Intel Server Chassis SR1530 Intel Server System

Transcription

®
Intel Server Chassis SR1530
®
Intel Server System SR1530AH
Technical Product Specification
Intel order number D77400-002
Revision 1.0
November 2006
Enterprise Platforms and Services Division - Marketing
Revision History
Intel® Server Chassis SR1530
Intel® Server System SR1530AH
Revision History
Date
November 2006
Revision
Number
1.0
Modifications
Initial release.
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's
Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any
express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make
changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or
"undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
This document contains information on products in the design phase of development. Do not finalize a design with
this information. Revised information will be published when the product is available. Verify with your local sales office
that you have the latest datasheet before finalizing a design.
The server boards / chassis referenced in this document may contain design defects or errors known as errata which
may cause the product to deviate from published specifications. Current characterized errata are available on
request.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2006. All rights reserved.
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Revision 1.0
Table of Contents
Table of Contents
1.
2.
Introduction .......................................................................................................................... 1
1.1
Chassis Views ......................................................................................................... 1
1.2
Chassis Dimensions ................................................................................................ 1
1.3
System Components ............................................................................................... 2
1.4
System Boards ........................................................................................................ 3
1.4.1
Intel® Server System SR1530AHLX ........................................................................ 3
1.4.2
Intel® Server System SR1530AH............................................................................. 4
1.5
Hard Drive and Peripheral Bays .............................................................................. 4
1.6
System Cooling........................................................................................................ 5
1.7
Rack and Cabinet Mounting Options ....................................................................... 5
Power Sub-System............................................................................................................... 6
2.1
Mechanical Specifications ....................................................................................... 7
2.2
Airflow Requirements............................................................................................... 8
2.3
Acoustics ................................................................................................................. 8
2.4
Temperature ............................................................................................................ 9
2.5
Output Connectors................................................................................................... 9
2.5.1
P1 Main power connector ...................................................................................... 10
2.5.2
P2 Processor Power Connector ............................................................................ 10
2.5.3
HD Power Connector (P3) ..................................................................................... 11
2.5.4
Slimline Power Connector (P4).............................................................................. 11
2.6
2.6.1
AC Inlet Connector ................................................................................................ 11
AC Power Cord Specification Requirements ......................................................... 12
2.7
Marking and Identification...................................................................................... 12
2.8
AC Input Voltage.................................................................................................... 12
2.9
AC Line Transient Specification............................................................................. 13
2.10
Susceptibility.......................................................................................................... 13
2.10.1
Electrostatic Discharge Susceptibility .................................................................... 14
2.10.2
Fast Transient/Burst .............................................................................................. 14
2.10.3
Radiated Immunity................................................................................................. 14
2.10.4
Surge Immunity...................................................................................................... 14
2.11
AC Line Fast Transient (EFT) Specification .......................................................... 14
2.12
AC Line Dropout / Holdup...................................................................................... 15
Revision 1.0
iii
Table of Contents
Intel® Server System
SR1530AH
2.12.1
2.13
Power Recovery .................................................................................................... 15
2.13.1
Voltage Brown Out................................................................................................. 15
2.13.2
Voltage Interruptions.............................................................................................. 15
2.14
AC Line Inrush ....................................................................................................... 15
2.15
AC Line Isolation Requirements ............................................................................ 16
2.16
AC Line Leakage Current ...................................................................................... 16
2.17
AC Line Fuse ......................................................................................................... 16
2.18
Power Factor Correction........................................................................................ 16
2.19
Efficiency ............................................................................................................... 16
2.20
Grounding .............................................................................................................. 17
2.21
Remote Sense ....................................................................................................... 17
2.22
Output Power / Currents ........................................................................................ 17
2.22.1
Standby Outputs .................................................................................................... 17
2.22.2
Fan Operation in Stand-By Mode .......................................................................... 17
2.23
2.23.1
Voltage Regulation ................................................................................................ 18
Dynamic Loading ................................................................................................... 18
2.24
Capacitive Loading ................................................................................................ 19
2.25
Closed loop stability............................................................................................... 19
2.26
Common Mode Noise ............................................................................................ 19
2.27
Ripple / Noise ........................................................................................................ 19
2.28
Soft Starting ........................................................................................................... 20
2.29
Zero Load Stability Requirements ......................................................................... 20
2.30
Timing Requirements............................................................................................. 20
2.31
Residual Voltage Immunity in Standby mode ........................................................ 23
2.32
Protection Circuits.................................................................................................. 23
2.33
Over-Current Limit (OCP) .................................................................................... 23
2.34
Over-Voltage Protection (OVP) ............................................................................ 23
2.35
Over-Temperature Protection (OTP) .................................................................... 24
2.36
Control and Indicator Functions............................................................................. 24
2.37
PSON# Input Signal .............................................................................................. 24
2.38
PWOK (Power OK) Output Signal ......................................................................... 26
2.39
Environmental Requirements ................................................................................ 26
2.39.1
iv
AC Line 5VSB Holdup ........................................................................................... 15
Temperature .......................................................................................................... 26
Revision 1.0
3.
4.
2.39.2
Humidity................................................................................................................. 26
2.39.3
Altitude................................................................................................................... 26
2.39.4
Mechanical Shock.................................................................................................. 27
2.39.5
Random Vibration .................................................................................................. 27
2.39.6
Thermal Shock (Shipping) ..................................................................................... 27
2.39.7
Ecological Requirements ....................................................................................... 27
2.39.8
Catastrophic Failure............................................................................................... 27
Cooling Sub-System .......................................................................................................... 28
3.1
Power Supply Fans................................................................................................ 29
3.2
CPU Air Duct ......................................................................................................... 29
Peripheral and Hard Drive Support................................................................................... 30
4.1
4.1.1
4.2
4.2.1
5.
Table of Contents
Optical Drive Support............................................................................................. 30
Optical Drive Support............................................................................................. 31
Hard Disk Drive Support ........................................................................................ 31
System Fan Connectors ........................................................................................ 32
Front Control Panel............................................................................................................ 33
5.1.1
Power / Sleep LED ................................................................................................ 34
5.1.2
System Status LED................................................................................................ 34
5.1.3
Drive Activity LED .................................................................................................. 34
6.
PCI Riser Cards and Assembly ......................................................................................... 35
7.
Supported Intel® Server Boards........................................................................................ 37
8.
Environmental and Regulatory Specifications ................................................................ 38
8.1
System Level Environmental Limits ....................................................................... 38
8.2
Product Regulatory Compliance ............................................................................ 38
8.2.1
Product Safety Compliance ................................................................................... 38
8.2.2
Product EMC Compliance ..................................................................................... 39
8.2.3
Certifications / Registrations / Declarations ........................................................... 39
8.2.4
Product Regulatory Compliance Markings ............................................................ 40
8.3
Electromagnetic Compatibility Notices .................................................................. 41
8.3.1
USA ....................................................................................................................... 41
8.3.2
FCC Verification Statement ................................................................................... 41
8.3.3
ICES-003 (Canada) ............................................................................................... 42
8.3.4
Europe (CE Declaration of Conformity) ................................................................. 42
8.3.5
Japan EMC Compatibility ...................................................................................... 42
8.3.6
BSMI (Taiwan) ....................................................................................................... 42
Revision 1.0
v
Table of Contents
SR1530AH
8.3.7
RRL (Korea)........................................................................................................... 43
8.3.8
CNCA (CCC-China) ............................................................................................... 43
8.4
Replacing the Back up Battery .............................................................................. 44
8.5
Serviceability and Availability................................................................................. 45
8.6
Restriction of Hazardous Substances (RoHS) Compliance................................... 45
8.7
Regulated Specified Components ......................................................................... 46
Appendix A: Integration and Usage Tips................................................................................... I
Appendix B: POST Code Diagnostic LED Decoder ................................................................. II
Appendix C: POST Error Beep Codes......................................................................................VI
Glossary.....................................................................................................................................VII
Reference Documents .............................................................................................................VIII
vi
Revision 1.0
List of Figures
List of Figures
Figure 1. Intel® Server System SR1530AH.................................................................................. 1
Figure 2. Major System Components ........................................................................................... 2
Figure 3. Back Panel Features ..................................................................................................... 3
Figure 4. Drive Bays ..................................................................................................................... 4
Figure 5. Power Supply Enclosure Drawing ................................................................................. 7
Figure 6. Airflow Characteristics ................................................................................................... 8
Figure 7. Output Voltage Timing ................................................................................................. 21
Figure 8. Turn On/Off Timing (Power Supply Signals)................................................................ 22
Figure 9. PSON# Required Signal Characteristic. ...................................................................... 25
Figure 10. Fan Module Assembly ............................................................................................... 28
Figure 11. Air Duct ...................................................................................................................... 29
Figure 12. Drive Bays ................................................................................................................. 30
Figure 13. Front Control Panel.................................................................................................... 33
Figure 14. PCI Riser Card Assembly .......................................................................................... 35
Figure 15. 1U PCIX Riser Card Mechanical Drawing ................................................................. 35
Figure 16. 1U PCIE Riser Card Mechanical Drawing ................................................................. 36
Figure 17. Diagnostic LED Placement Diagram Example ............................................................ II
Revision 1.0
vii
List of Tables
SR1530AH
List of Tables
Table 1. Chassis Dimensions ....................................................................................................... 1
Table 2. Acoustic Requirements ................................................................................................... 9
Table 3. Environmental Requirements......................................................................................... 9
Table 4. Cable Lengths................................................................................................................. 9
Table 5. P1 Main Power Connector ........................................................................................... 10
Table 6. P2 Processor Power Connector................................................................................... 10
Table 7. HD Power Connector ................................................................................................... 11
Table 8. Slim-line Power Connector .......................................................................................... 11
Table 9. AC Input Rating............................................................................................................. 12
Table 10. AC Line Sag Transient Performance ........................................................................ 13
Table 11. AC Line Surge Transient Performance ..................................................................... 13
Table 12. Performance Criteria................................................................................................... 13
Table 13. Dropout Criteria........................................................................................................... 15
Table 14. Load Ratings.............................................................................................................. 17
Table 15. Voltage Regulation Limits ........................................................................................... 18
Table 16. Transient Load Requirements..................................................................................... 18
Table 17. Capacitve Loading Conditions .................................................................................... 19
Table 18. Ripple and Noise......................................................................................................... 19
Table 19. Output Voltage Timing ................................................................................................ 20
Table 20. Turn On/Off Timing ..................................................................................................... 22
Table 21. Over Current Protection (OCP) ................................................................................... 23
Table 22. Over-Voltage Protection (OVP) Limits ........................................................................ 24
Table 23. PSON# Signal Characteristic....................................................................................... 25
Table 24. PWOK Signal Characteristics ..................................................................................... 26
Table 25. Cooling Zones............................................................................................................. 29
Table 26. 40-pin Internal IDE Connector Pin-out (J3J2) ............................................................. 31
Table 27. System Four-pin Fan Headers Pin-outs (J7J1, J8D1, J4J1, and J6B1, J6J1)............ 32
Table 28. Control Panel LED Functions...................................................................................... 34
Table 29. SSI Power LED Operation .......................................................................................... 34
Table 30. System Environmental Limits Summary ..................................................................... 38
Table 31. POST Progress Code LED Example ............................................................................ II
viii
Revision 1.0
List of Tables
Table 32. Diagnostic LED POST Code Decoder ......................................................................... III
Table 33. POST Error Beep Codes .............................................................................................VI
Revision 1.0
ix
1.
Introduction
Introduction
The Intel® Server Chassis SR1530 is a 1U server chassis that is designed to support the Intel®
Server Boards S3000AH and S3000AHLX. The server boards and the chassis have features
that are designed to support the high-density server market. This chapter provides a high-level
overview of the chassis features. Greater detail for each major chassis component or feature is
provided in the following chapters.
1.1
Chassis Views
Figure 1. Intel® Server System SR1530AH
1.2
Chassis Dimensions
Table 1. Chassis Dimensions
Height
Revision 1.0
1.67 inches
42.42 mm
Width without rails
16.93 inches
430.02 mm
Depth without CMA
20 inches
508.00 mm
Maximum weight
33 lbs
15 kg
1
Introduction
SR1530AH
1.3
System Components
D
C
B
A
E
K
F
G
J
H
I
A
AF000970
A
Rack handles (two)
G
System Memory DIMM Sockets
B
PCI cooling fan
H
System blower fans (two)
C
Processor air duct
I
Hard drives Brackets (two)
D
PCI add-in card bracket
J
Control panel
E
Processor and Heat Sink
K
Slimline optical drive
F
Power supply
Figure 2. Major System Components
2
Revision 1.0
Introduction
The I/O connector locations on the back of the chassis are pre-cut, so an I/O shield is not
required. The EMI gasket is pre installed to maintain electromagnetic interference (EMI)
compliance levels.
A
B
C
D
I
H
G F
E
AF000999
A
AC power connector
F
USB ports 0 - 1
B
PS2 Mouse port
G
NIC 2 (10/100/1000 Mb)
C
Serial Port (DB9)
H
Video connector
D
NIC1 (10/100/1000 Mb)
I
PS2 Keyboard port
E
PCI-E/X Add-in Card Slot
Figure 3. Back Panel Features
1.4
System Boards
The Intel® Server Systems SR1530AH and SR1530AHLX include system boards that are used
as internal interconnects and provide feature accessibility. The following section provides a brief
description for each.
Intel® Server System SR1530AHLX
1.4.1
The Intel® Server System SR1530AHLX includes an Intel® Server Board S3000AHLX. This
board supports two different riser card options:
•
PCI-X* – capable of supporting a single full height/full length PCI-X* 66/100 MHz add-in
card.
•
PCI Express* – capable of supporting a single full height/full length x8 PCI Express*
add-in card.
Revision 1.0
3
Introduction
SR1530AH
1.4.2
The Intel® Server System SR1530AH includes an Intel® Server Board S3000AH. This board
supports a PCI Express* riser card.
•
PCI Express* – capable of supporting a single full height/full length x8 PCI Express*
add-in card.
Additionally both systems include a front control panel. The front control panel is a printed
circuit board routing the outputs of the system board SSI connector to provide a power on/off
switch, a power on/off LED, a Hard Disk Drive activity LED, NIC 1/2 activity LED, and USB port
2.
1.5
Hard Drive and Peripheral Bays
The chassis is designed to support up to two fixed 3.5-inch SATA (Serial ATA) hard drives and
one slimline optical device.
A
B
C
A
Slimline optical drive bay
B
Hard drive bay HDD0 (located under the
slimline optical drive bay)
C
Hard drive bay HDD1
AF001074
Figure 4. Drive Bays
4
Revision 1.0
1.6
Introduction
System Cooling
The chassis provides two non-redundant blower fans and one PCI cooling fan. When external
ambient temperatures remain within specified limits, the cooling system will provide sufficient air
flow for all drive configurations, processors, supported memory, and add-in cards.
1.7
Rack and Cabinet Mounting Options
The chassis was designed to support 19-inch wide by up to 30-inch deep server cabinets. The
chassis supports three rack mount options:
•
A fixed mount relay rack / cabinet mount kit (Product order code - AXXBRACKETS )
which can be configured to mount the system into either a 2-post or 4-post rack cabinet
•
A tool-less full extracting slide rail kit (Product order code – AXXHERAIL) designed to
support an optional cable management arm (Product order code – AXXRACKCARM).
•
A basic slide rail kit (Product order code – AXXBASICRAIL) designed to mount the
chassis into a standard (19-inch by up to 30-inch deep) EIA-310D compatible server
cabinet.
Revision 1.0
5
Power Sub-System
SR1530AH
2.
Power Sub-System
The power sub-system of the server chassis consists of a single non-redundant 350 W power
supply with 7 outputs; 3.3V, 5V, 12V1, 12V2, 12V3, -12V and 5VSB. The form factor fits into a
1U system and provides a wire harness output to the system. An IEC connector is provided on
the external face for AC input to the power supply. The power supply provides two nonredundant 40mm fans for self cooling. The power supply fans also provide additional airflow for
parts of the system.
The power supply operates within the following voltage ranges and ratings:
Parameter
Voltage (110)
Minimum
90 Vrms
Rated
100-127 Vrms
Maximum
140 Vrms
Voltage (220)
180 Vrms
200-240 Vrms
264 Vrms
Frequency
47 Hz
Start up VAC
85Vac +/-4Vac
Power Off VAC
75Vac +/-5Vac
63 Hz
The power supply must operate within all specified limits over the following input voltage range,
shown in the table. Harmonic distortion of up to 10% THD must not cause the power supply to
go out of specified limits. The power supply shall power off if the AC input is less than 75VAC
+/-5VAC range. The power supply shall start up if the AC input is greater than 85VAC +/-4VAC.
Application of an input voltage below 85VAC shall not cause damage to the power supply,
including a fuse blow.
6
Revision 1.0
2.1
Power Sub-System
Mechanical Specifications
The 1U 350 W power supply is designed specifically for use in the Intel® Server Chassis
SR1530. The physical size of the power supply enclosure is intended to accommodate power
ranges from 350 W. The power supply size is 40mm x 106mm x 300mm and has a wire
harness for the DC outputs. The AC input plugs directly into the external face of the power
supply; refer to the following figure.
Figure 5. Power Supply Enclosure Drawing
Notes:
1. All dimensions are in mm.
2. The tolerance of the 40mm height dimension (marked with letter C) pertains to the metal case
only.
Revision 1.0
7
Power Sub-System
SR1530AH
2.2
Airflow Requirements
The power supply shall incorporate two 40mm fans for self-cooling and system cooling. The
fans will provide no less than 8 CFM airflow through the power supply when installed in the
system. The cooling air will enter the power supply module from the non-AC side.
System Flow Impedance - 1U
System Pressure (in H 2O)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
2
4
6
8
10
12
14
16
18
Power Supply Airflow (CFM)
Figure 6. Airflow Characteristics
2.3
Acoustics
The power supply shall incorporate two variable speed fans. The fans’ speed shall vary linearly
based on output loading and ambient temperature. The declared sound power levels (LwAd) of
the power supply unit (PSU) must meet the requirements shown in the following table. Sound
power must be measured according to ECMA 74 (www.ecma-international.org) and reported
according to ISO 9296.
The acoustic measurement of the PSU shall be performed with the PSU fan operating at the
RPM corresponding to the operating conditions shown in the following table. The PSU acoustic
test report shall include the PSU dimension, photo, fan model and size, fan voltage (or duty
cycle), RPM, and PSU sound power level at each operating condition. The proper RPM
thermally sustainable shall be determined through PSU thermal testing, and shall be submitted
as an appendix to the acoustic test report.
The declared sound power level of the power supply module shall not exceed the levels
specified in the following table.
8
Revision 1.0
Power Sub-System
Table 2. Acoustic Requirements
Operating Conditions
Inlet Temperature
Condition
45ºC
28°C
28°C
28°C
Maximum
Operating
Idle
Standby (main outputs off)
2.4
% of Maximum Loading
Condition
100%
60%
40%
5Vsb/2A
LwAd (BA)
6.5
5.6
5.4
< 5.4
Temperature
The power supply shall operate within all specified limits over the Top temperature range. The
average air temperature difference (ΔTps ) from the inlet to the outlet of the power supply shall
not exceed 20°C. All airflow shall pass through the power supply and not over the exterior
surfaces of the power supply.
Table 3. Environmental Requirements
ITEM
Top
Tnon-op
Altitude
DESCRIPTION
Operating temperature range.
Non-operating temperature range.
Maximum operating altitude.
MIN
0
-40
MAX
45
70
1500
UNITS
°C
°C
m
The power supply must meet UL enclosure requirements for temperature rise limits. All sides of
the power supply with exception to the air exhaust side must be classified as “handle, knobs,
grips, etc. held for short periods of time only”.
2.5
Output Connectors
Listed or recognized component appliance wiring material (AVLV2), CN, rated min 80°C,
300VDC shall be used for all output wiring.
Table 4. Cable Lengths
Length
(mm)
From
Power Supply cover exit hole
Revision 1.0
380
390
495
605
860
To
connector
#
P1
P2
P3
P4
P5
No of
pins
20
8
6
6
4
Description
Baseboard Power Connector
Processor Power Connector
HD Power Connector
HD Power Connector
Slimline Power Connector
9
Power Sub-System
SR1530AH
2.5.1
P1 Main power connector
Connector housing: 20-Pin Molex* Mini-Fit Jr. 39-01-2200 or equivalent.
Contact: Molex Mini-Fit, HCS, female, crimp 44476 or Molex 5556 as the alternative, or
equivalent approved by Intel.
Table 5. P1 Main Power Connector
Pin
1
2
3
4
5
6
7
8
9
10
Signal
+3.3VDC
3.3V RS
+3.3VDC
COM
+5VDC
COM
+5VDC
COM
PWR OK
5 VSB
+12V
12VRS
18 AWG Color
Orange
Orange/White (24AWG)
Orange
Black
Red
Black
Red
Black
Gray (24AWG)
Purple
Yellow
Yellow/White (24AWG)
Pin
11
12
13
14
15
16
17
18
19
20
Signal
+3.3VDC
-12VDC
COM
PSON#
COM
COMRS
COM
COM
Reserved
+5VDC
+5VDC
5VRS
18 AWG Color
Orange
Blue
Black
Green (24AWG)
Black
Black (24AWG)
Black
Black
N.C.
Red
Red
Red/White (24AWG)
Notes:
1.
2.
2.5.2
Remote Sense wire double crimped.
P1 add cable bend requirement at P1.
P2 Processor Power Connector
Connector housing: 8-Pin Molex* 39-01-2085 or equivalent.
Contact: Molex 44476-1111 or Molex 5556 as the alternative, or equivalent approved by Intel.
Table 6. P2 Processor Power Connector
Pin
1
2
3
4
10
Signal
COM
COM
N.C.
N.C.
18 AWG color
Black
Black
Pin
5
6
7
8
Signal
+12V
+12V
N.C.
N.C.
18 AWG Color
Yellow
Yellow
Revision 1.0
2.5.3
Power Sub-System
HD Power Connector (P3)
Connector housing: 6-pin Molex* 39-01-2065 or equivalent.
Contacts: Molex Mini-Fit, (HCS or standard), female, crimp or equivalent.
Table 7. HD Power Connector
Pin
1
2
3
4
5
6
2.5.4
Signal
COM
COM
+5VDC
+12VDC
+12VDC
+5Vsb
18 AWG Color
Black
Black
Red
Yellow
Yellow
Purple
Slimline Power Connector (P4)
Connector housing: 4-pin Molex* 39-01-3042 or equivalent.
Contact: Molex 44476-1111 or Molex 5556 as the alternative, or equivalent approved by Intel.
Table 8. Slim-line Power Connector
PIN
1
2
2.6
SIGNAL
+12V
COM
18 AWG COLOR
Yellow
Black
PIN
3
4
SIGNAL
+5V
COM
18 AWG COLOR
Red
Black
AC Inlet Connector
The AC input connector shall be an IEC 320 C-14 power inlet. This inlet is rated for 10A /
250VAC.
Revision 1.0
11
Power Sub-System
SR1530AH
2.6.1
AC Power Cord Specification Requirements
The AC power cord must meet the following specification requirements:
2.7
Cable Type
Wire Size
SJT
16 AWG
Temperature Rating
105º C
Amperage Rating
13A
Voltage Rating
125V
Marking and Identification
The power supply module marking supports the following requirements: safety agency
requirements, government requirements (if required, e.g. point of manufacturing), power supply
vendor requirements, and Intel manufacturing and field support requirements.
2.8
AC Input Voltage
The power supply must operate within all specified limits over the following input voltage range,
shown in table below. Harmonic distortion of up to 10% of the rated line voltage must not
cause the power supply to go out of specified limits. The power supply shall power off if the AC
input is less than 75VAC +/-5VAC range. The power supply shall start up if the AC input is
greater than 85VAC +/-4VAC. Application of an input voltage below 85VAC shall not cause
damage to the power supply, including a fuse blow.
Table 9. AC Input Rating
PARAMETER
Voltage (110)
Voltage (220)
Frequency
Notes:
1.
2.
3.
12
MIN
RATED
IMAX
VMAX
1, 3
90 Vrms
100-127 Vrms
140 Vrms
6A
180 Vrms
47 Hz
200-240 Vrms
50/60
264 Vrms
63 Hz
3A
2, 3
Start up
VAC
85VAC +/4VAC
Power Off
VAC
75VAC +/5VAC
Maximum input current at low input voltage range shall be measured at 90VAC, at max load.
Maximum input current at high input voltage range shall be measured at 180VAC, at max load.
This requirement is not to be used for determining agency input current markings.
Revision 1.0
2.9
Power Sub-System
AC Line Transient Specification
AC line transient conditions shall be defined as “sag” and “surge” conditions. “Sag” conditions
are also commonly referred to as “brownout”; these conditions will be defined as the AC line
voltage dropping below nominal voltage conditions. “Surge” will be defined to refer to conditions
when the AC line voltage rises above nominal voltage.
The power supply shall meet the requirements under the following AC line sag and surge
conditions.
Table 10. AC Line Sag Transient Performance
Continuous
10%
AC Line Sag
Operating AC Voltage
Line
Frequency
Nominal AC Voltage ranges
50/60Hz
0 to 1 AC
cycle
95%
50/60Hz
No loss of function or performance
> 1 AC cycle
>30%
50/60Hz
Loss of function acceptable, self
recoverable
Duration
Sag
Performance Criteria
Table 11. AC Line Surge Transient Performance
Duration
Surge
Continuous
10%
0 to ½ AC
cycle
30%
AC Line Surge
Operating AC Voltage
Line
Frequency
Nominal AC Voltages
50/60Hz
Mid-point of nominal AC
Voltages
50/60Hz
Performance Criteria
2.10 Susceptibility
The power supply meets the following electrical immunity requirements when connected to a
cage with an external EMI filter which meets the criteria defined in the SSI document EPS
Power Supply Specification. For further information on Intel standards please request a copy of
the Intel Environmental Standards Handbook.
Table 12. Performance Criteria
Level
A
Description
The apparatus continues to operate as intended. No degradation of performance.
B
The apparatus continues to operate as intended. No degradation of performance beyond
spec limits.
C
Temporary loss of function is allowed provided the function is self-recoverable or can be
restored by the operation of the controls.
Revision 1.0
13
Power Sub-System
SR1530AH
2.10.1
Electrostatic Discharge Susceptibility
The power supply complies with the limits defined in EN 55024: 1998 using the IEC 61000-42:1995 test standard and performance criteria B defined in Annex B of CISPR 24.
2.10.2
Fast Transient/Burst
The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-44:1995 test standard and performance criteria B defined in Annex B of CISPR 24.
2.10.3
Radiated Immunity
The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-43:1995 test standard and performance criteria A defined in Annex B of CISPR 24.
2.10.4
Surge Immunity
The power supply was tested with the system for immunity to AC ringwave and AC
unidirectional wave, both up to 2kV, per EN 55024:1998, EN 61000-4-5:1995 and ANSI C62.45:
1992. The pass criteria includes: no unsafe operation exists under any condition; all power
supply output voltage levels remain within proper spec levels; no change in operating state or
loss of data was detected during and after the test profile; no component damage occurred
under any condition.
The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-45:1995 test standard and performance criteria B defined in Annex B of CISPR 24.
2.11 AC Line Fast Transient (EFT) Specification
The power supply meets the EN61000-4-5 directive and any additional requirements in
IEC1000-4-5:1995 and the level 3 requirements for surge-withstand capability, with the following
conditions and exceptions:
• These input transients do not cause any out-of-regulation conditions, such as overshoot
and undershoot, nor any nuisance trips of any of the power supply protection circuits.
• The surge-withstand does not produce damage to the power supply.
The supply meets surge-withstand test conditions under maximum and minimum DC-output
load conditions.
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Power Sub-System
2.12 AC Line Dropout / Holdup
An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC
line for any length of time. During an AC dropout the power supply must meet dynamic voltage
regulation requirements. An AC line dropout of any duration shall not cause tripping of control
signals or protection circuits. If the AC dropout lasts longer than the hold up time, the power
supply should recover and meet all turn on requirements. The power supply shall meet the AC
dropout requirement over rated AC voltages (100-240VAC) and frequencies. A dropout of the
AC line for any duration shall not cause damage to the power supply.
Table 13. Dropout Criteria
Loading
350W (100%)
260W (75%)
Dropout time
15msec
20msec
2.12.1 AC Line 5VSB Holdup
The 5VSB output voltage should stay in regulation under its full load (static or dynamic) during
an AC dropout of 70ms / min (=5VSB holdup time) whether the power supply is in the ON or
OFF state (PSON asserted or de-asserted).
2.13
Power Recovery
The power supply shall recover automatically after an AC power failure. AC power failure is
defined to be any loss of AC power that exceeds the dropout criteria.
2.13.1 Voltage Brown Out
The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-411:1995 test standard and performance criteria C defined in Annex B of CISPR 24.
In addition the power supply shall meet the following Intel requirements:
A continuous input voltage below the nominal input range shall not damage the power supply or
cause overstress to any power supply component. The power supply must be able to return to
normal power up state after a brownout condition. Maximum input current under a continuous
brownout shall not blow the fuse. The power supply shall be tested with a 3 min ramp from
90VAC voltage to 0VAC after the components have reached a steady state condition.
2.13.2 Voltage Interruptions
The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-411:1995 and the level 3 requirements test standard and performance criteria C defined in Annex
B of CISPR 24.
2.14
AC Line Inrush
AC line inrush current shall not exceed 55 A peak, cold start at 20°C and no component
damaged at hot start for up to one-quarter of the AC cycle, after which, the input current should
Revision 1.0
15
Power Sub-System
SR1530AH
be no more than the specified maximum input current. AC line inrush current may exceed 55 A
peak during hot start at 45°C. The peak inrush current shall be less than the ratings of its
critical components (including input fuse, bulk rectifiers, and surge limiting device).
The power supply must meet the inrush requirements for any rated AC voltage, during turn on at
any phase of AC voltage, during a single cycle AC dropout condition as well as upon recovery
after AC dropout of any duration, and over the specified temperature range (Top).
2.15
AC Line Isolation Requirements
The power supply shall meet all safety agency requirements for dielectric strength. Additionally,
the power supply vendor must provide Intel with written confirmation of the dielectric withstand
test which includes: voltage level, duration of test and identification detailing how each power
supply is marked to indicate the dielectric withstand test had been completed successfully.
Transformers’ isolation between primary and secondary windings must comply with the
3000Vac (4242Vdc) dielectric strength criteria. If the working voltage between primary and
secondary dictates a higher dielectric strength test voltage, the highest test voltage should be
used. In addition the insulation system must comply with reinforced insulation per safety
standard IEC 950. Separation between the primary and secondary circuits, and primary to
ground circuits, must comply with the IEC 950 spacing requirements.
2.16
AC Line Leakage Current
The maximum leakage current to ground for each power supply shall be 3.5 mA when tested at
240VAC.
2.17 AC Line Fuse
The power supply shall have one line fused in the single line fuse on the line (Hot) wire of the
AC input. The line fusing shall be acceptable for all safety agency requirements. The input fuse
shall be a slow blow type. AC inrush current shall not cause the AC line fuse to blow under any
conditions. All protection circuits in the power supply shall not cause the AC fuse to blow unless
a component in the power supply has failed. This includes DC output load short conditions.
2.18 Power Factor Correction
The power supply shall incorporate a Power Factor Correction circuit.
The power supply shall be tested as described in EN 61000-3-2: Electromagnetic Compatibility
(EMC) Part 3: Limits- Section 2: Limits for harmonic current emissions, and shall meet the
harmonic current emissions limits specified for ITE equipment.
The power supply shall be tested as described in JEIDA MITI Guideline for Suppression of High
Harmonics in Appliances and General-Use Equipment and shall meet the harmonic current
emissions limits specified for ITE equipment.
2.19 Efficiency
The power supply shall have a recommended efficiency of 70% at maximum load and over the
specified AC voltage.
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Revision 1.0
Power Sub-System
2.20 Grounding
The output ground of the pins of the power supply provides the output power return path. The
output connector ground pins shall be connected to the safety ground (power supply enclosure).
This grounding should be well designed to ensure passing the max allowed common mode
noise levels.
The power supply shall be provided with a reliable protective earth ground. All secondary
circuits shall be connected to protective earth ground. Resistance of the ground returns to
chassis shall not exceed 1.0 mΩ. This path may be used to carry DC current.
2.21 Remote Sense
The power supply has remote sense return (ReturnS) to regulate out ground drops for all output
voltages: +3.3V, +5V, +12V, -12V, and 5VSB. The power supply uses remote sense to regulate
out drops in the system for the +3.3V, +5V, and 12V outputs. The power supply must operate
within specification over the full range of voltage drops from the power supply’s output
connector to the remote sense points.
2.22 Output Power / Currents
The following tables define two power and current ratings for this 350 W power supply. The
combined output power of all outputs shall not exceed the rated output power. The power
supply must meet both static and dynamic voltage regulation requirements for the minimum
loading conditions.
Table 14. Load Ratings
Minimum
Continuous Load
1.5 A
1.0 A
1.5 A
0A
0.1 A
Voltage
+3.3V4
+5V4
+12V
-12V
+5VSB
Notes:
1.
2.
3.
4.
Maximum
Continuous Load1, 3
14 A
18 A
24 A
0.3 A
2.0 A
Peak Load2, 3
28 A
2.5 A
Maximum continuous total DC output power should not exceed 350 W.
Peak total DC output power should not exceed 400 W.
Peak power and peak current loading shall be supported for a minimum of 12 seconds.
Combined 3.3V/5V power shall not exceed 100 W.
2.22.1 Standby Outputs
The 5VSB output shall be present when an AC input greater than the power supply turn on
voltage is applied.
2.22.2 Fan Operation in Stand-By Mode
The power supply fans shall continue to operate at their lowest speed when in stand-by mode.
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17
Power Sub-System
SR1530AH
2.23 Voltage Regulation
The power supply output voltages must stay within the following voltage limits when operating at
steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise.
All outputs are measured with reference to the return remote sense signal (ReturnS).
Table 15. Voltage Regulation Limits
PARAMETER
+3.3V
+5V
+12V1
- 12V
+5VSB
TOLERANCE
- 5% / +5%
- 5% / +5%
- 5% / +5%
- 10% / +10%
- 5% / +5%
MIN
+3.14
+4.75
+11.40
- 13.20
+4.75
NOM
+3.30
+5.00
+12.00
-12.00
+5.00
MAX
+3.46
+5.25
+12.60
-10.80
+5.25
UNITS
Vrms
Vrms
Vrms
Vrms
Vrms
2.23.1 Dynamic Loading
The output voltages shall remain within specified limits for the step loading and capacitive
loading specified below. The load transient repetition rate shall be tested between 50 Hz and 5
kHz at duty cycles ranging from 10%-90%. The load transient repetition rate is only a test
specification. The Δ step load may occur anywhere within the MIN load to the MAX load.
Table 16. Transient Load Requirements
Output
+3.3V
+5V
+12V
+5VSB
Δ Step Load Size
(See note)
5.0A
6.0A
11.0A
0.5A
Load Slew Rate
Test capacitive Load
0.25 A/μsec
0.25 A/μsec
0.25 A/μsec
0.25 A/μsec
250 μF
400 μF
500 μF
20 μF
Notes:
1.
18
Step loads on each 12V output may happen simultaneously and it shall be tested that way.
Revision 1.0
Power Sub-System
2.24 Capacitive Loading
The power supply shall be stable and meet all requirements with the following capacitive
loading ranges.
Table 17. Capacitve Loading Conditions
Output
+3.3V
MIN
250
MAX
2200
Units
μF
+5V
400
2200
μF
+12V
500
2200
μF
-12V
1
350
μF
+5VSB
20
350
μF
2.25 Closed loop stability
The power supply shall be unconditionally stable under all line/load/transient load conditions
including capacitive load ranges. A minimum of: 45 degrees phase margin and -10dB-gain
margin is required. The power supply manufacturer shall provide proof of the unit’s closed-loop
stability with local sensing through the submission of Bode plots. Closed-loop stability must be
ensured at the maximum and minimum loads as applicable.
2.26 Common Mode Noise
The common mode noise on any output shall not exceed 350 mV pk-pk over the frequency
band of 10 Hz to 20 MHz.
1. The measurement shall be made across a 100 Ω resistor between each of the
DC outputs, including ground at the DC power connector and chassis ground
(power subsystem enclosure).
2. The test set-up shall use a FET probe such as Tektronix* model P6046 or
equivalent.
2.27 Ripple / Noise
The maximum allowed ripple/noise output of the power supply is defined in the table below.
This is measured over a bandwidth of 10 Hz to 20 MHz at the power supply output connectors.
A 10 μF tantalum capacitor in parallel with a 0.1 μF ceramic capacitor is placed at the point of
measurement.
Table 18. Ripple and Noise
+3.3V
50mVp-p
Revision 1.0
+5V
50mVp-p
+12V
120mVp-p
-12V
120mVp-p
+5VSB
50mVp-p
19
Power Sub-System
SR1530AH
2.28 Soft Starting
The power supply shall contain a control circuit which provides a monotonic soft start for its
outputs without overstress of the AC line or any power supply components at any specified AC
line or load conditions.
2.29 Zero Load Stability Requirements
When the power sub-system operates in a no load condition, it does not need to meet the
output regulation specification, but it must operate without any tripping of over-voltage or other
fault circuitry. When the power sub-system is subsequently loaded, it must begin to regulate
and source current without fault.
2.30 Timing Requirements
These are the timing requirements for the power supply operation. The output voltages must
rise from 10% to within regulation limits (Tvout_rise) within 5 to 70 ms, except for 5VSB; it is
allowed to rise from 1.0 to 25 ms. The +3.3V, +5V and +12V output voltages should start to rise
approximately at the same time. All outputs must rise monotonically. The 5V output needs to
be greater than the 3.3 V output during any point of the voltage rise condition. The +5V output
must never be greater than the +3.3V output by more than 2.25V. Each output voltage shall
reach regulation within 50 ms (Tvout_on) of each other during turn on of the power supply.
Each output voltage shall fall out of regulation within 400 ms (Tvout_off) of each other during
turn off. The table below shows the timing requirements for the power supply being turned on
and off via the AC input, with PSON held low and with the AC input applied.
Table 19. Output Voltage Timing
Item
Tvout_rise
Description
Output voltage rise time from each main output.
Tvout_on
T vout_off
MIN
5.0 *
MAX
70 *
UNITS
msec
All main outputs must be within regulation of each
other within this time.
50
msec
All main outputs must leave regulation within this
time.
400
msec
Note: The 5VSB output voltage rise time shall be from 1.0ms to 25.0ms
20
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Power Sub-System
Vout
V1
10%
Vout
V2
V3
V4
Tvout
rise
Tvout_off
Tvout_on
Figure 7. Output Voltage Timing
Revision 1.0
21
Power Sub-System
SR1530AH
Table 20. Turn On/Off Timing
Item
Tsb_on_delay
T ac_on_delay
Tvout_holdup
Tpwok_holdup
Tpson_on_delay
T pson_pwok
Tpwok_on
T pwok_off
Tpwok_low
Tsb_vout
T5VSB_holdup
Description
Delay from AC being applied to 5VSB being within regulation.
Delay from AC being applied to all output voltages being within
regulation.
Time all output voltages stay within regulation after loss of AC.
Delay from loss of AC to de-assertion of PWOK
#
Delay from PSON active to output voltages within regulation
limits.
Delay from PSON# deactivate to PWOK being de-asserted.
Delay from output voltages within regulation limits to PWOK
asserted at turn on.
Delay from PWOK de-asserted to output voltages (3.3V, 5V,
12V, -12V) dropping out of regulation limits.
Duration of PWOK being in the de-asserted state during an
off/on cycle using AC or the PSON signal.
Delay from 5VSB being in regulation to O/Ps being in regulation
at AC turn on.
Time the 5VSB output voltage stays within regulation after loss
of AC.
MIN
MAX
1500
UNITS
ms
2500
ms
21
20
5
100
ms
ms
400
ms
50
ms
1000
ms
1
ms
100
ms
50
1000
ms
70
msec
AC Input
Tvout_holdup
Vout
Tpwok_low
TAC_on_delay
Tsb_on_delay
PWOK
5VSB
Tpwok_off
Tpwok_on
Tsb_on_delay
Tpwok_on
Tpwok_off
Tpson_pwok
Tpwok_holdup
T5VSB_holdup
Tsb_vout
Tpson_on_delay
PSON
AC turn on/off cycle
PSON turn on/off cycle
Figure 8. Turn On/Off Timing (Power Supply Signals)
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Power Sub-System
2.31 Residual Voltage Immunity in Standby mode
The power supply should be immune to any residual voltage placed on its outputs (typically a
leakage voltage through the system from standby output) up to 500 mV. There shall be no
additional heat generated, nor stress of any internal components with this voltage applied to any
individual output, and all outputs simultaneously. It also should not trip the protection circuits
during turn on.
The residual voltage at the power supply outputs for no load condition shall not exceed 100 mV
when AC voltage is applied.
2.32 Protection Circuits
Protection circuits inside the power supply shall cause only the power supply’s main outputs to
shutdown. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF
for 15 sec and a PSON# cycle HIGH for 1 sec shall be able to reset the power supply.
2.33 Over-Current Limit (OCP)
The power supply shall have current limits to prevent the +3.3V, +5V, and +12V outputs from
exceeding the values shown in the table below. If the current limits are exceeded, the power
supply shall shutdown and latch off. The latch will be cleared by toggling the PSON# signal or
by an AC power interruption. The power supply shall not be damaged from repeated power
cycling in this condition. -12V and 5VSB shall be protected under over-current or shorted
conditions so that no damage can occur to the power supply. 5Vsb will be auto-recovered after
removing the OCP limit.
Table 21. Over Current Protection (OCP)
VOLTAGE
+3.3V
+5V
+12V
-12V
5VSB
MIN
15A
20A
30A
0.625A
N/A
OVER CURRENT LIMIT
MAX
21A
27A
40A
2A
4A
2.34 Over-Voltage Protection (OVP)
The power supply over-voltage protection shall be locally sensed. The power supply shall
shutdown and latch off after an over-voltage condition occurs. This latch shall be cleared by
toggling the PSON# signal or by an AC power interruption. The table below contains the overvoltage limits. The values are measured at the output of the power supply’s pins. The voltage
shall never exceed the maximum levels when measured at the power pins of the power supply
connector during any single point of fail. The voltage shall never trip any lower than the
minimum levels when measured at the power pins of the power supply connector. 5Vsb will be
auto-recovered after removing the OVP limit.
Exception: +5VSB rail should be able recover after its over-voltage condition occurs.
Revision 1.0
23
Power Sub-System
SR1530AH
Table 22. Over-Voltage Protection (OVP) Limits
Output Voltage
+3.3V
MIN (V)
3.9
MAX (V)
4.5
+5V
5.7
6.5
+12V
13.3
14.5
-12V
-13.3
-16
+5VSB
5.7
6.5
2.35 Over-Temperature Protection (OTP)
The power supply will be protected against over-temperature conditions caused by loss of fan
cooling or excessive ambient temperature. In an OTP condition the power supply will shutdown.
When the power supply temperature drops to within specified limits, the power supply shall
restore power automatically, while the 5VSB remains always on. The OTP circuit must have
built in hysteresis such that the power supply will not oscillate on and off due to temperature
recovering condition. The OTP trip level shall have a minimum of 4°C of ambient temperature
hysteresis.
2.36 Control and Indicator Functions
The following sections define the input and output signals from the power supply. Signals that
can be defined as low true use the following convention: Signal# = low true.
2.37 PSON# Input Signal
The PSON# signal is required to remotely turn on/off the power supply. PSON# is an active low
signal that turns on the +3.3V, +5V, +12V, and -12V power rails. When this signal is not pulled
low by the system, or left open, the outputs (except the +5VSB) turn off. This signal is pulled to
a standby voltage by a pull-up resistor internal to the power supply.
24
Revision 1.0
Power Sub-System
Table 23. PSON# Signal Characteristic
Accepts an open collector/drain input from the system.
Pull-up to VSB located in power supply.
Signal Type
PSON# = Low
ON
#
OFF
PSON = High or Open
MIN
0V
1.0V
2.0V
5.25V
Logic level low (power supply ON)
Logic level high (power supply OFF)
MAX
4mA
Source current, Vpson = low
Power up delay:
Tpson_on_delay
PWOK delay:
T pson_pwok
5msec
400msec
50msec
0.3V ≤ Hysteresis ≤ 1.0V
in 1.0-2.0V input voltage range is required
Disabled
≤ 1.0 V PS is
enabled
≥ 2.0 V PS is
disabled
Enabled
0V
1.0V
2.0V
5.25V
Figure 9. PSON# Required Signal Characteristic.
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25
Power Sub-System
SR1530AH
2.38 PWOK (Power OK) Output Signal
PWOK is a power OK signal and will be pulled HIGH by the power supply to indicate that all the
outputs are within the regulation limits of the power supply. When any output voltage falls below
regulation limits or when AC power has been removed for a time sufficiently long so that power
supply operation is no longer guaranteed, PWOK will be de-asserted to a LOW state. The start
of the PWOK delay time shall inhibited as long as any power supply output is in current limit.
Table 24. PWOK Signal Characteristics
Signal Type
PWOK = High
PWOK = Low
Logic level low voltage, Isink=4mA
Logic level high voltage, Isource=200μA
Sink current, PWOK = low
Source current, PWOK = high
PWOK delay: Tpwok_on
PWOK rise and fall time
Power down delay: T pwok_off
Open collector/drain output from power supply. Pull-up
to VSB located in system.
Power OK
Power Not OK
MIN
MAX
0V
0.4V
2.4V
5.25V
4mA
2mA
100ms
1000ms
100μsec
1ms
200msec
2.39 Environmental Requirements
2.39.1
•
•
•
Temperature
Operating Ambient, normal mode (inlet air): +0°C min / +45°C max at 5000 feet above
sea level. (At full load, with a maximum rate of change of 5°C/10 minutes, but no more
than 10°C/hr)
Operating Ambient, stand-by mode (inlet air): +0°C min / +45°C max at 5000 feet
above sea level.
Non-operating Ambient: -40°C to +70°C
(Maximum rate of change of 20°C/hour)
2.39.2
Operating:
Non-Operating:
Humidity
To 85% relative humidity (non-condensing)
To 95% relative humidity (non-condensing)
Note: 95% relative humidity is achieved with a dry bulb temperature of 55°C and a wet bulb temperature of
54°C.
2.39.3
Operating:
Non-operating:
26
Altitude
to 5000 ft
to 50,000 ft
Revision 1.0
2.39.4
Power Sub-System
Mechanical Shock
Non-operating:
2.39.5
50 G Trapezoidal Wave, Velocity change = 170 in. / sec.
Three drops in each of six directions are applied to each of the samples.
Random Vibration
Non-operating
• Sine sweep:
5Hz to 500Hz @ 0.5gRMS at 0.5 octave/min; dwell 15 min at each of 3 resonant points;
• Random profile:
5Hz @ 0.01g²/Hz to 20Hz @ 0.02g²/Hz (slope up); 20Hz to 500Hz @ 0.02g²/Hz (flat);
Input acceleration = 3.13gRMS; 10 min. per axis for 3 axis on all samples
2.39.6
Thermal Shock (Shipping)
Non-operating: -40°C to +70°C, 50 cycles, 30°C/min. ≥ transition time ≥ 15°C/min., duration of
exposure to temperature extremes for each half cycle shall be 30 minutes.
2.39.7
•
•
•
Ecological Requirements
Cadmium shall not be used in painting or plating.
Cadmium shall not be used in any of the cabling and wiring.
No Quaternary salt electrolytic capacitors shall be used. Example of prohibited caps:
United Chemi-Con type: LXF, LXY, and LXZ.
2.39.8
Catastrophic Failure
The power supply shall be designed to fail without startling noise or excessive smoke.
Revision 1.0
27
Cooling Sub-System
SR1530AH
3.
Cooling Sub-System
The cooling sub-system consists of two 97 x 94 x 33 blower fan and one 40 x 40 x 15 PCI
cooling fan and a CPU air duct. These components are used to provide the necessary cooling
and airflow to the system. A fan on the processor heat sink is not needed.
To maintain the necessary airflow within the system, the air duct and the top cover must be
properly installed.
Note: The Intel® Server Chassis SR1530 does not support redundant cooling. Should a fan
blower fail, the system should be powered down as soon as possible to replace the failed fan
blower. The system fans are not hot-swappable.
Figure 10. Fan Module Assembly
28
Revision 1.0
Cooling Sub-System
Table 25. Cooling Zones
Fan
System Fan Blower #1
and #2
PCI Cooling Fan
Power Supply Fans
3.1
Cooling
Zone
CPU/MCH
PCI
PS
Greatest Cooling Influence
Primary cooling for the CPU and the system memory
Primary cooling for HDD0, full-height PCI cards, PXH
Primary cooling for HDD1 and the 350W power supply
Power Supply Fans
The power supply supports two non-redundant 40 mm fans. They are responsible for the
cooling of the power supply and the second hard drive bay.
3.2
CPU Air Duct
The chassis requires the use of a CPU air duct to direct airflow through the processor heat sink.
AF000665
Figure 11. Air Duct
Revision 1.0
29
Peripheral and Hard Drive Support
SR1530AH
4.
The server chassis provides support for two fixed hard drive bays and one slimline peripheral
drive bay at the front of the chassis. The fixed hard drive bays are designed to support SATA
drives.
A
B
C
A
Slimline optical drive bay
B
Hard drive bay HDD0 (located under the
slimline optical drive bay)
C
Hard drive bay HDD1
AF001074
Figure 12. Drive Bays
4.1
Optical Drive Support
The chassis provides a slimline drive bay that can be configured for an IDE optical CD-ROM,
DVD/CDR drive. The slimline devices are not hot-swappable.
30
Revision 1.0
4.1.1
Optical Drive Support
The chassis supports a slimline IDE optical drive. The drive is mounted with two side mount rail
accessories and is connected to an interposer card attached to the drive. The drive assembly is
then installed in to the slimline drive bay. A 40-pin ribbon cable is used to connect the drive
assembly to a matching IDE connector on the server board.
Table 26. 40-pin Internal IDE Connector Pin-out (J3J2)
Pin
4.2
1
Signal Name
RESET#
2
Pin
GND
Signal Name
3
IDE_DD7
4
IDE_DD8
5
IDE_DD6
6
IDE_DD9
7
IDE_DD5
8
IDE_DD10
9
IDE_DD4
10
IDE_DD11
11
IDE_DD3
12
IDE_DD12
13
IDE_DD2
14
IDE_DD13
15
IDE_DD1
16
IDE_DD14
17
IDE_DD0
18
IDE_DD15
19
GND
20
KEY
21
IDE_DMAREQ
22
GND
23
IDE_IOW#
24
GND
25
IDE_IOR#
26
GND
27
IDE_IORDY
28
GND
29
IDE_DMAACK#
30
GND
31
IRQ_IDE
32
Test Point
33
IDE_A1
34
DIAG
35
IDE_A0
36
IDE_A2
37
IDE_DCS0#
38
IDE_DCS1#
39
IDE_HD_ACT#
40
GND
Hard Disk Drive Support
The chassis can support up to two 3.5-inch by 1-inch fixed SATA hard disk drives. The drives
are mounted inside the chassis and are not hot swappable.
Revision 1.0
31
SR1530AH
4.2.1
System Fan Connectors
The system supports two system fan blowers and one PCI cooling fan. The pin-out for each
connector is provided in the following table.
Table 27. System Four-pin Fan Headers Pin-outs (J7J1, J8D1, J4J1, and J6B1, J6J1)
32
Pin
1
Signal Name
Ground
Type
Power
Description
GROUND is the power supply ground
2
Fan Power
Power
Fan Power
3
Fan Tach
Out
FAN_TACH signal is connected to the Heceta* to monitor the FAN
speed.
4
PWM
Control
Pulse Width Modulation – Fan Speed Control signal
Revision 1.0
5.
Front Control Panel
Front Control Panel
The standard control panel supports a power button, status LED, hard drive activity LED, and
NIC 1 and NIC 2 activity LEDs. The control panel assembly comes pre-assembled into the
chassis. The control panel assembly module slides into a predefined slot on the front of the
chassis. Once installed, communication to the server board can be achieved through a standard
24-pin cable connected directly to the server board.
Note: The status LED is not used on the Intel® Server System SR1530AH.
A
B
C
D
E
F
G
AF001000
Item
A
Feature
USB port
B
Power button. This button also functions as a sleep button if
enabled by an ACPI-compliant operating system.
C
Not Used
D
System power LED
E
Hard drive activity LED
F
NIC 1 LED
G
NIC 2 LED
Figure 13. Front Control Panel
Revision 1.0
33
Front Control Panel
SR1530AH
Table 28. Control Panel LED Functions
LED
Color
State
Description
NIC Link/no access
Green
On
Green
Blink
LAN access
Power / Sleep
(on standby power)
Green
On
Blink
Off
Power on
Sleep / ACPI S1 state
Power Off / ACPI S4 state
System Status
(on standby power)
Status LED is not used on the Intel® Server Systems SR1530AH and SR1530AHLX
NIC1 / NIC2
Activity
Disk Activity
Off
Green
Random blink
HDD access
Off
Off
No hard disk activity
The current limiting resistors for the power LED, the system fault LED, and the NIC LEDs are
located on the Intel® Server Board S3000AHLX.
5.1.1
Power / Sleep LED
Table 29. SSI Power LED Operation
State
Power Off
Power Mode
Non-ACPI
Off
LED
Description
System power is off, and the BIOS has not initialized the chipset.
Power On
Non-ACPI
On
System power is on, but the BIOS has not yet initialized the chipset.
S5
ACPI
Off
Mechanical is off, and the operating system has not saved any context
to the hard disk.
S4
ACPI
Off
Mechanical is off. The operating system has saved context to the hard
disk.
S3-S1
ACPI
Slow blink 1
DC power is still on. The operating system has saved context and
gone into a level of low-power state.
S0
ACPI
Steady on
System and the operating system are up and running.
Note:
1.
5.1.2
The blink rate is ~ 1Hz with at 50% duty cycle.
System Status LED
The system status LED is not available on the Intel® Server Boards S3000AH and S3000AHLX
or the Intel® Server Systems SR1530AH and SR1530AHLX.
5.1.3
Drive Activity LED
The drive activity LED on the front panel indicates drive activity from the onboard hard disk
controllers. The Intel® Server Boards S3000AH and S3000AHLX also provide a header giving
access to this LED for add-in controllers.
34
Revision 1.0
6.
PCI Riser Cards and Assembly
The Intel® Server Board S3000AH supports one PCI Express* riser slot which accepts a single
PCIe* x8 full-height adapter card. The Intel® Server Board S3000AHLX supports either a PCI
Express x8 or a PCI-X* riser card inserted into the Intel® Adaptive Slot.
A
B
C
AF000676
Figure 14. PCI Riser Card Assembly
Figure 15. 1U PCIX Riser Card Mechanical Drawing
Revision 1.0
35
SR1530AH
Figure 16. 1U PCIE Riser Card Mechanical Drawing
36
Revision 1.0
7.
Supported Intel® Server Boards
Supported Intel® Server Boards
The chassis is mechanically and functionally designed to support the Intel® Server Boards
S3000AH and S3000AHLX. See the Intel® Server Board S3000AH Technical Product
Specification for detailed server board information.
Revision 1.0
37
Environmental and Regulatory Specifications
SR1530AH
8.
8.1
System Level Environmental Limits
The table below defines the system level operating and non-operating environmental limits
Table 30. System Environmental Limits Summary
Parameter
Operating Temperature
Limits
+10°C to +35°C with the maximum rate of change not to exceed 10°C per hour
Non-Operating
Temperature
-40°C to +70°C
Non-Operating Humidity
90%, non-condensing at 35°C
Acoustic noise
Sound Power: 7.0 BA in an idle state at typical office ambient temperature. (23
+/- 2 degrees C)
Shock, operating
Half sine, 2 g peak, 11 mSec
Shock, unpackaged
Trapezoidal, 25 g, velocity change 136 inches/sec (≧40 lbs to > 80 lbs)
Shock, packaged
Non-palletized free fall in height 24 inches (≧40 lbs to > 80 lbs)
Vibration, unpackaged
5 Hz to 500 Hz, 2.20 g RMS random
Shock, operating
Half sine, 2 g peak, 11 mSec
ESD
+/-15kV except I/O port +/-8KV per Intel Environmental test specification
System Cooling
Requirement in BTU/Hr
2550 BTU/hour
8.2
8.2.1
Product Regulatory Compliance
Product Safety Compliance
The platform complies with the following safety requirements:
38
•
UL60950 – CSA 60950(USA / Canada)
•
EN60950 (Europe)
•
IEC60950 (International)
•
CB Certificate & Report, IEC60950 (report to include all country national deviations)
•
GS License (Germany)
•
GOST R 50377-92 - License (Russia)
•
Belarus License (Belarus)
•
Ukraine License (Ukraine)
•
CE - Low Voltage Directive 73/23/EEE (Europe)
•
IRAM Certification (Argentina)
•
GB4943- CNCA Certification (China)
Revision 1.0
8.2.2
Product EMC Compliance
The platform has been tested and verified to comply with the following electromagnetic
compatibility (EMC) regulations when installed a compatible Intel host system. For information
on compatible host system(s) refer to Intel’s Server Builder website or contact your local Intel
representative.
•
FCC (Class A Verification) – Radiated & Conducted Emissions (USA)
•
CISPR 22 – Emissions (International)
•
EN55022 - Emissions (Europe)
•
EN55024 - Immunity (Europe)
•
EN61000-3-2 - Harmonics (Europe)
•
EN61000-3-3 - Voltage Flicker (Europe)
•
CE – EMC Directive 89/336/EEC (Europe)
•
VCCI Emissions (Japan)
•
AS/NZS 3548 Emissions (Australia / New Zealand)
•
BSMI CNS13438 Emissions (Taiwan)
•
GOST R 29216-91 Emissions (Russia)
•
GOST R 50628-95 Immunity (Russia)
•
Belarus License (Belarus)
•
Ukraine License (Ukraine)
•
RRL MIC Notice No. 1997-41 (EMC) & 1997-42 (EMI) (Korea)
•
GB 9254 - CNCA Certification (China)
•
GB 17625 - (Harmonics) CNCA Certification (China)
8.2.3
Certifications / Registrations / Declarations
•
UL Certification (US/Canada)
•
CE Declaration of Conformity (CENELEC Europe)
•
FCC/ICES-003 Class A Attestation (USA/Canada)
•
VCCI Certification (Japan)
•
C-Tick Declaration of Conformity (Australia)
•
MED Declaration of Conformity (New Zealand)
•
BSMI Certification (Taiwan)
•
GOST R Certification / License (Russia)
•
Belarus Certification / License (Belarus)
•
RRL Certification (Korea)
•
IRAM Certification (Argentina)
•
CNCA Certification (China)
•
Ecology Declaration (International)
Revision 1.0
39
SR1530AH
8.2.4
Product Regulatory Compliance Markings
®
The Intel Server Chassis SR1530 is provided with the following regulatory marks.
40
Regulatory Compliance
cULus Listing Marks
Region
USA/Canada
GS Mark
Germany
CE Mark
Europe
FCC Marking (Class A)
USA
EMC Marking (Class A)
Canada
C-Tick Mark
Australia / New
Zealand
VCCI Marking (Class A)
Japan
BSMI Certification
Number & Class A
Warning
Taiwan
GOST R Marking
Russia
RRL MIC Mark
Korea
China Compulsory
Certification Mark
China
Marking
Revision 1.0
8.3
Electromagnetic Compatibility Notices
8.3.1
USA
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
•
Reorient or relocate the receiving antenna.
•
Increase the separation between the equipment and the receiver.
•
Connect the equipment to an outlet on a circuit other than the one to which the receiver
is connected.
•
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the grantee of this device could void
the user’s authority to operate the equipment. The customer is responsible for ensuring
compliance of the modified product.
Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC
Class B limits may be attached to this computer product. Operation with noncompliant
peripherals is likely to result in interference to radio and TV reception.
All cables used to connect to peripherals must be shielded and grounded. Operation with
cables, connected to peripherals that are not shielded and grounded may result in interference
to radio and TV reception.
8.3.2
FCC Verification Statement
Product Type: SR1530; S3000AH; S3000AHLX
Revision 1.0
41
SR1530AH
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124-6497
Phone: 1 (800)-INTEL4U or 1 (800) 628-8686
8.3.3
ICES-003 (Canada)
Cet appareil numérique respecte les limites bruits radioélectriques applicables aux appareils
numériques de Classe A prescrites dans la norme sur le matériel brouilleur: “Appareils
Numériques”, NMB-003 édictée par le Ministre Canadian des Communications.
(English translation of the notice above) This digital apparatus does not exceed the Class A
limits for radio noise emissions from digital apparatus set out in the interference-causing
equipment standard entitled “Digital Apparatus,” ICES-003 of the Canadian Department of
Communications.
8.3.4
Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive
(73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark
to illustrate its compliance.
8.3.5
Japan EMC Compatibility
Electromagnetic Compatibility Notices (International)
English translation of the notice above:
This is a Class A product based on the standard of the Voluntary Control Council For
Interference (VCCI) from Information Technology Equipment. If this is used near a radio or
television receiver in a domestic environment, it may cause radio interference. Install and use
the equipment according to the instruction manual.
8.3.6
BSMI (Taiwan)
The BSMI Certification number and the following warning is located on the product safety label
which is located on the bottom side (pedestal orientation) or side (rack mount configuration).
42
Revision 1.0
8.3.7
RRL (Korea)
Following is the RRL certification information for Korea.
English translation of the notice above:
1.
2.
3.
4.
5.
Type of Equipment (Model Name): On License and Product
Certification No.: On RRL certificate. Obtain certificate from local Intel representative
Name of Certification Recipient: Intel Corporation
Date of Manufacturer: Refer to date code on product
Manufacturer/Nation: Intel Corporation/Refer to country of origin marked on product
8.3.8
CNCA (CCC-China)
The CCC Certification Marking and EMC warning is located on the outside rear area of
the product.
Revision 1.0
43
SR1530AH
8.4
Replacing the Back up Battery
The lithium battery on the server board powers the real time clock (RTC) for up to 10 years in
the absence of power. When the battery starts to weaken, it loses voltage, and the server
settings stored in CMOS RAM in the RTC (for example, the date and time) may be wrong.
Contact your customer service representative or dealer for a list of approved devices.
WARNING
Danger of explosion if battery is incorrectly replaced. Replace only with
the same or equivalent type recommended by the equipment
manufacturer. Discard used batteries according to manufacturer’s
instructions.
ADVARSEL!
Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering. Udskiftning
må kun ske med batteri af samme fabrikat og type. Levér det brugte
batteri tilbage til leverandøren.
ADVARSEL
Lithiumbatteri - Eksplosjonsfare. Ved utskifting benyttes kun batteri
som anbefalt av apparatfabrikanten. Brukt batteri returneres
apparatleverandøren.
VARNING
Explosionsfara vid felaktigt batteribyte. Använd samma batterityp eller
en ekvivalent typ som rekommenderas av apparattillverkaren. Kassera
använt batteri enligt fabrikantens instruktion.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu. Vaihda paristo
ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty
paristo valmistajan ohjeiden mukaisesti.
44
Revision 1.0
8.5
Serviceability and Availability
The system is designed to be serviced by qualified technical personnel only.
The desired Mean Time To Repair (MTTR) of the system is 30 minutes including diagnosis of
the system problem. To meet this goal, the system enclosure and hardware have been
designed to minimize the MTTR.
Following are the maximum times that a trained field service technician should take to perform
the listed system maintenance procedures, after diagnosis of the system and having identified
the failed component.
Activity
8.6
Remove cover
Time Estimate
1 min
Remove and replace hard disk drive
5 min
Remove and replace power supply module
1 min
Remove and replace system fan
7 min
Remove and replace control panel module
2 min
Remove and replace baseboard
15 min
Restriction of Hazardous Substances (RoHS) Compliance
Intel has a system in place to restrict the use of banned substances in accordance with the
European Directive 2002/95/EC. Compliance is based on declaration that materials banned in
the RoHS Directive are either (1) below all applicable substance threshold limits or (2) an
approved/pending RoHS exemption applies.
Note: RoHS implementing details are not fully defined and may change.
Threshold limits and banned substances are noted below.
•
Quantity limit of 0.1% by mass (1000 PPM) for:
•
- Lead
- Mercury
- Hexavalent Chromium
- Polybrominated Biphenyls Diphenyl Ethers (PBDE)
Quantity limit of 0.01% by mass (100 PPM) for:
-
Cadmium
Revision 1.0
45
SR1530AH
8.7
Regulated Specified Components
To maintain the UL listing and compliance to other regulatory certifications and/or declarations,
the following regulated components must be used and conditions adhered to. Interchanging or
use of other component will void the UL listing and other product certifications and approvals.
Updated product information for configurations can be found on the Intel Server Builder Web
site at the following URL: http://channel.intel.com/go/serverbuilder.
If you do not have access to Intel’s Web address, please contact your local Intel representative.
46
•
Server chassis (base chassis is provided with power supply and fans)⎯UL listed.
•
Server board⎯you must use an Intel server board—UL recognized.
•
Add-in boards⎯must have a printed wiring board flammability rating of minimum
UL94V-1. Add-in boards containing external power connectors and/or lithium batteries
must be UL recognized or UL listed. Any add-in board containing modem
telecommunication circuitry must be UL listed. In addition, the modem must have the
appropriate telecommunications, safety, and EMC approvals for the region in which it is
sold.
•
Peripheral storage devices⎯must be UL recognized or UL listed accessory and TUV
or VDE licensed. Maximum power rating of any one device is 19 watts. Total server
configuration is not to exceed the maximum loading conditions of the power supply
Revision 1.0
This page intentionally left blank
Revision 1.0
47
Appendix A: Integration and Usage Tips
Appendix A: Integration and Usage Tips
This section provides a list of useful information that is unique to the Intel® Server Chassis
SR1530 and should be kept in mind while integrating and configuring your Intel® Server Board
S3000AH or S3000AHLX.
•
Only low-profile (1.2 inch or 30.48 mm) DIMMs can be used in the server chassis.
•
Processor fans are not needed and are not supported. The system fan module and
power supply fans provide the necessary cooling needed for the system. Using a
processor fan in this chassis may cause Intel® System Management Software to
incorrectly monitor the system fans.
•
The air duct must be used to maintain system thermals.
•
System fans are not hot swappable.
•
A screw on the front edge of the top cover is required when the unit is installed in a useraccessible environment.
•
Make sure the latest system software is loaded. This includes system BIOS. The latest
system software can be downloaded from
http://support.intel.com/support/motherboards/server/S3000AH/.
Revision 1.0
I
Appendix B: POST Code Diagnostic LED Decoder
SR1530AH
During the system boot process, the BIOS executes a number of platform configuration
processes, each of which is assigned a specific hex POST code number. As each configuration
routine is started, the BIOS will display the given POST code to the POST Code Diagnostic
LEDs found on the back edge of the server board. To assist in troubleshooting a system hang
during the POST process, the diagnostic LEDs can be used to identify the last POST process to
be executed.
Each POST code will be represented by a combination of colors from the four LEDs. The LEDs
are capable of displaying three colors: green, red, and amber. The POST codes are divided into
two nibbles, an upper nibble and a lower nibble. Each bit in the upper nibble is represented by a
red LED and each bit in the lower nibble is represented by a green LED. If both bits are set in
the upper and lower nibbles then both red and green LEDs are lit, resulting in an amber color. If
both bits are clear, then the LED is off.
In the below example, BIOS sends a value of ACh to the diagnostic LED decoder. The LEDs
are decoded as follows:
•
red bits = 1010b = Ah
•
green bits = 1100b = Ch
Since the red bits correspond to the upper nibble and the green bits correspond to the lower
nibble, the two are concatenated to be ACh.
Note: The following example is for illustrative purposes only; the diagram does not match the
back edge of the server board in the Intel® Server Systems SR1530AH and SR1530AHLX.
Table 31. POST Progress Code LED Example
8h
LEDs
ACh
1
Result
Amber
4h
Red
Green
1
2h
Red
0
Green
1
Green
1h
Red
1
Red
Green
0
Red
0
Off
MSB
USB Port
USB Port
Green
0
LSB
Diagnostic LEDs
Back edge of board
MSB
LSB
Figure 17. Diagnostic LED Placement Diagram Example
II
Revision 1.0
Table 32. Diagnostic LED POST Code Decoder
Diagnostic LED Decoder
G=Green, R=Red, A=Amber
MSB
LSB
Host Processor
Description
Checkpoint
0x10h
OFF
OFF
OFF
R
Power-on initialization of the host processor (bootstrap processor)
0x11h
OFF
OFF
OFF
A
Host processor cache initialization (including AP)
0x12h
OFF
OFF
G
R
Starting application processor initialization
0x13h
OFF
OFF
G
A
SMM initialization
OFF
OFF
R
G
Initializing a chipset component
OFF
OFF
A
OFF
0x23h
OFF
OFF
A
G
0x24h
OFF
G
R
OFF
Programming timing parameters in the memory controller
0x25h
OFF
G
R
G
Configuring memory parameters in the memory controller
0x26h
OFF
G
A
OFF
Optimizing memory controller settings
0x27h
OFF
G
A
G
Initializing memory, such as ECC init
0x28h
G
OFF
R
OFF
0x50h
OFF
R
OFF
R
Enumerating PCI busses
0x51h
OFF
R
OFF
A
Allocating resources to PCI busses
0x52h
OFF
R
G
R
Hot Plug PCI controller initialization
0x53h
OFF
R
G
A
Reserved for PCI bus
Chipset
0x21h
Memory
0x22h
Reading configuration data from memory (SPD on DIMM)
Detecting presence of memory
Testing memory
PCI Bus
0x54h
OFF
A
OFF
R
0x55h
OFF
A
OFF
A
0x56h
OFF
A
G
R
0x57h
OFF
A
G
A
0x58h
G
R
OFF
R
Resetting USB bus
0x59h
G
R
OFF
A
Reserved for USB devices
USB
ATA / ATAPI / SATA
0x5Ah
G
R
G
R
Resetting PATA / SATA bus and all devices
0x5Bh
G
R
G
A
Reserved for ATA
0x5Ch
G
A
OFF
R
Resetting SMBUS
0x5Dh
G
A
OFF
A
Reserved for SMBUS
0x70h
OFF
R
R
R
Resetting the video controller (VGA)
0x71h
OFF
R
R
A
Disabling the video controller (VGA)
0x72h
OFF
R
A
R
Enabling the video controller (VGA)
SMBUS
Local Console
Remote Console
Revision 1.0
III
SR1530AH
Checkpoint
0x78h
MSB
LSB
G
R
R
R
Description
Resetting the console controller
0x79h
G
R
R
A
Disabling the console controller
0x7Ah
G
R
A
R
Enabling the console controller
Keyboard (PS2 or USB)
0x90h
R
OFF
OFF
R
Resetting the keyboard
0x91h
R
OFF
OFF
A
Disabling the keyboard
0x92h
R
OFF
G
R
Detecting the presence of the keyboard
0x93h
R
OFF
G
A
Enabling the keyboard
0x94h
R
G
OFF
R
Clearing keyboard input buffer
0x95h
R
G
OFF
A
Instructing keyboard controller to run Self Test (PS2 only)
Mouse (PS2 or USB)
0x98h
A
OFF
OFF
R
Resetting the mouse
0x99h
A
OFF
OFF
A
Detecting the mouse
0x9Ah
A
OFF
G
R
Detecting the presence of mouse
0x9Bh
A
OFF
G
A
Enabling the mouse
0xB0h
R
OFF
R
R
Resetting fixed media device
0xB1h
R
OFF
R
A
Disabling fixed media device
R
OFF
A
R
Detecting presence of a fixed media device (IDE hard drive detection,
etc.)
R
OFF
A
A
Enabling / configuring a fixed media device
Fixed Media
0xB2h
0xB3h
Removable Media
0xB8h
A
OFF
R
R
Resetting removable media device
0xB9h
A
OFF
R
A
Disabling removable media device
A
OFF
A
R
Detecting presence of a removable media device (IDE CDROM
detection, etc.)
A
G
R
R
Enabling / configuring a removable media device
R
Trying boot device selection
0xBAh
0xBCh
Boot Device Selection
IV
0xD0
R
R
OFF
0xD1
R
R
OFF
A
0xD2
R
R
G
R
0xD3
R
R
G
A
0xD4
R
A
OFF
R
0xD5
R
A
OFF
A
0xD6
R
A
G
R
0xD7
R
A
G
A
0xD8
A
R
OFF
R
0xD9
A
R
OFF
A
0XDA
A
R
G
R
0xDB
A
R
G
A
0xDC
A
A
OFF
R
0xDE
A
A
G
R
0xDF
A
A
G
A
Revision 1.0
MSB
LSB
Pre-EFI Initialization (PEI) Core
Description
Checkpoint
0xE0h
R
R
R
OFF
Started dispatching early initialization modules (PEIM)
Initial memory found, configured, and installed correctly
0xE2h
R
R
A
OFF
0xE1h
R
R
R
G
Reserved for initialization module use (PEIM)
0xE3h
R
R
A
G
Reserved for initialization module use (PEIM)
Driver Execution Environment (DXE) Core
0xE4h
R
A
R
OFF
0xE5h
R
A
R
G
Started dispatching drivers
Entered EFI driver execution phase (DXE)
0xE6h
R
A
A
OFF
Started connecting drivers
0xE7h
R
A
A
G
0xE8h
A
R
R
OFF
Checking password
0xE9h
A
R
R
G
Entering BIOS setup
0xEAh
A
R
A
OFF
Flash Update
0xEEh
A
A
A
OFF
Calling Int 19. One beep unless silent boot is enabled.
0xEFh
A
A
A
G
DXE Drivers
Waiting for user input
Unrecoverable boot failure / S3 resume failure
Runtime Phase / EFI Operating System Boot
0xF4h
R
A
R
R
0xF5h
R
A
R
A
Exiting Sleep state
0xF8h
0xF9h
0xFAh
Entering Sleep state
A
R
R
R
Operating system has requested EFI to close boot services
(ExitBootServices ( ) has been called)
A
R
R
A
Operating system has switched to virtual address mode
(SetVirtualAddressMap ( ) has been called)
A
R
A
R
Operating system has requested the system to reset (ResetSystem ()
has been called)
Pre-EFI Initialization Module (PEIM) / Recovery
0x30h
OFF
OFF
0x31h
OFF
OFF
R
A
Crisis recovery has been initiated by software (corrupt flash)
0x34h
OFF
G
R
R
Loading crisis recovery capsule
0x35h
OFF
G
R
A
Handing off control to the crisis recovery capsule
0x3Fh
G
G
A
A
Unable to complete crisis recovery.
Revision 1.0
R
R
Crisis recovery has been initiated because of a user request
V
Appendix C: POST Error Beep Codes
SR1530AH
Appendix C: POST Error Beep Codes
The following table lists POST error beep codes. Prior to system video initialization, BIOS uses
these beep codes to inform users on error conditions. The beep code is followed by a user
visible code on POST Progress LEDs.
Table 33. POST Error Beep Codes
Beeps
3
VI
Error Message
Memory error
POST Progress Code
Description
System halted because a fatal error related to the memory
was detected.
Revision 1.0
Glossary
Glossary
Word / Acronym
ACA
Australian Communication Authority
Definition
ANSI
American National Standards Institute
BMC
Baseboard Management Controller
CMOS
Complementary Metal Oxide Silicon
D2D
DC-to-DC
EMP
Emergency Management Port
FP
Front Panel
FRB
Fault Resilient Boot
FRU
Field Replaceable Unit
LCD
Liquid Crystal Display
LPC
Low-Pin Count
MTBF
Mean Time Between Failure
MTTR
Mean Time to Repair
OTP
Over-temperature Protection
OVP
Over-voltage Protection
PFC
Power Factor Correction
PSU
Power Supply Unit
RI
Ring Indicate
SCA
Single Connector Attachment
SDR
Sensor Data Record
SE
Single-Ended
UART
Universal Asynchronous Receiver Transmitter
USB
Universal Serial Bus
VCCI
Voluntary Control Council for Interference
Revision 1.0
VII
Reference Documents
SR1530AH
Reference Documents
See the following documents for additional information:
VIII
•
Intel® Server Board S3000AH Technical Product Specification
•
Intel® 3000 Series Chipsets Server Board Family Datasheet
•
Intel® Server Chassis SR1530 AC Power Supply Module Specification
•
Intel® Server Board S3000AH/S3000AHLX Tested Hardware and OS List
•
Intel® Server Board S3000AH/S3000AHLX / Intel® Server System
SR1530AH/SR1530AHLX Spares/Parts List and Configuration Guide
Revision 1.0

Intel Server Chassis SR1530 Intel Server System

Transcription

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