Toppan Photomasks, Inc. Company Presentation

Toppan Photomasks
More than Masks
TOP PAN PR IN TIN G CO., LTD
ELECTR ON I CS DI VI S I ON
©TOPPAN CONFIDENTIAL
Outline
• Mask Market evolution
• Toppan Photomasks Offering
• What more does Toppan do
• How can we help ?
Changing semicon industry …
1980’s
2010’s
Large, vertically integrated OEM’s
Specialized Producers
DRAM
Microprocessor
Advanced
Analog
Design
Houses
Flash
MEMs
Foundry
3
Specialty
Foundry
…requiring specialized
Photomask Solutions
~50% WW mask units sustain @
>=180nm
More Moore is not the only route to a sustainable business model for our customers
Source: VLSI Research
©TOPPAN CONFIDENTIAL
... But >60% mask $$ <=45nm
AND
-mask market is only ~1% of semiconductor market
- + today mask litho tools around 15x LESS unit throughput (20nm) vs eg 500nm
Source: VLSI Research
©TOPPAN CONFIDENTIAL
Implications for Mask Makers
• Need to invest and be good at More Moore
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–
•
Need also to support and be good at More than Moore
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–
•
support standard analog, automotive, fast growing more than
more segments
Generate sustainable levels of maskshop utilisation (unit
volume)
Do both globally
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–
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Support customer roadmaps & industry
Secure future revenue
Support customer global manufacturing/marketing strategy
Gain critical mass for sustainable business model
Not many companies have the ability to do all 3
Number of Mask Suppliers
60
Merchants
Captives
50
40
30
20
10
1985
1990
1995
2000
2005
2010
Internal company estimate
•This trend likely to continue
•Mask engagement model and supplier selection are
strategic decisions
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©TOPPAN CONFIDENTIAL
Toppan is the world’s most global
mask partner
Dresden, Germany
Corbeil, France
Round Rock, TX
Moscow
Shanghai, China
Santa Clara, CA
Burlington, VT
Ichon, Korea
Shiga, Japan
Asaka, Japan
Hsinchu, Taiwan
Manufacturing Sites
R&D Sites
JDP with IBM
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•Advanced and standard volume
production in each region
Of course, full range of mask technologies and
formats are required …
T OP PAN products
Toppan produces all these and more in Europe
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©TOPPAN CONFIDENTIAL
.. But Toppan doesn’t just make masks
Semiconductor Business
LSI
Image Sensor
On Chip Color Filters
Display Business
LSI Design
Liquid Crystal Display
Photomasks
Color Filters
Anti-reflection Films
Touch Panel
Printed Wiring FC-BGA
Boards
Substrates
Lead
Frames
Touch Sensors
Functional Product and Energy Related Business
Lithium-ion battery
packaging materials
Solar Cell Back Sheet
Transparent Barrier Film:
”GL Film”
We also buy chips to laminate
into E-passports and smartcards
Synthetic Paper ：
Teslin
（PPG：USA)
&
Toppan Special
Adhesive
Final
Configuration
Etched Aluminum
Antenna Sheet
IC + Protection Foil
2 covers per sheet
( 3 covers per sheet in the US )
Surface Cover Cloth
with
Toppan Special
Cover Adhesive
Teslin
Cover Cloth
…. And design chips too..
Toppan Technical Design Center Co.,ltd.
Number of engineers is 280 persons.
Hokkaido Design
Center
--- Analog engineers is 150 persons(50%).
Asaka Design Center
Fukuoka Design Center
Kyoto Design Center
：Analog design
Location
… or assist with customers chip
finishing & litho engineering..
Design Layout
Design
Verification
• Design Rule Checking (DRC)
• Lithography Rule Checking (DFM)
Mask Design
• Automated Multi-Project Wafer (MPW) layout
• Frame Generation
Litho Design
• Illuminator optimization (source shape, NA, sigma)
• Mask options (bias, phase, sub-resolution assist
features)
OPC
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• Test pattern design
• Gray-scale mask design
• OPC model calibration & recipe optimization
• OPC application to product data
Sample Applications
Technology
node ramp
Production
outsource
Derivative layers
IP protection
Silicon photonics
& MEMS
• Lithography selection and setup
• Lithography engineering and OPC
• OPC and mask design
• Extended design rule support for standard processes
• Custom layers
• IP firewall between designer and foundry
• Half-tone gray-scale mask design for shaped resist
applications
.. Or special lithography applications
eg Half-tone Gray-scale Lithography
Arrays of sub-resolution
patterns of varying size or
pitch transmit light as a
function of clear mask area
Transmittance
Dissolution Rate
Systematically varying size or
pitch produces predictable
2D illumination patterns
Tuning half-tone pattern to
resist exposure and
dissolution characteristics
makes it possible to predict
desired resist profile
Clear feature Size
Best MEMS-MOEMS paper award at 2012 Photonics West
Clear feature Size
On chip Color Filters and µlens
design and application

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On-chip color filter is indispensable for CCD and CMOS image
sensors for small size display devices to provide color images.
Early
on R&D
each

Color filter of red, green and blue (RGB) is directly formed
of the phototransistors generated on a silicon wafer.

Toppan's OCF has won a high reputation for its own color
reproduction and fine fabrication technologies developed by
printing technology.
©TOPPAN CONFIDENTIAL
Transm ittance (%)
Spectral
response
is Spectral
tunable toResponse
Samples
of RGB
customer need/reference
100%
90%
80%
G R (>3.0um pitch) t=0.8um
G R (>1.75um pitch) t=0.8um
70%
G R (1.4um pitch) t=0.85um
G R (1.4um pitch) t=0.8um
60%
R E (>3.0um pitch) t=1.1um
R E (>1.75um pitch) t=0.8um
50%
R E (1.4um pitch) t=0.7um
B L (>3.0um pitch) t=1.15um
40%
B L (>1.75um pitch) t=0.8um
B L (1.4um pitch) t=0.6um
30%
20%
10%
0%
400
450
Toppan Confidential
500
550
W avelength (nm )
600
650
700
CFA & MLA for fine pitch pixels – 1.1um 20120629 update
Lens shape and form factor programmable
Using grey-scale masks and proprietary process
Lens　Type
D ouble-Lens
N ew -EB L
C onventional-EB L
SEM
1.4um size
1.4um size
2.2um size
cross‐
sectionalshape(im age)
C ellsize
1.4～4.0um
0.9～4.0um
＞2.2um
Lens gap（
diagonal.）
0.2～0.35um
0.1～0.35um
0.6～1.0um
Lens shape
sphericallens
sphericallens
asphericallens
≧95%
≧95%
≧95%
▲
○
○
area ratio
spectralsensitivity ratio （
B /G ,R /G ）
Hi vol to hi-end advanced
Flip chip package design and production
Game Consoles
Automotive
Computer (CPU)
HVM
Applications
Substrate
Spec
31mmSQ
2-2-2
C4 Pitch: 198um
35mmSQ
2-2-2
C4 Pitch: 169um
42.5mmSQ
3-2-3
C4 Pitch: 180um
<Current cutting edge item>
Structure
Size
Via structure
Line/Space
C4 Bump count
Die size
:
:
:
:
:
:
10,929 bump
10,929 bump
7-4-7
60.0×42.5mm
4 stack(L1-L5)
15um
10,929bump /Die
20x15 mm x 2 Die
Line
15um
27mmSQ
2-2-2
C4 Pitch: 226um
Cross section view
4 Stack
27mmSQ
3-2-3
C4 pitchi: 180um
40mmSQ
4-4-4
C4 Pitch: 179um
Toppan and Russia
• Multi-year commercial engagement in Russian market
• Significant accumulated experience in logistics and export control
• All mask types/technologies manufactured in Europe
• Multiple direct daily flights to Moscow
• Vast experience in “More than Moore” mask applications and
optimisation
• Global stability, local flexibility
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Summary
• Toppan is a committed partner to Russian semiconductor industry
• A range of leading technologies and support available
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Europe’s most advanced mask facility in Dresden
Volume standard production in Corbeil France
Full lithography optimisation service
OPC support from process refining to full design
Design support to fabless/foundry
Colour filter and µlens for CIS
Chip packaging
• We would be delighted to provide further information on any of
these that could be of interest to you.
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Please Contact Us
• For any of your product or service needs or any enquiries
• Wolfgang Stamp
– [email protected]
– +49 171 556 4930
• Adrian Phillips
– [email protected]
– +44 771 882 5647
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Thank You!
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©TOPPAN CONFIDENTIAL