MC3362 Low-Power Narrowband FM Receiver - PL-1

Transcription

MC3362 Low-Power Narrowband FM Receiver - PL-1
MC3362
Low-Power Narrowband
FM Receiver
. . . includes dual FM conversion with oscillators, mixers, quadrature
discriminator, and meter drive/carrier detect circuitry. The MC3362 also has
buffered first and second local oscillator outputs and a comparator circuit for
FSK detection.
• Complete Dual Conversion Circuitry
•
•
•
•
•
•
•
LOW–POWER
DUAL CONVERSION
FM RECEIVER
Low Voltage: VCC = 2.0 to 6.0 Vdc
SEMICONDUCTOR
TECHNICAL DATA
Low Drain Current (3.6 mA (Typical) @ VCC = 3.0 Vdc)
Excellent Sensitivity: Input Voltage 0.6 µVrms (Typical)
for 12 dB SINAD
Externally Adjustable Carrier Detect Function
Low Number of External Parts Required
P SUFFIX
PLASTIC PACKAGE
CASE 724
Manufactured Using Motorolais MOSAICr Process Technology
MC13135 is Preferred for New Designs
DW SUFFIX
PLASTIC PACKAGE
CASE 751E
(SO-24L)
Figure 2. Pin Connections and
Representative Block Diagram
Figure 1. Simplified Application in a PLL Frequency
Synthesized Receiver
1st Mixer Input 1
RF Input
to 200 MHz
2nd LO Output 2
Figure 2.
Input
Match
0.01
VCC
120 pF
50 pF
10.245 MHz
Ceramic Filter
455 kHz
10 k
0.1
200 k
To Carrier
Detect
Indicator
Lp = 680 µH
Cp = 180 pF
24
2
23
3
22
4
21
5
20
MC3362
0.1
0.1
1
39 K
6
19
7
18
8
17
9
16
10
15
11
14
12
13
From PLL Phase
Detector
22 1st LO Tank
2nd LO Base 4
21 1st LO Tank
2nd Mixer Output 5
X
20 1st LO Output
VCC 6
0.01
0.41 µH
Limiter Input 7
To PLL or Prescaler
Limiter
8
Decoupling
Limiter
9
Decoupling
Ceramic Filter
10.7 MHz
1.0 +
10 k
19 1st Mixer Output
18 2nd Mixer Input
17 2nd Mixer Input
16 VEE
15 Comparator Output
Meter Drive 10
14 Comparator Input
Carrier Detect 11
Quadrature Coil 12
X
13 Detector Output
0.1
Data
VCC
ORDERING INFORMATION
0.001
8.2 k
23 Varicap Control
2nd LO Emitter 3
Recovered
0.01 Audio
Device
MC3362DW
MC3362P
8–82
24 1st Mixer Input
X
Operating
Temperature Range
TA = – 40 to +85°C
Package
SO–24L
Plastic DIP
MOTOROLA ANALOG IC DEVICE DATA
MC3362
MAXIMUM RATING (TA = 25°C, unless otherwise noted)
Pin
Symbol
Value
Unit
Power Supply Voltage (See Figure 2)
6
Vdc
6
VCC(max)
VCC
7.0
Operating Supply Voltage Range (Recommended)
2.0 to 6.0
Vdc
1.0
Vrms
Rating
Input Voltage (VCC
q 5.0 Vdc)
1, 24
Junction Temperature
–
Operating Ambient Temperature Range
–
Storage Temperature Range
–
V1–24
TJ
TA
Tstg
150
°C
– 40 to + 85
°C
– 65 to + 150
°C
ELECTRICAL CHARACTERISTICS (VCC = 5.0 Vdc, fo = 49.7 MHz, Deviation = 3.0 kHz, TA = 25°C, Test Circuit of Figure 3,
unless otherwise noted)
Pin
Min
Typ
Max
Units
6
–
4.5
7.0
mA
Input for – 3.0 dB Limiting
–
0.7
2.0
µVrms
Input for 12 dB SINAD (See Figure 9)
–
0.6
–
µVrms
Series Equivalent Input Impedence
–
450–j350
–
Ω
Characteristic
Drain Current (Carrier Detect Low – See Figure 5)
Recovered Audio (RF signal level = 10 mV)
13
–
350
–
mVrms
Noise Output (RF signal level = 0 mV)
13
–
250
–
mVrms
Carrier Detect Threshold (below VCC)
10
–
0.64
–
Vdc
Meter Drive Slope
10
–
100
–
nA/dB
Input for 20 dB (S + N)/N (See Figure 7)
–
0.7
–
µVrms
First Mixer 3rd Order Intercept (Input)
–
–22
–
dBm
First Mixer Input Resistance (Rp)
–
690
–
Ω
First Mixer Input Capacitance (Cp)
–
7.2
–
pF
Conversion Voltage Gain, First Mixer
–
18
–
dB
Conversion Voltage Gain, Second Mixer
–
21
–
–
1.4
–
Dector Output Resistance
13
RF
Input
kΩ
Figure 3. Test Circuit
Ferronics
12–345–K
50 Ω
120 pF
10.245
MHz
2:6
50 pF
1
24
2
23
3
22
4
21
5
FL1
6
0.1
0.1
68 kΩ
180 pF
VCC
0.01
10.5 Turns
Coilcraft
UNI–10/142
33 pF
20
MC3362
7
18
8
17
9
16
10
15
11
14
12
13
Toko RMC–2A6597HM
FL1:
muRata CFU455D
or
Toko LFC–4551
19
FL2
0.1
1.0 µF
+
FL2:
muRata SFE10.7MA
or
Toko SK107M3–A0–10
VEE
NOTE: See AN980 for Additional Design Information.
MOTOROLA ANALOG IC DEVICE DATA
8–83
MC3362
Figure 5. Drain Current, Recovered Audio
versus Supply
Figure 4. IMeter versus Input
8.0
11
VCC
10
10
MC3362
700
ICC, Carr. Det. Low (RF in = 10 mV)
6.0
5.0
8.0
I CC (mA)
I10 ( µ A)
7.0
A
9.0
800
7.0
6.0
5.0
400
300
3.0
Recovered Audio
3.0
2.0
200
1.0
100
0
2.0
– 130 – 120 – 110 – 100 – 90 – 80 – 70 – 60 – 50 – 40 – 30
RF INPUT (dBm)
0
Figure 6. Signal Levels
20
10
10
0
S + N, N, AMR (dB)
20
Second Mixer Output
– 10
First Mixer Output
– 20
Second Mixer Input
– 30
1.0
2.0
3.0
4.0
VCC (V)
5.0
6.0
7.0
0
8.0
Figure 7. S + N, N, AMR versus Input
30
0
POWER (dBm)
500
ICC, Carr. Det. High (RF in = 0 mV)
4.0
4.0
– 40
– 50
600
V13 (mVrms)
12
First Mixer Input
S+N
– 10
– 20
– 30
S + N 30% AM
– 40
– 50
MC3362 13 10 k
– 60
0.01
N
10 k
0.01
– 60
– 70
RF Input to Transformer
– 70
– 130 – 120 – 110 – 100 – 90 – 80 – 70 – 60 – 50 – 40 – 30
RF INPUT (dBm)
– 80
– 130 – 120 – 110 – 100 – 90 – 80 – 70 – 60
RF INPUT (dBm)
Figure 8. 1st Mixer 3rd Order Intermodulation
– 50 – 40
– 30
Figure 9. Detector Output versus Frequency
4.0
20
10
0
3.0
– 10
V13 (Vdc)
dB
– 20
– 30
– 40
– 50
Desired Products
3rd Order Intermod.
Products
– 60
2.0
1.0
– 70
– 80
– 100 – 90
8–84
– 80
– 70 – 60 – 50 – 40 – 30
RF INPUT (dBm)
– 20 – 10
0
0
– 40
– 30
– 20
– 10
0
10
20
RELATIVE INPUT FREQUENCY (kHz)
30
40
MOTOROLA ANALOG IC DEVICE DATA
MC3362
Figure 10. PC Board Test Circuit
(LC Oscillator Configuration Used in PLL Synthesized Receiver)
18 p
RF Input
49.67 MHz
50 Ω
1000 p
1
24
0.01
0.47 µ
2
p p VCC)
Varactor Control
(keep 0.7 V V23
23
0.01
VCC = 2.0 to 7.0 Vdc
120 p
3
22
4
21
10.245, Fund. Mode
32 pF Load
5
20
455 kHz
Cer. Filt.
0.41 µ
33 p
50 p
First Local Oscillator
Buffered Output
3.0 k
VCC
CRF1
6
19
7
18
CRF2
0.1
0.1
8
17
9
16
10
15
0.1
(This network must be tuned to exactly
10.7 MHz above or below the incoming
RF signal.
NOTE: The IF is rolled off above 10.7
MHz to reduce L.O. feedthrough.)
to VCC
CRF1 = muRata CFU 455X – the X
suffix denotes 6.0 dB bandwidth.
Rin = Rout = 1.5 to 2.0 kΩ.
1
CRF2 = muRata SFA10.7 MF5 or
SFE10.7 or equivalent. Rin = Rout
= 330 Ω . Crystal filters can be
used but impedance matching will
need to be added to ensure proper
filter characteristics are realized.
10.7 MHz
Cer. Filt.
0.1
100 k
51 k
10 k
CD Adjust
10 k
Carrier
Detect
39 k
–+
11
14
FSK Data Output
(optional)
0.001
12
13
8.2 k
455 kHz
LC Resonator
0.01
Recovered
Audio
(MC3362)
Figure 10A. Crystal Oscillator Configuration for Single Channel Application
MC3362
23
22
20 k
0.68 µ
VCC
300
21
0.68 µ
Crystal used is series mode resonant
(no load capacity specified), 3rd overtone.
This method has not proven adequate for
fundamental mode, 5th or 7th overtone crystals.
The inductor and capacitor will need to be
changed for other frequency crystals. See
AN980 for further information.
20 k
38.97 MHz
MOTOROLA ANALOG IC DEVICE DATA
8–85
MC3362
Figure 11. Component Placement View
Showing Crystal Oscillator Circuit
Figure 11A. LC Oscillator Component View
L.O.OUT
1
.047
1
.2K
3
METER
DRIVE
DATA
L.O.OUT
GND
4
TOKO
55VLC06379GT
5
CONTROL
CONTROL
330
1
3K
3
10.7MHz
CF
10K
68K
3
8.2 K
2
10K
3K
2
.01
.047
CARRIER
DETECT
10K
10K
.1
.1
51K
.41 µH
7
33p
CF
455KHz
.1
2
.68
µH
39 MHz
XT
10.7 MHz
CF
.1
100K
.01
.01
50p
MC3362P
18p
Vcc
120p
10.245MHz
XT
1.
.68
µH
1Kp
.47 µH
.01
.01
INPUT
8
REC. AUDIO
NOTES: 1. Recovered Audio components may be deleted when using
data output.
2. Carrier Detect components must be deleted in order to obtain
linear Meter Drive output. With these components in place the
Meter Drive outputs serve only to trip the Carrier Detect indicator.
3. Data Output components should be deleted in applications
where only audio modulation is used. For combined audio/data
applications, the 0.047 µF coupling capacitor will add distortion
to the audio, so a pull–down resistor at pin 13 may be required.
4. Use Toko 7MC81282 Quadrature coil.
5. Meter Drive cannot be used simultaneously with Carrier Detect output.
For analog meter drive, remove components labelled ″2″ and measure
meter current (4–12 µA) through ammeter to VCC.
6. Either type of oscillator circuit may be used with any output circuit
configuration.
7. LC Oscillator Coil: Coilcraft UNI 10/42 10.5 turns, 0.41 µH Crystal
Oscillator circuit: trim coil, 0.68 µH. Coilcraft M1287–A.
8. 0.47 H, Coilcraft M1286–A. Input LC network used to match first mixer
input impedance to 50 Ω .
CIRCUIT DESCRIPTION
The MC3362 is a complete FM narrowband receiver from
antenna input to audio preamp output. The low voltage dual
conversion design yields low power drain, excellent
sensitivity and good image rejection in narrowband voice and
data link applications.
In the typical application (Figure 1), the first mixer
amplifies the signal and converts the RF input to 10.7 MHz.
This IF signal is filtered externally and fed into the second
mixer, which further amplifies the signal and converts it to a
455 kHz IF signal. After external bandpass filtering, the low IF
is fed into the limiting amplifier and detection circuitry. The
audio is recovered using a conventional quadrature detector.
Twice–IF filtering is provided internally.
The input signal level is monitored by meter drive circuitry
which detects the amount of limiting in the limiting amplifier.
The voltage at the meter drive pin determines the state of the
carrier detect output, which is active low.
APPLICATIONS INFORMATION
The first local oscillator can be run using a free–running
LC tank, as a VCO using PLL synthesis, or driven from an
external crystal oscillator. It has been run to 190 MHz.* A
buffered output is available at Pin 20. The second local
oscillator is a common base Colpitts type which is typically
run at 10.245 MHz under crystal control. A buffered output is
available at Pin 2. Pins 2 and 3 are interchangeable.
The mixers are doubly balanced to reduce spurious
responses. The first and second mixers have conversion
gains of 18 dB and 22 dB (typical), respectively, as seen in
Figure 6. Mixer gain is stable with respect to supply voltage.
For both conversions, the mixer impedances and pin layout
are designed to allow the user to employ low cost, readily
available ceramic filters. Overall sensitivity and AM rejection
are shown in Figure 7. The input level for 20 dB (S + N)/N is
0.7 µV using the two–pole post–detection filter pictured.
* If the first local oscillator (Pins 21 and/or 22) is driven from a
strong external source (100 mVrms), the mixer can be used to
over 450 MHz.
8–86
MOTOROLA ANALOG IC DEVICE DATA
MC3362
FSK modulation. Data rates are typically limited to 1200 baud
to ensure data integrity and avoid adjacent channel “splatter.”
Hysteresis is available by connecting a high valued resistor
from Pin 15 to Pin 14. Values below 120 kΩ are not
recommended as the input signal cannot overcome the
hysteresis.
The meter drive circuitry detects input signal level by
monitoring the limiting amplifier stages. Figure 4 shows the
unloaded current at Pin 10 versus input power. The meter
drive current can be used directly (RSSI) or can be used to
trip the carrier detect circuit at a specified input power. To do
this, pick an RF trip level in dBm. Read the corresponding
current from Figure 4 and pick a resistor such that:
Following the first mixer, a 10.7 MHz ceramic band–pass
filter is recommended. The 10.7 MHz filtered signal is then
fed into one second mixer input pin, the other input pin being
connected to VCC. Pin 6 (VCC) is treated as a common point
for emitter–driven signals.
The 455 kHz IF is typically filtered using a ceramic
bandpass filter then fed into the limiter input pin. The limiter
has 10 µV sensitivity for – 3.0 dB limiting, flat to 1.0 MHz.
The output of the limiter is internally connected to the
quadrature detector, including a quadrature capacitor. A
parallel LC tank is needed externally from Pin 12 to VCC. A 39
kΩ shunt resistance is included which determines the peak
separation of the quadrature detector; a smaller value will
increase the spacing and linearity but decrease recovered
audio and sensitivity.
A data shaping circuit is available and can be coupled to
the recovered audio output of Pin 13. The circuit is a
comparator which is designed to detect zero crossings of
'
R10
0.64 Vdc / I10
Hysteresis is available by connecting a high valued resistor
RH between Pins 10 and 11. The formula is:
Hysteresis = VCC/(RH x 10 – 7 ) dB
INPUT
Figure 12. Circuit Side View
MC3362P
GND
L.O. OUT
CARRIER
DETECT
VCC
CONTROL
4I
REC. AUDIO
METER
DRIVE
DATA
4I
MOTOROLA ANALOG IC DEVICE DATA
8–87
8–88
Figure 13. Representative Schematic Diagram
23
1.0
kΩ
1.0 kΩ
100 Ω
20
21
bias
1
400
Ω
6 VCC
24
400 Ω
1.4 kΩ
4
5
3
17
18
2
bias
11
12
MOTOROLA ANALOG IC DEVICE DATA
7
2.0 kΩ
8
9
bias
bias
14
13
bias
16
VEE
15
MC3362
10
Tape and Reel Options
In Brief . . .
Motorola offers the convenience of Tape and Reel
packaging for our growing family of standard integrated circuit
products. Reels are available to support the requirements of
both first and second generation pick–and–place equipment.
The packaging fully conforms to the latest EIA–481A
specification. The antistatic embossed tape provides a
secure cavity, sealed with a peel–back cover tape.
MOTOROLA ANALOG IC DEVICE DATA
Page
Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2
Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4
Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5
12–1
Tape and Reel Configurations
Mechanical Polarization
SOIC and Micro–8
DEVICES
PLCC DEVICES
Typical
Typical
PIN 1
User Direction of Feed
User Direction of Feed
DPAK and D2PAK
DEVICES
Typical
User Direction of Feed
12–2
SOT–23 (5 Pin)
DEVICES
SOT–89 (3 Pin)
DEVICES
SOT–89 (5 Pin)
DEVICES
Typical
Typical
Typical
User Direction of Feed
User Direction of Feed
User Direction of Feed
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations
(continued)
TO–92 Reel Styles
STYLE A
(Preferred)
STYLE E
Carrier Strip
Carrier Strip
Rounded
Side
Adhesive Tape
Flat Side
Adhesive Tape
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Feed
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Feed
Flat side of transistor and adhesive tape visible.
Rounded side of transistor and adhesive tape visible.
TO–92 Ammo Pack Styles
STYLE P
(Preferred)
STYLE M
Adhesive Tape On
Top Side
Adhesive Tape On
Top Side
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
Flat Side
Carrier
Strip
Rounded side of transistor and
adhesive tape visible.
Label
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Feed
Feed
Rounded Side
Carrier
Strip
Flat side of transistor and
adhesive tape visible.
Label
Style M ammo pack is equivalent to Style E of reel
pack dependent on feed orientation from box.
Style P ammo pack is equivalent to Styles A and B of reel pack
dependent on feed orientation from box.
TO–92 EIA Radial Tape in Fan Fold Box or On Reel
H2A
H2A
H2B
H2B
H
W2
H4 H5
T1
L1
H1
W1 W
L
T
T2
F1
F2
P2
P1
MOTOROLA ANALOG IC DEVICE DATA
P2
D
P
12–3
Tape and Reel Information Table
Tape
p Width
(mm)
Devices(1)
per Reel
Reel Size
(inch)
Device
Suffix
SO–8, SOP–8
SO–14
SO–16
12
16
16
2,500
2,500
2,500
13
13
13
R2
R2
R2
SO–16L, SO–8+8L WIDE
SO–20L WIDE
SO–24L WIDE
SO–28L WIDE
SO–28L WIDE
16
24
24
24
32
1,000
1,000
1,000
1,000
1,000
13
13
13
13
13
R2
R2
R2
R2
R3
Micro–8
12
2,500
13
R2
PLCC–20
PLCC–28
PLCC–44
16
24
32
1,000
500
500
13
13
13
R2
R2
R2
PLCC–52
PLCC–68
PLCC–84
32
44
44
500
250
250
13
13
13
R2
R2
R2
TO–226AA (TO–92)(2)
18
2,000
13
RA, RE, RP, or RM
(Ammo Pack) only
DPAK
16
2,500
13
RK
D2PAK
24
800
13
R4
SOT–23 (5 Pin)
8
3,000
7
TR
SOT–89 (3/5 Pin)
12
1,000
7
T1
Package
(1) Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.
(2) Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations
are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.
12–4
MOTOROLA ANALOG IC DEVICE DATA
Analog MPQ Table
Tape/Reel and Ammo Pack
Package Type
Package Code
MPQ
Case 775
Case 776
Case 777
0802
0804
0801
1000/reel
500/reel
500/reel
Case 751
Case 751A
Case 751B
Case 751G
Case 751D
Case 751E
Case 751F
0095
0096
0097
2003
2005
2008
2009
2500/reel
2500/reel
2500/reel
1000/reel
1000/reel
1000/reel
1000/reel
Case 846A
–
2500/reel
Case 29
Case 29
0031
0031
2000/reel
2000/Ammo Pack
Case 369A
–
2500/reel
Case 936
–
800/reel
–
3000/reel
–
1000/reel
–
1000/reel
PLCC
SOIC
Micro–8
TO–92
DPAK
D2PAK
SOT–23 (5 Pin)
Case 1212
SOT–89 (3 Pin)
Case 1213
SOT–89 (5 Pin)
Case 1214
MOTOROLA ANALOG IC DEVICE DATA
12–5
12–6
MOTOROLA ANALOG IC DEVICE DATA
Packaging Information
In Brief . . .
The packaging availability for each device type is indicated
on the individual data sheets and the Selector Guide. All of the
outline dimensions for the packages are given in this section.
The maximum power consumption an integrated circuit
can tolerate at a given operating ambient temperature can be
found from the equation:
PD(TA) =
TJ(max) – TA
RθJA(Typ)
where:
PD(TA) = Power Dissipation allowable at a given
operating ambient temperature. This must
be greater than the sum of the products of
the supply voltages and supply currents at
the worst case operating condition.
TJ(max) = Maximum operating Junction Temperature
as listed in the Maximum Ratings Section.
See individual data sheets for TJ(max)
information.
TA = Maximum desired operating Ambient
Temperature
RθJA(Typ) = Typical Thermal Resistance Junction-toAmbient
MOTOROLA ANALOG IC DEVICE DATA
13–1
Case Outline Dimensions
LP, P, Z SUFFIX
CASE 29-04
Plastic Package
(TO-226AA/TO-92)
ISSUE AD
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
B
R
P
1
2
L
F
SEATING
PLANE
DIM
A
B
C
D
F
G
H
J
K
L
N
P
R
V
K
3
D
X X
G
J
H
V
C
SECTION X–X
1
N
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.022
0.016
0.019
0.045
0.055
0.095
0.105
0.015
0.020
0.500
–––
0.250
–––
0.080
0.105
–––
0.100
0.115
–––
0.135
–––
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.41
0.55
0.41
0.48
1.15
1.39
2.42
2.66
0.39
0.50
12.70
–––
6.35
–––
2.04
2.66
–––
2.54
2.93
–––
3.43
–––
N
KC, T SUFFIX
CASE 221A-06
Plastic Package
ISSUE Y
–T–
F
–B–
4
SEATING
PLANE
C
T
S
4
Q
A
U
1 2 3
H
–Y–
1
2
3
K
R
L
J
G
D 3 PL
0.25 (0.010)
M
B
M
Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
INCHES
MIN
MAX
0.560
0.625
0.380
0.420
0.140
0.190
0.020
0.045
0.139
0.155
0.100 BSC
–––
0.280
0.012
0.045
0.500
0.580
0.045
0.070
0.200 BSC
0.100
0.135
0.080
0.115
0.020
0.055
0.235
0.255
0.000
0.050
MILLIMETERS
MIN
MAX
14.23
15.87
9.66
10.66
3.56
4.82
0.51
1.14
3.53
3.93
2.54 BSC
–––
7.11
0.31
1.14
12.70
14.73
1.15
1.77
5.08 BSC
2.54
3.42
2.04
2.92
0.51
1.39
5.97
6.47
0.00
1.27
N
13–2
MOTOROLA ANALOG IC DEVICE DATA
TH SUFFIX
CASE 314A-03
Plastic Package
ISSUE D
–T–
B
–P–
Q
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
C
E
OPTIONAL
CHAMFER
A
U
F
L
DIM
A
B
C
D
E
F
G
J
K
L
Q
S
U
K
1
5
G
5X
S
D
0.014 (0.356)
T, TV SUFFIX
CASE 314B-05
Plastic Package
ISSUE J
M
T P
M
OPTIONAL
CHAMFER
E
A
U
L
S
W
V
F
1
5
5X
G
5X
0.24 (0.610)
M
J
T
H
D
0.10 (0.254)
M
T P
N
M
–T–
T SUFFIX
CASE 314C–01
Plastic Package
ISSUE A
–Q–
B
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
14.478 14.859
1.702 BSC
0.381
0.635
18.542 18.923
8.128
9.271
3.556
3.886
5.334
6.604
11.888 12.827
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
C
B
–P–
Q
K
J
5X
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.570
0.585
0.067 BSC
0.015
0.025
0.730
0.745
0.320
0.365
0.140
0.153
0.210
0.260
0.468
0.505
–T–
SEATING
PLANE
DIM
A
B
C
D
E
F
G
H
J
K
L
N
Q
S
U
V
W
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.850
0.935
0.067 BSC
0.166 BSC
0.015
0.025
0.900
1.100
0.320
0.365
0.320 BSC
0.140
0.153
–––
0.620
0.468
0.505
–––
0.735
0.090
0.110
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
21.590 23.749
1.702 BSC
4.216 BSC
0.381
0.635
22.860 27.940
8.128
9.271
8.128 BSC
3.556
3.886
––– 15.748
11.888 12.827
––– 18.669
2.286
2.794
SEATING
PLANE
C
E
A
1 2 3 4 5
L
1
DIM
A
B
C
D
E
G
J
K
L
Q
K
5
G
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
INCHES
MIN
MAX
0.610
0.625
0.380
0.420
0.160
0.190
0.020
0.040
0.035
0.055
0.067 BSC
0.015
0.025
0.500
–––
0.355
0.370
0.139
0.147
MILLIMETERS
MIN
MAX
15.59
15.88
9.65
10.67
4.06
4.83
0.51
1.02
0.89
1.40
1.702 BSC
0.38
0.64
12.70
–––
9.02
9.40
3.53
3.73
5 PL
0.356 (0.014) M T Q
MOTOROLA ANALOG IC DEVICE DATA
M
J
13–3
T, T1 SUFFIX
CASE 314D-03
Plastic Package
ISSUE D
–T–
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
C
–Q–
B
E
U
A
L
DIM
A
B
C
D
E
G
H
J
K
L
Q
U
S
1 2 3 4 5
K
S
12
3
45
J
G
D
H
5 PL
0.356 (0.014)
DT-1 SUFFIX
CASE 369-07
Plastic Package
(DPAK)
ISSUE K
M
T Q
C
E
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
DIM
A
B
C
D
E
F
G
H
J
K
R
S
V
4
A
1
2
3
S
1
–T–
2
K
SEATING
PLANE
3
J
F
H
D
G
DT SUFFIX
CASE 369A-13
Plastic Package
(DPAK)
ISSUE Y
0.13 (0.005)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
C
B
E
R
4
Z
A
S
1
3
2
3
U
K
F
J
L
H
D
G
13–4
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.84
1.01
0.94
1.19
2.29 BSC
0.87
1.01
0.46
0.58
8.89
9.65
4.45
5.46
1.27
2.28
0.77
1.27
T
M
4
1
INCHES
MIN
MAX
0.235
0.250
0.250
0.265
0.086
0.094
0.027
0.035
0.033
0.040
0.037
0.047
0.090 BSC
0.034
0.040
0.018
0.023
0.350
0.380
0.175
0.215
0.050
0.090
0.030
0.050
3 PL
–T–
V
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
1.702 BSC
2.210
2.845
0.381
0.635
25.908 27.051
8.128
9.271
3.556
3.886
2.667
2.972
13.792 14.783
M
B
V
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.067 BSC
0.087
0.112
0.015
0.025
1.020
1.065
0.320
0.365
0.140
0.153
0.105
0.117
0.543
0.582
2 PL
0.13 (0.005)
M
DIM
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
INCHES
MIN
MAX
0.235
0.250
0.250
0.265
0.086
0.094
0.027
0.035
0.033
0.040
0.037
0.047
0.180 BSC
0.034
0.040
0.018
0.023
0.102
0.114
0.090 BSC
0.175
0.215
0.020
0.050
0.020
–––
0.030
0.050
0.138
–––
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.84
1.01
0.94
1.19
4.58 BSC
0.87
1.01
0.46
0.58
2.60
2.89
2.29 BSC
4.45
5.46
0.51
1.27
0.51
–––
0.77
1.27
3.51
–––
T
MOTOROLA ANALOG IC DEVICE DATA
DP1, N, P, P1 SUFFIX
CASE 626-05
Plastic Package
ISSUE K
8
5
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B–
1
4
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
–A–
NOTE 2
L
8
C
1
J
–T–
N
SEATING
PLANE
D
M
K
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
–––
10_
0.030
0.040
G
H
0.13 (0.005)
M
T A
B
M
M
N, P, N-14, P2 SUFFIX
CASE 646-06
Plastic Package
ISSUE L
14
8
1
7
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
B
A
F
14
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
1
C
J
N
H
DP2, N, P, PC SUFFIX
CASE 648-08
Plastic Package
ISSUE R
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
–––
10_
0.76
1.01
G
D
SEATING
PLANE
K
M
9
1
8
B
F
C
16
L
S
1
–T–
SEATING
PLANE
K
H
G
D
J
16 PL
0.25 (0.010)
MOTOROLA ANALOG IC DEVICE DATA
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
13–5
B, P, P2, V SUFFIX
CASE 648C-03
Plastic Package
(DIP–16)
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND
5, 12 AND 13.
–A–
16
9
1
8
–B–
L
NOTE 5
16
C
1
–T–
M
N
SEATING
PLANE
K
E
F
J
G
D 16 PL
0.13 (0.005)
16 PL
0.13 (0.005)
M
T A
M
T B
MILLIMETERS
MIN
MAX
18.80
21.34
6.10
6.60
3.69
4.69
0.38
0.53
1.27 BSC
1.02
1.78
2.54 BSC
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION A AND B DOES NOT INCLUDE MOLD
PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
6. ROUNDED CORNER OPTIONAL.
R
16
9
1
8
–B–
M
P
L
F
16
J
1
C
–T–
SEATING
PLANE
S
K
H
G
D 13 PL
0.25 (0.010)
P SUFFIX
CASE 649-03
Plastic Package
ISSUE D
P
M
T B
A
S
L
B
1
12
J
H
F
C
N
1
K
G
D
SEATING
PLANE
INCHES
MIN
MAX
0.740
0.760
0.245
0.260
0.145
0.175
0.015
0.021
0.050
0.070
0.100 BSC
0.050 BSC
0.008
0.015
0.120
0.140
0.295
0.305
0_
10 _
0.200 BSC
0.300 BSC
0.015
0.035
MILLIMETERS
MIN
MAX
18.80
19.30
6.23
6.60
3.69
4.44
0.39
0.53
1.27
1.77
2.54 BSC
1.27 BSC
0.21
0.38
3.05
3.55
7.50
7.74
0_
10 _
5.08 BSC
7.62 BSC
0.39
0.88
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
13
Q
DIM
A
B
C
D
F
G
H
J
K
L
M
P
R
S
S
A
24
13–6
INCHES
MIN
MAX
0.740
0.840
0.240
0.260
0.145
0.185
0.015
0.021
0.050 BSC
0.040
0.70
0.100 BSC
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.040
–A–
P SUFFIX
CASE 648E–01
Plastic Package
(DIP–16)
ISSUE O
24
DIM
A
B
C
D
E
F
G
J
K
L
M
N
M
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
Q
MILLIMETERS
MIN
MAX
31.50
32.13
13.21
13.72
4.70
5.21
0.38
0.51
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.30
2.92
3.43
14.99
15.49
–––
10
0.51
1.02
0.13
0.38
0.51
0.76
INCHES
MIN
MAX
1.240
1.265
0.520
0.540
0.185
0.205
0.015
0.020
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.012
0.115
0.135
0.590
0.610
–––
10 _
0.020
0.040
0.005
0.015
0.020
0.030
MOTOROLA ANALOG IC DEVICE DATA
A, B, N, P SUFFIX
CASE 707-02
Plastic Package
ISSUE C
18
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
10
B
1
9
A
L
C
18
DIM
A
B
C
D
F
G
H
J
K
L
M
N
1
K
N
F
H
D
G
J
M
SEATING
PLANE
P SUFFIX
CASE 710-02
Plastic Package
ISSUE B
1
28
DIM
A
B
C
D
F
G
H
J
K
L
M
N
15
B
14
1
L
C
A
N
G
F
D
M
K
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1
40
21
B
1
20
L
A
C
N
J
F
MOTOROLA ANALOG IC DEVICE DATA
INCHES
MIN
MAX
1.435
1.465
0.540
0.560
0.155
0.200
0.014
0.022
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.015
0.115
0.135
0.600 BSC
0_
15_
0.020
0.040
SEATING
PLANE
40
G
MILLIMETERS
MIN
MAX
36.45
37.21
13.72
14.22
3.94
5.08
0.36
0.56
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.38
2.92
3.43
15.24 BSC
0_
15_
0.51
1.02
J
P SUFFIX
CASE 711-03
Plastic Package
ISSUE C
H
INCHES
MIN
MAX
0.875
0.915
0.240
0.260
0.140
0.180
0.014
0.022
0.050
0.070
0.100 BSC
0.040
0.060
0.008
0.012
0.115
0.135
0.300 BSC
0_
15 _
0.020
0.040
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
28
H
MILLIMETERS
MIN
MAX
22.22
23.24
6.10
6.60
3.56
4.57
0.36
0.56
1.27
1.78
2.54 BSC
1.02
1.52
0.20
0.30
2.92
3.43
7.62 BSC
0_
15_
0.51
1.02
D
K
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MILLIMETERS
MIN
MAX
51.69
52.45
13.72
14.22
3.94
5.08
0.36
0.56
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.38
2.92
3.43
15.24 BSC
0_
15_
0.51
1.02
INCHES
MIN
MAX
2.035
2.065
0.540
0.560
0.155
0.200
0.014
0.022
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.015
0.115
0.135
0.600 BSC
0_
15_
0.020
0.040
M
SEATING
PLANE
13–7
F, P, P-3 SUFFIX
CASE 724-03
Plastic Package
(NDIP–24)
ISSUE D
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
24
1
–A–
24
13
1
12
–B–
L
C
–T–
NOTE 1
K
SEATING
PLANE
N
E
G
M
J
F
D
0.25 (0.010)
H, P, DP SUFFIX
CASE 738-03
Plastic Package
ISSUE E
24 PL
0.25 (0.010)
24 PL
T A
M
M
INCHES
MIN
MAX
1.230
1.265
0.250
0.270
0.145
0.175
0.015
0.020
0.050 BSC
0.040
0.060
0.100 BSC
0.007
0.012
0.110
0.140
0.300 BSC
0_
15_
0.020
0.040
DIM
A
B
C
D
E
F
G
J
K
L
M
N
T B
M
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
–A–
20
11
1
10
B
DIM
A
B
C
D
E
F
G
J
K
L
M
N
L
C
20
1
–T–
K
SEATING
PLANE
J
F
M
T A
C
0.25
H
M
B
M
1
4
8
B
1
h
e
q
SEATING
PLANE
0.10
A1
B
0.25
13–8
X 45 _
A
C
M
C B
S
A
S
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
5
E
T B
M
M
D
8
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
20 PL
0.25 (0.010)
A
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
20 PL
0.25 (0.010)
D
D, D1, D2 SUFFIX
CASE 751-05
Plastic Package
(SO-8, SOP-8)
ISSUE R
M
N
E
G
MILLIMETERS
MIN
MAX
31.25
32.13
6.35
6.85
3.69
4.44
0.38
0.51
1.27 BSC
1.02
1.52
2.54 BSC
0.18
0.30
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
L
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.18
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
CASE 751A-03
Plastic Package
(SO-14)
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
M
B
M
14
1
R X 45 _
G
F
C
–T–
0.25 (0.010)
M
J
M
K
D 14 PL
SEATING
PLANE
T B
A
S
S
DIM
A
B
C
D
F
G
J
K
M
P
R
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
16
1
K
R
F
X 45 _
C
SEATING
PLANE
D
J
M
16 PL
0.25 (0.010)
DW, FP SUFFIX
CASE 751D-04
Plastic Package
(SO-20L, SO–20)
ISSUE E
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
–A–
D SUFFIX
CASE 751B-05
Plastic Package
(SO-16)
ISSUE J
–T–
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
T B
M
A
S
S
–A–
20
10X
P
0.010 (0.25)
1
M
B
M
10
20X
J
D
0.010 (0.25)
M
T A
B
S
S
20
F
1
R
C
–T–
18X
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
G
MOTOROLA ANALOG IC DEVICE DATA
K
SEATING
PLANE
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
11
–B–
DIM
A
B
C
D
F
G
J
K
M
P
R
X 45 _
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
12.65
12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.499
0.510
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
M
13–9
DW SUFFIX
CASE 751E-04
Plastic Package
(SO-24L,
SOP (16+4+4)L)
ISSUE E
–A–
24
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
13
–B–
12X
P
0.010 (0.25)
1
M
B
M
12
24X
24
D
J
0.010 (0.25)
1
T A
M
B
S
S
DIM
A
B
C
D
F
G
J
K
M
P
R
F
R
X 45 _
C
–T–
M
SEATING
PLANE
DW SUFFIX
CASE 751F-04
Plastic Package
(SO-28L, SOIC–28)
ISSUE E
K
G
22X
1
–A–
15
14X
–B–
1
P
0.010 (0.25)
M
B
M
14
M
28X
D
R
0.010 (0.25)
M
T A
B
S
S
X 45 _
C
26X
–T–
G
F
SEATING
PLANE
K
DW SUFFIX
CASE 751G-02
Plastic Package
(SO-16L, SOP–16L,
SOP-8+8L)
ISSUE A
–B–
8X
P
0.010 (0.25)
M
B
M
8
16X
MILLIMETERS
MIN
MAX
17.80
18.05
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27 BSC
0.23
0.32
0.13
0.29
0_
8_
10.01
10.55
0.25
0.75
J
D
16
1
0.010 (0.25)
M
T A
S
B
S
F
R X 45 _
C
–T–
14X
13–10
G
INCHES
MIN
MAX
0.701
0.711
0.292
0.299
0.093
0.104
0.014
0.019
0.016
0.035
0.050 BSC
0.009
0.013
0.005
0.011
0_
8_
0.395
0.415
0.010
0.029
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
9
1
DIM
A
B
C
D
F
G
J
K
M
P
R
J
–A–
16
INCHES
MIN
MAX
0.601
0.612
0.292
0.299
0.093
0.104
0.014
0.019
0.016
0.035
0.050 BSC
0.009
0.013
0.005
0.011
0_
8_
0.395
0.415
0.010
0.029
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
28
28
MILLIMETERS
MIN
MAX
15.25
15.54
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27 BSC
0.23
0.32
0.13
0.29
0_
8_
10.05
10.55
0.25
0.75
K
SEATING
PLANE
M
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
10.15
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.400
0.411
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
CASE 751K–01
Plastic Package
(SO–16)
ISSUE O
16
1
16
S
–A–
–B–
0.25 (0.010)
M
B
9
P
1
M_
F
DIM
A
B
C
D
F
G
J
K
M
P
R
8
G
R X 45 _
C
–T–
K
J
0.25 (0.010)
DW SUFFIX
CASE 751N–01
Plastic Package
(SOP–16L)
ISSUE O
SEATING
PLANE
14 X D
M
T A
B
S
S
–A–
9
–B–
1
0.010 (0.25)
P
M
B
M
8
16
13X
1
J
D
0.010 (0.25)
M
T A
S
B
S
F
R X 45 _
C
–T–
S
K
9X
MOTOROLA ANALOG IC DEVICE DATA
SEATING
PLANE
M
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.368
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
T
16
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4 MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
S
T
MILLIMETERS
MIN
MAX
10.15
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
2.54 BSC
3.81 BSC
INCHES
MIN
MAX
0.400
0.411
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
0.100 BSC
0.150 BSC
G
13–11
CASE 762-01
Plastic Medium Power Package
(SIP-9)
ISSUE C
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
Q
0.25 (0.010)
T A
M
1
M
–A–
–C–
U
V
M
X
S
W
E
Y
R
B
9
1
–T–
N
SEATING
PLANE
K
D
M
T C
9 PL
0.25 (0.010)
FN SUFFIX
CASE 775-02
Plastic Package
(PLCC-20)
ISSUE C
0.25 (0.010)
J
H
G
F
M
T A
M
Y BRK
–N–
0.007 (0.180)M T L–M S N
S
0.007 (0.180)M T L–M S N
U
S
D
–L–
Z
–M–
W
20
D
1
V
G1
X
0.010 (0.250)S T L–M S N
S
VIEW D–D
A
0.007 (0.180)M T L–M S N
S
R
0.007 (0.180)M T L–M S N
S
Z
H
C
0.007 (0.180)M T L–M S N
S
E
G
0.004 (0.100)
J –T– SEATING
PLANE
VIEW S
G1
0.010 (0.250)S T L–M S N
13–12
K1
K
F
S
VIEW S
0.007 (0.180)M T L–M S N
MILLIMETERS
MIN
MAX
22.40
23.00
6.40
6.60
3.45
3.65
0.40
0.55
9.35
9.60
1.40
1.60
2.54 BSC
1.51
1.71
0.360
0.400
3.95
4.20
30 _BSC
2.50
2.70
3.15
3.45
13.60
13.90
1.65
1.95
22.00
22.20
0.55
0.75
2.89 BSC
0.65
0.75
2.70
2.80
INCHES
MIN
MAX
0.873
0.897
0.252
0.260
0.135
1.143
0.015
0.021
0.368
0.377
0.055
0.062
0.100 BSC
0.059
0.067
0.014
0.015
0.155
0.165
30_BSC
0.099
0.106
0.124
0.135
0.535
0.547
0.064
0.076
0.866
0.874
0.021
0.029
0.113 BSC
0.025
0.029
0.106
0.110
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
1
B
M
DIM
A
B
C
D
E
F
G
H
J
K
M
N
Q
R
S
U
V
W
X
Y
S
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 776-02
Plastic Package
(PLCC–28)
ISSUE D
1
0.007 (0.180)
B
T L–M
M
N
S
T L–M
S
S
Y BRK
–N–
0.007 (0.180)
U
M
N
S
D
Z
–M–
–L–
W
28
D
X
G1
0.010 (0.250)
T L–M
S
N
S
S
V
1
VIEW D–D
A
0.007 (0.180)
R
0.007 (0.180)
M
T L–M
S
N
S
C
M
T L–M
S
N
0.007 (0.180)
H
Z
M
T L–M
N
S
S
S
K1
E
0.004 (0.100)
G
J
S
K
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250)
–T–
T L–M
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
MOTOROLA ANALOG IC DEVICE DATA
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485
0.495
0.485
0.495
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.450
0.456
0.450
0.456
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10_
0.410
0.430
0.040
–––
MILLIMETERS
MIN
MAX
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10_
10.42
10.92
1.02
–––
13–13
FN SUFFIX
CASE 777-02
Plastic Package
(PLCC)
ISSUE C
0.007(0.180) M T
B
L–M
0.007(0.180) M T
U
N
S
L–M
S
S
N
S
1
–N–
Y
D
BRK
Z
–M–
–L–
G1
0.010 (0.25)
X
VIEW D–D
V
44
W
1
D
0.007(0.180) M T
L–M
S
N
S
R
0.007(0.180) M T
L–M
S
N
S
T
0.007(0.180) M T
H
A
S
L–M
S
L–M
S
N
S
N
N
S
S
K1
Z
K
J
C
F
E
0.007(0.180) M T
0.004 (0.10)
–T– SEATING
G
0.010 (0.25)
S
T
L–M
S
N
NOTES:
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
M SUFFIX
CASE 803C
PRELIMINARY
Plastic Package
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
VIEW S
S
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
11
K
–B–
1
1
10
S
10 PL
0.13 (0.005)
M
B
M
N
C
E
MILLIMETERS
MIN
MAX
17.40
17.65
17.40
17.65
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
16.51
16.66
16.51
16.66
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
15.50
16.00
1.02
–––
J
G
20
INCHES
MIN
MAX
0.685
0.695
0.685
0.695
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.650
0.656
0.650
0.656
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.610
0.630
0.040
–––
NOTES:
6 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
7 CONTROLLING DIMENSION: MILLIMETER.
8 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
9 MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER
SIDE.
10 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–A–
–F–
20
S
VIEW S
PLANE
G1
L–M
D 20 PL
0.13 (0.005) M T B
0.10 (0.004)
L
S
–T–
A
S
SEATING
PLANE
M
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
S
MILLIMETERS
MIN
MAX
12.35
12.80
5.10
5.45
1.95
2.05
0.35
0.50
–––
0.81
12.40*
1.15
1.39
0.59
0.81
0.18
0.27
1.10
1.50
0.05
0.20
0_
10 _
0.50
0.85
7.40
8.20
INCHES
MIN
MAX
0.486
0.504
0.201
0.215
0.077
0.081
0.014
0.020
–––
0.032
0.488*
0.045
0.055
0.023
0.032
0.007
0.011
0.043
0.059
0.001
0.008
0_
10 _
0.020
0.033
0.291
0.323
*APPROXIMATE
13–14
MOTOROLA ANALOG IC DEVICE DATA
TV SUFFIX
CASE 821C-04
Plastic Package
(15-Pin ZIP)
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
1
15
SEATING
PLANE
–T–
C
E
M
–Q–
B
DIM
A
B
C
D
E
G
H
J
K
L
M
R
S
U
V
Y
–P–
U
Y
K
V
A
R
S
H
PIN 15
PIN 1
L
G
15X
D
15X
0.010 (0.254)
T SUFFIX
CASE 821D-03
Plastic Package
ISSUE C
T P Q
M
S
J
0.024 (0.610)
M
T
15
SEATING
PLANE
–T–
C
B
E
–P–
U
DIM
A
B
C
D
E
F
G
H
J
K
Q
R
U
Y
A
R
K
PIN 1
Y
PIN 15
G
7X
15X
MILLIMETERS
MIN
MAX
17.374 17.627
19.914 20.116
4.395
4.597
0.610
0.787
1.473
1.574
1.270 BSC
4.293 BSC
0.458
0.609
17.780 18.034
5.080 BSC
3.760
3.835
10.567 10.820
3.988
4.242
2.667
2.921
22.047 REF
15.875 16.231
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DELETED
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
1
Q
–L–
INCHES
MIN
MAX
0.684
0.694
0.784
0.792
0.173
0.181
0.024
0.031
0.058
0.062
0.050 BSC
0.169 BSC
0.018
0.024
0.700
0.710
0.200 BSC
0.148
0.151
0.416
0.426
0.157
0.167
0.105
0.115
0.868 REF
0.625
0.639
H
F
D
0.010 (0.254)
15X
M
T P L
MOTOROLA ANALOG IC DEVICE DATA
S
J
0.024 (0.610)
M
INCHES
MIN
MAX
0.681
0.694
0.784
0.792
0.173
0.181
0.024
0.031
0.058
0.062
0.016
0.023
0.050 BSC
0.110 BSC
0.018
0.024
1.078
1.086
0.148
0.151
0.416
0.426
0.110 BSC
0.503 REF
MILLIMETERS
MIN
MAX
17.298 17.627
19.914 20.116
4.395
4.597
0.610
0.787
1.473
1.574
0.407
0.584
1.270 BSC
2.794 BSC
0.458
0.609
27.382 27.584
3.760
3.835
10.567 10.820
2.794 BSC
12.776 REF
T
13–15
FTB SUFFIX
CASE 824D–01
Plastic Package
(TQFP–44)
ISSUE O
1
L
–T–, –U–, –Z–
–Z–
44
34
11
T–U
G
AE
DETAIL AA
M
V
S
AE
PLATING
F
BASE METAL
ÉÉÉÉ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
J
23
12
0.20 (0.008)
DETAIL AA
0.05 (0.002) Z
AC Z
S
T–U
0.20 (0.008)
M
B
L
S
–U–
AB Z
–T–
S
33
1
22
N
D
0.20 (0.008)
A
0.20 (0.008)
AB T–U
M
S
Z
S
S
Z
S
M
AC T–U
S
Z
S
SECTION AE–AE
0.05 (0.002) T–U
S
0.20 (0.008)
M
AC T–U
M
C
–AB–
E
0.10 (0.004)
–AC–
H
Y
R
K
W
X
VIEW AD
13–16
DETAIL AD
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT
DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.530
(0.021).
MILLIMETERS
DIM MIN
MAX
A
9.950 10.050
B
9.950 10.050
C
1.400
1.600
D
0.300
0.450
E
1.350
1.450
F
0.300
0.400
G
0.800 BSC
H
0.050
0.150
J
0.090
0.200
K
0.450
0.550
L
8.000 BSC
M
12_REF
N
0.090
0.160
Q
1_
5_
R
0.100
0.200
S 11.900 12.100
V 11.900 12.100
W
0.200 REF
X
1.000 REF
Y
12_REF
INCHES
MIN
MAX
0.392
0.396
0.392
0.396
0.055
0.063
0.012
0.018
0.053
0.057
0.012
0.016
0.031 BSC
0.002
0.006
0.004
0.008
0.018
0.022
0.315 BSC
12_REF
0.004
0.006
1_
5_
0.004
0.008
0.469
0.476
0.469
0.476
0.008 REF
0.039 REF
12_REF
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 824E–02
Plastic Package
(QFP)
ISSUE A
44
1
S
0.20 (0.008)
M
–L–, –M–, –N–
T L–M
S
N
S
H L–M
S
N
S
A
0.20 (0.008)
M
0.05 (0.002) L–M
PIN 1
IDENT
J1
44
G
J1
34
VIEW Y
33
1
G
11
40X
S
T L–M
M
J
0.20 (0.008)
VIEW Y
BASE METAL
B1
D
M
T L–M
S
N
S
SECTION J1–J1
44 PL
22
–N–
M
VIEW P
C E
–H–
W
Y
q1
R
DATUM
PLANE
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
0.20 (0.008)
23
12
F
PLATING
V
S
0.20 (0.008)
M
B
–M–
0.05 (0.002) N
–L–
H L–M
N
N
S
S
3 PL
–H–
R
K
A1
C1
VIEW P
MOTOROLA ANALOG IC DEVICE DATA
R1
R2
q2
DATUM
PLANE
0.01 (0.004)
–T–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.530 (0.021).
DIM
A
B
C
D
E
F
G
J
K
M
S
V
W
Y
A1
B1
C1
R1
R2
q1
q2
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
9.90
10.10
0.390
0.398
9.90
10.10
0.390
0.398
2.00
2.21
0.079
0.087
0.30
0.45 0.0118 0.0177
2.00
2.10
0.079
0.083
0.30
0.40
0.012
0.016
0.80 BSC
0.031 BSC
0.13
0.23
0.005
0.009
0.65
0.95
0.026
0.037
5_
10 _
5_
10_
12.95
13.45
0.510
0.530
12.95
13.45
0.510
0.530
0.000
0.210
0.000
0.008
5_
10 _
5_
10 _
0.450 REF
0.018 REF
0.130
0.005
0.170
0.007
1.600 REF
0.063 REF
0.130
0.300
0.005
0.012
0.130
0.300
0.005
0.012
5_
10 _
5_
10 _
0_
7_
0_
7_
13–17
FB SUFFIX
CASE 840F–01
Plastic Package
ISSUE O
64
1
L
–Z–
64
49
S
S
T–U
48
T–U
1
–T–, –U–, –Z–
–U–
DETAIL AA
S
S
AC Z
M
G
DETAIL AA
33
S
16
AE
V
0.20 (0.008)
–T–
AE
0.20 (0.008) M
0.050 (0.002)
B
Z
L
AB Z
P
32
Z
17
S
S
Z
S
F
M
C
SECTION AE–AE
–AB–
Y
D
J
E
H
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
N
S
Z
AC T–U
S
AC T–U
M
S
M
0.20 (0.008)
BASE
METAL
0.20 (0.008)
A
0.20 (0.008) M AB T–U
0.050 (0.002) T–U
0.10 (0.004)
–AC–
DETAIL AD
Q
R
K
W
X
DETAIL AD
13–18
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED
AT DATUM PLANE –AC–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
MILLIMETERS
DIM MIN
MAX
A
9.950 10.050
B
9.950 10.050
C
1.400
1.600
D
0.170
0.270
E
1.350
1.450
F
0.170
0.230
G
0.500 BSC
H
0.050
0.150
J
0.090
0.200
K
0.450
0.550
7.500 BSC
L
M
12° REF
N
0.090
0.160
0.250 BSC
P
Q
1°
5°
R
0.100
0.200
S 11.900 12.100
V 11.900 12.100
0.200 REF
W
1.000 REF
X
12° REF
Y
INCHES
MIN
MAX
0.392
0.396
0.392
0.396
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.020 BSC
0.002
0.006
0.004
0.008
0.018
0.022
0.295 BSC
12° REF
0.004
0.006
0.010 BSC
5°
1°
0.004
0.008
0.469
0.476
0.469
0.476
0.008 REF
0.039 REF
12° REF
MOTOROLA ANALOG IC DEVICE DATA
DM SUFFIX
CASE 846A–02
Plastic Package
(Micro–8)
ISSUE C
8
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
–A–
–B–
K
PIN 1 ID
G
D 8 PL
0.08 (0.003)
–T–
M
T B
S
A
S
SEATING
PLANE
0.038 (0.0015)
C
H
MOTOROLA ANALOG IC DEVICE DATA
J
DIM
A
B
C
D
G
H
J
K
L
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
–––
1.10
0.25
0.40
0.65 BSC
0.05
0.15
0.13
0.23
4.75
5.05
0.40
0.70
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
–––
0.043
0.010
0.016
0.026 BSC
0.002
0.006
0.005
0.009
0.187
0.199
0.016
0.028
L
13–19
FB SUFFIX
CASE 848B-04
Plastic Package
(TQFP–52)
ISSUE C
1
52
L
39
27
S
D
S
V
B
–A–, –B–, –D–
0.20 (0.008)
0.20 (0.008)
M
L
B
M
C A–B
S
S
B
H A–B
–B–
–A–
0.05 (0.002) A–B
DETAIL A
D
26
40
DETAIL A
14
52
1
13
–D–
B
0.20 (0.008) M H A–B
F
S
D
S
S
D
S
0.05 (0.002) A–B
J
V
0.20 (0.008)
M
C A–B
N
BASE METAL
M_
C
D
DETAIL C
0.02 (0.008)
E
–H–
M
C A–B
S
D
S
SECTION B–B
DATUM
PLANE
0.10 (0.004)
H
M_
G
U_
R
Q_
K
T
W
X
DETAIL C
13–20
–C–
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
Q
R
S
T
U
V
W
X
MILLIMETERS
MIN
MAX
9.90
10.10
9.90
10.10
2.10
2.45
0.22
0.38
2.00
2.10
0.22
0.33
0.65 BSC
–––
0.25
0.13
0.23
0.65
0.95
7.80 REF
5_
10_
0.13
0.17
0_
7_
0.13
0.30
12.95
13.45
0.13
–––
0_
–––
12.95
13.45
0.35
0.45
1.6 REF
INCHES
MIN
MAX
0.390
0.398
0.390
0.398
0.083
0.096
0.009
0.015
0.079
0.083
0.009
0.013
0.026 BSC
–––
0.010
0.005
0.009
0.026
0.037
0.307 REF
5_
10 _
0.005
0.007
0_
7_
0.005
0.012
0.510
0.530
0.005
–––
0_
–––
0.510
0.530
0.014
0.018
0.063 REF
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848D–03
Plastic Package
ISSUE C
52
1
4X
4X TIPS
0.20 (0.008) H L–M N
0.20 (0.008) T L–M N
52
40
1
CL
39
3X VIEW
–X–
X=L, M, N
AB
Y
–L–
AB
–M–
B
B1
VIEW Y
V
V1
27
14
26
J
–N–
A1
S1
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
BASE METAL
F
PLATING
13
G
0.13 (0.005)
M
D
T L–M
U
S
N
S
A
SECTION AB–AB
S
ROTATED 90_ CLOCKWISE
4X
C
θ2
0.10 (0.004) T
–H–
–T–
SEATING
PLANE
4X
θ3
VIEW AA
0.05 (0.002)
S
W
θ1
2XR
R1
0.25 (0.010)
C2
θ
GAGE PLANE
K
C1
E
Z
VIEW AA
MOTOROLA ANALOG IC DEVICE DATA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
DIM
A
A1
B
B1
C
C1
C2
D
E
F
G
J
K
R1
S
S1
U
V
V1
W
Z
θ
θ1
θ2
θ3
MILLIMETERS
MIN
MAX
10.00 BSC
5.00 BSC
10.00 BSC
5.00 BSC
–––
1.70
0.05
0.20
1.30
1.50
0.20
0.40
0.75
0.45
0.22
0.35
0.65 BSC
0.07
0.20
0.50 REF
0.08
0.20
12.00 BSC
6.00 BSC
0.09
0.16
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0_
7_
–––
0_
12 _ REF
5_
13 _
INCHES
MIN
MAX
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
–––
0.067
0.002
0.008
0.051
0.059
0.008
0.016
0.018
0.030
0.009
0.014
0.026 BSC
0.003
0.008
0.020 REF
0.003
0.008
0.472 BSC
0.236 BSC
0.004
0.006
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
0_
7_
–––
0_
12 _ REF
5_
13 _
13–21
B SUFFIX
CASE 858–01
Plastic Package
ISSUE O
42
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
–A–
42
22
–B–
1
21
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
H
C
–T–
SEATING
PLANE
N
G
F
D 42 PL
K
0.25 (0.010)
M
T A
M
J 42 PL
0.25 (0.010)
S
M
T B
INCHES
MIN
MAX
1.435
1.465
0.540
0.560
0.155
0.200
0.014
0.022
0.032
0.046
0.070 BSC
0.300 BSC
0.008
0.015
0.115
0.135
0.600 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
36.45
37.21
13.72
14.22
3.94
5.08
0.36
0.56
0.81
1.17
1.778 BSC
7.62 BSC
0.20
0.38
2.92
3.43
15.24 BSC
0_
15 _
0.51
1.02
S
B SUFFIX
CASE 859–01
Plastic Package
(SDIP)
ISSUE O
56
1
–A–
56
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)
29
–B–
1
28
L
H
C
–T–
K
SEATING
PLANE
G
F
D 56 PL
0.25 (0.010)
13–22
E
M
T A
S
N
J
M
56 PL
0.25 (0.010)
M
T B
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
2.035
2.065
0.540
0.560
0.155
0.200
0.014
0.022
0.035 BSC
0.032
0.046
0.070 BSC
0.300 BSC
0.008
0.015
0.115
0.135
0.600 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
51.69
52.45
13.72
14.22
3.94
5.08
0.36
0.56
0.89 BSC
0.81
1.17
1.778 BSC
7.62 BSC
0.20
0.38
2.92
3.43
15.24 BSC
0_
15 _
0.51
1.02
S
MOTOROLA ANALOG IC DEVICE DATA
FB, FTB SUFFIX
CASE 873-01
Plastic Package
(TQFP–32)
ISSUE A
1
L
S
D
S
H A–B
V
P
B
M
S
D
S
0.20 (0.008)
B
B
0.20 (0.008)
L
M
–B–
–A–
0.05 (0.002) A–B
16
C A–B
17
24
25
–A–, –B–, –D–
DETAIL A
DETAIL A
32
9
1
8
F
BASE
METAL
–D–
A
0.20 (0.008)
C A–B
M
D
S
S
0.05 (0.002) A–B
N
J
S
0.20 (0.008)
M
H A–B
D
S
S
D
0.20 (0.008)
M
M
C A–B
D
S
S
DETAIL C
SECTION B–B
VIEW ROTATED 90 _CLOCKWISE
C E
–H–
–C–
SEATING
PLANE
H
M
G
DATUM
PLANE
0.01 (0.004)
U
T
R
–H–
DATUM
PLANE
K
X
DETAIL C
MOTOROLA ANALOG IC DEVICE DATA
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
X
MILLIMETERS
MIN
MAX
6.95
7.10
6.95
7.10
1.40
1.60
0.273
0.373
1.30
1.50
0.273
–––
0.80 BSC
–––
0.20
0.119
0.197
0.33
0.57
5.6 REF
6_
8_
0.119
0.135
0.40 BSC
5_
10_
0.15
0.25
8.85
9.15
0.15
0.25
5_
11_
8.85
9.15
1.00 REF
INCHES
MIN
MAX
0.274
0.280
0.274
0.280
0.055
0.063
0.010
0.015
0.051
0.059
0.010
–––
0.031 BSC
–––
0.008
0.005
0.008
0.013
0.022
0.220 REF
6_
8_
0.005
0.005
0.016 BSC
5_
10_
0.006
0.010
0.348
0.360
0.006
0.010
5_
11_
0.348
0.360
0.039 REF
13–23
T SUFFIX
CASE 894-03
Plastic Package
(23-Pin SZIP)
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF
THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
1
23
C
E
B
–N–
L
U
K
Y
P
F
V
M
S
H
A
R
W
–T–
23X
PIN 1
0.024 (0.610)
PIN 23
G
23X
D
0.010 (0.254)
13–24
M
T Q
J
SEATING
PLANE
S
N
M
T
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
U
V
W
Y
INCHES
MIN
MAX
0.684
0.694
1.183
1.193
0.175
0.179
0.026
0.031
0.058
0.062
0.165
0.175
0.050 BSC
0.169 BSC
0.014
0.020
0.625
0.639
0.770
0.790
0.148
0.152
0.148
0.152
0.390 BSC
0.416
0.424
0.157
0.167
0.105
0.115
0.868 REF
0.200 BSC
0.700
0.710
MILLIMETERS
MIN
MAX
17.374 17.627
30.048 30.302
4.445
4.547
0.660
0.787
1.473
1.574
4.191
4.445
1.270 BSC
4.293 BSC
0.356
0.508
15.875 16.231
19.558 20.066
3.760
3.861
3.760
3.861
9.906 BSC
10.566 10.770
3.988
4.242
2.667
2.921
22.047 REF
5.080 BSC
17.780 18.034
S
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 932–02
Plastic Package
(TQFP–48)
ISSUE D
1
48
P
4X
0.200 (0.008) AB T–U Z
9
DETAIL Y
A
A1
48
37
AE
1
AE
36
–T–
–U–
B
V
B1
12
25
13
V1
–T–, –U–, –Z–
DETAIL Y
24
–Z–
S1
M_
TOP & BOTTOM
S
R
4X
0.200 (0.008) AC T–U Z
GAUGE PLANE
0.250 (0.010)
C
E
0.080 (0.003) AC
G
–AB–
W
H
Q_
–AC–
AD
K
DETAIL AD
X
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
BASE METAL
N
J
F
D
0.080 (0.003)
M
AC T–U
S
Z
S
SECTION AE–AE
MOTOROLA ANALOG IC DEVICE DATA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.170
0.270
1.350
1.450
0.170
0.230
0.500 BASIC
0.050
0.150
0.090
0.200
0.500
0.700
12 _REF
0.090
0.160
0.250 BASIC
1_
5_
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.020 BASIC
0.002
0.006
0.004
0.008
0.020
0.028
12 _REF
0.004
0.006
0.010 BASIC
1_
5_
0.006
0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
13–25
D2T SUFFIX
CASE 936–03
Plastic Package
ISSUE B
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
3
TERMINAL 4
K
U
A
S
B
V
H
F
1
2
3
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
U
V
J
D
G
0.010 (0.254)
M
T
–T–
OPTIONAL
CHAMFER
E
C
M
L
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.051 REF
0.100 BSC
0.539
0.579
0.125 MAX
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
MILLIMETERS
MIN
MAX
9.804 10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.295 REF
2.540 BSC
13.691 14.707
3.175 MAX
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
P
N
R
D2T SUFFIX
CASE 936A–02
Plastic Package
(D2PAK)
ISSUE A
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
5
TERMINAL 6
U
A
V
S
K
B
H
1 2 3 4 5
DIM
A
B
C
D
E
G
H
K
L
M
N
P
R
S
U
V
D
0.010 (0.254)
M
T
G
–T–
OPTIONAL
CHAMFER
E
C
M
N
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.067 BSC
0.539
0.579
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
MILLIMETERS
MIN
MAX
9.804 10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.702 BSC
13.691 14.707
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
L
P
R
13–26
MOTOROLA ANALOG IC DEVICE DATA
20
DT, DTB SUFFIX
CASE 948E–02
Plastic Package
(TSSOP–20)
ISSUE A
1
20X
0.15 (0.006) T U
M
20
L/2
2X
K REF
0.10 (0.004)
S
T U
V
S
K
K1
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
S
J J1
11
B
L
PIN 1
IDENT
0.25 (0.010)
N
10
1
0.15 (0.006) T U
SECTION N–N
–U–
M
S
A
–V–
N
F
DETAIL E
C
G
D
–W–
H
0.100 (0.004)
–T– SEATING
DTB SUFFIX
16
CASE 948F–01
Plastic Package
(TSSOP–16, TSSOP–16L)
ISSUE O
1
16X K REF
0.10 (0.004)
M
T U
S
V
S
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
S
K
K1
2X
L/2
16
9
J1
B
–U–
L
SECTION N–N
J
PIN 1
IDENT.
8
1
S
M
A
–V–
N
F
DETAIL E
C
0.10 (0.004)
–T– SEATING
PLANE
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
–W–
H
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
N
0.25 (0.010)
0.15 (0.006) T U
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
DETAIL E
PLANE
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
G
DETAIL E
MOTOROLA ANALOG IC DEVICE DATA
13–27
DTB SUFFIX
CASE 948G–01
Plastic Package
(TSSOP–14)
ISSUE O
14
1
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
–V–
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
SECTION N–N
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
13–28
D
G
H
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948H–01
Plastic Package
ISSUE O
24
1
24X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
2X
24
L/2
B
–U–
L
PIN 1
IDENT.
12
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
13
S
A
–V–
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
C
0.10 (0.004)
–T– SEATING
PLANE
G
D
H
MILLIMETERS
MIN
MAX
7.70
7.90
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.303
0.311
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
–W–
DETAIL E
N
0.25 (0.010)
K
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
M
K1
J1
N
F
SECTION N–N
J
MOTOROLA ANALOG IC DEVICE DATA
DETAIL E
13–29
DTB SUFFIX
CASE 948J–01
Plastic Package
(TSSOP–8)
ISSUE O
8
1
0.15 (0.006) T U
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
K REF
8x
0.10 (0.004)
S
M
T U
V
S
S
K
2X
L/2
ÉÉ
ÇÇÇ
ÇÇÇ
ÉÉ
K1
8
5
J J1
B
–U–
L
PIN 1
IDENT.
SECTION N–N
4
1
N
0.25 (0.010)
0.15 (0.006) T U
S
A
–V–
M
N
F
DETAIL E
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
G
D
SEE DETAIL E
H
M SUFFIX
CASE 967–01
Plastic Package
(EIAJ–20)
ISSUE O
INCHES
MIN
MAX
0.114
0.122
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
1
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
11
Q1
E HE
1
M_
L
10
DETAIL P
Z
D
VIEW P
e
A
c
A1
b
0.13 (0.005)
MILLIMETERS
MIN
MAX
2.90
3.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
20
20
13–30
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.81
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.032
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 976–01
Plastic Package
(TQFP–20)
ISSUE O
20
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
1
4X
9
0.200 (0.008) AB T–U Z
A
A1
20
DETAIL Y
16
15
1
–T–
–U–
V
B1
V1
11
5
6
10
–Z–
S1
MILLIMETERS
MIN
MAX
4.000 BSC
2.000 BSC
4.000 BSC
2.000 BSC
1.400
1.600
0.170
0.270
1.350
1.450
0.170
0.230
0.650 BSC
0.050
0.150
0.090
0.200
0.500
0.700
12_REF
0.090
0.160
0.250 BSC
1_
5_
0.150
0.250
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
B
S
4X
0.200 (0.008) AB T–U Z
DETAIL AD
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
J
–AB–
INCHES
MIN
MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.026 BSC
0.002
0.006
0.004
0.008
0.020
0.028
12 _REF
0.004
0.006
0.010 BSC
1_
5_
0.006
0.010
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
–AC–
N
F
D
0.080 (0.003) AC
0.080 (0.003)
M_
S
AC T–U
S
Z
S
SECTION AE–AE
TOP & BOTTOM
R
–T–, –U–, –Z–
C E
AE
W
H
K
X
DETAIL AD
MOTOROLA ANALOG IC DEVICE DATA
Q_
AE
GAUGE
PLANE
0.250 (0.010)
G
DETAIL Y
13–31
FTA SUFFIX
CASE 977–01
Plastic Package
ISSUE O
24
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
1
4X
9
0.200 (0.008) AB T–U Z
A
A1
24
–T–
DETAIL Y
19
18
1
–U–
V
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
B
V1
13
6
B1
12
7
–Z–
S1
S
4X
0.200 (0.008) AB T–U Z
MILLIMETERS
MIN
MAX
4.000 BSC
2.000 BSC
4.000 BSC
2.000 BSC
1.400
1.600
0.170
0.270
1.350
1.450
0.170
0.230
0.500 BSC
0.050
0.150
0.090
0.200
0.500
0.700
12_REF
0.090
0.160
0.250 BSC
1_
5_
0.150
0.250
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.020 BSC
0.002
0.006
0.004
0.008
0.020
0.028
12 _REF
0.004
0.006
0.010 BSC
1_
5_
0.006
0.010
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
DETAIL AD
–T–, –U–, –Z–
–AB–
–AC–
AE
AE
0.080 (0.003) AC
M_
TOP & BOTTOM
R
C E
J
W
H
K
X
Q_
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
P
G
DETAIL Y
N
F
GAUGE
PLANE
D
0.250 (0.010)
0.080 (0.003)
S
AC T–U
S
Z
S
DETAIL AD
SECTION AE–AE
13–32
MOTOROLA ANALOG IC DEVICE DATA
N SUFFIX
CASE 1212–01
Plastic Package
(SOT–23)
ISSUE O
1
A
B
D
5
E
A2
0.05 S
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DATUM C IS A SEATING PLANE.
A1
4
1
2
L
3
E1
L1
B
C
5X
0.10
C B
M
A
S
C
S
e
e1
H SUFFIX
CASE 1213–01
Plastic Package
(SOT–89)
ISSUE O
DIM
A1
A2
B
C
D
E
E1
e
e1
L
L1
MILLIMETERS
MIN
MAX
0.00
0.10
1.00
1.30
0.30
0.50
0.10
0.25
2.80
3.00
2.50
3.10
1.50
1.80
0.95 BSC
1.90 BSC
0.20
–––
0.45
0.75
1
A
D
A2
C
B
D1
E1
E
L1
B
0.10
B1
e
M
C B
S
A
S
2X
0.10
M
C B
S
A
S
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCING
PER ASME Y14.5M, 1994.
3. DATUM C IS A SEATING PLANE.
DIM
A2
B
B1
C
D
D1
E
E1
e
e1
L1
MILLIMETERS
MIN
MAX
1.40
1.60
0.37
0.57
0.32
0.52
0.30
0.50
4.40
4.60
1.50
1.70
–––
4.25
2.40
2.60
1.50 BSC
3.00 BSC
0.80
–––
e1
MOTOROLA ANALOG IC DEVICE DATA
13–33

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