EMPC 09Jun16 - VIA electronic

Transcription

A Comprehensive Overview on Today`s Ceramic Stubstrate Technologies
17th European Microelectronics and Packaging Conference
„ A Comprehensive Overview on Today`s Ceramic
Stubstrate Technologies“
Rimini, 16.06.2009
Franz Bechtold
VIA electronic GmbH, Hermsdorf
www.via-electronic.de
EMPC Rimini June 15 – 18 2009
Franz Bechtold, VIA electronic GmbH, Hermsdorf
Content
•
Introduction
•
Ceramic Substrates as Fired
•
Multilayer Substrates HTCC and LTCC
•
Ceramic Substrates between Silicon and PCB
•
Market for Hybrid Circuits
•
Applications Fields for Ceramic Based Hybrid Integrated Circuits
•
Materials, Board and Technology Providers
•
Perspectives and Challanges
•
Conclusion and Acknowledgement
Introduction
Thickfilm Alumina Substrates
ZrO2 Stabilised Alumina Substrates
Aluminum Nitride Substrates
Direct Bonded Copper Substrates
Thickfilm Technology
HTCC Technology
LTCC Technology
Ceramic Substrates As Fired
Courtesy of Ceramtec
ZrO2 stabilised Al2O3 Substrate
AlN substrates
Thermomechanical stability
Thermal Conductivity
Flexural strength
Si matched TCE
Elasticity.
Capable for Thickfilm
Cabable for DBC
Capable for DBC
low thickness
Ceramic Substrates As Fired
Courtesy of Ceramtec
Standard Substrates, extruded and dry
pressed devices
Ceramic tubes for heater
elements, dry pressed alumina
pressure sensor membranes
and micro cooler components
are applied in special
applications in harsh
environment.
Multilayer Substrats HTCC and LTCC
LTCC
Low temperature material systems
with noble metal conductor inks
available.
Tape blanking
Via punching
(DuPont, Heraeus, Ferro, ESL,
CeramTec)
Via filling
conductor printing HTCC
Material Systems not available
Stacking
Lamination
scribing/cerving
Burnout, Cofiring
Singulation
High temperature ceramics with
refratory metal inks
High material complexity with full
system capability including resistors
SME Foundries on the open Market
(MSE, Selmic, C-Mac and VIA)
Captive materials and processes
inside big entities (Bosch, Epcos)
Full system capability achieved by
Proprietary Materials and processes
Ni/Au Plating
in big enterprises
Cofire and postfired resistors not
possible proprietary material
Multilayer Substrats HTCC and LTCC
HTCC
Thermal Conductivity 20W/m*K
Mechanical strength 400 MPa/mm
LTCC
Thermal conductivty 3 W/m*K
Brazing strength > 50 N/mm2
Mechanical Strenght 200 MPa/mm2
Brazing strength > 30 N/mm2
Condctor resistivity inside >10 mOhm/sq
Conductor resistivity <5 mOhm/sq
Good RF Performance
Very good RF Performance
Integrated resistors not possible
Integrated resistors possible
Typical NRE Costs:
•1.000€ for PCB
•5.000 € for thickfilm board
•10.000 to 15.000 € for HTCC and LTCC
•Up to 250.000 € ASICS.
Typical Material Content(per 150cm2):
•
•
•
•
almost pure silicon for Asics,
low priced plastics together with a few glass fibres and 5g of Cu for PCB
expensive green ceramic sheets and about 3g of noble metals for
conductors and resistors in the case of LTCC
and a few less expensive Alumina sheets together with about 3g of
refractory metals for the conductor.
Table 2: Average Process cost
Table 1: Average Material costs in €
PCB
Thick
film
HTCC
LTC
C
Silicon
1000
panels
1,50
15
40
40
500
16
10.000
Panels
1,00
9
32
32
300
13
100.000
Panels
0,50
5
26
26
200
PCB
Thick
film
HTCC
LTCC
Silicon
1000
panels
2,0
15
20
40
20
10.000
Panels
1,5
12
16
32
100.000
Panels
1,0
10
14
26
Table 4: Total costs at different volumes
PCB
Thickfil
m
HTC
C
LTC
C
Silico
n
1000
panels
3,50
30
60
80
520
10.000
Panels
2,50
21
48
64
316
100.000
Panels
1,50
15
40
52
213
Table 5: Total cost per circuit
PC
B
Thickfil
m
HTC
C
LTC
C
Silic
on
1000
panels
0,18
1,40
0,47
0,63
1,28
10.000
Panels
0,10
0,86
0,33
0,44
0,57
100.000
Panels
0.06
0,60
0,27
0,35
0,36
Table 6: Minimum number of circuits to be realised
(yield losses not included)
PCB
Thickfilm
HTCC
LTCC
Silicon
1000
panels
25k
25k
150k
150k
600k
10.000
Panels
250k
250k
1.500k
1.500k
6.000k
100.000
Panels
2.500k
2.500k
15.000k
15000k
60.000k
Technical Performance
Table 7: Technical
characteristics
LTCC
HTCC
Si
3
>20
>20
>20
>1011
>1012
>1012
106
Break down voltage
In V/µm
40
>40
15
-
Thermal Coefficient of
Expansion(TCE) x,y
16
6
7
3
TCE z < tg
TCE z > tg
60
290
6
7
3
-
210
350
100
0,1
3
20
125
Guaranteed Life time
in years
Volume resistivity
In Ohm*m (RT)
Flexural strength
In Mpa
Thermal Conductivity
In W/m*K (RT to 400°C)
PCB
Technical Performance
Table 7: Technical
characteristics
PCB
LTCC
HTCC
Si
Conductor Resistance
In mOhm/square
<1
<5
<15
<30
Dielectric Const. 1MHz
Dielectric Const. 10GHz
4,7
-
7,85
7.83
9,8
9,0
12,0
-
0,025
0,020
0,002
0,005
0,0004
0,001
-
200
200
200
2
L
L, R, C
L
L, R, C
Water absorption
In %
<0,3
0
0
0
Hermeticity in Torr
>10-3
<10-8
<10-8
<10-8
Loss Tangent
Loss Tnangent
1MHz
10GHz
Line pitch
Integration of
Passive components
Market for Hybrid Circuits
Market for Hybrids, ZVEI Yearly Report 2008, Handbuch der Leiterplattentechnik,2003
European market: 1.200 Bn €
Regional distribution:
Germany 48%
France 14%
UK 14%
Benelux 9%
Technology Distribution:
Italy 5%
Distribution to Market sections:
Scandinavia 5%
Automotive: 40%
Others 5%
Telecom: 30%
Thick film with 38%
Industrial: 15%
LTCC with 36,5%
Military, Avionic: 10%,
DCB 21%
Thin film 4,5%
The captive market is about
2/3 of the total market
others: 5%
.
Application Fields for Alumina Based Hybrids
Courtesy of Siegert electronic
Dual Inline Hybrid Circuit for power stations
Oil sensor
•high degree of miniaturisation
•printed resistors on top of the dielectric
•high reliability in harsh envionment
•Robustness
•aggressive environment
•hot oil
Courtesy of Micro Hybrid
Smart Power Gear Controll Unit
Yarn tension sensor pricniple
•Chip on Board
•High Power, high Currency
•Thick wire, thick Silver
•Robustness
•Matched TCE Component/Sustrate
Courtesy of Micro-Hybrid
Courtesy of Micro Hybrid
Yarn tension sensor system
Sensor System, Open Frame
•Long term stable Youngs Modulus
•Stress free packed pressuer sensor
•Thickfilm integrated Sonsor
•Electronic close to the sensor
Application Fields for Aluminum Nitride Based Hybrids
Courtesy of Lust Hybrid
Courtesy of Lust Hybrid
H-Bridge Hybrid Circuit
H-Bridge Hybrid Circuit, Open Frame
•high power Dissipation
•high heat conductivity
•Low cost sealing
•Up to 1600 V and 24 A
•200W/m*K
•Glop top, silicone and plastic package
Courtesy of Anceram
Courtesy of Electrovac Curamik:
Satellite CCD Camera Board
Direct bonded Copper 100 to 300µm
•Silicon Matched TCE 3ppm
•260x15x7mm size
•Low weight
•On ZrO2 stabilized 0,25mm Alumina
•On Aluminum Nitride
•Double sided, Cu Vias
•Excellent thermal properties
Courtesy of Electrovac Curamik:
Hermetically sealed DBC on AlN
• 300µm Cu lines and integrated heat sinks
• 180 W/m*K thermal conductivity
•Double sided, Cu Via technology
• low cost 250mm ZrO2 stabilised Alumina
HTCC Applications
Courtesy of MDBA-France and Egide Courtesy of Egide:
Aerospace Multichip Module 50x50mm
Tosa/Rosa Fibre optic transmissions
• miniaturisation, reliability
•15 layers, 20.000 vias
•75µ lines and vias
• Hermeticity
• Robustness
•High density 40µm internal lines
•Very small outline
LTCC Material System Background
Commercial LTCC materials
951
DuPont
943
DuPont
A6
Ferro
41110
ESL
CT 2000
Heraeus
5,9
4,7
9,1
Permittivity ε
≤1
GHz
7,4
7,5
1-20
GHz
-
7,4
20-40
GHz
-
7,4
5,9
4,6
<2
≤4
9,1
Dielektric losses tan δ [10-3]
≤1
GHz
<2
<1
1-20
GHz
5
1
20-40
GHz
<15
<2
<2
Ag
Ag
Ag
Ag
≤1,4
≤ 0,3
≤ 0,4
≤ 0,4
5,8
4,5
7,0
6,4
≤1
≤2
Insertion loss [dB inch-1]
Conductor
1- 20
GHz
TCE
α [ppm K-1]
(25-300°C)
5,6
LTCC Material System Background
Table 9: Material System 951 DuPont
Material
Process
Function
properties
Tol.%
Au/AuPt
cofire
Wire/solder
3/30 mOhm
20
Ag/AgPd
cofire
Wire/solder
3/30 mOhm
20
Ag/AgPd/Au
cofire
Wire/solder/
bond
3/30/3
mOhm
20
Au, AuPtPd
postfire
Wire/solder
3/30 mOhm
20
Ag, AgPd
Postfire
Wire/solder
3/30 mOhm
20
Dielectric glass
Cofire
Solder stop
Dielectric glass
Postfire
Insulator
RuO2-Bi2O3
Cofire
Resistor
Not qualified
30
RuO2-Bi2O3
Buried
Resistor
10 to
10kOhm
50
RuO2-Bi2O3
postfire
Resistor
10 to
10MOhm
1 (tr.)
Metallisation
Co/post
Inductor,
capac.
E=7
20
High Volume LTCC Applications
Courtesy of Siemens-VDO
Courtesy of Bosch:
Gear Car Controll (source: W.C. Heraeus)
ABS/ESP8 Controller
• miniaturisation, reliability, Costs
•-40/+155°C
•50g
• Robustness
•Under the Hood
•Close to the working unit
Courtesy of Bosch
Courtesy of Bosch:
Steer by Wire
Transmision Controll Unit
• miniaturisation, reliability, Costs
•-40/+155°C
•50g
• Robustness
•Under the Hood
•Close to the working unit
Courtesy of Epcos
Front end for mobile phones
• miniaturisation
•reliability, Costs
• RF capability
• K20/K8 Technology
• passive integration
Chip&Wire bonding
Glob Top
Flip Chip
Surface Mounting
Technology
Low Volume LTCC Applications
Courtesy of VIA electronic
Courtesy of Ketek and VIA
Customised LTCC Packages for Sensors
Fully integratedd X-Ray detector System
• Reliability
• Modularity
• Flexibility
• Vaccum cmpatible
• Spectroscopic neutral
• Thermal management
Low Volume LTCC Applications
Courtesy of Ericsson
T/R Modules
(Source: Workshop MakroNano
2006)
• Miniaturisation
• RF capabiltiy
• Passive integrated RF
components
Materials Provider
Table 10
Supplier
Materials and services
CeramTec
Al2O3 substrates 96%, 99%,
Al2O3 ZrO2 stabilised,
Al2O3 dry pressed and extruded parts AlN
Substrates thinfilm/thickfilm
LTCC dielectric tape
Laserscribing and cutting
Single sided cofired metallisation
AnCeram
AlN substrates thinfilm/thickfilm
Active brazed Copper
Heraeus
Thickfilm inks
LTCC material systems
DuPont
Thickfilm inks
LTCC material systems
Technology Provider
Technology Provider
Technology services
AB Mikroelektronik
Thickfilm
Advanced Microelectronics
Thickfilm, Thinfilm
C-Mac
Thickfilm, LTCC
Curamik
Direct bonded Copper
Egide
HTCC
Epcos
LTCC
Hightec
Thinfilm
Hybrid Electronic
Thickfilm
Lewicki
Thickfilm
Lust
Thickfilm
Microdul
Thickfilm
Microtel
Thickfilm
Micro-Hybrid
Thickfilm
Micro Circuit Engineering
Thickfilm
Micro System Engineering
Thickfilm, LTCC
Radeberger Hybridelektronik
Thickfilm, Thinfilm
Reinhardt Microtech
Thinfilm
Selmic
Thickfilm, LTCC
Siegert Electronic
Thickfilm
Siegert TFT
Thinfilm
VIA electronic
LTCC
Perspectives and Challanges
Opportunity
Challange
Technical Requirements
Biotechnology, chemical
sensors
Lab on Chip,
integrated fluidic,
integrated reactors
and sensors
Chemical performance
Biocompatibility
Fluidic interfaces
Heterogeneous Integration
High pin count, QFP,
LGA, BGA
Flatness, TCE matching of Ceramic to PCB,
System in Package
3D interconnection,
passive integration,
thermal management
New and adapted materials, new and
adepted processe
MEMS
Packaging
3D integration,
hermeticity, Wafer
level packaging
TCE matching of Ceramic to Si, no XY
shrinkage
MOEMS Packaging
Integration of optical
and electrical
conductors
no XY shrinkage, excellent planarity and
accuracy
Energy efficiency
High power/high
complexity integration
High currency conductor, micro cooler, high
temp.
R&D Roadmaps
Microsystems and sensors are constantly increasing and require new packaging solutions.
R&D efforts are put into innovative
LTCC technology
DBC
high temperature thickfilm
.
The R&D road maps for LTCC ceramic are dominated
cost improvements at process level
(self constrained sintering, high resolution screen printing, micro via
laser drilling, wafer level packaging)
cost improvements at integration leve
(new functional materials like high k, low k, high permeability and
TCE graduation and cost improvements by combined technologies
R&D Roadmaps
Courtesy of Fraunhofer IKTS
AlN Multilayer System development
•Tape casting
•Tungsten ink preparation
• Cofiring
Tungsten/Aluminumnitride Interface
Conclusion
Ceramic substrates provide economic and ecologic solutions at
low, medium and high volumes for high reliability applications.
Increasing power and operating temperatures of the electronic
devices needs well adjusted thermal properties of the ceramic
board technology selected.
Increasing frequency of the electronic devices arrives to the
request for passive integration of RF functions and thermal
management
Acknowledgement
This presentation was supported by:
Dr. Knuth Baumgärtel, Micro-Hybrid, Hermsdorf
Dr. Dieter Brunner, Anceram, Bindlach,
Walter Distler, Siegert electronic, Cadolzburg
Dr. Erwin Effenberger, ZVEI, Frankfurt
Dr. Marco Fritsch, Fraunhofer IKTS, Dresden
Thomas Heise, Ceramtec, Marktredwitz
Dr. Sebastian Brunner, Epcos, Deutschlandsberg
Michel. Massiot, Egide, Bollene
Christina Modes, W.C. Heraeus, Hanau
Walter Röthlingshöfer, Bosch, Reutlingen
Dr. Jürgen Schulz-Harder, Electrovac Curamik,
Ralf Stötter, Ketek, München
Thomas. Walther, Lust Hybrid, Hermsdorf
Questions
Thanks for your Attention

EMPC 09Jun16 - VIA electronic

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