Technical_Systems_Overview_RD540_RD640_ENG

Change Log
2
Version
Change
10/2/2013
Original release
© 2013 LENOVO. ALL RIGHTS RESERVED.
Overview

 Product Features
 Generational Differences
 Mechanicals
-
– Front View
– Mechanicals / HDD Configurations
– Rear View

 System Design
– Motherboard – Layout & Connections
– Expansion Capability
3
© 2013 LENOVO. ALL RIGHTS RESERVED.

CPU Compatibility
Memory Subsystem
Storage Subsystem
Networking
Power Management
Manageability / Serviceability
-
– Under the Covers
– System Block Diagram
Technologies / Key Subsystems
Server Management
Ease of Use & Serviceability
Diagnostic LED’s
Security Features
-
TPM
BIOS / BMC
Post Launch Content
Support
4
RD540
RD640
RDIMMs: DDR3 1866 MHz


TBD – Feb 2014 block
HDDs: 3.5” 300/600GB 15k


TBD – Feb 2014 block
© 2013 LENOVO. ALL RIGHTS RESERVED.
Date
RD540 Technical Features
Processor Support
• E5-2600 v2 Series, up to 130W SKUs
• Intel C602-J chipset
I/O Expansion Slots
• 1 PCIe x16 Gen3 FH/HL (x16 link)
• 1 PCIe x8 Gen3 LP (x8 link) – RAID card uses this slot
Memory
• 20 DIMM sockets
o CPU 1: 12 DIMM (3DPC)
o CPU 2: 8 DIMM (2DPC)
• LV-RDIMMs: DDR3 1600 MHz ECC 4, 8, 16 GB DIMMs
(max 320GB)
• RAS: ECC, Lock step, Mirroring, Sparing
I/O Connectors
• Two 1 Gb/s Ethernet ports
• One 1 Gb/s Ethernet for shared or dedicated remote
management
• USB 2.0 ports – 2 front, 4 rear, 2 internal
• Video (VGA) – 1 front 1, 1 rear
• Serial port – 1 rear
Storage
• 4x 3.5” HS HDD Bays – up to 16TB SATA or 12 TB SAS
storage
• 8x 2.5” HS HDD Bays – up to 8TB SATA or 7.2TB SAS
storage
• Support SATA/SAS/SSD HDD
System Cooling
• 8x system fans,7+1 Redundant 2
Storage Controller
• RAID500 adapter (RAID 0/1/10) w/ Upgrade Key (RAID
5/50)
• RAID700 adapter (RAID 0/1/5/6/10/50/60) w/ optional
Battery
• RAID710 adapter (RAID 0/1/5/6/10/50/60) w/ 1GB cache
and optional CacheVault / CacheCade / FastPath
Manageability/RAS/Service
• Intelligent Diagnostics Module
• TMM Remote Management / Optional TMM Premium
(KVM)
• IPMI 2.0 / SOL / Node Manager / DCMI
• Configurable TPM (supports TCG 1.2)
• uEFI BIOS
Media
• Slim optical drive in 3.5’ HDD configurations
Packaging
• 1U
Dimensions / Weights
• W: 482.4 mm / 19 in (w/ handles)
• H: 43.6mm / 1.72 in
• D: 734 mm / 28.9 in (w/ handles)
• Weight: 12 kg (26.5 lbs) – 17 kg (37.5 lbs)
Power
• 1+1 Redundant Power – 800W (80Plus Gold)
• Energy Star Server 1.1 compliant
OS Support
• Windows Server 2012 (Including Hyper-V)
• Windows Server 2008 (x64) (Including Hyper-V)
• Windows Server 2008 R2 (Including Hyper-V)
• Windows SBS 2011
• SLES 11 sp2
• RedHat 5.9 / 6.4
• VMware ESXi 5.1 U1
• Citrix XenServer 6.0.2 / 6.1
1 - Front VGA N/A for 4x 3.5" HDD config
2 - Fans are not redundant when using E5-2600 130W 4C & 135W or E5-2600 v2 130W 4C/6C
5
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD640 Technical Features
Processor Support
• E5-2600 v2 Series, up to 135W SKUs
• Intel C602-J chipset
Memory
• 20 DIMM sockets
o CPU 1: 12 DIMM (3DPC)
o CPU 2: 8 DIMM (2DPC)
• LV-RDIMMs: DDR3 1600 MHz ECC 4, 8, 16 GB DIMMs
(max 320GB)
• RAS: ECC, Lock step, Mirroring, Sparing
Storage
• 8x 3.5” HS HDD Bays – up to 32TB SATA or 24TB SAS
storage
• 8x or 16x 2.5” HS HDD Bays – up to 16TB SATA or
14.4TB SAS storage
• Support SATA/SAS/SSD HDD
Storage Controller
• RAID500 adapter (RAID 0/1/10) w/ Upgrade Key (RAID
5/50)
• RAID700 adapter (RAID 0/1/5/6/10/50/60) w/ optional
battery
• RAID710 adapter (RAID 0/1/5/6/10/50/60) w/ 1GB cache
and optional CacheVault / CacheCade / FastPath
6
© 2013 LENOVO. ALL RIGHTS RESERVED.
Available I/O Expansion Slots
• With CPU 1 installed:
o 1 x LP x8 mechanical, x8 electrical
o 1 x FH/HL x16 mechanical, x16 electrical (RAID card
uses this slot)
o 2 x FH/HL x8 mechanical, x8 electrical (PCIe Expander
Card for 16 HDD config uses one of these slots)
• With CPU 1 & CPU 2 installed:
o 1 x LP x8 mechanical, x8 electrical
o 1 x FH/HL x16 mechanical, x16 electrical (RAID card
uses this slot)
o 1 x FH/HL x16 mechanical, x8 electrical
o 3 x FH/HL x8 mechanical, x8 electrical
I/O Connectors
• Two 1 Gb/s Ethernet ports
• One 1 Gb/s Ethernet for shared or dedicated remote
management
• USB 2.0 ports – 2 front, 4 rear, 2 internal
• Video (VGA) – 1 front, 1 rear
• Serial port – 1 rear
Manageability/RAS/Service
• Intelligent Diagnostics Module / Configurable Premium
Module
• TMM Remote Management / Optional TMM Premium (KVM)
• IPMI 2.0 / SOL / Node Manager / DCMI
• Configurable TPM (supports TCG 1.2)
• uEFI BIOS
1 – Fans are not redundant when using E5-2600 130W 4C
& 135W or E5-2600 v2 130W 4C/6C
System Cooling
• 6 system fans, 5+1 Hot Swap Redundant1
Media
• Slim optical drive
Packaging
• 2U
Dimensions / Weights
• W: 482.4 mm /19 in (w/ handles)
• H: 87.6 mm / 3.45 in
• D: 734 mm / 28.9 in (w/ handles)Max 26.5kg
• Weight: 16 kg (35.3 lbs) –26.5 kg (58.4 lbs)
Power
• 1+1 Redundant Power – 800W (80Plus Gold)
• Energy Star Server 1.1 compliant
OS Support
• Windows Server 2012 (Including Hyper-V)
• Windows Server 2008 (x64) (Including Hyper-V)
• Windows Server 2008 R2 (Including Hyper-V)
• Windows SBS 2011
• SLES 11 sp2
• RedHat 5.9 / 6.4
• VMware ESXi 5.1 U1
• Citrix XenServer 6.0.2 / 6.1
New Features
Explained…
CPU:
Intel Xeon E5-2600 v2 Series
- Increased performance via Higher frequency and core count: up to 12 cores / 24 threads
- Increased energy efficiency via Lower Idle Power design (was 12W, now 7.5W for LV CPU’s)
Expansion:
PCIe Riser Card with Additional x8 slot gives RD640 5 available PCIe slots after RAID card is installed
HDDs:
3.5” - 4TB SATA 7200 RPM & 3TB SAS 7200 RPM
3.5” – 100GB, 200GB, 400GB eMLC SSD (2.5” SSD in 3.5” carrier)
2.5” - 1TB SATA 7200 RPM & 900GB SAS 10k RPM
RAID solution:
RAID 710 adapter (RAID 0/1/5/6/10/50/60) w/ 1GB cache and options for CacheVault / CacheCade /
FastPath
7
© 2013 LENOVO. ALL RIGHTS RESERVED.
Intel Xeon E5-2600 v2 Improvements
Feature
8
Xeon E5-2600 (Sandy Bridge-EP)
Xeon E5-2600 v2 (Ivy Bridge-EP)
Threads Per Socket
Up to 16 threads
Up to 24 threads
Last-level Cache
Up to 20MB
Up to 30MB
Max Memory Speed
Up to 1600
Up to 1866
Idle Power Targets
15W , 12W for LV CPU's
10.5W , 7.5W for LV CPU's
© 2013 LENOVO. ALL RIGHTS RESERVED.
OS Support
RD540
RD640
Windows Server 2008 Editions (x64) (Including Hyper-V)


Windows Server 2008 Editions R2 with SP1 (Including Hyper-V)


Windows Small Business Server 2011


Windows Server 2012 Editions (Including Hyper-V)


Windows Server 2012 Hyper-V


SUSE Linux Enterprise Server 11 sp2


RedHat Enterprise Linux 5.9


RedHat Enterprise Linux 6.4


VMware ESXi 5.1 U1


Citrix XenServer 6.0.2
 (1)
 (1)


Citrix XenServer 6.1
Notes:
1- No 82574/82579 driver for Citrix XenServer 6.0.2
9
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD530 vs RD540
BMC
RAID and Capabilities
10
RD530
RD540
TMM/TMM Premium
TMM/TMM Premium
RAID 500
RAID 700
RAID 500
RAID 700
RAID 710 w/ 1GB cache and optional CacheVault / CacheCade /
FastPath
•
•
•
•
•
•
•
•
Windows Server 2012 (Including Hyper-V)
Windows Server 2008 (x64) (Including Hyper-V)
Windows Server 2008 R2 (Including Hyper-V)
Windows SBS 2011
SLES 11 sp2
RedHat 5.9 / 6.4
VMware ESXi 5.1 U1
Citrix XenServer 6.0.2 / 6.1
Certified (Supported) OS
•
•
•
•
•
•
CPU
• Xeon E5-2600 (Sandy Bridge)
• Xeon E5-2600 v2 (Ivy Bridge)
PCIe
• 1 PCIe x16 Gen3 FH/HL (x16 link)
• 1 PCIe x8 Gen3 LP (x8 link) – RAID card uses this slot
• 1 PCIe x16 Gen3 FH/HL (x16 link)
• 1 PCIe x8 Gen3 LP (x8 link) – RAID card uses this slot
Memory
• 1600 MHz Memory
• Supports maximum 16 LV-RDIMM’s at 1.35V setting
• 1600 MHz Memory
• Supports 20 LV-RDIMM’s at 1.35V setting
Windows Server 2008 (x64) (Including Hyper-V)
Windows Server 2008 R2 (Including Hyper-V)
Windows SBS 2011
SLES 11.1 / 11.2
RedHat 5.7 / 6.1
VMware ESXi 5.0
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD630 vs RD640
RD630
RD640
BMC
TMM/TMM Premium
TMM/TMM Premium
RAID and Capabilities
RAID 500
RAID 700
Certified (Supported) OS
11
•
•
•
•
•
•
Windows Server 2008 (x64) (Including Hyper-V)
Windows Server 2008 R2 (Including Hyper-V)
Windows SBS 2011
SLES 11.1 / 11.2
RedHat 5.7 / 6.1
VMware ESXi 5.0
RAID 500
RAID 700
RAID 710 w/ 1GB cache and optional CacheVault / CacheCade /
FastPath
•
•
•
•
•
•
•
•
Windows Server 2012 (Including Hyper-V)
Windows Server 2008 (x64) (Including Hyper-V)
Windows Server 2008 R2 (Including Hyper-V)
Windows SBS 2011
SLES 11 sp2
RedHat 5.9 / 6.4
VMware ESXi 5.1 U1
Citrix XenServer 6.0.2 / 6.1
CPU
• Xeon E5-2600 (Sandy Bridge)
• Xeon E5-2600 v2 (Ivy Bridge)
PCIe
• With 2 CPU’s installed:
o 1 PCIe x16 Gen3 FH/HL (x8 link) – RAID card uses this slot
o 1 PCIe x8 Gen3 FH/HL (x8 link) – RAID expander uses this slot
in optional 6x 2.5" config
o 1 PCIe x8 Gen3 LP (x8 link)
o 1 PCIe x16 Gen3 FH/HL (x8 link)
o 1 PCIe x8 Gen3 FH/HL (x8 link)
• With 2 CPU’s installed:
o 1 PCIe x16 Gen3 FH/HL (x8 link) – RAID card uses this slot
o 1 PCIe x8 Gen3 FH/HL (x8 link) – RAID expander uses this slot
in optional 6x 2.5" config
o 1 PCIe x8 Gen3 LP (x8 link)
o 1 PCIe x16 Gen3 FH/HL (x8 link)
o 2 PCIe x8 Gen3 FH/HL (x8 link)
Memory
• 1600 MHz Memory
• Supports maximum 16 LV-RDIMM’s at 1.35V setting
• 1600 MHz Memory
• Supports 20 LV-RDIMM’s at 1.35V setting
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD540 Front View
Flat fronts to simplify visual work
area
Modular design accommodates
multiple rack configurations
Power and
ID button
USB
Ports
VGA
Port
Vent pattern maximizes cooling
and visual synergy
Intelligent
Diagnostic
Module
HDD
bays
HDD capacity
tag
Localized control
panels
Simple snap-in
rail lock
12
© 2013 LENOVO. ALL RIGHTS RESERVED.
Pull-out information
cards
Red stripe accents on touch points
HDD Status
Indicators
Red touch
points
RD640 Front View
Modular design accommodates
multiple rack configurations
Power and ID
button
Simple snap-in
rail lock
13
Flat fronts to simplify visual work
area
USB
Ports
VGA
Port
Localized
control
Intelligent panel
Pull-out
Diagnostic
information cards
Module
Premium
© 2013 LENOVO. ALL RIGHTS RESERVED.
Vent pattern maximizes cooling
and visual synergy
HDD
bays
Red stripe accents on touch points
HDD Status Indicators
HDD capacity tag
Red touch points
RD540 Drive / Mechanical Configurations
4x 3.5” Hot Swap SAS/SATA HDDs + ODD
(Intelligent Diagnostics Module)
8x 2.5” Hot Swap SAS/SATA HDDs
(Intelligent Diagnostics Module)
14
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD640 Drive / Mechanical Configurations
8x 3.5” Hot Swap SAS/SATA HDDs + ODD
(Basic or Premium Intelligent Diagnostics
Module)
8x 2.5” Hot Swap SAS/SATA HDDs + ODD
(Basic or Premium Intelligent Diagnostics
Module)
16x 2.5” Hot Swap SAS/SATA HDDs + ODD
(Basic or Premium Intelligent Diagnostics
Module)
15
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD540 Rear View
Identifier
16
Description
Identifier
Description
1
Hot-swap redundant power supply #2
(some models)
7
Ethernet port 0 – System management port
2
Hot-swap redundant power supply #1
8
Ethernet port 1
3
PCIe card slot 2 (*8 LP) – RAID 500 / 700 use this slot
9
VGA DB-15 connector
4
PCIe card slot 1 (*16 FH/HL)
10
USB ports
5
System ID LED
11
Ethernet port 2
6
Serial Port
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD640 Rear View
Identifier
17
Description
Identifier
Description
1
PCIe card slot 5 (*8 FH/HL)
(available when CPU 2 is installed)
9
VGA DB-15 connector
2
PCIe card slot 6 (*8 FH/HL)
(available when CPU 2 is installed)
10
Ethernet port 1
3
PCIe card slot 4 (*8 LP)
11
Ethernet port 0 – System management port
4
PCIe card slot 1 (*16 FH/H)
(RAID 500 / 700 use this slot)
12
Serial Port
5
PCIe card slot 2 (not available)
13
System ID LED
6
PCIe card slot 3 (*8 FH/HL)
(expander in this slot for 16 drive config)
14
Hot-swap redundant power supply #2
(some models)
7
Ethernet port 2
15
Hot-swap redundant power supply #1
8
USB ports
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD540 Under the Covers (3.5” HDD config)
18
© 2013 LENOVO. ALL RIGHTS RESERVED.
ID
Description
1
Cooling shroud
2
Riser card assembly slot 1 (Riser Card 4)
3
PCIe card
4
Riser card assembly slot 2 (Riser card 3)
5
One or two HS redundant power supplies
6
CPU2 DIMMs
7
Heat Sink(s) with microprocessors under
8
HDD backplane
9
Rack handle (right)
10
HDD bay 3
11
Optical drive
12
HDD bay 2
13
Pull out information card
14
HDD bay 1
15
Diagnostic module
16
HDD bay 0
17
Front panel
18
Rack handle (left)
19
System fans
20
CPU1 DIMMs
21
System board
22
System board battery
23
PCIe card
RD640 Under the Covers (2.5” HDD config)
19
© 2013 LENOVO. ALL RIGHTS RESERVED.
ID
Description
1
Cooling shroud
2
Power supply cooling shroud
3
Riser card assembly slot 2 (Riser card 2)
4
One or two HS redundant power supplies
5
PCIe cards
6
CPU2 DIMMs
7
HDD backplanes
8
Rack handle (right)
9
HDD cage (right)
10
HDD cage (middle)
11
Pull out information card
12
VGA DB-15 connector
13
Slim Optical drive
14
Diagnostic module (varies by model)
15
Rack handle (left)
16
Front panel board
17
System fans
18
CPU1 DIMMs
19
Heat Sink(s) with microprocessors under
20
System board
21
System board battery
22
PCIe cards
23
Riser card assembly slot 1 (Riser card 1)
RD540 / RD640 System Block Diagram
Not Used
Not Used
20
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD540 / RD640 Motherboard Connections
ID
Name
Description
A
Front Panel
Front Panel Connector
B
C
USB1
USB2
Internal 2x5 USB connector 1
Internal 2x5 USB connector 2
D
DIT CONN
Intelligent Diagnostics Module connector
E
F
G
H
I
J
K
L
F_VGA
SATA0
SAS 4-7
IBTN
PCH
SAS 0-3
BAT
SKT3
M
IKVM CONN
N
SKT4
Front Panel VGA connector
SATA connector 0 for ODD
SAS connector 4-7 (NOT USED)
iButton socket
Platform Controller Hub (PCH)
SAS connector 0-3 (NOT USED)
System board battery
Internal USB Type A connector 1
ThinkServer Management Module Premium
Connector
Internal USB Type A connector 2
O
TPM/TCM
TPM/TCM connector
P
BMC
ThinkServer Management Module
Q
Riser Slot1
Riser card assembly 1 slot
R
Riser Slot2
Riser card assembly 2 slot
S
PSU1
Redundant power supply connector 1
T
PSU2
Redundant power supply connector 2
U
BP PWR1
Backplane power connector 1
V
BP PWR2
Backplane power connector 2
DIMM
FAN_8
FAN_7
CPU2
FAN_6
DIMM
FAN_5
DIMM
FAN_4
FAN_3
FAN_2
CPU1
DIMM
FAN_1
Memory slots
System fan 8 connector
System fan 7 connector
Microprocessor 2
System fan 6 connector
Memory slots
System fan 5 connector
Memory slots
System fan 4 connector
System fan 3 connector
System fan 2 connector
Microprocessor 1
Memory slots
System fan 1 connector
W
X
Y
Z
AA
BB
CC
DD
EE
FF
GG
HH
II
JJ
21
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD540 / RD640 Expansion & Connectivity
RD540
Slot #
Riser
Card ID
Type
Supported Card Types
(Mechanical)
Bus width
Gen
Form
Factor
Comments
1
RC4
PCIe
PCIe x16, x8, x4, x2, x1
x16
3
FH/HL
From CPU1; NHP
2
RC3
PCIe
PCIe x8, x4, x2, x1
x8
3
LP
Riser
Card ID
Type
Supported Card Types
(Mechanical)
Bus width
Gen
Form
Factor
Comments
PCIe
PCIe x16, x8, x4, x2, x1
x8
3
FH/HL
From CPU1; NHP; RAID Card uses this slot
PCIe
PCIe x8, x4, x2, x1
X8
3
FH/HL
From CPU1; NHP
3
PCIe
PCIe x8, x4, x2, x1
x8
3
FH/HL
From CPU1; NHP; RAID expander uses this slot in
16x 2.5” HDD configuration
4
PCIe
PCIe x8, x4, x2, x1
x8
3
LP
From CPU1; NHP
PCIe
PCIe x16, x8, x4, x2, x1
x8
3
FH/HL
From CPU2; NHP
PCIe
PCIe x8, x4, x2, x1
x8
3
FH/HL
From CPU2; NHP
From CPU1; NHP; RAID Card uses this slot
RD640
Slot #
1
2
5
6
22
RC1
RC2
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD540 Riser Cards
 Riser Card 3 in System Board Slot 2:
– Slot 2 = 1x LP PCIe x8 slot (Primary RAID
controller occupies this slot)
 Riser Card 4 in System Board Slot 1:
– Slot 1 = 1x HL/FH PCIe x16 slot
23
© 2013 Lenovo. All rights reserved.
RD640 Riser Cards
 Riser Card in System Board slot 1:
– Slot 1 = 1x HL/FH PCIe x16 (Primary RAID controller
occupies this slot)
– Slot 2 = 1x HL/FH PCIe x8 slot
– Slot 3 = 1x HL/FH PCIe x8 slot (HDD expander card
occupies this slot in the 16x 2.5” HDD config)
 Riser Card in System Board slot 2:
– Slot 5 = 1x HL/FH PCIe x16 (covered and unavailable
without CPU2)
– Slot 6 = 1x HL/FH PCIe x8 (covered and unavailable
without CPU2)
– Slot 4 = 1x LP PCIe x8
24
© 2013 LENOVO. ALL RIGHTS RESERVED.
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD540 / RD640 Supported CPUs – Existing (Sandy Bridge)
26
1066
1333
1600
RD530
RD630
Memory DDR3 Speed Support (MHz)
800
8/16










n/a

20
8/16












115
20
8/16












2.9
130
15
6/12












E5-2665
2.4
115
20
8/16












E5-2660
2.2
95
20
8/16












E5-2650
2.0
95
20
8/16












E5-2650L
1.8
70
20
8/16












E5-2643
3.3
130
10
4/8












E5-2640
2.5
95
15
6/12



n/a








E5-2637
3.0
80
5
2/4










n/a
n/a
E5-2630
2.3
95
15
6/12



n/a








E5-2630L
2.0
60
15
6/12



n/a








E5-2620
2.0
95
15
6/12



n/a








E5-2609
2.4
80
10
4/4


n/a
n/a

n/a



n/a


E5-2603
1.8
80
10
4/4


n/a
n/a

n/a



n/a


Core Clock
Speed (GHz)
TDP (W)
E5-2690
2.9
135
20
E5-2680
2.7
130
E5-2670
2.6
E5-2667
SKU
© 2013 LENOVO. ALL RIGHTS RESERVED.
Cache (MB)
Cores /
Threads
LV- DDR3
Turbo
Boost
AESNI
TXT
VT
HT
RD540 / RD640 Supported CPUs – New v2 (Ivy Bridge)
27
RD640
Memory DDR3 Speed Support (MHz)
RD540
Cores /
E5-2697 v2
2.7
130
30
12/24
8.0












E5-2695 v2
2.4
115
30
12/24
8.0












E5-2690 v2
3.0
130
25
10/20
8.0










n/a

E5-2680 v2
2.8
115
25
10/20
8.0












E5-2670 v2
2.5
115
25
10/20
8.0












E5-2667 v2
3.3
130
25
8/16
8.0












E5-2660 v2
2.2
95
25
10/20
8.0












E5-2650 v2
2.6
95
20
8/16
8.0












E5-2650L v2
1.7
70
25
10/20
7.2




n/a







E5-2643 v2
3.5
130
25
6/12
8.0










n/a

E5-2640 v2
2.0
95
20
8/16
7.2



n/a
n/a







E5-2637 v2
3.4
130
15
4/8
8.0










n/a

E5-2630 v2
2.6
80
15
6/12
7.2




n/a







E5-2630L v2
2.4
60
15
6/12
7.2




n/a







E5-2620 v2
2.1
80
15
6/12
7.2




n/a







E5-2609 v2
2.5
80
10
4/4
6.4



n/a
n/a
n/a



n/a


E5-2603 v2
1.8
80
10
4/4
6.4



n/a
n/a
n/a



n/a


SKU
Core Clock
TDP (W) Cache (MB)
Speed (GHz)
© 2013 LENOVO. ALL RIGHTS RESERVED.
Threads
QPI
Speed
800
1066
1333
1600
1866
Turbo Boost
AESNI
TXT
VT
HT
© 2013 LENOVO. ALL RIGHTS RESERVED.
E5-2600 v 2 Series Memory Architecture Summary
Intel POR
RD540 / RD640 Implementation
Supports DDR3 & DDR3L memory
• UDIMM
• RDIMM
• LV- RDIMM
• LR-DIMM (Load Reduced)
Supports DDR3 & DDR3L memory
Architecture
24 DIMMs
• 4 channels per CPU / 3 DIMMs per channel
maximum
20 DIMMs
• CPU1: 4 CH / 3 DIMMs Per Channel maximum
• CPU2: 4 CH / 2 DIMMs Per Channel maximum
Memory Capacity
• UDIMM: 128 GB (16x 8GB)
• RDIMM: 768GB (24x 32GB)
• LV-RDIMM: 512 GB (16x 32GB)
• For E5-2600 SNB Series CPU with LV-RDIMM running at default
1.5V: 320GB (20x 16GB)
• For E5-2600 v2 IVB Series CPU - LV-RDIMM: 320GB (20x 16GB)
1.5V memory:
• 1DPC up to 1866, 2DPC up to 1600, 3DPC at 1066
Operating at 1.5V:
• 1DPC up to 1866, 2DPC up to 1600, 3DPC up to 1066
1.35V (LV memory):
• 1DPC up to 1600, 2DPC up to 1333, 3DPC at 800
Operating at 1.35V:
• 1DPC up to 1600, 2DPC up to 1333, 3DPC at 800
• ECC, Patrol Scrubbing, Demand Scrubbing,
Sparing, Mirroring, Lockstep Mode, x4/x8 SDDC
• Same
Memory Types
Memory speed
Memory RAS
• LV – RDIMMs (provides RDIMM and LV-RDIMM capability)
1,2
Notes:
1. If only LV-RDIMM are installed, BIOS will provide a setup option to control memory voltage. Default value is 1.5V and can be changed manually to 1.35V (LV).
2. If changed to 1.35V then:
- For SNB-CPU, only support 8 DIMMs w/CPU1 and 8 DIMMs w/CPU2. If more than more than 8 DIMMs/CPU, voltage will be changed to 1.5V automatically (to support all installed DIMM’s)
- For IVB-CPU, support 12 DIMMs w/CPU1 and 8 DIMMs w/CPU2
29
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD540 / RD640 Memory Support
C0
C0
 DDR3L memory
– LV-RDIMM (provides RDIMM and LV-RDIMM
capability)
C1
C1
CPU 1
C2
QPI
x2
CPU2
C2
 20 DIMMs –
C3
C3
– CPU1: 4 CH / 3 DPC
– CPU2: 4 CH / 2 DPC
 Max Memory
Implemented Memory Architecture
– LV-RDIMM: 320GB (20x 16GB) 1
 Memory speed
– 1.5V operating voltage: 1DPC up to 1866, 2DPC
up to 1600, 3DPC up to 1066
– 1.35V operating voltage: 1DPC up to 1600, 2DPC
up to 1333, 3DPC at 800
 Memory RAS
– ECC, Patrol Scrubbing, Demand Scrubbing,
Sparring, Mirroring, Lockstep Mode, x4/x8
SDDC
Notes:
1. For SNB-CPU, only support 8 DIMMs w/CPU1 and 8 DIMMs w/CPU2, for max of 256GB when running at 1.35V. For
IVB-CPU, support 12 DIMMs w/CPU1 and 8 DIMMs w/CPU2 for 320GB when running at 1.35V.
30
© 2013 LENOVO. ALL RIGHTS RESERVED.
Memory Population Rules
Independent Mode
 DIMM capacities, voltage, frequency and rank may
be mixed
 Mixing memory type (RDIMM, LVDIMM) is not
supported
 Populate DIMM farthest from CPU of any given
channel first
RAS Mode (Mirroring, Sparing,
Lockstep)
 DIMM capacities, voltage, frequency, rank and
type must be identical
 Populate DIMM farthest from CPU of any given
channel first
31
© 2013 LENOVO. ALL RIGHTS RESERVED.
Memory Physical Layout
RD540 / RD640 Memory Support
DIMM Type
Memory
Operating
Voltage
(BIOS
Setting)
Integrated Memory Controller (IMC) Frequency of Installed
Processors
DIMMs
Populated
per
Channel
1866MHz
Remarks
1600MHz
1333 MHz
1066 MHz
LV-RDIMM
1.5V
1
Y
Y
Y
Y
1 DPC (SR/DR) runs at fastest common frequency of DIMMs and CPU
IMC
LV-RDIMM
1.5V
2
Y
Y
Y
N
2 DPC (SR/DR) runs at a maximum frequency of 1600MHz regardless of
DIMM or CPU IMC frequency
LV-RDIMM
1.5V
3
Y
N
N
N
3 DPC (SR/DR) runs at a maximum frequency of 1066MHz regardless of
DIMM or CPU IMC frequency
LV-RDIMM
1.35V
1
Y
Y
Y
N
1 DPC (SR/DR) runs at a maximum frequency of 1600MHz regardless of
DIMM or CPU IMC frequency
LV-RDIMM
1.35V
2
Y
Y
N
N
2 DPC (SR/DR) runs at a maximum frequency of 1333MHz regardless of
DIMM or CPU IMC frequency
LV-RDIMM
1.35V
3
N
N
N
N
3 DPC (SR/DR) runs at a maximum frequency of 800MHz regardless of
DIMM or CPU IMC frequency
1066 MHz
1333 MHz
1600 MHz
1866 MHz
Memory DIMM Frequency Supported
Based on version 2.2 of system AVL’s
32
Memory Population Rules (Independent mode)
X
X
X
X
X
X
8
X
X
X
X
X
X
12
X
X
X
X
X
X
2
X
4
X
X
6
X
X
X
8
X
X
X
12
X
X
X
X
X
16
X
X
X
X
X
X
20
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Independent Mode Install Order
CPU 1:
A1 - B1 - C1 - D1 A2 - B2 - C2 - D2 A3 - B3 - C3 - D3
CPU 1 & CPU 2: (1)A1 - (2)A1 - (1)B1 - (2)B1 - (1)C1 - (2)C1 - (1)D1 - (2)D1 (1)A2 - (2)A2 - (1)B2 - (2)B2 - (1)C2 - (2)C2 - (1)D2 - (2)D2 (1)A3 - (1)B3 - (1)C3 - (1)D3
33
DIMMD2
6
DIMMD1
X
DIMMC2
X
DIMMC1
X
DIMMB2
X
DIMMB1
4
DIMMA2
X
DIMMA1
X
DIMMD3
X
DIMMD2
DIMMD1
3
DIMMC3
X
DIMMC2
X
DIMMC1
2
DIMMB3
X
DIMMB2
1
DIMMB1
DIMMA3
DIMMA1
2 CPU’s
Populated
CPU 2
Number
of
DIMMs
1 CPU
Populated
DIMMA2
CPU 1
© 2013 LENOVO. ALL RIGHTS RESERVED.
Population Rules for Memory RAS Modes
Mirroring Mode:
CPU 1
A1B1 - C1D1 A2B2 - C2D2 A3B3 - C3D3
CPU 1 & CPU 2
(1)A1B1 - (2)A1B1 - (1)C1D1 - (2)C1D1 (1)A2B2 - (2)A2B2 - (1)C2D2 - (2)C2D2 (1)A3B3 - (1)C3D3
Sparing Mode:
CPU 1
A1A2 - B1B2 - C1C2 - D1D2 A1A2A3 - B1B2B3 - C1C2C3 - D1D2D3
CPU 1 & CPU 2
(1)A1A2 - (2)A1A2 - (1)B1B2 - (2)B1B2 - (1)C1C2 - (2)C1C2 - (1)D1D2 - (2)D1D2 (1)A1A2A3 - (1)B1B2B3 - (1)C1C2C3 - (1)D1D2D3
LockStep Mode:
34
CPU 1
A1B1 - C1D1 A2B2 - C2D2 A3B3 - C3D3
CPU 1 & CPU 2
(1)A1B1 - (2)A1B1 - (1)C1D1 - (2)C1D1 (1)A2B2 - (2)A2B2 - (1)C2D2 - (2)C2D2 (1)A3B3 - (1)C3D3
© 2013 LENOVO. ALL RIGHTS RESERVED.
Memory Performance Considerations
 General Guidelines
– Best memory performance can be obtained by using a balanced memory configuration, which requires DIMMs to be identical in size, organization, and speed in
each socket
 Maximum Performance Considerations
– Populate both processors with equal amounts of memory to ensure a balanced system
– Populate all memory channels on each processor with equal memory capacity
– Ensure an even number of ranks are populated per channel
– Have at least 2 ranks available on each channel
– Use Dual-rank DIMM’s whenever appropriate
 Examples
– For optimal 1866MHz performance, populate 8 dual rank DIMMs (4 per CPU)
– For optimal 1600MHz performance, populate 16 dual rank DIMMs (8 per CPU)
– For optimal 1333MHz performance, populate 16 dual rank DIMM’s (8 per CPU)
 Power Consumption Considerations
– Use fewer larger DIMM’s. For example 8x 8GB DIMM’s will generally have lower power requirements than 16x 4GB DIMM’s
– x8 DIMM’s will generally draw less power than equivalently sized x4 DIMM’s
35
© 2013 LENOVO. ALL RIGHTS RESERVED.
Storage Subsystem
 The PCH C602-J includes integrated Serial ATA (SATA)
controller
PCH
C602-J
(Patsburg – J)
Port 0
SATA III
1x SATA III (6 Gbps)
Optical Drive
– Supports one 6 Gb/s SATA connection for Optical Drive
 ThinkServer RAID 500 adapter
– RAID 0, 1, 10
– RAID 0, 1, 10, 5, 50 with optional upgrade key
RAID 500 Upgrade Key
RAID 500 Adapter
 ThinkServer RAID 700 adapter and optional battery
– RAID 0, 1, 10, 5, 50, 6, 60
RAID 700 Battery
 ThinkServer RAID 710 adapter and optional CacheVault
RAID 700 Adapter
– RAID 0, 1, 10, 5, 50, 6, 60
– Also options for CacheCade and FastPath (see separate
RAID deck)
RAID 710 CacheVault
RAID 710 Adapter
36
© 2013 LENOVO. ALL RIGHTS RESERVED.
Storage Subsystem – Drive Support
 Enterprise class SATA / SAS / SSD
– SATA
– 3.5” 7,200RPM 6Gbps SATA: 500GB, 1TB, 2TB, 3TB, 4TB
– 2.5” 7,200RPM 6Gbps SATA: 500GB, 1TB
– SAS
– 3.5” 7,200RPM 6Gbps SAS: 1TB, 2TB, 3TB
– 2.5” 10,000RPM 6Gbps SAS: 300GB, 450GB, 600GB, 900GB
– 2.5” 15,000PM 6Gbps SAS: 300GB
– SSD
– 3.5” eMLC SSD 3Gbps: 100GB, 200GB, 400GB (2.5” SSD in 3.5” carrier)
– 2.5” eMLC SSD 3Gbps: 100GB, 200GB, 400GB
 HDD mix population rules
– Support mixed HDD Capacity in system, but not in the same RAID array (delta capacity will go unused)
– Support mixed SAS/SATA/SSD in system, but not in the same RAID Array
– Do not supported mixed 2.5” and 3.5” HDDs
37
© 2013 LENOVO. ALL RIGHTS RESERVED.
Embedded Ethernet
 Three embedded GbE ports ideal for virtualization and I/O intensive workloads
 I350 (Powerville) Dual GbE Controller
– Best 1GbE Server LOM for Virtualization, iSCSI, Manageability, & Low Power
– Virtualization Support
– Virtual Machine Device Queues (VMDq)
– VM Direct Connect (VMDc) – PCI-SIG SR-IOV with VM migration capability
– NAS and iSCSI support
– Storage over Ethernet support
– Intelligent offloads optimized to accelerate OS S/W initiators
– Energy savings features with Energy Efficient Ethernet (EEE), and DMA Coordination features
 82574L (Hartwell) GbE Controller
– Shared with TMM management port
– Performance features
– Jumbo frames
– I/O acceleration technologies (Receive Side Scaling, MSI-X)
38
© 2013 LENOVO. ALL RIGHTS RESERVED.
82574L (Hartwell) GbE Network Controller
 Fully-integrated Gigabit Ethernet MAC and PHY port
 Interfaces to Patsburg PCH chipset
– PCIe Rev. 1.1 (2.5GT/s) x1
PCI-E x1
SmBus
NC-SI
 Low Power
– ~710 mW GbE fully active
– ~300 mW 10/100 fully active
PCI-Express
Mgmt
 Standards Support
– MDI (Copper) support for standard IEEE 802.3 Ethernet interface for
1000BASE-T, 100BASE-TX, and 10BASE-T applications (802.3,
802.3u, and 802.3ab)
Packet Buffer
LAN Config
SPI Flash/
EEPROM
– IEEE 1149.1 JTAG
 Advanced features
– Receive Side Scaling (RSS)
Ethernet MAC
Ethernet PHY
– MSI-X and Low Latency Interrupt (LLI)
– Supports PXE, iSCSI boot
– 2Tx/Rx queues for improved performance in multi-core systems
1000 Base-T Network Interface
– IEEE 1588 / 802.1as Time Synchronization
 Virtualization Support
– VMware, XEN, Hyper-V
39
© 2013 LENOVO. ALL RIGHTS RESERVED.
39
i350 (Powerville) Dual GbE Controller

Two fully-integrated Gigabit Ethernet MAC and PHY ports
–
Interfaces to Patsburg PCH chipset
–


Energy Efficiency
–
EEE – Energy Efficient Ethernet
–
DMA Coordination for up to 8W lower platform power
–
MDI (Copper) support for standard IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASE-TX, and 10BASE-T
applications (802.3, 802.3u, and 802.3ab)
–
MSI-X and Direct Cache Access (DCA)
–
Receive Side Scaling (RSS) and Low Latency Interrupt (LLI)
IEEE 1588 / 802.1as time stamping
40
Supports PXE, iSCSI boot
Virtualization Support
–

SMBus
PCIe
Intel® I/O Acceleration Technology
–

NC-SI
Mgmt
Advanced Features
–

PCIe v2.0 (5GT/s)
(x4/x2/x1)
Standards Support
–

PCIe v2.1 Gen2 (5.0GT/s) x4
Queue Management & DMA
…
Q0
Qn
…
Q0
Qn
TX
RX
TX
RX
FIFO
FIFO
FIFO
FIFO
Virtual Machine Device Queues (VMDq)
–
Max queues: 8 Rx/Tx queues/port
–
Sorting based on: MAC address, 802.1q tag
–
VM Direct Connect with PCI-SIG SR I/O Virtualization
–
VMware, XEN, Hyper-V
Virtual Ethernet Bridge
GbE MAC
GbE MAC
SerDes
PHY
SerDes
PHY
SerDes/
1000
SerDes/
1000
SGMII
Base T
SGMII
Base T
I/O enhancements:
–
8 Rx/Tx queues/port
–
IEEE 1588/802.1as (pre-standard) time stamping
Unified networking
–
Storage over Ethernet support
–
iSCSI acceleration - Intelligent offloads optimized to accelerate OS SW initiators
© 2013 LENOVO. ALL RIGHTS RESERVED.
Lenovo design features reduce power consumption
 High efficiency power supplies
– 80 Plus Gold (90% efficiency)
 Energy Star Compliance (Computer Server Ver 1.1) – all models
 Low-voltage components for power savings (available CPU, Memory, SSD)
 Low power laptop style optical drive
 Dual internal USB ports enable diskless hypervisor support
 Unused devices moved to a minimum power consumption state
41
© 2013 Lenovo. All rights reserved.
Latest Intel technologies help cut and manage power consumption
 Intel “Intelligent Power Technology” minimizes power consumption when server components are not
fully utilized
– Processor and memory automatically put into lowest available power state that meets current workload
requirements
– Results in power consumption based on real-time load
– Integrated power gates allow individual idle cores to be reduced to near-zero power independent of other
operating cores
– Idle power consumption cut to 10 watts, versus 16 or 50 watts in prior-generations of Intel quad-core processors
– Reduces server idle power consumption up to 50% vs. previous generation two-socket server processors
 Turbo Boost Technology provides performance on demand
– Processors can operate above the rated frequency to meet specific workload demands
– Lowers frequency to reduce power consumption during low utilization periods
 New design for lower Idle Power, reduced to 7.5W for LV CPU’s
42
© 2013 LENOVO. ALL RIGHTS RESERVED.
Intel Node Manager monitors and regulates server power consumption
 Integrated technology accessible through industry
standard IPMI interface
 Dynamic power monitoring
– Measures / reports actual system level, CPU and memory
power consumption (+/-5%)
– Provides real-time data
 Power threshold alerting
– If targeted power budget (policy) cannot be maintained,
sends alerts to the management console
43
© 2013 LENOVO. ALL RIGHTS RESERVED.
PCH
SMBus
BMC
Manageability
Engine
SPI Flash
PMBus
– Enforces power caps – dynamically adjusts processor
performance, memory power, or dynamically allocating
processor cores
DIMMs
PECI
 Platform power capping
– Receives policies setting platform power budget while
maintaining maximum performance for the given power level
SMBus
Processors
Power
Supply
(PMBus 1.2)
Board & System
Sensors
To Network &
Mgmt Console
Server Management
 See “Embedded Server Management with TMM.pptx”
44
© 2013 LENOVO. ALL RIGHTS RESERVED.
Ease of Use and Serviceability
 Quicker Serviceability
– Tool-less replaceable parts
– Power supply redundancy
– Covers
– Hot swap HDD’s
– Power supplies
– RD540 7+1 redundant system fans
– System fans
– RD640 - Hot swap 5+1 redundant system fans
– HDD and Optical drives
– Fans
– Riser cards / PCIe adapters
– Diagnostics Panel
– Snap-in rails – Fully extends to on-line service position
– Parts commonality
– Common HDD carriers across the portfolio
– Common Mechanical Building Blocks including rails
– Common options across the portfolio (RAID, memory, Power
supplies, Ethernet adapters, TMM Premium module, etc.)
– Internal CRU replaceable components easily identifiable by
blue color
– 1U System Fans, PSU dummy, air duct buckle, ODD bracket
45
 Reliability Features
© 2013 LENOVO. ALL RIGHTS RESERVED.
– Dual embedded USB ports for failover hypervisor support
 Easier Fault Isolation
– Front Panel Intelligent Diagnostics LED’s
Diagnostic Panel
Intelligent Diagnostics Panel
Intelligent Diagnostics Premium Panel
Digit indicates failed
component. MEM1 & MEM2
specify actual DIMMs
available.
Definition
Sys Fans
© 2013 LENOVO. ALL RIGHTS RESERVED.
Fan Tachometer reading < 500 rpm
CPU1 DIMMS
Memory ECC fault occurred or over temperature
CPU2 DIMMS
Memory ECC fault occurred or over temperature
OVER TEMP
46
Error Condition
System over-temperature
CPU
System has experienced a catastrophic error
PSU
Redundant PSU is uninstalled or has failed:
• PSU over temperature
• No AC input
• PSU failure detected
• Output out of range
Security Features
 Integrated Trusted Program Module (TPM)
– Optional HW-based system security feature
supporting TCG 1.2
– Securely stores passwords, certificates and
encryption keys, which can be used to authenticate
the platform
– Also can be used to store platform measurements
that help ensure that the platform remains
trustworthy.
– Server usage models
– Disk encryption – Windows BitLocker Drive Encryption is
a data protection feature available in Windows Server.
BitLocker leverages the TPM to protect user data and to
ensure that a server running Windows Server has not
been tampered with while the system was offline.
 Password Security
– BIOS
– Administrator / User Password
– BMC
– User access control
47
© 2013 LENOVO. ALL RIGHTS RESERVED.
TPM Block Diagram
© 2013 LENOVO. ALL RIGHTS RESERVED.
SNB Turbo Boost Frequency Bin upside by SKU†
SKU
Base
Frequency (GHz)
Cores
E5-2690
2.9
E5-2680
1 Core Active
2 Cores Active
3 Cores Active
4 Cores Active
5 Cores Active
6 Cores Active
7 Cores Active
8 Cores Active
8
3.8 (+9)
3.6 (+7)
3.6 (+7)
3.4 (+5)
3.4 (+5)
3.3 (+4)
3.3 (+4)
3.3 (+4)
2.7
8
3.5 (+8)
3.5 (+8)
3.4 (+7)
3.2 (+5)
3.2 (+5)
3.2 (+5)
3.1 (+4)
3.1 (+4)
E5-2670
2.6
8
3.3 (+7)
3.3 (+7)
3.2 (+6)
3.2 (+6)
3.1 (+5)
3.1 (+5)
3.0 (+4)
3.0 (+4)
E5-2667
2.9
6
3.5 (+6)
3.4 (+5)
3.3 (+4)
3.2 (+3)
3.2 (+3)
3.2 (+3)
n/a
n/a
E5-2665
2.4
8
3.1 (+7)
3.1 (+7)
3.0 (+6)
3.0 (+6)
2.9 (+5)
2.9 (+5)
2.8 (+4)
2.8 (+4)
E5-2660
2.2
8
3.0 (+8)
3.0 (+8)
2.9 (+7)
2.9 (+7)
2.8 (+6`)
2.8 (+6)
2.7 (+5)
2.7 (+5)
E5-2650
2.0
8
2.8 (+8)
2.8 (+8)
2.7 (+7)
2.5 (+5)
2.5 (+5)
2.5 (+5)
2.4 (+4)
2.4 (+4)
E5-2650L
1.8
8
2.3 (+5)
2.3 (+5)
2.2 (+4)
2.2 (+4)
2.1 (+3)
2.1 (+3)
2.0 (+2)
2.0 (+2)
E5-2643
3.3
4
3.5 (+2)
3.5 (+2)
3.4 (+1)
3.4 (+1)
n/a
n/a
n/a
n/a
E5-2640
2.5
6
3.0 (+5)
3.0 (+5)
2.9 (+4)
2.9 (+4)
2.8 (+3)
2.8 (+3)
n/a
n/a
E5-2637
3.0
2
3.2 (+2)
3.2 (+2)
n/a
n/a
n/a
n/a
n/a
n/a
E5-2630
2.3
6
2.8 (+5)
2.8 (+5)
2.7 (+4)
2.7 (+4)
2.6 (+3)
2.6 (+3)
n/a
n/a
E5-2630L
2.0
6
2.5 (+5)
2.5 (+5)
2.4 (+4)
2.4 (+4)
2.3 (+3)
2.3 (+3)
n/a
n/a
E5-2620
2.0
6
2.5 (+5)
2.5 (+5)
2.4 (+4)
2.4 (+4)
2.3 (+3)
2.3 (+3)
n/a
n/a
E5-2609
2.4
4
Turbo Boost not supported
E5-2603
1.8
4
Turbo Boost not supported
† Max
Turbo Boost Frequency based on number of 100 MHz increments above marked frequency (+1 = + 100
MHz, etc.)
49
© 2013 LENOVO. ALL RIGHTS RESERVED.
IVB Turbo Boost Frequency Bin upside by SKU†
†Max Turbo Boost Frequency based on number of 100 MHz increments above marked frequency (+1 = + 100 MHz, etc.)
50
© 2013 LENOVO. ALL RIGHTS RESERVED.
50
RD540 Hero Photography
8 x 2.5” HDD
(no optical)
51
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD540 Hero Photography
4 x 3.5” HDD
52
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD640 Hero Photography
16x 2.5” HDD
53
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD640 Hero Photography
8 x 3.5” HDD
54
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD540 Inside
55
© 2013 LENOVO. ALL RIGHTS RESERVED.
RD640 Inside
56
© 2013 LENOVO. ALL RIGHTS RESERVED.
Panels
57
© 2013 LENOVO. ALL RIGHTS RESERVED.