interactive

Transcription

interactive

VISHAY INTERTECHNO L O G Y , INC .
INTERACTIVE
data book
infrared data communication
vishay semiconductors
vse-db2802-0610
Notes:
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One of the World’s Largest Manufacturers of
Discrete Semiconductors and Passive Components
V I S H AY I N T E R T E C H N O L O G Y, I N C .
DATA B O O K
Infrared data communication
vishay semiconductors
Tr a n s c e i v e r s
Encoders/Decoders
w w w. v i s h a y. c o m
SEMICONDUCTORS
RECTIFIERS
RF TRANSISTORS
Bipolar Transistors (AF and RF)
Dual Gate MOSFETs
MOSMICs®
Schottky (single, dual)
Standard, Fast, and Ultra-Fast Recovery (single, dual)
Bridge
Superectifier®
Sinterglass Avalanche Diodes
SMALL-SIGNAL DIODES
P rod u ct L istings
Schottky and Switching (single, dual)
Tuner/Capacitance (single, dual)
Bandswitching
PIN
OPTOELECTRONICS
IR Emitters and Detectors,
and IR Receiver Modules
Optocouplers and Solid-State Relays
Optical Sensors
LEDs and 7-Segment Displays
Infrared Data Transceiver Modules
Custom Products
ZENER AND SUPPRESSOR DIODES
ICs
Zener (single, dual)
TVS (TransZorb®, Automotive, ESD, Arrays)
MOSFETs
Power MOSFETs
JFETs
Power ICs
Analog Switches
DC/DC Converters
RF Transceivers
ICs for Optoelectronics
Passive Components
RESISTIVE PRODUCTS
CAPACITORS
Foil Resistors
Film Resistors
Metal Film Resistors
Thin Film Resistors
Thick Film Resistors
Metal Oxide Film Resistors
Carbon Film Resistors
Wirewound Resistors
Power Metal Strip® Resistors
Chip Fuses
Variable Resistors
Cermet Variable Resistors
Wirewound Variable Resistors
Conductive Plastic Variable Resistors
Networks/Arrays
Non-linear Resistors
NTC Thermistors
PTC Thermistors
Varistors
Tantalum Capacitors
Molded Chip Tantalum Capacitors
Coated Chip Tantalum Capacitors
Solid Through-Hole Tantalum Capacitors
Wet Tantalum Capacitors
Ceramic Capacitors
Multilayer Chip Capacitors
Disc Capacitors
Film Capacitors
Power Capacitors
Heavy-Current Capacitors
Aluminum Capacitors
Silicon RF Capacitors
MAGNETICS
Inductors
Transformers
STRAIN GAGE TRANSDUCERS
and stress analysis systems
PhotoStress®
Strain Gages
Load Cells
Force Transducers
Instruments
Weighing Systems
IR Transceivers
Databook
Vishay Semiconductor GmbH
P.O.B. 3535,
D-74025 Heilbronn
Germany
Telephone: + 49 (0)7131 67 2831
Fax number: + 49 (0)7131 67 2423
www.vishay.com
NOTICE
Specifications of the products displayed herein are subject to change without notice. Vishay
Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or
inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or
implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except
as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability
whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products
including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement
of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining
applications. Customers using or selling these products for use in such applications do so at their own
risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.
OZONE DEPLETING SUBSTANCES POLICY STATEMENT
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operating systems with respect to their impact on the health and safety of our employees and the
public, as well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which
are known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of
ODSs and forbid their use within the next ten years. Various national and international initiatives are
pressing for an earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate
the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the
Environmental Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances)
respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone
depleting substances and do not contain such substances.
Table of Contents
Vishay Semiconductors
Alphanumeric Index ..............................................................................................................................................
4
Selection Guide ......................................................................................................................................................
5
General Information
Infrared Data Communication According to IrDA® Standard, Part 1: Physical Layer............................................
Infrared Data Communication According to IrDA® Standard, Part 2: Protocol......................................................
Symbols and Terminology .....................................................................................................................................
Data Sheet Structure .............................................................................................................................................
Taping, Labeling, Storage, Packing and Marking..................................................................................................
Environmental Health and Safety Policy ...............................................................................................................
Surface Mount Assembly Instructions ...................................................................................................................
Window Size in Housings ......................................................................................................................................
Sources for Accessories and Testing ....................................................................................................................
Ambient Light and Electromagnetic Interference ..................................................................................................
Eye Safety of Diode Emitters ................................................................................................................................
Remote Control with IrDA® Transceivers ..............................................................................................................
Interface Circuits ...................................................................................................................................................
Reference Layouts and Circuit Diagrams..............................................................................................................
Quality and Reliability ............................................................................................................................................
8
21
31
41
42
52
53
58
60
66
68
69
80
87
96
SIR
TFBS4650 .............................................................................................................................................................
TFBS4652 .............................................................................................................................................................
TFBS4710 .............................................................................................................................................................
TFBS4711 .............................................................................................................................................................
TFDU4100 .............................................................................................................................................................
TFDU4101 .............................................................................................................................................................
TFDU4202 .............................................................................................................................................................
TFDU4203 .............................................................................................................................................................
TFDU4300 .............................................................................................................................................................
120
131
142
151
160
171
185
194
204
MIR
TFBS5700 .............................................................................................................................................................
TFBS5711 .............................................................................................................................................................
TFDU5307 .............................................................................................................................................................
218
230
242
FIR
TFBS6711 .............................................................................................................................................................
TFBS6712 .............................................................................................................................................................
TFDU6102 .............................................................................................................................................................
TFDU6103 .............................................................................................................................................................
TFDU6300 .............................................................................................................................................................
TFDU6301 .............................................................................................................................................................
TFBS6614 .............................................................................................................................................................
258
270
282
295
308
321
334
FIR with RC Receiver
TFDU7100 .............................................................................................................................................................
346
VFIR
TFDU8108 .............................................................................................................................................................
360
Emitter/Detector Pair
TFDU2201 .............................................................................................................................................................
384
Endec
TOIM4232 .............................................................................................................................................................
392
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3
Alphanumeric Index
TFBS4650..............................................................................................................................................................
120
TFBS4652..............................................................................................................................................................
131
TFBS4710..............................................................................................................................................................
142
TFBS4711..............................................................................................................................................................
151
TFBS5700..............................................................................................................................................................
218
TFBS5711..............................................................................................................................................................
230
TFBS6614..............................................................................................................................................................
334
TFBS6711..............................................................................................................................................................
258
TFBS6712..............................................................................................................................................................
270
TFDU2201 .............................................................................................................................................................
384
TFDU4100 .............................................................................................................................................................
160
TFDU4101 .............................................................................................................................................................
171
TFDU4202 .............................................................................................................................................................
185
TFDU4203 .............................................................................................................................................................
194
TFDU4300 .............................................................................................................................................................
204
TFDU5307 .............................................................................................................................................................
242
TFDU6102 .............................................................................................................................................................
282
TFDU6103 .............................................................................................................................................................
295
TFDU6300 .............................................................................................................................................................
308
TFDU6301 .............................................................................................................................................................
321
TFDU7100 .............................................................................................................................................................
346
TFDU8108..............................................................................................................................................................
360
TOIM4232..............................................................................................................................................................
392
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4
Selection Guide
Type
Size
Operating
Link Distance
(H x L x W)
Voltage VCC
(m)
(mm x mm x mm)
(V)
Idle Supply
Current
(mA)
Shutdown
Current
(μA)
Pins
Pad Pitch
(mm)
I/O Voltage TXD (V)
Echo
Data Rate: SIR 9.6 kbit/s to 115.2 kbit/s
TFBS4650
1.6 x 6.8 x 2.8
0 to t 0.3
2.4 to 3.6
0.08
0.01
7
0.95
VCC
on
TFBS4652
1.6 x 6.8 x 2.8
0 to t 0.3
2.4 to 3.6
0.08
0.01
7
0.95
t 1.5
on
TFBS4710
2.7 x 8.0 x 3.3
0 to t 1.0
2.4 to 5.5
0.07
0.01
6
1.55
VCC
off
TFBS4711
1.9 x 6.0 x 3.1
0 to t 0.5
2.7 to 5.5
0.08
0.01
6
0.95
VCC
off
TFDU4100
4.0 x 9.7 x 4.7
0 to t 1.0
2.7 to 5.5
1
no SD
8
1
VCC
x
TFDU4101
4.0 x 9.7 x 4.7
0 to t 1.0
2.7 to 5.5
1
0.01
8
1
VCC
on
TFDU4202
2.8 x 7.3 x 4.7
0 to t 0.7
2.4 to 5.5
0.06
no SD
8
0.8
VCC
off
TFDU4203
2.8 x 7.3 x 4.7
0 to t 0.7
2.4 to 5.5
0.06
0.02
8
0.8
VCC
off
TFDU4300
2.5 x 8.3 x 3.1
0 to t 0.7
2.4 to 5.5
0.08
0.01
8
0.95
t 1.5
off
Data Rate: SIR 9.6 kbit/s to MIR 1.152 Mbit/s
TFBS5700
1.6 x 6.8 x 2.8
0 to t 0.5
2.7 to 3.6
0.55
0.01
6
0.95
1.8
on
TFBS5711
1.9 x 6.0 x 3.1
0 to t 0.5
2.7 to 5.5
0.55
0.1
6
0.95
VCC
off
TFDU5307
2.5 x 8.3 x 3.1
0 to t 0.7
2.7 to 5.5
0.55
0.01
8
0.95
t 1.5
on
Data Rate: SIR 9.6 kbit/s to FIR 4 Mbit/s
TFBS6614
2.7 x 8.0 x 3.0
0 to t 0.7
2.7 to 5.5
1.6
0.01
8
0.95
t 1.5
on
TFBS6711
1.9 x 6.0 x 3.1
0 to t 0.5
2.4 to 3.6
1.7
0.01
6
0.95
VCC
on
TFBS6712
1.9 x 6.0 x 3.1
0 to t 0.5
2.4 to 3.6
1.7
0.01
6
0.95
1.8
on
TFDU6102
4.0 x 9.7 x 4.7
0 to t 1.0
2.7 to 5.5
1.6
< 1.0
8
1
VCC
on
TFDU6103
4.0 x 9.7 x 4.7
0 to t 1.0
2.7 to 5.5
1.6
< 1.0
8
1
1.8
on
TFDU6300
2.5 x 8.3 x 3.1
0 to t 0.7
2.4 to 3.6
1.7
0.01
8
0.95
VCC
on
TFDU6301
2.5 x 8.3 x 3.1
0 to t 0.7
2.4 to 3.6
1.7
0.01
8
0.95
1.8
on
Data Rate: SIR 9.6 kbit/s to FIR 4 Mbit/s and 36 kHz to 38 kHz Carrier Remote Control Receiver
TFDU7100
4.0 x 9.7 x 4.7
2.7 to 5.5
5
2 mA
(RC active)
8
1
VCC
on
0 to t 0.7
2.7 to 5.5
3
0.01
8
1
t 1.8
on
n.a.
2.4 to 5.5
n.a.
n.a.
8
0.8
n.a.
yes
n.a.
2.7 to 3.6
2
1
16
VCC
n.a.
0 to t 0.5
Data Rate: SIR 9.6 kbit/s to VFIR 16 Mbit/s
TFDU8108
4.0 x 9.7 x 4.7
Emitter/Decoder pair any data rate
TFDU2201
2.8 x 7.3 x 4.7
SIR Encoder/Decoder
TOIM4232
2.7 x 10.3 x 10.4
Document Number 81368
Rev. 1.0, 04-Jul-06
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5
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6
Contents
Infrared Data Communication
According to IrDA® Standard,
Part 1: Physical Layer .............. 8
Infrared Data Communication
According to IrDA® Standard,
Part 2: Protocol ........................21
General
Information
Symbols and Terminology........ 31
Data Sheet Structure ............... 41
Taping, Labeling, Storage,
Packing and Marking ............... 42
Environmental Health and
Safety Information.................... 52
Surface Mount Assembly
Instructions .............................. 53
Window Size in Housings ........ 58
Sources for Accessories and
Testing ..................................... 60
Ambient Light and
Electromagnetic
Interference.............................. 66
Eye Safety of Diode
Emitters.................................... 68
Remote Control with IrDA®
Transceivers ............................ 69
Interface Circuits...................... 80
Reference Layouts and Circuit
Diagrams ................................. 87
Quality and Reliabilty ............... 96
IRDC, Part 1: Physical Layer
Infrared Data Communication According to IrDA® Standard
Part 1: Physical Layer
What is IrDA?
IrDA is the abbreviation for the Infrared Data Association, a non-profit organization for setting standards
in IR serial computer connections. The following is an
original excerpt from the IrDA Web site
(http://www.irda.org).
Executive Summary
IrDA was established in 1993 to set and support hardware and software standards which create infrared
communications links. The Association's charter is to
create an interoperable, low-cost, low-power, halfduplex, serial data interconnection standard that supports a walk-up, point-to-point user model that is
adaptable to a wide range of applications and
devices. IrDA standards support a broad range of
computing, communications, and consumer devices.
International in scope, IrDA is a non-profit corporation
headquartered in Walnut Creek, California, and led by
a Board of Directors which represents voting membership worldwide. As a leading high technology standards association, IrDA is committed to developing
and promoting infrared standards for the hardware,
software, systems, components, peripherals, communications, and consumer markets.
Industry Overview
Infrared (IR) communications is based on technology
which is similar to the remote control devices such as
TV and entertainment remote controls used in most
homes today. IR offers a convenient, inexpensive and
reliable way to connect computer and peripheral
devices without the use of cables. IrDA connectivity is
being incorporated into most notebook PCs to bring
the most cost-effective and easy to use support available for wireless technologies.
There are few US, European or other international
regulatory constraints.
Manufacturers can ship IrDA-enabled products globally without any constraints, and IrDA functional
devices can be used by international travellers wherever they are, and interference problems are minimal.
Standards for IR communications have been developed by IrDA. In September 1993, IrDA determined
the basis for the IrDA SIR Data Link Standards. In
June 1994, IrDA published the IrDA standards which
www.vishay.com
8
includes Serial Infrared (SIR) Link specification, Link
Access Protocol (IrLAP) specification, and Link Management Protocol (IrLMP) specification. IrDA
released extensions to SIR standard including
4 Mbit/s in October 1995. The IrDA Standard Specification has been expanded to include high speed
extensions of 1.152 Mbit/s and 4.0 Mbit/s. This extension will require an add-in card to retrofit existing PCs
with high speed IR, and a synchronous communications controller or equivalent.
In 1995, several market leaders announced or
released products with IR features based on IrDA
standards. These products include components,
adapters, printers, PCs, PDAs, notebook computers,
LAN access, and software applications. In November
1995, the Microsoft Corporation announced it had
added support for IrDA connectivity to the Microsoft
Windows 95 operating system, enabling low-cost
wireless connectivity between Windows 95 based
PCs and peripheral devices.
IrDA's interoperable infrared serial data link features
low power consumption with data speeds up to
4 Mbit/s, allowing a cordless 'walk-up-to' data transfer
in a simple, yet compelling way. Applications are in
both consumer and commercial markets with a universal data connection relevant in the use of docking
and input units, printers, telephones, desktop/ laptop
PCs, network nodes, ATMs, and handheld mobile
peers (PDA meets PDA). Yesterday’s systems with
IR capabilities such as Newton, Omnibook, Wizard
and Zoomer are not easily compatible with each other
or other complementary devices. IrDA is the response
in which many segments of the industry have committed themselves to realizing the opportunity of a general standard providing data links which are noninterfering and interoperable.
The IrDA - Standard
The current IrDA physical layer standard is version
1.4 and includes all changes and add-ons up to VFIR
with 16 Mbit/s. Version 1.4 replaced version 1.3 which
is obsolete as are all former versions from 1.0 to 1.2.
Referring to these versions currently can describe
only historical steps of the IrDA - development.
Document number: 82513
Rev. 1.4, 20-Sep-06
How IrDA Transmission Works
The transmission in an IrDA-compatible mode (sometimes called SIR for serial IR) uses, in the simplest
case, the RS232 port, a built-in standard of all compatible PCs. With a simple interface, shortening the
bit length to a maximum of 3/16 of its original length
for power-saving requirements, an infrared emitting
diode is driven to transmit an optical signal to the
receiver.
This type of transmission covers the data range up to
115.2 kbit/s which is the maximum data rate supported by standard UARTs (see figure 1). The minimum demand for transmission speed for IrDA is only
9600 bit/s. All transmissions must be started at this
frequency to enable compatibility. Higher speeds are
a matter of negotiation of the ports after establishing
the links.
Higher speeds require special interfaces which operate at 1.152 Mbit/s and use a similar pulse-shortening
process as in the RS232-related mode, but with a
pulse reduction to 1/4 of the original pulse length. The
fastest data rate supported by IrDA is 4.0 Mbit/s (often
called FIR), operating with 125-ns pulses in a 4-PPM
(PPM = Pulse-Position Modulation) mode. The typical
interfaces for the various modes are shown in figure
2. In the following chapter "IrDA Standard - Physical
Layer", the definitions of the IrDA standard are given.
Optical output power and receiver sensitivity are set
to a level where a point-and-shoot activity (r15q) is
sufficient for point-to-point communication, but prevents the pollution of the ambient by straying needless power. Transmission over a distance of at least
1 m is ensured. The detector front end receives the
transmitted signal, re-shapes the signal and feeds it
to the port. The system works in a half-duplex mode
that allows only one transmission direction to be
active at any given time.
For frequencies up to 115.2 kbit/s, the minimum output intensity is defined with 40 mW/sr. For higher
speeds, a higher output intensity of 100 W/sr minimum is used. The sensitivity thresholds are
40 mW/m2 and 100 mW/m2 for SIR and FIR respectively.
The wavelength chosen for the standard is between
850 nm and 900 nm.
An additional IrDA standard was generated in 1997
(voted Feb. 1998) for Control applications, the socalled IrControl standard.
This standard is using the IEC1603-1 sub carrier frequency allocation with a carrier at 1500 kHz. The
transmission capacity is 72 kbit/s. This system has
still some compatibility problems with the SIR/FIR
Rev. 1.4, 20-Sep-06
IrDA Standard. One of the disadvantages is that the
detector circuitry is different from the other, baseband system. Therefore, integrating both into one
application is expensive. Using IrControl and SIR/FIR
in one application would imply that two IR hardware
channels must be built-in. The Very Fast IR (VFIR,
min. 16 Mbit/s transfer rate over more than 1 m)
established in 1999.
What do I need to enable
IrDA Transmission?
The simplest way of optical interfacing in the SIR
mode is shown in figure 1. For pulse shaping and
recovery, the Vishay Semiconductors device
TOIM4232 is recommended. The front end including
transmitter and receiver should be realized for example by the integrated transceiver module TFDU4100
or other devices of the 4000 series. The TFDU4100
can also be directly connected to Super I/Os.
A transimpedance amplifier is used in the receiver for
input amplification. Its output signal is fed to the comparator input, whose reference level is adjusted to
efficiently suppress noise and interferences from the
ambient.
Additionally, the digital pulse-shaping circuit must be
inserted for shortening the pulse to be emitted to
1.6 Ps (i.e., 3/16 of the bit length at 115 kbit/s) and
pulse recovery of the detected signal to comply with
the IrDA standard. Only the active low bits (0) are
transmitted.
For the high-speed mode, the TFDU6102 or other
devices from the 6000 series are recommended to be
operated with e.g NSC’s or SMC’s IrDA-compatible
Super I/O circuits. Circuit proposals for the various
modes can be found in our application section. A
block diagram is shown in Figure 2.
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9
IR output
Pulse shaping
UART16550/ RS232
TOIM4232
Pulse recovery
Transmitter
4000 series
transceiver
Receiver
IR input
17255
Figure 1. Block diagram of one end of the overall SIR link
Up to 115.2 kbit/s
I/O
Output driver
and IRED
1.152 Mbit/s
0.576 Mbit/s
IR transceiver
module
4.0 Mbit/s
Detector
and receiver
IR output
Active output
interface
Active input
interface
IR output
17256
Figure 2. Block diagram of one end of the link for signaling rates up to 4.0 Mbit/s
The IrDA standard documentation can be found on
the IrDA web site http://www.irda.org. The documents
which are public and can be downloaded are shown
on the next page.
The physical layer is responsible for the definition of
hardware transceivers for the data transmission. The
physical layer is therefore discussed in the following
chapters which define the properties of the front end
devices manufactured by Vishay Semiconductors.
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10
Rev. 1.4, 20-Sep-06
Standards available for public access
and download on www.irda.org
Standards, specifications and guidelines are available under the addresses
http://www.irda.org/standards/standards.asp
http://www.irda.org/standards/guidelines.asp
http://www.irda.org/standards/specifications.asp
The following documents describe the IrDA
Standards:
IrDA SIR Data Specification
(http://www.irda.org/standards/pubs/IrData.zip)
containing
IrDA Serial Infrared Physical Layer Link Specification IrPHY 1.4
(http://www.irda.org/standards/pubs/IrPHY_1p4.pdf)
IrDA Serial Infrared Link Access Protocol (IrLAP)
IrDA Serial Infrared Link Management Protocol
(IrLMP)
IrDA Tiny TP
IrDA Point and Shoot Profile
Test Specification
Rev. 1.4, 20-Sep-06
Other available documents
IrDA Financial Messaging (IrFMTM) Point and Pay
Specification
IrDA Financial Messaging (IrFMTM)Test Specification
IrDA IrLAPFast Connect Application Note
IrDA Adapter Application Profile and Test
Specification
IrDA Control Specification
IrDA Infrared Communications Protocol
(IrCOMM 1.0)
IrDA Infrared Tiny Transport Protocol (IrTinyTP 1.1)
IrDA Infrared LAN Access Extensions for Link
Management Protocol (IrLAN 1.0)
IrDA Object Exchange Protocol (OBEXTM) Ver.1.3
IrDA Object Exchange Protocol (OBEXTM) Test
Specification Ver.1.0.1
IrDA Minimal IrDA Protocol Implementation (IrLite)
IrDA Plug & Play Extensions to IrLMP 1.0
IrDA Infrared Mobile Communications (IrMC)
IrDA Infrared Transfer Picture Specifications
(IrTranP)
IrDA Dongle Interface specifications
IrDA Infared for Wrist Watches specification (IrWW)
Serial Port Profile, IrModem Profile and Test Specs
Serial Interface for Transceivers
IrDA Point and Shoot
IrDA Point and Shoot Application Profile
IrDA Point and Shoot Test Specification
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11
IrDA-Standard - Physical Layer
Specification
In SIR mode, the data is represented by optical pulses
between 1.6 μs and 3/16 of the bit length of the
RS232 data pulse in SIR mode. Pulse-length reduction is also applied in the higher frequency modes.
The limits of the standards are shown in tables 1 and
3. The optical radiant intensity and detector sensitivity
are adjusted to guarantee a point-to-point transmission in a cone of r15qover a distance of at least 1 m.
The radiant intensity and the sensitivity of the front
end can be increased to ensure a transmission over
3 m (see figure 3). Data from the optical interface
standard are documented in tables 2 to 4.
Media Interface Specification
Overall Links
There are two different sets of transmitter/ receiver
specifications. The first, referred to as Standard, is for
a link which operates from 0 to at least 1 meter. The
second, referred to as the Low Power Option, has a
shorter operating range, and is only defined up to
115.2 kbit/s. There are three possible links (see Table
1 below): Low Power Option to Low Power Option,
Standard to Low Power Option; Standard to Standard. The distance is measured between the optical
reference surfaces.The Bit Error Ratio (BER) shall
be no greater than 10-8. The link shall operate and
meet the BER specification over its range.
Signaling Rate and Pulse Duration: An IrDA serial
infrared interface must operate at 9.6 kbit/s. Additional allowable rates listed below are optional. Signaling rate and pulse duration specifications are
shown in table 2.
For all signaling rates up to and including 115.2 kbit/s
the minimum pulse duration is the same (the specification allows both a 3/16 of bit duration pulse and a
minimum pulse duration for the 115.2 kbit/s signal
(1.63 μs minus the 0.22 μs tolerance). The maximum
pulse duration is 3/16 of the bit duration, plus the
greater of the tolerance of 2.5 % of the bit duration, or
0.60 μs.
For 0.576 Mbit/s and 1.152 Mbit/s, the maximum and
minimum pulse durations are the nominal 25 % of the
bit duration plus 5 % (tolerance) and minus 8 % (tolerance) of the bit duration.
For 4.0 Mbit/s, the maximum and minimum single
pulse durations are the nominal 25 % of the symbol
duration plus and minus a tolerance of 2 % of the
symbol duration. For 4.0 Mbit/s, the maximum and
minimum double pulse durations are 50 % of the symbol plus and minus a tolerance of 2 % of the symbol
duration. Double pulses may occur whenever two
adjacent chips require a pulse.
The link must meet the BER specification over the link
length range and meet the optical pulse constraints.
Low Power Low Power
Link Distance Lower Limit, meters
Minimum Link Distance Upper Limit, meters
Standard Low Power
Standard Standard
0
0
0
0.2
0.3
1.0
Table 1: Link Distance Specifications
www.vishay.com
12
Rev. 1.4, 20-Sep-06
UART
Start
Frame
Data Bits
Stop
Bit
0
Bit
0
1
1
0
1
0
UART
0
1
1
Frame
IR Frame
Start
Data Bit
s
Stop
Bit
0
Bit
1
1
0
0
0
1
1
0
1
IR Frame
Bit T ime
Pulse Width = 3/16 Bit Time
17257
Signaling Rate
Modulation
Rate Tolerance
% of Rate
Pulse Duration
Minimum
Pulse Duration
Nominal
Pulse Duration
Maximal
2.4 kbit/s
RZI*)
r 0.87
1.41 μs
78.13 μs
88.55 μs
9.6 kbit/s
RZI*)
r 0.87
1.41 μs
19.53 μs
22.13 μs
19.2 kbit/s
RZI*)
r0.87
1.41 μs
9.77 μs
11.07 μs
38.4 kbit/s
RZI*)
r0.87
1.41 μs
4.88 μs
5.96 μs
57.6 kbit/s
RZI*)
r0.87
1.41 Ps
3.26 μs
4.34 μs
115.2 kbit/s
RZI*)
r0.87
1.41 μs
1.63 μs
2.23 μs
0.576 Mbit/s
RZI
*)
r0.1
295.2 ns
434.0 ns
520.8 ns
1.152 Mbit/s
RZI*)
r0.1
147.6 ns
217.0 ns
260.4 ns
4.0 Mbit/s
Single pulse
Double pulse
4 PPM
4 PPM
r0.01
r0.01
115.0 ns
240.0 ns
125.0 ns
250.0 ns
135.0 ns
260.0 ns
HHH (1.13)
r0.01
38.3 ns
41.7 ns
45.0 ns
16 Mbit/s
Table 2: Signaling rate and pulse-duration specification
*) RZI = Return to Zero Inverted
Rev. 1.4, 20-Sep-06
www.vishay.com
13
1.6 μ s or 3 /16
NRZ
≤ 115.2 kbit/s
RZ I - IR
0.576 Mbit/s
1.15 2 Mbit/s
17258
1/ 4 Bit cell
4.0 Mbit/s
One complete
Symbol
chip 1
chip 2
chip 3
chip 4
Ct = 125 ns
Dt = 500 ns
17259
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14
Data Bit Pair
(DBD)
4PPM Data Symbol
(DD)
00
01
10
11
1000
0100
0010
0001
Rev. 1.4, 20-Sep-06
HHH (1,13) Modulation Code for the 16-Mbit/s VFIR Standard
The HHH (1, 13) modulation code has the following
salient features:
• Code Rate:
2/3 ,
• Maximal Duty Cycle:
1/3 (~ 33 %) ,
• Average Duty Cycle:
~ 26 % ,
• Minimal Duty Cycle:
1/12 (~ 8.3 %) ,
• Run-Length Constraints:
(d, k) = (1, 13) ,
• Longest Run of '10' s:
yyy'000'101'010'101'000'yyy ,
• Chip Rate at Data Rate 16 Mbit/s:
24 Mchips/s ,
• System Clock at Data Rate 16 Mbit/s:
N × 12 MHz (where N t 4).
Rev. 1.4, 20-Sep-06
The HHH(1,13) code is a Run Length Limited (RLL)
code that provides both power efficiency and bandwidth efficiency at the high data rate. The signaling
rate of the code is 24 Mchips/s allowing a rise and fall
time of 19 ns. LED on time is further improved by having a 26 % average duty cycle for random data. The
lower duty cycle is achieved by scrambling the incoming data stream. The run length constraints
(d, k) = (1, 13) ensure an inactive chip after each
active chip, i.e. only single-chip-width pulses occur.
This feature allows a source or a receiver to exhibit a
long tail property. To take full advantage of the d = 1
feature of HHH(1, 13) in strong signal conditions,
clock and data recovery circuitry should be designed
to ignore the level of the chip following an active chip
and assume these chips are inactive. The 13 in
HHH(1, 13) denominates that the maximum number
of chips without a signal is 13. That limits the lower
cutoff frequency of the system and optimizes threshold trigger stability in receiver designs. The modulation code is enhanced with simple framesynchronized scrambler/descrambler mechanisms as
defined and described in the IrDA IrPhy 1.4 standard.
While such a scheme does not eliminate worst-case
duty cycle signal patterns in all specific cases, the
probabilities of their occurrence are reduced significantly on average. This leads to a better "eye" opening and reduced jitter in the recovered signal stream
for typical payload data.
www.vishay.com
15
Active Output Interface
The active output interface (IRLED) emits an infrared
signal. Key parameters for this interface, defined by
IrDA physical layer specification are shown in table 3.
A complete specification is available from IrDA.
Data Rates
Type
Minimum
Peak wavelength, Op, Pm
Specification
All
Both
0.85
0.90
Maximum intensity in angular range, mW/sr
All
Std
-
500*)
Low Power
-
500*)
Std
40
-
Low Power
3.6
-
Std
100
-
Low Power
9
-
All
Both
r 15
r 30
All
Both
See table 2
See table 2
-
600
-
40
115.2 kbit/s and below
Minimum intensity in angular range, mW/sr
Above 115.2 kbit/s
Half angle, degrees
Signaling rate (also called clock accuracy)
Rise time tr ,10 % to 90 %,
fall time tf , 90 % to 10 %, ns
Both
115.2 kbit/s to 4.0 Mbit/s
16 Mbit/s
Pulse duration
Optical overshoot, %
Maximum
-
19
See table 2
All
Both
See table 2
All
Both
-
25
Both
-
r 6.5
Edge Jitter, relative to reference clock, % of nominal duration 0.576 and 1.152 Mbit/s
Both
-
r 2.9
Edge Jitter % of nominal chip duration
4.0 Mbit/s
Both
-
r 4.0
16.0 Mbit/s
Std
-
r 4.0
Edge Jitter, % of nominal pulse duration
Table 3: Active output specification
*)For a given transmitter implementation, the IEC 60825-1 AEL Class 1 limit may be less than this.
See section 2.4 above and Appendix A.
Tolerance Field of Angular Emission
The optical radiant intensity is limited to a maximum
of 500 mW/sr and an angle of r 30q to enable the
independent operation of more than one system in a
room. In figure 3, the tolerance field of an infrared
transmitter's emission is shown. A typical far field
characteristic of a transmitter is also shown in this
figure.
Radiant intensity (mW/sr)
550
500
450
400
350
IrDA tolerance field
300
250
200
Typical characteristic
150
100
(V)FIR
50
0
- 90
17260
SIR
- 75
- 60
- 45
- 30
- 15
0
15
30
45
60
75
90
Angle of emission (°)
Figure 3. Tolerance field of angular emission
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16
Rev. 1.4, 20-Sep-06
Active Input Interface
When a infrared optical signal impinges on the active
input interface (PIN photodiode), the signal is
detected, conditioned by the receiver circuitry, and
transmitted to the IR receive decoder.
Specification
Data Rates
Type
Minimum
Maximum
All
Both
-
500
Low Power
9.0
-
Std
4.0
-
Low Power
22.5
-
Std
10.0
-
All
Both
15
-
Std
-
10
Low Power
-
0.5
Both
-
0.10
Maximum irradiance in angular range, mW/m2
Minimum irradiance in angular range, mW/m2
Above 115.2 kbit/s
Half angle, degrees
Receiver latency allowance, ms
16.0 Mbit/s
Table 4: Active input specification
Active Input Specification
The following five specifications form a set which can
be measured concurrently:
Maximum irradiance in angular range, mW/m2
Minimum irradiance in angular range, mW/m2
Half-angle, degrees
Bit Error Ratio, (BER)
Receiver Latency Allowance, ms
These measurements require an optical power
source and means to measure angles and BERs.
Since the optical power source must provide the
specified characteristics of the Active Output, calibration and control of this source can use the same
equipment as that required to measure the intensity
and timing characteristics. BER measurements
require some method to determine errors in the
received and decoded signal. The latency test
requires exercise of the node's transmitter to condition the receiver.
Definitions of the reference point etc., are the same as
for the Active Output Interface optical power measurements except that the test head is now an optical
power source with the in-band characteristics (peak
wavelength, rise and fall times, pulse duration, signaling rate and jitter) of the Active Output Interface. The
optical power source must also be able to provide the
maximum power levels listed in the Active Output
Specifications. It is expected that the minimum levels
can be attained by appropriately spacing the optical
source from the reference point.
Rev. 1.4, 20-Sep-06
Figure 4 illustrates the region over which the Optical
High State is defined. The receiver is operated
throughout this region and BER measurements are
made to verify the maximum and minimum requirements. The ambient conditions of A.1 (page 20) apply
during BER tests; BER measurements can be done
with worst case signal patterns. Unless otherwise
known, the test signal pattern should include maximum length sequences of "1"s (no light) to test noise
and ambient, and maximum length sequences of "0"s
(light) to test for latency and other overload conditions.
Latency is tested at the Minimum Irradiance in angular Range conditions. The receiver is conditioned by
the exercise of its associated transmitter. For rates up
to and including 1.152 Mbit/s, the conditioning signal
should include maximum length sequences of "0"s
(light) permitted for this equipment. For 4.0 Mbit/s
4 PPM operation, various data strings should be
used; the latency may be pattern dependent. The
receiver is operated with the minimum irradiance levels and BER measurements are made after the specified latency period for this equipment to verify
irradiance, half angle, BER and latency requirements.
The minimum allowable intensity value is indicated by
"minimum" in figure 5, since the actual specified value
is dependent upon the data rate, SIR or FIR.
www.vishay.com
17
Low Power Standard and Full Range Operation
The message that a Low Power device must be a
special design is often propagated, but is incorrect.
Full standard devices can be operated easily with
reduced IRED drive current to fulfill the low power
specification. However, devices specially designed
for Low Power applications with low profile package
are not able to cover the full standard because of limited efficiency and little drive current capability.
Irradiance (or Incidence) (W/m 2 )
(Vertical axis is not drawn to scale)
5 kW/m 2
Undefined Region
Optical
Undefined Region
High
State
minimum
- 30
17261
- 15
0
15
30
Angle (Degrees)
Figure 4. Optical High State Acceptable Range
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18
Rev. 1.4, 20-Sep-06
Transmission Distance
From figure 5, the transmission distance as a function
of the sensitivity (necessary irradiance on the detector) can be read. For example: Sensitivity given as a
minimum irradiance on the detector of 40 mW/m2,
combined with an intensity of 40 mW/sr, results in a
transmission distance of 1 m. A combination of a
detector with a minimum irradiance of 10 mW/m2 and
an emitter with 250 mW/sr can transmit over almost
five meters. Vishay Semiconductor transceivers work
well with standard remote control receivers and can
therefore be operated as remote control transmitters.
The physical layer properties of the devices are
defined under ambient conditions listed in an appendix which has been reprinted in the following chapters.
107
Ie = 500 mW/sr
Ie = 240 mW/sr
106
Ie = 100 mW/sr
Ie = 40 mW/sr
105
Irradiance (mW/m 2)
IrDA FIR Standard specified sensitivity
IrDA SIR Standard specified sensitivity
104
Remote Control, guaranteed sensitivity
Remote Control, typical sensitivity
103
102
101
100
10-1
10-2
0.01
0.1
1
Distance (m)
10
100
17262
Figure 5. IrDA and Remote Control maximum transmission distance. For Remote Control
receivers operating with IrDA transmitters a sensitivity of 0.7 mW/m2 can be assumed.
Rev. 1.4, 20-Sep-06
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19
Appendix A. Test Methods
Note - A.1 is Normative unless otherwise noted. The
rest of Appendix A and all of Appendix B are Informative, not Normative {i.e. it does not contain requirements, but is for information only}. Examples of
measurement test circuits and calibration are provided in IrDA Serial Infrared Physical Layer Measurement Guidelines.
A.1. Background Light and Electromagnetic Field
There are four ambient interference conditions in
which the receiver is to operate correctly. The conditions are to be applied separately:
• Electromagnetic field: 3 V/m maximum (Refer to
IEC 61000-4-3. test level 2 for details) (For
devices that intend to connect with or operate in
the vicinity of a mobile phone or pager, a field of
30 V/m with frequency ranges from 800 MHz to
690 MHz and 1.4 GHz to 2.0 GHz including 80 %
amplitude modulation with a 1 kHz sine wave is
recommended. Refer to IEC 61000-4-3 test level 4
for details. The 30 V/m condition is a recommendation; 3 V/m is the normative condition.)
• Sunlight: 10 kilolux maximum at the optical port
This is simulated with an IR source having a peak
wavelength within the range 850 nm to 900 nm
and a spectral width less than 50 nm biased to provide 490 μW/cm2 (with no modulation) at the optical port. The light source faces the optical port.
This simulates sunlight within the IrDA spectral
range. The effect of longer wavelength radiation is
covered by the incandescent condition.
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20
• Incandescent Lighting: 1000 lux maximum. This
is produced with general service, tungsten filament, gas-filled, inside-frosted lamps in the
60 Watt to 150 Watt range to generate 1000 lux
over the horizontal surface on which the equipment under test rests. The light sources are above
the test area. The source is expected to have a filament temperature in the 2700 to 3050 degrees
Kelvin range and a spectral peak in the 850 nm to
1050 nm range.
• Fluorescent Lighting: 1000 lux maximum This is
simulated with an IR source having a peak wavelength within the range 850 nm to 900 nm and a
spectral width of less than 50 nm biased and modulated to provide an optical square wave signal
(0 μW/cm2 minimum and 0.3 μW/cm2 peak amplitude with 10 % to 90 % rise and fall times less than
or equal to 100 ns) over the horizontal surface on
which the equipment under test rests. The light
sources are above the test area. The frequency of
the optical signal is swept over the frequency
range from 20 kHz to 200 kHz. Due to the variety
of fluorescent lamps and the range of IR emissions, this condition is not expected to cover all circumstances. It will provide a common basis for
IrDA operation.
Rev. 1.4, 20-Sep-06
IRDC, Part 2: Protocol
Infrared Data Communication According the IrDA® Standard
Part 2: Protocol
IrDA Protocol Stack
The IrDA protocol stack provides hardware and software architecture guidelines for designing an IrDA
compliant system. Figure 1 shows the different layers
in the stack. As a minimum, compliance to IrPHYS,
IrLAP, and IrLMP is required. Optional sections of the
protocol include the Higher Speed Extensions
(1.15 and 4 Mbit/s), IrCOMM, TinyTP & PnP.
17265
Figure 1. IrDA Protocol Stack
IrDA Link Access Protocol (IrLAP)
IrLAP, is derived from an existing asynchronous data
communications standard (an adaptation of HDLC). It
provides guidelines for link access in which the software searches for other machines to connect to (sniffing), recognizes other machines (discovery), resolves
addressing conflicts, initiates connection and information exchange, and manages disconnection. During
data transfer, IrLAP is responsible for providing reliable error detection, retransmission, and flow control.
While the discovery and address conflict resolution
procedures are somewhat unique to IrLAP, the link
initialization/ shutdown, connection startup, disconnection and information transfer procedures all
resemble similar operations in HDLC protocols and
are adapted to the IrDA serial infrared environment.
A link operates essentially as follows:
A device (primary) will want to connect to another
device (either by automatic detection via the discovery and sniffing capability of IrLAP, or via direct user
request). A data link involves at least one primary
Document Number: 82504
Rev.1.4, 20-Sep-06
(commanding) station and one or more secondary
(responding) stations, whose roles IrLAP has the
responsibility of managing. The primary station has
responsibility for the data link. All transmissions over
a data link go to or from the primary station and can
be point-to-point or point-to-multi-point. There is
always one and only one primary station while all
other stations must be secondary stations.
After obeying the media access rules the primary will
send connection request information at 9600 bit/s to
the other device, this data will include information
such as its address and its other capabilities such as
data rate, etc. The responding device will assume the
secondary role and, after obeying the media access
rules, return information that contains its address and
capabilities. The primary and secondary will then
change the data rate and other link parameters to the
common set defined by the capabilities described in
the information transfer. The primary will then send
data to the secondary confirming the link data rate
and capabilities. The two devices are now connected
and the data is transferred between primary and secondary under the complete control of the primary.
Rules are defined which ensure that the secondary
and primary are both able to efficiently transfer data.
Any station that is capable can contend to play the primary station role. The role of primary is determined
dynamically when the link connection is established
and continues until the connection is closed (the
exception is that there is a method provided for a primary and secondary on a point to point link to
exchange roles without closing the connection).
Sniff- Open
Address
Discovery
Address Conflict
Resolution
Connect
Information
Transfer
Disconnect
Reset
17266
Figure 2. IrLAP Operation Procedures
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21
IrDA Infrared Link Management Protocol
(IrLMP)
Once a connection is established, IrLMP manages
the available functions and applications between the
communicating devices. IrLMP determines the capabilities of the connected devices (discovery) and manages negotiation of link parameters and correct data
transfer (link control). The link management framework also provides a means for a device to establish
coexisting access to an IR connection between multiple devices (multiplexing).
Discovery occurs when two devices first encounter
each other. Each service and each protocol on a
device will have registered with the link management.
The information registered includes both standard
and protocol specific information. An application can
query the capabilities of devices within range.
Once an application on one device has determined
which service or protocol it wishes to use, it requests
the link control to use the protocol. The link management framework allows multiplexing of application or
transport protocols on the same link connection at the
same time.
Multifunctional devices may have requirements for
the IR link to support concurrent activities. While the
IrDA Link Access Protocol, IrLAP, provides a single
connection between a given pair of IrDA compliant
devices, it provides no means for multiple application
components to share coexisting access to that connection.
A useful feature set of capabilities would have the
mobile user wishing his handheld/PDA or note-book
computer to synchronize systems, check/send/
receive electronic mail, reconcile scheduling &
address book (PIM) data, and also initiate deferred
printing when it makes contact with the owner's desktop personal computer (PC) and network gateway.
Each activity may be controlled by distinct application
components within each device (mobile unit and PC)
and each component has a separate requirement to
locate its peer component and establish the relevant
connection.
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22
IrDA Link Management Protocol, IrLMP, is a mandatory component of IrDA compliant devices and
addresses both the previous needs mentioned.
• Connection multiplexing services provided by
IrLMP Multiplexer (LM-MUX).
• Location of peer application components supported by IrLMP Information Access Service(LMIAS)
IrLMP Multiplexer (LM-MUX) provides multiplexed
channels on top of an IrLAP connection. Each of
these so called Link Service Access Point or LSAPconnections (distinguished from IrLAP connections)
carries a logical separated information stream. The
multiplexer operates in two modes. In multiplexed
mode, the multiplexer will accept data from any of its
clients (transport entities or directly bound applications). In exclusive mode a single LSAP-connection
claims access to the IR medium.
IrLMP Information Access Service (LM-IAS) is a
direct client of LM-MUX and operates in a sclient
servers manner. Application components that wish to
make themselves accessible to peer components in
other devices "describe" themselves by creating an
object whose attributes carry the essential parameters required to establish a connection between the
two peers. An application component seeking a peer
application component inspects the objects within the
remote LM-IAS information base. Assuming a suitable object exists, the connection parameters and the
mechanism are retrieved, which is accessible at the
top of the LM-IAS.
MUX is used to enumerate the devices available. The
resulting list of devices may be sorted/prioritized on
the basis of the information hints supplied in discovery responses.
IrDA Physical Layer (IrPHY)
The Physical Layer provides guidelines for the physical connection of equipment using IR and defines the
specifications which infrared transceivers must be
able to meet. The specifications of the Physical Layer
were already described in a previous chapter.
Rev.1.4, 20-Sep-06
IrDA Flow Control Mechanism (Tiny TP)
Whilst IrLAP provides a flow-control mechanism
between peer IrLAP entities, the introduction of multiplexed channels above IrLAP by IrLMP LM-MUX
introduces a problem. Reliance on IrLAP to provide
flow-control for a multiplexed channel can result in
dead-locks if the consumption of data from one multiplexed channel is dependent on data flowing in an
adjacent multiplexed channel. Conversely, if inbound
data on a multiplexed channel cannot be consumed
and the underlying IrLAP connection cannot be flow
controlled off due to the possibility of deadlock,
inbound data (freshly arrived or buffered) must be discarded in the event of buffer exhaustion. Sadly this
reduces the reliable delivery service provided by
IrLAP to a best effort delivery service provided by
IrLMP LM-MUX (when multiple multiplexed channels
are in operation).There are at least two possible solutions for restoring a reliable delivery service above
IrLMP LM-MUX.
• Provide a per application stream flow-control
mechanism above LM-MUX between peer application entities. This ensures that there is always
sufficient buffer space available to accommodate
in-bound application data.
• Provide a per application stream retransmission
mechanism above LM-MUX that recovers from the
loss of data that arises if inbound buffering
become exhausted.
The Tiny TP protocol provides:
• Independently flow controlled transport connections
• Segmentation and re-assembly
IrDA Serial & Parallel Port Emulation
(IrCOMM)
IrCOMM defines the emulation of Serial and Parallel
ports over the IrLMP/IrLAP protocol stack. The motivation for IrCOMM comes from the many printing and
communication applications which use standard communication APIs to talk to other devices via serial and
parallel ports. By making IrDA protocols accessible
via these APIs, many existing applications including
printing can run over an IrDA infrared link without
change. This intent to support so-called legacy applications is the basis for IrCOMM. New applications are
encouraged to take better advantage of IrDA protocols by using their capabilities directly.
Emulating COMM ports raises a number of questions,
Rev.1.4, 20-Sep-06
starting with what kinds of ports will be emulated.
IrCOMM emulates RS-232 (EIA/TIA-232-E) serial
ports, and Centronics parallel ports like those found
on most personal computers. The four service types
used to emulate these ports are the core of this specification. Before discussing service types, however,
there are some basic differences between wired and
IrDA communications to consider.
Wired communications methods can send streams
of information in both directions at once, because
there are multiple wires (some to send data on, some
to receive data from). With infrared, there is the equivalent of only one wire (the IR path through the air).
This has the following implications:
• IrDA protocols send packets one way at a time.If a
device tried to send data and listen for data at the
same time, it would "hear" itself and not the device
it wants to communicate with. The way IrDA
devices achieve two way communications is to
take turns, also known as "turning the link around".
This happens at least every 500 ms, and can be
made more frequent as necessary. This latency
makes it impossible to perfectly emulate the wired
COMM environment - very timing sensitive operations will be disrupted.Fortunately, many communication tasks are not so sensitive, and can
therefore use IrCOMM.
• All of the information carried on multiple wires
must be carried on the single IR "wire". This is
accomplished by subdividing the packets into data
and control parts. In this way a logical data channel and control channel are created, and the various wires can be emulated.
On a different level, IrCOMM is intended for legacy
applications, applications that know about serial or
parallel ports but know nothing about IrDA protocols.
IrDA protocols, however, have very different procedures and APIs from wired COMMs. Suppose, for
example, a word processing application wants to print
via IR using IrDA protocols, an application must first
"discover" the printer (locate a printer in IR-space),
then check the printercs IAS to find information
needed to connect. Since the word processing application (a legacy application) knows nothing about
this, IrCOMM maps these operations into normal
COMM operations so that it is completely transparent.
For the purposes of IrCOMM a complete communication path involves two applications running on different devices (the communication endpoints) with
a communication segment between them. The
www.vishay.com
23
communication segment may consist solely of IR or
IR connections to a network. The figure below shows
the complete communication path.
Application
Application
Communication
Segment
Device A
Device B
17267
IrCOMM is intended to cover applications that make
use of the serial and parallel ports of the devices in
which they reside. In the simple case, the communication segment is an IR link from one device to
another (direct connect). In the case where the communication segment is a network, IR is used for the
path between the device and a networking connection
device like a modem. Modems communicate through
the network using wire, radio or IR. IrCOMM is only
concerned with the connection between devices in
the direct connect case or between the device and a
modem in the network case. There are other configurations that IrCOMM can support such as modules
that communicate via IR on one side and provide a
wired interface on the other side. These devices are
not really modems but offer a similar service and thus,
are not explicitly discussed.
Basically two device types exist that IrCOMM must
accommodate. Type 1 devices are the communication end points such as computers and printers. Type
2 devices are those that are part of the communication segment such as modems. Though IrCOMM
does not make a distinction between these two device
types in the protocol, accommodating both types of
devices impacts the IrCOMM protocol. The figures
below illustrate how the two IrCOMM device types fit
into communication paths.
Device A
with IrDA
(Type 1)
17268
Device A
with IrDA
(Type 1)
IR
IR
Device B
with IrDA
(Type 2)
Device B
with IrDA
(Type 1)
Wire
Device C
non IrDA
The information transferred between two IrCOMM
entities has been defined to support both type 1 and
type 2 devices. Some information is only needed by
type 2 devices while other information is intended to
be used by both. In the protocol no distinction is made
www.vishay.com
24
between type 1 and type 2 therefore, it is up to the
IrCOMM implementor to determine if the information
passed in the IrCOMM protocol is of use to the implementation. Since the devices do not know the type of
the other device in the communication path, they
must pass all the information specified by the protocol
of which they have knowledge.
IrCOMM emulates serial and parallel ports. However,
printing and communications applications use communication ports in a variety of ways. To address this
need, IrCOMM provides four service types or classes:
3-Wire raw, 3-Wire, 9-Wire, and Centronics. The service types fall into 2 camps, which are called raw and
cooked; the differences hinge on whether a control
channel is supplied and the type of flow control used.
3-Wire raw provides a data channel only, and uses
IrLAP flow control. The "cooked" service types (3Wire, 9-Wire, and Centronics) support a control channel, and employ Tiny TP flow control.
3-Wire raw - This service type can be used for serial
or parallel emulation when a single exclusive connection is acceptable, and only the data circuits need to
be emulated (no non-data circuits in a corresponding
wired setting carry any information). The name of this
service comes from the notion of emulating the minimum three RS-232 circuits required for full duplex
communications. The circuits are shown below.
CCITT
Signal
Description
Comment
102
Signal
Common
This circuit is not needed for IR but is
one of the circuits that drove the
definition of the name.
103
Transmitted
Data (TD)
This connection carries data
transmitted by the DTE
104
Received
Data (RD)
This connection carries data received
by the DTE
Here are the main attributes of the 3-Wire Raw service class:
• Only one non-IAS IrLMP connection can be
open if 3-Wire raw is used - all other connections
must be closed before it can be established, and
others must wait until the raw connection is closed
before they can connect.This is because 3-Wire
raw uses the flow control features of IrLAP, which
can result in a deadlock condition if more than one
non-IAS connection is open.
• Minimal Implementation. All the IrCOMM data is
sent directly via IrLMP in IrLMP packets. All data
that follows the IrLMP Mux bytes in an IrLMP
packet is IrCOMM data, (i.e., it is the information
that would travel over the data line(s) of a wired
interface). No control channel is available to comDocument Number: 82504
Rev.1.4, 20-Sep-06
municate information about the state of other
leads (e.g., RTS/CTS), software flow control settings, and the like. A service which employs 3-Wire
raw must be able to do without that information.
The link is merely a raw channel for the movement
of data.
• This service can be used to emulate both serial
and parallel ports. This may seem counter–intuitive (who has ever heard of a 3-Wire parallel
port?), but if you remove the non-data circuits
(which 3-Wire raw does not emulate), serial and
parallel are equivalent, i.e., just streams of data.
IrLPT is an IrDA service in use on commercially available printing devices. It is equivalent to 3-Wire raw in
functionality, but is slightly different in how it uses the
IAS.
3-Wire - Like 3-Wire raw, the name of this service
comes from the minimum three RS-232 circuits
required for full duplex communications. Like 3-Wire
raw, it is intended for both serial and parallel ports.
However, there are the following important differences to be noted:
• 3-Wire service class makes use of Tiny TP flow
control, so that it may coexist with other connections that employ higher level (not IrLAP) flow control (including other cooked IrCOMM connections).
It is not limited like 3-Wire raw to a single IrLMP
connection.
• 3-Wire service class supports a control channel for
sending information like data format. The control
channel mechanism is described in the chapter
titled Frame Formats and the Control Channel.
• Because of the need for flow control and the use
of the control channel, the 3-Wire service type
uses a more elaborate frame format.
9-Wire - The name of this service class comes from
the notion of emulating the 9 circuits of an
RS-232 interface which are part of a standard IBM
compatible PC. Unlike the previous services it is true
to its name;
9-Wire emulates serial ports only. Three of the circuits
are the same as described in the 3-Wire service
classes. The other six are listed below.
CCITT
Signal Description
105
Request to Send (RTS)
106
Clear to Send (CTS)
107
Data Set Ready (DSR)
108
Data terminal Ready (DTR)
109
Data Channel received line signal detector (RLSD), aka
Carrier Detect (CD)
125
Calling indicator, aka ring Indicator (RI)
Rev.1.4, 20-Sep-06
Some attributes of this service are listed below.
• Like 3-Wire, it uses the Tiny TP flow control mechanism. It also uses the same control channel
mechanism for sending information like data format.
• The control channel is used to send the states of
the other RS-232 leads as they change.
Centronics - This service is intended to emulate the
function of a standard Centronics interface. This service is for parallel ports only. Some attributes of this
service are listed below.
• It uses the Tiny TP flow control mechanism.
• It uses the same control channel mechanism used
in 3-Wire to send the status/changes of the additional circuits.
IrDA Object Exchange Protocol (IrOBEX)
One of the most basic and desirable uses of the IrDA
infrared communication protocols is simply to send an
arbitrary "thing", or data object, from one device to
another, and to make it easy for both application
developers and users to do so. We refer to this as
object exchange (uncapitalized), and it is the subject
of the protocol IrOBEX (for IrDA Object Exchange,
OBEX for short). OBEX is a compact, efficient, binary
protocol that enables a wide range of devices to
exchange data in a simple and spontaneous manner.
OBEX is being defined by members of the Infrared
Data Association to interconnect the full range of
devices that support IrDA protocols. It is not, however, limited to use in an IrDA environment.
OBEX performs a function similar to HTTP, a major
protocol underlying the World Wide Web. However,
OBEX works for the many very useful devices that
cannot afford the substantial resources required for
an HTTP server, and it also targets devices with different usage models from the Web. OBEX is enough
like HTTP to serve as a compact final hop to a device
"not quite" on the Web.
A major use of OBEX is a "Squirt" or "Slurp" application, allowing rapid and ubiquitous communications
among portable devices or in dynamic environments.
For instance, a laptop user squirts a file to another
laptop or PDA; an industrial computer slurps status
and diagnostic information from a piece of factory
floor machinery; a digital camera squirts its pictures
into a film development kiosk, or if lost can be queried
(slurped) for the electronic business card of its owner.
However, OBEX is not limited to quick connect-transfer-disconnect scenarios - it also allows sessions in
which transfers take place over a period of time, maintaining the connection even when it is idle.
www.vishay.com
25
PCs, pagers, PDAs, phones, auto-tellers, information
kiosks, calculators, data collection devices, watches,
home electronics, industrial machinery, medical
instruments, automobiles, pizza ovens, and office
equipment are all candidates for using OBEX. To support this wide variety of platforms, OBEX is designed
to transfer flexibly defined "objects"; for example,
files, diagnostic information, electronic business
cards, bank account balances, electrocardiogram
strips, or itemized receipts at the grocery store.
"Object" has no lofty technical meaning here; it is
intended to convey flexibility in what information can
be transferred. OBEX can also be used for Command
and Control functions – directives to TVs, VCRs, overhead projectors, computers and machinery.
OBEX consists of two major parts: a model for representing objects (and information that describes the
objects), and a session protocol to provide a structure
for the "conversation" between devices.
OBEX is designed to fulfill the following major goals:
IrDA Infrared Transfer Picture (IrTran-P)
IrTran-P (Infrared Transfer Picture) is an image communication scheme for a digital camera based on the
Infrared Communication Standard specification created by IrDA. The IrTran-P specification should generally be used together with the IrDA standard
specifications.
IrTran-P is placed on the upper layer of IrSIR, IrLAP,
IrLMP, TinyTP and IrCOMM which is already established as IrDA standard specifications. SCEP (Simple
Command Execute Protocol) and a bFTP (Binary File
Transfer Protocol) are necessary for exchanging an
image between devices and mutually exchanging
properties of the devices. An image format (file) called
UPF (Uni Picture Format) is exchanged on such an
entity (UPF is the image format out of the category of
IrDA, and can be found in the appendix of the IrTranP specification). IrTran-P is a generic name given to
all of these components.
UPF (Uni Picture Format)
bFTB (binary File Transfer Protocol)
The wide world of applications
(Command Definition)
Default OBEX
applications
SCEP (Simple Command Execute Protocol)
(connection management, segmentation & reassemple)
IrCOMM
(RS232Cemulation)
OBEX protocol
Various Transports
(TinyTP, Connectionless)
IAS Services
IrLMP-IAS
Tiny TP
(Information Acces Service)
(flow control for a multiplexed channel)
IrMP-MUX (Link Management Protocol)
IrLMP LM-MUX
IrLAP (Link Acces Protocol)
IrLAP
17269
Figure 3. OBEX in the IrDA architecture
• Application friendly - provide the key tools for rapid
development of applications
• Compact - minimum strain on resources of small
devices
• Cross platform
• Flexible data handling, including data typing and
support for standardized types - this will allow simpler devices for the user through more intelligent
handling of data inside.
• Maps easily into Internet data transfer protocols
• Extensible - provides growth path to future needs
like security, compression, and other extended
features without burdening more constrained
implementations.
• Debuggable
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17270
IrDA SIR 1.0 (115.2kbit/s) / SIR 1.1 (4.0Mbit/s)
SCEP establishes a session on IrCOMM and provides a transparent session which notifies an upper
layer of a command. The procedure of SCEP is developed by a lower layer making use of an advantage
that an IrDA protocol is "error free", as a high speed
session layer matching the IrDA protocol.
As is apparent from its name, bFTP provides a service for transferring a binary file. The bFTP assumes
a virtual file system together with a communication
protocol. The bFTP has an aspect which enables it to
be easily implemented, because it assumes such a
simple file system that will allow "a binary file to be
stored with its name".
Moreover, bFTP is characterized by a query function
which allows it to query functions and properties of a
device and the image format available in the theme of
this section, i.e., the image transfer. This query function simplifies the user interface of a digital camera,
Rev.1.4, 20-Sep-06
and allows the most suitable data of an image to be
transferred between the digital cameras or printers
facing each other. In addition, this function makes it
possible for the user to transfer, communicate or print
suitable image data regardless of the difference in
platform or model just by "selecting a photograph to
be sent and pushing a transmission button".
As mentioned earlier, UPF is the standard of an
image format not included in the category of the IrDA
standard. The IrDA standards were originally provided for defining and standardizing a protocol in connection with infrared communications. Therefore, it is
out of the scope to define the contents of an image
transfer. However, in order to ensure mutual connectivity as an application of a digital camera, it is
required to decide an image format so that image data
sent via infrared communication is reliably reproduced. Therefore, in advocating IrTran-P as a standard to IrDA, the specific contents of an image format
of IrTran-P are defined and described in an appendix.
UPF is an image file format based on the JPEG base
line. JFIF, which is a JPEG file, makes an image of
various color forms available and employs a high level
of compression scheme. For this reason, JFIF may be
regarded as the industry standard of an image file format today. Since JPEG is a format enabling a variety
of color forms, a compromise is required to some
extent in order to realize the standard at a low cost, for
example adopting only a part of the format as the
standard. In UPF, among the formats included in the
base line of JPEG, the format which allows the
devices at least to reliably display and mutually transfer an image is defined as an indispensable one, and
others are regarded as an option. For more details,
please refer to the sections of UPF in the later part of
this document.
It is characteristic of a digital camera that all the data
accompanying a photograph taken by a digital camera, such as a photo-taking date/time and the orientation (direction) of an image and other additional data,
cannot be covered by the data within the JPEG format. In view of such a background, UPF is designed
so that data is separated and stored on its own
header arranged in the file without changing the
image data scheme of JPEG Base Line at all. In addition, the header has expendability and allows a vendor-unique function to be added thereto. This makes
it possible to separate the data necessary for a digital
video camera from the data necessary for display and
expansion of an image. This is advantageous in that
the existing JPEG techniques can be used where
they stand and do not have to be changed. In a compact device like a digital camera, when using existing
Rev.1.4, 20-Sep-06
hardware or software, e.g. in the case where an algorithm of JPEG compression/expansion or the like is
performed by hardware or is fixedly used as firm
ware, it is undesirable to change JPEG itself.
As a further advanced step, UPF is designed so that
additional data on an ambiguous point within the data
of JPEG scheme is arranged in the header part. The
additional data includes factors such as white level,
black level and color-difference signal, necessary for
reproducing an image with correct brightness and
color.
Although the format of a digital camera is being examined by various organizations, a conclusive decision
has not yet been made. In most cases, an arrangement such as a new addition of a tag to JPEG or the
like has been proposed. However, it will take a long
time to reach a conclusion satisfactory to all the companies concerned. The approach of making the best
use of an existing standard, wherein the data necessary for a digital camera is separated and added so as
to assure expendability, is more realistic than the
approach of waiting for a new standard to be defined
and finalized.
Though UPF is defined as an appendix, it is indispensable in order that the IrTran-P standard is able to
support an image format of a UPF scheme. In IrTranP, a sender starts an operation which transfers picture data from a digital camera.
• Operation by User
With the use of "selection of a specific picture" and
a "transmission button" the user puts the digital
camera of the sender into a transmission state.
It is assumed that the device of a receiver is
always in a receiving state or put info a picture
data receiving state by a "reception button".
• Establishment of Session by SCEP
The digital camera of the sender carries out a discovery procedure using IrDA protocols and performs a connection for the physical to IrCOMM
layers of IrDA protocols in accordance with IrDA
protocols. When an IrDA transmission path is
established, SCEP makes a "session establishment request" from the sender to the receiver of a
digital camera, printer or PC. If the receiver is
implemented with SCEP, it must make a response
of either "session established" or "session establishment rejected".
• Query Operation by bFTP (Query function)
When a session by SCEP is established, the digital camera of the sender issues a Query request in
order to recognize the picture processing functions of the receiver. The information mutually
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27
exchanged by the Query request includes the
transmittable / receivable picture size, the picture
compression format and the basic picture size of
the device. Since this information is exchanged
before transfer of picture data, the picture data can
be transferred in "the most reasonable format"
between devices of different platforms.
In IrTran-P, a "mandatory format" is defined
among the picture data formats of both sides,
whereby a picture can be reliably exchanged
between devices of different grades or manufacturers.
Furthermore, the power supply condition of the
device, the receivable data capacity etc. should be
queried. This makes it possible to deal with the
applications of a portable system.
• Transfer of Picture Data by bFTP
Transfer of picture data is started once the most
appropriate picture format for both the sender and
the receiver has been determined by Query.
SCEP performs the data transfer at a high transmission rate by making use of IrDA protocols. After
the file transfer is completed, next picture data
may be subsequently transmitted, or a session
may be disconnected by SCEP. (Accordingly,
even a simple model can transmit more than one
picture in succession.)
• Completion of Session by SCEP
When the picture transfer has been completed, the
digital camera of the sender disconnects a session
by SCEP. Thereafter, a disconnection request is
issued for IrCOMM and lower layers of IrDA protocols and the picture transfer operation has been
completed.
IR Mobile Communication Standard
(IrMC)
The IrDA IrMC specification defines the rules for utilization of IR in wireless communications equipment,
e.g., in mobile handsets, PDAs, PCs, notebook computers and pagers.
The IrMC specification enables IrMC Object
exchange between a variety of applications. For
instance, the IrMC specification enables easy
exchange of:
• business cards between Phone Book Applications
• text messages between Messaging Applications
• calendar and todo items between Calendar Applications
• short notes between Note applications
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The IrMC Call Control specification enables call control of mobile handsets. The IrMC Audio Specification
enables real time audio transmission respectively.
These two specifications are for communication
between a handset and PC or a handset and car cradle.
Data Transmission
The IrMC framework uses the existing IrDA specifications as much as possible. IrDA connection-oriented
services are used as is, and the connectionless service (Ultra) is further defined to be applicable to IrMC
devices.
Physical Layer Considerations
Because the power consumption requirements of the
IrMC devices are very critical, a low power option for
these devices has been specified already in the
IrPHY version 1.2. This specification defines a lighter
physical layer and allows up to ten times savings in
the LED drive current. It should be noted that this
specification, which only expects the Specifications
for IR Mobile Communications (IrMC) Version 1.1
IrMC devices to be capable of 20 cm link distance
from IrMC device to IrMC device and 30 cm from IrMC
device to a standard IrDA device, is optional and the
original IrDA-SIR values may be used in all IrMC
device implementations. Despite the shorter communication range of some IrMC devices, all devices must
clearly be compatible with the IrDA-SIR in the short
range.
Devices supporting IrCOMM communications with
personal computers should realize that the RF interference shielding of PCs may be imperfect.
For Mobile Communication applications standard
transceivers, fulfilling the IrDA‚ physical layer specification can be applied. However, especially in mobile
phone application the demand for a high EMI immunity must be considered. Vishay Semiconductors supplies devices suited for these applications.
Rev.1.4, 20-Sep-06
IR Financial Messaging (IrFM)
IrSimpleTM - Simple Connect Standard
The IrFM profiles have been developed to enable a
digital payment system which will cut transaction
costs for the merchant and the financial institutions,
cut charge-back fees to merchants through the electronic warehousing of transaction receipts, and provide a simpler method of financial transaction tracking
to individuals for personal and business use. In simple words: IR enabled devices as mobile phones or
PDAs will include the credit card information and the
transaction will be done over the air by Infrared beaming.
IrFM provides a quick and seamless way for users of
infrared enabled portable devices, such as PDAs and
mobile phones, to pay for services and merchandise
by beaming their "soft" credit cards, debit cards,
checks, cash, or other financial instruments to a point
of sale device (POS), ATM, vending machine or other
compatible payment terminal. The IrFM Profiles
define the minimum technical requirements needed to
implement the use cases described. Potential devices
implementing these Profiles include pagers, PDAs
and mobile phones communicating with POS terminals, vending machines, ATMs and other existing
POS devices enabled with infrared adapters, or new
devices with IrDA capability built in.
IrFM is compatible with the Ir Physical Layer standard
and any physical layer compliant hardware transceiver will support IrFM.
Early adopters of this new financial messaging scenario will include the many millions of users of IrDA
enabled PDA's and mobile phones; paying for meals
at restaurants and fast food outlets, buying gas at the
pump, making purchases at all types of stores, going
to the movies, using public transportation systems
and a host of other applications made possible by the
electronic wallet concept.
The manual card swipe/card reader interaction
between the consumer's physical card and the point
of sale terminal is replaced by the consumer’s handheld device and an IR-enabled point of sale terminal.
After the transaction has been "beamed", the backend processing of the transaction is treated as if the
process had occurred by card swipe. No backend
processing changes are required.
IrSimple (Acronym: IrSC), is one of the latest additions to the upper layer protocols, it does not replace
but enhances most of the other application based protocols by providing a more efficient mechanism to
transfer specific object data formats such as graphic
files that are typically associated with small portable
devices maintaining the lowest usage of memory.
Frequent scenarios are the transmission of pictures
between mobile phones as well as from mobiles to TV
sets. This protocol also relies on the binding Access
and Management protocols.
Because it must maintain a degree of integrity with
other application’s protocol that would also allow it to
handle standard bidirectional transmission of small
data files, it makes use of a sequence manager protocol IrSMC for the segmentation and reassembly of
frames (flow control), primarily between the application protocols and the link management protocol
IrLMP. Unlike with other robust and complex data
transfer protocols, IrSC is specifically aimed at visual
(graphical data transfers). It is not mandatory for the
receiving station to maintain a bidirectional link
because successful transmission of data is visually
ackknowledged.
The Infrared Data Association (IrDA) announced the
availability of the IrSimple Protocol and Profile Specifications under the brand name SimpleShotTM. Simple Shot enables mobile devices like Camera Phones
to wireless transmit digital images to similarly enabled
Televisions, Monitors, Projectors and Photo Kiosks.
SimpleShot frees the billions of digital images trapped
in Camera Phones and PDAs, allowing them to be
viewed on large screens or quickly printed. The IrDA
Special Interesting Group (SIG) developed and perfected SimpleShot for fast, wireless communication
between mobile devices and digital home appliances.
Rev.1.4, 20-Sep-06
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Appendix
List of Terms and Abbreviations:
IrDA
Infrared Data Association
IrLAP
IrDA Link Access Protocol
IrLMP
IrDALink Management Protocol
IrPHY
IrDA Physical Layer
IrTRAN-P
IrDA Transfer Picture
IrCOMM
IrDA "Serial & Parallel Port Emulation over Ir"
IrOBEX
IrDA Object Exchange Protocol
Tiny TP
a Flow control mechanism for use with IrLMP
LM-MUX
IrLMP Multiplexer
LM-IAS
IrLMP Information Access Service
SCEP
Simple Command Execute Protocol
BFTP
binary File Transfer Protocol
UPF
Uni Picture Format
SIR
Serial Infrared
FIR
Fast Infrared
IrMC
IrDA Mobile Communication
IrFM
IrDA Financial Messaging
IrSC
IrSimple(TM), SimpleShot(TM)
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Rev.1.4, 20-Sep-06
Symbols and Terminology
A
anode
Anode terminal
A
ampere
SI unit of electrical current
A
radiant sensitive area
That area which is radiant sensitive for a specified range
a
distance
E.g. a distance between the emitter (source)
and the detector
B
base
Base terminal
BER Bit Error Rate
bit/s data rate or signaling rate
1000 bit/s = 1 kbit/s, 106 bit/s = 1 Mbit/s
C
capacitance
Unit: F (farad) = C/V
C
coulomb
C=As
C
cathode, cathode terminal
C
collector, collector terminal
°C
degree Celsius
Celsius temperature, symbol t, and is defined
by the quantity equation t = T - T0.
The unit of Celsius temperature is the degree
Celsius, symbol °C. The numerical value of a
Celsius temperature t expressed in degrees
Celsius is given by t / °C = T / K – 273.15
It follows from the definition of t that the degree
Celsius is equal in magnitude to the kelvin,
which in turn implies that the numerical value of
a given temperature difference or temperature
interval whose value is expressed in the unit
degree Celsius (°C) is equal to the numerical
value of the same difference or interval when
its value is expressed in the unit kelvin (K)
cd
candela
SI unit of luminous intensity. The candela is the
luminous intensity, in a given direction, of a
source that emits monochromatic radiation of
frequency 540 x 1012 hertz and that has a radiant intensity in that direction of
1/683 watt per steradian. (16th General Conference of Weights and Measures, 1979)
1 cd = 1 lm sr-1
CD
diode capacitance
Total capacitance effective between the diode
terminals due to case, junction and parasitic
capacitances
Rev. 1.4, 06-Oct-06
Cj
junction capacitance
Capacitance due to a pn junction of a diode,
decreases with increasing reverse voltage
d
apparent (or virtual) source size
(of an emitter)
The measured diameter of an optical source
used to calculate the eye safety laser class of
the source. See IEC60825-1 and
EN ISO 11146-1
E
emitter
Emitter terminal (phototransistor)
EA
illumination at standard illuminant A
According to DIN 5033 and IEC 306-1, illumination emitted from a tungsten filament lamp
with a color temperature Tf = 2855.6 K, which
is equivalent to standard illuminant A
Unit: lx (Lux) or klx
EA amb ambient illumination at standard illuminant A
echo - off
Unprecise term to describe the behavior of the
output of IrDA® transceivers during transmission. "echo – off" means that by blocking the
receiver the output Rxd is quiet during transmission
echo - on
Unprecise term to describe the behavior of the
output of IrDA® transceivers during transmission. "echo – on" means that the receiver output Rxd is active but often undefined during
transmission. For correct data reception after
transmission the receiver channel must be
cleared during the latency period
Ee, E irradiance (at a point of a surface)
Quotient of the radiant flux d)e incident on an
element of the surface containing the point, by
the area dA of that element. Equivalent definition. Integral, taken over the hemisphere visible
from the given point, of the expression
Le cosT d:, where Le is the radiance at the
given point in the various directions of the incident elementary beams of solid angle d:, and
T is the angle between any of these beams and
the normal to the surface at the given point
Ee
d)
= --------e- =
dA
³
L e cos T d : 2 S sr
Unit: W m-2
Ev, E illuminance (at a point of a surface)
Quotient of the luminous flux d)v incident on
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31
an element of the surface containing the point,
by the area dA of that element.
Equivalent defnition. Integral, taken over the
hemisphere visible from the given point, of the
expression Lv cosT d:, where Lv is the luminance at the given point in the various directions of the incident elementary beams of solid
angle d:, and T is the angle between any of
these beams and the normal to the surface at
the given point
d )v
L v cos T d : E v = --------- =
dA
³
2 S sr
F
f
fc, fcd
fs
FIR
Ia
IB
IBM
IC
Ica
ICEO
ICM
idle
Unit: lx = lm m-2
farad
Unit: F = C/V
frequency
Unit: s-1, Hz (Hertz)
cut-off frequency – detector devices
The frequency at which, for constant signal
modulation depth of the input radiant power,
the demodulated signal power has decreased
to ½ of its low frequency value. Example: The
incident radiation generates a photocurrent or
a photo voltage 0.707 times the value of radiation at f = 1 kHz
(3 dB signal drop, other references may occur
as e.g. 6 dB or 10 dB)
switching frequency
Fast Infrared, as SIR, data rate 4 Mbit/s
light current
General: Current which flows through a device
due to irradiation/illumination
base current
base peak current
collector current
collector light current
Collector current under irradiation
Collector current which flows at a specified illumination/irradiation
collector dark current, with open base
Collector-emitter dark current
For radiant sensitive devices with open base
and without illumination/radiation
(E = 0)
repetitive peak collector current
Mode of operation where the device (e.g. a
transceiver) is fully operational and expecting
to receive a signal for operation e.g in case of
a transceiver waiting to receive an optical input
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or to send an optical output as response to an
applied electrical signal
Ie, I radiant intensity (of a source, in a given
direction)
Quotient of the radiant flux d)e leaving the
source and propagated in the element of solid
angle d: containing the given direction, by the
element of solid angle
Ie = d)e/d:
Unit: W sr-1
Note: The radiant intensity Ie of emitters is typically measured with an angle < 0.01 sr on
mechanical axis or off-axis in the maximum of
the irradiation pattern
IF
continuous forward current
The current flowing through a diode in the forward direction
IFAV average (mean) forward current
IFM peak forward current
IFSM surge forward current
short-circuit current
Ik
That value of the current which flows when a
photovoltaic cell or a photodiode is short circuited (RL << Ri ) at its terminals
Io
dc output current
Iph
photocurrent
That part of the output current of a photoelectric detector, which is caused by incident radiation
IR
reverse current, leakage current
Current which flows through a reverse biased
semiconductor pn-junction
IR
Abbreviation for infrared
Ira
reverse current under irradiation
Reverse light current which flows due to a
specified irradiation/illumination in a photoelectric device
Ira = Iro + Iph
IrDA® Infrared Data Association
No profit organization generating infrared data
communication standards
IRED infrared emitting diode
Solid state device embodying a p-n junction,
emitting infrared radiation when excited by an
electric current. See also LED:
Solid state device embodying a p-n junction,
emitting optical radiation when excited by an
electric current.
Iro
reverse dark current, dark current
Reverse current flowing through a photoelectric device in the absence of irradiation
Rev. 1.4, 06-Oct-06
IrPHY version 1.0
SIR IrDA®‚ data communication specification
covering data rates from 2.4 kbit/s to
115.2 kbit/s and a guaranteed operating range
more than one meter in a cone of ± 15°
IrPHY version 1.1
MIR and FIR were implemented in the IrDA®
standard with the version 1.1, replacing version
1.0
IrPHY version 1.2
Added the SIR Low Power Standard to the
IrDA® standard, replacing version 1.1.
The SIR Low Power Standard describes a current saving implementation with reduced range
(min. 20 cm to other Low Power Devices and
min. 30 cm to full range devices).
IrPHY version 1.3
extended the Low Power Option to the higher
bit rates of MIR and FIR replacing version 1.2.
IrPHY version 1.4
VFIR was added, replacing version 1.3
ISB quiescent current
ISD supply current in dark ambient
ISH supply current in bright ambient
Iv, I luminous intensity (of a source, in a given
direction)
Quotient of the luminous flux d)v leaving the
source and propagated in the element of solid
angle d: containing the given direction, by the
element of solid angle
Ie = d)v/d:
Unit: cd sr-1
Note: The luminous intensity Iv of emitters is
typically measured with an angle < 0.01 sr on
mechanical axis or off-axis in the maximum of
the irradiation pattern
K
luminous efficacy of radiation
Quotient of the luminous flux )v by the corresponding radiant flux )e:
K = )v / )e
Unit: lm W-1
Note: When applied to monochromatic radiations, the maximum value of K(O) is denoted by
the symbol Km
Km = 683 lm W-1 for Qm = 540 1012 Hz
(Om | 555 nm) for photopic vision.
K'm = 1700 lm W-1 for O'm | 507 nm for
scotopic vision. For other wavelengths:
K(O) = Km V(O) and K'(O) = K'm V'(O)
K
kelvin
SI unit of thermodynamic temperature, is the
fraction 1/273.15 of the thermodynamic temDocument Number: 82512
Rev. 1.4, 06-Oct-06
perature of the triple point of water (13th CGPM
(1967), Resolution 4). The unit kelvin and its
symbol K should be used to express an interval
or a difference of temperature.
Note: In addition to the thermodynamic temperature (symbol T), expressed in kelvins, use is
also made of Celsius temperature (symbol t )
defined by the equation t = T-T0, where
T0 = 273.15 K by definition. To express Celsius
temperature, the unit "degree Celsius", which
is equal to the unit "kelvin" is used; in this case,
"degree Celsius" is a special name used in
place of "kelvin". An interval or difference of
Celsius temperature can, however, be
expressed in kelvins as well as in degrees Celsius
Latency
receiver latency allowance (in ms or μs) is
the maximum time after a node ceases transmitting before the node’s receiving recovers its
specified sensitivity
LED and IRED
Light Emitting Diode
LED: Solid state device embodying a p-n junction, emitting optical radiation when excited by
an electric current. The term LED is correct
only for visible radiation, because light is
defined as visible radiation (see “Radiation and
Light”). For infrared emitting diodes the term
IRED is the correct term. Nevertheless it is
common but not correct to use "LED" also for
IREDs
Le; L radiance (in a given direction, at a given point
of a real or imaginary surface)
Quantity defined by the formula
Le
lm
lx
m
d)
v
= -------------------------------- ,
dA cos T d :
where d)e is the radiant flux transmitted by an
elementary beam passing through the given
point and propagating in the solid angle d:
containing the given direction; dA is the area of
a section of that beam containing the given
point; T is the angle between the normal to that
section and the direction of the beam
Unit: W m-2 sr-1
lumen
Unit for luminous flux
lux
Unit for illuminance
meter
SI unit of length
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33
Me; M radiant exitance (at a point of a surface)
Quotient of the radiant flux d)e leaving an element of the surface containing the point, by the
area dA of that element. Equivalent definition.
Integral, taken over the hemisphere visible
from the given point, of the expression
Le cosT d:, where Le is the radiance at the
given point in the various directions of the emitted elementary beams of solid angle d:, and T
is the angle between any of these beams and
the normal to the surface at the given point.
d)
M e = ----------e- =
dA
³
2Ssr
L e cos T d :
Unit: W m-2
MIR Medium speed IR, as SIR, with the data rate
576 kbit/s to 1152 kbit/s
Mode Electrical input or output port of a transceiver
device to set the receiver bandwidth
N.A. Numerical Aperture
N.A. = sin D/2
Term used for the characteristic of sensitivity or
intensity angles of fiber optics and objectives
NEP Noise Equivalent Power
Ptot total power dissipation
Pv
power dissipation, general
Radiation and Light
visible radiation
Any optical radiation capable of causing a
visual sensation directly.
Note: There are no precise limits for the spectral range of visible radiation since they depend
upon the amount of radiant power reaching the
retina and the responsivity of the observer. The
lower limit is generally taken between 360 nm
and 400 nm and the upper limit between
760 nm and 830 nm
Radiation and Light
optical radiation
Electromagnetic radiation at wavelengths
between the region of transition to X-rays
( O = 1 nm) and the region of transition to radio
waves ( O = 1 mm)
Radiation and Light IR
infrared radiation
Optical radiation for which the wavelengths are
longer than those for visible radiation. Note:
For infrared radiation, the range between
780 nm and 1 mm is commonly sub-divided
into: IR-A 780 nm to 1400 nm
IR-B 1.4 μm to 3 μm
IR-C 3 μm to 1 mm
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34
RD
RF
Ri
Ris
RL
RS
Rsh
dark resistance
feedback resistor
internal resistance
isolation resistance
load resistance
serial resistance
shunt resistance
The shunt resistance of a detector diode is the
dynamic resistance of the diode at zero bias.
Typically it is measured at a voltage of 10 mV
forward or reverse, or peak-to-peak
RthJA thermal resistance, junction to ambient
RthJC thermal resistance, junction to case
RXD electrical data output port of a transceiver
device
s
second
SI unit of time 1 h = 60 min = 3600 s
S
absolute sensitivity
Ratio of the output value Y of a radiant-sensitive device to the input value X of a physical
quantity: S = Y/X
Units: E.g. A/lx, A/W, A/(W/m2)
s(Op) spectral sensitivity at a wavelength Op
s(O) absolute spectral sensitivity at a wavelength O
The ratio of the output quantity y to the radiant
input quantity x in the range of wavelengths
O to O +'O:
s(O) = dy(O)/dx(O).
E.g., the radiant power )e(O) at a specified
wavelength O falls on the radiationsensitive
area of a detector and generates a photocurrent Iph. s(O) is the ratio between the generated
photocurrent Iph and the radiant power )e(O)
which falls on the detector:
s(O) = Iph / )e(O)
Unit: A/W
s(O)rel spectral sensitivity, relative
Ratio of the spectral sensitivity s(O) at any considered wavelength to the spectral sensitivity
s(O0) at a certain wavelength O0 taken as a reference:
s(O)rel = s(O)/s(O0)
s(O0) spectral sensitivity at a reference wavelength O0
SC Electrical input port of a transceiver device to
set the receiver sensitivity
SD Electrical input port of a transceiver device to
shut down the transceiver
shutdown
Mode of operation where a device is switched
to a sleep mode (shut down) by an external signal or after a quiescent period keeping some
Rev. 1.4, 06-Oct-06
functions alive to be prepared for a fast transition to operating mode. Might be in some cases
identical with "Standby"
SIR Serial Infrared,
Term used by IrDA® to describe infrared data
transmission up to and including 115.2 kbit/s.
SIR IrDA® data communication covers 2.4 kbit/s
to 115.2 kbit/s, equivalent to the basic serial
infrared standard introduced with the physical
layer version IrPhy version 1.0
split power supply
Term for using separated power supplies for
different functions in transceivers. Receiver circuits need well-controlled supply voltages.
IRED drivers don’t need a controlled supply
voltage but need much higher currents. Therefore it safes cost not to control the IRED current
supply and have a separated supply. For that
some modified design rules have to be taken
into account for designing the ASIC. This is
used in nearly all Vishay transceivers and is
described in US-Patent No. 6,157,476
sr
steradian (sr)
SI unit of solid angle :
Solid angle that, having its vertex at the centre
of a sphere, cuts off an area of the surface of
the sphere equal to that of a square with sides
of length equal to the radius of the sphere.
(ISO, 31/1-2.1, 1978)
Example:
The unity solid angle, in terms of geometry, is
the angle subtended at the center of a sphere
by an area on its surface numerically equal to
the square of the radius (see figures below)
Other than the figures might suggest, the
shape of the area doesn't matter at all. Any
shape on the surface of the sphere that holds
the same area will define a solid angle of the
same size. The unit of the solid angle is the
steradian (sr). Mathematically, the solid angle
is dimensionless, but for practical reasons, the
steradian is assigned
Standby
Mode of operation where a device is prepared
to be quickly switched into an idle or operating
mode by an external signal
T
period of time (duration)
T
temperature
0 K = – 273.15 °C
Unit: K (kelvin)
t
temperature
°C (degree Celsius)
Rev. 1.4, 06-Oct-06
t
Tamb
Tamb
TC
TC
Tcase
td
tf
Tj
toff
ton
tp
Instead of t sometimes T is used not to mix up
temperature T with time t
time
ambient temperature
If self-heating is significant: temperature of the
surrounding air below the device, under conditions of thermal equilibrium. If self-heating is
insignificant: air temperature in the surroundings of the device
ambient temperature range
As an absolute maximum rating: The maximum
permissible ambient temperature range
temperature coefficient
The ratio of the relative change of an electrical
quantity to the change in temperature ('T)
which causes it under otherwise constant operating conditions
colour temperature (BE)
The temperature of a Planckian radiator whose
radiation has the same chromaticity as that of a
given stimulus
Unit: K
Note: The reciprocal colour temperature is
also used, unit K-1 (BE)
case temperature
The temperature measured at a specified point
on the case of a semiconductor device. Unless
otherwise stated, this temperature is given as
the temperature of the mounting base for
devices with metal can
delay time
fall time
The time interval between the upper specified
value and the lower specified value on the trailing edge of the pulse.
Note: It is common to use a 90 % value of the
signal for the upper specified value and a 10 %
value for the lower specified value
junction temperature
The spatial mean value of the temperature during operation. In the case of phototransistors, it
is mainly the temperature of the collector junction because its inherent temperature is the
maximum
turn-off time
turn-on time
pulse duration
The time interval between the specified value
on the leading edge of the pulse and the specified value an the trailing edge of the output
pulse
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35
Note: In most cases the specified value is 50 %
of the signal
tpi
input pulse duration
tpo
output pulse duration
rise time
tr
The time interval between the lower specified
value and the upper specified value on the trailing edge of the pulse.
Note: It is common to use a 90 % value of the
signal for the upper specified value and a 10 %
value for the lower specified value ts Storage
time
ts
storage time
Tsd soldering temperature
Maximum allowable temperature for soldering
with a specified distance from the case and its
duration
Tstg storage temperature range
The temperature range at which the device
may be stored or transported without any
applied voltage
TXD Electrical data input port of a transceiver device
V
volt
V(O) standard luminous efficiency function for
photopic vision (relative human eye sensitivity)
V(O), V'(O)
spectral luminous efficiency (of a monochromatic radiation of wavelength O); V(O) for photopic vision; V'(O) for scotopic vision)
Ratio of the radiant flux at wavelength Om to
that at wavelength O such that both radiations
produce equally intense luminous sensations
under specified photometric conditions and Om
is chosen so that the maximum value of this
ratio is equal to 1.
VCC supply voltage (positive)
VCEsat collector-emitter saturation voltage
The saturation voltage is the dc voltage
between collector and emitter for specified
(saturation) conditions, i.e., IC and EV (Ee or
IB), whereas the operating point is within the
saturation region
Vdd supply voltage (positive)
VF
forward voltage
The voltage across the diode terminals which
results from the flow of current in the forward
direction
VFIR As SIR, data rate 16 Mbit/s
Vlogic reference voltage for digital data communication ports
VO
output voltage
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36
'VO output voltage change
(differential output voltage)
VOC open circuit voltage
The voltage measured between the photovoltaic cell or photodiode terminals at a specified
irradiance/illuminance (high impedance voltmeter!)
VOH output voltage high
VOL output voltage low
Vph photovoltage
The voltage generated between the photovoltaic cell or photodiode terminals due to irradiation/ illumination
VR
reverse voltage (of a junction)
Applied voltage such that the current flows in
the reverse direction
VR
reverse (breakdown) voltage
The voltage drop which results from the flow of
a defined reverse current
VS
supply voltage
VSS (most negative) supply voltage (in most
cases: Ground)
± M1/2 angle of half transmission distance
K
quantum efficiency
T1/2; ± M = D/2
half – intensity angle
In a radiation diagram, the angle within which
the radiant (or luminous) intensity is greater
than or equal to half of the maximum intensity.
Note: IEC60747-5-1 is using T1/2. In Vishay
data sheets mostly ± M = D/2 is used
T1/2; ± M = D/2
half – sensitivity angle
In a sensitivity diagram, the angle within which
the sensitivity is greater than or equal to half of
the maximum sensitivity.
Note: IEC60747-5-1 is using T1/2. In Vishay
data sheets mostly ± M = D/2 is used
:
solid angle, see sr, steradian for
IEC60050(845)-definition
The space enclosed by rays, which emerge
from a single point and lead to all the points of
a closed curve. If it is assumed that the apex of
the cone formed in this way is the center of a
sphere with radius r and that the cone intersects with the surface of the sphere, then the
size of the surface area (A) of the sphere subtending the cone is a measure of the solid
angle :
: = A/r2
The full sphere is equivalent to 4S sr.
A cone with an angle of D/2 forms a solid angle
Rev. 1.4, 06-Oct-06
of : = 2S(1-cos D/2) = 4Ssin2D/4
Unit: sr (steradian)
Om
wavelength of the maximum of the spectral
luminous efficiency function V(O)
'O
range of spectral bandwidth (50 %)
The range of wavelengths where the spectral
sensitivity or spectral emission remains within
50 % of the maximum value
)e;); P
radiant flux; radiant power
Power emitted, transmitted or received in the
form of radiation.
Unit: W
W = Watt
)v; ) luminous flux
Quantity derived from radiant flux )e by evaluating the radiation according to its action upon
the CIE standard photometric observer. For
photopic vision
)v = Km
f d)
eO
V( O d O
³0 -------------dO
O
Oc
wavelength, general
centroid wavelength
Centroid wavelength Oc of a spectral distribution, which is calculated as "centre of gravity
wavelength" according to
O2
O2
Oc =
³ O Sx ( O d O e ³ Sx ( O d O
O1
OD
Op
O1
dominant wavelength
wavelength of peak sensitivity or peak emission
,
d )e O
where -------------- is the spectral distribution of
dO
the radiant flux and V(O) is the spectral luminous efficiency.
Unit : lm
lm: lumen
Km = 683 lm/W:
Note: For the values of Km (photopic vision)
and K'm (scotopic vision), see IEC60050
(845-01-56).
Rev. 1.4, 06-Oct-06
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37
Ω = 4 π sr
α = 65.5°
Ω = 1.0sr
α = 2 arc cos ( 1– / 2 π)
α = 20.5°
Ω = 0.01sr
Ω = 0.1sr
α = 6.5°
94 8584
Definitions
Databook Nomenclature
The nomenclature and usage of symbols, abbreviations and terms inside the Vishay Semiconductors
IRDC Databook is based on ISO and IEC standards.
The special optoelectronic terms and definitions are
referring to the IEC Multilingual Dictionary (Electricity,
Electronics and Telecommunications), Fourth edition
(2001-01), IEC50 (Now: IEC60050). The references
are taken from the current editions of IEC60050
(845), IEC60747-5-1 and IEC60747-5-2. Measurement conditions are based on IEC and other international standards and especially guided by
IEC60747-5-3.
Editorial notes: Due to typographical limitations variables cannot be printed in an italics format, which is
usually mandatory. Our databook in general is using
American spelling (AE). International standards are
www.vishay.com
38
written in British English (BE). Definitions are copied
without changes from the original text. Therefore
these may contain British spelling.
Radiant and Luminous Quantities and Their Units
These two kinds of quantities have the same basic
symbols, identified respectively, where necessary, by
the subscript e (energy) or v (visual), e.g.)e, )v. See
note.
Note: Photopic and scotopic quantities. - Luminous
(photometric) quantities are of two kinds, those used
for photopic vision and those used for scotopic vision.
The wording of the definitions in the two cases being
almost identical, a single definition is generally sufficient with the appropriate adjective, photopic or
scotopic added where necessary.
The symbols for scotopic quantities are prime
()'v, I'v, etc), but the units are the same in both cases.
Rev. 1.4, 06-Oct-06
The radiometric terms are used to describe the quantities of optical radiation.
The relevant radiometric units are:
In general, optical radiation is measured in radiometric units. Luminous (photometric) units are used when
optical radiation is weighted by the sensitivity of the
human eye, correctly spoken, by the CIE standard
photometric observer (Ideal observer having a relative spectral responsivity curve that conforms to the
V(O) function for photopic vision or to the V'(O) function for scotopic vision, and that complies with the
summation law implied in the definition of luminous
flux).
Note: With a given spectral distribution of a radiometric quantity the equivalent photometric quantity can
be evaluated. However, from photometric units without knowing the radiometric spectral distribution in
general one cannot recover the radiometric quantities.
Radiometric Terms, Quantities and Units
Photometric
Term
Equivalent Radiometric
Term
Radiometric Term
Symbol
Unit
Reference
Radiant power,
Radiant flux
)e
W
IEC50 (845-01-24)
Radiant intensity
Ie
W/sr
IEC50 (845-01-30)
Irradiance
Ee
W/m2
IEC50 (845-01-37)
Radiant Exitance
Me
W/m2
IEC50 (845-01-47)
Radiance
Le
W/(srm2)
IEC50 (845-01-34)
Table 1: Radiometric Quantities and Units
Photometric Terms, Quantities and Units
The photometric terms are used to describe the quantities of optical radiation in the wavelength range of
visible radiation (generally assumed as the range
Symbol
Unit
Reference
)v: IEC50 (845-01-25)
Luminous power
or
Luminous flux
Radiant power
or
Radiant flux )e
)v
lm
Luminous intensity
Radiant intensity Ie
Iv
lm/sr = cd
Iv: IEC50 (845-01-31)
cd: IEC50 (845-01-50)
Illuminance
Irradiance Ee
Ev
lm/m2 = lx (Lux)
Ev: IEC50 (845-01-38)
lx: IEC50 (845-01-52)
Luminous exitance
Radiant exitance Me
Mv
lm/m2
IEC50 (845-01-48)
Luminance
Radiance Le
Lv
cd/m2
IEC50 (845-01-35)
lm: IEC50 (845-01-51)
Table 2: Photometric Quantities and Units
Photometric units are derived from the radiometric
units by weighting them with a wavelength dependent
standardized human eye sensitivity V(O) - function,
the so-called CIE-standard photometric observer.
There are different functions for photopic vision
(V(O) ) and scotopic vision (V'(O) ).
In the following is shown, how the luminous flux is
derived from the radiant power and its spectral distribution. The equivalent other photometric terms can
be derived from the radiometric terms in the same
way.
9 m2
4
m2
1 m2
1m
2m
3m
Relation between distance r, irradiance (illuminance) Ee (Ev) and intensity Ie (Iv)
The relation between intensity of a source and the
resulting irradiance in the distance r is given by the
basic square root rule law.
An emitted intensity Ie generates in a distance r the
irradiance Ee = Ie/r2.
This relationship is not valid under near field conditions and should be used not below a distance d
smaller than 5 times the emitter source diameter.
Rev. 1.4, 06-Oct-06
18145
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39
Using a single radiation point source, one gets the following relation between the parameter Ee, )e, r:
d )e W
E e = ----------- ------dA m 2
use
) , : = ---A- and get
Ie = d
------2
d:
r
I W
d)
d:
E e = ----------e- = I e -------- = ----e ------2
2
dA
dA
r m
Examples
1. Calculate the irradiance with given intensity and
distance r:
Transceivers with specified intensity of
Ie = 100 mW/sr will generate in a distance of 1 m an
irradiance of Ee = 100/12 = 100 mW/m2. In a distance
of 10 m the irradiance would be
Ee = 100/102 = 1 mW/m2.
2. Calculate the range of a system with given intensity
and irradiance threshold.
When the receiver is specified with a sensitivity
threshold irradiance Ee = 20 mW/m2, the transmitter
with an intensity Ie = 120 mW/sr the resulting range
can be calculated as
r =
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40
Ie
=
-----Ee
120
---------- =
20
6 = 2.45 m
Rev. 1.4, 06-Oct-06
Data Sheet Structure
Data Sheet Structure
Data sheet information is generally presented in the
following sequence:
• Description
• Features
• Applications
• Absolute maximum ratings
• Optical and electrical characteristics
• Typical characteristics (diagrams)
• Dimensions (mechanical data)
Additional information on device performance is provided if necessary.
The thermal resistance junction ambient (RthJA)
quoted is that which would be measured without artificial cooling, i.e., under worst-case conditions.
Temperature coefficients, on the other hand, are
listed together with the associated parameters under
"Optical and Electrical Characteristics".
Description
Typical Characteristics (Diagrams)
The following information is provided: Type number,
semiconductor materials used, sequence of zones,
technology used, device type and, if necessary, construction.
Also, short-form information on the typical applications and special features is given.
Besides the static (dc) and dynamic (ac) characteristics, a family of curves is given for specified operating
conditions. Here, the typical independence of individual characteristics is shown.
Absolute Maximum Ratings
These define maximum permissible operational and
environmental conditions. If any one of these conditions is exceeded, this could result in the destruction
of the device. Unless otherwise specified, an ambient
temperature of 25 r3 °C is assumed for all absolute
maximum ratings. Most absolute ratings are static
characteristics; if they are measured by a pulse
method, the associated measurement conditions are
stated. Maximum ratings are absolute (i.e., interdependent).
Any equipment incorporating semiconductor devices
must be designed so that even under the most unfavorable operating conditions, the specified maximum
ratings of the devices used are never exceeded.
These ratings could be exceeded because of
changes in supply voltage, the properties of other
components used in this equipment, control settings,
load conditions, drive level, environmental conditions
and the properties of the devices themselves (i.e.,
ageing).
Some thermal data is given under the heading "Absolute Maximum Ratings" (e.g., junction temperature,
storage temperature range, total power dissipation).
This is because it imposes a limit on the application
range of the device.
Rev. 1.1, 29-Sep-05
Optical and Electrical Characteristics
The most important operational optical and electrical
characteristics (minimum, typical and maximum values) are grouped under this heading, together with
associated test conditions supplemented with curves.
Dimensions (Mechanical Data)
In this section, important dimensions and connection
sequences are given, supplemented by a circuit diagram. Case outline drawings carry DIN-, JEDEC or
commercial designations. Information on angle of
sensitivity or intensity and weight completes the list of
mechanical data.
Note:
If the dimensional information does not include any
tolerances, then the following applies:
Lead length and mounting hole dimensions are minimum values. Radiant sensitive or emitting area
respectively are typical, all other dimensions are maximum.
Any device accessories must be ordered separately
and the order number must be quoted.
Additional Information
Preliminary specifications
This heading indicates that some information given
here may be subject to changes.
Not for new developments
This heading indicates that the device concerned
should not be used in equipment under development.
The device is, however, available for present production.
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41
Taping, Labeling, Storage, Packing and Marking
Vishay Semiconductor Standard Bar-Code Labels
Standard bar code labels for finished goods
The standard bar code labels are product labels and
used for identification of goods. The finished goods
are packed in final packing area. The standard packing units are labeled with standard bar code (3-of-9
bar code (code 39) conforming MIL-STD-1189)
before transported as finished goods to warehouses.
The labels are on each packing unit with Vishay Semiconductor GmbH specific data. The content of the
label is show in the following table and figure 1.
In future a change from 1D to 2D barcodes can be
expected. That one will look as shown in figure 2.
For transceivers the following logos are used inside
the bar code label which are shown in figure 3.
The following lead (Pb)-free categories (see figure 1
to figure 3) are meant to describe the lead (Pb)-free
2nd level interconnect terminal finish/material of components and/or the solder used in board assembly.
e1
SnAgCu (shall not be included in category 2)
e2
Sn alloys with no Bi or Zn excluding SnAgCu
e3
Sn
e4
Precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn)
e5
SnZn, SnZnx (no Bi)
e6
contains Bi
e7
low temperature solder (d 150 °C) containing Indium
(no Bi)
e0, e8, e9
symbol are unassigned
Lead (Pb)-free category
e3 – Sn
Origin
Machine (CPU) number
QA acceptance seal
Device type
QA signature and date
Plant location code
Lead (Pb)-free logo
Device selection code
Date code
Lot number
Quantity
RoHS compliance logo
Working week day and shift
19873
Remark: Multi - Date Codes would be marked in the QA field of this label on top of the lead
Figure 1. Barcode label, detailed description
Terminations
lead (Pb)-free designed
19874
ESD
Totally
lead (Pb)-free designed
Lead (Pb)-free categories
19877
Figure 2. 2D barcode label (according the Barcode Standard for
2D Label PDF 417) for a lead (Pb)-free device, equivalent to that
shown in figure 11.
www.vishay.com
42
Figure 3. Logos inside the label
Rev. 1.7, 20-Sep-06
Moisture Proof Packing
The reel with the taped components is packed in a
moisture proof aluminum bag to protect the devices
from absorbing moisture during transportation and storage. This bag finally is packed in a cardboard box. On
the reel as well as on the bag and the box are labels,
which are described in the following (see figure 4). This
is an example and little variations may be between different plants.
Pb-free information is part of the bar code label, but
when it is missing a "lead (Pb)-free"-label (figure 8)
may be attached. In addition the "Moisture-Sensitive
Identification Label (MSID)" is applied (figure 9).
Moisture Level
Sticker
BarCode
ESD Sticker
Label
Aluminum bag
Box
19880
0
Figure 7. Product (top) and taping label
Reel
18298
Figure 4. Moisture proof packing
Inside the aluminum bag with the reel are a desiccant
bag and a humidity indicator (figure 5).
19881
Figure 8. Lead (Pb)-free logo
19878
Figure 5. Desiccant bag (example, left) and humidity indicator card
19882
On the reel are the barcode product label and taping
label (figure 7) and a yellow ESD sticker (figure 6).
Figure 9. Moisture-Sensitive Identification Label (MSID)
19879
Figure 6. ESD sticker
Rev. 1.7, 20-Sep-06
www.vishay.com
43
On the bag the same stickers as on the reel will be
shown. In addition the moisture-sensitivity caution
label as shown in figure 10 describes the storage and
drying procedures.
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
LEVEL
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard JSTD-020
Figure 10. EIA JEDEC Standard JSTD-020 Level 4 label is
included on all dry bags
In the following two reels of different size are shown
with the labeling (figure 11 and figure 12).
Figure 12. 330-mm reel with labels. No labels on the rear. Lead
(Pb)-free information is on the barcode label.
Final Packing
The sealed reel is packed into a cardboard box, which
is 334 x 335 x 40 mm3 in size. A secondary cardboard
box is used for shipping purposes, with the following
sizes, slightly different for different production locations, see the following tables.
Table 2. Secondary boxes Malaysia,
location code 68
Size, Length x Width x Height
mm x mm x mm
Quantity of boxes
360 x 360 x 45
1
360 x 360 x 120
2
360 x 360 x 200
5
360 x 360 x 340
8
675 x 355 x 375
16
620 x 530 x 480
26
625 x 525 x 640
30
1000 x 600 x 580
60
Philippines, location code 19
Size, Length x Width x Height
mm x mm x mm
Quantity of boxes
360 x 360 x 130
2
380 x 380 x 260
5
370 x 360 x 620
11
730 x 380 x 570
20
On the boxes the same labels as on the bag will be
used.
19889
Figure 11. 180-mm reel with labels. No labels on the rear. Lead
(Pb)-free marking is not on the barcode; here an additional lead
(Pb)-free sticker is applied.
www.vishay.com
44
Rev. 1.7, 20-Sep-06
Recommended Method of Storage
Dry box storage is recommended as soon as the dry
bag has been opened to prevent moisture absorption.
The following conditions should be observed, if dry
boxes are not available:
• Storage temperature 10 qC to 30 qC
• Storage humidity d60 % RH max.
After more than 72 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will
recover to the former condition by drying under the
conditions given in the label on the aluminium bag as
shown in figure 5. Such an EIA JEDEC Standard
JSTD-020 Level 4 label is included on all dry bags
(see figure 10).
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices especially when these are removed from the Antistatic
Shielding Bag. “Electro–Static Sensitive Devices”warning labels (figure 6) are affixed on the packaging.
Order Information, Related Packing Units, Tape and Reel Size and Labeling
In this document the packing and labeling information for IR transceivers is compiled.
Part
Description
Quantity / Reel
Orientation in tape for mounting
pcs
TFBS4650-TR1
Side view
1000
TFBS4650-TR3
Side view
2500
TFBS4652-TR1
Side view
1000
TFBS4652-TR3
Side view
2500
TFBS5700-TR3
Side view
2500
TFBS4711-TR1
Side view
1000
TFBS4711-TR3
Side view
2500
TFBS5711-TR1
Side view
1000
TFBS5711-TR3
Side view
2500
TFBS6711-TR1
Side view
1000
TFBS6711-TR3
Side view
2500
TFBS6712-TR1
Side view
1000
TFBS6712-TR3
Side view
2500
TFDU4300-TR1
Side view
750
TFDU4300-TR3
Side view
2500
TFDU4300-TT1
Top view
750
TFDU4300-TT3
Top view
2500
TFDU5307-TR1
Side view
750
TFDU5307-TR3
Side view
2500
TFDU5307-TT1
Top view
750
TFDU5307-TT3
Top view
2500
TFDU6300-TR3
Side view
2500
TFDU6300-TT3
Top view
2500
TFDU6301-TR3
Side view
2500
TFDU6301-TT3
Top view
2500
TFBS4710-TR1
Side view
1000
TFBS6614-TR3
Side view
2500
TFDU2201-TR1
Side view
750
TFDU2201-TR3
Side view
2250
TFDU4202-TR1
Side view
750
TFDU4202-TR3
Side view
2250
TFDU4203-TR1
Side view
750
TFDU4203-TR3
Side view
2250
TFDU4100-TR3
Side view
1000
TFDU4100-TT3
Top view
1000
TFDU6102-TR3
Side view
1000
TFDU6102-TT3
Top view
1000
TFDU8108-TR3
Side view
1000
TFDU8108-TT3
Top view
1000
TOIM4232
Top view
500
Table1. Transceiver tape drawing and reel size reference according to type order text
Rev. 1.7, 20-Sep-06
Tape
Figure-No
14
14
14
14
14
15
15
15
15
15
15
15
15
16
16
17
17
16
16
17
17
16
17
16
17
18
18
19
19
19
19
19
19
20
21
20
21
20
21
22
Reel
Reel No in Reel Table
1
2
1
2
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
2
2
2
2
2
2
1
2
1
2
1
2
3
3
3
3
3
3
2
www.vishay.com
45
Shape of Reel and Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
Reel
mm
mm
mm
mm.
mm
mm
W3 max.
mm
#1
16
180
60
16.4
22.4
15.9
19.4
#2
16
330
50
16.4
22.4
15.9
19.4
#3
24
330
60
24.4
30.4
23.9
27.4
(According EN 60286-3: 1998)
Leader and Trailer
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
Trailer
Leader
96 11818
Figure 13. Leader and trailer
Cover Tape Peel Strength
According to IEC 286
Peel Strength: 0.1 N to 1.3 N
(300 r10 %) mm/min
165q 180qpeel angle
www.vishay.com
46
Rev. 1.7, 20-Sep-06
Tape Dimensions
19867
Drawing-No.: 9.700-5296.01-4
Issue: 1; 08.12.04
Figure 14. Tape for 1.6 - mm package side view oriented
19868
Drawing-No.: 9.700-5294.01-4
Issue: 1; 08.12.04
Rev. 1.7, 20-Sep-06
www.vishay.com
47
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
19855
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
Figure 17. Tape for 2.5 - mm package top view oriented
www.vishay.com
48
Rev. 1.7, 20-Sep-06
19869
Drawing-No.: 9.700-5299.01-4
Issue: 1; 18.08.05
19870
Drawing-No.: 9.700-5227.01-4
Issue: 3; 03.09.99
Rev. 1.7, 20-Sep-06
www.vishay.com
49
19871
Drawing-No.: 9.700-5297.01-4
Issue: 1; 08.04.05
19872
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Figure 21. Tape for 4.0 - mm package top view oriented
www.vishay.com
50
Rev. 1.7, 20-Sep-06
19876
Drawing-No.: 9.700-5284.01-4
Issue: 1; 24.07.03
Figure 22. Tape for SO - 16 package top view oriented
Marking of Transceiver Modules
Date code
6
1
0
0
V
Y
W
W
X
X
Package
2: no specific
Selection Vishay Year
Type
4: 115 kbit/s, SIR
Work week
Manufacturing
5: 1 Mbit/s, MIR
location
0:
Standard,
SMD
6: 4 Mbit/s, FIR
3:
DIL,
Through
Hole
7: RC - Receiver added
Note: V and XX are optional and
8: 16 Mbit/s, VFIR
can be omitted when the space
for marking is limited
1: 4 mm (leadframe)
2: 2.75 mm (leadframe)
Example:
3: 2.5 mm (leadframe)
The marking 4650V61268
6: PCB-based
identifies a
7:
PCB-based,
6
pin
17273-1
TFBS4650, produced by Vishay
in week 12 of year 2006 at the
location 68 (Krubong, Malaysia)
Rev. 1.7, 20-Sep-06
www.vishay.com
51
Environmental Health and Safety Policy
www.vishay.com
52
Rev. 1.0, 18-Aug-06
Surface Mount Assembly Instruction
Soldering Process
When assembling IrDC transceivers on a printed
circuit board (PCB), it is useful to have an understanding of the properties of the materials used during manufacturing.
While IrDC transceivers use semiconductor dice
and other constituents processed in the semiconductor industry, there are considerable differences
between transceivers and other semiconductor
devices. One of the most important differences is
the molding material that is used for its manufacture.
Packaging material used for transceivers must be
transparent to infrared radiation in order to emit and
receive optical signals. However, visible light might
disturb the proper performance of the transceiver
ASIC. A special dye is mixed into the encapsulant to
block visible light. This results in the transceiver
appearing black. The need for good optical performance requires the use of pure resin. No other
ingredients can be added.
The encapsulant used for standard integrated
circuits (IC), however, is a mixture of resin
(typically 30 %) and other ingredients (e.g. nearly
70% silica sand). This mixture results in more uniform mechanical properties of semiconductor die,
leadframe and encapsulant.
Figure 1 and figure 2 show the difference between
filled and unfilled epoxy resin.
The following table 1 shows the main differences
between the two types of mold compound
18052 1
Figure 1. IC molding compound (30 % resin)
18053_1
Figure 2. Clear molding compound (100 % resin)
Table 1
Characteristics
Optical Properties
IC Mold Compound
IrDC Mold Compound
Light Blocking
Transparent
High
Low (brittle)
Hardness
Coefficient of thermal expansion
Glass transition temperature
Low (matched to leadframe & die)
High
High (160 °C)
Low (120 °C to 140 °C)
Thermal conductivity
High
Low
Moisture ingress
Low
High
A standard molded integrated circuit will have its
constituents nicely matched to each other in terms
of thermal expansion. The typical IC package
Rev. 1.3, 20-Sep-06
is rather free of mechanical stress compared
to an IrDC transceiver, which experience more
mechanical stresses during manufacturing.
www.vishay.com
53
Moisture Sensitivity
The high rate of moisture ingress is another property
of the optical clear molding compound. The
saturation value for room temperature of moisture
intake is roughly a factor of ten larger than for filled
molding compound. Due to this high rate of
moisture ingress transceivers are more prone to the
"popcorn effect".
Any possible void (delamination, bubble) inside the
package will be filled very quickly with moisture.
Even the whole package can soak up a considerable amount of moisture. Whenever the package is
heated up above the boiling point of water, a very
high vapor pressure builds up inside the voids. This
pressure can cause the package to crack or creates
severe delamination.
The amount of moisture absorbed by the package
is determined by the exposure time to humid air.
The exposure time allowed for a particular package
is defined by a moisture sensitivity level (MSL)
according to JEDEC standards J-STD-020 and
JESD22-A113.
Vishay transceivers are designed to withstand three
subsequent passes through a reflow soldering oven
using our recommended reflow temperature-time
profile when the package has been exposed not
longer than 72 hours to environmental conditions of
d 30 °C/60 % RH. This correlates to MSL 4.
The parts will be delivered in a moisture barrier bag
containing desiccant and a humidity indicator card.
As long as the parts are stored in the sealed bag,
the performance will not degrade. As soon as the
bag is opened, the material should be consumed
within 72 hours or must be stored in a dry place
(chamber which is purged with a dry gas like air or
nitrogen) or baked according to the sticker on the
reel.
Reflow Soldering
Vishay Semiconductor transceivers are surface
mount devices and are designed to be assembled to
printed circuit boards (PCB) using reflow soldering.
State of the art for reflow soldering is the use of a
so-called convection reflow oven.
Recommendations for reflow conditions can only be
given in general terms since each PCB should be
considered individually depending on the size and
distribution of components. Because IrDA transceivwww.vishay.com
54
ers are more sensitive to thermal stress than most
other components, it is recommended that these be
used to determine the optimum soldering conditions. If the subsequent recommendations are followed excellent results can be achieved despite the
limitations of the materials used.
Reflow Solder Profile
There are two distinct tasks for the temperature-time
profile of the solder process:
• Prepare the components for the stress at the soldering temperature.
• Solder the components to the PCB.
The main idea behind this pre-soldering preparation
(neglecting the solder paste activation and the like)
is to have a very small temperature difference
between all components. This allows for a low peak
temperature and damage free soldering.
There are two different profile types used in industry
nowadays. The most often used type in the past and
still today is the ramp-soak-spike profile (RSS).
The convection oven allows for a ramp-to-spike
profile (RTS), and the application of this type is
increasing.
A solder profile consists roughly of three distinct
phases.
• Pre-heating or Soak Phase: For standard components, this is the phase where all parts should
come roughly to the same temperature. This is
achieved either by keeping the PCB for a certain
time at a specific temperature (RSS) or ramp-up
the temperature at a certain speed (RTS) to have
all parts at all times of the profile at the same
temperature.
• Soldering: During this phase, the actual soldering takes place. We recommend not to exceed
260 °C peak temperature and the device should
not be exposed to higher temperatures than
255 °C for more than 30 s (TFDUxxxx) or 20 s
(TFBSxxxx) depending on the type of transceiver
• Cool Down: The PCB should be cooled down
rather quickly to have a fine grain solder joint.
As outlined previously a transceiver package has
built-in mechanical stress, which should be reduced
before submitting the part to the actual solder temperature. This stress is relieved during the soak
phase.
Rev. 1.3, 20-Sep-06
Depending on the encapsulant material used for
packaging, the best soak temperature is in the
range of 140 °C to 160 °C and the time interval is
120 s to 180 s. As a rule of thumb, the temperature
should be slightly above the glass transition
temperature and the dwell time must be long
enough to allow for stress relief. This is most
conveniently realized with an RSS profile.
For RTS profiles, the low thermal conductivity
compared to standard components should be
considered. To get the transceiver into thermal
equilibrium with the PCB and allow for internal
stress relief the thermal ramp-up rate normally must
be lower than for standard components.
Vishay Semiconductor recommended
RSS Profile
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab
use. However, for a production process it cannot be
recommended because the risk of damage is quite
highly depending on the experience of the operator.
Nevertheless, we added a chapter, describing manual soldering and desoldering. Before soldering or
desoldering be sure that the devices (or boards) are
correctly dried corresponding to given MSL-condition. See the equivalent standard JEDEC J-STD033A, "Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices".
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4 if not otherwise specified in the data
sheet.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
275
T ≥ 255 °C for 10 s....30 s
250
225
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
Temperature/°C
200
175
150
30 s max.
125
90 s...120 s
100
70 s max.
2 °C...4 °C/s
75
2 °C...3 °C/s
50
Pick & Place
25
0
0
50
100
150
200
250
300
350
Time/s
19693
Vishay Semiconductor recommended
RTS Profile
280
Tpeak = 260 °C max.
260
240
220
Temperature/°C
< 4 °C/s
160
1.3 °C/s
140
120
Due to the non-symmetric package - very common
for opto-electronic parts - the pick-up position can
not be expected in any case at the center of the
package.
The best pick-up location is indicated in the data
sheet drawings as "mounting center". It coincides
with the center of the hole in the pocket of the carrier
tape.
200
180
For reliable pick and place operation an adequate
flat area on the topside of the module is important.
Vishay Semiconductors always design transceivers
to have a flat surface on the topside for pick and
place.
Time above 217 °C t ≤ 70 s
<2 °C/s
Peak temperature Tpeak = 260 °C
100
80
60
40
20
0
0
50
100
19694
Rev. 1.3, 20-Sep-06
150
200
250
300
Time/s
www.vishay.com
55
Manual Soldering
Although IrDC transceivers are surface mount
components and therefore designed for reflow
soldering, it is possible to solder these manually
using soldering irons. Be sure that the devices are
correctly dried corresponding to the MSL4 conditions. Based on long-standing experience of some
of Vishay Semiconductors customers the following
rules should be observed:
• Use standard Pb-Sn or Sn solder
• Use a high power (at least 25 W) temperature
controlled soldering iron
• Soldering iron temperature 345 °C ± 5 °C
• Soldering time 1 second maximum per lead
• Avoid any mechanical stress to the leads during
soldering or cool down
18272
18270
Step 1:
Start with one pad only and get some solder on it.
18271
Step 2:
Place the transceiver at its appropriate position
www.vishay.com
56
Step 3:
Solder the lead to lead pad prepared in step 1
18273
Step 4:
Solder quickly and skillfully the remaining leads
Rev. 1.3, 20-Sep-06
Desoldering
Hot air method
If it is necessary to remove a transceiver from a PCB
for replacement or investigation without damage the
same constraints apply as for soldering. Excessive
heat or mechanical strain (e.g. usage of pliers) could
result in cracks or damaged wire bonds. Bake the
whole board according to MSL4 before removing
the part to avoid moisture effects. Vishay recommends two procedures which have been found to
give the most consistent results:
• Nozzle temperature 400 °C ± 10 °C
• Lead temperature (nozzle 5 cm from the device)
270 °C ± 10 °C
• Hold device with long tweezers
• Apply air at an angle of 45° to the lead moving
the nozzle to heat all of the leads or apply the
heat from the back side when no components
are mounted on the back under the transceiver
• When the solder melts (< 4 s) push gently or lift
device to lift off the leads
It is important that as little mechanical force as
possible is applied to the leads when the package
is hot and softened by the heat. Any excessive force
can tear off the leads causing internal damage to
the wire bonds.
Soldering iron method
• Use a high thermal capacity soldering iron
(> 25 W) at 360 °C ± 10 °C
• Use a solder iron with a very broad tip
• Hold device with long nose tweezers
• Heat leads
• Do not apply force until the solder melts
• Push the unit away without force
18274
Use a broad tip for desoldering with a solder iron
18276
When the solder is completely molten (< 2 s)
push the transceiver gently off the solder pads
on the PCB
18275
Apply heat uniformly to the whole set of leads
Rev. 1.3, 20-Sep-06
www.vishay.com
57
Window Size in Housings
In Figure 1 and 2, the minimum window size in relation to the distance between the window and the
transceiver is described.
Generally speaking, a 10 % transmission loss should
be accounted for in the design calculations so that
output power and input sensitivity requirements are
met for the system design. The external filter should
be placed squarely against the transceiver otherwise
reflection may cause emitter power loss or a decrease
in receiver sensitivity in the system.
Optically transparent window materials are available
from different sources, e.g. Bayer, GE, Rohm & Haas
(see “Source for Accessories”).
The optical window must be a minimum size of
d1 x d2 rectangular or elliptical so as not to reduce
the IrDA performance.
The following expressions apply to figures 1 to 4.
d1 = w + 2x = w + 0.54a
d2 = h + 2x = h + 0.54a
where x = a tan 15q
Dimensions of d1, d2, and a are given in mm.
The dimensions for w and h for the different packages
are as follows:
Device
Package Type
w
(mm)
h
(mm)
Baby Face (TFDUx1xx) family
9.7
4.0
2.5 mm family (as TFDUx3xx)
8.5
2.5
1.9 mm family (as TFBSx7xx)
6.2
2.0
1.6 mm family (as TFBSx6xx)
7.0
1.7
Micro Face (as TFDUx2xx)
5.7
2.7
Window
15 °
x
a
h
d2
x
15 °
18062-1
Figure 2. View from the side, example Baby Face package
15 °
w
15 °
Window
a
d1
x
x
18063-1
Figure 3. View from above, example Micro Face package
Window
15 °
w
15 °
15 °
x
Window
a
h
d2
x
d1
x
a
x
18061-1
15 °
18064-1
Figure 1. View from above, example Baby Face package
www.vishay.com
58
Figure 4. View from the side, example Micro Face package
Rev. 1.4, 09-Sep-05
Some recommendations to enhance robustness of
your design:
• Do not make the window larger than needed, otherwise you will unnecessarily increase the influence of ambient (sun) light.
• The larger the distance a, the better the shielding
against the ambient light.
• The outer window surface may be recessed
against the surrounding case material to protect
the window from scratches, abrasion, dust, etc.
Recessed window
avoiding scratches
Recessed transceiver
is recommended to
shield against ambient
(sun)light
±15°
Avoid vignettation but
limit the reception angle
15809
Figure 5.
?
?
15 810
Figure 6. Avoid an unintentional lens effect of your window
Rev. 1.4, 09-Sep-05
www.vishay.com
59
Sources for Accessories and Testing
Sources for Accessories
IrDA Related References
Infrared Data Association
IrDA
P. O. Box 3883
2855 Mitchell Drive, Suite 107
Walnut Creek, CA 94598
Phone: +1 925 943-6546
Fax: +1 925 943-5600
Email: [email protected]
http://www.irda.org
Software
Microsoft Corporation
IrDA is supported by Windows 95®‚ Windows 98®,
Windows NT®, Win CE®Windows 2000®,
Windows XP®and Palm PC®platforms.
IrDA device drivers are either already included in the
software package or can be downloaded from the
Microsoft website.
One Microsoft Way, 5/2153
Redmond, WA 98052–6399, USA
http://www.microsoft.com
www.vishay.com
60
ACTiSYS
ACTiSYS Corp has been a leading supplier of Infrared wireless IrDA and ASK–IR protocol software and
adapters for 115.2 kbit/s and 4 Mbit/s since 1990.
ACTiSYS also provides test software and hardware
for IRDA compatibility testing.
ACTiSYS
48511 Warm Springs Blvd., Suite #206
Fremont, CA 94539
USA
Phone: +1 510-490-8024
http://www.actisys.com
Laplink Software
Laplink Software Inc.
10210 NE Points Drive, Suite 400
Kirkland, WA 98033, USA
Phone: +1 425 952-6000
Fax: +1 425 952-6002
http://www.travsoft.com/
Rev. 1.5, 20-Sep-06
Plastics
Korea
In our products we use polycarbonate (PC) and polymethylmethacrylate (PMMA) for optical window and
as filter material. Therefore we recommend these
materials and list some sources.
www.bayer.co.kr
Polycarbonate (PC)
PC is available under many different trade names and
supplied by many manufacturers and distributors. A
comprehensive list can be found at
http://www.matweb.com/reference/polycarbonate
mfr.asp
Some product names of PC material
Product
Calibre
Durolon
Enduran
Jupilon
Lexan
Lupoy
Makrolon
Wonderlite
Manufacturer
DOW
Policarbonatos do Brasil
GE
Mitsubishi
GE
LG Chemical
Bayer
Chi Mei
Some manufacturers are listed below. Contact them
for local distributors.
Bayer "Makrolon®"
http://www.plastics.bayer.com
USA
Bayer MaterialScience LLC
Pittsburgh, Pennsylvania
100 Bayer Road
Pittsburgh, PA 15205-9741
www.BayerMaterialScienceNAFTA.com
Phone: 800-662-2927
Phone: +1 (412) 777-2000
Fax: +1 (412) 777-3899
The Dow Chemical Company
www.dow.com
(see Calibre polycarbonate resins)
General Electric Plastics "Lexan®"
EUROPE
GE Plastics B.V.
Plasticslann 1
Bergen op Zoom
4612PX
Netherlands
Phone: +31 164-292911
http://www.geplastics.com
Germany
GE Plastics GmbH
Eisenstrasse 5
65428 Rüsselsheim
Postfach 1362-65402
Phone: +49 6142 6010
USA
GE Plastics
Technology Centre
1 Plastics Avenue
Pittsfield / MA 01201
Phone: +1 413 448-5800
Fax: +1 413 448-7493
GERMANY
Bayer MaterialScience AG
RSC EMEA
Leverkusen, Deutschland
www.bayerplastics.com
Rev. 1.5, 20-Sep-06
www.vishay.com
61
PMMA (Polymethylmethacrylate)
PMMA is available under many different trade names
and supplied by many manufacturers and distributors.
Some product names of PMMA material
Product
Acrylite
Acryrex
Acrystex
Altuglas
Degalan
Diakon
Oroglas/Altuglas
Plexiglas
Manufacturer
Cyro
Chi Mei
Chi Mei
Atoglas
Degussa-Röhm
Lucite
Arkema (Atoglas)
Degussa-Röhm
Some manufacturers are listed below. Contact them
for local distributors.
Altuglas
Based on the history of Rohm & Haas, formerly
known as Atoglas and Arkema
www.plexiglas.com
www.altuglas.com
www.altumax.com
USA
Altuglas International
www.plexiglas.com/altuglas/plex2.cfm
Altuglas International c/o Arkema
2000 Market Street
Philadelphia PA 19103
Phone: +1 215 419-7000
Fax: +1 215 419-7591
Chi Mei Corporation
No. 59-1, San Chia, Jen Te, Tainan County,
Taiwan 71702
Phone: +886-6-2663000.2665000 Ext. 1372
Fax: +886-6-2665555~7
[email protected]
Lucite
www.lucite.com
www.vishay.com
62
Cyro Industries
Cyro is the North American arm of the Röhm/Degussa
group
Technical Service
Orange, Conn. 06477
Phone: +1 203 799-4066
www.cyro.com
For Europe see
www.degussa.com
Polycast Technology Corporation
70 Carlisle PI Ste 1
Stamford, CT 06902-7630
Phone: +1 203 327 6010
Distributors (USA)
Calsak Corporation
200 W. Artesia Blvd.
Compton, CA 90220
Phone: (800) 743-2595
+1 310 637-2000
Fax: +1 310 637-3696
E-mail: [email protected]
www.calsakpolymers.com
Plastic Sales Incorporated
849 W. 18th St.
Costa Mesa, Calif. 92627
Phone: +1 714 645-6860
Regal Plastics
Southern Region
2356 Merrell Road
Dallas, TX 75229
Phone: +1 972 484-0741 or (800) 441-1553
Fax: +1 972 484-0746
Specialty Manufacturing Inc.
6790 Nancy Ridge Dr.
San Diego, CA 92121-2230
Phone: +1 858 450-1591
Phone: 800 491-1652
Fax: +1 858 450-0400
Rev. 1.5, 20-Sep-06
Interface Circuits
National Semiconductor Corporation
National Semiconductor Corporation, a Fortune 500
company headquartered in Santa Clara, California,
develops and manufactures semiconductor products
for high growth markets in the electronics equipment
industry. Their Super I/O ICs provide IrDA encoding/
decoding function as well as single chip solutions for
floppy disk control, keyboard control, dual UARTs,
parallel port and IDE interface.
World Headquarters
2900 Semiconductor Dr.
P. O. Box 58090
Santa Clara, California
USA 95052–8090
Phone: +1 408 721–5000
http://www.national.com
Standard Microsystems Corporation (SMSC)
Standard Microsystems Corporation (SMSC) is a
worldwide supplier of MOS/VLSI integrated circuits
(ICs) for the personal computer industry. SMSC has a
leading position in input/output (I/O) circuits for PCs
with over 80 million units shipped and, additionally,
supplies ICs for local area networks and embedded
control systems.
Standard Microsystems Corporation
80 Arkay Drive
P.O. Box 18047
Hauppauge, New York 11788–8847
Toll Free: 800–443–SEMI (7364) –
USA and Canada Only
Phone: +1 631 435–6000
Email: [email protected]
http://www.smsc.com
SigmaTel, Inc.
European Headquarters
Livry-Gargan-Str. 10
82256 Fürstenfeldbruck
Germany
+49 (0) 81 41 35-0
[email protected]
Deutsch: +49 (0) 69 9508 6208
English: +44 (0) 870 240 21 71
Francais: +33 (0) 141 91 87 90
Rev. 1.5, 20-Sep-06
SigmaTel Worldwide Headquarters
Sigma Tel, Inc.
1601 S. Mo Pac Expressway, Suite 100
Austin, TX 78746
Phone: +1 512-381-3700
Fax: +1 512-744-1700
[email protected]
http://www.sigmatel.com
SigmaTel Asia, Limited
Unit 3613-14, 36/F, Tower 6
The Gateway, Harbour City
9 Canton Road
Tsimshatsui, Kowloon
Hong Kong
Phone: +852-2175 5225
Fax: +852-2175 5050
[email protected]
www.vishay.com
63
Microprocessors
AMD
AMD is a global supplier of integrated circuits (ICs) for
the personal and network computer and communications markets. The company produces processors for
Microsoft® Windows® compatible PCs, flash memories, products for communications and networking
applications. AMD's Elan family of 32-bit micro controllers provides support for IrDA along with other features for mobile computing applications.
AMD
One AMD Place
P. O. Box 3453
Sunnyvale, CA 94088–3453, USA
Phone: +1 408 749–4000
www.amd.com
Hitachi Semiconductor America
The 32-bit SuperH RISC engine series is the high end
of Hitachi’s micro controller and microprocessor product lines. This advanced product family provides a
solid roadmap for meeting embedded controller and
microprocessor requirements with the most efficient
solutions for emerging applications.
www.hitachi.com
Hitachi Semiconductor America
2000 Sierra Point Parkway
Brisbane, CA 94005, USA
Phone: +1 800 285–1601
Motorola
Motorola manufactures a wide variety of microprocessors suitable for embedded and hosted applications
that contain built–in support for IrDA. Many of their
microprocessors can be connected to industry typical
IrDA transceivers directly, without any interface support electronics. In support of the processors, Motorola provides IrDA software implementing the full IrDA
stack.
Motorola
6501 William Cannon Drive West
Austin, Texas 78735, USA
http://www.mot.com
Philips Semiconductors
Philips Semiconductors provides the TwoChipPICTM
and TwoChipPIC PlusTM, dual 32-bit enhanced
MIPS RISC chipsets which provide integrated solutions for Personal Digital Assistants (PDAs), Personal
Intelligent Communicators (PICs), and Handheld PCs
(H/PCs) for Windows®‚CETM.
www.philips.com
www.vishay.com
64
Rev. 1.5, 20-Sep-06
Test Houses - Interoperability Testing
IrDA Test Labs (from IrDA-website www.irda.org)
The function of these Test Labs is to provide an independent assessment of the interoperability of an IrDA
product. In addition, Test Labs may also provide services and consulting to resolve design problems
when they occur. It is up to each Test Lab to set their
fees for the services provided.
The primary responsibility of Test Labs is:
• To provide testing services to assure IrDA interoperability and compliance.
• To perform the Interop tests and if authorized perform full compliance tests necessary to verify reference products.
• To present the Qualified Product certificate to
products that pass the tests as defined by IrDA.
• Report successful products to the IrDA office for
registration.
In providing the IrDA Interop testing services, Test
Lab ensures that:
• The tests, procedures and processes conducted
are the most up to date as defined by IrDA and that
they are an advocate for the enduser in conducting
the tests.
• IrDA policies and procedures are complied with.
• Tools and equipment are available for conducting
the tests.
• Other services may also be provided related to
IrDA such as consulting and troublesshooting.
This is the independent decision of the individual
Test Lab.
Independent Test Lab Locations that can assist in the
validation of product qualification are:
ICT Korea, Co., Ltd.
5F Bogwang Bldg., 249-14 Yangjae-2Dong,
Seocho-Gu,
Seoul, Korea
Web: www.ictk.co.kr
Contact: Mr. Kwanhoon Lee, Researcher & Overseas
Management at [email protected]
Testing Type: IrFM
Waseda University Test Lab
Tokyo, 160-0074, Japan
Tel: 81-3-5286-3114
Contact: Mitsuji Matsumoto at
[email protected]
Testing Type: IrReady
Rev. 1.5, 20-Sep-06
ACTiSYS Corp.
48511 Warm Springs Blvd., Suite 206,
Fremont, CA 94539, USA
Tel: (510)490-8024
Fax: (510)623-7268
www.actisys.com
Contact: Dr. Keming Yeh at [email protected]
ACTiSYS (Asia) Corp.
3rd Floor, #12, Prosperity 2nd Rd.,
Science Park, Hsin-Chu City, Taiwan
Tel: +886-3-578-5161
Fax: +886-3-578-5164
Contact:
Lawrence Yang at [email protected]
Couleur Communication Ecriture CCE, France
Immeuble Grenat,
3 av. Doyen Louis Weil,
38000 Grenoble, France
Tel: +33 4 76 48 86 30
Fax: +33 4 76 96 41 79
Web: www.affixcce.com
Contact:
Mr. Serge Veyres, Director at [email protected]
OPEN INTERFACE, INC.
2-15-12 Shinyokohama Kouhoku-ku,
Yokohama-city,
Kanagawa, 222-0033 Japan
Tel: +81-45-476-3900
Fax: +81-45-476-3689
Web: www.oii.co.jp
Contact:
Mr.Tatsuo Iwasaki,
Director of Technical Dept. 1 at [email protected]
Ms.Kayoko Yamanashi,
Groupe Manager of IrDA
Groupe Testing Solution Center at
[email protected]
Testing Type: IrReady, IrFM
www.vishay.com
65
Ambient Light and Electromagnetic Interference
IrDA specifies normative tests, with specific ambient conditions, under which IrDA applications
must be able to operate within the IrDA specifications.
These normative conditions are part of the physical layer specification IrPHY 1.4, Appendix A.
In the following these four essential requirements
are quoted from the original standard:
Background Light and Electromagnetic Field
There are four ambient interference conditions in
which the receiver is to operate correctly. The conditions are to be applied separately.
1. Electromagnetic field:
3 V/m maximum Refer to IEC 61000-4-3 test
level 2 for details. (For devices that intend to
connect with or operate in the vicinity of a
mobile phone or pager, a field of 30 V/m with
frequency ranges from 800 MHz to 960 MHz
and 1.4 GHz to 2.0 GHz including 80% amplitude modulation with a 1 kHz sine wave is recommended. Refer to IEC 61000-4-3 test level 4
for details.
The 30 V/m condition is a recommendation;
3 V/m is the normative condition.)
2. Sunlight:
10 kilolux maximum at the optical port This is
simulated with an IR source having a peak
wavelength within the range 850 nm to 900 nm
and a spectral width less than 50 nm biased to
provide 490 μW/cm2 (with no modulation) at
the optical port. The light source faces the optical port. This simulates sunlight within the IrDA
spectral range. The effect of longer wavelength
radiation is covered by the incandescent condition.
3. Incandescent Lighting:
1000 lux maximum This is produced with general service, tungsten-filament, gas-filled,
inside-frosted lamps in the 60 Watt to 150 Watt
range to generate 1000 lux over the horizontal
surface on which the equipment under test
rests. The light sources are above the test
area. The source is expected to have a filament
temperature in the 2700 to 3050 degrees
Kelvin range and a spectral peak in the 850 nm
to 1050 nm range.
4. Fluorescent Lighting :
1000 lux maximum This is simulated with an IR
source having a peak wavelength within the
range 850 nm to 900 nm and a spectral width
www.vishay.com
66
of less than 50 nm biased and modulated to
provide an optical square wave signal
(0 μW/cm2 minimum and 0.3 μW/cm2 peak
amplitude with 10 % to 90 % rise and fall times
less than or equal to 100 ns) over the horizontal
surface on which the equipment under test
rests. The light sources are above the test
area. The frequency of the optical signal is
swept over the frequency range from 20 kHz to
200 kHz. Due to the variety of fluorescent
lamps and the range of IR emissions, this condition is not expected to cover all circumstances. It will provide a common floor for IrDA
operation.
Electromagnetic Interference (EMI)
Standards
The IrDA EMI specification is similar to the conditions
specified by the standard conditions used for European "CE" certification. The standards to be taken
into account are specified as IEC standards or equivalent EN standards
IEC/EN 61000-4-3: "Electromagnetic compatibility
(EMC) - Part 4: Testing and measurement techniques - Section 3: Radiated, radio-frequency, electromagnetic field immunity test".
IrDA doesn’t specify the immunity to conducted disturbances. However, this is also necessary for CE
certification for the final product. See for that:
IEC/EN 61000-4-6: "Electromagnetic compatibility
(EMC) - Part 4: Testing and measurement techniques - Section 6: Immunity to conducted disturbances, induced by radio-frequency fields".
For mobile phone applications the conditions are
listed in
ETSI EN 301 489-1
Electromagnetic compatibility
and Radio spectrum Matters (ERM);
ElectroMagnetic Compatibility (EMC)
standard for radio equipment and services;
Part 1: Common technical requirements
ETSI EN 301 489-7
ElectroMagnetic compatibility and Radio spectrum
Matters (ERM);
ElectroMagnetic Compatibility (EMC) standard for
radio equipment and services;
Part 7: Specific conditions for mobile and portable
radio and ancillary equipment of digital cellular radio
telecommunications systems (GSM and DCS)
Rev. 1.4, 20-Sep-06
Testing
The Vishay Semiconductors transceivers for IrDA
applications are tested according the standards in the
frequency range of 15 kHz (the standard starts at
150 kHz) to 80 MHz and for mobile phone frequencies in the extended range of 700 MHz to 2100 MHz
covering the 800 MHz, 900 MHz, 1800 MHz, and
1900 MHz mobile phone applications. The test capabilities also include frequencies up to 3000 MHz to
cover the 2400 MHz band.
In the frequency range of 700 MHz to 3000 MHz a
GTEM 250 Cell with a field strength test capability of
up to 500 Vrms/m is used. This RF signal is AM modulated by 217 Hz, 80 % modulation depth, GSM
equivalent burst duration of 550 μs.
Another tool available for testing is DPI (direct power
injection).
In the lower frequencies (15 kHz to 80 MHz) strip line
boxes are used with a maximum applied field of about
80 Vrms/m. The RF signal is AM modulated by 1 kHz,
80 % modulation depth.
In both ranges the transceivers are tested for the
specified Bit Error Ratio (BER).
The IrDA specified field strengths are sufficient for
normal applications. However, when transceivers are
operated close to an antenna, much higher field
strengths may occur.
An electromagnetic compatibility (EMC) of 30 V/m is
not sufficient when the transceiver is built into a
mobile phone close to an antenna. Experience shows
that a minimum of 100 V/m is necessary in the case
when pick-up in the wired circuit is avoided.
Board – Layout and EMI
In most of the GSM Applications - EMI is not caused
by the transceivers. At these frequencies very strong
(and resonant) coupling to the wiring from and to the
transceiver can occur. Therefore all connecting lines
should be sandwiched between grounded layers and
these lines should be handled like strip lines and terminated. Transceiver inputs/ outputs detect the RF
signal when the signal voltage is above the threshold.
In 3 V applications, using DPI test method, it was verified that applied GSM signals with RF voltages of
more than 1.5 V trigger the input. Therefore it has to
be pointed out, that a suitable circuit layout and correct termination of lines is the major issue when discussing the EMI behavior of transceivers. The design
goal for the transceiver itself (when used in mobile
phones) is to withstand field strength of 300 V/m when
terminated lines are used and no RF signals above
the threshold are applied.
Rev. 1.4, 20-Sep-06
The internal shielding mechanism in the transceivers
is efficient and additional metal EMI shields are not
necessary. Additional metal shielding has no or even
worse effect on the EMI behavior.
Interference with Optical Light (Radiation) Sources
Unmodulated sources of optical radiation are e.g.
sunlight and incandescent lamps. The spectra of both
are different, therefore the eye sensitivity related visible impression of a source (measured e.g. in lux or
lumen per Watt) is quite different, also in the case
when the optically generated detector current (A) in a
Si-detector might be the same. The Silicon detector
absorption characteristic defining the detector sensitivity is very different from the human eye. The invisible infrared part of the radiation of incandescant light
is much larger compared to sunlight and more efficiently detected. Therefore the incandescent lamp is
a more disturbing source for a Silicon receiver than
sunlight, same illuminance assumed.
Such unmodulated sources generate a background
current in the photo detector, which generates noise,
and offsets and displacements of the operating conditions. Vishay typically specifies and test designs for
higher values than given by the standard.
Vishay is testing with vertical incidence on the optical
axis, a condition much worse than the IrDA given condition with irradiating the optical test setup from the
ceiling.
Fluorescent Lighting
Fluorescent Lamps and especially Compact Fluorescent Lamps operated with electronic ballasts generate a quite strong infrared radiation modulated with a
wide electrical spectrum. The IrDA specified value of
3 mW/m2 reflects the worst-case irradiance in about a
meter distance of a fluorescent lamp. In this case also
Vishay is testing with vertical incidence on the optical
axis, a condition much worse than the IrDA given condition with irradiating the optical test setup from the
ceiling. The majority of the Vishay Semiconductors
transceivers are specified with a no-output level of
4 mW/m2, an additional safety margin vs. the IrDA
specified value.
www.vishay.com
67
Eye Safety of Diode Emitters
Eye Safety of Diode Emitters
Since 1993, the International Electrotechnical Committee (IEC) and the European Committee for Electrotechnical Standardization (CENELEC, officially
recognized as the European Standards Organization
in its field by the Commission in Directive 83/189/EEC)
have included Diode Emitters1) such as IREDs2) and
LEDs3) in the laser safety standard. LEDs and lasers
are technologically similar. However, the different
radiance of LEDs compared to lasers was not taken
into account. This resulted in LEDs being incorrectly
assessed concerning eye safety. In the 1997 edition of
the standard EN 60825-1 (and the IEC equivalent IEC
60825-1) the basic assessment errors were corrected.
The standard was further revised in January 2001.
Amendment 2 was added (IEC60825-1 Amd. 2
Ed. 1.0) and is available at www.iec.ch. Based on the
parallel voting process, this standard is also effective
as a CENELEC document, EN60825-1 Amendment 2.
Amendment 2 allows for a large increase in exposure
limits, especially for the extended sources such
as conventional LEDs and IREDs. The standard
describes the Maximum Possible Exposure (MPE)
and the Accessible Emission Levels (AEL) for the
human eye and skin. The safe emission level is
dependent on exposure time, wavelength, virtual
source size and other parameters. For extended
sources like LEDs, the apparent or virtual source size
is the most important parameter in assessing risk and
shall be specified in the component manufacturer's
data sheet. Given the revised exposure limits, under
normal operating conditions the MPE and AEL values
are difficult to exceed when using conventional LEDs.
Also, recognizing the low risk emissions of these
sources, Amendment 2 eliminated the single fault
condition for standard LEDs.
Worldwide, no eye damage by LEDs has ever been
reported. Diode Emitters efficiency is still increasing.
Especially at the shorter wavelengths, a risk due to
blue light effects, called blue light hazard, may occur
and shall be considered.
By definition, Laser Class 1 devices are safe under all
reasonably foreseeable conditions.
All of Vishay's IrDA transceivers and LEDs are rated
as Class 1 devices when operated within specifications. The datasheet of each transceiver notes this
Class 1 rating. The following example justifies the
Class 1 rating. Given an LED transmitter emitting at
880 nm with a source size of 2 mm, the Class 1 limit
for continuous operation is approximately 570 mW/sr.
For an IrDA application using an FIR transceiver with
a 25 % duty cycle, this limit would allow the LED to
emit pulse intensities up to 2280 mW/sr. When operated within specifications, this high intensity will never
occur. First, the IrDA® Physical Layer limits emitter
intensities to 500 mW/sr. Second, IrDA transceivers
limit the pulse duration. Finally, if drive conditions are
set outside the specification, the thermal saturation of
the emitter will limit the output intensity.
Vishay's LEDs and IrDA transceivers are eye-safe.
For more information regarding LEDs see the ICNIRP
(International Commission on Non-Ionizing Radiation
Protection) statement "ICNIRP Statement on LightEmitting diodes (LEDs) and Laser Diodes: Implications for Hazard Assessment"4).
In the United States the safety standard IEC60825-1,
Amd. 2 is harmonized by the Food and Drug Administration's (FDA) Center for Devices and Radiological
Health (CDRH): "Laser Products - Conformance with
IEC60825-1, Am. 2 and IEC60601-2-22; Final Guidance for Industry and FDA (Laser Notice No. 50)5)",
issued July 26, 2001.
Recent studies in the United States support these
revisions; finding that eye damage can not be caused
by even the brightest of currently available LEDs.
1)
Diode Emitters: Semiconductor devices with diode characteristic emitting radiation such as LDs(laser diodes), IREDs or LEDs
IRED: Infrared Emitting Diode. It is common but not correct to use the term LED also for Infrared Emitting Diodes
LED: Light Emitting Diode, this term is used also for IR emitting diodes
4)
Copyright© 2000 Health Physics Society. Copies are available from the Internet at: http://www.icnirp.org/documents/led.pdf
5) Copies are available from the Internet at: http://www.fda.gov/cdrh/comp/guidance/1346.html
2)
3)
www.vishay.com
68
Rev. 1.3, 20-Sep-06
Remote Control with IrDA® Transceivers
Utilizing a Vishay IrDA Transceiver for Remote Control
Table of Contents
Remote Control with IrDA Transceivers .........................................................................................
70
Hardware - Interface Schematics .....................................................................................................
70
Transmit Distance...............................................................................................................................
71
Test Results.........................................................................................................................................
75
Expected Performance .......................................................................................................................
76
Remote Control Data Formats ...........................................................................................................
77
Application Examples.........................................................................................................................
78
Rev. 1.6, 20-Sep-06
www.vishay.com
69
Remote Control with IrDA Transceivers
An infrared remote control unit is used to control many
common consumer electronic products such as TV’s,
DVD players, VCR’s and CD players. When a button
is pressed on the remote control unit, a signal is sent
from the unit, and received for example by the TV.
The remote control unit contains an infrared emitting
diode (LED) that transmits the signal and the TV contains an infrared receiver that receives the signal. This
signal “commands” the TV to perform a function like
Power-On/Off, Sound-Up/Down, and Channel-Up/
Down. The signal contains the TV’s address and the
command code. Each function will have a different
command code. The signal is encoded and transmitted using a modulated carrier wave in the frequency
range of 30 kHz to 56 kHz.
There are many different coding systems used for
remote control. The most common codes are the
RC5®, RC6®, and RMM® codes from Philips and the
NEC code. Different products may use different coding systems. For example, your old TV remote control
unit may not work with your new TV because they use
different coding systems. For products using the
same coding system, each product will have a different address to avoid performing a command meant
for another product. Figure 1 in the Remote Control
Data Formats section provides an example of a
remote control signal using the Philips RC5 code
when the channel “3” is pressed. For more information about remote control codes, please refer to this
section and the document “Data Format for IR
Remote Control”.
Design engineers of handheld devices such as
mobile phones and PDAs are faced with the challenge of combining multiple functions in a single
device. Among the new features being integrated into
handheld devices is TV remote control. Most of these
devices feature a Vishay IrDA transceiver used for
short-distance wireless communication. The transceiver’s emitter can be used to transmit remote
control signals. This eliminates the need to designin an additional discrete LED emitter. At no additional
cost or board space, this is an excellent solution.
The remote control signal can be generated by software or by the combination of hardware (Baud Rate
Generator or Timer) and software. Remote control
applications generally include many of the available
coding systems. For handheld devices, it is best if the
application supports a “teach” function where the
handheld device learns the codes from the remote
control unit. The detector of the IrDA transceiver
receives the emitted signals to be stored in the handheld application.
www.vishay.com
70
”Teaching”
18802
Figure 1.
By integrating the remote control application with
voice recognition, PDA and mobile phone manufacturers can offer their customers a very attractive capability: while in the process of answering a call, the user
can simply say “Mute” to mute the TV. Convert the
spoken word into an infrared remote control signal.
Hardware - Interface Schematics
The same hardware interface can be used for
Vishay’s IrDA transceivers whether used for IrDA
communication or remote control. No additional components are required for remote control. The following
is a general interface block diagram for IrDA and
remote control (RC) using Vishay’s new generation
transceivers (figure 2).
There are two output signals (IRTXD and SD/Mode)
from the controller and one input signal to it. To use
the same output line IRTXD of a controller for both
IrDA and RC, the IrDA TXD port should be a multifunction port, which supports also GPIO (General
Purpose Output) and UART (asynchronous serial
data Transmit, in case using its Baud Rate Generator), and its functions can be alternated by software.
To use the same input line IRRXD of a controller for
both IrDA and RC “Teaching/Learning” function, the
IrDA RXD port should be a multifunction port, which
supports also GPIO (General Purpose Input), and its
functions can be alternated by software.
If the IrDA port does not support UART or GPIO one
has to find another port and an extra multiplexer to do
the RC.
Rev. 1.6, 20-Sep-06
The circuit diagram in figure 2 shows additionally to
the connections for the logic the little external circuit
to be added for filtering the supply voltage (low-pass
R1, C) and a resistor R2 for limiting the LED drive current. The resistor R2 is only necessary when the
transceiver has no internal current control or the current should be reduced to a level lower than the internally controlled current.
Also when operated with a supply voltage Vcc > 4 V
the resistor R2 may be necessary when the application is operated close to the maximum temperature
limits. "Transceiver" stands here for e.g. TFDU4300
(SIR, 115.2 kbit/s) or TFBS6614 (FIR, 4 Mbit/s). For
these the pin numbers are valid.
VCC = 3.3 V
R2 = 2.7
(optional)
Vcc
Transceiver
LEDA (1)
LEDC (2)
IRTXD/UART/GPIO
TXD (3)
IRRXD/GPIO
RXD (4)
GPIO[X]
SD (5)
Vcc (6)
R1 = 22
GND
C = 200 nF
Transmit Distance
Factors Influencing Transmit Distance
This section provides a detailed description of factors
influencing transmit distance:
• Wavelength of emitter and detector
• Optical intensity of the emitter
• Receiver Sensitivity
• Frequency of the emitter and detector.
Operating Range
The primary factors in the theoretical distance calculation are radiant intensity of the emitter (Ie in mW/sr)
and sensitivity of the receiver (given as minimum or
threshold irradiance Eemin in mW/m²). Calculating
transmission distance in the simplest case assumes a
square-law relationship between distance d and irradiance Eemin on the receiver. Shown below is the calculation using a receiver sensitivity of
Eemin = 0.4 m W/m2 and an intensity of Ie = 40 mW/sr.
The distance d is resulting as
Vlogic (7)
GND (8)
d =
18803
Figure 2. General Interfacing Block Diagram for IrDA and RC
Pin Function Description:
IRRXD/GPIO: IrDA and RC data input
RTXD2/UART/GPIO: IrDA and RC data output
GPIO[x]: the available General Purpose pin, used for SD
and Bandwidth Select
In case when only an external RC port is available
that can be used to independently switch the LED (or
more precise IRED as indicated).
Figure 3. General Interfacing Block Diagram for IrDA® and RC
using an n-channel FET when only a separate RC port is
available.
In the chapter "Application Examples" samples with
the interfacing circuit diagrams of the three most common used microcontrollers are shown, which have the
IrDA port built-in and the port supports both UART
and GPIO.
Rev. 1.6, 20-Sep-06
Intensity
--------------------------- =
Sensitivity
Ie
-------------- =
E emin
40
-------- = 10 m
0.4
Transmission distance increases as the intensity
increases and as the receiver becomes more sensitive.
Wavelength
Standard infrared remote control uses a wavelength
of 900 nm to 950 nm and a subcarrier frequency of
33 kHz to 40 kHz (IEC61603-1). Some manufacturers
use a subcarrier frequency range from 30 kHz to
56 kHz. After the use of these wavelengths became
standard, the still more efficient and much faster
850 nm to 900 nm emitters became available. These
emitters are used in IrDA applications. Vishay further
limits the peak wavelength used in its IrDA transceivers to 880 nm to 900 nm with a typical value of
886 nm.
The main difference between an LED used exclusively for remote control and an IrDA LED is the emitted wavelength. The wavelength of Vishay’s IrDA
LED is t 880 nm while the wavelength of a typical
remote control LED is 940 nm.
For longer transmit distances, the spectral distribution
of an emitting LED should match the remote control
receiver spectral sensitivity. Vishay’s IrDA transceivers are effective for remote control because the
remote control receiver is sensitive to the wavelength
emitted by the transceiver. Figure 4 shows that
Vishay’s IrDA (886 nm) LED emits a wavelength long
enough to be received by the remote control receivwww.vishay.com
71
meaning there is an 11 % range loss when using an
886-nm emitter instead of a 950-nm emitter.
Normalized Spectral Emission or Sensitivity
ers. Though the peak wavelength of the emitter and
receiver are not matched, enough radiation is
received to function well. Figure 5 shows spectral
sensitivity curve of the leading remote control receivers.
Because the peak wavelengths of the IrDA emitter
and receiver are not matched, transmit distance is a
function of a reduction factor, Rf, derived from the relative responsivity of the receiver Rf = Eemin/Ee
(with Eemin = threshold irradiance at the maximum at
950 nm and Ee = threshold irradiance at the given
wavelength). This reduction factor, Rf, is obtained
from the curves by reading the normalized sensitivity
value (Y-axis) where the receiver sensitivity curve
intersects the IrDA emitter’s peak wavelength of 886
nm.The wavelength of 886 nm is the specified typical
peak wavelength of Vishay’s IrDA-transceivers. In the
following equations the parameter IrDA represents
the wavelength range from 880 nm to 900 nm, CIR
refers to the consumer IR wavelength of 930 nm to
950 nm.
1.1
1
0.9
0.8
"886 nm - peak emitter"
"950 nm - peak emitter"
RC-Receiver
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
750
800
850
900
950
Wavelenght (nm)
1000
1050
1100
17225
Figure 4. Spectral sensitivity and emitter „Overlap“
Ie
E emin = ----2
d
d =
Ie
-------------E emin
1
E emin IrDA = E emin CIR u ----Rf
Ie
E emin CIR = --------------------2
d CIR E emin IrDA 1
Rf
I
e
= E emin CIR u ----- = ----------------------2
I
d IrDA =
Rf
e
u ------------------------------- =
d IrDA =
Rf
u d CIR E emin CIR d IrDA Rf
u d CIR E.g. in Figure 6,
R f = 0.79 ,
www.vishay.com
72
Rf =
0.79 = 0.89
Rev. 1.6, 20-Sep-06
Relative Spectral Sensitivity S (λ) rel
1.2
1.0
0.8
0.6
0.4
0.2
0
750
850
950
1050
Wavelength λ (nm)
17229
1150
80
60
40
20
0
600
700
Relative Spectral Sensitivity S (λ) rel
17232
800
900 1000 1100 1200
Wavelength λ (nm)
1.2
1.0
0.8
250
0.6
200
0.4
0.2
0
750
17230
850
950
1050
Wavelength λ (nm)
1150
Intensity (mW/sr)
Relative Sensitivity S (% )
100
Optical Intensity
As already described, remote control transmit distance is a function of emitter intensity. Transmit distance increases as the intensity of the emitter diode
increases. Vishay lab results indicate that to transmit
over a distance of 10 meters, the minimum intensity of
the 880-nm emitter should be 70 mW/sr. Most lowpower IrDA transceivers have a LED intensity of less
than 9 mW/sr, woefully inadequate to be used for
remote control function.
The intensity of the emitter depends on its peak current and efficiency. The peak current can be controlled by using a serial, current-limiting resistor. By
reducing the value of the resistor, the LED peak current will increase which increases the intensity. Each
IrDA transceiver, however, has a limit or maximum
intensity. For example, the TFDU6102, the world’s
leading FIR transceiver, has a peak current of typically 550 mA and typical intensity of 170 mW/sr (max.
350 mW/sr). Similarly, the TFDU4300 peak current
and resulting intensity are typically 300 mA and
65 mW/sr.
While the TFDU6102 does not require a current limiting resistor, figure 6 shows the dependence of intensity on the value of the serial resistor for randomly
selected transceivers. The serial resistor may be
used to reduce the internal power dissipation or to
reduce the current consumption with resulting lower
intensity. Note that these curves are for a few transceivers only. Single devices may deviate from average or normal behavior due to device parameter
tolerances.
150
100
Figure 5. Collection of different spectral sensitivity curves of
different types from different manufacturers
50
0
18807
0
1
2
3
4
5
6
7
8
Rled (Ohm)
Figure 6. Current-limiting resistor vs. on-axis intensitity for
TFDU6102 (five randomly selected transceivers). Applied
operating voltage V2 = 3.3 V
Rev. 1.6, 20-Sep-06
www.vishay.com
73
Carrier Frequency
The sensitivity of an infrared remote control receiver
is dependent on the carrier frequency as shown in
Figure 7. The 3-dB bandwidth f is about 1/10 of its
central frequency f0.
A carrier based modulation scheme is used for
remote control to efficiently filter the signal from disturbed ambient. Therefore remote control receivers
can be much more sensitive (x 100 to x 200) than
baseband transmission systems as e.g. IrDA equivalent receivers.
The carrier frequency of the handheld device’s controller should be the same as the central frequency of
the target device. A difference will result in a loss in
sensitivity and subsequent transmit distance. For
example, the transmit distance of a system which
uses a 36-kHz controller with a Vishay TSOP1238
receiver (center frequency of 38 kHz) will be reduced
by approximately 10 %. The selectivity is not that high
to allow multi-channel operation. With strong signals
as e.g. in a distance of 1 m a TSOP1238 will receive
also 30 kHz and 56 kHz carriers.
Battery Charge
A weakly charged battery causes a drop in the
strength of the emitted signal, particularly the beginning of the signal. In the following two diagrams (see
figure 8 and 9) the effect of charging state of the battery is shown. This drop at the beginning of the signal
may reduce the efficiency of the gain control of the
receiver, requiring longer response times or repeating
of the signal. Note that this is not RC-5 code. This
code provides a long header to allow the receiver to
adjust gain but with a weak battery the header is
dropped.
E e min / E e – Rel. Responsivity
1.0
0.8
18808
0.6
Figure 8. Signal from the IR transmitter with empty batteries.
The measured intensity is decreasing during the burst.
0.4
0.2
f = f0 ± 5 %
Δ f ( 3 dB ) = f0/10
0.0
0.7
94 8143
0.8
0.9
1.0
1.1
1.2
1.3
f/f0 – Relative Frequency
Figure 7. Frequency dependence of responsivity
18809
Figure 9. Signal from the IR transmitter with new Alkaline batteries.
The measured intensity is constant.
www.vishay.com
74
Rev. 1.6, 20-Sep-06
Test Results
Tests have verified that Vishay’s IrDA transceivers
can easily and effectively be used as remote control
emitters. These tests were performed using Vishay’s
standard remote control test procedures and equipment. Vishay, the leading supplier of remote control
receivers, as well other leading supplier’s receivers
were tested. The measurements are performed on a
Test Results
Remote Control
IrDA Transceivers
Emitter
Part Number
long corridor, where reflections from walls, floor and
ceiling improve the transmit distance. Therefore the
range data does not follow the square law rule for free
air transmission mentioned above. The measured
ranges are not resulting from a statistical relevant
number of devices. When comparing with table 2,
remember that the test conditions may be different.
SIR
MIR
FIR
Vishay
Vishay
Vishay
Vishay
Vishay
TSAL6400
TFDU4100
TFDU4300
TFDU5307
TFDU6614
IRED Peak Current (mA)
100
100
300
420
550
Intensity (mW/sr)
41
48
145
235
110
Peak Wavelength (nm)
940
886
886
886
886
RC Receivers
Transmit Distance (m)
Vishay TSOP1238
19
11
20
25
17
Panasonic PNA4612
11
8
13
17
11
Vishay TSOP4838
25
22
39
> 42
34
The signal was generated using a Philips remote control transmitter, Figure 10 and Figure 11 and Philips
RC5® code with a modified carrier frequency of
38 kHz with a pulse width of 9 μs.
+3V
200 μF
DUT
Button Array
Philips
Remote
Control
DUT
17226
17227
Figure 10. Philips remote control used in test
Figure 11. Circuit diagram for driver the DUT
Since carrier frequency has no influence on the optical matching of transmitter to receiver, the collected
data can be transferred to any other carrier frequency
system. This remote control transmitter generated a
digital signal. The signal is fed to an IRED driver transistor. When testing IrDA transceivers with internal
current controllers, the signal from the remote control
was directly fed to the TXD input of the transceiver.
For transceivers without internal current controllers, a
serial resistor was used to generate constant current
signal during the pulse. The transmitter supply voltage was set to 3 V.
With the different receivers listed in the tables a Philips decoder SAA3049 was used, see the circuit diagram in Figure 12.
Rev. 1.6, 20-Sep-06
+5V
100 Ω
Data
10 μF
Adress
Toggle
Remote
Control
Receiver
17228
SAA3049 5 V
4 MHz
Figure 12. Receive circuit diagram
www.vishay.com
75
Expected Performance
Remote Control and IrDA® applications are both
using Infrared as transmission medium. The remote
control applications are using historically the wavelength band from 930 nm to 960 nm while IrDA covers
the band from 850 nm to 900 nm. In the early days
the 950-nm band was also under consideration for the
IrDA organization. However, expecting future higher
speed, IrDA decided to go with the shorter wavelength range. Standard IrDA receivers are able to
receive RC signals, while RC receivers may not necessarily be able to receive IrDA signals. The typical
RC receivers have cut-off filters which are in the center of the IrDA band. In general one can state, that the
sensitivity of remote control receivers is questionable
in the lower part of the IrDA band while above 880 nm
the sensitivity of remote control receivers is quite
good and can be used. This opens up the option to
use IrDA transmitters also with remote control without
spending an additional long wavelength chip.
The experience confirms, that for the wavelength
range from 880 nm to 900 nm for the majority of stateof-the-art remote control receivers a sensitivity
threshold of 0.7 mW/m2 can be assumed.
In the following table 1 the range is listed which can
be expected under IrDA intensity conditions with the
boundary condition that the wavelength is above
880 nm.
In table 2 the expected range with some VISHAY
transceivers is listed.
Table 1: Expected Minimum RC Range under Standardized IrDA Conditions (Wavelength > 880 nm)
Wavelength > 880 nm
Min Intensity
Sensitivity = 0.7 mW/m2 (VISHAY TSOP1238
receiver)
IrDA
Ie
RC Range
[mW/sr]
[m]
VFIR/FIR/MIR Standard
100
12.0
at IrDA nominal conditions
VFIR/FIR/MIR extended LowPower 70 cm
50
8.5
> SIR 70 cm IrDA range with standard
VFIR/FIR/MIR extended LowPower 50 cm
25
6.0
> SIR 50 cm IrDA range with standard
VFIR/FIR/MIR LowPower
9
3.6
SIR Standard
40
7.6
SIR extended LowPower 70 cm
20
5.3
SIR 70 cm IrDA range with standard
SIR extended LowPower 50 cm
10
3.8
SIR 50 cm IrDA range with standard
SIR LowPower
3.6
2.3
Bold: IrDA Physical Layer IrPHY 1.4
Table 2: Expected RC Range with Selected VISHAY IrDA Transceivers
Transceiver
RC Range [m]
Remark
TFDU4100
14.1
at 5.0 V, Rs = 14 Ohm, about 210 mA
TFDU6102
20.0
at 550 mA
TFDU8108
20.0
at 550 mA
TFBS4710
12.5
at 300 mA internally controlled
TFBS6614
18.2
at 3.3 V, R = 0 Ohm
TFDU5307
18.1
at 3.3 V, internally controlled
TFDU4300
10.5
TFBS4711
9.3
TFBS6711
12.8
TFBS5700
9.3
at 3.3 V, R = 4.7 Ohm, about 300 mA
TFBS4650/4652
9.3
at 300 mA internally controlled, device specified operation
TFBS4650/4652
3.8
at 50 mA externally limited, LowPower operation
TFDU4202
14.6
at 320 mA resistor limited
TFDU4203
14.6
at 320 mA resistor limited
Receiver: VISHAY TSOP1238, Sensitivity = 0.7 mW/m2 at 885 nm
www.vishay.com
76
Rev. 1.6, 20-Sep-06
Remote Control Data Formats
There are many different coding systems used for
remote control. The most common codes are the
RC5® and RC6® codes from Philips and the NEC
code. For more information see the application note
Data Formats for IR Remote Control. Figure 13 is an
example of a remote control signal using the Philips
RC5 code when channel “3” is pressed. It was
recorded using an oscilloscope connected to IR PIN
detector.
Figure 13. RC5 optical signals of Key ‘3’
Channel 3: The RC5 code of key ‘3’ (RC5 0 3)
Channel A: Zoom-in of the start bits (11) and toggle bit.
Channel B: Zoom-in of the start bit.
Figure 14 shows the data format of the RC5 code.
The data word
is repeated as
long as a key is
pressed.
114 ms
Data
24.9 ms
Bit length 1.78 ms
Example
of a data word
2 start
bit
1
toggle
bit
5
address
bit
6 data
bit
27.8 μs
Burst
(half bit)
868 μs (32 cycles of 36 kHz)
17052
Figure 14. Philips RC5 IR remote control protocol
The RC5 - code has an instruction set of 2048 different instructions and is divided into 32 addresses
(5 bits) of each 64 instructions or commands (6 bits).
Each remote controlled device has its own address,
making it possible to change the volume of the TV
without changing the volume of the CD player. The
transmitted code is a data word that consists of 14 bits
and is defined as:
Rev. 1.6, 20-Sep-06
• 2 start bits (ss) for the automatic gain control in the
infrared receiver.
ss = 10 (Add 64 to command)1)
ss = 11 (Use command as it is)
• 1 toggle bit (change every time when a new button
is pressed on the IR transmitter)
• 5 address bits for the system address
• 6 instruction bits for the command or key pressed
The RC5 code uses the Bi-Phase modulation technique, meaning that a single bit is split up into two half
bits:
0 -> 10
1 -> 01
The duration time of each bit is equal to 1.778 ms containing 32 pulses with a repetition rate of 36 kHz, the
carrier frequency of this code. The total time of a full
RC5 code is 24.889 ms. The space between two
transmitted codes is 50 bit times or 88.889 ms. The
carrier frequency is used to enable a narrow band
reception to improve the noise rejection. The carrier
frequency of the RC5 code is 36 kHz. The complete
signal is repeated every 114 ms as long as the command button is still pressed. The toggle bit is changing its polarity each time the button is pressed.
For example, pressing and holding the volume key
will hold the toggle bit constant and the volume will
continuously increase bar by bar, the signal will not
change but will be repeated. By discretely pressing
the volume button, the toggle bit will change its value
each time. The final result is the same. In this case,
the toggle bit has no influence. However, when
selecting channel “1” and pressing and holding the
“1”- key, the receiver will detect the unchanged toggle
bit and will recognize only the “1” ignoring identical
signals regardless of how long the button is pressed.
Even if the transmission path is interrupted, it will not
detect “11” or “111”. To change to channel “11”, the
number “1” must be pressed twice. With each press,
the polarity of the toggle bit changes and the receiver
recognizes the command.
Additional Components Required for Remote Control
No additional components are required when using
Vishay transceivers. Vishay’s transceivers have an
emitter driver built-in and use the same digital input
pin, TXD, for IrDA and RC. No MOSFET is required.
1)The command set can be increased by 64 commands by using a
modified start bit “10” instead of “11” using the second start bit as a
7th command bit.
www.vishay.com
77
Application Examples
Motorola MC68SZ328 Processor (DragonBall)
The Motorola MC68SZ328 Processor (DragonBall) is
a high-performance low-power 32-bit microcontroller
with an integrated IrDA block for direct support of the
IrDA physical layer protocol (SIR, 9.6 kbit/s to
115.2 kbit/s).
The application circuit is shown in figure 15.
This processor uses the pin TXD / PE5 for IrDA or RC
data output and RXD / PE4 as IrDA or RC data input.
The pin RTS* / PE6 serves originally as RTS or GPIO.
Here this pin is used as a general-purpose output. It
is connected to SD for controlling the transceiver
operating mode by asserting this pin low or high to
enable or shutdown it. It is controlled by RTS bit of
UMISC register.
TXD/PE5, RXD/PE4 and RTS/PE6 pins are dedicated to the UART/Infrared Communication Port. For
RC data output or recording, set the SEL4-6 of the
PESEL register to 1. Control of these pins is given to
the Port E for use as general-purpose input/output
pins.
Intel SA-1110 Processor, StrongArm
The Intel SA-1110 Processor or StrongArm is a high
performance, low-power microcontroller with an IrDA
interface which supports SIR (9.6 kbit/s to 115.2 kbit/s)
and FIR (4 Mbit/s). It does not support MIR (1 Mbit/s).
The Vishay low profile (2.7 mm) transceiver
TFBS6614 is an option to operate with this processor
in the FIR range while the low profile (2.5 mm) transceiver TFDU4300 supports SIR in this application.
Both can be used for IrDA and remote control operations.
Other transceivers depending on the demand of the
application (device profile, and range) may be applicable, too. The pin numbering of the transceiver may
be different from that shown in figure 15.
The SA1110 pin functions (see figure 16) are RXD2
as IrDA data input, and TXD2 as IrDA data output.
GPx is an available general-purpose pin used for SD
and Bandwidth selection. TXD2 and RXD2 pins are
dedicated to the infrared communication port.
If serial transmission is not required and this port is
disabled, control of these pins is given to the peripheral pin control (PPC) unit for use as general-purpose
input/output pins, uninterruptible. Refer to section
11.13 entitled "Peripheral Pin Controller" on page 11167 of the Intel StrongArm SA-1110 Microprocessor
Developers Manual. To use these pins for remote
control, the user must also program the PPC pin
direction register. The direction of TXD2 should be
output and RXD2 should be input.
19896
Figure 15. Motorola MC68SZ328 Processor, DragonBall,
interfaced for IrDA/RC applications
The pin numbers are related to the VISHAY transceiver TFDU4300. Depending on the demand also
TFBS4650, TFBS4652, or other SIR transceivers can
be used, the pin numbering may be different in that
case.
19897
Figure 16. Intel SA-1110 Processor, StrongArm, in IrDA/RC
applications
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78
Rev. 1.6, 20-Sep-06
Intel PXA255 Processor or XScale
The Intel PXA255 Processor or XScale is a high-performance low-power microcontroller and has an IrDA
interface which supports both SIR (9.6 kbit/s to 115.2
kbit/s) and FIR (4 Mbit/s), see figure 17.
19898
Figure 17. Intel PXA255 Processor, Xscale, in IrDA/RC
applications
The Vishay low profile (2.7 mm) transceiver
TFBS6614 is an option to operate with this processor
in the FIR range while the low profile transceiver (2.5
mm) TFDU4300 supports SIR in this application. Both
can be used for IrDA and remote control operations.
The circuit diagram is shown in figure 17.
The transmitter input TXD (pin-3) of the transceiver is
connected to the processor's pin IRTXD/GPIO[47],
the receiver output RXD (pin-4) is connected to
IRRXD/GPIO[46] and the shutdown SD (pin-5) to one
of any available GPIO pins.
The I/Os IRRXD/GPIO[47] and IRTXD2/GPIO[46] are
multifunctional pins. To change their function
between IrDA and RC the bit-pair AF47 and AF46 of
the GPIO Alternate Function Select Registers
(GAFR1) is to be programmed. For example, setting
the bit-pair of GAFR1_L AF47 alters its function
between SIR, FIR, STD_UART and GPIO for remote
control as shown in the following table.
bits <31,30>
Name
Description
00
GP47
General Purpose IO port (for CIR)
01
TXD
STD_UART transmit data
10
ICP_TXD
FIR transmit data
Rev. 1.6, 20-Sep-06
Programming Example for RC operation (direct
access the GPIO ports):
Refer to section 4.1.3 GPIO Register Definitions, on
page 4-6 of "Intel® PXA255 Processor Developer's
Manual", March 2003
1.
Set the direction of port GPIO[47] to Output, by
setting 1 to bit-15 (PD47) of register GPDR1
(GPIO Pin Direction). Set the direction of port
GPIO[46] to input, by setting 0 to bit-14 (PD46)
of register GPDR1 (GPIO Pin Direction).
2.
Set the IRTXD/GPIO[47] port to GPIO, by writing 00 to bit-pair <31,30> (AF47) of register
GAFR1_L. Set the IRRXD/GPIO[46] port to
GPIO, by writing 00 to bit-pair <29,28> (AF46)
of register GAFR1_L.
3.
Send the same signals through the output port,
by writing one to either bit-15 (PS47) of register
GPSR1 (to set) or bit-15 (PC47) of GPCR1
(to clear).
4.
Read and record the inputs from port
IRRXD/GPIO[46] for RC simulation. The pin
state can be read by reading the bit-14 (pl46) of
register GPLR1.
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79
Interface Circuits
Interface Circuits
Interfacing SIR transceivers to an RS232
port
A quite common method of adding the IrDA capability
to a desktop computer is the usage of a so-called dongle connected to the COM - port (RS232 - port). This
connectivity is currently available at any desktop or
laptop computer but in future will be replaced by the
USB port.
For interfacing the SIR frontend transceivers (4000
series) as for other SIR transceivers an Encoder/
Decoder device (TOIM4232) is necessary to provide
the NRZ to RZI conversion. This device also provides
the clock generator and can be programmed by a set
of (8 bit-) commands. Drivers for the RS232 connector with TOIM4232 are provided by Microsoft (R) with
the Operating Systems. The block diagram of a dongle connection to RS232 is shown in figure 1.
RS232 9 pin
connector
Level
converter
SIR
transceiver
TOIM4232
Pin4, DTR
RESET
Pin7, RTS
BR/D
VCC_SD
TD_IR
TxD
Pin3, TxD
TD_UART
RD_IR
RxD
Pin2, RxD
RD_UART
X1
18046-1
VCC
X2
3.6842 MHz
Figure 1. TOIM4232-RS232 Interface (external infrared adapter)
Interfacing SIR Transceivers with
Enhanced UART16550A that are provided
with internal IR encoder/decoder.
There’s a large selections of enhanced UART’s and
μP’s for customized industrial applications as well as
portable handheld equipment, that have an embedded IR encoder/decoder supporting speeds from
9.6 kbit/s up to 115.2 kbit/s.
A short list of the UART’s in this criteria;
PC87334VLJ/PC87334VJG from National Semiconductors as well as FDC37C6651RI/ FDC37C666IR
from Standard Microsystems, or W83877TF and
W83977TF from Winbond, the SC16C550 and
SC16C650 from Philips. Also microprocessors for
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80
universal applications such as the Toshiba’s
TMP91CW12F, TMP3912U and the IT8172G from
ITE Tech. Inc. just to mention a few.
For this new generation of enhanced UART’s and
Micros, the SIR transceivers can be directly interconnected. Please consult the application notes and
interfacing guidelines by the manufacturer to optimize
the efficiency and performance of your design.
Interfacing MIR and FIR Transceivers.
Advanced UART Interfaces provides
this Port.
Our MIR transceivers support speeds from 9.6 kbit/s
to 1.152 Mbit/s while the FIR transceivers are supporting speeds from 9.6 kbit/s to 4 Mbit/s. Only
TFDU5307 out of the 5000 series is compatible to the
NSC and SMSC controller circuits described in the
following. All available devices of the 6000 series are
compatible to the described interface circuits.
NSCPC87108
The configuration shown in figure 2 is recommended
to interface MIR and FIR transceivers to the National
Semiconductor PC87108VHG "Advanced UART and
Infrared Controller".
• C1 and C2 should be placed as close as possible
to the Infrared Transceiver.
• The area which is grounded should be large
enough to cover as much space as possible between
the circuit paths leading to the Infrared Transceiver.
This will enhance EMI shielding to the internal optoelectronics.
NSCPC87338VLJ
The configuration shown in figure 3 is recommended
to interface MIR and FIR transceivers to the National
Semiconductor's PC87338VLJ.
• C1 and C2 should be placed as close as possible
to the Infrared Transceiver.
• The area which is grounded should be large
enough to cover as much space as possible between
the circuit paths leading to the Infrared Transceiver.
This will enhance EMI shielding to the internal optoelectronics.
A catalog overview by National can be found in at
http://www.national.com/catalog/PersonalComputing.html and documentation of the PC87109 controller in http://www.national.com/pf/PC/PC87109.html.
Rev. 1.7, 20-Sep-06
Interface Circuits
Interfacing MIR and FIR transceivers with
SMSC Infrared Controllers
tor’s IrDA compatible transceivers with regard to
these circuits are available from SMSC (see appendix
for addresses).
For more product information, see:
http://www.smsc.com/main/datasheet.html
and
http://www.smsc.com/main/catalog/pcio.html.
Many application hints can be found in the document
"SMSC IrCC (Infrared Communications Controller)
Hardware Design Guide" at
http://www.smsc.com/main/appnotes/an76.html
Standard Microsystems Corporation SMC has developed a variety of new Advance and Ultra I/Os. Typical
representatives of the new controllers are the
FDC37C669FR and the FDC37C93XFR. Application
notes describing how to use the Vishay Semiconduc-
Application Examples
16506
C3
VCC
R2
2 :
R1
50 :
6.8 PF
VCC
IRRX1
38
NSC87108
2
IRED
Cathode
4
IRSLO
IRTX
Rxd
Txd
37
TFDU6102
6
39
Vcc2, IRED
Anode
8
Vcc1
SD
GND
Mode
1
3
5
7
GND
GND
C1
C2
470 nF
6.8 PF
Figure 2. Application Example using NSC87108
Comp.#
Recommended Values
Vishay Part #
R1
50 :
CRCW–1206–50R00–F–RT1
R2
2:
CRCW–1206–2R00–F–RT1
C1
470 nF
VJ1206Y474–JXXMT
C2, C3
6.8 PF
293D685X9016B2T
16507
VCC
R2
2:
R1
50 :
VCC
IRRX1
67
PC87338VLJ
IRSLO
2
4
68
IRED
Cathode
65
8
TXD
RXD
TFDU6102
6
IRTX
Vcc2,IRED
Anode
Vcc1
SD
GND
Mode
1
3
5
7
GND
GND
C1
C2
470 nF
6.8 PF
Figure 3. Application Example for TFDU6102 with NSC87338VLJ I/O
Rev. 1.7, 20-Sep-06
www.vishay.com
81
Interface Circuits
Comp.#
Recommended Values
Vishay Part #
R1
50 :
CRCW–1206–50R00–F–RT1
R2
2:
CRCW–1206–2R00–F–RT1
C1
470 nF
VJ1206Y474–JXXMT
C2
6.8 μF
293D685X9016B2T
Recommended Application Circuits
V CC
R3
MAX3232CSE
1
C+
+ C3
3
4
VCC
TOIMx232
16
1
U1
C1-
V+
C2+
V-
2
C5
+
6
C7
+
2
3
C6
+ C4
4
+
5
C2-
GND
15
5
6
11
10
12
9
T1IN
T2IN
R1OUT
R2OUT
T1OUT
T2OUT
R1IN
R2IN
14
7
13
8
7
8
Reset
Vcc
U2
BR/Data
RD IR
RD 232
TD IR
TD 232
S2
V CC SD
S1
X1
NC
X2
RD LED
GND
TD LED
C10
16
2
+
15
R4
R6
TFDU4100
C11
4
14
6
13
8
IRED
Cathode
RXD
VCC1
IRED
Anode
U4
GND
TXD
NC
SC
1
3
5
7
12
11
10
9
J1
1
6
2
7
3
8
4
9
5
RXD
RTS (BR/D)
TXD
R1
DTR (Reset)
VCC
Y1
Application circuit using TFDU4100 with integrated
level shifter MAX3232E. When used directly with
3 Vlogic , this one can be omitted
Z2
CON9
ext.
input max
3.3 V DC
J2
1
2
C1
R2
+ C2
C8
CON2
C9
16527
Figure 4. Application circuit using TFDU4300 with an integrated level shifter MAX3232E.
When used directly with 3 V logic, this one can be omitted
For the component list see the TOIM4232 data sheet.
USB to IrDA Interface
HOST SYSTEM
4230 VFIR BLOCK
Host Power
Supplies
Power
STIR4230
Host Controller
Control Signals
24.00 MHz
crystal
TFDU8108
SPI
Transceiver
The USB connection replaces in computers the well
known old peripheral connections as RS232 and LPT
and will be the most common connector in future.
Therefore it is important to also support the IrDA
wireless connectivity at the USB port. In the drawing
in figure 5 the circuit block diagram using a SigmaTel
solution is shown.
This design operates up to the VFIR speed of 16 Mbit/s
using the VISHAY transceiver TFDU8108. The USB
to IrDA® interface shown here covers the frequency
range up to 16 Mbit/s.
On the following page the Sigmatel reference design
is shown for the Sigmatel STIR4230 interface circuit
used with the VISHAY transceiver TFDU8108.
19817
Figure 5. Block diagram of the USB to IrDA interface
www.vishay.com
82
Rev. 1.7, 20-Sep-06
Connect RESET_B to the pin on the
Host Controller that will control
the reset of the 4230
Connect INT to the pin on the Host
Controller that will monitor the
interrupt line
Connect SPI_SSn to the SPI_SSn
pin on the Host Controller
Connect SPI_MOSI to the SPI_MOSI
Connect SPI_MISO to the SPI_MISO
Connect SPI_SCK to the SPI_SCK
Connect VDDIO to the 3.3V supply
generated by the Host System
Connect V_IR to the Host System's
battery (must be above 2.7V) or
3.3V supply.
RESET_B
INT
SPI_SSn
SPI_MOSI
SPI_MISO
SPI_SCK
3.3V_Supply
BATT
1.8V_Supply
VDD
VDDIO
V_IR
R1
47K
GND
16
15
VDD
VSS1
INT
C1
22pF
16-Pin 4x4mm QFN
STIR4230N
GND
C2
22pF
IR_RX
IR_SCLK
VDDIO
VSS2
D1
LED
R4
220 Ohm
VDDIO
5
6
7
8
Optional Activity LED
24.000MHz
Y1
SPI_SSn
XTAL must be close
to the STIR4230.
GND
C3
0.1uF
VDD
14
13
U1
12
SPI_MOSI
GND
GND
C4
0.1uF
VDDIO
V_IR
+
GND
C5
10uF
GND
C6
0.1uF
C7
0.1uF
Date:
Size
B
Page
Title
1
2
3
4
5
GND
IRED Anode
TOP VIEW
8
7
6
5
4
3
2
1
TFDU8108
Friday, December 10, 2004
Sheet
2
of
3
This design is the property of SigmaTel, Inc. It is offered
on an "as is" basis, and carries no implied warranty.
STIR4230 - Battery IR
Rev
B
3815 Capital of Texas Hwy.
Suite 300
Austin, TX 78704
tel: (512)381-3700
www.sigmatel.com
GND
GND
C8
4.7uF
SigmaTel, Inc.
U2
TFDU8108
IRED Cathode
Txd
Rxd
SCLK
+
STIR4230 16L-4X4mm QFN Reference design
Filter to reduce noise on the
system's power supplies - may
be required in some systems
R2
10 Ohm
Place C7 as close as possible
to pins 6 and 7 of U2
R3
4.7 Ohm
VDDIO
R2, C5 and C6 are used to reduce the amount of
noise on the system's power supplies. The
actual values for R2 and C5 depend on several
factors and will be specific to each
application.
IMPORTANT DESIGN NOTES
STIR4230 16-Pin 4x4mm QFN
6
VCC
Connect VDD to the 1.8V supply
generated by the Host System
XTAL_OUT
2
XTAL_IN
1
11
SPI_MISO
10
SPI_SCK
9
LED_OUT
IR_TX
4
RESET_B
3
7
Vlogic
Rev. 1.7, 20-Sep-06
GND
8
VDD
Interface Circuits
19818
Figure 6. STIR4230 16-Pin 4 x 4 mm QFN Reference design
www.vishay.com
83
Interface Circuits
Remarks to the circuit shown in figure 6, STIR4230 16-Pin 4 x 4 mm QFN Reference design.
1) VDD is the core supply for the 4230. Connect to the host system´s 1.8 V supply.
2) VDDIO is the I/O supply for the 4230 and must be connected to the I/O supply used by the host processor
and IR transceiver to ensure proper logic levels.
VDDIO can be either 3.3 V or 1.8 V.
3) The integrity of the SPI_MOSI, SPI_MISO, and SPI_SCK signals are critical to the proper operation of the
4230. Use proper high speed layout techniques for these signals. Use signal paths that are as short and clean
as possible. Introducing a delay of even a few nanoseconds can be enough to prevent full speed operation of
the SPI bus and must be avoided.
4) While transmitting, the IR transceiver will consume large amounts of power and cause large current spikes
on the supply and ground planes. Peak currents of over 500 mA are common for devices that transmit 1 m.
Attention must be paid to power and ground layout as well as supply bypassing to prevent issues related to
excessive ground bounce or power supply ripple. In some circumstances R2, C5 and C6 can be used to help
isolate the transmit diode from the rest of the system. The optimum values for R2 and C5 depend on several
factors and will be unique to each design.
5) The supply used for the transmit diode (V_IR) must be above 2.7 V. The transmit diode does not require a
regulated supply, and for systems with battery voltages that are between 2.7 V and 5.5 V, can be powered from
the battery. If the supply voltage is above 4 V, a series resistor may be needed to limit the amount of power
dissipated inside the IR transceiver.
6) Place bypassing caps as close as possible to the IC´s power and ground pins. For U1, place C3 close to
pins 15 and 16 and C4 close to pins 7 and 8. For U2, place C7 as close as possible to pins 6 and 7.
7) Place Y1 close to the STIR430.
8) The DAP (die attachpad) is not needed either electrically or thermally and attaching it to the PC board is not
required. However, attaching the DAP provides additional mechanical support and may improve self allignment.
www.vishay.com
84
Rev. 1.7, 20-Sep-06
Interface Circuits
List of some I/O Controllers and Interfaces Supporting IR
(Remark: This list is not complete, there are other
suppliers such as IBM, ITC, VLSI, or Phoenix)
SC14428 Baseband Processor NSC
ADSP-BF531, 532 & 533 Embedded Processor
ANALOG DEVICES
ADSP-BF537 & 536 Embedded Processor
ANALOG DEVICES
ADSP-BF561 Embedded Processor
ANALOG DEVICES
Elan SC400 Microprocessor AMD
Elan SC520 Microprocessor AMD
Alchemy AU1000 & 1100 Microprocessor AMD
Geode SC Family Microprocessor AMD
Geode GX533 & GX500 Microprocessor AMD
Vr4100 Processor Family NEC
WV8307 VolP Chipset Agere Systems
BCM2121 GPRS/GSM Baseband Processor
BROADCOM
BCM2132 EDGE/GPRS/GSM Single-Chip
Multimedia BROADCOM
BCM2140 WCDMA (UTMS) FDD Baseband
Coprocessor BROADCOM
ML2011 GSM Single-Chip Baseband Processor
BROADCOM
BCM2702 Mobile Multimedia Processor
BROADCOM
AT76C713 Microcontroller ATMEL
EP9312 Embedded ARM Processor (Industrial
Applications) Cirrus Logic
EP7309 Embedded ARM Processor (Portable
Devices) Cirrus Logic
EP7311 Embedded ARM Processor (Industrial,
Mediacal) Cirrus Logic
EP9302 Embedded ARM Processor (Industrial &
Consumer) Cirrus Logic
EP7312 Embedded ARM Processor (Portables &
Handheld) Cirrus Logic
EP9307 Embedded ARM Processor (Portables &
Handheld) Cirrus Logic
Rev. 1.7, 20-Sep-06
CY8C21123, 223 & 323 Mixed-Signal Array PSoC
Family product CYPRESS
MPC875, 880, 875, 870 Power QUICC Processors
Motorola-Freescale
i.MX31 & iMX21 Multimedia Applications Processors
Motorola-Freescale
MCF54xX ColdFire V4e Core Processor Family
Motorola-Freescale
MC9S12E123/64/32 16-bit Microcontrollers
Motorola-Freescale
H8 & H8S H8SX Microprocessor Family
HITACHI-Renesas
M32R Microprocessor Family HITACHI-Renesas
HMCS400 Microprocessor Family
HITACHI-Renesas
M16C Microprocessor Family HITACHI-Renesas
H8/300H Microprocessor Family HITACHI-Renesas
R8C Microprocessor Family HITACHI-Renesas
ComCentrix L1501 I/O Controller LSI
MAX3130, MAX3131 IrDA Encoder/Decoder
MAXIM-DALLAS
DS80C400 Network Microcontroller
MAXIM-DALLAS
DS89C420 8051 Microcontroller MAXIM-DALLAS
MCP2120 EnDec IrDA MICROCHIP
Vr41xx Microprocessor Family NEC
MSM9405 EnDec IrDA OKI
S3C4530A Microcontroller SAMSUNG
SC16Cxxx UART Product family PHILIPS
SC68Cxxx UART Product family PHILIPS
PCD509x2/zuu/v Baseband Controller family
PHILIPS
uPSD Microcontroller 8032 Product family
STMicroelectronics
www.vishay.com
85
Interface Circuits
STn88xx Multimedia Processor Product family
STMicroelectronics
USB2230 & USB2229 USB-IrDA Controller 4 Mbit/s
SMSC
MPC47N207 Super I/O UART SMSC
SIO1036 & SIO 1000 I/O UART SMSC
LPC47M10x & 47B272 Super I/O Controller
(consumer appl.) SMSC
LPC47M112 Enhanced Super I/O UART SMSC
LPC47M172 & 182 Advance I/O Controller SMSC
LPC47S45x Advance I/O Controller X-Bus SMSC
LPC47S42x Enhanced Super I/O Server Appl. SMSC
SCH5017 Super I/O SMSC
SCH3116, 3114 & 3112 Super I/O SMSC
SIO10N268 Advance Notebook I/O (ISA/LPC) SMSC
FDC37N3869 Super I/O Controller (Portable Applications) SMSC
FDC37M81x Enhanced Super I/O SMSC
FDC37M707 Super I/O SMSC
FDC37B72x & 78x Super I/O SMSC
FDC37C665GT & 66GT Super I/O SMSC
KBC1100 & KBC1100L Embedded Controller
(Mobile) SMSC
TMP91Cxxx Microcontroller Product family TOSHIBA
TLCS-900/L1& H1 Microcontroller Product family
TOSHIBA
TMP86FS64FG Microcontroller Product family
TOSHIBA
VT1211 Super I/O VIA
OXmPCI954 UART Bridge OXFORD Semicon.
OX16PCI952 UART Dual Channel
OXFORD Semicon.
OXCB950 UART High Performance
OXFORD Semicon.
OX16C954 UART High Performance
OXFORD Semicon.
XC95108 Programmable CPLD Xilinx
ST16C580 UART EXAR
ST16C650A & 654 UART EXAR
XR17C152, 154 & 158, UART PCI Bus EXAR
XR17D152, 154 & 158 UART PCI Bus EXAR
XR17L152, 154 & V258 UART PCI Bus EXAR
XR16C285xx UART Family EXAR
UCC5340 IrDA Receiver ???? Texas Instruments
UCC5341 IrDA Receiver ???? Texas Instruments
MSP430 IrDA SIR EnDec Texas Instruments
TL16PIR552 Dual UART Texas Instruments
TIR1000 IrDA SIR EnDec Texas Instruments
TUSB3410 USB-RS232 Texas Instruments
TMS320VC5470 & 5471 Fixed-Point DSP
Texas Instruments
OMAP5912 Multimedia Processor
Texas Instruments
OMAP5910 Dual-Core Processor
Texas Instruments
C5472 Programmable DSP Texas Instruments
eCOG1K Mikrocontroller CYAN Technlg.
W83L517D LPC I/O WINBOND
W83637HF LPC I/O WINBOND
W8369UF LPC I/O WINBOND
W83627HF LPC I/O WINBOND
L1501 Embedded UART LSI Logic.
STIR4200 IrDA-USB1 Bridege FIR SIGMATEL
STIR4210, 4220 & 4116 IrDA-USB2 Bridege VFIR
SIGMATEL
STIR4230 & 4231 VFIR Embedded Controller
SIGMATEL
IT8661F Super I/O ITE Tech.
Note: The list of controllers is based on our research in the public literature. We don’t claim that this list covers all available controllers. We
cannot guarantee the functionality of these controllers with transceivers. This must be verified for any special case.
www.vishay.com
86
Rev. 1.7, 20-Sep-06
Reference Layouts and Circuit Diagrams
For testing and comparing test results a common
base is necessary. The layout of a test board can
have a quite big influence on parameters, especially
on rise and fall time and also on jitter.
testing all transceivers with the common Vishay pin
order and with a 1 mm lead pitch.1 The test boards
and the Gerber plots of the test boards are available
on request.
In most cases the used power supplies are far away
from the device under test and the wiring is done with
long inductive cables. In such a case the power supply is not able to supply high peak currents. The only
way to overcome this condition is to implement many
capacitors close to the device under test.
For comparison test data, especially as mentioned
before for rise and fall times, the circuit ambient must
be well defined. The circuit and the layout may have
a quite big influence on the resulting data. Therefore
a comparison should only be done under equal or
very similar conditions. The boards for testing can be
used for different types. Therefore redundant pads for
circuit components may be in some cases not used or
may have different purposes for different transceivers. For connecting to the test equipment, controllers,
and power supplies twisted pair cables are used,
which provide low capacitive load and defined
impedance. The different usage of pin 7 of the transceiver in figure 2 leads to a layout where only for the
case of Vlog at pin 7 the components C5, C6, and R4
may be used. In other cases a jumper replaces R4,
and C5 and C6 are omitted.
It is very important to note, that the circuit for testing
is different from the application circuit, where e.g. in a
telephone application the battery is very close to
the transceiver and the wiring is also low impedance.
In general we recommend using in application circuits
the combination R1/C4 (shown in figure 1 and
figure 2) and not more than that.
In this chapter a common reference layout and the circuit diagram is described which is used for
JP1
1
IRED Anode
R2
Vlogic
Vlogic
V cc1
GND
V cc
R1
C1
C4
Ground
SD
SD
TXD
TXD
RXD
RXD
I R T ra ns c e ive r
V cc2
2
4
+
C1
R1
6
8
10
9
5
R2
C2
GND
GND
7
3
19706
R3
VCC
GND
2
RXD
4
GND
6
C3
GND
+
C4
GND
C5
Vlog. Mode or NC
SD
+
8
IRED
Cathode
IRED
Anode
RXD
TXD
Transceiver
VCC1
SD
GND
Vlog.
Mode
or NC
1
3
5
7
C6
R4 opt.
TXD
19707
Figure 1. Generally recommended application circuit for all
Vishay IR transceivers. R1/C4 are recommended, R2 necessary
only for not internally current controlled transceivers, C1 is
optional, when inductive wiring is used.
Figure 2. Test circuit for IR transceivers. The component
positions are provided on the reference test board and can be
populated depending on the demand and the test conditions
Circuit description
The test board is using only one power supply voltage
VCC (at pin 1 of connector JP1, figure 2) for the transmitter and receiver. Another supply voltage is available for different logic voltages Vlog at JP1, pin 3
connected to pin 7 of the transceiver. The analog supply voltage VCC1 at pin 6 of the transceiver is connected to VCC via a low pass filter given by R1 and C3/C4.
Also C1/C2 contribute to smoothing and stabilizing
the voltage at pin 6, VCC1. The IRED anode is connected to the power supply via R2/R3 (two parallel
resistors for increased power dissipation). These re1
sistors define the IRED current for the case a switch
is built into the transceiver. In case of a built-in current
controller, these two resistors can be replaced by a
jumper. For supply voltages above 4 V it might by advisable to use these for lowering the power dissipation
inside the transceiver, especially in case the maximum operating temperature will be used. In that case
care should be taken, that the voltage at the IRED pin
doesn’t drop below the minimum specified supply
voltage.
Note: This is an example for the 8 pin devices with 1-mm pitch. For other devices with different pitch and less pins equivalent boards are
also available.
Rev. 2.0, 20-Sep-06
www.vishay.com
87
In figure 3 the test board layout is shown with top and 9-pin Sub-D connector or a twisted pair cable (see
bottom layer, the component placement and the dif- table 3).
ferent option for external connection, either via a
Table 1. Component list for testing SIR - devices at VCC = 3.3 V
TFDU4300
max. distance
Component
TFDU4300
Low Power mode
TFDU4100
Test board
C8P_5102
acc. figure 2
Application
acc. figure 1
C8P_5102
acc. figure 2
Application
acc. figure 1
U8-P_5002
acc. figure 2
R1
47 :
47 :
47 :
47 :
47 :
47 :
R2
0:
56 :
56 :
10 :
4.7 :
R3
open
open
R2/R3
0:
56 :
10 :
R4
0:
0:
5:
C1
10 μF
10 μF
10 μF
C2
470 nF
470 nF
470 nF
C3
6.8 μF
6.8 μF
C4
470 nF
C5
-
-
-
C6
-
-
-
100 nF
Application
acc. figure 1
470 nF
100 nF
6.8 μF
4.7 μF
470 nF
100 nF
-
Remark: For component values in application circuits for volume production and other SIR transeivers see the relevant data sheets.
Table 2. Component list for testing FIR/VFIR - devices at VCC = 3.3 V
Component
TFBS6614
TFDU6102
TFDU8108
Test board
C8P_5102
acc. figure 2
Application
acc. figure 1
C8P_5102
acc. figure 2
Application
acc. figure 1
U8-P_5002
acc. figure 2
Application
acc. figure 1
R1
10 : to 47 :
10 :
10 : to 47 :
10 :
4.7 :
4.7 :
R2
0:
0:
0:
0:
0:
0:
R3
-
-
-
-
-
R2/R3
0:
0:
0:
R4
0:
0:
0:
C1
10 μF
10 μF
10 μF
C2
470 nF
470 nF
470 nF
C3
6.8 μF
6.8 μF
C4
470 nF
100 nF
470 nF
6.8 μF
100 nF
220 nF
220 nF
C5
C6
470 nF
470 nF
470 nF
Table 3. Signal and pin assignment for test board
Connector
D_Sub 9 pos. male
Function
Cable pinning and color
(when using twisted pair cables)
Pin
Signal
Pin / Color
1
SD
9 / Blue
2
RX
7 / Green
www.vishay.com
88
3
TX
5 / Yellow
4
Vlogic, SC, Mode or NC
3 / Orange
5
VCC
1 / Red
6
GND
2, 4, 6, 8, 10 / White
7
VCC (opt.)
8
VCC (opt.)
9
GND
Rev. 2.0, 20-Sep-06
19711
19708
Figure 3. Board dimensions.
Figure 6. Board layout BOTTOM-Side. See from Top-Side.
19709
19712
Figure 4. Component placement.
Figure 7. Upper layer with Connector pinning.
19710
19713
Figure 5. Board layout TOP-Side.
Figure 8. Upper layer with cable pinning.
Figure 3 to figure 8. Test board layout for 8 pin
transceiver – modules with 1-mm pitch. “U8P_5002” is the internal ID number, another test board
with 0.95 mm pitch is available with the ID
“C8P_5102”. For 6-pin and 7-pin transceivers equivalent test boards are available on request.
Rev. 2.0, 20-Sep-06
www.vishay.com
89
Remarks to the Test Board Layout and Pin - Function
The circuit layouts are designed to operate with transceivers with the general Vishay pin order as
SIR (9600 bit/s to 115.2 kbit/s) to VFIR(16 Mbit/s) shown in the following table.
data rates. Our test boards can be used with
pin #1
pin #2
pin #3
pin #4
pin #5
pin #6
pin #7
pin #8
IR Emitter
Annode
IR Emitter
Cathode
Transmitter
Input
Receiver
Output
Shutdown
Analog
Supply
Voltage
Digital
Supply
Voltage
Ground
IREDA
IREDC
TXD
RXD
SD
VCC
Vlogic
GND
IR Emitter
Annode
IR Emitter
Cathode
Transmitter
Input
Receiver
Output
Shutdown
Analog
Supply
Voltage
Mode Input
Ground
IREDA
IREDC
TXD
RXD
SD
VCC
Mode
GND
IR Emitter
Annode
IR Emitter
Cathode
Transmitter
Input
Receiver
Output
Serial Clock
Analog
Supply
Voltage
Mode Input
Ground
IREDA
IREDC
TXD
RXD
SD
VCC
Mode
GND
Function
7-pin device
TFBS4650
IR Emitter
Anode
IR Emitter
Cathode
Transmitter
Input
Receiver
Output
Shutdown
Analog
Supply
Voltage
Ground
Symbol
IREDA
IREDC
TXD
RXD
SD
VCC
GND
Function
7-pin device
TFBS4652
IR Emitter
Anode
Receiver
Output
Transmitter
Input
Shutdown
Digital
Supply
Voltage
Analog
Supply
Voltage
Ground
Symbol
IREDA
RXD
TXD
SD
Vlogic
VCC
GND
Function
6-pin device
as e.g.
TFBS4711
TFBS6711
TFBS6712
IR Emitter
Anode
Transmitter
Input
Receiver
Output
Shutdown
Analog
Supply
Voltage
Ground
Symbol
IREDA
TXD
RXD
SD
VCC
GND
Function
8-pin device
as e.g.
TFBS6614
Symbol
Function
8-pin device
as e.g.
TFBS6102
Symbol
Function
8-pin device
as e.g.
TFBS8108
Symbol
The recommended board layouts are Vishay references for testing the transceivers. Identical boards
are used for all speeds from SIR to VFIR. The layout
has an influence on the rise/fall times of the signals,
especially of the optical output pulse due to the quite
high drive current through the LED. The circuit is also
identical for all transceivers apart from the different
use of pin 5 (SD or not connected as e.g. in case of
TFDU4100, which has no SD function), pin 7 (Mode,
Vlogic, or NC), and the device dependent current limiting resistors R2 for controlling the current through
the IR emitter.
As already described, the given layout is nearly
identical for all Vishay transceivers because the pin
order is identical for all devices. For different lead
pitch different boards are available.
www.vishay.com
90
Transceiver I/Os (8-pin as example) Optical Domain, Input and Output
The IrDA® physical layer standard specifies only the
optical interlink, not the electrical input or output signals. The optical domain is strictly specified and
tested with the IrDA-given conditions. However, the
constriction to the IrDA standard limits the application
of the transceivers outside the IrDA protocol.
Due to the pulse duration limits of minimum and maximum optical pulse width IrDA receivers are designed
to suppress low frequency and DC radiation as sunlight, incandescent or fluorescent lamps. Therefore
these receivers cannot be used as DC-radiation sensors. The emitter pulse duration is limited to overcome the overload risk during start-up conditions of
computers and for eye safety issues, too.
Rev. 2.0, 20-Sep-06
Pin #1 - IR Emitter Anode
There are in general different LED (or IRED) drive
options in the different devices. Most of the new
designs have a built-in current control for the LED
drive current to set the intensity correctly for the
application adapted to the IrDA standards (e.g.
TFDU6102, TFBS6614, TFDU4300, TFBS4650). In
that case the IREDA-pin is directly connected to the
supply voltage. Only in special cases a series
resistor is applicable: Adding an external resistor in
series to the LED can have two reasons. The first is
to reduce the dissipated power inside the receiver
when supply voltages above 4 V are used (and
specified) and the full temperature range should be
covered keeping the internal current control active.
The second is to reduce the internally set current e.g.
for low power application or just saving power when
the full range is not needed. In that case the controller
function is changed just to a switch.
Other transceivers are using only an internal switch.
In that case the external resistor R2 from pin #1 to the
power supply is responsible for the current limitation.
With the internally defined current through the LED
the intensity is to a great extent independent of the
applied voltage while in case of using the switch the
intensity is strongly voltage dependent and the resistor R2 is to be selected depending on the applied voltage. Also when the internal regulation is overruled by
an external resistor this will behave like a switched but
not controlled IRED. In figure 9 the typical resulting
currents dependent on the applied voltages are
shown when the current limitation is done by a series
resistor Rs. In figure 10 the influence of the series
resistance on the resulting current is shown.
400
350
IRED current (mA)
300
250
200
150
100
Rs = 3.3 Ohm
50
0
2.3
2.5
2.7
2.9
3.1
3.3
3.5
3.7
19714
Voltage VIRED = VCC (V)
Figure 9. Resulting current depending on the operating voltage LED drive current, limiting series resistor Rs = 3.3 :
Rev. 2.0, 20-Sep-06
www.vishay.com
91
450
Resulting IRED current (mA)
400
350
300
250
200
150
100
VCC1 = VCC2 = 3.3 V
50
0
1
10
100
Series Resistor Rs (Ω)
19722
Figure 10. Resulting current depending on the series resistor for limiting the LED drive current, VCC1 = VCC2 = 3.3 V
The on-resistances RDSon of the driver transistors do
not vary very much. Therefore this example is quite
representative for all transceiver types with built-in
switches. One should keep in mind that the parameters may slightly change over the temperature range.
In figure 11 and figure 12 the behavior of transmitters
with built-in current control is shown. There only a little
voltage dependency can be observed for the drive
current and the intensity, respectively. To increase the
intensity a serial LED can be used when the quite high
operating voltage is available. The abs. max ratings
must be taken into account.
350
100
Intensity le (mW/sr)
Peak current lf (mA)
300
250
200
150
100
50
60
40
20
0
0
2
3
4
2
5
IRED Anode Voltage (V)
19723
Figure 11. TFBS4711, peak emitter current as
a function of the applied voltage
Pin #2 – IR Emitter Cathode
In most cases the IR Emitter Cathode pin is not to be
connected. The IR Emitter cathode is internally connected to the LED driver. When the IR Emitter should
be driven from an additional source as a Remote Control controller (Figure 13) an n-channel FET can be
added to operate the Emitter like via an “or”-gate.
An additional external diode can be operated in parallel when the intensity should be improved. That is efwww.vishay.com
92
80
3
4
5
IRED Anode Voltage (V)
19725
Figure 12. TFBS4711, intensity as a function of supply voltage
ficient, when the transceiver is internally operated by
a switch (Figure 14). In all cases the abs. max ratings
must be taken into account. Connecting this pin to a
large copper PCB-area would improve the heat dissipation especially in lead frame based designs
(TFDUxxxx-types).
Rev. 2.0, 20-Sep-06
V cc1
R1
C1
GND
IRED Anode
V cc2
Vlogic
Vlogic
V cc
C4
Ground
SD
SD
TXD
TXD
RXD
RXD
R2
IRED Anode
Vlogic
V cc
R1
V cc1
C1
GND
C4
Ground
SD
SD
TXD
TXD
RXD
RXD
IR Transceiver
R2
I R T ra ns c e ive r
V cc2
Vlogic
Si1012R/X
TXD_RC
IRED Cathode
IRED Cathode
R2’
19727
19726
Figure 13.
Figure 14.
Pin #3 – TXD Transmitter Input
Inputs in general
All inputs (as all other pins) are ESD protected. For
the protection level see the data sheets or the Qualpacks for the special transceivers. Nevertheless, care
should be taken that the voltage at the inputs does not
exceed the specified values. Voltages above the
threshold will trigger the input. This is valid also for applied RF – signals. Some EMI is just generated by too
high applied RF voltages to the inputs (e.g. of more
than 1.5 V with 3 V logic levels). When the transceivers are operated close to RF-antenna it should be
avoided to couple RF to the input or output lines.
As a counter measure terminating inputs (and also
output lines) is recommended.
Most devices have a built-in dynamic load circuit at
the inputs (TXD, SD, Mode, SC), which keeps the input in the Low state. Changing the state will cause a
current of some μA. The typical behavior and current
flow is shown in figure 15. In figure 15 a simulation is
shown with rising TXI input voltage over time. IVIC is
the resulting input current and IDDadd is the additional operating current. Other inputs (e.g. SD) show the
same behavior.
V(TXI)_1:1
V
7
6
5
4
3
2
1
0
-1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0e-3
s
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0e-3
s
1.0
1.2
1.4
1.6
1.8
IVIC
1.5e-5
1.0
0.5
0.0
-0.5
-1.0
-1.5
0.0
IDDadd
e-4
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
VDD = 3.0 V
0.0
0.2
0.4
0.6
0.8
19731
2.0e-3
s
Figure 15. Input current characteristic
Rev. 2.0, 20-Sep-06
www.vishay.com
93
To demonstrate the current vs. input voltage characteristics a triangular voltage function V(TXI) is applied
to the TXD input pin. With increasing voltage the input
current IVIC is increasing until the voltage crosses the
switching point of the input. Above that the input load
is switched off. However, there is still an additional
operating current in the vicinity of the logic threshold
level. That current vanishes, when the input voltage
comes closer to the operating voltage (3 V in this
case).
Pin #3 – TXD Input
Setting the transceiver input active will cause to
output an electrical drive current through the LED and
emitting a specified optical intensity. The pulse duration of IrDA-standard related transmission is limited to
a maximum of about 20 μs2. To protect the emitter
against wrong timing and also to comply with eye
safety regulations the pulse duration in VISHAY emitters is limited to a value between 20 μs to 100 μs.
This indicates that an NRZ-code (NRZ: no return to
zero) cannot be transmitted with these devices spe-
cialized for the IrDA standard. For communicating with
RS232 via IrDA transceivers a code converter (ENDEC as the device TOIM4232) from NRZ to RZI (return to zero inverted) is necessary. Remote Control
codes are supported. The IrDA standardized wavelength is shorter than the remote control wavelength.
However, the RC receivers are able to receive IrDA
signals, at least when the emitted wavelength is in the
IrDA band above 870 nm as used by VISHAY.
Pin #4 – RXD Receiver Output
Outputs Vishay transceivers use tri-state outputs.
When the device is set to the shut down mode, the
output is floating with a very little load (in the order of
500 k: to 1 M:) to the digital supply voltage Vlogic, if
available, or Vcc. The only device, which is using an
open collector output, is TFDU4100 with an internal
pull-up of 20 k: to Vcc.
protected. With that feature programming errors will
not kill outputs.
All Vishay FIR transmitter outputs are short circuit
As already noted for the TXD-input also the receive
channel detects only pulses, but no DC-radiation. In
general carrier based remote control signals (as
RC5®, RC6® or NEC® - codes) can be received and
used especially for a teach mode for learning RC
codes.
Pin #5 – SD Shutdown
Shutdown With a few exemptions as TFDU4100 and
TFDU4202 all Vishay Semiconductors IrDA-compliant transceivers feature a shutdown input. When set
active the devices go into a shutdown mode with the
RXD output floating with a weak pull-up. To shut
down TFDU4100 and TFDU4202 see the special data
sheets.
and VFIR devices it is recommended to reset the
transceivers by setting the SD active to force the device directly into a programmed mode before starting
a communication. Often the start-up conditions in circuits are not defined very well. Therefore it is advisable to force the transceiver into a desired condition
than to rely on a default state.
In case of programmable transceivers as the MIR, FIR
Pin #6 – VCC Analog Supply Voltage
In nearly all Vishay Semiconductors transceivers the
supply voltages for the LED and the transceiver can
be applied separately. This has the advantage that
only the transceiver with a small operating current has
to be connected to the regulated power supply whereas the much higher LED drive current is supplied by
the unregulated source, resulting in less cost for the
Pin #7 – Mode
The mode pin is used in FIR devices as e.g.
TFDU6102 to change the mode from SIR to FIR statically. This pin can also be used to monitor the opera2
power supply. The supply voltage should be filtered
with a low pass as shown in the circuit diagram. A
combination of a Tantalum capacitor and a ceramic
capacitor is recommended. Especially when EMI immunity is an issue, care should be taken for the RFquality of the ceramic capacitor.
tion mode (SIR or FIR) of the device, which is set
dynamically by using SD and TXD lines. If not used,
leave this pin open. Maximum capacitive load: 50 pF.
Note: Any IrDA receiver must be able to handle 1.6 μs input signals
www.vishay.com
94
Rev. 2.0, 20-Sep-06
Pin #7 – Vlogic Digital Supply Voltage
Some of the Vishay Semiconductors transceivers
have the opportunity to apply an external reference for
the logic input and output levels. If a Vlogic – voltage is
specified, this can be either connected to Vcc or can
be separately supplied by a reference voltage to
adapt input thresholds and output levels to the logic
levels for optimum noise suppression especially when
using low I/O voltages.
The input threshold is about half of the applied Vlogic
and the output swing is defined by Vlogic. If not different from Vcc this pin can be directly connected to Vcc.
Pin #8 – GND Ground
This is the reference for all applied voltages.
Especially when working with FIR and VFIR
frequencies the standard rules for ground wiring in RF
circuits should be observed. For testing basic
parameters the described reference layout should be
used. Switching times, delays, noise immunity and
even sensitivity can suffer from bad grounding.
Longer signal lines in particular should not be used
without termination. See e.g. “The Art of Electronics”
Paul Horowitz, Winfield Hill, 1989, Cambridge
University Press, ISBN 0521370957.
Encoder and Decoder Circuits
The VISHAY transceivers are designed to operate
according to the IrDA standard, this means with dedicated pulse duration for transmitter and receiver.
Many controllers (PC, mobile phone and microprocessor families) support the IrDA standard. SIR with
RS232 is supported by the VISHAY – ENDEC
TOIM4232. For a circuit diagram see this data sheet.
See also the supplier list in the application note
“Sources for Accessories”.
Optical Windows
Optical windows should be designed not to truncate
the beam shape of transceivers. On the other hand
the window design also can be used to minimize interference with background light and other disturbances. For type related window design and general
information regarding windows materials and suppliers see the application note “Window Size in Housings”. Supplier references are in the note “Sources for
Accessories”.
Rev. 2.0, 20-Sep-06
www.vishay.com
95
Quality and Reliability
Quality Information
Corporate Quality Policy
Our goal is to exceed the quality
expectations of our customers.
This commitment starts with top
management and extends through
the entire organization. It is achieved
through innovation, technical excellence
and continuous improvement.
18348
Figure 1. Vishay quality policy
www.vishay.com
96
Rev. 1.3, 20-Sep-06
VISHAY INTERTECHNOLOGY; INC.
ENVIRONMENTAL, HEALTH AND SAFETY POLICY
VISHAY INTERTECHNOLOGY, INC. is committed to conducting its worldwide operations in a
socially responsible and ethical manner to protect the environment, and ensure the safety and health
of our employees to conduct their daily activities in an environmentally responsible manner.
Protection of the Environment: Conduct our business operation in a manner that protects the environmental quality of the communities in which our facilities are located. Reduce risks involved with
storage and use of hazardous materials. The company is also committed to continual improvement
of its environmental performance.
Compliance with Environmental, Health and Safety Laws and Regulations:
Comply with all relevant environmental, health and safety laws and regulations in every location.
Maintain a system that provides timely updates of regulatory change.
Cooperate fully with governmental agencies in meeting applicable requirements.
Energy, Resource Conservation and Pollution Control: Strive to minimize energy and material
consumption in the design of products and processes, and in the operation of our facilities. Promote
the recycling of materials, including hazardous wastes, whenever possible. Minimize the generation
of hazardous and non-hazardous wastes at our facilities to prevent or eliminate pollution. Manage
and dispose of wastes safely and responsibly.
Rev. 1.3, 20-Sep-06
www.vishay.com
97
WWoor rl dl dCCl al assssEExxcceel llel ennccee
2008
In te g ra te d M a n a g e m e n t S y s te m s
E C - D ir e c tiv e E L V , R o H S , W E E E fu lfille d
IS O /T S 1 6 9 4 9 - A u to m o tiv e S ta n d a r d
IS O 9 0 0 1 :2 0 0 0 P r o c e s s O r ie n te d B u s in e s s
2000
IS O 1 4 0 0 1
Q S 9 0 0 0 / V D A 6 .1
E F Q M A p p ro a c h
1995
M e a s u r e m e n t C u s t o m e r S a t is f a c t io n
C o r p o r a te C u s to m e r S e r v ic e P o lic y
IS O 9 0 0 0
A d v a n c e d Q u a lity T o o ls
S u p p lie r P a r tn e r s h ip
C o s t o f Q u a l i ty
1990
E m p o w e re d Im p ro v e m e n t T e a m s
19593
Figure 2. Vishay Quality road map
Quality System
Quality Program
Vishay Corporate Quality
At the heart of the quality process is the Vishay worldwide quality program. This program, which has been
in place since the early 90's, is specifically designed
to meet rapidly increasing customer quality demands
now and in the future.
Vishay Corporate Quality implements the Quality Policy and translates its requirements for use throughout
the worldwide organization.
Vishay Quality has defined a roadmap with specific
targets along the way. The major target is to achieve
world-class excellence throughout Vishay worldwide
by 2008.
The Vishay Corporate Quality defines and implements the Vishay quality policy at a corporate level. It
acts to harmonize the quality systems of the constituent divisions and to implement Total Quality Management throughout the company worldwide.
www.vishay.com
98
Vishay Zero Defect Program
• Exceeding quality expectations of our customers
• Commitment from top management through entire
organization
• Newest and most effective procedures and tools
- design, manufacturing and testing
- management procedures (eg. SPC, TQM)
• Continuous decreasing numbers for AOQ and
Failure Rate
• Detailed failure analysis using 8D methodology
• Continuous improvement of quality performance of
parts and technology
Rev. 1.3, 20-Sep-06
Quality Goals and Methods
Inputs from:
from:
rIntetability
un
aco
QM
Rev. 1.3, 20-Sep-06
re
ultu
C-C
Di r ec t i v es f r o m :
tegy
Stra
K ey f u n c t i o n s :
Forecast
Mar k et i n g
Order
R& D, En g i n eer i n g
Products
Tr an s ac t i o n o f Or d er s
Data Base
New Products
>3years
VM, Cu s tom er Ac c.
Cycle Time
Sales/ASP
Turns
Inventorries
Promisses
Turns
Response Time
Returns
A OQ
Raw Material
AOQ, Returns
C o m p l a i nt s
Q-Costs
GGOOAALLSS
Qu al i t y
Cu s t o m er Qu al i t y
En v i r o n m en t
Su p p o r t ed b y :
Con
trolli
ng
Standards
Laws
K ey Parameter
V M , RTM
Product Sampl es
Proj ect M gmt
Y i el d
Pr o d u c t i o n
ManProject
age men
t
Other
Agreements
Pu r c h as i n g
Sale
s
Customer
Qualitiy
Dev el o p m en t o f New Pr o d u c t s
F G
MaS
R
rco,H
m,L,ACC
OG .
,IT
Customer
Requests
Process Outputs
K ey Pr oc es s es :
Pl an n i ng
Division
The goals are straightforward: Customer satisfaction
through continuous improvement towards zero
defects in every area of our operation. We are committed to meet our customers' requirements in terms
of quality and service. In order to achieve this, we
build excellence into our product from concept to
delivery and beyond.
• Design-in Quality
Quality must be designed into products. Vishay uses
optimized design rules based on statistical information. This is refined using electrical, thermal and
mechanical simulation together with techniques such
as FMEA, QFD and DOE.
• Built-in Quality
Quality is built into all Vishay products by using qualified materials, suppliers and processes. Fundamental
to this is the use of SPC techniques by both Vishay
and its suppliers. The use of these techniques, as well
as tracking critical processes, reduces variability,
optimizing the process with respect to the specification. The target is defect prevention and continuous
improvement.
• Qualification
All new products are qualified before release by submitting them to a series of mechanical, electrical and
environmental tests. The same procedure is used for
new or changed processes or packages.
• Monitoring
A selection of the same or similar tests used for qualification is also used to monitor the short- and longterm reliability of the product.
• SPC (Statistical Process Control)
SPC is an essential part of all Vishay process control.
It has been established for many years and is used as
a tool for the continuous improvement of processes
by measuring, controlling and reducing variability.
• Vishay Quality System
All Vishay's facilities worldwide are approved to
ISO 9000. In addition, depending on their activities,
some Vishay companies are approved to recognized
international and industry standards such as VDA 6.1
and QS 9000. Each subsidiary goal is to fulfill the particular requirements of customers. The Opto Divisions
of Vishay Semiconductor GmbH are certified according to ISO 9001:2000, QS 9000 and
ISO/TS 16949.
Co n t i n u o u s Im p r o v ement
(PDCA - Cy c le)
le)
19594
The procedures used are based upon these standards and laid down in an approved and controlled
Quality Manual.
Total Quality Management
Total Quality Management is a management system
combining the resources of all employees, customers
and suppliers in order to achieve total customer satisfaction. The fundamental elements of this system are:
• Management commitment
• European Foundation for Quality Management
(EFQM assessment methodology)
• Empowered Improvement Teams (EITs)
• Supplier development and partnership
• Quality tools
• Training
• Quality System
All Vishay employees from the senior management
downwards are trained in understanding and using of
TQM. Every employee plays its own part in the continuous improvement process which is fundamental to
TQM and our corporate commitment to exceed customers' expectations in all areas including design,
technology, manufacturing, human resources, marketing, and finance. Everyone is involved in fulfilling
this goal. The management believes that this can only
be achieved by employee empowerment.
The Vishay corporate core values
• Leadership by example
• Employee empowerment
• Continuous improvement
• Total customer satisfaction
• Business excellence
are the very essence of the Vishay Quality Movement
process.
www.vishay.com
99
• Training
Vishay maintains that it can only realize its aims if the
employees are well trained. It therefore invests
heavily in courses to provide all employees with the
knowledge they need to facilitate continuous improvement. A training profile has been established for all
employees with emphasis being placed on Total
Quality Leadership. Our long-term aim is to continuously improve our training so as to keep ahead of projected changes in business and technology.
• EFQM Assessment Methodology
From 1995, Vishay has started to introduce the
EFQM (European Foundation for Quality Management) methodology for structuring its Total Quality
Management approach. This methodology, similar to
the Malcolm Baldrige process, consists in selfassessing the various Vishay divisions and facilities
according to nine business criteria:
• Leadership
• People
• Policy & Strategy
• Partnership & Resources
• Processes
• People Results
• Customer Results
• Society Results
• Key Performance Results
(See figure 3)
RESUL TS
People related
People related
Results
Results
Politicy and
Politicy and
Strateg y
Strategy
Processes
Processes
Leadership
Leadership
People
People
Partnerships and
Partnerships and
Resources
Resources
Customer related
Customer related
Results
Results
Society related
Society related
Results
Results
I NNOV A TI ON & L EA RNI NG
Key Performance
Key Performance
Results
Results
ENA BL ERS
The assessments are conducted on a yearly basis by
trained and empowered, internal Vishay assessors.
This permits the identification of keypriority improvement projects and the measurement of the progress
accomplished.
The EFQM methodology helps Vishay to achieve
world-class business excellence.
• Empowered Improvement Teams (EITs)
At Vishay we believe that every person in the company has a contribution to make in meeting our target
of customer satisfaction. Management therefore
empowers employees to higher and higher levels of
motivation, thus achieving higher levels of effectiveness and productivity. Empowered improvement
teams, which are both functional and cross functional,
combine the varied talents from across the breadth of
the company. By taking part in training, these teams
are continually searching for ways to improve their
jobs, achieving satisfaction for themselves, the company and most important of all the customer.
19595
Figure 3. EFQM criteria for self-assessment
www.vishay.com
100
Rev. 1.3, 20-Sep-06
TQM Tools
As part of its search for excellence, Vishay employs
many different techniques and tools. The most important of them are:
• Auditing
As well as third party auditing employed for approval
by ISO 9000 and customers, Vishay carries out its
own internal and external auditing. There is a common auditing procedure for suppliers and sub-contractors between the Vishay entities. This procedure
is also used for inter-company auditing between the
facilities within Vishay. It is based on the "Continuous
Improvement" concept with heavy emphasis on the
use of SPC and other statistical tools for the control
and reduction of variability.
Internal audits are carried out on a routine basis. They
include audits of satellite facilities (i.e., sales offices,
warehousing etc.). Audits are also used widely to
determine attitudes and expectations both within and
outside the company.
more efficient and promoting common understanding
among team members of the methods and principles
used.
• Gauge Repeatability and Reproducibility
(GR&R)
This technique is used to determine equipment’s suitability for purpose. It is used to make certain that all
equipment is capable of functioning to the required
accuracy and repeatability. All new equipment is
approved before use by this technique.
• Quality Function Deployment (QFD)
QFD is a method for translating customer requirements into recognizable requirements for Vishay’s
marketing, design, research, manufacturing and
sales (including after-sales). QFD is a process, which
brings together the life cycle of a product from its conception, through design, manufacture, distribution
and use until it has served its expected life.
Quality Service
Vishay believes that quality of service is equally as
important as the technical ability of its products to
meet their required performance and reliability.
• Our objectives therefore include:
• On-time delivery
• Short response time to customers’ requests
• Rapid and informed technical support
• Fast handling of complaints
• A partnership with our customers
18351
• Failure Mode and Effect Analysis (FMEA)
FMEA is a technique for analyzing the possible methods of failure and their effect upon the performance/
reliability of the product/process. Process FMEAs are
performed for all processes. In addition, product
FMEAs are performed on all critical or customer products.
• Design of Experiments (DOE)
There is a series of tools that may be used for the statistical design of experiments. It consists of a formalized procedure for optimizing and analyzing
experiments in a controlled manner. Taguchi and factorial experiment design are included in this. They
provide a major advantage in determining the most
important input parameters, making the experiment
Rev. 1.3, 20-Sep-06
18352
• Customer Complaints
Complaints fall mainly into two categories:
• Logistical
• Technical
www.vishay.com
101
Vishay has a procedure detailing the handling of complaints. Initially complaints are forwarded to the
appropriate sales office where in-depth information
describing the problem, using the Vishay Product
Analysis Request and Return Form (PARRF), is of
considerable help in giving a fast and accurate
response. If it is necessary to send back the product
for logistical reasons, the Sales Office issues a
Returned Material Authorization (RMA) number. On
receipt of the goods in good condition, credit is automatically issued. If there is a technical reason for
complaint, sample together with the PARRF is sent to
the Sales Office for forwarding to the Failure Analysis
Department of the supplying facility. The device’s
receipt will be acknowledged and a report issued on
completion of the analysis. The cycle time this analysis has set targets and is constantly monitored in
order to improve the response time. Failure analysis
normally consists of electrical testing, functional testing, mechanical analysis (including X-ray), decapsulation, visual analysis and electrical probing. Other
specialized techniques (i.e. LCD, thermal imaging,
SEM, acoustic microscopy) may be used if necessary.
If the analysis uncovers a quality problem, Corrective
Action Report (CAR) in 8D format will be issued. Any
subsequent returns are handled with the RMA procedure.
18353
Customer notifies Vishay Sales
Office of a complaint and Sales obtains
the necessary information about return
using attached form (Product Analysis
Request and Return Form)
Customer has a complaint
regarding Commercial Aspects
e.g. Incorrect products, stock
rotation, wrong delivery times or
quantities
Customer has a complaint
regarding Technical Aspects e.g.
Product out of specification,
labeling error, and packaging
issues
Customer sends samples to
designated factory location
(communicated by Sales)
Customer receives an analysis
report from Vishay with reference
number
End of return procedure
No
Entitled to
return/replacement
products
Yes
Sales assign RMA number
and Customer returns
product
18354
Complaint and Return Procedure
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102
Rev. 1.3, 20-Sep-06
Product A nalysis Request and Return Form
Address Data
Customer:
Address:
Sales Ref.No:
Sales Office:
Incoming Date:
Customer Ref.-No:
Cust. Contact
Person:
E-Mail:
Phone:
Fax:
Sales Contact
Person:
E-Mail:
Phone:
Fax:
Product A nalysis Request
Device:
Date Code:
Qty. for Analysis:
Failure Rate:
Plant Code:
Type of Complaint (pls. specify)
Electr.
Mechan.
Others
Failure description
Point of Failure:
Qualification
Reliability
Others
Incoming
Assembly
Field Failure
Stress Conditions before Failure:
(Temp / %HR / Voltage / Others)
Application:
(please specify)
Remarks / Other Data:
(please specify)
Return Request
Device:
Date Code:
Inv. No.:
Commercial Return
Technical Return
RMA-No. :
( mandatory )
CAR-No.
of 8D - Report:
QM Vishay
Issue: 02.10.2000
19596
Product Analysis Request and Return Form (PARRF)
Rev. 1.3, 20-Sep-06
www.vishay.com
103
Company Address
CAR Number:
Page: 1
VISHAY Company Name
8D Report
Company Phone Number
Report Date:
Complete following for all applicable items:
Date Opened:
Originator
Vishay Location:
Vishay Part No.:
Plant code:
Customer:
Date Code:
Lot Serial No.:
Customer Location:
Device Type:
Lot size:
Customer Ref. Code:
Value:
Sample Qty:
Customer Part No.:
Tolerance:
Failure rate:
Customer P.O. No.:
RMA Number:
Analysis Code:
Company Specific Information
Package Type:
8D APPROACH – Disciplines 1, 2, and 4 below must be completed for ALL requests.
DISCIPLINE 1: ESTABLISH TEAMS
DISCIPLINE 2: DESCRIBE PROBLEM
DISCIPLINE 3: CONTAINMENT ACTIONS
DISCIPLINE 4: ROOT CAUSE/RESULTS
If VALID, ALL Disciplines must be completed.
DISCIPLINE 5: CORRECTIVE ACTIONS
DISCIPLINE 6: IMPLEMENT CORRECTIVE ACTIONS
DISCIPLINE 7: PREVENT RECURRENCE
DISCIPLINE 8: CONGRATULATE TEAM
Revised by:
Approved by:
Rev.:
Date:
Date:
Date Closed:
Form # CQA004 Rev B 04/26/02
MANUFACTURER OF ONE OF THE WORLD’S BROADEST LINE OF DISCRETE SEMICONDUCTORS AND PASSIVE COMPONENTS
Confidential Information
19598
Vishay 8D form
www.vishay.com
104
Rev. 1.3, 20-Sep-06
• Change Notification
All product and process changes are controlled and
released via ECN (Engineering Change Notification).
This requires the approval of the relevant departments. In the case of a major change, the change is
forwarded to customers via Sales/ Marketing before
implementation. Where specific agreements are in
place, the change will not be implemented unless
approved by the customer.
• Ship-to-Stock/Ship-to-Line (STS/STL)
Many customers now require devices to be shipped
direct to stock or to the production line by omitting any
goods inwards inspection. Vishay welcomes such
agreements as part of its customer partnership program, which promises an open approach in every
aspect of its business. A product will only be supplied
as STS or STL if there is a valid agreement in place
between the two companies. Such an agreement
details the quality level targets agreed upon between
the companies and the methods to be used in case of
problems.
Assurance Program
Though both quality and reliability are designed into
all Vishay products, three basic programs must
assure them:
• Average Outgoing Quality (AOQ) –
100 % testing is followed by sample testing to
measure the defect level of the shipped product.
This defect level (AOQ) is measured in ppm (parts
per million).
• Reliability qualification program –
to assure that the design, process or change is
reliable.
• Reliability monitoring program –
to measure and assure that there is no decrease
in the reliability of the product.
AOQ Program
Before leaving the factory, all products are sampled
after 100% testing to ensure that they meet a minimum quality level and to measure the level of defects.
The results are accumulated and expressed in ppm
(parts per million). They are the measure of the average number of potentially failed parts in deliveries
over a period of time. The sample size used is determined by AQL or LTPD tables depending upon the
product. No rejects are allowed in the sample.
The AOQ value is calculated monthly using the
method defined in standard JEDEC 16:
6
AOQ = p LAR 10 ppm where:
number of devices rejected
p = -------------------------------------------------------------------------------total number of devices tested
LAR = lot acceptance rate:
number of lots rejected
LAR = 1 – --------------------------------------------------------------------total number of lots tested
18357
Rev. 1.3, 20-Sep-06
The AOQ values are recorded separately with regard
to electrical and mechanical (visual) rejects by product type and package.
The actual qualification procedure depends on which
of these (or combinations of these) are to be qualified.
Normally there are three categories of qualification in
order of degree of qualification and testing required:
• New technology or process (this includes a new
design on a new process)
www.vishay.com
105
• New product or re-designed product using a qualified process
New package including piece-part or material
change
New manufacturing location
• Minor change of process, assembly or package
Accelerated testing is normally used in order to produce results fast. The stress level employed depends
upon the failure mode investigated. The stress test is
set so that the level used gives the maximum acceleration without introducing any new or untypical failure
mode.
The tests used consist of a set of the following:
• High temperature life test (static)
• High temperature life test (dynamic)
• HTRB (High Temperature Reverse Bias)
• Humidity 85/85 (with or without bias)
• HAST (Highly Accelerated Stress Test)
• Temperature cycling
• High-temperature storage
• Low-temperature storage
• Marking permanency
• Lead integrity
• Solderability
• Resistance to solder heat
• Mechanical shock (not plastic packages)
• Vibration (not plastic packages)
• ESD characterization
SMD devices only are subjected to preconditioning to
simulate board assembly techniques using the methods defined in standard JSTD 020A before being subjected to stresses.
Normally, the endpoint tests are related to the data
sheet or to specified parameters. Additionally, they
may include:
• Destructive physical analysis
• X-ray
• Delamination testing using scanning acoustic
microscope
• Thermal imaging
• Thermal and electrical resistance analysis
Qualificationprocedure
procedure
Qualification
Waferprocess
process
Wafer
Package
Package
DeviceType
Type
Device
qualification
qualification
qualification
qualification
qualification
qualification
Monitoring
Monitoring
Processchange
change
Process
qualification
qualification
18358
18358
www.vishay.com
106
Rev. 1.3, 20-Sep-06
TFDU
TFDU 6102
6102 // TFDU
TFDU 6108
6108
Low
Low Profile
Profile Transceiver
Transceiver Module
Module
18359
18359
Example of the QualPack
Rev. 1.3, 20-Sep-06
www.vishay.com
107
Reliability Monitoring & Wear Out
Reliability Principles
The monitoring program consists of short-term monitoring to provide fast feedback on a regular basis in
case of a reduction in reliability and to measure the
Early-life Failure Rate (EFR). At the same time, Longterm monitoring is used to determinate the Long-term
steady-state Failure Rate (LFR). The tests used are a
subset from those used for qualification and consist
of:
• Life tests
• Humidity tests
• Temperature-cycling tests
• Solderability tests
• Resistance-to-solder-heat test
The actual tests used depend on the product
tested.
Depending on the assembly volume a yearly monitoring and wear out test plan is created.
Wear Out data are very important in Opto electronic
device. Out of that data degradation curves can be
made. These curves show the long time behavior of
the different devices.
Some typical curves are attached in this report.
Reliability is the probability of survival as a function of
time and stress, and is usually expressed in terms of
FITs (failures in 109 device hours). It is expressed as:
failure
failure
rate
rateλλ
Early-life
Early-life
failures
failures
(EFR)
(EFR)
Operating
Operatinglife
lifefailures
failures
(LFR)
(LFR)
F(t) + R(t) = 1 or R(t) = 1 – F(t)
where:
R(t) = probability of survival
F(t) = probability of failure
F(t) = 1-e-Ot
where
O = instantaneous failure rate
t = time
thus,
R(t) = e-Ot
The lifetime distribution or hazard rate curve is shown
on figure 4. This curve is also known as the 'bath-tub
curve' because of its shape. There are three basic
sections:
• Early-life failures (infant mortality)
• Operating-life failures (random failures)
• Wear-out failures
Wear-out
Wear-out
failures
failures
18374
18374
Figure 4. Bathtub curve
18353
The failure rate (l) during the constant (random) failure period is determined from life-test data. The failure rate is calculated from the formula:
r
r
O = ------------------------------------------- = ---6 Fi ti + N t C
where
www.vishay.com
108
Rev. 1.3, 20-Sep-06
O
= failure rate (hours-1)
r
= number of observed failures
fi
= failure number
= time to defect
ti
N
= good sample size
t
= entire operating time
C
= number of Components X hours
The result is expressed in either
a)
% per 1000 component hours by
multiplying by 105
or in
b)
FITs by multiplying by 109
(1 FIT = 10-9 hours -1)
Example 1: Determination of failure rate O 500
devices were operated over a period of 2000
hours (t) with:
1 failure (f1) after 1000 hours (t1) and
1 failure (f2) after 1500 hours (t2).
The failure rate of the given example can be
calculated as follows:
2
O = ---------------------------------------------------------------------------------------------------------- 1 1000h + 1 1500h + 498 2000h O = 2 10
–6
hours
-1
That means that this sample has an average
failure rate of 0.2 %/1000 hours or 2000 FIT
Observed failure rates as measured above are for the
specific lot of devices tested. If the predicted failure
rate for the total population is required, statistical confidence factors have to be applied.
The confidence factors can be obtained from "chi
square" (F2) charts. Normally, these charts show the
value of (F2/2) rather than F2. The failure rate is calculated by dividing the F2/2 factor by the number of component hours.
2
F e 2
O pop = -----------------C
Rev. 1.3, 20-Sep-06
The values for F2/2 are given in table 1
Number of Failures
Confidence Level
60 %
90 %
0
0.92
2.31
1
2.02
3.89
2
3.08
5.30
3
4.17
6.70
4
5.24
8.00
5
6.25
9.25
6
7.27
10.55
Table 1: F2/2 chart
Example 2: The failure rate of the population
Using example 1 with a failure rate of 2000
FIT and 2 failures:
F2/2 at 60% confidence is 3.08
O
pop
3.08
= ----------------------------- = 3085 FIT
5
9.985 10
This means that the failure rate of the population
will not exceed 3085 FIT with a probability of 60%
• Accelerated Stress Testing
In order to be able to assure long operating life with a
reasonable confidence, Vishay carries out accelerated testing on all its products. The normal accelerating factor is the temperature of operation. Most failure
mechanisms of semiconductors are dependent upon
temperature. This temperature dependence is best
described by the Arrhenius equation.
O T2 = O T1 u e
EA
1
-------- u § ------ – 1-·
© T1 -----k
T2¹
where
k
= Boltzmann's constant 8.63 x 10-5 eV/K
EA
= Activation energy (eV)
T1
= Operation temperature (K)
= Stress temperature (K)
T2
OT1 = Operation failure rate
OT2 = Stress-test failure rate
Using this equation, it is possible from the stress test
results to predict what would happen in use at the normal temperature of operation.
• Activation Energy
Provided the stress testing does not introduce a failure mode, which would not occur in practice, this
method gives an acceptable method for predicting
reliability using short test periods compared to the life
of the device. It is necessary to know the activation
www.vishay.com
109
energy of the failure mode occurring during the accelerated testing. This can be determined by experiment. In practice, it is unusual to find a failure or if
there is, it is a random failure mode. For this reason
an average activation energy is normally used for this
calculation. Though activation energies can vary
between 0.3 and 2.2 eV, under the conditions of use,
activation energies of between 0.6 and 0.9 eV are
used depending upon the technology.
Acceleration factor
Failure mechanism
Activation Energy
Mechanical wire shorts
0.3 – 0.4
Diffusion and bulk defects
0.3 – 0.4
Oxide defects
0.3 – 0.4
Top-to-bottom metal short
0.5
Electro migration
0.4 – 1.2
0.8 eV
Electrolytic corrosion
0.8 – 1.0
0.7 eV
Gold-aluminum intermetallics
0.8 – 2.0
0.6 eV
Gold-aluminum bond
degradation
1.0 – 2.2
Ionic contamination
1.02
Alloy pitting
1.77
1000
100
Activation Energies for common failure mechanisms
The activation energies for some of the major semiconductor failure mechanisms are given in the table
below. These are estimates taken from published literature.
0.5 eV
10
Table 2: Activation energies for common failure mechanism
100
1
55
75
95
120
115
150
135
155
Temperature (°C)
18361
Figure 5. Acceleration factor for different activation energies
normalized to T = 55 °C
Failure rates are quoted at an operating temperature
of 55 °C and 60 % confidence using an activation
energy (EA) of 0.8 eV for optoelectronic devices.
Example 3: Conversion to 55 °C
In Example 2, the life test was out at 150 °C
so to transform to an operating temperature
of 55 °C.
T1 = 273 + 55 = 328K
T1 = 273 + 150 = 423K
Acceleration factor =
O
O
423K T2 --------------- = ---------------------- = 258
O
O
328K T1 O
18362
www.vishay.com
110
328K O
423K 3080
= ---------------------- = ------------258
258
= 12 FIT
(at 55 °C with a confidence of 60 %)
This figure can be re-calculated for any
operating/junction temperature using this
method.
Rev. 1.3, 20-Sep-06
• EFR (Early Life Failure Rate)
This is defined as the proportion of failures, which will
occur during the warranty period of the system for
which they were designed. In order to standardize this
period, Vishay uses 1000 operation hours as the reference period. This is the figure also used by the
automotive industry; it equates to one year in the life
of an automobile. In order to estimate this figure,
Vishay normally operates a sample of devices for 48
or 168 hours under the accelerated conditions
detailed above. The Arrhenius law is then used as
before to calculate the failure rate at 55 °C with a confidence level of 60 %. This figure is multiplied by 1000
to give the failures in 1000 hours and by 106 to give a
failure in ppm. All EFR figures are quoted in ppm
(parts per million).
• Climatic Tests Models
Temperature cycling failure rate The inverse power
law is used to model fatigue failures of materials that
are subjected to thermal cycling. For the purpose of
accelerated testing, this model relationship is called
Coffin-Manson relationship, and can be expressed as
follows:
'T stress M
A F = § ----------------------·
© 'T use ¹
where:
AF
= Acceleration factor
'Tuse = temp. range under normal operation
'Tstress = temp. range under stress operation
M
= constant characteristic of the failure
mechanism.
Failure mechanism
Coffin–Manson exponent M
Al wire bond failure
3.5
Intermetallic bond fracture
4.0
Au wire bond heel crack
5.1
Chip-out bond failure
7.1
Table 3: Coffin - Manson exponent M
For instance:
'T use = 15 °C/ 60 °C = 45 °C
'T stress = – 25 °C/ 60 °C = 125 °C
Rev. 1.3, 20-Sep-06
125 °C 3
A F = § ------------------· | 21
© 45 °C ¹
Relative Humidity failure rate
Moisture effect modeling is based upon the HowardPecht-Peck model using the acceleration factor of the
equation shown below:
E
1
1
------A- § ------------ – ------------------·
k © T use T stress¹
RH stress C
A F = § -----------------------· e
© RH use ¹
where:
RHstress = relative humidity during test
RHuse = relative humidity during operation
Tstress = temperature during test
Tuse = temperature during operation
EA = activation energy
k = Boltzmann constant
C = material constant
For instance:
RHstress = 85 % RHuse = 92 %
Tuse = 313 K
Tstress = 358 K
AF
0, 8
1
1
------------------------------ § ---------- – ----------·
– 5 © 313 358¹
3
8,617
x
10
85
%
RH
= § ------------------------· e
© 92 % RH¹
A F | 33
This example shows how to transform test conditions
into environmental or into another test conditions.
This equation is applicable for devices subjected to
temperature humidity bias (THB) testing.
Using these acceleration factors the useful lifetime
can be calculated. Applying the acceleration factor
once more, useful lifetime for the moisture effect
model for parts subjected to THB can be estimated by
the following equation:
A F test hours
Useful life Years = ------------------------------------hours per year
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111
with:
Test hours = 1000
hours per year = 8760
AF | 118 (40 °C / 60 % RH)
118 1000
Useful life Years = --------------------------- | 13.5 years
8760
This means that operation in 40 °C / 60 % RH environment is good for around 13 years, calculated out
of the 85 °C/ 85 % RH 1000h humidity stress test.
18370
Wafer Level Reliability Testing
Due to the increasing demand for complex devices
with reduced geometry, Vishay is committed to
enhancing and improving process and product quality
through the use of Wafer Level Testing (WLT).
Through the use of custom-designed and standard
test devices and structures, the on-going design as
well as the process quality and reliability are monitored both at the wafer and package level. When
implemented in the manufacturing process, they provide a rapid means of monitoring metal integrity and
parameter stability.
The main tests are:
• Electro-migration
Commonly known as SWEAT (Standard Wafer- Level
Electro-migration Test), this test is used as a metallization process quality monitor.
• Mobile ion instability
Special sensitive transistors are used together with
built-in heaters to measure the effect of the movement of mobile ions at the interface region.
www.vishay.com
112
Handling for Quality
• Electrostatic Discharge (ESD) Precautions
Electrostatic discharge is defined as the high voltage,
which is generated when two dissimilar materials
move in contact with one another. This may be by rubbing (i.e. walking on a carpet) or by hot air or gas
passing over an insulated object. Sometimes, ESD is
easily detectable as when a person is discharged to
ground (shock).
Electronic devices may be irreversibly damaged
when subjected to this discharge. They can also be
damaged if they are charged to a high voltage and
then discharged to ground.
Damage due to ESD may occur at any point in the
process of manufacture and use of the device. ESD is
a particular problem if the humidity is low (< 40 %)
which is very common in non-humidified but air-conditioned buildings. ESD is not just generated by the
human body but can also occur with un-grounded
machinery.
ESD may cause a device to fail immediately or damage a device so that it will fail later. Whether this happens or not, usually depends on the energy available
in the ESD pulse.
All ESD-sensitive Vishay products are protected by
means of
• Protection structures on chip
• ESD protection measures during handling and
shipping
Vishay has laid down procedures, which detail the
methods to be used for protection against ESD. These
measures meet or exceed those of EN61340-5-1 or
MIL-STD-1686, the standards for ESD-protective and
preventative measures.
These include the use of:
• Grounded wrist straps
• Grounded benches
• Conductive floors
• Protective clothing
• Controlled humidity
It also lays down the methods for routinely checking
these and other items such as the grounding of
machines.
A semiconductor device is only completely protected
when enclosed in a «Faraday Cage». This is a completely closed conductive container (i.e., sealed conductive bag or box).
Most packaging material (i.e. tubes) used for semiconductors is now manufactured from antistatic material or anti-static-coated material. This does not mean
Rev. 1.3, 20-Sep-06
with a maximum temperature of 245 °C maximum
2 x with the total restricted to 3 soldering operations
Note: certain components may have limitations due to
their construction.
• Dry pack
When being stored, certain types of device packages
can absorb moisture, which is released during the soldering operations, thus causing damage to the
device. The so-called «popcorn» effect is such an
example. To prevent this, Surface Mount Devices
(SMD) are evaluated during qualification, using a test
consisting of moisture followed by soldering simulation (pre-conditioning) and then subjected to various
stress tests. In table Number 3 - Moisture Sensitivity
Levels – the six different levels, the floor life conditions as well as the soak requirements belonging to
these levels are described. Any device, which is
found to deteriorate under these conditions, is packaged in «dry pack».
The dry-packed devices are packed generally according to EIA-583 «Packaging Material Standards for
Moisture Sensitive Items», IPC-SM-786 «Recommended Procedures for Handling of Moisture Sensitive Plastic IC Packages».
The following are general recommendations:
• Shelf life in the packaging at < 40 °C and 90 % RH
is 12 months.
• After opening, the devices should be handled
according to the specifications mentioned on the
dry-pack label.
• If the exposure or storage time is exceeded, the
devices should be baked:
• Low-temperature baking - 192 hours at 40 °C and
5 % RH
• High-temperature backing - 24 hours at 125 °C.
that the devices are completely protected from ESD,
only that the packing will not generate ESD. Devices
are completely protected only when surrounded on all
sides by a conductive package.
It should also be remembered that devices can
equally as easily be damaged by discharge from a
high voltage to ground as vice-versa.
Testing for ESD resistance is part of the qualification
procedure. The methods used are detailed in MILSTD-883 Method 3015.7 (Human Body Model) and
EOS/ESD-S5.1-1993 (Machine Model) specification.
• Latch-up
The latch-up effect is a state in which a low impedance path results and persists following an input, output or the latch-up effect is a state in which a low
impedance path supply over voltage that triggers a
parasitic Thyristor.
Due to this effect an over current occurs in the IC,
which can destroy the IC. At least the supply voltage
of the IC must be cut off to get back the IC in a defined
state.
Normally, the latch-up test is carried out just at CMOS
ICs. This CMOS latch-up test is according to the
JEDEC 17 standard. For Bipolar ICs, there is no standard available so far.
• Soldering
All products are tested to ascertain their ability to withstand the industry standard soldering conditions after
storage. In general, these conditions are as follows.
• Hand soldering: 260 °C, 2 mm from the device
body for 10 s.
• Wave soldering: Double-wave soldering according
to CECC 00802 maximum 2 x total restricted to 3
soldering operations
• Reflow soldering: convection soldering according
to CECC 00802 with a maximum temperature of
260 °C, maximum 2 x with the total restricted to 3
soldering operations, IR soldering to CECC 00802
Floor
Life
Level
Conditions
Time
Time (hours)
Soak Requirements
Conditions
1
d30 °C / 90 % RH
Unlimited
85 °C / 85 % RH
2
d30 °C / 60 % RH
1 year
2a
d30 °C / 60 % RH
4 Weeks
168
168
696hrs
85 °C / 60 % RH
30 °C / 60 % RH
X
Y
Z
3
d30 °C / 60 % RH
168 h.
24
168
192
30 °C / 60 % RH
4
d30 °C / 60 % RH
72 h.
24
72
96
30 °C / 60 % RH
5
d30 °C / 60 % RH
24 / 48 h.
24
24 / 48
48 / 72
30 °C / 60 % RH
6
d30 °C / 60 % RH
6 h.
0
6
6
30 °C / 60 % RH
Table 4: Moisture Sensitivity Levels
Rev. 1.3, 20-Sep-06
www.vishay.com
113
X
Y
Z
= Default value of semiconductor manufacturer’s exposure time (MET) between bake and
bag plus the maximum time allowed out of the
bag at the distributor’s facility. The actual times
may be used rather than the default times, but
they must be used if they exceed the default
times.
= Floor life of package after it is removed from
dry pack bag (level 8 after completion of bake).
= Total soak time for evaluation (X + Y).
Note: There are two possible floor lives and soak
times in Level 5. The correct floor life will be determined by the manufacturer and will be noted on the
dry pack bag label per JEP 113.«Symbol and Labels
for Moisture Sensitive Devices».
www.vishay.com
114
Rev. 1.3, 20-Sep-06
Reliability & Statistics Glossary
Definitions
Accelerated Life Test: A life test under conditions
those are more severe than usual operating conditions. It is helpful, but not necessary, that a relationship between test severity and the probability
distribution of life be ascertainable.
Acceleration Factor: Notation: f(t) = the time transformation from more severe test conditions to the
usual conditions. The acceleration factor is f(t)/t. The
differential acceleration factor is df(t)/dt.
Acceptance number: The largest numbers of
defects that can occur in an acceptance sampling
plan and still have the lot accepted.
Acceptance Sampling Plan: An accept/reject test
the purpose of which is to accept or reject a lot of
items or material based on random samples from the
lot.
Assessment: A critical appraisal including qualitative
judgements about an item, such as importance of
analysis results, design criticality, and failure effect.
Attribute (Inspection By): A term used to designate
a method of measurement whereby units are examined by noting the presence (or absence) of some
characteristic or attribute in each of the units in the
group under consideration and by counting how many
units do (or do not) possess it. Inspection by attributes
can be two kinds: either the unit of product is classified simply as defective or no defective or the number
of defects in the unit of product is counted with
respect to a given requirement or set of requirements.
Attribute Testing: Testing to evaluate whether or not
an item possesses a specified attribute.
Auger Electron Spectrometer: An instrument, which
identifies elements on the surface of a sample. It
excites the area of interest with an electron beam and
observes the resultant emitted Auger electrons.
These electrons have the specific characteristics of
the near surface elements. It is usually used to identify very thin films, often surface contaminants.
Availability (Operational Readiness): The probability that at any point in time the system is either operating satisfactorily or ready to be placed in operation
on demand when used under stated conditions.
Average Outgoing Quality (AOQ): The average
quality of outgoing product after 100 % inspection of
rejected lot, with replacement by good units of all
defective units found in inspection.
Rev. 1.3, 20-Sep-06
Bathtub Curve: A plot of failure rate of an item
(whether repairable or not) vs. time. The failure rate
initially decreases, then stays reasonably constant,
then begins to rise rather rapidly. It has the shape of
bathtub. Not all items have this behaviour.
Bias: (1) The difference between the s-expected
value of an estimator and the value of the true parameter; (2) Applied voltage.
Burn-in: The initial operation of an item to stabilize its
characteristics and to minimize infant mortality in the
field.
Confidence Interval: The interval within which it is
asserted that the parameters of a probability distribution lies.
Confidence Level:
Equals 1 - D where D = the risk (%).
Corrective Action: A documented design, process,
procedure, or materials change to correct the true
cause of a failure. Part replacement with a like item
does not constitute appropriate corrective action.
Rather, the action should make it impossible for that
failure to happen again.
Cumulative Distribution Function (CDF): The probability that the random variable takes on any value
less than or equal to a value x, e.g.
F(x) = CDF (x) = Pr (x d X).
Defect: A deviation of an item from some ideal state.
The ideal state usually is given in a formal specification.
Degradation: A gradual deterioration in performance
as a function of time.
Derating: The intentional reduction of stress /
strength ratio in the application of an item, usually for
the purpose of reducing the occurrence of stressrelated failures.
Duty Cycle: A specified operating time of an item, followed by a specified time of no operation.
Early Failure Period: That period of life, after final
assembly, in which failures occur at an initially high
rate because of the presence of defective parts and
workmanship. This definition applies to the first part of
the bathtub curve for failure rate (infant mortality).
EDX Spectrometer: Generally used with a scanning
electron microscope (SEM) to provide elemental
analysis of X-rays generated on the region being hit
by the primary electron beam.
Effectiveness: The capability of the system or device
to perform its function.
EOS – Electrical Overstress: The electrical stressing of electronic components beyond specifications.
May be caused by ESD.
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115
ESD – Electrostatic Discharge: The transfer of electrostatic charge between bodies at different electrostatic potentials caused by direct contact or induced
by an electrostatic field. Many electronic components
are sensitive to ESD and will be degraded or fail.
Expected Value: A statistical term. If x is a random
variable and F (x) it its CDF, the E (x) = xdF (x), where
the integration is over all x. For continuous variables
with a pfd, this reduces to E (x) = ³ x pfd (x) dx. For discrete random variables with a pfd, this reduces to
E (x) = 6xnp (xn) where the sum is over all n.
Exponential Distribution: A 1-parameter distribution
(O > 0, t d 0) with: pfd (t) = lexp (-Ot);
Cdf (t) 0 1 – exp (-Ot); Sf (t) = exp (-Ot) ;
failure rate = O; mean time-to-failure = 1/O. This is the
constant failure-rate-distribution.
Failure: The termination of the ability of an item to perform its required function.
Failure Analysis: The identification of the failure
mode, the failure mechanism, and the cause (i.e.,
defective soldering, design weakness, contamination,
assembly techniques, etc.). Often includes physical
dissection.
Failure, Catastrophic: A sudden change in the operating characteristics of an item resulting in a complete
loss of useful performance of the item.
Failure, Degradation: A failure that occurs as a result
of a gradual or partial change in the operating characteristics of an item.
Failure, Initial: The first failure to occur in use.
Failure, Latent: A malfunction that occurs as a result
of a previous exposure to a condition that did not
result in an immediately detectable failure. Example:
Latent ESD failure.
Failure Mechanism: The mechanical, chemical, or
other process that results in a failure.
Failure Mode: The effect by which a failure is
observed. Generally, describes the way the failure
occurs and tells "how" with respect to operation.
Failure Rate: (A) The conditional probability density
that the item will fail just after time t, given the item has
not failed up to time t; (B) The number of failures of an
item per unit measure of life (cycles, time, miles,
events, etc.) as applicable for the item.
Failure, Wearout: Any failure for which time of occurrence is governed by rapidly increasing failure rate.
FIT: Failure Unit; (also, Failures In Time) Failures per
109 hours.
Functional Failure: A failure whereby a device does
not perform its intended function when the inputs or
controls are correct.
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116
Gaussian Distribution: A 2-parameter distribution
with:
1 § x – u· 2
--- -----------V ¹
2©
1
pfd (x) = ------------- e
V 2S
Cdf (x) = guaf (x). SF (x) = gaufc (x). "Mean value of
x" u, "standard deviation of x" = V
Hazard Rate: Instantaneous failure rate.
Hypothesis, Null: A hypothesis stating that there is
no difference between some characteristics of the
parent populations of several different samples, i.e.,
that the samples came from similar populations.
Infant Mortality: Premature catastrophic failures
occurring at a much greater rate than during the
period of useful life prior to the onset of substantial
wear out.
Inspection: The examination and testing of supplies
and services (including when appropriate, raw materials, components, and intermediate assemblies) to
determine whether they conform to specified requirements.
Inspection by Attributes: Inspection whereby either
the unit of product or characteristics thereof is classified simply as defective or no defective or the number
of defects in the unit of product is counted with
respect to a given requirement.
Life Test: A test, usually of several items, made for
the purpose of estimating some characteristic(s) of
the probability distribution of life.
Lot: A group of units from a particular device type
submitted each time for inspection and / or testing is
called the lot.
Lot Reject Rate (LRR): The lot reject rate is the percentage of lots rejected form the lots evaluated.
Lot Tolerance Percent Defective (LTPD): The percent defective, which is to be, accepted a minimum or
arbitrary fraction of the time, or that percent defective
whose probability of rejection is designated by b.
Mean: (A) The arithmetic mean, the expected value;
(B) As specifically modified and defined, e.g., harmonic mean (reciprocals), geometric mean (a product), logarithmic mean (logs).
Mean Life: R(t)dt; where R(t) = the s-reliability of the
item; t = the interval over which the mean life is
desired, usually the useful life (longevity).
Mean-Life-Between-Failures: The concept is the
same as mean life except that it is for repaired items
and is the mean up-time of the item. The formula is
the same as for mean life except that R(t) is inter-
Rev. 1.3, 20-Sep-06
preted as the distribution of up-times. Mean-TimeBetween-Failures (MTBF): For a particular interval,
the total functioning life of a population of an item
divided by the total number of failures within the population during the measurement interval. The definition holds for time, cycles, miles, events, or other
measure of life units.
Mean-Time-To-Failure (MTTF): See "Mean Life".
Mean-Time-To-Repair (MTTR): The total corrective
maintenance time divided by the total number of corrective maintenance actions during a given period of
time.
MTTR: = G(t)dt; where G(t) = Cdf of repair time;
T – maximum allowed repair time, i.e., item is treated
as no repairable at this echelon and is discarded or
sent to a higher echelon for repair.
Operating Characteristic (OC) Curve: A curve
showing the relation between the probability of acceptance and either lot quality or process quality, whichever is applicable.
Part Per Million (PPM): PPM is arrived at by multiplying the percentage defective by 10,000.
Example: 0.1 % = 1,000 PPM.
Population: The totality of the set of items, units,
measurements, etc., real or conceptual that is under
consideration.
Probability Distribution: A mathematical function
with specific properties, which describes the probability that a random variable will take on a value or set of
values. If the random variable is continuous and well
behaved enough, there will be a pfd. If the random
variable is discrete, there will be a pmf.
Qualification: The entire process by which products
are obtained from manufacturers or distributors,
examined and tested, and then identified on a Qualified Product List.
Quality: A property, which refers to, the tendency of
an item to be made to specific specifications and / or
the customer’s express needs. See current publications by Juran, Deming, Crosby, et al.
Quality Assurance: A system of activities that provides assurance that the overall quality control job is,
in fact, being done effectively. The system involves a
continuing evaluation of the adequacy and effectiveness of the overall quality control program with a view
to having corrective measures initiated where necessary. For a specific product or service, this involves
verifications, audits, and the evaluation of the quality
factors that affect the specification, production
inspection, and use of the product or service.
Rev. 1.3, 20-Sep-06
Quality Characteristics: Those properties of an item
or process, which can be measured, reviewed, or
observed and which are identified in the drawings,
specifications, or contractual requirements. Reliability
becomes a quality characteristic when so defined.
Quality Control (QC): The overall system of activities
that provides a quality of product or service, which
meets the needs of users; also, the use of such a system.
Random Samples: As commonly used in acceptance sampling theory, the process of selecting sample units in such a manner that all units under
consideration have the same probability of being
selected.
Reliability: The probability that a device will function
without failure over a specified time period or amount
of usage at stated conditions.
Reliability Growth: Reliability growth is the effort, the
resource commitment, to improve design, purchasing, production, and inspection procedures to improve
the reliability of a design.
Risk: D : The probability of rejecting the null hypothesis falsely.
Scanning Electron Microscope (SEM): An instrument, which provides a visual image of the surface
features of an item. It scans an electron beam over
the surface of a sample while held in a vacuum and
collects any of several resultant particles or energies.
The SEM provides depth of field and resolution significantly exceeding light microscopy and may be used
at magnifications exceeding 50,000 times.
Screening Test: A test or combination of tests
intended to remove unsatisfactory items or those
likely to exhibit early failures.
Significance: Results that show deviations between
hypothesis and the observations used as a test of the
hypothesis, greater than can be explained by random
variation or chance alone, are called statistically significant.
Significance Level: The probability that, if the
hypothesis under test were true, a sample test statistic would be as bad as or worse than the observed
test statistic.
SPC: Statistical Process Control.
Storage Life (Shelf Life): The length of time an item
can be stored under specified conditions and still
meet specified requirements.
Stress: A general and ambiguous term used as an
extension of its meaning in mechanics as that which
could cause failure. It does not distinguish between
www.vishay.com
117
those things which cause permanent damage (deterioration) and those things, which do not (in the
absence of failure).
Variance: The average of the squares of the deviations of individual measurements from their average.
It is a measure of dispersion of a random variable or
of data.
Wearout: The process of attribution which results in
an increase of hazard rate with increasing age
(cycles, time, miles, events, etc.) as applicable for the
item.
Abbreviations
AQL
CAR
DIP
ECAP
EMC
EMI
EOS
ESD
FAR
FIT
FMEA
FTA
h (t)
LTPD
MOS
MRB
MTBF
MTTF
MTTR
PPM
PRST
QA
QC
QPL
RPM
SCA
SEM
TW
Z (t)
O
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118
Acceptable Quality Level
Corrective Action Report / Request
Dual In-Line Package
Electronic Circuit Analysis Program
Electro Magnetic Compatibility
Electro Magnetic Interference
Electrical Overstress
Electrostatic Discharge
Failure Analysis Report / Request
(Failure In Time) Failure Unit; Failures /
109 hours
Failure Mode and Effects Analysis
Fault Tree Analysis
Hazard Rate
Lot Tolerance Percent Defective
Metal Oxide Semiconductor
Material Review Board
Mean-Time-Between-Failures
Mean-Time-To-Failure
Mean-Time-To-Repair
Parts Per Million
Probability Ratio Sequential Test
Quality Assurance
Quality Control
Qualified Products List
Reliability Planning and Management
Sneak Circuit Analysis
Scanning Electron Microscope
Wearout Time
Hazard Rate
Failure Rate (Lambda)
Rev. 1.3, 20-Sep-06
Contents
TFBS4650..............................120
TFBS4652..............................131
TFBS4710..............................142
TFBS4711..............................151
SIR
TFDU4100 ............................. 160
TFDU4101 ............................. 171
TFDU4202 ............................. 185
(9.6 kbit/s to 115 kbit/s)
TFDU4203 ............................. 194
TFDU4300 ............................. 204
www.vishay.com
3
TFBS4650
Infrared Transceiver
9.6 kbit/s to 115.2 kbit/s (SIR)
Description
The TFBS4650 is one of the smallest IrDA® compliant
transceivers available. It supports data rates up to
115 kbit/s. The transceiver consists of a PIN photodiode, infrared emitter, and control IC in a single package.
20206
Features
• Compliant with the IrDA physical layer
IrPHY 1.4 (low power specification,
9.6 kbit/s to 115.2 kbit/s)
e4
• Link distance: 30 cm/20 cm full 15° cone
with standard or low power IrDA, respectively. Emission intensity can be set by an external
resistor to increase the range for extended low
power spec to > 50 cm
• Typical transmission distance to standard device:
50 cm
• Small package L 6.8 mm x W 2.8 mm x H 1.6 mm
• Low current consumption
75 μA idle at 3.6 V
• Shutdown current 10 nA typical at 25 °C
• Operates from 2.4 V to 3.6 V within specification
over full temperature range from - 25 °C to + 85 °C
• Split power supply, emitter can be driven by a separate power supply not loading the regulated. U.S.
Pat. No. 6,157,476
• Lead (Pb)-free device
• Qualified for lead (Pb)-free and Sn/Pb processing
(MSL4)
• Device in accordance with RoHS 2002/95/EC and
WEEE 2002/96/EC
Applications
• Mobile phone
• PDAs
Parts Table
Part
Description
Qty / Reel
TFBS4650-TR1
Oriented in carrier tape for side view surface mounting
1000 pcs
TFBS4650-TR3
2500 pcs
www.vishay.com
120
Rev. 1.1, 03-Jul-06
TFBS4650
Functional Block Diagram
VCC
Tri-State
Driver
PD
Amplifier
RXD
Comparator
IREDA
SD
Mode
Control
IRED Driver
TXD
IRED
IREDC
ASIC
GND
19283
Pin Description
Pin Number
Function
Description
1
IREDA
IRED Anode, connected via a current limiting resistor to VCC2. A separate
unregulated power supply can be used.
I/O
Active
2
IREDC
IRED Cathode, do not connect for standard operation
3
TXD
Transmitter Data Input. Setting this input above the threshold turns on the
transmitter.
This input switches the IRED with the maximum transmit pulse width of
about 50 μs.
I
HIGH
4
RXD
Receiver Output. Normally high, goes low for a defined pulse duration with
the rising edge of the optical input signal. Output is a CMOS tri-state driver,
which swings between ground and Vcc. Receiver echoes transmitter output.
O
LOW
5
SD
Shut Down. Logic Low at this input enables the receiver, enables the
transmitter, and un-tri-states the receiver output. It must be driven high for
shutting down the transceiver.
I
HIGH
6
VCC
Power Supply, 2.4 V to 3.6 V. This pin provides power for the receiver and
transmitter drive section. Connect VCC1 via an optional filter.
7
GND
Ground
Pinout
TFBS4650, bottom view
weight 0.05 g
19284
Rev. 1.1, 03-Jul-06
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121
TFBS4650
Reference point Pin, GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Symbol
Min
Max
Unit
Supply voltage range,
transceiver
Parameter
0 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.5
Typ.
6.0
V
transmitter
0 V < VCC1 < 3.6 V
VCC2
- 0.5
6.0
V
Voltage at RXD
All states
Vin
- 0.5
VCC + 0.5
V
Input voltage range, transmitter
TXD
Independent of VCC1 or VCC2
Vin
- 0.5
6.0
V
Input currents
For all pins, except IRED anode
pin
- 40
40
mA
Output sinking current
Power dissipation
PD
Junction temperature
Storage temperature range
Soldering temperature ***)
see section Recommended
Solder Profile
Repetitive pulse output current
< 90 μs, ton < 20 %
Average output current
(transmitter)
125
°C
- 25
+ 85
°C
Tstg
- 40
+ 100
°C
°C
IIRED (RP)
500
mA
IIRED (DC)
100
mA
Virtual source size
Method: (1-1/e) encircled
energy
d
Maximum Intensity for Class 1
IEC60825-1 or
EN60825-1,
edition Jan. 2001
Ie
*)
mA
mW
Tamb
TJ
Ambient temperature range
(operating)
20
250
0.8
mm
*)
mW/sr
(500)**)
Due to the internal limitation measures the device is a "class1" device.
**)
IrDA specifies the max. intensity with 500 mW/sr
***) Sn/Pb-free
soldering. The product passed VISHAY’s standard convection reflow profile soldering test.
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhY 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhY 1.1, followed by IrPhY 1.2, adding the SIR Low Power Standard. IrPhY 1.3 extended the Low
Power Option to MIR and FIR and VFIR was added with IrPhY 1.4. A new version of the standard in any case obsoletes the former version.
www.vishay.com
122
Rev. 1.1, 03-Jul-06
TFBS4650
Electrical Characteristics
Transceiver
Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Parameter
Test Conditions
Supply voltage range
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
V
130
μA
Dynamic supply current
Idle, dark ambient
SD = Low (< 0.8 V),
Eeamb = 0 klx,
ICC
90
ICC
75
2
Ee < 4 mW/m2
- 25 °C dT d+ 85 °C
Idle, dark ambient
SD = Low (< 0.8 V),
Eeamb = 0 klx,
μA
Ee < 4 mW/m2
T = + 25 °C
3
mA
ISD
0.1
μA
ISD
1.0
μA
°C
Peak supply current during
transmission
SD = Low, TXD = High
Iccpk
Shutdown supply current
dark ambient
SD = High
(> VCC - 0.5 V),
T = 25 °C, Ee = 0 klx
Shutdown supply current, dark
ambient
SD = High
(> VCC - 0.5 V),
- 25 °C dT d+ 85 °C
Operating temperature range
TA
- 25
+ 85
Input voltage low (TXD, SD)
VIL
- 0.5
0.5
V
VIH
VCC - 0.5
6.0
V
Input voltage high
VCC = 2.4 V to 3.6 V
Input voltage threshold SD
VCC = 2.4 V to 3.6 V
1.8
V
Output voltage low
VCC = 2.4 V to 3.6 V
CLOAD = 15 pF
VOL
- 0.5
VCC x 0.15
V
Output voltage high
VCC = 2.4 V to 3.6 V
CLOAD = 15 pF
VOH
VCC x 0.8
VCC + 0.5
V
RXD to VCC pull-up impedance
SD = VCC
VCC = 2.4 V to 5 V
RRXD
Input capacitance
(TXD, SD)
Rev. 1.1, 03-Jul-06
0.9
CI
1.35
500
k:
6
pF
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123
TFBS4650
Optoelectronic Characteristics
Receiver
Parameter
Test Conditions
Symbol
Min
Sensitivity:
Minimum irradiance Ee in
angular range *)**)
9.6 kbit/s to 115.2 kbit/s
O = 850 nm to 900 nm
Ee
Maximum irradiance Ee in
angular range ***)
O = 850 nm to 900 nm
Ee
5
(500)
No receiver output input
irradiance
According to IrDA IrPHY 1.4,
Appendix A1, fluorescent light
specification
Ee
4
(0.4)
Typ.
Max
Unit
40
(4.0)
81
(8.1)
mW/m2
(μW/cm2)
kW/m2
(mW/cm2)
mW/m2
(μW/cm2)
Rise time of output signal
10 % to 90 %, CL = 15 pF
tr (RXD)
20
100
ns
Fall time of output signal
90 % to 10 %, CL = 15 pF
tf (RXD)
20
100
ns
RXD pulse width of output
signal, 50%****)
Input pulse width
1.63 μs
tPW
1.7
2.9
μs
Receiver start up time
Power on delay
Latency
tL
2.0
100
150
μs
50
200
μs
*)
This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent
lamps
**) IrDA sensitivity definition: Minimum Irradiance E In Angular Range, power per unit area. The receiver must meet the BER specification
e
while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length
***) Maximum Irradiance E In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the maxe
imum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors. If
placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification.
****)
RXD output is edge triggered by the rising edge of the optical input signal. The output pulse duration is independent of the input pulse
duration.
For more definitions see the document “Symbols and Terminology” on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
www.vishay.com
124
Rev. 1.1, 03-Jul-06
TFBS4650
Transmitter
Parameter
Test Conditions
Symbol
Min
Max
Unit
IRED operating current, current
controlled
The IRED current is internally
controlled but also can be
reduced by an external resistor
R1
ID
200
400
mA
1
μA
4
150
mW/sr
Output leakage IRED current
Tamb = 85°C
Output radiant intensity *)
D = 0°, 15°, TXD = High, SD =
Low, VCC1 = 3.0 V, VCC2 = 3.0 V,
R1 = 30 :(resulting in about
50 mA drive current)
Ie
D = 0°, 15°, TXD = High, SD =
Low, VCC1 = 3.0 V, VCC2 = 3.0 V,
R1 = 0 :, If = 300 mA
Ie
VCC1 = 5.0 V, D = 0°, 15°
TXD = Low or SD = High
(Receiver is inactive as long as
SD = High)
Ie
Saturation voltage of IRED
driver
VCC = 3.0 V, If = 50 mA
IIRED
Optical rise time,
Optical fall time
Optical output pulse duration
25
mW/sr
0.04
VCEsat
Peak - emission wavelength
Typ.
mW/sr
0.4
Op
880
tropt,
tfopt
20
V
886
900
nm
100
ns
Input pulse width t < 30 μs
Input pulse width t t 30 μs
topt
topt
30
t
50
300
μs
μs
Input pulse width t = 1.63 μs
topt
1.45
1.61
2.2
μs
20
%
Optical overshoot
*)
The radiant intensity can be adjusted by the external current limiting resistor to adapt the intensity to the desired value. The given value
is for minimum current consumption. This transceiver can be adapted to > 50 cm operation by increasing the current to > 200 mA, e.g.
operating the transceiver without current control resistor (i.e. R1 = 0 :and using the internal current control.
Table 1.
Truth table
Inputs
Outputs
SD
TXD
Optical input Irradiance mW/m2
RXD
Transmitter
high
x
x
Tri-state floating with a weak
pull-up to the supply voltage
0
Ie
low
high
x
low (echo on)
low
high > 50μs
x
high
0
low
low
<4
high
0
low
low
> Min. irradiance Ee
< Max. irradiance Ee
low (active)
0
low
low
> Max. irradiance Ee
x
0
Rev. 1.1, 03-Jul-06
www.vishay.com
125
TFBS4650
Recommended Circuit Diagram
Operated at a clean low impedance power supply the
TFBS4650 needs only one additional external component when the IRED drive current should be minimized for minimum current consumption according
the low power IrDA standard. When combined operation in IrDA and Remote Control is intended no current limiting resistor is recommended.
However, depending on the entire system design and
board layout, additional components may be required
(see figure 1). When long wires are used for bench
tests, the capacitors are mandatory for testing rise/fall
time correctly.
VCC2
recommended to position C2 as close as possible to
the transceiver power supply pins.
When connecting the described circuit to the power
supply, low impedance wiring should be used.
In case of extended wiring the inductance of the
power supply can cause dynamically a voltage drop
at VCC2. Often some power supplies are not able to
follow the fast current is rise time. In that case another
10 μF cap at VCC2 will be helpful.
Keep in mind that basic RF-design rules for circuit
design should be taken into account. Especially
longer signal lines should not be used without termination. See e.g. "The Art of Electronics" Paul Horowitz,
Wienfield Hill, 1989, Cambridge University Press,
ISBN: 0521370957.
IRED Anode
R1
IRED Cathode
VCC1
GND
Table 2.
Recommended Application Circuit Components
VCC
R2
C1
C2
Ground
SD
SD
Component
Recommended Value
Txd
Txd
C1, C2
Rxd
Rxd
0.1 μF, Ceramic Vishay part#
VJ 1206 Y 104 J XXMT
R1
See table 3
R2
47 :, 0.125 W (VCC1 = 3 V)
19286
Table 3.
Recommended resistor R1 [:]
Figure 1. Recommended Application Circuit
The capacitor C1 is buffering the supply voltage Vcc2
and eliminates the inductance of the power supply
line. This one should be a small ceramic version or
other fast capacitor to guarantee the fast rise time of
the IRED current. The resistor R1 is necessary for
controlling the IRED drive current when the internally
controlled current is too high for the application.
Vishay transceivers integrate a sensitive receiver and
a built-in power driver. The combination of both needs
a careful circuit board layout. The use of thin, long,
resistive and inductive wiring should be avoided. The
inputs (TXD, SD) and the output RXD should be
directly (DC) coupled to the I/O circuit.
The capacitor C2 combined with the resistor R2 is the
low pass filter for smoothing the supply voltage.
As already stated above R2, C1 and C2 are optional
and depend on the quality of the supply voltages VCCx
and injected noise. An unstable power supply with
dropping voltage during transmission may reduce the
sensitivity (and transmission range) of the transceiver.
The placement of these parts is critical. It is strongly
www.vishay.com
126
VCC2
[V]
Minimized current consumption,
IrDA Low power compliant
2.7
24
3.0
30
3.3
36
Rev. 1.1, 03-Jul-06
TFBS4650
Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
260
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
10 s max. at 230 °C
240 °C max.
240
220
2...4 °C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 °C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Figure 2. Recommended Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS4650 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-SoakSpike (RSS) and Ramp-To-Spike (RTS). The RampSoak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-ToSpike profile is used increasingly. Shown below in figure 3 is VISHAY's recommended profiles for use with
the TFBS4650 transceivers. For more details please
refer to Application note: SMD Assembly Instruction.
Storage
transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4.
280
T ≥ 255 °C for 20 s max
260
T peak = 260 °C max.
240
T ≥ 217 °C for 50 s max
220
200
180
Temperature/°C
Temperature/°C
160 °C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 °C...4 °C/s
80
60
2 °C...4 °C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
Rev. 1.1, 03-Jul-06
Figure 3. Solder Profile, RSS Recommendation
www.vishay.com
127
TFBS4650
Package Dimensions
19322
Figure 4. TFBS4650 mechanical dimensions, tolerance ± 0.2 mm, if not otherwise mentioned
19729
Figure 5. TFBS4650 soldering footprint, tolerance ± 0.2 mm, if not otherwise mentioned
www.vishay.com
128
Rev. 1.1, 03-Jul-06
TFBS4650
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
Rev. 1.1, 03-Jul-06
W3 max.
www.vishay.com
129
TFBS4650
Tape Dimensions in mm
www.vishay.com
130
Rev. 1.1, 03-Jul-06
TFBS4652
Infrared Transceiver
9.6 kbit/s to 115.2 kbit/s (SIR)
Description
The TFBS4652 is one of the smallest IrDA compliant
transceivers available. It supports data rates up to
115 kbit/s. The transceiver consists of a PIN photodiode, infrared emitter, and control IC in a single package.
Features
20206
• Compliant with the IrDA® physical layer
IrPHY 1.4 (low power specification,
9.6 kbit/s to 115.2 kbit/s)
e4
• Link distance: 30 cm/20 cm full 15° cone
with standard or low power IrDA, respectively. Emission intensity can be set by an external
resistor to increase the range to > 50 cm
• Typical transmission distance to standard device:
50 cm
• Low current consumption
75 μA idle at 3.6 V
• Split power supply, emitter can be driven by a separate power supply not loading the regulated. U.S.
Pat. No. 6,157,476
• Adjustable to logic I/O voltage swing from 1.5 V to
5.5 V
(MSL4)
WEEE 2002/96/EC
Applications
• Mobile phone
• PDAs
Parts Table
Part
Description
Qty / Reel
TFBS4652-TR1
1000 pcs
TFBS4652-TR3
2500 pcs
Rev. 1.1, 03-Jul-06
www.vishay.com
131
TFBS4652
VCC
Vlog
Tri-State
Driver
PD
Amplifier
RXD
Comparator
IREDA
SD
Mode
Control
IRED Driver
IRED
TXD
ASIC
GND
19288
Pin Description
Pin Number
Function
Description
I/O
Active
1
IREDA
IRED Anode, connected via a current limiting resistor to Vcc2. A separate
unregulated power supply can be used.
2
RXD
Receiver Output. Normally high, goes low for a defined pulse duration with
the rising edge of the optical input signal. Output is a CMOS tri-state driver,
which swings between ground and Vlogic. Receiver echoes transmitter
output.
O
LOW
3
TXD
Transmitter Data Input. Setting this input above the threshold turns on the
transmitter.
This input switches the IRED with the maximum transmit pulse width of
about 50 μs.
I
HIGH
4
SD
Shut Down. Logic Low at this input enables the receiver, enables the
transmitter, and un-tri-states the receiver output. It must be driven high for
shutting down the transceiver.
I
HIGH
I
5
Vlogic
Reference for the logic swing of the output and the input logic levels.
6
VCC
Power Supply, 2.4 V to 3.6 V. This pin provides power for the receiver and
transmitter drive section. Connect Vcc1 via an optional filter.
7
GND
Ground
Pinout
Definitions:
weight 0.05 g
In the Vishay transceiver data sheets the following nomenclature is
used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared
standard with the physical layer version IrPhY 1.0
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhY 1.1, followed by IrPhY
1.2, adding the SIR Low Power Standard. IrPhY 1.3 extended the
19284
Low Power Option to MIR and FIR and VFIR was added with IrPhY
1.4. A new version of the standard in any case obsoletes the former
version.
www.vishay.com
132
Rev. 1.1, 03-Jul-06
TFBS4652
Symbol
Min
Max
Unit
transceiver
Parameter
0 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.5
Typ.
6.0
V
transmitter
0 V < VCC1 < 3.6 V
VCC2
- 0.5
6.0
V
Supply voltage range, digital
supply
0 V < VCC1 < 3.6 V
Vlogic
- 0.5
6.0
V
Voltage at RXD
All states
Vin
- 0.5
Vlogic + 0.5
V
Input voltage range, transmitter
TXD
Independent of Vdd or Vlogic
Vin
- 0.5
6.0
V
Input currents
pin
- 40
40
mA
Power dissipation
PD
TJ
(operating)
Storage temperature
Soldering temperature ***)
see section Recommended
Solder Profile
< 90 μs, ton < 20 %
(transmitter)
mA
mW
125
°C
Tamb
- 25
+ 85
°C
Tstg
- 40
+ 100
°C
°C
IIRED (RP)
500
mA
IIRED (DC)
100
mA
Virtual source size
energy
d
IEC60825-1 or
EN60825-1,
edition Jan. 2001
Ie
*)
20
250
0.8
mm
mW/sr
*)
(500)**)
Due to the internal limitation measures the device is a "class1" device.
**) IrDA
***)
specifies the max. intensity with 500 mW/s.r
Sn/Pb-free soldering. The product passed VISHAY’s standard convection reflow profile soldering test.
Rev. 1.1, 03-Jul-06
www.vishay.com
133
TFBS4652
Transceiver
Parameter
Test Conditions
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
V
130
μA
Dynamic Supply current
Idle, dark ambient
SD = Low (< 0.8 V),
Eeamb = 0 klx,
ICC
90
ICC
75
Iccpk
2
Ee < 4 mW/m2
- 25 °C dT d+ 85 °C
Idle, dark ambient
SD = Low (< 0.8 V),
Eeamb = 0 klx,
μA
Ee < 4 mW/m2
T = + 25 °C
Peak supply current during
transmission
Idle, dark ambient at Vlogic - pin SD = Low (< 0.8 V),
Eeamb = 0 klx,
3
mA
Ilogic
1
μA
Ee < 4 mW/m2
Dark ambient
SD = High
(> Vlogic - 0.5 V),
T = 25 °C, Ee = 0 klx
ISD
0.1
μA
ambient
SD = High
(> Vlogic - 0.5 V),
T = 70 °C, Ee = 0 klx
ISD
2.0
μA
ambient
SD = High
(> Vlogic - 0.5 V),
T = 85 °C, Ee = 0 klx
ISD
3.0
μA
+ 85
°C
Output voltage low
IOL = 0.2 mA,
VCC = 2.4 V
Cload = 15 pF
VOL
Output voltage high
IOL = 0.2 mA,
VCC = 2.4 V
Cload = 15 pF
VOH
RXD to Vcc pull-up impedance
SD = VCC,
VCC = 2.4 V to 5 V
RRXD
TA
Input voltage low
(TXD, SD)
Input voltage high
(TXD, SD)
VCC = 2.4 V to 3.6 V
Input voltage threshold SD
V CC = 2.4 V to 3.6 V
Input capacitance
(TXD, SD)
www.vishay.com
134
- 25
0.3
Vlogic - 0.5
V
Vlogic
500
V
k:
VIL
- 0.5
0.5
V
VIH
Vlogic - 0.5
Vlogic + 0.5
V
0.9
CI
0.5 x Vlogic 0.66 x Vlogic
6
V
pF
Rev. 1.1, 03-Jul-06
TFBS4652
Receiver
Parameter
Test Conditions
Symbol
Min
Sensitivity:
angular range *)**)
O = 850 nm to 900 nm
Ee
angular range ***)
O = 850 nm to 900 nm
Ee
5
(500)
No output receiver input
irradiance
According to IrDA IrPHY 1.4,
Appendix A1, fluorescent light
specification
Ee
4
(0.4)
Typ.
Max
Unit
40
(4.0)
81
(8.1)
mW/m2
(μW/cm2)
kW/m2
(mW/cm2)
mW/m2
(μW/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
20
100
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
20
100
ns
signal, 50 %****)
Input pulse width
1.63 μs
tPW
1.7
2.9
μs
Power on delay
tL
30
Latency
100
150
μs
50
100
μs
*)
lamps.
**) IrDA sensitivity definition: Minimum Irradiance E In Angular Range, power per unit area. The receiver must meet the BER specificae
tion while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length.
***) Maximum Irradiance E In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the
e
maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors.
If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification.
****) RXD output is edge triggered by the rising edge of the optical input signal. The output pulse duration is independent of the input pulse
duration.
Rev. 1.1, 03-Jul-06
www.vishay.com
135
TFBS4652
Transmitter
Parameter
Test Conditions
Symbol
Min
Max
Unit
IRED operating current, current
controlled
The IRED current is internally
controlled but also can be
reduced by an external resistor
R1
ID
200
400
mA
1
μA
4
150
mW/sr
Tamb = 85°C
Output radiant intensity*)
D = 0°, 15°, TXD = High, SD =
Low, VCC1 = 3.0 V, VCC2 = 3.0 V,
R1 = 30 :(resulting in about
50 mA drive current)
Ie
D = 0°, 15°, TXD = High, SD =
Low, VCC1 = 3.0 V, VCC2 = 3.0 V,
R1 = 0 :, If = 300 mA
Ie
VCC1 = 5.0 V, D = 0°, 15°
SD = High)
Ie
Saturation voltage of IRED
driver
VCC = 3.0 V, If = 50 mA
IIRED
Optical rise time,
Optical fall time
25
mW/sr
0.04
VCEsat
Typ.
mW/sr
0.4
Op
880
tropt,
tfopt
20
V
886
900
nm
100
ns
topt
topt
30
t
50
300
μs
μs
Input pulse width t = 1.63 μs
t opt
1.45
1.61
2.2
μs
20
%
Optical overshoot
*)
The radiant intensity can be adjusted by the external current limiting resistor to adapt the intensity to the desired value. The given value
is for minimum current consumption. This transceiver can be adapted to > 50 cm operation by increasing the current to > 200 mA, e.g.
operating the transceiver without current control resistor (i.e. R1 = 0 :) and using the internal current control.
Table 1.
Truth table
Inputs
TXD
RXD
Transmitter
high
x
x
Tri-state floating with a weak
pull-up to the supply voltage
0
Ie
low
high
x
low (echo on)
low
high > 100μs
x
high
0
low
low
<2
high
0
low
low
> Min. irradianceEe
low (active)
0
low
low
x
0
www.vishay.com
136
Outputs
SD
Rev. 1.1, 03-Jul-06
TFBS4652
TFBS4652 needs only one additional external component when the IRED drive current should be minimized for minimum current consumption according
the low power IrDA standard. When combined operation in IrDA and Remote Control is intended no current limiting resistor is recommended. When long
wires are used for bench tests, the capacitors are
mandatory for testing rise/fall time correctly.
VCC2
IRED Anode
R1
Vlogic
VCC1
Vlogic
VCC
R2
C1
GND
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
19289
The capacitor C1 is buffering the supply voltage VCC2
the IRED current. The resistor R1 is necessary for
controlling the IRED drive current when the internally
controlled current is too high for the application.
As already stated above R2, C1 and C2 are optional
and depend on the quality of the supply voltages VCCx
and injected noise. An unstable power supply with
dropping voltage during transmission may reduce the
sensitivity (and transmission range) of the transceiver.
Rev. 1.1, 03-Jul-06
When connecting the described circuit to the power
supply, low impedance wiring should be used.
In case of extended wiring the inductance of the
at VCC2. Often some power supplies are not apply to
10 μF cap at VCC2 will be helpful.
Wienfield Hill, 1989, Cambridge University Press,
ISBN: 0521370957.
Table 2.
Component
Recommended Value
C1, C2
0.1 μF, Ceramic, Vishay part#
R1
See table 3
R2
47 :, 0.125 W (VCC1 = 3 V)
Table 3.
Recommended resistor R1 [:]
VCC2
[V]
Minimized current consumption,
IrDA Low power compliant
2.7
24
3.0
30
3.3
36
www.vishay.com
137
TFBS4652
Manual Soldering
desoldering.
260
10 s max. at 230 °C
240 °C max.
240
220
2...4 °C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 °C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
use of forced convection reflow ovens the Ramp-ToSpike profile is used increasingly. Shown below in
figure 3 is VISHAY's recommended profiles for use
with the TFBS4652 transceivers. For more details
please refer to Application note: SMD Assembly
Instruction.
Storage
280
T ≥ 255 °C for 20 s max
260
240
T ≥ 217 °C for 50 s max
220
200
180
Temperature/°C
Temperature/°C
160 °C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 °C...4 °C/s
80
60
2 °C...4 °C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
www.vishay.com
138
Rev. 1.1, 03-Jul-06
TFBS4652
Package Dimensions in mm
19322
Figure 4. TFBS4652 mechanical dimensions, tolerance ± 0.2 mm, if not otherwise mentioned
19729
Figure 5. TFBS4652 soldering footprint, tolerance ± 0.2 mm, if not otherwise mentioned
Rev. 1.1, 03-Jul-06
www.vishay.com
139
TFBS4652
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
www.vishay.com
140
W3 max.
Rev. 1.1, 03-Jul-06
TFBS4652
19286
Rev. 1.1, 03-Jul-06
www.vishay.com
141
TFBS4710
Serial Infrared Transceiver SIR, 115.2 kbit/s,
2.7 V to 5.5 V Operation
Description
The TFBS4710 is a low profile, full range Infrared
Data Transceiver module. It supports IrDA data rates
up to 115.2 kbit/s (SIR). The transceiver module consists of a photo PIN photodiode, an infrared emitter
(IRED), and a low-power CMOS control IC to provide
a total front-end solution in a single package.
The device has a link distance of 1 meter. The RXD
pulse width is independent of the duration of TXD
pulse and always stays at a fixed width thus making
the device optimum for all standard SIR Encoder/
Decoder and interfaces. The Shut Down (SD) feature
cuts current consumption to typically 10 nA.
18071
Features
• Compliant with the latest IrDA physical
layer
specification (9.6 kbit/s to 115.2 kbit/s)
e4
• Small package:
H 2.74 mm x D 3.33 mm x L 8.96 mm
• Typical Link distance 1 m
• Drop in replacement for IRM5000D/ IRMT5000
• Battery & Power Management Features:
> Idle Current - 75 μA Typical
> Shutdown Current - 10 nA Typical
> Operates from 2.4 V - 5.0 V within specification
• Remote Control - transmit distance up to 8 meters
• Tri-State Receiver Output, floating in shutdown
with a weak pull-up
• Fixed RXD output pulse width (2 μs typical)
• Meets IrFM Fast Connection requirements
• Split power supply, an independant, unregulated
supply for IRED Anode and a well regulated
supply for VCC
• Directly Interfaces with Various Super I/O and
Controller Devices and Encoder/ Decoder such as
TOIM4232
(MSL4)
• Device in accordance to RoHS 2002/95/EC and
WEEE 202/96EC
Applications
•
•
•
•
•
•
•
Ideal for Battery Operated Devices
PDAs
Mobile Phones
Electronic Wallet (IrFM)
Notebook Computers
Digital Still and Video Cameras
Printers, Fax Machines, Photocopiers,
Screen Projectors
•
•
•
•
•
•
•
•
Data Loggers
External Infrared Adapters (Dongles)
Diagnostics Systems
Medical and Industrial Data Collection Devices
Kiosks, POS, Point and Pay Devices
GPS
Access Control
Field Programming Devices
Parts Table
Part
Description
Qty / Reel
TFBS4710-TR1
1000 pcs
TFBS4710-TT1
Oriented in carrier tape for top view surface mounting
1000 pcs
www.vishay.com
142
Rev. 1.5, 03-Jul-06
TFBS4710
VCC1
Push-Pull
Driver
Amplifier
Comparator
RXD
VCC2
Logic
&
SD
TXD
Controlled Driver
Control
RED C
GND
18282
Pinout
Definitions:
TFBS4710
weight 100 mg
standard with the physical layer version IrPhy 1.0
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2,
adding the SIR Low Power Standard. IrPhy 1.3 extended the Low
1
2
3
4
5
6
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4.
A new version of the standard in any case obsoletes the former ver-
18511
sion.
With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version
IrPhy 1.4 (in Oct. 2002).
Pin Description
Pin Number
Function
Description
1
IRED
Anode
IRED Anode is connected to a power supply. The LED current can be decreased
by adding a resistor in series between the power supply and IRED Anode. A
separate unregulated power supply can be used at this pin.
I/O
Active
2
TXD
This Input is used to turn on IRED transmitter when SD is low. An on-chip
protection circuit disables the LED driver if the TXD pin is asserted for longer than
80 μs
I
HIGH
3
RXD
Received Data Output, normally stays high but goes low for a fixed duration
during received pulses. It is capable of driving a standard CMOS or TTL load.
O
LOW
4
SD
Shutdown. Setting this pin active for more than 1.5 ms switches the device into
shutdown mode
I
HIGH
5
VCC
Regulated Supply Voltage
6
GND
Ground
Rev. 1.5, 03-Jul-06
www.vishay.com
143
TFBS4710
Reference Point Ground, Pin 6 unless otherwise noted.
Parameter
Test Conditions
Supply voltage range, all states
Input current
For all Pins except IRED Anode
Pin
Symbol
Min
VCC
- 0.3
Typ.
ICC
Output Sink Current, RXD
Average output current, pin 1
20 % duty cycle
Repetitive pulsed output current < 90 μs, ton < 20 %
IRED anode voltage, pin 1
Voltage at all inputs and outputs Vin > VCC is allowed
Power dissipation
See derating curve
Soldering temperature
Unit
V
10.0
mA
25.0
mA
IIRED (DC)
60
mA
IIRED (RP)
300
mA
V
VIREDA
- 0.5
+ 6.0
VIN
- 0.5
+ 6.0
V
200
mW
(operating)
Max
+ 6.0
125
°C
Tamb
- 30
+ 85
°C
Tstg
- 40
+ 100
°C
260
°C
Max
Unit
See Recommended Solder
Profile
Transceiver
Tamb = 25 °C, VCC = VIREDA = 2.4 V to 5.5 V unless otherwise noted.
Parameter
Test Conditions
Idle supply current at V CC1
(receive mode, no signal)
Symbol
Min
VCC
2.4
Typ.
5.5
V
130
μA
SD = Low, Ee = 1 klx*),
Tamb = - 25 °C to + 85 °C,
VCC1 = VCC2 = 2.7 V to 5.5 V
ICC1
90
Tamb = 25 °C,
VCC1 = VCC2 = 2.7 V to 5.5 V
ICC1
75
Receive current
VCC = 2.7 V
ICC
280
Shutdown current
SD = High, T = 25 °C, Ee = 0 klx
ISD
2
μA
SD = High, T = 85 °C
ISD
3
μA
μA
μA
TA
- 25
+ 85
°C
Output voltage low, RXD
IOL = 1 mA
VOL
- 0.5
0.15 x VCC
V
Output voltage high, RXD
IOH = - 500 μA
VOH
0.8 x VCC
VCC + 0.5
V
IOH = - 250 μA
VOH
0.9 x VCC
VCC + 0.5
V
RRXD
400
600
k:
RXD to VCC impedance
Input voltage low: TXD, SD
Input voltage high: TXD, SD
CMOS level (0.5 x VCC typ,
threshold level)
Input leakage current (TXD, SD) Vin = 0.9 x VCC
Controlled pull down current
SD, TXD = "0" or "1",
0 < Vin < 0.15 VCC
SD, TXD = "0" or "1"
Vin > 0.7 VCC
Input capacitance
www.vishay.com
144
500
VIL
- 0.5
0.5
V
VIH
VCC - 0.5
6.0
V
IICH
-2
IIRTx
IIRTx
CIN
-1
0
+2
μA
+ 150
μA
1
μA
5
pF
Rev. 1.5, 03-Jul-06
TFBS4710
Receiver
Tamb = 25 °C, VCC = 2.4 V to 5.5 V unless otherwise noted
Symbol
Min
Typ.
Max
Unit
Minimum detection threshold
irradiance, SIR mode
Parameter
O = 850 nm - 900 nm,
D = 0°, 15°
Test Conditions
Ee
10
(1.0)
25
(2.5)
40
(4)
mW/m2
Maximum detection threshold
irradiance
O = 850 nm - 900 nm
Ee
Maximum no detection
threshold irradiance
(μW/cm2)
5
(500)
Ee
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(μW/cm2)
10 % to 90 %, CL = 15 pF
tr(RXD)
10
100
90 % to 10 %, CL = 15 pF
tf(RXD)
10
100
ns
RXD pulse width
Input pulse width > 1.2 μs
tPW
1.65
3.0
μs
Leading edge jitter
Input Irradiance = 100 mW/m2,
d 115.2 kbit/s
250
ns
Standby /Shutdown delay
After shutdown active
150
μs
Receiver startup time
Power-on delay
150
μs
Latency
2.0
tL
ns
Transmitter
Parameter
Test Conditions
IRED operating current
Symbol
Min
Typ.
Max
Unit
ID
250
300
350
mA
Vf
1.4
1.8
1.9
V
IIRED
-1
1
μA
40
350
mW/sr
0.04
mW/sr
IRED forward voltage
Ir = 300 mA
IRED leakage current
TXD = 0 V, 0 < VCC < 5.5 V
Output radiant intensity
D = 0°, 15°, TXD = High,
SD = Low
Ie
VCC = 5.0 V, D = 0°, 15°,
TXD = High or SD = High (Receiver
is inactive as long as SD = High)
Ie
D
Output radiant intensity, angle of
half intensity
70
± 24
°
Peak-emission wavelength
Op
Spectral bandwidth
'O
Optical rise time
tropt
10
100
Optical fall time
tfopt
10
100
ns
Input pulse width 1.63 μs,
115.2 kbit/s
topt
1.46
1.8
μs
Input pulse width tTXD < 20 μs
topt
tTXD
t + 0.15
μs
Input pulse width tTXD t 20 μs
topt
50
μs
25
%
Optical overshoot
Rev. 1.5, 03-Jul-06
880
900
45
1.63
nm
nm
ns
www.vishay.com
145
TFBS4710
Manual Soldering
desoldering.
260
10 s max. at 230 °C
240 °C max.
240
220
2...4 °C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 °C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Storage
280
T ≥ 255 °C for 20 s max
260
240
T ≥ 217 °C for 50 s max
220
200
180
Temperature/°C
Temperature/°C
160 °C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 °C...4 °C/s
80
60
2 °C...4 °C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
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146
Rev. 1.5, 03-Jul-06
TFBS4710
Table 1.
High Operating Temperature > 70 °C
V CC
IR Controller
Vdd
Rled
TFBS4710
IREDA (1)
IRTX
IRRX
IRMODE
R1= 47:
TXD
(2)
RXD
(3)
SD
(4)
Vcc
(5)
GND
(6)
GND
C4
C2
C3
C1
4.7 μF 0.1μF 4.7 μF 0.1 μF
18281
The TFBS4710 integrates a sensitive receiver and a
built-in power driver. This combination needs a careful circuit layout. The use of thin, long, resistive and
inductive wiring should be avoided. The inputs (TXD,
SD) and the output (RXD) should be directly (DC)
coupled to the I/O circuit.
The combination of resistor R1 and capacitors C1,
C2, C3 and C4 filter out any power supply noise to
provide a smooth supply voltage.
The placement of these components is critical. It is
strongly recommended to position C3 and C4 as
close as possible to the transceiver power supply
pins. A Tantalum capacitor should be used for C1 and
C3 while a ceramic capacitor should be used for C2
and C4.
A current limiting resistor is not needed for normal
operation. It is strongly recommended to use the Rled
values mentioned in Table 1 below for high temperature operation. For Low Power Mode, IRED Anode
voltage of less than 5 V is recommended.
Under extreme EMI conditions as placing a RF transmitter antenna on top of the transceiver, it is recommended to protect all inputs by a low-pass filter, as
a minimum a 12 pF capacitor, especially at the RXD
port.
Basic RF design rules for circuit design should be followed. Especially longer signal lines should not be
used without proper termination. For reference see
"The Art of Electronics" by Paul Horowitz, Winfield
Hill, 1989, Cambridge University Press, ISBN:
0521370957.
Rev. 1.5, 03-Jul-06
Rled (:)
Rled (:)
VLED
(V)
Standard Power Mode
(Intensity > 40 mW/sr,
0° - 15°)
Low Power Mode
(Intensity > 3.6 mW/sr,
0° - 15°)
2.7
3
50
3.3
6
> 50
5.0
18
> 60
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the I/
O manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
Table 2.
Component
Recommended Value
C1, C3
4.7 μF, 16 V
Vishay Part Number
293D 475X9 016B
C2, C4
0.1 μF, Ceramic
R1
47 :, 0.125 W
CRCW-1206-47R0-F-RT1
Rled
See Table 1
www.vishay.com
147
TFBS4710
Table 3.
Truth table
Inputs
SD
TXD
Outputs
Optical input Irradiance
Remark
RXD
Transmitt
er
Operation
Shutdown
mW/m2
high
> 1 ms
x
x
weakly pulled
(500 :) to VCC1
0
low
high
x
high inactive
Ie
Transmitting
high
> μs
low
x
high inactive
0
Protection is active
<4
high inactive
0
low
> Min. Detection Threshold Irradiance
< Max. Detection Threshold Irradiance
low (active)
0
low
> Max. Detection Threshold Irradiance
undefined
0
Ignoring low signals below the
IrDA defined threshold for noise
immunity
Response to an IrDA compliant
optical input signal
Overload conditions can cause
unexpected outputs
Package Dimensions
18086
Drawing-No.: 6.550-5256.01-4
Issue: 1; 24.06.03
Figure 4. Package drawing TFBS4710
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148
Rev. 1.5, 03-Jul-06
TFBS4710
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
Rev. 1.5, 03-Jul-06
W3 max.
www.vishay.com
149
TFBS4710
Tape Dimensions
19611
Drawing-No.: 9.700-5299.01-4
Issue: 1; 18.08.05
Figure 5. Tape drawing for TFBS4710 for side view mounting
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150
Rev. 1.5, 03-Jul-06
TFBS4711
Description
The TFBS4711 is a low profile, Infrared Data Transceiver module. It supports IrDA data rates up to
115.2 kbit/s (SIR). The transceiver module consists of
a PIN photodiode, an infrared emitter (IRED), and a
low-power CMOS control IC to provide a total frontend solution in a single package.
The device is designed for the low power IrDA standard with an extended range on-axis up to 1 m. The
RXD pulse width is independent of the duration of
TXD pulse and always stays at a fixed width thus
making the device optimum for all standard SIR
Encoder/ Decoder and interfaces. The Shut Down
(SD) feature cuts current consumption to typically 10 nA.
20208
Features
• Compliant with the latest IrDA physical
layer low power specification
( 9.6 kbit/s to 115.2 kbit/s)
• Small package:
e4
H 1.9 mm x D 3.1 mm x L 6.0 mm
• Industries smallest footprint
- 6.0 mm length
- 1.9 mm height
• Typical Link distance on-axis up to 1 m
• Battery & power management features:
> Idle Current - 75 μA Typical
> Shutdown current - 10 nA typical
> Operates from 2.4 V - 5.5 V within specification
• Remote Control - transmit distance up to 8 meters
• Tri-State receiver output, floating in shutdown with
a weak pull-up
• Constant RXD output pulse width (2 μs typical)
• Meets IrFM Fast Connection requirements
• Split power supply, an independent, unregulated
supply for IRED Anode and a well regulated
supply for VCC
• Directly interfaces with various Super I/O and Controller Devices and Encoder/ Decoder such as
TOIM4232
(MSL4)
WEEE 2002/96EC
Applications
•
•
•
•
•
•
•
Ideal for battery operated devices
PDAs
Mobile phones
Electronic wallet (IrFM)
Notebook computers
Digital still and video cameras
Printers, fax machines, photocopiers,
screen projectors
•
•
•
•
•
•
•
•
Data loggers
External infrared adapters (Dongles)
Diagnostics systems
Medical and industrial data collection devices
Kiosks, POS, Point and Pay devices
GPS
Access control
Field programming devices
Parts Table
Part
Description
Qty / Reel
TFBS4711-TR1
1000 pcs
TFBS4711-TR3
2500 pcs
Rev. 1.8, 26-Sep-06
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151
TFBS4711
V CC
Amp
Comp
RXD
Driver
IRED A
Power
SD
Driver
Control
TXD
18280
GND
Pinout
Definitions:
TFBS4711
weight 50 mg
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy
PIN 1
1.2, adding the SIR Low Power Standard.
19428
Pin Description
Pin Number
Function
Description
1
IRED
Anode
IRED Anode is directly connected to a power supply. The LED current can be
decreased by adding a resistor in series between the power supply and IRED
Anode. A separate unregulated power supply can be used at this pin.
I/O
Active
2
TXD
This Input is used to turn on IRED transmitter when SD is low. An on-chip protection
circuit disables the LED driver if the TXD pin is asserted for longer than 80 Ps
I
HIGH
3
RXD
Received Data Output, normally stays high but goes low for a fixed duration during
received pulses. It is capable of driving a standard CMOS or TTL load.
O
LOW
4
5
6
SD
VCC
Shutdown. Setting this pin active switches the device into shutdown mode
Supply Voltage
Ground
I
HIGH
GND
Reference Point Ground, Pin 6 unless otherwise noted.
Parameter
Test Conditions
Input current
For all Pins except IRED Anode Pin
Symbol
Min
VCC
- 0.5
ICC
Output sink current, RXD
20 % duty cycle
Repetitive pulsed output current < 90 μs, ton < 20 %
Voltage at all inputs and outputs Vin > VCC is allowed
(operating)
www.vishay.com
152
See Recommended Solder Profile
Typ.
Max
Unit
+ 6.0
V
10.0
mA
25.0
mA
IIRED (DC)
80
mA
IIRED (RP)
400
mA
V
VIREDA
- 0.5
+ 6.0
VIN
- 0.5
+ 6.0
V
Tamb
- 30
+ 85
°C
Tstg
- 40
+ 100
°C
260
°C
Rev. 1.8, 26-Sep-06
TFBS4711
Eye safety information
Symbol
Min
Typ.
Virtual source size
Parameter
energy
Test Conditions
d
1.3
1.5
Maximum intensity for class 1
IEC60825-1 or EN60825-1,
edition Jan. 2001, operating
below the absolute maximum
ratings
Ie
Max
Unit
mm
mW/sr
*)
(500)**)
Transceiver
Tamb = 25 °C, VCC = VIREDA = 2.4 V to 5.5 V unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
VCC
2.4
Typ.
SD = Low, Ee = 1 klx ,
Tamb = - 25 °C to + 85 °C,
VCC = 2.7 V to 5.5 V
ICC1
Tamb = 25 °C,
VCC = 2.7 V to 5.5 V
ICC1
Receive current
VCC = 2.7 V
ICC
80
Shutdown current
ISD
< 0.1
ISD
*)
Max
Unit
5.5
V
130
μA
75
μA
μA
2
μA
3
μA
TA
- 25
+ 85
°C
IOL = 1 mA
VOL
- 0.5
0.15 x VCC
V
IOH = - 500 μA
VOH
0.8 x VCC
VCC + 0.5
V
IOH = - 250 μA
VOH
0.9 x VCC
VCC + 0.5
V
RRXD
400
600
k:
RXD to VCC impedance
Input voltage low: TXD, SD
500
VIL
- 0.5
0.5
V
VIH
VCC - 0.5
6.0
V
Input leakage current (TXD, SD) Vin = 0.9 x VCC
IICH
-2
SD, TXD = "0" or "1",
0 < Vin < 0.15 VCC
IIRTx
SD, TXD = "0" or "1"
Vin > 0.7 VCC
IIRTx
Input voltage high: TXD, SD
Input capacitance
Rev. 1.8, 26-Sep-06
CMOS level (0.5 x VCC typ,
threshold level)
CIN
-1
0
+2
μA
+ 150
μA
1
μA
5
pF
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153
TFBS4711
Receiver
Tamb = 25 °C, VCC = 2.4 V to 5.5 V unless otherwise noted
Parameter
Test Conditions
Symbol
angular range **)
O = 850 nm - 900 nm,
D = 0 °, 15 °
Ee
angular range***)
O = 850 nm - 900 nm
Ee
irradiance
Ee
Min
Typ.
Max
Unit
35
(3.5)
80
(8)
mW/m2
5
(500)
(μW/cm2)
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(μW/cm2)
10 % to 90 %, CL = 15 pF
tr(RXD)
10
100
ns
90 % to 10 %, CL = 15 pF
tf(RXD)
10
100
ns
RXD pulse width
Input pulse width > 1.2 μs
tPW
1.7
Leading edge jitter
Standby /Shutdown delay,
receiver startup time
3.0
μs
Input Irradiance = 100 mW/m2,
d 115.2 kbit/s
250
ns
After shutdown active
or power-on
150
μs
150
μs
Latency
2.0
tL
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length.
e
If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER).
Transmitter
Symbol
Min
Typ.
Max
Parameter
Tamb = - 25 °C to + 85 °C
Test Conditions
ID
200
300
400
Transceiver operating peak
supply current
During pulsed IRED operation
@ ID = 300 mA
ICC
0.57
Unit
mA
mA
IRED leakage current
TXD = 0 V, 0 < VCC < 5.5 V
IIRED
-1
1
μA
D = 0 °, TXD = High, SD = Low,
R = 0 :, VLED = 2.4 V
Ie
45
60
300
mW/sr
D = 0 °, 15 °, TXD = High, SD =
Low, R = 0 :, VLED = 2.4 V
Ie
25
35
300
mW/sr
VCC = 5.0 V, D = 0 °, 15 °, TXD =
High or SD = High (Receiver is
inactive as long as SD = High)
Ie
0.04
mW/sr
D
± 22
°
Peak-emission wavelength
Op
Spectral bandwidth
'O
Optical rise time
tropt
10
100
Optical fall time
tfopt
10
100
ns
topt
1.41
2.23
μs
topt
tTXD
topt
Optical overshoot
www.vishay.com
154
Input pulse width 1.63 μs,
115.2 kbit/s
880
900
45
1.63
nm
nm
ns
tTXD +
μs
300
μs
25
%
Rev. 1.8, 26-Sep-06
TFBS4711
Manual Soldering
desoldering.
260
10 s max. at 230 °C
240 °C max.
240
220
2...4 °C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 °C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Storage
280
T ≥ 255 °C for 20 s max
260
240
T ≥ 217 °C for 50 s max
220
200
180
Temperature/°C
Temperature/°C
160 °C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 °C...4 °C/s
80
60
2 °C...4 °C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
Rev. 1.8, 26-Sep-06
www.vishay.com
155
TFBS4711
V CC
IR Controller
Vdd
TFBS4711
Rled
IREDA (1)
TXD
IRTX
IRRX
IRMODE
R1= 47:
(2)
RXD
(3)
SD
(4)
Vcc
(5)
GND
(6)
GND
C4
C2
C3
C1
4.7 PF 0.1PF 4.7 PF 0.1 PF
18510
TFBS4711 needs no additional external components
when the internal current control is used. For reducing
the IRED drive current for low power applications with
reduced range an additional resistor can be used to
connect the IRED to the separate power supply.
Depending on the entire system design and board
layout, additional components may be required. (see
figure 3).
Worst-case conditions are test set-ups with long
cables to power supplies. In such a case capacitors
are necessary to compensate the effect of the cable
inductance. In case of small applications as e.g.
mobile phones where the power supply is close to the
transceiver big capacitors are normally not necessary. The capacitor C1 is buffering the supply voltage
the IRED current. The resistor R1 is optional for
reducing the IRED drive current.
directly (DC) coupled to the I/O circuit
low pass filter for smoothing the supply voltage when
noisy supply voltage is used or pick-up via the wiring
is expected.
R2, C1 and C2 are optional and dependent on the
quality of the supply voltage VCCX and injected noise.
An unstable power supply with dropping voltage during transmission may reduce the sensitivity (and
transmission range) of the transceiver.
In any case, when connecting the described circuit to
the power supply, low impedance wiring should be
used.
When extended wiring is used the inductance of the
at VCC2. Often some power supplies are not to follow
the fast current rise time. In that case another 10 μF
capacitor at VCC2 will be helpful.
The recommended components in table 1 are for test
set-ups
Keep in mind that basic RF - design rules for circuit
longer signal lines should not be used without termination. See e.g. "The Art of Electronics" Paul Horowitz, Winfield Hill, 1989, Cambridge University Press,
ISBN: 0521370957
I/O and Software
Table 1.
Component
Recommended Value
C1, C3
4.7 μF, 16 V
293D 475X9 016B
C2, C4
0.1 μF, Ceramic
R1
47 :, 0.125 W
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156
Vishay Part Number
Rev. 1.8, 26-Sep-06
TFBS4711
Table 2.
Truth table
SD
TXD
Optical input Irradiance
RXD
Transmitter
Operation
mW/m2
Inputs
Inputs
Inputs
Outputs
Outputs
Remark
high
x
x
weakly pulled
(500 :) to VCC1
0
Shutdown
low
high
x
high inactive
Ie
Transmitting
low
high
> 300 μs
x
high inactive
0
low
low
<4
high inactive
0
IrDA defined threshold for
noise immunity
low
low
low (active)
0
Response to an IrDA
compliant optical input signal
low
low
undefined
0
Overload conditions can
cause unexpected outputs
19612
Figure 4. Package drawing of TFBS4711, tolerance of height is + 0.1mm, - 0.2 mm, other tolerances ± 0.2 mm
Rev. 1.8, 26-Sep-06
www.vishay.com
157
TFBS4711
19728
Figure 5. Recommended Solder Footprint
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
www.vishay.com
158
W3 max.
Rev. 1.8, 26-Sep-06
TFBS4711
19613
Rev. 1.8, 26-Sep-06
www.vishay.com
159
TFDU4100
Not for new design*
Description
The TFDU4100 is an infrared transceiver module
compliant with the IrDA standard for serial infrared
(SIR) data communication, supporting IrDA speeds
up to 115.2 kbit/s. The transceiver module consists of
a PIN photodiode, an infrared emitter (IRED), and a
low-power analog control IC to provide a total frontend solution in a single package. This SIR transceiver
is using the small BabyFace package. The transceivers are capable of directly interfacing with a wide variety of I/O chips which perform the pulse-width
modulation/demodulation function, including Vishay
Semiconductors’ TOIM4232. At a minimum, a cur-
20110
rent-limiting resistor in series with the infrared emitter
and a VCC bypass capacitor are the only external
components required to implement a complete solution.
Features
• Compliant to the IrDA physical layer
specification (Up to 115.2 kbit/s),
HP-SIR® and TV Remote Control
e3
• 2.7 V to 5.5 V wide operating
voltage range
• Low Power Consumption (1.3 mA Supply Current)
• Surface mount package
- universal (L 9.7 mm × W 4.7 mm × H 4.0 mm)
• Open collector receiver output, with 20 k:
internal pull-up.
• BabyFace (Universal) package capable of surface
mount solderability to side and to view
orientation
• Directly interfaces with various Super I/O and controller devices and Vishay Semiconductors’s
TOIM4232 I/O
• Built-in EMI protection - no external shielding necessary
• Few external components required
• Split power supply, transmitter and receiver can be
operated from two power supplies with relaxed
requirements saving costs, US - Patent No.
6,157,476
• Compliant with IrDA background light
specification
• EMI Immunity in GSM Bands > 300 V/m verified
(MSL4)
WEEE 2002/96EC
Applications
• Printers, fax machines, photocopiers,
screen projectors
• Telecommunication products
(cellular phones, pagers)
• Internet TV boxes, video conferencing systems
• Medical and industrial data collection devices
•
•
•
•
External infrared adapters (dongles)
Data loggers
GPS
Kiosks, POS, Point and Pay devices including
IrFM - applications
Parts Table
Part
Description
Qty / Reel
TFDU4100-TR3
1000 pcs
TFDU4100-TT3
1000 pcs
* TFDU4100 will be replaced by TFDU4101, January 2007
www.vishay.com
160
Rev. 1.6, 03-Jul-06
TFDU4100
VCC1
VCC2
Driver
RXD
Comparator
Amplifier
IRED Anode
AGC
Logic
SC
R1
IRED Cathode
TXD
Open Collector Driver
14876
GND
Pin Description
Pin Number
Function
Description
1
IRED
Anode
IRED anode, should be externally connected to VCC2 through a current control
resistor
2
IRED
Cathode
IRED cathode, internally connected to driver transistor
I/O
Active
3
TXD
Transmit Data Input
I
HIGH
4
RXD
Received Data Output, open collector. No external pull-up or pull-down resistor is
required (20 k: resistor internal to device). Output data is invalid during
transmission.
O
LOW
5
NC
No internal connection
6
VCC1
Supply Voltage
7
SC
Sensitivity control
I
HIGH
8
GND
Ground
Pinout
Definitions:
TFDU4100
weight 200 mg
"U" Option BabyFace
(Universal)
IRED
Detector
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the
1
17087
2 3 4 5 6
7 8
Low Power Option to MIR and FIR and VFIR was added with IrPhy
1.4.A new version of the standard in any case obsoletes the former
version.
Rev. 1.6, 03-Jul-06
www.vishay.com
161
TFDU4100
Reference point Ground (pin 8) unless otherwise noted.
Parameter
Input current
Symbol
Min
Max
Unit
0 V d VCC2 d 6 V
Test Conditions
VCC1
- 0.5
Typ.
+6
V
0 V d VCC1 d 6 V
VCC2
- 0.5
+6
V
10
mA
for all pins, except IRED anode pin
Output sink current
Power dissipation
see derating curve
TJ
(operating)
mA
mW
125
°C
- 25
+ 85
°C
Tstg
- 25
+ 85
°C
IIRED(DC)
t < 90 μs, ton < 20 %
25
200
Tamb
see recommended solder profile
Average IRED current
Repetitive pulsed IRED current
PD
IIRED(RP)
260
°C
100
mA
500
mA
VIREDA
- 0.5
+6
V
Transmitter data input voltage
VTXD
- 0.5
VCC1 + 0.5
V
Receiver data output voltage
V RXD
- 0.5
VCC1 + 0.5
V
Max
Unit
IRED anode voltage
Symbol
Min
Typ.
Virtual source size
Parameter
Method: (1-1/e) encircled energy
d
2.5
2.8
IEC60825-1 or EN60825-1, edition
Jan. 2001
Ie
*)
Test Conditions
mm
mW/sr
(500)*) **)
The device is a "class 1" device.
**)
IrDA specifies the max. intensity with 500 mW/sr.
Transceiver
Parameter
Test Conditions
Supported data rates
base band
Supply voltage
receive mode
transmit mode, R2 = 47 :
(see recommended application
circuit)
Supply current pin VCC1
(receive mode)
Symbol
Min
Max
Unit
2.4
Typ.
115.2
kbit/s
VCC1
2.7
5.5
V
VCC2
2.0
5.5
V
VCC1 = 5.5 V
ICC1(Rx)
1.3
2.5
mA
VCC1 = 2.7 V
ICC1(Rx)
1.0
1.5
mA
Supply current pin VCC1 (avg)
IIRED = 210 mA (at IRED anode
(transmit mode), 20 % duty cycle pin), VCC1 = 5.5 V
ICC1(Tx)
5.0
5.5
mA
IIRED = 210 mA (at IRED anode
pin), VCC1 = 2.7 V
ICC1(Tx)
3.5
4.5
mA
VCC1 = OFF, TXD = LOW,
VCC2 = 6 V, T = - 25 to + 85 °C
IL(IREDA)
0.005
0.5
μA
50
μs
Leakage current of IR emitter,
IRED anode pin
Transceiver power on settling
time
www.vishay.com
162
TPON
Rev. 1.6, 03-Jul-06
TFDU4100
Receiver
Tamb = 25 °C, VCC = 2.7 V to 5.5 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
irradiance
Test Conditions
Symbol
Min
Typ.
Max
Unit
BER < 10- 8 (IrDA specification)
D = ± 15°, SC = LOW, SIR
Ee
20
35
mW/m2
D = ± 15°, SC = HIGH, SIR
Ee
6
10
15
mW/m2
irradiance
D = ± 90°, VCC1 = 5.0 V
Ee
3.3
5
D = ± 90°, VCC1 = 3.0 V
Ee
8
15
Logic LOW receiver input
irradiance
Note: No detection below this
input irradiance
Ee
4
Output voltage - RXD
Active, C = 15 pF, R = 2.2 k:
VOL
non-active,
C = 15 pF, R = 2.2 k:
VOH
kW/m2
kW/m2
mW/m2
0.5
0.8
V
VCC1 - 0.5
Output current - RXD
VOL < 0.8 V
Rise time - RXD
active to inactive
C = 15 pF, R = 2.2 k: to VCC1
tr(RXD)
20
200
ns
active to inactive
C = 15 pF, internal load only
tr(RXD)
20
1400
ns
inactive to active
C = 15 pF, R = 2.2 k: to VCC1
tf(RXD)
20
200
ns
inactive to active
C = 15 pF, internal load only
tf(RXD)
20
200
ns
tPW
1.63
4.3
μs
2
μs
500
μs
Fall time - RXD
Pulse width - RXD output
Jitter, leading edge of output
signal
over a period of 10 bit,
115.2 kbit/s
Latency
IOL
V
4
4
ti
100
tL
mA
Transmitter
Tamb = 25 °C, VCC = 2.7 V to 5.5 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test Conditions
IRED operating current can be
adjusted by variation of R1.
Current limiting resistor is in
series to IRED:
R1 = 14 :, VCC2 = 5.0 V
Symbol
Min
Id
Typ.
Max
Unit
0.2
0.28
A
Logic LOW transmitter input
voltage
VIL(TXD)
0
0.8
V
Logic HIGH transmitter input
voltage
VIH(TXD)
2.4
VCC1 + 0.5
V
In agreement with IEC825 eye
safety limit, if current limiting
resistor is in series to IRED:
R1 = 14 :, VCC2 = 5.0 V,
D = ±15 °
Ie
45
200
mW/sr
TXD logic LOW level
Ie
0.04
mW/sr
900
nm
Angle of half intensity
D
Peak wavelength of emission
Op
Rev. 1.6, 03-Jul-06
140
± 24
880
°
www.vishay.com
163
TFDU4100
Parameter
Test Conditions
Symbol
Min
Half-width of emission spectrum
Typ.
Max
Optical rise time, fall time
tropt, tfopt
nm
200
600
Optical overshoot
Rising edge peak-to-peak jitter
of optical output pulse
Unit
45
Over a period of 10 bits,
independent of information
content
tj
ns
25
%
0.2
μs
power supply with dropping voltage during transmission may reduce sensitivity (and transmission range)
of the transceiver.
500
Vcc = 5.25 V,
max. efficiency, center,
min. VF, min. VCEsat
450
400
350
Intensity (mW/sr)
The only required components for designing an IrDA®
compatible application using Vishay Semiconductors
SIR transceivers are a current limiting resistor to the
IRED. However, depending on the entire system
design and board layout, additional components may
be required (see figure 1). It is recommended that the
capacitors C1 and C2 are positioned as near as possible to the transceiver power supply pins. A tantalum
capacitor should be used for C1, while a ceramic
capacitor should be used for C2 to suppress RF
noise. Also, when connecting the described circuit to
used.
300
250
200
Vcc = 4.75 V, min. efficiency,
±15q off axis, max. VF, max. VCEsat
150
100
50
0
VCC2
6
R1
VCC1
14377
IRED
Cathode
R2
RXD
8
10
12
14
Current Control Resistor ( : )
16
IRED
Anode
RXD
Figure 2. Ie vs. R1
TXD
TFDx4x00
C1
GND
C2
VCC1/SD
SC
GND
NC
18092
Note: outlined components are optional depending
on the quality of the power supply
R1 is used for controlling the current through the IR
emitter. For increasing the output power of the IRED,
the value of the resistor should be reduced. Similarly,
to reduce the output power of the IRED, the value of
the resistor should be increased. For typical values of
R1 (see figures 2 and 3), e.g. for IrDA compliant operation (VCC2 = 5 V ± 5 %), a current control resistor of
14 : is recommended. The upper drive current limitation is dependent on the duty cycle and is given by the
absolute maximum ratings on the data sheet and the
eye safety limitations given by IEC825.1. R2, C1 and
C2 are optional and dependent on the quality of the
supply voltage VCC1 and injected noise. An unstable
www.vishay.com
164
Intensity (mW/sr)
SC
TXD
14378
760
720
VCC = 3.3 V, max. intensity on
680
axis, min. VF , min VCEsat
640
600
560
520
480
440
400
360
320
280
240 VCC = 2.7 V, min. intensity
200
± 15q off axis, max. VF ,
160
max. VCEsat
120
80
40
0
0
1
2
3
4
5
6
7
8
Current Control Resistor ( : )
Figure 3. Ie vs. R1
Rev. 1.6, 03-Jul-06
TFDU4100
Table 1.
Component
Recommended Value
Vishay Part Number
C1
4.7 μF, Tantalum
293D 475X9 016B 2T
C2
0.1 μF, Ceramic
R1
14 :, 0.25 W (recommended using two 7 :M, 0.125 W
resistor in series, (VCC2 = 5 V)
R2
47 :, 0.125 W
The sensitivity control (SC) pin allows the minimum
detection irradiance threshold of the transceiver to be
lowered when set to a logic HIGH. Lowering the irradiance threshold increases the sensitivity to infrared
signals and increases transmission range up to 3
meters. However, setting the Pin SC to logic HIGH
also makes the transceiver more susceptible to transmission errors due to an increased sensitivity to fluorescent light disturbances. It is recommended to set
the Pin SC to logic LOW or left open if the increased
range is not required or if the system will be operating
in bright ambient light.
cally 5 nA). The settling time after switching VCC1/SD
on again is approximately 50 Ps. Vishay Semiconductors’ TOIM4232 interface circuit is designed for this
shutdown feature. The VCC_SD, S0 or S1 outputs on
the TOIM4232 can be used to power the transceiver
with the necessary supply current. If the microcontroller or the microprocessor is unable to drive the supply
current required by the transceiver, a low-cost SOT23
pnp transistor can be used to switch voltage on and
off from the regulated power supply (see figure 5).
The additional component cost is minimal and saves
the system designer additional power supply costs.
Shutdown
The internal switch for the IRED in Vishay Semiconductors SIR transceivers is designed to be operated
like an open collector driver. Thus, the VCC2 source
can be an unregulated power supply while only a well
regulated power source with a supply current of 1.3
mA connected to VCC1/SD is needed to provide power
to the remainder of the transceiver circuitry in receive
mode. The term VCC1/SD is used here for the power
supply pin to indicate that VCC1 can be switched off
independently to shut down the transceiver. It is
allowed to keep the power supply connected to the
IRED Anode. In transmit mode, the current at VCC1 is
slightly higher (approximately 4 mA average at 3 V
supply current) and the voltage is not required to be
kept as stable as in receive mode. A voltage drop of
VCC1 is acceptable down to about 2.0 V when buffering the voltage directly from the Pin VCC1 to GND see
figure 1). This configuration minimizes the influence
of high current surges from the IRED on the internal
analog control circuitry of the transceiver and the
application circuit. Also board space and cost savings
can be achieved by eliminating the additional linear
regulator normally needed for the IRED’s high current
requirements. The transceiver can be very efficiently
shutdown by keeping the IRED connected to the
power supply VCC2 but switching off VCC1/SD. The
power source to VCC1/SD can be provided directly
from a microcontroller (see figure 4). In shutdown,
current loss is realized only as leakage current
through the current limiting resistor to the IRED (typiDocument Number 82514
Rev. 1.6, 03-Jul-06
IIRED
Power
Supply
+
– Regulated Power Supply
50 mA
R1
IRED
Anode
Microcontroller or
Microprocessor
20 mA
IS
VCC1/SD
TFDU4100 (Note: Typical Values Listed)
Receive Mode
at 5 V: IIRED = 210 mA, IS = 1.3 mA
at 2.7 V: IIRED = 210 mA, IS = 1.0 mA
Transmit Mode
at 5 V: IIRED = 210 mA, IS = 5 mA (Avg.)
at 2.7 V: IIRED = 210 mA, IS = 3.5 mA (Avg.)
14878
Figure 4.
IIRED
Power
Supply
+
– Regulated Power Supply
50 mA
R1
IRED
Anode
Microcontroller or
Microprocessor
20 mA
IS
VCC1/SD
TFDU4100 (Note: Typical Values Listed)
Receive Mode
at 5 V: IIRED = 210 mA, IS = 1.3 mA
at 2.7 V: IIRED = 210 mA, IS = 1.0 mA
Transmit Mode
at 5 V: IIRED = 210 mA, IS = 5 mA (Avg.)
at 2.7 V: IIRED = 210 mA, IS = 3.5 mA (Avg.)
14879
Figure 5.
www.vishay.com
165
TFDU4100
Storage
10 s max. at 230 °C
240 °C max.
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
275
2...4 °C/s
T ≥ 255 °C for 10 s....30 s
250
225
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
0
50
19535
100
150
200
250
300
350
Time/s
The TFDU4100 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead (Pb)free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu,
use of forced convection reflow ovens the Ramp-ToSpike profile is used increasingly. Shown below in figure 7 and 8 are VISHAY's recommended profiles for
use with the TFDU4100 transceivers. For more
details please refer to the application note
“SMD Assembly Instructions”
A ramp-up rate less than 0.9 °C/s is not recommended. Ramp-up rates faster than 1.3 °C/s could
damage an optical part because the thermal conductivity is less than compared to a standard IC.
Temperature/°C
260
240
220
200
180
160
140
120
100
80
60
40
20
0
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
2 °C...3 °C/s
50
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
Tpeak = 260 °C max
260
240
220
200
180
Temperature/°C
Temperature (°C)
Solder Profile for Sn/Pb Soldering
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Figure 8. RTS Recommendation
Manual Soldering
desoldering.
Current Derating Diagram
600
Peak Operating Current (mA)
Wave Soldering
500
400
300
200
Current derating as a function of
the maximum forward current of
IRED. Maximum duty cycle: 25 %.
100
0
- 40 - 20
14880
0
20 40 60 80 100 120 140
Temperature (5 °C)
Figure 9. Current Derating Diagram
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166
Rev. 1.6, 03-Jul-06
TFDU4100
Package Dimensions
7x1=7
0.6
2.5
1
8
1
18470
Figure 10. Package drawing and solder footprint TFDU4100, dimensions in mm, tolerance ± 0.2 mm if not otherwise mentioned
Rev. 1.6, 03-Jul-06
www.vishay.com
167
TFDU4100
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
www.vishay.com
168
W3 max.
Rev. 1.6, 03-Jul-06
TFDU4100
Tape Dimensions
19824
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Figure 11. Tape drawing, TFDU4100 for top view mounting, tolerance ± 0.1 mm
Rev. 1.6, 03-Jul-06
www.vishay.com
169
TFDU4100
19875
Drawing-No.: 9.700-5297.01-4
Issue: 1; 08.04.05
Figure 12. Tape drawing, TFDU4100 for side view mounting, tolerance ± 0.1 mm
www.vishay.com
170
Rev. 1.6, 03-Jul-06
TFDU4101
Infrared Transceiver Module (SIR, 115.2 kbit/s)
for IrDA® Applications
Description
The TFDU4101 transceiver is an infrared transceiver
module compliant to the latest IrDA physical layer
standard for fast infrared data communication, supporting IrDA speeds up to 115.2 kbit/s (SIR), and carrier based remote control modes. Integrated within
the transceiver module are a photo PIN diode, an infrared emitter (IRED), and a low-power control IC to
provide a total front-end solution in a single package.
This device covers the full IrDA range of more than
1 m using the internal intensity control. With one external current control resistor the current can be adjusted for shorter ranges saving operating current
operating in IrDA low power mode. This Vishay SIR
transceiver is using the lead frame technology.
The receiver output pulse duration is independent of
20110
the optical input pulse duration and recovers always a
fixed pulse duration optimum for compatibility to
standard Endecs and interfaces. TFDU4101 has a tristate output and is floating in shutdown mode with a
weak pull-up.
Features
• Operates from 2.4 V to 3.6 V within
specification over full temperature range
from - 30 °C to + 85 °C
e3
• Split power supply, transmitter and
receiver can be operated from two power
supplies with relaxed requirements saving costs,
US - Patent No. 6,157,476
• Low power consumption (< 0.12 mA supply current in receive mode, no signal)
• Power shutdown mode (< 4 μA shutdown current
in full temperature range, up to 85 °C, < 10 nA at
25 °C)
• Surface mount 4-mm package
L 9.7 mm × W 4.7 mm × H 4.0 mm
• High efficiency emitter
• Low profile (universal) package capable of surface
mount soldering to side and top view orientation
• Directly Interfaces with various Super I/O and controller devices as e. g. TOIM4232
• Tri-state-Receiver Output, floating in shut down
with a weak pull-up
(MSL4)
WEEE 2002/96EC
Applications
• Printers, fax machines, photocopiers, screen projectors
• Medical data collection
• Diagnostic systems
• Notebook computers, desktop PCs, Palmtop
computers (Win CE, Palm PC), PDAs
•
•
•
•
•
•
Internet TV Boxes, video conferencing systems
External infrared adapters (dongles)
Data loggers
GPS
Kiosks, POS, Point and Pay devices
Industrial applications
Parts Table
Part
Description
Qty / Reel
TFDU4101-TR3
1000 pcs
TFDU4101-TT3
1000 pcs
Rev. 1.0, 26-Sep-06
www.vishay.com
171
TFDU4101
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
Logic
&
SD
Controlled
Driver
Control
TXD
IRED C
GND
18468
Pin Description
Pin Number
1
Function
Description
I/O
Active
VCC2
IRED anode to be externally connected to VCC2. An external resistor is only
IRED Anode necessary for controlling the IRED current when a current reduction below
300 mA is intended to operate in IrDA low power mode.
This pin is allowed to be supplied from an uncontrolled power supply
separated from the controlled VCC1 - supply.
2
IRED
Cathode
3
TXD
This Schmitt-Trigger input is used to transmit serial data when SD is low. An
on-chip protection circuit disables the LED driver if the TXD pin is asserted
for longer than 50 μs (max 300 μs).
I
HIGH
4
RXD
Received Data Output, push-pull CMOS driver output capable of driving
standard CMOS or TTL loads. During transmission the RXD output is active
(echo-on). No external pull-up or pull-down resistor is required. Floating
with a weak pull-up of 500 k: (typ.) in shutdown mode.
O
LOW
I
HIGH
5
SD
Shutdown
6
VCC1
Supply Voltage
7
NC
No internal connection
8
GND
Ground
I
Pinout
TFDU4101
weight 200 mg
"U" Option BabyFace
(Universal)
IRED
1
2 3 4 5 6
Detector
7 8
17087
www.vishay.com
172
Rev. 1.0, 26-Sep-06
TFDU4101
Symbol
Min
Max
Unit
transceiver
Parameter
- 0.3 V < VCC2 < 6.0 V
Test Conditions
VCC1
- 0.5
6.0
V
transmitter
- 0.5 V < VCC1 < 6.0 V
VCC2
- 0.5
6.0
V
Voltage at RXD
- 0.5 V < VCC1 < 6.0 V
VRXD
- 0.5
VCC1
+ 0.5
V
Vin
- 0.5
6.0
V
10
mA
Voltage at all inputs and outputs Vin > VCC1 is allowed
Input currents
Typ.
For all Pins, Except IRED Anode
Pin
Power dissipation
See Derating Curve
TJ
(operating)
< 90 μs, ton < 20 %
25
mA
250
mW
125
°C
Tamb
- 30
+ 85
°C
Tstg
- 30
+ 85
°C
260
°C
IIRED (DC)
80
mA
IIRED (RP)
400
mA
Max
Unit
See “Recommended Solder
Profile”
Repetitive pulse output current,
pin 1 to pin 2
PD
Reference point Pin: GND unless otherwise noted.
Symbol
Min
Virtual source size
Parameter
Method: EN ISO 11146
d
2.6
IEC60825-1 or
EN60825-1, edition Jan. 2001
operating below the absolute
maximum ratings
Ie
*) Due
**)
Test Conditions
Typ.
mm
*)
(500)**)
mW/sr
to the internal limitation measures the device is a "class1" device under all conditions
Definitions:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy: 1.0
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with the physical layer standard IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard.
IrPhy 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case
obsoletes the former version.
Note: We apologize to use sometimes in our documentation the abbreviation LED and the word Light Emitting Diode instead of Infrared
Emitting Diode (IRED) for IR-emitters. That is by definition wrong; we are here following just a bad trend.
Typical values are for design aid only, not guaranteed nor subject to production testing and may vary with time.
Rev. 1.0, 26-Sep-06
www.vishay.com
173
TFDU4101
Transceiver
Tamb = 25 °C, VCC1 = VCC2 = 2.4 V to 5.5 V unless otherwise noted.
Parameter
Test Conditions/Pins
Supply voltage
Symbol
Min
VCC1
2.4
Typ.
Max
Unit
5.5
V
130
μA
Tamb = - 25 °C to + 85 °C
VCC1 = VCC2 = 2.4 V to 5.5 V
ICC1
90
Tamb = 25 °C
VCC1 = VCC2 = 2.4 V to 5.5 V
ICC1
75
Average dynamic supply
current, transmitting
IIRED = 300 mA,
25 % Duty Cycle
ICC
0.65
mA
No signal, no resistive load
ISD
0.1
μA
ISD
3
μA
ISD
4
μA
TA
- 30
+ 85
°C
Output voltage Low, RXD
Cload = 15 pF
VOL
- 0.5
0.15 x
VCC1
V
Output voltage High, RXD
IOH = - 500 μA, CLoad = 15 pF
VOH
0.8 x VCC1
VCC1 + 0.5
V
VOH
0.9 x VCC1
VCC1 + 0.5
V
RRXD
400
600
k:
RXD to VCC1 impedance
Input voltage High (TXD, SD)
1.5 V d Vlogic d 2.5 V**)
500
μA
VIL
- 0.5
0.5
V
VIH
0.8 x VCC1
6
V
VIH
VCC1 - 0.5
6
V
Input leakage current (TXD, SD) Vin = 0.9 x VCC1
IICH
-2
+2
μA
0 < Vin < 0.15 VCC1
Vin > 0.7 VCC1
IIrTX
+ 150
1
μA
μA
5
pF
Vlogic > 2.5 V**
Input capacitance (TXD, SD)
*)
)
SD, TXD = "0" or "1"
-1
CI
0
Standard Illuminant A
**)
The typical threshold level is 0.5 x VCC1. It is recommended to use the specified min/max values to avoid increased operating current.
www.vishay.com
174
Rev. 1.0, 26-Sep-06
TFDU4101
Receiver
Parameter
Test Conditions
angular range**) SIR mode
O = 850 nm to 900 nm; D = 0°, 15°
angular range
O = 850 nm to 900 nm
Symbol
Min
Typ.
Max
Unit
Ee
4
(0.4)
20
(2)
35*)
(3.5)
mW/m2
(μW/cm2)
Ee
5
(500)
kW/m2
(μW/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
20
100
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
20
100
ns
RXD pulse width
input pulse length > 1.2 μs
t PW
1.65
3.0
μs
Leading edge jitter
Input Irradiance = 100 mW/m2, d 115.2
kbit/s
250
ns
After shutdown active or power-on
500
μs
150
μs
Latency
*)
tL
2.2
100
IrDA specification is 40 mW/m2. Specification takes a window loss of 10 % into account.
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical power delivered to the detector by a source operating at
the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link
errors. If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification.
Rev. 1.0, 26-Sep-06
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175
TFDU4101
Optoelectronic Characteristics, continued
Transmitter
Tamb = 25 °C, VCC1 =VCC2 = 2.4 V to 5.5 V unless otherwise noted.
Parameter
IRED operating current,
switched current limiter
Test Conditions
No external resistor for current
Symbol
Min
Typ.
Max
Unit
ID
250
300
350
mA
1.8
1.9
V
1
μA
limitation*)
Forward voltage of built-in IRED If = 300 mA
Vf
1.4
IIRED
-1
48
D = 0°, 15°
TXD = High, SD = Low
Ie
VCC1 = 5.0 V, D = 0°, 15°
TXD = Low or SD = High (Receiver is
Ie
Peak - emission wavelength**)
Op
Spectral bandwidth
'O
Optical rise time,
Optical fall time
± 24
880
mW/sr
deg
900
45
nm
nm
tropt,
tfopt
10
300
ns
tTXD
- 0.15
tTXD
+ 0.15
μs
300
μs
25
%
input pulse width
1.6 μs < tTXD < 20 μs
topt
input pulse width tTXD t 20 μs
topt
Optical overshoot
mW/sr
0.04
D
Output radiant intensity,
angle of half intensity
65
20
*)
Using an external current limiting resistor is allowed and recommended to reduce IRED intensity and operating current when current
reduction is intended to operate at the IrDA low power conditions.
E.g. for VCC2 = 3.3 V a current limiting resistor of Rs = 56 : will allow a power minimized operation at IrDA low power conditions.
**)
Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for the
standard Remote Control applications with codes as e. g. Philips RC5/RC6® or RECS 80.
www.vishay.com
176
Rev. 1.0, 26-Sep-06
TFDU4101
Operated with a clean low impedance power supply
the TFDU4101 needs no additional external components. However, depending on the entire system
be required (see figure 1). That is especially the case
when separate power supplies are used for bench
tests. When using compact wiring and regulated supplies as e. g. in phone applications in most cases no
external components are necessary.
VIRED
R1 *)
VCC
R2
C1
GND
VCC2 , IRED A
VCC1
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
IRED C
20037
Figure 1. Recommended test circuit.
*) R1 is optional when reduced intensity is used.
The capacitor C1 is buffering the supply voltage and
eliminates the inductance of the power supply line.
This one should be a Tantalum or other fast capacitor
to guarantee the fast rise time of the IRED current.
The resistor R1 is the current limiting resistor, which
may be used to reduce the operating current to levels
below the specified controlled values for saving battery power.
VISHAY's transceivers integrate a sensitive receiver
and a built-in power driver. The combination of both
needs a careful circuit board layout. The use of thin,
long, resistive and inductive wiring should be avoided.
The shutdown input must be grounded for normal
operation, also when the shutdown function is not
used.
The inputs (TXD, SD) and the output RXD should be
directly connected (DC - coupled) to the I/O circuit.
low pass filter for smoothing the supply voltage. R2,
C1 and C2 are optional and dependent on the quality
of the supply voltages VCC1 and injected noise. An
unstable power supply with dropping voltage during
transmission may reduce the sensitivity (and transmission range) of the transceiver.
When extended wiring is used (bench tests!) the
inductance of the power supply can cause dynamically a voltage drop at VCC2. Often some power supplies are not able to follow the fast current rise time.
In that case another 4.7 μF (type, see table under C1)
at VCC2 will be helpful.
Under extreme EMI conditions as placing an RFtransmitter antenna on top of the transceiver, we recommend to protect all inputs by a low-pass filter, as a
minimum a 12 pF capacitor, especially at the RXD
port. The transceiver itself withstands EMI at GSM
frequencies above 500 V/m. When interference is
observed, the wiring to the inputs picks it up. It is verified by DPI measurements that as long as the interfering RF - voltage is below the logic threshold levels
of the inputs and equivalent levels at the outputs no
interferences are expected.
One should keep in mind that basic RF - design rules
for circuit design should be taken into account. Especially longer signal lines should not be used without
termination. See e.g. "The Art of Electronics" Paul
Horowitz, Winfield Hill, 1989, Cambridge University
Press, ISBN: 0521370957.
Table 1.
Recommended Tests and Application Circuit Components
Component
Recommended Value
C1
4.7 μF, 16 V
293D 475X9 016B
C2
0.1 μF, Ceramic
R1
depends on current to be adjusted, e. g. with VCC2 = 3.3 V 56 : is an option for minimum low power operation
R2
Rev. 1.0, 26-Sep-06
Vishay Part Number
47 :, 0.125 W
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177
TFDU4101
Figure 2 shows an example of a typical application
with a separate supply voltage VS and using the
transceiver with the IRED Anode connected to the
unregulated battery Vbatt. This method reduces the
peak load of the regulated power supply and saves
therefore costs. Alternatively all supplies can also be
tied to only one voltage source. R1 and C1 are not
used in this case and are depending on the circuit
design in most cases not necessary.
In figure 2 an option is shown to operate the transmitter at two different power levels to switch for long
range to low power mode for e.g. saving power for
IrDA application but use the full range specification for
Remote Control. The additional components are
marked in the figure.
For operating at RS232 ports TOIM4232 is recommended as ENDEC.
I/O and Software
from the I/O suppliers. In special cases refer to the
I/O manual, the Vishay application notes, or contact
Figure 3 shows the maximum operating temperature
when the device is operated without external current
limiting resistor.
Vbatt | 3 V
Hi/Low
C1
R1
Vs = 2.8 V
Vdd
IRED Anode (1)
IRED Cathode (2)
TXD (3)
RXD (4)
SD (5)
Vcc1 (6)
IRTX
IRRX
IR MODE
R2
C2
GND (8)
20038
Ambient Temperature (°C)
90
85
80
75
70
65
60
55
50
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Operating Voltage [V] at duty cycle 20 %
18097
Figure 2. Typical application circuit.
Grey: Optional for Hi/Low switching.
Table 2.
Truth table
Inputs
Remark
TXD
RXD
Transmitter
high
> 1 ms
x
x
weakly pulled
(500 k:) to VCC1
0
Shutdown
low
high < 50 μs
x
low active
Ie
Transmitting
high > 50 μs
x
high inactive
0
low
<4
high inactive
0
Ignoring low signals below
the IrDA defined threshold for
noise immunity
low
low (active)
0
Response to an IrDA
compliant optical input signal
low
undefined
0
Overload conditions can
cause unexpected outputs
www.vishay.com
178
Outputs
SD
Operation
Rev. 1.0, 26-Sep-06
TFDU4101
Storage
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 °C
240 °C max.
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
2...4 °C/s
275
T ≥ 255 °C for 10 s....30 s
250
225
0
50
100
19535
150
200
250
300
350
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
Time/s
Temperature/°C
Temperature (°C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
Tpeak = 260 °C max
260
240
220
200
180
Temperature/°C
2 °C...3 °C/s
50
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
Manual Soldering
desoldering.
Rev. 1.0, 26-Sep-06
www.vishay.com
179
TFDU4101
7x1=7
0.6
2.5
1
8
1
18470
Figure 7. Package drawing TFDU6103, dimensions in mm, tolerance ± 0.2 mm if not otherwise mentioned
www.vishay.com
180
Rev. 1.0, 26-Sep-06
TFDU4101
20035
Figure 8. Recommended footprint for side view applications and solderpaste mask
20036
Figure 9. Recommended footprint for top view applications and solderpaste mask
Rev. 1.0, 26-Sep-06
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181
TFDU4101
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
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182
W3 max.
Rev. 1.0, 26-Sep-06
TFDU4101
Tape Dimensions
19824
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Rev. 1.0, 26-Sep-06
www.vishay.com
183
TFDU4101
Tape Dimensions
19875
Drawing-No.: 9.700-5297.01-4
Issue: 1; 04.08.05
www.vishay.com
184
Rev. 1.0, 26-Sep-06
TFDU4202
Integrated Low Profile Transceiver Module for Telecom
Applications - IrDA Standard
Description
The miniaturized TFDU4202 is an ideal transceiver
for applications in telecommunications like mobile
phones and pagers. The device is mechanically
designed for lowest profile with a height of only
2.8 mm. The infrared transceiver is compatible to the
latest IrDA® IrPHY specification up to a data rate of
115 kbit/s. At lower operating voltages up to 3.3 V the
transceiver can be operated without external current
limiting resistor to achieve a range > 1 m. The added
feature is a split power supply for IRED driver and
ASIC.
18170
Features
• Package dimension:
L 7.1 mm x W 4.7 mm x H 2.8 mm
• Compatible to latest IrDA IrPHY standard
e3
• CIR Remote Control operation:
Typical transmission range 8 m using standard
RC-receivers. Receives RC-commands with
typical specified sensitivity.
• SMD Side View
• Lowest power consumption 65 μA, receive mode,
0.01 μA Shutdown
• Built-in current limitation
• Output intensity adjustable by external resistor
• Wide supply voltage range (2.4 V to 5.5 V)
• Split power supply
• Operational down to 2.0 V
• Fewest external components
• Eye safety: Double safety
Measures:
Limited optical output pulse duration
Limited optical output intensity
IEC60825-1, 2001: Class 1
• Push-pull output (RXD)
• High EMI immunity
requirements saving costs, US Patent No.
6,157,476
(MSL4)
WEEE 2002/96/EC
Applications
•
•
•
•
Mobile Phones
Pagers
Personal Digital Assistants (PDA)
Handheld Battery Operated Equipment
Parts Table
Part
Description
Qty / Reel
TFDU4202-TR1
Orientated in carrier tape for side view in mounting
750 pcs
TFDU4202-TR3
2250 pcs
Rev. 2.0, 06-Oct-06
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185
TFDU4202
Tri-State-Driver
RXD
Comparator
Amplifier
Control
Logic
Vccp
TXD
Control
Controlled Driver
18190
VCC
GND
Pin Description
Pin Number
Function
Description
1
2
3
4
5
6
7
8
IRED GND
IRED GND
RXD
VCCP
GND
GND
TXD
VCC
IRED cathode, ground
IRED cathode, ground
Output, received data, push-pull output
IRED supply voltage
Ground
Ground
Input, transmit data
Power supply voltage
I/O
Active
O
low
I
I
high
high
Pinout
TFDU4202
weight 100 mg
18228
Reference Point Pin 8, unless otherwise noted.
Parameter
Test Conditions
Input current
Output sink current
Power dissipation
(operating)
2.4 V dVCC d 6 V
all pins
Min
VCC
Vccp
- 0.5
- 0.5
Max
Unit
6
6
10
25
200
125
85
V
V
mA
mA
mW
°C
°C
Ptot
TJ
Tamb
- 25
Tstg
- 40
100
260
°C
°C
IIRED(DC)
125
mA
IIRED(RP)
500
mA
see the chapter “Soldering
conditions” for lead-bearing and
Pb-free processing
Symbol
< 90μs, ton < 20 %
Typ.
VTXD
- 0.5
6
V
V RXD
- 0.5
6
V
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186
Rev. 2.0, 06-Oct-06
TFDU4202
Parameter
Virtual source size
Test Conditions
Method: (1 - 1/e) encircled
energy
Symbol
Min
Typ.
d
Max
2
Unit
mm
Compatible to Class 1 operation of IEC 60825 or EN60825 with worst case IrDA SIR pulse pattern, 115.2 kbit/s
Transceiver
Tested for the following parameters (VCC = 2.4 V to 5.5 V, - 25 °C to + 85 °C, unless otherwise stated).
Parameter
Test Conditions
Symbol
base band
Min
Typ.
9.6
VCC
Max
Unit
115.2
kbit/s
operational down to 2.0 V
5.5
V
Supply current
VCC = 2.4 V to 5.5 V, Ee = 0,
receive mode, full temperature
range
IS
65
100
μA
VCC = 2.4 V to 5.5 V, 10 klx
sunlight, receive mode, full
temperature range, no signal
IS
70
100
μA
VCC = 2.7 V, Vccp = 2.7 V,
115.2 kbit/s transmission,
receive mode,
nose to nose operation
IS
1
Supply current at V ccp
shutdown mode, entire
temperature range 20 °C
ISshdown
0.02
IRED peak current transmitting
Ie = 40 mW/sr, no external
resistor, Vccp = 2.7 V,
SIR standard
Transceiver ‘power on‘ settling
time
time from switching on VCC to
established specified operation
2.4
IStr
mA
1
μA
360
mA
1
ms
Receiver
Parameter
Test Conditions
Symbol
irradiance (logic high receiver
input irradiance)
| D | d ± 15 °,
VCC = 2.4 V to 5.5 V
2.0 V, 25 °C tested
Ee, min
irradiance
| D | d ± 90 °, VCC = 5 V
Ee, max
| D | d ± 90 °, VCC = 3 V
Logic low receiver input
irradiance
Min
Ee, min
Ee, max
Typ.
Max
Unit
25
(2.5)
50
(5)
mW/m2
50
100
3300
(330)
5000
(500)
8000
(800)
15000
(1500)
Ee, max,low
W/m2
W/m2
(mW/cm2)
4
(0.4)
VOL
0
non active, C = 15 pF
VOH
VCC - 0.5
VOL < 0.5 V
Rise time at load
C = 15 pF, R = 2.2 k:
Rev. 2.0, 06-Oct-06
tr
mW/m2
(μW/cm2)
μW/m2
active, C = 15 pF
Output current RXD
mW/m2
(mW/cm2)
Ee, max,low
Output voltage RXD
(μW/cm2)
20
0.5
V
4
mA
70
ns
V
www.vishay.com
187
TFDU4202
Symbol
Min
Fall time at load
Parameter
C = 15 pF, R = 2.2 k:
Test Conditions
tf
20
Typ.
70
ns
RXD signal electrical output
pulse width
2.4 kbit/s, input pulse width
1.41 μs to 3/16 of bit duration
tp
1.41
20
μs
tp
1.41
4.5
μs
Output delay time (RXD),
leading edge optical input to
electrical output
output level =
tdl
2
μs
signal
115.2 kbit/s
tj
400
ns
tdt
6.5
μs
0.1
1
ms
100
200
μs
1
Max
Unit
0.5 x VCC at 40 mW/m2
Output delay time (RXD), trailing output level =
edge optical input to electrical
output
Power on time, SD recovery
time
Latency
tL
Transmitter
Symbol
Min
Max
Unit
Logic low transmitter input
voltage
Parameter
Test Conditions
VIL(TXD)
- 0.5
0.15 x VCC
V
Logic high transmitter input
voltage
VIH(TXD)
0.8 x VCC
6
V
Ie
45
Op
850
IF1 = 320 mA, | D | d ± 15 °,
current controlled by external
resistor, voltage range
2.7 V to 5.5 V
Peak emission wavelength
Spectral emission bandwidth
Typ.
mW/sr
900
Optical rise/fall time
115.2 kHz square wave signal
(duty cycle 1 : 1)
input pulse duration 1.6 μs
1.5
1.6
input pulse duration > 25 μs,
safety protection
logic low level
Overshoot, optical
Rising edge peak to peak jitter
nm
60
over a period of 10 bits,
content
tj
nm
200
ns
1.7
μs
25
μs
0.04
μW/sr
25
%
0.2
μs
Truth table
Inputs
TXD
RXD
low
x
x
low
0
high
high
x
high
Ie
Transmitter
high t 25 μs
x
high
0
low
<4
high
0
low
> Min. detection threshold irradiance
< Max. detection threshold irradiance
x
0
low
> Max. detection threshold irradiance
undefined
0
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188
Outputs
VCC
Rev. 2.0, 06-Oct-06
TFDU4202
Application Hints
The TFDU4202 does not need any external component when operated with a "clean" power supply. In a
more noisy ambient it is recommended to add a
capacitor C1 and a resistor R1 for noise suppression.
A combination of a tantalum with a ceramics capacitor
will be efficient to attenuate both, RF and LF. The
power supply Vccp must be able to source up to
550 mA current with a fast rise time. If that cannot be
guaranteed an additional capacitor near pin 4 (Vccp)
should be included. The value is depending on the
power supply quality. A good choice is between
4.7 μF and 10 μF.
Latency
The receiver is in specified conditions after the
defined latency.
In a UART related application after that time after the
last transmitted signal (IrDA specifies 500 μs maximum for low power applications and 10 ms maximum
for standard) the receiver buffer of the UART must be
cleared. Therefore the transceiver has to wait at least
the specified latency after receiving the last bit before
starting the transmission to be sure that the corresponding receiver is in a defined state.
For more application circuits, see IrDC Design Guide
and TOIM4232 data sheet.
R1
C1
VCC
8
VCC
GND
5, 6 GND
RXD
3
RXD
TXD
7
TXD
4
VCCP
Vccp
R2
1, 2 IRED Cathode
18187
Table
Component
Recommended Value
Vishay Part Number
C1
4.7 μF, 16 V
293D 475X9 016B 2T
R1
5 : ( 2 : to 47 :)
This is a recommendation for a combination to start with to exclude power supply effects.
Optimum, from a costs point of view, to work without both.
Temperature Derating Diagram
The temperature derating diagram shows the maximum operating temperature when the device is operated without external current limiting resistor. A power
dissipating resistor of 2 : is recommended from the
cathode of the IRED to Ground for supply voltages
above 4 V. In that case the device can be operated up
to 85 °C, too.
Ambient Temperature (˚C)
90
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Figure 1. Temperature Derating Diagram
Rev. 2.0, 06-Oct-06
www.vishay.com
189
TFDU4202
Storage
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 °C
240 °C max.
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
2...4 °C/s
275
T ≥ 255 °C for 10 s....30 s
250
225
0
50
19535
100
150
200
250
300
350
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
Time/s
Temperature/°C
Temperature (°C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
Tpeak = 260 °C max
260
240
220
200
180
Temperature/°C
2 °C...3 °C/s
50
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
Manual Soldering
desoldering.
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190
Rev. 2.0, 06-Oct-06
TFDU4202
Package Dimensions
19821
Drawing-No.: 6.550-5185.01-4
Issue: 5; 02.09.05
Figure 5. Package drawing, TFDU4202
Rev. 2.0, 06-Oct-06
www.vishay.com
191
TFDU4202
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
mm
mm
mm
mm
mm
mm
mm
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
W3 max.
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
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192
Rev. 2.0, 06-Oct-06
TFDU4202
Tape Dimensions
19820
Drawing-No.: 9.700-5227.01-4
Issue: 3; 03.09.99
Figure 6. Tape drawing, TFDU4202 for side view mounting
Rev. 2.0, 06-Oct-06
www.vishay.com
193
TFDU4203
Integrated Low Profile Transceiver Module for Telecom
Applications - IrDA Standard
Description
The miniaturized TFDU4203 is an ideal transceiver
for applications in telecommunications like mobile
2.8 mm. The infrared transceiver is compatible to the
IrDA® IrPHY specification up to a data rate of
115 kbit/s.
The transceiver can be operated without external current limiting resistor to achieve full SIR compliance
(range > 1 m in full ± 15° cone).
18170
Features
L 7.1 mm x W 4.7 mm x H 2.8 mm
• Compatible to the latest IrDA IrPHY
e3
standard
• CIR Remote Control operation:
Typical transmission range 8 m using standard
RC-receivers. Receives RC-commands
with typical specified sensitivity.
• SMD side view
• Lowest power consumption 65 μA,
Receive Mode, 0.01 μA shutdown current
• Built-in current limitation
• Output intensity adjustable beyond
IrDA Low Power
• Supply voltage range 2.4 V to 5.5 V
Operational down to 2.0 V
• Fewest external components
• Eye safety: Double safety
Measures:
Limited optical output pulse duration,
limited optical output intensity
IEC60825-1, 2001: Class 1
• Tri - state output (RXD)
• High EMI immunity
• SD pin
(MSL4)
WEEE 2002/96/EC
Applications
•
•
•
•
Mobile phones
Pagers
Personal digital assistants (PDA)
Hand-held battery operated equipment
Parts Table
Part
Description
Qty / Reel
TFDU4203-TR1
750 pcs
TFDU4203-TR3
2250 pcs
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194
Rev. 1.6, 04-Oct-06
TFDU4203
Vcc
Tri-State-Driver
RXD
Comparator
Amplifier
Control
&
Logic
TXD
Control
SD
Controlled Driver
19019
GND
Pin Description
Pin Number
Function
Description
1
2
IRED GND
IRED GND
IRED Cathode, Ground
IRED Cathode, Ground
3
4
5
6
7
8
RXD
VCC
GND
GND
TXD
SD
Output, received data, tri-state, floating in shutdown mode
Supply voltage
Ground
Ground
Input, transmit data
Shutdown
I/O
Active
O
Low
I
I
High
High
Pinout
TFDU4203
weight 100 mg
18228
Reference Point Pin 8, unless otherwise noted.
Parameter
Input current
Output sink current
Power dissipation
(operating)
Test Conditions
Rev. 1.6, 04-Oct-06
Min
VCC
- 0.5
Ptot
TJ
Tamb
- 25
Tstg
- 40
all pins
Symbol
see the chapter “Soldering
conditions” for lead-bearing and
Pb-free processing
< 90 μs, ton < 20 %
IIRED(DC)
IIRED(RP)
VTXD
V RXD
- 0.5
- 0.5
Typ.
Max
Unit
+6
10
25
200
125
85
V
mA
mA
mW
°C
°C
100
°C
260
°C
125
500
6
6
mA
mA
V
V
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195
TFDU4203
Parameter
Virtual source size
(TFDU4203 only)
Test Conditions
energy
Symbol
Min
d
Typ.
Max
2
Unit
mm
Compatible to Class 1 operation of IEC 60825 or EN60825 with worst case IrDA SIR pulse pattern, 115.2 kbit/s
Transceiver
Parameter
Test Conditions
Symbol
base band
Min
Typ.
9.6
Unit
kbit/s
operational down to 2.0 V
5.5
V
Supply current
VCC = 2.4 V to 5.5 V, Ee = 0,
receive mode, full temperature
range
IS
65
100
μA
VCC = 2.4 V to 5.5 V, 10 klx
sunlight, receive mode or
transmit mode,
full temperature range,
no signal
IS
70
100
μA
VCC = 2.7 V 115.2 kbit/s
transmission, receive mode,
nose to nose operation
IS
1
shutdown mode, entire
temperature range
ISshdown
0.02
VCC = 5.5 V, 20 °C
ISshdown
10
nA
IStr
360
mA
1
ms
Supply current, at VCCP
IRED peak current transmitting
Ie = 40 mW/sr,
no external resistor
VCCP = 2.7 V, equivalent to SIR
standard
Transceiver ‘power on‘ settling
time
time from switching on VCC
to established specified
operation
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196
VCC
Max
115.2
2.4
mA
1
μA
Rev. 1.6, 04-Oct-06
TFDU4203
Receiver
Parameter
Test Conditions
Symbol
irradiance (logic high receiver
input irradiance)
| D | d ± 15 °,
VCC = 2.0 V to 5.5 V
2.0 V, 25 °C tested
Ee, min
irradiance
| D | d ± 90 °, VCC = 5 V
Ee, max
| D | d ± 90 °, VCC = 3 V
Logic low receiver input
irradiance
Output voltage RXD
Output current RXD
Min
Ee, min
Ee, max
Typ.
Max
Unit
25
(2.5)
50
(5)
mW/m2
50
100
3300
(330)
5000
(500)
8000
(800)
15000
(1500)
Ee, max,low
(μW/cm2)
mW/m2
W/cm2
(μW/cm2)
W/cm2
(μW/cm2)
4
(0.4)
active, C = 15 pF
VOL
0
non active, C = 15 pF
VOH
VCC - 0.5
mW/m2
(μW/cm2)
0.5
V
4
mA
ns
V
VOL < 0.5 V
Rise time at load
C = 15 pF, R = 2.2 k:
tr
20
70
Fall time at load
C = 15 pF, R = 2.2 k:
tf
20
70
ns
Rxd signal electrical output
pulse width
tp
1.41
20
μs
tp
1.41
4.5
μs
Output delay time (RXD),
leading edge optical input to
electrical output
output level =
tdl
2
μs
signal
115.2 kbit/s
tj
400
ns
tdt
6.5
μs
0.1
1
ms
100
200
μs
Output delay time (RXD), trailing output level =
edge optical input to electrical
output
Power on time, SD recovery
time
Latency
Rev. 1.6, 04-Oct-06
1
tL
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197
TFDU4203
Transmitter
Parameter
Test Conditions
Logic low shutdown input
Symbol
Min
Max
Unit
VIL(TXD)
- 0.5
Typ.
0.15 x VCC
V
VIH(TXD)
0.8 x VCC
6
V
VIL(TXD)
0.5
0.81 x VCC
V
VIH(TXD)
0.8 x VCC
6
V
Ie
45
Op
880
voltage*)
Logic high shutdown input
voltage*)
Logic low transmitter input
voltage*)
Logic high transmitter input
voltage*)
Optical output radiant intensity
| D | d ± 15 °, IF1 = 320 mA,
mW/sr
Internally current controlled**),
voltage range 2.7 V to 5.5 V*)
Spectral emission bandwidth
900
115.2 kHz square wave signal
(duty cycle 1 : 1)
input pulse duration 1.6 μs
logic low level
*)
nm
200
1.5
1.6
Overshoot, optical
Rising edge peak to peak jitter
nm
40
tj
over a period of 10 bits,
content
ns
1.7
μs
0.04
μW/sr
25
%
0.2
μs
Recommended logic levels for minimum shutdown current. The CMOS decision level is 0.5 x VCC.
**) Add external resistor for VCC > 4 V to prevent thermal overload, see Fig. 3.
Truth table
Inputs
Outputs
SD
TXD
RXD
Transmitter
high
low
low
low
low
low
x
high
high t 25 μs
low
low
low
x
x
x
<4
floating
high
high
high
x
x
0
Ie
0
0
0
0
Application Hints
Latency
The TFDU4203 does not need any external components when operated with a "clean" power supply. In
a more noisy ambient it is recommended to add a
capacitor C1 (4.7 μF Tantalum) and a resistor R1
(d 3 :) for noise suppression. In addition the capacitor is needed to prevent a pulse distortion when the
power supply is not able to generate the peak currents or inductive wiring is used. A combination of a
tantalum with a ceramics capacitor will be efficient to
attenuate both, RF and LF if RF noise is present. The
value is dependent on the power supply quality. A
good choice is between 4.7 μF and 10 μF.
The receiver is in specified conditions after the
defined latency.
In a UART related application after that time after the
last transmitted signal (IrDA specifies 500 μs maximum for low power applications and 10 ms maximum
for standard) the receiver buffer of the UART must be
cleared. Therefore the transceiver has to wait at least
the specified latency after receiving the last bit before
starting the transmission to be sure that the corresponding receiver is in a defined state.
For more application circuits, see IrDC Design Guide
and TOIM4232 data sheet.
Shut down
To shut down the TFDU4203 into a standby mode the
SD pin has to be set active.
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198
Rev. 1.6, 04-Oct-06
TFDU4203
SD
8
SD
GND
5, 6 GND
RXD
3
RXD
TXD
7
TXD
4
VCC
R1
Vcc
C1
1, 2 IRED Cathode
R2
18199
Component
Recommended Value
Vishay Part Number
C1
R1
4.7 μF, 16 V
5 : max
293D 475X9 016B 2T
This is a recommendation for a combination to start with to exclude power supply effects.
Optimum, from a costs point of view, to work without both.
Temperature Derating Diagram
90
85
80
75
70
65
60
55
50
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
18097
The temperature derating diagram shows the maximum operating temperature when the device is operated without external current limiting resistor. A power
dissipating resistor of 2 : is recommended from the
cathode of the IRED to Ground for supply voltages
above 4 V. In that case the device can be operated up
to 85 °C, too.
Rev. 1.6, 04-Oct-06
www.vishay.com
199
TFDU4203
Storage
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 °C
240 °C max.
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
2...4 °C/s
275
T ≥ 255 °C for 10 s....30 s
250
225
0
50
19535
100
150
200
250
300
350
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
Time/s
Temperature/°C
Temperature (°C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
Tpeak = 260 °C max
260
240
220
200
180
Temperature/°C
2 °C...3 °C/s
50
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
Wave Soldering
50
100
150
200
250
300
Time/s
Manual Soldering
desoldering.
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200
Rev. 1.6, 04-Oct-06
TFDU4203
Package Dimensions
19821
Drawing-No.: 6.550-5185.01-4
Issue: 5; 02.09.05
Rev. 1.6, 04-Oct-06
www.vishay.com
201
TFDU4203
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
mm
mm
mm
mm
mm
mm
mm
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
W3 max.
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
www.vishay.com
202
Rev. 1.6, 04-Oct-06
TFDU4203
Tape Dimensions
19820
Drawing-No.: 9.700-5227.01-4
Issue: 3; 03.09.99
Rev. 1.6, 04-Oct-06
www.vishay.com
203
TFDU4300
Infrared Transceiver Module (SIR, 115.2 kbit/s)
Description
The TFDU4300 is a low profile (2.5 mm) infrared
transceiver module with independent logic reference
voltage (Vlogic) for low voltage IO interfacing. It is
compliant to the latest IrDA® physical layer standard
for fast infrared data communication, supporting IrDA
speeds up to 115.2 kbit/s (SIR) and carrier based
remote control. The transceiver module consists of a
PIN photodiode, an infrared emitter (IRED), and a
low-power control IC to provide a total front-end solution in a single package.
This device covers an extended IrDA low power range
of close to 1 m. With an external current control resistor the current can be adjusted for shorter ranges.
This Vishay SIR transceiver is built in a new smaller
package using the experiences of the lead frame
BabyFace technology.
20101
The RXD output pulse width is independent of the
optical input pulse width and stays always at a fixed
pulse width thus making the device optimum for standard Endecs. TFDU4300 has a tri-state output and is
floating in shut-down mode with a weak pull-up.
Features
• Compliant to the latest IrDA physical
layer specification (9.6 kbit/s to
115.2 kbit/s) and TV Remote Control,
bi-directional operation included.
e3
specification over full temperature range from 30 °C to + 85 °C
• Logic voltage 1.5 V to 5.5 V is independent of
IRED driver and analog supply voltage
6,157,476
• Extended IrDA Low Power range to about 70 cm
• Typical Remote Control range 12 m
• Low power consumption
(< 0.12 mA supply current)
• Power shutdown mode (< 5 μA shutdown current
in full temperature range, up to 85 °C)
• Surface mount package, low profile (2.5 mm)
- (L 8.5 mm × H 2.5 mm × W 2.9 mm)
• Low profile (universal) package capable of
surface mount soldering to side and top view
orientation
• Directly interfaces with various Super I/O and controller devices as e.g. TOIM4232
• Tri-state-receiver output, floating in shut down with
a weak pull-up
• Compliant with IrDA background light
specification
• EMI immunity in GSM bands > 300 V/m verified
(MSL4)
WEEE 2002/96EC
Applications
• Ideal for battery operated applications
• Digital still and video cameras
• Printers, fax machines, photocopiers, screen
• projectors
• Medical and industrial data collection
• Diagnostic systems
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204
• Notebook computers, desktop PCs,
Palmtop computers (Win CE, Palm PC), PDAs
• External infrared adapters (Dongles)
• Data loggers
• GPS
• Kiosks, POS, Point and Pay devices including
IrFM - applications
Rev. 1.5, 03-Jul-06
TFDU4300
Parts Table
Part
Description
TFDU4300-TR1
Qty / Reel
750 pcs
TFDU4300-TR3
2500 pcs
TFDU4300-TT1
750 pcs
TFDU4300-TT3
2500 pcs
VCC1
Push-Pull
Driver
Amplifier
Comparator
RXD
VCC2
SD
TXD
Logic
&
Controlled Driver
Control
RED C
GND
18282
Pin Description
Pin Number
Function
Description
1
VCC2
IRED Anode
Connect IRED anode directly to the power supply (VCC2). IRED
current can be decreased by adding a resistor in series between the
power supply and IRED anode. A separate unregulated power
supply can be used at this pin.
I/O
Active
2
IRED Cathode
IRED Cathode, internally connected to the driver transistor
3
TXD
This Schmitt-Trigger input is used to transmit serial data when SD
is low. An on-chip protection circuit disables the LED driver if the
TXD pin is asserted for longer than 300 Ps. The input threshold
voltage adapts to and follows the logic voltage swing defined by the
applied Vlogic voltage.
I
HIGH
4
RXD
Received Data Output, push-pull CMOS driver output capable of
driving standard CMOS or TTL loads. During transmission the RXD
output is inactive. No external pull-up or pull-down resistor is
required. Floating with a weak pull-up of 500 k: (typ.) in shutdown
mode. The voltage swing is defined by the applied Vlogic voltage
O
LOW
5
SD
Shutdown. The input threshold voltage adapts to and follows the
logic voltage swing defined by the applied Vlogic voltage.
I
HIGH
6
VCC1
Supply Voltage
7
Vlogic
Vlogic defines the logic voltage level of the I/O ports to adap the logic
voltage swing to the IR controller. The RXD output range is from 0
V to Vlogic, for optimum noise suppression the inputs- logic decision
level is 0.5 x Vlogic
8
GND
Ground
Rev. 1.5, 03-Jul-06
I
www.vishay.com
205
TFDU4300
Pinout
Definitions:
TFDU4300
weight 75 mg
used for defining the IrDA® operating modes:
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
18101
5
6
1
2
3
4
8
7
IRED A IRED C TXD RXD SD Vcc Vlog GND
version.
With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA
®
standard is the actual version
Symbol
Min
Max
Unit
transceiver
Parameter
- 0.3 V < VCC2 < 6 V
- 0.5 V < Vlogic < 6 V
Test Conditions
VCC1
- 0.5
+ 6.0
V
transmitter
- 0.5 V < VCC1 < 6 V
- 0.5 V < Vlogic < 6 V
VCC2
- 0.5
+ 6.0
V
Supply voltage range, Vlogic
- 0.5 V < VCC1 < 6 V
- 0.3 V < VCC2 < 6 V
Vlogic
- 0.5
+ 6.0
V
RXD output voltage
- 0.5 V < VCC1 < 6 V
- 0.3 V < Vlogic < 6 V
VRXD
- 0.5
Vlogic + 0.5
V
VIN
- 0.5
+ 6.0
V
10
mA
Voltage at all inputs
Note: Vin t VCC1 is allowed
Input current
for all pins, except IRED anode
pin
Power dissipation
see derating curve
Repetitive pulsed output
current, pin 1 to pin 2
www.vishay.com
206
t < 90 μs, ton < 20 %
mA
mW
125
°C
- 30
+ 85
°C
Tstg
- 40
+ 100
°C
260
°C
IIRED(DC)
125
mA
IIRED(RP)
600
mA
see recommended solder profile
25
250
Tamb
TJ
(operating)
PD
Typ.
Rev. 1.5, 03-Jul-06
TFDU4300
Symbol
Min
Typ.
Virtual source size
Parameter
d
1.3
1.8
IEC60825-1 or EN60825-1, edition
Jan. 2001, operating below the
absolute maximum ratings
Ie
*)
Test Conditions
Max
Unit
*)
mW/sr
mm
(500)**)
Due to the internal limitation measures the device is a "class 1" device under all conditions.
**)
Emitting Diode (IRED) for IR-emitters. That is by definition wrong; we are here following just a bad trend.
Typical values are for design aid only, not guaranteed nor subject to production testing and may vary with time.
Transceiver
Tested at Tamb = 25 °C, VCC1 = VCC2 = 2.7 V to 5.5 V unless otherwise noted.
Symbol
Min
Supply voltage
Parameter
Remark: For 2.4 V < V CC1 <
2.6 V at Tamb < - 25 °C a minor
reduction of the receiver sensitivity
may occur
Test Conditions
VCC1
2.4
Typ.
Max
Unit
5.5
V
Tamb = - 25 °C to + 85 °C,
VCC1 = VCC2 = 2.7 V to 5.5 V
ICC1
90
130
μA
Tamb = 25 °C,
VCC1 = VCC2 = 2.7 V to 5.5 V
ICC1
75
Idle supply current at V logic
SD = Low, Ee = 1 klx*), Vlog,
pin 7, no signal, no load at RXD
Ilog
1
μA
IIRED = 300 mA, 20 % Duty Cycle
ICC1
0.65
mA
Standby supply current
no signal, no load
- 30
- 0.5
0.1
2
3
1
+ 85
0.15 x
Vlogic
μA
μA
μA
μA
°C
V
V
μA
Standby supply current, Vlogic
CLoad = 15 pF
ISD
ISD
ISD
I log
TA
VOL
IOH = - 500 μA
VOH
0.8 x Vlogic
Vlogic + 0.5
VOH
0.9 x Vlogic
Vlogic + 0.5
V
RRXD
400
600
k:
VIL
VIH
- 0.5
Vlogic - 0.5
0.5
6
V
V
Input voltage high (TXD, SD)
CMOS level**), Vlogic t2.5 V
CMOS level**), Vlogic <2.5 V
Input leakage current (TXD, SD) VIN = 0.9 x Vlogic
SD, TXD = "0" to "1",
VIN < 0.15 Vlogic
SD, TXD = "0" to "1",
VIN > 0.7 Vlogic
*)
500
VIH
0.8 x Vlogic
6
V
IICH
IIRTx
-2
+2
+ 150
μA
μA
IIRTx
-1
1
μA
5
pF
CIN
0
Standard illuminant A
**)
To provide an improved immunity with increasing Vlogic the typical threshold level is increasing with Vlogic and set to 0.5 x Vlogic. It is
recommended to use the specified min/max values to avoid increased operating current.
Rev. 1.5, 03-Jul-06
www.vishay.com
207
TFDU4300
Receiver
Parameter
Typ.
Max
Unit
O = 850 nm - 900 nm; D = 0 °, 15 °
Ee
40
(4)
80
(8)
mW/m2
(μW/cm2)
O = 850 nm - 900 nm
Ee
5
(500)
O = 850 nm - 900 nm
tr, tf < 40 ns,
tpo = 1.6 μs at f = 115 kHz,
no output signal allowed
Ee
10 % to 90 %, CL = 15 pF
tr(RXD)
20
100
90 % to 10 %, CL = 15 pF
tf(RXD)
20
100
ns
tPW
1.65
3.0
μs
angular range **)
Maximum Irradiance Ee In
Angular Range ***)
irradiance
Test Conditions
RXD pulse width of output signal input pulse length > 1.2 μs
Symbol
Min
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(μW/cm2)
2.0
ns
Stochastic jitter, leading edge
input irradiance = 100 mW/m2,
d 115.2 kbit/s
250
ns
after shutdown active or
power-on
150
μs
150
μs
Latency
*)
tL
100
Equivalent to IrDA Background Light and Electromagnetic Field Test: Fluorescent Lighting Immunity.
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angular range at the maximum Link
Length.
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the
maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible ralated link errors.
If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER). For more definitions see the document “Symbols and Terminology” on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
Transmitter
Parameter
Test Conditions
Forward voltage of built-in IRED
No external resistor for current limitation*)
If = 300 mA
TXD = 0 V, 0 < VCC1 < 5.5 V
D = 0 °, 15 °
VCC1 = 5.0 V, D = 0 °, 15 °
SD = High)
Symbol
ID
Vf
IIRED
Ie
D
Op
Max
Unit
300
1.8
350
1.9
1
mA
V
μA
mW/sr
0.04
mW/sr
900
nm
65
± 24
880
'O
Spectral bandwidth
Optical overshoot
Typ.
Ie
Min
250
1.4
-1
30
45
tropt, tfopt
input pulse width 1.6 < tTXD < 20 μs
topt
input pulse width tTXD t 20 μs
topt
°
nm
100
tTXD-0.15
20
ns
tTXD +
μs
300
μs
25
%
*)
reduction is intended to operate at the IrDA low power conditions. E.g. for VCC2 = 3.3 V a current limiting resistor of RS = 56 :
will allow a power minimized operation at IrDA low power conditions.
**)
Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for
the standard Remote Control applications with codes as e.g. Phillips RC5/RC6® or RECS 80.
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208
Rev. 1.5, 03-Jul-06
TFDU4300
Operated with a clean low impedance power supply
the TFDU4300 needs no additional external components. However, depending on the entire system
be required (see figure 1).
VIRED
R1 *)
VCC2, IRED A
VCC
R2
VCC1
C1
GND
C2
Ground
Vlogic
Vlogic
SD
SD
TXD
TXD
RXD
RXD
IRED C
19295
*) R1 is optional when reduced intensity is used
Vishay’s transceivers integrate a sensitive receiver
The shutdown input must be grounded for normal
operation, also when the shutdown function is not
used.
directly connected (DC - coupled) to the I/O circuit.
of the supply voltages VCC1 and injected noise. An
transmision may reduce the sensitivity (and transmission range) of the transceiver.
the transceiver pins.
When extended wiring is used as in bench tests the
inductance of the power supply can cause dynamically a voltage drop at VCC2. Often some power supplies are not able to follow the fast current rise time.
In that case another 4.7 μF (type, see table under C1)
at VCC2 will be helpful.
port. The transceiver itself withstands EMI at a GSM
observed, the wiring to the inputs picks it up. It is verified by DPI measurements that as long as the interfering RF - voltage is below the logic threshold levels
of the inputs and equivalent levels at the outputs no
interferences are expected.
for circuits design should be taken into account.
Especially longer signal lines should not be used without termination. See e.g. “The Art of Electronics” Paul
Press, ISBN: 0521370957.
Table 1.
Compo
nent
Recommended Value
Vishay Part Number
C1
4.7 μF, 16 V
293D 475X9 016B
C2
0.1 μF, Ceramic
R1
depends on current to be
adjusted
R2
47 :, 0.125 W
Rev. 1.5, 03-Jul-06
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209
TFDU4300
19296
Figure 2. Typical application circuit
limiting resisor.
I/O and Software
For operating at RS232 ports the ENDEC TOIM4232
is recommended.
90
Figure 2 shows an example of a typical application for
to work with low voltage logic (connected to VDD), a
seperate supply voltage VS and using the transceiver
with the IRED Anode connected to the unregulated
battery Vbatt. This method reduces the peak load of
the regulated power supply and saves therefore
costs. Alternatively all supplies can also be tied to
only one voltage source. R1 and C1 are not used in
this case and are depending on the circuit design in
most cases not necessary.
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Table 2. Truth table
Inputs
Outputs
Remark
SD
TXD
RXD
Transmitter
Operation
high
> 1 ms
x
x
weakly pulled
(500 k:) to VCC1
0
Shutdown
low
high
x
high inactive
Ie
Transmitting
low
high
> 50 μs
x
high inactive
0
low
low
<4
high inactive
0
IrDA® defined threshold for noise
immunity
low
low
low (active)
0
Response to an IrDA® compliant
low
low
> Max. Irradiance Ee
undefined
0
unexpected outputs
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210
Rev. 1.5, 03-Jul-06
TFDU4300
Storage
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 °C
240 °C max.
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
2...4 °C/s
275
T ≥ 255 °C for 10 s....30 s
250
225
0
50
100
19535
150
200
250
300
350
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
Time/s
Temperature/°C
Temperature (°C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
Tpeak = 260 °C max
260
240
220
200
180
Temperature/°C
2 °C...3 °C/s
50
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
Wave Soldering
50
100
150
200
250
300
Time/s
Manual Soldering
desoldering.
Rev. 1.5, 03-Jul-06
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211
TFDU4300
19700
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212
Rev. 1.5, 03-Jul-06
TFDU4300
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
Rev. 1.5, 03-Jul-06
W3 max.
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213
TFDU4300
19855
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
Figure 7. Tape drawing, TFDU4300 for top view mounting
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214
Rev. 1.5, 03-Jul-06
TFDU4300
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
Rev. 1.5, 03-Jul-06
www.vishay.com
215
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216
Contents
TFBS5700..............................218
TFBS5711..............................230
TFDU5307 ............................. 242
MIR
(9.6 kbit/s to 1.15 Mbit/s)
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217
TFBS5700
Fast Infrared Transceiver Module (MIR, 1.152 Mbit/s)
for IrDA® and Remote Control Applications
Description
The TFBS5700 is a low profile infrared transceiver
standard for fast infrared data communication, supporting IrDA speeds up to 1.152 Mbit/s (MIR) and carrier based remote control modes up to 2 MHz. The
transceiver module consists of a PIN photodiode, an
infrared emitter (IRED), and a low-power control IC to
provide a total font-end solution in a single package.
20207
Features
• IrDA IrPHY 1.4 compliant
range > 50 cm, exceeding the low
e4
power standard
• Wide operating voltage range 2.4 V
to 3.6 V
• I/O compatible to 1.8 V logic voltage
• Low power consumption
Supply current in receive mode, Idle: 550 μA
• Remote control transmitter operation
- Typical range 12 m
• Emitter wavelength: 886 nm
- suited for Remote Control
• High immunity to fluorescence light
• High EMI immunity > 200 V/m
(700 MHz to 2100 MHz)
(MSL4)
WEEE 2002/96EC
Applications
• Mobile phone
• Smart phone
• PDAs
• POS Terminals/Vending
• Battery Operated IrDA applications
Parts Table
Part
TFBS5700-TR3
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218
Description
Qty/Reel
2500 pcs
Rev. 2.1, 25-Sep-06
TFBS5700
VCC
Tri-state
Driver
PD
Amplifier
Comparator
RXD
IRED
SD
Mode
Control
IREDA
IRED Driver
TXD
ASIC
GND
19291
Pin Description
Pin Number
Function
Description
1
IRED A
IRED anode, VCC2
I/O
Active
2
TXD
on-chip protection circuit disables the LED driver if the TXD pin is asserted
for longer than 80 μs. When used in conjunction with the SD pin, this pin is
also used to control receiver output pulse duration. The input threshold
voltage adapts to and follows the internal logic voltage reference of 1.8 V
I
HIGH
3
RXD
standard CMOS or TTL loads. No external pull-up or pull-down resistor is
required. Floating with a weak pull-up of 500 k: (typ.) in shutdown mode.
The voltage swing is defined by the internal Vlogic voltage of 1.8 V
O
LOW
4
SD
Shutdown. Also used for setting the output pulse duration. Setting this pin
active for more than 1.5 ms places the module into shutdown mode. Before
that (t < 0.7 ms) on the falling edge of this signal, the state of the TXD pin
is sampled and used to set the receiver output to long pulse duration (2 μs)
or to short pulse duration (0.4 μs) mode. The input threshold voltage adapts
to and follows the internal logic voltage reference of 1.8 V
I
HIGH
5
VCC
Power Supply. Receives power supply 2.4 V to 3.6 V. This pin provides
power for the receiver and transmitter drive section.
6
GND
Ground
Pinout
Definitions:
weight 33 mg
standard with the physical layer version IrPhY 1.0
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhY 1.1, followed by IrPhY
1.2, adding the SIR Low Power Standard. IrPhY 1.3 extended the
19290
Low Power Option to MIR and FIR and VFIR was added with IrPhY
1.4. A new version of the standard in any case obsoletes the former
version.
Rev. 2.1, 25-Sep-06
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219
TFBS5700
Symbol
Min
Max
Unit
transceiver
Parameter
0 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.5
6
V
transmitter
0 V < VCC1 < 6 V
VCC2
- 0.5
6.5
V
Voltage at all I/O pins
- 0.5
Typ.
5.5
V
Power dissipation
See derating curve
PD
350
mW
Note: Internal protection above
125° ASIC temperature
TJ
125
°C
(operating)
Tamb
- 30
+ 85
°C
Tstg
- 40
+ 100
°C
260
°C
IIRED (DC)
125
mA
IIRED (RP)
500
See section “Recommended
Solder Profile”
< 90 μs, ton < 20 %
Virtual source size
Method:
(1-1/e) encircled energy
d
IEC60825-1 or
EN60825-1,
edition Jan. 2001
Ie
0.8
mA
mm
*)
mW/sr
(500)**)
ESD protection
ESD protection on all pins
Method: Human body model
Latch up
*)
d
1
kV
d
|± 100|
mA
Due to the internal limitation measures the device is a "class1" device
**)
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220
Rev. 2.1, 25-Sep-06
TFBS5700
Transceiver
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
V
Idle, dark ambient
SD = Low (< 0.8 V), Ee = 0 klx
ICC
550
Receiving
SD = Low, 1 Mbit/s,
ICC
0.75
SD = High (> VCC1 - 1.3 V),
T = 25 °C, Ee = 0 klx T = 25 °C
ISD
SD = High, (> VCC1 - 1.3 V),
T = 85 °C
ISD
Output voltage low
IOL = 0.5 mA, Cload = 15 pF
VOL
Output voltage high
IOH = - 250 μA, Cload = 15 pF
VOH
Output voltage high
IOH = 0 μA, Cload = 15 pF
VOH
RXD to internal Vlogic
impedance
SD = active, pull-up in shutdown
RRXD
400
Input voltage low
(TXD, SD)
VIL
- 0.5
Input voltage high
(TXD, SD)
VIH
1.3
IS-SD,
IIN-SD
- 1.1
tSDPW
0.2
900
μA
mA
Ee = 100 mW/m2
Dark ambient
Shutdown supply current at
maximum operating
temperature
Input leakage current
(TXD, SD) *)
SD mode programming pulse
width
Input capacitance
(TXD, SD)
*)
0.01
TA
Vin = 0.9 x VCC1
CI
- 25
1.0
μA
5.0
PA
+ 85
°C
0.4
V
1.44
V
1.98
V
800
k:
0.5
V
1.8
2.2
V
4
10
μA
300
μs
5
pF
500
Decision level 0.9 V
Rev. 2.1, 25-Sep-06
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221
TFBS5700
Receiver
Parameter
Test Conditions
Symbol
angular range **)
SIR mode
O = 850 nm to 900 nm
Ee
angular range **)
MIR mode
1.152 Mbit/s
O = 850 nm to 900 nm
Ee
angular range ***)
O = 850 nm to 900 nm
Ee
irradiance *)
According to IrDA appendix A1,
fluorescent light specification
Ee
signal, dafault mode after power
on or reset
Input pulse length
TWopt > 200 ns
Min
Typ.
Max
Unit
50
(5)
81
(8.1)
mW/m2
50
(5)
140
(14)
5
(500)
(μW/cm2)
mW/m2
(μW/cm2)
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(μW/cm2)
300
400
500
ns
10 % to 90 %, CL = 15 pF
tr (RXD)
10
27
60
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
10
17
60
ns
tPW
1.7
2.0
2.9
μs
SIR ENDEC compatility mode 1): Input pulse length
RXD pulse width of output signal TWopt > 200 ns, see chapter
“Programming”
Input irradiance = 150 mW/m2,
d 1.152 Mbit/s, 576 kbit/s
70
ns
d 115.2 kbit/s
350
ns
Standby/shutdown delay
after shutdown active or (SD
low to high transition)
1.5
ms
Shutdown active time window for During this time the pulse
programming
duration of the output can be
programmed to the application
mode. see chapter
“Programming”
600
μs
Receiver start up time,
Power on delay
Shutdown recovery delay
250
μs
200
μs
0.6
After shutdown inactive (SD
high to low transition) and
power-on
Latency
tL
50
®
Note: All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header.
The data given here are valid 5 μs after starting the preamble.
*)
lamps
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length.
e
1)
Some ENDECs are not able to decode short pulses as valid SIR pulses. Therefore this additional mode was added in TFBS5700.
TFBS5700 is set to the "short output pulse" as default after power on, also after recovering from the shutdown mode (SD must have been
longer active than 1.5 ms). For mode changing see the chapter "Programming".
www.vishay.com
222
Rev. 2.1, 25-Sep-06
TFBS5700
Transmitter
Parameter
Test Conditions
Recommended IRED operating
peak current **)
The IRED current must be
controlled by an external
resistor
TXD = 0 V, Tamb = 25 °C
TXD = 0 V, Tamb = 85 °C
Symbol
Typ.
Max
Unit
ID
200
600
mA
IIRED
200
1
pA
μA
500
mW/sr
0.04
mW/sr
Output radiant intensity, s. figure a = 0°, 15°, TXD = High, SD =
3, recommended appl. circuit
Low, VCC1 = 2.5 V, VCC2 = 2.9 V,
Rs = 4.7 :
Ie
VCC1 = 5.0 V, D = 0°, 15° TXD =
Low, SD = High (Receiver is
Ie
Peak - emission wavelength *)
Op
Optical spectral bandwidth
'O
Optical rise time,
Optical fall time
Min
25
60
880
900
nm
45
tropt,
tfopt
10
Input pulse width 217 ns,
1.152 Mbit/s
topt
180
topt
topt
217
Optical overshoot
nm
40
ns
240
ns
tTXD
85
μs
μs
25
%
*) Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for
the standard Remote Control applications with codes as e.g. Philips RC5/RC6® or RECS 80. When operated under IrDA full range conditions (> 120 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers
are used.
**) Typ. conditions for If = 200 mA, VCC2 = 2.9 V, Rs = 4.7 :
Table 1.
Truth table
Inputs
Outputs
Remark
SD
TXD
RXD
Transmitter
Operation
high
< 600 μs
x
x
weakly pulled
(500 k:) to VCC1
0
Time window for
pulse duration
setting
high
> 1.5 ms
x
x
weakly pulled
(500 k:) to VCC1
0
Shutdown
low
high
x
low (active)
Ie
Transmitting
low
high > 80μs
x
high inactive
0
low
low
<4
high inactive
0
Ignoring low signals
below the IrDA
defined threshold for
noise immunity
low
low
> Min. irradianceEe
low (active)
0
Response to an
IrDA compliant
low
low
undefined
0
Overload conditions
can cause
unexpected outputs
Rev. 2.1, 25-Sep-06
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223
TFBS5700
TFBS5700 needs only one additional external component for setting the IRED drive current. However,
depending on the entire system design and board layout, additional components may be required (see
figure 1).
V cc2
R1
V cc1
R2
C1
GND
IRED Anode
V cc
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
19297
This one should be a small ceramic version or other
fast capacitor to guarantee the fast rise time of the
IRED current. The resistor R1 is only necessary for
setting the IRED drive current.
quality of the supply voltages VCCx and injected
noise. An unstable power supply with dropping voltage during transmission may reduce the sensitivity
(and transmission range) of the transceiver.
In addition, when connecting the described circuit to
used.
10 μF (type, see table under C1) at VCC2 will be helpful.
longer signal lines should not be used without termination. See e.g. "The Art of Electronics" Paul Horowitz, Wienfield Hill, 1989, Cambridge University Press,
ISBN: 0521370957.
Table 2.
Component
Recommended Value
C1, C2
0.1 μF, Ceramic
Vishay part# VJ 1206 Y 104 J XXMT
R1
2.9 V to 5.4 V supply voltage VCC2: add a
resistor in series, e.g. 4.7:
R2
47 :, 0.125 W (VCC1 t 2.5 V)
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Rev. 2.1, 25-Sep-06
TFBS5700
I/O and Software
Simplified Method
Setting the device to the long pulse duration is nothing
else than a short active SD pulse of less than 600 μs.
In any case a short SD pulse will force the device to
leave the default mode and go the compatibility
mode. Backwards also an active SD can be used to
fall back into the default mode by applying that signal
for a minimum of 1.5 ms. That causes a power-onreset and sets the device to the default short pulse
mode. This simplified method takes more time but
may be easier to handle.
Programming Pulse duration Switching
After Power-on the TFBS5700 is in the default short
pulse duration mode. Some ENDECs are not able to
decode short pulses as valid SIR pulses. Therefore
an additional mode with an extended pulse duration
as in standard SIR transceivers was added in
TFBS5700. TFBS5700 is set to the “short output
pulse” as default after power on, also after recovering
from the shutdown mode (SD must have been longer
active than 1.5 ms). For mode changing see the following. To switch the transceivers from the short
pulse duration mode to the long pulse duration mode
and vice versa, the programming sequences
described below are required.
50 %
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Setting to the ENDEC compatibility mode
with an RXD pulse duration of 2 μs
1. Set SD input to logic "HIGH".
2. Set TXD input to logic "LOW". Wait ts t 200 ns.
3. Set SD to logic "LOW" (this negative edge latches
state of TXD, which determines speed setting).
4. TXD must be held for th t 200 ns. After waiting th
t 200 ns TXD.
TXD is now enable as normal TXD input for the longer
RXD - pulse duration mode.
Figure 2. Mode Switching Timing Diagram
Setting back to the default mode with
400 ns RXD-output pulse duration
2. Set TXD input to logic "HIGH". Wait ts t 200 ns.
4. After waiting th t 200 ns TXD is limited by the maximum allowed pulse length.
TXD is now enabled as normal TXD input.
The timing of the pulse duration changing procedure
is quite uncritical. However, the whole change must
not take more than 600 μs. See in the spec. “Shutdown Active Time Window for Programming”
Rev. 2.1, 25-Sep-06
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225
TFBS5700
Manual Soldering
desoldering.
260
10 s max. at 230 °C
240 °C max.
240
220
2...4 °C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 °C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
refer to Application note: SMD Assembly Instruction
Storage
280
T ≥ 255 °C for 20 s max
260
240
T ≥ 217 °C for 50 s max
220
200
180
Temperature/°C
Temperature/°C
160 °C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 °C...4 °C/s
80
60
2 °C...4 °C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
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226
Rev. 2.1, 25-Sep-06
TFBS5700
19325_1
Figure 5. TFBS5700 mechanical dimensions, tolerance ± 0.2 mm if not otherwise mentioned
19294
Figure 6. TFBS5700 soldering footprint, tolerance ± 0.2 mm if not otherwise mentioned
Rev. 2.1, 25-Sep-06
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227
TFBS5700
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
www.vishay.com
228
W3 max.
Rev. 2.1, 25-Sep-06
TFBS5700
19286
Rev. 2.1, 25-Sep-06
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229
TFBS5711
Fast Infrared Transceiver Module (MIR, 1.152 Mbit/s)
Description
The TFBS5711 is an infrared transceiver module
compliant to the latest IrDA physical layer standard for
fast infrared data communication, supporting IrDA
speeds up to 1.152 Mbit/s (MIR), HP-SIR®, Sharp
ASK® and carrier based remote control modes up to
2 MHz. Integrated within the transceiver module are a
PIN photodiode, an infrared emitter (IRED), and a
low-power control IC to provide a total front-end solution in a single package.
The transceivers are capable of directly interfacing
with a wide variety of I/O devices, which perform the
modulation/ demodulation function. At a minimum a
serial resistor for current control is the only external
20208
component required in implementing a complete solution. TFBS5711 has a tri-state output and is floating in
shut-down mode with a weak pull-up.
Features
layer low power specification (up to
1.152 Mbit/s) and TV Remote Control
e4
• Operates from
2.7 V to 5.5 V within specification
• Industries smallest footprint
- 6.0 mm length
- 1.9 mm height
• Low Power Consumption (typ. 0.55 mA
Supply Current in receive mode, no signal)
• Power Shutdown Mode (< 5 PA Shutdown Current
in Full Temperature Range, up to 85 °C)
• Surface Mount Package, low profile (1.9 mm)
Universal (L 6.0 mm x W 3.1 mm x H 1.9 mm)
• Directly Interfaces with Various Super I/O and
Controller Devices
with a weak pull-up
requirements saving costs, US - Patent No.
6,157,476
• Only One External Component Required
• TV Remote Control supported
(MSL4)
WEEE 2002/96EC
Applications
• Telecommunication Products
(Cellular Phones, Pagers)
• Digital Still and Video Cameras
• Printers, Fax Machines, Photocopiers,
Screen Projectors
• Medical and Industrial Data Collection
• Notebook Computers, Desktop PCs,
Palmtop Computers (Win CE, Palm PC), PDAs
• Internet TV Boxes, Video Conferencing Systems
• External Infrared Adapters (Dongles)
• Kiosks, POS, Point and Pay Devices including
IrFM - Applications
Parts Table
Part
Description
Qty / Reel
TFBS5711-TR1
1000 pcs
TFBS5711-TR3
2500 pcs
www.vishay.com
230
Rev. 1.5, 03-Jul-06
TFBS5711
VCC1
Tri-State
Driver
Amplifier
Comparator
RXD
VCC2
Controlled
Driver
Logic
&
SD
TXD
Control
GND
18512
Pinout
TFBS5711
weight 50 mg
PIN 1
19428
Pin Number
Function
Description
1
VCC2
IRED Anode
Connect IRED anode directly to be the power supply (VCC2). An
external resistor is necessary for controlling the IRED current. A
separate unregulated power supply can be used at this pin.
I/O
Active
2
TXD
This Schmitt-Trigger input is used to transmit serial data when SD
is low. An on-chip protection circuit disables the LED driver if the
TXD pin is asserted for longer than 80 μs. When used in conjunction
with the SD pin, this pin is also used to control receiver output pulse
duration.
I
HIGH
3
RXD
driving standard CMOS or TTL loads. No external pull-up or pulldown resistor is required. Floating with a weak pull-up of 500 k:
(typ.) in shutdown mode.
O
LOW
4
SD
Shutdown, also used for setting the output pulse duration. Setting
this pin active for more than 1.5 ms places the module into
shutdown mode. Before that (t < 0.7 ms) on the falling edge of this
signal, the state of the TXD pin is sampled and used to set the
receiver output to long pulse duration (2 μs) or to short pulse
duration (0.4 μs) mode
I
HIGH
5
VCC1
Supply Voltage
6
GND
Ground
Rev. 1.5, 03-Jul-06
www.vishay.com
231
TFBS5711
Reference point Ground (Pin 6) unless otherwise noted.
Symbol
Min
Max
Unit
transceiver
Parameter
- 0.3 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.3
Typ.
+ 6.0
V
transmitter
- 0.5 V < VCC1 < 6 V
VCC2
- 0.3
+ 6.5
V
Input currents
pin
10
mA
Power dissipation
See derating curve
PD
125
°C
- 25
+ 85
°C
Tstg
- 25
+ 85
°C
240
°C
IIRED(DC)
125
mA
IIRED(RP)
600
mA
V
TJ
See recommended solder
profile
current, pin 1
t < 90 μs, ton < 20 %
mA
mW
Tamb
(operating)
25
500
VIREDA
- 0.5
+ 6.5
Vin
- 0.5
+ 5.5
V
50
pF
Voltage at all inputs and outputs Vin < VCC1 is allowed
Load at mode pin when used as
mode indicator
Definitions:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4.A new version of the standard in any case obsoletes the former version.
With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version IrPhy 1.4
(in Oct. 2002).
Symbol
Min
Typ.
Virtual source size
Parameter
energy
d
1.3
1.5
IEC60825-1 or EN60825-1,
ratings
Ie
*)
Test Conditions
Max
Unit
mm
mW/sr
*)
(500)**)
Due to the internal limitation measures the device is a "class 1" device.
**)
www.vishay.com
232
Rev. 1.5, 03-Jul-06
TFBS5711
Transceiver
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC1
2.7
Typ.
Max
Unit
5.5
V
SD = Low, Ee = 1 klx
ICC
550
900
μA
IIRED = 500 mA, 25 % Duty
Cycle
ICC
1100
1500
μA
ISD
1
μA
SD = High, T = 25 °C,
ISD
2.5
μA
SD = High, T = 85 °C, not
ambient light sensitive
ISD
5
μA
+ 85
°C
CLoad = 15 pF, IOL = 1 mA
VOL
0.4
V
IOH = - 500 μA
VOH
0.8 x VCC1
VOH
0.9 x VCC1
RRXD
400
Ee = 1 klx*)
TA
- 25
V
V
500
600
k:
V
VIL
- 0.5
0.5
VIH
VCC1 - 0.5
VCC1 + 0.5
V
IICH
-2
+2
μA
SD, TXD = "0" to "1",
0 < Vin < 0.15 VCC1
IIRTx
+ 150
μA
SD, TXD = "0" to "1",
Vin > 0.7 VCC1
IIRTx
1
μA
5
pF
CMOS level**)
-1
0
CIN
*)
**)
The typical threshold level is 0.5 x VCC1. It is recommended to use the specified min/max values to avoid increased operating current
Receiver
Typ.
Max
Unit
irradiance
Parameter
9.6 kbit/s to 1152 kbit/s
O = 850 nm - 900 nm
Test Conditions
Ee
100
(10)
150
(15)
mW/m2
irradiance
O = 850 nm - 900 nm
Ee
5
(500)
irradiance
Symbol
Ee
Min
(μW/cm2)
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(μW/cm2)
10 % to 90 %, CL = 15 pF
tr(RXD)
20
60
90 % to 10 %, CL = 15 pF
tf(RXD)
20
60
ns
tPW
300
400
500
ns
tPW
1.7
2.0
2.9
μs
RXD pulse width of output signal, input pulse length
default mode after power on
tPWopt > 200 ns
SIR ENDEC compatibility
mode*): RXD pulse width of
output signal
Rev. 1.5, 03-Jul-06
Input pulse length
tPWopt > 200 ns, see chapter
"Programming"
ns
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233
TFBS5711
Parameter
Max
Unit
1.152 Mbit/s, 576 kbit/s
Test Conditions
Symbol
Min
Typ.
80
ns
d 115.2 kbit/s
350
ns
1.5
ms
After shutdown active or (SD low
to high transition)
Shutdown active time window for
programming
During this time the pulse
mode. see chapter
"Programming"
600
μs
Receiver start up time power on
delay shutdown recovery delay
high to low transition) and after
power-on
300
μs
200
μs
Latency
0.6
tL
*)
Some ENDECs are not able to decode short pulses as valid SIR pulses. Therefore this additional mode was added in TFDU5307.
TFDU5307 is set to the "short output pulse" as default after power on, also after recovering from the shutdown mode (SD must have been
longer active than 1.5 ms). For mode changing see the chapter "Programming"
Transmitter
Parameter
Test Conditions
Symbol
Min
recommended serial resistor for
MIR applications
VCC2 = 3.3 V: RS = 2.0 :
VCC2 = 5.0 V: RS = 5.6 :
TXD = 0 V, 0 < VCC1 < 5.5 V
IIRED
-1
recommended application
circuit, see figure 1
IF = 250 mA, D = 0 °,
D = 15 °, VCC2 = 2.7 V,
Ie
10
VCC1 = 5.0 V, D = 0 °, 15 °
SD = High)
Ie
ID
Peak - emission wavelength*)
Op
Spectral bandwidth
'O
Optical overshoot
Max
Unit
400
500
mA
1
μA
25
mW/sr
0.04
D
half intensity
Typ.
± 24
880
mW/sr
°
900
45
nm
nm
tropt, tfopt
10
topt
200
topt
20
tTXD
μs
topt
20
85
μs
25
%
1.152 Mbit/s
217
40
ns
240
ns
*)
the standard Remote Control applications with codes as e.g. Phillips RC5/RC6® or RECS 80. With the typical specified intensity an RC
operating range of about 4 m can be expected.
www.vishay.com
234
Rev. 1.5, 03-Jul-06
TFBS5711
Recommended Circuit Diagram for
IrDA and Remote Control Operation
In general Vishay transceivers are using the identical
circuit for IrDA and Remote Control operation. For
using the IrDA transceiver as an RC transmitter no
change of the operating circuit is necessary. Used
with a clean low impedance power supply the
TFBS5711 only needs an external series current limiting resistor. However, depending on the entire system design and board layout, additional external
components may be required (see figure 1).
V2
R1
IRED Anode VCC2
V1
R2
VCC1
C1
C3
C2
GND
Ground
SD
SD
Txd
Txd
Rxd
Rxd
18560
The resistor R1 is the current limiting resistor and this
is supply voltage dependent, see derating curve in figure 4, to avoid too high internal power dissipation.
quality of the supply voltages V1 and V2 and injected
the transceiver power supply pins. An Tantalum
capacitor should be used for C1 while a ceramic
capacitor is used for C2.
used.
at V2. Often some power supplies are not apply to follow the fast current rise time. In that case another
4.7 PF (type, see table under C1) at V2 will be helpful.
port.
ISBN: 0521370957.
Table 1.
Component
Recommended Value
C1
4.7 μF, 16 V
293D 475X9 016B
C2
0.1 μF, Ceramic
R1
5 V supply voltage: 5.6 : s. text 0.25 W (recommended
using two 2.8 :, 0.125 W resistors in series).
3.3 V supply voltage: 2.0 : s. text 0.25 W
e.g. 2 x CRCW-1206-2R0-F-RT1 for 3.3 V supply voltage
R2
47 :, 0.125 W
Rev. 1.5, 03-Jul-06
Vishay Part Number
www.vishay.com
235
TFBS5711
I/O and Software
Programming
Pulse duration Switching
After Power-on the TFBS5711 is in the default short
RXD pulse duration mode.
Some ENDECs are not able to decode short pulses
as valid SIR pulses. Therefore an additional mode
with extended pulse duration (same as in standard
SIR transceivers) is added in TFBS5711. TFBS5711
is set to the "short output pulse" as default after power
on, and after recovering from the shutdown mode (SD
being active longer than 1.5 ms).
To switch the transceivers from the short RXD pulse
duration mode to the long pulse duration mode and
vice versa, follow the procedure described below.
4. After waiting th t 200 ns TXD can be set to logic
"LOW". The hold time of TXD is limited by the maximum allowed pulse length.
After that TXD is now enabled as normal TXD input
and the RXD output is set for the short RXD - pulse
duration mode.
not take more than 600 Ps. See in the spec. "Shutdown Active Time Window for Programming"
SD
50 %
ts
th
High:
TXD 50 %
400 ns
50 %
Low:
2 μs
18150
with an RXD pulse duration of 2 Ps
4. After waiting th t 200 ns.
After that TXD is enabled as normal TXD input and
the RXD output is set for the longer RXD - pulse duration mode.
Setting back to the default mode with a
400 ns pulse duration
www.vishay.com
236
Figure 2. Timing Diagram for changing the output pulse duration
Simplified Method
Setting the device to the long pulse duration is simply
applying a short active (less than 600 Ps) pulse to SD
(TXD = Low). In any case a short SD pulse will force
the device to leave the default mode and go the compatibility mode. Vice versa applying a 1.5 ms (minimum) pulse at SD will cause the device to go back to
the default mode by activating a power-on-reset and
setting the device to the default short pulse mode.
This simplified method takes more time but may be
easier to handle.
Rev. 1.5, 03-Jul-06
TFBS5711
Table 2.
Truth table
Inputs
Outputs
Remark
SD
TXD
RXD
Transmitter
Operation
high
< 600 Ps
x
x
weakly pulled
(500 k:) to VCC1
0
Time window for pulse duration
setting
high
> 1.5 ms
x
x
weakly pulled
(500 k:) to VCC1
0
Shutdown
low
high
x
low (active)
Ie
Transmitting
high
> 80 Ps
x
high inactive
0
low
<4
high inactive
0
IrDA defined threshold for noise
immunity
low
> Min. Detection Threshold
Irradiance
< Max. Detection Threshold
Irradiance
low (active)
0
low
> Max. Detection Threshold
Irradiance
undefined
0
unexpected outputs
Dry packing
Recommended Method of Storage
The reel is packed in a moisture proof aluminum bag
to protect the device from absorbing moisture during
transportation and storage.
Dry box storage is recommended as soon as the dry
bag has been opened to prevent moisture absorption.
The following conditions should be observed, if dry
boxes are not available:
Aluminum bag
Moisture Level
Sticker
BarCode
ESD Sticker
Label
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
Box
0
Reel
18298
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard JSTD-020
Acc. to EIA JEDEC Standard JSTD-020
Rev. 1.5, 03-Jul-06
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237
TFBS5711
Storage
260
10 s max. at 230 °C
240 °C max.
240
220
2...4 °C/s
200
180
Temperature/°C
160 °C max.
160
140
120 s...180 s
120
90 s max.
100
80
280
2...4 °C/s
60
260
40
240
20
220
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
200
0
50
100
150
200
250
300
350
Time/s
19431
180
Temperature/°C
0
160
20 s
140
120
90 s...120 s
100
50 s max.
2 °C...4 °C/s
80
60
2 °C...4 °C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
limiting resistor. A minimum resistor of 2 Ohms is recommended from the anode of the IRED to VCC.
Manual Soldering
desoldering.
90
Wave Soldering
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
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238
Rev. 1.5, 03-Jul-06
TFBS5711
Package Dimensions in mm (Inches)
19612
Figure 6. Package drawing of TFBS5711, tolerance of height is + 0.1mm, - 0.2 mm, other tolerances ± 0.2 mm
19728
Figure 7. Recommended Solder Footprint
Rev. 1.5, 03-Jul-06
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239
TFBS5711
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
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240
W3 max.
Rev. 1.5, 03-Jul-06
TFBS5711
19613
Rev. 1.5, 03-Jul-06
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241
TFDU5307
Fast Low Profile (2.5 mm) Infrared Transceiver Module
(MIR, 1.152 Mbit/s) for IrDA® Applications
Description
The TFDU5307 is an infrared transceiver module
compliant to the latest IrDA physical layer standard,
supporting IrDA speeds up to 1.152 Mbit/s (MIR) and
carrier based remote control modes up to 2 MHz. Integrated within the transceiver module are a PIN photodiode, an infrared emitter (IRED), and a low-power
control IC to provide a total front-end solution in a single package.
This Vishay MIR transceiver is built in a low profile
package using the experiences of the lead frame
babyface technology. The transceivers are capable of
directly interfacing with a wide variety of I/O devices,
which perform the modulation/ demodulation function.
At a minimum, a VCC bypass capacitor and a serial
resistor for current control are the only external com-
20101
ponents required implementing a complete solution.
TFDU5307 has a tri-state output and is floating in
shutdown mode with a weak pull-up.
Features
layer specification (up to 1.152 Mbit/s)
and TV Remote Control, bi-directional
operation included.
e3
• Sensitivity covers full IrDA range.
Recommended operating range is from nose to
nose to 70 cm
• Operates from
2.7 V to 5.5 V within specification
• Low power consumption (typ. 0.55 mA
Supply current in receive mode, no signal)
• Power shutdown mode (< 5 μA Shutdown Current
in Full Temperature Range, up to 85 °C)
• Surface mount package, low profile
universal (L 8.5 mm x W 2.9 mm x H 2.5 mm)
Capable of surface mount soldering to side and
top view orientation
• Backward pin compatible to Vishay
Semiconductors SIR and MIR infrared
transceivers
• Directly interfaces with various super I/O and controller devices
a weak pull-up
6,157,476
• Logic voltage 1.5 V to 5.5 V is independent of
IRED driver and analog supply voltage
• Only one external component required
• TV remote control supported
• Transmitter intensity can be adjusted by an
external resistor for extended range (> 0.7 m) or
minimum low
power (> 0.2 m) IrDA compliance.
(MSL4)
WEEE 2002/96EC
Applications
• Telecommunication products (cellular phones,
pagers)
• Low power consumption (typ. 0.55 mA
Supply current in receive mode, no signal)
www.vishay.com
242
Computers (Win CE, Palm PC), PDAs
• External infrared adapters (dongles)
• Kiosks, POS, Point and Pay devices including
IrFM - applications
Rev. 1.5, 07-Apr-06
TFDU5307
Parts Table
Part
Description
TFDU5307-TR1
Qty / Reel
750 pcs
TFDU5307-TR3
2500 pcs
TFDU5307-TT1
750 pcs
TFDU5307-TT3
2500 pcs
Vlogic
VCC1
Tri-State
Driver
Amplifier
SD
TXD
Comparator
Logic
&
VCC2
RXD
IRED Driver
Control
IRED C
GND
18509
Pin Description
Pin Number
Function
Description
1
IRED
Anode
Connect IRED anode to the VCC2 power supply through an external current
limiting resistor. A separate unregulated power supply can be used at this pin.
I/O
Active
2
IRED
Cathode
3
TXD
This Schmitt-Trigger input is used to transmit serial data when SD is low. An onchip protection circuit disables the LED driver if the TXD pin is asserted for longer
than 80 Ps. When used in conjunction with the SD pin, this pin is also used to
control receiver output pulse duration. The input threshold voltage adapts to and
follows the logic voltage reference applied to the Vlogic pin (pin 7).
I
HIGH
4
RXD
Received Data Output, push-pull CMOS driver output capable of driving standard
CMOS or TTL loads. No external pull-up or pull-down resistor is required. Floating
with a weak pull-up of 500 k: (typ.) in shutdown mode. The voltage swing is
defined by the applied Vlogic voltage
O
LOW
5
SD
Shutdown. Also used for setting the output pulse duration. Setting this pin active
for more than 1.5 ms places the module into shutdown mode. Before that (t < 0.7
ms) on the falling edge of this signal, the state of the TXD pin is sampled and used
to set the receiver output to long pulse duration (2 μs) or to short pulse duration
(0.4 Ps) mode. The input threshold voltage adapts to and follows the logic voltage
reference applied to the Vlogic pin (pin 7).
I
HIGH
6
VCC1
Supply Voltage
7
Vlogic
Vlogic defines the logic voltage levels for input and output. The RXD output range
is from 0 V to Vlogic, for optimum noise suppression the inputs’ logic decision level
is 0.5 x Vlogic
8
GND
Ground
Rev. 1.5, 07-Apr-06
I
www.vishay.com
243
TFDU5307
Pinout
Definitions:
TFDU5307
weight 75 mg
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
18101
5
6
1
2
3
4
8
7
IRED A IRED C TXD RXD SD Vcc Vlog GND
version.
With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version
Symbol
Min
Max
Unit
transceiver
Parameter
- 0.3 V < VCC2 < 6 V
- 0.5 V < Vlogic < 5.5 V
Test Conditions
VCC1
- 0.3
+ 6.0
V
transmitter
- 0.5 V < VCC1 < 6 V
- 0.5 V < Vlogic < 5.5 V
VCC2
- 0.3
+ 6.5
V
Supply voltage range, Vlogic
- 0.5 V < VCC1 < 6 V
- 0.3 V < VCC2 < 6.5 V
Vlogic
- 0.3
+ 5.5
V
Input current
pin
10
mA
Power dissipation
See derating curve, figure 4
current, pin 1 to pin 2
t < 90 μs, ton < 20 %
Voltage at all inputs and outputs Vin < VCC1 is allowed
mode indicator
www.vishay.com
244
mA
mW
125
°C
- 25
+ 85
°C
Tstg
- 25
+ 85
°C
260
°C
IIRED(DC)
125
mA
IIRED(RP)
600
mA
V
profile (figure 3)
25
500
Tamb
TJ
(operating)
PD
Typ.
VIREDA
- 0.5
+ 6.5
Vin
- 0.5
+ 5.5
V
50
pF
Rev. 1.5, 07-Apr-06
TFDU5307
Symbol
Min
Typ.
Virtual source size
Parameter
energy
d
1.8
2.0
IEC60825-1 or EN60825-1,
ratings
Ie
*)
Test Conditions
Max
Unit
mm
(500)*) **)
mW/sr
Max
Unit
Due to the internal limitation measures the device is a "class 1" device.
**)
Transceiver
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC1
2.7
Typ.
5.5
V
Idle supply current
ICC1
550
900
μA
Cycle
ICC
1100
1500
μA
ISD
1
μA
SD = High, T = 25 °C,
ISD
2.5
μA
SD = High, T = 85 °C, not
ISD
5
μA
+ 85
°C
CLoad = 15 pF, IOL = 1 mA
VOL
0.4
V
IOH = - 500 μA
VOH
0.8 x Vlogic
VOH
0.9 x Vlogic
RRXD
400
Ee = 1 klx*)
TA
CMOS level**)
Input leakage current (TXD, SD) Vin = 0.9 x Vlogic
SD, TXD = "0" to "1",
0 < Vin < 0.15 Vlogic
SD, TXD = "0" to "1",
Vin > 0.7 Vlogic
*)
- 25
V
V
500
600
k:
V
VIL
- 0.5
0.5
VIH
Vlogic - 0.5
Vlogic + 0.5
V
IICH
-2
+2
μA
+ 150
μA
1
μA
5
pF
IIRTx
IIRTx
CIN
-1
0
**)
The typical threshold level is 0.5 x Vlogic. It is recommended to use the specified min/max values to avoid increased operating current.
The inputs in low state are actively loaded for noise protection. See for that the "Controlled pull down current" spec. Equivalently a pull up
current stabilizes the state when the inputs are in high state.
Rev. 1.5, 07-Apr-06
www.vishay.com
245
TFDU5307
Receiver
Parameter
Test Conditions
Symbol
Min
Typ.
Max
Unit
40
(4)
90
(9)
mW/m2
irradiance
O = 850 nm - 900 nm
Ee
irradiance
O = 850 nm - 900 nm
Ee
No detection receiver input
irradiance
Threshold! No RXD output
below this irradiance value
allowed
Ee
10 % to 90 %, CL = 15 pF,
Vlogic = VCC
tr(RXD)
20
60
ns
90 % to 10 %, CL = 15 pF,
Vlogic = VCC
tf(RXD)
20
60
ns
tPW
300
400
500
ns
tPW
1.7
2.0
2.9
μs
1.152 Mbit/s, 576 kbit/s
80
ns
d 115.2 kbit/s
350
ns
1.5
ms
Input pulse length
signal, default mode after power PWopt > 200 ns
on or reset
SIR ENDEC compatibility
mode*): RXD pulse width of
output signal
Input pulse length
PWopt > 200 ns, see chapter
"Programming"
5
(500)
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(μW/cm2)
After shutdown active or (SD low
to high transition)
Shutdown active time window
for programming
During this time the pulse
mode. see chapter
"Programming"
600
μs
Receiver start up time power on
delay shutdown recovery delay
high to low transition) and after
power-on
300
μs
200
μs
Latency
0.6
(μW/cm2)
tL
*)
Some ENDECs are not able to decode short pulses as valid SIR pulses. Therefore this additional mode was added in TFDU5307.
TFDU5307 is set to the "short output pulse" as default after power on, also after recovering from the shutdown mode (SD must have been
longer active than 1.5 ms). For mode changing see the chapter "Programming"
www.vishay.com
246
Rev. 1.5, 07-Apr-06
TFDU5307
Transmitter
Parameter
Test Conditions
recommended serial resistor for
MIR applications
VCC2 = 3.3 V: RS = 2.0 :
VCC2 = 5.0 V: RS = 5.6 :
TXD = 0 V, 0 < VCC1 < 5.5 V
circuit, see figure 1
D = 0 °, If =420 mA
Symbol
Min
ID
Typ.
Max
Unit
450
500
mA
IIRED
-1
1
μA
Ie
110
500
mW/sr
Ie
70
500
mW/sr
0.04
mW/sr
TXD = High, SD = Low **)
D = 0 °, 15 °, If =420 mA
120
TXD = High, SD = Low **)
VCC1 = 5.0 V, D = 0 °, 15 °
SD = High)
Ie
D
half intensity
Peak - emission wavelength*)
Op
Spectral bandwidth
'O
± 24
880
°
900
nm
45
nm
tropt, tfopt
6
1.152 Mbit/s
Note: IrDA specification for MIR
topt
190
(147.6)
topt
20
tTXD
μs
topt
20
85
μs
25
%
Optical overshoot
217
40
ns
240
(260)
ns
ns
*)
the standard Remote Control applications with codes as e.g. Philips RC5/RC6® or RECS 80. When operated under IrDA full range conditions (>120 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers
are used.
**)
Typ. conditions for If = 420 mA, VCC2 = 3.3 V, Rs = 2.3 :, VCC2 = 5.0 V, Rs = 6.4 :
Rev. 1.5, 07-Apr-06
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247
TFDU5307
Used with a clean low impedance power supply the
TFDU5307 only needs an external series current limiting resistor. However, depending on the entire system design and board layout, additional components
may be required (see figure 1).
V IRED
R1
VCC
R2
C1
GND
IRED Anode
VCC
C2
Ground
Vlogic
Vlogic
SD
SD
TXD
TXD
RXD
RXD
IRED Cathode
18147
The resistor R1 is the current limiting resistor and this
is supply voltage dependent, see derating curve in figure 4, to avoid too high internal power dissipation.
quality of the supply voltages and injected noise. An
the transceiver power supply pins. A Tantalum capacitor should be used for C1 while a ceramic capacitor
is used for C2.
used.
follow the fast current rise time. In that case another
4.7 μF (type, see table under C1) at VCC2 will be helpful.
port.
ISBN: 0521370957.
Table 1.
Component
Recommended Value
C1
4.7 μF, 16 V, Tantalum
293D 475X9 016B
C2
0.1 μF, Ceramic
R1
5 V supply voltage: 5.6 : s. text 0.25 W (recommended
using two 2.8 :, 0.125 W resistors in series).
3.3 V supply voltage: 2.0 : s. text 0.25 W
e.g. 2 x CRCW-1206-2R0-F-RT1 for 3.3 V supply voltage
R2
47 :, 0.125 W
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248
Vishay Part Number
Rev. 1.5, 07-Apr-06
TFDU5307
I/O and Software
Programming
Pulse duration Switching
After Power-on the TFDU5307 is in the default short
RXD pulse duration mode.
Some ENDECs are not able to decode short pulses
as valid SIR pulses. Therefore an additional mode
with extended pulse duration (same as in standard
SIR transceivers) is added in TFDU5307. TFDU5307
is set to the "short output pulse" as default after power
on, and after recovering from the shutdown mode (SD
being active longer than 1.5 ms).
To switch the transceivers from the short RXD pulse
duration mode to the long pulse duration mode and
vice versa, follow the procedure described below.
After that TXD is now enabled as normal TXD input
and the RXD output is set for the short RXD - pulse
duration mode.
not take more than 600 μs. See in the spec. "Shutdown Active Time Window for Programming"
SD
50 %
ts
th
High:
TXD 50 %
Low:
with an RXD pulse duration of 2 μs
4. After waiting th t 200 ns.
the RXD output is set for the longer RXD - pulse duration mode.
Setting back to the default mode with a
400 ns pulse duration
Rev. 1.5, 07-Apr-06
400 ns
50 %
2 μs
18150
Figure 2. Timing Diagram for changing the output pulse duration
Simplified Method
Setting the device to the long pulse duration is simply
applying a short active (less than 600 μs) pulse to
SD. In any case a short SD pulse will force the device
to leave the default mode and go the compatibility
mode. Vice versa applying a 1.5 ms (minimum) pulse
at SD will cause the device to go back to the default
mode by activating a power-on-reset and setting the
device to the default short pulse mode. This simplified
method takes more time but may be easier to handle.
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249
TFDU5307
Table 2.
Truth table
Inputs
Outputs
Remark
SD
TXD
RXD
Transmitter
Operation
high
< 600 μs
x
x
weakly pulled
(500 k:) to VCC1
0
Time window for pulse duration
setting
high
> 1.5 ms
x
x
weakly pulled
(500 k:) to VCC1
0
Shutdown
low
high
x
low (active)
Ie
Transmitting
high
> 80 ms
x
high inactive
0
low
<4
high inactive
0
Ignoring low signals below the IrDA
defined threshold for noise
immunity
low
> Minimum irradiance Ee
< Maximum irradiance Ee
low (active)
0
low
> Maximum irradiance Ee
undefined
0
unexpected outputs
Temperature (°C)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 °C
240 °C max.
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
Wave Soldering
2...4 °C/s
0
50
19535
100
150
200
250
300
350
Time/s
figure 4 and 5 are VISHAY's recommended profiles
for use with the TFDU5307 transceivers. For more
www.vishay.com
250
Manual Soldering
desoldering.
Storage
Rev. 1.5, 07-Apr-06
TFDU5307
275
T ≥ 255 °C for 10 s....30 s
250
225
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
90
2 °C...3 °C/s
50
25
0
0
50
100
150
200
Time/s
19532
250
300
350
Temperature/°C
200
limiting resistor. A power dissipating resistor of 2 : is
recommended from the cathode of the IRED to
Ground for supply voltages above 4 V. In that case
the device can be operated up to 85 °C, too.
85
80
75
70
65
60
55
280
50
2.0
Tpeak = 260 °C max
260
240
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
220
200
Temperature/°C
180
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Rev. 1.5, 07-Apr-06
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251
TFDU5307
TFDU5307 - TinyFace (Universal) Package (Dimensions in mm)
(Mechanical Dimensions)
18100
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252
Rev. 1.5, 07-Apr-06
TFDU5307
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
Rev. 1.5, 07-Apr-06
W3 max.
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253
TFDU5307
19855
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
www.vishay.com
254
Rev. 1.5, 07-Apr-06
TFDU5307
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
Rev. 1.5, 07-Apr-06
www.vishay.com
255
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256
Contents
TFBS6711..............................258
TFBS6712..............................270
TFDU6102 ............................. 282
TFDU6103 ............................. 295
FIR
TFDU6300 ............................. 308
TFDU6301 ............................. 321
TFBS6614..............................334
(9.6 kbit/s to 4 Mbit/s)
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257
TFBS6711
Low Profile Fast Infrared Transceiver (FIR, 4 Mbit/s)
Description
The TFBS6711 is the smallest FIR transceiver available. It is a low profile and low-power IrDA transceiver. Compliant to IrDA’s Physical Layer specification, the TFBS6711 supports data transmission rates
from 9.6 kbit/s to 4 Mbit/s with a typical link distance
of 50 cm. It also enables mobile phones and PDAs to
function as universal remote controls for televisions,
DVDs and other home appliances. The TFBS6711
emitter covers a range of 6.5 meters with common
remote control receivers. Integrated within the transceiver module is a PIN photodiode, an infrared emitter, and a low-power control IC. The TFBS6711 can
be completely shutdown, achieving very low power
consumption. The TFBS6711 has an I/O voltage
20208
related to the supply voltage while TFBS6712 supports low voltage logic of 1.8 V allowing direct connection to a microcontroller’s I/Os operating at 1.8 V.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Lowest profile: 1.9 mm
Smallest footprint: 6.0 mm x 3.05 mm
Surface mount package
e4
IrDA transmit distance: 50 cm typical
Best Remote Control distance: t6.5 m on-axis
Fast data rates: from 9.6 kbit/s to 4 Mbit/s
Low shutdown current: 0.01 μA
Operating Voltage: 2.4 V to 3.6 V
Reduced pin count: 6 pins
I/O voltage equal to the supply voltage
Pin compatibility: TFBS4711 and TFBS5711
Integrated EMI Protection no external shield
required
•
•
•
•
IEC 60825-1 Class 1, Eye Safe
Qualified for Lead (Pb)-free and Sn/Pb processing
Compliant to IrDA Physical Layer Specification
Split power supply, transmitter and receiver can be
requirements saving costs, US patent
No. 6,157,476
(MSL4)
WEEE 2002/96/EC
Applications
• High-speed data transfer using infrared
wireless communication
• Mobile phones
• Camera phones
•
•
•
•
PDAs
MP3 Players
Digital Cameras
IrDA Adapters or Dongles
Package Options
Ordering Information
Part Number
Qty / Reel or Tube
Description and Remarks
TFBS6711-TR1
1000 pcs
TFBS6711-TR3
2500 pcs
Note: A version oriented in the carrier tape for top view mounting is available on request
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258
Rev. 1.2, 03-Jul-06
TFBS6711
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
SD
Logic
&
Controlled
Driver
Control
TXD
GND
19298
Figure 1. Functional Block Diagramm
Pin Description
Pin Number
Function
Description
1
VCC2, IRED
Anode
IRED anode to be externally connected to VCC2. For higher voltages as
3.6 V an external resistor might be necessary for reducing the internal power
dissipation. See derating curves. This pin is allowed to be supplied from an
uncontrolled power supply separated from the controlled V CC1 - supply
I/O
Active
2
TXD
Transmit Data Input
I
HIGH
3
RXD
Received Data Output, push-pull CMOS driver output capable of driving a
standard CMOS load. No external pull-up or pull-down resistor is required.
Floating with a weak pull-up of 500 k: (typ.) in shutdown mode. The RXD
output echos the TXD input during transmission.
O
LOW
4
SD
Shutdown, also used for dynamic mode switching
I
HIGH
5
VCC1
Supply voltage
6
GND
Ground
TFBS6711
Weight: 50 mg
PIN 1
19428
Figure 2. Pinning
Rev. 1.2, 03-Jul-06
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259
TFBS6711
Symbol
Min
Max
Unit
transceiver
Parameter
0 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.5
Typ.
6
V
transmitter
0 V < VCC1 < 6 V
VCC2
- 0.5
6.5
V
Input currents
Pin
10
mA
Power dissipation
PD
25
mA
500
mW
125
°C
(operating)
Tamb
- 25
+ 85
°C
Tstg
- 25
+ 85
°C
TJ
IIRED (DC)
< 90 μs, ton < 20 %
IRED anode voltage
Virtual source size
energy
IIRED (RP)
260
°C
125
mA
600
mA
IIREDA
- 0.5
6.5
V
Vin
- 0.5
5.5
d
1.5
V
mm
Maximum Intensity for Class 1 operation of
IEC60825-1 or EN60825-1, edition Jan. 2001
internal
limitation
to class 1
500
IrDA® specified maximum limit
mW/sr
Due to the internal limitation measures the device is a “class 1” device. It will not exceed the IrDA®
intensity limit of 500 mW/sr
Definitions:
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
IrDA, the Infrared Data Association, implemented MIR and FIR with IrPHY 1.1, followed by IrPhY 1.2, adding the SIR Low Power Standard. IrPhY 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhY 1.4. A new version of the standard in any
case obsoletes the former version.
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260
Rev. 1.2, 03-Jul-06
TFBS6711
Parameters
Test Conditions / Pins
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
V
Transceiver
Supply voltage
Receive mode only.
In transmit mode, add additional 85 mA (typ) for IRED current.
Add RXD output current depending on RXD load.
SD = Low, SIR mode
ICC
1.7
3
mA
SD = Low, MIR/FIR mode
ICC
1.9
3.3
mA
SD = High
T = 25 °C, not ambient light
sensitive, detector is disabled in
shutdown mode
ISD
1
μA
SD = High
sensitive
ISD
5
μA
+ 85
°C
Output voltage low
IOL = 1 mA
CLOAD = 15 pF
VOL
0.4
V
Output voltage high
IOH = - 250 μA
CLOAD = 15 pF
VOH
TA
- 25
0.9 x VCC
V
RRXD
400
600
k:
VIL
- 0.5
0.5
V
V IH
VCC - 0.5
VCC + 0.5
V
Input leakage current (TXD, SD)
IICH
-1
+1
μA
5
pF
Internal RXD pull-up
Input capacitance
(TXD, SD)
*)
CI
500
0.05
**)
The typical threshold level is 0.5 x VCC (VCC = 3 V). It is recommended to use the specified min/max values to avoid increased operating/
shutdown currents.
Rev. 1.2, 03-Jul-06
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261
TFBS6711
Parameter
Test Conditions
Symbol
angular range **)
O = 850 nm - 900 nm, VCC = 2.4 V
Ee
angular range
MIR mode
1.152 Mbit/s
O = 850 nm - 900 nm, VCC = 2.4 V
Ee
angular range
FIR mode
4 Mbit/s
O = 850 nm - 900 nm, VCC = 2.4 V
Ee
angular range ***)
O = 850 nm - 900 nm
Ee
Min
Typ.
Max
Unit
Receiver
No detection receiver Input
Irradiance (fluorescent light
noise suppression)
Ee
50
80
mW/m2
(5)
(8)
(μW/cm2)
100
mW/m2
(10)
(μW/cm2)
120
200
mW/m2
(12)
(20)
(μW/cm2)
5
kW/m2
(500)
(mW/cm2)
4
mW/m2
(0.4)
(μW/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
10
50
90 % to 10 %, CL = 15 pF
tf (RXD)
10
50
ns
signal, 50%, SIR mode
Input pulse length
1.4 Ps < PWopt < 25 μs
tPW
1.4
1.8
2.6
μs
signal, 50%, MIR mode
Input pulse length
PWopt = 217 ns, 1.152 Mbit/s
tPW
110
250
270
ns
signal, 50%, FIR mode
Input pulse length
PWopt = 125 ns, 4 Mbit/s
tPW
110
140
ns
Input pulse length
tPW
225
275
ns
RXD output jitter, leading edge
4 Mbit/s
1.152 Mbit/s
d115.2 kbit/s
After completion of shutdown
programming sequence
Power on delay
20
ns
40
ns
350
ns
500
μs
100
μs
Latency
tL
ns
Note: All timing data measured with 4 Mbit/s are measured using the IrDA® FIR transmission header. The data given here are valid 5 μs
after starting the preamble.
**) IrDA sensitivity definition: Minimum Irradiance E In Angular Range, power per unit area. The receiver must meet the BER specie
fication while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link
Length
***)
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262
Rev. 1.2, 03-Jul-06
TFBS6711
Symbol
Min
Typ.
Max
Unit
switched current control
Parameter
For 3.3-V operation no external
resistor is needed.
Test Conditions
ID
330
440
600
mA
VCC = VIRED = 3.3 V, TXD = Low
IIRED
-1
1
μA
s. figure 3, recommended
application circuit
VCC = VIRED = 3.3 V, D = 0°
TXD = High, SD = Low, R1 = 1:
Ie
45
115
300
mW/sr
s. figure 3, recommended
application circuit
VCC = VIRED = 3.3 V, D = 0°, 15°
Ie
25
75
300
mW/sr
VCC1 = 3.6 V, D = 0°, 15°
SD = High)
Ie
0.04
mW/sr
r24
D
half intensity
Optical rise time,
Optical fall time
°
Op
880
900
nm
tropt,
tfopt
10
40
ns
1.152 Mbit/s
topt
200
217
230
ns
Input pulse width 125 ns, 4 Mbit/s
topt
116
125
134
ns
topt
241
250
259
ns
topt
topt
85
μs
μs
25
%
Optical overshoot
Rev. 1.2, 03-Jul-06
t
20
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263
TFBS6711
TFBS6711 needs no additional external components.
(see figure 3).
V CC2
V CC1
GND
IRED Anode
R1
R2
C1
V CC
C3
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
19299
used.
ISBN: 0521370957.
Table 1. Recommended Application Circuit Components
Component
Recommended Value
C1
4.7 μF, 16 V
Vishay part#:
293D 475X9 016B
C2
0.1 μF, Ceramic
Vishay part#:
VJ1206 Y 104 J XXMT
R1
3.3 V supply voltage: no resistor is necessary,
the internal controller is able to control the
current
R2
4.7 :, 0.125 W
inputs (RXD, SD) and the output RXD should be
A Tantalum capacitor should be used for C1 while a
ceramic capacitor is used for C2.
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264
I/O and Software
Rev. 1.2, 03-Jul-06
TFBS6711
Mode Switching
The TFBS6711 is in the SIR mode after power on as
a default mode, therefore the FIR data transfer rate
has to be set by a programming sequence using the
TXD and SD inputs as described below. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the
high frequency mode. Lower frequency data can also
be received in the high frequency mode but with
reduced sensitivity. To switch the transceivers from
low frequency mode to the high frequency mode and
vice versa, the programming sequences described
below are required.
Setting to the Lower Bandwidth Mode
(2.4 kbit/s to 115.2 kbit/s)
4. TXD must be held for th t 200 ns.
TXD is now enabled as normal TXD input for the
lower bandwidth mode.
50 %
SD
Setting to the High Bandwidth Mode
(0.576 Mbit/s to 4 Mbit/s)
“LOW”. The hold time of TXD is limited by the maximum allowed pulse length.
TXD is now enabled as normal TXD input for the high
bandwidth mode.
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Truth table
Inputs
Outputs
SD
TXD
Input irradiance mW/m2
RXD
Transmitter
high
x
x
weakly pulled
(500 k:)
high
0
Ie
low
high
x
high
low
high > 80μs
x
high
0
low
low
<4
high
0
low
low
in angular range
in angular range
low (active)
0
low
low
in angular range
x
0
Rev. 1.2, 03-Jul-06
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265
TFBS6711
Manual Soldering
desoldering.
260
10 s max. at 230 °C
240 °C max.
240
220
2...4 °C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 °C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Instruction.
Storage
280
T ≥ 255 °C for 20 s max
260
240
T ≥ 217 °C for 50 s max
220
200
180
Temperature/°C
Temperature/°C
160 °C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 °C...4 °C/s
80
60
2 °C...4 °C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
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266
Rev. 1.2, 03-Jul-06
TFBS6711
TFBS4711, TFBS5711, TFBS6711, and TFBS6712 Package
19612
Figure 7. Package drawing, tolerances: Height + 0.1, - 0.2 mm, otherwise ± 0.2 mm if not indicated
19301
19728
Soldering footprint: Side view
Soldering footprint: Top view
Figure 8. Soldering footprints
Design Rules for Optical Windows
For optical windows see the application note on the web http://www.vishay.com/docs/82506/82506.pdf.
Rev. 1.2, 03-Jul-06
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267
TFBS6711
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
W3 max.
mm
16
330
50
16.4
22.4
15.9
19.4
Figure 9. Reel dimensions [mm]
19303
Drawing-No.: 9.700-5294.01-4
Issue: prel. copy; 24.11.04
Figure 10. Tape dimensions [mm] TFBS6711-TT3
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268
Rev. 1.2, 03-Jul-06
TFBS6711
19304
Drawing-No.: 9.700-5295.01-4
Figure 11. Tape dimensions [mm] TFBS6711-TR3
Rev. 1.2, 03-Jul-06
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269
TFBS6712
Low Profile Fast Infrared Transceiver (FIR, 4 Mbit/s)
for IrDA® Applications with Low voltage Logic (1.8 V)
Description
The TFBS6712 is the smallest FIR transceiver available. It is a low profile and low-power IrDA transceiver. Compliant to IrDA’s Physical Layer specification, the TFBS6712 supports data transmission
rates from 9.6 kbit/s to 4 Mbit/s with a typical link distance of 50 cm. It also enables mobile phones and
PDAs to function as universal remote controls for televisions, DVDs and other home appliances. The
TFBS6712 emitter covers a range of 6.5 meters with
common remote control receivers. Integrated within
the transceiver module is a PIN photodiode, an infrared emitter, and a low-power control IC. The
TFBS6712 can be completely shutdown, achieving
very low power consumption. This type is adapted to
20208
work with a low logic I/O voltage of 1.8 V. For operation with VCC as logic voltage base TFBS6711 is available with otherwise same performance.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Lowest profile: 1.9 mm
Smallest footprint: 6.0 mm x 3.05 mm
Surface mount package
e4
IrDA transmit distance: 50 cm typical
Best Remote Control distance: t6.5 m on-axis
Fast data rates: from 9.6 kbit/s to 4 Mbit/s
Low shutdown current: 0.01 μA
Operating Voltage: 2.4 V to 3.6 V
Reduced pin count: 6 pins
I/O voltage equal to the supply voltage
Pin compatibility: TFBS4711 and TFBS5711
Integrated EMI Protection no external shield
required
•
•
•
•
IEC 60825-1 Class 1, Eye Safe
Qualified for Lead-free and Sn/Pb processing
Compliant to IrDA Physical Layer Specification
Split power supply, transmitter and receiver can be
requirements saving costs, US patent
No. 6,157,476
(MSL4)
WEEE 2002/96/EC
Applications
• High-speed data transfer using infrared
wireless communication
• Mobile phones
• Camera phones
•
•
•
•
PDAs
MP3 Players
Digital Cameras
IrDA Adapters or Dongles
Package Options
Part Number
Qty / Reel or Tube
Description and Remarks
TFBS6712-TR1
1000 pcs
TFBS6712-TR3
2500 pcs
Note: A version oriented in the carrier tape for top view mounting is available on request
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270
Rev. 1.1, 25-Sep-06
TFBS6712
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
SD
Logic
&
Controlled
Driver
Control
TXD
GND
19298
Figure 1. Functional Block Diagramm
Pin Description
Pin Number
Function
Description
1
VCC2, IRED
Anode
IRED anode to be externally connected to VCC2. For higher voltages as 3.6
V an external resistor might be necessary for reducing the internal power
dissipation. See derating curves. This pin is allowed to be supplied from an
uncontrolled power supply separated from the controlled V CC1 - supply
I/O
Active
2
TXD
Transmitter Data Input, adapted to 1.8-V logic
I
HIGH
3
RXD
standard CMOS load. No external pull-up or pull-down resistor is required.
Adapted to low i/O voltage 1.8-V logic. Floating with a weak pull-up of 500 k:
(typ.) in shutdown mode
O
LOW
4
SD
Shutdown, also used for dynamic mode switching
I
HIGH
5
VCC1
Supply voltage
6
GND
Ground
TFBS6712
Weight: 50 mg
PIN 1
19428
Figure 2. Pinning
Rev. 1.1, 25-Sep-06
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271
TFBS6712
Symbol
Min
Max
Unit
transceiver
Parameter
0 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.5
Typ.
6
V
transmitter
0 V < VCC1 < 6 V
VCC2
- 0.5
6.5
V
Input currents
pin
10
mA
Power dissipation
PD
25
mA
500
mW
125
°C
(operating)
Tamb
- 25
+ 85
°C
Tstg
- 25
+ 85
°C
TJ
IIRED (DC)
< 90 Ps, ton < 20 %
IRED anode voltage
Virtual source size
energy
IIRED (RP)
260
°C
125
mA
600
mA
VIREDA
- 0.5
6.5
V
Vin
- 0.5
5.5
d
1.5
V
mm
Maximum intensity for Class 1 operation of
IEC60825-1 or EN60825-1, edition Jan. 2001
internal
limitation
to class 1
500
mW/sr
Due to the internal limitation measures the device is a “class 1” device. It will not exceed the IrDA®
intensity limit of 500 mW/sr
Definitions:
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
IrDA, the Infrared Data Association, implemented MIR and FIR with IrPHY 1.1, followed by IrPhY 1.2, adding the SIR Low Power Standard. IrPhY 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhY 1.4. A new version of the standard in any
case obsoletes the former version.
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Rev. 1.1, 25-Sep-06
TFBS6712
Parameter
Test Conditions
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
V
Transceiver
Receive mode only.
In transmit mode, add additional 85 mA (typ) for IRED current. Add RXD output current depending on
RXD load.
SD = Low, SIR mode
ICC
1.7
3
mA
SD = Low, MIR/FIR mode
ICC
1.9
3.3
mA
SD = High
shutdown mode
ISD
1
μA
SD = High
sensitive
ISD
5
μA
+ 85
°C
Output voltage “Low”
IOL = 1 mA
CLOAD = 15 pF
VOL
0.4
V
Output voltage “High”
IOH = - 250 μA
CLOAD = 15 pF
VOH
2
V
600
k:
0.5
V
TA
- 25
1.6
1.8
500
RRXD
400
Input voltage “Low” (TXD, SD)
VIL
- 0.5
Input voltage “High” (TXD, SD)
VIH
1.5
1.8
2.1
V
Input leakage current (TXD, SD)*) Vin > 1.6 V
Input capacitance
(TXD, SD)
IICH
-1
0.05
+1
μA
5
pF
Internal RXD pull-up
CI
*) The typical threshold level is 0.5 x V
CC (at VCC = 3V). It is recommended to use the specified min/max values to avoid increased operating/shutdown currents.
Rev. 1.1, 25-Sep-06
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273
TFBS6712
Parameter
Test Conditions
Symbol
angular range**)
O = 850 nm to 900 nm, Vcc = 2.4 V
Ee
angular range
MIR mode
1.152 Mbit/s
O = 850 nm to 900 nm, Vcc = 2.4 V
Ee
angular range
FIR mode
4 Mbit/s
O = 850 nm to 900 nm, Vcc = 2.4 V
Ee
angular range***)
O = 850 nm to 900 nm
Ee
Min
Typ.
Max
Unit
Receiver
No detection receiver Input
Irradiance (fluorescent light
noise suppression)
Ee
50
80
mW/m2
(5)
(8)
(μW/cm2)
100
mW/m2
(10)
(μW/cm2)
120
200
mW/m2
(12)
(20)
(μW/cm2)
5
kW/m2
(500)
(mW/cm2)
4
mW/m2
(0.4)
(μW/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
10
50
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
10
50
ns
signal, 50%, SIR mode
Input pulse length
tPW
1.4
1.8
2.6
μs
signal, 50%, MIR mode
Input pulse length
tPW
110
250
270
ns
Input pulse length
tPW
110
140
ns
Input pulse length
tPW
225
275
ns
RXD output jitter, leading edge
4 Mbit/s
1.152 Mbit/s
d115.2 kbit/s
Power on delay
20
40
350
ns
ns
ns
500
μs
100
μs
Latency
tL
**) IrDA sensitivity definition: Minimum Irradiance E In Angular Range, power per unit area. The receiver must meet the BER specie
fication while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link
Length
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical power delivered to the detector by a source operating
at the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link
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Rev. 1.1, 25-Sep-06
TFBS6712
Parameter
Test Conditions
Symbol
Min
Typ.
Max
Unit
440
600
mA
Transmitter
IRED operating current, switched
current control
See derating curve. For 3.3-V
operation no external resistor is
needed.
ID
330
VCC = VIRED = 3.3 V, TXD = Low
IIRED
-1
1
μA
see figure 3, recommended
application circuit
VCC = VIRED = 3.3 V, D = 0°
Ie
45
115
300
mW/sr
see figure 3, recommended
application circuit
VCC = VIRED = 3.3 V, D = 0°, 15°
Ie
25
75
300
mW/sr
VCC = 3.6 V, D = 0°, 15°
SD = High)
Ie
0.04
mW/sr
r24
D
half intensity
Optical rise time,
Optical fall time
°
Op
880
900
nm
tropt,
tfopt
10
40
ns
Input pulse width 217 ns, 1.152
Mbit/s
topt
200
217
230
ns
topt
116
125
134
ns
topt
241
250
259
ns
topt
topt
85
μs
μs
25
%
Optical overshoot
Rev. 1.1, 25-Sep-06
t
20
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275
TFBS6712
TFBS6712 needs no additional external components.
(see figure 3).
VCC2
VCC1
GND
R1
R2
C1
IRED Anode
VCC
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
19430
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276
A Tantalum capacitor should be used for C1 while a
ceramic capacitor is used for C2.
used.
4.7 μF (type, see tavle under C1) at VCC2 will be helpful.
ISBN: 0521370957.
Table 1. Recommended Application Circuit Components
Component
Recommended Value
C1
4.7 μF, 16 V
Vishay part#:
293D 475X9 016B
C2
0.1 μF, Ceramic
Vishay part#:
VJ1 206 Y 104 J XXMT
R1
3.3 V supply voltage: no resistor necessary, the
internal controller is able to control the current
R2
4.7 :, 0.125 W
I/O and Software
Rev. 1.1, 25-Sep-06
TFBS6712
Mode Switching
below are required.
TXD is now enabled as normal TXDinput for the lower
bandwidth mode.
50 %
SD
“LOW”. The hold time of TXD is limited by the maximum allowed pulse length.
bandwidth mode.
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Truth table
Inputs
Outputs
SD
TXD
Optical input Irradiance [mW/m2]
RXD
Transmitter
high
x
x
weakly pulled
(500 k:)
high
0
Ie
low
high
x
high
low
high > 80μs
x
high
0
low
low
<4
high
0
low
low
in angular range
in angular range
low (active)
0
low
low
in angular range
x
0
Rev. 1.1, 25-Sep-06
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277
TFBS6712
Manual Soldering
desoldering.
260
10 s max. at 230 °C
240 °C max.
240
220
2...4 °C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 °C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Storage
280
T ≥ 255 °C for 20 s max
260
240
T ≥ 217 °C for 50 s max
220
200
180
Temperature/°C
Temperature/°C
160 °C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 °C...4 °C/s
80
60
2 °C...4 °C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
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Rev. 1.1, 25-Sep-06
TFBS6712
TFBS4711, TFBS5711, TFBS6711, and TFBS6712 Package
19612
Figure 7. Package drawing, tolerances: Height + 0.1, - 0.2 mm, otherwise ± 0.2 mm if not indicated
19301
19728
Soldering footprint: Side view
Soldering footprint: Top view
Figure 8. Soldering footprints
Design Rules for Optical Windows
For optical windows see the application note on the web http://www.vishay.com/docs/82506/82506.pdf.
Rev. 1.1, 25-Sep-06
www.vishay.com
279
TFBS6712
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
W3 max.
mm
16
330
50
16.4
22.4
15.9
19.4
19303
Drawing-No.: 9.700-5294.01-4
Figure 10. Tape dimensions [mm] TFBS6712-TT3
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280
Rev. 1.1, 25-Sep-06
TFBS6712
19304
Drawing-No.: 9.700-5295.01-4
Figure 11. Tape dimensions [mm] TFBS6712-TR3
Rev. 1.1, 25-Sep-06
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281
TFDU6102
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.7 V to 5.5 V Operation
Description
The TFDU6102 is a low-power infrared transceiver
standard for fast infrared data communication, supporting IrDA® speeds up to 4.0 Mbit/s (FIR), and carrier based remote control modes up to 2 MHz.
Integrated within the transceiver module are a PIN
photodiode, an infrared emitter (IRED), and a lowpower CMOS control IC to provide a total front-end
solution in a single package.
Vishay FIR transceivers are available in different
package options, including this BabyFace package
(TFDU6102). This wide selection provides flexibility
for a variety of applications and space constraints.
with a wide variety of I/O devices which perform the
20110
modulation/demodulation function, including National
Semiconductor’s PC87338, PC87108 and PC87109,
SMC’s FDC37C669, FDC37N769 and CAM35C44,
and Hitachi’s SH3. TFDU6102 has a tri-state output
and is floating in shut-down mode with a weak pull-up.
Features
• Supply voltage 2.7 V to 5.5 V, operating
idle current (receive mode) < 3 mA,
shutdown current < 5 μA over full
temperature range
e3
• Surface mount package, top and side
view, 9.7 mm x 4.7 mm x 4.0 mm
• Operating temperature - 25 °C to 85 °C
• Storage temperature - 40 °C to 100 °C
• Transmitter wavelength typ. 886 nm, supporting
IrDA and Remote Control
• IrDA compliant, link distance > 1 m, ± 15°, window
losses are allowed to still be inside the IrDA spec.
• Remote Control range > 8 m, typ. 22 m
• ESD > 4000 V (HBM)
• Latchup > 200 mA
• EMI immunity > 550 V/m for GSM frequency and
other mobile telephone bands/
(700 MHz to 2000 MHz, no external shield)
• Split power supply, LED can be driven by a
separate power supply not loading the regulated
supply. U.S. Pat. No. 6,157,476
with a weak pull-up
• Eye safety class 1 (IEC60825-1, ed. 2001), limited
LED on-time, LED current is controlled, no single
fault to be considered
(MSL4)
WEEE 2002/96EC
Applications
screen projectors
• Internet TV Boxes, video conferencing systems
• Medical an industrial data collection
Parts Table
Part
Description
Qty / Reel
TFDU6102-TR3
1000 pcs
TFDU6102-TT3
1000 pcs
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282
Rev. 1.7, 21-Aug-06
TFDU6102
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
Logic
&
SD
Controlled
Driver
Control
TXD
IRED C
GND
18468
Pinout
Definitions:
TFDU6102
weight 200 mg
"U" Option BabyFace
(Universal)
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
IRED
Detector
version.
1
2 3 4 5 6
7 8
Note: We apologize to use sometimes in our documentation the
abbreviation LED and the word Light Emitting Diode instead of
17087
Infrared Emitting Diode (IRED) for IR-emitters. That is by definition
wrong; we are here following just a bad trend.
Typical values are for design aid only, not guaranteed nor subject
to production testing and may vary with time.
Rev. 1.7, 21-Aug-06
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283
TFDU6102
Pin Description
Pin Number
Function
Description
1
VCC2
IRED Anode
Connect IRED anode directly to V CC2. For voltages higher than 3.6 V an
external resistor might be necessary for reducing the internal power
dissipation.
An unregulated separate power supply can be used at this pin.
I/O
Active
2
IRED
Cathode
3
TXD
This input is used to transmit serial data when SD is low. An on-chip
protection circuit disables the LED driver if the TXD pin is asserted for
longer than 80 μs. When used in conjunction with the SD pin, this pin is
also used to receiver speed mode.
I
HIGH
4
RXD
standard CMOS or TTL load. No external pull-up or pull-down resistor is
required. Floating with a weak pull-up of 500 k: (typ.) in shutdown
mode.
O
LOW
5
SD
Shutdown, also used for dynamic mode switching. Setting this pin active
places the module into shutdown mode. On the falling edge of this signal,
the state of the TXD pin is sampled and used to set receiver low bandwidth
(TXD = Low, SIR) or high bandwidth
(TXD = High, MIR and FIR) mode. Will be overwritten by the mode pin input,
which must float, when dynamic programming is used.
I
HIGH
6
VCC1
Supply Voltage
7
Mode
HIGH: High speed mode, MIR and FIR; LOW: Low speed mode, SIR only
(see chapter "Mode Switching"). Must float, when dynamic programming is
used.
I
Mode
The mode pin can also be used to indicate the dynamically programmed
mode. The maximum load is limited to 50 pF. High indicates FIR/MIR-, low
indicates SIR-mode
O
GND
Ground
8
Reference point Ground Pin 8, unless otherwise noted.
Symbol
Min
Max
Unit
transceiver
Parameter
0 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.5
+6
V
transmitter
0 V < VCC1 < 6 V
VCC2
- 0.5
+ 6.5
V
Input currents
pin
10
mA
Power dissipation
TJ
(operating)
< 90 μs, ton < 20 %
IRED anode voltage
mode indicator
www.vishay.com
284
25
mA
500
mW
125
°C
Tamb
- 25
+ 85
°C
Tstg
- 25
+ 85
°C
260
°C
IIRED (DC)
125
mA
IIRED (RP)
600
mA
profile (see figure 4)
PD
Typ.
VIREDA
VIN
- 0.5
+ 6.5
V
5.5
V
50
pF
Rev. 1.7, 21-Aug-06
TFDU6102
Symbol
Min
Typ.
Virtual source size
Parameter
energy
d
2.5
2.8
IEC60825-1 or
EN60825-1,
edition Jan. 2001
Ie
*)
Test Conditions
Max
Unit
mm
*)
(500)**)
mW/sr
Max
Unit
Due to the internal limitation measures the device is a "class1" device
**)
Transceiver
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC
2.7
Typ.
5.5
V
3
mA
Supply current (Idle)*)
ICC
2
SD = Low, Ee = 1 klx **)
ICC
2
3
mA
SD = High, Mode = Floating
Ee = 0 klx
ISD
2.0
μA
SD = High, Mode = Floating
ISD
2.5
μA
SD = High, T = 85 °C,
Mode = Floating, not ambient
light sensitive
ISD
5
μA
+ 85
°C
Output voltage low
IOL = 1 mA, Cload = 15 pF
VOL
0.4
V
Output voltage high
VOH
0.8 x VCC
VOH
0.9 x VCC
Ee = 1 klx **)
TA
- 25
V
V
Output RXD current limitation
high state
Short to Ground
20
mA
low state
Short to VCC1
20
mA
SD = High
RRXD
400
600
k:
VIL
- 0.5
0.5
V
VIH
VCC - 0.5
VCC + 0.5
V
(TXD, SD)
IL
- 10
+ 10
μA
Mode
IICH
-2
+2
μA
Input capacitance
(TXD, SD, Mode)
CIN
5
pF
Input voltage low
(TXD, SD, Mode)
Input voltage high
(TXD, SD, Mode)
CMOS level ***)
500
*)
Receive mode only.
In transmit mode, add additional 85 mA (typ) for IRED current. Add RXD output current depending on RXD load.
**)
Standard Illuminant A.
***)
The typical threshold level is 0.5 x VCC2. It is recommended to use the specified min/max values to avoid increased operating current.
Rev. 1.7, 21-Aug-06
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285
TFDU6102
Receiver
Typ.
Max
Unit
angular range **) SIR mode
Parameter
O = 850 nm to 900 nm
Test Conditions
Symbol
Ee
Min
25
(2.5)
35
(3.5)
mW/m2
angular range, MIR mode
1.152 Mbit/s
O = 850 nm to 900 nm
Ee
65
(6.5)
Minimum irradiance Ee
inangular range, FIR mode
4.0 Mbit/s
O = 850 nm to 900 nm
Ee
angular range ***)
O = 850 nm to 900 nm
Ee
irradiance
*)
80
(8.0)
(μW/cm2)
mW/m2
(μW/cm2)
90
(9.0)
5
(500)
mW/m2
(μW/cm2)
kW/m2
(mW/cm2)
Ee
4
(0.4)
10 % to 90 %, 15 pF
tr (RXD)
10
40
90 % to 10 %, 15 pF
tf (RXD)
10
40
signal, 50 %, SIR mode
Input pulse length
1.4 μs < PWopt < 25 Ps
tPW
Input pulse length
1.4 μs < PWopt < 25 μs,
tPW
1.5
1.8
2.6
μs
250
270
ns
mW/m2
(μW/cm2)
2.1
ns
ns
μs
- 25 °C < T < 85 °C ****)
signal, 50 %, MIR mode
Input pulse length
PWopt = 217 ns,
1.152 Mbit/s
tPW
110
signal, 50 %, FIR mode
Input pulse length
PWopt = 125 ns,
4.0 Mbit/s
tPW
100
140
ns
Input pulse length
PWopt = 250 ns,
4.0 Mbit/s
tPW
225
275
ns
4.0 Mbit/s
20
ns
1.152 Mbit/s
40
ns
576 kbit/s
80
ns
d 115.2 kbit/s
350
ns
Power on delay
500
μs
300
μs
Latency
tL
170
Note: All timing data measured with 4 Mbit/s are measured using the IrDA® FIR transmission header.
The data given here are valid 5 μs after starting the preamble.
*)
lamps
**)
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors. If
placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER). For more definitions
see the document “Symbols and Terminology” on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
****)
Retriggering once during applied optical pulse may occur.
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Rev. 1.7, 21-Aug-06
TFDU6102
Transmitter
Parameter
Test Conditions
See derating curve (fig. 5). For
3.3 V operations no external
resistor needed. For 5 V
application that might be
necessary depending on
operating temperature range.
Symbol
Min
Typ.
Max
Unit
ID
500
550
600
mA
1
μA
170
350
mW/sr
0.04
mW/sr
IIRED
-1
circuit
D = 0°, 15°
TXD = High, SD = Low,
VCC1 = VCC2 = 3.3 V
Internally current-controlled, no
external resistor
Ie
120
VCC1 = 5.0 V, D = 0°, 15°
TXD = Low or SD = High,
SD = High)
Ie
D
half intensity
Op
Spectral bandwidth
'O
± 24
880
°
900
40
nm
nm
tropt, tfopt
10
40
ns
1.152 Mbit/s
topt
207
217
227
ns
4.0 Mbit/s
topt
117
125
133
ns
4.0 Mbit/s
topt
242
250
258
ns
Input pulse width
topt
tTXD
μs
0.1 Ps < tTXD < 100 μs *)
Input pulse width tTXD t 100 μs *)
Optical overshoot
topt
23
100
μs
25
%
*)
Typically the output pulse duration will follow the input pulse duration t and will be identical in length t.
However, at pulse duration larger than 100 μs the optical output pulse duration is limited to 100 μs. This pulse duration limitation can already start at 23 μs.
Rev. 1.7, 21-Aug-06
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287
TFDU6102
Vishay Semiconductors transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout.
The use of thin, long, resistive and inductive wiring
should be avoided. The inputs (TXD, SD, Mode) and
the output RXD should be directly (DC) coupled to the
I/O circuit.
VCC2
R1
VCC1
R2
C1
C3
IRED Anode
VCC
C2
GND
Ground
Mode
Mode
SD
SD
TXD
TXD
RXD
RXD
IRED Cathode
18469
reduces the influence of the inductance of the power
supply line. This one should be a Tantalum or other
higher operating voltages and elevated temperatures,
see derating curve in figure 5, to avoid too high internal power dissipation.
The capacitors C2 and C3 combined with the resistor
R2 (as the low pass filter) is smoothing the supply
voltage VCC1. R2, C1, C2, and C3 are optional and
dependent on the quality of the supply voltages VCC1
and VCC2 and injected noise. An unstable power supply with dropping voltage during transmission may
reduce sensitivity (and transmission range) of the
transceiver. The placement of these parts is critical. It
is strongly recommended to position C2 and C3 as
pins. A Tantalum capacitor should be used for C1 and
C3 while a ceramic capacitor is used for C2.
used.
ISBN: 0 521 37095 7.
Table 1.
Component
Recommended Value
C1, C3
4.7 μF, 16 V
293D 475X9 016B
C2
0.1 μF, Ceramic
R1
5 V supply voltage: 2 : , 0.25 W ( recommended using
two 1 :, 0.125 W resistor in series)
3.3 V supply voltage: no resistors necessary, the internal
controller is able to control the current
e.g. 2 x CRCW-1206-1R0-F-RT1
R2
10 :, 0.125 W
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288
Vishay Part Number
Rev. 1.7, 21-Aug-06
TFDU6102
I/O and Software
Mode Switching
The TFDU6102 is in the SIR mode after power on as
TXD and SD inputs as described below or selected by
setting the Mode Pin. The Mode Pin can be used to
statically set the mode (Mode Pin: LOW: SIR, HIGH:
0.576 Mbit/s to 4.0 Mbit/s). If not used or in standby
mode, the mode input should float or should not be
loaded with more than 50 pF. The low frequency
mode covers speeds up to 115.2 kbit/s. Signals with
higher data rates should be detected in the high frequency mode. Lower frequency data can also be
received in the high frequency mode but with reduced
sensitivity.
To switch the transceivers from low frequency mode
to the high frequency mode and vice versa, the programming sequences described below are required.
After that TXD is enabled as normal TXD input and the
transceiver is set for the high bandwidth (576 kbit/s to
4 Mbit/s) mode.
transceiver is set for the lower bandwidth (9.6 kbit/s to
115.2 kbit/s) mode.
50 %
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
(0.576 Mbit/s to 4.0 Mbit/s)
14873
Table 2.
Truth table
Inputs
Outputs
SD
TXD
RXD
Transmitter
high
x
x
weakly pulled
(500 k:) to VCC1
0
low
high
x
low (active)
Ie
high > 80 μs
x
high
0
low
<4
high
0
low
> Min. irradianceEe
low (active)
0
low
x
0
Rev. 1.7, 21-Aug-06
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289
TFDU6102
Recommended Solder Profiles for TFDU6102
Storage
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 °C
240 °C max.
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
2...4 °C/s
275
T ≥ 255 °C for 10 s....30 s
250
225
0
50
19535
100
150
200
250
300
350
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
Time/s
Temperature/°C
Temperature (°C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
Tpeak = 260 °C max
260
240
220
200
180
Temperature/°C
2 °C...3 °C/s
50
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
Manual Soldering
desoldering.
www.vishay.com
290
Rev. 1.7, 21-Aug-06
TFDU6102
90
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Package Dimensions
Figure 7. Package drawing TFDU6102, dimensions in mm, tolerance ± 0.2 mm if not otherwise mentioned
Rev. 1.7, 21-Aug-06
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291
TFDU6102
Solder Footprint
20111
Figure 8. Solder footprint for top and side view mounting TFDU6102, dimensions in mm, tolerance ± 0.2 mm if not otherwise mentioned
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
W3 max.
mm
24
330
60
24.4
30.4
23.9
27.4
www.vishay.com
292
Rev. 1.7, 21-Aug-06
TFDU6102
Tape Dimensions
19824
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Rev. 1.7, 21-Aug-06
www.vishay.com
293
TFDU6102
19875
Drawing-No.: 9.700-5297.01-4
Issue: 1; 04.08.05
www.vishay.com
294
Rev. 1.7, 21-Aug-06
TFDU6103
Description
The TFDU6103 is a low-power infrared transceiver
standard for fast infrared data communication, supporting IrDA speeds up to 4.0 Mbit/s (FIR), and carrier
based remote control modes up to 2 MHz. Integrated
within the transceiver module are a PIN photodiode,
an infrared emitter (IRED), and a low-power CMOS
control IC to provide a total front-end solution in a single package.
Vishay FIR transceivers are available in different
package options, including this BabyFace package
(TFDU6103). This wide selection provides flexibility
for a variety of applications and space constraints.
with a wide variety of I/O devices which perform the
20110
modulation/
demodulation
function,
including
National Semiconductor’s PC87338, PC87108 and
PC87109, SMC’s FDC37C669, FDC37N769 and
CAM35C44, and Hitachi’s SH3. TFDU6103 has a tristate output and is floating in shut-down mode with a
weak pull-up.
Features
• Supply voltage 2.4 V to 5.5 V, operating
idle current (receive mode) < 3.3 mA,
shutdown current < 1 μA over full
temperature range
e3
• Surface mount package, top and side
view, 9.7 mm x 4.7 mm x 4.0 mm
• Operating temperature - 25 °C to 85 °C
• Transmitter wavelength typ. 886 nm, supporting
IrDA® and Remote Control
• IrDA® compliant, link distance > 1 m, ± 15°, window losses are allowed to still be inside the IrDA®
spec.
• Remote Control range > 8 m, typ. 22 m
• ESD > 1 kV
• Latchup > 100 mA
• EMI immunity > 550 V/m for GSM frequency and
other mobile telephone bands/
(700 MHz to 2000 MHz, no external shield)
• Split power supply, LED can be driven by a separate power supply not loading the regulated supply. U.S. Pat. No. 6,157,476
with a weak pull-up
(MSL4)
WEEE 2002/96EC
Applications
screen projectors
• Internet TV Boxes, video conferencing systems
• Medical an industrial data collection
Parts Table
Part
Description
Qty / Reel
TFDU6103-TR3
1000 pcs
TFDU6103-TT3
1000 pcs
Rev. 1.0, 31-Jul-06
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295
TFDU6103
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
Logic
&
SD
Controlled
Driver
Control
TXD
IRED C
GND
18468
Pinout
Definitions:
TFDU6103
weight 200 mg
"U" Option BabyFace
(Universal)
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
IRED
Detector
version.
1
17087
2 3 4 5 6
7 8
Note: We apologize to use sometimes in our documentation the
abbreviation LED and the word Light Emitting Diode instead of
Infrared Emitting Diode (IRED) for IR-emitters. That is by definition
wrong; we are here following just a bad trend.
Typical values are for design aid only, not guaranteed nor subject
to production testing and may vary with time.
www.vishay.com
296
Rev. 1.0, 31-Jul-06
TFDU6103
Pin Description
Pin Number
Function
Description
1
VCC2
IRED
Anode
Connect IRED anode directly to VCC2. For voltages higher than 3.6 V an external
resistor might be necessary for reducing the internal power dissipation.
An unregulated separate power supply can be used at this pin.
I/O
Active
2
IRED
Cathode
3
TXD
This input is used to transmit serial data when SD is low. An on-chip protection circuit
disables the LED driver if the TXD pin is asserted for longer than 100 μs. When used
in conjunction with the SD pin, this pin is also used to receiver speed mode.
I
HIGH
4
RXD
Received Data Output, push-pull CMOS driver output capable of driving a standard
CMOS or TTL load. No external pull-up or pull-down resistor is required. Floating with
a weak pull-up of 500 k: (typ.) in shutdown mode.
O
LOW
5
SD
Shutdown, also used for dynamic mode switching. Setting this pin active places the
module into shutdown mode. On the falling edge of this signal, the state of the TXD pin
is sampled and used to set receiver low bandwidth (TXD = Low, SIR) or high bandwidth
(TXD = High, MIR and FIR) mode. Will be overwritten by the mode pin input, which must
float, when dynamic programming is used.
I
HIGH
6
VCC1
Supply Voltage
7
NC
8
GND
Ground
Reference point Ground Pin 8, unless otherwise noted.
Symbol
Min
Max
Unit
transceiver
Parameter
0 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.5
Typ.
+6
V
transmitter
0 V < VCC1 < 6 V
VCC2
- 0.5
+ 6.5
V
Input currents
pin
10
mA
Power dissipation
TJ
(operating)
< 90 μs, ton < 20 %
IRED anode voltage
mA
mW
125
°C
- 25
+ 85
°C
Tstg
- 25
+ 85
°C
260
°C
IIRED (DC)
125
mA
IIRED (RP)
600
mA
+ 6.5
V
VIREDA
mode indicator
25
500
Tamb
PD
- 0.5
VIN
5.5
V
50
pF
Max
Unit
Symbol
Min
Typ.
Virtual source size
Parameter
energy
Test Conditions
d
2.5
2.8
IEC60825-1 or
Ie
mm
*)
(500)**)
mW/sr
*) Due
**)
to the internal limitation measures the device is a "class1" device
Rev. 1.0, 31-Jul-06
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297
TFDU6103
Transceiver
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC
2.4
Typ.
Max
Unit
5.5
V
Receive mode only, idle
SIR mode
ICC
1.8
3.0
mA
MIR/FIR mode
ICC
2.0
3.3
mA
SD = High
shutdown mode
ISD
0.01
SD = High, full specified
temperature range, not ambient
light sensitive
ISD
μA
1
μA
TA
- 25
+ 85
°C
Input voltage low
(TXD, SD)
VIL
- 0.5
0.5
V
Input voltage high
(TXD, SD)
CMOS level *)
VIH
VCC - 0.3
6
V
(TXD, SD)
Vin = 0.9 x VCC1
IICH
-1
+1
μA
CI
5
pF
Output voltage low
IOL = 500 μA, Cload = 15 pF
VOL
0.4
V
Output voltage high
VOH
high state
low state
Short to Ground
Short to VCC1
SD shutdown pulse duration
Activating shutdown
Input capacitance, TXD, SD
duration
All modes
0.9 x VCC1
V
20
20
30
RRXD
400
tSDPW
200
500
mA
mA
v
μs
600
k:
ns
*)
The typical threshold level is 0.5 x VCC1 (VCC1 = 3 V) . It is recommended to use the specified min/ max values to avoid increased operating current
www.vishay.com
298
Rev. 1.0, 31-Jul-06
TFDU6103
Receiver
Typ.
Max
Unit
angular range **) SIR mode
Parameter
O = 850 nm to 900 nm
Test Conditions
Symbol
Ee
Min
25
(2.5)
35
(3.5)
mW/m2
(μW/cm2)
1.152 Mbit/s
O = 850 nm to 900 nm
Ee
65
(6.5)
4.0 Mbit/s
O = 850 nm to 900 nm
Ee
80
(8.0)
angular range ***)
O = 850 nm to 900 nm
Ee
5
(500)
irradiance
*)
Ee
4
(0.4)
mW/m2
(μW/cm2)
90
(9.0)
mW/m2
(μW/cm2)
kW/m2
(mW/cm2)
mW/m2
(μW/cm2)
10 % to 90 %, 15 pF
tr (RXD)
10
40
90 % to 10 %, 15 pF
tf (RXD)
10
40
Input pulse length
tPW
Input pulse length
1.4 Ps < PWopt < 25 μs,
tPW
1.5
1.8
2.6
μs
250
270
ns
2.1
ns
ns
μs
- 25 °C < T < 85 °C ****)
Input pulse length
PWopt = 217 ns,
1.152 Mbit/s
tPW
110
Input pulse length
PWopt = 125 ns,
4.0 Mbit/s
tPW
100
140
ns
Input pulse length
PWopt = 250 ns,
4.0 Mbit/s
tPW
225
275
ns
4.0 Mbit/s
20
ns
1.152 Mbit/s
40
ns
576 kbit/s
80
ns
d 115.2 kbit/s
Power on delay
350
ns
250
μs
100
μs
Latency
tL
40
®
Note: All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header.
The data given here are valid 5 Ps after starting the preamble.
*)
lamps
**)
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors. If
placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER). For more definitions
see the document “Symbols and Terminology” on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
****)
Retriggering once during applied optical pulse may occur
Rev. 1.0, 31-Jul-06
www.vishay.com
299
TFDU6103
Transmitter
Parameter
Test Conditions
Symbol
Min
Typ.
Max
Unit
Note: No external resistor
current limiting resistor is
needed for VCC1 = VCC2 = 3.3 V
ID
330
440
600
mA
IIRED
-1
1
μA
Output radiant intensity, see
figure 3, recommended
application circuit
VCC = VIRED = 3.3 V, D = 0°
TXD = High, SD = Low, R1 = 1 :
Ie
110
170
500*)
mW/sr
Output radiant intensity, see
figure 3, recommended
application circuit
VCC = VIRED = 3.3 V, D = 0°, 15°
TXD = High, SD = Low, R1 = 1 :
Ie
100
130
500*)
mW/sr
VCC1 = 3.3 V, D = 0°, 15°
SD = High)
Ie
0.04
mW/sr
D
half intensity
Op
Spectral bandwidth
'O
Optical rise time,
Optical fall time
Optical overshoot
± 24
875
886
°
900
45
tropt ,
tfopt
10
1.152 Mbit/s
topt
207
4.0 Mbit/s
topt
4.0 Mbit/s
nm
nm
40
ns
217
227
ns
117
125
133
ns
topt
242
250
258
ns
topt
topt
20
100
μs
μs
25
%
t
*)
Maximum value is given by the IrDA-Standard
**) Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for
the standard Remote Control applications with codes as e.g. Philips RC5/RC6® or RECS 80. When operated under IrDA full range conditions (125 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers
are used.
www.vishay.com
300
Rev. 1.0, 31-Jul-06
TFDU6103
Vishay Semiconductors transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout.
The use of thin, long, resistive and inductive wiring
should be avoided. The inputs (TXD, SD, Mode) and
the output RXD should be directly (DC) coupled to the
I/O circuit.
V cc2
R1
V cc1
R2
C1
C3
GND
IRED Anode
V cc
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
IRED Cathode
19789
reduces the influence of the inductance of the power
supply line. This one should be a Tantalum or other
higher operating voltages and elevated temperatures,
see derating curve in figure 5, to avoid too high internal power dissipation.
The capacitors C2 and C3 combined with the resistor
R2 (as the low pass filter) is smoothing the supply
voltage VCC1. R2, C1, C2, and C3 are optional and
dependent on the quality of the supply voltages VCC1
and VCC2 and injected noise. An unstable power supply with dropping voltage during transmission may
reduce sensitivity (and transmission range) of the
transceiver. The placement of these parts is critical. It
is strongly recommended to position C2 and C3 as
pins. An Tantalum capacitor should be used for C1
and C3 while a ceramic capacitor is used for C2.
used.
ISBN: 0521370957.
Table 1.
Component
Recommended Value
C1, C3
4.7 μF, 16 V
293D 475X9 016B
C2
0.1 μF, Ceramic
R1
3.3 V supply voltage: no resistors necessary, the internal
controller is able to control the current
e.g. 2 x CRCW-1206-1R0-F-RT1
R2
10 :, 0.125 W
Rev. 1.0, 31-Jul-06
Vishay Part Number
www.vishay.com
301
TFDU6103
I/O and Software
Mode Switching
reduced sensitivity.
transceiver is set for the high bandwidth (576 kbit/s to
4 Mbit/s) mode.
transceiver is set for the lower bandwidth (9.6 kbit/s to
115.2 kbit/s) mode.
50 %
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Table 2.
Truth table
Inputs
TXD
Optical input Irradiance mW/m 2
RXD
Transmitter
high
x
x
weakly pulled
(500 k:) to VCC1
0
Ie
low
www.vishay.com
302
Outputs
SD
high
x
low (active)
high > 100 μs
x
high
0
low
<4
high
0
low
> Min. irradianceEe
low (active)
0
low
x
0
Rev. 1.0, 31-Jul-06
TFDU6103
260
240
220
200
180
160
140
120
100
80
60
40
20
0
275
10 s max. at 230 °C
240 °C max.
T ≥ 255 °C for 10 s....30 s
250
225
2...4 °C/s
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
160 °C max.
120 s...180 s
Temperature/°C
Temperature (°C)
90 s max.
2...4 °C/s
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
2 °C...3 °C/s
50
25
0
50
100
19535
150
200
250
300
0
350
0
Time/s
50
100
150
200
Time/s
19532
Wave Soldering
Manual Soldering
desoldering.
Storage
Rev. 1.0, 31-Jul-06
300
350
280
Tpeak = 260 °C max
260
240
220
200
Temperature/°C
180
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
90
250
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
www.vishay.com
303
TFDU6103
20111
Figure 7. Package drawing and solder footprints for top and side view mounting TFDU6103, dimensions in mm, tolerance ± 0.2 mm if not
otherwise mentioned
www.vishay.com
304
Rev. 1.0, 31-Jul-06
TFDU6103
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
Rev. 1.0, 31-Jul-06
W3 max.
www.vishay.com
305
TFDU6103
Tape Dimensions
19824
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
www.vishay.com
306
Rev. 1.0, 31-Jul-06
TFDU6103
Tape Dimensions
19875
Drawing-No.: 9.700-5297.01-4
Issue: 1; 04.08.05
Rev. 1.0, 31-Jul-06
www.vishay.com
307
TFDU6300
Description
low-power standard for fast infrared data communication, supporting IrDA speeds up to 4 Mbit/s (FIR),
HP-SIR®, Sharp ASK® and carrier based remote control modes up to 2 MHz. Integrated within the transceiver module is a photo PIN diode, an infrared
emitter (IRED), and a low-power control IC to provide
This new Vishay FIR transceiver is built in a new
smaller package using the experiences of the lead
frame BabyFace technology. The transceivers are
capable of directly interfacing with a wide variety of
I/O devices, which perform the modulation/demodulation function. At a minimum, a Vcc bypass capacitor is
20101
the only external component required implementing a
complete solution. TFDU6300 has a tri-state output
and is floating in shutdown mode with a weak pull-up.
An otherwise identical transceiver with low-voltage
(1.8 V) logic levels is available as TFDU6301.
Features
layer specification (up to 4 Mbit/s) with an
extended low power range of > 70 cm
e3
(typ. 1 m) and TV Remote Control (> 9 m)
specification
• Low power consumption (1.8 mA typ. supply
current)
• Power shutdown mode (0.01 μA typ. shutdown
current)
- Universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)
a weak pull-up
• Directly interfaces with various Super I/O and controller devices
requirements saving costs
(MSL4)
WEEE 2002/96EC
Applications
• Digital cameras and video cameras
• Printers, fax machines, photocopiers, screen
projectors
pagers)
Parts Table
Part
Description
Qty / Reel or Tube
TFDU6300-TR3
2500 pcs
TFDU6300-TT3
2500 pcs
www.vishay.com
308
Rev. 1.2, 21-Jun-06
TFDU6300
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
SD
Logic
&
Controlled
Driver
Control
TXD
GND
18468_1
Figure 1. Functional Block Diagram
Pin Description
Pin Number
1
Function
Description
I/O
Active
VCC2
IRED anode to be externally connected to Vcc2 (VIRED). For higher voltages
IRED Anode than 3.6 V an external resistor might be necessary for reducing the internal
power dissipation. This pin is allowed to be supplied from an uncontrolled
power supply separated from the controlled Vcc1 - supply.
2
IRED
Cathode
3
TXD
protection circuit disables the IRED driver if the TXD pin is asserted for
also used to control the receiver mode. Logic reference: Vcc1
I
HIGH
4
RXD
Received data output, push-pull CMOS driver output capable of driving
standard CMOS. No external pull-up or pull-down resistor is required.
Floating with a weak pull-up of 500 kOhm (typ.) in shutdown mode. High/
Low levels related to Vcc1. RXD echoes the TXD signal.
O
LOW
5
SD
(TXD = Low: SIR) or high bandwidth (TXD = High: MIR and FIR) mode.
I
HIGH
6
VCC1
Supply voltage
7
NC
Internally not connected.
8
GND
Ground
I
TFDU6301
weight 0.075 g
19531
Figure 2. Pinning
Rev. 1.2, 21-Jun-06
www.vishay.com
309
TFDU6300
Symbol
Min
Max
Unit
transceiver
Parameter
0 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.5
6
V
transmitter
0 V < VCC1 < 6 V
VCC2
- 0.5
6.5
V
Vin < VCC1 is allowed
Input currents
For all pins, except IRED anode pin
Typ.
- 0.5
Power dissipation
PD
25
mA
500
mW
125
°C
- 25
+ 85
°C
Tstg
- 25
+ 85
°C
260
°C
IIRED (DC)
150
mA
IIRED (RP)
700
mA
See chapter “Recommended
Solder Profiles”
V
mA
Tamb
TJ
(operating)
6
10
< 90 μs, ton < 20 %
ESD protection
Human body model
Virtual source size
d
IEC60825-1 or EN60825-1,
edition Jan. 2001
Ie
1
1.8
kV
2.0
mm
*)
mW/sr
(500)**)
*) Due to the internal limitation measures and the IrDA defined transmission protocol the device is a "class 1" device when operated inside
the absolute maximum ratings
**) IrDA specifies the maximum intensity with 500 mW/sr
Definitions:
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case obsoletes the former version.
(in Oct. 2002).
www.vishay.com
310
Rev. 1.2, 21-Jun-06
TFDU6300
Transceiver
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
V
SIR mode
ICC
1.8
3.0
mA
MIR/FIR mode
ICC
2.0
3.3
mA
SD = High
T= 25 °C, not ambient light
shutdown mode
ISD
0.01
light sensitive
ISD
μA
1
μA
°C
TA
- 25
+ 85
VIL
- 0.5
0.5
V
VIH
VCC - 0.3
6
V
IICH
-1
CMOS level*)
Output voltage low
IOL = 500 μA
Cload = 15 pF
Output voltage high
IOH = - 250 μA
Cload = 15 pF
high state
low state
Short to Ground
Short to VCC1
Activating shutdown
duration
All modes
+1
μA
CI
5
pF
VOL
0.4
VOH
V
0.9 x VCC1
V
20
20
30
RRXD
400
tSDPW
200
500
mA
mA
f
μs
600
k:
ns
*)
The typical threshold level is 0.5 x VCC1 (VCC1 = 3 V). It is recommended to use the specified min/max values to avoid increased operating
current.
Rev. 1.2, 21-Jun-06
www.vishay.com
311
TFDU6300
Receiver
Parameter
Test Conditions
Typ.
Max
Unit
Ee
50
(5)
80
(8)
mW/m2
(μW/cm2)
1.152 Mbit/s
O = 850 nm to 900 nm,
VCC = 2.4 V
Ee
100
(10)
4 Mbit/s
O = 850 nm to 900 nm,
VCC = 2.4 V
Ee
130
(13)
O = 850 nm to 900 nm
Ee
5
(500)
Minimum irradiance Ee*) in
angular range**)
O = 850 nm to 900 nm,
VCC = 2.4 V
angular range***)
Symbol
Min
mW/m2
(μW/cm2)
200
(20)
mW/m2
(μW/cm2)
kW/m2
(mW/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
10
40
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
10
40
ns
Input pulse length
1.4 μs < PWopt < 25 μs
tPW
1.6
2.2
3
μs
Input pulse length
tPW
105
250
275
ns
Input pulse length
tPW
105
125
145
ns
Input pulse length
tPW
225
250
275
ns
4.0 Mbit/s
1.152 Mbit/s
d 115.2 kbit/s
25
80
350
ns
ns
ns
programmimg sequence
Power on dalay
250
μs
100
μs
Latency
tL
40
*)
IrDA low power specification is 90 mW/m2. Specification takes into account a window loss of 10 %.
**) IrDA sensitivity definition (equivalent to threshold irradiance):
Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length.
***) Maximum Irradiance Ee In Angular Range, power per unit area. The optical power delivered to the detector by a source operating
For more definitions see the document "Symbols and Terminology" on the Vishay Website
www.vishay.com
312
Rev. 1.2, 21-Jun-06
TFDU6300
Transmitter
Parameter
IRED operating current, switched
current limiter
Test Conditions
needed
Symbol
Min
Typ.
Max
Unit
ID
330
440
600
mA
IIRED
-1
1
μA
Output radiant intensity, s. figure 3, VCC = VIRED = 3.3 V, D = 0°
recommended appl. circuit
Ie
65
180
500*)
mW/sr
Output radiant intensity, s. figure 3, VCC = VIRED = 3.3 V, D = 0°, 15°
Ie
50
125
500*)
mW/sr
VCC1 = 3.3 V, D = 0°, 15°
SD = High)
Ie
0.04
mW/sr
r24
D
Output radiant intensity, Angle of
Half Intensity
Op
Spectral bandwidth
'O
Optical rise time,
Optical fall time
875
886
deg
900
45
tropt,
tfopt
10
nm
nm
40
ns
1.152 Mbit/s
topt
207
217
227
ns
4 Mbit/s
topt
117
125
133
ns
4 Mbit/s
topt
242
250
258
ns
input pulse width t t 100 μs
topt
topt
20
100
μs
μs
25
%
Optical overshoot
t
*) Maximum value is given by the IrDA-Standard
**) Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source
for the standard Remote Control applications with codes as e.g. Philips RC5/RC6® or RECS 80. When operated under IrDA full range
conditions (125 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers
are used
Rev. 1.2, 21-Jun-06
www.vishay.com
313
TFDU6300
TFDU6300 needs no additional external components.
(see figure 3).
VCC2
R1
VCC1
R2
C1
GND
IRED Anode
V CC
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
IRED Cathode
19307
The resistor R1 is only necessary for high operating
voltages and elevated temperatures.
is used for C2.
used.
Winfield Hill, 1989, Cambridge University Press,
ISBN: 0521370957.
Table 1.
Component
Recommended Value
C1
4.7 μF, 16 V
293D 475X9 016B
C2
0.1 μF, Ceramic
R1
no resistor necessary, the internal controller is able to
control the current
R2
10 :, 0.125 W
www.vishay.com
314
Vishay Part Number
Rev. 1.2, 21-Jun-06
TFDU6300
I/O and Software
Mode Switching
TXD and SD inputs as described below. The low
frequency mode covers speeds up to 115.2 kbit/s.
Signals with higher data rates should be detected in
the high frequency mode. Lower frequency data can
also be received in the high frequency mode but with
below are required.
bandwidth mode.
50 %
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Table 2.
Truth table
Inputs
Outputs
SD
TXD
RXD
Transmitter
high
x
x
weakly pulled
(500 k:) to VCC1
0
Ie
low
high
x
high
low
high > 100 μs
x
high
0
low
low
<4
high
0
low
low
low (active)
0
low
low
x
0
Rev. 1.2, 21-Jun-06
www.vishay.com
315
TFDU6300
Storage
10 s max. at 230 °C
240 °C max.
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
2...4 °C/s
275
T ≥ 255 °C for 10 s....30 s
250
225
0
50
19535
100
150
200
250
300
350
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
Time/s
Temperature/°C
Temperature (°C)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
Tpeak = 260 °C max
260
240
220
200
180
Temperature/°C
2 °C...3 °C/s
50
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
Manual Soldering
desoldering.
www.vishay.com
316
Rev. 1.2, 21-Jun-06
TFDU6300
Package Dimensions
TFDU6300 (Universal) Package
19533
Figure 8. Package Drawing
Rev. 1.2, 21-Jun-06
www.vishay.com
317
TFDU6300
Tape and Reel Information
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Figure 9. Reel drawing
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
www.vishay.com
318
W3 max.
Rev. 1.2, 21-Jun-06
TFDU6300
Tape Dimensions
19855
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
Rev. 1.2, 21-Jun-06
www.vishay.com
319
TFDU6300
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
www.vishay.com
320
Rev. 1.2, 21-Jun-06
TFDU6301
for 2.4 V to 3.6 V Operation and Low-Voltage Logic (1.8 V)
Description
low-power standard for fast infrared data communication, supporting IrDA speeds up to 4 Mbit/s (FIR),
HP-SIR®, Sharp ASK® and carrier based remote control modes up to 2 MHz. Integrated within the transceiver module is a photo PIN diode, an infrared
emitter (IRED), and a low-power control IC to provide
This new Vishay FIR transceiver is built in a new
smaller package using the experiences of the lead
frame BabyFace technology. The transceivers are
capable of directly interfacing with a wide variety of I/O
devices, which perform the modulation/ demodulation
function. At a minimum, a Vcc bypass capacitor is the
20101
only external component required implementing a
complete solution. TFDU6300 has a tri-state output
and is floating in shutdown mode with a weak pull-up.
An otherwise identical transceiver with supply voltage
related logic levels is available as TFDU6300.
Features
• Compliant to the latest IrDA physical layer
specification (up to 4 Mbit/s) with an
extended low power range of > 70 cm (typ.
1 m) and TV Remote Control (> 9 m)
e3
specification
• Low power consumption (1.8 mA typ. supply current)
• Power shutdown mode (0.01 μA typ. shutdown
current)
- Universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)
a weak pull-up
• Directly interfaces with various Super I/O and controller devices
requirements saving costs
• Internal logic voltage reference of 1.8 V
(MSL4)
WEEE 2002/96EC
Applications
• Notebook computers, desktop PCs, Palmtop computers (Win CE, Palm PC), PDAs
• Digital cameras and video cameras
pagers)
Parts Table
Part
Description
Qty / Reel or Tube
TFDU6301-TR3
2500 pcs
TFDU6301-TT3
2500 pcs
Rev. 1.2, 21-Jun-06
www.vishay.com
321
TFDU6301
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
SD
Logic
&
Controlled
Driver
Control
TXD
GND
18468_1
Pin Description
Pin Number
1
Function
Description
I/O
Active
VCC2
IRED anode to be externally connected to Vcc2 (VIRED). For higher voltages
IRED Anode than 3.6 V an external resistor might be necessary for reducing the internal
power dissipation. This pin is allowed to be supplied from an uncontrolled
power supply separated from the controlled Vcc1 - supply.
2
IRED
Cathode
3
TXD
protection circuit disables the IRED driver if the TXD pin is asserted for
also used to control the receiver mode. Logic reference: 1.8 V logic
I
HIGH
4
RXD
Received data output, push-pull CMOS driver output capable of driving
standard CMOS. No external pull-up or pull-down resistor is required.
Floating with a weak pull-up of 500 kOhm (typ.) in shutdown mode. High/
Low levels adapted to 1.8 V logic. RXD echoes the TXD signal.
O
LOW
5
SD
(TXD = Low: SIR) or high bandwidth (TXD = High: MIR and FIR) mode.
I
HIGH
6
VCC1
Supply voltage
7
NC
Internally not connected.
8
GND
Ground
I
TFDU6301
weight 0.075 g
19531
Figure 2. Pinning
www.vishay.com
322
Rev. 1.2, 21-Jun-06
TFDU6301
Symbol
Min
Max
Unit
transceiver
Parameter
0 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.5
6
V
transmitter
0 V < VCC1 < 6 V
VCC2
- 0.5
6.5
V
Vin < VCC1 is allowed
Input currents
pin
Typ.
- 0.5
Power dissipation
PD
TJ
(operating)
V
mA
25
mA
500
mW
125
°C
Tamb
- 25
+ 85
°C
Tstg
- 25
+ 85
°C
260
°C
IIRED (DC)
150
mA
IIRED (RP)
700
mA
See chapter “Recommended
Solder Profiles”
6
10
< 90 μs, ton < 20 %
ESD protection
Human body model
Virtual source size
energy
d
IEC60825-1 or EN60825-1,
edition Jan. 2001
Ie
1
1.8
kV
2.0
mm
mW/sr
*)
(500)**)
*) Due to the internal limitation measures and the IrDA defined transmission protocol the device is a "class 1" device when operated inside
the absolute maximum ratings
**) IrDA specifies the maximum intensity with 500 mW/sr
Definitions:
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case obsoletes the former version.
(in Oct. 2002).
Rev. 1.2, 21-Jun-06
www.vishay.com
323
TFDU6301
Transceiver
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC
2.4
Typ.
Max
Unit
3.6
V
SIR mode
ICC
1.8
3.0
mA
MIR/FIR mode
ICC
2.0
3.3
mA
SD = High
T= 25 °C, not ambient light
shutdown mode
ISD
0.01
light sensitive
ISD
TA
- 25
Internally generated
Vdd
1.62
Input voltage low
(TXD, SD)
VIL
- 0.5
Input voltage high*)
(TXD, SD)
VIH
1.5
IICH
-1
Digital Reference Voltage
(TXD, SD)
Vin > 1.6 V
Output voltage low
IOL = 500 μA
Cload = 15 pF
Output voltage high
IOH = - 250 μA
Cload = 15 pF
high state
low state
Short to Ground
Short to VCC1
Activating shutdown
duration
*)
All modes
PA
1
μA
+ 85
°C
1.98
V
0.5
V
6
V
+1
μA
CI
5
pF
VOL
0.4
V
VOH
1.8
1.8
0.8 x Vdd
V
20
20
30
RRXD
400
tSDPW
200
500
mA
mA
f
μs
600
k:
ns
The typical threshold level is 0.5 x Vdd. It is recommended to use the specified min/max values to avoid increased operating current.
www.vishay.com
324
Rev. 1.2, 21-Jun-06
TFDU6301
Receiver
Parameter
Test Conditions
Symbol
Minimum irradiance Ee*) in
angular range**)
O = 850 nm to 900 nm,
VCC = 2.4 V
Ee
1.152 Mbit/s
O = 850 nm to 900 nm,
VCC = 2.4 V
Ee
4 Mbit/s
O = 850 nm to 900 nm,
VCC = 2.4 V
Ee
angular range***)
O = 850 nm to 900 nm
Ee
Min
Typ.
Max
Unit
50
(5)
80
(8)
mW/m2
(μW/cm2)
100
(10)
130
(13)
mW/m2
(μW/cm2)
200
(20)
5
(500)
mW/m2
(μW/cm2)
kW/m2
(mW/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
10
40
ns
90 % to 10 %, CL = 15 pF
tf (RXD)
10
40
ns
Input pulse length
1.4 Ps < PWopt < 25 Ps
tPW
1.6
2.2
3
μs
Input pulse length
PWopt = 217 ns,
1.152 Mbit/s
tPW
105
250
275
ns
Input pulse length
PWopt = 125 ns,
4 Mbit/s
tPW
105
125
145
ns
Input pulse length
PWopt = 250 ns,
4 Mbit/s
tPW
225
250
275
ns
4.0 Mbit/s
1.152 Mbit/s
d 115.2 kbit/s
25
80
350
ns
ns
ns
250
μs
100
μs
programmimg sequence
Power on dalay
Latency
tL
40
*)
IrDA low power specification is 90 mW/m2. Specification takes into account a window loss of 10 %.
**) IrDA sensitivity definition (equivalent to threshold irradiance):
Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length.
***) Maximum Irradiance Ee In Angular Range, power per unit area. The optical power delivered to the detector by a source operating
For more definitions see the document "Symbols and Terminology" on the Vishay Website
Rev. 1.2, 21-Jun-06
www.vishay.com
325
TFDU6301
Transmitter
Parameter
Test Conditions
needed
Symbol
Min
Typ.
Max
Unit
ID
330
440
600
mA
IIRED
-1
1
μA
see figure 3,
VCC = VIRED = 3.3 V, D = 0°
Ie
65
180
500*)
mW/sr
see figure 3,
VCC = VIRED = 3.3 V, D = 0°, 15°
Ie
50
125
500*)
mW/sr
VCC1 = 3.3 V, D = 0°, 15°
SD = High)
Ie
0.04
mW/sr
r24
D
Output radiant intensity, Angle of
Half Intensity
Op
Spectral bandwidth
'O
Optical rise time,
Optical fall time
875
886
°
900
45
tropt,
tfopt
10
nm
nm
40
ns
1.152 Mbit/s
topt
207
217
227
ns
4 Mbit/s
topt
117
125
133
ns
4 Mbit/s
topt
242
250
258
ns
topt
topt
20
100
μs
μs
25
%
Optical overshoot
t
*) Maximum value is given by the IrDA-Standard
**) Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source
for the standard Remote Control applications with codes as e.g. Philips RC5/RC6® or RECS 80. When operated under IrDA full range
conditions (125 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers
are used
www.vishay.com
326
Rev. 1.2, 21-Jun-06
TFDU6301
TFDU6300 needs no additional external components.
(see figure 3).
VCC2
R1
VCC1
R2
C1
GND
IRED Anode
V CC
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
IRED Cathode
19307
The resistor R1 is only necessary for high operating
voltages and elevated temperatures.
is used for C2.
used.
ISBN: 0521370957.
Table 1.
Component
Recommended Value
C1
4.7 μF, 16 V
293D 475X9 016B
C2
0.1 μF, Ceramic
R1
no resistor necessary, the internal controller is able to
control the current
R2
10 :, 0.125 W
Rev. 1.2, 21-Jun-06
Vishay Part Number
www.vishay.com
327
TFDU6301
I/O and Software
from the I/O suppliers. In special cases refer to the I/O
manual, the Vishay application notes, or contact
Mode Switching
below are required.
bandwidth mode.
50 %
SD
ts
th
High : FIR
TXD
50 %
50 %
Low : SIR
14873
Table 2.
Truth table
Inputs
TXD
Optical input Irradiance mW/m 2
RXD
Transmitter
high
x
x
weakly pulled
(500 k:) to VCC1
0
low
high
x
high
Ie
low
high > 100 μs
x
high
0
low
low
<4
high
0
low
low
low (active)
0
low
low
x
0
www.vishay.com
328
Outputs
SD
Rev. 1.2, 21-Jun-06
TFDU6301
Storage
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 °C
240 °C max.
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
2...4 °C/s
275
T ≥ 255 °C for 10 s....30 s
250
225
0
50
100
19535
150
200
250
300
350
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
Time/s
Temperature/°C
Temperature (°C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
Tpeak = 260 °C max
260
240
220
200
180
Temperature/°C
2 °C...3 °C/s
50
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
Manual Soldering
desoldering.
Rev. 1.2, 21-Jun-06
www.vishay.com
329
TFDU6301
TFDU6301 (Universal) Package
19533
Figure 8. Package Drawing
www.vishay.com
330
Rev. 1.2, 21-Jun-06
TFDU6301
Tape and Reel Information
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Figure 9. Reel drawing
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
Rev. 1.2, 21-Jun-06
W3 max.
www.vishay.com
331
TFDU6301
19855
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
www.vishay.com
332
Rev. 1.2, 21-Jun-06
TFDU6301
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
Rev. 1.2, 21-Jun-06
www.vishay.com
333
TFBS6614
Low Profile 4 Mbit/s (FIR) Infrared Transceiver Module
Description
The Vishay TFBS6614 is a very low profile (2.7 mm)
4 Mbit/s Infrared Data Transceiver module. A PIN
photodiode, an infrared emitter (IRED) and a lowpower control IC are integrated in a single package
that provides a total front-end solution.
VLOGIC - allows a low-voltage controller to connect
directly to TXD, RXD and SD/Mode logic signals of
the transceiver hence eliminating the need for costly
signal level converter and reducing power consumption.
18088
Features
• Small size:
H 2.7 mm x W 3.33 mm x L 7.98 mm
• Typical 1.0 m link distance, typ. RC range
e4
20 m
• Battery and power management features:
> Receive - 2 mA typical
> Shutdown - 10 nA typical
> Independent LED anode power supply
> Wide voltage range 2.6 V - 5.5 V
> High VCC noise rejection > 100 mVPP
• The TXD-echo function is enabled
• Vlogic (1.5 V - 5.5 V) - Independent digital supply
voltage
• Shutdown tri-states receiver output and disables
TXD allowing bus interfacing
• High immunity to fluorescent light noise and AC
field. No external shield required
• High DC ambient rejection - operates outdoors
• Directly interfaces with various super I/O and controller devices
(MSL4)
WEEE 2002/96EC
Applications
•
•
•
•
•
•
•
•
PDAs
Mobile phones
Notebook computers, desktop PCs
Digital photo and video cameras
External infrared adapters (Dongles)
Diagnostics systems
Medical and industrial data collection
GPS
Part Number
TFBS6614-TR3
www.vishay.com
334
Description
Quantity / Reel
2500 pcs
Rev. 2.2, 03-Sep-06
TFBS6614
VCC1
Amplifier
Comparator
Tri-state driver
RXD
IRED
IRED A
VCC2
Current
control
SD
Mode
control
IRED C
TXD
GND
Pinout
TFBS6614, side view
Weight 80 mg
1
2
3
4
5
Emitter
6
7
8
19906
Detector
Pin Description
Pin Number
Function
1
IRED Anode
2
IRED Cathode
3
TXD
4
RXD
5
SD
Description
I
high
O
low
I
high
IRED Cathode, internally connected to driver transistor
This input is used to transmit serial data when SD is low. An onchip protection circuit disables the LED driver if the TXD pin is
asserted for longer than 100 μs. When used in conjunction with the
SD pin, this pin is also used to set the receiver speed mode.
driving a standard CMOS or TTL load. No external pull-up or pulldown resistor is required. Floating with a weak pull-up of 500 k:
(typ.) in shutdown mode.
Shutdown, also used for dynamic mode switching. Setting this pin
active places the module into shutdown mode. On the falling edge
of this signal, the state of the TXD pin is sampled and used to set
receiver low bandwidth (TXD = Low, SIR) or high bandwidth (TXD
= High, MIR and FIR) mode.
VCC1
Supply Voltage, analog part
7
Vlogic
Supply Voltage, digital part, I/O reference voltage for inputs and
outputs.
8
GND
Ground
Rev. 2.2, 03-Sep-06
Active
Connect IRED anode directly to Vcc2. For voltages higher than
3.6 V an external resistor might be necessary for reducing the
internal power dissipation. An unregulated separate power supply
can be used at this pin.
6
I/O
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335
TFBS6614
Reference point Pin: GND unless otherwise noted
Parameter
transceiver
Test Conditions
0 V < VCC2 < 6 V
Symbol
Min
Max
Unit
VCC1
- 0.5
Typ.
+ 6.0
V
IRED anode voltage
0 V < VCC1 < 6 V
VCC2
- 0.5
+ 6.5
V
I/O reference voltage
0 V < VCC2 < 6 V
0 V < VCC1 < 6 V
Vlogic
- 0.5
+ 6.0
V
Input current
pin
10.0
mA
Power dissipation
PD
125
qC
- 25
+ 85
qC
Tstg
- 25
+ 85
qC
260
qC
profiles ( see figure 4, 5)
< 90 Ps, ton < 20 %
IIRED(DC)
125
mA
IIRED(RP)
600
mA
vin
Virtual source size
d
Method:
(1-1/e) encircled energy
mA
mW
Tamb
TJ
(Operating)
25
500
5.5
1.5
2.1
V
mm
Maximum Intensity for Laser Class 1 Operation of IEC60825-1 or
EN60825-1, edition Jan. 2001*)
internal
limitation
to class 1
500
mW/sr
Due to the internal limitation measures the device is a “ class 1” device under the specified conditions. It will not exceed the IrDA® intensity
limit of 500mW/sr
*) Sn/Pb and lead (Pb)-free soldering. The product passed VISHAY’s standard convection reflow profile soldering test.
Definitions:
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4.A new version of the standard in any case obsoletes the former version.
Emitting Diode (IRED) for IR -emitters. That is by definition wrong; we are here following just a bad trend.
www.vishay.com
336
Rev. 2.2, 03-Sep-06
TFBS6614
Transceiver
Tamb = 25 qC, VCC = 2.6 V to 5.5 V unless otherwise noted.
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC
2.6
Typ.
Max
Unit
5.5
V
3
mA
ICC
2
SD = Low, Ee amb = 1 klx**)
ICC
2
3
mA
Supply current transmitting
ICC
10
mA
SD = High, Ee amb = 0 klx
ISD
2.0
PA
SD = High, Ee amb = 1 klx
ISD
2.5
PA
SD = High, T = 85 qC, not
ISD
5
PA
+ 85
qC
Output voltage low
IOL = 1 mA, CLoad = 15 pF
VOL
Output voltage high
IOL = 500 PA, CLoad = 15 pF
VOH
0.8 x Vlogic
Output voltage high
IOL = 250 PA, CLoad = 15 pF
VOH
0.9 x Vlogic
Output RXD current limitation high
state
Short to ground
20
mA
Output RXD current limitation low
state
Short to Vlogic
20
mA
SD = High
600
k:
TA
- 25
0.4
V
V
V
RRXD
400
VIL
- 0.5
500
0.5
V
Vlogic - 0.5
Vlogic + 0.5
V
CMOS level***) for shutdown
current < 2 PA
VIH
Shutdown current
Vlogic = 3.3 V
Vin(SD) = 2.5 V
ISD
5
PA
Shutdown supply
Vlogic = 3.15 V
Vin(SD) = 2.5 V
ISD
0.5
PA
TTL level, Vlogic = 4.5 V
VIH
2.4
Input leakage current (TXD, SD)
- 25 qC to 85 qC
IL
- 10
Input capacitance (TXD, SD, Mode)
CIN
V
+ 10
PA
5
pF
*) Receive
mode only.
In transmit mode, add additional 85 mA (typ) for IRED current. Add RXD output current depending on RXD load.
**) Standard
Illuminant A.
***)
The typical threshold level between 0.5 x Vlogic (Vlogicd 3 V) and 0.4 x Vlogic(Vlogic = 5.5 V). It is recommended to use the specified
min/max values to avoid increased operating/shutdown current.
Rev. 2.2, 03-Sep-06
www.vishay.com
337
TFBS6614
Receiver
Tamb = 25 qC, VCC = 2.6 V to 5.5 V unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
Typ.
Ee
irradiance 1), SIR mode
O = 850 nm to 900 nm
40
(4)
irradiance, FIR mode
4.0 Mbit/s
O= 850 nm to 900 nm
Ee
100
(10)
O = 850 nm to 900 nm
Ee
irradiance 2)
Max
Unit
mW/m2
(PW/m2)
150
(15)
5
(500)
mW/m2
(PW/m2)
mW/m2
(mW/m2)
No detection receiver input
irradiance
*)
Rise time output signal
10 % to 90 %, 15 pF
tr(RXD)
10
40
90 % to 10 %, 15 pF
tf(RXD)
10
40
Input pulse length
tPW
Input pulse length
- 25 qC < T > 85 qC
tPW
1.5
1.8
2.6
Ps
Input pulse length
tPW
110
250
270
ns
Input pulse length
tPW
100
140
ns
Input pulse length
tPW
225
275
ns
Ee = 100 mW/m2, 4.0 Mbit/s
signal, 50 %, SIR mode **)
Ee
4
(0.4)
mW/m2
(PW/m2)
ns
ns
Ps
2.1
20
ns
2
40
ns
2
80
ns
2
ns
Ee = 100 mW/m , 1.152 Mbit/s
Ee = 100 mW/m , 576 kbit/s
Ee = 100 mW/m ,d115.2kbit/s
350
programming sequence Power
on delay
500
μs
300
μs
Latency
tL
170
Note: All timing data measured with 4 Mbit/s are measured using the IrDA ® FIR transmission header. The data given here are valid 5μs
lamps
Retriggering during applied optical pulse may occur
1) 2)
These terms are equivalent to the IrDA sensitivity definitions:
1) Minimum
Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is
operating at the Minimum Intensity in Angular Range into the minimum Half-Angular Range at the maximum Link Length
2)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical power delivered to the detector by a source operating at
the Maximum Intensity In Angular Range at Minimum Link Length must not cause receiver overdrive distortion and possible related link
errors. If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER)
specification.
For more definitions see the document “Symbols and Terminology “ on the Vishay Website
http://www.vishay.com/docs/82512/82512.pdf
www.vishay.com
338
Rev. 2.2, 03-Sep-06
TFBS6614
Transmitter
Tamb = 25 qC, VCC = 2.6 V to 5.5V unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
Typ.
Max
Unit
For 3.3 V operations no external
resistor needed. For 5 V
application that might be
necessary depending on
operating temperature range.
ID
500
550
650
mA
1
PA
110
400
mW/sr
0.04
mW/sr
IIRED
-1
circuit
D = 0 q, 15 q
TXD = High, SD = Low,
VCC1 = VCC2 = 3.3 V
Internally current-controlled, no
external resistor
Ie
90
VCC1= 5.0 V, D = 0 q, 15 q = Low
or SD = High (receiver is inactive
as long as SD = High)
Ie
D
half intensity
Op
Spectral bandwidth
'O
r24
880
886
q
900
40
nm
nm
tropt, tfopt
10
40
ns
1.152 Mbit/s
topt
207
217
227
ns
4.0 Mbit/s
topt
117
125
133
ns
4.0 Mbit/s
topt
242
250
258
ns
topt
topt
20
100
μs
μs
25
%
Optical overshoot
Mode Switching
has to be set by programming sequence using the
below are required.
Rev. 2.2, 03-Sep-06
t
1. Set SD/ Mode input to logic "High".
2. Set TXD input to logic "High". Wait ts t200 ns.
3. Set SD/ Mode to logic "Low" (the negative edge
latches state of TXD, which determines speed setting).
4. After waiting th t200 ns TXD can be set to logic
"Low". The hold time of TXD is limited by the maximum allowed pulse width.
bandwidth mode.
www.vishay.com
339
TFBS6614
1. Set SD/ Mode input to logic "High".
2. Set TXD input to logic "Low". Wait ts t200 ns.
3. Set SD/ Mode to logic "Low" (the negative edge
latches state of TXD, which determines speed setting).
SD
50%
ts
th
High: FIR
TXD 50%
50%
Low: SIR
Truth table
Inputs
TXD
RXD
Transmitter
high
x
x
weakly pulled (500 k:) to
Vlogic
0
low
high
x
low (active)
Ie
low
high
> 80 μs
x
high
0
low
low
<4
high
0
low
low
low (active)
0
low
low
x
0
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340
Outputs
SD
Rev. 2.2, 03-Sep-06
TFBS6614
TFBS6614 needs no additional external components
when the internal current control is used. For reducing
the IRED drive current for low power applications with
reduced range an additional resistor can be used to
connect the IRED to the separate power supply.
Depending on the entire system design and board
layout, additional components may be required. (see
figure 3).
Worst-case conditions are test set-ups with long
cables to power supplies. In such a case capacitors
are necessary to compensate the effect of the cable
inductance. In case of small applications as e.g.
mobile phones where the power supply is close to the
transceiver big capacitors are normally not necessary.
The TFBS6614 is designed to operate in system with
logical I/O level independent of the supply voltage. It
can interface to IR controllers with low voltage logic
from 1.5 V upwards to TTL (5 V). The reference voltage is to be connected to the Vlogic input.
VCC2
R1
VCC
R2
C1
IRED Anode
VCC
C2
GND
Ground
SD
SD
TXD
TXD
RXD
RXD
IRED current. The resistor R1 is optional for reducing
the IRED drive current.
low pass filter for smoothing the supply voltage when
noisy supply voltage is used or pick-up via the wiring
is expected.
quality of the supply voltage VCCX and injected noise.
An unstable power supply with dropping voltage during transmission may reduce the sensitivity (and
transmission range) of the transceiver.
In any case, when connecting the described circuit to
used.
at VCC2. Often some power supplies are not to follow
the fast current rise time. In that case another 10 PF
capacitor at VCC2 will be helpful.
The recommended components in table 1 are for test
set-ups
ISBN: 0521370957.
This one should be a small ceramic version or other
Table 1.
Component
Recommended Value
Vishay Part Number
C1, C2
0.1 PF, Ceramic
R1
Supply voltage > 3.6 V: add a resistor in series e.g. 2 :.
The internal controller is able to limit the current to about
550 mA.
R2
10 :, 0.125 W
Rev. 2.2, 03-Sep-06
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341
TFBS6614
Manual Soldering
desoldering.
260
10 s max. at 230 °C
240 °C max.
240
220
2...4 °C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 °C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Instruction.
Storage
280
T ≥ 255 °C for 20 s max
260
240
T ≥ 217 °C for 50 s max
220
200
180
Temperature/°C
Temperature/°C
160 °C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 °C...4 °C/s
80
60
2 °C...4 °C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Wave Soldering
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342
Rev. 2.2, 03-Sep-06
TFBS6614
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
Rev. 2.2, 03-Sep-06
W3 max.
www.vishay.com
343
TFBS6614
19616
Drawing-No.: 9.700-5299.01-4
Issue: 1; 18.08.05
Figure 6. Tape drawing, TFBS6614 for side view mounting
www.vishay.com
344
Rev. 2.2, 03-Sep-06
Contents
TFDU7100 ............................. 346
FIR
with RC
Receiver
www.vishay.com
3
TFDU7100
Infrared Transceiver Module (FIR, 4 Mbit/s) for IrDA® combined
with Remote Control Receiver (36 kHz to 38 kHz Carrier)
Description
The TFDU7100 IrDA compliant transceiver is a multimedia module that supports IrDA data transfer up to
4 Mbit/s (FIR) and bidirectional Remote Control operating over a range of more than 18 m. Integrated
within the transceiver are two PIN photodiodes, an
infrared emitter (IRED) and two low-power control IC.
It is ideal for applications requiring both Remote Control and IrDA communication.
19584
Features
layer specification (9.6 kbit/s to 4 Mbit/s)
• TV Remote Control receiver with 18 m
e3
receive range
• Remote Control carrier frequency 36 kHz
to 38 kHz
• Surface Mount Package, low profile
(L 9.9 mm x 4.1 mm x 4 mm)
• Compliant with IrDA Background Light Specification
• EMI Immunity > 300 Vrms/m in GSM Bands verified
(according IEC61000-4-3)
(MSL4)
• Qualified for lead (Pb)-free and lead (Pb)-bearing
soldering processes
WEEE 2002/96/EC
requirements saving costs, US - Patent - No.
6,157,476
Applications
• Remote control and IrDA communication in
Multimedia
• Notebook computers, Desktop PC’s, Internet TV
Boxes, Video Conferencing Systems
• Digital Still and Video Cameras
• Printers, fax machines, Photocopiers, Screen
Projectors
Parts Table
Part
Description
Qty / Reel
TFDU7100-TR3
1000 pcs
TFDU7100-TT3
1000 pcs
www.vishay.com
346
Rev. 1.1, 27-Sep-06
TFDU7100
Open Collector
Output
Amplifier
Envelope
Generator
RC - Rxd
Push-Pull
Driver
Amplifier
Comparator
VCC2
Rxd
SD
Logic
&
Controlled Driver
Control
TXD
VCC1
GND
19597
Pin Description
Pin Number
Function
Description
1
VCC2
IRED Anode
IRED anode to be externally connected to V CC2. An external resistor is only
necessary for controlling the IRED current when a current reduction below
300 mA is intended.
This pin is allowed to be supplied from an uncontrolled power supply
separated from the controlled VCC1 - supply
I/O
Active
2
IRED Cathode
3
TXD
on-chip protection circuit disables the IRED driver if the TXD pin is asserted
for longer than 80 Ps.
I
HIGH
4
RXD
standard CMOS or TTL loads. During transmission the RXD output is active
(echo-on). No external pull-up or pull-down resistor is required. Floating with
a weak pull-up of 500 k: (typ.) in shutdown mode.
O
LOW
5
SD
Shutdown for IRDA channel only
I
HIGH
6
VCC1
Supply Voltage
7
RC-Rxd
Open Collector Output. This output is active during transmission (echo-on).
External pull-up resistor to be added (e.g. 10 k:).
O
LOW
8
GND
Ground
Rev. 1.1, 27-Sep-06
www.vishay.com
347
TFDU7100
Symbol
Min
Max
Unit
transceiver
Parameter
- 0.3 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.5
+ 6.0
V
transmitter
- 0.5 V < VCC1 < 6 V
VCC2
- 0.5
+ 6.0
V
Voltage at RXD
- 0.5 V < VCC1 < 6.0 V
VRXD
- 0.5
VCC1 + 0.5
V
Vin
- 0.5
+ 6.0
V
10
mA
Input currents
Pin
Typ.
Power dissipation
see derating curve
TJ
(operating)
PD
125
°C
- 30
+ 85
°C
Tstg
- 40
+ 100
°C
260
°C
IIRED (DC)
125
mA
IIRED (RP)
700
mA
Repetitive pulse output current,
pin 1 to pin 2
< 0.3 Ps, ton < 25 %
Virtual source size
energy
d
IEC60825-1 or
EN60825-1,
ratings
Ie
*)
mA
mW
Tamb
25
250
2.5
2.8
mm
*)
(500)**)
mW/sr
Due to the internal limitation measures the device is a "class1" device under all conditions.
**)
Definitions:
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low Power
Option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case obsoletes the former version. With
introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version IrPhy 1.4 (in
Oct. 2002).
www.vishay.com
348
Rev. 1.1, 27-Sep-06
TFDU7100
Transceiver
Parameter
Test Conditions
Supply voltage
Symbol
Min
VCC1
2.7
Typ.
Max
Unit
5.5
V
SD = Low, Ee = 1 klx**), VCC1
ICC1
5
mA
Cycle
ICC
6.5
mA
Shutdown supply current*)
ISD
2
mA
TA
- 30
+ 85
°C
Cload = 15 pF
VOL
- 0.5
0.15 x
VCC1
V
IOH = - 500 μA
IOH = - 250 μA, Cload = 15 pF
VOH
0.8 x VCC1
0.9 x VCC1
VCC1 + 0.5
V
V
RRxd
400
600
k:
Input voltage low
(TXD, SD)
VIL
- 0.5
0.5
V
Input voltage high
(TXD, SD)
VIH
VCC1 - 0.5
6
V
-2
+2
μA
+ 150
μA
1
μA
5
pF
(TXD, SD)
Vin = 0.9 x Vlogic
IICH
SD, TXD = "0" or "1"
0 < Vin < 0.15 VCC1
IIrTX
SD, TXD = "0" or "1"
Vin > 0.7 VCC1
IIrTX
Input capacitance
(TXD, SD)
*)
-1
500
0
CI
The Remote Control receiver is always on. The shutdown function is used for disabling the IrDA channel, only
**)
Standard Illuminant A
Rev. 1.1, 27-Sep-06
www.vishay.com
349
TFDU7100
Receiver
Tested at Tamb = 25 °C, VCC1 = vCC2 = 2.7 V to 5.5 V unless otherwise noted.
Parameter
irradiance, SIR mode*)**)
Maximum irradiance in angular
Test Conditions
Symbol
O = 850 nm - 900 nm
D = 0 °, 15 °
Ee
576 kbit/s to 4 Mbit/s
O = 850 nm - 900 nm
D = 0 °, 15 °
Ee
O = 850 nm - 900 nm
Ee
Min
O = 850 nm - 900 nm
tr, tf < 40 ns, tpo = 1.6 μs at
f = 115 kHz, no output signal
allowed
Ee
Max
Unit
45
(4.5)
81
(8.1)
mW/m2
100
(10)
190
(19)
5
(500)
range***)
Logic LOEW receiver input
irradiance
Typ.
(μW/cm2)
mW/m2
(μW/cm2)
kW/m2
(mW/cm2)
4
(0.4)
mW/m2
(μW/cm2)
10 % to 90 %, CL = 15 pF
tr (RXD)
40
90 % to 10 %, CL = 15 pF
tf (RXD)
40
signal, 50 % SIR Mode
Input pulse length
tPW
Input pulse length
- 25 °C < T < 85 °C**)
tPW
1.5
1.8
2.6
μs
signal, 50 % MIR mode
Input pulse length
tPW
110
250
270
ns
signal, 50 % FIR mode
Input pulse length
tPW
100
140
ns
Input pulse length
tPW
225
275
ns
tPW
225
Receiver start-up time
*)
2.1
ns
ns
μs
275
ns
Ee = 200 mW/m2,
4 Mbit/s
20
ns
Ee = 200 mW/m2,
1.152 kbit/s
40
ns
576 kbit/s
80
ns
Ee = 200 mW/m2,
d 115.2 kbit/s
350
ns
programming sequence Power
on delay
500
μs
IrDA low power specification is 90 mW/m2. Spec takes a window loss 10 % into account.
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link
Length.
***)
If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification
www.vishay.com
350
Rev. 1.1, 27-Sep-06
TFDU7100
Remote Control Receiver*)
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing
Test Conditions
Symbol
irradianceRC
Parameter
O = 950 nm
D = 0 °, 15 °, RC5/RC6, 36 kHz
EeRC
0.4
(0.04)
irradiance
O = 950 nm
D = 0 °, 15 °, 36 kHz to 38 kHz
EeRC
0.4
(0.04)
1
mW/m2
(μW/cm2)
irradiance)
O = 850 nm - 970 nm
EeRC
0.4
(0.04)
2
mW/m2
(μW/cm2)
irradiance
O = 850 nm - 900 nm
EeRCmax
30
- 0.5
Output voltage low, RCRXD
CLoad = 15 pF, RL = 10 k:
VOLRC
Output voltage high, RCRXD
CLoad = 15 pF, RL = 10 k:
VHLRC
*)
Min
Typ.
Max
Unit
mW/m2
(μW/cm2)
W/m2
0.15 x VCC1
VCC1
V
V
Timing parameters are equivalent to TSOP1238, see that datasheet.
**)
The RCRXD output is an open collector output, therefore a load resistor is mandatory.
Transmitter
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing
Symbol
Min
Typ.
Max
Unit
limitation
Parameter
No external resistor for current
limitation*)
Test Conditions
ID
450
550
650
mA
limitation for low power FIR
mode
VCC2 = 3.3 V, RS = 18 :
Ie 10 t mW/sr
ID
90
mA
Txd = 0 V, 0 < VCC1 < 5.5 V
IIRED
-1
1
μA
D = 0 °, 15 °, full IrDA cone,
TXD = High, SD = Low, no external
resistor for current limitation*)
Ie
50
70
300
mW/sr
D=0°
TXD = High, SD = Low, no external
resistor for current limitation*)
Ie
80
200
400
mW/sr
VCC1 = 5.0 V, D = 0 °, 15 °
TXD = Low or SD = High (Receiver is
Ie
0.04
mW/sr
Op
Spectral bandwidth
'O
Optical overshoot
880
900
45
nm
nm
tropt, tfopt
10
40
ns
Input pulse width 1.63 Ps,
115.2 kbit/s (SIR)
topt
1.6
1.63
1.75
μs
1.152 Mbit/s
topt
207
217
227
ns
4.0 Mbit/s
topt
117
125
133
ns
4.0 Mbit/s
topt
242
250
258
ns
Input pulse width
0.1 μs, < tTXD < 100 μs
topt
Input pulse width
0.1 μs, tTXD t 100 μs
topt
tTXD
tTXD
μs
100
μs
25
%
*)
reduction is intended to operate at the IrDA low power conditions.
E.g. for VCC2 = 3.3 V a current limiting resistor of Rs = 56 : will allow a power minimized operation at IrDA low power conditions.
**)
the standard Remote Control applications with codes as e.g. Philips RC5/RC6® or RECS 80.
Rev. 1.1, 27-Sep-06
www.vishay.com
351
TFDU7100
TFDU7100 needs no additional external components
beside a resistor at the open collector RCRXD-output.
(see figure 2).
VIRED
R1
VCC
R2
C1
IRED Anode
VCC1
C2
GND
R3
Ground
RCRXD
RC Rxd
SD
SD
TXD
Txd
RXD
Rxd
IRED Cathode
19600
The inputs (Txd, SD) and the output Rxd should be
of the supply voltages VCCx and injected noise. An
the transceiver power supply pins. An Tantalum
used.
4.7 PF (type, see table under C1) at VCC2 will be helpful.
The RCRXD output is an open collector driver. Therefore it needs an external pull-up resistor of e.g. 10 k:
R3.
minimum a 12 pF capacitor, especially at the Rxd
port. The transceiver itself withstands EMI at GSM
observed, it is picked up by the wiring to the inputs. It
is verified by DPI measurements that as long as the
interfering RF - voltage is below the logic threshold
levels of the inputs and equivalent levels at the outputs no interference is expected.
for circuit design should be taken into account. Especially longer signal lines should not be used without
termination. See e.g. "The Art of Electronics" Paul
Press, ISBN: 0521370957.
Component
Recommended Value
C1
4.7 PF, 16 V
293D 475X9 016B
C2
0.1 PF, Ceramic
R1
depends on current to be adjusted
R2
47 :, 0.125 W
CRCW-0805-47R
R3
10 k:, 0.125 W
CRCW-0805-10K
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352
Vishay Part Number
Rev. 1.1, 27-Sep-06
TFDU7100
I/O and Software
Mode Switching
reduced sensitivity.
The SD-pulse duration for programming should be
limited to a maximum of 5 Ps avoiding that the transceiver goes into sleep mode.
the transceiver is set for the high bandwidth (576 kbit/
s to 4 Mbit/s) mode.
2. Set TXD input to logic "LOW". Wait ts > 200 ns.
state of Txd, which determines speed setting).
4. TXD must be held for th > 200 ns.
the transceiver is set for the lower bandwidth (9.6 kbit/s
to 115.2 kbit/s) mode.
50 %
SD
ts
High : FIR
50 %
TXD
th
50 %
Low : SIR
2. Set TXD input to logic "HIGH". Wait ts > 200 ns.
4. After waiting th > 200 ns Txd can be set to logic
"LOW". The hold time of Txd is limited by the maximum allowed pulse length.
14873
Table 2.
Truth table
Inputs
Outputs
Remark
SD
TXD
RXD
Transmitter
RC-RXD
high
x
x
weakly pulled
(500 k: to VCC1)
0
x
low
high
x
active low (echo)
Ie
x
low
high
> 100 Ps
x
high
0
x
x
low
> specified RC sensitivity (RCprotocol)
x
0
active low (envelope)
low
low
<4
high
0
x
low
low
> minimum irradiance in angular
range (IrDA)
< maximum irradiance in angular
range (IrDA)
low (active)
0
x
low
low
> maximum irradiance in angular
range (IrDA)
x
0
x
Rev. 1.1, 27-Sep-06
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353
TFDU7100
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 °C
240 °C max.
275
2...4 °C/s
T ≥ 255 °C for 10 s....30 s
250
160 °C max.
225
90 s max.
2...4 °C/s
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
0
50
19535
100
150
200
250
300
350
2 °C...3 °C/s
50
Time/s
25
0
0
Wave Soldering
Manual Soldering
desoldering.
Storage
www.vishay.com
50
100
150
200
Time/s
19532
250
300
350
280
Tpeak = 260 °C max
260
240
220
200
Temperature/°C
180
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
limiting resistor.
90
354
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
120 s...180 s
Temperature/°C
Temperature (°C)
85
80
75
70
65
60
55
50
2.0
18097
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Rev. 1.1, 27-Sep-06
TFDU7100
Optical Window
For the design of the optical windows see application
note “Window Size in Housings”
TFDU7100 - (Universal) Package
19586
Figure 8. Package drawing TFDU7100, dimensions in mm, tolerance ± 0.2 if not otherwise mentioned
7x1=7
0.6
2.5
1
8
1
19587
Figure 9. Recommended solder pad layout
Rev. 1.1, 27-Sep-06
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355
TFDU7100
Tape and Reel
Reel dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Figure 10. Reel dimensions, tolerance ±0.2 mm, if not otherwise mentioned
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
www.vishay.com
356
W3 max.
Rev. 1.1, 27-Sep-06
TFDU7100
Tape Dimensions
19819
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Figure 11. Tape dimensions, tolerance r0.2 mm, if not otherwise mentioned
Rev. 1.1, 27-Sep-06
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357
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358
Contents
TFDU8108 ............................. 360
VFIR
(9.6 kbit/s to 16 Mbit/s)
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359
TFDU8108
Very Fast Infrared Transceiver Module (VFIR, 16 Mbit/s)
IrDA® Serial Interface Compatible
2.7 V to 5.5 V Supply Voltage Range
Description
The TFDU8108 transceiver is part of a family of low
power consumption infrared transceiver modules. It is
compliant to the IrDA physical layer standard for VFIR
infrared data communication, supporting IrDA speeds
up to 16 Mbit/s (VFIR) and carrier based remote control modes up to 2 MHz. Integrated within the transceiver module are a PIN photodiode, an infrared emitter (IRED), and a low-power control IC.
At a minimum, a Vcc bypass capacitor is the only
external component required implementing a complete solution. For limiting the transceiver’s internal
power dissipation one additional resistor might be
necessary. The transceiver can be operated with
logic I/O voltages as low as 1.8 V.
20110
Features
layer standard (up to 16 Mbit/s), HP-SIR®,
Sharp ASK® and TV Remote Control
e3
• Compliant to the IrDA "Serial Interface
Specification for Transceivers"
• Surface mount Soldering to side and top view orientation
• Surface Mount package 9.7 x 4.7 x 4.0 mm3
for side view and top view applications
• Operating supply voltage from 2.7 V to 5.5 V
• Compliant to all logic levels between 1.8 V and 5 V
• TV Remote Control support
• Low Power consumption (4.2 mA supply current)
• Power Shutdown mode (1 μA shutdown current)
• Tri-State-receiver output, weak pull-up when in
output is disabled
• Built - In EMI Protection - No external shielding
necessary
• Pin to Pin compatible to legacy Vishay SIR and
FIR infrared transceivers
(MSL4)
WEEE 2002/96/EC
• Split power supply, can be driven by a separate
power supply not loading the regulated supply.
U.S. Pat. No. 6,157,476
Applications
• Notebook Computers, Desktop PCs, Palmtop
screen projectors
• MP3 players
• Telecommunication products (Cellular Phones,
Pagers)
• Internet TV boxes, Video Conferencing Systems
• Medical and industrial data collection devices
Package
TFDU8108
Baby Face
(Universal)
weight 200 mg
19497
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360
Rev. 1.7, 19-Jan-06
TFDU8108
Part Number
Description
Qty / Reel
TFDU8108-TR3
1000 pcs
TFDU8108-TT3
1000 pcs
TFDU8108
In tube
50 pcs
Vcc1
Voltage
Regulator
ASIC
VCC1: Analog supply voltage
Vlogic: Digital supply voltage, I/O reference voltage
VCC2: Independent supply voltage for the LED driver
Vlogic
RXD
+
+
+
Driver
V
Serial Interface according the IrDA standard "Serial
Interface for Transceiver Control"
SCLK: Clock line as timing reference*)
TXD: TX/SWDAT - line*)
RXD: RX/SRDAT - line*)
Vcc2
Logic
IRKAT
AGC
SCLK
Serial Interface
TXD
GND
*) see Appendix A for definitions
GND
19493
Definitions:
• VFIR: 16 Mbit/s
MIR and FIR were implement with IrPhy 1.1, followed by IrPhy 1.2,
• SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the ba-
adding the SIR Low Power Standard. IrPhy 1.3 extended the Low
sic serial infrared standard with the physical layer
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4.
version IrPhy 1.0
A new version of the standard in any case obsoletes the former ver-
• MIR: 576 kbit/s to 1152 kbit/s
sion.
• FIR: 4 Mbit/s
Pin Description
Pin Number
Function
Description
1
IRED Anode
IRED anode to be externally connected to VCC2 This pin is allowed
to be supplied from an uncontrolled power supply seperated from
the controlled VCC1 - supply.
2
IRED Cathode
IRED Cathode, internally connected to driver transistor
3
TXD
4
RXD
5
SCLK
Serial Clock, dynamically loaded
6
VCC
Supply Voltage
7
Vlogic
Supply voltage for digital part, 1.8 V to 5.5 V, defines logic swing for
TXD, SCLK, and RXD
8
GND
Ground
Rev. 1.7, 19-Jan-06
I/O
Active
Transmit Data Input, dynamically loaded
I
HIGH
Received Data Output, Tri-State CMOS driver output capable of
driving a standard CMOS or TTL load. No external pull-up or pulldown resistor is required. Pin is current limited for protection against
programming errors. The output is loaded with a weak 500 k: pullup, when in SD mode. The RXD echoes the optical TXD signal
duration transmission.
O
LOW
I
HIGH
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361
TFDU8108
BabyFace (Universal)
"U" Option BabyFace
(Universal)
IRED
1
Detector
2 3 4 5 6
7 8
17087
Figure 2. Pinning
Symbol
Min
Max
Unit
transceiver
Parameter
0 V < VCC2 < 6 V
Test Conditions
VCC1
- 0.5
6
V
transmitter
0 V < VCC1 < 6 V
VCC2
- 0.5
6
V
transceiver logic
0 V < VCC1 < 6 V
Vlogic
- 0.5
6
V
VIREDA
- 0.5
6
V
VTXD
- 0.5
Vlogic + 0.5
V
V RXD
- 0.5
Vlogic + 0.5
V
10
mA
IRED anode voltage
Input currents
Typ.
pin
Power dissipation
< 90 μs, ton < 20 %
Virtual source size
energy
Maximum Intensity for Class 1 Operation of IEC825-1 or
mA
mW
125
°C
- 25
+ 85
°C
Tstg
- 40
+ 100
°C
260
°C
IIRED (DC)
130
mA
IIRED (RP)
600
profile (see figures 4 to 6)
25
350
Tamb
TJ
(operating)
PD
d
2.5
2.8
mA
mm
Internal
limitation to
class 1
500
mW/sr
Due to the internal limitation measures the device is a "class1" device. It will not exceed the IrDA® intensity limit of 500 mW/sr.
www.vishay.com
362
Rev. 1.7, 19-Jan-06
TFDU8108
Transceiver
Symbol
Min
Max
Unit
Supply voltage VCC1
Parameter
Test Conditions
VCC1
2.7
Typ
5.5
V
Supply voltage Vlogic
Vlogic
1.8
5.5
V
Receive mode only. In transmit mode, add the averaged programmed current of IRED current as ICC2
Active, SIR, Ee = 0 klx (idle)
T = - 25 °C to 85 °C
ICC1
Active, VFIR, Ee = 0 klx, (idle)
T = - 25 °C to 85 °C
0.8
2.5
mA
ICC1
10
mA
active, no load Ee = 0 klx, (idle)
T = - 25 °C to 85 °C
Ilogic
5
μA
Ee = 1 klx*) receive mode,
Ilogic
1
mA
2
2
μA
μA
5
μA
+ 85
°C
0.4
V
EEo = 100 mW/m2
(9.6 kbit/s to 4.0 Mbit/s),
RL = 10 k: to Vlogic = 5 V,
CL = 15 pF
T = - 25 °C to 85 °C
Inactive, set to shutdown mode
T = 25 °C, Ee = 0 klx
T = 25 °C, Ee = 1 klx*) **)
ISD
Shutdown mode, **)
T = 85 °C
ISD
TA
Output voltage low
Cload = 15 pF,
Vlogic = 3 V, IOLO < + 500 μA
VOLO
Output voltage high
Cload = 15 pF,
Vlogic = 5 V, IOHI < - 250 μA
VOHI
- 25
0.8 x Vlogic
Input voltage high (TXD, SCLK)
V IL
- 0.5
Input voltage high (TXD, SCLK)
V IH
Vlogic - 0.3
logic decision level
(TXD, SCLK) ***)
VIL
(TXD, SCLK)
IL
Input capacitance
CI
V
0.5
6
0.5 x Vlogic
- 10
V
V
+ 10
μA
5
pF
*) Standard illuminant A.
**) In shutdown condition the device is not ambient light sensitive.
***) The device will work with less tight levels than specified min/max values of the logic input voltage. It is recommended to use the specified min/max values to minimize operating/standby supply currents.
Rev. 1.7, 19-Jan-06
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363
TFDU8108
Receiver
Typ.
Max
Unit
irradiance
Parameter
9.6 kbit/s to 115.2 kbit/s, SIR
O = 850 nm to 900 nm
Test Conditions
Ee
25
40
mW/m2
irradiance
1.152 Mbit/s, MIR
O = 850 nm to 900 nm
Ee
65
90
mW/m2
irradiance
4 Mbit/s, FIR
O = 850 nm to 900 nm
Ee
85
90
mW/m2
irradiance
16 Mbit/s, VFIR
O = 850 nm to 900 nm
Ee
140
200
mW/m2
irradiance
O = 850 nm to 900 nm
Ee
5
Ee
4
irradiance
Symbol
Min
10
kW/m2
mW/m2
signal, 50 % SIR mode
Input pulse length 20 Ps,
9.6 kbit/s
tPW
1.3
2.6
μs
signal, 50 % SIR mode
Input pulse length 1.41 Ps,
115.2 kbit/s
tPW
1.3
2.6
μs
signal, 50 % MIR mode
Input pulse length 217 ns,
1.152 Mbit/s
tPW
200
260
ns
4 Mbit/s
tPW
105
145
ns
4 Mbit/s
tPW
225
285
ns
signal, 50 %
Input pulse length 16 Mbit/s,
VFIR
39.5 ns < Pwopt < 43 ns
tPW
32
42
52
ns
RXD rise time of output signal
20 % to 80%, CL = 15 pF
tr (RXD)
2
5
15
ns
RXD fall time of output signal
20 % to 80%, CL = 15 pF
tr (RXD)
2
5
15
ns
RXD fall time of output signal
90 % to 10%, CL = 15 pF
tr (RXD)
5
RXD Jitter, leading edge, SIR
mode
125
30
ns
115.2 kbit/s
350
ns
RXD Jitter, leading edge, MIR
mode
1.152 Mbit/s
40
ns
RXD Jitter, leading edge, FIR
mode
4 Mbit/s
20
ns
RXD Jitter, leading edge
16 Mbit/s, VFIR mode
5
7
ns
RXD output pulse delay
tRXDdel
1
μs
Latency
tLAT
55
100
μs
Receiver Startup Time
tPOR
100
500
μs
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364
Rev. 1.7, 19-Jan-06
TFDU8108
Transmitter
Test Conditions
Symbol
internally controlled*)
Parameter
VCC1 = 3.3 V, the maximum
current is limited internally. An
external resistor can be used to
reduce the power dissipation at
higher operating voltages, see
derating curve.
ID
8
16
32
64
128
256
512
Max. output radiant intensity
VCC = 3.3 V, D = 0 °,15 °
Txd = High, R1 = 0 :
programmed to max. power
level
Ie
0.3
VCC = 5.0 V, D = 0 °, 15 °
Txd = Low, programmed to
shutdown mode
Ie
TXD pulse width of output
signal, 50 %
Input pulse length 1.63 μs,
115.2 kbit/s
tPW
signal, 50 %
Input pulse width 0.1 μs < tTXD
< 60 Ps
tPW
20
60
μs
signal, 50 %
(FIR, double pulse)
tPW
240
260
ns
signal, 50 %
Input pulse length 217.0 (MIR)
t PW
115
260
ns
signal, 50 %
FIR mode
Input pulse length 125 ns (FIR)
tPW
115
135
ns
signal, 50 %
Input pulse length 41.7 ns
tPW
38.3
45.0
ns
half intensity
D
Op
Spectral bandwidth
Optical overshoot
Min
Typ.
1.45
Max
mA
600
mW/sr/mA
0.04
mW/sr
2.20
μs
tTXD
125
± 24
870
°
900
40
tropt, tfopt
Unit
nm
nm
19
ns
15
%
*) Programmable using the"serial interface“ programming sequence, see Appendix A for implementation guidance and Appendix B for intensity values and range.
Rev. 1.7, 19-Jan-06
www.vishay.com
365
TFDU8108
Operated with a low impedance power supply the
TFDU8108 series devices need no external components. However, depending on the entire system
be required (see figure 3).
VCC2
R1
Recommended Application Circuit
Components
Component
Recommended Value
C1
4.7 μF, 16 V
C2
0.1 μF, Ceramic
R1
Recommended for VCC2 t 4 V
Depending on current limit
R2
< 10 :, 0.125 W
VCC1
IRED
Cathode
R2
Rxd
C1
GND
C2
I/O and Software
IRED
Anode
For operating the device from a Controller I/O a driver
software must be implemented.
Rxd
Txd
Vcc
SCLK
Mode Switching and Programming
GND
Vlogic
The generic IrDA "Serial Interface programming"
needs no special settings for the device. Only the current control table must be taken into account. For the
description see the Appendix A, B and C and the IrDA
document "Serial Interface specification for transceivers"
Vlogic
SCLK
Txd
17089
All external components (R, C) are optional
resistive and inductive wiring must be avoided. The
inputs (TXD, SCLK) and the output Rxd should be
directly DC-coupled to the I/O circuit.
R1 is used for reducing the power dissipation when
operating the device at a supply voltage of VCC2 > 4 V.
For increasing the max. output power of the IRED, the
value of the resistor should be reduced. It should be
dimensioned to keep the IRED anode voltage below
4 V for using the full temperature range. For device
and eye protection the pulse duration and current are
internally limited.
quality of the supply voltage VCC1 and injected noise.
An unstable power supply with dropping voltage during transmission may reduce sensitivity (and transmission range) of the transceiver.
recommended to position C2 as near as possible to
the transceiver power supply pins. An electrolytic
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Rev. 1.7, 19-Jan-06
TFDU8108
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 °C
240 °C max.
2...4 °C/s
160 °C max.
275
90 s max.
225
50
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
2...4 °C/s
0
T ≥ 255 °C for 10 s....30 s
250
120 s...180 s
100
19535
150
200
250
300
350
Time/s
Temperature/°C
Temperature (°C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
2 °C...3 °C/s
50
25
Wave Soldering
Manual Soldering
desoldering.
Storage
Rev. 1.7, 19-Jan-06
0
0
50
100
150
200
Time/s
19532
250
300
350
280
Tpeak = 260 °C max
260
240
220
200
Temperature/°C
180
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
600
500
400
300
200
100
0
- 40 - 20
14875
0
20 40 60 80 100 120 140
Temperature (°C)
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TFDU8108
TFDU8108 - BabyFace (Universal) Package
18473-1
Figure 8. Mechanical drawing, dimensions in mm, tolerance ± 0.2 mm if not otherwise shown
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Rev. 1.7, 19-Jan-06
TFDU8108
Recommended SMD Pad Layout
7x1=7
0.6 ( 0.7)
2.5 ( 2.0)
1
8
1
16524-1
Figure 9. Mechanical drawing, dimensions in mm, tolerance ± 0.2 mm if not otherwise shown
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Figure 10. Reel dimensions, dimensions in mm, tolerance ± 0.2 mm
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
Rev. 1.7, 19-Jan-06
W3 max.
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TFDU8108
Tape Dimensions
19822
Drawing-No.: 9.700-5251.01-4
Issue: 3; 02.09.05
Figure 11. Tape drawing,TFDU8108 for top view mounting, tolerance ± 0.1 mm
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Rev. 1.7, 19-Jan-06
TFDU8108
19875
Drawing-No.: 9.700-5297.01-4
Issue: 1; 04.08.05
after mounting, tolerance ± 0.1 mm
Rev. 1.7, 19-Jan-06
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TFDU8108
Tube drawing
19496
Figure 13. Tube drawing
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Rev. 1.7, 19-Jan-06
TFDU8108
Appendix A
Serial Interface Implementation
Basics of the IrDA Definitions
The data lines are multiplexed with the transmitter
and receiver signals and separate clocks are used
since the transceivers respond to the same address.
When no infrared communication is in progress and
the serial bus is idle, the IRTX line is kept low and
IRRX is kept high.
OFE A
IRTX/SWDAT
TX/SWDAT
IRRX/SRDAT
Infrared
Controller
RX/SRDAT
SCLK1
Optical
Transceiver
SCLK
SCLK2
VCC
OFE B
TX/SWDAT
RX/SRDAT
Optical
Transceiver
SCLK
17092
Figure 14. Interface to Two Infrared Transceivers
Connector
Infrared
Controller
IRTX+/SWDAT+
IRTX-/SWDATIRRX+/SRDAT+
IRRX-/SRDATSCLK+
SCLK-
Shielded Cable
VCC
GND
VCC
LVDS
Transceiver
GND
TX/SWDAT
RX/SRDAT
SCLK
Optical
Transceiver
A_SL
GND
17093
Figure 15. Infrared Dongle with Differential Signaling
Functional description
The serial interface is designed to interconnect two or
more devices. One of the devices is always in control
of the serial interface and is responsible for starting
every transaction. This device functions as the bus
master and is always the infrared controller. The infrared transceivers act as bus slaves and only respond
to transactions initiated by the master. A bus transaction is made up of one or two phases. The first phase
is the Command Phase and is present in every transaction. The second phase is the Response Phase
and is present only in those transactions in which data
must be returned from the slave. If the operation
involves a data transfer from the slave, there will be a
Response Phase following the Command Phase in
which the slave will output the data.
The Response Phase, if present, must begin 4 clock
cycles after the last bit of the Command Phase, as
shown in figures 9 and 10, otherwise it is assumed
that there will be no response phase and the master
can terminate the transaction.
Rev. 1.7, 19-Jan-06
The SCLK line is always driven by the master and is
used to clock the data being written to or read from
the slave.
This line is driven by a totem-pole output buffer. The
SCLK line is always stopped when the serial interface
is idle to minimize power consumption and to avoid
any interference with the analog circuitry inside the
slave. There are no gaps between the bytes in either
the Command or Response Phase. Data is always
transferred in Little Endian order (least significant bit
first). Input data is sampled on the rising edge of
SCLK. IRTX/SWDAT output data from the controller
is clocked by SCLK falling edge. IRRX/SRDAT output
data from the slave is clocked by SCLK rising edge.
Each byte of data in both Command and Response
Phases is preceded by one start bit. The data to be
written to the slave is carried on the IRTX/SWDAT
line. When the control interface is idle, this line carries
the infrared data signal used to drive the transmitter
LED. When the first low-to-high transition on SCLK is
detected at the beginning of the command sequence,
the slave will disable the transmitter LED. When the
first low-to-high transition on SCLK is detected at the
beginning of the command sequence, the slave will
disable the transmitter LED. The infrared controller
then outputs the command string on the IRTX/
SWDAT line. On the last SCLK cycle of the command
sequence the slave re-enables the transmitter LED
and normal infrared transmission can resume. No
transition on SCLK must occur until the next command sequence otherwise the slave will disable the
transmitter LED again. Read data is carried on the
IRRX/SRDAT line. The slave disables the internal signal from the receiver photo diode during the response
phase of a read transaction. The addressed slave will
output the read data on the IRRX/SRDAT line regardless of the setting of the Receiver Output Enable bit in
the main control register (main-ctrl-0). Non addressed
slaves will tri-state the IRRX/SRDAT line. When the
transceiver is powered up, the IRTX/SWDAT line
should be kept low and SCLK should be cycled at
least 30 times by the infrared controller before the first
command is issued on the IRTX/SWDAT line, see figure 11. This guarantees that the transceiver interface
circuitry will properly initialize and be ready to receive
commands from the controller. In case of a multiple
transceiver configuration, only one transceiver should
have the receiver output enabled.
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TFDU8108
A series resistor (approx. 200 :) should be placed on
the receiver output from each transceiver to prevent
large currents in case a conflict occurs due to a programming error.
Note: Generally the abbreviations IRTX/IRRX and TXD/RXD are
used for the data transmission lines for the optical communication.
IRTX/IRRX is mostly used at the controller, TXD/RXD at the transceiver
19505
Figure 19. Write Data Waveform with Extended Index
START ADDRESS & CONTROL
SCLK
IRTX/
SWDAT
IRRX/
SRDAT
19506
Figure 20. Read Data Waveform
19502
Figure 16. Special Command Waveform
START
ADDRESS,INDEX, DIR. START
DATA
SCLK
IRTX/
SWDAT
19507
Figure 21. Read Data Waveform with Extended Index
IRRX/
SRDAT
Note: During a read transaction the infrared controller sets the
19503
IRTX/SWDAT line high after sending the address and index byte
Figure 17. Write Data Waveform
(or bytes). It will then set it low two clock cycles before the end of
the transaction. It is strongly recommended that optical transceiv-
Note: If the APEN bit in control register 0 is set to 1, the internal sig-
ers monitor this line instead of counting clock cycles in order to
nal from the receiver photo diode is disconnected and the IRRX/
detect the end of the read transaction. This will always guarantee
SRDAT line is pulsed low for one clock cycle at the end of a write
correct operation in case two or more transceivers from different
or special command.
manufacturers are sharing the serial interface.
> 30 CLOCK CYCLES
SCLK
IRTX/
SWDAT
IRRX/
SRDAT
19504
Figure 18. Initial Reset Timing
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Rev. 1.7, 19-Jan-06
TFDU8108
Switching Characteristics
Maximum capacitive load = 20 pF*)
Parameters
Test Conditions
Min.
Max.
Unit
tCKp
Symbol
SCLK Clock Period
Rising edge of SCLK to next rising edge
of SCLK
250
infinity
ns
tCKh
SCLK Clock High Time
At 2.0 V for single-ended signals
60
ns
tCKI
SCLK Clock Low Time
At 0.8 V for single-ended signals
80
ns
tDOtv
Output Data Valid
(from infrared controller)
After falling edge of SCLK
tDOth
Output Data Hold
(from infrared controller)
After falling edge of SCLK
tDOrv
Output Data Valid
(from optical transceiver)
After rising edge of SCLK
40
ns
tDOrh
Output Data Hold
(from optical transceiver)
40
ns
40
0
ns
ns
tDOrf
Line Float Delay
tDIs
Input Data Setup
Before rising edge of SCLK
10
ns
tDIh
Input Data Hold
5
ns
60
ns
*)
Maximum capacitive load = 20 pF. That is is different from "Serial interface - specification". For the bus protocol see "RECOMMENDED
SERIAL INTERFACE FOR TRANSCEIVER CONTROL, Draft Version 1.0a, March 29, 2000, IrDA". In Appendix B the transceiver related
data are given.
Rev. 1.7, 19-Jan-06
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TFDU8108
Appendix B
Application Guideline
In the following some guideline is given for handling
the TFDU8108 in an application ambient, especially
for testing. It is also a guideline for interfacing with a
controller. We recommend to use for first evaluation
the Vishay IRM1802 controller. For more information
see the special data sheet. Driver software is available on request. Contact [email protected].
Serial Interface Capability of the Vishay
IrDA Transceivers
Abstract
A serial interface allows an infrared controller to communicate with one or more infrared transceivers. The
basic specification of the IrDA specified interface is
described in "Serial Interface for Transceiver Control,
v 1.0a", IrDA.
This part of the document describes the capabilities of
the serial interface implemented in the Vishay IrDA
transceivers TFDU8108. The VFIR (16 Mbit/s) device
TFDU8108 and the FIR device TFDU6108 (4 Mbit/s)
are using the same interface specification (with specific identification and programming).
IrDA Serial Interface Basics
The "Serial Interface for Transceiver Control" is a
master/slave synchronous serial bus, which uses the
TXD and RXD as data lines and the SCLK as clock
line with a minimum period of 250 ns. The transceiver
works always as slave and jumps into a control mode
on the first rising edge of the clock line remaining
there until the command phase is finished. After
power-on, it is required to initialize the transceiver by
at least 30 clock cycles of SCLK with TXD continuously low before starting programming.
If TXD gets active (high) during the initialization period
the initialization must be repeated.
A data word consists of one byte preceded by one
start bit.
The specified serial interface allows the communication between infrared controller and transceiver
through write and read transactions. In two register
blocks with different functions all data is stored for
operating the interface. The Main Control Registers
allow write and read transactions and here the executable configuration of the device is stored. The
Extended Indexed Registers contain the description
of the supported functionality of the device and can be
read only.
Power-on
After power on the transceiver is in the default mode
shown in table B1.
Addressing
The transceiver is addressable by three address bits.
There are individual and common addresses with the
values shown in table B2.
Registers Data Depth
In general data registers use a data depth of eight
bits. Sometimes it is not necessary to implement the
full depth. In such cases the invisible bits are considered as a zero.
Registers
The register content is listed in the tables B4 to B7.
Data Acknowledgment
Data acknowledgement generated by the slave is
available if the APEN bit is set to 1 in the common
control register, see the "main_ctrl_0" register values
table B4. In IrDA default state this functionality is disabled. It is recommended to enable this function.
Table B1: Power-on default mode
Function
sleep
RXD (Receive)
disable (floating tri-state)
TXD_LED (Emitter driver):
disable
APEN (Acknowledgment)
disable
Infrared Operating Mode (Speed)
SIR
Transmitter Power (Intensity setting)
max. SIR power level
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TFDU8108
Power Mode (active or sleep)
Rev. 1.7, 19-Jan-06
TFDU8108
Table B2: Addressing
Description
Address value ADDR [2:0]
Individual address
010
Common (broadcast) address
111
Table B3: Index Commands
Commands INDEX
[3:0]
Mode
write/read
Actions
Register Name
0h
W/R
Common control
main-ctrl-0 register
[4:0]
00h
1h
W/R
Infrared mode
[7:0]
00h
2h
W/R
TXD power level
[7:4]
70h
3h - Bh
X
Not used
Ch
X
Not used
Dh
W
Reset transceiver,
Only one byte!
R
Not used
Eh
X
Not used
Fh
W
Not used
R
Extended indexing
Data Bits
Data
TFDU8108
default
Note: The main_ctrl_1 register is written software dependent on the offset value stored in ext_ctrl_7 and ext_ctrl_8 registers.
The main_ctrl_1 register can be set to the following values, shown in the table.
Tables B4 to B7: Control Register Values
The status of the entire transceiver is stored in the
control registers.
Table B4: Register main-ctrl-0
Command structure:
C
0
0
0
0
bit 0
INDEX [3:0], 0h
bit 1
bit 2
1
bit 0
ADDR [0:2]
C is the transfer direction:
bit 1
bit 2
0
bit 4
0
0
0
DATA [7:0]
x C = 1: WRITE or RESET transaction
x C = 0: READ transaction
Main-ctrl-0, register values
Value
Function
bit 0
PM SL - Power Mode Select
low power-mode (shutdown
(sleep) mode)
normal operation power mode
shutdown
Default
bit 1
RX OEN - Receiver Output Enable
IRRX/SRDAT line disable
(tristated)
IRRX/SRDAT line enabled
disabled
bit 2
TLED EN - Transmitter LED Enable
disabled
enabled
bit 3
not used
bit 4
APEN*)
disabled
not used
don’t acknowledge
acknowledge
disabled
*)
APEN - Acknowledge Pulse Enable, (optional)
This bit is used to enable the acknowledge pulse. When it is set to 1 and RX OEN is 1 (receiver output enabled) the IRRX/SRDAT line will
be set low for one clock cycle upon successful completion of every write command or special command with individual (non broadcast)
transceiver address. The internal signal from the receiver photo diode is disconnected when this bit is set to 1.
Rev. 1.7, 19-Jan-06
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TFDU8108
Command structure:
C
1
0
0
0
bit 0
INDEX [3:0], 1h
bit 1
bit 2
1
bit 0
bit 1
bit 2
bit 3
ADDR [0:2]
bit 4
bit 5
bit 6
bit 7
DATA [7:0]
Main-ctrl-1, register values
DATA [7:0]
Function
00h
SIR (default)
01h
MIR
02h
FIR
03h
Apple Talk® (FIR functionality)
05h
VFIR - 16
08h
Sharp IR® (SIR functionality)
20h
IrDA CIR
Depending on the values of "ext_ctrl_7" and "ext_ctrl_8" check for correct main_ctrl_1. In case of an error, the transceiver will load 00h
into the main_ctrl_1 register and will not give an acknowledgement.
Command structure:
C
1
0
0
bit 0
INDEX [3:0], 1h
bit 1
bit 2
1
bit 0
bit 1
bit 2
bit 3
ADDR [0:2]
bit 4
bit 5
bit 6
bit 7
DATA [7:0]
Main-ctrl-2, DATA [7:0], bit 4 to bit 7
DATA
[7:0]
bit
7
bit
6
bit
5
bit
4
bit
3
bit
2
bit
1
bit
0
TXD IRED [mA]
le [mW/sr]
15°
(typ. on axis)
Link distance on axis
Recommended for
8xhFxh
1
x
x
x
x
x
x
x
512
140 (240)
VFIR > 0.7 m,
FIR > 1 m (link distance
limited by receiver
sensitivity)
VFIR/FIR standard
7xh*)
0
1
1
1
x
x
x
x
256
> 70 (120) *)
SIR >1 m
FIR > 0.7 m, VFIR > 0.5 m
SIR, More Ext.
FIR LP
6xh
0
1
1
0
128
35 (60)
SIR > 0.70 m
FIR > 0.50 m
VFIR > 0.30 m
Extended FIR
Low Power
5xh
0
1
0
1
64
16 (30)
SIR > 0.5 m
FIR > 0.30 m
VFIR > 0.30 m
VFIR Low Power /
FIR Low Power
4xh
0
1
0
0
(48)
3xh
0
0
1
1
32
8 (19)
SIR > 0.35 m
FIR > 0.20 m
VFIR > 0.20 m
SIR Low Power
2xh
0
0
1
0
16
40 (10)
1xh
0
0
0
1
8
(5)
0xh
0
0
0
0
x
x
x
x
0
SIR Low Power, min
without optical
windows
SIR > 0.15 m
FIR > 0.10 m
VFIR > 0.10 m
Close distance, e.g.
Docking station
0
*) Device is tested under this condition. Default setting is 7xh.
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TFDU8108
IRED current If
[mA]
Intensity Ie
[mW/sr]
d[m] at Ee =
d[m] at Ee =
d[m] at Ee =
d[m] at Ee =
100 mW/m2
40 mW/m2
90 mW/m2
225 mW/m2
512
240
1.55
2.45
1.63
1.03
256
120
1.10
1.73
1.15
0.73
128
60
0.77
1.22
0.82
0.52
0.37
64
30
0.55
0.87
0.58
48
22.5
0.47
0.75
0.50
0.32
32
15
0.39
0.61
0.41
0.26
16
7.5
0.27
0.43
0.29
0.18
8
3.75
0.19
0.31
0.20
0.13
Note: Calculated expected range in dependence of IRED drive current for the case that the receiver sensitivity is not limiting the range, on
axis, for information only.
IRED current If
[mA]
Intensity Ie
[mW/sr]
d[m] at Ee =
d[m] at Ee =
d[m] at Ee =
d[m] at Ee =
100 mW/m2
40 mW/m2
90 mW/m2
225 mW/m2
512
140.0
256
70.0
1.18
1.87
1.25
0.79
0.15
0.23
1.16
128
35.0
0.10
0.59
0.94
0.62
64
0.39
17.5
0.42
0.66
0.44
0.28
48
13.1
0.36
0.57
0.38
0.24
32
8.8
0.30
0.47
0.31
0.20
16
4.4
0.21
0.33
0.22
0.14
8
2.2
0.15
0.23
0.16
0.10
Note: Calculated expected range in dependence of IRED drive current for the case that the receiver sensitivity is not limiting the range;
15° off-axis, for information only.
Table B7: Reading Extended Indexed Registers
Note: Read Data with Extended Index E_INDX is one of the Extended Indexed Registers. It must be addressed via a precursor of writing
all 1s into the normal index location, thus INDEX[3:0] = Fh. It is an 8 bit address value, which must be followed by 3 SCLK cycles plus a
start clock before reading the DATA value. As in the normal Read Transaction, the input signal, TXD, must be set one clock cycle on LOW
(master ready to receive) and then on HIGH for the next 3 SCLKs and continuing through the entire Response Phase. The corresponding
reaction of the RXD line and the 8 bit DATA value is then read out as depicted below, noting that the Read Data value comes after the 3
SCLK cycles.
Read Command structure:
0
1
C
1
1
1
bit 0
INDEX [3:0], Fh
bit 1
bit 2
1
bit 0
bit 1
bit 2
ADDR [0:2]
bit 3
bit 4
bit 5
bit 6
bit 7
E_INDEX [0:7]
Response:
bit 0
bit 1
bit 2
bit 3
bit 4
bit 5
bit 6
bit 7
DATA [0:7]
Extended Indexed Registers
Action
E_INDEX [7:0]
Register name
DATA [7:0]
in TFDU8108
Definition default
in the TFDU8108
Manufacture ID
00h
ext_ctrl_0
0Bh
Chip information
(Factory reserved)
Read Support, Device ID
01h
ext_ctrl_1
C6h
Device ID
Receiver Recovery Time
Power On Stabilization
04h
ext_ctrl_4
23h
100μs to 500μs
Receiver Stabilization
05h
ext_ctrl_5
30h
0
Rev. 1.7, 19-Jan-06
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TFDU8108
Action
E_INDEX [7:0]
Register name
DATA [7:0]
in TFDU8108
SCLK Max. Frequency
(4MHz)
Common Capabilities
Definition default
in the TFDU8108
4 MHz
06h
ext_ctrl_6
03h
Low Power Mode and
Programmable Transmitter
Power supported
All listed in Receive Mode
Supported Infrared Modes
07h
ext_ctrl_7
2Fh
Supported Infrared Modes
08h
ext_ctrl_8
01h
Sharp IR
Mask ID: Released Ver. Set,
followed by Revision Letter
F0h
ext_ctrl_240
0Ah
Chip information
(Factory reserved)
Invalid Commands Handling
Reset
Commands and register addresses, which cannot be
encoded by the Serial Interface, are ignored by the
internal logic as invalid data. Below the different types
invalid command handling and the slave reaction is
shown.
Two ways to set the serial interface into a defined
state are available: The brute force method is to
switch the power off and on and let the device recover
in the default state. The software method is to set the
IRTX/SWDAT line low for t 30 clock cycles of the
clock line. If this line is detected as low for t 30 clock
cycles the transceiver is set into the command start
state and all registers are set to the as default implemented values.
Table B8: Invalid Commands Handling
Description
Master Command
Slave Reaction on RXD/SRDAT
Invalid command in read mode
Index [3:0] & C = 0
no reaction
Invalid command in write mode
Index [3:0] & C = 1
No acknowledgement generating
independent of the value of APEN
Valid command in invalid read mode
Index [3:0] & C = 0
no reaction
Valid command in invalid write mode
Index [3:0] & C = 1
Valid command in valid write mode and
invalid data
Index [3:0] & C = 1
ADDR [2:0] = 111 & C = 0
no reaction
Broadcast address in read mode
No reaction means that the slave does not start the respond phase.
C is the transfer direction:
• C = 1: WRITE or RESET transaction
• C = 0: READ transaction
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TFDU8108
Appendix C
SCLK
Serial Interface Programming Guide
The serial interface port of TFDU8108 enables an
interface controller to communicate using a standardized protocol, recall module ID and capability information, and implement receiver bandwidth mode switching, LED power control, shutdown and some other
functions.
This interface requires three signal lines: a clock line
(SCLK) that is used for timing, and two unidirectional
lines multiplexed with the transmitter (TXD, write) and
receiver (RXD, read) signal lines.
Programming sequence formats supported are
• one-byte special commands
• two-byte write commands
• two-byte read commands
• three-byte read commands
One-byte special command sequences are reserved
for time-critical actions, while the two-byte write command is predominantly used to set basic transceiver
characteristics. More information can be found in the
IrDA document "Serial Interface for Transceiver Control, v 1.0a" on http://www.IrDA.org.
Serial Interface Timing Specifications
In general, serial interface programming sequences
are similar to any clocked-data protocol:
• there is a range of acceptable clock rates, measured from rising edge to rising edge
• there is a minimum data setup time before clock
rising edges
• there is a minimum data hold time after clock rising
edges
Recommended programming timing:
• fSCLK < 8 MHz (according to the Serial Interface
Standard, quasi-static programming is possible)
• TSCLK > 125 ns,
• Tsetup > 10 ns,
• Thold > 10 ns
The timing diagrams, see figure 22, show the setup
and hold time for the serial interface programming
sequences.
TX
125 ns < Tclk
18496
Tsetup > 10 ns
Thold > 10 ns
s
Figure 22. Programming Sequence
Protocol Specifications
The serial interface protocol is a command-based
communication standard and allows for the communication between controller and transceiver by way of
serial programming sequences on the clock (SCLK),
transmit (TXD), and receive (RXD) lines. The SCLK
line is used as a clocking signal and the transmit/
receive lines are used to write/read data information.
The protocol requires all transceivers to implement
the write commands, but does not require the readportion of the protocol to be implemented (though all
transceivers must at least follow the various commands, even if they perform no internal action as a
result). This serial interface follows but does not support all read/ write commands or extended commands, supporting only the special commands and
basic write/read commands. Write commands to the
transceiver take place on the SCLK and TXD lines
and may use the RXD line for acknowledgment. A
command may be directed to a single transceiver on
the SCLK, TXD and RXD bus by specifying a unique
three-bit transceiver address, or a command may be
directed to all transceivers on the bus by way of a special three-bit broadcast address code. The Vishay
VFIR transceiver TFDU8108 will respond to transceiver address 010 and the broadcast address 111
only; it ignores all other transceiver addresses.
All commands have a common "header" or series of
leading bits, which take the form shown below.
first bit sent to transceiver
0
1
0/1
Sync.
Bits
R/W
0/1
I0
I1
last bit sent to transceiver.
I2
I3
Commands Index
A0
A1
A2
...
...
Transceiver
Address
The bits shown are placed on the TXD (DATA) line
and clocked into the transceiver using the rising edge
of the SCLK signal. Only the data bits are shown as it
is assumed that a clock is always present, and that
the transceiver samples the data on the rising edge of
each clock pulse.
Note: as illustrated in the diagram above, the protocol uses "Little
Endian" ordering of bits, so that the LSB is sent first, and the MSB
is sent last for register addresses, transceiver addresses, and read/
write data bytes. The notation that follows presents all addresses
and data in LSB-to-MSB order (bits 0, 1, 2, 3, ... 7) unless otherwise
stated.
Rev. 1.7, 19-Jan-06
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381
TFDU8108
One-byte Special Commands
One-byte special commands are used for time-critical
transceiver commands, such as full transceiver reset.
A total of six special commands are possible, although only one command is available on the
TFDU8108.
0
1
1
I0
Sync.
Bits
W
Special Command
Code
I1
I2
I3
A0
A1
A2
0
Transceiver
Address
0
Stop
Bits
Command
Programming Sequence
(Binary)
RESET
(Set all registers to default
value)
011 1011 010 00
Two-byte Write Commands
Two-byte write commands are used for setting the
contents of transceiver registers which control transceiver such as shutdown/enable, receiver mode, LED
power level, etc. The register space requires four register address bits (INDEX), although three codes are
used for controlling the transceiver (see above). The
1111 escape code is for extended commands. The 3bit transceiver address (ADDR) is for selecting the
destination, e.g. 010 to TFDU8108 and 001 to
TFDU6108. The second byte is data field (DATA) for
setting the characteristics of the transceiver module,
e.g. SIR mode (00) or VFIR (05) when the register
address is 0001.
The basic two-byte write command is illustrated
below:
1
1
Sync.
Bits
0
W
I0
I1
I2
Commands
Index
I3
A0 A1 A2 A3 D0..07
Transceiver
Address
8 Data
Bits
Some important serial interface
sequences are shown in table C1.
0
0
Stop
Bits
programming
Table C1: Serial interface programming sequences
Command
DATA
Normal (Enable all)
0Fh
01 1 0000 010 1 11110000 00
Shutdown
00h
01 1 0000 010 1 00000000 00
Receiver Mode
main_ctrl_1
DATA
SYNC / C / INDEX / ADDR / 1 / DATA / STOP
SIR
00h
01 1 1000 010 1 00000000 00
MIR
01h
01 1 1000 010 1 10000000 00
FIR
02h
01 1 1000 010 1 01000000 00
Apple Talk
03h
01 1 1000 010 1 11000000 00
VFIR
05h
01 1 1000 010 1 10100000 00
Sharp-IR
08h
01 1 1000 010 1 00010000 00
LED Intensity
main_ctrl_2
DATA
8 mA
1xh
01 1 0100 010 1 00001000 00
16 mA
2xh
01 1 0100 010 1 00000100 00
32 mA
3xh
01 1 0100 010 1 00001100 00
64 mA
5xh
01 1 0100 010 1 00001010 00
128 mA
6xh
01 1 0100 010 1 00000110 00
256 mA
7xh
01 1 0100 010 1 00001110 00
512 mA
Fxh
01 1 0100 010 1 00001111 00
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382
TFDU8108 Programming Sequence (Transceiver address: 010)
Common Ctrl
main_ctrl_0
Rev. 1.7, 19-Jan-06
Contents
TFDU2201 ............................. 384
Emitter/
Detector
pair
www.vishay.com
383
TFDU2201
Low Profile Transceiver Module
PIN Photodiode and Infrared Emitter
Description
The miniaturized TFDU2201 is an ideal PIN photodiode transmitter combination in a unique package for
applications in telecommunications like mobile
2.8 mm. The device is designed to be compatible to
the IrDA standard when using an external receiver IC
and IRED driver.
18170
Features
L 7.3 mm x W 4.55 mm x H 2.75 mm
• SMD side view
e3
• Fast PIN Photodiode for SIR and
FIR applications
• Detector with high efficiency and high speed at low
bias voltage
• Only 30 mA IRED peak current during transmission for IrDA SIR low power standard
(MSL4)
WEEE 2002/96/EC
Applications
• Mobile Phones, Pagers, Personal Digital Assistants (PDA)
• Handheld battery operated equipment
Parts Table
Part
Description
Qty / Reel
TFDU2201-TR1
Orientated in carrier tape for side view mounting
750 pcs.
TFDU2201-TR3
Orientated in carrier tape for side view mounting
2250 pcs.
Pin Description
Pin Number
Function
Description
1
IRED GND
IRED Cathode, Ground, to be used as heat sink
2
IRED GND
IRED Cathode, Ground, to be used as heat sink
3
IRED Anode
IRED Anode, to be driven by a current source
4
NC
The pins 4, 5, 6 are internally not connected. No modulated sources or voltages > 5 V
should be applied to these pins. It is recommended to ground these pins. In this case the
lead frame structure will work as an internal EMI shield.
5
6
7
Danode
Detector Anode
8
Dcathode
Detector Cathode
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384
Rev. 1.3, 21-Mar-06
TFDU2201
Pinout
TFDU2201
weight 100 mg
18228
Parameter
Test Conditions
Photo pin diode, reverse voltage range
Symbol
Min
Vr
- 0.3
Typ.
< 90 μs, ton < 20 %
IRED, reverse voltage range
V
10
mA
IIRED(DC)
100
mA
IIRED(RP)
550
mA
VrIRED
Power dissipation
See Figure 3
- 0.3
Ptot
Juntion temperature
See the chapter “Soldering
conditions” for lead-bearing and Pbfree processing
Virtual source size
Method: (1 - 1/e) encircled energy
5
V
200
mW
125
°C
Tamb
- 25
+ 85
°C
Tstg
- 40
+ 85
°C
260
°C
TJ
Ambient temperature range (operating)
Unit
12
Photo pin diode, reverse photo current
Max
d
2
mm
Compatible to Class 1 opration of IEC 60825 or EN60825 with worst case IrDA SIR pulse pattern, 115.2 kbit/s
Transceiver
Tested for the following parameters (T = 25 °C, unless otherwise stated)
Parameter
Test Conditions
Symbol
Min
Base band
Typ.
9.6
Max
Unit
4000
kbit/s
Receiver
Tested for the following parameters (T = 25 °:C, unless otherwise stated)
Parameter
Spectral sensitivity
Test Conditions
| D | d ± 15 °, Vr = 2 V,
O = 875 nm
Bias voltage range, detector
Symbol
Min
Typ.
Max
Unit
SO
1.0
1.2
1.8
nA/(mW/m2)
12
VRev
Reverse leakage current
0.2
Spectral bandwith
Max. operating irradiance
| D | d ± 90 °C, VCC = 2 V
Rise time at load : R = 50 :
Vr = 2 V, O = 875 nm
Fall time at load : R = 50 :
Vr = 2 V, O = 875 nm
Rev. 1.3, 21-Mar-06
O
800
Ee, max
8000
V
nA
950
nm
15000
W/m2
tr
40
ns
tr
40
ns
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385
TFDU2201
Transmitter
Tested for the following parameters (T = 25 °C, unless otherwise stated)
Test Conditions
Symbol
Forward current operating
condition for low power IrDA
operation
Parameter
Ie = 4 to 28 mW/sr in | D | d ± 15 °
IF1
| D | d ± 15 °, IF1 = 35 mA, 25 %
duty cycle
Ie
4
| D | d ± 15 °, IF1 = 350 mA, 25 %
duty cycle
Ie
35
Forward voltage
If = 50 mA
Min
Typ.
Unit
mA
8
14
mW/sr
mW/sr
Vf
1.2
1.45
V
Op
880
900
nm
Spectral emission bandwith
Max
30
2 MHz square wave signal (duty
cycle 1 : 1)
45
nm
38
ns
10 s max. at 230 °C
240 °C max.
Manual Soldering
desoldering.
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
2...4 °C/s
0
50
19535
100
150
200
250
300
350
Time/s
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386
Storage
275
T ≥ 255 °C for 10 s....30 s
250
225
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
Temperature/°C
Temperature (°C)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Wave Soldering
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
2 °C...3 °C/s
50
25
0
0
19532
50
100
150
200
Time/s
250
300
350
Rev. 1.3, 21-Mar-06
TFDU2201
280
Tpeak = 260 °C max
260
240
600
220
Temperature/°C
180
200
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
500
400
300
200
100
0
0
50
100
150
200
250
300
0
- 40 - 20
Time/s
14875
0
20 40 60 80 100 120 140
Temperature (°C)
Package Dimensions
19821
Drawing-No.: 6.550-5185.01-4
Issue: 5; 02.09.05
Rev. 1.3, 21-Mar-06
www.vishay.com
387
TFDU2201
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
24
330
60
24.4
30.4
23.9
27.4
www.vishay.com
388
W3 max.
Rev. 1.3, 21-Mar-06
TFDU2201
Tape Dimensions
19820
Drawing-No.: 9.700-5227.01-4
Issue: 3; 03.09.99
Rev. 1.3, 21-Mar-06
www.vishay.com
389
www.vishay.com
390
Contents
TOIM4232 ..............................392
Endec
www.vishay.com
391
TOIM4232
SIR Endec for IrDA Applications
Integrated Interface Circuit
Description
The TOIM4232 Endec IC provides proper pulse shaping for the SIR IrDA® front end infrared transceivers
as of the 4000-series. For transmitting the TOIM4232
shortens the RS232 output signal to IrDA compatible
electrical pulses to drive the infrared transmitter. In
the receive mode, the TOIM4232 stretches the
received infrared pulses to the proper bit width
depending on the operating bit rate. The IrDA bit rate
varies from 2.4 kbit/s to 115.2 kbit/s.The TOIM4232 is
using a crystal clock 3.6864 MHz for its pulse stretching and shortening. The clock can be generated by
the internal oscillator. An external clock can be used,
too. The TOIM4232 is programmable to operate from
1200 bit/s to 115.2 kbit/s by the communication software through the RS232 port. The output pulses are
software programmable as either 1.627 μs or 3/16 of
bit time. The typical power consumption is very low
with about 10 mW in operational state and in the order
of a few microwatts in standby mode.
18080
Features
• Pulse shaping function (shortening
and stretching) used in SIR IrDA®
applications
e3
• Directly interfaces the SIR transceiver
TFD..- and TFB..- series to an RS232 port
• Programmable baud clock generator (1200 Hz to
115.2 kHz), 13 baud rates
• 3/16 bit pulse duration or 1.627 μs pulse selectable
• SO16 - package
• 2.7 V to 3.6 V operation voltage, 5 V tolerant inputs
• Low operating current
(MSL4)
WEEE 2002/96EC
ULC Technology: High performance gate array
package using multiple metal layer CMOS technology
featuring sub-micron channel lengths (0.35 μm).
Part Number
TOIM4232-TR1
Qty / Reel
500 pcs
Block Diagram
Vcc
TD_IR
TD_232
Endec
RD_232
RD_IR
TD_LED
Baud
Generator
BR/D
RD_LED
S1
S2
Logic
RESET
Vcc_SD
Osci llator
GND
X1
X2
18079
www.vishay.com
392
Rev. 1.5, 06-Jun-06
TOIM4232
Pin Assignment and Description
Pin Number
Symbol
Description
1
RESET
Resets all internal registers. Initially must be HIGH ("1") to reset internal
registers. When HIGH, the TOIM4232 sets the IrDA default bit rate of
9600 bit/s, sets pulse width to 1.627 μs. The VCC_SD output is simply an
inverted reset signal which allows to shut down of a TFDx4x00 transceiver
when applying the reset signal to the TOIM4232. When using devices with
external SD like TFDU4203, the reset line can be used directly as shut
down signal. RESET pin can be controlled by either the RTS or DTR line
through RS232 level converter. Minimum hold time for resetting is 1 μs.
Disables the oscillator when active.
I/O
Active
2
BR/ D
Baud Rate control/ Data.
BR/ D = 0, data communication mode:
RS232 TXD data line is connected (via a level shifter) to TD_232 input pin.
The TXD - signal is appropriately shortened and applied to the output
TD_IR, driving the TXD input of the IR transceiver. The RXD line of the
transceiver is connected to the RD_IR input. This signal is stretched to the
correct bit length according to the programmed bit rate and is routed to the
RS232 RXD line at the RD_232 pin.
BR/ D = 1, Programming mode:
Data received from the RS232 port is interpreted as Control Word. The
Control Word programs the baud rate width will be effective as soon as
BR/ D return to LOW.
3
RD_232
Received signal data output of stretched signal to the RS232 RXD line
(using level converter).
O
HIGH
4
TD_232
Input of the signal to be transmitted from the RS232 port TXD line (passing
the level converter).
I
HIGH
5
VCC_SD
Outputs an inverted RESET signal. Can be used to shut down the power
supply of a 4000 series transceiver (e.g., TFDU4100). VCC shutdown
output function. This pin can be used to shut down a transceiver (e.g.,
TFDx4xxx). Output polarity: Inverted RESET input.
O
LOW
6
X1
Crystal input clock, 3.6864 MHz nominal. Input for external clock *)
I
7
X2
Crystal *)
I
HIGH
8
GND
Ground in common with the RS232 port and IrDA transceiver ground
9
TD_LED
Transmit LED indicator driver. Use 180 : current limiting resistor in series
to LED to connect to VCC. (VCC = 3.3 V)
O
LOW
10
RD_LED
Receive LED indicator driver. Use 180 : current limiting resistor in series
to LED to connect to VCC. (VCC = 3.3 V)
O
LOW
11
NC
No connection
12
S1
User Programmable Bit. Can be used to turn ON/ OFF a front-end infrared
transceiver (e.g., an infrared module at the adapter front)
O
LOW
13
S2
User Programmable Bit. Can be used to turn ON/ OFF a front-end infrared
transceiver (e.g., an infrared module at the adapter back)
O
LOW
14
TD_IR
Data output of shortened signal to the infrared transceiver
O
HIGH
15
RD_IR
Data input from the infrared transceiver, min. pulse duration 1.63 μs **)
I
LOW
16
VCC
Supply voltage
I
*) Crystal should be connected as shown in figure 2. In addition connect a 100 k: resistor from Pin 6 to Pin 7 and from Pin 6 and Pin 7 a
22 pF capacitor to ground, respectively. When an external clock is available connect it to Pin 6 leaving Pin 7 open. The external resistor
of 100 k: is used to accelerate the start of oscillation after reset or power - on. The value depends on the "Q" of the resonator. With low
Q resonators it is not necessary. The start - up time of the oscillator is between 30 μs (with piezo resonators) and above 2 ms with high Q
quartzes.
**) All Vishay Semiconductor SIR transceivers fulfill this condition
Rev. 1.5, 06-Jun-06
www.vishay.com
393
TOIM4232
Block diagram of application circuit
RESET VCC_SD
DTR
VCC
RTS
BR/D
TD_IR
TXD
TXD
TD_232
RD_IR
RXD
RD_232
RXD
RS232 9 pin
connector
Operating the interface circuit at a PC COM - port.
When operating directly with an UART with 3 V - or
5 V - logic, in the application circuit no level converter
is necessary.
TOIM4232
Level
converter
X1
R1
X2
100 kΩ
TFDU4100
TFDU420x
TFDU4300
3.6864 MHz
C1
C2
2 x 22 pF
18081
Table 1.
Component
Recommended Value
Vishay Part Number
C1
C2
R1
Quartz Crystal
22 pF
22 pF
100 k:
3.686400 MHz
VJ 1206 A 220 J XAMT
CRCW-1206-1003-F-RT1
XT49S - 20 - 3.686400M
Parameter
Test Conditions
Supply voltage
Input voltage
Symbol
Min
VCC
- 0.5
3.6
V
- 0.5
5.5
V
- 0.5
VCC + 0.5
V
8
mA
All pins
Output voltage
All pins
Output sinking current, max
All pins
Typ.
IO
Junction temperature, max
TJ
Ambient temperature
(operating)
Tamb
- 25
Storage temperature
Tstg
- 25
Tsldr
Max
Unit
125
°C
85
°C
85
°C
260
°C
DC Characteristics
Parameter
Test Conditions
Symbol
Min
Typ.
Max
Unit
VCC
2.7
3.3
3.6
V
Test Conditions
Symbol
Min
Typ.
Max
Unit
Inputs tolerate levels as high as
5.5 V max. all inputs are Schmitt
trigger inputs
VIH
2.0
Operating voltage
VCC = 3.3 V ± 5 %, operating temperature = - 55 °C to + 125 °C
Parameter
Input HIGH voltage
Input LOW voltage
V
VIL
Input Schmitt trigger hysteresis
0.8
Vhyst
0.6
V
V
PA
Input leakage no pull-up/down
VIN = VDD or GND
IL
- 10
Output HIGH voltage
IOH = - 2.0 mA
VOH
2.0
IOH = - 0.5 mA
VOH
2.4
Output LOW voltage
IOL = + 2.0 mA
VOL
0.4
V
Consumption current standby
Inputs grounded, no output load
VCC = 3.3 V, T = 25 °C
ISB
1
μA
Consumption current dynamic
Inputs grounded, no output load
VCC = 3.3 V, T = 25 °C
ICC
www.vishay.com
394
±1
10
V
V
2
mA
Rev. 1.5, 06-Jun-06
TOIM4232
Operation Description
Figure 2 shows a typical example of an RS232 port
interface. The TOIM4232 connects to an RS232 level
converter on one side, and an infrared transceiver on
the other. The internal TOIM4232 baud rate generator
can be software controlled.
When BR/D = 0, the TOIM4232 interprets the channels TD_232 to TD_IR and RD_IR to RD_232 as data
channels.
On the other hand, whenever BR/D = 1, the
TOIM4232 interprets TD_232 as Control Word for
setting the Baud rate. The Baud rate can be programmed to operate from 1200 bit/s to 115.2 kbit/s.
As RS232 level converter, EIA232 or MAX232 or
equivalent are recommended.
When using the TOIM4232 directly connected to an
UART it is compatible to 5 V TTL and 3.3 V CMOS
logic.
Typical external resistors and capacitors are needed
as shown in the TFDx4xxx references.
The output pulse duration can also be programmed,
see chapter "Operation Description". It is strongly recommended using 1.627 μs output pulses to save battery power. As frequency determining component a
Vishay XT49M Crystal is recommended, when no
external clock is available.
We strongly recommend not to use this 3/16 mode
because 3/16 pulse length at lower bit rates consumes more power than the shorter pulse. At a
data rate of 9600 bit/s, the ratio of power consumption of both modes is a factor of 12 (!).
Control Byte (8 bit)
First Character
X
S1
Second Character
S0
B3
B2
B1
B0
LSB
X: Do not care
S1, S2: User programmable bit to program the outputs S1 and S2
S0: Irda pulse select
S0 = (1): 1.627 μs pulses
S0 = (0): 3/16 bit time pulses, not recommended
B0 .. B3: Baud rate select words
Example:
To set TOIM4232 at COM2 port (2F8) to 9600 bit/s
with 3/16 bit time pulse duration send to the
TOIM4232 in programming mode in e.g. "Basic"
OUT &H2F8, (&H6)
For same port, 9600 bit/s and 1.627 μs pulse duration
send
OUT &H2F8, (&H16)
For additionally activating S1 send
OUT &H2F8, (&H36)
Baud Rate Select Words
B3
0
Programming the TOIM4232
For correct, data rate dependent timing the
TOIM4232 is using a built-in baud rate generator.
This is used when no external clock is not available as
in RS232 IR-dongle applications. For programming
the BR/D pin has to be set active, BR/D = 1.
In this case the TOIM4232 interprets the 7 LSBs at
the TD_232 input as a Control Word. The operating
baud rate will change to its supposedly new baud rate
when the BR/D returns back to LOW ("0") Set the
UART to 8 bit, no parity, 1 stop bit.
S2
1
B2
B1
B0
2nd
Char
Baud Rate
0
0
0
0
115.2 k
0
0
1
1
57.6 k
0
1
0
2
38.4 k
0
1
1
3
19.2 k
1
0
0
4
14.4 k
1
0
1
5
12.8 k
1
1
0
6
9.6 k
1
1
1
7
7.2 k
0
0
0
8
4.8 k
0
0
1
9
3.6 k
0
1
0
A
2.4 k
0
1
1
B
1.8 k
1
0
0
C
1.2 k
1
0
1
D
forbidden
1
1
0
E
forbidden
1
1
1
F
forbidden
Note: IrDA standard only supports 2.4 kbit/s, 9.6 kbit/s, 19.2 kbit/s, 57.6 kbit/s, and 115.2 kbit/s.
Rev. 1.5, 06-Jun-06
www.vishay.com
395
TOIM4232
Software for the TOIM4232
UART Programming
For proper operation, the RS232 must be programmed (using 8 bit, 1 stop, no parity) to send a two character control word, YZ. The control
word YZ is composed of two characters, written in hexadecimal, in format: YZ. The transfer rate for programming must be identical with
the formerly programmed data rate, or after resetting the TOIM4232, the default rate of 9600 bit/s is used.
Step.
RESET
BR/ D
TD_UART
RD_UART
RD_IR
TD_IR
Description and Comments
1
High
X
X
X
X
X
Resets all internal registers. Resets to
IrDA default data rate of 9600 bit/s
2
Low
X
X
X
X
X
Wait at least 2 ms, to allow start-up of
internal clock. When external clock is
used: Wait at least 7 μs.
3
Low
High
X
X
X
X
Wait at least 7 μs. TOIM4232 now is set
to the Control Word programming mode
4
Low
High
YZ
with Y = 1
for 1.627 μs
Y=0
3/16 bit
length
X
X
X
Sending the Control Word YZ.
Examples: Send "1Z" if 1.627 μs pulses
are intended to be used. Otherwise
send "0Z" for 3/16 bit period pulses.
"Y6" keeps the 9.6 kbit/s data rate.
Z = 0 sets to 115.2 kbit/s, see
programming table.
Wait at least 1 μs for hold-time.
5
Low
Low
DATA
DATA
DATA
DATA
With BR/D = 0, TOIM4232 is in the data
communication mode. Both RESET
and BR/D must be kept LOW ("0")
during data transmission.
Reprogramming to a new data rate can
be resumed by restarting from step 3.
The UART itself also must set to the
correct data rate *).
*) For programming the UART, refer to e.g., National Semiconductor’s data sheet of PC 16550 UART
V CC
R3
MAX3232CSE
1
C+
+ C3
3
4
VCC
TOIMx232
16
1
U1
C1-
V+
C2+
V-
2
C5
+
6
C7
+
2
3
C6
+ C4
4
+
5
GND
C2-
15
5
6
11
10
12
9
T1IN
T2IN
R1OUT
R2OUT
T1OUT
T2OUT
R1IN
R2IN
14
7
13
8
7
8
Reset
U2
Vcc
BR/Data
RD IR
RD 232
TD IR
TD 232
S2
V CC SD
S1
X1
NC
X2
RD LED
GND
TD LED
C10
16
2
+
15
R4
R6
TFDU4100
C11
4
14
6
13
8
IRED
Cathode
RXD
VCC1
GND
IRED
Anode
U4
TXD
NC
SC
1
3
5
7
12
11
10
9
J1
1
6
2
7
3
8
4
9
5
RXD
RTS (BR/D)
TXD
R1
DTR (Reset)
VCC
Y1
Application circuit using TFDU4100 with integrated
3 Vlogic , this one can be omitted
Z2
CON9
ext.
input max
3.3 V DC
J2
1
2
CON2
C1
R2
+ C2
C8
C9
16527
www.vishay.com
396
Rev. 1.5, 06-Jun-06
TOIM4232
Table 1.
Component
Recommended Value
Vishay Part Number
1
C1
100 nF
2
C2
10 μF, 16 V
293D106X9016B2T
3
C3
100 nF
4
C4
100 nF
5
C5
100 nF
6
C6
100 nF
7
C7
1 μF. 16 V
293D105X9016A2T
8
C8
22 pF
9
C9
22 pF
10
C10
6.8 μF, 16 V
293D 685X9 016B 2T
11
C11
100 nF
12
Z2
3.6 V
BZT55C3V6
13
R1
5.6 :
CRCW-1206-5601-F-RT1
14
R2
100 k: (up to 1 M:, or omitted)
CRCW-1206-1003-F-RT1
15
R3
47 :
16
R4
20 :
17
R6
20 :
XT49S - 20 - 3.686400M
18
Y1
3.686400 MHz
19
U1
MAXIM MAX 3232E
20
U2
TOIM4232
21
U3
TFDU4100
22
J1
9 Pin - D - Sub
23
J2
Power connector
Cannon
24
PCB
VISHAY Dongle_4
R3
TOIMx232
MAX3232CSE
1
16
C+
+ C3
V
CC
1
U1
3
16
Reset
2
C1-
V+
C2+
V-
4
C5
+
6
C7
+
2
U2
Vcc
15
BR/Data
RD IR
RD 232
TD IR
3
C6
+ C4
5
15
C2-
S2
VCC SD
S1
5
GND
T1OUT
T2OUT
R1IN
R2IN
Anode
3
6
U4
TXD
5
SD
8
7
GND
Vlog
11
X1
14
7
13
8
1
Cathode
4
12
6
T1IN
T2IN
R1OUT
R2OUT
2
+
VCC1
13
TD 232
C10
RXD
14
4
+
11
10
12
9
R4
opt.
TFDU4300
C11
NC
7
10
X2
RD LED
GND
TD LED
8
9
J1
1
6
2
7
3
8
4
9
5
RXD
DTS (BR/D)
TXD
R1
DTS (Reset)
VCC
Y1
Z2
CON9
J2
ext.
input max
3,6V DC
1
2
C1
CON2
R2
+ C2
C8
C9
Application circuit using TFDU4300 with an integrated
3 Vlogic, this one can be omitted
18240
Rev. 1.5, 06-Jun-06
www.vishay.com
397
TOIM4232
Table 2.
Component
Recommended Value
Vishay Part Number
1
C1
100 nF
2
C2
10 μF, 16 V
293D106X9016B2T
3
C3
100 nF
4
C4
100 nF
5
C5
100 nF
6
C6
100 nF
7
C7
1 μF, 16 V
293D105X9016A2T
8
C8
22 pF
9
C9
22 pF
10
C10
6.8 μF, 16 V
293D 685X9 016B 2T
11
C11
100 nF
12
Z2
3.6 V
BZT55C3V6
13
R1
5.6 k:
CRCW-1206-5601-F-RT1
14
R2
100 k: (up to 1 M:, or omitted)
CRCW-1206-1003-F-RT1
15
R3
47 :
16
R4
20 :
17
Y1
3.686400 MHz
XT49S - 20 - 3.686400M
18
U1
MAXIM MAX 3232E
19
U2
TOIM4232
20
U3
TFDU4300
21
J1
9 Pin - D-Sub
22
J2
Power connector
23
PCB
www.vishay.com
398
Cannon
VISHAY Dongle_4
Rev. 1.5, 06-Jun-06
TOIM4232
VCC
3
C1
+
R13
+3,3V
2
Q4
1
Q2
+ C2
R2
R6
RXD
RTS
1
3
Q1
D5
D6
VB1
TXD
3
Q3
1
D4
1
D7
R5
3
2
R1
2
R3
1
6
2
7
3
8
4
9
5
D1
D2
RXD
RTS
TXD
DTR
R20
SUB-D 9
3
R9
Reset
1
Q1
2
D3
+3.3 V
TD232 RD232 BR/D Reset
VCC
R12/1
R11
TOIM4232
1
2
3
4
5
QZ1
6
R10
7
8
C3
Reset
R12/2
IRED1
U1
VCC
BR/Data
RD IR
RD 232
TD IR
TD 232
S2
VCC SD
S1
X1
NC
X2
RD LED
GND
TD LED
16
15
14
13
12
2
11
4
10
6
9
8
C4
IRED cathode
IRED anode
RXD
TXD
VCC
NC
Gnd
SC
U2
1
3
5
7
TFDU4100
+
Jumper
C5
C6
18082
Install Jumper connection only when VCC SD supplies
U2. In that case leave R11 off.
Rev. 1.5, 06-Jun-06
www.vishay.com
399
TOIM4232
Table 3.
Component
Recommended Value
Vishay Part Number
1
C1
22 μF, 16 V
293D 226X9 016C 2T
2
C2
47 μF, 16 V
293D 476X9 016D 2T
3
C3
22 pF
4
C4
22 pF
5
C5
100 nF
6
C6
6.8 μF, 16 V
293D 685X9 016B 2T
7
D1
8
D2
1N4148
9
D4
BZT55C4V7
10
D5
1N4148
11
D6
1N4145
12
D7
BZT55C3V9
13
IRED1
TSHF5400
14
Jumper
CRCW-1206-000-F-RT1
15
LED1
TLLY4401
16
LED2
TLLG4401
17
Q1
BC817-25
18
Q2
VP 0610 0T
19
Q3
BC817-25
20
Q4
21
QZ1
3.686400 MHz
XT49S - 20 - 3.686400M
22
R1
22 k:
CRCW-1206-2202-F-RT1
23
R2
10 k:
CRCW-1206-1002-F-RT1
24
R3
22 k:
CRCW-1206-2202-F-RT1
25
R5
1 k:
CRCW-1206-1001-F-RT1
BC817-25
26
R6
47 k:
CRCW-1206-4702-F-RT1
27
R9
5.6 k:
CRCW-1206-5601-F-RT1
28
R10
100 k:
CRCW-1206-1003-F-RT1
29
R11
100 :
CRCW-1206-1000-F-RT1
30
R12
20 :
21
R13
1 k:
CRCW-1206-1001-F-RT1
32
R17
750 :
CRCW-1206-7500-F-RT1
CRCW-1206-750-F-RT1
33
R18
750 :
34
VB1
9 Pin - D- Sub
35
PCB
Cannon
VISHAY Dongle_3
36
U1
TOIM4232
37
U2
TFDU4100
www.vishay.com
400
1N4148
Rev. 1.5, 06-Jun-06
TOIM4232
Storage
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10 s max. at 230 °C
240 °C max.
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
2...4 °C/s
275
T ≥ 255 °C for 10 s....30 s
250
225
0
50
100
19535
150
200
250
300
350
Tpeak = 260 °C
T ≥ 217 °C for 70 s max
200
Time/s
Temperature/°C
Temperature (°C)
175
150
30 s max.
125
100
90 s...120 s
70 s max.
2 °C...4 °C/s
75
25
0
0
50
100
150
200
Time/s
19532
250
300
350
280
Tpeak = 260 °C max
260
240
220
200
180
Temperature/°C
The TOIM4232 is a lead (Pb)-free transceiver and
use with the TOIM4232 transceivers. For more details
please refer to the application note
2 °C...3 °C/s
50
< 4 °C/s
160
1.3 °C/s
140
120
100
80
< 2 °C/s
60
40
20
0
0
50
100
150
200
250
300
Time/s
Wave Soldering
Manual Soldering
desoldering.
Rev. 1.5, 06-Jun-06
www.vishay.com
401
TOIM4232
Package SO16L
10.5
10.1
9.25
8.75
7.5
7.3
2.45
2.25
1.27
0.25
0.10
0.49
0.35
8.89
16
0.3
0.2
10.56
10.15
9
technical drawings
according to DIN
specifications
13011
1
8
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape Width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
mm
16
330
50
16.4
22.4
15.9
19.4
www.vishay.com
402
W3 max.
Rev. 1.5, 06-Jun-06
TOIM4232
18241
Rev. 1.5, 06-Jun-06
www.vishay.com
403
Notes
www.vishay.com
404
Worldwide Sales Contacts
Online Information
For product information and current list of sales offices,
representatives and distributors, visit our website:
www.vishay.com
The Americas
EUROPE
United States
Vishay Americas
One Greenwich Place
Shelton, CT 06484
United States
Ph: +1-402-563-6866
Fax: +1-402-563-6296
Germany
Vishay EUROPE SALES GmbH
Geheimrat-Rosenthal-Str. 100
95100 Selb
Germany
Ph: +49-9287-71-0
Fax: +49-9287-70435
Asia
France
Vishay S.A.
199, BLVD DE LA MADELEINE
06003 NICE, CEDEX 1
France
Ph: +33-4-9337-2920
Fax: +33-4-9337-2997
Singapore
Vishay intertechnology
Asia Pte Ltd.
25 Tampines Street 92
Keppel Building #02-00
Singapore 528877
Ph: +65-6788-6668
Fax: +65-6788-0988
P.R.C.
Vishay Trading (Shanghai) Co., Ltd.
(SHANGHAI REPRESENTATIVE OFFICE)
ROOM D, 15F, SUN TONG INFOPORT PLAZA
55 HUAI HAI WEST ROAD
200030 SHANGHAI
P.R.C.
PH: +86-21-5258-5000
FAX: +86-21-5258-7979
Netherlands
Vishay BCCOMPONENTS B.V.
HURKESTRAAT 31
P.O. BOX 8766
5652 AH EINDHOVEN
NETHERLANDS
Ph: +31-40-2590-700
Fax: +31-40-2590-777
Japan
vishay japan CO., LTD.
Shibuya 3-chome Square Building 3F
3-5-16 Shibuya
Shibuya-Ku
Tokyo 150-0002
Japan
Ph: +81-3-5464-6411
fax: +81-3-5464-6433
One of the World’s Largest
Manufacturers
of Discrete Semiconductors and Passive Components
63 Lancaster Avenue
Malvern, PA 19355-2143
One of the World’s Largest
Manufacturers
of Discrete Semiconductors and Passive Components
United States
D ata B ook
infrared data co m m u nication
World Headquarters
© Copyright Vishay Intertechnology, Inc.
Registered Trademarks of Vishay Intertechnology, Inc.
All rights reserved. Printed in Germany.
Specifications subject to change without notice.
w w w. v i s h a y. c o m
VSE-DB2802-0610

interactive

Transcription

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