to an Adobe PDF file of the presented slides.

Webinar: SEMI Americas
Quarterly Update to Members
February 2013: Q1 Update
Ray Morgan, Director of Membership
Agenda
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SEMI Update
ISS 2013 - Highlights and Insights
SEMI Programs - Chapter Report
Member Spotlight – Applied Materials
Q&A
Closing Remarks
Today’s Presenters
• Ray Morgan, Director of Outreach and Membership, SEMI
Americas
– SEMI Activity Update & ISS Highlights & Insights
– Contact: [email protected], 408.943.7047
• Lin Tso, Sr. Manager, Programs, SEMI Americas
– Chapter Report / New Regional Programs
– Contact: [email protected], 408.943.7920
• John Grisham, Director, Applied Materials, SEMI Pacific
Northwest Chapter Chair
– Applied Introduction & Success Story of New Workforce
Development Program
Agenda
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SEMI Update – SEMI Membership
ISS 2013 - Highlights and Insights
SEMI Programs - Chapter Report
Member Spotlight – Applied Materials
Q&A
Closing Remarks
SEMI & Membership
Jan, 2013
About SEMI
SEMI is a global organization representing 1,850+ member
companies who innovate, manufacture, and supply the
processes, tools, technologies, and materials that enable
advanced microelectronics for:
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Semiconductors │Photovoltaics │ High-brightness LEDs
MEMS │ Plastic │ Organic/flexible electronics │Display
SEMI exists to
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Advance the growth and prosperity of the global
microelectronics industry
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Help and support our members' technology and business
development worldwide
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Support innovation that enables faster, more powerful, and
more affordable electronic devices that enrich people's lives
SEMI Supports our Members through:
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Trade shows & Conferences
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Standards & Information/market data reports
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Initiatives/collective action & Advocacy
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Partnerships
SEMI Global Membership
1,868 Members
As of December 2012
CHINA
275 Companies
JAPAN
378 Companies
EUROPE
KOREA
279 Companies
201 Companies
AMERICAS
TAIWAN
466 Companies
233 Companies
INDIA
9 Companies
SINGAPORE
37 Companies
Driven by Members
International Board of Directors
Regional Advisory Boards
Americas
Europe
Special Interest Groups
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EHS
Silicon Manufacturers
Chemicals & Gases
Public Policy
Secondary Equipment
Test
Logistics
Japan
Korea
China
Programs Committees
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Packaging
Lithography
Process Control
Wafer Conditioning
Test
LED
PV
Event Advisory
Southeast
Asia
Taiwan
India
Standards Committees
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EHS
Physical Interface
Chemicals & Gases
Equipment Communication
Facilities
Metrics
Silicon Wafer
3DS-IC
PV
LED
WWW.SEMI.ORG – Learn More
Agenda
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SEMI Update – Global Update
ISS 2013 - Highlights and Insights
SEMI Programs - Chapter Report
Member Spotlight – Applied Materials
Q&A
Closing Remarks
2012 Membership Survey
Overall Satisfaction Rating
2009
Overall Satisfaction with SEMI Among Members
2010
- Percent Above Acceptable and Acceptable -
2011
2012
94%
91%93%
89%94%
89%
94%96%
90%
70%
69%
62%
93%94%93%
95%96%
92%
86%
95%
96%
99%
93%94%
80%
71%
68%
I am pleased to report that the
annual SEMI Customer
Satisfaction Survey shows
member satisfaction reached its
highest level since the annual rating system
was instituted eight years ago.
56%
Overall, 94 percent of the respondents rated
satisfaction with SEMI as Acceptable or
Above Acceptable, improving in nearly all
regions. Member satisfaction was nearly
identical among companies of different revenue
levels and industry segments.
Total
Japan
North America
Europe
China
Korea
SE Asia
About the Survey:
The survey was conducted in English, Japanese, Korean, and both simplified
and traditional Chinese.
Feedback was collected from nearly 1,000 members and provides a 2.7
percent margin of error with 95 percent confidence.
One of the most important outcomes confirmed
by the annual study was the critical importance
of key SEMI functional areas to member
satisfaction, especially in the areas of
exhibitions, standards, global advocacy,
market data, and membership.
Denny McGuirk, President and CEO, SEMI
The survey was administered and analyzed by Quality Resources
Partners, a market research firm with experience in the microelectronics
industry.
http://www.semi.org/MarketInfo
Semiconductor Equipment Book-to-Bill
December 2012 Statistics
Oct $742.8 million in orders; book-to-bill ratio of 0.75
Nov $718.6 million in orders; book-to-bill ratio of 0.79
Dec $924.1 million in orders; book-to-bill ratio of 0.92 (prelim)
Silicon Wafer Shipment Forecast
2012 October projections polished and epitaxial silicon
shipments to reach 8,901 million and 9,400 million square inches
in 2013, and 9,965 million square inches in 2014.
Semiconductor Equipment Outlook
2012 December projections for new semiconductor
manufacturing equipment orders $ 38.2 billion. Slight decline by
2% in 2013. In 2014, growth will resume.
Semiconductor Materials Market
Estimated $47.7 billion in 2012 and grow to $49.8 billion by 2013.
Worldwide Semiconductor Equipment Billings
Worldwide semiconductor manufacturing equipment billings
reached $9.06 billion in the third quarter of 2012. The billings
figure is 12% percent lower than Q2 2012 and 15% lower than
the same quarter a year ago.
All data is as of December 2012 and is US$ if not otherwise noted
Global Expositions and Events
SEMICON Europa 2012 (October)
Dresden, Germany. With more than 4,100 visitors and exhibitors in
attendance and over 340 companies exhibiting
Plastic Electronics 2012 (October)
Co-located with SEMICON Europa for the third consecutive year,
Plastic Electronics 2012. The event covered OLEDs (for Display
and Lighting), Flexible and Organic PV, integrated smart systems
and focused on transferring technology into volume manufacturing.
Strategic Materials Conference (SMC) 2012 (October)
Held at SEMI HQ in San Jose,CA, this event is the only
conference dedicated to exploring the synergies, trends and
business opportunities in advanced electronic materials. Over 130
attended the conference
PV Taiwan 2012 (October)
8,000+ visitors from 60 countries. A total of 119 one-on-one trade
meetings were arranged for 40 foreign buyers during the 3-day
show which was expected to generate more than US$ 120 million
in immediate and future business deals.
China LED Manufacturing Conference 2012 (October)
On October 19 in Shanghai, co-organizers SEMI and Swagelok
presented the 2012 China LED Manufacturing Conference.
International Technology Partners Conference
(ITPC) 2012 (November)
27th International Technology Partners Conference
(ITPC). Industry leaders from all over the globe
convened to discuss and collaborate on global
manufacturing, technology and trade issues for the
semiconductor and adjacent industries.
SEMICON Japan 2012 and PVJapan 2012
(December)
December 5-7 34,145. Over 850 companies
exhibited at the combined show. Hot topics
included, Power Semiconductors, 3D-ICs, Printed
Electronics, 450mm, EUV, and MEMS.
PVJapan 2012 (December)
PVJapan 2012 was held concurrently with
SEMICON Japan, featuring 196 exhibiting
companies and total attendance of 11,000 from
eight countries.
Americas Regional Events
Arizona Breakfast Forum: In Chandler, Arizona on October 11,
Microchip Technology Inc. hosted the Breakfast Forum with speakers
from AZ Technology Council, OEM Group, IC Insights, and Microchip
Technology. Over 80 attended the event.
WEBINARS
Outlook on the Semiconductor Manufacturing
Industry: On December 11, Lara Chamness and
Chris Dieseldorff, both from the Industry Research
and Statistics group at SEMI, presented outlooks at
the webinar.
SEMI Professional Development Seminar: In Corvallis, Oregon on
October 26, over 65 STEM major students participated in the "Jobs in
the Micro- and Nano-Electronics Industry: Connecting Students to
Industry" half-day event that was co-sponsored by SEMI, Oregon State
University, participating SEMI member companies, Oregon
Nanoscience and Microtechnologies Institute, and Pacific Northwest
National Laboratory.
Opportunities in the Turbulent Photovoltaic
Equipment Market: On December 13, Fatima Toor
from Lux Research presented at the webinar.
SEMI Austin Annual Industry Outlook Forum: In Austin, Texas on
October 30, the annual SEMI Austin Industry Outlook Forum featured
speakers from Gartner, IC Insights, Perryman Group, SEMATECH,
Stratfor Global Intelligence, and Tokyo Electron. Over 85 people
participated in the event.
SEMI Americas Quarterly Update for Members
(Nov 14): Ray Morgan moderated the webinar. The
"Member Spotlight" was on Entegris with guest
speaker Paul Rosenfeld from the
Microenvironments Division. Dan Tracy, SEMI
Industry Research and Statistics, presented a
Market Update/Fab Activity (with 450mm).
SEMI Pacific Northwest Dinner: In Portland, Oregon on November 8,
SEMI presented "Advanced Electronic Materials: Highlights,
Challenges, and Outlook." Over 90 attended the event which featured
presentations from Air Products, FEI, Intel, and Techcet Group.
http://www.semi.org/Standards
Emerging Standard Segment Areas Shown (Q4 2012)
PHOTOVOLTAICS
In Ballot – Specifications for:
• Package protection technology for PV Modules
• Test Method for the content of Vinyl Acetate (VA) in Ethylene-Vinyl
Acetate (EVA) applied in PV modules --Thermal Gravimetric Analysis
(TGA)
• Impurities in Polyethylene Packaging Materials for Polysilicon Feedstock
• Quasi-monocrystalline Silicon Wafers used in Photovoltaic Solar Cells
• Anti-reflective-coated Glass, Used In Crystalline Silicon Photovoltaic
Modules
PV Automation
Published - Specification
SEMI PV35-1012 - Horizontal Communication Between Equipment for
Photovoltaic Fabrication System (tool to tool in flow communications)
PV Materials
Proposals
• Test Method for Measurement of Cracks in PV Silicon Wafers in PV
Modules by Laser Scanning
New
• Test Method for the Measurement of Oxygen Concentration in PV Silicon
Materials for Silicon Solar Cells by Inert Gas Fusion Infrared Detection
Method; PV43-0113.
• Test Method for In-Line Measurement of Waviness of PV Silicon Wafers
by a Light Sectioning Technique Using Multiple Line Segments. PV420113
• Specification for Orientation Fiducial Marks for PV Silicon Wafers
3DS-IC
In Ballot:
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Specification for Glass Carrier Wafers for 3DS-IC
Application
Test Method for Measuring Warp, Bow and TTV on
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Silicon and Glass Wafers Mounted on Wire Grids by
Automated Non-Contact Scanning using Laser
Scanning Interferometry
Proposals
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Guide for Incoming/Outgoing Quality Control and
Testing Flow for 3DS-IC Products3D-IC
Working Group News
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Study Group meeting was held on December 6 in
conjunction with SJ2012. 30 people participated.
Current global activities were introduced and future
directions discussed. Standardization on thin wafer
bending strength measurement is candidate for future
activities.
HIGH-BRIGHTNESS LED
In Ballot
• Specifications for Sapphire Wafers Intended for Use for
Manufacturing High Brightness-Light Emitting Diode
Devices
www.semi.org/press
SEMI Europe addresses national governments on the importance of
III-V compounds
Key Points; SEMI Europe addressed a meeting of national ministries to
explain how III-V compounds are irreplaceable when it comes to delivering
the fast, smart and efficient devices
Distributed PV Application and Commercialization Forum
Key Points: Stakeholder meetings in China to discuss PV policy incentives,
industry upgrades, techno-economy, management and market
mechanisms.
SEMI Applauds Approval of Permanent Normal Trade Relations
(PNTR) for Russia
Key Points: In December, SEMI praised Congressional leadership as the
U.S. Senate passed legislation (92-4 vote) to normalize trade relations with
Russia.
SEMI North American Advisory Board Commits to Corporate Tax
Reform Principles
Key Points: Lower top corporate tax to be closer to the average rate of
25.1% for industrialized nations. Retention of innovation polices like the
R&D tax credit. Shift to a territorial tax system.
SEMI Submits Comments on Renewable Energy Trade to U.S.
International Trade Commission.
Key Points: Supply chain importance, impact on jobs, elimination of tarrifs.
SEMI Export Control Working Group Holds Inaugural Meeting
Key Points: The ECWG serves to monitor U.S. policies governing the trade
of dual-use goods. The group openly advocates for policies which promote
innovation and growth within the industry, while supporting national
security concerns.
SEMI Publishes Regulatory Summary of the New U.S. Conflict
Minerals Regulation
Key Point: SEMI Conflict Minerals Working Group reviewed and
provided feedback to new regulatory language on SEC requirements
for U.S. and foreign companies to report on the conflict-minerals
content of their products.
SEMI Hosts EHS Regulatory Compliance Seminar at SEMICON
Japan 2012
Key Point: At SEMICON Japan, SEMI held a regulatory compliance
seminar. Topics included the U.S. Conflict Minerals Legislation and
changes to the European RoHS Regulation.
Global Environment Symposium at SEMICON Japan 2012
Key Point: At SEMICON Japan seminar. Topics included energy and
water conservation and green house gas (GHG) emission abatement.
EHS Technical Content Shared at SEMI China LED Manufacturing
Workshop
Key Point: SEMI hosted a technical seminar at full-day technical and
business seminar in Shanghai on EHS and manufacturing issues.
CAST Elects New Leadership to Address Future of
Semiconductor Test
In November, the Collaborative Alliance for Semiconductor Test
(CAST), a SEMI special interest group, elected new leadership to
advance their mission to develop, accelerate and support industrywide advances in semiconductor test
Preview & Highlights
SEMICON West
SEMICON West is the largest
microelectronics manufacturing
exposition in North America.
Engineers, fab managers, and executives from across
the microelectronics industry and around the world
recognize SEMICON West as the premier forum for
discovering new technologies, sourcing solutions,
and connecting with suppliers and partners who can
move their innovations forward.
Participants will find key customers and buyers from
across the microelectronics supply chain— from
materials to final manufacturing and semiconductors
to high brightness LEDs— who will help you grow
your business.
Intersolar North America is co-located with
SEMICON West.
SEMICON West Visitor Profile
Total 2012 Verified Attendance = 17,800
Influential Buyers
70% of visitors say that what they see
and who they meet at SEMICON
West influences their buying decisions
over the next 12 months.
2013 Technology Themes— The Power of [X]
[Wafer Processing]
– Manufacturing nonplanar
transistors
– Advanced lithography
– 450mm wafer processing
– Advanced materials and
processes
[Productivity Innovation]
– Productivity technology for
existing fabs
– Equipment and materials
management
– Secondary equipment and
solutions
[Test and Packaging]
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Semiconductor test strategies
Probe card technology
Trends and opportunities in 3D IC
Advanced packaging materials and
technologies
[Extreme Electronics]
– Lab-to-fab: R&D to high-volume
manufacturing
– MEMS manufacturing and
technology
– High Brightness LED manufacturing
– Printed and flexible electronics
What’s New for 2013
• Increased focus on R&D & Innovation
• Silicon Innovation Forum
• R&D Keynote Panel Wed. morning with SEMATECH, CEA-Leti,
and imec
• “Lab to Fab” session in Extreme Electronics
• Themed networking on the show floor
• Fab Productivity, LED, Advanced Packaging
• Bulls and Bears Investor Panel
• Regional advisory boards get-together
• Global intellectual property event
• SEMI Executive Panel
http://www.semiconwest.org/sif
The Silicon Innovation Forum (SIF) will address these global
dynamics and showcase current, emerging and potential solutions to
accelerating R&D and supply chain innovation in this newlyconstrained world.
The Forum will highlight both short-term business opportunities for
early /mid-stage companies, R&D entrepreneurs from larger
companies, and other industry innovators—while addressing longterm structural changes to the industry necessary to foster a healthy
innovation pipeline.
Exhibit Showcase
The Forum will provide a stage for new and emerging innovators,
industry leaders, strategic investors, and venture capitalists to discuss
the needs and requirements of the industry’s innovation engine, and
provide insights into technology, capital, partnership, and
collaboration strategies necessary for mutual success.
Conference
THE FORUM
http://www.semi.org/EventsTradeshows
Partial List
Feb 24-26: ISS Europe 2013 (Milan, Italy)
Mar 10-12: 7th PV Fab Managers Forum 2013 (Berlin, Germany)
Mar 19-21: SEMICON China 2013 (Shanghai, China)
Mar 19-21: FPD China 2013 (Shanghai, China)
Mar 19-21: SOLARCON China 2013 (Shanghai, China)
Mar 20: SEMI Northeast Forum (Billerica, MA)
Mar 31-Apr 4: SEMI North America Standards Spring Meetings (San Jose, CA)
May 7-9: SEMICON Singapore 2013 (Marina Bay Sands, Singapore)
May 14-16: ASMC 2013 (Saratoga Springs, NY)
Jun 5-6: SEMICON Russia 2013 (Moscow, Russia)
Jun 19-21: Intersolar Europe 2013 PV Prod & Technologies (Munich, Germany)
Jul 9-11: SEMICON West 2013 (San Francisco, CA)
Jul 9-11: Intersolar N. America 2013: PV Prod & Technologies (San Francisco, CA)
Agenda
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SEMI Update
ISS 2013 - Highlights and Insights
SEMI Programs - Chapter Report
Member Spotlight – Applied Materials
Q&A
Closing Remarks
• Industry Strategy Symposium
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Event Overview
Intel Presents 450
Highlights 2013
Committee Team
Who Attends ISS
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Chairmen
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CEO
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President
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Executive Vice President
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Other Senior Executives
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Financial Analysts
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Consulting firms
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Market Researchers
ISS 2014
January 12-15
The Ritz Carlton
Half Moon Bay, CA
Contact: Agnes Cobar
Programs Manager, SEMI
Email: [email protected]
Introduction
• The SEMI Industry Strategy Symposium (ISS) examines global
economic, technology, market, business and geo-political
developments influencing the semiconductor processing
industry along with their implications on strategic business
decisions.
• For more than 35 years, ISS has been the bellwether
semiconductor conference for senior executives to acquire
the latest trend data, technology highlights and industry
perspective to support business decisions, customer
strategies and the pursuit of greater profitability.
• ISS 2013 topics examined opportunities created by the next
wave of the digital revolution including insights and
perspectives into how key imminent technology decisions
will impact the ecosystem, transform the semiconductor
industry in the next decade, and ensure prosperity up and
down the supply chain.
Who Attends ISS
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Chairmen
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CEO
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President
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Executive Vice President
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Other Senior Executives
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Financial Analysts
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Consulting firms
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Market Researchers
ISS 2014
January 12-15
The Ritz Carlton
Half Moon Bay, CA
Contact: Agnes Cobar
Programs Manager, SEMI
Email: [email protected]
Intel – 450mm
Intel presents fully patterned
450mm silicon wafer @ ISS 2013
Robert E. Bruck, corporate vice president and
general manager of Technology Manufacturing
Engineering (TME), Intel Corporation, and Intel
450mm Equipment Program Manager Mario
Abravanel make the first public presentation of a
fully patterned 450mm silicon wafer at the SEMI
Industry Strategy Symposium (ISS) on January
15, 2013.
Bruck said the wafer was patterned with 26nm
features using nano imprint lithography and that
thousands of similar wafers will be made available
in the coming quarters to suppliers engaged in
450mm tool development.
Source: SEMI ISS2013 & “Highlights” @ www.semi.org
At ISS 2013 - Intel Receives the SEMI Award for a Process and
Technology Integration Breakthrough — the High-k Solution
The Intel team was honored for their contribution to the first
development, integration and introduction of a successful high-k
dielectric and metal electrode gate stack for CMOS IC production,
first implemented at the 45nm node in 2007.
The Team
Mark Bohr, senior fellow and director of Process Architecture and Integration, Logic
Technology Development, Intel
Robert Chau, senior fellow and director of Transistor Research and
Nanotechnology, Components Research, Intel
Suman Datta, professor, Electrical Engineering, Pennsylvania State University*
Mark Doczy, senior engineer in Advanced Transistor and Nanotechnology Group,
Components Research, Intel
Brian Doyle, principal engineer in Advanced Transistor and Nanotechnology Group,
Components Research, Intel
Tahir Ghani, fellow and director of Transistor Technology and Integration, Logic
Technology Development, Intel
Jack Kavalieros, principal engineer in Advanced Transistor and Nanotechnology
Group, Components Research, Intel
Matthew Metz, senior engineer in Advanced Transistor and Nanotechnology Group,
Components Research, Intel
Kaizad Mistry, vice president and director of Logic Technology Integration, Logic
Technology Development, Intel
Agenda – Day 1
Opening Keynote
Transforming the Semiconductor Industry to Meet the Demands of a New Era
Ajit Manocha, CEO Global Foundries
Session 1: Economic and Market Trends
Session Keynote: Dr. John C. Williams
President and CEO, Federal Reserve Bank of San Francisco
"Heavy Lifting"- A Global Economic Overview for 2013
Bruce Kasmank Chief Economist and Managing Director of Global Research, JP Morgan
Geopolitical Outlook 2013: Crises of Leadership and Balances of Power
Matthew Gertken, University of Texas at Austin
The “New” IC Industry Cycle Model
Bill McClean, IC Insights
Session 2: Semiconductor Markets Session Keynote: Semiconductor Markets in 2020: Perils and Opportunities
Andy Oberst, Senior VP, Strategy & Corporate Development, Qualcomm
Semiconductor Demand Mapped on the Compute, Communication and Storage Continuum
Satya Kumark, Director, Credit Suisse
Intel - Michael Bell
Vice President, General Manager, Mobile and Communications Group, Intel Corporation
It's Now a Mobile World: So What's Next?
Simon Segars, President, ARM
IMFT Joint Venture and the Evolution of Flash Memory
Keyvan Esfarjani, Intel Vice President, Technology & Manufacturing Group, Co-CEO, IM Flash Technologies
Ajit Manocha, CEO of GLOBALFOUNDRIES
Transforming the Semiconductor Industry to Meet the
Demands of a New Era
Highlights
• Ajit discussed the dynamic technology and economic needs of mobile computing that is
driving new approaches to the chip design-to-production cycle.
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Calling it “Foundry 2.0,” Ajit sees outsourced semiconductor manufacturing moving toward a more IDMlike model, creating new collaboration models and techniques to close the gap between process teams at
foundries and design teams at the fabless companies.
Other Key points:
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The Industry faces daunting technical challenges like 3D stacking, 450mm fabs, new transistor
architectures, multi-patterning, and the uncertainties to lithography-based scaling, product
development paths with virtual teams will evolve and adapt rapidly in the coming months and years.
With new fabs now costing upwards of $8 billion and leading-edge manufacturing investments
expected to exceed $40 billion this year alone, global economic trends and forces — increasingly
influenced by uncertain consumer spending in both developed and emerging markets — have never been
more important to the semiconductor ecosystem.
Dr. John C. Williams, President and CEO of the Federal
Reserve Bank of San Francisco (Full Presentation Text)
– “Many businesses are locked into a paralyzing state of anxiety.”
– Williams used the ISS conference to lessen uncertainty and anxiety in the
capital markets, pledging to keep interest rates near zero until the
unemployment rate drops to 6.5 percent, as long as inflation expectations do
not climb above 2.5 percent.
Bruce Kasman, Chief Economist and Managing Director of
Global Research, J.P. Morgan
– Bruce on the economic outlook. “A positive economic outlook, especially in
the second half of the year, that is “bumpy, better and less risky.””
– Bruce sees Asia leading the economic rebound, as China demand accelerates
with the change in leadership and improved access to credit.
Matthew Gertken, University of Texas Austin Churchill scholar
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Discussed the simmering “Asian cold war” developing as territorial disputes with China
generate an emerging “containment policy” by many of China’s neighbors.
Andy Oberst, senior VP, Strategy and Corporate Development at Qualcomm
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Looked at what mobile phones would likely look like in 2020, but also pointed out how
disruptive changes — not incremental changes — have always driven the mobile phone market.
Satya Kumar, vice president at Credit Suisse
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Discussed how original equipment makers like phone and computer manufacturers have always
benefitted from the declining cost of transistors and pondered, “Could stopping Moore’s Law be
a good thing?”
Michael Bell, vice president, general manager, Mobile and Communications Group at
Intel
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Brought the audience up to date on the company’s mobile strategy, offering confidence that
Intel’s portfolio of RF baseband technologies, leading-edge scaling performance, and supply chain
excellence will ultimately deliver significant success.
Agenda – Day 2 (AM)
Session 3: Supply Chain
Intel - Robert Bruck
Vice President, General Manager, Technology Manufacturing Engineering
TEL's Perspective on Supply Chain
Tetsuro Higashi, Chairman of the Board, Tokyo Electron Limited
Deep Supplier Collaboration
Donald Esses, Vice President, Operations and Quality, Qualcomm
Samsung Semiconductor - Ana Hunter
VP of Foundry Services
The Emerging Consequences of Materials within the Electronics Ecosystem
Wayne Mitchell, Vice President, General Manager, Electronics, Air Products
Supply Chain Panel
Moderator, G. Dan Hutcheson, VLSI Research
Ana Hunter, Samsung Semiconductor
Robert Bruck, Intel
Donald Esses, Qualcomm
Tetsuro Higashi, Tokyo Electron
Wayne Mitchell, Air Products
Agenda – Day 2 (PM)
Agenda – Day 3
Session 5: Opportunities at the Edge
Session Keynote: Cognitive Systems and the Emergence of a New Era of Computing
Dario Gil, Director, Industry Solutions, IBM Research
Utility Scale Solar Power Projects
Peter Carrato, Fellow, Bechtel Corporation
Innovation in Technology Saturated Vehicles
Kal Gyimesi, IBM Software Group, Industrial Sector Offering Leader, IBM
“I’d Like That with Chips Please”
Andrew Thompson, Founder and CEO, Proteus Digital Health
Session 6: Streetviews Panel
Moderator: Klaus Rinnen, Managing VP, Gartner
Joseph Dews, Partner, AGC Partners
Jason Hutchinson, Managing Director, Head of the Technology Group, Houlihan Lokey
Mahesh Sanganeria, Director, RBC Capital Markets
Isaac Sudit, Vice President and Investment Analyst, The Capital Research Global Investors
ISS 2013 Organizing Committee
Agenda
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SEMI Update
ISS 2013 - Highlights and Insights
SEMI Programs - Chapter Report
Member Spotlight – Applied Materials
Q&A
Closing Remarks
SEMI Americas Regional Programs
February, 2013
Lin Tso
SEMI Americas
Regional Chapters
Arizona
Austin
Northeast
Pacific Northwest
Chair-April Rossrucker
Vice-Chair- Lisa Neeley
Chair-Ken Parmerter
Vice-Chair- Greg Sajbel
Chair- Jim Brown
Vice-Chair- Rob Nine
Chair-John Grimshaw
Vice-Chair- Rudy Kellner
The Regional Chapter’s goal is to identify, prioritize, and help solve
challenges impacting SEMI members around the following key
themes:
• Workforce Development/Education
• Technology and Innovation
• Regional Stakeholder Outreach
40
Importance of Education/Workforce Development
• Workforce development is an important initiative for our SEMI
members. We must prepare the microelectronics workforce
with a pipeline of skilled workers. At the same time, thought
leaders must inspire tomorrow’s workforce to choose careers in
our industry.
• That is the goal of the workforce development and education
activities and was the motivation towards creating a new “SEMI
Professional Development Seminar” program
SEMI Professional Development Seminar
• The SEMI Pacific Northwest Chapter organized the SEMI Professional
Development Workshop to connect College Students to semiconductor
and related high technology industries.
• SEMI invited Industry Professionals with broad educational backgrounds
and work experience to provide college students with real world
perspective. Delivered valuable information in a face to face workshop.
Helped students to choose their career direction and provided guidance
in their particular field of interest.
• Provided college students with a look at career opportunities in the
Semiconductor industry and to help excite college students about career
opportunities in the high tech industries.
• The SEMI Pacific Northwest Chapter held the first seminar at Oregon
State University last October, 2012.
• The SEMI Northeast Chapter held their first seminar at Northeastern
University in February, 2013.
SEMI Professional Development Seminar
• The Seminar covered:
• Overview of careers in high tech, sought after degrees and
skill sets
• First hand discussions with engineers, marketing and sales,
management, finance, recruiting and human resources.
• The best approach to resumes and cover letters
• Common Interview Questions and Answers
• Preparing for the interview, tips on behavior, what to wear,
etc.
• Learning and Networking with High Tech Industry Experts
• Questions and Answers
Seminar Agenda
8:30am
8:35am
8:45am
Introduction ~ Seminar Chairperson, FEI
Overview of SEMI ~ President of SEMI Americas, SEMI
Jobs in the Micro- and Nano-Electronics and High-Tech Semiconductor
Industry
9:45am
10:00am
10:40am
11:40pm
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Break
Strategies for Landing a Job in High Tech
The Interview Process: Telephone and Face-to-Face Interview Formats
Breakout Sessions
Day in the Life of a High Tech Engineer--Hear about the semiconductor industry from Applied
Materials and Intel engineers
Working on the Business Side--Using your technical skills for a career in sales, marketing and human
resources
Jump-start your career--Commandeering a successful job search
Is a career in High-Tech Startups, Business Operations, and General Management right for me?
Managing people and the bottom line
SEMI Professional Development Seminar
Oregon State University, Oregon
• Attendance, 45 undergrads, grad students and Ph.D. candidates from
Oregon State University (OSU), the University of Oregon, and the
University of Washington
• Very well received, especially the talks delivered by industry experts
Northeastern University, Boston
• Attendance, 35 Students
• Instructors are all volunteers from High Tech Semiconductor Industries
such as Applied Materials, Entegris, Intel Corporation, TEL/NEXX Systems
and others. They hold positions at these companies in Human Resources,
Recruiting, Engineering, Marketing, Finance and Management, and Business
Development.
SEMI SEMINAR AT OSU
Testimonials
1.
Thank you for the opportunity to meet with Professional Leaders in the
semi-conductor industry. I learned a lot of valuable information and
insight into the hiring process for these companies. I commend these
wonderful, highly accomplished people for taking the time to offer their
advice to those of us just starting out. I highly recommend continuing to
organizing events like these. It was very inspirational, educational and a
wonderful opportunity to meet with successful pioneers who have been
in our shoes. If future events occur, I would definitely like to participate
and attend. Again, thank you so much for making this event happen!
2.
I was attending SEMI seminar on Friday. It was a great opportunity for
students to know more about industry and get to talk with people from
various positions in companies. I got inspired and learned a lot. Thanks
for making this happen! Hope more events similar coming. Have a great
day!
Call for Participation
Upcoming Professional Development Seminars will take place in the
Fall of 2013…Opportunities for Industry Professional Volunteers,
Sponsors, Venue Hosting, etc…
If you are interested in participating…please contact Lin Tso,
Email: [email protected]
408-943-7920
Agenda
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•
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•
•
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SEMI Update
ISS 2013 - Highlights and Insights
SEMI Programs - Chapter Report
Member Spotlight – Applied Materials
Q&A
Closing Remarks
Applied Materials – At A Glance
* As of November 14, 2012. Fiscal year-end October 28
** Excluding temporary and interns
Professional Development Seminar
• Our Challenge:
– Bring Educational Institutions and Industry Professionals together to enable pathway for
student career success
• How did SEMI help?
– SEMI Pacific Northwest Steering Committee – reinvigorated in Dec’11
– Charter formed with educational enhancement in mind, SEMI helped share learning from past
involvement to develop programs
– Sub-team formed to drive development of Profession Development concept involving many
member companies
– SEMI leadership helped kickoff first seminar with 45 students attending at Oregon State
University
• The Result:
– Students received a full day of “real world” knowledge from Industry Leadership.
– Students connecting with Companies for future career opportunities – Excellent for both the
Students and the Member Companies
Agenda
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•
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•
•
•
SEMI Update
ISS 2013 - Highlights and Insights
SEMI Programs - Chapter Report
Member Spotlight – Applied Materials
Q&A
Closing Remarks
Agenda
•
•
•
•
•
•
SEMI Update
ISS 2013 - Highlights and Insights
SEMI Programs - Chapter Report
Member Spotlight – Applied Materials
Q&A
Closing Remarks
Driving the Electronics Revolution
Thank You.