Our Catalog - Practical Components

Transcription

Distributor of mechanical IC samples
(dummy components), test boards, kits and
SMD production tools and equipment.
Frequently Asked Questions
What are dummy components?*
What is a PCB Practice Kit?
Dummy components are the exact mechanical equivalent of
functional electronic components.
A PCB Practice Kit contains both the PC practice board and the
necessary dummy components so customers can conduct assembly process evaluation without using high-cost, live components
and functional PC boards. Kits are available in a single pack for
employee hand soldering training or packaged for production
equipment evaluation. Both X, Y Theta data and Gerber data are
available without charge.
Why use dummy components?
Dummies save money. In cases where only mechanical characteristics are required, dummy components can be used instead of
live functioning components. Since there is no expensive die
inside the package, the cost for performing mechanical testing is
significantly lower.
Who is Practical Components?
Practical Components is a team of dedicated electronic industry
professionals offering value pricing, on-time delivery, and superior service to our customers. The Practical Components team is
ready to provide project assistance in the areas of technical component knowledge, drawings, component land patterns, and PCB
practice kits.
What other products are offered by
Practical Components?
In addition to dummy components, Practical carries solder training aids, tools and related equipment, IPC products and designs
custom printed circuit boards. Your sales representative can supply technical information and pricing on all our products.
Who uses dummy components?
Companies that are involved with electronic component assembly, testing, evaluation and employee training.
Contact Practical Components
If you have any additional questions concerning
Practical Components, our products or policies, please
contact us.
Practical Components, Inc.
10762 Noel Street
Los Alamitos, CA 90720 USA
Tel: 1-714-252-0010
Fax: 1-714-252-0026
E-mail: [email protected]
Web Site: www.practicalcomponents.com
Main E-mail��[email protected]
Sales...........................................................................Russell Kido / [email protected]
Sales �� Kym Bell / [email protected]
Sales...................................................................... Lisa Laphen / [email protected]
Technical Support��[email protected]
Purchasing/Distributors��Deanne Herman / [email protected]
President......................................................... Kevin Laphen / [email protected]
*Disclaimer: Dummy components are only to be used for evaluation and
testing purposes. Practical Components is not responsible for product
that is used as a “live” package using live die assembly. Dummy samples
are not to be used for 1st reliability testing.
Practical Components is the exclusive distributor of
Amkor Technology Mechanical Components.
How To Place Your Order
Our sales staff is ready to serve you from 8:00 A.M. to 5 P. M.
Pacific Standard Time, Monday through Friday. Our fax lines
are open 24 hours every day.
Fax and E-mail orders received after normal business hours
are processed the next business day. Please include your
telephone and fax numbers so we can confirm your order.
Bill / Remit to:
PO Box 1037
Los Alamitos, CA 90720-1037 USA
Ship to:
10762 Noel Street
Los Alamitos, CA 90720 USA
Tel: 1-714-252-0010
Fax: 1-714-252-0026
Web Site: www.practicalcomponents.com
F.O.B. is Los Alamitos, CA USA
Product Liability: Practical Components’ sole obligation for products
that prove to be defective within 10 days of purchase will be replaced or
refunded. Practical Components gives no warranty either expressed or
implied and specifically disclaims all other warranties, including warranties for merchantability and fitness.
In no event shall Practical Components’ liability exceed the buyer’s
purchase price nor shall Practical Components be liable for any indirect or
consequential damages.
Shipment Damage: Merchandise is carefully packaged in compliance
with carrier requirements. Claims for loss or damage in transit must be
made with the carrier by the customer. All shipments should be unpacked
and inspected immediately upon receipt. If damage does not become apparent until shipment is unpacked, make a request for inspection by the
carrier’s agent. Failure to do so will result in the carrier refusing to honor
the claim.
Non-Catalog Items: Merchandise not listed in our catalog, if available
from our suppliers, may be subject to minimum order quantities and/or
special handling charges. Shipment is made as quickly as deliveries are
received from our suppliers. Special order products are sold on a nonreturnable basis.
Quotations: All items are subject to prior sale. A quote is valid for
30 days.
Dishonored Check Policy: If a check you give us as payment is dishonored for any reason by the bank or any other institution on which it is
drawn, you agree to pay us $20.00 as a service charge. In addition, you
agree to pay any other reasonable charges imposed by any check verification company or collection agency that we may use for collection.
Terms and Conditions
Prices/Quantities: Prices are subject to change without notice and
quantities may be limited.
Out Of Stock Items: Items not available for immediate shipment will
be shipped as they become available. Items not available at the end
of 90 days will be cancelled. The number of back-ordered days may be
extended beyond 90 days with customer approval.
Handling Charge: A $10.00 handling charge applies to all orders less
than $50.00.
Return Policy: Returns must be made promptly and accompanied by a
return authorization number. Please contact a customer service representative to obtain a return authorization number. All returns must be made
within 30 days of date of invoice and accompanied by return authorization number.
 Return freight charges must be prepaid.
 C.O.D. returns cannot be accepted.
 Return merchandise in original packaging and in
resalable condition.
 Please note that items returned due to customer error may be subject
to a restocking charge of 25%.
 Non-catalog items are not returnable.
Catalog Listings: Not all products listed in this catalog are maintained
in stock, and all product specifications for each product are current as of
the date of publication. Product listings, specifications and prices for each
product are subject to change without notice.
Terms: We accept Visa, MasterCard and American Express
(minimum order is $50.00).
Open Account: We bill on a net 30–day basis to customers with
approved credit.
Large Quantity Quotations: Practical Components will be happy to
quote quantities in excess of the amounts shown in the catalog.
Freight Charges: On open accounts, actual freight charges are added
to the invoice. A packing and handling fee of $5.00 is added to the order.
C.O.D accounts will have the freight charges pre-billed to the C.O.D. total
in addition to a $5.00 packing and handling charge.
Tray Charge: A $7.50 tray charge is added if customer orders less than a
full tray quantity.
Special Requirements: Please include specific instructions if you require
special packing, marking, shipping, routing or insurance.
*All prices are in USD ($).
Contents
Flip Chips
CSPnl (RDL) Wafer Level Package-Amkor Technology.......................4
eWLP Wafer Level Package-Amkor Technology..................................5
Flip Chip—Pac Tech......................................................................................... 6
PC310 Pac Tech Flip Chip Test Die Kits...................................................... 7
WLP Wafer Chip Size Package...................................................................... 8
Flip Chips............................................................................................................10
Flip Chip Test Die Kit......................................................................................12
Customized Wafer Bumping.......................................................................13
Ball Grid Array
.3mm CVBGA Very Thin ChipArray®-Amkor Technology ................14
PCB368- .3 mm Pitch CVBGA Evaluation Board...................................15
CVBGA Very Thin ChipArray® BGA—Amkor Technology.................16
CTBGA ChipArray® Thin Core BGA—Amkor Technology.................17
CABGA ChipArray® BGA—Amkor Technology......................................18
Land Grid Array
LGA Land Grid Array—Amkor Technology........................................................... 19
Industry Acronyms
Industry Acronyms.........................................................................................20
Through Mold Via
TMV® PoP Through Mold Via Pkg—Amkor Technology...................23
PCB250 TMV® 14mm Drop Test Board —Amkor Technology.........27
Package on Package
PoP Package on Package —Amkor Technology.................................28
PC200 PoP 12mm Lead Free-Test Kit—Amkor Technology............37
14x14mm Package on Package (PoP)- Amkor Technology ............38
PC200 PoP 14mm Lead-Free Test Kit.......................................................41
Ball Grid Array
PBGA 1.0mm Pitch—Amkor Technology...............................................42
PBGA 1.27mm Pitch—Amkor Technology.............................................43
SuperBGA®—Amkor Technology...............................................................44
OmQFN
OmQFN Open-Molded Quad Flat Pack No Leads—Quik-Pak........45
MicroLeadFrame
MLF® MicroLeadFrame®—Amkor Technology.....................................46
Dual Row MLF®—Amkor Technology.....................................................47
Quad Flat Packs
TQFP Thin Quad Flat—Amkor Technology...........................................48
LQFP Low Profile Quad Flat Pack—Amkor Technology....................49
QFP Quad Flat Pack—Amkor Technology.............................................50
CQFP Ceramic Quad Flat Pack....................................................................51
LCC Leadless Ceramic Carrier.....................................................................51
Daisy-Chain Patterns.....................................................................................52
Dual Packages
PLCC Plastic Leaded Chip Carrier..............................................................53
SOIC/SOJ Small Outline Integrated Circuit............................................54
TSOP Type I & Type II Thin Small Outline Package—Amkor Tech.55
TSSOP Thin Shrink Small Outline—Amkor Technology...................56
SSOP Small Shrink Outline Package—Amkor Technology..............57
Ceramic Chip Pad Components
Ceramic Chip Pad components.................................................................58
Passives, Resistors, Discretes
MELF Resistors Metal Electrode Leadless Face..................................58
SMR Lead-Free Surface Mount Resistors................................................59
SMC Lead-Free Surface Mount Ceramic Capacitors .........................60
SME Surface Mount Electrolytic Capacitors..........................................61
MELF Diodes Metal Electrode Face Component Diodes..................61
SMT Lead-Free Surface Mount Transistors............................................62
SMTA Surface Mount Molded Tantalum Capacitors..........................64
Through-Hole
PDIP Plastic Dual In-line Pkg.......................................................................65
Through-Hole Glass Diodes........................................................................65
TO Through-Hole Transistors......................................................................66
Axial Leaded Resistors...................................................................................66
CD Case Display
Dummy Component Display Case...........................................................67
Tape and Reel
CTReels Empty Carrier Tape Reels............................................................68
Tape and Reel Specifications......................................................................69
Printed Circuit Boards and Kits
Custom PC Practice Boards and Kits........................................................70
CircuitCAM™ Software—Aegis Industrial Software...........................71
Kit Identifier (component part/kit numbers)........................................72
Single Pack Hand Solder Kits......................................................................75
Conformal Coating Process Flow Chart..................................................76
Test Boards for Cleanliness and Conformal Coating..........................77
SIR Test Board and Kit....................................................................................80
SMTA Saber Evaluation Board and Kit.....................................................81
PC052 B-52 CRET Rev B Cleanliness & Residue Eval. Test Kits ........82
B-52 CRET Cleanliness & Residue Eval Kit...............................................84
PC000 Lead-Free Zero-Ohm SMD Resistor Board and Kit...............86
PC2009 AIM Print Test Board and Kit—AIM..........................................87
PC003 Solder Practice Board and Kit.......................................................88
PC005 BGA Variable Pitch and Array Board and Kits.........................89
PC007 MLF® Test Board and Kits................................................................90
PC008 Solder Practice Board and Kits.....................................................92
PC009 Mixed Technology Board and Kit................................................94
PC011 BGA Fine Pitch Board and Kit.........................................................95
PC012 BGA Global Daisy-Chain Test Kit..................................................96
PC013 Through-Hole Solder Training Kits.............................................98
PC014 IPC 9850 Attribute Defect Rate Kit..............................................99
PC015 Rework Kits........................................................................................ 100
PC016-J-STD IPC Compliant Hand Soldering Kit...............................101
WTK-1 Terminal and Wire Kit................................................................... 102
IPC/WHMA-A620 Wire Harness Kit........................................................ 103
PC031 Lead-Free Process Capability Validation Kit—Cookson.. 104
PC009-40 Traceability & Control Validation Kit—Aegis................ 106
Jabil Selective/Wave Solder Vehicle.................................................... 108
Jabil Solder Paste Evaluation Kit............................................................. 108
PC049 SMT/PTH Mixed Tech. Pb-Free Kit—Indium Corp.............. 109
Practical Production Tools
Epoxy Kit—CircuitMedic............................................................................110
Professional Repair Kit—CircuitMedic..................................................110
Micro Drill System—CircuitMedic.......................................................... 111
Plated Hole Repair Kit—CircuitMedic................................................... 111
Beau Tech Soldering Aids..........................................................................112
Flextac™ BGA Rework Stencil Kit.............................................................114
International Distributors..........................................................................116
CSPnl (RDL) Wafer
!
NEW
Practical Components introduces new CSPnl (RDL) dummy wafers from
Amkor. The CSPnl Bump on Redistribution (RDL) option adds a plated
copper redistribution layer to route I/O pads to JEDEC / EIAJ standard
pitches, avoiding the need to redesign legacy parts for CSP applications.
Nickel-based or copper UBM is offered, along with polyimide or PBO
repassivation. CSPnl with RDL utilizes industry-standard surface mount
assembly and reflow techniques, and does not require underfill.
This 8 inch wafer can be provided diced into individual die or as an uncut
wafer. The wafer can be provided with SAC405 bumps.
Pad pitch is 400um (0.4mm). Wafer thickness is 725um, with back grinding available to 200um.
Pads on this wafer are daisy chained and can be cut to any sized request.
Packaging is tape and reel bumps down for cut die or cut and in the ring.
Uncut 8inch wafers are shipped in plastic wafer packs. There is a lot of flexibility with this type of component.
In addition to the wafer Practical Components can also provide a test
board (substrate) on request.
Please call our technical representatives at 714-252-0010 for additional
information.
Notes
n
n
n
n
n
Trace material: Copper
Trace thickness: 3um
Trace width: 100um
Bump pad shape: Circular/ Square
Bump pad size: 225/290um
Amkor CSPnl (RDL) Wafer
Pad I/O
Pad
Matrix
Pitch
Die Sizes
Tape & Reel
4
2x2
0.4
.76
W=8mm P=4mm
40,000
16
4x4
0.4
1.56
W=8mm P=4mm
10,000
36
6x6
0.4
2.36
W=8mm P=4mm
4,500
64
8x8
0.4
3.16
W=8mm P=4mm
2,500
100
10x10
0.4
3.96
W=8mm P=4mm
1,500
144
12x12
0.4
4.76
W=8mm P=4mm
1,000
196
14x14
0.4
5.56
W=8mm P=4mm
500
Practical Components is the
exclusive distributor of
4
Projected
Die Yield
Practical Components, Inc.  www.practicalcomponents.com  [email protected]
eWLP Embeded Wafer Level Package
!
NEW
Practical Components is offering Amkor’s embedded copper posts/pad on
a eWLP (embedded Wafer Level Package) 8 inch wafer. eWLP wafers have
copper posts that are embedded into the die. Size of the posts is 8um to
10um. Pitch between the copper posts is 400um (0.4mm).
Wafer thickness is 725um and can be back grinded to 200um.
These wafers can be supplied by uncut wafer or cut die, packaged on
tape and reel with bumps up. Copper pillar dummy test wafers provide an
excellent opportunity to investigate the effectiveness of the flip chip die
attach process.
Practical Components technical staff can provide additional information
on the new Amkor eWLP test wafers. In addition to the wafers and die,
Practical can supply test vehicles for the eWLP test die.
Each die is daisy chained and customer can have the wafer cut to match a
required die size.
Call for more informatiom. 714-252-0010
Notes:
Ball Place or Electroplated: Electroplated
Bump On Pad or redistribution Layer: Redistribution Layer
n Bump Material: Cu bump
n Bump Height: 10 um
n Bump pitch: 400 um
n Bump Shear Strength: >2 g/mil2
n Plating Area 30 : 5948 mm2
10 : 10804 mm2
n
n
Amkor .4mm eWLP
Pad I/O
Pad
Matrix
Pitch
Die Sizes
Tape & Reel
Projected
Die Yield
4
2x2
0.4
.76
W=8mm P=4mm
40,000
16
4x4
0.4
1.56
W=8mm P=4mm
10,000
36
6x6
0.4
2.36
W=8mm P=4mm
4,500
64
8x8
0.4
3.16
W=8mm P=4mm
2,500
100
10x10
0.4
3.96
W=8mm P=4mm
1,500
144
12x12
0.4
4.76
W=8mm P=4mm
1,000
196
14x14
0.4
5.56
W=8mm P=4mm
500
Practical Components, Inc.  Tel: 1-714-252-0010  Fax: 1-714-252-0026
5
Flip Chips
Flip Chip describes the method of electrically connecting the die to the
package carrier. The package carrier, either substrates or leadframe, then
provides the connection from the die to the exterior of the package. The
interconnection between die and carrier in flip chip packaging is made
through a conductive bump that is placed directly on the die surface. The
bumped die is then flipped over and placed face down, with the bumps
connecting to the carrier. After the die is solderable, underfill is applied
between the die and the substrates, around the solder bumps. The underfill is designed to contract the stress in the solder joints caused by the
difference in thermal expansion between the silicon die and carrier.
Pac Tech offers a complete set of additional wafer level and backend
services including: saw, dice, redistribution, repassivation, backside
laser mark, backside coating, test die, and assembly. In addition, Pac
Tech has the latest in metrology and analytical equipment to help in
the development and production proceses, including: x-ray, shear,
AOI, ICP, AA, probing, high speed ball pull, chemical analysis, etc…
For kit see page 7.
Flip Chips
Part Descriptions
Die
Size
No. of
Bumps
Bump
Pitch
Bump
Height
UBM
Diameter
Passivation
Via
UnCut
Wafer *
Trays
Pac2.3
FA572-200/400-10mm
10x10mm
394x394mils
572
200µm/400µm
7.88/15.76mil
75μm
90μm
80µm
"6" Wafer
(132) Die
36 per Tray
4" sq
Pac2.5
PB376-100-10mm
10x10mm
394x394mils
376
100µm
3.94mils
53μm
37μm
27µm
"6" Wafer
(120) Die
36 per Tray
4" sq
Notes
Part Description System
n
* = Die count represents expected yield per wafer.
n All die is packaged in waffle pack trays unless otherwise specified.
n The potential multiple is the number of die repears on the wafer. With
the wafer orientated flat down, a right hand coordinate system applies.
n Die Size is from scribe line to center-to-center. Scribe width is 0.05mm
Passicated. Each bump is electrically connected to one other bump and
isolated form all others to facilitate electrical test.
n Bump pitch is defined as center-to-center distance between passivation
openings.
n Bump height is defined as silicon surface to the top of the bump.
n Bump diameter is defined as the maximum diameter.
n UBM = Under Bump Metallurgy
n Unbumped wafers are available upon special request.
n Metal Composition is 5µm Ni, .05µm Au
n Die are packaged in Waffle Packs
n Lead-Free parts available with (SAC305) 96.5%Sn/3.0%Ag/0.5%Cu alloy
or (SAC405) 95.5%Sn/4.0%Ag/.05%Cu alloy
n Other Alloys available upon request.
Lead-Free Die
n
All Flip Chips are available Lead-Free with (SAC305)
96.5%Sn/3.0%Ag/0.5%Cu or (SAC405) 95.5%Sn/4.0%Ag/0.5%Cu alloys.
n When ordering Lead Free-Flip Chips add "305" or "405" to end of part
number.
Pac2.3-FA572-200/400-10mm
Die size: 10x10mm (394mils sq)
Pitch: 200µm/400µm (7.88/15.76mil)
6
Pac2.5-PB376-100-10mm-DC-Alloy
PB=Perimeter Bump
FA=Full Array
(SAC305, SAC405)
Daisy Chain
Number of Bumps
Die Dimensions–L x W (mm)
Pitch
Solder Bump
Al, Ni, Cu UBM
Die Passivation
Al Pad
Die
About Lead-Free Flip Chips
Flip Chips are used in evaluating assembly techniques, board contiunity,
temperature cycle life test evaluation, underfill procsses and other generic
needs to be given to the appropriate flux, underfill, temperature profile,
and pad finish for the assembly. Many companies are developing and
qualifying alternative pad finishes sue as immersion Sn. Lead-Free Flip
Chips address the need for environmentally conscious assemblies as well
as Alpha particle tolerant packaging.
Pac2.5-PB376-100-10mm
Die size: 10x10mm (394mils sq)
Pitch: 100µm (3.94mil)
Flip Chip Kits
PACTECH Flip Chip Test and Evaluation Kit and Board
Introduction (taken from Website)
The PACTECH Flip Chip Test & Evaluation board is for placement and daisy
chain continuity testing after assembly. Substrate has 14 mounting sites
for 10 x 10mm Flip Chips. With an increasing number of I/O’s on Integrated Circuits and accompanying requirements for high performance, flip
chip type components are a compelling technology for potential users.
PACTECH test die are combined with test boards to provide customers
with the ability to test a variety of specs and processes. The components
and test board are daisy-chained for continuity. The PCB310 PacTech
Board is single sided with 14 pads to accommodate 2 rows of 7 Pac2.3572-200/400-10mm die each.
Notes
n
Board size is 6.3" x 3.95", 2 layers, .062" thick.
Board material is IS410-High Temp 180Tg.
n Standard board finish OSP Entek CU-A-HT.
n Gerber and X,Y Theta data included at no charge.
n See page 6 for available solder ball alloys.
n
Order Number: 12299 PCB310-PACTECH (board only)
Order Number: 12312 Pac2.3-FA572-200/400-10mm-DC-305 (Rows 2 and 3)
7
WLP
!
NEW
Wafer Chip Size Package
WLP uses interconnection technology to effectively utilize the chip area
by making it possible to form electrodes over the entire chip surface.
This eliminates the need for the wire bonding space required by previous
wiring methods. Also, electrodes are formed using copper posts for a
simple structure.
All of this means that the area of the finished package is exactly the
same compact size as the original chip. It also simplifies mounting and
contributes to easier high-density mounting. WLP is the perfect choice for
packaging chips used in portable telephones, digital cameras, and other
applications where mounting space is severely restricted.
WLP
I/O
Count
196
256
264
400
676
Part Description
WLP196-.3mm-4.2mm-DC-SAC305
WLP264-.3mm-6mm-DC-SAC305
WLP400-.3mm-6mm-DC-SAC305
Body
Size
4.2mm sq
4.8mm sq
6mm sq
6mm sq
7.8mm sq
Pitch
.3mm
.3mm
.3mm
.3mm
.3mm
Alloy
96.5%Sn/3.0%Ag/0.5%Cu
96.5%Sn/3.0%Ag/0.5%Cu
96.5%Sn/3.0%Ag/0.5%Cu
96.5%Sn/3.0%Ag/0.5%Cu
96.5%Sn/3.0%Ag/0.5%Cu
Wafer Chip
Size Package
I/O Count
Solder Ball
Alloy
Daisy Chain
Pitch
Body Size
Encapsulation
Re-passivation
Cu Bump (Post)
Cu Re-distribution
Encapsulation
Protect here by
encapsulation
Cu redistribution +
Low-k layer
Silicon Substrate
Dicing Surface
n
Ultra thin type, Ultra miniature, Lightweight
n High current capacity and good heat radiation
n Stress buffer structure
n High reliability of WLP as semiconductor package makes KGD
issues cleared.
n Cu-to-Cu wiring structure
n Include inductors of high Q value
n Possibility of SMT assembly
n Coplanarity (5 to 10 µm)
n Available diced and left in ring or in trays.
0.3mm Pitch
0.57mm Ref
0.20mm
0.3mm
Copper Post pitch
Solder Ball min. diameter
Copper Post diameter
Redistribution thickness
Body thickness
Redistribution Line/Space
8
PI thickness
WLP
Wafer Chip Size Package
WLP196-.3mm-4.2mm (14x14 Matrix)
WLP264-.3mm-6mm (17x17 Matrix)
WLP400-.3mm-6mm (20x20 Matrix)
9
Flip Chips
Flip Chip describes the method of electrically connecting the die to the
package carrier. The package carrier, either substrate or leadframe, then
provides the connection from the die to the exterior of the package. The
interconnection between die and carrier in flip chip packaging is made
through a conductive bump that is placed directly on the die surface. The
bumped die is then flipped over and placed face down, with the bumps
connecting to the carrier. After the die is soldered, underfill is applied between the die and the substrate, around the solder bumps. The underfill
is designed to contract the stress in the solder joints caused by the difference in thermal expansion between the silicon die and carrier.
UBM is the Al/NiV/Cu (under bump metallization) covering about 1%
of the wafer which is under the bumps only. Nitride passivation is an
invisible glass-like protective coating over 99% of the wafer, except under
the bumps. The bumps will not stick to the Nitride, only the UBM. Nitride
coating is standard for all Flip Chip wafers.
Flip Chips
FA10-200x200
Part Numbers:
FA10-400x400
x 200 mils
Die Size 200
400 x 400 mils
Bump Pitch 254 µm, 10 mil
Passivation Via 80 µm
UBM Diameter 102 µm
Bump Height 120 µm
Bump Diameter 135 µm
No. of Bumps 317
Final Metal Pad Size 127 x 127 µm
Thickness Type
Metal Composition 98/1/1 Al/Cu/Si
Packaging
PB08-200x200
PB08-400x400
200 x 200 mils
400 x 400 mils
203 µm, 8 mil
73 µm
95 µm
98 µm
120 µm
88
115 x 115 µm
98/1/1 Al/Cu/Si
5" Wafer
Uncut Wafer* 200 x 200 mils (344Die)
400 x 400 mils (86 Die)
5" Wafer
200 x 200 mils (344 Die)
400x400mil (86 Die)
Sawed 5" Wafer
36 per tray 200 x 200
9 per tray 400 x 400
Waffle Pack
For
Tape and Reel Call
Availability
Sawed 5" Wafer
36 per tray 200 x 200
9 per tray 400x400
Waffle Pack
Call For
Availability
Tray
Part Number System
Notes
* Die count represents expected yield per wafer.
 All die is packaged in waffle pack trays unless otherwise specified.
 All test wafers are currently 5" diameter and are 0.635mm thick.
Passivation is one-micron thick plasma Nitride with round via openings.
 The potential multiple is the number of die repeats on the wafer. With
the wafer orientated flat down, a right hand coordinate system applies.
 Die size is from scribe line to center-to-center. Scribe width is 0.05mm
passivated. Each bump is electrically connected to one other bump and
isolated from all others to facilitate electrical test.
 Bump pitch is defined as center-to-center distance between
passivation openings.
 Bump height is defined as silicon surface to the top of the bump.
 Bump diameter is defined as the maximum diameter.
 UBM = Under Bump Metallurgy
 Lead-free parts are available with 93.6% Sn/ 3.4% Ag/ 3.0% Cu alloy.
 Unbumped wafers are available upon special request.
FA
10 _______
200x200 -DC-Alloy
__ __
__ ____

PB=Perimeter Bump
FA=Full Array
Pitch (mil)
Die Dimensions
L x W (mil)
EUT, LF2
Daisy Chain
Add “WR” to end of part number for Wafer Cut and left in Seal Ring.
Add “TR” to end of part number for die on Tape and Reel.
n Add “EUT” to end of part number for Eutectic.
n Add “LF2” to end of part number for Lead-Free.
n Add “W” to end of part number for Uncut Wafer.
n Add “unbumped” to end of part number for unbumped wafer/die.
n
n
FCT Bump Structure
Solder Bump
Al, Ni, Cu UBM
Die Passivation
Al Pad
Die
For kit see page 12.
10
Flip Chips
About Lead-Free Flip Chips
Lead-Free Die
Flip Chips are used in evaluating assembly techniques, board continuity, temperature cycle life test evaluation, underfill processes and other
generic Flip Chip evaluations. When using Lead-Free Flip Chips, consideration needs to be given to the appropriate flux, underfill, temperature
profile, and pad finish for the assembly. Many companies are developing
and qualifying alternative pad finishes such as immersion Sn. Lead-Free
Flip Chips address the need for environmentally conscious assemblies as
well as Alpha particle tolerant packaging.
All Flip Chips are available Lead-Free with Alloy LF2 composition
93.6% Sn /3.4% Ag /3.0% Cu.
 When ordering Lead-Free Flip Chips, add “LF2” to end of part number.
 LF2 was introduced by FCT (the acronym is Lead-Free #2).

Daisy-Chain Patterns
PB08-200x200
PB08-400x400
66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45
67
44
68
43
69
42
70
41
71
40
72
39
73
38
74
37
75
36
76
35
77
34
78
33
79
32
80
31
81
30
82
29
83
28
84
27
85
26
86
25
87
24
88
23
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
Die size: 5.08mm sq.
122
101 100
89
144
67
145
66
176
1
22
23
44
The PB08 daisy-chain test die is designed with an 8-mil (203µm) solder
bump pitch around the perimeter of the device. Each die contains 99 I/O
(44 daisy-chain pairs). The device comes in two sizes: 200mil x 200mil and
400mil x 400mil. The PB08-400x400 device consists of a 4 PB08-200x200
devices without the inner I/O’s bumped.
FA10-200x200
1
15
16
34
52
70
88
106
124
142
160
178
196
214
232
250
268
286
33
51
69
87
105
123
141
159
177
195
213
231
249
267
285
303
304
The FA10 daisy-chain test die is designed with a 10-mil pitch (254µm)
array of solder bumps across the surface of the die. They are configured
in “quad” structures for versatile assembly and evaluation options. The
array pattern is an 18 row x 18 column footprint minus four pairs of corner
bumps. The addition of a key bump in the upper left corner addresses
alignment requirements. Each die contains 317 I/O (158 daisy-chain pairs).
This device is offered with eutectic or Pb-free solder bumps.
317
11
Flip Chip Test Die Kit
With an increasing number of I/O’s on Integrated Circuits and accompanying requirements for high performance, flip chip type components
become a compelling technology for potential users. Flip Chip Technology test die are combined with factory designed test boards to provide
customers the ability to test a variety of die specs, bump pitches and
bump counts. Both components and test boards are daisy-chained
for continuity.
Laminate Board
Laminate board is double-sided. One side has 10
pads for the PB8-2x2 (the back side is no longer
available for the PB8-4x6, this part has been
discontinued).
Substrate Information

Board Type—High Temp FR4

Board Thickness—0.062"

Layers—4 (top, bottom, ground, power) inner
layers nonfunctional

Copper Conductor—1/4 oz. or 1/2 oz. Cu

Solder Mask—Taiyo PSR-4000

Test Site Die—10 (200 x 200 mil2) sites on one side
of the board

Pitch—8 mil

Minimum Line—4mil

Minimum Space—4 mil


Board Size: 3.5" x 5.5"
Wettable Cu Pad—4 x 8 mil2 (defined using a
solder mask)
Purpose— Flip Chip on FR-4 board with
daisy‑chain structure
Board for 400x400 die size is not available.
Order Number: PB08-2x2-Laminate
Laminate Board
Laminate is only available for FA10-2x2. Single-sided
pattern.
Substrate Information

Board Type—High Temp FR4

Board Thickness—0.031"

Layers—4 (top, bottom, ground, power) inner
layers nonfunctional

Copper Conductor—1/4 oz. or 1/2 oz. Cu

Solder Mask—Taiyo PSR-4000

Test Site Die—10 (200 x 200 mil2) sites on one side
of the board

Pitch—10 mil array

Minimum Line—4 mil; Minimum Space—4 mil

Wettable Cu Pad—5 mil diameter, round

Through-Hole Via—8 mil drill, 10 mil capture pad
Board for 400x400 die size is not available.
Order Number: FA10-2x2-Laminate
12
Board Size: 3.5" x 5.5"
Notes
Board finish is Organic Solderability Preservative (OSP).OSP, also known
as ENTEK® (CU-106A-HT), is a high performance, copper protective
coating for use on printed wiring board, which replaces hot air solder
leveling (HASL) and other metallic PWB surface finishes. ENTEK® PLUS
maintains surface planarity and inhibits copper oxidation. Technical data
is on file upon request.
 Digitized files provided by Aegis Software included at no charge.

Customized RTI Supplied Wafer Bumping
and Wafer Level Packages
Practical Components provides access to state of the art wafer bumping and wafer level packaging technologies. Advanced packaging and
interconnecting devices offered from Practical Components partners
include, bump on I/O pad, bump on polymer, polymer on repassivation,
multilayer copper redistribution, eutectic Sn/Pb, Pb-free and copper post
bumping. Dummy components can be provided on uncut wafer or diced
die also available are Cu pillar or solder bumps. Wafers can be provided
with uniformed area arrays, perimeter or mixed bump patterns and can
be daisy chained on request.
 Bump on I/O pad
 Bump on polymer
 Polymer repassivation
 Single and multiple layer Cu redistribution
 Eutectic Sn/Pb,Pb-free, and Cu pillar bumping
 Design services.
Customers can use standard repassivation, redistribution and bumping
processes. In addition the processes can be customized with multilevel
metallization and employing inorganic or organic dielectrics are available.
Practical’s Partners can provide services from design to fabrication of
custom WLCSP and Flip Chip test vehicles. In addition, Practical offers a
full line of substrate test vehicles.
These types of advanced wafers and test die provide an ideal process
evaluation path for suppliers developing new materials such as photoresists, polymer dielectrics, plating chemistries and underfills. Please call
your Practical Components technical representive to discuss these test
packages or any other requirements your company might have.
Call a Practical representative at 714-252-0010 for more information.
13
.3 mm Pitch CVBGA
Very Thin ChipArray® BGA
.3mm Package
Amkor 0.3mm Dummy CVBGA The Practical Dummy Component® version
of the .3mm CVBGA has become a popular choice for electronic assembly.
It is identical to the live package without the expensive IC die inside. The
dummy versions are made of the same materials on the same manufacturing lines and have the same size, thermal and soldering properties as
the live equivalent without the cost of a live die.
CVBGA Very Thin ChipArray® BGA
Part Description
I/O Count
Pitch
Body Size
A-CVBGA368-.3mm-8mm
368
.3mm
8x8mm
Ball
Matrix
23x 23
Ball
Alignment
Perimeter
Quantity
Per Tray
260
Available Lead-Free Alloys
SAC105
Notes
Parts are packaged in JEDEC trays.
All components are daisy-chained.
n Moisture sensitivity is JEDEC level 3.
n Lead-free parts are available with 98.5%Sn/1.0%Ag/0.5%Cu (SAC105)
alloy only.
n .3mm Pitch CVBGA are not available with Eutectic 63/37 Solder Balls.
n
n
CABGA
®
ChipArray BGA
Body Size
CTBGA
®
Thin ChipArray BGA
Body Size
1.5 mm (max.)
Mold
Compound
CVBGA
®
Very Thin ChipArray BGA
1.2 mm (max.)
Die Attach
Au Wire
Solder
Mask
Die
Side View
Top View
1.0 mm (max.)
A1 Ball Corner
Via
Ball Pitch
Ball Pitch
Bottom View
14
Eutectic
Rigid Laminate
PCB368- .3 mm Pitch CVBGA
Evaluation and Qualification Test Board
The PCB368-8 Evaluation Board is a test vehicle for the
.3mm pitch CVBGA component.
Both X, Y Theta data and Gerber data are available without
charge.
Solder practice test vehicle PCB boards and kits are used
for machine setup, evaluation, qualification, workflow
analysis, prototyping, testing, solder profiling.
It is 77 x 132mm
For this component we have added a PCB368-8 mm Evaluation Board that is ideal for testing, evaluating and qualifying this fine-pitch technology. With Practical Components
test boards and the necessary dummy components,
customers can conduct assembly process evaluation without using high-cost, live components and functional PC
boards. Kits are available packaged for production equipment evaluation.
1mm thick
4 layers
15 pads for the CVBGA368 package
It is offered with OSP, ImAg & ENIG finishes
15
CVBGA
Very Thin ChipArray® BGA
.4mm Package
ChipArray® (CVBGA) is a new package offering by Amkor that has a 0.4mm
pitch. In addition to the standard core ChipArray® package (CABGA and
CTBGA), Amkor offers thinner mold cap thickness of 1.0mm max. By utilizing a thin core laminate, much denser routing can be achieved, thereby
enabling more I/O’s in a given footprint. Due to their small size and I/O
density, Amkor’s ChipArray® product family is an excellent choice for new
devices requiring a small footprint and low mounted height.
CVBGA Very Thin ChipArray® BGA
Part Description
I/O Count
Pitch
Body Size
A-CVBGA97-.4mm-5mm
A-CVBGA360-.4mm-10mm
A-CVBGA432-.4mm-13mm
97
360
432
.4mm
.4mm
.4mm
5mm
10mm
13mm
Ball
Matrix
10 x 10
23 x 23
31 x 31
Ball
Alignment
Full Array
Perimeter
Perimeter
Quantity
Per Tray
360
250
160
Available Lead-Free Alloys
SAC405, SAC305 or SAC105
Notes
Parts are packaged in JEDEC trays.
All components are daisy-chained.
n Moisture sensitivity is JEDEC level 3.
n Solder ball material is available with Eutectic 63/37 SnPb.
n Lead-free parts are available with 95.5% Sn/ 4.0% Ag/ 0.5%
Cu (SAC405) alloy or 96.5% Sn/ 3.0% Ag/ 0.5% Cu (SAC305) or
98.5%Sn/1.0%Ag/0.5%Cu (SAC105) alloy.
n New: CVBGA ,CTBGA and CABGA parts are available without solder ball,
which makes the package LGA. See page 19.
Amkor
A-CVBGA-97-.4mm-5mm-DC-Alloy
ChipArray
(SAC305, SAC405,
Very Thin
and SAC105)
Ball Grid Array
Daisy Chain
I/O Count
Body Size
Pitch
n Add “TR” to end of Part Description for Tape and Reel.
n Add “SAC405” or “SAC305” or “SAC105” to end of part number for Lead-Free.
n
n
CABGA
®
ChipArray BGA
Body Size
CTBGA
®
Thin ChipArray BGA
Body Size
1.5 mm (max.)
Mold
Compound
CVBGA
®
Very Thin ChipArray BGA
1.2 mm (max.)
Die Attach
Au Wire
Solder
Mask
Die
Side View
Top View
1.0 mm (max.)
A1 Ball Corner
Via
Ball Pitch
Eutectic
Rigid Laminate
For kits see pages 87 and 95.
Ball Pitch
Bottom View
16
CTBGA
ChipArray® Thin Core Ball Grid Array
CTBGA ChipArray® Thin Core Ball Grid Array
Part Description
.5mm Pitch
A-CTBGA84-.5mm-6mm
A-CTBGA84-.5mm-7mm
A-CTBGA108-.5mm-7mm
A-CTBGA132-.5mm-8mm
A-CTBGA228-.5mm-12mm
.8mm Pitch
A-CTBGA49-.8mm-6mm
A-CTBGA49-.8mm-7mm
A-CTBGA64-.8mm-7mm
A-CTBGA64-.8mm-8mm
1.0mm Pitch
A-CTBGA144-1.0mm-13mm
I/O Count
Pitch
Body Size
Ball
Matrix
Ball
Alignment
Quantity
Per Tray
Available Lead-Free
Alloys
84
84
108
132
228
.5mm
.5mm
.5mm
.5mm
.5mm
6mm
7mm
7mm
8mm
12mm
10 x 10
12 x 12
12 x 12
14 x 14
22 x 22
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
608
476
476
360
189
SAC405, SAC105, or SAC305
49
49
64
64
100
176
208
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
6mm
7mm
7mm
8mm
10mm
13mm
15mm
7x7
7x7
8x8
8x8
10 x 10
15 x 15
17 x 17
Full Array
Full Array
Full Array
Full Array
Full Array
Perimeter
Perimeter
608
476
476
360
250
160
126
144
1.0mm
13mm
12 x 12
Full Array
160
Notes
Parts are packaged in JEDEC trays when available.
 All components are available daisy-chained.
 <0.12mm (5 mil) coplanarity.
 Solder ball material is Eutectic 63/37 SnPb.
 BT (Bismaleimide-Triazine) substrates or equivalent.
 Package thickness is 1.2mm max for 0.8mm and 1.0mm pitch packages.
 Package thickness is 1.1mm max for 0.5mm pitch packages.
 Moisture sensitivity is JEDEC level 3.
 Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/0.5%
Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or (SAC105)
98.5%Sn/1.0%Ag/0.5%Cu is also available.
 New: CABGA, CVBGA and CTBGA parts are available without solder
balls, which makes the package LGA. See page 19.

A-CTBGA84-.5mm-6mm-DC-Alloy
Amkor
®
ChipArray
Thin Core Ball Grid Array
I/O Count
(SAC305, SAC405,
and SAC105)
Pitch
Body Size
Daisy Chain
n Add "TR" to end of part description for Tape and Reel
n Add "SAC405" or "SAC105" or SAC305" to end of part description for Lead-Free.
n Add DC & Alloy to Part Number System after body size:
For recommended kit see page 95.
17
CABGA
ChipArray® Ball Grid Array
ChipArray® (CABGA) packages are offered in laminate format and are available as Ball Grid Array. The near chip size
standard outlines offer fixed body sizes and ball counts.
Established SMT mounting processes and techniques are
compatible with ChipArray®. The package size and design
provides ideal RF operation (low inductance) for high
speed applications requiring small footprints.
ChipArray® Ball Grid Array
Part Description
.8mm Pitch
A-CABGA36-.8mm-6mm
A-CABGA144-.8mm-12mm
1.0mm Pitch
A-CABGA100-1.0mm-11mm
I/O Count
Pitch
Body Size
Ball Matrix
Ball
Alignment
Quantity
Per Tray
Available
Lead-Free Alloys
36
144
100
160
176
192
208
288
.
8mm
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
.8mm
6mm
12mm
10mm
12mm
13mm
14mm
15mm
19mm
6x6
13 x 13
10 x 10
14 x 14
15 x 15
16 x 16
17 x 17
22 x 22
Full Array
Perimeter
Full Array
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
608
189
250
189
160
119
126
84
100
144
196
256
1.0mm
1.0mm
1.0mm
1.0mm
11mm
13mm
15mm
17mm
10 x 10
12 x 12
14 x 14
16 x 16
Full Array
Full Array
Full Array
Full Array
168
160
126
 90
Notes
Parts are packaged in JEDEC trays when available.
 All components are available daisy-chained.
 <0.12mm (5 mil) coplanarity.
 Solder ball material is Eutectic 63/37 SnPb.
 BT (Bismaleimide-Triazine) substrates or equivalent.
 Package thickness is 1.5mm max for 0.8mm and 1.0mm pitch packages.
 Package thickness is 1.34mm max for 0.5mm pitch packages.
 Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5%
Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or (SAC105)
98.5%Sn/1.0%Ag/0.5%Cu is also available.
 New: CABGA, CVBGA and CTBGA parts are available without
solder balls, which makes the package LGA. See page 19.
Amkor

A-CABGA40-.5mm-5mm-DC-Alloy
(SAC305, SAC405
and SAC105)
Daisy Chain
Body Size
ChipArray®
Ball Grid Array
I/O Count
Pitch
n Add "TR" to end of part description for Tape and Reel
n Add "SAC405" ,"SAC105" or SAC305" to end of part description for Lead-Free.
Solder Ball Height
After Ball Attach
B
Solder Ball Diameter/Height
(As Received)
A
C
Diameter = Height
After Reflow
D
Motherboard
For recommended kits see pages 87, 92,
94, 100, 101 and 105.
Package Pitch
A
B
C
D
1.00/0.80mm
0.46mm
0.48mm
(± 0.05mm)
0.36mm
(± 0.05mm)
0.30mm
(± 0.05mm)
0.50mm
0.30mm
0.32mm
(± 0.05mm)
0.19mm
(± 0.05mm)
0.17mm
(± 0.03mm)
Note: Typical motherboard non-solder mask defined pad:
0.50 pitch = 0.28
0.80 pitch = 0.30
 1.00 pitch = 0.38


18
LGA
Land Grid Array
Amkor laminate ChipArray® packages are available without solder balls
upon special order. Packages available without solder balls include
CABGA, CTBGA and CVBGA. The same standard daisy-chained substrate
would be used based on open tooling.
LGA is another term used for parts without solder balls. The same BOM
(bill of material) is used when parts are assembled. LGA parts are used to
reduce package height, drop test performance in handheld applications,
solder ball attach practice, socket insertion, P&P evaluation, reflow profiling, enhance thermal cycle reliability and other purposes.
LGA solder interconnect if formed solely by solder paste applied at board
assembly because there are no solder balls attached to the LGA. This results in a lower stand-off height of approximately 0.06mm to 0.10mm, depending on solder paste volume and PCB geometry. Laminate substrate is
solder mask defined. Standard ball pad finish is NiAu.
Application notes available for supporting technical data.
Notes
n
Part Description System (use as an example when ordering)
Body sizes range from 5mm ~ 17mm.
n Available pitches are .4mm, .5mm, .8mm and 1.0mm.
n Parts packaged in trays (standard).
n Parts available on Tape and Reel upon special request.
0.6 mm
1.10 mm–1.30 mm
0.80 mm–1.00 mm
2.71 mm–3.20 mm
Amkor
A-CTBGA-84-.5mm-7mm-LGA
Land Grid Array
(without solder balls)
Package Type
I/O Count
Pitch
Body Size
0.6 mm
1.1 mm–1.30 mm
1.92 mm–2.20 mm
19
Industry Acronyms
AC
ACA
ACES
AEM
AF
AIAA
ALT
AMLCD
ANSI
AOQ
AOQL
APQ
ARAC
ARP
ASIC
ASSC
ASSP
AST
ATC
Autoclave
Aniosotropic Conductive Adhesive
Applied Computational Electromagnetics Society
Aircraft Equipment Monitor
Acceleration Factor
American Institute of Aeronautics and Astronautics
Accelerated Life Test
Active Matrix Liquid Crystal Display
American National Standards Institute
Average Outgoing Quality
Actual Outgoing Quality Level
Accelerated Product Qualification
Aviation Rulemaking Advisory Committee
Aerospace Recommended Practice
Application Specific Integrated Circuit
Application Specific Standard Component
Application Specific Standard Product
Accelerated Stress Test
Accelerated Thermal Cycling AWGIECQ Avionics
Working Group
a-Si
Amorphous Silicon
BEM
Boundary Element Method
BGA
Ball Grid Array
BME
Base Metal Electrode
BT
Bismaleimide Triazine
BV
Breakdown Voltage
CA
Contract Assembly or Contract Assembler
CAGR
Compound Annual Growth Rate
CALCE™ Computer Aided Life Cycle Engineering
CB
Citizens Band
CBGA
Ceramic Ball Grid Array
CCA
Circuit Card Assembly
Charge Coupled Device
CCD
CCGA
Ceramic Column Grid Array
CDM
Charged Device Model
CECC
Cenelec Electronic Components Committee
Conventional Finite Element Method
CFEM
CFF
Conductive Filament Formation
CL
Confidence Level
CLPT
Classical Laminated Plate Theory
CM
Contract Manufacturing or Contract Manufacturer
CMM
Component Maintenance Manual
CMOS
Complementary Metal Oxide Semiconductor
COB
Chip on Board
COF
Chip on Flex
COGS
Cost of Goods Sold
COTS
Commercial Off The Shelf
Cpk
Process Capability Index
CPLD
Complex Programmable Logic Device
CR
Contact Resistance
CRT
Cathode Ray Tube
CSAM
C-mode Scanning Acoustic Microscopy
CSP
Chip Scale Package
CTE
Coefficient of Thermal Expansion
DBC
Direct Bond Copper
DBGA
DBS
DBTF
DFR™
DIP
DL
DMSMS
DOE
DOF
DRAM
DSCC
DUT
DWV
ECL
ECM
ECMP
EDA
EDRAM
EDS
EEPLD
EFIS
EIA
ELD
EMC
EMC
EMCS
EMI
EMS
EN
EOL
EP
EPLD
EPSC
ESD
ESEM
ESR
ESS
EU
FAA
FADEC
FAR
FBGA
FCC
FCOB
FCOC
FCOF
FDTD
FEA
FED
FEM
FET
FFF
FFOP
FMEA
FMECA
Dimple Ball Grid Array
Direct Broadcast Satellite
Design-Build-Test-Fix
Design for Reliability
Dual In-line Package
Design Life
Diminishing Manufacturing Sources and Material Shortages
Design of Experiment
Degrees of Freedom
Dynamic Random Access Memory
Defense Supply Center Columbus
Device Under Test
Dielectric Withstanding Voltage
Emitter-Coupled Logic
Electrochemical Migration
Electronic Component Management Plan
Electronic Design Automation
Embedded Dynamic Random Access Memory
Electron Disruptive Spectroscopy
Electrically Erasable Programmable Logic Device
Electronic Flight Instrumentation System
Electronic Industry Association
Electroluminiscent Displays
Electromagnetic Compatibility
Encapsulated Molding Compound
Electromagnetic Compatibility Society
Electromagnetic Interference
Electronic Manufacturing Services
Euro Norms (European Standards
End of Life
Energy Partitioning
Erasable Programmable Logic Device
Electronics Products and Systems Center/Consortium
Electrostatic Discharge
Environmental Scanning Electron Microscope
Equivalent Series Resistance
Environmental Stress Screening
European Union
Federal Aviation Agency
Full Authority Digital Engine Control
Federal Aviation Regulations
Fine pitch ball grid array
Federal Communications Commission
Flip Chip On Board
Flip Chip On Ceramic
Flip Chip on Flex
Finite Difference Time Domain
Finite Element Analysis
Field Emission Displays
Finite Element Method
Field Effect Transistor
Form Fit and Function
Failure-Free Operating Period
Failure Mode and Effect Analysis
Failure Mode Effect and Criticality Analysis
Courtesy of CALCE www.calce.umd.edu
20
Industry Acronyms
FPGA
FRACAS
FSDT
FTA
FQFP
GA
GAL
GEM
GIDEP
GPC
GPWS
HALT
HASS
HAST
HBM
HDL
HDTV
HM
HSDT
HSOP
HTCC
HTOL
HTRB
HTS
HTTP
I/O
IC
IDDQ
IDSA
IDT
IEC
IECQ
IEEE
IFE
IGBT
IMA
IP
IPC
IPD
IR
IRC
Isat
ITO
JAN
JAR
JEDEC
LCA
LCCC
LC
LCD
LCM
LGA
LIF
Field Programmable Gate Array
Failure Reporting, Analysis and Corrective Action System
First-order Shear Deformable Theory
Fault Tree Analysis
FusionQuad® Flat Pack
Gate Array
Generic Array Logic/Lattice
Generalized Emulation of Microcircuits
Government Industry Data Exchange Program
Government Procurement Committee
Ground Proximity Warning System
Highly Accelerated Life Test
Highly Accelerated Stress Screening
Highly Accelerated Stress Test
Human Body Model
Hardware Description Language
High Definition Television
Health Monitoring
Higher-order Shear Deformable Theory
Small Outline Package with a Heat Sink
High Temperature Cofired Ceramic
High Temperature Operation Life
High Temperature Reverse Bias
High Temperature Storage
Hyper-Text Transfer Protocol
Input/Output
Integrated Circuit
Quiescent Current
Incremental Damage Superposition Approach
Integrated Device Technology
International Electrotechnical Commission
International Electrotechnical Commission Quality
Assessment System for Electronic Components
Institute of Electrical and Electronic Engineers
In-Flight Entertainment
Integrated Gate Bipolar Transistor
Integrated Modular Avionics
Intellectual Property
Institute for Interconnecting and Packaging Electronic Circuit
Integrated Passive Devices
Infra Red/Insulation Resistance
International Resistive Company
Saturation Current
Indium tin oxide
Joint Army Navy
Joint Aviation Regulation
Joint Electron Device Engineering Council
Logic Cell Array
Leadless Ceramic Chip Carrier
Liquid Crystal
Liquid Crystal Display
Life Consumption Monitoring
Land Grid Array
Low Insertion Force
LIGA
Acronym from German words for lithography, electroplating,
and molding
LM
Life Margin
LOT
Life of Type
LPCC
Leadless Plastic Chip Carrier
LRM
Line Replaceable Module
LRU
Line Replaceable Unit
LSI
Large Scale Integration
LTB
Last Time Buy
LTOL
Low Temperature Operating Life
LVCES
Low Volume Complex Electronic System
LVT
Low Voltage (BiCMOS) Technology
LWDT
Layer-Wise Deformable Theory
MAX
Multiple Array Matrix
MBGA
Metal Ball Grid Array
MCM
Multi-Chip Module
MDRR
Multi-Domain Rayleigh Ritz
MDSDT Material Dependent Shear Deformable Theory
MEMS
MicroElectroMechanical Systems
MFG
Mixed Flowing Gases
MFOP
Maintenance Free Operating Period
MLCC
Multilayer Ceramic Capacitor
MLD
Minimum Life Desired
MM
Machine Model
MMC
Metal Matrix Composite
Mn
Metal level number n
MOCA Mitigation of Obsolescence Cost Analysis
MoL
Method of Lines
Method of Moments
MoM
MOS
Metal Oxide Semiconductor
MOSFET Metal Oxide Semiconductor Field Effect Transistor
MRP
Maintenance Recovery Period
Moisture Sensitivity Level
MSL
MTBF
Mean Time Between Failures
MTBUR Mean Time Between Unscheduled Removals
MTTF
Mean Time to Failure
National Center for Manufacturing Sciences
NCMS
NEC
Numerical Electromagnetic Code
NEMI
National Electronics Manufacturing Initiative Inc.
NEMP
Nuclear Electromagnetic Pulse
NFEM
Nested Finite Element Method
NFF
No Fault Found
NIF
Normal Insertion Force
NRE
Non-Recurring Engineering
NSWC
Naval Surface Warfare Center
OEM
Original Equipment Manufacturer
OLED
Organic Light Emitting Diodes
OOR
Ordered Overall Range
PAL
Programmable Array Logic
PASIC
Programmable Application Specific Integrated Circuit
PBGA
Plastic Ball Grid Array
PBT
Parasitic Bipolar Transistor
PC
Pre-Conditioning
PC FAB Printed Circuit Fabrication
21
Industry Acronyms
PCB
PCM
PCN
PDI
PDN
PDP
PEEC
PFC
PGA
PHM
PLA
PLCC
PoF
PoP
POS
PPM
PQFP
PSD
PT
PTH
PTV
PWA
PWB
PZT
QFP
QML
QPL
QRD
RDF
RDSON
RET
RF
RFI
RH
RMS
ROI
RT
S&A
SAC
SAE
SAM
SARA™
SBGA
SC
SCMOS
SDA
SDDV
SDU
SE
SEM
SI
SIA
SILC:
SM
Printed Circuit Board
Phase Change Material
Product Change Notice
Precision Devices Incorporated
Product Discontinuance Notice
Plasma Displays Panel
Partial Element Equivalent Circuit
Primary Flight Control
Pin Grid Array
Prognostic Health Monitoring
Programmable Logic Array
Plastic Leaded Chip Carrier
Physics of Failure
Package on Package
Proof of Screen
Parts Per Million
Plastic Quad Flat Pack
Power Spectral Density
Punch Through
Plated-Through Hole
Plated-Through Via
Printed Wiring Assembly
Printed Wiring Board
Lead Zirconate Titanate
Quad Flat Pack
Qualified Manufacturer List
Qualified Part List
Quality Reliability Durability
Range Distribution Function
Drain to Source On Resistance
Reliability Enhancement Test
Radio Frequency
Radio Frequency Interference
Relative Humidity
Root mean square
Return On Investment
Room Temperature
Safety and Arming Tin
Silver Copper (SnAgCu)
Society of Automotive Engineers
Scanning Acoustic Microscope
Simulation Assisted Reliability Assessment
Super Ball Grid Array
Standard Cell
Scalable Complementary Metal Oxide Semiconductor
Spectral Domain Approach
Stress-Driven Diffusive Voiding
Shop Discardable Unit
Shielding Effectiveness
Scanning Electron Microscope
Signal Integrity
Semiconductor Industry Association
Stress Induced Leakage Current
Surface Mount
SMD
SMT
SOC
SOIC
SOP
SOWIC
SPC
SPICE
SPLD
SRAM
SRU
SUBM
TAB
TBGA
TC
TCAS
TCTF
TDDB
TEM
TFT
Tg
TH
THB
TI
TLM
TMM
TMV®
TS
TSMC:
TTF
TTL
UBGA
UV
VCO
VDCEP
VHDL
VHSIC
VLSI
VQ
Vt
WEEE
WLP
xPyM
ZIF
Standard Microcircuit Drawing
Surface Mount Technology
System-On-Chip
Small Outline Integrated Circuit
System-On-Package / Small Outline Package
Small Outline Wide Integrated Circuit
Statistical Process Control
Simulation Program with Integrated Circuit Emphasis
Simple Programmable Logic Device
Static Random Access Memory
Shop Replaceable Unit
Submicron
Tape Automated Bonding
Tape Ball Grid Array
Temperature Cycle
Traffic-alert Collision Avoidance System
Time-, Cycles-to Failure
Time-Dependent Dielectric Breakdown
Transverse Electromagnetic
Thin film transistor
Glass Transition Temperature
Through Hole
Temperature, Humidity and Bias
Transfer Impedance
Transmission Line Matrix
Thermo -Mechanical Microstructural
Through Mold Via
Thermal Shock
Taiwan Semiconductor Manufacturing Corporation
Time to Failure
Transistor-Transistor Logic
Micro Ball Grid Array
Ultraviolet
Voltage Controlled Oscillator
Volume Driven Commercial Electronic Product
VHSIC Hardware Description Language
Very High-Speed IC
Very Large Scale Integration
Virtual Qualification
Threshold Voltage
Waste from Electrical and Electronic Equipment
Wafer Level Package
x Polysilicon and y Metal
Zero Insertion Force
22
TMV® PoP
!
NEW
Through Mold Via Package
After three years of development, Amkor has introduced the next generation PoP solution. This new technology is called Through Mold Via (TMV®).
The new TMV® technology is used to create interconnect vias through the
mold cap, it also provides a more stable bottom package that enables the
use of thinner substrates with a larger die to package ratio. TMV® enabled
POP can support single, stacked die for wirebond and FC designs.
TMV® technology enables next generation PoPs by:
n
Removing bottlenecks for fine pitch memory interfaces
Enhancing warpage control and bottom package thickness reduction
n Increasing die to package size ratios
n Supporting wirebond, flip chip, stacked die and passive integration
n Improving board level solder joint life
n
White paper articles and technical presentations are available on Practical
Components web site at www.practicalcomponents.com or Amkor Technology’s web site at www.amkor.com.
TMV® PoP—Mating Top and Bottom Daisy Chain Samples
Part Description
14mm Body Size
A-PoP200-.5mm-14mm-DC
A-TMV620-.4mm-14mm-DC
I/O Count
Pitch
Body Size
Ball
Matrix
Ball
Alignment
Quantity
Per Tray
200 (top package)
620 (bottom package)
.5mm
.4mm
14mm
14mm
27x27
33x33
Perimeter
Perimeter
119
119
Notes
Fine pitch 0.4mm bottom package footprints.
 Stacked package heights of 1.2mm nominal (see Stack Up table on
following pages).
 Package configurations compliant with JEDEC standards.
 Moisture Resistance Testing is JEDEC Level 3 @ 260 °C.
 Temp Cycle –55/+125 °C, 1000 cycles.
 HAST 130 °C, 85% RH, 96 hours.
 Temp/Humidity 85 °C/85%RH/1000 hours.
 High Temp Storage 150 °C, 1000 hours.
 Board level Thermal Cycle –40/+125 °C, 1000 cycles.
 Parts packaged in JEDEC matrix trays.
 PoPs are only available Pb-free (not Tin-Lead). Available alloys are:
(SAC105) 98.5%Sn/1.0%Ag/0.5%Cu Top Package and (SAC125Ni)
98.2%Sn/1.2%Ag/0.5%Cu/0.05%Ni bottom package.
 It is recommended that parts be pre-baked at 125 °C for 48 hrs before
using parts regarding moisture concern.
 PoP’s are not available without solder balls.
Amkor

A-TMV620-.4mm-14mm-DC-Alloy
Through Mold Via
Package Stackable
I/O Count
(Bottom Side Only)
(SAC105 and SAC125Ni)
Daisy Chain
Body Size
Pitch
Ball Diameter
I/O Count
Ball Diameter
200
620
0.33mm
0.30mm
Please Note
 Amkor supporting data is available on our website for: Board
See drawings on the following pages (25–26) for
additional technical data. Color coded version available on our website: www.practicalcomponents.com
Level Reliability (BLR), PoP application notes, PoP Stencil &
Stacking paper for SMT Conditions.
 IMAPS and SMTA White Paper Articles for
additional supporting data available on our
website:www.practicalcomponents.com.
23
TMV® PoP
14mm 620 TMV Bottom Package Design Dimensions
Foot print - top (b)
Package size (a)
Die size (d)
Foot print - bottom (c)
Body (a)
Foot Print–top (b)
Foot Print–bottom (c)
Die (d)
14 x 14mm
0.50 pitch, 200 ball
27 matrix, 2 row
0.4 pitch, 620 BGA
33 matrix, 4 + 2 row
7.6 x 7.6mm
Daisy Chain 4 Net Design
Daisy chain netlist of TMV, Bottom package balls.
Daisy chain netlist of TMV corners only.
A3, A31
Corner NC pads of top site package.
[H17 H18], [H19 H20]
Daisy chain netlist of top side (Top FBGA to TMV pin
memory interface).
Bottom package:
Package Stackable TMV.
[T8 U8], [V8 W8]
* Color diagram of DC Net design available on our website.
24
TMV® PoP
TMV 620 (Bottom Package)
Bottom Side Daisy Chain Nets
TMV 620 (Bottom Package)
Top Side Daisy Chain Nets
Bottom side of bottom package
(top view through package)
14x14mm, 0.4 mm TMV620, 33x33 ball matrix.
Top side of bottom package
14x14mm, 0.5 mm PoP200, 27x27 ball matrix.
Connected thru
bottom side
[H17 H18] , [H19 H20]
1 2
3 4 5
6 7 8 9 10 11 12 1314 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
Daisy chain pattern of
TMV–Bottom BGAs corner
24 balls
TMV–Bottom BGAs
Top View
Top side 16
corner ball DC net
Top side main DC net
1 2
3 4 5
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
6 7 8 9 10 11 12 1314 15 16 17 18 19 20 21 22 23 24 25 26 27
Connected thru
bottom side
[T8 U8] , [V8 W8]
Top View
Top PoP + TMV
Daisy Chain Netlist
200 PoP (Top Package ONLY)
Daisy Chain Netlist
Connected thru
bottom side
[H17 H18] , [H19 H20]
1 2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
3 4 5
6 7 8 9 10 11 12 1314 15 16 17 18 19 20 21 22 23 24 25 26 27
1 2
Top side 16
corner ball DC net
Top View
Top side 16
corner ball DC net
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
3 4 5
6 7 8 9 10 11 12 1314 15 16 17 18 19 20 21 22 23 24 25 26 27
Connected thru
bottom side
[T8 U8] , [V8 W8]
Top View
25
TMV® PoP
Stacked view of 4 DC Nets for
BLR testing
Test Board PWB Netlist Pattern for
BLR Testing
1-1
1 2
2-1
1-1
1-2
3 4 5
1 2
6 7 8 9 10 11 12 1314 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
PWB Pattern for
Test Board design
2-2
4-1
3-1
2-1
3-2
Top View
PWB Pattern for
Test Board design
4-2
1-2
3 4 5
6 7 8 9 10 11 12 1314 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
2-2
4-1
3-1
3-2
Top View
4-2
TMV® PoP Overall Stack Up Table
B3
B2
B1
A3
A2
A1
100μm core, 350μm mode cap (Laminate)
Symbol
Unit
Min
Nom
Max
Tolerance
A1 (Ball, 0.4 pitch)
A2 (4L laminate)
A3 (Mold cap)
Total Bottom Pkg Height
B1 (package stand-off )
B2 Subs
B3 Mold
B2 + B3
Overall PoP Stack Height
mm
mm
mm
mm
mm
mm
mm
mm
mm
0.100
0.260
0.230
0.729
0.370
0.100
0.380
0.494
1.301
0.150
0.300
0.350
0.800
0.400
0.130
0.400
0.530
1.380
0.200
0.340
0.380
0.871
0.430
0.160
0.420
0.566
1.459
0.05
0.04
0.03
0.03
0.03
0.02
26
TMV® (Through Mold Via) 14mm Board and Kit
!
NEW
Drop Test Lead Free Kit
PCB250 14mm TMV Drop Test Board
Practical Components new TMV® 14MM test board and
kit is a basic drop test board designed for the new Amkor
TMV® (Through Mold Via) components. This test eight layer
board is a 3x5 array with 15 components placements per
board. The board is 132mm x 77mm in size, and 1.0mm
thick. The standard surface finish is OSP. Our test vehicle
is designed for the new TMV® 620 solder ball .4mm pitch
bottom component and the PoP 200 solder ball .5mm
top component. Both top and bottom components have
a daisy chain pattern through the substrate of the part. A
daisy chain pattern also runs through the test board. The
design allows for daisy chain 3 net design. Meaning both
top and bottom components as well as the board can be
tested individually or as a group. This kit allows the end
user to test the integrity of their process applications for
TMV® components.
Notes
Board size is 132 x 77mm, 8 layers, .039" thick,
no microvias.
n Board material is IS-410 High Temp. 180Tg.
n Standard board finish is OSP Entek CU-106A-HT.
n 15 daisy-chain pad placements for 14x14 620
TMV® component.
n Immersion Silver board finish is available upon special
request. MOQ may apply.
n
Order Number: 15110 PCB250-14mm-TMVDT (board only)
Order Number: 31557 A-PoP200-.5-14mm-DC-105 (top component only)
Order Number: 31558 A-TMV620-.4-14mm-DC-125 (bottom component only)
27
PoP
Package on Package
Amkor is offering daisy chain samples of their award winning bottom
Package Stackable Very Thin Fine Pitch BGA (PSvfBGA) and their top PoP
optimized for Package on Package (PoP) requirements. PoP has become
the solution of choice for an increasing number of mobile consumer
applications for 3D integration of logic and memory devices. Amkor’s
PSvfBGA is a high density fine pitch BGA package supporting logic or
ASIC devices including base band, application and image processors. PoP
stacking allows the OEM greater device, supplier and time to market flexibility by sourcing the bottom and top devices from their preferred logic
and memory suppliers and then stacking the devices in the PWB surface
mount assembly flow. A wide range of leading wireless and mobile
integrated device manufacturers are relying on Amkor’s technical and
industry leadership in PoP.
Stacked Package
PoP Package on Package—Mating Top and Bottom Daisy Chain Samples
Part Description
I/O Count
12mm Body Size
A-MPoP128-.65mm-12mm-DC
A-PSvfBGA305-.5mm12mm-DC
14mm Body Size
A-PSvfBGA353-.5mm-14mm-DC
15mm Body Size
A-PSvfBGA604-.5-15mm-DC
Pitch
Body Size
Ball
Matrix
Ball
Alignment
Quantity
Per Tray
128 (top package)
128 (middle package)
.65mm
12mm
.65mm
12mm
.65mm (top) - .5mm (bottom) 12mm
18x18
18x18
23x23
Perimeter
Perimeter
Perimeter
152
152
152
152 (top package)
.65mm
14mm
21x21
26x26
Perimeter
Perimeter
119
119
160 (top package)
.65mm
15mm
22x22
28x28
Perimeter
Perimeter
112
112
Notes
Fine pitch 0.5mm bottom package footprints
 Stacked package heights of 1.2mm to 1.6mm available in a variety of
configurations (see Stack Up table on following pages)
 Wafer thinning / handling < 100 µm
 Consistent product performance and reliability
 Package configurations compliant with JEDEC standards
 Moisture Resistance Testing is JEDEC Level 3 @ 260 °C
 Temp Cycle –55/+125 °C, 1000 cycles
 HAST 130 °C, 85% RH, 96 hours
 Temp/Humidity 85 °C/85%RH/1000 hours
 High Temp Storage 150 °C, 1000 hours
 Board level Thermal Cycle –40/+125 °C, 1000 cycles
 Parts packaged in JEDEC matrix trays
 PoPs are only available Pb-free (not Tin-Lead). Available alloys are:
SAC305, SAC405, SAC105 and SAC125Ni*.
 *SAC125Ni (98.25%Sn/1.2%Ag/0.5%Cu/0.05%Ni) is only available for bottom packages.
 It is recommended that parts be pre-baked at 125 °C for 48 hrs before
using parts regarding moisture concern.
 PoPs are not available without solder balls.

See drawings on the following pages (29–25) for
additional technical data. Color coded version available on our website: www.practicalcomponents.com
A-PSvfBGA305-.5mm-12mm-DC-Alloy
Amkor
Package Stackable
Very Thin
Fine Pitch BGA
I/O Count
(Bottom Side Only)
Pitch
(SAC305, SAC405,
SAC105, and SAC125Ni)
Daisy Chain
Body Size
Ball Diameter
I/O Count
Ball Diameter
128
152
305
353
0.45mm
0.45mm
0.30mm
0.30mm
For recommended kits see pages 37, 41 and 26.
Please Note
 Amkor supporting data is available on our website for: Board
Level Reliability (BLR), PoP application notes, PoP Stencil &
Stacking paper for SMT Conditions.
 IMAPS and SMTA White Paper Articles for
additional supporting data available on our
website:www.practicalcomponents.com.
28
Package on Package (PoP)
12x12mm Stacked Daisy Chain
12x12mm, 0.65mm to pitch
Stacked Daisy Chain
12mm 305 PSvfBGA Bottom Package Design Dimensions
Package size (a)
0.27mm
Max die size (d)
Body (a)
Die (d)
Bond Fingers
Available
12 x 12mm
18 matrix, 2 row
0.5 pitch, 292 I/Os
23 matrix, 4 row
+ 12 NC + A1 ball 305 BGA
7.0 mm
332
PoP Daisy Chain 3 Net Design
Daisy chain netlist of PSvfBGA, Bottom
package balls.
Daisy chain netlist of top side (Top PoP to PSvfBGA 12
corner balls reserved for NC or additional supplies as
memory combinations may require).
L20 M20
Daisy chain netlist of top side (Top PoP to PSvfBGA
116 pin memory interface).
Bottom package called: Package Stackable
very thin fine pitch BGA (PSvfBGA).
M4 N4
29
PSvfBGA 305
(Bottom Package) Daisy Chain Nets
Top package interface (top view) 0.65 mm pitch,
128 pads, 18x18 ball matrix
Bottom side of bottom package
(top view through package) 12x12mm,
0.5 mm PSvfBGA305, 23x23 ball matrix
1 2
3 4 5
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
1
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
A
*
B
C
* Connected thru
bottom side (B)
D
PSvfBGA—Top
memory pads
E
F
G
H
(B)
J
(A)
Connected thru
bottom side (A)
K
L
M
Top side 12 corner ball
DC net
N
P
R
T
U
V
Daisy chain pattern of PSvfBGA -Bottom BGAs
PoP + PSvfBGA
Daisy Chain Netlist
128 PoP (Top Package)
Daisy Chain Netlist
1
2
3
4
5
6
7
8
9
1
10 11 12 13 14 15 16 17 18
A
A
B
B
Top PoP package
Bottom side (top view
through package)
C
D
E
F
12x12 mm, 0.65 mm pitch
128 PoP
18x18 ball matrix
2 rows
G
H
J
K
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
* Connected thru
bottom side (B)
C
D
E
F
G
Top PoP
stacked on PSvfBGA
(top view through package
H
J
K
L
L
M
M
N
N
P
P
R
R
T
T
U
U
V
V
Daisy chain pattern for 12 corner balls (typically
reserved as NC for applications with no underfill, or
option to add additional I/O or memory supplies as
required for high density combinations)
2
Connected thru
bottom side (A)
Daisy chain pattern of Top package for
116I/O memory interface
Daisy chain netlist of
Top PoP and PSvfBGA.
30
PWB Netlist
Pattern for BLR Testing
1 2
1-1
3 4 5
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
Stacked view of 3 DC Nets for
BLR testing
1 2
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
1-1
1-2
4-1
3-1
4-2
3-2
3 4 5
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
Black line: PWB pattern
In: 1-1, 3-1, 4-1
Common: 1-2, 3-2, 4-2
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
1-2
4-1
3-1
4-2
3-2
In: 1-1, 3-1, 4-1
Common: 1-2, 3-2, 4-2
PoP Overall Stack Up Example
B3
B2
B1
A2
A1
PoP +PSvfBGA
Symbol
Unit
Min
Max
Nom
A2 (4L laminate)
B1 (Ball, 0.65 pitch)
B2 (2L laminate)
B3 (Mold cap)
Overall Pkg Height
mm
mm
mm
mm
mm
mm
0.150
0.260
0.270
0.180
0.420
1.378
0.250
0.340
0.330
0.240
0.480
1.542
0.200
0.300
0.300
0.210
0.450
1.460
B2 and B3 may vary depending on top memory PoP (MCP) design rules.
Overall Stack up to be finalized based on top PoP rules.
31
12x12mm Stacked Daisy Chain—3 Package Stacking
12x12mm, 0.65mm to pitch
Stacked Daisy Chain—3 Package Stacking
PoP Daisy Chain 3 Net Design—2 Package Stack
Daisy Chain netlist of PSvfBGA, Bottom package balls
L20 M20
Daisy chain netlist of top side (Top FBGA to PSvfBGA
116 pin memory interface)
Bottom package called:
Package Stackable very thin fine pitch BGA (PSvfBGA)
M4 N4
PoP Daisy Chain 3 Net Design—3 Package Stack
Daisy Chain netlist of PSvfBGA, Bottom package balls
Daisy chain netlist of middle/bottom side (middle of PSvfBGA to
bottom of PSvfBGA 128 balls)
L20 M20
Daisy chain netlist of middle/top side (FBGA to middle
PSvfBGA 128 balls)
Bottom/middle package called:
Package Stackable very thin fine pitch BGA (PSvfBGA)
M4 N4
32
PoP Overall Stack Up—2 Package Stack
B3
B2
B1
A2
A1
Symbol
Unit
Min
Nom
Max
A2 (4L laminate)
B2 (2L laminate)
B3 (Mold cap)
Overall Pkg Height
mm
mm
mm
mm
mm
mm
0.180
0.260
0.270
0.180
0.420
1.408
0.230
0.300
0.300
0.210
0.450
1.490
0.280
0.340
0.330
0.240
0.480
1.572
Assumed standard DC substrate
Thinner stack up feasible in future build
PoP Overall Stack Up—3 Package Stack
C3
C2
C1
B2
B1
A2
A1
Symbol
Unit
Min
Nom
Max
A2 (4L laminate)
B2 (2L laminate)
C1 (Ball, 0.65 pitch)
C2 (2L laminate)
C3 (Mold cap)
Overall Pkg Height
mm
mm
mm
mm
mm
mm
mm
mm
0.180
0.260
0.270
0.180
0.270
0.180
0.420
1.907
0.230
0.300
0.300
0.210
0.300
0.210
0.450
2.000
0.280
0.340
0.330
0.240
0.330
0.240
0.480
2.093
Assumed standard DC substrate
Thinner stack up feasible in future build
33
PSvfBGA 305 (Bottom Package) Daisy Chain Nets
Bottom side of bottom package (top view through package)
12x12mm, 0.65 mm PSvfBGA305, 23x23 ball matrix
1 2
3 4 5
Top/Middle package interface (top view)
0.65mm pitch, 128 pads, 18x18 ball matrix
1
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
*
B
C
D
* Connected to
bottom side (B)
E
F
G
H
(B)
(A)
J
K
Connected to
bottom side (A)
L
Top View
M
N
P
R
T
U
V
Daisy chain pattern of PSvfBGA—Top memory pads
Daisy chain pattern of PSvfBGA—Bottom BGAs
Top side 12 corner ball DC net
PSvfBGA 128 (Middle Package) Daisy Chain Nets
Bottom side of middle package (top view through package)
12x12mm, 0.65 mm PSvfBGA128, 18x18 ball matrix
1
2
3
4
A
5
6
7
8
9
Top side of middle package
Top package interface (top view)
0.65mm pitch, 128 pads, 18x18 ball matrix
1
10 11 12 13 14 15 16 17 18
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
K
L
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
A
J
(C)
K
L
M
M
N
N
P
P
R
R
T
T
U
U
V
V
Connected to
bottom side (C)
Top View
Each pad on the top side is connected to the corresponding
pad on the bottom side through via.
34
FBGA 128 (Top Package) Daisy Chain Netlist
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
A
B
C
Top FBGA package
through package)
D
E
F
G
H
J
12x12 mm, 0.65 mm pitch
FBGA 128
18x18 ball matrix
2 rows
K
L
M
N
Top View
P
R
T
U
V
Middle-to-Bottom Package Connection after 3 PKG Stack
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
A
B
C
D
E
* Connected thru
bottom side (B)
F
G
H
J
K
L
M
Connected thru
bottom side (A)
Top View
N
P
R
T
U
V
Daisy chain pattern of Top package for
116 I/O memory interface
35
Top-to-Middle Package Connection after 3 PKG Stack
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
A
B
C
D
E
F
G
H
J
K
L
Connected to
bottom side (A)
Top View
M
N
P
R
T
U
V
PWB Netlist Pattern for BLR Testing
1 2
1-1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
3 4 5
1 2
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
1-1
1-2
3-1
3-2
4-1
4-2
PWB Pattern
In: 1‑1, 3‑1, 4‑1
Common: 1‑2, 3‑2, 4‑2
Top View
36
Stacked View of 3 DC Nets for BLR Testing
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
3 4 5
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
1-2
3-1
3-2
4-1
4-2
PWB Pattern
In: 1‑1, 3‑1, 4‑1
Common: 1‑2, 3‑2, 4‑2
Top View
Top View
Top View
PoP (Package on Package) 12mm Board and Kit
Lead-Free Test Kit
PCB200 12mm Board
This PoP 12mm Board and Kit is designed as test vehicle
for the new Amkor (PSvfBGA) 12x12 305 PoP package. PoP
packages from Amkor focus on high density logic devices.
PoP packages are designed for products such as cell
phones, digital cameras and other mobile applications
benefiting from the combination of stacked packages and
small footprint technology. This test board enables the
end user to test their process applications on the top and
bottom PoP components.
With daisy-chain patterns in both packages and the
PCB200 Board, customers are able to check for continuity
to guarantee the integrity of their process.
Notes
n
Board size is 132 x 77mm, 8-layers, .039" thick,
no microvias.
n Board material is IS-410 High Temp 180Tg.
n Standard board finish OSP Entek CU-106A-HT.
n Immersion Silver finish is also available upon special
n 15 daisy-chain pad placements for 12x12
305 PoP component.
n See page 28 for available solder ball alloy’s for PoP
components. SAC305, SAC405, SAC105 and
SAC125Ni is available.
Order Number: 19577 PCB200 12mm (board only)
Order Number: 31288 A-PoP128-.65mm-12mm-DC-SAC105 (top component only)
Order Number: 31289 A-PSvfBGA305-.5mm-12mm-DC-SAC125Ni (bottom component only)
37
Package on Package (POP)
14x14mm
Stacked Daisy Chain
14mm 353 PSvfBGA
Bottom Package Design Dimensions
Package size (a)
0.27mm
Max die size (d)
Body (a)
Die (d)
Bond Fingers
Available
14 x14 mm
21 matrix, 2 row
0.5 pitch, 340 I/Os
26 matrix, 4 row
+ 12 NC + A1 ball 353 BGA
8.9 mm
328 to 396
PoP Daisy Chain 3 Net Design
Daisy chain netlist of PSvfBGA, Bottom
package balls
Daisy chain netlist of top side (Top PoP to PSvfBGA 12
corner balls reserved for NC or additional supplies as
memory combinations may require).
M23 N23
Daisy chain netlist of top side (Top PoP to PSvfBGA
140 pin memory interface)
Bottom package called: Package Stackable very thin
fine pitch BGA (PSvfBGA)
M4 N4
38
PSvfBGA 353
(Bottom Package) Daisy Chain Nets
Bottom side (top view through package) 14x14mm,
0.5 mm PSvfBGA353, 26x26 ball matrix
1 2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
Top side—Top package interface (top view) 0.65 mm pitch,
152 pads, 21x21 ball matrix
31 42 53 64 75 86 97 108 11
9 12
10 13
11 14
12 15
1316
14 17
15 18
16 19
17 20
18 21
19 22
20 23
21 24
22 25
23 26
24 25 26
1
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
Daisy chain pattern
of PSvfBGA—Top
memory pads
(B) (B)
(A) (A)
Top side 12
corner ball DC net
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
K
K
L
L
M
M
N
N
P
P
R
R
T
T
U
U
V
V
W
W
Y
Y
AA
AA
Daisy chain pattern of PSvfBGA—Bottom BGAs
2
3
4
5
6
7
8
9
1
10 11 12 13 14 15 16 17 18 19 20 21
A
B
B
C
E
F
G
H
J
K
L
Connected
Connected
with with
bottom
bottom
side side
(A) (A)
Top PoP + PSvfBGA
Daisy Chain Netlist
A
D
Top side 12 corner
Connected
Connected
thru thru
ball DC net bottom
bottom
side side
(B) (B)
Top side 12 corner ball DC net
152 PoP
(Top Package) Daisy Chain Netlist
1
2 13 24 3 5 4 6 57 68 7 9 810 911 10
12 11
13 12
14 1315 1416 15
17 16
18 1719 1820 1921 20 21
A
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21
Connected with
bottom side (B)
C
Top PoP package
through package)
14x14 mm, 0.65 mm 152 PoP
21x21 ball matrix
2 tiers
M
N
P
R
D
E
F
G
H
Daisy chain
pattern of Top
package for
140 I/O memory
interface
Top PoP
stacked on PSvfBGA
J
K
L
Connected with
bottom side (A)
M
N
P
R
T
T
U
U
V
V
W
W
Y
Y
AA
AA
Daisy chain pattern for 12 corner balls
(typically reserved as NC for applications with no
underfill, or option to add additional I/O or memory
supplies as required for high density combinations).
Daisy chain netlist of Top FBGA and PSvfBGA
39
Stacked View of 3 DC Nets
For BLR Testing
PWB Netlist Pattern
for BLR Testing
PWB (top view)
1 2
1-1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
3 4 5
1 2
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
1-1
1-2
3-1
4-1
3-2
4-2
In: 1-1, 3-1, 4-1
Common: 1-2, 3-2, 4-2
3 4 5
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
1-2
3-1
4-1
3-2
4-2
In: 1-1, 3-1, 4-1
Common: 1-2, 3-2, 4-2
PoP Overall Stack Up Example
B3
B2
B1
A2
A1
PoP + PSvfBGA
Symbol
Unit
Min
Max
Nom
A2 (4L laminate)
B2 (2L laminate)
B3 (Mold cap)
Overall Package Height
mm
mm
mm
mm
mm
mm
0.150
0.260
0.270
0.180
0.420
1.378
0.250
0.340
0.330
0.240
0.480
1.542
0.200
0.300
0.300
0.210
0.450
1.460
B2 and B3 may vary depending on top memory PoP (MCP) design rules.
Overall Stack up to be finalized based on top PoP rules.
40
PoP (Package on Package) 14mm Board and Kit
Lead-Free Test Kit
PCB200 14mm Board
This PoP 12mm Board and Kit is designed as test vehicle
for the new Amkor (PSvfBGA) 14x14 305 PoP package. PoP
packages from A mkor focus on high density logic devices.
PoP packages are designed for products such as cell
phones, digital cameras and other mobile applications
benefiting from the combination of stacked packages and
small footprint technology. This test board enables the
end user to test their process applications on the top and
bottom PoP components.
With daisy-chain patterns in both packages and the
PCB200 Board, customers are able to check for continuity
to guarantee the integrity of their process.
Notes
n
Board size is 132 x 77mm, 8-layers, .039" thick,
no microvias.
n Board material is IS-410 High Temp 180Tg.
n Standard board finish OSP Entek CU-106A-HT.
n 15 daisy-chain pad placements for 14x14
353 PSvfPGA component.
n Immersion Silver finish is also available upon special
n See page 28 for available solder ball alloy’s for PoP
components. SAC305, SAC405, SAC105 and
SAC125Ni is available.
n 12mm PC board and PoP components available (see
page 28).
Order Number: 12953 PCB200 14mm (board only)
Order Number: 31290 A-PoP152-.65mm-14mm-DC-LF-SAC105 (top component only)
Order Number: 31291 A-PSvfBGA305-.5mm-14mm-DC-LF-SAC125Ni (bottom component only)
41
PBGA
Plastic Ball Grid Arrays (PBGA) incorporate advanced assembly processes and designs for low cost, high performance applications. PBGAs
are designed for low inductance, improved thermal operation and
enhanced SMT-ability.
All PBGAs listed on this page are daisy-chained and
available lead-free.
PBGA Plastic Ball Grid Array 1.0mm Pitch
Part Description
I/O Count
Pitch
Body Size
Ball Matrix
A-PBGA208-1.0mm-17mm
208
256
288
289
324
324
484
516
580
676
680
928
1,156
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
1.0mm
17mm
17mm
23mm
19mm
19mm
23mm
27mm
31mm
35mm
27mm
35mm
40mm
35mm
16 x 16
16 x 16
22 x 22
17 x 17
18 x 18
22 x 22
26 x 26
30 x 30
34 x 34
26 x 26
34 x 34
39 x 39
34 x 34
Ball
Alignment
Perimeter
Full Array
Perimeter
Full Array
Full Array
Perimeter
Perimeter
Perimeter
Perimeter
Full Array
Perimeter
Perimeter
Full Array
Notes
Overall thickness of 1.0mm pitch PBGA packages will vary (please call for
more details).
 Parts are packaged in JEDEC trays.
 Call for tape and reel quantity and availability.
 Solder ball material is eutectic 63/37 SnPb.
 All components are daisy-chained.
 Daisy-chained connections are connections between I/O
(input/output) of the component.
 BT (Bismaleimide-Triazine) substrates.
 JEDEC MS-034 standard outlines.
 Ball diameter varies (see chart).
 BGA packages should be baked at 125ºC for 24 hours prior to assembly
to prevent delamination during the assembly process.
Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) is also available.
Sn3.5Ag is also available (call for availability).
 PBGAs are not available without solder balls.
Amkor

n
Available
Lead-Free Alloys
SAC405, SAC305 or Sn3.5Ag
A-PBGA208-1.0mm-17mm-DC-Alloy
Plastic Ball
Grid Array
I/O Count
n
Quantity
Per Tray
90
90
60
84
84
60
40
27
24
40
24
21
24
(SAC305, SAC405)
Pitch
Body Size
Daisy Chain
Add “TR” to end of part number for Tape and Reel.
Add “SAC405” or “SAC305” or “Sn3.5Ag” to end of part number for Lead-Free.
For kits see pages 80, 87, 90, 95,
96, 105, and 109.
Practical does not guarantee the chain of custody for moisture
sensitivity. This is due to the factory making consolidated shipments
and customers quantity being met (breaking full tray quantities).
42
PBGA
Amkor Plastic Ball Grid Arrays (PBGA) incorporate advanced assembly processes and designs for low cost, high performance applications. PBGAs are
designed for low inductance, improved thermal operation and enhanced
SMT ability.
Some PBGAs are available
daisy-chained. All PBGAs are
available lead-free.
PBGA Plastic Ball Grid Array 1.27mm Pitch
Part Description
I/O Count
Pitch
Body Size
Ball Matrix
A-PBGA208-1.27mm-23mm*
208
217
256
272
329
356
388
420
456
564
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
23mm
23mm
27mm
27mm
31mm
27mm
35mm
35mm
35mm
40mm
17 x 17
17 x 17
20 x 20
20 x 20
23 x 23
20 x 20
26 x 26
26 x 26
26 x 26
30 x 30
Ball
Alignment
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Quantity
Per Tray
60
60
40
40
27
40
24
24
24
21
Notes
* = DC available
 Daisy-chained connections are connections between I/O (input/output)
of the component.
 BT (Bismaleimide-Triazine) substrates.
 JEDEC MS-034 standard outlines.
 Ball diameter varies (see chart).
 BGA packages should be baked at 125ºC for 24 hours prior to assembly
to prevent delamination during the assembly process.
Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or Sn3.5Ag (call for
SnAg availability)
 PBGAs are not available without solder balls.
Amkor

Practical does not guarantee the chain of custody for moisture
sensitivity. This is due to the factory making consolidated shipments
and customers quantity being met (breaking full tray quantities).
A-PBGA208-1.27mm-23mm-DC-Alloy
Plastic Ball
Grid Array
I/O Count
(SAC305, SAC405)
Package
PBGA
PBGA
PBGA
PBGA
(1)
(2)
Units = mm
Notes
Pitch
1.00
1.00
1.27
1.50
Solder Ball
Land On
Package and
Board
Solder Ball
Height on
Package
(B)
Solder Joint
Height After
SMT*
(C)
0.50
0.63
0.76
0.76
0.45
0.45
0.63
0.63
0.40
0.55
0.60
0.60
0.32
0.48
0.52
0.52
*Assumptions: 5 mils Solder Paste
Solder Mask Defined Pad
Daisy Chain
Body Size
Pitch
n Add “SAC405” or “SAC305” or “Sn3.5Ag” to end of part number for Lead-Free.
n
Mold Compound
Die Attach
Au Wire
Solder
Mask
Die
Via
Eutectic Solder Ball
Rigid Laminate
Note: Drawing not to scale.
(As Received)
Solder Ball Height
After Ball Attach
B
A
Diameter = Height
Solder
Ball
Diameter
(A)
Available
Lead-Free Alloys
SAC405, or SAC305 or Sn3.5Ag
After Reflow
C
Motherboard
For kits see pages 92, 94,
96, 105, and 107.
(1) applies to 13, 15 and 17mm packages.
(2) applies to 23, 27, 31, 35mm, 37.5mm and 40.0mm packages.
43
SBGA
SuperBGA®
SuperBGA® (SBGA) package is a very low profile, high-power BGA. The IC
is directly attached to an integrated copper heatsink. Since the IC and the
I/O are on the same side, signal vias are eliminated.
SBGA SuperBGA® 1.27mm Pitch
Part Description
I/O Count
Pitch
Body Size
Ball Matrix
A-SBGA256-1.27mm-27mm
A-SBGA560-1.27mm-42.5mm
256
304
352
432
520
560
600
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
27mm
31mm
35mm
40mm
40mm
42.5mm
45mm
20 x 20
23 x 23
26 x 26
31 x 31
31 x 31
33 x 33
35 x 35
Ball
Alignment
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Perimeter
Notes
Superior thermal performance.
 Light weight
 Low profile (1.4mm mounted)
 Moisture resistant (JEDEC level 3)
 JEDEC MO-192 standard outlines
 Enhanced electrical performance > 1 GHz
 BGA packages should be baked at 125°C for 24 hours prior to assembly
to prevent delamination during assembly process.
 Parts can be baked and dry-packed.
 All components are daisy-chained except for 520 I/O.
 Lead-free parts are available with (SAC405 )95.5% Sn/ 4.0% Ag/ 0.5%
Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305). Sn3.5Ag is also
available (call for availablity).
 SBGAs are not available without solder balls.
Amkor

Quantity
Per Tray
40
27
24
21
21
12
12
A-SBGA256-1.27mm-27mm-DC-Alloy
®
SuperBGA
I/O Count
Pitch
(SAC305, SAC405)
and SnAg)
Daisy Chain
Body Size
n Add “SAC405” or “SAC305” or “Sn3.5Ag” to end of part number for Lead-Free.
n
Substrate
Die
Copper Heat Spreader
Copper Ring
Solder Balls
Wires
Mounting Surface
Encapsulant
Resin Dam (Part of Substrate)
Note: Drawing not to scale.
Solder Ball Height
After Ball Attach
(As Received)
B
A
Pb
Looking for Lead-Free?
Diameter = Height
This symbol indicates that
lead-free parts are available!
After Reflow
C
Motherboard
Package
Pitch
A
B
C
SBGA
1.27
.76
.62
.52
All units in mm.
Assumptions: 5 mils solder paste. Solder mask defined pad. Typical motherboard no solder mask defined pad:
0.50 Pitch – 0.28
0.80 Pitch – 0.30
 1.00 Pitch – 0.38


44
OmQFN
Open-molded Quad Flat Pack No Leads
Microelectronic Packaging & Assembly Solutions
From prototype to production volumes, these pre-molded QFN packages, created by Quik-Pak, provide a high quality, fast solution for your
assembly needs.
The pre-molded packages come in a variety of sizes. They are available
from 3x3mm to 12x12mm body size with lead pitch sizes ranging from
.8mm to .4mm. Covers or lids are also available for air cavity applications.
OmQFN Open-molded Quad Flat Pack No Leads Package
Part Number
.4mm Pitch
QPQFN28-4mm-.4mm
QPQFN48-6mm-.4mm
QPQFN88-10mm-.4mm
QPQFN100-12mm-.4mm
.5mm Pitch
QPQFN12-3mm-.5mm
QPQFN16-3mm-.5mm
QPQFN20-4mm-.5mm
QPQFN24-4mm-.5mm
QPQFN28-5mm-.5mm
QPQFN32-5mm-.5mm
QPQFN40-6mm-.5mm
QPQFN44-7mm-.5mm
QPQFN48-7mm-.5mm
QPQFN56-8mm-.5mm
QPQFN64-9mm-.5mm
QPQFN72-10mm-.5mm
QPQFN80-12mm-.5mm
.65mm Pitch
QPQFN8-3mm-.65mm
QPQFN12-3mm-.65mm
QPQFN16-4mm-.65mm
QPQFN20-5mm-.65mm
QPQFN24-5mm-.65mm
QPQFN28-6mm-.65mm
QPQFN32-7mm-.65mm
Lead Count
Body Size
Pitch
28
48
88
100
4x4mm
6x6mm
10x10mm
12x12mm
.4mm
.4mm
.4mm
.4mm
12
16
20
24
28
32
40
44
48
56
64
72
80
3x3mm
3x3mm
4x4mm
4x4mm
5x5mm
5x5mm
6x6mm
7x7mm
7x7mm
8x8mm
9x9mm
10x10mm
12x12mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
8
12
16
20
24
28
32
3x3mm
3x3mm
4x4mm
5x5mm
5x5mm
6x6mm
7x7mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
Notes
Larger die paddle area.
 Supports larger die and ground bonds per given body size.
 RoHS and REACH compliant “green” molding compound.
 Gold plated.
 Superior bondability.
 Custom body sizes and lead counts available.
 Components can be encapsulated or lids are available.
 40Au/80Ni Plated

Quik-Pak
QP QFN8-3mm-.65mm
Quad Flat Pack
No Leads
Lead Count
Pitch
Body Size
Assembly Solutions Include the following:
 Wafer Dicing
Wire Bonding
Custom Packaging
 Backgrinding
 Complete Assembly


45
MLF®MicroLeadFrame®
Amkor’s MicroLeadFrame® Package (MLF®) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact
to the PWB. The package also offers Amkor’s ExposedPad™ technology
as a thermal enhancement by having the
die attach paddle exposed on the bottom of the package surface to provide an efficient
heat path when soldered directly to the PWB.
MLF®—MicroLeadFrame®
Part Description
.4mm Pitch
A-MLF28-4mm-.4mm
A-MLF48-6mm-.4mm
A-MLF88-10mm-.4mm
A-MLF100-12mm-.4mm
.5mm Pitch
A-MLF12-3mm-.5mm
A-MLF16-3mm-.5mm
A-MLF20-4mm-.5mm
A-MLF24-4mm-.5mm
A-MLF28-5mm-.5mm
A-MLF32-5mm-.5mm
A-MLF36-6mm-.5mm
A-MLF40-6mm-.5mm
A-MLF44-7mm-.5mm
A-MLF48-7mm-.5mm
A-MLF52-8mm-.5mm
A-MLF56-8mm-.5mm
A-MLF64-9mm-.5mm
A-MLF68-10mm-.5mm
A-MLF72-10mm-.5mm
.65mm Pitch
A-MLF8-3mm-.65mm
A-MLF16-4mm-.65mm
A-MLF20-5mm-.65mm
A-MLF28-6mm-.65mm
A-MLF32-7mm-.65mm
A-MLF44-9mm-.65mm
.8mm Pitch
A-MLF12-4mm-.8mm
A-MLF16-5mm-.8mm
A-MLF20-6mm-.8mm
A-MLF28-7mm-.8mm
Notes
Lead Count
Body Size
Pitch
Quantity
Per Tube
28
48
88
100
4mm
6mm
10mm
12mm
.4mm
.4mm
.4mm
.4mm
75
50
30
25
12
16
20
24
28
32
36
40
44
48
52
56
64
68
72
3mm
3mm
4mm
4mm
5mm
5mm
6mm
6mm
7mm
7mm
8mm
8mm
9mm
10mm
10mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
100
100
75
75
60
60
50
50
43
43
37
37
33
30
30
8
16
20
28
32
44
3mm
4mm
5mm
6mm
7mm
9mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
100
75
60
50
43
33
12
16
20
28
4mm
5mm
6mm
7mm
.8mm
.8mm
.8mm
.8mm
75
60
50
43
Amkor
A-MLF12-3mm-.5mm-DC-Sn
Parts are packaged in tubes (standard).
MicroLeadFrame™
(100% Matte Sn)
 Parts are available in trays or on tape and reel upon special request.
Lead Count
Daisy Chain
 Solder plating finish available is 100% Matte Sn.
Body Size
Pitch
 Moisture sensitivity level is JEDEC 1.
 Two MLF® designs are available: Punch or Saw (see the
Cross-Sections MLF®
cross-section drawing).
Mold
 Small size (50% space reduction as
Gold
NiPd
Die Attach
Die Attach
Solder
Gold Wire Mold Compound
Compound
Wire
Plating
Material
Material Ag Plating
compared with TSSOP).
Plating
 MLF® package is a near CSP plastic
Die
Die
encapsulated package with a copper
leadframe substrate.
Down
Cu
Cu
Down
Exposed
Exposed
Ground Bond
Ground Bond
Bond
 MLF® is also known as QFN, MCC or MLP.
Leadframe
Leadframe Bond
Die Paddle
Die Paddle
 0.6mm to 1.5mm maximum height
Individual Unit Design “Punch”
MAP Design “Saw”
 Body sizes ranging from 3 x 3mm
to 12 x 12mm.
For kits see pages 87, 90, 92, 100 and 105.
 Pin counts and body sizes change on an ongoing basis.
Please call for updated listing of available packages.

46
Dual Row MLF®
Amkor’s new Dual Row MLF® (MicroLeadFrame®) package with 2 rows of
lands is a cost effective, high performance solution for devices requiring
up to 164 I/O. Typical applications include hard disk drives, USB controllers, and Wireless LAN. The small size and weight, along with excellent
thermal and electrical performance, make the MLF® package an ideal
choice for handheld portable applications such as cell phones and PDAs
or any other application where size, weight and package performance are
required issues.
Dual Row MLF
Part Description
Lead Count
Body Size
Pitch
A-DualRowMLF124-10mm-.5mm
124
132
156
164
10mm
10mm
12mm
12mm
.5mm
.5mm
.5mm
.5mm
Notes
Quantity
Per Tube
30
30
25
25
Parts are packaged in tubes (standard).
Parts are available in trays or on tape and reel upon special request.
n Solder plating finishes available are 85/15 SnPb and 100% Matte Sn.
n Moisture sensitivity level is JEDEC 1.
n Process flow is same as standard “punch” MLF®.
n Small size (reduce package footprint by 50% or more and improved
RF performance) and weight.
n Dual row MLF® offers enhanced thermal capability.
n
n
Amkor
A-DualRowMLF124-10mm-.5mm-DC-Sn
Daisy Chain
Pitch
n Add “TR” to end of part number for Tape and Reel.
n Add “Sn” to end of part number for Lead-Free.
MQFP
3.93 mm
For recommended kits see pages 87 and 90.
(100% Matte Sn)
Dual Row MLF
Lead Count
Body Size
SOIC
CABGA
SOT/SC
MQFP
2.33 mm
LQFP
TSOP
1.6mm
MLF
TSOP
TQFP TSSOP 0.9 mm
0.8 mm
1.2 mm 1.1 mm
0.6 mm
47
TQFP
Thin Quad Flat Pack
Thin Quad Flat Pack (TQFP) packages provide the same benefit of the
metric QFP package, but are thinner (body thickness of 1.0mm) and have
a standard lead-frame footprint (2.0mm lead footprint). TQFPs are helping
to solve issues such as increasing board density, die shrink programs, thin
end-product profile and portability. Lead counts range from 32 to 176.
Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are
used for the TQFP package. Lead pitches available for TQFP package are
0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.
TQFP Thin Quad Flat Pack 1.0mm Thick
Number
of Pins
32
32
40
44
48
52
64
64
64
80
80
100
120
128
128
144
176
Part Description
A-TQFP32-5mm-.5mm-2.0
A-TQFP52-10mm-.65mm-2.0
A-TQFP80-14mm-.65mm-2.0
A-TQFP100-14mm-.5mm-2.0
A-TQFP120-14mm-.4mm-2.0
A-TQFP128-14mm-.4mm-2.0
A-TQFP128-20mm-.5mm-2.0
A-TQFP144-20mm-.5mm-2.0
A-TQFP176-20mm-.4mm-2.0
Body
Size
5mm sq
7mm sq
5mm sq
10mm sq
7mm sq
10mm sq
7mm sq
10mm sq
14mm sq
12mm sq
14mm sq
14mm sq
14mm sq
14mm sq
20mm sq
20mm sq
20mm sq
Lead
Pitch
.5mm
.8mm
.4mm
.8mm
.5mm
.65mm
.4mm
.5mm
.8mm
.5mm
.65mm
.5mm
.4mm
.4mm
.5mm
.5mm
.4mm
Quantity
Per Tray
360
250
360
160
250
160
250
160
90
119
90
90
90
90
60
60
60
Footprint
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
2.0mm
Tape
Width
16mm
16mm
16mm
24mm
16mm
24mm
16mm
24mm
32mm
24mm
32mm
32mm
32mm
32mm
44mm
44mm
44mm
Tape
Pitch
12mm
12mm
12mm
16mm
12mm
16mm
12mm
16mm
24mm
24mm
24mm
24mm
24mm
24mm
24mm
24mm
24mm
Quantity
Per Reel
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
750
1,000
750
750
750
750
500
500
500
Notes
TQFP is available in die up configurations in 1.0mm thickness only.
 5 x 5mm to 20 x 20mm body size (JEDEC Standard).
 Copper leadframes.
 1.0mm body thickness for TQFP.
 Lead-free parts are available with SnBi or 100% Matte Sn finish.
 Parts may also be available NiPdAg-Au & NiPdAu. Call for availability.
Minimums may apply.
 SnPb parts no longer available.
Amkor

A-TQFP32-5mm-.5mm-2.0-DC-Sn
Thin Quad Flat Pack
Number of Pins
Body Size
Lead Pitch
(100% Matte Sn
and SnBi)
Daisy Chain
Lead Footprint
Add “ePad” to beginning of part number when ordering ExposedPad™ package.
-Add “LF” to end of part number for Lead-Free, i.e Sn or SnBi.
n
TQFP Package
Cu Leadframe
Die Attach
Adhesive
Mold
Compound
Au Wire
1.0mm
Die
Die Attach Pad
Die Up (Standard)
Exposed Pad L/TQFP Package
Mold
Compound
Cu Leadframe
Au Wire
Die Attach
Die Attach
Die Up (Standard)
48
Mold
Compound
Die
Die
Exposed Pad
Exposed Pad
Cu Leadframe
Au Wire
Die Down (Inverted)
LQFP
Low Profile Quad Flat Pack
Daisy-Chain And Lead-Free Parts Available!
Low Profile Quad Flat Pack (LQFP) packages provide the same benefit of
the metric QFP packages, but are thinner (body thickness of 1.4mm) and
have a standard lead-frame footprint (2.0mm lead footprint).
LQFPs help to solve issues such as increasing board density, die shrink
programs, thin end-product profile and portability. Lead counts range
from 32 to 256. Body sizes range from 7 x 7mm to 28 x 28mm. Copper
lead-frames are used for the LQFP package. Lead pitches available for
LQFP package are 0.4mm, 0.5mm, 0.65mm and 0.8mm.
LQFP Low Profile Quad Flat Pack 1.4mm Thick
Part Description
.4mm Pitch
A-LQFP64-7mm-.4mm-2.0
A-LQFP120-14mm-.4mm-2.0
A-LQFP128-14mm-.4mm-2.0
A-LQFP176-20mm-.4mm-2.0
A-LQFP216-24mm-.4mm-2.0
A-LQFP256-28mm-.4mm-2.0
.5mm Pitch
A-LQFP100-14mm-.5mm-2.0
A-LQFP128-14x20mm-.5mm-2.0
A-LQFP128-20mm-.5mm-2.0
A-LQFP144-20mm-.5mm-2.0
A-LQFP160-24mm-.5mm-2.0
A-LQFP176-24mm-.5mm-2.0
A-LQFP208-28mm-.5mm-2.0
.65mm Pitch
A-LQFP52-10mm-.65mm-2.0
A-LQFP80-14mm-.65mm-2.0
A-LQFP100-14x20mm-.65mm-2.0
.8mm Pitch
1.0mm
A-LQFP44-14mm-1.0mm-2.0
Number
of Pins
Body
Size
Lead
Pitch
Quantity
Per Tray
Tape
Width
Tape
Pitch
Quantity
Per Reel
Available
Lead-Free Finishes
64
120
128
176
216
256
7mm sq
14mm sq
14mm sq
20mm sq
24mm sq
28mm sq
.4mm
.4mm
.4mm
.4mm
.4mm
.4mm
250
90
90
60
40
36
16mm
32mm
32mm
44mm
44mm
44mm
12mm
24mm
24mm
24mm
32mm
40mm
1,000
750
750
500
500
500
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
48
64
100
128
128
144
160
176
208
7mm sq
10mm sq
14mm sq
14 x 20mm
20mm sq
20mm sq
24mm sq
24mm sq
28mm sq
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
.5mm
250
160
90
72
60
60
40
40
36
16mm
24mm
32mm
44mm
44mm
44mm
44mm
44mm
44mm
12mm
24mm
24mm
32mm
24mm
24mm
32mm
32mm
40mm
1,000
1,000
750
500
500
750
500
500
500
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
52
80
100
10mm sq
14mm sq
14x20mm
.65mm
.65mm
.65mm
160
90
72
24mm
32mm
44mm
24mm
24mm
32mm
1,000
750
500
Sn or SnBi
Sn or SnBi
Sn or SnBi
32
44
64
7mm sq
10mm sq
14mm sq
.8mm
.8mm
.8mm
250
160
90
16mm
24mm
32mm
12mm
24mm
24mm
1,000
1,000
750
Sn or SnBi
Sn or SnBi
Sn or SnBi
44
14mm
1.0mm
90
32mm
24mm
750
Sn or SnBiP
Notes
All LQFPs are standard in trays.
 LQFPs have a body thickness of 1.4mm.
 Tray quantity may vary.
 Tape type is plastic.
 Parts may also be available NiPdAg-Au & NiPdAu. Call for availability.
Minimums may apply.
 SnPb parts no longer available.
Low Profile
LQFP48-7mm-.5mm-2.0-DC-Sn
Quad Flat Pack
(100% Matte Sn
Number of Pins
and SnBi)
Daisy Chain
Body Size
Lead
Footprint
Lead Pitch

n
n
Add specific finish to end of part number for Lead-Free, i.e Sn or SnBi.
For recommended kits see pages 84,
87, 90, 92, 100, 105, and 109.
For drawings, please visit our web site at
www.practicalcomponents.com.
49
QFP
Quad Flat Pack
Daisy-Chain And Lead-Free Parts Available!
Quad Flat Pack (QFP) components have four sides with leads extending
from the component body on all four sides. QFP components come packaged in trays or on tape and reel to protect the component leads that can
be easily damaged. An important measurement for QFPs is coplanarity.
When the first lead from the component is placed on the PCB coplanarity is established. Coplanarity ensures the last lead can be placed on the
board. The standard for QFP coplanarity is ±4 mils.
QFP Plastic Quad Flat Pack
Part Description
.40mm Pitch
A-QFP256-28mm-.4mm-2.6
.50mm Pitch
A-QFP64-10mm-.50mm-3.2
A-QFP64-10mm-.50mm-3.9
A-QFP100-14mm-.5mm-3.2
A-QFP100-14mm-.5mm-3.9
A-QFP128-14x20mm-.5mm-3.2
A-QFP128-14x20mm-.5mm-3.9
A-QFP208-28mm-.5mm-2.6
A-QFP208-28mm-.5mm-3.2
A-QFP240-32mm-.5mm-2.6
.65mm Pitch
A-QFP52-10mm-.65mm-3.2
A-QFP52-10mm-.65mm-3.9
A-QFP80-14mm-.65mm-3.2
A-QFP80-14mm-.65mm-3.9
A-QFP100-14x20mm-.65mm-3.2
A-QFP100-14x20mm-.65mm-3.9
A-QFP144-28mm-.65mm-2.6
A-QFP144-28mm-.65mm-3.2
A-QFP160-28mm-.65mm-2.6
A-QFP160-28mm-.65mm-3.2
A-QFP160-28mm-.65mm-3.9
.80mm Pitch
A-QFP44-10mm-.8mm-3.2
A-QFP44-10mm-.8mm-3.9
A-QFP64-14mm-.8mm-3.2
A-QFP64-14mm-.8mm-3.9
A-QFP80-14x20mm-.8mm-3.2
A-QFP80-14x20mm-.8mm-3.9
A-QFP120-28mm-.8mm-2.6
A-QFP120-28mm-.8mm-3.2
A-QFP128-28mm-.8mm-2.6
A-QFP128-28mm-.8mm-3.2
1.00mm Pitch
A-QFP52-14mm-1.0mm-3.2
A-QFP52-14mm-1.0mm-3.9
A-QFP64-14x20mm-1.0mm-3.2
A-QFP64-14x20mm-1.0mm-3.9
Number Body
of Pins Size
Body
Thickness
Lead Pitch
Footprint
Quantity
Per Tray
Tape
Width
Tape
Pitch
Quantity
13" Reel
Available
Lead-Free Finishes
256
28mm sq
3.37mm
.40mm
2.6mm
24
44
40
200
Sn or SnBi
64
64
100
100
128
128
208
208
240
10mm sq
10mm sq
14mm sq
14mm sq
14 x 20mm
14 x 20mm
28mm sq
28mm sq
32mm sq
2.0mm
2.0mm
2.0/2.67mm
2.67mm
2.71mm
2.71mm
3.37mm
3.37mm
3.4mm
.50mm
.50mm
.50mm
.50mm
.50mm
.50mm
.50mm
.50mm
.50mm
3.2mm
3.9mm
3.2mm
3.9mm
3.2mm
3.9mm
2.6mm
3.2mm
2.6mm
96
96
84
84
66
66
24
24
24
24
24
32
32
44
44
44
44
56
24
24
24
24
32
32
40
40
44
500
500
350
350
200
200
200
200
250
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
52
52
80
80
100
100
144
144
160
160
160
10mm sq
10mm sq
14mm sq
14mm sq
14 x 20mm
14 x 20mm
28mm sq
28mm sq
28mm sq
28mm sq
28mm sq
2.0mm
2.0mm
2.0/2.67mm
2.67mm
2.71mm
2.71mm
3.37mm
3.37mm
3.37mm
3.37mm
3.37mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
3.2mm
3.9mm
3.2mm
3.9mm
3.2mm
3.9mm
2.6mm
3.2mm
2.6mm
3.2mm
3.9mm
96
96
84
84
66
66
24
24
24
24
24
24
24
32
32
44
44
44
44
44
44
44
24
24
24
24
32
32
40
40
40
40
40
500
500
350
350
200
200
200
200
200
200
200
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
44
44
64
64
80
80
120
120
128
128
10mm sq
10mm sq
14mm sq
14mm sq
14 x 20mm
14 x 20mm
28mm sq
28mm sq
28mm sq
28mm sq
2.0mm
2.0mm
2.0/2.67mm
2.67mm
2.71mm
2.71mm
3.37mm
3.37mm
3.37mm
3.37mm
.80mm
.80mm
.80mm
.80mm
.80mm
.80mm
.80mm
.80mm
.80mm
.80mm
3.2mm
3.9mm
3.2mm
3.9mm
3.2mm
3.9mm
2.6mm
3.2mm
2.6mm
3.2mm
96
96
84
84
66
66
24
24
24
24
24
24
32
32
44
44
44
44
44
44
24
24
24
24
32
32
40
40
40
40
500
500
350
350
200
200
200
200
200
200
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
52
52
64
64
14mm sq
14mm sq
14 x 20mm
14 x 20mm
2.0/2.67mm
2.67mm
2.71mm
2.71mm
1.00mm
1.00mm
1.00mm
1.00mm
3.2mm
3.9mm
3.2mm
3.9mm
84
84
66
66
32
32
44
44
24
24
32
32
350
350
200
200
Sn or SnBi
Sn or SnBi
Sn or SnBi
Sn or SnBi
Notes
All QFPs are standard in JEDEC trays.
 Tray quantities may vary.
 Parts available on Tape and Reel upon
special request.
 Parts may also be available NiPdAg-Au & NiPdAu.
Call for availability. Minimums may apply.
Quad
QFP44-10mm-.8mm-3.9mm-DC-Sn
Flat Pack
(100% Matte Sn
Number of Pins
and SnBi)
Body Size
Lead
Daisy Chain
Footprint
Lead Pitch

50
n
n
Add specific finish to end of part number for Lead-Free, i.e Sn or SnBi.P
For kits see pages 84, 81, 87,
88, 92, 94, 101, 105, 109.
CQFP
Ceramic Quad Flat Pack
CQFPs are hermetic packages consisting of true pieces of dry pressed
ceramic surrounding a uniformed leadframe with tie bar attached. Lead
counts for this package range from 14 to 304, with lead pitch ranging
from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be
solder-coated by special request. Lids are optional for CQFPs, which are
sealed over the package cavity at temperatures from 400° to 460° C.
CQFP Ceramic Quad Flat Pack
Part Description
52CQFP-19.0mm-1.27mm
68CQFP-24.1mm-1.27mm
84CQFP-16.5mm-.65mm
100CQFP-19.0mm-.65mm
Body Size
(Inch)
.750" sq
.950" sq
.650" sq
.750" sq
.950" sq
1.050" sq
1.150" sq
1.260" sq
Number
of Pins
52
68
84
100
132
144
172
196
Notes
(mm)
19.0mm sq
24.1mm sq
16.5mm sq
19.0mm sq
24.1mm sq
26.6mm sq
29.2mm sq
32.0mm sq
Pitch
1.27mm
1.27mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
52CQFP–19.0mm–1.27mm
I/O Count
CQFPs are available with or without combo lid.
 Pins are flat (sandwiched) with tie bar.
 Parts are packaged in non-JEDEC trays.
 Due to the custom nature of the package, body size and dimensions
can change without notice.
 Parts available with a daisy-chain configuration upon request.
 Other ceramic packages available upon request.
 Glass or epoxy seal.
 Footprint compatible with plastic QFP packages.
 EIAJ and JEDEC standards.
 Lead-frames are embedded into the glass to create both internal die
connection and external PCB connection.

Ceramic Quad
Flat Pack
Lead Pitch
Body Size
LCC
Leadless Ceramic Carrier
This surface mount package consists of a ceramic base that has metalized
castellations/pads on the sides and bottom of the package. LCC packages
have pads on all four sides of the package. Lids for LCCs can be either
metal or ceramic. Lids are attached after die attach. This allows for a
hermetically sealed environment for the die.
LCC Leadless Ceramic Carrier
Part Description
16LCC-1.27mm-7.36x8.96mm
20LCC-1.27mm-8.90mm
28LCC-1.27mm-11.5mm
32LCC-1.27mm-11.4x14.0mm
40LCC-1.00mm-10.1mm
44LCC-1.27mm-16.5mm
48LCC-1.00mm-14.2mm
52LCC-1.27mm-19.0mm
68LCC-1.27mm-24.11mm
84LCC-1.27mm-29.2mm
Number of
Castellations
16
20
28
32
40
44
48
52
68
84
Notes
(mm)
7.36 x 8.96mm
8.90mm sq
11.50mm sq
11.40 x 14.00mm
10.10mm sq
16.50mm sq
14.20mm sq
19.00mm sq
24.11mm sq
29.20mm sq
Pitch
1.27mm
1.27mm
1.27mm
1.27mm
1.00mm
1.27mm
1.00mm
1.27mm
1.27mm
1.27mm
LCCs are available with or without combo lid.
 Gold castellations are standard, but can be solder-tinned with
100% Sn or SnPb alloy.
 Parts are packaged in non-JEDEC trays.
 Parts available with a daisy-chain configuration upon request.
 Other types of ceramic packages not listed in catalog are available
upon request.

Body Size
(Inch)
.350" x .285"
.350" sq
.450" sq
.550" x .450"
.400" sq
.650" sq
.560" sq
.750" sq
.950" sq
1.150" sq
Number of
20LCC–1.27mm–8.90mm
Castellations
Leadless
Pitch
Ceramic Carrier
Body Size
51
Daisy-Chain Patterns
The standard daisy chain pattern for non-BGA IC’s is Even. Example of
daisy-chain “even” pattern for leadframe packages. Pin 1-2, 3-4, 5-6, 7-8,
etc. Continuity testing requires dummy components to contain daisychain connections. There is no standard daisy-chain pattern for Ball Grid
Array Packages.
QFP Quad Flat Packs
SOIC Small Outline Integrated Circuits
PLCC Plastic Leaded Chip Carriers
52
PLCC
Daisy-Chained And Lead-Free Parts Available!
Plastic Leaded Chip Carriers (PLCC) are four-sided “J” Leaded Plastic body
packages. Lead counts range from 20 to 84. PLCC packages can be square
or rectangle. Body sizes range from .35" to 1.15". PLCCs are JEDEC standard compliant. The PLCC “J” Lead configuration requires less board space
versus equivalent gull leaded components.
PLCC Plastic Leaded Chip Carrier
Part Description
(In Tubes)
PLCC20T
PLCC28T
PLCC32T
PLCC44T
PLCC52T
PLCC68T
PLCC84T
Pin Count
Body Size
20
28
32
44
52
68
84
8.8mm
11.4mm
11.4 x 13mm
16.5mm
19.0mm
24.1mm
29.2mm
Quantity
Per Tube
46
38
30
27
24
18
15
Part Description
(Tape and Reel)
PLCC20TR
PLCC28TR
PLCC32TR
PLCC44TR
PLCC52TR
PLCC68TR
PLCC84TR
Notes
Tape Width
Tape Pitch
16mm
24mm
24mm
32mm
32mm
44mm
44mm
12mm
16mm
16mm
24mm
24mm
32mm
36mm
Quantity
13" Reel
1,000
750
750
450/500
450
230/250
250
Packaging
Number of Pins
Packaging: T=Tubes, TR=Tape and Reel.
n
Mold
Compound
Au Wire
J-Formed
Cu Leadframe
Die
94, 100, 101, 107 and 109.
Die Attach Adhesive
Die Attach Pad
Z
G
A
H
PLCC20T
All PLCCs have “J” leads.
 Standard lead pitch is 1.27mm (50 mils).
 PLCCs are to JEDEC standards.
 Tube quantity may vary.
 13" reels are standard.
 Parts available on Tape and Reel.
 Lead-free parts are available with 100% Matte Sn finish.

Y
X
Full Radius Optional
S J L
E
B
D C
P
W
Heel
L
T
Grid
Placement
Courtyard
C
PLCC Component Dimensions
Component
Identifier
PLCC-20
PLCC-28
PLCC-44
PLCC-52
PLCC-68
PLCC-84
L (mm)
Min
9.78
12.32
17.40
19.94
25.02
30.10
S (mm)
Max
10.03
12.57
17.65
20.19
25.27
30.35
Min
5.78
8.32
13.40
15.94
21.02
26.10
W (mm)
Max
6.53
9.07
14.15
16.69
21.77
26.85
Min
0.33
0.33
0.33
0.33
0.33
0.33
T (mm)
Max
0.53
0.53
0.53
0.53
0.53
0.53
Min
1.50
1.50
1.50
1.50
1.50
1.50
A (mm)
Max
2.00
2.00
2.00
2.00
2.00
2.00
Min
8.89
11.43
16.51
19.05
24.13
29.21
B (mm)
Max
9.04
11.58
16.66
19.20
24.33
29.41
Min
8.89
11.43
16.51
19.05
24.13
29.21
Max
9.04
11.58
16.66
19.20
24.33
29.41
J (mm)
Ref
7.87
10.41
15.49
18.03
23.11
28.19
H (mm)
Max
4.57
4.57
4.57
5.08
5.08
5.08
P (mm)
Basic
1.27
1.27
1.27
1.27
1.27
1.27
PLCC Land Patterns
Component
Identifier
Z (mm)
G (mm)
X (mm)
PLCC-20
PLCC-28
PLCC-44
PLCC-52
PLCC-68
PLCC-84
10.80
13.40
18.40
21.00
26.00
31.20
6.40
9.00
14.00
16.60
21.60
26.80
0.60
0.60
0.60
0.60
0.60
0.60
Y (mm)
Ref
2.20
2.20
2.20
2.20
2.20
2.20
C (mm)
Ref
8.60
11.20
16.20
18.80
23.80
29.00
D (mm)
Ref
5.08
7.62
12.70
15.24
20.32
25.40
E (mm)
Ref
1.27
1.27
1.27
1.27
1.27
1.27
Placement Grid
(No. of Elements)
24 x 24
30 x 30
40 x 40
44 x 44
54 x 54
66 x 66
53
SOIC
Small Outline Integrated Circuit
Small Outline Package (SOIC) body size was compressed and the lead
pitch tightened to obtain a smaller version SOIC. This yields an IC package
that is a significant reduction in the size (compared to standard package).
All IC assembly processes remain the same as with our standard SOICs.
SOIC Small Outline Integrated Circuit
Number
of Pins
8
14
16
16
20
24
28
Part Description
SO8GT-3.8mm
SO14GT-3.8mm
SO16GT-3.8mm
SO16GT-7.6mm
SO20GT-7.6mm
SO24GT-7.6mm
SO28GT-7.6mm
Lead
Style
Gull
Gull
Gull
Gull
Gull
Gull
Gull
Body
Width
3.8mm
3.8mm
3.8mm
7.6mm
7.6mm
7.6mm
7.6mm
Quantity
Per Tube
100
50
48
46
38
31
25
Notes
Tape
Width
12mm
16mm
16mm
16mm
24mm
16mm
24mm
Tape
Pitch
8mm
8mm
8mm
12mm
12mm
12mm
12mm
Quantity
13" Reel
2,500
2,500
2,500
1,000
1,000
1,000
1,000
Small Outline
Integrated Circuit
Standard lead pitch is 1.27mm.
 Parts available on Tape and Reel.
 Lead-free parts are available with 100% Matte Sn finish.

SO14GT-3.8mm-DC-Sn
(100% Matte Sn)
Number of Pins
Lead Style
Daisy Chain
Body Width
Packaging
Lead Style: G=Gull Wing.
n Packaging: T=Tubes, TR=Tape and Reel.
n
For kits see pages 84, 81, 88, 93, 94,
98, 99, 100, 101, 105, 107, and 109.
B
D
Grid
Placement
Courtyard
A
P
W
S
L
C
G
Z
H
E
X
Y
SOIC Component Dimensions
Component
Identifier
JEDEC
Number
SO8
SO14
SO16
SO16-7.6mm
SO20-7.6mm
SO28-7.6mm
MS-012 AA
MS-012 AB
MS-012 AC
MS-013 AA
MS-013 AC
MO-119 AB
L (mm)
Min
Max
5.80
6.30
5.80
6.30
5.80
6.30
10.00
10.65
10.00
10.65
10.29
10.64
S (mm)
Min
Max
3.26
4.55
3.26
4.55
3.26
4.55
7.46
8.85
7.46
8.85
8.21
9.01
W (mm)
Min
Max
0.33
0.51
0.33
0.51
0.33
0.51
0.33
0.51
0.33
0.51
0.36
0.51
Min
0.40
0.40
0.40
0.40
0.40
0.53
T (mm)
Max
1.27
1.27
1.27
1.27
1.27
1.04
A (mm)
Min
Max
3.80
4.00
3.80
4.00
3.80
4.00
7.40
7.60
7.40
7.60
7.40
7.60
B (mm)
Min
Max
4.80
5.00
8.55
8.75
9.80
10.00
10.10
10.50
12.60
13.00
18.08
18.39
H (mm)
Min
Max
1.35
1.75
1.35
1.75
1.35
1.75
2.35
2.65
2.35
2.65
2.34
2.64
P (mm)
Basic
1.27
1.27
1.27
1.27
1.27
1.27
SOIC Land Pattern Dimensions
54
Component
Identifier
Z (mm)
G (mm)
X (mm)
SO8
SO14
SO16
SO16-7.6mm
SO20-7.6mm
SO28-7.6mm
7.40
7.40
7.40
11.40
11.40
11.40
3.00
3.00
3.00
7.00
7.00
7.00
0.60
0.60
0.60
0.60
0.60
0.60
Y (mm)
Ref
2.20
2.20
2.20
2.20
2.20
2.20
C (mm)
Ref
5.20
5.20
5.20
9.20
9.20
9.20
D (mm)
Ref
3.81
7.62
8.89
8.89
11.43
16.51
E (mm)
Ref
1.27
1.27
1.27
1.27
1.27
1.27
Placement Grid
(No. of Grid Elements)
12 x 16
20 x 16
22 x 16
22 x 22
28 x 24
38 x 24
TSOP
Thin Small Outline Package
Thin Small Outline Packages (TSOP) are thin body size components;
thickness is 1.0mm. TSOP packages have four sides and are rectangular.
Type I TSOPs have the leads protruding from the width portion of the
package. Lead counts range from 28 to 48. Package body size ranges from
8x11.8mm to 12x20mm.
TSOP Thin Small Outline Package – Type I
Part Description
A-TI-TSOP28-8.1x11.8mm-.55mm
A-TI-TSOP32-8x11.8mm-.5mm
Number
of Pins
28
32
32
48
Body Size
8.1 x 11.8mm
8 x 11.8mm
8 x 18.4mm
12 x 18.4mm
Lead
Pitch
.55mm
.5mm
.5mm
.5mm
Quantity
Per Tray
234
234
156
96
Tape
Width
24mm
24mm
32mm
32mm
Tape
Pitch
12mm
12mm
12/16mm
16mm
Quantity
13" Reel
1,000
1,000
1,000
1,000
TSOP Thin Small Outline Package – Type II
Type II TSOP are becoming obsolete. Practical has some stock. Please call for availability.
Notes
Standard packaging is in JEDEC trays or tape and reel
(quantities may vary).
 Body dimensions are measured by body length and width.
 Type I means that pins extend from the narrow end (the width) of
the body.
 Parts available on Tape and Reel upon special request.
 See chart for 100% Matte Sn, SnPb, and SnBi availability.
 Type II means that pins extend from the wide end (the length) of the
body. Type II TSOP are becoming obsolete. Practical has some stock.
Please call for availability.
Amkor

A-TI-TSOP28-8.1x11.8mm-.5mm-DC-Sn
Type I
Thin Small
Outline Package
Number of Pins
Body Size
(100% Matte Sn
or SnBi)
Daisy Chain
Lead Pitch
Add “T” to end of part number for Tray.
n Add specific finish to end of part number for Lead-Free, i.e Sn or SnBi.
n
TYPE I
TYPE II
55
TSSOP
Thin Shrink Small Outline Package
The Thin Shrink Small Outline Package (TSSOP) offers smaller body sizes,
smaller lead pitches and package thickness (0.9mm thick) than standard
SOIC packages. Body widths are 3.0mm, 4.4mm and 6.1mm. Lead counts
range from 8 to 80. This package conforms to JEDEC package outlines.
TSSOP Thin Shrink Small Outline Package
Part Description
A-TSSOP8T-3.0mm
A-TSSOP8T-4.4mm
A-TSSOP10T-3.0mm
A-TSSOP14T-4.4mm
A-TSSOP16T-4.4mm
A-TSSOP20T-4.4mm
A-TSSOP24T-4.4mm
A-TSSOP28T-4.4mm
A-TSSOP28T-6.1mm
A-TSSOP44T-4.4mm
A-TSSOP48T-6.1mm
A-TSSOP56T-4.4mm
A-TSSOP56T-6.1mm
A-TSSOP64T-6.1mm
A-TSSOP80T-6.1mm
Number
of Pins
8
8
10
14
16
20
24
28
28
44
48
56
56
64
80
Body
Width
3.0mm
4.4mm
3.0mm
4.4mm
4.4mm
4.4mm
4.4mm
4.4mm
6.1mm
4.4mm
6.1mm
4.4mm
6.1mm
6.1mm
6.1mm
Notes
Tape
Width
12mm
12/16mm
12mm
12/16mm
12/16mm
16mm
16mm
16mm
24mm
24mm
24mm
24mm
24mm
N/A
N/A
Pitch
.65mm
.65mm
.5mm
.65mm
.65mm
.65mm
.65mm
.65mm
.65mm
.5mm
.5mm
.4mm
.5mm
.5mm
.4mm
Tape
Pitch
8mm
8mm
8mm
8mm
8mm
8/12mm
8/12mm
8/12mm
12mm
12mm
12mm
12mm
12mm
N/A
N/A
Quantity
Per Tube
98
100
98
96
96
74
62
50
50
42
39
42
35
28
28
Quantity
Per Reel
2,500
1,000/2,500
2,500
1,000/2,500
1,000/2,500
1,000/2,500
1,000/2,500
1,000
1,000
1,000
1,000
1,000
1,000
N/A
N/A
0.9mm body thickness for 4.4 and 6.1mm body widths.
 0.85mm body thickness for 3.0mm body width.
 JEDEC package outline is standard.
 High conductivity copper leadframes.
 Very low-stress mold compound.
 Parts available on Tape and Reel upon request..
 Lead-free available with 100% Matte Sn alloy.
Amkor

A-TSSOP8T-3.0mm-DC-Sn
Thin Shrink Small
Outline Package
Number of Pins
Packaging
n
n
(100% Matte Sn)
Daisy Chain
Body Width
Add “T” for Tubes or “TR” for Tape and Reel to end of part number.
Add “Sn” to end of part number for Lead-Free.
TSSOP Package
Au Wire
Mold
Compound
Cu Leadframe
Die
Die Attach Pad
56
Die Attach Adhesive
SSOP
Small Shrink Outline Package
The Small Shrink Outline Package (SSOP) body size is compressed and
the lead pitch is tightened to obtain a small version of the standard SOIC
packages. Lead counts range from 8 to 64. Body sizes are 209 and 300
mils. The SSOP package is JEDEC and EIAJ compliant. The package leads
are solder plated.
SSOP Small Shrink Outline Package
Part Description
A-SSOP14T-5.3mm
A-SSOP16T-5.3mm
A-SSOP20T-5.3mm
A-SSOP24T-5.3mm
A-SSOP28T-5.3mm
A-SSOP36T-7.6mm
A-SSOP48T-7.6mm
A-SSOP56T-7.6mm
Number
of Pins
14
16
20
24
28
36
48
56
Body Width
Pitch
5.3mm
5.3mm
5.3mm
5.3mm
5.3mm
7.6mm
7.6mm
7.6mm
.65mm
.65mm
.65mm
.65mm
.65mm
.8mm
.635mm
.635mm
Notes
Quantity
Per Tube
100
80
62
66
47
31
30
26
Tape Width
Tape Pitch
16mm
16mm
16mm
16mm
16/24mm
24mm
32mm
32mm
12mm
12mm
12mm
12mm
12mm
12mm
12/16mm
12/16mm
Quantity
13" Reel
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
Tube quantity may vary.
Parts available on Tape and Reel upon special request.
 209 and 300 mil body widths.
 JEDEC and EIAJ package outline standard compliance.
 High-conductivity copper leadframes.
 Eutectic solder plating is 85/15 Sn/Pb.
 Lead-free available with 100% Matte Sn alloy.
Amkor

A-SSOP20T-5.3mm-DC-Sn
Small Shrink
Outline Package
Number of Pins
Packaging

Add “T” for Tubes or “TR” for Tape and Reel to end of part number.
Add “ePad” to beginning of part number when ordering
ExposedPad™ package.
n
n
Mold
Compound
Au Wire
Pb
(100% Matte Sn)
Daisy Chain
Body Width
Cu Leadframe
Die
Die Attach Adhesive
Die Attach Pad
For kits see pages 87, 92, and 109.
Cu Leadframe
Die Attach
Adhesive
DiMold
Compound Au Wire
Die
Exposed Pad
Exposed Pad
Note: Drawings not to scale.
57
Ceramic Chip Pad Components
!
W
E
N
Practical is pleased to offer NEW Ceramic Chip Pad components on
tape and reel to help verify the contrasts of vision systems for pick and
place machine evaluation. These Ceramic slugs are white ceramic with
90degree laser cut edges in addition there are no terminations on either
side of the components. Dimensions for each chip are 2.0mm x2.0mm
x0.5mm. Chip material is Ceramic Rubalit 708 dry pressed. In addition to
machine vision evaluation, these ceramic pads are idea for CPK testing
amd increasing yield alignment.
Please call your knowledgeable Practical Components technical sales
representative for further information.
MELF Resistors
Metal Electrode Leadless Face
Metal Electrode Leadless Face (MELF) Resistors are round or cylindrical
in shape. They are available in embossed plastic tape on 7" reels. The
terminals on MELF resistors are force-fitted steel caps with Sn plated
termination. Parts are also available in Zero-Ohm value. Land pattern sizes
for MELF resistors are the same as SMD chip resistor.
MELF Metal Electrode Leadless Face Component Resistors
Body Size
(Inch)
.08" x .05"
.12" x .06"
.14" x .06"
.23" x .09"
Part Description
0805SMR-MELF-PL-Sn
1206SMR-MELF-PL-Sn
1406SMR-MELF-PL-Sn
2309SMR-MELF-PL-Sn
(mm)
2.0 x 1.27mm
3.0 x 1.5mm
3.56 x 1.5mm
5.84 x 2.29mm
Notes
Tape Pitch
8mm
8mm
8mm
12mm
4mm
4mm
4mm
4mm
Quantity
7" Reel
3,000
2,000
3,000
1,500
MELF is the acronym for Metal Electrode Leadless Face.
 90/10 solder plated end caps.
 Suitable for reflow and wave soldering.
 Meets or exceeds EIAJ–8009, EIA–PDP–100.
 Force fitted steel caps are tin plated. SnPb is available upon request
based on availability.

D3
C
L
58
Tape Width
D1
Body Size in Inches
0805SMR–MELF-PL
Tape Type
Cylindrical MELF Type
Carbon Film Resistor
Surface Mount Resistor
Size Code Dimensions
Case Size
L
C Min
D1
D2 Max
D3 Max
0805
2.0±0.1
(0.079±0.004)
0.3
(0.012)
1.25±0.05
(0.049±0.002)
1.35
(0.053)
0.07
(0.003)
1406
3.5±0.2
(0.138±0.008)
1.45±0.10
(0.057±0.004)
1.55
(0.061)
0.10
(0.004)
1206
3.2±0.2
(0.126±0.008)
1.55±0.15
(0.061±0.006)
1.75
(0.069)
0.10
(0.004)
2309
5.9±0.2
(0.232±0.008)
2.2±0.10
(0.087±0.004)
2.40
(0.094)
0.15
(0.006)
0.5
(0.02)
Unit: mm (Inch)
D2
SMR
Lead-Free Surface Mount Resistors
Surface Mount Resistors (SMR) are best suited for commercial industrial
and automotive applications. Chip Resistors are suitable for a wide range
of solder processes, and are ideal for high-speed electronic assembly
equipment. Chip Resistor body size range from 01005 to 1210. Seveninch reels are standard, but eleven and thirteen-inch reels are available
upon special request. Paper carrier tape is standard for Chip Resistors. In
addition, Zero-Ohm Chip Resistors have a copper wire internally. This creates a short condition. Zero-Ohm Chip Resistors can be used to check for
continuity after soldering.
SMR Surface Mount Resistors—Lead-Free
Body Size
(Inch)
.01” x .005”
.02” x .01”
.04” x .02”
.06” x .03”
.08” x .05”
.12” x .06”
.12” x .10”
Part Description
01005SMR-PA-Sn-0
0201SMR-PA-Sn-0
0402SMR-PA-Sn-0
0603SMR-PA-Sn-0
0805SMR-PA-Sn-0
1206SMR-PA-Sn-0
1210SMR-PA-Sn-0
Tape
Width
8mm
8mm
8mm
8mm
8mm
8mm
8mm
Metric
(mm)
0.4 x 0.2mm
0.6 x 0.3mm
1.0 x 0.5mm
1.6 x 0.8mm
2.0 x 1.2mm
3.2 x 1.6mm
3.2 x 2.6mm
0402
0603
1005
1608
2012
3216
3225
Notes
Tape
Pitch
2mm
2mm
2mm
4mm
4mm
4mm
4mm
Quantity
7” Reel
20,000
15,000
10,000
5,000
5,000
5,000
4,000
0402SMR–PA
Tape Type
Surface mount resistors come packaged on paper carrier tape and 7"
reels (larger quantities are available upon request).
 Plastic carrier tape is non-standard for surface mount resistors.
 The numeric section of the part number refers to the physical body size
(in inches) of the component. For example: Part number 0402SMR-PA
has a body size of .04" length by .02" width.
 Chip resistor arrays are available (call for availability).
 Resistors are now only available standard lead-free with
100% Sn over Ni.
Body Size in Inches

Surface Mount Resistor
n
Tape Type: PA=Paper Tape, PL=Plastic Tape.
L
W
C
For kits see pages 81, 86, 87, 88, 92,
94, 99, 100, 101, 105, 107, and109.
C
H
d
d
SMR Component Dimensions
Metric
0402
0603
1005
1608
2012
3216
3225
Inch
01005
0201
0402
0603
0805
1206
1210
L
0.4 +/– 0.02
0.6 +/– 0.03
1.0 +/– 0.05
1.6 +/– 0.1
2.0 +/– 0.1
3.2 +/– 0.15
3.2 +/– 0.15
W
0.2 +/– 0.02
0.3 +/– 0.03
0.5 +/– 0.05
0.8 + 0.15 – 0.05
1.25 +/– 0.10
1.6 +/– 0.15
2.5 +/– 0.15
H
0.12 +/– 0.02
0.23 +/– 0.03
0.35 +/– .05
0.45 +/– 0.10
0.55 +/– 0.10
0.55 +/– 0.10
0.55 +/– 0.15
c
0.1 +/– 0.03
0.1 +/– 0.05
0.2 +/– 0.1
0.3 +/– 0.1
0.4 +/– 0.2
0.5 +/– 0.25
0.5 +/– 0.25
d
0.1 +/– 0.03
0.15 +/– 0.05
0.25 + 0.05 – 0.10
0.3 +/– 0.1
0.4 +/– 0.2
0.5 +/– 0.25
0.5 +/– 0.25
* Unit weight/pc.
—
0.16mg
0.6mg
2mg
5mg
9mg
16mg
Unit: mm *Values for reference
59
SMC
Lead-Free Surface Mount Ceramic Capacitors
Surface Mount Multilayer Ceramic (SMC) capacitors come in case sizes
ranging from 01005 to 2225. The most popular case sizes are listed in the
table below. Parts on tape and reel are available on paper tape or plastic
tape. Larger size reels are available upon special request. Practical Components has lead-free PCB test boards available for the 01005 through 1206
case sizes.
SMC Surface Mount Ceramic Capacitors—Plastic Tape
Part Description
Body Size
Body Size
Tape Width
Tape Pitch
0805SMC-PL-Sn
1206SMC-PL-Sn
1210SMC-PL-Sn
1812SMC-PL-Sn
1825SMC-PL-Sn
.08" x .05"
.12" x .06"
.12" x .10"
.18" x .12"
.18" x .25"
2.0 x 1.2mm
3.2 x 1.6mm
3.2 x 2.6mm
4.5 x 3.2mm
4.5 x 6.4mm
8mm
8mm
8mm
12mm
12mm
4mm
4mm
4mm
8mm
8mm
Quantity
7" Reel
4,000
3,000
4,000
1,100
1,000
Lead-Free
Plating
Sn
Sn
Sn
Sn
Sn
SMC Surface Mount Ceramic Capacitors—Paper Tape
Part Description
Body Size
Body Size
Tape Width
Tape Pitch
01005SMC-PA-Sn
0201SMC-PA-Sn
0402SMC-PA-Sn
0603SMC-PA-Sn
0805SMC-PA-Sn
1206SMC-PA-Sn
.01" x .005"
.02" x .01"
.04" x .02"
.06" x .03"
.08" x .05"
.12" x .06"
0.4 x 0.2mm
0.6 x 0.3mm
1.0 x 0.5mm
1.6 x 0.8mm
2.0 x 1.2mm
3.2 x 1.6mm
8mm
8mm
8mm
8mm
8mm
8mm
2mm
2mm
2mm
4mm
4mm
4mm
Notes
Quantity
7" Reel
15K~20K
15,000
10,000
4,000
5,000
4,000
Lead-Free
Plating
Sn
Sn
Sn
Sn
Sn
Sn
0402SMC–PA
Body Size in Inches
Surface mount capacitors come on standard 7" reels (larger quantity
reels are available upon request).
 Plastic carrier tape is non-standard for some carrier sizes.
 The numeric section of the part number refers to the physical
body size (in inches) of the component. For example: Part number
0805SMC-PL has a body size of .08" length by .05" width.
 Chip capacitor arrays are available. Call for details.
 Capacitors are now only available standard lead-free with 100% Sn over
Ni. SnPb is available upon request based on availability.

Tape Type
Surface Mount Ceramic Capacitor
n
Tape Type: PA = Paper Tape, PL = Plastic Tape
L
C
T
W
X
S
For kits see pages 84, 99, 100 and 101.
H
Grid
Placement
Courtyard
G
Y
Z
SMC Component Dimensions
Component Dimensions
(mm) (in)
0603 (0201)
1005 (0402)
1608 (0603)
2012 (0805)
3216 (1206)
3225 (1210)
4532 (1812)
L (mm)
Min
0.57
0.90
1.45
1.80
3.00
3.00
4.20
S (mm)
Max
0.63
1.10
1.75
2.20
3.40
3.40
4.80
Min
—
0.30
0.45
0.30
1.50
1.50
2.30
W (mm)
Max
—
0.65
0.97
1.11
2.31
2.31
3.46
Min
0.27
0.40
0.65
1.05
1.40
2.30
3.00
T (mm)
Max
0.33
0.60
0.95
1.45
1.80
2.70
3.40
Min
—
0.10
0.20
0.25
0.25
0.25
0.25
H (mm)
Max
0.33
0.60
0.85
1.10
1.35
1.35
1.35
Max
—
0.30
0.50
0.75
0.75
0.75
0.95
SMC Land Pattern Dimensions
Component Identifier
(mm) (in)
0603 (0201)
1005 (0402)
1608 (0603)
2012 (0805)
3216 (1206)
3225 (1210)
4532 (1812)
60
Z (mm)
G (mm)
X (mm)
0.72
2.20
2.80
3.20
4.40
4.40
5.80
0.26
0.40
0.60
0.60
1.20
1.20
2.00
0.32
0.70
1.00
1.50
1.80
2.70
3.40
Y (mm)
Ref
0.23
0.90
1.10
1.30
1.60
1.60
1.60
C (mm)
Ref
0.49
1.40
1.70
1.90
2.80
2.80
3.90
Placement Grid
(No. of Grid Elements)
—
2x6
4x6
4x8
4 x 10
6 x 10
8 x 12
SME
Surface Mount Electrolytic Capacitors
Surface Mount Electrolytic (SME) capacitors are measured according to
the diameter of the can mounted on top of the terminations. Sizes range
from 3mm to 24mm in diameter. The most popular sizes are listed below.
Please call if different sizes are needed. These components come packaged on plastic embossed carrier tape. Standard reel sizes are 15".
SME Surface Mount Electrolytic Capacitors
Part Description
Body Size
Tape Width
Tape Pitch
3mm-SME-PL-Sn
4mm-SME-PL-Sn
5mm-SME-PL-Sn
6.3mm-SME-PL-Sn
8mm-SME-PL-Sn
10mm-SME-PL-Sn
18mm-SME-PL-Sn
3mm
4mm
5mm
6.3mm
8mm
10mm
18mm
12mm
12mm
12mm
16mm
16mm
24mm
44mm
8mm
8mm
12mm
12mm
12mm
16mm
32mm
Notes
Lead spacing and wire diameter
4
5
6.3
8
8
10
18
L
5.3±0.2
5.3±0.2
5.3±0.2
6.3±0.3
10±0.5
10±0.5
16.5
A
4.3
5.3
6.6
8.4
8.4
10.4
19.0
C
2.0
2.3
2.7
3.4
3.0
3.3
6.5
4.3
5.3
6.6
8.4
8.4
10.4
21.0
W
0.5±0.8
0.5±0.8
0.5±0.8
0.5±0.8
0.7±1.1
0.7±1.1
1.2±0.3
P
1.0
1.5
2.0
2.3
3.1
4.7
6.7
Plastic Carrier Pack
Surface Mount
Electrolytic Capacitor
0.3 Max
Unit: mm
B
3mm–SME–PL
Body Size
Surface mount electrolytic capacitors come standard on 15" reels.
 Components are measured by the diameter of the electrolytic can.
 Lead-free available with 100% Sn.

øD
Quantity
15" Reel
2,000
2,000
1,000
1,000
1,000
500
125
A±0.2
0.4±0.2
C±0.2
øD±0.5
B±0.2
P
C±0.2
L
W
MELF Diodes
Metal Electrode Face Components
Metal Electrode Face Components (MELF) have metallized terminals at
each end of a cylindrical body. MELF components are designed to fit the
same footprints as flat components i.e., 0805 (.08" x .05") and the 0603
(.06" x .03"). MELF packages are available on plastic tape and reel.
MELF Metal Electrode Face Component Diodes
Part Description
Body Size
SOD80-TR-Sn
1.4 x 3.4mm
SOD80 Package is also known as LL-34 or DO-213AA.
SM1-TR-Sn
2.6 x 5.0mm
Package is also known as DO-213AB.
Quantity
7" Reel
2,500
Tape Width
Tape Pitch
8mm
4mm
Quantity
13" Reel
10,000
1,500
12mm
4mm
5,000
Notes

MELF Diodes are cylindrical glass or plastic packages with Sn
termination for lead-free.
Package
Dimension A
Dimension B
SOD80 (LL34)
3.4mm
1.5mm
SM1 (LL41)
5.0mm
2.8mm
Device/Package
A
SOD80–TR
Tape and Reel
B
61
SMT
Lead-Free Surface Mount Transistors
SOT package is a rectangular surface mount transistor diode with three
or more gull-wing leads. The leads are on the two length sides of the
package. SOT packages are JEDEC compliant. Popular sizes are the SOT23,
DPAK, SOT223 and SOT89.
94, 99, 100, 104 and 107.
SMT Surface Mount Transistors
Number
of Pins
3
3
5
6
3
5
6
4
3
3
Part Description
SC90-TR-Sn
SOT323-TR-Sn
SOT353-TR-Sn
SOT363-TR-Sn
SOT23-TR-Sn
SOT25-TR-Sn
SOT26-TR-Sn
SOT143-TR-Sn
SOT89-TR-Sn
SOT223-TR-Sn
DPAK-TR-Sn
D2PAK-TR-Sn
Body Size
"W"
1.6mm
2.0mm
2.0mm
2.0mm
2.9mm
2.9mm
2.9mm
2.9mm
4.5mm
6.5mm
6.5mm
10.0mm
Body Leads
"L"
1.6mm
2.1mm
2.1mm
2.1mm
2.4mm
2.8mm
2.8mm
2.5mm
4.0mm
7.0mm
9.5mm
15.2mm
Tape
Width
8mm
8mm
8mm
8mm
8mm
8mm
8mm
8mm
12mm
12mm
16mm
24mm
SC Device
SC-75A
SC-70
SC-88A / SOT325
SC-88 / SOT326
TO-236AB
SC-74A
SC-74
TO-253AA
SC-62 / TO-243AA
SC-73 / TO-261AA
SC-63 / TO-252-AA
TO-263AB
Notes
Tape
Pitch
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
8mm
8mm
8mm
12mm
Quantity
Per Reel
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
1,000
1,000
2,500
800/1,000
SC90
(3)
W
0.5
0.3
(2)
Packaging
L
0.2
(1)
SOT326–TR
Transistor Package
Carrier pack is plastic for surface mount transistors.
 Parts only available on Tape and Reel.
 Tin-Lead solder plating available upon request based on availability.
 Lead-free available with 100% Sn alloy.

0.5
SOT323
1.0
(1)
1.6
(3)
0.3
0.65
1.3 2.0
0.65
(2)
0.2
0.8
(1) Emitter (Source)
(2) Base (Gate)
(3) Collector (Drain)
1.25
(2) Base (Gate)
1.6
2.1
0.2
0.55 0.7
0.15
0.7 0.9
0.15
0~0.1
0.1 Min.
0.1~0.4
0~0.1
Each lead has same dimensions
SOT363
SOT353
0.2
(3)
(4)
0.2
(2)
(5)
0.65
1.3 2.0
0.65
(3)
(4)
(2)
(5)
(6)
(1)
1.3
2.0
1.25
2.1
2.1
0.7
0.9
0.7 0.9
0.15
0~0.1
0~0.1
0.1 Min.
62
0.65
(1)
1.25
0.15
0.65
0.1 Min.
SMT
Lead-Free Surface Mount Transistors
SOT23
SOT25
(1)
0.95
(3)
(2)
(3)
0.36
0.4
1.9 2.9
0.95
(2)
1.3
0.95
(5)
0.95
1.9 2.9
1.6
(2) Base (Gate)
2.4
0.95
(1)
(4)
2.8
1.1
0.45
0.15
0.15
0~0.1
.3 ~ .6
0~0.1
0.2 Min.
SOT26
Top View
(6)
SOT143
(1)
0.3
0.95
1.9
0.95
(2)
(5)
.004(0.10)
.005(0.13)
2.9
.079(2.01)
.003(0.08)
.005(0.13)
.037(0.94)
.043(1.09)
1.6
2.8
0.8
0.15
3
4
15°
6°
(3)
(4)
.110(2.79)
.118(3.00)
.047(1.19)
.051(1.30)
.098(2.49)
Max.
2
1
.014(0.36)
.018(0.46)
.071(1.80)
.030(0.76)
.033(0.84)
1.1
0~0.1
0.3~0.6
SOT223
0.5
.001(0.03)
.004(0.10)
(1)
1.5
15°
(2)
0.5
1.6
1.5
4.5
1.5
5.5
2.3
D2PAK
1.5
Inches
E
V
5.1 6.5
0.9
(3)
0.65
2.3
0.8 Min.
1.5
0.5
2.5
9.5
0.5
A
S
C0.5
1.0
.181(4.60)
C
B
(2)
0.9
.091(2.31)
Notes:
1. Dimensioning and tolerancing per ANSI
Y14.5M, 1982.
2. Controlling Dimension: Inch.
(1)
2.3
.033(0.84)
.041(1.04)
.024(0.61)
.031(0.79)
0.75
.264(6.71)
.287(7.29)
.130(3.30)
.146(3.71)
15°
.009(0.23)
.013(0.33)
(3)
0.4
(1) Base (Gate)
0.4
DPAK TO-252
.114(2.90)
.122(3.10)
.063(1.60)
.067(1.70)
2.5
1.0
0.4
3.0
0°-7°
4.0
SOT89
Top View
.248(6.30)
.264(6.71)
-T-
J
G
3 PL D
0.13(0.005) M T
Min.
Max.
Min.
Max.
A
0.340
0.380
8.64
9.65
B
0.380
0.405
9.65
10.29
C
0.160
0.190
4.06
4.83
D
0.020
0.035
0.51
0.89
E
0.045
0.055
1.14
G
K
H
Millimeters
Dim.
0.100 BSC
1.40
2.54 BSC
H
0.080
0.110
2.03
2.79
J
0.018
0.025
0.46
0.64
K
0.090
0.110
2.29
2.79
S
0.575
0.625
14.60
15.88
V
0.045
0.055
1.14
1.40
63
SMTA
Lead-Free Surface Mount Tantalum Capacitors
Surface Mount Molded Tantalum Capacitors (SMTA) are polarized capacitors with solderable terminations. Surface Mount Tantalum packages are
identified by case size i.e.: A, B, C and D. These case sizes stand for metric
footprints of length and width. For example: A = 3.2 x 1.6mm;
B = 3.5 x 2.8mm; C = 6.0 x 3.2mm; D = 7.3 x 4.3mm.
SMTA Surface Mount Tantalum Capacitors
Part Description
Body Size
Case Size
Tape Width
Tape Pitch
1608SMTA-PL-Sn
3216SMTA-PL-Sn
3528SMTA-PL-Sn
6032SMTA-PL-Sn
7343SMTA-PL-Sn
1.6 x .85mm
3.2 x 1.6mm
3.5 x 2.8mm
6.0 x 3.2mm
7.3 x 4.3mm
R (smaller than A case)
A
B
C
D
8mm
8mm
8mm
12mm
12mm
4mm
4mm
4mm
8mm
8mm
Notes
Quantity
7” Reel
500
2,000
2,000
500/750
500/750
Body Size in
3216SMTA–PL
Millimeters
Surface Mount
Tantalum Capacitor
Components are molded, surface mount tantalums.
 Conformal coated tantalums are available.
 Please call for availability of mil-spec surface mount tantalums.
 Standard reel size is 7" (larger sizes are available upon request).
 All tantalum capacitors are on plastic carrier tape.
 Tantalums are now available as standard lead-free with 100% Sn finish.
 SnPb is available upon request based on availability.

Plastic Carrier Pack
C
H2
H1
W1
W2
64
S
L
T
2 Places
X
Y
G
Z
Grid
Placement
Courtyard
PDIP
Plastic Dual In-Line Package
Plastic Dual In-Line Packages (PDIP) are long-established industry
standard through-hole packages.
PDIP Plastic Dual In-Line Package
Part Description
Number
of Pins
Body Size
(body length in inches)
Quantity
Per Tube
300 mil wide body
PDIP8-300
PDIP14-300
PDIP16-300
PDIP18-300
PDIP20-300
PDIP24-300
8
14
16
18
20
24
.360"
.750"
.750"
.900"
1.030"
1.250"
50
25
25
21
18
15
Notes
Dais
y-Ch
ain
Ava
ilab
le
Part System Description
Plastic Dual
In-Line Package
Eutectic solder plating finish is 85% Sn/15% Pb.
 High conductivity copper leadframe.
 JEDEC standard compliant.
 Parts packaged in anti-static 20" tubes.
 Lead-free available with 100% Sn Matte alloy.
 Pitch is 100 mils.

PDIP8-300-DC-Alloy
Number of Pins
(100% Matte Sn)
Daisy Chain
Body Width (Mils)
Die Attach Adhesive
Mold Compound
Au Wire
Cu Leadframe
Die
PDIP Cross-Section
100, 101, 105, 107 and 109.
Die Attach Pad
Through-Hole Glass Diodes
Axial Leaded Through-hole Glass Diode package has been in use for over
50 years in the electronics industry. The body of these parts are glass and
the package is hermetically sealed. The “DO” prefix is a JEDEC designation
for through-hole diodes. The 34 and 35 references case size. These type
of components are packaged on ammo pack or bulk. In most cases, these
parts are sold as training aids to teach new operators how to solder.
Axial Leaded Through-Hole Glass Diode
References
(JEDEC)
DO-34
DO-35
Part Description
DO-34
DO-35
Case Size
(Inch)
(mm)
0.0629" x 0.1197" 1.6 x 3.04mm
0.0728" x 0.1673" 1.85 x 4.25mm
(EIAJ)
SC-40
Notes
Lead
Diameter
.55mm
.56mm
b
Max
D
Max
G1Max
L
Min
mm
0.55
1.6
3.04
25.4
Packaging
Body Size
Add “Ammo” to end of part number for Ammo T&R.
n Add “B” to end of part number for bulk.
n
(1)
DO-34
Unit
DO-34-B
Glass Diode
Part is hermetically sealed glass package.
 Axial leaded (2 leads).
 Parts are packaged Ammo pack (5K per reel) or bulk.
 Lead-free available with 100% Sn alloy.

b
D
L
G1
L
(1)
DO-35
Unit
b
Max
D
Max
G1Max
L
Min
mm
0.56
1.85
4.25
25.4
b
D
L
G1
L
65
TO
Through-Hole Transistors
TO type components are through-hole transistors. These are basic
electronic components developed in the last forty years. There are many
additional types of TO components not listed. TO components come
packaged in tubes, bulk, and tape and reel. Not all components types are
available in all packaging styles. Please call for availability. Parts are available lead-free with Sn finish.
TO Through-Hole Transistors
Part Description
Number of Pins
Case Material
TO5-3-B
TO18-3-B
TO92-3-B
TO220-3-B
3
3
3
3
Metal
Metal
Plastic
Plastic
8.51
9.4
8.0
8.51
TO5
Transistor Package
TO92
TO220
3.7
4.8
17.0
EBC
(1) Emitter
(2) Base
(3) Collector
5.08 Typ.
2.54Typ.
Lead #1
ECB
(1) Emitter
(2) Collector
(3) Base
Lead #3
45°
0.71
0.86
Lead Codes
0.74
1.14
Pin
1
2
SCR
C
G
Transistor E
B
TRIAC
MT1 G
Dimensions: mm
7.0
2.8
ø3.1
2.5 Min.
12.7 Min.
Lead #2
4.5
10.0
1.8
4.8
12.7
Minimum
3 Leads
0.41
0.53
Packaging
Number of Pins
6.1
6.6
1.02
Maxium
TO5–3–B
3
A
C
MT2
0.5
12.0
8.0
5.0
2.5
13.5 Min.
0.45
2.3
5
0.8
0.55
2.54
(1) (2) (3)
1.3
Dimensions: mm
(1) Base
(2) Collector
(3) Emitter
101, 105, 107 and 109.
Dimensions: mm
(1) (2) (3)
Axial Leaded Resistors
Axial Leaded Resistors are through-hole mounted components. The
Practical Components part numbering system for this type of component
is based on wattage ratings, i.e.; 1/2 watt = 1/2-W-AR-3.5x9.5MM. AR components are available in bulk, tape and reel or ammo pak.
Axial Leaded Resistors
Part Description
Type
1/8-W-AR-1.6X3.7mm-TR
1/4-W-AR-2.3X6.5mm-TR
1/2-W-AR-3.5X9.5mm-TR
CF 1/8
CF 1/4
CF 1/2
Dimensions (mm)
L
3.00 ± 0.1
6.35 ± 0.5
8.51 ± 0.5
Notes
C
3.5 Max
7.1 Max
9.52 Max
D
1.70 ± 0.2
2.30 ± 0.3
3.00 ± 0.3
I
28.0 ± 3.0
28.0 ± 3.0
28.0 ± 3.0
d
0.45 ± 0.05
0.60 ± 0.05
0.60 ± 0.05
Wattage Size
Parts are conformal coated resistors—carbon film type.
 TR = Tape and Reel
 Lead-Free and Zero-Ohm value parts available

I
1/8–W–AR–1.6x3.7mm–TR
Axial Resistor
Package
Tape and Reel
Body Size
L
ød
øD
101, 105, 107 and 109.
C
66
2.6
2.54
(1) (2) (3)
Dummy Component Display Case
Practical Components offers a display case containing a sampling of
components. The components included range from the latest in high
technology (01005s, PoPs, CVBGAs, and Flip Chips) to standard SMT packages (PBGAs, MLFs, QFPs and TSOPs). The display case is equivalent to a
CD case for portability. These cases are fun and educational, providing
a quick, portable, show-n-tell representation to students, co-workers,
customers and vendors.
Case Size: 6" x 4"
Display Case Contents
Display Case Order Number: 12082
n
PoP Top Package on Package
PSvfBGA Bottom Package on Package
n CVBGA Very Thin ChipArray®
n PBGA Plastic Ball Grid Array
n QFP Quad Flat Pack
n LQFP Low Profile Quad Flat Pack
nMLF® MicroLeadFrame
n QFPQFN Open-molded Quad Flat Pack No Leads
n TSOP Type I
n Flip Chip
n 01005 Chip Resistor
n SOT23 Transistor
n SOD80 Diode
n TO18 Through Hole Transistor
n 1/4 Watt Axial Leaded Resistor
n
67
CTReels
Empty Carrier Tape Reels
When only the physical characteristics of the tape matter, we offer empty
carrier tape reels in a variety of widths and pitches. Empty carrier tape
reels are plastic embossed or paper carrier tape with sealed cover tape
to simulate running parts without the cost and mess during feeder applications. CTReels are a cost saving alternative compared to actual parts
on tape.
Empty Carrier Tape Reels
Part Description
Reel Size
Tape Width
7"x8mm-CTR-PA
7"
8mm
7"x8mm-CTR-PL
7"
8mm
7"x12mm-CTR-PL
7"x16mm-CTR-PL
13"x8mm-CTR-PA
13"x8mm-CTR-PL
13"x12mm-CTR-PL
7"
7"
13"
13"
13"
12mm
16mm
8mm
8mm
12mm
13"x16mm-CTR-PL
13"
16mm
13"x24mm-CTR-PL
13"
24mm
13"x32mm-CTR-PL
13"
32mm
13"x44mm-CTR-PL
13"
44mm
13"x56mm-CTR-PL
13"
56mm
13"x72mm-CTR-PL
13"
72mm
Notes
Tape Pitch
2mm
4mm
2mm
4mm
8mm
12mm
4mm
4mm
8mm
8mm
12mm
12mm
16mm
20mm
24mm
12mm
16mm
24mm
16mm
20mm
24mm
32mm
36mm
40mm
40mm
44mm
24mm
Standard
Pocket
0402SMR
0805SMR
0402SMR
0805SMR
1812SMC
SO16-7.6mm
0805SMR
0805SMR
SO8-3.8mm
SO14-3.8mm
SO16-7.6mm
SO20-7.6mm
PLCC28
LQFP-12mm
PBGA-13mm
T1-TSOP32
T1-TSOP32
PLCC44
T11-TSOP54
TBD
LQFP-20mm
PBGA-23mm
TBD
TBD
PBGA-35mm
QFP-32mm
TBD
Pockets
Per Reel
10,000
5,000
10,000
5,000
1,000
500
10,000
10,000
2,500
2,500
1,000
1,000
750
750
500
1,000
1,000
750
500
1,000
750
250
250
200
250
250
300
Tape Type
Paper
Paper
Plastic
Plastic
Plastic
Plastic
Paper
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Plastic
Taped to EIA 481 standards.
 Reels come standard with Heat Seal Cover Tape.
 PSA available upon request (pressure sensitive adhesive).
 10–100g peel back pressure for 8mm carrier tapes.
 10–130g peel back pressure for 12–56mm carrier tapes.
 10–150g peel back pressure for 72mm carrier tapes.
 Additional pocket types available upon request.
 Additional widths and pitches may be available, call for details.
 Plastic carrier tape is standard. Paper carrier tape is special order.
Reel Size and
7"x8mm-CTR–PA
Tape Width
Carrier Tape Reel

n
Tape Type
Tape Type: PA = Paper, PL = Plastic
Label
Top Cover Tape
Sprocket Hole
Cavity
Carrier Tape
68
Tape and Reel Specifications
Part Description
Tape
Width
Tape
Pitch
Reel
Size
Qty Per
Reel
Tape
Type
Part Description
Tape
Width
Tape
Pitch
Reel
Size
Qty Per
Reel
Tape
Type
01005SMR-PA
8mm
2mm
7"
20,000
Paper
TSSOP28TR-4.4mm
16mm
8/12mm
13"
1,000
Plastic
0201SMR-PA
8mm
2mm
7"
10,000
Paper
TSSOP28TR-6.1mm
24mm
12mm
13"
1,000
Plastic
0402SMR-PA
8mm
2mm
7"
10,000
Paper
TSSOP32TR-6.1mm
24mm
12mm
13"
1,000
Plastic
0603SMR-PA
8mm
4mm
7"
5,000
Paper
TSSOP38TR-4.4mm
16mm
8/12mm
13"
1,000
Plastic
0805SMR-PA
8mm
4mm
7"
5,000
Paper
TSSOP38TR-6.1mm
24mm
12mm
13"
1,000
Plastic
1206SMR-PA
8mm
4mm
7"
5,000
Paper
TSSOP44TR-4.4mm
24mm
12mm
13"
1,000
Plastic
1210SMR-PA
8mm
4mm
7"
5,000
Paper
TSSOP48TR-4.4mm
16mm
8mm
13"
1,000
Plastic
0201SMC-PA
8mm
2mm
7"
15,000
Paper
TSSOP48TR-6.1mm
24mm
12mm
13"
1,000
Plastic
0402SMC-PA
8mm
2mm
7"
10,000
Paper
TSSOP56TR-4.4mm
24mm
12mm
13"
1,000
Plastic
0603SMC-PA
8mm
4mm
7"
4,000
Paper
TSSOP56TR-6.1mm
24mm
12mm
13"
1,000
Plastic
0805SMC-PA
8mm
4mm
7"
4,000
Paper
T1-TSOP28-8.1x11.8mm-.55mm
24mm
12mm
13"
1,000
Plastic
1206SMC-PA
8mm
4mm
7"
4,000
Paper
T1-TSOP28/32-8x18.4mm-.5mm
32mm
12/16mm
13"
1,000
Plastic
0805SMC-PL
8mm
4mm
7"
4,000
Plastic
T1-TSOP32-8x18.4mm-.5mm
32mm
12/16mm
13"
1,000
Plastic
1206SMC-PL
8mm
4mm
7"
3,000
Plastic
T1-TSOP40-10x18.4mm-.5mm
32mm
16mm
13"
1,000
Plastic
1210SMC-PL
8mm
4mm
7"
3,000
Plastic
T1-TSOP48-12x18.4mm-5mm
32mm
16mm
13"
1,000
Plastic
1812SMC-PL
12mm
8mm
7"
1,000
Plastic
T11-TSOP20/26-7.6x17.4mm-1.27mm
24mm
12mm
13"
1,000
Plastic
1825SMC-PL
12mm
8mm
7"
1,000
Plastic
T11-TSOP24/28-10.16x18.41mm-1.27
32mm
16mm
13"
1,000
Plastic
3mm-SME-PL
12mm
8mm
13"
2,000
Plastic
T11-TSOP32-10.16x20.95mm-1.27mm
32mm
16mm
13"
1,000
Plastic
4mm-SME-PL
12mm
8mm
13"
2000
Plastic
T11-TSOP40/44-10.16x18.42mm-.8mm
32mm
16mm
13"
1,000
Plastic
5mm-SME-PL
12mm
12mm
13"
1,000
Plastic
T11-TSOP44-10.16x18.42mm-.8mm
32mm
16mm
13"
1,000
Plastic
6.3mm-SME-PL
16mm
12mm
13"
1,000
Plastic
T11-TSOP44/50-10.16x20.95mm-.8mm
32mm
16mm
13"
1,000
Plastic
8mm-SME-PL
16mm
12mm
13"
1,000
Plastic
T11-TSOP50-10.16x20.95mm-.8mm
32mm
16mm
13"
1,000
Plastic
10mm-SME-PL
24mm
16mm
13"
500
Plastic
T11-TSOP54-10.16x22.22mm-.8mm
44mm
16mm
13"
1,000
Plastic
18MM-SME-PL
44mm
32mm
13"
125
Plastic
T11-TSOP66-12.7x22.22mm-.5mm
44mm
16mm
13"
1,000
Plastic
3216SMTA-PL
8mm
4mm
7"
2,000
Plastic
T11-TSOP86-10.16X22.22mm-.65mm
44mm
16mm
13"
1,000
Plastic
3528SMTA-PL
8mm
4mm
7"
2,000
Plastic
PLCC20TR
16mm
12mm
13"
1,000
Plastic
6032SMTA-PL
12mm
8mm
7"
500
Plastic
PLCC28TR
24mm
16mm
13"
750
Plastic
7343SMTA-PL
12mm
8mm
7"
500
Plastic
PLCC32TR
24mm
16mm
13"
750
Plastic
SC90-TR (supermini)
8mm
4mm
7"
3,000
Plastic
PLCC44TR
32mm
24mm
13"
450
Plastic
SOT323-TR
8mm
4mm
7"
3,000
Plastic
PLCC52TR
32mm
24mm
13"
450
Plastic
SOT353-TR
8mm
4mm
7"
3,000
Plastic
PLCC68TR
44mm
32mm
13"
230/250
Plastic
SOT363-TR
8mm
4mm
7"
3,000
Plastic
PLCC84TR
44mm
36mm
13"
250
Plastic
SOT23-TR
8mm
4mm
7"
3,000
Plastic
QFP-10mm sq.
24mm
24mm
13"
500
Plastic
SOT25-TR
8mm
4mm
7"
3,000
Plastic
QFP-14mm sq.
32mm
24mm
13"
350
Plastic
SOT26-TR
8mm
4mm
7"
3,000
Plastic
QFP-14x20mm
44mm
32mm
13"
500
Plastic
SOT143-TR
8mm
4mm
7"
3,000
Plastic
QFP-28mm sq.
44mm
40mm
13"
200
Plastic
SOT89-TR
12mm
8mm
7"
1,000
Plastic
QFP-32mm sq.
56mm
44mm
13"
200
Plastic
SOT223-TR
12mm
8mm
7"
1,000
Plastic
LQFP/TQFP- 5mm sq.
16mm
12mm
13"
1,000
Plastic
DPAK-TR
16mm
8mm
13"
2,500
Plastic
LQFP/TQFP- 7mm sq.
16mm
12mm
13"
1,000
Plastic
D2PAK-TR
24mm
12mm
13"
800/1,000
Plastic
LQFP/TQFP- 10mm sq.
24mm
16/24mm
13"
1,000
Plastic
SO8GTR-3.8mm
12mm
8mm
13"
2,500
Plastic
LQFP/TQFP- 12mm sq.
24mm
20/24mm
13"
1,000
Plastic
SO14GTR-3.8mm
16mm
8mm
13"
2,500
Plastic
LQFP/TQFP- 14mm sq.
32mm
24mm
13"
750
Plastic
SO16GTR-3.8mm
16mm
8mm
13"
2,500
Plastic
LQFP/TQFP- 14x20mm
44mm
32mm
13"
500
Plastic
SO16GTR-7.6mm
16mm
12mm
13"
1,000
Plastic
LQFP/TQFP- 20mm sq.
44mm
24mm
13"
500
Plastic
SO20GTR-7.6mm
24mm
12mm
13"
1,000
Plastic
LQFP/TQFP- 24mm sq.
44mm
32mm
13"
500
Plastic
SO28GTR-7.6mm
24mm
12mm
13"
1,000
Plastic
PBGA-13mm sq.
24mm
24mm
13"
500
Plastic
SO28JTR-7.6mm
24mm
12mm
13"
1,000
Plastic
PBGA-15mm sq.
24mm
24mm
13"
500
Plastic
SSOP8TR-5.3mm
12mm
8mm
13"
2,500
Plastic
PBGA-17mm sq.
24mm
24mm
13"
500
Plastic
SSOP14TR-5.3mm
16mm
12mm
13"
1,000
Plastic
PBGA-23mm sq.
44mm
32mm
13"
250
Plastic
SSOP16TR-5.3mm
16mm
12mm
13"
1,000
Plastic
PBGA-27mm sq.
44mm
32mm
13"
250
Plastic
SSOP20TR-5.3mm
16mm
12mm
13"
1,000
Plastic
PBGA-35mm sq.
56mm
40mm
13"
250
Plastic
SSOP24TR-5.3mm
16mm
12mm
13"
1,000
Plastic
CTBGA/CABGA-5mm sq.
12mm
8mm
13"
1,000
Plastic
SSOP28TR-5.3mm
16/24mm
12mm
13"
1,000
Plastic
CTBGA/CABGA-6mm sq.
16mm
8mm
13"
1,000
Plastic
SSOP48TR-7.6mm
32mm
12/16mm
13"
1,000
Plastic
CTBGA/CABGA-7mm sq.
16mm
12mm
13"
1,000
Plastic
SSOP56TR-7.6mm
32mm
12/16mm
13"
500
Plastic
CTBGA/CABGA-8mm sq.
16mm
12mm
13"
1,000
Plastic
TSSOP8TR-3.0mm
12mm
8mm
13"
2,500
Plastic
CTBGA/CABGA-9mm sq.
16mm
12mm
13"
1,000
Plastic
TSSOP8TR-4.4mm
12/16mm
8mm
13"
1,000/2,500
Plastic
CTBGA/CABGA-10mm sq.
24mm
12mm
13"
1,000
Plastic
TSSOP10TR-3.0mm
12mm
8mm
13"
2,500
Plastic
24mm
16mm
13"
1,000
Plastic
TSSOP14TR-4.4mm
12/16mm
8mm
13"
1,000/2,500
Plastic
24mm
16mm
13"
1,000
Plastic
TSSOP16TR-4.4mm
12/16mm
8mm
13"
1,000/2,500
Plastic
24mm
24mm
13"
500
Plastic
TSSOP20TR-4.4mm
16mm
8/12mm
13"
1,000/2,500
Plastic
24mm
24mm
13"
500
Plastic
TSSOP24TR-4.4mm
16mm
8/12mm
13"
1,000/2,500
Plastic
69
Custom PC Practice Boards and Kits
Design Custom PC Practice Boards Or Complete
Kits To Meet Your Specific Requirements.
Software
Data Files and
Includ
With All Kit ed
s!
Practical Components will help you design custom practice PC boards or
complete kits. Use the building blocks below to create your board and
start saving time and money using dummy parts and a PCB practice kit.
Please contact your service representative for more information. Practical PC boards are non solder mask defined.
Board Material
FR4 (140 ° Tg)
Polyimide
FR 5
BT
IS-410
170Tg
Stencil
Metal mask stencil is
used for solder printing,
which is available
for custom or
Practical board.
Stencils manufactured by
Soldermask, Inc.
Board Size/Thickness
Fiducials/Tooling Holes
4" x 5.5" (standard)
2.5" x 2.5"
3" x 3"
8" x 5.5"
.062" thick (2 layers)
Other
Fiducials are used to
orient the position of
each individual
component to populate
the board
Tooling holes are
.125" diameter
Doughnut (local and
global)
Gerber Data
LPI/Solder Mask
LPI is a photo liquid
imageable solder mask
that will not interfere
with solder paste
screen printing
X, Y and Theta Data
Software data used to
create a metal mask
stencil for solder paste
application
Software used to
calibrate pick and place
machines for placement
of components to PCB
Surface Pad Finishes
HASL
Pb F ree HASL
IMSN (Immersion Tin)
IMAG (Immersion Silver)
ENIG (Immersion Gold
over Electroless Nickel)
OSP (ENTEK® CU-106A HT)
Delivery
Standard delivery is
estimated 6 to 8 weeks
Expedited delivery
is available
Parts for PC Board
Capacitor
QFP
Transistor
TSOP
SOIC
BGA
PLCC
Tantalum
Resistor
LQFP
CABGA
SBGA
TQFP
ML F
TS SO P
SS OP
CTBGA
CVBGA
Dual Row MLF
tsCSP
Po P
Other
Final Product
PCB Practice Kit
70
CircuitCAM™ Software
Rapidly prepare off-line machine programs and
color-coded assembly documentation from
CAD or Gerber data.
Practical Components’ goal is to provide value to our customers by
saving time when setting up board test runs. Our partnership with Aegis
Industrial Software provides our customers digitized data files for use
with Practical’s complete line of PCB test boards. Using Aegis’ CircuitCAM
software, customers save an enormous amount of time when setting up
both manual stations and automated equipment.
Customer support for installation and use of CircuitCAM and
CheckPoint is provided directly by Aegis. Please call your Practical sales
representative to request additional information.
Aegis Software is a leading provider of innovative software solutions to
improve speed, control, and visibility throughout manufacturing operations. The company’s FactoryLogix software is the first system designed to
support all types of discrete manufacturing. From PCB assembly, to complex box-builds, large system integrations and even high-speed consumer
goods processing; this adaptive, multi-market solution redefines the very
concept of MES.
Aegis’ integrated suite of software modules manage the entire manufacturing information environment: from product launch, to material
logistics, through manufacturing execution, to operations analytics and
real-time dashboard systems. This holistic solution yields unprecedented
product, process, and materials traceability as well as the data fulfillment
and visibility manufacturers need for competitive improvement.
With a customer base of more than 1,200 corporations across the
electronics, medical, automotive, military and aerospace industries; 36
manufacturing equipment supplier partnerships, and over a decade of
independent customer satisfaction awards, Aegis delivers a unique level
of capability, value, and time-to-value for its manufacturing customers.
Founded in 1997 by two manufacturing engineers looking to address a
noticeable gap in the manufacturing information chain, the company’s
mission is to provide “software for manufacturing, created by manufacturing engineers.” The Aegis corporate culture and philosophy demand
honesty in the sales and promotion process, honoring of customer commitments, software value, and respect for the customer’s investment.
Aegis Software is headquartered in a state-of-the-art development and
training facility in Philadelphia PA. Aegis has international sales and support offices in Germany, UK, China, Singapore, and Japan, and is partnered
with 36 manufacturing equipment suppliers.
www.aiscorp.com
Virtual Factory Modeling
Create a graphical routing of your plant’s assets and the processes performed at each step. Each point in this routing is associated to a
user-defined documentation layout (template) and to a machine
programming interface gateway. Model your entire discrete assembly
process flow, from prep, assembly, inspection, test, and final assembly; out
through packout and shipping.
Total and Simplified CAD Support
Import board location data from CAD, Gerber, scanned boards, and from
select machine sources. Import for any CAD type takes a single click.
Knowledge of CAD formats is not required.
Visual Documentation
Expedite documentation development for both circuit board and
mechanical assemblies with drawing templates, automatic color coding,
cropping, annotation, OLE, clipboard, and multimedia. CircuitCAM is the
fastest tool to provide operators with the documents they need to do
their jobs effectively.
Machine Programming
CircuitCAM supports virtually all process, assembly, and inspection
systems. Through an industry leading network of over 25 machine OEM
partnerships, AEGIS offers comprehensive and user-friendly off-line programming for all types of SMT and through-hole insertion equipment.
All Practical Components kits come with:
nd
are a
Softw s Included
File
Data h All Kits!
Wit
Demonstration versions of CircuitCAM and Checkpoint
Ready-to-run CircuitCAM Project Files (CPFs)
n BOM, Gerber, GenCAD, and XY Centroid Files
n Assembly Documentation Samples and Templates
n Installation Instructions and User Manuals
n
CircuitCAM is an integral component to Aegis’ Factory Logix
system, a scalable suite of NPI and MES Solutions. Other integrated manufacturing tools include:
n
CheckPoint—BOM Importing and Revision Control
Web-based Paperless Documentation
n Web-based Work In Process (WIP) Tracking
n Web-based Quality Data Collection and Analysis
n Web-based Line Monitoring and Supervisory Dashboard
n Web-based Materials Setup Verification and Control
n Aegis DataMiner—Ad hoc data analysis, charting & reporting
n
n
For assistance with the installation and use of CircuitCAM and
Checkpoint, please contact an Aegis sales representative at:
Aegis Industrial Software
www.aiscorp.com
[email protected]
(215) 773-3571 (phone)
(215) 773-3572 (fax)
71
Kit Identifier
Component Part Numbers / Kit Numbers
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
SIR
v
PC2009
v
v
v
PC200-14mm
v
v
v
v
PC250-14mm-TMV-DT
v
PC052
v
PC200-12mm
v
PC049
72
v
WTK-1
01005SMR-PA-0
0201SMR-PA
0201SMR-PA-0
0402SMC-PA
0402SMR-PA-0
0603SMC-PA
0603SMR-PA-0
0805SMC-PA
0805SMR-PA-0
1/2-W-AR-3.5x9.5mm-TR
1/4-W-AR-2.3x6.5mm-TR
1206SMC-PA
1206SMR-Melf
1206SMR-PA-0
1210SMR-PA-0
6032SMTA-PL
68LCC
A-CABGA36-.8mm-6mm-DC
A-CVBGA97-.4mm-5mm-DC
A-CABGA196-1.0-15mm-DC
A-DualRowMLF156-12mm-.5mm-DC
A-CTBGA84-.5mm-7mm-DC
A-CTBGA228-.5mm-12mm-DC
A-MLF8-3mm-.65mm-DC
A-MLF16-5mm-.8mm-DC
A-MLF20-5mm-.65mm-DC
A-MLF28-7mm-.8mm-DC
A-MLF44-7mm-.5mm-DC
A-MLF48-7mm-.5mm-DC
A-PBGA1156-1.0mm-35mm-DC
A-PBGA196-1.0mm-15mmDC
A-PBGA208-1.0mm-17mm-non DC
PC031
PC015
PC014
PC013
PC012
PC011
SABER
PC009
PC008
PC007
PC003
PC000
Component Part Description
PC016-J-STD-E
Kit Part Description
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v v
v
v
v
v
v
v
v
v
v
v
v
v
v v
v
v
v v
v
v
v
v
v
Kit Identifier
v
v
SIR
v
v
v
v
v
v
v
v
v
v
v
v
PC2009
PC200-14mm
PC250-14mm-TMV-DT
PC052
PC200-12mm
PC049
WTK-1
A-PoP128-.65mm-12mm-DC-LF
A-PoP152-.65mm-14mm-DC-LF
A-PSvfBGA305-.5-12mm-DC-LF
A-PSvfBGA353-.5-14mm-DC-LF
A-TMVPoP200-.5mm-14mm-DC-LF
A-TMVPSvfBGA620-.4mm-14mm-DC-LF
A-T1-TSOP32-8x20mm-.5mm
A-TSSOP20T-4.4mm
Axial Electrolytic, 5x11
BQFP100-22.6mm-.636mm
CKO5
Conn-SMT
Conn-TH-Horizontal
Conn-TH-Vertical
DIP14
DIP16
DIP20-DC
DO35
DPAK(TO252)
LQFP80-10mm-.4mm
LQFP100-14mm-.5mm-2.0mm
LQFP120-14mm-.4mm-2.0
LQFP160-24mm
LQFP44-10mm-.8mm-2.0
LQFP64-7mm-.4mm-2.0
LQFP144-20mm-.5mm-2.0
Mono Capacitor - .200" lead space
PB08-200x200 Flip Chip
PBGA169-1.5mm-23mm-DC
PLCC20
PLCC28
PLCC44
PC031
PC015
PC014
PC013
PC012
SABER
PC011
PC009
PC008
PC007
PC003
PC000
PC016-J-STD-E
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v v
73
Kit Identifier
SIR
PC2009
PC200-14mm
PC250-14mm-TMV-DT
PC052
PC200-12mm
PC049
WTK-1
74
v v
PC031
PLCC68
PLCC68-DC
QFP100-14x20mm-.65mm-3.2mm
QFP100-14x20mm-.65mm-3.9mm-DC
QFP160-28mm-.65mm
QFP208-28mm-.5mm-2.6mm
QFP208-28mm-.5mm-2.6mm-DC
SO8-3.8mm
SO14-3.8mm
SO16-3.8mm
SO16-5.6mm
SO16-7.6mm-DC
SO18G-7.6mm
SO20-7.6mm
SO44G-13.3mm
SOD80
SOT143-TR
SOT23-TR
Spacer, CKO5
SSOP14T-5.3mm
SSOP16-3.8mm
SSOP20T-5.3mm-DC
SSOP20T-5.3mm
SSOP28T-5.3mm
SSOP8T-5.3mm
Sticky Tape (double sided)
T05
T11-TSOP54-10.16X22.22mm-.8mm
T11-TSOP44-10.16X18.42mm-.8mm
Terminal Holder Board, TB1
Terminal, Bifurcated
Terminal, Gold Cup
Terminal, Hook
Terminal, Pierced
Terminal, Turret
TO18
TO5/18 Spacer
TQFP80-12mm-.5mm
Wire, 20 guage
Wire, 22 guage
Wire, 26 guage
PC015
PC014
PC013
PC012
PC011
SABER
PC009
PC008
PC007
PC003
PC000
PC016-J-STD-E
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v v
v
v
v
v
v
v v
v
v
v
v
v
v
v
v
v
v
v
v
v
v v
v
v v v
v
v
v
v v
v
v
v
v
v
v
v
v
v
v
v v v
v
v
v
v
v
v
v
v
v
v
v
v
v
v v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
Single Pack Hand Solder Kit
Page Matrix
The kits listed below are for Hand Assembly. Each kit is prepackaged as an
individual kit. Each component is bagged and labeled for identification.
The test board is also individually bagged. Both kit and test board are put
in a cardboard box that identifies the kit contents. Kits can be customized to meet specific needs. Please call regarding availability of Lead-Free
single pack soldering kits.
Reference List for Single Pack Kits
Part Number
Tin-Lead / Lead-Free
10680 / 12086
13100 / 19314
13200 / 19990
13300 / 19463
19266 / 16561
19697 / 16795
15848 / 19742
15923 / 19462
15924 / 19991
15212 / 16792
15213 / 16791
15214 / 19409
15215 / 19308
15226 / 15227
11450 / 11444
15223 / 15225
15220 / 15224
IPC
Reference
Description
PC003
PC007T-0-01
PC007B-0-01
PC007K-0-01
PC009
PC011-0-01
PC012-0-01
PC012T-0-01
PC012B-0-01
PC013-K
PC013-BTK
PC013-RWTK-1
PC013-RK
PC015-0-01-STD
PC015-0-01-RWK
PC016-J-STD
WTK-1
Hand Solder Kit, 2.5" square
MLF Hand Assembly Kit
SMT Hand Assembly Kit (T/LQFP, TSOP, BGA, DualRowMLF)
MLF / Fine Pitch SMT (top and bottom)
Mixed Technology Kit
Fine Pitch BGA Kit (0.4, 0.5, 1.0mm)
Global BGA Test Kit (1.0mm and 1.27mm pitch)
Global BGA Test Kit (topside only, 1.0mm pitch)
Global BGA Test Kit (bottomside only, 1.27mm pitch)
Through Hole Kit (with wires and terminals)
Through-Hole Kit (no wires or terminals)
Recertification Kit (with wires and terminals)
Recertification Kit (no wires or terminals)
Rework Kit (unassembled)
Rework Kit (assembled)
Mixed Tech Kit
Wires and Terminals (with or without holder)
Page
Number
88
90
90
90
94
95
96
96
96
98
96
96
96
7711/7721
7711/7721
J-Std-001 Rev E
100
100
101
102
Software
Data Files and
Includ
With All Kit ed
s!
Pb
75
Conformal Coating Process Flow Chart
Dummy Components And PCB Test Boards For Cleanliness
And Conformal Coating Process Testing
Practical Components provides products and services for the testing and
evaluation of Conformal Coating materials on assembled PCB test boards.
Conformal coating has provided many benefits to high and reliability
industries as well as commercial off the shelf products being used in
extreme environments. Changes in technology have caused conformal
coating to become more prevalent in different industries like telecommunications, automotive, and other hand held devices. All these products
have befitted from the use of coatings for environmental protection and
product enhancements.
Parts for PC Board
Board Material
FR4 (140° Tg)
Polyimide
Fr5
BT
IS-410
170Tg
Capacitor
QFP
Transistor
TSOP
SOIC
BGA
PLCC
Tantalum
Board Size/Thickness
4" x 5.5" (standard)
2.5" x 2.5"
3" x 3"
8" x 5.5"
.062" thick (2 layers)
Other
Resistor
LQFP
CABGA
SBGA
TQFP
MLF
TSSOP
SSOP
CTBGA
CVBGA
Dual Row MLF
tsCSP
PoP
Other
Gerber Data
X, Y and Theta Data
Software data used to
create a metal mask
stencil for solder paste
application
Software used to calibrate
pick and place machines
for placement of
components to PCB
Surface Pad Finishes
HASL
Pb Free HASL
IMSN (Immersion Tin)
IMAG (Immersion Silver)
ENIG (Immersion Gold over
Electroless Nickel)
®
OSP (ENTEK CU-106A HT)
Customer Option 2
Customer Option 1
Manage Component
and board assembly.
Ship Unassembled
parts and boards.
Delivery
Standard delivery is
estimated 6 to 8 weeks
Expedited delivery
is available
Practical Components products can be effective in
the following areas:
The products and services provided by Practical Components in support of the evaluation items listed above are:
n
n
Is conformal coating necessary?
Clean or no clean
n SIR testing
n Coating process options
n Coating reliability
n Coating material evaluation
n Correct design for costing application
n Masking options
n Inspection and quality control of coating
n Repair and rework of PCB assemblies
n
Dummy Components including IC, Passives, transistors, connections or
special items as requested
n Test PCB dummy boards, made to any size, thickness, material, or special requirements as requested
n Assembly of dummy components to the test PCB boards
n Design of the PCB board to customer’s exact specifications
n Management of the procurement process and supply chain
All Practical Components supplies products are fully guaranteed. Our
products are made to the exact equivalent of live components, without
the internal live die or electrically functioning board. This significantly
lowers the cost of the components and test boards. Practical Components
can be one stop shop from board design and layout to completed assemblies read for coating. You can be focused on the coating not the logistical
chain of acquiring testing assemblies.
76
Test Boards for Cleanliness and Conformal Coating
Practical Components offers the following
PCB Test boards for printed wiring assemblies
materials for process qualification evaluations.
Practical Components Test Coupon Board Availability
Cu
HASL
ImAg
ENIG
PCB052/Rev B
PCB-B-24
PCB-B-25A
PCB-B-36
PCB-SIR
PCB-Saber
PCB015
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
CRET board
Standard Test Board
Standard Test Board
Standard Test Assembly
Test Board
Evaluation Test Board
Rework Test Board
X
X
X
H
H
PCB052 CRET Board
The Practical Components B-52 CRET (Cleanliness & Residue Evaluation Test) board is designed to help determine the ionic cleanliness of
a customers manufacturing process. The test board follows guidelines
associated with the IPC-B-52 Test Vehicle. There are several different ways
to measure residues and their effects on electrical performances, the two
most common in the industry are ionic cleanliness testing, for determination of ionic residues, and surface insulation resistance (SIR) testing, for
the evaluation of electrochemical failures in humid environments.
Of the various methods for determination of ionic residues, the method
of choice is ion chromatography, which determines both the type of ionic
residue and the amount of the residue. The IPC method for ion chromatography is IPC-TM-650, method 2.3.28. For SIR testing, the most modern
test method, involving frequent of continuous monitoring, is IPC-TM-650,
method 2.6.3.7. Consequently, a test vehicle was needed which could
be used for both ion chromatography and surface insulation resistance
testing, but which was more representative of mainstream manufacturing
materials and process.
77
Test Boards for Cleanliness and Conformal Coating
PCB-B-24 Standard Test Board
PCB-B-24
The PCB-B-24 standard test board is compliant with the IPC Phase 3
cleaning and cleanliness test program. It was designed to be a vehicle for
examining the interactions between laminate, surface metalizations, and
fluxes. It is the primary qualification vehicle for ANSI J-STD-004, which is
the IPC specification on fluxes.
The four comb patterns are identical and have 16 mil lines and 20 mil
space. These values were chosen both for ease of stencil printing solder
paste, and the board can be wave soldered with minimal chance of
solder bridging.
The PCB-B-24 test board is an excellent vehicle for narrowing down fluxes
or solder material, or testing material interaction.
PCB-B-25A Standard Test Board
PCB-B-25A
The PCB-B-25A test board meets the current guidelines for solder Masks
(IPC-SM-804C) and conformal coatings (IPC-CC-830A).
The board is normally 0.062" FR-4. The board is simple print-and-etch. The
surface is bare copper for materials qualification, but could be any Surface
finish required.
The PCB-B-25A is used to evaluate interactions between solder masks,
solder paste, and fluxes.
PCB-B-36 Standard Test Assembly
PCB-B-36
The PCB-B-36 standard test board was designed for the IPC cleaning
cleanliness test program, Phase 1. It was designed for examining the
ability of a cleaning solvent to remove flux residues, and to examine
the effects of entrapped residues under low standoff components. The
PCB-B-36 test board can be used as a process qualification vehicle for the
J-STD-001. This board has 10 SIR test patterns. Two patterns #2 and #4
are mounting pads in quadrants C and D. The pad spacing is 25 mils for
patterns #2 and #4. The contact fingers of the board are normally gold
plated for compatibility with edge card connectors. The remaining metallization is normally bare copper, or any surface finish. In most cases, four
leadless ceramic chip carriers (LCCs) are mounted on the board, one in
each quadrant.
This test vehicle is designed to test combinations of conformal coatings,
fluxes, solder paste and their interactions with each other. Testing cleaning residue under low stand off components is a benefit of the PCB-B-36
test board.
78
Test Board Matrix for Cleanliness and Conformal Coating
Practical Components SIR Test Board
The Practical Components SIR board is a double sided board
to characterize fluxes by determining the degradation of
electrical insulation resistance of rigid printed wiring board
specimens after exposure to the specified flux. The board
contains pads for LCC68 and A-PBGA208-1.0mm-17mm
components. Boards and kits are available in Tin-Lead or
Lead-Free.
Practical Components Saber Board
The SABER evaluation board can be used to evaluate pick and place
equipment, reflow process, component, cleanliness and solder paste
screening. The SABER board also has honeycomb patterns for SIR testing.
Board finishes include ImAg, ENIG and Pb-Free HASL. Standard board
material is IS-410.
Practical Components PC015 Assembled Test Board
Available Pre-Assembled, this board is the ideal vehicle for Off the shelf
Conformal Coating testing. Pre-Populated with a variety of component
types, from LQFPs and CABGAs, DIPs down to 0603 chips this board offers
a real-world conformal coating testing surface and gives standardized
and repeatable results. The PC015 is available in Tin-Lead or Lead-Free
versions. The PC015 and components can also be delivered unassembled
or partially assembled, example: only the surface mount components
mounted on the board. Practical Components also specializes in designing PCB test boards made to size, thickness, material or specified requirements as requested. Practical can also manage the procurement process
and supply chain, including assembly and application of materials. Practicals PC015 Rework Kit conforms to IPC 7711/7721 standards or reworking.
79
SIR Test Board and Kit
REVISED
[Rev. A]
The Practical SIR board is double sided board to characterize fluxes by
determining the degradation of electrical insulation resistance of rigid
printed wiring board specimens after exposure to the specified flux. This
test is carried out at height humidity and heat conditions. The board
contains pads for LCC68 and A-PBGA208-1.0mm-17mm components. Kit
is available Tin-Lead or Lead-Free (see note.)
SIR Test Board
Standard finish is ImAg. IS-410 board material.
Order Number: PCB-SIR (Board Only)
SIR Kits
Part Description
68LCC-1.27mm-24.1mm
Kit Order Number: (Tin-Lead)
Kit Order Number:(Lead-Free)
Quantity Per
1 Kit
4
2
SIR-0-01
SIR-0-01-LF
Quantity Per
5 Kits
20
10
SIR-0-05
SIR-0-05-LF
Quantity Per
10 Kits
40
20
SIR-0-10
SIR-0-10-LF
Notes


Gerber and X, Y Theta data included at no charge.
PBGA is available Lead-Free with SAC305 or SAC405 solder ball alloy’s.
LCC is only available with Au castellations which is standard.
80
SMTA Saber Evaluation Board and Kit
REVISED
Tin-Lead or Lead-Free Available!
[Rev. E]
SMTA Saber Evaluation PC Board
The SMTA Saber Evaluation Kit.
Practical Components is licensed by SMTA to distribute the Saber
Evaluation PC Board. The Saber Board includes land patterns for a
wide variety of JEDEC and EIAJ components.
The Saber Board is used to evaluate:
P&P equipment
Reflow process
 Component placement accuracy
 Cleanliness
 Speed and accuracy of component placement
 Solder paste screening


Notes
Gerber Data and X, Y Theta Data are available if required at
no charge.
 Lead-free parts are available.

Order Number: PCB-SABER (Board Only)
Standard board finish is Immersion SilverIS-410
board material.
Other board finishes available are:
ENIG and Pb Free HASL
Available as a
Single Pack Kit
Top/bottom view (double-sided)
Board size: 3.875" x 5.375"
SMTA Saber Board Kits
Part Description
PCB-Saber (see chart for avail. finishes)
01005SMR-Sn
0201SMR-Sn
0402SMR-Sn
0603SMR-Sn
0805SMR-Sn
1206SMR-Sn
1210SMR-Sn
SOT23-Sn
A-CABGA208-.8mm-15mm-DC-305
DPAK(TO252)-Sn
SO16GT-3.8mm-Sn
SO20GT-7.6mm-Sn
PLCC68-Sn
T1-TSOP32-8x18.4mm-.5mm-Sn
(V)FQFP216(100/116)-14mm-.5mm-DC-Sn
QFP208-28mm-.5mm-2.6mm-Sn
QFP100-140x20mm-.65mm-3.9-DC-Sn
Kit Order Number: (Lead-Free)
Quantity Per
1 Kit
1
57
30
34
31
21
20
14
24
1
2
3
1
1
1
1
1
1
1
SMTA-Saber-1
SMTA-Saber-1-LF
Quantity Per
24 Kit
24
1,368
720
1,000
1,000
500
500
500
1,000
24
48
100
24
24
24
24
24
24
24
SMTA-Saber-24
SMTA-Saber-24-LF
Quantity Per
48 Kits
48
2,736
1,440
1,632
1,488
1,008
960
672
1,152
48
96
144
48
48
48
48
48
48
48
SMTA-Saber-48
SMTA-Saber-48-LF
Quantity Per
96 Kits
96
2,736
2,880
4,000
3,000
2,000
2,000
2,000
3,000
96
200
288
96
96
96
96
96
96
96
SMTA-Saber-96
SMTA-Saber-96-LF
81
B-52 CRET Rev B
Cleanliness & Residue Evaluation Test Kits
The new B-52 Rev. B board is the newest revision of the existing B-52 CRET
board. Practical will continue to offer the B-52 board on a transitional
basis over the next year. The B-52 Rev. B board continues to provide a platform for the electronic assembly industry to evaluate the cleanliness of
the assembly process. Both Rev. A and Rev. B boards have the same board
thickness (.062) and use the same components. On the Rev. B the copper
designators have been moved out. The Rev. B board width has increased
and the manufacturing rails have been removed. The non-plated holes
were revised to accommodate the alignment pins of the connectors, in
addition the diameter of through holes were reduced for better solderability of the through hole connectors. The ground plane was changed
from solid copper to copper mesh. These changes should have a positive
effect both on assembly and evaluation results.
Items to note are the B-52 Rev. B is available with just the SIR coupon.
Information regarding this option is available by calling Practical Components at 714-252-0010. In addition, it is recommended that customers use
test boards from their current or potential board supplier. Test boards can
also be customized to fit specific customer needs.
B-52 CRET Rev B Kit
Figure ID
Location
Part Description
3
6
7
9
2
8
5
10
1
11
4
U1, U9
U2, U8
U3, U10
U4-U7
C1-C8, C64-C75
C9-C23
C24-C38, C76-C85
C39-C63
J2
J1, J3
P1
A-CABGA256-1.0mm-17mm-ISO
A-QFP160-28mm-.65mm-ISO
A-TQFP80-12mm-.5mm-ISO
A-SO16GT-3.8mm-ISO
0402SMC-10.0pf
0603SMC-10.0pf
0805SMC-10.0pf
1206SMC-10.0pf
Conn-TH-Hor-4x24-AMP
Conn-TH-Ver-4x24-AMP
Conn-SMT-2x16-Molex
Lead-Free Part Number List
Quantity
Per Board
2
2
2
4
20
15
25
25
1
2
1
Tin-Lead Part Number List
Part Number
Part Description
Part Number
Part Description
19959
19960
19961
19962
20009
20010
20011
20012
19942
19943
19944
A-CABGA256-1.0mm-17mm-ISO-SAC305
A-QFP160-28mm-.65mm-2.6mm-ISO-SN
A-TQFP80-12mm-.5mm-2.0mm-ISO-Sn
A-SO16GT-3.8mm-ISO-Sn
0402SMC-10.0pf-Sn
0603SMC-10.0pf-Sn
0805SMC-10.0pf-Sn
1206SMC-10.0pf-Sn
Conn-SMT-2x16-Molex
19967
19968
19969
19970
20005
20006
20007
20008
19942
19943
19944
A-QFP160-28mm-.65mm-2.6mm-ISO
A-TQFP80-12mm-.5mm-2.0mm-ISO
A-SO16GT-3.8mm-ISO
0402SMC-10.0pf
0603SMC-10.0pf
0805SMC-10.0pf
1206SMC-10.0pf
Conn-SMT-2x16-Molex
Board Order Number: PCB052-RevB
82
B-52 CRET Rev B
83
B-52 CRET
The New Practical Components B-52 CRET (Cleanliness & Residue Evaluation Test) Kit is designed to help determine the ionic cleanliness of a customers manufacturing process. The test boards and components follow
guidelines associated with the IPC-B-52 Test Vehicle.
There are several different ways to measure residues and their effects on
electrical performances, the two most common in the industry are ionic
cleanliness testing, for determination of ionic residues, and surface insulation resistance (SIR) testing, for the evaluation of electrochemical failures
in humid environments.
Of the various methods for determination of ionic residues, the method
of choice is ion chromatography, which determines both the type of ionic
residue and the amount of the residue. The IPC method for ion chromatography is IPC-TM-650, method 2.3.28. For SIR testing, the most modern
test method, involving frequent of continuous monitoring, is IPC-TM-650,
method 2.6.3.7. Consequently, a test vehicle was needed which could
be used for both ion chromatography and surface insulation resistance
testing, but which was more representative of mainstream manufacturing
materials and processes. The IPC‑B‑52 Test Vehicle was the result.
The Practical B-52 CRET test vehicle is divided into four primary segments:
1. The main SIR test board
2. The Ion Chromatography (IC) test coupon
3. The solder mask adhesion coupons
4. The SIR mini-coupons
Additional technical information specifications and guidelines can be
found on the Practical Components web site at www.practicalcomponents.com. Practical Components provides the test vehicles, components,
Gerber files, and Aegis Circuit Cam files. If the goal of testing is to do an
engineering evaluation of the manufacturing process, then stock IPC-B-52
boards can be used, but should be as representative as possible. If the
goal of the testing is process qualification, per J-STD-001 or IEC 61189-5,
then the test vehicles should be procured from the customers existing
PCB vendor using the same material set as for manufactured hardware.
Customers should note that Practical will offer both Tin-Lead and
Lead‑Free versions of the PCB052 B-52 CRET Kit.
B-52 CRET Kit
Figure ID
Location
Part Description
3
6
7
9
2
8
5
10
1
11
4
U1, U9
U2, U8
U3, U10
U4-U7
C1-C8, C64-C75
C9-C23
C24-C38, C76-C85
C39-C63
J2
J1, J3
P1
A-QFP160-28mm-.65mm-ISO
A-TQFP80-12mm-.5mm-ISO
A-SO16GT-3.8mm-ISO
0402SMC-10.0pf
0603SMC-10.0pf
0805SMC-10.0pf
1206SMC-10.0pf
Conn-SMT-2x16-Molex
Lead-Free Part Number List
Quantity
Per Board
2
2
2
4
20
15
25
25
1
2
1
Tin-Lead Part Number List
Part Number
Part Description
Part Number
Part Description
19959
19960
19961
19962
20009
20010
20011
20012
19942
19943
19944
A-CABGA256-1.0mm-17mm-ISO-SAC305
A-QFP160-28mm-.65mm-2.6mm-ISO-SN
A-TQFP80-12mm-.5mm-2.0mm-ISO-Sn
A-SO16GT-3.8mm-ISO-Sn
0402SMC-10.0pf-Sn
0603SMC-10.0pf-Sn
0805SMC-10.0pf-Sn
1206SMC-10.0pf-Sn
Conn-SMT-2x16-Molex
19967
19968
19969
19970
20005
20006
20007
20008
19942
19943
19944
A-QFP160-28mm-.65mm-2.6mm-ISO
A-TQFP80-12mm-.5mm-2.0mm-ISO
A-SO16GT-3.8mm-ISO
0402SMC-10.0pf
0603SMC-10.0pf
0805SMC-10.0pf
1206SMC-10.0pf
Conn-SMT-2x16-Molex
Note
n
Board Order Number: PCB052
Connector J2 has overhang tabs which interfere with the manufacturing
rails. In its place, a third vertical connector (J1, J3) can be used.
84
B-52 CRET
H
H
Standard board finish is Immersion Silver, ENIG and HASL. S-410
board material. Board size: 3.950" x 10.04".
85
Lead-Free Zero-Ohm SMD Resistor Kit
REVISED
The PCB000 test board has land patterns for 01005, 0201, 0402, and 0603
Zero Ohm Lead-Free SMD Resistors. Each component pad is connected
in series (daisy-chained) to the next pad. When zero ohm value resistors
are placed on the pad, the result is a line of continuity. This test board can
be used for placement accuracy evaluation with any type of component
[Rev. B]
matching the physical size of the pads. Each component type has 2,000
pads, except for 01005 pad size which has 165 pads for Pick-n-Placement
purposes only with four different pad spacing. There are also 48 pads for
01005 to test for continuity.
PCB000 Zero-Ohm Test Board
P/N PCB000© 2ØØØ PRACTICAL COMPONENTS, INC.
Board size: 8" x 5.5", .062" thick.
IS-410 board material.
Standard finish is Immersion Silver.
Board finishes available are ENIG and Pb-free HASL.
SMD Resistors with Zero-Ohm value, and SMD Capacitors can be used on
this test board. Customers can mix and match components and quantities
to create a custom kit. Please contact your Practical Components sales
representative for details.
PC000 SMD Lead-Free Zero-Ohm Resistor Kits
Part Description
*01005SMR-PA-0-Sn
0201SMR-PA-0-Sn
0402SMR-PA-0-Sn
0603SMR-PA-0-Sn
PCB000-Zero Ohm Board
Kit Order Number (Lead-Free):
Quantity Per
5 Kits
1,000
10,000
10,000
10,000
5
PC000-0-5-LF
Quantity Per
10 Kits
2,000
20,000
20,000
20,000
10
PC000-0-10-LF
* 01005SMR-PA-0-Sn part is not included in kit. Can be added to kit‑build
upon request for additional price.
 Gerber and X, Y Theta data included at no charge.
86
Quantity Per
20 Kits
3,500
40,000
40,000
40,000
20
PC000-0-20-LF
Quantity Per
25 Kits
4,300
50,000
50,000
50,000
25
PC000-0-25-LF
Quantity Per
50 Kits
8,500
100,000
100,000
100,000
50
PC000-0-50-LF
Order numbers for individual items
Notes

Quantity Per
15 Kits
3,000
30,000
30,000
30,000
15
PC000-0-15-LF
Part Description
01005SMR-PA-0-Sn
0201SMR-PA-0-Sn
0402SMR-PA-0-Sn
0603SMR-PA-0-Sn
PCB000-Zero Ohm Test Board
Order Numbers
16463
12200
16069
16070
TBD (customer to specify finish)
AIM Print Test Board and Kit
PCB2009 AIM Print Test Board
Board material is IS-410.
Standard finish: ImAg.
Board size: 8.5" x 6".
The AIM print test board was designed to include many printing challenges which are commonly encountered on manufacturers assemblies. BGA
pads have circular and square pad design to test paste release. AIM has
included the standard IPC slump test pattern in order to further challenge
the properties of any product tested thereon. This print pattern is more
real life and more accurate to predict slump since individual pads are used
instead of one pad that is common in the “thermometer” method. There is
a number on the board indicating the distances between pads so a hard
number can be used for paste evaluations.
Common pad sizes were incorporated into the layout including 1206,
0805 and 0603 rectangular pads for discrete components. These pads
have varying distance between them so the user can determine solder
beading of paste. Four 250 x 250mil pads are available to be utilized with
various aperture styles in order to allow for wetting tests. There are also
several fine pitch QFP pads designed to check for the propensity of any
given product to cause bridging and to confirm the existence of torn
prints, peaking (dog ears), or bridging.
Notes


Digitized gerber files provided by Aegis Software included at no charge.
Kit available with Tin/Lead and Pb-free components.
and
ware cluded
t
f
o
S
In
Files ll Kits!
a
t
a
A
D
With
PC2009 AIM Test Kit
Part Description
Quantity Per 25 Kits
A-T/LQFP144-20mm-.5mm-2.0
A-PLCC20T
A-CABGA196-1.0mm-15mm-DC
A-QFP44-10mm-.8mm-3.2mm
A-QFP64-14mm-.8mm-3.2mm
A-LQFP176-24mm-.5mm-2.0mm
A-PLCC68T
A-SSOP28T-5.3mm
A-SSOP20T-5.3mm
0603SMR
0805SMR
1206SMR
0402SMR
0201SMR
01005SMR
PDIP14
A-MLF48-7mm-.5mm-DC
A-MLF16-5mm-.8mm-DC
PCB2009
Kit Order Number:
50
25
50
25
25
25
25
25
25
75
75
750
750
1206
750
750
1425
350
100
100
100
25
25
25
25
PC2009-0-25
87
PC003 Solder Practice Board and Kit
Tin-Lead and Lead-Free Kits are available
The PC003 hand solder practice kit is a low cost, effective kit for training
and testing employees. This double-sided board has pads for 13 different
components: One through-hole Dip14 and twelve surface-mount components. Each item is individually bagged and tagged for easy identification. Kits consist of PLCCs, SOICs, TSSOPs, SOTs, Passives, and QFPs with
0.5mm and 0.65mm pitch. This low cost kit is ideal for classroom training
and practice. IPC-A-610 Rev D compliant. Kit is available with Tin-Lead or
Lead-Free components.
PCB003 Solder Practice Board
IPC Compliant
Single Pack Kit
PC003 Solder Practice Board Kit
(Tin-Lead and Lead-Free components available)
Part Description
Top View—Board
size: 2.5" x 2.5"
PCB003 Board (customer to specify finish)
QFP100-14x20mm-.65mm-3.2mm
PLCC44
SO8GT-3.8mm
SO20GT-7.6mm
SOT23
SOT143
TSSOP20-4.4mm
0603SMR
0805SMR
1206SMR
DIP14T
Quantity
Per Kit
1
1
1
1
1
1
1
3
2
2
6
3
6
1
PC003
PC003-LF
Note


Standard finish
is ImAg finish,
IS-410 board
material.
Other board
finishes available
are: HASL, ENIG,
and Pb free ImAg.
Gerber Data and X, Y Theta Data are available at no charge.
Lead-Free parts are available with Sn finish.
Software
Data Files and
Includ
With All Kit ed
s!
Bottom View
Order Number: PCB003 Rev B (Board Only)
88
BGA Variable Pitch and Array Board
Mix and match components to configure your custom kit.
Practical Components is now offering a “one-of-a-kind” BGA Variable Pitch
and Array PC Board. Each board contains matrices for the most popular
ball pitches found on BGAs and CSPs. The use of full matrices allows
maximum flexibility for placing parts with full, staggered, or perimeter
configurations. Each board has a mixture of even and odd matrices
to enable placement, using automatic equipment, of the highest ball
counts available.
PCB005 Variable Pitch and Array Board
WWW.PRACTICALCOMPONENTS.COM
FAX: 714.252.0026
FAX: 714.252.0026
[email protected]
PHONE: 714.252.0010
PHONE: 714.252.0010
Standard finish is Immersion Silver.
Top View
Bottom View
Order Number: PCB005 (Board Only)
Notes
Kits can be configured to the customer’s requirements.
 Gerber Data and X, Y Theta Data are available if required at no charge.
 Pad dimensions:
1.0mm pitch = 24 mil pad diameter
1.27mm pitch = 28–30 mil pad diameter
1.5mm = 28–30 mil pad diameter
0.5mm = 11 mil pad diameter
0.8mm = 18–19 mil pad diameter
0.75mm = 18 mil pad diameter

Available as a
Single Pack Kit
Please call your Practical Components’ sales representative to identify
components available for the PCB005 Test Board.
89
MLF® Test Board and Kits
REVISED
[Rev. A]
Lead-Free and Tin-Lead Kits Available!
This new PCB007 MicroLeadFrame® (MLF®) Test Board is two test boards
in one. The top side of the board consists of daisy-chained MLF® pads.
Amkor’s new MLF® packages are a near CSP plastic encapsulated package
with a copper leadframe substrate. MLF® packages have perimeter pads
on the bottom of the package. Thermal enhancement is provided by
Amkor’s ExposedPad™ technology.
The test board front side has land patterns for MLF® package sizes in
varying I/O counts. Lead pitches of these include 0.5mm, 0.65mm and
0.8mm. The MLF® side of the PCB007 board is designed to help customers
become more familiar with the placement and process characteristics of
MLF® packages. The wide assortment of pad sizes and pitches provide a
PCB007 MLF Test Board
comprehensive overview of MLF® packages. Daisy-chain patterns on the
PCB007 board complement the patterns on the components, allowing
continuity to be tested (except for TSOP‘s and T/LQFP120).
The bottom side of the PCB007 Test Board provides a variety of SMD
component types. The bottom of the board has T/LQFP component with
0.4mm pitch, pads for the PBGA256 component with a 1.00mm pitch
and two TSOP Type II components with 0.8mm pitch. Board also has new
DualRowMLF156 component with 0.5mm pitch. Standard board finish for
the PCB007 is Immersion Silver. Other finishes are available upon request.
Standard board thickness is 0.062". Customers always have the option of
mixing and matching components to suit their requirements.
Available as a
Single Pack Kit
Standard finish is Immersion Silver IS-410
board material.
Other board finishes available are: ENIG and
Pb free HASL.
Top view—
Board size: 8" x 5.5"
Software
Data Files and
Includ
With All Kit ed
s!
Bottom view
90
MLF® Test Board and Kits
Part Description
Kit Order Number (Top and Bottom):
A-MLF16-5mm-.8mm-DC
A-MLF28-7mm-.8mm-DC
A-MLF44-7mm-.5mm-DC
T11-TSOP44-10.16x18.42mm-.8mm
T11-TSOP54-10.16x22.22mm-.8mm
PCB007 Test Board
Part Description
Kit Order Number (Bottom Only):
T11-TSOP44-10.16x18.42mm-.8mm
T11-TSOP54-10.16X22.22mm-.8mm
PCB007 Test Board
Part Description
Kit Order Number (Top Only):
A-MLF16-5mm-.8mm-DC
A-MLF28-7mm-.8mm-DC
A-MLF44-7mm-.5mm-DC
PCB007 Test Board
Quantity Per
1 Kit
PC007K-0-01
24
24
32
10
20
28
6
3
6
6
6
1
PC007 MLF® Kits
(Lead-Free Option Available)
Quantity Per
5 Kits
PC007K-0-05
120
120
160
50
100
140
30
15
30
30
30
5
Quantity Per
10 Kits
PC007K-0-10
240
240
320
100
200
280
60
30
60
60
60
10
Quantity Per
20 Kits
PC007K-0-20
480
480
640
200
200
560
120
60
120
120
120
20
Quantity Per
50 Kits
PC007K-0-50
1,200
1,200
1,600
500
1,000
1,400
300
150
300
300
300
50
Quantity Per
1 Kit
PC007B-0-01
6
3
6
6
6
1
Quantity Per
5 Kits
PC007B-0-05
30
15
30
30
30
5
Quantity Per
10 Kits
PC007B-0-10
60
30
60
60
60
10
Quantity Per
20 Kits
PC007B-0-20
120
60
120
120
120
20
Quantity Per
50 Kits
PC007B-0-50
300
150
300
300
300
50
Quantity Per
1 Kit
PC007T-0-01
24
24
32
10
20
28
1
Quantity Per
5 Kits
PC007T-0-05
120
120
160
50
100
140
5
Quantity Per
10 Kits
PC007T-0-10
240
240
320
100
200
280
10
Quantity Per
20 Kits
PC007T-0-20
480
480
640
200
200
560
20
Quantity Per
50 Kits
PC007T-0-50
1,200
1,200
1,600
500
1,000
1,400
50
Notes
Kit quantities are subject to change.
 Mix and match components and quantities to create a custom kit.
Please contact your sales representative for details.
 Components supplied in kits (except for TSOP‘s and T/LQFP120) have
pairs of leads shorted together in a daisy-chain pattern that result in a
line of continuity when combined with the shorted pairs of pads on the
board. Continuity test pads on the board allow the end user to verify
electrical connections at solder joints and to identify electrical opens.
 PBGA is available with SAC305 or SAC405 Lead-Free solder ball alloy’s.

Available as a
Lead-Free Part Description List
Part Description
A-DualRowMLF156-12mm-.5mm-DC-Sn
A-T/LQFP120-14mm-.4mm-2.0-Sn
PBGA256-1.0mm-17mm-DC-SAC305
T11-TSOP44-10.16x18.42mm-.8mm-Sn
T11-TSOP54-10.16x22.22mm-.8mm-Sn
PCB007 Test Board (customer to specify board finish)
Single Pack Kit
91
Solder Practice Board and Kits
REVISED
A universal PCB to meet all your needs.
Rework practice, solder training and evaluation, and for testing and calibration of pick-and-place machines.
[Rev. H]
Lead-Free Option Available!
Order Number: PCB008 Rev H (Board Only)
PCB008 Solder Practice Board
Software
Data Files and
Includ
With All Kit ed
s!
Standard finish is Immersion Silver. IS-410
board material.
Other board finishes
available are: ENIG,
OSP-HT, and Pb-free
HASL.
Top view—
Bottom view—
92
Solder Practice Board and Kits
Choose from the kits below or create your own custom configuration.
Lead-Free Components List
(included in a complete kit)
Part Description
MLF68-10mm-.5mm-DC-Sn
PBGA256-1.0mm-17mm-DC-LF
CVBGA97-.4mm-5mm-DC-LF
PBGA388-1.27mm-35mm-DC-LF
QFP44-10mm-.8mm-3.9mm-Sn
QFP100-14x20mm-.65mm-3.9mm-DC-Sn
LQFP100-14mm-.5mm-2.0mm-Sn
PLCC20-Sn
PLCC44-Sn
PLCC68-Sn
SO8-3.8mm-Sn
SO14-3.8mm-Sn
SO20-7.6mm-Sn
SSOP20-5.3mm
01005SMR-Sn
SOT23-TR-Sn
SOT143-TR-Sn
0201SMR-Sn
0402SMR-Sn
0603SMR-Sn
0805SMR-Sn
1206SMR-Sn
PCB008 Board (customer to specify finish)
Quantity
Per Board
2
2
2
2
2
2
2
2
1
2
2
2
4
4
4
3
200
4
4
180
52
42
36
32
1
Tin-Lead Components List
(included in a complete kit)
Part Description
MLF68-10mm-.5mm-DC
CVBGA97.4mm-5mm-DC
QFP100-14x20mm-.65mm-3.9mm-DC
PLCC20
PLCC44
PLCC68
SO8-3.8mm
SO14-3.8mm
SO20-7.6mm
SSOP20-5.3mm
01005SMR
SOT23-TR
SOT143-TR
0201SMR
0402SMR
0603SMR
0805SMR
1206SMR
PCB008 Board-HASL finish
Quantity
Per Board
2
2
2
2
2
2
2
2
1
2
2
2
4
4
4
3
200
4
4
180
52
42
36
32
1
Notes
Gerber Data and X, Y Theta Data are available if required at no charge.
Digitized files provided by Aegis Software included at no charge.
 Kit is available with Lead-Free components (for Tin-Lead and
Lead-Free kits). Substitutions may occur depending on availability of
lead-free finishes and alloys.
 PBGAs are available with SAC305 or SAC405 Lead-Free alloys.
 CVBGA is available with SAC105, SAC305 or SAC405 Lead-Free alloys.



Add “LF” to end of Kit Order Number when ordering Lead-Free kits.
93
Mixed Technology Board and Kit
The PC009 Mixed Technology kit has surface mount components and
through-hole components. This kit’s primary use is for hand soldering
but is also available as machine run upon special request. Tin-Lead and
Lead-Free components available. Through-hole components are placed
in close proximity to surface mount components to represent real soldering situations. Components are individually bagged and identified for
component recognition.
Tin-Lead and Lead-Free Kits Available
PCB009 Mixed Technology Board
Part Description
A-PBGA256-1.27mm-27mm-DC-SAC405 or SAC305 **
A-CABGA36-.8mm-6mm-DC-SAC405 or SAC305 or SAC105 **
SOT23-TR-Sn
PLCC44-Sn
PLCC68-Sn
SOD80-TR-Sn
SO16GT-3.8mm-Sn
6032SMTA-TR-Sn
0805SMR-TR-Sn
1206SMR-TR-Sn
0603SMR-TR-Sn
QFP44-10mm-.8mm-3.2-Sn
DIP16T-Sn
1/4 Watt Axial Resistor-Sn
1/2 Watt Axial Resistor-Sn
CK05-LF
T05-Sn
5 x 11 Axial Electrolytic-LF
DO35-LF
PC009 Mixed Technology Kits
(Tin-Lead and Lead-Free parts)
Hand Assembly
Part Description
PCB009 Mixed Technology Board
SMD Components
A-PBGA256-1.27mm-27mm-DC **
A-CABGA36-.8mm-6mm-DC **
SOT23-TR
PLCC44
PLCC68
SOD80-TR
SO16GT-3.8mm
6032SMTA-TR
0805SMR-TR
1206SMR-TR
0603SMR-TR
QFP44-10mm-.8mm-3.2
Through-Hole Components
DIP16T
1/4 Watt Axial Resistor
CK05
T05
5 x 11 Axial Electrolytic
DO34 or DO35
94
Board size: 4" x 5.5". Standard finish is Immersion Silver.
Other board finishes available are: ENIG and HASL.
Quantity Per
1 Kit
Quantity Per
5 Kits
5
Machine Run
Quantity Per
Quantity Per
10 Kits
20 Kits
10
20
Quantity Per
50 Kit
50
1
1
1
10
1
1
10
4
10
20
20
20
1
5
5
5
50
5
5
50
20
50
100
100
100
5
10
10
10
100
10
10
100
40
100
200
200
200
10
20
20
20
200
20
20
200
80
200
400
400
400
20
50
50
50
500
50
50
500
200
500
1,000
1,000
1,000
50
40
50
50
50
50
20
50
PC009-0-10
PC009-0-10-LF
80
100
100
100
100
40
100
PC009-0-20
PC009-0-20-LF
200
250
250
250
250
100
250
PC009-0-50
PC009-0-50-LF
4
5
5
5
5
2
5
PC009-0-01
PC009-0-01-LF
20
25
25
25
25
10
25
PC009-0-05
PC009-0-05-LF
Available as a
Single Pack Kit
Kit available
with Tin-Lead or
Lead-Free parts.
Notes
**BGA/CABGA Packages are not included in kit. Either BGA or CABGA
can be added to kit upon request.
 Mix and match components and
quantities to create a custom kit.
 Gerber Data and X, Y Theta Data
are available at no charge.
 Not all parts are available
lead-free.

BGA Fine Pitch Board and Kit
REVISED
[Rev. E]
Tin-Lead and Lead-Free Available
The PC011 BGA Kit contains Amkor daisy-chained fine pitch BGAs. The
daisy-chain PCB011 test board contains patterns for the 0.4mm pitch,
0.5mm pitch and 1.0mm pitch CSP/BGA components. Amkor BGA type
components on the board are the CTBGAs, CVBGAs and PBGAs. The
PCB011 test board is double sided. This test board is designed to help
the end user become familiar with smaller BGA body sizes and pitches.
Components come in standard JEDEC trays. Kit component quantities are
for one side of the board only.
PCB011 BGA Fine Pitch Board
Standard finish is Immersion Silver or ENIG finish.
Part Description
A-CTBGA84-.5mm-7mm-DC-SAC305
A-CVBGA360-.4mm-10mm-DC-SAC305
A-CABGA196-1.0mm-15mm-DC-SAC305
A-PBGA676-1.0mm-27mm-DC-SAC305
PCB011-Amkor BGA Test Board
Board size: 8" x 5.5"
PC011 BGA Kits
Quantity Per
1 kit
12
6
4
4
4
3
1
PC011-0-01
PC011-0-01-LF
Quantity Per
5 kits
60
30
20
20
20
15
5
PC011-0-05
PC011-0-05-LF
Quantity Per
10 kits
120
60
40
40
40
30
10
PC011-0-10
PC011-0-10-LF
Quantity Per
15 kits
180
90
60
60
60
45
15
PC011-0-15
PC011-0-15-LF
Quantity Per
20 kits
240
120
80
80
80
60
20
PC011-0-20
PC011-0-20-LF
Notes
Gerber and X, Y Theta data included at no charge.
 PBGAs are available with SAC305 or SAC405 solder ball alloys. CVBGA
and CTBGA are available with SAC305, SAC405 or SAC105 solder
ball alloys.

Part Description
Order Number

A-CABGA196-1.0mm-15mm-DC-SAC305
A-PBGA676-1.0mm-27mm-DC-SAC305
PCB011-Amkor BGA Test Board
31317
31329
31281
32182
31021
31019
19560
Available as a
Single Pack Kit
95
BGA Global Daisy-Chain Test Kit
Tin-Lead and Lead-Free Available!
PCB012 BGA Global Daisy-Chain Test Board
Standard finish
is Immersion
Silver.
IS-410 board
material.
Other board
finishes available are:
ENIG, and Pb
Free HASL
Top view—
Board size: 8"
x 5.5"
Bottom view
96
BGA Global Daisy-Chain Test Kit
Tin-Lead and Lead-Free Available!
The New PCB012 Global Daisy-Chain test board has 25 different BGA
land patterns. Board pads accommodate BGA components ranging from
15mm square to 35mm square. The PCB012 test board has 1.00mm and
1.27mm pitch pads. BGA components placed on this test board range
from 156 to 1,156 balls. Daisy-chain patterns on the PCB012 board compliment the patterns on the components, allowing continuity to be tested.
Each pad on the board has multiple daisy-chain patterns. These multiple
daisy-chained pads allow different ball-count PBGA components to be
placed on the same pad. Each pattern has test points to check for continuity. There are ball-count to test-point legends on the board. Standard
finish for the PCB012 board is Alpha Level Silver flash. Other finishes are
available upon request. Standard board thickness is 0.062". The board is
double‑sided with different pad sizes on the top and bottom. Customers
can mix and match components to suit their requirements.
PC012 BGA Global Daisy-Chain Test Kit
1.0mm Pitch—Top Side
Part Number
Part Description
30542
31358
30362
31359
30513
31352
31083
31019
30604
31312
31123
31306
30343
31345
A-PBGA208-1.0mm-17mm-DC-LF-305
A-PBGA1156-1.0mm-35-DC-LF-305
Part Number
Part Description
30543
31432
30047
31020
30372
31309
30417
31475
30645
30832
30644
31476
30065
31310
Quantity
Per 1 Kit
Quantity
Per 5 Kit
Quantity
Per 10 Kit
Quantity
Per 20 Kit
5 Pads
Per
Board
5
25
50
100
4 Pads
Per
Board
4
20
40
80
2 Pads
Per
Board
2
10
20
40
2 Pads
Per
Board
2
10
20
40
Quantity
Per 1 Kit
Quantity
Per 5 Kit
Quantity
Per 10 Kit
Quantity
Per 20 Kit
3 Pads
Per Board
3
15
30
60
3 Pads
Per
Board
3
15
30
60
2 Pads
Per
Board
2
10
20
40
2 Pads
Per Board
2
10
20
40
Description
PC012T-0-01
PC012T-0-01-LF
PC012B-0-01
PC012B-0-01-LF
PC012K-0-01
PC012K-0-01-LF
Part Number
15923
19462N
15924
19795
15848
19742
1.27mm Pitch—Bottom Side
Notes
Top
Top Lead Free
Bottom
Bottom Lead Free
Complete
Complete Lead Free
Kit quantities are subject to change.
Mix and match components and quantities to create a custom kit.
Please contact your sales representative for details.
 Board is double sided (top side for 1.0mm pitch packages / bottom side
for 1.27mm pitch package)
Available as a
Single Pack Kit
n Kit also available as SAC405 but SAC305 is the preferred Alloy.


97
Through-Hole Solder Training Kits
PC013 Kits—Choose from four kits!
The PC013 hand solder practice kit is an effective way to evaluate or train employees and
students. This versatile board comes with a
variety of through-hole components and each
kit is conveniently boxed and the components
are individually bagged and labeled for easy
identification. It is available in several different
options to meet each company’s requirements.
Kits come standard with an SO16 resistor network, but can be upgraded to a Flat Pack 16.
This kit is ideal for classroom settings.
PCB013 Board
Kit is available with Tin-Lead and
Lead-Free parts.
Available as a
Single Pack Kit
Basic Through-Hole Kit
Part Description
Quantity
Per Kit
PCB013 (customer to
specify finish)
DO35
AE-5x12
CK05
CK05 Spacer
1/2-W-AR
1/4-W-AR
DIP16
TO5
TO18
TO5/18 Spacer
SO16GT-3.8mm
Order Number: (Lead-Free)
Order Number:(Tin-Lead)
2
10
4
20
20
18
20
6
10
4
14
4
PC013-BTK -LF
PC013-BTK
Board size: 3" x 4", IS-410 board material.
Other board finishes available are: ENIG and HASL.
Complete Though-Hole Kit
Part Description
PCB013
Turret Terminal
Bifurcated Terminal
Hook Terminal
Pierced Terminal
Cup Terminal
DO35
AE-5x12
CK05
CK05 Spacer
1/4-W-AR
1/2-W-AR
DIP16
TO5
TO18
TO5/18 Spacer
SO16GT-3.8mm
20 Gauge Wire
22 Gauge Wire
26 Gauge Wire
98
Quantity
Per Kit
2
15
15
15
15
15
10
4
20
20
20
18
6
10
4
14
4
3'
3'
3'
PC013-K
PC013-K-LF
Recertification Kit With
Wires And Terminals
Part Description
PCB013
Turret Terminal
Bifurcated Terminal
Hook Terminal
Pierced Terminal
Cup Terminal
DO35
AE-5x12
CK05
CK05 Spacer
1/4-W-AR
1/2-W-AR
DIP16
TO5
TO18
TO5/18 Spacer
SO16GT-3.8mm
20 Gauge Wire
26 Gauge Wire
Order Number: (Tin-Lead)
Quantity
Per Kit
1
5
5
5
5
5
2
1
6
6
5
3
2
2
2
4
1
5'
5'
PC013-RWTK-1
PC013-RWTK-1-LF
Recertification Kit
Part Description
PCB013
DO35
AE-5x12
CK05
CK05 Spacer
1/4-W-AR
1/2-W-AR
DIP16
TO5
TO18
TO5/18 Spacer
SO16GT-3.8mm
Order Number: (Tin-Lead)
Quantity
Per Kit
1
2
1
6
6
5
3
2
2
2
4
1
PC013-RK
PC013-RK-LF
IPC 9850 Attribute Defect Rate Kit
IPC 9850 Kit
Attribute Defect Rate Kit checks out pick and place machines.
IPC-9850 includes test methods for determining various SMT placement
equipment attributes, including repeatability, accuracy and attribute defects. Each of these tests requires specific material and this new test board
and kit from Practical Components provides the solution for conducting
the attribute rate defect testing. The applicable section from IPC-9850
is 4.1, where attribute defects are
defined as components placed upside
down, tombstoned, on side, missing
or extra part, damaged lead(s), damaged part(s), completely off land, or
wrong polarity. Testing requires the
placement of 88,000 components on
20 boards to attain reasonably accurate test results. Practical Components
9850 Kit will provide you with enough
components and boards to meet this
guideline. While IPC-9850 requires the
placement of components on sticky
tape (included), these boards can
also be printed with solder paste and
reflowed.
IPC Compliant
PCB014 Board
Each board contains the lands
(multiple orientations) for 4,400
components (440 SOT23s, 440 SO8s,
880 0603SMCs, 880 0603 SMRs, 880
0402SMCs and 880 0402SMRs). Test
material is available from Practical as
single boards or complete kits with all
the necessary dummy components.
On request, this board comes with
demonstration versions of CircuitCAM
and CheckPoint manufacturing software, ready-to-run CircuitCAM Project
Files (CPFs) and Gerber and X, Y Theta
data at no extra charge.
PC014 Kit (IPC 9850)
Part Description
SOT23-TR
SO8GTR-3.8mm
0402SMC-PA
0402SMR-PA
0603SMC-PA
0603SMR-PA
Sticky Tape
PCB014
Kit Order Number:
Quantity Per
5 Kits
3,000
2,500
10,000
10,000
8,000
5,000
1 Roll
5
PC014-0-05
Quantity Per
10 Kits
6,000
5,000
10,000
10,000
12,000
10,000
2 Rolls
10
PC014-0-10
Board size: 11" x 11", .062" thick. High Temp 170Tg board
material. Standard board finish is HASL.
Quantity Per
20 Kits
12,000
10,000
20,000
20,000
20,000
20,000
3 Rolls
20
PC014-0-20
Notes


Gerber Data and X, Y Theta Data are available, if required, at no charge.
99
Rework Kits
REVISED
PC015 Rework Kit Conforms to IPC 7711/7721
Standards for reworking.
The PC015 Kit is ideal for rework training or evaluating current rework
procedures. This kit contains 2 fully populated boards and replacement
components to enable removing and replacing ½ of the components.
Reworked solder joints can then be visually compared to original solder
joints (on components not reworked) on the same board. Kit includes 2
boards which allows one to be used practice and one to be used evaluation. This kit conforms to the IPC 7711 and 7721 standards for rework-
PCB015 Board
[Rev. B]
Kit is available with Lead-Free and
Tin/Lead components!
ing. It contains a wide range of components from Through-Hole to Chip
Scale. Each kit is conveniently boxed with the replacement components
individually bagged and labeled for easy identification. Forget looking for
scrap boards for training purposes. Tin-Lead and Lead-Free components
available.
This kit is perfect for classroom settings and can also be ordered unassembled as a standard hand solder.
IPC Compliant
Available as a
Single Pack Kit
Contains boards populated
with components.
Standard board finish is
HASL or Immersion Silver. IS410 board material
Board size:
3.5" x 5.5"
PC015 Rework Kit Assembled
PC015 For Hand Assembly Kit
Part Description
Quantity Per Kit
Part Description
Quantity Per Kit
PCB015-Assembled
LQFP100-14mm-.5mm-2.0
PLCC28T
SOT23
0603SMC
0805SMC
1206SMR
SOD80
SO14GT-3.8mm
1/4-W-AR
**CK05 w/Standoff
DIP14
TO5 w/Standoff
TO18 w/Standoff
*MLF16-5mm-.8mm
*A-CABGA36-.8mm-6mm-DC
2
2
2
4
6
6
6
6
6
4
6
6
3
3
6
2
2
PC015-01
PC015-01-LF
PCB015-Standard
LQFP100-14mm-.5mm-2.0
PLCC28
SOT23
0603SMC
0805SMC
1206SMR
SOD80
SO14GT-3.8mm
1/4-W-AR
**CK05
CK05 Spacer
DIP14
TO5
TO18
TO5/18 Spacer
*MLF16-5mm-.8mm-DC
1
2
2
4
6
6
6
6
6
4
6
6
6
3
3
6
9
2
2
PC015-0-01-Std
PC015-0-01-Std-LF
Notes
n
*MLF16/CABGA36 Packages are not included in kit. Either package can
be added upon request.
n **CK05 may be substituted with Radial Mono.
100
IPC Compliant Hand Soldering Kit
PCB-J-Std Board
Tin-Lead and Lead-Free Kits Available
PCB-J-STD Board Soldering Kit Conforms
to J-STD-001E Specifications
The PC016 Mixed Technology Kit is an effective and economical way to
train and evaluate students and employees. This kit contains a variety of
standard Surface Mount and Through-Hole components with traces to
simulate real world situations. Each kit comes individually boxed with all
components bagged and labeled for easy identification. Conforms to IPC
J-STD-001E standard for soldering. In stock and ready to ship, this kit is
perfect for classroom settings.
Available as a
Single Pack Kit
IPC Compliant
Board size: 3" x 4", .062 thick, IS-410 board material.
HASL and Immersion Silver finish is available.
PC016-J-STD-E Hand Soldering Kit
PC016-J-STD-E Lead-Free Hand Soldering Kit
Part Description
Quantity Per Kit
Part Description
Quantity Per Kit
PCB016
1/4-W-AR
TO5
TO5 Spacer
DO35
CK05 *see note
CK05 Spacer
DIP16
0805SMR
1206SMR
1206SMC
SOD80
SO14GT-3.8mm
QFP100-14x20mm-.65mm-3.2
PLCC20
Turret Terminals
Bifurcated Terminals
Pierced Terminals
Hook Terminals
Gold Cup Terminals
20 Gauge Wire
22 Gauge Wire
26 Gauge Wire
2
4
4
4
4
4
4
4
4
4
4
4
2
2
2
4
4
4
4
4
3'
3'
3'
PC016-J-STD-E
PC016-J-STD-E-LF
PCB016
1/4-W-AR-Sn
TO5-Sn
TO5 Spacer
DO35-LF
CK05-LF *see note
CK05 Spacer
DIP16-Sn
0805SMR-Sn
1206SMR-Sn
1206SMC-Sn
SOD80-Sn
SO14-3.8mm-Sn
QFP100-14x20mm-.65mm-3.2mm-Sn
PLCC20-Sn
Turret Terminals
Bifurcated Terminals
Pierced Terminal
Hook Terminals
Gold Cup Terminals
20 Gauge Wire
22 Gauge Wire
26 Gauge Wire
Kit Order Number:
2
4
4
4
4
4
4
4
4
4
4
4
2
2
2
4
4
4
4
4
3'
3'
3'
PC016-J-STD-E-LF
Note
n
*CK05 may be substituted with Radial Mono.
J-STD-001E is world-recognized as the sole industry-consensus standard
covering soldering materials and processes. This revision now includes
support for lead free manufacturing, in addition to easier to understand
criteria for materials, methods and verification for producing quality
soldered interconnections and assemblies. The requirements for all three
classes of construction are included. Full color illustrations are provided
for clarity. This standard fully complements IPC-A-610E.
60 pages—Released February 2005.
101
Terminal and Wire Kit
The WTK-1 Kit includes everything needed to train and practice your wire
soldering skills. This kit contains three different gauges of wire and five
styles of terminals representative of what is available in the marketplace.
Our kit also comes standard with a Terminal Holder. This reusable tool
safely holds terminals during wiring and soldering operations. Terminals
will fit snug in holes of the TH1 when the holder is new. The holes are
intentionally slightly undersized to all for expansion with use. Each kit
comes individually packaged with all components bagged and tagged for
easy identification. Perfect for classroom settings.
.078 Dia.
Hole
.112 Dia.
0.46
0.75
.187 Dia.
.112 Dia.
.250
.460
.145 Dia.
.025 .114
.145 Dia.
WTK-1 Kit
Part Description
TB01 — Terminal Holder
Turret Terminal
Bifurcated Terminal
Hook Terminal
Pierced Terminal
Cup Terminal
22 Gauge Wire
20 Gauge Wire
26 Gauge Wire
Quantity
Per Kit
1
5
5
5
5
5
3'
3'
3'
TB-01 Terminal Holder
Order
Number
11229
11228
11224
11227
11226
11301
16163
16164
16162
Turret Terminal
.587
.047
.313
.178
.125 Dia.
.155
.089 Dia.
Hook Terminal
.147
.062 Dia.
Hole
Bifurcated Terminal
.076 Dia.
Hole
.104 Dia.
Kit is available without terminal holder.
.312
.718
Single Pack Kit
Pierced Terminal
.1.33
No
Knurl
.025
.070
Available as a
12° Ref
R.060
.170
Note

.050
.239
2.58
.020
.063
Round
Gold Cup Terminal
Measurements are in inches.
102
2.85
3.00
.425
IPC/WHMA-A620 Wire Harness Kit
Compliant Wire Harness Kit
The New A620 kit from Practical Components is designed
to help companies meet industry standards for cable and
wire harness assembly criteria. The A620 kit enables hands
on training in the following areas of wire harness assembly.
Wire preparation, soldering to terminals, ultrasonic welding,
splicing connectors, molding, marking coax/twinac cables
with terminations. The A620 kit comes with the recommended
materials and tools required to become proficient with the
IPC/WHMA-A-620 standard. Each kit is individually packaged
with all items labeled.
Please call 714-252-0010 for additional information regarding
this kit.
103
Lead-Free Process Capability Validation Kit
Cookson Electronics Lead-Free Process
Capability Validation Program
Practical Components and Cookson Electronics are teaming up to offer a
new Lead-Free Process Capability Validation Program. This program consists of lead-free components and test boards from Practical Components,
with Cookson Electronics’ analytical evaluation and process capability
validation services to the IPC and J-STD requirements.
Definition of Cookson Electronic Materials Included
The CE Analytics Test Kit consists of: PCB test boards with IS-410
laminate, various lead-free compatible pad finishes (ENTEK® PLUS™ CU106A-HT and Alpha-LEVEL™ Immersion Silver), industry standard lead-free
components, ALPHA™ OM-338 (M13) lead-free solder paste and ALPHA™
Telecore + cored wire, and process application guidelines.
Alpha-LEVEL™ is an immersion silver finish applied to circuit board solder
pads that develops a dense uniform silver deposit and provides excellent
Pb free soldering, reliability, and contact resistance.
The CE Analytics laboratory services include:
1. Lead-Free Process Capability Validation, comprised of:
Macro and microscopic inspection and analysis of processed assem-
blies compared to IPC and J-STD requirements.
Validation Report with recommendations for process optimization,
if applicable
CE Analytics Lead-Free Process Capability Validation Certificate.
2.Voiding Analysis
3.Macroscopic Examination of Processed Assemblies (non-destructive)
4.Microscopic Examination of Solder Connection Integrity.
Draw on CE Analytics expertise to validate your lead-free process
capabilities. You can reduce the cost, time, and worry associated with
converting to lead-free by using the new CE Analytics Lead-Free Process
Capability Validation. It is an easy three-step procedure:
1. Order the CE Analytics Lead-Free Test Kit, which includes boards, materials and components to set up and run a lead-free SMT, Thru-Hole, Mixed
Technology or Rework process.
2.Order a service package from CE Analytics and send in your processed
boards. In return, you will receive a detailed laboratory analysis, report,
recommendations for optimization if applicable, and a Lead-Free
Process Capability Validation Certificate.
3.Run your lead-free process with confidence.
For More Information
For more information concerning price, delivery and how to order
the new CE Analytics Lead-Free Process Capability Validation go to
www.alphametals.com/lead_free/validation.html or contact Cookson
Electronics at 1-877-664-6263. To contact your Practical Components sales
representative about the CE Analytics Lead-Free Test Kit call 714‑252‑0010
or check our web site www.practicalcomponents.com.
104
IS-410 is a CAF resistant, lead-free assembly compatible laminate and
prepreg system that is ideal for high-density designs requiring multiple
soldering steps. IS-410 materials contain a unique resin technology that
offers exceptional IST thermal performance and reliability.
ALPHA® OM-338 (M13) is a broad latitude lead-free solder paste providing the lowest cost of ownership proven through a wide print process
window performance, ultra-fine pitch printing capability (0.25mm circles
and 0.4 mm pitch components) and excellent voiding resistance exceeding IPC7095 Class III standards.
ALPHA® Telecore Plus is a low residue core solder wire designed for
no-clean soldering applications that must meet all appropriate Bellcore
specifications. The unique blend of rosin and proprietary activators
provides rapid wetting while leaving minimal, optically clear, completely
inert residue.
Electroless Nickel/ Immersion Gold (ENIG) is a leading immersion finish
delivering excellent coverage, uniformity and mechanical strength for
good solderability. Low temperature operation allows for good solder
mask compatibility. The finish has a long shelf-life and can withstand
multiple thermal cycles.
ALPHA® CUT Laser Cut Stencils are designed and manufactured to
provide the ultimate stencil printing performance for most surface mount
requirements, particularly when used in conjunction with ALPHA® Solder
Pastes or ALPHA® Surface Mount Adhesives. The stencils are manufactured
using a CAD/CAM driven high precision XY-laser cutting process.
Order Numbers
Stencils are sold separately as follows:

For PCB030 board design:
Order Number: 82632 (29" x 29" size, 5mil thick)
n
For PCB031 modified board design:
Software
Data Files and
Includ
With All Kit ed
s!
Lead-Free Process Capability Validation Kit
Board Design Revised To Include
Through-hole Components.
PCB031 Cookson Lead-Free Validation Board
PCB031 PC Board Chart
PCB Board (optional–customer to choose board finish)
PCB031-ENTEK (CU-106A-HT)
PCB031-AlphaLevel (Immersion Silver)
PCB031-ENIG (Electroless Nickel/Immersion Gold)
PC031 Cookson Lead-Free
Capability Validation Kit
Part Description
PCB031
0201SMR-Sn
0402SMR-Sn
0603SMR-Sn
0805SMR-Sn
1206SMR-Sn
1210SMR-Sn
SOT23-Sn
.200" Radial Mono Cap
SO16GT-3.8mm-Sn
SO20GT-7.6mm-Sn
PDIP16T-Sn
1/4-W-AR-Sn
TO-5-Sn
QFP256-28mm-.4mm-Sn
QFP100-14x20mm-.65mm-Sn
A-PBGA256-1.0mm-17mm-SAC305
A-PBGA208-1.27mm-23mm-SAC305
A-LQFP100-14mm-.5mm-Sn
SOD80-Sn
A-CABGA36-6mm-.8mm-SAC305
A-MLF48-7mm-.5mm-Sn
Kit Order Number:
Quantity
Per 24 Kits
24
1,250
1,000
1,000
1,000
1,000
500
500
120
72
24
72
240
96
24
24
24
24
24
250
24
43
PC031-0-24
Board size: 3.875" x 5.375".
Order Number: PCB031 (board only—customer to specify board finish upon
order. See PC board chart.)
Notes
* See PC board chart above to specify board finish.
Gerber Data and X,Y Theta Data are available if required at
no charge.
 Digitized files provided by Aegis Software.
 All parts included in kit are lead-free.
 Laminate board material is IS-410.
 2-layer (.062" thickness).
 Finishes available: ENTEK® CU‑106A-HT, Alpha Level Immersion
Silver and ENIG (Electroless Nickel over Gold).


Notice:
A limited number of PC030 SMT kits and boards are available.
Please call for availability.
105
Traceability & Control Validation Kit
Practical Components and Aegis Industrial Software, the leader in Manufacturing Information Management Systems, have partnered together to
offer a traceability and control kit designed to validate your entire manufacturing process and provide the potential for rich product and process
traceability detail.
Traceability and process control are no longer requirements reserved
for manufacturers in regulatory or specific market segments. Today, all
manufacturers who aspire to achieve or to maintain a ‘world class’ status
must deliver some degree of traceability. Until now, there has not existed
a common language regarding the nature of traceability or its levels. Nor
was there a means to benchmark such capability or to communicate its
nature to customers or regulatory agencies in a common manner.
The new Traceability & Control Validation Kit provides the physical materials and the procedural guide to determine your factories traceability and
control capability, and then rate the results in a formalized matrix. These
ratings can be used to demonstrate your capabilities, communicate to
customers or auditors, or to provide a start point on a path to improve
your capabilities and track progress along the way.
Benchmark Your Traceability and Control
Rate your traceability and control far beyond simple component traceability. Using the procedural guide and materials provided in this kit,
a manufacturer can test and validate two key elements of traceability;
control mechanisms to assure process execution is proper even under
high-change conditions, and the resultant reporting scope and depth
their traceability systems will deliver. This dual approach of validating
process control and visibility yields a comprehensive assessment of
your capabilities.
Communicate Your Capability
Manufacturers all over the world have been searching for a way to convey
to their customers or auditors their traceability capability. In the past, it
has been impossible without a common rating system or even a generalized agreement on the maximum range of what traceability entails. One
party may believe traceability is simple lot traceability of components
while another may include all quality, test, packaging and machine data
feeds from the entire process.
The purpose of this kit is to produce a common rating on the scale from
simple traceability to the very advanced. The scale can then be used to
communicate your capabilities in a uniform manner to those who require
this information.
Improve What You Measure
The rating scale will also help manufacturers who are continuously
looking for ways to improve their factory operations. Through uniformed
measurements, a roadmap can be developed to improve your plant to
even greater levels of traceability. By measuring your abilities today, this
kit can help create a defined path to the future.
106
Technical Basis
As the only solution provider of information systems delivering such
scope of control and traceability, Aegis has the unique technical experience to deliver such a kit in conjunction with Practical Components. Aegis’
methods of rating traceability have been concurrently developed with,
and adopted by, many of the leading manufacturers in the industry. Now
your enterprise can benefit from over 6 years of definition and usage in
factories all over the world to rate your systems and processes against this
scale.
Use this Kit’s Materials and Procedural Guide to Determine Your
Traceability and Control Capability in the Following Categories:
Traceability Validation
Production and Release Authentication History
Process Documentation History
Consumable Lots Used at Every Process Step
Tooling ID’s Used at Every Process Step
Component Lot Traceability From Automated Mounters
Component Lot Traceability From Hand Insertion
PCB Panel and Image Record Integrity
Route History and Cycle Rate
Operator ID at Every Process Step
Process and Product Content Deviation Notices
Pin, Component and Product Quality Indictment/Diag./Repair
Test and Measurement Records
Parametric Data Records
Machine Events and Alarms
Box-Build Genealogy
Packaging and Shipment Genealogy
Process Control Supporting Proper Traceability
Assured Identifier Acquisition on Conveyorized Line
PCB Panel to Image Mapping Control
Assured Documentation and Version Dispatch to Station
Consumable Validation Line Control
Tooling Validation and Line Control
Feeder/Component Validation and Line Control
Route Sequence Enforcement
Packout Control
Traceability & Control Validation Kit
PC009-40 Traceability & Control Validation Kit
Part Description
0603SMR-TR
0805SMR-TR
1206SMR-TR
6032SMTA-TR
*A-PBGA256-1.27mm-27mm-DC
PLCC44
PLCC68
QFP208-28mm-.5-2.6mm-DC
QFP44-10mm-.8mm-3.2
SO16GT-3.8mm
SOD80-TR
SOT23-TR
5 x 11 Axial Electrolytic
CK05
DIP16T
DO35
TO5
PCB009-Aegis-ImAg
Kit Order Number:
Quantity
Quantity Per Kit
Per Board
(10 Panels)
20
800
20
800
20
800
10
400
1
40
1
40
1
40
1
40
1
40
1
40
4
160
10
400
10
400
5
200
5
200
2
80
5
200
4
160
5
200
5
200
4-up array
40 boards
PC009-40-MES-ImAg
*Customer to choose between CABGA36 vs. PBGA256 upon order. Board
material is IS-410 with ImAg finish.
An identification label containing barcode details are found on each reel,
tray, and tube, providing knowledge of incoming material Part Description relationships. The label includes an AGI (Aegis Global Identifier)
that serves as a unique identifier for each material instance. Below is
an example:
PC009-40 Traceability & Control Validation Kit
The PCB009 board is presented in a rotated 4-up panel to address the
challenges of multi-up assemblies for surface mount and through-hole insertion processes. Both the panel and each image is directly laser marked*
with a barcode for serial identification. Barcode labels are also included
with the kit. Use of this panel provides for:
n
Establishing Panel ID-to-Image ID relationships
Proofing WIP tracking and Route Enforcement
n Proofing Graphic Defect Collection and Repair
n Verifying Circuit Image Ordering Across Machines
n Verifying Placement Accuracy on Rotated Images
n
Note: A sample iServer database that contains a fully defined PC009
assembly example is available to existing Aegis customers with
FUSION systems.
Global Technology Award
Aegis received the Global Technology Award,
sponsored by Global SMT & Technology.
The kit also includes the following items to support the control and
validation processes:
n
Guide for performing validation steps
Adhesive labels for each board and panel
n Label files for use with Dymo Label Writer printers
n Sample ECN/Deviation notices in PDF format for validating change
notification processes
n Additional material labels with AGI numbers for affixing to tooling , consumables and other materials that require validation in
order to build product
n
*Laser marking services provided by Conveyor Technologies Incorporated
(CTI). CTI Systems is a leading manufacturer of SMT connecting conveyors
and peripherals, including label and laser marking solutions.
Tel: (919) 776-7227
www.conveyor-technologies.com
107
Jabil Selective/Wave Solder
Practice Test Vehicle
The new Jabil Selective/Wave Solder practice test vehicle PCB boards and
kits are used for wave solder machine setup and evaluation. The JABIL/
WS board assists in identifying the impact of critical parameters for the
development of a reliable, robust lead free wave or selective soldering
process as well as determining the process that achieves the optimized
soldered joint.
The critical aspects of the selective/wave soldering process can be broken
down into several categories which include component reliability, board
reliability, flux type and specifications, alloy and alloy composition, equipment capacity and power, etc.
Call your knowledgeable Practical Components Technical representative
for additional information. 714-252-0010
Notes
n
Board size: 8.00” x 10.40”
n 12-layers
n 0.125 “ thick
n Alloy and flux evaluation
n Board finish evaluation
n Design: Pin to hole evaluations, pad evaluation
n Defect reduction analysis
n Determine optimum set of parameters to achieve maximum wetting
and hole fill
n Cleaning evaluation, residue compatibility with ICT, cleaning process
parameters
n Pallet development
Jabil Solder Paste Evaluation
Board and Kit
Practical Components continues to offer high technology solder paste
evaluation kits. The new Jabil Solder paste evaluation test board and
components is the most recent example.
This kit can be used to evaluate new solder paste and its performance
for stencil printing and reflow characteristics. The kit can also be used to
evaluate the compatibility with wave and rework chemistries. Other uses
include ICT probability, comparison studies with different types of solder
pastes, as well as internal development and evaluation. Practical will
continue to offer new exciting evaluation kits to serve all aspects of the
electronic manufacturing industry.
Notes
Jabil SP Evaluation Kit #1
Order Number 12853
(50) Jabil Test Boards
(360) A-MLF68-10mm-.5mm-DC-Sn-TR
(2) Jabil Test Board Stencils
Jabil SP Evaluation Kit #2
Order Number 12854
(100) Jabil Test Boards
(360) A-MLF68-10mm-.5mm-DC-Sn-TR
108
SMT/PTH
Mixed Technology Pb-Free Kit
Indium Corporation SMT/PTH Mixed Technology Pb-Free Kit Practical
Components and Indium Corporation are introducing a new Lead-Free
SMT/Through-hole Mixed Technology test board and kit. The PCB049
Board can be used to evaluate the following conditions:
PCB049 Board
Solder paste wetting and spread.
Solder paste slump performance.
 Solder perform Pin-in-Paste
performance.
 Wave flux hole fill performance.
 P&P equipment and placement
accuracy.
 Reflow process capabilities.
 Effectiveness of cleaning processes.
 Surface Insulation resistance (SIR).
 Surface finish interaction factors.
 Pb-Free Underfill performance.


Board size: 8" x 12", FR4 170Tg board material.
Standard board finish is ImAg.
PC049 Indium Lead-Free Kit
Part Description
A-PBGA256-1.0mm-17mm-DC-LF
LQFP64-7mm-.4mm-2.0-DC-Sn
A-QFP208-28mm-.5mm-2.6-DC-Sn
A-QFP100-14x20mm-.65-3.9-DC-Sn
A-SSOP20T-5.3mm-DC-Sn
A-SO16GT-7.6mm-DC-Sn
A-PLCC68T-DC-Sn
0201SMR-PA-0-Sn
0402SMR-PA-0-Sn
0603SMR-PA-0-Sn
1206SMR-PA-0-Sn
A-PDIP20T-7.6mm-DC-Sn
A-DIP16T-7.6mm-Sn
0805SMR-PA-0-Sn
1/4W-AR-Sn
TO5-Sn
Kit Order Number:
Quantity Per
24 Kits
48
48
48
48
72
72
48
1,200
3,000
3,000
2,000
144
24
1,000
168
96
PC049-0-24-LF
Order
Number
31071
31016
31120
31014
30682
16081
30597
19511
16069
16070
16047
30737
31036
16071
12003
16743
For details on evaluation techniques and material performance requirements, contact Chris Anglin of Indium Corporation at 1-800-4-INDIUM or
[email protected].
For complete information this kit or other Lead-Free solutions please
contact your Practical Components representative at 1-714-252-0010.
Software
Data Files and
Includ
With All Kit ed
s!
109
CircuitMedic
115-1322 Epoxy Kit
201-2100 Professional Repair Kit
This kit contains 10 packages of clear, low viscosity, superior strength
epoxy, precisely measured out into two-compartment plastic packages so
it’s easy to use and there’s no measuring.
The Professional Repair Kit is the most complete and most versatile circuit
board repair kit you’ll find anywhere. It’s the total package.
Once cured, this epoxy makes an effective electrical insulator with good
high temperature mechanical and impact resistance properties. The epoxy can be used to fill in holes, gaps, burns or to inject into delaminated
locations. The kit also contains mixing sticks, mixing cups and foam swabs.
The kit includes dry film, epoxy-backed circuit frames, and unique replacement circuits that do not use messy liquid epoxy. Includes eyelets and setting tools for plated through hole repair, Circuit Tracks to repair damaged
circuits, epoxy and color agents for solder mask or base board repairs, and
a comprehensive manual all packaged in a convenient carrying case.
If you need to repair damaged circuit boards, the all-in-one Professional
Kit is what you need.
Applications
Kit contains 10 packages of clear, low viscosity, superior strength epoxy,
precisely measured out into two-compartment plastic packages so it’s
easy to use and there’s no measuring.
n Surface Mount Pad Repair
n BGA Pad Repair
n Land Repair
n Edge Contact Repair
n Conductor Repair
n Plated Hole Repair
n Base Board Repair, Epoxy Method
n Base Board Repair, Edge Transplant Method
n Coating Replacement
n RoHS Compliant
n RoHS Compliant
nApplications
n Base Board Repair, Epoxy Method
n Base Board Repair, Edge Transplant Method
n Coating Replacement, Solder Mask
Practical Part Number: 19029
Professional Repair Kit is packaged in an ESD safe carry case
110
CircuitMedic
110-4102 Micro Drill System
201-3140 Plated Hole Repair Kit
Micro-Drill is a workhorse in a kit. This versatile powerhouse is ideal for
milling, drilling, grinding, cutting and sanding circuit boards. It removes
coating, cuts circuits, cuts leads, drills holes, cuts slots, shapes FR4 and
performs many other procedures using various interchangeable bits.
Here are all the tools and materials you’ll need to repair damaged plated
through holes in circuit boards.
Unlike most hand-held tools, the Micro-Drill has a tiny, high speed DC motor in the hand piece, eliminating bothersome drive cables and giving the
technician better control. A separate power supply keeps the hand piece
lightweight and reduces fatigue. Power is supplied by a panel switch or
foot switch for ease of use.
Application
n Multipurpose machining, grinding, and cutting for circuit board repair and rework.
The kit includes a variety of eyelet sizes, carbide ball mills for drilling, and
setting tools to form the eyelets conforming to IPC guidelines. Eyelets
are made of pure copper electroplated with solder. Eyelet tooling is
hardened steel.
Application Notes
n Plated Hole Repair, No Inner Layer Connection
n Plated Hole Repair, Double Wall Method
n Plated Hole Repair, Inner Layer Connection
n RoHS Compliant
Practical Part Number: 19513N
The Micro-Drill is ideal for precision circuit board grinding and
cutting operations.
111
Soldering Aids
Tools for the Latest Developments in Component
and Assembly Technologies
1 MilProbes for Ultra Fine Pitch Rework—
BGA, Flip Chip, TAB, COB, etc.
The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape
stainless steel handle. The Micro-tip is tapered to a one mil diameter tip
for TAB, BGA, and other ultra fine pitch rework. The tip is either straight
(SH-341) or 50º angled at 5 mil from the point (SH-316). The different tip
geometry allows the tips to reach between all circuit leads and traces
under a microscope.
Soldering Aid Kits
These Beau Tech kits contain the most popular tools. The vinyl cases keep
the tools clean, handy, and safe from damage. The clear vinyl front allows
easy selection of the tool to be used. The kits will also keep your bench
more organized. Selection of a kit denotes a true crafts person and seeker
of value.
Two-Piece Fine Pitch RocHard 10 MilProbe Kit
Kit Contents
SH-241, 10 MilProbe
SH-216, 10 MilProbe
 Teflon Tip Protectors
 Vinyl Case


Order Number: SH-222
(Minimum Order: 1)
Four-Piece TH/SMT RocHard 25 MilProbe Kit
Kit Contents
I MilProbe (SH-316) cleaning 3 mil pitch TAB substrate.
SH-116, 25 MilProbe
SH-117, 25 MilProbe
 SH-123, 25 MilProbe
 SH-141, 25 MilProbe
 Vinyl Case


Order Number: SH-125
(Minimum Order: 1)
Overall dimensions of the 1 MilProbe,
straight and angled version.
Available Models: SH-316 (50º Angled)
SH-341 (Straight)
SH-322 (Kit including both SH-316 and SH-341)
Six-Piece Standard/Miniature Soldering Aid Kit
The probe tip is strong and long lasting since it is made of special,
proprietary alloy to achieve maximum strength.
 The hex shape stainless steel handle provides a easy grasp of the tool
when operating under a microscope. It also prevents the tool from rolling on the work bench.
 To further increase the comfort of using the tool, a foam sleeve that
goes onto the handle is available as an optional part.
 The 1 MilProbe comes with a protection cap and a vinyl pouch. The cap
keeps the tip from damage and keeps the operator from injury. The
pouch provides additional protection to the tip and provides a convenient way of storing and carrying the 1 MilProbe.
Standard Aids

MilProbe Selection Guide
A = 1 MilProbes, B = 10 MilProbes, C = 25 MilProbes
Application
Pitch Size
2-10 mil
10-15 mil
15-25 mil
25-30 mil
30+ mil
Through-Hole
Testing Solder Joint &
Wire Bonding Strength
A
A, B
B
B, C
C
C
Straightening Leads & Wires
A
A, B
B
B, C
C
C
Cleaning Leads & Traces
Applying Epoxy
A
A
B
B
C
C
A
A
B
B
C
C
Kit Contents
SH-20A Straight Flat Reamer/
Straight Fork Tip
 SH-20B Angled Flat Reamer
Reamer/Straight Fork Tip
 SH-20K Stainless Steel Brush/
Beveled Scraper Blade

Miniature Aids
SH-20C Straight Flat Reamer/
Straight Fork Tip
 SH-20D Angled Flat Reamer Reamer/Straight Fork Tip
 SH-20G Stainless Steel Brush/Beveled Scraper Blade
 Vinyl Case

Order Number: SH-120 (Minimum Order: 1)
The new inspection mirror meets clean room requirements yet is
sufficiently economical for non-clean room.
112
Soldering Aids
Orange Sticks
Double Beveled Ends (7" x 5/32")
Beau Tech orange sticks are
made of high quality nonresin wood which will not
contaminate solder and component leads. Natural wood
is among the best material
that does not generate static
charge, thus is safe to use in
any ESD sensitive area. They
are effective, yet inexpensive
tools coming in packages of 100.
Applications
Use to position and hold Through-Hole and Surface Mount components
for soldering and desoldering.
 Use to bend component leads.
 Use to guide wire on the board.
 Use to break solder bridges.
 Use to probe for loose components.

ESD SAFE
Order Number: SH-83 (Package of 100)
Package of 100
40-%&3*/("/%3&803,803,45"5*0/4)"/%500-4'6.&&953"$5*0/
5"4,-*()5*/(*/41&$5*0/&26*1.&/5."5&3*"-)"/%-*/(&26*1.&/5&4%
4611-*&4803,45"5*0/4"/%$0/46."#-&4
Practical Tools Inc.
64"
13"$5*$"-500-4*/$
/0&-45
USA
-04"-".*504$"њ
10762 Noel St.
"7*--*("/ў13"$5*$"-500-$0.
Los Alamitos, CA 90720-2548
Phone: 714-252-1192
1)0/&њњ
Fax: 714-252-0026
'"9њњ
[email protected]
.&9*$0
13"$5*$"-500-44%&3-%&$7
$"--*&+0/5&33";"4/0*/5#
$&/530*/%6453*"-0/*9
Costa Rica
5*+6"/"#"+"$"-*'03/*"
Calle 22, Ave. 3 y 5 #351
3'$15./8
San Jose Costa Rica
&4"/5"/"ў13"$5*$"-500-$0.
Office Phone (506) 2223-0371
Office Fax (506) 2258-5234
1)0/&юяњ
'"9юяњ
[email protected]
XXXHPQSBDUJDBMUPPMTDPN
www.practicaltool.com
113
Flextac™ BGA Rework Stencil Kit
includes 20 different sizes of BGA
rework stencils, a spatula handle
and three sizes of spatula blades.
There are a total of 40 stencils in kit
(2 stencils per type). Replacement
blades are available (see tool kit list
for order number).
If you’ve been using metal stencils for BGA rework, we have some great
news for you. Flextac™ BGA Rework Stencils…a creative new product that
is a major improvement over what you may be using now. These flexible
solder paste stencils are laser cut from high quality, anti-static polymer
film with a residue-free adhesive backing. Because they are self-sticking,
no tape or fixturing is needed. The adhesive seals around each BGA pad
to prevent solder paste from bleeding under the stencil when the paste
is applied. Flextac™ Stencils are easy to use and leave no residue on the
board surface.
Current BGA rework stencils are fabricated from metal and require fixturing or taping to position them and hold them in place. Metal stencils
warp easily, and if the circuit board has undulations in the board surface,
the metal stencil will not sit flat. Since there is no gasket-like seal, solder
paste can easily bleed under metal stencils when paste is applied with a
squeegee. Also solder paste can spill out over the sides of flat metal stencils contaminating the circuit board surface. Metal stencils require tedious
stencil cleaning. To use metal stencils effectively, a high level of operator
skill is required.
To use, the operator folds the pre-scored side tabs and then peels off
the cover film from the bottom side of the stencil. The operator holds
the side tabs while placing the Flextac™ Stencil in position. If it is not
correctly positioned, it can simply be removed and repositioned. The side
tabs also serve as solder dams preventing overspill. No external taping
or fixturing is used. Next the operator applies a small dab of solder paste
and uses a standard squeegee to spread the paste. Since the residue-free
adhesive seals around each BGA pad, the operator can make as many
passes as necessary with the squeegee to assure proper aperture filling.
The Flextac™ Stencil is then peeled up leaving a perfect deposit of solder
on each pad. Although Flextac™ Stencils are disposable, they can be used
several times.
114
Application

Applying solder paste for BGA rework.
Features and Benefits
Residue-free adhesive backing seals around BGA pads to prevent solder
paste bleed.
 Laser cut ensures precise aperture size.
 Disposable—eliminates tedious stencil cleaning.
 Flexible—conforms to board surface.
 Fold-up sides for easy placement and solder paste containment.
 Low cost.
 Packaged in a handy ESD safe carrying case

Description
201-3120
Note

Custom pattern stencils are available as special order with up to 2,600
holes per stencil. Please call Practical for quotation.
Flextac™ BGA Rework Stencil Kits—each kit includes 2 stencils per ball count
PBGA
Ball Count
119
196
225
256
256
256
272
292
304
324
352
357
361
388
432
484
560
625
672
676
Part Description
B6-119-1422-127
B4-196-1515-100
B6-225-2727-150
B4-256-1717-100
B8-256-2121-127
B6-256-2727-127
B6-272-2727-127
B6-292-2727-127
B8-304-2125-127
B4-324-2323-100
B6-352-3535-127
B6-357-2525-127
B8-361-2525-127
B6-388-3535-127
B6-432-4040-127
B4-484-2323-100
B6-560-4242-127
B8-625-3232-127
B4-672-2727-100
B4-676-2727-100
Body Size
Pitch
Aperture Size
14 x 22mm
15mm
27mm
17mm
21mm
27mm
27mm
27mm
21 x 25mm
23mm
35mm
25mm
25mm
35mm
40mm
23mm
42.5mm
32.5mm
27mm
27mm
1.27mm
1.0mm
1.5mm
1.0mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.0mm
1.27mm
1.27mm
1.27mm
1.27mm
1.27mm
1.0mm
1.27mm
1.27mm
1.0mm
1.0mm
.025" (0.635mm)
.020" (0.508mm)
.025" (0.635mm)
.020" (0.508mm)
.032" (0.813mm)
.025" (0.635mm)
.025" (0.635mm)
.025" (0.635mm)
.032" (0.813mm)
.020" (0.508mm)
.025" (0.635mm)
.025" (0.635mm)
.032" (0.813mm)
.025" (0.635mm)
.025" (0.635mm)
.020" (0.508mm)
.025" (0.635mm)
.032" (0.813mm)
.020" (0.508mm)
.020" (0.508mm)
Ball Pattern
(matrix)
7 x 17 Full Array
14 x 14 Full Array
15 x 15 Full Array
16 x 16 Full Array
16 x 16 Full Array
20 x 20 P4-Row
20 x 20 P4-Row + 4x4 center
16 x 19 Full Array
26 x 26 P4-Row
19 x 19 Full Array
19 x 19 Full Array
31 x 31 P4-Row
22 x 22 Full Array
33 x 33 P5-Row
25 x 25 Full Array
26 x 26 Full Array
26 x 26 Full Array
Part Description Description
Pitch
B6-119-1422-127
Stencil Thickness
in Mils
Ball Count
Body Size
Hand tools included in kit
Part Description
Description
115-3514
115-3502
115-3504
115-3506
115-3508
Spatula (1 piece)
Squeegee Blade Handle (1 piece)
Squeegee Blade—12mm (1 piece)
Other PBGA stencils available (not included in kit)
Each item includes set of 10 stencils which depends on part number
Part Description
B6-208-2323-127
B6-241-2323-127
B4-324-1919-100
B6-420-3535-127
B8-475-2532-127
B6-540-4242-127
B6-552-2525-100
B8-624-3232-127
B4-1156-3535-100
PBGA
Ball Count
208
241
324
420
475
540
552
624
1,156
Body Size
Pitch
Aperature Size
23mm
23mm
19mm
35mm
25 x 32mm
42.5mm
25mm
32.5mm
35mm
1.27mm
1.27mm
1.0mm
1.27mm
1.27mm
1.27mm
1.0mm
1.27mm
1.0mm
.025" (0.635mm)
.025" (0.635mm)
.020" (0.508mm)
.025" (0.635mm)
.030" (0.762mm)
.025" (0.635mm)
.025" (0.635mm)
.032" (0.813mm)
.020" (0.508mm)
Ball Pattern
(matrix)
17 x 17 P4-Row
18 x 18 Full Array
26 x 26 P5-Row
19 x 25 Full Array
32 x 32 P5-Row
24 x 24 Full Array
25 x 25 Full Array
34 x 34 Full Array
115
International Distributors
Australia / New Zealand
OnBoard Solutions Pty Ltd
4 Nymboida Steet
Coogee NSW 2034
Sydney, Australia
Tel :+61 (0)2 9695 1030
Fax: +61 (0)2 9695 1944
Contact : Peter Ruefli
Brazil
New Horizon Comercial
Rua James Holand, 380 - Barra Funda
Sao Paulo, SP 01138-000
Brazil
Tel: +55 11 31868181
Fax: +55 11 31868182
Contact: Maria Fernanda
China
Kasion Automation Limited
Website: www.kasion.com
Hong Kong Office
Suite 1204, 12/F,
Nanyang Plaza, 57 Hung To Road,
Kwun Tong, Kowloon, Hong Kong
Tel: (852) 2515 1268
Fax: (852) 2515 1175
Shanghai Office
Suite 1301, Xu Hui Commercial Mansion,
168 Yude Road,
Shanghai 200030, P.R.C.
Tel: (86) 21-6426 0711 or 6426 0712
Fax: (86) 21-6426 0713
Shenzhen Office
Room 308,
Futian Tianan Hi-Tech Venture Park Tower A
Tianan Cyber Park, Futian District,
Shenzhen 518041, P.R.C.
Tel: (86) 755-8389 7068
Fax: (86) 755-8389-8028
SZ Demo Centre
Suite 1821, Changping Commercial Blding
99 Honghua Road
Futian Free Trade Zone
Shenzhen 518038, P.R.C.
Tel: (86) 755-8359 0018
Fax: (86) 755-8359 2281
Tianjin Office
Suite 8-503, Hong Da Apartment,
Hebei Road
Tianjin 300451, P.R.C.
Tel: (86) 22-6628 8541
Fax: (86) 22-6628 8541
Eastern Europe
(Covering countries i.e. Latvia, Lithuania, Estonia, Belarus, Czech
Republic, Slovakia, Poland and Russia)
Production Solutions Sp. z.o.o.
ul. Marka Hlaski 18
05-410 Jozefow
Poland
Tel: +48 22 353-6324
Fax: +48 22 353-9024
Contact: Robert Jaworski
Website: www.psinter.com
Finland
Prodi Oy
Valakkatie 2
00780 Helsinki
Finland
Tel: +358 207 439439
Fax:+358 207 439430
Contact: Lauri Lehtinen
Website: www.prodi.fi
France
Teknis France
11, Av Des Marronniers
BP 85
78152 Le Chesnay Cedex
France
Tel: +33 1 3923 8400
Fax: +33 1 3963 3421
Contact: Philippe Guillaume
Website: www.teknisfrance.com
116
Germany
AAT Aston
Konradstrasse 7
90429 Nurnberg
Germany
Tel: +49 9 11 3266-0
Fax: +49 9 11 32 66 299
Contact: Dana Girstl
Website: www.aston.de
India
Practical Components Mktg. Svcs.
51 Bukit Batok Crescent
#06-18 Unity Center
Singapore 658077
Tel: +65 65335669
Fax: +65 65336010
Contact: David Koh
Ireland
Production Equipment Ltd.
Riverside Commercial Estate
Galway
Ireland
Tel: 00353 91 745100
Fax: 00353 91 751299
Contact: Monica Markovic
Website: www.productionequipment.ie
Israel
Nortec International
4 Hamelacha St.
Industrial Zone
Ra’Anana 43100
Israel
Tel: +972 9 7486277
Fax: +972 9 7486270
Contact: Kobi Shterenberg
Website: www.nortec.co.il
Italy
Ramos
Via Camillo de Nardis 49
80127 Napoli
Italy
Tel: +39 081 5609081
Fax: +39 081 5609416
Contact: Michele Moscati
Website: www.ramos.it
Japan
Nissho Musen
2-13-1 SOTOKANDA
Chiyoda Ku, Tokyo
101-0021 Japan
Tel: +81 3 3255 6691
Fax: +81 3 3255 6602
Contact: Mr. Aoki
Website: www.nmk.co.jp
Korea
T.S.S.C..
3-4, Jangmi-ro 148 beon-gil,
Bundang-gu, Seongnam-si,
Gyeonggi-do, 463-856 Korea
Tel : 82-10-3345-8410
Fax: 031-786-4090
Contact: Jae-Hee (John) Lee
Website: www.tsk.kr.com
Netherlands / Belgium / Luxembourg
PrintTec
Lingewei 57
4004 LK TIEL
The Netherlands
Tel: +31 (0) 344 570088
Fax: +31 (0) 344 571077
Contact: Robert Joosten
Website: www.printtec.nl
Portugal
Tel/Fax: +351 262598383
Mobile: +351 967126579
Contact: Marie Christine Boukhobza
Website: www.teknisfrance.com
Russia
DiPaul
23, Pr. Popova Street
St. Petersburg, 197376 Russia
Tel: +7 812 325 1478
Fax: +7 812 702 1269
Contact: Andrey Lukin
Contact: Grigory Rubtsov - sales
Website: www.dipaul.ru
Singapore / Malaysia / Indonesia
Practical Components Mktg. Svcs.
51 Bukit Batok Crescent
#06-18 Unity Center
Singapore 658077
Tel: +65 65335669
Fax: +65 65336010
Contact: David Koh
Spain
ESTANFLUX S.A.
c/Gomis 1
08023 Barcelona – Spain
Office phone : +34 93 351 6151
Tech. service phone : +34 93 408 5323
Fax : +34 93 352 38 45
Website: http://www.estanflux.es
Email: [email protected]
Sweden/ Denmark/ Norway
DESAB Elektroniksystem AB
Haradsvagen 29
14143 Huddinge
Sweden
Tel: +46 8711 7000
Fax: +46 8711 7010
Contact: Mikael Roots
Website: www.desab-elektronik.se
Switzerland
Sibalco AG
Birmannsgasse 8
CH-4009 Basel
Switzerland
Tel: +41 612 641010
Fax: +41 612 641015
Contact: Noelia Guilherme
Tunisia / Algeria / Morocco
Teknis Tunisie
Avenue Mohamed V
Boumhel el Bassatine
2097 Ben Arous
Tunisie
Tel: +216 71 451 110 /+216 71 451 229
Fax: +216 71 451 050
GSM: +216 20 319 735
Contact: Ghazali Zied
Website: www.teknistunisie.com
United Kingdom
Intertronics
Unit 17, Station Field
Industrial Estate
Kidlington, Oxon
OX5 1JD, England
Tel: +44 1865 842 842
Fax: +44 1865 842 172
Contact: JKevin Cook
Website: www.intertronics.co.uk
Portugal
Teknis Portugal
Rua Eng. Duarte Pachecco, No66
Appartado 644
2461-901 Alcobaca

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