“3D Flex Vision”

July 2015
“3D Flex Vision”
High-speed ball/bump inspection system
for turret handlers
Dates & Events
COME SEE US AT
SEMICON WEST,
BOOTH 6251
Cohu innovates once again, this time
with a new line of machine vision technology. We are pleased to announce the market
release of the new “3D Flex” Vision, the first
high speed (up to 30K uph) 3D ball/bump
inspection system that is fully integrated into
your turret handlers.
July 14 - 16, San Francisco
Based on light phase shifting technology,
moiré interferometry, the system combines a
sequence of touchless 2D images with light
pattern projections to generate a topographic 3D view of inspected devices.
3D view of WLP 1.5 x 1.5 mm - 9 device, 9 bumps.
The 3D Flex inspection system is part of
Platinum sponsor for
Test Vision 20/20
Cohu’s NVcore Vision architecture. n
This solution is ideal for inspecting small
BGAs, CSPs, and bumped dies. It measures
ball height, 3D coplanarity as well as regular
BALL-COUNT UNLIMITED
2D measurements: ball diameter, pitch and
location. This is a touch-less (without any
contact of the device) technology.
Cohu ITS offers a wide
Depending on the
range of pogo pin contactors
handler platform — Test-in-
for BGA and WLP packages.
Strip, Turret, Pick-and-Place
Our Philippines team provides
or Gravity Feed — the con-
design and manufacturing
tactor is optimized to assure
of precision spring probe
an excellent temperature ac-
contactors.
curacy of the device under
Our solutions address
test from -55°C to 175°C.
several market requirements,
including that of microcontroller IC test with 2,500+
pins with contact pitch down
Additional features are
FBGA pogo pin contactor interposer with
11.9 mm x 13.9 mm package size, 1006
contacts, and a 0.30 mm pitch.
to 0.3 mm.
Above top: FDZ5047N, Power MOSFET BGA
4.3x5.5mm, 20 bumps device, shown in horizontal and
vertical orientation; Bottom: 36 Bumps, WLP package,
0.4mm pitch, shown in 2D and 3D.
We also offer a variety of Kelvin solutions
available to assure reliable heat transmission and
precise device alignment in
the contactor. The Cohu ITS
pogo pin portfolio covers contactor solutions for
for BGAs and WLPs with offset pins for spring
WLPs, BGAs, LGAs, QFNs, DFNs, QFPs and
probes. We can also accommodate custom or
SO devices. n
specified spring probes.
July 2015
Boost your Yield!
Cohu has added the Yield Booster* to its
Gravity Feed Handlers
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Approximately 8% improved handler
uptime, fewer cleaning cycles and
reduced contactor maintenance
interventions.
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10% reduced contactor spare
part consumption per year due to
extended pin lifetime.
The Yield Booster option provides
a significant reduction of the contact
resistance and assures that it remains
stable through test. This technology uses
an electro-mechanical process that reduces
pin contamination and cleaning cycles,
extending the lifetime of the pins.
u
This Yield Booster is currently available
for the SO1000 and SO2000 Gravity Feed
Handlers, with other handler platforms
The Yield Booster option is the only
available solution which enables test
of analog products with extreme low
CRES requirements.
available soon. n
Field Data of Yield Booster Benefits
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2 - 5% Yield improvement
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Very low and consistent contact
resistance
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Higher first pass yield
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Reduced re-test
* Patent Pending
2015 BiTS Workshop a Success
Cohu had a big presence at The
Testing (IGBT and Diodes).”
Burn-in and Test Strategies (BiTS)
Additionally, Cohu showcased their
Workshop held in March 2015. Cohu’s
line of integrated contactor solutions
Markus Wagner, Manager, Contactor
for Turret, Gravity, Pick -and-Place and
Engineering presented “Contacting
Test-in-Strip Handlers. n
Solutions for High Power Bare Die
CONTACT US
12367 Crosthwaite Circle, Poway, CA 92064-6817
Tel. 858.848.8000
Email: [email protected]
www.cohuseg.com