Texas Instruments 300mm for Analog Technologies

Texas
Instruments
300mm for Analog
Technologies
Wolfgang Ploss
Engineering MGR, Richardson, TX
October 9th , 2012
1
Agenda
•
•
•
•
Introduction to Texas Instruments
TI’s Manufacturing Strategy
RFAB 300mm Analog Technology
Closing
2
Leading Analog Innovation
3
…..with our complete solutions across the board
The Real World
Data
Converter
Amplifier
Temperature
Pressure
Position
Speed
Flow
Humidity
Sound
Light
Identification
Power Management
Amplifier
Data
Converter
Interface
Wireless
Connectivity
Embedded
Processing
Clocks & Timing
Logic
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….by doing more with TI’s Analog, Embedded
Processing and Wireless technologies
• Broad and deep product portfolio
o
o
o
o
o
Embedded processors
Analog integrated circuits
DLP - digital display chip
Wireless
More than 80,000 products
• Systems expertise and technical support
>130 sales offices
o Global team of 2,500 applications and sales engineers
o More than 60 design centers worldwide
o
Integrated Solutions, Custom Products, Catalog Products
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….through our history of innovation
Innovation in signal processing has been the technology thread throughout TI’s 80+ year history. 1930s
1950s
1970s
1990s
2010s
Revolutionizes oil exploration by measuring reflected signals
Invents the integrated Circuit
Applies signal processing to consumer Products
Creates first apps processor for multi‐media cell phones
Industry’s
first 300mm
Analog wafer fab
1940s
1960s
1980s
2000s
Applies signal measurement to magnetic anomaly detection
Invents the
handheld
calculator
Introduces single‐chip digital signal processor
Introduces world’s fastest analog‐to‐digital converter and lowest‐power DC‐DC converter
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….by applying our investment in new
technologies
$13.7B
Other $2.7B
o DLP® Products o Custom ASIC
Analog $6.4B
o High-Volume Analog &
Logic
o Calculators
o Power Management
o Royalties
o High-Performance Analog
o Silicon Valley Analog
Wireless $2.5B
Embedded Processing $2.1B
o OMAP™ Processors
o DSPs & Microcontrollers
o Wireless Connectivity
o Communications Infrastructure
o Basebands
o Automotive
2011 TI Revenue 7
...stronger analog position
Analog Market 2011
$42B
TI
15%
3%
National
Other
39%
10%
STM
6%
2%
3%
6%
3%
3%
4%
5%
Qualcomm
6%
Infineon
Skyworks
ADI
Linear
NXP Maxim
Source: Databeans, April 2012 and TI estimates (adjusted as if National/TI were separate entities)
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Leadership Processes
Drive Product Innovation
BiCom3
High Speed
Low Noise
CO5
High Density
Low Power
THS770006
High-Speed
Amplifier
Wireless
Communication
s
ADS4149
High-Speed
Data Converter
Test &
Measurement
HPA07
High Precision
Low Noise
LBC7
Reliability
Integration
ADS1298
Analog Front
End
ECG/EEG
Medical
TPA6140A2
Audio Amplifier
Mobile Phones,
Portable Media
Players
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About TI manufacturing
Flexible manufacturing strategy and extensive manufacturing footprint ensure continuity of supply
Innovative process technology and packaging roadmaps support customers well into the future
Quality system continuously improves products, processes, and services
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Flexible manufacturing strategy
TI delivers the products our customers need, when they need them,
even in peak periods of the demand cycle
Miho Fab, Miho, Japan
DMOS5, Dallas, Texas
DMOS6, Dallas, Texas
TIPI, Baguio City, Philippines
• TI leverages a flexible manufacturing model for its
digital logic products, using internal capacity as well
as world-class foundry partners
• Strong foundry and subcontractor relationships provide
flexible production and technology development
• TI defines technologies that provide performance and cost
leadership in wireless and embedded processing markets
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Significant capacity investments since 2009
Acquired from
Spansion, 2 wafer fabs
and equipment in Aizu,
Japan
Opening of TI-Clark
site
Opening of RFAB
Phase 1
TI-Clark ramps
QFN and WCSP
production
Jan
Apr
200+
devices
qualified at
RFAB
RFAB Phase 2
RFAB qualifies
its first device,
production begins!
Oct
May
2009
Jul
Oct
2010
Sept
2011
Between 2Q09 and 2Q10 installed
more than 400 testers at TI A/T
factories around the world
Since 2009, TI has added nearly
$7.5 billion of analog capacity to
support customers’ growth.
Acquired from
Cension, 2 wafer
fabs and equipment
in Chengdu, China
TI acquires
National
Semiconductor
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Worldwide Manufacturing sites
Greenock
GFAB
Chengdu
CFAB
150mm,
200mm
200mm
Freising
FFAB
200mm
Aizu
200mm
Miho
200mm
So. Portland
MFAB
200mm
Texas
150mm,
200mm
DHC
MEMS Heater
Chips
DMOS5
DMOS6
200mm
300mm
DFAB
SFAB
150mm
Taipei
TITL
Aguascalientes
TMX
Baguio City
TIPI
Kuala Lumpur
TIM
Melaka
TIEM
Pampanga Clark
Bump
DBUMP
RFAB
300mm
LEGEND
Wafer Fabs
Assembly / Test
Bump
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Welcome to RFAB
300mm Analog FAB, Richardson, TX
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RFAB – World’s first 300mm Wafer FAB for
advanced Analog Technologies
92 acre site (37.2 Hectares)
Status October 2009
1,078,000 SF total facility space (100K Sq Meters)
284,000 SF total clean room space (26K Sq Meters )
LEED recognition (Leadership in Energy and Environmental Design)
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All crates piled up
would get a total
height of ~2100m
 870m higher
than the highest
mountain of
Saxony
870 m
Fichtelberg (SA)
- 1215 m ü. NN -
RFAB - 300mm Tool Base
Over 850 tools from around the globe
More than 15 million Lbs. of tools and material
Over 1000 semi trucks used for shipping
Qimonda Dresden
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300mm Production Start within 1 year
TI Announced RFAB will open
Qimonda deal signed
September 29, 2009
October 13, 2009
All tools on site to start the technology
Start Production on 300mm
Ramp Capacity
December 31, 2009
October 2010
2011 – 2012
 First Silicon started, 1st technology - LBC7
January 15, 2010
 2nd technology - C05 started
July, 2010
 LBC7 First qualification – Driver product
October 6, 2010
 C05 First Qualification - Driver Product Qualification
February 15, 2011
 LBC7 Enterprise Technology Qualification
March 3, 2011
 C05 Enterprise Qualification
May 12, 2011
 3rd technology - LBC8LV started
2011
 4th technology - LBC8MV started
2011
 LBC8MV / LV Qualification
2012
 LBC9 – Development started
2012
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RFAB Start Up in 2009 - 100 Tools in 3 month
October through December 2009
October’ 09 , 0 Tools
November’09, 47 Tools
December’09, 100 Tools
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RFAB - Production in October 2010
Fully automated 300mm Wafer FAB within 1 year
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October 6th, 2010: LBC7 Product Qualification
Baby Shrimp
TPS51217
3V to 28V Input, Eco-Mode, Single-Output
Synchronous Buck Controller
Baby Shrimp, LBC7 Technology, 300mm
RFAB, TX
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Summary
Broad portfolio of analog process
technology platforms
Flexible Manufacturing Strategy to enable
customer growth
World’s first 300mm Analog FAB for Analog
Technologies in Production
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Thank You!
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