led tv service manual - LG Parts and Accessories
Transcription
led tv service manual - LG Parts and Accessories
Internal Use Only North/Latin America http://aic.lgservice.com Europe/Africahttp://eic.lgservice.com Asia/Oceaniahttp://biz.lgservice.com LED TV SERVICE MANUAL CHASSIS : LA57H MODEL : 32LF5600 32LF5600-UB CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. P/NO : MFL68646501(1502-REV00) Printed in Korea CONTENTS CONTENTS ............................................................................................... 2 PRODUCT SAFETY .................................................................................. 3 SPECIFICATION........................................................................................ 4 ADJUSTMENT INSTRUCTION............................................................... 10 TROUBLE SHOOTING............................................................................. 16 BLOCK DIAGRAM................................................................................... 22 EXPLODED VIEW ................................................................................... 23 SCHEMATIC CIRCUIT DIAGRAM .............................................APPENDIX Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes -2- LGE Internal Use Only SAFETY PRECAUTIONS IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer. General Guidance Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet. An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB. Keep wires away from high voltage or high temperature parts. Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer. Leakage Current Hot Check circuit Before returning the receiver to the customer, always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock. Leakage Current Cold Check(Antenna Cold Check) With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer. Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes -3- LGE Internal Use Only SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500 °F to 600 °F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. -4- LGE Internal Use Only IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes -5- LGE Internal Use Only SPECIFICATION NOTE : Specifications and others are subject to change without notice for improvement. 1. Application range This spec sheet is applied LED TV with LA57H chassis 2. Test condition Each part is tested as below without special notice. 1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC 2) Relative Humidity: 65 % ± 10 % 3) Power Voltage Market Input voltage Frequency USA 100~240V 50/60Hz Remark Standard Voltage of each product is marked by models 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM 5) The receiver must be operated for about 20 minutes prior to the adjustment 3. Test method 1) Performance: LGE TV test method followed 2) Demanded other specification Safety : UL, CSA, IEC specification EMC: FCC, ICES, IEC specification Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes -6- LGE Internal Use Only 4. General Specification No Item Specification Result Remark 1. Receiving System ATSC / NTSC-M / 64 & 256 QAM 2. Available Channel 1) VHF : 02~13 2) UHF : 14~69 3) DTV : 02-69 4) CATV : 01~135 5) CADTV : 01~135 3. Input Voltage AC 100 ~ 240V 50/60Hz 4. Market NORTH AMERICA 5. Screen Size 32/42/43/49/55 inch Wide (1920 × 1080) FHD / 60Hz 32LF5600-Ux 42LF5500-Ux 42LF5600-Ux 43LF5400-Ux 49LF5500-Ux 49LF5400-Ux 55LF5500-Ux 32 inch Wide (1366 × 768) HD / 60Hz 32LF560B-Ux 6. Aspect Ratio 16:9 7. Tuning System FS 8. Module Direct Mark : 110V, 60Hz (N.America) LC320DXE-MGA3 LGD HD / 60Hz 32LF560B-Ux HC320DXN-ABHS3 BOE HD / 60Hz 32LF560B-Ux LC320DUE-MGA3 LGD FHD / 60Hz 32LF5600-Ux NC320DUN-VBBP3 BOE FHD / 60Hz 32LF5600-Ux LC420DUE-MGA3 LGD FHD / 60Hz 42LF5600-Ux NC420DUN-VUBP5 AUO FHD / 60Hz 42LF5600-Ux LC420DUE-MGA6 LGD FHD / 60Hz 42LF5500-Ux NC420DUN-VUBP8 AUO FHD / 60Hz 42LF5500-Ux LC490DUE-MGA6 LGD FHD / 60Hz 49LF5500-Ux LC550DUE-MGA6 LGD FHD / 60Hz 55LF5500-Ux NC430EUN-AACR1 LGD FHD / 60Hz 43LF5400-Ux NC490EUN-AACR1 LGD FHD / 60Hz 49LF5400-Ux 9. Operating Environment 1) Temp : 0 ~ 40 deg 2) Humidity : ~ 80 % 10. Storage Environment 1) Temp : -20 ~ 60 deg 2) Humidity : ~ 85 % Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes -7- LGE Internal Use Only 5. Supported video resolutions 5.1. Component input(Y, CB/PB, CR/PR) No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 1 720*480 15.73 59.94 13.50 SDTV ,DVD 480I 2 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I 3 720*480 31.47 59.94 27.00 SDTV 480P 4 720*480 31.50 60.00 27.027 SDTV 480P 5 1280*720 44.96 59.94 74.176 HDTV 720P 6 1280*720 45.00 60.00 74.25 HDTV 720P 7 1920*1080 33.72 59.94 74.176 HDTV 1080I 8 1920*1080 33.75 60.00 74.25 HDTV 1080I 9 1920*1080 26.97 23.976 74.176 HDTV 1080P 10 1920*1080 27.00 24.00 74.25 HDTV 1080P 11 1920*1080 33.71 29.97 74.176 HDTV 1080P 12 1920*1080 33.75 30.00 74.25 HDTV 1080P 13 1920*1080 67.432 59.94 148.352 HDTV 1080P 14 1920*1080 67.50 60.00 148.50 HDTV 1080P Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes -8- LGE Internal Use Only 5.2. HDMI Input (DTV / PC) No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks DTV 1 640*480 31.46 59.94 25.125 SDTV 480P 2 640*480 31.5 60.00 25.125 SDTV 480P 3 720*480 15.73 59.94 13.500 SDTV 480I Spec-Out. (Just Display) 4 720*480 15.75 60.00 13.514 SDTV 480I Spec-Out. (Just Display) 5 720*480 31.47 59.94 27.00 SDTV 480P 6 720*480 31.5 60.00 27.027 SDTV 480P 7 1280*720 44.96 59.94 74.176 HDTV 720P 8 1280*720 45 60.00 74.25 HDTV 720P 9 1920*1080 33.72 59.94 74.176 HDTV 1080I 10 1920*1080 33.75 60.00 74.25 HDTV 1080I 11 1920*1080 26.97 23.97 74.176 HDTV 1080P 12 1920*1080 27.00 24.00 74.25 HDTV 1080P 13 1920*1080 33.71 29.97 74.176 HDTV 1080P 14 1920*1080 33.75 30.00 74.25 HDTV 1080P 15 1920*1080 67.43 59.94 148.352 HDTV 1080P 16 1920*1080 67.5 60.00 148.50 HDTV 1080P 1 640*350 @70Hz 31.46 70.09 25.17 EGA X 2 720*400 @70Hz 31.46 70.08 28.32 DOS O 3 640*480 @60Hz 31.46 59.94 25.17 VESA(VGA) O 4 800*600 @60Hz 37.87 60.31 40.00 VESA(SVGA) O 5 1024*768 @60Hz 48.36 60.00 65.00 VESA(XGA) O 6 1152*864 @60Hz 54.34 60.05 80.002 VESA O 7 1280*1024 @60Hz 63.98 60.02 108.0 VESA (SXGA) O 8 1360*768 @60Hz 47.71 60.01 85.50 VESA (WXGA) O 9 1920*1080 @60Hz 67.5 60.00 148.5 WUXGA(CEA 861D) O PC Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes -9- FHD only FHD only LGE Internal Use Only ADJUSTMENT INSTRUCTION 1. Application This spec. sheet applies to LA57H Chassis applied LED TV all models manufactured in TV factory 4. MAIN PCBA Adjustments * Download (1) E xecute ISP program “Mstar ISP Utility” and then click “Config” tab. (2) Set as below, and then click “Auto Detect” and check “OK” message. If display “Error”, Check connect computer, jig, and set. (3) C lick “Connect” tab. If display “Can’t ”, Check connect computer, jig, and set. 2. Specification (1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of 25 ±5 ºC of temperature and 65±10% of relative humidity if there is no specific designation (4) The input voltage of the receiver must keep 100~240V, 50/60Hz (5) At first Worker must turn on the SET by using Power Only key. (6) The receiver must be operated for about 5 minutes prior to the adjustment when module is in the circumstance of over 15 ºC In case of keeping module is in the circumstance of 0°C, it should be placed in the circumstance of above 15°C for 2 hours In case of keeping module is in the circumstance of below -20°C, it should be placed in the circumstance of above 15°C for 3 hours. (4) Click “Read” tab, and then load download file(XXXX.bin) by clicking “Read” ※ Caution When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area (5) Click “Auto” tab and set as below (6) Click “Run”. (7) After downloading, check “OK” message. 3. Adjustment items 3.1. Main PCBA Adjustments (1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p (2) EDID download: HDMI and RGB-PC ■ A bove adjustment items can be also performed in Final Assembly if needed. Adjustment items in both PCBA and final assembly tages can be checked by using the INSTART Menu(1.ADJUST CHECK) Component 1080p and RGB-PC Adjust will be calculated by 480i adjust value. 3.2. Final assembly adjustment (1) White Balance adjustment (2) RS-232C functionality check (3) Factory Option setting per destination (4) Shipment mode setting (In-Stop) (5) GND and HI-POT test 4.1. ADC Calibration 4.1.1. Overview ▪ ADC adjustment is needed to find the optimum black level and gain in Analog-to-Digital device and to compensate RGB deviation ▪ ADC adjustment is OTP (Auto ADC) 3.3. Appendix (1) Shipment conditions (2) Tool option menu (3) USB Download (S/W Update, Option and Service only) (4) Preset CH Information Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 10 - LGE Internal Use Only 4.2. EDID Download ▪ 2D / 8bit / FHD (1) EDID Block 0, Bytes 0-127 [00H-7FH] 4.2.1. Overview ▪ I t is a VESA regulation. A PC or a MNT will display an optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”. 4.2.2. Equipment ▪ Since embedded EDID data is used, EDID download JIG, HDMI cable and D-sub cable are not need. ▪ Adjust by using remote controller (2) EDID Block 1, Bytes 128-255 [80H-FFH] 4.2.3. Download method (using DFT) ※ PC(for communication through RS-232C), UART baud rate: 115200 bps Command : aa 00 00 (Start Factory mode) Command : ae 00 10 (Download All EDID) Command : aa 00 90 (End of Factory mode) 4.2.4. Download method 1) Press Adj. key on the Adj. R/C, 2) Select EDID D/L menu. 3) By pressing Enter key, EDID download will begin 4) If Download is successful, OK is display, but If Download is failure, NG is displayed. 5) If Download is failure, Re-try downloads. ■ L15_M1L EDID - AC3 ▪ 2D / 8bit / HD (1) EDID Block 0, Bytes 0-127 [00H-7FH] ※ Caution) When EDID Download, must remove RGB/HDMI Cable. 6) EDID Write confirmation (2) EDID Block 1, Bytes 128-255 [80H-FFH] 4.2.5. Models for EDID Data 2D North America (PCM) HD / 8bit HDMI 2ea FHD / 8bit HDMI 2ea 32LF560B-Ux 32LF550B-Ux 32/42LF5600-Ux 42/49/55LF5500-Ux 43/49LF5400-Ux ▪ 2D / 8bit / FHD (1) EDID Block 0, Bytes 0-127 [00H-7FH] 4.2.6. EDID DATA ■ L15_M1L EDID - PCM ▪ 2D / 8bit / HD (1) EDID Block 0, Bytes 0-127 [00H-7FH] (2) EDID Block 1, Bytes 128-255 [80H-FFH] (2) EDID Block 1, Bytes 128-255 [80H-FFH] 4.2.7. Tool Option Input ▪ Input Model Tool Option according to BOM Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 11 - LGE Internal Use Only 5. Final Assembly Adjustment 5.1.4. Adjustment Command (Protocol) (1) RS-232C Command used during auto-adj. 5.1. White Balance Adjustment RS-232C COMMAND 5.1.1. Overview 5.1.1.1. W/B adj. Objective & How-it-works (1) Objective: To reduce each Panel’s W/B deviation (2) How-it-works: When R/G/B gain in the OSD is at 192, it means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value. (3) Adj. condition: normal temperature - Surrounding Temperature: 25±5 °C - Warm-up time: About 5 Min - Surrounding Humidity: 20% ~ 80% - Before White balance adjustment, Keep power on status, don’t power off 5.1.1.2. Adj. condition and cautionary items (1) Lighting condition in surrounding area surrounding lighting should be lower 10 lux. Try to isolate adj. area into dark surrounding. (2) Probe location: Color Analyzer (CA-210) probe should be within 10cm and perpendicular of the module surface (80°~ 100°) (3) Aging time - A fter Aging Start, Keep the Power ON status during 5 Minutes. - In case of LCD, Back-light on should be checked using no signal or Full-white pattern. DATA ID Wb 00 00 Begin White Balance adj. Wb 00 ff End White Balance adj. (internal pattern disappears ) Ex) wb 00 00 -> Begin white balance auto-adj. wb 00 10 -> Gain adj. ja 00 ff -> Adj. data jb 00 c0 ... ... wb 00 1f -> Gain adj. complete *(wb 00 20(start), wb 00 2f(end)) -> Off-set adj. wb 00 ff ->End white balance auto adj. (2) Adjustment Map Adj. item Cool 5.1.2. Equipment (1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED: CH14) (2) A dj. Computer (During auto adj., RS-232C protocol is needed) (3) Adjust Remocon (4) V ideo Signal Generator MSPG-925F 720p/204-Gray (Model: 217, Pattern: 49) → Only when internal pattern is not available ※ Color Analyzer Matrix should be calibrated using CS-1000 5.1.3. Equipment connection Explanation CMD Command (lower case ASCII) Data Range (Hex.) CMD1 CMD2 MIN MAX R Gain j g 00 C0 172 G Gain j h 00 C0 172 B Gain j i 00 C0 192 R Cut 128 G Cut 128 B Cut Medium Warm Default (Decimal) 128 R Gain j a 00 C0 192 G Gain j b 00 C0 192 B Gain j c 00 C0 192 R Cut 128 G Cut 128 B Cut 128 R Gain j d 00 C0 192 G Gain j e 00 C0 192 B Gain j f 00 C0 172 R Cut 128 G Cut 128 B Cut 128 ▪ When you connect the RS232 to set Phone jack, please use 3pin phone jack cable. Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 12 - LGE Internal Use Only 5.1.5. Adjustment method 5.1.5.1. Auto WB calibration (1) Set TV in ADJ mode using P-ONLY key (or POWER ON key) (2) Place optical probe on the center of the display - It need to check probe condition of zero calibration before adjustment. (3) Connect RS-232C Cable (4) Select mode in ADJ Program and begin a adjustment. (5) When WB adjustment is completed with OK message, check adjustment status of pre-set mode (Cool, Medium, Warm) (6) Remove probe and RS-232C cable. ▪ W/B Adj. must begin as start command “wb 00 00” , and finish as end command “wb 00 ff”, and Adj. offset if need 5.1.6. Reference (White Balance Adj. coordinate and color temperature) 5.1.5.2. Manual adjustment (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within 10cm of the surface.. (3) Press ADJ key → EZ adjust using adj. R/C → 6. WhiteBalance then press the cursor to the right (KEY►). ( When KEY(►) is pressed 204 Gray(80IRE) internal pattern will be displayed) (4) One of R Gain / G Gain / B Gain should be fixed at 192, and the rest will be lowered to meet the desired value. (5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of color temperature. ※ CASE First adjust the coordinate far away from the target value(x, y).B (1) x, y >target i) Decrease the R, G. (2) x, y< target i) First decrease the B gain, ii) Decrease the one of the others. (3) x >target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) F irst decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G ** (normal line) LGD Cell (LF56xx, LF55xx,LF54xx) ▪ S tandard color coordinate and temperature using CA-210(CH-14) – by aging time L15 ※ CASE : Medium / Warm mode First adjust the coordinate far away from the target value(x, y). (1) x, y >target i) Decrease the R, G. (2) x, y< target i) First decrease the B gain, ii) Decrease the one of the others. (3) x >target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G - 13 - Aging time (Min) Cool Medium Warm X Y X Y X Y 271 270 286 289 313 329 1 0-2 281 285 296 304 323 344 2 3-5 280 284 295 303 322 343 3 6-9 279 282 294 301 321 341 4 10-19 277 279 292 288 319 338 5 20-35 275 275 290 294 317 334 6 36-49 273 273 288 292 315 332 7 50-79 272 272 287 291 314 331 8 80-119 271 270 286 289 313 329 9 Over 120 271 270 286 289 313 329 ** ( Aging chamber) LGD Cell (LF56xx, LF55xx,LF54xx) ▪ S tandard color coordinate and temperature using CA-210(CH-14) – by aging time L15 ► How to adjust (1) Fix G gain at least 172 : Adjust R, B Gain ( In Case of Mostly Blue Gain Saturation ) (2) When R or B Gain > 255, Release Fixed G Gain and Readjust Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes ▪ Luminance: 204 Gray, 80IRE Aging time (Min) Cool Medium Warm X Y X Y X Y 271 270 286 289 313 329 1 0-5 280 285 295 304 319 340 2 6-10 276 280 291 299 315 335 3 11-20 272 275 287 294 311 330 4 21-30 269 272 284 291 308 327 5 31-40 267 268 282 287 306 323 6 41-50 266 265 281 284 305 320 7 51-80 265 263 280 282 304 318 8 81-119 264 261 279 280 303 316 9 Over 120 264 260 279 279 303 315 ** For INX,AUO,SHARP,CSOT Module.( In the case of , the color temperature spec of cool mode is 13000K) L15 cool med warm x y x y x y spec 271 270 286 289 313 329 target 276 277 291 296 318 336 LGE Internal Use Only 6. GND and HI-POT Test 5.2. Option selection per country 5.2.1. Overview (1) Tool option selection is only done for models in Non-USA North America due to rating (2) Applied model: LA57H Chassis applied to CANADA and MEXICO 6.1. GND & HI-POT auto-check preparation (1) Check the POWER CABLE and SIGNAL CABE insertion condition 6.2. GND & HI-POT auto-check (1) Pallet moves in the station. (POWER CORD / AV CORD is tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto) - If Test is failed, Buzzer operates. - If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX) (5) HI-POT test (Auto) - If Test is failed, Buzzer operates. - If Test is passed, GOOD Lamp on and move to next process automatically. 5.2.2. Country Group selection (1) Press ADJ key on the Adj. R/C, and then select Country Group Menu (2) Depending on destination, select US, then on the lower Country option, select US, CA, MX. Selection is done using +, - KEY (3) Using DFT(Auto) ※ PC (for communication through RS-232C) -> UART Baud rate : 115200 bps Command : ah 00 00 DATA(Area Number(hexadecimal)) ITEM DATA(Area Number) AREA AREA OPTION1 0 USA 1 CANADA 2 MEXICO 6.3. Checkpoint (1) Test voltage - GND: 1.5KV/min at 100mA - SIGNAL: 3KV/min at 100mA (2) TEST time: 1 second (3) TEST POINT - GND Test = POWER CORD GND and SIGNAL CABLE GND. - Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms 5.2.3. Tool Option inspection ▪ Press Adj. key on the Adj. R/C, then select Tool option. 2,3th Suffix 4th Suffix Module Tool 1 Tool 2 Tool 3 Tool 4 32LF560B -Ux - M Sharp 13074 13314 41036 28768 32LF550B -Ux CC/US M Sharp 13074 17410 53324 24672 WM M Sharp 13074 17410 53316 24672 CC/US F BOE 21266 17410 53324 24672 WM F BOE 21266 17410 53316 24672 CC/US Y LGD 785 17410 49228 24672 WM Y LGD 785 17410 49220 24672 32LF5600 -Ux CC/US Y LGD 785 1030 45132 28768 WM Y LGD 785 1030 45124 28768 32LF5600 -Ux CC/US F BOE 21264 1030 49228 20576 WM F BOE 21264 1030 49220 20576 42LF5600 -Ux CC/US Y LGD 1553 1030 49228 28768 WM Y LGD 1553 1030 49220 28768 CC/US D AUO 9744 1030 49228 24672 WM D AUO 9744 1030 49220 24672 CC/US Y LGD 1553 5126 49228 28768 WM Y LGD 1553 5126 49220 28768 CC/US D AUO 9744 5126 49228 24672 Model 42LF5500 -Ux WM D AUO 9744 5126 49220 24672 49LF5500 -Ux CC/US Y LGD 2321 5126 49228 24672 WM Y LGD 2321 5126 49220 24672 55LF5500 -Ux CC/US Y LGD 2833 5126 53324 24672 WM Y LGD 2833 5126 53316 24672 7. AUDIO output check 7.1. Audio input condition (1) RF input: Mono, 1KHz sine wave signal, 100% Modulation (2) CVBS, Component: 1KHz sine wave signal (0.4Vrms) (3) RGB PC: 1KHz sine wave signal (0.7Vrms) 7.2. Specification No Item Min Typ Max Unit 1 Audio practical max Output, L/R (Distortion=10% max Output) 4.5 6.0 5.0 6.3 6.0 6.9 W Vrms (1) Measurement condition -E Q/AVL/Clear Voice: Off (2) S peaker (8Ω Impedance) (3) LF55 Series Remark 2 Audio practical max Output, L/R (Distortion=10% max Output) 9.0 8.5 10.0 8.9 12.0 9.8 W Vrms (1) Measurement condition -E Q/AVL/Clear Voice: Off (2) S peaker (8Ω Impedance) (3) LF56 Series ※ Tool option can be reconstructed by Software Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 14 - LGE Internal Use Only 8. USB S/W Download (optional, Service only) (1) Put the USB Stick to the USB socket (2) Automatically detecting update file in USB Stick - If your downloaded program version in USB Stick is lower than that of TV set, it didn’t work. Otherwise USB data is automatically detected. (3) Show the message “Copying files from memory” (4) Updating is staring. (5) Updating Completed, The TV will restart automatically (6) If your TV is turned on, check your updated version and Tool option. * If downloading version is more high than your TV have, TV can lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ ATV test on production line. * After downloading, TOOL OPTION setting is needed again. (1) Push "IN-START" key in service remote controller. (2) Select "Tool Option 1" and Push “OK” button. (3) Punch in the number. (Each model has their number.) Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 15 - LGE Internal Use Only TROUBLE SHOOTING 1. Power-up boot check Check PSU DC Voltage P401_5,6,7,8 pin : 13.2V NO Check 12pin Power connector OK Main B/D 13.2V Line Short Check NO Main B/D 3.3V Line Short Check OK Replace IC201 (DCDC) NO Replace X100 NO Re-download software. NO Replace Mstar(IC102) or Main board NO Replace IC402, IC403, IC404, Q403 NO Replace Q205 NO Replace Mstar(IC102) or Main Board NO Check PSU OK Replace PSU OK Check stand-by Voltage L202 : +3.3V OK Check X100 clock 24 MHz OK Check P200 PWR_ON. 1pin : 3.3V OK Check IC402/3/4 Output Voltage IC202 : 1.15V & 5V IC200 : 1.8V Q204 : 3.3V OK Check TCON(Module) Panel_VCC Q205 : 13.2V OK Check Output Mstar LV D S OK Check DRV ON Control P200 11pin : High OK Change Module Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 16 - LGE Internal Use Only 2. Digital / Analog TV Video Check RF Cable & Signal OK Check Tuner 3.3V Power L500 NO Replace L500 NO B a d Tu n e r. R e p l a c e Tuner. NO Replace Mstar(IC102) or Main Board. NO Replace Jack NO Replace AR401 or R110 NO Replace Mstar(IC102) or Main Board. OK Check IF_P/N Signal TU501 6,7 Pin OK Check Mstar LVDS Output 3. AV Video Check input signal format. Is it supported? OK Check AV Cable for damage for damage or open conductor OK Check JK401, CVBS Signal Line R120 OK Check CVBS_DET Signal OK Check Output Mstar LV D S Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 17 - LGE Internal Use Only 4. Component Video Check input signal format. Is it supported? OK Check Component Cable for damage or open conductor. OK Check JK401 Y/PB/PR signal Line NO Replace Jack NO Replace AR401or R109 NO Replace Mstar(IC101) or Main Board. OK Check Signal COMP_DET OK Check Output Mstar LV D S Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 18 - LGE Internal Use Only 5. HDMI Video Check input signal format. Is it supported? OK Check HDMI Cable conductors for damage or open conductor. OK Check EDID NO AR102, AR101, AR410, AR411 I2C Signal Replace the defective IC or re-download EDID data OK Check JK403, JK404 NO Replace Jack NO Replace R418, R410, Q400, R419 NO Check other set If no problem, check signal line NO Replace Mstar(IC101) or Main Board. OK Check HDMI_DET (HPD) OK Check HDMI Signal NO Replace Main Board OK Check Output Mstar LV D S Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 19 - LGE Internal Use Only 6. All Source Audio Check the TV Speaker Menu (Menu -> Audio -> TV Speaker) OFF Toggle the Menu NO Main B/D 3.3V Line Short Check ON Check AMP IC(IC5600) Power 24V, 3.3V OK Check Mstar AUDIO_MASTER_CLK NO R148 Replace Mstar(IC101) or Main Board. OK Check AMP I2C Line R140, R141 NO Check signal line. Or replace Mstar(IC101) NO Check signal line. Or replace Mstar(IC101) NO Replace Audio AMP IC(IC5600) NO Replace connector if found to be damaged. OK Check Mstar I2S Output IC5600 20,21,22 Pin OK Check Output Signal P5600 1, 2, 3, 4 pin. OK Check Connector & P5600 OK Check speaker resistance and connector damage. NO Replace speaker. Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 20 - LGE Internal Use Only 7. Digital / Analog TV Audio Check RF Cable & Signal OK Check Tuner 3.3V Power L500 NO Replace L500 NO Replace AR500, R502, R503 NO B a d Tu n e r. R e p l a c e Tuner. OK Check Tuner I2C AR500, R502, R503 OK Check IF_P/N Signal TU501 6/7 Pin OK Follow procedure ‘7. All source audio’ trouble shooting guide. 8. AV Audio Check AV Cable for damage for damage or open conductor OK Check JK401 Signal Line R409 ,R406 NO Replace Jack NO Replace Jack OK Follow procedure ‘7. All source audio’ trouble shooting guide. 9. Component Audio Check Component Cable for damage or open conductor. OK Check JK401 Signal Line R409 ,R406 OK Follow procedure ‘7. All source audio’ trouble shooting guide. Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 21 - LGE Internal Use Only Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 22 - (( (( P305 LPF LPF S_AMP_24V IC100 EEPROM 24C512 IC101 Serial Flash 8Mbytes VDDC_1.15V Panel_Vcc 13 N_3.3V 46 36 39 IC301 22 21 20 23 24 Sound AMP TAS5733 1 15 USB_DN USB_DP Audio_SCL 2 1 56 132 94 95 32 57 131 144 JK602 HDMI1 134,135,145~152 EEP SCL EEP SDA 106 105 HDMI2 139,140,1~4,153~156 22,24,26,34,35 IC101 29,34,35 Panel_12V LGE8220 / M1L SPI_CLK SPI_DI SPI_CZ SPI_DO 114 113 112 111 RL_on 124 123 110 100 101 PWM 21 33 51 52 87 127 63 64 65 66 Audio_SDA I2S_MCLK I2S_WS I2S_SCK I2S_SDO DDR_1.8V IR KEY1/2 LED IC200 AZ1117EH AVDD_ST_3.5V 3 4 33 34 Q204 DMP2130L IC202 BD9D321EFJ IC201 TI (TBD) 2BUCK 1OCP Q204 DMP2130L 4 INV_on P200 JK601 62 JK608 SPDIF 116 117 79 ~ 89 P300/301 48 49 50 58 59 53 54 P304 IR B+ 5 Tx, Rx Debug JK607/P601/P602 M_3.3V TU_3.3V TDSS-H701F 9 IF_AGC 10 11 TUNER IF_P IF_N TU701 HDMI2 MHL_5V USB_DN USB_DP USB_5V ST_3.5V IR Board 3 Tuner SCL 4 Tuner SDA 24Mhz KEY2 Module KEY1 3, 4, 7, 8 P_13.2V Y,Pb,Pr In 67 ~ 78 Comp. R/L In JK605 AV1 In LED Power Board(LPB) BLOCK DIAGRAM JK603 LGE Internal Use Only EXPLODED VIEW IMPORTANT SAFETY NOTICE Set + Stand 200 A2 A10 121 LV1 530 310 540 900 410 120 521 400 Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer. Copyright © LG Electronics. Inc. All rights reserved. Only for training and service purposes - 23 - LGE Internal Use Only AR103 100 1/16W Closed to SoC as possible KEY1 KEY2 LED_RED +1.15V_VDDC DDR_DATA AV_DET DDC_SCL_1 DDC_SDA_1 COMP_DET 5V_DET_HDMI_2 R111 1K DP_P1 126 AVDD_MOD_4 SAR0/GPIO75 SAR1/GPIO74 SAR2/GPIO73 127 VDDC_3 R110 1K AR102 100 1/16W GPIO54 DDCDD_CL DDCDD_DA 136 10K DDCDA_DA 137 R128 10K RXB0- RXB0+ RXB1+ RXB1- RXB2- RXBCK- RXB2+ RXBCK+ RXB3- AVDD_MOD RXB3+ USB_OCD USB_CTL AMP_SDA AMP_SCL AR112 1/16W 100 1/16W AR111 33 79 80 81 82 83 84 85 R_ODD[3]/LVB2-/RLV4-/EPI5R_ODD[2]/LVB2+/RLV4+/EPI5+ R_ODD[1]/LVBCLK-/RLV5-/EPI4R_ODD[0]/LVBCLK+/RLV5+/EPI4+ G_ODD[7]/LVB3-/RLV6-/EPI3G_ODD[6]/LVB3+/RLV6+/EPI3+ G_ODD[5]/LVB4-/LLV0-/EPI2G_ODD[4]/LVB4+/LLV0+/EPI2+ 86 AVDD_MOD_3 87 88 89 90 91 92 93 95 GPIO9/TCON9 GPIO10/TCON10 96 97 GPIO8/TCON8 99 98 GPIO7/TCON7 GPIO6/TCON6 100 GPIO5/TCON5 101 GPIO4/TCON4 102 GPIO3/TCON3 103 GPIO2/TCON2 104 GPIO1/TCON1 105 94 LVSYNC/GPIO16/RLV0-/GPIO16 LHSYNC/GPIO17/RLV0+/GPIO17 LDE/GPIO18/RLV1-/GPIO18 LCK/GPIO19/RLV1+/GPIO19 R_ODD[7]/LVB0-/RLV2-/EPI7R_ODD[6]/LVB0+/RLV2+/EPI7+ R_ODD[5]/LVB1-/RLV3(CLK)-/EPI6R_ODD[4]/LVB1+/RLV3(CLK)+/EPI6+ 5V_DET_HDMI_1 HPD1 106 GPIO0/TCON0 HOTPLUG_A HOTPLUG_D 107 108 PWM1/GPIO14 109 PWM0/GPIO15 110 SPI_DI SPI_DO 111 112 SPI_CZ 113 SPI_CK THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. RXACK+ RXACKRXA2+ RXA2RXA1+ RXA1RXA0+ RXA0- AUD_LRCH AUD_SCK AUD_MASTER_CLK AUD_LRCK SPDIF_OUT VCOM_SDA VCOM_SCL TU_SCL TU_SDA VDDC_2 56 VDDIO_CMD 55 AVDD_MOD_2 54 XOUT 53 XIN 52 AVDD3P3_DMPLL 51 AVDD3P3_DADC 50 VIFM R122 0 49 VIFP R123 0 C124 48 IFAGC +1.15V_VDDC DDR_CMD AVDD_MOD R127 1M C143 15pF C142 15pF X100 24MHz AVDD_DMPLL Closed to SoC AVDD_DADC C123 0.1uF 16V IF_N_MSTAR IF_P_MSTAR 0.1uF 16V OPT C128 100pF LINEOUTR0 OPT C134 100pF 45 46 LINEOUTL0 LINEOUTR3 44 LINEOUTL3 43 42 VRM VAG 41 AUL3 39 40 AUR3 AUL2 38 AUR2 37 AUL1 36 35 AUR1 10V AUL0 +3.3V_NORMAL C122 0.1uF 16V C116 0.1uF 16V C115 C114 10V 2.2uF 34 AUR0 2.2uF 33 32 AVDD_AU33 VDDC_1 31 25V CVBS_OUT1 R124 10K IF_AGC_MAIN R125 100 PZ1608U121-2R0TF L100 COMP_L_IN AVDD_AU33 TP1 +1.15V_VDDC C117 10uF 6.3V COMP_R_IN 30 C113 180 COMP_Y+ R121 0.047uF VCOM 25V 28 29 CVBS0 C112 150 R120 CVBS1 27 VSYNC1 26 C111 R119 33 0.047uF 25V RIN1P 25 GIN1M 25V 25V C110 0.047uF 24 23 SOGIN1 GIN1P 50V 0.047uF 1000pF 33 C109 0.047uF C107 SPI_SDI Not USe Macronix (EAN63146601) Copyright ⓒ 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes C108 8 9 RX0P_A RX0N_A 7 RXCP_A RXCN_A 6 5 4 SPI_SCK DI[IO0] 68 5 CLK R118 6 4 C106 0.1uF 16V AR109 3 %HOLD[IO3] 33 7 COMP_Pr+ GND 2 VCC R113 WP[IO2] 8 COMP_Pb+ DO[IO1] SPI_SDO 1 AVDD_VIDEO CS /SPI_CS AVDD_MOD R105 4.7K /FLASH_WP 114 DDCA_DA ARC/GPIO87 115 116 DDCA_CK 117 TEST 118 IRIN CEC 119 120 121 RESET IC101 W25Q64FVSSIG OPT R100 10K +3.3V_ST AVDD_MOD_1 SERIAL FLASH(64MB) RXA3- Closed to SoC E-PAD OPT C104 8pF D2+_HDMI2 OPT C102 8pF OPT C141 0.1uF 16V RXA3+ 57 47 COMP_Y+ 156 I2C_SDA 22 155 RX0P_B BIN1P RX0N_B D0+_HDMI2 25V D0-_HDMI2 RX2P_B I2C_SCL SDA 3 5 154 AVDD3P3_ADC 21 RXCP_B 20 CK+_HDMI2 RX2N_B 6 4 AR100 33 1/16W SCL 19 153 VSYNC0 RXCN_B RIN0P CK-_HDMI2 D2-_HDMI2 3 R107 2.2K D1+_HDMI2 7 R106 2.2K 1 GND 2 C105 0.1uF 16V WP RX1N_B A2 VCC 18 152 17 D2+_HDMI1 RX2P_D GIN0M 151 GIN0P 150 RX2N_D 16 RX1P_D D2-_HDMI1 15 D1+_HDMI1 BIN0P 149 SOGIN0 RX1N_D 14 148 D1-_HDMI1 13 D0+_HDMI1 RX0P_D HSYNC0 147 RX2P_A RX0N_D 12 D0-_HDMI1 11 146 RX2N_A RXCP_D RX1P_A CK+_HDMI1 58 10 CK-_HDMI1 145 RX1N_A 144 RXCN_D +3.3V_ST 8 62 59 2 SDA NVRAM_ATMEL 1 63 143 VDDC_4 +1.15V_VDDC SCL IC100 AT24C512C-SSHD-T A1 64 THERMAL 157 GND_EFUSE WP 65 [M1L] C136 0.1uF 16V C135 10uF 6.3V GPIO46/MHL_VBUS GPIO45/I2C_SCLM/UART_RX1 GPIO44/I2C_SDAM/UART_TX1 66 AVDD_5V_MHL 142 HDMI2_5V VCC EEPROM(512KB) A0 141 OPT C125 0.1uF 16V 60 67 RX1P_B 5 140 HOTPLUG_B C119 0.1uF 16V GPIO47 68 139 DDCDB_CL L104 PZ1608U121-2R0TF 61 69 D1-_HDMI2 6 4 DDCDB_DA AVDD_VIDEO C144 0.1uF 16V +1.8V_DDR SPDIF 70 MHL_DET/GPIO86 138 AVDD_DMPLL C145 0.1uF 16V DDR_DATA R126 100 71 IC102 LGE8220(MSD8220LBM) L107 PZ1608U121-2R0TF C138 0.1uF 16V C137 0.1uF 16V G_ODD[3]/LVA0-/LLV1-/EPI1G_ODD[2]/LVA0+/LLV1+/EPI1+ G_ODD[1]/LVA1-/LLV2-/EPI0G_ODD[0]/LVA1+/LLV2+/EPI0+ B_ODD[7]/LVA2-/LLV3(CLK)B_ODD[6]/LVA2+/LLV3(CLK)+ B_ODD[5]/LVACLK-/LLV4B_ODD[4]/LVACLK+/LLV4+ B_ODD[3]/LVA3-/LLV5B_ODD[2]/LVA3+/LLV5+ B_ODD[1]/LVA4-/LLV6B_ODD[0]/LVA4+/LLV6+ GPIO53/I2S_OUT_SD GPIO52/I2S_OUT_BCK GPIO51/I2S_OUT_MCK GPIO50/I2S_OUT_WS GPIO49/SPDIF_OUT 72 135 AVDD_AU33 Closed to Main SoC Each Pin 73 134 C130 0.1uF 16V C129 0.1uF 16V C126 1uF 10V C118 10uF 6.3V 74 133 R108 HPD2 IC100-*1 BR24G512FJ-3 3 L108 PZ1608U121-2R0TF C146 0.1uF 16V +1.8V_DDR L101 PZ1608U121-2R0TF 75 131 DDCDA_CL 1/16W GND C140 0.1uF 16V DDR_CMD 76 130 AVDD_DADC C147 0.1uF 16V L106 PZ1608U121-2R0TF 77 129 1K DDC_SCL_2 7 C127 1uF 10V C120 10uF 6.3V 78 128 R109 AR101 100 SUB_NVRAM_ROHM R114 10K VDDIO_DATA 132 DDC_SDA_2 2 L105 PZ1608U121-2R0TF +1.15V_VDDC 125 MHL Disable A2 C121 10uF 6.3V C132 0.1uF 16V C139 0.1uF 16V C131 0.1uF 16V PZ1608U121-2R0TF L103 AVDD_MOD AR107 33 1/16W AR106 33 1/16W INT/GPIO64/I2S_OUT_MCK 1/16W 100 AR104 DM_P1 122 DM_P0 DP_P0 HD R101 4.7K 123 124 MODEL_OPT A1 AMP_MUTE R117 10K Closed to SoC as possible FHD R102 4.7K 8 AVDD_MOD Closed to SoC as possible C103 0.1uF 16V +3.3V_NORMAL 1 AR110 100 1/16W 4.7K 1/16W AR108 <HW_OPTION> A0 AMP_RESET POWER_ON/OFF MODEL_OPT INV_CTL RL_ON PANEL_CTL /FLASH_WP I2C_SDA I2C_SCL PWM_DIM <Chip config.> SOC_RESET R104 470K +3.3V_ST L102 PZ1608U121-2R0TF 1K 1K C101 4.7uF 10V <MAIN SoC Vcc> +3.3V_ST 0.047uF OPT R112 OPT AR105 4.7K R115 +3.3V_ST C100 4.7uF 10V PWM_DIM2 SPI_SDO SPI_SCK /SPI_CS SPI_SDI PM_RXD PM_TXD +3.3V_ST IR POWER_DET_RESET POWER_DET OPT R103 470 SOC_RESET SIDE_USB_DP SIDE_USB_DM <SOC_RESET> C133 0.047uF 25V Close to MSTAR L15_M1L MAIN 140822 1 5 LGE Internal Use Only L15 NA POWER BLOCK PANEL_Vcc FROM LIPS or POWER B/D Power_DET +13.2V --> 3.56V M13.2V TR_NXP +3.3V_ST TR_KEC Q201-*1 2N3906S-RTK C E MMBT3906(NXP) Q201 3 1 OPT R215 33K OPT R201 10K 2 PANEL_VCC L203 UBW2012-121F B OPT C212 0.1uF 25V R205 10K RL_ON R219 33K 10% 1608 R202 10K PANEL_VCC +3.3V_ST +3.3V_ST Q205 SSM3J332R S D Panel_Cgs_0.22uF C213 0.22uF G 25V R241 100K R224 3.3K OPT R236 0 R232 14K 1% OPT R225 3.3K Reset_IC_KEC IC203 VCC R220 120K OPT R207 0 To make high at RL_ON when AC On +3.3V_NORMAL +3.3V_ST P200 SMAW200-H12S5K(BK)(LTR) OPT VR200 ICVS0518150FR_ R206 R209 1K 100 INV_CTL C R203 10K B TR_NXP Q200 MMBT3904(NXP) C 2 PDIM#2 GND 3 4 D13.2V D13.2V 5 6 D13.2V A13.2V A13.2V 7 8 GND 9 10 GND 12 PDIM#1 DRV_ON 11 E PWM_DIM2 2 OUT POWER_DET 1 C238 0.1uF GND POWER_DET_RESET RESET_IC_DIODES IC203-*1 E APX803E29 VCC 3 2 RESET 1 GND PWM_DIM L208 E TR_KEC Q200-*1 B 2N3904S 1 TR_KEC Q202-*1 2N3904S B R233 5.6K 1% C224 0.1uF 16V C TR_NXP Q202 MMBT3904(NXP) 3 OPT R237 0 R245 300 13 MLB-201209-0120P-N2 OPT . R200 10K C B PANEL_CTL PWR_ON Panel_Cgs_0.1uF C213-*1 0.1uF 50V 10% 1608 R246 4.7K KIC7529M2 L201 MLB-201209-0120P-N2 E M13.2V D S +3.3V_ST FET_3.3V_TOSHIBA Q204 SSM3J332R C214 4.7uF 10V +3.3V_NORMAL L204 PZ1608U121-2R0TF OPT ZD202 5V C218 10uF 6.3V C215 0.1uF 16V G S R221 12K AO3435 C241 0.1uF 25V Q204-*1 SUB_FET_3.3V_AOS +3.3V_Normal A13.2V G C205 0.1uF 25V D C203 10uF 25V OPT R216 10K R222 1.8K +1.8V_DDR POWER_ON/OFF R218 10K OPT R217 10K C C TR_NXP Q203 MMBT3904(NXP) B E TR_KEC Q203-*1 2N3904S B E +3.3V_NORMAL +1.8V_DDR IC200 AZ1117EH-ADJTRG1 IN C201 10uF 6.3V OUT R1 ADJ/GND R214 0 1% R212 3.9K OPT ZD205 5.1v ZD200 2.5V C208 10uF 6.3V R2 +5V_Normal & +1.15V_VDDC 1% R213 1.6K Check ESR!! Vout=1.25*(1+R2/R1)+I(ADJ)XR2 Vout=0.6(R1/R2)+0.6 +1.15V_VDDC M13.2V L206 4.7uH C223 1uF 10V 1 1/16W 1% BST1 LX1 FB1 1/16W 1% VREG C204 100pF 50V 2 3 7 6 BOOT SW AGND 3 ROSC/SYNC RSET FB2 SW_EN 5 14 6 13 12 11 10 9 C229 R235 3300pF 20K 50V BST2 LX2 VIN2 R247 3.3K +3.3V_NORMAL R231 0 C228 0.047uF 25V 3A 5 C207 2200pF 50V GND C210 22uF 10V 3216 125C R2 C235 47pF 50V +5V_NORMAL L207 4.7uH USB_OCD C211 22uF 10V 3216 125C C236 22uF 16V 3216 85C C239 22uF 16V 3216 85C +5V_USB CST Check!! 16V 22uF C225 22K R211 1% 1/16W C206 1uF 10V 4 R244 39K 1% R1 +5V_NORMAL SS R2 R242 200 1% R243 5.1K 1% C230 22pF 50V COMP2 8 NFAULT USB_CTL 16V 0.1uF C209 L202 2uH 16 IC202 4 SN1406035RGER 15 7 R227 4.7K OPT R229 91K OPT ZD204 5.1v C240 22uF 6.3V 17 PGND2 FB VIN OPT R250 +3.3V_NORMAL 300K SW_IN R1 8 OPT ZD201 5V SD05 OPT C217 4700pF 50V SW_OUT R208 68K 1 9 R204 6.2K EN THERMAL R248 33K [EP] OPT R249 300K R228 10K IC201 BD9D321EFJ R210 100K OPT C216 4700pF 50V C232 R240 3300pF 10K 50V COMP1 18 THERMAL 25 EN1 EN2 OPT C202 0.1uF 25V C237 22uF 6.3V C233 22pF 50V 19 PGND1 VIN1 V7V SS1 SS2 2 C200 10uF 25V OPT C234 10uF 6.3V OPT ZD203 2.5V R239 5.1K 1% R234 15K OPT C222 2200pF 50V 20 R226 10K 21 R223 10K 22 L200 BLM18PG121SN1D OPT C221 2200pF 50V OPT C231 82pF 50V R2 23 +3.3V_ST +3.3V_ST R238 4.7K 1% 0 R230 24 +3.3V_NORMAL M13.2V C220 10uF 25V [EP] C219 10uF 25V +3.3V_STANDBY R1 25V 0.047uF C226 L205 CB2012PK501T C227 1uF 16V Vout=0.6(R1/R2)+0.6 Vout=0.765*(1+R1/R2) THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Copyright ⓒ 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes L15_M1L POWER 141020 2 5 LGE Internal Use Only AUDIO AMP(TI)/LVDS/IR IR +3.3V_ST [51Pin LVDS Connector] (For FHD 60Hz) [30Pin LVDS Connector] (For HD 60Hz_Normal) AR303 10K 1/16W HD P301 KEY1 10031HR-30 FHD P300 OPT C338 0.1uF 16V VR302 SP14-11592-01-51Pin OPT 1 P302 P303 12507WR-08L 12507WR-10L 2 1 2 LVDS_SEL 3 VCOM_SDA_M 5 VCOM_SCL_M 6 9 13 14 15 16 17 V_COM R317 2K 1 1 2 2 3 3 4 4 5 5 6 6 7 7 L307 PZ1608U121-2R0TF C335 0.1uF 16V RXA1+ 12 RXA2- 13 RXA2+ RXA0- 14 RXA0+ 15 RXACK- RXA1- 16 RXACK+ RXA1+ 17 RXA2- 18 RXA3- RXA2+ 19 RXA3+ VCOM_SCL_M VCOM_SCL VCOM_SDA_M VCOM_SDA C336 1000pF 50V LED_RED V_COM OPT R323 2K OPT R324 2K OPT VR300 +3.3V_ST OPT R322 3.3K 8 IR 8 9 C339 100pF 50V LVDS_SEL 18 9 OPT VR303 10 +3.3V_NORMAL 11 20 19 20 RXACK- 21 RXACK+ 22 OPT R307 3.3K PANEL_VCC 21 OPT R306 10K 23 22 23 RXA3- 24 RXA3+ 25 24 HD L302 120OHM UBW2012-121F 26 25 33 +3.3V_ST AR302 0 11 12 32 RXA1- 10 11 31 OPT C337 0.1uF 16V OPT VR301 V_COM R316 2K RXA0+ 9 10 30 KEY2 +3.3V_NORMAL 8 OPT R301 10K 8 29 V-COM I2C or GPIO(Tuner) RXA0- 7 OPT R302 3.3K 7 28 VCOM_SDA_M +3.3V_NORMAL 6 27 VCOM_SCL_M 4 5 4 26 3 27 R300 0 R320 0 FHD_GND_26 28 FHD_GND_27 RXB0- HD C306 0.1uF 25V HD_VCC_Cap C303 10uF 25V 29 30 RXB0+ 31 RXB1RXB1+ RXB2RXB2+ 34 35 36 RXBCKRXBCK+ 37 38 39 RXB3RXB3+ 40 AUDIO AMP(TI) 41 FHD_GND_42_43 AR300 0 +13.2V_AMP A13.2V This parts are Located on AVSS area. R303 0 PANEL_VCC L301 44 1/16W 120OHM FHD L300 UBW2012-121F C307 0.1uF 50V 47 L304 SPK_L+ C311 4700pF 14 MCLK 15 OSC_RES 16 DVSSO 17 VR_DIG 18 PDN PVDD_AB_2 PVDD_AB_1 BST_A NC_1 SSTIMER NC_2 PBTL OUT_A 1 2 3 4 5 6 7 10.0uH NRS6045T100MMGK C332 0.1uF 50V C333 0.1uF 50V [EP] 48 PGND_AB_2 47 PGND_AB_1 46 OUT_B 45 NC_6 44 NC_5 43 BST_B 42 BST_C R313 18 SPK_L- 10.0uH NRS6045T100MMGK SPK_L+ NC_4 NC_3 SDIN 22 39 OUT_C SDA 23 38 PGND_CD_2 SCL 24 37 PGND_CD_1 C325 0.033uF 50V 36 SPK_R- OUT_D PVDD_CD_1 PVDD_CD_2 BST_D GVDD_OUT GND VREG AGND DVSS DVDD STEST RESET AR301 4.7K 1/16W +3.3V_NORMAL C308 0.1uF 16V C316 0.1uF 16V C323 10uF 25V C334 0.1uF 50V C328 330pF 50V C331 0.33uF 50V C329 330pF 50V AMP_SCL R315 18 2 SPK_R+ 1/16W 1% AUD_SCK +13.2V_AMP 3 SPK_R+ L303 10.0uH NRS6045T100MMGK R314 18 C321 0.1uF 50V 4 SPK_L- 40 AMP_RESET P304 250A1-WR-H04M 1/16W 1% C324 0.033uF 50V 41 AMP_SDA OPT C342 2200pF 50V L306 21 AUD_LRCH OPT C341 2200pF 50V SPEAKER_L C330 0.33uF 50V C327 330pF 50V 20 AUD_LRCK 1/16W 1% C326 330pF 50V C322 10uF 25V SCLK 25 +3.3V_NORMAL C320 0.1uF 50V LRCLK 35 C309 0.1uF 16V 34 POWER_DET OPT C302 1000pF 50V TAS5733 33 OPT R304 0 19 32 AMP_MUTE IC300 31 18K 1% 49 13 30 AUD_MASTER_CLK Need to Check. AVDD A_SEL_FAULT THERMAL R309 2.2K R308 12 C305 0.1uF 16V 8 VR_ANA 470 52 R305 4.7K R312 18 C315 2200pF 50V R310 29 0.047uF PLL_FLTP PLL_FLTM C310 +3.3V_NORMAL +3.3V_NORMAL 51 +13.2V_AMP AVSS FHD C301 0.1uF 25V 9 FHD_VCC_Cap C300 10uF 25V C318 0.033uF 50V C314 0.047uF 28 50 Close to Speaker C313 4700pF Separate DGND AND AVSS 48 49 R311 470 OPT 11 46 10 45 27 43 26 42 C340 0.1uF 50V OPT C343 2200pF 50V OPT C344 2200pF 50V 1 SPK Wafer Box Type SPEAKER_R 1/16W 1% L305 SPK_R- OPT ZD300 5V THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Copyright ⓒ 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes C317 1uF 16V C319 0.033uF 50V 10.0uH NRS6045T100MMGK C312 0.1uF 16V L15_M1L LVDS/S_AMP/IR 140828 3 5 LGE Internal Use Only EXTERNAL INTERFACE HDMI_1(REAR) OPT R414 AV/COMPONENT 10K C R410 1K JK401 PPJ245N2-01 TR_NXP Q400 MMBT3904(NXP) JK404 6E [RD2]E-LUG E OPT VR408 GND R409 10K SHIELD R418 10K HPD1 +5V_NORMAL C TR_KEC B Q400-*1 2N3904S 5V_DET_HDMI_1 R413 2.7K 20 COMP_R_IN B AR410 4.7K 1/16W E DDC_SDA_1 HP_DET 5E VR403 OPT [RD2]O-SPRING 19 OPT C402 1000pF 50V R402 470K 5V R408 12K 18 R416 4.7K VR409 OPT OPT VR404 DDC_SCL_1 GND OPT VR410 17 DDC_DATA OPT VR412 16 DDC_CLK 4E 15 [RD2]CONTACT NC R406 10K 14 CE_REMOTE COMP_L_IN 4C [WH]O-SPRING OPT C401 1000pF 50V EAG59023302 5D R401 470K VR401 OPT 13 +3.3V_NORMAL R407 12K AR401 10K 1/16W CK- 9 8 7 OPT VR402 6 5 5C [RD1]O-SPRING 4 COMP_Pr+ 5B [RD1]E-LUG-S ZD405 3 2 ZD404 7C OPT VA402 ICVS0518150FR_ L401 DLP11SA900HL2L CK_GND 11 10 COMP_DET [RD1]CONTACT AR406 5.1 1/16W AR407 5.1 1/16W 12 R405 75 1% comp-shape=1005 1 4 3 1 2 CK-_HDMI1 CK+ CK+_HDMI1 D0L402 DLP11SA900HL2L D0_GND D0+ 4 3 1 2 D0-_HDMI1 D0+_HDMI1 D1D1_GND L403 DLP11SA900HL2L 4 3 1 2 AR408 5.1 1/16W AR409 5.1 1/16W D1-_HDMI1 D1+ D1+_HDMI1 D2L404 DLP11SA900HL2L D2_GND D2+ 4 3 1 2 D2-_HDMI1 D2+_HDMI1 HDMI_EMI_Filter [BL]O-SPRING COMP_Pb+ ZD402 4A [GN/YL]CONTACT 5A [GN/YL]O-SPRING OPT VA401 ZD403 ICVS0518150FR_ R404 75 1% comp-shape=1005 HDMI_2(SIDE) AV_DET OPT VR400 6A Check!! HPD2 Pull-Up [GN/YL]E-LUG GND JK403 COMP_Y+ BODY_SHIELD R420 10 ZD401 UART For DEBUG OPT VA400 ICVS0518150FR_ R403 75 1% comp-shape=3216 USB(SIDE) +3.3V_ST EAG62611204 ZD400 JK400 +5V_USB OPT 1/16W 5% IC400 P401 MAX3232CDR M6 3AU04S-305-ZC-(LG) C400 0.1uF 16 1 15 2 14 3 M3_DETECT GND 4 M4 5 M5_GND AR400 100 1/16W DOUT1 13 4 12 5 C1- C406 0.1uF C405 0.1uF 22uF 16V 3216 22uF 10V 2012 22uF 10V 2012 ROUT1 DIN1 DIN2 ROUT2 P400 11 6 10 7 9 8 12507WS-04L EAN41348201 18 5V 17 GND 16 DDC_DATA 15 DDC_CLK 14 NC CE_REMOTE 12 CK- 11 10 9 8 7 4 SIDE_USB_DP RCLAMP0502BA OPT D400 OPT C413 5pF 50V 3 2 OPT C414 5pF 50V 1 +5V_NORMAL AR411 4.7K 1/16W 5V_DET_HDMI_2 DDC_SDA_2 13 5 C2+ C2- HP_DET SIDE_USB_DM 5 RIN1 V+ 22uF 16V 3216 19 6 USB DOWN STREAM 3 C1+ OPT C418 2 VCC 1 M1 C407 OPT C417 4 1 OPT ZD406 5V OPT C409 3 6 R400 0 HPD2 OPT VR406 OPT R411 1K R412 2.7K 20 KJA-PH-1-0177 R419 33 HDMI2_5V VR405 OPT VR407 OPT R415 4.7K DDC_SCL_2 OPT VR411 OPT VR413 OPT D401 CK_GND AR404 5.1 1/16W AR405 5.1 1/16W CK+ D0D0_GND IP4283CZ10-TBA 1 10 2 9 3 8 4 7 D0-_HDMI2 5 6 D0+_HDMI2 1 10 D1-_HDMI2 2 9 D1+_HDMI2 D0+ CK-_HDMI2 CK+_HDMI2 D1D1_GND AR402 5.1 1/16W D1+ D2D2_GND AR403 5.1 1/16W 3 8 4 7 D2-_HDMI2 5 6 D2+_HDMI2 D2+ D402 IP4283CZ10-TBA C404 0.1uF OPT V- DOUT2 C403 0.1uF RIN2 SPDIF OPTIC JACK +3.3V_NORMAL 1 SPDIF JK402 2 PM_TXD PM_RXD OPT THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Copyright ⓒ 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes C408 1uF 10V ESD Ready SPDIF C412 18pF 50V JP425 JP424 2 FIX_POLE 4 SPDIF_OUT JP423 VINPUT JP422 5 Fiber Optic VCC 4 3 GND 3 1 JST1223-001 L15_M1L COMP/USB/SPDIF 141020 4 5 LGE Internal Use Only 3.3V_NORMAL -> 3.3V_TU TUNER for ATSC W/O Isolator +3.3V_NORMAL +3.3V_TU L500 PZ1608U121-2R0TF C507 0.1uF 16V C508 22uF 6.3V C509 22uF 6.3V C510 0.1uF 16V +3.3V_TU TU501 TDJH-H301F C500 100pF 50V C503 0.1uF 16V close to the tuner pin 1 2 3 4 5 6 7 8 9 IF_AGC_MAIN +3.3V C502 0.1uF 16V should be guarded by ground NC_1 +3.3V_TU DIF_AGC SCL_RF R502 1.8K AR500 33 1/16W SDA_RF R503 1.8K TU_SCL TU_SDA DIF[P] C501 15pF 50V C504 15pF 50V OPT C505 20pF 50V OPT C506 20pF 50V DIF[N] SIF R501 33 IF_P_MSTAR 1/16W 5% CVBS R500 33 IF_N_MSTAR 1/16W 5% A1 A1 B1 B1 Close to the tuner 47 SHIELD TU_GND_A 1. should be guarded by ground 2. No via on both of them 3. Signal Width >= 12mils Signal to Signal Width = 12mils Ground Width >= 24mils THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Copyright ⓒ 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes L15_M1L TUNER 140822 5 5 LGE Internal Use Only
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