Cree XLamp MC-E LED Data Sheet

Transcription

CLD-DS16 Rev 11H
Product family data sheet
Cree® XLamp® MC-E LED
MC-E White
MC-E Color
Product Description
MC-E Dynamic White
FEATURES
The XLamp® MC-E LED is a family of
Table of Contents
• Available in white (2600 K –
Characteristics
10,000 K CCT), EasyWhite ,
Complete Package............................ 2
provides high lumen output in a small
Dynamic White, or color (RGBW)
Per LED Die (White)........................... 2
package. Compared to discrete LEDs,
• ANSI-compatible neutral & warm
Per LED Die (Color)............................ 2
lighting-class,
multi-chip
LEDs
that
XLamp MC-E LEDs reduce the distance
®
white chromaticity bins
Flux Characteristics
between LED die, creating a small optical
• Individually addressable LEDs
White.................................................. 3
source for excellent optical control and
• MC-E Dynamic White LEDs have
EasyWhite®........................................ 4
efficient color mixing. XLamp MC-E LEDs
two cool-white (6500 K) and two
can reduce LED system complexity by
warm-white (2700 K) LED die
reducing the number of components
• MC-E EasyWhite LEDs available in
2- and 4-step bins, up to 85 CRI
required.
• Maximum drive current: 700 mA per
Cree
XLamp
LEDs
bring
high
performance and quality of light to a wide
range of lighting applications, including
LED die
• Reflow solderable – JEDEC
J-STD-020
Relative Spectral Power Distribution
White.................................................. 5
Color................................................... 5
Relative Flux Output vs Junction
Temperature............................................ 6
Electrical Characteristics........................ 7
Relative Intensity vs. Current.................. 7
Typical Spatial Radiation Pattern........... 8
color-changing lighting, portable and
• Electrically neutral thermal path
Reflow Soldering Characteristics........... 9
personal lighting, outdoor lighting, indoor
• RoHS and REACh compliant
Notes.....................................................10
directional lighting, and entertainment
• UL recognized component
Mechanical Dimensions.......................12
lighting.
®
(E349212)
Tape and Reel........................................13
www.cree.com/Xlamp
Packaging..............................................14
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and
EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
XLamp ® MC-E LED
Characteristics - Complete Package
The following table lists the product characteristics for the XLamp MC-E LED package.
Characteristics
Unit
Thermal Resistance, junction to solder point - white
°C/W
Thermal Resistance, junction to solder point - color
Minimum
Typical
Maximum
3
°C/W
4
Viewing Angle (FWHM) - white
degrees
110
Viewing Angle (FWHM) - color
degrees
115
ESD Withstand Voltage (HBM per Mil-Std-883D)
V
8000
LED Junction Temperature
°C
150
Characteristics - Per LED Die (White, EasyWhite®, Dynamic White)
The following table lists the product characteristics of each individual LED die within the XLamp MC-E White LED package.
Characteristics
Unit
Temperature Coefficient of Voltage
Minimum
Typical
mV/°C
DC Forward Current
Maximum
-4
mA
700
Reverse Voltage
V
5
Forward Voltage (@ 350 mA)
V
3.1
V
3.4
3.9
Characteristics - Per LED Die (Color)
The following table lists the product characteristics for each LED die within the XLamp MC-E Color LED package.
Characteristics
Temperature Coefficient of Voltage
DC Forward Current
Unit
mV/°C
Red
Green
Blue
White
Typical
-2
-4
-4
-4
mA
Maximum
700
700
700
700
Reverse Voltage
V
Maximum
5
5
5
5
V
V
Typical
2.1
3.4
3.2
3.1
Maximum
2.5
3.9
3.9
3.9
Typical
2.3
3.7
3.5
3.5
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a
trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC.
2
XLamp ® MC-E LED
Flux Characteristics - White, Dynamic White, Color (TJ = 25 °C)
The following table provides several base order codes for XLamp MC-E LEDs. It is important to note that the base order codes listed here
are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the ordercode nomenclature, please consult the XLamp MC-E LED Binning and Labeling document.
Part
White
Color
Minimum
Maximum
Cool White
5000 K
10,000 K
Neutral White
3700 K
5000 K
Warm White
Dynamic White
Color
CCT / Dominant Wavelength Range
2600 K
3700 K
Minimum Luminous Flux
@ 350 mA*
Flux (lm)
K
370
MCE4WT-A2-0000-000K01
M
430
MCE4WT-A2-0000-000M01
J
320
MCE4WT-A2-0000-000JE4
K
370
MCE4WT-A2-0000-000KE4
G
240
MCE4WT-A2-0000-000GE7
H
280
MCE4WT-A2-0000-000HE7
J
320
MCE4WT-A2-0000-000JE7
2 cool-white die
6500 K
K
100
2 warm-white die
2700 K
G
70
2 cool-white die
6000 K
K
100
2 warm-white die
2700 K
G
70
Red
620 nm
630 nm
Green
520 nm
535 nm
Blue
450 nm
465 nm
Order Code
Group
MCEDWT-A1-0000-0000A1001
MCEDWT-A1-0000-0000A1002
30.6
A5
67.2
8.2
Cool White
5700 K
7000 K
100
Red
620 nm
630 nm
30.6
Green
520 nm
535 nm
Blue
450 nm
465 nm
Neutral White
3700 K
4300 K
A4
67.2
8.2
MCE4CT-A2-0000-00A5AAAA1
MCE4CT-A2-0000-00A4AAAB1
80
Notes:
• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements, ±2 on CRI
measurements and ± 1 nm on dominant wavelength measurements. See the Measurements section (page 10).
• Typical CRI for cool white and neutral white (3700 K - 10,000 K CCT) is 75.
• Typical CRI for warm white (2600 K - 3700 K CCT) is 80.
* Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA. The flux and chromaticity
of XLamp MC-E White LED are measured with all LEDs lit simultaneously. The flux and color of each LED in XLamp MC-E Dynamic
White and MC-E Color LEDs are measured individually.
3
XLamp ® MC-E LED
Flux Characteristics - EasyWhite® MC-E LEDs (TJ = 25 °C)
The following table provides order codes for XLamp MC-E EasyWhite LEDs. For a complete description of the order-code nomenclature,
please consult the XLamp MC-E LED Binning and Labeling document.
Color
CCT
Range
4000 K
3500 K
Standard CRI
EasyWhite
3000 K
2700 K
4000 K
80-CRI
Minimum
EasyWhite
3500 K
3000 K
2700 K
85-CRI
Minimum
EasyWhite
3000 K
2700 K
Minimum Luminous Flux
@ 350 mA, 25 ° C*
Group
Flux (lm)
K
370
J
320
J
320
H
280
J
320
H
280
J
320
H
280
K
370
J
320
J
320
H
280
J
320
H
280
J
320
H
280
H
280
G
240
H
280
G
240
2-Step
Chromaticity
Region
40H
35H
30H
27H
40H
35H
30H
27H
30H
27H
4-Step
Order Code
MCEEZW-A1-0000-0000K040H
MCEEZW-A1-0000-0000J040H
MCEEZW-A1-0000-0000J035H
MCEEZW-A1-0000-0000H035H
MCEEZW-A1-0000-0000J030H
MCEEZW-A1-0000-0000H030H
MCEEZW-A1-0000-0000J027H
MCEEZW-A1-0000-0000H027H
MCEEZW-H1-0000-0000K040H
MCEEZW-H1-0000-0000J040H
MCEEZW-H1-0000-0000J035H
MCEEZW-H1-0000-0000H035H
MCEEZW-H1-0000-0000J030H
MCEEZW-H1-0000-0000H030H
MCEEZW-H1-0000-0000J027H
MCEEZW-H1-0000-0000H027H
MCEEZW-P1-0000-0000H030H
MCEEZW-P1-0000-0000G030H
MCEEZW-P1-0000-0000H027H
MCEEZW-P1-0000-0000G027H
Chromaticity
Region
40F
35F
30F
27F
40F
35F
30F
27F
30F
27F
Order Code
MCEEZW-A1-0000-0000K040F
MCEEZW-A1-0000-0000J040F
MCEEZW-A1-0000-0000J035F
MCEEZW-A1-0000-0000H035F
MCEEZW-A1-0000-0000J030F
MCEEZW-A1-0000-0000H030F
MCEEZW-A1-0000-0000J027F
MCEEZW-A1-0000-0000H027F
MCEEZW-H1-0000-0000K040F
MCEEZW-H1-0000-0000J040F
MCEEZW-H1-0000-0000J035F
MCEEZW-H1-0000-0000H035F
MCEEZW-H1-0000-0000J030F
MCEEZW-H1-0000-0000H030F
MCEEZW-H1-0000-0000J027F
MCEEZW-H1-0000-0000H027F
MCEEZW-P1-0000-0000H030F
MCEEZW-P1-0000-0000G030F
MCEEZW-P1-0000-0000H027F
MCEEZW-P1-0000-0000G027F
Notes:
• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on
CRI measurements. See the Measurements section (page 10).
• For Standard CRI parts, the typical CRI is 80 for 4000 and 3500 K CCT parts and typical CRI is 82 for 3000 and 2700 K CCT.
* Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA and with all LEDs lit
simultaneously.
4
XLamp ® MC-E LED
Relative Spectral Power Distribution (If = 350 mA per LED) - White
Relative Spectral Power Distribution (IF = 350 mA per LED) - White
The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on sim
The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on simultaneously.
Relative Radiant Power (%)
100
80
5000 K - 10,000 K
CCT
60
3700 K - 5000 K
CCT
40
2600 K - 3700 K
CCT
20
0
380
430
480
530
580
630
680
730
780
Wavelength (nm)
Relative Spectral Power Distribution (If = 350 mA per LED) - Color
The following
graph
represents
typical spectral
output
the -XLamp
Relative
Spectral
Power
Distribution
(IF = 350 mA
perofLED)
ColorMC-E Color LED with all four LEDs on simulta
The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously.
100
80
60
RGBW (6000 K)
RGBW (4000 K)
40
20
0
380
430
480
530
580
630
680
730
780
Wavelength (nm)
5
XLamp ® MC-E LED
The following
graph
represents
typical spectral
output
of LED)
the XLamp
MC-E
Color LED with each LED on independen
Relative
Spectral
Power
Distribution
(IF = 350 mA
per
- Color
(continued)
The following graph represents typical spectral output of the XLamp MC-E Color LED with each LED on independently.
100
80
Red
60
Green
Blue
40
White (6000 K)
White (4000 K)
20
0
380
430
480
530
580
630
680
730
780
Wavelength (nm)
Relative Flux Output vs Junction Temperature (I = 350 mA)
Relative
Flux Output vs. Junction Temperature (If = 350 mA)
F
TheThe
following
typical
performance
of each
LED
dieXLamp
in the MC-E
XLamp
MC-E LED
followinggraph
graph represents
represents typical
performance
of each
LED die
in the
LED.
100%
Relative Luminous Flux
90%
80%
70%
White
60%
Red
50%
Green
40%
Blue
30%
20%
10%
0%
25
50
75
100
125
150
Junction Temperature (ºC)
6
XLamp ® MC-E LED
Electrical Characteristics (Tj = 25ºC)
Electrical
(TJ performance
= 25 ˚C)
The following Characteristics
graph represents typical
of each LED die in the XLamp MC-E LED
The following graph represents typical performance of each LED die in the XLamp MC-E LED.
700
Forward Current (mA)
600
500
400
White, Blue
Red
300
Green
200
100
0
1.5
2.0
2.5
3.0
3.5
4.0
Forward Voltage (V)
Relative
Intensity vs. Current (Tj = 25ºC)
Relative Intensity vs. Current (T = 25 ˚C)
J
The following graph represents typical performance of each LED die in the XLamp MC-E LED.
200
Relative Luminous Flux (%)
180
160
140
120
White, Blue
100
Red
Green
80
60
40
20
0
0
100
200
300
400
500
600
700
Forward Current (mA)
7
XLamp ® MC-E LED
Typical Spatial Radiation Pattern
Typical Spatial Radiation Pattern
following
graph
represents
output
of the
with all four LEDs on simultaneously.
The followingThe
graph
represents
typical
outputtypical
of the spectral
XLamp MC-E
LED
withXLamp
all fourMC-E
LEDsLED
on simultaneously.
100
Relative Luminous Intensity (%)
80
60
White
Color
40
20
-90
-60
-30
0
0
30
60
90
Angle (º)
8
XLamp ® MC-E LED
Reflow Soldering Characteristics
In testing, Cree has found XLamp MC-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
Time
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Free Solder
1.2 °C/second
Preheat: Temperature Min (Tsmin)
120 °C
Preheat: Temperature Max (Tsmax)
170 °C
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
1 - 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
9
XLamp ® MC-E LED
Notes
Measurements
The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely
represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors
that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are
provided for informational purposes only and are not intended as specifications.
Pre‑Release Qualification Testing
Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.
For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document.
Moisture Sensitivity
Cree recommends keeping XLamp MC-E LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp MC-E LEDs should be handled and stored as MSL 4 per JEDEC J-STD-033, meaning they have limited
exposure time before damage to the LED may occur during the
soldering operation. The table on the right specifies the maximum
Temperature
Maximum Percent Relative Humidity
30%
40%
50%
60%
70%
80%
90%
exposure time in days depending on temperature and humidity
30 ºC
9
5
4
3
1
1
1
conditions. LEDs with exposure time longer than the specified
25 ºC
12
7
5
4
2
1
1
maximums must be baked according to the baking conditions
20 ºC
17
9
7
6
2
2
1
listed below.
Baking Conditions
It is not necessary to bake all XLamp MC-E LEDs. Only the LEDs that meet all of the following criteria must be baked:
• LEDs that have been removed from the original MBP.
• LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
• LEDs that have not been soldered.
LEDs should be baked at 80 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do
not bake parts at temperatures higher than 80 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity
section above.
10
XLamp ® MC-E LED
Notes - Continued
Storage Conditions
XLamp MC-E LEDs that have been removed from the original MBP but not soldered yet should be stored in a room or cabinet that will
maintain an atmosphere of 25 ± 5 ºC and no greater than 10% RH. For LEDs stored in these conditions, storage time does not add to
exposure time as defined in the above Moisture Sensitivity section.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product
Documentation sections of www.cree.com.
REACh Compliance
REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has
published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to
insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available
upon request.
UL® Recognized Component
Level 1 enclosure consideration. The LED package or a portion thereof has not been investigated as a fire enclosure or a fire and electrical
enclosure per ANSI/UL 8750.
Vision Advisory
WARNING. Do not look at exposed LED lamps in operation. Eye injury can result. For more information about LEDs and eye safety, please
refer to the LED Eye Safety application note.
11
6
5
4
3
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE INC.
XLamp ® MC-E LED
4
3
6
2
5
REVISIONS
REV
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
OF CREE INC.
COMMENTS
A
Mechanical Dimensions
Initial Release
B
1.45
Change height due to new lens
C
Change recommended solder pad footprint
Height change .05±.05
due to new lens (was 3.86)
D
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
E
HEATSINK
5
NOTICE
DATE
APPROVED
BY AND THE INFORMATION
CREE CONFIDENTIAL.
THIS PLOT
CONTAINED
WITHIN
ARE
THE PROPRIETARY AND
10/16/07
RC
10/23/2007
RC
MAY NOT
BE COPIED, REPRODUCED
+.13OR DISCLOSED TO ANY
.75 -.03
UNAUTHORIZED
PERSONRCWITHOUT
THE WRITTEN CONSENT
11/26/2007
OF CREE INC.
12/26/2007
RC
5/12/2008
RC
1
+.13
.75 -.03
.80
TYP.
6
Color
D1: Red
D2: Green
D3: Blue 1
D4:DATEWhite
2
REVISIONS
C
REV
+.2
9.0
.0
D
A
D2 D3
Initial Release
Change recommended solder pad footprint
D
Height change due to new lens (was 3.86)
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
8
HEATSINK
7
6
5.40
5
A
2.60
.05±.05
+.13
.75 -.03
+.2
9.0
.0
4
APPROVED BY
A
RC
2.60
10/23/2007
.25
RC
4.48±.20
.05±.05
D
7.50
1
2
2.60
5.40
+.2
7090MC
INDEPENDENT
Bottom
9.0 PARALLEL /7.50
.0CONFIGURATION
Side View
8
1
D1
5.60
C
2
1
D1
B
2.84
POSITIVE (+) 1
1.16
7.70 10.02
8(-) 3
NEGATIVENEGATIVE
(-) 1
6
D1
D5
POSITIVE (+) 1
7
.10
2
D2
2.00
POSITIVE (+) 2
3.85
1.30
5
7(-) 4
NEGATIVENEGATIVE
(-) 2
3
6
1.50 BSC
3
PITCH
POSITIVE (+) 3
7.00
B
A
D8
2
4
(+) 4
POSITIVE POSITIVE
(+) 2
POSITIVE (+) 3
D7
5
1.16
NEGATIVE (-) 4
NEGATIVE (-) 1
1
D4
8
2.75
D1
4
THIRD ANGLE PROJECTION
1 POSITIVE (+) 4
POSITIVE (+) 1
D8
DRAWN BY
DATE
UNLESS OTHERWISE SPECIFIED
10/16/07
R.Chaloupecky
DIMENSIONS ARE IN
2.00 CHECK
B DATE
MILLIMETERS & BEFORE FINISH.
5
Ban
Loh
TOLERANCE UNLESS SPECIFIED:
APPROVED
DATE
.X ± 0.3
.XX ± .13
6
3.85
A
Tolerances: .10
10.02
MATERIAL 7.70
X° mm
± 1° bigger 2.84
Solder mask windows must be .05
than PCB Solder Pad.
FOR SHEET METAL PARTS ONLY
2.75
X°
± 2°
3
6
5
TITLE
SIZE
OUTLINE DRAWING,
1.
C
20:1
DRAWING NO.
2
D2
4
POSITIVE (+) 2
UNLESS
SPECIFIED
2.84OTHERWISE
7.70
10.02
DIMENSIONS ARE IN
.X ± 0.3
1.30 .XX ± .13
X°
± 1°
.X ± .25
.XX ± .10
DRAWN B
R.Cha
DIMENSIONS AREX°
IN ± 2°
3 MILLIMETERS & BEFORE FINISH.
A
D7
2.75
.X ± .25
.XX ± .10
E
SHEET 1 OF 1 D4
1
4
POSITIVE (+) 4
3
6
CHECK
Ban L
APPROVE
.XX ± .13
REV.
5
4
2.00
Tolerances: .10
7.7
10.02
THIRD ANGLE
PROJECTION
D3
31.24
Solder mask
windows
must
be
mm biggerX° ± 1°
POSITIVE
(+) .05
3
2610-00005
NEGATIVE (-) 4
.10
RECOMMENDED PCB SOLDER PAD
.X ± 0.3
6
7090MC
2.
NEGATIVE
(-) 3PACKAGE
SCALE
2
Durham, N.C 27703
D6
FINAL PROTECTIVE FINISH
1.30
1.50 BSC
4600 Silicon Drive
PITCH
4
3.85
.X ± .25
.XX ± .10
7
NEGATIVE (-) 2
4
3
(+) 3
POSITIVE POSITIVE
(+) 1
D5
1.50 BSC
PITCH
1.
2.
1
7090MC
PARALLEL / D3
INDEPENDENT
6
3
CONFIGURATION
NEGATIVE (-) 3
2.75
1.30
Tolerances:
1.00
TYP..10
POSITIVE
(+) 4 windows must be .05 mm bigger
Solder
mask
1. 4
2.
D4
1.16
5
7.70 10.02
D7
4
2.84
5.60
5
1.50 BSC
POSITIVE (+) 2PITCH
D8
D6
D3
A
D4
D2
3.85
D6
6
D7
D5
2.75
.10
D1 D4
B
1.00
TYP.
D3
B
.25
7.00
D2 D3
D6
1.00 TYP.
4
5
View
8
D5
7090MC PARALLEL / INDEPENDENT
D2
7
CONFIGURATION
NEGATIVE (-) 2
.10
1.50 BSC
PITCH
5.40
.25
2.00
6
E
A
2.60
1.50 BSC
PITCH
3
7
.10
A
5
.80
7.00
TYP.
.25
C
1.16
REV
6
D1 D4
8
R3.18
5.60
8
7
D2 D3
R3.18
C
NEGATIVE (-) 1
3.85
.05±.05
3 D1 D4
4
2
+.13
.75 -.03
C
1.00 TYP.
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
1
B
+.2
9.0
.0
1.45
1.50 BSC
5.40
PITCH
1.16
7.50
1.45
D
B
7
E
.80
TYP.
D2 D3
3
R3.18
5.60
2
D
4
C
Top View
8
3
A
Dynamic
WhiteRC
11/26/2007
D1:
Cool WhiteRC
12/26/2007
D2: Warm White
5/12/2008
RC
D3: Cool White
D4: Warm White
7.00
BSC
H
B
C
HEATSINK
10/16/07
7.50
Change height due to new lens
D1 D4
B
C
C
COMMENTS
4
1
A
All measurements are ±.1 mm unless otherwise indicated.
D
1.45
5
NOTICE
1 THE
2 INFORMATION
3
4
CREE CONFIDENTIAL. THIS PLOT AND
MAY NOT BEHEATSINK
COPIED, REPRODUCED OR DISCLOSED TO ANY
OF CREE INC.
5
2
REV
.80
TYP.
4.48±.20
D
D
R3.18
3
6
4.48±.20
NOTICE
DCONFIDENTIAL. THIS PLOT AND THE INFORMATION
CREE
1
4
X°
MATERIA
FINAL PROT
± 2°
5
D8
A
1.50 BSC
PITCH
1.5
Recommended Stencil Pattern
(Shaded Area
is Open)
RECOMMENDED
PCBPCB
SOLDER
PADPad
Recommended
Solder
1.
2.
Tolerances: .10
Solder mask windows must be .05 mm bigger
than PCB
Solder Pad.
ESS OTHERWISE SPECIFIED
10/16/07
4600 Silicon Drive
R.Chaloupecky
DIMENSIONS ARE INCopyright © 2008-2016 Cree, Inc. All rights reserved. The information in
thisN.Cdocument
Durham,
27703
DATE
CHECK
®
METERS & BEFORE trademark
FINISH.
ofBan
Cree,
Inc UL and the UR logo are registered trademarks of UL LLC.
Loh
RANCE UNLESS SPECIFIED:
APPROVED
DATE
.X ± 0.3
TITLE
.XX ± .13
DRAWN BY
X°
± 1°
DATE
6
MATERIAL
OUTLINE DRAWING,
7090MC PACKAGE
5
is subject to change without notice. Cree , XLamp and EasyWhite are registered trademarks
®
®
®
A
DIMENSIONS ARE IN
.X ± 0.3
.XX ± .13
X°
3
± 2°
R.Ch
CHECK
Ban
APPRO
MATER
and the Cree.X logo
is a
± .25
.XX ± .10
X°
4
± 1°
DRAW
12
FINAL PR
XLamp ® MC-E LED
Tape and Reel
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all measurements in mm.
4.0±.1
1.5±.1
12.0±.1
1.75±.10
5.5±.1
Cathode Side
+.3
16.0
.0
Anode Side
(denoted by chamfer)
User Feed Direction
END
START
Loaded Pockets
(200 Lamps)
Trailer
160mm (min) of
empty pockets
sealed with tape
(13 pockets min.)
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(34 empty pockets min.)
User Feed Direction
Cover Tape
Pocket Tape
13mm
7"
13
XLamp ® MC-E LED
Packaging
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin Code,
Quantity, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Dessicant
(inside bag)
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Quantity, Reel ID, PO #
Humidity Indicator Card
(inside bag)
Label with Cree Bin
Code, Quantity, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
(on bottom of box)
14

Cree XLamp MC-E LED Data Sheet

Transcription

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