IPC-7351B Compliance

IPC-7351B Compliance
Modified by Jason Howie on 13-Nov-2014
Altium Designer 14.3 incorporates a number of additions and enhancements to both the IPC®Compliant Footprint Wizard, and the IPC®-Compliant Footprints Batch Generator. These changes are
aimed at making both truly compliant with Revision B of the IPC standard 7351 - Generic
Requirements for Surface Mount Design and Land Pattern Standard.
IPC-7351B was released in 2010 and supersedes IPC-7351A (which was released in 2007).
The following additional packages are now supported: CAPAE, CHIP ARRAY, DFN, LGA, PQFN, PSON,
SODFL, SON, and SOTFL. In addition, existing packages have been reviewed and modified with
respect to data required and/or terminology, with graphics enhanced to better illustrate the
application of that data.
Three further beneficial enhancements have also been added in this release:
Splitting of the paste mask into small fills, for packages with a large thermal pad (sized 2.1mm
x 1.6mm, or larger).
For packages involving gullwing leads, pads are trimmed to prevent them from otherwise
extending under the package's body.
For small packages having a large central thermal pad (PQFP, QFN, SOIC, SOP), the peripheral
pads are trimmed to ensure required clearance between the pads, in accordance with the IPC
Standard.
Where pad trimming is applied, a warning is displayed in the IPC®-Compliant Footprint
Wizard, or in the report generated from the IPC®-Compliant Footprints Batch Generator.
Create PCB library components compliant with IPC standard 7351B - individually, or en-masse - using the enhanced IPC®-Compliant
Footprint Wizard and IPC®-Compliant Footprints Batch Generator.
Newly Supported Packages
The following sections detail the new packages introduced in Altium Designer 14.3, and supported in
both the IPC-Compliant Footprint Wizard and the IPC-Compliant Footprints Batch Generator.
Previously existing packages have been modified, where necessary, to comply with the
IPC-7351B standard. Consult the legends in the underlying Excel templates (accessed from
the Open Template menu in the IPC-Compliant Footprints Batch Generator dialog), for the
current data sets for each of those packages.
CAPAE
Description: Electrolytic Aluminum Capacitor
Included Packages: CAPAE
Support for CAPAE packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the CAPAE package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to CAPAE Package Specifications.
Name
Value
Required
Format Description (Dimensions in mm)
Optional
String
If blank, then auto-generated IPC naming will be
used
FootprintDescription Optional
String
If blank, then description is auto-generated
Lmin, Lmax
Yes
Real
Minimum and maximum lead span
Wmin, Wmax
Yes
Real
Minimum and maximum body width
FootprintName
Tmin, Tmax
Yes
Real
Minimum and maximum length of lead
Twmin, Twmax
Yes
Real
Minimum and maximum width of lead
Amin
Optional
Real
Minimum component height
Amax
Yes
Real
Maximum component height
L1min, L1max
Yes
Real
Minimum and maximum body length
Dmax,Dmin
Yes
Real
Diameter of Body
DensityLevel
Optional
L, M, N
M = Most or maximum copper (density level A), N
= Nominal or median copper (density level B), L
= Least or minimum copper (density level C)
JHmin
Optional
Real
Minimum value for heel fillet
JSmin
Optional
Real
Minimum value for side fillet
JTmin
Optional
Real
Minimum value for toe fillet
DrawingNote
Optional
String
If package has other features that will affect the
footprint, then enter details.
Table of data related to CAPAE Footprint Specifications.
Name
Value Required
Format
Description (Dimensions in mm)
Z
Optional
Real
Distance between pads. Measured from outside edges
G
Optional
Real
Distance between pads. Measured from inside edges
X
Optional
Real
Pad width
Y
Optional
Real
Pad length
C
Optional
Real
Row spacing. Distance between pad centers
A
Optional
Real
Assembly width
B
Optional
Real
Assembly length
V1
Optional
Real
Courtyard width
V2
Optional
Real
Courtyard length
R1
Optional
Real
Silkscreen width
R2
Optional
Real
Silkscreen length
Chip Array
Description: Chip Array
Included Packages: Chip Array, Chip Array Exposed Pad
Support for Chip Array packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the Chip Array package
in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required
information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to Chip Array Package Specifications.
Value
Required
Format
Optional
String
If blank, then auto-generated IPC
naming will be used
FootprintDescription Optional
String
If blank, then description is autogenerated
Name
FootprintName
Description (Dimensions in
mm)
Emin, Emax
Yes
Real
Minimum and maximum body
width
Dmin, Dmax
Yes
Real
Minimum and maximum body
length (side containing pin 1)
Bmin, Bmax
Yes
Real
Minimum and maximum lead
width
B1min, B1max
Optional
Real
Minimum and maximum corner
lead width
Lmin, Lmax
Yes
Real
Minimum and maximum lead
length
Amax
Yes
Real
Maximum height
Amin
Optional
Real
Minimum height
PinCount
Yes
Integer
Total number of pin positions
(including absent pins)
Pitch
Yes
Real
Pitch (e)
PackageType
Yes
Flat,Concave,ConvexE,
ConvexS
Type of packge
DensityLevel
Optional
L, M, N
M = Most or maximum copper
(density level A), N = Nominal or
median copper (density level B), L
= Least or minimum copper
(density level C)
JHmin
Optional
Real
Minimum value for heel fillet.
JSmin
Optional
Real
Minimum value for side fillet.
JTmin
Optional
Real
Minimum value for toe fillet.
DrawingNote
Optional
String
If package has other features that
will affect the footprint, then enter
details.
Table of data related to Chip Array Footprint Specifications.
Name
Value Required
Format
Description (Dimensions in mm)
Z
Yes
Real
Distance between pads. Measured from outside edges
C
Optional
Real
Row spacing. Distance between pad centers
G
Yes
Real
Distance between pads. Measured from inside edges
X
Yes
Real
Pad width
X1
Optional
Real
Corner pad width
Y
Yes
Real
Pad length
A
Yes
Real
Assembly width (E side)
B
Yes
Real
Assembly length (D side)
V1
Yes
Real
Courtyard width (E side)
V2
Yes
Real
Courtyard length (D side)
R1
Yes
Real
Silkscreen width (E side)
R2
Yes
Real
Silkscreen length (D side)
DFN
Description: Dual Flat No-lead
Included Packages: DFN
Support for DFN packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the DFN package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to DFN Package Specifications.
Value
Required
Format
Optional
String
If blank, then auto-generated IPC naming will be
used
FootprintDescription Optional
String
If blank, then description is auto-generated
Emin, Emax
Yes
Real
Minimum and maximum body width
Dmin, Dmax
Yes
Real
Minimum and maximum body length (side
containing pin 1)
b1min, b1max
Yes
Real
Minimum and maximum lead width (small lead)
L1min, L1 max
Yes
Real
Minimum and maximum lead length (small lead)
Amax
Yes
Real
Maximum height
Amin
Optional
Real
Minimum height
A1max
Optional
Real
Maximum standoff height
A1min
Yes
Real
Minimum standoff height
PinCount
Yes
Integer
Total number of pin positions (2,3,4)
e1
Optional
Real
Pitch (e1)
e2
Yes
Real
Pitch (e2)
e
Optional
Real
Pitch (e)
b2min, b2max
Yes
Real
Minimum and maximum lead width (big lead)
L2min, L2max
Yes
Real
Minimum and maximum lead length (big lead)
Name
FootprintName
Description (Dimensions in mm)
DensityLevel
Optional
L, M, N
M = Most or maximum copper (density level A), N
= Nominal or median copper (density level B), L
= Least or minimum copper (density level C)
DrawingNote
Optional
String
If package has other features that will affect the
footprint, then enter details.
Table of data related to DFN Footprint Specifications.
Name
Value Required
Format
Description (Dimensions in mm)
A
Yes
Real
Assemble width (D side)
B
Yes
Real
Assemble length (E side)
C
Yes
Real
pads span betwen small one
C1
Yes
Real
pads span between big and samll one
C2
Yes
Real
distance from package center to center of big pad
R1
Yes
Real
Silkscreen width (D side)
R2
Yes
Real
Silkscreen length (E side)
V1
Yes
Real
Courtyard width (D side)
V2
Yes
Real
Courtyard length (E side)
X1
Yes
Real
Small pad width
Y1
Yes
Real
Small pad length
X2
Yes
Real
Big pad width
Y2
Yes
Real
Big pad length
LGA
Description: Land Grid Array
Included Packages: LGA
Support for LGA packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the LGA package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to LGA Package Specifications.
Value
Required
Format
Optional
String
If blank, then auto-generated IPC naming will be
used
FootprintDescription Optional
String
If blank, then description is auto-generated
Dmin, Dmax
Yes
Real
Minimum and maximum body length along D
side (A, B, C, ...)
D1ave
Yes
Real
Average length of grid along D side
Emin, Emax
Yes
Real
Minimum and maximum body length along E
side (1, 2, 3, ...)
E1ave
Yes
Real
Average length of grid along E side
A1min
Yes
Real
Minimum standoff height
A1max
Optional
Real
Maximum standoff height
A2min, A2max
Optional
Real
Minimum and maximum body height
Amin
Optional
Real
Minimum overall height
Amax
Yes
Real
Maximum overall height
Bnom
Yes
Real
Average lead size
LeadShape
Yes
R,S
Lead shape, round or square
PitchD, PitchE
Yes
Real
Distance between ball centres, in "D" and "E"
directions
GridType
Yes
P, S
P = Plain Grid, S = Staggered Grid
MatrixType
Yes
F, P, SD, TE
F = Full Matrix, P = Perimeter, SD = Selectively
Depopulated, TE = Thermally Enhanced
Rows
Yes
Integer
Number of balls along D side (A, B, C, ...)
Columns
Yes
Integer
Number of balls along E side (1, 2, 3, ...)
Nmax
Yes
Integer
Maximum number of ball positions (Rows x
Columns)
PinCount
Yes
Integer
Number of actual balls present
DepopulateBalls
Optional
String
Ball positions removed from matrix. Example:
C5-H10,B6-B9,A1
RepopulateBalls
Optional
String
Ball positions added back into depopulated
matrix. Example: C8,D6-F9
DrawingNote
Optional
String
If package has other features that will affect the
footprint, then enter details.
Name
FootprintName
Description (Dimensions in mm)
Table of data related to LGA Footprint Specifications.
Name
Value Required
Format
Description (Dimensions in mm)
Diameter of pad. If specified this overrides the calculated
value. This can be used to specify a manufacturer's
recommended pad size.
X
Optional
Real
C1
Optional
Real
C2
Optional
Real
A
Optional
Real
Assembly width
B
Optional
Real
Assembly length
V1
Optional
Real
Courtyard width
V2
Optional
Real
Courtyard length
R1
Optional
Real
Silkscreen width
R2
Optional
Real
Silkscreen length
PQFN
Description: Pulback Quad Flat No-lead
Included Packages: PQFN
Support for PQFN packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the PQFN package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to PQFN Package Specifications.
Value
Required
Format
Optional
String
If blank, then auto-generated IPC naming will be
used
FootprintDescription Optional
String
If blank, then description is auto-generated
Dmin, Dmax
Real
Minimum and maximum body span on side D
Name
FootprintName
Yes
Description (Dimensions in mm)
Emin, Emax
Yes
Real
Minimum and maximum body span on side E
Bmin, Bmax
Yes
Real
Minimum and maximum lead width
Lmin, Lmax
Yes
Real
Minimum and maximum lead length
Amin
Optional
Real
Minimum height
Amax
Yes
Real
Maximum height
A1min
Yes
Real
Minimum standoff height
A1max
Optional
Real
Maximum standoff height
L1min, L1max
Yes
Real
Lead pull-back length
PinCountD
Yes
Integer
Number of pins on D side of package
PinCountE
Yes
Integer
Number of pins on E side of package
PitchD
Yes
Real
Distance between two adjacent pins on side D
PitchE
Yes
Real
Distance between two adjacent pins on side E
Pin1
Yes
S2, C1
Location of pin 1; S2 = corner of package. C1 =
center of package side
D2min, D2max
Optional
Real
Minimum and maximum thermal pad size on D
side. If there is no thermal pad leave this field
blank
E2min, E2max
Optional
Real
Minimum and maximum thermal pad size on E
side. If there is no thermal pad leave this field
blank
DensityLevel
Optional
L, M, N
M = Most or maximum copper (density level A), N
= Nominal or median copper (density level B), L =
Least or minimum copper (density level C)
Periphery
Optional
Real
Land Periphery
DrawingNote
Optional
String
If package has other features that will affect the
footprint, then enter details.
Table of data related to PQFN Footprint Specifications.
Name
Value Required
Format Description (Dimensions in mm)
ZE
Optional
Real
Distance between pads. Measured from outside edges
ZD
Optional
Real
Distance between pads. Measured from outside edges
GE
Optional
Real
Distance between pads. Measured from inside edges
GD
Optional
Real
Distance between pads. Measured from inside edges
X
Optional
Real
Pad width
Y
Optional
Real
Pad length
CE
Optional
Real
Row spacing. Distance between pad centers
CD
Optional
Real
Row spacing. Distance between pad centers
E2t
Optional
Real
Thermal Pad width
D2t
Optional
Real
Thermal Pad length
L2
Optional
Real
Power Bar width.
B2, B3, B4,
B5, G3, G4,
G5, G6
Optional
Real
Power Bar length. If all are blank, no power bars are
drawn.
A
Optional
Real
Assembly width (E side)
B
Optional
Real
Assembly length (D side)
V1
Optional
Real
Courtyard width (E side)
V2
Optional
Real
Courtyard length (D side)
R1
Optional
Real
Silkscreen width (E side)
R2
Optional
Real
Silkscreen length (D side)
PSON
Description: Pulback Small Outline No-lead
Included Packages: PSON
Support for PSON packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the PSON package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to PSON Package Specifications.
Value
Required
Format
Optional
String
If blank, then auto-generated IPC naming will be
used
FootprintDescription Optional
String
If blank, then description is auto-generated
Name
FootprintName
Description (Dimensions in mm)
Emin, Emax
Yes
Real
Minimum and maximum body width
Dmin, Dmax
Yes
Real
Minimum and maximum body length (side
containing pin 1)
D2min, D2max
Optional
Real
Minimum and maximum thermal pad size on D
side. If there is no thermal pad leave this field
blank
E2min, E2max
Optional
Real
Minimum and maximum thermal pad size on E
side. If there is no thermal pad leave this field
blank
Bmin, Bmax
Yes
Real
Minimum and maximum lead width
cmin, cmax
Optional
Real
Minimum and maximum lead height
Lmin, Lmax
Yes
Real
Minimum and maximum lead length
L1min, L1max
Optional
Real
Minimum and maximum lead pullback
Amax
Yes
Real
Maximum height
Amin
Optional
Real
Minimum height
A1max
Optional
Real
Maximum standoff height
A1min
Yes
Real
Minimum standoff height
PinCount
Yes
Integer
Total number of pin positions (including absent
pins)
Pitch
Yes
Real
Pitch (e)
AbsentPins
Optional
String
Comma separated list showing absent pins.
Example: 1,2,5. If blank all pins present
PinOrder
Optional
String
Comma separated list showing pin order. If blank
pin order is assumed sequential from 1 to
PinCount. Example: 8,7,6,5,4,3,2,1 will reverse
the pin order of an 8 pin package
DensityLevel
Optional
L, M, N
M = Most or maximum copper (density level A), N
= Nominal or median copper (density level B), L =
Least or minimum copper (density level C)
Periphery
Optional
Real
DrawingNote
Optional
String
If package has other features that will affect the
footprint, then enter details.
Table of data related to PSON Footprint Specifications.
Name
Value
Required
Format
Description (Dimensions in mm)
Z
Yes
Real
Distance between pads. Measured from outside edges
C
Optional
Real
Row spacing. Distance between pad centers
G
Yes
Real
Distance between pads. Measured from inside edges
X
Yes
Real
Pad width
Y
Yes
Real
Pad length
E2t
Optional
Real
Thermal Pad width (X2)
D2t
Optional
Real
Thermal Pad length (Y2)
A
Yes
Real
Assembly width (E side)
B
Yes
Real
Assembly length (D side)
V1
Yes
Real
Courtyard width (E side)
V2
Yes
Real
Courtyard length (D side)
R1
Yes
Real
Silkscreen width (E side)
R2
Yes
Real
Silkscreen length (D side)
ViaCountE
Optional
Integer
Number of thermal vias in the E direction
ViaCountD
Optional
Integer
Number of thermal vias in the D direction
ViaPitchE
Optional
Real
Thermal Via Pitch in the E direction
ViaPitchD
Optional
Real
Thermal Via Pitch in the D direction
Real
Peripheral Pads - Top Solder Layer. Enter expansion value
for Solder Mask. Only enter value if following
manufacturer recommendation. Otherwise leave blank
X2Y2_Solder Optional
Real
Thermal Pad - Top Solder Layer. Enter expansion value for
Solder Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank
XY_Paste
Optional
Real
Peripheral Pads - Top Paste Layer. Enter expansion value
for Paste Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank.
X2Y2_Paste
Optional
Real
Thermal Pad - Top Paste Layer. Enter expansion value for
Paste Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank.
X_Paste
Optional
Real
Peripheral Pads - Fill on Top Paste Layer. Value in X
direction.
Y_Paste
Optional
Real
Peripheral Pads - Fill on Top Paste Layer. Value in Y
direction.
X2_Paste
Optional
Real
Thermal Pad- Fill on Top Paste Layer. Value in X direction.
Y2_Paste
Optional
Real
Thermal Pad- Fill on Top Paste Layer. Value in Y direction.
FillCountE
Optional
Integer
Number of Top Paste fills placed on the thermal pad in the
E direction (No Paste Mask fills placed if blank)
FillCountD
Optional
Integer
Number of Top Paste fills placed on the thermal pad in the
D direction (No Paste Mask fills placed if blank)
Fill_Gap
Optional
Real
Gap between Top Paste fills placed on the thermal pad
(0.2mm if blank)
XY_Solder
Optional
SODFL
Description: Small Outline Diode, Flat Lead
Included Packages: SODFL
Support for SODFL packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the SODFL package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to SODFL Package Specifications.
Value
Required
Format
Optional
String
If blank, then auto-generated IPC naming will be
used
FootprintDescription Optional
String
If blank, then description is auto-generated
Name
FootprintName
Description (Dimensions in mm)
Dmin, Dmax
Yes
Real
Minimum and maximum body length
Emin, Emax
Yes
Real
Minimum and maximum lead span
E1min, E1max
Yes
Real
Minimum and maximum body width
Bmin, Bmax
Yes
Real
Minimum and maximum width
Lmin, Lmax
Yes
Real
Minimum and maximum lead length
Amin, Amax
Yes
Real
Minimum height
DensityLevel
Yes
L, M, N
M = Most or maximum copper (density level A), N
= Nominal or median copper (density level B), L =
Least or minimum copper (density level C)
JHmin
Optional
Real
Minimum value for heel fillet
JSmin
Optional
Real
Minimum value of side fillet
JTmin
Optional
Real
Minimum value for toe fillet
DrawingNote
Optional
String
If package has other features that will affect the
footprint, then enter details.
Table of data related to SODFL Footprint Specifications.
Name
Value Required
Format
Description (Dimensions in mm)
Z
Optional
Real
Distance between pads. Measured from outside edges
C
Optional
Real
Distance between pads. Measured from pad centre
G
Optional
Real
Distance between pads. Measured from inside edges
X
Optional
Real
Pad width
Y
Optional
Real
Pad length
X1
Optional
Real
Pad width (large pad)
A
Optional
Real
Assembly width
B
Optional
Real
Assembly length
V1
Optional
Real
Courtyard width
V2
Optional
Real
Courtyard length
R1
Optional
Real
Silkscreen width
R2
Optional
Real
Silkscreen length
SON
Description: Small Outline No-lead
Included Packages: SON, SON Exposed Pad
Support for SON packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the SON package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to SON Package Specifications.
Name
FootprintName
Value
Required
Format Description (Dimensions in mm)
Optional
String
If blank, then auto-generated IPC naming will be used
FootprintDescription Optional
String
If blank, then description is auto-generated
Emin, Emax
Yes
Real
Minimum and maximum body width
Dmin, Dmax
Yes
Real
Minimum and maximum body length (side containing pin 1)
D2min, D2max
Optional
Real
Minimum and maximum thermal pad size on D side. If there is no thermal pad leave this field blank
E2min, E2max
Optional
Real
Minimum and maximum thermal pad size on E side. If there is no thermal pad leave this field blank
Bmin, Bmax
Yes
Real
Minimum and maximum lead width
cmin, cmax
Optional
Real
Minimum and maximum lead height
Lmin, Lmax
Yes
Real
Minimum and maximum lead length
L1min, L1max
Optional
Real
Minimum and maximum lead pullback
Amax
Yes
Real
Maximum height
Amin
Optional
Real
Minimum height
A1max
Optional
Real
Maximum standoff height
A1min
Yes
Real
Minimum standoff height
PinCount
Yes
Integer
Total number of pin positions (including absent pins)
Pitch
Yes
Real
Pitch (e)
AbsentPins
Optional
String
Comma separated list showing absent pins. Example: 1,2,5. If blank all pins present
PinOrder
Optional
String
Comma separated list showing pin order. If blank pin order is assumed sequential from 1 to PinCount. Example: 8,7,6,5,4,3,2,1 will reverse
the pin order of an 8 pin package
DensityLevel
Optional
L, M, N
M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level
C)
JHmin
Optional
Real
Minimum value for heel fillet.
JSmin
Optional
Real
Minimum value for side fillet.
JTmin
Optional
Real
Minimum value for toe fillet.
DrawingNote
Optional
String
If package has other features that will affect the footprint, then enter details.
Table of data related to SON Footprint Specifications.
Name
Value
Required
Format
Description (Dimensions in mm)
Z
Yes
Real
Distance between pads. Measured from outside edges
C
Optional
Real
Row spacing. Distance between pad centers
G
Yes
Real
Distance between pads. Measured from inside edges
X
Yes
Real
Pad width
Y
Yes
Real
Pad length
E2t
Optional
Real
Thermal Pad width (X2)
D2t
Optional
Real
Thermal Pad length (Y2)
A
Yes
Real
Assembly width (E side)
B
Yes
Real
Assembly length (D side)
V1
Yes
Real
Courtyard width (E side)
V2
Yes
Real
Courtyard length (D side)
R1
Yes
Real
Silkscreen width (E side)
R2
Yes
Real
Silkscreen length (D side)
ViaCountE
Optional
Integer
Number of thermal vias in the E direction
ViaCountD
Optional
Integer
Number of thermal vias in the D direction
ViaPitchE
Optional
Real
Thermal Via Pitch in the E direction
ViaPitchD
Optional
Real
Thermal Via Pitch in the D direction
XY_Solder
Optional
Real
Peripheral Pads - Top Solder Layer. Enter expansion value
for Solder Mask. Only enter value if following
manufacturer recommendation. Otherwise leave blank
X2Y2_Solder Optional
Real
Thermal Pad - Top Solder Layer. Enter expansion value for
Solder Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank
XY_Paste
Optional
Real
Peripheral Pads - Top Paste Layer. Enter expansion value
for Paste Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank.
X2Y2_Paste
Optional
Real
Thermal Pad - Top Paste Layer. Enter expansion value for
Paste Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank.
X_Paste
Optional
Real
Peripheral Pads - Fill on Top Paste Layer. Value in X
direction.
Y_Paste
Optional
Real
Peripheral Pads - Fill on Top Paste Layer. Value in Y
direction.
X2_Paste
Optional
Real
Thermal Pad- Fill on Top Paste Layer. Value in X direction.
Y2_Paste
Optional
Real
Thermal Pad- Fill on Top Paste Layer. Value in Y direction.
FillCountE
Optional
Integer
Number of Top Paste fills placed on the thermal pad in the
E direction (No Paste Mask fills placed if blank)
FillCountD
Optional
Integer
Number of Top Paste fills placed on the thermal pad in the
D direction (No Paste Mask fills placed if blank)
Fill_Gap
Optional
Real
Gap between Top Paste fills placed on the thermal pad
(0.2mm if blank)
SOTFL
Description: Small Outline Transistor, Flat Lead
Included Packages: 3-Leads, 5-Leads, 6-Leads
Support for SOTFL packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the SOTFL package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to SOTFL Package Specifications.
Name
Value
Required
Format
Description (Dimensions in mm)
Optional
String
If blank, then auto-generated IPC naming will be
used
FootprintDescription Optional
String
If blank, then description is auto-generated
Dmin, Dmax
Yes
Real
Minimum and maximum body length
Emin, Emax
Yes
Real
Minimum and maximum lead span
E1min, E1max
Yes
Real
Minimum and maximum body width
PinCount
Yes
3,5
Total number of pin positions, not including tab
FootprintName
PinOrder
Optional
String
Comma separated list showing pin order. If blank
pin order is assumed sequential from 1 to
PinCount. Example: 8,7,6,5,4,3,2,1 will reverse
the pin order of an 8 pin package
AbsentPins
Optional
String
Comma separated list showing absent pins.
Example: 1,2,5. If blank all pins present
Bmin, Bmax
Yes
Real
Minimum and maximum width of narrow leads
B1min, B1max
Optional
Real
Minimum and maximum width of wide lead (3 pin
packages only)
cmin, cmax
Optional
Real
Minimum and maximum lead thickness
L1min, L1max
Optional
Real
Minimum and maximum lead length (from body to
end of lead)
LPmin, LPmax
Yes
Real
Minimum and maximum lead length
Pitch
Yes
Real
Pitch (e)
Amin, Amax
Yes
Real
Minimum height
DensityLevel
Yes
L, M, N
M = Most or maximum copper (density level A), N
= Nominal or median copper (density level B), L =
Least or minimum copper (density level C)
JHmin
Optional
Real
Minimum value for heel fillet
JSmin
Optional
Real
Minimum value of side fillet
JTmin
Optional
Real
Minimum value for toe fillet
DrawingNote
Optional
String
If package has other features that will affect the
footprint, then enter details.
Table of data related to SOTFL Footprint Specifications.
Name
Value Required
Format
Description (Dimensions in mm)
Z
Optional
Real
Distance between pads. Measured from outside edges
C
Optional
Real
Distance between pads. Measured from pad centre
G
Optional
Real
Distance between pads. Measured from inside edges
X
Optional
Real
Pad width
Y
Optional
Real
Pad length
X1
Optional
Real
Pad width (large pad)
A
Optional
Real
Assembly width
B
Optional
Real
Assembly length
V1
Optional
Real
Courtyard width
V2
Optional
Real
Courtyard length
R1
Optional
Real
Silkscreen width
R2
Optional
Real
Silkscreen length
Source URL: http://techdocs.altium.com/display/ADOH/IPC-7351B+Compliance