Samsung SGH-J400 service manual

Transcription

Samsung SGH-J400 service manual
GSM TELEPHONE
SGH-J400
GSM TELEPHONE
CONTENTS
1.
Safety Precautions
2.
Specification
3.
Product Function
4.
Array course control
5.
Exploded View and Parts List
6.
Main Electrical Parts List
7.
Block Diagrams
8.
PCB Diagrams
9.
Flow Chart of Troubleshooting
10.
Reference data
11.
Disassembly and Assembly
Instructions
GSPN (Global Service Partner Network)
Country
North America
Latin America
CIS
Europe
China
Asia
Mideast & Africa
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
Web Site
service.samsungportal.com
latin.samsungportal.com
cis.samsungportal.com
europe.samsungportal.com
china.samsungportal.com
asia.samsungportal.com
mea.samsungportal.com
ⓒ
Samsung Electronics Co.,Ltd.
2007. 11. Rev.1.0
1. Safety Precautions
1-1. Repair Precaution
― Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test, because the specification of cellular phone is sensitive for
surrounding interference(RF noise).
― Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
― Surely use a standard screwdriver when you disassemble this product, otherwise screw will be
worn away.
― Use a thicken twisted wire when you measure level.
A thicken twisted wire has low resistance, therefore error of measurement is few.
― Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
― Take specially care of soldering, because Land of PCB is small and weak in heat.
― Surely tune on/off while using AC power plug, because a repair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
― Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
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Safety Precautions
1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
― Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.
― Use earthed soldering steel when you connect or disconnect ESD.
― Use soldering removing tool to break static electricity. , otherwise ESD will be damaged by
static electricity.
― Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
― You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or a circuit board.
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2. Specification
2-1. GSM General Specification
G SM900
Pha se 1
EG SM 90 0
Pha se 2
DCS1 800
Phase 1
PCS1 900
WCDMA 2100
Fr eq.
Ba nd[MHz]
Uplink/Downlin
k
89 0~915
93 5~960
88 0~915
92 5~960
1710~1 785
1805~1 880
1850~1 910
1930~1 990
1922 ~ 1977
2112 ~ 2167
ARFCN ran ge
1 ~124
0 ~124 &
975 ~1023
512~8 85
512~8 10
UL : 9612 ~ 9888
DL : 10562 ~
10838
Tx/Rx spacin g
4 5MHz
4 5MHz
95MHz
80MHz
190 MHz
270.8 33kbps
3.69 2us
3.84 Mcp s
Mod . Bit r ate/ 270. 833kbp s 270. 833kbp s 2 70.83 3kbps
Bi t Peri od
3. 692us
3. 692us
3.69 2us
Tim e Slot
Per iod / Fr am e
Per iod
57 6.9us
4.6 15ms
57 6.9us
4.6 15ms
576. 9us
4 .615ms
576. 9us
4 .615ms
Fr ame Leng th
:10ms
Slot lengt h
:0 .667ms
Mo dulat ion
0. 3G MSK
0. 3G MSK
0.3G M SK
0.3G MSK
Q PS K
HQ PSK
MS Power
33dBm~13d 33dBm~5dB
3 0dBm~0 dBm 30dBm~ 0dBm 24dBm ~ -5 0 dBm
Bm
m
Po wer Class
5p cl ~
1 5pcl
5pcl ~ 19pcl
0pcl ~ 15pcl
0pcl ~ 15pcl
3
(max + 2 4dBm)
Sen sitivity
-102 dBm
-102 dBm
- 100dBm
- 100dBm
-106 .7 dBm
TDMA Mu x
8
8
8
8
Cell Radius
3 5Km
3 5Km
2Km
-
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2 Km
Specification
2-2. GSM TX power class
TX Power
control level
GSM900
TX Power
control level
DCS1800
TX Power
control level
PCS1900
5
33±2 dBm
0
30±2 dBm
0
30±2 dBm
6
31±2 dBm
1
28±3 dBm
1
28±3 dBm
7
29±2 dBm
2
26±3 dBm
2
26±3 dBm
8
27±2 dBm
3
24±3 dBm
3
24±3 dBm
9
25±2 dBm
4
22±3 dBm
4
22±3 dBm
10
23±2 dBm
5
20±3 dBm
5
20±3 dBm
11
21±2 dBm
6
18±3 dBm
6
18±3 dBm
12
19±2 dBm
7
16±3 dBm
7
16±3 dBm
13
17±2 dBm
8
14±3 dBm
8
14±3 dBm
14
15±2 dBm
9
12±4 dBm
9
12±4 dBm
15
13±2 dBm
10
10±4 dBm
10
10±4 dBm
16
11±3 dBm
11
8±4dBm
11
8±4dBm
17
9±3dBm
12
6±4 dBm
12
6±4 dBm
18
7±3 dBm
13
4±4 dBm
13
4±4 dBm
19
5±3 dBm
14
2±5 dBm
14
2±5 dBm
15
0±5 dBm
15
0±5 dBm
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3. Product Function
Main Function
― Mobile Instant Messaging
― Built-In Digital Camera with flash and Video Capture
― MP3 Player, and Java Games
― Hands-free speaker phone
― Bluetooth Wireless Technology
― Organizer feature provides Calendar, Alarms, Calculator, and Converter
― Multimedia Messaging Service-send and receive text messages with animation and sound
― Text Messaging Service-send and receive alphanumeric messages and Email
― Media Net Internet browsing
― Support 64 note polyphonic ringtones, MP3 ringtones, and AAC ringtones
― Tripple band(900/1800/1900MHz), WCDMA2100
― VGA Camera
― GPRS Class 10
― EGPRS Class E2
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Product Function
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4. Array course control
4-1. Software Adjustments
1.
2.
3.
4.
5.
6.
JIG: Download, Trace, Calibration, etc [ GH80-03308A
RF test cable: RF test [ GH39-00397A ]
Test cable: JIG to phone [ GH39-00971A ]
TA (Travel Adaptor - S20pin ) [ GH44-01702A ]
Data Link Cable : USB cable (S20) [ GH39-00922A ]
Serial cable: PC to JIG
]
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Array course control
4-2. Software Downloading
4-2-1. Downloading Binary Files
• Five binary files for downloading J400
– J400BGGJ2.img : Modem binary for communication function
& Mocha binary for user interface and various application
– J400BGGJ2._calset.img
: Dependent Parameter Set
– J400BGGJ2.rc1: Files need for each application, Power on/off
& Back charging animation
– J400BGGJ2.tfs : Default file system to be put into in initial production
4-2-2. Pre-requsite for Downloading
• Downloader Program(BCM2133 Downloader v1.65(D).exe)
• SGH-J400 Mobile Phone
• USB Data Link Cable
• Binary files
4-2-3. S/W Downloader Program
1. Load the binary download program by executing the “BCM2133 Downloader
v1.65(D).exe" and initially check Include "Calset Data" and "All Images Download to
NOR + NAND"
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Array course control
2. Press the button "D/L Bootloader" and then check '"OK" for downloading Bootloader.
3. Select the binary file what you want to download
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Array course control
3. Select the binary file what you want to download
4. Now press the button 'START' and SGH-J400 connets with cable
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Array course control
5. When checking is completed, Press Nand Erase.
6. Now press the button 'Download'.
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Array course control
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5. Exploded View and Parts List
5-1. Cellular phone Exploded View
QFR01
QVO01
QKP01
QFU01
QMI03
QME01
QMC16
QMI01
QCA01
QCR04
QLC01
QSH01
QSP01
QMO01
QCR04
QCB01
QMP01
QAN02
QCR12
QFL01
QHI01
QSD01
QCR12
QSC01
QRE01
QMW01
QIF01
QCR04
QCR04
QRF01
QBA01
QBA00
5-1
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Exploded View and Parts List
5-2. Cellular phone Parts List
Design LOC
Description
SEC CODE
QAN02
INTENNA-SGHJ400
GH42-01385A
QBA00
PMO COVER-BATT
GH72-43670B
QBA01
INNER BATTERY PACK-880MAH,BLK,
GH43-02934A
QCA01
CAMERA MODULE-SGHJ400
GH59-04949A
QCB01
CBF COAXIAL CABLE-SGHJ400
GH39-00964A
QCR04
SCREW-MACHINE
6001-001479
QCR04
SCREW-MACHINE
6001-001479
QCR04
SCREW-MACHINE
6001-001479
QCR12
SCREW-MACHINE
6001-001530
QFR01
ASSY CASE-FRONT
GH98-05887B
QFU01
ASSY CASE-FOLDER UPPER(XEC/ME_
GH98-06786B
QKP01
ASSY KEYPAD-(D_GRY/XEC)
GH98-05890A
QLC01
ELA ETC-SGHJ400 LCD MODULE
GH96-02779A
QMC16
PCB-CON TO CON(J400)
GH41-01869A
QMO01
MOTOR DC-SGHJ400
GH31-00381A
QMP01
PBA MAIN-SGHJ400
GH92-04103A
QMW01
ASSY COVER-MAIN WINDOW(XEC)
GH98-06961A
QRF01
TAPE-RF HOLE CAP
GH74-34588B
QSC01
RMO RUBBER-SCREW CAP
GH73-11130A
QSH01
ASSY BRACKET-SHIELD
GH98-05950A
QSP01
SPEAKER
3001-002249
QVO01
PMO KEY-VOLUME
GH72-43637B
QRE01
ASSY CASE-REAR
GH98-05888B
QIF01
PMO COVER-IF
GH72-44229B
QSD01
PMO COVER-MICRO SD
GH72-43636B
KEY FPCB-MAIN KEY PBA
GH59-04931A
QMI01
AS-MIC (KEY PBA)
GH81-06102A
QMI03
AS-SPHW2900_MAIN MIC RUBBER HO
GH81-06629A
ASSY CASE-FOLDER LOWER
GH98-05886A
ASSY HINGE-FOLDER
GH98-03681A
QME01
QFL01
QHI01
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Exploded View and Parts List
Description
SEC CODE
BAG PE
6902-000634
FPCB ANTENNA CHIP-SGHJ400
GH42-01434A
ADAPTOR-ATADS10EBE,BLK,EU
GH44-01702A
EARPHONE
GH59-04556A
LABEL(P)-UNIT SEAL
GH68-00518B
LABEL(R)-WATER SOAK
GH68-09361A
MANUAL USERS-SMS LEAFLET
GH68-16463A
MANUAL USERS-XEC LEAFLET
GH68-16464A
MANUAL USERS-XEC SPANISH
GH68-16632A
LABEL(R)-MAIN(EU)
GH68-16669A
CUSHION-CASE(EU)
GH69-05985A
BOX-UNIT(XEC)
GH69-06130D
RMO RUBBER-LCD SIDE
GH73-10936A
MPR-TAPE
GH74-27509A
TAPE-HINGE DECO 2
GH74-34028A
TAPE-LCD CON
GH74-34037A
TAPE INSU-CAM CON
GH74-34038A
TAPE INSU-LCD CON
GH74-34039A
TAPE-LCD SIDE
GH74-34043A
TAPE-FPCB DUST
GH74-34137A
TAPE-INTENNA EMI
GH74-34394A
TAPE INSU
GH74-34655A
TAPE-REMOVE
GH74-35112A
CBF SIGNAL-SPHA560 RF CABLE
GH39-00397A
0.4M
CBF INTERFACE-SGHJ750 TEST CAB
GH39-00968A
1.5M
CBF INTERFACE-SGHJ750 TEST CAB
GH39-00971A
INSTALL-TEST JIG BOX
GH80-03308A
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Exploded View and Parts List
5-4
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6. Main Electrical Parts List
SEC Code
Design LOC
Description
STATUS
0403-001547
0403-001547
0404-001172
0404-001245
0406-001254
0406-001254
0406-001254
0406-001254
0406-001254
0406-001254
0406-001254
0406-001254
0406-001254
0406-001256
0406-001286
0406-001286
0502-001201
0504-001151
0505-001332
0505-001464
0801-003016
0801-003016
0801-003016
0801-003016
0801-003022
0801-003058
0801-003130
0801-003140
0801-003140
1001-001394
1001-001394
1108-000104
1201-002305
1201-002323
1201-002576
1201-002606
1203-004792
1203-004792
1203-004793
1203-004799
1205-002942
1205-003099
1205-003103
1205-003104
1404-001221
1405-001108
1405-001108
2007-000070
2007-000070
2007-000145
2007-000148
2007-000148
2007-000148
D800
ZD803
D500
D600
D700
D701
D802
D803
U816
U817
ZD600
ZD601
ZD602
D601
ZD801
ZD802
Q600
Q601
Q500
Q602
U502
U600
U602
U800
U302
U102
U605
U101
U304
U802
U803
UME500
PAM300
U300
PAM100
U700
U601
U604
U606
U603
U303
U200
UCP500
UCP400
V400
V800
V801
R103
R300
R301
R109
R410
R412
DIODE-ZENER
DIODE-ZENER
DIODE-SCHOTTKY
DIODE-SCHOTTKY
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
TR-POWER
TR-DIGITAL
FET-SILICON
FET-SILICON
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-ANALOG SWITCH
IC-ANALOG SWITCH
IC-MCP
IC-POWER AMP
IC-RF AMP
IC-POWER AMP
IC-AUDIO AMP
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POWER SUPERVISOR
IC-TRANSCEIVER
IC-TRANSCEIVER
IC-MODEM
IC-COMM. CONTROLLER
THERMISTOR-NTC
VARISTOR
VARISTOR
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
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Main Electrical Parts List
SEC Code
Design LOC
Description
STATUS
2007-000148
2007-000148
2007-000148
2007-000148
2007-000148
2007-000148
2007-000156
2007-000159
2007-000159
2007-000159
2007-000159
2007-000159
2007-000159
2007-000162
2007-000162
2007-000162
2007-000162
2007-000162
2007-000162
2007-000162
2007-000162
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000172
2007-000172
2007-000172
2007-000242
2007-000242
2007-001288
2007-001288
2007-001316
2007-001339
2007-003006
2007-003006
2007-003019
2007-007008
2007-007008
2007-007008
2007-007008
2007-007100
2007-007137
R506
R508
R600
R602
R702
R712
R809
R615
R616
R617
R618
R619
R620
R416
R418
R420
R503
R504
R509
R608
R609
L303
R201
R204
R206
R303
R402
R409
R426
R500
R501
R502
R604
R607
R623
R200
R707
R708
R612
R613
R100
R104
R210
R813
R807
R808
R710
R101
R102
R105
R106
R603
R700
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
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Main Electrical Parts List
SEC Code
Design LOC
Description
STATUS
2007-007137
2007-007137
2007-007137
2007-007148
2007-007318
2007-007318
2007-007318
2007-007489
2007-007489
2007-007489
2007-007573
2007-007741
2007-007869
2007-007981
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008354
2007-008401
2007-008419
2007-008478
2007-008516
2007-008516
2007-008516
2007-008516
2007-008542
2007-008542
2007-008542
2007-008542
2007-008581
2007-008581
2007-008581
2007-008581
2007-008581
2007-008581
2007-008581
2007-008581
2007-008581
2007-008581
2007-008581
2007-009084
2007-009084
2007-009084
2007-009084
2007-009108
R705
R711
R713
R621
R408
R709
R714
R304
R403
R816
R815
R817
R606
R401
R411
R414
R415
R417
R419
R421
R422
R423
R505
R801
R814
R407
R406
R611
R400
R413
R424
R425
R614
R205
R207
R208
R209
R431
R432
R433
R434
R435
R436
R437
R438
R439
R440
R441
R404
R405
R507
R803
R812
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SA
SA
SA
SA
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Main Electrical Parts List
SEC Code
Design LOC
Description
STATUS
2007-009157
2007-009157
2007-009170
2007-009361
2203-000233
2203-000233
2203-000233
2203-000254
2203-000254
2203-000254
2203-000254
2203-000254
2203-000278
2203-000278
2203-000278
2203-000330
2203-000330
2203-000425
2203-000438
2203-000438
2203-000438
2203-000438
2203-000438
2203-000438
2203-000438
2203-000679
2203-000679
2203-000812
2203-000812
2203-000812
2203-000812
2203-000812
2203-000812
2203-000812
2203-000812
2203-000854
2203-000940
2203-000995
2203-000995
2203-000995
2203-000995
2203-000995
2203-000995
2203-000995
2203-001072
2203-001072
2203-001153
2203-001383
2203-001405
2203-002443
2203-002677
2203-003054
2203-003054
R810
R811
R800
R622
C317
C328
C620
C205
C227
C228
C229
C523
C119
C327
C830
C118
C234
C713
C116
C117
C121
C122
C238
C322
C829
C506
C634
C100
C112
C115
C233
C702
C718
C819
C826
C223
C329
C310
C311
C709
C714
C726
C801
R302
C805
C806
C111
C303
C808
C318
C109
C724
C728
R-CHIP
R-CHIP
R-CHIP
R-CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
6-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Main Electrical Parts List
SEC Code
Design LOC
Description
STATUS
2203-005158
2203-005158
2203-005288
2203-005288
2203-005288
2203-005288
2203-005382
2203-005382
2203-005393
2203-005395
2203-005395
2203-005444
2203-005444
2203-005444
2203-005482
2203-005482
2203-005482
2203-005552
2203-005552
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005717
2203-005736
2203-005736
2203-005736
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006121
2203-006121
2203-006194
2203-006194
2203-006194
C214
C216
C106
C230
C231
R305
C615
C638
C614
L304
L310
C224
C226
C308
C319
C406
C410
C220
C222
C101
C102
C104
C108
C202
C207
C235
C236
C237
C419
C420
C421
C422
C305
C113
C120
C316
C306
C502
C504
C641
C708
C711
C715
C717
C725
C727
C803
C825
C301
C302
C217
C225
C400
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
6-5
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Main Electrical Parts List
SEC Code
Design LOC
Description
STATUS
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006260
2203-006305
2203-006305
2203-006348
2203-006361
2203-006361
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
C401
C513
C518
C520
C608
C722
C221
C212
C219
C627
C612
C616
C213
C218
C405
C413
C415
C424
C500
C501
C503
C505
C510
C514
C516
C521
C601
C603
C604
C605
C607
C613
C618
C619
C624
C628
C632
C633
C639
C712
C200
C201
C203
C206
C208
C209
C211
C215
C402
C404
C407
C409
C411
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
6-6
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Main Electrical Parts List
SEC Code
Design LOC
Description
STATUS
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006556
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006626
2203-006681
2203-006824
2203-006824
2203-006824
2203-006824
2203-006824
2203-006824
2203-006824
2203-006824
2203-006824
2203-006825
2203-006825
2203-006838
2203-006838
2203-006838
2203-006838
2203-006838
2203-006838
2203-006838
2203-006838
2203-006838
2203-006979
2404-001381
2404-001430
C414
C417
C418
C423
C425
C507
C508
C509
C511
C512
C515
C517
C519
C522
C706
C710
C721
C804
C307
C103
C323
C403
C602
C617
C630
C636
C809
C818
C416
C701
C600
C606
C609
C611
C622
C625
C626
C629
C631
C700
C705
C300
C321
C326
C408
C412
C610
C621
C623
C707
C210
TA800
TA801
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-TA,CHIP
C-TA,CHIP
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
6-7
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Main Electrical Parts List
SEC Code
Design LOC
Description
STATUS
2404-001465
2404-001465
2404-001496
2703-001178
2703-001178
2703-001722
2703-001747
2703-001747
2703-002199
2703-002203
2703-002204
2703-002208
2703-002208
2703-002268
2703-002309
2703-002314
2703-002314
2703-002314
2703-002314
2703-002365
2703-002368
2703-002369
2703-002608
2703-003182
2703-003182
2801-003856
2809-001327
2901-001286
2901-001286
2901-001286
2901-001286
2901-001286
2901-001408
2904-001769
2904-001788
2909-001279
2910-000044
2911-000089
3301-001438
3301-001438
3301-001438
3301-001438
3301-001438
3301-001438
3301-001438
3301-001438
3301-001438
3301-001438
3301-001438
3301-001534
3301-001534
3301-001659
3301-001756
TA700
TA701
TA100
L207
L208
L204
L205
L206
L309
L308
L305
L312
R110
L307
C313
L102
L103
L301
L302
R107
L300
C309
R108
L600
L601
OSC600
TCX200
F801
F802
F803
F804
F805
F800
F200
F300
F302
DUF300
U103
L700
L701
L702
L703
L704
L705
L800
L801
L802
L805
L806
L803
L804
L311
L200
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
CRYSTAL-SMD
OSCILLATOR-VCTCXO
FILTER-EMI SMD
FILTER-EMI SMD
FILTER-EMI SMD
FILTER-EMI SMD
FILTER-EMI SMD
FILTER-EMI SMD
FILTER-SAW
FILTER-SAW
FILTER-LC
DUPLEXER-SAW
DUPLEXER-FEM
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
6-8
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Main Electrical Parts List
SEC Code
Design LOC
Description
STATUS
3301-001756
3301-001756
3301-001756
3705-001358
3705-001448
3709-001453
3710-002499
3711-005296
3711-006256
3711-006278
4302-001181
L201
L202
L203
RFS101
RFS100
CD600
IFC800
HEA801
BTC801
HEA800
BAT600
BEAD-SMD
BEAD-SMD
BEAD-SMD
CONNECTOR-COAXIAL
CONNECTOR-COAXIAL
CONNECTOR-CARD EDGE
SOCKET-INTERFACE
HEADER-BOARD TO BOARD
HEADER-BATTERY
HEADER-BOARD TO BOARD
BATTERY-LI(2ND)
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Please consult the GSPN website (Samsung Portal) for the most recent version of the product's
part list.
6-9
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Main Electrical Parts List
6-10
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
7. Block Diagrams
7-1. Base Band Solution Block Diagram
Main LCD
176x220 QCIF(2.0”)
262K color, TFT
LCD
Camera Module
QCIF
1/24” Sensor
Sub LCD
Camera Module
1.3M
LSI 1/5” Sensor
96x96 B/W(1.00”)
CSTN DTC LCD
Folder
Speaker
13*18. 3.5t
Motor (10 ø,3.0T)
MAIN
Bluetooth(BCM2045)
V2.0 / HCI
SIM Card
1.8V/3.0V Support
Memory (SEC)
NOR(256Mbit)
NAND(256Mbit)
UtRAM(256Mbit)
Burst Mode support
(NOR, UtRAM)
BCM2133
AUDIO AMP
(LM4937)
(10x10-BGA302)
GSM/GPRS/
EDGE
USB/SPI
ARM926EJ
(156MHz)
I2C Interface
TeakLite DSP
Vocoder/Codec
Camera I/F
(2M pixel)
MPEG4 15fps
Video Acc
MIDI/MP3,4
AAC/AAC+/AMR
USIM I/F
RF Interface
RF Block
PMB6952 (Transceiver)
AWT6172(GSM PAM)
WS2512-G(UMTS PAM)
LMG006F-5174A(ASM)
Intenna
BCM2141
Earphone
(S20 pin)
MIC
(4 ø x 1.0t)
External IO Interface
UART 1
USB 2.0
PMU(BCM59001)
11ch LDOs
2ch DC/DC(300mA)
I2C Interface / RTC
Charger (USB/TA)
(7x7-BGA144)
WCDMA
ARM7TDMI-S
RF Interface
7-1
Battery(BYD)
880mA / 533640
7-2
B7646
Duplexer
DUF302
UMTS_2100_TRX
(RFS100 )
FEM
RF Con.
(C100)
BGA622L7
LNA
(U303)
AWT6275
PAM
(PAM303)
GSM_TX
SAW
(F303)
WCDMA_TX
AWT6172
GSM PAM
(PAM100)
FAR-F6KB-2G1400-B4GCHZ
FAR-F6KB-1G9500-B4GJ
SAW
(F305)
DPCS_TX
LMG006F-5175A
PCS_RX
DCS_RX
GSM_RX
Polar
Modulator
LNA
3.8GHz
TX
Synthesizer
RX
Synthesizer
Infineon Transceiver
PMB6952 (U200)
ΣΔ
3-wire bus
control
LF
Fractional -NPLL
Modulator
ADC
Bryce Par k
20 June ’06
TX_Q
TX_I
RX_Q
WCDMA
Main Chip
BCM2141
(U600)
RX_I
1XTV26000UCJ
TCX200
VC-TCXO(26MHZ)
~
Q
I
GSM
Main Chip
BCM2133
(UCP500 )
Block Diagrams
7-2. RF Solution Block Diagram
8. PCB Diagrams
- Main top view
8-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
PCB Diagrams
- Main bottom view
8-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
9. Flow Chart of Troubleshooting
9-1. Power On
' Power On ' does not work
Yes
No
Check the Battery Voltage
is more than 3.4V
Change the Battery
Yes
No
R611(U803 BB_RESET) is
2.9V?
Check the PMIC (U603)
Yes
No
Q600 outputs are
2.9V and 1.8V?
Check the Q600(Level Shifter)
Yes
No
Check the OSC600
OSC600 is 32.768Khz?
Yes
No
Each Level Shifter and PMIC
outputs are OK?
Check the PMIC(U603) related Level
Shifer output
Yes
Check the initial operation
Yes
END
9-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
9-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
9-2. Sim Part
Phone can't access SIM Card
Yes
No
CD600 VDD_SIM_3.0V = "H"?
Check the SIM POWER
Yes
No
After Power ON,
Check C634(SIM_CLK Signal)
in a few second
Check the Clock
Yes
No
After SIM card insert,
SIM_RST (C635) = "H"?
Replace PBA
Yes
Check the SIM Card
END
9-3
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Flow Chart of Troubleshooting
9-4
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9-3. Speaker Part
Speaker does not work
Yes
No
C705(VDD_B_2.9V) =
2.9V
Check the U603
Yes
No
Check the U700 work
correctly
Check the U700
Yes
No
Is Speaker working?
Change the Speaker
Yes
END
9-5
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9-6
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9-4. Microphone Part
Microphone does not work
Yes
No
Check the connection
from MIC
Resolder MIC
Yes
No
Check the circuit
from UCP400 to MIC
Resolder the related component
Yes
No
Check the MIC
Replace the MIC
Yes
END
9-7
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9-8
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9-5. Key Data Input
Check Initial Operation
Yes
No
When one of the keys is
pushed,
is it displayed on LCD?
Check the Dome sheet & Key Pad
Yes
No
When one of the keys is
pushed,
KEY_IO signal is OK?
Replace the PBA
Yes
END
9-9
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Flow Chart of Troubleshooting
9-6. LCD Back Light
Backlight does not work
Yes
No
R817(LCD_LED_ON) of
HEA800 is high?
Check the UCP400
Yes
Replace the LCD Module
Yes
END
9-10
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9-11
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9-7. CAMERA PART
"Camera" function does not work
Yes
No
Connect the LCD connector
Check the LCD connector
Yes
No
Check the camera
connector
Connect the camera module
Yes
No
HEA800 PIN10(R812)
(CAM_VDD_EN) = 'H'?
Check UCP400
Replace the camera
module
END
9-12
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9-13
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9-8. Charging Part
"Charging" function does not work
Yes
No
Check the U603
PIN 28 = '5V' ?
Check the TA connection
and
Yes
check the U603
END
9-14
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Flow Chart of Troubleshooting
9-9. GSM Receiver
RX ON
RF input : CH center freq : +67.7kHz
Amp : -50dBm
Yes
No
C112
>= -53dBm
Resolder RFS101(RF CN)
Yes
C116 = 2.5V
C121,C117,C122 =0V
No
Resolder U603(PMIC)
Yes
C214,C216
>= -60dBm
No
Resolder U103(ASM)
Yes
Resolder
U200(TRANCEIVER)
END
9-15
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Flow Chart of Troubleshooting
9-10. GSM Transmitter
TX ON (5Level)
Yes
Yes
U103 pin19
≥ 30dBm
Resolder RFS100,C112,L102
No
RFS100 pin25
≥ 30dBm
Yes
VDD = H (2.5V),
VC1 , VC2 = 1.5V
VC3= 0
No
Check ANT Switch
control circuit
Yes
No
Change or Resolder U103
PAM100 pin11
≥ 30dBm
Yes
Resolder or Change R108
No
PAM100 pin7
≥ -4dBm
Yes
Check PAM100
pin2,3,4,5,8 is ok?
Yes
Resolder or Change PAM100
No
No
Check U200
END
9-16
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Check VBAT or PAM
control signal
Flow Chart of Troubleshooting
9-11. DCS Receiver
RX ON
RF input : CH center freq : +67.7kHz
Amp : -50dBm
Yes
No
C112
>= -53dBm
Resolder RFS101(RF CN)
Yes
C116 =2.5V
C117, C122= 1.5V
C121=0V
No
Resolder U603(PMIC)
Yes
C224,C226
>= -60dBm
No
Resolder U103(ASM)
Yes
Resolder
U200(TRANCEIVER)
END
9-17
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Flow Chart of Troubleshooting
9-12. DCS Transmitter
TX ON (5Level)
Yes
Yes
U103 pin19
≥ 25dBm
Resolder RFS101,C112,L103
No
Yes
U103 pin22
≥ 25dBm
VDD = H (2.5V),
VC1 = 1.5V
VC2, VC3= 0
No
Check ANT Switch
control circuit
Yes
No
Change or Resolder U103
PAM100 pin17
≥ 25dBm
Yes
Resolder or Change R107
No
PAM100 pin1
≥ -4dBm
Yes
Check PAM100
pin2,3,4,5,8 is ok?
Yes
Resolder or Change PAM100
No
No
Check U200
END
9-18
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Check VBAT or PAM
control signal
Flow Chart of Troubleshooting
9-13. PCS Receiver
RX ON
RF input : CH center freq : +67.7kHz
Amp : -50dBm
Yes
No
C112
>= -53dBm
Resolder RFS101(RF CN)
Yes
No
C116 =2.5V
C117 = 1.5V
C121, C122= 0V
Resolder U603(PMIC)
Yes
No
C220,C222
>= -60dBm
Resolder U103(ASM)
Yes
Resolder
U200(TRANCEIVER)
END
9-19
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Flow Chart of Troubleshooting
9-14. PCS Transmitter
TX ON (5Level)
Yes
Yes
U103 pin19
≥ 25dBm
Resolder RFS101,C112,L103
No
Yes
U103 pin22
≥ 25dBm
VDD = H (2.5V),
VC1 = 1.5V
VC2, VC3= 0
No
Check ANT Switch
control circuit
Yes
No
Change or Resolder U103
PAM100 pin17
≥ 25dBm
Yes
Resolder or Change R107
No
PAM100 pin1
≥ -4dBm
Yes
Check PAM100
pin2,3,4,5,8 is ok?
Yes
Resolder or Change PAM100
No
No
Check U200
END
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Check VBAT or PAM
control signal
Flow Chart of Troubleshooting
9-15. WCDMA Receiver
RX ON
RF input : CH center freq : +67.7kHz
Amp : -50dBm
Yes
C112
>= -53dBm
Resolder RFS101(RF CN)
No
Yes
C116=2.5V
C121, C122= 1.5V
C117 =0V
Check U603(PMIC)
No
Yes
C119
>= -60dBm
Yes
Resolder U103(ASM)
No
L300
>= -60dBm
Resolder DUF300(Duplexer)
No
C307
>=2.75V
Check U603(PMIC)
Yes
C310
>= -50dBm
Resolder U300(LNA)
C230,C231
>= -53dBm
Resolder F200(SAW)
Resolder
U200(TRANCEIVER)
END
9-21
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Flow Chart of Troubleshooting
9-16. WCDMA Transmitter
TX ON (5Level)
Yes
U103 pin19
≥ 23dBm
Yes
Resolder RFS101,C112,L103
No
U103 pin17
≥ 23dBm
Yes
Check ANT Switch
control circuit
Yes
No
DUF300
≥ 23dBm
No
VDD = H (2.5V),
VC1,VC3 = 1.5V
VC2, = 0
Change or Resolder U103
Yes
Resolder or Change C119
No
PAM300 pin8
≥ -5dBm
Yes
Check PAM300
pin2,3,4,5,8 is ok?
Yes
Resolder or Change PAM300
No
No
F300 pin8
≥ -5dBm
Yes
Resolder or Change L304, L310
No
Check U200
END
9-22
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Check VBAT or PAM
control signal
Flow Chart of Troubleshooting
9-23
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Flow Chart of Troubleshooting
9-24
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Flow Chart of Troubleshooting
9-25
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9-26
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10. Reference data
Reference Abbreviate
― AAC
: Advanced Audio Coding.
― AVC
: Advanced Video Coding.
― BER
: Bit Error Rate
― BPSK : Binary Phase Shift Keying
― CA
: Conditional Access
― CDM
: Code Division Multiplexing
― C/I
: Carrier to Interference
― DMB : Digital Multimedia Broadcasting
― EN
: European Standard
― ES
: Elementary Stream
― ETSI : European Telecommunications Standards Institute
― MPEG: Moving Picture Experts Group
― PN
: Pseudo-random Noise
― PS
: Pilot Symbol
― QPSK : Quadrature Phase Shift Keying
― RS
: Reed-Solomon
― SI
: Service Information
― TDM : Time Division Multiplexing
― TS
: Transport Stream
10-1
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Reference data
10-2
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11. Disassembly and Assembly Instructions
11-1. Disassembly Instructions
1
2
①
②
③
1) Unscrew the 4 points.
1) Disjoin the connectors (①②③) from the
2) Separate the REAR from the FRONT ass'y
PBA.
using assembly stick.
2) Unscrew the 2 points.
※ Caution
※ Caution
1) Be care of scratch and molding damage.
1) Be care of scratch and molding damage.
1) Be care of damage to the FPCBs.
4
3
1) Take out the PBA.
Push the hinge with a thin stick to
2) Unscrew the 2 points..
2) Detach the DUST PROTECTION TAPE.
separate the UPPER from the LOWER.
※ Caution
※ Caution
1) Be care of damage to the FPCBs.
1) Be care of scratch and molding damage.
2) Be care of scratch and molding damage.
11-1
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Disassembly and Assembly Instructions
5
6
1) Put the two SCREW CAPs out.
1) Disassemble the UPPER by using a
2) Detach the HINGE DUMMY out.
assembly stick.
2) Unscrew 2 points.
※ Caution
※ Caution
1) Be care of scratch and molding damage.
1) Be care of scratch and molding damage.
Separate a motor/speaker/camera
7
8
from the LOWER using a tweezer.
Take the LCD out.
Separate the LCD module from the LOWER.
※ Caution
※ Caution
1) Be care of scratch and molding damage.
1) Be care of scratch and molding damage.
2) Be care of damage to motor/speaker wires.
2) Be care of damage to LCD FPCB..
11-2
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Disassembly and Assembly Instructions
11-2. Assembly Instructions
1
2
Solder motor/speaker to the pad of
LCD module and Bonding.
Attach CAMERA module to the LCD.
※ Caution
※ Caution
1) Be care of damage to the LCD module
1) Be care of damage to the LCD module
3
4
Attach three insulation tapes to LCD module.
Attach GASKET & RUBBER to LCD module.
※ Caution
※ Caution
1) Be care of scratch and molding damage.
1) Be care of scratch and molding damage.
11-3
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Disassembly and Assembly Instructions
6
5
Assemble the LCD into the lower.
Assemble the MOTOR/SPEAKER/CAMERA.
※ Caution
※ Caution
1) Be care of damage to F-PCB of LCD
1) Be care of scratch and the direction of
module.
hinge dummy.
7
8
Assemble the UPPER.
Attach the MAIN WINDOW.
※ Caution
※ Caution
1) Be care of scratch and molding damage.
1) Be care of damage to the camera F-PCB.
11-4
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Disassembly and Assembly Instructions
9
10
Assemble the HINGE DUMMY and assemble
two SCREW CAPs.
Screw two points.
※ Caution
※ Caution
1) Be care of scratch and molding damage.
1) Be care of scratch and molding damage.
12
11
1) Assemble the folder and the front by fitting
1) Attach the DUST PROTECTION TAPE.
hinge dummy in the front.
2) Put the KEYPAD/SHIELD CAN on the front ass'y.
2) Push the hinge.
3) Screw 2 points.
※ Caution
※ Caution
1) Be care of scratch.
1) Be care of scratch and molding damage.
11-5
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Disassembly and Assembly Instructions
14
13
①
②
③
1) Put the PBA on the front ass'y.
2) Join the LCD/KEY/COAXIAL CABLE connector to the
1) Assemble the rear case to the assembly.
PBA.
3) Screw 2 points.
※ Caution
※ Caution
1) Be care of damage to the LCD/KEY
1) Be care of scratch and molding damage.
F-PCBs.
15
16
1) Assemble the VOLUME KEY to the
assembly.
1) Screw down 4 points in the red circles.
※ Caution
※ Caution
1) Be care of scratch and molding damage.
1) Be care of scratch and molding damage.
11-6
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