Yoke Instrumentation: ILD Muon System / Tail Catcher

Yoke Instrumentation:
ILD Muon System / Tail Catcher
Valeri Saveliev
IAM, RAS, Russia
DESY, Germany
3 June, 2016
ILD Muon System/Tail Catcher
Detector Layou
Layo
Events/0.2 [GeV]
µ+
µ-
150
Zh µ+µ-X
s = 250 GeV
-1
Lint = 250 fb , P(e , e+) = (-0.8, +0.3)
Signal+Background (MC)
Fitted signal+Background
100
Fitted signal
Fitted background
50
0
120
130
140
150
TT
Mrecoil [GeV]
SS
Valeri Saveliev | ILD Muon System/Tail Catcher | 2
Ties Behnke, 2/16/2010
ILC Detector Concepts
ILD Muon System/Tail Catcher
•  Muons final states HZ, Z −> µµ is crucial for ILC Physics Program,
• 
• 
• 
• 
Large area with high Hermicity,
High efficiency of Identification and excellent hadron rejection,
Possibility to Recover the Hadron Interaction Tail,
Performance depends on integration with full detector
•  Simulation crucial in design stage,
•  Prototype construction and testing for realistic estimation of
performance and cost,
•  Cost
Valeri Saveliev | ILD Muon System/Tail Catcher | 3
Muon System/Tail Catcher
Detector Layout
Modules:
3 Barrels
Sizes:
R min:
R max:
Length:
4450
300
Typical
multi-purpose
7760
7760
2800
2560
detector
N of Sensitive
Layers
14 (16)
2 EndCaps
12
precision tracking
precision calorimetry
precision muon system
hermetic
Two
Twowell
welldeveloped
developedconcepts:
concepts:
SiD
SiD ILD
ILD
Ties Behnke, 2/16/2010
Valeri Saveliev | ILD Muon System/Tail Catcher | 4
ILC Detector Concepts
21
Instrumentation of the Yoke
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Simulation
Detailed Description of ILD Magnet, Muon System/Tail Catcher
Cryostat with Coils
in Simulation Framework
General view of Muon System
in Simulation Framework
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Simulation
Instrumentation of the Yoke (Muon System/Tail Catcher)
Cryostat : Detailed Geometry
Instrumentation:
2 Scintillation Double Sensitive Layers
Coil
: Detailed Geometry,
Coil Segmentation
Yoke
: Detailed Geometry based on
Mechanical Design
Instrumentation:
Barrel: total 14 +(2) Layers
40(Sc) + 10*[100(Fe)+40(Sc)]
+3*[560(Fe) + 40(Sc)] mm
EndCup: total 12 Layers
10*[100(Fe)+40(Sc)] +2*[560(Fe) +
40(Sc)] mm
Basic Option for the Simulation is Scintillator Cells 30 x 30 mm
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Simulation
Geometry of Stereolayers: ortogonal ?
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Simulation Results
10 GeV Single muons and pions in the Barrel and EndCup Region
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15
50
10
100
20
15
50
10
5
5
0
0
5
0
10
Momentum [GeV/c]
π contamination (%)
20
µ-id efficiency(%)
100
π contamination (%)
µ-id efficiency(%)
Simulation Results
0
0
5
10
0
Momentum [GeV/c]
Muon Efficiency and pion Contamination as function of energy of single
particles (color of the line is correspond to the layers of the Muon
System which are used for identification)
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Low Momenta Muon in Barrel
Problem of Identification: 3 GeV Single Muons in the Barrel Region
Due to Multipliscattering and Magnetic Field, muons partially don’t
reach Muon Sensitive Layers
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Muon Identification Performance
50 GeV b-jet in the ILD, PFA Reconstruction (red-muon tracs),
Not all Muons could be identified as Muons by Muon System
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Simulation Results
Muon Identification Efficiency and pion Contaminations in b-jet,
normalised on the energy of muons in b-jets > 5 GeV(color of the line is
correspond to the layers of the Muon System which are used for
identification)
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Muon Reconstruction Performance
Single Particles (muons) reconstruction in ILD PFA
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17. Example coil emulation (configuration two). The shaded rectangle on the left highlights the
ayers added to the AHCAL. The central shaded rectangle highlights the portion of the TCMT used
ate a magnet coil. The shaded rectangle on the right highlights the TCMT layers used for post-coil
g. See text for additional details.
Tail Catcher Significance
ull length of the TCMT or a coil with little or no additional sampling.
RMS/E [%]
Effect of Coil and Tail Catcher on the Energy Resolution
26
CALICE
24
Without TCMT Layers After Emulated Coil
22
With TCMT Layers After Emulated Coil
20
20 GeV π18
16
14
5
6
7
8
9
10
11
Thickness of Calorimeter System [λn]
18. Comparison of the energy RMS resolution of a 20 GeV negative pion sample with an emulated
hout final TCMT layers after the coil (triangular symbols) and with final TCMT layers after the coil
symbols). The calculation includes the energy from the ECAL and partial AHCAL.
Comparison of energy RMS for
Effect of Tail Catcher on the
20 GeV pions with an
Energy Resolution:
gure 19 indicates that for a coilemulated
located at 5.5lncoil
the improvement due to post-coil sampling RMS Visible Energy of Pions
with and without TCMT
without and with Muon System as
contribution
Tile Catcher
– 20 –
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R&D Muon System/Tail Catcher
Detector Technologies:
>  Scintillator Strip with Silicon Photomultiplier Readout
>  Resistive Plate Chamber
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R&D Sensitive Elements Technology
Resistive Plate Chamber (RPC) are considered as option of Sensitive Elements
Main advantage is excellent granularity up to 1 x 1 cm2 Pads,
One threshold (1 bit) Digital Readout.
Several Types of RPCs have been successfully constructed and tested within
ILC R&D program
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R&D Sensitive Elements Technology
The Main Option for the Sensitive Elements
Is Scintillator Strip with Wave Length Shifter and Silicon Photomultiplier Readout
The technology: Extruded Scintillation Strips with
ü  thickness of ~10 mm,
ü  width of ~30 mm,
ü  Maximal length of ~2800 mm.
ü  Scintillation Strips are covered by the Reflection Layer TiO2 that is coextruded
along side the Scintillator during the extrusion Process.
ü  1mm wide extruded groove running along the strip
ü  Commercially available WLS fiber ~1 mm diameter
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R&D Sensitive Elements Technology
Simulation of the Light Propagation and Detection
Scintillation UV Photons
created by Muon in Sensitive
Element
Converted Green Photon
in WLS (Scintillation Photons
are hidden)
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R&D Sensitive Elements Technology
Element
strip,
m)
2 , 50 µm pixels)
mamatsu 1 mmThe
preliminary results: Light Yield from both sides of WLS fiber
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R&D Sensitive Elements Technology
Scintillator Strips with WLS production:
The equipment is not so complicated, actually it could be easily build
in China..
(We have already production line for Scintillator Crystal - LySO…)
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R&D Sensitive Elements Technology
Silicon Photomultiplier Development:
>  CMOS Silicon Photomultiplier,
>  3D-IC SiPM,
>  3D-IC Digital Silicon Photomultiplier,
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R&D CMOS SiPM
>  Bias 13.25 V,
>  Excellent Single Photon Performance,
>  Optic Crosstalk Suppression
counts
pnbjt_array_250_130ns_2us_10V_13.25V
Q1
250
Entries
Mean
RMS
18000
293.8
57.52
200
150
100
50
0
0
200
400
600
800
Valeri Saveliev | ILD Muon System/Tail Catcher | 23
1000
1200
channel
R&D CMOS SiPM
SiPM was developed in CMOS TECHNOLOGY (180 nm) and produced in China
IMPORTANT points:
ü  Can be produced at any place in the world, at any CMOS Facility,
ü  Not needed the Quality Check, Quality Check is provided by CMOS Facilities,
ü  Lowest cost,
ü  Open way for the Advanced Developments…
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R&D Test Bench
Huazhong University of Science and Technology, China
Already with Support of
University Created World Class
Technology Test Lab’s
for Silicon Photomultiplier
Development
18/04/2016
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25
R&D Test Bench
Already with Support of HUST Created World Class Test and Development Lab’s
for Silicon Photomultiplier Investigations and Applications
build
o
t
Plan
18/04/2016
t Se
s
e
T
on
u
M
f
o
ng…
i
o
g
s on
tup i
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26
R&D Muon System/Tail Catcher
Advanced Silicon Photomultiplier Development:
>  3D-IC SiPM, - dramatically increasing the detection efficiency,
factor 2
>  3D-IC Digital Silicon Photomultiplier, - the SiPM principle operation is
digital (elementary sensors – pixels are sources of binary signals).
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Requirements for ILD Muon System
• 
• 
• 
• 
Mainly detected isolated particles,
Typical Signal ~ 10-20 (photons) photoelectrons per MIP on the face
of SiPM,
Dynamic range could be chosen ~100-128 photons (pixels)
Digital readout on the SiPM Chip even with local preliminary
analysis
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R&D SiPM Readout
3D InterConnection Technology: gives the possibility to build the
completely digital SiPM with excellent performance
ü 
detection efficiency ~ 80% (factor 2 in comparison to existing SiPMs)
no analog electronics.
ü 
digital output signal (already in number of photons)
ü 
Sensors Digital
Digital Memory
Processing and Output
We planed 3 layers: sensors, digital memory, processing electronics
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Conclusion and Outlook
Muon System:
>  Muon identification
§  ~98% muon identification efficiency and correspondingly about
99% pions rejection at energy > 3.5 GeV
§  Muons identification with energies < 3 GeV. Needs dedicated
analysis
>  Muon Reconstruction in the ILD (PFA):
§  d(1/pt) = 2.3 10-5 GeV-1
§  d(D0) = 2.5 microns
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Conclusion and Outlook
Tail Catcher:
•  Improves energy resolution. In particular at high energies
•  Full thickness instrumentation of yoke important for pion
rejection (Also needed for achieving low stray field)
•  Instrumentation of outer (thick) layers is useful for pion
rejection. Much better than just one muon sensitive layer at the
end.
•  Increasing iron plate thickness from 10 to 20 cm will be study
In addition, one very thick instead of three outer iron layers (each about
100tons) would be much more difficult to deal with (manufacturing,
transportation and assembly)
Coil Instrumentation:
•  improvement of energy resolution for Hadrons
•  useful for low energy muons identification
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