BGA Reballing - - BMK Group - - Vorsprung durch

BGA Reballing - - BMK Group - - Vorsprung durch

BMK Group GmbH & Co KG
Werner-von-Siemens-Str. 6
D-86159 Augsburg
Tel.: +49 (0)821 - 20788- 0
Fax: +49 (0)821 - 20788- 101
Web: www.bmk-group.de
E-Mail: info[at]bmk-group.de
Link: http://www.bmk-services.de/en/elektronikservice/elektronik-rework/bga-reba
Reballing Tasks
• BGA Reballing - Lead Free Balls
• BGA Reballing - Leaded Balls
• BGA Reballing - Re-Alloying
• IC Refurbishment
Reballing technologies are becoming more and more common. The reasons are low availability of components and
the re-usage of expensiveIC s. Our customers often request re-alloying of components and some designs still
have the need for leaded components, which may on no longer be available on the market.
To perform this Task, we use a gentle process, which is certified by the Fraunhofer Institute. The process of
re-melting will be performed under Nitrogen on our Finetech machines. The component will only undergo one
thermal cycle.
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