MC-Flexc High-End Laser Engraving Systems

Transcription

Contents
MC Flexc High-End Laser Engraving Systems . . . .2
Main Ophthalmic Applications . . . . . . . . . . . . . . . . .4
High Resolution Engraving Samples . . . . . . . . . . . .5
Ophthalmic Inkjet L2M-MC-JET . . . . . . . . . . . . . . . .6
Industrial Fibre Laser Module . . . . . . . . . . . . . . . . . .7
DPSS Laser Station . . . . . . . . . . . . . . . . . . . . . . . . .8
Dual Wavelength microPULSE . . . . . . . . . . . . . . . .9
Excimer Laser Station microSTRUCT . . . . . . . . . .10
Fluor Excimer Laser Station . . . . . . . . . . . . . . . . . .11
Nanosecond Laser Station microSIGN . . . . . . . . .12
Nanosecond Laser Station microDRILL . . . . . . . . .13
Picosecond Laser Station microPULSE . . . . . . . . .14
Femtosecond Laser Station . . . . . . . . . . . . . . . . . .16
Telephone: 01933 461 666 • Fax: 01933 461 699 • e-mail: [email protected] • website: www.laser2000.co.uk
MC-Flexc High-End Laser Engraving Systems
Technical Contribution to UV marking systems
Laser 2000 has developed the MCFlexc laser engraving system combining precise mask projection with a
highspeed galvanometer laser beam
scanning system. This permits the
engraving of an unlimited mix of
characters, patterns or codes without
changing the lens aperture. This is
achieved by replacing the usual lens
with a specially designed image objective. The method is very fast – allowing the use of full pulse speed of
an Excimer laser –and economical as
a greater part of the laser energy can
be applied.
requires an aperture change. The
The patent
patentsystems also used
ed MC-Flexc
more powerful and
system mean
meanthus more expenwhile became
sive laser systems.
international stan
stanThe characters to be
dard in Ophthalmic
engraved are simply generindustry. It can be used in all
ated as a chain of x-y coordinates
situations where conventional
in a text file such that every user can
laser products fail to operate
easily create and apply to his own due to micro cracks or unclean markcharacter set.
ing results.
By appropriate selection of laser parameters text heights can be miniaturised to approx. 20 µm. The contrast
Conventional methods are less flex- and appearance of the engraving reible as each character change also mains freely selectable.
Materials
Technology
Lenses (mineral, organics)
Molds
Ceramics
Stainless-steel
Diamonds
Crystals
Galvanometer-/Mask controlled Laserengraving
Applications
Marking
Coding
Structuring
Software
MC-Flexc operating system
Operating system Windows XP multilingual
Intuitive graphical interface with preview
Extended configurable log filing system for long term process control
Separate modes for operators, supervisor and service
Including 1 licence of software Project
designer
Excimer Laser Engravings
Features
Connection to the RX-data base
Direct communication with the RXdata base server
Interface to barcode reader
Full automatic generator for project files
Data Matrix Generator for engraving
Data Matrix ‚Read Out‘ Desktop device
Project designer
Offline layout editor with WYSWYG
preview (placing/scaling/rotation) for
engraving file generation
One click import functionality
Offline creation of charakters, logos
and fonts in different sizes and styles
Manipulation of existing packages
Creation of individual graphics
Import DXF, bitmaps and fonts
Preview modus
Micro encoding adjustment sign
Micro coding with 100 µm dot size
"one click" logo import
Flexible handling designs depending on the RX-Lab environment
Specifications of MC-Flexc High-End Laser Engraving Systems
Model
Technology
Blocking options
User interface
Remote control mode
Operation modes
Marking field size
Individual dot size
Character size
Position accuracy
Z measurement
Laser source
Output energy control
Electricity
Security
Required gases
Size
International norm
Warranty
MC-Flexc V2.4.
galvanometer, mask controlled laser engraving system,
air cooled nitrogen atmosphere within entire optical system
blocked and unblocked glasses
Touch screen, programmable soft keys
via network connection to host computer
Manual, semi automatic, full automatic
Approximately 300 mm x 150 mm
10 changeable numerals 0 to 9 (height 100 µm) and 10 dot diameters 0.01 to 0.14 µm
up to 20 mm
typical ± 10 µm, specified ± 30 µm
integrated Z measurement of entire marking field
193 nm, 200 Hz (optional 500 Hz, 1000 Hz), 10 ns
stabilized to ± 10 %
230 VAC (110 VAC on request) 50/60 Hz, 2 kW, IP20
laser class 1 system
ArF, compressed air (6 bar)
Height 1660 mm (including display arm 2385 mm), Width 815 mm (including display
arm 1470 mm), Depth 1835 mm (including display arm 2610 mm)
CE, CDRH on request
12 months (24 months/36 months optional)
MC-Flexc Highlights
Performance
 Lifetime optimised beam path components for lowest consumable costs
 Full energy control for the entire optic system for long term stable engraving result
 Sealed and Nitrogen covered beam path (no Nitrogen cylinders any longer required)
 High precision chucks for blocked and unblocked lenses and molds
 Remote service access via TCP-IP/VPN
Highest safety standards
 Full coverage of all CE and UL requirements
 Integrated ergonometric and sealed laser gas
 Integrated gas detection and protection
 Gas cabinet exhaust device
 Gas warning and F 2 scrubber
cabinet
devices
Options
 Maintenance agreements
 Warranty extension to three years
 Service network Asia, Europe, America
3 MC-Flexc Series for 3 Main Ophthalmic Applications
MC-Flexc V2.4. Automatic Handling
The automatic handling including a handling arm with
two vacuum grippers, the stoppers and sensors and
the conveying belt.
It can be selected for right hand (as shown in the picture)
or left hand side location in relation to the MC-Flexc Engraving system according to the individual needs:
 For blocked lenses
 For unblocked lenses
 Suitable for all MC-Flexc Systems
 Conveyer belt length free selectable
 Throughput up to 480 lenses/hour
MCF-V2.4.-AH
MCF V2.4. Image Recognition
This system engraves unblocked as well as blocked
lenses. Two camera and illumination systems indicate
the permanent engravings for further engraving process steps. All kinds and styles of lens materials can
be engraved:
 Blocked lenses
 Unblocked lenses single vision
 Unblocked lenses semi-finished
 Unblocked lenses progressive
 Cutted lenses with individual logo
design
MCF-V2.4.IRec
MCF V2.4. Mold Master
This MC-Flexc laser engraving system engraves unblocked as well as blocked molds and lenses. Special
chucks for blocked molds are an integrated part of the
MC-Flexc. Designed for engraving all kind of mold materials:
 Unblocked Molds (slumped, untreated
 Blocked Molds (direct machined)
 Camera visualisation included
…)
MCF-V2.4.-Mold Master
High Resolution Engraving Samples
New Laser-Galvanometer High Resolution Scanner for ‘real micro engraving’ and micro coding down to 5 μm dot size
Silica, “A” height 1.5 mm
Silica, “L2000” height 0.12 mm
CR 39, “L” height 0.12 mm
Mold, dot diameter 0.02 mm
Data Matríx Code 0.4 mm x 0.4 mm
Ablation analyses of organic lens
CO2 , DPSS, Excimer Laser System Compare
Laser
CO2 laser
DPSS laser
Technology
Scanner/Focus ablation
Scanner/Focus ablation
Wavelength
10,600 nm
355 nm
Materials
organics
organics, silica, glass
Applications
marking, coding, engraving
Marking process
melting, burning
melting/ablation
Marking of organic lenses
yes
yes
Marking of silica lenses
yes, with some quality constraints
yes, in most cases
Marking into hard-/AR-coating no
Marking glass molds
no
100 - 150 µm
about 10 µm
Minimal dot size/line width
micro encoding
no
yes
Beam path
dust protected
dust protected
Warranty standard
2 years
2 years
Warranty extension
3 years
3 years
Excimer laser
Scanner/Mask projection
193 nm
organics, silica, glass, molds
ablation
yes
yes
yes
yes
about 5 µm
yes
dust protected
and Nitrogen sealed
1 year
3 years
Ophthalmic Inkjet L2M-MC-JET
In the ophthalmic industry, the market of growth is the market of progressive lenses for near and far sight.
Commonly, these lenses are pad
printed to ease the work of optician
finding semi or quasi invisible laser
engravements indicating the properties of the lense. Until recently, lense
manufacturers had to live with the
pad printing machines major flaw of
inflexibility. The L2M-MC-JET now
provides great flexibility and gives
the lense manufacturer great market
advantage. The L2M-MC-JET replaces limited stamping mask changers
– different images on the lenses are
now simply placed by software. Thus,
yearly running costs are greatly reduced. With the special L2M-MC-JET
different lense geometries may follow in a mixed sequence. The lense
geometry can either be determined
by the L2M-MC-JET or –in a fully automated version – be retrieved from
bar code and host computer. As an
additional feature, the L2M-MC-JET
also gives the opportunity to freely
import any graphical data. This way,
glasses and molds can also be added
with individual company names and
logos. The L2M-MC-JET is posed to
become the flexible alternative to pad
printing processes. Mostly because
it is more flexible and no masks are
needed. Any glass or mold can be individually inked with the information
provided. The L2M-MC-JET not only
lets you enjoy the higher flexibility –it
also is far more economic regarding
the costs of investment, yearly costs,
and costs per glasses.
Specifications (example)
Options
Printing capability:
Dotsize:
Resolution:
Positioning accuracy:
Ink:
Available colors:
Automated handling
Loading capacity for one or two glasses
Automated measurement of glass
geometry and adaption
signs, characters, logos and bitmaps
250… 350 µm (depending on surface)
approx. 48 dots (height)
approx. 500 µm
solvable in ethanol
yellow, red, green, blue, black
Industrial Fiber Laser Module
L2M-Fib-1064
General description
The laser beam of this unique fiber
laser module L2M-Fib-1064 is easily brought to point of use through
means of a flexible fiber. This fiber
may be up to 8 m long. Only the weight
of the laser head need to be moved to
quickly and accurately position the
laser focus over the work piece. This
concept has the great advantage of
securing very endurant, reliable micromachining equipments. This way,
any multi dimensional accurate positioning becomes an almost easy task.
Today, these industrial 19” fiber laser modules systems are already
successfully implemented in applications requiring the integration on
smallest area and demanding very
high marking speeds.
Among many others, examples of
these applications include coding in
the packaging industry or marking of
electronic parts. Fiber laser marking
systems are now providing an alternative solution to ink jet or mechanical engraving.
The L2M-Fib-1064 modules are ready
for integration into production lines.
Bulky, big and difficult to access objects can be structured or marked as
easily and comfortably as small and
flat ones.
Typical applications:
Industrial Fiber Laser Module
 packing industry
 semiconductor industry
 electronic industry
 bio analytic applications
Characteristics of the extremely compact system
Reliable state-of-the-art air-cooled laser source
Maintenance-free operation
Very high dynamic properties
“Plug and play“ system including industrial PC with pre-installed marking software
User-friendly operating software
19“ rack (IP20) compact design
Durable, water- and dust-proof galvohead
Laser data
Software
Fiber laser without wearing parts
Long-term robust and stable
Air-cooled
Power 10, 20, 40 W
(up to 100 W on request)
Wavelength 1064 nm
Frequency up to 100 kHz
Editor with preview mode
Graphic import
Data matrix code
True type fonts
Applications
Marking in packing industry
Semiconductor industry
Electronic industry
Bio analysis
Cutting
Structuring
Options
Pilot laser
Driver for Z axis
Drivers for the positioning system
Control of axis, external devices, communication via PLC
On-the-fly marking of moving objects
Security kit for “Laser Class 1”integration
DPSS Laser Station
L2M-DPSS
Whether selecting an individual workstation or designing an entire customized production chain: Long service life, reliability, easy handling
and quality always constitute the criteria of upmost importance. For that
matter, diode pumped solid state laser systems are suited best to serve
even under rigorous conditions present in today’
s industrial environments.
In workstation at Laser 2000 GmbH
and 3D-Micromac AG, long-term tested and robust laser sources become
versatile tools for the precise and rapid machining of metals, semiconductors, ceramics and plastics at a very
reasonable cost performance ratio.
DPSS Laser Station in clean room environment
Materials
Technology
Options
Dielectrics ceramics
Metal foils
Stainless steel
Metal films on glass
Semiconductors
Drilling
Cutting
Micromachining
Direct write
Tuning of HF components
Semi-automated or fully automated
alignment with camera system
Automated workpiece handling
Vacuum chuck
Mounts for 300 mm wafer
Purpose-built mounts for masks
Customer-specific workpiece mounts
Fully air-conditioned processing chamber
Mini clean room environment
up to ISO class 4
Beam analyser featuring
microPROFILER software
Applications
Lasers
Tools for microsurgery
Automotive
Circuit boards
Mold making
Hard metal tools
Balancing of MEMS
Telecommunication
Wavelengths 1064 nm, 532 nm (SHG),
355 nm (THG), 266 nm (FHG)
Repetition rate 1 Hz - 500 kHz
Beam profile TEM00
Energy 100 µJ - 15 mJ
Average power 0.5 - 20 W
Pulse width 10 - 500 ns
Software
Operating system Windows XP pro
Intuitive graphical operator
interface with preview
Separate modes for operators and
experts
Programming in Visual Basic Script,
G-Code (DIN 66025) or via data import
Interfaces GDS II, STL, DXF
Addressing of up to 32 NC axes
Integrated vision system
Traverse path (XY) 200 x 200 mm2
Positioning accuracy ± 1 µm
Repeat accuracy ± 0.5 µm
Maximum velocity 2 m/s
Pitch/yaw ± 8 arcsec
Z axis 100 mm
Mechanical alignment
Scanner with diverse fields
of work and resolutions
Sputter mask made of stainless steel
Diameter: 600 µm
Thickness: 1000 µm
Operator interface with real
time image for easy naviga
navigation and observation
Dual Wavelength Laser Station – microPULSE 532/266
L2M-ns-mP-532/266
One of the major demands on machining of substrates is to have a
wide range of different material that
actually can be machined. Ideally,
one tool should be usable for metals, ceramics, and also for optically
transparent substrates. The microPULSE 532/266 fulfil those demands
in a very compact way. A simple
software switch changed the wavelength between 532 nm and 266 nm
and thus allows very flexible proceeding without waiting time. The
exchange of the lens is as easy as
loading a film of a camera. These
two easy steps make the machine
ready for the other wavelength in
just an instant.
Dual Wavelength Laser Station
Materials
Plastics
Thin films
Glasses
Semiconductors
Metals
Software
Operating system Windows XP Pro
Control software microMMI by 3DMicromac
Intuitive graphical operator interface
with preview
Separate user modes for operators and
experts
Programming in visual basic script,
Interfaces for 2D and 3D CAD files (e.g.
STL, DXF)
Integrated energy monitor
Technology
Drilling
Cutting
Direct surface structuring
Lasers
Wavelengths 532 nm, 266 nm (switchable)
Repetition rate 6 - 10 kHz
Energy max. 1.5 µJ at 532 nm/max. 0.15 µJ
at 266 nm
Average power 1 - 10 W
Pulse width < 20 ns
Traverse path (Z) 150 mm
Maximum velocity 200 mm/s
Observation of field of work with a CCD
camera
Switchable between 532 nm and 266 nm
by software
Options
Scanner with different working areas
and resolutions
Semi automated or fully automated
Customer specific mini environments
up to ISO class 4
Beam analyser featuring microPROFILER
software
Workpiece mounts on customer’
s demand
Rotational axis for customer specific tasks
Dual wavelength objective
Housing/Base frame
Rugged base frame made of steel with
bread board or granite
Housing for laser class 1
532-266 nm beam delivery unit
Applications
Tools for medical applications
Thin film processing
Engraving of optical transparent materials
Telephone: 01933 461
666 • Fax: 01933 461 699 • e-mail: [email protected] • website: www.laser2000.co.uk 11
www.laser2000machining.com
Excimer Laser Station microSTRUCT
L2M-Excim-mSTRUCT
The new cost effective excimer laser workstation L2MExcim-mSTRUCT of Laser 2000 GmbH by 3D-Micromac
AG boosts your laser application to high productivity.
Complex structures can be demagnified and imaged
onto the object by mask projection and optics.
Manufacturing of comb stents made of plastics
Using wavelengths in the ultraviolet range, sub-micron feature sizes can be generated – no matter whether plastics,
ceramics, glasses, composites or biological tissues are to
be machined.
Stripping of insulation from plastics-coated metals
Cutting of ceramics
Materials
Technology
Software
Dielectrics
Ceramics
Metal foils
Stainless steel
Metal films on glass
Semiconductors
Drilling
Cutting
Micromachining
Direct write
2D/3D fluting
with preview
Separate modes for operators and experts
Image recognition system
Applications
Tools for microsurgery
Automotive
Circuit boards
Mold making
Hard metal tools
Balancing of MEMS
Telecommunication
Options
Scanner with diverse fields of work
and resolutions
Semi-automated or fully automated
Workpiece mounts on customer
demand
Mini environment up to ISO class 4
Pitch/yaw ± 8 arc sec
Z axis 150 mm
Vacuum chuck
Rinseable optical path
Observation of field of work
with a CCD camera
Lasers
Wavelengths:193 nm (ArF)
248 nm (KrF)
308 nm (XeCl)
Repetition rate 10 Hz to 4 kHz
Beam profile TEM00
Energy 1 mJ - 1.200 mJ
Average power 0.5 to 20 W
Pulse width 10 to 500 ns
Workpiece positioning with xyz linear drives
Fluor Excimer Laser Station
L2M-F2-Excim-157
A novel highly efficient fluor laser system is now commercially available
from Laser 2000 GmbH in cooperation
with 3D-Micromac AG for machining
microstructures. The L2M-F2-Excim157 permits material processing at fluences of up to 7 J/cm2 with a pulse energy of 20 mJ. The maximum field size
on the sample is 240 by 240 µm2. Materials can be processed by single pulses,
a burst of pulses, or time and position
synchronized. The growing interest
in fluor lasers for microstructuring is
attributed to the short wavelength of
157 nm and the corresponding high
photon energy of 7,9 eV. Photons of
this energy are easily absorbed by a
large range of materials including
many band gap insulators. However,
until recently fluor lasers suffered
from high energy loss along the beam
path. Existing fluor lasers need to run at
maximum power to provide a minimum
fluence at the workpiece. With the ingeniously new design of the beam path,
the energy loss from the laser source
to the workpiece is reduced tremendously. The advantages are significant:
less laser power is needed resulting in
a longer lifetime, the gas consumption is reduced, and the system handling is easier. With Laser 2000 GmbH/
3D-Micromac AG’s new fluor laser system, protected by patent, now virtual-
Materials
Technology
Glass
Polymers
Composites
Sapphire
Magnesium fluoride (MgF2)
Calcium fluoride (CaF2)
Biological materials
Mask projection
Exposing
2D/3D structuring
Hardening/annealing
Patterning
Smoothing
Applications
Positioning accuracy ± 0.5 µm
Horizontal rotation axis
Z axis 150 mm
Semi-automated alignment
with camera system
Optical path can be evacuated down
to 10-3 bar and rinsed with gas
Beam analysis with
Beam position measurement
and correction
ly any material can be microstructured
with excellent quality. For instance, the
three dimensional microstructuring of
fused silica, other glasses, polymers,
and alumina open up novel applications in biomedicine and microsystems technology.
Micro structuring of optical
components
Diffractive optical components
Aerospace
Medical technology
UV/DUV lithography
Superconductors
Telecommunication
Photonic crystals
Lasers
Wavelength 157 nm
Repetition rate 50 Hz - 2 kHz
Energy 10 mJ - 50 mJ
Average power 2.5 W
Pulse width 20 ns
Options
Customer-specific workpiece mounts
Software
with preview
Separate modes for operators
and experts
Image recognition system
100 µm
Structured borosilicate with depth of 60 µm (Laserinstitut Mittelsachsen)
100 µm
Structured quartz glass with depth of 30 µm (Laserinstitut Mittelsachsen)
Nanosecond Laser Station microSIGN
L2M-ns-mSIGN
In the past, marking of wafers of various semi conducting material, dies,
and MEMS in ultimate quality was
the domain of large and expensive facilities. Today, our microSIGN can be
easily customized for large automized
production as well as for a small production.
Whenever hard or soft marking complying with SEMI standards or customer specifications is required, microSIGN is your first choice.
Materials
Technology
Silicon
Silicon carbide (SiC)
Gallium arsenide (GaAs)
Gallium nitride (GaN)
Lithium aluminate (LiAlO2)
Marking
Micromachining
Focus ablation
4“ and 6“ wafer mount
Z axis 50 mm
Scan field 150 x 150 mm2 at 254 mm
working distance
Applications
Semiconductors
Solar cells
Displays
Options
and resolutions
Vacuum chuck
Mounts for 300 mm wafer
Purpose built mounts for masks
Customer specific workpiece mounts
Fully air conditioned processing
chamber
microSIGN softmarks in silicon (dot size 60 µm)
Nanosecond Laser Station microSIGN DPS-532-1
Laser
Wavelength 1064 nm
532 nm (SHG)
Software
Intuitive graphical operator
interface with preview
and experts
Programming in Visual Basic Script
or via data import
Marking with single or double density
codes complying SEMI standards M12,
M13 or according to customer definition
Application of a microSIGN system. The invisible
laser beam has been post-edited by computer
microSIGN softmarks in silicon (dot size 76 µm)
microSIGN wafer handling and alignment
Nanosecond Laser Station microDRILL
L2M-ns-mDRILL
Increasingly, semiconductor wafers and
metals in the fabrication of MEMS are
being drilled and cut by enhanced laser machining systems. Highest quality at highest processing speeds are
considerable benefits for your production. The microDRILL of Laser 2000
GmbH and 3D-Micromac AG is a per-
fectly versatile tool for this application.
The microDRILL combine the required
characteristics with the unbeatable performance of diode pumped solid state
laser with the unbeatable performance
of diode pumped solid state laser and is
suited for high throughput 24-7 industrial applications.
Materials
Technology
Silicon
Germanium
Other semiconductors
Dielectrics
Polymers
Stainless steel
Titanium
Other metals
Drilling
Cutting
Direct write
Focus ablation
Micromachining
Applications
Cutting/drilling of wafers
Structuring of circuit boards
Machining of solar cells
IC test adapters
Sieves
Software
with preview
and experts
Programming in Visual Basic Script
or via data import
Integrated vision system
Lasers
Wavelengths 1064 nm, 532 nm (SHG)
355 nm (THG), 266 nm (FHG)
Repetition rate 1 Hz to 100 kHz
Beam profile TEM00
Energy 100 µJ to 15 mJ
Average power 0.5 to 20 W
Pulse width 10 to 500 ns
Nanosecond Laser Station microDRILL system
4“ und 6“ wafer mount
Positioning accuracy ± 1.5 µm
Maximum velocity 90 mm/s
Pitch/yaw ± 80 µrad/ ± 40 µrad
Z axis 100 mm
Bores in Cr/Ni alloy DIN 14310
Diameter 260 µm,
Hole grid 365 µm,
Thickness 300 µm
Options
Vacuum chuck
Mount for 300 mm wafer
Purpose built mounts for masks
Customer specific workpiece mounts
Fully air conditioned processing chamber
Bores in silicon
Diameter 50 µm,
Thickness 500 µm
Operator interface with live image for direct navigation and observation
Picosecond Laser Station microPULSE
L2M-ps-mP
In research and development, it has
increasingly become indispensable to
possess the capability of machining
smaller and finer structures into most
various substrates. Substrates to be
machined may be of any nature – say
metals, alloys, ceramics, transparent
material, or biological material.
For that purpose, it would be best to
have one universal tool suited for all
of these substrates without need of reconfiguring or altering it.
The resulting requirements of such a
laser micromachining equipment are:
degree of freedom regarding the positioning of the substrates
 open system concept for the integration of most different lasers or laser
sources operated parallel
 flexible, upgradeable control concept for possible future integration
of further components (for instance
additional axes systems, additional
optical components, etc.)
With regard to the above requirements, Laser 2000 GmbH in
cooperation with 3D-Micromac AG
are presenting a system concept that
provides exactly these features. The
microPULSE L2M-ps-mP has partic
particularly been designed for the upmost
various tasks posed in micromachining, such as drilling of micro holes, creating micro structures, or micro cuts.
Dependent on the chosen laser type,
materials with high thermal conductivity and low melting temperatures
can as easily processed as transparent, semi conducting, superconducting, or organic materials. Thanks to
constantly improving lasers, powerful and reliable systems are available
today. These, high performance systems enable the precise machining
of almost any material. The positioning of the substrates is performed by
5 axes positioning system consisting
of three lineal axes and two goniometers. Direct driven axes position the
Through hole in stainless teel with diameter of 180 µm
200 µm
 maximal
microPULSE picosecond laser station with 355 nm
wavelength
substrate in x and y. The Z axis is a
limited spindle axis. Two goniometers enable for an angular positioning of the substrates with respect to
x and y directions. This versatile concept also provides the possibility of
extending it by additional positioning systems – for instance additional
rotational axes.
Machining table with X/Y axes and two goniometers
Gearwheel made of stainless steel
Machining CuInSe2 solar cells with gap width of 10 µm
200 µm
Structured glass
Materials
Technology
Thin films, e.g. for photovoltaics (CIS)
Molybdenum
Stainless steel or other metals
Silicon
Gallium arsenide (GaAs)
2D/3D fluting
Cutting
Direct write
Drilling
Tuning of HF components
5 axes positioning system
Z axis 100 mm
2 goniometers for angular positioning
Positioning accuracy ± 1 μm
Repeat accuracy ± 0.5 μm
Inspection of working field by CCD
camera
Applications
Laser
Automotive
Hard metal tools
Cutting/drilling of silicon wafers
High-resolution scribing
of displays and solar cells
Medical implants
OLEDs
Spinnerets
Wavelengths 1064 nm (optional 532 nm,
355 nm, and 266 nm)
Repetition rate 1 - 500 kHz
Beam profile TEM00
Maximum energy 20 μJ
Average power 10 W
Pulse width < 15 ps
600 µm
200 µm
50 µm
Spinneret in stainless steel
Options
and resolutions
Fully air conditioned processing
chamber
Additional rotational axes
Femtosecond Laser Station
L2M-fs-775, L2M-fs-800
Precision and quality are both
most crucial in high end machining of micromechanical products.
The materials being used and demands to be matched (e.g. structuring on the sub micrometer scale
or thermally stress-free machining) require a purpose-built laser
source. The L2M-fs femtosecond
workstation by Laser 2000 GmbH/
3D-Micromac AG are ideally suited
for complex tasks due to their highly special technical characteristics.
Some of the features include minimal
bore diameters of several 100 nanometers, the avoidance of heat affected zones, debris free and crack free
machining, the avoidance of layer
stack delamination and the capability to machine virtually any material.
L2M femtosecond laser station
Materials
Applications
Software
Metals
Silicon
III/V semiconductors
YBCO
Biological materials
Ceramics and composites
Quartz glass and other optical materials
Diffractive optical elements
Waveguides
Photonic crystals
Micro structuring of ceramics or composites
Structuring of reversible cutting inserts
Micro channels
Superconductors
Biotechnology
with preview
Separate modes for operators and
experts
G-code or via data import
Lasers
Wavelengths 775 or 800 nm (optional SHG, THG)
Average power 1 W
Beam profile TEM00
Max. energy 1 mJ
Repetition rate 1-6 kHz
Pulse width 50 - 150 fs
Technology
2D/3D fluting
Fabrication of waveguides
Modification of materials und surface
Trimming of MEMS
200 µm
6 µm
Structured quartz glass. Area around the pyramid
was removed by femtosecond laser
Superconductor: YBCO trench (seen from above)
Options
Vacuum chuck
Mount for 300 mm wafer
Workpiece mounts on customers demand
Fully air conditioned processing chamber
Beam analyser featuring microPROFILER software
20 µm
20 µm
a) entrance side
b) exit side
Cylindrical micro-bores in GaN, thickness 340 µm
20 µm
Injector aperture in stainless steel

MC-Flexc High-End Laser Engraving Systems

Transcription

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