led packaging - ASM Assembly Systems

Transcription

TOTAL SOLUTIONS FOR
LED PACKAGING
Total Solutions For
Light Emitting Diode (LED) Packaging
Die Level Scribing, Inspection, Sorting
LS100
ES100
MS100 Plus
AS899
Epoxy Die Attach
Eutectic Die Attach
AD830 / AD830R
AD211 / AD212
AD838L
AD220
AD880
AD819-LD
AD881 Series
AD100
AD819-PD
Curing Oven
COE139 / R
SR902W
Gold / Copper Ball
Wire Bonding
Aluminium Wedge
Wire Bonding
Harrier Xtreme
AB559A Series
iHawk Xtreme
AB530
Eagle60X2L
Cheetah
Gold Stud Bumping
Hummingbird
iHawk-V
iHawk-02
Eagle60AP-LD
Silicon Liquid Molding
Encapsulation /
Phosphors Application
IDEALcompress™
DS500 Series
IDEALab™ - WLP
DS520 Series
Package Sorting / Taping
SLS230 / S
TLB203
SLS230T Plus
TLC203
SLT400
IP360 Series
1
Testers
Laser Scribing System
Automatic AOI System
LS100
ES100
Map Sorter
Die Sorter
MS100 Plus
AS899
Applications: Scribing die, e.g. LED, laser diode, etc.
 High speed laser scribing driven by latest actuating system
 User-friendly interface
 Flexible to implement with various laser with different wavelengths
for different substrates
Applications: Sorting die, e.g. blue LED, white LED, laser diode, etc.
according to wafer map information
 High speed sorting driven by
• Dual heads sorting system
• Direct drive rotary (DDR) motor and linear motor system
 User-friendly interface with Windows® operating system
 Extra large bin area
 Supporting pre-scan capability
Applications: Automatic advanced optical inspection system for
die, e.g. LED die
 High speed and accurate inspection performance
 True color inspection capability
 Supporting pre-scan capability
 Picking “No-Good (NG) die” capability (option)
Applications: Individual LED die testing and sorting solution
 High speed die testing and sorting system with rotary testing station
design
• Dual individual linear bond heads for pick and place processes
• Parallel pick, test and sort processes
• Sorting good die only with advanced die surface defect detection at wafer
stage
 Excellent flexibilities
• Supporting various types of testers
• Flexible bin block combination
• Up to 56 bin blocks can be installed at one time (option)
 Precision probing performance with XYZ testing stage motions
 User-friendly interface with Windows® operating system
*Remark: All machine performance data are package dependent
2
Epoxy Die Attach
US PATENTED
US PATENTED
Automatic High Speed Die Bonder
Automatic High Speed Epoxy Die Bonder
AD830 / AD830R
AD838L
Applications: High density substrates, e.g. chip LED, top LED,
side view LED, SOIC, SOD, etc.
 High speed performance
• Implementing patented bond head design
• Supporting dual dispensing system
 Widely implementing linear motor systems
 Graphical user interface with multi-language support
 AD830R for reel form materials handling
 Up to 8” wafer handling capability (option)
Applications: Direct substrate indexing, e.g. ceramic substrates for
high power LED, etc.
 Strategic direct indexing algorithm suitable for direct ceramic
indexing or other materials handling
 Implementing excellent precision with
• Various inspection systems during bonding process
• Patented bond head design
 Extra large bonding area: up to 4” width substrate handling
capability
 Excellent substrate warpage control
 Implementing latest global substrate alignment
Automatic Die Bonder
Automatic Die Bonder
AD880
AD881 Series
Applications: Suitable for large area epoxy die bonding process
 Extra large bonding area: 8” x 8” substrate handling
 Providing high speed die attach with DDR bond head system
 Implementing excellent flexibility – capability of handling various
substrates with corresponding carrier design
 6 mil small die handling capability
 Graphical user friendly interface with MS Windows® operating
system
Applications: Flexible of handling various substrates, e.g. metal
cans, bent lead frames, etc.
 Wide range of substrates handling capability
 Excellent flexibility
• AD881M: up to 3 wafers handling capability (with similar die sizes)
• AD881H: automatic materials handling
• AD881MH: up to 3 wafers and automatic substrate handling capability
 Providing extremely high speed die attach with DDR bond head
system
 Powerful inspection system providing excellent bonding quality
• Wafer PRS with PR look ahead capability
• Advanced die surface defect inspection at wafer stage
3
Epoxy Die Attach
Epoxy Die Attach
PATENT PENDING
Automatic High Precision Epoxy Die Bonder
(for Vertical Lead Frame Application)
(for Photo Diode Application)
AD100
AD819-PD
Applications: Vertical LED, photo transistors, infrared diodes, etc.
 World’s fastest epoxy die bonding system with patent pending
technologies – dual shuttling system
 Pro-longing MTBA with new inputting / outputting systems
• Inputting system: dual stack loading inputting system / multi-magazine
inputting elevator system
• Outputting system: multi-magazine outputting elevator system
 Precise epoxy stamping capability with pre-bond inspection
 Getting advantages between quality control and bonding speed
Applications: Metal can packages, e.g. photo diodes on stem, etc.
 High precision epoxy die bonding with
• 2-in-1 stamping and bonding system
• Widely implementing linear motor systems
• Full range of PR inspection at various stages for precision bonding
Eutectic Die Attach
High Speed Epoxy Die Bonder
 Carrier free metal cans handling design
 Supporting various configurations to fit different applications
• Programmable tilting workchuck for PD application
• Rotary workchuck for VCSEL application (option)
with latest post-bond inspection system
Eutectic Die Attach
US PATENTED
US PATENTED
Automatic Eutectic Die Bonder
Automatic Eutectic Die Bonder
AD211 / AD212
AD220
Applications: Panel form of high power LED packages, e.g.
ceramic/wafer submount for direct eutectic process
 Implementing patented technologies
• Double decoupling bond head system
• Heated collet die attach process
Applications: Strip form of high power LED lead frames for direct
eutectic die attach process
 Implementing patented technologies
• Double decoupling bond head system
• Heated collet die attach process
 Extra large bonding area:
• AD211: up to 4” x 4” bonding area
• AD212: up to 8” x 8” bonding area
 Providing excellent oxygen level control
 Providing excellent oxygen level control
 Automatic die theta alignment with precision stage
 Excellent void control with mature process know-how
 Minimizing thermal shock with pre-heat and post-heat stations
 Excellent void control with proven heat tunnel design and mature
process know-how
 Automatic lead frame input and output handling capability
 Automatic materials handling for AD211
4
Eutectic Die Attach
Curing Oven
Automatic High Precision Eutectic Die Bonder
Snap Curing Oven
(for Laser Diode Application)
AD819-LD
Applications: Metal can packages, e.g. one pass LD and submount
on stem
 Precision placement with
• Widely implementing linear motor systems
• Full range of PR inspection at various stages for precision bonding
 Carrier free metal cans handling design
 Individual bonding system for submount and LD attach
 Providing consistent eutectic environment
• Excellent oxygen level control with nitrogen gas supply
• Programmable temperature profile on various stations
COE139 / COE139R
Applications: Curing process for die attached substrates in either
strip or reel form, e.g. SOT, top LED, etc.
 Excellent oxygen level control with
• N2 curtains at oven’s input and output sides
 Consistent curing temperature control with 6 temperature control
zones
 Selectable for various substrates handling
• COE139: strip form substrate handling
• COE139R: reel form substrate handling
 In-line capability, e.g. AD830 or other die attach system (option)
 Anti-thermal shock with pre-heating and post-heating stations
Gold / Copper Ball Wire Bonding
Reflow Oven
Extreme High Speed Wire Bonder
SR902W
Harrier Xtreme
Applications: Reflowing process for large substrate
 Up to 8 independent temperature controlling regions
• 6 heating zones and 2 cooling zones
 Combination of convection and radiation heating modes
 Sophisticated oxdiation level control
5
Applications: QFN, SMD LED, HP LED, high density discrete
packages, etc.
 Dual high speed wire bond heads system
 Highest output per square foot area
 User-friendly, intelligent Windows® based interface
 Innovative algorithm for high speed PR
 Supporting copper wire bonding & copper BSOB (option)
Ultra High Speed Wire Bonder
(for Discrete/Opto Applications)
(for Hybrid Application)
iHawk Xtreme
Eagle60X2L
Applications: One pass solution for large bond area packages,
e.g. multi-chip modules, SiP, etc.
 Ultra fast speed: up to 12 wires/sec with extreme precision
 Compact and low inertia digitally controlled bond head with
built-in features
 Advanced loop algorithm with superior looping trajectory profile
and auto-tuning technology
 Bond process monitoring with post-bond inspection, free air ball
formation monitoring and non-stick detection monitoring
 Extra large bonding area
Automatic Gold Ball Wire Bonder
Automatic Gold Ball Wire Bonder
(for Vertical Lead Frame Application)
(for Bent Lead Frame Application)
iHawk-V
iHawk-02
Applications: Gold ball wire bonding on vertical lead frames
 Innovative dual track design enhancing bonding speed
 Long MTBA with latest input / output magazine handling
 Innovation in optics & PR system especially for smaller LED dice
• Up to 54 mm x 102 mm for LF width < 125 mm
Curing Oven
Applications: Gold ball wire bonding, QFN, SMD LED, HP LED, high
density discrete packages, etc.
 Innovation in optics & PR system for smaller dice
 Advanced PR algorithm with PR look ahead capability
 Faster package conversion with fully motorized material handling
system
Eutectic Die Attach
High Speed Wire Bonder
Applications: Bent lead frame handling capability, e.g. piranha LED
application
 High speed wire bonding capability
 Long MTBA with latest input / output magazine handling
 Saving cost of ownership by direct bent lead frame indexing
6
Aluminium Wedge Wire Bonding
Automatic Gold Wire Bonder
Rotary Bondhead Wedge Bonder
(for Laser Diode Application)
AB559A Series
Eagle60AP-LD
Applications: Metal can packages with three dimensional bonding,
e.g. LD assembly, etc.
 Rotary workholder system for multi-plane bonding
• 0° to 90° programmable rotation
 One pass LD and submount bonding
 Specially designed for photonics and optoelectronic application
 Custom-made top plate and carrier for large range of laser diode
products
Applications: Chip-on-board, multi-die, LED display, chip-on-flex,
chip-on-glass, ceramic, etc.
 Fine pitch capability for advanced packages
 Large effective bonding area
 Vision Lead Locator (VLL) to adapt lead width variation
 Dual colour (red-blue) LED lighting for different substrates
surface reflection
 Gold wire wedge bonding application (option)
 60° wire feeding angle capability (option)
PATENTED
Automatic Ultrasonic Wedge Bonder
Automatic Ultrasonic Wedge Bonder
AB530
Cheetah
Applications: Chip-on-board, multi-die / multi-PCB, high lead count,
etc.
 High speed bonding
 Fine pitch capability for advanced packages
 Cost saving by widely implementing linear and DDR motor systems
 Multi-unit / multi-PCB bonding capabilities
7
Applications: suitable for leaded substrate, e.g. dot matrix display,
numerical display, etc.
 High speed bonding
 Up to 4" diameter bonding area
 Saving cost of ownership by widely implementing linear and DDR
motor system
 Multi-unit / multi-PCB bonding capability
Silicon Liquid Molding
Wafer Level Stud Bumping System
IDEALcompress™
Hummingbird
Applications: Gold / copper stud bumping on wafer
 High speed bumping performance
 Excellent bumping control
 Implementing flexibility
• Large bumping area: up to 12” wafer handling capability
• Supporting gold / copper stud bumping
• Automatic wafer loading system (option)
• Equipping with pre-heat / post-heat system (option)
• Small lot assembly
• Compact
 Ideal for eco-friendly manufacturing
• No material wastage
• No mold cleaning required
 Various dispensing applications, including liquid epoxy, clear
silicone, granular powder dispensing
Aluminium Wedge Wire Bonding
• Fine pitch bumping capability
• Stack bumping capability
Applications: Large substrate molding: W150mm x L300mm, LED
 Ideal for high-mix, low volume manufacturing
Gold Stud Bumping
Encapsulation / Phosphors Application
DS500-IL
IDEALab™ - WLP
 Quick change mold chase concept with aid of IDEALtrolley™
DS500 Series
Applications: Die coat, adhesive dispensing, sealing, gel coating,
underfill dispensing, etc.
 Excellent encapsulant placement repeatability and dispensing
quality
 Extra large dispensing area with gantry table design
 Glob top, dam and fill dispensing mechanism
 Custom programmable dispensing patterns & parameters
 Automatic substrate handling capability with input / output elevator
systems (option)
 Dual dispensing heads with adjustable pitch (option)
 Reel-to-reel handling capability (option)
• Liquid epoxy
• Clear silicone
• Granular powder
Precision Dispensing System
Molding
Applications: WLP, wafer level LED, exposed solder ball WLP, Cu
bump pillar WLP, embedded wafer ball grid array,
redistributed chip package
 Tape assisted to release
 Dispensing options
Gold Stud Bumping
DS500
8
PATENT PENDING
Precision Jetting System
Automatic LED (SMD) Sorting System
DS520 Series
SLS230 / S
Applications: Jetting encapsulant onto various substrates, including
phosphors mixed silicone on LED packages, etc.
 Extremely high speed jetting with in-house developed jetting system
 Excellent performance
• High accuracy & repeatability
• Easy to operate & maintain
• Durable consumables
 Maintaining fluid homogeneity by strategic agitating system
 Supporting individual dual workholders control
Applications: Chip LED, sideview LED, etc.
 Excellent performance by implementing patent pending design
 Prevent mixing design by detecting bin removal and automatic label
printing the bin data
 Optional vision inspection for multi-chip LED to screen out package
with missing chip, defected chip, etc. before sorting
 Wide range of applications
• SLS230: chip LED devices, e.g. 0402, 0603, 0605, 0805, 1206, etc.
• SLS230S: sideview LED devices, e.g. 008, 010, 020, 215, 335, etc.
 Automatic materials handling with DS520M
 DS520V for vertical leadframe application
Automatic LED (SMD) Sorting System
Automatic LED (SMD) Taping System
SLS230T Plus
SLT400
Applications: Top LED, e.g. 3014, 3020, 3528, 5050, etc.
 Prevent mixing design by detecting bin removal and automatic label
printing the bin data
 Long lasting performance with latest XY table design
 Increasing bin capacity for large lot size
 Optional with vision inspection for multi-chip LED to screen out
package with missing chip, defected chip, etc. before sorting
Applications: Chip LED, top LED, sideview LED, etc.
 In-house developed direct drive rotary motor and linear up down
motor to maximize system throughput
 Advanced inspection algorithm for high accurate inspection
 Ensuring taping only good units with supporting test contact
technology
 Simple and easy operation with MS Windows® operating system
 Wide range of applications
• Chip LED devices: 0402, 0603, 0805, etc.
• Top LED devices: 3014, 3020, 3528, 5050, etc.
• Sideview LED devices: 008, 010, 020, etc.
9
Ingenious (LED) Packing System
IP360 Series
Applications: Ceramic, silicon molded LED
 One-stop solution for test, sort and output with good traceability
 In-house developed direct drive rotary motor and linear up down
motor to maximize system throughput
 Flexible materials handling input material handling
• Input system: wafer frame / bowl feeding system
• Output system: tape-and-reel output, bin frames and / or bins
 Powerful inspection capability
• Wafer inspection
• Tape-and-reel in-pocket inspection, etc.
 Optional input barcode scanning, unit map, label printing and
output file generation package for good tractability of devices
Tester
Tester
LED Tester System
LED Full Function Checker
TLB203
TLC203
Applications: Measuring electrical and optical characteristics on
wafer prober or handler, e.g. AS899, SLS230 series,
IP360 series, etc. for die / package level sorting
 Large range of power supply
 Precision measurement
 Flexible implementation
• Supporting up to two testing stations simultaneously
• Multiple drivers and photo-detectors handling capability
Applications: Measuring both electrical and optical characteristics
such as VF, IR, polarity and CIE1931 (x,y) of LED and
detect discrepancy before taping the work pieces to
taping system. All test items can be programmed by
user. This checker is designed as standalone system
and communicate with SLT400 taping system or any
3rd party system through I/O.
 Driving source range
• Current: up to 100 mA
• Voltage: up to 10V
10
China 中國
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
2/F, Zu Chong Zhi Road Lot 1505
Shanghai Zhangjiang Hi-Tech Park
Shanghai 201203, China
先域微電子技術服務(上海)有限公司
上海市張江高科技園區
祖冲之路 1505 弄 55 號 2 樓
Tel : 86-21-5080 5465
Fax : 86-21-5080 5467
Room 705, Da An Building B
No. 41 You Yi Road, He Xi District
Tianjin 300211, China
天津分公司
天津市河西區友誼路 41 號
大安大厦 B 座 705 室
Tel : 86-22-5881 3008
Fax : 86-22-5881 3009
Room C345-4, Chengdu Hi-Tech Zone
Innovation Service Centre
Chengdu 611731, China
成都辦事處
成都西芯大道四號西部園區基地
孵化樓 C345-4 號
Tel : 86-28-8784 6551
Fax : 86-28-8784 6562
Room B, 31/F, Bi Li Da Building
No. 22 Lv Ling Road
Xiamen 361009, China
廈門分公司
廈門市呂岭路 22 號
必利達大廈 31B 室
Tel : 86-592-550 9125
Fax : 86-592-550 9121
Room 05-03/06, Block A
No. 5 Xing Han Street
Suzhou Industrial Park
Suzhou 215021, China
蘇州分公司
蘇州市蘇州工業園
星漢街五號A幢 05-03/06 室
Tel : 86-512-6762 6278
Fax : 86-512-6762 6378
Room 7-11, 4th Floor, Block A
Tai'an Square, Dongshen Road
Zhang Mu Tou Town
Dongguan 523620, China
東莞分公司
東莞市樟木頭鎮東深公路旁荔苑大道
泰安廣場 A 棟四樓 A7-A11
Tel : 86-769-8712 5600
Fax : 86-769-8712 5601
East Wing, 4/F, Block 2
CATIC (Zhonghang) Shahe Industrial Zone
Qiao Xiang Road, Nanshan District
Shenzhen 518053, China
深圳分公司
深圳市南山區僑香路
中航沙河工業區(北區) 2 號樓 4 層東
Tel : 86-755-8830 8533
Fax : 86-755-8344 6245
Room 1402-4
Jiangxin Guoji Jiayuan Yinzuo
No. 85 Jiefangxi Road, Qingyunpu District
Nanchang 330002, China
南昌分公司
江西省南昌市解放西路
江信國際嘉園銀座大廈 1402-1404
Tel : 86-791-8820 1517
Fax : 86-791-8820 7178
China 中國
Europe 歐洲
Hong Kong 香港
Japan 日本
ASM Materials China
Block 15, Fuqiao 2nd Industrial Estate
Gong Ye Road, Fuyong Town
Baoan District, Shenzhen 518103, China
先進半導體材料(深圳)有限公司
深圳寶安區福永工業大道
富橋第二工業區 15 棟
Tel : 86-755-2961 8000
Fax : 86-755-2733 5548
ASM Assembly Products B.V.
Weltevreden 4 A, 3731 Al De Bilt
The Netherlands
Tel : 31-30-890 6310
Fax : 31-30-890 6320
ASM Pacific (Hong Kong) Ltd
4/F Watson Centre, 16-22 Kung Yip Street
Kwai Chung, Hong Kong
先進太平洋(香港)有限公司
香港葵涌工業街 16-22 號
屈臣氏中心 4 樓
Tel : 852-2619 2000
Fax : 852-2619 2118/9
ASM Assembly Technology Co Ltd
5F, Tachikawa F-Bldg, 1-7-18
Nishiki-Cho, Tachikawa-Shi
Tokyo 190-0022, Japan
〒190-0022 東京都立川市錦町 1-7-18
立川エフビル 5 階
Tel : 81-42-521 7751
Fax : 81-42-521 7750
Philippines 菲律賓
Singapore 新加坡
ASM Pacific Kor Ltd.
Room 501, 5F, Hi-Tech Center
958-14 Daechon-dong, Buk-gu
Gwangju 500-470, Korea
광주광역시 북구 대촌동 958-14
하이테크센터 501 호 500-470
Tel : 82-62-973 4174
Fax : 82-62-973 4216
Edgeward Development Limited
Philippines Branch
2108, Prime Street
Corner Enterprise Street
Madrigal Business Park, Alabang
Muntinlupa City, Philippines 1770
Tel : 63-2-850 4543
Fax : 63-2-850 4547
ASM Technology Singapore Pte Ltd
2 Yishun Avenue 7
Singapore 768924
Tel : 65-6752 6311
Fax : 65-6758 2287
ASM Assembly Equipment Malaysia
Sdn Bhd
24A, Jalan Medan Ipoh 1B
Medan Ipoh Bistarli
31400 Ipoh Perak, Malaysia
Tel : 605-542 3991
Fax : 605-542 3992
Sdn Bhd
B-1-12, Jalan SS6/20, Dataran Glomac
Pusat Bandar Kelana Jaya
47301 Petaling Jaya, Malaysia
Tel : 603-7806 4942
Fax : 603-7806 4943
Sdn Bhd
1, Tingkat Satu, Jalan Warisan 1
Taman Warisan Jalan Junid
84000, Muar, Johor, Malaysia
Tel : 606-951 5713
Fax : 606-951 5786
ASM Pacific (Holding) Limited
Taiwan Branch
10F, No. 530, Sec. 2, Chung Shan Road
Chung Ho Dist, New Taipei City, Taiwan
香港商先進太平洋股份有限公司
台灣分公司
台北辦事處
新北市中和區中山路二段 530 號 10 樓
Tel : 886-2-2227 3388
Fax : 886-2-2227 3399
Taiwan Branch
1F, No. 7, Lane 91, Dongmei Road
Hsinchu, Taiwan
台灣分公司
新竹辦事處
新竹市東美路 91 巷 7 號 1 樓
Tel : 886-3-573 3750
Fax : 886-3-573 3551
Taiwan Branch
8F-1, No. 135, Sec 2
Chung Shan Road, Tantzu
Taichung, Taiwan
台灣分公司
台中辦事處
台中市潭子區中山路 2 段 135 號 8F-1
Tel : 886-4-2535 6390
Fax : 886-4-2535 6820
Korea 韓國
ZEMOS Korea Inc. /
ASM Pacific Kor Ltd.
3F, 628-6, Deung Chon Dong
Kangseo Gu, Seoul 157-030, Korea
서울시 강서구 등촌동 628-6 3층 157-030
Tel : 82-2-538 5900
Fax : 82-2-561 5905
Malaysia 馬來西亞
Sdn Bhd
Bayan Point, Block A, No. 15-1-23, 15-1-24
Medan Kampung Relau
11900 Penang, Malaysia
Tel : 604-644 9490
Fax : 604-645 1294
Taiwan 台灣
Taiwan Branch
No. 4-2, East 3 Road Street
N.E.P.Z. Kaohsiung, Taiwan
台灣分公司
高雄市 811 楠梓加工出口區東三街 4-2 號
Tel : 886-7-367 6300
Fax : 886-7-367 6399
Thailand 泰國
U.S.A. 美國
ASM Assembly Equipment Bangkok Ltd
51/3, Vibhavadi Tower, 18/2 Floor
Ngamwongwan Road, Ladyao, Chathuchak,
Bangkok 10900
Thailand
Tel : 66-2-941 3181/2
Fax : 66-2-941 3183
ASM Pacific Assembly Products Inc.
3440 East University Drive, Phoenix
Arizona 85034-7200
U.S.A.
Tel : 1-602-437 4760
Fax : 1-602-437 4630
ASM Pacific Assembly Products Inc.
(West Regional Office)
97 East Brokaw Road, Suite 100
San Jose, California 95112-4209
U.S.A.
Tel : 1-408-451 0800
Fax : 1-408-451 0808
http://www.asmpacific.com
DB1

led packaging - ASM Assembly Systems

Transcription

Similar documents

2013 version_NB3 - ASM Assembly Systems