North American Company Profiles - Smithsonian

Transcription

8x8
North American Company Profiles
8X8
8x8, Inc.
(formerly Integrated Information Technology)
2445 Mission College Boulevard
Santa Clara, California 95054
Telephone: (408) 727-1885
Fax: (408) 980-0432
Fabless IC Supplier
Financial History ($M)
Sales
Employees
1991
28
1992
45
1993
36
1994
41
1995
50
100
114
100
105
110
Company Overview and Strategy
8x8, Inc. was founded originally as Integrated Information Technology, Inc. (IIT) in 1987 to supply math
coprocessors for 286 and later 386 microprocessor chips. Since then, the privately-held company has
moved its focus from coprocessors to high-performance multimedia processors, which were the basis for the
name change to 8x8, Inc. in early 1996. The 8x8 name reflects the company’s focus on programmable
integrated circuits for video conferencing and MPEG applications in a wide range of consumer and PC
multimedia products. An 8x8 block of picture elements (pixels) is the basis of many video compression
algorithms.
Management
Joseph L. Parkinson
Sandra Abbott
David Harper
Chris McNiffe
Bryan Martin
Samuel Wang
Doug Bailey
Kevin Deierling
President and Chief Executive Officer
Vice President, Finance and Chief Financial Officer
Vice President, European Operations
Vice President, Sales and Marketing
Vice President, Engineering and Chief Technical Officer
Vice President, Process Technology
Director, Worldwide Sales
Director, Marketing
INTEGRATED CIRCUIT ENGINEERING CORPORATION
1-1
8x8
Products and Processes
8x8 Inc. develops highly integrated programmable single-chip compression and decompression ICs and
software for video phone, video conferencing, and MPEG/digital video such as VideoCD, karaoke, and DVD
equipment.
The company’s family of processors include the following:
•
•
•
•
Video Communications Processor (VCP) is a single-chip programmable video subsystem and multimedia
communications processor for conferencing over ISDN telephone lines.
Low-bit-rate Videophone Processor (LVP) is a single-chip programmable video-phone processor for
conferencing over ordinary telephone lines.
Multimedia Playback Processor (MPPex) is a single-chip programmable MPEG 1 video/audio decoder for
a wide range of digital video playback applications.
Multimedia Encode Processor (MEP) for powering a PCI video capture and compression board using
Intel’s wavelet-based Indeo interactive video compression technology.
These processors are based on the company’s Multimedia Processor Architecture (MPA), which combines
advanced DSP and RISC technologies onto a single processor chip.
Key Agreements
• 8x8 has strategic development alliances with National Semiconductor and Siemens Semiconductor.
1-2
ACC Micro
ACC MICRO
ACC Microelectronics Corporation
2500 Augustine Drive
Telephone: (408) 980-0622
Fax: (408) 980-0626
Fabless IC Supplier
ACC Microelectronics Corporation (ACC Micro™) was established in 1987 to design, develop, and market a
variety of VLSI circuit devices for computer system control, computer system board integration, and
communication applications. The company's flagship products are a line of single chip solutions targeted at
the desktop, notebook, and subnotebook computer industries.
Management
Wei-Tau Chiang, Ph.D.
Mark Shieu
Vice President, Engineering
ACC Micro supplies chipsets and controller chips for 386/486-based and Pentium-based computers. Other
products include buffer chips, power management chips, and single-device floppy-disk controllers.
Semiconductor Fabrication Facilities
ACC Micro has second-source licensing agreements with Motorola to support delivery schedules.
1-3
Actel
ACTEL
Actel Corporation
955 East Arques Avenue
Sunnyvale, California 94086-4533
Telephone: (408) 739-1010
Fax: (408) 739-1540
Web Site: www.actel.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1991
35
1
8
1992
41
(0.3)
9
1993
56
5
11
1994
76
8
14
1995
109
(1)
19
150
168
211
245
320
Founded in 1985, Actel Corporation designs, develops, and markets field programmable gate arrays
(FGPAs) and associated software development systems and programming hardware. Its products are used
by designers of computer, telecommunications, military, industrial, and other electronic systems. Actel is a
leader in the development of FPGAs based on antifuse technology. The company's objective is to become
the leading supplier of FPGAs by fully exploiting the capabilities of its proprietary antifuse and circuit
architectures.
In April 1995, Actel completed the acquisition of Texas Instruments' antifuse FPGA business. As part of the
transaction, Actel signed a three-year manufacturing agreement with TI. TI had been a licensed second
source of Actel's FPGAs since 1988.
Development Systems
5%
Military/Aerospace
12%
Computers/
Peripherals
21%
FPGAs
95%
1995 Sales by Product Type
1-4
Industrial
23%
Communications/
Networking
44%
1995 Sales by End-Use Market
Actel
Asia-Pacific
9%
Japan
12%
Europe
17%
United States
62%
1995 Sales by Geographic Region
Management
John C. East
Esmat Z. Hamdy
Jeffrey M. Schlageter
David M. Sugishita
Michelle A. Begun
Doug Goodyear
Dennis F. Nye
David L. Van De Hey
Warren Miller
Robert Nalesnik
David Stieg
Senior Vice President, Technology
Senior Vice President, Engineering
Senior Vice President, Finance, and Chief Financial Officer
Vice President, Human Resources
Vice President, Sales
Vice President, Marketing
Vice President and General Counsel
Director, Silicon Planning and Strategic Applications
Director, Product Marketing
Director, North American Distribution Sales
Actel's IC product line currently consists of three series of FPGAs.
Value Series
•
The ACT1 family consists of two devices, a 1,200-gate part and a 2,000-gate part, and offers system
performance of up to 25MHz. This family of circuits utilizes 1.0µm CMOS technology.
Accelerator Series
•
The ACT3 family consists of devices ranging from 1,500 to 10,000 gates and offers system
performance of up to 75MHz.
•
The ACT3 PCI family consists of fully PCI-compliant devices with 4,000 to 10,000 usable gates and
performance up to 250MHz.
Both families are based on a 0.8µm CMOS process that was initially developed by Hewlett-Packard.
1-5
Actel
Integrator Series
•
The 1200XL family features parts ranging from 2,500 to 8,000 gates and offers system performance
of up to 60MHz. This family of circuits is based on 0.65µm CMOS technology.
•
The 3200DX family is Actel’s newest series of FPGAs with capacities ranging from 6,500 gates to
40,000 gates and offers system performance up to 100MHz. These high-performance FPGAs offer
fast dual-port SRAM, fast decode, and data path circuitry based on 0.65µm double-level-metal
CMOS technology.
Actel plans to offer in 1996 radiation-hardened FPGAs for application in communications satellites. Also in
1996, Actel plans to migrate its technology to a 0.5µm triple-level-metal process.
To support its FPGA products, Actel offers design automation software, programming and test hardware,
and a diagnostic option that provides special in-circuit debug and diagnostic capabilities.
Actel's FPGAs are manufactured by Matsushita, Chartered Semiconductor (Actel holds a minor equity
interest in Chartered), Winbond, and Texas Instruments. Loral Federal Systems Company will be the sole
source of Actel’s rad-hard FPGAs, which are being jointly developed by Actel and Loral.
Key Agreements
• Actel completed an agreement with Loral Federal Systems in Manassas, Virginia, in 1H95 to jointly
develop radiation-hardened, nonvolatile FPGAs. The chips will be targeted at applications in military and
aerospace systems. The agreement also calls for Loral to manufacture the rad-hard FPGAs.
1-6
Allegro MicroSystems
ALLEGRO MICROS YSTEMS
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036
Telephone: (508) 853-5000
Fax: (508) 856-7434
IC Manufacturer
Sales
Capital Expenditures
1991
104
1992
115
13
1993
124
10
1994
161
14
Employees
1995
204
61
2,000
Allegro MicroSystems is the former semiconductor branch of Sprague Technologies, Inc. In 1990, Sprague
was purchased by Japan's Sanken Electric and renamed Allegro MicroSystems.
Today, Allegro is
functionally and structurally an independently operating organization as a wholly owned subsidiary of Sanken
Electric.
Allegro MicroSystems specializes in the design, manufacture, and marketing of advanced mixed-signal ICs.
The company is the world leader in Hall-effect sensor ICs and a prominent supplier of power and smart
power ICs. Allegro's customers are OEM's primarily serving the automotive and industrial markets, but also
the consumer, telecommunications, computer mass storage, and printer markets.
Telecommunications
5%
EDP
8%
Consumer
14%
Japan
14%
Industrial
47%
Automotive
26%
Far East
15%
Europe
19%
United States
52%
1-7
Management
Allan S. Kimball
Dan Ax
Dennis Fitzgerald
John Kokulis
Andy Labrecque
John MacDougell
Steven W. Miles
Fred Windover
Marybeth Perry
President
Vice President, Business Development
Vice President, Quality Systems
Vice President, Operations
Vice President, Research and Development
Vice President, Product Development
Director, Human Resources
Allegro's product offering is outlined below by end-use market segment.
Automotive Market
Magnetic field sensors
Power driver ICs
Signal processing ICs
Radio components
EDP Printer and Communication Markets
Printer head driver
Paper transport motor driver
Battery management
Computer Mass Storage Market
Spindle motor controller/driver
Servo/voice-coil motor driver
Combination drivers
Industrial and Consumer Markets
Discretes
Chip supply for hybrids
Smoke detector electronics
Switch Mode Power Supply Market
AC-DC converter (>10W to <250W)
Universal input switching (<1kW)
The semiconductor processes used by Allegro range from standard bipolar to CMOS, power DMOS (doublediffused MOS), and combinations of all of them.
Discretes
6%
BiCMOS/
BCD/CMOS ICs
22%
Bipolar ICs
72%
1995 Sales by Device Type
1-8
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036
Cleanroom size: 20,000 square feet
Capacity (wafers/week): 5,000
Wafer size: 100mm
Processes: Bipolar, CMOS, BiCMOS, DMOS
Products: Power and smart power ICs,
signal processing ICs, sensors
Feature sizes: 1.5µm-8.0µm
3900 Welsh Grove Road
Willow Grove, Pennsylvania 19090
Wafer size: 100mm
Processes: Bipolar, CMOS, BiCMOS, DMOS
Products: Power and smart power ICs,
ASICs (mixed-signal), sensors
Allegro plans to invest $80 million to expand wafer capacity at its Worcester fab facility. A 150mm wafer line
will be added to support 1.5µm production of its power and smart power ICs and sensor products. Allegro is
also planning to double the capacity at its Willow Grove facility.
1-9
Alliance Semiconductor
ALLIANCE S EMICONDUCTOR
Alliance Semiconductor Corporation
3099 North First Street
San Jose, California 95134-2006
Telephone: (408) 383-4900
Fax: (408) 383-4999
IC Manufacturer
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Employees
1992
4
(3)
1
1993
22
2
2
1994
55
9
4
1995
119
24
8
1996
201
11
n/a
20
35
40
74
n/a
Founded in 1985, Alliance Semiconductor designs, develops, and markets memory products and memory
intensive logic products for high-performance applications. Such applications are in the desktop and
portable personal computer, networking, telecommunications, and instrumentation industries.
The company originally manufactured its own devices in a fab facility near Kansas City, Missouri, leased from
AT&T. However, high overhead costs and low demand in its product markets caused the plant to operate at
a significant loss until its closure in February 1990. The company filed for Chapter 11 bankruptcy protection
in March 1991 and then emerged with a new business strategy to operate as a fabless supplier of highperformance SRAMs and other memory products.
Alliance operated as a fabless company until 1995 when it announced several manufacturing partnerships
with Taiwan’s United Microelectronics Corporation (UMC) and Singapore’s Chartered Semiconductor.
Other
10%
Asia
45%
United States
45%
1-10
Since the beginning of fiscal 1993, sales of Alliance’s SRAM products have accounted for substantially all of
its net revenue. The company continues to develop and introduce new SRAM products, such as high
density (32K x 32), 3.3V burst synchronous SRAMs. Meanwhile, Alliance is aggressively making a transition
from a single product line, SRAM supplier to a broad-based semiconductor company with multiple product
lines. The new product lines include high-performance DRAMs, multimedia ICs, and flash memory devices.
Management
N. Damodar Reddy
C.N. Reddy
Sid Agrawal
Kamal Gunsagar
Angela Kupps
Ken Poteet
Phil Richards
Sunit Saxena
Bharat Shastri
Ronald K. Shelton
Ritu Shrivastava
Executive Vice President, Engineering and Operations
Vice President, Contract Manufacturing
Vice President, Integrated Memory Products
Vice President, Product Engineering
Vice President, Systems Engineering
Vice President, Finance and Administration, and Chief Financial Officer
Vice President, Technology Development
Alliance Semiconductor supplies primarily high-speed CMOS SRAMs, ranging from 64K densities with 10ns
access times to 4M densities with 15ns access times. The company also offers a 1M (32K x 32)
synchronous burst fully pipelined SRAM specifically designed for high-performance Pentium applications with
access times as low as 6ns.
Volume production of a new line of high-speed 4M and 16M DRAMs is expected to begin in the second half
of 1996. At present, Alliance only sells 256K and 1M DRAMs.
Alliance supplies a limited amount of 3.3V-only and 5V-only 1M flash memory devices. Flash memories with
2M and 4M densities are expected to be introduced in 1996.
The company's first foray beyond memory chip markets came in late 1994, when it unveiled what it
considers to be the first multimedia user interface (MMUI) chip. The chip, called ProMotion-3210, is a
DRAM-based motion video and graphics accelerator that is compatible with several compression techniques,
including Indeo, CinePak, Motion JPEG, and MPEG 1. The chip line also includes a fully integrated graphic
accelerator chip, the ProMotion-6422, which includes a RAMDAC, a clock synthesizer, and a video and
graphics accelerator.
Since 1988, Alliance's CMOS process technology has migrated from the 1.5µm level to the current 0.45µm
level. Currently, nearly all of Alliance’s products are manufactured using 0.6µm and 0.5µm technologies, but
0.45µm technology is being used at one of its foundries. The company’s SRAMs are based on a two-poly,
one-metal CMOS process and its DRAMs on a three-poly, one-metal CMOS process.
1-11
Alliance Semiconductor announced major plans in 1995 calling for a substantial portion of the company’s
future wafer capacity to come from fabs in which it has partial ownership. The company’s existing foundry
supply agreements are with UMC, Chartered Semiconductor, Rohm, and TSMC. In addition, some of
Alliance’s MMUI products are produced by Samsung.
In October 1995, Alliance entered a definitive agreement with UMC and other parties to form a separate
Taiwanese company, United Silicon Inc., for the purpose of building and managing a semiconductor
manufacturing facility in Taiwan. Alliance will invest approximately $60 million, representing an initial equity
ownership of about 10 percent. In return for its investment, Alliance will receive 12.5 percent of the
manufacturing capacity in United Silicon’s fab, which is expected to move into production in 1997.
Earlier in 1995, Alliance entered into a partnership with UMC and S3 Incorporated to establish a new jointly
owned wafer foundry company in Taiwan called United Semiconductor Corporation (USC). Alliance’s
investment in the foundry will initially total approximately $80 million, representing an equity ownership of 20
percent. In return for its investment, Alliance will receive 25 percent of the manufacturing capacity in the
United Semiconductor fab. The fab will be a 200mm wafer, 0.35µm plant capable of producing 5,000 to
6,250 wafers per week. It will start manufacturing wafers for Alliance, S3, and other semiconductor
companies in 3Q96.
Also in 1995, Alliance announced a $50 million investment in Chartered Semiconductor Manufacturing to
obtain a minority ownership stake in the company and a guaranteed portion of the capacity in Chartered’s
new 200mm wafer fab that began production in the second half of 1995.
Alliance’s equity investments in UMC and Chartered so far total about $200 million. By the end of 1997, the
company expects wafers from the UMC and Chartered fabs it has invested in will represent more than 50
percent of its capacity.
Key Agreements
• Alliance and UMC signed an agreement in 4Q95 under which UMC may expand allocation of wafer
fabrication capacity to Alliance for the manufacture of Alliance’s DRAM products. In return, Alliance
granted UMC a license to produce for itself a certain number of Alliance DRAM products. As discussed
above, UMC and Alliance will also cooperate in the manufacture of ICs through two new IC foundry
companies they are setting up in Taiwan.
• Alliance signed an agreement with 3Dfx Interactive, Inc. in late 1995 to work together on ensuring
compatibility between Alliance’s ProMotion multimedia chips and 3Dfx Interactive’s Voodoo Graphics
three dimensional graphics accelerator designed for 3D entertainment applications.
• Alliance licensed Aspec Technology's Portfolio™ family of ASIC design tools in 2Q95. These tools will
allow the company to create low-cost ASIC gate array and embedded memory array products.
1-12
• Alliance entered into a joint development, manufacturing, and marketing agreement with Japan's Rohm
Co., Ltd. in mid-1994 calling for Rohm to furnish Alliance with 0.5µm CMOS fab capacity for the
production of SRAMs. Rohm will also help Alliance sell and market the products in Japan; Alliance will, in
turn, assist Rohm in developing high-performance, low-power SRAMs.
1-13
Altera
ALTERA
Altera Corporation
2610 Orchard Parkway
Telephone: (408) 894-7000
Fax: (408) 435-1394
Web Site: www.altera.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
107
18
14
1992
101
12
16
1993
140
21
17
1994
199
15
22
1995
402
87
34
446
477
527
667
900
Altera Corporation, founded in 1983, is a leading supplier of high-performance, high-density CMOS
programmable logic devices (PLDs) and associated development tools. Its broad line of "off-the-shelf" userconfigurable chips, together with Altera-developed software, enable system manufacturers to create custom
logic functions in-house for a wide variety of applications. Altera believes its products and services provide its
customers with faster time-to-market than custom (ASIC) solutions. The company's name was derived from
the word Alterable.
Altera products are used in a variety of applications, including telephone switching systems, computer
networking, multimedia boards, broadcast video and video conferencing, and medical instrumentation.
Development Software
and Hardware
5%
Military
6%
Consumer
4%
Other
1%
Industrial
17%
CMOS Programmable
Logic Chips
95%
1-14
Computer
17%
Communications
55%
Altera
Asia-Pacific
6%
Japan
20%
Europe
21%
North America
53%
Management
Rodney Smith
Denis Berlan
Erik Cleage
Jack Fitzhenry
Clive McCarthy
Thomas J. Nicoletti
Nathan Sarkisian
Peter Smyth
Vice President, Operations and Product Engineering
Vice President, Development Engineering
Vice President, Business Development and Investor Relations
Vice President, Finance
Altera's PLD products extend from 20 to 560 pins with usable gate counts up to 100,000 gates and process
technologies advancing to 0.5µm through its fabrication partners.
FLEX 10K Family
• 10,000-100,000 usable gates
• In-circuit reconfigurable
• 84-560 pins
• Performance: 75MHz
• SRAM technology
• 3.3V versions available
• Megafunction support
• 0.5µm
FLEX 8000 Family
• 2,500-50,000 usable gates
• 84-304 pins
• Performance: 75MHz
• SRAM technology
• 3.3V versions available
• 0.65µm-0.8µm
FLASHlogic Family
• 800-3,200 usable gates
• In-system programmable
• Performance: 50-100MHz
• SRAM and flash/EPROM technology
• 0.6µm
MAX 9000 Family
• 6,000-12,000 usable gates
• 84-304 pins
• EEPROM technology
• 0.65µm
1-15
Altera
MAX 7000 Family
• High pin to gate ratio
• 44-208 pins
• EEPROM technology
• 0.65µm-0.8µm
MAX 5000 Family
• High register count
• 24-100 pins
• 0.65µm-0.8µm
Classic Family
• 150-900 usable gates
• Zero-standby power
• 20-68 pins
• 0.8µm-1.5µm
The company also offers 64K, 213K, and 1M EPROMs designed to configure its FLEX devices, as well as
mask-programmed logic devices (MPLDs) for high-volume applications. MPLDs are pin-, function-, and
timing-compatible with Altera’s PLDs and are available for all families.
In November 1995, Altera announced it would discontinue its military-qualified line of PLDs. It will ship Milspec devices until mid-1997 and support existing customers. In addition, Altera stated in early 1996 that it
would drop certain low-density simple PLD lines, many of which are PAL/GAL and 22V10 equivalent devices,
by August 1996.
Altera supplies proprietary software development systems (MAX+PLUS II™) to support its PLD products.
Altera has foundry agreements with Sharp and TSMC. It also owns 17 percent of Cypress Semiconductor's
wafer fab in Round Rock, Texas. Through this ownership, Altera has the right to buy a percentage of the
wafers produced by Cypress approximately equal to the percentage of its ownership.
In November 1995, Altera signed a letter of intent for joint ownership of a TSMC fab to be built in Camas,
Washington. Under the terms, Altera will invest $125 million to take a 16 percent equity stake in TSMC, and
also gain the rights to 24 percent of the output from the new fab. Potential output from the $1.2 billion plant
is expected to be 7,500 200mm wafers per week, with production scheduled to start in 1H98. Design rules
will start at 0.35µm and migrate to 0.25µm.
1-16
Altera
Cypress Semiconductor (Texas) Inc.
(17 percent owned by Altera)
17 Cypress Drive
Round Rock, Texas 78664
Wafer size: 150mm
Processes: CMOS
Products: PLDs for Altera
TSMC Joint Venture Fab
(will be 16 percent owned by Altera)
Camas, Washington
Wafer size: 200mm
Process: CMOS
Products: Foundry services
Feature sizes: 0.25µm, 0.35µm
(Scheduled to start up in 1Q98)
Key Agreements
• In February 1996, Altera purchased a minority stake in I-Cube Inc., a privately held supplier of
programmable switching and interconnect devices (PSIDs).
1-17
AMCC
APPLIED MICRO CIRCUITS (AMCC)
Applied Micro Circuits Corporation
6195 Lusk Boulevard
San Diego, California 92121-2729
Telephone: (619) 450-9333
Fax: (619) 450-9885
Web Site: www.amcc.com
IC Manufacturer
Sales
1991
38
1992
39
1993
47
1994
50
1995
51
265
275
300
310
270
Employees
Established in 1979, Applied Micro Circuits Corporation (AMCC) develops, manufactures, and markets highspeed, high-reliability ASSPs for data communications, telecommunications, computer interface, and clock
and timing applications, in addition to ASICs for commercial and military applications. The privately-held
company is a leader in bipolar manufacturing and bipolar ECL logic arrays.
Pacific Rim
12%
Bipolar Analog/Custom
9%
Europe/Israel
8%
Bipolar/BiCMOS Digital
91%
1-18
North America
80%
AMCC
Management
David Rickey
John Grosse
Joel O. Holliday
Roger Smullen
William Staunton
Mark Denin
Brent Little
Vice President, Quality Assurance and Reliability
Director, ASSP Marketing
Director, ASIC Marketing
AMCC produces and sells bipolar and BiCMOS gate arrays, custom bipolar IC products, and standard
bipolar and CMOS products.
The company’s line of ASSPs for high-performance networking, clock/timing, and bus interface applications,
and ASICs include the following:
Q20000 Series ECL/TTL “Turbo” Logic Arrays
MicroPower 3V, low power, bipolar, standard cell ASICs
PCI Bus Controllers
SONET/SDH Products
WAN/LAN Products
ATM Products
Crosspoint Switches
CRC Generator/Checker
ECL Terminator
Clock Buffers
CMOS (PCI Products)
7%
BiCMOS
20%
Bipolar
73%
1995 Sales by Process Technology
1-19
AMCC
AMCC operates from a 120,000 square foot facility in San Diego, California, which includes a design center
for customer design use and training, a Class 10 cleanroom for bipolar IC production, and an assembly and
test facility. The company has established strategic foundry partners to augment its wafer supply.
Applied Micro Circuits Corporation
6195 Lusk Boulevard
San Diego, California 92121
Cleanroom size: 10,000 square feet (Class 10)
Wafer size: 100mm
Processes: Bipolar
Products: Gate arrays, ASSPs, custom ICs
Feature sizes: 1.0µm ECL/bipolar
2.0µm, 3.0µm bipolar
AMCC's capacity is only about half utilized, and the company expects its current manufacturing resources to
reach maximum levels in a few years.
Key Agreements
• AMCC has a strategic alliance with Hughes Electronics for ASIC products.
1-20
AMD
ADVANCED MICRO DEVICES (AMD)
Advanced Micro Devices, Inc.
One AMD Place
P.O. Box 3453
Telephone: (408) 732-2400
Fax: (408) 774-7216
Web Site: www.amd.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
1,227
145
214
111
1992
1,514
245
228
222
1993
1,648
229
263
324
1994
2,135
305
280
549
1995
2,430
300
398
621
11,254
11,554
12,065
11,793
12,730
Advanced Micro Devices (AMD) was founded in 1969 and is today one of the largest U.S.-based merchant
manufacturers of integrated circuits. With a focus on the personal and networked computing and
communications markets, the company produces microprocessors and related peripherals, flash memories,
programmable logic devices, and circuits for telecommunications and networking applications.
AMD’s strategy is to be competitive only in those markets where it can be a leading factor. The company
has been a major supplier of microprocessors since 1975, it is a leading supplier of non-volatile memories, a
leader in ICs for local area networks and linecards for public communications applications, and the second
largest supplier of programmable logic devices.
Analog
10%
Digital Bipolar
5%
MOS Micro
38%
MOS Logic
19%
MOS Memory
28%
ROW
19%
Japan
8%
North America
45%
Europe
28%
1-21
AMD
In January 1996, AMD completed the acquisition of NexGen, Inc., significantly enhancing its core
competency in advanced microprocessor design. The acquisition brings together the engineering resources
and sixth-generation microprocessor design of NexGen with AMD’s sub-0.35µm process technology and
manufacturing capability to enable AMD to offer future generations of microprocessors in a competitive
timeframe. The company plans to bring to production the sixth-generation NexGen design as the AMD-K6™
microprocessor in early 1997.
Management
W.J. Sanders III
Richard Previte
Marvin Burkett
Gene Conner
S. Atiq Raza
Stanley Winvick
Stephen Zelencik
John Bourgoin
Vinod Dham
Richard Forte
Terryll R. Smith
Benjamin M. Anixter
Gary Ashcraft
Frank Barone
Kathryn Brandt
Donald M. Brettner
David Chavoustie
Susan T. Daniel
James Doran
Curt Francis
Al F. Frugaletti
Clive Ghest
Gary O. Heerssen
Robert R. Herb
Larry Hollatz
Robert M. Krueger
Gerald A. Lynch
Walid Maghribi
Robert McConnell
Thomas M. McCoy
Giuliano Meroni
K.C. Murphy
Daryl Ostrander
Joseph Proctor
Geoff Ribar
Douglas Ritchie
1-22
Chief Executive Officer
President and Chief Operating Officer
Senior Vice President, Chief Financial and Administrative Officer and
Treasurer
Senior Vice President, Operations
Corporate Vice President and Chief Technical Officer
Senior Vice President, Human Resources
Senior Vice President and Chief Marketing Executive
Group Vice President, Computation Products Group
Group Vice President, Computation Products Group
Group Vice President, Communications and Components Group
Group Vice President, Sales
Vice President, External Affairs
Vice President and GM, Communication Products Division
Vice President and GM, Programmable Logic Division and Bipolar Operations
Vice President, Business Systems
Vice President, Manufacturing Services Division
Vice President and GM, Embedded Processor Division
Vice President, Human Resource Operations
Vice President, Technical Operations
Vice President, Corporate Planning and Development
Vice President, Worldwide Distribution and Headquarters Sales
Vice President and Group Executive, Austin Wafer Fab Operations
Vice President, Group Strategic Marketing, Computation Products Group
Vice President and GM, Texas Microprocessor Division
Vice President and GM, I/O and Network Products Division
Vice President, Asia Pacific Sales and Marketing
Vice President and GM, Non-Volatile Memory Division
Vice President
Vice President, Europe Sales and Marketing
Vice President, Systems and Platform Development
Vice President, Austin Wafer Fabrication
Vice President, Information Systems
Vice President, Corporate Controller
Vice President, Information Integration and Access
AMD
Jack Saltich
William Siegle
Vice President and General Manager, European Microelectronics Center
Vice President, Integrated Technology Division and Submicron Development
Center, and Chief Scientist
Vice President, Corporate Quality
Vice President, Communications
President, Fujitsu AMD Semiconductor Ltd.
Danne Smith
Tom Sites
Kimio Yanagida
MOS MEMORY
ANALOG
DRAM
SRAM
✔
✔
Consumer/Automotive
EPROM
Voltage Regulator/Reference
EEPROM
✔
✔
Other (Including Non-Volatile RAM)
General Purpose Logic
Gate Array
Field Programmable Logic
Comparator
DIGITAL BIPOLAR
✔
✔
Standard Cell
✔
Data Conversion
Other (Includes Telecom)
MOS LOGIC
✔
Interface
Flash Memory
ROM
✔
Amplifier
✔
Bipolar Memory
Gate Array/Standard Cell
✔
Other Special Purpose Logic
✔
MPU/MCU/MPR
MOS MICROCOMPONENT
✔
✔
✔
MPU
OTHER
MCU
Full Custom IC
MPR
Discrete
DSP
Optoelectronic
AMD is organized into three focused product groups: AMD 1 (Microprocessor Products), AMD 2
(Communication Products), and AMD 3 (Non-Volatile Memory, Programmable Logic, and Embedded
Processor Products).
Microprocessor Products
AMD5K86 Microprocessors—The first member of AMD’s K86 family of superscalar microprocessors, the
5K86 is a fifth-generation alternative to Intel’s Pentium. It is based on AMD’s 0.35µm CMOS technology
and is initially offered in two versions. The 5K86-P75 and 5K86-P90 are said to offer performance greater
than or equal to a 75MHz Pentium and a 90MHz Pentium, respectively. AMD’s sixth-generation offering is
scheduled to start production in early 1997.
1-23
AMD
Am5x86 Microprocessors—The 5x86 is said to offer Pentium-class performance using a fourth-generation
architecture. It is based on a 0.35µm CMOS process and runs at a quadrupled clock rate of 133MHz.
Am486 Microprocessors—AMD’s 486DX4 microprocessors offer clock-tripled performance speeds of up to
120MHz and feature “enhanced” power management features.
InterWave™ Audio Processor—This is a complete audio sound system on a chip for PC applications that
supports many major audio standards.
Communication Products
AMD’s communications and networking products include ICs for public infrastructure, including subscriber line
interface circuits (SLICs), subscriber line audio-processing circuits (SLACs™), and ISDN controllers; ICs for
networking, including FDDI chips and PCnet™ Ethernet LAN devices; ICs for data communications, including
PCI small computer systems interface (SCSI) circuits, serial communications controllers (SCCs), and
TAXIchip™ devices; and ICs for wireless communications, including CT2 PhoX™ controllers for digital
cordless telephones and PCnet-Mobile devices for wireless LANs.
Non-Volatile Memory Products
Am29Fxxx Flash Memories—The Am29Fxxx family of 5.0V-only sector-erase flash memory devices are
available in densities ranging from 1M to 16M.
Am29LVxxx Flash Memories—The Am29LVxxx family of 3.0V-only sector-erase flash memory devices are
available in densities ranging from 2M to 8M.
Am28Fxxx Flash Memories—This is the company’s first generation family of 5.0V/12.0V bulk-erase flash
memory devices. They are available in densities ranging from 256K to 2M.
EPROM Products—AMD’s CMOS UV and OTP EPROMs are offered in densities ranging from 64K to 4M.
Low-voltage versions are available in 1M and 2M densities.
ExpressROM Products—These are standard EPROM die that are pre-programmed and then encapsulated
in plastic packaging before delivery. They are offered in densities ranging from 64K to 8M.
Programmable Logic Products
AMD’s PLD products include a variety of CMOS and bipolar programmable array logic (PAL) devices and its
line of MACH (Macro Array CMOS High-Density) advanced complex PLDs (CPLDs) with densities as high as
20,000 gates and speeds as fast as 7.5ns.
1-24
AMD
Embedded Processor Products
AMD’s E86™ Family of embedded processor products include several microprocessors and microcontrollers
based on the company’s 186, 386, and 486 cores. The company has shifted its embedded product focus
toward its growing E86 family and away from its venerable 29K™ family of embedded RISC processors.
AMD will continue to support current product designs and customers using its 29K products. However,
development of new 29K devices has been discontinued. AMD cited the high cost of supporting the
proprietary architecture as the reason for putting an end to the product line.
Other IC Products
The company’s other IC products include bipolar PROMs and RAMs, FIFO memories, high-performance
CMOS and bipolar bus interface devices, transmission line drivers and receivers, and dynamic memory
management circuits.
AMD announced plans to build a $1.9 billion sub-half-micron semiconductor manufacturing facility in
Dresden, Germany, for the manufacture of its K5 microprocessors and other generations of its K86 family.
Groundbreaking is scheduled for the end of 1996, with production commencing by the end of 1998.
In another move, AMD and Fujitsu broke ground in late 1995 on their second joint-venture manufacturing
facility in Japan, a $1.2 billion fab for the production of flash memories.
Advanced Micro Devices
5204 East Ben White Boulevard
Austin, Texas 78741
Telephone: (512) 385-8542
Fab 10
Wafer size: 125mm
Process: CMOS
Products: PLDs
Feature size: 0.9µm
Austin, Texas 78741
Telephone: (512) 385-8542
Fab 14
Wafer size: 150mm
Process: CMOS
Products: Flash memories, EPROMs
1-25
AMD
Austin, Texas 78741
Telephone: (512) 385-8542
Fab 15
Wafer size: 150mm
Process: CMOS
Products: Logic, telecom, and network ICs;
MPUs; microperipheral ICs
901 Thompson Place
Sunnyvale, California 94088
Telephone: (408) 732-2400
Fab 17 and Submicron Development Center
Wafer size: 150mm
Process: CMOS
Products: R&D, MPUs, flash memories
Austin, Texas 78741
Telephone: (512) 385-8542
Fab 25
Wafer size: 200mm
Process: CMOS
Products: MPUs, logic ICs, flash memories
Feature sizes: 0.35µm, 0.5µm (0.25µm capability)
Dresden, Germany
Fab 30
Wafer size: 200mm
Process: CMOS
Products: MPUs, logic ICs
Feature size: 0.25µm (0.18µm capability)
(Expected to start production by the end of 1998.)
Fujitsu AMD Semiconductor Ltd.
Aizuwakamatsu, Fukushima Prefecture, Japan
FASL I
Wafer size: 200mm
Process: CMOS
Products: Flash memories
Feature sizes: 0.35µm, 0.5µm (0.25µm capability)
Fujitsu AMD Semiconductor Ltd.
Aizuwakamatsu, Fukushima Prefecture, Japan
FASL II
Wafer size: 200mm
Process: CMOS
(Scheduled to begin operations in 1997)
AMD’s back-end manufacturing facilities are located in Penang, Malaysia; Bangkok, Thailand; and
Singapore. In early 1996, AMD began the construction of a new assembly and test facility in Suzhou,
China.
1-26
AMD
Key Agreements
• In early 1996, NexGen, Inc. merged with and into AMD. The merger brings together the engineering
resources and sixth-generation microprocessor design of NexGen with AMD’s sub-0.35µm process
technology and manufacturing capability to enable AMD to offer future generations of microprocessors in
a competitive timeframe. AMD paid nearly $1 billion for NexGen.
• AMD and Intel signed a new five-year cross-licensing agreement in early 1996 that gives the two
companies rights to use each other’s patents and certain copyrights, excluding microprocessor microcode
beyond the 486 generation.
• AMD and Fujitsu opened a large flash memory fabrication facility in Japan in September 1994.
Production of flash memory chips began in 1Q95. As an extension of their relationship, Fujitsu is OEMprocuring 1M and 2M flash devices from AMD for use in portable communications equipment. In late
1995, the partners began the construction of a second joint-venture fab in Japan.
• Taiwan Semiconductor Manufacturing Co. (TSMC) was signed on as a foundry partner for AMD's Am486
microprocessors in late 1994. Production volumes started in 3Q95. The agreement is good through the
end of 1997.
• AMD announced in mid-1994 that SGS-Thomson Microelectronics would become a second source for all
of AMD's 5-volt-only flash memory devices.
1-27
AMI
AMERICAN MICROSYSTEMS (AMI)
American Microsystems, Inc.
2300 Buckskin Road
Pocatello, Idaho 83201
Telephone: (208) 233-4690
Fax: (208) 234-6795
Web Site: www.amis.com
IC Manufacturer
Sales
1991
86
1992
135
1993
150
1994
171
1995
221
Employees
1,375
1,685
1,657
1,265
1,265
Established in 1966, American Microsystems Inc. (AMI) was a pioneer in the development of application
specific ICs (ASICs). Today, the company's products and services range from digital and mixed-signal
ASICs, to CMOS foundry services, application-specific standard products (ASSPs), and high-level integrated
solutions through multichip modules. AMI currently specializes in producing both digital and mixed-signal
systems on a chip and is the number one U.S. manufacturer of mask ROMs.
The company is comprised of three business units and two divisions: the Mixed-Signal Business
Digital ASIC Business Unit, the Foundry Business Unit, the Standard Products Division, and the
Products Division, which specializes in contract manufacturing solutions utilizing multichip modules.
the five units has the responsibility, along with the marketing and engineering resources needed,
respective products and services.
Unit, the
Multichip
Each of
to sell its
Recently, AMI's sales strategy underwent a significant shift from a primary focus on direct sales to increased
reliance on the company's growing international network of manufacturer's representatives, distributors, and
design centers. This network markets AMI's cell-based and gate array ASICs as well as its ROMs.
1-28
AMI
Multichip
Products
1%
Other
Standard
1%
Cell
10%
Standard
Products
11%
Foundry
35%
Mixed Signal
14%
Gate Array
28%
1995 Sales by Business Segment
AMI's products serve markets such as telecommunications, consumer electronics, computer peripherals,
military, industrial, and automotive equipment.
Distributor
2%
Automotive
5%
Other
3%
Industrial
13%
Military
13%
ROW
6%
Europe
2%
Japan
2%
Communications
29%
Consumer
17%
EDP
18%
North America
90%
Management
Gerald "Jerry" E. Homstad
Harold Blomquist
Randy Cook
Grant Hulse
Paul Pimentel
Tom Schiers
Dan Schroeder
Tony Cabiedes
Al Morrison
Troy Murray
Marv Yancey
Vice President, Multichip Products Division
Vice President, Standard Products
Vice President, Finance/Purchasing
Vice President, Digital ASICs
Director, Mixed-Signal
Director, Foundry
Manager, Site Services
Manager, Sub-Micron Program
1-29
AMI
AMI offers the following products and services:
•
•
•
•
Standard-cell and gate array digital ASICs
Mixed-signal ASIC development services
Mask programmable ROMs (16K to 16M density)
Digital and mixed-signal ASIC design software
•
•
•
•
Foundry services
Contract design and manufacturing
Multichip modules
Custom packaging
AMI's digital ASIC standard library, which supports both gate arrays and standard cells, contains over 500
cells and operates from 2.5V to 5.5V. Its arrays have up to 464,000 usable gates.
AMI's mixed-signal processes allow the analog voltage to run from –5V to +5V or from 0V to 12V, and will
accommodate a wide range of functions.
The company's semiconductor products are fabricated using CMOS and NMOS process technologies, with
geometries as fine as 0.6µm. In 1996, the company will complete construction of Fab 10 (see section
below), which will provide the capability to process devices with 0.35µm feature sizes.
AMI
2300 Buckskin Road
Pocatello, Idaho 83201
Wafer size: 125mm
Processes: CMOS, NMOS
Products: ASICs, ROMs, telecom and datacom ICs,
MCMs, foundry services
Feature sizes: 0.6µm-5.0µm CMOS;
3.0µm-5.0µm NMOS
AMI
Pocatello, Idaho
Fab 10 (startup in 4Q96)
Wafer size: 200mm
Process: CMOS
Feature size: 0.35µm-2.0µm
AMI's facility in the Philippines performs sort and final testing, while assembly work is contracted out.
Key Agreements
• AMI has an alliance with WSI Inc. to jointly develop mask-programmable versions of WSI's line of
microcontroller peripherals and both companies are separately marketing the complete range of devices.
AMI is manufacturing the parts.
1-30
Anadigics
ANADIGICS
Anadigics, Inc.
35 Technology Drive
Warren, New Jersey 07059-5197
Telephone: (908) 668-5000
Fax: (908) 668-5068
IC Manufacturer
Sales
Net Income
R&D Expenditures
1991
7
(6)
6
Employees
1992
20
(2)
5
1993
29
2
7
2
1994
35
2
9
5
1995
51
7
12
9
115
200
270
320
Anadigics was founded in 1985 when it initiated macrocell development. A year later, it completed
construction of its wafer fab, and in 1987, started GaAs IC production with the introduction of both MMIC
and fiber optic IC products. Today, the company is a leading designer and producer of GaAs ICs for highvolume, high-frequency receiver applications. The company launched its initial public offering in April 1995.
The company had originally relied on defense contracts to survive. However, with lucrative military pacts
becoming more of a rarity, Anadigics looked to the commercial and consumer electronics marketplaces to
sell its products. Today, Anadigics has established itself as a leading supplier of high-volume, low-cost, highperformance analog GaAs ICs for applications including direct broadcast satellite (DBS) systems, cable
television systems, cellular telephones, fiber optic communications, and personal communication systems
(PCS).
1-31
Anadigics
Engineering
Services
4%
Asia-Pacific
31%
Europe
37%
North
America
32%
Fiber Optics
19%
Cable TV
21%
Wireless
29%
Direct Broadcast
Systems
27%
Management
Ron Rosenzweig
George Gilbert
Charles Huang, Ph.D.
John F. Lyons
Robert Baytuns
Sheo Khetan
Javed S. Patel
Phillip Wallace
Executive Vice President and Chief Operating Officer
Executive Vice President, Market Research and Business Development
Senior Vice President and Chief Financial Officer
Vice President, Research and Technology
Vice President, Manufacturing
Vice President, Marketing and Sales
Among the company's GaAs IC products are low-noise block converters and tuners for DBS systems,
upconverter chips for use in cable TV converters, cellular telephone power amplifiers and receivers, and fiber
optic (SONET) transimpedence amplifiers. Anadigics produces all of its ICs in its GaAs MESFET process.
Anadigics, Inc.
35 Technology Drive
Warren, New Jersey 07059-5197
Capacity (wafers/week): 400
Wafer size: 3in
Process: GaAs MESFET
1-32
Analog Devices
ANALOG D EVICES (ADI)
Analog Devices, Inc.
One Technology Way
P.O. Box 9106
Norwood, Massachusetts 02062-9106
Telephone: (617) 329-4700
Fax: (617) 326-8703
Web Site: www.analog.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends October 31
Sales
Net Income
R&D Expenditures
1991
538
8
89
52
1992
567
15
88
66
1993
666
44
94
67
1994
773
74
107
91
1995
942
119
134
213
Employees
5,200
5,200
5,300
5,400
6,000
Analog Devices, Inc. (ADI) was founded in 1965 and is today a leading designer and manufacturer of highperformance linear, mixed-signal, and digital integrated circuits that address a wide range of real-world signal
processing applications.
The company's products are typically incorporated by OEMs in equipment, instruments, and systems for a
variety of applications, including communications equipment; computers and computer peripherals;
engineering, medical, and scientific instruments; factory automation equipment; military/aerospace
equipment; high-end consumer electronic products; and automotive equipment.
Computer
8%
Other
14%
Factory Automation/
Military/
Instrumentation
Aerospace
42%
14%
Communications
22%
Japan
17%
ROW
11%
North America
44%
Europe
28%
1-33
Analog Devices
Analog Devices’ products can be divided into four groups: general purpose, standard-function linear ICs
(SLICs), including amplifiers and data converters; special-purpose linear and mixed-signal ICs (SPLICs) and
general-purpose digital signal processing ICs (DSP ICs); hard disk drive ICs; and assembled products such
as hybrids and multichip modules. Integrated circuits accounted for 92 percent of the company's total
revenues in fiscal 1995.
Assembled
Products
8%
Hard Disk
Drive ICs
4%
SPLICs
and DSP ICs
24%
SLICs
64%
1995 Sales by Product Group
ADI's strategy is to focus on major opportunities for DSPs and SPLICs as its primary sources of revenue
growth, while at the same time, continuing its efforts to sell traditional SLIC product lines, which remain its
largest cash and profit generators. In addition, the company plans to continue to extend its core
technologies to include new technologies, such as RF/IF signal processing for wireless communications
applications and surface micromachining for automobile air bag system accelerometers.
Management
Ray Stata
Jerald G. Fishman
J.B. Archinard
Ross Brown
Dennis Buss
David D. French
Russell K. Johnsen
Rob Marshall
Robert McAdam
Brian McAloon
Joseph E. McDonough
Joe Reichbach
Volkmar Schaldach
Shozo Sugiguchi
Goodloe Suttler
Geoffrey R. M. Thomas
Franklin Weigold
1-34
Vice President and General Manager, Assembled Products Division
Vice President and General Manager, Computer Products Division
Vice President and General Manager, Communications Products Division
Vice President, Worldwide Manufacturing
Vice President and General Manager, Standard Linear Products Division
Vice President, Finance, and Chief Financial Officer
Vice President, Sales, North America
Vice President, Sales and Marketing, Europe
Vice President, Sales and Marketing, Japan
Vice President, Planning and Quality Improvement
Vice President and Manufacturing General Manager, ADSC
Vice President and General Manager, Transportation and
Industrial Products Division
Analog Devices
Analog Devices offers high-performance linear, digital, and mixed-signal ICs such as data converters,
amplifiers, voltage references and comparators, signal processors and conditioners, application-specific ICs
for the consumer, disk drive, telecommunications, and automotive industries, and temperature and
accelerometer sensors.
SLICs
Analog Devices principal SLIC products are high-performance amplifiers and data converters. Other SLIC
products include analog signal processors, voltage references, and comparators.
The company
continues to expand its SLIC product line to include offerings in areas where it traditionally has had limited
focus, primarily interface circuits and power management ICs, and to include a much larger number of
products designed to operate from single-supply 3-volt or 5-volt power sources.
SPLICs and DSPs
ADI’s SPLICs and DSP ICs, which are collectively referred to as system-level ICs, are multi-function
devices that feature high levels of functional integration on a single chip. Most SPLICs are mixed-signal
devices and the balance are linear-only devices. The DSP ICs include both digital-only devices and
mixed-signal ICs that include a DSP core along with data conversion and analog signal processing
circuitry. The company also offers sensors and surface micromachined ICs.
Hard Disk Drive ICs
Chips in this category are used in hard disk drives that serve as rotating mass storage devices in
equipment such as PCs, workstations, and network servers. These ICs process analog signals from a
hard disk drive’s read/write head.
Assembled Products
The company’s assembled products consist of hybrids, multichip modules (MCMs), and printed-board
modules (primarily I/O modules used in industrial control and factory automation equipment).
In addition to utilizing standard bipolar and CMOS process technologies, ADI employs a number of
proprietary processes specifically tailored for use in manufacturing high-performance linear and mixed-signal
SLICs and SPLICs.
Analog Devices meets most of its need for wafers fabricated using linear and mixed-signal processes with
company-owned production facilities and uses third-party wafer fabricators for most wafers that can be
produced on industry-standard digital processes. Its two principal foundries are Taiwan Semiconductor
Manufacturing (TSMC) and Singapore’s Chartered Semiconductor Manufacturing.
During 1995 and early 1996, Analog Devices expanded its relationships with TSMC and Chartered in
response to the rapid growth of its systems IC business (see Key Agreements). Together with the current
expansions of its own fab facilities, these actions will provide Analog Devices access during 1996 to
approximately 2.5 times more digital CMOS capacity than it had available in 1995.
1-35
Analog Devices
Expansion of company-owned fabs included the installation of its first 150mm wafer line in its Irish fab facility.
The new line, completed in fiscal 1995, is currently producing 750 wafers per week, rising to 1,200 per week
in 1998, and 2,000 per week in 1999. The company is also upgrading its fab in Wilmington, Massachusetts,
to run 150mm wafers, starting in 3Q96.
In early 1996, Analog Devices announced it would establish
Massachusetts, dedicated to the development and production of
The fab will be located in a building previously used by Polaroid
fab is expected to run its first production parts, micromachined
fabricated in ADI’s Wilmington, Massachusetts, wafer fab.
a wafer fabrication facility in Cambridge,
the company’s surface micromachined ICs.
Corporation as an R&D fab. By 1Q97 the
accelerometers, which are currently being
Semiconductor Division
804 Woburn Street
Wilmington, Massachusetts 01887
Wafer size: 100mm (upgrading to 150mm)
Processes: CMOS, BiCMOS, bipolar
Products: Linear ICs, DSPs, ASICs
Feature sizes: 1.0µm CMOS
1.5µm BiCMOS, bipolar
4.0µm BiCMOS, complementary bipolar
PMI Division
1500 Space Park Drive
Wafer size: 100mm
Products: Linear ICs
610 East Weddell Drive
Wafer size: 150mm
Process: CMOS, bipolar
(Acquired from Performance Semiconductor in 1995)
Analog Devices, B.V.
Bay F-1
Raheen Industrial Estate
Limerick, Ireland
Wafer sizes: 100mm, 150mm
Processes: CMOS, BiCMOS
Products: Linear and mixed-signal ICs, ASICs
Feature sizes: 0.6µm, 1.0µm, 2.0µm
Analog Devices has its own test and assembly facilities located in the United States, Ireland, the Philippines,
and Taiwan. Expansions of the latter two facilities began in 1995.
1-36
Analog Devices
Key Agreements
• ADI licensed its ADSP-21xx 16-bit digital signal processor core to AMD and Acer Laboratories (Taiwan) in
early 1996. AMD will embed the core in communications-related ICs and Acer Labs will use it for future
PC telephony and telephone-answering devices.
• Analog Devices announced a license agreement with Hitachi in February 1996 for Hitachi’s 16-bit
microprocessor H8/300H core. ADI also has the option of licensing Hitachi’s next-generation H8S/2000
core. The core will be used by ADI’s Wireless Communications Division.
• Analog Devices expanded its relationship with TSMC in fiscal 1995 to include a series of advance
payments to the Taiwanese company totaling $22 million in exchange for a guaranteed amount of
200mm wafer capacity over the period from 1996 to 1999.
• The company entered into an additional agreement with Chartered in early 1996, whereby ADI agreed to
pay Chartered $20 million for guaranteed access to certain quantities of submicron 200mm wafers
through fiscal 2000. Originally in 1995, Analog Devices made an equity investment of $20 million in
Chartered Semiconductor in exchange for access to 0.5µm, 200mm wafer capacity during 1996.
• In early 1996, Aspec Technology licensed to Analog Devices its high-density ASIC architectures. The
agreement includes Aspec’s family of embedded array and standard cell architectures, as well as
associated design tools.
• Analog devices entered an agreement with Noise Cancellation Technologies Inc. (NCT) to provide design
and foundry services for NCT's first line of custom chipsets.
• Analog Devices is working with DSP Group to provide DSP Group's TrueSpeech voice compression
technology on ADI's digital signal processors.
• Analog Devices has an alliance with IBM in the joint design, production, and marketing of mixed-signal
and RF ICs based on IBM's silicon-germanium (SiGe) process technology.
• Analog Devices is developing surface micromachined accelerometers with Delco Electronics and MartinMarietta for both defense and commercial applications.
1-37
Array Microsystems
ARRAY MICROSYSTEMS
Array Microsystems, Inc.
1420 Quail Lake Loop
Colorado Springs, Colorado 80906
Telephone: (719) 540-7900
Fax: (719) 540-7950
Fabless IC Supplier
Employees
38
Array Microsystems, founded in 1990, designs, develops, and markets high-performance digital signal
processing (DSP) products with a focus on video compression technologies and system level designs for
multimedia applications. Array's mission is to become the leading supplier of optimum performance, lowcost digital motion video chipset solutions for consumer and professional markets.
Array is a privately held company that began operations with assets, personnel resources, products, and
technology developed from 1984 to 1989 by Honeywell Signal Processing Technologies. Presently about
80 percent of the firm’s business comes from military-type customers.
Management
Surendar S. Magar, Ph.D.
Tom Kopet
E. Flint Seaton
Shannon Shen, Ph.D.
David W. Still
Paul Vroomen
Vice President and Chief Financial Officer
Vice President, IC Technology
Vice President, IC Engineering
Array Microsystems has developed a complete line of processor and controller ICs, SRAM memory modules,
software simulators, and processor boards. The company's first product family, the a66, includes proprietary
VLSI chipsets, development tools, and array processor boards that set industry performance standards for
frequency domain processing. Array's two-chip video compression chipset, based on unique vector data
flow architecture, forms the core of the VideoFlow product family. One of the chips is called an image
compression coprocessor (ICC) and the other a motion estimation coprocessor (MEC).
1-38
Array Microsystems
North American Compa ny Profiles
Array Microsystems is a fabless IC supplier.
including Samsung and Atmel.
The company's devices are produced by other companies,
Key Agreements
• Array Microsystems signed a technology development pact with Samsung that provided Array with a
strong foundry partnership. The two companies codeveloped the initial VideoFlow video compression
technology. The deal provides Array with access to Samsung's advanced 0.5µm and 0.35µm CMOS fab
capacity for the manufacture of its products. In 1993, Samsung secured a 20 percent equity ownership
position in Array Microsystems, and in mid-1995, Samsung increased its stake to 37 percent with an
additional $4 million investment.
1-39
Atmel
ATMEL
Atmel Corporation
2125 O'Nel Drive
San Jose, California 95131
Telephone: (408) 441-0311
Fax: (408) 436-4200
Web Site: www.atmel.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
120
10
15
7
1992
140
14
18
14
1993
222
30
26
74
1994
375
59
43
183
1995
634
114
70
270
875
998
1,250
1,900
2,900
Atmel designs, manufactures, and markets a broad array of high-performance CMOS memory, logic, and
analog integrated circuits. Founded in 1984, the company serves the manufacturers of communications
equipment, computers, and computer peripherals as well as producers of instrumentation, consumer,
automotive, military, and industrial equipment. Much of Atmel's ICs are based on its proprietary non-volatile
memory technology. The company's name was derived from A dvanced technology: me mory and logic.
MCU
4%
ASIC
14%
EEPROM
24%
Analog
3%
Flash Memory
28%
EPROM/
Other Memory
27%
1-40
Japan
15%
North
America
44%
Asia
16%
Europe
25%
Atmel
Atmel is a leading supplier of EPROM, EEPROM, and flash memory components. Nevertheless, the
company is shifting its focus away from being primarily a memory company toward having a balanced
portfolio of memory and logic products. Still, the company hopes to continue expanding its share of the
memory market even as logic products take over a larger share of its production capacity.
Atmel has made several acquisitions over the past few years in support of its core product lines, nonvolatile
memory and logic ICs. The company bought out FPGA supplier Concurrent Logic in 1993, acquired Seeq
Technology's EEPROM product line in early 1994, and made a minority investment in SRAM producer
Paradigm Technology in 1995 in return for certain SRAM product rights.
The company’s most substantial acquisition came in April 1995, when it purchased a majority interest (75
percent) in the French IC manufacturer ES2. By the end of 1995, Atmel increased its ownership of the
company to more than 90 percent and renamed it Atmel-ES2. Atmel is expanding Atmel-ES2’s existing fab
facility and is constructing a new 0.35µm, 200mm wafer fab at the site that will be operational by 1997.
Management
George Perlegos
Gust Perlegos
Tsung-Ching Wu
Ralph Bohannon
Kris Chellam
Chih Jen
B. Jeffrey Katz
Krish Panu
Jack Peckham
Bernard Pruniaux
Mikes Sisois
Graham Turner
Vice President and General Manager
Vice President, Technology
Vice President, Asian Operations
Vice President, North American Sales
Vice President and General Manager, ASIC Operations
Vice President, Atmel-ES2 Operations
Vice President, Planning and Information Systems
Vice President, European Sales
Atmel's products are outlined below.
NonVolatile Memory ICs
• EPROMs—Standard, high-speed, and low-voltage parts ranging in density from 256K to 8M.
• EEPROMs—Serial-interface parts ranging in density from 1K to 64K.
—Parallel-interface parts ranging in density from 4K to 4M.
• Flash memories—Single voltage supply (5V or 2.7V) parts ranging in density from 256K to 4M.
Programmable Logic Devices and Field Programmable Gate Arrays
• PLDs—Generic PAL-type ICs including fast, low-power, and 3V flash-based versions of the standard
22V10, 16V8, and 20V8.
—Complex PLDs with densities to 5,000 gates.
• FPGAs—SRAM-based devices with 2,000 to 20,000 usable gates and very low power. Partial or full
reconfiguration, in system, during normal operation.
1-41
Atmel
ASIC Devices
• Gate arrays—High speed with up to 1.2 million routable gates.
• RFID ASICs—Analog, digital, and memory on a single-chip ASIC.
• Cell based ASICs—Mixed-technology.
Other Products
• Microcontrollers—Combine Intel's 80C51 core logic with 1K, 2K, 4K or 8K of Atmel's flash memory.
• Standard logic devices—Multimedia system, controllers/chipsets.
• Flash memory cards.
• Spread spectrum cordless phone chipset.
Atmel uses proprietary CMOS and BiCMOS technology for the processing of its chips. Most products are
produced with 0.8µm and 0.6µm line widths. The company's newest Colorado Springs fab facility is capable
of producing ICs with 0.4µm feature sizes.
Atmel Corporation
1150 East Cheyenne Mountain Boulevard
Telephone: (719) 567-3300
Fab 3
Wafer size: 150mm
Products: EEPROMs, EPROMs, flash memories,
PLDs, FPGAs, ASICs, MCUs, linear ICs
Atmel Corporation
1150 East Cheyenne Mountain Boulevard
Telephone: (719) 567-3300
Fab 5
Wafer size: 150mm
Process: CMOS
Products: EEPROMs, flash memories, EPROMs
Atmel-ES2
Zone Industrielle
13106 Rousset Cedex
France
Telephone: (33) (42) 33-40-0
Fab 6
Wafer size: 150mm
Process: CMOS
Products: Cell-based ASICs, MCUs
Atmel-ES2
Zone Industrielle
13106 Rousset Cedex
France
Telephone: (33) (42) 33-40-0
Fab 7
Wafer size: 200mm
Process: CMOS
Products: Cell-based ASICs, MCUs
(Scheduled to start production by the end of 1996)
Atmel maintains a facility for IC test and qualification at its headquarters in San Jose and assembly work is
performed offshore.
1-42
Atmel
Key Agreements
• Atmel and Paradigm Technology formed an alliance in May 1995 concerning Paradigm's SRAM products.
Atmel provides manufacturing capacity for Paradigm's SRAMs in exchange for product rights. Atmel also
purchased approximately 19 percent of Paradigm. The companies are developing new-generation
SRAMs with speeds below 8ns.
• Atmel-ES2 licensed from Advanced RISC Machines in mid-1995, the ARM7DMI 32-bit RISC processor
core and associated software tools.
• Atmel has a cross-licensing and product exchange agreement with Philips Semiconductors covering
several of each company's proprietary PLDs.
• Atmel established an agreement with Wireless Logic Inc. of Hong Kong in 1994 that calls for the
codevelopment and joint marketing of special-purpose DSP and microcontroller chipsets for the spreadspectrum wireless communications market.
• IBM Microelectronics licensed Atmel's FPGA technology in 1993. IBM also has rights to second source
versions of Atmel FPGAs (to date IBM has not exercised that right). Both companies will codevelop new
FPGAs.
• Fuji Film Microdevices and Atmel are collaborating in the development of flash memory-based products
such as ATA-interface memory cards.
1-43
Austin Semiconductor
AUSTIN SEMICONDUCTOR
Austin Semiconductor, Inc.
8701 Cross Park Drive
Austin, Texas 78754-4566
Telephone: (512) 339-1188
Fax: (512) 835-8358
Fabless IC Supplier
Sales
Employees
1993
7
1994
14
1995
19
60
110
114
Austin Semiconductor, Inc. (ASI) was founded in 1988 to supply high-reliability semiconductors and
microcircuit devices to the military and aerospace industries. In 1993, privately-held ASI acquired the Micron
Semiconductor Military Products Group, and now supplies standard memory chips to those industries.
The company's business is currently divided into two distinct groups: a custom product line and a standard
product line (consisting primarily of the former Micron products). At the end of 1995, about 70 percent of
ASI's business was in memory products, with the balance in custom products.
Management
Roger C. Minard
H. Donald Ludwig
Marty Lanning
Ed Walker
Vice President and General Manager, Operations
Director, Sales
ASI's standard IC products include: 64K to 16M DRAMs, 64K to 4M SRAMs, 1M VRAMs, and SCSI
interface processors. ASI also has the right to introduce military-grade versions of Micron's new products as
they are brought out.
ASI's custom product capabilities include testing and packaging of a wide array of custom memory products,
interface devices, and analog/digital communications products. ASI is also capable of manufacturing
devices using a silicon-on-sapphire (SOS) process. In 1996, DRAMs, SRAMs, EEPROMs, and flash
memories will be available.
1-44
Austin Semiconductor
ASI is a fabless IC supplier, but maintains a Class 100 assembly, packaging, and test facility on site. As part
of its purchase of Micron's military products group, ASI receives wafers from Micron. The firm also uses
other major manufacturers for the fabrication of its product wafers.
1-45
Benchmarq
BENCHMARQ MICROELECTRONICS
Benchmarq Microelectronics, Inc.
17919 Waterview Parkway
Dallas, Texas 75252
Telephone: (214) 437-9195
Fax: (214) 437-9198
Web Site: www.benchmarq.com
Fabless IC Supplier
Sales
Net Income
1994
23
2
Employees
1995
29
4
180
Benchmarq Microelectronics, founded in 1989, has a worldwide presence in the power-sensitive and
portable electronic systems marketplace. It provides integrated IC and module solutions that address realworld problems in managing battery-operated, low-power, and power-sensitive equipment. Benchmarq's
products are adopted by companies producing PCs, cellular phones, telecommunications equipment, and
portable electronics systems.
In 1995, international sales accounted for approximately 50 percent of total sales.
Management
Derrell Coker
Will Davies
Reginald McHone
Wallace E. Matthews
Jim Vernon
David Freeman
David Heacock
Loren Reifsteck
1-46
Vice President, Manufacturing Operations
Director, System Product Development
Director, Marketing and Corporate Communications
Director, Quality Technology and Assurance
North American Compan y Profiles
Benchmarq
Benchmarq's product portfolio consists of CMOS and BiCMOS mixed-signal circuits. The focus is on lowpower, battery-backed ICs and ICs for battery management. Geometries on its devices range from 0.8µm to
1.2µm.
Benchmarq’s IC product families include:
• Battery management ICs and modules that provide fast charge control, sophisticated battery
conditioning, and “gas gauge” capacity monitoring of many different types of battery-operated systems.
• Real-time clock ICs and modules, which provide highly integrated clock/calendar solutions for
microcomputer-based designs. The RTCs are available with 3V or 5V operation.
• Nonvolatile SRAM (nvSRAM) and PSRAM (nvPSRAM) ICs in densities ranging from 64K to 16M.
• Nonvolatile controller ICs and modules that provide power monitoring, write protection, and supply
switching to convert standard SRAM and a battery backup into a reliable, predictable nonvolatile memory.
The company is fabless, relying instead on domestic and overseas foundries for wafer fabrication. Burn-in
and test of ICs and value-added assembly of hybrid circuits is performed at the company's headquarters in
Texas.
1-47
Bit
BIT
Bit Incorporated
9400 Southwest Gemini Drive
Beaverton, Oregon 97008-7193
Telephone: (503) 520-1800
Fax: (503) 520-1700
Fabless IC Supplier
Employees
30
Bit Incorporated was originally established as Bipolar Integrated Technology, Inc. in 1983. As Bipolar
Integrated Technology, the company developed, manufactured, and marketed VLSI products for the highperformance computing and communications markets using proprietary bipolar ECL technology. However,
financial troubles forced the company to shut down its wafer fab in February 1993 and begin reforming itself
as a designer and supplier of specialized ICs for emerging networking and data communications markets.
In early 1995, the company began conducting business under its current name. Bit is currently developing
IC solutions for ATM and other LAN technologies.
It is also completing product development and
technology licensing deals with other semiconductor firms, which are expected to introduce ATM chips that
have been designed by Bit.
Management
Steven S. Hubbard
Louis Pengue
Bit's first product in a line of LAN communications ICs is the BN2002, a single-chip solution for an eight-port
Ethernet Switch.
1-48
Brooktree
BROOKTREE
Brooktree Corporation
9868 Scranton Road
Telephone: (619) 452-7580
Fax: (619) 452-1249
Web Site: www.brooktree.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends September 30
Sales
Net Income
R&D Expenditures
Employees
1991
83
10
18
1992
92
13
19
1993
111
28
23
1994
109
2
26
1995
138
13
28
536
540
568
578
607
Founded in 1981, Brooktree designs, develops, and markets high-performance digital and mixed-signal
integrated circuits for computer graphics, imaging, multimedia, communications, and automated test
equipment (ATE) applications.
In the past, Brooktree’s revenues had been heavily dependent on its graphics product line. However, since
1992, Brooktree has been busy transitioning its business focus toward highly integrated devices for the
communications, imaging, and multimedia markets. As a percent of total revenues, Brooktree’s graphics
business shrank to 36 percent in 1995 from 87 percent in fiscal 1992. Meanwhile, its communications
business grew from six percent to 26 percent during those years.
Multimedia
3%
ATE
15%
Imaging
18%
Graphics
36%
Communications
28%
1-49
Brooktree
With its newer communications and multimedia product lines, the company believes it is well positioned to
capitalize on the convergence of the business, entertainment, and computer industries.
Sales to foreign customers accounted for 52 percent of the company’s total revenues in fiscal 1995.
Management
James A. Bixby
Robert W. Zabaronick
Anthony C. D'Augustine
Phillip L. DenAdel
Pete R. Fowler
David C. Gelvin
Edward P. Holtaway
Stewart Kelly
David H. Russian
Jeffrey R. Teza
David G. Matty
Vice President, Graphics and Imaging Strategic Business Unit
Vice President, Worldwide Sales and Corporate Marketing
Vice President, Multimedia Strategic Business Unit
Vice President, Corporate Quality
Vice President, Communications Strategic Business Unit
Vice President, Technology and Business Development
Director, Research and Development
Brooktree’s product offering consists of digital and mixed-signal VLSI circuits that address four target
markets: computer graphics and imaging, communications, multimedia, and ATE.
Graphics and Imaging Products
The company’s principal graphics products are RAMDACs, which are an integration of static random
access memory (RAM), logic, and digital-to-analog converter (DAC) technology on a single integrated
circuit, and VideoDACs, which are stand-alone video-speed DACs. Brooktree’s graphics chips service
applications ranging from relatively low-resolution laptop computers to ultra-high resolution workstations.
Several of the company’s multimedia devices integrate RAMDAC technology.
Brooktree’s family of mixed-signal imaging ICs includes decoders for use in a range of applications such
as video capture in desktop and portable PCs, video conferencing, and video editing/authoring platforms,
and encoders for use in the emerging digital video consumer market, which includes digital broadcast settop boxes, CD interactive, and karaoke players. The company believes it holds approximately one-third of
the market share in the imaging IC business.
Communications Products
Brooktree's communications products target applications for high-speed voice, data, and video
transmission within wide-area network (WAN), metropolitan-area network (MAN), and local-area network
(LAN) environments.
Its current product lines for these applications include T1/E1 and T3/E3
framer/controllers, protocol controllers, HDSL (high-bit-rate digital subscriber line) devices, ATM
(asynchronous transfer mode) devices, ADPCM (adaptive differential pulse code modulation) devices,
and SMDS (switched multimegabit digital service) devices.
1-50
Brooktree
Multimedia Products
In October 1994, Brooktree announced its first multimedia product, the BtV MediaStream media
accelerator, which combines hardware and software to optimize audio, graphics, and full-motion video
performance in a wide range of PC applications for the home and office. In the fourth quarter of calendar
1995, Brooktree announced the BtV 3D MediaStream media accelerator as a pin-compatible upgrade for
the earlier 2D version. The 3D MediaStream accelerator incorporates such advanced features as
perspective correct texture mapping and Z-buffer depth cueing to target the emerging segment of
consumer entertainment PCs that feature 3D capabilities. The BtV media accelerators are fully-integrated
chipsets consisting of four chips, the MediaStream controller, an audio I/O subsystem, a videostream
decoder, and a packetized data DAC (PACDAC).
To complement the industry-standard synthesis of the BtV audio stream, Brooktree also provides a
software-based wavetable synthesis solution, called WaveStream.
ATE Products
In 1994, Brooktree announced that its long-term strategic plans would not include the development of
new ATE products. The company discontinued the development of future ATE products but continues to
market its existing devices for ATE applications.
A significant percentage of Brooktree’s products are currently based on 0.8µm CMOS process technology.
New product designs are based on 0.6µm CMOS technology, and the company expects that by mid-1997,
all new designs will be at the 0.35µm level. Some of the company’s products, predominantly in its ATE and
certain graphics product lines, utilize bipolar technology.
Brooktree's advanced mixed-signal technology can be manufactured using standard semiconductor wafer
fabrication and device assembly processes. The company currently relies on outside sources for the
fabrication of its CMOS and bipolar wafers and the assembly of its ICs, while design and test are handled
internally.
To help ensure continued wafer supply, Brooktree strengthened its manufacturing alliances in 1994 and
1995.
The company announced long-term supply arrangements with Chartered Semiconductor
Manufacturing of Singapore, Seiko Epson of Japan, and TSMC of Taiwan (see Key Agreements).
Brooktree was notified in 1994 by its primary suppliers of bipolar wafers that they would be discontinuing the
manufacture of such wafers. The company was given last-time-buy notices that were good through the
middle of 1996.
1-51
Brooktree
Key Agreements
•
In October 1995, Brooktree entered two agreements with Taiwan’s TSMC which grant the company
options to obtain an additional supply of wafers through the year 2000. Brooktree has said it may make
prepayments to TSMC in 1996 and 1997 totaling about $59 million, in return for discounts on future
200mm wafer purchases.
•
In August 1994, Brooktree agreed to pay Seiko Epson $47 million to assist the Japanese company in the
expansion of its advanced submicron wafer fab. In consideration for the payment, Seiko agreed to
provide Brooktree a guaranteed minimum supply of wafers.
•
Brooktree invested approximately $11 million in Chartered Semiconductor in February 1994 to obtain a
minority equity position in Chartered and receive guaranteed foundry capacity for 0.5µm, 200mm wafers.
•
Brooktree linked up with DEC in 1994 to jointly develop and market a family of graphics chips for the highperformance desktop and workstation markets.
1-52
Burr-Brown
BURR -BROWN
Burr-Brown Corporation
P.O. Box 11400
Tucson, Arizona 85734-1400
Telephone: (602) 746-1111
Fax: (602) 889-1510
Web Site: www.burr-brown.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
1991
179
(10)
20
12
1992
163
1
18
5
1993
169
3
20
7
1994
194
6
22
12
1995
269
29
26
18
Employees
1,649
1,566
1,547
1,825
1,900
Founded in 1956, Burr-Brown Corporation is primarily engaged in the design, manufacture, and marketing of
a broad line of proprietary standard high-performance analog and mixed-signal ICs used in the processing of
electronic signals. The company also integrates its ICs into system components including PC data
acquisition and signal processing products, data collection systems, and data entry terminals. Applications
that Burr-Brown's products target include:
industrial control and automation; precision test and
measurement equipment; telecommunications systems; medical and scientific instrumentation; medical
imaging; digital audio and multimedia; electronic musical and professional audio equipment; and computers
and peripherals.
Burr-Brown is moving away from its traditional focus on older IC processing technologies—primarily linear
bipolar—and instead going in new directions such as CMOS and BiCMOS technologies. The company has
also been strategically shifting some of its production to outside foundries, a trend that is expected to
continue in order to put a cap on internal production costs.
In early 1996, Burr-Brown sold its interest in Power Convertibles Corporation (PCC). PCC formerly a majorityowned affiliate of Burr-Brown, manufactures DC-to-DC converters and battery charges used in cellular
telephone applications. Burr-Brown will continue to focus on its analog and mixed-signal IC business.
In 1995, Burr-Brown set new directions for its foreign operations. Burr-Brown’s Japanese subsidiary is now
concentrating exclusively on the digital audio market, while the company’s Livingston Scotland operations
have been re-directed from subcontract manufacturing to in-house product R&D.
1-53
Burr-Brown
Power
Conversion
Products*
10%
Other
6%
Analog ICs
42%
Europe
29%
Data Conversion ICs
42%
North America
36%
Asia
35%
*Sold its affiliate that produced
these products in early 1996.
PC/Multimedia
6%
Telecom
12%
Test and
Instrumentation
24%
Consumer*
29%
Industrial
29%
*Digital Audio and Video
1995 Sales by Application
Management
Syrus P. Madavi
John L. Carter
Michael M. Pawlik
Paul Prazak
Robert E. Reynolds
Bryan Rooney
R. Mark Stitt
Charles Lewis
Toshiyuki Yamasaki
Executive Vice President and Chief Financial Officer
Vice President, Data Conversion Division
Vice President, Worldwide Sales
Vice President, Linear Division
General Manager, Scotland Division
President, Japan Operations
Burr-Brown's product portfolio includes operational, instrumentation, power, and isolation amplifiers,
optoelectronic ICs, digital audio devices, digital-to-analog and analog-to-digital converters, data
communications products, LAN products, microterminals, design and development software, and board-level
microcomputer subsystems. The company’s products are manufactured using processes that include
bipolar, complementary bipolar, CMOS, and BiCMOS.
1-54
Burr-Brown
The following describes the various processes that Burr-Brown utilizes in the manufacture of its ICs.
40 Volt Bipolar Process:
This is a high-voltage (40V) bipolar process (±15V or 36V power supplies) used to make high-voltage
operational and instrumentation amplifiers. High precision in these products is made possible by the
capability of ion implanted JFETs and trimmable resistors. Other typical products made from this process
are universal active filters, isolation amplifiers, and high-voltage power amplifiers.
20 Volt Bipolar Process:
This is a lower voltage (20V) bipolar process especially suited for data acquisition and PCM components.
These are faster circuits utilizing smaller devices with lower Rc. Trimmable resistors allow high precision
products.
Dielectrically Isolated Bipolar Process:
This is a dielectrically isolated high-voltage bipolar (40V) process used for low noise, high precision, and
low drift. Very high-performance amplifiers are built using this process where the noise and drift
characteristics are important, especially in the medical equipment markets that it serves.
Complementary Bipolar Dielectrically Isolated Process:
This is a dielectrically isolated process with complementary NPN and PNP bipolar transistors. It is used to
manufacture high-voltage operational amplifiers, voltage-to-frequency converters, and sample/hold
circuits.
CMOS Double-Level Metal Poly-Poly Process:
This is a 3.0µm double-level metal CMOS process which also makes use of parasitic bipolar devices. This
is a ±5V process with compatible thin film resistors and very high quality poly-poly capacitors. It produces
high density, high precision (16-bit and 18-bit) single and dual analog-to-digital and digital-to-analog
converters.
BiCMOS Process:
This double-poly, double-metal 3.0µm process is optimized for analog circuitry including critical thin-film
resistor capability. The process is primarily used for data conversion products.
Processes not available internally are sourced from various foundries, including Mitel Semiconductor, Oki,
Hualon Microelectronics, and Taiwan Semiconductor Manufacturing Co. (TSMC). Such processes include
2.0µm, 1.2µm, and 0.6µm BiCMOS and CMOS processes, and a very high-frequency bipolar process for
products such as video amplifiers.
1-55
Burr-Brown
Burr-Brown Corporation
6730 South Tucson Boulevard
Tucson, Arizona 85706
Capacity (wafer/week): 4,200
Wafer size: 100mm (Planning conversion to 150mm wafers)
Processes: CMOS, Bipolar, BiCMOS
Products: Digital and linear ICs, monolithic and hybrid assembly
Burr-Brown has IC assembly facilities in Tucson and Scotland. The company also incorporated multichip
module (MCM) assembly capability in its Tucson facility in 1995.
Key Agreements
• In 1995, Burr-Brown signed a foundry agreement with TSMC.
using 0.6µm technology for Burr-Brown.
TSMC will produce advanced products
• Burr-Brown is jointly developing with Oki 20-bit BiCMOS A/D and D/A converter chips for business digital
audio equipment.
1-56
C-Cube Microsystems
C-CUBE MICROSYSTEMS
C-Cube Microsystems Inc.
1778 McCarthy Boulevard
Milpitas, California 95035
Telephone: (408) 944-6300
Fax: (408) 944-6314
Web Site: www.c-cube.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1991
6
(8)
6
1992
14
(5)
7
Employees
1993
24
(1)
7
1994
45
5
10
1995
124
25
14
112
140
165
Founded in 1988, C-Cube Microsystems is a provider of highly integrated, standards-based, programmable
digital video and still image compression products and systems. The company's innovative encoder,
decoder, and codec products bring full motion video and still image capabilities to a broad range of enduser products in the consumer electronics, computer, and communications markets. Such products include
video CD players, interactive game equipment, and computer add-in cards that allow full-motion video,
desktop video conferencing systems, interactive digital cable TV systems, and direct broadcast satellite
(DBS) systems.
In 1995, C-Cube acquired Media Computer Technologies (MCT), a supplier of PC-based digital video
processing and video-windowing technology. As a subsidiary of C-Cube, MCT will be responsible for
developing ASICs, reference designs, application software, and contributing to development projects of CCube’s PC customers.
U.S.
30%
International
70%
1-57
C-Cube Microsystems
Management
Alexandre A. Balanski, Ph.D. President and Chief Executive Officer
Mark K. Allen
James G. Burke
Brian T. Conners
Alex Daly
Richard Foreman
Vice President and Chief Information Officer
Sai-Wai Fu
Vice President, Hardware Engineering
Didier Le Gall, Ph.D.
Richard S. Rasmussen
Vice President and General Manager, JPEG Division
Senjeev Renjen, Ph.D.
Vice President, Decoder Engineering
C-Cube's single-chip and chipset products include: MPEG 1 video and audio/video encoders and decoders
for consumer electronics applications; highly integrated MPEG 1 video and audio/video decoders, JPEG
codecs, multistandard codecs, video conferencing codecs, and multimedia video processors for computer
applications; and MPEG 2 video encoders and decoders and MPEG 2 transport demultiplexers for
communications applications.
The company also markets a line of design example boards and
demonstration systems products.
C-Cube’s IC products are currently manufactured using two- or three-layer metal CMOS process technology
with 0.8µm, 0.65µm, and 0.5µm feature sizes. New products are being designed with 0.35µm technology.
Semiconductor Fab Facilities
C-Cube does not manufacture its own ICs; it uses independent foundries. The company’s principal IC
foundry is Texas Instruments. Other foundry partners include Matsushita, Yamaha, TSMC, and Samsung.
AMD is also a foundry partner, but it is not presently manufacturing products for C-Cube. Assembly, test,
and packaging of its devices is also subcontracted to third parties.
Key Agreements
•
In October 1995, C-Cube licensed Sun Microsystems’ MicroSparc processor core technology for use in a
multifunction chip, to be introduced in 1997, intended for digital compression and decompression.
•
C-Cube entered into an agreement with Matsushita, JVC, and Sharp to jointly develop MPEG 1 and
MPEG 2 decoders. Matsushita also provides C-Cube with preferential access to its 0.5µm and 0.35µm
manufacturing processes. In return, Matsushita has the rights to use and sell a limited amount of the
decoders.
•
C-Cube has an agreement with TI under which TI provides C-Cube with foundry services in exchange for
access to its core technology for use in creating derivative products. In addition, C-Cube has access to
TI’s MPEG audio decoding technology on a reciprocal basis. C-Cube has a similar agreement with AMD.
1-58
California Micro Devices
CALIFORNIA MICRO DEVICES (CMD)
California Micro Devices Corporation
215 Topaz Street
Milpitas, California 95035-5430
Telephone: (408) 263-3214
Fax: (408) 942-9505
IC Manufacturer
Financial History* ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Employees
1992
22
(0.3)
2
1993
30
1
4
1994
27
(7)
3
1995
36
(31)
4
1996
40
5
3
204
247
273
229
240
*Financial history has been adjusted to reflect a change in fiscal year from ending in June to ending in
March.
Founded in 1980, California Micro Devices (CMD) is a designer, manufacturer, and marketer of integrated
passive electronic component (IPEC™) products and analog and mixed-signal integrated circuits. The
company's IPECs, built using its silicon-based thin film materials and process technology, integrate multiple
passive elements onto a single integrated circuit. They address resistor, resistor network, and capacitor
applications in computers and communications equipment. The company's analog and mixed-signal ICs are
designed primarily for telecommunications applications.
Recently, the company’s product mix has shifted toward thin film products, which accounted for 64 percent
of sales in 1995. The company is also developing a new line of products referred to as P/Active circuits.
This new product line will combine CMD’s thin film technology with active semiconductor components and
techniques to create enhanced passive networks called applications specific passive networks (ASPNs).
1-59
Auto
2%
Military
2%
Medical
4%
Instruments
6%
Other
4%
PCs/Peripherals
36%
Workstations
16%
Communications
30%
International
33%
North America
67%
1995 Sales by Region
Management
Jeffrey C. Kalb
Bob Filiant
P.R. "Hari" Hariharan, Ph.D.
Richard W. Helfrich
Rao R. Penumarty
Basker B. Rao, Ph.D.
Arieh Schifrin
John E. Trewin
Vice President and General Manager, Milpitas Operations
Vice President and General Manager, Tempe Operations
CMD's thin film products include precision resistors, resistor networks, capacitors, capacitor networks, resistorcapacitor networks, resistor-capacitor-diode networks, and IPEC products.
The company's analog and mixed-signal integrated circuits include data communications and interface
devices, as well as telecommunication dual tone multi-frequency (DTMF) receiver and transceiver products.
These products are used in personal computers, answering machines, telephones, and switching systems.
They are manufactured in 1.25µm through 3.0µm BiCMOS and CMOS processing technologies.
CMD also offers the use of its fabrication facilities as a foundry and test service.
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Microcircuits Division
2000 West 14th Street
Tempe, Arizona 85281
Telephone: (602) 921-6000
Wafer size: 125mm
Processes: CMOS (SM/DP, DM/SP, DM/DP);
BiCMOS (SM/DP, DM/DP)
Products: Linear and mixed-signal ICs, thin film
devices, foundry services
Feature sizes: 1.25µm-3.0µm CMOS;
1.25µm, 1.5µm BiCMOS
215 Topaz Street
Wafer size: 100mm
Products: Thin film discretes
Key Agreements
• California Micro Devices has a comprehensive strategic alliance with Hitachi Metals, Ltd. (HML), a
subsidiary of Hitachi, Ltd., that involves joint IPEC product development, manufacturing, marketing, and
worldwide distribution. Also under the alliance, HML purchased a 10 percent stake in CMD.
1-61
Calogic
CALOGIC
Calogic Corporation
237 Whitney Place
Fremont, California 94539
Telephone: (510) 656-2900
Fax: (510) 651-3025
IC Manufacturer
Employees
105
Calogic is a privately held company, founded in 1983. The company offers a line of standard and full
custom semiconductor products made using several technologies including CMOS/DMOS and bipolar. Its
product line is specifically designed for high-performance applications. The company strives to form
relationships with its customers by offering technical expertise from design to processing to final test.
Management
Manny Del Arroz
Charlie Bevivino
Brenda Hill
President
Director, Sales
Director, Marketing
Calogic offers bipolar standard products (e.g., switches, multiplexers, and op amps) and CMOS, DMOS, and
JFET full custom ICs. Calogic acquired a small signal discrete line from Harris and now offers one of the
broadest small signal FET product lines in the industry. In addition, Calogic offers its production facilities as a
foundry service.
CRT Related Products:
CRT driver amplifiers (30MHz to 185MHz)
Pre-amplifiers
Buffers
Video Products:
Widebank buffers and amplifiers
Instrumentation Products:
Op amps
References
Analog switches
Full Custom and Semicustom Capabilities:
Design, layout, manufacturing, and test
1-62
Calogic
Discretes:
High-speed lateral DMOS FET switch and switch arrays (switching speeds under 1ns)
Vertical MOS FET switches
JFETs
MOSFETs
Diodes
Calogic’s process technologies include a dielectrically isolated (DI) complementary bipolar process, a high
frequency (1GHz), low-noise bipolar process, and a medium-voltage, medium-frequency, bipolar process for
supply voltages up to ±20 volts.
Calogic Corporation
237 Whitney Place
Wafer size: 100mm
Processes: CMOS, DMOS, bipolar
Products: ASICs (gate arrays, full custom ICs); peripheral, linear, and logic ICs; discretes
1-63
Catalyst
CATALYST S EMICONDUCTOR
Catalyst Semiconductor, Inc.
2231 Calle de Luna
Telephone: (408) 748-7700
Fax: (408) 980-8209
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
Employees
1992
29
(7)
7
1993
33
(2)
5
1994
54
(22)
7
1995
49
2
7
1996
60
n/a
9
100
90
60
60
65
Catalyst Semiconductor, established in 1985, designs, develops, and markets a broad range of nonvolatile
memory IC products that have applications in the computer, wireless communications, network, automotive,
and instrumentation markets.
The company's strategy is to become a leading supplier of flash memory devices while maintaining its
position as a leading supplier of EEPROM products.
Management
C. Michael Powell
Chris Carstens
Heber Clement
Irvin Kovalik
Alan Renninger
Radu Vanco
Donald Witmer
Mike Shamshirian
1-64
Vice President, Quality and Reliability
Director, Marketing
Catalyst
Catalyst's family of nonvolatile devices includes flash memories (1M, 2M, and 4M), serial EEPROMs (1K to
16K), parallel EEPROMs (16K to 256K), battery-backed SRAMs, and NVRAMs (i.e., shadow RAMs and
devices that combine EEPROM with SRAM). Catalyst also offers a line of BiCMOS data converters and
other specialized products such as its application-specific electrically erasable devices (ASEEDs™).
Most of the company's products are designed and manufactured using a 1.2µm CMOS EEPROM process
or a 0.7µm flash memory process. Catalyst's 4M flash memory ICs are based on a 0.7µm process and its
16M parts will use a 0.5µm process. The 4M and 16M devices are a result of a joint-development
agreement between Catalyst and Oki.
Through the establishment of long-term licensing agreements, Catalyst has contracts with Oki, Seiko Epson,
Chartered Semiconductor, and Newport Wafer-Fab Ltd. (Wales, U.K.) for the fabrication its devices.
Key Agreements
• In 1996, Catalyst announced an agreement with United Microelectronics Corp. (UMC). As part of the
agreement, UMC will take a 10 percent equity stake in Catalyst and will provide significant wafer foundry
capacity. Also, UMC and Catalyst will jointly develop 0.5µm and 0.35µm process technologies, geared for
flash memory products. The first 0.5µm flash devices are expected to be available in 4Q96.
• In November 1995, Catalyst signed a cross-licensing agreement with Intel.
Catalyst with the right to utilize all of Intel’s flash memory patents.
The agreement provides
• Catalyst signed on Wales, U.K.-based Newport Wafer-Fab Ltd. in May 1995 for the manufacture of its
EEPROMs and for process technology development.
• Catalyst formed an alliance with Zilog that calls for the joint development of 20M and 40M 2.5-inch solidstate disk drives merging Catalyst's flash memory devices with Zilog's compression and controller
technology. The two companies are also developing other devices combining flash and microcontroller
technology.
1-65
Cherry Semiconductor
CHERRY SEMICONDUCTOR
Cherry Semiconductor Corporation
2000 South County Trail
East Greenwich, Rhode Island 02818-0031
Telephone: (401) 885-3600
Fax: (401) 885-5786
IC Manufacturer
Financial History ($M), Fiscal Year Ends February 28
1992
1993
1994
1995
1996
229
5
266
10
275
11
339
15
425
11
36
3
1
45
5
4
56
7
7
75
11
17
99
5
20
415
450
500
550
975
Corporate
Sales
Net Income
Semiconductor
Sales
Net Income
Employees
Formed in 1972 as Micro Components Corporation, Cherry Semiconductor originally manufactured linear
bipolar ICs with a focus on the photography market. In 1977, MCC was acquired by The Cherry Corporation
and renamed Cherry Semiconductor Corporation (CSC). The market orientation of CSC began to include
more automotive business as the photo market began to sag. In 1985, the company committed to two
major market focuses: automotive and computer. Within these two markets, CSC focused further on four
applications areas: dedicated automotive, power supply control, motor control, and memory management
(high-performance disk drive circuits). In 3Q95, CSC was reorganized into three business groups:
automotive OEM, automotive electronics, and computer and industrial.
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Cherry Semiconductor
Europe
5%
Telecom
16%
Computer
16%
Asia-Pacific
14%
Automotive
68%
1996 Semiconductor Sales
by End-Use Market
United States
81%
by Geographic Region
Management
Alfred S. Budnick
Andrew F. Durette
Walter E. McMann
President, Cherry Semiconductor
Executive Vice President
Vice President, Finance and Administration
Cherry Semiconductor designs and builds standard linear ICs and semicustom and full-custom ICs (ASICs).
The company’s automotive ICs are most often custom designs, while its standard ICs are usually targeted at
the computer market.
CSC developed its high-performance PowerSense™ BiCMOS process for automotive circuits. It is a mixedsignal process that allows analog power functions and compact digital logic to be combined on a single chip.
It uses 15 masks and has five critical alignments. In addition, CSC has developed a 16-volt BiCMOS
process for disk drive applications and a 2.5MHz bipolar process for computer applications. The firm’s
bipolar processes feature vertical and lateral PNP transistors, up-down isolation, and low leakage diodes.
Cherry Semiconductor Corporation
2000 South County Trail
East Greenwich, Rhode Island 02818
Processes: Bipolar, BiCMOS
Products: Linear ICs and ASICs
Key Agreements
• Cherry Semiconductor is working with Motorola to develop ASICs for the automotive industry.
companies struck their first agreement in the late 1980's.
The two
1-67
Chip Express
CHIP EXPRESS
Chip Express Corporation
2903 Bunker Hill Lane, Suite 105
Telephone: (408) 988-2445
Fax: (408) 988-2449
Web Site: www.elron.net:80/chipx
Fabless IC Supplier
Sales
Employees
1994
10
1995
18
80
110
Chip Express started its operations in 1990 when it was spun out from Elron Electronics Industries Ltd. (an
Israeli high technology holding company). The company offers complete time-to-market ASIC solutions
featuring three high-performance gate array families. The first product, the laser personalized gate array
(LPGA), is used for fast prototyping and emulation of gate arrays. The LPGA can be delivered to the
customer in 24 hours. The second product, the OneMask® Gate Array is intended for low volume production
requirements. OneMask devices can be delivered in one week. Finally, the HARD Array® family of products
offer cost competitive high-volume gate array production that can be ready to deliver in one month. The
company has over ten patents for the laser programming machine, called the QuICk® System, the laser
personalizing architecture, and other proprietary design tools. Chip Express’ gate array libraries support
popular CAE platforms such as Synopsys, Cadence, and Viewlogic.
Management
Zvi Or-Bach
Howard Brodsy
Paul Indaco
Uzi Yoeli
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Chip Express
Chip Express offers ASICs from prototype to production. The company uses CMOS processes with
geometries of 1.0µm, 0.8µm, and 0.65µm in double and triple layer metal.
Chip Express provides prototyping and production services with on-site manufacturing. The company has a
37,000 square foot facility that provides gate array prototyping and low volume production services. The
laser-based QuICk System operates in a computer room environment. The QuICk System enables the
personalization of one die at a time. Chip Express uses base arrays that are manufactured by international
gate array vendors and are compatible with their gate array families. In order to personalize the devices,
predefined links are disconnected by the laser. Thus, in a single operation, with 16,000 cuts per second, the
QuICk System disconnects the predefined links of multi-layer metal gate arrays. A real time computer and
image processing system use the Cut-List to control the automatic laser cutting process. The prototype is
personalized in a self-contained Class 100 laminar air flow cell.
The OneMask operation for low volume production operates in a cleanroom environment, processing one
wafer at a time, in a single etch step.
Chip Express presently offers arrays of up to 80,000 gates. By the end of 1996, the company will introduce
its new module array architecture, the CX2000 family, with up to 225K gates, plus 128K of RAM.
The company has strategic alliances with three wafer foundries: Seiko Epson (Japan), Tower Semiconductor
(Israel), and Yamaha (Japan).
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Chips and Technologies
CHIPS AND T ECHNOLOGIES
Chips and Technologies, Inc.
2950 Zanker Road
Telephone: (408) 894-0600
Fax: (408) 894-2085
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends June 30
Sales
Net Income
R&D Expenditures
Employees
1991
225
(10)
53
1992
141
(64)
46
1993
98
(49)
23
1994
73
3
12
1995
105
9
13
595
400
220
180
185
Founded in 1984, Chips and Technologies (also known as Chips) supplies advanced semiconductor devices
to the worldwide personal computer industry. The company has a product portfolio that includes display
controllers, graphics accelerators, video devices, communications ICs, and system logic chipsets. These
products are built into a wide range of systems from compact portables to high-performance desktop
computers.
Chips' system logic chipset business has fallen from representing 87 percent of total revenues in fiscal 1989
to 25 percent in 1995. The focus of Chips is now on fewer, more profitable products, with resources directed
toward single chip systems for emerging markets such as graphics controllers for notebook PCs. Future
plans are to move beyond graphics, core logic, and I/O to add multimedia products, as well as more
communications-related devices.
I/O
10%
Logic
25%
Graphics
65%
1-70
Asia and Europe
47%
North America
53%
Chips and Technologies
Management
James F. Stafford
Morris E. Jones, Jr.
Keith Angelo
Lee J. Barker
Timothy R. Christofferson
Richard E. Christopher
Scott E. Cutler, Ph.D.
Lawrence A. Roffelsen
Tom Erjavac
Senior Vice President and Chief Technical Officer
Vice President, Software Technology
Director, Marketing
Chips' product line includes CRT and flat-panel graphics controller ICs, graphical user interface (GUI)
accelerators, PC video circuits, I/O and peripheral controllers, and system logic chipsets. The company's
LCD controllers have been well received by makers of industry-leading products in the laptop, notebook, and
sub-notebook industries.
The firm's integrated circuits are built using bipolar, BiCMOS, and CMOS processes with geometries of
1.0µm to 2.0µm.
Chips and Technologies uses subcontractors for the fabrication and assembly of its semiconductor
components. Currently its foundry partners include Chartered Semiconductor, IBM, NEC, Samsung, and
TSMC.
Key Agreements
•
Chips and Technologies signed a production agreement with Chartered Semiconductor. Under the
agreement, Chips will make $20 million installments over the next year to Chartered in exchange for
guaranteed production capacity support of 200mm wafers through 2000.
1-71
Cirrus Logic
CIRRUS LOGIC
Cirrus Logic, Inc.
3100 West Warren Avenue
Fremont, California 94538-6423
Telephone: (510) 623-8300
Fax: (510) 226-2240
Web Site: www.cirrus.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1992
218
17
42
1993
355
21
73
1994
557
45
127
1995
889
61
166
1996
1,147
(36)
239
973
1,353
1,854
2,331
3,500
Cirrus Logic, founded in 1984, is a leading supplier of proprietary integrated circuits and related software for
multimedia (graphics, video, audio), wireline and wireless communications, magnetic hard disk and CD-ROM
storage, and data acquisition in desktop, portable, and handheld computing systems, as well as in
telecommunications and consumer electronics. Cirrus Logic targets emerging high growth markets as well
as large existing markets that are undergoing major product or technology transitions.
The primary focus is personal computers, a market which is transforming rapidly as PCs evolve from word
processing and spreadsheet tools into high performance communications and multimedia computing
platforms. Cirrus Logic is also applying its core technologies to emerging digital wireless communications
and digital audio and video consumer markets. Cirrus Logic serves most of the major disk drive
manufacturers as well as several multimedia and video conferencing equipment suppliers.
Communications/
Wireless
15%
Mass Storage
15%
Other
10%
Graphics
60%
1995 Sales by End-Use Market (est)
1-72
Cirrus Logic
Cirrus Logic has pursued a strategy of developing or acquiring key technologies and systems expertise to
provide complete software-rich integrated solutions for its customers. The company has made substantial
R&D investments and has completed several technology related acquisitions, including Pixel Semiconductor,
Inc. (1991), Crystal Semiconductor Corporation (1991), Acumos Inc. (1992), Pacific Communication
Sciences, Inc. (1993), PicoPower Technology, Inc. (1994), the 3D graphics chip technology of Austek
Microsystems (1994), and the graphics and disk interface IC businesses of Appian Technology (1994).
These efforts have broadened Cirrus Logic's technology base to include mixed-signal design, digital audio,
graphics acceleration, modulation/demodulation algorithms, and digital wireless communications.
Until fiscal year 1996, Cirrus Logic was profitable each year since its IPO (1989). However, blaming weak
market conditions, a transition to new products, manufacturing difficulties, and an $11.6 million net loss in
charges related to the layoff of 455 employees and restructuring within the company, Cirrus Logic’s net
income was a negative $36 million during the 1996 fiscal year. As a result of its losses, Cirrus Logic planned
to sell or spin off three product lines within its Visual and Systems Interface (VSys) subsidiary and will then reform VSys into a graphics-only enterprise. Among the divestitures is PicoPower Technology, which was
purchased in 1994 but no longer fits with the central direction on the company. Cirrus Logic has pared
about 20 other projects across the company as part of an ongoing effort to focus on three main markets:
multimedia (2D/3D graphics/video and high-integration audio), communications (high-speed modems for fax,
data, and Internet access), and mass storage (both hard disk and CD-ROM).
Approximately 55 percent of Cirrus Logic's revenues come from sales in countries other than the U.S.
Management
Michael L. Hackworth
Suhas S. Patil
Michael L. Canning
William W.Y. Chu
James H. Clardy
Robert V. Dickson
David L. Lyon
George N. Alexy
William D. Caparelli
Kenyon Mei
C. Sena Reddy
Sam S. Srinivasan
William H. Bennett
Halappa Ravindra
Executive Vice President, Products and Technology
President, Mass Storage Products Company
President, Graphics Company
President, Crystal Semiconductor Corporation
President, Graphics Company
President, Pacific Communications Sciences, Inc. (PCSI)
Senior Vice President, Marketing
Senior Vice President, Worldwide Sales
Senior Vice President and GM, Personal Systems Business Unit
Senior Vice President, Manufacturing
Senior Vice President, Finance and Administration, CFO, Treasurer, Secretary
Graphics
Cirrus Logic offers a broad range of graphics products. The company is a leading supplier of VGA and
Super VGA graphics controllers for both CRT and LCD displays. Cirrus also offers GUI accelerators and
3D graphics accelerators. In 1995, it was the first to offer high-performance LCD graphics controllers that
integrate 2D graphics and video playback on a single chip.
1-73
Cirrus Logic
Multimedia
Cirrus Logic offers a wide variety of audio and video products through its Crystal Semiconductor and
Pixel Semiconductor subsidiaries.
The company is a leading supplier of 16-bit stereo codecs for PCs, using delta sigma technology to
provide high quality audio and offering SoundBlaster, AdLib, Yamaha synthesis, and Microsoft business
audio compatibility. The company also provides audio decompression and wave-table sound/music
synthesis chips for the PC market, and audio products used in consumer products such as digital audio
tape and digital compact cassettes, as well as in broadcast and automotive applications.
Through its Pixel Semiconductor subsidiary, the company offers real-time digital video processing
products for desktop PCs, video conferencing systems, and workstations. Its most advanced video
processors can handle up to four video streams simultaneously.
Wireline Communications
Cirrus Logic introduced the industry's first two-chip intelligent fax/data/voice modem in 1992, and offers a
more recent three-chip high performance version. The company is also an innovator in providing serial
and parallel I/O devices for multi-channel, multi-protocol communications.
Through its Crystal Semiconductor subsidiary, the company is a leading supplier of monolithic T1/E1 line
interface circuits, CMOS Ethernet LAN line interface circuits, and infrared (IR) interface circuits.
Its PCSI subsidiary supplies the Clarity series of wide area network system products.
Wireless Communications
Cirrus Logic, through its PCSI subsidiary, is a leader in the development of Cellular Digital Packet Data
(CDPD) technology, offering base stations and subscriber units. The company also provides chips for
digital cordless telephones operating in the 1.9GHz range, and is supplying chipsets for the U.S. IS54
digital cellular telephone market.
Mass Storage
Cirrus logic is a leading supplier of chips that perform the key electronics functions contained in
advanced disk drives. Controllers are offered for the AT (IDE), PCMCIA, SCSI, and high-speed SCSI2
standards. Cirrus Logic began offering read-write electronics for disk drives in 1993, and was the first
supplier to provide PRML data-detection technology in its ICs. The company recently introduced a pair
of hard-drive controller chips featuring "ID-less" technology that it claims can add up to 10 percent to the
capacity of a hard-disk drive.
Power-Managed System Logic
Cirrus Logic's acquisition of PicoPower Technology provided it with advanced power-saving system
controllers and core logic chipsets for personal computers and portable and mobile electronics products.
Despite the success of PicoPower Technology, it may be spun off or put up for sale during 1996 (see
Company Overview and Strategy).
1-74
North Americ an Company Profiles
Cirrus Logic
Data Acquisition
Through its Crystal Semiconductor subsidiary, Cirrus Logic has established a broad line of analog-todigital converters consisting of general-purpose and low-frequency measurement devices. The family
includes more than twenty products used in industrial automation, instrumentation, medical, military,
and geophysical applications.
The majority of Cirrus Logic's IC products are manufactured using 0.8µm, double-layer-metal CMOS and
0.6µm, triple-layer-metal CMOS process technologies, although some use other CMOS processes (high and
low voltage), while others use BiCMOS or GaAs processes (for RF chips).
Cirrus Logic currently procures the majority of its wafers from outside wafer suppliers (about ten of them). In
1994, Cirrus Logic made a move to abandon its completely fabless approach by forming a joint venture with
IBM to manufacture ICs for both companies at one of IBM's East Fishkill, New York, fab facilities. The
venture is operating as a separate company, named MiCRUS (see Key Agreements).
In late 1995, Cirrus Logic announced a program to invest approximately $2 billion over a five-year period to
build and develop its manufacturing infrastructure. The program emphasizes both fab ownership and
foundry relationships that target 0.35µm and 0.25µm process capabilities.
The initial phase of the program was to commit additional money to the expansion of MiCRUS, and the
formation of a new joint venture with Lucent Technologies (formerly AT&T Microelectronics). Slated to begin
production in early 1997, the new joint venture will operate within an existing Lucent Technologies wafer fab
in Orlando, Florida. The fab will be 40 percent owned by Cirrus Logic and 60 percent by Lucent
Technologies. The two firms will equally split the production output, which will focus on 0.35µm and 0.25µm
processing on 200mm wafers.
Cirrus Logic also unveiled manufacturing partnerships with UMC and TSMC, as part of its multi-billion dollar
manufacturing investment plan. Under a foundry venture agreement with UMC and two other U.S.
semiconductor companies, a new company, United Silicon, Inc., will be formed. Production at the new fab is
scheduled to commence in 1997. Meanwhile, Cirrus Logic will expand its current relationship with TSMC to
include a long-term purchase agreement.
Upon completion of the $2 billion manufacturing program, Cirrus believes that two-thirds of its total wafer
requirement will be met from fabs in which it has partial ownership in (i.e., the company will eventually be 30
to 40 percent dependent on foundries for the production of its wafers, versus 100 percent in 1994).
1-75
Cirrus Logic
MiCRUS
1580 Route 52
Hopewell Junction, New York 12533
Telephone: (914) 892-2121
Wafer size: 200mm
Process: CMOS
Products: DRAMs, logic ICs
(Joint venture with IBM Microelectronics.
See Key Agreements.)
Lucent Technologies/Cirrus Logic Joint Venture
9333 South John Young Parkway
Orlando, Florida 32819
Telephone: (407) 345-6000
Wafer sizes: 200mm
Process: CMOS
Products: ASICs, MPRs
(Scheduled to start production in 1997.)
Key Agreements
• Cirrus Logic licensed the Rambus high-performance DRAM interface architecture in early 1995.
license gives Cirrus the right to use the Rambus interface in its graphics controllers.
The
• Cirrus Logic is licensed to embed Advanced RISC Machines' ARM processor into its future ICs for
communications, computer, consumer, and other applications. Cirrus is involved with Apple Computer in
designing next-generation Newton chipsets based on the ARM architecture.
• IBM and Cirrus Logic formed a joint manufacturing venture called MiCRUS in 1994. IBM and Cirrus Logic
own 52 percent and 48 percent of MiCRUS, respectively. Volume production of logic chips for Cirrus and
memory ICs for IBM began in mid-1995. The two companies have said they each will invest $160 million
in MiCRUS over the next few years to expand its capacity and capabilities. For the time being, the
agreement does not include product and/or technology exchange.
• Cirrus Logic's Pixel Semiconductor subsidiary signed a deal with ITT Semiconductors in December 1993
to develop multimedia chips. Introduction of jointly-designed components for digital cable decoder boxes
occurred in 1994. The firms will continue a wider exploration of both the video-on-a-PC and digital set-top
box markets.
• Cirrus Logic's PCSI subsidiary established a strategic alliance with AT&T Microelectronics (now Lucent
Technologies) in 1993 to develop a Cellular Digital Packet Data (CDPD) system for cellular networks.
• Anticipating a market that is expected to grow rapidly as new 3D titles appear for the PC platform, Cirrus
Logic licensed 3DO’s 3D technology to use in its new line of 64-bit graphics accelerators. The chips
should be ready for incorporation into customers’ products by the end of 1996.
1-76
Crosspoint Solutions
CROSSPOINT SOLUTIONS
Crosspoint Solutions, Inc.
694 Tasman Drive
Telephone: (408) 324-0200
Fax: (408) 324-0123
Fabless IC Supplier
With equity funding from ASCII Corporation, Crosspoint Solutions was founded in 1989 to develop a fieldprogrammable replacement for standard gate arrays. A proprietary cell and routing architecture, coupled
with a unique interconnect technology, enable Crosspoint to meet the performance and density demands of
the mainstream CMOS gate array market. Crosspoint was one of the first companies offering a fieldprogrammable challenge to gate arrays.
Management
Robert N. Blair
Thomas Chan
John Daws
Scott Graham, Ph.D.
Michael Levis
Ian R. Mackintosh
Vice President, Business Development and Product Marketing
The gate array granularity and transistor-level interconnect of Crosspoint's FPGA are made possible by the
company's unique antifuse technology, for which several patents have been issued. An antifuse is a
programmable switch that has a very high impedance initially, but exhibits a low resistance after
programming.
Crosspoint's unique antifuse fabrication technique provides antifuse elements with very low capacitance and
low "on" resistance. This translates directly to higher operating speed. The programming is permanent and
non-volatile, resulting in one-time-programmable (OTP) devices.
In 1Q96, Crosspoint unveiled its CrossFire™ family of FPGAs. The devices range from 20K-100K total gates
with an expected 60-80 percent being usable.
1-77
Crosspoint Solutions
Crosspoint has a long-standing foundry partnership with Hitachi. LG Semicon was added on recently as a
foundry partner (see Key Agreements).
Key Agreements
•
In 1Q96, Crosspoint gave LG Semicon limited licensing, manufacturing, and marketing rights to its
CP20K FPGA architecture in exchange for foundry access to LG’s 0.8µm and 0.6µm two- and three-layer
metal IC technology.
1-78
Cypress Semiconductor
CYPRESS SEMICONDUCTOR
Cypress Semiconductor Corporation
Telephone: (408) 943-2600
Fax: (408) 943-2796
Web Site: www.cypress.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
1991
287
34
72
80
1992
272
(21)
65
32
1993
305
8
50
56
1994
406
50
53
112
1995
596
102
72
195
Employees
1,945
1,529
1,262
1,423
1,859
Founded in 1983, Cypress Semiconductor is a designer, developer, and manufacturer of high-performance
digital integrated circuits for a variety of markets including networking, military, computers,
telecommunications, and instrumentation.
Military/Other
5%
Computer
Peripheral
17%
Computer
22%
Asia-Pacific
6%
Telecommunications
29%
Datacom
27%
1995 Sales by OEM Application
Japan
9%
Europe
19%
North
America
66%
Suffering its first revenue decline in 1992, Cypress initiated a restructuring program. From the company's
beginning, it had been known for its niche-market strategy of acquiring and managing smaller autonomous
businesses.
That approach, however, has been modified to take advantage of Cypress' lowered
manufacturing costs, allowing the company to compete effectively in high-volume markets such as the PC
market. Cypress has also turned to a more market-driven focus.
1-79
Restructuring activities included the selling of its Sparc processor subsidiary, Ross Technology, to Fujitsu and
the realignment of its subsidiaries Aspen Semiconductor and Multichip Technology under the company's
current four business units: the Memory Products Division (MPD), the Programmable Products Division
(PPD), the Data Communications Division (DCD), and the Computation Products Division (CPD). Cypress
also made a few strategic acquisitions, including Seattle-based IC Designs, Inc., a supplier of clockfrequency synthesis chips for the PC market, and the high-speed FCT logic product line from Performance
Semiconductor.
Data Communications
and Computation
Products
19%
Workstations
6%
Military
7%
Programmable
Products
19%
Memory
Products
62%
1995 Sales by Product Division
Other
10%
Telecommunications
27%
PCs
13%
Peripheral
14%
Datacom
23%
1995 SRAM Sales (~$300M) by Application
Management
T.J. Rodgers
Antonio Alvarez
Dan Barrett
David Barringer
Bernard Glasauer
Emmanuel Hernandez
Larry Jordan
Jeff Kaszubinski
Paul Keswick
Jim Kupec
Lothar Maier
J. Daniel McCranie
R. Michael Starnes
Joyce Sziebert
John Torode
Ron Treadway
William Verde
Michael Villott
1-80
Vice President, European Sales and Marketing
Vice President, New Product Planning and Applications
Vice President, Quality and Reliability Assurance
Vice President, Programmable Products Division
Vice President, Memory Products Division
Vice President, Worldwide Wafer Manufacturing
Vice President, Process Technology
Vice President, Computation Products Division
Vice President, Data Communications Division
Vice President, Strategic Accounts
Highlights of Cypress Semiconductor's product line is given below. Its integrated circuits are fabricated using
proprietary 0.5µm, 0.65µm, and 0.8µm CMOS, BiCMOS, and bipolar technologies.
SRAMs
• 4K to 1M CMOS SRAMs
• 64K and 256K BiCMOS SRAMs
• 1K and 16K ECL SRAMs
• 64-bit x 18 cache tag RAMs
• 128K and 256K cache RAMs
Specialty Memories and Memory Modules
• Industry-standard FIFOs
• Bidirectional FIFOs
• Clocked FIFOs
• Dual-port RAMs
• Memory accelerator MCMs
UltraLogic PLDs/FPGAs/Tools
• Flash370 CPLDs (44-288 pins)
• pASIC380 FPGAs (44-208 pins)
• Development tools
Industry-Standard PLDs/FPGAs
• 20-pin CMOS/BiCMOS PLDs
• 16V8 GAL-compatible PLDs
• 22V10 flash/BiCMOS PLDs
• MAX CPLDs (28-84 pins)
• Antifuse-based FPGAs
PROMs/EPROMs
• 4K to 512K CMOS PROMs
• 4K-1M CMOS EPROMs
Data Communications
• HOTLink point-to-point communications
• Fast Ethernet, Fibre Channel, and ATM/
SONET transceivers/receivers
Timing Technology Products
• Motherboard frequency synthesizers
• Low-power system logic devices
• Graphics frequency synthesizers
• Programmable products
• Custom oscillators
• Pentium clock synthesizers/drivers
Logic and Bus Products
• FCT logic chips
• VMEbus controllers
• ECL-TTL translators
• Bit slice/multipliers
• Programmable skew clock buffers
• Low-skew clock buffers
Cypress Semiconductor Inc.
Telephone: (408) 943-2653
Fab I
Wafer size: 150mm
Products: R&D and Prototype
Cypress Semiconductor (Texas) Inc.
17 Cypress Drive
Round Rock, Texas 78664
Telephone: (512) 244-7789
Fab II (17 percent owned by Altera)
Wafer size: 150mm
Products: SRAMs, PLDs, FPGAs, EPROMs,
datacom ICs
1-81
Cypress Semiconductor (Minnesota) Inc.
2401 East 86th Street
Bloomington, Minnesota 55425
Telephone: (612) 851-5100
Fab III
Wafer size: 150mm
Products: SRAMs, PLDs, FPGAs, logic chips,
datacom ICs
Cypress Semiconductor (Minnesota) Inc.
2401 East 86th Street
Bloomington, Minnesota 55425
Telephone: (612) 851-5100
Fab IV
Wafer size: 200mm
Products: SRAMs, Specialty Memories
Round Rock, Texas
Fab V
Capacity (wafers/week): 5,000 (when fully equipped)
Wafer size: 200mm
Products: SRAMs, EPROMs, Logic ICs
Key Agreements
• In 2Q96, Cypress settled its PLD litigation with AMD with a cross-licensing agreement.
• Cypress expanded its agreement with Altera Corporation regarding Altera's MAX 5000 EPLD line to bring
a family of smaller, faster devices to market.
• Cypress formed an alliance with QuickLogic Corporation to develop products, technology, and design
tools for high-performance FPGA architecture. Cypress also made a multi-million dollar equity investment
in QuickLogic, giving Cypress a stake of less than 10 percent in the company.
1-82
Cyrix
CYRIX
Cyrix Corporation
2703 North Central Expressway
Richardson, Texas 75080-2010
Telephone: (214) 994-8388
Fax: (214) 699-9857
Web Site: www.cyrix.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
Employees
1991
55
13
4
1992
73
8
8
1993
125
20
16
1994
246
38
25
1995
228
16
29
130
150
220
309
400
Founded in 1988, Cyrix Corporation designs, develops, and markets high-performance x86 softwarecompatible microprocessors for the desktop and mobile computer markets. The company seeks to serve
the needs of the PC marketplace as an alternative source for x86 microprocessors of original design with
competitive price/performance characteristics.
For Cyrix, 1995 was a transitionary year. Due to the demise of the 486 market in the first half of the year
and delayed introductions of new products, the company was unable to demonstrate growth over its record
performance in 1994. However, by the end of 1995 Cyrix had introduced both its fifth-generation and sixthgeneration microprocessors, the Cyrix 5x86™ and 6x86™, placing it in a compelling competitive position
against Intel’s Pentium and Pentium Pro microprocessors.
Math Coprocessors
1%
Europe
30%
Asia-Pacific
44%
Microprocessors
99%
North America
37%
1-83
Cyrix
Cyrix has strategic alliances with IBM Microelectronics and SGS-Thomson Microelectronics for the production
of its high-performance microprocessors. These agreements support the company's current strategy to
focus its resources on product design, market development, and customer support.
Management
Gerald D. Rogers
James N. Chapman
Kevin C. McDonough
Michael E. Barton
Thomas B. Brightman
Nancy B. DeChaud
Russell N. Fairbanks, Jr.
Timothy W. Kinnear
Lewis R. Paceley
Everett J. Roach
Stephen A. Tobak
Senior Vice President, Sales
Senior Vice President, Engineering
Vice President, Sales, Americas
Vice President, Business and Technology Development
Vice President, General Counsel, and Secretary
Vice President, Finance, and Treasurer
Vice President, Sales, Asia
Vice President, Corporate Marketing
Cyrix’s first products were math coprocessors. The company delivered its first x86 microprocessors in 1992.
It then moved quickly to develop a full line of 486 processors with advanced power management, clockdoubling capabilities, integrated math coprocessors, and write-back cache. Now the company is pushing its
fifth-generation 5x86 and sixth-generation 6x86 high-performance processors (the 486 products are no
longer in production).
Cyrix’s 6x86 (formerly called the M1) is based on a superscalar, superpipelined architecture and a RISC core.
The 6x86 line consists of three microprocessors, the 6x86-P133+ with a 110MHz clock speed, the 6x86P150+ with a 120MHz clock, and the 6x86-P166+ with a 133MHz clock. The P+ nomenclatures suggest
which specific higher-clock-rate Intel Pentium each of the members best compete with.
Cyrix expects to bring out its seventh-generation microprocessor, the M3 or 7x86, in 1997. In the meantime,
the company’s M2 processor, which will feature greater multimedia support, will begin sampling in 4Q96.
The company currently uses 0.65µm five-layer metal CMOS technology for its 6x86 products. In the second
half of 1996, the company will employ 0.5µm five-layer metal process technology for certain of its products.
In March 1996, Cyrix announced its entrance into the PC market through a five-year agreement with
Electronic Data Systems Corporation (EDS) to produce and sell high-performance PCs using Cyrix
microprocessors. The strategy behind Cyrix’s move to offer its own PCs is to showcase the capabilities of the
6x86 to key PC OEMs, rather than drive massive volumes.
1-84
Cyrix
Cyrix currently has relationships with SGS-Thomson and IBM Microelectronics for the manufacture of its ICs.
SGS-Thomson has been a manufacturing partner of Cyrix since October 1990. In early 1994, their pact was
extended and is now valid through the end of 1997.
Cyrix's agreement with IBM Microelectronics was established in April 1994 and is good through the end of
1999. As part of the agreement, Cyrix made a capital equipment investment of about $88 million in an IBM
fab in 1995.
To complement its partnerships with SGS-Thomson and IBM, Cyrix is negotiating to sign up a third
manufacturing partner. However, the arrangement will likely be for foundry supply only. IBM and SGSThomson are licensed to also produce Cyrix-designed x86 processors under their own names.
The construction of its own fabrication facility is not part of the company’s current business plan. However,
the option is not being ruled out. A jointly owned fab is a more likely option.
Key Agreements
• In 1Q96, Cyrix announced an agreement with Cadence Design Systems.
Under the agreement,
Cadence will provide a broad range of technologies and services to Cyrix, and work together in designing
Cyrix’s seventh-generation x86 microprocessor, called the M3.
• Cyrix extended its wafer supply agreement with SGS-Thomson in 1994. Under the new arrangement,
SGS-Thomson increased the number of wafers it produces for Cyrix and is allowed to make a certain
percentage of those same wafers for itself. In addition, Cyrix granted SGS-Thomson the right to use
certain Cyrix-designed chips as part of SGS-Thomson’s ASIC libraries. SGS-Thomson is allowed to
produce and sell such ASIC products under its own name in unlimited quantities, with Cyrix receiving
royalties from the sale of the devices. Also, Cyrix has the right to sell the SGS Thomson-designed ASICs
under its own name.
• Cyrix and IBM announced a five year agreement in early 1994 under which IBM is manufacturing Cyrix's
x86-compatible microprocessors. The agreement calls for the two companies to equally share the output
of the Cyrix-designed chips.
1-85
Dallas Semiconductor
DALLAS S EMICONDUCTOR
Dallas Semiconductor Corporation
4401 South Beltwood Parkway
Dallas, Texas 75244-3292
Telephone: (214) 450-0400
Fax: (214) 450-3715
Web Site: www.dalsemi.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
104
15
15
13
1992
120
18
16
16
1993
157
26
19
21
1994
181
30
23
45
1995
233
37
29
49
662
696
748
850
1,000
Founded in 1984, Dallas Semiconductor designs, manufactures, and markets high performance CMOS ICs
and semiconductor-based systems that provide innovative and cost-effective solutions to electronic design
problems in a wide range of markets. The company's continuous new product development strategy serves
as a means to increase future revenues and avoid dependence upon a single industry, market, or customer.
Its products are sold to OEMs in the personal computer and workstation, scientific and medical equipment,
industrial control, automatic identification, telecommunications, and other markets.
Other
9%
Communications
25%
Computing
36%
Scientific, Industrial,
and Medical
30%
1-86
Europe
17%
Asia
22%
U.S.
61%
Management
C.V. Prothro
Chao C. Mai, Ph.D.
Michael L. Bolan
Alan P. Hale
Doug Powell
F.A. Scherpenberg
Senior Vice President
Vice President, Marketing and Product Development
Vice President, Computer Products
Dallas Semiconductor's product groups include:
• Timekeeping circuits
• Microcontrollers (8-bit)
Secure MCUs
High-speed MCUs
• Nonvolatile RAMs (16K to 4M)
Integrated battery backup
Intelligent sockets
• Automatic identification devices
Serial numbers
Touch memories
• Telecommunications ICs
T1 and E1 circuits
SCSI terminators
• Silicon timed circuits
• System extension circuits
CPU supervisors
Digital potentiometers
Auto ID
6%
• Software authorization
Other
17%
Timekeeping
29%
Micros
8%
Telecom
14%
System
Extension
12%
NVRAMs
14%
1995 Sales by Product Family
1-87
4401 South Beltwood Parkway
Dallas, Texas 75244-3292
Wafer size: 150mm (2 lines)
Process: CMOS
1-88
Digital Semiconductor
DIGITAL S EMICONDUCTOR
Digital Equipment Corporation
77 Reed Road
Hudson, Massachusetts 01749
Telephone: (508) 568-6868
Web Site: www.digital.com/info/semiconductor
Captive IC Manufacturer
Corporate
Sales
Net Income
Semiconductor*
Sales
Internal Sales
External Sales
1991
1992
1993
1994
1995
12,943
(617)
13,931
(2,796)
14,371
(251)
13,451
(2,156)
13,813
122
225
225
—
230
230
—
240
235
5
270
245
25
305
255
50
3,000
2,750
Employees
*Calendar year
Digital Equipment Corporation (DEC) is one of the world's largest manufacturers of computers and computerrelated products. The company provides network computer systems, systems integrator, computer
peripheral equipment, software, and associated computer accessory equipment to customers in more than
100 countries.
DEC began developing semiconductor products in 1975 for use in its electronic systems. In 1993, Digital
expanded its semiconductor charter to become a merchant vendor. As part of its push into the merchant
market, DEC spun out its semiconductor operation in mid-1994 to become an autonomous business unit,
called Digital Semiconductor. For the past several years, Digital Semiconductor has worked to establish itself
as an independent semiconductor vendor, but its largest customer always has been Digital Equipment,
which bases its workstations and servers on its proprietary high-performance RISC microprocessor, called
Alpha. Still, the company desires to expand its merchant focus.
Digital Semiconductor designs, manufactures, and markets a broad portfolio of semiconductor products
including its Alpha processor and PCI-based networking, bridge, and graphics/multimedia devices.
1-89
Management
Robert B. Palmer
R.E. Caldwell
Arthur Swift
Vice President, Digital Semiconductor
Vice President, Sales and Marketing, Digital Semiconductor
Digital Semiconductor manufactures 64-bit RISC microprocessors with speeds as fast as 400MHz, PCIcompliant system and peripheral logic chipsets, Ethernet controller ICs, PCI-PCI bridge devices, graphics
accelerators, and graphics coprocessors (integrated accelerator, video controller, and RAMDAC on a single
chip).
Digital's IC products are built using primarily CMOS and bipolar technologies, with all advanced process
development centered on CMOS technology. Its leading-edge 0.35µm, four-level interconnect, CMOS-6
process technology is being used to manufacture the latest versions of the Alpha 21164. The processor is
available in 366MHz and 400MHz versions. 433MHz and 500MHz versions are expected by the end of
1996.
The Alpha processor, coupled with Digital’s FX!32 translation technology destined for future versions of
Windows NT software for Alpha, will enable Alpha-based systems to run 32-bit Windows applications at an
average of 70 percent of native Alpha speed.
In early 1995, Digital Semiconductor agreed to sell to Motorola its South Queensferry, Scotland, fabrication
facility. Motorola agreed to continue to make Alpha microprocessors for Digital, as well as take over Digital's
two-year foundry agreement with AMD for the production of AMD's 486 microprocessors at the plant.
75 Reed Road
Hudson, MA 01749
Telephone: (508) 568-4000
Wafer sizes: 100mm, 125mm, 150mm
Processes: CMOS, MOS, bipolar
Products: MPUs, ASICs, logic and custom ICs
Fab 6 (ramp up and production during 1996)
Wafer size: 200mm
Process: CMOS
Products: MPUs
Feature size: 0.35µm (eventually, 0.18µm)
1-90
Key Agreements
• Digital and Microsoft joined together in a broad patent- and technology-sharing agreement that supports
hardware and software development for client-server computing.
• Digital and Brooktree announced a long-term joint development and marketing relationship in early 1994
aimed at graphics-intensive and multimedia applications in high-performance PCs. The two companies
are cooperating on development of new accelerators, RAMDACs, and chips integrating both devices.
Digital and Brooktree previously worked together on RAMDACs in 1989.
• Mitsubishi agreed to be both a second source for Digital's Alpha MPUs and a development partner. The
Japanese company began producing Alphas for Digital at its newest Saijo facility in late 1994.
Subsequently, Mitsubishi will design and fabricate its own versions of the RISC architecture for use in its
own systems and to be sold to its own customers.
• Advanced RISC Machines Ltd. announced in early 1995 it would jointly develop with DEC and Apple
Computer a family of high-performance microprocessors compatible with the ARM RISC line. The 32-bit
processor, called StrongARM, are being produced by DEC using its 0.35µm CMOS-6 process. Volume
shipments began in the first half of 1996 and are targeted at applications in digital imaging, multimedia,
set-top boxes, handheld computers, and communications products, as well as Apple's Newton line.
1-91
Dionics
DIONICS
Dionics Inc.
65 Rushmore Street
Westbury, New York 11590-4839
Telephone: (516) 997-7474
Fax: (516) 997-7479
IC Manufacturer
Employees
35
Established in 1969, Dionics is a developer, manufacturer, and marketer of innovative high-quality integrated
circuits and discrete products. It targets these devices at areas of the industrial and military markets where
high voltage, high frequency, and unusual structures are required.
Using a dielectric isolation process, Dionics has evolved from a supplier of discrete components to a
manufacturer of hybrid circuits, ICs, photovoltaic SSRs, and MOSFET-drivers. The products were initially
targeted for use in digital watches but have since made their way to markets that require high reliability that
is inherent to the dielectric isolation process.
Management
Bernard L. Kravitz
Sherman Gross
President
Vice President
Photovoltaic ICs, SSRs, and MOSFET-drivers.
Dionics Inc.
65 Rushmore Street
Westbury, New York 11590-4839
Wafer size: 100mm
Process: Dielectric isolation bipolar
Products: Photovoltaic SSRs and MOSFET-drivers
1-92
DSP Group
DSP GROUP
DSP Group, Inc.
3120 Scott Boulevard
Telephone: (408) 986-4300
Fax: (408) 986-4323
Web Site: www.dspg.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1992
9
(6)
4
1993
12
(0.4)
2
Employees
1994
29
4
4
1995
50
7
8
106
115
DSP Group, Inc. develops, licenses, and markets digital signal processing (DSP) ICs and related software
targeted at digital speech applications in the multimedia personal computer, telecommunication, consumer
telephone, and consumer electronics markets.
DSP Group began business in 1987 with the purchase of a small design house that was involved in
paramilitary DSP-related design for applications such as noise cancellation and eavesdropping.
The
company began developing its own DSPs and established a design center in 1990. In 1992, the company
launched DSP Semiconductors as a subsidiary to directly focus on the licensing of its technology. Since
then, DSP Semiconductors has been folded back into DSP Group and now operates as the Semiconductor
Division.
The company’s strategy is to use its digital speech processing, telephony signal processing, and DSP core
architecture technologies to become a leading supplier of DSP-based solutions for the emerging markets for
digital speech products.
1-93
DSP Group
Royalties/
Licensing/Other
18%
DSPs
82%
Management
Eli Porat
Yuval Cohen
John P. Goldsberry, Ph.D.
Ofer Ronen
Martin Skowron
Gideon Wertheizer
Vice President, Consumer Products
Vice President, VLSI Design Center
DSP Group has developed a family of low-power consumption, low-cost DSP core architectures that are
suitable for consumer, mobile computer, and wireless communications products. The company’s products
are manufactured using 0.6µm-0.8µm CMOS technologies.
•
Application specific DSPs for speech and telephony processors used in digital telephones, answering
machines, and personal computers.
•
The PineDSPCore™ and OakDSPCore™ architectures. These core architectures are highly modular and
designed for customers developing their own high-volume, application-specific DSPs.
•
A proprietary digital speech compression technology called TrueSpeech®. TrueSpeech software is
designed for a wide range of applications, including video conferencing, computer telephony, the internet,
and personal recorders.
Current licensees of the PineDSPCore and OakDSPCore architectures include Adaptec, Asahi Kasei
Microsystems, DSP Communications, GEC Plessey, Harris Semiconductor, Integrated Circuit Systems, Level
One Communications, LSI Logic, NEC, Samsung, Siemens, Silicon Systems, TEMIC, VLSI Technology, and
Xicor.
Licensees of DSP’s TrueSpeech technology include Lucent Technologies, Atmel, Cirrus Logic, Intel,
Microsoft, Siemens, Sierra Semiconductor, U.S. Robotics, and VLSI Technology.
1-94
North American Company Profi les
DSP Group
As a fabless supplier, DSP depends on foundries for the manufacturing of its devices. The company has
established foundry relationships with several companies, including Tower Semiconductor, Taiwan
Semiconductor Manufacturing Co. (TSMC), and Samsung.
1-95
EDI
ELECTRONIC DESIGNS (EDI)
Electronic Designs Incorporated
One Research Drive
Westborough, MA 01581
Telephone: (508) 366-5151
Fax: (508) 836-4850
Fabless IC Supplier
Sales
Employees
1991
22
1992
23
1993
23
1994
25
1995
40
100
85
85
85
85
Founded in 1980, Electronic Designs Incorporated (EDI) is an international supplier of high-density, highperformance semiconductor memory products to many segments of the electronic equipment industry,
including computer systems and peripherals, telecommunications, medical equipment, and military systems.
The company emphasizes a time-to-market advantage for its high-speed SRAM modules. New modules
combining SRAM, flash, and EEPROM technology were introduced in 1994. The company also designs
and supplies active-matrix LCDs.
Management
Don McGuinness
Ken Buckley
Frank Edwards
EDI's products include the following:
•
•
•
•
•
High-speed monolithic 256K, 1M, and 4M CMOS SRAMs (commercial or military)
Monolithic 1M synchronous and special feature SRAMs (commercial)
High-density CMOS SRAM modules (1M-45M) with speeds of 15ns-70ns (commercial or military)
Modules combining two 1M SRAMs, two 1M flash memories, and two 256K EEPROMs (commercial)
Active-matrix LCDs
1-96
EDI
EDI handles assembly, test, and QCI at its headquarters in Westborough. For the production of its wafers,
the company has silicon foundry partnerships with major U.S. and international IC manufacturers.
Key Agreements
• EDI formed an agreement with Atmel in 1994 that calls for EDI to design, manufacture, and market highdensity memory modules using Atmel's flash memory devices.
• EDI signed a licensing agreement with Thomson-CSF that enables EDI to make and market products
using the French company's technology for 3D stack memory products.
1-97
EG&G Reticon
EG&G RETICON
EG&G Reticon
345 Potrero Avenue
Telephone: (408) 245-2060
Fax: (408) 738-6979
IC Manufacturer
Employees
160
EG&G Reticon was among the first semiconductor companies to specialize in solid-state imaging
components and vision system products. From its start in 1971, Reticon has been a leader in image
sensing and signal processing technology.
Reticon, a subsidiary of EG&G, Inc. since 1976, combines a tradition of innovation and quality with the
stability and resources of EG&G, a $1.4 billion company involved in diversified high technology markets.
Management
Andris Ramans
President and General Manager
•
Image sensing products—character scan devices, instrumentation devices, infrared sensors and
multiplexers, photodiode arrays, and CCDs.
•
Analog signal processing ICs—switched-capacitor filters, modem filters, universal active filters, transversal
filters, and analog delay lines.
•
Solid state camera products.
EG&G Reticon
Sunnyvale, California
Wafer size: 100mm
Processes: MOS, CMOS
Products: Linear ICs and image sensing devices
1-98
Elantec
ELANTEC
Elantec, Inc.
1996 Tarob Court
Telephone: (408) 945-1323
Fax: (408) 945-9305
Web Site: www.elantec.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
15
0.1
1992
15
0.3
1993
18
1
4
1994
23
1
4
1995
27
3
5
103
110
120
125
165
Elantec, Inc., founded in 1983, designs, manufacturers, and markets high-performance analog and mixedsignal integrated circuits for the video/multimedia, data processing, instrumentation, and communications
markets. The company serves these markets with standard products and application specific standard
products (ASSPs), using primarily high-speed complementary bipolar and advanced CMOS technologies.
Elantec has transformed itself from a military hybrid IC supplier to a company focused on providing highperformance analog intensive functions for growing commercial markets. At one time, military hybrid sales
accounted for 90 percent of the company's total sales, versus about 18 percent today.
In October 1995, the company completed its initial public offering.
Asia
33%
Europe
11%
Standard ICs
25%
North America
56%
ASSPs
75%
1-99
Elantec
Management
Dave O'Brien, Ph.D.
Richard Corbin
Ralph Granchelli, Jr.
Terrence W. Plette
Barry Siegel
Vice President, Bipolar Design
Elantec's analog and mixed-signal ICs for commercial markets include the following:
•
•
•
•
•
•
•
Op amps
Video circuits
Analog buffers
Transistor arrays
Servo motor drivers
Comparators and ATE pin drivers
IGBT drivers
•
•
•
•
•
•
H-sync Genlock-computer video circuits
DC restore subsystems
Fader circuits
MOSFET drivers
Half-bridge drivers
PWM controllers
Elantec has developed and used a variety of technologies for its products. In particular, Elantec has
focused on developing advanced complementary bipolar technology, using dielectric isolation and silicon-oninsulator (SOI) techniques, and advanced CMOS technology. The company utilizes external foundries for
other technologies such as ultra high-speed bipolar and BiCMOS.
Elantec, Inc.
1996 Tarob Court
Telephone: (408) 945-1323
Wafer size: 100mm
Processes: Complementary bipolar, complementary bipolar dielectric isolation (DI), JI bipolar, CMOS
Products: Analog ICs
Feature sizes: 5.0µm (bipolar)
1.2µm, 2.0µm (CMOS)
1-100
ESS Technology
ESS T ECHNOLOGY
ESS Technology, Inc.
46107 Landing Parkway
Telephone: (510) 226-1088
Fax: (510) 226-1098
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1991
23
6
1992
24
5
4
1993
15
0.2
3
1994
33
8
4
1995
106
30
9
Employees
145
ESS Technology, founded in 1984, designs, develops, and markets highly integrated mixed-signal
semiconductor audio solutions for the PC audio market, primarily to multimedia desktop and notebook
computer manufacturers.
In December 1995, ESS made an equity investment in VideoCore Technology, which will operate as a
wholly owned subsidiary of ESS. In 1996, ESS acquired OSEE Technology, a developer of fax/modem
technology.
In 1995, 70 percent of ESS Technology’s total sales were to international customers.
Management
Fred S.L. Chan
Nicholas A. Aretakis
Robert L. Blair
Hoover J. Chen
Ralph J. Harms
Albert Y. Mak
Robert S. Plachno
Roger K. Shum
1-101
ESS Technology
The company’s products consist of AudioDrive singe-chip solutions, wavetable synthesizers, and multimedia
system chipsets.
ESS Technology’s audio chips have migrated from 12-bit to 16-bit and from mono to stereo sound. The
company has also developed a core library of audio semiconductor designs, including microcontroller, bus
interface, codec, mixer, filter and FM synthesizers, and device drivers, as well as application software.
The company’s products are manufactured using a mixed-signal 0.6µm CMOS process technology, with a
move to 0.5µm technology expected in 1996.
ESS has contracts with several independent foundries for the manufacture of its products. The majority of
its devices are currently manufactured by Taiwan Semiconductor Manufacturing Company (TSMC), its
primary supplier since 1989. The company also uses UMC in Taiwan, Sharp Corporation in Japan, and IC
Works in California.
In December 1995 ESS announced a wafer supply program to commit approximately $62 million, and an
option to commit another $31 million, over the next three years for expanding manufacturing capacity and
developing advanced technology. The company expanded its relationship with TSMC by entering into a
long term agreement for an increased amount of wafer capacity. ESS agreed to pay approximately $32
million to TSMC in exchange for wafer supply through 1999. ESS also obtained an option to further expand
this agreement for additional capacity.
ESS also entered into a joint venture agreement with United Microelectronics Corporation (UMC) of Taiwan.
Under the agreement, ESS will invest $30 million for a five percent equity ownership in one of UMC’s three
joint 200mm wafer manufacturing facilities currently under construction in Taiwan. UMC is providing ESS
with capacity during the interim.
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Exar
EXAR
Exar Corporation
48720 Kato Road
Telephone: (408) 434-6400
Fax: (408) 943-8245
Web Site: www.exar.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1992
140
11
11
1993
146
14
11
1994
162
16
11
1995
159
(11)
14
1996
126
14
16
475
500
525
468
441
Employees
Founded in 1971, Exar Corporation is involved in the design and marketing of analog and mixed-signal
ASICs and ASSPs, primarily for use in communications, computer peripheral, and consumer electronics
products. The company also serves the automotive, industrial, and medical markets. Exar's strategy is to
address niche markets in which its design and process capabilities enable it to offer analog and mixed-signal
ASSPs to meet customer's needs. The company also produces digital ICs that are used primarily to
complement its other products.
In 1995, Exar shifted its product mix by withdrawing from the mass storage IC business. Currently, about 90
percent of Exar’s sales are from three market sectors: communications, consumer electronics, and
computers. In 1995, 62 percent of sales were to foreign customers.
Mass
Storage
13%
Document
Imaging
14%
New
Markets
12%
Consumer
38%
Communications
23%
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Exar
Europe
8%
ROW
1%
Asia
13%
Japan
40%
North America
38%
Exar has undergone a series of acquisitions and divestitures over the past couple of years. Included was
the reduction of the ownership Rohm (its original investor) has in the company to less than five percent and
the transferring of its epitaxial and bipolar manufacturing operations to Rohm. Also, Exar acquired three
semiconductor companies, Micro Power Systems, Inc., Origin Technology, Inc., and Startech
Semiconductor. While Micro Power Systems and Origin Technology were folded into Exar, Startech
operates as a wholly owned subsidiary under its own name. In 1996, Exar acquired Silicon Microstructures,
Inc. (SMI), a fabless semiconductor company mainly involved in the design, development, and marketing of
silicon sensors for the automotive and industrial market. SMI will operate as a subsidiary of Exar.
Management
George D. Wells
Ronald W. Guire
John Caruso
Roubik Gregorian
Thomas R. Melendrez
Stephen W. Michael
Ram Reddy
H. Ilhan Refioglu
Eric J. Ochiltree
Robert M. Skinner
Suhas "Sid" Bagwe
Thomas W. Jones
Paul Kageyama
Senior Vice President, Chief Financial Officer, and Secretary
Vice President, Micro Power Systems
President, Startech Semiconductor
Vice President, Legal Affairs
Vice President, Operations Division
Chief Executive Officer, Startech Semiconductor
Vice President, Strategic Product Groups
Director, Strategic Planning and Long Range Development
Director, Reliability and Quality Assurance
Director, Manufacturing Operations
Exar offers analog, digital, and mixed-signal ASICs and ASSPs. Its products are manufactured using 0.5µm
to 2.0µm CMOS processes or a 1.6µm BiCMOS process. The company also uses bipolar technology for
high speed and low noise applications. In April 1995, Exar discontinued several aging bipolar product lines it
inherited from Rohm. All of the products were low-margin devices, such as operational amplifiers and timers.
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Exar
Products gained through the acquisition of Micro Power Systems included high-performance data converters
and data acquisition systems for the advanced consumer, mass storage, telecommunications, and imaging
markets. Origin Technology provided Exar with proprietary speech recognition products for the consumer
market. Startech designs and markets ASSPs for a variety of markets such as datacommunications,
telecommunications, computers, workstations, and peripherals. Through the acquisition of SMI, Exar gained
silicon sensor technology.
Through its relationship with Rohm, Exar has access to the Japanese company's fabrication facilities. Some
of the company's products are produced by IC Works, Orbit Semiconductor, SGS-Thomson, and another
unnamed European manufacturer, as well as by TSMC.
Key Agreements
•
Exar and IC Works announced a $15 million wafer production agreement in 1995, under which IC Works
will provide wafers to Exar over the next five years. As part of the agreement, Exar will purchase and
install equipment in IC Works’ facility to convert it from 125mm wafers to 150mm wafers and improve its
process technology.
1-105
Exel Microelectronics
EXEL MICROELECTRONICS
Exel Microelectronics, Inc.
2150 Commerce Drive
P.O. Box 49038
Telephone: (408) 432-0500
Fax: (408) 432-8710
Fabless IC Supplier
Sales
1991
28
1992
32
1993
30
1994
36
1995
39
Exel Microelectronics is a division of Rohm Corporation, a wholly owned U.S. subsidiary of Rohm Co., Ltd. in
Japan. The company was founded in 1983 to design, manufacture, and market nonvolatile memory and
related products. Acquired by Rohm in 1989, Exel operates independently of the Japanese company,
though they maintain a close engineering and manufacturing relationship.
Exel’s original and continued focus is on EEPROM technology. The company is a high volume supplier of
industry standard serial and parallel EEPROMs. It also specializes in combining core EEPROM technology
with other functions providing higher levels of integration. This includes a family of both remote and contact
access devices and a family of analog functions combined with EEPROM technology.
Management
Tom Freeze
Rick Orlando
President
Exel Microelectronics supplies serial and parallel EEPROMs and access control products.
Serial EEPROMs
• Microwire
• I2C
• SPI
1.8V to 5.5V; 1K, 2K, and 4K
1.8V to 5.5V; 1K, 2K, 4K, 8K, and 16K
2.7V to 5.5V; 2K, and 4K (16K available in 3Q96)
Parallel EEPROMs
• CMOS full-featured 16K and 64K
1-106
Exel Microelectronics
Surelok™ Security Products
• XL 106
• XL 124
• XL 109 ,110, and 138
Random rolling code encoder, decoder, and coprocessor
Low cost rolling code encoder
Rolling code controllers
Exel's serial and parallel EEPROMs are based on proprietary 1.0µm CMOS and NMOS processes.
All of Exel's EEPROM products are manufactured in Rohm's fabrication facility located in San Jose,
California.
1-107
Genesis Microchip
GENESIS MICROCHIP
Genesis Microchip Inc.
200 Town Centre Boulevard
Suite 400
Markham, Ontario
Canada L3R 8G3
Telephone: (905) 470-2742
Fax: (905) 470-2447
Web Site: www.genesisus.com
U.S. Representative:
Genesis Microchip Corporation
2111 Landings Drive
Mountain View, California 94043
Telephone: (415) 428-4277
Fax: (415) 428-4288
Fabless IC Supplier
Employees
47
Founded in 1987, Genesis Microchip is a technology leader
company designs, develops, and markets leading-edge ICs
applications demanding high-quality video/image processing.
resizing. Markets are divided into high-end chips (gm865 class),
low-cost, high-performance cores.
in digital video/image manipulation. The
targeted at both existing and emerging
Genesis sets the standard in video/image
middle tier (gm833 class), and commodity,
Management
Paul M. Russo
Peter Dakin
Hamid Farzaneh
Lance Greggain
Eric Erdman
Scott Baker
John Chan
Jordan Du Val
Jay Giblon
David Green
Graham Loveridge
Peter Mandl
1-108
Vice President, Product Development Operations
Director, Finance and Administration
Manager, ASIC Development
Manager, IC Design
Manager, Marketing
Manager, Information Systems
Manager, Sales
Manager, Customer and Product Support
Manager, Video DSP Technology
Genesis Microchip
Genesis' products include the Genesis Scaling™ series of video/image resizing ICs (gm865x1, gm833x2,
gm833x3, gm833x3F), the gm2242B half-band filter, and the gmVLD family of video line doublers plus
supporting evaluation boards and software.
The patented algorithms and architectures provide
improvement in computational efficiency over traditional finite impulse response (FIR) filter structures. All of
Genesis' design efforts currently employ 0.8µm (and below) CMOS technology. Several products are
described below.
•
gm865x1—This is the first of the Genesis Scaling chip series. The gm865x1 IC is a single-channel
device that provides high-quality video/image processing technology for medical imaging, broadcast
equipment, and projection systems.
•
gm833x2—This is the second of the Genesis Scaling chip series. The gm833x2 is a dual-channel
device for use in workstation, projection systems, and multimedia applications.
•
gm833x3—This is a triple-channel version in the 833 class designed for use in projection systems,
videographic workstations, and scan conversion equipment.
•
gm833x3F (fast) “Bullet”—This is a 68MHz version of an RGB scaler, featuring low power, and an
advanced 0.35µm, 3.3V CMOS process.
•
gm2242B Half-Band Filter—This is a decimating/interpolating digital filter for use in applications
requiring pre- or post-filtering of digital video signals. The gm2242B supports NTSC, PAL, SECAM,
and square pixel video standards.
•
gmVLD8/gmVLD10 Video Line Doublers—This is a single-chip de-interlacing device for use in
equipment such as large screen televisions, video walls, projection systems, video-in-a-window
workstations, and home theater screens.
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Gennum
GENNUM
Gennum Corporation
P.O. Box 489, Station A
Burlington, Ontario
Canada L7R 3Y3
Telephone: (905) 632-2996
Fax: (905) 632-2055
IC Manufacturer
Financial History ($M), Fiscal Year Ends November 30
Sales
Net Income
R&D Expenditures
Employees
1991
24
4
5
2
1992
26
4
7
3
1993
27
4
7
2
1994
33
5
8
3
1995
42
7
9
4
219
233
240
247
255
Gennum Corporation, formed in 1973, is a Canadian high technology company that designs, manufactures,
and markets electronic components, primarily silicon integrated circuits and thick-film hybrid circuits, for
special applications in the information world.
The company's products include low-voltage audio electronic amplifiers and analog signal processing circuits
supplied to the world hearing instrument industry; video signal distribution and processing components sold
to the professional video and broadcast television markets; and user specific ICs for a wide variety of specific
applications where information is being conditioned, transmitted, or interpreted.
Canada
10%
Pacific Rim
19%
United States
42%
Europe
29%
1995 Sales By Geographic Region
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Gennum
Management
H. Douglas Barber, Ph.D.
Michael R. Fielding
David L. Lynch
Ian L. McWalter
C. Timothy Zahavich
Gennum produces analog arrays, linear ICs, and thick-film hybrid circuits using bipolar process technology.
The company has developed a DMOS process, though it has not put it into production, and CMOS designs
are contracted out for manufacture by external foundries.
Gennum Corporation
3435 Landmark Road
Burlington, Ontario L7M 1T4
Wafer size: 100mm
Process: Bipolar
Products: Linear ICs, ASICs, thick-film hybrid circuits
Feature sizes: 1.5µm-4µm
1-111
GTE Microelectronics
GTE M ICROELECTRONICS
GTE Government Systems Corporation
77 A Street
Needham Heights, Massachusetts 02194-2892
Telephone: (800) 544-0052
Fax: (617) 455-5885
Fabless IC Supplier
GTE Microelectronics designs, tests, and supplies high-end, complex military and commercial microelectronic
devices to GTE Corporation and other companies. GTE Corporation is one of the world's largest suppliers of
communications systems, equipment, and services for commercial and government/defense applications.
GTE Microelectronics is an organization within the Communications Systems Division of GTE Government
Systems, one of GTE Corporation's two operating groups.
GTE Microelectronics was founded in 1969 as a captive supplier to GTE. In 1993, GTE Microelectronics
started providing products and services to other companies. Currently, 60 percent of GTE Microelectronics'
business is internal to GTE and 40 percent is with other companies.
Approximately 75 percent of its sales, which are estimated to be in the $10 to $15 million range, are from
military-related products and 25 percent commercial-related products. Typical applications for its products
are avionics, imaging, portable satellite terminals, military electronics equipment, submarine
communications, receivers, and the space shuttle.
Management
John Condon
Debbie Cremin
Director, GTE Microelectronics
Manager, Business Development
GTE Microelectronics' products include ASICs, FPGAs, multichip modules, and hybrids. The company
specializes in rapid prototyping, small production runs, custom packaging, and conversion of hybrids to
ASICs.
The company's ASIC offerings include a variety of standard cell and gate array technologies from 9.0µm to
0.65µm CMOS, BiCMOS, and bipolar for digital, analog, and mixed-signal circuits.
1-112
GTE Microelectronics also provides custom test services for test development and production of analog,
digital, and mixed signal circuits, including temperature testing, characteristics, and qualification.
For the production of its ICs, GTE Microelectronics has established several strategic partnerships with wafer
foundries, including National Semiconductor and Symbios Logic.
1-113
Harris Semiconductor
HARRIS SEMICONDUCTOR
2401 Palm Bay Road Northeast
Palm Bay, Florida 32905
Telephone: (407) 724-7000
Fax: (407) 729-5691
Web Site: www.semi.harris.com
IC Manufacturer
Corporate
Sales
Net Income
Semiconductor
Sales
Net Income
1991
1992
1993
1994
1995
3,040
20
3,004
75
3,099
111
3,336
112
3,444
155
741
(76)
54
585
(20)
22
591
17
27
635
31
44
659
42
80
8,000
8,100
Employees
Harris Semiconductor is one of the four major business sectors of Harris Corporation, a worldwide
manufacturer of electronic systems, semiconductors, communications products, and office systems with
sales of over $3.4 billion and more than 26,000 employees.
Semiconductor
19%
Communications
21%
Electronic Systems
30%
Lanier Worldwide
30%
1995 Corporate Sales by Business Sector
Harris Semiconductor originated as the Microelectronics Division of Radiation, Inc. in 1962. It became Harris
Semiconductor in 1967 through the merger of Harris and Radiation. Then in 1988, Harris Semiconductor
nearly tripled in size through the acquisition of the General Electric Solid State semiconductor business.
1-114
Harris Semiconductor manufactures and markets advanced analog, digital, power, and mixed-signal
integrated circuits and discrete semiconductors for power, signal-processing, data-acquisition, and logic
applications. The company is focusing most of its future efforts on specialized applications in automotive,
communications, and power control products.
Data Acquisition
7%
Intelligent Power
11%
Discretes
24%
Power
25%
Signal Processing
16%
Mixed-Signal
18%
Integrated Circuits
76%
Digital
23%
by Application
by Device Type
Below are applications served by Harris’ semiconductor products.
Automotive—multiplexing systems, antilock braking systems, engine controls, emission controls, engine
knock sensing, air bag systems, and entertainment systems. This is Harris' largest commercial end market.
Communications—wireless local area network (LAN) systems, cellular base stations, satellite communications
systems, set-top boxes, and PBX, central office, wireless local loop, and fiber-in-the-loop equipment.
Video/Multimedia—video and imaging processing systems, video teleconferencing, and multimedia systems.
Power and Load Control—motor controllers, disk drives, power supplies, distributed power systems, and
power switching.
Power Protection—surge suppression equipment, uninterruptible power supplies, house electrical panel
protection, and on-board electronic circuit protection.
Other Applications—test equipment, industrial controls, consumer electronics, medical imaging, computer
peripherals, hand-held portable equipment, and military and aerospace equipment.
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Management
Harris Corporation
Phillip W. Farmer
Bryan R. Roub
Harris Semiconductor Sector
John C. Garrett
George L. Gidzinski
F. Scott Moody
W. Russell Morcom
P.G. Phillips
Carleton Smith
Ron Van Dell
Edward Verbeek
Marcus Wise
President
Vice President and GM, Military and Aerospace Products Division
Vice President and GM, Semiconductor Products Division
Vice President (North America), Sales
Vice President, Worldwide Sales and Marketing
Vice President (Europe), Sales
Vice President (Asia), Sales
Harris offers a broad range of standard, semicustom, and custom ICs and discrete semiconductors, including
intelligent power devices, data acquisition and signal processing circuits, digital microprocessor, peripheral,
and logic ICs, and radiation-hardened circuits for spacecraft and satellite applications.
MOS MEMORY
DRA M
✔
SRAM
Flash Memory
EPROM
ROM
EEPROM
✔
ANALOG
✔
✔
✔
✔
✔
✔
✔
MOS LOGIC
✔
✔
✔
✔
Amplifier
Interface
Consumer/Automotive
Data Conversion
Comparator
DIGITAL BIPOLAR
Bipolar Memory
Gate Array
Standard Cell
✔
MPU/MCU/MPR
MOS MICROCOMPONENT
✔
✔
✔
✔
1-116
MPU
MCU
MPR
DSP
OTHER
✔
✔
✔
Full Custom IC
Discrete
Optoelectronic
Process technologies used by Harris Semiconductor include: CMOS, BiCMOS, power BiMOS, highfrequency bipolar/power MOS, high-voltage bipolar/power MOS, complementary bipolar dielectric isolation
(bonded wafer), CMOS/SOI (silicon-on-insulator), CMOS/SOS (silicon-on-sapphire), and radiation hardening.
Harris supplements its internal semiconductor production capabilities with foundry agreements with external
semiconductor manufacturers. For example, the company uses foundries for the fabrication of triple-layermetal CMOS devices like signal processing ICs.
In 1995, Harris started the construction of the world’s first 200mm wafer fabrication facility for discrete
semiconductors. The $250 million fab will be located adjacent to the company’s Mountaintop, Pennsylvania,
plant. Completion of the fab expected in the fall of 1996.
Harris Semiconductor (Ohio), Inc.
1700 Fostoria Road
Findlay, Ohio 45840
Telephone: (419) 423-0321
Processes: CMOS, bipolar, BiCMOS
Products: Custom digital, linear, logic, and
mixed-signal ICs
Harris Semiconductor (Florida), Inc.
P.O. Box 883
Palm Bay, Florida 32905
Telephone: (407) 724-7000
Wafer sizes: 3in, 100mm, 125mm
Processes: CMOS, PMOS, bipolar
Products: MPUs, SRAMs, linear and digital ICs,
discretes
Feature sizes: 0.8µm, 1.0µm, 2.0µm, 4.0µm
Harris Semiconductor (Pennsylvania), Inc.
Crestwood Industrial Park
125 Crestwood Road
Mountaintop, Pennsylvania 18707-2189
Telephone: (717) 474-6761
Wafer sizes: 100mm, 125mm, 150mm
Processes: MOS, bipolar, BiCMOS
Products: Discretes, hybrids, ASICs
Harris Semiconductor (Pennsylvania), Inc.
Mountaintop, Pennsylvania
Cleanroom size: 25,000
Wafer size: 200mm
Process: MOS
Products: Discretes
(Scheduled to start production in 1Q97)
In early 1996, Harris began building a new IC assembly and test facility in Suzhou, China. The company
expects construction to be completed by early 1997. The new facility will assemble and test digital logic,
microperipheral, and analog and mixed-signal devices. Harris has existing semiconductor assembly factories
in Kuala Lumpur, Malaysia, and Dundalk, Ireland.
1-117
Key Agreements
• In 4Q95, Harris announced a license agreement with DSP Group Inc. Harris licensed DSP Group’s Oak
and Pine DSP cores for use in devices for audio-band signal processing applications.
• Harris has a product agreement with Sony. Under the agreement, Harris expanded its line of 10-bit, 12bit, and 14-bit data converters to include Sony’s 6-bit and 8-bit converters.
• Harris has a second-source agreement with Xilinx for radiation-hardened FPGAs.
• Harris formed an agreement with Noise Cancellation Technologies to develop and manufacture
proprietary chips for application of NCT's active noise reduction technology.
1-118
Honeywell
HONEYWELL SSEC
Honeywell, Incorporated
Solid State Electronics Center (SSEC)
12001 Highway 55
Plymouth, Minnesota 55441
Telephone: (612) 954-2301
Fax: (612) 954-2504
Web Site: www.ssec.honeywell.com
IC Manufacturer
Corporate
Sales
Net Income
Semiconductor
IC Sales
1991
1992
1993
1994
1995
6,193
331
300
6,223
247
312
5,963
322
337
6,057
279
319
6,731
334
323
50
53
45
45
58
500
523
Employees
Founded in 1885, Honeywell is an international company that provides control components, products,
systems, and services for the home and building, industrial, space and aviation, and defense and marine
markets.
Other*
2%
Space and
Aviation Control
23%
Home and
Building Control
45%
Industrial Control
30%
*Includes sales from the SSEC
1995 Corporate Sales by Business Segment
1-119
Honeywell
Honeywell established its Solid State Electronics Center (SSEC) in 1965 to support the high technology
demands in the markets served by the parent company. This growing reliance on microelectronics led SSEC
to become a niche market manufacturer of specialized ICs and solid-state sensors.
Over the years, Honeywell SSEC has taken on numerous military contracts. Two of the more well known
programs are the Very High Speed Integrated Circuit (VHSIC) program and the Enhanced Modular Signal
Processor (EMSP) program. These programs helped position SSEC for its future in control, memory, and
spaceborne applications.
The SSEC's mission is to develop and produce niche semiconductor technologies and products which are
focused in the market areas of sensors, radiation-hardened space components, and specialized ICs for its
parent's needs and for select external markets. SSEC is the world’s leading supplier of SOI CMOS ICs for
space and industrial applications. Approximately 50 percent of the SSEC's IC production is sold to external
customers.
Management
Michael R. Bonsignor
D. Larry Moore
Larry C. Welliver
Bryan Johnson
Lou Del Monte
Pravin Parekh
Jay Schrankher
Jim Becker
Peggy Kvam
Vice President, SSEC
Director, Human Resources and Facilities, SSEC
Director, Business Management, SSEC
Director, Operations, SSEC
Director, Quality and Information Systems, SSEC
Manager, Material Management, SSEC
Manager, ASIC Products, SSEC
Honeywell SSEC's key business areas are outlined below.
Space components (for commercial, military space, and tactical and strategic missile applications).
• SRAMs
• ROMs (SOI and bulk)
• Gate arrays (SOI and bulk) with ultra low power options
• Bus interface products (1773 and 1553)
Sensors (for industrial control, automotive, medical, and aircraft applications).
• Precision pressure
• High-accuracy magnetic
High-temperature products (for oil service industry, industrial control, and gas turbine control
applications). All SOI devices.
• Op amps
• Switches
• A/D converters and controllers
1-120
Honeywell
About 90 percent of Honeywell's ICs are manufactured using CMOS or radiation-intensive CMOS
(RICMOS™) processes and 10 percent using an advanced bipolar process.
Honeywell, Incorporated
Solid State Electronics Center
12001 Highway 55
Plymouth, Minnesota 55441
Wafer size: 100mm
Processes: CMOS, bipolar
Products: Rad-hard memories, ASICs, analog ICs, digital ICs, sensors, foundry services
Feature sizes: 0.5µm, 0.7µm, 0.8µm, 1.2µm, 4.5µm
Key Agreements
• Honeywell SSEC licensed Micron Technology's Softool known-good die technology. It plans to use the
test method to provide known-good die to the military and commercial markets, primarily for space
applications.
1-121
HP
HEWLETT -P ACKARD (HP)
Hewlett-Packard Company
3000 Hanover Street
Palo Alto, California 94304-1112
Telephone: (415) 857-1501
Fax: (415) 857-5518
Web Site: www.hp.com
Financial History ($M), Fiscal Year Ends October 31
Corporate
Sales
Net Income
Semiconductor*
Sales
IC Sales
Internal Sales
External Sales
Discrete Sales**
1991
1992
1993
1994
1995
14,494
755
16,410
549
20,317
1,177
24,991
1,599
31,519
2,433
560
340
328
12
220
745
400
350
50
345
880
475
410
65
405
1,085
585
540
45
500
1,250
655
615
40
595
*Calendar year
**Includes internal and external sales
Hewlett-Packard (HP) is one of the world's leading designers and manufacturers of electronic, medical,
analytical, and computing instruments and systems. HP divides its business into five product categories:
computer products, electronic test and measurement instruments and systems, medical electronic
equipment, analytical instruments, and electronic components.
Hewlett-Packard's Components Group is a leading supplier of microwave semiconductors and optoelectronic
devices for the fiber-optic, wireless and visual communications, computer equipment, industrial, and
automotive markets.
1-122
HP
Analytical
Instruments
3%
Medical
Electronics
4%
Electronic
Components
3%
Test/
Measurement
Instruments
10%
Asia
20%
Computers
80%
1995 Corporate Sales by
Product Group
Europe
35%
U.S.
45%
Geographic Region
In 1992, HP completed the acquisition of Avantek, Inc. Through Avantek, HP gained a wider customer base
in the components market. Those Avantek products targeted for commercial markets became part of the
Communications Components Division. Those products whose main applications are defense-related make
up the Avantek subsidiary of the Components Group.
Also under the wings of Hewlett-Packard is HP Labs, which is one of the world's leading electronic research
centers.
Management
Lewis E. Platt
Richard W. Anderson
William F. Craven
Frederic N. Schwettmann
Neal Carney
Vice President and GM, Microwave and Communications Group
Vice President and GM, Components Group
Vice President and GM, Circuit Technology Group
Marketing Manager, IC Business Division
HP's semiconductor products range from analog and high-speed digital ICs to RF, microwave, and
optoelectronic semiconductors. The company also offers motion control devices, solid-state relays, and
millimeter-wave components. In addition, HP manufactures a RISC MPU that was designed using what it
calls Precision Architecture-RISC (PA-RISC). Two of the newest PA-RISC microprocessors are the PA-8000
for high-end systems and the PA-7300LC for low-end and midrange systems. Both of the chips are based
on HP’s 0.5µm, four-layer metal CMOS process.
In 1995, HP launched Tachyon, a gigibit-speed Fibre Channel single-chip controller for networked massstorage applications. Also in 1995, HP unveiled an infared (IR) transceiver that will transmit data at
4M/second over distances up to one meter, eliminating the need for cables to exchange files between PCs
and peripherals.
HP uses sophisticated semiconductor technologies based on silicon, GaAs, and InP materials.
1-123
HP
Hewlett-Packard
350 West Trimble Road
Telephone: (408) 435-7400
Wafer sizes: 3in, 100mm
Processes: Bipolar, GaAs
Products: ASICs, optoelectronics, discretes
Hewlett-Packard
39201 Cherry Street
Newark, California 95131
Telephone: (408) 435-6765
Wafer size: 100mm
Process: Bipolar
Products: Analog ICs, RFICs
Hewlett-Packard
3404 East Harmony Road
Fort Collins, Colorado 80525
Telephone: (303) 229-3800
Products: RFICs, microwave ICs, MPUs, ASICs
Hewlett-Packard
1050 Northeast Circle Boulevard
Corvalis, Oregon 97330
Process: CMOS
Products: ASICs, MPUs, MPRs, DSPs
Hewlett-Packard
Santa Rosa, California
Wafer size: 2in
Process: Bipolar
Products: Discretes
Avantek, Inc.
Santa Clara, California
Wafer size: 3in
Process: GaAs
Products: ICs and discretes
TECH Semiconductor Singapore Pte. Ltd.
P.O. Box 2093, SE 9040
990 Bendemeer Road
Singapore 1233
Telephone: (65) 298-1122
Wafer size: 200mm
Process: CMOS
Products: DRAMs
(Joint venture with Texas Instruments, the Economic Development
Board of Singapore, and Canon.)
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HP
Key Agreements
• In August 1995, Hewlett-Packard signed an agreement with Tower Semiconductor to increase the
amount of wafers HP receives from the Israeli foundry.
• AT&T Microelectronics (now Lucent Technologies) and Hewlett-Packard signed an agreement in early
1995 to develop and dual-source fiber-optic transceivers for SONET/SDH and ATM applications.
• To promote and coordinate the use of its PA-RISC architecture, Hewlett-Packard formed PRO, the
Precision RISC Organization. Some of the founding members are Convex Computer, Hitachi, Oki,
Hughes Aircraft, and Mitsubishi. Other members include Sequoia Systems and Winbond Electronics.
• Although not a PRO member, Samsung has the right to manufacture PA-RISC ICs to sell on the
merchant market and use in its own workstations.
• HP formed an alliance with Analog Devices for the joint development of advanced mixed-signal processes
based on HP's submicron CMOS and BiCMOS technologies.
• Hewlett-Packard and Intel announced a wide ranging joint research and development alliance in 1994
under which the partners are seeking to design a superior next-generation 64-bit microprocessor by 1998.
The processor will be binary-compatible with both Intel x86 code and HP PA-RISC code.
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Hughes Electronics
HUGHES ELECTRONICS
Hughes Electronics Corporation
Delco Electronics Corporation
One Corporate Center
Kokomo, Indiana 46904-9005
Telephone: (317) 451-5700
Fax: (317) 451-5426
Web Site: www.delco.com
Hughes Aircraft Company
Semiconductor Products Center
500 Superior Avenue
Newport Beach, California 92663
Telephone: (714) 759-2411
Fax: (714) 759-2280
Web Site: www.hughes.com
Corporate
Sales
Net Income
Semiconductor
Sales
Delco Electronics
Internal Sales
External Sales
Hughes Aircraft
Internal Sales
External Sales
1991
1992
1993
1994
1995
11,541
559
12,297
(922)
13,518
922
14,099
1,049
14,772
1,108
330
195
185
10
135
85
50
341
205
195
10
136
81
55
350
220
205
15
130
72
58
360
235
215
20
125
64
61
340
240
215
25
100
45
55
Hughes Electronics Corporation (HE), known as GM Hughes Electronics Corporation prior to March 1995, is a
subsidiary of General Motors Corporation.
HE's principal operating organizations are Delco Electronics
Corporation and Hughes Aircraft Company. Its other business units are Hughes Telecommunications and
Space Company, DirecTV, Inc., and Hughes Network Systems, Inc.
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Hughes Electronics
Other
1%
Telecommunications
and Space
21%
Automotive
Electronics
38%
Aerospace and
Defense Systems
40%
1995 Corporate Sales by Business Segment
Delco Electronics (DE) is a world leader in the development, manufacture, and marketing of vehicle and
driver systems for the global automotive market, and Hughes Aircraft, acquired by GM in 1985, is a world
leader in aerospace, defense electronics, and information systems.
Delco Electronics has benefited in recent years from the rising content of electronics in vehicles and higher
vehicle volumes. Electronic controllers for airbags, active suspensions, and anti-lock brakes, electronic
pollution control systems, powertrain computers, and theft deterrent systems are major contributors to the
increase in vehicle electronic content. Some of its new technologies include night vision systems, collision
avoidance systems, navigation systems, keyless start systems, tire pressure warning systems, and
reconfigurable LCD head-up displays.
Delco Electronics, alone, is the third largest captive IC manufacturer. Its fabrication facilities produce about
40 percent of its semiconductor needs.
Hughes Aircraft is continuing to restructure its business to adapt to severe cuts in U.S. defense spending.
The company intends to maintain its leadership in key defense markets, while at the same time, explore new
marketplaces and exploit new technologies. Some commercial ventures the company is involved in include:
digital cellular communications systems, advanced acoustic technologies, light projection systems, digital
signal compression, character recognition, and airport integration systems.
Management
C. Michael Armstrong
Gary W. Dickinson
John C. Weaver
W. Scott Walker
Barry Abrahams
Robert A. Miller
Chief Executive Officer, Hughes Electronics Corporation
Executive Vice President, Hughes Electronics Corporation;
President and Chief Executive Officer, Delco Electronics Corp.
Senior Vice President, Hughes Electronics Corporation;
President, Hughes Aircraft Company
Senior Vice President and Chief Technical Officer, Delco Electronics Corp.
Vice President, Business Development, Hughes Aircraft Company
Vice President, Marketing, Delco Electronics Corp.
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Hughes Electronics
IC Delco, DE's automotive semiconductor unit designs and manufactures custom analog and digital ICs for
specific automotive applications such as anti-lock brake systems, engine controllers, suspension control
systems, communications, and instrumentation. IC Delco also produces silicon-based electronic sensors.
Among the semiconductor devices Hughes Aircraft designs and manufactures are ASICs, memory devices,
microcomputers, rad-hard circuits, and microwave/millimeter wave integrated circuits (MMICs) using a variety
of process technologies including CMOS, BiCMOS, GaAs, and InP. Approximately half of its devices are
sold to the merchant market.
Delco Electronics Corporation
IC Delco Business Unit
700 East Firmin Street
Kokomo, Indiana 46902-2340
Cleanroom size: 125,000 square feet (3 fabs)
Processes: NMOS, CMOS, BiCMOS, bipolar
Products: MPUs, MCUs, ASICs, logic and
linear ICs, discretes
500 Superior Avenue
Newport Beach, California 92663-3627
Telephone: (714) 759-2411
Wafer sizes: 100mm
Processes: CMOS, BiCMOS, SOS, CryoCMOS
Products: ASICs, memories, MCUs, LCD drivers,
digital and linear ICs, foundry services
3100 Lomita Boulevard
Torrance, California 90509
Telephone: (310) 517-6000
Wafer size: 3in
Process: GaAs
Products: MMICs, MM wave devices
Key Agreements
•
Delco Electronics and Texas Instruments jointly developed a new methodology, called Prism, that is
intended to cut the high cost and long lead time of taking complex mixed-technology designs from
concept to silicon. Prism is being used by DE to produce configurable 16-bit microcontrollers for GM cars.
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IBM Microelectronics
IBM M ICROELECTRONICS
1580 Route 52
Telephone: (914) 894-2121
Fax: (914) 894-6891
Web Site: www.chips.ibm.com
IC Manufacturer
Corporate (IBM Corp.)
Sales
Net Income
Semiconductor
Sales
Internal Sales
External Sales
1991
1992
1993
1994
1995
64,766
(2,861)
64,523
(4,965)
62,716
(8,101)
64,052
3,021
71,940
4,178
3,835
3,815
20
3,775
3,725
50
3,885
3,510
375
4,575
3,605
970
650
5,705
4,020
1,685
1,000
Employees (IBM Microelectronics)
22,000
International Business Machines (IBM) was founded by Thomas J. Watson in 1924. Since then, IBM has
grown into one of the world's largest corporations that sells in over 140 countries. IBM develops,
manufactures, and sells advanced information processing products, including computers and
microelectronics technology, software, networking systems, and information technology-related services.
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Finance and Other
5%
OEM Hardware*
6%
Maintenance
10%
Information
Technology
Products
43%
Software
18%
Services
18%
*Includes external sales of semiconductors.
Product/Service Group
Latin America
5%
Asia-Pacific
19%
North America
39%
Europe/
Middle East/Africa
37%
Geographic Region
The Microelectronics Division of IBM develops, manufactures, and markets a wide range of integrated
microelectronic products and technologies. Products and services range from semiconductor design and
fabrication to fully assembled and tested functional assemblies.
Prior to 1992, IBM Microelectronics supplied its products and services exclusively to one customer—IBM
Corporation. Spurred by both a comprehensive restructuring of IBM into independent business units and
the high cost of developing advanced semiconductor technologies, IBM Microelectronics launched a
worldwide microelectronics merchant market effort in 1992 by offering to sell virtually every product and
service in its technology portfolio. Its products and services are targeted at manufacturers of computers,
communications, and consumer electronics systems.
IBM Microelectronics’ strategic products are its PowerPC RISC microprocessors and embedded controllers,
x86 microprocessors, memory ICs, ASICs, and leading-edge packaging services.
Other important
microelectronic products include analog and mixed-signal ICs, digital signal processors, and graphics chips.
Initially, the company is seeking to establish itself as a high-volume supplier of microelectronic products such
as standard DRAMs and microprocessors.
To bolster its technological leadership, IBM has entered into several major alliances. Examples of these
alliances are Toshiba, Siemens, and Motorola in process technology, the PowerPC microprocessor alliance
with Motorola and Apple Computer, and work in the area of x-ray lithography with AT&T, Motorola, and Loral.
Management
IBM Corporation
Louis V. Gerstner, Jr.
Peter Draheim
Stanley J. Grubel
Chief Executive Officer, SubMicron Semiconductor Technologies GmbH
Chief Executive Officer, MiCRUS
IBM Microelectronics Division
Michael J. Attardo
General Manager and IBM Senior Vice President
James K. Picciano
General Manager, Applications and Solutions Development
Orest Bilous
General Manager, Manufacturing and Process Development
John C. Gleason
Vice President and Assistant GM, Worldwide Sales and Marketing
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IBM Microelectronics offers the following products:
• Memory ICs—4M, 16M, and 64M DRAMs (standard and low power versions); 16M synchronous DRAMs
(SDRAMs); 4M VRAMs; and 1M fast synchronous SRAMs; as well as SIMMs, DIMMS, and memory cards
• CMOS digital ASICs—gate arrays with gate counts ranging from 50,000 to 1.6 million, standard cell
ASICs, and SRAM- and EEPROM-based FPGAs
• Bipolar analog and mixed-signal ASICs
• CMOS analog and mixed-signal ASICs
• BiCMOS analog and mixed-signal ASICs
• High-performance BiCMOS analog and mixed-signal ASICs
• 6x86, 5x86C, 486 DX4, and 486 DX2 microprocessors (the 5x86C and 6x86 are designed by Cyrix)
• PowerPC™ 600 Series 32-bit and 64-bit RISC microprocessors (clock speeds of up to 150MHz)
• PowerPC™ 400 Series 32-bit RISC embedded controllers
• MC196 16-bit microcontrollers (compatible with Intel’s MCSR-96 16-bit architecture)
• PCI core logic chipsets and PCI-to-PCI bridge chips
• High-end RGB series of palette digital-to-analog converters for 2D and 3D graphics
• Adaptive Lossless Data Compression (ADLC) ICs and MPEG-2 digital video encoders and decoders
• Mwave™ digital signal processing products for multimedia and communications applications
• Deep-UV photoresists
• Semiconductor test equipment
• Semiconductor packaging services for single or multiple chip applications
• Printed circuit boards and cards
• PCMCIA infrared wireless and data/fax modem products and solid state file storage products
It is estimated that at about half of IBM's merchant semiconductor business is represented by memory ICs.
IBM has developed and uses some of the industry's most advanced CMOS processing technologies
including the following: 0.35µm, 0.5µm, and 0.6µm CMOS with up to five layers of metal. The company
unveiled its 0.25µm CMOS 6S process technology in May 1996. While CMOS is the company's principal
technology, various other processes are used, including bipolar, BiCMOS, CBiCMOS, and silicon-germanium
(SiGe).
In early 1996, IBM announced $1.4 billion in fab facility expansions. Included is a $400 million upgrade of
its fab in Vermont to handle 0.35µm and 0.25µm technologies for manufacturing PowerPC MPUs and
embedded controllers, Mwave media chips, and other logic devices. The remaining $1 billion will go toward
the construction of a 64M DRAM production line at its facility in Essonnes, France. The plant will initially
fabricate 16M DRAMs, starting in late 1996 or early 1997. To make space for the 0.35µm CMOS processing
line, IBM’s existing bipolar line at the facility will be closed down.
In August 1995, IBM pledged $1.2 billion to build a new 64M DRAM plant in cooperation with Toshiba at the
site of a closed IBM fab in Manassas, Virginia. IBM and Toshiba will each own 50 percent of the facility,
which will operate under the name Dominion Semiconductor. First silicon is expected from the fab in late
1997, with volume production beginning in 1998.
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Additionally, IBM’s near term fab plans may include another U.S.-based wafer fab. Work on the proposed
fab would begin in 1997 and would likely produce logic chips with geometries of 0.35µm, initially.
East Fishkill Facility
1580 Route 52
Telephone: (914) 894-5647
Process: CMOS
Products: Logic ICs, memories, R&D
(IBM's ASTC—Advanced Semiconductor
Technology Center is located here)
1000 River Street
Essex Junction, Vermont 05452
Telephone: (802) 769-0111
Wafer size: 200mm
Products: DRAMs, SRAMs, logic and linear ICs,
ASICs, MPUs, foundry services
Thomas J. Watson Research Center
Route 134
Yorktown Heights, New York 10598
Telephone: (914) 945-3000
Products: R&D
3605 Highway 52 North
Rochester, Minnesota 55901
Telephone: (507) 253-4011
Products: Prototype ICs
5600 Cottle Road
Telephone: (408) 256-1600
Processes: Bipolar, MOS
Products: R&D and some production
IBM Research Division
Zurich Research Lab
Saumerstrasse 4
CH-8003 Ruschlikon, Switzerland
Telephone: (41) (1) 724-8111
Products: R&D
IBM France
224 Bd. John Kennedy
P.O. Box 58
F-91102 Corbeil Essones-Cedex
France
Telephone: (33) (1) 60-88-51-51
Wafer size: 125mm
Process: Bipolar
Products: MPUs
(Being converted to a 0.35µm CMOS processing
line for the manufacture of DRAMs.)
IBM United Kingdom Labs Ltd.
Hursley Park
North Winchester
Hampshire SO21 2JN
England
United Kingdom
Telephone: (44) (962) 84-4433
Wafer size: 200mm
Products: R&D
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North American Company Profile
IBM/Siemens
Corbeil Essones-Cedex
France
Wafer size: 200mm
Process: CMOS
Products: DRAMs
IBM Duetschland GmbH
Werk Singdelfingen
Postfach 266
Singdelfingen, Germany
Telephone: (49) 7031-910
Processes: Bipolar, CMOS
Products: DRAMs, SRAMs, ASICs, DSPs, MPUs
IBM Japan Ltd.
800 Ohaza Ichimayake, Yasu-Machi
Yasu-gun, Shiga-ken 520-23, Japan
Telephone: (81) (755) 88-2511
Wafer sizes: 125mm-200mm
Process: CMOS
Products: MPUs, DSPs, ASICs, logic ICs
(DRAM production discontinued here in 1996.)
MiCRUS
1580 Route 52
Telephone: (914) 892-2121
Wafer size: 200mm
Process: CMOS
(Joint venture with Cirrus Logic.
SubMicron Semiconductor Technologies GmbH
Schoenaicherstrasse 220
Boeblingen, Germany
Wafer size: 200mm
Process: CMOS
(Joint venture with Philips. The partners plan
to upgrade the fab to handle 0.5µm line
widths. See Key Agreements.)
Dominion Semiconductor LLC
Manassas, Virginia
Wafer size: 200mm
Process: CMOS
Products: DRAMs
(Joint venture with Toshiba. Scheduled to begin
production in early 1998. See Key Agreements.)
Key Agreements
• IBM and Synopsys announced a six-year R&D agreement in February 1996 to jointly develop tools and
methodologies for designing complex ICs with as many as 10 million gates.
• IBM licensed the Rambus ASIC Cell (RAC) high-bandwidth interface technology in early 1996 from
Rambus to use in its SystemCore ASIC megacell library.
• IBM granted licensing rights to Exponential Technology, Inc. to develop and market a new ultra-highperformance BiCMOS microprocessor based on the PowerPC architecture. Volume shipments of
Exponential’s MPU are expected to begin in early 1997.
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•
In August 1995, IBM and Toshiba announced they would build a new 64M DRAM plant at the site of a
closed IBM fab in Manassas, Virginia. IBM and Toshiba will each own 50 percent of the facility, which will
operate under the name Dominion Semiconductor. First silicon is expected from the fab in late 1997 with
production beginning in 1998.
• Ramtron signed a manufacturing agreement with IBM in May 1995 for EDRAM production. Under the
agreement, IBM is serving as a foundry for the production of Ramtron-subsidiary Enhanced Memory
Systems' EDRAMs, and IBM has a non-exclusive license to sell the devices.
• In 1994, Philips agreed with IBM Microelectronics to form a joint venture to manufacture ICs at IBM's fab
facility in Boeblingen, Germany. Philips holds 51 percent and IBM 49 percent of the new company, called
SubMicron Semiconductor Technologies GmbH (SMST). SMST is supplying products solely to IBM and
Philips, manufacturing 4M DRAMs for IBM and 0.8µm logic ICs for Philips. The two companies are also
discussing the possibility of additional technology cooperation.
• IBM and Cirrus Logic formed a joint manufacturing venture called MiCRUS in 1994. MiCRUS fabricates
wafers for both companies in a former IBM plant in East Fishkill, New York. IBM and Cirrus Logic own 52
percent and 48 percent of MiCRUS, respectively. The two companies have said they each will invest $160
million in MiCRUS over the next few years to expand its capacity and capabilities. For the time being, the
agreement does not include product and/or technology exchange.
• S3 Incorporated signed an agreement with IBM for the production of S3's graphics accelerators at IBM's
fab in Essex Junction, Vermont.
• The PowerPC RISC architecture has been, and continues to be, codeveloped by IBM, Motorola, and
Apple Computer. The trio of companies are also working on combining the PowerPC technology with an
open hardware platform supporting a range of operating systems.
• IBM is producing 16M and 64M DRAMs with Siemens at their partnership fab in Corbeil-Essones, France.
The two companies are also working with Toshiba and Motorola for the development of 256M DRAMs
based on 0.25µm process technology.
• Toshiba licensed the PowerPC microprocessor technology from IBM Microelectronics. Although Toshiba
was not given the right to sell the PowerPC on the merchant market, it does have the right to develop and
manufacture its own derivatives of the processor. For now, IBM will produce the MPUs for Toshiba.
• National Semiconductor and IBM are working on an isochronous (time-dependent) Ethernet LAN project.
• IBM and Cyrix announced a five-year agreement in early 1994 calling for IBM to manufacture Cyrix's 486,
5x86, and 6x86 microprocessors. The two companies equally share the output of the Cyrix-designed
chips.
• IBM and Analog Devices announced in late 1993 plans to jointly design, produce, and market mixedsignal and RF chips based on IBM's silicon-germanium (SiGe) process technology.
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• In mid-1993, IBM licensed Atmel's fine-grained SRAM-based FPGA architecture. IBM is allowed to use,
modify, manufacture, and sell Atmel's FPGAs. IBM’s first FPGA based on the Atmel architecture were
expected to be introduced in 1H96.
• IBM is working with Motorola, Loral Federal Systems, and Lucent Technologies to establish a
manufacturing infrastructure for x-ray lithography. The team hopes to have a manufacturing capability by
1997.
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IC Works
IC W ORKS
IC Works, Inc.
Telephone: (408) 922-0202
Fax: (408) 922-0833
IC Manufacturer
Sales
1992
5*
1993
21
1994
26
1995
41
85
125
150
200
Employees
*Reflects six months of operation.
IC Works was established in June 1992, when it acquired the San Jose fabrication facility, process
technology, and engineering and manufacturing staff of Samsung Semiconductor, the U.S. business of
Korea’s Samsung. As an independent company, IC Works designs, manufactures, and markets mixedsignal products using its design and in-house facility, and provides quick-turn, submicron foundry services to
selected mixed-signal semiconductor companies.
IC Works operates three complementary mixed-signal businesses—clock products, wireless communications
products, and submicron foundry services.
Memory ICs
3%
Japan
10%
Foundry
44%
Clock Generators
53%
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Europe
10%
ROW
30%
North
America
50%
IC Works
Management
Ilbok Lee, Ph.D.
Aurelio Fernandez
John Hagedorn
John Kelly
Richard Miller
Chen Wang
Vice President, Fab Operations
IC Works' product and services include high-performance clock generator ICs, wireless communication
circuits, and foundry services. New products for the computer and data communications markets are being
developed.
Foundry Services
IC Works’ in-house foundry provides special services to mixed-signal semiconductor companies for the
development, prototyping, and early production of new products.
Clock Products
IC Works offers a wide range of high performance phase-locked-loop (PLL) based clock ICs for system
manufacturers in a variety of markets. The main applications within the clock market include PC
motherboards, communications, mass storage, multimedia, and workstations. Products include clock
buffers and single and dual PLL clocks.
Wireless Communications
Utilizing its PLL and BiCMOS process technologies, IC Works is developing RF solutions for the wireless
marketplace, focusing on data communications.
This product strategy includes development of
component level functional block products and ASSPs.
As part of the buyout, Samsung licensed IC Works to use its scaleable submicron CMOS and BiCMOS
process technologies. Currently, the majority of IC Works’ production wafer output is processed to 0.7µm
design rules with a migration to 0.6µm under way. Future plans include development of finer geometry
processes down to 0.35µm.
IC Works, Inc.
Capacity (wafers/week): 1,200 (expanding)
Products: Mixed-signal ICs, foundry services
Feature sizes: 0.5µm, 0.7µm (0.35µm under development)
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IC Works
IC Works is in the process of expanding its fab capacity with financial support from its three fab partners,
Exar Corporation, Sierra Semiconductor, and TelCom Semiconductor Inc. The $50 million expansion, which
includes moving from 125mm to 150mm wafers, is scheduled to be completed in the first half of 1997.
Key Agreements
•
In 1996, IC Works and Motorola announced a second-source agreement for the development and
manufacture of CMOS and BiCMOS-based mixed-signal timing circuits. Motorola will contribute highperformance timing solutions targeted at workstations, servers, and network applications, while IC Works
will provide “clock” solutions targeting personal computers and peripheral applications.
•
IC Works and Exar announced a $15 million wafer production agreement in 1995, under which IC Works
will provide wafers to Exar over the next five years. As part of the agreement, Exar will purchase and
install equipment in IC Works’ facility to convert it from 125mm wafers to 150mm wafers and improve its
process technology.
•
IC Works has a foundry agreement with TelCom Semiconductor. Under the agreement, TelCom will
invest $10 million in equipment and the expansion of IC Works’ submicron wafer fabrication facility, in
return for wafer capacity.
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ICS
INTEGRATED CIRCUIT S YSTEMS (ICS)
Integrated Circuit Systems, Inc.
2435 Boulevard of the Generals
P.O. Box 968
Valley Forge, Pennsylvania 19482-0968
Telephone: (610) 630-5300
Fax: (610) 630-5399
Web Site: www.icsinc.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1991
21
0.6
6
Employees
1992
37
4
7
1993
78
11
9
1994
94
12
10
1995
104
5
11
224
314
336
219
Founded in 1976, Integrated Circuit Systems, designs, develops, and markets mixed-signal integrated
circuits primarily for data communications, clock, and multimedia applications. The company also provides
custom application specific ICs (ASICs) for the consumer, medical, telecommunications, and aerospace
industries.
ICS’s primary focus is to combine its innovation, market position, and competency in mixed-signal and phase
locked-loop technology to capitalize on the trend convergence of computer, communications, and consumer
applications, especially in the LAN/WAN communications marketplace.
For most of its formative years ICS concentrated on supplying its mixed-signal technology in custom ASIC
designs for OEMs. In the late 1980’s, ICS began to develop proprietary standard products. ICS entered
the frequency timing generator (FTG) business in 1989 with a pioneering FTG for video clocks.
In 1992, ICS completed the acquisition of the Avasem Corporation, the leader in motherboard clocks.
Together, ICS and Avasem offer a breadth of clock products unequaled by any other company.
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ICS
North American Com pany Profiles
Multimedia/
ARK Logic
14%
Turtle Beach
12%
ASICs
19%
Clock ICs
55%
In April 1995, ICS purchased a majority interest in ARK Logic Inc., a Santa Clara, California-based developer
of graphical user interface (GUI) accelerator devices. ARK Logic's graphics controller technology was
merged with ICS's audio and mixed-signal RAMDAC and video clock generator technologies to provide
complete PC multimedia solutions.
In 1995, ICS introduced a line of high-performance transceiver chips designed for international use in the
latest network systems. These devices work in local area networks (LANs) and wide area networks (WANs),
including the newest technologies such as SONET/SDH fiber optic systems, asynchronous transfer mode
(ATM) copper/fiber systems, and fast Ethernet systems.
Sales outside of the United States, primarily to the Pacific Rim, reached approximately 55 percent of total
sales in 1995.
Management
David W. Sear, Ph.D.
N. Werner Anderson
Hock Tan
Perry Denning
Ray Lu
Gregory Richmond
William Weir
John Klein
President, Chief Executive Officer, and Chief Operating Officer
Senior Vice President, Quality Assurance
Senior Vice President, Finance and Administration,
and Chief Financial Officer
President, ARK Logic and Director, Multimedia Business Group
Vice President, FTG Business Group (San Jose, CA)
Vice President, Data Communications Business Group
Director, Custom Products
ICS's products are outlined below. The products are designed and produced using CMOS processing
technologies ranging from 0.35µm to 3.0µm.
Data Communications Products
• Fast Ethernet LAN
• ATM
• SONET/SDH
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Multimedia Audio Products
• Music synthesizers
• Audio codecs (coder and decoders)
• Software for wavetable music synthesis
ICS
Clock Products
• Motherboard timing generators
• Video timing generators
• Graphics timing for workstations
• Special-purpose FTGs for Pentium Pro and
PowerPC microprocessors and chipsets
Turtle Beach Products
• Multimedia sound cards
• CD-ROM Products
• Software
ASIC Products
• Customized, application-specific ICs
Others
• Battery Charger ICs
All of ICS's wafers are currently manufactured by outside foundries, two of which meet a substantial majority
of the company's wafer needs. One of ICS’s foundry partners is AMI.
Key Agreements
• ICS acquired a 51 percent interest in ARK Logic, Inc. in 3Q95. ICS plans to combine its audio design
specialty with ARK’s video graphics expertise to develop a chip that handles 3D graphics, VGA control,
and audio and video processing. ICS may purchase the remaining 49 percent of ARK Logic.
• In October 1992, ICS entered into an alliance with American Microsystems Inc., in which ICS secured
wafer processing capacity through the year 2000.
• ICS licensed DSP Group’s Pine digital signal processing and TrueSpeech voice compression technologies
for use in its next-generation audio components.
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ICT
ICT
ICT Inc.
2123 Ringwood Avenue
Telephone: (408) 434-0678
Fax: (408) 434-0688
Web Site: www.ictpld.com
Fabless IC Supplier
Sales
Employees
1991
6
1992
8
1993
10
1994
12
1995
15
30
50
75
75
80
ICT Inc. was founded in November 1991 after acquiring the business originally established in 1983 by
International CMOS Technology.
ICT is organized into two divisions: the Programmable Logic Division (PLD) and the Personal Computer
Products Division (PCPD). The PLD division designs, develops, and markets user-programmable integrated
circuits specializing in programmable logic devices (PLDs). The PCPD division designs and markets PC core
logic chipsets and peripheral controller products. ICT's products are used by designers of computer,
telecommunication, industrial control, medical, and consumer electronics systems.
Management
Larry Matheny
Volker Cathrein
Edward Barnett
Donald E. Robinson
Web Chang
Manny Pitta
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Chief Financial Officer
Vice President, Special Products
Director, Engineering, PCPD
Director, Marketing, PCPD
ICT
ICT's programmable logic product line consists of two families of CMOS PLDs—PEEL Devices and PEEL
Arrays—in addition to supporting development tools. PEEL Devices are simple PLDs designed as
replacements for standard 20-pin and 24-pin PAL/GAL devices with speed grades ranging from 5ns to 25ns.
PEEL Arrays are complex PLDs (CPLDs) that combine a non-segmented PLA with FPGA-like logic cells with
wide single-level delays as fast as 9ns/15ns (internal/external). PEEL Arrays are used for combinatorial logic,
with clocking frequencies running up to 80MHz for sequential functions.
PEEL
PEEL
PEEL
PEEL
PEEL
PEEL
PEEL
Devices
16V8
18CV8
20V8
20CG10A
22CV8
22CV10A
PEEL Arrays
PA7024
PA7128
PA7140
ICT's PLDs are designed and manufactured using proprietary 0.8µm CMOS EEPROM technology.
The company's PC product line consist of Pentium and 486 portable and desktop core logic chipsets,
programmable peripheral interface ICs, and peripheral controller ICs.
As with other fabless IC suppliers, ICT utilizes external fabrication and assembly facilities. ICT wafers are
currently fabricated by two companies: Chartered Semiconductor Manufacturing of Singapore and Rohm Co.
of Japan. Assembly work is handled by multiple vendors in the Philippines, Thailand, and Taiwan, while
testing functions are performed at the firm's headquarters in San Jose.
Key Agreements
• ICT has a license agreement with AMD involving PLD products.
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IDT
INTEGRATED DEVICE T ECHNOLOGY (IDT)
Integrated Device Technology, Inc.
2972 Stender Way
Telephone: (408) 727-6116
Fax: (408) 727-8043
Web Site: www.idt.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
1992
203
(33)
52
26
1993
236
5
54
28
1994
330
40
64
38
1995
422
78
78
95
1996
680
120
133
n/a
Employees
2,159
2,414
2,615
2,965
3,875
Integrated Device Technology, Inc. (IDT), founded in 1980, designs, manufactures, and
proprietary and industry standard integrated circuits using high-performance CMOS and
technologies. The company's four semiconductor product groups are synergistic, and are
manufacturers of high-performance electronic systems in the desktop computing,
communications, and office automation industries. The product groups are SRAMs,
products (SMPs), logic products, and RISC microprocessors.
Server/
Workstation
11%
RISC
Microprocessors
11%
Military/Other
6%
Desktop
39%
Office
Automation
18%
Communications
26%
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markets complex
BiCMOS process
aimed primarily at
network server,
specialty memory
Logic Products
21%
SRAMs
40%
Specialty
Memory Products
28%
IDT
Asia
10%
Japan
9%
Europe
20%
United States
61%
Management
Leonard C. Perham
Stuart Bardach
Charles R. Clark
William B. Cortelyou
Robin H. Hodge
Alan H. Huggins
Daniel Lewis
Chuen-Der Lien
John R. Mick
Danny R. Morris
Alex Naqvi
Bob Phillips
Richard R. Picard
Joseph F. Santandea
Christopher P. Schott
William D. Snyder
Thomas B. Wroblewski
Vice President, Quality
Vice President, Subsystems Products
Vice President, Wafer Operations
Vice President, Assembly and Test
Vice President, Memory Division
Vice President, Systems Technology Group
Vice President, FIFO Products
Vice President, Microprocessor RISC Products
Vice President, Logic and Microprocessor Products
Vice President, Special Products
Vice President, Specialty Memory Products
IDT produces SRAMs, specialty memory products (SMPs), logic products, and RISC microprocessors. These
products are designed and manufactured using proprietary advanced submicron CMOS and BiCMOS
process technologies, including the company's newest CMOS VIII 0.5µm process. The next-generation
0.35µm process is due in 1996. IDT's product groups are outlined below.
SRAMs
• Standard fast CMOS and BiCMOS SRAMs with 16K to 1M densities and access times as fast as 12ns.
• 3.3V fast CMOS and BiCMOS SRAMs with 256K and 1M densities and access times as fast as 15ns.
• Cache and cache tag SRAMs for 486, Pentium, PowerPC, and R3000 microprocessors as fast as 7ns.
• High-speed BiCMOS ECL I/O SRAMs with 4K to 1M densities and access times as fast as 4ns.
• High-speed CMOS and BiCMOS module products.
• Will introduce in 1996 its “Fusion Memory”, a combination of DRAM-type circuitry with near high-end
SRAM performance.
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IDT
Specialty Memory Products (SMPs)
• High-speed CMOS and BiCMOS multi-port RAMs with 16K to 256K densities.
• First-in, first-out memories (FIFOs) in synchronous unidirectional or bidirectional and asynchronous
unidirectional or bidirectional versions.
Logic Products
• High-speed FCT and FCT-T CMOS logic devices.
• High-speed complex logic devices.
• ATM transceiver devices.
RISC Microprocessors
• R3000- and R4000-based 32-bit microprocessors, microcontrollers, and cores, as well as the fourth
generation R4600 Orion 64-bit microprocessor.
• RISC subsystems.
Integrated Device Technology
1566 Moffett Street
Salinas, California 93905
Fab 2
Wafer size: 150mm
Process: CMOS
Products: SRAMs, FIFOs, MPUs
2670 Seeley Road
Telephone: (408) 944-0114
Fab 3
Wafer size: 150mm
Products: SRAMs, FIFOs, RISC MPUs, logic ICs, R&D
Hillsboro, Oregon
Fab 4
Capacity (wafers/week): 1,875 (3,000 when fully outfitted)
Wafer size: 200mm
(Began operations in 1Q96)
Key Agreements
• IDT licensed its SRAM, RISC, and other IC technologies to startup South Korean IC producer Iljin Group.
Iljin is expected to start production at its new 200mm fab in 3Q97.
• IDT, a MoSys Inc. foundry and minority investor, will serve as an alternate second-source supplier for a
MoSys Multi-bank DRAM device version called MCache or Fusion Memory.
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IDT
• IDT codesigned its Mips-based Orion 64-bit RISC microprocessor with its partner, Quantum Effect Design.
• IDT is cooperating with Siemens in the production of 32-bit microcontrollers based on the Mips Computer
Systems R3000 architecture. The two parties are also jointly developing 32-bit RISC controller derivatives
for peripherals and embedded-control applications as well as second-sourcing each other's products.
• IDT agreed with Toshiba to codevelop and manufacture derivatives of the R3000/R4000 Mips
microprocessor architecture for embedded control, PC, and Unix markets.
• IDT signed an alternate source agreement with Texas Instruments for logic products. TI and IDT are also
jointly developing FIFO memory devices.
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IMI
INTERNATIONAL MICROCIRCUITS (IMI)
International Microcircuits Inc.
525 Los Coches Street
Telephone: (408) 263-6300
Fax: (408) 263-6571
IC Manufacturer
Employees
70
International Microcircuits Inc. (IMI) was formed in 1972 to manufacture high quality chrome photomasks.
With the invention of the CMOS gate array two years later, IMI pursued a new business and an engineering
philosophy to which it has adhered.
In the early 1990's IMI began developing niche application specific standard products (ASSPs), building on
its years of experience in ASICs. The company has a particular strength in the area of frequency synthesis
using phase-locked loop (PLL) techniques.
Management
Frank Deverse
Charlie Stimson
Orhan Tozun
Ed Walsh
Vice President, Sales and Marketing, and Chief Financial Officer
IMI's products are focused on two major applications: frequency synthesis for telecommunications and clock
generation for digital systems. These products include clock generation devices for PC motherboards
(including those based on the latest CISC and RISC processors) and PLLs and phase detectors for cellular
phones, cordless phones, satellite receivers, and cable TV boxes.
International Microcircuits Inc.
525 Los Coches Street
Wafer size: 150mm
Process: CMOS
Products: ASSPs
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IMP
IMP
IMP, Inc.
Telephone: (408) 432-9100
Fax: (408) 434-0335
Web Site: www.impweb.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1992
46
(6)
9
0.2
1993
56
(2)
10
2
1994
48
0.4
9
5
1995
60
1
9
5
1996
77
5
10
n/a
331
324
340
400
425
IMP was founded in 1981 as International Microelectronic Products, but changed its name to IMP, Inc. in
1993. Originally in the custom IC business, IMP began marketing its silicon foundry in 1987 and exited the
custom IC business in 1990 with the introduction of its first standard product. IMP is now comprised of two
business groups, the Application-Specific Standard Products group and the Customer-Specific Products
group.
The company's ASSP group designs, manufacturers, and markets a proprietary line of value-added ICs for
tape and disk drive manufacturers. The CSP group provides a wide range of CMOS IC manufacturing
processes (specializing in mixed-signal) to companies in the computer and computer peripherals markets, as
well as to fabless semiconductor companies and IMP's own ASSP group. Value-added processes include
0.8µm CMOS, EECMOS, 3-volt, and BiCMOS.
Europe and
Pacific Basin
21%
ASSPs
18%
North America
79%
CSP
82%
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IMP
To address the need for wafer capacity by small fabless startup companies, IMP announced the
establishment of its Silicon Venture Partners (SVP) program in May 1995. Under the SVP program, IMP
provides access to wafer fabrication capabilities to fabless semiconductor startups. This includes absorbing
some of the expenses of developing and producing a new IC in exchange for product, marketing, and/or
technology rights, a share of future profits, or other compensation.
Management
David A. Laws
Charles S. Isherwood
Russ Almand
Jerry Block
Robert J. Crossley
Jerry L. DaBell
Moiz B. Khambaty, Ph.D.
Eugene J. Vaatveit
Vice President, Materials
Vice President, Administration
Vice President, Product Development and Applications
Application-Specific Standard Products
• High-frequency programmable filters for tape and disk drives.
• Read channel ICs with both 3V and 5V operation for tape and disk drives.
• Electrically programmable analog circuits (EPAC™)—Analog counterparts to digital FPGAs that are
designed for signal conditioning applications in the sensor, instrumentation, and industrial control
markets. The EPACs are based on IMP's mixed-signal 1.2µm EECMOS process.
Customer-Specific Products—IMP provides specialized or value-added foundry services. The firm is capable
of running multiple processes in the same fab.
• CMOS Analog Processes: For analog and mixed-signal applications in mass storage products, fax
modems, local area networks, cellular phones, and computers.
• EECMOS Process: Suitable for customization or personalization of customer designed circuits through
on-chip electrical programming.
• High-Voltage Processes: Allows a chip to be designed with some sections functioning up to 18 volts
and other sections at the typical 5 volts.
• 3-volt Processes: To be used with circuits designed for portable system applications.
IMP's process technologies include: 0.8µm double-poly/double-metal CMOS, 1.0µm single- and doublepoly/double-metal CMOS, 1.2µm low-voltage and high-voltage CMOS, 1.2µm double-poly/double-metal
BiCMOS, and 1.2µm double-poly/double-metal EECMOS.
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IMP
IMP, Inc.
Wafer size: 125mm
Processes: CMOS, BiCMOS, EECMOS
Products: ASSPs, ROMs, foundry services
Feature sizes: CMOS: 0.8µm, 1.0µm, 1.2µm, 2.0µm, 3.0µm, 5.0µm
BiCMOS: 1.2µm
EECMOS: 1.2µm
Key Agreements
• In July 1995, IMP signed a five-year foundry agreement with Rockwell Semiconductor Systems for the
fabrication of Rockwell’s mixed-signal modem ICs.
• IMP joined with Zilog and Allegro MicroSystems in a marketing alliance. The team is marketing what they
call a ZIA disk drive chipset, with ZIA standing for Zilog, IMP, and Allegro. IMP's contribution to the ZIA
chipset are the read channel ICs and ROMs.
• In 1992, IMP signed a technology and distribution agreement with Asahi Kasei Microsystems (AKM)
covering ASSPs.
• IMP has a design and process technology transfer agreement with South African Microelectronic Systems
(SAMES). SAMES purchased the rights to IMP's 1.2µm and 2.0µm mixed-signal process technologies
and has been qualified as a second source for IMP high-volume manufacturing processes.
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Integrated Silicon Solution
INTEGRATED SILICON S OLUTION (ISSI)
Integrated Silicon Solution Inc.
680 Almanor Avenue
Telephone: (408) 733-4774
Fax: (408) 245-4774
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1991
10
(1)
2
1992
29
1
3
Employees
1993
53
6
6
1994
61
5
9
1995
123
30
15
190
228
311
Integrated Silicon Solution, Inc. (ISSI) was founded in 1988 and focused its initial development efforts on
high-performance SRAMs for cache memory applications. The company introduced its first SRAM products
in 1990, and has since expanded its product offerings to include high-speed EPROMs, serial EEPROMs,
and flash memory devices. To date, SRAM sales have accounted for substantially all of ISSI's product
sales.
The majority of the company's sales are derived from Taiwan-based PC motherboard manufacturers, but an
increasing portion is coming from PC, data communications, networking, and telecommunications OEMs in
the U.S. and Asia. ISSI's business in Taiwan is handled by its wholly owned subsidiary, Integrated Silicon
Solution (Taiwan), Inc. (ISSI-Taiwan).
United States/
Europe
44%
Asia
56%
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Management
Jimmy S.M. Lee
Kong-Yeu Han
Gary L. Fischer
Robert B. Cushman
Steve Hsia
Yun S. Hwang
Ming D. Ni
Robert Shen
John Unger
Thomas Doczy
Chie-Siang Hong
Executive Vice President, and General Manager, ISSI-Taiwan
Executive Vice President, Finance and Administration
Vice President, Design Engineering
Vice President, DSP Products
Vice President, Manufacturing and Corporate Planning
Senior Director, Quality Assurance
Director, North American Sales
Director, Test and Product Engineering
ISSI designs and markets a family of high-performance SRAMs, as well as several families of nonvolatile
memory products, such as high-speed, high-density EPROMs, serial EEPROMs, and flash memories. In
addition to new SRAM and nonvolatile products, the company is developing a memory-intensive applicationspecific DSP device that incorporates its memory technology.
SRAM Products
• 5V SRAMs in 64K, 256K, 512K, and 1M density levels with access speeds as low as 10ns.
• 3.3V SRAMs in 256K, 512K, and 1M density levels with access speeds as low as 12ns.
• 3.3V 1M synchronous SRAMs for Pentium and PowerPC cache applications.
EPROM Products
• 5V EPROMs in 256K, 512K, and 1M density levels with access speeds of 30ns to 90ns.
• 3.3V EPROMs in 512K and 1M density levels with 90ns access times.
• 2.4V voice EPROMs with embedded speech algorithm technology.
EEPROM Products
• 3.3V and 5V serial EEPROMs in 1K, 2K, and 4K density levels.
Flash Memory Products
• 1M Intel-compatible bulk-erase flash memories. The company plans to introduce a 2M bulk-erase and
1M, 2M, and 4M boot block flash chips in 1996.
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ISSI develops its advanced CMOS process technology in collaboration with its Asian manufacturing partners.
Through these alliances, ISSI has jointly developed and taken into production five generations of CMOS
memory technology with 1.2µm, 1.0µm, 0.8µm, 0.6µm, and 0.5µm feature sizes. The company currently
has several development programs with Taiwan Semiconductor Manufacturing Company (TSMC), including
a program based on a 0.35µm design for advanced SRAM applications and a 0.5µm design for a highspeed flash memory product. The company also has collaborative programs with Chartered Semiconductor
Manufacturing (CSM) in Singapore for 0.5µm SRAM process technology and with Belling Semiconductor in
China for EEPROM design and process technology.
ISSI has adopted the fabless manufacturing strategy. Its principal manufacturing partner is TSMC, with
whom it also jointly develops process technology. In 1995, 90 percent of ISSI’s wafer capacity was supplied
by TSMC. Since 1993, ISSI has also used Chartered as a foundry for some SRAM and flash products. ISSI
also has agreements with United Microelectronics Corporation (UMC), and Vanguard Semiconductor, both
located in Taiwan, for additional supply of wafers. (see Key Agreements below).
Key Agreements
• In early 1996, ISSI announced an agreement with Intel. ISSI is licensing flash-related patents from Intel
and will pay royalty fees to Intel for the sales of certain flash-based products.
• In fiscal 1995, ISSI and UMC signed a manufacturing and joint venture agreement. Under terms of the
agreement, ISSI will invest $30 million for equity in a joint manufacturing venture that will provide ISSI with
an additional supply of wafers beginning in 1997. In the interim, ISSI has secured foundry capacity with
UMC for its wafer supply in 1996.
• ISSI has an agreement with Vanguard Semiconductor, located in Taiwan, for Vanguard’s SRAM wafers.
Under the agreement, Vanguard will supply ISSI with certain SRAM wafers in exchange for the right to sell
specified quantities of the wafers under the Vanguard name.
•
ISSI has a collaborative development effort with Rohm Corporation for flash memory products.
1-154
Intel
INTEL
Intel Corporation
2200 Mission College Boulevard
P.O. Box 58119
Santa Clara, California 95052-8119
Telephone: (408) 765-8080
Fax: (408) 765-1821
Web Site: www.intel.com
IC Manufacturer
Sales
IC Sales
Net Income
R&D Expenditures
Employees
1991
4,779
3,900
819
618
948
1992
5,844
4,950
1,067
780
1,228
1993
8,782
7,550
2,295
970
1,933
1994
11,521
9,850
2,285
1,111
2,441
1995
16,202
13,590
3,566
1,296
3,550
24,600
25,800
29,500
32,600
41,600
Intel Corporation was established in 1968 to pursue the potential of integrating large numbers of transistors
into silicon chips. The company created the first DRAM, the first EPROM, and the first microprocessor,
revolutionizing the electronics industry by making possible small and powerful computing systems. Intel
originally flourished as a MOS memory supplier. However, in 1985 Intel abandoned the DRAM business, in
favor of microprocessors.
Today, Intel is by far the world's leading supplier of MOS microprocessors. The company's other principal
products are microprocessor peripherals, motherboards, network and communications products, embedded
controllers, and flash memory devices. Its IC products are sold to manufacturers of computer systems and
peripherals, automotive equipment, industrial systems, and telecommunications products.
1-155
Intel
Systems/
Other
16%
Flash Memories
4%
Asia Pacific
12%
Microcomponents
80%
Japan
11%
Europe
28%
North
America
49%
Thanks to strong demand for its microprocessors, Intel grew to become the world's largest semiconductor
manufacturer in 1993. Part of Intel's strategy to maintaining momentum and supporting demand for its
products is heavy reinvesting with its profits. Since 1991, Intel has invested more in new plants and
equipment each year than any other semiconductor company in the world. The company expects to
expend approximately $4.1 billion for capital additions in 1996.
Intel believes that communications and multimedia will be decisive areas for the PC industry in the next
decade. For this reason, the company continues to introduce new hardware and software products for local
area network (LAN) management and personal computer conferencing systems. Intel is also pushing its
multimedia extension (MMX) technology, which the company says speeds up the execution of multimediarelated functions by routing compute-intensive code to the central processor, rather than through dedicated
silicon. The first processor to use the MMX instruction set will be the Pentium P55C in 4Q96. Intel’s other
chips are expected to gain MMX capability in 1997.
Management
Andrew S. Grove
Craig R. Barrett
G. Carl Everett, Jr.
Frank C. Gill
David L. House
Paul S. Otellini
Gerhard H. Parker
Robert W. Reed
Leslie L. Vadasz
Ronald J. Whittier
Albert Y. C. Yu
Michael A. Aymar
Andy D. Bryant
Dennis L. Carter
Sunlin Chou
Jean-Claude Cornet
Richard DeLateur
1-156
Senior Vice President and GM, Desktop Products Group
Senior Vice President and GM, Intel Products Group
Senior Vice President and Director, Corporate Strategy
Senior Vice President and Director, Sales
Senior Vice President and GM, Technology and Manufacturing Group
Senior Vice President and GM, Semiconductor Products Group
Senior Vice President and Director, Corporate Business Development
Senior Vice President and GM, Intel Architecture Laboratories
Senior Vice President and GM, Microprocessor Products Group
Vice President and GM, Intel486 Microprocessor Division
Vice President and Director, Corporate Marketing Group
Vice President and Director, Components Technology Development
Vice President and Director, Microprocessor Technology
Intel
Michael Fister
Hans Geyer
Robert T. Jenkins
D. Craig Kinnie
Michael Maibach
Sean Maloney
David Marsing
Edward A. Masi
Stephen P. Nachtsheim
Jacob Pena
David Perlmutter
Pamela Pollace
William Siu
Stephen Smith
Michael R. Splinter
Vice President, Microprocessor Products Group
Vice President and GM, Intel Europe
Vice President and Director, Corporate Licensing
Vice President and Director, Architecture Development Lab
Vice President, Government Affairs
Vice President, Technology and Manufacturing Group
Vice President and GM, Scalable Systems Division
Vice President and GM, Mobile and Handheld Products Group
Vice President and GM, Components Manufacturing
Intel's principal products are microprocessors, core logic chipsets based on the PCI bus, embedded
processors and microcontrollers, flash memory chips, computer modules and boards, network and
communications products, personal conferencing products, and scalable parallel processing computers.
Some of these products are described in more detail below.
• Microprocessors—Intel's 32-bit microprocessors include the Intel486 family, the fifth-generation Pentium
family, and the sixth-generation Pentium Pro family. The leading edge Pentium is a 3.3-volt 166MHz
processor. The Pentium Pro, which is available in 150MHz, 166Mhz, 180MHz, and 200MHz speed
grades, makes use of RISC-like techniques that Intel has chosen to call "dynamic execution". Intel
announced in early 1996 that it would phase out its commercial-grade 486SX2 and DX processor lines by
the end of 1997. The company will continue to offer 486SX, DX2, and DX4 MPUs, as well as its new
ultra-low-power 486SX, but only for embedded applications.
• Embedded Processors and Microcontrollers—This product line includes the company's i960 family of 32bit RISC processors, Intel386 and Intel486 processor cores, the 80C196 microprocessor family, and 8-bit
and 16-bit microcontrollers.
• Flash Memory Chips—Intel continues to be the largest flash memory producer. The company provides a
broad line of flash memory devices, with densities ranging from 1M to 16M. In early 1996, Intel
announced that it was scaling back production of low-density (256K and 512K) flash parts to open up
capacity for higher density devices.
• Computer Boards and Modules—A significant portion of Intel's Pentium processors are sold as board-,
system-, or module-level products to OEMs.
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Intel
Intel uses advanced CMOS and BiCMOS process technologies in the manufacture of its integrated circuits.
In 1995, most of Intel’s IC products were manufactured using 0.6µm process technology. During 1996, the
company will aggressively migrate its microprocessor production to the 0.35µm level. In fact, by the end of
1996 Intel expects the majority of its processors will be at 0.35µm. The company expects to begin
fabricating chips using 0.25µm process technology in 1997. Some of Intel’s products are still manufactured
with 0.8µm and 1.0µm process technologies.
During 1995, Intel announced the construction of three new 200mm wafer fabs, one in Oregon (Fab 13),
one in Ireland (Fab 14), and one in Israel (Fab 18). Fab 13 will be part of a $2.2 billion campus that will
initially be used for research and development, but eventually volume production of the company's Pentium
Pro and future P7 microprocessors. The first phase will cost $565 million and is scheduled to come on-line in
1997, at which time the company's aging Fab 4 facility at the site will be closed down.
Fab 14 is an expansion of the existing Fab 10 in Ireland. It will be used to manufacture microprocessors in
generations beyond the Pentium Pro. Completion of the $1.5 billion plant is scheduled for 1998.
In Israel, the $1.6 billion Fab 18 will be used for the production of flash memory chips beginning in 1998.
The factory was named out of sequence because 18 is said to be a lucky number in Hebrew tradition.
Intel Corporation
3585 Southwest 98th Avenue
Aloha, Oregon 97007
Telephone: (503) 681-8080
Fabs D1A
Wafer size: 200mm
Process: CMOS
Products: MPUs, R&D
Intel Corporation
3601 Juliet Lane
Telephone: (408) 496-9023
Fab D2
Wafer size: 200mm
Products: MPUs, R&D
Intel Corporation
5200 N.E. Elam Young Parkway
Aloha, Oregon 97124-6497
Telephone: (503) 681-8080
Fab 4 (To be closed in early 1997)
Wafer size: 100mm
Processes: NMOS, CMOS
Products: MPUs, MCUs, EPROMs
Intel Corporation
2111 Northeast 25th Avenue
Aloha, Oregon 97124
Telephone: (503) 681-8080
Fab 5
Wafer size: 150mm
Products: Logic and memory ICs, MPUs
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Intel
Intel Corporation
5000 West Chandler Boulevard
Chandler, Arizona 85226-3699
Telephone: (602) 554-8080
Fab 6
Wafer size: 150mm
Processes: NMOS, CMOS
Products: MPUs, MCUs
Intel Corporation
4100 Sara Road SE
Rio Rancho, New Mexico 87124
Telephone: (505) 893-7000
Fab 7
Wafer size: 150mm
Process: CMOS
Intel Israel, Ltd.
Jerusalem, Israel
Fab 8
Wafer size: 150mm
Process: CMOS
Products: MPUs
Intel Corporation
4100 Sara Road SE
Rio Rancho, New Mexico 87124
Telephone: (505) 893-7000
Fab 9
Wafer size: 150mm
Products: MPUs, flash memories
Intel Ireland, Ltd.
Collinstown Industrial Park
Leixlip, County Kildare, Ireland
Telephone: (353) (1) 707-7000
Fab 10
Wafer size: 200mm
Process: BiCMOS
Products: MPUs
Intel Corporation
4100 Sara Road SE
Rio Rancho, New Mexico
Telephone: (505) 893-7000
Fab 11
Wafer size: 200mm
Processes: BiCMOS, CMOS
Products: MPUs
Intel Corporation
Chandler, Arizona
Fab 12 (Startup in 1997)
Wafer size: 200mm
Process: CMOS
Products: MPUs
Intel Corporation
Hillsboro, Oregon
Wafer size: 200mm
Process: CMOS
Products: R&D, MPUs
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Intel
Intel Ireland, Ltd.
Collinstown Industrial Park
Leixlip, County Kildare, Ireland
Telephone: (353) (1) 707-7000
Wafer size: 200mm
Process: CMOS
Products: MPUs
Intel Israel, Ltd.
Kiryat Gat, Israel
Wafer size: 200mm
Process: CMOS
Intel has semiconductor assembly and test facilities in Malaysia and the Philippines. In addition, the
company is building a new assembly and test factory in Shanghai, China, scheduled for completion in 1997.
Key Agreements
• Integrated Silicon Solution Inc. (ISSI) licensed flash memory-related patents from Intel in early 1996.
• Intel and AMD signed a five-year patent cross-licensing agreement near the end of 1995 giving the two
companies rights to use each other’s MPU-related patents and certain copyrights—excluding
microprocessor code. AMD agreed not to use Intel microcode beyond the 486 MPU generation.
• In October 1995, Intel and flash memory card maker SanDisk agreed to cross-license the full inventory of
their respective flash memory patent portfolios. The deal does not include a physical exchange of
technology.
• Intel entered a cross-licensing agreement with Micron Technology covering Intel's full range of flash
memory patents and products.
• Intel and Hewlett-Packard announced a wide ranging joint research and development alliance in 1994
under which the partners are seeking to design a superior next-generation 64-bit microprocessor by 1998.
The processor will be binary-compatible with both Intel x86 code and HP PA-RISC code.
• Intel announced that it signed a 10-year licensing agreement with Sharp Corporation to co-develop 0.6µm
and 0.4µm processes for Intel's flash memory ICs. Sharp currently manufactures a significant portion of
Intel’s flash memory products on a foundry basis.
• Intel and Philips extended a patent cross-license agreement they made in 1977 to include all of each
other's semiconductor devices except certain proprietary Intel MPUs and Philips video products. The
agreement is now valid until the year 2000.
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Interdesign
INTERDESIGN
Interdesign Custom Arrays Corporation
525 Del Ray Avenue
Telephone: (408) 749-1166
Fax: (408) 749-1718
Fabless IC Supplier
Founded in 1984, Interdesign is a member of the ELEX Group of companies headquartered in Belgium.
Through its association with ELEX, Interdesign offers mixed-signal CMOS custom and standard cell ASICs in
addition to its own MM and MV bipolar arrays.
The ELEX Group also has a wafer foundry, X-FAB, located in Germany with technologies that include N-well
and P-well CMOS, vertical DMOS, MOS analog to 40V, and micro sensors. Foundry services are available
to U.S. semiconductor and sensor companies, through Interdesign acting as an interface between the
foundry and the customers.
"Interdesign" has been registered as a trademark and the company has commenced doing business as
Interdesign.
Management
Robert W. Townley
William H. Hass
President
Interdesign supplies mixed-signal CMOS ASICs, both custom and standard cell.
Interdesign occupies an 8,000-square-foot facility devoted to assembly, test, and engineering.
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International Rectifier
INTERNATIONAL RECTIFIER (IR)
International Rectifier Corporation
233 Kansas Street
El Segundo, California 90245
Telephone: (310) 322-3331
Fax: (310) 322-3332
Web Site: www.irf.com
IC Manufacturer
Sales
IC Sales*
Net Income
R&D Expenditures
1991
253
12
16
8
14
1992
265
15
9
9
35
1993
282
17
(3)
14
17
1994
329
22
16
16
25
1995
429
29
39
20
107
Employees
2,700
3,000
2,700
3,100
3,310
*Calendar year
International Rectifier (IR) was founded in 1947 and is today a major worldwide manufacturer of power
semiconductors with applications in the automotive, consumer electronics, computer/peripheral, industrial,
lighting, telecommunications, and government/space markets.
The company's growth products for fiscal 1995 included HEXFET® power MOSFETs, insulated gate bipolar
transistors (IGBTs), control ICs, and high-performance diodes. In control ICs, new development efforts
concentrate on devices tailored to their applications. New control ICs are tuned to specific power levels,
features, and circuit topologies in motor control, lighting, and power supply applications.
Asia
26%
North America
46%
Europe
28%
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Management
Alexander Lidow
Derek B. Lidow
Robert J. Mueller
Michael P. McGee
Gene Sheridan
Executive Vice President, External Affairs and Business Development
Director, Strategic Product Marketing
IR manufactures power semiconductors, including HEXFET power MOSFETs, IGBTs, power ICs, diodes,
rectifiers, thyristors, and standard and custom power modules.
In late 1995, IR introduced its next-generation manufacturing technology, a four-step mask, low-voltage
process called Gen 5. The Gen 5 process is already being used at the company’s Temecula fab.
(HEXFET America)
41915 Business Park Drive
Temecula, California 92390
Telephone: (714) 676-7500
Processes: CMOS, MOS
Products: Discretes, power ICs
233 Kansas Street
El Segundo, California 90245
Telephone: (310) 322-3331
Wafer size: 100mm
Products: Discretes, power ICs
International Rectifier Italiana, S.p.A.
Via Privata Liguria 49
10071 Borgoro, Turin, Italy
Telephone: (39) 11-470-14-84
Wafer size: 100mm
Products: Discretes
Key Agreements
• International Rectifier signed a cross-licensing and alternate-source agreement with Motorola covering
power ICs and power discretes.
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ISD
INFORMATION STORAGE DEVICES (ISD)
Information Storage Devices, Inc.
2045 Hamilton Avenue
Telephone: (408) 369-2400
Fax: (408) 369-2422
Web Site: www.isd.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1991
0.2
(3)
1
Employees
1992
5
(3)
1
1993
23
—
2
1994
39
4
3
1995
55
6
7
70
122
Information Storage Devices, Inc. (ISD), designs, develops, and markets integrated circuits for voice
recording and playback using the company’s proprietary ChipCorder™ storage technology. The company’s
ChipCorder products are targeted at the consumer, communications, and industrial market segments.
In 1991, ISD introduced its first commercially available products—non-volatile chips that store analog signals
in analog form. From its inception in December 1987, ISD's charter has been to develop such devices for
storage of voice, music, and other forms of analog information on a single chip.
ISD's storage technology is adaptable to a variety of small form factor applications, such as hand-held
products, alarms, answering machines, cellular phones, greeting cards, and implantable medical devices.
The firm's original chips were capable of storing up to 20 seconds of information. However, ISD claims parts
based on a new 0.8µm process will be able to store 180 seconds of information. The company has received
eight patents with several others pending. ISD became a public company in February 1995.
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ISD
Europe
7%
United States
35%
Asia
58%
Management
David L. Angel
Trevor Blyth
Michael Geilhufe
Genda Hu
Scott Owen
Felix J. Rosengarten
Steve Stephansen
Al Woodhull
Vice President, Advanced Development
Vice President, Quality and Reliability
Vice President, Engineering and Chief Operating Officer
Vice President, Marketing, Sales, and Business Development
ISD's ChipCorder™ products are solid-state memory devices based on flash technology that store analog
signals in a multi-level format. The company currently offers five product families incorporating its ChipCoder
Technology. All of the company’s ChipCoder products feature an on-chip oscillator, microphone preamplifier,
automatic gain control, anti-aliasing filter, smoothing filter, and speaker amplifier. The devices are being built
using 0.8µm, 1.2µm, and 1.5µm CMOS technology.
ISD currently has foundry agreements with Rohm, Sanyo, and Samsung.
Key Agreements
• ISD formed an agreement with Samsung to jointly develop and market products based on ISD's
ChipCorder technology for the recording and playback of voices. The deal also guarantees ISD a portion
of Samsung's fab capacity.
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IXYS
IXYS
IXYS Corporation
3540 Bassett Street
Telephone: (408) 435-1900
Fax: (408) 435-0670
Web Site: www.ixys.com
Fabless IC Supplier
IXYS Corporation designs, develops, and markets a broad spectrum of power semiconductors, integrated
circuits, and modules for the global power market. IXYS products are incorporated into various industrial,
commercial, and military systems.
Founded in 1983, IXYS has been an innovator in power MOS semiconductor products and technologies
since its inception. However, it has differentiated itself by focusing on the higher voltage and higher power
end of the MOSFET and IGBT spectrum. The company's strategy is to provide cost-effective systems
solutions for its target markets. To that end, it provides several lines of low-cost chipsets for various
applications.
In April 1989, IXYS acquired the Asea Brown Boveri (ABB) power semiconductor operation in Lampertheim,
Germany. Now called IXYS, GmbH, the firm is recognized for pioneering direct copper bonding-to-ceramic
packaging technology and provides IXYS with a strong foothold in the European market.
Management
Nathan Zommer, Ph.D.
Peter Ingram
Arnold Agbayani
Rich Fassler
Managing Director, IXYS Semiconductor GmbH
The IGBT discrete and IGBT module product lines are the company's flagship products. They are targeted
at the AC motor drive market first and at electric vehicles for the long-term market.
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IXYS
IXYS's major product lines include:
Modules
• IGBT modules
• High current thyristor and rectifier modules
• Rectifier bridges
• Custom (customer-specific) power modules
Discretes
• IGBTs
• MegaMOS FETs
• HiPer FET™
• Ultra-fast recovery epitaxial diodes (FREDs)
• High-current rectifiers and switching current regulators
• High-power thyristors and rectifiers
Smart Power ICs
• High-voltage current regulators
• Half-bridge (high side/low side) smart power ICs
• Pulse width modulation controllers
For the design of its products, IXYS uses a proprietary HDMOS (high performance DMOS) technology, which
is compatible with standard bulk CMOS.
The company’s semiconductor products are fabricated in external wafer fabrication facilities through
technology and foundry relationships with a number of semiconductor companies throughout the world.
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Lansdale Semiconductor
LANSDALE S EMICONDUCTOR
Lansdale Semiconductor, Inc.
2502 West Huntington Drive
Telephone: (602) 438-0123
Fax: (602) 438-0138
Web Site: ssi.syspac.com/~lansdale
IC Manufacturer
Sales
Net Income
1991
9
2
1992
7
0.5
1993
7
—
1994
6
—
1995
8
—
Employees
40
38
40
45
50
Founded in 1964, Lansdale Semiconductor is a semiconductor life cycle extender dedicated to
manufacturing past and present technologies as long as the market requires them. The privately-held
company is a strategic resource for critical military programs, telecommunications systems, and
semiconductor OEMs wishing to offer their products longer than the normal lifecycle dictates.
The company purchases lines as they are discontinued by large semiconductor companies such as Intel,
Signetics, Harris, National, and Motorola. It actively seeks new product licenses from semiconductor
manufacturers as part of its niche strategy and supports OEM semiconductor companies by manufacturing
wafers on a foundry basis to extend their product lifecycles.
Military weapons systems typically operate for approximately 25 years while the commercial lifecycle of a
semiconductor chip is about seven years. Lansdale manufactures and supports these products on a
continuing basis making it possible to extend the lifecycles of the system and its products.
Management
R. Dale Lillard
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Owner and President
Lansdale Semiconductor
Lansdale's current product lines (about 2,600 parts) include NMOS 8-bit MPUs and bipolar general purpose
logic, MPU, SRAM, PROM, and linear ICs, as well as bipolar full custom devices.
Original Manufacturer
AMD
Raytheon
Signetics
Motorola
Harris
National
Intel
Product Line
Digital Bipolar ICs
DTL 200 Series ICs
DTL, TTL ICs, 54LS, 82S, 54S, 54H, LSI, 8X
SUHL ICs, 5400 TTL, 3000 TTL, 900 DTE, RTL, Linear
0512 Bipolar PROMs, 7600 Bipolar PROMs/Diode Matrices
PMOS ICs
8080A and peripherals, 828x Peripherals
Lansdale Semiconductor, Inc.
2502 West Huntington Drive
Wafer sizes: 100mm, 3in
Processes: Bipolar, LS, Linear, TTL
Products: Foundry service, Bipolar ICs
Feature size: 3µm, two-layer metal
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Lattice Semiconductor
LATTICE S EMICONDUCTOR
Lattice Semiconductor Corporation
5555 Northeast Moore Court
Hillsboro, Oregon 97124-6421
Telephone: (503) 681-0118
Fax: (503) 681-0347
Web Site: www.latticesemi.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
Employees
1992
71
11
13
1993
103
17
17
1994
126
22
21
1995
144
27
23
1996
198
42
27
263
352
355
438
450
Lattice Semiconductor, founded in 1983, is a leader in the design, development, and marketing of highdensity and low-density, high-speed EECMOS programmable logic devices (PLDs) and related software
development systems. Its proprietary Generic Array Logic (GAL® ), pLSI® , and ispLSI® devices are sold
worldwide, primarily to OEMs of microcomputers, computer peripherals, graphics systems, workstations,
telecommunications gear, military systems, and industrial controls.
Lattice's strategy is to offer a full line of high-performance and cost-effective standard programmable devices
based on innovative architectures while offering design flexibility through reprogrammable technology. The
company supports its products with sophisticated logic development tools providing high functionality at low
cost that can be easily adopted and fully integrated with common third-party CAE development systems.
International
47%
U.S.
53%
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Management
Cyrus Y. Tsui
Albert L. Chan
Stephen M. Donovan
Paul T. Kollar
Steven A. Laub
Rodney F. Sloss
Jerry G. Taylor
Jonathan K. Yu
Kenneth K. Yu
Vice President, California Product Development
Vice President, International Sales
Vice President and General Manager
Vice President, Finance and Secretary
Vice President, Oregon Product Development
Vice President and Managing Director, Lattice Asia
Lattice's base business involves its GAL product family, targeting the low-density simple PLD (SPLD) market.
The company sells the industry standard GAL16V8, GAL20V8, GAL22V10, GAL20RA10, and GAL20XV10
architectures in a variety of speed grades (as fast as 3.5ns), with 5V or 3.3V signal compatibility. Lattice also
offers several proprietary architectures, the GAL26CV12, GAL18V10, GAL16VP8, GAL20VP8, and
GAL6001/2, each of which is optimized for specific applications. In 1994, the company extended its GAL
line by introducing the ispGAL22V10, bringing the advantages of in-system programmability to the low
density market.
Lattice entered the high-density complex PLD (CPLD) market in 1992 by releasing its pLSI® and ispLSI®
1000 product families. The second-generation 1000E family, incorporates familiar GAL-like logic building
blocks and offers performance up to 125MHz (7.5ns) and densities of 2,000 to 8,000 gates. Two of the
company's newer families are the 2000 and 3000 series. The isp/pLSI 2000 family provides speeds of up to
150MHz (5.5ns) and is the first high-density PLD architecture capable of supporting advanced
microprocessors operating at clock speeds over 60MHz. The isp/pLSI 3000 family offers densities of 8,000
to 14,000 gates, while retaining performance up to 110MHz (10ns). In early 1996, Lattice announced it
would begin offering predefined, function-specific memory and counter-timer megacells for its pLSI and
ispLSI CPLD families.
Lattice also offers its ispGDS™ (Generic Digital Switch) family of in-system programmable switching matrices
targeted at mechanical dip switch replacement and connectivity applications.
The company's products are based on a proprietary EECMOS process technology, called UltraMOS® . The
current mainstream process, UltraMOS V, is a 0.65µm, double-metal CMOS technology. Lattice moved its
0.5µm UltraMOS VI process into production in late 1995.
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Most Lattice Semiconductor products are produced by Seiko Epson in Japan. In 1994, Lattice invested $42
million in Seiko Epson for the expansion of Seiko’s submicron wafer fab in Sakata, Japan. The investment
will provide Lattice with additional submicron manufacturing capacity through 1997.
Lattice added Taiwan’s United Microelectronics Corporation (UMC) as a foundry partner in 1995. In October
1995, Lattice said it would invest $60 million over a two-year period for a 10 percent equity stake in one of
UMC’s joint-venture fabs that will come on-line in mid-1997. Additionally, UMC agreed to provide Lattice with
interim wafer capacity from one of its existing fabs.
Key Agreements
•
Lattice entered into a joint venture with UMC and Oak Technology. Lattice will invest $60 million to gain a
10 percent equity stake in a new joint-venture wafer fab UMC is building in Taiwan. The fab is expected
to begin production in mid-1997. UMC also agreed to supply Lattice with wafers from an existing fab until
the new fab comes on line.
•
In 1994, Lattice signed a production agreement with Seiko Epson. As part of the agreement, Lattice
advanced Seiko $42 million to finance additional submicron wafer capacity at its fab in Sakata, Japan. In
1995, Lattice invested an additional $2 million for the development of submicron process technology.
•
Lattice licensed both National and SGS-Thomson to second source its EECMOS PLDs.
•
Lattice has a cross-licensing agreement with AMD under which patents for AMD's PALs have been
exchanged for Lattice's GAL patents.
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Level One
LEVEL ONE C OMMUNICATIONS
Level One Communications Inc.
9750 Goethe Road
Sacramento, California 95827
Telephone: (916) 855-5000
Fax: (916) 854-1101
Web Site: www.level1.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
Employees
1991
6
(3)
1992
14
2
3
1993
26
4
6
1994
47
8
10
1995
78
10
17
48
70
139
221
300
Level One Communications, Inc., founded in 1985, is a leading supplier of silicon connectivity solutions for
complex mixed-signal communications and networking applications. The company name “Level One” refers
to the company’s focus on the physical layer, “layer one”, of the seven layer network model developed by
the International Standards Organization (ISO).
The company specializes in the development of ASSPs, such as transceivers, repeaters, and related
devices used in two key areas of the telecommunications and data communications industry: interface
solutions for digital transmission systems; and local and wide area networking (LAN/WAN) solutions,
including Ethernet LAN, datacom, and digital modems. Most of Level One’s ICs feature complex functions
incorporated on a single silicon chip for applications formerly requiring multiple chips.
In June 1995, the company acquired San Francisco Telecom, which operates as a wholly owned subsidiary
and develops products for the telecommunications market.
Management
Robert D. Pepper, Ph.D.
J. Francois Crepin
George B. Holmes
John Kehoe
Daniel S. Koellen
Manual Yuen
Vice President, Quality and Reliability Assurance
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Level One
Level One’s semiconductor products include T1/E1 transceivers, receivers, repeaters, and clock adapters;
digital subscriber line (DSL) chipsets; PDM multiplexers; and Ethernet transceivers and repeaters.
Level One utilizes several foundries in the U.S., Europe, and the Far East for the fabrication of its ICs.
Key Agreements
•
In 1995, Level One entered into a technology agreement with Maker Communications Inc. for the
development of asynchronous transfer mode (ATM) products.
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Linear Systems
LINEAR SYSTEMS
Linear Integrated Systems, Inc.
4042 Clipper Court
Telephone: (510) 490-9160
Fax: (510) 353-0261
Fabless IC Supplier
Linear Integrated Systems (LIS), a.k.a. Linear Systems, was formed in 1987 with the goal of establishing a
market niche by taking advantage of refractory-metal interconnect technology. Most firms have stayed away
from refractory metals and instead prefer to use CVD and silicon-gate technologies.
Linear Systems specializes in developing integrated circuits for applications in systems where obsolete
devices or processes are no longer available or require upgrading. Existing IC products include operational
amplifiers, voltage references, and multiplexers. Besides proprietary products, Linear Systems also supplies
a broad range of second source and obsolete devices manufactured to customer's requirements.
In addition to semiconductor design and custom manufacturing services, state-of-the-art precision thin film
services are also offered.
Management
John H. Hall
Mark Ashton
Don Howland
Paul Norton
President
General Manager
Manager, Eastern U.S. Marketing
Manager, Western U.S. Marketing
Linear Systems’ proprietary product line includes bipolar linear ICs (e.g., amplifiers, voltage references,
multiplexers) and discretes, as well as full custom bipolar, CMOS, and BiCMOS ICs.
Using CMOS, bipolar, and dielectric isolation processes, Linear Systems offers a family of second-source
products including multiplexers, monolithic dual N-channel JFETs, monolithic dual PNPs and NPNs, switches,
and amplifiers.
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Linear Technology
LINEAR T ECHNOLOGY
Linear Technology Corporation
Telephone: (408) 432-1900
Fax: (408) 434-0507
Web Site: www.linear-tech.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
94
17
10
8
1992
119
25
12
10
1993
151
36
10
8
1994
201
57
9
16
1995
265
85
9
22
730
800
870
1,000
1,350
Linear Technology Corporation (LTC) was founded in 1981 to design, manufacture, and market a broad line
of high-performance standard linear integrated circuits. Its devices monitor, condition, amplify, or transform
continuous analog signals associated with such physical properties as temperature, pressure, weight,
position, light, sound, or speed.
The company targets its product and marketing efforts toward the high-performance segments of the linear
circuit market. Applications for its products include telecommunications; notebook and desktop computers;
video/multimedia; computer peripherals; cellular telephones; industrial, automotive and process controls;
network and factory automation products; and satellites.
Other
17%
Japan
10%
Europe
22%
U.S.
51%
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Linear Technology
Management
Robert H. Swanson, Jr.
Paul Chantalat
Paul Coghlan
Timothy D. Cox
Clive B. Davies, Ph.D.
Robert C. Dobkin
Sean T. Hurley
Thomas D. Recine
Hans J. Zapf
Vice President, Quality, Reliability, and Service
Vice President and Chief Operating Officer
Linear Technology products include: operational, instrumentation, and audio amplifiers; voltage regulators,
power management devices, references, comparators, and data converters; switched-capacitor filters;
communications interface circuits; single-chip data acquisition sub-systems; pulse width modulators; and
sample-and-hold devices. The company markets approximately 4,700 finished part types, of which more
than 80 percent are proprietary.
Linear Technology uses a variety of process technologies in the design and fabrication of its chips, including
standard bipolar, CMOS, BiCMOS, and complementary bipolar, as well as thin-film and laser trimming
technologies.
Fabs 1 and 2
Wafer size: 100mm
Camas, Washington
Fab 3
Wafer size: 150mm
Feature sizes: ≤2.0µm
(Began production in 2Q96)
In early 1995, Linear Technology commenced its own plastic assembly facility in Penang, Malaysia. In the
past, the company exclusively used subcontractors for the assembly of its ICs. Now, approximately half of
the company’s assembly requirements for plastic packages are met by the Malaysian facility.
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Linfinity Microelectronics
LINFINITY MICROELECTRONICS
Linfinity Microelectronics Inc.
11861 Western Avenue
Garden Grove, California 92641-2119
Telephone: (714) 898-8121
Fax: (714) 898-2781
IC Manufacturer
Corporate
Sales
Net Income
Semiconductor
Sales
1991
1992
1993
1994
1995
62
2
69
2
88
6
98
7
103
10
33
27
1
31
2
39
2
40
5
Linfinity Microelectronics Inc. (LMI) is a wholly owned subsidiary of Symmetricom, Inc. (formerly Silicon
General, Inc.). It was founded in 1968 as Silicon General Semiconductors and adopted its current name in
1993. LMI designs, manufactures, and markets linear bipolar, CMOS, and BiCMOS integrated circuits for
industrial, commercial, automotive, and military applications. Linfinity's special area of expertise is in power
management with an emphasis on mixed-signal technology. The company is expanding the value-added
products and services it currently provides for power supply systems, while adding product lines to serve new
areas such as signal conditioning and motion control systems.
Management
Brad P. Whitney
Ralph Brandi
Shufan Chan
Mark Granahan
Kelly Jones
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Vice President, Development
Linfinity's products generally address three main markets: power supply systems, motion control, and signal
conditioning.
Power Supply
Linfinity is a leading supplier of a wide variety of power management products, including pulse width
modulators (PWMs), voltage regulators, supervisory circuits, and power factor conversion chips. Typical
applications for these products include desktop and portable computers, portable communications
equipment, video monitors, automotive entertainment, HVAC products, satellites, and lighting. The new
product focus in this area includes controllers, linear regulators, DC-DC converters, FET drivers, and
voltage supervisors.
Motion Control
Linfinity makes two kinds of motion control integrated circuits: one that controls the spin motor in
computer disk drives and the other controls the position of the read-write head. The new product focus
in this area includes sensorless spindle controllers, voice coil controllers, and brushless DC motor
controllers.
Signal Conditioning
Linfinity's signal conditioning circuits include operational amplifiers, comparators, and voltage references.
Typical applications include instrumentation, industrial controls, telecommunications, and audio
equipment.
Linfinity uses a wide range of process technologies that address linear and mixed-signal product
requirements.
Bipolar
Two main process flows are available in this technology. Option A provides a rugged, high-voltage
(60V), high-power process for applications such as off-line power supplies and motor drivers. Option B
provides a high-performance, low-voltage (20V) process for applications in high-speed, low-noise signal
conditioning equipment.
CMOS
Exhibiting all the characteristics of a good analog CMOS process it provides 18V MOS transistors
coupled with high density 3.0µm feature sizes for optimal packing density. Limited logic capability is
available at this feature size.
BiCMOS
The BiCMOS process combines the Option B bipolar and CMOS processes into a single flow. The
process is idealized for mixed-signal applications requiring excellent analog performance in conjunction
with logic capability. A double-level metal option is available for optimum packing density. Applications
include power supply controllers and high-performance disk drive motor controllers.
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Linfinity Microelectronics Inc.
11861 Western Avenue
Garden Grove, California 92641
Wafer size: 100mm
Processes: Bipolar, CMOS, BiCMOS
Products: Linear ICs, ASICs
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Logic Devices
LOGIC DEVICES
Logic Devices Incorporated
628 East Evelyn Avenue
Telephone: (408) 737-3300
Fax: (408) 733-7690
Web Site: www.logicdevices.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
Employees
1991
19
0.5
2
1992
12
0.1
1
1993
13
0.3
1
1994
13
1
1
1995
17
1
1
87
61
49
44
49
Logic Devices Incorporated was founded in 1983. It develops and markets high-performance digital
integrated circuits for applications requiring high operating speeds and low operating power. Such
applications include computers, workstations, video image processing, medical instrumentation,
telecommunications, and military signal processing.
Logic Devices was founded as a supplier of building-block DSPs, but later entered the growing 1989 SRAM
market. It was driven from the SRAM market in 1992 due to cost and quality problems with its then supplier
of SRAM wafers. Sales of the company's SRAM products rebounded in 1994 and continue to account for
about 20 percent of sales. The company intends to remain a player in fast SRAMs and other niche SRAM
markets, while placing a greater emphasis on DSP devices.
SRAMs
20%
Europe
12%
DSP Devices
80%
Far East
8%
North America
80%
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Logic Devices
In April 1995, Logic Devices acquired Star Semiconductor, which developed the Sproc programmable digital
signal processor architecture. The Sproc architecture enables multiple processors to efficiently share data
via a common memory array, resulting in high processing throughput.
Management
William J. Volz
Todd J. Ashford
Antony G. Bell
William L. Jackson
President
High-speed, low-power CMOS SRAMs and DSP circuits are Logic Devices' principal product lines. Its DSPs
primarily target video editing, broadcast special effects, and studio production applications, where lossless
manipulation of very high bandwidth data is required. The company also offers specialty memories, register
products, and high-performance CMOS SCSI controllers.
Ultrafast SRAM
16K family
64K family
256K family
1M family
Fast Logic
Pipeline registers
Register files
Shadow registers
Computational
Multipliers
Multiplier-accumulators
Filters
Arithmetic logic units
Digital correlators
Barrel shifters
Interface
SCSI bus controllers
Specialty Memory
Cache-tag memories
Resettable memories
Cache-data memories
FIFOs
The company's chips are produced using 0.8µm and 1.0µm CMOS technologies, and it expects to employ a
0.5µm CMOS process in 1996.
Logic Devices has teamed with two foundry partners to manufacture its products: Oki in Japan and TSMC in
Taiwan. In December 1995, Logic Devices announced a foundry agreement with Zentrum Mikroelektronik
Dresden (ZMD), for wafer supply in 1996.
1-182
LSI Computer Systems
LSI C OMPUTER SYSTEMS
LSI Computer Systems, Inc.
1235 Walt Whitman Road
Melville, New York 11747-3086
Telephone: (516) 271-0400
Fax: (516) 271-0405
Fabless IC Supplier
LSI Computer Systems, Inc. (LSI/CSI) began operations in 1969 and is thought to be the world’s first
“fabless” semiconductor company. The privately held company utilizes a broad array of LSI process
technologies in the design of full custom and standard ICs for products in applications ranging from
consumer and industrial to military and aerospace.
LSI Computer Systems is recognized as one of the leading suppliers of lighting control ICs and full custom
ICs, and was the first company to develop and market ICs for brushless DC motors.
Management
Al Musto
LSI Computer Systems supplies both standard and full custom ICs. Its standard ICs include programmable
digital delay timers, CMOS dividers, incremental encoder interface chips, counters, melody generators,
lighting control ICs, AC and brushless DC motor controllers, LCD drivers, telephone line switch controllers,
and programmable digital lock circuits.
The company’s analog and digital full custom IC service is called Extra-Custom. The use of several external
wafer foundries that offer a broad range of process technologies makes the Extra-Custom service flexible in
meeting the needs of a variety of applications. LSI Computer Systems custom designs every detail of each
Extra-Custom IC thereby providing protection of the customer’s proprietary product techniques.
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LSI Logic
LSI LOGIC
LSI Logic Corporation
Telephone: (408) 433-8000
Fax: (408) 433-7715
Web Site: www.lsilogic.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
1991
698
8
81
74
1992
617
(110)
79
143
1993
719
54
79
88
1994
902
109
99
166
1995
1,268
238
124
233
Employees
4,000
3,400
3,370
3,750
3,750
LSI Logic is a leading designer and manufacturer of high-performance ASICs and related products and
services. Founded in 1981, the company uses advanced process technology and design methodology to
design and develop highly complex ASICs and other integrated circuits. Customers of LSI Logic are
primarily original equipment manufacturers (OEMs) in the electronic data processing, telecommunications
and certain office automation industries. Within these industries, the company emphasizes digital video,
networking, desktop and personal computing, and wireless communication applications.
As process technology becomes more sophisticated, allowing greater density and increased functionality,
the "system-on-a-chip" is becoming the foundation of LSI Logic's business. Its CoreWare® methodology
and submicron process technologies permit its customers to combine microprocessor "engines", logic blocks
(including industry standard functions, protocols, and interfaces), and memory with their own proprietary logic
on a single chip.
LSI Logic’s CoreWare technology is at the center of its shift toward more consumer and communications
products. In 1995, these two segments accounted for 44 percent of the company’s revenue. The firm
estimates that in the year 2000, communications and consumer markets will account for 65 percent of total
revenues.
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LSI Logic
ASIC Design and Services
6%
Europe
16%
Component Products
94%
1995 Sales by Business
Asia-Pacific
25%
North America
59%
Management
Wilfred J. Corrigan
Brian L. Halla
Cyril F. Hannon
Moshe N. Gavrielov
Rick Marz
Albert A. Pimentel
Joseph M. Zelayeta
Peng H. Ang
John P. Daane
Bruce L. Entin
Amnon Fisher
James W. Hively
Michael D. Rostoker
Executive Vice President, LSI Logic Products
Executive Vice President, Worldwide Operations
Senior Vice President, International Marketing and Sales
Senior Vice President, North American Marketing and Sales
Senior Vice President, Research and Development, and General Manager
U.S. Wafer Fab Operations
Vice President and General Manager, Consumer Products
Vice President and General Manager, Communication Products
Vice President, Investor Relations and Corporate Communications
Vice President and General Manager, Computer Products
Vice President, ASIC Product Development
Vice President, Strategic Alliances
LSI Logic's broad product line includes high-performance gate array, cell-based, and embedded array ASICs
with up to 1.5 million gates (or up to 9 million transistors). The company's CoreWare methodology enables
system-on-a-chip design by integrating industry-standard interfaces, such as the PCI interface, and industrystandard cores, such as MPEG engines for video and image compression, graphics accelerators, Ethernet
controllers, special-purpose memory, and Mips microprocessors, with customer-defined logic. The company
unveiled its first mixed-signal cells in 2Q95, initially for data conversion applications. Over time its library will
be expanded to include a wide variety of mixed-signal functions.
1-185
LSI Logic
In 1995, LSI Logic introduced its G10 series of ASIC devices that are based on a methodology it calls
application optimization. The new series has elements that are important for speed, power, and integration
and can be developed accordingly for a customer’s application. The family, which takes advantage of LSI’s
proprietary CoreWare “system-on-a-chip” technology, can integrate up to five million usable gates or 49
million transistors on a single chip.
LSI Logic hopes to capitalize on the potential market for low-cost, Internet-exclusive terminals that have
been touted to sell for less than $500. The company introduced a Mips-based single-chip architecture
device for such an application. Its “Internet on a chip” device, capable of 100 Mips, could open Internet
access by enabling users to browse for information using a standard television monitor.
In an attempt to enter the MPEG-2 encoding market, LSI Logic unveiled its first complete MPEG-2 encoder
chipset. LSI Logic also manufactures and markets stand-alone Sparc and Mips RISC microprocessors as
well as other various standard products. In addition, LSI offers a comprehensive set of design tools,
applications and system architectural expertise, and advanced packaging and test solutions.
MPUs
1%
MPRs
6%
Standard
Cell ASICs
41%
Gate Array ASICs
52%
(incl. design services)
The company uses CMOS technology to manufacture its products. Its leading-edge process technology is a
0.35µm (0.25µm, Leff ) 3-volt CMOS process that was developed for the G10 series of ASIC devices.
Nearly all (an estimated 90 percent) of LSI Logic's wafers are manufactured by its Japanese subsidiary,
Nihon Semiconductor, Inc. (NSI), which prior to January 1995 was jointly owned by LSI Logic (55 percent)
and Kawasaki Steel Corporation (45 percent). LSI Logic is now the sole owner of NSI, as a result of the
purchase of Kawasaki Steel's interest.
LSI announced that its Japanese chip fab would be among the first in Japan to use SMIF isolation
technology in a production setting. The company plans to use the minienvironments in office space
converted to a fabrication facility. The system will be used to produce ASICs with 0.5µm and 0.6µm
geometries.
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LSI Logic
In 1995, LSI Logic made a $20 million equity investment in Chartered Semiconductor, in exchange for
guaranteed wafer capacity for products based on 0.6µm technology and smaller for a period of 10 years.
Chartered's new $800 million 200mm wafer fab began production in the second half of 1995.
Also, the company selected Gresham, Oregon, as the U.S. site for a major manufacturing hub that will
produce deep submicron devices. Chips produced using 200mm wafers and a 0.35µm CMOS process
should begin shipping in 1Q97. As much as $4 billion could be invested during the next 15-year period as
the company expands operations at the Gresham location.
LSI Logic Corporation
3115 Alfred Street
Telephone: (408) 433-6666
Wafer size: 150mm
Products: R&D
Nihon Semiconductor, Inc. (NSI)
10 Kitahara, Tsukuba-shi
Ibaraki-ken 300-32, Japan
Telephone: (81) (298) 64-3359
Fax: (81) (298) 64-3458
Fabs I and II
Wafer size: 150mm
Products: ASICs, MPUs, MPRs
Key Agreements
• LSI Logic joined Mentor Graphics to form a 10-year alliance that couples Mentor’s open design tools
within LSI Logic’s submicron design and manufacturing environment to ensure “right-first-time” ASICs.
• The company formed a five-year alliance with Argonaut Software to develop a family of 3D graphics
accelerators. Incorporating LSI’s system-on-chip, the companies will develop upgradeable 3D graphics
cores for LSI’s ASIC library.
• LSI Logic entered into an agreement with InterDigital Communications Corporation that calls for LSI Logic
to develop and produce custom chips for InterDigital to use in Personal Communications Services (PCS
handsets and Wireless Local Loop equipment. The cores that LSI Logic will use in the design are based
on the company’s G10 0.25µm process technology.
• LSI Logic established a joint development agreement with Sanyo Electric to design the core of an HDTV
system.
• LSI Logic signed an agreement with Philips to collaborate on developing video compression ICs for HDTV
applications.
• LSI Logic formed an alliance with Cadence Design Systems to provide their mutual customer base with
design automation tools, submicron silicon technology (0.5µm and below), and training, service, and
support.
1-187
LSI Logic
• LSI Logic signed on Zenith to jointly develop a codec chip supporting a Zenith decoding technology that
can double the channel capacity of digital cable-television systems.
•
The company teamed with David Sarnoff Research Center in 1994 to develop an MPEG-2 video
encoding engine for initial use in Sun Microsystems' SparcStation 20 systems.
1-188
Lucent Technologies
LUCENT T ECHNOLOGIES
Lucent Technologies
Microelectronics Group
(formerly AT&T Microelectronics)
Two Oak Way
Berkeley Heights, New Jersey 07922-2727
Telephone: (908) 771-2000
Fax: (908) 771-4542
Web site: www.att.com/lucent
IC Manufacturer
1991
1992
Sales (Lucent Technologies)
Semiconductor
Sales
Employees (Microelectronics)
1993
1994
1995
17,734
19,765
21,413
815
175
900
135
1,095
160
1,280
185
1,675
210
19,000
20,000
20,000
18,500
18,000
Lucent Technologies Microelectronics Group (formerly AT&T Microelectronics) designs and manufactures
advanced integrated circuits, photonic components, interconnection products, and power systems. Its
product line is built upon strengths in digital signal processing, networked computing, and communications
technologies. The company's products are used in applications such as personal computers, workstations,
local-area networks (LANs), wireless telecommunications, voice/data/video switches, consumer telephones,
and other high-volume electronic systems. Lucent’s Microelectronics Group total revenue in 1995 is
estimated to have been approximately $3.0 billion.
Lucent’s semiconductor roots stretch back to the late 1940's, when Bell Labs, the research and
development arm of Lucent Technologies, was credited with the invention of the transistor. Bell Labs was
given the Nobel Prize for its invention in 1956. After nearly three decades of supplying its parent with chips,
AT&T Microelectronics, as it was then known, decided to offer its products on the merchant market. In 1995,
semiconductor sales to firms outside AT&T Corporation represented 71 percent of total semiconductor sales.
1-189
Lucent Technologies
AT&T Corporation’s restructuring began with an announcement on September 20, 1995, to separate the
$80 billion corporation into three independent companies: AT&T Corporation (communications), Lucent
Technologies (systems and technology), and NCR Corporation, recently AT&T Global Information Systems,
(business computing).
NCR Corporation
10%
AT&T Capital
2%
Lucent
Technologies
26%
AT&T
Corporation
62%
1995 Corporate Sales by Company
The company name, Lucent, was chosen for its meaning “marked by clarity” or “glowing with light” to
distinguish itself from AT&T. Lucent Technologies is made up of five business groups: Network Systems,
Business Communications Systems, Microelectronics, Consumer Products, and Bell Laboratories.
Consumer
8%
Other
5%
Microelectronics
9%
Communications
24%
Network Systems
54%
1995 Lucent Technologies'
Sales by Business Group
Lucent Technologies’ Microelectronics Group is comprised of six strategic business units that are divided into
two groups. The units and the major products offered by each are listed below.
Integrated Circuit Group
Network Communication
Digital, high-voltage, linear, high-frequency ICs
Wireless and Multimedia
DSPs, video encoders
Integrated Systems
ASICs, FPGAs, LAN ICs, ATM ICs
1-190
Lucent Technologies
Systems and Components Group
Power Systems
DC/DC converters
Off-Line switches
Energy systems
Transformers and inductors
Power ICs
Interconnection
Printed circuit boards
Backplanes
Optoelectronic Products
Laser and LED subsystems
Management
Lucent Technologies
Henry B. Schacht
Richard A. McGinn
Curtis J. Crawford
William T. O’Shea
Patricia F. Russo
Daniel C. Stanzione
William B. Marx, Jr.
Carleton S. Fiorina
Donald K. Peterson
Curtis R. Artis
Kathleen M. Fitzgerald
Richard J. Rawson
Arun N. Netravali
President, Microelectronics Group
President, Bell Laboratories
President, Business Communications Systems
President, Network Systems
Senior Executive Vice President
Executive Vice President, Corporate Operations
Senior Vice President, Public and Investor Relations
Senior Vice President and General Counsel
Vice President, Research (Bell Laboratories)
Lucent Technologies Microelectronics Group
Curtis J. Crawford
President
John T. Dickson
Vice President, Integrated Circuits (ICs)
Kenneth W. Dorushka
Richard Mattern
Vice President and Chief Operating Officer, Interconnection Technologies
Peter R. McCarthy
Vice President, Sales Development and Operations
John V. Pilitsis
Vice President, Optoelectronics
William R. Spivey
Vice President, Systems and Components
Jay A. Walters
Vice President and Chief Operating Officer, Power Systems
1-191
Lucent Technologies
Lucent utilizes CMOS, BiCMOS, bipolar, and GaAs processes in the manufacture of its integrated circuits.
The following are Lucent’s primary semiconductor products: 16-bit and 32-bit DSPs, ASICs (digital and
mixed-signal standard cells, gate arrays), FPGAs, mass-storage and PC graphics devices, and
communication ICs. New multimedia and voice recognition products are expected to do well for the
company.
Lucent has essentially completed its plans to withdraw from the CMOS foundry business (it still has
manufacturing arrangements with Standard Microsystems and Cirrus Logic, see Key Agreements). The
company is continuing to provide bipolar manufacturing to outside companies. The AT&T Bipolar Foundry
utilizes two industry leading advanced complementary bipolar process technologies, called CBIC-U2 and
CBIC-V2.
MOS MEMORY
DRAM
SRAM
Flash Memory
ANALOG
✔
✔
✔
Interface
Consumer/Automotive
EPROM
ROM
Data Conversion
EEPROM
✔
✔
MOS LOGIC
✔
✔
✔
✔
Amplifier
Gate Array
Standard Cell
Comparator
DIGITAL BIPOLAR
✔
✔
✔
Bipolar Memory
Field Progra mmable Logic
MPU/MCU/MPR
MOS MICROCOMPONENT
✔
✔
MPU
MCU
MPR
✔
1-192
DSP
OTHER
✔
✔
✔
Full Custom IC
Discrete
Optoelectronic
Lucent Technologies
Lucent Technologies
Allentown Works
555 Union Boulevard
Allentown, Pennsylvania 18103
Telephone: (610) 712-6011
Processes: NMOS, CMOS, bipolar
Products: Linear and logic ICs, DSPs, MPUs
ASICs, FPGAs, telecom ICs
Lucent Technologies
Orlando Plant
Telephone: (407) 345-6000
Process: CMOS
Products: ASICs, FPGAs, DSPs, MPRs
Lucent Technologies
Reading Works
P.O. Box 13396
Reading, Pennsylvania 19612
Telephone: (610) 939-7011
Wafer size: 100mm
Processes: Bipolar, HVCMOS, BCDMOS
Products: Linear ICs, optoelectronics,
foundry services
Lucent Technologies
Solid State Technology Center
9901 Hamilton Boulevard
Breinigsville, Pennsylvania 18031-9359
Telephone: (610) 391-2000
Lucent Technologies d.a. Espana
Poligono Industrial de Tres Cantos
S/N (Zona Oeste), 28770 Colmenar Viejo
Madrid, Spain
Wafer size: 150mm
Process: CMOS
Products: ASICs, communications ICs, DSPs
Lucent Technologies/Cirrus Logic Joint Venture
Telephone: (407) 345-6000
Wafer size: 200mm
Process: CMOS
Products: ASICs, MPRs
(Scheduled to start production in 1997.)
In early 1996, Lucent announced plans to invest $145 million by 1997 to increase the manufacturing
capacity at its Madrid facility. The fab will be upgraded to 0.35µm technology and the first ASIC, FPGA, and
DSP products based on the new technology will be available in 1997. Expected wafer output will be 5,000
wafers per week.
1-193
Lucent Technologies
Key Agreements
• In October 1995, Lucent signed an agreement with Cirrus Logic to form a $600 million joint manufacturing
venture in Orlando, Florida. The new facility will be 60 percent owned by Lucent and 40 percent by Cirrus.
The new facility will begin production by early 1997, beginning with a 0.35µm process (with plans to move
to 0.25µm in the future), and the two companies will equally share its output.
• Lucent signed an agreement with Hewlett-Packard in 1995 to develop and dual-source fiber-optic
transceivers for SONET/SDH and ATM applications.
• Lucent (then AT&T Microelectronics) struck an agreement with Standard Microsystems Corp. (SMC) in
1994 under which SMC agreed to buy equipment for installation in Lucent's fab in Spain in return for a
guaranteed portion of the fab output for a period of five years.
• Lucent is working with IBM, Loral Federal Systems, and Motorola to establish a manufacturing
infrastructure for x-ray lithography. The team hopes to have a manufacturing capability by 1997.
• Lucent will continue its IC process technology development alliance with NEC to the 0.25µm level. The
deal is based on a similar agreement signed in 1991 in which the companies set out to develop a 0.35µm
CMOS process.
• Lucent has several agreements with TriQuint Semiconductor involving the development, manufacture,
and marketing of GaAs ICs for high-performance wireless and telecommunications systems. As part of
the deal, Lucent discontinued its production of GaAs wafers and now relies on TriQuint for the
manufacture of its GaAs wafers. The two companies are developing an epitaxial process based on
Lucent's GaAs intellectual property.
• Lucent is teamed with Sandia National Laboratories to develop new lithography patterning technologies
for the production of high-density ICs with geometries below 0.2µm.
1-194
Maxim Integrated Products
MAXIM INTEGRATED PRODUCTS
Maxim Integrated Products, Inc.
120 San Gabriel Drive
Telephone: (408) 737-7600
Fax: (408) 737-7194
Web Site: www.maxim.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
74
10
11
4
1992
87
14
13
4
1993
110
17
16
13
1994
154
24
13
22
1995
250
39
42
36
500
554
638
1,016
1,552
Established in 1983, Maxim Integrated Products is a leading designer, developer, and manufacturer of linear
and mixed-signal integrated circuits. Maxim's products are the interface between the real, analog world and
the world of digital processing. They detect, measure, amplify, and convert real world signals, such as
temperature, pressure, or sound, into the digital signals necessary for computer processing. Its circuits are
used in a wide variety of microprocessor-based equipment, including PCs and peripherals, test equipment,
handheld products, wireless communicators, and video displays. The company also provides a range of
high-frequency design processes and capabilities that can be used in custom design.
Maxim’s main objective is to actively develop and market both proprietary and industry standard analog
integrated circuits that meet the increasing quality standards demanded by customers.
1-195
Europe and
Pacific Rim
49%
United States
51%
In mid-1994, Maxim acquired substantially all of the assets of the Tektronix's Integrated Circuits Operation in
Beaverton, Oregon, for about $22 million. The acquisition provided Maxim with additional wafer production
capacity, leading-edge high-frequency bipolar technologies that have broadened the firm's presence in the
wireless and optic communications markets, and high-speed data acquisition, RF signal processing, and
video products.
Management
Jack F. Gifford
Frederick G. Beck
Ziya Boyacigiller
Michael J. Byrd
Steve Combs, Ph.D.
Tunc Doluca
Dave J. Fullager
Anthony Gilbert
Kenneth J. Huening
William N. Levin
Robert F. Scheer
Richard E. Slater
Chairman, President and Chief Executive Officer
Vice President
Vice President, and Secretary
Vice President
Vice President
Vice President and Chief Accounting Officer
Maxim Integrated Products offers a broad range of linear and mixed-signal ICs, including data converters,
interface circuits, microprocessor supervisory circuits, operational amplifiers, power control circuits, timers and
counters, display circuits, multiplexers and switches, battery chargers, voltage detectors, filters, comparators,
and voltage reference circuits.
1-196
Maxim supplements is own IC production capacity with foundry agreements with other companies.
430 West Maude Avenue
Telephone: (408) 746-2650
Wafer size: 100mm
Products: Linear and mixed-signal ICs
14320 Southwest Jenkins
Beaverton, Oregon 97005
Telephone: (503) 641-3737
Wafer size: 100mm
Process: Bipolar
Products: Mixed-signal ICs
(purchased from Tektronix in mid-1994)
1-197
Micrel Semiconductor
MICREL SEMICONDUCTOR
Micrel Semiconductor, Inc.
1849 Fortune Drive
Telephone: (408) 944-0800
Fax: (408) 944-0970
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
14
0.3
2
1992
18
1
2
1993
19
1
3
1994
35
3
4
1995
53
7
4
140
150
160
180
345
Micrel was founded in 1978 as an independent high-performance testing facility for manufacturers and
consumers of digital and analog ICs. In 1982, Micrel acquired an IC fabrication facility in Sunnyvale,
California, from Siemens Components and began acting as a silicon foundry. This led to the company's
development of semicustom and standard linear smart power ICs.
In early 1993, Micrel moved its headquarters and manufacturing operations from Sunnyvale to San Jose.
The new fab, formerly owned by Seeq Technology, tripled Micrel's fab capacity. In 1995, Micrel signed a
lease on an additional 63,000 square foot building. This additional space will be used to expand its
manufacturing activities. The company also went public in 1995.
Micrel is focusing its efforts on the design and marketing of its high-performance analog power ICs to
become a strong force in portable computing, desktop computing, communications, and automotive and
aviation electronics.
1-198
Micrel Semiconductor
Military and Other
7%
Custom ICs
25%
Foundry Services
25%
Standard ICs
50%
1995 Sales by Product
Telecom
18%
Consumer
19%
Industrial
29%
Computer
27%
Management
Ray Zinn
Robert Barker
Robert Johnston
John Husher
Jerome Markus
Warren Muller
Vice President, Fabrication Operations
Vice President, Standard Products Sales
Vice President, Test Operations
Micrel supplies both standard and semicustom products. The company's key standard product lines include
high-current low-side power MOSFET drivers, high-side power MOSFET drivers, low dropout (LDO) linear
regulators, high-efficiency switching regulators, PCMCIA power control matrices, power latched drivers,
display drivers, P-channel MOSFETs, and open drain power switches. Micrel also continues to offer the use
of its fabrication facilities as a foundry source.
Micrel uses and offers a full range of processes: CMOS, DMOS, bipolar, BiCMOS, and BCDMOS. The
company’s fab is capable of handling metal-gate, silicon-gate, double-metal and double-poly architectures
with feature sizes down to 1.0µm.
Micrel Semiconductor, Inc.
1849 Fortune Drive
Wafer size: 100mm
Processes: CMOS, bipolar, DMOS, BiCMOS/DMOS, BCD
1-199
Micro Linear
MICRO LINEAR
Micro Linear Corporation
2092 Concourse Drive
Telephone: (408) 433-5200
Fax: (408) 432-0295
Fabless IC Supplier
Sales
Net Income
R&D Expenditure
Employees
1991
35
4
1992
37
3
7
1993
34
—
8
1994
42
3
9
1995
57
11
10
150
210
210
225
251
Established in 1983, Micro Linear designs, develops, and markets analog and mixed-signal ICs for a broad
range of applications within the communications, computer, and industrial markets. Such applications
include local-area networks (LANs), mass storage, personal computers, notebook computers, personal digital
assistants (PDAs), voice-band telecommunications, data acquisition, motor control, and power management.
Micro Linear targets high growth applications that require substantial analog and mixed signal content.
Using its designs, the company integrates electronic subsystems or several analog building block circuits into
a single circuit or chipset.
In 1991, Micro Linear implemented a strategy to diversify its business and lessen its dependence on the
hard disk drive industry. As a result, hard disk drive product sales represented only 19 and 15 percent of
total revenues in 1994 and 1995, respectively, compared to 81 percent in 1990. International sales
represented approximately 31 percent of total revenues in 1995.
Other ICs
38%
Computer
Networking ICs
47%
Hard
Disk Drive ICs
15%
1-200
Micro Linear
Management
Arthur B. Stabenow
William T. Malanczuk
Carlos A. Laber
Chris A. Ladas
Marty Levy
Ray A. Reed
J. Philip Russell
Paul E. Standish
Vice President, Marketing and Applications
Micro Linear provides second-source products and proprietary standard products as well as semi-standard
parts and ASICs using bipolar, CMOS, and BiCMOS processes, with a particular emphasis placed on its
1.5µm BiCMOS technology. Its product offerings are broken down by market application below.
Mass storage (HDD, MOD, and tape):
Pulse detectors
Read/write amplifiers
Motor, servo controllers
Servo demodulators
Read channel
SCSI terminators
Clock generators
Data separators
Frequency synthesizers
Trajectory generators
Voice coil drivers
Filters
Buffers
LANs:
Data quantizer
Transceivers for MPR, FOIRL
Transceivers for AUI/FDDI
Transceivers for ATM
Fiberoptic LED drivers
Voiceband telecommunications:
Gain/attenuators
Tone detectors
Sine-wave generators
Equalizers
Dual filters
Power and motion control:
Motor controllers
Power factor correctors
Battery—DC/DC converters
PWM controllers
Synchronized power supply chips
Resonant controllers
Phase modulation controllers
LCD backlight IC
Data conversion:
12-bit ADCs
10-bit ADCs
8-bit ADCs
8-bit DACs
1-201
Micro Linear
Micro Linear utilizes wafer foundries for the production of its ICs.
1-202
Microchip Technology
MICROCHIP T ECHNOLOGY
Microchip Technology Inc.
Chandler, Arizona 85224-6199
Telephone: (602) 786-7200
Fax: (602) 899-9210
Web Site: www.ultranet.com/biz/mchip
IC Manufacturer
Sales
Net Income
R&D Expenditures
1992
73
0.4
8
8
1993
89
4
9
3
1994
139
19
14
35
1995
208
36
21
71
1996
286
44
49
n/a
Employees
1,100
1,070
1,260
1,430
1,600
Microchip Technology was organized in 1989 by a group of venture capital investors to acquire General
Instrument Corporation's Microelectronics division, which was established in 1960. Since the acquisition,
Microchip Technology has shifted its focus from commodity memory and logic products to embedded control
products.
The company is now a leading manufacturer of high-performance, field-programmable RISC
microcontrollers, complementary ASSPs, and related specialty memory products for high-volume embedded
control applications. Microchip sells its products to a broad and diverse customer base in the consumer,
automotive, communications, office automation, and industrial control markets.
1-203
Commodity Memories and
Logic Products
8%
EEPROMs and
Specialty EPROMs
34%
Microcontrollers
and associated
development systems
58%
1995 Sales by Product Category
United States
35%
Other
(primarily Asia,
Europe, and Japan)
65%
Microchip's embedded control products (microcontrollers, serial and parallel EEPROMs, and high-speed and
low-power EPROMs) represented only eight percent of total product sales in fiscal 1990 compared to 92
percent in fiscal 1995. The remaining 8 percent in fiscal 1995 was represented by the company’s
commodity memory and logic products.
In the fourth quarter of calendar 1995, Microchip announced it had acquired the “Keelog” hopping code and
secure smart card technology and patents developed by Nanoteq of South Africa. The $10 million
acquisition also provided Microchip with worldwide marketing rights to the technology. New products are
being developed that combine the Keelog and smart card technology with Microchip’s 8-bit MCUs and serial
EEPROMs for enhanced security applications in wireless/remote controlled systems.
Management
Steve Sanghi
Timothy B. Billington
Frederick J. Bruwer
C. Philip Chapman
Franc C. Guerrini
Robert J. Hackmeister
Michael J. Jones
David S. Lambert
Robert A. Lanford
Mitchell R. Little
Robert J. Lloyd
John F. Oatley
Gordon W. Parnell
George P. Rigg
Howard Teeter
Ernest Villicana
William Yang
1-204
Vice President, Secure Data Products Group
Vice President, Chief Financial Officer and Secretary
Vice President, European Sales Operation
Vice President, Assembly and Test and Operations Support
Vice President, Human Resources and Information Systems
Vice President, Process Development and Manufacturing Engineering
Vice President, Memory Products and ASSP Division
Vice President, Facilities Management
Vice President, Manufacturing Operations-Pacific Rim
Vice President, Controller and Treasurer
Vice President, Logic Products Division
Vice President, Americas Sales
Vice President, Logic Product Marketing
Vice President, Finance-Pacific Rim
During the 1970's and 1980's, a high-volume ROM and EPROM business was then-General Instrument's
primary revenue generator.
Since then, however, Microchip has placed designs derived from
microcontrollers at the forefront of its strategy, and has limited nonvolatile offerings to specialty areas such
as serial EEPROMs. Although commodity EPROM shipments will continue to decrease as a percentage of
total sales, the company intends to manage EPROM production levels to maintain optimal manufacturing
capacity utilization.
Microchip's integrated circuit products are outlined below. These products are based upon CMOS process
technology with lithography dimensions down to 0.9µm. The company is in the process of transitioning
products to smaller geometry processes.
Microcontroller Products
• PIC16/17 8-bit microcontrollers that combine a high-performance RISC processor with one-timeprogrammable (OTP) technology. Current PIC16/17 microcontroller product families include advanced
features such as sophisticated timers, embedded A/D converters, extended instruction/data memory,
inter-processor communication (I2C/SPI ports and USARTs), and ROM, RAM, EPROM, and EEPROM
memories. Some of Microchip’s MCUs operate from power supplies as low as 2.0V.
Application-Specific Standard Products (ASSPs)
• Microchip’s ASSPs combine selected application-specific software programs with different combinations of
the company’s standard microcontroller and memory products.
EEPROM Products
• Serial CMOS EEPROMs with densities ranging from 256bit to 64K and featuring data transfer rates up to
1MHz. The company’s serial EEPROMs are offered with a wide operating voltage range (1.8V to 6.0V).
• Parallel CMOS EEPROMs available in 4K, 16K, and 64K densities with 10,000 to 100,000 erase/write
cycles (typ).
EPROM Products
• Standard CMOS EPROMs with densities ranging from 64K to 512K.
• Low-voltage (as low as 3.0V) CMOS EPROMs with densities ranging from 64K to 512K.
• High-speed 256K CMOS EPROMs with access times as fast as 55ns.
Application-Specific Standard Products
• TrueGauge™ intelligent battery capacity monitoring and charge controller ICs.
• Mouse controller ICs for all Apple Computer and IBM PC-compatible formats.
• Energy management controller ICs for reducing power consumption of AC induction motors.
• 8-bit microcontrollers with 1K of on-chip serial EEPROM.
Other Logic Products
• Static LCD driver ICs.
1-205
Microchip announced in late 1995 that it plans to invest nearly $1 billion over the next few years to expand
its fabrication capacity in Arizona. The investment will consist of $475 million for the construction of Fab III
adjacent to its headquarters starting in late 1996 or early 1997 and $550 million to build Fab IV starting in
1998. Fab III will feature 50,000 square feet of cleanroom space and will process 200mm CMOS wafers.
Chandler, Arizona 85224
Fab I
Process: CMOS
1200 South 52nd Street
Fab II
Wafer size: 150mm
Process: CMOS
Microchip’s IC products are assembled and tested primarily at a subsidiary in Kaohsiung, Taiwan, and a
third-party contractor in Bangkok, Thailand. Other third-party assembly and test suppliers used by Microchip
are located in the Philippines and other Asian countries.
1-206
Micron Technology
MICRON T ECHNOLOGY
Micron Technology, Inc.
8000 South Federal Way
P.O. Box 6
Boise, Idaho 83707-0006
Telephone: (208) 368-4000
Fax: (208) 368-4435
Web Site: www.micron.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends August 31
Sales
Net Income
R&D Expenditures
1991
425
5
36
83
1992
506
7
48
102
1993
828
104
57
163
1994
1,629
401
83
377
1995
2,953
844
129
961
Employees
4,095
4,300
4,900
5,400
8,080
Micron Technology, Inc. was founded in 1978 as a semiconductor design consulting firm. In late 1982, the
company entered the memory market with a 64K DRAM, which had a significantly smaller die size than
competing products.
Today, Micron is a leading developer and manufacturer of DRAM, very fast SRAM, and other semiconductor
products, processes, and packaging options. It is one of the few U.S.-headquartered merchant DRAM
manufacturers. The company's long-term goals are threefold: to offer electronics manufacturers the most
advanced and highest quality memory products available; to take advantage of its production expertise by
expanding into other memory-related businesses; and to help reinstate the U.S. as the leader in the
production of memory ICs.
1-207
Micron Technology
Board-Level
Products
3%
SRAMs
6%
Other
4%
Other
8%
PCs
15%
DRAMs/
Specialty DRAMs
68%
Europe
10%
Far East
15%
North
America
71%
Micron's primary business is memory ICs, but it is also involved in a number of other businesses, including
the design and manufacture of custom boards and modules, the development of chips and systems for RF
identification applications, flat panel display technologies, and the design and assembly of personal
computers.
Management
Steve R. Appleton
Tyler A. Lowrey
Donald D. Baldwin
Kipp A. Bedard
Eugene H. Cloud
Robert M. Donnelly
W. Bryan Farney
Edward J. Heitzeberg
Norman L. Schlachler
Nancy M. Self
Kenneth G. Smith
Wilbur G. Stover, Jr.
Thomas M. Trent
Chief Operations Officer
Vice President, Corporate Affairs
Vice President, SRAM Products Group
Vice President, Design, Product Engineering, and Quality Assurance
Vice President and Treasurer
Vice President, Administration
Vice President, Computer Aided Design
Micron's semiconductor product strategy is focused primarily on the design, development, and manufacture
of memory products, primarily DRAMs and SRAMs, for standard and custom memory applications, with
various packaging and configuration options, architectures, and performance characteristics.
1-208
Micron Technology
Micron’s semiconductor products are outlined below.
DRAMs
• 4M DRAMs in x1 and x4 configurations with support for fast page and extended data-out (EDO) modes.
• 16M DRAMs in x4, x8, and x16 configurations with support for fast page, EDO, and burst EDO modes.
• 64M DRAMs in x4, x8, and x16 configurations with support for fast page, EDO, and burst EDO modes.
• DRAMs are also offered in bare-die form or module form.
Graphics DRAMs
• 4M EDO DRAMs in x16 configuration.
• 8M synchronous graphics RAM (SGRAM) in x32 configuration. Operates from a 3.3V power supply and
is offered in speed grades ranging from 15ns/66MHz to 10ns/100MHz.
Synchronous SRAMs
• 1M flow-through or pipelined burst SRAMs in x18, x32, and x36 configurations. The flow-through devices
support bus frequencies up to 67MHz and the pipelined devices up to 125MHz.
• 2M flow-through or pipelined burst SRAMs in x18, x32, and x36 configurations.
• SRAMs are also offered in bare-die form or module form.
Flash Memories
• 2M boot block flash memories in x8 configuration using Intel-licensed SmartVoltage technology.
• 4M boot block flash memories in x8 and x16 configurations using Intel-licensed SmartVoltage technology.
• 16M sector erase flash memories in x8 and x16 configurations using Intel-licensed SmartVoltage
technology (samples expected to be available in 3Q96).
• Micron plans to introduce a line of solid-state flash memory cards in 2H96.
Research and development efforts continue on next generation processes and designs in DRAM, SRAM,
flash memory, radio frequency identification devices (RFID), and FED flat panel displays. The company
plans to be in production of its first RFID chip, the RFIDEngine, by the end of 1996.
Currently, most of Micron’s semiconductor products are based on 0.45µm CMOS technology and are
migrating to 0.35µm technology.
Micron has completed the conversion of Fab III from 150mm to 200mm wafers, and is in process of
converting Fabs I and II. In 1995, the company began construction on a new $2.3 billion 200mm wafer fab
complex in Lehi, Utah. The new plant will be capable of processing 10,000 wafers per week, utilizing
0.25µm technology. In early 1996, the company decelerated construction of the fab, due to a softening of
the DRAM market. The fab shell will be completed and equipment will be added to it as market conditions
warrant.
1-209
Micron Technology
Fabs I and II
Wafer size: 150mm, 200mm
Process: CMOS
Fab III
Wafer size: 200mm
Process: CMOS
Fab IV
Wafer size: 200mm
Process: CMOS
Key Agreements
• Micron signed a cross-licensing agreement with Intel covering flash memory ICs. Volume production of
2M and 4M flash chips that are pin-compatible with Intel's boot-block products began in 1995.
• Micron announced a memorandum of understanding with NEC on the mutual OEM sales of each other's
semiconductor memory products. The deal allows both companies to resell memory products, such as
16M DRAMs and 1M synchronous SRAMs under their own logos.
• Micron has made a number of agreements to license its known-good die (KGD) technology. Licensees
include Honeywell SSEC, Chip Supply, nChip, and Cybex Technologies.
1-210
Mitel Semiconductor
MITEL SEMICONDUCTOR
Mitel Semiconductor
360 Legget Drive
P.O. Box 13089
Kanata, Ontario
Canada K2K 1X3
Telephone: (613) 592-2122
Fax: (613) 592-4784
Web Site: www.semicon.mitel.com
U.S. Representative:
Mitel Semiconductor
2321 Morena Boulevard
Telephone: (619) 276-3421
Fax: (619) 276-7348
IC Manufacturer
Sales*
R&D Expenditures
Employees
1992
45
8
1993
69
6
1994
80
7
1995
110
9
1996
121
n/a
529
552
564
633
n/a
*External sales only. Mitel Semiconductor also supplies ICs and Hybrid to its parent Mitel Corporation.
Mitel Semiconductor was founded in 1976 and supplies analog and digital communications ICs to
telecommunications equipment manufacturers around the world. Mitel Semiconductor is a leader in
providing complete communications solutions.
The company provides analog and digital
telecommunications ICs, thick-film hybrids, and board-level products to designers of products such as PBXs,
EDs, MUXs, and computer/telephony systems. Mitel Semiconductor also provides extensive design and
applications support.
Canada
8%
Wafers
9%
Hybrids
20%
ICs
71%
Japan
7%
ROW
31%
Europe
23%
United States
31%
1-211
Mitel Semiconductor
Management
John Millard
Kirk Mandy
President and Chief Executive Officer, Mitel Corporation
Vice President and General Manager, Semiconductor Division
Mitel Semiconductor's product line includes analog and digital switches; DTMF and caller-ID devices;
subscriber line circuits (SLICs); telephone-set, ISDN, and line interface devices; and broadband ISDN primary
rate and ATM products. Mitel Semiconductor also offers a custom wafer foundry service.
Mitel Semiconductor acquired Swedish semiconductor manufacturer ABB Hafo AB in March 1996. ABB
Hafo specialized in cell-based ASIC design and the manufacture of custom mixed-signal radiation-hardened
ICs and optoelectronics. In 1995, ABB Hafo had revenues of about $40 million, half from ICs and foundry
work and half from discretes/optoelectronics.
Mitel Semiconductor
18 Airport Boulevard
Bromont, Quebec, Canada J0E 1L0
Telephone: (514) 534-2321
Fax: (514) 534-3201
Wafer size: 100mm
Processes: CMOS, single and double poly and metal, CCD, metal gate, SiCr-on-chip
Feature sizes: 1.2µm, 1.5µm, 2.0µm, 3.0µm, 4.0µm, 5.0µm, 9.0µm
Mitel Semiconductor AB (formerly ABB Hafo AB)
Bruttovägen 1, P.O. Box 520
S-175 26 Järfälla, Sweden
Telephone: (46) (8) 580 24500
Fax: (46) (8) 580 225 60
Wafer size: 100mm
Processes: CMOS, bipolar, SOS
1-212
Mosaic Semiconductor
MOSAIC S EMICONDUCTOR
Mosaic Semiconductor, Inc.
7420 Carroll Road
Telephone: (619) 271-4565
Fax: (619) 271-6058
Fabless IC Supplier
Employees
25
Founded in 1988, Mosaic Semiconductor is a supplier of high reliability memory components and
subsystems for military, aerospace, industrial, and medical markets. Mosaic's customers are mainly in the
U.S., Canada, and Israel, but the company is targeting similar customers in Japan.
Management
David Armstrong
Andrew Ross
Jaime Conde
S. Fallaize
Executive Vice President and General Manager
Manager, Eastern Area Sales
Manager, North American Sales
Mosaic's military IC products include DRAMs in densities ranging from 64K to 4M, EEPROMs in 256K and
1M densities, and flash memories in 1M and 4M densities; all conform to MIL STD 883D methods 5004 and
5005. Mosaic's military module offerings include SRAM, EEPROM, flash, and EPROM.
Mosaic's ICs are currently manufactured by various North American and Asian semiconductor
manufacturers. The company maintains an assembly, test, and package design facility in San Diego.
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MOSAID Technologies
MOSAID T ECHNOLOGIES
MOSAID Technologies Incorporated
P.O. Box 13579
Kanata, Ontario
Canada K2K 1X6
Telephone: (613) 836-3134
Fax: (613) 831-0796
Web Site: www.mosaid.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends April 30
Sales
Net Income
R&D Expenditures
Employees
1992
7
(1)
2
1993
10
2
2
1994
15
3
3
1995
24
4
5
61
58
74
93
MOSAID Technologies was founded in 1975 to provide MOS memory design and consulting services.
Today, the company is a recognized leader in the design of memory chips. It designs and licenses
advanced chips for standard memory and application-specific memory (ASM) requirements. The company is
also a leading supplier of engineering memory test systems. Approximately 93 percent of MOSAID's sales
revenue is generated outside of Canada.
Taiwan
4%
Other
11%
Korea
44%
North
America
11%
Japan
30%
1-214
MOSAID Technologies
Management
George J.J. Cwynar
Robert C. Albrow
Christine Baburek
G. Glann Evans
Iain H. Scott
Vice President, Strategic and Technical Development
Vice President and General Manager, Systems Division
Vice President and General Manager, Semiconductor Division
MOSAID has experience in eight generations of DRAM designs, from 4K to 64M. Some recent memory
chip designs include: a high-performance 16M synchronous DRAM supporting data transfer rates of up to
100M/second, a low-voltage 16M DRAM upgrading the capabilities of portable computers, a low-voltage
word-wide 4M DRAM, and a low-power SRAM. Macrocell designs intended for use as blocks within ASICs
include high-speed pipelined SRAM and DACs for RAMDAC function, and HDRAM™ (high-density DRAM).
MOSAID also designs and sells memory intensive components such as high-performance RAMDACs. In
addition, the company designs, manufactures, and distributes engineering test systems for memory chips.
Key Agreements
• MOSAID announced in May 1994 the formation of a joint venture company to develop a leading edge
ASM chip. Ownership of the joint venture Accelerix is shared equally with Symbionics Holdings Limited, a
U.K.-based corporation with specific expertise in advanced ASIC applications.
• MOSAID announced a project with Newbridge Networks Corporation in Kanata and Kawasaki Steel
Corporation in Tokyo, Japan, in September 1994, for the development of an ASIC incorporating a highdensity DRAM (HDRAM) macrocell.
• MOSAID announced a project with LG Semicon (formerly Goldstar Electron) in early 1995 for the
development of an advanced memory device.
• In FY95, MOSAID announced a project with Oki Electric Industry Co., Ltd. to design a 64M SDRAM.
1-215
Motorola
MOTOROLA
Motorola, Inc.
Semiconductor Products Sector (SPS)
3102 North 56th Street
Phoenix, Arizona 85018
Telephone: (602) 952-3000
Fax: (602) 952-6100
Web Site: motserv.indirect.com
IC Manufacturer
Corporate
Sales
Net Income
Semiconductor
Sales
IC Sales
Discrete Sales
1991
1992
1993
1994
1995
11,341
454
13,303
453
16,963
1,022
22,245
1,560
27,037
1,781
3,920
3,087
833
653
4,470
3,606
864
666
5,800
4,825
975
1,120
6,960
5,600
1,360
1,640
8,540
6,850
1,690
2,530
41,000
44,000
46,000
52,000
Employees (SPS)
Established in 1928, Motorola's first products were battery eliminators and private label radio sets. Shortly
after WWII Motorola entered the television and semiconductor businesses. Today, Motorola supplies a wide
range of electronic products, including cellular telephones, semiconductors, two-way radios, paging and data
communications products, defense and space electronics, computers, and other electronic components,
modules, and systems for automotive, industrial, transportation, navigation, communication, energy
systems, consumer, and lighting markets.
1-216
Motorola
Other
11%
Land Mobile
12%
General Systems
36%
Messaging,
Information,
and Media
12%
Semiconductor
29%
Product Group/Sector
In 1949, Motorola set up a solid-state research laboratory in Phoenix, Arizona, and then established its
semiconductor products sector in 1954. The company has since continued to be one of the world’s largest
producers of semiconductors. It offers one of the industry's broadest portfolios of semiconductor products,
including microprocessors, RF devices, microcontrollers, digital signal processors, memories, sensors, and
discretes. Applications for these products are primarily in the communications, computer, and industrial
markets, but also in the automotive and consumer markets.
Consumer
Automotive 11%
12%
Industrial
17%
Japan
10%
Communications
33%
Computing
27%
1995 Semiconductor Sales by
End-Use Market
Asia/Pacific
19%
Americas
46%
Europe
25%
Geographic Region
Motorola Semiconductor Products Sector (SPS) is organized into five product groups: the Microprocessor
and Memory Technologies Group (MMTG); the Microcontroller Technologies Group; the Communications,
Power, and Signal Technologies Group; the Logic and Analog Technologies Group; and the recently formed
Communications and Advanced Consumer Technologies Group (CACTG).
The new CACTG was announced in 1Q96 as part of a broader reorganization of the SPS, undertaken, in
part, to promote sales of the PowerPC RISC microprocessor. The Application Specific IC Division, the Digital
Signal Processing Division, the High-Performance Embedded Systems Division, the MOS Digital-Analog IC
Division, and the Israel Design Center were all combined under the CACTG to target applications in digital
wireless and wireline communications, as well as in consumer products like set-top boxes and digital
videodisks.
The reorganization also refined the focus of the MMTG to encompass all PC and networking solutions, with
its principal product being the PowerPC. In addition, the Microcontroller Technologies Group is now
responsible for providing systems solutions for the automotive market.
1-217
Motorola
Management
Motorola, Inc.
Gary L. Tooker
Christopher B. Galvin
Thomas D. George
Carl F. Koenemann
Motorola Semiconductor Products Sector
Thomas D. George
President and General Manager
Murray A. Goldman
Senior Vice President and Assistant General Manager
Bertrand Cambou
Senior Vice President and Director, Technology
R. Gary Daniels
Senior Vice President and GM, Microcontroller
Technologies Group
Larry L. Gartin
Senior Vice President and Director, Finance
Gary M. Johnson
Senior Vice President and GM, Service, Panning, and Logistics
Paul J. Shimp
Senior Vice President and Director, Quality and Support
Operations
Fred Shlapak
Senior Vice President and GM, Communications and Advanced
Consumer Technologies Group
C.D. Tam
Senior Vice President and GM, Asia-Pacific Semiconductor Group
Barry Waite
Senior Vice President and GM, Microprocessor and Memory
Technologies Group
Pete Bingham
Vice President and GM, MOS Digital-Analog IC Division
Andre Borrell
Vice President and GM, Communications, Power, and Signal
Technologies Group
Jim George
Vice President and GM, Digital Signal Processing Division
Steve Hanson
Vice President and GM, European Semiconductor Group
George Turner
Vice President and GM, Logic and Analog Technologies Group
Robert Weisshappel
Vice President and GM, Research and Development
Brian Hilton
Vice President and Director, World Marketing
L.J. Reed
Vice President and Director, Application Specific IC Division
1-218
Motorola
MOS MEMORY
✔
✔
ANALOG
✔
✔
✔
✔
✔
✔
✔
DRAM
SRAM
Flash Memory
EPROM
ROM
EEPROM
MOS LOGIC
✔
✔
Interface
Consumer/Automotive
Data Conversion
Comparator
DIGITAL BIPOLAR
✔
✔
✔
Gate Array
Standard Cell
✔
✔
Amplifier
Bipolar Memory
MPU/MCU/MPR
MOS MICROCOMPONENT
✔
✔
✔
✔
MPU
OTHER
MCU
Full Custom IC
✔
✔
MPR
DSP
Discrete
Optoelectronic
Digital Bipolar
5%
Analog
12%
MOS Memory
15%
MOS Logic
16%
MOS Micro
34%
Discrete/Opto
18%
Device Type
1-219
Motorola
Provided below are details concerning Motorola’s semiconductor products.
Analog ICs
Motorola offers an extensive line of linear ICs, including amplifiers and comparators, power supply circuits,
motor control devices, voltage references, data converters, interface circuits, communications circuits,
consumer electronics ICs, automotive ICs, and other special purpose linear ICs like RF circuits. These
devices are manufactured using bipolar or MOS technology.
Application-Specific ICs (ASICs)
Motorola’s ASIC products include CMOS, bipolar, and BiCMOS gate arrays and FPGAs. Its most advanced
digital gate arrays (M5C Series) are based on three-layer-metal 0.45µm (Leff ) CMOS process technology,
which allows for up to 557,000 available gates and 556 I/Os.
Application-Specific Standard Products (ASSPs)
The company launched its Customizable Standard Product (CSP) program in June 1995, following two years
of development. For the general market, Motorola will make available a stream of ASSPs for asynchronous
transfer mode (ATM) local and wide area network applications in its new MC92000 Series. The first device,
an ATM cell processor that operates at 155 Mbits/second, was introduced in early 1996. The second device
is expected to be a 155 Mbits/second ATM segmentation and reassembly controller.
Discretes, Optoelectronics, and Sensors
These products include a variety of bipolar and MOS transistors, diodes, RF devices, thyristors,
optoelectronics, pressure and temperature sensors, fiber optic devices, and power modules.
Logic ICs
Since the inception of ICs, Motorola has been a leader in the market for digital logic devices. Its product line
includes a broad range of bipolar MECL (Motorola emitter-coupled logic), MECL10K, MECL10KH, MECL III,
ECLinPS (ECL in picoseconds), ECLinPS Lite, low-power TTL, and fast TTL logic IC families, as well as
CMOS high-speed, low-voltage, and metal-gate logic IC families.
Memory ICs
Motorola manufactures and markets dynamic and fast static RAMs, including processor-specific SRAMs and
synchronous SRAMs. Its fast SRAMs are based on 0.8µm to 0.5µm BiCMOS and high-performance CMOS
technologies with access times as fast as 5ns for 64K devices, 6ns for 256K devices, 5ns for 1M devices,
and 12ns for 4M devices.
The company’s DRAMs include 4M and 16M parts designed using 0.6µm and 0.5µm high-performance
CMOS technologies. In late 1995, Motorola announced it would join the IBM-Siemens-Toshiba DRAM
development alliance. By joining the team, Motorola gains access to technology for 64M and 256M
DRAMs, and will take part in the development of 1G DRAMs.
Motorola will be adding flash memory products to its portfolio later in 1996.
1-220
Motorola
Microcontrollers and Digital Signal Processors
Motorola offers one of the most comprehensive selections of high-performance single-chip microcontrollers,
ranging from industry-standard 8-bit controllers to state-of-the-art 16-bit and 32-bit modular controllers.
The company’s 68HC05 and 68HC08 families of 8-bit MCUs are a part of the Motorola Customer Specific IC
(CSIC) program, which is targeted for high-volume projects that require the cost-efficiency of standard
devices, but have requirements that cannot be met by “off-the-shelf” components.
Motorola’s 16-bit MCUs include the 68HC11 controller family and the 68HC16 modular controller family. Its
32-bit MCUs include the 6833X controller family and the PowerPC-based MPC5XX controller family.
Motorola’s digital signal processor products include the 56100 and 56800 families of 16-bit general-purpose
DSPs, the 56000, 56300, and 56800 families of 24-bit general-purpose DSPs, and the 96002 family of 32bit general-purpose floating-point DSPs. The company is working to regain a dominant position in the
merchant digital signal processor market by developing new DSPs for the personal and wireless
communications applications. The first results of this effort are the DSP56300 for high-end digital cellular
equipment and the DSP56800 for pagers and wireless handsets.
Microprocessors and Embedded Processors
Motorola manufactures and markets high-performance microprocessors for computer applications and
embedded processors for a variety of applications, including communications, imaging, office peripherals,
multimedia systems, games, and industrial controls.
The PowerPC RISC microprocessor family has replaced the 680X0 family of CISC MPUs as Motorola’s
mainstream processors for computer applications. However, the 680X0 MPUs still have a strong presence in
the market for embedded processors.
•
PowerPC 601 Microprocessor—The first member of the PowerPC family, the 2.8-million-transistor 32-bit
601 is designed for application in desktop computers. The 66MHz and 80MHz versions are based on
four-layer-metal 0.6µm CMOS process technology. The newest 100MHz version (601v) is based on a
0.5µm (0.25µm Leff ) CMOS process, which reduces the processor die size by 38 percent.
•
PowerPC 602 Microprocessor—The 1-million-transistor 32-bit 602 is intended for use in portable and small
form factor equipment, such as PDAs. It is based on a four-level-metal 0.5µm CMOS process.
•
PowerPC 603/603e Microprocessors—The 32-bit 603 is a 1.6-million-transistor high-performance RISC
MPU with integrated power management features for the notebook and energy-sensitive desktop PC
markets. It is based on a four-level-metal 0.5µm CMOS process and is available in 66 and 80MHz
versions. The 603e is an enhanced version of the PowerPC 603; it contains twice the cache size of the
original 603 and extends its speed from 80MHz to 100MHz.
•
PowerPC 604 Microprocessor—The 604 is the newest 32-bit PowerPC. Based on a 0.5µm CMOS
process, the 604 has 3.6 million transistors and is available in 100, 120, 133, and 150MHz versions.
1-221
Motorola
•
PowerPC 620 Microprocessor—The 620 is the first 64-bit implementation of the PowerPC RISC
architecture. It is intended for use in server and high-end workstation computers. The 133MHz 620 is
based on a four-level-metal 0.5µm CMOS process and has about 7 million transistors.
Motorola’s embedded processor products include: the 680X0 family, the ColdFire (MCF51XX and
MCF52XX) processors, the Embedded PowerPC (MPC8XX and MPC6XX) processors, the FlexCore
products, the 683XX family of integrated microprocessors, data communications controllers and peripherals,
and physical interface products.
Motorola plans to introduce a new “multimedia engine”, which combines microcontroller, MPEG-2
decompression, error correction, and 3D graphics functions on one chip. It is aimed at lowering the cost of
multimedia products such as digital set-top boxes, digital video disc players, and electronic game systems.
Mixed-Signal ICs
The company’s mixed-signal ICs are targeted at applications including wireless and wireline communications,
multimedia systems, automotive equipment, and control networks.
Motorola has several fab facility projects underway, including the construction of a new 200mm wafer fab
(MOS 17) in Tianjin, China, where CMOS and BiCMOS ICs will be produced. Other projects include the
construction of a new fab facility (MOS 19) near Richmond, Virginia, for the production of PowerPC chips; an
expansion of the Nippon Motorola fab in Aizu, Japan; and the starting up of MOS 13 in Austin, Texas, for
the production of PowerPC devices in 1996. In addition, Motorola and Siemens may build a jointly owned
$1.5 billion DRAM plant in Fort Worth, Texas. Construction of the joint venture is likely to begin in 1996, with
initial production of 64M parts in 1998.
Motorola, Ltd.
Colvilles Road
Kelvin Estate, East Kilbride
Glasgow G75 0TG, Scotland
United Kingdom
Telephone: (44) (35) 52-39101
MOS 1
Wafer size: 150mm
Processes: CMOS, HMOS
Products: MCUs, linear and logic ICs
1-222
Motorola, Inc.
3501 Ed Bluestein Boulevard
Austin, Texas 78721
Telephone: (512) 928-6000
MOS 2
Wafer size: 100mm
Process: CMOS
Products: Logic ICs, ASICs
Motorola
Motorola, Inc.
Austin, Texas 78721
Telephone: (512) 928-6000
MOS 3
Wafer size: 100mm
Products: MCUs
Motorola, Inc.
5005 East McDowell Road
Phoenix, Arizona 85008
Telephone: (602) 244-6900
MOS 4
Wafer size: 150mm
Process: MOS
Products: Power MOS discretes
Motorola, Inc.
2200 West Broadway Road
Mesa, Arizona 85202
Telephone: (602) 962-2011
MOS 5
Wafer size: 125mm
Processes: CMOS, MOS, bipolar
Products: MCUs, logic, linear, and digital ICs
Motorola, Inc.
Mesa, Arizona 85202
Telephone: (602) 962-2011
MOS 6
Wafer size: 150mm
Processes: CMOS, BiCMOS,
Products: SRAMs, ASICs
Nippon Motorola, Ltd.
Aizu Facility
1 Oyagi, Kofune
Shiokawa-machi, Yama-gun
Fukushima-ken 969-35, Japan
Telephone: (81) (241) 27-2231
MOS 7
Process: CMOS
Products: MCUs, logic and smart power ICs
(This fab is being upgraded to produce logic IC
with 0.5µm to 0.65µm feature sizes on 200mm
wafers. Construction will start in 1997 and
operations in 1998.)
Motorola, Inc.
Austin, Texas 78721
Telephone: (512) 928-6000
MOS 8
Wafer size: 125mm
Process: CMOS
Products: MCUs, MPUs, SRAMs, DSPs
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Motorola
Motorola, Ltd.
Colvilles Road
Kelvin Estate, East Kilbride
Glasgow G75 0TG, Scotland, UK
Telephone: (44) (35) 52-39101
MOS 9
Wafer size: 150mm
Products: MPUs, MCUs, DSPs, SRAMs
Motorola, Inc.
8105 Irvine Center Drive
Irvine, California 92718
Telephone: (714) 932-5000
MOS 10
Wafer size: 150mm
Process: CMOS
Products: DSPs, linear ICs
(Acquired from Western Digital)
Motorola, Inc.
6501 William Canon Drive West
Austin, Texas 78735-8598
Telephone: (512) 891-2000
MOS 11
Wafer size: 200mm
Products: MCUs, MPUs, SRAMs, DSPs
Motorola, Inc.
1300 North Alma School Road
Telephone: (602) 814-4691
MOS 12
Wafer size: 200mm
Process: CMOS
Products: MCUs, DSPs, linear ICs
Motorola, Inc.
Austin, Texas 78721
Telephone: (512) 928-6000
MOS 13
Wafer size: 200mm
Process: CMOS
Products: MPUs, SRAMs
Feature sizes: 0.35µm-0.5µm (0.25µm capable)
Motorola, Inc.
3026 Cornwallis Road
Research Triangle Park, North Carolina 27709
Telephone: (919) 549-3100
MOS 15
Wafer size: 150mm
Process: CMOS
Products: MCUs, logic ICs
(Acquired from Harris Semiconductor)
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Motorola
Motorola, Ltd.
Headrig Road
South Queensferry
West Lothian EH 30 9SH, Scotland
MOS 16
Wafer size: 150mm
Processes: BiCMOS, CMOS
Products: MPUs, logic ICs
(Acquired from Digital Equipment Corporation)
Motorola
Tainjin, China
MOS 17
Wafer size: 200mm
Products: ICs for wireless communications
(Scheduled to begin production in 1998)
Motorola, Inc.
West Creek, Virginia
MOS 19
Wafer size: 200mm
Process: CMOS
Products: MPUs
(Scheduled to begin production in 1999)
Motorola, Inc.
Mesa, Arizona 85202
Telephone: (602) 962-2011
BP 1
Wafer size: 100mm
Products: Linear and smart power ICs
Motorola, Inc.
Mesa, Arizona 85202
Telephone: (602) 962-2011
BP 2
Wafer size: 100mm
Motorola, Inc.
Mesa, Arizona 85202
Telephone: (602) 962-2011
BP 3
Wafer size: 100mm
Products: ASICs, logic and linear ICs
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Motorola
Motorola Semiconducteurs
126 Avenue du General Eisenhower
Le Mirail BP 1029
31023 Toulouse Cedex, France
Telephone: (33) (61) 41-11-88
BP 4 and Bipolar Power Fabs
Wafer size: 100mm (moving to 150mm in 1995)
Products: Linear, smart power, and RF ICs,
discretes, optoelectronics
Motorola, Inc.
5005 East McDowell Road
Phoenix, AZ 85008
Telephone: (602) 244-6900
RF Power and Rectifier Fabs
Processes: Bipolar, GaAs
Products: Discretes, RF MMICs, optoelectronics
Tohoku Semiconductor Corporation
Izumi-ku, Sendai-shi,
Miyagi Prefecture, Japan
Products: DRAMs, SRAMs, MPUs, ASICs
(Joint venture with Toshiba. An individual
profile of Tohoku is provided in this publication)
Key Agreements
• In early 1996, Motorola and IC Works entered into an agreement under which IC Works became an
authorized second source of selected Motorola CMOS and BiCMOS mixed-signal timing circuits.
Moreover, the two companies will work together to broaden their existing lines with complementary timingcircuit devices.
• In late 1995, Motorola announced it would join the IBM-Siemens-Toshiba DRAM development alliance.
By joining the team, Motorola gains access to technology for 64M and 256M DRAMs, and will take part in
the development of 1G DRAMs. In addition, Motorola and Siemens agreed to build a jointly owned
DRAM fab in the U.S.
• International Rectifier signed a cross-licensing and alternate-source agreement with Motorola in early
1995 covering power ICs and power discretes.
• Motorola and IBM are jointly developing, producing, and marketing the PowerPC family of RISC
microprocessors (Apple Computer also plays a part in the design of the MPUs).
• Motorola and Cherry Semiconductor have an agreement to develop mixed-signal ASICs for the
automotive market.
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Motorola
• Motorola licensed the SRAM-based FPGA technology of Pilkington Microelectronics Ltd. of the United
Kingdom in 1992. Motorola's first FPGAs were announced in 1995. In late 1995, Motorola also licensed
Pilkington’s field programmable analog array (FPAA) technology.
• Motorola is partnering with National Semiconductor and Toshiba to develop and market new fast, highdrive, low-voltage CMOS bus interface chips.
• Motorola is working with IBM, Loral Federal Systems, and Lucent Technologies to establish a
manufacturing infrastructure for x-ray lithography. The team hopes to have a manufacturing capability by
1997.
• Motorola has an RFID product agreement with Matsushita and ferroelectric memory pioneer Symetrix
Corp. Motorola's subsidiary Indala Corp. will jointly produce a family of read/write RFID chips with
Matsushita incorporating Symetrix's ferroelectric memory technology (Matsushita has an equity stake in
Symetrix and has the right to relicense its technology).
1-227
National Semiconductor
NATIONAL SEMICONDUCTOR (NSC)
National Semiconductor Corporation
2900 Semiconductor Drive
P.O. Box 58090
Telephone: (408) 721-5000
Fax: (408) 732-9742
Web Site: www.nsc.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends May 31
Sales
Net Income
R&D Expenditures
Employees
1991
1992
1993
1994
1995
1,702
(151)
199
110
1,718
(120)
208
189
2,014
130
229
235
2,295
264
256
271
2,374
264
283
479
29,800
27,200
23,400
22,300
22,400
National Semiconductor was established in Danbury, Connecticut, as a manufacturer of transistors in 1959.
In 1967, the company moved its headquarters to Santa Clara, California, where it began producing
proprietary ICs.
National has become a leading supplier of technologies for moving and shaping information that include
data and voice networks; imaging, interface, and data bus protocols; audio and video signal processing; and
mixed-signal applications. End-user markets for the company are focused in personal computers,
telecommunication and switching systems, automotive, and mass storage. Other markets include data
communications, power management, consumer electronics, and military/aerospace.
At the beginning of fiscal 1996, National decentralized its business by eliminating its group structure, leaving
seven main operating divisions: the Analog and Mixed-Signal Divisions, the Data Management Division, the
Embedded Technologies Division, the Local Area Networks Division, the Wide Area Networks Division, and
the Personal Systems Division.
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The Analog and Mixed-Signal Divisions offer a variety of analog products including standard products,
application specific products, and full custom devices, as well as advanced mixed-signal solutions. The Data
Management Division offers high performance chips for switching and data manipulation applications. The
Embedded Technologies Division consists of microcontrollers and memory products. The Local and Wide
Area Network Divisions provide chip solutions for networking computers, telephones, televisions, and
satellites. The Personal Systems Division develops products for the personal computer, laptop, and
workstation markets, particularly peripheral function devices.
In early 1995, National acquired Comlinear Corporation, a Fort Collins, Colorado-based supplier of highfrequency amplifiers, current-feedback devices, analog-to-digital converters, and other analog signal
processing circuits. Comlinear is operating as a separate business unit within National's Analog Mixed-Signal
Systems Division and retains the Comlinear product name.
Japan
9%
Other
17%
Discretes
5%
Logic and Memory
22%
Analog and
Mixed-Signal
56%
Europe
24%
Americas
43%
Southeast Asia
24%
National is continuing to shift its emphasis from its mature products lines (i.e., bipolar and CMOS logic and
memory products) to its higher margin analog and mixed-signal product lines.
Management
Brian Halla
Richard M. Beyer
Ellen M. Hancock
Kirk P. Pond
Patrick J. Brockett
Donald P. Beadle
Charles P. Carinalli
John M. Clark III
Donald Macleod
R. Thomas Odell
Edgar R. Parker
Richard L. Sanquini
Bami Bastani
Mike Bereziuk
Michael D. Burger
W. Wayne Carlson
Chief Operating Officer
President, International Business Group
Senior Vice President and Executive Advisor
Senior Vice President and Chief Technical Officer
Senior Vice President, Finance and Chief Financial Officer
Senior Vice President, Standard Products Group
Senior Vice President, Quality and Reliability
Senior Vice President, Intellectual Property Protection and
Business Development
Vice President and GM, Embedded Technologies Division
Vice President and GM, Personal Systems Division
Vice President and GM, Southeast Asia Division, International
Business Group
Vice President and GM, Data Management Division
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Gordon C. Chilton
David S. Dahmen
Raymond G. Hawkins
Gunner Hurtig III
Tatsuo Ishihara
Keith D. Jackson
Keith M. Kolerus
Robert B. Mahoney
Douglas M. McBurnie
Robert M. Penn
Hans Rohrer
Robert M. Whelton
Richard Wilson
Vice President, Asia Pacific
Vice President and GM, Americas Division, International Business Group
Vice President, Corporate Strategic Planning
Vice President, Japan Division, International Business Group
Vice President and GM, Analog Mixed-Signal Systems Division
Vice President, Strategy, International Business Group
Vice President and Controller
Vice President and GM, Local Area Networks Division
Vice President and GM, Wide Area Networks Division
Vice President, European Division, International Business Group
Vice President and GM, Analog Products Division
MOS MEMORY
DRAM
✔
✔
✔
SRAM
Flash Memory
EPROM
ROM
✔
✔
EEPROM
ANALOG
✔
✔
✔
✔
✔
✔
✔
MOS LOGIC
✔
✔
✔
✔
✔
Consumer/Automotive
Data Conversion
Comparator
Bipolar Memory
✔
Standard Cell
Interface
DIGITAL BIPOLAR
Gate Array
Amplifier
✔
✔
MPU/MCU/MPR
MOS MICROCOMPONENT
✔
✔
✔
MPU
MCU
MPR
DSP
OTHER
✔
✔
✔
Full Custom IC
Discrete
Optoelectronic
Analog and Mixed-Signal Products
Analog products and technology has been one of National’s core competencies since its inception. The
company continues to be a leader in the analog IC industry. Its analog products include high-performance
operational amplifiers, power management circuits, data acquisition circuits, and voltage regulators.
National’s mixed-signal products include circuits for video monitors and consumer audio equipment, real time
clocks, automotive ICs, custom linear ASICs (CLASICs), and peripheral drivers.
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Data Management Products
National’s data management ICs include bipolar, CMOS, and BiCMOS ICs such as the company’s FACT,
FAST, BCT, ABT, and 100K ECL general purpose logic families.
Embedded Technologies Products
This product line consists of 4-bit, 8-bit, and 16-bit microcontrollers, 8-bit and 32-bit microprocessors
(including its own 486-class core), and memory products such as EPROMs (16K to 4M), serial and parallel
EEPROMs (256bit to 64K), and flash memories (4M, 8M, and 16M). These products are targeted at
markets which combine basic computational or logic algorithms with specific memory storage chips.
Networking Products
National is one of the world’s leading suppliers of LAN Ethernet controller chipsets, which are used in
networking computers. The company’s WAN products include ATM, ISDN, and Sonet/SDH families of traffic
management, terminal/access, and transmission devices.
Personal Systems Products
National’s personal systems products consist of peripheral function devices that work in tandem with the host
microprocessor in computer systems. These products include a family of input/output devices that
consolidate many dependent function on the motherboard and a variety of chips for use in high
performance disk drives such as read/write amplifiers, pulse detectors, data synchronizers, encoder/decoder
circuits, and motor speed and head positioning control devices.
National Semiconductor's primary process technology, M2CMOS, is built around a core double-metal CMOS
process. To this core, modules are added to provide a third level of metallization producing analog,
EEPROM, and BiCMOS applications. Optimized for analog and mixed-signal applications, the M 2CMOS
process is used by the majority of the communications and computing group product lines. A wide range of
design rules (down to 0.55µm) are supported by the M 2CMOS process. Plans are to further shrink the
process to 0.35µm by 1997.
In addition to its family of M2CMOS processes, National also utilizes a high-performance core VLSI bipolar
process named ASPECT, which stands for Advanced Poly Emitter-Coupled Technology. ASPECT and its
BiCMOS module, ABiC, are used for high-performance gate arrays, customer-owned designs, and wireless
communications. ASPECT has been scaled from 2.0µm to 0.8µm and will be replaced with BiCMOS at
0.5µm and beyond. The current version of ASPECT and ABiC offer up to four-layers of metallization in
addition to a level zero local interconnect.
A variety of analog processes are used to produce a broad line of linear products. Notable process
technologies are VIP, a high speed complementary bipolar process for operational amplifiers, LB, a medium
voltage automotive market oriented process, LMDMOS, a high power mixed-signal process, and LFAST and
LCMOS, which are used for CLASICs.
The FAST, FACT, and BCT processes are used for bipolar, CMOS, and BiCMOS digital logic.
production feature sizes for FACT are at 1.5µm, while BCT feature sizes are at 1.0µm.
Minimum
National Semiconductor also has a CEPROM process for non-volatile memory products with production
feature sizes of 1.2µm and 0.8µm.
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In 1995, National completed the construction of a new $116 million 200mm BiCMOS and CMOS wafer
production line at its R&D center in Santa Clara, California. The 20,000 square-foot, Class 1 cleanroom is
being used for the fabrication of ICs with 0.35µm geometries (0.25µm geometries in the future). National is
also installing a 200mm wafer line at its fab in Maine for the fabrication of ICs with 0.35µm geometries. The
new $600 million facility will include 40,000 square feet of Class 1 cleanroom and should be ready for
production in 4Q97.
National Semiconductor Corp.
Fairchild Research Center
Telephone: (408) 721-5000
Wafer size: 150mm
Products: R&D
Telephone: (408) 721-5000
Capacity (wafers/week):
Wafer size: 200mm
Products: Analog and mixed-signal ICs
333 Western Avenue
South Portland, Maine 04106
Telephone: (207) 775-8100
Products: Logic and analog ICs, discretes
3333 West 9000 South
West Jordon, Utah 84088
Telephone: (801) 562-7000
Wafer size: 150mm
Process: CMOS
Products: Memory, analog, and logic ICs
1111 West Bardin Road
Arlington, Texas 76017
Telephone: (817) 468-6400
Fabs I and II
Wafer sizes: 150mm
Process: CMOS
Products: Logic ICs, EEPROMs, EPROMs,
Microcomponents, ASICs
National Semiconductor (UK) Ltd.
Earnhill Road
Larkfield Industrial Estate
Greenock PA16 OEQ
Scotland, UK
Telephone: (44) (1475) 633733
Cleanroom size: 106,000 square feet (three facilities)
Products: Analog and logic ICs, MCUs
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National’s semiconductor assembly and test plants are located in Toa Payoh, Singapore; Malacca and
Penang, Malaysia; and Cebu in the Philippines.
Key Agreements
• In early 1996, National joined up with the Belgian research firm IMEC to develop process technology for
the 0.25µm and 0.18µm generations.
• National acquired SiTel Sierra BV, in Hertogenbosch, the Netherlands, which designs and supplies both
components and subsystems for the wireless market and baseband solutions that couple well with
receiver products offered by National.
• National signed a three-year agreement in mid-1995 with Tower Semiconductor Ltd. under which Tower
was to increase its wafer production commitment to National. Tower’s fab in Israel was originally owned
by National, which retains an 8.3 percent interest in foundry.
• In November 1994, National formed a long-term alliance with Synaptics Inc. to jointly develop computer
controls based on human senses (sight, touch, and sound).
• National formed an alliance with 8x8 Inc. (formerly Integrated Information Technology) in 1993.
partners are developing embedded processor, video, and data compression technologies.
The
• National entered a resale and joint-development agreement with NEC for Ethernet ICs in 1993.
• National began jointly developing a new family of CMOS bus-interface logic ICs with Toshiba and
Motorola in 1993.
• National entered a cooperative
manufacturing (1992).
relationship with Matsushita,
including
joint
development
and
• National established a long-term partnership with Toshiba for the development, licensing, design, and
manufacture of NAND and NOR flash memories (1992).
• National entered a networking technology agreement with IBM in 1992 under which IBM licensed to
National its single-chip Token-Ring Protocol Interface Controller (TROPIC) technology for production and
sales.
• National signed a 10-year semiconductor patent cross-licensing agreement with Hitachi in 1991.
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Oak Technology
OAK T ECHNOLOGY
Oak Technology Inc.
139 Kifer Court
Telephone: (408) 737-0888
Fax: (408) 737-3838
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1991
110
4
Employees
1992
43
(3)
1993
30
(5)
5
1994
46
4
6
1995
111
21
15
225
Oak Technology is a leading supplier of high-performance ICs and related software for multimedia
applications in personal computers, PC peripheral products, and consumer electronics. The company has
established four key areas of focus: optical storage, compression/imaging, video/graphics (2D and 3D), and
PC audio.
Founded in 1987, Oak’s initial product offerings were PC graphics chips. In 1988, the company expanded
into Super VGA graphics controllers and grew to become a unit volume leader in the SVGA market segment
between 1989 and 1991. Furthermore, Oak developed the first commercially available CD-ROM controller in
1990 and pioneered the development of an IDE/ATAPI (integrated drive electronics/AT attachment packet
interface) CD-ROM controller in 1993. With the IDE/ATAPI established as an interface standard for CD-ROM
drives, Oak is one of the largest merchant suppliers of CD-ROM controllers.
Oak’s most recent product development includes MPEG video decoders, its Spitfire™ family of 64-bit
video/graphics accelerators, and its Mozart™ family of 16-bit digital audio controllers supporting Sound
Blaster and the Windows Sound System standards.
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Oak Technology
Other
12%
PC Audio
14%
CD-ROM Controllers
74%
In fiscal 1995, 93 percent of sales were derived from foreign customers, primarily in Japan, Singapore, and
Taiwan.
Management
David D. Tsang,
Donald R. Bryson
Sidney Faulkne
Dr. Mou Hsin Yang
Ben T. Taniguchi
Kenji Fujimoto
Abel Lo
Vice President, Optical Storage Business Unit
Vice President, Oak Technology; General Manager, Oak Technology, K.K.
Vice President, Oak Technology; General Manager, Oak Technology, Taiwan
Oak currently offers products in four key multimedia categories: optical storage, compression/imaging,
video/graphics, and PC audio. Oak’s products include CD-ROM controllers, MPEG video decoders, video
compression/expansion processors (VCEPs), 64-bit multimedia video/graphics accelerators, and 16-bit digital
audio controllers.
Oak Technology is a fabless IC supplier. The company's devices are produced by wafer foundry companies,
including Chartered, TSMC, Samsung, and Seiko Epson.
In 1995, Oak Technology entered into several long-term agreements with TSMC and
Semiconductor, securing additional wafer capacity through 2000.
Chartered
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Opti
OPTI
Opti Inc.
2525 Walsh Avenue
Telephone: (408) 980-8178
Fax: (408) 980-8860
Web Site: www.opti.com
Fabless IC Supplier
1991
65
5
17
Sales
Net Income
R&D Expenditures
1992
98
9
6
Employees
1993
85
9
7
2
1994
134
15
9
7
1995
164
11
11
10
220
224
Opti Inc. was spun out from Chips and Technologies in 1989 to focus on developing and supplying core
logic chipsets to the personal computer industry. The company holds the largest share of the world's PC
chipset market. In addition to its core logic chipsets, Opti supplies peripheral and multimedia chipsets as well
as custom ICs for audio/telephone, power management, graphics/video, and storage control applications.
The company’s chipsets provide in one or a few semiconductor devices the core logic functions of a PC as
well as multimedia related functions.
Audio Chips
20%
Core Logic Chipsets
80%
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Europe/Other
16%
North America
25%
Far East
59%
Opti
Management
Stephen Dukker
Jerry Chang
David Zacarias
David Lin
Walt Henry
Matthew Ready
Chin Sun
Paul Tien
Steve Wu
Steve Rowe
Prem Talreja
H.T. Tung
Jeffrey Wang
President
Executive Vice President, Emerging Businesses
Vice President, Multimedia Products
Vice President, Mobile Products
Director, Core Logic Marketing
Director, Core Logic Engineering
Director, Foundry Operations
Opti is the industry's leading supplier of PC core logic chipsets. The company introduced its first 486 AT
chipset in 1989, and its first chipset for the Pentium in 1993.
The initial member of its Viper family of Pentium-class chipsets was unveiled in 1994. The second member
of the family, the Viper-N, is designed for Pentium PCI-based portable computers, and the newest member,
the Viper-M, is a multimedia-enhanced chipset for Pentium PCI-based desktop computers. In addition to
the Pentium, the Viper products will support compatible AMD and Cyrix microprocessors.
In 1993, Opti began to broaden its product line to include peripheral chips. In the fourth quarter of that year,
the company acquired MediaChips Inc., a designer of audio chips. Through the MediaChips acquisition,
Opti began supplying 16-bit audio controller ICs featuring an on-chip sigma-delta audio codec/mixer. That
move was followed by an entrance into the graphics chip market with an LCD controller for notebook
computers in early 1994. Its other peripheral ICs include IDE disk drive controllers and bus-interface bridge
chips.
The process technologies used by Opti in the design and manufacture of its semiconductors include 0.6µm
and 0.8µm CMOS.
Fabless Opti has three principal foundry partners, IBM Microelectronics, Ricoh, and UMC. The company also
uses, to a certain extent, TSMC, Samsung, Winbond, and Toshiba for the fabrication of its wafers.
In 1995, Opti signed a manufacturing and foundry venture agreement with United Microelectronics
Corporation (UMC). Under the agreement, Opti will make a $30 million equity investment in UMC’s joint
venture IC foundry, called United Silicon Inc. (USI). The fab is expected to begin production of 0.5µm
200mm wafers in the second half of 1997.
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Orbit Semiconductor
ORBIT S EMICONDUCTOR
Orbit Semiconductor, Inc.
116 Java Drive
Telephone: (408) 744-1800
Fax: (408) 747-1263
Web Site: www.orbitsemi.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
24
(2)
1
1992
25
0.4
2
0.5
1993
34
2
2
1
1994
50
5
3
4
1995
62
7
5
16
116
120
154
184
278
Orbit Semiconductor was established in 1985 as a subsidiary of Orbit Instruments Corp. In November 1991,
the business was acquired by the company's current management. In June 1995, Orbit acquired KMOS
Semiconductor, a supplier of digital and analog ASICs.
Today, Orbit Semiconductor specializes in semiconductor design, manufacturing, and engineering support
services that allow system designers to manage application specific integrated circuit (ASIC) development,
production, scheduling, and inventory control. Orbit provides its Encore! program that converts FPGAs and
other IC designs into Orbit digital gate arrays for more cost-effective solutions or accelerated delivery. Orbit
also offers a mixed-signal (analog/digital) design service that provides rapid development of custom mixedsignal ASICs. A shared wafer-processing program, Foresight, is provided for cost-effective prototyping of
mixed-signal ASICs. In addition, Orbit offers contract manufacturing programs including hi-rel manufacturing,
a low-cost prototyping service, and charge coupled device (CCD) fabrication.
The company's Encore! program has grown rapidly since it was introduced in October 1992. As of
December 1995, the number of completed Encore! design conversion totaled 733. Revenues from its gate
array program, which includes Encore! and mixed-signal designs, made up 44 percent of total sales in 1995.
Orbit's customers include companies that design various electronic systems and products for application in
the medical, telecommunications, consumer, aerospace and military, computers and peripherals, and other
industries. Sales to foreign customers (primarily in Europe and Asia) accounted for 10 percent of revenues
in 1995.
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Orbit Semiconductor
Management
Gary P. Kennedy
Steve Kam
Joseph K. Wai
Richard B. Kash
Edward Rodriguez
Zahid Ansari
Fernando A. Bettencourt
Brian Gillings
George W. Lewicki
Betty Y. Newkirk
Lynn G. Reed
Glen R. Wiley
Executive Vice President, Technology and Chief Technology Officer
Executive Vice President, Chief Operating Officer,
Chief Financial Officer, and Secretary
Executive Vice President, Mixed-Signal Design
Group Vice President,
Sales, Marketing, Engineering, and Customer Service
Vice President, Product Engineering
Vice President, Software Engineering
Vice President, Customer Service
Vice President, Design Engineering
Orbit's manufacturing services include several IC fabrication programs. The most popular program, Encore!,
is a service that converts netlists for gate arrays or FPGAs into Orbit gate arrays with 270 to 37,000 usable
gates. The resulting circuits are functionally equivalent, but lower in price. Another program, Foresight,
supports multi-project, multi-technology runs and reduces NRE charges.
Subscribers of Foresight's
processes see lower costs because they share space on masks and wafers.
Both Encore! and Foresight users have access to all of Orbit's processes. These include: 1.0µm and 1.2µm
N-well and P-well CMOS processes with various options such as a second poly layer for capacitors and
gates, NPN bipolar transistors with high or low collector resistances, classical EEPROM, imaging buried
channel CCDs with an oxide nitride gate insulator to maintain low leakage on large arrays, and conventional
N-channel and P-channel transistors to allow on-chip digital logic.
Orbit offers additional programs based on its independent manufacturing capabilities. Its low-volume
manufacturing programs include a "High Reliability Manufacturing Program" in support of medical companies
and military contractors and a low-cost prototyping service, typically for fabless semiconductor companies.
Orbit intends to establish and operate a semiconductor production facility in Eilat, Israel. Plans call for a
cleanroom of 12,500 square feet (expandable to 25,000 square feet) with an initial capacity of 1,500
150mm wafers per week, utilizing 0.8µm process technology.
In the meantime, Orbit is in the process of expanding its wafer fabrication capacity in Sunnyvale, California.
The expansion, consisting of an additional 6,000 square feet of cleanroom includes installation of a 150mm
wafer line capable of triple-metal 0.8µm process technology.
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Orbit Semiconductor
Orbit Semiconductor, Inc.
169 Java Drive
Processes: CMOS, CCD
Products: ASICs, foundry services
Feature sizes: 1.0µm, 1.2µm, 2.0µm (0.8µm under development)
1-240
Paradigm Technology
PARADIGM T ECHNOLOGY
Paradigm Technology, Inc.
71 Vista Montana
Telephone: (408) 954-0500
Fax: (408) 954-8913
Web Site: www.prdm.com
IC Manufacturer
Sales
Employees
1991
12
1992
26
1993
37
1994
36
1995
52
155
140
190
205
244
Paradigm Technology was founded in 1987 and is involved in the design, development, and production of
SRAM-based devices and modules. Paradigm targets its products at commercial, industrial, and military
applications in high-end PC and server, telecommunications, and networking systems. Paradigm has
developed a proprietary CMOS process that has achieved feature sizes in the 0.6µm range.
Paradigm completed a successful financial restructuring in June of 1994. The restructuring began in
January 1994 and led to pre-negotiated Chapter 11 filling on March 30, 1994. Paradigm was under Chapter
11 bankruptcy status from March 30, 1994 through May 24, 1994. However, the company emerged with a
record $9.4 million in sales in the quarter ended September 1994. Furthermore, the company received $11
million worth of investments from Singapore-based ACMA Ltd. and National Semiconductor.
In 1Q96, Paradigm acquired startup NewLogic Corporation, gaining products and technology designs that
incorporate logic memory arrays. NewLogic was merged into Paradigm and operates as the firm’s new
system division. The first SRAM-based product will be released in late 1996.
Management
Michael Gulett
Bob McClelland
Phil Siu
Richard Veldhouse
Steve Zadig
1-241
Paradigm Technology
Paradigm Technology manufactures high-performance 256K, 1M, and 4M asynchronous SRAMs, 100MHz
FIFO buffer-memory chips, high-speed processor-specific synchronous burst RAMs, and high-speed cache
RAM modules.
The proprietary technology of Paradigm involves a dual-well CMOS process consisting of two polysilicon
layers and two metal layers, with three of the four layers fully configurable. Its technology has reached
feature sizes of 0.6µm in the newest products.
To add production capacity, Paradigm established a foundry agreement with Atmel in May 1995 (see Key
Agreements) and is working on setting up another. The company also has a foundry alliance with NKK
Corporation in Japan.
Paradigm Technology, Inc.
71 Vista Montana
Wafer size: 125mm
Process: CMOS
Products: SRAMs
Key Agreements
• Paradigm and Atmel signed a five-year manufacturing, product, and technology agreement in May 1995.
Terms of the agreement include guaranteed wafer supply from Atmel to Paradigm for a five year period.
Moreover, Paradigm transferred its 0.6µm SRAM process to Atmel, and the two companies are jointly
developing 0.5µm and 0.4µm technologies for SRAM manufacturing by both. Atmel also made a
significant equity interest in the company.
• Paradigm has an extensive relationship with Japan's NKK Corporation. NKK holds a 10 percent stake in
Paradigm as well as a technology and product license for 256K and 1M SRAMs and FIFOs. The two
companies worked together to codevelop the latest 4M technology. Paradigm also has access to NKK's
state-of-the-art 200mm wafer fabrication facility in Japan.
• Paradigm has a strategic alliance with National Semiconductor that provides National exclusive marketing
and sales rights to Paradigm’s products for military and aerospace applications. National also made an
equity investment in Paradigm.
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Peregrine Semiconductor
PEREGRINE S EMICONDUCTOR
Peregrine Semiconductor Corporation
2909 Canõn Street
Telephone: (619) 523-2660
Fax: (619) 523-2655
Fabless IC Supplier
Employees
40
Founded in 1990, Peregrine Semiconductor develops and markets high-performance integrated circuits
based on its patented UTSi™ (ultra thin silicon) process. Initially, Peregrine focused on developing the UTSi
process and today, through joint research and product development, uses this proprietary technology to
develop high-performance products targeted at specific applications such as wireless communications,
portable computing, and high-speed memory.
Management
Ronald E. Reedy, Ph.D.
Mark L. Burgener, Ph.D.
Stephen Farnow Ph.D.
Ed Lare
Edward R. Moore
David R. Staab
Vice President, Marketing and Product Development
Vice President, Design
Currently, Peregrine is developing the Microcommunicator™ family of frequency synthesizers, which will be
capable of operating at frequencies as high as 2.5GHz. This family of communications products will provide
integrated solutions to wireless system design problems in applications such as satellite, cellular, and
cordless telephones, and cable and direct broadcast satellite television.
The company's devices are currently produced by Asahi Kasei Microsystems in Japan.
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Peregrine Semiconductor
Key Agreements
• In January 1996, Peregrine signed a six-year fab agreement with Asahi Kasei Microsystems Co. (AKM) of
Japan. AKM will provide wafer fabrication to Peregrine in exchange for process technologies. The two
companies are also negotiating a joint development agreement for future products, combining their
capabilities in design, manufacturing, and process technology.
1-244
Pericom Semiconductor
PERICOM SEMICONDUCTOR
Pericom Semiconductor Corporation
2380 Bering Drive
Telephone: (408) 435-0800
Fax: (408) 435-1100
Web Site: www.pericom.com
Fabless IC Supplier
Sales
Employees
1992
0.5
1993
6
1994
19
1995
23
26
40
50
100
Pericom Semiconductor, founded in 1990, designs and markets ultra fast digital and mixed-signal CMOS
and BiCMOS ICs that provide solutions to bottlenecks in high-performance computing and communications
systems. The company's first products were high-performance cache SRAMs. However, its current product
line includes CMOS 5V and 3V logic clock generators and drivers, networking ICs, and application specific
switching devices.
Pericom's 3V, 5V, and 3V/5V products are applicable in computing,
datacommunications, and networking systems.
Founded originally as Pioneer Semiconductor, the company changed its name to Pericom Semiconductor in
1993 to avoid becoming confused with a number of other technology companies with "Pioneer" in their
names.
Management
Alex Hui
Patrick Brennan
John Chi-Hung Hui, Ph.D.
Hank O'Hara
Michael Yen
Van Lewing
Vice President, Applications and Systems Engineering
Director, Marketing
1-245
Pericom Semiconductor
North American Compan y Profiles
Employing proprietary 0.8µm and 0.6µm CMOS and BiCMOS technologies, Pericom provides advanced
logic, clock, and mixed-signal products.
•
•
•
•
•
•
•
High-speed FCT bus interface logic chips with propagation delays as low as 3.2ns
High-speed clock distribution series, including PLL implementation for high clock rates
Fast switching, low impedance bus switches
Wide architecture 16-bit FCT logic families
Low voltage 3.3V, high-performance 16-bit FCT and LPT (low-power technology) logic families
Frequency synthesizer ICs that provide several PLL generated output frequencies for PC applications
Active token ring hub fully integrated, high-performance mixed-signal devices
Pericom has foundry relationships with Austria Mikro Systeme International, Chartered Semiconductor
Manufacturing, and New Japan Radio Corp.
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Power Integrations
POWER I NTEGRATIONS
Power Integrations Inc.
477 North Mathilda Avenue
Telephone: (408) 523-9200
Fax: (408) 523-9300
Fabless IC Supplier
Employees
75
Power Integrations, founded in 1988, is a privately held company focused on the power conversion market.
The company designs, develops, and markets integrated circuits that combine low-voltage analog and digital
control capability with high-voltage power output devices in monolithic form.
The company's technology is used to innovate high-voltage products for the power supply, battery charging,
telecommunications, motor control, and high-efficiency lighting markets.
Management
Howard Earhart
Balu Balakrishnan
Vladimir Rumennik, Ph.D.
Dan Selleck
Robert Staples
Clifford Walker
Shyam Dujari
Vice President, Marketing and Engineering
Vice President, Corporate Development
Director, Marketing
Power Integrations utilizes a proprietary high-voltage BiCMOS process to provide monolithic power supply
and interface products. This process is capable of combining 1,200V N-channel MOSFETs, 700V P-channel
MOSFETs, and 400V L-IGBTs with 5-15V CMOS and bipolar logic devices.
TOPSwitch® is the newest family of products for power conversion applications. In addition to integration
benefits of the high voltage process technology, this family also has patented circuit and system design
innovations.
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Power Integrations
The company's power supply IC product line is targeted at the needs of portable and small form-factor
products such as portable computers, camcorders, cellular telephones, PBX line cards, and feature phones.
The high-voltage outputs of Power Integrations' power supply circuits provide universal input voltage (85-256
VAC) capability. The high-frequency switching capability and low system component count enables low-cost,
small form-factor power supply/chargers to be realized. The power supply ICs cover universal input voltage
applications from 5 watts to 50 watts (10 watts to 60 watts from 220 VAC). A one-watt back converter for
non-isolated ISDN applications is also available.
Its interface IC products are designed for use in energy-efficient, variable-speed electric motors for
appliances such as room air conditioners. The high-voltage capability of these products provides costeffective level shifting capability and control for those 110/220 VAC applications. The latest product is the
INT 100 half-bridge MOSFET driver, providing 800-volt level shifting and control for electric motors in the
50W to 3kW power range.
Foundry relationships with AT&T, Panasonic Semiconductor group of Matsushita, and Oki Electric have been
established for wafer fabrication utilizing Power Integrations' proprietary process.
Key Agreements
• Power Integrations granted Matsushita access to its technology and products for internal consumption
worldwide, and for non-exclusive distribution of the products in Japan and other selected geographical
areas in return for providing foundry support.
1-248
QLogic
QL OGIC
QLogic Corporation
3545 Harbor Boulevard
Costa Mesa, California 92626
Telephone: (714) 438-2200
Fax: (714) 668-5027
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1991
28
2
8
1992
40
(5)
9
Employees
1993
52
6
9
1994
45
5
5
1995
58
4
3
130
140
QLogic Corporation develops and markets a full line of host and peripheral I/O controller chips and host
adapter cards used to connect hard disk drives, optical storage devices, CD-ROMs, and other peripherals to
computer systems. In addition, the company develops small computer system interface (SCSI) target and
disk controller chips used in peripherals and host computers themselves.
QLogic was originally known as Emulex Micro Devices (EMD), a subsidiary of Emulex Corporation. In 1993,
the subsidiary changed its name to QLogic and became a publicly-held company in February of 1994.
To position itself as a major supplier of computer and peripheral controllers, the company is expanding its
SCSI technology. QLogic is devoted to providing its customers with products that optimize the transfer and
management of data between computer systems and peripheral devices, by developing IC chips, host
adapters boards, and software that combine a range of features and technologies.
In 1995, 62 percent of revenues were to foreign customers, primarily in the Pacific Rim region.
Management
H.K Desai
Thomas R. Anderson
William Caldwell
Joseph F. Pleso
David Tovey
Vice President, Computer Product Engineering
1-249
QLogic
QLogic’s semiconductor product families include:
•
The FAS (Fast Architecture SCSI) Family of fast and wide SCSI controller ICs for host and peripheral
applications.
•
The ESP (Enhanced SCSI Processor) Family of SCSI controller ICs based on the industry standard
advanced SCSI core.
•
The TEC (Triple Embedded Disk Controller) Family of 8-bit and 16-bit wide SCSI HDD controllers.
•
The ISP (Intelligent SCSI Processor) Family of fast and wide, bus master host adapter ICs for 32-bit
interfaces.
QLogic is working with Apple Computer to develop a new version of its high performance Fast!SCSI IQ PCI
card for the Power Macintosh platform.
The company relies on outside vendors for the manufacturing of its semiconductor and circuit board
products.
1-250
Quality Semiconductor
QUALITY SEMICONDUCTOR
Quality Semiconductor, Inc.
851 Martin Avenue
Telephone: (408) 450-8000
Fax: (408) 496-0591
Web Site: www.qualitysemi.com
IC Manufacturer
Sales
1991
12
Employees
1992
18
1993
27
1994
38
1995
45
100
160
160
160
Quality Semiconductor, Inc. (QSI) was established in 1989 to provide high-performance CMOS logic and
specialty memory devices. Quality's strategy is to go after existing areas with higher performance parts, then
create new niches that can be developed. The company targets systems manufacturers principally in the
networking, personal computer and workstation, and telecommunications industries.
In January 1996, Quality Semiconductor purchased AWA MicroElectronics, Pty. Ltd. (now Quality
Semiconductor Australia) from AWA Limited, acquiring AWA’s fab facility, foundry business, and design
center in Australia. In the first part of 1996, QSI plans to upgrade the facility in order to migrate to deep-submicron process technologies. The new subsidiary will continue to provide foundry services to AWA’s existing
foundry customers. AWA Limited will have a share of the new subsidiary and jointly develop new products
and technologies with Quality Semiconductor.
Management
Quality Semiconductor Inc.
Paul Gupta
Chun P. Chiu
George Anderl
Kevin Daroca
Steve Vonderach
1-251
Quality Semiconductor
Quality Semiconductor Australia
Phil Cavanagh
President
Andy Brawley
Manager, Operations
Andrew Greatbach
Manager, Marketing
Clive Potter
Manager, Engineering
Quality Semiconductor focuses on high-performance products, particularly FCT logic devices, fast FIFOs,
clock management devices, and high-speed digital logic switches.
Quality Semiconductor Australia
8 Australia Avenue
Homebush, NSW, 2140
Australia
Telephone: (61) 2-763-4105
Fax: (61) 2-746-1501
Cleanroom: 5,000 square-feet
Wafer size: 150mm
Products: Logic and memory ICs, ASICs, foundry services
Feature sizes: 0.8µm, 1.0µm, 1.2µm, 1.5µm (0.6µm in development)
Key Agreements
• Quality will develop new products and technologies through a strategic alliance agreement with AWA
Limited.
• Quality formed a second-source and product development alliance with Sharp Corporation in April 1995
that covers a variety of specialty memory products for advanced networking, multimedia data
communications, and high-performance I/O subsystem applications.
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QuickLogic
QUICKLOGIC
QuickLogic Corporation
2933 Bunker Hill Lane
Telephone: (408) 987-2000
Fax: (408) 987-2012
Web Site: www.quicklogic.com
Fabless IC Supplier
Sales
Employees
1994
7
1995
15
40
90
QuickLogic was founded in 1988 by the inventors of the programmable array logic (PAL) device. Today, the
privately-held company designs and sells high density CMOS field programmable gate arrays (FPGAs)
featuring high speeds and low power consumption, along with high productivity design software.
QuickLogic’s FPGAs compete with conventional high density programmable local devices and gate arrays in
applications such as graphics processing, high-speed memory control, video and image processing, DSP
support logic, and data acquisition.
Management
E. Thomas Hart
John Birkner
Andrew Chan
H.T. Chua
Richard Johnson
Nim Cho Lam
Philip Ong
William Falk
Richard J. Fong
Kathryn Gordon
Edward Smith
Vice President, CAE
Director, CAE Tools Engineering
Director, Product and Test Engineering
Director, Process Development
Director, Marketing
1-253
QuickLogic
QuickLogic's programmable ASIC (pASIC) devices are implemented in a submicron CMOS process and
deliver high speeds and low power consumption. All of the company's existing devices are offered in both
5V and 3.3V power supply versions. They are based on QuickLogic's proprietary metal layer, amorphous
silicon ViaLink® antifuse programming element technology that offers high speeds and high densities (up to
20,000 usable gates). QuickLogic also supplies a comprehensive set of CAE development tools, operating
on the PC and popular workstation platforms. An open architecture approach allows popular third-party tools
to interface to the company's development environment.
pASIC 1 FPGA Family—Consists of four parts in densities ranging from 1,000 usable gates to 8,000 usable
gates (96 to 768 logic cells) and I/O pin counts ranging from 64 pins to 180 pins. The pASIC 1 devices are
based on high-speed, low-power, two-layer-metal 0.65µm CMOS process technology.
pASIC 2 FPGA Family—Consists of seven parts in densities ranging from 3,000 usable gates to 20,000
usable gates (192 to 1,440 logic cells) and I/O pin counts ranging from 120 pins to 336 pins. The pASIC 2
devices are based on high-speed, low-power, three-layer-metal 0.65µm CMOS process technology.
During the first half of 1994, QuickLogic shifted its process technology from a 1.0µm CMOS process (125mm
wafers) supplied by VLSI Technology to a 0.65µm CMOS process (150mm wafers) supplied by Cypress
Semiconductor.
QuickLogic does not fabricate its own ICs, it has a manufacturing and technology agreement with Cypress
Semiconductor. However, QuickLogic does perform all FPGA product testing for both companies.
Key Agreements
• QuickLogic has an agreement with Cypress Semiconductor to develop and produce high-performance
FPGAs. Cypress has rights to market QuickLogic's current FPGA devices, as well as certain future
products and software. In return, QuickLogic has guaranteed wafer production capacity using 0.65µm
CMOS technology, eventually leading to 0.35µm technology.
1-254
Ramtron
RAMTRON
Ramtron International Corporation
1850 Ramtron Drive
Telephone: (719) 481-7000
Fax: (719) 481-9170
Web Site: www.csn.net/ramtron
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
0.1
(15)
11
13
1992
0.1
(23)
15
14
1993
4
(27)
20
14
1994
14
(20)
17
13
1995
11
(2)
12
10
100
129
140
121
88
Ramtron was established in 1984 to produce non-volatile memory products by combining the unique
characteristics of ferroelectric materials with conventional integrated circuitry. The company was the first to
manufacture ferroelectric memory devices. It holds 48 international patents covering its proprietary
technologies and products and more than 81 are pending.
Ramtron's principal business focus is directed toward the development of the commercial manufacture of
ferroelectric RAMs (FRAMs). The company sites benefits of FRAMs as having fast right times, high write
endurance, nonvolatile retention, small form factors, and minimal power consumption. Applications for
FRAM devices include consumer electronics, business machines, communications equipment, test
instruments, industrial controls, and medical equipment.
Besides ferroelectric RAMs, Ramtron is also involved in the development and sale of very high speed
DRAMs the company calls enhanced-DRAMs (EDRAMs), that are based on standard volatile DRAM
technology. In 1995, Ramtron spun off its EDRAM business into a wholly owned subsidiary called Enhanced
Memory Systems, Inc., which has the sole responsibility of developing EDRAMs.
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Ramtron
FRAMs
10%
EDRAMs
90%
EDRAMs have been demonstrated to provide SRAM performance with DRAM density in a product that
approaches DRAM pricing. A large portion of the company’s EDRAM business is targeted at replacement of
fast (≤15ns) SRAMs in high-performance systems. As such, EDRAMs applications include a wide variety of
the highest performing systems such as personal computer motherboards, accelerator boards,
multiprocessor systems, disk controllers, embedded computer modules, digital signal processing systems,
and video graphic systems.
Ramtron's business strategy is to manufacture its own products, to license its products on a contract basis to
other companies, and to license its proprietary technologies to a limited number of IC manufacturers in
exchange for royalties and access to advanced manufacturing capabilities. The company has forged
alliances with IBM, Fujitsu, Hitachi, Rohm, Toshiba, and Nippon Steel Semiconductor.
Management
L. David Sikes
Greg B. Jones
Richard L. Mohr
Elliot M. Philofsky, Ph.D.
Craig Rhodine
Senior Vice President, Technology and Manufacturing
General Manager, Enhanced Memory Systems, Inc.
Ramtron first demonstrated a working 256bit FRAM prototype in 1987 and in 1993, began commercial sales
of 4K FRAMs. Commercial 16K and prototype 64K devices were introduced in 1994. Production of 256K
FRAMs started in the second half of 1995. Ramtron is pursuing the development, through its strategic
alliance partners, of new high-density (1M and above) FRAM products. Ramtron's FRAM products are pin
compatible with many serial and parallel EEPROMs on the market.
The nonvolatile storage element in Ramtron's FRAMs is a capacitor constructed from two metal electrodes
with a thin-film ferroelectric material between the transistor and metallization layers of an industry standard
CMOS manufacturing process.
In addition to nonvolatile memories, Ramtron has identified other products in which ferroelectric technology
may be integrated, including microcontrollers, programmable logic devices (PLDs), and radio frequency
identification devices (RFIDs). Ramtron's joint venture affiliate, Racom ID Systems, Inc., is engaged in the
development of ferroelectric RFID chips and systems.
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Ramtron
Enhanced Memory Systems' enhanced-DRAM (EDRAM) products were developed in cooperation with
United Memories Inc. (UMI) and Nippon Steel Semiconductor (then NMB Semiconductor).
Colorado
Springs-based UMI was formed by Ramtron and NMB in 1988 (see Key Agreements). The EDRAMs are
fabricated at Nippon Steel Semiconductor's fab facility in Japan. Enhanced Memory Systems currently sells
six EDRAM configurations, all of which are 4M in density.
Ramtron International Corporation
1850 Ramtron Drive
Wafer size: 150mm
Process: Ferroelectric CMOS and standard CMOS
Products: Specialty memory ICs
Ramtron's wafers are also manufactured by Rohm Corp., Nippon Steel Semiconductor (0.6µm process), and
IBM (see Key Agreements).
Key Agreements
• Ramtron signed a manufacturing agreement with IBM Corporation in May 1995 for EDRAM production.
Under the agreement, IBM is serving as a foundry for the production of Enhanced Memory Systems'
EDRAMs, and IBM has a non-exclusive license to sell the devices.
• Ramtron added Fujitsu to the list of companies with which it maintains joint design and licensing deals for
ferroelectric memories. The two firms are developing of a 1M FRAM and working on a feasibility study for
16M FRAMs.
• In late 1994, Ramtron signed a cross-licensing deal with ferroelectric memory competitor, Symetrix, also
located in Colorado Springs. Both companies are jointly developing a 3-volt 16K FRAM based on
Symetrix's Y-1 ferroelectric material technology. In addition, Ramtron's ferroelectric technology is now
licensable by Symetrix to its strategic partners, which include Motorola and Matsushita, and Ramtron may
license Symetrix's technology to its partners. The deal also called for Ramtron to purchase half of
Symetrix for about $6 million.
• Ramtron and Rohm signed a joint manufacturing, development, and marketing deal in 1993 giving Rohm
access to Ramtron's line of FRAM products. Under the agreement, Rohm is supplying Ramtron with
wafers and is selling completed devices in Japan under both logos. In addition, joint development of new
ferroelectric-based circuits, including microcontrollers and custom products will take place.
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Ramtron
• A joint program to integrate Ramtron's ferroelectric technology with Hitachi's DRAM manufacturing process
was established in 1992. In early 1994, Hitachi indicated it was satisfied with its pilot program of testing
and packaging midrange density FRAMs. As a result, Hitachi is working with Ramtron to design and
develop 256K, 1M, and 4M FRAMs. Volume production of the 256K FRAM is scheduled for 2H96.
Further, Ramtron agreed to license to Hitachi all its non-standard as well as standard FRAM products.
Ramtron will rely on Hitachi as a foundry for the devices since its own fab is not capable of the feature
sizes required for the larger memories.
• Toshiba agreed to jointly develop and second-source Ramtron’s FRAMs in densities of 256K and above.
• In 1988, Ramtron and NMB Semiconductor (now Nippon Steel Semiconductor) entered into a product
development and license agreement for conventional 1M and 4M DRAMs. Then, in 1990, the two
companies established United Memories, Inc. (UMI) to design and develop advanced memory devices
(not involving Ramtron's ferroelectric technology) for both companies. In 1995, Ramtron sold all its
remaining interest in UMI to Nippon Steel. Now, Nippon Steel manufactures and sell 4M EDRAM
products to Enhanced Memory Systems for resale to EMS’s customers.
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Raytheon Semiconductor
RAYTHEON SEMICONDUCTOR
Raytheon Company
350 Ellis Street
P.O. Box 7016
Mountain View, California 94039-7016
Telephone: (415) 968-9211
Fax: (415) 968-8556
Web Site: www.raytheon.com
IC Manufacturer
Corporate
Sales
Net Income
Semiconductor
Sales
1991
1992
1993
1994
1995
9,274
592
9,058
635
9,201
693
10,013
759
11,716
793
104
105
110
110
115
Employees
1,700
Raytheon Semiconductor is one of the eight divisions of Raytheon Company, an international, multi-industry,
technology-based firm that was founded in 1923. Approximately 10 percent to 15 percent of Raytheon
Semiconductor's sales are to other Raytheon divisions. Half of its external sales are in commercial markets
and the other half are in industrial and military markets.
Raytheon Semiconductor focuses primarily on video and multimedia, ATE and instrumentation, high-speed
communications networks, and RF communications applications. In 1992, the company purchased TRWLSI, a market leader in digital video processing products, as part of a strategy designed to turn its highperformance industrial and military analog and mixed-signal chip strengths into a portfolio that compliments
its commercial abilities. Raytheon’s newest IC products include video encoders for MPEG-2 applications,
multi-standard encoders for cable or satellite systems, and high-speed D/A converters and low-cost A/D
converters.
1-259
Management
Shi-Chuan Lee
James V. DiLorenzo
Arthur J. Hoage
Peter F. Bejarano
Scott Keller
Les Welborn
President, Raytheon Semiconductor
General Manager, Advanced Device Center
Manager, Manufacturing Services
Director, VLSI Products
Director, Linear and Mature Products
Raytheon Semiconductor's products are focused primarily on video/multimedia, ATE and instrumentation,
and communications applications. All new products developed are mixed-signal circuits, including A/D and
D/A converters, and MPEG-2 and multi-standard encoders. These products are based on bipolar processes
ranging in performance from fT = 4GHz to fT = 13GHz and CMOS processes with geometries ranging from
0.5µm to 2.5µm.
Raytheon Company
350 Ellis Street
Telephone: (415) 968-9211
Wafer size: 100mm (3 lines)
Products: Linear, logic, and memory ICs,
discretes
Raytheon Company
Hartwell Road
Bedford, Massachusetts 01730
Telephone: (617) 274-5000
Wafer size: 100mm
Processes: NMOS, CMOS, bipolar
Products: Logic and custom ICs
Feature sizes: ≥0.5µm
Raytheon Company
Missile Systems Division
350 Lowell Street
West Andover, Massachusetts 01810
Telephone: (508) 475-5000
Wafer size: 125mm
Processes: NMOS, CMOS, bipolar, BiCMOS
Products: Logic, custom, and linear ICs
Raytheon Company
Advanced Device Center
350 Lowell Street
West Andover, Massachusetts 01810
Telephone: (508) 470-5000
Wafer sizes: 3in, 100mm
Process: GaAs
Products: MMICs, discretes
1-260
Key Agreements
• Raytheon teamed with New Japan Radio Co. to provide GaAs down converters for the satellite TV market.
1-261
Rochester Electronics
ROCHESTER E LECTRONICS
Rochester Electronics Inc.
10 Malcolm Hoyt Drive
Newburyport, Massachusetts 01950-4018
Telephone: (508) 462-9332
Fax: (508) 462-9512
Fabless IC Supplier
Rochester Electronics was established in 1981 to supply discontinued semiconductors. Rochester offers
entire discontinued lines, both commercial and military, from manufacturers that reduce support for old parts
to rationalize scarce manufacturing and service resources. Increased military cutbacks have also led chip
makers to reduce their support for military parts as they shift to more commercial offerings.
Rochester handles discontinued lines from companies such as AMD, National, Texas Instruments, Harris,
Intel, AT&T, and Raytheon.
Management
Curt Gerrish
President
Rochester has more than 260 million devices in stock, some over 20 years old. Its product lines include
SRAMs, DRAMs, VRAMs, PROMs, logic chips, and linear devices. The company also stocks unfinished
wafers and original mask sets.
Rochester uses more than 30 foundries to manufacture its product lines.
1-262
Rockwell Semiconductor Systems
ROCKWELL SEMICONDUCTOR SYSTEMS
Rockwell International Corporation
4311 Jamboree Road
P.O. Box C
Telephone: (714) 833-4600
Fax: (714) 833-4078
Web Site: www.nb.rockwell.com
IC Manufacturer
Corporate
Sales
Net Income
1991
1992
1993
1994
1995
11,927
601
10,910
483
10,840
562
11,123
634
12,981
742
297
333
423
581
760
1,695
4,000
Semiconductor Systems
Sales
Employees (Semiconductor Systems)
Rockwell International Corporation was incorporated in 1928 and is engaged in the research, development,
and manufacture of diversified products for the following industries: electronics (industrial automation,
avionics, semiconductor systems, and defense electronics), automotive (heavy vehicles and light vehicles),
graphics (printing press systems), and aerospace (space systems and aircraft).
Graphic Systems
5%
Semiconductor Systems
11%
Defense
Electronics
15%
Aerospace
19%
Automotive
24%
Electronics
52%
Business Segment
Avionics
20%
Automation
54%
1995 Electronics Sales by
Business Segment
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Rockwell Semiconductor Systems is the fastest-growing business segment of Rockwell and comprises the
Multimedia Communications Division and the Wireless Communications Division. Rockwell’s Semiconductor
Systems business offers mixed-signal computing chipsets that form the core of a broad family of personal
communications electronics products.
Management
Rockwell International Corporation
Donald R. Beall
Don H. Davis, Jr.
Dwight W. Decker, Ph.D.
President
Armando Geday
Vice President and General Manager, Multimedia Communications Division
Vijay Parikh
Vice President and General Manager, Wireless Communications Division
Rockwell Semiconductor Systems’ key product lines include facsimile, data, and integrated data/fax/voice
modem devices with transmission speeds of up to 28,800 bps, multimedia
engines, wireless
communications engines for GPS receivers, spread spectrum cordless telephony solutions, and power
amplifier devices for cellular phones.
Rockwell introduced the first modem to the worldwide communications market in the early 1950's. To this
day, the company continues to be a leader in the data and fax modem markets, with a current worldwide
marketshare of about 70 percent.
New technologies developed this year by the Multimedia Communications Division include extensions to the
high-speed V.34 product lines, simultaneous voice and data (SVD)—the exchange of voice and data over a
single, standard phone line, and the integration of fax, speakerphone, printer, and copier capabilities into
multifunctional peripheral engines (MFPE) for the SOHO market.
The Wireless Communications Division addresses the digital cordless telephony (DCT) market, with an
integrated circuit component family for 900MHz digital spread spectrum cordless telephones. The division
also offers global positioning system (GPS) receiver engines, wireless packet data chipsets, and is
developing products and technologies to address the Personal Communications Services (PCS) market.
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Digital Communications Division
4311 Jamboree Road
P.O. Box C
Process: CMOS
Products: Linear ICs, memories, MPUs, DSPs,
ASICs
Microelectronic Technology Center
2427 West Hillcrest Drive
Newbury Park, California 91320
Telephone: (805) 375-1256
Wafer size: 100mm
Processes: HBT, MESFET GaAs
Products: ASICs, receivers, power amps,
high-speed digital circuits
1575 Garden of the Gods Road
Colorado Springs, Colorado 80907-3486
Capacity (wafers/month): 7,500
Wafer size: 200mm
Process: CMOS
Products: Linear ICs, memories, MPUs, DSPs, ASICs
Feature sizes: 0.5µm and below
In August 1995, Rockwell purchased the United Technologies Microelectronics Center (UTMC) wafer fab
facility in Colorado Springs, Colorado. The company plans to invest up to $1.2 billion to build a 450,000
square-foot fab facility at this site to produce 7,500 wafers per week, supporting $1.5 billion of
Semiconductor Systems’ annual revenue by 1999. Construction of Phase I, which began in March 1996, will
include a 65,000 square-foot, Class 1 cleanroom with production expected to begin in July 1997.
In early 1995, Rockwell started production of fax/data modem chipsets on a new $150 million 200mm wafer
line that was installed at its fab in Newport Beach. Application-specific DSPs based on the company's new
RSP core-processor architecture are expected to consume the majority of the wafer output from the new
line.
In early 1994, the company executed an agreement to acquire additional 200mm wafer capacity through a
minority equity investment in Chartered Semiconductor Manufacturing, Pte. Ltd., of Singapore. Under the
agreement, Rockwell is guaranteed capacity in Chartered’s new $1.3 billion Fab 2 facility in Singapore. The
new plant began operations in late 1995.
Key Agreements
•
In early 1996, Rockwell and SubMicron Technology announced a long-term technology transfer and
wafer supply agreement. Rockwell will transfer its 0.5µm and 0.35µm CMOS wafer processes and
SubMicron will guarantee Rockwell wafer capacity at its new $1.3 billion, 200mm wafer fab being built
near Bangkok, Thailand. SubMicron is scheduled to begin operations in mid-1997.
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• In July 1995, Rockwell signed a five-year foundry agreement with IMP, Inc. for the wafer fabrication of
CMOS mixed-signal ICs.
• Rockwell signed a licensing agreement with Aerojet Electronic Systems Division to use Aerojet's lowinfrared-background radiation-hardened technology in its infrared detectors. The detectors are used as
sensing elements in tactical systems such as night-vision devices, man-portable weapons, and smart
weapons.
• Rockwell is teamed with McCaw Cellular Communications to develop and provide a Cellular Digital Packet
Data (CDPD) chipset that enables portable PCs to send digital data over cellular phone networks.
• Rockwell is working with Hitachi and Mitsubishi Electric to increase high-speed modem IC production.
Rockwell has transferred technology to Hitachi and Mitsubishi who will produce modem ICs and supply
them to Rockwell.
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Ross Technology
ROSS T ECHNOLOGY
Ross Technology
5316 Highway 290 West
Austin, Texas 78735
Telephone: (512) 349-3108
Fax: (512) 349-3101
Web Site: www.ross.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
Employees
1995
39
(11)
13
1996
101
18
16
75
175
Ross Technology is an independent wholly owned subsidiary of Fujitsu Ltd., which acquired the firm from
Cypress Semiconductor in mid-1993 for about $22 million. In November 1995, Ross completed its initial
public offering, reducing Fujitsu’s share to 61 percent. A minority position in Ross is also held by Sun
Microsystems.
Originally established in 1988, Ross is involved in the design, development, and marketing of advanced
RISC microprocessors based on the Sparc architecture. Ross' high-end Sparc products complement
Fujitsu's existing portfolio of lower-performance Sparc chips. Cypress and Ross agreed to continue a multimillion-dollar development program focused on complex logic-oriented products.
Management
Roger D. Ross
David Zeleniak
Steve Goldstein
Ross Technology's current family of RISC microprocessors include the Colorado 2, 3, and 4 hyperSparc™
lines. The superscaler, superpipelined hyperSparc processors are based on a 0.4µm triple-level-metal
CMOS process and deliver performance of up to 150MHz..
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Ross Technology
The company's devices are manufactured by Fujitsu.
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S-MOS Systems
S-MOS S YSTEMS
S-MOS Systems, Inc.
Telephone: (408) 922-0200
Fax: (408) 922-0238
Web Site: www.smos.com
Fabless IC Supplier
Sales
Employees
1991
125
1992
152
1993
137
1994
135
1995
190
200
210
210
220
210
S-MOS Systems Inc., established in 1983, designs, develops, and markets a full line of very-low-power and
low-voltage (2V) advanced CMOS integrated circuits for a variety of market applications including desktop,
notebook and palmtop computers, handheld instrumentation, data and telecommunications, and mobile
and portable communications devices. The company also provides silicon foundry services through its
Japanese affiliate, Seiko Epson Corporation.
Management
Tadakatsu Hayashi
Tom Endicott
Eiicha Suda
Kai P. Yiu
Takami Takeuchi
Vice President, Product Creation
Vice President, Advanced Systems Division
Executive Director, Finance
S-MOS Systems' IC products include memories (SRAMs, mask ROMs, EEPROMs), 3D graphics geometry
and rendering processors, VGA-LCD controllers, LCD drivers, 4-bit and 8-bit microcontrollers, semicustom
system interface products (SSIPs) for PCI- and PCMCIA-based systems, and products for mobile
communications systems. S-MOS also offers contract manufacturing services on 100mm, 125mm, and
150mm wafers with geometries ranging from 1.2µm to 0.6µm.
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S-MOS Systems
Other products include the CARDIO™ line of products, which are full-function, plug-in PCs, reduced to
PCMCIA-sized cards.
Design, engineering, and marketing of S-MOS's products are handled at its San Jose headquarters.
Manufacturing is done at Seiko Epson's fabrication facility in Fujimi, Nagano Prefecture, Japan.
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S3
S3
S3 Incorporated
P.O. Box 58058
2770 San Tomas Expressway
Telephone: (408) 980-5400
Fax: (408) 980-5444
Web Site: www.s3.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
1991
3
(5)
3
Employees
1992
31
4
5
1993
113
19
12
1994
140
6
18
1995
316
35
42
68
141
230
444
S3 Incorporated was founded in 1989 with the goal of improving the performance of personal computers by
relieving the bottleneck of their graphics subsystems. The company pioneered graphics acceleration in 1991
when it introduced the industry's first single-chip graphics accelerator, significantly improving the performance
of PCs. The 16-bit accelerator was followed by 32-bit and 64-bit families in 1992 and 1993, respectively.
As PCs continue to evolve beyond two-dimensional graphics toward a more natural user interface, S3 is
leveraging its acceleration expertise to offer 3D graphics and video acceleration solutions for home, desktop,
and mobile multimedia computing environments.
Besides 3D graphics and full-motion video, S3 believes that audio, true-color imaging and visualization, realtime communications, and voice and text recognition on the PC, will also require acceleration. To address
the acceleration requirements of those applications, S3 formed two new business divisions in 1995, the
Home and Advanced System Products division and the Multimedia and Mobile Products division. In
addition, the company’s acquisition of Floreat, Inc., a privately-held firm specializing in communications
software, will help it to expand into new markets.
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S3
Asia/Europe/ROW
44%
United States
56%
Management
Terry N. Holdt
Harry L. Dickinson
George A. Hervey
Jackson K.C. Hu
Gary J. Johnson
Ronald T. Yara
Paul G. Franklin
Neal D. Margulis
Michael P. Nell
Maxwell G. Paley
Mark Scheible
Senior Vice President, Sales
Senior Vice President, Finance, and Chief Financial Officer
Senior Vice President, Engineering/Operations
Senior Vice President, Multimedia and Mobile Products
Senior Vice President, Strategic Marketing
Vice President, Home and Advanced Systems Products
Vice President, Software Products
S3 offers a variety of 32-bit and 64-bit graphics and multimedia accelerator ICs, as well as supporting
software drivers. In 1995, the company significantly expanded its product offerings from 2D graphics
acceleration to video acceleration, MPEG decoding, audio processing, 3D acceleration, and mobile
multimedia acceleration. S3’s IC products are listed below.
•
•
•
•
•
•
•
•
•
•
Trio32™ 32-bit DRAM-based integrated 2D graphics accelerators for home and desktop PCs.
Trio64™ 64-bit DRAM-based integrated 2D graphics accelerators for home and desktop PCs.
Trio64V+™ 64-bit DRAM-based, digital-video enabled integrated graphics and video accelerators for
home and desktop PC applications.
Trio64UV+™ 64-bit UMA (unified memory architecture)-based integrated graphics and video accelerators
for home PCs. UMA technology eliminates the need for separate graphics memory in PC systems.
ViRGE™ (video and rendering graphics engine)—a 64-bit DRAM-based 2D/3D graphics and video
accelerators for home PCs.
ViRGE/VX™ 64-bit WRAM-based or VRAM-based 2D/3D graphics and video accelerators for home PCs.
Vision968™ 64-bit VRAM-based multimedia accelerators for desktop PCs.
Aurora64V+™ 64-bit multimedia accelerators for mobile computers.
The Aurora64V+ accelerators
provide notebook computer users with desktop-equivalent graphics performance and multimedia
capability, as well as the industry’s first dual display support.
Scenic/MX1™ (PCI) and Scenic/MX2™ audio/video MPEG-1 decoders for home and desktop PCs.
Sonic/AD™ CD-quality, sigma-delta audio DAC, S3’s first audio product for home and desktop PCs.
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S3
The majority of S3's silicon products are currently manufactured by IBM Microelectronics, Hewlett-Packard,
TSMC, and UMC. In 1995, S3 entered into a partnership with UMC and Alliance Semiconductor to establish
a new jointly owned wafer foundry company in Taiwan called United Semiconductor Corporation (USC). S3
will hold a 25 percent ownership in the venture, which will begin processing 200mm wafers in 3Q96, and will
have the right to purchase up to 31.25 percent of the fab’s output. S3 invested $36 million in USC in 1995
and is committed to invest $52 million in 1996.
United Semiconductor Corporation
(Jointly owned by UMC, S3, and Alliance Semiconductor)
Science-Based Industrial Park
Hsinchu, Taiwan
Wafer size: 200mm
Process: CMOS
Products: Foundry services
(Scheduled to begin production in 3Q96)
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Seeq Technology
SEEQ T ECHNOLOGY
Seeq Technology, Inc.
47200 Bayside Parkway
Telephone: (510) 226-7400
Fax: (510) 657-2837
Web Site: www.seeq.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1991
49
(3)
7
1992
37
(11)
5
1993
33
(4)
3
1994
21
(8)
3
1995
23
1
3
332
190
161
67
67
Employees
Seeq Technology was established in 1981 to develop, produce, and market EEPROMs. Over the years the
company has undergone a series of transitions that has created a company that is today much different
than it was founded to be. Seeq began developing Ethernet products in 1982 and adopted a strategy to
have its products manufactured by outside foundries in 1989. As a result of the foundry alliances that were
established, the company shut down its wafer fab facility in 1992 and thus became a fabless IC supplier. In
early 1994, the company abandoned the market it had itself created by selling its EEPROM business to
competitor Atmel Corporation for $10 million. Additionally, the company's Ethernet adapter board product
line was discontinued in early 1994.
Seeq now focuses exclusively on local area network (LAN) communication devices and subsystems. These
products are targeted at system manufacturers in the personal computer, workstation, printer, networking,
and telecommunications markets.
LAN
subsystems
17%
Europe
10%
Asia-Pacific
28%
U.S.
62%
1-274
LAN ICs
83%
Seeq Technology
Management
Phillip J. Salsbury, Ph.D.
Stephen Dreyer
Walter B. Gebaur
Barry Gray
Robert Hersh
Philip A. Ortiz
Albert Schadlick
Vice President, Eastern Sales
Seeq supplies Ethernet datacommunication controllers, Ethernet chipsets, encoder/decoders, coaxial and
unshielded twisted pair cable CMOS transceivers, and networking modules. The company also sells media
signaling ICs for the high-speed ATM (asynchronous transfer mode) LAN market. Its products are designed
using proprietary digital and mixed-signal CMOS process technologies, including submicron (0.8µm and
0.6µm). In 1995, Seeq doubled its product line by introducing ten new products such as controllers, media
interface adapters, and transceivers.
Seeq has established several agreements with wafer-based and ASIC-based foundry suppliers. Its volume
wafer processing partners are AMI, Hualon Microelectronics Corporation (HMC), Ricoh, and Rohm. VLSI
Technology and Samsung are used for turn-key manufacturing using either a standard cell or a gate array
approach.
Key Agreements
• In 1995, Seeq re-established its foundry relationship with HMC for the manufacture of its mixed-signal
products with an agreement that guarantees foundry services through July 1998. Seeq is also sharing
resources with HMC to codevelop new generations of analog circuits for Ethernet data communications
products.
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Semtech
SEMTECH
Semtech Corporation
652 Mitchell Road
Telephone: (805) 498-2111
Fax: (805) 498-3804
IC Manufacturer
Financial History ($M), Fiscal Year Ends January 31
Sales
Net Income
R&D Expenditures
1992
27
1
1993
20
0.4
1
Employees
1994
21
1
1
1995
36
2
1
1996
62
7
n/a
340
372
500
Semtech Corporation, incorporated in 1960, manufacturers and market a wide variety of semiconductor
products focused at both commercial and military applications.
Initially, Semtech only supplied
semiconductor devices to the military and aerospace industries. However, in 1990, Semtech began its
migration into commercial markets with the acquisition of Lambda Electronics. This equipped Semtech with
an IC fab facility in Corpus Christi, Texas. In 1992, the company acquired Modupower Inc., a supplier of
solid state modules, further moving Semtech into the commercial marketplace. In late 1995, Semtech
acquired ECI Semiconductor, an analog semiconductor manufacturer located in Santa Clara, California.
From ECI, Semtech gained new process technology, additional wafer fab capacity, and ECI’s foundry
customer base.
Today, Semtech’s primary focus is on the personal computer and telecommunications market, though it still
maintains a presence in the military and aerospace market. In 1995, military and aerospace revenues
accounted for 40 percent of total revenues.
Military and
Aerospace
40%
Commercial
60%
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Semtech
Management
John D. Poe
Raymond E. Bregar
David G. Franz, Jr.
Arthur E. Fury
Executive Vice President, Corporate Operations
Semtech offers a wide range of integrated circuits and discrete devices including transient voltage
suppressers, linear and switching voltage regulators, DC-to-DC power modules, rectifiers, high voltage
monolithic ceramic capacitors, and modular assemblies.
Through its acquisition of ECI Semiconductor, Semtech now offers linear and mixed-signal CMOS arrays,
linear bipolar arrays, standard analog circuits, and RF discretes, in addition to offering foundry services.
Semtech
121 International Boulevard
Corpus Christi, Texas 78406
Telephone: (512) 289-0403
Wafer size: 100mm
Process: Bipolar
Semtech
652 Mitchell Road
Telephone: (805) 498-2111
Products: Discretes
Semtech (formerly ECI Semiconductor)
975 Comstock Street
Products: ASICs, linear ICs, discretes, foundry services
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Sensory Circuits
SENSORY C IRCUITS
Sensory Circuits, Inc.
Telephone: (408) 452-1000
Fax: (408) 452-1025
Web Site: www.sensoryc.com
Fabless IC Supplier
Employees
29
Founded in 1994, Sensory Circuits is a privately held company that designs and markets low-cost ICs that
perform speech recognition, speaker verification, speech and music synthesis, audio record/playback, and
general purpose product control for consumer electronic applications including telecommunications devices,
interactive toys, home appliances, personal electronics, and security devices.
Management
Todd Mozer
David Dick
Robert Savoie
Keith Kitami
Jay Zerfoss
Director, Marketing
Director, Finance
Sensory’s current products include the Interactive Speech™ line of integrated circuits (ICs). This family of
chips is designed to “bring life to products” through Sensory’s speech and audio technologies. The
Interactive Speech single-chip ICs utilize neural network technology to deliver low-cost speech recognition
and speaker verification solutions to consumer electronic products.
Other services offered by Sensory Circuits include product specification, vocabulary development for
recognition and synthesis, circuit board design, application programming, product design consulting, and
custom ICs.
Sensory’s complete product line is produced using a 0.6µm CMOS process technology.
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Sierra Semiconductor
SIERRA SEMICONDUCTOR
Sierra Semiconductor Corporation
2075 North Capitol Avenue
Telephone: (408) 263-9300
Fax: (408) 263-3337
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
Employees
1991
86
13
13
1992
92
12
13
1993
83
(13)
15
1994
105
(9)
16
1995
189
1
23
280
322
295
335
480
Sierra Semiconductor, founded in 1984, develops and markets high-performance mixed-signal integrated
circuits for advanced communications applications. The company uses its strengths in broadband, wireless,
data, facsimile, sound, and visual technologies to support the three fundamental segments of the
communications market: wide area infrastructure, local area networking, and user interface. In addition,
Sierra provides communications software support products for personal computers and wireless
communications systems.
In 3Q94, Sierra acquired the remaining 39 percent of PMC-Sierra, Inc. of Burnaby, British Columbia,
Canada. PMC-Sierra, now a wholly owned subsidiary of Sierra Semiconductor, supplies broadband
transmission and networking chipsets for ATM, Sonet/SDH, and T1/E1 applications. PMC was originally
established in 1992 as a spinoff from MPR Teltech Inc., the research arm of the British Columbia phone
company.
In 4Q94, Sierra acquired Prometheus Products, Inc., a supplier of voice modems and applications software
for both Microsoft Windows and Apple Macintosh platforms. Like PMC-Sierra, the Prometheus subsidiary
operates as a separate entity.
International sales accounted for 39 percent of the company’s total revenues in 1995.
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Sierra Semiconductor
Management
James V. Diller
Richard J. Koeltl
Glenn C. Jones
George D. Antenucci
Naresh K. Batra
Alden J. Chauvin, Jr.
Victor Godbole
Raman K. Rao
Marc E. Robinson
Robert L. Bailey
John W. Murphy
Vice President and General Manager, Multimedia Products
Vice President, Strategic Planning and System Engineering
Vice President, Technology Development and Quality
President and Chief Executive Officer, PMC-Sierra, Inc.
President and Chief Executive Officer, Prometheus Products, Inc.
Sierra uses what it calls a "Triple Technology" process that uses its competencies in analog, digital, and
EEPROM technologies to provide complex IC system solutions.
The company's semiconductor product offerings include WAN and LAN chipsets and subsystems; modem
chipsets with data, fax, or integrated data/fax/voice capabilities; audio, voice synthesis, and voice recognition
circuits; and graphics and imaging products.
Sierra Semiconductor is a fabless IC operation, with the majority of its wafers being manufactured by
Chartered Semiconductor. In 1987, the company formed Chartered Semiconductor as a fab-and-test joint
venture with Singapore Technologies Industrial Corporation Pte. Ltd. Sierra originally held a minority interest
in the venture and licensed Chartered Semiconductor to use its manufacturing processes and fab and test
technologies. In 1993, Singapore Technologies Ventures Pte. Ltd. purchased all of the shares held by
Sierra.
Under an agreement that is good through November 1996, Sierra is obligated to purchase up to 60 percent
of its total wafer requirements from Chartered Semiconductor, and Chartered is required to allocate a
percentage of its total wafer production capacity to Sierra. The agreement may be extended to November
1999.
Key Agreements
• Sierra Semiconductor and MPR Teltech formed a new company in 1993 called Sierra Wireless Inc. to
develop and market cellular digital packet data (CDPD) modems and modem subsystems. Sierra
Wireless is based in Vancouver, British Columbia, Canada.
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Signal Processing Technologies
SIGNAL PROCESSING T ECHNOLOGIES (SPT)
Signal Processing Technologies, Inc.
4755 Forge Road
Telephone: (719) 528-2300
Fax: (719) 528-2370
Fabless IC Supplier
Employees
80
Signal Processing Technologies (SPT) is a supplier of high-performance data conversion and signal
conditioning integrated circuits. It was formed in 1983 as a business unit of Honeywell's semiconductor
group. SPT was then acquired in 1989 by a group of private investors and an employee team and was
established as a separate corporation. In June 1990, the company became a wholly-owned subsidiary of
Japan's Toko, Inc., a worldwide supplier of electronic components and integrated circuits.
Management
Ben Takada
Richard Mintle
Alfi Moscovici
Mike Ruebenson
General Manager
Director, Sales and Marketing
Director, Engineering
Director, Finance and Administration
SPT offers a portfolio of products that includes high-speed comparators and A/D and D/A converters. The
company's primary focus is on developing proprietary, high-performance signal conditioning, and data
conversion products. It has received funding from its parent to develop new analog products such as RF
communications and imaging markets.
Toko acts as the foundry for SPT. In late 1992, SPT purchased a former Digital Equipment Corp. R&D
facility, which more than doubled the company's engineering and test area The facility includes a 10,000
square-foot space that SPT may convert into a Class 10 or Class 1 fab in the future.
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Silicon Systems
SILICON S YSTEMS
Silicon Systems, Incorporated
14351 Myford Road
Tustin, California 92680-7022
Telephone: (714) 731-7110
Fax: (714) 731-5457
Web Site: www.ssi1.com
IC Manufacturer
Sales
1991
182
1992
244
1993
260
1994
300
1995
375
Employees
1,800
2,200
2,200
2,000
2,000
Silicon Systems Inc. (SSI) specializes in the marketing, design, and manufacturing of standard and custom
mixed-signal ICs (MSICs), primarily for use in storage products and communications equipment. The firm
was founded in 1972 and initially offered only design services. In the mid-70's, it began subcontracting out
its fab for the production of other companies' devices. In 1982, the firm began manufacturing its own ICs.
In 1989, Silicon Systems was acquired by TDK Corp., a $4.4 billion Japanese producer of ferrite and
magnetic recording products.
Today, Silicon Systems offers MSICs to a growing worldwide customer base. It has largely tied its fortunes
to the disk drive industry, designing and selling ICs aimed at applications in that market. SSI is considered
to hold the largest marketshare of the mixed-signal disk-drive IC market. To a lesser extent, Silicon Systems
focuses on applications in the telecommunications market.
Telecommunications
25%
Disk Drives
75%
1995 Sales by End-Use Market (est)
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Silicon Systems
Management
Yutaka Mori
Rick Goerner
William E. Bendush
Donald Crim
Martin H. Jurick
Jim Peterson
Yoshihito Yamamoto
Senior Vice President, Wafer Fab and Technology
Senior Vice President, Corporate Planning
Vice President, Corporate Planning
Silicon Systems offers a line of custom and standard ICs in bipolar, CMOS, and BiCMOS technologies. It
focuses on ICs that combine analog and digital circuitry.
SSI is organized into two business units, the Storage Products Division and the Communications Products
Division. The Storage Products Division consists of read/write preamps, read channel ICs, disk controllers,
flash controller ICs, and servo controller products. The Communications Products Division consists of
wirelined and wireless modulation, digital transmission, and networking products.
Silicon Systems closed its 100mm wafer fabrication facility in Tustin, California, in May 1995. The company
had been trying to sell the plant since 1993. Silicon Systems is debating whether to break ground for a new
200mm wafer fab or partner with another company.
Silicon Systems
2300 Delaware Avenue
Santa Cruz, California 95060
Wafer size: 150mm
Products: Mixed-signal ICs
Key Agreements
• Silicon Systems has an agreement with Philips for hard-disk drive ICs and bipolar process technology. As
part of an extension of the agreement, Silicon Systems is licensed to use Philips' BiCMOS process
technology and Philips has access to Silicon Systems' foundry services.
• Silicon Systems has a pact with Oki Electric under which the Japanese company is supplying Silicon
Systems with 1.2µm and 1.5µm foundry services.
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Siliconix
SILICONIX
Siliconix Incorporated
(Member of TEMIC Semiconductors)
2201 Laurelwood Road
Telephone: (408) 988-8000
Fax: (408) 970-3950
IC Manufacturer
Sales
IC Sales
Discrete Sales
Net Income
R&D Expenditures
1991
140
50
90
0
9
7
1992
155
43
112
5
8
13
1993
171
36
135
7
13
18
1994
197
34
163
11
16
25
1995
250
64
186
24
19
28
Employees
1,247
1,202
1,211
1,172
1,269
Founded in 1962, Siliconix designs, manufactures, and markets ICs and discrete components for switching,
motor control, and power management in computers, automotive, instrumentation, and telecommunications
applications. AEG Capital Corporation became a majority shareholder of the company in December 1990,
increasing its ownership from 38.3 percent to 80.1 percent of the company's outstanding stock. In July
1992, Siliconix was joined with Telefunken Semiconductors, Matra MHS, and Dialog Semiconductor to form
the semiconductor division of TEMIC, the microelectronics group of Daimler-Benz AG, a German automotive,
electronics, and aerospace conglomerate.
Automotive
4%
Data
Storage
11%
Hi-Rel
9%
Consumer
3%
Instrumentation
14%
Communications
18%
Industrial
20%
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Japan
13%
Computer
21%
North America
37%
Asia Pacific
24%
Europe
26%
Siliconix
Management
Richard J. Kulle
King Owyang
Jürgen F. Biehn
Michael Gingrass
Rod Graham
G. Thomas Simmons
Executive Vice President, Technology and Silicon Operations
Vice President, Environmental and Plant Services
Siliconix's power transistors and integrated circuits are mainly used for power management and motion
control in computers, hard disk drives, automobiles, and communications systems. The company's analog
switches, analog multiplexers, and low-power transistors are used to sense, switch, and route signals in
video, multimedia, instrumentation, and test equipment in both industrial and hi-rel environments. In 1995,
sales of power MOSFETs and power ICs accounted for about 70 percent of total sales.
Analog Switch and
Low-Power Discrete
30%
Power MOSFET
and Power IC
70%
Siliconix provides products and technologies that directly answer the market's demand for smaller, more
efficient, and more cost-effective components. The company's Lite Foot™ discrete power transistors are the
industry's most compact solution for motion control in hard disk drives and for load management in portable
computers. These miniaturized products can be mounted directly on the printed circuit board, and they are
the first such power devices small enough to fit in a PCMCIA card. The company's Little Foot® line has been
designed into telecom systems, automotive air bag triggers, and numerous other applications where spacesavings and efficiency are at a premium.
Siliconix's power integrated circuits combine the functions of two or more discrete transistors on one chip. A
family of high-frequency switchmode regulator and controller ICs designed for use with Lite Foot or Little Foot
discretes offers the optimal level of integration for DC-to-DC conversion in battery-operated equipment,
including laptop and notebook computers. For data storage customers the company offers highly integrated
chips for voice coil and spindle motor control. Other IC products include power interface devices for
computers equipped with dual battery packs or PCMCIA slots, power ICs for bus control in automobiles, and
analog switches and multiplexers for use in signal switching and routing in electronic instruments and
industrial equipment.
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Siliconix
Siliconix utilizes CMOS, DMOS, BiCMOS, and BiC/DMOS (BCDMOS) technologies in the manufacture of its
IC and discrete products. The company's power ICs are manufactured using its proprietary self-isolated
BCDMOS technologies, which include the BCD15 process for producing power ICs operating from 2.5V to
15V and the BCD60 process for producing power ICs operating up to 60V.
Fab 2
Wafer sizes: 100mm
Processes: CMOS, DMOS, BiCMOS, BCDMOS
Products: Linear and power ICs, discretes
Feature sizes: 3.0µm
Fab 3
Wafer sizes: 150mm
Processes: CMOS, DMOS, BiCMOS, BCDMOS
Products: Power ICs and discretes
Siliconix also uses a foundry in Taiwan for the production of some of its cost-sensitive analog switch and lowpower discrete product lines.
High-volume assembly and product testing is handled at the company's facilities in Kaohsiung, Taiwan, a
joint venture in Shanghai, China, called Simconix, and at subcontractors in the Philippines, Italy, and India.
A limited amount of assembly and product test is performed in Santa Clara.
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Simtek
SIMTEK
Simtek Corporation
1465 Kelly Johnson Boulevard
Telephone: (719) 531-9444
Fax: (719) 531-9481
Web Site: www.csn.net/simtek
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1991
1
(6)
4
Employees
1992
0.5
(6)
3
1993
3
(6)
2
1994
1
(4)
2
1995
3
(2)
2
25
32
25
17
Simtek Corporation has designed, developed, and marketed nonvolatile semiconductor memory products
since it commenced business operations in 1987.
Its concentration has been on the design and
development of fast nvSRAMs (nonvolatile SRAMs) and associated products and technologies.
Simtek's products are aimed at avionics subsystems, portable computers and instruments, medical
instrumentation, navigation aids, robotics, telecommunications systems, and other high performance
applications.
Pacific-Rim
17%
Europe
30%
North America
53%
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Simtek
Management
Sheldon A. Taylor
Sheldon A. Taylor (acting)
Jack Maxcy
Albert S. Weiner
Vice President, Production
Simtek's nvSRAM product family includes 4K, 16K, 64K, and 256K devices with access speeds ranging from
25ns to 45ns. The nvSRAMs utilize a unique patented memory cell technology called Novcel, which
integrates fast SRAM and EEPROM elements in each cell. In late 1993, Simtek introduced its AutoStore™
nvSRAMs, which automatically detect power loss and transfer data from SRAM into EEPROM.
Simtek uses an advanced implementation of silicon-nitride-oxide-semiconductor (SNOS) technology in the
design of its products. The company's Novcel technology is compatible with basic CMOS technology,
allowing nvSRAM memory cells to be incorporated with other system level semiconductor products.
Currently, Simtek is migrating its process technology to a 0.8µm level from a 1.2µm level.
Simtek has a foundry agreement with Chartered Semiconductor Manufacturing (CSM) of Singapore for the
manufacture of its wafers.
Key Agreements
• Simtek signed an agreement with Zentrum Mikroelektronik Dresden (ZMD) in mid-1994 to install its 1.2µm
process in ZMD's fab in Germany and to jointly develop 0.8µm process technology. The agreement was
later modified to bypass the installation of 1.2µm technology and instead install 0.8µm technology. ZMD
also received a license to sell Simtek's 64K and 256K nvSRAMs built in the 0.8µm process.
In 1995, the two companies expanded their relationship to include the joint development of additional
nvSRAMs using the 0.8µm process. ZMD will finance the development in exchange for the right to
convert its investment into additional shares in Simtek. If the option is taken, ZMD, who is already the
largest shareholder of Simtek, will own approximately 25 percent.
• Simtek entered into a manufacturing and development agreement with Chartered Semiconductor
Manufacturing (CSM) in 1992 for 64K through 1M nvSRAMs. CSM will provide Simtek with wafers at least
through 3Q97.
• Simtek established an agreement in 1989 with GEC Plessey Semiconductors under which GEC Plessey
has the right to incorporate Simtek's non-volatile memory technology into its ASICs. In 1990, the
agreement was extended to grant GEC Plessey a worldwide license to manufacture and market Simtek's
nvSRAM devices.
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Single Chip Systems
SINGLE CHIP SYSTEMS
Single Chip Systems Corporation
(formerly Instant Circuit Holdings Inc.)
16885 West Bernardo Drive
Suite 295
Telephone: (619) 485-9196
Fax: (619) 485-0561
Fabless IC Supplier
Single Chip Systems (formerly Instant Circuit Holdings Inc.) was established in 1986 to design electrically
programmable integrated circuits that employ patented antifuse technology. Specifically, Single Chip
Systems is developing IC products for the field programmable gate array (FPGA) market. Since its inception,
the company has developed products primarily through cross licensing agreements. This strategy has
enabled Single Chip Systems to minimize its expenses in developing its products. The company has not yet
sold ICs of its own, but has produced test wafers.
Management
Bruce B. Roesner, Ph.D.
Gregory A. Bohdan
The company's first product is an FPGA (jointly developed with cross license) that offers a significant increase
in operating and programming speed and improvements in chip size and manufacturing cost.
Single Chip Systems' products will be manufactured largely at the fabs of its cross licensees, but also at
independent foundries.
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Sipex
SIPEX
Sipex Corporation
22 Linnell Circle
Billerica, Massachusetts 01821
Telephone: (508) 667-8700
Fax: (508) 667-8310
IC Manufacturer
Sipex Corporation was formed as a result of the merging of four companies: Hybrid Systems Corp.,
DataLinear Corp., Dielectric Semiconductor Inc., and Barvon Technology, Inc. The first two corporations
merged in 1986, Dielectric Semiconductor joined in 1987, and Barvon Technology in 1988.
The company serves the analog signal processing market. It produces interface, ASIC, low voltage, signal
conditioning, signal conversion, and data acquisition system products using both hybrid and monolithic
technology.
Management
Jim E. Donegan
Frank R. Dipietro
Sanford Cohen
Neal Lambert
Chairman and Chief Executive Officer
Chief Financial Officer, and Senior Vice President
Senior Vice President, Technology
Senior Vice President, Manufacturing
Sipex offers both standard and custom products. The standard products include interface (line
driver/receivers), data conversion, and other linear products while the custom products include ASICs, full
custom monolithics, and custom hybrids. The company also provides dielectrically isolated silicon substrates
to a broad spectrum of semiconductor manufacturers.
Sipex has foundry capabilities for producing 3.0µm to 5.0µm dielectrically isolated complementary bipolar
and CMOS linear devices, and has foundry relationships for producing 1.2µm to 4.0µm BiCMOS linear
devices.
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Sipex
Sipex Corporation
22 Linnell Circle
Billerica, Massachusetts 01821
Telephone: (508) 667-8700
Products: Linear ICs, ASICs, interface ICs,
data converters
Sipex Corporation
491 Fairview Way
Telephone: (408) 945-9080
Wafer size: 100mm
Processes: BiCMOS, Bipolar
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Space Electronics
SPACE E LECTRONICS (SEI)
Space Electronics, Inc.
4031 Sorrento Valley Boulevard
Telephone: (619) 452-4167
Fax: (619) 452-5499
Web Site: www.newspace.com/spaceelec
Fabless IC Supplier
Sales
1995
4
Space Electronics, Inc. (SEI) was established in 1992 as a spin-off of Science Applications International
Corporation (SAIC) Microelectronics Technology Center. The focus of Space Electronics is to address the
niche market of spacecraft microcircuits.
Management
Robert Czajkowski
Paul Blevins
David J. Strobel
David Czajkowski
Len Drogo
Edward Li
Chris Wentworth
Manager, Space Products
Manager, Operations
Manager, Sales and Marketing
Manager, Production
Space Electronics' products and services include Rad-Pak™ radiation-hardened microelectronic devices for
the worldwide satellite industry in both defense and commercial applications, MicroMag™ non-cryogenic
magnetic sensing devices based on a magneto-resistive sensor developed and patented by Kodak, and test
lab services.
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Standard Microsystems
STANDARD MICROSYSTEMS (SMC)
Standard Microsystems Corporation
Component Products Division
80 Arkay Drive
Hauppauge, New York 11788-9725
Telephone: (516) 435-6000
Fax: (516) 271-6004
Web Site: www.smc.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends February 28
Corporate
Sales
Net Income
Semiconductor
Sales
1992
1993
1994
1995
1996
133
1
251
16
323
20
379
24
342
12
35
25
57
117
150
Standard Microsystems Corporation (SMC) is comprised of two complementary business divisions:
Component Products and System Products. The System Products Division designs, produces, and markets
hardware and software products for the PC local area network (LAN) market. The Component Products
Division develops, manufactures, and markets VLSI microperipheral circuits. Its products are sold chiefly in
the PC market for input/output and network control applications, and in industrial and transportation markets
for network control applications.
SMC was strictly a chip manufacturer when it was founded in 1971. Then, in the early 1980's, the System
Products Division was created and in 1991, Western Digital's LAN Products Division was acquired. The
company's networking business grew to represent as much as 90 percent of total revenues (fiscal 1993).
However, demand for the Component Products Division’s products has been very strong over the past
couple of years, boosting its share of total revenues to 44 percent in fiscal 1996.
To further its advancement into the chipset market, the Component Products Division announced the
acquisition of EFAR Microsystems, Inc. (EFAR) in early 1996. Technologies obtained from the acquisition
include the UltraCore™ PCI PC systems logic chipset for 64-bit microprocessors and the UltraCache™ PCI
core logic chipset with integrated cache memory. The UltraCore was developed in cooperation with Mosys
Inc. EFAR will operate as a separate business unit called the Personal Computer Systems Logic Business
Unit within the Component Products Division of SMC.
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Management
Paul Richman
Arthur Sidorsky
Executive Vice President, Component Products Division
Anthony M. D’Agostino
Walter J. Kmeta
Senior Vice President, Wafer Fab Operations
Lance Murrah
Senior Vice President and General Manager, System Products Division
Reginald R. Maton, Jr.
Vice President and Chief Information Officer
SMC’s Component Products Division
John E. Burgess
Douglas L. Finke
Lawrence H. Goldstein
Peter Ju
Vice President, Personal Computer Systems Logic Business Unit
Di Ma
Vice President, Foundry Operations
William A. Rotoli
SMC's IC product offering includes the following:
• Personal computer I/O devices that perform many of the basic input/output functions required in every
PC, including floppy disk control, IDE hard disk interface, parallel port control, and serial port control.
Included is a family of Super I/O devices that integrate all of the above functions on a single IC. The
Super I/O family includes some other new products such as a single-chip PCI to IDE hard disk interface.
• Highly integrated single-chip Ethernet products such as an IC that incorporates an encoder/decoder,
10Base-T transceiver, AT bus interface, and memory management unit (MMU) on a single chip.
• ARCNET LAN devices for use in PCs and in industrial networking environments.
• Foundry services for customers desiring wafer fabrication capacity for 1.6µm geometries and above or for
specialized semiconductor processing requirements that require unique thin film expertise.
SMC utilizes a mix of internal and external wafer fabrication sources to manufacture its products. Its more
mature products are produced at its fab in New York, while newer products, utilizing 1.0µm and 0.8µm
technologies are produced by external wafer foundries in the U.S., Europe, and Asia. SMC’s core-logic
products (acquired with EFAR) will initially be built by TSMC in Taiwan.
In 1995, SMC made a $12 million investment in Lucent Technologies’ (formerly AT&T Microelectronics)
Madrid fab and a $20 million investment in Chartered Semiconductor to enhance its external wafer supply
(see Key Agreements).
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Component Products Division
35 Marcus Boulevard
Hauppauge, New York 11788
Wafer size: 100mm
Products: LAN ICs, disk controllers, discretes, foundry services
Key Agreements
• In 1995, SMC made a $20 million investment in Singapore-based foundry Chartered Semiconductor
Manufacturing (CSM) in return for guaranteed capacity from CSM's new 200mm wafer fab that came online in 2H95.
• SMC struck a foundry deal with Lucent Technologies in 1994 under which SMC agreed to boost the
capacity of Lucent's fab facility in Madrid, Spain, in return for a guaranteed portion of the fab output over
a five-year period. The new equipment has the capability to produce devices with 0.9µm to 0.45µm
feature sizes. SMC was supposed to receive its first wafers in 2Q96.
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Supertex
SUPERTEX
Supertex, Inc.
1350 Bordeaux Drive
Telephone: (408) 744-0100
Fax: (408) 734-5247
Web Site: www.supertex.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1992
26
3
4
1
1993
24
2
4
1
1994
26
3
4
1
1995
32
5
4
2
1996
43
7
6
n/a
270
240
235
265
300
Established in 1976, Supertex is a niche-oriented company that designs, develops, manufactures, and
markets high voltage semiconductor products utilizing advanced DMOS and HVCMOS process technologies.
Supertex merged CMOS and DMOS processes creating its proprietary HVCMOS® technology.
The
company originally conducted business as a foundry. However, starting in fiscal 1990, and through fiscal
1992, the company's foundry business was phased out as sales of proprietary products steadily increased.
Supertex's proprietary products are sold to electronic equipment manufacturers in the computer,
telecommunications, instrumentation, defense, medical, and consumer products industries.
More
specifically, Supertex's products are targeted for applications in ultrasound imaging and medical electronics,
flat panel displays, non-impact printers and plotters, telecommunications, and high-reliability military and
commercial aerospace systems.
Europe and
Far East
50%
United States
50%
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Supertex
Management
Henry C. Pao, Ph.D.
Richard E. Siegel
Benedict C.K. Choy
Michael V. Bond
Edward MacKenna
Senior Vice President, Technology Development and IC Products
Vice President, DMOS Products
Vice President, DMOS Process Engineering
Supertex has developed advanced technologies using CMOS and DMOS (Double-diffused MOS) processes.
It pioneered the merging of CMOS and DMOS processes into its proprietary HVCMOS® (high-voltage
CMOS) technology. This process allows for the combination of the high speed and low power logic circuit of
CMOS and the high voltage output drive of DMOS on the same chip, thus creating the high voltage IC, or
HVIC. Supertex intends to maintain a leadership position in the HVIC segment of the semiconductor
industry.
Supertex's DMOS product line includes depletion-mode and low-threshold enhancement-mode transistors
and arrays. Its CMOS products encompass a range of offerings from microprocessor supervisory ICs to
encoder/decoder and smoke detector chips. There are three distinct categories of HVIC products available,
digital products, analog products, and BiCMOS products. The digital product family includes driver/interface
ICs for flat panel displays and non-impact printers and plotters. The analog product family includes high
voltage analog switches and multiplexers, which are used in the medical ultrasound imaging industry, and
pulse width modulators (PWMs). Lastly, the company's BiCMOS product family consists of DC/DC
converters and power supply ICs.
Supertex, Inc.
1235 Bordeaux Drive
Wafer size: 100mm
Processes: CMOS, DMOS, HVCMOS, BiCMOS
Products: High-voltage ICs, discretes
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Supertex
Key Agreements
• Supertex made an agreement with Texas Instruments in 1991 that provided TI the rights to use
Supertex's HVCMOS process technologies in return for license fees and royalties, as well as access to TI's
foundry and assembly services.
• Supertex has received funding from the U.S. Government's ARPA agency to research and develop
dielectric-isolation (DI) technology. The goal of the project is to further raise the voltage and operating
speed of ICs.
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Symbios Logic
SYMBIOS LOGIC
Symbios Logic Inc.
(Formerly AT&T Global Information Solutions
NCR Microelectronic Products Division)
2001 Danfield Court
Fort Collins, Colorado 80525-2998
Telephone: (970) 226-9576
Fax: (970) 226-9626
Web Site: www.symbios.com
IC Manufacturer
Sales
1991
145
1992
228
Employees
1993
274
1994
354
1995
520
1,950
2,010
2,499
Symbios Logic was established in February 1995 when Hyundai completed the purchase of the NCR
Microelectronic Products Division from AT&T Global Information Solutions Co., a wholly owned subsidiary of
AT&T Corporation. NCR Microelectronic Products Division was originally established in 1972 and was
acquired along with NCR Corporation by AT&T Corporation in 1991 (NCR Corporation was later named AT&T
Global Information Solutions and then recently, back to NCR Corporation). Hyundai renamed the division
Symbios Logic, Symbios being a derivative from the word symbiosis, meaning a mutually beneficial
relationship.
Symbios Logic, now a wholly owned, independently operated subsidiary of Hyundai Electronics America,
manufactures semicustom ICs including cell-based ASICs and gate arrays, as well as a family of applicationspecific standard products (ASSPs). Its cell library includes extensive analog functions for cell-based mixedsignal ASICs and complex standard function macrocells (cores) for embedded SCSI, Ethernet, disk drive
electronics, and serial communications. Symbios Logic is a leader in bus interface technology, offering highperformance application-specific SCSI (including an extensive family of PCI-SCSI I/O controllers), Ethernet
parts, and RAID subsystems and controllers. In 4Q95, the company added a line of SCSI Host Adapter
Boards and introduced a Fibre Channel Raid controller board.
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Symbios Logic
Management
H. Gene Patterson
C.S. Chung
Jeff Dumas
Dan Ellsworth
Glenn Gainley
Tom Lagatta
Al Lofthus
Tim McCarthy
Tony Walters
Vice President, Global Planning and Coordination,
Vice President, General Counsel, and Secretary
Vice President, Business Units
Vice President, World Sales
Director, Quality
Symbios Logic is comprised of five business groups: Client/Server, OEM RAID, MetaStor, Drive Electronics,
and ASIC Solutions. Listed below are the major products of each business group.
Client/Server Products
• Client and server I/O products including SCSI devices
• Communications products including LAN communications devices
• SCSI Host Adapter Boards
OEM RAID
• RAID-related products including RAID/disk array controller boards, I/O adapter boards, and OEM
storage subsystems
MetaStor
• Storage related products including RAID/disk array subsystems and tape arrays
Drive Electronics
• Disk and tape drive electronic products and CD-ROM products
ASIC Solutions
• ASIC products include CMOS cell-based ASICs, both digital and mixed-signal, CMOS gate arrays,
and complex core-related products
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Symbios Logic
Symbios Logic Inc.
2001 Danfield Court
Fort Collins, Colorado 80525
Telephone: (970) 223-5100
Wafer size: 150mm
Process: CMOS
Products: ASICs, ASSPs, foundry services
Symbios Logic Inc.
1635 Aeroplaza Drive
Telephone: (719) 596-5795
Wafer size: 200mm
Process: CMOS
Products: ASICs, ASSPs
Symbios expects that approximately 20 percent of its products will be manufactured by Hyundai.
Key Agreements
• Symbios Logic Inc. announced an alliance with Hyundai Electronics Industries (HEI) and Compass Design
Automation in the release of a new deep sub-micron 0.35µm five-layer metal CMOS technology.
• In 1995, Symbios licensed Advanced RISC Machines Ltd.’s “Thumb” 32-bit RISC processor core for use in
I/O channel controllers and other intelligent peripheral products.
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Synergy Semiconductor
SYNERGY S EMICONDUCTOR
Synergy Semiconductor Corporation
3450 Central Expressway
Telephone: (408) 730-1313
Fax: (408) 737-0831
Web Site: www.synergysemi.com
IC Manufacturer
Sales
1993
14
Employees
1994
19
1995
26
110
175
Founded in 1987, Synergy Semiconductor Corporation designs, develops, manufactures, and markets highperformance digital and mixed-signal integrated circuits using bipolar and BiCMOS processes. Synergy’s
products include precision time-clock generators for computers and workstations, and communications
circuits for local and wide area networks. Synergy’s products employ proprietary design and process
technology, resulting in high-performance ICs. The company’s products are designed by an internal design
team, and built in the company’s in-house wafer fabrication facility.
Management
Thomas D. Mino
T. Olin Nichols
George W. Brown
Tom Lauer
Larry J. Pollock
Luke Smith
E. Marshall Wilder
Thomas S. Wong
Vice President, New Business Development
Vice President, Quality and Administration
Synergy supplies high-speed ICs to a range of systems vendors of public network equipment, such as
multiplexers and digital access cross-connect systems (DACS); LAN and WAN private network equipment,
such as adapter cards and hubs; high-performance workstations and superservers; and automatic test
equipment (ATE).
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Synergy’s products encompass three families: the ECLinPS and Super300K family of ultra-high-speed ECL
logic products, the ClockWorks family of clock generation and distributions devices, and the SuperCOM
family of optical fiber transceivers, copper wire transceivers, and clock recovery devices. Synergy recently
introduced a family of network and communication products for Fast Ethernet, FDDI, ATM, SONET, and SDH
applications utilizing its proprietary bipolar ASSET™ (All Spacer Separated Element Transistor) technology.
3450 Central Expressway
Telephone: (408) 730-1313
Wafer size: 100mm
Products: Transceivers, SRAMs, logic products,
clock control circuits, FIFOs, translators
Feature sizes: 1.2µm, 1.5µm (bipolar);
1.0µm (BiCMOS);
submicron in development
System Microelectronic Innovation GmbH (SMI)
Wildbahn, Markendorf
O-15203 Frankfurt (Oder), Germany
Telephone: (49) 335-46-2200
Capacity (wafers/week): 2,400 (10,500 max.)
Wafer size: 100mm
Products: Logic, memory, and linear ICs, ASICs
Feature sizes: ≥1.2µm
(Joint venture between Synergy and the German
government. Synergy holds a 49 percent stake.)
Wafer probing and packaged product test capabilities are performed in-house.
Key Agreements
•
In April 1995, Synergy entered into a technology license agreement with Linear Technology Corporation.
Under the agreement, Synergy gave LTC the right to use the its bipolar ASSET technology to develop
non-competitive products.
•
In March of 1993, Synergy entered into a agreement with the German government to form System
Microelectronic Innovation (SMI). This is a joint venture which is currently 49 percent owned by Synergy
and 51 percent owned by the German government. As part of this agreement, Synergy transferred its
ASSET technology to SMI, enabling it to produce Synergy's family of ECL SRAMs, logic, clock control
circuits, translators, and semicustom products and market them throughout Europe.
•
Synergy entered into a comprehensive strategic alliance with Toshiba Corporation in November 1990.
The alliance covers foundry, joint R&D and manufacturing, technology licensing, and an equity
investment in Synergy by Toshiba. Under terms of the manufacturing agreement, Toshiba is providing
Synergy with the use of a high-volume (150mm, submicron) IC fabrication line, which is running Synergy's
high-performance ASSET and BiCMOS technologies. This fab allows Synergy to produce its current
SRAM and logic products, as well as future products.
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TelCom Semiconductor
T EL COM SEMICONDUCTOR
TelCom Semiconductor, Inc.
1300 Terra Bella Avenue
P.O. Box 7267
Telephone: (415) 968-9241
Fax: (415) 967-1590
IC Manufacturer
Sales
Employees
1994
25
1995
39
125
236
TelCom Semiconductor emerged in December 1993 as a result of a management-led buy-out of Teledyne
Industries' Teledyne Components division. The operation's history stretches back to 1960 when Teledyne
Industries began Amelco Semiconductor, one of Silicon Valley's first semiconductor firms. In 1970, Amelco
merged with Continental Devices to form Teledyne Semiconductor. That company was then combined with
three other Teledyne divisions – Philbrick, Crystalonics, and TAC – in 1990 to form Teledyne Components.
Prior to the formation of TelCom, Teledyne Components' management shut down parts of the company –
Philbrick and TAC – and sold the Crystalonics line.
Today, TelCom Semiconductor is building on Teledyne's strengths in analog and mixed-signal technology to
develop standard ICs for high-volume consumer and commercial markets. TelCom's future growth strategy
centers on the acquisition of mixed-signal technologies addressing the portable computing, communications,
and instrumentation markets. The company has also said it will target energy management products.
Management
Phillip M. Drayer
Edward D. Mitchell
Raphael M. O'Malley
Gary P. Pinelli
Ali Tasdighi
Allan I. Resnick
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Vice President, Quality Management
Vice President, New Product Development
Manager, Operations
TelCom Semiconductor
TelCom's main products are divided into three areas of focus:
• Mixed-signal ICs:
references.
includes display and system A/D converters, V/F and F/V converters, and voltage
• Power management ICs: includes drivers, PWM controllers, DC/DC converters, switching regulators,
voltage detectors, microprocessor supervisor circuits, and change pumps.
• Smart sensors: includes solid-state thermal management and battery management control ICs.
TelCom Semiconductor, Inc.
1300 Terra Bella Avenue
Processes: Silicon- and metal-gate CMOS, BiCMOS,
CMOS/DMOS, DMOS, bipolar
Key Agreements
•
TelCom announced a foundry agreement with IC Works (San Jose, CA). Under the agreement, TelCom
will invest $10 million in equipment and the expansion of IC Works submicron wafer fabrication facility, in
return for wafer capacity.
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Texas Instruments
T EXAS I NSTRUMENTS (TI)
Texas Instruments Incorporated
Semiconductor Group
P.O. Box 655303
Dallas, Texas 75265
Telephone: (214) 995-2011
Fax: (214) 997-5250
Web Site: www.ti.com/sc
IC Manufacturer
1991
1992
1993
1994
1995
Corporate
Sales
Net Income
6,784
(409)
7,440
247
8,523
472
10,315
691
13,128
1,088
Semiconductor
Sales
IC Sales
Discrete Sales
2,635
2,550
85
380
3,080
3,000
80
315
4,100
4,040
60
525
5,550
5,500
50
860
7,900
7,850
50
1,180
Texas Instruments (TI) is one of the leading high-technology companies in the U.S. and one of the top ten
semiconductor manufacturers in the world. It was founded in 1930 as Geophysical Service to provide
geophysical exploration services to the petroleum industry using reflection seismographs. In 1946, the
company formally added electronic systems manufacturing to its operations, and in 1951, adopted its
current name.
TI's products include integrated circuits and discrete devices, defense electronics systems, software
productivity tools, printers, mobile computing products, printers, electronic calculators, and metallurgical
materials. Its printed circuit board contract manufacturing operation was sold to Solectron Corp. in early
1996.
1-306
Texas Instruments
Other
1%
Metallurgical Materials
1%
Defense Systems
13%
Europe
17%
Digital
Products
14%
Components
72%
1995 Sales by Business Segment
East Asia
31%
United States
51%
Texas Instruments’ business is based principally on its broad semiconductor technology and application of
that technology to selected electronic end equipment markets.
The company’s participation in
semiconductors dates back to the emergence of the industry in the early 1950’s. It began the research and
development of semiconductor devices in 1952. Two years later, the company commercialized the transistor
and in 1958, invented the integrated circuit.
Although the company is the leading U.S. merchant producer of DRAMs, much of its semiconductor
emphasis is focused on differentiated products like digital signal processors (DSPs), microcomponents, and
mixed-signal interface devices. TI is the world’s leading supplier of DSPs, and has a strong position in the
mixed-signal device market. The company's bipolar business, meanwhile, is shifting to advanced system
logic, with new differentiated products for emerging markets in computers, consumer electronics, and
telecommunications.
The majority (about 75 percent) of the DRAMs TI sells are sourced from the joint venture companies in which
it holds a majority interest, including TI-Acer in Taiwan, KTI Semiconductor in Japan, and TECH
Semiconductor in Singapore. In addition to expansions of the TI-Acer, KTI, and TECH fabs, TI is involved in
the construction of two other jointly owned DRAM fabs: TwinStar Semiconductor Incorporated, a fab being
built in Texas in partnership with Hitachi; and Alpha-TI Semiconductor, a fab being built near Bangkok,
Thailand, in partnership with Alphatec Electronics.
Management
Tomas J. Engibous
Richard J. Agnich
William A. Aylesworth
Marvin M. Lane, Jr.
Jeff McCreary
Executive Vice President and President, Semiconductor Group
Senior Vice President, Secretary, and General Counsel
Senior Vice President, Treasurer, and Chief Financial Officer
Vice President and Corporate Controller
Vice President, Americas Sales and Marketing
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Texas Instruments
TI's principal semiconductor products include DSPs, CISC and RISC microprocessors and controllers,
graphics ICs, networking chips, ASICs, memory ICs, and mixed-signal devices. Details concerning these
products are provided below.
Processors
• Digital Signal Processors—TI offers a variety of DSP chips, including several generations of dedicated
and programmable 16-bit fixed-point and 32-bit floating-point DSPs; customizable and applicationspecific DSPs; and its Multimedia Video Processor (MVP), a DSP that integrates up to four 32-bit
advanced DSPs and a 32-bit RISC master processor on a single-chip and delivers up to 2 BOPS
(billion operations per second).
• Microprocessors—The TI486 family of Windows-compatible 486-class microprocessors includes DX4,
DX2, and SXLC2 versions with clock speeds of up to 100MHz. In early 1996, TI announced that its
100MHz 486 would be the final microprocessor the company introduces that utilizes the core
technology obtained from Cyrix. TI is now focused on bringing a proprietary 686-level family to the
marketplace, although no introduction date has been released.
• Microcontrollers—TI offers an expanding family of ROM, one-time programmable, and UV-erasable 8bit microcontrollers for applications in automotive, communications, computer, consumer electronics,
and industrial equipment. The company’s next-generation 8-bit and 16-bit MCUs will offer higher
integration levels by utilizing TI’s Prism process for reconfigurable MCU libraries.
• LAN Products—This group of products includes both communications processors and physical layer
interface devices.
Mixed-Signal and Analog Devices
• TI offers a wide range of mixed-signal and standard analog semiconductor products, including power
supply products, amplifiers, comparators, data converters, RAMDACs, telecommunications ICs, power
ICs, sensor signal processors, hard disk drive ICs, speech processors, digital tapeless answering
devices (DTADs), and CCDs. Several of these products are available in low-voltage (3V) versions.
Advanced System Logic Devices
• This family of products includes a full spectrum of devices in a variety of process technologies,
including CMOS, bipolar, and BiCMOS.
TI has second-source agreements with Philips
Semiconductors and Hitachi for Advanced BiCMOS Technology (ABT) logic devices as well as for lowvoltage logic chips.
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Texas Instruments
Memory ICs
• TI’s expanding line of memory ICs includes a broad family of DRAMs (4M, 16M, and 64M), 16M
synchronous DRAMs (SDRAMs), 4M VRAMs, EPROMs, flash memories (512K to 4M), and FIFOs.
TI announced in 3Q95 that it would reduce the production of its EPROMs by as much as 50 percent in
order to provide more capacity for the manufacture of DSPs. The company said it would continue to
support selected EPROM customers, primarily those in the telecommunications and automotive
markets, and those markets that use TI DSP products. TI plans to transition its focus from EPROM to
flash memory technology.
ASICs
• TI was the second largest North American ASIC vendor in 1995. Its application-specific IC products
include high-speed bipolar and CMOS PLDs and CMOS and BiCMOS gate arrays, embedded arrays,
and standard cells. The company’s most advanced ASICs are manufactured with a four-level-metal
0.35µm CMOS process, enabling designs of up to 1.7 million gates.
In April 1995, Texas Instruments sold its antifuse FPGA business to Actel Corporation. TI had been a
licensed second source of Actel's FPGAs since 1988.
MOS MEMORY
✔
DRAM
SRAM
✔
✔
Flash Memory
EPROM
ROM
EEPROM
✔
ANALOG
✔
✔
✔
✔
✔
✔
✔
MOS LOGIC
✔
✔
✔
✔
✔
Gate Array
Standard Cell
Amplifier
Interface
Consumer/Automotive
Data Conversion
Comparator
DIGITAL BIPOLAR
✔
✔
✔
✔
Bipolar Memory
✔
MPU/MCU/MPR
MOS MICROCOMPONENT
✔
✔
✔
✔
MPU
OTHER
MCU
MPR
DSP
Full Custom IC
✔
✔
Discrete
Optoelectronic
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Texas Instruments
Texas Instruments has several major wafer fab projects underway. At the company’s main campus in
Dallas, Texas, $2 billion is being spent to put up a new DSP production facility (DMOS-6) and an R&D
development fab (R&D-1). The $1.6 billion DMOS-6 fab (to begin production by the end of 1997) is being
built to accommodate a production capacity of 7,500 200mm wafers per week. Initially, capacity will be
2,500 wafers per week. Additional equipment will be installed in phases depending on market conditions.
The R&D-1 facility will be used for work on 0.18µm and 0.12µm device generations and eventually for the
company’s development of 300mm wafer technology.
As mentioned earlier, a great deal of fab activity is taking place at each of TI’s joint venture companies. TIAcer recently broke ground on its second fab that is scheduled to begin production of 16M DRAMs in early
1997, and 64M DRAMs later. KTI is completing an expansion of its fab that will double the facility’s wafer
capacity for the manufacture of 64M DRAMs starting in 1997. TECH Semiconductor is building its second
wafer fab, which will have a capacity of 10,000 200mm wafers per week and is expected to be ready in
1998.
Texas Instruments-1
Dallas, Texas 75243
Telephone: (214) 995-2001
Processes: Bipolar, MOS, GaAs
Products: Analog and memory ICs, discretes
Texas Instruments-2
Dallas, Texas 75243
Telephone: (214) 995-2001
Wafer size: 100mm
Process: MOS
Products: Logic and analog ICs, ASICs
Texas Instruments-3
Dallas, Texas 75243
Telephone: (214) 995-2001
Wafer size: 150mm
Products: Analog ICs
Texas Instruments-DMOS 4
Dallas, Texas 75243
Telephone: (214) 995-2001
Wafer size: 150mm
Process: CMOS
Products: DRAMs, EPROMs, logic ICs
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Texas Instruments
Texas Instruments-5
Dallas, Texas 75243
Telephone: (214) 995-2001
Wafer size: 3in
Process: GaAs
Products: Analog and digital ICs
Dallas, Texas 75243
Telephone: (214) 995-2001
Wafer size: 200mm
Process: CMOS
Products: DSPs, MPUs
Dallas, Texas 75243
Telephone: (214) 995-2001
Wafer size: 200mm
Process: CMOS
Products: DSPs
(Scheduled to begin operations in late 1997)
Texas Instruments-R&D-1
Dallas, Texas 75243
Telephone: (214) 995-2001
Wafer size: 200mm
Process: CMOS
Products: R&D
(Scheduled to begin operations in late 1997)
Texas Instruments
2301 North University
Lubbock, Texas 79415
Telephone: (806) 741-2000
Wafer size: 125mm
Products: EPROMs, ASICs
Texas Instruments
Highway 75 South
Sherman, Texas 70590
Telephone: (214) 868-5980
Wafer sizes: 125mm
Process: Bipolar
Products: Logic ICs, MPRs
Texas Instruments
32201 Southwest Freeway
Stafford, Texas 77477
Telephone: (713) 274-2000
Wafer size: 125mm
Processes: Bipolar, NMOS, CMOS
Products: Logic and analog ICs, ASICs
Texas Instruments Japan Ltd.
18-36, Minami 3-chome
Hatagoya-shi, Saitama Prefecture 334
Japan
Telephone: (81) (48) 282-2211
Wafer size: 125mm
Products: Logic ICs, ASICs
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Texas Instruments
2355 Kihara Miho-Mura
Inashiki-gun, Ibaraki Prefecture
Miho 300-04, Japan
Telephone: (81) (29) 885-3311
Products: ASICs, ASSPs, MCUs,
MPUs, DSPs, DRAMs
4260 Aza-Takao
Oaza-Kawasaki
Hiji-Machi, Hayami-gun
Oita Prefecture 979-15, Japan
Telephone: (81) (97) 772-111
Products: Logic and analog ICs, DRAMs
Texas Instruments Italia S.p.A.
Via Antonio Pacinotti 5/7
Nucleo Industriale
I-67051 Avezzano, Italy
Telephone: (39) 863-4321
Process: CMOS
Products: DRAMs
Texas Instruments Deutschland GmbH
Haggertystrasse 1
Freising, Germany
Telephone: (49) 816-1801
Wafer size: 150mm
Products: Logic and analog ICs, ASSPs
6-12, Kita Aoyama 3-chome
Minato-ku, Tokyo 107, Japan
Telephone: (81) (3) 3498-2111
Products: Logic ICs, EPROMs
KTI Semiconductor Ltd.
189-1 Hirano-cho
Nishiwaki City
Hyogo Prefecture 677, Japan
Capacity (wafers/week): 2,750 (6,250 in 1997)
Wafer size: 200mm
Process: CMOS
Products: Logic ICs, DRAMs
(Joint venture with Kobe Steel)
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TI-Acer Incorporated
4F, Industry East 9th Road
Science-Based Industrial Park
Hsinchu, Taiwan
Telephone: (886) (35) 785112
Fax: (886) (35) 782038
Process: CMOS
Products: DRAMs
TECH Semiconductor Singapore Pte Ltd.
P.O. Box 2093, SE 9040
990 Bendemeer Road
Singapore 1233
Telephone: (65) 298-1122
Wafer size: 200mm
Process: CMOS
Products: DRAMs
(Joint venture with the Economic Development
Board of Singapore, Canon, and HP.)
Texas Instruments
TwinStar Semiconductor Incorporated
Richardson, Texas
Wafer size: 200mm
Process: CMOS
Products: DRAMs
(Joint venture with Hitachi. Scheduled to
start production in mid-1996. See Key Agreements.)
Alpha-TI Semiconductor Co. Ltd.
Alphatechnopolis Industrial Park
Chachoengsao, Thailand
Wafer size: 200mm
Process: CMOS
Products: DRAMs
Feature size: 0.4µm, 0.5µm
(Joint venture with Alphatec Electronics.
Scheduled to start production in 2Q97.
Key Agreements
• Fujitsu renewed its semiconductor patent cross-licensing agreement with TI that expired the end of 1995
by signing a 10-year deal that extends through 2005.
• TI is collaborating with IMEC of Leuven, Belgium, on the research of advanced lithography processes to
achieve 0.18µm capabilities for manufacturing 1-gigabit-class semiconductors.
• Texas Instruments and Ericsson have a long-standing alliance in which TI has provided the Swedish
company with its leading edge process technologies for wireless communications.
• Hitachi joined with Texas Instruments for 16M, 64M, and 256M DRAM development and production. The
partners are building a joint 16M and 64M DRAM manufacturing facility in Texas. The $500 million
factory, called TwinStar Semiconductor Inc., will begin producing 16M DRAMs in July 1996 and 64M parts
in 1997. The output will be shared equally between Hitachi and TI. The two companies also have a
separate alternate source agreement for low-voltage logic devices.
• TI, Philips, and Hitachi formed a pact in 1993 covering joint development and alternate sourcing of
FutureBus and BiCMOS logic IC products.
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Texas Instruments
• C-Cube Microsystems and TI made an agreement to codevelop video and audio compression ICs.
• IDT is serving as a second source for a series of TI logic devices and FIFOs.
• TI has a license agreement with Sony for the Japanese company's 16-bit MCUs and ASICs based on the
16-bit core.
• Sun Microsystems and TI are jointly developing asynchronous transfer mode (ATM) network chipsets. TI
and Sun are also jointly developing the next-generation Sparc microprocessor, the 64-bit UltraSparc-I.
• TI has a joint venture with MEMC Electronic Materials, Inc., called MEMC Southwest Inc. (Sherman,
Texas), for the manufacture of raw silicon wafers.
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TLSI
TLSI
TLSI, Incorporated
815 Broadhollow Road
Farmingdale, New York 11735
Telephone: (516) 755-7005
Fax: (516) 755-7626
Fabless IC Supplier
TLSI designs and markets analog, digital, and mixed-signal ICs for the automotive, telecommunications,
industrial process control, security, home appliance, and military/aerospace markets. TLSI was formed as a
division of Telephonics Corp. in 1977 to provide Telephonics with ICs needed for its military and commercial
airline communication systems. Today, TLSI remains a wholly owned subsidiary of Telephonics and
provides ICs to the general marketplace.
Management
Mort Pullman
R. Hartig
Jerry Powder
President
Vice President, Business Management
Director, Sales
TLSI offers a wide range of solutions in the area of full custom MOS, cell-based, and gate array
configurations. Broken down into categories, these alternatives include the following:
Full Custom:
Includes transistor-level designs.
Standard Cell Library:
Characterized functions with auto place-and-route using standard height and variable width cells.
Standard Cell Library with Custom Interconnect:
Characterized functions with Calma operator place-and-route using standard height and variable width
cells.
Minimum Area Cell Libraries with Custom Interconnect:
Custom interconnect with minimum sized cells to reduce die area and development time/cost for highervolume requirements where a full custom configuration may not be required.
1-315
TLSI
Analog and Digital Functions Combined on the Same Chip:
Maximizes system integration and minimizes printed circuit board area.
Processes:
Includes 1.5µm to 3µm CMOS, 1.5µm BiCMOS, and bipolar selected to best fit the customer's specific
application.
1-316
TranSwitch
T RAN SWITCH
TranSwitch Corporation
8 Progress Drive
Shelton, Connecticut 06484
Telephone: (203) 929-8810
Fax: (203) 926-9453
Web Site: www.transwitch.com
Fabless IC Supplier
Employees
90
TranSwitch Corporation designs, develops, and markets highly integrated digital and mixed-signal
semiconductor products for broadband telecommunications and data communications applications.
The company’s product line includes very large scale integration (VLSI) devices that serve four markets:
worldwide public telephone networks, local area networks (LAN), wide area networks (WAN), and cable
television (CATV) systems.
Management
Santanu Das, Ph.D.
Michael F. Stauff
William G. Bartholomay
Frank Middleton
Robert G. Pico
Philip C. Richards
Kandaswamy Thangamuthu
Daniel C. Upp
Jitender K. Vij
Senior Vice President, Chief Financial Officer
Vice President, PLM Transmission Products
TranSwitch’s IC devices include asynchronous (PDH), synchronous (SONET/SDH), and asynchronous
transfer mode (ATM) communications circuits.
The asynchronous products include line interface,
multiplexer/demultiplexer, framer, and data communications devices. The synchronous product line includes
line termination, overhead processor, mapper, and multiplexer/demultiplexer devices. The ATM products
include physical layer, ATM layer, and ATM adaptation layer devices that implement a variety of public and
private switching and multiplexing products.
1-317
Trident Microsystems
T RIDENT MICROSYSTEMS
Trident Microsystems, Inc.
189 North Bernardo Avenue
Telephone: (415) 691-9211
Fax: (415) 691-9260
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1991
28
3
2
Employees
1992
67
12
6
1993
78
10
7
1994
69
1
10
1995
107
8
13
115
130
150
268
Founded in 1987, Trident Microsystems develops and markets very large scale integrated circuits for the
mainstream PC and multimedia markets.
Trident's products address three market segments: PC graphics, video technologies, and 3D acceleration
and multimedia solutions. These are central to the personal computer industry’s expansion into the small
office and home office market where direct display to TVs, flat-panels, and monitors are required. Trident’s
multimedia accelerators drive a mix of graphic and full-motion video data types that include MPEG, off-theair broadcast, live video, and teleconferenced images.
The company’s complete line of 32-bit and 64-bit integrated circuits, video accelerators, and multimedia
video processing chips provide cost-effective easy-to-use graphics solutions based on advanced technology.
Trident was among the first to deliver chips for the new Unified Memory Architecture (UMA), which reduces
system memory costs by efficiently using existing PC memory for the graphics frame buffer. Additionally,
several of Trident’s GUI and video acceleration products include the company’s proprietary TrueVideo
algorithm, the first technology to deliver horizontal/vertical interpolation and diagonal edge recovery for
clearer, sharper full-motion images.
1-318
Trident Microsystems
Management
Frank C. Lin
Jung-Herng Chang, Ph.D.
Tung-Liang Chang, Ph.D.
Peter Jen
James T. Lindstrom
Amir Mashkoori
Richard Silverman
Lawren Farber
Chief Technical Officer
Vice President, ASIC Technology
Director, Marketing Communications
Trident designs its products using 1.0µm, 0.8µm, and 0.6µm CMOS process technologies. The company's
product line includes: 3D and MPEG ICs, advanced mixed-signal GUI accelerators, high-performance SVGA
controllers, multimedia video processing devices, and LCD/CRT controllers.
Trident currently has foundry agreements with Toshiba and Matsushita in Japan; TSMC, UMC, Winbond,
and HMC in Taiwan; and Samsung in Korea.
Key Agreements
• In May 1996, Trident and Samsung announced a long-term partnership.
Samsung will provide
manufacturing capacity to Trident in exchange for mixed-signal ASIC designs from Trident.
• In August 1995, Trident entered into a joint venture agreement with UMC. Under the agreement, Trident
will invest $60 million over the next three years for a 10 percent equity interest in a new 0.5µm 200mm
fab facility UMC is building in Taiwan. Construction is scheduled to be completed in the first half of 1997.
• In June 1995, Trident expanded its relationship with TSMC by signing a five-year foundry agreement.
Under the agreement, Trident will purchase a certain number of wafers each year from TSMC through
1999.
• In October 1994, Trident signed a technology agreement with C-Cube Microsystems, Inc. for the transfer
of C-Cube’s MPEG core technology to Trident. Trident integrated C-Cube's MPEG-1 video decoder
technology in its own graphics accelerator products and introduced an MPEG-1 decoder in 3Q95.
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TriQuint Semiconductor
T RIQUINT S EMICONDUCTOR
TriQuint Semiconductor, Inc.
3625A Southwest Murray Boulevard
Telephone: (503) 644-3535
Fax: (503) 644-3198
Web Site: www.triquint.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
24
(5)
6
1
1992
29
1
7
1
1993
33
1
9
4
1994
30
(10)
10
4
1995
46
3
9
9
180
190
195
222
285
TriQuint Semiconductor designs, develops, manufactures, and markets a broad range of high-performance
analog and mixed-signal gallium-arsenide (GaAs) ICs for the wireless communications, telecommunications,
and computing markets.
TriQuint's mission is to commercialize GaAs ICs for communications and
computing. The company’s continued focus is on achieving new designs and introducing new products in all
three market areas.
Computing
14%
Telecommunications
33%
Wireless
Communications
53%
International
32%
United States
68%
TriQuint's origin can be traced back to 1978, when researchers at Tektronix Laboratories began investigating
GaAs IC technology. Established as a majority-owned subsidiary in 1985, TriQuint Semiconductor was
charged with developing application-specific integrated circuits (ASICs) for high-performance microwave,
linear, and digital systems.
1-320
TriQuint became independent from Tektronix in 1991 when it completed a successful merger with GigaBit
Logic and Gazelle Microcircuits to form a new privately-held TriQuint. In 1993, TriQuint became a public
company.
Management
Steven J. Sharp
Edward C.V. Winn
Gordon Cumming, Ph.D.
Bruce R. Fournier
Joseph I. Martin
Donald Mohn
Philip B. Snow
Richard Wood
Vice President and General Manager, Telecommunications and Computing
Vice President, Wireless Communications
TriQuint Semiconductor's standard and customer-specific products are structured into three end-market
groups: wireless communications, telecommunications, and computing.
Wireless Communications—Standard products for this market are used as building blocks for multipurpose
applications in radio frequency (RF) and microwave systems.
These systems include personal
communications networks, cellular telephones, satellite communications and navigation equipment, and
wireless computer networks. In October 1995, TriQuint announced the first in a family of high-power RF
amplifier ICs for the burgeoning voice and data wireless communications market.
Telecommunications—Most the company's telecommunications ICs are customer-specific, but its does offer
some standard products, such as SONET and SDH multiplexers/demultiplexers and transceivers, ATM
framers, and high-performance crosspoint switches.
Computing—Standard products for this market are concentrated on solving system timing and data
communications performance bottlenecks in high-performance PCs, workstations, servers, and storage
systems.
The company utilizes its proprietary GaAs technology for the production of its ICs. Its GaAs process features
0.5µm to 0.7µm geometries, 4.0µm metal pitch, and a cutoff frequency of up to 21GHz.
TriQuint’s services include GaAs IC design, wafer fabrication, test engineering, package engineering,
assembly, and test services.
1-321
TriQuint Semiconductor, Inc.
3625A Southwest Murray Boulevard
Wafer size: 100mm
Process: GaAs
Products: ASICs, standard components, foundry services
In 1995, TriQuint announced its plans to build a GaAs semiconductor manufacturing facility and office
complex in Hillsboro, Oregon, to provide additional production capacity. The new 165,000 square-foot site
will house all of the company’s manufacturing, engineering, marketing, and administrative functions currently
located in Beaverton, Oregon, with 45,000 square-feet used for the manufacturing facility. Construction is
scheduled to begin in 1996, with completion scheduled for the middle of 1997
Key Agreements
• In April 1996, TriQuint and Philips announced a wafer sourcing agreement. Under the pact, Philips will
develop GaAs ICs for TriQuint to produce according to Philips’ specifications. Assembly and test will be
done by Philips at a facility in Limeil, France.
• In August 1993, TriQuint and AT&T Microelectronics (now Lucent Technologies) announced a set of
agreements involving the development, manufacture, and marketing of GaAs ICs for high-performance
wireless and telecommunications systems. As part of the deal, Lucent discontinued its production of
GaAs wafers and is instead relying on TriQuint for the manufacture of its GaAs wafers. Lucent also
became a minority stockholder in TriQuint. Lucent increased its stake in TriQuint to 8.2 percent in early
1995.
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Tseng Labs
T SENG LABS
Tseng Labs, Inc.
6 Terry Drive
Newtown, Pennsylvania 18940
Telephone: (215) 968-0502
Fax: (215) 860-7713
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1991
61
10
1
1992
75
14
1
1993
76
11
1
1994
81
9
2
1995
39
1
3
50
95
Employees
Tseng Labs has designed and supplied integrated circuits and board-level enhancement products for
graphics and video applications since 1983, its founding year. The company's graphics and multimedia
accelerator products work in conjunction with a PC’s CPU to enhance its overall performance.
U.S.
41%
International
59%
Management
Jack Tseng
David Kwok Ping Hui
John Vigna
James E. Bauer
Mark H. Karsch
Russell Bower
Senior Vice President, Sales and Marketing
Senior Vice President, Finance and Administration, and
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Tseng Labs
Raymond Chang
Barbara J. Hawkins
Richard K. McDowell
Mark Dorfman
Christopher Sutphin
Vice President, Engineering and Product Development
Vice President and Chief Administrative Officer
Vice President, Production and Operations
Director
Director
The first product in the company's line of graphics accelerators, the ET4000/W32, was introduced late in
1992 and became one of the industry's more successful SVGA controllers. Two additional products were
introduced in 1993—the W32i and the W32p. The W32i upgraded the W32 system with a more powerful
graphics accelerator and added a new 32-bit interleaved memory controller. The W32p further enhanced
graphics acceleration and added support for both local bus and the PCI bus architecture.
In November 1994, Tseng Labs introduced its VIPeR f/x advanced video image processor for multimedia
systems. The VIPeR f/x enables full screen, accelerated playback of .AV1 and .MPG video files as well as
simultaneous capture and display of full motion, 30 frames-per-second video.
Tseng is busy bringing to volume production, its ET6000, the first in a family of next generation graphics
controller products. It is an advanced 128-bit graphics and multimedia engine that integrates a high quality
video processor, an interface to the new high-bandwidth Multibank DRAM (MDRAM) from Mosys, Inc., and a
PCI bus interface. Optimized for Windows 95 graphics performance, the ET6000 was designed to offer high
resolution and color without system degradation. To complement the ET6000, Tseng also introduced the
VPR6000, a video image processor, and the MPG9920, an MPEG decoder with built-in scaling capabilities.
The company’s products are based on CMOS process technology with line geometries as small as 0.6µm.
Most of its new products are manufactured using an advanced triple-layer metal process.
Tseng currently has foundry agreements with Chartered Semiconductor Manufacturing in Singapore, Tower
Semiconductor in Israel, and Winbond Electronics in Taiwan.
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Unitrode
UNITRODE
Unitrode Corporation
7 Continental Boulevard
Merrimack, New Hampshire 03054-0399
Telephone: (603) 424-2410
Fax: (603) 424-3460
IC Manufacturer
Financial History ($M), Fiscal Year Ends January 31*
Sales
Net Income
R&D Expenditures
Employees
1992
40
5
3
1993
50
6
4
1994
65
9
6
1995
87
12
9
16
1996
116
18
15
12
235
300
425
514
620
*Results excluding disposed operations.
Unitrode was founded in 1960 as a manufacturer of electronic components and subsystems. In 1994, the
company divested its two remaining non-strategic businesses, Powercube Corporation and Micro Networks
Division, leaving only its IC business, Unitrode Corporation, which was founded in 1981. Unitrode is now
focused entirely on the design and manufacture of high-performance analog integrated circuits. The
company's ICs are used in a variety of applications for power management and as interface devices. For
the most part, the chips are used to control switching power supplies and small electronic motors, or as highspeed interface and communication circuits between various pieces of electronic equipment.
Unitrode's customers are primarily in the EDP/computer and telecommunications markets, but also in the
industrial control and instrumentation, defense/aerospace, automotive, and consumer markets. In fiscal
1996, 67 percent of the company's integrated circuit sales were to international customers.
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Unitrode
Special Function/
Power Drivers
8%
Motor Control
23%
Consumer/
Automotive/
Military
10%
Power
Supply Control
40%
Communication/Interface
29%
Data
Communications
6%
Industrial
10%
Computer/Office
63%
Communications
11%
1996 Sales by Market
Management
Robert L. Gable
Edward H. Browder
Richard V. Paulson
Dennis A. Peasenell
Cosmo S. Trapani
Allan R. Campbell
S. Kelley MacDonald
Patrick Moquin
Frederick J. Myers
President
Executive Vice President, Marketing and Sales
Executive Vice President, Operations
Vice President, Corporate Communications
Unitrode's product offerings are comprised of analog ICs for power supply control, motor control, lighting,
power driving, power quality, and power factoring, as well as for high-speed and high-power interface
applications. Most of the products are based upon proprietary design utilizing enhanced bipolar, BiCMOS,
and BCDMOS semiconductor technologies and are considered application specific standard products
(ASSPs).
Unitrode Corporation
7 Continental Boulevard
Merrimack, New Hampshire 03054
Wafer size: 100mm
Processes: Bipolar, BiCMOS, BCDMOS
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Unitrode
Unitrode has agreements with four foundries to supply additional wafers, as required. In January 1995, the
company signed an agreement with GMT Microelectronics Corporation (former Commodore Semiconductor
fab in Norristown, Pennsylvania) for additional wafer capacity. Under the agreement, Unitrode made a $2
million equity investment in GMT, in return for up to 30 percent of GMT's capacity.
Key Agreements
• Unitrode entered into an alliance with Irvine Sensors. Under the agreement, Unitrode will become a
licensee and exclusive second-source for Irvine Sensors’ wireless infrared communication ICs.
• Unitrode entered into an agreement with GMT Microelectronics Corporation in early 1995 to supply wafers
to Unitrode. As part of the agreement, Unitrode invested $2 million in GMT.
• Unitrode agreed with Toko Inc. (Japan) in 1993 to jointly develop power-control ICs. The deal also calls
for the cross-licensing and alternate sourcing of select proprietary products.
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Universal Semiconductor
UNIVERSAL SEMICONDUCTOR
Universal Semiconductor, Inc.
1925 Zanker Road
Telephone: (408) 436-1906
Fax: (408) 436-1125
IC Manufacturer
Employees
40
Universal Semiconductor was established in 1978 to serve as a CMOS foundry offering design and
manufacturing of customers' custom/semicustom devices, gate arrays (digital and mixed-signal), dielectrically
isolated (DI) high-voltage ICs, linear arrays, and DMOS FETs.
Management
Vic Hejmadi
Greg Anzelc
Wajid Rizvi
Director, Marketing and Sales
Director, Operations
Universal Semiconductor uses CMOS processing for all devices and offers gate arrays with up to 2,400
gates, mixed-signal gate arrays (18V breakdown), and 300V and 500V dielectrically isolated high-voltage
ICs, as well as radiation-hardened devices.
Universal Semiconductor, Inc.
1925 Zanker Road
Wafer size: 100mm
Process: CMOS
Products: ASICs, linear devices, discretes, foundry services
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UTMC
UNITED T ECHNOLOGIES MICROELECTRONICS C ENTER (UTMC)
United Technologies Microelectronics Center Inc.
1575 Garden of the Gods Road
Colorado Springs, Colorado 80907-3486
Telephone: (719) 594-8000
Fax: (719) 594-8032
Web Site: www.utmc.com
Fabless IC Supplier
Sales
Employees
1991
17
1992
20
1993
27
1994
30
1995
30
400
350
300
300
180
United Technologies Microelectronics Center Inc. (UTMC) is a subsidiary of United Technologies Corp. (UTC),
a $23 billion Hartford, Connecticut-based provider of high technology products to the aerospace, building
systems, and automotive industries throughout the world.
Established in 1980, UTMC serves government and commercial aerospace, commercial property and
residential housing, and automotive manufacturing customers. It was originally established to assist other
UTC divisions with the integration of custom and semicustom microelectronics into their systems. In 1985,
UTMC began supplying semicustom and military-standard VLSI circuits to external companies in the
aerospace and defense industries. Today, the majority of UTMC’s business is with external companies. The
company also engages in government- and customer-funded R&D.
Up to about mid-1995, UTMC manufactured its IC products in its own fab in Colorado Springs. However, the
company took on a fabless strategy with the sale of its fab to Rockwell Semiconductor. UTMC reportedly
sold the fab because it could not be operated economically. It was underutilized due to the fact that the
company sells only a small number of wafers with relatively high value. In addition, UTMC felt that by
adopting a fabless strategy, it would be able to move to 0.8µm and smaller geometries more quickly while
not incurring the large capital costs associated with a submicron fab.
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UTMC
Management
Charles "Nick" H. Ide
Chuck Gregory
Rich Paetsch
Ron Hehr
Dwight Deem
President
Vice President, Product Development and Engineering
Director, Marketing
Director, Sales
UTMC offers semicustom and military-standard products. Its semicustom products include CMOS gate
arrays with densities from 3,400 to 150,000 usable gates, CMOS cell-based ASICs, and radiation-hardened
antifuse programmable logic arrays. The process used for the gate arrays and standard cells is a JANqualified low-temperature double- or triple-metal rad-hard process with 1.2µm or 1.5µm geometries.
The company also offers a large selection of radiation-hardened monolithic, ASD/ENASC-certified MIL-STD1553 products. These include bus interface and control devices, bipolar bus transceivers, 16-bit RISC MPUs
and 8-bit MCUs in both rad-hard and non-rad-hard versions, mask ROMs, dual-port RAMs, SRAMs of up to
256K density, and standard bipolar and CMOS logic devices.
Radiation-hardened products accounted for about 40 percent of UTMC’s sales in 1995.
UTMC sold its fabrication facility to Rockwell Semiconductor in mid-1995. As part of the deal, Rockwell
agreed to supply UTMC with wafers until February 1997 as it makes the transition to a fabless operation. In
March 1996, UTMC announced a foundry deal with Loral Federal Systems to obtain production capacity for
rad-hard products from Loral’s fab in Manassas, Virginia (see Key Agreements). Other foundries used by
UTMC include Analog Devices, Honeywell SSEC, and Harris Semiconductor.
Key Agreements
•
UTMC established a three-year foundry supply deal with Loral Federal Systems in March 1996. The deal
makes Loral UTMC’s main foundry for rad-hard CMOS devices.
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Vadem
VADEM
Vadem Ltd.
1885 Lundy Avenue
Suite 201
Telephone: (408) 467-2100
Fax: (408) 467-2199
Fabless IC Supplier
Employees
45
Vadem was established in 1983 as a design house specializing in chips for the portable computer industry
that was emerging at the time. Now, Vadem is building upon its established portable design experience to
become a leading designer and marketer of ICs and related software for subnotebook-size computers and
personal communications devices.
Management
Chikok Shing
Richard H. Lee
Ahmet Alpdemir
Henry Fung
Siu-Kuen Tsang
Norman Farquhar
Phil Mitchell
Geoff Teng
President
Director, ASIC Development
Manager, Software
Manager, Single-Chip PC Products
Manager, PCMCIA Products
Vadem's IC products include display controllers, microprocessors, PCMCIA host adapters, and PC card
controllers for portable systems. Some of these products are described below.
• VG-230—a 16MHz x86-compatible processor for handheld systems. The highly integrated, low-power
consuming processor incorporates a CPU and core logic, along with an LCD controller, keypad scanner,
and PCMCIA controller.
• VG-469—a 208-pin PCMCIA card controller that is register- and software-compatible with Intel's i82365SL
controller ICs. The part provides a migration path for current 5V devices, emerging 3.3V, and future
lower-voltage systems and is compatible with PCMCIA 2.1 ExCA (Exchangable Card Architecture)
extension, Microsoft's Plug-and-Play ISA version 1.0a, and PC Card DMA operation.
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Vadem
• VG-660—claimed to be the industry's first LCD VGA controller. It supports small flat panel displays with
enhanced features and VGA compatibility.
Vadem's primary foundry sources are NEC in Japan and Samsung in Korea. Atmel, Symbios Logic, and
VLSI Technology are used to a lesser extent.
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Vitesse Semiconductor
VITESSE SEMICONDUCTOR
Vitesse Semiconductor Corporation
741 Calle Plano
Camarillo, California 93012
Telephone: (805) 388-3700
Fax: (805) 987-5896
IC Manufacturer
Sales
Net Income
R&D Expenditures
1991
24
(3)
9
11
1992
37
1
9
3
1993
26
(19)
10
6
1994
36
(4)
9
2
1995
43
2
9
3
200
300
238
201
235
Employees
Vitesse Semiconductor, founded in 1984, is a leader in the design, development, manufacturing, and
marketing of digital gallium arsenide (GaAs) ICs suitable for commercial, industrial, and military customers.
The company's custom, semicustom, and standard products are used in a wide variety of industries
including telecommunications, data communications, computers, defense and aerospace systems,
automatic test equipment (ATE), and instrumentation.
Vitesse's mission is to be the dominant supplier of the highest performance IC solutions for communications
and ATE applications. As the communications market shifts from wire to optical channels, and computers
undergo a shift from large proprietary central processors to open distributed processors, Vitesse is
positioning itself to provide leading high-performance digital, analog, and mixed-signal IC solutions.
Foundry
3%
Standard
Products
28%
ASIC Products
69%
1995 Sales by Product
Computers
7%
Government
13%
ATE
21%
Other
3%
Communications
56%
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Japan
4%
ROW
1%
Europe
9%
North America
86%
Management
Louis R. Tomasetta
Ian Burrows
Ira Deyhimy
Chris Gardner
Eugene F. Hovanec
James Mikkelson
Michael Millhollan
Robert Nunn
Neil Rappaport
Ram Venkataraman
Vice President, Fab Operations
Vice President and General Manager, Standard Products
Vice President and General Manager, ASIC Products
Vitesse's products are fabricated using its proprietary H-GaAs™ (high integration gallium arsenide) process
technology. The current generation is the five-level metal, 0.5µm H-GaAs IV process, capable of integration
levels of over one million transistors. ASIC design and simulation is supported on industry standard tools
from Mentor, Cadence, Viewlogic, Synopsys, and Teradyne.
Vitesse's standard products include telecommunications and data communications ICs. Its communications
products address the high-speed data transmission marketplace. Most are designed to be compatible with
the SONET (Synchronous Optical Network), ATM, and Fibre Channel standards. The operating frequency of
these devices is from 155MHz to 10GHz and they are aimed at providing physical layer solutions for copper
or fiber optics communication lines.
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Vitesse's ASIC product line consists of five gate array families: GLX, FX, Viper, SCFX, and Fury™ . Aimed at
the communication, ATE/instrumental, and computer markets, GLX arrays are suited to switching networks,
serial links, high-speed data bus transfers, DSP functions, and critical timing blocks. GLX utilizes a sea-ofgates architecture and can be powered from either a single or dual power supply, depending on I/O
requirements. These gate arrays can accommodate virtually any digital application requiring up to 175,000
gates. The FX series provides solutions in super minicomputers, high-end workstations, telecommunications
systems, and high-performance ATE/instrumentation. The Viper family provides solutions in computer
peripherals, medical instrumentation, and communications.
The SCFX family is targeted at
telecommunications and data communications applications, offering maximum operating frequencies
beyond 3GHz. The Fury series addresses the conventional silicon ECL user.
741 Calle Plano
Camarillo, California 93012
6,500 square feet (Class 100)
Wafer size: 100mm
Process: H-GaAs E/D MESFET
Products: Gate arrays, telecom and datacom devices,
microperipherals, foundry services
1-335
Vivid Semiconductor
VIVID S EMICONDUCTOR
Vivid Semiconductor, Inc.
7402 West Detroit Street
Suite 120
Telephone: (602) 961-3200
Fax: (602) 961-0200
Fabless IC Supplier
Employees
35
Vivid Semiconductor, a limited partnership, was formed in 1993 to design and market integrated circuits to
manufacturers of flat panel displays (FPDs). The general partner in Vivid is FPD Technology Inc., a private
company formed in June of 1993 for the purpose of developing products for the flat panel industry.
Using patented extended voltage-range CMOS technology, Vivid has developed technology that allows
designers to build enhanced performance flat panel displays with 24-bit color and full-motion video.
Although Vivid’s current focus is on supplying the needs of the FPD market, Vivid’s process technology can
be applied to a broad range of markets, from automotive to telecommunications, where extended voltagerange CMOS can make a difference in product capability, power consumption, and reliability.
Management
Kenneth B. Fine
Tim Vatuone
Alex Erhart
Gerry Harder
Steve Shank
Ed Fullman
President, and Chief Executive Officer
Vice President and Chief Technical Officer
Vivid Semiconductor's FPD chips are based on its patented "Dual Range" design architecture, which allows
high-voltage devices to be achieved on standard, low-voltage CMOS processes.
Unlike leading edge microprocessors and memories, Vivid’s silicon requirements can be fabricated in plants
that are three process generations old. Vivid’s wafer processing, packaging, and testing functions are
contracted to well-established manufacturers.
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VLSI Technology
VLSI TECHNOLOGY
VLSI Technology, Inc.
1109 McKay Drive
Telephone: (408) 434-3100
Fax: (408) 263-2511
Web Site: www.vlsi.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
1991
413
10
39
55
1992
429
(32)
50
40
1993
516
16
65
72
1994
587
32
79
94
1995
720
46
90
204
Employees
2,315
2,379
2,659
2,728
2,986
VLSI Technology is a leader in the design, manufacture, and sale of complex high-performance ASICs and
ASSPs. Founded in 1979, the company has been a pioneer in the cell-based ASIC business. VLSI targets
high-growth markets in which it has built expertise and can use its library of proprietary cells and FSB™
functional system blocks to assist customers in designing products and bringing them to market rapidly.
VLSI’s integrated circuit business is organized in a “market-focused” structure. Its three main groups are
Computing Products, Communications Products, and Consumer Digital Entertainment Products. The
Computing Product group offers devices for the computer market, including PC applications and high-end
computing applications such as graphics workstations and high-end storage systems. The Communications
Products groups offers devices for wireless and network communications applications. The Consumer Digital
Entertainment Products group supplies devices for secure communications and home entertainment
applications such as interactive television and video game systems.
VLSI’s core logic chipset business is expected to show a sharp decline in 1996 as a result of Intel’s
strengthened dominance in the core logic business in 1995. Therefore, the Computing Products group is
shifting its focus away from standard core logic chipsets and toward custom products for x86 applications.
The wireless communications segment was the fastest growing part of the company in 1995. In 1Q96, VLSI
created a European subsidiary called Creative Systems Solutions.
Based in Munich, Germany, the
company will focus on the wireless data communications marketplace.
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VLSI Technology
The company's subsidiary, Compass Design Automation, Inc., supplies software and design libraries to the
broad commercial ASIC and electronic design automation (EDA) marketplaces. Nearly half (46 percent) of
VLSI’s total business in 1995 was derived from the personal computer industry (33 percent from x86
products).
Europe
23%
Japan/
Asia-Pacific
28%
United States
49%
Management
Alfred J. Stein
Bernd U. Braune
Donald L. Ciffone, Jr.
Gregory K. Hinckley
Dieter J. Mezger
John C. Batty
Larry Grant
Balakrishnan S. Iyer
L. Don Maulsby
Cliff Roe
Chief Executive Officer and President, Chairman
Senior Vice President, World Wide Sales and Marketing
Senior Vice President, VLSI Products
Senior Vice President and President, Compass Design Automation, Inc.
Vice President, General Counsel and Secretary
Vice President and Controller
Group Vice President, Computing Products Division
Vice President, Strategic Products
Using advanced design capabilities, a vast cell library of predefined cells, and advanced manufacturing
processes, VLSI Technology offers highly customized, highly integrated standard cell, embedded array
(FlexArray), and gate array ASICs and ASSPs for applications such as computers, wireless communications
equipment, electronic games, and digital set-top boxes.
The VLSI Cell Library provides an extensive and growing variety of predesigned and characterized cells,
macrocells, and large functional system blocks. The company’s specialized system blocks include: UART,
parallel port, SCC, SCSI, PCMCIA, PCI, SSA, Fibre Channel, and graphics functions for computing
applications; T1/E1, SONET/SDH, and ATM functions for network communications applications; GSM/DCS,
DECT, CT2, PHS, CDPD, and Ruby II functions for wireless communications applications; and digital
demodulation, forward error correction (FEC), MPEG 2 video and MPEG audio, microcontroller, and transport
for digital entertainment applications. VLSI’s cell library also includes general-purpose system blocks such as
32-bit ARM RISC processor cores, data encryption devices, and programmable DSP cores.
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VLSI Technology
VLSI manufactures its ASICs and ASSPs in CMOS technology with geometries ranging from 0.35µm to
1.0µm and with up to five layers of interconnect metal. At the end of 1995, approximately 30 percent of the
company’s monthly wafer production was built using a 0.6µm process. Much of the remainder was 0.8µm
technology. VLSI’s newest 0.35µm process technology supports 1280 pins and five million gates for cellbased designs, with supply voltages ranging from 2.2V to 3.6V.
Through its subsidiary, Compass Design Automation, VLSI provides IC design software (design tools and
libraries) to a broad range of system and semiconductor customers.
The conversion of VLSI’s San Antonio facility to primarily 0.6µm and smaller feature size production was due
to be completed in the first half of 1996. Because of the age of its San Jose fab, VLSI does not intend to
push the technology at the facility below 0.8µm feature sizes.
1109 McKay Drive
Telephone: (408) 434-3000
Fab 1
Wafer size: 150mm
Process: CMOS
9641 Westover Hills Boulevard
San Antonio, Texas 78251
Telephone: (210) 522-7000
Fab 2
Wafer size: 150mm
Process: CMOS
VLSI Technology's manufacturing capacity is enhanced by manufacturing relationships with Chartered
Semiconductor of Singapore and TSMC of Taiwan. Approximately 20 percent of the company's total wafer
production was performed by these foundries in 1995. Only 10 percent of VLSI’s wafer needs are expected
to be served by foundries in 1996.
VLSI subcontracts all of its IC packaging and 50 percent of its final test needs.
functions are performed at its factories in California and Tempe, Arizona.
Its in-house final test
Key Agreements
• VLSI and Hitachi renewed and expanded their 1988 standard cell and process technology exchange
agreement. The new pact gives Hitachi access to VLSI's gate array technology, and the two companies
will develop compatible gate array families. In mid-1995, the companies announced successful
development of a 0.35µm five-layer metal CMOS process.
• The DSP Group licensed its Pine™ digital signal processing core technology and its TrueSpeech™
speech compression technology to VLSI Technology in 1994. The new technologies were added to
VLSI's FSB library for design in wireless communications applications.
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VLSI Technology
• In late 1994, VLSI licensed Santa Clara, California-based Mediametrics Inc.'s MPEG 1 and 2 video
decompression technology, supporting the company's drive into the set-top box and direct broadcast
satellite markets.
• VLSI announced its intention to jointly develop and market fuzzy logic-based ASIC technology for chip
design and development capabilities with Togai InfraLogic, Inc. of Irvine, California.
• In February 1994, VLSI and ARM, Ltd. renewed their agreement to expand market opportunities for the
ARM 32-bit architecture in embedded control and portable applications.
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VTC
VTC
VTC Inc.
2800 East Old Shakopee Road
Bloomington, Minnesota 55425-1350
Telephone: (612) 853-5100
Fax: (612) 853-3355
IC Manufacturer
Sales
Employees
1991
19
1992
50
1993
75
1994
108
1995
166
220
300
375
480
540
VTC was founded in 1984 to design and manufacture VHSIC products for government markets. Within the
first year, VTC acquired Control Data Corporation's microcircuits division (a captive chip manufacturing
operation for CDC's disk drive business that had operated since 1969). VTC was privately held, but Control
Data was a major investor.
Control Data purchased all of VTC in 1987, making it a wholly-owned subsidiary. In 1988, the two original
founders left CDC and the company was put up for sale. In October 1990, CDC sold the bipolar portion to a
management buyout led by VTC's new CEO, Larry Jodsaas. Before the end of the year, CDC also sold the
CMOS fab to Cypress.
Today, VTC's strategy is to offer quality, high-performance ICs to the mass storage (disk and optical drive)
industry. Most of the company's revenues come from bipolar preamp ICs and much of its products are
consumed by the top five disk drive makers.
Management
Larry Jodsaas
Cliff Boler
John Doyle
Dan Griffith
Greg Peterson
Robert Rousseau
Ed Schnable
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VTC
VTC offers a broad line of read/write preamplifier standard products and channel ASICs for use in rigid disk
drives. Processes used by the company are complementary bipolar (CBP), ECL, and BiCMOS (called
PolarMOS).
VTC Inc.
2800 East Old Shakopee Road
Bloomington, Minnesota 55425-1350
Processes: Bipolar, complementary bipolar, BiCMOS
Products: Standard and ASIC read/write preamplifiers, servo preamplifiers, and channel electronics
1-342
Weitek
W EITEK
Weitek Corporation
2801 Orchard Parkway
Telephone: (408) 526-0300
Fax: (408) 577-1066
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
Employees
1991
39
(5)
15
1992
26
(11)
14
1993
36
(1)
10
1994
28
(11)
10
1995
18
(4)
10
206
140
144
83
60
Founded in 1981, Weitek specializes in processors and controllers that enhance the performance of industry
standard operating systems, user interfaces, and application software. Weitek's graphics and multimedia
products bring workstation-class performance to the personal computer.
Weitek traditionally supplied coprocessors, RISC processors, and graphics processors to supercomputer and
workstation manufacturers, in particular to manufacturers of Sparc2-based workstations. However, in 1991
the company began to focus more of its resources on developing high-performance user interface
processors based upon the company's established RISC processor and workstation graphics technology.
New product development is focused entirely on user interface processors.
RISC Processors
48%
User Interface
Products
52%
Asia
15%
Europe
10%
North America
75%
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Weitek
Management
Richard Bohnet
Howard J. Gopen
Allen R. Samuels
Benjamin M. Warren
Stephen J. Gillis
Kent D. Goodin
Paul K. Kidman
Gopal Solanki
Director, Multimedia and Systems
Director, Finance
Director, IC Design Engineering
Weitek's products remain in two areas, user interface processors and RISC processors:
• User interface products—The company's user interface products are marketed to personal computer
OEMs, as well as to motherboard and add-in card manufacturers. The most recent product introductions
were the Power 9100, a high-performance single-chip integrated graphics processor for high-end PC
applications, and the Video Power™ coprocessor, a multimedia coprocessor designed to work with the
Power 9100 to improve the performance and quality of full-motion video under Microsoft's Video for
Windows.
• RISC processors: Weitek's RISC microprocessors products include Sparc processors for workstations and
printer processors for laser printers.
The company's products are manufactured using 0.8µm, 1.0µm, and 1.2µm CMOS technologies.
Weitek's semiconductor wafers are processed to its specifications principally by Matsushita and Samsung.
Key Agreements
• In 1995, Weitek and Samsung established a technology exchange agreement.
As part of the
agreement, Samsung will provide wafer capacity for Weitek’s proprietary products. In addition, the
companies will work together in developing new products including next-generation multimedia chips for
PCs.
• Weitek licensed Intel's Indeo™ video technology for use with its Video Power digital video accelerator chip
to deliver television-quality video playback to PC platforms.
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WSI
WSI
WSI, Inc.
47280 Kato Road
Telephone: (510) 656-5400
Fax: (510) 657-5916
Web site: www.wsipsd.com
Fabless IC Supplier
Sales
Employees
1991
35
1992
28
1993
27
1994
28
1995
38
165
137
125
125
125
WSI, Inc. (formerly WaferScale Integration, Inc.) was founded in 1983 as a supplier of high-performance
programmable ICs. It serves system designers who need to achieve higher system performance, reduce
system size and power consumption, and shorten product development cycles to achieve faster market
entry. It offers field-programmable microcontroller peripherals as well as high-performance non-volatile
EPROM products.
Management
Michael Callahan
Robert Hoard
Boaz Eitan
John Ekiss
Carl Mills
Vice President, New Products and Technology Development
WSI supplies several families of programmable microcontroller peripherals as well as a broad line of high
performance non-volatile PROM and EPROM devices. These products are based on the company's
patented self-aligned split-gate CMOS EPROM technology. WSI's fast EPROMs are available in densities
ranging from 16K to 1M. The programmable peripherals integrate EPROM, SRAM, PLD, and userconfigurable logic.
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WSI
WSI does not have its own fabrication facility.
Semiconductor, AMD, and AMI.
It has foundry agreements with Sharp Corp., National
Key Agreements
• National took a 10 percent stake in WSI as part of a five-year foundry and technology exchange
agreement.
• WSI signed an agreement with Advanced Micro Devices that allows AMD to make and market products
that are manufactured with WSI's Alternate Metal Virtual Ground non-volatile memory technology. In
exchange, WSI is using AMD's technology and submicron fab to make its Programmable System
Devices.
• WSI formed an alliance with American Microsystems to jointly develop mask-programmable versions of
WSI's line of microcontroller peripherals. AMI is manufacturing the parts and the companies are
marketing them separately.
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Xicor
XICOR
Xicor, Inc.
1511 Buckeye Drive
Telephone: (408) 432-8888
Fax: (408) 432-0640
Web Site: www.xicor.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
1991
94
(16)
24
9
1992
93
(30)
22
6
1993
104
(6)
13
2
1994
104
2
14
5
1995
114
10
15
9
Employees
1,000
840
800
691
641
Xicor, Inc., founded in 1978, designs and manufactures a broad line of non-volatile in-the-system
programmable semiconductor ICs. In-the-system programmability enables telecommunications, consumer,
computer, industrial, automotive, and military products to adapt to changing software and operating
environments, and to be personalized by the user. Many of Xicor’s products consume little power and
operate well from a battery powered source, making them well suited for hand-held and portable
applications.
Japan
15%
ROW
13%
Europe
20%
United States
52%
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Xicor
Xicor emphasizes the development of proprietary products which incorporate its programmable technology,
enabling customers to rapidly bring to market products with improved features, efficiency and maintainability.
In 1995, Xicor introduced its first SerialFlash™ memory product family, operating from low voltage power
sources. Xicor is a leading supplier of EEPROM memory products and EEPOT™ digitally controlled
potentiometers.
Management
Raphael Klein
David J. Coakley
Joseph Drori
Geraldine N. Hench
Klaus G. Hendig
Timothy D. Kanemoto
Madga M. Madriz
Bruce W. Mattern
William H. Owen III
President
Vice President, Products Design, Engineering, Quality, and Reliability
Vice President and Corporate Controller
Vice President, Product Operations
Vice President, Technology Development and Intellectual Properties
Xicor offers serial EEPROMs in 128bit to 128K densities, parallel EEPROMs in 16K to 1M densities, serial
flash in 8K to 128K densities, NOVRAMs (nonvolatile SRAMs), NOVRAMs with Autostore™ power-loss data
protection, EEPOT™ digitally controlled potentiometers, EEPROMs that interface directly with
microcontrollers or microprocessor bus-based systems, and memory subsystems.
As part of its move into application-specific products, Xicor introduced a chipset that performs keyboard and
display control as well as power management in laptop computers in 1994. Called LapKit™, the chipset
includes two Xicor EE-based devices and one microcontroller based on Intel's 80C51 architecture. The
LapKit firmware may be altered at any time during system operation.
Xicor licensed the Pine 16-bit fixed-point DSP core and related development tools from DSP Group, in late
1993. The firm is developing products that integrate the Pine DSP core with its EEPROM technology.
Xicor, Inc.
1511 Buckeye Drive
Wafer size: 150mm
Products: EEPROM-based ICs and chipsets
For 1996, Xicor plans to purchase additional equipment to increase the capacity of its manufacturing facility.
1-348
Xilinx
XILINX
Xilinx, Inc.
2100 Logic Drive
Telephone: (408) 559-7778
Fax: (408) 559-7114
Web Site: www.xilinx.com
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1992
136
21
18
1993
178
27
24
1994
256
41
34
1995
355
59
45
1996
561
102
n/a
482
544
689
868
1050
Employees
Xilinx is the leading supplier of CMOS programmable logic devices (PLDs) and related system software.
Founded in 1984, Xilinx is credited with the invention of the field programmable gate array (FPGA). Xilinx
continues to hold the largest share of the CMOS programmable logic and FPGA markets.
In February 1992, Xilinx acquired Plus Logic, Inc., a company involved in electrically programmable logic
devices (EPLDs). In addition, the company also markets HardWire™ devices (non-programmable ICs
functionally equivalent to the programmable FPGA). The firm ships its PLD and related development system
software to electronic equipment manufacturers in the computer peripherals, telecommunications, industrial
control and instrumentation, and military markets.
System Software
4%
Military
4%
Other
14%
Industrial
14%
FPGAs and EPLDs
96%
Computer
Peripherals
36%
Communications
32%
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Xilinx
Asia-Pacific
12%
Europe
19%
North
America
69%
In April 1995, Xilinx acquired NeoCAD, Inc. NeoCad is a private PLD design software producer, founded in
1990 and is headquartered in Boulder, Colorado. Xilinx integrated NeoCAD’s operations with its own.
Management
Willem P. Roelandts
R. Scott Brown
William S. Carter
Lee D. Farrell
Charles Fox
Steve Hayes
Robert C. Hinckley
Nicholas Kucharewski
C. Frank Myers
Gordon M. Steel
Vice President, Product Marketing
Vice President, Strategic Plans and Programs and Secretary
Vice President, EPLD Division
Xilinx has seven CMOS FPGA families in production, with gate counts ranging from 800 to 52,000. Gate
counts for the next-generation of devices is expected to reach 125,000. In 3Q95, Xilinx introduced its
XC8100 family of FPGAs. These devices are based on Xilinx’s 0.6µm MicroVia™ amorphous silicon antifuse
technology and proprietary sea-of-gates architecture. The family offers from 1K to 9K usable gates.
In 4Q95, Xilinx announced its XC9500 family of complex PLDs (CPLDs). The devices are produced using
5V-only 0.6µm flash memory technology. This family offers in-system programmability (ISP) characteristics
with more than 10,000 program/erase cycles. The initial family includes densities ranging from 800 to
12,800 gates.
In 2Q96, Xilinx expanded its flagship SRAM-based XC4000E FPGA series to offer densities of up to 52,000
usable gates using the new XC4000EX family. Devices with up to 125,000 usable gates are expected to
sample in 1997. The new XC4000EX devices are produced using 0.5µm process technology with 0.35µm
processing expected to be used for the 1997 devices.
The company also provides CAE software that offers complete FPGA and EPLD solutions, from design entry
through partitioning, placement, and routing.
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Xilinx
Xilinx does not fabricate its own ICs; but has foundry agreements with Seiko Epson, Yamaha, and IC Works.
In early 1994, Xilinx provided its foundry partner Seiko Epson with $42 million to help fund a wafer fab Seiko
Epson built in Sakata, Japan.
Key Agreements
• Xilinx has a second-source agreement with Harris Semiconductor for rad-hard FPGAs.
1-351
Zilog
ZILOG
Zilog, Inc.
210 East Hacienda Avenue
Campbell, California 95008-6600
Telephone: (408) 370-8000
Fax: (408) 370-8056
Web Site: www.zilog.com
IC Manufacturer
Sales
Net Income
R&D Expenditures
Employees
1991
110
11
12
1992
146
16
16
27
1993
203
27
21
40
1994
223
35
23
69
1995
265
43
25
79
1,330
1,400
1,500
1,500
1,575
Zilog was founded in 1974 and became a wholly owned subsidiary of Exxon by 1980. In 1985, the
company rechartered its course to focus on application specific market segments.
In 1989, Zilog's
management, employees, and a venture capitalist purchased the company from Exxon. Zilog became a
public company in February 1991.
Today, Zilog is a leader in the development, design, and manufacture of application specific standard
products (ASSPs) for the consumer electronics, data communications, and computer peripheral markets.
The company utilizes its Superintegration™ design methodology to combine cores and cells from its
extensive library of microprocessors and controllers, DSPs, and memory and logic circuits.
Europe
10%
ROW
7%
Far East
40%
United States
43%
1-352
Zilog
Management
Edgar A. Sack
Michael J. Bradshaw
Thomas C. Carson
William R. Walker
Sally M. Baumwell
James J. Magill
Richard L. Moore
Richard R. Pickard
Alan Secor
Senior Vice President, Worldwide Operations
Vice President and General Manager, Data Communications
Vice President, General Counsel
Vice President, Consumer/Peripherals
Zilog's core library includes 8-bit microcontrollers, 8-bit, 16-bit, and 32-bit microprocessors, 16-bit digital signal
processors, serial communications controllers, and peripheral circuits. These cores are available as standalone devices or may be combined in Superintegration products. The company’s cell library consists of logic
and memory circuits that are generally combined in Superintegration products.
The Superintegration library and diverse product portfolio of over 800 items serve three distinct markets:
data communications, consumer products, and intelligent peripherals.
• For data communications applications, Zilog offers ASSPs based on its Z80 microprocessor family
and serial communications controllers. These ASSPs are optimized for Ethernet routers, bridges, data
switches, modems, terminals, printers, workstations, local area networks, and wide area networks.
The company holds a leadership position in general purpose, multiprotocol controllers for the LAN and
WAN markets.
• Based on the Z8® 8-bit microcontroller, Zilog offers a family of controllers for use in consumer
electronics products such as cellular phones, audiovisual equipment, automobiles, telephone
answering machines, household appliances, battery chargers, garage door openers, security systems,
set-top boxes, interactive TVs, and infrared remote controls.
• Zilog is an innovator in the addition of intelligence to computer peripheral chips using its line of Z80®
8-bit, Z180® 16-bit, and Z380® 32-bit microprocessors, and peripheral circuits. Adding intelligence to
computer peripherals frees the central processor from micro-management tasks and upgrades the
performance of the system. Common peripherals are printers, keyboards, monitors, pointing devices,
hard disk and floppy disk controllers, modems, and PCMCIA bus interface products.
During 1994, Zilog underwent the transition from 1.2µm to 0.8µm CMOS manufacturing technology. Then,
in 1995, the company began using 0.6µm CMOS process technology.
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Zilog
Zilog, Inc.
2601 11th Avenue, North Extension
Nampa, Idaho 83651
Telephone: (208) 466-4551
Fax: (208) 467-9765
Modules I and II
Wafer size: 125mm
Processes: NMOS, CMOS, BiCMOS
Products: ASSPs, MCUs, MPUs, DSPs
Zilog, Inc.
1401 North King Road
Nampa, Idaho 83651
Module III
Cleanroom size: 30,000 square-feet (Class 1)
Wafer size: 200mm
Process: CMOS
Products: ASSPs, MCUs, MPUs, DSPs
Feature sizes: 0.6µm, 0.8µm (0.35µm in 1996)
Assembly and test operations are performed in company-owned facilities in Manila and Carmona, the
Philippines. Contracts with outside IC fabricators Kawasaki Steel in Japan and Thesys Microelectronics in
Germany, and with assembly houses in Malaysia, Indonesia, and China are back-up sources to the
company's own operations.
Key Agreements
• Zilog purchased a license in 1995 for the design and manufacture of ASSPs using Aspec Technology's
high-density array and embedded array technologies.
• Zilog joined with Allegro MicroSystems and IMP in a marketing alliance. The team is marketing what they
call a ZIA disk drive chipset—ZIA standing for Zilog, IMP, and Allegro.
• Oak Technology and Zilog extended a joint-development and cross-license agreement to develop
integrated circuits for mass storage applications.
• Zilog has an agreement (formed in 1993) with Kawasaki Steel under which Zilog is licensed to
manufacture, use, and sell the Kawasaki KC80™, an enhanced high-performance version of the Z80™ 8bit microprocessor. Additionally, the companies are developing new Superintegration products that use
the KC80 core.
• Zilog and Catalyst entered into a cross-licensing agreement in 1993 under which Zilog gained access to
Catalyst's flash technology and Catalyst gained the right to develop products using Zilog's Z8 one-timeprogrammable (OTP) microcontroller family. The two companies then expanded their alliance to jointly
develop flash memories.
1-354
Zoran
ZORAN
Zoran Corporation
1705 Wyatt Drive
Telephone: (408) 986-1314
Fax: (408) 986-1240
Fabless IC Supplier
Sales
Net Income
R&D Expenditures
1992
1
(3)
5
1993
2
(8)
5
Employees
1994
6
(5)
4
1995
18
1
4
75
Zoran Corporation, first incorporated in 1981, and reincorporated in 1986, develops and markets integrated
circuits for digital video and audio compression applications. The company’s VLSI products are produced for
high-performance, cost-sensitive digital image enhancement, image compression, and audio processing
applications, such as multimedia computing, digital cameras, scanners, digital television, and digital audio
systems.
Zoran has a strong core expertise in DSP technology, including digital filtering and frequency domain
processing. Its strategy centers on building partnerships with innovative marketing and manufacturing
companies and targeting high-volume, high-performance applications, such as multimedia computing and
consumer video and audio systems. In 1995, 69 percent of revenues were to foreign customers.
In 1995, Zoran entered into the worldwide television market as it teamed up with The Goldtron Group of
Singapore to spin off a new company, Oren Semiconductor. The venture, based in Israel, will jointly develop
and market ICs combining DSP and filtering technology to correct flawed TV images. The devices will be
manufactured by Taiwan Semiconductor Manufacturing Co. (TSMC) and Tower Semiconductor using 0.6µm
CMOS technology.
1-355
Zoran
Pacific Rim
21%
Europe
48%
United States
31%
Management
Levy Gerzberg, Ph.D.
Ami Kraft
Isaac Shenberg
Alexander Sinar
Meir Tsadik
Director, Manufacturing
Vice President, Research and Development, and
Zoran has three product families: Image Compression Processors, Image Enhancement Processors, and
Vector Signal Processors.
Zoran has established foundry agreements with TSMC, Motorola, and Tower Semiconductor.
Key Agreements
• In 1995, Zoran signed a four-year agreement with Tower Semiconductor under which Tower will supply
specified quantities of wafers to Zoran.
• Siemens and Zoran announced in 1995 they would collaborate on the development and marketing of
multimedia ICs for PC and consumer electronics applications.
• Dolby Laboratories formed a long-term joint technology partnership with Zoran in August 1992. The
partnership calls for the development of low-cost ICs for multi-channel digital audio for motion-picture
soundtracks and eventually consumer media.
1-356

North American Company Profiles - Smithsonian

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