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HyperLynx Products
HyperLynx Products Steve Gascoigne Application Engineer Consultant Focus Products Organization A Complete Analysis Solution Address multiple design areas through virtual prototyping Integrated technologies to accelerate adoption Ease-of-use enables ALL engineers to perform analysis — PCB designers thru SI/PI specialists © 2012 Mentor Graphics Corp. Company Confidential 2 HyperLynx Product Update www.mentor.com Signal Integrity Concerns Traditional signal integrity — Crosstalk, overshoot, timing, impedance DDRx design — Timing, ODT selection Multi-gigabit SerDes technologies — Loss management, via design, length matching, impedance discontinuities © 2012 Mentor Graphics Corp. Company Confidential 3 HyperLynx Product Update www.mentor.com HyperLynx: LineSim SI Industry-renowned ease of use Accurate modeling of trace impedance, coupling & frequency-dependent losses Terminator wizard recommends optimal termination strategies Identify SI issues, perform crosstalk analysis & parametric sweeps Stackup planning Industry-leading for SERDES, including fast eye diagram analysis, S-parameter simulation, and BER prediction Advanced via modeling Provides an early look at EMC Integration with the CES 4 HyperLynx Product Update © 2012 Mentor Graphics Corp. Company Confidential www.mentor.com HyperLynx: BoardSim SI Simulate post-routed data from Expedition Layout Run interactive simulations on individuals nets Run a comprehensive batch simulation on many nets at once Parametric sweeps Verify DDR/2/3 bus structures (single and multi-board setups) Crosstalk analysis Advanced Timing Analysis Interactive EMC Analysis Run SERDES Fast-eye analysis Run IBIS-AMI channel analysis © 2012 Mentor Graphics Corp. Company Confidential 5 HyperLynx Product Update www.mentor.com HyperLynx DDRx Simulation Validate LPDDR and DDRx timing and SI designs — Analyze timing for both address and data buses — Measurements for clock to strobe skew — Measure timing and SI on all signal edges — Advanced crosstalk simulation Analysis is simplified through an interview process © 2012 Mentor Graphics Corp. Company Confidential 6 HyperLynx Product Update www.mentor.com Multi-Gigabit Channel Analysis Fast time domain and statistical analysis — Simulate millions to billions of bits for accurate BER prediction Generate the channels worst case bit sequence — PRBS or 8B/10B protocol dependant — Always produces a maximally closed eye — Bounds Dj (deterministic jitter) Validate BER — Eye density plots — BER plots Support for IBIS-AMI, SPICE, S-Parameters © 2012 Mentor Graphics Corp. Company Confidential 7 HyperLynx Product Update www.mentor.com Full-Wave 3D Via Modeling Some designs require more accurate via models — Can contribute significant loss at higher frequencies Need the ability to accurately tune the via design — Separation, stitching, entry angle, etc. 3D simulation provides highly accurate models up to 100+ Gbps frequencies © 2012 Mentor Graphics Corp. Company Confidential 8 HyperLynx Product Update www.mentor.com 3D Full-Wave EM Modeling HyperLynx 3D EM Based on IE3D technology — Fastest, highest-capacity, full 3D EM simulation in the market NEW product for Mentor Graphics — Zeland Software, Inc. acquired February 2010 Creates high-frequency parasitic models needed for circuit simulation — Frequency-dependent parasitic extraction of metallic structures – “s-parameter models” Highly respected for EM design & verification — Over 1600 customers — Long history (since 1992) of production proven use Employs a Unique 3D Integral Equation Method to Solve Maxwell’s Equation Governing Electrical Behavior of Metallic Structures © 2012 Mentor Graphics Corp. Company Confidential 9 HyperLynx Product Update www.mentor.com Application of HyperLynx 3D EM EM Simulation is Used in All High-Frequency Design Applications Wireless — Cell phone, routers, Bluetooth, GPS, LTE, wimax (802.16) — Antenna and antenna arrays — RFID/zigbee tag design Hi speed digital — 10G/40G+ internet, Fibrechannel, XAUI, PCIE, Infiniband — On-chip SerDes, package — DDR2/DDR3 memory I/F channel Military/aerospace — Secure communications/network — Large phase array/imaging antenna — Compact multi-band antenna — Materials research © 2012 Mentor Graphics Corp. Company Confidential 10 HyperLynx Product Update www.mentor.com HyperLynx 3D EM Value Fastest commercial 3D EM simulator Has the largest design capacity Accuracy matches measurement Packaged for widespread deployment Fastest EM design closure — More simulations/hour accelerates design convergence — Higher capacities alleviate need to manually partition design Lower EM design costs — Unique, scalable distributed EM simulation — Replace less-capable, more-expensive competitive alternatives — Reliable, predictable results reduces risks of costly design iterations Improve design quality - minimize EM design re-spins — Higher simulation coverage helps ensure nothing was missed — Higher capacity – detect hard-to-find EM design flaws prior to prototype — Reliable, predictable results increases designer confidence © 2012 Mentor Graphics Corp. Company Confidential 11 HyperLynx Product Update www.mentor.com Power Integrity Analysis DC drop analysis — Identify excessive voltage drop and high current densities — Determine if there is enough copper & stitching vias — Batch analysis of all power nets AC power plane analysis — Optimize capacitor selection and mounting — Verify power supply impedance at IC power pins — Analyze voltage ripple on power nets © 2012 Mentor Graphics Corp. Company Confidential 12 HyperLynx Product Update www.mentor.com IR Drop Design Issues Common problems: — Not enough voltage getting to ICs from power supplies – Leads to IC malfunction — High current densities in voltage island neck-downs and vias – Leads to dielectric or via breakdown and board failure High Current Density 13 HyperLynx Product Update Excessive Voltage Drop © 2012 Mentor Graphics Corp. Company Confidential www.mentor.com Decoupling Design Develop decoupling methodologies to — Properly design stackup for power — Design capacitor mounting structures — Make intelligent capacitor selections Goal = Achieve IC Target Impedances for power — Set by voltage ripple requirements © 2012 Mentor Graphics Corp. Company Confidential 14 HyperLynx Product Update www.mentor.com Plane Noise Analysis HyperLynx Plane Noise can help identify voltage ripple exceeding IC power pin specifications Plane noise is a result of target impedance and switching currents — (V=I*R) — Amount of voltage noise is dependant on edge rate (frequency) of current and impedance at that frequency © 2012 Mentor Graphics Corp. Company Confidential 15 HyperLynx Product Update www.mentor.com Thermal Analysis Allows engineers and PCB designers to identify component and PCB hot spots What-if analysis on — Component placement — Stackup design — Mechanical cooling techniques Quick and accurate analysis including — All PCB copper — Packages, Pins, vias, screws, etc — Environment including enclosure — Package to Board, Pin to Board junctions — Heat sinks and Airflow © 2012 Mentor Graphics Corp. Company Confidential 16 HyperLynx Product Update www.mentor.com Analog Simulation Scalable simulation solution built on DxDesigner Analog and full mixed signal simulation capability — Support for analog and digital primitives — Standard language support – VHDL, VHDL-AMS, Spice, & Verilog-A — Power ADMS and Eldo simulation kernels Full featured waveform viewing with EZWave — Including complex waveform calculations © 2012 Mentor Graphics Corp. Company Confidential 17 HyperLynx Product Update www.mentor.com EMI / PCB Verification PCB Design Validation — Rules-based verification of the PCB — Finds problems before building prototypes — Create custom design rules to identify your common problems Automates the design review process — Enables consistency — Minimizes human error — Reduces design review time investment 18 1. DRCs 5. Board Display 4. Advice 3. Problem 2. Violation List © 2012 Mentor Graphics Corp. Company Confidential www.mentor.com Crossing Domains Sometimes independent analysis addresses only part of the issue Integrated Analysis flow allows for simulation across domains © 2012 Mentor Graphics Corp. Company Confidential 19 HyperLynx Product Update www.mentor.com Simulating Via-to-Via Crosstalk Mixed signal and power integrity simulation — Via crosstalk through power planes © 2012 Mentor Graphics Corp. Company Confidential 20 HyperLynx Product Update www.mentor.com PI/Thermal Co-Simulation HyperLynx Thermal within the existing HyperLynx SI and PI environment Co-Simulation capabilities between PI and Thermal — Power Integrity engine (DC drop) simulates power nets provides power density “map” to thermal solver — Thermal solver runs thermal analysis with component power dissipation and results from PI simulation — System runs several iterations of above process with PI simulator using updated resistances(based on temp) until convergence © 2012 Mentor Graphics Corp. Company Confidential 21 HyperLynx Product Update www.mentor.com Analysis is Core to the Design Process PCB design is more than schematic and layout — We know designs are becoming more complex To meet reliability and time-to-market — Project engineers must do PCB Analysis Schematic Constraints PCB Analysis PCB Analysis Layout “HyperLynx is now mandated as part of our PCB design process.” - SEAKR Engineering Prototype Test /Bring-up PCB Analysis © 2012 Mentor Graphics Corp. Company Confidential 22 HyperLynx Product Update www.mentor.com HyperLynx Analysis Environment Comprehensive suite of analysis technologies — Reduce design cycle time – Develop constraints for “first time right” design — Improve design reliability – Validate design intent before prototyping — Verification in multiple domains – Accurate & fast time-to-results — HyperLynx enables ALL engineers to drive analysis © 2012 Mentor Graphics Corp. Company Confidential 23 HyperLynx Product Update www.mentor.com HYPERLYNX 9.1 © 2013 Mentor Graphics Corp. Company Confidential 24 HyperLynx 9.0 – June 2013 www.mentor.com Consolidated export from Xpedition HyperLynx SI and HyperLynx PI and HyperLynx Thermal all use the same exported file — Has info needed for all types of analysis — .CCE © 2012 Mentor Graphics Corp. Company Confidential 25 www.mentor.com Improved Integration .CCE Import — Both 64-bit and 32-bit ODB++ Import — Both 64-bit and 32-bit Read in SI Constraints — from .CCE file — into Generic Batch Mode Read in DC Drop constraints — from .CCE © 2012 Mentor Graphics Corp. Company Confidential 26 2 www.mentor.com Enhanced EDM integration HyperLynx LineSim Support — LineSim is now fully supported in EDM and all the required HyperLynx files (*.ffs + *.pjh) are saved together with the DxDesigner project file at check-in HyperLynx BoardSim Enhancements — Automatic design synchronization between Xpedition, EDM, and HyperLynx — Metadata enhancements — Support for concurrent analysis © 2012 Mentor Graphics Corp. Company Confidential 27 www.mentor.com EDM synchronization Starting with VX release, Xpedition and CES automatically generate design and constraints data (.CCE and .CSE files) on each checkin of the design HyperLynx uses this data for analysis, thus providing automatic synchronization with a specific version of an Xpedition design — No need to manually export the data for high-speed analysis - it’s always available at hand © 2012 Mentor Graphics Corp. Company Confidential 28 www.mentor.com Design state information Once analysis is run, the result is shown as metadata of the PCB design. The following information was added: — PCB design version used to perform analysis — Name of the user © 2012 Mentor Graphics Corp. Company Confidential 29 www.mentor.com EDM concurrent analysis Multiple users will be able to analyze a design simultaneously Analysis can be done on different computers – local settings, including IBIS models, will be preserved for each user and automatically restored on the same or a different machine — Settings can be reused when analysis is done again with a newer version of the design Analysis results from multiple users will be automatically combined and displayed as metadata © 2012 Mentor Graphics Corp. Company Confidential 30 www.mentor.com Also New in VX (HyperLynx 9.1) New Toolbar icons — With enhanced tool tips Language localization (Chinese) Show full path in recent files and title bar — Idea #D2862 New editing modes in the stackup editor — Keep CES and Expedition stackups in sync — Option to turn off Z0 calculation to improve performance QPL editor in LineSim Touchstone Viewer — now supports Touchstone 2.0 — TDR plot smoothing © 2012 Mentor Graphics Corp. Company Confidential 31 www.mentor.com HYPERLYNX 9.X TEASER © 2010 Mentor Graphics Corp. Company Confidential Your 32 Initials, Presentation Title, Month Year www.mentor.com HyperLynx 9.2 Main Features Multiple Net Selection (LP)DDR4 Support in DDRx Wizard Back drill support SERDES Improvements Advanced S-parameter Extraction IBIS Model PI effects PI Pin grouping DC Drop performance improvement (x20) © 2010 Mentor Graphics Corp. Company Confidential www.mentor.com Hyperlynx 9.2 3D Viewing Integrated 3D board and region viewing High performance display of entire PCBs, including realistic lighting and shading, etc.. 3D view of selected areas/objects for detailed studies © 2010 Mentor Graphics Corp. Company Confidential www.mentor.com www.mentor.com © 2012 Mentor Graphics Corp. Company Confidential 35 HyperLynx Product Update www.mentor.com
