July/Aug 2007 - Passive Component Industry Magazine

Transcription

P
PAUMANOK
PUBLICATIONS
JULY/AUGUST 2007
An affiliate publication of the
Electronic Industries Alliance
A sector of the Electronic Industries Alliance
The Only Magazine Dedicated Exclusively To The Worldwide Passive Electronic Components Industry
Raw Materials
Mg Vapor-Reduced Ta Powders
Conductive Polymer Aluminum for Electrolytic
Capacitor Technology
Enabling Thinner, High-Performance,
Low-Cost MLCCs
Class II SPDs according to IEC 61643-1
CV+ - Advanced Medium Voltage Varistors
SV - Superior Medium Voltage Varistors
ZOV & ZOVR - High Energy Varistors
CV+
SV
ZOVR
ZOV
In = 5 to 40 kA @ 8/20 s
Imax = 10 to 80 kA @ 8/20 s
Your Partner in Overvoltage Protection
...not the biggest, simply the best !
For more info contact :
in Europe
KEKO VARICON, d.o.o.
Phone : +386-7-3885-120
Fax : +386-7-3885-158
e-mail : [email protected]
www.keko-varicon.si
in North America
SEI Stackpole Electronics, Inc.
Phone : +1-919-850-9500
Fax : +1-919-850-9504
www.seielect.com
in Asia
Stackpole Taiwan Electronics, Inc.
Phone : +886-2-8751-2668
Fax : +886-2-8751-0487
www.stackpole.com.tw
CONTENTS
VOLUME 9 • ISSUE NUMBER 4
JULY/AUGUST 2007
FEATURES
10
Tantalum Powders
Product Watch
Magnesium Vapor-Reduced Tantalum
Powders with Very High Capacitances
14
Chemical-Polymerized Polypyrrole
Conductive Polymer Aluminum for
Electrolytic Capacitor Technology
Product
Passive
Releases from the
Component Marketplace
34
20
Best Practices Guide
EIA’s Innovation & Global
Competitiveness
DEPARTMENTS
4
Letter from the Publisher
25
Technical Paper
Key Issues Affecting Raw Material
Usage & Supply to the Passive Component Industry: 2007
Enabling Thinner, HighPerformance, Low-Cost MLCCs
5
Letter from ECA
30
Newsmakers
Fight the Good Fight Against
Counterfeiting
Deals and Happenings in the
Passive Component Marketplace
Cover Photo
Courtesy of H.C. Starck
Passive Component Industry Magazine is owned, published, and distributed by Paumanok Publications. Copyright 2000-2007 Paumanok Publications. All rights reserved.
Parties submitting materials to Paumanok Publications represent and warrant that the submission does not violate any other party’s proprietary rights. Paumanok
Publications is not responsible for content. Article content, product names, services, and logos may be copyrighted, registered, and/or trademarked to their respective
authors and/or companies.
PASSIVE COMPONENT INDUSTRY
JULY/AUGUST 2007
3
LETTER FROM THE
PUBLISHER
Key Issues Affecting Raw
Material Usage & Supply to the
Passive Component Industry:
2007
the marketplace.
These events help us understand
what might happen as a result of
metals price increases in 2007. The
focus is now on thick film chip resistors and the price of ruthenium
(ruthenium paste is used in resistors). The price of ruthenium skyrocketed to more than $870 per
Troy ounce in 2007. Contracts in
ruthenium pastes are annualized,
and the price of ruthenium increased from $50 per Toz about one
year ago. The impact is potentially
substantial in thick film chip resistors because there is no alternative
to ruthenium.
aw materials constitute about
30% of the cost to produce
capacitors
and
resistors.
Higher materials costs are associated
with the most advanced components
that require the latest in materials
technology. This makes passive
components highly susceptible to
changes in market dynamics that are,
for the most part, controlled by third
parties. Raw material price increases
in the passive component supply
chain may inadvertently affect the
Near-Term Impact of Higher Metals
price of components consumed by
Prices on the Passive Component
original equipment manufacturers,
Industry: 2007
contract electronic manufacturers,
The metals of greatest near-term
and electronic component distribuconcern are ruthenium
tors because the materials
and nickel, which are conrepresent such a large
sumed in thick film chip
percentage of producresistors and multilayer
tion costs.
ceramic chip capacitors
In 2007, Paumanok
(MLCC).
notes price increases for a
There are other inlarge number of metals
creases in metals prices,
across multiple compowith emphasis on alunent platforms, with
minum and tantalum,
emphasis on ruthenium,
which are the anodes connickel,
copper,
alusumed in electrolytic
minum, and tantalum.
capacitors. Their yearHistorically, two metals
over-year price increases
in particular have been Dennis M. Zogbi
are more “tame” in comthe most volatile when it
parison, but because their operating
comes to price increases, and have
profits are lower, the impact on the
placed the most strain on a smooth
profitability of the key vendors is
supply chain. The first metal is
more likely.
tantalum, a non-ferrous metal consumed in the production of capacitor-grade tantalum metal powder
Thick Film Chip Resistor Metals
and wire, which in turn is consumed
in tantalum capacitor anodes. The
The resistance values in thick film
second metal is palladium, a platchip resistors are dependent on a
inum group metal that is consumed
metallization layer. There are three
in about 20% of the world’s multibasic types of metallization layers—
layered ceramic chip capacitor elecpalladium/silver for low ohmic
trodes. Problems with the tantalum
value circuit protection circuits,
supply chain in 2000 actually shut
ruthenium oxide, and ruthenate
down major production plants
pyrochlore. Ruthenium metal is the
further up the supply chain at the
raw material consumed for the latter
OEM and CEM levels in automotive,
two and constitutes a substantial cost
computer, and telecom sectors of
Continued on page 6
R
4
JULY/AUGUST 2007
Publisher
DENNIS M. ZOGBI
Director of Advertising
MITCHELL DEMSKO
Art Director
AMY DEMSKO
Editor
MELINDA ALLEN
Research Editor
NAUREEN S. HUQ
Advisory Board
Glyndwr Smith
Vishay Intertechnology, Inc.
Ian Clelland
ITW Paktron
Pat Wastal
Avnet
Jim Wilson
MRA Laboratories
Michael O’Neill
Heraeus Inc.
Bob Gourdeau
Vishay BCcomponents
Bob Willis
ECA President
Editorial and Advertising Office
224 High House Road, Suite 210
Cary, North Carolina 27513
(919) 468-0384 (919) 468-0386 Fax
www.paumanokgroup.com
The Electronic Components – Assemblies – Materials –
Association (ECA) represents the electronics industry
sector comprised of manufacturers and suppliers of passive and active electronic components, component arrays
and assemblies, and commercial and industrial electronic component materials and supplies. ECA, a sector of the
Electronic Industries Alliance, provides companies with a
dynamic link into a network of programs and activities
offering business and technical information; market
research, trends and analysis; access to industry and government leaders; standards development; technical and
educational training; and more.
The Electronic Industries Alliance (EIA) is a federation of
associations and sectors operating in the most competitive and innovative industry in existence. Comprised of
over 2,100 members, EIA represents 80% of the $400 billion U.S. electronics industry. EIA member and sector
associations represent telecommunications, consumer
electronics, components, government electronics, semiconductor standards, as well as other vital areas of the
U.S. electronics industry. EIA connects the industries
that define the digital age.
ECA members receive a 15% advertising discount for
Passive Component Industry. For membership information, contact ECA at (703) 907-7070 or www.ec-central.org;
contact EIA at (703) 907-7500 or www.eia.org.
LETTER FROM E C A
Fight the Good Fight
Against Counterfeiting
By Bob Willis
ECA President
t has reached epidemic proportions in jewelry, clothes,
food, and consumer electronics. Anywhere there is brand
value, there is counterfeiting.
The electronic component industry is no different. And
like every other product that counterfeiting invades, it has
a huge economic impact that ripples throughout the entire
supply chain. At CARTS USA this Spring, a seminar led by
Leon Hamiter of CTI Inc. addressed the issue from the perspectives of OEMs and contract manufacturers.
Lost sales caused by counterfeiting are estimated at
somewhere between one and ten billion dollars in the U.S.
alone, according to information provided by Hamiter. That
doesn’t include costs associated with equipment failure,
finding and destroying counterfeits, and loss of customer
goodwill.
I
Theft and Much Worse
Electronic Industries Association (EIA) members report
a wide range of counterfeits, including fake products
marked with a manufacturer’s logo; parts disassembled
from scrap heaps, re-reeled and sold as new; and untraceable old products that are re-reeled with counterfeit labels
and date codes.
“Caveat Emptor has never been more appropriate,” says
Bill Millman of AVX’s tantalum division. “We have developed a language to disguise the activity for what it really
is—a crime. It’s theft and much worse.”
Millman sees several reasons for the continued growth
of counterfeiting, including:
• better technology and skills to copy or re-brand complex devices
• cost pressures
• cultural acceptance of product copying
• buying and selling via the Internet
• procurement outsourcing by OEMs
• surplus stock dumped into the Asian market
The counterfeit market has also been aided by better
quality products, according to Jayson Young of KEMET.
Within the last five years, print formats such as labels and
packaging from counterfeiters have become almost identical to those from the manufacturer.
Complex Problem, Simple Solution
The fact that it is more difficult to detect counterfeit
Continued on page 40
JULY/AUGUST 2007
5
LETTER FROM THE P U B L I S H E R
Continued from page 4
1Q 2006
1Q2007
% Increase
Impacting
The Cost To Produce
Ruthenium (per Troy Ounce) $87.00
Nickel (Per Pound)
$6.25
Copper (Per Pound)
$2.00
Silver (Per Troy Ounce)
$9.00
Palladium (Per Troy Ounce) $255.00
Tantalum (Per Pound)
$45.00
$1.10
Aluminum (Per Pound)
$640.00
$24.00
$3.05
$13.50
$345.00
$52.00
$1.22
635%
284%
53%
50%
35%
16%
11%
Chip Resistor
MLCC
MLCC
MLCC
MLCC
Tantalum Capacitor
Aluminum Capacitor
Primary Metal
•
•
Source: Kitco, Engelhard, and Paumanok combined resources.
Figure 1: 1Q 2006 vs. 1Q 2007 Price Increases for Primary Metals Consumed in Passive Electronic
Components
factor in producing chip resistors.
The first substantial price increase for ruthenium in
decades impacted the thick film chip resistor business in
2007, causing significant price increases for resistive pastes.
There are no viable alternatives to ruthenium paste for
resistive layers in chip resistors. Passing the increased cost
along to the customer will be difficult due to recent
announcements of capacity expansion by major chip resistor vendors.
Because of price, the most disturbing factor is the tendency to thrift ruthenium, meaning to use less metal in
paste to achieve historic ohmic values. Since 2002, the USD
price of ruthenium has seen a maximum of $870 per Toz
(early 2007), a minimum of $30 (2003), with an average of
$120. As of April 2007, the price was around $635, according to Engelhard.
Potential for Thrifting of Ruthenium Metal
Thrifting is the term used in the metals industry to
describe using less of the metal product to obtain similar
performance. This has been successful in many industries
in the past but poses a threat to electronic components
because of the concept of the available surface area
providing, in this case, the ohmic value.
Historically, and as is apparent on the DuPont Web site,
the precise loading of ruthenium is critical to the desired
ohmic value of the finished resistor. Thrifting is therefore
discouraged and is a threat to the performance of the
finished resistor.
MLCC Metals
There has been a rapid rise in demand for ultra-fine
nickel powder for use in the internal electrodes of multilayered ceramic chip capacitors (MLCC). The reasons for
the increased consumption in this application include:
• Extremely high price for palladium, of which nickel is
displacing in the MLCC electrode.
6
JULY/AUGUST 2007
•
The added technical benefit of
producing MLCC with nickel
electrodes in very high capacitance values, which can compete
against electrolytic capacitors
(tantalum and aluminum), creating new market opportunities for
core MLCC suppliers.
Due to the high palladium price
and low comparable nickel price,
selling ultra-fine nickel electrode
powders to the MLCC industry is
relatively easy.
There is a broad supply base of
nickel electrode powder producers
who compete in both the battery
and capacitor businesses (energy
Continued on page 8
•
•
•
•
storage), including JFE Mineral, Sumitomo, and many
others.
2007 price increases should be about 175% year-overyear for nickel electrode powder, raising prices and
costs to produce for MLCC manufacturers.
Movement in China is now to 0.2 micro nickel electrode powder from the traditional 0.4 micron
powder. Japan is well into 0.2 production for nickel
powder in 2007.
As powders get smaller, prices increase as the yields of
the finished capacitors decline. Price increases for
nickel will impact those with higher percentages of
nickel and greater numbers of stacked layer capacity.
MLCC manufacturers have greater control over
ceramic supply chain, but cannot control their nickel
supply chain.
April 2002 to April 2007
20.0000
kitco.com
15.0000
10.0000
Jan. '07
Jan. '06
Jan. '05
Jan. '04
0.0000
Jan. '03
5.0000
$US/lb
Source: Kitco
Figure 2: 5-Year Nickel Prices
Electrode Powder Manufacturing
Both the MLCC manufacturers and electrode material
suppliers agree the most difficult process is to convert bullion or feedstock to spherical powders. This process, which
is generally known as the aqua regia process (some other
processes may be used, but this is very proprietary) adds approximately $7 per Toz onto the bullion (or feedstock)
charge and is referred to as fabrication costs (fab costs).
Within this charge, there are basic fabrication charges plus
a charge for metal losses, if the metal is supplied by the
powder producer. However, in some instances, the metal is
supplied by the component manufacturer, or even owned
by the component manufacturer but held by the engineered powder producer, for which the component manufacturer charges what is known as a “toll charge.”
The outside fabrication of spherical powders from raw
bullion (and nickel) is a common process in the MLCC
industry. Many MLCC manufacturers outsource based on
the simple fact that some merchant market suppliers have
better technology than they do.
8
Paste Manufacturing
After spherical powders are precipitated, the next
process is paste manufacturing, which will add an additional $5.40 per Toz onto the co-precipitated powder charge.
The production of pastes requires a binder to be mixed
with the co-precipitated powder. Binders used for the production of Y5V/Z5U and COG MLCCs are organic in nature. In X7R ceramics, however, there is a reaction between
the electrode metal and the PVA acrylic binder. The acrylic
binder creates voids in the electrode, which impedes the performance of the finished MLCC. Proprietary additives are
employed to prohibit the creation of voids in X7R electrodes
5 Year Nickel
25.0000
The current trend is for major Chinese MLCC vendors
to begin mass production of MLCC using 0.2 micron nickel electrode powder. Nickel electrode powder pricing has
increased by 175% YOY due to feedstock costs. Palladium
prices ironically remain stable.
JULY/AUGUST 2007
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This new report analyzes the
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TANTALUM P O W D E R S
Magnesium Vapor-Reduced Tantalum
Powders with Very High Capacitances
By Dr. Helmut Haas
and Dr. Christoph Schnitter
Research Tantalum Capacitor Powder, Central Research and
Development Division
H.C. Starck GmbH
nly a few years ago, tantalum powders used for solid
electrolytic capacitors showed specific capacitances of
around 20,000 µFV/g. Nowadays, the main volumes of
capacitor-grade tantalum powders have capacitances of
40,000 to 50,000 µFV/g, but these are shifting more
towards the 70,000 to 80,000 µFV/g range.
Continuing introduction of smaller portable electronic
devices such as mobile phones, PDAs, and laptops causes a
dramatic increase in demands for smaller capacitors with
higher capacitances. This trend to smaller capacitors with
high-density charge can be observed from the strong and
increasing demand in powders with capacitances of
100,000 µFV/g and higher.
Capacitor manufacturers developed numerous new techniques to increase the volumetric efficiency of their capacitors such as higher-anode-to-capacitor volume ratio and
“face down technology.” But the most important parameter
that influences the final capacitance of the tantalum capacitor is the specific surface area of the tantalum powder.
To provide high capacitance, a powder has to show a
high specific surface area. For example, a 50 K µFV/g powder
has < 1 m2/g, whereas the specific surface area of a
150 K µFV/g powder is approximately 3 m2/g. To increase
the capacitance to the actual 200 K µFV/g level, the powders
have to provide even higher surface areas > 4 m2/g.
Production of these capacitor-grade powders requires
primary powders with even higher surface areas that can
later be transformed by various processing steps such as
heat treatments, agglomeration, deoxidation, and sieving
into tantalum powders useable for capacitor production.
Suitable primary powders with surface area > 4.0 m2/g can
be produced by sodium reduction of K2TaF7 or by Mg
vapour reduction of tantalum oxides. One significant
advantage of the second process, patented by H.C. Starck,
are the very low levels of metallic impurities, which is more
critical for low-voltage applications. In addition, this very
controllable process allows tailoring particle shape and size
distribution of tantalum powders in a wide range.
The physical characteristics of these magnesiumreduced tantalum powders are excellent, such as flowability,
and they are fully comparable to the best capacitor-grade
O
10
JULY/AUGUST 2007
tantalum powders produced with the conventional sodiumreduction process.
It has been shown that the Mg vapour-reduction process of
tantalum oxides allows production of tantalum powders with
very high surface areas up to 15 m2/g on an economic scale.
Figure 1 is a SEM picture of a powder with surface area of
more than 8 m2/g in comparison to a powder with only
3 m2/g in Figure 2. With this, H.C. Starck has a tool to
provide tantalum powders with even higher specific surface
areas that assists the capacitor manufacturing industry to
continue their trend of miniaturization.
Figure 1: Mg-Reduced Tantalum Powder with Surface Area of 8 m2/g
Figure 2: STA 150 KA (10000 x)—Mg-Reduced Tantalum Powder with
Surface Area of 3 m2/g
In addition to capacitance, other parameters such as
leakage current and ESR get even more important. To
reach ultra-low leakage current values, ultra-high purity
tantalum powder is required.
In the case of magnesium reduction of tantalum oxide, the
purity level of the finished powders is strongly influenced by the
purity level of the raw material oxide. These oxides can be made
at H.C. Starck with the highest purity, with impurity levels below
1 ppm for alkali metals and fluorine. In addition, no corrosive
molten halide salts have to be used in the new process, like in
the conventional sodium-reduction process, and therefore the
halide content and metallic impurities such as Fe, Cr, and Ni of the
produced tantalum powders are usually below detection limit. It is
well known that all of these elements are harmful to the anodic
oxide film but that low levels of these elements are necessary for
manufacturing good electrolytic capacitors.
Another advantage of the magnesium-reduction process compared to the conventional tantalum production process is the possibility to control the morphology of the powder agglomerates.
This can be done by varying the starting oxide precursor, keeping
in mind its morphology is retained in the finished metal powders.
H.C. Starck decided to produce tantalum powders with small
spherical agglomerates. This special morphology of the magnesium-reduced tantalum powders shows a very tight particle size
distribution with very small average particle size (Figure 3).
More than 80% of the particles normally have sizes below 38 µm,
but flowability remains excellent. Pressing these powders results
in anodes with a homogenous press density distribution and
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• Optimal Terminal Creepage Design
Figure 3: Different Particle Size Distribution of Mg-Reduced Tantalum
Powders
high homogeneity. In addition, the variation in weight of these
anodes, even for very small capacitors, is distinctly lower compared to those prepared from conventional sodium-reduced
tantalum powders.
Comparing the SEM pictures of magnesium-reduced tantalum
powders with different surface areas, there is not a big
difference in the macroscopic particle morphology. They all
consist of comparable particle size distribution and particle shape
(Figures 4 and 5). Even the big pores that are included in each
powder particle are obvious in all powder grades. In enlarged
JULY/AUGUST 2007
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Figure 4: STA 50 KA (200 x)
Figure 6: STA 50 KA (10000x)—Mg-Reduced Tantalum Powder with
Surface Area of 0.9 m2/g
Figure 5: STA 150 KA (200 x)
SEM pictures, the main difference between the powders
can finally be observed. The higher the surface area, the
smaller the primary particles that build the macroscopic
spherical particles. (Compare Figures 6 and 2.)
Looking again at the SEM pictures in Figures 4 and 5, the
two types of pores inside each powder particle are distinguishable. The first type is large pores with a diameter of
more than 1 µm, which are determined by the tantalum
oxide precursor. The second type is small pores created by
the magnesium-vapour reduction. The diameter of these
pores are dependent on the size of the primary particles
and, therefore, on the surface area of the powder. The
higher the surface area, the smaller the smallest pores. Due
to their high mechanical strength of these spherical
agglomerates, they can be pressed to anodes still offering
12
JULY/AUGUST 2007
this bimodal porosity. The combination of big pores and
small particle diameter in the spherical magnesiumreduced powders is favorable for easy impregnation of
these anodes with the cathode material.
The most critical areas in sintered anodes are the sinter
necks between the primary grains, which are the smallest
cross sectional areas of the electrical path within this metal
structure. If the tantalum powder shows very high surface
area, these nodules are small, and therefore the necks
between them are also small. Two types of sinter necks can
be distinguished: the intra- and the inter-agglomerate necks.
The first (intra) connects the primary grains within one
agglomerate. The second (inter) connects the primary grains
of different agglomerates to each other. Both of them are
influenced by the initial powder surface area and the sinter
temperature of anodes. In addition, the inter-particle necks
are influenced by press density and sinter activity of powder.
Higher press density and sinter activity improve inter-particle
contacts and simplifies sintering.
The metal core in these narrow connections between
primary grains is partially consumed during growth of the
dielectric oxide layer by electrolytic oxidation. If there is
any neck in the sintered anode that is too thin, it will be
completely transferred to insulating tantalum oxide. Any
metal structure past the neck will drop out of the circuit
resulting in less capacitance of the anode. The SEM pictures (Figures 2 and 6) of the magnesium-reduced powders
display a very tight size distribution of the primary grains
and also shows that the size distribution of the sinter necks
between them is very tight. Therefore, the probability of
capacitance loss due to small sinter necks is very low.
To summarize, magnesium-reduced tantalum powders
CHEMICAL-POLYMERIZED P O LY P Y R R O L E
Conductive Polymer Aluminum for Electrolytic
Capacitor Technology
By Masashi Oshima
General Engineering Manager
Rubycon Carlit Japan
he last five years of growth and
popularity of flat-panel monitors
and television sets have dramatically driven the need for SMT conductive polymer aluminum electrolytic
capacitors. Advancements in digitalization, miniaturization, and higher
operating frequency have increased
the popularity with high-heat receptivity and low-profile form factor with
surface mounting. With this, key
elements for capacitors used in digital
circuitry are lower ESR and higher
capacitance.
In this article, I discuss the difficulties and solutions to the design and
production of the Rubycon PC-CON
Conductive Polymer Aluminum Solid
Electrolytic Capacitors. These capacitors employ the chemical-polymerized
polypyrrole as the cathode.
T
Polypyrrole
Pyrrole is a monomer material that
is easy to polymerize. It reacts with
various chemical oxidants to form
polypyrrole in a black powder form.
(See Figure 1.) However, if pyrrole is
mixed with oxidants in the roomtemperature
state, the polymerization
reaction starts
immediately.
Figure 1: Chemical
W i t h t h i s , Structure of Polypyrrole
polypyrrole
begins to form even before the chemical solution diffuses into the bottom
of narrow pits prepared on the
surface of the anode aluminum foil.
Thus, manufacturing aluminum solid
electrolytic capacitors employing the
14
Manufacturing Process and Construcchemical-polymerized polypyrrole has
tion of PC-CON
been difficult. The difficulty lies
The basic manufacturing process
in controlling the polymerization
starts when the aluminum oxide layer,
process, such as cooling and diluting
the dielectric, is formed on the
the chemical solution to lower its
surface of etched aluminum anode
density, which in turn slows the reacfoil by electro-chemical forming treattion speed; however, this re q u i r e s
ment. An electro-conductive layer is
r e p e a t i n g t h e polymerization
formed on the surface of aluminum
process multiple times.
anode foil by chemical polymerizaOn the other hand, when a pair of
tion. Then the polypyrrole layer is
electrodes is immersed into the
formed on top by electrochemical
pyrrole solution and supporting
polymerization. Carbon paste and
electrolyte and electric current is
silver paste are applied to form the
flown, polypyrrole forms on the
cathode electrode. Cathode elecsurface of the anode electrodes by
trodes are connected by throughelectrochemical polymerization. In
hole, and anode electrodes are conthis process, the anion of the
nected by wire bonding, to the outer
supporting electrolyte is captured
termination. Epoxy packaging and
into the polypyrrole as dopant,
the aging and inspection processes
resulting in the formation of a fine
complete the product manufacturing.
polypyrrole film with conductivity
See the basic structure of PC-CON in
of approximately 100 siemens/
Figure 2.
centimeters.
There are advantages in the
electrchemical
polymerization
method. One
is that the
polymerization
speed is controllable by current
density of electrochemical
polymerization.
Another is that
processing
conditions are Figure 2: PC-CON Structure
mild, such as
A uniquely developed etched
temperature and the neutral
aluminum foil, with the thickness of
non-acidic solution. Yet another
200 to 300 µm, which is two to three
advantage is when using masstimes thicker than conventional foil,
production techniques of electrolysis
polymerization, polypyrrole forms
is used. This enlarges the capacitor’s
value per unit surface area while conon the pre-formed electro-conducducting a deeper etching process.
tive layer on the etched/magnified
Thus, the number of stacks of the
surface of the aluminum anode foil.
JULY/AUGUST 2007
CHEMICAL-POLYMERIZED P O LY P Y R R O L E
etched aluminum foils is approximately half of normally
etched aluminum foils.
Leakage Current ( µ A)
PC-CON has features
that are more robust
– Voltage Applied
10
against reverse voltage
compared to tantalum
10
+ Voltage Applied
solid electrolytic capac10
0
5
10
itors. Furthermore,
Voltage (V)
there is no required
voltage derating, with
Figure 4: Leakage Current vs. Voltage
no protection circuitry
necessary. In addition,
they are less susceptible to short circuit failures, which are
a common mode for tantalum solid electrolytic capacitors.
10
4
–
+
2
Features of PC-CON
Extremely low ESRs are achieved by the use of low resistance termination materials and by the superb conductivity
of electrochemical polymerized polypyrrole, which is
employed on the cathode electrode.
ESR values at 100 kHz range from 9 to 50 milliohms in
the SL/SLE series, from 9 to 15 milliohms in the SXB/SXE
series, and from 7 to 10 milliohms on SW series. Figure 3
displays the typical frequency curves for the SW series of
low ESR (<10 milliohms) and its stable capacitance at the
resonant frequency.
The polypyrrole used on cathodes has an electronic conduction property that promotes low resistance with minimal effect at low temperatures. Such features present stable
temperature, capacitance, and ESR characteristics in
extreme conditions reaching as low as –55°C.
0
-2
Expansion Roadmap
An expanded PC-CON lineup is planned through developing higher capacitance and voltage (up to 16 V), along
with lower ESR. High frequency noise reduction, especially
in the GHz range, is becoming more important. In order to
respond to the need for high frequency noise reduction, a
low ESL feature is another theme for development.
Figure 3: ESR/Impedance vs. Frequency
Excellent performance and durability in high humidity
environments is achieved by using high-grade sealing
materials. Also, electrochemical polymerized polypyrrole
has excellent thermal stability with decomposition temperature over 300°C and can easily withstand the RoHS reflow
soldering temperature profile (250°C peak for 5 seconds).
Figure 4 indicates the voltage dependency curve rated at
6.3 V. The solid line represents the leakage current when
voltage with correct polarity is applied. Dielectric breakdown does not occur until the applied voltage reaches to
double the rated voltage. The dotted line represents the
leakage current when reverse voltage is applied. It indicates
no breakdown until a significant voltage level. Thus,
JULY/AUGUST 2007
15
5 Year Copper
4.0000
kitco.com
3.0000
2.0000
Jan. '07
Jan. '06
Jan. '05
0.0000
$US/lb
Jan. '04
1.0000
Jan. '03
during the firing process. These additives are one of the
“black secrets” of the MLCC industry, and according to
certain merchant suppliers, took almost 20 years to perfect.
The finished materials, however, actually add to the
performance of the finished X7R capacitor.
Regardless, the volume of material consumed as bullion
or feedstock will not differ from the ultimate volume of material consumed as powder, or paste, because the binders will
disintegrate upon firing and leave only the metals with which
it began. These binder materials are based on water-based
PVA acrylics, which disintegrate during the firing process.
In terms of value, however, each step—bullion/feedstock to powder to paste—will add value to the electrode
system. The conversion to electrode paste is typically
captive by the MLCC manufacturer and adds an additional
$5.40 to the production charge.
In the MLCC firing process (high or low fire), all the
organic materials will disappear after 500°C. This makes it
easier for market researchers to determine
Pd and Ag consumption in finished MLCC.
Thus, the MLCC manufacturer will
typically pay approximately $12.40 of electrode material beyond the bullion or
raw material costs.
Source: Kitco
Figure 3: 5-Year Copper Prices
shift away from these metals toward nickel and copper. Over
the past five years, the price for both these metals has
increased substantially; however, over the past year, the
prices have been stable and, therefore, their pricing will not
Pow(d)er for Passives
Copper Termination Powder for High Capacitance
MLCC
Copper powders and flakes, when combined together with glass frit and organic
binder materials, produce a termination
paste that is used with multilayered
ceramic chip capacitors produced with
base metal internal electrodes (BME
MLCC). The dramatic trend in the MLCC
industry, which has grown rapidly in Japan
since 1993 and is now taking a firm
foothold in North America, Europe, and
the Asian countries outside of Japan, is the
transference of internal electrodes and
external terminations employing precious
metals (palladium and silver) to less expensive base metals of nickel (internal electrode) and copper (external termination).
1 µm
1 µm
Nickel Powder
Palladium and silver metals are also consumed in MLCC for electrode and termination. About a decade ago, most MLCC
were made with palladium and silver. A
massive price increase in the metal in the
early 1990s and again in 2001 prompted a
Copper Flake
Copper Powder
Palladium and Silver Consumption for NPO and
Specialty MLCC
16
1 µm
JULY/AUGUST 2007
• unique competitive technology
• controlled size and shape
• high density and low shrinkage
Umicore Canada Inc.
10110 - 114 Street, Fort Saskatchewan, Alberta, Canada, T8L 4K2
tel: (780) 992-5700 – fax: (780) 992-5788
e-mail: [email protected] – website: www.umicore.com
TM
®
alpha CoolLytics
How many SMT electrolytics
are you hand soldering after
lead-free reflow?
Cookson Electronics is pleased to be the recipient of SMT
Magazine’s Vision Award for its ALPHA® CoolCap™ Rework
Technology, developed to protect adjacent components
from the stray heat of typical rework processes.
Now, new ALPHA® CoolLytics™, extends our unique thermal
management technology to protect temperature sensitive SMT
aluminum electrolytic capacitors during the SMT reflow process.
ALPHA® CoolLytics™ deliver:
• Active cooling to limit the peak temperature of the capacitor
while allowing SMT leads to reflow
• The ability to preserve the reliability of SMT Electrolytic Capacitors
by meeting the maximum component thermal specifications
• Compatibility with a variety of Lead-Free SMT reflow processes
• Pick and place compatibility from Tape and Reel packaging
To learn how ALPHA® CoolLytics™ can protect your electrolytic
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contact [email protected].
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Asia-Pacific Headquarters • 1/F, Block A • 21 Tung Yuen Street • Yau Tong Bay • Kowloon, Hong Kong • +852-3190-3100
© 2007 Cookson Electronics
Price Increases for Electrolytic Metals
Aluminum
The five-year analysis for aluminum
prices shows how raw aluminum feedstock have actually risen more than
100% during the last five years, while
average unit prices for aluminum
capacitors fell each year during that
time period.
Near-term price increases in aluminum at 11% year over year are not
as dramatic as price increases in
ruthenium or nickel.
The primary raw material consumed in the manufacture of aluminum electrolytic capacitors is the
thin aluminum foil. This foil must be
etched and electrochemically formed
before it can be wound as the dielectric support material for the finished
aluminum electrolytic capacitor. The
etching process is the single most
expensive process in the production
of aluminum electrolytic capacitors.
Most major world manufacturers of
aluminum electrolytic capacitors
attempt to control their processing
costs by owning and operating their
own foil processing plants. But no
major manufacturers of aluminum
18
1.2000
kitco.com
1.0000
0.8000
$US/lb
Jan. '06
0.4000
Jan. '07
0.6000
Jan. '05
Since 2002, the USD price of palladium has seen a maximum of $438
(early 2007), a minimum of $150
(2003), with an average of $264.37. As
of April 2007, the price was around
$350. (Source: Engelhard Corp.)
Since 2002, the USD price of silver
has seen a maximum of $14.89 (May
2006), a minimum of $4.26 (early
2002), with an average of $7.35. As of
April 2007, the price was around
$13.50. (Source: Engelhard Corp.)
1.4000
Jan. '04
Price Trend for Palladium and Silver
2002–2007
dissolved to increase the surface area
of the foil. This creates a dense, interconnecting network of small channels. The process involves running
the thin aluminum foil stock through
a chloride solution with an AC, DC, or
AC/DC voltage applied to the etch
solution and the aluminum foil. The
increase in the surface area of the foil
is known in the industry as foil gain.
Low-voltage foil gains can be as high
as 100 times, and high-voltage foil
gains can be as much as 25 times the
standard capacitance value of the
beginning thin foil.
5 Year Aluminum
Jan. '03
impact MLCC production in 2007.
It is important to note that today, most
of the world’s production of NPO-type
MLCC are still palladium-based because of the low number of layers, so
these systems remain air-fired systems.
Source: Kitco
Figure 4: 5-Year Aluminum Prices
electrolytic capacitors own aluminum
foil feedstock plants, so the general
starting point in the supply chain is
the purchase of the thin, high-purity
foil direct from the merchant market.
Foil Supply to the Aluminum Electrolytic
Capacitor Industry
There are approximately eight thin
foil suppliers, 20 anode and cathode
foil etchers, and approximately 100
winders of aluminum electrolytic
capacitors globally.
Thin foil suppliers supply solid
core and porous foils to the etchers,
who expose the foil to an electrochemical process in which the metal is
Tantalum Ore
Price increases for tantalum ore
are expected, due to overall increases in other non-noble metals, the
exhaustion of the DLA stockpile, and
the idling of the Greenbushes Mine
in Australia. Large price increases in
tantalum ore is not anticipated, as
the costs to produce tantalum capacitors exceed that of their competing
technologies (High Cap MLCC).
Tantalum capacitor manufacturers,
as a group, have the lowest operating
margins worldwide because of
their exposure to high priced raw
materials.
Average Tantalum Ore/Concentrate Prices: Average Global Price Per Pound: 1995-2006; 2007-2010
Forecast (Contract & Spot Price Combined)
$100
$89
$90
Gap in Ore Supply
Price Correction Forecasted
$83
$77
$80
$75
$70
$
$65
$61
$60
$
$53
$
$47
$45
$40
$55
$52
$
$54
$52
$50
$60
$50
$52
$30
$20
$10
$0
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005 2006E 2007F 2008F 2009F 2010F
Source: Paumanok Publications, Inc.
Table Notes: Reflects actual price paid by Cabot and Starck for tantalum ore under contract with SOG and other reliable vendors.
Excludes Cabot wholly owned Tanco Mine contract pricing.
JULY/AUGUST 2007
The Life & Times of Wet Tantalum Technology
tantalum industry has made significant changes to keep
abreast of material opportunities and techniques becoming available. The introduction of laser welding enabled a
hermetic glass-to-metal seal to be welded directly into a
tantalum case. It was then possible to produce an all-tantalum, hermetically sealed construction. We have now
moved to a period offering much greater CV values with
operating voltages up to 150 VDC, and temperatures to
200°C with suitable voltage derating above 85°C.
Until the more recent introduction of super-caps, wet tantalum provided the highest capacitance-per-unit volume than
any other available dielectric. We believe it still provides the
most environmentally rugged capacitor available.
Arcotronics Ltd. was arguably the first producer of wet tantalum capacitors. During the early 1950s, the technology
was created by Plessey’s Allen Clark Research Centre in
Caswell, Northamptonshire, UK. It was then later produced
by Plessey Components Division in nearby Towcester,
which in 1982 became Arcotronics Ltd. as part of a newly
formed Group centered on the Italian parent Arcotronics
Italia (also a part of the Plessey Group until 1982).
The early technology incorporated a tantalum powder slug
sintered to a tantalum anode plate with a silver cathode
plate. It was housed inside a nickel case to form a button
shape, or castanet shape as it was often referred to. This
became part of the reason the registered trade name
“Castanet” was first introduced all those years ago and is
still maintained to this day.
A main benefit and reason for developing the technology
was the potential for a dielectric with very high capacitance per unit volume. Another benefit was the ability to
provide a stable performance over the target market of
military equipments and systems; achieving the operating
conditions requiring a temperature range from -55° to
+150°C. Voltage ratings were restricted to 75 VDC and a
typical range was from 3 to 75 VDC, and a maximum
capacitance of 470 µF at 3 VDC.
The early construction using silver-based cathodes for
button and tubular types were perfectly reliable when
power supplies had low frequency ripple and sinusoidal
wave forms. They were later prone to silver migration
when inverter frequencies were increased during the early
‘60s to reduce the size of the associated transformer. The
higher inverter frequencies combined with possible
reverse current flow meant that, with time, the electrolyte
solution within the construction could form a conductive
stream of silver particles eroded from the cathode surface
by electrolysis action. Eventually, this led to a short circuit
within the units and a highly volatile condition.
Since those early days, as with most
industries that have survived, the wet
Applications range from reservoir capacitors, or hold-up
capacitors as they are often called, for switch-mode power
supplies, timing circuits, and any areas where large
capacitance combined with high levels of ripple current
capability are required. Their robust and stable construction provides the added advantage of being able to withstand high levels of shock and vibration, making them ideally suited to military, down-hole drilling, or similar
demanding environments.
During the early 1990s, multilayer ceramics presented a
threat to the industry by taking advantage of power supplies available with higher switching frequencies operating
in the MHz region, and therefore requiring much smaller
capacitance values for rectified ripple content reduction.
However, their appeal was soon restricted to more benign
environmental conditions than what wet tantalum could
cope with, thus excluding them from the larger section of
the available market.
The Arcotronics’ TH range of all-tantalum, tubular
capacitors are excellent examples of state-of-the-art
products. They still retain a reverse voltage potential, even
with the latest very high CV values. These capacitors can
also be easily built into modules consisting of series
or parallel configurations to make
more effective use
of PCB or chassis
space.
If the industry can
continue to take
steps to keep
abreast of, and
search for further
advances in suitable
materials,
there should continue to be a long and
interesting future for wet tantalum
technology.
More information contact:
Arcotronics America - Dan Viotto at [email protected]
BEST PRACTICES
GUIDE
EIA’s Innovation & Global Competitiveness
By Storme Street
Senior Director of Government Relations
EIA
T
he economic success of China and its unique role as a latecomer to Western traditions of
property rights, rule of law, and free market economies pose the greatest challenges yet for the U.S.
and Western companies doing business there. In April 2006, the Electronic Industries Alliance
(EIA) published Protecting Intellectual Property Rights in China: A Best Practices Guide, focusing
on intellectual property rights protection in China to help companies better understand the risks, responsibilities, and opportunities of producing valuable high-tech products and components in the global market.
This is the fifth and final installment in a series of excerpts from EIA’s Best Practices Guide. To
purchase the book, visit www.eia.org/ipr. For further information on EIA’s work in this field, including Congressional testimony, visit www.eia.org/innovation.
Excerpt: Administrative, Judicial, and Customs Measures in China
Administrative Action
Many years ago China created an “administrative” system
of IPR enforcement, which is available to owners of IP who
encounter infringement, in addition to judicial relief. The
administrative system was largely designed to answer
foreign complaints about the slowness and inefficiency of
the court system.
Unlike the administrative structures of IP offices in most
countries (including in the U.S.), the national offices of
the Chinese patent, trademark, and copyright offices are
represented nationally, provincially, and locally. The
Administration for Industry and Commerce (AIC) has the
power to enforce trademarks and to deal with acts of unfair
competition; the Administrative Authority of Patent Affairs
(AAPA) has the power to enforce patents and designs; and
the Administrative Authority for Copyright Affairs (AACA)
has the power to enforce copyrights. All three authorities
perform both administrative and judicial functions.
More importantly, these authorities have a great deal of
latitude in dealing with infringement problems. For example,
the AIC and the AAPA have the power to (a) enter premises
and seize goods, (b) order infringing acts to be stopped,
(c) order delivery up or destruction of infringing products,
(d) order an accounting of profits, and (e) levy fines. However, the authorities do not conduct pre-raid investigations,
nor do they involve themselves in the preparation and
filing of the complaint, which is the formal step
necessary to initiate their involvement.
Administrative action tends to happen quickly, typically
20
JULY/AUGUST 2007
MRA ...
A Leading Producer of Formulated
Ceramic Dielectric Materials
and Customized Multilayer
Technology Solutions.
COG Materials
X7R Materials
(Both COG and X7R materials compatible
with up to 95Ag/5Pd Electrode Systems)
Specialty
Compositions
To learn more about how we can supply
you with your dielectric material needs,
contact us at:
MRA Laboratories, Inc.
15 Print Works Drive
Adams, MA 01220 USA
Tel (413) 743-3927 • Fax (413) 743-0305
www.MRALABS.com
[email protected]
BEST PRACTICES
GUIDE
within a day or two of the filing of the initial complaint. It is best
to initiate actions wherever infringement occurs around
the country.
Legal Proceedings
Simultaneous with or following the administrative steps
outlined above, you may initiate legal action in the People’s
Court. Proceedings are relatively slow, taking at least six months
to reach a final hearing. But while this is much more timeconsuming than the administrative route, it is the only option
available for the award of damages. Although slow, the outcomes—particularly in large cities—have been favorable to foreigners in recent years. As well, injunctions may be available,
which is a significant change in China’s IP system as part of its
reformation of rules and procedures in the run-up to WTO
accession in 2001.
In 2005, the Chinese government took steps to ease the
transfer of administrative cases to criminal courts, but evidence
is still lacking that such transfers are occurring on a significant
scale yet. If you are considering legal proceedings, you might give
some thought to the availability of criminal prosecution for
infringement. The general assumption among policymakers in
Beijing and Washington is that increased criminal convictions
of IPR offenders will have a greater deterrent effect on future
infringement than civil or administrative proceedings.
BEST PRACTICE
Consider all of your legal options when you discover
infringement of your company’s IPR. In some cases,
simultaneous pursuit of both administrative and judicial
action may be the best course of action, while circumstances may rule out one option in other cases.
Customs Action
China promulgated regulations that allow the Customs
Office to halt both the export and the import at the frontier of
goods deemed to infringe IP registered in China. To save time,
it is highly recommended that you list your Chinese IP registrations with the Customs Office before a problem arises.
The Chinese Customs authorities can also be a very
useful tool for IPR protection, particularly when a company’s
primary concern is to stop inflows or outflows of infringing
goods at the border. For example, if a trademark owner suspects that counterfeit goods are about to leave or enter China,
it may request that the relevant customs authority detain the
suspected counterfeit goods. Such a request typically will need
to be accompanied by evidence of IP ownership rights; for
example, a trademark registration and prima facie evidence of
JULY/AUGUST 2007
23
BEST PRACTICES
GUIDE
infringement.
If the relevant IP has been registered with the General
Administration of Customs, you will be required to
produce only a registration number of the relevant rights.
In the event of a problem, this will allow Customs officials
to move quickly to seize the goods using their network,
which ties the 300-plus Customs Offices together. This will
not be done quickly if you have not previously listed your
registrations—and in the case of goods at the frontier waiting for export, quick action is everything. Registration of
intellectual property rights is good for 10 years.
• In what locale should I file a complaint of IPR infringement if I am seeking administrative or judicial action?
The local office of the relevant IP division in the area
where the infringement occurred should be your first stop.
However, if there are multiple counterfeiters, or if the
manufacturer and distributors are in different localities, it
is a good idea to consider “forum shopping.” If you are
stuck in court in the locus of counterfeiting, the deck is
often stacked against you unless you have local political
allies. However, if you can find a legitimate reason to bring
the case to a jurisdiction where local protectionism,
bribery, or corruption is less likely, it is worth pursuing.
Insider Advice
O
ne EIA member company advises that it is best to have
sufficient local/regional infrastructure, including welltrained personnel, in place for handling customs seizures
before registering your company’s trademarks with Customs in
China. Once a seizure of suspected counterfeit goods is made
and the trademark owner is notified, Customs officials will
generally hold the goods for only a few days before releasing
them. If a company does not have infrastructure in place to
quickly respond when seizures are first made, the counterfeit
products will be released by Customs.
“You must be able to respond in hours, not days or weeks,”
the company warns. They also advise allocating a budget for
periodic Customs education programs, to ensure officials are
up to date on your company’s products and any unique identification features they include that may assist Customs agents
in their identification of counterfeit goods.
r
st foires
ciali
Spe Free W
r
Lead tions foation
Solu r-Mitig
ske
Whi
• Which action will result in compensatory damages?
Ordinarily, only a judicial action will provide you with
compensatory damages.
SPECIALTY WIRES
• Can I undertake administrative action and judicial
action simultaneously?
Yes, particularly given that while each action should
result in the halting of infringement, they require different
procedures and may be used to target different sources of
infringing articles. Specifically, the administrative action
typically targets the distributor while the judicial action
typically targets the source. The possibility of receiving an
injunction through administrative action is worth pursuing, as it puts a hold on infringement while during the
judicial trial process. It has been a challenge in some cases
for companies to get injunctions in Chinese courts, but
administrative agencies have been less reticent.
ADOLF EDELHOFF
• What actions can the administrative agency take in
response to my filing of a complaint?
A cease and desist order may result, the goods may be
confiscated, and fines may be imposed.
24
JULY/AUGUST 2007
SPECIALTY WIRES
US Contact:
Component InterTechnologies Inc.
Phone: 724 – 253 – 3161 Ext. 210
E-mail: [email protected]
Am Großen Teich 33
D-58640 Iserlohn, Germany
Phone: (+49) 23 71 / 43 80 30
Fax:
(+49) 23 71 / 43 80 7930
Internet: www.edelhoff-wire.de
TECHNICAL
PA P E R
Enabling Thinner, High-Performance, Lower-Cost
MLCCs that Meet Environmental Regulations
Development of Second Generation, Pb Free,
Ultra Low Fire, High Voltage, X7(8)R Dielectric
Formulations
By Walt Symes, Mike Chu, Everette Davis,
and Joseph Capurso
Ferro Electronic Material Systems
Ferro Corporation
unique BaTiO3 and Additives
chemistry family and processing
technique was developed for
dielectric compositions that contain
no lead compounds and can be sintered at temperatures below 1000˚C.
Two formulations, one with K >2700
and X7R TCC, suitable for high capacitance multilayer capacitor applications
and the other with K >2000, X8R TCC,
and very stable high voltage properties,
suitable for BX and high voltage multilayer capacitor applications have been
developed and studied.
The low sintering temperature
enables the use of high Ag content
electrodes and the fact there are no
lead compounds included in these
two dielectric formulations offer two
advantages: 1) lowering manufacturing costs of multilayer capacitors and
2) meeting increasingly strict and
demanding environmental requirements of the marketplace.
A
Introduction
Multilayer ceramic chip capacitors
(MLCC) are widely utilized in highperformance electronic components
and have kept pace with the need
for smaller case size, higher capacitance, lower cost, and higher reliability. They also have encountered
increasing demands to comply with
environmental regulations and contain no environmentally hazardous
materials such as lead.
MLCCs generally are fabricated by
forming alternating layers of a dielectric paste and an internal electrodeforming paste. Such layers are typically formed by sheeting, printing, or
similar techniques, followed by concurrent firing. Generally, the internal
electrodes have been formed of conductors such as palladium, gold, silver,
or alloys of the foregoing.
Ceramic dielectric formulations
usually contain lead or lead compounds to reduce the sintering temperature from above 1250˚C to a
range of 1150˚ to 1050˚C1 to allow use
of lower-cost metal pastes with higher
silver:palladium ratios as inner electrodes. Excluding lead and/or lead
compounds in the ceramic formulation would permit the manufacturing
of multilayer capacitor devices meeting environmental regulations such as
Directive 2002/95/EC of the European Parliament and of the Council
of 27 January 2003 (RoHS).
Our work sought to develop a
method of producing a ceramic composition system without lead or lead
compounds that would be sintered at
temperatures below 1000˚C. Other
required characteristics included a
dielectric constant of greater than
2000 and a stable temperature characteristic (including when a DC bias
voltage is applied). This would permit
the use of a less costly electrode
material, such as >85% silver/<15%
palladium by weight, without sacrificing capacitor performance.
The Electronic Industry Association
(EIA)2 prescribes a standard for the
temperature coefficient of capacitance (TCC) known as the X7R characteristic. The X7R characteristic
requires that the change of capacitance be no greater than +/-15% over
the temperature range from -55˚ to
+125°C. The capacitor industry also
prescribes a standard for the temperature coefficient of capacitance with a
DC voltage bias applied (TCVC)
known as the BX characteristic. The
BX characteristic requires that the
change of capacitance be no greater
than +/-25% over the temperature
range from -55˚ to +125°C when a DC
bias voltage is applied.
Experimental
To prepare each dielectric composition for this study, a high purity
BaTiO3 powder was wet-mixed and
milled with proprietary dopant mixes.
After achieving an average particle
size of <0.8 micron, the powder was
dried and pulverized.
MLCC test samples were prepared
by processes that are well known in
the industry. The formulated powder
was binderized (PVB, PolyvinylButyral, Ferro B74001, Ferro Corp.,
Vista, CA) and then cast into tape for
screen printing with 90 Ag/10 Pd or
95 Ag/5 Pd internal electrodes (Ferro
Corp., Vista, CA). The electrode
printed tapes were then stacked, laminated, and cut into green chips. The
green chips were then put into a slow
binder burnout profile (over 48
hours) in air with a peak temperature
of 250°C. The chips were then placed
either on top of a zirconia sled or a
closed alumina crucible and sintered
in either a batch kiln or a tunnel kiln.
Typical temperature ramp up time
and typical soak time at the sintering
temperature were both four to six
JULY/AUGUST 2007
25
TECHNICAL
PA P E R
hours. Cooling time was about six hours. After sintering,
the fired chips were corner rounded, end terminated with
Ag/Pd, and fired at about 810°C.
Capacitance (Cap.), dissipation factor (DF), temperature coefficient (TCC), temperature coefficient with DC
voltage bias (TCVC), insulation resistance (IR), and breakdown voltage (BDV) of the chips were then measured.
The dielectric constant of the formulation (K) can be
calculated from values of capacitance (Cap., in farad),
active dielectric thickness of each layer (t, in cm), electrode
length (L, in cm), electrode width (W, in cm), and number
of active dielectric layers (N), according to the following
equation.
K = Cap.* t / (L*W*N*8.854*10-14)
Results and Discussion
Powder Properties
Figure 1 shows representative values of particle size,
measured by Horiba 950, and surface area, measured by
Quanta Chrome Nova 2000, of the powder prepared for
this study.
D90 (µm)
1.0-1.3
D50 (µm)
0.5-0.7
Loading Thickness Capaci- DF Calculated TCC TCC TCC RC 25˚C RC 125˚C Break(µm)
tance (%)
K
-55˚C 85˚C 125˚C (sec.) (sec.) down
(nF)
(v/µm)
930/4 Zr
10.4 75.0 1.82 2182 -16.1 2.5 9.4 7178 610
80
930/4 Al
11.0 71.5 1.79 2227 -16.3 2.9 10.0 9954 782
95
930/6 Zr
11.3 81.3 1.89 2637 -14.4 1.6 6.5 9025 528
96
930/6 Al
11.8 76.0 1.83 2609 -14.7 2.3 7.6 7822
714
84
940/4 Zr
11.5 82.7 1.86 2842 -13.1 0.6 5.4 7354 402
84
940/4 Al
11.1 78.6 1.82 2480 -13.6 1.2 6.0 6796
78
450
Zr = ZrO2 Sled
Al = Al2O3 Crucible
Figure 3: MLCC Properties of ULF X7R Powder
This powder can deliver a dielectric constant of about
2200 to 2800 with TCC meeting X7R and with very good IR
and breakdown properties. As shown in Figure 4, TCC of
this material will rotate clockwise when sintered at higher
temperature and/or with longer soak time. It is a characteristic of all the X7R materials.
0.3-0.4
Surface Area
(m2/g)
3.6-4.2
Figure 1: Particle Size and Surface Area of ULF X7(8)R Powders
Figure 2 shows the SEM view of the powder. XRD
analysis shows that these fine particle size powders have
tetragonal structure with c/a = 1.009 (after milling).
MLCC TCC (%)
D10 (µm)
Firing
(˚C/
Hr.)
903C/4H
930C/6H
940C/4H
Temperature (C)
Figure 4: MLCC TCC of ULF X7R vs. Firing Temperature and Soak Time
(5,000X)
(20,000X)
Figure 2: SEM of ULF X7(8)R Powder
ULF X7R Dielectric
Figure 3 shows basic dielectric properties of the chips
made with the ULF X7R powder and a 90 Ag/10 Pd electrode.
26
JULY/AUGUST 2007
Even when these chips were fired at below 1000˚C, the
microstructure is very dense.
Technology and cost drivers have resulted in MLCCs
being made at thinner and thinner dielectric thickness.
The clockwise TCC rotation and DF increase of chips with
thinner layers have presented great challenges to overcome. Thin layer capability of the ULF X7R material was
tested and estimated by measuring Cap., DF, and TCC with
higher applied AC RMS voltage. Figure 5 shows TCC of
ULF X7R as a function of AC test voltage and equivalent
dielectric thickness.
Figure 6 shows K and DF versus the equivalent layer
thickness. As seen from Figure 5, TCC can meet X7R at
2 micron or even lower dielectric layer thickness. As seen in
TECHNICAL
Temp (C)
11.5 µm
-55
-30
10
20
25
40
55
85
125
145
150
155
-12.8
-8.0
-2.7
-1.0
0.0
1.8
1.8
-0.1
5.8
-3.8
-9.7
-14.5
5.8 µm
3.8 µm
2.9 µm
-12.0
-2.7
-2.7
-1.1
0.0
1.9
1.6
-0.6
3.8
-7.7
-13.7
-18.5
-11.2
-7.3
-2.6
-1.1
0.0
1.7
1.3
-1.0
2.7
-10.2
-16.2
-20.9
-10.0
-6.6
-2.3
-0.9
0.0
1.7
1.2
-1.3
1.4
-11.5
-17.8
-22.6
2.3 µm
-9.4
-6.4
-2.2
-0.8
0.0
1.6
1.0
-1.7
0.3
-14.0
-20.2
-24.8
Figure 5: MLCC TCC of ULF X7R vs. Equivalent Dielectric Layer
Thickness
Thickness DC Voltage Voltage Stress
(Micron) (Volt) (Volt/Micron)
940/4
11.5
TCVC
at -55˚C
(%)
TCVC
at 0˚C
(%)
TCVC TCVC
at 85˚C at 125˚C
(%)
(%)
0
0.0
-13.1
0.0
0.6
5.4
10
0.9
-18.1
-5.2
-5.7
-2.6
25
2.2
-30.5
-21.1 -25.1
-25.8
50
4.3
-53.1
-47.9 -49.8
-49.0
(Meets BX (< +/- 25%)
at about 18 V DC
(1.6 V/micron)
Figure 7: TCVC of ULF X7R
pastes also contain ceramic additives as sintering inhibiters.
Figure 8 on page 28 shows the basic electrical properties of
the chips. Chips made with 95 Ag/5 Pd electrodes have
higher dielectric constants and more negative TCCs, especially at the high temperature side. It is also illustrated in
Figure 9. All other properties are similar to those chips
made with a 90 Ag/10 Pd electrode paste.
MLCC K
MLCC DF (%)
Figure 6, at 2 micron dielectric layer thickness, it is
estimated that an MLCC dielectric constant close to 3000
with DF less than 5.5% can be achieved.
Further extrapolation of the high AC
voltage data indicates that X7R TCC
could be met at less than 1 micron
dielectric thickness with a dielectric
constant >3100 and a DF <8%. Ferro’s
continuing work will seek experimental
verification.
Firing
(˚C/Hr.)
PA P E R
Equivalent Thickness (micron)
Figure 6: MLCC K and DF of ULF X7R vs. Equivalent
Dielectric Layer Thickness
The TCC characteristics of ULF X7R
when a DC bias voltage is applied (TCVC) is
shown in Figure 7. It meets BX specification
when up to 1.6 V/micron DC voltage is
applied.
Chips were also made with ULF X7R
powder with two experimental 95 Ag/5 Pd
electrode pastes. In this case, to better
match the sintering and shrinkage of the
electrode with the ceramic, these electrode
JULY/AUGUST 2007
27
TECHNICAL
Firing
(oC/Hr.)
920/6
930/4
940/4
PA P E R
Electrode
Loading
Thickness
(µm)
Capacitance
(nF)
DF
(%)
Calculated
K
TCC
-55˚C
TCC
85˚C
TCC
125˚C
95Ag/5Pd-1
95Ag/5Pd-2
90Ag/10Pd
95Ag/5Pd-1
95Ag/5Pd-2
90Ag/10Pd
95Ag/5Pd-1
95Ag/5Pd-2
90Ag/10Pd
95Ag/5Pd-1
95Ag/5Pd-2
90Ag/10Pd
95Ag/5Pd-1
95Ag/5Pd-2
90Ag/10Pd
95Ag/5Pd-1
95Ag/5Pd-2
90Ag/10Pd
Zr
Zr
Zr
Al
Al
Al
Zr
Zr
Zr
Al
Al
Al
Zr
Zr
Zr
Al
Al
Al
12.7
12.6
12.4
13.0
13.0
12.9
12.1
13.0
13.2
12.3
12.3
12.5
12.6
12.5
11.7
12.3
12.3
11.9
103.3
100.3
95.5
91.0
88.5
84.8
97.4
90.8
95.5
86.6
89.6
80.8
97.4
97.1
88.6
92.9
87.0
82.0
2.34
2.25
2.02
2.04
1.98
1.86
2.19
2.00
2.17
1.95
1.90
1.81
2.06
2.06
1.91
1.97
1.92
1.83
3369
3371
3311
3325
3117
2875
3233
3079
3379
2874
2963
2661
3357
3270
2803
2271
2941
2727
-12.2
-11.9
-13.2
-12.2
-12.0
-14.0
-12.8
-11.6
-13.0
-12.2
-11.8
-13.8
-11.9
-11.3
-13.0
-11.6
-11.5
-13.7
-5.2
-4.6
-3.2
-3.0
-2.8
-0.1
-3.3
-3.2
-2.0
-2.4
-2.2
0.1
-3.5
-3.4
-1.8
-3.0
-2.6
-0.2
-1.3
-0.9
1.0
1.1
1.0
-5.7
0.3
0.1
2.9
1.2
1.5
6.1
-8.2
0.6
3.0
1.3
1.4
5.2
RC 25˚C
(sec.)
257
3680
4038
5650
4862
6593
3361
3260
2063
3749
4129
3303
4247
3798
4249
4860
4048
4981
RC 125˚C Breakdown
(sec.)
(V/µm)
116
210
180
278
245
400
206
330
187
248
204
379
199
175
217
243
219
326
11
60
51
78
79
89
35
69
42
82
88
83
65
76
97
85
85
101
Zr = ZrO2 Sled
Al = Al2O3 Crucible
Figure 8: MLCC Properties of ULF X7R with 95/5 and 90/10 Ag/Pd Electrodes
MLCC TCC (%)
X8R Dielectric
With some modification of BaTiO3 and additive composition, a ULF X8R material was developed. Figure 10 on
page 39 shows basic electrical properties of chips made
with this material.
It demonstrates that a ULF X8R material with K about
2000 to 2200 can be achieved. Microstructure of this ULF
X8R material is similarly dense as ULF X7R material. Based
95Ag/5Pd-1
95Ag/5Pd-2
90Ag/10Pd
Temperature (C)
Figure 9: MLCC TCC of ULF X7R with 95/5 and 90/10 Ag/Pd Electrodes
on the same high AC voltage test, when chips are sintered
in Al2O3 crucible and at lower temperatures, this ULF X8R
material can meet X8R TCC down to about 5 microns
dielectric layer thickness with dielectric constant of about
2100 and DF of about 3%. Thin layer capability of the ULF
X8R material is not as good as the ULF X7R material
because of the intrinsic sharp dielectric constant decrease
of the BaTiO3 above its Curie temperature (125˚C). TCVC
of this X8R material meets BX when about 2.4 v/micron
DC voltage is applied.
Conclusions
At high quality RoHS-compliant, ultra low firing temperature (<1000˚C), high dielectric constant (>2600), X7R
dielectric formulation was developed. Thin layer (2 microns
or less) MLCCs can be made with this powder utilizing
95 Ag/5 Pd or 90 Ag/10 Pd electrode, resulting in significantly improved cost efficiency. The powder also has good
TCVC characteristics and meets BX specification in the
range of 1.6 v/micron (16 V/10 micron).
At high quality RoHS-compliant ultra low firing temperContinued on page 39
28
JULY/AUGUST 2007
T h e
P a u m a n o k
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A market research report that forecasts the global consumption volume, value, and pricing for capacitors,
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to industry needs, this report was designed for end-users of passive electronic components
who need to update their supply chain information on an annual basis for passive parts.
Future Price Forecasts
You’ll find future price forecasts for each passive component based on position in the fiveyear cycle—current capacity expansion, higher raw material prices (nickel, aluminum,
copper, Ruthenium, tantalum), and forecasted demand over the next five years for
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Major Vendors
All major vendors of passive components are discussed in this report, including:
AVX/Kyocera Corp
EPCOS AG
KEMET Electronics
KOA Corp
Nichicon Corp
Nippon Chemi-Con Corp
Panasonic Electronic Devices Co Ltd
Murata Manufacturing Ltd
ROHM Company Ltd
Rubycon Corp
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Sumida Electric Company Ltd
Taiyo Yuden Corp
TOKO Inc.
Tokin Corp/NEC
Vishay Intertechnology, Inc.
Walsin Technology
Yageo Corp
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NEWS M A K E R S
Electronic Component Orders Bounce Back
ARLINGTON, VA—Electronic component orders
bounced back in June from a small dip the month before,
according to the four-to-five week average index compiled
by the Electronic Components, Assemblies & Materials
Association (ECA). The 12-month average, which compares order growth to the previous year, remains flat.
Orders started slowly in the first week of June and picked
up momentum toward the end of the month, creating
some optimism for the rest of the summer. The overall
forecast for 2007 remains positive, but indicates a bit slower growth than last year.
“It’s nothing to jump up and down about, but the stable
growth of the last two years shows a more mature supply
chain that is able to chart a steady course through market
fluctuations,” says Bob Willis, ECA president. “I don’t think
we could say that five years ago.”
Web: www.ec-central.org
Rio Tinto and Alcan Reach Agreement
MONTREAL, MELBOURNE, and LONDON—Rio Tinto
and Alcan announced they have reached an agreement for
Rio Tinto to make an offer to acquire all of Alcan's outstanding common shares for US $101 per common share in
a recommended all-cash transaction. The offer represents a
total equity consideration for Alcan of approximately US
$38.1 billion.
Commenting on the offer, Rio Tinto Chairman Paul
Skinner said, "This transaction combines two leading and
complementary aluminum businesses and is a further step
in Rio Tinto's strategy of creating shareholder value
through investing in high-quality, large-scale, low-cost, and
30
JULY/AUGUST 2007
long-life assets in attractive sectors.”
The transaction is expected to create a new global
aluminum industry leader in bauxite, alumina, aluminum,
and technology, with a strong pipeline of attractive growth
projects for the future. Newly named Rio Tinto Alcan will
be the largest global producer of aluminum and bauxite,
based on current production. The acquisition of Alcan will
position Rio Tinto to capitalize on the strong demand
fundamentals of the aluminum sector.
Web: www.riotinto.com and www.alcan.com
AVX Enters into a Definitive Agreement to Acquire American
Technical Ceramics Corp.
MYRTLE BEACH, S.C.—AVX Corporation announced
that it has signed a definitive agreement to acquire American Technical Ceramics Corp.
John Gilbertson, President and
Chief Executive Officer of AVX
Corporation, stated, "The addition
of ATC further broadens AVX's offering in high reliability products. ATC is a premier brand
that we are proud to add to the advanced products group
of AVX. They are well recognized for their leadership in
the area of high frequency applications for a broad range
of commercial and military applications. No finer brand
name exists in many of those markets today. The combination of AVX and ATC offers exciting growth potential for
the years ahead."
Web: www.avxcorp.com and www.atceramics.com
Acquisition of Power Electronics Division of C&D Technologies, Inc. (US)
KYOTO, JAPAN—Murata Manufacturing Co., Ltd.,
announced it has signed an agreement with C&D Technologies, Inc. to acquire its Power Electronics Division (PED).
The acquisition will be finalized during the first half of FY
2007 upon receiving all necessary legal and regulatory
approvals and after fulfillment of the necessary condition of
the acquisition contract.
C&D Technologies is a power system specialist with its
headquarters in the USA. It consists of three divisions:
Standby Power Division, Motive Power Division, and the
aforementioned Power Electronics Division. The main PED
office is located in Mansfield, Massachusetts, USA, and it
develops, manufactures, and sells electric components
including DC/DC converters, AC/DC power supplies,
inductors, and transformers. It commands an especially
high market share for DC/DC converters.
Under the terms of the agreement, Murata will become
the sole owner of the PED business through the acquisition
NEWS M A K E R S
of the six subsidiaries of C&D Technologies, which together
constitute the PED business.
Web: www.murata.com and www.cdtechno.com
HolyStone Enterprise Co., Ltd. Expands into Europe
HolyStone Enterprise Co., Ltd., a Taiwan-based manufacturer of ceramic capacitors, announced the opening of HolyStone (Europe) Ltd., which is headquartered in Norwich,
England. HolyStone (Europe) is under the direction of John Plaskett. Mr. Plaskett is well
known in the industry with thirty years of experience in the capacitor field and has been
Managing Director of Syfer Technology, Ltd.
The new European operation, in addition
to U.S.-based HolyStone International established three years ago, is another step in expanding
HolyStone’s global presence and recognition.
Web: www.holystone.com.tw
Kamaya, Inc. Reopens U.S. Operations
Kamaya, Inc., announced it has reopened its operations
in the U.S. through a series of changes in the ownership of
Kamaya Electric Co. Ltd. Japan.
In 2006, Walsin Technology Corporation acquired the
majority shares of Kamaya Electric Co. Ltd. from Mitsubishi
Materials Corporation. As a result of that acquisition, the
supply channel for Kamaya-brand resistors for the North
American market will be handled by Kamaya, Inc., which
was a subsidiary of Kamaya Electric for over 25 years. All of
the same staff and facilities were kept together during the
Mitsubishi acquisition, therefore it was a fast track process
for Kamaya, Inc. to reinstate its business in Indiana, Texas,
and California.
Some of the items being offered for the first time by
Kamaya, Inc. include MLCCs, RF devices including Bluetooth, WLAN chip antennas, high frequency inductors,
and the standard line of Walsin resistors.
Web: www.kamaya.com
TTI Names KOA Speer a Platinum Level Supplier
BRADFORD, PA—KOA Speer Electronics, Inc.
announced they have earned the TTI Supplier Excellence
Award for 2006. KOA Speer Electronics is once again a
Platinum Level recipient from TTI, an honor that can only
be reached by receiving the Supplier Excellence Award for
five consecutive years. KOA Speer has been an award recipient in 11 of the 12 years TTI has presented this recognition.
KOA Speer Electronics was presented with this award for
their dedication to TTI, management’s commitment, and
32
JULY/AUGUST 2007
their overall operating philosophy for excellence to ensure
customer satisfaction.
The TTI Supplier Excellence Award represents the highest recognition possible of a supplier’s performance within
TTI. The program is centered on quality measurements
that include on-time delivery, receiving quality, customer
quality, administrative quality, and business systems. In
addition, there are performance measurements including
sales results, profitability, and percent growth.
Web: www.koaspeer.com and www.ttiinc.com
Valeo and Maxwell Technologies Agree to Collaboratively
Develop Ultracapacitor-Based Energy Storage System for
Hybrid Autos
SAN DIEGO, CA—Maxwell Technologies Inc. announced it has signed a memorandum of understanding
(MOU) with Valeo, a Tier 1 supplier to automakers worldwide, covering a development collaboration to incorporate
Maxwell’s BOOSTCAP® ultracapacitors in Valeo’s next-generation StARS+X “stop-start” and regenerative braking
system. This system reduces automobile fuel consumption
and emissions and powers additional electrical functions.
The new 14+X StARS (starter alternator reversible
system) consists of a reversible starter-alternator, a multicell ultracapacitor energy storage module, and other
power and control electronics in a 14 V architecture that
enables standard gasoline and diesel engines to shut down
during idle phases and restart instantly, eliminating fuel
consumption and emissions anytime the vehicle is stopped.
Valeo estimates that the system can reduce fuel consumption and associated emissions by about 12% in normal
operation and more than 20% in stop-and-go urban traffic.
The flexible 14+X system’s ability to be adapted for integration with a wide variety of existing motor platforms and
to be applied to any new fuel technology, such as flex fuel,
will make time-to-market for new models incorporating it
much shorter than more radical hybrid approaches.
Dr. Richard Balanson, Maxwell’s president and chief
executive officer, said that the MOU also covers terms of a
proposed multi-year development and supply agreement
through which Valeo will source ultracapacitors from
Maxwell.
“This design win is the result of an extensive collaborative development effort, and it reflects the progress
Maxwell has made in developing and manufacturing products that meet the very demanding performance requirements of the auto industry,” Balanson said. “We continue
to work with automakers and other Tier 1 suppliers worldwide to enable new applications such as this one and
achieve the broadest possible penetration of this large and
strategically important market.”
Web: www.maxwell.com and www.valeo.com
Reach the global
passive component
industry decision makers
by marketing in the only
magazine dedicated exclusively
to the global passive component
industry —
Passive Component Industry Magazine
Passive Component Industry Magazine
is read by key players in all aspects of the
passive industry—from raw materials,
to manufacturers, to end-users.
For more information on Passive Component Industry Magazine
contact Mitch Demsko at
[email protected]
PRODUCT W AT C H
The Latest Product Release News from the Passive Component Marketplace
New WK73 Wide Terminal Resistor Ideal for High Power
Applications
KOA Speer Electronics introduced its new WK73 wide
terminal flat chip resistor that features higher power
ratings as a result of its enhanced heat dissipation, as
demonstrated by the WK73S3A type (1225 size) with a 1.5 W
rating versus KOA Speer’s RK73B3A type (2512 size) with a
1 W rating. The WK73 offers current sensing for power
supply circuits, which makes it
ideal for automotive electronics,
ECUs, anti-locking braking systems, and air bag systems.
Its wide terminal construction gives the WK73 resistor superior thermal shock characteristics and high solder joint
reliability. The resistance range of the WK73 is 22 m to ~1
M and the T.C.R. is ±100, ±200, ±300, and ±800 ppm/°C.
The available tolerances are ±1% and ±5% with a high
power rating of 1.0 W and 1.5 W at 70°C. This wide terminal flat chip resistor sizes include 1020, 1218, and 1225 and
it is RoHS-compliant.
Typical lead time is 10 weeks, packaging: 4,000 pcs/7"
embossed plastic with small quantity pricing at $0.50 each.
Samples and sample kits are available upon request.
Web: www.koaspeer.com
Tecate’s 2.7 V PowerBurst® Ultracapacitor Line Now Features
Cells Ranging from 0.5 F to 300 F
Tecate Industries announced the newest members of the
2.7 V PowerBurst family of cylindrical, radial leaded ultracapacitor cells. Comprised of the 100% RoHS-compliant
TPL and TPLS Series, PowerBurst ultracapacitors are available in values ranging from 0.5 F to 300 F.
The electrochemical double-layer capacitors (EDLCs)
34
JULY/AUGUST 2007
offer extremely low ESR for high power and low loss during
operation. The lightweight, small form factor parts are
maintenance-free, boast a wide operating temperature
range, and offer a limitless charge/discharge cycle life (500
K cycles) along with high useable capacity. Moreover, these
low leakage current ultracapacitors charge quickly and
safely, and deliver frequent energy pulses without harmful
effects or reduced life.
They notably feature an operating temperature range
from -40° to +70°C, making them a logical alternative to
batteries in very low-temperature applications.
The TPL Series is provided in 18 specific capacitance
values ranging from 0.5 to 70 F, and in sizes from 8 (D) x 12 (L)
to 18 (D) x 45 mm (L). The TPLS Series is offered in four
specific capacitance values ranging from 100 to 300 F, and
in sizes of from 22 (D) x 45 (L) to 35 (D) x 50 mm (L).
PowerBurst ultracapacitors feature a capacitance tolerance
of -20% to +30%.
In quantities of 1 K, pricing for Tecate’s TPL Series of
2.7 V PowerBurst ultracapacitors is $1.70 each for parts
with a capacitance of 10 F, while the TPLS Series’ pricing is
$7.50 each for parts with a capacitance of 100 F. Delivery is
from stock to 6 weeks ARO. Custom orders are welcome.
Web: www.tecategroup.com
Umicore, Next-Generation Nickel Powder
Spherical and non-agglomerated next-generation nickel
powders with controlled size distribution and high oxidation resistance are very well suited for electrode layers in
multilayered ceramic capacitors. Particle size and distribution are designed to minimize sinter shrinkage difference
with the dielectric, thus it prevents cracking.
Umicore applies its proprietary autoclave technology to
produce nickel powders with an
average diameter of 200, 400,
and 800 nm from an aqueous
nickel salt solution using
hydrogen under high pressure
and temperature.
The major benefit of autoclave technology is not only the
large-scale effect but also a controlled narrow particle size distribution. The narrow size distribution permits drastic reduction of micron size particles, which are detrimental in everthinner nickel electrodes. The new development, ENP 200 S,
has less than 10 particles in about 100 photos, which were confirmed by a Scanning Electron Microscope. Total particles
counted were 40,700. Number of fields was 100. And the percent particles > 1.0 µm was 0.017%.
Web: www.umicore.com
PRODUCT W AT C H
Device Utilizes SuperTan® Technology to Provide Low ESR of
0.035
Vishay Intertechnology, Inc. announced the release of a
new wet tantalum high-energy capacitor that offers the
highest capacitance of any similar device on the market.
The HE3 features a unique case design with SuperTan
technology for improved reliability and performance in
high-energy applications.
Optimized for energy-storage and pulse-power applications in high-reliability avionics and military devices,
Vishay’s HE3 is housed in an all-tantalum, hermetically
sealed case, and is manufactured to withstand high stress
and hazardous environments.
The design features a unique
double seal for improved reliability
and performance,
while providing a
capacitance range
of 3300 to 72,000 µF,
the highest capacitance per unit
volume of any wet tantalum capacitor.
The HE3 represents a major breakthrough in wet tantalum capacitor technology by utilizing Vishay’s proven
SuperTan hybrid cathode technology in combination with
industry-leading anode designs. Its ESR is a very low 0.035 Ω
at +25°C and 1 kHz.
The new capacitor operates over a temperature range of
-55° to +85°C. It offers a ±20% standard capacitance tolerance at 120 Hz and +25°C, with tolerances of ±10% also
available.
Lead times for delivery is approximately 8 to 10 weeks
for larger orders. Pricing for U.S. delivery ranges from
$250 to $750 each.
Web: www.vishay.com
RCD Introduces Ultra-Precision TO126 & TO220 Resistors to
0.025%, 2 ppm
RCD Components Inc. announced the expansion of the
popular MP Series of TO-style power film resistors. The
precision TO126- and TO220style power resistors have tolerances to 0.025% and temperature
coefficients to 2 ppm. Uses include
precision and/or low distortion
power supplies, LSI test, motor control, UPS, electronic
load, high frequency amplifiers, medical power supplies,
and equipment, etc.
Pricing for 0.1% 5 ppm parts start at under $10 each
with deliveries initially at 8 to 9 weeks, with shorter lead
times available.
Web: www.rcdcomponents.com
High Voltage SMD Mica Capacitors Offer Better Performance
Than Porcelain in RF Applications
Cornell Dubilier Electronics (CDE) has expanded its series of multilayer RF chip capacitors. The new 2500 VDCand 4000 VDC-rated Type MCH uses high-Q alumina
silicate (mica)/resin/epoxy construction to avoid cracking
and delaminating associated with porcelain and NPO
ceramics in large SMD sizes. The natural rugged flexibility
and high temperature threshold of these chips is compatible with FR4 boards and permits wave soldering. A nonmagnetic version, MCHN, is available for applications
where strong magnetic fields are present, such as MRIs.
Type MCH and MCHN are designed for use in high RF
power designs where stability and low losses are critical.
Applications include MRI coils, plasma chambers, baluns,
lasers, RF power amplifiers, antennas, and transmitters.
Type MCH is available in a 3838 (.380% x .380%) (9.9 x
9.9 mm) case size, surface mountable package. The cataloged capacitance values range from 10 to 220 pF at 4000
VDC and up to 1000 pF at 2500 VDC. The MCH boasts
lower ESR, higher-Q, and higher current-carrying capability
than other similar dielectrics, including porcelain and NPO
ceramics.
Pricing begins at under $5 each in OEM quantities. Leadtime is stock to 8 weeks from authorized CDE distributors.
Web: www.cde.com
EPCOS Publishes EMC Filters Product Profile 2007
EPCOS has published a full-color, 62-page brochure titled
EMC Filters Product Profile 2007. The publication features:
• Selector guide
• Detailed data-regarding filters for power lines (1-, 2-,
3-line filters for regenerative converters, and customer-specific filters)
• Detailed data-regarding
shielded rooms (filters for
power lines and for communication lines)
• EPCOS services and accredited EMC laboratory
• Mounting instructions
• Components for discrete
filter solutions
• Environmental protection
Free copies of EMC Filters Product Profile 2007 are available.
Web: www.epcos.com
JULY/AUGUST 2007
35
PRODUCT W AT C H
Taiyo Yuden’s New High-Frequency Inductors Typically Offer
100% or Better “Q-Factor” Improvement vs. Previous HK
Series Devices
Taiyo Yuden announced the mass-production availability
of its AQ105 series of high-frequency inductors for matchingcircuit applications in cell phones, notebook PCs, and other
wireless-enabled computer and communications devices.
AQ105 series inductors employ a proprietary simulation
technique that optimally characterizes the device’s structural attributes to produce a typical Q-value improvement
of 100% or higher as compared to the company’s earlier
HK-series inductors. At a measuring frequency of 0.8 GHz,
for example, the AQ105-2N2
device achieves a typical Qvalue of 67 versus 31 for
the HK1005-2N2-series device
with similar physical and electrical characteristics.
At 1.8 GHz, the same AQ
series part provides a Q-value
of 101. This is important because cell phones, notebook
PCs, PDAs, and other computer
and communications devices
are increasingly integrating
Bluetooth®, wireless LANs,
radio, TV, and even GPS reception into the same unit.
Sending and receiving on multiple frequencies in a single
device requires a large number of matching circuits to
ensure proper operation of high-frequency circuits and modules. For this reason, demand has greatly increased for the
types of high-frequency inductors critical to this application.
Production capacity for AQ series high-frequency inductors has now reached 20 M units per month. Sample price:
$0.10 each in OEM quantity.
Web: www.yuden.us
New Sub-1 mm Surface Mount Chip Inductor Supports High
Frequency Electronic Circuitry
With a sleek sub-1 mm square surface mount chip footprint, the new DR354-0 Chip Inductors from Datatronic
Distribution, Inc., feature a miniature design that delivers
superior performance and value in high frequency circuit
designs for a wide range of electronic equipment.
The DR354-0 Chip Inductors provide reliable protection
against challenging EMI problems in high frequency filtering applications. This miniature wire-wound inductor features a low-seated height that stands only 0.66 mm above
the circuit board. It protects sensitive electronic circuitry
and ensures high performance operation in a wide range
of compact devices.
36
JULY/AUGUST 2007
The surface mount DR354-0 Series Inductors are available in a wide range of inductance values to meet the needs
of just about any circuit. They are ROHS-compliant and in
accordance with J-STD-020C, with no lead to prevent damage to the environment.
Depending on the specific model, the DR354-0 Series
Inductors feature an inductance range from 1.0 to 68 nH,
with a DCR from 0.054 to 0.0912 Ω maximum, over a maximum current rating from 150 to 1360 mA. They are compatible with extreme temperature environments, ranging
from -40° to +125°C.
With their miniature wirewound chip design, the
DR354-0 Inductors come in small package size of 0.64 (W)
x 1.19 (L) x 0.66 mm (H). They are compatible with highspeed pick-and-place assembly equipment, and are also
suitable for high-temperature soldering.
Custom designed DR354-0 Inductor packages can be specified to meet unique circuit requirements. The standard
configuration DR354-0 Inductors are priced from $0.14 each
in typical production volumes. Lead-time is stock to six
weeks. Volume OEM pricing is available upon request.
Web: www.datatronics.com
SMT & Radial Polymer Capacitors from Jianghai
Jianghai, a manufacturer of aluminum electrolytic capacitors in China, announced the product range of SMT,
radial, snap-in, and screw-terminal capacitors now includes
polymer-technology. Jianghai’s new SMT series HCV and
radial series HPS completes the existing polymer series
HCP (radial). Due to lowest ESRvalues (10 to 50 mΩ) of polymertechnology, the highest ripple
currents (up to 5400 mArms
105°C) can be managed, which is
required in computers, DC/DC converters, and back-up
systems. A voltage range between 2.5 and 16 V with
capacitances of 68 to 1500 µF is offered.
All products from Jianghai are lead-free and conform to
RoHS/WEEE.
Web: www.jianghai-europe.com
PRODUCT W AT C H
Nichicon Announces New F72 Tantalum Capacitor Values for
PCMCIA Card Designs
Nichicon has extended the range of its low profile F72 tantalum capacitor to include 1500 µf and 2200 µf 6.3 V
values that meet the low profile (2 mm)
and high capacitance demands of
PCMCIA cards. In addition, the F72
series features a small size, low ESR,
low leakage current, capacitance stability at various temperatures, and long life.
Samples of part numbers F720J158MXJAQ2
and F720J228MXJAQ2 are now available, as well as
production quantities.
Pricing is $1.95 and $2.55 in production volume.
Web: www.nichicon-us.com
Cooper Bussmann Announces Launch of KR Series 5.5 V Coin
Cell Supercapacitors
Cooper Bussmann PowerStor® has extended their supercapacitor product portfolio to include 5.5 V coin cell
packages to address the continued growth in real-time
clock (RTC) and memory back-up power applications.
The new PowerStor KR series coin cell offers high
capacitance in industry standard horizontal, vertical, and
cylindrical package styles. Parts are available in six capacitance values from 0.1 to 1.5 F with a working voltage of
5.5 V and a surge voltage capability of 6.3 V. All values have
a -25° to +70°C operating temperature range and are
supplied in a bulk pack quantity of 500 pieces.
The KR series is designed for use in products such as
DVD players, set top boxes, digital radio, photocopiers,
computers and peripherals, and HVAC controls. Cooper
Bussmann PowerStor also offers standard and custom
supercapacitors up to 100 F as singles and in packs that can
be configured to suit a wide variety of applications ranging
from toys to automated meter readers and hybrid vehicles.
Web: www.cooperbussmann.com
ECI’s 5MPA Series Metallized Polypropylene, UL-Recognized
Component with Low Loss Dry Film Construction
Electronic Concepts, Inc.’s new 5MPA series is for
AC-motor run applications where high PWM and other
feedback currents are present on top-of-the-line frequency.
The 5MPA has unique high current and frequency
response terminations, plus a dry film construction.
Values up to 100 µF are supplied with an exclusive "bridge
and bolt" construction—both with multiple internalsoldered contact points for high current distribution. Units
are wrapped with flame-retardant insulating sleeves and endfilled with a flame-retardant potting compound. Current
handling capabilities are from normal line frequency
currents to 83 A, RMS from 2 KHz to resonant frequency.
Each capacitor also undergoes a series of electrical property
tests to ensure in-the-field quality.
Web: www.ecicaps.com
High Precision, Current Sensing Power Resistors with
ISA-PLAN® Technology
The range of ISABELLENHÜTTE´s precision power
resistors covers the complete spectrum of simple low-ohmic
precision resistors up to high-power resistors. With the ISAPLAN technology developed by ISABELLENHÜTTE, the
resistance components are manufactured from etched,
solid manganin foils and electrically insulated and mounted
to a substrate with good thermal conductivity. Besides the
two- and four-terminal connection for conventional mounting, there are five established SMD product families available
that cover nearly all requirements in the automotive, power
electronics, energy metering, and medical industries.
The precision current sensing resistors guarantees high
nominal power at small sizes, low temperature coefficient,
lowest tolerances available, excellent long-term stability, resistance values down to 0.1 mΩ, and high-pulse load capacity.
Web: www.isabellenhuette.com
Caddock Introduces Current Sense TO-Style Power Resistors
Caddock Electronics’ MP Series of TO-Style Current
Sense Resistors offers a wide range of package options for
current sensing applications. The MP Series resistors are
ideal for use in power electronics circuits where a higher
voltage signal is needed due to a noisy environment, or
where a minimum load is required by the circuit. The compact heat sink mountable packages allow higher power
dissipation in a compact design without creating excess
heating inside the electronics assembly. The non-inductive
design allows these TO-Style current sense resistors to operate in high frequency applications and switching circuits.
The MP Series of TO-Style Current Sense Resistors offers a resistance range of 0.005 to 0.009 Ω available to ±5%
tolerance, and 0.010 to 0.019 Ω available to ±2% tolerance,
and 0.020 Ω and above available to ±1% tolerance. The
current and power ratings are: for the TO-126 Style, up to
35 A or 25 W +25°C case temp; for the TO-220 Style, up to
40 A or 50 W +25°C case temp; for the TO-220 Clip Mount,
up to 60 A or 60 W +25°C case temp; and for the TO-247
Style, up to 44 A or 100 W +25°C case temp.
Lead time is seven weeks ARO. Most standard resistance
values are available from Caddock inventory and from
catalog distributors.
Web: www.caddock.com
JULY/AUGUST 2007
37
PRODUCT W AT C H
KEMET Announces Expansions in the T491, T495, and T499
Surface Mount Tantalum Capacitor Product Lines
KEMET continues to expand its surface mount tantalum
capacitor product lines with 14 new releases in the T491/4
Commercial, T495 Low ESR/Surge Robust, and T499 High
Temperature series.
KEMET expanded its T491/4 Commercial series with the
release of four new CV offerings, such as the 1000 µF, 6.3 V X
Case (7343-43) and the 220 µF, 16
V D Case (7343-31). The T491/4
series remains a popular choice
among designers interested in
high reliability solutions with high
capacitance needs in space-restricted applications.
Ten new T495 Low ESR/Surge Robust part types have
been released in a variety of case sizes, capacitance offerings, and voltage ratings. One offering is the D Case (734331) 220 µF, 16 V design available with ESR options of
150 mΩ and 200 mΩ. In addition, KEMET has expanded its
offerings in the T495 E Case (7260-38) with the release of
five new part numbers available in capacitance values from
33 to 470 µF with voltage ratings from 10 to 35 V and ESR
options from 40 to 200 mΩ. KEMET's low ESR T495 series
was designed for applications with high surge current
potential such as DC/DC converters and output filtering
on power supplies.
KEMET has also expanded the T499 High Temperature
(175°C) series with the introduction of a customer-driven
request for a low ESR version of the 220 µF, 10 V X Case (734343) with a maximum ESR of 250 mΩ. This lower ESR results
in improved performance in high temperature applications.
The T499 series was designed to deliver stable and reliable
performance in extreme temperature applications such as
automotive under-the-hood applications and oil exploration,
and is rapidly gaining popularity in these industries.
These new releases are available in RoHS-compliant (Pbfree) finishes and are capable of meeting the 26˚C peak
Pb-free profiles.
Web: www.kemet.com
Stackpole Electronics, Inc. Introduces the Non-Inductively
Wound Conformal Coated Wirewound Series NWW
Stackpole Electronics, Inc. introduces their non-inductive version of the standard conformal coated, leaded, wirewound series WW. Designated the NWW, this product
offers the same robust performance expected from a
wirewound technology with the added characteristic of
vastly improved inductance. This non-inductive winding is
available in all standard WW sizes from .6 to 13 W.
Wirewound technology has long been known as a leading technology for power resistor needs. The most critical
drawback with this technology is that it is inherently
38
JULY/AUGUST 2007
inductive. This is logical, given that a wirewound inductor
and a wirewound resistor are made with essentially the
same materials and processes. This fact limits the use of
wirewounds for applications with high switching speeds,
which require low inductance. Now the same standard wirewounds can be used for these applications by using a noninductively wound version. This manufacturing method
greatly reduces the inductance of any given resistor size
and value combination; however, it does not completely
eliminate the inductance.
A non-inductively wound wirewound has one winding in
one direction, and one in the other direction, known as
Ayrton Perry winding. A byproduct of this design is that
this creates two resistors in parallel in each device. Because
of this, non-inductive wirewounds have an upper resistance
range limit of half the value possible with a standard winding. For ease of use, Stackpole has listed a non-inductive
resistance value range on their data sheets, along with the
standard range.
The WW and NWW series are both RoHS-compliant and
offer standard tape-and-reel packaging in 250- to 2500piece increments, depending on size. Pricing is size- and
value-dependent, but ranges from $.16 each to $1.06 each
for minimum quantities. Standard lead-time for this
product is stock to 8 weeks.
Web site: www.seielect.com
Aluminum & Film
Capacitors
If interested in submitting
an article, contact
Mitch Demsko by
August 31, 2007 at
[email protected]
or call (919) 461-8128
PRODUCT W AT C H
IRC’s TO-247 Power Resistors Feature High Stability Elements
for High Frequency, High-Speed Pulse Applications
Providing high-power resistive devices in a stable transistor-style package, TT electronics IRC Advanced Film Division’s MHP Series TO-247 power resistors are available in
100 W and 140 W packages.
According to Gary Bleasdell, thick film business unit
Director for IRC Advanced Film Division, the resistors are
specified for applications that require accuracy and stability.
“The MHP Series resistors are designed with an alumina
ceramic layer that separates the resistance element and
mounting tab,” said Bleasdell. “This construction provides
very low thermal resistance while ensuring high insulation
resistance between the terminals and the metal back plate.
As a result, the resistors feature a very low inductance,
making them ideal for high frequency and high-speed
pulse applications.”
Additional applications for the MHP Series TO-247
resistors include automation test equipment, high frequency
snubber and pulse handling circuits, motor control and
drive circuits, switch mode power supplies, load resistors,
automotive electronics, industrial power equipment, UPS
systems, and industrial computers.
The MHP Series 100 W and 140 W resistors feature a
resistance range of 0.01, inductance value of <50 nH, and a
voltage rating of 700 V. Absolute tolerances are to ±1% and
±5, with absolute TCRs to ±100 ppm/°C. Operating temperature range is -40° to +85°C. IRC will also produce
devices outside these specifications to meet customer
requirements. The MHP Series power resistors are available
with RoHS-compliant terminations. Pricing for the MHP
Series TO-247 power resistor is $4.58 each in quantities of
1 K. Lead time is stock to 10 weeks.
Web: www.irctt.com
Technical Paper
ature (<1000˚C), high dielectric constant (>2000), X8R
dielectric formulation also was developed. This enables thin
layer (5 microns) MLCCs to be produced utilizing significantly
lower cost 95 Ag/5 Pd or 90 Ag/10 Pd electrode. The powder
also has good TCVC characteristics and meets BX specification
in the range of 2.3 v/micron (11.5 V/5 micron).
Firing
Loading
(˚C/Hr.)
Thickness Capacitance DF
(µm)
(nF)
(%)
References
1. M.Chu, C.Hodgkins, D. Rose, US Patent 4,540,676, Seo.
1985
2. EIA RS198D publications
Editor’s note: This paper was previously released at the CARTS
USA 2007 conference.
Calculated
K
TCC
-55˚C
TCC
85˚C
TCC
125˚C
TCC
150˚C
RC 25˚C RC 150˚C
(sec.)
(sec.)
Breakdown
(V/micron)
930/4
Zr
13.7
56.2
1.74
2136
-8.2
-1.9
2.4
-11.8
1718
31
81
930/4
Al
13.3
54.4
1.71
1989
-8.5
-1.4
2.6
-10.8
1968
49
86
930/6
Zr
13.8
58.8
1.79
2265
-7.0
-2.8
1.6
-14.5
1625
28
85
930/6
Al
13.7
59.3
1.74
2110
-7.2
-2.7
1.1
-13.1
1819
45
83
940/4
Zr
13.7
57.3
1.73
2094
-7.4
-2.2
1.4
-11.2
1601
29
85
940/4
Al
13.6
54.7
1.70
2120
-7.9
-1.7
1.7
-10.3
1729
45
139
Zr = ZrO2 Sled
Al = Al2O3 Crucible
Figure 10: MLCC Properties of ULF X8R
JULY/AUGUST 2007
39
from H.C. Starck can be offered for capacitors with very
high volumetric efficiency:
• High chemical purity (> 99.95%) with respect to
"harmful" elements such as C, Fe, Cr, Ni, Al, Na, K,
and F.
• Highest specific surface area for storage of high
charges.
• Open-pore structure that allows good impregnation
with the counter electrode precursor.
• Spherical powder agglomerates showing good flowa-
•
•
•
•
bility, which allows use in fully automatic high-speed
presses.
Small powder agglomerates with narrow-size distribution resulting in small-weight variations, even for tiny
anodes.
Strong agglomerates resulting in high-crush strength
and open porosity of capacitor anodes.
High-sinter activity for good particle bonding to each
other and to the wire.
Sponge-structured agglomerates with very homogenous sinter necks between primary grains.
Letter from ECA
goods, doesn’t mean the industry at all levels should abdicate
the fight to protect itself against them.
AVX’s Millman offers the following anti-counterfeiting
measures for manufacturers:
• randomized lot coding that maintains traceability
• subtle indicators on labels, reels, tape, and products
• identification markers on reels, labels, and products
• traceability of purchase orders
• warnings of counterfeit products posted on the manufacturer’s Web site
For electronic component buyers, Millman provides
these tips:
• Buy from the manufacturer directly or from a franchised distributor.
• Contact approved suppliers that can cross-reference
alternate parts and legitimate second and third sources.
• If you have to ask for assistance to identify whether a
part is genuine, it is most likely counterfeit.
• Once identified, a counterfeit product should be
destroyed and not allowed to re-enter the supply chain.
• A counterfeit product is evidence of a crime; pursue
actions through the broker or dealer.
From the buyer’s perspective, savings on the initial purchase of counterfeit products are typically subject to harsh,
long-lasting penalties, such as loss of reputation and trust
of customers, and costs associated with recalls, compensation to customers, repairs, and warranty claims.
Counterfeiting might be a complex problem, but
Millman offers a simple solution: don’t buy suspected
counterfeit parts or products. The law of supply and
demand will take care of the rest.
It’s Time to Get Connected to the
Passive Component Industry
September/October Issue
Aluminum/Film Capacitors • Deadline: August 31
November/December Issue
Linear/Non-Linear Resistors & Inductors • Deadline: October 31
To Place an Ad or Submit Editorial Content for Publication in Passive Component Industry,
Call Mitch Demsko at (919) 461-8128 or e-mail: [email protected]
40
JULY/AUGUST 2007

July/Aug 2007 - Passive Component Industry Magazine

Transcription

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