Electromagnetic Simulation for Power Integrity: From Analysis to
Transcription
Electromagnetic Simulation for Power Integrity: From Analysis to
Electromagnetic Simulation for Power Integrity: From Analysis to Design A. Ege Engin [email protected] Agenda • Analysis • • • • Equivalent-circuit modeling of power planes Key idea of efficient power integrity simulation Dielectric loss, surface roughness, etc. Frequency-domain characterization • Design • • • • Goodness of a PDN Design for target impedance Sensitivity of a PDN Incremental simulation for “what-if” Part 1: Analysis SI/PI Challenges for IC Packaging Microstrip line Vias Stripline Chip Package Vdd Vss PCB Vdd Vss Signal degradation / Jitter Power supply noise Electromagnetic interference Non-Ideal Component Behavior 10 2 Measurement RLGC model Electrically short interconnect: Lumped RLC model mag(Z11) [Ohm] 10 1 L 10 0 R 10 -1 10 -2 C 10 7 G=ωCtanδ 10 8 10 Frequency [Hz] 9 Embedded Capacitor Electrically long interconnect: Transmission line 10 10 Sources of PI Issues • As transistors in an integrated circuit (IC) start switching, current needs to be supplied by the power delivery network (PDN). Because of the current flow through the impedance of the PDN, power-supply voltage fluctuates from its DC value. The power supply noise eventually degrades the signal quality of high-speed signals, limiting the clock frequency of the system. Current drawn by the IC low-power techniques, such as clock gating to reduce the current Impedance of the PDN Decoupling capacitors, Vdd/Gnd planes, lots of Vdd/Gnd pads Power-supply voltage noise Signal-integrity problems Control the return current for I/Os PDN Example Package PCB power / power / ground Through hole Wirebonds or ground planes & on- vias and BGA flip-chip planes & onpackage SMD solder balls bumps package SMD capacitors capacitors Embedded capacitor SMD capacitors Vdd Z Gnd Target Impedance Vdd Gnd Embedded capacitors Noise Coupling in Multilayered Structures Signal to power coupling SMD capacitor Gap coupling Gnd/Vdd Horizontal coupling Gnd/Vdd Aperture coupling External field coupling (EMI) Vias and via coupling Gnd/Vdd Embedded capacitor Gnd/Vdd Multi-Dimensional Electromagnetic Problem Cavity Resonances in Distributed Analysis Voltage Maxima (a) (b) Voltage Minima (c) (d) Voltage on plane (a) 300MHz (b) 600MHz (c) 670MHz (d) 847MHz How do the Cavity Resonances Affect Impedance • • • a=b=250mm, εr=4, d=0.2mm C=11.067 nF, f10=f01=300MHz,f11=424MHz, f20=f02=600MHz, f21=f12=671MHz, f22=849MHz, f30=f03=900MHz Some resonances may be suppressed depending on the location of the impedance port. Close resonances may merge. Equivalent Circuit Model of a Single Plane Pair Based on FDM Based on the 5-point finite-difference approximation of Helmholtz equation R L L R R L R R R L L L C L R R G R L R R G L L C L R R L L R R G L DK, Loss tangent L C R G Dielectric thickness R R L R Port 1 L G C L R L L R Port 2 L L L C R R C L G R Finite Difference Method FDM results in a sparse block- diagonal matrix ui,j+1 (T2 k 2 )u jdJ z T2 u i , j ui-1,j 1 1 2 1 4 1u i , j h 1 YU I ui,j ui+1,j ui,j-1 h h A B B A 1/ Z B B Y B B A 1/ Z B B A 1/ Z Y 2 / Z 1/ Z Y 3 / Z 1/ Z 1/ Z Y 3 / Z A B 1 / Z 1/ Z 1/ Z Y 3 / Z 1/ Z 1 / Z Y 2 / Z Circuit Interpretations of FDM • 5-point approximation results in the well-known bed-spring model • 9-point approximation includes diagonal inductances • More accurate representation of current paths T2 u i , j 1 1 2 1 4 1u i , j h 1 Z/2 Z/2 Y 5-point Approximation T2 u i , j 2 / 3 1/ 6 1 / 6 1 2 2 / 3 10 / 3 2 / 3u i , j h 1 / 6 2 / 3 1 / 6 3Z/4 3Z/4 Y 9-point Approximation Finite-Difference Time Domain (FDTD) Vi,j+1 Iyi,j Ixi-1,j Ixi,j Vi,j Vi-1,j Vi+1,j Iyi,j-1 Iz Vi,j-1 t t 2 t Iyi , j Iyi , j t Vi , j t 2 t Vi , j t 2 t 2 y x t t t (Vi , j Vi , j 1 ) L t ( Ixit1, j Ixit, j ) ( Iyit, j 1 Iyit, j ) Izit, j C FDTD Simulation Example -3 1 x 10 Iz [A] 0.8 V 0.6 0.4 10cm Iz εr=4, d=100um 10cm 0.2 0 0 0.2 0.4 0.6 Time [s] 0.8 1 -8 x 10 FDTD Simulation Result -4 0 x 10 SPICE FDTD Voltage [V] -1 -2 -3 -4 -5 -6 0 0.2 0.4 0.6 Time [s] 0.8 1 -8 x 10 Finite Element Method FEM simulation done with the PDE toolbox in Matlab. Current source is in the middle. Color: abs(u) Height: abs(u) 1.5 1.5 1 1 0.5 0.5 0 0.1 0.05 0.1 0.05 0 0 -0.05 -0.05 -0.1 -0.1 FEM 0 0.1 0.05 0.1 0.05 0 0 -0.05 -0.05 -0.1 -0.1 FDM Modeling of Multiple Plane Pairs -10 mag(S12) [dB] Plane pairs get coupled through the apertures -20 -30 -40 Multilayer FDM Sonnet Measurements -50 -60 -70 0 Port 1 200 phase(S12) [degrees] Port 2 0.8 0.6 Voltage [V] 0.4 0.2 0 1 2 3 4 Frequency [Hz] 5 6 9 x 10 Multilayer FDM Sonnet Measurements 100 0 -100 -0.2 -0.4 -0.6 0 0.2 0.4 0.6 Time [s] 0.8 1 -8 x 10 Switching noise voltage at port 1 -200 0 2 4 Frequency [Hz] 6 9 x 10 Losses The Debye model requires real (and positive) coefficients: Standard curve fitting does not work! RC curve fitting approach can be used to obtain the coefficients assuming that the permittivity is available at some discrete frequency points. -3 3.785 8.5 Measured RC Vector Fitting 3.78 Measured RC Vector Fitting 8 3.775 7.5 3.77 7 tan 3.765 3.76 6.5 6 3.755 5.5 3.75 5 3.745 3.74 0 x 10 2 4 6 8 Frequency (Hz) 10 12 14 9 x 10 4.5 0 2 4 6 8 Frequency (Hz) 10 12 14 9 x 10 Skin Effect and Surface Roughness Assume the Hammerstad model for the surface roughness: 𝛼 = 𝑘𝛼𝑐 + 𝛼𝑑 Where: 𝑘 = 1 + 2 atan 𝜋 𝑟𝑚𝑠 2 𝛿 1.4 For a transmission line, 𝑅~𝑘/𝛿 -9 3 30 2.5 2 20 Inductance (H) Resistance (Ohm) RC Vector Fitting Simulated RC Vector Fitting 25 15 1.5 10 1 5 0.5 0 x 10 0 1 2 3 4 5 6 Frequency (Hz) 7 8 9 10 9 x 10 0 0 1 2 3 4 5 6 Frequency (Hz) 7 8 9 10 9 x 10 Effect of Surface Roughness RT5880 Rolled (less rough) Electrodeposited Materials courtesy of Rogers Corp. Effect of Surface Roughness RO4350 LoPro (less rough) TWS foil Examples of SI/PI Coupling via Return Currents Helen K. Pan et al, Intel, PIERS 2007 Sung-Ho Joo, IEEE MWCL Oct07 Scott McMorrow, PCDesign, 2002 Larry Smith, Sun Microsystems, EPEP’99 Modal Analysis – Key Idea of Efficient Signal and Power Integrity Simulation A stripline can be routed between a power and a ground plane. Where is the return current in such a case? Is=Ip+Ig h2 Ip=? Ig=? h1 Power Ip Is r Ground Ig L R R L L L R R R L C R L R R G L L R G R R G L R L C L L C G R R R L R R L R G L L C L C L L L C R R G C L L L R L R R L G R R R R L L L C L R G R L C G R Modeling of Transmission Lines Considering Non-Ideal Supply Planes • • The signal line and the power/ground planes can be regarded as a multiconductor transmission line (MTL) Power/Ground planes can be modeled at various levels of complexity h2 r h1 stripline µ-strip Parallel-Plate and Stripline Modes • The transformation matrices are defined such that the two modes are the • parallel plate mode (i.e., no current flows on the signal line) • stripline mode (i.e., both planes at the same potential) r Vdd h2 h1 Parallel-Plate V1 k*I1 h1 k h1 h2 Signal Stripline I1 k*V1 Vss V2 Vdd k*I2 I2 Vss k*V2 Signal Summary of Modal Decomposition Methods Transmission line type Coupling factor (k) Inhomogeneous medium (ε1 different than ε2) Microstrip referenced to ground k=0 Modal decomposition works k=-1 Modal decomposition works k=h1/(h1+h2) Capacitive coupling terms need to be considered k can be obtained from a 2D field solver Capacitive coupling terms need to be considered Signal Ground Power ε1 ε2 Microstrip referenced to power Signal Power Ground ε1 ε2 Stripline Power Signal Ground ε1 h2 ε2 h1 Conductor-backed CPWG Signal Power Ground ε1 ε2 Power • Model • Measurement • S12: near-end coupling between signal line and power plane S12, dB Experimental Validation -15 -20 -25 -30 -35 -40 -45 0 2 4 6 8 10 freq, GHz Vss Vdd S12, degrees 100 50 0 -50 -100 0 2 4 6 freq, GHz 8 10 Modeling of Microstrip-Stripline Vias Solid Lines: Model Circles: Measurement Via inductance and capacitance neglected mag(S12), dB 0 -10 -20 -30 -40 -50 0 1 2 3 4 5 6 4 5 6 freq, GHz phase(S12), degrees • • • Signal µstrip model 100 0 -100 -200 k*V2 I2 I1 k*V1 Signal stripline Vss Vdd 200 Vss parallel plate V1+- k*I1 parallel plate k*I2 +V2 Vdd 0 1 2 3 freq, GHz Measurement of a PDN with a VNA • • • • • Since typical PDN impedance is very small, the probe inductance has to be removed (or deembedded) from measurements Assume we want to measure the input impedance of a PDN Using a VNA we get the S-parameters of the setup in the figure below including the probe inductance We always use two probes. For the input impedance, they are placed as close as possible to the input impedance port It turns out that the transfer impedance is actually not affected by the probe inductance (based on the T-model below)! Measured impedance PDN input impedance Measurement of Input vs. Transfer Impedance Probe Error box tip 1 𝒁𝒑 DUT 𝒁𝟏𝟏 − 𝒁𝟏𝟐 𝒁𝟐𝟐 − 𝒁𝟏𝟐 𝒁𝟏𝟐 Probe Error box tip 2 𝒁𝒑 Probe Error box tip 1 𝒁𝒑 𝑫𝑼𝑻 Input impedance: 𝒁𝒎 = 𝒁 𝟏𝟐 𝟏𝟏 DUT 𝒁𝟏𝟏 − 𝒁𝟏𝟐 Error box 𝒁𝟐𝟐 − 𝒁𝟏𝟐 𝒁𝟏𝟐 𝑫𝑼𝑻 Transfer impedance: 𝒁𝒎 = 𝒁 𝟏𝟐 𝟏𝟐 𝒁𝒑 Probe tip 2 Part 2: Design Concept of Target Impedance • • Frequency-domain target impedance is commonly used to design power distribution networks It is based on the consideration that the power supply will have less voltage noise than allowed ripple for the given maximum current and power supply voltage. i + VDD - Z + vL + VIC - Not always true but useful! IC The concept of target impedance: If mag(Z) < mag(ZT) Then (VL) < (Vdd x ripple) How Robust is the Target Impedance Approach? An example where the voltage noise is larger than that predicted by the target impedance X. Hu, W. Zhao, P. Du, Y. Zhang, A. Shayan, C. Pan, A. E. Engin, and C. K. Cheng, “On the Bound of Time-Domain Power Supply Noise Based of Frequency-Domain Target Impedance,” ACM/IEEE System Level Interconnect Prediction, pp. 69-76, 2009. Possible Metric for the Goodness of a PDN 𝒁 PDN1 PDN2 𝒁𝑻 𝒇 Which PDN is better? Problem Definition • Assume the impedance is simulated at m distinct frequencies f1, f2, …, fm.We want to minimize 𝐹(ℎ)) = maxj 𝑍𝑗 ℎ 𝐹(ℎ • − 𝑍𝑗𝑇 Where the impedance at frequency fj is Zj and 𝑍𝑗𝑇 is the target impedance at that frequency. The variables h that can be controlled are the locations and values of the decoupling capacitors. Example for Minimax Optimization The values of four decoupling capacitors are optimized using the minimax algorithm to reduce the input impedance of a 20 cm x 20 cm board • 0.7 Before optimization After optimization 0.6 mag(Z11) [Ohm] 0.5 0.4 0.3 0.2 0.1 0 0 0.5 1 1.5 2 2.5 3 Frequency [Hz] 3.5 4 4.5 5 8 x 10 Ref: Engin, A. E.; , "Efficient Sensitivity Calculations for Optimization of Power Delivery Network Impedance,“ IEEE Transactions on Electromagnetic Compatibility, May 2010 Optimization Algorithms • • Heuristic: Simulated annealing, genetic algorithms, etc. Gradient-based: Needs efficient sensitivity calculations for the impedance. All the terms are already available from the simulation of input impedance 𝑍𝑖 Sensitivity • Differential sensitivity • 𝜕𝑍 𝜕𝐶 • 𝜕𝑍 𝜕𝐿 • • 𝜕𝑍 or 𝜕𝑅 : Is the PDN impedance really that sensitive to the ESL or ESR of the decaps? Exact calculation based on adjoint method. Large-change sensitivity • • • : Needed to find the search direction to minimize the PDN impedance, or just have quick idea of which capacitors are not effective at certain frequencies. Fast design-space exploration. What if some decaps are removed, added, or replaced? What if the geometry is slightly modified? Can we do an incremental simulation using previous data? Tracking sensitivity • • Simulated cavity resonances don’t match measured data due to incorrect value of dielectric constant or loss tangent? Frequency-dependent behavior of complex permittivity. Fast Design-Space Exploration • • • In all optimization methods, the same PDN needs to be simulated with only small changes (such as the location or value of a decoupling capacitor) to explore design space The simulation is typically restarted from scratch, without using any information from previous simulations This procedure can be greatly improved by applying an incremental simulation for fast design-space exploration Can be solved incrementally if the nominal solution is available for Simulation of PDNs with Variable Dielectric Constant and Loss Tangent • • • • The dielectric constant (DK) and loss tangent (DF) of the substrate between the power and ground planes has a big impact on the PDN resonances The DK and DF are functions of frequency, with an unknown frequency variation for most cases This impacts the accuracy of the simulation When simulations are being correlated to measurements, many iterative simulations are necessary, resulting in a 100X-1000X increase in simulation time Tracking Sensitivity • • The tracking sensitivity algorithm is an efficient method to calculate the changes in the network matrix of a circuit, when a global parameter, such as temperature, is continuously varied. In our case, the global variable (K) we consider is the complex permittivity of the dielectric. Can be solved by extracting K as a variable, based on several simulations of the nominal matrix Ref: Engin, A. E.; , "An Arnoldi Algorithm for Power Delivery Networks with Variable Dielectric Constant and Loss Tangent,“ accepted for publication at IEEE Transactions on Electromagnetic Compatibility Tracking Sensitivity Based on Complex Arnoldi Iteration To approximate this system: Rewrite as: Using complex Arnoldi iteration, obtain the factorization: The approximate solution is then given by: which can be expressed as a rational function of K: 𝑵 𝑽= 𝒋=𝟏 𝒇𝒋 𝒈𝒋 𝟏 − 𝑲𝝀𝒋 Block Arnoldi Algorithm for Complex Matrices: Tracking Sensitivity Example • Even though the nominal simulation was done for zero loss, the tracking sensitivity algorithm was able to “track” the correct complex permittivity Summary • PDN analysis: • • Efficient electromagnetic simulation techniques well understood and implemented Refinements in improving the accuracy for vias, gaps, and other 3D discontinuities • PDN design: • • • • Target impedance approach provides a design methodology Goodness of a PDN Sensitivity of the PDN impedance to decaps, geometry Efficient what-if simulations