Circuit Board Laminates as a part of High Frequency PCB

Transcription

Circuit Board Laminates as a part of
High Frequency PCB
Aspocomp – Piirilevytekniikkaa 2015
Oulu on 10.2.2015
Mika Sillgren
Content
•
Panasonic Electronic Materials Business Division brief
•
High speed laminate trends
•
Dielectric material production process
•
Key Characteristics of dielectric laminates for high speed circuit boards
–
Resin system
•
•
–
Copper foil
•
•
–
Dk/Dielectric constant
Df/Dissipation factor
Roughness
Inner layer treatment
Glass cloth
•
•
Glass cloth style (E-glass vs. NE-glass)
Spreading of Glass cloth
•
Panasonic circuit board material offering for high speed applications
•
Summary and Key takeaways
Panasonic
2
Trends
Process
Characteristics – Resin – Copper foil – Glass cloth
© Panasonic Corporation Electronic Materials Business Division
Materials
Summary
Panasonic Corporation - Four Company System
Electronic
Materials
Business Division
3
Product Development from viewpoint of customer
Requirements
・Switches
・Base Stations
・etc.
・Servers
・Routers
Networking Equipment
IC Substrates
IC Substrate Materials
series
Products
Low Dk/Df and High Tg
Circuit Board Materials
series
・
・
・
・
・
LED, Automotive,
Power Device
High thermal
dissipation Materials
・BOCs
(Black type)
・PC-BGAs
Evaluation
and Analysis
Acquired Technology
Technology
・
・
・
・Halogen-free FR-4
・Halogen-free CEM-3
・Halogen-free FR-1
Automotive
series
・
・
・
PreMulti
Material Design
Technology
Halogen free
・etc.
High Reliability
Circuit Board Materials
Process
Technology
series
・LED back light ・ECUs, Headlamp
・LED lightings
・etc.
・CSP Cards
(Mass laminations)
・Automotive
・etc.
Flexible Circuit Board
Materials
series
Advanced Films
・TVs
・Note PCs
・DVCs
・DVD Players
・Printers
・DVD-ROM drives
・etc.
・Laundry machines
Home Appliances
PC-related Devices
4
series
・Tablet PCs
・Note PCs
・Digital Audio
Players
・etc.
・Smart phones ・DSCs
Mobile Products
Global Production System
We have production bases in China, Asia, Europe and Japan
to effectively support customer’s global production.
Multi-layer
Materials
Foundation 2000
R&M
PIDM Europe
R&M
Foundation 1995
Multi-layer
Materials
CEM-3
R&D
Circuit Board
Multi-layer
Materials
Foundation 1999
PIDM Guangzhou
PIDM Suzhou
R&M
Molding
Compounds
Encapsulation
materials
Research &
Marketing Group
PIDM Shanghai
Europe
N.America
China
Japan
Asia
Foundation 1970
Multi-layer
Materials
Encapsulation
materials
PreMulti
Foundation 1961
Molding
Compounds
Molding
product
Advanced Film
Flexible CCL
PIDM Koriyama
PIDM Singapore
Foundation 1996
Paper
Phenolic CCL
Molding
Compounds
Encapsulation
materials
Foundation 2001
Multi-layer
Materials
Foundation 1986
CEM-3
Flexible CCL
Encapsulation
materials
PMF Ayutthaya
5
Foundation 1987
Multi-layer
Materials
PIDM Yokkaichi
PIDM Taiwan
Electronic Materials
Business Unit
PIDM Koriyama
West Factory
PIDM Yokkaichi
South Factory
High speed laminate trends – Examples of Applications
Navigation
systems
1.2–1.6 GHz
Bluetooth
2.4 GHz
RFID
W-LAN
850–950 MHz
2.4 – 5.8 GHz
Mobile phones
800 Mhz – 3.8 GHz
WIGIG
60 GHz
Networking
systems
3 – 6 GHz
Optical systems
>10 GHz
Router
5-14GHz
Server
4-12 GHz
Car radar
systems
FM Radio
24 – 79 GHz
88 - 108 MHz
TV broadcasting
D-TV satellites
VHF: 50 - 230MHz
UHF: 470 - 890MHz
Frequency
100MHz
1GHz
10
Wave length [m]
UHF
6
11 – 15 Ghz
1m
10GHz
1-1
VHF
10cm
100GHz
1-2
SHF
1cm
1-3
EHF
1mm
High speed laminate trends – ICT segment
Source: LinLin ECWC13
7
High speed laminate trends – ICT segment
Source: LinLin ECWC13
8
Dielectric material production process – raw materials
Copper foil
Copper Clad
Laminate
(Fully cured)
Resin
Prepreg
(Semi-cured)
Glass cloth
Raw materials
9
Products
Customer products
Laminate and Prepreg Production process
Acceptance of
raw materials
1
Varnish Blending
2
Varnish Impregnation
Produces the varnish by
blending epoxy resin, solvent,
catalyst and hardening agent.
3
4
Drying
Cutting
Drying of varnish-impregnated glass cloth,
and detection of foreign materials by appearance inspect.
Prepregs are ready.
Solvent
Copper foil
Catalyst
Hardening
agent
Epoxy resin
Glass cloth
Epoxy resin
Yarn
5
6
7
8
9
Build-up
Build-up
Press
Break-down
Inspection
Packing
Cover prepregs by copper foil
and stainless plates.
Lamination process for CCL.
Lamination of copper foil to
prepregs by pressure and
heat in vacuum press.
Remove the stainless plates
from copper clad laminate.
Stainless plate
Copper foil
Prepreg
Copper
Clad
Laminate
10
Inspection of CCL appearance
and packing.
Electrical characteristics of resin and glass (Dk and Df)
※@1MHz
10-1
Dissipation factor
Thermosetting Resin
Epoxy
10-2
Polyimide
Thermoplastics Resin
PPO
10-3
PP
PE
PS
PTFE
10-4
Polymethylpentene
10-5
1
2
3
4
5
Dielectric constant
Properties of glass

11
Final properties of laminates and prepregs are combination of properties of resin- and glass
cloth used.
Electrical characteristics of resin (impact of resin + glass to Dk)

12
Dk level of laminate is depending on resin content (ratio of glass cloth and resin) used, and is
varying even for same laminate product.
Electrical characteristics of resin – Why Low Dk/Df for HS boards?
Formula for impedance
Zo =
5.98h
60
ln
√εr
π（0.8W＋t）
100um


13
150
140
130
120
110
100
90
80
70
60
50
Cu thickness ：t=35μm
Impedance：50 Ω
2
3
Dk
4
5
Cu thickness ：t=35μm
Impedance：50 Ω
0.45
Dielectric thickness [mm]
Circuit width [um]
0.25 mmt
0.4
0.35
0.3
0.25
0.2
0.15
0.1
2
3
4
5
Dk
Lower Dk ⇒ Wider circuit patterns and thinner dielectric layers
 Easier manufacturability, more robust design (tolerances), product miniaturization
(thickness), etc.
Electrical characteristics of resin – Why Low Dk/Df for HS boards?


14
Signal transmission loss is sum of conductor loss and dielectric loss.
Dk and Df are both impacting on transmission loss.
Electrical characteristics of resin – Panasonic HS product offering
15
Electrical characteristics of resin - Transmission Loss comparison
PCB construction
Transmission Loss (dB/m)
0
-5
16
35um
-10
-15
[RT]
-20
[RT]
-25
[RT]
-30
R-1566
[RT]
-35
R-1755V
[RT]
-40

Copper type： RT
0
1
2
3
4
Frequency (GHz)
5
6
Lower Dk/Df of materials has direct impact on signal transmission loss.
250um
Key Characteristics – Why copper foil roughness is important?
•
“Skin effect is the tendency of an alternating electric current (AC) to become distributed within a
conductor such that the current density is largest near the surface of the conductor, and
decreases with greater depths in the conductor. The electric current flows mainly at the "skin" of the
conductor, between the outer surface and a level called the skin depth. The skin effect causes the
effective resistance of the conductor to increase at higher frequencies where the skin depth
is smaller, thus reducing the effective cross-section of the conductor.”
Source: Wikipedia (http://en.wikipedia.org/wiki/Skin_effect)
Frequency
Skin effect
depth
10 kHz
660 μm
100 kHz
210 μm
1 MHz
65 μm
10 MHz
21 μm
100 MHz
6.6 μm
1 GHz
2.1 μm
10 GHz
0.7 μm
 Higher the frequency - more significant the impact of skin effect to transmission loss.
17
Higher Resistance
Key Characteristics – Why copper foil roughness is important?
Signal path
Higher Resistance
Signal path
Low frequency signals
High frequency signals
 Copper profile is one of the main contributors for transmission loss for high frequency signals.
18
Key Characteristics – Copper profile classification by IPC
Copper profile classification
based on IPC-4562:
>10.2 μm
Standard (S)
Mat side
Conventional (Low
Profile)
5.2 – 10.2 μm
Low profile (L)
<= 5.1 μm
Rz=6～8μm
H-VLP
Very Low profile (V)
No Treatment or
Roughness (X)
RT (Reverse Treated)
Rz=3～4μm
Rz=1～2μm
 Typically high frequency laminates use either Low profile or Very Low Profile copper profile types.
 Low/No Peel strength limiting X-style copper usage.
19
Key Characteristics – Transmission loss vs. Cu foil type
Cu Thickness：35μm
Cu Type ：H-VLP, RT, Conventional
Inner treatment Type： None
・Core ： 6MIL （0.13t） (#2116x 1ply), Mat side
・Prepreg: #1080 RC64% *2ply
Line length ： 200, 100mm
Impedance ： 50 Ω
H-VLP
Rz=1～2μm
Transmission loss (dB/100mm)
0
RT
-2
H-VLP
Rz=3～4μm
-4
[H-VLP]
RT
Conventional
(Low Profile)
[RT]
-6
Conventional
Rz=6～8μm
-8
0
5
10
Frequency (GHz)
15
20
 Copper profile impact on transmission loss is getting bigger with higher frequencies.
 Usage of conventional copper profile increase transmission loss significantly.
20
Key Characteristics – E glass vs. NE glass Dk & Df (MEG7)
 NE-glass (Low Dk glass) reduces effective Dk of the material by 0.2 – 0.3 vs. E-glass.
 Df of NE-glass version is slightly better than E-glass version.
21
Key Characteristics – E glass vs. NE glass transmission loss (MEG7)
 The difference of transmission loss between E-glass and NE-glass version of MEGTRON7
material is ~4dB/m at 20GHz.
 The impact is almost on the same as the difference between H-VLP and RT copper foil.
22
Key Characteristics – Spreading of glass cloth
Differences in Propagation delay & loss
are minimized with
Spread Glass
Conventional glass cloth
23
Spreaded glass cloth
Key Characteristics – Dk difference between glass and resin
 Glass DK = 6.4 (IPC-4412)
3.1.6.1 Dielectric Constant for Base E-Glass
The DK of base E-glass to be used for printed board applications is 6.4 @ 1 GHZ
(as measured by IPC-TM-650, Method 2.5.5.9)
 Resin/Filler DK = 2.5 - 4.5
RC VS DK@1GHZ
STD FR-4
FILLED FR-4
FILLED LOW LOSS A
FILLED LOW LOSS B
5.5
FILLED LOW LOSS C
FILLED LOW LOSS D
FILLED LOW LOSS E
DK @ 1GHz
5
4.5
4
3.5
3
RC%
24
85
75
65
55
45
35
25
15
2.5
Key Characteristics – Dk difference between glass and resin
25
Key Characteristics – Conventional Glass vs Spread Glass
Delay Time vs Frequency
Delay Tim e vs Frequency(＃1078)
Delay Time vs Frequency(＃１
０
８
０
)
1.28E-09
1.28E-09
1.27E-09
Delay Tim e [sec]
1.27E-09
Delay Time [sec]
1.26E-09
Max
1.25E-09
1.24E-09
Min
1.23E-09
1.26E-09
1.25E-09
Max
1.24E-09
Min
1.23E-09
1.22E-09
1.22E-09
0
1
2
3
4
5
Frequency　[GHｚ
]
26
1078 (spread weave)
1080 (conventional weave)
6
0
1
2
3
4
Frequency　[GHｚ
]
5
6
Electrical characteristic of resin – Panasonic HS product offering
Dk: 3.7 / 3.4(N)
Df: 0.002 / 1GHz,
0.0015 / 1GHz(N)
Dk: 4.1
Df: 0.01 / 1GHz
Dk: 4.4
Df: 0.016 / 1GHz
Dk: 4.6
Df: 0.01 / 1GHz
27
Dk: 3.8
Df: 0.005 / 1GHz
Dk: 3.6 / 3.4(N)
Df: 0.0015/1GHz
0.001 / 1GHz (N)
Summary and Key takeaways
• Higher the frequency requirements for your
application/PCB  more you need to understand
laminates used in it.
• Resin system, glass cloth and copper have all significant
impact on transmission loss in high frequency PCB‘s –
you can lose good performance by specifying wrong
property for other parameter.
• Low loss resin system, smooth copper profile and use of
spreaded glass cloth style with Low Dk/Df properties
help you tackle challenges of high frequencies.
• Panasonic comprehensive circuit board material offering
can meet your varying application requirements with
good quality and high reliability today and in future!
28
29

Circuit Board Laminates as a part of High Frequency PCB

Transcription

Similar documents