Eurotronics advanced PCB capabilities Datasheet

SPECIALIZED COMPETENCES
What are the core competences of Eurotronics?
A lot of customers choose Eurotronics as a total solution provider for the entire printed circuit board production process. This allows them to
gain time, cut costs and minimize risks.
How does Eurotronics stand out?
In the more than twenty five years of its existence, Eurotronics has built up a broad range of knowledge and experience in the field of printed
circuit board manufacturing. The advantage is that Eurotronics has established a long term representational relationship with one of the
finest state-of-the-art manufacturing facilities, China Eagle Electronics, situated in China. Our multidisciplinary team of technical and
commercial experts strives to quickly find the most creative and pragmatic solutions. Our goal is to always create an added value for your
product by providing constant quality and delivery performance.
In which fields/markets is Eurotronics represented?
Eurotronics has executed projects in, amongst others, the following fields/markets: Renewable energy, Electric Drive, Automotive, Medical
field, Communication, Broadcast equipment, Satellite Navigation (for aviation, agriculture and container placement etc.), Sports and leisure.
How does the cooperation with Eurotronics work?
Whether it concerns production, engineering or services, Eurotronics always creates a suitable addition to the existing customer capacity.
Customers will submit the command and quality control over the total production process to Eurotronics because knowledge, experience and
control sometimes have shortcomings internally.
What is our procedure?
Eurotronics screens every project for feasibility, technical completeness/accuracy and manufacturability. (Design for Manufacturability)
Where/if necessary, alternatives can be developed and discussed with the customer. Based on the final analyses, the production method is
selected and our engineers execute a final check to eliminate possible discrepancies with the actual production process. Eurotronics is used
to cooperating with product, purchasing, R&D and project managers as well as engineers and management, and has developed a reliable
communication.
What is the lead time for production of a printed circuit board?
This depends of course on many circumstances, such as the availability of the laminates and the complexity of the printed circuit board (for
example the number of pressing cycles). On average, production and delivery of a batch of printed circuit boards will take from 2 to 6 weeks.
Prototypes can be delivered to your warehouse from 10 working days. To manage all this properly, refinement of our logistical system is
essential. Therefore, we have a thorough communication with our logistic services in Asia and Europe and they too are constantly being
monitored and evaluated.
Which technologies does Eurotronics apply?
For the production of your printed circuit boards, Eurotronics implements the most common as well as the most complex technologies: ‘Blind
and Buried’ via technology, High Density Interconnect technology, Rigid Flex, Ultra Fine Line technology, Laser drilling, Controlled Impedance
etc.
How are the manufacturing processes guaranteed?
Eurotronics attaches great value to transparent and thorough production monitoring of the factory automation system, which enables us to
closely follow-up each step in the production process. This is why we require strict compliance to the IPC criteria for base materials. Each
outgoing batch is accompanied by a written quality report, based on the general IPC standards. Furthermore, your designs are protected by
non-disclosure agreements. You can also rest assured the environment and the human rights are being respected.
How does Eurotronics guarantee the quality?
The outgoing inspection at the factory is the incoming inspection for our customers. Eurotronics takes full responsibility for this and has
guaranteed its quality by, amongst others, ISO 9001, ISO14001,UL ,IPC-TM-650 Class 2, IPC-2615 Class 2 for dimensions and tolerances,
IPC-A-600 Class 2 for delivery and, at explicit request, we can even guarantee IPC Class 3 for qualification and performance, as well as for
delivery.
Our production facilities are certified with a green label and apply the latest directions on RoHS and REACH.
How far does the international experience of Eurotronics go?
Eurotronics has customers in high technology niche markets throughout Europe, who distribute their products worldwide. By doing so, we
have a lot of experience and knowledge of international guidelines and demands on the fields of transportation, packaging, production etc.
Which volumes can Eurotronics handle?
The assignments Eurotronics executes vary in volume from a few prototypes to mass production.
Can Eurotronics also run/manage my stock?
In addition to production, Eurotronics offers optimized services in the field of logistics, transportation and stock control.
Grote Hondstraat 32, B-2018 Antwerpen - Belgium
[email protected]
www.eurotronics.be
+32 3 281 1699
MULTI LAYERS
General
General capabilitiescapabilities- Multilayer
Multilayer
Eurotronics' technical and production capabilities have kept pace with the ever growing demands due to product design, processor speed requirements, component scaling, increased thermal performance... all
pushing towards cutting edge Printed Circuit technologies.
General capabilities- Multilayer
2015
Max. Layer Count
30
Max. Finished Thickness
5.0mm
Max. Production Panel Size
609.60mm x 685.80mm
Min. Thickness Core
Max. Copper Thickness (depending
on the line & space requirements)
Min. Line Width
Min. Line Space
3mil (76.20μm)
Inner Layer
6Oz (210μm)
Outer Layer
6Oz (210μm)
Inner Layer
2.5mil (63.5μm)
Outer Layer
2.7mil (68.50μm)
Inner Layer
2.5mil (63.5μm)
Outer Layer
3mil (76.20μm)
Impedance Control Tolerance
Partial hybrid + embedded copper coin
Partial Hybrid +Embedded copper coin
Partial Hybrid +Embedded copper coin
7%
Min. PTH (Mechanical) - Depending on Aspect Ratio
Max. Aspect Ratio (Mechanical Drill)
0.15mm
10:1
Min.Laser Drill Size
Partial Hybrid +Embedded copper coin
3mil (76.2μm)
Max. Aspect Ratio (Laser Drill)
1:1
Solder Mask Clearance
+/-20μm
Solder Mask Registration
40μm
ENIG (NiAu), OSP, ENIG+OSP, Immersion Tin, Immersion Silver, Lead Free HASL, HASL, Gold
Finger Plating, Selective Hard Gold, Soft Gold, Flash Gold
Surface Finishing
Press-fit copper coin
Press-fit copper coin
Press-fit copper coin
Advanced
Embedded Capacitance
3M:C-PLY14, 19C-PLY14;Faradflex:BC24, BC12TM;Dupont:HK4
High Layer Count + HDI
YES
High Layer Count + HDI + GF
YES
Thermal Management
Hybrid Stack-up
Normal Tg
Middle Tg
Material*
High Tg
www.founderpcb.com
Halogen Free
Low Dk/Df
Press-fit copper coin
Embedded Copper Coin, Press-fit Copper Coin, Metal Base, Heavy Copper
YES (Rogers RO4000 series + FR4)
KB6160A, S1141, NP-140
IT158, S1000, TU662, NP-155FTL,
IT180A, S1000-2, 370HR, 370Turbo, IS-FR406, NP-175FTL, TU768
Stagger Fingger
IT140G, IT150G, R1566, MCL-BE-67G, S1155
RO4350B, RO3003, RO3006, N4000-13(SI), N4000-13EP(SI), ARLON TC350
Stagger Fingger
*On request we can provide almost any type of special material on the market
www.founderpcb.com
Stagged gold fingers
Stagger Fingger
www.founderpcb.com
Grote Hondstraat 32, B-2018 Antwerpen - Belgium
[email protected]
www.eurotronics.be
+32 3 281 1699
HIGH DENSITY INTERCONNECT (HDI)
eneral
capabilitiesGeneral
capabilitiesHDI
General
capabilities-HDI
HDI
Due to continuous investment in developing world-class fine-line microvia technology, together with our partner manufacturing facility Eurotronics has become a well known microvia board provider. Our creativity,
experience and commitment to provide a complete solution for our customers helps to resolve early design issues, shorten lead time, and provide a high quality cost effective product. Our HDI-substrates can be
found mainly in applications where high reliability is of crucial importance.
2015
Max. Layer Count
20
Max. Finished Thickness
2.6mm
Min. Finished Thickness
0.3mm
Min. Thickness Core
50μm
Min. Line Width
50.8μm
Min. Line Space
50.8μm
Impedance Control Tolerance
7%
Min. Micro Via Design
50/228μm
Min. Finished Through Via Size
0.1mm
Max. Aspect Ratio Laser Drill Via Hole
0.8:1
Max. Aspect Ratio PTH
10:1
Min. BGA Pitch
0.35mm
Layer To Layer Registration Tolerance
+/-50μm
Solder Mask Clearance
+/-20μm
Solder Mask Registration
40μm
ELIC Level
14 Layers
Surface Finishing
Advanced
ENIG (NiAu), OSP, ENIG+OSP, Immersion Tin, Immersion Silver
Copper Filling
YES
VOP Stack Via Design
YES
Any Layer
YES
Extensive Modular Edge PTH
YES
Carbon Ink Technique
YES
Embedded ESD
YES
Middle Tg
High Tg
Material
www.founderpcb.com
Three step HDI
Halogen Free
RCC
VOP + FV
IT158, EM825, S1000 H, TU662, NP-155FTL,
IT180A, S1000-2, S1170, EM320
EM825
LG LGF-2000G/LGF-2000GA LG LGF-2000/LGF-2000HF, MITSUI MR500, MATSUSHITA R-0880
ELIC structure
www.founderpcb.com
w.founderpcb.com
Grote Hondstraat 32, B-2018 Antwerpen - Belgium
[email protected]
www.eurotronics.be
+32 3 281 1699
BACKPLANES & HIGH LAYER COUNT
l capabilities-Backplane&HLC
Whether a customer needs passive, active or high-bandwidth backplanes,... We are dedicated to provide backplane and high layer count circuit solutions that deliver high-speed performance, value and reliability.
2015
Max. Layer Count
48
Max. Finished Thickness
8.0mm
Max. Production Panel Size
609.60mm x 914.40mm
Min. Thickness Core
Max. Copper Thickness (depending
on the line & space requirements)
Min. Line Width
Min. Line Space
3mil (76.20μm)
Inner Layer
6Oz (210μm)
Outer Layer
6Oz (210μm)
Inner Layer
2.5mil (63.5μm)
Outer Layer
2.7mil (68.50μm)
Inner Layer
2.5mil (63.5μm)
Outer Layer
3mil (76.20μm)
Impedance Control Tolerance
7%
Min. PTH (Mechanical) - Depending on Aspect Ratio
Max. Aspect Ratio (Mechanical Drill)
10:1
Min.Laser Drill Size
4mil (101,6μm)
Max. Aspect Ratio (Laser Drill)
1:1
ENIG (NiAu), OSP, ENIG+OSP, Immersion Tin, Immersion Silver, Lead Free HASL, HASL, Gold
Finger Plating, Selective Hard Gold, Soft Gold, Flash Gold
Surface Finishing
Advanced
Embedded Capacitance
Middle Tg
High Tg
Material
0.15mm
Halogen Free
Low Dk/Df
3M:C-PLY14, 19C-PLY14;Faradflex:BC24, BC12TM;Dupont:HK4
IT158, S1000-2, TU662, NP-155FTL
IT180A, S1000-2, 370HR, 370Turbo, IS-FR406, NP-175FTL, TU768
IT140G, IT150G, R1566, MCL-BE-67G, S1155
IS415, N4000-13(SI), N4000-13EP(SI), FR408HR, Megtron4, Megtron6, T150D, IT150DA,
IT200LK, RO4350B
Backplane 34 layers
m
Grote Hondstraat 32, B-2018 Antwerpen - Belgium
[email protected]
www.eurotronics.be
+32 3 281 1699
FLEXIBLE & RIGID FLEX
Early involvement in the design stage of your flexible circuitry is crucial. We support our customers with the right selection of base materials and production methodes to maximize performance and durability with
the most cost effective advantages. On special request, we can even provide an assembled end product!
2015
FCCL
Adhesiveless: Dupont Pyralux AC,AP, AK; Doosan, Panasonic
Adhesive: Dupont FP, LF
Coverlay
Acrylic: Dupont FR, LF
Adhesive
Material
FR4 (High Tg)
Pre-Preg
Acrylic: Dupont FR, LF
TUC TU-862, TU722; EMC EM-370(D), EMC EM285, ITEQ IT180A, Shengyi S1000-2
Normal Pre-Preg: TU-72P, TU-86P, E-37B(D), EM-285B, ITEQ, Shengyi
No/Low Flow Pre-Preg: TU-84P, Doosan, ITEQ, Shengyi
Shielding Film
Stiffener
Tatsuta, Toyo
PTFE
Panel Dimensions
Arlon AD255A (Immersion Ag)
PI, FR4, Stainless steel, Aluminum, Ceramic
Arlon AD255A
Standard
Large
Panel Size
304.80mm x 500.38mm
500.38mm x 609.60mm
Active Area
279.40mm x 474.98mm
474.98mm x 584.20mm
Minimum Unit Size
6.35mm x 6.35mm
FLEXIBLE PRINTED CIRUITS (FPC)
Max. Layer Count
14
Max. Finished Thickness
1.6mm
Min. Dielectric Thickness
Inner Layer**
Outer Layer***
25μm (Standard); 12.5μm (Advanced)
Line
1.5mil (38μm)
Spacing
1.5mil (38μm)
Line
1.5mil (38μm)
Spacing
1.5mil (38μm)
7 Layer Rigid Flex with "Bikini Technology" and NiAu finish for
Al wirebonding
Grote Hondstraat 32, B-2018 Antwerpen - Belgium
[email protected]
www.eurotronics.be
+32 3 281 1699
FLEXIBLE & RIGID FLEX
RIGID FLEX PRINTED CIRUITS (RFPC)
Max. Layer Count
16
Max. Finished Thickness
Standard 1.6mm; Advanced 2.4mm
Min. Dielectric Thickness
Inner Layer**
Outer Layer***
25μm (Standard); 12.5μm (Advanced)
Line
1.5mil (38μm)
Spacing
1.5mil (38μm)
Line
2mil (50.8μm)
Spacing
Design
2mil (50.8μm)
Symmetric/Asymmetric stack-up; 1-F-1; 2-F-2; 3-F-3, 0.4mm BGA,ELIC
Dielectric Thickness
Minimum Hole Size (FPC)
<2mil (50.8μm)
Standard: 6mil (152.4μm), Advanced 4mil (101.6μm) - Mechanincal Drilled
<63mil (1.6mm)
Standard: 8mil (203.2μm)), Advanced 6mil (152.4μm) - Mechanincal Drilled
Aspect Ratio (By drilled hole size)
Minimum Pad Size
Standard: 3mil (76.20μm), Advanced 2mil (50.8μm) - Laser Drilled
<24mil (609.6μm)
Double sided flex + 6 layer rigid
10:1 (Standard); 14:1 (Advanced)
Outer Layer
8mil (203.2μm)
Inner Layer
8mil (203.2μm)
Inner Layer Anti-Pad
14mil (355.6μm)
Blind & Buried Via's
Filled Micro Via's
Micro Via Technology
Solder mask, Resin, Copper
POFV
ELIC Level
Back Drilling
12 layers
D+8 (tolerance depends on the design)
Solder Mask Dam
Standard: 3mil (76.20μm), Advanced 2mil (50.8μm)
Solder Mask Registration
Standard: 3mil (76.20μm), Advanced 2mil (50.8μm)
Surface Finishing
Impedance Control Tolerance
ENIG (NiAu), ENEPIG, OSP, ENIG+OSP, Immersion Silver, Gold Finger Plating, Selective Hard Gold
10% (5% achievable after process tuning)
**Applicable on 18μm base copper, without copper plating
***Outer layer spacing depends on the actual design, via filling, track width
RFPC with micro via technology
Grote Hondstraat 32, B-2018 Antwerpen - Belgium
[email protected]
www.eurotronics.be
+32 3 281 1699