ESPANEX@ M series

Go.,
Ltd.
I themical
Adhesive-less
CopperClad Laminate
ESPANEX@M series
Standard Type / Low Modulus Type
copperclad laminatethat is suitablefor the
series is adhesive-less
ESPANEX"M
flexuraluse,whichappliesNSCCoriginalpolyimide.
CCLwhich
and castingmethod,we realizethin polyimide
By the originalpolyimide
flexibility.
is superiorin consecutive
the low modulustype newly.This supportsa field
We havestartedmanutacturing
M
thanthe conventional
suchas bendpartsof narrowhousingneedinglow repulsion
series.
o Widecopperfoil selectivity
o Widepolyimidethicknessselectivity
process
o Excellentdimensional
stabilityin circuitmanufacturing
o Excellentfoldingenduranceand flexibility
t tJPä't;
o E x c e l l e n th
t e rma lsta b i l i ty
. S u p p o r tl ea d -fre eso l d e r
o E x c e l l e n ch
t e mi ca lre si sta n ce
o E x c e l l e n tel e ctri ca p
l ro p e rti e s
I
Applications
o Connecting
FPCfor LCD
Cell phone,Car navigationsystem
. Connecting
FPCfor Dynamicapplications Cell phone(slide,hinge),RAIVcable,Opticalpickup
. Connecting
FPCfor Staticapplications
Key board,Touchpanel,Cameramodule
. FPCfor HighFrequency
Devises
OpticalLink PWB, High FrequencyAntennaPWB
o FPCforAutomotive
applications
Car navigationsystem,ECU
T Lineup
o Cu FoilType
E D ,R A
r Cu FoilThickness9gm-359m
o Pl Type
/ Lowmodulus)
M series(Standard
o PlThickness
12!m-50!m
. CCLStructure
CCL
CCL,Double-sided
Single-sided
Stiffness Property
I
Measurementcondition :
BendingProperty
I
IPCFlexuralEnduranceR=1.25mm
Loop Length=60mm
GaP=15n,''SampleWidth=12.7mm
1ot
f#,"",
o
o
4
o
8.0
7.O
+
+
Standardtvpe
Low Modulus type
i
rn5
::i:-.-_
!
c
\ (n
z "'"
g q o
3 eo
ts ""
_---------;;;
-
:::::::::::::::::::::::::::::
::::::::::::::::::::::::::::::
-
c
l
z
'E
an
a,v
6
1oo
1.0
0.0
20
30
40
(g m)
Polyimide
Thickness
I
P I 1 2p m
C u 1 2p m
P I 2 0p m
C u 1 2p m
ED
ED
Pl 25pm
Cu 18gm
RA
Properties
Items
MB12-12-12REGMB12-2G12REGMBl&2S18FRG M812€0'12REO
PolyimideType
Standard
Standard
Standard
Low Modulus
PolyimideThickness
12
20
25
50
CopperFoil Type
ED
ED
RA
ED
CopperFoil Thickness
12
12
18
12
Test ltem
unit
Test rnethod
0.03
0.30
o.70
5.20
Gap: 15mm,
Loop Length: 60mm
MoistureAbsorption(Pl) wt%
0.8
0.8
0.8
1.3
23"C,50%RH,24hrs
Peel Strength
1.1
1.2
1.3
1.2
J I SC . 5 O 1 6 8
MD
o/
/o
0.01
o.o2
0.04
0.06
TD
o/
/o
-0.03
-0.01
o.o2
0.01
Film LoooStiffness
Dimensional
Stability
after Etching
MIT
N/m
kN/m
Cast side
cycre
533
341
184
61
Laminateside
cycle
535
342
144
oö
MO
10'
10'
10'
10'
380
380
380
380
VTM-O
VTM-O
VTM-O
v-0
InsulationResistance
SolderResistance
Flammability
IPC-TM-6502.2.4 (B)
Jrsc6471
(r=0.38mm,withoutC/L)
IPC-TM-6502.6.3.2
UL94
The informationand data on this leaflet have been measuredby reliable test method. But confirm the property of the products according to your actual
process condition or test method before use. we are not able to Suaranteelhat the method or usage on this leaflet won't
conflict with all the patent. The
contents of this leafletcan be changedaccordingto our reasons.
- Mav 201 O -
l{ipponSteelChemical
Co.,Ltd. Functionat
Materials
Bureau
PWB& Package
Materials
Division 14 - 1 , S o t o k a n d4a- C h o m eC, h i y o d a - k u
T ,o k y o10 1- 0 0 2 j , J a p a n
ESPANEXSalesDepartment T E L : B1 - 3 - 5 2 0 7- 76 1 7 . , F A X : 81 - 3 - 5 2 0 7- 7 6 S s
Functional
Materials
Laboratories1 TsukijiKisarazuChiba292-0835,Japan
1 3 F A X : 8 1- 4 3 8 - 3 0 - 7 1 2 9
PWB& Package
Materials
Center T E L : 8 1- 4 3 8 - 3 0 - 7 0