Grinding - IIT Bombay

Transcription

Grinding - IIT Bombay
Grinding and Finishing
Illegitimi non carborundum
ver. 1
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
1
Overview
• Processes
• Analysis
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
2
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
3
Horizontal Grinding
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
4
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
5
Horizontal grinding
Vertical grinding
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
6
Centered grinding
Centerless grinding
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
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Creep Feed Grinding
• Full depth and stock is removed with
one or two passes at low work speed
• Very high forces are generated
• High rigidity and power
Advantages
• Increased accuracy
• Efficiency
• Improved surface finish
• Burr reduction
• Reduced stress and fatigue
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
8
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
9
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
10
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
11
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
12
Grinding Wheels
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
13
Grinding Wheels
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
14
Grinding Wheel Information
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
15
Correctly Mounted Wheel
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
16
Grinding Wheel Surface
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
17
Grind Wheel Dressing
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
18
Grinding Wheel Dressing
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
19
Grinding Chips
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
20
Chip formation geometry
w
l
t
D
q
t
d
V
l
v
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
21
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
Chip geometry
• As with rolling contact length, the chip length,
l
– D = wheel diameter, d = depth of cut
l  Dd
• Material removal rate, MRR
– v = workpiece velocity, d = depth of cut, b = width
of cut
MRR  v  d  b
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
23
Material removal rate
• The chips have a triangular cross-section,
and ratio (r) of chip thickness (t) to chip width
w
(w)
w
r   10 to 20
t
t
l
• So, the average volume per chip
1 1
1
Volchip  w  t  l  wtl
2 2
4
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
24
Chips
• The number of chips removed per unit time
(n), where c = number of cutting edges
(grains) per unit area (typ. 0.1 to 10 per mm2,
and V = peripheral wheel velocity
n V bc
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
25
Combining
MRR  v  d  b  n Volchip
1
v  d  b  Vbc  wtl
4
w  r t
l  Dd
1
vd b V cb r t t  Dd
4
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
26
Chip thickness
4v  d
t 
V cr Dd
2
or
4v
t
V cr
d
D
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
27
Specific grinding energy, u
• Consist of chip formation, plowing, and sliding
u  uchip  u plowing  usliding
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
28
Total grinding force
• Get force from power
Power  u  MRR
Fgrinding V  u  v  d  b
v  d b
Fgrinding  u 
V
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
29
Total grinding force
• From empirical results, as t decreases, the
friction component of u increases
1
u
t
or
1
u  K1 
t
substituting
1 v  d b
Fgrinding  K1  
t V
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
30
Total grinding force
Substituting for t
v  d b
Fgrinding  K1 

V
4v
d

V cr D
1
rearranging
d cr v
Fgrinding  K1  b 
 Dd
4V
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
31
ME 6222: Manufacturing Processes and
Singh/Melkote/Colton
Systems Prof. J.S. Colton © GIT 2006
Force on a grain
• The force per grain can be calculated
Fgrain  u  Area
1
Fgrain  u  wt
2
w  rt
and
1
u  K1 
t
1 1
Fgrain  K1    r  t  t
t 2
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
32
Force on a grain
substituting for t, and rearranging
K1
4v
Fgrain   r 
2
V cr
d
D
vr d
Fgrain  K1 
V c D
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
33
ME 6222: Manufacturing Processes and
Singh/Melkote/Colton
Systems Prof. J.S. Colton © GIT 2006
Grinding temperature
• Temperature rise goes with energy delivered
per unit area
Energy input
T  K2 
area
u bl  d
1
T  K2 
 K2  K1   d
bl
t
T  K1  K2  d 
1
4v d
Vcr D
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
34
Grinding temperature
• Rearranging
∆𝑇 =
3
𝐾1 𝐾2 𝑑 4
𝑉𝑐𝑟
𝐷
4𝑣
• Temperatures can be up to 1600oC, but for a
short time.
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
35
Grinding – Ex. 1-1
• You are grinding a steel, which has a specific
grinding energy (u) of 35 W-s/mm3.
• The grinding wheel rotates at 3600 rpm, has a
diameter (D) of 150 mm, thickness (b) of 25 mm, and
(c) 5 grains per mm2. The motor has a power of 2
kW.
• The work piece moves (v) at 1.5 m/min. The chip
thickness ratio (r) is 10.
• Determine the grinding force and force per grain.
• Determine the temperature (K2 is 0.2oK-mm/N).
Room temperature is 20oC.
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
36
Grinding – Ex. 1-2
• First we need to calculate the depth of cut.
We can do this from the power.
Power  u  MRR  u  v  d  b
2
W s
m
min
6 mm
2000 W  35
1.5
 d  25 mm 10

3
2
min
60 sec
mm
m
d  91.4 106 m
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
37
Grinding – Ex. 1-3
• Now for the total grinding force
v  d b
Fgrinding  u 
V
mm
3
1500

91
.
4

10
mm  25 mm
W s
min
Fgrinding  35

m
mm3 3600 rev 150 mm 
min
rev 1000 mm
Fgrinding  70.7 N
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
38
Grinding – Ex. 1-4
• Next, the force per grain
1
Fgrain  u  wt
2
and
w  rt
1
Fgrain  u  r  t  t
2
we need t
t
4v
V cr
mm
d
91.4 103 mm
min

mm grains
D
150 mm
3600  150
5

10
min
mm2
4  1500
t  1.32 103 mm
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
39
Grinding – Ex. 1-5
• Substituting


1
1
3 2
Fgrain  u  r  t  t  35  10  1.32 10
2
2
4
Fgrain  3.05 10 J / mm
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
40
Grinding – Ex. 1-6
• For the temperature, we need K1 and K2. K2 is
given, so we need to calculate K1.
1
1 1
1
Fgrain  u   r  t  t  K1    r  t  t  K1   r  t
2
t 2
2
1
3.0510 N  K1  10 1.32106 m
2
3 N
K1  46.2 10
m
1
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
41
Grinding – Ex. 1-7
• substituting
1
T  K2  K1   d
t
T  0.2
K m
N
1
6
 46.2 

91
.
4

10
m  640K

6
N
m 1.32 10 m
T  Tinitial  T  20  640  660C
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
42
Honing and Superfinishing
Honing tool used to improve
the surface finish of bored or
ground holes.
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
Schematic
illustrations of the
superfinishing
process for a
cylindrical part.
(a) Cylindrical
mircohoning, (b)
Centerless
microhoning.
Lapping
(a) Schematic illustration of the lapping process. (b)
Production lapping on flat surfaces. (c) Production lapping
on cylindrical surfaces.
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
Polishing Using Magnetic
Fields
Schematic illustration of polishing of balls and rollers
using magnetic fields. (a) Magnetic float polishing of
ceramic balls. (b) Magnetic-field-assisted polishing of
rollers. Source: R. Komanduri, M. Doc, and M. Fox.
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
Abrasive-Flow Machining
Schematic illustration of
abrasive flow machining to
deburr a turbine impeller.
The arrows indicate
movement of the abrasive
media. Note the special
fixture, which is usually
different for each part
design. Source: Extrude
Hone Corp.
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
Robotic Deburring
A deburring operation on a robot-held die-cast
part for an outboard motor housing, using a
grinding wheel. Abrasive belts or flexible
abrasive radial-wheel brushes can also be used
for such operations. Source: Courtesy of
Acme Manufacturing Company and
Manufacturing Engineering Magazine,
Society of Manufacturing Engineers.
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
Conformal Hydrodynamic Nanopolishing:
Case-study
Applications
Challenges
• Most processes can polish only flat
surfaces; concave/profiled surfaces
• Defence & Nuclear
are difficult to superfinish
• Concave surface on hard brittle
• Electronics
materials, such as single crystal
• Industrial
sapphire can not be finished via form
Existing Methods
grinding due to process-induced
cracks
• Diamond Turning
• Diamond turning center can be used
• Precision Grinding
for non ferrous materials but it is a
• Lapping
super-precision machine-tool (The
equipment cost is ~ 20 crores besides
• Ion Beam Polishing
• Spot Hydrodynamic Polishing the expensive operational cost)
• Optics
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
1
Conformal Hydrodynamic
Nanopolishing Process and Machine
Process Description
•
•
•
•
Improvement over existing
spot hydrodynamic polishing
methods
Superfinish hard and brittle
concave surfaces, specially,
sapphire and hardened steels
Mitigates
existing surface
microcracks
Polishing action due to
elastohydrodynamic film in
the slurry
submerged
rotating conformal contact
(silicone ball in the cavitynd
being
polished)
12st Generation Conformal Hydrodynamic Nanopolishing Machin
Delivered to Precison Engineering Division BARC
Generation
(designed and fabricated in the Machine Tools Lab
at IIT Bombay)
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
2
Novelty and Technology Breakthrough
• Existing hydrodynamic polishing employs spot polishing unable to
polish small cavities (< 6mm in dia)
– More than 3 degrees of freedom required to polish the entire cavity
effectively
– Small actuation system and polishing tool is required
• Conformal contact has a rotating soft tool which conforms to the shape
of the cavity
• Axis of this tool is inclined at 45˚ and the workpiece is rotated inside a
slurry filled tank which ensures non-zero relative motion between tool
and workpiece at every location in the cavity
• The entire cavity can be polished at once which will be much cheaper
and faster than programming the tool path
• Alternative to expensive Diamond Turning
• Can finish wide range of materials ceramics (sapphire, glass) and
hardened steels
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
3
Technology Outcomes
•
•
•
•
•
Superfinished surfaces in
steels (< 3nm 3D surface
roughness)
Crack-free surface of < 100
nm 3D surface roughness in
single
crystal
sapphire
cavity
Process
knowhow
and
machine
transferred
to
Precision
Engineering
Division, BARC for strategic
applications in a nuclear
device
The superfinished obtained
at a fraction of cost of
Diamond turning
It can also be used by gem
polishers
which
could
reduce the health hazard by
reducing the dust inhalation
and automation is possible
Nanometric finish on hardened steel
Crack-free superfinished surface on single
crystal sapphire cavity
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
4
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
Economics of Grinding and Finishing
Operations
Increase in the cost of
machining and finishing a
part as a function of the
surface finish required.
This is the main reason
that the surface finish
specified on parts should
not be any finer than
necessary for the part to
function properly.
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
Summary
• Overview of processes
• Analysis of process
• Example problem
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton
54

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