Samsung Galaxy Gear SM-V700

Transcription

Samsung Galaxy Gear SM-V700
Smartwatch
Report #15300-131016-PWd
Product Description
The Samsung Galaxy Gear SM-V700 smartwatch features a 1.63in. AMOLED display with 320 x 320 resolution, 16M colors, and a
multitouch capacitive touchscreen. It runs the Android 4.1.2 “Jelly
Bean” operating system on a 800 MHz single-core Samsung Exynos
3 processor with 512 MB RAM. Other features include 4 GB of internal
memory, two microphones, speaker, and a 1.9 MP BSI CMOS camera
with 720p HD video recording capability. Sensors include a 6-axis MEMS
gyroscope and accelerometer. Connectivity is provided by Bluetooth 4.0
and NFC. Featured apps include Atooma, which enables the connection
of software and hardware sensors on the Galaxy Gear with hardware
sensors on other smart devices to create context-specific operating
instructions; Banjo, a social discovery app; Evernote, for capturing
images, taking notes, and syncing files across devices; and Glympse, a
real-time location app. The Samsung Galaxy Gear SM-V700 is powered
by a 3.8 V, 315 mAh Li-Polymer battery that supplies a listed 25 hours
of use time and 150 hours of standby.
Learn more...
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses
are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes
that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any
information in this document, and shall bear no liability whatsoever for the use of the information.
Copyright © 2013, TechIngsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any
portion thereof, by any means without the express written permission of TechInsights.
© 2013, TechInsights
Survey Teardown
Survey Report
Samsung Galaxy Gear SM-V700 Report #15300-131016-PWd
Product Description
Product Type
Brand
Product Name & Model #
Official Release Date
Retail Price
Weight (grams)
Product Dimensions (mm)
Smartwatch
Samsung
Galaxy Gear SM-V700
9/15/2013
$359.00
74.2
56.73 x 36.76 x 11.39
Product Features
Operating System
Connectivity
Battery Life
Processor
Interface
Storage
Sensors
Android 4.1.2 "Jelly Bean"
Bluetooth 4.0, NFC
Use Time: 25 hrs.; Standby Time: 150 hrs.
800 MHz Single-Core Exynos 3 (ARM Cortex-A8) w/ 512 MB RAM
Multitouch Capacitive Touchscreen
Internal: 4 GB; External: N/A
6-Axis MEMS Gyroscope & Accelerometer
Key Subsystems
Battery
Display
Camera
Front Page
Product Details
3.8 V, 315 mAh, Li-Polymer
1.63" AMOLED; 320 x 320 Pixels; 16777216 Colors
1.9 MP CMOS BSI, Autofocus, 720p HD Video Capability
Major IC Bill of Materials
Exterior Features
Product Label
Major Components
Antenna
Subsystems
Main Board
Cost Estimation Discussion
Survey Report
Package Info
Pkg Ref. #
Pkg
Qty
Brand Name
1
2
1
1
3
4
Part Number
Estimated Costs
Die Info
Pkg Description
Samsung
Samsung
S6E63J0X03
S5K6A3YX14
AMOLED Display Driver
1.9 MP BSI CMOS Image Sensor
1
Samsung
KMNJW0002M
Mutichip Memory - 4 GB MLC NAND Flash, 512 MB Mobile DDR2-S4 SDRAM, Memory Controller
1
Samsung
Exynos 3 Single
Applications Processor
5
1
Yamaha
YMU831
Audio Hub / CODEC Amplifier
6
7
10
11
12
13
14
15
1
1
1
1
1
1
1
1
Texas Instruments
Samsung
Maxim
Maxim
STMicroelectronics
Broadcom
Melfas
Invensense
TPS65631
S5M8767
MAX17048
MAX14577EEWA
STM32F401CB
BCM20702
MCS-8000
MPU-6500
Dual-Output AMOLED Display Power Supply
Power Management
Li-ion Battery Fuel Gauge
Battery Management
ARM Cortex-M4 32-Bit MCU + FPU
Single-Chip Bluetooth 4.0
Capacitive Touchscreen Controller
Totals
13
Form
Pin Count
Length
(mm)
Flip Chip, Adhesive
COB
670
48
21.75
5.37
1.06
4.20
0.34
0.31
BGA-POP-3 (UF)
216
12.06
11.09
1.02
BGA-POP (UF)
1020
12.08
12.01
0.95
BGA Stacked 2 (UF)
105
5.04
5.03
0.88
DFN
Flip Chip, Solder
Flip Chip, Solder
Flip Chip, Solder
Flip Chip, Solder
Flip Chip, Solder
QFN
QFN
10
144
8
25
49
42
36
24
2.50
5.02
1.69
2.05
2.98
3.02
3.99
2.99
2.50
5.02
0.94
2.05
2.97
2.51
3.98
2.99
0.75
0.77
0.56
0.55
0.50
0.48
0.50
0.89
Width
(mm)
Height
(mm)
Die Ref #
Die Qty
1.1
2.1
3.1
3.2
3.3
4.1
5.1
5.2
6.1
7.1
10.1
11.1
12.1
13.1
14.1
15.1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2397
Brand Name
Samsung
Samsung
Samsung
Samsung
Samsung
Samsung
Yamaha
Yamaha
Texas Instruments
Samsung
Maxim
Maxim
STMicroelectronics
Broadcom
Melfas
Invensense
Part Number
S6E63J0X03
S5K6A3YX14
K9GBG08U0B
K4P4G324EQ
S4LL125S01
S5PC220A01
ZT6B07
ZTB103
TPS65631WA0
S5M8767A01
BC01Z
AL25Y
R423A
BCM20702HA
MCS 81
SCORPION-A02
Description
MLC NAND Flash Memory - 4 GB
Mobile DDR2-S4 SDRAM Memory - 512 MB
Memory Controller
Audio CODEC
DSP / Synthesizer ?
Dual-Output AMOLED Display Power Supply
Power Management
Battery Management
Length
(mm)
Width
(mm)
21.75
4.39
10.32
9.05
5.40
8.97
4.18
3.11
1.91
5.02
1.69
2.05
2.98
3.02
2.71
2.61
1.06
4.20
8.09
7.38
1.37
8.48
4.18
2.78
1.20
5.02
0.94
2.05
2.97
2.51
2.70
2.21
16
Each
Total
$1.230
$1.430
$3.260
$1.700
$0.620
$16.450
$1.370
$0.830
$0.190
$2.250
$0.200
$0.400
$0.880
$0.810
$0.710
$1.650
$1.230
$1.430
$3.260
$1.700
$0.620
$16.450
$1.370
$0.830
$0.190
$2.250
$0.200
$0.400
$0.880
$0.810
$0.710
$1.650
$33.98
(UF) = Underfilled
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
Front Page
Product Details
Exterior Features
Product Label
Major Components
Antenna
Subsystems
Main Board
Survey Report
View 1
Front Page
Product Details
Exterior Features
View 2
Product Label
View 3
View 4
Major Components
Antenna
Subsystems
Main Board
Survey Report
View 1
Front Page
Product Details
Exterior Features
View 2
Product Label
View 3
View 4
Major Components
Antenna
Subsystems
Main Board
Survey Report
View 1
Front Page
Product Details
Exterior Features
View 2
Product Label
View 3
View 4
Major Components
Antenna
Subsystems
Main Board
Survey Report
View 1
Front Page
Product Details
Exterior Features
View 2
Product Label
View 3
View 4
Major Components
Antenna
Subsystems
Main Board
Survey Report
Front Page
Product Details
Exterior Features
Product Label
Major Components
Antenna
Subsystems
Main Board
Survey Report
View 1
Front Page
Product Details
Exterior Features
Product Label
View 2
Major Components
Antenna
Subsystems
Main Board
Survey Report
View 1
Front Page
Product Details
Exterior Features
Product Label
View 2
Major Components
Antenna
Subsystems
Main Board
Survey Report
WiFi / Bluetooth
Front Page
Product Details
Exterior Features
Product Label
NFC
Major Components
Antenna
Subsystems
Main Board
Survey Report
WiFi / Bluetooth
Front Page
Product Details
Exterior Features
Product Label
NFC
Major Components
Antenna
Subsystems
Main Board
Survey Report
Battery Subsystem
Brand
Part Number
Type
Voltage
Rating (mAh)
Size (mm)
Vol. Energy Density (mWh/cc)
Weight (grams)
Wt. Energy Density (mWh/g)
Battery
Front Page
Product Details
Exterior Features
Display
Product Label
Touchscreen
Samsung
LSSP482230AB
Lithium Polymer
3.80
315
29.1 x 21.86 x 4.63
406.4
5.6
214
Camera - Front
Major Components
Antenna
Subsystems
Main Board
Survey Report
Display Subsystem
Brand
Part Number
Type
View Diagonal (inches)
Colors
Rows x Columns (pixels)
Backlight
Display Size (mm)
Weight (grams)
Samsung
AMS163AX01
AMOLED
1.6
16777216
320 x 320
None
36.04 x 31.43 x 0.45
1.1
1 - Samsung
#S6E63J0X03
Battery
Front Page
Product Details
Exterior Features
Display
Product Label
Touchscreen
Camera - Front
Major Components
Antenna
Subsystems
Main Board
Survey Report
Touchscreen Subsystem
Brand
Part Number
Type
Size (mm)
Weight (grams)
Battery
Front Page
Product Details
Exterior Features
Display
Product Label
Touchscreen
Unknown
163R1.2
Capacitive
40.84 x 34.17 x 2.21
5.6
Camera - Front
Major Components
Antenna
Subsystems
Main Board
Survey Report
2 MP Camera Subsystem
Brand
Part Number
Type
Resolution
Optical Size (inches)
Optical Zoom
Size (mm)
Weight (grams)
Unknown
P3905
CMOS
2 MP
1/5
1
7.32 x 7.3 x 4.13
0.4
2 - Samsung
#S5K6A3YX14
Battery
Front Page
Product Details
Exterior Features
Display
Product Label
Touchscreen
Camera - Front
Major Components
Antenna
Subsystems
Main Board
Survey Report
Grid = 1 cm
Side 1
Front Page
Product Details
Exterior Features
Side 1 IC Identification
Product Label
Side 2
Major Components
Antenna
Subsystems
Main Board
Survey Report
6 - Texas Instruments
#TPS65631
Dual-Output AMOLED
Display Power Supply
3 - Samsung
#KMNJW0002M
Mutichip Memory - 4 GB MLC NAND Flash, 512 MB
Mobile DDR2-S4 SDRAM, Memory Controller
(3-Die Pkg.)
4 - Samsung
#Exynos 3 Single
5 - Yamaha
#YMU831
Audio Hub / CODEC Amplifier
(2-Die Pkg.)
10 - Maxim
#MAX17048
15 - Invensense
#MPU-6500
6-Axis MEMS Gyroscope &
Accelerometer
11 - Maxim
#MAX14577EEWA
Battery Management
14 - Melfas
#MCS-8000
12 - STMicroelectronics
#STM32F401CB
13 - Broadcom
#BCM20702
7 - Samsung
#S5M8767
Power Management
Grid = 1 cm
Side 1
Front Page
Product Details
Exterior Features
Product Label
Side 2
Major Components
Antenna
Subsystems
Main Board
Survey Report
Grid = 1 cm
Side 1
Front Page
Product Details
Exterior Features
Product Label
Side 2
Major Components
Antenna
Subsystems
Main Board
Survey Report
COST ESTIMATION PROCESS
Overview and Discussion
Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand
in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions
about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that
which strives to maintain comparability of the output of the model across product families and over time.
TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past
eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate
in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However,
TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost
model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge.
Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-ofmaterials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type,
manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer
size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and
interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD
display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative
sources, LCD panel costs are taken from and referenced to these sources.
Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive
at their estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average
high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly
time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost.
The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules,
electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under
evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.
We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While
the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type.
Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view
of OEM high volume cost-to-produce.
Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.
Front Page
Product Details
Exterior Features
Product Label
Major Components
Antenna
Subsystems
Main Board

Samsung Galaxy Gear SM-V700

Transcription

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