HP1050 - McDonald Lab

Transcription

1050 Series of HPLC
Modules
Service Handbook
 Copyright Agilent
Technologies 2001
All rights reserved.
Reproduction, adaption,
or translation without
prior written permission
is prohibited, except as
allowed under the
copyright laws.
Part No. NONE
09/2001
Printed in Germany
Warranty
IMPORTANT NOTE
The information
contained in this
document is subject to
change without notice.
This version of the 1050
service manual includes
all sections from the
01050-90102 edition 4
(1995).
Agilent Technologies
makes no warranty of
any kind with regard to
this material,
including, but not
limited to, the implied
warranties or
merchantability and
fitness for a particular
purpose.
shall not be liable for
errors contained herein
or for incidental or
consequential damages
in connection with the
furnishing, performance,
or use of this material.
Hewlett-Packard-Strasse 8
76337 Waldbronn
Germany
The series I opticals
information (79854A
MWD and G1306A DAD)
and the 79853A VWD
information has been
removed (products went
out of support during
2000).
Part numbers have been
updated as of 09/2001.
Contact your local
Agilent support office in
case of part number
issues or upgrades.
The latest version of this
manual is available as
Adobe Acrobat Reader
(PDF) version only and
can be downloaded from
the Agilent Technolgies
web page
www.agilent.com.
Contents
1 Common: General Information
This chapter provides general information about the 1050 Series of HPLC Modules 29
Safety Information 30
General 30
Operation 30
Safety Symbols
32
Radio Interference
33
Manufacturer’s Declaration
Sound Emission
33
33
UV-Radiation 34
Solvent Information
33
35
Flow Cell 35
Solvents 35
1050 Introduction
36
The Modules Overview 36
1050 Identification 38
Repair Policy 38
2 Common: Electronic Information
This chapter provides common electronic information about
the 1050 Series of HPLC Modules 39
Overview 41
Common Main Processor Board (CMP) 42
Common 1050 Functions
CMP Details 44
Remote Control 47
42
Service Handbook for 1050 Series of HPLC Modules - 09/2001
3
Contents
Firmware Board (FIM)
Firmware Description
53
53
Fluorescent Indicator Module (FIP)
External Contacts 56
Power Supply (DPS-B / DPS-A) 57
55
General Description 57
Base Supply (DPS-B) 58
Lamp Supply (DPS-A) 60
Communication Interface (CIB / CRB)
64
3 Common: Cable Information
This chapter provides information on cables for the 1050
Modules 67
Overview 68
Analog Cables 70
Remote Cables 72
BCD Cables 77
4 Pumps: General Information
This chapter provides general information about the 1050
Pumps 83
Introduction 84
About this Manual 84
About the Pumps 85
Repair Policy 85
Product Structure 86
4
Contents
Capillaries 87
Specifications 88
5 Pumps: Hardware Information
This chapter provides hardware information about the 1050
Pumps 91
Overview 93
How does the Pump Work? 95
Isocratic Operation
Gradient Operation
95
96
Overview of the Electronics 96
Overview of the Flow Path 98
Solvent Cabinet 99
Helium Degassing 99
Manual Injection Valve
Column Heater 100
100
Multi Channel Gradient Valve (MCGV)
Metering Drive Assembly 103
Pump Head Assembly 104
Continuous Seal Wash 105
Active Inlet Valve 107
Outlet Ball Valve 108
Frit Adapter Assembly 109
Purge Valve 110
High Pressure Damper 111
Column Holder 112
102
5
Contents
6 Pumps: Electronic Information
This chapter provides electronic information about the 1050
Pumps 113
Overview 115
Pump Drive Control Board (PDC2) 118
Relative A/D Converter Board (RAD) 123
Firmware Board (SFW) 127
HRI Board - Heater Isocratic Board 128
Heater Quaternary Board (HRQ) 131
High Pressure Transducer Board (HPT) 134
Connector Board (CON) 136
Pump Motherboard (HPS) 138
7 Pumps: Diagnostic Information
This chapter provides information on error messages and diagnostic features of the 1050 Pumps 143
How to use the Diagnostic Test Functions
Pump Pressure Ripple 146
Flow (Pressure) Tests 147
Prerequisites for the Pressure Tests 148
Normal Pressure Test 149
The Modified Pressure Test 150
Flow Test Method 151
Flow Test Method - Firmware Rev. 1.0 152
Flow Test Method - Firmware Rev. 3.0 and above
Gradient Test Method
157
159
Prerequisites for the Gradient Test Method
Running the Gradient Test Method 159
6
145
159
Contents
Error Messages
Selftest 163
ROM/RAM Test
162
163
Panic Error / Bus Error Address Error 164
Common 1050 Error Messages 165
Pump Initialization Error Messages 167
Normal Operation Error Messages 171
Column Heater Error Messages 175
Online Monitor Messages 177
Troubleshooting Hints 180
Standard Pressure Tests with different Solvents 181
Modified Pressure Tests 181
Pressure Tests - Firmware Revision 1.0 182
Pressure Tests - Firmware Revision 3.0 and above
184
Pressure Tests when the Pump is broken 185
Pressure Tests - Leak at Piston Seal 1 186
Pressure Tests - Leak at Piston Seal 2 189
Pressure Tests - Defective Piston 1 192
Pressure Tests - Defective Piston 2 196
Pressure Tests - Defective Active Inlet Valve
200
8 Pumps: Maintenance Information
This chapter provides provide procedures for service and maintenance of the 1050 Pumps 203
Solvent Cabinet and Column Heater
205
Replacing the Heat Exchanger 205
Replacing the Cable Assembly 206
Replacing the Active Inlet Valve
207
7
Contents
Replacing the Outlet Ball Valve 209
Maintaining the Frit Adapter Assembly
Maintaining the Purge Valve 211
210
Maintaining the Pump Head Assembly 212
Procedure 1: Pump Head with old Plunger Housing
213
Stage 1: Removing the Pump Head Assembly 213
Stage 2: Disassembling the Pump Head assembly 213
Stage 3: Replacing the Seals 214
Stage 4: Disassembling the Plunger Housing 215
Stage 5: Reassembling the Plunger Housing 216
Stage 6: Reassembling the Pump Head Assembly 217
Stage 7: Mounting the Pump Head Assembly 217
Procedure 2: Pump Head with new Plunger Housing
218
Stage 1: Removing the Pump Head Assembly 218
Stage 2: Disassembling the Pump Head Assembly 218
Stage 3: Replacing the Seals 219
Stage 4: Reassembling the Pump Head Assembly 220
Stage 5: Mounting the Pump Head Assembly 220
Continuous Seal Wash Option 221
Replacing the Fan 222
Removing the Metering Drive Assembly
223
9 Pumps: Parts Information
This chapter provides information on parts of the 1050
Pumps 225
Electronic Boards 227
Complete List of Ti-Parts 229
Solvent Cabinet 230
8
Contents
Solvent Cabinet with Helium Degassing 232
Solvent Cabinet with Column Heater and Manual Injection
Valve 234
Overall Diagram 236
Hydraulic Flow Path 240
Metering Drive Assembly 243
Pump Head Assembly (old version) 244
Pump Head Assembly (new version) 245
Pump Head Assembly with Seal Wash 246
Active Inlet Valve 248
Frit Adapter Assembly 250
Purge Valve Assembly 251
Column Holder Assembly 252
Special Tools 253
10Pumps: Additional Information
This chapter provides additional information about the 1050
Pumps 255
Product History 257
Firmware History 259
Revision 1.0
Revision 3.0
Revision 3.1
Revision 3.2
259
259
260
260
How does the On-line Monitor work 261
Normal Operation 262
M2 Gas Bubble 263
M4 Leak at first Piston 265
9
Contents
M6 Valve Backflow 266
M8 Outlet Valve Problem
267
If You Need Operational Hints 268
Helium Degassing Principle 269
Helium Regulators 269
Bottle Head Assembly 270
Isocratic Pumps 270
Pump Head Assembly 271
PDC Board 271
PDC2 Board 271
HRQ Board 272
GVD Board 272
Wear Retainer 272
Flow Test Method 273
Method loading 273
Flow Gradients 273
Manual Injection Valve 273
Metering Drive Repairs 274
Troubleshooting E27 Errors (Max Motor Drive Power Exceeded)
Piston with Conical Holder 276
Ghost Leak messages 276
PANIC Errors 276
275
11Sampler: General Information
Autosampler 281
About this Manual 282
About the Autosampler 282
Repair Policy 283
10
Contents
Product Structure 283
Capillaries 284
Specifications 285
12Sampler: Hardware Information
Autosampler 287
Overview 289
Solvent Flow Path 290
How Does The Autosampler Work? 291
The Injection Sequence 293
What happens when the 18596L/M Sample Tray is
connected? 294
Overview of the Electronics 295
Sampling Unit 297
Metering Drive 299
Analytical Head Assembly 300
High Pressure Switching Valve 301
Pneumatic Assembly 302
Actuator Air Solenoids
303
Additional 100 Sample Capacity
304
13Sampler: Electronic Information
Autosampler 307
Overview
309
11
Contents
Max Tray Drive Board (MTD) 312
Needle Mini Tray Drive Board (NMD) 316
Valve Metering Drive Board (VMD) 320
Firmware Board (FIM) 324
Autosampler Motherboard (ALM) 325
Extender Test Board (ET) 330
14Sampler: Diagnostic Information
This chapter provides information on error messages and diagnostic features of the 1050 Autosampler 333
Single Steps
335
Entering the Test Functions
335
Single Steps For The 21 Sample Tray 336
Single Steps for the 100 Sample Tray 338
Entering the Additional Single Steps
338
18596L/M Sample Tray Diagnostic Mode
340
Entering Diagnostic Mode 340
Z Test (Gripper Assembly) 340
R Test (radial arm movement) 341
Theta Test (angular movement) 341
Error Messages 342
Selftest 343
Panic Error 343
Error Messages for Firmware Revision 4.0 and greater 346
Injector Program Error Messages 350
Normal Operation Messages for Firmware Revision 3.1 and
below 351
Events Messages 354
12
Contents
18596L/M Vial Tray
355
15Sampler: Maintenance Information
This chapter provides provide procedures for service and maintenance of the 1050 Autosampler 357
Sampling Unit 359
Stage 1: Removing the Sampling Unit 359
Stage 2: Removing the Needle 360
Stage 3: Installation of the Needle 361
Stage 4: Removing the Seat Capillary 361
Stage 5: Disassembling the Needle Arm 362
Stage 6: Reassembling the Needle Arm 362
Stage 7: Disassembling the Tray Mechanic 363
Metering Device
365
Removing the Metering Device 365
Removing the Gear Belt 365
Analytical Head Assembly 366
Procedure 1: Analytical Head Assembly with old Adapter Housing
Procedure 2: Analytical Head with new Adapter Housing 369
Reassembling the Metering Device 371
High Pressure Switching Valve
366
372
Stage 1: Removing 372
Stage 2: Disassembling 372
Adjust the Sensors 374
Service Only Level 374
Sensors of the Sampling Unit 376
Sensor of the High Pressure Switching Valve
Metering Device Home Sensor 380
379
13
Contents
16Sampler: Parts Information
This chapter provides information on parts of the 1050
Autosampler 381
Electronic Boards and Fuses 383
Electronic Boards
Fuses 383
383
Complete List of Ti-Parts 384
Overall Diagram 79855A/B 385
Hydraulic Flow Path 389
Sampling Unit 391
Arm Assembly Spare Parts
395
Metering Drive and Analytical Head
Metering Drive 396
Analytical Head (Old Version)
396
396
High Pressure Switching Valve 399
Pneumatic Valve Assembly 401
17Sampler: Additional Information
Autosampler 403
Product History 405
Firmware Revisions 406
Firmware Revision 1.0
14
406
406
407
408
409
410
Contents
Firmware Revision 4.1 411
Firmware Revision 4.2 411
If you update the firmware to revision 4.0 and greater 412
If you add a 100 vial tray to the autosampler 412
If you have Intermittant E17: Needle cannot move out of vial
If you have to update the autosampler with a fan 413
If the fan in the autosampler does not work properly 413
If the needle lifts the vial out of the tray 414
If the injections are not reproducible (grooved needle) 414
413
18DAD/MWD: General Information
This chapter provides general information about the 1050 Diode Array and Multiple Wavelength Detectors 419
About the Detector 420
General 420
Repair Policy 420
Identification 421
Compatibility 421
DAD Differences 422
Added features 422
Removed features from local keyboard
Restrictions of user interface 423
Compatibility 423
Local User Interface 424
Workstation Interface 426
Test Functions 428
Options 428
422
Specifications DAD/MWD 429
15
Contents
19DAD/MWD: Hardware Information
This chapter provides hardware information about the 050 Diode Array and Multiple Wavelength Detectors 433
Overview: Optical System 435
Overview: Electronics 436
Optical Unit 438
Flow Cell Assemblies 439
Slit Assembly 441
Deuterium Lamp Assembly 442
Heat Exchanger Assembly 444
Shutter Assembly 445
Leak Sensor Assembly 446
Fans 447
20DAD/MWD: Electronic Information
Diode Array and Multiple Wavelength Detectors 449
Overview 451
Array Signal Conversion Board (ASC) 454
Data Acquisition Board (AQB) 459
Firmware Board (FIM) 463
Common Main Processor Board (CMP) 464
Remote Control
466
Communication Interface (CRB) 467
Digital to Analog Conversion Board (DAC)
Fluorescent Indicator Module (FIP) 472
Motherboard (LUM) 473
LPC Board 477
16
468
Contents
Power Supply (DPS-A)
478
21DAD/MWD: Diagnostic & Troubleshooting Information
This chapter provides information on error messages and diagnostic features of the 1050 Diode Array and Multiple Wavelength Detectors 483
STATUS Information
485
Status Modes 485
Status LEDs 486
Warnings 486
Error Messages 487
Selftest
487
1050 DAD/WMD Error Messages 490
Diagnostic Features 493
493
Measure Intensity Profile 494
Lamp Intensity Test 496
Measure Holmium Spectrum 498
D/A Converter Test 500
Electronic Noise Test 502
Check of Wavelength Calibration 504
ASC Test 505
Shutter Position 506
ROM/RAM/DISPLAY Tests 507
Using the Built-in Test Chromatogram 508
How to print the DAD Profiles
510
17
Contents
22DAD/MWD: Maintenance Information
This chapter provides provide procedures for service and maintenance of the 1050 Diode Array and Multiple Wavelength
Detectors 513
Tools Needed 514
Warnings and Notes
515
Removing the Optical Unit 516
Flow Cell Maintenance 517
Flushing Procedure 517
Replacements on Standard Flow Cells 518
Replacements on High Pressure Flow Cells 520
Lamp House Window Maintenance
Removing the Quartz Window
522
522
Replacing the Achromat 524
Replacing Fans 525
Replacement of Shutter or LPC Board 526
Replacement of Leak Sensor 527
Upgrade to from 79854A MWD to G1306A DAD 528
Upgrade MWD with Series II Optical 529
Verifying the Performance 530
Specifications 530
What You Need 530
Preparations 530
Scaling Factors 532
23DAD/MWD: Parts Information
This chapter provides information on parts of the 1050 Diode
Array and Multiple Wavelength Detectors 533
18
Contents
Overall Diagram 535
Optical Unit 538
Heat Exchanger and Flow Cell 540
Flow Cell Parts (STD-SST) 541
High Pressure Flow Cell Parts (HP-STD-SST) 542
High Pressure Flow Cell Parts (HP-Micro-SST) 543
Cell Repair Kits 544
Lamp Housing 545
Upgrade Parts MWD to DAD 546
Upgrade Parts MWD to Series II Optical 547
List of Accessories 548
24DAD/MWD: Additional Information
Diode Array and Multiple Wavelength Detectors 549
Product History
Hardware Changes
551
551
Firmware Changes 552
Known Problems 553
Panic Errors
553
25VWD: General Information
Variable Wavelength Detectors 559
About the Detector 561
Versions vs. Support Periods (EOS) 561
19
Contents
79853A
79853C
561
561
Repair Policy 562
Specifications 563
26VWD: Hardware Information
Overview 566
Optical System Overview 568
Leak Interface Assembly 569
Leak Sensor Assembly 570
Fan Assemblies 571
Optical Unit 572
Flow Cells 573
Deuterium Lamp 576
Photodiodes Assemblies 579
Filter Assembly 580
Grating Assembly and Motor 581
Mirrors 582
Slit Assemblies 582
Beam Splitter 582
Enhanced Optical Unit (“D”) 583
27VWD: Electronic Information
20
Contents
Location of Electronic Assemblies 587
Interconnection Diagram 589
Detector Controller Board (DCB) 590
Digital Section 592
Analog Sections 594
Keyboard 602
601
Keyboard Electronics (KDI / VFD)
603
Pre-Amplifier Boards 605
Power Supply Connection Board (PSC) 606
GPIB Communication Interface 607
GPIB Firmware Revisions
608
28VWD: Diagnostic & Troubleshooting Information
This chapter provides information on error messages and diagnostic features of the 1050 Variable Wavelength
Detectors 609
Self Diagnosis 611
During Power On 611
During Normal Operation
611
Error Messages Before Lamp Ignition
At Power ON
612
612
Error Messages After Lamp Ignition 616
Error Messages During Normal Operation 617
Error Messages During Use of Control Functions 619
User Control Functions 620
Service Control Functions 622
Entering the Service Mode 622
Zero Order Calibration 624
21
Contents
Wavelength Calibration 626
Wavelength Calibration Check 628
SET WL Parameter 629
Fix Signal 631
Leak Sensor Voltage 634
Voltage Test 635
ADC Noise 636
Grating Photo Sensor 637
Filter Photo Sensor 638
Remote Test 639
Filter Check 640
Zero Order Test 641
DAC Test 642
Pre-amplifier Gain 644
EEROM Test 645
DAC Calibration 646
Wavelength Compensation 647
29VWD: Maintenance Information
This chapter provides provide procedures for service and maintenance of the 1050 Variable Wavelength Detectors 649
Warnings 650
Securing for Transport 651
Replacement of Deuterium Lamp
652
Step 1: Replacement 652
Step 2: 0th Order Calibration 653
Step 3: WL CALIBRATION 654
Flow Cell Maintenance
Flow Cell Maintenance Kits
Replacing Cell Parts 655
22
655
655
Contents
Flushing Procedure
Leak Test 657
656
Using the Cuvette Holder 658
Replacing DCB Board and Firmware
661
DCB Board 661
DCB Firmware 661
Replacing Display Boards 662
Replacing the Leak Interface 663
Leak Sensor Assembly
Leak Interface 664
663
Replacements in the Optical Unit
665
Removing the Optical Unit 666
Replacing the PSC Board 667
Replacing Pre-amplifiers or Photodiodes 667
Replacing Grating Assembly Parts 668
Replacing Filter Assembly Parts 670
Replacing Mirrors, Beamsplitter and Slits 670
Optical Alignment Procedures 671
Procedure 1: Simple Alignment 671
Procedure 2: Sample Beam Alignment 672
Procedure 3: Reference Beam Alignment 674
Cleaning of Optical Unit Parts 675
Upgrade to GPIB 676
Performance Verification 677
What you need 677
Preparations 677
Starting a run 678
Scaling Factors 679
30VWD: Parts Information
This chapter provides information on parts of the 1050 Vari-
23
Contents
able Wavelength Detectors
681
Overall Diagram 683
Front Panel Parts 686
Leak Interface 686
Font Panel 687
Optical Unit “C”
688
Optical Unit “C” Inner Parts Top 689
Optical Unit “C” Inner Parts Bottom 690
Grating Assembly 691
Filter Assembly 692
Standard Flow Cell “C” (SST/Ti) 693
Semi-Micro Flow Cell (SST) 695
High Pressure Flow Cell (SST) 696
Ultra High Pressure Flow Cell (SST) 697
Preparative Flow Cell (Ti) 698
Cuvette Holder 700
Accessories 701
Screws 702
31VWD: Enhanced Optical Unit Information
This chapter provides information about the enhanced optical
unit “D” 705
Compatibility 706
Support of Previous Optical Units
Introduction 707
Support Considerations 708
706
Prefix Change 708
Identification 708
24
Contents
Compatibility Matrix
708
Part Numbers for Enhanced “D” Optical Unit 709
Standard Flow Cell “D” Repair Parts 710
Repair and Mainenance 711
Tools required: 711
Pre-requisites: 711
Additional Information 712
Replacements and Calibrations 712
Installing the Test Slit 713
Replacing Mirror #1 Assembly 715
Replacing Mirror #3 or #4 Assembly 716
Replacing the Grating or Grating Motor 718
Replacing the Beam Splitter 720
Cleaning or Replacing the Lens 721
Unlocking the Reference Aperture 723
Optimizing the Reference Readings 725
Installing the Standard Slit 726
32VWD: Additional Information
Product History
Prefix Changes
729
729
DCB ROM Firmware Revisions 731
GPIB ROM Firmware Revisions 733
Hardware Changes and Service Notes 734
Modified Pre-Amplifier Gain 734
Important Service Note 734
25
Contents
26
1050 Series of HPLC
Modules
Service Handbook Common Information
Technologies 2001
allowed under the
copyright laws.
Part No. NONE
11/2001
Printed in Germany
Warranty
IMPORTANT NOTE
The information
contained in this
01050-90102 edition 4
(1995) and G1306-90102
edition 2 (May 1994). It
merges both sections,
the MWD and the DAD.
this material,
including, but not
warranties or
merchantability and
purpose.
76337 Waldbronn
Germany
information (79854A
MWD) information has
been removed (product
went out of support
during 2000).
Contact your local
case of part number
issues or upgrades.
web page
www.agilent.com.
1
1
Common: General Information
This chapter provides general information about
the 1050 Series of HPLC Modules
Safety Information
Safety Information
The following general safety precautions must be observed during all phases
of operation, service, and repair of this instrument. Failure to comply with
these precautions or with specific warnings elsewhere in this manual violates
safety standards of design, manufacture, and intended use of the instrument.
Agilent Technologies assumes no liability for the customer’s failure to comply
with these requirements.
General
This is a Safety Class I instrument (provided with terminal for protective
earthing) and has been manufactured and tested according to international
safety standards.
Operation
Before applying power, comply with the installation section. Additionally the
following must be observed.
Do not remove instrument covers when operating. Before the instrument is
switched on, all protective earth terminals, extension cords,
auto-transformers, and devices connected to it must be connected to a
protective earth via a ground socket. Any interruption of the protective earth
grounding will cause a potential shock hazard that could result in serious
personal injury. Whenever it is likely that the protection has been impaired,
the instrument must be made inoperative and be secured against any
intended operation.
Make sure that only fuses with the required rated current and of the specified
type (normal blow, time delay, and so on.) are used for replacement. The use
of repaired fuses and the short-circuiting of fuseholders must be avoided.
Some adjustments described in the manual, are made with power supplied to
the instrument, and protective covers removed. Energy available at many
points may, if contacted, result in personal injury.
Any adjustment, maintenance, and repair of the opened instrument under
voltage should be avoided as much as possible. When inevitable, this should
be carried out by a skilled person who is aware of the hazard involved. Do
not attempt internal service or adjustment unless another person, capable of
30
Safety Information
rendering first aid and resuscitation, is present. Do not replace components
with power cable connected.
Do not operate the instrument in the presence of flammable gases or fumes.
Operation of any electrical instrument in such an environment constitutes a
definite safety hazard.
Do not install substitute parts or make any unauthorized modification to the
instrument.
Capacitors inside the instrument may still be charged, even though the
instrument has been disconnected from its source of supply. Dangerous
voltages, capable of causing serious personal injury, are present in this
instrument. Use extreme caution when handling, testing and adjusting.
When working with solvents please observe appropriate safety procedures
(for example, goggles, safety gloves and protective clothing) as described in
the material handling and safety data sheet by the solvent vendor, especially
when toxic or hazardous solvents are used.
31
Safety Information
Safety Symbols
Table 1 shows safety symbols that are used on the instrument and in the
manuals.
Table 1
Safety Symbols
Symbol
Description
The apparatus is marked with this symbol when the user should refer to the
instruction manual in order to prevent risk of harm to the operator and protect
the apparatus against damage.
Indicates dangerous voltages.
Indicates a protected ground terminal.
Eye damage may result from directly viewing the light produced by the
deuterium lamp used in this product. Always turn off the deuterium lamp
before opening the metal lamp door on the side of the instrument.
WA R N I N G
A warning alerts you to situations that could cause physical injury or
damage to the equipment. Do not proceed beyond a warning until you
have fully understood and met the indicated conditions.
C A UT I O N
A caution alerts you to situations that could cause a possible loss of data. Do
not proceed beyond a caution until you have fully understood and met the
indicated conditions.
32
Radio Interference
Radio Interference
This is to certify that this equipment is in accordance with the Radio
Interference Requirements of Directive FTZ 1046/1984. The German
Bundespost was notified that this equipment was put into circulation, the
right to check the series for compliance with the requirements was granted.
Test and Measurement
If test and measurement equipment is operated with equipment unscreened
cables and/or used for measurements on open set-ups, the user has to assure
that under operating conditions the radio interference limits are still met
within the premises.
Sound Emission
This statement is provided to comply with the requirements of the German
Sound Emission Directive of 18 January 1991.
This product has a sound pressure emission (at the operator position)
< 70 dB.
• Sound Pressure Lp < 70 dB (A)
• At Operator Position
• Normal Operation
• According to ISO 7779:1988/EN 27779/1991 (Type Test)
33
UV-Radiation
UV-Radiation
Emissions of ultraviolet radiation (200-315 nm) from this product is limited
such that radiant exposure incident upon the unprotected skin or eye of
operator or service personnel is limited to the following TLVs (Threshold
Limit Values) according to the American Conference of Governmental
Industrial Hygienists:
Table 2
UV-Radiation Limits
Exposure/day
Effective Irradiance
8 hours
0.1 µW/cm2
10 minutes
5.0 µW/cm2
Typically the radiation values are much smaller than these limits:
Table 3
UV-Radiation Typical Values
Position
Effective Irradiance
Lamp installed, 50-cm distance
average 0.016 µW/cm2
Lamp installed, 50-cm distance
maximum 0.14 µW/cm2
34
Solvent Information
Solvent Information
Observe the following recommendations on the use of solvents.
Flow Cell
Long term operation at pH > 11 should be avoided. Never leave strongly
alkaline solutions in the flow cell without flow.
Solvents
Always filter solvents through 0.4 µm filters, small particles can permanently
block the capillaries. Avoid the use of the following steel-corrosive solvents:
• Solutions of alkali halides and their respective acids (for example, lithium
iodide, potassium chloride, and so on).
• High concentrations of inorganic acids like sulfuric acid, especially at
higher temperatures (replace, if your chromatography method allows, by
phosphoric acid or phosphate buffer which are less corrosive against
stainless steel).
• Halogenated solvents or mixtures which form radicals and/or acids, for
example:
2CHCl3 + O2 → 2COCl2 + 2HCl
This reaction, in which stainless steel probably acts as a catalyst, occurs
quickly with dried chloroform if the drying process removes the
stabilizing alcohol.
• Chromatographic grade ethers, which can contain peroxides (for example,
THF, dioxane, di-isopropylether) such ethers should be filtered through
dry aluminium oxide which adsorbs the peroxides.
• Solutions of organic acids (acetic acid, formic acid, and so on) in organic
solvents. For example, a 1-% solution of acetic acid in methanol may attack
steel.
• Mixtures of carbon tetrachloride with 2-propanol or THF dissolve stainless
steel.
35
1050 Introduction
1050 Introduction
The Modules Overview
1050 is a series of HPLC products based on a modular concept. The
necessary functions are broken down into independent stand-alone modules
with standardized external design hydraulic- and external interfaces.
Following modules will be available at introduction:
Table 4
1050 Modules
Module
Product Number
1050 Isocratic Pump
79851A
1050 Quaternary Pump
79852A
1050 Quaternary Pump (bio compatible)
79852B
1050 Variable Wavelength Detector
79853C
1050 Multiple Wavelength Detector
79854A
1050 Diode Array Detector
G1306A
1050 Autosampler
79855A
1050 Autosampler (bio compatible)
79855B
36
1050 Introduction
Figure 1
1050 Modules
37
1050 Introduction
1050 Identification
Each module is identified by a 5 digit product number and a 10 unit serial
number on a label attached to the wall inside the module. The first four digits
of the serial number are the serial prefix. The letter identifies the country of
origin. The last five digits are an identification number unique to each
module. Any changes to the modules will be covered initially by Service
Notes. They will be sent out to all Service personnel prior to implementation
of the change to the instrument. With every reprint these changes will be
incorporated into the documentation.
Repair Policy
Major mechanical and electrical assemblies inside the 1050 modules will be
repaired on an assembly-exchange level. All other items have to be repaired
on board/component level. Repair procedures are given in the respective
sections of this manual (refer to Table of Contents). Assemblies can be set up
to the Blue Stripe Exchange system or can be removed. If in doubt contact
Waldbronn Product Support (Europe/ICON) or Little Falls Product Support
(USA/Canada).
38
2
2
Common: Electronic Information
This chapter provides common electronic
information about the 1050 Series of HPLC
Modules
This chapter gives information about the common electronics used in more
than one of the 1050 Series of modules:
• Overview
• Common Main Processor (CMP)
• Remote Control
• Firmware Boards (FIM, SFW)
• Fluorescent Indicator Module (FIP)
• External Contacts
• Poweer Supplies (DPS-B, DPS-A)
• Communication Interfaces (CIB, CRB)
40
Overview
Overview
Some of the electronic boards are used in more than one 1050 module.
The following table shows common electronic assemblies:
Table 5
Common Electronic Boards
Description
Modules
Part Number
Exchange
Power Supply (DPS-B)
pump, sampler
5061-3374
01050-69374
MWD, DAD, VWD
5061-3375
01050-69375
Common Main Processor (CMP)
pump, sampler, MWD, DAD
5061-3380
01050-69580
Display Interface Board (FIP)
pump, sampler, MWD, DAD
5061-3376
no
Communication Interface (CIB)
pump, sampler
5061-3382
no
Communication Interface (CRB)
MWD, DAD
5062-2482
no
41
Common Main Processor Board (CMP)
Repair Level: Board
Table 6
Part Numbers for CMP Board
Item
Part Number
CMP Board (Exchange)
01050-69580
CMP Board (NEW)
5061-3380
Common 1050 Functions
• display handling
• keyboard polling
• remote control input and output
• leak sensing
• option interfacing
• time programming
• method storage
• module configuration
• memory switching
• 32 kbyte RAM with battery back-up for parameter storage.
42
Figure 2
Blockdiagram CMP
43
According to the above functions the main processor board contains some
basic hardware which is common to all 1050 modules:
• 68008 main processor running at 8 MHz;
• 64 kByte RAM (32 kbyte RAM with battery back-up for parameter storage.
The data will be lost when CMP is removed from the slot);
• interrupt logic for system communication;
• 3 channel software controlled timer;
• interface to keyboard/display module;
• remote I/O hardware;
• leak sensor electronics;
• interface to backplane bus;
• watchdog hardware.
Firmware is not part of this board, because parts of the main processor’s
software are module specific. The main processor firmware will be located
on the ’personality module’ (AQB-, RAD, VMD-Board) or on an optional
board.
CMP Details
Interrupt system
There are one non-maskable interrupt six high priority hardware interrupt
lines and seven low priority mail interrupt lines. The non-maskable interrupt
is connected to the powerfail line of the power supplies (DPS-A/B).
The high priority interrupt lines are: One from timer 6840 for hardware
synchronization and five from remaining slots (these lines are disabled by
SOK- = HIGH (system not ok).
The low priority interrupt lines are: Five lines from all slots except power
supply used for communication with local processors via dual port RAMs and
two lines for CMP controlled software interrupts.
Watchdog timer
(Test for CPU hang-up) This circuitry is software retriggerable and is
disabled during CPU initialization. In case of CPU hang-up SOK line is set the
CPU is halted and the remote line ’shutdown’ is set.
44
LED on board
There is a RED LED on the board which is the output of the watchdog circuit.
It is ON during initialization and when the processor has a hang-up (LD 101).
Programmable timer
It includes 3 independent timers:
• Timer 1 is connected to the backplane bus it’s free for module special use.
• Timer 2 is used as software timer for the CMP.
• Timer 3 is used to generate the BUS ERROR signal.
Reset system
A harware reset is performed
• at power
• manually by on-board switch
Hardware reset will reset all devices connected to the bus but main
processor can reset these devices by software too.
Reset for display unit
The latch for the status LEDs and the brigthness control will not be reseted
by power on or by software reset. The alphanumeric display is reseted at
power on.
I/O
Two remote connectors are at the rear panel. They provide start, stop, not
ready, shutdown, prepare-run and power on signals. The remote lines are
input and output and are decoupled for EMC. The shutdown line is set by
hardware in the case of leak or CPU hang-up.
System control
The POK (peripheral OK) is driven from all devices. The SOK- (system OK)
• is outputted from main processor to all devices;
• is hardware and software controlled
• disables/enables all devices by main software;
• disables all devices if main processor watchdog becomes active (main
processor hang-up);
45
All devices are enabled after initialization. Bus control After bus request the
main processor will pass bus control to the requesting external controller.
The local main processor areas including I/O are accessible too.
This may be a feature for diagnostics or if data rate is increasing to much
with later options. For this second case an external fast transfer hardware
(for example DMA device) could do the transfers after set-up by the main
processor.
Leak sensing
The leak detection circuit is located on the CMP board and checks
continuously for presence and leak conditions. If the sensor is missing
(defect) or in leak condition the PTC is cooled down the error message
appears. When the module is turned on the leak message is disabled for some
time to allow the sensor to reach its working range.
Working condition of the PTC
Normal:
about 75°C
400...500 Ohm
Error:
below 55°C
about 150 Ohm
Actions:
❏ Check for leak.
❏ Check connector of the sensor.
❏ Check resistance of leak sensor.
❏ Change leak sensor.
❏ Change CMP board.
❏ Change FIM board.
46
Remote Control
The CMP board provides two remote connectors.
Remote control allows easy connection between single instruments or
systems to ensure coordinated analysis with simple coupling requirements.
When 1050 System is started from the autosampler the following signals can
be measured at the remote lines. The START REQUEST signal is only
available when the autosampler was started from any other module (remote
configuration set to HPSystem).
Figure 3
Remote Control Analysis
47
For the 1050 Series of HPLC Modules the subminiatur D connector is used.
Each module provides two remote connectors which are both parallel and
inputs/outputs (wired-or technique).
To provide maximum safety within a distributed analysis system one line is
dedicated to SHUT DOWN the system’s critical parts in case any module
detects a serious problem.
To detect whether all participating modules are switched on or properly
powered one line is defined to summarize the POWER ON state of all
connected modules.
Control of analysis is maintained by signal readiness READY for next
analysis followed by START of run and optional STOP of run triggered on the
respective lines. In addition PREPARE and START REQUEST may be issued.
Signal description
SHUT DOWN
(L) System has serious problem (e.g. leak: stops pump). Receiver is
any module capable to reduce safety risk.
POWER ON
(H) All modules connected tosystem are switched on. Receiver is any
module relying on operation of others.
READY
(H) System is ready for next analysis. Receiver is any sequence
controller.
PREPARE
(L) Request to prepare for analysis (e.g. calibration detector lamp on).
Receiver is any module performing preanalysis activities.
START REQUEST
(L) Request to start injection cycle (e.g. by start key on any module).
Receiver is the autosampler.
START
(L) Request to start run / timetable. Receiver is any module
performing runtime controlled activities.
STOP
(L) Request to reach system ready state as soon as possible (e.g.
stop run abort or finish and stop injection). Receiver is any module
performing runtime controlled activities.
The signal level are defined as standard TTL levels (0 V is logic true, + 5 V is
logic false). The remote lines can be input or output (wired or technique).
• Fan-out is 10
• Input Load 2 kOhm against + 5 V
• Outputs are open collector type
48
The REMOTE Connector
To help you make the correct connections the signals carried on each pin are
listed in the table below (the colors refer to wires of remote cable
01046-60201).
Figure 4
APG Remote Connector
Table 7
Remote Signals
Pin
Signal
Active
Color
1
Digital ground
2
Prepare run
LOW
brown
3
Start
LOW
gray
4
Shut down
LOW
blue
5
Reserved
6
Power ON
HIGH
yellow
7
Ready
HIGH
red
8
Stop
LOW
green
9
Start request
LOW
black
white
pink
Remote Configuration
The 1050 Series provides three remote configurations:
HPsystem
Start of automatic operation from any modules’ start key.
Start request is outputted.
GLOBAL
Synchronized start of several modules for a single run.
Start / Stop is outputted.
LOCAL
Single modules’ start. No pulses outputted.
49
Figure 5
Table of line definition
Notes
• Y1 is done by balance key of MWD only.
• Y2 BALANCE on detectors is performed.
• Y3 is not used in the module.
• The remote line SHUT DOWN will always be active.
• The remote line POWER ON will not be processed.
50
Figure 6
Schematic of Remote Control
N OT E
Above schematic is for Pump, Autosampler, MWD and DAD.
The signal level are defined as standard TTL levels
• (0 V is logic true, +5 V is logic false).
• The remote lines can be input or output (wired or technique).
• Fan-out is 10
• Input Load >=2.2 kOhm against + 5 V
51
Figure 7
Board Layout CMP
52
Repair Level: Exchange Board
Table 8
Part Numbers for Firmware Boards
Item
Part Number Exchange
for Pumps (79851/2A/B) on RAD Board
01018-66518 no
for Autosamplers (79855A/B) on VMD Board
01078-66504 no
for Multiple Wavelength Detectors (79854A) on AQB
Board
01048-66504 no
for Diode ArrayDetectors (G1306A) on AQB Board
G1306-66524 no
Firmware Description
Figure 3-7 shows the firmware structure for the 1050 Series of modules
(pump, autosampler, multiple wavelength detector and diode array detector).
As many as possible tasks use the same core firmware and only special
routines for each module are developed seperate (control of the hardware
sensors motors and so on). This common structure gives maximum flexibility
for later development of similar products.
It is obvious that also in the common firmware different commands display
contents method parameters and so on. appear (Dialog, Method Handler,
Parameter Handler). But nevertheless the structure is the same. In each part
of the firmware there exist tables which hold the module specific commands
parameters and so on, which are all handled under the same conditions.
The firmware works with a foreground background mode. All time critical
tasks (timetable execution, sensor and motor information) are working in the
foreground mode and have highest priority. All other tasks share the
remaining time in the background. If there are no tasks running the processor
goes into the idle state.
The firmware per module has approxmiately 300 kByte, where 170 kByte is
Common and 130 kByte module specific).
53
The firmware is located on the module specific firmware board which is
piggy back on the personality board of each module (AQB-, RAD- or
VMD-board) and can be exchanged easily.
Figure 8
Firmware Structure
54
Repair Level: Board or Fuse ICP1
Table 9
Part Numbers for FIP Board
Item
Part Number
used for
FIP Board
5061-3376
pumps, autosampler, MWD amd DAD
Fuse 1 A
2110-0099
The FIP module is located behind the keyboard module of pump,
autosampler and multiple wavelength detector.
The function of the FIP module is to provide an interface between a host
system and the user. Messages can be displayed with up to 32 characters
(2 lines x 16 characters/line). A matrix keyboard is scanned for numeric or
special function input and status information is displayed through 4 LEDs.
The characters are displayed in a 5 x 7 dot matrix.
In case of a dark display, check the on board fuse ICP1 (1 A) which is
soldered in close to the connector P1/P2.
Figure 9
Board Layout FIP
55
External Contacts
External Contacts
The personality boards of the 1050 modules (MWD/DAD: AQB, Pumps: RAD
and Autosampler: VMD) have two external conacts at the rear.
• 1 contact without supply (contact closure) <newline>max. 30 V/250 mA
(fused with 250 mA)
• 1 contact with internal 24 V supply (max. 250 mA output with fuse)
The schematic for all three boards (AQB, NMD and RAD) is in general the
same. Only the values of the components vary from board to board due to
internal specifications.
Figure 10
External Contacts
Table 10
Components of External Contacts
Components
AQB
RAD
VMD
L1, L2, L3, L4
4.7 µH
10 µH
1 µH
C1, C2, C6, C7
100 nF
1 nF
C3, C4, C8, C9
10 nF
10 nF
C5, C10
1 nF
10 nF
Fuse F250 mA (2110-0004)
56
Power Supply (DPS-B / DPS-A)
Repair Level: Fuses and DPS-B / DPS-A
Table 11
Part Numbers for LUC/LPC Board
Item
Part Number
used for
DPS-B (Exchange)
01050-69374
Pumps and Autosamplers
DPS-B (New)
5061-3374
Pumps and Autosamplers
DPS-A (Exchange)
01050-69375
MWD, DAD, VWD
DPS-A (New)
5061-3375
MWD, DAD, VWD
Fuse for 110 V operation 3 A
2110-0003
2110-0002
General Description
The power supply is a primary switching regulated type. It consists of two
parts. the Base Supply and the Lamp Supply. The Base Supply provides
outputs of +5 V, ±19 V, +24 V and +36 V. In addition the Lamp Supply
provides all circuits necessary for the operation of a deuterium lamp.
57
Base Supply (DPS-B)
Figure 11 on page 59 shows the base part of the DPS-A. The line voltage is
rectified filtered and switched with about 50 kHz by a power MOS-FET. The
complete control of frequency and pulsewidth is made by the control
board #1 containing the logic needed and the FET driver.
The isolation between the primary and the secondary part is made by
opto-couplers and the switching transformer. The DC-output voltages are
generated by single-phase rectifiers and LC-filtering with the additional
features: The +36 V output has an separate over-voltage protection to limit
the voltage to +45 V maximum. The +5 V output contains an additional analog
series regulator to provide a stable output for all load conditions under
different applications. The synchronization input is used in the 1050
MWD/DAD only to synchronize the switching frequency to a value of three
times (54 kHz) of the diode array readout frequency. This output is not used
in the other modules.
The power supply status is monitored by the processor system to detect a
powerfail condition and to save all important data. The Power Supply
STATUS LED (GREEN) at the rear panel shows the OK condition of the
power supply.
N OT E
OK means that the pulsewidth of the switching FET is inside the allowed
limits. OK does not means that all voltages at the output are present (for
example a broken inductor is not detected).
58
Figure 11
Block Diagram DPS-B (Base Supply)
59
Lamp Supply (DPS-A)
Figure 12 on page 61 and Figure 13 on page 62 show the additional circuits
necessary for the deuterium lamp:
• a DC output of 5.5 V for the regulated heater output (located on the
primary board);
• a regulated constant current source with selectable current of 320 mA,
360 mA or 400 mA;
• a 600 V lamp ignition circuit;
• a 12 V regulated output for future use.
WA R N I N G
Hazardous voltage present at the output connector with instrument
power cord connected to AC line.
The main feature of this power supply is a low noise current source for the
deuterium lamp. For realization a pulse-width modulated DC-DC converter
(36 V input, 170 V no load output) is built-up with a switching FET and high
voltage transformer. The pulse-width is regulated so that the DC-output is
about 12V above the actual anode voltage of the deuterium lamp.
This design allows minimum power loss if the anode voltage varies from
lamp to lamp and by aging between 65 V and 100 V. The final regulation to the
selected current is made by an analog power regulator. Again the switching
frequency is synchronized to 54 kHz in the 1050 MWD/DAD.
60
Figure 12
Block Diagram DPS-A (Lamp Supply I)
61
Figure 13
Block Diagram DPS-A (Lamp Supply II)
62
Lamp Ignition
To ignite the deuterium lamp a 0.5 µF capacitor loaded with 600 V is
discharged via a 10 kOhm resistor to the anode. These 600 V are generated by
a separate winding.
The lamp status output signal shows "OK" if the lamp current has the selected
value. Otherwise an error message is generated.
The heater output made by a series regulator is in the pre-heating status 2.5 V
always. After ignition a different output voltage is selected depending on the
lamp type used:
In the 79853C VWD, 79854A MWD and the G1306A DAD, the heater is
switched off after ignition.
The 12 V low noise output is made by a series regulator connected to the
+19 V output.
63
Repair Level: Exchange Board
Table 12
N OT E
Part Numbers for CRB Board
Item
Part Number
used for
CIB Board (NEW)
5061-3382
Pumps and Autosampler
CRB Board (NEW)
5062-2482
79854A MWD / G1306A DAD
This section describes the communication interface for the 1050 Pumps
(79851/2A/B), Autosamplers (79855A/B), Multiple Wavelength Detectors
(79854A) and Diode Array Detector (G1306A) only.
The communication interface for the 1050 Variable Wavelength Detector
(79853C) is described in the chapter of the 1050 VW Detector.
The communication interface board is necessary for the control by a
Personal Computer and to connect printer or plotter devices. The
communication interface board provides one GPIB and one RS-232 interface.
The CRB for the 1050 MWD/DAD has a 96 kbyte runbuffer for the
data/spectrum operation with the Multiple Wavelength Detector. The
interface is located in Slot #2 of the module.
64
Compatibilities
Table 13
CIB/CRB Compatibility
Instrument
CIB
CRB
Firmware
1050 Pump
R
P
REV 3.1
1050 Sampler
R
P
REV 3.1
1050 MWD
C
R
REV 3.1
1050 DAD
C
R
REV 1.0
R
recommended configuration
P
possible but not neccessary
C
only for instrument control
Firmware
To use the communication interface board it is mendatory to have the 1050
Modules equipped with the latest firmware revisions (see Table 13).
Baud rate
The board contains a baudrate generator. The baudrate is setable up to
19200 baud from the keyboard. The transmitter and receiver baudrate are
independent adjustable.
RS-232 Interface
The implemented serial interface is a subset of the RS-232 standard only. It
contains at
PIN 2
RxD receive data (data input)
PIN 3
TxD transmit data (data output)
PIN 4
GND (Ground)
The 1050 modules are designed as DCE (data communication equipment)
without hardware handshake.
65
66
3
3
Common: Cable Information
This chapter provides information on cables for
the 1050 Modules
Overview
The 1050 Modules provide
• Analog Signal Output (Pumps, Detectors)
• Remote Control Connector (all)
• BCD Connector (Autosampler)
WA R N I N G
Never use cables other than the ones supplied by Agilent Technologies
to ensure proper functionality and compliance with safety or EMC
regulations.
68
Overview
Table 14
Cables Overview
Type
Description
Part Number
Analog
cables
3390/2/3 integrators
01040-60101
3394/6 integrators, 35900A A/D converter
35900-60750
General purpose (spade lugs)
01046-60105
3390 integrator
01046-60203
3392/3 integrators
01046-60206
3394 integrator
01046-60210
3396A (Series I) integrator
03394-60600
Remote
cables
3396 Series II / 3395A integrator, see page 74
BCD
cables
GP-IB
cable
3396 Series III / 3395B/96C/97A integrator
03396-61010
1100 / 1050 modules / 1046A FLD / 35900A A/D
converter
5061-3378
1040 DAD / 1090 liquid chromatographs / SDM
01046-60202
3392/3 integrators
obsolete
3396 integrator
03396-60560
General purpose (spade lugs)
18594-60520
1100 module to ChemStation, 1 m
10833A
10833B
10833D
69
Analog Cables
Analog Cables
One end of these cables provides a BNC connector to be connected to 1050
Series modules. The other end depends on the instrument to which
connection is being made.
1050 to 3390/2/3 Integrators
Connector
01040-60101
Pin
3390/2/3
Pin
1050
Signal Name
1
Shield
Ground
2
3
Not connected
Center
4
5
Signal +
Connected to pin 6
Shield
Analog -
6
Connected to pin 4
7
Key
8
Not connected
1050 to 3394/6 Integrators
Connector
35900-60750
Pin
3394/6
Pin
1050
1
70
Signal Name
Not connected
2
Shield
Analog -
3
Center
Analog +
Analog Cables
1050 to BNC Connector
Connector
8120-1840
Pin
BNC
Pin
1050
Signal Name
Shield
Shield
Analog -
Center
Center
Analog +
Pin
1050
Signal Name
1050 to General Purpose
Connector
01046-60105
Pin
3394/6
1
Not connected
2
Black
Analog -
3
Red
Analog +
71
Remote Cables
Remote Cables
One end of these cables provides a Agilent Technologies APG (Analytical
Products Group) remote connector to be connected to 1050 Series modules.
The other end depends on the instrument to be connected to.
1050 to 3390 Integrators
Connector
01046-60203
72
Pin
3390
Pin
1050
Signal Name
Active
(TTL)
2
1 - White
Digital ground
NC
2 - Brown
Prepare run
Low
7
3 - Gray
Start
Low
NC
4 - Blue
Shut down
Low
NC
5 - Pink
Not connected
NC
6 - Yellow
Power on
High
NC
7 - Red
Ready
High
NC
8 - Green
Stop
Low
NC
9 - Black
Start request
Low
Remote Cables
1050 to 3392/3 Integrators
Connector
01046-60206
4 - Key
Pin
3392/3
Pin
1050
Signal Name
Active
(TTL)
3
1 - White
Digital ground
NC
2 - Brown
Prepare run
Low
11
3 - Gray
Start
Low
NC
4 - Blue
Shut down
Low
NC
5 - Pink
Not connected
NC
6 - Yellow
Power on
High
9
7 - Red
Ready
High
1
8 - Green
Stop
Low
NC
9 - Black
Start request
Low
Pin
3394
Pin
1050
Signal Name
Active
(TTL)
9
1 - White
Digital ground
NC
2 - Brown
Prepare run
Low
3
3 - Gray
Start
Low
NC
4 - Blue
Shut down
Low
NC
5 - Pink
Not connected
NC
6 - Yellow
Power on
High
5,14
7 - Red
Ready
High
6
8 - Green
Stop
Low
1
9 - Black
Start request
Low
Connector
01046-60210
13, 15
N OT E
Not connected
START and STOP are connected via diodes to pin 3 of the the 3394 connector.
73
Remote Cables
1050 to 3396A Integrators
Connector
03394-60600
Pin
3394
Pin
1050
Signal Name
9
1 - White
Digital ground
NC
2 - Brown
Prepare run
Low
3
3 - Gray
Start
Low
NC
4 - Blue
Shut down
Low
NC
5 - Pink
Not connected
NC
6 - Yellow
Power on
High
5,14
7 - Red
Ready
High
1
8 - Green
Stop
Low
NC
9 - Black
Start request
Low
13, 15
Active
(TTL)
Not connected
1050 to 3396 Series II / 3395A Integrators
Use the cable 03394-60600 and cut pin #5 on the integrator side. Otherwise
the integrator prints START; not ready.
74
Remote Cables
1050 to 3396 Series III / 3395B Integrators
Connector
03396-61010
Pin
33XX
Pin
1050
Signal Name
9
1 - White
Digital ground
NC
2 - Brown
Prepare run
Low
3
3 - Gray
Start
Low
NC
4 - Blue
Shut down
Low
NC
5 - Pink
Not connected
NC
6 - Yellow
Power on
High
14
7 - Red
Ready
High
4
8 - Green
Stop
Low
NC
9 - Black
Start request
Low
13, 15
Active
(TTL)
Not connected
1050 to 1050, 1046A or 35900 A/D Converters
Connector
5061-3378
Pin
1050 / …
Pin
1050
Signal Name
1 - White
1 - White
Digital ground
2 - Brown
2 - Brown
Prepare run
Low
3 - Gray
3 - Gray
Start
Low
4 - Blue
4 - Blue
Shut down
Low
5 - Pink
5 - Pink
Not connected
6 - Yellow
6 - Yellow
Power on
High
7 - Red
7 - Red
Ready
High
8 - Green
8 - Green
Stop
Low
9 - Black
9 - Black
Start request
Low
Active
(TTL)
75
Remote Cables
1050 to 1090 LC, 1040 DAD or Signal Distribution Module
Connector
01046-60202
5 - Key
Pin
1090
Pin
1050
Active
Signal Name (TTL)
1
1 - White
Digital ground
NC
2 - Brown
Prepare run
Low
4
3 - Gray
Start
Low
7
4 - Blue
Shut down
Low
8
5 - Pink
Not connected
NC
6 - Yellow
Power on
High
3
7 - Red
Ready
High
6
8 - Green
Stop
Low
NC
9 - Black
Start request
Low
Pin
1050
Signal Name
Active
(TTL)
1 - White
Digital ground
2 - Brown
Prepare run
Low
3 - Gray
Start
Low
4 - Blue
Shut down
Low
5 - Pink
Not connected
6 - Yellow
Power on
High
7 - Red
Ready
High
8 - Green
Stop
Low
9 - Black
Start request
Low
Connector
01046-60201
76
Pin
Universal
BCD Cables
BCD Cables
One end of these cables provides a 15-pin BCD connector to be connected to
the 1050 Series modules. The other end depends on the instrument to be
connected to.
1050 to 3392/3 Integrators (Obsolete)
Connector
18584-60510
6 - Key
Pin
3392/3
Pin
1050
Signal Name
BCD Digit
10
1
BCD 5
20
11
2
BCD 7
80
3
3
BCD 6
40
9
4
BCD 4
10
7
5
BCD 0
1
5
6
BCD 3
8
12
7
BCD 2
4
4
8
BCD 1
2
1
9
Digital ground
2
15
+5V
Low
77
BCD Cables
Connector
03396-60560
Pin
3392/3
Pin
1050
Signal Name
BCD Digit
1
1
BCD 5
20
2
2
BCD 7
80
3
3
BCD 6
40
4
4
BCD 4
10
5
5
BCD 0
1
6
6
BCD 3
8
7
7
BCD 2
4
8
8
BCD 1
2
9
9
Digital ground
NC
15
+5V
Low
Wire Color
Pin
1050
Signal Name
BCD Digit
Green
1
BCD 5
20
Violet
2
BCD 7
80
Blue
3
BCD 6
40
Yellow
4
BCD 4
10
Black
5
BCD 0
1
Orange
6
BCD 3
8
Red
7
BCD 2
4
Brown
8
BCD 1
2
Gray
9
Digital ground
White
15
+5 Vt
Connector
18594-60520
78
Low
In This Book
This manual contains technical
information about the Agilent 1050
liquid chromatographs.
This manual is available as electronic
version (Adobe Acrobat Reader file)
only.
1050 Series of HPLC
Modules
Service Handbook Pumps (79851A/79852A/B)
Technologies 2001
allowed under the
copyright laws.
Part No. NONE
11/2001
Printed in Germany
Warranty
IMPORTANT NOTE
The information
contained in this
01050-90102 edition 4
(1995) and G1306-90102
this material,
including, but not
warranties or
merchantability and
purpose.
76337 Waldbronn
Germany
information (79854A
went out of support
during 2000).
Contact your local
case of part number
issues or upgrades.
web page
www.agilent.com.
4
4
Pumps: General Information
the 1050 Pumps
Introduction
This chapter gives general information on
• about this pump
• repair policy
• product structure
• capillaries
• specifications
About this Manual
This manual provides service information about the 1050 Pumps (isocratic
and quaternary). The following sections give the detailed descriptions of all
electronic and mechanical assemblies. You will find illustrated
part-breakdowns interconnection tables connector configurations as well as
all necessary replacement procedures in this manual. Detailed diagnostic
procedures using firmware resident test methods and error messages are
also given in this manual.
84
About the Pumps
About the Pumps
The 1050 Pump modules houses the mechanical devices and the electronic
circuitry for either the isocratic or quaternary module which control the
various functions of the flow system. The module is controlled via the user
interface through which the operator defines his requirements
(flow-composition and so on) and which provides the required analytical
information.
Repair Policy
The 1050 Pumps are designed that all components are easy accessible
Customers are able to repair certain parts of the 1050 Pumps see Operator’s
Handbook.
For details on repair policy refer to “Repair Policy” on page 38.
85
Product Structure
Product Structure
The 1050 Series of HPLC modules are available in two versions. In the
standard version most of the parts used are stainless steel.
In the 1050 Ti Series the flow path of the quaternary pump consists solely of
corrosion resistant materials such as titanium, tantalum, quartz, sapphire,
ruby, ceramic and fluorocarbon polymers. It is recommended for use with
mobile phases containing high salt concentrations, extreme pH solutions and
other aggressive mobile phases.
N OT E
Isocratic Pump
79851A
Quaternary Pump
79852A
Ti - Quaternary Pump
79852B
The isocratic pump was also introduced as Ti - version (79851B) but due to the
insufficient orders it became obsolete end of FY 91.
86
Capillaries
Capillaries
In the 1050 Pumps the capillary shipped with the module will have a plastic
color coating for identification in terms of material and internal diameter.
All capillaries before the injector have a internal diameter of 0.25 mm. From
the injector the internal diameter is reduced to 0.17 mm.
Table 15
Capillary Color Code
color
Internal Diameter
blue
0.25 mm
green
0.17 mm
red
0.12 mm
white
N OT E
Material
tantalum
For the Ti pumps the fittings are always titanium with a titanium nitrite
coating and the front and back ferrules are gold plated.
The Ti capillaries have two color coatings. One for identifying the material
covering the main part of the capillary and a small one for the internal
diameter.
87
Specifications
Specifications
Table 16
Specifications of 1050 Pumps
Hydraulic System
Dual-pistons in-series with proprietary servo-controlled
variable stroke drive floating pistons and active inlet
valve.
Flow Range
Setpoint from 0.001 to 9.999 ml/min in 0.001 ml/min
increments.
Piston Displacement
20 to 100 µl, automatic matched to flow rate or
user-selectable.
Flow Precision
<0.3% RSD (typically <0.15%) based on retention time at
0.5 ml/min and 2.5 ml/min.
Pressure
Operating range from 0-400 bar (5880 psi) up to 5 ml/min;
from 0-200 bar (2950 psi) up to 10 ml/min. Display in bar,
psi or MPa.
Pressure Pulsation
<2% amplitude (typically <1%), 1 ml/min isopropanol at
all pressures >10 bar.
Compressibility Compensation User-selectable, based on mobile phase compressibility.
Recommended pH Range
2.3 to 12.5 (stainless steel version). Solvents with pH
below 2.3 should not contain acids which attack stainless
steel. 1.0 to 14 (TI series).
Gradient Formation
Low pressure quaternary mixing/gradient capability using
proprietary high-speed proportioning valve. Delay Volume
900 to 1100 µl dependent on back pressure.
Composition Range
0 to 100% in 0.1% increments from four independent
channels.
Composition Precision
±0.25% absolute (typically ±0.15%) peak to peak, binary
mixed water/acetonitrile from 0.5 ml/min to 5.0 ml/min
without mixer.
Solvent Preparation
Four 1 liter bottles each with individually-regulated
helium sparger, cap and filter.
88
Specifications
Table 16
Oven Temperature Range
Ambient +5°C to ambient +60°C in 0.1°C
increments.Display in °C, °F or K.
Oven Temperature Stability
±0.15°C
Oven Capacity
Two 25-cm or three 20-cm columns.
Control
Integrated keyboard with function keys; parameter editing
during run possible; keyboard lock; optional control by PC.
Parameters
Flow rate, compressibility, stroke volume, upper and
lower pressure limits, 2 external contacts; %B, %C, %D
(for quaternary pump). Time-programmable Parameters:
Flow rate, upper pressure limit, external contacts; %B,
%C, %D.
Methods
Battery-backed storage of up to 10 methods. Automatic
start up and shut down methods. Editing of stored
methods possible in run.
Analog Output
For pressure monitoring, 2 mV/bar.
Communications
Outputs: ready signal and two external outputs (one 24 V
relay and one 30V (AC/DC) contact closure, both with 0.25
A. In-and outputs: start, stop and shut down signals.
Optional interface for GPIB and RS-232C.
Safety Aids
Extensive diagnostics, error detection and display via
front-panel LED's and status logbook. User-definable
shutdown method activated in case of error. Leak
detection and safe leak handling. Low voltages in major
maintenance areas. Column pressure protection with
maximum rate of pressure change of <20 bar/sec after a
setpoint change.
Environment
4°C to 55°C (constant temperature) with <95% humidity
(non-condensing).
Power Requirements
Line voltage: 100-120 or 220-240 VAC ±10%
Line frequency: 48-66 Hz
Power consumption: 120 VA max.
89
Specifications
Table 16
Dimensions
Height: 208 mm (8.2 in)
Width: 325 mm (12.8 in)
Depth: 560 mm (22.0 in)
For complete description of test conditions used to obtain specifications, see
Owner’s Manual.
90
5
5
Pumps: Hardware Information
This chapter provides hardware information
about the 1050 Pumps
This chapter gives general and technical information about the hardware
components of the 1050 Pumps.
• Solvent Cabinet
• Pump Hardware
❏ Multi Channel Gradient Valve (MCGV)
❏ Metering Drive Assembly
❏ Pump Head Assembly
❏ Continuous Seal Wash
❏ Active Inlet Valve
❏ Outlet Ball Valve
❏ Frit Adapter Assembly
❏ Purge Valve
❏ High Pressure Damper
• Column Holder
92
Overview
Overview
The 1050 Pump is based on a dual piston series design which comprises all
essential functions a solvent delivery system has to fulfill. Metering of solvent
and delivery to the high pressure side are performed by one metering
assembly which can generate pressure up to 400 bar.
The basic system (isocratic) comprises the metering assembly including an
active inlet valve, an outlet valve, a frit adapter assembly and a damping unit.
The gradient operation system includes a highs peed proportioning valve
allowing quaternary operation and a solvent cabinet with separate Helium
degassing for each solvent channel.
Since the introduction of the G1303A Online Degasser (December 1,1991) the
Helium degassing might be replaced by the degasser module.
A purge valve is installed on the pump head for convenient priming of the
pump.
An continuous seal wash is available when the pump is used with buffer
solutions. It is mandatory in the Ti - pump and can be ordered as an option
for the standard version.
The solvent cabinet for the 1050 Pumps can be equipped with a manual
injection valve and a column heater.
93
Overview
Figure 14
Overview Pump System
94
How does the Pump Work?
How does the Pump Work?
The metering assembly comprises two substantially identical piston pump
units. Both pump units comprise a ball screw drive and a pump head with a
sapphire piston for reciprocating movement in it. The servo controlled
variable reluctance motor drives the two ball drive screws in opposite
direction. The gears for the ball screw drives have different circumferences
(ratio 2:1) allowing the first piston to move double the stroke length of the
second piston. The solvent enters the pump heads close to the bottom limit
and leaves it at its top. The outer diameter of the piston is smaller than the
inner diameter of the pump head chamber allowing the solvent to fill the gap
in between. The first piston has a stroke volume in the range of 20 µl to 100 µl
depending on the flow rate. The microprocessor controls all flow rates in a
range of 1 µl to 10 ml.
The inlet of the first pumping unit is connected to the active inlet valve which
is processor controlled opened or closed allowing solvent to be sucked into
the first pump unit. The outlet of the first pump unit is connected via the
outlet ball valve and the damping unit to the inlet of the second pump unit.
The outlet of the metering assembly is than connected to the following
chromatographic system.
Isocratic Operation
When turned on the pump runs through a initialization procedure to
determine the upper dead center of the first piston. The first piston moves
slowly upwards into the mechanical stop of the pump head and from there it
moves back a predetermined path length. The controller stores this piston
position in memory. After this initialization the pump starts operation with
the set parameters. The active inlet valve is opened and the down moving
piston draws solvent into the first pump head. At the same time the second
piston is moving upwards delivering into the system. After a controller
defined stroke length (depending on the flow rate) the drive motor is stopped
and the active inlet valve is closed. The motor direction is reversed and
moves the first piston up until it reaches the stored upper limit and at the
same time moving the second piston downwards. Then the sequence starts
again moving the pistons up and down between the two limits.
95
Overview of the Electronics
During the up movement of the first piston the solvent in the pump head is
pressed through the outlet ball valve and the damping unit into the second
pumping unit. The second piston draws in half of the volume displaced by the
first piston and the remaining half volume is directly delivered into the
system.
During the drawing stroke of the first piston the second piston delivers the
drawn volume into the system.
Gradient Operation
For gradient operation the multi channel gradient valve (MCGV) connected
to solvent containers A, B, C and D is required. The controller makes sure
that each intake stroke of the first piston contains the required solvent
composition. The controller divides the length of the intake stroke in certain
fractions in which the MCGV connects the specified solvent channel to the
pump input.
The figure 2-2 shows the block diagram of the 1050 Pumps including all
currently available options.
The common main processor (CMP) controls all functions of the modules.
The controller firmware is attached to the relative A/D converter board
(RAD).
The column heater can be installed into the solvent cabinet. The electronic
control is done via the pump module. Two different boards will be available
for supporting the column heater in either the isocratic pump (79851A) or the
quaternary pump (79852A/B).
For the quaternary pump (79852A/B) the heater quaternary board (HRQ)
controls the column heater and drives the multi channel gradient valve
(MCGV).
For the isocratic pump (79851A) the heater isocratic board (HRI) controls
only the column heater. The HRI board is a subtract of the HRQ Board; the
blank board is identical but the components for the gradient operation are
not mounted.
96
The communication interface board (CIB) provides an GPIB and RS232C
interface. With the CIB installed the pump can be controlled via the
ChemStation or via the 3396B integrator.
Figure 15
Block Diagram 1050 Pumps
97
Overview of the Flow Path
Overview of the Flow Path
From the bottle head assembly (tube #1) the solvent moves via the gradient
valve (MCGV), the connection tube #2 and the active inlet valve into the
pump. From the outlet ball valve the capillary #3 is connected to the damper
and from there the solvent streams back to the second piston chamber
(capillary #4). The standard interface capillary #5 (70 cm long 0.25 mm ID)
connects the pump to the next module (for example the autosampler).
In the isocratic pump the solvent sucking tube #2 is directly connected to the
solvent bottle and the interface capillary (#5) is connected to the frit adapter.
In the quaternary pump the interface capillary (#5) is connected to a purge
valve.
The purge valve allows convenient priming of the system. When opened the
flow is directed via tubing (#7) in to the waste.
The typical delay volume for the pump is in the range 900 to 1100 µl
(depending on system back pressure).
If the seal wash accessory is installed the wash bottle on top of the
instrument (tube #6) is connected to the two support rings for back flushing
of the piston seals. From the second support ring the wash solvent flows into
the collecting vessel.
Figure 16
Hydraulic Path
98
Solvent Cabinet
Solvent Cabinet
Repair Level: Component
Table 17
Product Numbers for Solvent Cabinet
Item
Part Number
Solvent Cabinet
79856A
Ti - Solvent Cabinet
79856B
The solvent cabinet allows storage of 4 four 1 liter solvent bottles. It is
designed to hold the following options:
• Helium degassing; later it was replaced by 1050 online degassing
• Manual injection valve
• Column Heater
• Manual injection valve and column heater
Helium Degassing
N OT E
For low pressure mixing degassing is a must. Therefore the Helium degassing
or the Online Degasser G1303A is mandatory for the quaternary pump.
If the Helium degassing is selected a internal tubing guides the Helium from
the back of the solvent cabinet to an on/off valve and from there to four
regulators. Each of the regulator supplies helium to one bottle head assembly
for separate sparging of each bottle. The bottle head assembly consists of a
sintered glass sparger, stainless steel or titanium filter and a cap with vent
position. It is designed for the provided standard bottle, but allows also
operation with supply bottles from certain vendors. The bottle head assembly
has also a connection for a fume hood tubing (see also “Helium Degassing
Principle” on page 269).
99
Solvent Cabinet
N OT E
The connected helium pressure has to be in the range 2 to 4 bar (30 to 60 psi).
With pressures below 2 bar the helium degassing system may not work
correctly. Pressure above 4 bar might damage the helium regulators.
If ordered with manual injection valve a Rheodyne 7125 valve with 20 µl loop
will be installed in the solvent cabinet. If ordered as a Ti version a Rheodyne
7125 titanium valve with Tefzel rotor seal will be present in the cabinet. A
remote-start output is available at the back of the cabinet.
Column Heater
The column heater fits into the recess of the cabinet. Electronic control is
done via the pump module. The column heater can hold up to 25 cm long
columns. The flow path of the column heater is stainless steel even in the Ti version.
The heater uses a heating foil which is attached to a aluminum heating block
where the solvent capillaries are leading through (heat exchanger). The
column rests in the U-shaped heat exchanger. When turned on, the heat
exchanger will heat up the solvent, the column and the surrounding air in the
compartment.
Temperature is monitored on the heating block via a Pt. 100. A multi (3) color
LED shows the actual status of the column heater. The power consumption
of the heater is reduced by heat recycling. Incoming and outgoing capillaries
of the heat exchanger are in close thermal contact allowing radial heat
exchange while the solvent is streaming through.
100
Solvent Cabinet
Figure 17
Solvent Cabinet including all options
101
Repair Level: Exchange Assembly
Table 18
Part Numbers MCGV
Item
Part Number
Exchange
MCGV
79835-67701
79835-69701
Ti - MCGV
01019-67701
The multi channel gradient valve (MCGV) works like a multi position switch.
Depending on the timing of the control electronic the Heater Quaternary
Board (HRQ) activates one of the four solenoids connecting the selected
channel to the output of the valve.
In the Ti-version of the gradient valve only the materials have been changed.
Table 19
Technical Data of MCGV
Switching Time:
approximately 2 ms
Solenoid Voltage:
+12 V (+36 V Chopper Drive)
Ti Series
Materials in contact with solvent:
Figure 18
PFA, PTFE, sapphire, ruby, ceramic, Titanium
MCGV
102
Metering Drive Assembly
Repair Level: Exchange Assembly
Table 20
Part Numbers Metering Drive Assembly
Item
Part Number
Exchange
01018-60001
01018-69100
The metering drive assembly is identical for the stainless steel and the Ti
version. The metering pump system is driven by a variable reluctance motor
(servo) and electrically controlled by the Pump Drive Control Board (PDC).
Feedback about actual movement is sensed by a shaft encoder mounted on
top of the motor. In order to achieve required flow resolution a gear is used
to transmit motor movement to the two pistons. The gears for the ball screw
drives have different circumferences (ratio 2:1) allowing the first piston a
twice as large stroke volume as the second piston. The second piston
operates with a fixed 180° difference relative to the first piston. A sensor on
the motor surface checks for over temperature conditions (90°C).
Table 21
Figure 19
Technical Data of Metering Drive
Resolution of mechanical system:
6.6 nl/steps of Encoder
Resolution of Encoder:
0.25 degree
Lowest Frequencies:
2.5 Hz
Highest Frequencies:
25 KHz
Number of steps between piston extension limits:
8191
103
Pump Head Assembly
Pump Head Assembly
Table 22
Part Numbers Pump Head Assembly
Item
Part Number
Pump Head Assembly
01018-60004
Ti - Pump Head Assembly
01019-60002
Two identical piston move inside the solvent filled chamber in the pump head
assembly. The piston are ball loaded on the spindles and center itself in the
seal. The built in spring prevents clearances of the plunger affecting flow
accuracy (see also “Pump Head Assembly” on page 271).
Table 23
Technical Data of Pump Head
Maximum displacement volume:
108 µl
Ti - Series
Materials in contact with solvents
Figure 20
titanium, gold, sapphire, ceramic
Pump Head Assembly
104
Continuous Seal Wash
Table 24
Part Numbers Seal Wash
Item
Part Number
Seal Wash Kit
01018-68722
Velocity regulator 3/pk
5062-2486
Bioscience application do very often use high concentrated buffer solutions.
Therefore the seal wash is installed in each Ti pump. For the stainless steel
version it is available as an option and should be used when buffer solutions
are used in the instrument. If high buffer concentration are used in the pump
the continuous seal wash will maintain the life time of the pump seal. Buffer
solutions below 0.1mol normally do not require the seal wash option.
The option is customer installable.
The option consists of a support ring (1) a secondary seal (2) and a gasket (3)
for both piston sides. A wash bottle filled with water/isopropanol (90/10) will
be placed above the pump module and gravity will maintain a flow through
the pump head removing all possible buffer crystals from the back of the
pump seal.
N OT E
Running dry is the worst case for a seal and drastically reduces the life time of
it. Therefore the tubings of the wash option should always be filled with
solvent to maintain the life time of the wash seal. Use always a mixture of
distilled water (90%) and isopropanol (10%) as wash solvent. The mixture
prevents bacteria growth in the wash bottle and reduces also the surface
tension of the water. The flow rate should be regulated to approximately
20 drops/minute (velocity regulator 5062-2486).
105
Figure 21
106
Active Inlet Valve
Active Inlet Valve
Repair Level: Assembly
Table 25
Part Numbers Active Inlet Valve
Item
Part Number
Active Inlet Valve
01018-60010
Ti - Active Inlet Valve
01019-60010
The active inlet valve is a solenoid driven check valve. In the Ti version all
parts in contact with solvents are corrosion resistant. The solenoid is
controlled by the Pump Drive Control Board (PDC). A spring loaded ruby ball
sitting in a sapphire seat closes or opens the flow path. If the solenoid is
deactivated the keeper of the magnet presses the ruby ball down opening the
flow path. At the same time the down moving first piston draws solvent into
the pump head. The activated solenoid enables the spring to press the ruby
ball in its seat and the flow path is blocked. Older versions do have a solvent
protection cover installed.
Table 26
Ti - Series
Figure 22
titanium, gold, sapphire, ceramic,
Active Inlet Valve
107
Outlet Ball Valve
Outlet Ball Valve
Repair Level: Assembly
Table 27
Part Numbers Outlet Ball Valve
Item
Part Number
Outlet Ball Valve
G1311-60012
The outlet ball valve is made of corrosion resistant materials and can be used
in both pump versions. The outlet valve cartridge contains two seat / ball
pairs with the necessary seals. A slight weight on top of each ball limits the
movement of the ball and maintains a small delay volume. The cartridge (3) is
fixed with adhesive and the valve will be damaged if opened. The valve
should always be tightened at the housing screw (2) and never at the
cartridge (3) itself.
Table 28
Ti - Series
Figure 23
titanium, gold, ruby, sapphire
Outlet Ball Valve
108
Frit Adapter Assembly
!Repair Level: Component
Table 29
Part Numbers Seal Wash
Item
Part Number
01018-60007
The housing of the frit adapter assembly is made from titanium and is
suitable for both pump versions. The frit adapter assembly is installed in each
isocratic pump. It is the interface to the following system components (for
example autosampler) and holds a PTFE frit. The capacity of the frit when
installed correctly is large enough to collect all the particles during the
normal life time of the piston seal. It is recommended to replace the frit each
time the seal has to be replaced as part of the normal pump maintenance. The
second criteria for replacing the frit is the pressure across over it. If the
pressure drop is more then approximately 10 bar with 5ml/min H2O the frit
should be changed.
Table 30
Ti - Series
Figure 24
Titanium, PTFE, gold
109
Purge Valve
Purge Valve
Repair Level:Assembly except of PTFE frit and gold seal (item 1 to 3)
Table 31
Part Numbers Purge Valve
Item
Part Number
Purge Valve (replacement)
G1311-60009
Purge Valve Update Kit
01018-68723
The purge valve was introduced in November 1990. The purge valve is made
from corrosion resistant materials and is suitable for both pump versions.
The purge valve will be installed on all quaternary pumps and can be ordered
as an option to the isocratic pump. The lower part of the purge valve is
designed like the frit adapter assembly and holds the PTFE frit. A ball seat
combination builds the purge valve. When opened at the thumb screw the
ball is lifted out of its seat allowing the solvent to flow through the waste
outlet. When the thumbscrew is turned down the internal springs press the
ball into the seat. Flow is directed to the following system components.
Table 32
Ti - Series
Figure 25
Titanium, PTFE, gold, ceramic
Purge Valve Assembly
110
High Pressure Damper
Repair Level:Assembly
Table 33
Part Numbers High Pressure Damper
Item
Part Number
Damper
79835-60005
Ti - Damper
01019-60005
For the Ti version of the high pressure damper all parts which are in contact
with solvents are gold plated. Two functions are obtained from the High
Pressure Damper. Flow is damped (flow ripple reduction) and the pressure in
the system is measured. The damping function is provided by an aluminum
housing partly filled with water as the compressible medium and a solid steel
block (3) which compensates for different coefficients of expansion of water
and the aluminum housing. A protection plate (2) mounted between cover
and housing prevents membrane (1) damage resulting from pressure excess
or pressure shocks. Pressure is measured with a pressure transducer. The
electrical circuit that outputs a voltage proportional to the pressure
measured is mounted directly to the pressure transducer.
Table 34
Ti - Series
Figure 26
gold
111
Column Holder
Column Holder
Repair Level:Assembly
Table 35
Part Numbers High Pressure Damper
Item
Part Number
Column Holder Assembly
5062-2469
The column holder is standard for the 1050 Ti Pumps. It is designed for use
with any of the 1050 Series modules either separately or in a stack. A 1050
module will fit onto the column holder base (1) and the stand (2) can be used
to attach columns which do not fit into the solvent module compartment
using the clamp (3). Possible leaks will be collected in the groove (5). The
support block (4) maintains the correct height adjustment of the autosampler
foot support (100 vial tray).
WA R N I N G
The column holder is not intended for use with solvents which are
flammable or toxic. If such solvents are used you must use a leak tray
or equivalent. You must also position the column so that any leaking
solvent is collected by the leak tray.
Figure 27
Column Holder
112
6
6
Pumps: Electronic Information
This chapter provides electronic information
• This chapter gives information about the electronic of the pumps:
• Overview
• Pump Drive Control Board (PDC)
• Relative A/D Converter Board (RAD)
• Firmware Board (SWF)
• Heater Isocratic Board (HRI)
• Heater Quaternary Board (HRQ)
• High Pressure Transducer Board (HPT)
• Connector Board (CON)
• Pump Motherboard (HPS)
114
Overview
Overview
All electronic boards (except the FIP, behind the keyboard and the CON,
above the MCGV) are located in the rear part of the module and they are
connected to the Motherboard (HPS). Excess to the boards is from the back
of the instrument. Slot numbers for the boards (as shown in the status
screen) are counted from left to right. The power supply board is located in
slot 1 and the common main processor is located in slot 7.
In the 1050 pumps the following electronic assemblies are available:
Table 36
N OT E
Electronic Boards
Description
Part Number
Exchange
5061-3374
01050-69374
5061-3380
01050-69580
Pump Drive Control (PDC2)
01018-66532
Relative A/D Converter (RAD)
01018-66503
Firmware Board (SFW)
01018-66506
Heater Isocratic Board (HRI)
01018-66517
Heater Quaternary Board (HRQ)
01018-66518
Connector Board (CON)
01018-66505
Motherboard (HPS)
01018-66501
5061-3376
5061-2482
01018-69503
01018-69518
For information about Power Supply, Common Processor and Fluorescent
Interface refer to “Common: Electronic Information” on page 39.
115
Overview
Figure 28
Rear of 1050 Pumps
116
Overview
Figure 29
Block Diagram 1050 Pumps
117
Pump Drive Control Board (PDC2)
Repair Level: Board, Fuses and U78, U79
Table 37
Part Numbers for ASC Board
Item
Part Number
PDC2
01018-66532
PDC
replaced by PDC2
Fuse: F16 (PDC), F481 (PDC2) 1.5 A
2110-0304
Fuse F891, F892 (PDC); F112, F113 (PDC2)
on board 500 mA
2110-0934
U78 (MC78L15ACP)
1826-0274
U79 (MC79L15ACP)
1826-0281
The main functions of the PDC board are the control of the pump motor and
the active inlet valve.
For the quaternary system the PDC board has also to generate the control
signals for the gradient valve circuit on the Heater Quaternary Board (HRQ).
The PDC2 board succeeds the PDC board. For standardization and cost
reduction reasons part of the circuit has been implemented in ASIC
(Application Specific Integrated Circuit). The board size was reduced the
board is also used in the other APG products and a stainless steel plate
extends the board to 1050 board size.
Fuses
Fuse F16 (PDC) or F481 (PDC2) (1.5 A) protects the +36 V for servo motor
and active inlet valve for overcurrent conditions on the old PDC board. F891
(PDC) or F113 (PDC2) (500 mA) protects the active inlet valve for
overcurrent conditions while F892 (PDC) or F112 (PDC2) is for future use
(space for additional connector on CON board).
118
Figure 30
Block Diagram PDC2 Board
119
U78, U79
PDC Boards revision A need an replacement of U78 and U79 when the
metering drive (01018-69100) of the instrument has to be changed.
Clock Generator
The clock generator provides the clocks for the different pump boards. The
pump control chip needs the 2 MHz clock and the pump control logic on the
Relative A/D Board (RAD) and the Gradient Valve Driver Board (GVD) need
the 1 MHz clock.
Filter and Logic
The filter and logic circuit disables the operation of the control chip in case
of malfunctions in the system. Input signals for the block is the system OK
(SOK) signal from the common main processor (CMP) which is active when
the processor has locked up. The second signal connected to the circuit
comes from the over temperature sensor on the surface of the pump motor.
The TOK signal is active when the motor temperature exceeds 90°C.
12 V Check
The +12 V voltage will be checked for under voltage conditions. In case the
voltages drops below approximately +10 V a proper working of the pump is
no longer possible and the pump control chip will be disabled.
Pump Control Chip
The pump control chip is the brain of the PDC board. It handles all time
critical and time consuming tasks for the digital position control of the
pumping system. The chip works independent from the processor which
supplies only the pump parameters (for example flow, stroke, compensation,
gradient information and so on). All parameter changes will be transferred
directly to the pump control chip. The feedback from the motor comes to the
chip via the shaft encoder and allows accurate control of the motor (speed,
direction and so on).
The control chip sends the signals for the motor driver to energize the
various motor windings. The control chip influences the current through the
motor windings by changing the pulse width and by an amplification factor
(Gain). The actual value of the current is supplied by the current amplifier
and comparator circuit.
120
The active inlet valve gets its control signals from the control chip. The
optional gradient valve driver board (GVD), which controls the MCGV works
under the supervision of the control chip.
Motor Driver
The motor driver circuit block contains the power stages for the motor. The
motor is a three phase variable reluctance motor.
Current Amplifier and Comparator
One task of this circuit block is to measure the current through all the
windings and to feed this signal into the control chip. From the control chip
the circuit gets the pulse width (PW) and gain (GA) signals. With the pulse
width the current value through the windings is determined. If the gain signal
is active the amplifier multiplies the current with a factor (1.4). This is
necessary to assure a constant torque at all motor positions.
Active Inlet Valve
The control chip provides the signals to activate or deactivate the active inlet
valve. Figure 31 shows the control signal from the control chip and the
current in the solenoid valve. The high current allows fast switching of the
valve while the holding current reduces the heat dissipation of the solenoid.
Figure 31
Inlet Valve Control
121
Figure 32
Board Layout PDC
122
Relative A/D Converter Board (RAD)
Repair Level: Exchange Board or Fuses
Table 38
Item
Part Number
Exchange
RAD
01018-66503
01018-69503
Fuse: F12, F22, 250 mA
2110-0004
The main function of the board is the relative A/D conversion with an analog
pressure output and overpressure measurement for the flow reduction. In
addition the RAD board controls the two external contacts and checks for
the status of active inlet valve and motor temperature. The firmware board
(SFW) which contains the module firmware is attached to the RAD board and
is used by the common main processor (CMP).
Control Logic
The control logic synchronizes the communication between the RAD and the
main processor.
Status Register
The status register sends information about board identification motor
temperature and active inlet valve to the main processor.
Via the board identification the main processor identifies the board in the
card cage. In case of a wrong board position the processor does not allow
signals to the board.
The over temperature sensor on the pump motor surface generates an error
message when the motor temperature exceeds 90°C (fan defective?).
If the active inlet valve is not connected an error message is generated (when
pump will be turned on) and the operation of the pump is inhibited.
123
Figure 33
Block Diagram RAD
124
Relay Contact Register
The relay contact register activates the two relay contact circuits on request
of the processor. When activated contact 1 provides fused (250 mA) +24 V
while contact 2 provides a fused (250 mA) 30 V (AC/DC) rated contact
closure. For more technical information about the relay contacts see
“External Contacts” on page 56.
Relative A/D Conversion
The relative A/D conversion consist of a A/D converter a D/A converter with
differential amplifier and a divider and filter. In addition a filter and amplifier
for the pressure signal is needed and a comparator for the overpressure
signal.
The relative A/D converter delivers a binary data word which is independent
from the absolute value of the signal. The output data word shows the %
difference of the actual value compared to a reference value.
The 8 bit D/A converter and the differential amplifier provide the reference
voltage URef. The dynamic range for the relative measurement represents
±6.4% of the absolute value of the signal. The divider and filter stage
determines the Reference signal which is Ref=URef x 12.8%.
The pressure signal from the high pressure damper is filtered and amplified.
The outlet of this stage is the input voltage (UIn) for the A/D converter. The
same signal is directly fed to the BNC output which has a resolution of
2 mV/bar for the range between 0 to 440 bar. The output has an offset of
30 mV (typical value) for offset compensation of the damping unit.
The comparator compares reference signal and actual pressure signal. In
case of overpressure conditions the flow will be reduced via the PDC board.
The A/D converter allows different operation modes. Measurements of the
difference between URef - UIn in relation to the reference (Ref) value or the
absolute measurement of UIn - AGND in relation to Ref is possible. The
results will be used by the processor to show the pressure ripple and the
actual pressure on the display. It is also used to reduce the flow in case of
overpressure conditions and for the online diagnostic (for example gas
bubble detector, ball valve check, and so on).
The BNC output is an additional diagnostic tool for checking the
performance of the pump. For normal operation the use of the displayed
pressure ripple is sufficient.
125
Figure 34
Board Layout RAD
126
Repair Level: Board
Table 39
Part Numbers for FIM Board
Item
Part Number
Firmware Board (SWF)
01018-66506
The SFW board is a piggy back board, placed on RAD board (’personality
module’).
• The programmed SFW contains the firmware of the 1050 pump module.
• The board is designed for on board programming.
• The FIM contains 128K x 8bit EPROMs.
• All inputs/outputs are pulled down for electrostatic discharge protection.
Figure 35
Layout of SFW Board
127
HRI Board - Heater Isocratic Board
Repair Level: Board or Fuses
Table 40
Part Numbers for HRI Board
Item
Part Number
HRI
01018-66517
Fuse: F4, 2.5 A
2110-0083
The main function of the board is to control the column heater in the solvent
conditioning module of the 1050 Isocratic Pump.
Fuse
Fuse F4 (2.5A) protects the +24V for the heater foil for overcurrent
conditions.
Control Logic
The control logic synchronizes the communication between the HRI and the
main processor.
Status Register
The register provides the main processor with the board identification.
Synchronization
The circuit receives the timing for the D/A converter from the main processor
via the control logic. Synchronization adapts the timing to the needs of the 12
bit D/A converter.
Pulse Width Modulator
When the column heater is turned on the main processor provides control
signals to the pulse width modulator. The output is a TTL signal with a duty
cycle which depends on the temperature difference (error signal) between
actual and setpoint temperature.
128
Figure 36
Block Diagram HRI/HRQ Board
129
Temperature Measurement
The temperature of the heat exchanger is measured with a Pt. 100
temperature sensor. (Resistance 1000 Ohm; at 0°C and approximately
1400 Ohm; at 100°C). The temperature converter circuit provides an analog
signal (0V to +5V) correlating to the temperature of the heating block. The
chosen setpoint temperature is converted in a reference voltage via the 12 bit
A/D converter. Actual and setpoint temperature are then compared in the
comparator.
The derived error signal is send via Latch 1 to the main processor which
updates the necessary signals for the heating section. The sensor check
circuit provides information whether the temperature sensor is installed or
not.
Heater Driver
The heater driver circuit contains the power stages for the heater foil. If the
temperature of the heater block exceeds 100°C a over-temperature switch on
the heater foil interrupts the connection to the heater driver.
Latch 2
The latch provides the signals to the multi color LED which gives visible
information about the heater status. The LED shines green when the heater is
on and at correct temperature. When maintaining the temperature the LED
flashes yellow indicating the percentage of power used. The LED shines
yellow when the heater is on and is at correct temperature but the not ready
time has not been elapsed. During the heating up phase the LED flashes
yellow. A red LED appears in case of error conditions.
The system ok signal (SOK) of the processor is connected to the latch. In
case of problems Latch 1 and the PWM are disabled and the heating process
is interrupted.
Board Layout
Refer to “Board Layout HRI/HRQ” on page 133.
130
Repair Level: Exchange Board or Fuses
Table 41
Part Numbers for HRQ Board
Item
Part Number
Exchange
HRQ
01018-66518
01018-69518
Fuse: F4, 2.5 A
2110-0083
Fuse: F16, 1 A
2110-0007
The main function of the board is the control of the column heater as well as
the multi channel gradient valve (MCGV). The board comprises the function
of the HRI Board. Therefore only the multi channel gradient control has been
described. The HRQ board replaced the gradient valve driver board (GVD)
which controlled the MCGV.
Block Diagram
Refer to “Block Diagram HRI/HRQ Board” on page 129.
Fuses
Fuse F16 (1A) protects the +36V for the multi channel gradient valve (MCGV)
for overcurrent conditions. Originally the fuse had 500 mA which was a
incorrect value.
Control Logic
The control logic synchronizes the communication between the HRQ and the
main processor.
Valve Sequence Register
The valve sequence register contains the information about the sequence in
which the solenoids of the MCGV should be activated (for example A, B, C, D
or A, C, D and so on).
131
4 Bit Counter
The control chip divides the piston path length for one stroke into four parts.
The length for each part is depending on the flow composition. The four bit
counter gets a pulse each time the portion is changed. The output is a 2 bit
data word for the valve select memory.
Valve Select Memory
The following figure shows an example for the input and output of the valve
select memory circuit. The channel number information comes from the 4 bit
counter. The pump drive control board (PDC) supplies the gradient power
pulse (GPP) and the blank out pulse (BOP). GPP delivers the power
switching signals for the multi channel gradient valve (MCGV). BOP makes
sure that all solenoids of the MCGV are switched off before opening the next
one. Valve sequence register gives the relation between the four piston
portions and the solvent channels. Output of the valve select memory is the
accurate timing for the four solenoids of the MCGV.
Figure 37
Valve Select Memory Signals
Valve Driver
The valve Driver contains the power stages for the multi channel gradient
valve (MCGV).
132
Common Valve Switch
Fast switching of the four valves without any interference between the
channels is achieved with the common valve switch. One side of all the four
valves is connected together and is opened each time before switching to the
next valve (BOP).
Figure 38
Board Layout HRI/HRQ
133
High Pressure Transducer Board (HPT)
Repair Level: Damper
The High Pressure Transducer Board (HPT) is built into the High Pressure
Damper and measures the system pressure on the high pressure side. A
negative going voltage is provided showing a linear characteristic between 0
bar to 440 bar from -1 V to -8 V. The measurement is taken with a strain gauge
bridge. The firmware of the pump allows a interactive offset adjustment for
the damping unit. In certain limits the software compensates the offset of the
high pressure transducer.
N OT E
The HPT is installed and preadjusted in the factory. In case of malfunctions the
complete assembly should be replaced in the field.
Figure 39
HPT Pressure Diagram
134
Figure 40
Block Diagram HPT
135
Repair Level: Board or Fuse
Table 42
Part Numbers for CON Board
Item
Part Number
CON (NEW)
01018-66505
Fuse: F2, 375 mA
2110-0421
The connector board (CON) allows easy access to plugs for the multi channel
gradient valve (MCGV) active inlet valve and the leak sensor. The connector
cable transmits the signals to the motherboard and from there it is fed to the
various boards. The fuse protects the active inlet valve circuit for overcurrent
conditions (only on board revisions B and greater).
Figure 41
Board Layout CON
136
Table 43
CON Connectors
Connector
Function
J1
MCGV
J2
not used
J3
Active Inlet Valve
J4
Leak Sensor
J5
Cable
J1
MCGV
137
Pump Motherboard (HPS)
Repair Level: Board
Table 44
Part Numbers for LUM Board
Item
Part Number
HPS Board
01018-66501
The Motherboard connects the various boards of the pump to each other and
supplies the signals for the front parts like metering drive, damper, MCGV,
fan and keyboard. Figure 42 shows the location of all connectors, Figure 43
to Figure 45 show the main signals of the pump.
Figure 42
Layout of Pump Motherboard
J1 - Power Supply
J6 - Not used
J11 - Fan
J2 - PDC Board
J7 - CMP
J12 - High Pressure Damper
J3 - RAD/SFW Board
J8 - FIP Keyboard
J13 - Connector Board Cable
J4 - not used yet
J9 - Temperature Sensor
J14 - Metering Drive Motor
J5 - HRI/HRQ Board
J10
J15 - Shaft Encoder
138
Figure 43
Connection Table HPS (I)
139
Figure 44
Connection Table LUM (II)
140
Figure 45
Connection Table LUM (III)
141
142
7
7
Pumps: Diagnostic Information
This chapter provides information on error
messages and diagnostic features of the 1050
Pumps
This chapter provides information about:
• Test Functions
• Flow (Pressure) Tests
• Pump Pressure Ripple
• Normal Pressure Test
• Modified Pressure Test
• Flow Test Method - Firmware Revision 1.0
• Flow Test Method - Firmware Revision 3.0 and above
• Gradient Test
• Error Messages
• Selftest
• Common 1050 Messages
• Pump Initialization
• Column Heater
• Online Monitor
• Troubleshooting Hints (Pressure Tests)
• Pressure Tests with water and methanol
• Pressure Tests when the pump is broken
144
The test function of the firmware is part of the control section. The first test
function is a online monitor of the actual pressure ripple. The two other
programs allow verification of the pump performance. The two test methods
are also used for the final test of the 1050 Pump modules.
Press CTRL and with Next move the cursor to
TEST FUNCTIONS (enter)
After pressing Enter the following TEST FUNCTIONS are accessible.
PUMP PRESSURE RIPPLE YY.Y%
Monitors the actual flow ripple if the diagnosis level (Configuration) is turned
on (1, 2 or 3).
LOAD FLOW TEST METHOD
Loads a special program (pressure test) for performance verification of the
flow system.
LOAD GRADIENT TEST METHOD
Loads a gradient test program (tracer test) for the performance of the
gradient system.
145
Pump Pressure Ripple
Pump Pressure Ripple
The pressure ripple display shows the actual pressure variation of the solvent
flow. It can be used as a quick check for determination of gas bubbles in the
system. If the online diagnostic is turned on no pressure ripple (--.-%)
indicates either no flow in the system or too many gas bubbles in the system
exceeding the measurement range or a pressure below 30 bar to 50 bar.
Positive pressure ripple values (for example 0.5%) are shown when the pump
is overcompensated. Negative pressure ripple values (for example -0.8%) are
shown in case of an under compensated pump.
Whether the values in the display are either positive or negative is strictly
depending on the solvents in use and the respective pressure compensation
values which are user selectable. Typical pressure ripple readings are in the
range ±1%. A higher ripple which can not be reduced by pressure
compensation changes may indicate an air bubble.
N OT E
In purge mode the pressure ripple is not measured. The display might show
incorrect values during this time.
146
Flow (Pressure) Tests
The pump has an analog output for the pressure signal for monitoring and
troubleshooting purposes. The tightness and performance of the pump can
be tested with various pressure tests. The outlet of the pump will be blocked
and depending on the chosen pressure test the system pressure rises until it
is stopped either by the program itself or the pressure limit.
The plotted pressure signal provides information about the performance of
the system. In case of system failures it might be possible to combine the
pressure tests for clear identification of the failing part.
Firmware revision 3.0 and above
These firmware provide an additional feature which allows to monitor which
of the two piston is delivering into the system. This is a very helpful tool
when troubleshooting the system. Pressure drops in the pressure tests can be
related to the delivering piston. Conclusions which parts failed are much
easier done.
Press Status and twice Next to get the following display.
currently active piston 1
The display shows whether piston 1 or piston 2 are just delivering into the
system. ** indicates that the change from one piston to the other is to fast to
be monitored (flow >1.2 ml/min).
147
Prerequisites for the Pressure Tests
1 Place a bottle of isopropanol (HPLC grade) into the solvent cabinet and
connect it to one of the solvent channels (lets take channel B).
2 Switch on the degassing for that channel and establish an appropriate
helium flow rate in the bottle.
3 Connect the signal cable between RAD board and integrator input (for
example a 339X integrator). The pressure signal provides 2 mV/bar.
4 Purge the channel (B). Observe the pressure reading until the value is
stable. The pump pressure ripple display should show a value in the range
±0.5% for isopropanol (with default settings).
N OT E
If the system is not well primed or degassed incorrect measurements may be
taken resulting in wrong interpretation of the plots.
5 Set Integrator parameters (339X series).
Zero 10
ATT 210
CHART SPEED 2 cm/min
148
Normal Pressure Test
This test is well known for verifying system tightness.
❏ Turn on pump and set FLOW 0.000 ml/min and disconnect the interface
tubing at pump outlet.
❏ Plug pump outlet with a blank nut (01080-83202).
❏ Start the integrator with the plot mode.
❏ Set Flow FLOW 1.000 ml/min to start the pressure test.
Figure 46
Normal Pressure Plot with IPA
Explanations to Plot
The plot shows a typical pressure profile of a normal performing 1050 Pump.
With the flow of 1 ml/min the pressure in the system raises until the pump
stops via the overpressure condition at 400 bar. After one minute wait time
the pressure drop should not exceed 5 bar/min.
149
The Modified Pressure Test
This test is a slight modification of the previous used normal pressure test.
❏ Turn pump on, set FLOW 0.000ml/min and disconnect the interface
capillary at the outlet of the pump.
❏ Plug pump outlet with a blank nut (01080-83202).
❏ Start the integrator with the plot mode.
❏ Set Flow FLOW 1.000ml/min to start the pressure test.
❏ Observe the pressure display and reduce the flow to FLOW 0.100ml/min
at approximately 200 bar.
Figure 47
Modified Pressure Test with IPA
Explanations to the Modified Pressure Plot
The pressure in the system rises as seen in the previous test. When switched
to the reduced flow rate the pressure increases with a lower slope. During
the time until the system pressure limit will be reached piston I and II deliver
alternately into the system. A straight line as seen indicates that both piston
chambers are leak free. After switched off at 400 bar and one minute wait
time the pressure drop should not exceed 5 bar/min.
150
Flow Test Method
The firmware of the pump module holds a firmware resident flow test
method which contains the parameters for the pressure test. The parameters
cannot be displayed. During the life time of the instrument the firmware has
been changed (communication update rev. 1.0 to 3.0) and the flow test
method was revised. Therefore firmware revision 1.0 and 3.0 run different
tests when the flow test method will be executed.
❏ Place a bottle of isopropanol (HPLC grade) into the solvent cabinet and
connect it to one of the solvent channels (lets assume its channel B).
❏ Set PRIMARY CHANNEL B
N OT E
The Test Method uses exclusively the solvent specified by the primary
channel and ignores the setting of the % display. However for flushing the
system a setting %B 100 is necessary.
❏ Connect the signal cable between RAD board and integrator input.
❏ Flush the system. Observe the pressure reading until the value is stable.
(hint: use pressure ripple display).
❏ Set FLOW 0.000ml/min and disconnect interface tubing at pump outlet.
❏ Load Flow Test Method.
N OT E
Loading the flow test method resets the pump an action which moves the
pistons into a predefined position. In addition the instrument sets the actual
flow to zero (FLOW 0.000ml/min) if not already set.
❏ Plug the pump outlet with a blank nut (01080-83202).
❏ Set integrator parameters (339XA)
Attenuation 210
Chart Speed 1 cm/min (PLOT mode).
❏ Press START, then ENTER to run the test method.
151
Flow Test Method - Firmware Rev. 1.0
Figure 48
Pressure Test (Rev. 1.0) with IPA
Explanations to Pressure Plot
Following are some remarks to the various steps in the plot.
N OT E
The pump displaces approximately 150 µl until the first plateau will be
reached at a pressure of 120 to 130 bar. After pump initialization the 1. piston
is in its upper position which means the 2. piston starts delivering into the
system. With the given stroke length of 70 µl strokes of both pistons (II-I-II- I)|
are necessary to reach the 1. plateau. Drastic leaks at active inlet valve outlet
ball valve or seals will disturb the intake stroke of the 1. piston. The result
might be a pressure drop when the 1. piston takes over to deliver into the
system at a pressure between 20 to 40 bar. If the pressure test does not reach
the first plateau the pressure plot cannot give any reliable diagnostic or
troubleshooting hints.
152
1 From the predefined position the pistons start moving with a flow of 150 µ|
and rises the pressure in the pump.
2 At the first plateau the firmware makes sure that the first piston is delivering
into the pump. With the very small flow rate of 2 µl the pump pressure should
remain stable. During the 1min at this plateau a maximum pressure drop of
5 bar is allowed (pressure display). At this position the tightness of the whole
system is measured.
3 Pressure is increased until the second piston is delivering.
4 At the second plateau the second piston is delivering into the system with a
flow of 2 µl. Again a straight line is expected. A pressure drop of 5 bar during
the 1min is allowed.
5 The pistons move now with a higher speed (flow 500 µl/min) increasing the
pressure in the system.
6 While increasing system pressure the pistons move with a stroke volume of
4 µl. The system pressure must reach a value of 330 bar ±30 bar. This part of
the test checks for the mechanical tolerances from system to system and is of
minor interest for system troubleshooting.
7 The system pressure is increased until the system shows an overpressure
condition (>400 bar) which turns the pump off. 1 min after turning off the
pump pressure drop should not exceed 5 bar/min.
Possible Failure Modes
The most relevant service information are obtained from the plot of the first
(2) and second (4) plateau of the pressure plot. Three major failure modes
are possible. For troubleshooting the system both plateaus should be seen
together and not separately.
The following plots show the different failure modes.
153
Straight line at first plateau but negative slope at second plateau
Figure 49
Negative Slope at second Plateau
The plot shows a leak free system when the first piston provides the flow.
But during the stroke of the second piston the pressure drops down
indicating a internal leak. The pump seals are definitely ok.
Possible failure:
Contaminated outlet ball valve (backflow).
154
Negative slope at first plateau and stable plot at second plateau
Figure 50
First Plateau unstable
Plot shows malfunction in the system when the first piston maintains the
pressure in the system. The delivery stroke of the second piston is separated
from the first one via the outlet ball valve and shows no problem.
Possible failure:
• leak at first piston seal
• leak at active inlet valve
• no tight connection at outlet ball valve.
155
Negative slope at both pistons
Figure 51
Problems at both Plateaus
Plot shows same failure mode on both pistons when maintaining the pressure
in the pump. Under the assumption that the slope has the same angle for both
“plateaus” it can be said that the problem is probably coming from the second
piston chamber. Different angles indicate more than one leak in the pump.
Possible failure
• Blank nut not tight enough
• Fittings at frit adapter assembly or damper not tight
• Leaking piston seal at second piston.
156
Flow Test Method - Firmware Rev. 3.0 and above
Figure 52
Pressure Test (Rev. 3.0) with IPA
Explanations to Pressure Plot
N OT E
This flow test method is pressure controlled. The actual pressure has to
exceed at least 270 bar for the first step otherwise the test cannot reach the
following steps.
1 Starting with a flow of 500 µl/min and a stroke of 20 µl the pump starts
delivering into the system. The pressure rises until the damper detects a
system pressure of more than 270 bar. The pump continues to deliver with
the same parameters until piston I reaches its upper limit. At this position
the stroke is changed to 80 µl and piston II delivers one stroke with the
larger stroke volume.
2 Now the flow is changed to 100 µl/min (stroke 80 µl) and piston I continues
with this parameters for about 1/3 of its stroke.
3 At the plateau piston I delivers for approximately 1 minute with a very low
flow rate (4 µl) into the system. A straight line or a slight pressure increase
is expected for a normal performing pump. A pressure drop during this
minute indicates a problem in the pump.
157
4 Piston II delivers into the system. At the end of the first plateau the flow is
increased back to 500 µl until piston II reaches approximately 1/3 of its
stroke. At the second plateau piston II delivers with a very low flow rate
(4 µl) into the system. A straight line or a slight pressure increase is
expected for a normal performing pump. A pressure drop during this
minute indicates a problem in the pump.
5 The flow is increased to 250 µl and the pumps works with this rate until the
damper detects more than 390 bar. The flow is set to zero and the test is
finished. It might happen that the system stops with a pressure slightly
below 400 bar. This allows to restart the pump without reset. In most of the
cases the pressure will exceed the upper pressure limit of 400 bar and will
show the error message. 1 minute after reaching the maximum pressure of
the test the pressure drop should not exceed 5 bar/min.
Possible Failure Modes
The plateaus (3, 4) of the pressure test provide the same information like in
the previous test (Rev. 1.0). The only difference is that the two plateaus are
moved to higher pressure values. The section pressure plots of this manual
will provide additional pressure tests under failure conditions of the pump.
158
The test measures all the relevant data which have an influence on the pump
performance. The step performance of the MCGV and the gradient linearity
are controlled with this tracer test. The tracer test is a chromatographic test
and therefore requires a UV detector connected (no column installed) to the
1050 Pump module. The gradient test is decided into two parts. The first part
tests the step reproducibility of a gradient and the second part tests the
linearity of a gradient.
Prerequisites for the Gradient Test Method
Place the following solvents (HPLC grade) into the solvent cabinet and degas
them thoroughly.
Channel A
Distilled Water
Channel B
Tracer (Isopropanol + 0.5% Acetone)
Channel C
Isopropanol
Channel D
Isopropanol
Running the Gradient Test Method
1 Flush each channel for a couple of minutes.
2 Connect the outlet capillary of the pump to a detector.
3 Set detector parameters Sample Wavelength 267 nm (Bandwidth 4 nm) or
equivalent, Reference Wavelength 550 nm, 100 (if available) or equivalent
or fixed reference.
4 Connect the signal cable between detector and integrator.
159
5 Set integrator parameters (339X).
Zero = 5
Att 2^ = **
CHT SP = 1.0
PK WD = 0.01
THRSH = 11
AT 12 min Att 2^ = **
AT 12 min CHT SP = 0.5
AT 45 min STOP
** The tracer concentration may vary from mixture to mixture. Therefore
check for the appropriate integrator attenuation. Start the integrator
manually change %B = 7 observe the plot and adjust the attenuation to a
value which gives the highest deflection without exceeding the paper
range.
Proceed in the same way with %B = 100. Set the pump parameters back to
start values (%B = 0).
6 Load gradient test method.
7 Press START, then ENTER to run the test method.
Figure 53
Gradient Test Method (part 1)
160
Figure 54
Gradient Test Method (part 2)
Explanations to Gradient Test
In the first part of the test the step reproducibility will be tested. The steps
should have all the same height except the last two steps. The last steps
(from 2% to 1% to 0%) will not have the same step height because of a too
small solvent volume versus the switching time at this positions. In addition
the composition precision can be tested. The noise on each of the steps
should not exceed 50% of the step height. Typically values of 30%
representing a composition precision of ±0.15% are reached.
In the second part of the test the gradient linearity will be verified. Except of
the bump at the upper end of the gradient the curve should show a straight
line indicating a good linearity of the system. Be aware that the performance
of the detector (linearity, stray light, and so on) will have a significant impact
on the results.
161
Error Messages
Error Messages
The error messages will help to locate and repair a failure. In case an error
message appears the Error LED will be turned on and the message will be
written into the system logbook. Reset Pump or switching on the pump
again will reset the error. The entry in the logbook remains.
The error messages can be divided into the following blocks:
• Selftest
• PANIC Error
• Pump Initialization
• Column Heater
• Online Monitor
162
Selftest
Selftest
ROM/RAM Test
RAM and display can be tested via the build in selftest. The selftest will be
performed when CRTL will be pressed while the module is turned on at the
LINE~ switch. In case of a failure one of the following messages appears. The
complete test requires approximately two minutes.
ROM test failed
( ROM test failed )
The ROMs on the SFW board are tested. In case of a checksum error the
ROM test fails.
❏ Replace the SFW board.
RAM test failed
( RAM test failed )
The RAM’s on the CMP board will be tested. In case of a failure the error
message appears and the CMP has to be replaced.
❏ Replace the CMP board.
163
Panic Error / Bus Error Address Error
Panic Error / Bus Error Address Error
PANIC: XXXXXXH BUS ERROR
PANIC: XXXXXXH Address ERROR
The panic error messages should not appear under normal operation
conditions. In case of hardware or firmware problems the instrument might
try to access a wrong or not existing address which results in the error
message on the display. The instrument is locked up and has to be switched
off/on.
Reason for the PANIC error message can be any disturbance on the bus lines
due to bad contacts (high resistance) or defective IC on any of the boards.
❏ Check boards for good connections or corrosions at the contacts (clean
contact pins).
❏ Check revision of firmware board (SWF). It should be revision C or higher.
Revision C boards do have a dynamic bus termination for spike
suppression on the bus lines.
❏ Replace one board at a time to identify the faulty one.
❏ If board replacement will not cure the problem replace the motherboard.
164
Common 1050 Error Messages
The common messages are either event or error messages which may appear
in all the 1050 series modules. The messages are identical or very similar in
the various modules.
E00 : Power Fail
E00 HH:MM DDMMM power fail >
This message indicates that the instrument has either been disconnected
from line source or a line power voltage drop has occurred. System clock will
stop and has to be set again after turning on the pump.
E01 : Leak Detected
E01 HH:MM DDMMM leak detected >
leak detected in pump
The leak detection system uses a PTC resistor as leak sensing item. Liquid
cooling the PTC results in a decrease of the resistance. The PTC is built in a
resistor divider which is connected to a constant voltage. From the voltage
divider a signal can now be obtained depending on the current through the
PTC and hence depending on the temperature. The leak detection circuit is
located on the CMP board and checks continuously for presence and leak
conditions. If the sensor is missing (defect) or in leak condition the PTC is
cooled down the error message appears (only when pump motor was turned
on beforehand otherwise only a status information is given). When the
module is turned on the leak message will be disabled for a short period of
time (30 seconds) to allow the sensor to warm up and stabilize.
Normal:
about 75°C
400...500 Ohm
Error:
below 55°C
about 150 Ohm
165
Actions:
❏ Check for leaks in the pump module.
❏ Change SFW board.
E02 : Shutdown In
Other Module
E02 HH:MM DDMMM shut down >
error in other module
An external device pulled the shut down line of the remote connector down.
This forces the pump to stop the pump motor inhibiting a flow into the
system. Probably a leak appeared in one of the connected modules.
E03 : Error Method
loaded
E03 HH:MM DDMMM error method >
error method has been loaded
The operator may define a method as a error method. The event message
indicates that the module detected an error and that the error method was
loaded.
E04 : Time Out
E04 HH:MM DDMMM time out
The operator may define a time after which the instruments stops all further
actions. Mainly two cases will lead to the time out message. First if a normal
run is finished the pump is turned off after the specified time (only if no new
start command appears during this time). Second a not ready condition in a
sequence mode or in multiple run mode will start the time out timer
eventually leading to the message.
166
Pump Initialization Error Messages
During the pump initialization the system performs some start up routines to
prepare the motor drive system for normal operation. The system starts the
servo system and measures the upper dead center of the first piston.
Malfunctions during the turn on process will lead to the following error
messages.
E11 : Gradient
feedback failed
E11 HH:MM DDMMM init failed >
gradient feedback failed
In case the gradient valve (MCGV) is installed and recognized during boot up
the system turns on the Primary Channel before it starts with any other
action. The error message indicates that the primary channel could not be
turned on. Reason is an communication problem between the pump drive
control board (PDC) and gradient valve driver board (HRQ).
❏ Check for proper connection of HRQ and PDC boards.
❏ Replace HRQ board.
❏ Replace PDC board.
Work around: Set different primary channels one of them should work. Use
pre mixed solvents and connect the solvent directly to the active inlet valve.
E12 : Servo restart
failed
servo restart failed >
The first action for the servo motor is to switch on the C-phase of the variable
reluctance motor. The rotor will move to one of the C-positions. This action
is called the Servo Restart. From such a rotor stator relation the servo will be
able to take over the phase sequencing with the commutator (on the PDC
board). If the rotor is not able to move or the C-phase cannot be reached the
error message appears.
❏ Check Fuse on the PDC board.
❏ Check cables to pump motor.
❏ Check for mechanical blockage of the drive system.
❏ Change PDC board.
❏ Change drive assembly.
167
E13 : Pump timeout
pump timeout
After restart the pump will move the first piston to its upper position. The
upper position is recognized when the piston touches the mechanical stop
rising drive power for the blocked motor. If the piston will not reach the
upper limit within one minute the initialization will be stopped and the error
message appears.
❏ Check gears of the drive assembly (broken coupler?).
❏ Change the drive assembly.
E14 / E15 / E16
The following three error messages use the same measurement principle
with different limits. During the pump initialization the first piston hits the
upper dead center of the pump head and stops there. To make sure that the
piston will not run into this mechanical stop during normal operation the
index hole of the motor shaft encoder wheel is used as the initialization
reference. From the upper center the piston travels back until it reaches the
index hole. There will be no reinitialization during normal operation
(initialization only during pump on procedure or pump reset command). The
Index position is expected in a certain range from the upper dead center. If
the Index does not appear in this range one of the three messages will show
up on the display.
E14 : Home position
not found
home position not found
After the piston has hit the upper limit it will move down to find the first
Index hole of the encoder. If the Index is not found in the maximum allowed
number of steps this error message appears. The communication to the shaft
encoder index hole is missing.
❏ Check cable and connector of the encoder.
❏ Check PDC board connection.
❏ Change Drive Assembly.
168
E15 : Home position
out of limit
home position out of limit
When the motor is stopped for reversing the direction the moment of inertia
of motor and spindle will continue the movement for certain steps until it
finally stops. Therefore an minimum number of steps is necessary until the
Index should be reached. In case the number is to small this error message
appears. Changed adjustment or sticking movement of the system can be the
reason for this.
❏ Check drive system for smooth movement.
❏ Change motor drive assembly.
E16 : Pump head
missing
pump head missing
The mechanical tolerances from one system to the other need an offset
compensation to make sure that the piston reverses its direction always at
the same position. If the distance between the upper limit and the first index
exceeds the compensation range but is still below the maximum limit (E14)
the error message will show up. Reason can be that the pump head is missing
or not mounted in the right way.
❏ Mount pump head correctly.
E17 : Idle power
exceeded
idle power exceeded
The PDC board measures the actual electrical current. If the motor needs
more then a defined current for a pressure free pump it indicate a failure in
the system. Reason is either an tight mechanical system or a defective motor.
❏ Check PDC board.
169
E18 : Stroke length
misadjusted
stroke length misadjusted
This error message appears only when the pump is running in DIAGNOSE
LEVEL 3 which is a manufacturing test. The error indicates a incorrect
spindle position adjustment.
Hint: If error message E27 occurs when pump works with 100 µl stroke
volume diagnose level 3 allows a quick check of the pump. Set diagnose level
3 and turn on pump. If E18 occurs the metering drive is mis-adjusted and
generates the E27 problem. Metering drive has to be changed.
170
Normal Operation Error Messages
Operation error messages can be detected at any time of a normal operation.
They are normally independent of the current state of the pump. The ERROR
LED will be ON and the message will be entered in the logbook. Restarting
the pump will reset the error.
E19 : Pressure above
upper limit
E19 HH:MM DDMMM press too high >
pressure above upper limit
The actual pressure in the system is continuously monitored during
operation of the pump. The firmware allows only operation up to the user
defined upper limit, if not in purge mode. If the high pressure damper detects
more than the upper limit the pump is turned off or a specified error method
will be activated and the error message appears. All this measurements are
performed on the RAD board.
❏ Check flow system for blockages.
❏ Check Flow setting.
❏ Change RAD board.
E20 : Pressure above
maximum limit
E20 HH:MM DDMMM press too high >
pressure above maximum limit
The system pressure is normally checked with the upper and lower limit
values. In case of any malfunction (for example pump does not stop at
400 bar rapid fast pressure increase) in the system which allow the pressure
to rise above 420 bar the pump is stopped and the error message appears.
This message shows up when the system is blocked and the pressure shoots
up very fast (pressure test).
❏ Check flow system for blockages.
❏ Check flow setting.
171
E21 : Pressure below
lower limit
E21 HH:MM DDMMM press too low >
pressure below lower limit
The lower limit value function is firmware controlled. In case the system
pressure drops once below a user defined value the pump motor will be
turned off or the specified error method will be activated and the error
message appears. The error message allows to check the system for empty
solvent bottles, broken capillaries, fitting leakage and so on.
❏ Check flow value and solvent composition.
❏ Check all seals and fittings in the complete LC system.
E22 : Temperature
sensor failed
E22 HH:MM DDMMM sensor failed >
temperature sensor failed
While the pump is turned on the firmware checks for the presence of the
temperature sensor. In case the sensor is disconnected defective or the
sensor is activated (switch open) by an over temperature condition the error
message appears. The temperature sensor switch opens at 90°C and the
pump motor will be turned off.
❏ Check fan.
❏ Check air filters.
❏ Check sensor with meter.
❏ Change metering drive.
E23 : Motor
temperature
exceeded limit
E23 HH:MM DDMMM overtemperature>
motor temp exceeded limit
The highest power consumption in the module is inside the variable
reluctance motor. High system back pressure at low flow rates results in
maximum heat dissipation. A fan and a special designed foam part make sure
that the heat of the motor is brought out of the instrument. In case the
airstream of the module is interrupted or the fan fails the motor temperature
will rise above allowed limits. A thermal switch is mounted on the surface of
the motor and turns off the pump when the temperature exceeds 90°C.
The error event circuit reacts immediately on the PDC board and turns off
the pump motor power. The same signal line on the PDC board is also used
from the system ok command (SOK). This means that the error also appears
in case of a SOK error. The SOK is set when the processor has locked up
172
preventing damage of pump or others or one of the boards holds the signal
down.
❏ Check fan.
❏ Check air flow path.
❏ Check temperature of the motor.
❏ Check all other boards in the system.
E24 : Inlet valve
disconnected
E24 HH:MM DDMMM valve missing >
inlet valve disconnected
If the active inlet valve is disconnected and the first piston is delivering
solvent the valve may be damaged. Therefore the presence of the active inlet
valve is controlled. In case the active inlet valve is not connected during the
initialization of the pump the pump motor is turned off and the message
occurs.
❏ Check Connector of the valve.
❏ Check the connector cable to the motherboard.
E25 : Adjust pressure
offset
E25 HH:MM DDMMM pressure offset>
adjust pressure offset
The high pressure damping unit measures the system pressure in the range
from 0 to 400 bar. Thermal drift of the electronic components may cause drift
to negative values. If the pressure offset is below -15 bar the error message
appears on the display. Incorrect adjustment may influence the pump
performance (pressure ripple measurement and so on).
❏ Perform offset adjustment.
❏ Check connector of damping unit.
❏ Change damping unit.
173
E26 : Pump drive lost
init values
E26 HH:MM DDMMM init lost
pump drive lost init values
The reference position for the upper limit of the piston is reached during
each pump cycle. In case the difference of the actual value in relation to the
value of the initialization is too large the system will turn off the pump and
the error message appears.
❏ Check connector and cable of the encoder.
E27 : Max motor drive E27 HH:MM DDMMM power use high>
power exceeded
max motor drive power exceeded
The power consumption of the motor drive will be monitored. In case of
servo failures or blockages of the ball screw drive the motor current will
exceed the maximum limit and the processor will turn off the pump.
❏ Check motor drive for smooth movement.
❏ Check the +12 V on the PDC board.
❏ Check outlet ball valve for blockages.
E28 : Secondary
Powerfail
E28 HH:MM DDMMM Sec Powerfail >
+12 V analog supply failed
The +12 V generated on the PDC board will be continuously checked for
under voltage conditions. In case the voltages drops below approximately
+10 V the pump will shut down and the error message will appear. The +12 V
will be also used on the RAD board and the pressure transducer board of the
damping unit.
❏ Change the PDC Board.
❏ Change the RAD Board.
❏ Change the Damping Unit.
174
Column Heater Error Messages
The following messages may appear as you work with the column heater.
E33 : Column heater
cable disconnected
E33 HH:MM DDMMM column heater >
cable disconnected
The firmware recognizes the column heater option when the cable is correct
installed. If afterwards the cable is disconnected or a wrong cable is
connected to the HRI/HRQ board the error message appears and the red
error LED is turned on.
N OT E
When the remote cable is connected to the HRI/HRQ board the error message
will appear and the +24 V of the board is disabled to prevent damage of the
modules which are connected to the remote cable.
If the column heater cable is connected to the remote connector of the pump
module the LED on the heater module will lit yellow/red.
❏ Check for correct cabling of the column heater module.
E34 : Column heater
board failed
board failed
The watch dog circuit on the CMP board (SOK signal) controls the correct
communication between processor and interface boards. If the SOK signal is
activated the error massage appears and the error LED of the pump module
is turned on and the column heater LED shines red. Reason for the error can
be either an electronic component failure or interference on the bus lines.
❏ Reboot the pump module.
❏ Reseat all boards in the card cage.
❏ Change the HRI/HRQ board.
❏ Change the CMP board.
❏ Change the CIB board.
❏ Change the SFW board.
❏ Change the HPS board.
175
E35 : Column heater
overtemperature
overtemperature
The column temperature is normally checked with the Pt. 100. In case of
malfunctions the temperature may exceed the normal working range. At 90°C
the firmware disables the heater circuit, sets the error message and turns on
the red error LED at the pump and the column heater. In case the heater
transistor is defective and still heats up the heat exchanger the over
temperature switch on the heater foil opens at 100°C and interrupts heating.
❏ Change the HRI/HRQ board.
E36 : Column heater
fuse blown
fuse blown
With the column heater turned on the firmware checks for the presence of
the +24 V on the HRI/HRQ board. If fuse F4 is blown, the +24 V is missing and
the instrument shows the error message, turns on the red error LED on the
pump and the column heater module. The fuse blows in case of a shortage on
the +24 V line.
❏ Replace fuse F4.
176
Online Monitor Messages
The online monitor function checks the metering pump during normal
operation and is described in the diagnostic section. Messages may appear
when the chromatographic performance might be influenced or the
instrument is in a special mode (initialization purge).
The messages except of M01 and M11 are related to the Diagnose Level
(0, 1, 2) of the instrument. If the diagnose level is turned off (0) the messages
will be suppressed. Diagnose Level 1 writes the messages into the logbook
with no further action. Diagnose Level 2 writes the messages into the
logbook and the Not Ready LED will be turned ON. For more information
about the online monitor, see the diagnostic chapter.
M01 : Pump reference M01 HH:MM DDMMM initialized >
initialized
pumps reference initialized
The initialization of the metering drive reference values appears under three
conditions. First after initial turn on of the pump after boot up second with a
reset pump command (Control Function) and third when the pump is turned
on and the reference values have been lost for any reasons. In this case the
message is an indication that a covered problem appeared while the pump
was turned off. Because of its state (off) the pump could not show the
malfunction and the instrument performs a new initialization. During this
initialization the probable error will be cleared and when the error is not
solid the pump will be turned on without problem.
M02 / M03 : Gas
bubble
M02 HH:MM DDMMM gas bubble >
gas problem ripple too high
M03 HH:MM DDMMM bubble solved >
problem solved ripple in range
If the pressure ripple of the pump exceeds a certain range the message M02
appears. In case of a temporary disturbance the ripple might return to its
normal working range and indicates this with message M03.
❏ Check for proper degassing.
❏ Check for appropriate compressibility setting.
177
M04 / M05 : 1st piston M04 HH:MM DDMMM 1st piston leak>
leak
check seals or inlet valve
M05 HH:MM DDMMM 1st piston ok >
problem solved leak in range
If the online monitor function detects a leak in the first piston chamber the
above message M4 appears. If the instrument returns to normal operation
(problem solved by user) the message M5 indicates a good working
instrument. The occurrence of M4 is a very good indicator when the seals
should be changed.
❏ Check for leaks a fittings.
❏ Check for tight connection of the active inlet valve.
❏ Change seals.
❏ Change active inlet valve.
M06 / M07 : Valve
backflow
M06 HH:MM DDMMM valve backflow>
check outlet valve
M07 HH:MM DDMMM valve tight >
problem solved no backflow
M06 indicates that the pump detected a backflow in the outlet valve which
indicates that the valve has been closed but is not tight. M07 indicates that
the problem was solved.
❏ Clean outlet valve.
❏ Change outlet ball valve.
M08 / M09 : Outlet
Valve
M08 HH:MM DDMMM outlet valve >
clean outlet valve
M09 HH:MM DDMMM outlet valve ok>
problem solved outlet valve ok
M08 appears when the outlet ball valve shows a time delay before it blocks
the flow path in the correct way. This is an indication that the valve sticks
and need to be cleaned.
❏ Clean outlet ball valve.
❏ Change outlet ball valve.
178
M11 : Purging mode
activated
M11 HH:MM DDMMM purging >
purge mode activated
This message shows when the instrument was purged the last time.
179
Troubleshooting Hints
Troubleshooting Hints
This section gives practical hints in troubleshooting the pumps according to
the pressure plots:
• Pressure Tests with different Solvents (water methanol)
• Pressure Tests when the Pump is broken
180
Standard Pressure Tests with different Solvents
Standard Pressure Tests with different
Solvents
The factory tests all the 1050 Pumps with isopropanol (IPA). Therefore the
tests should be done with this solvent for comparison reasons. Sometimes
isopropanol is not available at customer side. Following are pressure tests
which are performed with water and methanol.
Modified Pressure Tests
The pressure profile looks very similar to the one with isopropanol. There are
little steps when the piston change there direction. This is due to the
compressibility compensation setting (default 100). It is important that the
slope for both pistons are parallel to each other.
With methanol the pressure drop at 400 bar is larger than with isopropanol
because of the lower viscosity.
Figure 55
Modified Pressure Test with Water
181
Figure 56
Modified Pressure Test with Methanol
With methanol the pressure drop at 400 bar is larger than with isopropanol
because of the lower viscosity.
Pressure Tests - Firmware Revision 1.0
The results with water and methanol are similar than the one with
isopropanol. The plateaus reach approximately the same height. Also the
step 6 should be in the range 300 bar to 360 bar. The test with water shows
that the step 6 exceeds already the upper pressure limit (400 bar). Reason is
the lower compressibility of water compared to isopropanol.
182
Figure 57
Pressure Test (Rev. 1.0) with Water
Figure 58
Pressure Test (Rev. 1.0) with Methanol
183
Pressure Tests - Firmware Revision 3.0 and above
Due to the pressure controlled test the results are very similar as the one with
isopropanol. The pressure drop with methanol is slightly larger.
Figure 59
Pressure Test (Rev. 3.0) with Water
Figure 60
Pressure Test (Rev. 3.0) with Methanol
184
Pressure Tests when the Pump is broken
The pressure plots of the 1050 Pumps are a helpful tool for troubleshooting
the pumping system. Online diagnostic messages and flow related error
messages should be always verified by the previous described pressure plots.
This section shows examples of pressure plots for different in the factory
generated failure modes. They should give indications how a possible failure
looks like. The modified pressure test and the flow test method for firmware
revision 1.0 and 3.0 are shown for the same failure symptom.
The modified test and the flow test method should be always used together to
get a clear information about the problem of the pump.
185
Pressure Tests - Leak at Piston Seal 1
Figure 61
Modified Pressure Test - Leak at Piston Seal 1
The flow is reduced to 0.1 ml/min at approximately 240 bar. From this point
both piston deliver with a constant value and increase the pressure to
<nobreak|320 bar|. From this point the pressure moves up to 400 bar in an
oscillating curve. This means that one of the two pistons has a leak rate when
delivering into the system. At the upper pressure limit (400 bar) the pressure
is stable. The outlet ball valve is closed in this position and indicates that the
leak is probably on the first piston side. In this case it is a defective piston
seal.
Firmware revision 3.0 allows to identify the leaky piston side via the current
active piston display.
186
Figure 62
Pressure Test (Rev. 1.0) - Leak at Piston Seal 1
The flow test method shows a quite normal pressure profile. Only on the
slope to reach the upper limit some pressure fluctuations can be seen. The
modified pressure test showed that the seal leaked at more than 320 bar.
Therefore the flow test method cannot detect this defective seal.
187
Figure 63
The flow test method reduces the flow to 100 µl at approximately 320 bar.
The pressure drops and when the piston I delivers with its small flow rate a
continuous pressure drop can be observed at the first plateau. The second
plateau shows a slight pressure increase and the upper limit shows stable
conditions. The pressure drop at the first plateau indicates a leak on the first
piston side. In this case a leaky piston seal.
188
Pressure Tests - Leak at Piston Seal 2
Figure 64
Modified Pressure Test - Leak at Piston Seal 2
The flow is reduced to 0.1 ml/min at approximately 240 bar. From this point
both piston deliver into the system with a constant rate. At 360 bar to
<nobreak|370 bar| the curve is bent. With both pistons still delivering into the
system the pressure cannot exceed more than 380 bar. The fact that both
piston cannot increase the pressure above a certain value point to a leak on
the second piston side. In this case a leaky piston seal.
189
Figure 65
The pressure profile shows a pressure drop at the upper limit. The modified
test showed that the leak appears at more than 370 bar. Therefore the two
plateaus cannot show the malfunction. At the upper limit the outlet ball valve
is closed which indicates that the problem is on the second piston side. In
this case the flow test method cannot clearly identify the leaky seal. The
modified test is needed in addition.
190
Figure 66
Both plateaus for piston 1 and piston 2 and the upper limit of the test show a
certain pressure drop. Here it is very obvious that the problem is on the
second piston side. In this case it is the second piston seal.
191
Pressure Tests - Defective Piston 1
Figure 67
Modified Pressure Test - Defective Piston 1 (Stroke AUTO)
The pump is working with the default stroke (AUTO) setting. The flow is
reduced to 0.1 ml/min at approximately 260 bar. The pressure moves up to
the upper pressure limit in a oscillating curve. At the upper limit the pressure
remains stable. One of the two pistons generates a small leak when delivering
(pressure drop). The stable pressure line at 400 bar points to a problem on
the first piston side. Firmware revision 3.0 allows to verify that the pressure
drop appears on piston 1.
N OT E
When the piston is scratched in a certain part the failure cannot be always
detected when using the default stroke setting. Therefore the test should be
done also with a stroke of 100 µl.
192
Figure 68
Modified Pressure Test - Defective Piston 1 (Stroke 100 µl)
Here the pressure test has been done with a stroke of 100 µl. The pressure
profile gives additional information to the previous plot. When delivering
with the small flow rate the pressure increases for a long time but drops only
for a relatively short time. With the currently active display of firmware
revision 3.0 it can be seen that the pressure drops while the first piston is in
the middle of its stroke. This indicates that the piston itself is the source of
the problem. The test checks the pressure tightness of the seal over the full
length of the piston.
193
Figure 69
Pressure Test (Rev. 1.0) - Defective Piston Seal 1
Before the pressure reaches the two plateaus there is always a pressure dip
when the piston change there direction. Before the pressure reaches the
upper limit an oscillating curve can be seen. At the upper limit the pressure is
stable. All this indicates that the pump is not working correctly but it is very
difficult to locate the source of the problem.
194
Figure 70
Pressure Test (Rev. 3.0) - Defective Piston 1
The pressure increases in an oscillating curve. When exceeding 270 bar
piston 2 delivers with one large stroke into the system and increases the
pressure by more than 40 bar. This points already to a problem on the first
piston side. Now piston 1 delivers into the system increases the pressure for
a short time and then the pressure decreases for the whole plateau. The
second plateau looks quite normal and also the upper value when reached
after some pressure dips is stable. It is quite obvious that the problem is on
the first piston side. In this case the piston is defective.
195
Pressure Tests - Defective Piston 2
Figure 71
Modified Pressure Test (Stroke AUTO) - Defective Piston 2
Even with the reduced flow of 0.1 ml/min the pistons deliver with constant
rate into the system. After reaching the upper pressure value a continuous
pressure drop occurs. This indicates a problem. Therefore the test was
repeated with a stroke of 100 µl.
196
Figure 72
Modified Pressure Test (Stroke 100 µl) - Defective Piston 2
This pressure profile shows a totally different behavior then the previous
one. There are already pressure drops when the flow is 1.0 ml/min and the
piston change there directions. When the flow is reduced to 0.1 ml/min the
pressure drops with each stroke of the pistons until it is zero. With firmware
revision 3.0 it can be checked that the pressure drops appear on both pistons
but that the slight pressure increase is generated by piston 1. The piston is
scratched in its lower part. Delivering with a small stroke volume into the
system generates no problem. With the maximum flow rate of 100 µl the
scratched part has to move through the seal and is obviously leaking.
197
Figure 73
The both pressure plateaus cannot be reached but when switching to the part
where the instrument uses a stroke volume of 4 µl the pressure increases up
to its normal value. At the upper limit a slight leak rate is visible. The
scratches in the lower part of the piston are not visible when the pump is
working with its small stroke volume.
198
Figure 74
The pressure profile looks very strange. In the first part the pressure
increases up to approximately 320 bar and than it drops down to about
100 bar with normal behavior of the two plateaus and afterwards an increase
of the pressure to 400 bar with a slight pressure decrease at the upper limit.
Before reaching the first plateau the second piston performs one large (80 µl)
stroke. At this point the pressure drops. When the piston is moving only with
the upper part through the seal no leak can be seen. But when the scratched
part of the piston moves through the seal the system is no longer tight and the
pressure drops. At the low pressure value the system is still tight and
therefore the plateaus show no problem. The pump then reaches the upper
limit with 250 µl and a stroke volume of 20 µl. Here the piston uses again only
the unscratched part of the piston.
199
Pressure Tests - Defective Active Inlet Valve
Figure 75
Modified Pressure Test - Defective Active Inlet Valve
With the reduced flow rate of 0.1 ml/min the pressure increases slowly in an
oscillating curve until the upper limit is reached. At the upper limit the
pressure is stable pointing onto a problem on the first piston side. The
actively current piston display of firmware revision 3.0 shows that the
pressure drop is on the first piston side.
200
Figure 76
Pressure Test (Rev. 1.0) - Defective Active Inlet Valve
The test fails completely. The pressure in the system cannot be increased to
reach the plateaus at a pressure of more than 100 bar. Also the rest of the test
does not reach useful pressure values. Therefore the test provides no
information about the problem in the system.
N OT E
In such a case the pump can be troubleshooted in the following way. Move the
solvent inlet tubing out of the bottle and let the pump draw a large air bubble
(for example 5 cm in the tubing). In a normal working pump the bubble will
move during the intake stroke of piston 1 and will stop when the first piston is
delivering into the system. If the active inlet valve is internally leaky the air
bubble will move forwards during the intake stroke and the whole time
backwards when the piston is delivering into the system.
201
Figure 77
Pressure Test (Rev. 3.0) - Defective Active Inlet Valve
Also the new version of the test fails. The pressure in the system cannot be
increased to the two plateaus (>270 bar). The pressure in the system
stabilizes below that value. The pump can be troubleshooted as described
before.
202
8
8
Pumps: Maintenance Information
This chapter provides provide procedures for
service and maintenance of the 1050 Pumps
This section provides information on the procedures used for maintenance
replacement and alignment of assemblies in the pump. You will find
procedures for:
• Solvent Cabinet and Column Heater
❏ Heat Exchanger
❏ Solvent Cabinet Cable Assembly
• Pump Mainframe
❏ Active Inlet Valve
❏ Outlet Ball Valve
❏ Frit Adapter Assembly
❏ Purge Valve
❏ Pump Head Assembly
❏ Continuous Seal Wash
❏ Fan
❏ Metering Drive Assembly
204
Replacing the Heat Exchanger
❏ Open column heater door and disconnect all capillaries from the heat
exchanger.
❏ Using a flat screw driver loosen the solvent cabinet screws.
❏ Carefully take out the front panel with helium valves and manual injection
valve and place on top of the solvent module.
❏ Move the insulation out of its position and take it out.
❏ Take out the plastic heat shield.
❏ Disconnect the heater flex cable from the zero insertion force connector
on the cable board.
N OT E
Pull the outer sleeve of the connector to its front position. This releases the
tension from the cable and it can be removed from the connector without
problem.
❏ The heat exchanger holding screws are accessible from underneath the
solvent module. Therefore move the module above the table and remove
the two screws with the washers.
❏ Take the heat exchanger out of the column heater compartment.
❏ Place the new heat exchanger assembly into the column heater
compartment. Place the washers onto the screws and fix the heat
exchanger assembly in its position.
❏ Insert the flex cable into the zero insertion force connector and push the
sleeve back to fix the cable in its position.
❏ Insert the heat shield into the compartment.
❏ Place the insulation into the heat shield and carefully press it into its
position. Make sure that the parts are inserted underneath the plastic ledge
at the back panel of the compartment.
205
❏ Slide the front base back into its guiding slits. Assure that the front edge of
the plastic heat shield is guided into the gap between the front panel and
the connected metal panel.
❏ Tighten the two solvent cabinet screws.
❏ Reinstall all capillaries at the column heater assembly.
Replacing the Cable Assembly
❏ Follow the above mentioned steps for replacing the heat exchanger
assembly.
❏ Remove bottle tub and solvent bottles from the cabinet.
❏ Remove the front base by pushing the plastic knobs from underneath the
solvent cabinet and slide it out of the instrument.
❏ Put the solvent cabinet onto the side loosen the cable holding screw at the
back of the module and slide the cable out of the position.
❏ Loosen the screw which fixes the cable connector board in its position and
slide the board out of the recess.
❏ Remove the tape which fixes the multi color LED.
❏ Put the solvent cabinet onto the side and move the cable assembly through
the holes in the back panels to get it out of the solvent cabinet.
❏ Place the new cable assembly into the solvent cabinet that the board is
located in the column heater compartment.
❏ Slide the board into its recess place the end of the cable insulation under
the washer and tighten the holding screw.
N OT E
Do not clamp the single wires of the cable.
❏ Fix the multi color LED with a piece of tape in the groove.
❏ Reinsert the base plate and fix it with the two plastic knobs. Make sure that
the LED is positioned correctly and that the cables are not clamped.
N OT E
The rear end of the front base must fit into the recess at the back panel of the
compartment.
❏ Reinstall the heat exchanger assembly by following steps described in
section replacing the heat exchanger assembly.
206
❏ Remove the ESD cover.
❏ Disconnect the solenoid cable from the connector board.
❏ Loosen the screw which holds the shield cable and unplug the spade lug.
❏ Disconnect the active inlet valve inlet tubing.
❏ Using the supplied 12 mm wrench (8710-1841) loosen the valve and
remove it.
N OT E
It is recommended to insert a new gold seal into the plastic cap when changing
the active inlet valve.
❏ Place new inlet seal into the plastic cap and fix it onto the valve.
❏ Insert the active valve and screw it hand tight. In this position counter hold
the screw with the wrench. By hand turn the solenoid itself in either
direction until the capillary connection hole is about 60° to 90° away from
its final position.
Figure 78
Valve Final Position (Pump head disassembled)
207
❏ Using the 12 mm wrench tighten the screw of the valve by turning the
assembly in its final position (should not be more than a quarter turn).
Make sure that the ESD cover and the solvent sucking tube can be installed
with the valve in its position.
❏ Fix the spade lug of the shield cable in its position and reconnect the
solenoid cable to the connector board.
N OT E
If the active inlet valve is installed in an instrument without connection for the
shield connector connect the spade lug to the holding screw of the connector
board.
❏ Connect the valve inlet tube to the active inlet valve.
❏ Install the ESD cover
❏ Perform the pressure tests to verify tightness of the system.
208
Replacing the Outlet Ball Valve
Replacing the Outlet Ball Valve
❏ Using the 14 mm wrench (8710-1924) loosen the valve screw and remove it.
N OT E
It is recommended to insert a new gold seal into the seal cap when the same
valve will be used again.
❏ Before inserting a new valve check for correct center position of the cap
with the gold seal.
❏ Insert the valve into the pump head and screw it hand tight. Fix the valve
by turning another quarter turn with the 14 mm wrench.
N OT E
The plastic cover should always be installed. This prevents loosing the holding
screw when disassembled and does not allow to damage the outlet ball valve
by tightening at the cartridge itself.
❏ Perform the pressure tests to verify the tightness of the system.
209
❏ Using the 14 mm wrench (8710-1924) loosen the frit adapter assembly and
remove it.
❏ Remove the cap (6) with the gold seal (5) and take out the dirty frit (4).
❏ Clean the adapter chamber from all particles. Best is to use a degreaser
spray.
❏ Insert the new frit into the adapter. Ensure that the slit of the frit is facing
downwards, otherwise the filter capacity is reduced.
❏ Place cap and gold seal onto adapter.
N OT E
It is recommended to use always a new gold seal when the frit adapter
assembly was removed from the pump head.
❏ Insert the frit adapter assembly into the pump head and screw it hand tight.
Fix the assembly by turning another quarter turn with the 14 mm wrench.
❏ Perform the pressure tests to verify the tightness of the pump.
Figure 79
210
Maintaining the Purge Valve
Maintaining the Purge Valve
Changing the PTFE Frit
❏ Disconnect capillary to injector and waste tube from purge valve outlet.
❏ Using the 14 mm wrench open the purge valve at the hexagonal nut.
❏ For the next steps refer to “Maintaining the Frit Adapter Assembly” on
page 210.
Cleaning the Purge Valve
N OT E
Leaks in the purge valve can be due to particles (for example salt
precipitation) between seat and ball. Therefore the cleaning procedure should
be performed before replacing the whole valve.
❏ Remove the purge valve from the pump head as described before.
❏ Open the purge valve counter clockwise until the had screw (6) is loose.
N OT E
Do not open the securing ring on top of the hand screw and do not change the
seat.
❏ Clean the upper and lower part in a ultrasonic bath using methanol or
isopropanol.
❏ Re-assemble the purge valve parts and re-install purge valve.
Figure 80
Purge Valve
211
Maintaining the Pump Head Assembly
Maintaining the Pump Head Assembly
There are two different versions of the pump head available. In the latest
version the spring is integrated in the plunger housing. The following table
shows the serial number prefix at introduction of the new plunger housing
design.
Table 45
Pump Head Versions
Pump
SN Prefix
Procedure
79851A
3447 G .....
2
79852A/B
3447 G .....
2
79851A
3448 A .....
2
79852A/B
3448 A .....
2
212
Procedure 1: Pump Head with old Plunger
Housing
N OT E
The pump head has two identical channels. When disassembling the pump
head it is advisable not to interchange the parts of each channel for better
failure identification.
N OT E
Since introduction of the new plunger housing design the old plunger housing
parts are no longer available. The new parts are fully compatible to all existing
pump heads.
Stage 1: Removing the Pump Head Assembly
❏ Disconnect all four capillaries from the pump head assembly.
❏ Remove the ESD cover and disconnect the cable of the active inlet valve.
❏ Remove the two pump head screws and take out the pump head assembly.
Stage 2: Disassembling the Pump Head assembly
❏ Place the assembly on the head and remove the three holding screws.
❏ Carefully separate the head from the plunger housing.
C A UT I O N
Do not twist the parts while separating. This could break the sapphire plunger.
213
Stage 3: Replacing the Seals
❏ Remove the two seal keeper (8) or the support seal assembly (7a).
❏ Using the three millimeter hexagonal key remove the two seals (9).
❏ Remove the two wear retainer (10).
❏ Clean the pump head chamber from all seal particles. Best is to use a
degreaser spray.
❏ Place new wear retainer (10) into the pump chambers.
❏ Insert new seals (9).
❏ Place the two seal keeper (8) onto the seal. The support seal assembly will
be installed onto the plunger housing.
Figure 81
Pump Head Assembly
214
Stage 4: Disassembling the Plunger Housing
WA R N I N G
The very strong spring will catapult the adapter up when released
without holding it down.
❏ Remove the two support rings (1) or the support seal assembly.
❏ Hold the adapter (2) down on a table and loosen the setscrew (3) of one of
the plungers (5). Carefully release the tension of the spring.
❏ Proceed with the second plunger in the same way.
Figure 82
Plunger Housing
215
Stage 5: Reassembling the Plunger Housing
❏ Place the plunger keeper (6) on a table and insert plunger (5) and spring
(4).
❏ Take the plunger housing (2) and place it on top of the spring (4).
N OT E
Make sure that the spring (4) does not stick before the top of the housing (2).
❏ Press the housing (2) down over the plunger keeper (6) and when flat on
the table tighten the setscrew (3).
N OT E
The plunger keeper (6) should not stick out of the bottom of the plunger
housing (2).
❏ Proceed in the same way for the second plunger.
❏ Slide the two support rings or the support seal assembly onto the plungers
but do not try to press it in its position.
N OT E
If the support ring or the support seal assembly (1) sticks at the housing (2)
carefully push the plunger from the bottom. This will center the plunger and
the support ring slides into its final position.
Check the alignment by lifting the support ring out of its position. Release the
support ring and check that it slides back in its position without sticking.
The support seal assembly should be installed onto the plungers as described
before.
216
Stage 6: Reassembling the Pump Head Assembly
See Figure 81 on page 214.
❏ Prepare the head and the plunger housing as described beforehand.
N OT E
The seal keeper (8) should be installed on the head in front of the seals. In this
position they guide the plunger into the seal and reduce the possibility of
breaking the plunger during the assembling of head and plunger housing.
❏ Mount the plunger housing onto the head. The guiding pins prevent
incorrect mounting.
❏ Grease the three screws with the white Teflon lubricant (79841-65501).
❏ Insert the three screws and tighten them stepwise with increased torque.
Observe the slit between the two parts and make sure that they are in
parallel to each other.
Stage 7: Mounting the Pump Head Assembly
❏ Place the pump head assembly onto the two stay bolts of the metering
drive. Make sure that no capillary sticks between pump head and metering
drive.
❏ Put a light coating of white Teflon grease onto the mounting screws.
❏ Insert the two screws and tighten them crosswise.
❏ Reinstall the capillaries to the valves and the connector screw.
❏ Reconnect the active inlet valve connector and fix the shield to ground.
217
Procedure 2: Pump Head with new Plunger
Housing
N OT E
The pump head has two identical channels. When disassembling the pump
head it is advisable not to interchange the parts of each channel for better
failure identification.
Stage 1: Removing the Pump Head Assembly
❏ Disconnect all four capillaries from the pump head assembly.
❏ Remove the ESD cover and disconnect the cable of the active inlet valve.
❏ Remove the two pump head screws and take out the pump head assembly.
Stage 2: Disassembling the Pump Head Assembly
❏ Place the assembly on the head and remove the three holding screws.
❏ Pull the block straight up from the head being careful not to put any
sidewards strain on the sapphire pistons since they could shear and break.
❏ Put the plunger housing aside taking care to avoid dropping the pistons
from the plunger housing.
N OT E
The pistons are not secured in the plunger housing and will fall out when the
housing is turned upside down.
❏ Remove the pistons from the plunger housing.
❏ Check for scratches and dirt on the piston.
N OT E
Dirt can be removed by using a small quantity of tooth paste.
218
Stage 3: Replacing the Seals
❏ Remove the two support seal assemblies.
❏ Using the three millimeter hexagonal key remove the two seals.
❏ Remove the two wear retainer.
❏ Clean the pump head chamber from all seal particles. Best is to use a
degreaser spray.
❏ Place new wear retainer into the pump chambers.
❏ Insert new seals.
❏ Place the two support seal assemblies onto the seal.
Figure 83
Pump Head Assembly (new plunger housing design)
219
Stage 4: Reassembling the Pump Head Assembly
❏ Prepare the head as described beforehand.
❏ Place the plunger housing without the pistons onto the head.
❏ Tighten the three socket head screws hand tight.
N OT E
Tightening the screws fully will require much more force to insert the pistons
into its position in the seals.
❏ Insert the pistons into the assembly and carefully push it into the seal.
❏ Tighten the three screws stepwise with increasing torque. Make sure that
the head and plunger housing surfaces are in parallel.
Stage 5: Mounting the Pump Head Assembly
❏ Place the pump head assembly onto the two stay bolts of the metering
drive. Make sure that no capillary sticks between pump head and metering
drive.
❏ Put a light coating of white Teflon grease onto the mounting screws.
❏ Insert the two screws and tighten them crosswise.
❏ Reinstall the capillaries to the valves and the connector screw.
❏ Reconnect the active inlet valve connector and fix the shield to ground.
220
Continuous Seal Wash Option
Continuous Seal Wash Option
N OT E
The previous described procedures for the pump heads are also applicable for
the seal wash option. This procedure will only describe the secondary seal
replacement.
❏ Remove the pump head assembly and disassemble it following stage 1 and
stage 2.
❏ Remove the two support rings from the plunger housing.
❏ Remove the gasket from the support ring.
❏ Using the tool from the upgrade kit (01018-23702) remove the wash seal.
❏ Place the new seal onto the tool and insert the new wash seal into the
support ring. Ensure that the wash seal clicks into place in the support
ring.
Figure 84
Pump Head with continuous seal wash
221
Replacing the Fan
Replacing the Fan
❏ Remove the top cover.
❏ Disconnect the fan cable at the motherboard.
❏ Lift the foam part at the left side of the module and slide it out to the front.
❏ Carefully remove the fan from the foam part (one edge after the other).
N OT E
In case it is not possible to get the fan out of the foam cut the foam part at the
back side between the two naps.
❏ With the blade of a screwdriver separate the protection cover from the fan.
❏ Insert the new fan into the foam part. The air stream should be into the
module (arrow pointing down). Cable should show to the back.
❏ Place the fan protection cover onto the new fan.
❏ Place the foam part into its place.
N OT E
The foam part must be inserted into the chassis and must be replaced close to
the back panel. Make sure that the upper foam part fits behind the ridge of the
bottom part. It might be more convenient to replace the foam part when the
motor plug is disconnected.
222
❏ Remove the pump head assembly.
❏ Remove the foam part with the fan.
❏ Disconnect the three cable of the metering drive.
❏ Unscrew the three holding screws of the base of the metering drive.
N OT E
The third screw is accessible through the bottom foam part.
❏ Move the motor of the metering drive out of the foam part and take it out.
223
224
9
9
Pumps: Parts Information
This chapter provides information on parts of the
1050 Pumps
This chapter gives complete parts listings and exploded views for the
HP 1050 (Ti) Pumps.
• Electronic Boards
• All Ti - Parts
• Solvent Cabinet
• Overall Diagram
• Flow Path
• Metering Drive Assembly
• Pump Head Assemblies
• Active Inlet Valve
• Outlet Ball Valve
• Frit Adapter Assembly
• Purge Valve Assembly
• Special Tools
226
Electronic Boards
Electronic Boards
For fuses refer to Table 47 on page 228.
Table 46
Electronic Boards
Item
Description
Part Number
1 Power Supply Board
DPS-B 5061-3374
2 Pump Drive Control 2 Board
PDC2
Exchange PN
01050-69374
01018-66532
# U 78 MC78L15ACP
1826-0274
# U 79 MC79L15ACP
1826-0281
3 Relative A/D Converter
RAD
01018-66503
01018-69503
4 Firmware Board
SFW
01018-66506
5 Heater Isocratic Board
HRI
01018-66517
6 Heater Quaternary Board
HRQ
01018-66518
01018-69518
7 Communication Interface Board
CIB
5061-3382
01050-69582
8 Common Main Processor Board
CMP
5061-3380
01050-69580
9 Fluorescent Indicator Module
FIP
5061-3376
10 Connector Board
CON
01018-66505
11 Motherboard
HPS
01018-66501
# U 78 and U 79 have to be replaced when a new metering device
01018-60001/-69100 (parts included) is installed in a pump with PDC board
revision A.
227
Electronic Boards
Table 47
Fuses
Description
Board
Part Number
Fuse 110V operation (3 A)
DPS-B
2110-0003
DPS-B
2110-0002
Fuse F16 (PDC); F481 (PDC2) 1.5 A
PDC2
2110-0304
Fuse F891, F892 on board 500 mA
PDC
2110-0934
Fuse F112, F113 on board 500 mA
PDC2
2110-0934
Fuse F12, F22 250 mA
RAD
2110-0004
Fuse F4 2.5 A
HRI, HRQ
2110-0083
Fuse F15 1 A
HRQ
2110-0007
Fuse ICP1 1 A
FIP
2110-0099
Fuse F1 375 mA
CON
2110-0421
228
Complete List of Ti-Parts
Table 48
Description
Part Number
Description
Part Number
Ti - Pump Head Assembly
01019-60002
Ti - Capillary ID 0.17 35 cm lg
01019-87608
Ti - Pump Chamber Housing
01019-25205
Ti - Active Inlet Valve
01019-60010
Accessories
Ti - Piston Seal
0905-1199
PCTFE - Adapter
5021-1872
Ti - Damping Unit
01019-60005
Ti - MCGV
01019-67701
Ti - Maintenance Kit
01019-68724
Ti - Manual Injection Valve
obsolete
includes:
Ti - Rotor Seal Tefzel
0101-0620
Ti - Piston Seal (2x)
0905-1199
Ti - Stator
0101-0663
PTFE Frits 5/PK
01018-22707
Ti - Loop Capillary 20 µl
0101-0655
Gasket Seal Wash (2x) 6/pk
5062-2484
Ti - Bottle Head Assembly
obsolete
Seal Wash (2x)
0905-1175
Ti - Bushing
01019-21734
Seal Gold Outlet (5x)
5001-3707
Solvent Glass Filter
Adapter
5041-2168
5062-8517
Cap Outlet (5x) 4/pk
5042-1346
Ti - He - Sparge Assembly
01019-82702
Ti - Screw Tube
01019-23232?
Ti - High Pressure Solvent Filter Kit
01019-68709
Ti - Name Plate
includes:
Ti - Capillary Piston 1 260 mm lg
01019-67301
01019-87308
Ti - Capillary Piston 2 210 mm lg
01019-67302
Ti - Fitting Insert (2x)
01019-27601
Ti - Tubing ID 0.25 mm 700 mm lg
01019-67305
Fitting Nut (1x)
79900-25701
Ti - Sucking Tube
see item 13
Fitting Screen (1x)
79900-22401
Fitting Insert (1x)
01019-27601
229
Solvent Cabinet
Solvent Cabinet
Table 49
Solvent Conditioning Module
Item Description
Part Number
Item Description
Part Number
1 Solvent Compartment incl. (2)
01018-60019
11 Holder He-Valves
01018-05501
2 Bottle Tub
no PN
12 Washer
5001-3746
3 Front Panel
no PN
13 Screw
0624-0045
Cover Cap, no injection valve
6960-0024
14 Injector Tub
01018-44503
Cover Cap, no Helium on/off
valve
6960-0027
15 Screw M3 4 mm lg
0515-1508
16 Capillary ID 0.17 400 mm lg
79826-87608
16 Ti - Capillary ID 0.17 35 cm lg
01019-87608
Cover Cap, no Helium Regulators 6960-0028
4 Front Base
01018-40512
5 Oven Door
01018-60302
6 Bolt
01018-43701
7 Door Hinge
01018-45101
Angle Injection Position (part of
Sensor Assembly)
01018-00511
8 Name Plate
5041-2170
Sensor Assembly
5062-2432
Screw lock female (2x)
1251-7788
Washer M4 (2x)
3050-0893
9 Tubing Flexible ID 4 mm OD 5 mm
10 Funnel Leak
01018-43211
230
17 Accessory Kit, includes following 01018-68704
items
Solvent Cabinet
Figure 85
Solvent Cabinet
231
Solvent Cabinet with Helium Degassing
Table 50
Item Description
Part Number
Item Description
Part Number
1 Solvent Compartment, incl. (2)
01018-60019
14 Solvent Bottle, 1 liter
9301-0656
2 Front Panel
no PN
15 Bottle Head Assembly,
includes item 16 to 25
01018-60017
3 Holder He-Valves
01018-05501
15 Ti - Bottle Head Assembly,
01019-60017
4 Screw
0624-0045
16 Bottle Head Cap
01018-44111
5 Washer
5001-3746
17 Bottle Head Shaft
01018-43711
6 Regulator Knob A
01018-47413
18 Bottle Head Washer
01018-48811
Regulator Knob B
01018-47414
Regulator Knob C
01018-47415
19 Connector Helium Sparger (6/pk) 5062-8515
Regulator Knob D
01018-47416
20 Helium Sparger 10-16 µl
5041-8339
7 Knob On/Off
01018-47412
21 Solvent Filter SST
01018-60025
8 Helium Regulator Assembly,
includes item 6 an 7
01018-67001
21 Solvent Glass Filter
Adapter
5041-2168
5062-8517
9 Tubing PTFE ID 1/16” OD 1/8”
0890-0746
22 Tube Bushing Teflon
79835-21734
10 Fitting
0100-1430
22 Ti - Bushing
01019-21734
11 Tubing Flexible ID 0,156”
0890-0581
23 Tube Screw
5041-2163
12 Fitting
0100-1047
24 Tubing FEP ID 1.5 mm OD 3 mm
5 m
5062-2483
25 Tubing PTFE ID 1.45 mm
OD 2.5 mm 5 m
5062-2461
Filter Disc (part of 12)
13 Air Tubing Flexible 5 m
232
Helium Sparge Assembly,
includes item 19 and 20
01019-82702
5021-7127
Figure 86
233
Solvent Cabinet with Column Heater and Manual Injection Valve
Solvent Cabinet with Column Heater and
Table 51
Item Description
Part Number
1
Solvent Compartment, incl. (2)
01018-60019
2
Front Panel
no PN
3
Plug
4
Item Description
Part Number
Rheodyne Valve 7125 complete,
0101-0607
22
Isolation Seal
1535-4046
01018-44103
23
Rotor Seal Vespel
0101-0623
Cable Assembly Heater
01018-61600
23
(Ti) Rotor Seal Tefzel (high pH)
0101-0620
5
Washer
5001-3746
24
Stator Face Assembly
no PN
6
Screw M4 6 mm lg
0515-0915
25
Stator (Head)
1535-4044
7
Heater Assembly
01018-66901
25
Ti - Stator (Head)
0101-0663
8
Washer
3050-0893
26
Loop Capillary 20µl
0101-0377
9
Screw M3 16 mm lg
0515-0986
26
0101-0655
10
Insulation
01018-45401
27
Stator Screw
1535-4857
11
Heat Shield
01018-40601
28
Connector Capillary
no PN
12
Front Base
01018-40512
29
Valve Transport Protection
no PN
13
Oven Door
01018-60302
30
Capillary ID 0.17 400 mm lg
79826-87608
14
Bolt
01018-43701
30
01019-87608
15
Door Hinge
01018-45101
31
Tubing ID 0.25 mm 700 mm lg
01018-67305
16
Waste Vial
9301-1168
31
Ti - Tubing ID 0.25 mm 700 mm lg
01019-67305
17
Vial Holder
01018-44901
32
Sensor Assembly
5062-2432
18
Holder He-Valves
01018-05501
33
Remote Cable
5061-3378
19
Screw
0624-0045
Syringe 25 µl
9301-0633
20
Washer
5001-3746
Needle 10-100 µl
9301-0679
21
Angle Injection Position
01018-00511
234
Figure 87
235
Overall Diagram
Overall Diagram
Table 52
Overall Diagram
Item Description
Part Number
Item Description
Part Number
1 Fan Grill
3160-0544
35 Screw (plastic) for MCGV
0515-1256
2 DC Fan
01048-68500
36 no longer used
no PN
3 Cooling Drain
01018-47706
37 no longer used
no PN
4 Push Button, white
5041-1203
38 no longer used
no PN
5 Power Actuator
5041-2162
39 Leakage Tray right
01018-44502
6 Spring Compression
1460-1510
40 High Pressure Damper
79835-60005
7 Cover Hinge
5041-2147
41 Active Inlet Valve
01018-60010
8 Sheet Metal Kit
01018-68701
42 Frit Adapter Assembly
01018-60007
9 Foot Front
5041-2161
42 Purge Valve
G1311-60009
10 Cable to Connector Board
5062-2416
43 Adapter short
01018-23207
11 Connection Tube 150 mm lg
G1311-67304
44 Outlet Ball Valve
G1311-60008
12 MCGV
Exchange
79835-67701
79835-69701
45 Metering Drive Assembly
01018-60001
13 Connector Board
01018-66505
46 Pump Head Assembly includes
item 41 to 44
01018-60004
14 Front Plate
01018-04106
47 Pump Plate
01018-04704
15 Leakage Tray, left
01018-44501
48 Capillary Piston 1 ID 0.5 27 cm lg 01018-67309
16 Leak Sensor
5061-3356
17 Logo Base
5041-2144
50 Power Supply (DPS-B)
Exchange
5061-3374
01050-69374
18 Name Plate
5041-2170
51 PDC2 Board
01018-66532
19 Front Door
01018-60301
52 SFW Board (Firmware)
01018-66506
20 Power Switch Base
5041-2145
53 RAD Board
Exchange
01018-66503
01018-69503
236
Overall Diagram
Table 52
Overall Diagram
Item Description
Part Number
Item Description
Part Number
21 ESD Cover
01018-44106
54 HRI Board
01018-66517
22 Cover Keyboard
5001-3736
54 HRQ Board
01018-66518
23 Leak Assembly, includes item 24, 5062-8551
25, 26
56 Motherboard
01018-66501
27 Keyboard Module
01018-60201
57 Cover Plate P/S
5001-3728
28 Fluorescent Interface
5061-3376
58 Top Cover
5001-3724
29 Cable to Display Board
5061-3400
59 Plate Cover, 1.5 inch
5001-3722
30 Screw M3.5 6 mm lg
0515-0889
60 Plate Cover, 1.3 inch
5001-3721
31 Bumper
0403-0427
61 Card Cage
no PN
32 Screw M4 6 mm lg
0515-0898
also for AIV ground cable
0515-0887
33 Screw M4 20 mm lg (special)
0515-1918
34 Screw M3 8 mm lg
0515-0912
Screw, ESD cover
5021-1862
237
Overall Diagram
Figure 88
Overall Diagram Part 1
238
Overall Diagram
Figure 89
Overall Diagram Part 2 (Pars II)
239
Hydraulic Flow Path
Hydraulic Flow Path
Table 53
Hydraulic Flow Path Quaternary Pump
Item Description
Part Number
1 Drawing Tubing consists of
Item Description
Part Number
no PN
Gripper MCGV
0100-1431
Solvent Filter SST
01018-60025
Connector MCGV
0100-1432
Helium Sparger 10-16 µl
5041-8339
Ferrule, inlet valve 20/pk
5061-3321
Connector Helium Sparger (6/pk) 5062-8515
Gripper, inlet valve 20/pk
5061-3322
Tubing FEP ID 1.5 mm OD 3 mm
5 m
5062-2483
Male, inlet valve 20/pk
5061-3323
Tube Bushing Teflon
79835-21734
Buffer Disc, inlet valve 40/pk
5061-3324
Screw Tube
5041-2163
3 Ti - Capillary Piston 1 260 mm lg 01019-67301
1 Ti - Drawing Tubing, consists of
no PN
Adapter
5041-2168
5062-8517
4 Ti - Capillary Piston 2 210 mm lg 01019-67302
5 m
5062-2483
5 Tubing ID 0.25 mm 700 mm lg
Ti - Bushing
01019-21734
5 Ti - Tubing ID 0.25 mm 700 mm lg 01019-67305
Screw Tube
5041-2163
6 Teflon Tubing ID 1 mm OD 3 mm 0890-1764
G1311-67304
7 Tubing PTFE ID 1.45 mm
OD 2.5 mm 5 m
2 Connection Tube, consists of
01018-67305
5062-2461
Flex Tubing PTFE ID 0.7 mm5 m lg 5062-2462
240
Hydraulic Flow Path
Table 54
Hydraulic Flow Path Isocratic Pump
Item Description
Part Number
2 Drawing Tubing, consists of
01018-67303
Item Description
2 Ti - Drawing Tubing, consists of
Part Number
01019-67303
Solvent Filter SST
01018-60025
Adapter
5041-2168
5062-8517
5 m
5062-2483
5 m
5062-2483
Nut
79835-25731
Nut
79835-25731
Screw Tube
79835-23231
Ti - Screw Tube
01019-23232
241
Hydraulic Flow Path
Figure 90
Hydraulic Path
242
Table 55
Item Description
Part Number
Item Description
01018-60001
5 Bumper
5021-1839
01018-69100
0515-0887
1 Cover
01018-44102
7 Pump Plate
01018-04704
0515-0894
8 Screw M4
5021-1841
4 Stay Bolt
01018-23704
3 Metering Drive Assembly
Exchange Assembly,
includes item 1, 2, 4, U78 and
U79 for PDC board rev. A
Figure 91
Part Number
243
Pump Head Assembly (old version)
Table 56
Item Description
Part Number
Complete Assembly
Item Description
01018-60004
1 Plunger Keeper
Part Number
11 Pump Chamber Housing
01018-25203
12 Screw M5 50 mm lg
0515-1220
2 Sapphire Plunger
5063-6586
01018-60010
1460-2220
14 Adapter short
01018-23207
4 Screw M4 40 mm lg
0515-0850
15 Outlet Ball Valve
G1311-60008
5 Plunger Housing
see page 245
6 Set Screw M3 8 mm lg
0515-1917
Tools
7 Support Seal Assembly
5001-3739
Wrench 12 mm
8710-1841
8 Seal Keeper
part of (7)
Wrench 14 mm
8710-1924
9 Plunger Seal (2/Pk)
5063-6589
Insert Tool Seals
01018-23702
5064-8249
Teflon Grease
79841-65501
10 Wear Retainer (10/pk)
Figure 92
Pump Head Assembly (old version
244
Pump Head Assembly (new version)
Table 57
Item Description
Part Number
Complete Assembly
01018-60004
Item Description
9 Adapter short
Part Number
01018-23207
1 Sapphire Plunger
5063-6586
01018-60010
2 Screw M4 40 mm lg
0515-0850
0515-1220
3 Plunger Housing
01018-60006
Tools
5001-3739
Wrench 12 mm
8710-1841
5063-6589
Wrench 14 mm
8710-1924
5064-8249
Insert Tool seals
01018-23702
7 Outlet Ball Valve
G1311-60008
01018-25203
Teflon Grease
79841-65501
Figure 93
245
Pump Head Assembly with Seal Wash
Table 58
Item Description
Part Number
Item Description
Part Number
Complete Assembly
01018-60005
17 Sapphire Plunger
5063-6586
Ti - Complete Assembly
01019-60002
18 Plunger Keeper
no PN
1 Screw M5 50 mm lg
0515-1220
19 Plunger Housing
01018-60006
01018-60010
2 Ti - Active Inlet Valve
01019-60010
Tools
3 Adapter short
01018-23207
Wrench 12 mm
8710-1841
01018-25203
Wrench 14 mm
8710-1924
4 Ti - Pump Chamber Housing
01019-25205
Insert Tool, seals
01018-23702
5 Outlet Ball Valve
G1311-60008
Teflon Grease
79841-65501
5064-8249
5063-6589
Accessories
7 Ti - Seal
0905-1199
8 Seal Keeper
5001-3743
Seal Wash Option Update Kit
includes tubing, seals (2x),
support ring (2x) and items #
9 Gasket, seal wash (6/Pk)
5062-2484
# Syringe
9301-0411
10 Seal Wash
0905-1175
# Adapter Luer (3x)
0100-1681
11 Support Ring Seal Wash
5062-2465
# Abrasive Paper TP 240
01018-68722
12 Teflon Tubing ID 1 mm OD 3 mm 0890-1764
# Insert Tool Seal
01018-23702
0515-1917
# Seal Keeper (item 8) (2x)
5001-3743
14 Plunger Housing (old version)
order 19
0515-0850
Velocity Regulator (3/pk)
5062-2486
1460-2220
246
Figure 94
247
Active Inlet Valve
Active Inlet Valve
Table 59
Active Inlet Valve
# Description
Figure 95
Part Number
AIV Assembly, complete
01018-60010
Ti - AIV Assembly, complete
01019-60010
1 Cap Inlet Valve
01018-21207
2 Gold Seal
5001-3708
3 Retainer Ring, gold coated
5021-1874
Active Inlet Valve
248
Outlet Ball Valve
Outlet Ball Valve
Table 60
Outlet Ball Valve
# Description
Figure 96
Part Number
Outlet Ball Valve Assembly, complete
G1311-60008
Ti - Outlet Ball Valve Assembly, complete
01018-60032
1 Socket Cap
5042-1345
2 Housing Screw
01018-22410
3 Outlet Valve Cartridge
no PN
4 Gold Seal, Outlet
5001-3707
5 Cap
5062-2485
Outlet Ball Valve
249
Table 61
# Description
Frit Adapter Assembly, complete
Figure 97
Part Number
01018-60007
1 O-ring (12/Pk)
5180-4167
2 Housing Screw
01018-22410
3 Adapter
01018-23209
4 PTFE Frit (5/Pk)
01018-22707
5 Gold Seal
5001-3707
6 Cap (4/pk)
5062-2485
250
Table 62
# Description
Purge Valve Assembly, complete
Figure 98
Part Number
G1311-60009
1 Gold Seal
5001-3707
2 Cap (4/pk)
5062-2485
3 PTFE Frit (5/Pk)
01018-22707
4 Tubing PTFE ID 1.45 mm OD 2.5 mm 5 m
5062-2461
251
Table 63
# Description
Figure 99
Part Number
5062-2469
1 Holder Brass
no PN
2 Stand
5001-3738
3 Clamp
no PN
4 Support Block
no PN
252
Special Tools
Special Tools
Table 64
Special Tools
# Description
Part Number
Wrench, 12 mm
8710-1841
Wrench, 14 mm
8710-1924
Insert Tool, Seals
01018-23702
Teflon Grease
79841-65501
253
Special Tools
254
10
10
Pumps: Additional Information
This chapter provides additional information
This section gives information about:
• Pumps Prefix History
• Pumps Firmware History
• Online Monitor
• Operational Hints
• Helium Degassing Principle
• Isocratic Pumps
• Pump Head Assembly
• PDC Board
• HRQ Board
• Wear Retainer
• Flow Test Method
• Method Loading
• Flow Gradients
• Manual Injection Valve
256
Product History
Product History
Since introduction of the 1050 Pumps in 1988 a couple of hardware and
firmware changes have been implemented in production. With most of this
changes the serial number prefix has been changed too. Following is a list of
all prefix changes done in Waldbronn and Little Falls.
Table 65
Product History 79851A and 79852A/B
S/N Prefix
Changes
2813 G .....
Introduction of the 1050 Pumps
2913 G .....
ESD cover added to the gradient valve. Hardware
changes of extrusion and holding bracket for the
MCGV.
2949 G ..... 2949 A.....
Wear retainer installed in front of each seal.
3010 G ..... 3012 A .....
Introduction of the current pump head version. In the
meantime all old pump heads have been updated.
3016 G ..... 3019 A .....
Introduction of firmware revision 3.0 and introduction
of column heater. Introduction of HRI/HRQ Board
(HRQ replaces GVD board).
3031 G ..... 3034 A ... (51A) or Introduction of firmware revision 3.1
3032 A ... (52A)
3045 G .....
Purge Valve added to all quaternary pumps
3106 G ..... 3106 A ... (51A) or New voltage regulators on PDC board (rev B),
3107 A ... (52A)
exchange metering drives require a PDC update.
3117 G ..... 3117 A ... (51A) or Introduction of firmware revision 3.2
3118 A ... (52A)
3206 G .....
Introduction of dedicated seal and hardware
modifications of pump chamber and seal keeper
3243 G .....3244 A...(51A) or
3145 A...(52A)
Introduction of PDC2 board.
257
Product History
Table 65
Product History 79851A and 79852A/B
S/N Prefix
Changes
3312 G .....
Integrated spindle for metering drive assembly
01018-60001
3334 G .....
Support seal assembly replaces support ring and seal
keeper
3404 G ..... 3404 A ... (51A) or Introduction of Damper with new pressure sensor and
3405 A ... (52A)
electronic board (Rev. G)
Table 66
3447 G ..... 3448 A .....
Spring integrated in plunger housing
June 1996
Active Inlet Valve with Exchangeable Valve Cartridge
March 1998
Plunger Housing with new springs available
November 1998
Part Number Change for DC-Fans
September 2001
End of Support of 1050 Isocratic Pump 79851B TI ends
September 30, 2001
Product History Solvent Cabinet
S/N Prefix
Changes
3019 G .....
Solvent Cabinet 79856A/B serialized
3205 G .....
Improvement of Helium Regulators; better regulation
range and tightening behavior.
3216G...
Modification of Bottle Head Shaft of the Bottle Head
Assembly.
258
Firmware History
Firmware History
Revision 1.0
Revision 1.0 was the firmware at introduction of the 1050 Pumps.
Known Problems
In purge mode flow values above 5 ml/min will not be shown on the display.
At higher values the display remains at 5 ml/min but the pump is purging with
the set value.
Revision 3.0
Europe/ICON
SN 3016 G.....
US/Canada
SN 3019 A .....
Revision 3.0 incorporates:
• Communication with the GPIB communication interfaces.
• Support of the column heater.
• Improved flow test method.
Known Problems
1 If a gradient test method is started directly after running the build in flow
test method the gradient might be distorted. Switching the pump off and
on again after a pressure test solves the problem.
2 For applications with system pressures below 30 to 40 bar the lower
pressure limit is not applicable.
3 Internal tests of the DOS workstation (Phoenix) revealed a couple of bugs
in the communication part of the firmware.
259
Firmware History
Revision 3.1
Europe/ICON
SN 3031 G.....
US/Canada
SN 3034 A ..... (for 79851A/B)
SN 3033 A ..... (for 79852A/B)
This firmware revision fixes the bugs encountered with the ChemStation.
Known Problems
Due to an internal timing problem relay contact 1 and 2 may switch
incorrectly when used together in the timetable. Relay contact 2 might be
activated together with contact 1 even when the timetable shows only an
entry for contact 1.
Revision 3.2
Europe/ICON
SN 3117 G.....
US/Canada
SN 3117 A .....
This revision fixes the known bug of firmware revision 3.1.
260
How does the On-line Monitor work
The online monitor is part of the 1050 Pump firmware and checks the
performance of the metering pump. The online Monitor detects appearing
leaks 1st piston leak valve problems valve backflow and checks via
the pressure ripple for gas bubbles in the system gas bubble.
N OT E
The online monitor is a user selectable function and can be enabled or
disabled via the diagnose level in the configuration displays. The online
monitor is only active if the pressure in the pump is above 50 bar.
DIAGNOSIS LEVEL 0 disables the online monitor and none of the following
messages will be generated.
DIAGNOSIS LEVEL 1 turns the online monitor on. Any measured deviation
from the normal operation modes will generate an entry in the logbook.
DIAGNOSIS LEVEL 2 comprises the same functions like level 1 and in
addition lids the not ready LED at the keyboard. The remote output shows the
not ready condition and disables further injections when connected to the
1050 Autosampler.
DIAGNOSIS LEVEL 3 is used for factory adjustment of the metering drive.
261
Normal Operation
The figure below shows the normal pressure profile of the instrument. The
curve is ideal and can only be recorded with a very fast transient recorder. A
normal integrator (339X) is too slow to record the very fast changes of the
curve and shows a smoothed one. However occurring operation problems
can be also seen on a integrator plot. During the delivering strokes of the two
pistons the instrument measures the pressure at the points D1 to D10. Failure
conditions like leaks or gas bubbles influence the pressure curve from which
the processor can determine certain failure modes.
Figure 100
Online Diagnostic: Normal Operation
262
M2 Gas Bubble
The following figure shows the pressure profile when a gas bubble was
drawn from the bottle. During the delivery phase of piston I the gas bubble
will be compressed first before solvent can be delivered into the second
chamber. This means the pressure will drop during the compression phase of
the air bubble before it returns to normal behavior. The pressure profile of
the second piston shows no deviation. The pressure drop at the beginning of
the stroke generates a higher pressure ripple which is used to determine a
gas bubble problem.
The pressure ripple is depending on various parameters like solvent, flow,
compressibility and so on. For this reasons the pressure ripple has to exceed
a certain range before a gas bubble can be detected. The relation between
pressure ripple and compressibility setting is shown in the respective figure.
N OT E
Drastic pressure changes (for example suddenly no more solvent to pump due
to empty bottle) can not be detected under all circumstances. To make sure
that the system will stop in such a case (for example running out of solvent
during an unattended sequence) a lower pressure limit should be set.
Figure 101
Online Diagnostic: Gas Bubble
263
Figure 102
Online Diagnostic: Compressibility vs. Pressure Ripple
264
M4 Leak at first Piston
The following figure shows the pressure profile when the system is leaky
either at the inlet valve or at the piston seal. The delivery stroke of piston I
shows a pressure drop while piston II delivers without any problems.
Figure 103
1050 Online Diagnostic: Leak at first piston
265
M6 Valve Backflow
The following figure shows the pressure profile when the outlet ball valve is
not working correctly. Delivery stroke of piston I shows normal behavior
while during the stroke of piston II the pressure drops because of the
internally leaking ball valve.
Figure 104
Online Diagnostic: Outlet Ball Valve Backflow
266
M8 Outlet Valve Problem
The following figure shows the pressure profile when the outlet valve sticks
in its position. During the delivery stroke of piston II the pressure drops
because a sticky ruby ball needs longer time to be closed.
Figure 105
Online Diagnostic: Outlet Ball Valve
267
If You Need Operational Hints
You will find general information about the pumps and certain parts followed
by description of known behaviors of the instrument.
This section gives information about:
• Helium Degassing Principle
• Helium Regulators
• Isocratic Pumps
• Pump Head Assembly
• PDC Board
• HRQ Board
• Wear Retainer
• Flow Test Method
• Method Loading
• Flow Gradients
• Manual Injection Valve
268
Helium Degassing Principle
The Helium degassing works in two stages. First, replacing the dissolved gas
in the solvent. Helium streams through the solvent and replaces the air
dissolved. So after some time the solvent is saturated with Helium. Second,
prevent that air diffuses back into the solvent. The compartment above the
solvent will also be filled with Helium. The Helium above the solvent is
absolutely necessary to make sure that no air can be introduced back into the
solvent. So the bottle head has to be in its position otherwise the degassing
will not work or it will require a too high Helium stream through the solvent.
N OT E
If the vent position of the bottle head is connected to a fume hood, make sure
that the Helium is not sucked out of the bottle. Best is to install a restriction
(for example change diameter from 1/4" to 1/8") to make sure that the Helium
blanket above the solvent surface remains in its place. Otherwise
performance problems especially with gradient runs or excessive high Helium
consumption might be the result.
Helium Regulators
The helium regulators allow the regulation of the helium flow. The regulator
design does not allow to set the helium stream to zero. A small flow of helium
is still possible.
269
Bottle Head Assembly
During the lifetime of the solvent cabinet a problem with the bottle head
assembly was encountered.
The helium leaves the bottle head assembly through the vent connector. To
reach this vent the helium has to pass the bottle head shaft. The helium
passes through the gaps between the holes in the shaft and the supply tubings
for helium and solvent. Variations in the tolerances for hole size and tubing
diameter may restrict the helium flow out of the solvent bottle. This may
cause the effect that the solvent gets oversaturated with helium.
Oversaturation may lead to problems in pump and detector.
For that reason the bottle head assemblies have been modified with a
separate vent hole (1 mm to 2 mm in diameter) to the bottle head shaft
(01018-43711). All solvent cabinets 79856A/B with serial number prefix
3216 G... and greater will have the modification installed.
Instruments without the vent hold should be updated. Using a screwdriver
simply punch a hole of 1 mm to 2 mm diameter in the shafts of the bottle head
assemblies (01018-43711).
Isocratic Pumps
Isocratic pumps are often sold without the solvent conditioning module
option. The bottle is then placed beside the instrument. Tests have shown
that best results in regards of pressure ripple stability, air sensitivity and so
on are reached when the solvent bottle is placed on top of the module or even
higher (for example on top of a stack of modules). The slight gravity pressure
reduces the under pressure the pump requires to draw solvent from the
solvent bottle.
270
Pump Head Assembly
In February 1992, the pump head assembly was improved. The seal, the pump
chamber housing and the seal keeper have been changed. All together the
changes will assure a higher lifetime for the pump seal.
Seal
A dedicated seal was designed for the 1050 Pumps. Compared to the old seal
used in 1050 and in the 1090 the seal is the same material and color, but
slightly different in appearance. Nevertheless the seals are fully backward
compatible. They should be used in all existing 1050 pumps. Lifetime should
be expected the same as always. The wear retainer is still required.
Pump Chamber Housing and Seal Keeper
A groove has been added to the seal surface of the pump chamber and a
cutting edge was added to the seal keeper. These both changes ensure a
better compression of the new seal resulting in a higher lifetime. Part
numbers of the two parts were not changed because of there compatibility.
PDC Board
When exchanging the metering drive assembly 01018-69100 in a pump with
PDC Board revision A installed (see “Product History” on page 257), the
voltage regulators U78 and U79 on the board have to be replaced. Parts are
included in the exchange metering drive. PDC Board revision B and greater
and the PDC2 Board do not have the new type voltage regulator already
installed. A short in the active inlet valve cable (for example cable squeezed
between pump head and metering drive) will generate excessive current on
the components of the PDC board. This overcurrent will at least damage
(unsolder) one resistor on the board. The fuse added to the CON board
(introduction approximately January 1992) will prevent damage of the PDC
board.
PDC2 Board
In a standardization (board will also be used in other APG products) and cost
reduction program part of the circuit was implemented in ASIC (Application
Specific Integrated Circuit) which allowed a reduction in board size. A
stainless steel plate and the cover plate assure compatibility to the 1050
board.
271
HRQ Board
Originally the fuse F16 on the HRQ board was a 500 mA type. Evaluation of
returned defective exchange boards showed that the fuse was blown in most
of the cases. The fuse was to weak and could be blown without circuit
failure. Therefore the fuse was changed to a 1 A type.
GVD Board
At introduction of the 1050 Pumps the Gradient Valve Driver (GVD) board
controlled the multi channel gradient valve (MCGV). During the design phase
of the column heater option it was decided that the control of the heater
should be also done via the same board. Therefore the GVD was replaced by
the HRQ board for control of column heater and gradient valve (see “Product
History” on page 257).
Wear Retainer
The abrasion of the seal is a very well known fact. The wear retainer is a
device which keeps the departed particles around the seal instead of allowing
to move immediately into the flow path. The retainer consist of a small
porous Teflon disc placed directly in front of the seal. When installed the
retainer disc deflects and with the piston diameter slightly bigger than the
one of the Teflon disc a recess for the seal material is build.
With the operation time the plunger will widen the diameter of the disc
allowing part of the particles to move into the flow system. Therefore the
wear retainer should always be changed together with the seal. The high
pressure filter in the purge valve will collect all this materials without
problem. When changing the seals also the high pressure filter should be
changed too.
272
Outlet Ball Valve
The outlet ball valve is a cartridge type and does not need any maintenance.
It is not spring loaded and therefore uses gravity and the back pressure for
closing. To increase the reliability of this type of valve two ceramic seat/ ball
packages are used. The valve is less sensitive to contaminations and does not
require a sieve assembly in front. The cap in front of the valve holds a gold
seal for proper tightening. If the valve fails it is probably contaminated.
Cleaning can be done either in a sonic bath or by flushing using degreaser
spray in flow direction. Disassembling will damage the valve. The outlet ball
valve should only be tightened at the holding screw and not at the cartridge
itself. Under worst case conditions this could damage the cartridge
generating leaks at the seat/ball packages.
Flow Test Method
The flow test method should be always started with the remote mode in
LOCAL.
If set to GLOBAL the test method can be inhibited when a manual injection
valve in inject position is connected via the remote connector.
If the remote mode is set to HPSYSTEM the flow test will not be started at all,
because of the start request which is send out instead of a start.
Method loading
If a method will be loaded while pumping, the pump might be switched off
when there is a lower pressure limit set in the new method.
Flow Gradients
Timetables containing flow gradients with a starting point of 0 ml/min will
not be executed. Gradient parameter changes will always be executed at the
culmination point of the first piston. With a flow set to zero, this point will
never be reached.
Starting a 3390A or 3394A from the remote start of the manual injector
requires a slight modification of the injection sensor. 3390/94 integrators
need a dynamic signal which the manual injector can provide only if position
sensor is installed into an upright position.
273
Metering Drive Repairs
Evaluation of defective metering drives 01018-69100 showed that the wiper in
the spindle housing was broken or bent. The wiper defines the position of the
spindles to each other. Discussions with CE’s revealed that some people try
to check out the metering drive without the pump head installed, especially
when troubleshooting E27 (max motor drive power exceeded) problems.
When the pump head is removed and the pump is initialized the spindle
movement is stopped by the wiper. The pump displays the message
pumphead missing. This is generally no problem for the mechanical
system. The following problems may occur when operating from this point
on.
❏ The pump is turned on again without reinstalling the pump head.
Under this condition the pump will start with normal operation. The
wiper position is used as reference point. The movement of the spindle is
always stopped by hitting the wiper. This operation condition may
damage the wiper or misalign the spindles.
❏ The pump head is reinstalled without initializing the pump.
The pump still uses the previous determined position as the reference
values for the pump. So when started the piston may run with full flow
speed into the mechanical stop. This can crack the pistons.
This problems can be avoided by:
❏ NOT running the pump without pump head installed (also not for test
reasons).
❏ Always do a pump initialization when the pump head is re-installed.
274
Troubleshooting E27 Errors (Max Motor Drive Power
Exceeded)
The E27 can have two reasons - a problem in the metering drive and also a
blocked outlet ball valve.
❏ Blocked Outlet Ball Valve. It is possible that the valve is blocked (for
example the pin on the ball canted). In such a case the first piston cannot
deliver anything onto the high pressure side. The pressure in the first
chamber rises to values far above 400 bar. This pressure in the first
chamber cannot be detected by the pressure damper as it is located behind
the outlet ball valve. The pump motor working against a too high pressure
will exceed the maximum allowed drive power and gives error E27. This
can also be an intermittent problem.
Troubleshooting Procedure:
❏ Remove outlet ball valve and let the pump run without the valve.
❏ Replace the outlet ball valve and pump at high back pressure
(restriction). Error E27 under this condition verifies metering drive
problems. No error messages identify faulty outlet ball valves.
❏ Problem with Metering Drive. Possible problems on the metering drive are
defective bearings defective motors or misalignment of the wipers.
Troubleshooting Procedure
❏ Proceed in the same way as described before. Intermittent motor
problems might be identified.
❏ Remove pump head and press down spindle by hand. This should be
possible without too much resistance. High resistance indicates a
bearing defect.
❏ Remove metering covers and check for broken or loose wipers.
275
Piston with Conical Holder
Reports from the field and evaluation of returned parts showed that the
spring in the piston housing can scratch at the piston holder and may
generate a squeaking noise. This will not lead to a malfunction of the pump
but the noise has lead to customer complaints.
The piston holder was changed and now has a conical shape. The spring
should no longer scratch at the piston holder.
Ghost Leak messages
If the pump shows intermittent leak messages without any solvent in the leak
tray you should check the following two points.
• Make sure that the leak sensor is not in close proximity of the plastic
funnel. This can cool down the sensor to the trigger level resulting in ghost
error messages.
• Check the revision of the CMP board. CMP boards with revision E and
higher do have a improved leak sensor circuit installed. CMP boards with
revision D or below can be modified by soldering two 100nF capacitors
(0160-6623 or 0160-0576) between pin 12 and 11 and pin 12 and 9 of U45.
U45 is the sixth IC in the bottom row of the board (main connector on right
side). There are two fourteen pin IC beside each other. U45 is the right one.
PANIC Errors
Intermittent PANIC errors are mostly generated by spikes (disturbances) on
the bus lines. A dynamic bus termination has been added to the FIM board to
suppress the spikes and to reduce the possibility of this failure mode.
All firmware boards with revision C and higher do have the dynamic bus
termination installed (RC-network instead of a R-network). In case of
intermittent PANIC errors replace FIM boards (rev A or B) with the current
version.
276
In This Book
only.
1050 Series of HPLC
Modules
Service Handbook Sampler (79852A/B)
Technologies 2001
allowed under the
copyright laws.
Part No. NONE
11/2001
Printed in Germany
Warranty
IMPORTANT NOTE
The information
contained in this
01050-90102 edition 4
(1995) and G1306-90102
this material,
including, but not
warranties or
merchantability and
purpose.
76337 Waldbronn
Germany
information (79854A
went out of support
during 2000).
Contact your local
case of part number
issues or upgrades.
web page
www.agilent.com.
11
11
Sampler: General Information
the 1050 Autosampler
• about this autosampler
• repair policy
• product structure
• capillaries
• specifications
About this Manual
This manual provides service information about the 1050 Autosamplers. The
following sections give the detailed descriptions of all electronic and
mechanical assemblies. You will find illustrated part-breakdowns
interconnection tables connector configurations as well as all necessary
replacement procedures in this manual. Detailed diagnostic procedures using
firmware resident test methods and error messages are also given in this
manual.
About the Autosampler
The 1050 Autosampler module houses the mechanical devices and the
electronic circuitry for control of the various functions of the injection
system. The module is controlled through the user interface through which
the operator defines his requirements (vial number, injection volume and so
on) and which provides the required information.
282
Repair Policy
Repair Policy
The 1050 Autosampler is designed that all components are easy accessible.
Customers are able to repair certain parts of the 1050 Autosampler, see
Operator’s Handbook.
For details on repair policy refer to “Repair Policy” on page 38.
Product Structure
The 1050 Series of HPLC modules are available in two versions.
In the standard version most of the parts in the flow path are stainless steel.
In the 1050 Ti Series the flow path of the autosampler consists solely of
corrosion resistant materials such, as titanium, tantalum, quartz, sapphire,
ruby and fluorocarbon polymers. It is recommended for use with mobile
phases containing high salt concentrations, extreme pH solutions and other
agressive mobile phases.
Autosampler
79855A
Ti - Autosampler
79855B
283
Capillaries
Capillaries
In the 1050 Series all capillary shipped with the modules will have a plastic
colour coating for identification in terms of material and internal diameter.
Table 67
Capillary Color Code
color
Internal Diameter
blue
0.25 mm
green
0.17 mm
red
0.12 mm
white
N OT E
Material
tantalum
The capillaries for the 1050 Series will have only one color coating for the
internal diameter.
The capillaries for the 1050 Ti Series have two color coatings. One for
identifying the material, covering the main part of the capillary, and a small
one for the internal diameter. For the 1050 Ti Series the fittings are always
titanium with a titanium nitrite coating and the front and back ferrules are
gold plated.
284
Specifications
Specifications
Table 68
Specifications of 1050 Autosampler
Injection Range
Programmable from 0.1 to 100 µl in 0.1 µl increments
without hardware change required. Up to 1.8 ml with
larger injection valve capillary.
Replicate Injections
1-99 from one vial.
Precision
Typically <0.5% RSD of peak areas from 5-100 µl and
<1% from 2-5 µl
Minimum Sample Volume
1 µl can be sampled from 5 µl in 100 µl micro vial or
10 µl in 300 µl micro vial.
Carryover
<0.1% typically
Wash Cycle
None required, sample path flushed continuously with
mobile phase during normal operation.
Sample Viscosity Range
0.2 - 50 cp
Sample Capacity
21 or 34 in standard trays, with additional 100 in
external tray (less two positions for access).
Random Vial Access
<4 seconds from standard tray.
Injection Cycle Time
20 seconds typically, depending on injection volume
and drawing speed.
Recommended pH Range
2.3 to 9.5 standard; 1.0 to 12.5 optional (TEFZEL™
replaces VESPEL™ rotor). Solvent with pH below 2.3
should not contain acids which attack stainless steel.
Ti-Series pH 1 to 14.
Control
Integrated keyboard with function keys; parameter
editing possible during run; keyboard lock. Optional
control by PC or 3396 Series II integrator.
Method Parameters
Injection volume, draw offset, sample draw/eject
speed, 2 external contacts, stop time, post time,
injector program.
285
Specifications
Table 68
Specifications of 1050 Autosampler
Methods
Battery-backed storage of up to 10 methods.
Automatic startup and shutdown methods. Editing of
stored methods possible during run.
Sequence Parameters
Up to 10 parameter sets, each with keyboard setup of:
first- and last sample vial, # of injections per sample
vial, first- and last calibration vial, # of injections per
calibration vial, re-calibration frequency and injection
method. Editing of stored parameter sets possible
during run.
Communications
Inputs: start request. Outputs: BCD for bottle number;
start; two external relay contacts (one 24 V relay, one
30 V (AC/DC) contact closure, both 0.25A). In- and
Outputs: stop, ready, shut, down. Optional interface
for GPIB and RS-232C.
Safety Aids
front-panel LED’s and status logbook. User-definable
detection, safe leak handling, leak output signal to
shutdown pump. Low voltages in major maintenance
areas.
Environment
4°C to 55°C (constant temperature) with <95%
humidity (non-condensing)
100-Sample Tray
Temperature Control
1°C to 60°C using external circulating bath with
thermostat.
Power Requirements
Autosampler Dimensions
Height: 208 mm (8.2 in)
Width: 325 mm (12.8 in)
Depth: 560 mm (22.0 in)
Weight: 16 kg (35 lb)
286
12
12
Sampler: Hardware Information
about the 1050 Autosampler
components of the 1050 Autosampler.
• Overview about the Autosampler
• Autosampler hardware
• Sampling Unit
❏ Metering Drive
❏ Analytical Head Assembly
❏ High Pressure Switching Valve
❏ Pneumatic Assembly
• Additional 100 vial capacity
288
Overview
Overview
The 79855A/B Autosampler is a fully programmable module and is controlled
via the user interface. The operator sets the parameters at the user interface
which provides also the required analytical information. The processor
controlled electronic drives the mechanic of the 79855A/B Autosampler
consisting of sampling unit metering device and high pressure valve unit. The
pump delivers flow to a six port high pressure valve unit in which a sampling
unit and a metering device take the place of a sample loop. In normal mode
the needle of the sampling unit is held firm in its seat forming a leak free seal.
The valve unit directs the solvent through the metering device and the
sampling unit to the column. During injection the flow is bypassed and the
metering device loads the sample. Needle and metering device are always
flushed and ready for the next injection.
289
Solvent Flow Path
Solvent Flow Path
Solvent coming from the pump (capillary #1) enters via port 1 of the
switching valve the autosampler. In normal mode (switching valve in main
pass) the flow is guided from port 2 to the analytical head (capillary #2) and
from there via the loop capillary (#3) and the fitting (#4) to the needle (#5).
The needle is pressed into the seat and via the seat capillary #6 the flow
streams back to port 5 of the switching valve. The seat capillary can be
extended for injection volumes above 100 µl (multiple injections). From port
6 of the switching valve the solvent will be connected to the column
(capillary #7). During the injection cycle (switching valve in bypass) ports 1
and 6 are connected and flow is directly connected to the column. The
metering device displaces its volume into the waste (capillary #8) before
drawing the injection volume form the vial.
Figure 106
Solvent Flow Path
290
How Does The Autosampler Work?
The processor controls the injection sequence. To avoid malfunctions the
1050 Autosampler will perform a mechanical reset after initial turn-on of the
module. It can also be reset using the {{CONTROL RESET}} instruction of the
user interface.
First step of the injection sequence is activating the pneumatic valve unit so
that the air pressure can change the position of the high pressure switching
valve (see step 1 on page 292).
The flow is bypassed and sampling unit and metering device are without
pressure. The stepper motor of the metering device is activated moving the
piston to its home position displacing its volume into waste. Next the
electrically driven sampling unit lifts the needle and moves the sampling tray
with a programmed vial under the needle (see step 2 on page 292).
If the additional 100 sample tray (18596L/M) is installed the arm of this tray
moves the vial into the transfer position of the 21 sample tray (vial 16).
The sampling unit lowers the needle into the vial and the programmed
injection volume is then drawn up into the sampling unit by the metering
device. The needle is raised the tray is moved back to home position and the
needle is reseat. The valve unit returns to its normal position reconnecting
the needle loop to the flow system (see step 3 on page 292). All of the sample
is pumped out of the 1050 Autosampler onto the column.
Sampling unit and metering device are always in the main flow path (normal
mode) and therefore an extra flushing procedure is not necessary. In case of
air in the system (metering device) increase flow (for example 5 ml) or use
appropriate solvent (for example isopropanol).
291
1 Injection Sequence I
2 Injection Sequence II
3 Injection Sequence III
292
The Injection Sequence
The Injection Sequence
The injection sequence is stored in controller memory. For each step of the
sequence a time for execution is assumed. If execution takes too long
(time-out) or fails, it will result in an aborted injection and an error message.
Each single step of the sequence can be executed solely when the system is
brought into the test functions.
1 Switch Valve Unit to bypass flow.
2 Initialize Metering Device.
# Includes step 1 to 5 of 18596L/M sample tray if installed and selected.
3 Raise needle.
4 Move vial underneath needle.
5 Lower needle into vial.
6 Draw sample up from sample vial.
7 Raise needle out of vial.
8 Move vial back to home position.
9 Lower needle onto seat.
10 Switch Valve Unit to flow through sample loop.
# Executes steps 6 to 9 of 18596L/M sample tray if installed and selected.
N OT E
Steps 1 through 5 can be aborted.
293
What happens when the 18596L/M Sample Tray is connected?
What happens when the 18596L/M Sample
Tray is connected?
If the optional 18596L/M sample tray is connected to the autosampler, the
additional steps of the 100 sample tray will be incorporated into the injection
sequence. The 100 sample tray arm will move each selected vial into the
transfer position 16 of the 21 sample tray. After the injection, the 100 tray arm
moves the vial back to the original position in the 100 vial tray.
1 Initialize 100 vial tray.
2 Move to selected vial position.
3 Pick up vial.
4 Move to 21 sample tray.
5 Insert vial into position 16 of 21 sample tray.
6 Remove vial from 21 sample tray.
7 Move arm to vial position.
8 Insert vial into 100 vial tray.
9 Move the 100 tray arm to home position.
294
Figure 107 shows the block diagram of the 1050 Autosampler including all
currently available options.
The Common Main Processor (CMP) controls all functions of the module.
The firmware board (FIM) containing the EPROM’s with the sampler specific
firmware is attached to the VMD board. Therefore the processor board
(CMP) remains identical for all modules.
The Max Tray Drive (MTD) controls the 18596L/M 100 sample tray when
connected to the autosampler. This expands the vial range from 21 vials to a
total of 119 vials. Two vial positions in the 21 vial tray are needed for access
from the 100 vial tray. The rotor reader option can be connected to the
18596L/M tray. Electronic control is done from the rotor reader board which
is attached to the MTD board.
The communication interface board (CIB) provides an GPIB and RS232C
interface. With the CIB installed the autosampler can be controlled via the LC
ChemStation or via the 3396 Series II integrator.
295
Figure 107
Block Diagram 1050 Autosampler
296
Sampling Unit
Sampling Unit
Repair Level: Component (see Parts ID)
Table 69
Part Numbers Sampling Unit
Item
Part Number
Sampling Unit
01078-60001
Ti - Sampling Unit
01079-60001
The Sampling Unit comprises two functions, control of needle movement and
positioning the respective vial under the needle. The sampling unit is
controlled by the needle mini tray drive board (NMD).
The stepper motor for the needle movement is connected to a lead screw
which moves the needle arm with the needle up and down. Lightswitches at
the needle arm check for upper and lower limit of the needle and also check
the presence of a vial during the injection cycle. The second stepper motor
drives the coupler which holds the sample tray. The home position of the tray
is determined when a little magnet in the tray is located directly above the
home sensor. Standard sample tray with 21 vials or micro tray with 34 vials
are identified by the polarity of the tray magnet (north pole for standard tray
and south pole for the micro tray). A quadrature encoder on the coupler shaft
allows accurate positioning of the tray.
297
Sampling Unit
Table 70
Technical Data Sampling Unit
Number of spindle motor steps between
upper and lower limit
5867 steps (44 mm)
Number of spindle motor steps between
upper limit and needle in vial position
5334 steps (40 mm)
Needle speed
20 mm/sec
Spindle
200 steps (1.5 mm)/revolution
Number of encoder wheel slits
500
Resolution of the tray
2000 steps/revolution
Reproducibility of tray position
±1 mm
Tray speed
2.3 seconds/revolution
Sealing Force
50-55 N
Ti Series
Materials in contact with solvent:
Figure 108
tantalum, titanium, Peek, gold
Sampling Unit
298
Metering Drive
Metering Drive
Repair Level: Assembly or component level for given parts (see Parts ID)
Table 71
Part Numbers Metering Drive
Item
Part Number
Metering Drive
01078-60002
The Metering Drive is responsible for drawing the sample into the sample
loop. The stepper motor controlled by the Valve Metering Drive Board (VMD)
drives the spindle via a belt. The circular movement of the spindle is
transformed in a linear movement for the piston via a bronze nut. A light
sensor determines the home position of the piston.
Table 72
Figure 109
Technical Data Metering Drive
Resolution of mechanical system
7 nl/step of motor
Number of steps between extension limits
15000
299
Analytical Head Assembly
Table 73
Item
Part Number
Analytical Head assembly
01078-60003
Ti - Analytical Head assembly
01079-60003
The sapphire piston moves up or down the spindle on a bronze nut. The built
in spring prevents clearance affecting drawing accuracy. Piston movement in
the analytical head is guided by a sapphire ring. On the backward stroke the
piston draws sample from the vial.
Table 74
Technical Data Analytical Head
Maximum stroke
100 µl
Ti Series
Materials in contact with solvent
Figure 110
Filled Teflon, sapphire,
titanium
300
Repair Level: either Exchange Assembly or component level for given parts
(see Parts ID)
Table 75
Item
Part Number
Exchange
01078-60004
01078-69004
Ti - High Pressure Switching Valve
01079-60004
01079-69004
The High Pressure Switching Valve bypasses the flow direct to the column
during the injection cycle. The valve is air driven. The switching positions of
the valve are sensed with a light switch that provides a status signal to the
Valve Metering Drive (VMD) indicating proper execution of any movement.
Table 76
Technical Data High Pressure Switching Valve
Ti Series
Materials in contact with solvent
Figure 111
Tefzel, titanium, ceramic
301
Pneumatic Assembly
Pneumatic Assembly
Table 77
Part Numbers Pneumatic Assembly
Item
Part Number
Pneumatic Assembly
01078-66101
Air supply is connected from the rear of the module to a self latching
solenoid valve. Pressure is sensed for an under pressure condition (<5 bar)
with a sensor that provides an electrical status signal. Air pressure is applied
to the SUP connector of the valve. In normal position pressure is connected
to connector CYL1.When the solenoid is activated by a pulse, the air stream is
directed to outlet CYL2 and the air pressure moves the 6 port valve and
forces it to stay there. Air pressure is applied to the SUP connector of the
valve.
In normal position pressure is switched to connector CYL1 and when the
valve is switched it moves to CYL2. Both exhaust outlets (EXH1/EXH2) are
connected together at the rear of the module. The air leaves through a filter
to reduce the noise during the switching. Electrical control of the valve is
from the Valve Metering Drive (VMD).
Figure 112
Valve Connections
302
Pneumatic Assembly
For test reasons the actuator air solenoid may be switched manually.
Actuator Air Solenoids
Manual air actuation is done in the following way:
Table 78
Figure 113
Switching of Solenoids
Screw A Screw B Cyl #1
Cyl #2
Comment
0
0
SUP
EXH
Relaxed Position
1
0
SUP
EXH
0
0
SUP
EXH
0
1
EXH
SUP
0
0
EXH
SUP
Solenoid ready for next switch
Solenoid ready for next switch
Pneumatic Assembly
303
This option for the autosampler comprises the max tray drive board
assembly (MTD), the tray support and the foot support. A new firmware
might be required when updating existing instruments.
With these parts it is possible to adapt the unmodified 18596A/B GC tray to
the 79855A Autosampler (See also Updating to an additional 100 vial tray).
The 100 vial tray has to be ordered separately.
N OT E
The 18596A/B tray get a different order suffix when ordered for an 1050
Autosampler. Reason are the different accessories (for example manuals and
so) when ordered for an LC or GC.
Table 79
100 Vial Tray
GC
LC
18596A
18596L
18596B
18596M
For access of the additional vials the firmware adds 100 to each tray position
so that the 100 sample tray holds the positions 101 to 200. The arm of the 100
sample tray moves the selected bottle into position 16 of the 21 sample tray.
Position 15 has to be empty for the undisturbed movement of the tray arm.
After the injection the vial is placed back into its original position in the large
tray. The remaining vial range of the 21 sample tray (1 to 14 and 17 to 21) is
fully accessible. The firmware automatically skips vial 15 and 16.
N OT E
Service Information about the 18696A/B can be obtained from the 7673
Service Manual for the A tray and for the B tray.
304
Figure 114
Additional Tray Option
305
306
13
13
Sampler: Electronic Information
This chapter gives information about the electronic of the 1050 autosampler:
• Overview
• Max Tray Drive Board (MTD)
• Needle Mini Tray Drive Board (NMD)
• Valve Metering Drive Board (VMD)
• Firmware Board (FIM)
• Autosampler Motherboard (ALM)
308
Overview
Overview
All electronic boards (except the FIP, behind the keyboard) are located in the
rear part of the module and they are connected to the Motherboard (ALM).
Excess to the boards is from the rear of the instrument. Slot numbers (for
example in the status display) are counted from left to right. The Power
Supply (DPS-B) is located in slot 1 and the common main processor is
located in slot 7. The rear of the autosampler is shown in Figure 115 on page
310.
In the Autosampler the following electronic assemblies are available:
Table 80
Electronic Boards
Description
Part Number
Exchange
5061-3374
01050-69374
01050-69380
01050-69580
01078-66503
01078-69503
## Max Tray Drive Assembly (18596B/M) (MTD) 01078-66513
01078-69513
# Max Tray Drive Assembly (18596A/L) (MTD)
# Rotor Reader Drive Assembly (G1926A) (RRC) 01078-66507
#
Valve Metering Drive (VMD)
01078-66501
01078-69501
Needle Mini Tray Drive (NMD)
01078-66502
01078-69502
01018-66506
Motherboard (ALM)
01078-66504
5061-3376
5061-2482
Optional board
## Optional board, attached to the MTD board (not described in this
manual)
309
Overview
N OT E
For information about Power Supply, Common Processor and Fluorescent
Interface refer to chapter 1050 Common Information.
Figure 115
Rear of 1050 Autosampler
N OT E
The MTD board is optional.
310
Overview
Figure 116
Block Diagram 1050 Autosampler
311
Max Tray Drive Board (MTD)
Repair Level: Board
Table 81
N OT E
Part Numbers for MTD Board
Item
Part Number
Exchange
MTD Board 18596M
01078-66513
01078-69513
MTD Board 18596L
01078-66503
01078-69503
RRC Board for both versions
01078-66507
The RRC board will be attached to the MTD board when Rotor Reader Option
(G1926A) for the 100 vial tray is installed.
The function of the board is to control the 18596L/M sample tray and to
provide the electrical interface to the common main processor (CMP). The
18596L/M is part of the 7673A product family.
I/O Control
The I/O control circuit enables the common main processor (CMP) and the
maxi tray drive (MTD) to exchange data. This is done via a bidirectional I/O
buffer. A board identification (a resistor network) allows the processor to
identify the board and to address.
Sensor Status
Via the sensors interface circuit the sensor status is transferred to the sensor
status latch. The sensor status latch transfers the information via the
common bus to the CMP.
312
Data Conversion
While the common main processor bus has a parallel data structure the Main
Processor Unit (MPU) uses a serial data bus. The data conversion section
performs the parallel to serial and serial to parallel conversion for the
different bus structures.
Figure 117
Block Diagram MTD Board
Clock
The clock circuit provides all necessary frequencies for the main processor
unit (MPU) and the data conversion section. It uses a 4.9152 MHz clock
generator.
313
Main Processor Unit (MPU)
The MPU is the heart of the MTD board and controls all the functions of the
18596L sample tray. All the necessary memory needed to run the 100 tray
resides inside the MPU chip. The MPU chip provides all the signals for the
motor drivers and sends a tray fault signal out in case of malfunctions.
To control all the steps of the tray the MPU reads the sensor status from the
sensor interface.
Reset and Watchdog
This circuit checks for proper operation of the Main Processor Unit (MPU).
In case of malfunctions (for example timing problems and so on), the reset
and watchdog resets the system preventing any damage of the 18956L tray.
The System OK Signal (SOK) from the Common Main Processor (CMP) is
also fed into the reset and watchdog block. In case of 79855A processor
problems or problems which influence the SOK status, the reset and
watchdog will also reset the MTD board.
Motor Drivers
Three motors control all the movements of the 18596L 100 sample tray. The
radial arm drives (R-Motor) and the gripper drives (Z-Motor) are similar. To
keep the position of the arm or the gripper mechanism when not turning the
motors are powered down to maintain a standby torque. The angular driver
(Theta-Motor) provides a constant standby current in chopper mode and
normal on/off switching of the motor windings at standard speed.
Sensor Interface
Three position sensors are located in the tray to provide feedback as to the
position of the tray arm. An additional sensor in the gripper on the arm to
indicates the presence of a bottle. The bottle sensor is simply a micro switch
which provides a short ground when the bottle is present. The two position
sensors that are used to sense the home positions for radial (R) axis and
gripper (Z) axis are hall sensors that provide a logic low output when they
encounter a suitable magnetic field. Small permanent magnets are placed in
the appropriate positions in the tray. The angular (Theta) axis position
sensor is an optical photo diode transistor pair. The photo diode is turned on
only when the motor is being actuated. The interlock is a sense line which
identifies whether the sample tray (cable) is installed or not.
314
Figure 118
Board Layout MTD
315
Needle Mini Tray Drive Board (NMD)
Repair Level: Board, Capacitor
Table 82
Part Numbers for NMD Board
Item
Part Number
Exchange
NMD Board
01078-66502
01078-69502
Capacitor 100 pF (between pin 5 and 7 of U26)
0160-4801
The main function of the NMD board is the control of needle motor and tray
motor.
Capacitor 100pF
Firmware revision 4.0 and above require a modification of the NMD board.
Otherwise incorrect positioning of the 21 or 34 vial tray may occur. The
100 pF capacitor soldered between pin 5 and 7 of U26 solves the problem.
Instruments with serial number prefix 3117 G ..... or 3121 A ..... do have this
capacitor.
I/O Control
The I/O control circuit enables the common main processor and the needle
mini tray drive (NMD) to exchange data. This is done via a bidirectional I/O
buffer. A board identification circuit allows the processor to identify the
board and to address it.
BCD Output
The circuit codes the bottle number into BCD and provides the signal to the
connector on the back of the NMD board. The BCD code is implemented in
positive true logic. Firmware REV 2.0 and above allow configuration of the
output for either 2 digit BCD coded or 8 bit binary (HEX) coded information.
316
Figure 119
Block Diagram NMD Board
317
Sensor Status
The hall sensor, the bottle sensor and the needle sensor are connected to this
circuit block. The hall sensor checks the presence of the sample tray and is
used to set the home position. The bottle sensor checks for the presence of a
bottle during injection cycle. The needle sensor checks upper and lower
position of the needle. The status information from the sensors are
transferred directly to the processor.
Control Logic
The control logic provides the motor parameters to the motor driver. The
parameters are the direction, resolution and current for the motors. The
control logic starts the timer and stops it under two conditions. In case a light
sensor detects the home position or the number of steps of the motor have
been elapsed, the timer will be stopped. To increase the life time of the
sensors the control logic activates the light sensors only during the injection
cycle and switches it off afterwards.
Timer
The timer chip of the timer circuit consist of three independent timer/counter
stages from which only two are used. One timer generates the speed (step
frequency) of needle and sample tray motor. The second timer defines the
number of steps the motor has to perform to reach its selected destination
(needle position).
Motor Driver
The motor driver delivers the power to the two motors. A bipolar phase
controller allows a high torque at high frequency for the movement.
Quadrature Decoder
The quadrature encoder on the tray coupler senses the movement of the
sample tray. The derived signals contain information of the direction and the
actual position of the tray motor. The decoder reads the signals and transfers
the information to the processor.
318
Figure 120
Board Layout NMD
319
Valve Metering Drive Board (VMD)
Repair Level: Board, Fuse
Table 83
Part Numbers for NMD Board
Item
Part Number
Exchange
Valve Metering Drive (VMD)
01078-66501
01078-69501
Fuse F12, F14 250 mA
2110-0004
The main functions of the board is to control the Metering Drive and the High
Pressure Switching Valve. In addition the VMD board holds also the firmware
for the common main processor (CMP).The firmware is attached to the VMD
board but has no functional connection to the board.
I/O Control
The I/O control circuit enables the common main processor and the Valve
Metering Drive (VMD) to communicate data. This is done via a bidirectional
I/O buffer. A board identification circuit allows the processor to identify the
board and to address it.
Control Logic
The control logic provides the motor parameters to the motor driver circuit.
The parameters are the direction, resolution and current for the metering
drive motor. The control logic starts the timer. It stops it in case the home
position light switch is activated or the motor steps have been elapsed. To
increase the life time of the sensors the control logic activates the light
sensors only during the injection cycle and switches it off afterwards. The
pneumatic valve will be switched via the valve driver circuit to change the
position of the high pressure switching valve.
320
Figure 121
Block Diagram VMD Board
321
Relay Contact Control
Two relay contacts are controlled. When activated, contact 1 provides fused
(250 mA) +24 V, while contact 2 provides a fused (250 mA) 30 V maximum
(AC/DC) rated contact closure. For more information about the relay
contacts see “External Contacts” on page 56 in the chapter 1050 Common
Information.
Timer
The timer chip of the timer circuit consist of three independent timer/counter
stages from which only two are used. One timer generates the speed (step
frequency) of the metering motor. The second timer defines the number of
steps the motor has to perform to reach its selected destination (volume).
Motor Driver
The motor driver delivers the power to the motor. A bipolar phase driver
allows a high torque for the movement.
Sensor Status
The metering home sensor the valve position sensor and the air pressure
switch are connected to the sensor status circuit. The home position sensor
checks whether the piston of the metering unit is in the maximum front
position or not. The valve position sensor checks the switching of the bypass
valve. The air pressure switch senses low air pressure in the system and
inhibits further injections. The metering motion status signal gives the
information whether the metering drive motor is running or not. The signal is
derived from the timer circuit. The switch (S28) is not used so far and is
reserved for future use.
322
Figure 122
Board Layout VMD
323
Repair Level: Board
Table 84
Item
Part Number
Firmware Board (New)
01078-66506
The FIM board is a piggy back board, placed on VMD board (“personality
module”).
• The programmed FIM contains the firmware of the 1050 Autosampler.
• The FIM contains 128K x 8bit EPROMs.
Figure 123
Layout of FIM Board
324
Autosampler Motherboard (ALM)
Repair Level: Board
Table 85
Part Numbers for ALM Board
Item
Part Number
ALM Board
01078-66504
The motherboard contains all connectors for the boards and the assemblies
in the front part, like sampling unit, metering drive, high pressure switching
valve, pneumatic valve and keyboard.
Figure 124 on page 326 shows the location of all connectors. A mechanical
Injection Counter displays the actual number of injections counted by
switching valve transitions.
325
Figure 124
Layout of Autosampler Motherboard
Table 86
ALM Connectors
J1 - Power Supply
J9 - DGND
J17 - Leak Sensor
J2 - TAR Board
J10 - Bottle Sensor
J18 - Home Sensor
J3 - VMD/FIM Board
J11 - future option
J19 - Metering Motor
J4 - NMD Board
J12 - Needle Motor
J20 - Valve Position
J5 - Not used
J13 - Tray Motor
J21 - Low Pressure Switch
J6 - Not used
J14 - Shaft Encoder
J22 - Pneumatic Solenoid Valve
J7 - CMP
J15 - Hall Sensor
J8 - FIP Keyboard
J16 - Needle Sensor
Figure 125 on page 327 to Figure 127 on page 329 show the main signals and
voltages of the various boards and connectors.
326
Figure 125
Connectors ALM (Part I)
327
Figure 126
Connectors ALM (Part II)
328
Figure 127
Connectors ALM (Part III)
329
Extender Test Board (ET)
Table 87
Part Numbers for Extender Test Board
Item
Part Number
Extender Test Board
01078-66509
Cable Assembly
01078-61609
The extender test board in combination with the cable assembly allows the
operation of sampling unit metering drive and high pressure switching valve
taken out of the autosampler module. The test board contains all the
connectors for the different items and holds some electronic for
troubleshooting and sensor adjustment. Figure 128 shows the circuit diagram
of the test board. The LED’s CR1 to CR7 show the actual status of the
sensors. An LED which is ON indicates that the sensor is either blocked or
deactivated. The sensors are only activated during the injection cycle.
Figure 128
Extender Test Board
330
Figure 129
Circuit Diagram ET Board
331
332
14
14
Sampler: Diagnostic Information
Autosampler
This chapter provides information about
• diagnostic steps
• error messages
• additional information
334
Single Steps
Single Steps
The autosampler has several test functions which are part of the control
section. The test functions provides access to the single steps of the injection
sequence. If the 18596L/M sample tray (100 sample tray) is installed the
firmware provides also single steps for this tray.
❏ Press CTRL and with NEXT move the cursor to the TEST FUNCTIONS
display and press ENTER.
❏ With the PREV or NEXT keys all of the single steps are accessible.
N OT E
This section describes only the function of the single steps. In case of
malfunctions or error messages refer to the troubleshooting section of this
manual.
335
Single Steps For The 21 Sample Tray
C A UT I O N
Single steps can be performed in any order and the step sequence is under the
control of the operator. In case of incorrect step sequences damage of needle,
seat, sample tray and other parts of the instrument might be possible. Multiple
execution of the steps should be avoided because of occurring error messages
or possible damage of the instrument. The single steps should always be
performed with the inner cabinet installed.
SINGLE STEP 1
SINGLE STEP 1 BYPASS
The high pressure switching valve is activated and the mobile phase is
directed to the column bypassing the metering device and the sampling unit.
The correct switching of the valve is checked via a light sensor. Multiple
execution of this step will create an error condition (E11).
SINGLE STEP 2
SINGLE STEP 2 METERING HOME
Metering device drives in the plunger to its mechanical limit named the home
position. At home position a lever at the spindle system blocks the light path
of a light switch. The metering device motor stops and reverses the direction
until the lever has moved out of the light path. Multiple executions of this
step are possible.
SINGLE STEP 3
SINGLE STEP 3 NEEDLE UP
Sampling unit raises needle. Interrupter sensor detects upper position of the
needle. Multiple execution creates an error message (E13) because of the
missing activation of the sensor.
SINGLE STEP 4
SINGLE STEP 4 POS. MINITRAY
Sample tray moves vial under needle. During the initialization of the
autosampler the home position of the sample tray will be determined (hall
sensor). From this home position the selected vial will be reached by
counting the steps of the encoder, which is mounted to the tray shaft.
Multiple execution of this step are possible.
336
SINGLE STEP 5
SINGLE STEP 5 NEEDLE INTO VIAL
Sampling unit lowers needle into vial. The stepper motor executes a defined
number of steps to lower the needle. No sensor is involved in this action. Do
not execute this step a second time. Otherwise the needle will be lowered
again by the same number of steps. This means that the needle hits either the
bottom of the vial or the plastic of the sample tray (if no vial is present). No
error message will occur.
SINGLE STEP 6
SINGLE STEP 6 DRAW UP
Metering device withdraws plunger drawing up sample according to selected
injection volume. For each injection volume the metering device motor
performs certain steps to withdraw the plunger. Multiple execution of this
step will withdraw the plunger until it reaches the maximum position. No
error will occur.
SINGLE STEP 7
SINGLE STEP 7 NEEDLE OUT
Sampling unit raises needle out of vial. The needle motor is activated until
stopped by the interrupter sensor, which is activated at upper position.
Multiple execution of the step are possible without any problem (needle
moves always up until it reaches the upper position and is moved back).
SINGLE STEP 8
SINGLE STEP 8 MINITRAY HOME
Sample tray moves back to home position. The number of encoder steps
performed under step 4 will be executed in opposite direction. The home
sensor is not involved in this action. Multiple execution of this step are
possible without any problem (tray remains in home position).
SINGLE STEP 9
SINGLE STEP 9 NEEDLE DOWN
Sampling unit lowers needle into needle seat. Lower position is determined
by the activation of the interrupter sensor. Multiple execution will create an
error message (E19) because light path of sensor is already blocked.
SINGLE STEP 10
SINGLE STEP 10 MAINPASS
Switches switching valve to direct mobile phase through metering device and
sampling unit and then into column. Light switch recognizes the change of
the position. Multiple execution of this step will create an error message
(E20) because the light switch will not be activated again.
337
Single Steps for the 100 Sample Tray
If the 18596L/M 100 sample tray is connected to the autosampler the
firmware provides also single steps capability for this tray.
Entering the Additional Single Steps
❏ Press CTRL and with NEXT move the cursor to the TEST FUNCTIONS
display and press ENTER.
❏ With the PREV NEXT keys move to the display
SINGLE STEPS 100 vial tray and press ENTER.
N OT E
This section describes only the function of the single steps. In case of
occurring malfunctions or error messages refer to the troubleshooting section
of this manual.
C A UT I O N
Single steps can be performed in any order and the step sequence is under the
control of the operator. In case of incorrect step sequences damage of gripper
assembly tray arm and other parts of the instrument might be possible.
Multiple execution of the steps should be avoided, because of occurring error
messages or possible damage of the instrument.
SINGLE STEP 1
SINGLE STEP 1 INIT 100 TRAY
100 sample tray performs an initialization. Multiple execution of this step
causes no problem.
SINGLE STEP 2
SINGLE STEP 2 MOVE TO POS 101
From the home position the tray arm moves to the position 1 of the 100
sample tray. The firmware does not support access to other vials. Do not
execute the step a second time. Otherwise the arm performs the same
number of steps again and moves into the mechanical stop.
SINGLE STEP 3
SINGLE STEP 3 PICK UP VIAL
The gripper assembly moves down, picks up the bottle and the gripper moves
up to home position (determined by a hall sensor). Second execution of this
step will lead to incorrect position in step 4.
338
SINGLE STEP 4
SINGLE STEP 4 MOVE TO 21 TRAY
Tray arm moves vial to the 21 sample tray position and stops above vial
position 16 of the tray. Do not execute this step a second time, because the
arm would move into the mechanical stop.
SINGLE STEP 5
SINGLE STEP 5 INSERT VIAL
Gripper assembly moves down and places the vial into the 21 sample tray and
gripper returns to home position. Down position of the gripper can be
influenced via the teach tray mode. Do not execute the step a second time.
Otherwise incorrect positioning of the tray arm will occur and the following
steps might show incorrect results.
SINGLE STEP 6
SINGLE STEP 6 REMOVE VIAL
Gripper assembly picks up the vial from the 21 tray. Step is similar to step 2.
SINGLE STEP 7
SINGLE STEP 7 MOVE TO POS 101
From the 21 sample tray the arm moves back to the position 1 of the 100
sample tray. Second execution should be avoided, otherwise the tray arm
moves into the mechanical stop.
SINGLE STEP 8
SINGLE STEP 8 INSERT VIAL
The gripper assembly moves down and replaces the vial into its original
position.
SINGLE STEP 9
SINGLE STEP 9 HOME 100 TRAY
The tray arm is moved back to the home position. This step is not identical
with the initialization of the tray arm.
339
Tray diagnostics mode isolates sample tray motion in each of the Z (gripper
arm), R (radial movement of tray arm) and Theta (angular movement of tray
arm) direction.
Entering Diagnostic Mode
❏ Turn off power at the 79855A autosampler.
❏ Take out the MTD board and put the RUN-TEST jumper J13 into TEST
position.
❏ Replace the board.
❏ Take the sample quadrants out of the 18596L/M sample tray, if not taken
out interference in Z direction will occur.
❏ Turn on line power and the 18596L/M will go automatically into the Z test.
Z Test (Gripper Assembly)
First the tray will home itself to the Z sensor at the top of travel.
The tray will then drive the gripper down in Z back up to the sensor and up
further to the mechanical stop.
If the test passed (for example no problem in Z direction), the tray will pause
two seconds and then it will repeat the test.
If the bottle switch is pressed after passing the test, the sample tray will
advance to the R test.
N OT E
If the Z sensor was not found (due to shorted motor, board problem, bad flex
circuit, bad sensor, and so on), the test will abort. Turn off the autosampler
and turn on again to restart the test. Pressing the bottle switch when in this
error condition will advance the sample tray to the R test.
340
R Test (radial arm movement)
First the arm will drive to the hard stop in R and locate the R sensor.
The arm will then be driven out to full extension in R, back to the R sensor
and back to the hard stop.
If the test was passed, the sample tray will pause two seconds and then it will
repeat the R test.
advance to the Theta test.
N OT E
If the R sensor was not found, the test will abort. Turn off the autosampler and
on again to restart the test. Pressing the bottle switch when in this error
condition will advance the sample tray to the Theta test.
Theta Test (angular movement)
First the sample tray will home itself in R and Theta direction. The R axis is
homed so that the Theta motion can be made with R in its normal operating
position. Failure of the R axis to home will not prevent the Theta test from
running.
The Theta test drives both R and Theta motors.
After homing R and Theta, the arm will rotate 180° counter-clockwise, 360°
clockwise and 180° counter-clockwise and check for the Theta sensor.
If the test was passed, the tray will pause for two seconds and then it will
repeat the test.
advance to the Z test.
N OT E
If motor steps are lost, the test will abort. Turn off the autosampler and on
again to restart the Z and R test.
341
Error Messages
Error Messages
The error messages will help to locate and repair a possible failure. In case an
error message appears the Error LED will be turned on and the message will
be written into the system logbook. RESET INJECTOR clears the error
message. The entry in the logbook remains.
The error messages are divided into the following blocks:
• Selftest
• PANIC Error
• Error Messages for Firmware Revision 4.0 and greater
• Injector Program
• Error Messages for Firmware Revision 3.1 and below
• Events
• 18596L/M vial tray
342
Error Messages
Selftest
performed when CTRL will be pressed while the module is turned on at the
LINE ~ switch. In case of a failure one of the following messages appears.
The complete test requires approximately two minutes.
ROM test failed
( ROM test failed )
The ROMs on the FIM board are tested. In case of a checksum error the ROM
test fails. Replacement of the FIM board will probably fix the problem.
RAM test failed
( RAM test failed )
Panic Error
Bus Error Address
Error
PANIC: XXXXXXH BUS ERROR
PANIC: XXXXXXH Address ERROR
The panic error messages should not appear under normal operation
conditions. In case of hardware or firmware problems the instrument might
try to access a wrong or not existing address which results in the error
message on the display. The instrument is locked up and has to be switched
off/on.
Reason for the PANIC error message can be any disturbance on the bus lines
due to bad contacts (high resistance) or defective IC on any of the boards.
❏ Check boards for good connections or corrosions at the contacts (clean
contact pins).
❏ Check firmware revision of the firmware board (SWF). It should be
revision C or higher. Boards with revision C do have a dynamic bus
termination for spike suppression on the bus lines.
❏ Replace one board at a time to identify the faulty one.
❏ If board replacement will not cure the problem, replace the motherboard.
343
E00 : Power Fail
E00 HH:MM DDMMM power fail
This event message indicates that the instrument has either been turned off
or disconnected from line source or a line power voltage drop has occurred.
The system clock will stop and has to be set after turning on the module.
E01 : Leak Detected In E01 HH:MM DDMMM leak detected >
Detector
leak detected > in injector
The leak detection system uses a PTC resistor as leak sensing item. Liquid
cooling the PTC results in a decrease of the resistance. The PTC is built in a
resistor divider which is connected to a constant voltage. From the voltage
divider a signal can now be obtained depending on the current through the
PTC and hence depending on the temperature. The leak detection circuit is
located on the CMP board and checks continuously for presence and leak
conditions. If the sensor is missing (defect) or in leak condition the PTC is
cooled down the error message appears. When the module is turned on the
leak message will be disabled for some time (30 seconds) to allow the sensor
to reach its working range.
Normal:
about 75°C
400...500 Ohm
Error:
below 55°C
about 150 Ohm
Actions:
❏ Check for leaks in autosampler.
344
E02 : Shut down
error in other module
An external device pulled the shut down line of the remote connector down.
This forces the autosampler to stop all further injections.
E03 : Error Method
loaded
The operator may define an method as a error method. The event message
gives the information that the instrument detected an error and that the error
message has been loaded.
E04 : Time Out
E04 HH:MM DDMMM time out >
The operator may define a time period after which the instruments stops all
further actions. In case the instrument is in a sequence and a not ready has
been detected in one of the other modules the instrument will stop the
sequence after time out time has been elapsed.
345
Error Messages for Firmware Revision 4.0 and greater
Error Messages for Firmware Revision 4.0
and greater
N OT E
Firmware revision 4.0 and greater incorporates the injector program for the
autosampler. The injector program required a restructure of the internal code
of the injection cycle. Therefore some of the error messages had to be
removed. This section shows the error messages for the current firmware
revision 4.0 and greater. Nevertheless the same messages appear also in all the
previous firmware versions. The additional error messages for firmware
version 3.1 and below are described in section “Normal Operation Messages
for Firmware Revision 3.1 and below” on page 351.
The following messages might appear during the initialization, the injection
cycle and a reset of the injector.
At initialization and reset the system sets all components (sampling unit,
metering device and high pressure switching valve) to home position. Missing
or low air pressure will not result in an error condition.
When started, the injection cycle will perform all the steps which are
necessary to introduce the sample into the flow path.
E11 : Valve not moved E11 HH:MM DDMMM inject failed >
to bypass
valve not moved to bypass
A light switch controls the movement of the high pressure switching valve. In
case the sensor does not see a dynamic signal change the error message
appears. Reason might be missing air (air pressure message?), a misadjusted
lights witch or failures in the electronic circuit.
❏ Check air supply.
❏ Check sensor adjustment.
❏ Check wether the solenoid is activated.
❏ Change the VMD board.
❏ Change the sensor.
346
E13 : Needle has not
been raised
E13 HH:MM DDMMM inject failed >
needle has not been raised
The motor is activated and moves the needle arm out of the seat or vial. In
the upper position the interrupter pin blocks the light path of the interrupter
sensor. The motor is stopped and the interrupter pin is moved out of the
lights witch. Both positions upper limit and lower limit are determined by the
same lights witch (interrupter sensor).
❏ Check for blockages of the sensor.
❏ Check for proper connection of motor and sensor.
❏ Check for smooth movement of the spindle system.
❏ Check for smooth movement of the bottle vane (bottle sensor).
❏ Check drive nut.
❏ Change NMD board.
❏ Change interrupter sensor.
E14 : Vial position not E14 HH:MM DDMMM inject failed >
found
vial position not found
During the initialization, the sample tray determines its home position
(magnet above home sensor). The shaft encoder mounted onto the tray
coupler provides the information to reach the various vial positions of the
tray. If the selected position cannot be reached the error message will appear.
Possible failure modes are blockages of the mechanical system, defective
encoder or a electronic problem.
❏ Check for mechanical blockages of the mechanical system (sample tray,
tray coupler, belt and so on).
❏ Check all cable connections.
❏ Change encoder.
347
E18 : Home position of E18 HH:MMDDMMM inject failed >
tray not found
home position of tray not found
After moving the requested vial to the injection position the sample tray
moves back to its home position. The encoder checks the movement of the
tray. If the tray cannot be moved the error message will appear. Failure
modes might be mechanical blockages of the tray or problems from the
encoder.
❏ Check for blockages of the system.
❏ Check Encoder signal.
❏ Check Home sensor signal.
been lowered
needle has not been lowered
From the upper position the needle gets the command to move down into the
seat or vial. In case of malfunctions the error appears. A defective bottle in
place sensor might also generate the error.
❏ Check the needle motor and sensor connection.
❏ Check for blockages of the mechanical system.
❏ Check sensor signal.
❏ Lubricate bottle vane.
❏ Check bottle in place sensor.
E20 : Valve not moved E20 HH:MM DDMMM inject failed >
to mainpass
valve not moved to mainpass
Last step in the injection sequence is to turn back the high pressure switching
valve into its main pass position. Problems in the air supply, sensor or board
problems may cause the error message to appear.
❏ Check the pneumatic assembly.
❏ Check cable connections.
❏ Check sensor adjustment.
❏ Change VMD board.
348
E22 : Plunger home
position not found
plunger home pos not found
The plunger of the metering device is moved forward until the home position
sensor indicates the maximum allowed front position. In case the home
sensor cannot be recognized the plunger moves into the mechanical stop.
The motor will be stopped after the programmed time out has been elapsed.
Second possibility is that the motor does not start and the plunger will not
move at all. After time out the error message appears. Possible failure modes
are a misadjusted or defective sensor or a defective motor.
❏ Check alignment of sensor.
❏ Change sensor.
E24 : Tray home
position not found
tray home pos not found
During the initialization the sample tray determines its home position
(magnet above home sensor). If the home position could not be recognized
the error appears (for example sample tray not installed). At the begin of an
injection the system checks for the presence of the home sensor. If this
cannot be recognized the tray will be positioned incorrectly and the error will
show up.
❏ Check the magnet of the sample tray.
❏ Check for mechanical blockages of the mechanical system (sample tray,
tray coupler and so on).
❏ Check tray motor.
❏ Change encoder.
349
Injector Program Error Messages
Injector Program Error Messages
The injector program introduced with the firmware revision 4.0 and greater
comprises the programmable functions such as draw eject and mix sample.
This allows to program particular injections for the autosampler. The injector
program will be part of the method when stored.
E16 : Plunger failed to E16 HH:MM DDMMM inject failed >
draw/mix/eject
inject failed to draw/mix/eject sample
sample
The program line cannot be performed because a lack of draw, eject or mix
volume is left in the syringe. Use the verify function to identify the faulty
program line and correct the volume.
E97 : Program wait
time elapsed
program wait time elapsed
The utility functions allow to wait for remote line changes. If a remote line
change has not occurred before the time-out has elapsed, the error occurs.
E98 : no device for vial E98 HH:MM DDMMM inject failed >
no device for vial
The vial number used exceeds the limit of the vial range. This is possible
when using the SAMPLE+ command (adding a number to the actual vial
number) in the injector program. This function cannot be tested with the
verify function.
E98 : Volume exceeds E98 HH:MM DDMMM inject failed >
limit
volume exceeds limit
Incorrect setting of draw/eject commands may lead to a limit violation for the
injection volume. This function cannot be tested with the verify if the volume
was determined via the “def” command.
350
Normal Operation Messages for Firmware Revision 3.1 and below
Normal Operation Messages for Firmware
Revision 3.1 and below
N OT E
Following error messages describe the failure modes for instruments with
firmware revision 3.1 and below. The error messages will appear in addition
to the errors described before for revision 4.0 and greater.
E12 : Plunger home
position not found
plunger home pos not found
The plunger of the metering device is moved forward until the home position
sensor indicates the maximum allowed front position. In case the home
sensor cannot be recognized, the plunger moves into the mechanical stop.
The motor will be stopped after the programmed time out has been elapsed.
Second possibility is that the motor does not start and the plunger will not
move at all. After time out the error message appears. Possible failure modes
are a misadjusted or defective sensor or a defective motor.
❏ Check alignment of sensor.
❏ Change sensor.
E15 : Needle did not
move into vial
needle did not move into vial
The system assumes that the needle is in its upper position. From this
position the needle will be lowered into the vial. The processor determines
how many steps the motor has to perform. This information will be send to
the NMD board. In case the needle will not be lowered a electrical
malfunction should be the failure mode.
❏ Check connection of the needle motor.
351
E16 : Plunger failed to E16 HH:MM DDMMM inject failed >
draw sample
plunger failed to draw sample
From the home position the plunger is moved back a certain number of steps
to draw the requested volume. Failure mode is the electronics of the VMD
board.
❏ Check connections of metering motor.
E17 : Needle did not
move out of vial
needle did not move out of vial
The needle motor is activated to move the needle in its upper position. If this
action fails the error appears. Possible failure mode is the interrupter sensor,
spindle motor or the NMD board.
❏ Check interrupter sensor.
been raised
needle has not been raised
During this step the needle is raised from any position. In case this step fails
the error message appears.
❏ Check for blockages of the sensor.
❏ Check for smooth movement of the spindle system.
❏ Check drive nut.
❏ Change interrupter sensor.
352
been lowered
needle has not been lowered
From the upper position the needle driver gets the command to move the
needle down into the seat. In case of malfunctions the error appears.
Firmware revision 2.0 and above connect the functioning of the needle
sensor and the bottle in place sensor. If the bottle in place sensor is defective
the error will also appear.
❏ Check the needle motor and sensor connection.
❏ Check for blockages of the mechanical system.
❏ Lubricate bottle vane.
❏ Check sensor signal of interrupter and bottle in place sensor.
353
Events Messages
Events Messages
Event messages give the operator informations about the performed action
of the instrument. Messages will appear in the logbook.
E26 : No vial in
sam[ple tray
E26 HH:MM DDMMM missing vial >
no vial in sample tray
During the injection sequence the bottle in place sensor checks for the
presence of a vial. If no vial is in the tray the message appears in the logbook.
Depending on the system configuration (stop/cont/skip at missing vial), the
message is interpreted as an error or a event message. If the vial sensor is not
connected or defective error message E19 will appear.
❏ Place a bottle into vial position.
❏ Check bottle in place sensor.
❏ Check cabling of sensor board.
❏ Change sensor.
E29 : Sequence done
E29 HH:MM DDMMM sequ done >
sequ exec finished
Sequence finished is an event message. It records the correct termination of
an automated operation.
E30 : Sequence
aborted
E30 HH:MM DDMMM sequ aborted >
sequ exec aborted
Sequence either stopped by operator or error occurred during operation. In
case of an error the Error lamp will be on. Check next logbook line for more
information.
354
18596L/M Vial Tray
18596L/M Vial Tray
The following error messages may occur when the 100 sample tray is
connected to the autosampler.
E31 : Vial in claw
vial in claw remove vial!
After turning on the autosampler or the reset command the 18596L/M
performs an initialization. The initialization fails when there is a bottle in the
claw. If the initialization fails the Error lamp is on and the message appears in
the logbook.
❏ Remove vial from the claw and reset system.
❏ Check bottle sensor.
E32 : Cannot remove
vial from device
cannot remove vial from device
The 18596L/M sample arm tried to take a vial out of its own tray or the 21
sample tray and failed.
❏ Check claw position in teach tray mode.
E33 : Cannot insert
vial in device
cannot insert vial in device
The 18596L/M sample arm tried to place a vial either in the transfer position
of the 21 sample tray or the 100 sample tray and failed. Most common reason
is the presence of a vial in this position. It is also possible that the claw
position was not correctly set in the tray teach mode.
❏ Remove vial from selected position.
❏ Check claw position in teach tray mode.
355
18596L/M Vial Tray
E34 : Failed to home
axis
serious error in 100 vialtray
Error appears when the tray arm is not able to move to its selected position.
❏ Reset autosampler.
❏ Check cable connection.
❏ Change MTD board.
❏ Check tray arm.
E35 : Teach of 100 vial E35 HH:MM DDMMM teach done >
tray done
teach of 100 vialtray done
Event message indicating use of the teach tray function.
E36 : Vial number for
unknown device
E35 HH:MM DDMMM teach done >
teach of 100 vialtray done
This error appears when an incorrect vial range has been set. Example: The
vial range was specified 1 to 30 for the 34 vial tray. When the 21 vial tray is
installed the autosampler will show error E36 when reading 22 or greater.
E38 : Barcode
verification failed
E38 HH:MM:DDMMM verified failed
barcode verification failed
The error can only be seen when the DOS workstation is connected to the
autosampler with 100 vial tray and barcode reader. The label from the vial
will be verified with the setting for the analyzed vial position. A mismatch
will generate the error message.
❏ Check vial label and computer information for correctness.
❏ Check/replace barcode reader and driver board.
E39 : Error state of 100 E39 HH:MM:DDMMM injector aborted >
vial tray
error state of 100 vial tray
The error appears when a previous error on the 100 vial tray is still present
(error LED blinking) and a new action for the 100 vial tray has been started.
356
15
15
Sampler: Maintenance
Information
service and maintenance of the 1050
Autosampler
Sampler: Maintenance Information
This chapter describes the procedures that have to be performed during
servicing and maintenance of the 1050 Autosampler.
You will find procedures for:
• Sampling Unit
• Metering Device
• Analytical Head
• High Pressure Switching Valve
• Sensor Adjustments
358
Sampling Unit
Sampling Unit
N OT E
Needle and needle seat changes can be performed without removing the
sampling unit. For stage 2 it is necessary that the needle is in the needle
change position.
Stage 1: Removing the Sampling Unit
❏ Remove front door.
❏ Remove the Sample Tray.
❏ Remove the Inner Cabinet.
❏ Remove the Leak Tub.
❏ Disconnect the loop capillary either at the needle or at the switching valve.
❏ Disconnect the seat capillary at the switching valve.
❏ Disconnect all cables of the sampling unit from the motherboard.
❏ Remove the holding screw of the sampling unit.
❏ Slide the unit backwards and then to the right to remove it from its place.
❏ Take out the sampling unit.
359
Sampling Unit
Stage 2: Removing the Needle
❏ Move the needle in the needle change position (Control Configuration).
❏ With the Pozidrive# 2 loosen the clamp screw.
❏ Turn the needle with the ZDV fitting out of its recess and lift the needle to
get it out of the clamp screw.
❏ Disconnect the needle from the ZDV fitting.
❏ Needle with laser welded fitting: Disconnect the loop capillary from the
needle fitting
Figure 130
Needle Change
360
Sampling Unit
Stage 3: Installation of the Needle
N OT E
If a new needle will be installed the needle seat should be changed too
otherwise leaks might be possible.
❏ Needle with laser welded fitting: Connect the loop to the needle fitting and
tighten it.
❏ Connect the new needle to the ZDV fitting and screw it hand tight.
❏ Insert the needle into the groove behind the clamp plate and swing the ZDV
fitting back to the recess.
❏ Tighten the connection at the ZDV fitting (only old version).
❏ Tighten the clamp screw.
N OT E
No further needle adjustment necessary. In case the needle is not straight
carefully bend the needle for proper alignment.
Stage 4: Removing the Seat Capillary
N OT E
To avoid possible leaks, it is recommended to install a new needle seat when
the seat capillary will be changed.
❏ Raise the needle (Control Test Functions).
❏ With a wrench 5/16” unscrew the seat and remove it.
❏ Remove the seat capillary from the socket.
❏ Disconnect the seat capillary at the High Pressure Switching Valve.
361
Sampling Unit
Stage 5: Disassembling the Needle Arm
N OT E
Follow the steps of this procedure when replacing either guide rod, spindle,
needle arm or drive nut.
❏ Remove needle (make sure that the needle is in its change position or turn
the motor coupler to reach it) and interrupter sensor (only in case of
sensor or needle arm change readjustment necessary).
❏ Loosen the set screw for the guide rod and remove it from the sampling
unit. It might be necessary to use a mallet and a punch pin to get the guide
rod out.
❏ Remove the retainer on top of the spindle and save retainer and spring
disc.
❏ Loosen the screw of the motor coupler which holds the spindle.
❏ Move the needle arm up to move the spindle out of its ball bearing (some
force is required).
❏ Remove the brass bearing sleeve from the top shaft of the spindle and
carefully take out the assembly.
Stage 6: Reassembling the Needle Arm
❏ Insert the spindle into the top hole and then insert the small shaft into the
ball bearing.
❏ Push the motor coupler as close as possible to the bearing and fix it in this
position.
❏ Insert the guide rod and fix it with the set screw.
❏ Insert the spindle bearing sleeve and the spring disc at the top of the unit
and mount the retainer.
❏ Reinstall needle and interrupter sensor and perform required adjustments
(see “Adjustment of Interrupter Sensor with test board” on page 377).
362
Sampling Unit
Stage 7: Disassembling the Tray Mechanic
N OT E
Follow this instructions when either changing Tray Motor, Gear, Belt, Tray
Coupler, toothed wheel or Quadrature Encoder, see Figure 131 on page 364.
❏ Remove bottom cover of the sampling unit.
❏ Remove the tray Motor.
N OT E
The Tray Motor is fixed from the bottom. Loosening the four screws on top of
the motor will damage the tray motor.
❏ Remove the belt
N OT E
The belt roller will be pressed to the belt to stretch it. But the pretension of the
belt should not affect the smooth movement of the tray coupler.
❏ Remove the black cap in the sample unit housing to get access to the two
set screws of the coupler toothed wheel.
❏ Loosen the set screws and remove the coupler from the unit.
❏ Carefully slide the toothed wheel out of its place, see Figure 131 on page
364.
N OT E
The toothed wheel is coupled with the encoder slit wheel which is running in
the quadrature encoder. Take care not to damage the slit wheel while lifting
the assembly.
❏ Disconnect the cable of the encoder unscrew it and take it out.
N OT E
The encoder cable is not keyed. Make sure that position 1 of the cable is
connected to position 1 of the encode, see Figure 131 on page 364. If the cable
is positioned in the wrong direction the system cannot initialize the tray. The
behavior is like with a defective home sensor.
363
Sampling Unit
Figure 131
Bottom View of the Sampling Unit
364
Metering Device
Metering Device
N OT E
Move the plunger into the plunger change position before removing the
metering device from the instrument.
Removing the Metering Device
❏ Remove Top Cover.
❏ Disconnect the two capillaries to the head of the Metering Device.
❏ Disconnect motor and sensor cable.
❏ Remove the transport securing screw.
❏ Remove the screw which fixes the Metering Device on the High Pressure
Switching Valve.
❏ Take out the Metering Device.
Removing the Gear Belt
❏ Remove the cover of the gear box.
❏ Remove the stepper motor.
❏ Take out the gear belt.
365
Metering Device
There are two different versions of the analytical head available. In the latest
version the spring is integrated in the adapter housing. The following table
shows the serial number prefix at introduction of the new adapter housing
design.
Table 88
N OT E
New Analytical Head Assembly
Autosampler
SN Prefix
Version
79855A/B
3404 G .....
new; Procedure2
79855A/B
3406 A .....
new; Procedure 2
Follow this instruction when either changing Plunger Seal or Plunger. Do not
forget to use the plunger change position in the control section before
removing the analytical head assembly. The numbers in brackets refer to
Figure 132 on page 367.
Procedure 1: Analytical Head Assembly with old Adapter
Housing
Stage 1: Disassembling the Analytical Head Assembly
❏ Unscrew the Analytical Head Assembly and remove it from the Metering
Drive.
❏ Place the Assembly on its round head (13) and remove the two screws
(14).
❏ Carefully pull the head (13) to separate it from the body (9).
N OT E
Do not twist the head while pulling. This could break the plunger.
366
Metering Device
Stage 2: Changing the Seal
❏ Remove the seal keeper (11) from the head (13).
❏ Using the three millimeter hexagonal key remove the seal (12).
❏ Clean the head chamber (13) from all seal particles. Best is to use a
degreaser spray (for example 8500-0232).
❏ Insert a new seal (12).
Stage 3: Disassembling the Body
❏ Remove the support ring (10) or the support seal assembly.
❏ Hold the body down on a flat surface loosen the setscrew (15) and
carefully release the tension of the spring.
WA R N I N G
The spring will catapult the body up if released without holding it.
Figure 132
Analytical Pump Head Assembly (old)
367
Metering Device
Stage 4: Reassembling the Analytical Head Assembly
❏ Place sapphire plunger (7) and spring (8) into the spring support (6).
❏ Place the adapter (9) on a flat surface and insert the parts from the
previous step.
❏ Hold the adapter (9) from one side with the thumb and press the spring
support (9) with plunger and spring with the fingers into the body.
❏ Hold the spring support (6) with one hand in place and fix the setscrew.
❏ Slide the support ring (10) or the support seal assembly onto the plunger.
N OT E
If the support ring (10) or the support seal assembly sticks at the body when
sliding down the plunger push the plunger (7) slightly from the bottom. This
will center the plunger and the ring keeper slides into its position.
❏ Place the seal keeper (11) on the seal (12) of the head.
N OT E
In this position the seal keeper guides the plunger into the seal and reduces
the possibility to break the plunger.
❏ Carefully place the head (13) onto the adapter (9).
❏ Turn the assembly upside-down insert the screws (14) and fix them
stepwise with increased torque.
N OT E
It is important that the surface of head and adapter are parallel to each other
to obtain a good seal.
368
Metering Device
Procedure 2: Analytical Head with new Adapter Housing
Stage 1: Disassembling the Analytical Head Assembly
❏ Unscrew the Analytical Head Assembly and remove it from the Metering
Drive.
❏ Place the Assembly on its round head (6) and remove the two screws (2).
❏ Pull the adapter (3) straight up from the head (6) being careful not to put
any sidewards strain on the sapphire piston (1), since it could shear and
break.
❏ Put the adapter housing (3) aside taking care to avoid dropping the piston
(1) from the housing.
N OT E
The piston is not secured in the adapter housing and will fall out when the
housing is turned upside down.
❏ Remove the piston (1) from the adapter (3).
❏ Check for scratches and dirt on the piston.
N OT E
Dirt on the piston surface can be removed by using a small quantity of
toothpaste.
Stage 2: Changing the Seal
❏ Remove the support seal assembly 4) from the head (6).
❏ Using the three millimeter hexagonal key remove the seal (5).
❏ Clean the head chamber (6) from all seal particles. Best is to use a
degreaser spray.
❏ Insert a new seal (5).
❏ Place the support seal assembly (4) onto the seal (5).
369
Metering Device
Figure 133
Analytical Pump Head Assembly (new)
Stage 3: Reassembling the Analytical Head Assembly
❏ Prepare the head (6) as described beforehand.
❏ Place the adapter housing (3) without the piston (1) onto the head (6).
❏ Insert the two screws (2) and tighten until hand tight.
N OT E
Tightening the screws fully will require much more force to push the piston
into its position in the seal.
❏ Insert the piston (1) into the adapter housing (3) and carefully push it into
the seal.
❏ Tighten the two screws (2) stepwise with increasing torque. Make sure
that head and adapter surfaces are in parallel.
370
Metering Device
Reassembling the Metering Device
❏ Put the Analytical Head Assembly onto the metering drive and insert the
two screws.
N OT E
The Head Assembly should be installed like shown in Figure 132 on page 367
or Figure 133 on page 370. The capillary from the high pressure switching
valve is connected to the bottom of the head assembly.
❏ Tight the screws stepwise with increasing torque.
371
Stage 1: Removing
❏ Disconnect the air supply at the rear of the module.
❏ Remove front door and inner cabinet.
❏ Remove the leak tub.
❏ Remove the metering device.
❏ Disconnect all capillaries from the valve.
❏ Unscrew the holding screw at the base.
❏ Slide the unit out of its holder.
❏ Disconnect the air tubings.
❏ Take out the High Pressure Switching Unit.
Stage 2: Disassembling
❏ Loosen and remove the three socket head stator screws (4).
❏ Remove the stator (2) from the top of the valve.
❏ Remove the stator ring from the valve. Take special care not to lose the
stop pins in the stator ring.
❏ Using the blade of a screwdriver, release the rotor seal from the valve.
372
Figure 134
373
Adjust the Sensors
Adjust the Sensors
Adjusting of the sensors inside the instrument is very difficult. For that
reason the extender test board (see chapter Electronics) has been designed.
It allows to operate the assemblies outside of the instrument with easy
access to the sensors.
The firmware of the autosampler itself includes a service level which allows
to verify the sensor positions and to perform the sensor adjustment.
This section describes:
• Service Only Level
• Sensor adjustment Sampling Unit
• Sensor adjustment Metering Device
• Sensor adjustment High Pressure Switching Valve
Service Only Level
The service only will be accessed with a “password” to avoid accidental
changes of parameters.
N OT E
Do not enter or change any numbers in this part which are not described in the
following sections. Accidental change of system parameters could damage the
instrument.
Entering Service Only
❏ Press CTRL and with NEXT move the cursor to the < end of list >.
❏ Enter password (79855) and SERVICE ONLY will be displayed.
❏ With PREV or NEXT the following displays are accessible.
EXECUTE STEP 1
INSTR# 1 VAL 1 ; 0
Read the notes on next page first.
374
Adjust the Sensors
N OT E
EXECUTE STEP allows the performance of the step commands (Test
Functions) by entering the step number.
#1 Switch Valve Unit to bypass.
#2 Initialize Metering Device.
#3 Raise needle.
#4 Move vial underneath needle.
#5 Lower needle.
#6 Draw sample up from sample vial.
#7 Raise needle.
#8 Move vial to home position.
#9 Lower needle.
#10 Switch Valve Unit to flow through sample loop.
INSTR# allows to read the position of the various sensors and can be used for
adjustment of sensors. An negative number (for example -2) writes the actual
value into the processor memory for adjustment calculations. For more
information see chapter sensor adjustment.
#1 Reads the position of the shaft encoder.
for example INSTR# 1 VAL 1 ; 0
#2 Reads the left stop of the sample tray.
for example INSTR# 2 VAL -56 ; -56
#3 Reads the right stop of the sample tray.
#4 Calculate correction value for measurement performed under #2 and #3.
The result is shown in µm.
#5 Reads the data which represents the actual sensor status for the complete
sampling unit (interrupter home and bottle sensor).
for example INSTR# 5 VAL 227 ; 227 after initialization. Depending on
the sensor which is activated or not the value changes in increments of 1, 4, 8.
8 for the sample tray
4 for the bottle in place sensor
1 for interrupter sensor.
375
Adjust the Sensors
N OT E
#6 Reads the data which represents the actual sensor status for the metering
home sensor and the valve position sensor. Readings can be used for sensor
adjustment or troubleshooting.
for example INSTR# 6 VAL 240 ; 240 after initialization. Depending on
the sensor which is activated or not the value changes in increments of 1 or 8.
8 for the metering device home sensor.
1 for the valve position sensor.
Sensors of the Sampling Unit
N OT E
Four sensors are controlling the various functions of the sampling unit.
N OT E
Interrupter Sensor:
Initializes a signal to stop the needle motor at upper and lower limit. The
adjustment ensures a defined force for the needle into the seat and determines
the position of the needle in the sample vial during the injection cycle.
Home Sensor:
Determines the home position of the sample tray. The processor counts the
selected vial number relative to the home position. Adjustment ensures that
the needle hits the septa of the sample vial in each vial position.
Bottle in Place Sensor
Checks for presence of a vial during the injection cycle. No adjustment
required.
Quadrature Decoder
Checks the actual position of the 21 sample tray for adjustment of the 21 vial
tray. If the 34 vial tray is installed the more precise procedure should be
selected. No adjustment required.
The home sensor will be adjusted with the build in service level test features.
For the interrupter sensor there are two adjustment procedures available.
Adjustment can be done via the extender test board which is the easiest way
because of the accessibility of the sensor. If the test board is not available the
features of the service level also allow adjustment of the sensor.
376
Adjust the Sensors
Adjustment of Interrupter Sensor with test board
❏ With the test functions commands move the needle into upper position.
❏ By turning the motor coupler move the needle arm downwards until the
interrupter pin just touches the upper plate.
❏ Now move the needle arm upwards 1 mm.
N OT E
One revolution of the spindle moves the needle arm 1.5 mm up. Therefore 240°
represent 1 mm.
❏ Position the sensor that the LED on the extender board just changes its
state from on to off (should remain off) and fix it in this position.
Adjustment of Interrupter Sensor via Service Only Level
❏ Follow steps 1 to 3 of the previous described procedure.
❏ Enter SERVICE ONLY level.
❏ Move to the Instr# and enter #5 to get the following display.
INSTR# 5 VAL 239 ; 239 (without sample tray)
❏ Position the interrupter sensor that the value just changes to 238. Move it
back until you reach 239 and fix it in this position.
Adjustment of Home Sensor - procedure for 21/34 vial tray
N OT E
During RESET of the autosampler the processor finds the home position of
the sample tray and stores the actual dehydrator encoder reading as zero
position.
The position of vial #1 is used as reference for the adjustment. With
INSTR# 1 the processor reads the steps from the home position to the actual
position. If the tray is aligned correctly the encoder should read the following
values for the position of vial #1:
21 vial tray: VAL 0;-200 tolerance ±1
34 vial tray: VAL 0;-191 tolerance ±1
The above values can be obtained from the SERVICE ONLY level.
377
Adjust the Sensors
Adjustment Procedure
❏ Remove door, inner cabinet and the top cover from the autosampler.
❏ Make sure that the tray is installed correctly and that the vial is in position
#1.
❏ Using the CTRL functions of the instrument RESET the autosampler.
❏ Enter the TEST FUNCTIONS.
❏ Use single steps 3 to raise the needle.
❏ In the display SINGLE STEP 4 POS. TRAY AT 10 change the vial
position to 1 (use > ) and press 1 ENTER. They tray moves to position #1.
❏ The needle should point to the center of the vial. If not, turn the tray
manually until the position is correct.
❏ *Enter the service only level and select the following display
INSTR# 1 VAL 0; -XXX.
N OT E
XXX is the value for the actual position of the tray. If the home sensor is
adjusted correctly, the value should be -191 ±1 for the 34 vial tray or -200 ±1
for the 21 vial tray. If XXX differs from the above values the sensor has to be
adjusted.
6 counts represent approximately 1mm.
❏ Remove the tray, loosen the sensor screws and move the sensor
❏ Towards the front of the autosampler (ccw) when the actual values of
XXX are larger then the nominal (for example -199 for 34 vial tray; or
-205 for 21 vial tray).
❏ Towards the back of the autosampler (cw) when the actual value of XXX
is smaller then the nominal (for example -185 for 34 vial tray; or -195 for
the 21 vial tray).
❏ Verify the correct position. Insert the tray, RESET the injector and repeat
step 4 to 8 of this procedure.
378
Adjust the Sensors
Sensor of the High Pressure Switching Valve
The sensor at the back side of the high pressure switching valve controls the
correct movement of the valve.
❏ Take the high pressure unit out of the instrument and make connection to
the extender test board for operation outside of the instrument.
❏ Make sure that the valve is in one of its end positions.
❏ Connect the sensor to the holding arm and move it until the LED on the test
board becomes on. Then move it downwards until the LED just turns off
and fix the board in this position.
❏ * Verify the proper operation of the high pressure switching valve.
Adjustment of Valve Sensor via Service Only
❏ Follow step 1 to 2.
❏ Enter SERVICE ONLY level and move to the Instr# and enter #6 to get the
following display.
INSTR# 6 VAL 248 ; 248 (metering device in home position).
❏ Position the sensor that the display value just changes to 249. Move the
sensor back until the value changes back to 248 and fix it in this position.
❏ Verify proper operation of the switching valve.
379
Adjust the Sensors
Metering Device Home Sensor
The metering drive home sensor determines the maximum allowed front
position of the plunger. A lever mounted to an spindle mechanism moves into
the light switch to stop the motor. Adjustment is necessary that the plunger
can not run into the mechanical stop of the analytical head and to be
compatible with future options.
The adjustment for the metering home sensor is not critical. Therefore a
rough alignment without firmware support is sufficient.
The sensor housing has a slot for the adjustment. Mount the sensor into a
middle position of the sensor housing.
Use the test functions to move the piston to home position. The plunger
should stop before the mechanical stop. If the plunger moves into the stop
adjust the sensor slightly back and try again.
380
16
16
Sampler: Parts Information
1050 Autosampler
This chapter gives diagrams for parts identification and the complete parts
listings respectively for the 1050 (Ti) Autosampler.
• Electronic Boards
• Ti - Parts
• Overall Diagram
• Solvent Flow Path
• Sampling Unit
• Metering Drive and Analytical Head
• High Pressure Switching Valve
• Pneumatic Valve Assembly
382
Electronic Boards and Fuses
Electronic Boards and Fuses
Electronic Boards
Table 89
Electronic Boards
Item
Description
Part Number
Exchange
1 Power Supply Board
DPS-B 5061-3374
01050-69374
2 Maxi Tray Drive Board for 18596A/L
MTD
01078-66503
01078-69503
3 Maxi Tray Drive Board for 18596B/M MTD
01078-66513
01078-69513
4 Rotor Reader Drive Board
RRC
01078-66507
5 Valve Metering Drive Board
VMD
01078-66501
6 Firmware Board
FIM
01078-66506
7 Needle Mini Tray Drive Board
NMD 01078-66502
01078-69502
8 Communication Interface Board
CIB
5061-3382
01050-69582
9 Common Main Processor Board
CMP
50613380
01050-69580
10 Fluorescent Indicator Module
FIP
5061-3376
11 Motherboard
ALM
01078-66504
01078-69501
Fuses
Table 90
Fuses
Description
Board
Part Number
DPS-B
2110-0003
DPS-B
2110-0002
Fuse F12, 250 mA
VMD
2110-0004
Fuse: ICP1 1 A
FIP
2110-0099
383
Following is a complete list of all special Ti parts. For the assemblies and
accessories kits only the Ti parts are mentioned.
Table 91
Description
Part Number
Description
Part Number
Ti - Needle
01079-67201
Exchange
01079-60004
01079-69004
Ti - ZDV Fitting
5021-1871
Ti - Rotor Seal TEFZEL pH 12.5
0101-0627
ID 0.5 1.08 m lg
01079-87302
Ti - Pump Capillary ID 0.25 70 cm lg
01079-87306
Ti - Valve Metering Capillary
ID 0.25 140 mm lg
01079-87301
Ti - Sampling Unit
01079-60001
Ti - Seat Capillary
ID 0.17 180 mm lg
01079-87303
Ti - Needle Seat (Peek)
01079-67101
Ti - Capillary 500 µl Volume
ID 0.5 2.8 m lg
01079-87307
Ti - Capillary 2 ml Volume
ID 0.94 2.8 m lg
01079-87308
Ti - Flush Union
01079-23203
Analytical Head Assembly, includes
01079-60003
Ti- Piston Seal
0905-1199
Ti - Head Body
01079-27710
Ti - Column Capillary ID 0.17 70 cm lg 01079-87305
384
Overall Diagram 79855A/B
Table 92
Overall Diagram
Item Description
Part Number
Item Description
Part Number
1 Foot Support
01078-21001
21 Flexible Tubing (12ft)
5021-7127
2 100 Sample Tray
18596L/M
22 Press Switching Cable
01078-61601
3 Tray Support Assembly
01078-64701
23 Nut M4
0535-0056
0515-0889
24 Pneumatic Assembly
01078-66101
5 Cover Hinge
01078-44112
0515-1666
0515-0889
26 Name Plate
5041-2170
7 Fan Holder
01078-02302
27 Logo Base
5041-2144
8 Fan Assembly
3160-0862
28 Front Panel
01078-60301
29 Inner Cabinet
01078-64401
0515-1918
5021-1862
10 Sheet Metal Kit
01078-68701
5041-2145
0515-0889
32 Leak Assembly, includes 33, 34,
35
5062-8551
12 Bumper
0403-0427
36 Sample Tray
01078-44501
13 Foot Front
5041-2161
37 Sample Tray 34 vials
01078-44511
14 Push bottom, white
5041-1203
38 Sampling Unit
01078-60001
15 Actuator
5041-2162
0515-0887
1460-1510
40 Flexible Tubing (12ft)
5021-7127
17 Front Plate
5001-3725
41 Connector
0100-1175
18 Leak Sensor
5061-3356
42 Muffler
0100-1176
0515-1105
43 Adapter
79846-23202
20 Leak Tub
01078-44502
44 Connector, long
0100-1047
Fan Upgrade Kit (for ALS without 01078-68720
fan)
9 Screw M4 20 mm lg (special)
385
Table 92
Overall Diagram
Item Description
Part Number
Item Description
Part Number
45 Valve Metering Capillary
ID 0.25 140 mm lg
01078-87301
59 Screw M4 6 mm lg
0515-0898
46 Top Cover
01078-04110
60 Analytical Head Assembly
01078-60003
47 Loop Capillary 100 µl
ID 0.5 1.08 m lg
01078-87302
61 Metering Drive
01078-60002
48 DPS-B
5061-3374
62 Cable; FIP to ALM
5061-3400
49 Plate Cover P/S
5001-3728
63 HPS Valve
Exchange
01078-60004
01078-69004
50 MTD Board (18596A/L)
Exchange
01078-66503
01078-69503
64 Valve Waste Capillary
ID 0.5 130 mm lg
01078-87304
50 MTD Board (18596B/M)
Exchange
01078-66513
01078-69513
65 Screw M4 6 mm lg
0515-1963
51 Cover large (3 inch)
01078-04115
66 Screw M5 6 mm lg
0515-1117
52 FIM Board
01078-66506
67 Valve Base Plate
part of (10)
53 Screw M3 6 mm lg
0515-0912
68 Valve Holder Plate
01078-02310
54 VMD Board
Exchange
01078-66501
01078-69501
69 Card Cage
part of (10)
55 NMD Board
Exchange
01078-66502
01078-69502
70 Keyboard Module
01078-60201
56 Cover small (1.3 inch)
5001-3721
71 Fluorescent Interface
5061-3376
57 CMP Board
Exchange
5061-3380
01050-69580
72 ALM
01078-66504
0515-1117
386
Figure 135
387
Figure 136
388
Hydraulic Flow Path
Hydraulic Flow Path
Table 93
Hydraulic Flow Path Autosampler
Item Description
Part Nmber
Item Description
6 Multi Draw Kit, includes
Part Nmber
1 Pump Capillary ID 0.25 70 cm lg
01078-87306
1 Ti - Pump Capillary
ID 0.25 70 cm lg
01079-87306
500 µl Volume
ID 0.5 2.8 m lg
01078-87307
2 Valve Metering Capillary
ID 0.25 140 mm lg
01078-87301
2 ml Volume
ID 0.94 3.1 m lg
01078-87308
2 Ti - Valve Metering Capillary
ID 0.25 140 mm lg
01079-87301
Flush Union
79846-23203
3 Loop Capillary 100 µl
ID 0.5 1.08 m lg
01078-87302
6 Ti - Multi Draw Kit, incudes
01079-68704
3 Ti - Loop Capillary 100 µl
ID 0.5 1.08 m lg
01079-87302
Ti - Capillary 500 µl Volume
ID 0.5 2.8 m lg
01079-87307
4 ZDV Fitting
0100-0900
Ti - Capillary 2 ml Volume
ID 0.94 2.8 m lg
01079-87308
4 Ti - ZDV Fitting
5021-1871
Ti - Flush Union
01079-23203
5 Needle (fitting laser welded)
01078-67200
5 Ti - Needle
01079-67201
7 Column Capillary
ID 0.17 80 cm lg
01078-87305
5 Needle Grooved
01078-67202
7 Ti - Column Capillary
ID 0.17 70 cm lg
01079-87305
6 Seat Capillary
ID 0.17 180 mm lg
01078-87303
ID 0.5 130 mm lg
01078-87304
6 Ti - Seat Capillary
ID 0.17 180 mm lg
01079-87303
01078-68704
389
Hydraulic Flow Path
Figure 137
Solvent Flow Path
390
Sampling Unit
Sampling Unit
Table 94
Sampling Unit
Item Description
Part Nmber
Item Description
Part Nmber
Complete Assembly
01078-60001
18
Lubrication Ring
5001-3749
Complete Ti - Assembly
01079-60001
19
Coupler Assembly
01078-63201
1
Tray Motor Assembly
01078-64702
20
Plug Hole
6960-0076
2
Screw M3 12 mm lg
0515-1110
21
Motor Coupler
1500-0796
3
Washer
3050-0890
22
Set Screw M5 10 mm lg
0515-1741
4
Screw M2.5 6 mm lg
0515-0894
23
Belt
1500-0698
5
BOS Board
01078-66505
24
Belt Roller
01078-22501
6
Screw M3.5 6 mm lg (older
version)
0515-0887
25
Bearing Sleeve
1410-1253
6
Screw M3.0 6 mm lg
0515-0886
26
Washer
3050-0891
7
Washer
3050-0892
27
Screw M3 25 mm lg
0515-1060
8
Cable Clamp
1400-0082
28
Needle Seat
79846-67101
9
Retaining Ring
0510-1310
28
Ti - Needle Seat (Peek)
01079-67101
10
Washer Spring
3050-1299
29
Seat Capillary
ID 0.17 180 mm lg
01078-87303
11
Bearing Sleeve
1410-1261
29
Ti - Seat Capillary
ID 0.17 180 mm lg
01079-87303
12
Sampler Body
no PN
30
Socket
01078-25201
13
Screw M2.5 6 mm lg
0515-0894
31
Shock Mount
1520-0260
14
Washer
3050-0890
32
Screw M3 6 mm lg
0515-0886
15
Home Sensor
5180-0861
33
Spindle Motor Assembly
01078-64703
16
Traction Relief
5001-3752
34
Spring
1460-2365
17
Tray Coupler
01078-43201
35
Needle Arm Assembly
01078-60000
391
Sampling Unit
Table 94
Sampling Unit
Item Description
Part Nmber
Item Description
Part Nmber
36
Washer
3050-0890
43
Ti - ZDV-Fitting
5021-1871
37
Screw M2.5 6 mm lg
0515-0894
44
Needle (fitting laser welded)
01078-67200
38
Interrupter Sensor
5041-2142
45
Connector Cable
01078-61602
39
Cable Clamp
1400-0082
46
Traction Relief
5001-3752
40
Washer
3050-0892
47
Quadrature Encoder
1990-1265
41
Screw M3.5 6 mm lg (old version) 0515-0887
48
Screw M2.5 25 mm lg
0515-1640
41
Screw M3.0 6 mm lg
49
Screw M3.5 6 mm lg
(older version)
0515-0887
42
Needle (old design)
49
Screw M3.0 6 mm lg
0515-0886
42
Ti - Needle
01079-67201
50
Gear Cover
01078-04101
43
ZDV-Fitting
0100-0900
51
Bumper Foott
0403-0282
392
0515-0886
Sampling Unit
Figure 138
Sampling Unit I
393
Sampling Unit
Figure 139
Sampling Unit II
394
Sampling Unit
Table 95
Item Description
Part Nmber
Arm Spare Part Kit
Item Description
Part Nmber
01078-68706
3 Bottle Vane
no PN
1 Bottle Vane Screw
no PN
4 Clamp Plate
no PN
no PN
Figure 140
395
Metering Drive
Table 96
Metering Drive
Item Description
Part Nmber
Item Description
Part Nmber
01078-60002
3 Interrupter Sensor
5041-2142
1 Metering Motor
no PN
0515-0894
2 Belt
1500-0697
5 Washer
3050-0890
Analytical Head (Old Version)
Table 97
Analytical Head (old version)
Item Description
Part Nmber
Item Description
Part Nmber
01078-60003
11 Seal Keeper
order (10a)
Ti - Analytical Head Assembly
01079-60003
12 Seal (2/pk)
5062-8516
6 Spring Support
no PN
12 Ti-Seal
0905-1199
7 Sapphire Plunger
5063-6586
13 Head Body
01078-27710
8 Spring
1460-2220
13 Ti - Head Body
01079-27710
9 Adapter
see new
version
0515-0850
order (10a)
0515-1039
5001-3739
0515-2118
10 Support Ring
10a Support Seal Assembly
396
Figure 141
Metering Drive and Analytical Head (old version)
397
Analytical Head (New Version)
Table 98
Analytical Head (new version)
Item Description
Part Number
Item Description
Part Number
01078-60003
5 Seal (2/pk)
5062-8516
Ti - Analytical Head Assembly
01079-60003
5 Ti-Seal
0905-1199
1 Sapphire Plunger
5063-6586
6 Head Body
01078-27710
2 Screw M4 40 mm lg
0515-0850
6 Ti - Head Body
01079-27710
3 Adapter with spring
01078-23202
7 Screw M5 60 mm lg
0515-2118
5001-3739
Figure 142
Analytical Head (new version)
398
Table 99
Item Description
Part Number
Item Description
Part Number
Assembly
01078-60004
7 Valve Sensor Board
79846-66504
Exchange Assembly excluding
items 11 to 17
01078-69004
8 Bracket Actuator
79846-01206
Ti - New Assembly
01079-60004
9 Screw M5 6 mm lg
0515-1510
Exchange Assembly excluding
items 11 to 17
01079-69004
10 Elbow Fitting
0100-1408
0101-0626
ID 0.5 130 mm lg
01078-87304
0101-0627
12 Valve Holder Plate
01078-02310
2 Stator
1535-4044
13 Valve Base Plate
part of
01078-68701
3 Isolation Seal
1535-4046
14 Screw M5 6 mm lg
0515-1510
4 Stator Screw
1535-4857
15 Screw M4 6 mm lg (flat head)
0515-1963
5 Stator Set Screw
no PN
0515-1105
6 Bearing Ring
1535-4045
0515-0894
1 Rotor Seal VESPEL
Ti - Rotor Seal TEFZEL pH 12.5
399
Figure 143
400
Pneumatic Valve Assembly
Table 100
Pneumatic Assembly
Item Description
Part Nmber
Complete Assembly excluding
items 5, 6 and 7
Item Description
Part Nmber
01078-66101
4 Elbow Fitting
0100-1408
1 Solenoid Valve
0101-0559
5 Screw M4 35 mm lg
0515-1666
2 Low Air Pressure Switch 1/8”
3107-0019
6 Nut M4
0535-0056
3 Push-in Fitting Male
0100-1410
7 Pressure Switch Cable
01078-61601
Figure 144
401
402
17
17
Sampler: Additional Information
This section gives the following informations:
• Autosampler Prefix History
• Autosampler Firmware History
• Update to Firmware Revision 4.0
• Adding the 100 vial tray
• Intermittant E17
• Update the autosampler with a fan
404
Product History
Product History
Since introduction of the 1050 Autosampler in 1988 a couple of hardware and
firmware changes have been implemented into the production. With most of
this changes the serial number prefix has been changed too. Following is a
list of all prefix changes done in Waldbronn and Little Falls.
Table 101
Product History 79855A/B
S/N Prefix
Changes
2813 G ... 28XX A ...
Introduction of the 1050 Autosampler
2848 G ... 2902 A ...
Introduction of firmware revision 2.0
2934 G ... 2941 A ...
2944 G ... 2950 A ...
#024 (add 100 vial capacity) for support of 18596B/M tray
3020 G ... 30XX A ...
Fan Assembly added to the autosampler
3031 G ... 30XX A ...
Introduction of 1050 Ti Autosampler
3031 G ... 3033 A ...
3117 G ... 3121 A ...
3130 G ... 3130 A ...
Support Ring for Analytical Head with Ceramic Insert
3141 G ... 3141 A ...
3313 G ... 3315 A ...
New Revision of High Pressure Switching Valve
3313 G 02712 or 3315 A 02247
Modification of ALM board to increase fan voltage
3334 G ...
Introduction of support seal assembly
3338 G ...
Introduction of firmware rev. 4.2
3404 G ... 3406 A ...
Analytical Head - Spring integrated in the adapter
May 1995
Needle with integrated Fitting
October 1998
Adapter (Analytical Head) with new spring
3442 G ... 3443 A ...
Sampling Unit - ZDV Fitting Laser welded to the Needle
405
Firmware Revisions
Firmware Revisions
Rev 1.0 was the firmware at introduction of the 79855A Autosampler.
Known Problem: Time table execution
Problem is in the timetable execution, if there is more then one entry in the
timetable. Manually stop of the run (before elapsing the stoptime) may lead
to wrong behavior of the relay contacts in the next run.
Workaround/Solution
1 To stop a run manually reduce the stoptime to a value lower then the
actual run time.
2 Other 1050 modules do not show this problem and can be used as an
alternative to control the relay contacts.
Europe/ICON
2848 G .....
US/Canada
2902 A .....
Firmware revision 2.0 incorporates:
• Support of 18596A/L sample tray.
• Configuration of BCD output (either 2 digit BCD or 8 bit binary coded)
• Draw Offset Position for the needle.
• Fix of revision 1.0 bug.
406
Firmware Revisions
Europe/ICON
2934 G .....
US/Canada
2941 A .....
• Support of 18596B/M sample tray (Killer Bee).
N OT E
The 18596B/M sample tray is not compatible to the 18596A/L tray. It does
requires a change in firmware and hardware (MTD board). Nevertheless
firmware revision 2.1 support both versions of the tray.
Known Problem: Intermittant BUS ADDRESS ERRORS
Intermittant BUS ADDRESS ERRORS or similar lock ups of the autosampler
may occur when the 100 vial tray is connected.
A firmware bug in combination with a weak air supply genereates the
problem. During the injection cycle a underpressure condition may be
detected. This condition might be misinterpreted and then leads to the error.
407
Firmware Revisions
Europe/ICON
3020 G .....
US/Canada
3019 A .....
• Communication with the HPIB communication interfaces.
• Support of the Roto Reader of the 18596A/B tray.
• Support of the 34 vial tray in the autosampler.
• Introduces the AUTO-ON feature.
Known Problems
❏ Serious Problem with 21 vial tray.
If the 21 vial tray is not in home position at the begin of an injection, the
tray will be recognized as 34 vial tray and positioned accordingly. Damage
of the needle can be the result.
Any time the 21 vial tray has been moved or replaced, perform a RESET
INJECTOR prior to starting an injection.
❏ Reset during injection Break.
If the injection cycle is interrupted (injection break-stop during injection)
and followed by a RESET INJECTOR hardware crashes may appear. It
was observed that either the syringe piston was forced into the
mechanical stop or the tray was moved against the needle arm. Swtching
off and on the autosampler will cure the problem.
Do not use the RESET INJECTOR during injection break.
❏ Teach Mode
If one of the possible teach modes (tray or bar code reader) is done
without a vial in position 101 the autosampler is forced into an error
mode. The error LED is blinking and the display shows the value 3000.
ESCAPE and RESET INJECTOR brings the autosampler back into the
normal operation mode.
408
Firmware Revisions
Europe/ICON
3031 G .....
US/Canada
3033 A .....
The final tests for the DOS workstation revealed some firmware bugs in the
autosampler firmware. Revision 3.1 fixes these communication bugs.
Known Problems
❏ Problems with Relay Contact 2.
Relay Contact 2 generates a double pulse each time it is turned on or off.
❏ Intermittant E26, E32, E33 or E34: 100 vial tray arm moves two vials into
position #16 of the 21 vial tray.
A firmware bug in the synchronization between the autosampler and the
100 vial tray generates the problem. The firmware expects that the
metering syringe is already in home position before the 100 vial tray
places its vial into the 21 vial tray. With large injection volumes (for
example100 µl) and lower eject speed (for example <200 µl) the
initialization of the syringe takes longer then the movement of the tray
arm.
Set the EJECT SPEED to at least 300 when using larger injection volumes.
409
Firmware Revisions
Europe/ICON
3117 G .....
US/Canada
3121 A .....
• Support of Injector Program.
• Introduction of additional displays.
• Changes in tray movement.
• Addition of error messages.
• Fixes of known bugs.
N OT E
Autosamplers with serial number prefix below 3117 G ..... and 3121 A ..... need
a modification of the NMD board when updated to revision 4.0. A capacitor
(100 pF part number 0160-4801) has to be soldered between pin 5 and 7 of U26
on the NMD board.
Known Problems
❏ Incorrect BCD output for vials in 100 vial tray.
When working from the 100 vial tray the transfer position is always used
as output for the BCD output. Therefore the bottle number displayed on
the integrator is always 16 for BCD, or 10 for BIN, if the bottle number is
transfered via a BCD cable. PHOENIX and LC APPAC do not show the
problem.
❏ Using the injector program feature allows a work around for the problem.
{{ 10 DRAW def µl from SMPL SPEED def µl/min OFFSET def mm}}
{{ 20 UTILITY OUTPUT SMPL }}
❏ Intermittant hang-up of a sequence that uses overlap and return mode for
the 100 vial tray.
❏ Adjustment of the sampling unit home (hall) sensor via the service only is
not possible. INSTR# 4 gives incorrect values.
410
Firmware Revisions
Europe/ICON
3141 G .....
US/Canada
3141 A .....
Revision 4.1 incooperates:
• Fix of the three known bugs of revision 4.0
• The default transfer position is redifined (better position).
• The utility ’tray move’ command of the injector program allows to use the
sample vial option now.
• The wait after a post time represents a seperate event (for future
workstation only).
• Keep/Return configuration changes during the injection are possible now.
The following two bugs in the revison 4.1 firmware have been fixed with
revision 4.2.
• The LC ChemStation could not access all Injector Program features. The
bar code reader did not function in this mode.
• Autosampler with 100 vial tray in KEEP mode show a malfunction when a
injection >1 is interrupted (STOP during the injection cycle) and then
aborted. The inject LED remains on and a new START command will result
in a "Not Ready Wait 0.00" display and no injection will take place.
411
Firmware Revisions
If you update the firmware to revision 4.0 and greater
Firmware revision 4.0 requires a modification of the NMD board otherwise
incorrect positioning of the 21/34 vial tray may appear.
The new firmware revealed an already existing problem of the NMD board.
Noise on a signal line which is used more often then in previous firmware
versions might lead to incorrect data words for the 21/34 vial tray.
A 100 pF capacitor (part number 0160-4801) soldered between pin 5 and 7 of
U26 on the NMD board cures the problem. All autosampler with serial
number prefix 3117 G ... and 3121 A ... do have the capacitor already installed.
If you add a 100 vial tray to the autosampler
The update for the additional 100 vial tray comprises an option or upgrade kit
for the autosampler, which consists of bracket, electronic controler board
and firmware (if required) and the unmodified GC tray 18596.
Currently there are two 100 vial trays in the field, the 18596A and the
HP 18596B. Looking the same from the outside they differ and are not
compatible. Different electronic boards (MTD) are neccessary to control the
two trays. The basic difference is the controller firmware on the MTD board.
Table 102
Compatibility Table
18596A/L
18596B/M
Firmware
2.0 or higher
2.1 or higher
SN Prefix
2848 G / 2902A
2944 G / 2950 A
MTD Board
01078-66503 / -69503
01078-66513 / -69513
MTD firmware (U33)
412
18594-80295
Firmware Revisions
If you have Intermittant E17: Needle cannot move out of
vial
Variations in the size of the vial ground might be the source of the problem. If
the needle touches the ground during the injection cycle the error might
appear.
If the down movement of the needle is stopped by the vial ground it may
happen that the interrupter sensor gets activated. This indicates that the
needle is in the home position (seat). The up movement of the needle is
prohibited when the interrupter sensor is activated and results in the error
message.
Using the draw offset command for the needle will solve the problem.
All firmware revisions 3.1 and below may show this problem. Revision 4.0
and greater do not show the problem because of the changes done for the
injector program.
If you have to update the autosampler with a fan
In August 1990 a fan was added to the autosampler (see also “Product
History” on page 405). It cools down the electronic boards and prevents an
increase of the electronical failure rate when the card cage is equipped with
one or more additional option boards (for example MTD board, RRC board
or CIB board).
All autosampler equipped with the 100 vial tray (MTD RRC) or/and the HPIB
board (CIB) should be updated with the fan.
The fan upgrade kit 01078-68720 allows to retrofit autosampler without fan.
If the fan in the autosampler does not work properly
There is a possible problem with the fan in the 1050 Autosampler. It has been
realized that the fan does not start in all cases when the autosampler is
switched on. Measurements showed that the voltage at the fan can drop
below the needed +12V during the turn on cycle of the fan. Depending on the
quality of the fan (batch related) it will not start in any case.
All autosampler with serial number prefix 3313 G 02712 or 3315 A 02247 have
the voltage for the fan increased by changing R1 on the motherboard (ALM)
from 100 Ohm 2 Watt to 33.2 Ohm 0.5 Watt (0757-0995).
N OT E
The noise of the fan will be slightly increased by this modification.
413
Firmware Revisions
Update of existing Autosampler
Check wether the fan of the autosampler is running or not. Make also sure
that the fan will start at turn on of the module. If not, replace R1 on the
motherboard with the 33.2 Ohm resistor.
❏ Identify R1 which is located next to the connector J8 for the keyboard
cable.
❏ Cut the wires of the 100 Ohm resistor close to its body. This allows you to
solder the new 33.2 Ohm resistor (0757-0995) to the existing wires without
removing the ALM board from the card cage.
If the needle lifts the vial out of the tray
When the needle is raised out of the vial during an injection, cycle it may
happen that the vial is lifted out of its position (but finally drops back into the
tray). The reason might be a too weak spring in the bottle in place sensor
assembly. This happens only, if the septa is very tight. All autosamplers with
serial number prefix 3313 G... have a stronger spring 1460-2365 installed.
The new spring is much stronger then the old one and will keep the vial in
place also with tight septa.
If the injections are not reproducible (grooved needle)
It has been reported that a couple of customers had reproducibilty problems
when injecting larger volumes from vials that have been crimped very tight.
For such cases a grooved needle has been set up.
414
In This Book
only.
1050 Series of HPLC
Modules
Service Handbook Diode Array Detector
(G1306A) and Multiple
Wavelength Detector
(79854A)
Technologies 2001
allowed under the
copyright laws.
Part No. NONE
11/2001
Printed in Germany
Warranty
IMPORTANT NOTE
The information
contained in this
01050-90102 edition 4
(1995) and G1306-90102
this material,
including, but not
warranties or
merchantability and
purpose.
76337 Waldbronn
Germany
information (79854A
went out of support
during 2000).
Contact your local
case of part number
issues or upgrades.
web page
www.agilent.com.
18
18
DAD/MWD: General Information
the 1050 Diode Array and Multiple Wavelength
Detectors
• about this detector
• repair policy
• features
• user-interfaces
• specifications
About the Detector
General
The 1050 Diode Array Detector (G1306A DAD) and Multiple Wavelength
Detector (79854A MWD) module houses the optical system and the
electronic circuitry which acquire and process absorbance data. Control of
optics (radiation source shutter photo diode array etc.) is an integral part of
the electronics. The module is controlled through the user interface through
which the operator defines his requirements (detection parameters etc.) and
through which the system presents the required analytical information.
Repair Policy
The 1050 DAD/MWD is designed that you can access all components easily.
Customers are able to repair certain parts of the 1050 DAD/MWD described
in the User Handbooks.
For details on repair policy refer to “Repair Policy” on page 38 in chapter
1050 Common Information.
420
About the Detector
Identification
The module is identified by a 5 digit product number (G1306A or 79854A) and
a 10 unit serial number on a label attached to the wall inside the module. The
first four digits of the serial number are the serial prefix. The letter identifies
the country of origin. The last five digits are an identification number unique
to each module.
Any changes to the modules will be covered initially by Service Notes. They
will be sent out to all Service personnel prior to implementation of the
change to the instrument. With every reprint these changes will be
incorporated into the service documentation.
Compatibility
The replacement parts of the 1050 MWD are usable in the 1050 DAD and vice
versa. The 1050 MWD can be upgraded to a 1050 DAD.
421
DAD Differences
DAD Differences
The G1306A Diode Array Detector (DAD) is basically the 1050 Multiple
Wavelength Detector (MWD). The DAD has the same hardware as the 1050
MWD with two exceptions: keyboard and firmware are different.
• The 1050 DAD is NO replacement for the 1050 MWD.
• The 1050 DAD adds spectra capabilities to the existing 1050 MWD,
necessary for workstation controlled 3D detection systems.
• The 1050 DAD needs control by the HPLC DOS ChemStation (PHOENIX
3D-PLUS) to become operable.
• Upgrade from 1050 MWD to 1050 DAD will need new firmware and a new
user interface (keyboard).
Added features
The following features are new (compared to the 1050 MWD):
• up to five independent signals (sample and reference wavelength each)
• up to 5 spectra/second (time programmed, periodically or peak controlled)
• temporary storage of up to 90 spectra in internal run buffer
• up to 1 spectrum/second for monitor output
• lamp-on time information
Removed features from local keyboard
The following features are removed from local keyboard access (compared
to the 1050 MWD). The functionality is covered by the workstation:
• reduced run buffer size for signal data (shared between signal and spectra)
• no local spectra evaluation (e.g. spectra plot to analog output and
spectrum maximum calculations). This also affects the diagnostic
functions holmium test and intensity profile plots.
• No signal arithmetic for the analog outputs.
Signal A is analog output 1 and signal B is analog output 2.
422
DAD Differences
The signal multiplication factor has been removed from signal parameter
set points.
• no max monitor screen.
Restrictions of user interface
The user interface does have the following restrictions:
• no access to method parameter including the time table (e.g. signal
settings, external contacts).
• no method storage functionality (includes ’on error method’).
• no access to time-out or auto-on function.
• DATE&TIME will be monitored but cannot be set locally.
• no parameter lock on/off.
• no settings of the analog output functions and offsets.
Compatibility
The replacement parts of the 1050 MWD are usable in the 1050 DAD and vice
versa. The 1050 MWD can be upgraded to a 1050 DAD. An upgrade kit will
contain the necessary hardware and instructions (see section Parts
Identification).
The 1050 DAD cannot be operated properly in an integrator based system.
The LC APPACK software will not recognize the 1050 DAD as a module to
control.
423
DAD Differences
Local User Interface
The keyboard of the user interface has been changed. A different keypad foil
shows a limited number of available keys (see Figure 145 on page 424).
Figure 145
Local User Interface
424
DAD Differences
The following functions remain the same as for the 79854A MWD (same
keys):
• LAMP ON/OFF
Pressing NEXT LAMP ON FOR n hours and
RESET LAMPHOURS (enter)are displayed.
• BALANCE
• START and STOP
• Status line including signal A monitor, not ready conditions, logbook,
installed options and firmware revisions.
The following functions are hidden behind the STATUS key for maintenance
purpose):
• DATE&TIME
• REVISION
• CONFIGURATION
❏ remote configuration.
❏ set GPIB address.
❏ autobalance on/off.
❏ lamp current setting.
❏ set wavelength calibration factor.
❏ set analog output voltage.
• TEST FUNCTIONS
❏ measure intensity.
❏ Holmium spectrum.
❏ lamp intensity.
❏ gain (ASC).
❏ D/A converter.
❏ electronics noise.
❏ shutter position.
❏ wavelength calibration check.
425
DAD Differences
Workstation Interface
The 1050 DAD must be operated with the LC ChemStation.
Rawdata File
The run buffer within the detector is shared by signal and spectra data. In
case the run buffer is going to overflow, the signal data will have the higher
priority: the last stored spectrum is removed from the run buffer. This will
guarantee useful signal data but may cause loss of interesting spectral data.
The run buffer can hold up to 30000 signal data points or about 90 spectra.
Peak Detector
The peak detector (PD) always uses signal A as the ’pilot’ signal. The PD is
adjusted by means of the two set points peak width and threshold. Both
setpoint are time programmable. Whereas the PD-threshold is a method
parameter of its own, the PD-peak width parameter is derived from the
general peak width (PKWD) parameter. At start of the run the value for the
PD-peak width is set equal to the PKWD setpoint. During the run the PD-peak
width parameter can be changed by time programming.
Spectra Acquisition Modes
The spectra acquisition mode allows automatic storage of spectra during a
run. The mode can be changed during the run by time programming.
Compared to the 1040 DAD the 1050 DAD will have two new features
• storing spectra at the baseline before the begin of a peak
• periodically store spectra during a peak and at a reduced data rate.
The modes in detail are:
426
DAD Differences
Table 103
Spectra Acquisition Modes
Mode
Details
none
no spectra is stored
apex
top of peak spectra is stored
apex + baselines
last baseline spectrum before peak, top of peak
spectrum and first baseline spectrum after peak is
stored.
apex + slopes
spectrum in peak upslope, at top of peak and in peak
downslope is stored.
apex + slopes + baselines
combined apex + slopes and apex + baselines.
all in peak
compared to storing all spectra periodically, only
stores spectra within a peak at doubled period. Starts
with last baseline spectrum before peak and ends
with first baseline spectrum after peak. If baseline
spectra are not detected, the spectrum before the first
spectrum in peak or the spectrum after the last
spectrum within the peak is stored instead.
all
periodically all spectra are stored. The period depends
on the peak width setting. For peak width setting=0
(narrowest peak), the spectrum data rate would be
20 Hz
427
DAD Differences
Test Functions
The 1050 DAD has a reduced user interface and no analog output (DAC board
is optional). It has no means to display (plot) the spectra (or intensity scans)
of some of the built-in tests. These plots can be retrieved with the
Workstation.
Options
Because the 1050 DAD is only operable together with the workstation, the
Communication Interface Board (CRB) is mandatory.
Because the 1050 DAD typically needs no analog output signals, the Digital to
Analog Conversion Board (DAC) is optional.
Owner’s manual.
428
Specifications DAD/MWD
Table 104
Specification of the 1050 DAD/MWD (Series II Optical)
Detection Type
Double beam photometer
Signals
Up to 3 (MWD) or 5 (DAD), each defined by a sample
wavelength and bandwidth and an optional reference
wavelength and bandwidth.
Signal Combinations
Sum of two signals; difference of two signals; ratio of
two signals, with definable range and threshold;
window plot with definable ratio, range and
threshold.
Noise
< ±2.0 x 10-5 AU peak-to-peak, at 254 nm with 4 nm
bandwidth, flowing water at 1 ml/min, 1 second
response time (10-90%).
Drift
< 2 x 10-3 AU/hour, at 254 nm, after warm-up.
Wavelength Range
190-600 nm, selectable in 1 nm increments.
Bandwidth Range
2-400 nm, selectable in 1 nm increments.
Wavelength Accuracy
±1 nm.
Linear Absorbance Range
Better than 1% up to 1.5 AU, using acetone at
265 nm.
Response Time
8 choices, ranging from 0.1 to 20 seconds (10-90%).
Spectra
Storage of at least 8 spectra, with definable
wavelength range from 190-600 nm (total number of
spectra depends on range defined). Post-run plotting
of original or subtracted spectra possible.
Spectra Resolution
depends on slit width.
Absorbance Resolution
< 5 x 10-6 AU
Spectra Acquisition
12.5 ms from 190 to 600 nm; according to the
response time settings scans are accumulated for one
data point for improved sensitivity.
429
Table 104
Light Source
Deuterium lamp.
Flow Cell (Series II)
SST cell, 8 µl volume with 6 mm path length or 13 µl
volume with 10 mm path length and 120 bar (1760 psi)
maximum pressure. Optional high-pressure cells
(400 bar).
Display
2 line by 16 character fluorescent display with
real-time display of operating parameters or
absorbance and wavelength of maximum absorbance.
Control
editing during run possible; keyboard lock. External
control via GPIB with ChemStation or RS-232.
Integrated keyboard with function keys; limited
functionality and control on DAD.
Parameters
Signal definitions (wavelengths/bandwidths),
attenuation, response time, zero offset, balance;
spectra definitions; external contacts; analog outputs.
Time-programmable
Parameters
Wavelengths/bandwidths, attenuation, spectra
acquisition, external contacts.
Methods
Battery-backed storage of up to ten methods (depends
on length of method), including initial and
time-programmed parameters. Automatic startup and
shutdown methods. Editing of stored methods
possible during run.
Analog Outputs
Two analog outputs are available (on DAD optional)
for output of signals and/or signal combinations; both
1 V/2 AU or 100 mV/2 AU, user-selectable.
Communications
START (in- and output), STOP (in- and output), READY
(output), SHUTDOWN (output) for synchronization
with other LC modules; two external contacts
including: 1 relay with 24 V and 250 mA; 1 contact
closure with maximum 30 V and 250 mA.
430
Table 104
Safety Aids
front-panel LED’s and status logbook. User-definable
detection, safe leak handling, leak output signal to
shutdown the pump.
Environment
Temperature range: 5 to 55 °C
Humidity: < 85% (non-condensing)
Power Requirements
Dimensions
Height: 208 mm (8.2 inch)
Width: 325 mm (12.8 inch)
Depth: 560 mm (22.0 inch)
Weight: 16 kg (35 lb.)
Owner’s manual.
431
432
19
19
DAD/MWD: Hardware
Information
about the 050 Diode Array and Multiple
Wavelength Detectors
DAD/MWD: Hardware Information
components of the 1050 Diode Array and Multiple Wavelength Detectors.
• overview about the optical system
• overview about the electronics
• detector hardware
❏ optical units
❏ flow cells
❏ heat exchanger
❏ lamp
❏ shutter assembly
❏ leak sensor
❏ fans
N OT E
This chapter describes the Series II optical unit hardware only.
434
Overview: Optical System
Overview: Optical System
The light from the deuterium lamp is passing an achromat lens system and is
focussed first on the exit of the flow cell. Then it passes a lens and is
focussed again on the slit assembly. Due to this separation of flow cell and
slit and the availability of flow cells with different path lengths (6 and 10 mm)
and slit assemblies with different optical slit width (2, 4, 8 nm), it is now
possible to optimize the signal-to-noise and the spectral resolution. The
optical unit is optimized for the flow cell with 6 mm path length together with
the 4 nm slit assembly.
Figure 146
Optical System
1 - deuterium lamp
2 - windows
3 - shutter
4 - achromat
5 - flow cell
6 - slit assembly
7 - lens
8 - grating
9 - array
435
Overview: Electronics
Figure 147 shows a block diagram of the 1050 DAD/MWD.
The Common Main Processor (CMP) controls all functions of the module.
The CMP communicates with the AQB, controls directly the shutter of the
optical unit and the power supply. If a leak is detected inside the optical unit,
this leak message is connected to the CMP. The CMP also provides the I/O
Remote connections.
To the CMP the common main processor BUS is connected which allows the
communication with the user interface (keyboard), Digital to Analog
Converter (DAC) and GPIB/RS232 interface.
The Digital to Analog Converter interface is optional.
Because of the structure of the 1050 Series the module specific controller
firmware is piggy-back loaded to the Data Acquisition Board (AQB). The
AQB controls the Analog to Digital Conversion Board (ASC) and the Photo
Diode Array (PDA).
436
Figure 147
Block Diagram 1050 DAD/MWD
437
Optical Unit
Optical Unit
The main areas of the optical unit are:
Optical housing
same for use in 1050 MWD and 1040/90 DAD
(different flow cell, cover and slit).
flow cell
available as stainless steel (SST) with different path
lengths (6/10 mm, 8/13 µl) for high pressure use (120
bar). Additional high-pressure cells (400 bar) are also
available.
Slit assembly
available with optical slit width of 2, 4 and 8 nm slit.
LPC board
interface between leak sensor/shutter assembly and
main electronics.
Due to this separation of flow cell and slit and the availability of flow cells
with different path lengths and slit assemblies with different optical slit
width, it is now possible to optimize the signal-to-noise and the spectral
resolution. The optical unit is optimized for the flow cell with 6 mm path
length together with the 4 nm slit assembly.
Figure 148
Optical Unit
438
Optical Unit
Flow Cell Assemblies
The new flow cell design allows the work up to higher pressure and the
possibility of maintaining and replacing parts. The flow cells can be
disassembled, cleaned or repaired.
Figure 149
Flow Cell
Table 105
Flow Cell Data
STD
HP-STD
HP-Micro
Volume
8 or 13
13
1.7
Path length
6 or 10
10
6
mm
Maximum pressure in the cell
120
400
400
bar
Inlet capillary id
0.17
0.17
0.12
mm
Outlet capillary id
0.17
0.17
0.12
mm
recommended pH range
C A UT I O N
µl
>2.3 to 9.5
STD
Standard Flow Cell
HP-STD
High Pressure Cell with 13 µl volume
HP-Micro
High Pressure Cell with 1.7 µl volume
Because the very small inner diameter (0.17 or 0.12 mm) of the inlet capillary
only very clean solvents should be used.
439
Optical Unit
Additional Information of High Pressure Cells
Typical applications of the high-pressure flow cells are:
• Hyphenated systems (LC-MS)
• Super Critical Fluid Chromatography (SFC)
• Multi-detector systems
• Narrow-bore column applications
The main difference between the standard and high-pressure flow cells is the
design of the window assemblies. The high-pressure flow cells have a
different window screw, window and seal ring, washer, and a different
number and orientation of conical disk (bevelled) springs, see Figure 150.
The seal rings support and hold the window and at the same time form the
high-pressure seal.
Figure 150
Cross-section of Window Assembly
Washer
Windows
Washer
Conical Disk Springs (see
below)
Window Screw
Detail of Conical Disk
Springs Showing
Orientation
The following materials are in contact with solvents:
• Stainless steel (AISI 316)
• Quartz
• Vespel® (polyamide) Vespel is a registered trademark of DuPont.
440
Optical Unit
Under standard conditions (1 ml/min water flow, 254 nm detection
wavelength, 4 nm bandwidth, 1 s response time) the noise of the
high-pressure micro flow cell might increase.
The high-pressure micro flow cell is supplied with an additional 0.12 mm i.d.
capillary, allowing you to bypass the heat exchanger.
Slit Assembly
The separation of the slit from the flow cell allows to change the slits
according the needs to optimize signal-to-noise and spectral resolution.
Available slit sizes are 2, 4 and 8 nm.
Figure 151
Slit Assembly
441
Optical Unit
Deuterium Lamp Assembly
The deuterium lamp used in the 1050 DAD is the known lamp from the 1040
Diode Array Detector, the 1050 DAD/MWD and the 1050 Variable Wavelength
Detector (79853C).
The reduction of energy emission of the lamp (Figure 153 on page 443) is
time and wavelength dependent and is significantly higher within the first
days and for wavelengths in the ultra violet range compared to the visible
range (change in transmission of lamp glass).
Usually, the response maximum of the lamp is near 230 nm, but can be
shifted to a higher wavelength for an aged lamp. It has no relevance for
intensity degradation at other wavelengths.
Figure 152
Deuterium Lamp Assembly
Two versions were used:
• 79880-60002 was the original lamp
• 79883-60002 with 20% higher initial energy
442
Optical Unit
Figure 153
Intensity Degradation of Lamp (79883-60002)
• Measured wavelength is 230 nm
• initial intensity about 20% higher than 79880-60002
• should be used with 2 nm slit initially top prevent overload of photo diodes
(if intensity is to high).
• decrease in intensity is less with use
N OT E
The lamp should be replaced only if the following two criteria are both
fulfilled:
Baseline Noise (with test cell) has increased significantly.
Amount of counts of the lamp (with test cell) has decreased to less than 50%
of the count record of this same lamp when newly installed).
The decision to replace the lamp due to criteria 2 alone is not relevant,
because the signal/noise may be still within instrument specifications.
443
Optical Unit
Heat Exchanger Assembly
The MWD may exhibit severe noise under certain solvent and LC conditions.
This is most noticeable when Acetonitrile is the mobile phase. Therefore a
heat exchanger assembly is installed underneath the optical unit. The outlet
capillary of the heat exchanger is mounted at the flow cell and is led then into
the inlet of the flow cell connected by a union.
The heat exchanger contains 60 cm capillary of 0.17 mm i.d. Pressure drop
with water at 1 ml/min approximately 25 bar.
Figure 154
Heat Exchanger and Flow Cell
444
Optical Unit
Shutter Assembly
The Shutter Assembly is located in the cell compartment of the optical unit.
The stepper motor is responsible for moving the shutter into one of three
possible positions:
3 Shutter not in light path (normal operation)
4 Shutter in filter mode (a holmium filter is moved into the light), refer to
TEST FUNCTIONS, see “Shutter Position” on page 506.
5 Shutter in dark position (no light is coming through the cell; this is
necessary for dark current measurements carried out for calibration
purposes).
Figure 155
Shutter Assembly
445
Optical Unit
A leak sensor is located just under the cell. Should the cell leak, solvent
would cool the leak sensor (self-heating thermistor). The resulting change in
resistance, measured by comparators on the CMP board would generate an
error message on the CMP board and switch the instrument to STANDBY. A
drain is located at the bottom of the cell compartment and is led to the
module waste system.
Damage to the array compartment is prevented by a window which separates
the cell from the array compartment.
N OT E
In a 1050 System (using remote connections) the leak message will switch off
the pump.
To switch off non-1050 Modules refer to operating manual.
Figure 156
446
Fans
Fans
Two DC-fans are located between the optical unit and the motherboard,
inserted in a set of foam. The left one provides air for the lamp housing and
power supply and the right one provides air for the electronics in the rear.
For replacement refer to section Procedures.
In May 1994, a protection cover for the left fan (close to the lamp connector)
was introduced for safety reasons (not shown in Figure 157).
Figure 157
Fans
Fan cover not shown
447
Fans
448
20
20
DAD/MWD: Electronic
Information
DAD/MWD: Electronic Information
This chapter gives information about the electronic of the 1050 Diode Array
and Multiple Wavelength Detectors:
• Overview
• Array Signal Conversion Board (ASC)
• Data Acquisition Board (AQB)
• Firmware Board (FIM)
• Common Main Processor Board (CMP)
• Communication Interface Board (CRB)
• Fluorescent Indicator Module (FIP)
• Motherboard (LUM)
• LPC Board
• Power Supply (DPS-A)
• Digital to Analog Conversion Board (DAC)
N OT E
For additional details of the assemblies you may refer to the 1050 Service
Handbook, Chapter Common Information.
450
Overview
Overview
All electronic boards (except the FIP, behind the keyboard and the LPC, in
the optical unit) are located in the rear part of the module and they are
connected to the Motherboard (LUM). The rear of the detector is shown in
Figure 158 on page 452.
In the 1050 DAD the following electronic assemblies are available:
Table 106
Electronic Boards
Description
Part Number
Exchange
5061-3375
01050-69375
5061-3380
01050-69380
Array Signal Conversion (ASC)
01048-66501
Digital/Analog Conversion (DAC) (optional)
01048-66502
Data Acquisition (AQB)
01048-66543
Firmware Board (FIM) for DAD
G1306-66524
Firmware Board (FIM) for MWD
01048-66504
Leak/Shutter Interface (LPC)
79883-66509
Motherboard (LUM)
01048-66510
5061-3376
5062-2482
451
Overview
Figure 158
Rear of 1050 DAD/MWD
N OT E
The DAC board is optional in the 1050 DAD.
452
Overview
The system consists of the Photo Diode Array (PDA) with 211 elements, the
Array Front End Board (AFE), the Analog Signal Conversion Board (ASC)
and the Acquisition Processor Board (AQB).
The PDA detects a spectrum of incident light in the wavelength from
190...600 nm with 2 nm increments.
The AFE Board consists of a Readout Amplifier, which transfers the
accumulated charge from the diodes and generates the PDA signal.
The ASC Board consists of a variable gain amplifier, a 16-bit A/D converter, a
microprocessor interface and a control logic to control the PDA, the
amplifier and the microprocessor interface.
Figure 159
Block Diagram of Electronics
453
Array Signal Conversion Board (ASC)
Repair Level: Board
Table 107
Item
Part Number
ASC board
01048-66501
The two main functions of the ASC board are:
• providing of control signals for the readout routine of the photo diode
array;
• analog to digital conversion of the array signal.
Photo Diode Array Readout Routine
The readout cycle (12.5 ms) is divided into 225 time slots each 55.55 µs.
Time Slot
Function
0
not used
1
dummy diode, not used
2
Bit 1 of shift register, not used
3...211
information of intensity
212
Bit 213 of shift register, not used
213
dummy diode, not used
214
not used
215
Offset value, Gain = 1
216
217
218...224
not used
454
Figure 160
Block Diagram ASC Board
455
The analog ARRAY SIGNAL coming from the AFE board is in the range of
-5 V to - 10 V depending on the intensity of the light falling on to the photo
diodes.
Analog/Digital Conversion
The principle of conversion is based on the Triple-Slope technique see Figure
161.
During the TRACK phase the integration capacitor is loaded by a constant
voltage Uc. This voltage is proportional to the ARRAY SIGNAL voltage. The
voltage Uc is in the range of 0...10 V and is present for 12.37 µs.
Figure 161
Triple Slope Integration
During the HOLD phase (the ARRAY Signal voltage is disconnected). Uc is
discharged by two constant bipolar currents I1 and I2 and the discharge time
is measured. U c is discharged with I1 until the zero passage is reached. The
time used for this down slope is counted with the clock (18.432 MHz) and will
represent the upper 9 bits of the 16 bit data word.
After the zero passage I1 is switched off with the next active clock and the
negative residual charge is discharged with I 2 until the zero passage is
reached the second time. The time between both zero passages represent the
lower 7 bits of the 16 bit data word.
In reality only I 1 is switched and I2 is on permanent to avoid failures due to
multiple switching.
456
The cycle for the conversion takes 55.55 µs (18 kHz) and is divided into 1024
steps of 54.2 ns (18.432 MHz) which is the internal clock on the board.
During steps 0...227 the amplified input voltage (ARRAY SIGNAL) is switched
through and the integration capacitor is charged. The gain level can be 1, 2 or
4 depending on the instrument characteristic of the light source. These
amplification factors are measured for each diode at the begin of a
chromatographic run when a BALANCE is made. The values are put as a
table into memory on the AQB Board.
Starting with step 228 the input voltage is disconnected from the capacitor
and a RESET pulse resets all flip-flops and counters. Current I1 is switched
on. The conversion starts.
Up to this point the described timing sequence is independent of the input
voltage. The following processes are controlled by the zero passages.
The 9-bit counter counts the clock pulses until the comparator sees a zero
passage of the integrator voltage. Then I1 and the 9-bit counter are switched
off. I 2 and a 8-bit counter are now active discharging the negative integrator
voltage until the next zero passage. The 8-bit counter stops.
During steps 1012...1016 the 16 bit data word is build. The 16 bit word is
moved into the output registers from where the AQB Board takes the
information. Because of the ‘long’ availability of the data word (55.55 µs) the
AQB processor has enough time to get the data.
Input Amplifier and Integrator
The ARRAY SIGNAL coming from the AFE Board is in the range of +0.1 V
(dark) and -5.1 V (bright). A input amplifier transfers this voltage into the
range of -0.7 V to -11.1 V which is the input of an amplification switch. This
switch changes the amplification factor of the integrator stage (gain factor 1,
2 or 4). The adjustment of the separate photo diodes is done by the AQB
Board.
Ramp Amplifier and Comparator
The ramp amplifier is used to increase the slope speed of the integrator
voltage.
The comparator looks for the zero passage and provides the signals COMP
and COMP- for the time and control logic.
457
DC-Voltages
The internal reference voltages +10 V and -10 V are derived from the +15 V.
Input voltages:
+19 V, -19 V, AGND
+5 V, DGND
Output Voltages:
+15 V, -15 V, AGND
+5 V, DGND
Digital Sections
This section provides all timing and control signals used on the ASC Board.
The timing is done with a Programmable Array Logic (PAL) that gets 8
synchronous input signals in the range of 2.304 MHz and 18 KHz all derived
out of the 18.432 MHz main clock.
A SYNC signal is used for synchronization of the switching power supply.
The comparator signals COMP and COMP- (generated in the analog part)
control the 9-bit and 8-bit counter.
The 16-bit data word is transferred to the Data Acquisition Board (AQB) via
the 16-bit Data Register.
Status information is transferred to the Data Acquisition Board (AQB) via the
Status Register.
458
Data Acquisition Board (AQB)
Repair Level: Board and Fuse F11, F12 and Firmware
Table 108
Part Numbers for AQB Board
Item
Part Number
also used for
AQB Board
01048-66543/-69543 G1600A CE
Firmware Board DAD/CE
G1306-66524
Firmware Board MWD
01048-66504
Fuse F11, F12 (250 mA)
2110-0004
G1600A CE
The Data Acquisition Board (AQB) is the ’personality module’. It contains the
firmware for the main processor system.
Firmware including address decoder will be located piggy back on the FIM
board. But the main purpose of this board is to hold special hardware only
necessary for the DAD/MWD. This is frontend control hardware and a data
reduction processor system including dual port RAM for data transfer to
main processor.
Main Functions
• max. four EPROM main firmware on FIM board
• FIM board piggy back on AQB board
• lamp control hardware
• stepper motor driver hardware for shutter
• 2 external contacts
❏ 2 connectors on rear panel
❏ 1 contact without supply (only contact closure) max. 30 V (fused with
250 mA)
❏ 1 contact with internal 24 V supply (fused with 250 mA)
459
Figure 162
Block diagram of AQB Board
460
Frontend Processor Area
• 6809 running at 2 MHz
• A/D converter interface
• frontend firmware 512 byte
• 8 Kilobyte dual port RAM including interrupt register
Main Processor Area
• max. four EPROM main firmware on FIM board
• FIM board piggy back on AQB board
• lamp control hardware
❏ lamp on/off (anode voltage)
❏ heater on/off
❏ lamp start (600 V ignition)
❏ 2 lines for lamp current select status
• stepper motor driver hardware for light shutter
❏ motor on/off
❏ 4 bit step pattern lines
• bus buffer for backplane bus connection
Input / Output
❏ 2 connectors on rear panel
❏ 1 contact without supply (only contact closure) max. 30 V/250 mA
❏ 1 contact with internal 24 V supply (max. 250 mA output with fuse)
• via motherboard
❏ stepper motor lines to optical unit
❏ lamp control to power supply
❏ connection to ASC board
❏ backplane bus
461
Figure 163
Layout of AQB Board
462
Repair Level: Board
Table 109
Item
Part Number
also used for
Firmware Board DAD/CE
G1306-66524/-69524 G1600A CE
Firmware Board MWD
01048-66504
The FIM board is a piggy back board, placed on AQB board (’personality
module’).
• The programmed FIM contains the firmware of the 1050 DAD module.
• The FIM contains up to four 128K x 8bit EPROM (U4 to U7).
Figure 164
Layout of FIM Board
463
Repair Level: Board
Table 110
Part Numbers for CMP Board
Item
Part Number
also used for
CMP Board
5061-3380/01050-69580
G1600A CE
Common 1050 functions for the main processor are:
• display handling
• keyboard polling
• remote control input and output
• leak sensing
• option interfacing
• time programming
• method storage
• module configuration
• memory switching
• 32 kilobyte RAM with battery back-up for parameter storage.
Firmware is not part of this board, because parts of the main processor’s
software are module specific. The main processor firmware will be located
on the ’personality module’ (AQB Board) or on an optional board.
464
Figure 165
Block diagram CMP
465
Remote Control
The CMP board provides two remote connectors.
Remote Signals
Table 111
Pin
Signal
Active
Color
1
Digital ground
2
Prepare run
LOW
brown
3
Start
LOW
gray
4
Shut down
LOW
blue
5
Reserved
6
Power ON
HIGH
yellow
7
Ready
HIGH
red
8
Stop
LOW
green
9
Start request
LOW
black
white
pink
Remote Configuration
The 1050 Series provides three remote configurations:
HPsystem
Start of automatic operation from any modules’ start key.
Start request is outputted.
GLOBAL
Synchronized start of several modules for a single run.
Start / Stop is outputted.
LOCAL
Single modules’ start. No pulses outputted.
The signal level are defined as standard TTL levels
(0 V is logic true, + 5 V is logic false).
The remote lines can be input or output (wired or technique).
• Fan-out is 10
• Input Load 2 kOhm against + 5 V
466
Repair Level: Board
Table 112
Part Numbers for CRB Board
Item
Part Number
also used for
CRB Board
5062-2482
G1600A CE
The communication interface board is necessary for the control by a
Personal Computer and to connect printer or plotter devices. The
communication interface board provides one GPIB and one RS232 interface.
The CRB for the 1050 DAD has a 96 kilobyte run buffer for the data/spectrum
operation with the Multiple Wavelength Detector. The interface is located in
Slot #2 of the module.
The board contains a baud rate generator. The baud rate is selectable up to
19200 baud from the keyboard. The transmitter and receiver baud rate are
independent adjustable.
The implemented serial interface is a subset of the RS232 standard only. It
contains at
PIN 2
RxD receive data (data input)
PIN 3
TxD transmit data (data output)
PIN 4
GND (Ground)
The 1050 modules are designed as DCE (data communication equipment)
without hardware handshake.
467
Repair Level: Board
Table 113
Part Numbers for DAC Board
Item
Part Number
also used for
DAC Board
01048-66502
G1600A CE
The main functions of the DAC board are:
• conversion of digital data into analog signals compatible with external
integrators;
• provide two independent analog outputs.
The DAC board comprises two independent pulse-width modulated 16 bit
D/A converters with noise <1/4 LSB (peak to peak). The repetition rate for
the data per channel is 90 Hz. The two analog outputs can be used for
integrators and recorders. The rise time and the offset voltage is selectable
per software.
Output voltage:
-4 ... 996 mV (1 V) or
-0.4 mV ... 99.6 mV (100 mV)
Scale factor:
0.5 V/AU or 0.05 V/AU
(for multiplication factor =1)
Rise Time (10/90%):
0.1/0.3/1/3 s
Noise (0.1 s rise time):
< 4 µV (< 0.008 mAU)
468
Figure 166
Block diagram of DAC Board
469
Address Decoder and Data Storage
The digital signal prepared for conversion is sent from AQB through LUM
data bus in 8 bit portions. The appropriate address is available on LUM
address bus. This address is decoded by the address decoder and the data
storage circuit is activated and the digital word is stored. The two channels
are separated only through the appropriate address recognized by the
address decoder.
Timers
Three 16 bit timers are available on the DAC. One is fixed as a divider
(6.555 MHz/90 Hz) and provides the 90 Hz clock for the control logic. The
other two timers work as Pulse width Modulator for channel 1 and 2. They
are loaded with the digital word stored in the data storage and activated with
a 90 Hz clock. Starting with the loaded word each counter will count
downwards with the 6.555 MHz cycle.
Pulse Width Modulator
The pulses generated in the counter section are fed to diode switches that are
responsible to switch the constant current source on or off to the low pass
filter section.
Low Pass Filter
All low pass filters should suppress the 90 Hz cycle. The cutoff frequency is
<4 Hz and suppresses the 90 Hz with >100 dB. The second low pass filter is a
variable low pass filter dependent on the rise time (0.1/0.3/1/3 s). The third
low pass filter has a variable gain which allows a scale factor for the analog
output voltage at 50 mV/AU or 0.5 V/AU.
Rise time
The rise time is software selectable to 0.1 s, 0.3 s, 1 s, or 3 s. This rise time is
varied in combination with the peak width setting. The default setting is 1 s.
Refer to Operating Manual for more details.
Power Supply
The ±19 V from the Power Supply is used to generate ±15 V and + 10 V as a
reference voltage for the constant current source.
470
Board Diagnostics
There are two possibilities to troubleshoot the DAC board:
• output voltage check, see User Manual
• D/A converter test, see “D/A Converter Test” on page 500
Both of these tests can be done on both output channels.
Figure 167
Layout of DAC Board
471
Repair Level: Board or Fuse ICP1
Table 114
Part Numbers for FIP Board
Item
Part Number
FIP Board
5061-3376
Fuse 1 A
2110-0099
The FIP module is located behind the keyboard module of pump, autos
ampler and multiple wavelength detector.
The function of the FIP module is to provide an interface between a host
system and the user. Messages can be displayed with up to 32 characters
(2 lines x 16 characters/line). A matrix keyboard is scanned for numeric or
special function input and status information is displayed through 4 LEDs.
The characters are displayed in a 5 x 7 dot matrix.
In case of a dark display, check the on board fuse ICP1 which is soldered in
close to the connector P1/P2.
Figure 168
Board Layout FIP
472
Motherboard (LUM)
Motherboard (LUM)
Repair Level: Board
Table 115
Part Numbers for LUM Board
Item
Part Number
LUM Board
01048-66510
The Motherboard contains all connectors for the boards and the assemblies
in the front part, like fans, optical unit and keyboard.
Figure 169 shows the location of all connectors.
Figure 169
Layout of Motherboard
J1 - DPS
J6 - Not used
J10 - Shutter/Leak
J2 - ASC
J7 - CMP
J11 - Lamp
J3 - AQB
J8 - FIP
J12 - not used
J4 - DAC
J9 - PDA
J13 - Fan (left)
J5 - not used
J14 - Fan (right)
473
Motherboard (LUM)
Figure 170
Connection Table LUM (I)
474
Motherboard (LUM)
Figure 171
Connection Table LUM (II)
475
Motherboard (LUM)
Figure 172
Connection Table LUM (III)
476
LPC Board
LPC Board
Repair Level: Board
Table 116
Item
Part Number
also used for
LPC Board
79883-66509
G1600A CE
The board routes the signals from the leak sensor and signals to the shutter
assembly. Via J3 it is connected to J10 of the LUM board (Motherboard).
Figure 173
LPC Board Assembly
477
Repair Level: Fuses and DPS-A
Table 117
Item
Part Number
also used for
DPS-A
5061-3375/01050-69375
G1600A CE
2110-0003
2110-0002
For detailed information refer to the 1050 Service Handbook, Chapter
Common Information.
General Description
The power supply is a primary switching regulated type. It consists of two
parts. the Base Supply and the Lamp Supply. The Base Supply provides
outputs of +5 V, ±19 V, +24 V and +36 V. In addition the Lamp Supply
provides all circuits necessary for the operation of a deuterium lamp.
Lamp Ignition
always. After ignition the heater voltage is switched off (DAD/MWD).
Figure 174
Deuterium Lamp Ignition
478
Figure 175
Block Diagram DPS-A (Base Supply)
479
Figure 176
Block Diagram DPS-A (Lamp Supply I)
480
Figure 177
Block Diagram DPS-A (Lamp Supply II)
481
482
21
21
DAD/MWD: Diagnostic &
Troubleshooting Information
Diode Array and Multiple Wavelength Detectors
DAD/MWD: Diagnostic &
The 1050 DAD/MWD provides
• STATUS information during the normal operation (e.g. conditions errors);
• ERROR MESSAGES that identify the problem;
• DIAGNOSTIC features on special request to allow troubleshooting of the
module.
484
DAD/MWD: Diagnostic & Troubleshooting Information
STATUS Information
STATUS Information
Status Modes
• Status Modes
• Status LEDs
• Warnings
SYSTEM INIT
initializing .....
After turning on the module runs through an initialization.
STANDBY
1050 STANDBY 01:A 0.00mAU
All LEDs and the deuterium lamp are off. Edit of all parameters is possible (if
PARAMETER LOCK is off).
LAMP IGNITION
LAMP ON <lamp is off> ENTER
LAMP IGNITION 01:A 0.00mAU
During the ignition process the NOT READY LED is on.
PRERUN
PRERUN 01:A 0.00mAU
The same as in STANDBY mode except that the deuterium lamp is on now.
Transition to RUN only possibly by pressing START (LOCAL) or via
REMOTE.
RUN
timeprogram starting
is displayed for 2 seconds. Then actual display shows
RUN 01:A 0.00mAU.
The RUN LED is on and the timetable commands are executed. The
deuterium lamp cannot be switched to off.
timeprogram stopped
POSTRUN
POSTRUN 01:A 0.00mAU
The RUN LED is blinking. If post time has elapsed or STOP occurs the
instrument switches to BALANCE mode (calibration) if auto calibration
parameter is ON else to PRERUN mode.
485
STATUS Information
BALANCE
balancing
A calibration in performed and the NOT READY LED is on.
SYSTEM TEST
This mode is normally skipped and has to be called up through the TEST
functions or during power on by pressing
STATUS and LINE~ switch. Then ROM- RAM- and DISPLAY Test is
performed. For details see “ROM/RAM/DISPLAY Tests” on page 507.
Status LEDs
ERROR LED ON
This state indicates an error condition and requires an interaction of the user.
A message will be written into the system logbook. The display will be
overwritten with a messages:
NOT READY LED ON
This state indicates a NOT READY condition (action not yet finished
see also mode description). A logbook entry is made. The following reasons
may be reported on display for 2 seconds:
• lamp ignition in progress
• amp test in progress
• balancing
LAMP LED ON
Deuterium lamp on.
RUN LED ON
Instrument in RUN mode. If instrument is in POSTRUN mode the RUN LED
is blinking.
Warnings
A warning is written into the logbook if a problem occurs which doesn’t
cause the user to stop analysis. A message is written to the display for
2 seconds. Possible warnings can be:
• lamp below intensity test limit;
• excessive leakage current of one of the photo diodes (non-linear);
• intensity too high (wrong calibration at gradient run);
• temporary memory overflow.
486
Error Messages
Error Messages
This section describes the troubleshooting of the 1050 DAD/MWD according
to the error messages. The error messages will help to locate and repair a
failure. In case an error message appears the Error LED will be turned on and
the message will be written into the system logbook.
Selftest
ROM
performed when STATUS will be pressed while the module is turned on at
the LINE~ switch. In case of a failure one of the following messages appears.
The complete test requires approximately two minutes.
ROM test failed
( ROM test failed )
The ROMs on the FIM board are tested. In case of a checksum error the ROM
test fails. Replacement of the FIM board will probably fix the problem.
RAM test failed
( RAM test failed )
487
E00: Power Fail
E00 HH:MM DDMMM power fail >
clock stopped set time&date
This message indicates that the instrument has either been disconnected
from line source or a line power voltage drop occurred.
E01: Leak Detected In E01 HH:MM DDMMM leak detected >
Detector
leak detected > in detector
The leak detection circuit is located on the CMP board and checks
continuously for presence and leak conditions. If the sensor is missing
(defect) or in leak condition the PTC is cooled down the error message
appears. When the module is turned on the leak message is disabled for some
time to allow the sensor to reach its working range. The deuterium lamp is
switched OFF.
Normal:
about 75°C
400...500 Ohm
Error:
below 55°C
about 150 Ohm
Actions:
488
E02: Error In Other
Module
serious error in other module
An external device pulled the shut down line down (pins 1 and 4 of REMOTE
connector), for example when a leak is detected.
E03: Error Method
loaded
An error has come up in the DAD and this caused to load an error method (if
specified) and turned off the lamp.
E04: Time Out
E04 HH:MM DDMMM time out >
lamp turned off automatically
If the time after finishing the last run or a not ready condition exceed the
value of set time-out time the deuterium lamp is turned off automatically. A
time out occurs (pin 1 and 7 of REMOTE connector).
E05: Turn On Lamp
Automatically
E05 HH:MM DDMMM lamp has been >
turned on automatically
If the lamp was programmed to be turned on automatically this message is
displayed.
489
1050 DAD/WMD Error Messages
The following error messages are 1050 DAD/MWD specific.
E11/12: WL
Calibration out of
range
E11 HH:MM DDMMM WLcalibration >
WLcal factor more than +12
E12 HH:MM DDMMM WLcalibration >
WLcal factor more than -12
This message occurs when the wavelength calibration test failed.
Actions:
❏ Check whether the cell is inserted properly.
❏ Check for air bubbles in cell.
❏ Perform WL-Calibration Test.
E13: Spectra buffer
full
E13 HH:MM DDMMM spectramem.full>
not all ttbl spectra stored
Too many spectra were taken during time program.
Actions:
❏ Reduce number of spectra or time programmed spectra.
E14: No lamp current
E14 HH:MM DDMMM lamp failed >
no lamp current lamp is off
Actions:
❏ Check lamp.
❏ Change lamp current.
❏ Check connections.
❏ Replace power supply.
❏ Replace AQB board.
490
E15: Lamp ignition
failed
E15 HH:MM DDMMM ignition failed>
lamp failed during ignition
Actions:
❏ Turn lamp on.
❏ Check lamp connector.
❏ Perform lamp test.
❏ Change lamp.
❏ Replace AQB.
❏ Replace power supply.
E16: Low intensity
E16 HH:MM DDMMM intensity test>
low intensity make lamptest
Actions:
❏ Perform lamp test.
❏ Change lamp.
❏ Change flow cell.
E17: Data overflow
E17 HH:MM DDMMM data overflow >
intensity too high
Actions:
❏ Check whether cell is inserted correctly.
❏ Reduce lamp current.
❏ Change lamp.
E18: Data underflow
E18 HH:MM DDMMM data underflow>
ASC data too low
Actions:
❏ Check whether cell is inserted correctly.
❏ Increase lamp current.
❏ Change lamp.
❏ Change ASC, cable, AFE.
491
E19: Lamp turned on
automatically
E19 HH:MM DDMMM lamp turned on>
lamp turned on automatically
The lamp has been switched on per time program.
492
Diagnostic Features
Diagnostic Features
The instrument offers several built-in test features. Some are limited to
ChemStation operation (for details see descriptions of tests):
• intensity test
• holmium oxide test
• lamp intensity test
• ASC test
• D/A-Converter test
• electronic noise test
• close/open shutter
• check wavelength calibration
• RAM test
• ROM test
• Display test
N OT E
When using these test functions the 1050 DAD/MWD must not be in RUN
MODE.
Press BALANCE prior to perform the test.
When test cell is mentioned, remove cell and insert 4 nm slit for Series II
optical
You are entering the TEST FUNCTIONS by pressing STATUS followed by
PREV (4x). TEST FUNCTIONS <enter> ENTER.
493
Measure Intensity Profile
N OT E
This function is available from local keyboard only!
An intensity profile of the optical unit is measured. No calibration is made
before the measurement and the actual gain values are used. Perform this
test after the flow cell is flushed or removed with 4 nm slit installed.
MEASURE INTENSITYPROFILE
Taking the Profile
After pressing ENTER the message scanning ... is displayed for a second
and an intensity measurement between 190...600 nm is taken and stored like
a spectrum. The wavelength and the count number at maximum are
displayed max at max 17805cts at 234nm ; 0.00min.
Plotting the Profile (MWD only)
❏ Press SPECTR and RIGHT to display
PLOT 01 REF -- ;ints 0.00min.
❏ You can change now the wavelength range (190...600 nm) and the output
channel (out 1) if necessary.
❏ Press ENTER.
START INTEGR. AT SPEED=30 (enter)
❏ Start the integrator with the PLOT key and the spectrum of the intensity
profile is plotted after pressing ENTER.
❏ When the plot has finished max 17805cts at 234nm ; 0.00min is
displayed.
❏ Press ESC to return to beginning of line.
494
Find Maximum of Spectrum (MWD only)
❏ Press SPECTR, DOWN and RIGHT.
MAX. 01 REF -- ;ints 0.00min
❏ You can change now the wavelength range (190...600 nm) and the output
channel if necessary.
❏ The maximum is shown after pressing ENTER.
max 17805cts at 234nm ; 0.00min
Figure 178
Intensity Profile with Test Cell
495
Lamp Intensity Test
Lamp Intensity Test
N OT E
This function is available from local keyboard and from ChemStation!
An integral measurement of the lamp intensity is made in the range of 210 to
350 nm and the average counts are displayed (test is performed with
minimum gain = 0).
Now you can retrieve the plots or the maximum information. The plotted
curve should be within ±3% deviation from the intensity profile. Otherwise
the gain switching on the ASC board may not work properly.
N OT E
The characteristics vary from instrument to instrument depending on optics
lamp and array characteristics.
Figure 179
DAD/MWD Test: Lamp Intensity
496
Lamp Intensity Test
On local keyboard
If performed locally the display shows:
LAMP INTENSITY TEST ; 0
ENTER
LAMP INTENSITY TEST ; 14296
On ChemStation
If performed on the ChemStation this test is part of the DAD Test, see Figure
179 on page 496. The profile (190 to 600 nm) is stored on the ChemStation.
❏ Select Instrument, More DAD, DAD Tests...
❏ Press Measure and the instrument will perform the Lamp Intensity Test
and the Holmium Test automatically.
❏ Press Save to store both profiles.
❏ To print the profile refer to How to print the DAD Profiles, page 5-29.
497
Measure Holmium Spectrum
N OT E
This function is available from ChemStation only!
The shutter is moved to holmium filter position and a spectrum is measured
and plotted (full scale set to 4 AU).
Perform a BALANCE before entering this function.
The scan (190 to 600 nm) is stored.
N OT E
The characteristics vary from instrument to instrument depending on optics
lamp and array characteristics.
Figure 180
DAD/MWD Test: Holmium Spectrum
N OT E
At least one point should be >3000 mAU in the range of 190...300 nm.
498
On ChemStation
On the ChemStation this test is part of the DAD Test, see Figure 180. The
profile (190 to 600 nm) is stored on the ChemStation.
❏ Select Instrument, More DAD, DAD Tests...
❏ Press Measure and the instrument will perform the Lamp Intensity Test
and the Holmium Test automatically.
❏ Press Save to store both profiles.
❏ To print the profile refer to How to print the DAD Profiles, page 5-29.
On local keyboard
MAX. 01 REF -- ;holm 0.00min
ENTER
max 3912mAU at 228nm ; 0.00min
499
D/A Converter Test
D/A Converter Test
N OT E
This function is available from local keyboard only and is used to test the DAC
board (DAD optional)!
D/A CONVERTER TEST OFF
D/A CONVERTER TEST ON
The DAC board is tested by generation of a test pattern as DAC input. The
output voltages (out 1 and out 2) should show a constant value
corresponding to the ZERO OFFSET value. On top of this constant voltage is
a switched voltage with a duration of 12 seconds and a height of 15 µV, see
Figure 181.
Figure 181
D/A Converter Test
If the D/A converter and the plotting device are in specification then the noise
is depending on the peak width (5 µV are equal to 1 x 10-5 AU).
500
D/A Converter Test
When the function is switched on start the plotter (ATTN -5, ZERO=50) and
zero it.
Table 118
Limits of D/A Converter Test
Peak widths
Noise (pp) / Step height
< 0.01 / > 0.01 / > 0.02
1.3
> 0.05 / > 0.1 / > 0.2
0.5
> 0.4 / > 0.8
0.3
501
Electronic Noise Test
N OT E
ELECTRONIC NOISE TEST OFF
ELECTRONIC NOISE TEST ON
The optical unit and its electronic is tested with the possibility of changing
the parameters wavelength bandwidth peak width (before entering this
function).
The shutter is closed and the gain is fixed to minimum=0.
You can leave this function ONLY by switching to OFF.
Figure 182
With this test non-logarithmic intensity is measured. Result of test must not
exceed a given limit. If test fails the ASC DAC or optical unit may be
defective. If DAC test is OK then ASC or optical unit may be the problem.
502
Table 119
Limits of Electronic Noise Test
Peak width
Rise time
µVpp
Limit
3390/2/3
Limit 3394/96 ATTN
< 0.01
0.1 s
90
13.5 mm
27 mm
-1
> 0.01
0.2 s
90
13.5 mm
27 mm
-1
> 0.03
0.3 s
50
15.0 mm
30 mm
-2
> 0.05
1.0 s
30
18.0 mm
36 mm
-3
> 0.10
1.3 s
30
18.0 mm
36 mm
-3
> 0.20
2.6 s
20
12.0 mm
24 mm
-3
> 0.40
5.2 s
20
12.0 mm
24 mm
-3
> 0.85
10.0 s
20
12.0 mm
24 mm
-3
Measurement conditions
Any sample wavelength, bandwidth 4 nm, reference is switched off
automatically, 1 V full scale.
Table 120
NOISE 1:
Test as described.
NOISE 2:
Test as described under NOISE 1 but with PDA/LUM cable
disconnected
Noise Test Results
Result
Explanation
System OK
If NOISE 1 > NOISE 2 and in specification.
Electrical Problem
If NOISE 1 > limit and NOISE 2 >= limit.
Optical Problem
If NOISE 1 > limit and NOISE 2 < NOISE 1
503
Check of Wavelength Calibration
Check of Wavelength Calibration
N OT E
This function is available from local keyboard and from ChemStation.
The maximum absorbance of the Holmium filter is measured at 361 nm and
compared with a stored value. The difference in wavelength is displayed.
On local keyboard
CHECK WL CALIBRATION
IT SHOULD BE 2 AND IT IS 0
The value of 2 corresponds to 1 nm.
To change/correct the setting use function SET WL CALIB.
On ChemStation
❏ Select Instrument, More DAD, Wavelength Calibration.
❏ The wavelength calibration is started automatically (if lamp is on) see
Figure 183.
❏ If the value of Current and Should be is not equal then use Adjust to
correct.
❏ Press OK to store the new values and to add them to the Calibration
history.
❏ To print the profiles refer to How to print the DAD Profiles page 5-29.
Figure 183
Wavelength Calibration
504
ASC Test
ASC Test
N OT E
ASC TEST WITH GAIN 0 ; 0
The ASC board is tested by closing the shutter and measuring the dark
current of the photo diodes with three possible gains (0, 1, 2). Start test with
minimum gain first. High values may reflect in a non-linearity. (Default is
minimum gain = 0). The value that is shown is the average dark current
counts of a all photo diodes.
A value between 2500...5500 is the limit measured with gain 0. The value in
gain 1 and 2 may have a difference of ±1500 compared to the value from
gain 0.
N OT E
High values may reflect in a non-linearity.
The scan (190 to 600 nm) is stored.
You can change now the wavelength range (190...600 nm) and the output
channel if necessary.
Now you can retrieve the plots or the maximum information.
MAX. 01 REF -- ;tasc 0.00min
ENTER
max 3885cts at 475nm ; 0.00min
N OT E
If the difference between average and maximum is >100 then the array has a
problem at this particular wavelength. This might be no problem if the
customer is using a different wavelength.
505
Shutter Position
Shutter Position
N OT E
SHUTTERPOSITION OPEN
SHUTTERPOSITION HOLMIUM/CLOSED
The shutter can be positioned manually to OPEN, HOLMIUM and CLOSED
(dark current).
Leave this function by switching to OPEN.
506
ROM/RAM/DISPLAY Tests
ROM/RAM/DISPLAY Tests
The following functions are also performed during power on when both
STATUS and the LINE~ switch are pressed.
ROM TEST (enter)
The ROM checksum is compared with a stored value and the firmware
revision is displayed.
ROM TEST <executing>
( ROM test failed )
Action: Replace the FIM board.
RAM TEST (enter)
The RAM is tested.
RAM TEST <executing>
( RAM test failed )
Action: Replace CMP board.
DISPLAY TEST (enter)
The 32 characters of the display and the LEDs are tested. This test is the
same as performed during power on.
DISPLAY TEST <executing>
Action: If the display shows nothing, check first the soldered in on-board
fuse, see “Fluorescent Indicator Module (FIP)” on page 472.
507
Using the Built-in Test Chromatogram
N OT E
This function is available from ChemStation only!
The 1050 DAD has a built-in Test Chromatogram that can be used to check
the signal path from the detector to the ChemStation and the data analysis.
See Figure 184 and Figure 185 on page 509. The chromatogram is repeated
continuously until a stop is performed per stop time or manually.
To use the function proceed as follows:
❏ Set peak width to >0.05 minutes and run time to 4.5 minutes.
For a peak width of <0.01 the stop time can be set to 0.6 minutes.
❏ Type into the command line LoadSignal1050DAD INTERNAL.
The detector status goes to Prerun (Test) / Ready.
❏ Start a run.
The results are calculated like a normal chromatogram and the results
can be printed.
❏ The peak height is always the same but the area and the retention time is
depending on the set peak width.
508
Figure 184
Test Chromatogram: Peak width <0.05
Figure 185
Test Chromatogram: Peak width <0.01
509
How to print the DAD Profiles
Figure 186 shows the ChemStation screen when having performed the DAD
Test.
Figure 186
DAD Test
Using Paintbrush
❏ Press ALT and Print Screen keys to make screen capture.
❏ Leave the DAD Test and enter Paintbrush from the Program Manager.
❏ Select View and click Zoom Out.
❏ Select Edit and Paste (2x).
❏ Select View and click Zoom In.
❏ Select File, Print and [[OK]].
510
Using the Data Editor
❏ Select View, Data Analyses.
❏ Select View, Review DAD Test...
❏ Select from the table the spectrum of interest see Figure 187 or Figure 188.
❏ Press [[Show Selected Spectrum]] and select the window. At this point you
may zoom a certain part of the profile.
❏ Select File, Print, Selected Window for print.
Figure 187
DAD Test: Lamp Intensity
511
Figure 188
DAD Test: Holmium
512
22
22
DAD/MWD: Maintenance
Information
service and maintenance of the 1050 Diode Array
and Multiple Wavelength Detectors
DAD/MWD: Maintenance
Information
This chapter describes the following procedures that have to be performed
during servicing and maintenance of the 1050 DAD.
• removing the optical unit;
• flow cell maintenance;
• cleaning the quartz window;
• replacing fans;
• replacing shutter assembly or LUC/LPC board;
• replacing the leak sensor;
• upgrade to new optical unit;
• performance verification.
Tools Needed
❏ Screw driver flat 6 mm
❏ Hex wrench 6 mm
❏ Hex wrench 4 mm and length of 200 mm
❏ Pozidriv small
❏ cleaning tissue
514
DAD/MWD: Maintenance Information
Warnings and Notes
WA R N I N G
Dangerous voltages capable of causing serious personal injury are
present in this instrument. Use extreme caution when handling testing
and adjusting.
N OT E
DO NOT
open the screws of the large cover of the optical unit. This may result in
misalignments of the optical path.
exchange lamp housing. They are matched to the optical and replacement may
result in a misalignment of the optical path.
return defective exchange optical without information about the problem (use
attached info-note).
return flooded optical without information about the last used solvents (this
is needed for recycling).
N OT E
The lamp housing may be hot when you have to work at the optical unit.
515
Removing the Optical Unit
❏ Turn OFF the instrument and unplug the power.
❏ Remove top cover.
❏ Disconnect flow cell at union holder [2], remove cell from optical unit and
place it in front of the heat exchanger.
❏ Disconnect PDA [6] and Shutter [5] cable at optical unit and the Display
cable at the motherboard (LUM).
❏ Disconnect lamp connector [1].
❏ Disconnect the waste tube [3].
❏ Loosen the three bolts [4] that hold the optical unit (4 mm hex key
> 100 mm long) and take out the optical unit.
Figure 189
Optical Unit
1 - deuterium lamp
2 - union holder
3 - waste tube
4 - bolts
5 - connector shutter
6 - connector PDA
516
Flushing Procedure
To cleaning the flow cell (by using a glass syringe!) perform as described
below:
6 Flush with iso-Propanol.
7 Flush with bi-distilled water.
8 Flush with nitric acid : water (5 : 95).
9 Flush with bi-distilled water.
10 Flush with iso-Propanol
C A UT I O N
This concentration of nitric acid is dangerous and proper attention to safety
should be given. Also the nitric acid flushing procedure is not a certain cure
for a dirty cell. It is to be used as a last attempt to salvage the cell before cell
replacement. Note that the cell is essentially a consumable item.
517
Replacements on Standard Flow Cells
Replacing the Gaskets
❏ Take out the flow cell.
❏ Take a flat screwdriver (6 mm width) or a 6 mm hex wrench and turn out
the flow cell window assembly [1].
❏ In case of an leakage replace the gasket [2].
❏ Fix the flow cell window assembly.
Figure 190
Disassembled Flow Cell
Replacing Window Assembly Parts
❏ Take out the flow cell window assembly (Figure 190, item 1).
❏ Take out the quartz window carefully by pressing it out of the window
holder.
N OT E
If the washers have fallen out of the assembly they have to be inserted in the
correct order. Otherwise the window may break or will be leaky see.
❏ Clean or replace the window.
❏ Fix the window assembly.
518
1 Flow cell window assembly.
2 Window assembly schematic.
1 - window screw
2 - spring washers
3 - compression washers
4 - window holder
5 - quartz window
6 - gasket
3 Assembling of the washers.
4 Assembling of Teflon ring and window
assembly.
519
5 Replacing flow cell window in window
assembly.
Replacements on High Pressure Flow Cells
For cleaning the flow cell windows you will need
❏ a 4 mm hexagonal key (supplied with flow cell)
❏ a 20 mm open-ended wrench
❏ tweezers and
❏ a toothpick.
Figure 191
Cross-section of Window Assembly
Washer
Windows
Washer
Conical Disk Springs (see
below)
Window Screw
Detail of Conical Disk
Springs Showing
Orientation
520
Stage 1: Disassembling the Window Assembly
❏ Take flow cell out of optical unit.
❏ Unscrew window assembly (see Figure 191) using a 4 mm hexagonal
key--use a 20 mm open-ended wrench to hold the flow cell.
❏ Carefully take out window using a toothpick or a 4 mm hexagonal key.
❏ Take out the conical disk springs and discard them.
❏ Clean window in ultrasonic bath filled with methanol or ethanol.
Stage 2: Assembling the Window Assembly
❏ Put conical disk springs in window screw see Figure 191. Always use new
conical disk springs.
❏ Press window and seal rings together using tweezers.
❏ Put window and seal rings in window screw. Keep window facing upwards
to prevent it falling out.
❏ Screw window assembly into flow cell until finger tight.
❏ Tighten window assembly using a 4 mm hexagonal key, use a 20 mm
open-ended wrench to hold flow cell.
❏ Check flow cell for leaks.
If you have an 1050 Series pumping system use flow test method
described in Installing and Maintaining Your Pumping System.
Connect inlet capillary of flow cell to pump outlet. Connect blank nut to
outlet capillary of flow cell.
If flow cell leaks tighten window screw and check again for leaks.
❏ Put flow cell in optical unit.
521
This procedure can to be performed in case the intensity gets low and lamp
exchange does not increase the light trough put.
Between the lamp housing and the achromat lens system a quartz window is
located to protect the achromat against contaminations.
Removing the Quartz Window
Refer to Figure 192 on page 523.
❏ Take optical unit out of the instrument.
❏ Remove the lamp housing (2 screws).
❏ Remove the securing ring (1) with a pliers.
❏ Take out the spring (2) the aperture (3) and the window (4).
❏ Clean or replace the window.
N OT E
Use ethanol or methanol and lens paper to clean the window. DO NOT touch
or scratch the surface of the window. This will result in loss of intensity.
❏ Replace all parts in correct order. Watch for correct direction of the
aperture!
522
Figure 192
Removing Lamp House Parts
1 Removing of lamp housing.
2 Removing the quartz window.
1 = Securing Ring, 2 = Spring, 3 = Aperture, 4 = Window
523
Replacing the Achromat
Replacing the Achromat
To replace the achromat assembly proceed as follows:
❏ Switch off the power from the instrument.
❏ Take the optical unit out of the instrument.
❏ Remove the cover plate above the flow cell/shutter compartment.
C A UT I O N
Do not touch the AFE connector board!
❏ Unscrew the achromat assembly (hex key) and remove it.
❏ Insert the new achromat assembly completely and fix it.
❏ Replace the optical cover and reconnect the cables.
❏ Reinstall the optical unit and turn on the power.
❏ Perform a WL CALIBRATION TEST and correct the ‘is’ and ‘should be’
values if required (should be within ±3 steps from the original value from
step 1). If not within the range, rotate the achromat and repeat this step.
Figure 193
Location of Achromat Assembly
AFE Connector
Setscrew
Achromat Assembly
524
Replacing Fans
Replacing Fans
❏ Remove top cover and disconnect ALL cables from Motherboard.
Figure 194
Removing Fans
Fan cover not shown
❏ Take out the foam part which contains the fans completely.
N OT E
Take care that no connector on the Motherboard breaks when removing or
inserting the foam part.
❏ Note the position of the fan and replace it (arrow on the fan).
❏ Replace foam part carefully into the module.
❏ Connect ALL cables at the Motherboard and replace top cover.
525
Replacement of Shutter or LPC Board
Replacement of Shutter or LPC Board
In case the shutter assembly or the LPC board shows a malfunction it can be
replaced.
Figure 195
Shutter Assembly
❏ Remove the main cover to have access to optical unit.
❏ Disconnect flow cell and remove it.
❏ Remove slit assembly.
❏ Remove the cover of the optical compartment (5 screws).
❏ Disconnect LPC board from shutter assembly.
❏ Replace shutter assembly or LPC board.
❏ Replace all parts in correct order.
526
Replacement of Leak Sensor
Replacement of Leak Sensor
In case the leak sensor assembly shows a malfunction it can be replaced.
Figure 196
❏ Remove the main cover to have access to optical unit.
❏ Disconnect flow cell and remove it.
❏ Remove slit assembly.
❏ Remove the cover of the optical compartment (5 screws).
❏ Disconnect leak sensor from LPC board using a pliers.
❏ Replace leak sensor.
❏ Replace all parts in correct order.
527
Upgrade to from 79854A MWD to G1306A DAD
Upgrade to from 79854A MWD to G1306A
DAD
When upgrading 79854A MWD to DAD capabilities the keyboard and the
firmware board has to be exchanged. For parts list refer to “Upgrade Parts
MWD to DAD” on page 546.
C A UT I O N
Electronic boards are sensitive for electrostatic discharge. Use ESD
protection when replacing electronic boards.
❏ Remove the AQB board.
❏ Update the firmware board (FIM) to DAD version.
❏ Install the AQB board.
❏ Disconnect cable from keyboard electronics (FIP) to LUM (motherboard).
❏ Remove keyboard module from instrument.
❏ Remove metal cover at the rear.
❏ Remove FIP from MWD keyboard module.
❏ Install FIP into DAD keyboard module.
❏ Install keyboard module in the instrument.
❏ Reconnect cables.
528
Upgrade MWD with Series II Optical
Upgrade MWD with Series II Optical
N OT E
For required parts refer to “Upgrade Parts MWD to Series II Optical” on
page 547.
1 If an AQB board 01048-66543 (latest version) is installed skip step 2 and 3.
2 Check the AQB board for presence of 220 Ohm resistor that is located
between fuse F22 and the rear connector J1 (SN 01050-016). If not exist,
replace.
3 Q1C should be cut out only if the resistor on the AQB, mentioned in
SN 01050-016, has a value of 220 ohms and the firmware has revision 3.
Otherwise the current will be too low to move the shutter correctly
(SN 01050-021A).
4 Install new FIM board (3.10) if required.
5 Install series II optical unit.
6 Install series II flow cell.
7 Reconnect capillaries.
8 Check for leaks.
529
Verifying the Performance
Specifications
The noise and drift specifications of your detector are 4 x 10-5 AU and
2 x 10-3 AU/h respectively at 254 nm, 4 nm bandwidth, 1 second response
time and 1 ml/min flow of water after warm-up.
What You Need
To check these specifications you need:
• A pump that can deliver bi-distilled water at a rate of up to 1 ml/min against
a back-pressure of about 200 bar;
• A column: we recommend a 100 x 4.6 mm i.d. 5 µm Hypersil ODS column.
• A recording device that can accept the output signal from your detector
and that has attenuation set to about 35 cm/mV.
Preparations
❏ Prime the pump and ensure there are no air bubbles in the system.
❏ Thoroughly degas about 300 ml of bi-distilled water.
❏ Set pump to deliver bi-distilled water at a flow rate of 1 ml/min.
❏ Set the attenuation of the recording device to about 35 cm/mV.
❏ Set run time to 6.0 minutes.
❏ Turn ON detector and allow intensity of emitted radiation from radiation
source to stabilize.
❏ Set detection wavelength to 254 nm and bandwidth to 4 nm. Set reference
wavelength to 450 nm and bandwidth to 100 nm.
❏ Set peak width to >0.05 minutes.
❏ Set output signal so that 1 AU is equivalent to 0.5V.
❏ Start a run, press [[START]] [[ENTER]].
530
The baseline noise should not exceed 20 µV (4 x 10-5 AU) equivalent to 12 mm
at attenuation - 3 on a3390/2/3 integrator and equivalent to 24 mm at
attenuation - 3 on a 3394/6 integrator.
Figure 197
Example of Noise Plot
531
Scaling Factors
The table below shows the scaling factors for the 339XA family of
integrators. The 3390A, 3392A and 3393A have a full scale deflection of
75 mm. The 3394A and the 3396A have a full scale deflection of 150 mm, they
also have an attenuation range between -8 and 36.
Table 121
Scaling Factors on 339X integrators
ATTN
mV full scale
mAU full scale
-3
0.125
0.25
-2
0.25
0.5
-1
0.5
1
0
1
2
1
2
4
2
4
8
3
8
16
4
16
32
5
32
64
6
64
128
7
128
256
8
256
512
9
512
1024
10
1024
2048
532
23
23
DAD/MWD: Parts Information
1050 Diode Array and Multiple Wavelength
Detectors
listings respectively.
• Overall Diagram
• Optical Unit
• Heat Exchanger and Flow Cell
• Flow Cell Kits
• Upgrade Parts MWD to DAD
• Accessory Kit
534
Overall Diagram
Overall Diagram
Table 122
Overall Diagram
Item Description
Part Number
1 Fan Base (set of two)
01048-47701
2 Fan DC Axial
01048-68500
Fan Cover
3160-0544
# 3 Mainframe
Item Description
24 Keyboard Module (DAD)
Keyboard Module (MWD)
Part Number
01048-60202
01048-60201
25 FIP Board
5061-3376
26 Cable FIP/LUM
5061-3400
4 Screw M4 20 mm lg
0515-0175
27 Optical Unit
see page 538
0515-0889
28 Cable PDA/SHUTTER-LUM
5062-2410
6 Foot Rear
0403-0427
29 Heat Exchanger/Flow Cell
see page 540
7 Foot Front
5041-2161
30 Cable Lamp/LUM
01048-61603
8 Cover Hinge
5041-2147
# 31 Cover Power Supply
01048-04104
9 PWR Switch Actuator
5041-2162
32 Power Supply Assembly
01050-69375
10 PWR Switch Spring
1460-1510
33 ASC Board Assembly
01048-66501
11 PWR Switch Push Button
G1600-47400
34 AQB Board Assembly
01048-69543
35 FIM Board Assembly (DAD)
G1306-66524
#12 Frame + Cover Keyboard (42)
13 Filter
Part of 16
FIM Board Assembly (MWD)
01048-66504
14 Ring Filter
Part of 16
Screw M3 6 mm lg
0515-0886
15 Logo Base/Name Plate
5041-2144/n.a.
36 DAC Board Assembly
01048-66502
16 Front Panel (incl. 13, 14)
01048-60301
37 Plate Cover (33 mm width)
5001-3721
5041-2145
38 CMP Board Assembly
01050-69580
18 Leak Interface TOP
5062-8551
39 Top Cover
5001-3724
19 Leak Interface BOTTOM
Part of 18
20 Leak Interface Adapter
Part of 18
41 LUM Mother Board Assembly
21 Tube Flexible 6.5 mm i.d. (5 m)
5062-2463
43 Communication Interface Board CRB 5062-2482
22 Tube Flexible 0.7 mm i.d. (5 m)
5062-2462
23 Bolt
5041-2164
# 40 Card Cage Assembly
01048-84501
01048-66510
# These items are part of Sheet Metal Kit 01048-68701
535
Overall Diagram
Figure 198
Overall Diagram Part 1 (Series II)
536
Overall Diagram
Figure 199
Overall Diagram Part 2 (Series II)
537
Optical Unit
Optical Unit
Table 123
Optical Unit
Item Description
Part Number
Item Description
Part Number
# Optical Unit - New
01048-60024
# 15 Flow Cell Assembly STD
see page 541
# Optical Unit - Exchange
01048-69024
Flow Cell Assembly HP-STD
see page 542
79883-61901
Flow Cell Assembly HP-Micro
see page 543
0515-0886
Cell Clamp Assembly
79883-85001
79883-66509
Screw M2.5 6mm lg
0515-1056
# 1 Shutter Assembly
2 Screw M3 6mm lg
# 3 LPC Board Assembly
4 Screw M2.5 6mm lg
0515-0894
# 16 Capillary IN 0.17
79883-87303
5 Bolt
5021-1853
# 17 Capillary OUT 0.17
79883-87304
6 RFI Strip
01048-09101
18 Union
0100-0900
7 Damper
5041-2165
19 Clamp Union
79883-00502
8 Deuterium Lamp Assembly
79883-60002
9 Screw M3 10mm lg
0515-0757
21 Heat Exchanger Assembly
01048-87305
10 Union Holder
01048-02321
22 Screw M3 8mm lg
0515-0897
11 Screw M3 8mm lg
0515-1430
23 Tubing Flexible 80mm lg
0890-0581
12 Set Screw M3 6mm lg
0515-0031
24 Elbow Fitting (Plastic)
0100-1428
13 Union
0100-0900
25 Leak Sensor Assembly
5061-3356
# 14 Slit Assembly 2 nm
79883-80002
26 Nut M3
0535-0004
Slit Assembly 4 nm
79883-80004
27 Screw M3 8mm lg
0515-1430
Slit Assembly 8 nm
79883-80008
# 20 Screw
0515-0922
# 28 Cover Illum Compartment
79883-04101
# 29 Achromat Assembly
79883-60000
# These parts are not interchangeable with the previous optical unit design
(Series I).
538
Optical Unit
Figure 200
Optical Unit
29
539
Table 124
Item Description
Part Number
Item Description
Part Number
1 Heat Exchanger
01048-87305
5 Capillary OUT
see flow cell
2 Screw M3 8mm lg
0515-0897
6 Union
0100-0900
3 Flow Cell STD
see page 541
7 Clamp Union
79883-00502
Flow Cell High Pressure STD
see page 542
8 Screw M2.5 8mm lg
0515-0922
Flow Cell High Pressure Micro
see page 543
4 Capillary IN
Figure 201
see flow cell
Capillary Column/MWD (60 cm lg 01048-87302
0.17 mm i.d.)
Since 1992 with two
welded ZDV
540
Flow Cell Parts (STD-SST)
Table 125
Standard Flow Cell
Item Description
Part Number
Item Description
Part Number
Flow cell SST 6 mm, 8 µl
79883-60051
5 Compression Washer
79883-28801
Flow cell SST 10 mm, 13 µl
79883-60052
6 Washer (pack of 10)
5062-8553
Cell Repair Kits
see page 544
7 Window Screw
79883-22402
Capillary IN 0.17, 100 mm lg
79883-87303
8 Cell Clamp Assembly
79883-85001
Capillary OUT 0.17, 150 mm lg
79883-87304
1 Window Assembly
consists of 3, 4, 5, 6, 7
Screw M2.5 x 4 mm lg (cell body) 0515-1056
Clamp Union
79883-00502
Screw M2.5 x 8 mm lg (clamp)
0515-0922
2 Cell Gasket
see page 544
Wrench 4 mm for fittings
8710-1534
3 Window Quartz
1000-0488
Hex Key 6 mm for cell screw
8710-2023
4 Window Holder
79883-22301
Figure 202
541
High Pressure Flow Cell Parts (HP-STD-SST)
High Pressure Flow Cell Parts
(HP-STD-SST)
Table 126
High Pressure Flow Cell
Item Description
1
Part Number
Item Description
Part Number
79883-60054
5
Washer (pack of 10)
5062-8553
Cell Repair Kits
see page 544
6
Window Screw SST
79883-22404
Cell IN 50 .17, 100 mm lg
79883-87303
Cell OUT 50 .17, 150 mm lg
79883-87304
Window Assembly
2
Seal ring HP
79883-27101
8710-2023
3
Window Quartz HP
1000-0953
8710-1534
4
Compression Washer HP
79883-28802
Figure 203
High Pressure Flow Cell (HP-STD-SST)
542
High Pressure Flow Cell Parts (HP-Micro-SST)
High Pressure Flow Cell Parts
(HP-Micro-SST)
Table 127
Item Description
Part Number
Item Description
Part Number
Micro Flow Cell 1.7 µl
79883-60055
5 Washer (pack of 10)
5062-8553
Cell Repair Kits
see page 544
6 Window Screw SST
79883-22404
1 Window Assembly
Cell IN 50 .17, 100 mm lg
79883-87303
Cell IN .12, 100 mm lg
79883-87305
2 Seal ring HP
79883-27101
Cell OUT 50 .12, 370 mm lg
79883-87306
3 Window Quartz
1000-0953
8710-2023
4 Compression Washers HP
79883-28802
8710-1534
Figure 204
High Pressure Flow Cell (HP-Micro-SST))
543
Cell Repair Kits
Cell Repair Kits
Table 128
Cell Repair Kits
Description
contains (Qty)
Cell Repair Kit
79883-68701
Seal Kit
Seal Kit
79883-68702
Cell Screw Kit
79883-68703
Cell Gasket (12)
79883-68702
Cell Screw Kit
79883-68703
Window Quartz (2)
1000-0488
Compression Washers (2)
79883-28801
Window Holder (2)
79883-22301
Window Screw (1)
79883-22402
Spring Washers (10)
5062-8553
Cell Kit High Pressure
544
Part Number
79883-68700
Window Quartz HP (1)
1000-0953
Spring Washers (10)
5062-8553
Seal ring HP (2)
79883-27101
Lamp Housing
Lamp Housing
Table 129
Figure 205
Lamp Housing
# Description
Part Number
1 Retaining Ring
0510-1219
1460-2254
3 Aperture
79883-24601
4 Window
79880-28111
Lamp Housing
545
Upgrade Parts MWD to DAD
Upgrade Parts MWD to DAD
The following parts are required to upgrade a 1050 MWD (79854A) to 1050
DAD (G1306A).
Table 130
1050 Upgrade Parts MWD to DAD
Description
Part Number
Firmware Board FIM
G1306-66524
Keyboard (plastics)
01048-60202
Installation Note
see “Upgrade to from 79854A MWD
to G1306A DAD” on page 528
546
Upgrade Parts MWD to Series II Optical
The following parts are required to upgrade a 1050 MWD (79854A) to 1050
MWD Series II optical.
Table 131
Description
Part Number
Optical Unit
79883-60024
Firmware Board FIM
01048-66504 *
Slit assemblies as required
see “Optical Unit” on page 538
Flow cell as required
see Flow Cells
Resistor for AQB board modification
220 Ohm 5% 2W
0698-3628 ** or
AQB board (latest version)
01048-69543
*
Only required, if firmware revision is < 3.1.
Only required if AQB board does not have the resistor that is located between fuse F22 and the rear
connector J1 (SN 01050-016).
**
547
List of Accessories
List of Accessories
The following list shows parts that were part of the STD Accessory Kit.
Please order by item if required.
Table 132
Accessories
Description
Part Number
Hex Key for flow cell
8710-2023
Capillary Column/MWD 0.17 mm i.d. 800 mm lg
01048-87302
Crimp Terminals
0362-0321
Screw M3 6 mm lg
0515-0886
Tube Flexible 0.7 mm i.d. (re-order 5 m)
5062-2462
CONT CONN UTIL F
1251-3911
CONN UTIL 2PIN F
1251-4782
Fuse 2 A 250 V NTD
2110-0002
Fuse 3 A
2110-0003
Fuse 250 V 0.25 A NB
2110-0004
Ferrule
5041-2121
Gripper
5041-2122
Male
5041-2123
Buffer Disc
5041-2124
Wrench 5/16-1/4
8710-0510
Screwdriver POZI 1 PT 3
8710-0899
Hex Key 3 mm
8710-0911
8710-2023
548
24
24
DAD/MWD: Additional
Information
DAD/MWD: Additional
Information
This section gives the following informations:
• Hardware changes
• Firmware changes
• Known Problems
550
DAD/MWD: Additional Information
Product History
Product History
The introduction of the 79854A Multiple Wavelength Detector was in 1988.
The introduction of the G1306A Diode Array Detector was in 1993.
The following hardware and firmware changes have been implemented.
Hardware Changes
Table 133
Hardware Changes
Date
Serial Number
Change
1990
3016G....
Introduction of Series II optical
Jul 1992
Introduction of new cell screw design for
Series II flow cells. 6 mm hexagonal key
instead of screw with slit.
Nov 1992
Introduction of High Pressure Cell with 13 µl
and 1.7 µl for 400 bar operation (for Series II).
Oct 1993
3343G00938
Apr 1994
New AQB board, same for 79854A MWD,
G1306A DAD and G1600A CE.
Introduction of Fan Cover and new part
number for fans
Apr 1994
3414G00321
New Firmware 1.10 (see “Firmware Changes”
on page 552).
May 1994
3423G../3423A...
Introduction of n-MOS optical units.
Jul 1994
Change on ASC board (delay time of
amplifier), revision D-3444.
Dec 1995
DAD
on page 552).
May 1997
DAD
on page 552).
551
Firmware Changes
Firmware Changes
Table 134
Table 135
DAD Firmware Revisions
Revision Major Changes
Comments
1.00
First official release for G1306A
1.10
Instrument checks for lamp overflow
before WL calibration and returns an
error message (RE3001) if lamp
overflow occurs.
Essential for optical used in Capillary
Electrophoresis instruments.
FIM board same in G1306A and
G1600A (CE)
1.20
added fraction collection for G1600A same in G1306A and G1600A (CE)
(CE)
1.30
for use with new ChemStation
Software
same in G1306A and G1600A (CE)
MWD Firmware Revisions
Comments
1.00
No GPIB communication
First official release for 79854A
3.00
GPIB communication for HPLC
ChemStation.
Showed some GPIB communication
problems. Should be replaced
with revision 3.1 (01048-66504).
3.10
GPIB communication problems solved Replaced version 3.00 (01048-66504).
552
Known Problems
Known Problems
Panic Errors
Intermittent PANIC errors are mostly generated by spikes (disturbances) on
the bus lines. A dynamic bus termination has been added to the FIM board to
suppress the spikes and to reduce the possibility of this failure mode.
All FIM boards with revision C and higher do have the dynamic bus
termination installed (RC-network instead of R-network).
In case of intermittent PANIC errors replace FIM boards (revision A or B)
with the current version.
553
Known Problems
554
In This Book
only.
1050 Series of HPLC
Modules
Service Handbook Variable Wavelength
Detector (79853C)
Technologies 2001
allowed under the
copyright laws.
Part No. NONE
11/2001
Printed in Germany
Warranty
IMPORTANT NOTE
The information
contained in this
01050-90102 edition 4
(1995).
this material,
including, but not
warranties or
merchantability and
purpose.
76337 Waldbronn
Germany
information (79854A
MWD) and the 79853A
VWD information has
been removed (products
went out of support
during 2000).
Contact your local
case of part number
issues or upgrades.
web page
www.agilent.com.
25
25
VWD: General Information
the 1050 Variable Wavelength Detectors
• about this detector
• repair policy
• specifications
560
About the Detector
About the Detector
The 1050 Variable Wavelength Detector (VWD) is a detector of the modular
type liquid chromatograph 1050 Series. This is a standalone
grating/photodiode type general purpose detector. The performance and
features match the requirements of the routine analysis and QC/QA analysis.
The 1050 VWD is a standard size detector of 1050 modular type LC series and
can be build up with other LC modules, such as pump and automatic sampler.
Since it is standalone type, it can be also used as an ordinary LC detector. It
has a functional keyboard and 16-character fluorescent display which
provides you easy operation.
Versions vs. Support Periods (EOS)
79853A
• The 79853A VWD was shipped between May 1988 and January 1992. The
support with parts ended November 1, 2000.
79853C
• The 79853C VWD replaced the model 79853A VWD in January 1992. The
end of support (EOS) will be August 1, 2006 with all 1050 series HPLC
modules.
• The 79853C VWD got a redesigned optical unit (“D” enhanced optical, see
“VWD: Enhanced Optical Unit Information” on page 705) that replaced the
original “C” optical unit in June 1995. The end of support (EOS) for the “C”
optical unit parts will be August 1, 2006 with all 1050 series HPLC modules.
561
Repair Policy
Repair Policy
The 1050 VWD is designed that you can access all components easily. You can
recalibrate wavelength using control functions. Customers are able to
maintain certain parts of the 1050 VWD see Operator’s Handbook.
For details on repair policy refer to “Repair Policy” on page 38 in chapter
1050 Common Information.
562
Specifications
Specifications
Table 136
Specifications of 79853C VWD
Detection Type
Double beam photometer.
Noise
< 1.5 x 10-5 AU peak-to-peak at 254 nm, flowing
water at 1 ml/min, 1 second response time (10-90%),
standard flow cell.
Drift
< 5 x 10-4 AU/hour at 254 nm after warm-up.
Wavelength Range
190 - 600 nm, settable in 1 nm increments.
Wavelength Accuracy
±2 nm.
Wavelength Reproducibility
±0.3 nm.
Bandwidth
6.5 nm.
Linear Absorbance Range
Better than 1% up to 1.2 AU using acetone at 265 nm.
Response Time
0.25, 1 or 4 seconds (10-90%); user-selectable.
Spectra
Storage of 1 spectrum during run; scan rate
10 nm/sec; range from 190 to 600 nm, selectable.
Post-run plotting speed from 1 to 50 nm/sec
selectable; plotting of background-corrected
spectrum.
Light Source
Deuterium lamp from 1090/40/50 DAD.
Flow Cells
Standard 14 µl volume, 8 mm pathlength cell with
40 bar (588 psi) pressure maximum. Optional micro,
preparative, high-pressure cells are available.
Display
Single line, 16 character fluorescent display with real
time display of operating parameters and/or
absorbance.
Control
editing during run possible; keyboard lock; optional
control by computer or 3396 Series II integrator.
563
Specifications
Table 136
Specifications of 79853C VWD
Parameters
Wavelength, output range, response time, zero,
offset, balance, spectrum acquisition.
Diagnostic Aids
Wavelength calibration check with Holmium oxide
filter.
Time-programs
Time-programmable wavelength and output range;
storage of up to 5 time-programs.
Analog Output
One output user-configurable as recorder or
integrator. For recorder: 100 mV or 1 V output range
from 0.001 to 4 AU, user-selectable; for integrator:
100 mV/2 AU full scale or 1 V/2 AU full scale,
user-selectable.
Communications
START (input/output), STOP (input/output), READY
(output), SHUTDOWN (output) for synchronization
with other LC modules.
Safety Aids
front-panel LED’s. Leak detection, safe leak handling,
leak output signal for shutdown pumping system. Low
voltages in major maintenance areas.
Environment
Temperature range: 5 to 55°C
Humidity: < 95% (non-condensing)
Power Requirements
Dimensions
Height: 133 mm ( 5.2 inch)
Width: 325 mm (12.8 inch)
Depth: 545 mm (21.5 inch)
Weight: 14 kg ( 31 lb)
564
26
26
VWD: Hardware Information
about the 1050 Variable Wavelength Detectors
Overview
N OT E
The information in this chapter is based on the original optical unit (version
“C”). In June 1995 this optical was replaced by the enhanced version “D” to
overcome baseline stability problems in unstable environments.
For details on this “D” version refer to section Enhanced Optical Unit
Information “VWD: Enhanced Optical Unit Information” on page 705.
Figure 206 on page 567 shows the block diagrams of the 1050 VWD 79853C.
The main components are:
Table 137
Main Components Overview
Component
Purpose
provides all voltages within the instruments
Detector Controller Board
(DCB)
controls power supply, grating stepper motor,
cutoff filter, keyboard, display and GPIB
interface. It processes the signals coming
from the pre-amplifier boards (sample and
reference), the information from the grating
and filter position sensor, leak sensor, remote
control lines and the GPIB interface.
Optical Unit
contains all optical parts
Keyboard/Display
entry and display of parameter
GPIB Interface
communication with external controllers via
GPIB
566
Overview
Figure 206
Block Diagram of VWD
567
Optical System Overview
Optical System Overview
Figure 207 shows the optical diagram of the 79853C VWD. The radiation from
the deuterium lamp is focused on a spherical mirror (M1). The light beam
passes then a plane mirror (M2) the cutoff filter, the entrance slit, a spherical
mirror (M3), the grating, again a spherical mirror (M4), a beam splitter and
the flow cell to the sample diode. The beam through the flow cell is absorbed
depending on the solutions in the cell, where UV absorption takes place. The
intensity is converted to an electrical signal by means of the sample
photodiode. Part of the light is directed to the reference photodiode by the
beam splitter to obtain reference signal for compensation of intensity
fluctuation of the light source. A slit in front of the reference photodiode
focusses the light. Wavelength selection is made by rotating the grating,
which is driven directly by a stepper motor. This configuration allows fast
change of the wavelength. The cutoff filter is moved into the lightpath above
370 nm to reduce higher order light.
Figure 207
Light Path of Detector
568
Leak Interface Assembly
Leak Interface Assembly
To route waste from a module standing above the 1050 VWD to a module
below a leak interface can be installed at the detector. It is part of the
accessory kit.
Figure 208
Leak Interface
569
A drain is located at the bottom of the cell compartment and can be led to the
waste container or the 1050 waste handling system (the VWD has to stand on
top of another module when the leak interface is not used).
A leak sensor is located behind the front panel assembly (Figure 209).
Solvent would cool the leak sensor (self heating thermistor). The resulting
change in resistance, measured by comparators on the Detector Controller
Board (DCB), would generate an error message and switch the deuterium
lamp OFF.
N OT E
In the 1050 System remote mode the leak message will turn off the pump.
Figure 209
570
Fan Assemblies
Fan Assemblies
The instrument is equipped with two fans.
On the 79853C VWD, the fans are of different type:
HIGH type
this fan is located close to the lamp housing and runs
with a higher speed
LOW type
this fan is located at the rear under the GPIB interface
and runs with a lower speed
The fans are connected to +24 VDC on the DCB Board.
571
Optical Unit
Optical Unit
N OT E
The Optical Unit houses all parts, from the deuterium lamp to the photodiode
pre-amplifiers.
N OT E
The repair level is component.
The optical unit is also available as assembly.
Figure 210
Optical Unit
572
Optical Unit
Flow Cells
There are several flow cells available as stainless steel or as titanium version,
see Table 138 on page 574. The flow cell (Figure 211) can be exchanged
easily. No adjustments are necessary. After disassembling of the flow cell,
gaskets and windows can be replaced (refer to section “Flow Cell
Maintenance” on page 655).
There are several kits set up with replacement parts like gaskets and
windows, see “Standard Flow Cell “C” (SST/Ti)” on page 693 and the
following pages.
Figure 211
STD Flow Cell
N OT E
At the outlet of the flow cell a defined peek capillary (from the accessories
must be connected to build up a certain back pressure (noise reduction). See
“Standard Flow Cell “C” (SST/Ti)” on page 693 and the following pages for
parts.
573
Optical Unit
Table 138
Flow Cell Data
STD
(SST)
UHP MICRO
(SST) (SST)
STD
(TI)
PREP
(TI)
Maximum Pressure
40
400
40
40
40
bar
Pathlength
8
8
5
8
VAR
mm
Volume
14
14
1
14
VAR
µl
Inlet i.d.
0.25
0.25
0.10
0.25
0.80
mm
Inlet length
555
555
555
555
67
mm
Outlet i.d.
0.25
0.25
0.25
0.25
0.80
mm
Outlet length
67
67
67
67
100
mm
Outer diameter
1/16
1/16
1/16
1/16
1/16
inch
Used materials for SST flow cells: SST, quartz and PTFE or Polyimide HP cell
Used materials for TI flow cells:
N OT E
TI, quartz and PTFE
STD
Standard Flow Cell
HP
High Pressure Flow Cell (replaced by UHP early 1993)
UHP
Ultra High-Pressure Flow Cell (replaces HP early
1993), see details on “Ultra High-Pressure Flow Cell”
on page 575.
PREP
Variable Preparative Flow Cell with volume of 0.9, 1.8,
4.4 or 8.8 µl depending on which gasket is used.
MICRO
Semi Micro Flow Cell
The gaskets, windows and rings are not compatible with the high pressure
Cell (79853-60009 - OBSOLETE) that has been replaced by the ultra high
pressure Cellflow cell (79853-60013). See “Ultra High Pressure Flow Cell
(SST)” on page 697 for details.
574
Optical Unit
Table 139
Correction factors for 79853C flow cells
Flow cell type
Cell volume Part number
Path length
(nominal)
Path length
(actual)
Correction
factor
Standard flow cell
14 µl
79853-60000
8 mm
8.00 ± 0.19 mm
8/8.05
Standard flow cell TI
14 µl
79853-60011
8 mm
8.00 ± 0.19 mm
8/8.00
Micro flow cell
1 µl
79853-60010
5 mm
5.00 ± 0.19 mm
5/5.00
Ultra High pressure flow cell
14 µl
79853-60013
8 mm
8.00 ± 0.19 mm
8/8.00
Ultra High-Pressure Flow Cell
Typical applications of the high-pressure flow cells are:
• Hyphenated systems (LC-MS)
• Supercritical Fluid Chromatography (SFC)
• Multidetector systems
• Narrow-bore column applications
The main difference between the standard and high-pressure flow cells is the
design of the window assemblies. The high-pressure flow cells have different
windows, seal ring and gaskets, see Figure 212. The seal rings support and
hold the window and at the same time form the high-pressure seal.
N OT E
The gaskets, windows and rings are not compatible with the high pressure
Cell (79853-60009 - OBSOLETE) that has been replaced by the ultra high
pressure Cellflow cell (79853-60013). See “Ultra High Pressure Flow Cell
(SST)” on page 697 for details.
The following materials are in contact with solvents: Stainless steel
(AISI 316), Quartz, Kapton® polyimide (Kapton is a registered trademark of
DuPont).
Recommended pH range: 2.3 to 9.5
575
Optical Unit
Figure 212
Exploded Diagram of High-Pressure Flow Cell
Deuterium Lamp
On the 79853C VWD, the deuterium lamp (Figure 213) is the high intensity
lamp (79883-60002), which is same as in the 1040/90/50 series Diode Array
Detectors.
The reduction of energy emission of the lamp (Figure 214 on page 577) is
time and wavelength dependent and is significantly higher within the first
days and for wavelengths in the ultra violet range compared to the visible
range (change in transmission of lamp glass).
Usually, the response maximum of the lamp is near 230 nm, but can be
shifted to a higher wavelength for an aged lamp. It has no relevance for
intensity degradation at other wavelengths.
The deuterium lamp filament is heated only during the ignition phase. The
deuterium lamp can be exchanged easily. The lamp needs no adjustments.
576
Optical Unit
Figure 213
Deuterium Lamp
Figure 214
Intensity Degradation of Lamp (79883-60002)
• Measured wavelength is 230 nm
• initial intensity about 20% higer than 79880-60002
• decrease in intensity is less with use
577
Optical Unit
N OT E
The lamp should be replaced only if the following two criterias are both
fulfilled:
Baseline Noise (with test cell) has increased significantly.
Amount of counts of the lamp (with test cell) has decreased to less than 50%
of the count record of this same lamp when newly installed).
The decision to replace the lamp due to criterium 2 alone is not relevant,
because the signal/noise may be still within instrument specifications.
578
Optical Unit
Photodiodes Assemblies
Two photodiode assemblies (Figure 215) are installed in the optical unit. The
sample diode assembly is located at the right side of the optical unit. The
reference diode assembly is located in the front of the optical unit.
N OT E
Neither, the diodes nor the pre-amplifier boards are interchangeable.
N OT E
Refer to “Replacing Pre-amplifiers or Photodiodes” on page 667 for cleaning.
Figure 215
Photodiode Assemblies
sample diode
reference diode
579
Optical Unit
Filter Assembly
On the 79853C VWD (Figure 216), the Filter Assembly has a three filters [1]
installed and is processor controlled. It can move into four positions:
OPEN
nothing in lightpath at wavelength < 370 nm
CUTOFF
cut off filter in lightpath at wavelength > 370 nm
DARK
0 order calibration filter to reduce the light throughput to the
photodiode during grating calibration at 0 order light
HOLMIUM
holmium filter for grating motor alignment
A photo sensor [3] determines the correct position.
N OT E
Refer to “Replacing Filter Assembly Parts” on page 670 for cleaning.
Figure 216
Filter Assembly
580
Optical Unit
Grating Assembly and Motor
The Grating has 1200 lines/mm and is directly rotated by the Grating Drive
Stepper Motor, depending on the wavelength entry. The whole range
(190...600 nm) is equal to 1238 steps (15.5°). The step angle of the stepper
motor rotation is 3.75° and is reduced to 1/300 by a gear mounted directly to
the motor shaft. The stepper motor is controlled and driven by the Detector
Controller Board (DCB). The stepper motor reference position is determined
by a plate fitted on the motor shaft interrupting a beam of a photo sensor.
The wavelength calibration of the grating is done at the 0 order light position
and at at 656 nm, which is the emission line of the deuterium lamp.
If the motor assembly has to be exchanged it is necessary to do a
compensation of motor tolerances. Refer to “Replacing Grating Assembly
Parts” on page 668.
Figure 217
Grating Asembly
N OT E
The grating is coated with magnesium fluoride. The grating surface should not
be touched or cleaned (see also “Replacing Grating Assembly Parts” on
page 668). This will destroy the surface and reduce the light reflection.
581
Optical Unit
Mirrors
The instrument contains four mirrors (M1, M2, M3, M4). Three of them are
spherical type, one plane. On M2, M3 and M4 the beam height is adjustable.
Mirror M3 and M4 are identical.
N OT E
The mirrors are coated with magnesium fluoride. They should not be touched
or cleaned (see also “Replacing Mirrors, Beamsplitter and Slits” on
page 670). This will destroy the surface and reduce the light reflection.
Slit Assemblies
The instrument has two slit assemblies. The first slit is located at the light
entry into the main optical compartment and focused the light on mirror M3.
The second slit is in front of the reference diode.
Beam Splitter
The beam splitter splits the light beam. One part goes directly to the sample
diode. The reference diode gets the other part. The height of the light beam is
adjustable.
Refer to “Replacing Mirrors, Beamsplitter and Slits” on page 670 for
cleaning.
582
Enhanced Optical Unit (“D”)
In June 1995 this original optical unit was replaced by the enhanced version
“D” to overcome baseline stability problems in unstable environments.
583
584
27
27
VWD: Electronic Information
This chapter gives information about the electronic of the 1050 Variable
Wavelength Detector:
• Overview
• Interconnection Diagram
• Detector Controller Board (DCB)
• Power Supply (DPS-A)
• Keyboard/-electronics
• Pre-amplifier Boards
• Power Supply Connection Board (PSC)
• GPIB Communication Interface
586
Location of Electronic Assemblies
In the 1050 VWD, the following electronic assemblies are available (for item
numbers refer to Figure 218 on page 588):
Table 140
Electronic Assemblies
Item
Description
1 GPIB Interface
Firmware ROM GPIB
2 Fan Assembly (LOW)
3 Fan Assembly (HIGH)
4 Connection Board (PSC)
6 Sample Diode Assembly (SDA)
6 Pre-Amplifier Board SAMP
7 Display Interface Board (KDI)
7 Display Module (VFD)
9 Reference Diode Assembly (RDA)
9 Pre-Amplifier Board REF
10 Controller Board (DCB)
11 Firmware ROM DCB
12 Power Supply Assembly (DPS-A)
587
Figure 218
Location of Electronic
588
Interconnection Diagram
Figure 219
589
Detector Controller Board (DCB)
Repair Level: EPROM and Board
Table 141
Part Numbers for DCB
tem
Part Number
Comment
DCB (Exchange)
79853-69511
for use with PSC -66512
DCB
79853-66511
for use with PSC -66512
DCB
79853-66506 (OBSOLETE) for use with PSC -66509 (OBSOLETE)
Firmware ROM DCB
79853-13005
N OT E
If the DCB board is replaced by 79853-66511 version, the PSC board MUST be
changed to 79853-66512.
Main Functions
The main functions of the Detector Controller Board (DCB) are:
CPU
signal processing
display
analog output
digital input/output
A/D conversion
D/A conversion
control of Optical Unit
deuterium lamp ignition
grating movement
filter movement
leak detector
remote control
590
Figure 220
Block Diagram DCB
591
Digital Section
CPU
A 8-bit 1-chip Microprocessor 7810 is used as CPU. The 7810 includes
256 byte-RAM, 8 channel 8-bit A/D Converter, 16-bit timer/event counter,
2-channel 8-bit timer and two 8-bit I/O Ports. The Data Bus is 8-bit
multiplexed with the address.
ROM/RAM/EEPROM
The ROM contains the firmware of the the detector and can be exchanged
separately. In addition to the built-in functions, the 7810 has 64 Kbyte| of
external memory address and 32 Kbyte-ROM, 8 Kbyte-SRAM and 2
Kbyte-EEPROM are added.
The EEPROM contains:
• the time program;
• the grating calibration constant;
• D/A converter calibration constant;
• parameters set by key input (wavelength, range, response time, mode).
Clock
The main clock (24 MHz) is divided and distributed to:
24 MHz
A/D Converter Count Pulse
12 MHz
CPU Clock
6 MHz
D/A Converter Count Pulse
3 MHz
GPIB Controller, Key/Display
Controller Clock
1.2 KHz
A/D Converter Integration
period
After the power turns on, for about 100 ms the RESET signal is supplied to
CPU, GPIB Controller and Key/Display controller. Also, anytime when power
voltage becomes less than 4.7 V, the RESET signal is generated. The CPU
controls directly the Buzzer and the Stepper Motor Driver to move the filters
on the filter assembly.
The stepper motor for the grating, the input and the output port are
connected to the internal BUS (DATA ADDRESS and CONTROL) and are
controlled by the CPU. The grating motor and the filter motor are driven by a
motor controller IC and phase pattern are coming from CPU.
592
Figure 221
Block Diagram DCB - Digital
593
Analog Sections
Signal Processing
The light beam from the SAMPLE and REFERENCE enters the photodiode
respectively. Its current output is converted into a voltage by pre-amplifier.
The gain of the pre-amplifier can be changed into four stages with CPU
control.
The voltage signal from the pre-amplifiers are multiplexed and converted into
digital form by a 18-bit A/D Converter. The conversion time of A/D Converter
is 25 ms and is performed cyclically in the order of
Zero Sample-Reference
(Zero=GNDA)
Electrically zero calibration is done while balancing.
Digital data is transmitted to the CPU, digitally filtered based on response
time and converted into the absorbance unit using the equation shown
below:
AU = log
10
( REF ) – log
10
( SAMP )
The input voltage range of the integrator is -0.5..+9.5 V.
594
Figure 222
Block Diagram DCB - A/D Conversion
595
A/D Converter
Method for the A/D conversion is feedback type Pulse Width Modulation
(PWM).
Figure 223
A/D Converter
Positive or negative reference voltage is alternately added to the integrator.
Duty cycles of each reference voltage is controlled by the output of a
comparator connected to the output of integrator. Input voltage (U1) is
converted to pulse width so that sum of both reference voltages is balanced
with the U1. Clock voltage and ±ES control this system and determines the
period. The sum of clock voltage in one cycle is set to zero.
Pulse width, which is proportional to input voltage U1, is counted and is
converted into a digital output.
The A/D converter has 18 bits resolution with 25 ms conversion time.
D/A Converter
D/A converter combines a Pulse Width Modulator (PWM) and a 12-bit DAC.
The lower 4 bits of the DAC pulse width modulated with 12 bit resolution is
added to the upper 8 bits of the DAC. The upper 8 bits are also modulated by
fixed pulse width so that the lower 4 bits balances to LSB of the upper 8 bits
(pulse width is 15/16). The lower 4 bits are scaled to each bit of the upper 8
bits when using 44:DAC CALIBRATION. The output of the 12-bit DAC is
passed through a low-pass filter and 20-bit resolution analog signal is
outputted to the BNC Connector. The cutoff frequency of a low-pass filter is
set at 17 Hz while conversion frequency is 183 Hz.
596
Figure 224
D/A Conversion
Signal Output
The signal output is classified into three types: Display Out, Analog Out,
Digital In/Out.
Display Out
The display module receives ASCII codes via Keyboard Interface Board via
the Data Bus. On the Display Module, the ASCII code is converted to display
code and gives output on fluorescent display with 5 x 7 dots and 16
characters.
Signal (Analog) Out
The Signal (Analog) Out is available at a BNC connector at the rear of the
instrument. It is generated by 20-bit D/A converter. The conversion cycle of
the D/A converter is about 5.5 ms. The output of the D/A converter is filtered
by a low-pass filter. The output can be switched to:
Full Scale
Output Impedance
1V
1000 Ohm
0.1 V
100 Ohm
Digital In/Out
The digital signal is delivered to the GPIB Interface (option) via the Data Bus
and is converted into an GPIB signal.
Control of Deuterium
Lamp
The deuterium lamp is ignited using Anode Current, Trigger Voltage and
Heater Voltage supplied from the Power Supply Unit. The ignition
procedures are controlled by the CPU signal. The heater voltage is switched
from 2.5 V during ignition to 0 V after ignition.
597
Control of Grating
Assembly
The wavelength is set by rotating the grating with a 2-phase stepper motor.
The step angle of the stepper motor rotation (1 step angle 3.75°) and is
reduced to 1/300 by a gear. The stepper motor is controlled and driven by
DCB. The CPU contrls the motor controller IC that drives the motor. Stepper
Motor reference position is determined by a plate fitted on the swing arm
interrupting a beam of photo interrupter. The output signal of the photo
interrupter is read by a 8-bit ADC of the CPU.
Control of Filter
Assembly
The rotation of stepper motor controls the insertion of a diffterent filters into
the light path (cutoff, holmium, light reduction).
The stepper motor is controlled and driven by DCB. The CPU controls the
motor controller IC that drives the motor.
Remote Control
The REMOTE connectors communicate start or stop, error and not ready
signal inputs and outputs.
For detailed description of remote control refer to the 1050 Service
Handbook, chapter Common Information.
N OT E
When the 79853C VWD is used in a system which is connected via remote, the
VWD should be switched on as first module. Otherwise it may influence other
modules at power on.
Leak Detection
The leakage from a flow cell is detected by change of Thermal Radiation
Constant of NTC thermistor. Wheatstone bridge is constructed from NTC
thermistor and resistors on the DCB. Its supply voltage is varied by
controlling 24 V-power with Switching Regulator controller. The supply
voltage is controlled to keep the thermistor at about 150 Ohm (150°C)
constantly. If leakage occurs and the thermistor is soaked in the leaked
liquid, the thermal radiation constant are changed and gives higher supply
voltage at both ends of wheatstone bridge. This change is read by the CPU
and compensated with ambient temperature.
Error condition is when LS > LL. The values are visable with
33:LEAK TEST.
598
Figure 225
Block Diagram - Leak Detection
Change in Thermal Radiation Constant with surrounding temperature change
is compensated by second NTC thermistor having same characteristics.
599
Figure 226
Board Layout DCB
Table 142
Test Connector J16
Pin Purpose
Pin Purpose
Pin Purpose
Pin Purpose
Pin Purpose
5
1
Photocurrent 2
REF
Photocurrent 3
SAMP
+15 V
4
-15 V
6
+5 V
A/D Clock
1.2 kHz
Ref Voltage
+10 V
9
Analog GND 10
600
7
8
Digital GND
Repair Level: Fuses and Exchange DPS-A
Table 143
Part Numbers for DPS-A
Item
Part Number
DPS-A (Exchange)
01050-69375
DPS-A (New)
5061-3375
2110-0003
2110-0002
For detailed information on the power supply refer the 1050 Service
Handbook, chapter 1050 Common Information.
Lamp Ignition
always. After ignition a different output voltage is selected depending on the
lamp type used: In the 79853C VWD the heater is switched off after ignition.
601
Keyboard
Keyboard
The flat keys at the front panel is composed of 6 x 4 matrix. Data is read by
scanning at Key/Display Controller on the Keyboard Display Interface Board.
Key entry is checked by reading the status of the controller by the CPU at
every 10 ms. The Key/Display Controller also controls LED lamp lighting.
Figure 227
Keyboard
602
Keyboard
Keyboard Electronics (KDI / VFD)
Repair Level: Board
Table 144
Part Numbers for Keyboard Electronics
Item
Part Number
Keyboard Display Interface (KDI)
79853-66502
Display Module Board (VFD)
79853-66503
Behind the frontpanel two electronic boards are located: Keyboard Interface
Board (KDI) and the Display Module Board (VFD).
Keyboard Display
Interface
The Keyboard Interface Board (KDI) is connected to the DCB board and
contains:
• interface between key-matrix (6 x 4) and DATA bus
• LED driver for the status messages ERROR, NOT READY, LAMP and RUN
• buzzer.
Display Module
The Display Module Board (VFD) is connected to the KDI and contains:
• CPU for control of latch driver
• latch driver for the Vacuum Fluorescence Display (FLD)
• DC/DC converter to provide the voltages for the FLD.
Refer to “Replacing Display Boards” on page 662, when replacing this
board.
603
Keyboard
Figure 228
Block Diagram of Keyboard Electronics
604
Pre-Amplifier Boards
Pre-Amplifier Boards
Repair Level: Board
Table 145
Part Numbers for Pre-Amplifiers
Item
Part Number
Pre-Amplifier Board Sample
79853-66507
Pre-Amplifier Board Reference
79853-66508
Sensor Sample
79853-61109
Sensor Reference
79853-61110
The light (absorbtion) from the deuterium lamp (flow cell) is detected by the
sample and the reference photodiode. Its current is then amplified by the
pre-amplifiers. The signal then is routed to the DCB.
The wires from the photodiodes are soldered onto the board.
Figure 229
Photodiode Assemblies
Sample
Reference
605
Power Supply Connection Board (PSC)
Power Supply Connection Board (PSC)
Repair Level: Board
Table 146
N OT E
Part Numbers for PSC Board
Item
Part Number
PSC Board (for DCB -66511)
79853-66512
PSC Board (for DCB -66506 OBSOLETE)
79853-66509 OBSOLETE
If the DCB board is replaced by 79853-66511 version, the PSC board MUST be
changed to 79853-66512.
This board connects the Power Supply DPS-A with the DCB and the
Deuterium Lamp Assembly. The wires of the lamp cable are soldered in.
Figure 230
Board Layout PSC
606
GPIB Communication Interface
Repair Level: Board, Firmware
Table 147
Part Numbers for GPIB Interface Board
Item
Part Number
GPIB Board (with cable)
79853-68711
GPIB Cable to DCB Board
Firmware ROM GPIB
79853-13004
Parallel Interface
Dual direction transceiver for data bus between master and slave CPU’s. 8 bit
aux code from DCB to GPIB board. 3 bit control code from GPIB board to
DCB
Microprocessor
Single chip microprocessor with 1 Mbyte address capability, 512 byte internal
RAM and 32 I/O ports.
Memories
32 Kbyte of ROM for program memory and 128 Kbyte RAM for the run buffer.
Firmware Description The GPIB board performs all interruption processing from the GPIB
controller. DCB and GPIB board communicate with hardware interrupts.
Receiving GPIB commands the GPIB board passes them to the DCB with 3
bit control code. This control code shows the kind of bus data such as GPIB
commands, error codes or requesting data code and whether the data ended
or not. During run or monitor mode the DCB send chromatogram data
immediately to the GPIB board with 8 bit aux code. This aux code shows the
kind of bus data such as chromatogram data, parameters, time tables, remote
line status or GPIB board control code and whether the data ended or not.
The GPIB board writes the received data into the run buffer. The GPIB sends
out the formatted data adding the start and the end record.
GPIB Address Setting The GPIB address setting is done with a switch (1) at the rear of the GPIB
board. The factory setting is ’10’ (position A).
607
Figure 231
Location of GPIB board
GPIB Firmware Revisions
Refer to “GPIB ROM Firmware Revisions” on page 733 for information on
firmware revisions.
608
28
28
VWD: Diagnostic &
Variable Wavelength Detectors
VWD: Diagnostic &
This section provides information on the
• diagnostic routines
• error messages
• user contol functions
• service control functions
610
VWD: Diagnostic & Troubleshooting Information
Self Diagnosis
Self Diagnosis
At power on and after lamp ignition the instrument checks itself for correct
operation. In case of malfunctions, error messages will inform the operator
on the fault.
During Power On
The following tests are done automatically during power on. They are
descibed on the next pages together with the error message:
• Vaccuum Fluorescent display
• ROM and RAM
• Display
• Leak sensor
• Voltages
• A/D Converter
• EEROM Data
• Grating Drive
During Normal Operation
The following tests are done automatically during normal operation:
• for light intensity
• for filter movement
• for leaks
611
Error messages may come up during the power on state or the normal
operation.
At Power ON
During power on the instrument run automatically through different selftest
routines.
If all test are passed, the display shows HP 1050 VWD.
While initializing the CPU checks the response of the Vaccuum Fluorescent
Display (VFD) module.
If there is no problem, SELF DIAGNOSIS IN PROGRESS is displayed.
If there is no response from the VFD, the ERROR lamp will light, the buzzer is
heard for 2 seconds and is halted.
❏ Check connection DCB/KDI and KDI/VFD module.
❏ Replace VFD Module.
❏ Replace KDI Board.
❏ Replace DCB Board.
❏ Replace DPS.
ROM TEST FAILED
The ROM Test calculates the checksum and compares it with a stored value.
If a differrence is found, ERROR LED lights, ROM TEST FAILED is displayed
and the CPU is halted. Otherwise ROM TEST OK is displayed.
❏ Replace EPROM.
❏ Replace DCB.
RAM TEST FAILED
During RAM Test, firstly every RAM address is uniformly written. Then in
ascending order, each address is tested for contents and then the data is
inverted and written. Then the same procedure is repeated in decending
order with the inverted data. This cycle is repeated twice. If an error is found,
RAM TEST FAILED is displayed and further operation is prohibited.
Otherwise, RAM TEST OK is displayed.
❏ Replace DCB.
612
Display Test
During Display Test every dot on the VFD module is set and you have to
confirm it by yourself. If display is black or shows missing dots
❏ Check connection of flat ribbon cable DCB to KDI.
❏ Replace KDI.
L.SENSOR TROUBLE
The Leak Sensor Test checks the leak sensor and the leak sensor circuit, but
not for a leak resulting from the cell. The voltage applied is measured using
built-in 8 bit ADC (A/D Converter) of the CPU as well as temperature
compensation voltage from a second thermistor.
If the LS > LL, L.SENSOR TROUBLE is displayed.
The range during turn on should be: LS:0.63..4.06 V and LL:2.82..4.00 V.
❏ Use 33:LEAK S.VOLT to verify the values, (see message
LEAK DETECTED.
❏ Check connection of leak sensor to DCB.
❏ Replace leak sensor.
❏ Replace DCB.
POWER FAILURE
During Voltage Test this message is displayed if the voltages exceeds the
tolerance. If a voltage is not correct, it is displayed for a short moment, for
example +24V TROUBLE.
❏ Check voltages using function 34:VOLTAGE TEST:
Table 148
DC Voltages
Voltages
Used for
+ 12 V (±1 V)
filter and grating motor
- 15 V, + 15 V (±1 V)
analog circuits
+ 24 V (± 4.8V)
leak sensor, fans
❏ Replace DCB.
❏ Replace Power Supply.
613
ADC TROUBLE
During the A/D Converter Test the 18 bit ADC for photocurrent acquisition is
tested with multiplexer channel fixed at analog ground. Pulse count for
ground input is measured 20 times and calculate the average and the
fluctuations. If the value exceeds the pre-determined value ADC TROUBLE is
displayed.
❏ Replace DCB.
EEROM DATA LOST
During EEROM Data Test various parameters such as monochrometer
parameter and time table are stored in EEROM (Electrically Erasable Read
Only Memory) in order to save the value in absence of power. At initializing
those values are checked using checksum. If an error is found,
EEROM DATA LOST is displayed and default values are set.
Different types of EEROM DATA LOST messages are possible:
EEROM DATA LOST0
The key settable parameters (wavelength, responsetime, and so on) or time
time tables are lost. They are replaced by default values.
❏ Re-enter the values.
❏ Replace DCB.
EEROM DATA LOST1
Wavelength parameter (zero order) are lost. They are replaced by default
values. The monochromater parameters are differrent for each instrument.
❏ Execute 20:0th CALIB. or enter the 0th order parameter directly using
31:SET WL PARAM.
❏ Execute 45:WL COMPENSATE.
EEROM DATA LOST2
The DAC parameters are lost. The parameters are the scaling factors for each
DAC bit and ZERO SPAN factors. The lost parameters are recoverable.
❏ Execute 44:DAC CALIB.
EEROM DATA LOST3
The DAC parameters are lost. The parameters are the offset parameter of the
ADC reading for the output of each DAC bit (used for DAC calibration).
N OT E
These parameters can be re-written at the factory only.
❏ Perform 41:DAC TEST.
If OK, then leave it as it is.
If NOT OK, then continue.
614
❏ Perform 44:DAC CALIB. The default values of the offset parameters are
taken now.
❏ Perform 41:DAC TEST.
If OK, then leave it as it is.
If NOT OK, then replace DCB board.
WL SET TROUBLE
During the initialization of the grating motor position, the motor moves
backward to the home position where position sensor detects the limit. If it is
not able to detect the limit, WL SET TROUBLE is displayed.
❏ Check connection of position sensor and grating drive motor.
❏ Switch OFF lamp, remove top cover of optical unit to observe movement
of grating mirror (changing wavelength).
If grating will not rotate after changing the wavelength, replace DCB or
the Grating Driver Assy.
❏ Using 36:GRATING P.S. you can move the grating shaft automatically
or stepwise by pressing the down/up key. Normally in the position of about
-200 steps, the output voltage of the position sensor will change from LOW
to HIGH, detecting the limit position. If the output voltage will never
change, the position sensor is defective or the grating drive assembly has
a problem and has to be replaced.
615
Error Messages After Lamp Ignition
Error Messages After Lamp Ignition
LAMP ERROR
❏ Check connections of lamp connector, PSC board and DPS to DCB.
❏ Replace lamp, DPS, DCB.
LOW ILLUMINATION
Light intensity of deuterium lamp is checked after lamp ignition at the
wavelength of 250 nm. If the reference voltage at 250 nm is < 0.6 V, the
detector will check the reference voltage at 500 nm and if < 0.12 V,
LOW ILLUMINATION will be displayed. In this case the detector will never
return to the original wavelength. It will remain at 500 nm.
This test is skipped if WL SET TROUBLE is displayed and unable to set the
wavelength.
❏ Check the lamp image on the entrance slit.
If the image does not cover the slit properly, adjust mirror M1.
❏ Check connection to pre-amplifiers.
❏ Replace the lamp for deterioration of lamp.
❏ Replace the mirrors M1 and M2 for deterioration of mirrors.
FILTER ERROR
During Filter Test the second order light cutoff filter is tested by inserting it
at the wavelength of > 370 nm and measuring the change of light intensity. If
an error is found FILTER ERROR is displayed.
This message comes up if
• The reference current at 220 nm is more than 2.00 and at 500 nm more than
1/16 of the value at 220 nm. Then the filter is always off.
• The photocurrent at 220 nm is less than 2.00 and at 500 nm more than 0.04.
Then the filter is always ON.
• The reference light beam is focussed far from the reference diode.
❏ Flow cell should be clean and bubble free.
❏ Check connection of filter motor.
❏ Check correct operation of filter with 39:FILTER TEST and photo sensor
of filter with 37:FILTER P.S.
❏ Check beam splitter alignment.
616
Error Messages During Normal Operation
LEAK DETECTED
❏ Enter service mode function 33:LEAK S. VOLT and check leak sensor
voltages.
Error condition is when LS > LL. The normal range should be:
Table 149
Working Ranges for LS and LL
LS signal
LL signal
2.35..2.85 V
2.95..3.45 V
❏ If there is no leakage, check the connection leak sensor to DCB.
❏ Replace Leak Detector board.
❏ Replace Leak Sensor.
DATA UNDERFLOW
This message may come up only during BALANCING when the sample or
referrence voltage is lower than 1 mV.
❏ Check, whether the flow cell is in correct position and the screws are
tightened.
❏ Check the connection of pre-amplifier sample to DCB.
❏ Clean cell windows.
❏ Replace photo diode assembly.
❏ Replace DCB.
DATA OVERFLOW
This message may come up only during BALANCING when the sample or
referrence voltage exceeds 9.4 V.
Check, whether the flow cell is in correct position and the screws are
tightened.
Replace DCB.
617
ADC OVERFLOW
❏ Execute BALANCE, so that the proper pre-amplifier gain is selected.
❏ Check, whether the flow cell is in correct position and the screws are
tightened.
❏ Is apature gasket installed in flow cell?
❏ Replace DCB.
No response for HPIB ❏ set address switch correct.
❏ check connection to DCB and GPIB cable.
❏ change GPIB board.
618
Error Messages During Use of Control Functions
Error Messages During Use of Control
Functions
CALIB FAILURE
• When using 20:0th CALIB. this message may come up because the
lamp is turned OFF or to much light reaches the sample diode.
❏ Turn On the lamp.
❏ Reduce light to sample diode.
• When using 21:WL CALIBRATION this message may come up under the
following reasons:
If during scan the measured voltage of each step
is the same (Figure 232-a), or
is on an upslope (Figure 232-b) or
is on a downslope (Figure 232-c).
❏ Use other wavelength setting to get a different range,
31:SET WL PARAM.
❏ Recalibrate grating with 21:WL CALIBRATION.
Figure 232
Calibration Failure
619
User Control Functions
These functions are accessable for every instrument user. They are used for
parameter settings and special operating functions during normal work.
Table 150
#
Display
Used for
1
1:SAMPLE SCAN
takes a sample scan
2
2:REF. SCAN
takes a reference scan
3
3:SPECTRUM OUT
plots the spectrum
4
4:SCAN FROM
defines scan range from
5
5:SCAN TO
defines scan range to
6
6:ZERO OFFSET
zero offset in %
7
7:RESPONSETIME
choices 0.25, 1 and 4 s
8
8:AUTO LAMPOFF
automatic lamp off
9
9:AUTO LAMP ON
automatic lamp on
10
10:OUTP. DEVICE
integrator or recorder
11
11:OUTPUT VOLT
1 V or 100 mV
12
12:STATUS
FW revision, errors or status
13
13:START MODE
local, remote, hpsystem
14
14:OUTPUT CHECK
checks the output voltage
15
15:RESET
reset to default
16
16:PHOTOCURRENT
sample and reference diode’s current
17
17:PARAM. LOCK
locks certain parameters
18
18:WL SHIFT
WL change on display
19
19:POLARITY
polarity of signal (analog/GPIB)
20
20:0th CALIB.
0th order calibration
620
Table 150
#
Display
Used for
21
21:WL CALIBRATION
656 nm calibration
22
22:HOLMIUMCHECK
WL Calibration check
Functions 1 to 21 are described in detail in the User Documentation.
621
Service Control Functions
N OT E
These functions are secured by a PASSWORD, because they are normally used
by trained Service Engineers. Misuse of certain function may result in a
misalignment of the optical path or electronical values.
If the VWD is in service mode, the ERROR status lamp blinks.
If the instrument enters into this mode accidentally, the easiest way to abort
from this mode is: TURN OFF the power off the instrument.
Entering the Service Mode
1 Press [CTRL] [3] [0] [ENTER]
2 {30:SERVICE MODE} [ENTER]
3 {Pass Word} [1] [0] [5] [0] [ENTER]
This control function is the entry point for all service control functions. You
can enter service control function only through this control function. Select
your desired control function using [DOWN] or [UP]. Once you abort from this
mode, you have to execute this function again. However if power has not
switched off since last entry, you can skip password by just pressing
[ENTER].
It is adviced that you will turn-off the power, after you finished using service
control functions to avoid the accidental entry to service control mode.
In Table 151 on page 623 all service related functions are listed. Due to
different firmware versions and improvements on 79853C VWD, the order of
the functions is different.
622
The functions 20, 21 and 22 are part of the User Functions, but they are
described in this section.
Table 151
C A UT I O N
#
Display
Used for
20
20:0th CALIB.
Zero Order calibration
21
21:WL CALIBRATION
656 nm calibration
22
22:HOLMIUMCHECK
Wavelength Calibration check
31
31:SET WL PARAM.
Parameter Set for Zero Order and 656 nm
32
32:FIX SIGNAL
Fixed voltage to sample or reference path
33
33:LEAK S. VOLT
Shows leak sensor voltages
34
34:VOLTAGE TEST
Shows DC Voltages
35
35:ADC NOISE
Check of ADC noise
36
36:GRATING P.S.
Check of Grating Sensor
37
37:FILTER P.S.
Check of Filter Sensor
38
38:REMOTE TEST
Check of Remote lines-
39
39:FILTER CHECK
Checks movement of Filter
40
40:0TH TEST OFF
Positions the Zero Order Beam
41
41:DAC TEST
Checks DAC
42
42:PREAMP GAIN
Checks linearity of gains
43
43:EEROM TEST
Checks EEROM data
44
44:DAC CALIB .
Calibrates the DAC
45
45:WL COMPENSATE
Compensates non-lineraties of grating
Important parameters might be lost. DO NOT use control functions 31 through
45 until you have read this paragraph and fully understand the functions and
result of operation. Some functions may change the monochrometer
parameters and misuse of these functions leads to inaccurate wavelength
setting.
623
Zero Order Calibration
20:0th CALIB.
This control function is used for the electrical calibration of the zero order
beam of the monochrometer. The step number corresponds to the number in
31:SET WL PARAM.
The grating is driven by the stepper motor through steps 150 to 250 searching
for a maximum. The step number with the maximum voltage is displayed,
and if accepted, written into the EEROM.
The intensity of the zero order light is reduced by inserting a filter in the
calibration position automatically.
Prior to the use of this function, the grating assembly should be pre-aligned
on the zero order light, using control function 40:0TH TEST OFF.
Table 152
Control Function: Zero Order Calibration
Key Operation
ENTER
Display
Description
20:0th CALIB.
Select function.
nn step CHANGE?
display current parameter or
change to 200.
ENTER or
to continue calibration or
CLEAR
to abort.
wait appr. 20 seconds.
nn step x.xxxV
starts the calibration scan
from 150 step to 250step
No key entry is allowed here.
Possible error message at this
point may be:
624
CALIB. FAILURE
Indicates that the lamp is
OFF.
DATA OVERFLOW
Indicates that too much light
reaches the sample photo
diode. Reduce light and insert
paper between cell and
sample diode
Table 152
Control Function: Zero Order Calibration
Key Operation
Display
Description
DATA UNDERFLOW
Indicates that not enough
light reaches the sample
photo diode. Check light path.
The next line will be shown, if
no error message occured.
ENTER
nn step y.yyyV
Displays the step that gave
the maximum light intensity.
nnn step OK ?
Promps for confirmation, to
change the parameter.
ENTER
Takes the displayed step
number.
CLEAR
Rejects the displayed step
number.
ENTER
nnn step
New parameter is written in
EEROM and monochrometer
is reset with new parameter.
20:0th CALIB.
End of Zero order beam
calibration. You may repeat
the procedure again.
625
Wavelength Calibration
21:WL CALIBRATION
This control function is used for the calibration of the monochrometer using
the 656 nm line emission from the deuterium lamp. The step number
appeared in this control function is the number of steps of stepper motor
from the 0 order beam to the 656 nm emission line. Maximum light intensity
is searched between ±50 steps of 656 nm value. If the maximum peak is
found, the step number is written into EEROM and corresponds to the value
in 31:SET WL PARAM.
Table 153
Control Function: WL Calibration
Key Operation
ENTER
Display
Description
21:WL CALIBRATION
Select function.
656nm xxxx step
Displays the wavelength for
calibration and steps based
on present PARAM.WL 656.
ENTER or
To continue calibration or
CLEAR
to abort.
Wait appr. 30 seconds.
xxxxstep y.yyyV
Starts the calibration scan
from 656 nm ±50 steps and
seeks for maximum light
intensity.
No key entry is allowed here.
Possible error message at this
point may be:
CALIB. FAILURE
Indicates that there was no
maximum found (see “CALIB
FAILURE” on page 619).
DATA UNDERFLOW
Indicates that not enough
light reaches the sample
photodiode (<30 mV).
The next line will be shown, if
no error message occured.
626
Table 153
Control Function: WL Calibration
Key Operation
Display
Description
xxxxstep y.yyyV
Displays the step that gave
the maximum light intensity.
ENTER
656nm xxxx step
Displays the wavelength and
step that gave the maximum
light intensity.
after 2 seconds
656nm xxxxstep
Displays the new parameter
at 546 nm and prompts the
confirmation.
ENTER
Takes the displayed step
number.
CLEAR
Rejects the displayed step
ENTER
656 yyyystepOK
New parameter is written in
EEROM and monochrometer
is reset with new parameter.
after 2 seconds
21:WL CALIBRATION
End of calibration. You can
repeat the procedure again.
627
Wavelength Calibration Check
22:HOLMIUMCHECK
This control function is used for the automatic check of the instruments WL
calibrations using the some specific lines on the Holmium oxide filter which
is moved into the light path.
Table 154
Control Function: HOLMIUMCHECK
Key Operation
ENTER
Display
Description
22:HOLMIUMCHECK
Select function.
CHECK?
CLEAR
to leave function.
ENTER
to start the calibration check.
360.8nm
automatic verification
418.5nm
536.4nm
HOLMIUM CHECK OK
if within specification
CLEAR
to leave function.
DOWN
360.8nm 360.7nm
displays measured value
DOWN
418.5nm 418.4nm
DOWN
536.4nm 536.4nm
CLEAR
22:HOLMIUMCHECK
to leave function.
If this test was not successful, perform 20:0th CALIB. and
21:WL CALIBRATION.
628
SET WL Parameter
31:SET WL PARAM.
This control function is used for the confirmation of monochrometer
parameters or for changing them directly. PARM.WL0 is the number of steps
of stepper motor from the position sensor, while PARM.WL656 is the number
of steps from 0 order beam. As these values changes slightly from instrument
to instrument, they are originally calibrated and written into EEROM.
The parameter 360.8 nm, 418.5 nm, 486 nm and 536.4 nm cannot be changed.
These four parameters set with 45:COMPENSATE are used to compensate
non-linearity of the grating drive.
If PARM.WL656 is changed, these four parameters are automatically shifted.
Table 155
Control Function: SET WL PARAM.
Key Operation
ENTER
Display
Description
31:SET WL PARAM.
Select function.
Parm.WL0 200
Displays the 0 order light
parameter (same
value found with
20:0th CALIB. .
UP
Select the parameter WL656
nm.
Parm. 656yyyy
Displays the step number at
656 nm (same value found
with 21:WL CALIBRATION.
Enter the parameter using
numeric keys.
UP
Parm.360.8yyyy
360.8 nm.
UP
Parm.418.5yyyy
418.5 nm.
UP
Parm. 486 yyyy
486 nm.
UP
Parm.536.4yyyy
536.4 nm.
629
Table 155
Control Function: SET WL PARAM.
Key Operation
Display
Description
ENTER
31:SET WL PARAM.
Control function is displayed
again.
CLEAR
On WL0 or WL656 parameter,
reenters the displyed value.
In order to change both parameters you have to repeat the above procedure
for both wavelengths.
630
Fix Signal
32:FIX SIGNAL
If the 1050 VWD shows noise or drift problems, this function can help to
isolate the cause. The reference or the sample diode can be set to an fixed
electrical value to remove influences from the light path.
This function can also be used to retrieve the instrument profile of the
instrument.
Table 156
Control Function: FIX SIGNAL
Key Operation
ENTER
Display
Description
32:FIX SIGNAL
Select function.
REF. CH. FIXED
The photocurrent of reference
photo diode is a fixed
electrical value.
DOWN or UP
ENTER
N OT E
Select the parameter.
NORMAL-NOT FIXED
Return to normal condition
(neither photocurrrent is
fixed.)
SMP. CH. FIXED
The photocurrent of sample
photo diode is a fixed value.
32:FIX SIGNAL
Control function is displayed
again.
If either channel is fixed, the ERROR status lamp is blinking even after
returning to analysis mode from service control mode. This is an alarm to
show that the instrument is abnormal condition. You can return to normal
condition by executing NORMAL-NOT FIXED or switching off the power.
631
Use of FIX SIGNAL
Use this function for
❏ checking the noise of both sides separately;
❏ taking the instrument profile of both sides separately.
With fixed signal, either the reference or the sample side is supplied with a
constant current. So influences from the lamp effects only that side which is
not fixed. Influence due to a drifting or defective photo diode effects both, a
scan and the signal (noise). Small wavelength variations between fixed
sample and reference scans are caused by the characteristics of the photo
diodes.
Noise with Reference Signal Fixed: If the noise is large, the problem may
be caused by light path, flow cell or sample diode/pre-amplifier.
Noise with Sample Signal Fixed: If the noise is large, the problem may be
caused by light path, lamp or reference diode/pre-amplifier.
To take an instrument profile proceed as follows:
❏ Enter 32:FIX SIGNAL and set SMP. CH. FIXED .
❏ Press [ENTER] and leave function.
❏ Press [BALANCE].
❏ Take a reference scan 2:REF SCAN .
❏ Take a sample scan 1:SAMPLE SCAN .
❏ Set integrator to ATTN9, CS10 and Zero10%.
❏ Press [BALANCE].
❏ Enter 3:SPECTRUM OUT , press [ENTER] [ENTER].
❏ Start plot on integrator and press [ENTER]. The intensity profile is now
plotted on the integrator.
❏ Perform above steps with REF. CH. FIXED to check the light through
put of the cell. Figure 233 on page 633 shows both plots.
632
Figure 233
Example of Intensity Profiles
633
Leak Sensor Voltage
33:LEAK S.VOLT
You can check the leak sensor with this contol function in case of trouble.
Table 157
Control Function: Leak Sensor Voltage
Key Operation
Display
Description
33:LEAK S.VOLT
Select function.
ENTER
LS:2.70 LL:3.30
Displays LS (Leak Sensor
Voltage) and LL (Temperature
compensation voltage).
Error condition is when
LS > LL.
The normal ranges are:
LS signal 2.35..2.85 V,
LL signal 2.95..3.45 V
CLEAR
33:LEAK S.VOLT
Leaves function.
634
Voltage Test
34:VOLTAGE TEST
You can check some (but not all) voltages with this contol function.
Table 158
Control Function: Voltage Test
Key Operation
Table 159
Display
Description
34:VOLTAGE TEST
Select function.
ENTER
15.0 22.9
Displays first set of voltages.
DOWN or UP
12.1 -15.0
Displays second set of
voltages.
CLEAR
34:VOLTAGE TEST
Leaves function.
DC Voltages
Voltages
Used for
+ 12 V (±1 V)
filter and grating motor
- 15 V, + 15 V (±1 V)
analog circuits
+ 24 V (± 4.8V)
leak sensor, fans
635
ADC Noise
35:ADC NOISE
The output signal of the ADC noise corresponds to 196 AD counts at the
Analog Output with 1 V full scale setting. The ADC noise must be within
±10 counts (±50 mV) over a time of 10 minutes (Figure 234).
Table 160
Control Function: ADC Noise
Key Operation
Figure 234
Display
Description
35:ADC NOISE
Select function.
ENTER
TESTING ADC
ADC noise is outputted.
Start plotter in ATTN 7,
ZERO 50, Chartspeed 1 (on
HP 339X)
CLEAR
35:ADC NOISE
Leaves function.
ADC Noise
636
Grating Photo Sensor
36:GRATING P.S.
This control function can be used to check the function of the photo sensor
and the drive mechanism of the grating. The movement of the grating can be
done automatically or step for step. It will provide the step number and the
voltage of photo sensor which detects the backward limit when the drive
mechanism moves into the photo sensor. The photo sensor voltage exceeds
3 V when the photo sensor reaches at backward limit position.
A normal step value for change from LOW to HIGH is around -200 steps.
Table 161
Control Function: Grating Photo Sensor
Key Operation
Display
Description
36:GRATING P.S.
Select function.
ENTER
STPxxx PS0.11
Present step of stepper motor
and photo sensor voltage is
displayed.
DOWN or UP
STPxxx PSy.yy
You can move the stepper
motor and observe the
voltage.
ENTER
STP-nnn PS3.90
Starts automatically the
search for the home position
and displays the step number
(nnn) and the corresponding
voltage.
CLEAR
36:GRATING P.S.
Leaves function.
637
Filter Photo Sensor
37:FILTER P.S.
This control function can be used to check the function of the photosensor
and the filter motor. The movement is done step for step. It will provide the
step number and the voltage of photo sensor when the drive mechanism
moves into the photo sensor.
Table 162
Control Function: Filter Photo Sensor
Key Operation
Display
Description
37:FILTER P.S.
Select function.
ENTER
STP0 PS4.98
Move to home position and
shows steps and photo
sensor voltage.
DOWN or UP
STPxxx PSy.yy
You can move the stepper
motor and observe the
voltage. When the motor
leaves the photo sensor, then
PS changes to 0.01.
CLEAR
37:FILTER P.S.
Leaves function.
Pressing
UP once
rotates the filter 1 step (7.5°) to the left.
DOWN once
rotates the filter 1 step (7.5° to the right.
638
Remote Test
38:REMOTE TEST
This control function is to test the remote control line. Disconnect the
remote cables to avoid interferrence to and from other instruments.
Remote lines tested are: START, SHUT DOWN, POWER DOWN, READY and
STOP. PREPARE and START REQUEST are not tested.
Table 163
Control Function: REMOTE Test
Key Operation
Display
Description
38:REMOTE TEST
Select function.
ENTER
Disconnect REMOTE Cable and Press START
START
REMOTE LINE TEST
The REMOTE LINE TEST
starts.
REMOTE LINE OK
When test is passed.
REMOTE FAILURE
There’s a trouble.
38:REMOTE TEST
Leaves function.
CLEAR
639
Filter Check
39:FILTER CHECK
This control function is used to check the motion of second order cutoff
filter. The cutoff filter returns to original position at the end of this control
function.
Table 164
Control Function: Filter Test
Key Operation
Display
Description
39:FILTER CHECK
Select function.
ENTER
CUT FILTER OFF
Displays present filter status.
DOWN or UP
CUT FILTER ON
Cutoff Filter moves in or out.
CLEAR
39:FILTER CHECK
Leaves function.
640
Zero Order Test
40:0TH TEST OFF
This control function is used to move the stepper motor into the zero order
position and has to be performed during the alignment of the grating.
Table 165
Control Function: Zero Order Test
Key Operation
Display
Description
40:0TH TEST OFF
Select function.
The test is still off and the
grating is on set parameter
wavelength.
ENTER
0th STEP NOnnn
Take the number of steps
from 31:SET WL PARM. ,
(default) or use 200 steps.
ENTER
0TH TEST ON
The stepper motor is moved
to zero order position.
CLEAR
40:0TH TEST OFF
Leaves function and grating is
turned to set wavelength.
641
DAC Test
41:DAC TEST
This control function is used to check the D/A converter by setting different
bits. An AC voltage is added to the DC output and should be < 0.8 x 10-5 AU.
Table 166
Control Function: DAC Test
Key Operation
Table 167
Display
Description
41:DAC TEST
Select function.
ENTER
TESTING BIT 0
Bit 0 is tested.
UP
TESTING BIT 1
Bit 1 is tested.
UP
TESTING BIT 2
Bit 2 is tested.
UP
TESTING BIT 3
Bit 3 is tested.
UP
TESTING BIT 4
Bit 4 is tested.
UP
TESTING BIT 5
Bit 5 is tested.
UP
TESTING BIT 6
Bit 6 is tested.
UP
TESTING BIT 7
Bit 7 is tested.
CLEAR
41:DAC TEST
Leaves function.
DAC DC Values
Bit
mV
Decription
0
27
1
32
jump of 5 mV
2
42
jump of 10 mV
3
62
jump of 20 mV
4
104
jump of 40 mV
5
22
GND plus offset voltage
6
185
jump of 80 mV
7
511
about half of maximum output voltage
If you do not see a linear response, replace the DCB board.
642
An AC voltage is added to the DC output and should be < 0.8 x 10-5 AU.
Figure 235
DAC Test Bit 0 (AC)
Figure 236
DAC Test Bit 7 (AC)
If one or more tested bits are out of limit, then perform 44:DAC CALIB.
643
Pre-amplifier Gain
42:PREAMP GAIN
This control function allows the check of gain switching on the DCB.
The gain can be switched to 1, 2, 4 and 8.
Table 168
Control Function: Pre-Amplifier Gain
Key Operation
Display
Description
Change wavelength to 500
nm to reduce intensity of
light.
42:PREAMP GAIN
Select function.
ENTER
G1 R0.115 S0.045
Shows the photocurrent of
reference and sample side
with gain 1.
DOWN
G2 R0.227 S0.089
with gain 2.
DOWN
G4 R0.455 S0.179
with gain 4.
DOWN
G8 R0.914 S0.358
with gain 8.
The displayed values should
double each time.
If not, change wavelength to
500 nm or change DCB.
CLEAR
42:PREAMP GAIN
Leaves function.
644
EEROM Test
43:EEROM TEST
This control function checks the EEROM and is used as factory test.
Table 169
Control Function: EEROM Test
Key Operation
ENTER
CLEAR
Display
Description
43:EEROM TEST
Select function.
EEROM TEST******
The blinking * indicates the
checked section.
EEROM TEST OK
Test was successful. If test
failes, replace DCB.
43:EEROM TEST
Leaves function.
645
DAC Calibration
44:DAC CALIB.
This control function does a scaling between lower 12 bits and upper 8 bits of
DAC and an automatic recalibration of the DAC internal voltages. It should
be performed when the noise is higher than expected and a DAC
non-linearity is found. The test runs automatically.
The initial calibration is done at the factory.
The lamp can be off, but the instrument should be on for some time for
stabilizing the instrument to reduce drift.
Table 170
Control Function: DAC Calibration
Key Operation
Display
Description
44:DAC CALIB.
Select function.
ENTER
Disconnect SIGNAL Cable
and Press START
START
DAC SCALING
Scaling starts.
SCALING 0
Step 0 of 7 is displayed.
f0 yyyy
pre-scaling done for step 0.
Now you steps 1 to 7 are
done.
ENTER
CLEAR
646
DAC CALIB. OK
Calibration was successful.
44:DAC CALIB.
Takes new factors and leaves
function.
DAC CALIB.FAILED
Calibration was not
successful.
44:DAC CALIB.
Keeps previous factors when
calibratio failed and leaves
function.
Wavelength Compensation
45:WL COMPENSATE
This control function is used to compensate non-lineratity of the grating
drive.
N OT E
If the grating motor or the grating has been replaced or moved, this function
MUST be executed.
During this test, the flow cell should be empty (no windows) or clean filled
with water or methanol (no air bubbles). Absorption in the flow cell causes
an error.
• First step is to search for the 656 nm line emission of the deuterium lamp
within a window of ±50 steps.
• Then the processor sets the ideal (linear) steps for four interpolative
points, 360.8 nm, 418.5 nm, 486 nm and 536.4 nm.
360.8 nm and 418.5 nm are absorption points of the holmium oxide
spectra. 536.4 nm is a line emission from the deuterium lamp.
• Next, it scans each ideal interpolative point (±25 steps) as reference.
• Then the holmium oxide filter is inserted and it scans again for the three
absorption points of holmium oxide spectra (±25 steps).
• If all found values are in limit, then the parameters are written into EEROM
(visable with 31:SET WL PARAM.).
Table 171
Control Function: WL Compenstation
Key Operation
ENTER
Display
Description
45:WL COMPENSATE
Select function.
PARAM. CHANGE ?
ENTER
to continue calibration
CLEAR
to abort calibration
XXXstep y.yyyV
displays steps and voltage
during calibration
CALIB. FINISHED
new parameter, written into
EEROM.
647
Table 171
Control Function: WL Compenstation
Key Operation
Display
Description
ENTER
45:WL COMPENSATE
Takes new factors and leaves
function.
WL CALIB. FAILURE
one or more peaks could not
be found with ±25 steps.
Parameters are set to
previous values.
45:WL COMPENSATE
Keeps previous factors when
calibration failed and leaves
function.
CLEAR
648
29
29
VWD: Maintenance Information
service and maintenance of the 1050 Variable
N OT E
Warnings
WA R N I N G
Dangerous voltage is present in the cabinet, though it is covered and
insulated. DO NOT TOUCH PARTS unless they are specified in the
procedure.
Be careful when you have to work in the optical unit. The lamp housing
is hot.
Be sure to wear a pair of safety or sun glasses. Since the deuterium
lamp emits intensive ultraviolet light, it is dangerous to perform
optical alignment without eye protection. Be careful not to expose
your eyes directly to the light coming from the lamp.
650
Securing for Transport
Figure 237
651
If the Deuterium lamp no longer ignites or the lamp emission has become too
low and noisy, the lamp has to be replaced.
The deuterium lamp is exchangeable by the user. No adjustment is necessary.
For accurate wavelength setting excute user control function
20:0th CALIB. and 21:WLCalibration after exchanging the lamp.
Step 1: Replacement
❏ Turn the lamp off.
❏ Loosen the two screws at the rear of the instrument which fix the cover
and remove them.
❏ Unplug the lamp and remove it.
❏ Exchange the lamp (no adjustment is required).
❏ Reconnect the lamp.
❏ Replace top cover.
❏ Turn the lamp on.
652
Step 2: 0th Order Calibration
The instrument scans for the maximum of the zero-order light.
During 0th order calibration a filter for reducing light intensity to prevent
ADC data overflow will be inserted automatically.
Select control function 20:0th CALIB.
[ENTER]
enters function
200step CHANGE?
displays the current parameter
[ENTER] or [CLEAR]
to continue or to abort
150step 0.000V
instrument scans now for maximum from step
150 to 250
201step X.XXXV
maximum when calibration successfully
finished, press [ENTER]
201 step OK ?
press [ENTER] to keep the new value and to
leave function
If CALIB. FAILURE occurs, press [CLEAR] to keep the old value and to
leave function.
653
Step 3: WL CALIBRATION
The instrument scans for maximum light intensity of 656 nm line spectrum of
deuterium lamp.
Enter control function 21:WL CALIBRATION.
[ENTER]
enters function
656nm 1900step
displays the current parameter.
[ENTER] or [CLEAR]
to continue or to abort
1875step 0.000V
the instrument scans now for for maximum for
100 steps
1902step X.XXXV
maximum when calibration successfully
finished, press [ENTER]
656 1902stepOK?
press [ENTER] to keep the new value and to
leave function.
If CALIB. FAILURE occurs, press [CLEAR] to keep the old value and to
leave function.
654
To replace or clean certain parts of the flow cell you should have a clean
working area.
Refer to “Standard Flow Cell “C” (SST/Ti)” on page 693 and the following
pages for detailed flow cell schematics.
Flow Cell Maintenance Kits
There are several maintenance kits available with replacement parts for the
flow cells.
For details see“Standard Flow Cell “C” (SST/Ti)” on page 693 and the
following pages.
Replacing Cell Parts
For the detailed procedures refer to the Operating Manual.
❏ Remove flow cell.
❏ Unscrew the cell screw using a 6 mm hexagon wrench, see Figure 238 on
page 656, item 1.
❏ Remove inner parts carefully and place them in the correct order in front
of you.
❏ Replace window, gaskets or other parts as needed.
N OT E
Once a gasket has been compressed or spoiled on the surface, DO NOT use it
again. A used gasket may cause leakage.
❏ Insert all parts in the correct order.
❏ Tighten the cell screw.
❏ Perform a “Leak Test” on page 657.
655
Figure 238
Standard Flow Cell
Flushing Procedure
Cleaning the cell (by using a glass syringe!)
❏ Flush with iso-Propanol.
❏ Flush with bidistilled water.
❏ Flush with nitric acid : water (5 : 95).
❏ Flush with bidistilled water.
❏ Flush with iso-Propanol
C A UT I O N
This concentration of nitric acide is dangerous and proper attention to safety
should be given. Also, the nitric acid flushing procedure is not a certain cure
for a dirty cell. It is to be used as a last attempt to salvage the cell before
certain cell parts have to be replaced.
656
Leak Test
Remove the flow cell and connect the outlet tubing of the flow cell directly to
the pump. Then flow an appropriate solvent (for example Isopropanol) at
10 ml/min. After several minutes check the cell visually. If it is necessary to
check it for higher pressure, put an appropriate stainless steel tubing which
can build up a back-pressure.
C A UT I O N
DO NOT apply higher back pressure to the flow cell than maximum pressure
of the flow cell.
Table 172
Pressure Rating on Flow Cells
Type
Standard Flow Cell
Ultra High-Pressure Cell
Pressure
40 bar
400 bar
Preparative Flow Cell
40 bar
Semi-Micro Flow Cell
40 bar
657
Using the Cuvette Holder
When required:
If your own standard should be used to checkout the instrument.
Tools required:
None
Parts required:
Cuvette Holder 79853-60016
Cuvette with the “standard”, e.g. NIST certified holmium oxide sample
This cuvette holder can be placed instead of a flow cell in the variable
wavelength detector. Standard cuvettes with standards in it, for example,
National Institute of Standards & Technology (NIST) holmium oxide solution
standard, can be fixed in it.
This can be used for wavelength verifications.
Figure 239
Cuvette Holder
658
Preparation for this procedure are:
1 Locate the cuvette holder on the desk.
❏ Remove the normal flow cell.
❏ Install the cuvette holder in the instrument
and perform a wavelength calibration.
❏ Have cuvette with standard available.
2 Unscrew the bracket.
3 Insert the cuvette with the sample into the
holder.
Light path
Clear side
659
4 Replace the bracket and fix the cuvette.
5 Install the cuvette holder in the instrument.
6 Perform your verification.
660
When performing one of these tasks, take care for electrostatic discharge
protection to keep the electronics alive.
DCB Board
❏ Note the parameters from 31:SET WL PARAM.
❏ Disconnect the power from the instrument.
❏ Remove main cover and disconnect all connectors from DCB.
❏ Replace DCB after loosening the 3 fixing screws.
❏ Fix all screws and reconnect all connectors to the DCB.
❏ Carefully remove the firmware ROM from removed DCB and insert it on
new DCB.
❏ Replace main cover and turn the instrument ON.
❏ Turn lamp on and wait some minutes to stabilize the lamp.
❏ Perform functions 20:0th CALIB., 21:WL CALIBRATION,
44:DAC CALIB. and 45:COMPENSATE to input the detector specific
parameters into the EEROM.
DCB Firmware
❏ Disconnect the power from the instrument.
❏ Remove main cover.
❏ Carefully replace the firmware ROM.
❏ Replace main cover and turn the instrument ON.
❏ Turn lamp on and wait some minutes to stabilize the lamp.
661
Replacing Display Boards
Replacing Display Boards
❏ Remove front panel assembly and disconnect cables between front panel
and DCB.
❏ Unscrew the six screws which hold the plastic part at the metal frame
(except the two screws that fix the leak assembly).
❏ Disconnect the grounding cable and the cable between the two display
boards.
❏ Replace the defective board.
❏ To loosen the flat cable [3] from the keyboard, press a flat screwdriver
onto the two noses on each side of the connector [1] to release the upper
part [2] of the connector.
Figure 240
Release of connector
662
Replacing the Leak Interface
❏ Remove the flow cell.
❏ Disconnect leak cable from DCB and the flat ribbon cable from DCB to
keyboard at the KDI board.
❏ Unscrew the screws that fix the front panel.
❏ Remove front panel.
❏ Replace sensor board or complete assembly.
Figure 241
663
Leak Interface
❏ Carefully remove the leak interface.
❏ Replace the defective item. All three parts (top, bottom and tubing are
coming together as kit).
❏ Install the leak interface.
Figure 242
Leak Interface
664
The repair level of optical unit parts is component level.
Refer to section “Optical Unit “C”” on page 688 for additional parts.
N OT E
WA R N I N G
665
Figure 243
Optical Unit
❏ Disconnect power from instrument.
❏ Remove flow cell.
❏ Disconnect all cables that go from the optical to the Detector Controller
Board (DCB).
❏ Place the instrument on its left or right side.
❏ Remove all nuts that fix the optical unit.
❏ Take out the optical unit.
666
Replacing the PSC Board
❏ Refer to “Removing the Optical Unit” on page 666.
❏ Remove the PSC protection cover (2 screws).
❏ Loosen the PSC board (3 screws).
❏ Remove the lamp supply connector from the fan assembly.
❏ Fed the wire carefully between fan cover and power supply cabinet. If not
possible, loosen the fan cover.
❏ Replace the PSC board and reuse the old cable to the DCB board.
❏ When replacing the PSC protection cover, take care for correct routing of
the wire at the right side.
Replacing Pre-amplifiers or Photodiodes
❏ Remove the top cover and the front panel assembly.
❏ Refer to Figure 244 for next steps.
❏ Remove the cover that protects the pre-amplifier.
❏ To replace the pre-amplifier boards
❏ disconnect cable from pre-amplifier board
❏ unscrew the board
❏ unsolder the wire from the photodiode
❏ replace the board.
❏ To replace the photodiode
❏ remove cover plate of photodiode
❏ unsolder photodiode
❏ unscrew photodiode
❏ replace photodiode.
667
Figure 244
Location of Photodiodes
Sample
Reference
Replacing Grating Assembly Parts
Photo Sensor
❏ Remove the bottom plate of the optical unit.
❏ Unscrew the photo sensor and replace it.
Grating
For [ ] items refer to Figure 245 on page 669.
❏ Remove the top cover of the optical unit.
❏ Use a hex key (2.5 mm) to loosen the grating screw [2].
❏ Replace the grating [1].
❏ Refer to “Optical Alignment Procedures” on page 671.
668
Grating Motor
❏ Refer to “Replacing Grating Assembly Parts” on page 668 and take grating
out.
❏ Remove the two springs.
❏ Unscrew the three screws [6] that fix the motor assembly [5] and take it
out. Keep spring [3] and gasket [4].
❏ Replace the spring [3], gasket [4] and complete motor assembly [5].
❏ Reinstall the grating [1].
Figure 245
Grating Assembly
669
Replacing Filter Assembly Parts
❏ Refer to Refer to “Removing the Optical Unit” on page 666.
❏ Unscrew the 2 screws that fix the filter assembly.
❏ Take out the complete assembly.
❏ Replace the complete filter assembly, sensor lever or the sensor.
Figure 246
Filter Assembly
Replacing Mirrors, Beamsplitter and Slits
❏ Open the optical untit's top cover.
❏ Replace the item that need to be replaced.
N OT E
DO NOT touch the surface of the mirrors, beam splitter and the grating.
670
Optical Alignment Procedures
WA R N I N G
Procedure 1:
alignment after exchange of a specific part
Procedure 2:
alignment of complete optical (sample path)
Procedure 3:
alignment of complete optical (reference path)
Procedure 1: Simple Alignment
When replacing just a single part in the light path other than grating parts, M4
and beam splitter, this procedure can be performed.
❏ Execute 40:0th TEST which shows the step number from
31: SET WL PARM. and watch the location of the images on the slit
assemblies (entrance and reference slit) and the cell center.
❏ Exchange the part Refer to Replacing ... for more information.
❏ Position the part so that the image centers on entrance and reference slit.
❏ Fix the part.
❏ If image on exit slit is too high or low, follow procedure “Procedure 2:
Sample Beam Alignment” on page 672.
❏ If image on reference slit is too high or low, follow procedure “Procedure
3: Reference Beam Alignment” on page 674.
❏ Excute the 20:0th CALIB. and 21:WL CALIBRATION.
❏ Refer to “Replacement of Deuterium Lamp” on page 652, Step 2 and 3.
671
Procedure 2: Sample Beam Alignment
For [ ] items refer to Figure 247.
M1, M2, Entrance Slit, ❏ Remove the entrance slit [3].
M3
❏ Turn the deuterium lamp [1] on.
❏ Make sure the light spot covers over mirror M1 [4].
❏ Adjust the direction of mirror M1 [4] so that the light beam covers over
mirror M2 [5].
❏ Adjust the angle and direction of mirror M2 [5] so that the light beam
covers over mirror M3 [6].
❏ Install the entrance slit [3] where the light beam illuminates the center of
the slit.
❏ Adjust the angle and direction of the mirror M3 [6] so that the light beam
covers over the grating mirror [7].
Figure 247
Optical Unit Parts
672
Grating, M4, Beam
Splitter
❏ Excute control function 40:0TH TEST OFF to set the grating motor
position to 200 steps (center step number).
❏ Adjust the direction of the grating mirror [7] so that the light beam covers
over the mirror M4 [6].
❏ Remove the beam splitter [8] now so that you can see the center of the flow
cell.
❏ Adjust the angle and direction of the mirror M4 [6] so that the light beam
illuminates the center of the flow cell.
❏ Leave control function 40:0TH TEST OFF and return to normal display.
❏ Excute the 20:0th CALIB. and 21:WL CALIBRATION. Refer to
“Replacement of Deuterium Lamp” on page 652, Step 2 and 3.
❏ If grating has been moved, use 45:COMPENSATE to compensate
non-linearity of the grating motor.
❏ Set wavelength to 254nm.
❏ Place cover on optical unit (do not fix the screws at this time).
M4 fine tuning
❏ Excute control function 16:PHOTOCURRENT.
❏ Remove the blank screw for mirror M4 adjustment (Figure 243 on page
666) on the top cover (leave the blank screw for beam splitter adjustment
in).
❏ Adjust the angle of the mirror M4 with inserting a hexagon wrench
(1.5 mm) through the top cover screw hole to get maximum photocurrent
for the sample. Turn right to move image down and left for up.
❏ Replace the blank screw in the top cover.
❏ Excute the 20:0th CALIB. and 21:WL CALIBRATION. Refer to
❏ Install the beam splitter [8].
673
Procedure 3: Reference Beam Alignment
❏ Excute 40:0TH TEST ON with calibrated step value displayed.
❏ Open the top cover and adjust the angle and direction of the beam splitter
[8], so that the light beam illuminates the center of the reference slit [12].
❏ Place the cover on the optical unit.
❏ Leave 40:0TH TEST ON and set wavelength to 254 nm.❏ Remove the blank screw for beam splitter adjustment (Figure 243 on page
666) in the top cover.
❏ Excute 16:PHOTOCURRENT.
❏ Adjust the angle of the beam splitter inserting a hexagon wrench through
the top cover screw hole to get maximum photocurrent for the reference.
Turn right to move image down and left for up.
❏ Replace the blank screw in the top cover.
❏ Repeat the 20:0TH CALIB. and 21:WL CALIBRATION. Refer to
❏ Use 45:COMPENSATE to compensate non-linearity of the grating motor.
674
Cleaning of Optical Unit Parts
Cleaning of Optical Unit Parts
There are only a few parts within the optical unit that can be cleaned.
Table 173
Cleanable Optical Parts
NOT CLEANABLE
grating and all mirrors
Touching or cleaning will result in decrease of
reflaction/intensity
CLEANABLE
filters (holmium, cutoff and 0 order calibration), beam
splitter, photo diodes
You can wipe the surface with ethanol. In case you
cannot remove stains, the part has to be replaced.
675
Upgrade to GPIB
Upgrade to GPIB
❏ Note the values for WL, 0 and 656 nm using 31:SET WL PARAM., just in
case the EEROM looses the values.
❏ Turn off the instrument.
❏ Remove top cover of the instrument.
❏ Remove plate at the rear panel above the fan.
❏ Install the GPIB board in that location using the screws that hold the plate.
❏ Connect the GPIB cable to J12 of the DCB board.
GPIB Address Setting
The GPIB address setting is done with a switch (1) at the rear of the GPIB
board. The factory setting is ’10’ (position A).
Figure 248
Location of GPIB board
676
Performance Verification
Table 174
Noise and Drift Specifications
Noise
1.5 x 10-5 AU
Drift
5.0 x 10-4 AU/h
What you need
❏ a pump that can deliver bidistilled water, at a rate of up to 1 ml/min against
a back-pressure of about 200 bar.
❏ a column: we recommend our 100 x 4.6 mm i.d., 5 µm Hypersil ODS
column.
❏ a recording device that can accept the output signal from your detector
and that has attenuation set to about 35 cm/mV.
Preparations
❏ Prime the pump and ensure there are no air bubbles in the system.
❏ Thoroughly degas about 300 ml of bidistilled water.
❏ Set pump to deliver bidstilled water at a flow rate of 1 ml/min.
❏ Set the attenuation to about 35 cm/mV.
❏ Set run time on recorder to 6.0 min.
❏ Turn-ON line power and deuterium lamp.
❏ Set wavelength to 254 nm, response time to 1 second and output voltage to
1 V.
677
Starting a run
❏ Give the optical unit time to warm-up and stabilize.
❏ Start a run.
The baseline noise should not exceed 7.5 µV (1.5 x 10-5 AU|) equivalent to
4.5 mm at attenuation - 3 on a 3390/2/3 integrator and equivalent to 9 mm
at attenuation - 3 on a 3394/6 integrator.
Figure 249
Example of Noise Plot
This plot was taken with
• a 79853C VWD
• an 35900C A/D converter
• a LC DOS workstation
• flow cell windows removed, but gasket #2 installed.
It shows, that the drift on this example is < 1 x 10-4 AU/hr and the noise at
about < 1 x 10-5 AU.
678
Scaling Factors
The table below shows the scaling factors for the 339XA family of
integrators. The 3390A, 3392A and 3393A have a full scale deflection of
75 mm. The 3394A and the 3396A have a full scale deflection of 150 mm, they
also have an attenuation range between -8 and 36.
Table 175
Scaling Factors on 339X integrators
ATTN
mV full scale
mAU full scale
-3
0.125
0.25
-2
0.25
0.5
-1
0.5
1
0
1
2
1
2
4
2
4
8
3
8
16
4
16
32
5
32
64
6
64
128
7
128
256
8
256
512
9
512
1024
10
1024
2048
679
680
30
30
VWD: Parts Information
1050 Variable Wavelength Detectors
listings respectively.
• Overall Diagram
• Optical Unit
• Flowcell
• Flow Cell Kits
• Accessory Kit
N OT E
682
Overall Diagram
Overall Diagram
Table 176
Overall Diagram
Item Description
Part Nmber
Item Description
Part Nmber
1 Power Supply (5061-3375)
01050-69375
15 Cover Assembly
79853-64101
2 DCB Board Assembly, see *
79853-69511
16 GPIB Board Assembly
79853-68711
2 ROM DCB Firmware “C” only
79853-13005
16 ROM GPIB Firmware
79853-13004
2 ROM DCB Firmware “D” only
79853-13000
Cable DCB-GPIB
79853-61610
3 PSC Board for DCB 79853-66511 79853-66512
17 Fan Assembly (LOW)
79853-68503
4 Cable PSC-DCB
79853-61605
18 Cover Fan
79853-04102
5 Cover PSC
N.A.
19 Sheet Fan
N.A.
6 Leak Sensor Board
see page 687
20 Fan Assembly (HIGH)
79853-68502
see page 687
21 Switch Bearing
79853-61903
8 Sheet Front Panel
see page 687
22 Switch Bracket
N.A.
9 Front Panel Assembly
see page 687
23 Switch Shaft
79853-61901
10 Display Interface (KDI)
79853-66502
24 Switch Top
79853-61902
11 Display Module (VFD)
79853-66503
25 Cable DCB-KDI
79853-61609
12 Cable KDI-VFD
79853-61602
26 Optical Unit
see page 688
13 STD Flow Cell Assembly
see page 693
13 Semi-micro Flow Cell Assembly
see page 695
Transport Screw Kit, contains 3
screws with washer and spacer
79853-68700
13 Ultra High Pressure Flow Cell
Assembly
see page 697
PEEK Inlet Tubing Kit
5062-8522
13 Prep Flow Cell Assembly TI
see page 698
PEEK Waste Tubing Kit
5062-8535
14 Bracket DPS
N.A.
*
If installed in instruments with PSC -66509, then PSC must be updated to
79853-66512.
683
Overall Diagram
Figure 250
684
Overall Diagram
Figure 251
685
Front Panel Parts
Front Panel Parts
Leak Interface
Table 177
Leak Interface
Description
Part number
Leak Interface Kit, contains
79853-68731
Top, Bottom and Tubing
Figure 252
Leak Interface
Top
Tubing
Bottom
686
Front Panel Parts
Font Panel
Table 178
Front Panel
#
Description
Part number
Front Panel Complete
79853-60203
Front Panel
79853-60202
1 Leak Sensor Board
79853-66510
79853-66111
3 Display Module Board (VFD)
79853-66503
4 Cable KDI-VFD
79853-61602
5 Display Interface (KDI)
79853-66502
6 Cable DCB-KDI
79853-61609
O-ring, Leak Assembly
Figure 253
79853-82501
Front Panel
687
The parts identification of the optical unit is splitted into four sections:
• Optical Unit Inner Parts (Top)
• Optical Unit Inner Parts (Bottom)
• Grating Assembly
• Filter Assembly
• Flow Cell Assemblies
N OT E
For complete optical unit “C” replacements use part number 79853-60015.
This upgrades to “D” version, see “Part Numbers for Enhanced “D” Optical
Unit” on page 709
688
Optical Unit “C” Inner Parts Top
Table 179
Optical Unit “C” Inner Parts TOP
Item Description
Part Nmber
Item Description
Part Nmber
Optical Unit (complete assembly) 79853-69015
7 Grating Assembly
see page 691
Plate Optical Top
79853-04108
8 Beam Splitter
79853-20402
79883-60002
9 Pre-Amplifier Board, SAMPLE
79853-66507
Lamp housing
79853-22006
10 Sensor, Sample
79853-61109
2 Filter Assembly
see page 692
11 Pre-Amplifier Board, REF
79853-66508
3 Entrance Slit Assembly
79853-23103
12 Sensor, Reference
79853-61110
4 Mirror #1
79853-68107
Reference Slit
79853-23104
5 Mirror #2
79853-68108
Spacer Reference Sensor
79853-24702
6 Mirror #3 or #4
79853-68109
PTFE Ring 53C
79853-24500
Figure 254
Optical Unit “C” Inner Parts TOP
689
Optical Unit “C” Inner Parts Bottom
Table 180
Item Description
Part Nmber
Item Description
Part Nmber
Optical Unit (comple assembly)
79853-60015
7 Filter Assembly
Plate Optical Base
79853-04109
7 Position Sensor Assembly, Filter 79853-61107
1 Optical Body
N/A
8 Cable Assembly, Sample
79853-61607
2 Plate Sample Sensor
79853-04110
9 Cable Assembly, Reference
79853-61608
3 Position Sensor Assembly,
Grating
79853-61106
Spacer, Optical (metal foot)
79853-24701
4 Plate Reference Sensor
79853-04111
Insulator, Optical (rubber foot)
79853-85401
5 Spring #1, Grating
79853-29102
Foot Kit Optical
79853-22005
6 Grating Assembly
see page 691
Figure 255
see page 692
690
Grating Assembly
Grating Assembly
Table 181
Grating Assembly
#
Description
Part number
1
Grating
79853-64605
Hex Screw M3 14 mm lg
2
Spring #2, Grating
3
Gasket
4
Grating Motor Assembly
5
Screws M3 6 mm long
Photo Sensor
Figure 256
79853-29103
79853-64606
79853-61106
Grating Assembly
691
Filter Assembly
Filter Assembly
Table 182
Filter Assembly
#
Description
Part number
1 Filter Assembly
79853-67903
2 Lever Position Sensor
3 Position Sensor Filter
79853-61107
4 Screws M3 6 mm long
Figure 257
Filter Assembly
692
Standard Flow Cell “C” (SST/Ti)
Table 183
N OT E
Item
Description
Part Nmber
Qty
1
Cell Screw
79853-27201
2
Conical Spring 10/pk
79853-27203
10
3
Ring 2/pk
79853-27202
2
4
Gasket #1 PTFE
5
Window Quartz
6
Gasket #2 PTFE
7
Gasket #3 PTFE
STD Flow Cell 8 mm SST
see Note below
STD Flow Cell 8 mm Ti
79853-60011
PEEK Inlet Tubing Kit
5062-8522
Cell Kit STD, includes items 4 (2x), 5 (2x), 6
(1x) and 7 (1x)
79853-68718
5
Window Quartz Kit
79853-68719
2
4
Gasket #1 PTFE Kit STD 10/pk
79853-68720
10
6
79853-68721
5
7
79853-68722
5
The original STD flow cell 79853-60008 was replaced in June 1995 by the “D”
version 79853-60000. For parts ID refer to “Standard Flow Cell “D” Repair
Parts” on page 710.
693
Figure 258
694
Semi-Micro Flow Cell (SST)
Table 184
Semi-Micro Flow Cell (SST/Ti)
Item Description
Part Nmber
Qty
1 Cell Screw (same as STD)
79853-27201
2 Conical Spring (same as STD)
79853-27203
10/pk
3 Ring (same as STD)
79853-27202
2/pk
4 Gasket #1 PTFE (same as STD) 10/pk
79853-68720
10/pk
5 Window Quartz (same as STD)
79853-68719
2/pk
6 Gasket #2 PTFE Micro
79853-68724
10/pk
Semi-Micro Flow Cell (complete)
79853-60010
PEEK Capillary 400 mm lg ID 0.12 mm
5021-1823
Fitting for PEEK capillary
0100-1516
2/pk
Cell Kit Micro, includes items 4 (2x), 5 (2x) and 79853-68723
6 (2x)
Figure 259
695
High Pressure Flow Cell (SST)
Table 185
Item Description
1 Cell Screw (same as STD)
Part Nmber
Qty
79853-27201
2 Ring POLYIMIDE
3 Window Quartz
79853-68740
2/pk
4 Gasket #1 POLYIMIDE
79853-68729
10/pk
5 Gasket #2 POLYIMIDE
79853-68730
5/pk
High Pressure Flow Cell SST
replaced by UHP Cell,
see “Ultra High
Pressure Flow Cell
(SST)” on page 697
PEEK Tubing Assembly
5062-8522
Cell Kit HP, includes items 2 (2x), 3 (2x), 4 (2x) 79853-68728
and 5 (1x)
N OT E
The gaskets, windows and rings are not compatible with the Ultra High
Pressure Cell (79853-600013) that replaced the high pressure flow cell
(79853-60009). For parts identification refer to “Ultra High Pressure Flow Cell
(SST)” on page 697.
696
Ultra High Pressure Flow Cell (SST)
Table 186
Item Description
1 Cell Screw
Part Nmber
Qty
79853-27200
2 Ring PEEK UHP
Figure 260
3 Window Quartz Kit, UHP
79853-68734
2/pk
4 Gasket #1 POLYIMIDE Kit UHP
79853-68737
2/pk
5 Gasket #2 POLYIMIDE Kit UHP
79853-68738
2/pk
Ultra High Pressure Flow Cell SST
79853-60013
5062-8522
Cell Kit UHP, includes items 2 (1x), 3 (2x), 4
(2x) and 5 (2x)
79853-68733
697
Preparative Flow Cell (Ti)
Table 187
Preparative Flow Cell (Titanium)
Item Description
Part Nmber
1
Cell Screw (same as STD)
79853-27201
2
Conical Spring (same as STD)
79853-27203
10/pk
3
Ring (same as STD)
79853-27202
2/pk
4
Gasket #1 PTFE (same as STD)
79853-68720
10/pk
5
Window #1 Quartz (same as STD)
79853-68719
2/pk
6
Gasket #2 PTFE (0.1) for 0.9 µl
6
6
6
7
Window #2 Quartz
8
Gasket #3 PTFE
Preparative Flow Cell (complete)
79853-60012
5062-8522
Cell Kit PREP, includes items 4 (1x), 5 (1x),
6 (1 of each size), 7 (1x) and 8 (1x)
79853-68725
Qty
Window Quartz Kit PREP includes items 5 (1x), 79853-68726
7 (1x)
Gasket Kit PREP includes one of each size of
gasket #2
698
79853-68727
Figure 261
699
Cuvette Holder
Cuvette Holder
Table 188
Control Module Parts
Item
Description
Part Number
Cuvette Holder
79853-60016
For informationon the use of the cuvette holder, refer to “Using the Cuvette
Holder” on page 658.
Figure 262
Cuvette Holder
700
Accessories
Accessories
These parts are shipped with the 79853C VWD
Table 189
Accessories
Description
Part number
QTY
Manual Getting Ready
01050-90211
1
Cable Remote
5061-3378
1
PEEK Waste Accessory Kit
5062-8535
1
Standard Accessory Kit
79853-68701
1
Fitting
0100-1516
1
Fuse 250 V 2A
2110-0002
3
Fuse 250 V 3A
2110-0003
3
Wrench 1/4-5/16 inch
8710-0510
1
Screwdriver POZI 1 PT 3
8710-0899
1
Leak Interface Kit
79853-68731
1
Manual SOP
79853-90009
1
includes
701
Screws
Screws
Below table lists all screws within the instrument. They can be bought
locally, if needed.
Table 190
Screws
Location
Size
filter motor
M 2.3 4 mm lg
hexagon socket set
screw with cup point
grating motor
M3
3 mm lg
hexagon socket set
screw with cup point
mirror adjustment
M3
8 mm lg
hexagon socket set
screw with dog point
grating adjustment
M3
14 mm lg hexagon socket cap
screw
grating motor
M3
4 mm lg
countersink screw
to fix assemblies on the optical body; cover on M 3
the DCB board; plate of lamp house; KDI and
VFD board; mirrors, filter and grating;
6 mm lg
screw
position sensor
M3
6 mm lg
screw with smaller
head
REF sensor plate
M3
10 mm lg screw
SAMP and REF amplifier boards
M3
18 mm lg screw
cover assembly; optical unit top cover; DCB
and GPIB boards from rear panel;
M4
6 mm lg
screw with lock
washer
to fix assemblies on the base; DCB abd GPIB M 4
board; leak detector assembly; front panel
bracket; SAMP and REF covers; optical unit
bottom cover; blank screws of optical unit top
cover; plate for cell on the optical body;
5 mm lg
screw
blank plate of cell; lock screws
12 mm lg screw
702
M4
Length
Type
Screws
Table 190
Screws
Location
Size
Length
Type
lamp house
M4
14 mm lg screw
fan assemblies
M4
35 mm lg screw
cell
M5
10 mm lg screw
All screws are plus-shaped type.
703
Screws
704
31
31
VWD: Enhanced Optical Unit
Information
This chapter provides information about the
enhanced optical unit “D”
VWD: Enhanced Optical Unit
Information
Since June 1995, the design of the optical unit for the 79853C Variable
Wavelength Detector (VWD) was changed to improve its performance under
unstable temperature conditions.
Together with the enhanced optical unit (“D”), the standard flow cell was
changed (79853-60000).
N OT E
In this document the term “D” is used for the new enhanced optical design and
“C” for the original optical design.
Compatibility
This new enhanced optical unit (“D”) is fully backward compatible with all
79853C VWDs shipped since January 1992.
The new standard flow cell (79853-60000) is backward compatible with the
“C” optical unit.
Some of the parts for the enhanced optical unit (“D”) are not usable in the “C”
version.
In case of replacing a “C” optical unit with an enhanced “D” optical unit, the
new standard flow cell is required.
Support of Previous Optical Units
The parts for the “C” optical unit will continue to be available as a repair part
as long as the 79853C is supported (08/2006). In case the complete “C” optical
must be replaced, use the “D” upgrade mentioned on “Part Numbers for
Enhanced “D” Optical Unit” on page 709.
706
VWD: Enhanced Optical Unit Information
Introduction
Introduction
To overcome wander problems due to temperature variations of the lab
environment, the optical unit of the 79853C Variable Wavelength Detector
(VWD) has been modified.
Following hardware modifications were implemented in June 1995:
• different coupling of the lamp housing (lens between lamp housing and
optical casting).
• area around mirror M1 and M2 has been redesigned to eliminate one
mirror - result is a mirror #1 assembly with a plane mirror.
• redesigned entrance slit holder. Slits are changeable (standard/test).
• beam splitter assembly no longer vertically adjustable.
• reference slit assembly redesigned for better optimization.
• new standard flow cell with different aperture material and different inlet
capillary.
Figure 263
Optical Path of Enhanced Optical Unit
new lens assembly
new entrance slit
assembly
new mirror #1
assembly
new beam splitter
assembly
new reference slit
new standard flow cell
707
Support Considerations
Support Considerations
Prefix Change
The enhanced Optical Unit (“D” version) was introduced in production units
in June 1995. Since the detector appears to look the same as before, a prefix
change was made. All units with prefix 3522 J 04305 and above have the
new optical installed.
N OT E
Some units with a prefix lower than 3522 J 04305 have been installed on
customer sites prior to the official shipments.
Identification
Following identifications for the enhanced “D” version are available:
• Prefix and serial number 3522 J 04305 and above (rear of instrument)
• firmware revision 4.31 (press CTRL 12 ENTER ENTER DOWN)
• label on the optical unit “ENHANCED ILLUMINATION SYSTEM”
• handle of new reference slit looking out of the optical’s cover plate (see
Figure 266 on page 715).
Compatibility Matrix
Due to a redesign, several components are usable in the enhanced “D”
version only. Refer to Table 191 on page 709 for details.
N OT E
Both optical unit versions (“C” and “D”) can be operated with firmware
revision 4.24 (79853-13005). Due to the modifications, the photocurrent
readings are about 50% of those of the original “C” opticals. To make them
comparable the firmware for the enhanced “D” version got a new revision and
part number.
708
Part Numbers for Enhanced “D” Optical Unit
Part Numbers for Enhanced “D” Optical
Unit
Table 191
Enhanced “D” Version Part Numbers
Part Number
Description
Comments
79853-60000
Standard Flow Cell
backward compatible*, for details see Table 192 on page
710.
79853-69014
Exchange “D” Optical
includes firmware 79853-13000
when “D” optical should be replaced,
needs Standard Flow Cell 79853-60000
79853-69015
Exchange “D” Optical
includes a Standard Flow Cell
79853-60000 and firmware 79853-13000
when “C” optical should be replaced
79853-68110
“D” Mirror 1 Assembly
for “D” only, includes test slit
79853-68111
“D” Mirror 3/4 Assembly
backward compatible**, includes test slit
79853-68112
“D” Beam Splitter
79853-68113
“D” Lens Assembly
79853-66508
Pre-amplifier Board REF
from “C” used for SAMPLE and REFERENCE on “D”
79853-61109
Diode Sample
from “C” used for SAMPLE and REFERENCE on “D”
79853-64605
Grating Assembly
same part number as before, but test slit added
79853-13000
Firmware “D” rev 4.31
for “D” only, added also to
79853-69014/15 and 79853-69511 (DCB)
79853-68746
Slit Kit “D”
Test slit plus STD slit
*
**
with “C” version optical units
with “C” version optical units; part number 79853-68109 should only be used for 79853C optical until stock has expired.
N OT E
The part numbers 79853-68110, -68111, -68112, -68113 and -64605 include
beside the test slit in addition a seal to close the hole for Mirror 4 adjustment
setscrew. Close the hole with this seal during replacements (see Figure 266 on
page 715 for the location).
709
Standard Flow Cell “D” Repair Parts
Table 192
Item
1
Description
Part Number
STD Flow Cell “D”, complete assembly
79853-60000
Cell Screw
79853-27200
Kits:
Cell Kit STD “D”, consists of: two windows, two gaskets #1, 79853-68741
one gasket #2 and one gasket #3.
Figure 264
2
Conical Spring “D”, Qty=10
79853-29100
3
Ring SST “D”, Qty=2
79853-22500
5
Window Quartz “D”, Qty=2
79853-68742
4
Gasket #1 “D”, PTFE, Qty=10
79853-68743
6
Gasket #2 “D”, Aperture, gold, Qty=5
79853-68744
7
Gasket #3 “D”, PTFE, Qty=5
79853-68745
1
2
3
4
5
6
7
5
4
3
2
1
710
Repair and Mainenance
Repair and Mainenance
WA R N I N G
These procedures need special knowledge on servicing the 79853C
VWD and should be done by trained Service Engineers only.
These procedures should be carried out in a room where the light can
be reduced.
Since the deuterium lamp emits intensive ultraviolet light, it is
dangerous to perform optical alignment without eye protection.
Tools required:
❏ Test Slit (supplied with mirror or grating assembly)
❏ Pozi Driv PT1
❏ hexagonal wrench (1.5 mm)
❏ hexagonal wrench (2.5 mm)
❏ pair of tweezers (not too sharp points)
Pre-requisites:
❏ Assure that the flow cell is clean, flushed with water and bubble free.
❏ Remove detector from system.
❏ Place the detector on a bench.
❏ Remove the main cover.
711
Additional Information
For additional information about replacements and the use of the Service
control Functions refer to “VWD: Maintenance Information” on page 649
and “Service Control Functions” on page 622.
Replacements and Calibrations
The following procedures describe the replacements of parts separately.
N OT E
It is important that only one assembly (mirror, grating, beam splitter, ...) is
changed and calibrated at a time. Otherwise you will lose correct optical
assembly alignment during the calibration process.
WA R N I N G
Do not remove the Entrance Slit Holder nor loosen it. Otherwise the
optical unit has to be exchanged completely.
N OT E
The photocurrent readings with test slit installed are much lower than with
the standard slit.
712
Installing the Test Slit
The small diameter of the test slit allows a straight forward alignment of the
optical path. It enables the lamp image to be positioned optimally. This
ensures correct illumination of the Entrance Slit and the Reference Slit.
N OT E
This procedure has to be carried out at the beginning of all replacement
procedures.
1 Turn on the detector and the lamp.
2 Set the wavelength to 250 nm.
3 Carefully remove the cover of the optical unit. Take care for the reference
aperture handle, see Figure 266 on page 715.
4 Remove the standard slit from the entrance slit holder using a pair of tweezers
and place it safe.
Figure 265
Replacing the Entrance Slit
entrance slit
assembly
entrance slit
mirror #1
assembly
test slit
713
5 Carefully insert the test slit (with round hole) into the entrance slit holder. The
slit must sit flat on the holder with the white side towards the incoming light.
714
Replacing Mirror #1 Assembly
Replacing Mirror #1 Assembly
1 Install the Test Slit, see “Installing the Test Slit” on page 713.
2 Remove mirror #1 assembly.
3 Install new Mirror #1 assembly.
N OT E
DO NOT remove or change its position of adapter plate underneath the
mirror #1 assembly.
4 Position the lamp image onto the test slit hole:
- horizontally by rotating the mirror,
- vertically using the setscrew on the mirror.
5 Fix the mirror.
6 Install the Standard Slit and perform grating calibrations, see “Installing the
Standard Slit” on page 726.
7 Carefully replace the cover of the optical unit. Take care for the reference
aperture handle.
8 Reassemble the detector.
Figure 266
handle of reference
aperture
Handle of the Reference Aperture
hole / seal of Mirror #4 for
alignment
cover of optical unit
715
Replacing Mirror #3 or #4 Assembly
N OT E
Replace and calibrate one mirror at a time.
1 Install the test slit, see “Installing the Test Slit” on page 713.
3 Execute CTRL 20: 0th CALIB.
4 Activate service function CTRL 40: 0TH TEST ON.
6 Unlock the reference aperture, “Unlocking the Reference Aperture” on page
723.
7 Center the reference slit on the white image by moving the aperture up or
down, see Figure 267. The image diameter is nearly equal to the reference slit
diameter.
Figure 267
Algning the Reference Slit
handle of reference
aperture
reference image
716
8 Install new mirror #3 or #4 assembly.
9 Position the white image precisely onto the reference slit:
- horizontally by rotating the mirror,
- vertically using the setscrew of the mirror
aperture handle.
11 De-activate CTRL 40: 0TH TEST OFF, press CLEAR, CLEAR and BALANCE.
12 Set λ=250 nm.
13 Activate CTRL 16: PHOTOCURRENT.
14 Optimize the sample readings using the setscrew of mirror #4 through the hole
in the optical unit cover, see Figure 266 on page 715.
15 Optimize the reference readings with the reference aperture, see “Optimizing
the Reference Readings” on page 725.
16 Install the standard slit and perform electronic calibrations, see “Installing the
717
Replacing the Grating or Grating Motor
N OT E
To replace the Grating and/or the Grating Motor refer to “Replacing Grating
Assembly Parts” on page 668 and continue with the Alignment Procedure
below.
6 Unlock the reference aperture, see “Unlocking the Reference Aperture” on
page 723.
7 De-activate CTRL 40: 0TH TEST OFF.
down. The image diameter is nearly equal to the reference slit diameter.
9 Remove the grating and reassemble new grating.
N OT E
Assure that the grating is not fixed on the shaft with the setscrew.
10 Set the Param.
λ=200, using service function CTRL 31: SET λ PARAM.
12 Turn the grating so that the center of the image is on the reference slit (a small
horizontal and vertical deviation can be accepted).
13 Fix the grating with the setscrew.
14 De-activate and re-activate CTRL 40: 0TH TEST and check the position of
the image on the reference slit.
If not correct, loosen the grating and repeat steps 12 to 14.
718
15 Do a vertical adjustment with Mirror #4 for precise vertical fit of image on
reference slit, using the setscrew of mirror #4 through the hole in the optical
unit cover, see Figure 266 on page 715.
aperture handle.
17 De-activate CTRL 40: 0TH TEST OFF, press [CLEAR], [CLEAR] and
[BALANCE].
19 Activate CTRL 40: 0TH TEST ON and readjust the Beam Splitter for ideal
horizontal fit.
20 De-activate CTRL 40: 0TH TEST OFF.
21 Set λ=250 nm.
23 Optimize the sample readings, using the setscrew of mirror #4 through the
hole in the optical unit cover, see Figure 266 on page 715.
page 723.
25 Optimize the reference readings with the reference slit, see “Optimizing the
Reference Readings” on page 725.
719
Replacing the Beam Splitter
Replacing the Beam Splitter
page 723.
down. The image diameter is nearly equal to the reference slit diameter.
7 Install the new beam splitter assembly.
8 Position horizontally the white image center of the beam splitter onto the
reference slit.
9 Fix the beam splitter after precise image fit.
10 Correct new vertical position with reference slit.
aperture handle.
12 De-activate CTRL 40: 0TH TEST OFF, press [CLEAR], [CLEAR] and
[BALANCE].
13 Set λ=250 nm.
15 Optimize the sample readings using the setscrew of mirror #4, using the
setscrew of mirror #4 through the hole in the optical unit cover, see Figure 266
on page 715.
16 Optimize the reference readings, see “Optimizing the Reference Readings” on
page 725.
720
Cleaning or Replacing the Lens
The lens is located between lamp housing and casting and can be cleaned or
replaced.
1 Turn the detector off.
2 Disconnect the lamp connector and all other connectors to the DCB board.
3 Remove the optical unit completely from the instrument.
4 Unscrew the four screws of the lamp housing and remove lamp housing.
Figure 268
Lens Assembly Location
lens assembly
spring washer
location of lens assembly
casting of optical unit
lamp housing
with lamp
N OT E
For easier repositioning the lens ring is marked with color paint, see Figure
269 on page 722. The position of the marker could differ from instrument to
instrument and may be different to the position shown in the figure.
5 Remove, clean or replace the lens. If reusing old lens use markings for
repositioning.
721
Figure 269
Lens Position
marker
lens assembly
N OT E
The more plane lens side with smaller aperture faces towards the lamp.
N OT E
If a new lens is installed, mirror #1 assembly has to be realigned after this
procedure, see “Replacing Mirror #1 Assembly” on page 715.
6 Reassemble the flat spring.
7 Replace the Lamp housing and tighten it.
722
Unlocking the Reference Aperture
N OT E
Only necessary, if required during a replacement procedure.
For performance reasons, the reference aperture is fixed by one screw only
and has to be unlocked prior to any replacement/calibration within the
optical unit.
1 Unscrew the front panel and place it in front of the detector to have access to
the reference pre-amplifier area.
N OT E
When moving the front panel, assure that the keyboard cable is not partially
disconnected - damage to the electronics is possible.
2 Unscrew the right screw of the reference pre-amplifier cover and loosen the
left screw.
3 Turn the cover counter-clockwise until you can loosen the top screw of the
photo diode holder sheet.
Figure 270
Unlocking the Reference Slit
handle of reference
aperture
lock screw
reference diode assembly
723
4 Replace the reference pre-amplifier cover (to prevent stray light).
5 Fit the front panel with one screw at the right of the mainframe.
6 Turn on the detector and the lamp
7 Set wavelength to 250 nm.
8 Return to your replacement procedure.
724
Optimizing the Reference Readings
aperture handle.
3 Shift reference aperture vertically for maximum reference readings.
4 Fix the reference slit with the top lock screw of the photo diode assembly.
5 Replace the reference photodiode cover.
6 Continue with the next step of the procedure of the assembly you are
replacing.
Figure 271
handle of reference
aperture
lock screw
reference diode assembly
725
Installing the Standard Slit
Installing the Standard Slit
N OT E
This procedure has to be carried out at the end of all replacement procedures.
2 Remove the test slit from the entrance slit holder using a pair of tweezers and
place it safe.
Figure 272
Replacing the Entrance Slit
entrance slit
assembly
test slit
mirror #1
assembly
standard slit
3 Carefully insert the standard slit into the entrance slit holder. The slit must sit
plane on the holder.
6 Execute CTRL 21:
l CALIBRATION.
726
32
32
VWD: Additional Information
Since the introduction of the 79853C Variable Wavelength Detector in 1991,
the following hardware and firmware changes have been implemented.
728
Product History
Product History
Since introduction of the 79853C Variable Wavelength Detector in January
1992 following changes have been implemented.
Prefix Changes
Table 193
Prefix Changes
Serial Number
Changes
3145 J 00101
Start of customer shipments
∅
3152 J 00263
New amplification factor of reference See “Modified
side due to high output of new DAD Pre-Amplifier Gain” on
lamps.
page 734.
3152 J 00489
Introduction of DCB firmware revision See “SN 01050-055” on
4.22
page 734.
3217 J 00603
4.23
page 734.
3225 J 00773
4.24
page 734.
3225 J 01801
Introduction of PTFE ring in optical
unit
See “SN 01050-068” on
page 734.
Volume changes on Preparative Flow See Table 138 on page
Cell in September 1992
574 and Table 187 on
page 698.
3225 J 02011
Introduction of new DCB/PSC boards See “SN 01050-072” on
page 734.
3323 J 03117
Introduction of new lamp housing
3334 J 03255
Change of manufacturing process for to improve stability
photo diodes mounting
against humidity
Ultra High Pressure cell replaced High
Pressure Cell in 1993
729
Product History
Table 193
Prefix Changes
Serial Number
Changes
3522 J 04305
Enhanced optical unit “D” with STD
flow cell “D” in June 1995
to improve temperature
stability, see “VWD:
Enhanced Optical Unit
Information” on page 705
730
DCB ROM Firmware Revisions
Table 194
Comments
4.08
Used for first internal
Waldbronn/Avondale units and some
demo units.
4.09
PHOENIX problem: won’t stop when
running with A/D Concerter (for
example ABORT).
Not released.Used for internal
Waldbronn/Avondale tests.
4.21
CTRL 45 COMPENSATE bug fix,
calibrated wavelength deviation
might exceed the specification.
CTRL 22 HOLMIUMCHECK for GLP
reasons added.
Released for 79853C in January 1992.
For replacements use part number
79853-13005 (4.24).
NEEDS GPIB ROM version 0.20 or
above (79853-13004)
4.22
New algorithm for CTRL 45
COMPENSATE and CTRL 22
HOLMIUMCHECK.
Released for 79853C in March 1992.
Started with serial number
3152J00489.
79853-13005 (4.24).
above (79853-13004)
4.23
Removed bug: Incorrect wavelength
setting during stepper motor
intialisation bewteen 536.4 nm and
600 nm.
Released for 79853C in April 1992.
3217J00603.
79853-13005 (4.24).
above (79853-13004)
731
Table 194
Comments
4.24
Removed bug : EEROM DATA LOST1 Released for 79853C in June 1992.
Removed bug : Wavelength accuracy Started with serial number
between 360 nm and 486 nm
3225J00773.
79853-13005 (4.24).
above (79853-13004)
4.31
For Enhanced Optical Unit “D” only
732
Released for 79853C in June 1995.
3522J04305.
79853-13000 (4.31).
above (79853-13004)
GPIB ROM Firmware Revisions
GPIB ROM Firmware Revisions
The table below lists all GPIB ROM firmware revisions for the 79853A/C.
Table 195
GPIB ROM Revisions
Comments
0.04
First official realease for 79853A.
0.05
LC APPACK problem: BUFFER
OVERFLOW message preventing run
buffer overflow.
Released for 79853A.
0.08
Also useable for 79853C. PHOENIX
Released for 79853A and 79853C.
problem: prevents hang-ups at power For replacements use part number
on (if VWD is switched on after
79853-13004 (0.2X)
PHOENIX has been switched on).
0.09
PHOENIX problem: prevents VECTRA
486 hang-ups.
NOT officially released.
0.20
additional changes for future
PHOENIX enhancements.
Released for 79853A and 79853C in
January 1992.
Required for 79853C firmware
revision 4.21 and above.
79853-13004 (0.2X)
733
Hardware Changes and Service Notes
Hardware Changes and Service Notes
Modified Pre-Amplifier Gain
First instruments where shipped with a pre-amplifier gain of 100% on the
reference side. The new deuterium lamps (79883-60002) showed sometimes
very high energies which gave very high numbers on the reference side
16:PHOTOCURRENT. To prevent an overload the amplification factor was
changed to 75%. The feedback resistors on the reference side changed from
200 MOhm to 150 MOhm and on the sample side from 100 MOhm to
75 MOhm.
N OT E
No revision change was made. The modified pre-amplifiers started with serial
number 3145J00263.
Important Service Note
SN 01050-055
Service Note 1050-055 describes the introduction of the DCB firmware
revision 4.24 and the problems with previous revisions in more detail.
SN 01050-068
This note describes problems with POM ring between lamp housing and
optical casting. Exchange POM ring against PTFE Ring 53C (79853-24500).
SN 01050-072
This note describes problems with negative baseline jumps on analog output
signal. New DCB (79853-66511) and PSC (79853-66512) Boards have been
introduced.
SN 01050-085
This note describes the optimization for drift problems.
SN 01050-104
Introduction of Enhanced Optical Unit, see “VWD: Enhanced Optical Unit
Information” on page 705.
SN 01050-107
Cuvette Holder for Wavelength Verification with Certified Standard Solutions
available see “Cuvette Holder” on page 700.
SN 01050-112
Check of photometric accuracy - information on path lengths of flow cells,
see “Correction factors for 79853C flow cells” on page 575.
734
In This Book
only.

HP1050 - McDonald Lab

Transcription

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