bm23fr0.6

Hirose Korea Board To Board Connector
BM23FR0.6-Series
1. Characteristic of Products
------------------------------------------------- 2 page
2.Specifications & Formation of Products
3.Details of Products
P
No.
-------------------------------- 3 page
----------------------------------------------------------- 4 ~ 6 page
a
ii ai
NO of Contacts
page
1
B
F
**DP
V
10,24,34
Pitch 0.35mm , Height 0.515mm
4~6
2
B
F
**D
V
10,24,34
Pitch 0.35mm,Height 0.6mm
4~6
4.Reflow profile
HIROSE KOREA
----------------------------------------------------------------- 7page
Page1
BM23FR0.6 - SERIES
0.35mm PITCH, Board To Board CONNECTOR
■ Features
HIROSE KOREA
Page2
■
■ Specifications
Current rating
0.3A
Rating
Operating
temperature range
-55°C to +85°C
Storage
temperature range
-10°C to +60°C
Operating
humidity range
RH 20% to 80%
Storage
humidity range
RH 40% to 70%
Voltage rating 30V AC,DC
Item
Specification
Condition
1.Insulation resistance
50MΩ Min
100 V DC
2.Withstanding voltage
No flashover or insulation breakdown
100 V AC / 1minute
3.Contact resistance
100mΩ Max
20 mV AC, 1 kHz, 1 mA
4.Vibration
No electrical discontinuity of 1 µs or longer
No damage or parts dislocation
Frequency: 10 to 55 Hz, 5 min, single amplitude
of 0.75mm, 10 cycles, for each directions.
5.Humidity
Contact resistance: 100 mΩ max.,
Insulation resistance: 25 MΩ min.
96 hours at 40 ±2°C and humidity of 90 to 95%
No damage or parts dislocation
6.Temperature cycle
Contact resistance: 100 mø max.,
Insulation resistance: 50 Mø min.
No damage or parts dislocation
-55°C ➝ 5 to 35°C ➝ 85°C ➝ 5 to 35°C
Time: 30 min. ➝ 10 min. ➝ 30 min. ➝ 10 min.
5 cycles
7.Durability
Contact resistance: 100 mΩ max.
10 cycles
8.Resistance to
Soldering heat
No deformation of components affecting
performance
Reflow: At the recommended temperature
profile
Manual soldering: 350°C for 3 seconds
■ Material
Product
Part
Material
Finish
Remarks
Receptacle
Insulator
LCP
Color:Black
UL94V-0
Header
Contacts
Phosphor bronze
Gold plated
------
※
℃
※
■ Odering information
●Receptacles / Headers
BM 23 ##
-
DS - 0.35 V
Serieal Name
BM
Serieal No.
23
Configuration
FR:With metal fittings
Stacking Height
0.6mm
No of Contact
24 (6 TO 60)
Connector style
DS: Double-row receptacle / DP: Double-row Header
Contact Pitch
0.35mm
Termination type
V(SMT Vertical mount type)
HIROSE KOREA
Page3
■ Receptacles
▣ Recommended PCB layout
▣ Recommended metal mask dimensions
[mm]
Part Number
CL No.
Number of Contacts
A
B
C
D
BM23FR0.6-10DS-0.35V
6644-0011-0-000
10
4.25
1.40
2.81
1.78
BM23FR0.6-24DS-0.35V
6644-0003-2-000
24
6.70
3.85
5.26
4.26
BM23FR0.6-34DS-0.35V
6644-0007-3-000
34
8.45
5.60
7.01
5.98
HIROSE KOREA
Page4
ROHS
YES
■ Embosssed Carrier Tape Dimensions
▣ Receptacles
▣ Reel Dimensions
[mm]
Part Number
CL No.
Number of Contacts
M
N
P
BM23FR0.6-10DS-0.35V
6644-0011-0-000
10
16
7.5
17.5
BM23FR0.6-24DS-0.35V
6644-0003-2-000
24
16
7.5
17.5
BM23FR0.6-34DS-0.35V
6644-0007-3-000
34
24
11.5
21.5
▣ Headers
▣ Reel Dimensions
[mm]
Part Number
CL No.
Number of Contacts
S
T
V
BM23FR0.6-10DP-0.35V
6644-0004-5-000
10
12
5.5
13.5
BM23FR0.6-24DP-0.35V
6644-0002-0-000
24
16
7.5
17.5
BM23FR0.6-34DP-0.35V
6644-0005-8-000
34
16
7.5
17.5
HIROSE KOREA
Page6
■ Headers
▣ Recommended PCB layout
▣ Recommended metal mask dimensions
[mm]
Part Number
CL No.
Number of Contacts
BM23FR0.6-10DP-0.35V
6644-0004-5-000
10
BM23FR0.6-24DP-0.35V
6644-0002-0-000
BM23FR0.6-34DP-0.35V
6644-0005-8-000
HIROSE KOREA
F
G
H
J
3.45
1.40
2.50
2.11
4.25
24
5.90
3.85
4.60
4.56
6.70
34
7.65
5.60
6.00
6.31
8.45
Page5
ROHS
YES
■ Reflow Profile
Using Lead-free Solder Paste
##
5 ℃ Max
##
Temperature(℃)
℃
##
'
##
'
##
50
Pr
Pr
at
at
tt
S
S
rr
tt
0
50
100
150
200
250
300
Time (Seconds)
Recommended Application Conditions
Reflow System: N2 reflow
Solder: Cream type Sn / 3 Ag / 0.5 Cu
Flux content 11%wt
Metal mask thickness: 0.1mm
Preheating time: 150℃~190℃, 90±30seconds
A'=150℃~170℃ , B'=170℃~190℃
Soldering time: 250℃ Max
220℃ Min, 30~60 seconds
HIROSE KOREA
Page7
5
5