Panasonic Felios Flexible PCB

Proposal to
Flexible PCB Materials
June, 2008
Confidential
Matsushita Electric Works, Ltd.
Contents
1. Core Technology and Capability
2. Total Solution for FPC & Rigid Flex
3. Technology and Product Advantage
4. Product Offering Availability
5. What’s New?
Confidential
Matsushita Electric Works, Ltd.
1.Core Technology and Capability
Confidential
Matsushita Electric Works, Ltd.
1-1. Core Technology
Production
Engineering
Material
Technology
Halogen-free
Resin Design
Technology
Extended
Lamination System
(Roll type)
Core
Technology
Batch Press System
(Sheet type)
Evaluation
Technology
Quality Evaluation
Technology
(Ex.Connection with ACF)
Stress Analysis
Simulation
Confidential
Matsushita Electric Works, Ltd.
1-2. FPC Material Marketing Strategy
FPC Users
•Focus Application
•Evaluation Technology
(Ex; Bending test method
cooperative development with
customer and OEM)
Multi Layer
Multi Layer
Hinge
Hinge
Small LCD
Small LCD
Rigid Flex Users
•Total Solution
(All HF Materials -Rigid & FCCL)
PWB customers
making Rigid Flex
•Existing Sales Channel
Overseas
PWB customers
making
Rigid Flex
90% share
Confidential
Japan
Non Japan
Matsushita Electric Works, Ltd.
1-3. 2Layer D/S FCCL Market
No.1
Production Volume by Supplier
200
180
160
140
120
100
80
60
40
20
0
(10K m2/Year)
2L D/S Laminator
in 2008
2005
2006
2007
2008
*Source: Yano Economy Research Report with modification by MEW
Confidential
Matsushita Electric Works, Ltd.
1-4. Production Capacity
500
Yokkaichi
（10K ㎡/year）
360
400
240
300
ELS
(Newly Equiped)
180
1.Roll Style
2.ELS
Koriyama
1.Sheet Style
2.BPS
200
120
ELS
100
BPS
Koriyama
0
Yokkaichi
2007
Confidential
2008
2009
2010
Matsushita Electric Works, Ltd.
1-5. ISO & Environmental Friendly
■ISO
【Koriyama Factory】
】
ISO9001 April 2005
ISO14000 April 2005
TS16949 May 2007
【Yokkaichi Factory】
】 ISO9001 August 2006
ISO14000 February 2007
TS16949 March 2007
■Environmental Friendly
All Halogen Free Type
Confidential
Matsushita Electric Works, Ltd.
2. Total Solution for FPC & Rigid Flex
Confidential
Matsushita Electric Works, Ltd.
2-1. Total Solution for FPC
Proposal for LCD Module with improved ACF connection
Newly developed Copper foil by collaboration with copper supplier
■Test Condition
ACF Peel Strength
1.2
R-F785 with Newly Developed Copper
N/mm
1
Panasonic
Company C
Company D
0.8
1.Test IC and a FPC base material side
are pasted up by ACF
2.After humidity & thermal stress,
measure peel strength.
Pull
0.6
FPC
0.4
ＡＣＦ
Adhesive
Confidential
(Hours)
1000
900
800
700
600
500
400
300
200
100
0
（80℃
80℃95%）
95%）
0
0.2
Test IC
Supporting board
Matsushita Electric Works, Ltd.
2-2. Total Solution for Rigid-Flex
Rigid-Flex Board
Rigid PCB part
Flexible PCB part
Proposal 3
Proposal 1
2Layer FCCL
R-F775
New R-F785
New R-F705
Halogen-free FR-4 CCL
R-1566
Proposal 4
Low Flow Prepreg
R-1551L
Proposal 2
FCCL based Masslam
C-F170,F175
New C- F176,F156,F166
Proposal 5
Materials for Build-Up
ARCC R-0582
Rigid
Rigid
Flexible
Confidential
Matsushita Electric Works, Ltd.
3.Technology and Product Advantage
Confidential
Matsushita Electric Works, Ltd.
3-1-1. 2Layer FCCL
New
New
Confidential
(Face Lamination System)
R-F775,770：
R-F785,780：
R-F705,700：
Polyimide (Upilex)
Polyimide (Pixeo)
LCP (Vecstor)
ELS
BPS
(Extended
(Extended Lamination
Lamination System)
System)
(Batch
(Batch Press
Press System)
System)
Matsushita Electric Works, Ltd.
3-1-2. Panasonic ELS
(Extended Lamination System)
Feature of Panasonic ELS
- Stable Quality
- Uniform lamination by pressing with large area
- ＜Class100 clean environment in ELS processing
- ELS with various kinds of Films and Copper foils
Film
•Upilex
•Pixeo
•Vecstor, etc
ELS
Typical Roll
Lamination System
Copper foil
Very Thin (9μm, 12μm)
•RA type (General, Special)
•ED type (General, Special)
Confidential
Matsushita Electric Works, Ltd.
3-2-1. Excellent Dimensional Stability
14μm PI based FCCL (R-F785F)
・Copper=Special RA １８ μｍ
・Test method ：IPC‐TM‐650
After 150℃ 30min
After Etching
①
⑧
0.2
0.2
0.2
⑦
①
⑧
0.2
0.2
0.2
MD
0
②
0
0.2
0
0.2
-0.2
0
0
②
④
R-F785F
(ELS)
⑤
⑧
0.2
⑦
0.2
0.2
③
0.2
-0.2
0
0.2
0
⑥
②
Company A
⑤
⑧
0.2
0.2
0.2
0.2
③
-0.2
0
0
⑥
②
0.2
R-F785F
⑤
0.2
③
0
0.2
0
0
0.2
0
0.2
0
④
⑦
MD
0
0
0.2
0
0
0.2
0
0.2
0
④
①
MD
0
0
0.2
0
0
0.2
0
0.2
0
0.2
Confidential
⑥
①
MD
0
0.2
0
③
0
⑦
-0.2
0
0.2
0
⑥
0
0.2
④
⑤
Company A
(ELS)
Matsushita Electric Works, Ltd.
3-2-2. Excellent Dimensional Stability
14μm PI based FCCL (R-F785F)
・Copper=Special RA １８ μｍ
%
0.200
After Etching
MD
TD
MD
TD
・Test method ：IPC‐TM‐650
%
0.200
0.150
0.100
0.050
0.150
0.100
0.050
0.000
0.000
-0.050
-0.050
-0.100
-0.100
-0.150
-0.150
-0.200
-0.200
R-F785F
(ELS)
Confidential
Company A
After 150℃ 30min
MD
TD
R-F785F
MD
TD
Company A
(ELS)
Matsushita Electric Works, Ltd.
3-2-3. Excellent Dimensional Stability
25μm PI based FCCL (R-F775)
・Copper=RA １８ μｍ
・Test method ：Panasonic method
After 150℃ 30min
After Etching
⑧
① 0.1
0.1
0.1
⑧
⑦ ① 0.1
0.1
0.1
⑦
0
②
0
0.1
0.1
0
0
③
0.1
-0.1
0
0
0
0.1
④
R-F775
(ELS)
Confidential
0
0
0
⑥②
0.1
0
0
0.1
⑤③
0.1
0
0
0.1
-0.1
0
0
0
0.1
④
Company B
⑥
②
⑤
0
0
-0.1
0
0
0
0.1
⑦
0.1
0
0
0.1
0.1
0.1
③
0.1
0.1
④
R-F775
⑧
① 0.1
0
⑥ ②
⑤
0
0
-0.1
0
0
0
0.1
⑦
0.1
0
0
0.1
0.1
0.1
MD
MD
MD
MD
⑧
① 0.1
③
0.1
0.1
0.1
④
⑥
⑤
Company B
(ELS)
Matsushita Electric Works, Ltd.
3-2-4. Excellent Dimensional Stability
25μm PI based FCCL (R-F775)
・Copper=RA １８ μｍ
0.200
・Test method ：Panasonic method
After Etching
%
MD
TD
MD
%
TD
0.200
0.150
0.100
0.050
0.150
0.100
0.050
0.000
0.000
-0.050
-0.050
-0.100
-0.100
-0.150
-0.150
-0.200
-0.200
R-F775
(ELS)
Confidential
Company B
After 150℃ 30min
MD
TD
R-F775
MD
TD
Company B
(ELS)
Matsushita Electric Works, Ltd.
3-3-1. Bending Flexibility
αBending
Slide Bending
Crank Bending
Open
Closed
Open
Closed
Open
FPC Form
Confidential
Closed
FPC Form
FPC Form
Matsushita Electric Works, Ltd.
3-3-2. Enhanced Flexibility (αBending)
■ Test result
■ Test condition
Number of times (time)
250000
200000
150000
100000
50000
0
Test machine
L/S=100/100um
Coverlay
(PI12.5,Ad25)
R-F775
18-25-18
(General RA)
R-F775
18-20-18
(General RA)
Note) CoverCover-lay (PI12.5,Ad25μ
(PI12.5,Ad25μm) was used for the testing.
・Angle：
： 0 ⇔ 170 °
Double sided
FCCL R-F775
Plan view
170°
170°
Side view
OPEN
Confidential
R-F775F
18-20-18
(Special RA)
CLOSE
・Frequency：
： 60rpm
・α-bending diameter ：8Φ
Φ
Matsushita Electric Works, Ltd.
3-3-3. Finite Element Method (αBending)
Analysis ① Thin copper （18μ
μm ⇒ 12μ
μm）
）
Cu－
－Film－Ｃｕ
－Ｃｕ (μ
μm)
stress
１８－
１８－２５－
２５－１８
57.52 MPa
１２－
１２－２５－
２５－１２
50.45 MPa
Analysis ② Thin Film （25μ
μm ⇒ 20μ
μm）
）
Cu－
－Film－Ｃｕ
－Ｃｕ (μ
μm)
stress
Confidential
１８－
１８－２５－
２５－１８
57.52 MPa
１８－
１８－２０－
２０－１８
51.95 MPa
Matsushita Electric Works, Ltd.
3-3-4. Enhanced Flexibility (Slide Bending)
■ Test result
■Test Method
A circuit is
an outside
-Stroke
-Speed
-Temperature
-Radius of curvature
-Life judging
:50ｍｍ
ｍｍ
:60ｒｒpm
:room temp
:1.0mm
:20%UP
Number of times (time)
400000
300000
200000
100000
0
■Test Sample
0.1mm 0.1mm
Pattern
R-F785F
R-F775
R-F775
R-F785
18-14-18
18-25-18
18-20-18
18-14-18
(General RA) (General RA) (General RA) (Special RA)
Note) CoverCover-lay (PI12.5,Ad15μ
(PI12.5,Ad15μm) was used for the testing.
TD
Confidential
Matsushita Electric Works, Ltd.
3-3-5. Special RA copper pressed by ELS
Special RA, pressed by ELS, is re-crystallized,
and features superior performance for slide hinge.
Special RA
General RA
Crack formation along
grain boundary
4μm
Confidential
4μm
Matsushita Electric Works, Ltd.
3-3-6. Enhanced Flexibility
■ Test condition
(Crank Bending)
■ Test result
Number of times (time)
150000
100000
50000
0
R-F775 R-F775F
18-25-18 18-25-18
Test machine
R-F775 R-F775 R-F775
18-25-18 12-25-12 12-20-12
(General RA) (Special RA)
L/S=100/100um
Coverlay
(PI12.5,Ad25)
Plan view
Confidential
Side view
(Special ED)
Note) CoverCover-lay (PI12.5,Ad25μ
(PI12.5,Ad25μm) was used for the testing.
170°
170°
Double sidde
FCCL R-F775
R-F785
12-14-12
・Angle
:0 <=> 170°
°
・Frequency : 60rpm
・Circuit
:Both side
・Judgment
Resistance 10%UP
Matsushita Electric Works, Ltd.
3-3-7. Special ED copper pressed by ELS
Special ED, pressed by ELS(<300℃）, is re-crystallized,
and has the almost same crystal structure as General RA’s.
General ED
Special ED
General RA
MD
TD
Confidential
Matsushita Electric Works, Ltd.
3-4-1. Excellent Peel Strength
1.7N/mm (ELS) vs 0.9-1.0N/mm (Other system)
(N/mm)
1.7
• Test Method:
1.0
1.0
IPC-TM-650
0.9
Casting
ELS
Typical
(R-F775/R-F785) Roll
Lamination
Confidential
Matsushita Electric Works, Ltd.
3-5. Spring Back Performance
■Loop Test
■Gurley Test
80
25μ
μm
60
20μ
μm
18μ
μm
40
25μ
μm
Stiffness （mg）
）
Stiffness （ %）
）
80
14μ
μm
20
0
60
20μ
μm
18μ
μm
40
20
14μ
μm
0
F785, F780
F775, F770
Loop Dia at no
pressure
F785, F780
F775, F770
CCL
1gf
Confidential
Matsushita Electric Works, Ltd.
4.Product Offering Availability
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Matsushita Electric Works, Ltd.
4-1. Product Offering Availability
Polyimide Thickness
■ Part Number
Double Sided Single Sided
New
14μ 18μ 20μ
R-F775
R-F770
-
-
○
○
○
R-F785
R-F780
○
○
-
-
-
Product Size
Type
Confidential
25μ 50μ
Copper foil
9μm 12μm 18μm 35μm
TD (width)
(1/4oz) (1/3oz) (1/2oz)
(1oz)
Roll
250㎜
㎜
500㎜
㎜, 510㎜
㎜
ED
○
○
○
-
Sheet
Max 510㎜
㎜
RA
○
○
○
○
Matsushita Electric Works, Ltd.
5.What’s New
Confidential
Matsushita Electric Works, Ltd.
5-1. LCP based FCCL
■General Properties
Property
Test Condition
Surface Resistivity
A
Dielectric Constant (Dk)
Dissipation Factor (Df)
A 2GHz
A 10GHz
A 2GHz
A 10GHz
（Liquid Crystal Polymer）
R-F705
R-F775
PI25μ
μm, Cu18μ
μ
4.0E+13
3.2
3.2
0.0015
0.0027
1.0
IPC-TM650
Method2.5.5.5
%
R-F705
LCP50μ
μm, Cu18μ
μ
4.9E+14
3.0
3.0
0.0008
0.0016
0.04
N/m
m
0.8
1.7
IPC-TM-650
-
Unit
Ω
-
-
Moisture Absorption
25℃/50h dipping
Peel Strength
A
260℃ Solder for 5 sec
Frame Resistant （UL）
A and E-168/70
-
94VTM-0
94V-0
Chemical Resistance
HCl 2mol/l 23℃ for 5min
NaOH 2mol/l 23℃ for 5 min
IPA 23℃ for 5 min
-
No abnormality
No abnormality
260℃ solder float for 1 min
-
288℃ solder float for 1 min
-
No abnormality
No abnormality
No abnormality
No abnormality
C-96/40/90
260℃ solder float for 1 min
-
No abnormality
No abormality
%
0.001
-0.005
0.014
0.019
-0.007
0.016
-0.023
0.000
Solder Heat Resistance
Water Absorption
Solder Heat Resistance
After etching (MD direction)
Dimensional Stability
After etching (TD direction)
E-0.5/150 (MD direction)
E-0.5/150 (TD direction)
Note) The above data are our actual values and not assured values.
Confidential
Test Method
JIS C6471
IPC-TM650
Method2.5.5.5
-
JIS C6471
Internal Method
IPC-TM650
Matsushita Electric Works, Ltd.
5-2. Dimensional Stability
（LCP based FCCL)
ELS vs Typical Roll Lamination
・LCP=50μｍ、Copper=ＥＤ １８ μｍ
・Test method ：Panasonic method
After 150℃ 30min
After Etching
①
⑧
0.1
0.1
-0.1 -0.1
0
-0.1
-0.1
②
0.1
0
⑦
0.1
-0.1
0.1
0.1
0
0.1
④
R-F705
(ELS)
Confidential
-0.1
-0.1
0.1
0
⑤
⑧
-0.1 -0.1
0
⑥ ②
-0.1
③
0.1
0.1
0.1
0
-0.1 -0.1
①
-0.1
-0.1 -0.1
①
0.1
0.1
0.1
0
-0.1
-0.1
②
0.1
0.1
0
0
0.1
④
Company D
⑤
⑧
-0.1 -0.1
0
⑥
-0.1
0.1
③
⑦
0.1
-0.1
0.1
0.1
-0.1
-0.1
②
0.1
0.1
0
0
0.1
④
R-F705
⑤
⑧
-0.1 -0.1
0
⑥
-0.1
-0.1 -0.1
①
0.1
0
0.1
③
⑦
0.1
0.1
0
-0.1
⑥
-0.1
-0.1 -0.1
0.1
③
⑦
0.1
0.1
0
0.1
④
⑤
Company D
(ELS)
Matsushita Electric Works, Ltd.
5-3. Peel Strength
（LCP based FCCL)
ELS vs Typical Roll Lamination
・LCP=50μｍ、Copper=ＥＤ １８ μｍ
(N/mm)
・Test method ：IPC-TM-650
1
0.8
0.6
0.4
0.2
0
ELS
(R-F705)
Confidential
Typical
Roll
Lamination
Matsushita Electric Works, Ltd.
5-4. Dk/Df
（LCP based FCCL)
Dk/Df is very stable against the moisture uptake.
Dk (ε
εr)
Df (tanδ
δ)
3.30
0.0040
R-F775 (C-96/40/90)
3.25
R-F775 (C-96/40/90)
0.0035
3.20
0.0030
3.15
R-F775 (as it is )
3.10
3.05
0.0025
R-F775 (as it is )
0.0020
R-F705 (C-96/40/90)
R-F705 (C-96/40/90)
3.00
0.0015
2.95
R-F705 (as it is )
2.90
R-F705 (as it is )
0.0010
2.85
0.0005
2.80
0.0000
2GHｚ
Confidential
4GHｚ
6GHｚ
8GHｚ
10GHｚ
2GHｚ
4GHｚ
6GHｚ
8GHｚ
10GHｚ
Matsushita Electric Works, Ltd.
5-5. Transmission Loss
（LCP based FCCL)
■Transmission Loss
(dB/cm)
■Test Sample
after moisture uptake
0
-0.05
18μ
μm
50μ
μm
-0.1
R-F705
-0.15
w/Special Copper
-0.2
R-F705
-0.25
R-F775
•LCP film: 50μm
•Copper foil: 18μm
•Characteristic Impedance: 50Ω
•Preconditioning: C-96/40/90
-0.3
-0.35
1GHz
Confidential
2GHz
3GHz
4GHz
5GHz
Matsushita Electric Works, Ltd.
Thank you!
Confidential
Matsushita Electric Works, Ltd.