto, The Edward S. Rogers Sr. Dept. of Elec. and Comp. Eng. IFTU-32: Results on a Direct Digital Receiver Operated with Fast Learning Networks IFTU-33: A 6.5 mW Receiver Front-end for Bluetooth in 0.18 µm CMOS F. Beffa, R. Vogt, W. Baechtold, Swiss Federal Institute of Technology (ETH); E. Zellweger, Asulab S.A., Marin, Switzerland; U. Lott, Acter A.G., Zurich, Switzerland IFTU-34: An Active SiGe Sub-harmonic Direct-conversion Receiver Front-end for 5-6 GHz Band Applications R.M. Svitek, S. Raman, Virginia Tech, Bradley Dept. of Electrical and Computer Engineering; D.A. Johnson, M/A-COM Integrated Semiconductor Business Unit IFTU-35: Soft Breakdown and Hot Carrier Reliability for CMOS RF Mixers Q. Li, J.S. Yuan, Chip Design and Reliability Lab, School of Electrical Engineering & Computer Science, Univ. of Central FL; J. Zhang, VLSI Tech. Lab, Agere Systems, Orlando, FL IFTU-36: High-Q Copper Inductors on Standard Silicon Substrate with a Low-K BCD Dielectric Layer H. Xiao, K.J. Chen, P.C-H. Chan, Hong Kong Univ. of Science and Technology IFTU-37: Geometry and Bias Current Optimization for SiGe HBT Cascode Low-noise Amplifiers Q. Liang, G.F. Niu, J.D. Cressler, Auburn Univ. Electrical and Computer Engineering Dept.; S. Taylor, Maxim Integrated Products; D.L. Harame, IBM Microelectronics IFTU-38: High Linearity Low-K BCD-bridged AlGaAs/InGaAs Power HFETs H-C. Chiu, M-J. Hwu, S-C. Yang,Y-J. Chan, National Central Univ., Chungli, Taiwan, ROC IFTU-39: Performance of a CMOS Bluetooth Transceiver IC with Copper RF Passives M.T. Doan, Y. Qian, E.S. Khoo, P.B. Khannur, S.C. Rustagi, J. Shi, P.D. Foo, A.B. Ajjikuttira, Institute of Microelectronics, Singapore IFTU-40: Effects of Dummy Patterns and Substrate on Spiral Inductors for Sub-micron RFICs J-H. Chang, C-K. Kim, Dept. of EECS, Korea Advanced Institute of Science and Technology; Y-S. Youn, H-K. Yu, Electronics and Telecommunications Research Institute (ETRI) IFTU-41: Schottky Junction Transistors for Micropower RFICs J. Spann, Z. Wu, P. Jaconelli, J. Yang, T J Thornton, Arizona State Univ., Dept. of Electrical Engineering and Center for Solid State Electronics IFTU-42: ESD Protection Design for 900 MHz RF Receiver with 8-kV HBM ESD Robustness M-D. Ker, W-Y. Lo, C-M. Lee, Hsinchu, Taiwan, Tamarack Microelectronics Inc., Science-based Ind. Park, Institute of Electronics, National Chiao-Tung Univ.; C-P. Chen, H-S. Kao, Hsinchu, Taiwan IFTU-43: Improvements to Performance of Spiral Inductors on Insulators D.J. Kelly, F.A. Wright, Peregrine Semiconductor IFTU-44: Octave Tunable, Highly Linear, RC-ring Oscillator with Differential Fine-coarse Tuning, Quadrature Outputs and Amplitude Control for Fiber Optic M.A.T. Sanduleanu, D. van Goor, H. Veenstra, Philips Research Eindhoven IFTU-45: A 2.45 GHz Fully-differential CMOS Image-reject Mixer for Bluetooth Application P.B.Khannur, Institute of Microelectronics, Singapore; S.L.Koh, Oki Techno Centre Singapore IFTU-47: High Performance Single Supply Power Amplifiers for GSM and DCS Applications Using True Enhancement Mode FET Technology E Glass, M. Shields, A. Reyes, Motorola Semiconductor Product Sector IFTU-48: Integrated 2.4 GHz CMOS Quadrature VCO with Symmetrical Spiral Inductors and Differential Varactors B. Chi, B. Shi, Institute of Microelectronics, Tsinghua Univ., Beijing, China IFTU-49: A Fully Monolithic SiGe Quadrature Voltage Controlled Oscillator Design for GSM/DCS-PCS Applications D. Cordeau, H. Cam, G. De Astis, ACCO, 78100 Saint-Germain-en-Laye, France; J.M. Paillot, L. Dascalescu, LAII-ESIP, IUT d’AngoulÍme 4, AngoulÍme, France IFTU-50: Hot Carrier And Soft Breakdown Effects on VCO Performance E. Xiao, J.S. Yuan, Univ. of Central Florida, School of Electrical and Computer Science IFTU-51: A 1.5 V 4 GHz Dynamic-loading Regenerative Frequency Doubler in a 0.35 µm CMOS Process J.M.C. Wong, H.C. Luong, Hong Kong Univ. of Science and Technology Electrical and Electronic Dept. IFTU-52: Very Low Phase-noise Fully-integrated Coupled VCOs H. Jacobsson, B. Hansson, Ericsson Microwave Systems; H. Berg, Chalmers Univ. of Technology; S. Gevorgian, Ericsson Microwave Systems and Chalmers Univ. IFTU-53: Wide-tuning-range Dual-VCOs for Cable Modem Receivers K. Stadius, K. Halonen, Helsinki Univ. of Technology, Electronic Circuit Design Lab IFTU-54: A 5.8 GHz Fully Integrated Low Power Low Phase Noise CMOS LC VCO for WLAN Applications J. Bhattacharjee, D. Mukherjee, E. Gebara, S. Nuttinck, J. Laskar, School of ECE, Georgia Institute of Technology, Atlanta, GA IFTU-55: A 5 GHz Fast-switching CMOS Frequency Synthesizer X. Yang, T. X. Wu, Univ. of Central Florida School of Electrical Engineering and Computer Science; J. McMacken, Agere Systems Inc. IFTU-56: A Wilkinson Power Divider on a Low Resistivity Si Substrate with a Polyimide Interface Layer for Wireless Circuits J. Papapolymerou, E.M. Tentzeris, School of ECE, Georgia Tech; G.E. Ponchak, NASA Glenn Research Center IFTU-57: Development and Verification of a New Non-linear MOSFET Model H. Romdane, E. Bergeault, B. Huyart, ENST-Dep. Comelec-CNRS-URA 820 IFTU-58: Design and Analysis of a Multi-layer Transformer Balun for Silicon RF Integrated Circuits H.Y.D. Yang, L. Zhang, J. Castaneda, Broadcom Corp. IFTU-59: Smoothing Gate Capacitance Models for CMOS Radio Frequency and Microwave Integrated Circuits CAD J. Dobes, Czech Technical Univ., Dept. of Radioelectronics O. Mireux, J-J. Brault, R.G. Bosisio, Centre de Recherche Avancée en Micro-ondes et Electronique Spatiale (PolyGrames), Ecole Polytechnique de Montréal 32 PANEL SESSIONS PM: RF-CMOS IN CELL PHONES: FACT OR FICTION? PW: RF MEMS: REVOLUTION OR EVOLUTION Date & Time: Monday, June 3; 12:00 to 1:15 PM Date & Time: Wednesday, June 5; 12:00 to 1:15 PM Location: Washington State Convention Center, Room 6E Location: Washington State Convention Center, Room 6A/B Organizers: Natalino Camilleri, RF & Wireless Design Services Fazal Ali, Nokia Organizers: N. Scott Barker, University of Virginia Larry E. Corey, DARPA/SPO Speakers: Stephen Dow, Motorola Stefan Heinen, Infineon Technologies Christian Kermarrec, ADI Stephen Lloyd, Conexant Ahmadreza Rofougaran, Broadcom Jacques C. Rudell, UC Berkeley Darek K. Shaeffer, BigBear Networks Bernard Xavier, National Semiconductor Speakers: Eric Varian, Raytheon Greg Tavik, Naval Research Laboratories John K. Smith, former DARPA Gabriel M. Rebeiz, University of Michigan While MEMS technology has been used for years as sensors and actuators in commercial low frequency applications, it has yet to penetrate deeply into the RF arena. To date, RF-MEMS have demonstrated improved performance of existing system architectures through device for device replacement. For instance, by replacing the PIN diode switch in switched line phase shifters with an RF-MEMS switch the loss is greatly reduced. However, do RF-MEMS have the potential to enable new architectures? Can they be cost-effective and compatible with existing RFIC technologies? RF-CMOS development has come a long way towards being implemented in several systems for multiple applications. One can find RFCMOS in some cordless devices, WLAN and Bluetooth products. However, in Cellular Handset systems, RF-CMOS has had a difficult time competing with the SiGe BiCMOS technology in offering the “best-inclass” RF performance while maintaining the lowest power consumption. The Panelist, representing various industries and academia, will address their views on the future of high performance RF-CMOS for mobile handsets. PTH: MAKING SENSE OR CENTS: WHICH WLAN TECHNOLOGY WILL SURVIVE? PT: IS THE SINGLE-CHIP RADIO DEAD? Date & Time: Thursday, June 6; 12:00 to 1:15 PM Location: Washington State Convention Center, Room 6A/B Date & Time: Tuesday, June 4; 12:00 to 1:15 PM Organizer: IceFyre Semiconductor Location: Washington State Convention Center, Room 6A/B Speakers: Organizers: Bob Jackson, University of Massachusetts Joy Laskar, Georgia Tech Speakers: Fred Schindler, RFMD Sanjay Moghe, RF Solutions Rob Roy, Mobillian Corporation Teresa Meng, Stanford University Paul McGoldrick, analogZONE (moderator) Mark Roberts, IceFyre Semiconductor Benno Ritter, Philips Semiconductor Kevin Negus, Proxim Teik Kheong Tan, 3Com Bent Hessen-Schmidt, SiGe Semiconductor Eric Blaufarb, Cisco Systems/WECA The popularity of 802.11b 2.4-GHz wireless Local Area Network (WLAN) applications has ensured that the wireless LAN industry has gained much more than just a toehold in the enterprise and home markets. Analysts are predicting that the enterprise WLAN equipment market alone will grow to over $4.6 billion in 2005. Even with this recent success, a number of questions concerning wireless LAN technologies and their applications remain. What do the various wireless LAN technologies have to offer? What are their drawbacks? When will security of wireless LAN become truly “wired equivalent”? How serious is the issue of backward compatibility, and how will it be solved? This panel will include representatives who cover the various wireless LAN technologies, including 802.11b, 802.11a and Bluetooth, all of whom will debate the merits and drawbacks of their chosen technology. The panel will also include a WLAN OEM representative and a WECA representative to challenge the panelists on interoperability. Issues the panel will address include interoperability, throughput, implementation, security, time-to-market, end-user experience and system cost. This panel session will address two questions: (1) are single chip radios viable now or in the future based upon technological and market requirements? (2) if single-chip radios are viable, for what applications: WLAN, Bluetooth, Handsets or are they relegated to garage door openers? Leading speakers from industry and academia are targeted to provide their views into the single-chip radio or the radio in a package debate. 33 IEEE MTT-S IMS TECHNICAL SESSIONS 8:00–9:30 AM WE1A High Power Amplifiers WATTS UP? WE1B Microwave and mm-Wave Sensor Applications WE1C Transmission Line Structures Chair: K. Ikossi, NRL Co-chair: J. Komiak, BAE SYSTEMS ROOM 608–609 Chair: P. Staecker, Photonic Systems Inc. Co-chair: Richard Sparks, ANRO Engineering Inc. ROOM 606–607 Chair: G.E. Ponchak, NASA Glenn Research Center Co-chair: E. Denlinger, Sarnoff Corp. ROOM 611–612 WE1A-1: A 20 W 2080-2200 MHz Hybrid Power Amplifier Optimized for Error Amplifier Applications E.J. Crescenzi, Jr., UltraRF, Sunnyvale, CA WE1B-1: Development of RF Carbon Nanotube Resonant Circuit Sensors for Gas Remote Sensing Applications S. Chopra, A. Pham, Holcombe Dept. of Electrical and Computer Engineering, Clemson Univ.; J. Gillard, A. M. Rao, Dept. of Physics and Astronomy, Clemson Univ. WE1C-1: High Performance Air Gap Transmission Lines for mmWave Applications I. Jeong, J-S. Lee, C-M. Nam, D-W. Kim, Telephus Inc.; S-H. Shin, J-H. Go, Y-S. Kwon, Dept. of EE, Korea Advanced Institute of Science and Technology WE1A-2: A 15 W PEP GaAs PHEMT MMIC Power Amplifier for 3G Wireless Transmitter Applications J. Staudinger, R. Sherman, T. Quach, M. Miller, L. Frye, Motorola, Semiconductor Products Sector WE1B-2: Integrated Microwave Sensor for Cavity-length Measurement with Sub-millimeter Accuracy A. Megej, M. Schuessler, B. Mottet, O. Yilmazoglu, K. Mutamba, H.L. Hartnagel, Institute of Microwave Engineering, Darmstadt Univ. of Technology; K. Beilenhoff, United Monolithic Semiconductor; A. Ziroff, C.D. Hamann, R. Baican WE1C-2: Reconfigurable Quasi-fractal Transmission Line Structures J. Sor, Y. Wang, T. Itoh, UCLA Microwave Electronics Lab 8:20 AM 8:10 AM 8:00 AM WEDNESDAY, JUNE 5, 2002 WE1A-3: 70% High Efficient C-band 27W Hetero-structure FET for Space Application H. Minamide, M. Kohno, N. Yoshida, K. Yajima, K. Mori, High Frequency and Optical Semiconductor Div., Mitsubishi Electric Corp., T. Ogata, T. Sonoda WE1A-4: Ka-band Coupled-cavity Amplifiers for Military Radar and Commercial Satellite Communication J.R. Legarra, P.E. Kolda, Communications and Power Industries, Palo Alto, CA; H.P. Freund, T.M. Antonsen, Jr., Science Applications International Corp., McLean, VA; B. Levush, Naval Research Lab, WE1B-3: A Planar Resonant Sensor for the Complex Permittivity Characterization of Materials E. Fratticcioli, M. Dionigi, R. Sorrentino, D.I.E.I of the Univ. of Perugia, Perugia, Italy WE1C-4: Modeling of Real-shaped LTCC Stripline Structure Having Sharpened Edges and Embedded Pores J.H. Jang, N. Ishitobi, C.H. Kim, R&D Center, Samsung Electromechanics, Suwon, Korea WE1B-4: Microwave Reflection Tomography Array for Damage Detection in Concrete Structures Y.J. Kim, M.Q. Feng, University of California, Irvine, Civil and Environmental Engineering Dept.; L. Jofre, Technical Univ. of Catalonia, Barcelona, Spain; F.D. Flaviis, Signal Theory & Communication Dept., University WE1C-5: High-isolation Bonding Pad with Depletion-insulation Structure for RF/Microwave Integrated Circuits on Bulk Silicon CMOS S. Lam, W.H. Ki, M. Chan, Dept. of Electrical & Electronic Engineering, Hong Kong Univ. of Science & Technology WE1B-5: Wireless MEMs IDT Ice Sensor K.A. Jose, G. Sunil, V.K. Varadan, V.V. Varadan, Pennsylvania State Univ., Univ. Park, PA WE1C-6: Porosity Effects on Coplanar Waveguide Porous Silicon Inteconnects I.K. Itotia, R.F. Drayton, Univ. of Minnesota, Electrical and Computer Engineering Dept. WE1C-7: Substrate Loss Mechanisms for Microstrip and CPW D.C. Lederer, J-P. Raskin, Microwave Lab Université Catholique de Louvain Belgium WE1A-5: High Performance Microwave Power Modules for Military and Commercial Systems M.A. Basten, D.R. Whaley, J. Duthie, V.O. Heinen, K.E. Kreischer, J. Tucek, A. Ferek, F. Trimble, B.M. Gannon, Electronic Systems, Northrop Grumman Corp. 9:30 AM 9:20 AM 9:10 AM 9:00 AM 8:50 AM 8:40 AM 8:30 AM WE1C-3: Miniaturized Slow-wave Coplanar Waveguide Circuits on High-resistivity Silicon J. Naylor, T.M. Weller, Univ. of South Florida; J.W. Culver, M. Smith, Raytheon WE1A-6: Production and Operation of a High-efficiency DBS-band Klystron Utilizing a Multistage Depressed Collector T. Habermann, R. Batra, R. Begum, E.W. McCune, E.L. Wright, Communications and Power Industries (CPI)/Microwave Power Products (MPP) Div. 34 WE1E Linear Modeling Chair: J. Papapolymerou, Georgia Institute of Technology Co-chair: S. Wetenkamp, SCEAN ROOM 602–604 Chair: M. Nakhla, Carleton Univ. Co-chair: W. Struble, M/ACOM ROOM 602–604 WE1D-1: Ultra Low Phase Noise SiGe HBT Application to a C-band Sapphire Resonator Oscillator G. Cibiel, O. Llopis, R. Plana, LAAS-CNRS, Toulouse, France; M. Régis, H. Lafontaine, SiGe Se; Y. Kersalé, V. Giordano, M. Chaubet 8:00 AM WE1D Advances in Microwave Oscillators WE1E-1: Implicit Space Mapping EM-based Modeling and Design Exploiting Preassigned Parameters J.W. Bandler, Bandler Corp. and McMaster Univ.; Q.S. Cheng, N. Georgieva, McMaster Univ. Dept. of Electrical and Computer Engineering; M.A. Ismail, Com Dev International Ltd. WE1F-1: Enhanced PML-like ABCs for Layered Media Transmission Line Termination A. Lauer, A. Wien, P. Waldow, I. Wolff, IMST GmbH 8:10 AM WE1F-2: Global Modeling of Active Microwave Devices Incorporating a Novel Large-signal Time-domain Fullhydrodynamic Physical Simulator Using Wavelet-based Adaptive GR Y.A. Hussein, S.M. El-Ghazaly, Arizona State Univ. Electrical Engineering Dept. WE1D-2: A Low Phase Noise Silicon VCO and an 18 GHz Push-push Oscillator L. Dussopt, G.M. Rebeiz, Univ. of Michigan, EECS Dept.; D. Guillois, Thales Microwave WE1E-2: Wide-band Compact Modeling of Spiral Inductors in RFICS D. Melendy, A. Weisshaar, Oregon State Univ., ECE Dept.; P. Francis, C. Pichler, K. Hwang, G. Srinivasan, National Semiconductor Corp. 8:20 AM WE1F Advances in Time-domain Techniques for EM Field Modeling Chair: P. Russer, Institute for High Frequency Engineering, Technical Co-chair: A. Beyer, Institute of Electrical Engineering ROOM 613–614 WE1E-4: New Extraction Algorithm for GaAs-HBTs with Low Intrinsic Base Resistance F. Lenk, M. Rudolph, Ferdinand-Braun-Institut für Höchstfrequenztechnik (FBH) 8:50 WE1D-4: C-band Oscillator Using High-Q Inductors Embedded in Multilayer Organic Packaging S-W. Yoon, M.F. Davis, K. Lim, S. Pinel, M. Maeng, J. Laskar, School of Electrical and Computer Engineering, Georgia Institute of Technology; C-H. Lee, RF Solutions Inc.; T. Nonaka, G. White, R. Tummala, Packaging Research Center WE1F-4: Demonstration and Suppression of Numerical Divergence Errors in FDTD Analysis of Practical Microwave Problems M. Celuch-Marcysiak, Institute of Radioelectronics, Warsaw Univ. of Technology WE1D-5: A Differentially-tuned CMOS LC VCO for Low-voltage Full-rate 10 Gb/s CDR Circuit D. Mukherjee, J. Bhattacharjee, J. Laskar, School of ECE, Georgia Institute of Technology, Atlanta, GA WE1E-5: Uncertainty Estimation and Optimal Extraction of Intrinsic FET Small Signal Model Parameters C. Fager, P. Linnér, Microwave Electronics Lab, Chalmers Univ. of Technology, Sweden; J.C. Pedro, Institute of Telecommunications, Univ. of Aveiro, Portugal WE1F-5: Analysis of Guided Wave Structures Using 3-D Envelope-finite Element Technique H-P. Tsai, Y. Wang, T. Itoh, Electrical Engineering Dept., Univ. of California, Los Angeles WE1E-6: An Exact Expression for the HBT Extrinsic Base-collector Capacitance Derived from S-parameter Measurements E. Wasige, B. Sheinman, D. Ritter, Microelectronics Research Center, Technion, Israel Institute of Technology WE1F-6: A Surface Impedance Approach for Modeling Multilayer Conductors in FDTD W. Thiel, L.P.B. Katehi, Univ. of Michigan, Electrical Engineering and Computer Science, Radiation Lab 8:40 AM 9:00 AM 9:10 AM 9:20 AM 9:30 35 WEDNESDAY WE1E-3: On the Synthesis of Equivalent Circuit Models for Multiports Characterized by Frequency-dependent Parameters R. Neumayer, A. Stelzer, R. Weigel, Institute for Communications and Information Engineering, JK Univ. Linz; F. Haslinger, BMW Group Munich, Germany AM WE1D-3: A Novel Microwave Oscillator Using Double-sided MIC K. Kawahata, N. Miyayoshi, M. Aikawa, Dept. of Electrical and Electronic Engineering, Saga Univ. AM 8:30 AM WE1F-3: Coupling Front Tracking and Wavelet Techniques for Fast Time Domain Simulations C.D. Sarris, L.P. Katehi, Radiation Lab, Dept. of Electrical Engineering and Computer Science, Univ. of Michigan IEEE MTT-S IMS TECHNICAL SESSIONS 10:10 AM–12:00 PM WE2A Distortion Correction Techniques for High Power Amplifiers WE2B Evolving Communication and Radar Systems WE2C Transitions, Polarizers and Coupling Characteristics in LTCC Chair: A. Katz, The College of New Jersey Co-chair: J.Goel, S&EG/TRW ROOM 608–609 Chair: R.H. Knoechel, Univ. of Kiel Co-chair: K. Breuer, BAE Systems ROOM 606–607 Chair: M. Dydyk, Motorola Co-chair: K. Wu, Ecole Polytechnique ROOM 611–612 WE2A-1: Power Amplifier Module with Digital Adaptive Predistortion for Cellular Phone. S. Kusunoki, K. Yamamoto, T. Hatsugai, K. Tagami, H. Nagaoka, Sony Ericsson Japan,Inc.; N. Tominaga, K. Nakajima, T. Sakurai, Taiyo Yuden Co.,Ltd.; K. Osawa, K. Tanabe, S. Sakurai, T. Iida, Toshiba Corp. WE2B-1: A Compact Ka-band 156 Mbps Transceiver for a Wireless LAN System Using PTTE/FR-4 Laminated MCMs K. Takahashi, S. Fujita, H. Yabuki, Matsushita Electric Industrial, Co.,Ltd.; M. Inoue, G. Wu, Communications Research Lab, Independent Administrative Institution WE2C-1: Analysis and Synthesis of In-line Coaxial-to-waveguide Adapters R. Levy, R. Levy Associates; L.W. Hendrick, Boeing Satellite Systems WE2A-2: Feedforward Amplifier for W-CDMA Base Stations with a New Adaptive Control Method Y.Y. Woo, Y. Yang, J. Yi, J. Nam, J.H. Cha, B. Kim, Pohang Univ. of Science and Technology, E.E.E. Dept. WE2B-2: An Obstacle Sensing System for a Railway Crossing Application: A 60 GHz mm-Wave Spread Spectrum Radar M. Watanabe, K. Okazaki, T. Fukae, Industrial Electronics and Systems Lab, Mitsubishi Electric Corp., N. Tamiya, N. Ueda, M. Nagashima, Trans WE2C-2: A Transition from Microstrip to Dielectric-filled Rectangular Waveguide in Surface Mounting K. Sano, TOKO, Inc.; T. Yoneyama, Tohoku Institute of Technology, Dept. of Communication Engineering WE2C-3: A mm-Wave Perpendicular Coax-to-microstrip Transition M.A. Morgan, Dept. of Electrical Engineering, California Institute of Technology; S. Weinreb, Jet Propulsion Lab, California Institute of Technology WE2A-3: A Novel Technology for Linearzing Traveling Wave Tube Amplifiers T. Chen, Y. Goren, C. Jensen, P.M. Lally, D.R. Gagne, Teledyne Electronic Technologies WE2B-3: Highly Integrated Microwave Point-to-point Outdoor Unit Optimized for Ultra High Volume Manufacturing J.T. Louhi, H. Somerma, K. Nikkanen, M. Koivisto, N. Nordman, T. Tuoriniemi, M. Hirvilampi, M. Pehkonen, K. Vepsäläinen, P. Bergholm, P. Ruhanen, M. Platan, J. Rantiala, P. Mikkonen, J. Mäkinen, Nokia WE2C-4: Mono-grooved Circular Waveguide Polarizers N. Yoneda, M. Miyazaki, T. Horie, H. Satou, Mitsubishi Electric Corp. WE2A-4: New Linearization Method for the Modulated Signals with High Peak-to-average Ratio: Peak-to-average Ratio Reduction and Expansion Y. Yang, Y.Y. Woo, J. Cha, J. Yi, B. Kim, Pohang Univ. of Science and Technology Dept. of Elecronic and Electric Engineering WE2B-4: Architecture and Algorithm for High Precision Image Rejection and Spurious Rejection Mixers Using Digital Compensation Y. Kim, S. Shin, K. Lee, KAIST, Electrical Engineering Dept. WE2C-5: Analysis of Coupling Characteristics Between Transmission Lines with a Buried Meshed-ground in LTCC-MCMs J-G. Kim, S-Y. Lee, C-Y. Cheon, School of EE Eng., Univ. of Seoul, Seoul, Korea; E-T. Lee, D-H. Kim, Amotech Co., Ltd., Seoul, Korea; J-H. Lee, S-H. Kim, J-S. Park, Div. of Information Technology WE2A-5: Reduction of Intermodulation Distortion in Active Phased Array Antenna Systems Using a Distortion Controller T. Kaho, T. Nakagawa, K. Araki, NTT Network Innovation Laboratories, NTT Corp. WE2B-5: Power Amplifier Transient Tracking in OFDM D.G. Bateman, S. Simoens, M. de Courville, Motorola CRM, Espace Technologique, France; G. Julien, Motorola WSSG, Geneva, Switzerland 11:40 AM 11:30 AM 11:20 AM 11:10 AM 11:00 AM 10:50 AM 10:40 AM 10:30 AM 10:20 AM 10:10 AM WEDNESDAY, JUNE 5, 2002 36 WE2F Applications of the Finite-difference Time-domain Method Chair: P. Khanna, Agilent Technologies Co-chair: D. Elad, Rastech ROOM 615–617 Chair: B. Pejcinovic, Portland State Univ. Co-chair: S. Goodnick, Arizona State Univ. ROOM 602–604 Chair: E.M. Tentzeris, School of ECE, Georgia Inst. of Tech. Co-chair: L. Roselli, Dept. of Elec. and Inf. Eng. ROOM 613–614 WE2D-1: 45 GHz Highly Integrated Phase-locked Loop Frequency Synthesizer in SiGe Bipolar Technology G. Ritzberger, Infineon Technologies, Technical Univ. of Vienna; J. Boeck, Infineon Technologies; A.L. Scholtz, Technical Univ. of Vienna WE2E-1: A New Behavioral Model Taking into Account Nonlinear Memory Effects and Transient Behaviors in Wideband SSPAs A. Soury, E. Ngoya, J.M. Nebus, IRCOM, Univ. of Limoges WE2F-2: Custom Hardware Implementation of the Finite-difference Time-domain (FDTD) Method R.N. Schneider, M.M. Okoniewski, L.E. Turner, Univ. of Calgary, Electrical and Computer Engineering Dept. 10:20 AM 10:30 WE2D-2: Single Chip 20 GHz VCO and Frequency Divider in SiGe Tehnology K. Ettinger, DICE GmbH & Co. KG WE2E-2: Accurate Prediction of PHEMT Intermodulation Distortion Using the Nonlinear Discrete Convolution Model A. Costantini, G. Vannini, Dept. of Engineering, Univ. of Ferrara, Ferrara, Italy; R.P. Paganelli, P.A. Traverso, A. Santarelli, F. Filicori, Dept. of Electronics, Univ. of B; D. Argento, G. Favre, M. Pagani WE2D-3: 38 GHz Push-push GaAs-HBT MMIC Oscillator M. Schott, H. Kuhnert, F. Lenk, J. Hilsenbeck, J. Würfl, W. Heinrich, Ferdinand-Braun-Institut für Höchstfrequenztechnik (FBH) WE2E-3: An Electrothermal BSIM3 Model for Large-signal Operation of RF Power LDMOS Devices O. Tornblad, C. Blair, Ericsson Inc., Microelectronics, Morgan Hill, CA WE2D-4: A 40 GHz-band Fully Monolithic VCO with a One-wave Length Microstrip Resonator for Accurate Oscillation Frequency H. Ikematsu, K. Kawakami, T. Katoh, K. Itoh, Mitsubishi Electric Corp. WE2F-4: Modeling and Optimization of RF-MEMs Reconfigurable Tuners with Computationally Efficient Time-domain Techniques N. Bushyager, M. Tentzeris, J. Papapolymerou, Georgia Institute of Technology, Atlanta GA; K. Lange, Raytheon Co., Tucson AZ 11:00 AM 10:50 AM 10:40 AM WE2F-3: Analysis of CMOS Interconnections Combining LE-FDTD Method and SOC Procedure F. Alimenti, V.Palazzari, P. Placidi, G. Stopponi, A. Scorzoni, L. Roselli, Univ. of Perugia 11:10 AM WE2E-4: Nonlinear Amplifier Modeling Taking into Account HF Memory Frequency F. Launay, Y. Wang, S. Toutain, IRCCyN - SETRA, École Polytechnique de Université de Nantes, France; D. Barataud, J.M. Nebus, R. Quere, IRCOM, Limoges, France WE2D-5: A Ku-band InGaP/GaAs HBT MMIC VCO with a Balanced and a Differential Topologies D-H. Baek, J-G. Kim, S. Hong, Dept. EECS, KAIST WE2F-5: Application of C-COM for Microwave Integrated Circuit Modeling K. Lan, S.K. Chaudhuri, S. Safavi-Naeini, Dept. of Electrical and Computer Engineering, Univ. of Waterloo, Waterloo, ON, Canada 11:20 AM WE2F-1: Equivalent Circuit of Radiating Longitudinal Slots in Dielectric Filled Rectangular Waveguides Obtained with FDTD Method R.V. Gatti, R. Sorrentino, M. Dionigi, Univ. of Perugia, Dept. Electronic and Information Engineering 11:40 AM 11:30 AM WE2F-6: Comparison of The Efficiency of Electromagnetic Solvers in The Time- and Frequency-domain for the Accurate Modeling of Planar Circuits and MEMs L.Pierantoni, M. Farina, T. Rozzi, Dipartimento di Elettronica ed Automatica, Univ. of Ancona, Ancona, Italy; F. Coccetti, W. Dressel, P.Russer, Technische Universität München, Lehrstuhl für Hochfrequenztechnik, Munich, Germany 37 WEDNESDAY AM WE2E Nonlinear Device Modeling I AM 10:10 WE2D Microwave and mm-Wave Signal Generation IEEE MTT-S IMS TECHNICAL SESSIONS 1:20–3:00 PM WE3A Power Amplifier Technologies for Broadband, High Efficiency Applications WE3B Direct Conversion Techniques for Wireless Systems WE3C New Leakage Effects on Printed Circuit Transmission Lines Chair: A. Platzker, Raytheon Co-chair: P. Asbeck, UCSD ROOM 608–609 Chair: S.D. Pritchett, Texas Instruments Inc. Co-chair: S.L. March, Texas Instruments Inc. ROOM 606–607 Chair: J. Zehentner, Czech Technical Univ. Co-chair: H. Shigesawa, Doshisha Univ. ROOM 611–612 WE3A-1: A 6 W LDMOS Broadband High Efficiency Distributed Power Amplifier Fabricated Using LTCC Technology L. Zhao, A. M. Pavio, Solid State Research Center, Motorola, Tempe, AZ WE3B-1: A 0.9-2.6 GHz Broadband RF Front-end for Direct Conversion Transceivers M. Kawashima, H. Hayashi, T. Nakagawa, K. Nishikawa, K. Araki, Nippon Telegraph and Telephone Corp., NTT Network Innovation Lab WE3C-1: The Danger of High Frequency Spurious Effects on Wide Microstrip Line F. Mesa, Dept. of Applied Physics, Univ. of Seville; D.R. Jackson, Dept. of ECE, Univ. of Houston WE3A-2: Optimum Bias Conditions for Linear Broadband InGaP/GaAs HBT Power Amplifiers M. Iwamoto, M. Vaidyanathan, P.M. Asbeck, Univ. of California at San Diego, C.P. Hutchinson, J.B. Scott, T.S. Low, D.C. D’Avanzo, Agilent Technologies WE3B-2: Six-port Direct Digital Receiver (SPDR) and Standard Direct Receiver (SDR) Results for QPSK Modulation at High Speeds J-C. Schiel, S.O. Tatu, K. Wu, R.G. Bosisio, Centre de Recherche en Micro-ondes et Electronique Spatiale (PolyGrames), Ecole Polytechnique de Montreal WE3C-2: Frequency Dependent Characteristics of Radiation from a Voltage Source on a Covered Microstrip Line W.L. Langston, J.T. Williams, D.R. Jackson, Dept. of ECE, Univ. of Houston; F. Mesa, Microwave Group, Univ. of Seville WE3A-3: High Efficiency Wideband 6 To 18 GHz PHEMT Power Amplifier MMIC J.J. Komiak, W. Kong, K. Nichols, BAE Systems Information and Electronic Warfare Systems WE3B-3: Development of A Low-IF Receiver and a Fixed Wireless Utility Network S. Thumaty, A. Pham, Dept. of Electrical and Computer Engineering, Clemson Univ.; H. van Wyk, SchlumbergerSema Utilities, Union, SC WE3C-3: Approximate Analytical Evaluation of the Continuous Spectrum in a Substrate-superstrate Dielectric Waveguide P. Baccarelli, P. Burghignoli, F. Frezza, A. Galli, G. Lovat, La Sapienza Univ. of Rome, Electronic Engineering Dept., Rome, Italy; D.R. Jackson, Univ. of Houston, Dept. of ECE, Houston, TX. WE3B-4: A Microwave Communication Link with Self-heterodyne Direct Down Conversion and System Predistortion J. Park, Y. Wang, T. Itoh, Electrical Engineering Dept., Univ. of California, Los Angeles WE3C-4: Significant Contribution of Nonphysical Leaky Mode to the Fields Excited by a Practical Source in Printed Circuit Transmission Lines M. Tsuji, S. Ueki, H. Shigesawa, Doshisha Univ. Dept. of Electronics WE3A-4: A Broadband, Push-pull Power MMIC Operating at K/Ka-band Frequencies J.M. Schellenberg, Schellenberg Associates 2:50 PM 2:40 PM 2:30 PM 2:20 PM 2:10 PM 2:00 PM 1:50 PM 1:40 PM 1:30 PM 1:20 PM WEDNESDAY, JUNE 5, 2002 WE3A-5: A New Amplifier Power Combining Scheme with Optimum Efficiency under Variable Outputs C.Y. Hang, Y. Wang, T. Itoh, Electrical Engineering Dept., Univ. of California, Los Angeles, WE3A-6: W-band InN/InGaAs/InP DHBT MMIC Power Amplifiers Y. Wei, S. Lee, K. Sundararajan, M. Dahlstrom, M. Urteaga, M. Rodwell, Univ. of California Electrical and Computer Engineering Dept. WE3C-5: Novel Selected Modes on the Conductor-backed Slotline J. Zehentner, J. Machac, J. Mrkvica, Czech Technical Univ. WE3A-7: RF Performance and Thermal Analysis of AlGaN/GaN Power HEMTs in Presence of Self-heating Effects S. Nuttinck, J. Laskar, Yamacraw Design Center, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA; E Gebara, Quellan Inc., Atlanta, GA; B. Wagner, Georgia Tech Research Center 38 WE3D Efficient Modeling Techniques for Circuit Simulation WE3E Nonlinear Device Modeling II Chair: A.K. Sharma, TRW Co-chair: R. Goyal, TeleVersal Systems Inc. ROOM 615–617 Chair: S.K. Rockwell, Motorola Co-chair: G.F. Manes, Univ. of Florence ROOM 602–604 WE3D-1: A Symmetry Device to Speed-up Circuit Simulation and Stability Tests S. Ramberger, T. Merkle, Fraunhofer Institute for Applied Solid-state Physics, Freiburg, Germany WE3E-1: Novel Technique for Determining Bias, Temperature and Frequency Dependence of FET Characteristics A.E. Parker, Dept. of Electronics, Macquarie Univ., Sydney Australia; J.G. Rathmell, School of Electrical Engineering, The Univ. of Sydney, Australia WE3D-2: Feasible Adjoint Sensitivity Technique (FAST) for EM Design Optimization N.K. Georgieva, S. Glavic, M. Bakr, J.W. Bandler, (and Bandler Corp.), McMaster Univ., Dept. of Electrical and Computer Engineering WE3E-2: Towards a Unified Method to Implement Transit-time Effects in PI-topology HBT Compact Models M. Rudolph, F. Lenk, R. Doerner, P. Heymann, Ferdinand-Braun-Institut fuer Hoechstfrequenztechnik (FBH) WE3D-3: On Passive Time-domain Macromodels of Distributed Transmission Line Networks A. Dounavis R. Achar, M. Nakhla, Carleton Univ., Dept. of Electronics WE3E-3: Measurement and Modelling of Static and Dynamic Breakdowns of Power GaInP/GaAs HBTs S. Heckmann, J-M. Nébus, R. Quéré, IRCOM, Univ. of Limoges, France; D. Floriot, Thales Research and Technology, Orsay, France; P. Auxemery, United Monolithic Semiconductors, Orsay, France WE3D-4: Fast And Accurate CAD of Narrow Band Waveguide Filters Applying an Electromagnetic Segmentation Method D. Bariant, S. Bila, D. Baillargeat, S. Verdeyme, P. Guillon, IRCOM UMR WE3E-4: A Simple Practical Technique for Estimating the Junction Temperature and the Thermal Resistance of a GaAs HBT M. Olavsbråten, Norwegian Univ. of Science and Technology, Dept. of Telecommunication, Trondheim, Norway. ALSO OCCURRING Wednesday, June 5, 1:20–3:00 PM Special Session on the 50th Anniversary of the MTT WSCTC, Room 613–614 2:50 PM 2:40 PM 2:30 PM 2:20 PM 2:10 PM WEDNESDAY 2:00 PM 1:50 PM 1:40 PM 1:30 PM 1:20 PM NOTES WE3D-5: Coupling of Large Number of Vias in Electronic Packaging Structures and Differential Signaling H. Chen, Univ. of Washington, Dept. of Electrical Engineering, Seattle, WA; L. Tsang, City Univ. of Hong Kong, Dept. of Electrical Engineering, Hong Kong WE3E-5: A Novel Extraction Method for a Fully Electro-thermal Large-signal Model of HBT H.M. Park, S. Hong, Dept. EECS, KAIST, R. Green, Dynalinear Technologies Inc. WE3D-6: Full Wave Analysis of Isolated Pocket to Improve Isolation Performances on Silicon Based Technology. D. Bajon, ENSAE Groupe MOSE; S. Wane, H. Baudrand, ENSEEIHT Len7; P. Gamand, Philips Semiconductor France Session Chair and Moderator: Leo Young, Consultant, Washington, DC Panelists: H. George Oltman Jr., Consultant, Albuquerque, NM Harold Sobol, retired, Dallas, TX Kiyo Tomiyasu, Lockheed Martin, Philadelphia, PA Ted Saad, retired, Weston, MA James Wiltse, Georgia Tech, Atlanta, GA The IEEE Microwave Theory and Techniques Society celebrates its 50th birthday this year, along with 50 years of great progress in microwave technology. This session will review briefly both the history of microwave technology over the past 50 years and the history of the Society. The more daring panelists may attempt a prediction as to the future. The panelists are eminent contributors to both the technology and the Society. Each will present a short account of the highlights from his perspective, and it is hoped there will be time for discussion and questions afterwards, including from the audience. 39 IEEE MTT-S IMS TECHNICAL SESSIONS 3:30–5:00 PM WE4A RF Power Amplifiers for Wireless Applications WE4B New Technologies for Communications Systems WE4C New Periodic Structures and Effects Chair: C.E. Weitzel, Motorola Inc. Co-chair: A. Pham, Clemson Univ. ROOM 608–609 Chair: J. Sitch, Nortel Networks Co-chair: J.B. Horton, J.B. Horton Group ROOM 606–607 Chair: A. Omar, Univ. of Magdeburg Co-chair: D.R. Jackson, Univ. of Houston ROOM 611–612 WE4A-1: High Performance Silicon Bipolar Power Amplifier for 1.8 GHz Applications F. Carrara, A. Castorina, G. Palmisano, Universita di Catania, Facolta di Ingegneria, DEES; A. Scuderi, STMicroelectronics Catania Site WE4B-1: Broadband Highly Integrated LTCC Front-End Module for IEEE 802.11a WLAN Applications C-H. Lee, A. Sutono, S. Yoo, RF Solutions, Atlanta GA; S. Chakraborty, J. Laskar, Georgia Institute of Technology; D. Heo, National Semiconductor, Norcross GA WE4C-1: Negative Refractive Index Metamaterials Supporting 2-D Waves A.K. Iyer, G.V. Eleftheriades, Edward S. Rogers Sr. Dept. of Electrical & Computer Engg., Univ. of Toronto, Ontario, Canada WE4A-2: A 2.4 GHz High Efficiency SiGe HBT Power Amplifier with High-Q LTCC Harmonic Suppression Filter A. Raghavan, M. Maeng, K. Lim, J. Laskar, Georgia Institute of Technology, School of Electrical and Computer Engineering; D. Heo, National Semiconductor Inc.; A. Sutono, RF Solutions WE4B-2: DCS1800 Base Station Receiver Integrated in 0.25 µm CMOS O. Boric-Lubecke, P. Gould, Bell Labs, Lucent; J. Lin, Agere Systems WE4C-2: Characteristics of Ka-band Waveguide Employing Electromagnetic Crystal Sidewalls J.A. Higgins, H. Xin, A. Sailer, Rockwell Scientific Co. WE4C-3: THz Pulse Propagation in Plastic Photonic Crystal Fibers H. Han, H. Park, M. Cho, J. Kim, Dept. of Electrical and Computer Engineering, Pohang Univ. of Science and Technology; I. Park, H. Lim, Dept. of Electrical and Computer Engineering, Ajou Univ. WE4A-3: The Maximum Operating Region in SiGe HBTs A. Inoue, R. Hattori, Y. Matsuda, Mitsubishi Electric Corp.; . Nakatsuka, Miyoshi Electronics Corp. 4:30 PM 4:40 WE4B-4: Design of High Speed Master-slave D-Type Flip-flop in InP DHBT Technology A. Kasbari, OPTO+, Alcatel R&I, Marcoussis France/ENSEA, Cergy-Pontoise France; P. André, A. Konczykowska, M. Riet, S. Blayac, J. Godin, OPTO+, Alcatel R&I, Marcoussis France; H. Ouslimani, ENSEA, Cergy-Pontoise France WE4C-5: Dispersion Characteristics of EME Microstrip at First Higher Order C-K. Wu, C-K. Tzuang, Institute of Communication Engineering, National Chiao Tung Univ. WE4A-5: Performance of GaAs-on-Si Power Amplifier for Wireless Handset Applications N. Escalera, R. Emrick, S. Franson, B. Farber, G. Garrison, J. Holmes, S. Rockwell, B. Bosco, Physical Sciences Research Labs, Motorola Inc. WE4A-6: Broadband High Efficiency Monolithic InGaP/GaAs HBT Power Amplifiers for 3G Handset Applications H. Jäger, A.V. Grebennikov, E.P. Heaney, M/A-COM Eurotec Operations, Ireland; R. Weigel, Univ. of Linz, Austria 4:50 PM WE4C-4: Radiation from Ground-plane Photonic Bandgap Microstrip Waveguides N. Shino, Z. Popovic, Univ. of Colorado, Dept. of Electrical and Computer Engineering WE4C-6: EBG-Enhanced Inductor H-S. Wu, C-K. Tzuang, Institute of Electrical Communication Engineering, National Chiao Tung Univ. WE4B-5: A GaAs MHEMT Distributed Amplifier with Greater than 250 GHz Gain-bandwidth Product for 40-Gb/S Optical Applications M.S. Heins, C.F. Campbell, M-Y. Kao, M.E. Muir, J. M. Carroll, TriQuint Semiconductor WE4A-7: InGaP PHEMTs for 3.5 GHz W-CDMA Applications E. Lan, E. Johnson, B. Knappenberger, Motorola, Digital DNA Lab, SPS; M. Miller, Motorola, Wireless Infrastructure Systems Div., SPS 5:00 PM WE4B-3: Development of SOI Based MMICs for Wireless LAN Applications S. Pinel, S. Chakraborty, S. Venkataraman, S. Mandal, S. Nuttinck, J. Bhattacharjee, D. Mukherjee, Joy Laskar, School of Electrical and Computer Engineering, Georgia Institute of Technology WE4A-4: Implementation of RF Power MOS in 0.18 µm CMOS Technology for Single Chip Solution H-M. Hsu, C.H. Chen, Dept. of Electrical Engineering, National Taiwan Univ., Taipei, Taiwan ROC; C-W. Chen, J-G. Su, T-H. Yeh, J.C-H. Lin, J.Y-C. Sun, Research Development Center PM 4:20 PM 4:10 PM 4:00 PM 3:50 PM 3:40 PM 3:30 PM WEDNESDAY, JUNE 5, 2002 40 WE4C-7: Reduced Size Capacitive Defect EBG Resonators X. Gong, W.J. Chappell, L.P.B. Katehi, EECS Dept., Univ. of Michigan, Ann Arbor WE4D CAD Techniques Using Computational Intelligence WE4E Applications of Time Domain Methods Chair: K.C. Gupta, Univ. of Colorado at Boulder Co-chair: Q.J. Zhang, Carleton Univ. ROOM 615–617 Chair: S. El-Ghazaly, Dept. of Elect. Eng., Arizona Co-chair: W. Gwarek, Warsaw Univ. of Technology ROOM 602–604 WE4D-1: Advanced Microwave Modeling Framework Exploiting Automatic Model Generation, Knowledge Neural Networks and Space Mapping V. Devabhaktuni, B. Chattaraj, Q.J. Zhang, Dept. of Electronics, Carleton Univ., Ottawa, ON Canada; M.C.E. Yagoub, SITE, Univ. of Ottawa, Ottawa, ON Canada WE4E-1: A General Framework for Spice-TLM Interconnection P.P.M. So, W.J.R. Hoefer, Univ. of Victoria, Dept. of Electrical and Computer Engineering WE4D-2: Neural Based Dynamic Modeling of Nonlinear Microwave Circuits J. Xu, Q.J. Zhang, Dept. of Electronics, Carleton Univ., Ottawa, ON, Canada; M.C.E. Yagoub, SITE, Univ. of Ottawa, Ottawa, ON Canada WE4E-2: FDTD Study of Surface Waves in Microstrip and Patch Structures E. Semouchkina, G. Semouchkin, W. Cao, Pennsylvania State Univ. Materials Research Institute; R. Mittra, Pennsylvania State Univ. Dept. of Electrical Engineering WE4D-3: A Systematic Approach to a Reliable Neural Model for PHEMT Using Different Numbers of Training Data M. Joodaki, G. Kompa, Univ. of Kassel, High Frequency Engineering Dept. WE4E-3: Time Domain Field Synthesis with 3D Symmetric Condensed Node TLM M.H. Bakr, McMaster Univ., Hamilton, Canada; P.P.M. So, W.J.R. Hoefer, Univ. of Victoria, Canada WEDNESDAY WE4D-4: A Novel Design Approach for Microwave Planar Filters S.F. Peik, Univ. of Applied Sciences Bremen, Bremen, Germany; R.R. Mansour, Univ. of Waterloo, Waterloo, ON Canada WE4D-5: EM-simulator Based Parameter Extraction and Optimization Technique for Microwave and mm-Wave Filters P. Harscher, E. Ofli, R. Vahldieck, Swiss Federal Institute of Technology, Lab for Electromagnetic Fields and Microwave Electronics (IFH); S. Amari, Royal Military College of Canada, Dept. ECE 4:40 WE4D-6: Computer-aided Tuning of Microwave Filters Using Fuzzy Logic V. Miraftab, R.R. Mansour, Electrical and Computer Engineering Dept., Univ. of Waterloo WE4E-6: A New 2-D Image Reconstruction Algorithm Based on FDTD and Design Sensitivity Analysis N-W. Kang, Y-S. Chung, H-K. Jung, School of Electrical Engineering, Seoul National Univ.; C. Cheon, Dept. of Electronis, Univ. of Seoul 5:00 PM 4:50 PM WE4E-4: Toward Accurate Time-domain Simulation of Highly Conductive Materials C. Yuan, Z. Chen, Dalhousie Univ. Electrical and Computer Engineering Dept. WE4E-5: Lumped Device Modeling with FDTD Including Packaging Effects B.P. Koh, I.J. Craddock, P. Urwin-Wright, C.J. Railton, Univ. of Bristol, Center for Communication Research PM 4:30 PM 4:20 PM 4:10 PM 4:00 PM 3:50 PM 3:40 PM 3:30 PM NOTES ALSO Wednesday, June 5, 3:00–5:00 PM OCCURRI NG Special Interactive Forum on the 50th Anniversary of the MTT WSCTC, South Lobby This Special Interactive Forum will take place in the historical exhibit area immediately following the Special Session on the 50th Anniversary of the MTT. Authors will present their work from the 50th Anniversary Special Issue of the MTT Transactions. 41 WEDNESDAY, JUNE 5, 2002 • IF-WE INTERACTIVE FORUM • 1:30–4:30 PM WEDNESDAY WSCTC • CHAIR: ROB HAMILTON, TRIQUINT SEMICONDUCTOR • ROOM 6E IFWE-1: Measurements on Dielectric and Radiation Loss of Flexible Circular Dielectric Waveguides in Q-band J.R. Sohn, H.J. Seo, J-W. Han, H-S. Tae, School of Electrical Engineering and Computer Sciences, Kyungpook Nat’Univ.; J-H. Lee, Radio Science and Communication Engineering, Hongik Univ. IFWE-2: A Technique for Reducing the Size of Amplifiers Using Defected Ground Structure J-S. Lim, Y-T. Lee, J-H. Han, S. Nam, School of Electrical Engineering, Seoul National Univ., Seoul, ROK; J-S. Park, D. Ahn, Div. of Information Technology Engineering, SoonChunHyang Univ., Chungnam, IFWE-3: A New Sandwich Structure of Photonic Bandgap Y. Pang, B. Gao, Electronic Engineering Dept., Tsinghua Univ., State Key Lab on Microwave and Digital Communications, Beijing, China IFWE-4: Amplifier Design Using λ/4 High Impedance Bias Line with Defect Ground Structure (DGS) S-G. Jeong, D-K. Hwang, Y-C. Jeong, C-D. Kim, Chonbuk National Univ. IFWE-5: A Derivation of a Class of 3-port Baluns from Symmetrical 4-port Networks Y.C. Leong, K.S. Ang, C.H. Lee, DSO National Lab IFWE-6: An Inverted Coplanar Coupler with Integral Microstrip Interfaces and Bias Crossover E.J. Crescenzi, Jr., UltraRF, Sunnyvale, CA IFWE-7: Dividing and Filtering Function Integration for the Development of a Band-pass Filtering Power Amplifier S. Avrillon, A. Chousseaud, S. Toutain, IRCCyN UMR CNRS 6597 IFWE-8: Design Method of a Dual Band Balun and Divider J.H. Sung, S.H. Son, H.J. Lee, Micro-Radio Wave Technologies Ltd, ROK; G.Y. Kim, School of Information and Communication, Tamna Univ., ROK; Y.J. Song, Y.W. Jeong, H.S. Park, D. Ahn, Div. of Information Technology Eng IFWE-9: TFbar Filters for 2 GHz Wireless Applications K-W. Kim, J-G. Yook, M-G. Gu, W-Y. Song, Y-J. Yoon, H-K. Park, Dept. of EE Eng., Yonsei Univ., Seoul, Korea IFWE-10: Ferromagnetic Composite-based and Magnetically-tunable Microwave Devices E. Salahun, G. Tanné, P. Quéffélec, P. Gelin, LEST, UBO/ENSTBr, Brest Cedex, France; A-L. Adenot, O. Acher, CEA, Le Ripault, Monts, France IFWE-11: Field Distributions in Six-port Gyroelectric Semiconductor Circulators with Coplanar Waveguide (CPW) Feeders Z.M. Ng, L.E. Davis, R. Sloan, Univ. of Manchester Institute of Science & Technology (UMIST), Dept. EE&E IFWE-12: A Novel Microwave Absorber with Surface-printed Conductive Line Patterns M. Amano, Y. Kotsuka, Dept. of Communications Engineering, Tokai Univ. IFWE-13: Design of Narrow-band Tunable Band-pass Filters Based on Dual-mode STO Disc Resonators A. Deleniv, A. Eriksson, S. Gevorgian, Microwave and High Speed Research Center, Ericsson Microwave Systems, Moelndal, Sweden, Dept. of Microelectronics MC-2, Chalmers Univ. of Technology, Sweden IFWE-14: Microwave Characterization of Thin Film BST Material Using a Simple Measurement Technique Z. Jin, Dept. of Electrical and Computer Engineering, N. Carolina State Univ., Raleigh, NC; A. Tombak, J-P. Maria, B. Boyette, G.T. Stauf, A.I. Kingon, A. Mortazawi IFWE-15: High-Q mm-Wave Varactors: Extended Tuning Range and Discrete-position Designs L. Dussopt, G.M. Rebeiz, Univ. of Michigan, EECS Dept. IFWE-16: Silicon Micromachined RF MEMs Ressonators K.M.Strohm, B. Schauwecker, J-F. Luy, Fellow, W. Heinrich, DaimlerChrysler Research Center, Ulm, Germany; F.J. Schmückle, Ferdinand-Braun-Institut (FBH), Berlin, Germany IFWE-17: Gas Damping Model for a RF MEM Switch and Its Dynamic Characteristics T. Veijola, T. Tinttunen, Helsinki Univ. of Technology, Finland; H. Nieminen, V. Ermolov, T. Ryhanen, Nokia Research Center, Finland IFWE-18: Digital-type RF MEMs Switched Capacitors J. Rizk, G.M. Rebeiz, Radiation Lab, EECS Dept, Univ. of Michigan, Ann Arbor IFWE-19: Series Switch Compatible With CMOS Technology Y. Cai, L.P.B. Katehi, Univ. of Michigan, Radiation Lab, Dept. of Electrical Engineering and Computer Science, Ann Arbor, MI IFWE-20: Low Cost Low Actuation Voltage Copper RF MEMs Switches D. Balaraman, S. Bhattacharya, F. Ayazi, J. Papapolymerou, Georgia Tech IFWE-21: Atomic Layer Deposition (ALD) Technology N. Hoivik, J. Elam, S. George, K.C. Gupta, V.M. Bright, Y.C. Lee, Univ. of Colorado at Boulder IFWE-22: Polyimide Film Based RF MEMs Switches R. Ramadoss, S. Lee, V.M. Bright, Y.C. Lee, K.C. Gupta, Univ. of Colorado at Boulder, Boulder, CO IFWE-23: Distributed MEMs Phase Shifters on Silicon Using Tapered Impedance Unit Cells B. Lakshminarayanan, T. Weller, Univ. of South Florida, Electrical Engineering Dept. IFWE-24: 40 GHz Monolithic Integrated Mixer in SiGe Bipolar Technology S. Hackl, J. Böck, M. Wurzer, A.L. Scholtz, Infineon Technologies, Technical University of Vienna IFWE-25: Designing Reliable High-power Limiter Circuits with GaAs Pin Diodes D.G. Smith, D.D. Heston, J.G. Heston, B.R. Heimer, Raytheon Systems Co.; K. Decker, TriQuint Semiconductor IFWE-26: A 94 GHz High Performance Quadruple Subharmonic Mixer MMIC K. Kanaya, T. Hisaka, T. Ishikawa, S. Sakamoto, High Frequency and Optical Semiconductor Div., Mitsubishi Electric Corp.; K. Kawakami, Information Technology R&D Center, Mitsubishi Electric Corp. IFWE-27: Harmonic Boosting for High Performance Mixers S. Chakraborty, C-L. Lin, J. Laskar, Georgia Institute of Technology, ECE, Atlanta GA; B. Matinpour, RF Solutions Inc., Atlanta GA IFWE-28: Development of Ku-band Receiver/Downconverter for Satellite Transponders J-C. Jeong, Y-H. Lim, B-J. Jang, I-B. Yom, S-P. Lee, ETRI, Communications Satellite Development Center IFWE-29: The Design of SiGe HBT LNA for IMT-2000 Mobile Application J. Lee, G. Lee, J.H. Kim, J.C. Lee, B. Lee, N.Y. Kim, Kwangwoon Univ., Seoul, Korea, Alabama Microelectronics Science and Technology Center, Auburn Univ., AL IFWE-30: THz Radiation Using High Power, Microfabricated, Wideband TWTs C.L. Kory, Analex Corp./NASA Glenn Research Center, Cleveland, OH; J.H. Booske, Univ. of Wisconsin, Madison; W.-J. Lee, S. Gallagher, D.W. van der Weide, S. Limbach, S. Bhattacharjee IFWE-31: Simulation and Measurement Results of 150 GHz Integrated Silicon IMPATT Diodes M. Luschas, R. Judaschke, Arbeitsbereich Hochfrequenztechnik, TU Hamburg-Harburg, Germany; J.-F. Luy, DaimlerChrysler Research Center, Ulm, Germany IFWE-32: A Set of Integrated Circuits for 60 GHz Radio Front-end M. Kärkkäinen, M. Varonen, J. Riska, V. Porra, P. Kangaslahti, Electronic Circuit Design Lab, Helsinki Univ. of Technology IFWE-33: mm-Wave Direct Quadrature Converter Integrated with Antenna for Broad-band Wireless Communications J-Y. Park, S-S. Jeon, Y. Wang, T. Itoh, Univ. of California, Los Angeles, Dept. of Electrical Engineering IFWE-34: A Novel HMSM Photodetector with Resonant Cavity for Short Haul Communications X. Chen, B. Nabet, Electrical and Computer Engineering Dept., Drexel Univ., Philadelphia, PA; F. Quarantab, A. Cola, Institute of Microelectronics, National Research Council; M. Curriec IFWE-35: Effect of Substrate Modes In 40 Gbit Travelling Wave LiNbO3 Modulators K. Goverdhanam, Waveguide and Electro-Opto Research, Agere Systems IFWE-36: Experimental Results for a CW-mode Optically Controlled Microwave Switch with a Carrier-confinement Structure S. Lee, Y. Kuga, R.A. Mullen, Dept. of Electrical Engineering, Univ. of Washington IFWE-37: Direct Carrier Modulation for Wireless Digital Communications Using an Improved Microwave-photonic Vector Modulator (MPVM) Approach S. Chandramouli, W.D. Jemison, Dept. of ECE Lafayette College; E. Funk, Naval Research Lab IFWE-38: A Novel Dual Frequency Rectenna for High Efficiency Wireless Power Transmission at 2.45 and 5.8 GHz Kai Chang, Texas A&M Univ., Dept. of Electrical Engineering IFWE-39: An Investigation on the Effects of the Array Parameters on the Performance of Spatial Power Amplifiers with Hard Horn Feeds M. Ozkar, N. Carolina State Univ., Dept. of Electrical Engineering; A. Mortazawi, Univ. of Michigan, Dept. of Electrical Engineering and Computer Science IFWE-40: Radio-wave Beam Shaping Using Holograms J. Meltaus, J. Salo, E. Noponen, M.M. Salomaa, MilliLab, Radio Lab, Helsinki Univ. of Technology; A. Räisänen is presently visiting Observatoire de Paris, Paris, France IFWE-41: How to Increase Locking Range of Coupled Oscillator Cells Without Lowering Q J. Shen, L.W. Pearson, ECE Dept., Clemson Univ. IFWE-42: Bandwidth Improvement in a Tile Based Spatial Power Amplifier A. Al-Zayed, S. Ortiz, N. Carolina State Univ., Dept. of Electrical Engineering and Computer Science; A. Mortazawi, Univ. of Michigan, Dept. of Electrical Engineering and Computer Science, IFWE-43: A 10 GHz Integrated Class-E Oscillating Annular Ring Element for High-efficiency Transmitting Arrays J.A. Hagerty, Z. Popovic, Univ. of Colorado at Boulder IFWE-44: A New mm-Wave Printed Dipole Phased Array Antenna Using Microstrip-fed Coplanar Stripline Tee Junctions K. Chang, Texas A&M Univ., Dept. of Electrical Engineering IFWE-45: A Novel Broadband T/R Module for Phased Array Applications in Wireless Communications C. Wang, C.T. Rodenbeck, M.R. Coutant, K. Chang, Texas A&M Univ. Dept. of Electrical Engineering IFWE-46: Multi-layer Spatial Angular Filter with Air Gap Tuner to Suppress the Grating Lobes of Microstrip Patch Arrays Y. Lee, S.H. Jeong, W.S. Park, Dept. of Electronic and Electrical Engineering,Pohang Univ. of Science and Technology; J.S. Yun, S.I. Jeon, Electronics and Telecommunications Research Institute IFWE-47: Integrated MEM Antenna System for Wireless Communications B.A. Cetiner, C.H. Chang, J.Y. Qian, M. Bachman, G.P. Li, F. De Flaviis, Univ. of California at Irvine, Electrical and Computer Engineering Dept., Irvine, CA; L. Jofre, Technical University IFWE-48: The Design of T/R Module for X-band APAA System Used in Satellite Communications Y.B. Jung, S.Y. Eom, S.I. Jeon, J.I. Choi, Electronics and Telecommunications Research Institute, ROK IFWE-49: Experimental APAA for Satellite Communications S.I. Jeon, J.I. Choi, Electronics and Telecommunications Research Institute, ROK; Y.K. Choi, Agency for Defense Development, ROK; S.H. Oh, Dept. of Electronics, Chungnam Univ., ROK IFWE-50: A Novel K-band Frequency-controlled Beam-steering Quasi-Yagi Array with Mixing Frequency Compensation T. Nishio, Y. Wang, Y. Qian, T. Itoh, Dept. of Electrical Engineering Univ. of California Los Angeles IFWE-51: A Frequency Autonomous Retrodirective Array Transponder K. Leong, R.Y. Miyamoto, S-S. Jeon, Y. Wang, T. Itoh, Dept. of Electrical Engineering, Univ. of California, Los Angeles IFWE-52: Effects of Local Oscillator Phase Noise on the Interference Rejection Capability of CDMA Receivers Using Adaptive Antenna Arrays G.W. Slade, School of Electrical and Computer Systems Engineering, RMIT IFWE-53: A Balanced Adaptive Beamforming System for Broadband Wireless Communications S-S. Jeon, Y. Wang, T. Itoh, Dept. of Electrical Engineering, Univ. of California, Los Angeles IFWE-54: Impulse Ground Penetrating Radar for Nondestructive Evaluation of Pavements J.S. Lee, C. Nguyen, Texas A&M Univ. Electrical Engineering Dept.; T. Scullion, Texas A&M Univ. Texas Transportation Institute IFWE-55: Reentrant Resonators for Microwave Measurement Units L.V. Shebalkova, Electronic Devices Research Institute IFWE-56: An Adaptive Multi-functional Array for Wireless Sensor Systems R.Y. Miyamoto, K.M.K.H. Leong, S-S. Jeon, Y. Wang, T. Itoh, Dept. of Electrical Engineering, Univ. of California, Los Angeles IFWE-57: Compact Multibeam Imaging System for Automotive Radars B. Schoenlinner, G.M. Rebeiz IFWE-58: A New Approach for RIN Peak And Phase Noise Suppression in Microchip Lasers M. Csörnyei, T. Berceli, T. Bánky, T. Marozsák, Budapest Univ. of Technology and Economics, Dept. of Microwave Telecommunications; P.R. Herczfeld, Drexel Univ. Philadelphia Center for Microwave-Lightwave Engineering 42 SPECIAL SESSIONS TU2A: RADIO FREQUENCY INTEGRATED CIRCUITS FOR 3G TERMINALS AND BASE STATIONS Date & Time: Tuesday, June 4; 10:10 to 11:50 AM Location: WSCTC, Rooms 608–609 Organizers: Prof. Robert Weigel; W. Schelmbauer Speakers: ✗ K. Itoh, Integrated Even Harmonic Type Direct Conversion Receiver for W-CDMA Mobile Terminals ✗ W. Schelmbauer, An Analog Baseband Chain for a UMTs Zero-IF Receiver in a 75 GHz SiGe BiCMOs Technology ✗ Y-S. Youn, A 2 GHz RF Front-end Transceiver Chipset in CMOS Technology for PCS and IMT-2000 Applications ✗ C. Potter, System Analysis of a W-CDMA Base-station PA Employing Adaptive Digital Predistortion This session deals with radio frequency integrated circuits and system aspects for third generation mobile terminals and base stations. Two invited papers demonstrate the first implementations of an integrated even harmonic type direct conversion receiver and of a zero-IF receiver chip for wideband-CDMA, respectively. Furthermore, a CMOS transceiver chipset and system analysis of base station power amplifier are presented. ical community and promises to open the field up to the general public for the first time. Other less pervasive applications have been proposed, all of which would benefit from broader-based interest in the field. This session will focus on THz technology today with emphasis on frequencies above 500 GHz and on applications that may not be familiar to every listener. The session will offer a wide range of speakers on a variety of THz techniques and application areas with emphasis on those subjects that have not traditionally been, or are not now, a part of the microwave community. The goal will be to rekindle interest in this application area and bring back many of the experts who have either drifted away from IEEE or have come into the field from other disciplines. In order to draw in speakers with substantial experience and cover areas not traditionally part of todays MTT, the session will be composed mostly of invited talks. TH3D: WIDE BANDGAP DEVICES AND THEIR APPLICATION IN HIGH POWER AND LOW NOISE CIRCUITS Date & Time: Thursday, June 6; 1:20 to 3:00 PM Location: WSCTC, Rooms 615–617 Organizers: Kevin Webb; Scott Sheppard Speakers: ✗ L.F. Eastman, Experimental Power-frequency Limits of AlGan/Gan HEMTs ✗ R.J. Trew, AlGan/Gan HFET Amplifier Performance and Limitations ✗ T. Kikkawa, A 36W CW AlGan/Gan-power HEMT Using Surfacecharge-controlled Structure ✗ W.L. Pribble, Applications of SiC MESFETs and Gan HEMTs in Power Amplifier Design ✗ S.C. Binari, Trapping Effects in Wide-bandgap Microwave FETs Wide bandgap semiconductor devices, such as silicon carbide FETs and IMPATTs, and gallium nitride HEMTs on silicon carbide substrates, offer the opportunity for dramatically increased power densities. In oscillator applications, low 1/f noise is important, and in receiver applications, low microwave noise is critical. Advances in wide bandgap material systems have recently led to devices with good microwave performance, thereby yielding opportunities for high power and also low noise circuits. This session offers a forum for the presentation of recent advances in both wide bandgap devices and their utilization in circuits. TH1E: HIGH-SPEED/NON-CONTACTING ELECTRICAL PROBING Date & Time: Thursday, June 6; 8:00 to 9:40 AM Location: WSCTC, Rooms 602–604 Organizers: Dylan Williams; Paul Hale Speakers: ✗ T. Nagatsuma, Millimeter-Wave Network Analyzers Based on Photonic Techniques ✗ W. Mertin, Contactless Probing of High-Frequency Electrical Signals with Scanning Microscopy ✗ A.J.A. Smith, Optoelectronic Techniques for Improved High Speed Electrical Risetime Measurements ✗ M.K. Mc Manus, Picosecond Imaging Circuit Analysis of HighSpeed Digital Circuits ✗ Y. Norihide, Atomic Force Microscopy for IC Test This joint IMS/ARFTG session will address high-speed and non-contacting electrical probing for a variety of microwave applications. Particular emphasis will be placed on instrumentation and calibrations for testing 40 Gb/s digital circuitry associated with high-speed optical links and noncontact probing for testing dense digital integrated circuits. TH4D: OPTICAL PROCESSING OF ANTENNA SIGNALS Date & Time: Thursday, June 6; 3:30 to 5:10 PM Location: WSCTC, Rooms 615–617 Organizer: Robert Minasian Speakers: ✗ H.R. Fetterman, Multiple Output Photonic RF Phase Shifters for Optically Controlled Radar Systems ✗ S.A. Khan, Flexible Beamformer and Remoting Head for Optically Controlled Phased Array Antennas ✗ J.L. Corral, A Novel 2N Beams Heterodyne Optical Beamforming Architecture Based on NXN Optical Butler Matrices ✗ J.L. Corral, Photonic True-time Delay Beamformer for Broadband Wireless Access Networks at 40 GHz Band ✗ G. Maury, Optical Mixing of Antenna Signals in WDM Systems ✗ B. Ortega, Optimization of an Optical System Based on a Chirped Fibre Bragg Grating for Driving Phased Array Antennas Photonics provides a powerful technique for processing high bandwidth antenna signals. A major future challenge is new fibre-optic microwave transport systems that also have in-built signal conditioning, in applications such as fibre-radio and phased array signal distribution. Photonics offers advantages of extremely high time-bandwidth products, EMI immunity, and dense parallel signal processing capabilities using WDM. It also opens up new microwave signal processing functions for high resolution, wideband and adaptive processing for the evolution of future antenna systems that need increased instantaneous bandwidths. The object of this Special Session is to bring together leading researchers from around the world to present the current state-of-the-art in optical processing of antenna signals. Topics to be addressed include optical microwave filters, A/D converters, photonic interference mitigation filtering, frequency converters, and beamforming in phased arrays. TH2B: THZ TECHNOLOGY AND APPLICATIONS Date & Time: Thursday, June 6; 10:10 to 11:50 AM Location: WSCTC, Rooms 606–607 Organizers: Peter H. Siegel; Mohammed N. Afsar Speakers: ✗ D. Mittleman, T-Ray Imaging: New Possibilities in the Far Infrared ✗ F.C. DeLucia, THz Spectroscopy – Techniques and Applications ✗ M.J. Coulombe, Submillimeter-Wave Polarimetric Compact Ranges for Scale-model Radar Measurements ✗ B. Deng, THz Techniques in Plasma Diagnostics ✗ E.R. Brown, Remote Detection of Bioparticles in theTHz Region Despite great scientific interest since at least the 1920s, the THz frequency range remains one of the least tapped regions of the electromagnetic spectrum. Sandwiched between traditional microwave and optical technologies where there is a limited atmospheric propagation path, little commercial emphasis has been placed on THz systems. This has, perhaps fortunately, preserved some unique science and applications for tomorrow’s technologists. For over 25 years the major niche for THz technology has been in the high resolution spectroscopy and remote sensing areas where heterodyne and Fourier transform techniques have allowed astronomers, chemists, Earth, planetary and space scientists to measure, catalog and map thermal emission lines for a wide variety of lightweight molecules. As it turns out, nowhere else in the electromagnetic spectrum do we receive so much information about these chemical species. In fact, the universe is bathed in THz energy, most of it going unnoticed and undetected. Commercial uses for THz sensors and sources are just beginning to emerge as the technology enables new instrumentation and measurement systems. So called T-Ray imaging is tantalizing the interests of the med- 43 IEEE MTT-S IMS TECHNICAL SESSIONS 8:00–9:30 AM TH1A Flip-chip Techniques and Novel Application of Organic Materials in Packaging TH1B Low Noise Devices and Applications TH1C Synthesis and Multi-mode Techniques Chair: W. Heinrich, Ferdinand-Braun-Institut Co-chair: R. Franklin-Drayton, Univ. of Minnesota ROOM 608–609 Chair: M.S. Gupta, San Diego State Univ. Co-chair: T.C. Cisco, Raytheon ROOM 606–607 Chair: W.C. Tang, Com Dev International Co-chair: J.W. Modelski, Warsaw Univeresity of Technol ROOM 611–612 TH1A-1: Suppression of Multi-path Couplings in MCM with a Flip-chipped SiGe-MMIC T. Nishino, M. Shimozawa, N. Suematsu, H. Oohashi, T. Takagi, O. Ishida, Mitsubishi Electric Co, Information Technology R&D Center; T. Ikushima, K. Sadahiro, T. Katsura, K. Maeda, K. Itoh, Mitsubishi Electric Co, Mobile Communications TH1B-1: Intrinsic Noise Characteristics of AlGaN/GaN HEMTs S. Lee, School of Electrical and Computer Engineering, Purdue Univ., West Lafayette, IN; V. Tilak, L.F. Eastman, School of Electrical Engineering, Cornell Univ., Ithaca, NY; K.J. Webb, School of Electrical and Computer Engineering TH1C-1: Synthesis of Advanced Microwave Filters without Diagonal Cross-couplings R.J. Cameron, Com Dev International; A.R. Harish, Com Dev Wireless; C.J. Radcliffe, Pentire Associates TH1A-2: Flip-chip Mounted, Ku-band Power Amplifier Compliant with Space Application O. Vendier, J-P. Fraysse, C. Schaffauser, M. Paillard, C. Drevon, J-L. Cazaux, D. Floriot, N. Caillas-Devignes, H. Blanck, P. Auxemery, W. de Ceuninck, R. Petersen, N. Haese, P-A. Rolland TH1B-2: A 2.4 GHz to 5 GHz CMOS Low Noise Amplifier with High-resistivity Eltran® SoI-Epi™ Wafers J. Kodate, M. Ugajin, T. Tsukahara, T. Douseki, NTT Telecommunications Energy Lab; N. Sato, T. Okabe, K. Ohmi, T. Yonehara, Canon Inc. TH1C-2: A Method for the Direct Synthesis of Cascaded Quintuplets T.B. Reeves, TRAK Microwave, Inc.; N.D. van Stigt, R3 Microwave TH1A-3: W-band Flip-chip Interconnects on Thin-film Substrate F.J. Schmueckle, A. Jentzsch, W. Heinrich, Ferdinand-Braun-Institut; H. Oppermann, Fraunhofer-Institut IZM; K. Riepe, United Monolithic Semiconductors GmbH TH1B-3: A Modified Cascode Type Low Noise Amplifier Using Dual Common Source Transistors S. Ock, J-R. Lee, Future Communications IC; K. Han, B. Kim, Dept. of Electronic and Electrical Engineering Pohang Univ. of Science and Technology TH1C-3: Parameter Extraction for Symmetric Coupled-resonator Filters H-T. Hsu, Z.Y. Zhang, K.A. Zaki, Dept. of Electric and Computer Engineering, Univ. of Maryland at College Park; A.E. Atia, Orbital Sciences Corp. TH1B-4: Ku-band Low Noise MMIC Amplifier with Bias Circuit for Compensation of Temperature Dependence and Process Variation K. Yamanaka, K. Yamauchi, K. Mori, Y. Ikeda, T. Takagi, Mitsubishi Electric Corp., Information Technology R&D Center; H. Ikematsu, Mitsubishi Electric Corp., Communication Systems Center; N. Tanahashi, Mitsubishi Electric TH1C-4: Design Procedure for Waveguide Filters with Cross-couplings J. Kocbach, K. Folgerø, Nera ASA, Nera Research, Bergen, Norway TH1A-4: A Locally Matching Technique for Broadband Flip-chip Transition Design C-L. Wang (student), R-B. Wu (professor), Dept. of Electrical Engineering, National Taiwan Univ. TH1A-5: Development of an Organic Wafer-level Packaging Platform for Highly Integrated RF Transceivers. R. Ramachandran, A.Pham, Clemson Univ., Clemson 9:00 AM 8:50 AM 8:40 AM 8:30 AM 8:20 AM 8:10 AM 8:00 AM THURSDAY, JUNE 6, 2002 9:30 AM 9:20 AM 9:10 AM TH1C-5: Dual-mode Filters with Grooved Dielectric Resonators for Cellular-radio Base Stations L. Accatino, G. Bertin, Telecom Italia Lab, Torino; M. Mongiardo, Dipartimento di Elettronica, Universita’ di Perugia; G. Resnati, FOREM, SRL, Agrate Brianza TH1A-6: Design of Inductors in Organic Substrates for 1-3 GHz Wireless Applications S. Dalmia, F. Ayazi, M. Swaminathan, S.H. Min, S.H. Lee, W. Kim, D. Kim, S. Bhattacharya, V. Sundaram, G. White, R. Tummala, Georgia Institute of Technology TH1B-5: A 7.9 to 9.7 GHz On-chip Radar Receiver Front-end for Future Adaptive X-band Smart Skin Array Antennas J.R. Malmqvist, O.M. Alfredsson, B.A. Gustafsson, A. Ouacha, FOI Swedish Defence Research Agency Microwave Technology Dept. TH1A-7: Integrated Inductors in the Chip-TO Board Interconnect Layer Fabricated Using Solderless Electroplating Bonding Y-H. Joung, S. Nuttinck, S-W. Yoon, M.G. Allen, J. Laskar, Georgia Institute of Technology TH1C-6: A Dual Mode Filter with Trifurcated Iris and Reduced Footprint M. Yu, D.J. Smith, A. Sivadas, W. Fitzpatrick, COM DEV International, Cambridge, Ontario, Canada TH1C-7: Method of Spurious Mode Compensation Applied to Manifold Multiplexer Design D. Bariant, S. Bila, D.E. Baillargeat, S. Verdeyme, P. Guillon, IRCOM UMR, D. Pacaud, J-J. Herren,Alcatel Space Industries 44 TH1D Ferroelectric, Ferrite and Acoustic Components Joint ARFTG/IMS2002 Special Session Chair: D. Williams, NIST Co-chair: P. Hale, NIST ROOM 602–604 TH1F Spatial Power Combining and Quasi-optical Techniques Chair: D. Palmer, U.S. Army Research Office Co-chair: A. Mortazawi, Univ. of Michigan ROOM 613–614 TH1D-1: A New X Band 180° High Performance Phase Shifter Using (Ba,Sr)Tio3 Thin Films B. Acikel, R.A. York, Electrical & Computer Engineering Dept.,UC Santa Barbara, Santa Barbara, CA; T.R. Taylor, P.J. Hansen, J.S. Speck, Materials Dept.,UC Santa Barbara, Santa Barbara, CA TH1E-1: Invited: Contactless Probing of High Frequency Electrical Signals with Scanning Probe Microscopy TH1F-1: A Ka-band Perpendiculary-fed Patch Array for Spatial Power Combining S. Ortiz, Harris Corp., Melbourne, FL; A. Al-Zayed, Dept. of Electrical and Computer Engineering, N. Carolina State Univ., Raleigh, NC; A. Mortazawi, Dept. of Electrical Engineering and Computer Science, TH1D-2: A Wide Bandwidth Monolithic BST Reflection-type Phase Shifter Using a Coplanar Waveguide Lange Coupler D.S. Kim, Y.S. Choi, M.G. Allen, J.S. Kenney, Georgia Institute of Technology, School of Electrical and Computer Engineering, Atlanta, GA; B. Garvey, D. Kiesling, Microcoating Technologies Inc. Chamblee, GA TH1E-2: Invited: mm-Wave Network Analyzers Based on Photonic Techniques T. Nagatsuma, N. Sahri, A. Hirata, Y. Royter, A. Sasaki, NTT Telecommunications Energy Lab TH1F-2: A Waveguide Mode-converter Feed for a 5 W, 34 GHz Grid Amplifier C-T. Cheung, D.B. Rutledge, California Institute of Technology, Pasadena, CA; J.B. Hacker, G. Nagy, Rockwell Scientific Co. LLC, Thousand Oaks, CA TH1E-3: Invited: Optoelectronic Techniques for Improved High Speed Electrical Risetime A.J.A. Smith, A.G. Roddie, P.D. Woolliams, National Physical Lab TH1F-3: A 10 GHz High-efficiency Active Antenna Sub-array S. Pajic, Z. Popovic, Univ. of Colorado at Boulder TH1E-4: Invited: Picosecond Imaging Circuit Analysis of ULSI Microprocessors M.K. Mc Manus, IBM Research, Yorktown Heights TH1F-4: Quasi-optical E-band MEMs Switching Arrays W-K. Zhang, C.W. Domier, N.C. Luhmann, Jr, Univ. of California, Davis,Dept. of Applied Science; F. Jiang, Wytec Inc. TH1E-5: Electric-field Observation of Pico-pulse Propagation on Right-angle Bends by Miniature Photoconductive Near-field Probe J. Lee, J. Kim, KAIST, Electrical Engineering & Computer Science Dept. TH1F-5: A Circularly Polarized Rectifying Antenna Array for Wireless Microwave Power Transmission with Over 78% Efficiency B.H. Strassner, K. Chang, Texas A&M Univ. Electrical Engineering Dept. TH1E-6: Field-tuneable Probe for Combined Electric and Magnetic Field Measurements R.M. Reano, J.F. Whitaker, L.P.B. Katehi, Univ. of Michigan TH1F-6: A Multi-element 150 to 300 GHz Spatial Power Dividing/Combining Frequency Doubler B. Schumann, M. Hoeft, R. Judaschke, Arbeitsbereich Hochfrequenztechnik, Technische Universität Hamburg-Harburg, Hamburg TH1D-3: Bandwidth and Losses of 4-port Ferrite Coupled Line Circulators C.K. Queck, L.E. Davis, Microwave Engineering Group, Dept. of Electrical Eng. & Electronics, UMIST, Manchester, UK TH1D-4: Modeling and Optimization of Parallel Line Edge Mode Isolators A.H. Aly, B. Elsharawy, Dept. of Electrical Engineering, Arizona State Univ., Tempe, AZ 9:30 AM 9:20 THURSDAY TH1D-5: SAW FEMs for GSM-based Multi-band Cellular Phones with Direct-conversion Demodulation M. Hikita, Central Research Lab. Hitachi Ltd., Kokubunji, Tokyo, Japan; N. Matsuura, Y. Yokoyama, K. Sakiyama, Hitachi Media Ltd.; N. Shibagaki, C.R.L. Hitachi Ltd. AM 9:10 AM 9:00 AM 8:50 AM 8:40 AM 8:30 AM 8:20 AM 8:10 AM 8:00 AM Chair: C.C.W. Ruppel, EPCOS AG Co-chair: J. Owens, Boise State Univ. ROOM 615–617 TH1E High-speed/Non-contacting Electrical TH1D-6: Bulk Acoustic Wave Resonators and Filters for Applications Above 2 GHz K. Lakin, J. Belsick, J. McDonald, K.T. McCarron, C. Andrus, TFR Technologies Inc. 45 IEEE MTT-S IMS TECHNICAL SESSIONS 10:10 AM–12:00 PM TH2A Packaging TH2B Special Session on THz Technology and Applications TH2C Novel Filter Structures Chair: B.R. Allen, TRW Co-chair: M.A. Gouker, MIT Lincoln Lab ROOM 608–609 Chair: P.H. Siegel, Caltech JPL Co-chair: M. Afsar, Tufts Univ. ROOM 606–607 Chair: S. Kanamaluru, Sarnoff Corp. Co-chair: A.E. Atia, Orbital Sciences Corp. ROOM 611–612 TH2A-1: Design of an LTCC Integrated Tri-band Direct Conversion Receiver Front-end Module R. Lucero, A. Pavio, D. Penunuri, J. Bost, Solid State Research Center, Motorola Labs TH2B-1: Invited: T-Ray Imaging: New Possibilities in the Far Infrared D.M. Mittleman, Rice Univ. TH2C-1: Suspended Resonators for Filters-reduced Wavelength Excitation of Evanescent Cavities Using High Dielectric Constant Feedlines R.V. Snyder, RS Microwave; E. Niver, K.Um, S. Shin, New Jersey Institute of Technology TH2A-2: An L-band, LTCC Frequency Doubler Using Embedded Lumped Element Filters R.B. Hurley, G.T. Sloan, Sandia National Lab TH2B-2: Invited: THz Spectroscopy — Techniques and Applications F.C. De Lucia, Ohio State Univ. Dept. of Physics TH2C-2: Lumped-element Conductor-loaded Cavity Resonator H. Salehi, R.R. Mansour, Electrcial & Computer Engineering Department, Univ. of Waterloo; V. Dokas, COM DEV International TH2B-3: Invited: Submillimeter-Wave Polarimetric Compact Ranges for Scale-model Radar Measurements M.J. Coulombe, J. Waldman, R.H. Giles, UMass Lowell STL; W.E. Nixon, US Army National Ground Intelligence Center TH2C-3: Novel Coupling Schemes for Microwave Resonator Filters U. Rosenberg, Royal Military College of Canada, Canada; Marconi Communications, GmbH, Backnang, Germany; S. Amari, Dept. of ECE, Kingston, ON, Canada TH2B-4: Invited: THz Techniques in Plasma Diagnostics B.H. Deng, Univ. of California at Davis, Dept. of Applied Science, Davis, CA; C.W. Domier, K.C. Lee, N.C. Luhmann, Jr., Univ.; A.J.H. Donné, E. Mazzucato, T. Munsat, H. Park, M. van de Pol TH2C-4: Folded Quarter-wave Resonator Filters with Chebyshev, Flat Group Delay, or Quasi-elliptical Function Response C-Y. Chang, C-C. Chen, H-J. Huang, Institute of Electrical Communication Engineering, National Chiao Tung Univ., Hsinchu, Taiwan TH2A-3: 3D Integrated LTCC Module Using MbGa Technology for Compact C-band RF Front-end Module S. Pinel, S. Chakraborty, S. Mandal, H. Liang, K. Lim, M. Tentzeris, School of Electrical and Computer Engineering Georgia Institute of Technology; M. Roellig, R. Kunze, R. Tummala, Packaging Research Center; J. Laskar, School TH2A-4: Low Temperature Co-fired Ceramic: An Enabler of High Power RF Integrated Amplifiers P. Piel, J. Estes, S. Marshall, G. Funk, A. Pavio, Motorola TH2A-5: High Performance RF Passive Integration on Si Smart Substrate D-W. Kim, Telephus Inc.; I-H. Jeong, H-S. Sung, T-O. Kong, J-S. Lee, C-M. Nam, Telephus Inc., Y-S. Kwon, Dept. of EE, Korea Advanced Institute of Science and Technology TH2C-5: Stepped Impedance Resonator Bandpass Filters with Tunable Transmission Zeros and Its Application to Wide Stopband Design J-T. Kuo, E. Shih, National Chiao Tung Univ. Dept. of Communications Engineering 11:40 PM 11:30 PM 11:20 PM 11:10 PM 11:00 PM 10:50 PM 10:40 AM 10:30 AM 10:20 AM 10:10 AM THURSDAY, JUNE 6, 2002 TH2A-6: Micromachined Low Dispersion Interconnects for Optoelectronic Array Packaging S.R. Banerjee, R.F. Drayton, Univ. of Minnesota Dept. of Electrical and Computer Engineering TH2B-5: Invited: Remote Detection of Bioparticles in the THz Region E.R. Brown, UCLA, Los Angeles, CA; D.L. Woolard, US Army Research Office, Research Triangle Park, NC; A.C. Samuels, Aberdeen Proving Ground, Aberdeen, MD; T. Globus, B. Gelmont, Univ. of Virginia, Charlottesville, VA TH2A-7: Use of a Transparent Conductive Thin-film on a Glass Substrate in Active Integrated Antenna Arrays with Double Strong Coupling K. Oshima, N. Kidera, K. Niwano, K. Ikawa, Asahi Glass Co., Ltd. Research Center; R. Sonoda, S. Kawasaki, Tokai Univ., Dept. of Electrical and Electronic Engineering TH2C-6: A Ku-band Low-loss Stripline Low-pass Filter for LTCC Modules with Low-impedance Lines to Obtain Plural Transmission Zeros T. Ohwada, H. Ikematsu, H. Oh-hashi, T. Takagi, O. Ishida, Mitsubishi Electric Corp. TH2C-7: Design and Analysis of Novel Compact Inductor Resonator Filter G-A. Lee, F. De Flaviis, Conexant Systems Inc., Newport Beach, CA; M. Megahed, Dept. of Electrical and Computer Engineering, Univ. of California, Irvine, Irvine, CA 46 TH2E Microwave Measurements Inc. TH2F Microwave Photonics Chair: F. Raab, Green Mountain Radio Research Co-chair: J. Sevic, Tropian Inc. ROOM 615–617 Chair: R. Henderson, Motorola Inc. Co-chair: R.D. Pollard, The Univ. of Leeds ROOM 602–604 Chair: D. Jaeger, Gerhard-Mercator-Universitaet Duisbur Co-chair: C. Cox, Photonic Systems Inc. ROOM 613–614 TH2D-1: Switched-mode Class P — A New Challenge for High-efficiency RF And Microwave Power Amplifiers A.V. Grebennikov, H. Jaeger, M/A-COM Eurotec Operations 10:10 AM TH2D High Efficiency Amplifier Techniques 10:30 AM 10:20 AM TH2E-2: Error Analysis of the Unloaded Q-factors of a Transmission-type Resonator Measured by the Insertion Loss Method and the Return Loss Method Z. Ma, Y. Kobayashi, Dept. of Electrical and Electronic Systems, Saitama Univ. TH2D-2: Demonstration of A Switchless Class E/F(Odd) Dual-band Power Amplifier F. Bohn, S. Kee, A. Hajimiri, Dept. of Electrical Engineering, California Institute of Technology TH2E-3: Comparing Measurements of the Unloaded Q-factor of a High-Q Dielectric Resonator Using the Transmission Mode and Reflection Mode Methods Involving S-parameter K. Leong, J. Mazierska, M.V. Jacob, D. Ledenyov, Electrical and Computer Engineering, James Cook Univ. TH2F-2: Nonlinear Distortion and Crosstalk in Microwave Fiber-radio Links E.E. Funk, A.L. Campillo, D.A. Tulchinsky, Naval Research Lab TH2D-3: Push/Pull Class-DE Switching Power Amplifier A.S. Alipov, V.B. Kozyrev, Moscow Tech. Univ. of Communications and Informatics Chair of Radiotransmitters TH2E-4: Removal of Cable and Connector Dispersion in Time-domain Waveform Measurements on 40 Gb ICs J.B. Scott, B. Behnia, M. Vanden Bossche, A. Cognata, J. Verspecht, F. Verbeyst, D.R. Scherrer, Agilent Technologies TH2F-3: Optical Delivery of Modulated mm-Wave Signals Using Free-running Laser Heterodyne with Frequency Drift Cancellation L.A. Johansson, A.J. Seeds, Dept. of Electronic and Electrical Engineering, Univ. College London, London, UK TH2E-5: Characterization of a Solid 8 GHz Transient Signal Analyzer A. Ghis, P. Ouvrier-Buffet, LETI (CEA-Technologies Avancées); N. Rolland, A. Benlarbi-Delai, P.A. Rolland, D. Glay, IEMN/DHS; D.Jaeger, IN-SNEC TH2F-4: 10 and 39 GHz Band InP/InGaAs HPT Direct Optical Injection-locked Oscillator ICs for Optoelectronic Clock Recovery Circuits H. Kamitsuna, T. Shibata, K. Kurishima, M. Ida, NTT Photonics Lab, NTT Corp. TH2D-6: The Switching Noise Active Cancellation for The DC-DCConverter Driven RF Power Amplifier H. Kobayashi, Fuji Electric Co., Ltd., Nagano, Japan; P.M Asbeck, Univ. of California, San Diego, La Jolla, CA TH2E-6: A Sampled-line Reflectometer for Submillimeter-Wave Measurements S. Ulker, R.M. Weikle II, School of Engineering and Applied Science, Univ. of Virginia TH2F-5: A WDM Fiber-radio Experiment Incorporating a Wavelength Self-tunable Single-sideband Filter E. Vourch, LEST-ENST Bretagne; D. Le Berre, LEST-Univ. of Brest; D. Herve, ENST Bretagne TH2D-7: A Novel EER Transmitter Using Two-point Delta-Sigma Modulation Scheme for WLAN and 3G Applications K.C. Peng, J.K. Jau, T.S. Horng, National Sun Yat-Sen Univ. Electrical Engineering Dept. TH2E-7: Sampling Circuit on Silicon Substrate for Frequencies Beyond 50 GHz P. Abele, M. Birk, (now with AT&T Labs-Research, Red Bank, New Jersey), D. Behammer, H. Kibbel, A. Trasser, P. Maier, K.-B. Schad, E. Soenmez, H. Schumacher, Dept. of Electron Devices and Circuits, Univ. of Ulm, Germany, TH2F-6: A Circuit Model of Traveling Wave Electroabsorption Modulator J. Lim, S. Hong, Dept. of EECS, Korea Advanced Institute of Science and Technology; S. Jeon, Knowledge*on Inc.; J. Kim, Basic Research Lab, Electronics Telecommunication Research Institute 10:40 AM TH2F-1: Implementing Subcarrier-based Control in Optical Networking A.E. Willner, Univ. of Southern California TH2D-4: Harmonic Tuned PAS Design Criteria P. Colantonio, F. Giannini, G. Leuzzi, E. Limiti, Dipartimento di Ingegneria Elettronica, Università di Roma Tor Vergata TH2F-7: Predistortion Circuit Design for Second- and Third-order Simultaneous Linearization in Multiservice Telecommunications L. Roselli, V. Borgioni, F. Zepparelli, M. Comez, Dipartimento di Ingegneria Elettronica e dell’Informazione, Università di Perugia; P. Faccin, A. Casini, Tekmar Sistemi S.r.l, Faenza, Italy 11:40 47 THURSDAY TH2D-5: Finite DC Feed Inductor in Class E Power Amplifiers — A Simplified Approach D.K. Choi, RF Electronics Lab, Nokia Research Center (NRC), Mountain View, CA; S.I. Long, Dept. of Electrical and Computer Engineering, Univ. of California, Santa Barbara, CA AM 11:30 AM 11:20 AM 11:10 AM 11:00 AM 10:50 AM TH2E-1: Dielectric Sleeve Resonator Techniques for Variable-temperature Microwave Characterization of Ferroelectric Materials R.G. Geyer, P. Kabos, J. Baker-Jarvis, National Institute of Standards and Technology IEEE MTT-S IMS TECHNICAL SESSIONS 1:20–3:00 PM TH3A Advanced V-band Transceiver Technology TH3B Biological Effects and Medical Applications TH3C Waveguide and Planar Filter Structures Chair: E.C. Niehenke, Niehenke Consulting Co-chair: P. Saunier, TriQuint Semiconductor ROOM 608–609 Chair: A.V. Vorst, Microwaves UCL Co-chair: R. Bansal, Univ. of Connecticut ROOM 606–607 Chair: C. Wang, Radio Frequency Systems Co-chair: R.V. Snyder, RS Microwave Inc. ROOM 611–612 TH3A-1: Compact LNA and VCO 3-D MMICs Using Commercial GaAs PHEMT Technology for V-band Single-chip TRX MMIC K. Nishikawa, T. Nakagawa, K. Araki, NTT Network Innovation Lab; B. Piernas, Fujitsu Compound Semiconductor Inc.; K. Kamogawa, NTT DoCoMo Inc. TH3B-1: A Rugged Microstrip Tapered Balun Printed Dipole Reference for SAR System Verification M. Richard, M. Kanda, C. DiNallo, C.K. Chou, Motorola Florida Research Labs, Corporate EME Research Lab, Ft. Lauderdale, FL TH3C-1: A Two Zero Fourth Order Microwave Waveguide Filter Using a Simple Rectangular Quadruple-mode Cavity N. Boutheiller, P. Jarry, E. Kerherve, J.M. Pham, IXL Lab, Univ. Bordeaux; S. Vigneron, Alcatel Space TH3A-2: A 60 GHz mm-Wave MMMIC Chipset for Broadband Wireless Access System Front-end Y. Mimino, K. Nakamura, Y. Hasegawa, Y. Aoki, S. Kuroda, T. Tokumitsu, Fujitsu Quantum Devices Ltd. TH3B-2: Evaluation of Human Exposure in the Vicinity of a Base Station Antenna Using the Multiple Region/FDTD Hybrid Method P. Bernardi, M. Cavagnaro, S. Pisa, E. Piuzzi, Dept. of Electronic Engineering, Univ. La Sapienza of Rome TH3C-2: 26 GHz TM11D Mode Dielectric Resonator Filter and Duplexer with High-Q Performance and Compact Configuration A. Enokihara, Matsushita Electric Industrial Co.,Ltd. Advanced Technology Research Lab; H. Nanba, T. Nakamura, Matsushita Nitto Electric Co., Ltd. Engineering Dept.; T. Ishizaki, Matsushita; T. Uwano TH3A-3: A 60 GHz MMIC Chipset for 1 Gbit Wireless Links K. Fujii, S. Hessel, H. Morkner, Agilent Technologies, SPG R&D, Newark, CA. TH3B-3: Theoretical Evaluation of UMTS/GSM Electromagnetic Fields on Neuronal Network Response F. Apollonio, M. Liberti, G. D’Inzeo, ICEmB at La Sapienza Univ. of Rome, Rome, Italy TH3A-4: A Highly Integrated MMIC Chipset for 60 GHz Broadband Wireless Applications O. Vaudescal, B. Lefebvre, V. Lehoué, P. Quentin, United Monolithic Semiconductors (UMS) 2:30 PM 2:40 PM 2:50 TH3B-4: A Parallel FDT Tool for the Solution of Large Dosimetric Problems: An Application to the Interaction Between Humans and Radiobase Antennas L. Catarinucci, L. Tarricone, Univ. of Lecce, Dept. of Innovation Engineering; P. Palazzari, Centro Ricerche Casaccia — ENEA TH3C-3: Low-spurious Coaxial-line Bandpass Filter with Saucerloaded Stepped-impedance Resonators H. Uchida, Y. Furukawa, T. Ohwada, N. Yoneda, M. Miyazaki, Mitsubishi Electric Corp. TH3B-5: Confocal Microwave Imaging for Breast Tumor Detection: Application to a Hemispherical Breast Model M. Okoniewski, Electrical and Computer Engineering, Univ. of Calgary TH3C-4: 60 GHz Band Dielectric Waveguide Filters with Cross-coupling for Flip-chip Modules M. Ito, K. Maruhashi, K. Ohata, Photonic and Wirelss Devieces Research Labs., NEC Corp.; K. Ikuina, T. Hashiguchi, Functional Devices and Materials Reserach Labs., NEC Corp.; S. Iwanaga, NEC Kansai Ltd. TH3A-5: A Compact 60 GHz Sub-harmonically Pumped Mixer MMIC Integrated with an Image Rejection Filter A. Yamada, Y. Amano, Y. Motouchi, N. Takahashi, E. Suematsu, H. Sato, Sharp Corp. Advanced Technology Research Lab PM 2:20 PM 2:10 PM 2:00 PM 1:50 PM 1:40 PM 1:30 PM 1:20 PM THURSDAY, JUNE 6, 2002 TH3A-6: GaAs HBT Operating as Integrated V- to W-band Gunn Oscillator M. Rudolph, R. Doerner, P. Heymann, Ferdinand-Braun-Institut (FBH) TH3C-5: A Novel Compact Coplanar Filter T. Paillot, D. Cros, P. Blondy, IRCOM TH3B-6: Study of The Activity of Neurological Cell Solutions Using Complex Permittivity Measurement M-R. Tofighi, A. Daryoush, Dept. of ECE, Drexel Univ., Philadelphia, PA TH3C-6: Novel Low-pass Filter for Broad-band Spurious Suppression M.Q. Lee, K-K. Ryu, I-B. Yom, S-P. Lee, Communication Satellite Development Center, Electronics Telecommunications Research Institute, Yusung-Gu, Daejon, Korea TH3B-7: A Compact Low Cost Add-on Module for Doppler Radar Sensing of Vital Signs Using a Wireless Communications Terminal V.M. Lubecke, O. Boric-Lubecke, E. Beck, Bell Labs, Lucent Technologies TH3C-7: Improvement of Microstrip Open Loop Resonator Filter Using Aperture S.S. Im, C.H. Seo, J.H. Kim, School of Electronic Engineering, Soongsil Univ, Seoul, S. Korea; Y.W. Kim, N. Kim, ETRI, Daejern, S. Korea TH3B-8: Modeling of Planar Annular Applicators for Microwave Thermotherapy J. Carlier, V. Thomy, J-C. Camart, L. Dubois, J. Pribetich, IEMN — Universite Des Sciences & Technologies De Lille TH3C-8: Full Wave Optimization of Stripline Tapped-in Ridge Waveguide Bandpass Filters M.A. El Sabbagh, H.T. Hsu, K.A. Zaki, Electrical and Computer Engineering Dept., Univ. of Maryland, College Park; P. Pramanick, T. Dolan, K&L Microwave Inc., Salisbury, MD 48 TH3D Special Session on Wide Bandgap Devices and Their Application in High Power TH3E Microwave Measurements II Chair: K. Webb, Purdue University Co-chair: S.T. Sheppard, Cree Inc. ROOM 615–617 Chair: A. Ferrero, Politecnico di Torino Co-chair: L. Dunleavy, Univ. of South Florida ROOM 602–604 TH3D-1: Invited: Experimental Power Frequency Limits of AlGaN/GaN HEMTs L.F. Eastman, ECE and CNF, Cornell University Ithaca, NY TH3E-1: Broadband Thermoelectric Microwave Power Sensors Using GaAs Foundry Process A. Dehé, Infineon Technologies, Balanstrasse, Munich, Germany; K. Fricke-Neuderth, FH Fulda, FB Elektrotechnik, Fulda, Germany TH3D-2: Invited: AlGaN/GaN HFET Amplifier Performance and Limitations R.J. Trew, Virginia Tech, ECE Dept. TH3E-2: Novel Method for Vector Mixer Characterization and Mixer Test System Vector Error Correction J. Dunsmore, Agilent Technologies TH3D-3: A 36W CW AlGaN/GaN-power HEMT Using Surface-charge-controlled Structure T. Kikkawa, T. Kimura, N. Hara, K. Joshin, Fujitsu Laboratories Ltd.; M. Nagahara, S. Yokokawa, S. Kato, M. Yokoyama, Y. Tateno, K. Horino, K. Domen, Y. Yamaguchi, Fujitsu Quantum Devices Ltd. TH3E-3: Compensating Differences Between Measurement and Calibration Wafer in Probe-tip Calibrations G. Carchon, W. De Raedt, E. Beyne, IMEC, Div. MCP-HDIP, Kapeldreef, Heverlee, Belgium TH3D-4: Invited: Applications of SiC MESFETs and GaN HEMTs in Power Amplifier Design W.L. Pribble, J.W. Palmour, S.T. Sheppard, R.P. Smith, S.T. Allen, T.J. Smith, Z. Ring, J.J. Sumakeris, A.W. Saxler, J.W. Milligan, Cree, Inc. TH3E-4: A Study of the Effect of Envelope Impedance on Intermodulation Asymmetry Using a Two-tone Time Domain Measurement System D. J. Williams, J. Leckey, P J. Tasker TH3D-5: Invited: Trapping Effects in Wide-bandgap Microwave FETs S.C. Binari, P.B. Klein, Naval Research Lab, Washington DC; T.E. Kazior, Raytheon RF components, Andover MA TH3E-5: Simulations of Noise-parameter Uncertainties J. Randa, National Institute of Standards and Technology THURSDAY 2:50 PM 2:40 PM 2:30 PM 2:20 PM 2:10 PM 2:00 PM 1:50 PM 1:40 PM 1:30 PM 1:20 PM NOTES 49 Chair: D. Choudhury, HRL Lab Co-chair: J. C. Wiltse, Georgia Tech ROOM 608–609 Chair: R. Sorrentino, Univ. of Perugia Co-chair: A. Gopinath, Univ. of Minnesota ROOM 606–607 Chair: D. Swanson, Forem USA Co-chair: S. Ye, Conductus Inc. ROOM 611–612 TH4A-1: A 94 GHz Single-chip FMCW Radar Module for Commercial Sensor Applications A. Tessmann, T. Feltgen, M. Riessle, W.H. Haydl, Fraunhofer Institute for Applied Solid State Physics (IAF); S. Kudszus, Bigbear Networks; C. Sklarczyk, Fraunhofer Institute for Nondestructive Testing (IZFP) 3:40 PM TH4C-1: A Tunable Active MMIC Filter for On-chip X-band Radar Receiver Front-ends J.R. Malmqvist, B.A. Gustafsson, O.M. Alfredsson, A. Ouacha, FOI Swedish Defence Research Agency Microwave Technology Dept. TH4C-2: Active Impedance Inverter: Analysis and Its Application to the Bandpass Filter Design Y-H. Chun, J-K. Rhee, Millimeter-wave Innovation Technology Research Center, Dongguk Univ.; S-W. Yun, Dept. of Electronic Engineering, Sogang Univ. TH4B-3: Accuracy Limitations of Perfectly Matched Layers in 3D Finite-difference Frequency-domain Method T. Tischler, W. Heinrich, Ferdinand-Braun-Institut fuer Hoechstfrequenztechnik (FBH) PM 3:50 TH4A-2: A 38/76 GHz Automotive Radar Chip Set Fabricated by a Low Cost PHEMT Technology A. Werthof, H.J. Siweris, H. Tischer, W. Liebl, G. Jaeger, T. Grave, Infineon Technologies 4:00 PM TH4B-1: Hybrid Analysis of Three-dimensional Structures by the Method Of Lines Using Novel Nonequidistant Discretization L.A. Greda, R. Pregla, Univ. of Hagen, Electrical Engineering Dept. TH4B-2: 3D Hybrid Finite-difference Method for Lossy Structures Based on Quasi-static Field Solutions M. Kunze, W. Heinrich, Ferdinand-Braun-Institut (FBH), Berlin, Germany TH4A-3: A MMIC-based 75-110 GHz Signal Source M. Morgan, N. Wadefalk, Dept. of Electrical Engineering, California Institute of Technology; S. Weinreb, L. Samoska, Jet Propulsion Lab, California Institute of Technology PM 4:10 PM TH4C Active, Periodic and Planar Filters 4:20 PM 4:30 PM 4:50 PM 5:00 3:30–5:10 TH4B Frequency Domain Techniques TH4A-4: A Gunn Diode Based Surface Mount 77 GHz Oscillator for Automotive Applications N.E. Priestley, K.D. Newsome, I. Dale, P.C. Norton, Marconi Applied Technologies, Lincoln, England TH4C-3: A Filter Synthesis Technique Applied to the Design of Multistage Broadband Microwave Amplifiers J-P. Rooney, I.C. Hunter, R.D. Pollard, The University of Leeds School of Electronic and Electrical Engineering; R. Parry, Filtronic Components plc, Shipley, West Yorkshire, England. TH4B-4: Coupled Padé Approximation-finite Element Method Applied to Microwave Device Design B. Thon, D. Bariant, S. Bila, D. Baillargeat, M. Aubourg, S. Verdeyme, P. Guillon, IRCOM UMR; F. Thevenon, M. Rochette, Cadoe; J. Puech, L. Lapierre, J. Sombrin, CNES TH4C-4: A Super Compact Super Broadband Tapered Uniplanar PBG Structure for Microwave and Millimeter-Wave Applications C. Caloz, T. Itoh, University of California Los Angeles, Electrical Engineering Dept. TH4B-5: Electromagnettics Modeling of Interconnects for Mixered-signal Integrated Circuits from DC To Multi-GHz Frequencies A. Rong, A. Cangellaris, Dept. of Electrical and Computer Engineering, Univ. of Illinois at Urbana-Champaign TH4C-5: A Novel Planar Silicon Waveguide Filter at 45 GHz Based on a Periodic Structure B. Lenoir, P. Blondy, D. Baillargeat, S. Verdeyme, P. Guillon, IRCOM, Univ. of Limoges, France; C. Tavernier, EGIDE, Research and Development Group, France; J. Papapolymerou, School of ECE, Georgia Tech TH4A-5: A Comparison of W-band Monolithic Resistive Mixer Architectures A.R. Barnes, P.D. Munday, R. Jennings, M.T. Moore, QinetiQ Malvern TH4C-6: A Folded Coupled-line Structure and Its Application to Filter and Diplexer Design C-M. Tsai, S-Y. Lee, C-C. Chuang, C-C. Tsai, Dept. of Electrical Engineering, National Cheng Kung University 4:40 PM IEEE MTT-S IMS TECHNICAL SESSIONS TH4A W-band Transceiver Components and Applications PM 3:30 PM THURSDAY, JUNE 6, 2002 TH4A-6: A Micromachined Finite Coplanar Line-to-silicon Micromachined Waveguide Transition for mm- and Submillimeter-Wave Applications Y. Lee, L.P. Katehi, Radiation Lab, Univ. of Michigan; J.P. Becker, Electrical and Computer Engineering, Montana State Univ.; J.R. East, Solid State Electronics Lab, Univ. of Michigan TH4B-6: An Efficient Integral Equation Solver for the Electromagnetic Modeling of Highly-integrated Planar RF/Microwave Circuits V.I. Okhmatovski, J. Morsey, A.C. Cangellaris, Univ. of Illinois at U.C., Dept. of Electrical and Computer Engineering TH4B-7: Simulation of Resonant Modes of Rectangular DR In MIC Environment Using MPIE-MOM with Combined Entire-domain and Sub-domain Basis Functions Y. Liu, S. Safavi-Naeini, S.K. Chaudhuri, R. Sabry, Univ. of Waterloo Electrical and Computer Engineering Dept. 50 TH4C-7: Narrow-band, Band-pass Filters with Zig-Zag, Hairpin-comb Resonators G.L. Matthaei, Superconductor Technologies TH4D Special Session on Optical Processing of Antenna Signals TH4E Superconducting Components and Technology Chair: R. Minasian, Univ. of Sydney Co-chair: E. Rezek, TRW Velocium ROOM 615–617 Chair: C. Jackson, Ditrans Co-chair: J.F. Davis, Jet Propulsion Lab ROOM 602–604 TH4D-1: Invited: Multiple Output Photonic RF Phase Shifters for Optically Controlled Radar Systems H. Fetterman, J. Han, D. Chang, Dept of Electrical Engineering, Univ. of California, Los Angeles; H. Erlig, M-C. Oh, H. Zhang, Pacific Wave Communications, Los Angeles, CA; W. Steier, Dept of Electri TH4E-1: Folded Dual-mode HTS Microstrip Band Pass Filter K.F. Raihn, G.L. Hey-Shipton, Superconductor Technologies Inc. TH4D-2: Flexible Beamformer and Remoting Head for Optically Controlled Phased Array Antennas N.A. Riza, School of Optics/CREOL, Univ. of Central Florida; M.A. Arain, S.A. Khan, Photonic Information Processing Systems (PIPS) Lab TH4E-2: Ultra Selective 22 Pole, 10 Transmission Zero Superconducting Bandpass Filter Surpasses 50 Pole Chebyshev Rejectionnn G. Tsuzuki, S. Ye, S. Berkowitz, Conductus Inc. TH4E-3: A Low Loss 5 GHz Bandpass Filter Using HTS Coplanar Waveguide Quarter-wavelength Resonators Z. Ma, H. Suzuki, Y. Kobayashi, Dept. of Electrical and Electronic Systems, Saitama Univ., Japan; K. Satoh, S. Narahashi, T. Nojima, Wireless Lab, NTT DoCoMo Inc., Japan TH4D-3: A Novel 2N Beams Heterodyne Optical Beamforming Architecture Based on NXN Optical Butler Matrices B. Vidal, D. Madrid, J.L. Corral, V. Polo, A. Martínez, J. Martí, FRG/ITACA, Universidad Politécnica de Valencia (Spain) TH4E-4: Tuning Superconducting Microwave Filters by Laser Trimming N.J. Parker, S.W. Goodyear, D.J.P. Ellis, R.G. Humphreys, QinetiQ TH4E-6: Design Of Sapphire Rod Resonators to Measure the Surface Resistance of High Temperature Superconductor Films T. Hashimoto, Y. Kobayashi, Dept. of Electrical and Electronic Systems, Saitama Univ. 4:40 5:00 PM 4:50 PM TH4D-5: Optical Mixing of Antenna Signals in WDM Systems B. Cabon, IMEP; V. Girod, G. Maury, IMEP TH4D-6: Optimization of an Optical System Based on a Chirped Fibre Bragg Grating for Driving Phased Array Antennas P. Monteagudo, J. Capmany, C. de Vera, J.L. Cruz, C. Mo, Universidad Politecnica de Valencia, Spain; TH4E-7: Shunt Capacitor Approximation for HTS Microstrip Circuit Design S. Ye, Conductus Inc. 51 THURSDAY TH4D-4: Photonic True-time Delay Beamformer for Broadband Wireless Access Networks at 40 GHz Band B. Vidal, D. Madrid, J.L. Corral, V. Polo, A. Martínez, J. Martí, FRG/ITACA, Universidad Politécnica de Valencia, Spain; J.H. den Besten, F. Soares, M.K. Smit, COBRA/DIMES, Eindhoven Univ. of Technology, The Netherlands PM 4:30 PM 4:20 PM 4:10 PM 4:00 PM 3:50 PM 3:40 PM 3:30 PM NOTES THURSDAY, JUNE 6, 2002 • IF-TH INTERACTIVE FORUM • 1:30–4:30 PM THURSDAY WSCTC • CHAIR: KEN MAYS, TRIQUINT SEMICONDUCTOR • ROOM 6E IFTH-1: TE-Mode Propagation Properties of the Coupled Planar Kerr-like Nonlinear Waveguides J-G. Ma, Nanyang Technological University, Singapore IFTH-2: Generation of Wideband Electromagnetic Response Through a Laguerre Expansion Using Early Time and Low Frequency Data T.K. Sarkar, J. Koh, Syracuse Univ.; M. Salazar-Palma, Politechnique Univ. of Madrid IFTH-3: New Design of High-Q Sapphire Resonator with Distributed Bragg Reflector O. Piquet, D. Cros, S. Verdeyme, P. Guillon, IRCOM, UMR 6615 CNRS; M.E. Tobar, Dept . Physics, Univ. of Western Australia IFTH-4: Ferrite Filled Reflector Mode Converter for Axially Corrugated Waveguides A.J. Viitanen, T.M. Uusitupa, Helsinki Univ. of Technology IFTH-5: New Transmission Line Structure with Suppressed Eddy Current Effects M. Peter, P. Baureis, Univ. of Applied Sciences Würzburg-Schweinfurt, RF-design; H. Hein, F. Oehler, Fraunhofer Institute for Integrated Circuits, Erlangen, Germany IFTH-6: An Analytical Based Method for the Microwave Imaging of Cylindrically Stratified Media M.J. Akhtar, A.S. Omar, FET-IESK, Univ. of Magdeburg IFTH-7: Resonant Tunneling of Microwave Energy in Thin Film Multilayer Metal/Dielectric Structures A. Eriksson, A. Deleniv, S. Gevorgian, Dept. of Microelectronics MC-2, Chalmers Univ. of Technology, Sweden; Microwave and High Speed Research Center, Ericsson Microwave Systems, Moelndal, Sweden IFTH-8: High Functionality Mode Transformers with Bandwidth Control and Mode Selectivity M. Yang, K.J. Webb, School of Electrical and Computer Engineering, Purdue Univ., West Lafayette, IN IFTH-9: Frequency Parameterization of Open Structures by Modal Decomposition Using Finite Elements and Spherical Modes Y. Adane, A. Gati, M.F. Wong, France Télécom R&D — DMR/IIM; V.F. Hanna, Laboratoire Instruments et Systèmes Université Pierre et Marie Curie IFTH-10: Novel Wave Effects on Anisotropic and Ferrite Planar Slab Waveguides in Connection with Singularity Theory A.B. Yakovlev, The Univ. of Mississippi, Dept. of Electrical Engineering; G.W. Hanson, The Univ. of Wisconsin-Milwaukee, Dept. of Electrical Engineering and Computer Science IFTH-11: FEM-based Reduced-order Model for Steady-state Skin-effect Analysis in Lossy Lines F. Carbonera, F. Bertazzi, M. Goano, G. Ghione, Politecnico di Torino, DELEN IFTH-12: Modified RWG Basis Functions for Analysis of Periodic Structures P.S. Simon, Space Systems/Loral, Palo Alto, CA IFTH-13: Line-integral Formulation of the Hybrid MM/FEM Technique V. Crino, Space Engineering SpA. Via dei Berio 91 00155 Rome, Italy; C. Tomassoni, M. Mongiardo, DIEI, Università di Perugia, Via G. Duranti, Perugia, Italy IFTH-14: Efficient Calculation of Effective Material Parameters in Metamaterials Using FDT and a Modal Approach R. Schuhmann, T. Weiland, Technische Universität Darmstadt, Computational Electromagnetics Lab (TEMF) IFTH-15: An Efficient Technique for the Iterative Solution of Large Dense Matrices Arising in Method of Moments Simulation of MMIC Problems V.V.S. Prakash, Electromagnetic Communication Lab, Pennsylvania State Univ.; R. Mittra, Director, ECL, EE Dept., Pennsylvania State Univ. IFTH-16: Multiple Scattering Among Vias in Planar Waveguides Using SMCG Method C-C. Huang, L. Tsang, Univ. of Washington, Dept. of Electrical Engineering, Seattle; C.H. Chan, Dept. of Electronic Engineering, City Univ. of Hong Kong, Hong Kong IFTH-17: Development of an Unconditionally Stable Full Wave 2D ADI FDTD Method for Analysis of Arbitrary Wave Guiding Structures. PDF Ch. Ma, Z. Chen, Dalhousie Univ., Dept. of E&CE, Halifax, Nova Scotia, Canada; A-P. Zhao, Nokia Research Center,Helsinki, Finland IFTH-18: Direct EM-based Optimization of Advanced Waffle Iron Filters with Improved Performance F. Arndt, J. Brandt, Microwave Dept., Univ. of Bremen, Bremen, Germany IFTH-19: A New Time Domain Near Field to Far Field Transformation for FDTD in Two Dimensions F. Xu, W. Hong, Dept. of Radio Engineering, Southeast Univ. IFTH-20: 2-D Envelope Finite Element (EVFE) Technique — Implementation of PML and Dispersive Medium W. Yao, Y. Wang, T. Itoh, Dept. of Electrical Engineering, Univ. of California at Los Angeles, IFTH-21: Efficient Transient Simulation of Transmission Lines M. Condon, School of Electronic Engineering Dublin City Univ. Glasnevin Dublin, Ireland IFTH-22: Inductance Formula of a Square Spiral Inductor on Grounded Substrate by Duality and Synthetic Asymptote W.C. Tang, Y.L. Chow, City Univ. of Hong Kong IFTH-23: Electromagnetic/Circuit Co-optimization of Lumped Component and Physical Layout Parameters Using Generalized Layout Components J. Sercu, F. Demuynck, Agilent Technologies, EEsof EDA IFTH-24: CAD of Multipactor-free Waveguide Components for Communication Satellites M. Ludovico, L. Accatino, G. Zarba, Telecom Italia Lab; M. Mongiardo, DIEI, Universita’ di Perugia IFTH-25: CAD of Waveguide Structures with Production Based Radii at Arbitrary Double (E-H) Plane Steps and Junction Ports J.M. Reiter, R. Beyer, Mician GbR, Bremen, Germany; U. Rosenberg, Marconi Communications GmBH, Backnang, Germany IFTH-26: Electrothermal Modeling of Multi-fingered PHEMTs Applying a Global Approach E. Byk, D. Lopez, D. Baillargeat, S. Verdeyme, R. Quéré, R. Sommet, P. Guillon, IRCOM — Université de Limoges, France; E. Laporte, M. Soulard, ALCATEL Space industries, Toulouse, France IFTH-27: Accurate Computer Aided Design of Interdigital Filters Applying a Coupling Identification Method C. Saboureau, S. Bila, D. Baillargeat, S. Verdeyme, P. Guillon, IRCOM-UMR CNRS IFTH-28: Language Design Requirements for VVHDL-RF-MW™ J Willis, J Johnson, FTL Systems IFTH-29: CAD of Integrated Passives on Printed Circuit Boards Through Utilization of Multiple Material Domains P.J. Draxler IFTH-30: EM-based Optimization Exploiting Partial Space Mapping and Exact Sensitivities J.W. Bandler, McMaster Univ. and Bandler Corp.; A.S. Mohamed, M.H. Bakr, McMaster Univ. Dept. of Electrical and Computer Engineering; K. Madsen, J. Søndergaard, Technical Univ. of Denmark Dept. of Math IFTH-31: ANN and EM-based Models for Fast and Accurate Modeling of Excitation Loops n Combline-type Filters A. Borji, D. Busuioc, S. Safavi-Naeini, S.K. Chaudhuri, Dept. of ECE, Univ. of Waterloo, Waterloo, Ontario, Canada IFTH-32: IC Package Characterization Software and Its Application to RFIC Design K. Goto, Y. Horio, Tokyo Denki Univ., Dept. of Electronics Engineering; A. Dec, K. Suyama, Epoch-Technologies IFTH-33: Constrained EM-based Modeling of Passive Components T. Dhaene, Agilent EEsof Comms EDA, Agilent Technologies; J. De Geest, D. De Zutter, Dept. of Information Technology (INTEC), Ghent Univ., Belgium IFTH-34: Microwave Noise Sources in AlGaAs/GaAs HBTs P. Sakalas, M. Schroter, Dresden Univ., Elektronische Bauelemente und Integrierte Schaltungen; P. Zampardi, Conexant Systems Inc., RF Component Engineering; H. Zirath, Chalmers Univ., Dept. of Microelectronics; R. Welser IFTH-35: A Practical Small-signal Equivalent Circuit Model for RF-MOSFETs Valid up to the Cut-off Frequency H. Kawano, M. Nishizawa, S. Matsumoto, S. Mitani, M. Tanaka, N. Nakayama, H. Ueno, M. Miura-Mattausch, Graduate School of Advanced Sciences of Matter, Hiroshima Univ.; H.J. Mattausch, Research Center for Nanodevices and Systems, Hirochima Univ. IFTH-36: The Equivalent Circuit Modeling of Defected Ground Structure with Spiral Shape C.S. Kim, K.Y. Kang, Telecommunication Basic Research Lab., ETRI, ROK; J.S. Lim, S. Nam, School of Electrical Eng., Seoul National Univ., ROK; J.I. Park, D. Ahn, Div. of Information Technology Eng.; G.Y. Kim IFTH-37: HBT Small Signal Tee and Pi Model Extraction Using a Simple, Robust and Fully Analytical Procedure P.J. Tasker, Univ. of Cardiff, Cardiff, Wales, UK; M. Fernandez-Barciela, Univ. of Vigo, Vigo, Galicia, Spain IFTH-38: Completely Consistent No Charge PHEMT Model Including DC/RF Dispersion C-J. Wei, Y.A. Tkachenko, J. Gering, D. Bartle, Alpha Industries Inc., Woburn, MA IFTH-39: A Simple HBT Large Signal Model for CAD I Angelov, Microwave Electr. Lab, Chalmers Univ., Goteborg Sweden; A. Inoue, Mizuhara, Itami, Hyogo, Japan; K. Choumei, Melco Co. IFTH-40: A New Large Signal InP/InGaAs Single HBT Model Including Self-heating and Impact Ionization Effects T. Kim, K. Yang, Dept. of Electrical Engineering and Computer Science, KAIST IFTH-41: Large-signal Circuit-based Time Domain Analysis of High Frequency Devices Including Distributed Effects M. Valiullah, K. Liu, S.M. El-Ghazaly, S. Goodnick, ASU IFTH-42: The Smoothie “Data Base Model for the Correct Modeling of Non-linear Distortion in FET Devices” V. Cuoco, L.C. de Vreede, M.P. van der Heijden, Delft Univ. of Technology, Information Technology and Systems Dept., Lab. of Electronic Components, Technology & Materials ECTM, The Netherlands IFTH-43: The Assessment of Output Digital Spectra in Quasi Enhancement-mode PHEMTs by a Modified Large-signal Model S-C. Yang, C-W. Wang, C-K. Lin, Y-J. Chan, Dept. of Electrical Engineering, National Central Univ., Chungli, Taiwan, ROC IFTH-44: Extraction of a Polynomial LDMOS Model for Distortion Simulations Using Small-signal S-Parameter Measurements J. Vuolevi, T. Rahkonen, Electronics Lab, Dept. of Electrical Engineering, Univ. of Oulu, Finland; J. Aikio, Elektrobit Ltd, Tutkijantie, Oulu, Finland IFTH-45: Direct Observation of Loadlines in MESFET by Using Average RF Gate and Drain Currents C.C. Meng, C.H. Chang, Dept. of Electrical Engineering, National Chung-Hsing Univ.; J.F. Kuan, G.W. Huang, National Nano Device Lab IFTH-46: Implemention of a Scalable and Statistical VBIC Model for Large-signal Analysis and Intermodulation Distortion Of SiGe HBTs M.R. Murty, K.M. Newton, S.L. Sweeney, D.C. Sheridan, D.L. Harame, Communications R&D Center, IBM Microelectronics, Essex Junction, VT IFTH-47: Statistical Study of Metrics for Nonlinear Model Evaluation K.A. Remley, J.A. Jargon, D.C. DeGroot, D. Schreurs, K.U. Leuven, National Institute of Standards and Technology, IFTH-48: Simulation of RF Circuits Driven by Modulated Signals Without Bandwidth Constraints J.C. Pedro, N.B. Carvalho, Instituto de Telecomunicacoes, Universidade de Aveiro, Aveiro, Portugal IFTH-49: Global Coupled Electromagnetic-electrical-thermal Simulation and Experimental Validation for a Spatial Power Combining MMIC Array W. Batty, C.E. Christoffersen, A.B. Yakovlev, J.F. Whitaker, M. Ozkar, S. Ortiz, A. Mortazawi, R. Reano, K. Yang, L.P.B. Katehi, C.M. Snowden, M.B. Steer, Institute of Microwaves and Photonics, School of Elec. IFTH-50: Analysis and Elimination of Parametric Oscillations in Monolithic Power Amplifiers A. Anakabe, J.M. Collantes, J. Portilla, J. Jugo, Univ. of the Basque Country Electricity and Electronics Dept.; A. Mallet, L. Lapierre, CNES, Toulouse Space Center; J.P. Fraysse, ALCATEL Space IFTH-51: Nonlinear Analysis of a Microwave Fractional Synthesizer S. Sancho, A. Suarez, J. Chuan, DICOM, Univ. of Cantabria IFTH-52: Universal Parameterized Nonlinear Device Model Formulation for Microwave Circuit Simulation C.E. Christoffersen, S. Velu, M.B. Steer, Dept. of Electrical and Computer Engineering, N. Carolina State Univ. 52 THURSDAY, JUNE 6, 2002 • IF-TH INTERACTIVE FORUM (cont.) • 1:30–4:30 PM WSCTC • ROOM 6E IFTH-63: A Novel Signal Processing Approach for Microwave Doppler Speed Sensing S. Moedl, M. Hackner, Fraunhofer-Institut fuer Integrierte Schaltungen IFTH-64: Ultra-fast Broadband EMI Measurement in Time Domain Using Classical Spectral Estimation F. Krug, P. Russer, Technische Universitaet Muenchen, Lehrstuhl fuer Hochfrequenztechnik IFTH-65: An Accurate Complex Behavior Test Bed Suitable for 3G Power Amplifiers Characterization S. Boumaiza, F.M. Ghannouchi, Poly-Grames Research Center, Dept. of Electrical Engineering, Ecole Polytechnique, Montreal, Quebec, Canada IFTH-66: A New Satellite Repeater Amplifier Characterization System for Large Bandwidth NPR and Modulated Signals Measurements A. Mallet, F. Gizard, L. Lapierre, J. Sombrin, CNES, Toulouse Space Center,France; T. Reveyrand, IRCOM, Univ. of Limoges, France IFTH-67: Quantitative Extraction and Compensation of Excess Inductance: Case Study of a Digital Attenuator Chip S.C. Choi, D.H. Kwon, K.H. Kim, S.W. Hwang, Korea Univ. Dept. of Electronics Engineering IFTH-68: Vector Corrected Noise Temperature Measurements M.H. Weatherspoon, L.P. Dunleavy, Dept. of Electrical Engineering, Univ. of South Florida; A. Boudiaf, Agilent Technologies, N. Billerica, MA; J. Randa, National Institute of Standards and Technology, Boulder, CO IFTH-69: Sensitivity Analysis of Calibration Standards for Fixed Probes Spacing On-wafer Calibration Techniques M.E. Safwat, L. Hayden, Cascade Microtech Inc., Beaverton, OR IFTH-70: Estimation of Deep-seated Profile of Temperature Distribution Inside Biological Tissues by Means of Multifrequency Microwave Thermograph B. Stec, W. Susek, A. Dobrowolski, Military Univ. of Technology, Faculty of Electronics, Poland IFTH-71: A Bioelectromagnetic Overview of the Universal Mobile Telecommunication System (UMTS) M. Cappelli, DIEI, Univ. of Perugia, Italy; L. Tarricone, Dept. of Innovation Engineering, Univ. of Lecce, Italy IFTH-72: 3-D Scalar Microwave Image Reconstruction Algorithm P.M. Meaney, Q. Fang, S.H. Geimer, A.V. Streltsov, K.D. Paulsen, Thayer School of Engineering, Dartmouth College THURSDAY IFTH-53: Characterization of Intermodulation Distortion in Multicarrier Transmission Systems K. Naishadham, Systems Terchnology Center, Syracuse Research Corp. IFTH-54: M-ARY PSK Signal Power Spectrum at the Output of a Nonlinear Power Amplifier F. Launay, Y. Wang, S. Toutain, IRCCyN SETRA, École polytechnique de Université de Nantes, France IFTH-55: A Semi-limped Balun Fabricated by Low Temperature Cofired Ceramic C-W. Tang, C-Y. Chang, Hsinchu 300, Taiwan, Dept. of Communication Engineering, National Chiao Tung Univ. IFTH-56: Low-cost Flip-chip Alternatives for Millimeter Wave Applications J. Heyen, J. Schroeder, A.F. Jacob, Institut fuer Hochfrequenztechnik, TU Braunschweig, Braunschweig, Germany IFTH-57: X-band Microstrip Bandpass Filter Using Photoimageable Thick-film Materials C.Y. Ng, M.S. Aftanasar, I.D. Robertson, Microwave and Systems Research Group (MSRG), School of Electronics, Computing and Mathematics, Univ. of Surrey; M. Chongcheawchamnan, Maharnankorn Telecommunication Dept.; J. Minalgiene IFTH-58: Novel Lumped-element Coplanar Waveguide-to-coplanar Stripline Transitions with Low-pass and High-pass Characteristics Y-S. Lin, C.H. Chen, Dept. of Electrical Engineering and Graduate Institute of Communication Engineering, National Taiwan Univ., Taipei, Taiwan IFTH-59: RF Microwave Multi-band Design Solutions for Multilayer Organic System on Package Integrated Passives M.F. Davis, S-W. Yoon, S. Mandal, M. Maeng, K. Lim, S. Pinel, J. Laskar, M. Tentzeris, T. Nonaka, V. Sundaram, F. Liu, R. Tummala, Georgia Institute of Technology; A. Sutono, RF Solutions Inc. IFTH-60: Coupling Between Microstrip Lines with Finite Width Ground Plane Embedded in Polyimide Layers for 3D-MMICs on Si GE. Ponchak, NASA Glenn Research Center, Cleveland, OH; E. Dalton, E.M. Tentzeris, J. Papapolymerou, Georgia Institute of Technology, Atlanta, GA IFTH-61: A Novel Directional Coupler for PCB and LTCC Applications A. Sawicki, Ericsson Radio Access AB, Stockholm, Sweden; K. Sachse, Wroclaw Univ. of Technology, Wroclaw, Poland IFTH-62: High Performance Spiral Inductors Embedded on Organic Substrates for SOP Applications S.H. Lee, S. Kim, Georgia Institute of Technology, Atlanta, GA 53 FRIDAY WORKSHOPS WFB: EVOLUTION OF THE PHOTONIC ANTENNA WFA: CRYOGENIC AND SUPERCONDUCTOR MICROWAVE SUBSYSTEMS Date & Time: Friday, June 7; 8:00 AM to 5:00 PM Date & Time: Friday, June 7; 8:00 AM to 12:00 PM Location: Washington State Convention & Trade Center Location: Washington State Convention & Trade Center Topics & Speakers: Topics & Speakers: ✗ Fundamentals of Microwave Superconductivity, M.A. Hein, University of Wuppertal ✗ Fundamentals of Passive High-Temperature Superconductive (HTS) Microwave Components, H.J. Chaloupka, University of Wuppertal ✗ Design, Technology and Fabrication of HTS Filters, T. Kaesser, Tesat-Spacecom ✗ Tunable Devices at Cryogenic Temperatures, D.E. Oates, Lincoln Laboratory ✗ Cryogenic Dielectric Resonator Devices, N. Klein, Juelich Research Center ✗ Cryogenically Cooled Field Effect Transistors for Low Noise Applications, M.W. Pospieszalski, Inphi Corp. ✗ Cryogenic Refrigeration Technology, M. Nisenoff, M. Nisenoff Associates ✗ Cryogenic Subsystems for Wireless Base Stations, R.B. Hammond, Superconductor Technologies Inc. ✗ Active Superconductive Devices for Microwave Applications, M. Siegel, Juelich Research Center ✗ The Commercial Evolution of Fiber Optic Wireless Sytems, Henry Wojtunik, Anacom Systems Corp. ✗ Taking the Cost of Complexity Out of the Photonic Antenna, Dr. Dave Wake, UCL ✗ Photonic Feeding Coplanar Patch Antennas for Microwave and Millimeter-wave Wireless Communication System, Dr. Keren Li and Dr. Masayuki Izutzu, CRL ✗ Planar Antennas for Photonic-Microwave Conversion, Kevin M.K.H. Leong and Professor Tatsuo Itoh, UCLA ✗ Lightwave Antennas for Inter-satellite Communications, Professor Tadashi Takano, Astronautical Instutite of Japan ✗ Optical Control of the Active Integrated Antenna, Professor Shigeo Kawasaki, Tokai University Organizers: Prof. Dr. Heinz J. Chaloupka, University of Wuppertal Dr. Norbert Klein, Juelich Research Center Sponsor: MTT-18 Microwave Superconductivity Organizers: Charles Cox, Photonic Systems Inc. Tatsuo Itoh, UCLA Sponsors: MTT-3 Microwave Photonics MTT-20 Wireless Communication Today when we speak of using photonics for antenna remoting, we are basically talking about the photonics replacing conventional components, such as coax. Important as these initial applications have been, they are really just the first step along a path that eventually could lead to the evolutionary merging of the two fields: photonics and antennas. A second evolutionary step, which we are already beginning to see, is integrating photonics with antennas. The third and ultimate step in the evolution is the photonic antenna. In this stage new devices are employed which transition directly between the free space electro-magnetic wave and the modulated optical carrier. This session will present work in all phases of Photonic Antenna evolution. Cryogenic microwave systems represent a challenging approach to match the highest performance requirements with respect to extremely low noise figures, superior selectivity and high functional density. Those systems include passive high-Q components which are realized from high-temperature superconductors (HTS) and/or cooled low-loss dielectric materials. In addition, cryogenic semiconductor devices, like LNAs, mixers etc. contribute to an improvement of system performance. In the first three lectures of this tutorial short course fundamentals of microwave superconductivity and applications of high-temperature superconductivity for passive microwave devices, like pre-select filters, chirp filters etc., will be covered. This introduction is followed by a lecture on re-configurable and tunable filters based on a combination of HTS circuits with ferroelectric and/or ferrimagnetic structures as well as with MEMS. Subsequent parts of the short course deal with cryogenic dielectric devices as well as with cryogenic low-noise amplifiers and mixers. The succeeding lectures are devoted to cryocoolers and specific packaging issues for cryogenic systems. A lecture on cryogenic subsystems for wireless base stations will demonstrate how superior performance on the component level can be transformed into a significant benefit on the system level. Furthermore, this lecture will cover the status of commercialization of this new technology. In a final lecture, the fundamentals of nonlinear millimeter and submillimeter wave components based on the Josephson effects are presented. WFC: OPTICAL PACKAGING TECHNIQUES COMBINING OPTICS & ELECTRONICS Date & Time: Friday, June 7; 8:00 AM to 12:00 PM Location: Washington State Convention & Trade Center Topics & Speakers: ✗ ✗ ✗ ✗ ✗ ✗ S.J. Ben Yoo, University of California at Davis Alan Lindner, Stratedge Corp. Berinder Brar, Rockwell Science Center Vince Hietala, Quellan Hongwei Liang, Multilink James A. Hathaway, Velocium Organizers: Joy Laskar, Georiga Institute of Technology Alan Lindner, StratEdge Corporation Sponsor: MTT-12 Microwave and Millimeter Wave Packaging FRIDAY This workshop will address enabling technologies for packaging techniques for high performance optoelectronics including OC-192, OC768, 10 GB Ethernet and combined optical/microwave techniques. The half day workshop will be equally divided into an overview of system requirements, enabling optical technologies and enabling packaging technologies. Speakers will come from leading industry and academic institutions. 54 ARFTG 59th MICROWAVE MEASUREMENT CONFERENCE F R T A G CONFERENCE ORGANIZATION Conference Chair Dr. Edward M. Godshalk Maxim Integrated Products T (503) 641-3737 x1633 F (503) 644-9929 [email protected] Technical Program Chair Dr. Alfy Riddle Macallan Consulting T (408) 262-3575 [email protected] Exhibits and Conference Chair Dr. Leonard Hayden Cascade Microtech Inc. T (503) 601-1580 F (503) 601-1601 [email protected] EXECUTIVE COMMITTEE Dr. Charles Wilker, President DuPont Superconductivity Brian Pugh, Vice-President & Electronic Communication SiliconWave J. Gregory Burns, Secretary & Publications Northrop Grumman Ken Wong, Treasurer Agilent Technologies David Walker, Education NIST Dr. Edward M. Godshalk, Nominations Maxim Integrated Products Dr. Kate Remley, Publicity NIST TEST, MEASUREMENT AND CHARACTERIZATION OF HIGH SPEED DIGITAL COMPONENTS AND SYSTEMS AUTOMATIC RF TECHNIQUES GROUP Welcome to the 59th Automatic RF Techniques Group (ARFTG) Conference being held at the Washington State Convention and Trade Center on Friday, June 7, 2002. The conference theme is “Test, Measurement and Characterization of High-Speed Digital Components and Systems.” The demand for high data rates and broad-bandwidth wireless and fiber networks has resulted in high speed digital circuits with clock rates up to 40 GHz and beyond. Developing these products has led to remarkable challenges and opportunities as engineers are forced to meet both digital and microwave demands simultaneously. Presentations will discuss test, measurement and characterization issues in both the time and frequency domain plus related topics such as packaging solutions, circuit model extraction and interconnect characterization. In addition, papers concerning traditional ARFTG topics such as noise measurements, nonlinear characterization, S-parameter network analysis, calibration and on-wafer measurements will be included. The ARFTG conference is a great opportunity to meet and interact with many experts in the RF and microwave test community. You will have ample opportunity to meet with other attendees, presenters and leaders in measurement community at the continental breakfast and breaks in the exhibition area, interactive forum sessions and the luncheon. LOCATION The 59th ARFTG Conference will be held in rooms 602–604 of the Convention Center. You may reserve your hotel room using the IMS Conference Housing Form. Visit www.ims2002.org/hotelregistration.html for more information. There will also be a joint IMS/ARFTG session on Thursday, June 6 titled “Highspeed/Non-contacting Electrical Probing” with particular emphasis on instrumentation and calibration techniques for testing digital circuitry associated with highspeed optical links, and non-contact probing for testing dense digital integrated circuits. SCHEDULE John Cable, Standards Honeywell FM&T Dr. Leonard Hayden, Exhibits Cascade Microtech Raymond W. Tucker, Membership Air Force Research Lab Dr. Dylan Williams, Technical Coordinator NIST Robert M. Judish, Past-President NIST EX-OFFICIO MEMBERS Doug Rytting, Awards Agilent Technologies Friday, June 7 Activity Convention Center Room 7:00 AM – 4:00 PM 7:00 AM – 8:00 AM 7:00 AM – 8:00 AM 8:00 AM – 9:45 AM 9:45 AM – 10:30 AM 10:30 AM – 12:00 NOON 12:00 NOON – 1:15 PM 1:15 PM – 3:00 PM 3:00 PM – 3:30 PM 3:30 PM – 4:50 PM Exhibition and Interactive Forum Continental Breakfast Speaker’s Breakfast Technical Session 1 Exhibition/Poster Session Technical Session 2 Luncheon Technical Session 3 Exhibition/Poster Session Technical Session 4 606–607 606–607 611 602–604 606–607 602–604 611–614 602–604 606–607 602–604 Jim L. Taylor, Executive Secretary Chris Potter, ARMMS Liaison P&H Technology Consultants Dr. Roger Marks, MTT-S Liaison NIST EXHIBITS The 59th ARFTG Conference also offers an outstanding exhibition opportunity. Please contact our Exhibits Chair directly for further information. www.arftg.org 55 µAPS Microwave Application & Product Seminars µAPS are technical, product-oriented seminars presented near the trade show floor in Room 310. MESSAGE FROM THE 2002 µAPS CHAIRMAN The µAPS are in their seventh year serving as a forum for exhibitors. The µAPS provide technical information and background related to commercially available state-of-the-art products of interest to the microwave community. The product seminars will cover materials, active and passive components, EM simulation, circuit and system simulation and models, test and measurement topics, and foundry services. Individual presentations will be 20 minutes long, inclusive of questions and answers. Provisions are made for presenters to display and share product literature related to their presentations. The µAPS are open to all technical conference and exhibit attendees. The seminars will be held in a location close to the exhibit floor in the Washington State Convention and Trade Center on Tuesday, Wednesday and Thursday, June 4–6, 2002 in conjunction with the IMS 2002 Exhibition. Lisa Critchlow µAPS Chair 2002 µAPS SCHEDULE The 2002 Microwave Application & Product Seminars will be held on Tuesday, Wednesday and Thursday, June 4–6, 2002 in conjunction with the 2002 International Microwave Symposium at the Washington State Convention and Trade Center. The series of individual presentations is open to any exhibition or conference attendee. Tuesday, June 4, 2002 Wednesday, June 5, 2002 Thursday, June 6, 2002 9:00 AM–4:40 PM 9:00 AM–5:00 PM 9:00 AM–2:20 PM µAPS — MICROWAVE APPLICATION & PRODUCT SEMINARS — TECHNICAL PROGRAM TUESDAY, June 4, 2002 — ROOM 310, WSCTC Osprey Metals Have Developed a Novel Range of Al/Si Alloys ANDREW OGILVY, OSPREY METALS LTD. 9:00–9:20 AM Elements of Magnetic Circuit Design and Magnet Material Selection 9:20–9:40 AM ANTHONY PARAKKA, DEXTER MAGNETIC TECHNOLOGIES Cost-performance Substrate Solutions for High Volume RF Devices 9:40–10:00 AM GREGG WILDES, GORE ELECTRONIC MATERIALS Building RF and Microwave Circuits with Constrained Low Temperature Cofired Ceramics (LTCC) 10:00–10:20 AM JOE MAZZOCHETTE, LAMINA CERAMICS INC. Pure Copper Layers on Copper-Tungsten Composite Heatsink for Electronic Packages 10:20–10:40 AM LARRY CHATFIELD, KYOCERA AMERICA INC. Variable Integrated Passive (VIP) Components Using Thin-film Ferroelectric Technology 10:40–11:00 AM R.A. YORK, C. ELSASS, C.R. BISCHOF, AGILE MAERIALS AND TECHNOLOGIES Evolution of the BNC: From Common Connector to Miniaturized High Frequency Solution 11:00–11:20 AM DALE REED, TROMPETER ELECTRONICS INC. Save Time with New Interconnects for the Next Generation Base Station 11:20–11:40 AM DOUGLAS FINAN, HUBER + SUHNER Ceramic Monolithic Block Filters for RF and Microwave Applications 11:40–12:00 AM EDWARD LIANG, BRYAN CHEN, MCV TECHNOLOGIES INC. Super-mini Blows a Hole in the Equalizer Performance Wall 1:00–1:20 AM JOE FOREMAN, KAMAN INSTRUMENTATION Connector Design Combines High Performance and the Ability to Blindmate — All with Less Contact Engagement Required 1:20–1:40 AM RICHARD HEALEY, LITTON WINCHESTER/NORTHROP GRUMMAN Waveguide R-switch Redundant Networks for Multiple Amplifier Multimedia Communications Systems 1:40–2:00 AM STEVE HACK, LOGUS MICROWAVE CORP. Low Loss MMIC Filters from 10 to 50 GHz 2:00–2:20 AM TIMOTHY L. CHILDS, TLC PRECISION WAFER TECHNOLOGY Technical Product Literature — Application Principles for Circulators and Isolators 2:20–2:40 AM TONY ELDRIDGE, RODGER BILLINGS, M2 GLOBAL TECHNOLOGY LTD. New Low Spur-wide BW Direct Digital Synthesizer Demo and Presentation 2:40–3:00 PM BRIAN DAVIS, ITT INDUSTRIES INC., AES-MICROWAVE SYSTEMS Enhanced Phase Noise Performance Crystal Oscillator Using an Ulatralow Dropout Voltage Regulator 3:00–3:20 PM FINN JENSEN, KEN JENSEN, RUSS WEBER, TRAK MICROWAVE CORP. New Synthesizer DesignDelivers YIG Benefits without the Drawbacks 3:20–3:40 PM LANCE HAAG, VERTICOM INC. MMIC Oscillator Chips from 20 to 80 GHz 3:40–4:00 PM TIMOTHY L. CHILDS, TLC PRECISION WAFER TECHNOLOGY Ka-band Phase Shifters, Modulators and Switches from 20 to 40 GHz 4:00–4:20 PM TIMOTHY L. CHILDS, TLC PRECISION WAFER TECHNOLOGY High-power Tunable Microwave Sources of High Frequency Stability 4:20–4:40 PM WOJCIECH GWAREK, QWED 56 SESSION I 9:00–11:00 AM Materials SESSION II 11:00 AM–2:40 PM Passive Components SESSION III 2:40–4:40 PM Modulators, MEMs, Oscillators WEDNESDAY, June 5, 2002 — ROOM 310, WSCTC GSM/Edge Triple-band Power Amplifier Module ALVAN BEZOOIJEN, PHILIPS SEMICONDUCTORS 9:00–9:20 AM Packaging a 17–24 GHz PA MMIC DAVID RICHARDSON, MIMIX BROADBAND 9:20–9:40 AM New Sirenza Microdevices Power Amplifier RFICs Deliver Unequalied Linearity and ACP Performance JOANN CHUN, RAY CRAMPTON, NORM HILDRETH, SIRENZA MICRODEVICES (FORMERLY STANFORD MICRODEVICES) 9:40–10:10 AM SiGe-LNA at 1900 MHz for Direct Conversion Receivers MICHAEL SAGEBIEL, ATMEL GERMANY 10:00–10:20 AM A Commercial 20 GHz Balanced Optical Photoreceiver ROY HOWARD, DISCOVERY SEMICONDUCTORS INC. 10:20–10:40 AM LDMOS vs VDMOS — 30 to 510 MHz Broadband Amplifier Design S.K. LEONG, POLYFET RF DEVICES 10:40–11:00 AM Plug-n-play Power Technology SCOTT BEHAN, TALLY COSTA, XEMOD INC. 11:00–11:20 AM Demonstration of a 76 GHz MMIC Transceiver Module TIMOTHY L. CHILDS, TLC PRECISION WAFER TECHNOLOGY 11:20–11:40 AM Modeling of 24 GHz RX/TX Filters in LTCC ANDREAS WIEN, ANDREAS LAUER, IMST GMBH 11:40 AM–12:00 PM WASP-NET — CAD and Optimization Tool — New Fast Hybrid MM/FE/MoM/FD Software for Waveguide Components and Horn Antennas FRITZ ARNDT, MICROWAVE INNOVATION GROUP 1:00–1:20 PM Object Oriented and Network Based Distributed Electromagnetic Simulation and Optimization on the IE3D 9.0 JIAN-X. ZHENG, ZELAND SOFTWARE INC. 1:20–1:40 PM CST MICROWAVE STUDIO (CST MWS) Version 4.0 — The Cutting Edge 3D Electromagnetic Field Simulation Software JONATHAN OAKLEY, CST OF AMERICA INC. 1:40–2:00 PM Accurate 3D EM Simulations and Precision Machining for Low Cost Microwave and Millimeter-Wave Filters/Diplexers MACIEJ ZNOJKIEWICZ, ADAM ABRAMOWICZ, MWTG TELECOM, WARSAW UNIV. OF TECHNOLOGY AND QWED COMPANY 2:00–2:20 PM Full-wave 3D EM Design with no Need for 3D Drawing MALGORZATA CELUCH, QWED 2:20–2:40 PM Fast and Accurate EM Design of Coaxial Connectors and Axisymmetrical Antennas with QW-V2D MALFORZATA CELUCH, QWED 2:40–3:00 PM µWaveWizard — Seamless Integration of Fast and Flexible EM Methods PETER KRAUSS, MICIAN 3:00–3:20 PM EMPiCASSO™: An Advanced Design Tool for Printed Microwave Circuits and Antennas Arrays KAZ SABET, EMAG TECHNOLOGIES INC. 3:20–3:40 PM The New Comprehensive Multi-layer Library for ADS: MultiLIBTM ANDREAS BETTRAY, ANDREAS WIEN, IMST GMBH Vector Fields’ CONCERTO Software for Design and Analysis of RF Devices CRIS EMSON, DAVID CARPENTER, VECTOR FIELDS INC. Ansoft Designer™: The New World of Communications Design Software DAVID VYE, ANSOFT CORP. Characterization of an IQ-modulator Behavioral Model for RFIC System Design and Verification JOEL DUNSMORE, GREG JUE, JOHN KIKUCHI, AGILENT TECHNOLOGIES SESSION I 9:00–11:40 AM Devices, PAs SESSION II 11:40 AM–3:40 PM EM Simulation 3:40–4:00 PM 4:00–4:20 PM SESSION III 3:40–5:00 PM 4:20–4:40 PM Circuit/System Simulation and Models 4:40–5:00 PM THURSDAY, JUNE 6, 2002 — ROOM 310, WSCTC Efficient and Accurate Modeling of RF/Microwave Effects in a System Simulator JOEL KIRSHMAN, REZA MAHMOUDI, APPLIED WAVE RESEARCH Neural Network Aided Microwave Modeling and Design Q.J. ZHANG, CARLETON UNIVERSITY Topas 2.0 — Nonlinear FET Model and Extraction Software RÜDIGER FOLLMANN, IMST GMBH Design Flow for RF MEMS Using Coventorwave™ — Part 1: Parametric Design W. SCOTT BEST, JOE REPKE, WILLIAM SUH, COVENTOR INC. Design Flow for RF MEMS Using Coventorwave™ — Part 2: Parametric Design W. SCOTT BEST, JOE REPKE, WILLIAM SUH, COVENTOR INC. 9:00–9:20 AM 9:20–9:40 AM SESSION I 9:00–10:40 AM 9:40–10:00 AM Circuit/System Simulation and Models 10:00–10:20 AM 10:20–10:40 AM Synchronized Prematching a Family of Wideband High VSWR Tuners CHRISTOS TSIRONIS, FOCUS MICROWAVES INC. 10:40–11:00 AM New Programmable 65 GHz Tuner Using V Connectors CHRISTOS TSIRONIS, CHRIS LIU, RAYMOND JALLAD, FOCUS MICROWAVES INC. 11:00–11:20 AM Benefits of Thermal Management in the Test Environment HARLAN FALLER, JOHNSTECH INTERNATIONAL 11:20–11:40 AM Addressing the Problems of Characterizing RFIC Devices JOHN LUKEZ, CREDENCE SYSTEMS CORP. 11:40 AM–12:00 PM New Micromachining Technology Enables the Design of a Fully Impedance Controlled Probe Tip MOSTAFA DAOUDI, SUSS MICROTEC 1:00–1:20 PM InP HBT Foundry Services is available for High-Frequency Analog, Mixed-Signal, and RF Applications CHANH NGUYEN, GLOBAL COMMUNICATION SEMICONDUCTORS INC. 1:20–1:40 PM GCS is Offering Foundry Services with Multi-Purpose InGaP HBT Technology to Meet Today's Communication Needs W. YAU, D. HOU, Y. YANG, B. KUS, CHRIS LIU, RAYMOND JALLAD, GLOBAL COMMUNICATION SEMICONDUCTORS INC. 1:40–2:00 PM TriQuint Foundry Services — Your Sustainable GaAs Source ROB CHRIST, TRIQUINT SEMICONDUCTOR INC. 2:00–2:20 PM 57 SESSION II 10:40 AM –1:20 PM Test and Measurement SESSION III 1:20 –2:20 PM Foundry Services EXHIBITORS The MTT-S Exhibition is an annual event that has taken place since 1970. It comprises more than 450 microwave, subassembly, component, device, material, instrument and design software suppliers and each year draws approximately 11,000 microwave engineers involved in the design of systems, subsystems, components and devices. A-A Systel A-Alpha Waveguide Co. AC Microwave Gmbh Accent Optical Technologies Accumet Engineering Corp. ACE Technology Actipass Co. Ltd. Advance Reproductions Corp. Advanced Chemical Co. Advanced Control Components Advanced Electromagnetics Inc. Advanced Switch Technology Aeroflex Microelectronic Solutions Aeroflex Test Solutions Aeroflex Inc. Aerowave Inc. Aethercomm Inc. Agile Materials and Technologies Agilent Technologies Air Precision/Sivers AKON Inc. Alan Industries Inc. Aliner Industries Inc. Alpha Industries AMCOM Communications Inc. American Microwave Corp. American Technical Ceramics Ametek Specialty Metal Products AMITRON AML Communications Inc. Amotech Co. Amplifier Research & AR Kalmus Amplifonix Amplitronix LLC Analog Devices Inc. Anaren Microwave Inc. Anritsu Company Ansoft Corp. Ansys Inc. API Delevan Inc. Aplac Solutions Inc. Applied Microwave & Wireless Applied Specialties Inc. Applied Thin-Film Products Applied Wave Research Inc. ARC Technologies Arcom Wireless Inc. Argosy Component Sales Arlon Materials for Electronics Artech House Ascor Assemblies Inc. Astrolab Inc. Atlantic Microwave Avitronics Avnet RF & Microwave AVX Corp. BAE Systems Barry Industries Base Station/Earth Station Besser Associates Inc. Bird Component Products Bird Electronic Products Bird Technologies Group Bliley Technologies Inc. Bomar Interconnect Products Inc. Boonton Electronics BroadWave Technologies Inc. C-MAC MicroTechnology C.E. Precision Assemblies Inc. California Eastern Laboratories Carleton University Cascade Microtech Celeritek Inc. Celerity Systems Cernex Inc. Channel Microwave Corp. Chipcon AS Circuits Processing Technology Cirexx Corp. Cirqon Technologies Corp. Clarisay Inc. ClearComm Technologies LLC CMP Europe CMR Circuits Coilcraft Inc. Coleman Microwave Com Dev Ltd. Commercial Microwave Technology Inc Communication Techniques Inc. Communications & Power Industries Compac Development Corp. Compel Electronics Inc. Compex Corp. Component Distributors Inc. Component Sources Int’l COMSOL Inc. Comtech PST Connecting Devices Inc. Connectronics Inc. Continental Microwave & Tool Co. CoorsTek Corning Gilbert Inc. Corning IntelliSense Corry Micronics Cougar Components Coventor Inc. CRC Press Credence Systems Inc. CST of America Inc. CTS Wireless Components CTT Inc. Cuming Microwave Corp. Custom Cable Assemblies Inc. Cylux Technologies Inc. D-Coax Datum – Irvine DB Products Inc. Delta Electronics Dexter Magnetic Technologies Diablo Industries Thin Film Diamond Discovery Semiconductors Ditom Microwave Inc. DLI Dorado International Corp. Dow-Key Microwave DRC – Metrigraphics Ducommun Technologies Inc. DuPont Microcircuit Materials Dynamic Microcircuits Dynawave Inc. Eagleware Corp. Ecliptek Corp. EDO Corp. EE – Evaluation Engineering EiC Corp. ELANIX Inc. Elcom Technologies Inc. Electro Rent Corp. Elisra Electronic Systems Ltd. Elva-1 Ltd. EMAG Technologies EMC Technology Inc. Emerson & Cuming Microwave Products EMF Systems Emhiser Micro-Tech EMS Technologies Inc. Endwave Corp. EONCOM Ltd. Ericsson Microelectronics ETS – Lindgren Excelics Semiconductor Inc. EZ Form Cable Corp. F&K Delvotec Inc. Farran Technology Ltd. Faustus Scientific Corp. FCT Electronics LP The Ferrite Company Inc. Ferro Electronic Materials Filtel Microwave Inc. Filtran Microcircuits Inc. Filtronic Components Ltd. Filtronic Solid State First Technology Flexco Microwave Inc. Flomerics Inc. Florida RF Labs Focus Microwaves Inc. Fotofab Frequency Management Fujitsu Compound Semiconductor Inc. Fujitsu Microelectronics Inc. G.T. Microwave Gaiser Tool Co. Gannon & Scott Gavish Inc. Gawell Technology Inc. Gel-Pak/Quik Pak GGB Industries Inc. GHz Technologies Inc. GHz Technology Inc. Giga Solution Tech Co. Ltd. Giga-tronics Gigatech Co., Ltd. GIL Technologies Global Communication Semiconductors W.L. Gore & Associates Inc. Gowanda Electronics Harbour Industries Haverhill Cable & Mfg. Co. HCC Industries Inc. HEI Inc. Heraeus Inc. Herley Industries Herotek Inc. Hexawave Inc. Hitachi Metals America Hitachi Semiconductor America Hittite Microwave Corp. Honeywell Huber + Suhner Hypertronics Corp. Hytronics Corp. IBM IEEE Microwave Magazine/IEEE Media IMI Inc. IMS Connector Systems The 2002 Exhibition will be held in the Washington State Convention and Trade Center. Exhibition hours are Tuesday, June 4 and Wednesday, June 5 from 9:00 AM to 5:00 PM, and Thursday, June 6 from 9:00 AM to 3:00 PM. Following is a list of exhibiting companies. The list is complete as of press time, but may not include all companies. IMST GmbH In-Phase Technologies Infineon Technologies Instruments For Industry Integra Technologies Inc. Integrated Microwave Corp. International Crystal Mfg. International Manufacturing Svcs. Interpoint, a Crane Co. company Ion Beam Milling Inc. IQE Inc. ITT Industries IW Ixion Technologies JCA Technology, a NEW FOCUS company JFW Industries Inc. Johanson Manufacturing Johanson Technology Inc. Johnson Components/Cambridge Prod. Johnstech International Corp. Jye Bao Co. Ltd. K&L Microwave Inc. Kaman Instrumentation Keithley Instruments Inc. Kemac Technology Inc. Kevlin Knowledge*on Inc. Korea Sangshin Electric Co. Ltd. Krytar Inc. KW Microwave Corp. Kyocera America Inc. Kyocera Industrial Ceramics Corp. Labtech Limited Lamina Ceramics Inc. Lark Engineering Laser Processing Technology Laser Services Inc. Litron Inc. Logus Microwave Corp. Lorch Microwave LPKF Laser & Electronics Lucas/Signatone Corp. Lucix Corp. M2 Global Technology Ltd. M/A-COM Marconi Applied Technologies Maryatt Technologies Inc. Maury Microwave Corp. MCE Technologies (Nanjing) Co. Ltd. MCE Technologies Inc. MCE/DML Microwave, Ltd. MCE/Inmet Corp. MCE/KDI-Integrated Products MCE/KDI-Resistor Products MCE/Metelics Corp. MCE/Weinschel Corp. MCV Technologies Inc. MECA Electronics Inc. Mega Circuit Inc. MegaPhase Meggitt Safety Systems MEMSCAP Inc. Merrimac Industries Metallix Inc. MH&W International Corp. MICA Microwave Corp. Mician GbR Micralyne Micro Lambda Wireless Inc. Micro Networks, an ICS company Micro-Coax Inc. Micro-Mode Products Inc. Microlab FXR Microlab Inc. Micromanipulator Co. (The) MicroMetrics Inc. Micronetics Microphase Corp. Microsemi Corp. Microsource Microtech Inc. Microwave Applications Group Microwave Circuits Inc. Microwave Communications Labs Inc. Microwave Development Company Inc. Microwave Development Labs Inc. Microwave Device Technology Corp. Microwave Devices Inc. Microwave Dynamics Microwave Engineering Europe Microwave Journal Microwave Product Digest Microwave Solutions Limited Microwave Technology Inc. (MWT) Mid-Atlantic RF Systems MIG Microwave Innovation Group Millitech, LLC Mimix Broadband Mini-Circuits Mini-Systems Inc. Mission Telecom (Inc.) MI Technologies MI.TEL SRL MITEQ Inc. 58 Mitsubishi Electric & Electronics MMCOMM Inc. Modco Inc. Modular Components National Inc. Molex RF/Microwave Connector Div. Monitor Products Company Inc. Motorola SPS MRSI MTI – Milliren Technologies Inc. Murata Electronics N.A. Inc. Nanowave Inc. Narda Microwave Narda Microwave East Narda Microwave Group Narda Microwave West Narda Safety Test Solutions National Semiconductor NEL America Inc. Net Shape Technologies Networks International Corp. Nextec Microwave & RF Inc. Noise Com Inc. Northeast Electronics Corp. Northrop Grumman Electronic Systems Northwest EMC Inc. NTK Technical Ceramics Nurad Technologies Octagon Communications Olin Aegis Ophir RF Inc. Optotek Ltd. Orbit/FR Inc. Osprey Metals P/M Industries Pacific Aerospace & Electronics Palomar Technologies Paratek Microwave Inc. Park/Nelco Pascall Electronics Ltd. Passive Microwave Technology PC Dynamics PCB Engineering Peregrine Semiconductor Corp. Philips Semiconductors Piconics Inc. Planar Electronics Technology Planar Filter Company Planar Monolithics Industries Inc. Pletronics Inc. Pole/Zero Corp. Poly Circuits Inc. Polyfet RF Devices Polyflon Polyphaser Corp. Poseidon Scientific Instruments Pty. Precision Photo Fab Inc. Precision Tube Presidio Components Pulsar Microwave Corp. Q Microwave QinetiQ Quasar Microwave Technology Ltd. QUEST Microwave Inc. QuinStar Technology Inc. QWED R & K Company Limited Radio Waves Inc. Raytheon RF Components Reactel Inc. RelComm Technologies Inc. REMEC Inc. Remtec Inc. Renaissance Electronics Corp. Res-Net Microwave Resin Systems RF Depot.com RF Design RFHIC RF Industries RF Micro Devices RF Solutions Richardson Electronics Ltd. RJR Polymers Inc. RLC Electronics Rogers Corp. H. Rollet & Co. Ltd. Roos Instruments Inc. Rosenberger of North America LLC Royce Instruments Inc. Sabritec Sage Laboratories Inc. Salisbury Engineering Inc. San-Tron Inc. SaRonix Sawcom Tech Inc. (STI) Sawtek Inc. Schleifring Und Apparatebau GmbH Schwarzkopf Technologies Corp. Scientific Microwave Corp. SDP Components Inc. Semflex Inc. Semi Dice Inc. Semx Microelectronic Packaging Grp. Sierracom Sigma Systems Corp. Signal Technology Corp. Silicon Wireless Simulation Technology & Applied Res. Sinclair Manufacturing Sirenza Microdevices Smiths Group plc Sonnet Software Inc. Sonoma Scientific Inc. Sophia Wireless Soshin Electronics of America Inc. Southwest Microwave Spectra-Mat Inc. Spectrum Control Inc. Spectrum Elektrotechnik Gmbh Spinner North America Sprague-Goodman Electronics Inc. SRC Cables Inc. SRI Connector Gage Company SSI Cable Corp. SSPA Microwave Corp. State Of The Art Inc. Stetco Inc. STMicroelectronics Storm Products StratEdge Corp. Sumitomo Electric USA Inc. Summitek Instruments Inc. SUSS MicroTec SV Microwave C.W. Swift & Associates Synergy Microwave SyntheSys Research Inc. T-Tech Inc. Tachyonics Corp. Taconic Advanced Dielectric Div. Tecan Components Tecdia Inc. Technical Research & Manufacturing Tecom Industries Inc. Tektronix Telegartner Inc. Telephus Inc. Telwave Inc. Temex Temptronic Corp. Temwell Corp./The TW Tensolite Tensolite Complex Cable Assemblies Tensolite High Performance Cable Tensolite RF/Microwave Cable Assy. Tensolite RF/Microwave Connectors Thales Components Corp. Thermax/CDT Thin Film Concepts Inc. Thunderline-Z Times Microwave Systems TLC Precision Wafer Technology TRAK Communications Inc. TRAK Microwave Trans-Tech Transcom Inc. Trilithic Inc. TriQuint Semiconductor Trompeter Electronics Tronser Inc. Tru-Connector Corp. TTE Inc. A.J. Tuck Company Ube Electronics UltraRF UltraSource Inc. United Monolithic Semiconductors Unity Wireless Universal Microwave Technology Inc. UTE Microwave Inc. Vacuum Engineering & Materials Co. ValPey Fisher Corp. Vari-L Vector Fields Inc. Vectron International Velocium, a TRW company VertiCom Inc. Vishay Intertechnology Inc. Voltronics Corp. VXI Technology Inc. A.T. Wall Company Wavetronix Wenzel Associates Werlatone Inc. Wessex Electronics Ltd. West Bond Inc. John Wiley & Sons Inc. WIN Semiconductors Corp. Wireless Design & Development WJ Communications Xemod XL Microwave Inc. Zeland Software Inc. Zentrix Tech, Circuitry Products Zentrix Tech, Electronic Packaging Zentrix Technologies, Powder Metal Zeta-IDT ZIFOR Enterprise Co. Ltd. HISTORICAL EXHIBIT HISTORICAL INTERACTIVE FORUM The 2002 Microwave Theory and Techniques Society Historical Exhibit will be located in the South lobby entrance to the Exhibition Hall. Symposium attendees are encouraged to visit the Historical Exhibit during regular exhibition hours. In addition to the 50th ANNIVERSARY HISTORICAL EXHIBIT, be sure to attend the HISTORICAL INTERACTIVE FORUM to be held Wednesday afternoon from 3:30 to 5:10 PM. The forum will be held in the lobby near the south entrance to the exhibit hall just adjacent to the HISTORICAL EXHIBIT. This forum will feature papers from the 50th Anniversary Transaction issue written by leading pioneers in our field. This will be your chance to meet some of the people in this industry who have inspired so many of us. The forum will be informal and completely interactive. Some authors will also have historical hardware on hand to view and learn more about. The authors will be on hand to present their papers, answer questions and tell old “war stories” about their experiences in the industry. Don’t miss this opportunity to learn more about how this industry has grown in 50 years. FIFTIETH AND ONE-HUNDREDTH ANNIVERSARIES Not only are we celebrating the 50th anniversary of the formation of the Microwaves Theory and Techniques Society (MTT-S) but an even greater historical event occurred One Hundred years ago. December 11, 1901 was the genesis of a technology that evolved into the ubiquitous (microwave) cell phone of today. Sitting high on Signal Hill in St. Johns, Newfoundland Guglielmo Marconi held a receiver to his ear straining to hear the Morse Code “dit-dit-dit” symbol for the letter “S” just as a commuter today tries to decipher the voice of his wife from the earpiece of the modern cell phone as a roaring train pulls into the station. Somehow both were able to receive their messages. The signal received by Mr. Marconi was sent from a transmitter with a makeshift “Elephant Cage” suite of antenna masts located in Poldhu, Cornwall, England. Just prior to the scheduled transmission the array was blown over and temporary antennas were held aloft with balloons and kites. As every good microwave engineer knows if something fails “improvise!” It was on this day that Marconi proved to the world that radio signals could be transmitted great distances even around the curvature of the earth. Cornwall to St. Johns is over 2100 miles. Over the ensuing years he created many inventions. US patent No. 7777 solved the problem of interference where different transmitters jammed one another. This invention offered a new method of syntonic tuning. It was his inventions and business acumen that made the name Marconi the most famous name in the RF communications. The company that he started in 1897 as General Electric Company plc lives on today as Marconi plc. His legacy and name are still with us. The equipment used in those early transmissions were “Spark Gap” transmitters. To celebrate this 100th anniversary of the first long distant transmission and successful reception of RF/Microwave energy by Guglielmo Marconi, we will be displaying and demonstrating the same type of spark gap equipment used by Marconi. As part of the Historical Exhibit a spark gap transmitter built in 1912 will be shown. Also on display will be an extremely rare 1908 DeForest spherical audion, which was the first commercially available triode. In addition World War I communications gear from private collections will be on display to show the vast progress that has been made in less than 100 years. HISTORICAL ELECTRONICS MUSEUM The Historical Electronics Museum is the permanent home of the MTT-S Historical Collection between Symposia. The Museum holds many microwave related items besides the MTT-S Collection, including parts of the SCR-270 (Pearl Harbor) radar and a complete SCR-584 radar, which was used with the proximity fuse anti aircraft shell in World War II. It also contains an impressive library of over 7000 books and 11,000 journals. The museum is located near the Baltimore-Washington International Airport, and is approximately 20 minutes from the downtown Baltimore. Additional information on the Museum can be found on its web site at http://www.erols.com/radarmus, or call (410) 765-2345. A visit to the museum will be an interesting and educational experience for both young and old. 59 2002 MTT-S AWARDS 2002 MICROWAVE PRIZE The Microwave Prize recognizes, on an annual basis, the most significant contribution by a published paper to the field of interest of the Microwave Theory and Techniques Society. Papers under consideration are those published during the period January 1 to December 31 of the year preceding the Fall Meeting of the Administrative Committee at which the award is considered. This year’s recipients are Emad Gad, Roni Khazaka, Michel Nakhla and Richard Griffith. Citation: 2002 MICROWAVE CAREER AWARD This award recognizes an individual for a career of meritorious achievement and outstanding technical contribution in the field of microwave theory and techniques. This year’s recipient is Ingo Wolff. Citation: “FOR A CAREER OF LEADERSHIP, MERITORIOUS ACHIEVEMENTS, CREATIVITY AND OUTSTANDING CONTRIBUTIONS IN THE FIELD OF MICROWAVE THEORY AND TECHNIQUES.” “FOR A SIGNIFICANT CONTRIBUTION TO THE FIELD OF ENDEAVOR OF THE IEEE MTT SOCIETY IN THE PAPER ENTITLED, “A CIRCUIT REDUCTION TECHNIQUE FOR FINDING THE STEADY STATE SOLUTION OF NONLINEAR CIRCUITS,” IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, MTT-48, PP. 2389–2396 (2000)” 2002 DISTINGUISHED SERVICE AWARD This award is given in recognition of significant contributions and outstanding service to the Microwave Theory and Techniques Society and the microwave profession over a sustained period of time. This year’s recipient is H. John Kuno. Citation: 2002 N. WALTER COX AWARD The N. Walter Cox Award has been established in recognition of the qualities of N. Walter Cox and his service to the MTT Society prior to his untimely death in 1988. It is given to a Society volunteer whose efforts on behalf of MTT-S best exemplify Walter’s spirit and dedication. This year’s recipient is J. Michael Golio. Citation: “FOR HIS OUTSTANDING AND DEDICATED SERVICE TO THE SOCIETY.” 2002 DISTINGUISHED EDUCATOR AWARD This award was inspired by the untimely death of Prof. F.J. Rosenbaum (1937–1992), an outstanding teacher of microwave science and a dedicated Administrative Committee Member and contributor. The award recognizes a distinguished educator in the field of microwave engineering and science who best exemplifies the special human qualities of Fred Rosenbaum who considered teaching a high calling and demonstrated his dedication to the Society through tireless service. This year’s recipient is Linda P.B. Katehi. Citation: “FOR EXEMPLARY SERVICE, GIVEN IN A SPIRIT OF SELFLESS DEDICATION AND COOPERATION.” 2002 OUTSTANDING YOUNG ENGINEER AWARD The IEEE Electromagnetics Award was established in 1996, and is presented to an individual for outstanding contributions to electromagnetics in the areas of theory, application or education. The Award consists of a bronze medal, certificate and a cash prize. This year’s recipient is Ke Wu. Citation: “FOR OUTSTANDING ACHIEVEMENTS AS AN EDUCATOR, MENTOR AND ROLE MODEL OF MICROWAVE ENGINEERS AND ENGINEERING STUDENTS.” “FOR OUTSTANDING CONTRIBUTIONS TO HYBRID INTEGRATION OF PLANAR AND NON-PLANAR MICROWAVE AND MILLIMETER-WAVE CIRCUITS, AND THE THEORY AND PRACTICE OF GUIDED-WAVE STRUCTURES.” 2002 MICROWAVE PIONEER AWARD The Microwave Pioneer Award recognizes an individual or a team not exceeding three persons having made outstanding pioneering technical contributions that advance microwave theory and techniques and described in an archival paper published at least 20 years prior to the year of the award. This year’s recipient is John R. Tucker. Citation: 2002 IEEE USA HARRY DIAMOND MEMORIAL AWARD The Harry Diamond Memorial Award, sponsored by IEEE USA, honors individuals for distinguished technical contributions in the field of electro technology while in US government service. This year’s recipient is Robert J. Trew. Citation: “FOR GENERALIZING MICROWAVE MIXER THEORY TO INCLUDE PHOTON-ASSISTED TUNNELING AND DISCOVERING NEW EFFECTS LEADING TO QUANTUM-NOISE-LIMITED MILLIMETER WAVE RECEIVERS.” “FOR TECHNICAL CONTRIBUTIONS TO THE THEORY AND DESIGN OF MICROWAVE POWER DEVICES USING WIDE BANDGAP SEMICONDUCTORS AND LEADERSHIP IN MANAGING DOD’S BASIC RESEARCH PROGRAMS.” 2002 APPLICATION AWARD The Microwave Application Award recognizes an individual or team for outstanding application of microwave theory and techniques. This year’s recipient is Steven A. Maas. Citation: “FOR PROPOSING, ANALYZING AND DEMONSTRATING THE FET RESISTIVE MIXER.” IEEE FELLOWS: CLASS OF 2002 The Member Grade of Fellow is conferred in recognition of unusual and outstanding professional distinction. It is awarded at the initiative of the IEEE Board of Directors following a rigorous nomination and evaluation process. Individuals receiving this distinction have demonstrated extraordinary contributions to one or more fields of electrical engineering, electronics, computer engineering and related sciences. This Grade is not conferred automatically on nomination; only a fraction of those nominated are elected. Twelve MTT-S Members who were evaluated by our Society were elected to the Grade of Fellow, effective 1 January 2002: Osami Ishida For leadership in research and development of microwave devices for mobile communication Stephen James Nightingale For contributions to planar microwave and millimeter-wave circuits Zoya Popovic For contributions to the development of active antenna arrays and quasi-optical power combining techniques Ulrich Lothar Rohde For contributions to and leadership in the development and industrial implementation of microwave computer-aided design technology NAME CITATION John Tilman Barr, IV For contributions and leadership in RF & microwave component measurements & instrumentation for design and manufacturing David E. Root For contributions to nonlinear modeling of active semiconductor devices For contributions to the modeling of design of waveguide components and planar structures James Carson Stewart For leadership in education and academic research in the field of microwave and millimeter-wave devices and circuits For contributions to the exact synthesis techniques for microwave filters Robert Weigel For contributions to microwave acoustic, radio frequency integrated circuits, and microwave circuits and their applications For leadership in the development and application of MSAG GaAs processes for novel MMIC circuits Dylan Forrest Williams For contributions to advancements in microwave measurement Jens Bornemann Richard John Cameron Edward L. Griffin 60 In addition, the following thirteen MTT-S Members of the Class of 2002 Fellows were evaluated by other Societies: Joachim N. Burghatz For contributions to integrated high-speed and radio-frequency silicon devices and components Neville Clinton Luhmann For advances in millimeter/submillimeter wave plasma diagnostics, intense microwave plasma interactions, and coherent radiation generation Leda M. Lunardi For contributions to the development of high-performance 155 µm monolithically integrated photoreceiver for optical communication Eric Michielssen For contributions to the advancement of computational electromagnetics Edl Schamiloglu For contributions to the generation and propagation of intense pulsed charged particle beams Chi Ho Chan For contributions to computational electromagnetics Christos G. Christodoulou For contributions to the application of neural networks in adaptive antenna arrays Ramesh Garg For contributions to microstrip antenna technology Albin John Gasiewski For contributions to passive microwave sounding within clouds and precipitation, and passive polarimetric microwave imaging Staffan Einar Strom For contributions to null field approach to multiple scattering problems Allen W. Glisson For contributions to the development of numerical solution methods in electromagnetic scattering by complex surfaces Manfred Kaspar Andreas Thumm For contributions to the development and application of gyrotron oscillators, oversized microwave mode converters and transmission line components Hiroyoshi Ikuno For contributions to the development of new numerical methods and asymptotic techniques in computational electromagnetics GENERAL INFORMATION Information Booth: Pamphlets and information on the Seattle area will be available at a booth centrally located in the registration area of the WSCTC. The Hospitality Suite is located in the Sheraton Hotel. IEEE/MTT-S Memberships: An IEEE/MTT-S membership booth will be located in the registration area. (In addition, a membership application is provided on page 6 of this program.) Those who apply for membership on site will be eligible for the discounted member rates on registration fees. IEEE members (or on-site applicants) who register for the full Symposium and have not been MTT-S members in the past year will be offered a free basic MTT-S membership good until the end of the year, which will include admission to the MTT-S members’ breakfasts. Drinks and Refreshments: Free coffee and soft drinks will be available during mid-morning and mid-afternoon breaks in the refreshment areas in the exhibition hall. Smoking: Smoking is not permitted in the WSCTC. Many restaurants in Seattle are completely smoke-free but, generally, if there is a lounge attached, some smoking is permitted. It is best to inquire when making reservations. Recruiting: Businesses do not send their personnel to the IMS to be recruited by other businesses. To ensure that these meetings continue in the future, IEEE policy insists that recruiting does not occur at the Symposium. Recording of Technical Presentations: The recording of technical presentations by video or audio recorders or cameras is not allowed without the permission of the speaker and notification of the session organizer. NOTES 61 2002 IEEE MTT-S TECHNICAL PROGRAM COMMITTEE Mohamed Abouzahra Douglas Adam Mohammed Afsar Fazal Ali Barry Allen Roberto Alm Fritz Arndt Peter Asbeck John S. Atherton Ali Atia Inder Bahl John Bandler Rajeev Bansal Zaher Bardai Scott Barker H. Clark Bell Adalbert Beyer Sarjit Bharj Radek Biernacki Luciano Boglione Jens Bornemann Hermann Boss Ali Boudiaf Tom Brazil Gailon Brehm Klaus Breuer Steve Brozovich Charles Buntschuh Mark Calcatera Edmar Camargo Raymond Camisa Richard Campbell Andreas Cangellaris Kenneth Carr Zol Cendes Kai Chang Yung Kai Chen Debabani Choudhury Terry Cisco Eliot Cohen Charles Cox James Crescenzi Steve Cripps Gilles Dambrine Nirod Das Lionel Davis John Davis Michael DeLisio Edgar Denlinger Norman Dietrich Guglielmo D’Inzeo Paul Draxler Rhonda Drayton Lawrence Dunleavy Michael Dydyk Dan Elad Samir El-Ghazaly Badawy Elsharawy Rudy Emrick Murat Eron Aly Fathy Andrea Ferraro S. Jerry Fiedziuszko Victor Fouad Hanna Carol Gee Bernard Geller Ravindra Goel Jitendra Goel Marc Goldfarb Charles Goldsmith Mike Golio Stephan Goodnick Anand Gopinath Mark Gouker Gianfranco Manes Raafat Mansour Steve March Steve Marsh John Martens Babak Matinpour Mehran Matloubian J.K. McKinney David McQuiddy Mohamed Megahed David Meharry James Mink Koji Mizuno Jozef Modelski Mauro Mongiardo Amir Mortazawi Vijay Nair Krishna Naishadham Michel Nakhla Brad Nelson Clark Ngyuen Edward C. Niehenke Martin Nisenoff Toshio Nishikawa Michal Odyniec Hiroyo Ogawa Arthur A. Oliner Abbas S. Omar John Owens Terry Oxley Dev Palmer John Papapolymerou Don Parker Suman Patel Anthony M. Pavio Jeanne Pavio Jose Carlos Pedro Branimir Pejcinovic Song-Tsuen Peng Barry S. Perlman Anh-Vu Pham John Pierro Aryeh Platzker Roger D. Pollard George Ponchak Jeffrey Pond Zoya Popovic Marian Pospieszalski Reinhold Pregla Sam Pritchett Frederick Raab Lamberto Raffaelli Sanjay Raman Richard Ranson James Rautio Jose Rayas-Sanchez Gabriel Rebeiz Don Reid Leonard D. Reynolds Edward Rezek Alfy Riddle Vittorio Rizzoli Steve Rockwell David Root Luca Roselli Arye Rosen Clemens Ruppel Peter Russer Tom Ruttan Magdalena Salazar-Palma Tapan Sarkar Paul Saunier James Schellenberg Ed Griffin Marco Guglielmi Pierre Guillon K.C. Gupta Madhu S. Gupta Ramesh Gupta Wojciech Gwarek Mike Harris Leonard Hayden John Heaton Patric Heide Wolfgang Heinrich George Heiter Rashaunda Henderson Rudolf E. Henning Peter Herczfeld Wolfgang J.R. Hoefer Jia-Sheng Hong Kazuhiko Honjo Glenn Hopkins Derry Hornbuckle John B. Horton Charles Huang Ho C. Huang H. Alfred Hung James C.M. Hwang Kiki Ikossi Tatsuo Itoh Kenji Itoh Ferdo Ivanek David Jackson Robert W. Jackson Charles Jackson Dieter Jaeger Rolf H. Jansen George Jerinic Reynold Kagiwada Sridhar Kanamaluru Linda Katehi Allen Katz Roger Kaul Steve Kenney Amarpal (Paul) Khanna Marek Kitlinski Reinhard Knerr Reinhard Knöchel Jim Komiak Hiroshi Kondoh Bruce Kopp Kevin Kornegay Youji Kotsuka Chandra Kudsia H. John Kuno Lawrence J. (Larry) Kushner Richard Lai Paolo Lampariello Mike Lancaster Joy Laskar Timothy Lee Chi Lee S.K. Leong Baruch Levush Ralph Levy Guo-Chun Liang Jenshan Lin Alan Lindner Olivier Llopis Johann Luy Gregory Lyons Stephen (Steve) Maas Mohammad Madihian Asher Madjar Raghu Mallavarpu Donald Malocha 62 Manfred (Fred) Schindler Franco Sechi Alwyn Seeds John Sevic Arvind Sharma Tsugumichi Shibata Heroshi Shigesawa Wayne Shiroma Peter Siegel John Sitch Zbynek Skvor Phillip Smith Chris Snowden Richard V. Snyder Elissa Sobolewski Roberto Sorrentino Richard A. Sparks Peter Staecker Joe Staudinger Michael Steer Steven Stitzer Wayne Struble Roger W. Sudbury Frank Sullivan Stephen Sussman-Fort Dan Swanson Bela Szendrenyi Salvador Talisa Wai-Cheung Tang Jesse J Taub Joe Tauritz Douglas Teeter Emmanuil Tentzeris Michael Thorburn Glenn Thoren Michael H. (Mike) Thursby Yevgeniy Tkachenko Tsuneo Tokumitsu Kiyo Tomiyasu Robert J. Trew James Tsui Ching-Kuang Tzuang Yohtaro Umeda Ruediger Vahldieck André Vander Vorst Karl Varian Kikuo Wakino John Walker Chi Wang Key-Chung (K.C.) Wang Denis Webb Robert Weigel Claude M. Weil Sander Weinreb Andreas Weisshaar Charles (Chuck) Weitzel Thomas (Tom) Weller Cheng P. Wen Scott Wetenkamp James Whelehan Dylan Williams James C. Wiltse Ke Wu HungYu (David) Yang Shen Ye Tsukasa Yoneyama Robert York Paul Yu Kawthar A. Zaki Peter Zampardi Jan Zehentner Q.J. Zhang David Zimmermann 2002 IEEE MTT-S IMS STEERING COMMITTEE Donn Harvey, General Chairman [email protected] T 206-528-2002 T 425-837-8801 Marc Sweet, Vice-Chairman [email protected] T 425-562-6028 Tom Raschko, Operations Chairman [email protected] T 425-391-6714 Technical Program Eric Strid, Chair [email protected] T 503-601-1223 Ed Godshalk, Vice-Chair [email protected] T 503-641-3737 x1633 Workshops Tom Ruttan, Workshop Committee Chairman [email protected] T 503-696-2554 Larry Jacobs, Workshops – Sunday [email protected] T 503-646-2410 x20 Rick Campbell, Workshops – Monday [email protected] T 503-615-9378 Walter Wohlmuth, Workshops – Friday [email protected] T 503-615-9236 Nelly Vladimirsky, Workshop Publicity [email protected] T 503-615-9377 Terry Martin, Workshop Publications Editor [email protected] T 503-612-4422 Panel Sessions John Cowles, Sub-Committee Chair [email protected] T 503-690-1333 x7696 Special Sessions Alok Tripathi, Sub-Committee Chair [email protected] Interactive Forum Darren Ferwalt, Chair [email protected] T 503-615-9343 Rick Lutz, Vice-Chair [email protected] T 503-641-3737 x4756 Tim Mintzer, Special Interactive Chair [email protected] T 503-749-3444 Ken Mays [email protected] T 503-615-9341 µAPS Lisa Critchlow, Chair [email protected] T 503-245-2220 Audio/Visual James McSpadden, Sub-Committee Chair [email protected] T 253-657-3424 Scott Raby, Member [email protected] T 425-291-4861 Awards Bill Gjertson, Chairman [email protected] T 425-393-2557 Isaac Bekker [email protected] T 253-657-5923 Catering Gary Liebrecht [email protected] T 253-657-0891 CD-ROM Aurea Taylor, CD-ROM Editor [email protected] T 503-615-9331 Data Base Jock Argust [email protected] T 425-702-5916 Digest Rob Hamilton, Sub-Committee Chair [email protected] T 503-615-9407 Gul Gazipura, Member [email protected] T 408-782-5911 Norman Chiang, Member [email protected] T 408-588-2264 Rob Christ, Member [email protected] T 503-615-9316 Electronic Submissions Rob Shaver [email protected] T 512-933-6212 Joe Decuir, Presentations Coordinator [email protected] T 425-562-6598 Finance Steve Peters [email protected] T 425-844-9307 Mark Virtue [email protected] T 425-468-2335 Scott Huhn [email protected] T 503-624-2139 Eric Downs, Foothills Financial Services [email protected] T 425-557-8418 Historical Exhibit Harry Rutstein, Chair [email protected] T 206-574-0900 Liaisons Russ Hertenberger, University Liaison [email protected] T 425-702-5886 Paul Ferguson, Liaison, RFIC & ARFTG [email protected] T 425-376-2253 Leonard Hayden, Liaison, ARFTG Leonard_Hayden @cascademicrotech.com T 503-601-1580 Ming Chen, International Liaison [email protected] T 253-657-5953 Local Arrangements Jim Freeman, Chair [email protected] T 253-657-4250 Shashi Sanzgiri, Vice-Chair [email protected] T 253-657-5591 Jennifer Turso, Contact [email protected] T 732-981-3428 Photography Ed Adamick [email protected] T 425-562-6112 Protocol Deby Harvey [email protected] T 425-391-3455 Gerald Kaufman [email protected] T 425-889-9133 Ray Butler [email protected] T 425-580-1847 Janet Oneil [email protected] T 425-868-2558 Publicity Jerry Prismantas, Chair [email protected] T 425-354-1320 Henry Oman, Member [email protected] T 206-878-4458 Registration Steve Pennock [email protected] T 209-815-1438 Eric Soshea [email protected] T 425-376-2381 RFIC Sayfe Kiaei, General Chairman [email protected] RFIC Local Arrangements Vikram Jandhyala [email protected] T 206-543-2186 63 Signs Roland Svensson, Sub-Committee Chair [email protected] Special Events Mike Florian, Sub-Committee Chair [email protected] T 253-773-9346 Student Papers Branimir Pejcinovic [email protected] T 503-725-5416 Garth Sundberg [email protected] T 503-641-3737 x1112 Transactions Andreas Weisshaar, Co-Editor [email protected] T 541-737-3153 Wolfgang Hoefer, Co-Editor [email protected] T 250-721-6030 George Heiter, Co-Editor [email protected] T 978-475-7266 Kathee Runo, Transactions Editorial Assistant [email protected] T 480-775-1260 Transportation Julio Navarro, Sub-Committee Chair [email protected] T 253-657-8079 T 425-468-2268 Web Support Jimmy Takeuchi, Sub-Committee Chair [email protected] T 253-657-5955 Ruth MacDonald-Schmidt [email protected] T 425-861-0689 Trisha Sutakawa [email protected] Other Members Larry Whicker, owner of LRW [email protected] T 704-841-1915 Exhibition Harlan Howe, Chair [email protected] T 781-769-9750 F 781-769-5037 Kristen Dednah, Member [email protected] T 781-769-9750 F 781-769-5037 Program Publication Keith Moore [email protected] T 781-769-9750 F 781-769-5037 At-Large Member Howard Ellowitz, Member [email protected] T 781-769-9750 F 781-769-5037 IEEE MTT-S ADMINISTRATIVE COMMITTEE 2002 OFFICERS President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J.T. Barr, IV Vice President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .M.J. Schindler Treasurer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J.S. Kenney Secretary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .D.K. Lovelace ELECTED ADCOM MEMBERS 2002 2003 2004 J.T. Barr, IV S.M. El-Ghazaly J. Hausner M.P. DeLisio H.M. Harris J. Modelski K.C. Gupta K. Honjo V.K. Nair L.B. Katehi J.S. Kenney B.S. Perlman M.J. Schindler J.M. Pond W.A. Shiroma K.R. Varian R. Sorrentino R.J. Trew S.F. Wetenkamp G.R. Thoren IMMEDIATE PAST PRESIDENTS 2001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .C.M. Jackson 2000 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .R.W. Sudbury 1999 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .E.A. Rezek HONORARY LIFE MEMBERS A.C. Beck A.A. Oliner K. Tomiyasu S.B. Cohn T.S. Saad L. Young T. Itoh FUTURE IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIA 2003 — PHILADELPHIA, PA — JUNE 8–13, 2003 General Chairman Richard Snyder Tel (973) 492-1207 [email protected] Finance Sridhar Kanamaluru Tel (609) 734-2016 [email protected] Co-Chairman TPC Chair Kiyo Tomiyasu Tel (610) 531-5740 [email protected] Local Arrangements Peter Herczfeld Tel (215) 895-2256 [email protected] Publicity Ray Benson Tel (609) 259-0400 [email protected] Bill Wilber Tel (732) 462-1880 [email protected] TPC Co-Chairman Arye Rosen Tel (609) 734-2927 [email protected] Web Master Jenshan Lin Tel (908) 582-5182 [email protected] 2004—FORT WORTH, TX 2006—SAN FRANCISCO, CA 2008—ATLANTA, GA June 6–11, 2004 Chairman June 11–16, 2006 Co-Chairmen June 2008 Chairman Karl Varian Raytheon Tel (972) 344-2616 [email protected] Jerry Fiedziuszko Space Systems/LORAL Tel (650) 852-6868 [email protected] John T. Barr, IV Hewlett-Packard Tel (707) 577-2350 [email protected] Joy Laskar Georgia Tech Tel (404) 894-5268 • Fax (404) 894-0222 [email protected] 2005—LONG BEACH, CA 2007—HONOLULU, HI 2009—BOSTON, MA June 12–17, 2005 Chairman June 2007 Chairman June 2009 Chairman Charlie Jackson TRW Tel (310) 812-0283 [email protected] Mike DeLisio University of Hawaii Tel (808) 956-7898 • Fax (808) 956-3427 [email protected] 64 Fred Schindler RF Micro Devices Tel (978) 670-2230 [email protected] SEATTLE INFORMATION WELCOME TO THE EMERALD CITY Within 10 years the market became Seattle’s funky equivalent of a town square. With the Depression and World War II, the decline of First Avenue became apparent. By 1963, planners encouraged the city to tear down the market in favor of a parking facility and high-rise development. Preservationists, politicians, local architects, and voters saved the heart and soul of Seattle. Because of this fight the market has become a part of every Seattleite’s soul. In 1974, a seven-acre Market Historical District was established. Today, about 125 local farmers have permits to sell their produce at day stalls, 200 permanent businesses operate yearround and 200 registered craftspeople and artists sell their wares. The main attraction at the Market are the people. Old sailors reminisce about the Market’s past; the outgoing produce and fish vendors draw the people to their stalls; the street musicians, puppeteers, and mimes turn street corners into stages. Spend an unstructured day meandering the nooks and crannies of the market. Nibble from its astonishing variety of ethnic and regional foods, browse the shops and people watch. If you visit before 9:00am, you can watch the market come alive as the vendors set up in the Main Arcade. The Pike Place Market is one area of Seattle that should not be missed. Steep hills. Lush greenery. Flowers bursting with color. Glimpses of crystal blue water everywhere — Puget Sound, bays, lakes, rivers and canals. All of this combined with snowcapped Mount Rainier to the South, the Cascades to the East and the Olympics to the West, show a visitor why Seattle is known as “The Emerald City.” No, you won’t find Dorothy, the Tinman or Toto here, but you will find friendly people, high standards of service and a youthful creativity. The boundaries of hills and water create vibrant and intriguing neighborhoods creating a “small town” feel. The city is filled with a variety of specialty shops, wonderful restaurants and spectacular sights which fill every one of the five senses. DOWNTOWN SEATTLE Technically, the center of town is at University Street and Fourth Avenue. The lively downtown area consists of department stores, specialty shops, renovated historic theaters, cinemas, espresso stands, restaurants and unexpected experiences. In general, streets run east and west, and avenues run north and south. Yesler Avenue in Pioneer square is the “0” mark for North & South streets. Listed below are some favorite sights and secrets. TILLICUM VILLAGE A unique Northwest experience is available on Tuesday evening, June 4th from 5:30 PM to 10:30 PM. Leave Seattle on a boat cruise to Blake Island while enjoying the view of islands, mountains and the Seattle skyline. Once there, savor a delicious buffet inside the huge cedar longhouse featuring Northwest Coast Indian-style baked salmon. The evening includes a spectacular dance show by the Tillicum Village Dancers, who bring to life the dances and legends of the Northwest Coast. Tickets are limited; transportation is included. PIONEER SQUARE Seattle’s first neighborhood and business district burned to the ground in the summer of 1889. Thirty central city blocks, a total of 64 acres, were leveled before the Great Fire fizzled amid tidelands where the Kingdome stands today. The area was rebuilt immediately on higher ground that created an “Underground Seattle” which can be toured daily. The area has kept the charm of the early 1900s with its brick buildings and walking malls. Today, approximately 88 acres of offices, restaurants, art galleries and specialty stores populate what was the city’s first historic district. Pioneer Square is filled with history, unique shops, antique stores, and some of Seattle’s best nightclubs. TRANSPORTATION Driving Directions from Sea/Tac Airport to Downtown • Start out going South on Parking/Baggage Claim towards Parking Terminal • Follow the road around as it curves to the left and heads back north toward the airport entrance and the freeways • Continue north and take the 518 east exit to the right, toward I5 • Take the I-5 North Exit on left towards Seattle • Contiue on I-5 North • Take the Seneca St. exit #165 on left side An alternative to rental cars is to take the Gray Line Airport Express from the Sea/Tac Airport for $8.50 one way. The shuttle runs every 30 minutes and makes stops at all major hotels. The 25 mile trip to downtown from the airport via taxicab will cost approximately $30.00– $45.00 one way depending on traffic and time of day. WATERFRONT The waterfront drew visitors a century ago as the last stop for gold prospectors in the US before heading to Alaska. The waterfront still excites the senses with the bright lights, colorful banners, clanging bells on the restored street cars, large parks overlooking ships, ferry horns echoing and enticing aromas of salmon, crab, and sourdough bread. The best way to reach this bustling area is via University Street. Walk down University Street West towards the water and cross First Avenue where you will come upon the Harbor Steps. This 16,000 square foot staircase is so grand, that it is a park. The steps have become Seattle’s version of Rome’s Spanish Steps, a place to meet, to pause and reflect and to catch the sun amid eight waterfall fountains. Once you reach the waterfront you will find refurbished old warehouses containing restaurants and shops. The bare wood decks of Piers 62/63 become one of America’s most spectacular concert venues every summer where big name artists perform amid an incredible setting of skyscrapers, boats, sunsets and mountains. The waterfront is where you can hop aboard a boat for a quick Harbor Tour or take a Ferry ride. This area is continually growing and expanding and enhancing the city. SOCIAL EVENTS RFIC Symposium Reception: All RFIC Symposium attendees are invited to attend a reception hosted by the RFIC Steering Committee and several leading RF/Wireless IC vendors on Sunday, June 2 from 7:00 PM to 9:00 PM at the Sheraton Hotel. Admission tickets for attendees and one guest will be included in the registration packets. Microwave Journal/MTT-S Reception: All Microwave Week attendees and exhibitors are invited to attend a reception hosted by Microwave Journal and MTT-S on Monday, June 3 from 6:00 PM to 8:00 PM at the Pacific Science Center, 200 Second Avenue North, Seattle. Transportation will leave the Convention Center starting at 5:45 PM. Industry Hosted Cocktail Reception: Symposium exhibitors will host a cocktail reception on Wednesday, June 5 from 6:00 PM to 7:30 PM at the Sheraton Hotel. Complementary beverage tickets will be included in the registration packages. IEEE MTT-S Awards Banquet: The Annual Awards Banquet will be held on Wednesday, June 5 from 7:30 PM to 10:00 PM at the Sheraton Hotel. This evening will consist of an elegant dinner, awards presentation and entertainment featuring the first “MTTV” production. Student Awards Banquet: Student Paper Awards, MTT Graduate Fellowships and MTT Undergraduate Scholarships will be presented at the Student Awards Banquet on Thursday, June 6 at noon. The banquet is free of charge for all IMS 2002 student paper authors and advisors. PIKE PLACE MARKET The oldest continuously operating farmer’s market in the country has been called the “Marrakesh of the Northwest” by the New York Times. The market began in 1907, when food wholesalers formed a “Produce Row” along Western Avenue. Farmers who didn’t have the time to sell their crops relied on wholesalers to help them. The farmers suspected that the wholesalers were cheating them and gouging the purchasers and the city responded by establishing a true farmer’s market. On the first day, fewer than a dozen wagons showed up but thousands of people came eager to buy. The next week, 70 wagons lined the Pike Place curb and created the need to standardize stall sizes to fit everyone and canopies were built to protect them from the rain. There was a proposal to move the market to the waterfront and create a grandiose complex, but residents voted to keep the market small and personable in Pike Place. Portions of the above information appear courtesy of Carol Riddle, Seattle VIP Services 65 GUEST PROGRAM Saturday, June 1, 2002 Golf Tournament Hours: 3:00 PM Designed by Englishman William Henry Tucker, Sr. and Frank James in 1930, Jackson Park Golf Course is a traditional 18-hole championship course. Named after Andrew Jackson, the former President of the United States, Jackson Park is located north of downtown in the Olympic Hills section of Seattle. ($105) Includes: Transportation, greens fees and golf cart Sunday, June 2 & Friday, June 7, 2002 Pre and Post Tour Options Hours: 7:30 AM–8:00 PM (2 hr service to Victoria) Independent Victoria Day Trip (Unescorted) For those wishing to visit the picturesque town of Victoria, British Columbia on their own, a scenic two or three hour cruise aboard the Victoria Clipper catamaran will bring you to this quaint “Old English” town. Reservations aboard the Victoria Clipper can be made for any day of the week. You are responsible for transportation to and from Pier 69, which is a short cab ride from the downtown Seattle hotels. You must check in at the dock 45 minutes prior to departure to collect your boarding passes. ($115) Tuesday, June 4, 2002 Snoqualmie Falls, Steam Engine Train and Hedges Winery Tour Hours: 9:00 AM–3:00 PM Twenty-five miles east of Seattle, you will find one of Washington’s most popular scenic attractions, Snoqualmie Falls. The Snoqualmie River cascades 270 feet through a spectacular rock gorge into a 65-foot deep pool. On top of the falls sits one of Seattle’s most popular romantic getaways — the Salish Lodge. The exterior of the Salish may look familiar, as it was the lodge used to film the quirky TV hit Twin Peaks. After enjoying the views from the falls, guests will enjoy a gourmet boxed lunch before traveling to Snoqualmie’s Historic Train Depot. After lunch, guests will experience a scenic train excursion aboard antique railroad coaches through the upper Snoqualmie Valley. This round trip excursion will last an hour. Afterwards, guests will board deluxe motorcoaches and head back towards Seattle with a stop in the town of Issaquah, home to a favorite Washington wine, Hedges Cellars. ($63) Includes: Motorcoach Transportation; Seattle VIP Services Guide; Viewing of Snoqualmie Falls; Steam Engine Train Tour; Hedges Wine Tasting; Washington State Sales Tax Wednesday, June 5 and Thursday, June 6, 2002 Boeing’s Everett Plant Tour Hours: 8:30 AM–12:00 PM, Wednesday; 12:30–4:00 PM, Thursday A trip to Boeing’s Everett facility offers an in-depth view of the construction and assembly of jet aircraft. This is a fascinating tour, which gives insight into the many facets of the airplane industry. The 90-minute tour includes a video presentation followed by a visit to the 747 assembly building and a drive to the flight line. There are 21 steep steps, a 1/3 mile walk and an elevator ride to 35 feet above the factory floor. On the way to the plant our informative guide will also give visitors the opportunity to learn about life in the Pacific Northwest and the area’s relationship to Boeing, one of it’s largest employers. ($40) Includes: Motorcoach Transportation; Boeing Plant Tour Admission; Washington State Sales Tax; Seattle VIP Services Tour Guide Wednesday, June 5, 2002 Seattle’s Museum Tour with Lunch in Pike Place Market Seattle Art Museum Hours: 9:00 AM–2:00 PM The pride of the city’s art community, the new Seattle Art Museum is itself a work of art, designed by worldrenowned architect Robert Venturi. A beautifully displayed Northwest Native American collection includes masks, sculptures, textiles, decorative and household objects. Contemporary Pacific Northwest artists are featured as well as world-renowned artists from America, Europe and Asia. Burke Museum See displays of Washington’s only real dinosaur fossils, our world-renowned Northwest Coast Native art and other fabulous treasures from the Burke collections. The Burke Museum has served the people of Washington State as the premier museum of natural history and culture for more than 100 years. Museum of History and Industry The Museum of History and Industry, opened on February 15, 1952, has grown to become the largest private heritage organization in the state of Washington, attracting more than 60,000 visitors annually from the Northwest and beyond. The Museum collects, preserves and presents everything from ship’s wheels to evening gowns, gramophones to baby carriages, time clocks to crosscut saws, which gives visitors glimpses of life in Puget Sound from the 1780s to the present day. Lunch at No Boundaries Café No Boundaries is a quaint little European-style café in the heart of Pike Place Market. They serve fresh soups, salads and sandwiches. Each guest will receive a $10.00 voucher to use at their convenience, while strolling through Pike Place Market for an hour and a half. Includes: Motorcoach Transportation; Museum Tour Package ($58) Thursday, June 6, 2002 Cruise the Locks and Seattle Harbor Tour Hours: 9:30 AM–1:30 PM (Lock tour departs at 10:00 AM) with Lunch at Harborside Restaurant Since 1963, this 2-1/2 hour cruise has been operating on both salt and fresh water via Seattle’s famous Hiram Chittenden Locks. The Hiram Chittenden Locks, built early in the century, were as important for Seattle and Puget Sound as the Panama Canal was for the Western Hemisphere. As you pass through the locks, you will learn how they operate. Cruising in Elliott Bay, you will be fascinated by the maritime activity of chugging tugboats, smoothly gliding sailboats, mighty oceangoing tankers and cargo ships while you watch the architecturally exciting Seattle skyline unfold. For spectacular views, look west to the Islands of Puget Sound and the snowcapped Olympic Mountains. The cruise is narrated so you will understand just what you are seeing. ($85) Note: Proof of US citizenship (such as a passport, photo drivers license or certified copy of birth certificate) is required for all US citizens (including minors) entering Canada. Foreign nationals should check possible visa needs for entry into Canada and re-entry into the U.S. Boat departs Seattle at 8:30 AM and arrives in Victoria at 10:30 AM (Guests MUST check in one hour in advance) • Boat departs Victoria at 6:00 PM and arrives in Seattle at 8:00 PM. Includes: Round trip Victoria Clipper Fare; Seattle VIP Services Victoria Clipper Voucher Monday, June 3–Thursday, June 6, 2002 Morning Activities Hours: 6:30 AM–7:15 AM Morning Run Through Downtown Seattle You have the opportunity of joining one of our fitness experts on either a run or slower paced jog through scenic downtown Seattle. Each guide will be sensitive to the group’s fitness level and desired intensity. The morning run will provide you an opportunity to see different areas of downtown Seattle. Each morning, our running guide will take you on a different run through the city. (Free) Morning Walking Tour of Seattle Guests who prefer a walk in the mornings will enjoy an invigorating walk through downtown Seattle. Our walking guide will narrate the walk, pointing out interesting sights, architecture and public art highlights. Each morning will offer a different tour of the downtown area. (Free) Monday–Wednesday: 8:00 AM–5:00 PM — Thursday: 8:00 AM–12:00 NOON Our knowledgeable hosts, hostesses and tour guides delight in our city and enjoy the opportunity to share Seattle with others. They are involved in the community and are well versed in the Pacific Northwest. Many guides have also traveled extensively and are conversant on a broad range of topics. They will provide you with restaurant suggestions, make reservations, give ideas on where to explore and answer any questions. Monday, June 3, 2002 Mount Rainier Tour Hours: 8:30 AM–6:00 PM For many years Mount Rainier has been the landmark and sacred ground for the Northwest Native American Indians and is now the symbol of natural grandeur for the Northwest. This majestic peak (Elevation: 14,411 feet) was named by Captain Vancouver of the English Navy in 1792 for his friend, Admiral Peter Rainier. You will enjoy a drive through the countryside to Mount Rainier National Park (Elevation: 5,400 feet) with its easy hiking trails that pass waterfalls, massive glaciers and fields of wildflowers. There is an informative Visitor Center with panoramic views and slide and movie presentations on the park and its history. Snack and gift shops can be found at the Visitor Center and the beautiful Paradise Inn. Sturdy walking shoes are advised. Lunch is on your own. We recommend the lovely restaurant at the Paradise Inn. ($87) Includes: Motorcoach Transportation; Mt. Rainier Nat’l Park Admission; Seattle VIP Services Tour Guide Monday, June 3, 2002 Seattle City Highlights Hours: 9:00 AM–2:00 PM with lunch at the Space Needle You will learn why Seattle has been named one of America’s most livable cities! Our friendly and informative guides will give historical background on the area, point out interesting landmarks, as well as give insider tips on special shopping and sightseeing areas. Included in the tour is historic Pioneer Square, the location for Seattle’s top art galleries; the International District, heart of Seattle’s Asian community; and the beautiful Univ. of Washington campus. A stop at the Hiram H. Chittenden Locks will show how the area’s fresh and salt waters meet, and you will enjoy the underwater viewing at the adjoining salmon ladders. Last but not least a short stop at Seattle’s renowned Pike Place Market, an exciting array of color, aroma and sounds! A highlight of the tour is lunch at the Space Needle. The Seattle Center is the park-like setting created for the 1962 World’s Fair, and home to Seattle’s most famous landmark, the Space Needle. ($68) Includes: Motorcoach Transportation; Map of Pike Place Market; Lunch at the Space Needle; Private Room with view; Admission to Observation Deck of Space Needle; All Applicable Gratuities; Washington State Sales Tax; Seattle VIP Services Tour Guide Tuesday, June 4, 2002 Northwest Winery and Brewery Tour Hours: 12:30 PM–4:30 PM Situated on the same latitude as the French wine country, Washington State has a growing wine industry that is winning prestigious awards throughout the world. You will learn about Northwest wines as you visit a popular local winery. Located on 87 acres of arboretum-like grounds, Chateau Ste. Michelle is Washington’s oldest and most famous winery. After a cellar tour and wine tasting, you will enjoy strolling the grounds and visiting the extensive wine and accessory shop. You will also visit Columbia Winery, the pioneer of premium wine production in Washington State, and Red Hook Brewery, one of the finest microbrews that Seattle has to offer! ($33) Includes: Motorcoach Transportation; Columbia and Chateau Ste. Michelle Tour and Tasting; All Applicable Taxes and Gratuities Note: Sweater, jacket and comfortable walking shoes are recommended. Includes: Motorcoach Transportation; Harbor/Locks Cruise; Lunch at Harborside Restaurant; Washington State Sales Tax; Seattle VIP Services Tour Guide Friday, June 7–Saturday, June 8, 2002 Escorted Victoria Trip Hours: 6:30 AM, Friday–10:00 PM, Saturday Pre and Post Overnight Tour Options Enjoy a 2 day/1 night outing to nearby Canada by visiting the “Old English” town of Victoria, British Columbia. The morning begins with a scenic cruise aboard the Victoria Clipper. Once in Victoria, you will be whisked away to your hotel to drop off your belongings. Our knowledgeable guide will be on hand throughout the day to help you make the most of your trip, and there will be ample free time to enjoy shopping and sightseeing in Victoria before the return trip to Seattle. ($285) Note: Proof of US citizenship (such as a passport, photo drivers license or certified copy of birth certificate) is required for all US citizens (including minors) entering Canada. Foreign nationals should check possible visa needs for entry into Canada and re-entry into the US. Friday, June 7: Boat departs Seattle at 8:00 AM and arrives in Victoria at 11:00 AM (Guests MUST check in one hour in advance) • Saturday, June 8: Boat departs Victoria at 7:00 PM and arrives in Seattle at 9:45 PM Includes: Round-trip Motorcoach Transportation to Pier 69; Round trip Victoria Clipper Fare; Seattle VIP Services Victoria Clipper voucher; Transfer between Hotel and Pier in Victoria; (1) Night Accommodation in Victoria (double occupancy); Luggage handling; Continental Breakfast; Seattle VIP Services Staff Note: Guests wishing to have High Tea at the Empress Hotel should be aware that there is a dress code. Shorts, blue jeans, jogging attire and T-shirts are not allowed. 66 Washington State Convention and Trade Center LEVEL 3 MEETING ROOMS LEVEL 2 MEETING ROOMS LEVEL 6 BALLROOMS 67 Westin Seattle Hotel MEZZANINE SAN JUAN LEVEL GRAND BALLROOM 68 Sheraton Seattle Hotel LOADING DOCK C M ON PH O RO ALL DB AN GR PH M A ES OO LLR ON B AST ES B BA A EA E ION AR U E-F A PR M OO LLR BA ST WE T NC B S OM ST RE RO EXIT TO THE CONVENTION CENTER CK HE C AT CO EN ASP ELE AR BU S CE INESS NT ER VAT O R ESCALATORS TO LOBBY PLA PH LAS PO BAN Q OFF UET ICE A 430 428 426 422 424 420 418 R FOURTH FLOOR VAT O ON DR ELE MA 416 BOARDROOM RO ALL 412 NB ITA ME STAIRS TO SECOND FLOOR THIRD FLOOR R R IPE VAT O JUN ELE UG DO SECOND FLOOR R ON ES CED STAIRS TO THIRD FLOOR PH ON ES TR OL OP OM IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM PROGRAM GUIDE Seattle, Washington FIRST CLASS MAIL US POSTAGE PAID Permit No. 490 LIBERTY, MO