SP3965-15M UV Laser Micromachining

UV Laser Micromachining
SP3965-15M
FPCB DRILLING & CUTTING
Semiconductor & Display Equipment Manufacturer
Inatech co., ltd.
UV Laser Micromachining
SP3965-15M
UV Laser Micromachining
Drilling and Cutting
Dual Head (MD)
Sheet to Sheet (S2S)
Roll to Roll (R2R)
SP3965-15M
MAIN SYSTEM
System Features
User-centric and easy to use multilingual control panel. (Support Korean, Chinese, English, Japanese)
Advanced 2D On the fly
Position Based Output
Automatic thickness measurement and processing position compensation.
Independent control of Laser frequency and Laser output power
Maximize productivity with all-in-one material feed system
(Custom Option : Dual head, Sheet to Sheet, Roll to Roll)
Coreless linear motor applied on the Granite
Minimize the foreign bodies with high-pressure dust collector and air blow
By using Laser sources independently, Dual processing(Copy) and operating two of Manual type are available
Stable manufacturing with real time measurement and calibration of laser power while processing.
Classification
Laser Type
Avg.Out Power
Laser Frequency
Scan Scope & Method
Specification
SP3965-15M
UV ns LASER / 355㎚
12W@50 ㎑ at work position (Laser source: 15W)
50 ~500 ㎑
Advanced 2D on the Fly
X-Y Stage
Split Stage, Coreless Linear Motor
Panel Size
250㎜ × ‹ 600㎜ × 2 panels or 500㎜ × ‹ 600㎜ × 1 panel
Cutting Accuracy
±10 ㎛ @avg
PTH Drilling Dia
min 25 ㎛
BVH Drilling Dia
min 35 ㎛
Loader / Un-loader
Electric Power
Option
220V, 3-phase, 50/60㎐
Drilling Sample Image
Hole Size
PTH
25㎛ (X20)
50㎛ (X20)
75㎛ (X20)
100㎛ (X20)
200㎛ (X20)
Double Side FPCB
Top Image
Top Image
Top Image
Top Image
Top Image
After laser processing
Bottom Image
Bottom Image
Bottom Image
Bottom Image
Bottom Image
Copper plating
※1 Step process using the spiral method
Hole Size
BVH
※Before cleaning
35㎛ (X20)
50㎛ (X20)
75㎛ (X20)
100㎛ (X20)
200㎛ (X20)
Multi Layer FPCB
Top Image
Top Image
Top Image
Top Image
Top Image
After laser processing
Bottom Image
Bottom Image
Bottom Image
Bottom Image
Bottom Image
Copper plating
※2 Step process using the spiral method
※Before cleaning
Cutting Sample Image
RFPCB Full-cut
FPCB Full-cut
Coverlay
Prepreg
Bond Sheet
Superiority of Laser Machines in comparison with Mechanical Press Punching
Mold production and punching cost saving.
Management and storage place for mold are unnecessary.
Quality of advanced product is improved due to machining
accuracy improvement.
Extra setup to make up for faulty products is unnecessary.
Capable of producing small amount of panel in a brief time.
Capable of producing within ±20 ㎛ cutting allowance.
Extra management for burr on the mold like stabs or stretchiness
is unnecessary.
Correction of registration between actual product and CAD data
is excellent due to the capable of Auto correction function for
flexibility.
CCL
Black Coverlay
White Coverlay
Kapton
EMI Shield
Advantage of Laser Machines
1. COST – Cost Reduction
Outsourcing cost reduction form disuse the molds. (Prototype only)
Mechanical press punching cost and guide punching cost reduction.
2. TIME – Productivity Improvement
Capable of doing 1, 2, 3 steps of body press punching process at a time.
In case of short period for sample delivery, it is possible to produce a
sample without regard to LOT unit.
3. QUALITY – Quality Improvement
Quality of complicated shape product is improved due to machining
accuracy improvement.
It is able to produce uneven R/F product without extra second or third mold.
Produce the best quality products
in a clean environment
Semiconductor & Display Equipment Manufacturer
Inatech co., ltd.
Head Office/Factory : (Gojan-dong)127B-9LT Namdong Ind. Complex 37,
Namdongseo-ro, Namdong-gu, Incheon, Korea
Phone:+82-32-819-8651 Fax:+82-32-819-8658
Seoul Office : (Woolim Lions Valley, Gasan-dong) #C-906, 168,
Gasan digital 1-ro, Geumcheon-gu, Seoul, Korea
Phone:+82-2-2026-0655 Fax:+82-2-2026-0656
Cheonan Factory : 353, Taehaksan-ro, Pungse-myeon, Dongnam-gu,
Cheonan-si, Chungcheongnam-do, Korea
http://inatech.co.kr
[email protected]
2015O-1000 Printed in Korea