View /

Avner Goren
Avner Goren is the GM Strategic Marketing for TI Embedded Processing Business Unit. In this role, Avner is helping shape the complete
portfolio and how it is positioned in different target market. From a product point of view this spans across Processors, Application
Processors, DSPs, Microcontrollers and Connectivity devices. Avner is also the head of IoT activities in TI.
On top of his worldwide role, Avner is also the General Manager of TI design center in Israel.
Goren holds 10 patents for chip architectures and communication systems. In recognition of great technical achievements and impact at TI,
Goren was elected as Senior Member Technical Staff.
Prior to joining TI in 2002, he spent two years as vice president of marketing and applications for Lenslet, an Israeli-based start-up company
focused on optical-based digital signal processing engines.
Before joining Lenslet, Goren spent 13 years at Motorola, where he held a number of progressively responsible positions in DSP engineering
design, DSP design management and marketing. In his final role as strategic marketing manager, he was responsible for defining product
roadmaps for the company’s DSP and PowerPC-based devices. Goren was highly involved with Motorola’s StarCore initiative, serving on its
technical board of advisors. He was also a member of Motorola’s scientific and technical society.
Microcontrollers HW/SW
considerations for low power
and real-time performance
Avner Goren
GM Strategic Marketing, Embedded Processing, TI
GM TI Israel
TI Information – Maximum Restrictions
MCU Trends
Ultra-low power
• Pushing the limits of power consumption
toward a world without batteries
Real-time control
• Enabling “green” end equipments that use
less energy and operate more efficiently
Communications
• Connecting and automating home,
building and industrial systems
Security
• Securing data flow over all means of
communication
Safety
• Bringing intelligence to safety-critical
applications to prevent and protect
TI Information – Maximum Restrictions
2
It’s a Balancing Act
Intensity
Compute
Intensive
Mostly ON
Dominated
Standby
Dominated
Harvesting
Energy
source
Battery Powered
Line Powered
3
TI Embedded Processors Portfolio
Microcontrollers
MSP
C2000™
TM4Cx
Hercules™
o 1300+ devices,
from $0.25 to $25
o Optimized for low-power,
control, and safety
ARM® Processors/SoC
C6000™
C5000™
KeyStone
Sitara™
OMAP
KeyStone
o Cortex- A solutions with
support for Linux, Android,
Windows, QNX
o 600+ DSPs for audio, mission
control, imaging, vision, test &
measurement, etc.
o From $5 to 5 GHz
o $2 ultra-low power DSPs,
>10 GHz DSPs
o Proprietary and ARM®
Cortex®-M, -R MCUs
Wireless
Connectivity
Digital Signal
Processors
IEEE 802.15.4
More than 130 solutions
4
4
Building a broad MCU Portfolio
Low-Power
Microcontrollers
Ultra-low Power
Applications where the
majority of device life in
standby
Low Power + Performance
Mostly ‘On’ battery powered
applications needing
significant compute
requirements
Performance
Microcontrollers
Real-time Control
Applications needing low
latency closed loop control
Control + Automation
Expanding real-time control
platforms with Host Control &
Industrial Communications
technology
Hercules™ Safety
Applications that require
functional safety
5
MSP Low-Power MCU
Ultra-low Power
• Battery Life > 20 Years
•
<100 uA/MHz active, 0.5 uA RTC Mode,
0.1uA RAM Retention
• More Performance without Sacrificing Battery Life
•
7 Low-Power Modes, Instant Wakeup, Autonomous
Peripherals
Integration
• Advanced Peripherals
•
High Performance Analog, Optimized Serial
Communications
• Minimize Physical Footprint and Bill of Materials
•
USB, LCD Drivers, RF, Sigma Delta ADCs, Op Amps
Ease of Use
• The Right Tools for You
•
LaunchPad, Comprehensive Software, App Specific
Portfolio
• Support
•
Code Examples, Direct Forum Support, Developer
Community
6
The FRAM Advantage: At a Glance
Write More
Collect more data over time with 100x faster writes than Flash
Extend product life and ditch the EEPROM with infinite endurance
Decrease Power
Extend battery life with 250x lower energy writes vs Flash
Minimize wireless system power by shortening memory update times
Unified Memory
Simple to use with unmatched flexibility
Migration guides, code examples and application notes available!
7
FRAM Use-Case
Over the Air Updates
Speed of FRAM writes can make OTA updates more reliable
Solution Features
Solution Benefits
•
•
•
•
Updating FRAM takes 100x less time and 250x
less energy/bit
No pre-erase required
Data can be written on-the-fly, as opposed to
buffered in RAM
• Data can be written to FRAM right out of
the COMM channel, with no buffering
required
•
•
High speed, ultra-low-energy writes enable
longer system battery life
FRAM can simplify development while
simultaneously reducing the time a system is
active
Data will not be lost in case of power failure
meaning the verification algorithm can be
simpler
Tools & Resources
• Get started with the FR5969
LaunchPad
MSP-EXPFR5969
• Check out FRAM documents:
• FAQ
• How to / best Practices
• Quality and Reliability
CC110L BoosterPack
8
EnergyTrace ++TM technology
• Complete ecosystem for real-time power profiling/debugging
• Graphical User Interface in TI’s Code Composer Studio and IAR Systems’ Embedded
Workbench development environments
– Current measurement on all MSP430 MCUs
– CPU and peripheral states on MSP430FR69x/FR68x/FR59x/FR58x MCUs
9
C2000™ Microcontroller
Processing
• Single cycle execution of real-time control math
• Accelerated execution of application-specific
code
• Independent multi-loop processing
Actuation
• High resolution system control
• Flexible system interfacing
• Advanced system protection
Sensing
• Low latency, high accuracy, signal sampling
• High resolution, digital signal interfacing
• Asynchronous, system monitoring and response
10
Essentials of Real-time Control
Microcontroller
Ref
+
∑
Power
Electronics
Processing
Actuation
Sensing
Limited Time Window to Update Power Electronics Stimulus
Analog
To
Digital
Update
Control
Loop
Digital
To
Analog
Faster the update rate…
Background Tasks
Greater the application
performance
11
C2000™ Real-time Control: Processing
C2000™ MCU
C28x™
Core(s)
VCU
TMU
FPU
CLA
Core(s)
Sensing
Power
Power
Electronics
Electronics
Actuation
FPU
DSP Math Efficiency
•
•
•
Single cycle execution across
pipeline
Up to 300 MIPS per core
Single cycle real-time operations
such as 32 x 32-bit multiply-andaccumulate (MAC)
App Acceleration
•
•
Trigonometric math acceleration
Complex math, FFT, and Viterbi
algorithm acceleration
Parallel Processing
•
•
Independent processing of
multiple control loops
CLA is a streamlined C28x
processor
12
TM4C MCU
Connect
Communicate
•
Unparalleled number and combination
of connectivity options
•
Enabling communication to
the cloud
•
Connections from MCU to MCU or
machine to machine
•
Designing products for the
Internet of Things
Control
•
Running multiple events in a variety of
applications
•
Ability to control outputs
13
Wireless MCU
CC3200
Integration and Ease of Use
• 2.4GHz embedded Wi-Fi
• Integrated Aps MCU
• Internet on a Chip – Embedded TCP/IP, SSL/TLS
• QFN package or certified module
Low Power
• Low power radio: 37mA listen, 54 mA receive
• Low power modes: 4uA hibernate, 120 uA sleep,
95 mSec wakeup from hibernate to secure Wi-Fi
connection
CC3100
• Runs on 2xAA batteries over 1 year
Secure
• Integrated secured protocols: WPA2, SSL 3.0 / TSL 1.2
• On-Chip HW encryption
• On-Chip secret key
• Secure boot
14
Hercules MCU
High Reliability
•
Prove hardware based on 20+ years of TI safetycritical system expertise
•
Development flow refined for high quality and low
DPPM
•
Automotive AEC Qualified
Reduce Systematic and Random Faults
•
•
•
Built in self test to provide high diagnostic coverage
Lockstep CPUs & ECC protect against random faults
Clock and Voltage Monitoring
Broad Market Applications
•
•
•
CPU performance ranging from 80MHz to 330MHz
Flash memory options ranging from 256KB to 4MB
Wide range of peripherals for broad applications
15
LaunchPad is TI’s Common Denominator
Modular hardware enables developers to explore new ideas quickly
Sub-1GHz
(CC110L)
NFC/RFID Internet on Chip ZigBee
(TRF7970A)
(CC3100)
(CC2530)
BLE
(CC2541)
Bluetooth
(CC2564)
Wireless BoosterPacks enabled by TI transceivers
Thermocouple MEMS Temp Sensor
BoosterPack
BoosterPack
(ADS1118)
(TMP006)
ePaper Display
LiPo Battery
SensorHub
BoosterPack
BoosterPack
BoosterPack
(RePaper)
(BQ fuel gauge) (various sensors)
Additional BoosterPacks for analog, sensors, displays & more
from TI, Third Parties & Maker community.
LaunchPad kits featuring TI MCUs & standardized BoosterPack interface
MSP430
TM4Cx
C2000
Hercules
CC3200
16
Optical Heart Rate Monitor with BLE Connectivity
• Optical Heart Rate Monitor wrist watch reference
design (no chest strap!)
• Features
– Analog Front End (AFE4400) for measuring pulse
from veins in wrists
– MSP430F5528 MCU for holding algorithm and
motion cancellation calibration data
– BLE module connection (CC2541)
– This design is tested and provides everything you
need to complete your design including Schematics,
Layout and Gerber files, and BOM
• Tradeoffs
– Optimized to run from a coin cell battery
– Optimized for size/volume
17
Battery operated water meter with wireless connectivity
• Fully-functional battery powered magnetic pulse
water meter with wired and wireless automatic meter
reading (AMR) function. The instantaneous and total
flow is displayed on the LCD.
• Features
–
–
–
–
–
–
Magnetic pulse measurement
2.9uA standby current
Non-volatile on-chip FRAM real-time storage
Support NFC and Sub-1GHz BoosterPack
Battery voltage monitor
Tested and includes HW, firmware, GUI, demo and
User's Guide
• Tradeoffs
– This design works in low power mode and reduces CPU
engagement, which helps to reduce overall power
consumption.
– Wireless function activated only when readout needs to
be transmitted
18
Grid-tied Solar Micro Inverter with MPPT
• Digitally-controlled, grid-tied, solar micro inverter with
maximum power point tracking (MPPT). For this
design, a C2000 Piccolo MCU is used as the digital
controller for the complete inverter, including control
of the power stages, MPPT, and grid-tie
synchronization.
• Features
– Supports panel voltages of 28 to 45V at input as well as universal
power output at up to 280W for 220VAC and up to 140W for
110VAC, making it suitable for the diverse requirements of
worldwide solar markets
– 93% peak efficiency and less than 4% total harmonic distortion
(THD) provide more power output per solar panel, reducing
detrimental heat dissipation and increasing system longevity
• Tradeoffs
– Digital real time control with low event to reaction latency
is critical for the use case, while power is a secondary
concern as this system is line powered
19