Plasma-Surface-Technology www.plasma.de Macchine

Transcription

24/09/2012
Plasma-Surface-Technology
DECORAZIONI PER LA MODA E L’OCCHIALE: ECCO LE NUOVE FRONTIERE DELLA RICERCA
Programma Interreg IV Italia-Austria 2007-2013
CERTOTTICA
Longarone, (BL) Italy
14/09/2012
Macchine industriali per il trattamento superficiale al plasma:
pulizia, attivazione, ablazione, coating
www.plasma.de
Ing. Musella Danilo
Diener electronic s.r.l.
Longarone, 14.09.2012
• Diener electronic: l’azienda
• Processi al plasma standard
• Esempi di campioni trattati & analisi dei costi operativi
o Attivazione
o Coating
• Configurazione della macchina
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Lomazzo, 01.03.2012
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Diener electronic GmbH & Co. KG
We did move our company to our
www.plasma.de
new premises in January 2010
5,500 m² total space
Plasma-Surface-Technolo
Company name
Founded
1993 (as Diener electronic)
Employees
approx.100
Location
Ebhausen, Germany
Product range
- Low pressure and atmospheric
plasma systems
- process development
- contract plasma treatment
Installed systems
worldwide
> 3.000
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is a leading international producer
of
•
low pressure plasma systems
•
plasma generators and
•
atmospheric plasma systems
Femto
13.56 MHz-Generator
PlasmaBeam
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Tetra 30
Reattori al plasma: - Vendita, Vendita a rate, Noleggio
Servizi: - Sviluppo di processo
- Consulenza
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- Trattamento conto terzi
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Low pressure- and atmospheric plasma
Low pressure plasma
practically every kind of material can
be precision cleaned with plasma
plastics, semiconductors, glass,
ceramics, hybrid materials
Low pressure- and atmospheric plasma
Low pressure plasma
practically every material can be
activated with plasma
all technical materials, metals,
glass, ceramics
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The surface of the component is physically
cleaned by ion bombardment and – depending
on the type of gas – also cleaned by chemical
reactions. The contamination is converted to the
gas phase and pumped away or removed by
active gas jet. The plasma cleaning is generally
used for ablation of fine layers of organic
contaminants, e.g. plasma can remove the
grease by cleaning of finger prints, but not the
salt.
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Applications
e.g. removal of grease, oil, oxides,
fibres
Components
e.g. electronic devices
Users
e.g. automotive
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The surfaces of the parts are activated with
oxygen or air, for example. Radical sites and
finally, oxidized and polar chemical groups are
created to which the paint or glue systems
adhere very well. The lifetime of plasma
activation depends on the material to be treated,
storage conditions and parameters of plasma
treatment procedure.
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Applications
e.g. pretreatment before gluing
Components
e.g. sensors
Users
e.g. electronics industry
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Materials
Surface Energy
(dynes/cm)
before
after
Water Contact Angle
(degrees)
before
after
Hydrocarbons
Polypropylene
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>73
87
22
Polyethylene
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>73
87
42
Polystyrene
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>73
72.5
15
ABS
35
>73
82
26
Polyamide/
polyethylene
copolymer
<36
>73
63
17
Epoxy
<36
>73
59
12.5
Polyester
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>73
71
18
Rigid PVC
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>73
90
35
Phenolic
None
>73
59
36.5
Fluorocarbons
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Polytetrafluoroethylene
/
polyethylene
copolymer
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>73
92
53
Fluorinated
ethylene
propylene
22
72
96
68
Polyvinylidene
25
>73
78.5
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ESMPIIO 1: Attivazione al plasma con TETRA 30 PC LF
CARICO DI CAMPIONI IN PLASTICA
- Durata processo 20 min. + 5 min. carico e scarico
Opzione 1
- Carico con camera standard profondità 370 mm (5.1) -> 25 pz. per piano = Tot 75 pz. Cari.
150 pz. / h
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COSTO OPERATIVO PER USO SISTEMA AL PLASMA TETRA 100 PC LF
Descrizione
Calcolo
Ammortamento
• Ammortamento approssimativo annuo in 5 anni
circa di EUR 10.000
Costo per processo
Costo consumo Gas
• Gas processo ossigeno
EUR 0.01
PER
Vs. CAMPIONI: 39336,39337,43840, 83841
•CARICO
Consumo ca.
0.1 l /min.
• Consumo di gas per processo = 2 l / processo
• Costo per 10.000 l di ossigeno ca. 40 EUR
• Per processo Euro 40 /10000 l x 2 l = 0,008 cent/proc.
ESMPIIO 1: Attivazione al plasma con TETRA 30 PC LF
EUR 1.81
Carico con camera standard profondità 370 mm (5.1) -> 25 pz. per piano = Tot 75 pz. Carica
Costo consumo
energetico
Carico con
• Consumo medio per processo
• P = ca. 2.5 kWh
• Totale processo: 20 min.
• Energia:
W = Pprofondità
x t =2.5 kW x 1/3h
0.83 kWh
camera
standard
626= mm
(5.2) -> 45 pz.
• Prezzo elettricità: EUR 0.20 /kWh
• Costo consumo energetico: 0.83 kWh x EUR 0.11 = EUR 0.09
20 min.
EUR 0,09
per piano = Tot 135 pz. Carica
Raffreddamento
• Nessun consumo Lunghezza processo
Aria compressa
• Nessun consumo
EUR 0,00
Manutenzione
• Costo annuo manutenzione EUR 2000
EUR 0,36
TOTALE
• Costo totale per processo
EUR 2,27
EUR 0,00
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The surface of the part is etched with a reactive
process gas. In any case, the etched material is
removed into to the gas phase and pumped
away. The surface is enlarged and is very easily
wettable. Etching is used before printing, glueing
and painting, as well as for „roughening up“ the
material.
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Application
e.g. etching PTFE
Components
e.g. sensors
Users
e.g. automotive
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Changing microstructure on the surface area by plasma etching: on polycarbonate
substrate.
The picture on the right shows a fine, globular arrangement, which is created by
interchange reaction of plastic surface area and plasma.
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In plasma etching of PTFE-compounds the area
should not be etched too strongly, as this will
expose the filler and hence adhesion is reduced.
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Plasma deposition
An organic, inorganic or metal organic precursor
substance is introduced to the plasma chamber
as a gas or vapour. The gas decomposed by the
plasma and the fragments are reacting on the
surface to a very stable layer with good adhesion
to the parts.
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Components
e.g. deposition of hydrophobic layers
Components
e.g. special membranes
Users
e.g. medical technology
• textile manufacturers
• watch and clock makers
• etc.
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In low pressure plasma a gas under vacuum
is excited by some supply of energy. Energyrich ions and electrons are created along
with other reactive particles that form the
plasma. By impact of these species, surfaces
can be modified very efficiently.
There are three basic plasma effects in
the low pressure plasma
• „micro sandblasting“
• chemical reaction
• UV radiation
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Laboratory System Type Femto
Industry System Type Tetra 150
Special System Type Tetra-400-LF-PC
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2l
5l
10 l
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24 l
• Model:
Tetra -LF-PC
• Chambervolume: approx. from 34 to 150 l
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• Model:
Tetra 30 LF-PC
• Chambervolume: approx. 30 l
• HF Power:
1000 W
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• Model:
Tetra 575 LF-PC
• HF Power:
3000 W
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• Model:
Tetra 2800 LF-PC
• HF Power:
5000 W
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• Model:
Tetra 4400 LF-PC
• HF Power:
6000 W
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• Model:
Tetra 8000 LF-PC
• HF Power:
6000 W
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Gas is excited by means of a high voltage in
such a way that arc discharge ignites. Exited
state reactive gas particles will be blown out
with compressed air from the plasma nozzle.
In an atmospheric plasma there are two
different plasma effects
• chemical reaction
• blowing effect by active gas jet
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PlasmaBeam PC
PlasmaBeam
PlasmaBeam Duo, double
nozzle arrangement
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4 different
controls available
• Semi automatic
• Fully automatic
• PCCE Control
• PC Control
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The effect of vacuum plasma pretreatment
with respect to adhesion on various plastics: PE, PP,
ABS and PBT with 30% glass fibres.
• Samples: flat plates of several mm thickness with smooth surfaces
• Two types of high strength epoxy adhesives :
I.
Eccobond® 2332 (a single component adhesive mainly fit for metals)
II. Eccobond® 45W1 (a two-component adhesive, fit for plastics).
• Test:
I. Two samples of the same polymer were glued together and tested
under share load on a tensile testing machine
II. The tensile lap shear strength (TLSS) in MPa was measured both for
reference samples and for plasma treated samples.
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Conclusions
• For PP and PE, the improvement of adhesion after plasma treatment is
spectacular.
• In case of PP more than a 10 fold increase is reached and in case of PE the
bond strength is higher than the strength of the plastic itself.
• in case of ABS and PBT(with 30% GF), the bond strength of plasma pretreated samples is three times the value of non plasma treated samples.
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Describe your application We‘ll be happy to work out
solutions.
Grazie per la cortese
Attenzione !
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Plasma-Surface-Technology www.plasma.de Macchine

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