bm23fr0.6
Transcription
bm23fr0.6
Hirose Korea Board To Board Connector BM23FR0.6-Series 1. Characteristic of Products ------------------------------------------------- 2 page 2.Specifications & Formation of Products 3.Details of Products P No. -------------------------------- 3 page ----------------------------------------------------------- 4 ~ 6 page a ii ai NO of Contacts page 1 B F **DP V 10,24,34 Pitch 0.35mm , Height 0.515mm 4~6 2 B F **D V 10,24,34 Pitch 0.35mm,Height 0.6mm 4~6 4.Reflow profile HIROSE KOREA ----------------------------------------------------------------- 7page Page1 BM23FR0.6 - SERIES 0.35mm PITCH, Board To Board CONNECTOR ■ Features HIROSE KOREA Page2 ■ ■ Specifications Current rating 0.3A Rating Operating temperature range -55°C to +85°C Storage temperature range -10°C to +60°C Operating humidity range RH 20% to 80% Storage humidity range RH 40% to 70% Voltage rating 30V AC,DC Item Specification Condition 1.Insulation resistance 50MΩ Min 100 V DC 2.Withstanding voltage No flashover or insulation breakdown 100 V AC / 1minute 3.Contact resistance 100mΩ Max 20 mV AC, 1 kHz, 1 mA 4.Vibration No electrical discontinuity of 1 µs or longer No damage or parts dislocation Frequency: 10 to 55 Hz, 5 min, single amplitude of 0.75mm, 10 cycles, for each directions. 5.Humidity Contact resistance: 100 mΩ max., Insulation resistance: 25 MΩ min. 96 hours at 40 ±2°C and humidity of 90 to 95% No damage or parts dislocation 6.Temperature cycle Contact resistance: 100 mø max., Insulation resistance: 50 Mø min. No damage or parts dislocation -55°C ➝ 5 to 35°C ➝ 85°C ➝ 5 to 35°C Time: 30 min. ➝ 10 min. ➝ 30 min. ➝ 10 min. 5 cycles 7.Durability Contact resistance: 100 mΩ max. 10 cycles 8.Resistance to Soldering heat No deformation of components affecting performance Reflow: At the recommended temperature profile Manual soldering: 350°C for 3 seconds ■ Material Product Part Material Finish Remarks Receptacle Insulator LCP Color:Black UL94V-0 Header Contacts Phosphor bronze Gold plated ------ ※ ℃ ※ ■ Odering information ●Receptacles / Headers BM 23 ## - DS - 0.35 V Serieal Name BM Serieal No. 23 Configuration FR:With metal fittings Stacking Height 0.6mm No of Contact 24 (6 TO 60) Connector style DS: Double-row receptacle / DP: Double-row Header Contact Pitch 0.35mm Termination type V(SMT Vertical mount type) HIROSE KOREA Page3 ■ Receptacles ▣ Recommended PCB layout ▣ Recommended metal mask dimensions [mm] Part Number CL No. Number of Contacts A B C D BM23FR0.6-10DS-0.35V 6644-0011-0-000 10 4.25 1.40 2.81 1.78 BM23FR0.6-24DS-0.35V 6644-0003-2-000 24 6.70 3.85 5.26 4.26 BM23FR0.6-34DS-0.35V 6644-0007-3-000 34 8.45 5.60 7.01 5.98 HIROSE KOREA Page4 ROHS YES ■ Embosssed Carrier Tape Dimensions ▣ Receptacles ▣ Reel Dimensions [mm] Part Number CL No. Number of Contacts M N P BM23FR0.6-10DS-0.35V 6644-0011-0-000 10 16 7.5 17.5 BM23FR0.6-24DS-0.35V 6644-0003-2-000 24 16 7.5 17.5 BM23FR0.6-34DS-0.35V 6644-0007-3-000 34 24 11.5 21.5 ▣ Headers ▣ Reel Dimensions [mm] Part Number CL No. Number of Contacts S T V BM23FR0.6-10DP-0.35V 6644-0004-5-000 10 12 5.5 13.5 BM23FR0.6-24DP-0.35V 6644-0002-0-000 24 16 7.5 17.5 BM23FR0.6-34DP-0.35V 6644-0005-8-000 34 16 7.5 17.5 HIROSE KOREA Page6 ■ Headers ▣ Recommended PCB layout ▣ Recommended metal mask dimensions [mm] Part Number CL No. Number of Contacts BM23FR0.6-10DP-0.35V 6644-0004-5-000 10 BM23FR0.6-24DP-0.35V 6644-0002-0-000 BM23FR0.6-34DP-0.35V 6644-0005-8-000 HIROSE KOREA F G H J 3.45 1.40 2.50 2.11 4.25 24 5.90 3.85 4.60 4.56 6.70 34 7.65 5.60 6.00 6.31 8.45 Page5 ROHS YES ■ Reflow Profile Using Lead-free Solder Paste ## 5 ℃ Max ## Temperature(℃) ℃ ## ' ## ' ## 50 Pr Pr at at tt S S rr tt 0 50 100 150 200 250 300 Time (Seconds) Recommended Application Conditions Reflow System: N2 reflow Solder: Cream type Sn / 3 Ag / 0.5 Cu Flux content 11%wt Metal mask thickness: 0.1mm Preheating time: 150℃~190℃, 90±30seconds A'=150℃~170℃ , B'=170℃~190℃ Soldering time: 250℃ Max 220℃ Min, 30~60 seconds HIROSE KOREA Page7 5 5
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