Fourth Quarter FY 2014 Quarterly Update

Transcription

Fourth Quarter FY 2014 Quarterly Update
Fourth Quarter FY 2014
Quarterly Update
Infineon Technologies AG
Investor Relations
Table of Contents
 Infineon at a Glance
 Growth Drivers
 Results and Outlook
Disclaimer:
This presentation contains forward-looking statements about the business, financial condition and earnings
performance of the Infineon Group.
These statements are based on assumptions and projections resting upon currently available information and
present estimates. They are subject to a multitude of uncertainties and risks. Actual business development may
therefore differ materially from what has been expected.
Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update
forward-looking statements.
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 2
Average Cycle Financial Targets
Going forward
Historical
CAGR(99-14) = ~9%
FY99
FY02
FY04
FY06
Revenue Growth:
FY08
20%
FY10
FY12
FY14
Segment Result Margin:
14.4%
15%
10%
5%
0%
FY10
FY11
FY12
FY13
25%
20%
15%
10%
5%
0%
2014-11-27
FY14
FY10
FY11
FY12
FY13
~15%
Investment-to-Sales:
15.1%
FY09
~8%
FY14
~13%
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 3
Revenue Split by Division
Q4 FY 2014 revenue: EUR 1,175m
IPC
€219m
ATV
€518m
Courtesy: BMW Group
CCS
€142m
PMM
€300m
OOS+C&E*
€-4m
* Other Operating Segments;
Corporate and Eliminations.
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 4
Tight Customer Relationships are Based on
System Know-how and App Understanding
ATV
EMS partners
2014-11-27
IPC
PMM
CCS
Distribution partners
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 5
Infineon Holds Top Positions in All Major
Product Categories
Automotive
semiconductors
Power
semiconductors
total market in 2013:
$25.1bn
total market in 2013:
$15.4bn
Renesas
13.3%
Infineon
STMicro
Freescale
NXP
9.6%
7.9%
7.4%
6.5%
Infineon
Mitsubishi
Smart card ICs
total market in 2013:
$2.48bn
12.3%
NXP
32.3%
Infineon
7.2%
Toshiba
6.0%
STMicro
STMicro
5.8%
Samsung
Fairchild
5.5%
SHHIC
21.7%
17.9%
16.5%
6.4%
Automotive semiconductors incl.
semiconductor sensors.
Discrete power semiconductors and
power modules.
Microcontroller-based smart
card ICs.
Source: Strategy Analytics,
April 2014
Source: IHS Inc., September 2014
Source: IHS Inc., July 2014
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 6
Table of Contents
 Infineon at a Glance
 Growth Drivers
 Results and Outlook
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 7
Growth in Car Production and Content-perCar Continues Unabated
Global car production (cars ≤ 6t)
[units m]
[USD]
CAGR(13-17) = 3.5%
6.0
9.0
87.4
5.7
9.2
90.4
5.9
8.6
93.7
6.4
8.1
8.1
14.7
13.9
12.7
12.4
21.3
23.1
25.0
16.2
17.0
17.4
17.9
28.1
26.7
19.5
20.0
20.3
20.8
2013
2014
2015
2016
Europe
APAC ex China
97.3
6.3
13.2
North America
Japan
Brazil
China
230
200
CAGR
+2.8%
281
218
CAGR
+5.2%
18.3
North
America
487
429
CAGR
+2.6%
21.7
Europe
492
419
CAGR
+3.3%
2017
Japan
China
RoW
Source: IHS Inc., “Annual Light Vehicle Production and Sales
2007 – 2019”, October 2014 update
2014-11-27
CAGR
+2.4%
369
327
World
+3.4%
+3.2%
84.7
Semiconductor value per car
513
455
2018
CAGR
+2.4%
2013
Source: Strategy Analytics, "Automotive Semiconductor
Demand Forecast 2012 – 2021", incl. semiconductor
sensors, October 2014 update
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 8
In 2013, Infineon Gained Market Share in
All Addressed Product Categories
2013 automotive semiconductor
market by product category ($25.1bn)
Power
26%
Processor
25%
 “Power” and “Sensors” were the fastest
growing product categories with 8% and
7% growth y-y, respectively.
 Infineon remained market leader in
“Power” with 21.3% market share.
Sensors
15%
 Strong product portfolio in pressure and
Hall sensors led to significant market
share gain in “Sensors” of 1.0%-point.
others*
34%
Source: Strategy Analytics, April 2014.
* “others” include: opto, small-signal discretes, logic ICs, nonpower analog, memory, and other.
Market growth y-y
Power
Processor
Sensors
2014-11-27
8%
Infineon’s position 2013
#1
#3
2%
7%
#2
21.3%
8.7%
11.4%
Copyright © Infineon Technologies AG 2014. All rights reserved.
Infineon’s change y-y
+0.3%-pt
+0.7%-pt
+1.0%-pt
Page 9
In Addition to Powertrain, AURIX™ Is
Gaining Traction in Safety Applications
 Increasingly complex applications and more stringent requirements on functional safety
fuel transition from 16-bit to 32-bit microcontrollers.
 AURIX™ continues TriCore™-based success story in powertrain
applications: design-win for next-generation AURIX™ for powertrain
and transmission applications at leading European Tier-1.
 AURIX™ enters area of safety applications: About half of all
AURIX™ design-wins in FY14 already related to safety applications.
 Volume production of 65nm-based AURIX™ devices started at TSMC end of FY14.
AURIX™ design-wins in safety applications
 Electric power steering (EPS).
 Electronic stability control (ESC).
 “Classical” braking, autonomous emergency
braking (AEB).
 Camera-based object recognition.
 Radar-based distance warning.
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Courtesy: Bosch
Page 10
Wide Adoption of Premium Features, ADAS
and CO2 Reduction Drive ATV‘s Growth
Vehicle
production
Semiconductor content per car
CO2 reduction
Courtesy: BMW Group
~4% p.a.
ATV:
ADAS*
Courtesy: Bosch
Comfort, Premium
Courtesy: Bosch
2 – 4% p.a.
~8% p.a.
* ADAS: Advanced Driver Assistance Systems.
Sources: IHS Inc., Strategy Analytics, Infineon. All figures refer to mid-term compound annual growth rate of the respective market.
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 11
Increasing Inverterization Drives Demand
for Power Semis in Home Appliances
RC-H5
CIPOS™
Penetration of VSD*
Biggest home appliances market for
IGBT modules is air conditioning.
[units m]

Efficiency programs led and still lead
to higher VSD* penetration rate.
electric motor-based
home appliances

“Energy efficiency” labeling is key
differentiator vs competition.
VSD* penetration

total VSD* appliances
2011
2016
420
514
~20%
~40%
86
205
CAGR
4%
19%
Source: IHS Inc., “Major Home Appliances – World 2013”, October 2013.
* VSD: variable speed drive.
2014-03-24
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 12
Drives, Home Appliances and Others Show
Strongest Growth Rates
Drives
Renewables
Traction
Home
Appliances
Others
Expected growth of market segments
~10% p.a.
IPC:
> 5% p.a.
~5% p.a.
> 10% p.a.
> 10% p.a.
~10% p.a.
Sources: IHS Inc., Infineon. All figures refer to mid-term compound annual growth rate of the respective market.
2014-11-27
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Page 13
System Understanding Becomes Key
Success Factor for Next-Gen Si-Mic Design
Trends for higher number of silicon microphones
Silicon microphone
 Acoustic performance becomes differentiator and
enabler for new capabilities, e.g. command recognition,
driving number of microphones per device (up to four in
today’s smartphones to improve signal quality).
 New applications using microphones on the rise:
tablets, smart watches, wearables, etc.
Track record of IFX’s market share
29.8%
26.5%
16.1%
1.5%
8.8%
5.2% 7.3%
2007 2008 2009 2010 2011 2012 2013
Ranking 2013
Knowles
Membrane
59.1%
Infineon
29.8%
Omron
3.8%
ADI
2.6%
Wolfson
1.2%
Source: IHS Inc., “MEMS Microphone Report – 2014”, April 2014.
All data refer to units of silicon MEMS microphones excluding ASICs for signal conversion.
2014-05-19
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Page 14
PMM Aims to Outgrow Its Core Markets
Power Management
Computing
Mobile Communications
Lighting
Charger
Mobile devices
Cell. infrastructure
Expected growth of market segments
> 7% p.a.
PMM:
> 7% p.a.
~10% p.a.
Sources: IHS Inc., ABI Research, Infineon. All figures refer to mid-term compound annual growth rate of the respective market.
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 15
Strong Growth in Payment Business;
Design-wins in Government ID Projects
Strong momentum for
Infineon’s payment business
Worldwide government ID
projects in all major applications
 Payment business grew by ~50% yearon-year in FY14.
 Roll-out of chip-based
banking cards in China
and the US will fuel
further growth of this business.
[units m]
426
617
530
657
680
84
145
208
259
307
2014
2015
2016
2017
2018
USA
China
Source: IHS Inc., “Payment & Banking Cards Report – 2014”,
May 2014.
2014-11-27
 Infineon won contracts for government
ID projects in several European as well
as Asian, African and Latin American
countries in Q4 FY14.
 With this, Infineon provides chips to
more than 75% of all eID projects in
Europe and to more than 70% of all
ePassport projects in APAC.
 Infineon is present in more than 130
reference projects across all Government
ID applications* in 61 countries
representing 75% of the world's
population.
*
ePassport, National eID, eHealth Card, eResidence
Permit, eDriving Licence, MilitaryID and Road Toll.
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 16
CCS is Well Positioned to Grow Faster Than
the Market
High-end Mobile
Communications
Payment
Government
Identification
IoT Security
Expected growth of market segments
~0% p.a.
CCS:
~5% p.a.
~10% p.a.
~20 - 25% p.a.
6 – 9% p.a.
All figures refer to security microcontrollers.
Sources: IHS Inc., Infineon. All figures refer to mid-term compound annual growth rate of the respective market.
2014-11-27
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Page 17
Expected Growth Broadly In Line With
Historical Averages
ATV
Courtesy: BMW Group
~8% p.a.
Infineon:
IPC
PMM
CCS
~10% p.a.
6-9% p.a.
Courtesy: Siemens AG
~10% p.a.
~8% p.a.
Sources: IHS Inc., Strategy Analytics, ABI Research, Infineon.
All figures refer to mid-term compound annual growth rate of the respective market.
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 18
Table of Contents
 Infineon at a Glance
 Growth Drivers
 Results and Outlook
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 19
Q4 FY14 Was Sixth Consecutive Quarter
of Year-On-Year Growth
Revenue and Segment Result
[EUR m]
+12%
1.175
1.053
1.051
FY 2014 revenue split
by product category
1.110
984
14%
148
Q4 FY13
12%
14%
16%
116
146
170
188
Q1 FY14
Q2
Q3
Q4 FY14
Revenue
2014-11-27
15%
Segment Result
Power
embed. Control
RF
others
Segment Result Margin
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 20
Strong Q-Q-Growth in IPC, PMM and CCS;
ATV Stable Q-Q on High Revenue Level
ATV
IPC
[EUR m]
PMM
[EUR m]
CCS
[EUR m]
[EUR m]
+14%
455 452
484
510 518
+11%
+11%
271
197
179 185
200
238
219
252
271
300
18%
13% 12% 14% 14% 13%
12%
15%
17%
129
9%
17% 15% 18% 20% 20%
57
55
66
70
69
Q4 Q1 Q2 Q3 Q4
FY13FY14
FY14
Revenue
2014-11-27
33
27
33
40
44
Q4 Q1 Q2 Q3 Q4
FY13FY14
FY14
Segment Result
+10%
20%
49
29
37 46
60
Q4 Q1 Q2 Q3 Q4
FY13FY14
FY14
12
108
121 123
6%
7%
6
8
142
8% 14%
10
20
Q4 Q1 Q2 Q3 Q4
FY13FY14
FY14
Segment Result Margin
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 21
Guidance for Q1 FY15 and FY 2015
Outlook Q1 FY15
Outlook FY 2015
(compared to Q4 FY14)
(compared to FY 2014)
Revenue
Decline between
5% and 9%
Increase of 8%
+/- 2%-points
Segment
Result
Margin
Between
10% and 13%
About 14%
Investments in FY 2015
D&A in FY 2015
2014-11-27
(At the mid-point of the
revenue guidance)
About €700m
(Including €60m to €70m for Kulim 2 and €20m for Qimonda IP.)
About €600m
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 22
Increase of Dividend by 6 €-Cents Will Be
Proposed by Management at Coming AGM
Dividend payments
[€-Cents]
18
12
12
 Investment-to-sales
ratio reduced from
~15% towards ~13%.
 Higher sustainable
level of Free Cash
Flow frees up more
cash for increased
dividends.
12
10
Coming AGM takes place on
12 February 2015.
FY10
2014-11-27
FY11
FY12
FY13
FY14
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 23
Opex-to-Sales-Ratio Well Within
Target Range
S, G&A1)
R&D2)
[EUR m]
120
140
138
140
115
114
121
133
136
141
140
15%
122
14%
100
13%
80
60
12%
40
11%
20
0
10%
Q4
FY13
Q1
FY14
Q2
Q3
General & Administration
Q4
FY14
Q4
FY13
Selling
Q1
FY14
R&D
Q2
Q3
Q4
FY14
% of sales [rhs]
1) Target range for SG&A: „Low teens percentage of sales“.
2) Target range for R&D: „Low to mid teens percentage of sales“.
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 25
DOI, DSO and DPO in Line With Our
Targets
Working capital*
[EUR m]
Inventories
[EUR m]
Q4 FY13 Q1 FY14
Q2
Q3
Q4 FY14
0
-52
-100
-150
-75
-92
20
0
Q2
Q3
Inventories
[days]
581
100
80
60
400
40
200
20
0
0
Q4 FY13 Q1 FY14
Q2
Trade receivables
Q3
Q4 FY14
DOI*
Trade payables
[EUR m]
529
100
40
0
553
[days]
60
Q4 FY13 Q1 FY14
452
707
680
200
-123
518
674
80
Trade receivables
600
654
400
-16
-50
600
609
Q4 FY14
DSO*
[EUR m]
600
569
648
515
560
531
[days]
100
80
60
400
40
200
20
0
0
Q4 FY13 Q1 FY14
Q2
Trade payables
Q3
Q4 FY14
DPO*
* For definition please see page 31.
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 26
Pro Forma Gross Cash and Net Cash
Including International Rectifier
Liquidity Development
Gross Cash
Q4 FY13
Equity-linked
Net Cash
0*
0
190
Q1 FY14
Q2
Q3
Q4 FY14
~400
~1.700
~2100
2232
2418
186
2073
2263
2198
0
188
2048
2279
1983
195
193
2286
108
38
Debt
2010
[EUR m]
Q4 FY14
Pro forma**
* The remaining outstanding convertible bonds were converted by the end of January 2014.
** Pro forma calculation incl. gross cash and net cash of International Rectifier.
 Payment of €83m due to the antitrust fine and €260m for the settlement
with Qimonda insolvency administrator will have negative effect on Gross
Cash and Net Cash of €343m in the December quarter.
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 27
Proposal of Dividend of €0.18 Will Increase
Capital Returns by €202m in February
Total gross capital returns history
[EUR m]
1,053
 In November 2013, a
new €300m capital
returns program with a
maturity until Sep 2015
was started.
350
300
250
308
109
212
200
26
150
100
167
202
 After acquisition of
International Rectifier no
intention to continue to
issue new options or to
buyback shares.
164
130
173
50
62
FY11
129
129
38
35
FY13
FY14
20
0
FY12
convertible bond buyback
2014-11-27
202
 Per 30 Sep 2014, put
options for buyback of
6m shares outstanding.
FY15e
share buyback (via put options)
Copyright © Infineon Technologies AG 2014. All rights reserved.
dividends
Page 28
Target: 'RoCE Above WACC' Over the Cycle
RoCE* history
WACC: low teens %
30%
FY12: 22%
20%
27%
25%
20%
FY13: 14%
27%
10%
FY14: 20%
27%
17%
21%
24%
24%
Q1 FY14
Q2
Q3
Q4
16%
5%
7%
Q1 FY13
Q2
0%
Q1 FY12
Q2
Q3
Q4
Q3
Q4
Capital Employed* history
2,500 [EUR m]
2,000
1,889
2,035
1,629
1,760
Q1
FY12
Q2
Q3
Q4
2,239
2,274
2,216
2,159
2,194
2,232
2,327
2,452
Q1
FY13
Q2
Q3
Q4
Q1
FY14
Q2
Q3
Q4
1,500
1,000
500
0
* For definition please see page 31.
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 29
FY15 Investments Ratio excl. Kulim 2 and
Qimonda IP Would Be Down to ~13%
Investments*
D&A
[EUR m]
1000
30%
887
890
800
668
600
~600
15.0%
15.1%
453
11.9% 364
336
378
400
200
~700**
325
428
466
514
12.9%
10%
115
0
0%
FY09 FY10 FY11 FY12 FY13 FY14 FY15e
Q1
20%
Q2
Q3
Fiscal Year
Guidance
FY09 FY10 FY11 FY12 FY13 FY14 FY15e
6Y-avg % of sales [rhs]
% of FY15 revenue guidance [rhs]
* For definition please see page 31.
** Includes €60m to €70m for Kulim 2 and €20m for Qimonda IP.
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 30
Notes
Investments =
'Purchase of property, plant and equipment'
+ 'Purchase of intangible assets and other assets' incl. capitalization of R&D expenses
Capital Employed =
'Total assets'
– 'Cash and cash equivalents'
– 'Financial investments'
– 'Assets classified as held for sale'
– ('Total Current liabilities'
– 'Short-term debt and current maturities of long-term debt'
– 'Liabilities classified as held for sale')
RoCE =
NOPAT / Capital Employed =
('Income from continuing operations'
– 'financial income'
– 'financial expense')
/ Capital Employed
DOI (days of inventory; quarter-to-date) =
('Net Inventories' / 'Cost of goods sold') * 90
Please note:
All positions in ' ' refer to the
respective accounting position and
therefore should be applied with the
positive or negative sign used in the
relevant accounting table.
Working Capital =
('Total current assets'
– 'Cash and cash equivalents'
– 'Financial investment'
– 'Assets classified as held for sale')
– ('Total current liabilities'
– 'Short term debt and current maturities of long-term debt'
– 'Liabilities classified as held for sale')
DSO (days sales outstanding; quarter-to-date) =
('Trade receivables' / 'revenue') * 90
DPO (days payables outstanding; quarter-to-date) =
('Trade payables' / ['Cost of goods sold' + 'Purchase of property, plant and equipment']) * 90
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 31
Infineon is a Long-standing Member of
Europe's Leading Sustainability Indices
Infineon’s most recent achievements
 January 2014: Infineon is
listed in the Sustainability
Yearbook for the fourth
consecutive year and
according to RobecoSAM,
listed among the top 15%
most sustainable companies
worldwide.
 11 September 2014:
Infineon was listed in the
Dow Jones Sustainability
Index for the fifth
consecutive year.
2014-11-27
 September 2014:
Infineon was listed in
the STOXX® Global
ESG Leaders Indices,
which serves as an
indicator of the quality of Infineon’s
performance in the governance, social and
environmental areas (ESG).
 Infineon was added to the
FTSE4Good Index Series
in 2001 and has been
confirmed as a member
since then.
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 32
Financial Calendar
Date
Location
Event
02 – 03 Dec 2014
Scottsdale, AZ
Credit Suisse TMT Conference
29 Jan 2015*
12 Feb 2015
Q1 FY15 Results
Munich
Annual General Meeting
05 May 2015*
Q2 FY15 Results
30 Jul 2015*
Q3 FY15 Results
26 Nov 2015*
Q4 FY15 and FY 2015 Results
* preliminary
2014-11-27
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 33
Institutional Investor Relations Contact
Ulrich Pelzer
Corporate Vice President
Finance, Treasury &
Investor Relations
 +49 89 234-26153
 [email protected]
Joachim Binder
Senior Director
Investor Relations
 +49 89 234-25649
 [email protected]
Holger Schmidt
Manager
Investor Relations
2014-11-27
 +49 89 234-22332
 [email protected]
Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 34