DDR2-533

DDR2 Production Readiness
Geof Findley
Strategic Business Manager
Intel Corporation
Platform Memory Operations
Guest Speaker: Mike Seibert, Micron
Technology, Inc.
Feb 17, 2004
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
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INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products
are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to
change without notice.
Intel processors, chipsets, desktop boards may contain design defects or errors known as errata, which may
cause the product to deviate from published specifications. Current characterized errata are available on
request.
Wireless connectivity and some features may require you to purchase additional software, services or external
hardware. Availability of public wireless LAN access points limited. System performance measured by
MobileMark* 2002. System performance, battery life, wireless performance and functionality will vary
depending on your specific hardware and software configurations. See
http://www.intel.com/products/centrino/more_info for more information.
System performance measured by MobileMark* 2002. System performance, battery life, wireless performance and
functionality will vary depending on your specific hardware and software configurations. See
http://www.intel.com/products/centrino/more_info for more information.
Intel® and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
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*Other names and brands may be claimed as the property of others.
Copyright © 2004 Intel Corporation.
Agenda
Intel Platform Memory Roadmap
DDR2 400/533 Status
Benefits by Segment
Production Readiness
DDR2 667/800 Status
Summary
[Mark] is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States or other countries
Intel Platform Memory Technology Roadmap
DDR3
DDR3
DDR2
DDR
RDRAM*
DDR2 400/533
DDR266
PC800
SDRAM
FB-DIMM
DDR2 667/800
DDR333/400
PC1066
PC133
2005
2004
2006
2005
y DDR2 400/533 support in all main IA segments in 2004
– with DDR flexibility
y FB-DIMM new server interconnect in 2005
– see class for more details
y Low Power SDRAM moving to low power DDR
y RDRAM* memory used in networking applications
*Other names and brands may be claimed as the property of others
DDR2 400/533 Enabling Status
DDR2 400/533
Feasibility Init Spec Prototype
Final Spec
Evaluation
Validation
Ramp
Validated
y DDR2 400/533 is ready for production
– Intel validated all major DRAM suppliers
– Intel validated modules for desktop, servers, and
validating modules for mobile
U S H o m e | In te l W orld w id e
H a rd w a re D e sig n
D e sig n C o m p o n e n ts & P ro d u cts
W here to B u y | T ra in in g & E ve n ts | C o n ta ct U s | A b o u t In te l
In te l® P la tfo rm M e m o ry
D R A M C o m p o n e n t V alid a tio n R e sults
T his in fo rm a tio n is p ro vid ed a s a guid e to co m p o n e n t c o m p lia n ce . T his te stin g is n o t in te n d ed to re pla ce th e n o rm a l O E M
co m p o n e n t q u a lific a tion p ro ce ss . In tel e n c o ura g e s m e m o ry su p p lie rs to v alid a te th eir fa ste st s p e e d /la ten cy co m p o n e n t. T h e
slo w e r sp e e d /la te n cy co m p o n e n ts u sin g th e sa m e d ie re visio n a s th e liste d fa s t c o m p o n e n t m a y n o t b e e xp licitly liste d in this
ta b le . T his d o e s n ot p re clu d e th e slo w e r co m p o n e n ts fro m b e in g su b m itte d in m e m o ry m o d u le s for te sting if th e co m p o n e n t
h a s p a ss e d te stin g an d h a s be e n lis te d in this ta b le a t the fa ste st sp e e d /late n cy. P le a s e co n ta ct th e s u pp lie r dire ctly to ob tain
in form a tio n re ga rdin g th e corre spo n din g slo w e r s p e e d/la te n cy pa rts.
T h e fo llo win g D D R 2 5 33 /40 0 S D R A M s h av e p as se d s up p lier c om po n e nt-lev e l v a lid atio n:
V a lid a ted D D R 2 5 3 3 S D R A M C o m p o n e n ts
S u p p lie r
P a rt N u m b e r
D e n s ity
W id th
L a te n c y
C L -tR C D -tR P
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C o m po nent
D a te C o d e
E lp id a
E D E 5 1 0 8 A B S E -5 C
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K 4 T 5 1 1 6 3 Q B -G C D 5
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.
M ic ro n
M T 4 7 H 1 2 8 M 8 B T -3 7 E
Visit
Visithttp://developer.intel.com/technology/memory
http://developer.intel.com/technology/memory
for
forup
upto
todate
dateIntel
IntelValidation
Validationresults
resultsof
ofDDR2
DDR2
Comprehensive DDR2 System Validation
5
Extensive AC/DC parameter testing
To ensure compliant DRAM
Broad validation of DIMMS
To provide robust memory
5
Chipset specific collateral required
To enable a smooth transition
Thousands of systems evaluated
To provide reliable & stable operation
Intel
Intelis
isprepared
preparedfor
forthe
the
DDR2
DDR2400/533
400/533ramp
rampin
in2004
2004
5
DDR2 400/533 will Support High
Performance Mobile Platforms while
Improving Battery Life
150%
Power
Power relative to DDR 266
Power Consumption
125%
100%
ry ce
o
m an
Me orm
rf
Pe
75%
DDR 266 DDR 333
Relative power is based on IDD4R
DDR2
400
DDR2
533
DDR2 Provides
Enhanced Productivity
& Mobility
DDR2 400 Provides Better Server
Platform Capabilities
y Better performance
– ~20% higher peak bandwidth over
DDR333
y Lower power
– 38% less power over DDR333
important for blade and rack
servers
y Flexibility – Max of 4 DIMMs
per channel
– DDR333 max of 3 DIMMs per
channel
y Better board real estate
utilization & board cost
– ODT vs. on-baseboard
DDR2 533 Supported by Intel’s Next
Generation Desktop Chipset in 2004
Improved integrated video
& graphics
– More memory bandwidth
to support better media
playback experience and
3D performance on 3rd
generation integrated
graphics
Better simultaneous
computing
– More memory
bandwidth to support
threaded applications
& multitasking
Intel’s 2004 Chipsets Support both DDR
and DDR2
Intel Platform DDR & DDR2 Support
Intel Platform Memory Demand
100%
Grantsdale/Alderwood
DDR
DDR2
0%
Q1'04
Q2'04
Q3'04
Q4'04
Q1'05
Q2'05
Lindenhurst/Tumwater
Transition will be driven by price and
availability of DDR2
Flexible
FlexibleDDR2
DDR2transition
transitionexpected
expected
across
acrossall
allnew
newIA
IAplatforms
platforms
Alviso
Industry Ready for
DDR2 400/533
DDR2 Supply at Intel Platform Launch
DRAM
Registered DIMM
256Mb
512Mb
1Gb
256MB
512MB
1GB
Elpida
CS
v
ES
CS
v
v
Hynix
v
v
CS
v
v
v
CS
v
CS
CS
v
Micron
v
v
CS
v
Nanya
no plan
v
ES
v
v
CS
Supplier
Infineon
Samsung
Unbuffered DIMM
512MB
1GB
v
v
v
v
v
v
v
v
v
v
v
v
v
v
no plan
CS
CS
v
v
v
v
v
v
v
v
v
ES=Engineering Sample
CS=Customer Sample
Blank=ES not yet avail. at Intel Platform Launch
256MB
v=Mass Production Ready at Intel Platform Launch
The above is strictly provided from suppliers; Intel is not responsible for the content of this information.
For further details of DDR2 products, please contact them directly:
http://www.elpida.com/ddr2/
http://ddr2.hynix.com
http://www.infineon.com/ddr2
http://www.micron.com/products/dram/ddr2sdram/
http://www.ntc.com.tw
http://www.samsung.com/Products/Semiconductor/DRAM/index.htm
Module Manufactures Planning on being TTM
DDR2 667/800 Enabling Status
Feasibility Init Spec Prototype
Final Spec
Evaluation
Validation
667/800
y DDR2 667 spec in development
–
–
–
–
Additional ODT value
Improved AC timing values
Tighter AC/DC operating conditions
Modified PCB design
y DDR2 800 has technical challenges
– Evaluating improved AC timing values
– Analyzing signal integrity based on ranks per channel
Use
UseIntel
Intelvalidated
validatedmemory
memoryto
toensure
ensure
stable
stable&&reliable
reliableoperation
operation
Ramp
Conclusions
y DDR2 400/533 is ramping
y DDR2 offers improved bandwidth while lowering power
consumption and providing flexibility for servers
y All new Intel chipsets coming out in 2004 will support
DDR2
y Use Intel validated memory and chipset collaterals to
ensure stable & reliable operation
Please
Pleaseattend
attendother
othermemory
memoryrelated
relatedclasses
classes––FBFBDIMM
DIMMArchitecture,
Architecture,FB-DIMM
FB-DIMMDesign
Designand
and Enthusiast
Enthusiast
PC
PC––and
andthe
theMTE
MTEMemory
Memorynight
nighton
onWednesday
Wednesday
DDR2 Production…Ready
Mike Seibert
Strategic Marketing
Computing and Consumer Group
Micron Technology, Inc.
February 17, 2004
©2004 Micron Technology, Inc. All rights reserved. Information is subject to change without notice.
17
DDR2 Ramp Begins in 2004
y Silicon
–
–
–
–
1Gb
512Mb
256Mb
Now!
y Modules
–
–
–
–
18
Registered
Unbuffered
SODIMM
Now!
Driving a new PC Memory
y Open industry-standards
– JEDEC standards
yDRAM Specification
yPackage Registration
ySignaling
yModule Pinout
yModule Design
Specification
yModule Socket
yModule Reference
Designs
ySPD
yRegister and PLL
– Intel Spec Addendum
– Additional Intel-platform requirements
y Specification and Platform Validation Programs
y Multiple-sourced, compatible supply
19
Migrating from DDR to DDR2
Features/Options
DDR
DDR2
Package
TSOP
(66-pins)
FBGA only
Voltage
2.5V
2.5V I/O
1.8V
1.8V I/O
Reduces memory system power demand
Densities
128Mb –
1Gb
256Mb –
4Gb
High-density components enable large capacity
memory subsystems
Internal banks
4
4 and 8
1Gb and higher DDR2 devices will have 8 banks
for better performance
Pre-fetch
(MIN Write burst)
2
4
Speed (data pin)
200, 266, 333,
400 MHz
400, 533,
667 MHz
Read Latency
2, 2.5, 3 CLK
CL + AL
CL=(3, 4, 5)
Eliminating a ½ clock helps speed internal
DRAM logic, improves yields
N/A
AL options
(0,1,2,3,4)
Mainly used in server applications to improve
command bus efficiency
Additive Latency
(Posted CAS)
20
DDR2 Advantage
Enables Better electrical performance, speed
Reduced core speed dependency for better
yield
Migration to higher-speed I/O
Migrating from DDR to DDR2
Features/Options
DDR
DDR2
DDR2 Advantage
WRITE Latency
1 clock
Motherboard
READ Latency - 1
Improves command bus efficiency
ODT for both memory and
controller improves signaling,
Termination
Data Strobes
Modules
parallel to VTT
DRAM on-die
optional
Single ended
on motherboard
Differential or
184-pin
Unbuffered
Registered
200-pin
SODIMM
172-pin
MicroDIMM
DRAM I/O
No
MicroDIMM
Memory controller
Improved system timing margin by reduced
strobe crosstalk
Modules are the same length,
with added pins; DDR2 SODIMM is same
connector, different pinout as DDR
configured
Allows system to align pull-up/pull-down
drive strengths to nominal conditions;
feature not expected to be widely used
All desktops,
All desktops,
All major chipset providers
notebooks, servers
notebooks, servers
Calibration (OCD)
Chipset support
single ended
240-pin
Unbuffered
Registered
200-pin
SODIMM
244-pin
MiniDIMM
214-pin
and reduces system cost
21
Micron DDR2 Intel-Validation
Speed
Component
DDR2400
DDR2533
Module*
Unbf
Reg
SO
x4
256Mb
x8
x16
In Progress
In Progress
x4
512Mb
x8
x16
x4
1Gb
In Progress
x8
x16
In Progress
In Progress
* - At least one version of module type
22
In Progress
In Progress
In Progress
In Progress
DDR2 Overview
Improvements over DDR
– 60% higher
bandwidth DDR333
– Reduce system
power 50% or more
compared to DDR400
75
Delta Relative DDR333
y DDR2-533
DDR333
DDR400
50
DDR2-533
25
0
-25
-50
Data Rate
23
System Power
DDR2 Memory Advantage
Notebook
Server
Desktop
DDR2-533 vs. DDR333
DDR2-400 vs. DDR333
DDR2-533 vs. DDR400
Speed
y +60% DDR2-533
y Migration to
DDR2-667 = +100%
y +20% DDR2-400
y 15ns latencies
y +33% DDR2-533
y Migration to
DDR2-667 = +66%
Power
y 40% lower read
power at DDR2-533
y DDR2-400 even
lower
y 61% lower act-rd
power
y Reduced-power
Register and PLL
(can save 35%)
y Up to 60% lower
specified power
y Advantage in small
FF
Form
Factor
y 1Gb component
y DR, x8 standard
SODIMM
y Same dimensions
as PC2700 RDIMM
y 30mm height
(1.75mm lower profile)
y Same DIMM length
24
DDR2 Power
Measured Module Power Consumption:
SRx8 Registered DDR & DDR2
DDR400 & DDR2-400 server platforms, RST Jump Test
8.0
7.0
Power/Module (W)
6.0
59% Less
Power!
5.0
4.0
3.0
2.0
1.0
0.0
256Mb DDR
512Mb DDR
256Mb DDR2
512Mb DDR2
DRAM Technology
25
1Gb DDR2
Temperature at DRAM (C)
DDR2 vs. DDR Thermals
82
PC3200
62
DDR2 42% Lower
PC2700
42
PC2-3200
256Mb
22
0
0.5
1
2
3
Air Flow (m/s)
y Micron wind tunnel testing with 22°C ambient temp.
y DDR2 thermal advantage due to reduced power draw
26
Infrastructure
y Design Verification
– Models:
– DRAM component at www.micron.com
– Module .brd files or models at www.micron.com
– Debug tools
– Logic analyzer tools
– Agilent®
• FuturePlus
– Tektronix® TLA700
• Nexus NEXVu products
– Module testers
27
DDR2 Market Dynamics
y DDR2 market share by end of 2005
estimated at 38%, >70% by the end of 2007
Share of WW DRAM TAM
Share of WW DRAM TAM
Source: iSuppli 4Q04
DRAM
Tracker
Source:
iSuppli
4Q04 DRAM Tracker
100%
100%
90%
90%
Other
DDR2
>DDR2
80%
80%
70%
70%
60%
60%
50%
50%
40%
40%
30%
30%
20%
20%
DDR
DDR
SDRAM
FPM/EDO
10%
10%
RDRAM
SDRAM
0%
0%
3Q03 4Q03
1Q04 2004E
2Q04 3Q042005E
4Q04
2002A
2003E
28
1Q05
3Q05
2006E 2Q052007E
4Q05
New Technology Historical Pricing
Price Premium Multiples of New DRAM Technology
No Intel DDR CS
Intel DDR CS
16M EDO over FPM
2.0
Price Premium Multiple
64M SDR over EDO
128M DDR over SDR
1.5
DDR2 Range?
DDR Trend Line
1.0
0.5
1
2
3
4
5
6
7
8
Quarters of Usage In Desktop PCs
Historically,
Historically,premiums
premiumspersist
persistfor
forfirst
first66quarters
quartersof
ofnew
newtechnology
technology
©2004 De Dios and Associates. All rights reserved.
29
DRAM Infrastructure Comparison
EDO
SDR
DDR
DDR2
Fabrication
Existing
Existing
(3.3V)
0.21µm to 0.18µm
(2.5V)
0.13µm to 0.11µm
(1.8V)
Die size
No adder, included
on FPM die
No adder to EDO,
or less than
5-10% adder to
SDR
5-10% adder to
DDR
Component
Assembly
No package
change required:
Some TSOP
TSOP required
Add pins to
TSOP:
some FBGA
FBGA required
Component
Test
Existing testers
New test
infrastructure
Upgrade existing
New test
infrastructure
(>533MT/s)
Module
Design/Prod.
Little production
impact
Little production
impact
Little production
impact
Little production
impact
New
Newarchitectures
architecturesincrease
increasedie
diesize
sizeand
andtest
testcost
costmarginally
marginally
30
Platform Adoption of DDR2
Performance PCs and
Workstations
Higher Volume
Mid-Range Servers
Performance-Portable Notebooks
Re
du
cin
g
1H04
Entry-Level Servers
pr
e
mi
um
High-End Server
[FBDIMM]
Mainstream Desktops
and Notebooks
Value Desktops
and Notebooks
s
2H04
1H05
31
2H05
Micron Support
y Extensive website
– www.micron.com
– New information and tools being added
regularly
y Apps
– Local field application support to assist with
design-in, or product questions
y Self-qualification lab
– To provide a cost-effective, rapid path to
qualification of DDR2 components and
modules in your platform
32
Summary
y Production capacity rapidly expanding in 2004
– Micron will be in production with 3 densities of
components, and all modules that use them, at
system launch
y DDR2 offers more speed,
and less power
y DDR and DDR2 will compete for market share in
2004 and 2005. Micron is ready to supply our
customers with both technologies.
33
Round Tables for Innovation
Where: Level 2 – Alcoves across from Rooms 2018-2024
Immediately following Solution Keynotes
What: This is your chance to focus on relevant issues, compare notes with
colleagues, and gain insight from professionals who face similar challenges.
When: Tuesday 17th from 4:15 to 6:00pm
Topics:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Emerging worker models for the highly connected employee
Improving PC usability
IT Benchmarking Programs
Technology and Work/Life Balance
Internal IT Consulting Model
Managing wireless networks
Productivity/collaboration/eWorkforce
Capturing IT Business Value and ROI
Mobilized Software: Addressing Technology and Business Challenges Consistently
Creating Mobility Business Value in the Enterprise
Reducing Costs and Increasing Revenue with Secure WLAN Solutions
Achieving Competitive Advantages with Real-time Mobile Business Solutions
Collaborating with Mobility
Mobile Point of Care Solutions for Healthcare
RFID technologies transforming the Retail environment
Birds-of-a-Feather Lunch Discussions
y What:
Where:
Level
3 Foyer with
(NotIntel
in the
lunch area)
– Informal
lunch discussions
andmain
industry
technical experts on next-generation technologies, latest
Arrive
early
seating is limited
industry
standards
and–specifications
y When:
Wednesday 12PM – 1:30PM
802.11*
802.16*/ WiMax*
Server Manageability
Client Manageability
DMTF* Server Manageability
Working Group
IPMI (Intelligent Platform
Management Interface)
Thursday 12PM – 1:30PM
Enthusiast PC
Trusted Computing Group for More
Secure Computing
Extended Battery Life
Extensible Firmware Interface
(EFI )
Latin America Mobile/Data
Services
Advanced TCA*
Advanced Switching based on
PCI Express* Architecture
Connecting consumers in the
digital home
Ethernet in the Datacenter
Advanced Switching based on
PCI Express* Architecture